CONNECTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Abstract: A right angle connector device (10) is provided which can hold conductive pins in proper place at a pin-bending step. A plastic housing (12) is molded with a plurality of conductive pins (22, 24) set in and relative to the plastic housing. The respective pins are L-shaped at the time of molding and, after the housing has been molded, have their outer short portions (22c, 24c) bent in a direction vertical to one surface of the housing. At the bending step, the pins, even if being stressed with a bending force, are rigidly fixed by the surrounding plastic and hence held in proper place in the housing.

Description: Title CONNECTOR DEVICE AND METHOD FOR MANUFACTURING SAME Background of the Invention 1. Field of the Invention The present invention relates to a surface mounting connector device and a method for manufacturing the same and, in particular, to the art of a right angle connector device for surface mounting. 2. ' Description of the Related Art Generally, a 2 mm-pitch right angle connector device is manufactured by inserting conductive pins into a once-molded plastics housing and bending their end portions at an angle of 90° with respect to one housing surface. These bent end portions of the pins serve as solder leads and are soldered to lands on an associated printed circuit board. The connector device manufactured by a method using the pin insertion step is not enough strong to hold the pins in place in the housing and is not stable. At the bending step and subsequent steps, the connector device is not enough strong and rigid to hold the pins in proper place in the housing. Further, an assembling machine or tooling is required upon insertion of the pins into the housing, thus involving a high manufacturing cost . Summary of the Invention It is accordingly the object of the present invention to provide a connector device and a method for manufacturing the same which can adequately hold pins in a housing and, during a bending process and at a subsequent step, ensure a positive positioning of pins in and relative to the housing. In one aspect of the present invention, there is provided a connector device comprising: an elongated housing molded with a resin material and having mutually opposite first and second surface sections and a third surface section to be opposed to a surface of a circuit board in a direction perpendicular to the first and second surface sections and a plurality of first conductive pins and of second conductive pins set in place in and relative to the housing and arranged along a direction parallel to the third surface section at a molding step; the plurality of first conductive pins arranged as a single array along a length of the housing, the first conductive pin comprising a vertical portion having one end situated outside the housing and the other end situated inside the housing and vertically extending from its one end side, past the first surface section of the housing, toward its other end side near the second surface section, a parallel portion situated inside the housing and extending from the other end side of the vertical portion toward the third surface section in a direction substantially parallel to the second surface section, and a section projecting, as an extension of the parallel portion, out of the third surface section and bent substantially vertically toward the second surface section along the third surface section to provide a bent portion to be set in contact with a surface of an associated circuit board; and the plurality of second conductive pins arranged as a single array along a length of the housing in a direction substantially parallel to that in which the plurality of first conductive pins are arranged as a single array, the second conductive pin comprising a vertical portion having one end situated inside the housing and vertically extending from its one end side, past the first surface section of the housing, toward its other end side near the first surface section, a parallel portion situated inside the housing and extending from the other end side of the vertical portion toward the third surface section in a direction substantially parallel to the first surface portion, and a portion projecting, as an extension of the parallel portion, out of the third surface section and bent substantially vertically toward the first surface section along the third surface section to provide a bent portion to be set in contact with the surface of the associated circuit board. According to another aspect of the present invention there is provided a method for manufacturing a connector device, comprising the steps of: molding an elongated housing with a resin material with a plurality of substantially L-shaped first conductive pins and of substantially L-shaped second conductive pins set in the housing, the housing having mutually opposite first and second surface sections and a third surface section to be opposed to a surface of a circuit board in a direction perpendicular to the first and second surface sections, the plurality of first conductive pins arranged as a single array along a length of the housing, the first conductive pin having one end outside the housing and other end outside the housing and extending from its other end side, out of the third surface section in a direction vertical to the third surface section and the plurality of second conductive pins arranged as a single array along the length of the housing in a direction substantially parallel to that in which the first conductive pins are