A semiconductor switch comprising a temperature sensor

Abstract: A semiconductor switch has a power semiconductor device (1) and a temperature sensor (2) for providing a control signal to switch off the device (1) when it has a predetermined thermal condition. The power semiconductor device (1) comprises a semiconductor body (10) having a first region (13) of one conductivity type adjacent one major surface (10a) and a plurality of device cells (11) forming an insulated gate field effect device. Each cell (11) has a second region (32) of the opposite conductivity type provided within the first region (13), a third region (33) of the one conductivity type provided within the second region (32) and an insulated gate (34) overlying a conduction channel region (35) of the second region (32) for providing a gateable conductive path between the third and first regions (33 and 13). The temperature sensor (2) comprises a thermally responsive semiconductor device (100) formed within the semiconductor body (10) and comprising a number of further device cells (11') having the same structure as the power semiconductor device cells (11). The insulated gate (34) of each further device cell (11') is electrically connected to a third region (33) so that the further device cells (11') provide a parasitic bipolar (P) transistor having a leakage current which varies with temperature for enabling the temperature sensor (2) to provide the control signal to switch off the power semiconductor device (1) when the predetermined thermal condition exists.

Description: This invention relates to a semiconductor switch comprising a power semiconductor device and a temperature sensor. US-A-4730228 describes a temperature sensing circuit in which the temperature of a power semiconductor device is sensed by a bipolar transistor. The bipolar transistor is arranged in series with the main conductive path of a depletion mode (normally off) insulated gate field effect transistor (IGFET or MOSFET). The bipolar transistor has an open base connection and is in thermal contact with the power semiconductor device. For example, the bipolar transistor may be provided in the same semiconductor body as the power semiconductor device within a recess in the power semiconductor device. The depletion mode IGFET may also be integrated in the same semiconductor body but at a location remote from the power semiconductor device. In operation of the circuit described in US-A-4730228 if the circuit is at room temperature an off-state or leakage current flows through the open-base bipolar transistor and the depletion-mode IGFET acts as a current source. As the temperature of the power semiconductor device, and thus of the bipolar transistor, increases, the current through the bipolar transistor increases until it reaches that demanded by the depletion-mode IGFET at which time the internal resistance of the IGFET increases sharply and a control signal is provided for switching off the power semiconductor device. Although the circuit described in US Patent No. 4730228 enables the thermally responsive bipolar transistor to be placed in good thermal contact with the power semiconductor device, in practice significant modifications would have to be made to the mask set used to manufacture the power semiconductor device to enable inclusion of the bipolar transistor. According to the present invention, there is provided a semiconductor switch as defined in claim 1. Thus, in a semiconductor switch in accordance with the invention the thermally responsive semiconductor device is provided by a number of device cells similar, generally identical, to the device cells forming the power semiconductor device so that very little modification of the mask set used to produce the power semiconductor device is required to allow incorporation of the thermally responsive device. The insulated gate of each further device cell is connected to its third region or to a third region of the power semiconductor device. Generally, the insulated gate of each further device cell may be electrically shorted to the third region by a simple modification of the mask used to define the metallisation level. The second and third regions of the further device cells may be electrically shorted so as to provide a base-emitter shorted parasitic bipolar transistor. This should provide an improved output and higher signal. This can be achieved very simply as it is conventional in the manufacture of a power insulated gate field effect such as a power MOSFET or IGBT (Insulated Gate Bipolar Transistor) for the source (third) region to be shorted to the body (the channel-defining second region) and accordingly no mask modification is necessary to achieve the emitter-base short. Alternatively by modification of the appropriate masks, the second regions of the further device cells may be left floating so as to define an open base parasitic bipolar transistor. At least the power semiconductor device second regions may each have a more highly doped central area. In the case of the power insulated gate field effect device this serves to facilitate good contact by the metallisation and to improve ruggedness. The further device cells may be provided adjacent the periphery of the power semiconductor device which should simplify the affect of any metallisation modifications. As an alternative, the further device cells may be provided amongst the device cells forming the power semiconductor device so enabling a more accurate detection of the temperature of the power semiconductor device. This can be achieved relatively simply in the present case without