COOLER FOR HEAT GENERATION DEVICE

Abstract: In a cooler including a fan unit (3) attached to the top of, or buried into, a heat sink (2) fitted to a heat generation device (1), the present invention constitutes the heat sink (2) in various shapes so as to generate an effective air flow and to accomplish a uniform cooling operation. A cooling fan disposed away from the heat sink (2) or sideways of the heat sink (2) effectively cools the device through a ventilation path defined by a pipe or a cover.

Description: TECHNICAL FIELD The present invention relates to a cooling device for cooling a heat-generating element or a heat-generating unit, that is, a heat sink system, more particularly relates to a heat-generating element cooling device for cooling a heat-generating element or heat-generating unit such as a high density integrated circuit package. BACKGROUND ART Relative small sized, but multi-functional and high performance electronic equipment such as personal computers (PCs), work stations, and other desktop type or desk-side type computers make use of high density integrated circuit packages. These become local sources of heat. Usually, heat-radiating fins are provided individually or in common for such high density integrated circuit packages. Use is made of natural cooling by natural ventilation or forced cooling by common cooling fins for the equipment as a whole so as to cool the same along with other elements and units. Some recent high integration LSI packages give off several watts of heat. Further, along with the rise of the clock frequency used, the amount of heat generated increases. In particular, it is sometimes not possible to obtain sufficient cooling with the above type of usual heat sink in the case of an LSI package generating from 5 to 6 or more watts of heat. As the cooling fans for forced cooling, use is made of, for example, 60 to 80 mm square sized fans for the above-mentioned desktop type personal computers or 120 mm square sized fans for desk-side type computers, operated at a considerably high speed of, for example, 3000 to 5000 rpm. Use of ones with more powerful cooling capacities is not possible in view of the size of the equipment, costs, and noise. That is, if the fans are made larger in size, the size of the equipment increases accompanying this, the costs increase, and the noise increases as well, but the cooling capacity does not increase commensurate with the same. Further, even if a number of fans are used arranged in series or in parallel, the size of the equipment and the costs increase in accordance with this, but the resultant amount of cooling air does not similarly multiply. Further, operating the fan at a higher speed is difficult in view of the noise. Also, even if a large sized fan is operated at a low speed, the merits in terms of cooling effect and noise commensurate with the demerits of the equipment size and costs cannot be obtained. For these reasons, as a result, it is not possible to supply sufficient cooling air for the heat sink of a high heat generating LSI package for example as mentioned above. For example, a conventional example of the case of cooling a printed circuit board mounted in high density mounting electronic equipment is shown in Fig. 1. In this conventional example, cooling fans 17 are arranged in a shelf 15 of the electronic equipment for cooling the printed circuit boards 16, 16... housed in the shelf 15. When heat-generating elements 1 are mounted on the printed circuit boards 16, 16..., it is necessary to increase the efficiency of cooling the heat-generating elements 1 by affixing known heat sinks provided with a plurality of heat-radiating fins to the heat-generating elements 1. Note that in Fig. 1, 19 shows connectors for mounting the printed circuit boards 16 to a back panel, while 20 shows an air duct. The main object of a heat sink is to increase the heat conducting area. If trying to obtain a high heat radiating effect, the height of the heat-radiating fins must be made greater or the interval between the heat-radiating fins must be made narrower, but in an actual board, this would lead to a reduction in the mounting density and an increase in the fluid resistance and thus would cause the problem, it has been pointed out, of not being able to obtain the required performance. Further, even with cooling by a cooling fan 17, it is not possible to cool just a specific heat-generating element 1 on a spot basis. When a certain air speed or more is already obtained, there is the problem that the demerit of the greater noise becomes greater than the improvement of the cooling efficiency due to the increased air speed. In the known heat sink, when trying to improve the cooling capacity, it is