PROCESS FOR PREPARING COMPOSITES BASED ON ORIENTED MESOGENIC THERMOSET RESINS

Abstract: Continuous fiber reinforced oriented mesogen-containing resin matrix composites are prepared by (A) saturating a continuous fiber substrate material with a curable composition comprising (1) at least one mesogen-containing resin which contains an average of more than one vicinal epoxide group, thiirane group, cyanate group or vinyl ester group per molecule; and, optionally, (2) a curing amount of at least one curing agent and/or curing catalyst therefor; (B) arranging one or more saturated continuous fiber substrate material(s) formed in step (A) into a desired configuration; (C) subjecting the arranged saturated continuous fiber substrate material(s) from step (B) to a temperature which causes the mesogen-containing resin to convert to a liquid crystalline state; (D) subjecting the heated arranged saturated continuous fiber substrate material(s) from step (C) to a pressure sufficient to cause flow induced shear in the interstices of said continuous fiber substrate; (E) subjecting the continuous fiber substrate material of step (D) to curing conditions either simultaneously with the application of pressure in step (D) and/or subsequent to said application of pressure; and (F) permitting the cured continuous fiber reinforced composite of step (E) to cool to room temperature; thereby forming a cured continuous fiber reinforced composite containing an oriented mesogen-containing resin matrix. These composites have improved properties as compared to composites which are not oriented.

Description: PROCESS FOR PREPARING COMPOSITES BASED ON ORIENTED MESOGENIC THERMOSET RESINS The present invention pertains to a process for orienting a mesogenic thermosettable (curable) resin matrix during the preparation of a continuous fiber reinforced composite and the composite resulting therefrom. Bhama and Stupp in Polymer Engineering and Science, volume 30, number 4, pages 228 to 233 (February, 1990) disclose that carbon fibers dispersed into a thermotropic liquid crystal polyester have an influence on the orientation of said polyester when a magnetic field is applied to induce orientation. An enhanced rate of magnetic field induced orientation was observed in the molten polyester when carbon fibers were dispersed therein. Bhama and Stupp in Polymer Science and Engineering, volume 30, number 10, pages 603 to 608 (May, 1990) additionally disclose that carbon fibers which have been grafted with thermotropic liquid crystal polyester may be useful to control bonding and molecular orientation in the interfacial regions of the composite. Buckley, et al. in U.S. Patent No.4,479,999 (October 30, 1984) discloses a fabric comprising fusible and infusible fibers wherein said fusible fibers comprise thermotropic liquid crystal polymers. Heating of the liquid crystal fibers induces fusion to the adjacent infusible fibers without substantial loss of the orientation which was imparted to said fibers via melt extrusion. Chung, Gurion and Stamatoff in Polymer Composites, volume 6, number 3, pages 181 to 184 (July, 1986) disclose that preoriented thermotropic liquid crystal copolyester films are selectively oriented parallel to the carbon fiber axis in compression molded composites prepared using continous carbon fiber. The parallel orientation occurs regardless of the initial direction of preorientation of the liquid crystal copolyester film. All of the aforementioned employ a thermotropic liquid crystal thermoplastic matrix polymer to form the composite. Because of the extensive use of thermoset resins as composite matrix materials, it would be highly desireable to provide a process wherein a mesogenic thermoset resin matrix is substantially oriented during forming of a composite. Said composites would then provide needed increases in physical, mechanical and/or thermal properties as well as corrosion resistance over conventional thermoset resin based composites. Current methods for achieving an oriented liquid crystal matrix in a composite system are based on either A.) injection molding or extrusion of blends of thermotropic liquid crystal thermoplastics and chopped fiber reinforcement or B.) consolidation of oriented films of thermotropic liquid crystal thermoplastics and a continuous fiber reinforcement. In the injection molding or extrusion processing methods, the amount of chopped fiber reinforcement is usually limited to 30 weight percent or less in order to maintain processability. This constraint greatly restricts the reinforcement that can be achieved. In the consolidation of oriented films of thermotropic liquid crystal thermoplastics, fiber wetout cannot be achieved without melting of the film. Melting and flow to wetout the fibers can result in partial, if not total loss of the orientation. The present invention provides a process for orienting a mesogenic thermosettable resin matrix during the preparation of a continuous fiber reinforced composite. According to the process of the present invention thermosettable mixtures containing a mesogenic thermoset resin are used to prepare composites wherein said cured resin provides an oriented matrix. Additionally, according to the process of the present invention, high levels of fiber reinforcement (50 weight percent or more) can be used and fiber wetout is achieved prior to and/or during orientation of the matrix. A method forforming a continuous fiber reinforced oriented mesogen- containing resin matrix composite which method comprises (A) saturating a continuous fiber substrate material with a curable composition comprising (1) at least one mesogen-containing resin which contains an average of more than one vicinal epoxide group, thiirane group, cyanate group or vinyl ester group per molecule; and optionally, (2) a curing amount of at least one curing agent and/or curing catalyst therefor; (B) arranging one or more saturated continuous fiber substrate material(s) formed in step (A) into a desired configuration; (C) subjecting the arranged saturated continuous fiber substrate material(s) from step (B) to a temperature which causes the mesogen-containing resin to convert to a liquid crystalline state; (D) subjecting the heated arranged saturated continuous fiber substrate material(s) from step (C) to a pressure sufficient to cause flow induced shear in the interstices