Curable silicone composition

Abstract: The present invention pertains to a curable silicone composition comprised of (A) an organopolysiloxane represented by the formula wherein R¹ is a monovalent hydrocarbon group other than an alkenyl group; R² is a monovalent hydrocarbon group other than an alkenyl group or hydrogen; R³ is an organic group that contains an epoxy group or an alkoxysilylalkyl group with the proviso that at least one R³ group is an organic group containing an epoxy group; a is either 0 or a positive number; b is a positive number; c is a positive number; a/c has a value of between 0 to 4, b/c has a value of between 0.05 to 4, and (a + b)/c has a value of between 0.2 to 4; and (B) a curing compound selected from curing agents or curing catalysts. The curable silicone composition of the present invention has superior curing properties and is capable of forming a hardened silicone material with superior flexibility and heat resistance after curing.

Description: Because of their superior adhesive properties, bonding properties, environmental resistance, and electrical properties after the silicone is hardened curable silicone compositions are used for electric and electronic fillers, adhesives for electric and electronic applications, coating compositions, and coating materials for rubber. Silicone compositions curable by a condensation-reaction which undergo curing by a dehydration-condensation reaction of silanol groups, dehydrogenation between a silanol group and a hydrogen bonded to a silicon atom, dealcohol reaction between a silanol group and silicon atom bonded alkoxy group, and silicone compositions curable by an adduct reaction which undergo curing by an adduct reaction between the silicon atom, hydrogen, and fatty acid unsaturated groups in the presence of hydrosilylation reaction catalysts are known in the art. However, in the silicone compositions curable by a condensation reaction, the curing requires a very long time and the curing property is inferior; in the case of silicone compositions curable by an adduct reaction, curing does not progress in the presence of adduct reaction inhibitors such as sulfur and soldering flux, and the surface of the composition is less likely to be hardened because of oxygen. In addition, in general, the heat resistance of the curable silicone composition is inferior after curing. For this reason, various types of curable silicone compositions with improved curing properties have been suggested. Curable silicone compositions comprised of a hydrolysate of an organic silane containing an epoxy group and ammonium perchlorate are disclosed in Japanese Kokai Patent Application No. Sho 56[1981]-72054 and curable silicone compositions comprised of an organopolysiloxane containing at least two epoxy groups in a single molecule, organopolysiloxane containing at least two amino groups in a single molecule, and an epoxy curing catalyst are disclosed in Japanese Kokai Patent Application No. So 60[1985]- 179417. However, the curing properties of curable silicone compositions suggested in Japanese Kokai Patent Application No. Sho 56[1981]-72054 and Japanese Kokai Patent Application No. Sho 60[1985]-179417 are insufficient, and the flexibility and heat resistance of the cured silicone material are inferior. GB-A 834 326 teaches a process for the preparation of an organosilicon compound which contains epoxy groups. The silicon compounds can either be silanes or siloxanes. The siloxanes can be copolymers of allylmethylsiloxane, SiO 2 and AMeSiO, wherein A is an epoxy group. Example 4 of GB-A 834 326 discloses a compound which is composed of one SiO 2 unit and four identical monofunctional siloxane units bearing epoxy group-containing groups. Moreover, it was known from Journal of Polymer Science, Part A, Vol. 28, pages 479 to 503 (1990), to prepare silicon-containing epoxy resins which are useful for a photo-initiated cationic polymerization. These epoxy resins are mostly cyclic siloxanes. Moreover, it was known from EP-A 0 473 995 to use a combination of different epoxyfunctional diorganopolysiloxanes and a catalytic amount of a photocatalyst to prepare an ultraviolet radiation-curable epoxyfunctionalized silicone controlled