DUAL ELEMENT HEADPHONE

Abstract: A dual element headphone (10) including a first acoustic transducer (28) mounted within a first housing so as to direct sound in a certain direction out of the first housing. The first housing is sized small enough so as to at least partially fit into the cavum concha of a listener's ear, and yet be larger in area than the entrance of the external acoustic meatus of the listener's ear. A second acoustic transducer (18) is mounted within a second housing. That second housing is substantially larger than the first housing, and overlies at least portion of the auricle of the listener's ear. A crossover circuit divides the electrical signals received by the headphone and transmits signals for higher frequencies to the first, smaller transducer and signals for lower frequencies to the second, larger transducer. The first transducer may be flexibly mounted for improved comfort and sound fidelity.

Description: DUAL ELEMENT HEADPHONE Background of the Invention This invention relates to headphones for sound reproduction with high fidelity, and in particu- lar to dual element headphones having one transducer for each ear directed to reproducing higher frequen¬ cies and one transducer for each ear directed to re¬ producing lower frequencies. Designers of loudspeakers have long recog- nized the need for more than a single acoustic trans¬ ducer to faithfully reproduce the entire audio spec¬ trum. Quality loudspeakers may contain from two to five separate acoustic transducers, each designed to operate over a specific portion of the audio spectrum. Crossover networks are employed to distribute the ap¬ plied audio signal to the proper acoustic transducer and these typically include circuits comprised of re¬ sistors, capacitors and inductors. In the same vein, headphones having two transducer elements for each side are known in the art. Refer particularly, for instance, to Piribauer, U.S. Patent No. 3,943,304, wherein there is disclosed a headphone speaker system which combines a dynamic transducer for lower frequencies with an electrostatic transducer for higher frequencies. Similarly, the disclosure of Mathis, U.S. Patent No. 4,418,248, shows use of two transducers, in this case using a dynamic transducer for lower frequencies and a piezoelectric transducer for higher frequencies. And Andre et al, U.S. Patent No. 4,965,836 discloses use of two dynamic transducers, a larger one for lower frequencies and a smaller one for higher frequencies. In each of the headphones disclosed in these patents, the transducers are oriented substantially coaxially, so that the sound from the two transducers emanates in almost en¬ tirely the same direction. This invention relates to improvements to the headphone and loudspeaker apparatus set forth above and to solutions to some of the problems raised or not solved thereby. Summary of the Invention The invention comprises a dual element head¬ phone for use by a listener. According to this inven¬ tion, a first acoustic transducer is mounted within a first housing so as to direct sound in a certain di¬ rection out of the first housing. The first housing is sized small enough so as to at least partially fit into the cavum concha of a listener's ear, and yet be larger in area than the entrance of the external acoustic meatus of the listener's ear. Means are pro¬ vided for supporting the first acoustic transducer in the listener's ear so as to direct the sound generated by the transducer toward the entrance of the external acoustic meatus. A second acoustic transducer is mounted within a second housing. That second housing is substantially larger than the first housing, and connected to the supporting means so as to overlie at least a portion of the auricle of the listener's ear. Of course means are provided for dividing the electri- cal signals received by the headphone, and transmit- ting signals for higher frequencies to the first, smaller transducer and signals for lower frequencies to the second, larger transducer. The supporting means would normally include a headband and mounting plate, providing a set of these transducers for asso¬ ciation with each ear. The first transducer may be flexibly mounted to the supporting means for improved comfort and sound fidelity. Other objects and advantages of the inven- tion will become apparent hereinafter. Description of the Drawing Fig. 1 is a perspective view of a headphone constructed according to a preferred embodiment of the invention. Fig. 2 is a side elevational view, partially in section, of the transducer assembly of the head¬ phone shown in Fig. 1. Fig. 3 is a front elevational view, partial¬ ly in section, of the transducer assembly of the head- phone shown in Fig. 1. Fig. 4 is a top plan view, partially in sec¬ tion, of the smaller transducer, taken along line 4-4 of Fig. 2. Fig. 5 is a side elevational view, partially cut away, of the transducer assembly of the headphone shown in Fig. 4 along line 5-5. Fig. 6 is a cross sectional view, taken gen¬ erally along line 6-6 of Fig. 3. Description of the Preferred Embodiment Referring now to Fig. 1, there is shown a headphone apparatus 10 constructed according to a pre¬ ferred embodiment of the invention. The headphone 10 includes a headband 12, generally fitted over the head of a listener. To each end of headband 12 is attached a transducer assembly 14, by means of an earcup assem- bly 16. As shown in Figs. 2, 3 and 6, according to the invention each transducer assembly 14 includes a large transducer 18, mounted by any suitable means to the earcup assembly 16. Generally such mounting means will include a mounting plate 20 to which large trans¬ ducer 18 is attached. Since a portion of mounting plate 20 is positioned in front of transducer 18, the mounting plate is provided with slots 20a, to permit passage of sound therethrough. Large transducer 18 is of a size substantially larger than the cavum concha 22 of the