METHOD FOR CHEMICAL SURFACE PASSIVATION FOR IN-SITU BULK LIFETIME MEASUREMENT OF SILICON SEMICONDUCTOR MATERIAL

Abstract: Minority carrier bulk lifetime maps are accomplished using in-situ mu -PCD measurement techniques on a non-oxydized Si specimen of either polarity. Surface passivation of the specimen is accomplished chemically, preferably using a solution of iodine in ethanol with a concentration in the range of about 0.02 mol.dm<-3> to about 0.2 mol.dm<-3>. For n-type specimens, a solution of concentrated alkaline such as ammonia, sodium- and potassium-hydroxide is especially effective. For either type specimens, a solution of HF at about 40 % m/m is also effective. Surface passivation according to the present invention reduces surface recombination velocities to 10 cm/second or less. The specimen to be measured is placed in a container of passivation solution such that the specimen surfaces are covered with a solution film of about 1 mm or less. The container preferably is transparent to microwave and laser optical energy, and passivation and measurement can occur simultaneously. A method and apparatus are disclosed.

Description: METHOD FOR CHEMICAL SURFACE PASSIVATION FOR IN-SITU BULK LIFETIME MEASUREMENT OF SILICON SEMICONDUCTOR MATERIAL Field of the Invention The invention relates generally to microwave or eddy current measurements of bulk lifetime carrier concentration in semiconductor materials, and more specifically to a method for chemically paββivating the surface of a silicon semiconductor specimen to enhance measurement reliability. Background of the Invention It is known in the art to determine semiconductor specimen purity by examining minority carrier lifetime using laser-induced microwave-detected photoconductive decay measurement systems ("μ-PCD") . One such system is disclosed in U.S. Patent no. 4,704,576 to Tributsch, et al. (November 3, 1987). In a μ-PCD system, the specimen is exposed to a microwave field and subjected to bombardment by a pulsed laser source. The laser's photon energy induces recombination in the specimen by creating excess charge carriers, e.g., pairs of mobile electrons and holes having excess concentrations Δn and Δp. These carriers can affect the microwave energy reflected by the free electrons and holes in the specimen's crystal structure in a time-dependent manner. More specifically, the excess carriers increase specimen conductivity by Δσ = q(μ r4 Δn + μ p Δp) , where q is the electron charge, and μ„, μ p are respectively electron and hole mobilities. Excess carrier concentrations Δn and Δp decay over time as the carriers become trapped in defects or recombine along defects within the specimen. By detecting microwave energy reflected from the specimen, recombination decay times can be measured to determine the recombination time constant of excess carriers within the specimen. Excess conductivity (Δσ) measurements are indicative of defects and impurities within the specimen's crystal structure that affect the excess charge carriers. In the simplest case, recombination is exponential with a reciprocal decay time (1/τ) proportional to the concentration of recombination centers, or impurities. Thus 1/τ (e.g., recombination lifetime) is a measure of the specimen quality. Unless otherwise treated, the surface of a Si lattice presents many dangling bonds that can act as surface recombination centers and shorten excess carrier recombination lifetime. Because μ-PCD and eddy current techniques seek to measure bulk recombination and not the more rapidly occurring surface recombination, measurements typically have been made on a Si surface that is treated by thermal oxidation or chemical passivation. A significant deficiency of μ-PCD and eddy current measurements on non-oxidized wafers is that bulk lifetime cannot even be estimated' if bulk lifetime is too large. It would be advantageous to make stable μ-PCD or eddy current measurements on non-oxidized specimens for several reasons. Such measurements would avoid furnace contamination of the specimen associated with thermal oxide growing, and would avoid the problems associated with producing high quality stable, oxidized Si surfaces. Further, it is important to characterize "as-grown" (e.g., non-oxidized) Si wafers without high temperature alteration of the original distribution of any contaminants and/or the nature of crystal defects. One known technique for chemical passivation of Si has been to initially provide an HF acid etch and then use various acid solutions. E. Yablonovitσh, et al. report in Phve. Rev. Letters 57 (1986) 249 that this alternative to thermal oxidation produces an ideal (electronically inactive) surface with very low surface recombination velocity (S) . In fact, this reference reports surface recombination velocities as low as about 0.25 cm/sec, and states that these values were apparently the lowest value ever reported for any semiconductor. Unfortunately, Yablonovitch, et al.'s passivation technique is limited to measuring carrier-density decay on