detrimentally affecting device yield because the thermally responsive device is made up of device cells similar, generally identical, to those of the power semiconductor device. It may even be possible for the further device cells forming the thermally responsive device to be distributed throughout the power semiconductor device (e.g. with a number of further cells at two or more different locations) although the current sharing of the power semiconductor device will normally be so good that this would not significantly increase the accuracy of detection of the thermal condition of the power semiconductor device. The further device cells may be provided in a linear or any similar arrangement which maximises the ratio between the periphery of and the area occupied by the thermally responsive semiconductor device so as to increase its sensitivity to temperature changes. Generally, the temperature sensor will be arranged to detect when the temperature of the power semiconductor device reaches a predetermined value. However, the temperature sensor may be used, provided the rate of charge of voltage across the semiconductor body is small, to detect the temperature difference between centre cells and edge cells of the power device. In such a case the temperature sensor may comprise a further thermally responsive device similar to the thermally responsive semiconductor device, one of the thermally responsive semiconductor devices being provided adjacent and the other remote from the power semiconductor device and the temperature sensor may comprise means responsive to the two thermally responsive devices for providing a control signal to switch off the power semiconductor device when the difference in the temperatures sensed by the two thermally responsive semiconductor devices exceeds a predetermined value. One thermally responsive device may be provided adjacent the periphery of or actually within the power semiconductor device and the other thermally responsive device may be further from the periphery so enabling the temperature difference between the two thermally responsive devices to be determined. In certain conditions in power semiconductor devices such as power MOSFETs, for example, where a low resistance (say about 100mΩ), load is connected between ground and the power semiconductor device, the temperature at the centre of the power semiconductor device rises much more quickly than that of the surrounding semiconductor body so that a steep temperature gradient occurs at the periphery of the active semiconductor device. The use of two spaced thermally responsive devices allows this steep temperature gradient to be detected and to be used to provide a signal to switch off the active semiconductor device before it overheats significantly. Accordingly, excessive temperatures can be detected quickly and the circuit can be particularly sensitive to temperature changes. The switch of the present invention also may be integrated with a temperature sensing circuit comprising first and second transistors connected in a current mirror arrangement, a current source connected in series with the first and second transistors and the thermally responsive device in thermal communication with the power semiconductor device, the thermally responsive device passing a current which increases with temperature and being connected to an auxiliary current source for the second transistor for causing the second transistor to become increasingly switched off as the temperature sensed, and thus the current passed, by the thermally responsive device increases until the temperature sensor provides a control signal for switching off the power semiconductor device when the predetermined thermal condition exists. Embodiments of the invention will now be described, by way of example, with reference to the accompanying drawings, in which: Figure 1 illustrates a circuit diagram of one example of a temperature sensing circuit in accordance with the invention; Figure 2 is a plan view of part of a semiconductor body within which a power semiconductor device and a thermally responsive device of a temperature sensing circuit in accordance with the invention are integrated; Figure 3 is a cross-sectional view, part broken-away, of a semiconductor body within which a power semiconductor device and various components of the circuit illustrated in Figure 1 are integrated. It should be understood that Figures 2 and 3 are merely schematic and are not drawn to scale. In particular certain dimensions such as the thickness of layers or regions may have been exaggerated whilst other dimensions may have been reduced. It should also be understood that the same reference numerals are used throughout the Figures to indicate the same or similar parts. Referring now to the drawings, there is illustrated a semiconductor switch comprising a power semiconductor device 1 and a temperature sensor 2 for providing a control signal to switch off the power semiconductor device 1 when the power semiconductor device 1 has a predetermined thermal condition, for example when the temperature sensor 2 senses that the power semiconductor device 1 has reached a predetermined temperature. As shown in Figures 2 and 3, the power semiconductor device 1 comprises a semiconductor body 10 having a first region 13 of one conductivity type adjacent one major surface 10a and a plurality of device cells 11 forming an insulated gate field effect device each cell 11 comprising a second region 32 of the opposite conductivity type provided within the first region 13, a third region 33 of the one conductivity type provided