necessary to increase the surface area of the heat-radiating fins. When narrowing the interval between heat-radiating fins to try to increase the surface area, however, the pressure loss increases and the heat radiating effect is not effectively improved. A conventional cooling device for cooling a heat-generating element is shown in Fig. 2. In this conventional device, a heat sink 2 formed of a material with a good heat conductivity, such as aluminum, is affixed as a heat radiator on the heat-generating element 1. The heat sink 2 is provided on top with a plurality of comb-tooth-like heat-radiating fins 4, 4... The heat emitted from the heat-generating element 1 is conducted to the heat sink 2, then absorbed by the cooling air. That is, in a heat sink provided with such comb-tooth-like heat-radiating fins, referring to Fig. 3, if the interval between the heat-radiating fins 4 is made narrower, the air speed V2 becomes smaller than the air speed V1. Further, comparing the pressure loss of the heat-radiating fins 4 and the surrounding pressure loss, the surrounding pressure loss becomes far smaller so the majority of the cooling air ends up flowing in the surrounding area. Accordingly, if the amount of heat emitted by the heat-generating element 1 increases, it becomes necessary to raise the air speed near the heat-generating element 1 to raise the heat radiating effect and therefore use of a more powerful fan becomes necessary. On the other hand, to make the fan more powerful, in general the size of the fan is increased or else the rotational speed is raised. There is the problem, however, that the result is an increase in the mounting space of the fan or an increase in the noise. To raise the heat radiating effect, it is also possible to increase the surface area of the heat-radiating fins 4, but in this case there is the problem that this causes an increase in the mounting space. To resolve this, since the heat-generating elements or units emitting particularly high heat in a piece of equipment are usually limited to a handful of locations, it has been considered to provide these heat-generating elements or units with heat sinks assembled with for example individual small-sized cooling fans of about 25 to 40 mm square size so as to send the individually required amounts of cooling air to the heat sinks of these heat-generating elements or units and perform local forced cooling. Figure 4 gives front views, including partial cross-sections, illustrating schematically the kinds, that is, type, of mounting structures with such a cooling fan and heat sink assembled together. Here, examples are shown of application to a cooling device of an LSI package. In the figure, 1 is a package, that is, a heat-generating element, 2 is a heat sink formed by a material with a good heat conductivity, and 3 is a cooling fan unit. Consideration may be given to a direct vertical mounting type where the fan unit 3 is mounted above the heat sink, as shown in Fig. 4(A), and a buried mounting type where the fan unit 3 is buried in the heat sink 2, as shown in Fig. 4(B). However, sufficient study has yet to be made of the shape, structure, etc. for meeting size requirements and achieving high cooling efficiencies for the realization of a heat sink provided with an individual cooling fan for a heat-generating element or unit, particularly with equipment being made smaller in size and with higher mounting densities. In particular, sufficient study has not been made of a thin cooling structure able to meet the requirements of recent high density mounting equipment. Figure 5 gives a side view (A) and plan view (B) showing only the heat radiator portion in a cooling device of the mounting structure shown in Fig. 4(A). This heat radiator is comprised of a heat sink 2 formed of a material with a good heat conductivity and with a plurality of heat-radiating fins 4, 4... projecting out at the top surface and a cooling fan unit 3 provided above the heat sink 2. In such a conventional heat radiator comprised of a heat sink and cooling fan formed integrally together, the cooling fan unit 3 is constructed to be driven by a centrally disposed motor 3c to turn its fan blades 3. The motor 3c does not necessarily have to have a high cooling air generating capacity, since the area of projection of the cooling air on the blowing surface is large. To exhibit the desired cooling effect, it is necessary to raise the rotational speed etc. of the motor 3c. This has the problem of causing the generation of noise etc. Further, the cooling fan unit 3, as mentioned above, has a motor 3c disposed at its center, so there was the problem that the amount of cooling air becomes smaller at the center of the heat sink 2 where the amount