release composition. The main component of this composition is an epoxyfunctional diorganosiloxane having a monovalent cycloaliphatic epoxyfunctional organic radical, and this component is combined with a siloxane resinous copolymer which is comprised of two different monovalent siloxane units and tetravalent SiO 4/2 units. It is an object of the present invention to produce a curable silicone composition with superior curing properties that forms a hard silicone material with superior flexibility and heat resistance after curing. The present invention pertains to a curable silicone composition consisting of (A) an organopolysiloxane represented by the formula wherein R 1 is a monovalent hydrocarbon group other than an alkenyl group; R 2 is a monovalent hydrocarbon group other than an alkenyl group or hydrogen; R 3 is an organic group that contains an epoxy group or an alkoxysilylalkyl group with the proviso that at least one R 3 group is an organic group containing an epoxy group; a is a positive number; b is a positive number; c is a positive number; a/c has a value of up to 4, b/c has a value of between 0.05 to 4, and (a + b)/c has a value of between 0.2 to 4; (B) a curing compound selected from curing agents or curing catalysts, and optionally (C) fillers, fatty acid esters, metal salts, ester-based waxes and plasticizers. The curable silicone composition of the instant invention is mainly comprised of an organopolysiloxane made of monofunctional siloxane units (M units) and quaternary functional siloxane units (Q units) and has superior curing properties that forms a hardened silicone material with superior flexibility and heat resistance after curing. The organopolysiloxane, component (A), is the primary component of the present invention and is represented by the formula: R 1 is a monovalent hydrocarbon group other than an alkenyl group. R1 may be exemplified by alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group; aryl groups such as phenyl group, tolyl group, xylyl group; aralkyl groups such as benzyl group and phenethyl group; and substituted alkyl groups such as chloromethyl group and 3,3,3-trifluoropropyl group. R 2 is selected from hydrogen or a monovalent hydrocarbon group other than an alkenyl group. R 2 may be exemplified by hydrogen or alkyl groups such as methyl group, ethyl group, propyl group, butyl group, and pentyl group; aryl groups such as phenyl group, tolyl group, xylyl group; aralkyl groups such as benzyl group and phenethyl group; and substituted alkyl groups such as chloromethyl group and 3,3,3-trifluoropropyl group. R 3 is an organic group that contains an epoxy group or alkoxysilylalkyl group with the proviso that at least one of R 3 is an organic group containing an epoxy group. R 3 may be exemplified by organic groups containing an epoxy group, such as glycidoxyethyl group, glycidoxypropyl group, glycidoxybutyl group, 3,4-epoxycyclohexylethyl group, 3,4-epoxycyclohexylpropyl group, 3,4-epoxynorbornaylethyl group, 2-(3,4-epoxy-3-methylcyclohexyl)-2-methylethyl group; and alkoxysilylalkyl groups that provide an adhesive property to the composition of the present invention, such as trimethoxysilylethyl group, triethoxysilylpropyl group, trimethoxysilylbutyl group, triethoxysilylethyl group, triethoxysilylpropyl group, tripropoxysilylethyl group, methyldimethoxysilylethyl group, and methyldimethoxysilylpropyl group. Furthermore a is a positive number that indicates the number of monofunctional siloxane units (M units) that do not include an organic group containing an epoxy group or alkoxysilylalkyl group. And, b is a positive number that indicates the number of monofunctional siloxane units (M units) having an organic group containing an epoxy group or an alkoxysilylalkyl group. Finally, c is a positive number that indicates the number of quaternary functional siloxane units (Q units). For each of the ratios, a/c is a number up to 4, b/c is a number between 0.05 to 4, and (a + b)/c is a number between 0.2 to 4. This is because it is not possible to include more than four of the monofunctional siloxane units (M units) per quaternary functional siloxane unit (Q unit), and in order to produce a hardened silicone material with