within the second region 32 and an insulated gate 34 overlying a conduction channel region 35 of the second region 32 for providing a gateable conductive path between the third and first regions 33 and 13. The temperature sensor 2 comprises a thermally responsive semiconductor device 100 formed within the semiconductor body 10 and comprising a number of further device cells 11' with each further device cell comprising a second region 32 provided within the first region 13, a third region 33 provided within the second region and an insulated gate 34 overlying a conduction channel region 35 of the second region of the further device cell 11'. The insulated gate 34 of each further device cell 11' is electrically connected to a third region, either the third region 33 of the further device cell 11' or a third region of the power semiconductor device 1, so that the further device cells 11' provide a parasitic bipolar P transistor having a leakage current which varies with temperature for enabling the temperature sensor 2 to provide the control signal to switch off the power semiconductor device 1 when the predetermined thermal condition exists. Thus, in a semiconductor switch in accordance with the invention the thermally responsive semiconductor device 100 is provided by a number of device cells 11' similar, generally identical, to the device cells 11 forming the power semiconductor device 1 so that very little modification of the mask set used to produce the power semiconductor device 1 is required to allow incorporation of the thermally responsive device 100. Figure 1 illustrates one example of a temperature sensing circuit 2 which incorporates the thermally responsive device 100 mentioned above and which is used to provide a control signal to switch off the power semiconductor device 1 shown in Figure 2 when the temperature sensed by the thermally responsive device 100 reaches the predetermined temperature. The circuit 2 comprises first and second transistors Q1 and Q2 connected in a current mirror arrangement and a current source R2,R4 connected in series with the first and second transistors Q1 and Q2. The thermally responsive device 100 in thermal communication with the power semiconductor device 1 passes a current which increases with temperature and is connected to an auxiliary current source R5 for the second transistor Q2 for causing the second transistor Q2 to become increasingly switched off as the temperature sensed, and thus the current passed, by the thermally responsive device 100 increases until, at the predetermined temperature, the temperature sensor provides a control signal for switching off the power semiconductor device 1. As shown in Figure 1, a respective current source R2,R4 is connected in series with each of the first and second transistors Q1 and Q2, and the thermally responsive device 100 is connected in series with a resistor R5 connected in parallel with the current source R4 of the second transistor Q2. Thus, as will be explained in greater detail below, the current passed by the thermally responsive device 100 is used to offset the current in the source degeneration resistor R5 connected to the current mirror arrangement R2,R4. Referring now specifically to the example illustrated in Figures 1 to 3, the temperature sensing circuit 2 has first and second power supply lines 3 and 4. The first and second transistors Q1 and Q2 are both n-channel enhancement mode (normally off) IGFETs (insulated gate field effect transistors) having their first (drain) main electrodes connected via respective resistors R1 and R2 to the first power supply line 3 and their second (source) main electrodes connected to the second power supply line 4, which is in this example earth. The control or gate electrodes of the first and second transistors Q1 and Q2 are connected together and the control electrode of the first transistor Q1 is connected to its drain electrode to form a current mirror arrangement. As shown, the back gates of the first and second transistors Q1 and Q2 are not connected to their respective sources in the normal manner but are connected to earth (ground), that is to the second power supply line 4. In the interests of clarity in Figure 1, this connection is shown merely by an earth symbol on the back gates and not by an actual connection line to the second power supply line 4. Of course, the back gates of transistors Q1 and Q2 could be connected to their respective sources in normal manner although this might require some adjustment of the circuit parameters. A respective current source connects the source electrode of each of the transistors Q1 and Q1 to the second power supply line 4. The current sources could be of any suitable form but in this example are provided as resistors R2 and R4 which may be of the type to be described below with reference to Figure 3. As alternatives to the use of resistors as current sources, diode-connected depletion mode IGFETs could be used. A further resistor R5 is connected in parallel with the resistor R4 and acts as a current source degeneration resistor for the transistor Q2 so that, as will be explained below, at normal temperatures of the power semiconductor device 1 the current drawn by transistor Q2 is not equal to that drawn by transistor Q1. Again any suitable form of current source may be used in place of the resistor R5. The thermally responsive device 100 comprises, as will be explained in greater detail below with reference to Figures 2 and 3, a small power MOSFET formed by a number of device cells 11' formed in the same semiconductor body 10 as the power MOSFET 1 