NOVEL ETHERIMIDEIMIDE/ETHERIMIDE COPOLYMER

Abstract: This invention relates to novel copolymer of PEII/PEI having structural formula (I), wherein R and R' are independently selected from the group consisting of (a), (b), (c), (d), (e), (f) and (g);Ar and Ar' are independently selected from the group consisting of alkyl group with 6 to 12 carbon atoms and phenyl derivatives; and n and m are independently an integer between 5 and 500.

Description: NOVEL ETHEMMTOEIMIDE/ETHERIMIDE COPOLYMER BACKGROUND OF THE INVENTION Field of the Invention This invention relates to novel copolymer of etherimideimide/etherimide herein¬ after identified as PEII PEI copolymer of following structural formula(I). I o wherein, R and R' are independently selected from the group consisting of ^ tgT -@- CI 4 - §)- -<θ)- -@-°-@- Ar and Ar' are independently selected from the group consisting of alkyl group with 6 to 12 carbon atoms and phenyl derivatives ; and 15 n and m are independently an integer between 5 and 500. Description of the Related Art Generally, engineering plastics have excellent therm o-mechanical properties under severe physical and chemical conditions for a long time, and thus they have been 0 used as raw material for industrial accessories and structural housings in industrial fields such as electrics, electronics, precision instruments, etc. Polyimide resin(hereinafter identified as PI) especially wholly aromatic PI, is one of the above engineering plastics, having excellent heat-resistance. However, since wholly aromatic PI is very difficult to mold its molding product can be made by special molding methods such as compression or mechinary process of molding materials. To improve the disadvantage of PI research has been made. Among them, the polyetherimide(hereinafter identified as PEI), which was first synthesized by General Electric Co. of USA in 1982, has come into the market in the trade name of ULTEM®. PEI is a special engineering plastic having properties such as good mechanical stress, flame retardent, electric, chemical resistance, processability and heat-resistance. A range of PEI application has extended to a wide range such as a basic materials for automobile, electrics, electronics, household electrical appliances, public transport such as airplane, fiber and film etc. These inventor have developed and manufactured novel polyetherimideimide resin(hereinafter identified as PEII) as shown by Korea Patent Publication No. 91- 20065. PEII has additional imide group as compared to PEI which already consisting of phthalimide group and ether group. PEII can be produced either melt or solution polymerization process and it exhibits equal or even superior thermal stability and mechanical properties to PEI. Heat deflection temperature (hereinafter identified as HDT) of PEII is improved over 20 * 0 because glass transition temperature(hereinafter identified as Tg) has improved as compared with PEI. Although Tg and HDT of PEII have remarkably improved than PEI, mechanical properties such as tensile strength have not improved significantly because the bulkiness of diamine interferes with the formation of higher molecular weight polymer. As a result of continuous research, PEII/PEI copolymer as the above structural formula(I), which can be prepared by mixing diamine having imide group and m- phenylenediamine, has remarkably improved in tensile strength. The objective of the present invention is to provide PEII/PEI copolymer and its manufacturing process thereof which is excellent thermal stability and mechanical property improved as compared with PEI. SUMMARY OF THE INVENTION The present invention relates to novel etherimideimide/etherimide copolymer having etherimideimide/etherimide group with following structural formula(I) and 0.73 ~ 0.84 //g of inherent viscosity[^ mh ]. wherein, R,R',Ar,Ar', m and n are defined as the above, respectively. DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, the PEII/PEI copolymer of above shown structural formula(I), can be prepared by mixing diamine having imide group of following formula(II) with m-phenylenediamine of following formula(III), and copolymerizing the obtained reactant with bis ether anhydride(hereinafter identified as BEA) of