individual points in the chemically paββivated wafer. Notwithstanding the early success of E. Yablonovitch, et al., what is needed is a method of chemically paββivating a Si specimen that significantly decreases surface recombination velocity (S) . What is needed is a passivation method that permits mapping bulk lifetime for an entire area, rather than mapping only individual lattice points. Preferably such passivation technique should approximate the perfection of an Si-Si0 3 interface, and permit reliable in-situ bulk lifetime measurement on as-grown Si specimens. The present invention discloses a method and apparatus for accomplishing such chemical passivation. Summary of the Invention The present invention permits simultaneous chemical surface passivation of a silicon specimen and in-situ minority bulk lifetime mapping over the entire specimen. The specimen is positioned in a suitable container and covered with sufficient passivation solution to form a film on the specimen. The present invention provides an iodine containing passivation solution that lowers surface recombination velocities for n-type and p-type materials to 10 cm/sec or less. Alternatively, for n-typβ material, passivation is also achieved using a concentrated alkaline solution. Finally, for either type silicon, passivation may also be obtained with an acidic solution containing fluoride ions. Other features and advantages of the invention will appear from the following description in which the preferred embodiments have been set forth in detail in conjunction with the accompanying drawings. Brief Description of the Drawings FIGURE l depicts generally a μ-PCD type system with which the present invention may be practiced; FIGURE 2 depicts, for different surface recombination velocities, the close agreement between theoretical τ t and r, calculated from applicants' approximating equation (3); FIGURE 3 depicts dependence of surface recombination related decay time (r § ) and thickness for an n-type Si specimen; FIGURE 4A is a high resolution lifetime map of p-type <100> Si with an oxidized surface, average effective lifetime τ β « - 102 μβ; FIGURE 4B is a high resolution lifetime map for the same p-typβ specimen initially used in Figure 4A, with the oxide layer removed, average effective lifetime τ βff « FIGURE 4C is a high resolution lifetime map for the same p-type specimen used in Figure 4A and 4B, where the non- oxidized wafer is chemically passivated according to the present invention, average effective lifetime of τ tff - 115 μs; FIGURE 5 is a lifetime map made from a 200 μm thick n- type <111> Si, 25 Q-cm, float-zone produced specimen, using chemical surface passivation according to the present invention, average effective lifetime τ Λtt » 763 FIGURE 6 shows correlation between iron concentration and minority carrier lifetime in p-type silicon. Detailed Description of the Preferred Embodiments Figure 1 depicts a μ-PCD system with which the present invention may be practiced, although an eddy current system could also be used. A semiconductor specimen 2 having thickness d is positioned within a container 4 and subjected to microwave energy from microwave source and microwave reflection measuring unit 6 and to pulsed optical energy from laser source 8. Preferably container 4 is fabricated from a material that is transparent both to microwave and optical energy, e.g., a plastic, or a plastic container with glass windows. Container 4 holds a passivation solution 10 according to the present invention, which solution covers the upper and lower surfaces of specimen 2 to a desired film thickness Δ that preferably is less than about 1 m, and may in fact be less than about 0.1 mm. Laser source 8 is pulsed, and photons therefrom create minority carriers within specimen 2. More specifically, laser photoexcitation causes the simultaneous injection of electron-hole pairs in the specimen, and recombination occurs at each deep level present therein. Microwave energy from unit 6 reflects from free electrons and holes in specimen 2, which reflection is affected by minority carrier recombination lifetimes. A detector within microwave reflection measuring unit 6 detects these reflections, and the detector output signals are processed by processor 12 to characterize electron and hole recombination within the specimen. Processor 12 typically includes a digital computer and appropriate video monitor and/or plotter output that display operator selected information relating to impurities and their location within the specimen. Such information can include high resolution lifetime maps of a specimen under test, passivated according to the present invention. In the embodiment of Figure 1, unit 6 provides a 10.3 GHz microwave signal, and laser source 8 is a 904 nm GaAβ device whose output was concentrated on a spot smaller than about 1 mm' at the upper surface of specimen 2, with injected carrier density between about lO^/c 3 and 10 17 /cm'. Processor 12 preferably includes a computer- controlled MT-85 lifetime scanner, manufactured