superior flexibility and heat resistance after curing, at least 0.05 monofunctional siloxane unit (M unit) containing an organic group containing epoxy group or alkoxysilylalkyl group per quaternary functional siloxane unit (Q unit) is necessary. The organopolysiloxane (A) remains in a liquid state or a solid state at room temperature. and the molecular weight is not especially limited, but from the standpoint of superior curing properties, a range of 500-500,000 is desirable. The organopolysiloxane (A) described above can be produced by, for example, performing an adduct reaction with the organopolysiloxane represented by the formula: and an unsaturated aliphatic hydrocarbon containing an epoxy group, and an appropriate amount of alkoxysilylalkene in the presence of a hydrosilylation reaction catalyst; wherein R 1 is a monovalent hydrocarbon group other than an alkenyl group; d is a positive number; e is a positive number; f is a positive number; d/f has a value of up to 4, e/f has a value of between 0.05 to 4, and (d + e)/f has a value of between 0.2 to 4. The curing compound, component (B), is a component that hardens the organopolysiloxane component (A), and component (B) and is not especially limited as long as the material is a curing agent or curing catalyst that is capable of curing the epoxy resin. Useful curing agents may be exemplified by phenolic compounds, carboxylic acid compounds, acid anhydrides, amine compounds, compounds containing alkoxy groups, or mixtures thereof or partial reaction products thereof. Useful curing catalysts may be exemplified by tertiary amine compounds such as imidazole; quaternary amine compounds; phosphorus compounds such as phosphine; aluminum compounds such as organic aluminum compounds; and zirconium compounds such as organic zirconium compounds. Furthermore, in the composition of the present invention, either a curing agent or curing catalyst or a combination of a curing agent and a curing catalyst can be used. The mixing ratio of component (B) is not especially limited, but it is desirable to add 0.1-500 parts by weight per 100 parts by weight of component (A). This is because when the mixing ratio of component (B) is less than 0.1 part by weight per 100 parts by weight of component (A), the curing reaction is less likely to be initiated, and when the amount exceeds 500 parts by weight, a sufficient degree of the curing reaction fails to occur. In addition, the curable silicone composition of the present invention which is mainly composed of component (A) and component (B) may include fillers such as aerosol silica, crystalline silica, fused silica, wet silica, titanium oxide, zinc carbonate, calcium carbonate, iron oxide, carbon black, fatty acid esters such as stearic acid ester, palmitic acid ester, metal salts, ester-based waxes, and plasticizers. The curable silicone composition of the present invention has superior curing properties and forms a hard silicone material with a superior flexibility and heat resistance after curing. Therefore, it can be used effectively for coating compositions, coating agents for electric and electronic parts, adhesives, sealers for electric and electronic parts, sealing agents for high temperature areas such as automobile engines, and for a composition that provides flexibility in the curable resin composition. So that those skilled in the art can understand and appreciate the invention taught herein, the following examples are presented. In the following examples the value of the viscosity in application examples is the value measured at 25°C, and curable silicone compositions were cured by heating at 150°C for 3 hours Furthermore, measurement of physical properties of the hardened silicone material was carried out as described below. Heat resistance: A small piece of hardened silicone was heated in air at a rate of temperature increase of 10°C/min by thermogravimetric analysis (TGA), and is shown as the residual (wt%) at 850°C. Flexibility: Both ends of a hardened silicone material molded to form a 1/4 x 1/2 x 4 inch (0.635 x 1.27 x 10.16 centimeter) bar were fixed, then a 5 kg weight was hung from the center of the hardened silicone material, and the warping at the center area