of heat generated is the greatest and so the cooling efficiency is not by any means high. Figure 6 gives a side view (A) and a plan view (B) for explaining the cooling action in the heat radiator of the above-mentioned construction. This heat radiator is comprised of a heat sink 2 which has a plurality of pin-shaped heat-radiating fins 4, 4, ... projecting out from its top surface and which is adhered or affixed to the heat-generating element 1 and a cooling fan unit 3 which has a fan 3b accommodated in a casing 3a and which is mounted above the heat sink 2. It is designed so that the fan 3b of the cooling fan unit 3 is operated to cool the heat sink 2 to which the heat emitted from the heat-generating element 1 is conducted. In the above-mentioned conventional example, however, the distance between the bottom end of the fan 3b and the top surface of the heat sink 2 was substantially zero, so there was the problem that the area directly under the fan motor unit, that is the centre portion of the heat sink 2, became a dead zone, inviting a reduction of the cooling efficiency and resulting in a larger pressure loss and thus the reduction of the capacity of the fan 3b. Further, for example, in the case of the so-called push system where the exhaust air of the fan 3b is blown against the heat sink 2, the flow of air diffuses while swivelling as shown by the arrow marks in Fig. 6(B), so there is the problem that mutual interference is caused, dead points occur, and therefore the effective amount of air contributing to the actual cooling is reduced. Also, to resolve these problems and improve the cooling efficiency, it is possible to use a high speed fan for the cooling unit 3, but in this case there is the problem that the noise ends up becoming greater. WO-A-8900751 discloses a cooling device in which a heat generating element is housed within a sealed enclosure. An indirect heat exchanger, having a heat sink, is attached to the enclosure, and utilises forced convection by a fan combined with natural convection. The heat exchanger draws heated air from the enclosure by means of the fan mounted in a centre or side of the heat sink, which is then cooled. The cooled air is then drawn back into the fan and returned to the enclosure. Research Disclosure no. 330, October 1991, Emsworth, GB, page 813, XP265060 relates to a cover (an air collector and duct) mounted onto a heat sink, thereby introducing cooling air. According to a first aspect of the present invention there is provided a heat-generating element cooling device comprising: a heat radiator for attachment to a heat-generating element mounted on a printed circuit board, said heat radiator having a heat sink formed of a material with a good heat conductivity and a plurality of heat-radiating fins; characterised by a hollow pipe portion, said hollow pipe portion being arranged at a centre portion of the said heat sink and having small blowing holes in a side wall of said pipe portion, an air conduit passage connected with the said hollow pipe portion, and a blowing device, connected with the said hollow pipe portion by means of the said air conduit passage, for forcibly introducing cooling air through the said air passage to the said pipe portion of said heat radiator, whereby the said cooling air is ejected through said small blowing holes towards the said heat-radiating fins. According to a second aspect of the present invention there is provided a heat-generating element cooling device comprising: a heat radiator for attachment to a heat-generating element mounted on a printed circuit board, said heat radiator having a heat sink formed of a material with a good heat conductivity and a plurality of heat-radiating fins; characterised by a plurality of hollow pipe portions, said hollow pipe portions being arranged symmetrically of said heat sink and having small blowing holes in a side wall of said pipe portion, an air conduit passage connected with the said hollow pipe portions and a blowing device, connected with the said hollow pipe portions by means of the said air conduit passage, for forcibly introducing cooling air through the said air conduit passage to said pipe portions of said heat radiator, whereby the said cooling air is ejected through said small blowing holes towards the said heat-radiating fins. Reference will now be made, by way of example, to the accompanying drawings, in which: Figure 1 is a view of a conventional example of the case of cooling a printed circuit board. Figure 2 is a view of the problems in the conventional cooling construction. Figure 3 is a view explaining the action of the conventional heat sink. Figure 4 gives frontal views including partial cross-sections illustrating schematically the