TAB type semiconductor device

Abstract: According to this invention, there is provided a semiconductor device including a TAB tape (12) having an element through hole (11), a plurality of leads (13) integrally formed on the TAB tape (12), a semiconductor element (14) connected to one end of each of the leads (13) through a bump formed in the element through hole (11), a plurality of lead frames (15) each connected to the other end of a corresponding one of the leads (13), and a mold resin (16) sealed to cover the most part of the TAB tape (12), the leads (13), the semiconductor element (14), and the lead frames (15), wherein connection portions (17) between the leads (13) and the lead frames (15) are linearly formed at equal pitches perpendicularly to an outer periphery of the semiconductor element (14) opposite to the connection portions (17). Each of portions near positions where the leads (13) are respectively connected to the lead frames (15) is formed in a gull-wing shape. The length of each of straight end portions formed by connecting the lead frames (15) to the leads (13) is set to be at least 0.3 mm or more. In the mold resin (16), the thickness of a resin positioned at the upper portion of the semiconductor element is set to be smaller than that of a resin positioned at the lower portion of the semiconductor element (14).

Description: The present invention relates to a TAB (Tape Automated Bonding) type semiconductor device and, more particularly, to an improvement of connection portions between leads and lead frames of the semiconductor device. In a conventional TAB type semiconductor device, as expressed by its name, a semiconductor element is arranged on a tape (film), and a bonding operation can be performed by an automatic machine. It is expected that TAB type semiconductor devices will be popularly used due to their flexibility or the like. That is, a conventional TAB type semiconductor device is arranged as shown in Figs. 1 to 3, Fig. 1 is a sectional view showing a schematic overall arrangement of the semiconductor device, Fig. 2 is an enlarged plan view showing a 1/4 part of the device in Fig. 1, and Fig. 3 is an enlarged plan view showing a main part of the device in Fig. 2. As shown in Fig. 1, a conventional semiconductor device is constituted by a TAB tape 2 having an element through hole 1 and consisting of an insulator, a plurality of leads 3 consisting of a metal foil integrally formed on the TAB tape 2, a semiconductor element 4 arranged in the element through hole 1 and connected to one end of each of the leads 3 through a bump (not shown), a plurality of lead frames 5 each connected to the other end of a corresponding one of the leads 3, and a mould (mold) resin 6 sealed to cover the most part of the TAB tape 2, the leads 3, the semiconductor element 4, and the lead frames 5. Note that, in the mold resin 6, a resin positioned at the upper portion of the semiconductor element 4 and a resin positioned at the lower portion of the semiconductor element 4 have the same thickness L. When the above semiconductor device is to be manufactured, one end of each of the leads 3 of the TAB tape 2 is connected to the semiconductor element 4 first. The semiconductor element 4 generally has Au bumps, and the leads 3 are Sn-plated. The leads 3 are heated by a bonding jig to form an Au-Sn alloy, thereby connecting the leads 3 to the semiconductor element 4. Each of the leads 3 of the TAB tape 2 is molded in a gull-wing shape, and cut to have a desired length. The leads 3 are laid on the lead frame leads (lead frames) 5, respectively and the positions of the leads 3 are respectively matched with the positions of the lead frames 5 such that the leads 3 overlap the lead frames 5. The lead frames 5 are generally Ag-plated, and the leads 3 are Sn-plated as described above. For this reason, when a bonding jig of about 550°C × 1" is pressed on the leads 3 and the lead frames 5, Ag-Sn diffusion progresses to respectively connect the leads 3 to the lead frames 5. When the resultant structure in this state is arranged in a transfer mold, and is subjected to transfer molding, the conventional semiconductor device is completed. The lead frames 5 are arranged in a radial form to their distal ends, and the lead frames 5 overlap the leads 3 of the TAB tape 2 at the connection portions 7 to be connected to the leads 3, respectively. In this case, as shown in Fig. 3, the pitches of the lead frames 5 are drawn such that the lead width h of each of the lead frames 5 and each lead interval h' between the lead frames 5 assure a minimum width (0.22 or 0.27) at which etching or press processing can be performed, and a , b , c , d ,... are sequentially determined, thereby setting the shape and size of each lead. Therefore, pitches between the leads satisfy a condition of P 1 ' > P 2 ' > ... P n '. In accordance with this, the sizes of the leads 3 of the TAB tape 2 are determined accordingly. In the conventional semiconductor device, however, the following drawback is posed. That is, the leads 3 of the TAB tape 2 are formed in a gull-wing shape, the pitches of the leads 3 are increased as the leads 3 is closer to the four corners of the semiconductor element 4, and the leads 3 are twisted and are not easily matched with the lead frames 5. In addition, the sizes of the pitches of the lead frames 5 and the sizes of the pitches of the leads 3 of the TAB tape 2 cannot easily be measured and managed because these pitches are not equal to each other. The lengths of the leads 3 of the TAB tape 2 tend to be increased as the leads 3 are closer to the four corners of the semiconductor element 4. The leads 