listener's ear. Mounting plate 20 is con¬ nected to the headband so as to position itself and large transducer 18 substantially flat against the listener's auricle 24. The invention also calls for another, small¬ er transducer 26 affixed within a housing 28. This housing 28 is associated with large transducer 18 so that sound emanates from the smaller transducer 26 in a direction transverse to the direction of the sound emanating from the large transducer. In the embodi¬ ment shown in the drawing figures, the housing 28 is attached to the mounting plate 20 and projects out¬ wardly therefrom. As shown in Figs. 3 and 6, housing 28 projects substantially perpendicular to the mount¬ ing plate 20, and is sized so as to at least partially fit into the cavum concha 22 of the listener's ear. Housing 28 is larger in area, however, than the en¬ trance of the external acoustic meatus 30 of the listener's ear. When in use by the listener, then, housing 28 projects into the cavum concha 22 and aligns the smaller transducer 26 generally with the entrance to the external acoustic meatus 30. With smaller transducer 26 thus positioned, the sound ema- nating therefrom is transmitted almost directly to the tympanum 32 of the listener's ear. The invention also provides for conventional crossover filter means 34 (Fig. 4) for dividing the sound signal into lower frequencies and higher fre- quencies. By this means 34 the lower frequencies are transmitted to the larger transducer 18 while the higher frequencies are transmitted to the smaller transducer 26. Since the smaller transducer 26 is positioned almost directly facing the tympanum 32, the higher frequencies are transmitted to the tympanum with great fidelity. Correspondingly, since the larg¬ er transducer 18 is positioned further away from the tympanum 32, the relatively larger amplitudes of the lower frequencies are prevented from uncomfortably over-exercising the tympanum. For greater comfort in using and wearing the headphone 10, it is known to provide padding material, such as foam pads 36, to cover the large transducer 18 and mounting plate 20. In the present invention, in order to further improve comfort in use, the mounting of the housing 28 to the mounting plate 20 may be a flexible mounting 38. This flexible mounting 38 in¬ cludes a boot 40 attached to the plate 20, the other end of the boot easily carrying the relatively light- weight housing 28. The signals to the smaller trans¬ ducer 26 should then be carried by some flexible means such as flexible wires 42 (Fig. 5) rather than some other means such as solid traces. While the apparatus hereinbefore described is effectively adapted to fulfill the aforesaid ob¬ jects, it is to be understood that the invention is not intended to be limited to the specific preferred embodiment of dual element headphone set forth above. Rather, it is to be taken as including all reasonable equivalents within the scope of the following claims.

Claims: I claim: 1. A headphone speaker system comprising: a first acoustic transducer for producing sound from electrical signals, mounted to a mounting plate and arranged to direct the produced sound in a first predetermined direction; and a second acoustic transducer for producing sound from electrical signals, mounted to said mount¬ ing plate and arranged to direct sound in a second predetermined direction transverse to said first pre- determined direction. 2. A headphone speaker system as recited in claim 1 further comprising means for receiving elec¬ trical signals to be converted to sound, and means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending signals for lower frequencies to said second transducer. 3. A headphone speaker system as recited in claim 1 wherein said first transducer is mounted to said mounting plate by means of a flexible mounting. 4. A headphone speaker system as recited in claim 1 wherein said first transducer is substantially smaller than said second transducer. 5. A headphone speaker system as recited in claim 1 wherein: said first transducer is sized so as to fit into the cavum concha of a listener's ear; and said second transducer is substantially larger than said first transducer and arranged on said mounting plate so as to substantially overlie at least a portion of the auricle of said listener's ear. 6. A headphone speaker system as recited in claim 5 wherein said first transducer is positioned by said mounting plate so as to direct sound into the external acoustic meatus of said listener's ear. 7. A headphone speaker system as recited in claim 1 further comprising a headband connected to said mounting plate, for supporting said transducers in proximity to an ear of a listener. 8. A headphone speaker system as recited in claim 7 wherein said mounting plate is connected at one end of said headband, and further comprising an¬ other mounting plate, also carrying a first and second transducer, for association with the listener's other ear. 9. In a headphone for use by a listener, the combination comprising: a headband fitted generally to the head of the listener; a transducer assembly attached at each end of said headband, each said transducer assembly including: means for mounting said transducer assembly to said headband; a first acoustic transducer for producing sound from electrical signals, mounted to said mounting means and arranged to direct the produced sound in a first predetermined direction; and a second acoustic transducer for producing sound from electrical signals, mounted to said mounting means and arranged to direct sound in a second predetermined direction transverse to said first pre- determined direction and generally to¬ ward the opposite transducer assembly. 10. A headphone as recited in claim 9 fur¬ ther comprising means for receiving electrical signals to be converted to sound, and means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending sig¬ nals for lower frequencies to said second transducer. 