of said continuous fiber substrate; (E) subjecting the continuous fiber substrate material(s) of step (D) to curing conditions either simultaneously with the application of pressure in step (D) and/or subsequent to said application of pressure; and (F) permitting the cured continuous fiber reinforced composite of step (E) to cool to room temperature; thereby forming a cured continuous fiber reinforced composite containing an oriented mesogen-containing resin matrix. Another aspect of the present invention concerns the oriented thermoset mesogenic resin and continuous fiber reinforced composites resulting from the aforesaid process as well as products prepared therefrom. MESOGENIC THERMOSETTABLE RESINS Any epoxy, thiirane, cyanate or vinyl ester resin containing an average of more than one epoxide, thiirane, cyanate or vinyl ester group and at least one mesogenic moiety per molecule may be used in the process of the present invention to prepare the composites of the present invention. Suitable thermosettable resins containing at least one mesogenic moiety per molecule include those represented by the Formulas I, II or III; Formula I Di D2-Y-A n Y-A n )pi-Y- -(M-CH2-C-CH2-M-Y-Arτ—(Y-A n )pi-Y p— D2 Rl Formula II Dl D2-Y-A n -Y— M-CH2-C-CH 2 -M-Y-Ar . -Y-)-, D2 Rl I I Formula I wherein each Y is independently )3 (R)8 (R)lO ( R )4 D is -O- or -S-; D< is -OH or -SH; D-- is D OH / \ H2C C-CH2-M- H2C=C-C-0-CH 2 -C-CH 2 -0- R1 R1 R1 or -0-C ≡ N with the proviso that when D ~ is -O-C = N, p has a value of zero and when D ~ is 0 OH II I H2C=C-C-0-CH 2 -C-CH 2 -0- R1 R and p has a value greater that zero then D 1 is -OH; each M is independently (a) -0-, -S-, -NR2-, or -CO-O- where the single bonded oxygen atom attached to the carbon atom of -CO-O- is attached to the -CH 2 - — CH 2 group , or ( b ) I Rl where a single bonded oxygen atom is attached to the -CH2- — CH2 group ; Rl each Ra is independently hydrogen or an alkyl or haloalkyi group containing from 1 to 2 carbon atoms with the proviso that only one Ra group can be a haloalkyi group; m has a value from 1 to 100, preferably from 1 to 20, more preferably from 1 to 10, most preferably from 1 to 5; each A is independently a direct single bond, -CR 1 =CR ■-, -C = C-, -N = N-, -CR1 =N-, -0-CO-, -NR1-CO-, -CRi = N-N =CR*-, CR1 =CR *-CO-, -N = CR1-, -CO-O-, -CO-NR*-, -CO-CR 1 = CR 1 -, CO-O-N = CR1-, -CRi = N-0-OC-, -CO-NR1-NR --OC-, CR1 = CR*-0-OC-, -CO-0-CR1 = CRi-, -0-OC-CR1 = CR ■ -, -CR1 = CR1-CO-0-, -CHR1-0-CO-CR1 =CR1-, -CR 1 =CRl-CO-0-CHR i - -CHR1-CO-0-CR1 =CR1-, -CR1 = CRi-0-CO-CHR i -, -CO-S-, -S-OC-, -CH2-CH2-CO-0-, -0-OC-CH2-CH2-, -C ≡ C-C = C-, -CR1 = CR1-CR1 = CR1-, Cl Cl -CRl=C- -C=CRl- (Al) ■ n I (Al)n- ' ~ (Al ) (Al)n- ' -(Al)n -(Al) (Al)n- (Al) (Al)n- CN CN 0 t -C=N- -N=C- or -N=CH- ; each A' is independently a divalent hydrocarbyl group having from 1 to 10, preferably from 1 to 4, carbon atoms; each A* is independently a 0 0 0 0 I I I I I I I I -C- , -0-C- , -C-0- , -C-NR1- , 0 I I or -NR1-C- group ; each R is independently hydrogen or a hydrocarbyl or hydrocarbyloxy group having from 1 to 10, preferably 1 to 4, carbon atoms, a halogen atom, preferably chlorine or bromine, a nitro group, a nitrile group, a phenyl group or a -CO-R 1 group; each R 1 is independently hydrogen or a hydrocarbyl group having 1 to 3 carbon atoms; each R2 is independently a hydrocarbyl group having from 1 to 6 carbon atoms; z has a value of one or two; n has a value of zero or one; p has a value from zero to 30, preferably from zero to 5; and p 1 has a value from 1 to 30, preferably from 1 to 3. The aromatic rings or the A' hydrocarbyl group of Formula III can also contain one or more heteroatoms selected from N, O or S. The term hydrocarbyl as employed herein means any aliphatic, cycloaliphatic, aromatic, aryl substituted aliphatic or cycloaliphatic, or aliphatic or cycloaliphatic substituted aromatic groups. The aliphatic or cycloaliphatic groups can be saturated or unsaturated. When applied to the A' group of Formula III, the hydrocarbyl group can also contain one or more heteroatoms selected from N, O or S. Likewise, the term hydrocarbyloxy means a hydrocarbyl group having an oxygen linkage between it and the carbon atom to which it is attached. The term "curable" and "thermosettable" are used synonymously throughout and mean that the composition is capable of being subjected to conditions which will render the composition to a cured or thermoset state or condition. The terms "cured" and "thermoset" are used synonymously throughout. The term "thermoset" is defined by L.R. Whittington in Whittinqton's Dictionary of Plastics (1968) on page 239: "Resin or plastics compounds which in their final state as finished articles are substantially infusible and insoluble. Thermosetting resins are often liquid at some stage in their manufacture or processing, which are cured by heat, catalysis, or some other chemical means. After being fully cured, thermosets cannot be resoftened by heat. Some plastics which are normally thermoplastic can be made thermosetting by means of crosslinking with other materials." The epoxy resins containing a mesogenic moiety include, for example, those represented by the aforementioned Formulas I, II or III wherein at least 80 percent of the molecules are para substituted by both the bridging groups (-A-) and the substituent containing the epoxide or thiirane groups D / \ -CH 2 -C CH 2 Rl as well as the substituent containing a secondary hydroxyl or thiol alkylidene group(s) Dl I -CH2-C-CH2- I R1 which are present when p has a value greater than zero. The cyanate resins containing a mesogenic moiety include, for example, those represented by the aforementioned Formulas I, II or III wherein at least 80 percent of the molecules are para substituted by both the bridging groups (-A-) and the substituent containing the cyanate groups (-0-C ≡ N). The vinyl ester resins containing a mesogenic moiety include, for example, those represented by the aforementioned Formulas I, II or III wherein at least 80 percent of the molecules are para substitued by both the bridging groups (-A-) and the substituent containing the vinyl ester groups For Formula III, it is to be understood that para substitution is with respect to the direct bond between the aromatic rings. The bridging groups (-A-) form a rigid central linkage between the aromatic