by Semilab Corporation of Budapest, Hungary. In a manner known to those skilled in the art, with the onset of each laser optical pulse, the output from microwave reflection measuring unit 6 increases sharply in proportion to the change in conductivity (Δσ) of the specimen. The detector output waveform from microwave reflection measuring unit 6 then decays toward a baseline level with a time constant proportional to the minority carrier recombination lifetime. Because details of μ-PCD and eddy-current measuring systems are known to those skilled in the relevant art, further details of such systems and measurements are not presented. μ-PCD can be an effective tool for high resolution lifetime mapping on a whole semiconductor wafer specimen. The technique can provide valuable information about lateral distribution of contaminants such as crystal growth defects, metal contaminants, etc. on "as-grown" (non-oxidized wafers) . However μ-PCD is not suitable for estimating absolute impurity concentration levels because the measured lifetime of a non-oxidized specimen is not determined primarily by bulk recombination, but rather by surface recombination and carrier diffusion. As noted, while thermal oxidation of a Si specimen allows bulk recombination to predominate lifetime measurements, the thermal process of growing the oxide undesirably can alter characteristics of the specimen under test. According to the present invention, lattice termination is achieved by chemically paβsivating the specimen surface. Such passivation according to the present invention approximates the perfection of an Si-sio a interface, and permits in-situ μ-PCD bulk lifetime measurement on as-grown Si wafers. The theoretical relationship between the voltage transient from the microwave reflection measuring unit 6 and the parameters of specimen 2 is well known. Accordingly, the effective time constant r, ff calculated from the exponential shape of the conductivity decay curve may be written as: where τ_ is bulk minority carrier lifetime, and r, relates decay time to surface recombination. It is known that T, may be obtained by solving the time- dependent equation for excess carrier density. So doing yields a transcendental equation for r. as follows: α-tanf-^ f?) «• -0- , whe∑e — * P-.O 1 (2) 2 D n -„ and where D n is the minority carrier diffusion constant, S is the surface recombination velocity , and d is the thickness of the semiconductor specimen under test. Consider the two limiting cases , where surface recombination velocity S is large and where S is snail . For small surface recombination velocity, (S«D n ) , T, « ■ = ■ 2S/d, and for large surface recombination velocity (S»D n ) , T, βD t ,τr *, /d J . Rather than use one of the above expressions , applicants chose to approximate r, as follows : d- d τ - ' ι? * A ~ - (3 > For different surface recombination velocities , Figure 2 depicts the close agreement between T, calculated from theoretical equation (2 ) , and r, calculated from applicants ' equation (3 ) . In the following discussion, applicants ' equation ( 3 ) shall be relied upon . With reference to Figure 2 , applicants initially prepared various passivating solutions 10 using analytical grade reagents. Because the effectiveness of surface passivation is highly dependent upon pre-lifetime measurement surface treatment, applicants initially etched the non-polished surfaces of specimen 2. An etching solution containing HF and HNO, was applied to prepare the surfaces of the non-polished Si wafer specimens for subsequent μ-PCD measurements. Various solutions containing HF and HNO- proved to be suitable for pre-lifetime measurement surface treatment, including standard HF:HNO,:CH 3 COOH (22:47:31). Applicants believe that optimal preparation of the semiconductor specimen surface may be dependent upon the surface quality, e.g., polished, non-polished, hydrophobic, hydrophilous, etc. Thus in practice, front and back surfaces of non-polished wafers were etched, and no etching was performed on polished wafers. That the average effective recombination lifetime values for such wafers is determined principally by the rate of the diffusion process of minority carriers is borne out by Figure 3. Figure 3 depicts the average effective recombination lifetime for various non-oxidized polished and non-polished n-type Si wafers having different thicknesses d, with high expected bulk lifetimes. The data plotted in Figure 3 correspond to the effective lifetime values calculated using equations (i) and (3) at different surface recombination velocities (S) , assuming that l/r b is negligible, such that consequently τ β(f - τ § . with further reference to Figure 3, as all measured data points were below the curve calculated at S*»10 4 cm/sec, applicants conclude that the surface recombination velocity of the wafers initially tested probably exceeded this velocity. Figures 4A-4C are high resolution lifetime maps for the same p-type <100> specimen, under various surface conditions. Interestingly, the