was measured. When the warping was less than 0.5 cm, it is classified as x, when 0.5-1 cm, it is classified as Δ, an when it exceeds 1 cm, it is classified as 0. Hardness: A hardened silicone material molded to form a disc 2 inches (5.08 cm) in diameter x 1/10 inch (0.254 cm) was measured by a Barcol 935 hardness meter. Preparation Example 1 An organopolysiloxane shown by the formula [(CH 3 ) 3 SiO 1/2 ] 0.8 [(CH 3 ) 2 HSiO 1/2 ] 0.7 (SiO 4/2 ) 1.0 (viscosity 105 (centipoise) mPa.s, silicon-bonded hydrogen content 0.40 wt%) was reacted with an excess amount of allyl glycidyl ether in toluene using chloroplatinate as a catalyst. An organopolysiloxane having the formula: was produced. The viscosity of the organopolysiloxane produced was 520 (centipoise) mPa.s, and the epoxy equivalence was 420. Preparation Example 2 (not within the scope of the present invention) An organopolysiloxane shown by the formula: [(CH 3 ) 2 HSiO 1/2 ] 1.8 (SiO 4/2 ) 1.0 (viscosity 46 (centipoise) mPa.s, silicon-bonded hydrogen content 0.92 wt%) was reacted with an excess amount of allyl glycidyl ether in toluene with chloroplatinate as a catalyst. An organopolysiloxane having the formula: was produced. The viscosity of the organopolysiloxane produced was 610 (centipoise) mPa.s, and the epoxy equivalence was 370. Preparation Example 3 A viscous organopolysiloxane shown by the formula [(CH 3 ) 3 SiO 1/2 ] 0.7 [(CH 3 ) 2 HSiO 1/2 ] 0.5 (SiO 4/2 ) 1.0 (silicon-bonded hydrogen content 0.33 wt%) was reacted in toluene with an excess amount of allyl glycidyl ether with chloroplatinate as a catalyst. An organopolysiloxane having the formula: was produced. The organopolysiloxane produced had a semitransparent brown color, and the epoxy equivalence was 1100. Preparation Example 4 An organopolysiloxane shown by the formula [(CH 3 ) 3 SiO 1/2 ] 0.6 [(CH 3 ) 2 HSiO 1/2 ] 0.1 (SiO 4/2 ) 1.0 (silicon-bonded hydrogen content 0.09 wt%) was reacted in toluene with an excess amount of allyl glycidyl ether with chloroplatinate as a catalyst. An organopolysiloxane having the formula was produced. The organopolysiloxane produced had a semitransparent brown color, and the epoxy equivalence was 1290. Preparation Example 5 (not within the scope of the present invention) An organopolysiloxane shown by the formula (viscosity 46 (centipoise) mPa.s, silicon-bonded hydrogen content 0.92 wt%) was reacted in toluene with an excess amount of 1,2-epoxy-4- vinylcyclosiloxane with chloroplatinate as a catalyst. An organopolysiloxane having the formula was produced. The organopolysiloxane produced had a semitransparent brown color, the viscosity was 520 (centipoise) mPa.s, and the epoxy equivalence was 230. Preparation Example 6 (not within the scope of the present invention) An organopolysiloxane shown by the formula [(CH 3 ) 2 HSiO 1/2 ] 4.0 (SiO 4/2 ) 1.0 (boiling point 190°C, silicon-bonded hydrogen content 1.22 wt%) was reacted in toluene with an excess amount of allyl glycidyl ether with chloroplatinate as a catalyst, and organopolysiloxane having the formula below: was produced. The organopolysiloxane produced was a semitransparent brown color, the viscosity was 54 (centipoise) mPa.s, and the epoxy equivalence was 205. Preparation Example 7 (not within the scope of the present invention) An organopolysiloxane shown by the formula [(CH 3 ) 2 HSiO 1/2 ] 4.0 (SiO 4/2 ) 1.0 (viscosity 46 mPa.s (centipoise), silicon-bonded hydrogen content 0.92 wt%) was reacted in toluene with a mixture composed of allyl glycidyl ether and allyltrimethoxysilane = 1:1 with chloroplatinate as a catalyst. An organopolysiloxane having the formula was produced. The organopolysiloxane produced had a semitransparent yellow color, and the viscosity was 200 mPa.s (centipoise). EXAMPLE 1 Organopolysiloxanes produced in the Preparation Examples, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, 3- or 4-methylhexahydrophthalic anhydride, and 2,4,6-(trisdimethylaminomethyl)phenol were uniformly mixed in the weight ratio listed in Table I, and curable silicone compositions were produced. These curable silicone compositions were cured, and the properties of the hardened silicone materials were evaluated. These results are shown in Table I. Also, the