Power semiconductor device

Abstract: An integrated structure pad assembly for lead bonding to a power semiconductor device chip comprises a chip portion having a top surface covered by a metallization layer (10) and which comprises a first sub-portion (1) wherein functionally active elements of the power device are present; said chip portion comprises at least one second sub-portion (11) wherein no functionally active elements of the power device are present, and a top surface of the metallization layer (10) is elevated over said at least one second sub-portion (11) with respect to the first sub-portion (1) to form at least one protrusion which forms a support surface for a lead.

Description: The present invention relates to an integrated structure pad assembly for wire bonding on active area in power semiconductor devices, particularly with cellular structure, such as power MOSFETs and Insulated Gate Bipolar Transistors, and to a manufacturing process therefor. In power semiconductor devices such as those fabricated in MOS technology the chip area reserved to the bonding pads can be a significant fraction of the overall chip area. In the case for example of a low-voltage power MOSFET with a specified voltage rating of 100 V, the MOSFET current can be in the range of several tens of Ampere; to sustain such a current, the source wire must have a quite large diameter, typically 0.4-0.5 mm, and the area dedicated to bonding the wire to the chip must be of the order of 1.3 x 1.3 mm 2 . The situation is even worse when more than one source wire is necessary. To overcome this problem, the technique is known of realizing the bonding areas directly over the active area of the device, without the necessity of providing dedicated pad areas; such a technique is known with the name "bonding on active area", and allows a reduction in the chip size, since no areas are wasted for the realization of the bonding pads. Such technique however poses some problems, particularly as far as the soldering process between the wire and the chip metallization layer is concerned. Generally, aluminium wires having big diameter are soldered to the chip metallization layer by means of a technique known as "Ultrasonic Wire Bonding" (USWB), consisting in laying the wire to be soldered on the aluminium layer on the chip, applying a given vertical force to the wire, and simultaneously submitting the wire to an "ultrasonic discharge"; the ultrasonic discharge, together with the pressure exerted on the wire, put the two surfaces into close contact, breaking down their superficial oxides so that soldering is obtained. When Ultrasonic Wire Bonding on active area is carried out, for example on a power MOSFET chip, the significant mechanical stress to which the device is submitted during the bonding phase is transferred to the dielectric layers underlying the metallization layer, i.e. to the gate oxide layer and to the polysilicon gate layer, causing cracks in the oxide layer or microdefects which reduce the device relyability. The gate oxide layer, being generally the thinnest dielectric layer, is the most susceptible to such damages. The bigger the diameter of the wires used, the more probable the fenomenon is: when wires of diameter bigger than 0.4 mm are used, a sistematic damage can take place. Furthermore, since the technology trend in low-voltage power MOS devices goes toward a reduction in the oxide layer thickness, to reduce the output resistance and to increase the current densities, bonding on active area becomes more and more impractical. US-A-4 881 106 discloses a power MOSFET substantially as recited in the preamble of claim 1. In view of the state of art described, the object of the present invention is to realize an integrated structure pad assembly for wire bonding which allows bonding on active area without the abovementioned drawbacks. According to the present invention, such object is attained by means of a power semiconductor device chip as set forth in claim 1. In a power semiconductor device chip having a structure according to the present invention, the mechanical stresses transmitted by the wire to the power device chip during the bonding process are sustained by the dummy cell, which does not contain any functionally active element of the power device. Since the bonding pad region is elevated with respect to the surface of the metallization layer above the cells containing active elements, the bonding wires do not come into hard physical contact with the cells containing active elements but only with the dummy cells, and since these latter are more resistant to mechanical stress than the active cells, it possible to realize a bonding pad region directly on the active area of the power semiconductor device, without the risk of damaging the power device. The features of the present invention will be made