ring pairs. To optimize the aspect ratio of said mesogenic or rigid rodlike functionalities, it is preferred that the aromatic ring substituents (R in Formulas I, II and III) are hydrogen or methyl groups. The term "mesogenic" as is used herein designates compounds containing one or more rigid rodlike structural units which have been found to favor the formation of liquid crystal phases in the case of low molar mass substances. Thus the mesogen or mesogenic moiety is that structure responsible for molecular ordering. The term mesogenic is further defined by R. A. Weiss (ed.) and C. K. Ober (ed.) in Liquid-Crystalline Polymers, ACS Symposium Series 435 (1989) on pages 1-2: "The rigid unit responsible for the liquid crystalline behavior is referred to as the mesogen, " and "Liquid crystalline order is a consequence solely of molecular shape anisotropy, such as found in rigid rodshaped molecules. . ." and "Liquid crystal is a term that is now commonly used to describe materials that exhibit partially ordered fluid phases that are intermediate between the three dimensionally ordered crystalline state and the disordered or isotropic fluid state. Phases with positional and/or orientational long-range order in one or two dimensions are termed mesophases. As a consequence of the molecular order, liquid crystal phases are anisotropic, i.e., their properties are a function of direction." Further definition of the term mesogenic may be found in Polymeric Liquid Crystals, Alexandre Blumstein (ed.), (1983) on pages 2 - 3: "Compounds forming small molecule thermotropic liquid crystals usually have the following molecular structural features: - high length:breadth (axial) ratio - rigid units such as 1,4-phenylene, 1 ,4-bicyclooctyl, 1,4-cyclohexyl, etc., - rigid central linkages between rings such as -COO-, -CH = CH-, -N = NO-, -N = IM-, etc. - anisotropic molecular polarization." Representative epoxy resins containing a mesogenic moiety include, for example, the diglycidyl ethers and the dithiirane ethers of 4,4'-dihydroxybiphenyl, 4,4'-d i hyd roxysti I bene, 4,4'-d i hydroxy-d i phenylacety I ene, 4,4' -d i hyd roxyd i phenyl azomethi ne, 4,4'-dihydroxyazobenzene, 4,4'-dihydroxyazoxybenzene, 4,4'-bis((4- hydroxy)phenoxy)diphenyl, 3,3',5,5'-tetramethyl-4,4'-dihydroxydiphenyl, 3,3',5,5'-tetrachloro- 4,4'-dihydroxydiphenyl, 2,2',6,6'-tetramethyl-4,4'-dihydroxydiphenyl, bis (4- hydroxyphenyl)terephthalate, N,N'-bis(4-hydroxyphenyl)terephthalamide, 4-hydroxyphenyl-4- hydroxybenzoate, 4,4'-dihydroxybenzanilide, N-methyl-4,4'-dihydroxybenzanilide, 4,4'- dihydroxy-alpha-methylstilbene, 4,4'-dihydroxychaicone, 4,4'-dihydroxy-alpha-cyanostilbene, 2,2'-dimethyl-4,4'-dihydroxyazoxybenzene, 4,4'-dihydroxy-α,α'-dimethylstilbene, 4,4"- dihydroxybiphenylbenzoate, 4,4'-dihydroxy-α,α'-diethylstilbene, bis(4'-hydroxyphenyl)-1 ,4- benzenediimine, bis(4'-hydroxybiphenyl)terephthalate, the diglycidyl ethers and the dithiirane ethers of the dihydric phenols represented by the following formulas: -16- wherein n' has a value from 1 to 10. Also suitable are the products resulting from advancing the aforementioned diepoxides or dithiiranes with aromatic dihydroxyl or carboxylic acid containing compounds including, for example, all of the previously listed diphenol precursors to the diepoxides or dithiiranes containing a mesogenic moiety; or any combination thereof. Additional representative epoxy resins containing a mesogenic moiety include, for example, the diglycidyl amines and the dithiirane glycidyl amines of N,N'-diethyl-4,4'- diaminostilbene, N,N'-dimethyl-4,4'-diaminostiibene, N,N'-dimethyl-4,4'-diaminobenzanilide; N'-methyl-4'-aminophenyl-N-methyl-4-aminobenzoate, the diglycidyl thioethers and dithiirane glycidyl thioethers of 4,4'-stilbenedithiol, 4,4'-alpha-methylstilbenedithiol, 4,4'- benzanilidedithiol; the diglycidyl esters and the dithiirane glycidyl esters of 4,4'- stilbenedicarboxylic acid, 4,4'-alpha-methylstilbenedicarboxylic acid, 4,4'- benzanilidedicarboxylic acid; the diglycidyl ethers and the dithiirane glycidyl ethers of the bis(2-hydroxyethylether)s of 4,4'-dihydroxystilbene, 4,4'-dihydroxy-alpha-methylstilbene; the diglycidyl thioether ethers and the dithiirane glycidyl thioether ethers of the bis(2- hydroxyethyl thioether)s of 4,4'-stilbenedithiol, 4,4'-alpha-methylstilbenedithiol; the diglycidyl ester ethers and the dithiirane glycidyl ester ethers of the bis(2-hydroxyethylester)s of 4,4'- stilbenedicarboxylic acid, 4,4'-alpha-methylstilbenedicarboxylic acid; the diglycidyl amine ethers and the dithiirane glycidyl amine ethers of the bis(2-hydroxyethylamine)s of N,N'- dimethyl-4,4'-diaminostilbene, N,N'-diethyl-4,4'-diaminostilbene, N'-methyl-4'-aminophenyl- N-methyl-4-aminobenzoate; or any combination thereof. Also suitable are the products resulting from advancing the aforementioned epoxy resins with aromatic dihydroxyl or dicarboxylic acid containing compounds. Representative cyanate resins containing a mesogenic moiety include, for example, the dicyanates of the aforementioned mesogen-containing diphenols used to prepare the mesogen-containing diglycidyl ethers. Representative vinyl ester resins containing a mesogenic moiety include, for example, the acrylic acid and methacrylic acid esters of the aforementioned mesogen- containing diglycidyl ethers. PREPARATION OF EPOXY RESINS Epoxidation of di- and polyhydroxy aromatic compounds (or di- and polycarboxylic acids or bis(secondary amino)aromatic compounds) used to prepare the epoxy resins used in the present invention can be performed by the known methods described in Handbook of Epoxy Resins by Lee and Neville, McGraw-Hill, 1967; Jpn. Kokai Tokkyo Koho JP 6286,484 (8796,484); EP 88-008358/92 and Journal of Applied Polymer Science, Vol. 23, 1355- 1372 (1972). This usually includes reacting the respective di- or polyhydroxy aromatic compound (or di- and polycarboxylic acids or bis(secondary amino)aromatic compound) with an excess of an epihalohydrin such as, for example, epichlorohydrin or methyl epichlorohydrin, at a temperature of from about 0 C C to about 100°C, preferably from about 20°C to about 65°C followed by dehydrohalogenation with a basic-acting material such as, for example, an alkali metal hydroxide, typically sodium hydroxide, at a temperature of from about 0°C to about 100°C, preferably from about 20 C C to about 65°C and