11. A headphone as recited in claim 9 wherein said first transducer is flexibly mounted to said mounting means. 12. A headphone as recited in claim 9 wherein said first transducer is substantially smaller than said second transducer. 13. A headphone as recited in claim 9 wherein: said first transducer is sized so as to fit into the cavum concha of a listener's ear; and said second transducer is substantially larger than said first transducer and connected to said mounting means so as to substantially overlie at least a portion of the auricle of said listener's ear. 14. A headphone as recited in claim 13 wherein said first transducer is positioned by said mounting means and headband so as to direct sound into the external acoustic meatus of said listener's ear. 15. A dual element headphone for use by a listener comprising: a first acoustic transducer mounted within a first housing so as to direct sound in a certain direction out of said first housing, said first hous¬ ing sized so as to at least partially fit into the cavum concha of a listener's ear, said first housing being larger in area than the entrance of the external acoustic meatus of the listener's ear; means for supporting said first acoustic transducer in the listener's ear so as to direct sound toward the entrance of said external acoustic meatus; a second acoustic transducer mounted within a second housing, said second housing being substan- tially larger than said first housing, and connected to said supporting means so as to overlie at least a portion of the auricle of the listener's ear. 16. A dual element headphone as recited in claim 15 further comprising: means for receiving electrical signals to be converted to sound; and means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending signals for lower fre¬ quencies to said second transducer. 17. A dual element headphone as recited in claim 15 wherein said first transducer is flexibly mounted to said supporting means. 18. A headphone speaker system as recited in claim 15 wherein said supporting means includes a headband connected to said transducers, for supporting said transducers in proximity to an ear of a listener. 19. A headphone speaker system as recited in claim 18 wherein said supporting means includes: a first mounting plate connected at one end of said headband, to which mounting plate said first and second transducers are mounted; and a second mounting plate connected at the opposite end of said headband, also carrying a first and second transducer, for association with the lis¬ tener's other ear. _J_3_DED CLAIMS [received by the International Bureau on 2 August 1993 (02.08.93); original claims 1,4,9 and 12 cancelled; original claims 2,3,5,7,10,11 and 13 amended; new claims 20-29 added; other claims unchanged (7 pages)] 2. A headphone speaker system as recited in claim 5 further comprising means for receiving elec¬ trical signals to be converted to sound, and means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending signals for lower frequencies to said second transducer. 3. A headphone speaker system as recited in claim 5 wherein said first transducer is mounted to said mounting plate by means of a flexible mounting. 5. A headphone speaker system comprising: a first acoustic transducer for producing sound from electrical signals, mounted to a mounting plate and arranged to direct the produced sound in a first predetermined direction; and a second acoustic transducer for producing sound from electrical signals, mounted to said mount¬ ing plate and arranged to direct sound in a second predetermined direction transverse to said first pre- determined direction; said first transducer sized so as to fit into the cavum concha of a listener's ear; and said second transducer being substantially larger than said first transducer and arranged on said mounting plate so as to substantially overlie at least a portion of the auricle of said listener's ear. 6. A headphone speaker system as recited in claim 5 wherein said first transducer is positioned by said mounting plate so as to direct sound into the external acoustic meatus of said listener's ear. 7. A headphone speaker system as recited in claim 5 further comprising a headband connected to said mounting plate, for supporting said transducers in proximity to an ear of a listener. 8. A headphone speaker system as recited in claim 7 wherein said mounting plate is connected at one end of said headband, and further comprising an¬ other mounting plate, also carrying a first and second transducer, for association with the listener's other ear. 10. A headphone as recited in claim 13 fur¬ ther comprising means for receiving electrical signals to be converted to sound, and means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending sig¬ nals for lower frequencies to said second transducer. 11. A headphone as recited in claim 13 wherein said first transducer is flexibly mounted to said mounting means. 13. In a headphone for use by a listener, the combination comprising: a headband fitted generally to the head of the listener; a transducer assembly attached at each end of said headband, each said transducer assembly including: means for mounting said transducer assembly to said headband; a first acoustic transducer for pro- ducing sound from electrical sig¬ nals, mounted to said mounting means and arranged to direct the produced sound in a first prede- termined direction; and a second acoustic transducer for pro¬ ducing sound from electrical sig¬ nals, mounted to said mounting means and arranged to direct sound in a second predetermined direction transverse to said first predetermined direction and generally toward the opposite transducer assembly; said first transducer sized so as to fit into the cavum concha of a listener's ear; and said second transducer being substan¬ tially larger than said first transducer and connected to said mounting means so as to substan¬ tially