whose temperature is to be detected. In this example, the power MOSFET 1 is an n-channel enhancement mode MOSFET and the thermally responsive device 100 is therefore also an n-channel enhancement mode MOSFET. The gate electrode of the thermally responsive device 100 is connected to its source electrode as shown in Figure 1 so that the thermally responsive device 100 is provided by a parasitic bipolar transistor P within the small power MOSFET. The parasitic bipolar transistor P has, in this case, its base and emitter regions shorted by virtue of the fact that the source metallisation of the power MOSFET 1 shorts its third or source regions 33 to the channel-defining second or body regions 32. This should enable a higher gain and thus higher output than could be achieved with an open (or floating) base arrangement. However by appropriate modification of the metallisation mask, the parasitic bipolar transistor P may have a floating base. In the example illustrated in Figure 1, the power MOSFET 1 itself forms a low-side switch having its drain electrode connected via a load L, for example a light bulb, to a positive power supply line 5. The gate electrode of the power MOSFET 1 is connected to an input control line 7 which receives, via an appropriate input circuit, signals for controlling switching on and off of the power MOSFET 1. In the example illustrated, the input circuit comprises series-connected resistors R9 and R10 and a zener diode D1 connected between the node between the two resistors R9 and R10 and the power supply line 4. The zener diode D1 serves to protect the insulated gate 34 of the power semiconductor device 1. The source electrode of the thermally responsive device 100 is connected in series with the source degeneration resistor R5 so that, as will be described below, the thermally responsive device 100 provides an additional current source for the transistor Q2. The drain electrode of the second transistor Q2 is connected at junction W to the gate electrode of an n-channel enhancement mode third IGFET Q3 having its drain electrode connected via a fourth resistor R6 to the first power supply line 3 and its source electrode connected via a fifth resistor R8 to the second power supply line 4. The drain electrode of the third IGFET Q3 is connected to the gate electrode of a fourth n channel enhancement mode IGFET Q4 having its drain electrode connected via a resistor R7 to the first power supply line 3 and having its source electrode connected to the second power supply line 4. The two transistors Q3 and Q4 form an inverting output stage as will be discussed below. The drain electrode of IGFET Q4 is connected to a further n-channel enhancement mode IGFET Q5 which has its source electrode connected to the second power supply line 4. The IGFET Q5 forms an output transistor and its drain electrode is connected via an output line 6 and the resistor R10 to the insulated gate 34 of the power semiconductor device 1. The structure of various components of the circuit 2 shown in Figure 1 will now be described with reference to Figures 2 and 3 in which Figure 2 illustrates a top plan view of part of the semiconductor body 10 within which the power MOSFET 1 and the thermally responsive device or auxiliary MOSFET 100 are formed while Figure 3 illustrates a cross-sectional view through part of the semiconductor body 10. In order to show the structure of the MOSFETs 1 and 100, source, gate and interconnection metallisation have been omitted in Figure 2. As can be seen clearly from Figure 2, the power MOSFET 1 comprises a plurality of device or source cells 11 each of which comprises a second or body region 32, a third or source region 33 within the second region 32 so that the second and third regions 32 and 33 define therebetween a conduction channel region 35 (see Figure 3) over which the insulated gate 34 extends between each third region 33 and the first region 13 which forms at least part of a common drain region. Each second region 32 has a relatively deep relatively highly doped central region 32a which extends up to the surface 10a within the associated source region 33 to enable the source region 33 to be shorted to the second region 32 in normal manner to enable good contact by the source metallisation and to improve the ruggedness of the device. Typically the power MOSFET 1 may consist of many hundreds of thousands of source cells 11. The periphery 34a of the insulated gate 34 may extend up onto field oxide 15 surrounding the edge of the power MOSFET 1 in conventional manner and, although not shown, conventional edge termination such as Kao's rings and/or field plates may be provided at the periphery of the power MOSFET 1. As mentioned above, the thermally responsive device 100 effectively comprises a much smaller version of the power MOSFET 1. In this example, as shown, the thermally responsive device comprises 49 source cells 11' each formed by a second region 32 containing a third region 33 and defining with the third or source region 33 a conduction channel 35 (see Figure 3) over which the insulated gate 34 extends between each third region 33 and the first region 13 which forms at least part of a common drain region of the auxiliary MOSFET. Again a central region 32a of each second region 32 extends to the surface 10a within each source cell 11'. The number of source cells 11' forming the thermally responsive device 100 will of course depend on the desired characteristics and could be more or less than shown. Although not shown in Figure 2, the insulated gate of the thermally responsive device 100 is connected directly to its