following formula(IV). H !N τδr NH . ( m ) wherein, R and Ar are respectively defined as the above. For synthesizing PEII/PEI copolymer, solution polymerization is carried out by dissolving monomers of the above formula(TI), (III) and (IV) in the presence of mixed solvents such as N,N'-dimethylpropyl urea and dimethylacetic acid, etc., at 150 ~ 250 , . And the PEII/PEI copolymer can be synthesized by melt polymerization method at 250 ~ 350"C . PEII/PEI copolymer of the above formula(I) obtained according to the present invention have the following properties. PEII/PEI copolymer is soluble in chloroform, methylene chloride, m-cresol, N,N-dimethylformamide, etc. thus, films can easily be casted from the above solvents. Initial decomposition occurs at 551 ~ 560 Tj and the Tg values of these polymer are in a temperature range from 225 to 243 . The copolymers have 117 ~ 130 N/mm 2 of tensile strength, so application range is extended to be wide. PEII/PEI copolymer as a engineering plastic has application to automobile, electrics, electronics, household electrical appliances, public transport such as airplane and fiber, which are demanded for heat resistance and high intensity. In order that those skilled in the art will be able to practice the invention, the present invention is illustrated by the following examples in detail. But the ranges of this invention are not limited to the below illustrated examples. EXAMPLE 1 In four-necked flask fitted with a magnetic stirrer, a condenser and a thermometer was placed the following materials. A mixture of 7.9 Parts of 2,2'-bis[4-(3,4-dicarboxyphenoxy)phenyl] 5 propanedianhydride, (hereinafter identified as BEA), 0.6 parts of bis-4- aminophthalimidobenzene (hereinafter identified as B-4-APIB), 1.5 parts of m- phenylenediamine (hereinafter identified as m-PD) and 36.6 parts of dimethylaceteamide(hereinafter identified as DMAc), 30.5 parts of N,N'- dimethylpropyl urea(hereinafter identified as DMPU) were added. The reaction ι o mixture was heated under nitrogen atomsphere until the vessel temperature reached to 15012. After adding 22 parts of toluene, the water was continuously removed by azeotropic distillation using a dean-stark trap for one hour, and then toluene was completely distilled off. 15 Stirring was continued for two hours at 210 "C , the temperature was again allowed to reach for two hours at 230 , . Using a vaccum pump, the residual solvent was slowly removed for lhr at 250 C. , 10 torr. The copolymer(etherimideimide(EII) : etherimide(EI) = 10 : 90) was obtained by precipitation from methanol and dried for two hours in vaccum oven at 100C. . 20 The yield was quantitative and the inherent viscosity was found to be 0.84 dl/g by measuring with concentration of 0.5g/dl at 30O in m-cresol. Anal. Calcd : C, 74.59 ; H, 3.96 ; N, 4.96 Found : C, 73.82 ; H, 4.00 ; N, 4.87 25 EXAMPLE 2 The general procedure of example 1 is repeated except that 7.9 parts of BEA, 1.8 parts of B-4-APIB and 1.1 parts of m -PD were used to obtain a copolymer(EII/EI = 30 : 70). The yield was quantitative, the inherent viscosity was found to be 0.78 dl/g at 30"C in m-cresol. Anal. Calcd : C, 73.87 ; H, 3.80 ; N, 5.36 Found : C, 72.92 ; H, 3.83 ; N, 5.32 EXAMPLE 3 The general procedure of example 1 is repeated except that 7.9 parts of BEA, 3.0 parts of B-4-APIB, and 0.8 parts of m-PD were used to obtain a copolymer(EII/EI (50 : 50). The yield was quantitative and the inherent viscosity was found to be 0.73d /g by measuring with concentration of 0.5g/dl at 30TJ in m-cresol.. Anal. Calcd : C, 73.27 : H, 3.66 ; N, 5.70 Found : C, 72.69 ; H, 3.59 : N, 5.52 EXAMPLE 4 The general proceudre of example 1 is repeated except that 7.9 parts of BEA, 4.2 parts of B-4-APIB and 0.5 parts of m-PD were used to obtain a copolymer(EII/EI (70 : 30). The yield was quantitative and the inherent viscosity was found to be 0.76 dl/g by measuring with concentration of 0.5g/d at 30 3 in m-cresol.. Anal. Calcd : C, 72.75 : H. 3.55 ; N, 5.99 Found : C, 72.32 ; H, 3.52 ; N, 5.91 EXAMPLE 5 The general procedure of example 1 is repeated except that 7.9 parts of BEA, 5.4 parts of B-4-APIB and 1.7 x 10 "1 parts of m-PD were used to obtain a copolymer(EII/EI (90 : 10). The yield was quantitative and the inherent viscosity was found to be 0.70dl/g by measuring with concentration of 0.5g/dl at 30"C in m-cresol. Anal. Calcd : C, 72.31 ; H, 3.45 : N, 6.24 Found : C, 71.20 ; H, 3.46 : N. 6.17 Characteristics of PEII/PEI copolymer manufactured by the foregoing above examples, are as follows. 