measured lifetime map of Figure 4B (non-oxidized surface) mirrors the distribution of bulk parameters, as is appreciated by comparison with the lifetime map of Figure 4A (oxidized surface) . These data reflect the inapplicability of μ-PCD measurement to the determination of bulk minority carrier lifetime of non-oxidi2ed wafers, at least according to the prior art. Figures 4A and 4C demonstrate the effectiveness of surface passivation according to the present invention. The figures strongly suggest that the surface recombination velocity of the chemically passivatβd surface according to the present invention (Figure 4C) is basically the same as the surface recombination velocity of the thermally oxidized Surface (Figure 4A) . Applicants found three groups of passivation solutions to be applicable for the surface passivation of Si. These groups were (1) various fluoride ion containing acidic solutions, (2) concentrated alkaline solutions including ammonia, sodium-hydroxide and potassium-hydroxide solutions, and (3) and solutions containing iodine, especially ethanol and iodine, or hydrodic acid and iodine. Table 1 below depicts effective lifetime values measured in various of these passivating solutions for float-zone produced p-type and n-type specimens, having thickness d = 2 mm. Similar data would be expected for CZ-produced specimens as well. TABLE 1 Table l reflects that for n-type material, the highest effective lifetime (e.g., that corresponding to the lowest surface recombination velocity S) was obtained in an NaOH alkaline solution. However the same solution showed poor effectiveness in passivating p-type Si. Applicants noted that independent of specimen type, using alkaline solution passivation, Si dissolution was accompanied by hydrogen gas evolution. P-type Si has a higher dissolution rate and this gas evolution produced a discolored, rough surfaces for p-type specimens. By contrast, at low alkaline solution concentrations wherein gas evolution was absent, no passivation effect was observed during μ-PCD measurement. Table 1 also reflectβ that passivation with an iodine solution provided a higher effective lifetime that passivation with an acidic fluoride solution, regardless of specimen type. Based upon the data of Table 1, applicants experimentally determined that an iodine (I a ) concentration from about 0.02 mol ' d "3 to 0.2 mol « dnr J was es eci lly suitable for surface passivation of Si of either polarity. At lower iodine concentrations, the measured lifetime value decreased considerably, and at higher concentration, a slight decrease in effective lifetime value was detected during μ-PCD measurement. Possibly the latter effect is attributable to the slow oxidation of Si in the iodine solution. From equations (1) and (3) it is clear that at suf iciently low surface recombination velocity (S) , the measured effective lifetime is a good approximation of the bulk lifetime value. Figure 5 is a lifetime map of a relatively thin Si wafer (d - 200 μm) . This lifetime map measurement is used to estimate an upper limit for the surface recombination velocity of the specimen under test. Assuming that the upper value of effective lifetime is limited by the surface recombination process (e.g., ~ . > ~ t iι) i an upper limit for the surface recombination velocity is: S < - ( ) 2-(x tf( -d 2 /--'D π ) ' The above limit corresponds to a relatively low value S < 10 cm/sec for the case depicted in Figure 5. This surface recombination velocity value is sufficiently low for bulk lifetime measurements on standard size wafers (d > 0.5 mm). This conclusion follows because deviation of the effective lifetime value from the bulk lifetime is less than about 30%, even if the expected bulk lifetime is 10 J seconds. Figure 6 confirms the above finding and demonstrates excellent correlation between Fe-B pair recombination centers and the measured effective lifetime values. It ie known in the art that the presence of Fe in Si, even in low concentration, substantially reduces lifetime. For a p-type boron-doped specimen, iron is present in the form of an Fe-B pair. In such specimens, the concentration of the Fe-B pair recombination centers may be accurately determined using deep level transient spectroscopy ("DLTS") techniques. DLTS techniques are known to those skilled in the relevant art, and details are therefore not presented here. The linearity of the correlation curve shown in Figure 6 is a good indication of the reliability of bulk lifetime measurement, using chemical surface passivation according to the present invention. This conclusion follows because recombination probability, or the reciprocal lifetime l/τ b , is proportional to the concentration of the recombination centers. As noted. Figures 4A and C further bear out the integrity of surface passivation according to the present invention. Various modifications of the present invention may occur to those skilled in the art without departing from the true spirit and scope of the invention, as defined by the appended claims.