overlie at least a portion of the auricle of said listener's ear. 14. A headphone as recited in claim 13 wherein said first transducer is positioned by said mounting means and headband so as to direct sound into the external acoustic meatus of said listener's ear. 15. A dual element headphone for use by a listener comprising: a first acoustic transducer mounted within a first housing so as to direct sound in a certain 5 direction out of said first housing, said first hous¬ ♦ ing sized so as to at least partially fit into the cavum concha of a listener's ear, said first housing being larger in area than the entrance of the external acoustic meatus of the listener's ear; 10 means for supporting said first acoustic transducer in the listener's ear so as to direct sound toward the entrance of said external acoustic meatus; a second acoustic transducer mounted within a second housing, said second housing being substan- 15 tially larger than said first housing, and connected to said supporting means so as to overlie at least a portion of the auricle of the listener's ear. 16. A dual element headphone as recited in claim 15 further comprising: means for receiving electrical signals to be converted to sound; and 5 means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending signals for lower fre¬ quencies to said second transducer. 17. A dual element headphone as recited in claim 15 wherein said first transducer is flexibly mounted to said supporting means. 18. A headphone speaker system as recited in claim 15 wherein said supporting means includes a headband connected to said transducers, for supporting said transducers in proximity to an ear of a listener. 19. A headphone speaker system as recited in claim 18 wherein said supporting means includes: a first mounting plate connected at one end of said headband, to which mounting plate said first and second transducers are mounted; and a second mounting plate connected at the opposite end of said headband, also carrying a first and second transducer, for association with the lis¬ tener's other ear. 20. A headphone speaker system comprising: a first acoustic transducer for producing sound from electrical signals, mounted to a mounting plate and arranged to direct the produced sound in a first predetermined direction; and a second acoustic transducer for producing sound from electrical signals, mounted to said mount¬ ing plate and arranged to direct sound in a second predetermined direction transverse to said first pre- determined direction; said second transducer oriented on said mounting plate so as to substantially overlie at least a portion of the auricle of said listener's ear. 21. A headphone speaker system as recited in claim 20 wherein said first transducer is sized and oriented on said mounting plate so as to substantially fit into the cavum concha of a listener's ear. 22. A headphone speaker system as recited in claim 21 further comprising means for receiving electrical signals to be converted to sound, and means for dividing said electrical signals, and sending sig- nals for higher frequencies to said first transducer and sending signals for lower frequencies to said sec- ond transducer. 23. A headphone speaker system as recited in claim 20 wherein said first transducer is mounted to said mounting plate by means of a flexible mount¬ ing. 24. A headphone speaker system as recited in claim 20 further comprising a headband connected to said mounting plate, for supporting said transducers in proximity to an ear of a listener. 25. A dual element headphone for use by a listener comprising: a first acoustic transducer mounted within a first housing so as to direct sound in a certain direction out of said first housing, said first hous¬ ing sized so as to at least partially fit into the cavum concha of a listener's ear; means for supporting said first acoustic transducer in the listener's ear so as to direct sound toward the entrance of the listener's external acous¬ tic meatus; a second acoustic transducer mounted within a second housing, said second housing connected to said supporting means so as to overlie at least a por- tion of the listener's ear. 26. A dual element headphone as recited in claim 25 further comprising: means for receiving electrical signals to be converted to sound; and means for dividing said electrical signals, and sending signals for higher frequencies to said first transducer and sending signals for lower fre¬ quencies to said second transducer. 27. A dual element headphone as recited in claim 25 wherein said first transducer is flexibly mounted to said supporting means. 28. A headphone speaker system as recited in claim 25 wherein said supporting means includes a headband connected to said transducers, for supporting said transducers in proximity to the listener's ear. 29. A headphone speaker system as recited in claim 28 wherein said supporting means includes: a first mounting plate connected at one end of said headband, to which mounting plate said first and second transducers are mounted; and a second mounting plate connected at the opposite end of said headband, also carrying a first and second transducer, for association with the lis¬ tener's other ear. STATEMENT UNDER ARTICLE 19 The Amendment of the claims presented herewith incorporates the limitations of claim 1 into claim 5 and the limitations of claim 9 into claim 13. In addition, new claims 20 through 29 are presented herewith, claims 20 and 25 being independent. Claim 20 corresponds to claim 5, as amended above, without the unnecessary limitation relating to the size of the second transducer. Similarly, claim 25 corresponds to original claim 13, again having had removed therefrom the unnecessary limitation relating to the size of the second acoustic trans¬ ducer.

Inventors: KOSS MICHAEL J, KOSS, MICHAEL, J.
Applicants: KOSS CORP, KOSS CORPORATION
Application year: 1993
Main classification: H04R25
IPC codes: H04R1, H04R5, H04R25