types of mounting structures of combinations of cooling fans and heat sinks. Figure 5 gives views showing a conventional example of the type of Fig. 4(A), wherein (A) is a side view and (B) is a plan view of the heat sink. Figure 6 gives views showing a conventional example of the type of Fig. 4(B), wherein (A) is a side view and (B) is a plan view of the heat sink. Figure 7 gives views of the construction of a piece of electronic equipment to which a first embodiment of the heat-generating element cooling device according to the present invention is applied, wherein (A) is an overall view and (B) is an enlarged view of important portions. Figure 8 is a perspective view of the construction of a heat radiator in the first embodiment of the heat-generating element cooling device according to the present invention. Figure 9 is a plan view of Fig. 8. Figure 10 gives views of a modification of Fig. 8, wherein (A) is a perspective view and (B) is a plan view. Figure 11 is a cross-sectional view of the construction of a heat radiator in a second embodiment of a heat-generating element cooling device according to the present invention. Figure 12 is a cross-sectional view of a modification of Fig. 11. Figure 13 is a cross-sectional view of another modification of Fig. 11. Figure 14 gives views of the construction of a heat radiator in a third embodiment of the heat-generating element cooling device according to the present invention, wherein (A) is a plan view and (B) is a sectional view along the line B-B. Figure 15 is a perspective view of the construction of a heat radiator in a fourth embodiment of the heat-generating element cooling device according to the present invention. Figure 16 is a cross-sectional view of Fig. 15. Figure 17 is a plan view of Fig. 16. Figure 18 is a cross-sectional view of a modification of Fig. 15. Figure 19 is a view of a plan view of Fig. 18. Figure 20 is a view of the construction of a piece of electronic equipment to which a fifth embodiment of the heat-generating element cooling device according to the present invention is applied. Figure 21 is an enlarged view of important portions of Fig. 20. Figure 22 gives views of the state of connection of air conduit pipes. The construction of Fig. 7 shows the construction of a piece of electronic equipment to which the first embodiment of the heat-generating element cooling device according to the present invention is applied, in particular, the construction of the shelf 15 of the same. (A) is an overall view and (B) is an enlarged view of important portions of the same. In a piece of equipment of this construction, in the shelf 15, a plurality of printed circuit boards 16, 16... are plugged in to a rear back panel for connection. On the printed circuit boards 16, 16... are mounted various types of electronic devices including heat-generating elements 1. To introduce cooling air for cooling these elements into the shelf 15, the shelf 15 has cooling fans 17. Note that in Fig. 7, 20 shows an air duct provided for uniformly cooling the inside of the shelf 15. The flow of the cooling air inside the shelf 15, that is the air flow, is shown by the arrow marks in Fig. 7. Further, to cool a heat-generating element 1 on a spot basis, a blowing device 5 is mounted at the bottom of the shelf 15. The cooling air from this blowing device 5 is sent through a bellows-type duct 21 to a heat radiator 10, which serves as the main part of the heat-generating element cooling device of the present embodiment. Details of the heat radiator 10 in the heat-generating element cooling device of the present embodiment are shown in Fig. 8 and Fig. 9. The heat radiator 10 according to this embodiment is comprised of a heat sink 2 formed by a material with a good heat conductivity, for example aluminum, and a pipe portion 6 disposed at the center portion of the heat sink 2. The entire top surface of the heat sink 2 except for the center portion has a plurality of pin-shaped heat-radiating fins 4, 4... projected out from it. The pipe portion 6 is formed having a hollow rectangular cross-section and is sealed at its end portion. Further, the side walls of the pipe portion 6 have a plurality of small blowing holes 7, 7... formed in them corresponding to the intervals of the heat-radiating fins 4. On the other hand, as shown in Fig. 7, the blowing device 5 is preferably one provided with a high static pressure characteristic, such as a sirocco fan, a blower, or a compressor. In the illustrated embodiment, use is made of a sirocco fan. The exhaust port of the blowing device 5 has connected to it the bellows-type duct 21 communicating with the air duct 20. Cooling air is blown to the pipe portion 6 of the heat radiator 10 through this