source electrode. This can be achieved simply by modifying the metallisation mask in the area of the thermally responsive device 100 so that there is no separation of the source and gate metallisation of the thermally responsive device. The auxiliary MOSFET 100 thus provides a parasitic bipolar transistor P in which the source and body regions 33 and 32 provide the emitter and base regions and the common first region 13 provides the collector region of the bipolar transistor P. By virtue of the source-body short provided by the source metallisation, the parasitic bipolar P has its base shorted to its emitter. As indicated above, Figure 3 illustrates, by way of a cross-section through the semiconductor body 10, typical structures for the source cells 11 and 11' of the MOSFETs 1 and 100. In addition, Figure 3 shows typical structures for the resistors R1 to R8 and the n-channel IGFETs Q1 to Q5. It will be appreciated that only one resistor R1 and one IGFET Q1 are shown in Figure 3 because the structures of the resistors R1 to R8 and all the IGFETs Q may be similar. In addition, because the structures of the source cells 11 and 11' of the power MOSFET 1 and the thermally responsive device 100 are also similar the cross-section of only one source cell 11,11' is shown. In the example of Figure 3, the semiconductor body 10 comprises a relatively high doped n conductivity type monocrystalline silicon substrate 10b onto which is provided a relatively lowly doped n conductivity type epitaxial layer which forms the first region 13. The relatively highly doped substrate 10b provides a drain contact region which makes ohmic contact to metallisation 17 on the other major surface 10c of the semiconductor body 10. The metallisation 31 forms at least part of the connected drain electrodes of the power MOSFET 1 and the thermally responsive device 100. The resistors R1 to R8 may have any suitable form and could be, for example, simple diffused resistors or doped polycrystalline silicon resistors. In the example being illustrated, the resistors R1 to R8 are formed in the first region 13 of the semiconductor body 10 by a region 20 of the opposite conductivity type formed within the first region 13 and a further region 21 of the one conductivity type formed within the second region 20, first and second electrodes 22 and 23 being spaced apart on the third region 21 so that a resistive path is provided by the third region 21 between the first and second electrodes 22 and 23. A reference electrode 24 is provided for connecting the region 20 to a reference potential, the second power supply line 4 in this example. The region 20 is formed as a planar region by introducing, using an appropriate mask, p conductivity type impurities, generally boron ions with a dose (which determines the surface concentrations) in the region 10 x 10 12 to 13 x 10 12 atoms cm -2 , while the region 21 is formed as a planar region within the region 20 by introducing impurities using an appropriate mask with a dose in the region of 2 x 10 12 to 3 x 10 12 atoms cm -2 . The impurity concentrations within the regions 20 and 21 are such that the temperature coefficients of resistance of the diffused resistor formed by the third region 21 and the junction field effect transistor like structure formed by the regions 20 and 21 counteract to provide the resistor with a temperature coefficient of resistance α which increases with absolute temperature such that the relative temperature coefficient of resistance referred to the sensed temperature is substantially constant. The n-channel enhancement transistors Q1 to Q5 may have any suitable form. In this example each transistor Q1 to Q5 is a lateral IGFET and may have the structure shown in Figure 3 where the n-channel IGFET Q1 (for example) is formed in a relatively lowly doped p conductivity type isolation well having a surface dopant concentration of the order of 2-3 x 10 12 atoms cm -2 which is connected to the second supply line 4 (generally earth) via an electrode. In this example the lateral IGFETs Q1 to Q5 may be formed in the same region 20 as the resistors R1 to R8 so that the electrode 24 provides the back gate connection to the second supply line 4. The source and drain regions 40 and 41 of the IGFETs Q1 to Q5 may be formed with the source regions 33. In manufacture of the structure shown in Figure 3, the insulated gates 34 of the MOSFETs 1 and 100 and the insulated gates 42 of the IGFETs Q1 to Q5 are first defined after definition of any field oxide 15 and formation of the region 20. Generally the insulated gates will comprise a thermal gate oxide layer followed by a doped polycrystalline silicon layer. Impurities for forming the relatively deep relatively highly doped central regions 32a may then be introduced (with the areas of the IGFETs Q1 to Q5 and resistors covered) with the mask used to define the insulated gates still in place. This mask will overhang the insulated gates so that the central regions 24a will be spaced from the insulated gates. After removal of this mask, impurities for forming the remainder of the second or body regions 32 are introduced with the areas in which these regions 32 are not required masked. After removal of this mask, a further mask is provided to allow introduction of the impurities to form the source regions 33, regions 21 of the resistors and the source and drain regions 40 and 41 of the IGFETs Q1 to Q5. As will be appreciated by those skilled in the art, in respect of the MOSFETs 1 and 100, the insulated gates 34 form at least part of the mask for forming the regions 32 and 33 so that these regions 