3 which are not formed in a gull-wing shape are used because the leads 3 of the TAB tape 2 cannot be stably formed in a gull-wing shape. For this reason, the thickness of the mold resin 6 at the upper portion of the semiconductor element 4 is increased, passivation cracks disadvantageously occur. It is an object of the present invention to provide a semiconductor device in which the pitches of the leads of a TAB tape are prevented from being ununiform to facilitate size management of the TAB tape, thereby preventing passivation cracks in a mold resin. US-A-3 902 148 discloses a device comprising a chip attached to a heat sink and to intermediate leads. The intermediate leads are connected to external leads. The device comprises two levels of packaging. Both DE-A-4 113 034 and Feinwerktechnik und Messtechnik 100 (11), p.506-510 disclose a TAB package in which TAB leads are bonded to conductors on a substrate. US-A-5 065 504 teaches a method of forming gull-wing leads in a TAB package. According to the present invention, there is provided a semiconductor device as defined in claim 1. Each of portions near positions where the leads are respectively connected to the lead frames is formed in a gull-wing shape. The length of each of straight end portions formed by connecting the lead frames to the leads is set to be at least 0.3 mm or more. In the mold resin, the thickness of a resin positioned at the upper portion of the semiconductor element is set to be smaller than that of a resin positioned at the lower portion of the semiconductor element. Therefore, according to the present invention, the size of the gull-wing shape of each of the leads of the TAB tape can easily be assured. Design, size measurement, and size management can easily be performed because the pitches of the lead frames are equal to each other, and because the pitches of the leads of the TAB tape on the lead frame side are equal to each other. In addition, cost required for manufacturing a mold and an etching pattern to be processed can be reduced by 15%. The size of the gull-wing shape of each of the leads of the TAB tape is set to be a desired size, thereby preventing passivation cracks occurring due to a stress of the mold resin. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: Fig. 1 is a sectional view showing the overall schematic arrangement of a conventional TAB type semiconductor device; Fig. 2 is an enlarged plan view showing a main part of the semiconductor device in Fig. 1; Fig. 3 is an enlarged plan view showing a main part of the part of Fig. 2; Fig. 4 is a sectional view showing an overall schematic arrangement of a TAB semiconductor device according to an embodiment of the present invention; Fig. 5 is an enlarged plan view showing a main part of the semiconductor device in Fig. 4; Fig. 6 is an enlarged plan view showing a main part of the part of Fig. 5; and Fig. 7 is a side view including a section in Fig. 6. An embodiment of the present invention will be described below with reference to the accompanying drawings. A semiconductor device according to the present invention is arranged as shown in Figs. 4 to 7. Fig. 4 is a sectional view showing the schematic overall arrangement of the semiconductor device, Fig. 5 is an enlarged plan view showing a 1/4 part of the semiconductor device in Fig. 4, Fig. 6 is an enlarged plan view showing a main part of the part of Fig. 5, and Fig. 7 is a side view including a section in Fig. 6. As shown in Fig. 4, the semiconductor device of the present invention is constituted by a TAB tape 12 having an element through hole 11 and consisting of an insulator, a plurality of leads 13 consisting of a metal foil integrally formed on the TAB tape 12, a semiconductor element 14 connected to one end of each of the leads 13 through a bump (not shown) formed in the element through hole 11, a plurality of lead frames 15 each connected to the other end of a corresponding one of the leads 13, and a mold resin 16 sealed so as to cover the most part of the TAB tape 12, the leads 13, the semiconductor element 14, and the lead frames 15. In this case, connection portions 17 between the leads 13 and the leads frames 15 are linearly arranged at equal pitches perpendicularly to the outer periphery of the semiconductor element 14 opposite to the connection portions 17. This is the characteristic feature of the present invention. Each of portions 13a near positions where the leads 13 are respectively connected to the lead frames 15, as is apparent from Figs. 4 and 7, is formed in a gull-wing shape. As shown in Fig. 6, the length of each of straight end portions 15a where the lead frames 15 are respectively connected to the leads 13 is set to be at least 0.3 mm or more. As is apparent from Fig. 4, in the mold resin 16, a resin 16a positioned at the upper portion of the semiconductor element 14 has a thickness L 1 set to be smaller than a thickness L 2 of a resin 16b positioned at the lower portion of the semiconductor element 14. That is, the mold resin 16 is sealed to satisfy a condition of L 1 < L 2 . The above arrangement will be described below in detail. Each of the pitches of the lead frames 15 and the leads 13 is set to be a pitch P, and the lead width h and a lead interval h' at each of four corners in Fig. 6 are selected depending on processing methods. That is, when P = 0.32 is satisfied in etching processing, and P = 0.38 is satisfied in press processing, it can be assured that the lead width and the sum of the lead width and lead interval (h + h' at the central portion) of the connection portion 17 near the central portion of the semiconductor device are set to be 0.227 and 