finally recovering the resulting glycidyl ether product. For the production of polyepoxides from di- and polyhydroxy aromatic compounds possessing functional groups or linkages that are sensitive to hydrolysis under the reaction conditions employed in certain epoxidation chemistries, alternate techniques of preparation may be employed. As a typical example, Dhein, et al. in U. S. Patent No. 4,762,901 teaches preparation of the diglycidyl ether of the bisphenol represented by the following formula 0 which is a compound containing an ester linkage known to be sensitive to hydrolysis, using an anhydrous epoxidation technique. This technique employs azeotropic removal of water/epichlorohydrin concurrent with the controlled addition of aqueous sodium hydroxide to a reaction mixture consisting of epichlorohydrin, a diphenol, a phase transfer catalyst such as, for example, benzyltrimethylammonium chloride, and optionally, solvent(s) may also be employed. It is advantageous to conduct such anhydrous epoxidation reactions under a vacuum to facilitate the azeotropic removal of water. The azeotropic removal of water is usually conducted at temperatures of from about 20°C to about 100°C, preferably from about 30°C to about 65°C. It is also operable and advantageous to utilize sodium hydroxide free of water as the alkali metal hydroxide reactant. In order to control reaction exotherm, the solid sodium hydroxide is typically added in aiiquots as a powder to the epoxidation reaction mixture. A typical anhydrous epoxidation technique is described by Wang, et al. in U.S. Patent No.4,499,255. Another specific anhydrous epoxidation technique involves catalytic coupling of the di- or polyhydroxyl containing compound with an epihalohydrin, typically using as a catalyst one or more of the aforementioned ammonium halides. The resultant solution of halohydrin in excess epihalohydrin is then treated with finely pulverized potassium carbonate to effect dehydrohalogenation to the epoxy resin. Epoxy resins can be converted to thiirane resins (polythiirane compounds) via reaction of the epoxide groups therein with suitable sulfur containing compounds such as, for example, inorganic thiocyanates, thioureas, N-alkylbenzothiazol-2-thionessuch as N- methylbenzothiazol-2-thione/trifluoroacetic acid or a phosphine sulf ide such as triphenylphosphine sulfide/trif luoroacetic acid. The reaction is usually conducted at temperatures of from 5°Cto 100°C, preferably from 20°C to 60°C, for a time sufficient to complete the reaction, usually from one hour to forty eight hours, preferably from four to twenty four hours. The higher reaction temperatures typically require shorter times whereas the lower reaction temperatures typically require longertimesto complete the reaction. These reaction conditions are reported by Bell and Ku in the article "Epoxy/Episulfide Resins" pages 3 to 26 and by Vecera and Spacek in the article "Preparation and Reactivity of Thiiranes", pages 73 to 80 both published in Crosslinked Epoxies. Sedlacek and Kahwec (editors), by Waiter de Gruyter, New York (1987); Chan and Finkenbine, Journal of the American Chemical Society, 94, 2880 (1972) and Calo, Lopez, Marchese and Pesce, Journal of the Chemical Society, Chemical Communications, 621 (1975). 0 ADVANCED EPOXY RESINS Advancement reaction of the epoxy resins containing a mesogenic moiety with one or more compounds having an average of more than one active hydrogen atom per molecule can be performed by the known methods described in the aforementioned Handbook of Epoxy Resins. This usually includes combining the compound(s) having an 5 average of more than one group reactive with an epoxide or thiirane group per molecule and the epoxy resin(s) with the application of heat and mixing to effect the advancement reaction. A catalyst is frequently added to facilitate the advancement reaction. The epoxy resin(s) and the compound(s) having an average of more than one group reactive with an epoxide or thiirane group per molecule are reacted in amounts which o provide suitably from 0.001 : 1 to 0.95: 1 , more suitably from 0.01 : 1 to 0.7: 1, most suitably from 0.05: 1 to 0.50: 1 active hydrogen atoms per epoxide or thiirane group. By the term "compounds having an average of more than one active hydrogen atom per molecule" it is meant that the compound contains hydrogen atoms which are reactive with an epoxide or thiirane group. 5 Suitable compounds having an average of more than one active hydrogen atom per molecule which can be employed to prepare advanced resins useful in the present invention may contain one or more mesogenic moieties or may be free of said moieties. Suitable compounds having an average of more than one active hydrogen atom per molecule which can be employed to prepare the advanced resins include, for example, diphenols, 0 thiodiphenols, dicarboxylic acids and compounds containing one primary amine or amide group or two secondary amine groups such as those represented by the Formulas IV, V, VI or VII; 5 Formula IV Xπ-Ϊ-X. Formula V χ q _γ_ Aπ _ γ_ An ^— γ.χ q Formula VI Formula VI I H2N-R 3 wherein X is independently a -OH, -COOH, -SH or -NHR 1 group; q has a value of 1 with the proviso that when one q = 1 and one q = 0, one X may be -NH 2 , H 2 N-S0 2 -, H 2 N-CO- or H 2 N-R3-0- and the other X becomes R; R 3 is an aliphatic, cycloaliphatic, polycycloaliphatic or alkylsubstituted cycloaliphatic or polycycloaliphatic group having from 1 to 12, preferably 1 to 4, carbon atoms, q has a value of zero or one, each Y is independently each A is independently a direct single bond, a divalent hydrocarbyl group having from 1 to about 20, preferably from 1 to about 14, carbon atoms, -0-, -CO-, -SO-, -S0 2 -, -S-, -S-S-, -CRi = CRi-, -C = C-, -N = N-, -CR 1 = N-, -0-CO-, -NR1-CO-, -CR 1 = N-N = CR1-, -CR i = CR1-CO-, -N = CR i -, -CO-O-, -CO-NR1-, -CO-CR1 = CR1-, -CO-0-N = CR *-, -CR1 =N-0-OC-, -CO-NR1-NR1-OC-, -CR1 = CR1-0-OC-, -CO-0-CR1 = CR1-, -0-OC-CR 1 = CR1-, -CR 1 = CRi-CO-O-, -CHR1-CO-0-CR1 = CR1-, -CRi = CRi-O-CO-CHRl-, -CO-S-, -S-OC-, -CH 2 -CH 2 -CO-0-, -0-OC-CH 2 -CH 2 -, -C = C-C ≡ C-, -CR1=CR1-CR1=CR1-, Cl Cl -CR 1 =C-, -C CR 1 -, -(A -(Al)n (Al)n- ' -(Al) (Al)n- > 2C 25 CM 0 CN CN t -N=N- > -C=N- or -N=C- and A', A 1 , R 1 , z and n are as hereinbefore defined. The aromatic rings can also contain one or more heteroatoms selected