arranged as a single array, the second conductive pin having one end outside the housing and other end outside the housing and extending from its one end side into the housing and projecting, on its other end side, out of the third surface section vertically along the third surface section; and substantially vertically bending the first conductive pin toward the second surface section and the second conductive pin toward the first surface section to provide bent portions to be set in contact with the surface of the circuit board. According to the present connector device and the present manufacturing method, the housing is molded with a resin with conductive pins set in place in and relative to the resin housing, whereby the conductive pins are fixed by the surrounding resin structure and hence positively held in place in and relative to the resin housing. Brief Description of the Drawings Fig. 1 is a perspective view showing a face mounting connector device according to an embodiment of the present invention; Fig. 2 is a cross-sectional view, taken along line II-II in Fig. 1; Fig. 3 is a top view showing the connector device shown in Fig. 1; Fig. 4 is a cross-sectional view showing the connector device of Fig. 1 with conductive pins shown in a state before a bending step; and Fig. 5 is a front view showing the connector device of Fig. 1. Detailed Description of the Preferred Embodiments Fig. 1 shows a first embodiment of the present invention. A right angle connector device 10 of the present invention includes an elongated housing 12 which is injection molded of an insulating resin material, that is, plastics such as PBT, nylon, PPS and PET. The housing 12 is substantially U-shaped in vertical cross-section and has opposed surface sections 14 and 16, upper and lower, and a side surface section 18 formed perpendicular to the upper and lower surface sections 14 and 16 and to be set opposite a surface of a printed circuit board, not shown. Preferably, a groove 20 is provided in the side surface section 18 and used to remove a flux, at a time of soldering such as flow soldering or reflow soldering, which causes a defective connection, corrosion and undesirable external appearance if being deposited there. The side surface section 18 of the housing 12 is divided by the groove 20 into upper and lower side surface sections 18a and 18b. A plurality of first pins 22 and of second pins 24 are set in and relative to the housing 12 upon injection molding of the housing. The first pin 22 has three continuous portions 22a, 22b and 22c as shown in Fig. 2. The portion 22a of the first pin 22 extends, as a vertical portion, from above the upper surface 14 down toward the neighborhood of the lower surface section 16 at an inside area of the housing 12. Inside the housing near the lower surface section 16, the portion 22b of the first pin 22 extends, as a parallel portion, from the lower end of the vertical portion 22b of the first pin toward the lower side surface section of the housing 12, that is, extends substantially parallel to the lower surface section 16. The portion 22c, that is, a bent portion, of the first pin 22 extends, as a soldering lead 22c, out of the lower side surface section and is bent downwardly at an angle of nearly 90° relative to the lower surface section 16. The second pin 24 is substantially J-shaped and has three continuous portions 24a, 24b and 24c. The portion 24a of the second pin 24 extends, as a vertical portion, from above the upper surface section 14 of the housing 12 down toward the upper side surface section of the side surface section 18 inside the housing at an area near the upper surface section 14. Inside the housing at an area near the upper surface section 14, the portion 24b of the second pin 24 extends, as a parallel portion, from the lower end of the vertical portion 24a toward the upper side surface section 18a of the housing, that is, extends substantially parallel to the upper surface section 14 of the housing 12. The portion 24c, that is, a bent section, of the second pin 24 extends, as a soldering lead 24c, upwardly out of the upper side surface section 18a of the housing such that the portion 24c of the second pin 24 is bent at an angle of nearly 90° relative to the upper surface section 14 of the housing 12. As shown in Fig. 3 in particularly, these vertical portions of the first pins 22 are arranged as a single array along the length of the elongated housing 12 such that they extend upwardly relative to the upper surface section 14 of the housing 12. The vertical portions 24a of the second pins 24 are arranged as a single array along the length of the housing such that they extend upwardly relative to the upper surface section 14 of the housing. Solder pads 26 are each provided around the corresponding pin (22, 24) at the upper surface section 14 so as to locate the vertical portions 22a and 24a there. The solder pads 26 in a respective array are arranged at a pitch of 2 mm. As shown in Fig. 4, the first and second pins 22 and 24, upon the injection molding of the housing 12, are set in a substantially L-shape configuration with the portions 22c and 24c extending, as unbent portions, coaxial with the parallel portions 22b and 24c, respectively. As shown in Figs. 1 to 3 and 5, after the housing has been so injection molded, the unbent portions of the first and second pins are 90° bent as the bent portions 22c and 24c as already set out above. By so doing, a right angle connector device is manufactured which has solder leads 22c and 24c to be set opposite the surface of the aforementioned