more evident by the following detailed description of three practical realization of its preferred embodiment, illustrated as non-limiting examples in the annexed drawings, wherein: Figure 1 is a schematic top plan view of an integrated structure pad assembly according to a first practical realization of the preferred embodiment of the invention; Figure 2 is a cross-sectional view taken along the line II-II of Figure 1; Figure 3 is a schematic top plan view of an integrated structure pad assembly according to a second practical realization of the preferred embodiment of the invention; Figure 4 is a schematic top plan view of an integrated structure pad assembly according to a third practical realization of the preferred embodiment of the invention; Figures 5 to 7 are cross-sectional views similar to that shown in Figure 2, showing intermediate steps during the manufacturing process. A power semiconductor device, for example a power MOSFET, is composed by a plurality of elementary cells, also called "source cells", disposed to form a bidimensional array. In Figure 2 two source cells 1 are shown, each formed by a respective first sub-portion of semiconductor device chip: they comprise a P+ deep body region 2 obtained into an N- epitaxial layer 3 which is in turn grown over an N+ substrate 4. The P+ deep body region 2 is laterally surrounded by and merged with a P- annular region 5; inside the P type semiconductor region composed by the P- annular region 5 and by the P+ deep body region 2, an N+ annular region 6 is obtained constituting a source region of the elementary source cell 1. At the semiconductor surface, an oxide layer 7 extends over the P- annular region 5 and partially over the N+ annular region 6; a polysilicon layer 8 is superimposed over and autoaligned with the underlying oxide layer 7. An insulating layer 9 covers the polysilicon layer 8 and is selectively etched to form contact areas to allow an over lying metal layer 10 to come into contact with both the N+ annular region 6 and the P+ deep body region 2; the metal layer 10 contacts in the same way all the elementary source cells 1 and constitutes a source electrode for the power MOSFET. An integrated structure pad assembly according to a first practical realization of a preferred embodiment of the invention, shown in Figure 1, is substantially constituted by a bidimensional array of elementary source cells 1 intercalated with dummy cells 11 having horizontal dimensions identical to those of the source cells 1, but different height. This clearly appears in Figure 2, wherein the cross-section of one of such dummy cells 11 is shown as formed by a second sub-portion of the semiconductor chip. Differently from an elementary source cell 1, no P+ deep body region 2, P- annular region 5 and N+ annular region 6 are provided in the dummy cell 11; furthermore, the thickness of the oxide layer 7 is greater than the thickness of said oxide layer 7 in the source cells 1: this causes the surface of the metal layer 10 to be elevated over the dummy cells 11 with respect to the source cells 1. Such dummy cells 11 are more resistant to mechanical stresses than the source cells, because of the greater thickness of the oxide layer 7, and thanks to the fact that over them the metal layer 10 protrudes superiorly with respect to the surface of the source cells, when a wire is laid on the pad for being soldered to it, said wire does not come into hard phisical contact with the elementary source cells 1, but only with the dummy cells 11. Various topological distribution of dummy cells 11 and elementary source cells 1 are possibile, depending on the wire diameter: in Figure 1, a distribution is shown in which about 90% of the pad area is occupied by elementary source cells 1 and 10% by dummy cells 11: this means that 90% of the pad area is active area, and only 10% of the area is wasted. In Figure 3 a second practical realization of the preferred embodiment of the invention is shown, substantially differing from the previous one in that a different topological distribution of elementary source cells 1 and dummy cells 11 is used; as in the previous practical realization, the 90% of the total pad area is active area, while the 10% is wasted area. In Figure 4 a third practical realization of the preferred embodiment is shown in which the dummy cells 11 are disposed to form lines. As already noted, different topological dispositions and densities of the dummy cells 11 in the array of elementary cells 1 can be used, depending on the wire diameter and on the total pad area. For the manufacturing of an integrated structure pad assembly according to the preferred embodiment of the invention, a lightly doped N- epitaxial layer 3 is initially grown over a heavily doped N+ substrate 4; this latter is generally a silicon wafer with the "100" crystallographic cut