from N, O or S. Particularly suitable hydroxyl containing compounds include, for example, hydroquinone, bisphenol A, 4,4'-dihydroxydiphenylmethane, 4,4'-thiodiphenol, 4,4'-sulfonyldiphenol, 4,4'-dihydroxydiphenyl oxide, 4,4'-dihydroxybenzophenone, 1,1-bis(4-hydroxy-phenyl)-1-phenylethane, 3,3',5,5'-tetrachorobisphenol A, 3,3'-dimethoxybisphenol A, 4,4'-dihydroxybiphenyl, 4,4'-dihydroxy-α,α'-diethylstilbene, 4,4'-dihydroxy-α-methylstilbene, 4,4'-dihydroxybenzanilide, 4,4'-dihydroxy-2,2'-dimethylazoxybenzene, 4,4'-dihydroxy-α-cyanostilbene, bis(4-hydroxy- phenyl)terephthalate, N,N'-bis(4-hydroxy-phenyl)terephthalamide, bis(4'-hydroxybiphenyl)- terephthalate, 4,4'-dihydroxyphenylbenzoate, bis(4'-hydroxyphenyl)-1 ,4-benzenediimine, 4,4"-dihydroxybiphenylbenzoate, 1 ,4-bis(4'-hydroxy-phenyl-1 '-carboxamide)benzene, 1,4-bis(4'-hydroxy-phenyl-1'-carboxy)benzene, 4,4'-bis(4"-hydroxy- phenyl-1 "-carboxy)biphenyl, or any combination thereof. Particularly suitable thiol containing compounds include, for example, 4,4'- dithiodiphenylmethane, 4,4'-isopropylidenedithiophenol, 4,4'-dithio-α-methylstilbene, or any combination thereof. Particularly suitable carboxylic acid containing compounds include, for example, terephthalic acid, 4,4'-benzanilide dicarboxylic acid, 4,4'-phenylbenzoate dicarboxylic acid, 4,4'-stilbene-dicarboxylic acid or any combination thereof. Particularly suitable primary amine or amide containing compounds or compounds containing two secondary amine groups include, for example, aniline, 4'-sulfonamido-N-phenylbenzamide, 4'-sulfonamido-N'-phenyl-4-chlorobenzamide, 4-amino-1-phenylbenzoate, 4-amino-N-phenylbenzamide, N-phenyl-4-amino- phenyl-1-carboxamide, phenyl-4-aminobenzoate, biphenyl-4-aminobenzoate, 1-phenyl-4'-aminophenyl-terephthalate, N,N'-dimethyl-4,4'-diaminostilbene, or any combination thereof. The advancement reaction can be conducted in the presence of a suitable advancement catalyst such as, for example, phosphines, quaternary ammonium compounds, phosphonium compounds, tertiary amines, or any combination thereof. Particularly suitable catalysts include, for example, ethyltriphenylphosphonium chloride, ethyltriphenylphosphonium bromide, ethyltriphenyl-phosphonium iodide, ethyltriphenylphosphonium diacetate (ethyltriphenylphosphonium acetate.acetic acid complex), ethyltriphenylphosphonium phosphate, tetrabutylphosphonium chloride, tetrabutylphosphonium bromide, tetrabutylphosphonium iodide, tetrabutyl-phosphonium diacetate (tetrabutylphosphonium acetate.acetic acid complex), butyltriphenylphosphonium 0 tetrabromobisphenate, butyltriphenylphosphonium bisphenate, butyltriphenylphosphonium bicarbonate, benzyltr imethylammonium chloride, tetramethylammonium hydroxide, triethylamine, tripropylamine, tributylamine, 2-methylimidazole, benzyldimethylamine, or any combination thereof. Many of these catalysts are described in U. S. Patent Nos. 3,306,872; 3,341 ,580; 3,379,684; 3,477,990; 3,547,881 ; 3,637,590; 3,843,605; 3,948,855; 3,956,237; 5 4,048,141 ; 4,093,650; 4,131 ,633; 4,132,706; 4,171 ,420; 4, 177,216 and 4,366,295. The amount of advancement catalyst depends upon the particular reactants and catalyst employed; however, it is usually employed in quantities of from 0.03 to 3, preferably from 0.03 to 1.5, most preferably from 0.05 to 1.5 percent by weight based upon the weight of the epoxide or thiirane containing compound. The advancement reaction can be conducted at o atmospheric, superatmospheric or subatmospheric pressures at temperatures of from 20°C to 260°C, preferably from 80°C to 240°C, more preferably from 100°C to 200°C. The time required to complete the advancement reaction depends upon the temperature employed. Higher temperatures require shorter periods of time whereas lower temperatures require longer periods of time. Generally, however, times of from 5 minutes to 24 hours, preferably from 30 5 minutes to 8 hours, more preferably from 30 minutes to 3 hours are suitable. If desired, the advancement reaction can be conducted in the presence of one or more solvents. Suitable such solvents include, for example, glycol ethers, aliphatic and aromatic hydrocarbons, aliphatic ethers, cyclic ethers, ketones, esters, amides, or any combination thereof. Particularly suitable solvents include, for example, toluene, benzene, 0 xylene, methyl ethyl ketone, methyl isobutyl ketone, diethyiene glycol methyl ether, dipropylene glycol methyl ether, dimethylformamide, dimethyl-sulfoxide, N-methylpyrrolidinone, tetrahydrofuran, propylene glycol methyl ether, or any combination thereof. The solvents can be employed in amounts of from zero to 80%, preferably from 20% to 60%, more preferably from 30% to 50% by weight based upon the weight of the reaction 5 mixture. The advancement of the epoxy resins containing one or more mesogenic moieties with compounds having an average of more than one active hydrogen atom per molecule is employed to chain extend and/or branch the resin. This chain extension and/or branching is required for some mesogen containing resin compositions in order to obtain liquid crystal character. The advancement of the mesogenic epoxy resins can also be used to modify the temperature range in which a particular resin is liquid crystalline and to control the degree of crosslinking during the final curing. PREPARATION OF CYANATE RESINS The polycyanates used in the present invention are prepared by reacting one or more polyphenols containing one or more mesogenic moieties with a stoichiometric quantity or a slight stoichiometric excess (up to 20 percent excess) of a cyanogen halide per -OH group in the presence of a stoichiometric quantity or a slight stoichiometric excess (up to 20 percent excess) of a base compound per -OH group and in the presence of a suitable solvent. Reaction temperatures of from -40°C to 60°C are operable, with reaction temperatures of -15°C to 10°C being preferred. Reaction times can vary substantially, for example, as a function of the reactants being employed, the reaction temperature, solvent(s) used or the scale of the reaction, but are generally between 15 minutes and 4 hours, with reaction times of 30 minutes to 90 minutes being preferred. Suitable cyanogen halides include cyanogen chloride and cyanogen bromide. Alternately, the method of Martin and Bauer described in Organic Synthesis, Volume 61, pages 35 to 68 (1983) published