0.27, respectively. In this case,  < 45° is satisfied. The values of the pitch P are obtained when the angle  is about 45°. The pitch P can be decreased when the angle  is small. The intervals between the semiconductor device and the flexing points Q of lead frames 15 are increased as the intervals between the flexing points Q and the center of the semiconductor device are decreased, thereby increasing the lengths of the straight end portions 15a. In this case, the pitch P can be slightly decreased. Each of the straight end portions 15a requires a length of at least about 0.3 to 0.5 for the connection portions 17. The connection portions 17 are etched at a time or subjected to single-point bonding such that the flat portions of the gull-wing-shaped leads 13 respectively overlap the straight end portions 15a of the lead frames 15. The leads 13 are formed in a gull-wing shape because the resin thicknesses of the mold resin 16 satisfy the condition of L 1 < L 2 to prevent passivation cracks in the semiconductor element 14. Note that the resin thicknesses of the mold resin 16 satisfy the condition of L 1 < L 2 because a stress acts on the semiconductor element 14 due to molding shrinkage. When the thicknesses satisfy the condition of L 1 < L 2 to decrease the thickness L 1 , a stress acting on the semiconductor element 14 can be decreased. For this reason, passivation cracks can be prevented. In an example in which a KE-250MT (a trade name of a mold resin manufacturer) was used and 208 pins are arranged, the number of passivation cracks could be set to be "0". In manufacturing the above semiconductor device, the leads 13 of the TAB tape 12 are adhered to the semiconductor element 14 first. A bump consisting of Au is generally formed on the semiconductor element 14, and one end of each of the leads 13 is Sn-plated. These ends are heated by a bonding jig to form an Au-Sn alloy, thereby connecting the leads 13 to the semiconductor element 14. The other end of each of the leads 13 is formed in a gull-wing shape by a mold, and then cut to have a desired length. The other end of each of the leads 13 overlaps a corresponding one of the lead frames 15, and the positions of the leads 13 are respectively matched with the positions of the lead frame 15 such that the other end of the lead 13 overlap one end of the corresponding lead frame 15. One end of each of the lead frames 15 is Ag-plated, and the other end of each of the leads 13 is Sn-plated. For this reason, when a bonding jig of about 500°C × 1" is pressed on the leads 13 and the lead frames 15, Ag-Sn diffusion progresses to connect the leads 13 to the lead frames 15, respectively. When the resultant structure in this state is arranged in a transfer mold and subjected to transfer molding, the semiconductor device shown in Fig. 4 is completed. According to the present invention, the following excellent effect can be obtained. The size of the gull-wing shape of the leads 13 of the TAB tape 12 can easily be assured. That is, when each lead pitch shift and each lead length (indicated by ℓ in Fig. 7) in the semiconductor device of the present invention are compared with those in the semiconductor device of the prior art, the following results can be obtained. Prior Art Present Invention Lead Pitch Shift 20 to 30 µm 15 µm Lead Length 5 to 10 µm 5 µm Design, size measurement, and size management can easily be performed because the pitches of the lead frames 15 are equal to each other, and because the pitches of the leads of the TAB tape 12 on the lead frame side are equal to each other. In addition, cost required for manufacturing a mold and an etching pattern to be processed can be reduced by 15%. The size of the gull-wing shape of each of the leads 13 of the TAB tape 12 is set to be a desired size, thereby preventing passivation cracks occurring due to a stress of the mold resin 16.

Claims: A semiconductor device comprising: a TAB tape (12) having an element through hole (11); a plurality of TAB leads (13) integrally formed on said TAB tape (12); a semiconductor element (14) provided in said element through hole (11) and connected to one end of each of said leads (13) by bumps formed on a first surface of said semiconductor element (14); a plurality of lead frame leads (15) each connected to the other end of a corresponding one of said TAB leads (13); and a mould resin (16) sealed to cover said TAB tape (12), said TAB leads (13), said semiconductor element (14), and part of said lead frame leads (15), wherein connection portions (17) between said TAB leads (13) and said lead frame leads (15) are linearly formed at equal pitches perpendicularly to an outer periphery of said semiconductor element (14) opposite to said connection portions (17). A device according to claim 1, characterized in that each of said TAB leads is formed in a gull-wing shape near said connection portions. A device according to claim 1, characterized in each lead frame lead comprises a straight end portion where said connection portion is provided, said straight end portion having a length of at least 0.3 mm. A device according to claim 1, characterized in that the thickness of said resin above said first surface of said semiconductor element (14) is set to be smaller than the thickness of said resin above a second surface of said semiconductor element (14) opposing said first surface.

Inventors: HIRATA SEIICHI, KOJIMA SHINJIRO, HIRATA, SEIICHI, KOJIMA, SHINJIRO, HIRATA, SEIICHI, C/O INT. PROPERTY DIVISION, KOJIMA, SHINJIRO, C/O INT. PROPERTY DIVISION
Applicants: TOSHIBA KK, KABUSHIKI KAISHA TOSHIBA
Application year: 1993
Main classification: H01L23
IPC codes: H01L21, H01L23