orientation, and has a resistivity of about 10 mohm/cm; the epitaxial layer is instead highly resistive, having a resistivity value ranging from 1 to 100 ohm/cm. The thickness of the epitaxial layer 3 ranges from 1 to 100 µm. The silicon wafer is then oxidixed, to obtain an oxide layer having thickness of about 1 or 2 µm (Fig. 5). Masking and selective etching allow to obtain windows in the oxide layer in correspondance of the areas of formation of the elementary source cells 1 of the power device. The oxide layer is not removed from the areas wherein dummy cells 11 are to be obtained, and in the periphery of the chip. Boron ions are then implanted into the epitaxial layer 3 through said windows in the oxide layer, to form the P+ deep body regions 2 of the elementary cells 1 (Fig. 6). The oxide layer 7 is then removed from the surface of the active area of the power device, but not from the areas wherein the dummy cells 11 are to be formed. The active area of the device is then covered by a thinner oxide layer, to form the gate oxide layer, and the whole semiconductor surface is covered by a polysilicon layer 8 (Fig. 7). Windows are then opened in the polysilicon layer 8 and in the thinner oxide layer to selectively implant dopant ions to form the P- annular regions 5 and the N+ source regions 6 of the elementary cells 1. An insulation layer 9 is then deposited on the semiconductor surface and contact windows are opened in it to allow a metal layer 10 to come into contact with the source regions 6 and with the P+ deep body region 2 of all the elementary cells 1 (Fig. 2). A metallization layer is also deposited on the bottom surface of the device to form a drain electrode of the power MOSFET.

Claims: Power semiconductor device chip comprising: first and second identical cells (1) provided in a first major surface of said chip, each of said cells comprising active elements and a main contact region of a power device; a first insulating layer (7) having a first thickness and provided on said major surface above said first and second cells, said first insulating layer comprising first and second openings above said respective main contact regions of said first and second cells; a dummy cell (11) separating said first and second cells and having substantially identical dimensions thereto, and no active device regions formed therein; a second insulating layer (7) having a second thickness greater than said first thickness formed on the surface of said dummy cell; a contact metallization layer (10) provided on said first insulating layer above said first and second cells and contacting each of said main contact regions; characterized in that said contact metallization layer further extends above said second insulating layer above the dummy cell, thereby forming a bonding pad region for a bonding wire which is elevated with respect to the surface of said metallization layer above said first and second cells. Power semiconductor device chip according to claim 1, comprising a plurality of said identical cells disposed in a bidimensional array. Power semiconductor device chip according to claim 2, characterized in that it comprises a plurality of said dummy cells which are intercalated with said active cells. Power semiconductor device chip according to claim 2 or 3, said semiconductor chip comprising a substrate (4) covered by a lightly doped layer (3) of a first conductivity type, each one of said active cells being constituted by a respective first portion of the lightly doped layer (3) in which a heavily doped region (2) of a second conductivity type is provided, in which in turn a heavily doped region (6) of the first conductivity type is further provided, said first portion of the lightly doped layer (3) being partially covered by a first triple layer (7,8,9) comprising said first insulating layer (7), a conductive layer (8) and a third insulating layer (9), wherein each one of said dummy cells is constituted by a respective second portion of the lightly doped layer (3) which is completely covered by a second triple layer (7,8,9) comprising said second insulating layer, said conductive layer and said third insulating layer. Power semiconductor device chip according to claim 4, characterized in that said lightly doped layer (3) is an epitaxial layer. Power semiconductor device chip according to claim 5, characterized in that said substrate (4) is of the first conductivity type. Power semiconductor device chip according to claim 5, characterized in that said substrate (4) is of the second conductivity type.

Inventors: FRISINA FERRUCCIO, MANGIAGLI MARCANTONIO, FRISINA, FERRUCCIO, MANGIAGLI, MARCANTONIO
Applicants: CONS RIC MICROELETTRONICA, CONSORZIO PER LA RICERCA SULLA MICROELETTRONICA NEL MEZZOGIORNO
Application year: 1993
Main classification: H01L23
IPC codes: H01L23, H01L21, H01L27, H01L29