by John Wiley and Sons can be used to prepare the required cyanogen halide in situ from sodium cyanide and a halogen such as chlorine or bromine. Suitable base compounds include both inorganic bases and tertiary amines such as sodium hydroxide, potassium hydroxide, trimethylamine, triethylamine, or any combination thereof,. Triethylamine is most preferred as the base. Suitable solvents for the cyanation reaction include water, aliphatic ketones, chlorinated hydrocarbons, aliphatic and cycloaliphatic ethers and diethers, aromatic hydrocarbons, or any combination thereof. Acetone, methylethyl ketone, methylene chloride and chloroform are most preferred as the solvent. PREPARATION OF VINYL ESTER RESINS The vinyl ester resins used in the present invention are prepared by reacting one or more diglycidyl ethers, optionally containing one or more monoepoxides, containing one or more mesogenic moieties with one or more polymerizable monounsaturated monocarboxylic acids. A mole ratio of 0.9 to 1.1 monounsaturated monocarboxylic acid per epoxide group is preferred with a ratio of 0.95 to 1.0 being most preferred. Suitable monounsaturated monocarboxylic acids for reaction with the diglycidyl ethers (optionally containing one or more monoepoxides) include, for example, acrylic acid, methacrylic acid, cyanoacrylic acid, crotonic acid, alpha-phenylacrylic acid, methoxyacrylic acid, alpha-4-phenylphenylacrylic acid, monomethylester of fumaric acid, or any combination thereof. The reaction between the epoxide group and the carboxylic acid group is typically performed in the presence of one or more catalysts. Chromium trichloride and tris(dimethylaminoethyl)phenol are most preferred as the catalysts. A quantity of from 0.01 to 2 percent by weight has been found to be a suitable quantity of catalyst with concentrations of 0.1 to 0.3 weight percent of the total reactants being most preferred. A suitable process inhibitor is typically used in the reaction between the epoxide group and the carboxylic acid group to prevent gelation (homopolymerization of the vinyl ester(s) and/or copolymerization of the vinyl ester(s) with unreacted monounsaturated monocarboxylic acid). Hydroquinone activated with air is a most preferred inhibitor at concentrations of from 100 ppm to 500 ppm based on the weight of the total reactants used. The reaction to produce the vinyl ester resins containing one or more mesogenic moieties is optionally conducted in one or more organic solvents inert to the other reactants. The term inert as applied to the organic solvent means that little, if any, reaction between the diglycidyl ether (optionally containing one or more monoepoxides), the monounsaturated monocarboxylic acid or the vinyl esters thereof occurs under the reaction conditions employed. Typical of the inert organic solvents are the aliphatic ketones, such as methylisobutyl ketone, the chlorinated aliphatics, such as perchloroethylene and the aromatic hydrocarbons, such as toluene. The reaction to produce vinyl esters is usually conducted at a temperature of from 50°Cto 125°C, preferably from 80°Cto 120°C for from 90 minutes to 720 minutes, preferably from 120 minutes to 420 minutes. Although reaction times and reaction temperatures can vary substantially, most preferred vinyl ester compositions containing a mesogenic moiety are produced by reacting to a specific conversion, typically 1.5 to 0.25 percent carboxylic acid. The resulting vinyl ester containing one or more mesogenic moieties can be combined with one or more polymerizable ethyleni cally unsaturated monomers. Suitable ethylenically unsaturated monomers which can be employed herein can be selected from the many known classes of polymerizable vinyl monomers. Suitable such monomers include, for example, the vinyl aromatic compounds which include such monomers as styrene, alpha- methylstyrenes, vinyl toluenes, halogenated styrenes, t-butylstyrenes, divinyl benzenes or any combination thereof. Other suitable monomers include the methyl, ethyl, isopropyl, octyl, etc. esters of acrylic or methacrylic acid; acidic monomers such as acrylic acid, methacrylic acid and crotonic acid; amide monomers such as acrylamide and N-alkylacrylamides; allyl monomers such as diallylphthalate, triallylisocyanurate, diallylmaleate, dimethallylfumarate or any combination thereof. Preferred polymerizable monomers containing ethylenic unsaturation include, for example, styrene, p-vinyltoluene, o-, m-, p-halostyrenes, vinyl naphthalenes, vinyl acetate, the various alpha-substituted styrenes, as well as the various di-, tri- and tetrahalo styrenes and acrylic, methacrylic and crotonic acid esters including both the saturated alcohol esters and the hydroxyalkyl esters. CURING AGENTS AND/OR CATALYSTS The epoxy resins useful in the present invention can be cured with any suitable curing agent and/or curing catalyst for curing epoxy or thiirane resins such as, for example, primary and secondary polyamines, carboxylic acids and anhydrides thereof, aromatic hydroxyl containing compounds, imidazoles, guanidines, urea-aldehyde resins, melamine-aldehydes resins, alkoxylated urea-aldehyde resins, alkoxylated melamine-aldehyde resins, aliphatic amines, cycloaliphatic amines, aromatic amines or anycombination thereof. Particularly suitable curing agents include, for example, methylene dianiline, dicyandiamide, ethylene diamine, diethylenetriamine. triethylenetetramine, tetraethylenepentamine, urea- formaldehyde resins, melamine-formaldehyde resins, methylolated urea-formaldehyde resins, methylolated melamine-formaldehyde resins, phenol-formaldehyde novolac resins, cresol- formaldehyde novolac resins, sulfanilamide, substituted sulfani lam ides, diaminodiphenylsulfone, diethyltoluenediamine, t-butyltoluenediamine, bis-4-aminocyclohexylmethane, isophoronediamine, diaminocyclohexane, hexamethylenediamine, piperazine, aminoethylpiperazine, 2,5-dimethyl-2,5-hexanediamine, 1,12-dodecanediamine, tris-3-aminopropylamine or any combination thereof. The curing agents and/or curing catalysts are employed in amounts which will effectively cure the epoxy or thiirane resin; however, these amounts will depend upon the particular epoxy resin or thiirane resin and curing agent and/or curing catalyst employed. Generally, suitable amounts of curing agent include, for example, from 0.50: 1 to 1.2: 1, preferably from 