hardness of the curable silicone composition mixed with the organopolysiloxane prepared in Preparation Example 2 after curing was 55. COMPARATIVE EXAMPLE 1 The organopolysiloxane was omitted, and a curable epoxy resin composition was prepared in the weight ratio shown in Table I. The curable epoxy resin composition was cured as in Example I, and physical properties of the hardened material were evaluated. Results are shown in Table I. Also, the hardness of the hardened material was 55, and it was confirmed that no differences existed in the degree of hardness from the hardened material measured in Example 1. Example 1 Comparative Example 1 Type of organopolysiloxane A B C/F D/G E E Organopolysiloxane 100 100 95/5 95/5 100 50 -- A -- -- -- -- -- 50 100 B 37.6 42.7 14.4 12.2 40.5 76.6 120.5 C 1 1 1 1 1 1 1 Flexibility 0 0 0 ▵ ▵ ▵ X Residual (wt%) 33 25 55 63 27 11 0 EXAMPLE 2 In addition to the components of Example 1, a fused silica with an average grain diameter of 13 µm was added, and a curable silicone composition was produced as in Example 1. The curable silicone composition produced was cured as in Example 1, and the physical properties of the hardened silicone material were measured. Results are shown in Table II. Example 2 Type of organopolysiloxane E E Organopolysiloxane 100 50 A -- 50 B 40.5 76.6 Fused silica 137.5 169.9 C 1 1 Flexibility ▵ ▵ Residual (wt%) 65 57 COMPARATIVE EXAMPLE 2 The same components as used in Example 1 were used except the organopolysiloxane shown in the following formula was used, and a curable silicone composition was produced as before. The organopolysiloxane shown in the formula below separated out onto the surface during curing of said curable silicone composition, and it was not possible to evaluate the physical properties of the material. The curable silicone composition of the present invention is composed of component (A) and component (B). Component (A) is an organopolysiloxane composed of monofunctional siloxane units (M units) containing an organic group containing an epoxy group and quaternary functional siloxane units (Q units). The curing properties of the silicone composition are superior. and a hardened silicone material having superior flexibility and heat resistance after curing can be obtained.

Claims: A curable silicone composition consisting of (A) an organopolysiloxane represented by the formula wherein R 1 is a monovalent hydrocarbon group except R 1 is not an alkenyl group; R 2 is a monovalent hydrocarbon group except R 2 is not an alkenyl group or hydrogen; R 3 is selected from organic groups that contain an epoxy group or an alkoxysilylalkyl group with the proviso that at least one R 3 group is an organic group containing an epoxy group; a is a positive number; b is a positive number; c is a positive number; a/c has a value of up to 4, b/c has a value of between 0.05 to 4, and (a + b)/c has a value of between 0.2 to 4; (B) a curing compound selected from curing agents or curing catalysts and optionally (C) fillers, fatty acid esters, metal salts, ester-based waxes and plasticizers. A composition as claimed in claim 1 wherein the curing agent (B) is selected from the group consisting of phenolic compounds, carboxylic acid compounds, acid anhydrides, amine compounds, compounds containing alkoxy groups, mixtures thereof and partial reaction products thereof. A composition as claimed in claim 1 wherein the curing catalyst (B) is selected from the group consisting of tertiary amine compounds, quaternary amine compounds, phosphorus compounds, aluminum compounds, and zirconium compounds. A composition as claimed in claim 1 wherein there is 0.1 to 500 parts of (B) per 100 parts of (A). A composition as claimed in claim 1 wherein (A) is an organopolysiloxane represented by the formula A composition as claimed in claim 1 wherein (A) is an organopolysiloxane represented by the formula A composition as claimed in claim 1 wherein (A) is an organopolysiloxane represented by the formula

Inventors: MORITA YOSHITSUGU, MORITA, YOSHITSUGU, MORITA, YOSHITSUGU, TORAY DOW CORNING
Applicants: DOW CORNING TORAY SILICONE, DOW CORNING TORAY SILICONE COMPANY, LIMITED
Application year: 1993
Main classification: C08L83
IPC codes: C08L83