Claims: WHAT IS CLAIMED ISi 1. A method for surface passivation of a semiconductor specimen, the method comprising the following steps: (a) providing a passivation solution including iodine; (b) surrounding the specimen with said passivation solution such that both surfaces of the specimen are covered with at least a film of said solution. 2. The method of claim 1, wherein at step (a), said solution includes ethanol. 3. The method of claim 1, wherein at step (a), said solution has an iodine (I a ) concentration ranging from about 0.02 mol-dm *1 to about 0.2 mol-dm *1 . 4. The method of claim 1, wherein at step (b) , said film has a thickness less than about 1 mm. 5. The method of claim 1, wherein at step (a), said solution reduces surface recombination velocity of the specimen below about 10 cm/second. 6. A method for surface passivation of a semiconductor specimen, the method comprising the following steps: (a) providing a passivation solution including concentrated alkaline; (b) surrounding the specimen with said passivation solution βuσh that the upper and lower surfaces of the specimen are covered with at least a film of said solution. 7. The method of claim 6, wherein at step (a), said solution includes at least one constituent selected from the group consisting of ammonia, sodium-hydroxide, and potassium-hydroxide. 8. The method of claim 6, wherein at step (a), said solution has an alkaline concentration of about 4 mol-dm "3 . 9. The method of claim 6, wherein at step (b) , said film has a thickness less than about 1 mm. 10. A method for surface passivation of a semiconductor specimen, the method comprising the following steps: (a) providing a passivation solution including acidic fluoride; (b) surrounding the specimen with said passivation solution such that both surfaces of the specimen are covered with at least a film of said solution. 11. The method of claim 10, wherein at step (b) , said film has a thickness less than about l mm. 12. The method of claim 10, wherein at step (a), said passivation solution has a HF concentration of about 40% m/m. 13. A method of producing in-situ bulk lifetime measurements of a non-oxidized silicon semiconductor specimen, the method comprising the following steps: (a) providing a passivation solution; (b) surrounding the specimen with said passivation solution such that both surfaces of the specimen are covered with at least a film of said solution; (c) subjecting the specimen to energy from a microwave source and from a pulsed optical source; said optical energy creating within at least a region of said specimen carrier pairs that begin to reco bine upon cessation of each optical energy pulse; (d) detecting microwave energy reflected by freed carriers in said specimen; wherein detected reflected microwave energy characterizes minority carrier recombination lifetime within said specimen and provides information as to defects therein. 14. The method of claim 13, wherein at step (a) said solution includes a solution selected from the group consisting of (i) a solution including iodine (I.) , (ii) a solution including concentrated alkaline, and (iii) a solution including acidic fluoride. 15. The method of claim 13, wherein at step (a) said solution includes iodine and ethanol. 16. The method of claim 13, wherein at step (a) said solution has an iodine (I a ) concentration ranging from about 0.02 mol-dm 0 to about 0.2 mol-dm" 3 . 17. The method of claim 13, wherein at step (b) , said film has a thickness less than about 1 mm. 18. The method of claim 13, wherein at step (a), said solution reduces surface recombination velocity of the specimen below about 10 cm/second. 19. The method of claim 13, wherein at step (a), said solution includes NaOH at a concentration of about 4 mol-dm *3 . 20. The method of claim 13, wherein at step (a), said solution is HF at a concentration of about 40% m/m. 21. For use in passivating the surface of a non- oxidized silicon specimen, a passivation solution comprising a solution including iodine. 22. The solution of claim 21, wherein said solution further includes ethanol. 23. The solution of claim 21, wherein said solution has an iodine (I.) concentration ranging from about 0.02 mol-dm" 3 to about 0.2 mol-dm "3 . 24. For use in passivating the surface of a non- oxidized silicon specimen, a passivation solution comprising a solution including concentrated alkaline. 25. The solution of claim 24, wherein said solution includes at least one constituent selected from the group consisting of (i) ammonia, (ii) sodium-hydroxide, and (iii) potassium-hydroxide. 26. The solution of claim 24, wherein said solution has an alkaline concentration of about 4 mol-dm 3 . 27. For use in passivating the surface of a non- oxidized silicon specimen, a passivation solution comprising a solution including HF in a concentration of about 40% m/m.

Inventors: FERENCZI GYOERGY, HORANYI TAMAS, FERENCZI, GYOERGY, HORANYI, TAMAS
Applicants: SEMILAB FELVEZETOE FIZ LAB RT, SEMILAB FELVEZETOE FIZIKAI LABORATORIUM RT.
Application year: 1993
Main classification: H01L21
IPC codes: G01N22, H01L21