32 and 33 are autoaligned to the insulated gates 34. A central area of each source region 33 may be masked during the implantation process or may be subsequently etched away as shown in Figure 3 to allow the source metallisation 36 to contact the central regions 32a. As indicated above, if it is desired for the base of the parasitic bipolar transistor P to be floating rather than shorted to the emitter the central area of the source regions 33 of the auxiliary MOSFET 100 will not be so masked or etched. An insulating layer 37 is then provided and contact holes opened to enable metallisation to be deposited and defined to provide the source electrodes 36 and gate electrodes (not shown) of the MOSFETs 1, the shorted source-gate metallisation of the auxiliary MOSFET 100, the electrodes 22 to 24 of the resistors R1 to R8 and the source, gate and drain electrodes of the IGFETs Q1 to Q5 plus appropriate interconnections in accordance with the circuit shown in Figure 1. The metallisation 17 is also provided on the other major surface 10c to form the drain electrodes of the MOSFETs 1, 100. The operation of the circuit shown in Figure 1 will now be described. As indicated above, the thermally responsive device 100 comprises a base-emitter shorted parasitic bipolar transistor P provided by a few device cells 11' of the power MOSFET 1. As shown in Figure 2, the cells 11' forming the transistor P are at the edge of the power MOSFET 1 to facilitate contact but they could be at the centre of the power MOSFET 1, so as to enable a faster and more accurate detection of the maximum temperature within the power MOSFET 1. Alternatively, the transistor P could be formed by a group of cells 11' remote from the power MOSFET 1 but formed at the same time. The parasitic bipolar transistor P senses or experiences the temperature of the power MOSFET 1 and the current through the base-emitter shorted bipolar transistor increases with the temperature of the power MOSFET 1. Typically, the current supplied by the parasitic bipolar transistor P will effectively double for each ten degree Celsius increase in temperature. The parasitic bipolar P supplies current for the source-degeneration resistor R5 which allows the voltage at junction X in Figure 1 to increase as the temperature sensed (and thus the current supplied) by the parasitic bipolar transistor P increases until the voltage at junction X equals the voltage at point Y so that the drain currents of the current-mirror connected transistors Q1 and Q2 are equal. As the current supplied by the bipolar transistor P and thus the voltage at junction X increases, the IGFET Q2 will become increasingly turned off and the voltage at junction W will rise to turn on IGFET Q3 and thus switch off IGFET Q4 so that the gate voltage of the IGFET Q5 rises causing the IGFET Q5 to turn on (or conduct) so as to pull the gate voltage of the power MOSFET 1 down towards the voltage of the second power supply line 4 and thus switch off the power MOSFET 1 once a predetermined temperature is exceeded. The actual predetermined temperature at which the circuit 2 provides an output signal to switch off the power MOSFET 1 will of course depend upon the particular nature of the various circuit components but may be, typically, a temperature in the range of from 180°C to 190°C (degrees Celsius). The parasitic npn bipolar transistor P has a high voltage blocking capability, and this method for detecting the leakage current enhances the useful lower working range of the sensor. The parasitic bipolar transistor P may be used in temperature sensing circuits other than that described with reference to Figure 1, for example in circuits similar to that described in US-A-4730228 or in EP-A-360333 (PHB33491). Furthermore, two or more such parasitic bipolar transistors P may be provided in the same semiconductor body as a power MOSFET to for example provide a more accurate assessment of temperature by measuring and averaging the temperatures at different locations or to provide a differential temperature sensing circuit. For example parasitic bipolar transistors P may be used to form the temperature sensing devices of differential temperature sensing circuit such as those described in EP-A-479362. It will of course be appreciated that devices other than lateral IGFETs could be used to provide the transistors Q1 to Q4 or devices with similar appropriate characteristics. Of course the conductivity types, and where appropriate the polarities, given above could be reversed. Also it is possible that the power semiconductor device 1 and thermally responsive device 100 could be lateral rather than vertical devices. In addition it may be possible to use semiconductor materials other than or in addition to silicon. From reading the present disclosure, other modifications and variations will be apparent to persons skilled in the art. Such modifications and variations may involve other features which are already known in the semiconductor and analogue MOS circuit design arts and which may be used instead of or in addition to features already described herein. It has been stated above that the drawings illustrate examples of embodiments of the invention and, in order to avoid any misunderstanding, it is hereby further stated that, in the following claims, where technical features mentioned in any claim are followed by reference signs relating to features in the drawings and placed between parentheses, these reference signs have been included in accordance with Rule 29(7) EPC for the sole purpose of facilitating comprehension of the claim, by reference to an example.