0.90: 1 to 1.1 : 1 equivalents of curing agent per equivalent of resin. Generally, suitable amounts or curing catalyst include, for example, from 0.00001 to 5, preferably from 0.1 to 1 weight percent of catalyst based on the weight of epoxy or thiirane resin. The thiirane resins useful in the present invention can also be "self-cured", that is subjected to heat, until reaction of thiirane moieties occurs. It is felt that the self-curing results from initial opening of the thiirane ring to form a stable sulf ide ion which subsequently anionically attacks another thiirane ring. It is beneficial to partially (B-stage) or totally homopolymerize (self-cure) the polythiiranes containing one or more mesogenic moieties to produce resin compositions possessing liquid crystal character. The polycyanates useful in the present invention can be cured by heating from 50°Cto 400°C, preferably by heating from 100°Cto 250°C, optionally in the presence of a suitable catalyst. Suitable catalysts include, for example, acids, bases, salts, nitrogen and phosphorous compounds, such as for example, Lewis acids, such as AICI3, BF 3 , FeCl 3 , TiCI 4 , ZnCI 2 , SnCI : protonic acids such as HCI, H 3 P0 ; aromatic hydroxy compounds such as phenol, p-nitrophenol, pyrocatechol, dihydroxynaphthalene; sodium hydroxide, sodium methylate, sodium phenolate, trimethylamine, triethylamine, tributylamine, diazabicyclo-(2.2.2)-octane, quinoline, isoquinoline, tetrahydroisoquinoline, tetraethylammonium chloride, pyridine-N- oxide, tri butyl phosphine, zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, cobalt acetylacetonate, or any combination thereof. Also suitable as catalysts are the metal chelates such as, for example, the chelates of transition metals and bidentate or tridentate ligands, particularly chelates of iron, cobalt, zinc, copper, manganese, zirconium, titanium, vanadium, aluminum and mahnesium. These and other operable catalysts are disclosed in U.S. Patent Nos. 3,694,410 and 4,094,852. Cobalt naphthenate, cobalt octoate and cobalt acetylacetonate are most preferred as the catalysts. The quantity of catalyst used, if any, depends on the structure of the polycyanate being cured or the cure time,. Generally, catalyst concentrations of from 0.001 to 2 percent weight are preferred. B-staging or prepolymerization of the polycyanates used in the present invention can be accomplished by using lower temperatures and/or shorter cure times. Curing of the thus formed B-staged (prepolymerized) cyanate resin can then be accomplished at a later time or immediately following B-staging (prepolymerization) by increasing the temperature and/or curing time. The vinyl ester compositions useful in the present invention can be cured by the application of heat and/or pressure, optionally in the presence of a free radical forming catalyst. Catalysts that can be used for the curing are preferably the peroxide catalysts, such as benzoyl peroxide, lauroyl peroxide, t-butylhydroperoxide, methyl ethyl ketone peroxide, t- butylperbenzoate, potassium persulfate or any combination thereof. The amount of the catalyst added will vary from 0.1 to 2 percent by weight, preferably from 0.75 to 1.5 percent by weight. Temperatures employed can vary over a considerable range but usually are in the range of 20°Cto 250°C. Depending on the relative solubility and phase transition temperature(s) associated with the mesogenic moieties present in the vinyl ester compositions, curing at a elevated temperature can be especially desireable to enhance the molecular anisotropy of the cured product. Additionally, more rapid curing of the vinyl ester compositions can be accomplished by the addition of accelerating agnets such as lead or cobalt naphthenate, N,N- dimethylaniline or any combination thereof, usually in concentrations ranging from 0.01 to 2 percent by weight, preferably 0.05 to 0.5 percent by weight. MONOEPOXIDE AND MONOTHIIRANE COMPOUNDS Monothiirane and/or monoepoxide compounds can be employed as reactive diluents for the epoxy or thiirane resins useful in the present invention. The monoepoxide and/or monothiirane compounds may contain one or more mesogenic moieties or may be free of said mesogenic moieties. Preparation of monothiirane compounds containing a mesogenic unit which can be employed as reactive diluents herein is taught by Scherowsky and Gay, Liquid Crystals. 5. 4, 1253 (1989). The monoepoxide and/or monothiirane compound(s) are employed in amounts which provides the composition with the viscosity and reactivity profile desired for the particular purpose in which the composition is being employed. Usually the amount of monoepoxide and/or monothiirane compound(s) is from 1 to 99, preferably from 5 to 40, percent by weight based upon the combined weight of all compounds containing epoxide and/or thiirane groups. NON-MESOGENIC THERMOSETTABLE RESINS The mesogenic thermosettable resins used in the present invention can also be employed for the purpose of improving the properties provided by non-mesogenic thermosettable resins. Generally, suitable amounts of mesogenic thermosettable resins are from 1 to 99, more suitably from 10 to 80, most suitably from 10 to 50 weight percent based on the total weight of the combined resins. Suitable epoxy resins which can be blended with the mesogenic resins include any compound containing an average of more than one vicinal epoxide group per molecule. Suitable such epoxy resins include, for example, aromatic epoxides, aliphatic epoxides, cycloaliphatic epoxides, or any combination thereof. Particularly suitable epoxy resins include the diglycidyl ethers of: (a) compounds containing one or more aromatic rings and two or more aromatic hydroxyl groups per molecule; (b) compounds which are the result of reacting an alkylene oxide or monoglycidyl ether compound with the compounds of (a); (c) aliphatic diols which contain ether oxygen atoms or which are free of ether oxygen atoms; or (d) cycloaliphatic compounds containing more than one hydroxyl group per molecule. Particularly suitable epoxy resins include, for example, (a) the diglycidyl ethers of resorcinol, bisphenol A, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxybenzophenone, 3,3',5,5'-tetrabromobisphenol A, 4,4'-thiodiphenol, 4,4'-sulfonyldiphenol,4,4'- dihydroxydiphenyl oxide, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 