bellows-type duct 21. Accordingly, in this embodiment, the cooling air blown through the serpentine duct 21 to the pipe portion 6, as shown by the arrow marks in Fig. 9, is ejected from the small blowing holes 7 to the sides of the pipe portion 6 and cools the heat-radiating fins 5 disposed at the sides of the pipe portion 6. Note that the heat sink 2 of the heat radiator 10 according to the present embodiment is provided with pin-shaped heat-radiating fins 4, but in place of this it is also possible to form a plurality of wall-shaped heat-radiating fins 4 as shown in Fig. 10. In this case, the heat-radiating fins 4 are arranged along the opening direction of the small blowing holes 7 of the pipe portion 6 (see Fig. 10(B)). Further, in these embodiments, the pipe portion 6 of the heat radiator 10 may be formed integrally with the heat sink 2, but it is also possible to form the pipe portion 6 separately and to attach it detachably to the heat sink 2. In this case, the pipe portion 6 may be constituted so as to be mounted engaged with the heat sink 2. Figure 11 shows the heat radiator 10 of a second embodiment of a heat-generating element cooling device according to the present invention. In the heat radiator 10 according to this embodiment, the heat sink 2 has mounted to it a cover member 22. A pipe portion 6 is formed between a pair of suspended walls 22a, 22a, which are suspended from the center portion of the cover member 22 and which have a plurality of small blowing holes 7, 7... pierced through them, and the heat sink 2. The depth direction of the pipe portion 6 formed between the suspended walls 22a and the heat sink 2 is closed by a closing wall 22b formed at the cover member 22 or constituting part of the same. Further, the cover member 22 according to this embodiment is provided with engaging walls 23 at the side wall portions which for example are engaged with engagement grooves 18 made in the heat sink 2. Figure 12 shows a modification of Fig. 11. The pipe portion 6 in this modification is disposed at a suitable height from the base surface 12 of the heat-radiating fins 4. A plurality of small blowing holes 7, 7... are made through the bottom wall 13 and the side walls of the pipe portion 6. Accordingly, in this embodiment, the cooling air is ejected from the center toward the sides and is ejected also to the top of the center line L (see Fig. 9) of the heat sink 2 so the center portion of the heat-generating element 1, i.e., the high temperature area, is effectively cooled. Figure 13 shows another modification of Fig. 11. The pipe portion 6 in this modification has a circular section. Small blowing holes 7 are made in the bottom side of the pipe portion 6. Accordingly, in the heat radiator according to this embodiment, as shown by the arrow marks in the figure, the cooling air is ejected from the pipe portion 6 at a downward slant and so like with the above modification, the center portion of the heat-generating element 1, i.e. the high temperature area, is effectively cooled. Figure 14 shows the heat radiator 10 in a third embodiment of the heat-generating element cooling device according to the present invention, wherein (A) is a plan view and (B) is a sectional view along the line B-B. In the embodiment, two pipe portions 6 are provided at symmetrical positions with respect to the center line L of the heat sink 2. Small blowing holes 7 are made in the bottom walls 13 of these pipe portions 6. Therefore, in this embodiment, the cooling air is ejected from the two pipe portions 6 toward the center line L of the heat sink 2, and the center portion, that is, the high temperature area, is effectively cooled. Figure 15 is a perspective view of the heat radiator 10 in a fourth embodiment of the heat-generating element cooling device according to the present invention. Figure 16 is a cross-sectional view of the same, and Fig. 17 is a plan view thereof. The pipe portion 6 in this embodiment has a guide portion 14 which bends toward the center portion of the heat sink 2. The front end of this guide portion 14 is opened. In the state attached to the heat sink 2, it abuts against the base surface 12 of the heat-radiating fins of the heat sink 2 and therefore is closed (see Fig. 16). Therefore, in this embodiment, the cooling air is guided to the center portion of the heat sink 2 to cool the center portion of the heat sink 2 and also is ejected from the small blowing holes 7 made in the side walls of the guide portion 14 toward the sides to cool the surrounding heat-radiating fins 4,4 ... (see Fig. 17). A modification of the heat radiator shown in Fig. 15 is shown in Fig. 18. Figure 19 is a plan view of the same. The guide portion 14 in this modification is formed with a