Claims: A semiconductor switch compring a power semiconductor device (1) and a temperature sensor (2) for providing a control signal to switch off the power semiconductor device when the power semiconductor device has a predetermined thermal condition, the power semiconductor device comprising a semiconductor body (10) having a first region (13) of one conductivity type adjacent one major surface (10a) and a plurality of device cells (11) forming an insulated gate field effect device each cell comprising a second region (32) of the opposite conductivity type provided within the first region, a third region (33) of the one conductivity type provided within the second region and an insulated gate (34) overlying a conduction channel region (35) of the second region for providing a gateable conductive path between the third and first regions and the temperature sensor comprising a thermally responsive semiconductor device (100) formed within the semiconductor body and comprising a number of further device cells (11') with each further device cell comprising a second region (32) provided within the first region, a third region (33) provided within the second region and an insulated gate (34) overlying a conduction channel region (35) of the second region of the further device cell (11') and being electrically connected to a third region, either the third region of the further device cell or a third region of the power semiconductor device, so that the first region and the second and third regions of the further device cells (11') provide a parasitic bipolar transistor having a leakage current which varies with temperature for enabling the temperature sensor to provide the control signal to switch off the power semiconductor device when the predetermined thermal condition exists. A semiconductor switch according to Claim 1, wherein the third region (33) of each further device cell (11') is electrically connected to its second region (32). A semiconductor switch according to Claim 1 or 2, wherein at least the power semiconductor device second regions each have a more highly doped central area (32a). A semiconductor switch according to Claim 1, 2 or 3, wherein the further device cells (11') are provided adjacent the periphery of the power semiconductor device. A semiconductor switch according to Claim 1,2 or 3, wherein the further device cells (11') are provided amongst the device cells of the power semiconductor device. A semiconductor switch according to Claim 1, 2 or 3, wherein the temperature sensor (2) comprises a further thermally responsive device similar to the thermally responsive semiconductor device, one of the thermally responsive semiconductor devices being provided adjacent and the other remote from the power semiconductor device (1) and the temperature sensor comprises means responsive to the two thermally responsive devices for providing a control signal to switch off the power semiconductor device when the difference in the temperatures sensed by the two thermally responsive semiconductor devices exceeds a predetermined value. A semiconductor switch according to any one of Claims 1 to 6, integrated with a temperature sensing circuit comprising first (Q1) and second (Q2) transistors connected in a current mirror arrangement, a current source (R2,R4) connected in series with the first and second transistors and the thermally responsive device in thermal communication with the power semiconductor device, the thermally responsive device (100) passing a current which increases with temperature and being connected to an auxiliary current source (R5) for the second transistor for causing the second transistor to become increasingly switched off as the temperature sensed, and thus the current passed, by the thermally responsive device increases until the temperature sensor provides a control signal for switching off the power semiconductor device when the predetermined thermal condition exists. A semiconductor switch according to Claim 7, wherein a respective current source (R2,R4) is connected in series with each of the first (Q1) and second (Q2) transistors and the thermally responsive device (100) is connected in series with the auxiliary current source (R5) which is connected in parallel with the current source (R4) of the second (Q2) transistor.

Inventors: KELLY BRENDON PATRICK, LOWIS ROYCE, MOODY PAUL TIMOTHY, KELLY, BRENDON PATRICK, LOWIS, ROYCE, Kelly, Brendon Patrick, c/o Philips Hazel Grove, LOWIS, ROYCE, C/O PHILIPS HAZEL GROVE, MOODY PAUL TIMOTHY, C/O PHILIPS HAZEL GROVE
Applicants: KONINKL PHILIPS ELECTRONICS NV, PHILIPS ELECTRONICS UK LTD, KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS ELECTRONICS UK LIMITED
Application year: 1993
Main classification: H01L27
IPC codes: H01L29, G01K7, H01L21, H01L27