5 COMPARATIVE EXAMPLE 1 The general procedure of example 1 is repeated except that 7.9 parts of BEA, 6.05 parts of B-4-APIB were used to obtain a homopolymer, PEII. The yield was quantitative and the inherent viscosity was found to be 0.55 dl/g by measuring with concentration of 0.5 g/dl at 3012 in m-cresol. 0 COMPARATIVE EXAMPLE 2 The general procedure of example 1 is repeated except that 7.9 parts of BEA, 1.67 parts of m-PD were used to obtain a homopolymer, PEI. The yield was quantitative and the inherent viscosity was found to be 0.5l dl/g 5 by measuring with concentration of 0.5 g/dl at 3013 in m-cresol. Properties of copolymer according to above examples are as given in the following table 1. HDT of copolymer which is shown in the range from 208 to 22512 was o measured by ASTM-D647. As we can know from table 1, the heat resistance of copolymer is highly improved, compared with that of PEI. This is explained that as the weight ratio of EII in copolymer increase, molecular stiffness increases. 5 In conclusion, the novel copolyimide which is containing PEII and PEI certainly improve heat resistance and can be synthesized to higher molecular weight. Table 1 (1) polyetherimideimide resin (2) polyetherimide resin (3) Gel permeation chromatography (4) Glass transition Temperature (5) Heat Deflection Temperature (ASTM D-647) (6) Initial Decomposition Temperature. (7) Concentration of 0.5g/dl at 3012 in m-cresol (8) ASTM D-1708(Film casting method)

Claims: CLAIM A PEII/PEI copolymer with the following structural formula(I) wherein, R and R' are independently selected from the group consisting of ^oT , -©-<«-©- _ -©- . -©-o-®- , l C Ar and Ar 1 are independently selected from the group consisting of alkyl group with 6 to 12 carbon atoms and phenyl derivatives ; and n and m are independent integer between 5 and 500. 2. The copolymer as the defined in claim 1, which is characterized having an 15 initial decomposition temperature at 551 ~ 56012 , a glass transition temperature(Tg)of 225 ~ 243 2 and tensile strength of 117 ~ 130 N/mm 2 . The copolymer as defined in claim 1 to 2, which is partially or wholly soluble in organic solvents such as chloroform, methylene chloride, m-cresol, N,N'- dimethylformamide and Dimethylaceteamide. 4. A method for manufacturing PED/PEI copolymer with the following structural formula(I) by mixing diamine having imide group of following formula(II) with m-phenylenediamine of following formula(IH), followed by copolymerizing the mixed diamines with bisetheranhydride of following formula(IV). NH ( πi ) H 2N -| OΓ wherein, R, R', Ar, Ar'. m and n are respectively defined as the above claim 1. AMENDED CLAIMS [received by the International Bureau on 26 October 1993 ( 26.10.93 ) ; original claims 1-3 amended; original claim 4 deleted ( 1 page) ] 1. A copolymer of etherimideimide/etherimide with the following structural formula(I) wherein, R and R' are independently selected from the groups consisting of ^(δf -<O -CH -(d)- . - o>- , -<δ>-°-<δ>- Ar and Ar' are independently selected from the groups consisting of alkyl group with 6 to 12 carbon atoms and a phenyl derivative ; and n and m are independent integers between 5 and 500. 2. The copolymer as the defined in claim 1, which have glass transition temperatures(Tg's) of 225 ~ 27012. 3. The copolymers as defined in claims 1 and 2, which is partially or wholly soluble in organic solvents such as chloroform, methylene chloride, m-cresol, N,N'-dimethylformamide and dimethylaceteamide.

Inventors: CHOI KIL YEONG, DON YOUN SEUNG, HONG YOUNG TAIK, WON JONG CHAN, WOO SANG SUN, CHOI, KIL, YEONG, DON, YOUN, SEUNG, HONG, YOUNG, TAIK, WON, JONG, CHAN, WOO, SANG, SUN
Applicants: CHEIL IND INC, CHOI KIL YEONG, DON YOUN SEUNG, HONG YOUNG TAIK, KOREA RES INST CHEM TECH, WON JONG CHAN, WOO SANG SUN, CHEIL INDUSTRIES INC., KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
Application year: 1993
Main classification: C08G73
IPC codes: C08G73