bottom. Small blowing holes 7 are made in the center of the bottom wall 13 of the guide portion 14 disposed at a suitable height position from the base surface 12 of the heat-radiating fins 4 of the heat sink 2. Accordingly, in this modification, the cooling air is ejected to the center of the heat sink 2, a high temperature area, in a state with no interference, to enable a greater improvement of the cooling efficiency (see Fig. 18 and Fig. 19). Figure 20 shows the construction of a piece of electronic equipment to which a fifth embodiment of the heat-generating element cooling device according to the present invention is applied. In equipment of this construction, modules M, M... in which the heat-generating elements 1 are mounted are attached on the printed circuit boards 16, 16... provided with front plates 16a at the side edges corresponding to the open face of the shelf 15. The heat-generating elements 1 of the modules M have heat radiators 10 attached to them. Cooling air is blown to the heat radiators 10 by connecting an air conduit passage 11 to the pipe portions 6 of the heat radiators 10. Further, the air conduit passage 11 and the blowing device 5 are connected by a coupling portion 8' provided at the front plates 16a of the printed circuit boards 16. The blowing device 5, as shown in Fig. 21, is provided with a blower or a pump or other blowing device 24 and a throttle valve 25. The throttle valve 25 is adjusted based on information from the temperature sensors 26, 26... disposed near the heat radiators 10, enabling a supply of cooling air to the heat radiators 10 controlled in accordance with the state of heat emission. Note that in Fig. 21, reference 29 shows a valve controller which adjusts the throttle valve 25 by comparing the information from the temperature sensors 26 and the setting. Further, two or more blowing devices 24 may be disposed so that when the detection value of a pressure sensor 27 or a flow sensor 27 disposed at the output side falls below a lower limit setting, a standby device may be operated and thereby the redundancy improved. Also, in Fig. 21, 28 is a selective controller for selecting the blowing devices 24 by comparing information from the pressure sensors etc. 27 and the settings, and 30 is a switcher operating by a signal from the selective controller 28. On the other hand, the air conduit passage 11 is formed by suitably connecting a plurality of air conduit pipes 9, 9... The air conduit pipes 9 are comprised of a main pipe portion 9a and a branched pipe portion 9b branched from the same and have a substantially L-shaped plan section. As shown in Fig. 22(A), a joint portion 8 is formed at one end of the main pipe portion 9a. The other end of the main pipe portion 9a of another air conduit pipe 9 is fit into this or is connected by screwing. The branch pipe portion 9b is connected to the pipe portion 6 of the heat radiator 10. Note that in Fig. 22, 8a shows an O-ring attached to the coupling portion 8. Further, as mentioned above, the end of the air conduit passage 11 formed connecting the plurality of air conduit pipes 9, as shown in Fig. 22(B), may be closed by a cap member 9c. Further, the above-mentioned air conduit pipes 9 may be prepared in advance in numerous types with different lengths of the main pipe portions 9a and branched pipe portions 9b and be suitably selected and used in accordance with the disposition of the high heat-generating elements 1 on the printed circuit boards 16, 16... As clear from the above explanation of the embodiments, according to the heat-generating element cooling device of the present invention, it is possible to cool a specific element with a high cooling efficiency. As explained above, according to the heat radiator of the present invention, it is possible to make effective use of the cooling air of a cooling fan with limited power, so it is possible to raise the cooling efficiency. On top of this, there is no need for using a high powered cooling fan, so it is possible to prevent the generation of noise. Further, according to the integral fan type heat-generating element cooling device according to the present invention, the advantages of the direct vertical mounting type where the fan unit is mounted above the heat sink, the buried mounting type where the fan unit is buried in the center portion of the heat sink, and the side mounting type where the fan unit is disposed at the side of the assembly of the heat-generating element and the heat sink are made effective use of to improve the cooling efficiency and make the construction thinner. For example, it therefore becomes possible to meet the recent demands for high density mounting equipment such as personal computers, work stations, etc.