printed circuit board. The plastics molded with the pins 22 and 24 set as set out above provides, during the pin bending step and subsequent steps, a strength and rigidity enough great to maintain these pins 22 and 24 in proper position. It is thus possible to prevent the pins from being undesirably displaced at the bending step as compared with a conventional right angle connector device of such a type that pins are inserted in the plastics housing once molded. The right angle connector device of the present invention is face mounted on the circuit board by joining the bent portions 22c and 24c of the first and second pins 22 and 24, by a reflow soldering for instance, to the corresponding lands on the circuit board with the side surface section 18 of the housing 12 placed opposite the surface of the circuit board. At the soldering step, the groove 20 in the side surface section 18 of the housing defines a clearance relative to the surface of the circuit board, enabling the flux to be removed readily and completely through the groove or the clearance 20. According to the present connector device as well as the present method, since the resin housing is molded with the pins set in proper place, the pins are rigidly fixed in place by their surrounding resin structure. That is, since the pins can be bent at the bending step relative to the housing such that they are fixed in proper place, it is possible to achieve a high holding force, with which the pins are held in and relative to the housing at the bending step and subsequent steps, and to decrease a stress in the pin-to-housing structure at the time of manufacture. Further, it is not necessary to assemble pins in the onced molded housing or use added tooling relative to that housing so that a tooling cost can be reduced.

Claims: What is claimed is : 1. A connector device comprising: an elongated housing molded with a resin material and having mutually opposite first and second surface sections and a third surface section to be opposed to a surface of a circuit board in a direction perpendicular to the first and second surface sections and a plurality of first conductive pins and of second conductive pins set in place in and relative to the housing and arranged along a direction parallel to the third surface section at a molding step; the plurality of first conductive pins arranged as a single array along a length of the housing, the first conductive pin comprising a vertical portion having one end situated outside the housing and the other end situated inside the housing and vertically extending from its one end side, past the first surface section of the housing, toward its other end side near the second surface section, a parallel portion situated inside the housing and extending from the other end side of the vertical portion toward the third surface section in a direction substantially parallel to the second surface section, and a section projecting, as an extension of the parallel portion, out of the third surface section and bent substantially vertically toward the second surface section along the third surface section to provide a bent portion to be set in contact with a surface of an associated circuit board; and the plurality of second conductive pins arranged as a single array along a length of the housing in a direction substantially parallel to that in which the plurality of first conductive pins are arranged as a single array, the second conductive pin comprising a vertical portion having one end situated outside the housing and the other end situated inside the housing and vertically extending from its one end side, past the first surface section of the housing, toward its other end side near the first surface section, a parallel portion situated inside the housing and extending from the other end side of the vertical portion toward the third surface section in a direction substantially parallel to the first surface portion, and a portion projecting, as an extension of the parallel portion, out of the third surface section and bent substantially vertically toward the first surface section along the third surface section to provide a bent portion to be set in contact with the surface of the associated circuit board. 2. A method for manufacturing a connector device, comprising the steps of: molding an elongated housing with a resin material with a plurality of substantially L-shaped first conductive pins and of substantially L-shaped second conductive pins set in the housing, the housing having mutually opposite first and second surface sections and a third surface section to be opposed to a surface of a circuit board in a direction perpendicular to the first and second surface sections, the plurality of first conductive pins arranged as a single array along a length of the housing, the first conductive pin having one end outside the housing and the other end outside the housing and extending from its one end side, vertically past the first surface section, into the housing and projecting, on its other end side, out of the third surface section vertically along the third surface section; and substantially vertically bending the first conductive pin toward the second surface section and the second conductive pin toward the first surface section to provide bent portions to be set in contact with the surface of the circuit board.

Inventors: KUANG KAN MENG, LIAN LOO GUAT, KUANG, KAN, MENG, LIAN, LOO, GUAT
Applicants: BERG TECH INC, KUANG KAN MENG, LIAN LOO GUAT, BERG TECHNOLOGY, INC.
Application year: 1993
Main classification: H01R9
IPC codes: H01R12, H01R43