Claims: A heat-generating element cooling device comprising: a heat radiator (10) for attachment to a heat-generating element (1) mounted on a printed circuit board, said heat radiator (10) having a heat sink (2) formed of a material with a good heat conductivity and a plurality of heat-radiating fins (4); characterised by a hollow pipe portion (6), said hollow pipe portion (6) being arranged at a centre portion of the said heat sink (2) and having small blowing holes (7) in the side walls of said pipe portion (6), an air conduit passage (11, 21) connected with the said hollow pipe portion (6), and a blowing device (5), connected with the said hollow pipe portion (6) by means of the said air conduit passage (11, 21), for forcibly introducing cooling air through the said air passage (21) to the said pipe portion (6) of said heat radiator (10), whereby the said cooling air is ejected through said small blowing holes (7) towards the said heat-radiating fins (4). A heat-generating element cooling device as claimed in claim 1, further comprising a plurality of heat radiators (10) for attachment to said printed circuit board, wherein said air conduit passage (11) comprises a plurality of air conduit pipes (9), at least a first coupling portion (8') being provided for connecting said air conduit pipes (9) together, cooling air being introduced from said blowing device (5) to each of said pipe portions (6) provided for each of said plurality of said heat radiators (10) of the device via respective ones of the air conduit pipes (9) . A heat-generating element cooling device as claimed in claim 2, wherein the said air conduit passage (11) further comprises at least a second coupling portion (8) for connecting said air conduit pipes (9) together, said second coupling portion (8) being arranged for mounting on a front board connected to said printed circuit board. A heat-generating element cooling device as claimed in any preceding claim, wherein said pipe portion (6) is arranged on a centre line of said heat-generating element (1) and at a suitable distance from a heat-radiating fin base surface (12) of said heat sink (2) and is provided with small blowing holes (7) in a bottom wall (13) of said pipe portion (6) to eject said cooling air through said small blowing holes (7) to said heat-radiating fins (4). A heat-generating element cooling device as claimed in any preceding claim, wherein said pipe portion (6) is formed with a guide portion (14) for guiding said cooling air towards the centre of said heat sink (2). A heat-generating element cooling device as claimed in claim 5, wherein said guide portion (14) is arranged such that there is a suitable distance between a bottom wall (13) of said guide portion (14) and a heat-radiating fin base surface (12) of said heat sink (2), and is provided with small blowing holes (7) in said bottom wall (13) of said guide portion (14) to eject said cooling air through said small blowing holes (7) to said heat-radiating fins (4). A heat-generating element cooling device as claimed in any one of claims 1 to 4, further including a cover member (22) mounted on said heat sink (2) for effectively introducing said cooling air to said heat-radiating fins (4) from said blowing device (3). A heat-generating element cooling device as claimed in claim 1, wherein the said air conduit passage comprises a bellows-type duct (21). A heat-generating element cooling device comprising: a heat radiator (10) for attachment to a heat-generating element (1) mounted on a printed circuit board, said heat radiator (10) having a heat sink (2) formed of a material with a good heat conductivity and a plurality of heat-radiating fins (4); characterised by a plurality of hollow pipe portions (6), said hollow pipe portions (6) being arranged at symmetrical positions with respect to the center line of the heat generating element and having small blowing holes (7) in said pipe portions (6), an air conduit passage (11, 21) connected with the said hollow pipe portions (6) and a blowing device (5), connected with the said hollow pipe portions (6) by means of the said air conduit passage (11, 21), for forcibly introducing cooling air through the said air conduit passage (11, 21) to said pipe portions (6) of said heat radiator (10), whereby the said cooling air is ejected through said small blowing holes (7) towards the said heat-radiating fins (4). A heat-generating element cooling device as claimed in claim 9, further comprising a plurality of heat radiators (10) for attachment to said printed circuit board, wherein said air conduit passage (11) comprises a plurality of air conduit pipes (9), at least a first coupling portion (8') being provided for connecting said air conduit pipes (9) together, cooling air being introduced from said blowing device (5) to each of said pipe portions (6) provided for each of said plurality of said heat radiators (10) of said device via respective ones of the air conduit pipes (9). A heat-generating element cooling device as claimed in claim 10, wherein said air conduit passage (11) further comprises at least a second coupling portion (8) for connecting said air conduit pipes (9) together, said second coupling portion (8) being arranged for mounting on a front board connected to said printed circuit board.

Inventors: KITAHARA TAKASHI, SHIMANUKI TADAYOSHI, KITAHARA, TAKASHI, SHIMANUKI, TADAYOSHI, KITAHARA, TAKASHI PFU LIMITED NU-98-2, AZA UNOKE, SHIMANUKI, TADAYOSHI PFU LIMITED
Applicants: PFU LTD, PFU LIMITED
Application year: 1993
Main classification: H05K7
IPC codes: H01L23, H05K7