3,3',5,5'- tetrachlorobisphenol A, 3,3'-dimethoxybisphenol A, 4,4'-dihydroxy-alpha-methylstilbene, 4,4'- dihydroxybenzanilide, 4,4'-dihydroxyazoxybenzene, 4,4'-dihydroxybiphenyl; (b) the triglycidyl ether of tris(hydroxyphenyl)methane; (c) the polyglycidyl ethers of a phenol or alkyl or halogen substituted phenol-aldehyde acid catalyzed condensation product (novolac resins); the polyglycidyl ether of the condensation product of a dicyclopentadiene or an oligomer thereof and a phenol or alkyl or halogen substituted phenol; (d) the advancement reaction products of the aforesaid di- and polyglycidyl ethers with aromatic di- or polyhydroxyl- or carboxylic acid- containing compounds including, for example, bisphenol A (4,4'-isopropylidenediphenol), o-, m-, p-dihydroxybenzene, 2,4-dimethylresorcinol, 4,4'-dihydroxybiphenyl, 4,4'-dihydroxy-alpha- methylstilbene, 4,4'-dihydroxybenzaniiide, 4-chlororesorcinol, tetramethylhydroquinone, 1,1-bis(4-hydroxyphenyl)ethane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 4,4'- di hyd roxydi phenyl ether, 3,3',5,5'-tetramethyldihydroxydiphenyl ether, 3,3', 5,5'- dichlorodihydroxydiphenyl ether, 4,4'-bis-(p-hydroxyphenyl isopropyl)diphenyl ether, 4,4'-bis- (p-hydroxyphenoxy)benzene, 4,4'-bis(p-hydroxy-phenoxy)diphenyl ether, 4,4'-bis(4(4- hydroxyphenoxy.-phenyl sulfone)diphenyl ether, 4,4'-dihydroxydiphenyl sulfone, 4,4'- dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl disulfide, 2,2'-dihydroxy-diphenyl sulfone, 4,4'-dihydroxydiphenyl methane, 1,1-bis(p-hydroxyphenyl)cyclohexane, 4,4'-dihydroxy- benzophenone, phloroglucinol, pyrogallol, 2,2',5,5'-tetrahydroxydiphenyl sulfone, tris(hydroxyphenyl)methane, dicyclopentadiene diphenol, tricyclopentadiene diphenol; and (e) any combination of any of the aforementioned epoxy resins. Suitable cyanate resins which can be blended with the mesogenic resins include any compound containing an average of more than one cyanate group per molecule. Suitable such cyanate resins include; for example the aromatic di- and polycyanates and aromatic cyanate terminated oligomers and polymers. Particularly suitable cyanate resins are the aromatic dicyanates. Particularly suitable cyanate resins include, for example, the dicyanates of the aforementioned mesogen-free diphenols used to prepare the mesogen-free epoxy resins. Suitable vinyl ester resins which can be blended with the mesogenic resins include any compound containing an average of more than one vinyl ester group per molecule. Suitable such vinyl ester resins include, for example, vinyl esters of aromatic epoxides, aliphatic epoxides, cycloaliphatic epoxides or any combination thereof. Particularly suitable vinyl esters include the vinyl esters of the diglycidyl ethers of: (a) compounds containing one or more aromatic rings and two or more aromatic hydroxyl groups per molecule; (b) compounds which are the result of reacting an alkylene oxide or monoglycidyl ether compound with the compounds of (a); (c) aliphatic diols which contain ether oxygen atoms or which are free of ether oxygen atoms; and (d) cycloaliphatic compounds containing more than one hydroxyl group per molecule. Particularly suitable vinyl ester resins include, for example the vinyl ester resins of the aforementioned mesogen-free diglycidyl ethers, triglycidyl ether, polyglycidyl ethers and advancement reaction products of the aforesaid di- and polyglycidyl ethers. CONTINUOUS REINFORCING MATERIALS The continuous reinforcing materials which can be employed herein include natural and synthetic fibers in the form of woven fabric, mats, monofilament, multifilament, unidirectional fibers, or any combination thereof. Suitable reinforcing materials include glass, ceramics, nylon, rayon, cotton, aramid, carbon (graphite), silicon carbide, polybenzoxazoles, polyesters such as polyalkylene terephthalates, polyethylene, polypropylene, aluminum oxide, boron, or any combination thereof, or hybrids thereof. The amount of continuous reinforcing fiber used in the composites of the present invention can vary widely as a function of the type of thermosettable resin(s) used, the type of curing agent(s) and/or catalyst(s) used, the processing temperature(s) employed, the type of continuous reinforcing fiber used, the processing method(s) used, and other known variables. Generally, continuous reinforcing fibers can be employed in amounts suitably from 0.5 to 90, more suitably from 1 to 80, most suitably from 2 to 70 percent by weight based upon the o weight of the total composite. COMPOSITE PROCESSING METHODS The methods for combining the continuous fiber reinforcement with the mesogenic thermoset resin are those known to the art for the preparation of continuous fiber reinforced composites. These methods are based on applying the thermosettable resin plus any 5 curing agent and/or catalyst that is used as the matrix material to the continuous fiber reinforcement in the melted state, as a powder, or in a one or more solvents. In this processing, the combination of the continuous fiber reinforcement and the curable mesogenic thermoset resin system can be done to prepare ready to mold sheets (prepreg) which can be used immediately or stored and used at a later time to form the desired part. Alternatively, the 0 shape of the final composite can be done during combination with the continuous fiber reinforcement, such as is done in resin transfer molding, filament winding and pultrusion. Detailed teaching of these processing methods can be found in Fiber-Reinforced Composites: Materials, Manufacturing, and Design by P.K. Mallick, Chapter 5, pages 319 to 379, published by Marcel Dekker, Inc., New York, New York (1988). 5 After, and optionally before, the combination with the continuous fiber reinforcement, the curable mesogenic thermoset resin system is heated to a temperature where liquid crystallinity either exists or develops during curing. Upon obtaining a liquid crystal state for the matrix resin, flow induced shear is then produced between the interstices of the continuous fiber reinforcement by the application of pressure. Processing methods 0 which allow for the application of pressure during consolidation of the composite include autoclaving and/or vacuum bag molding, compression molding, resin transfer molding and rolling. Detailed teaching of these processing methods can be found in the aforementioned Fiber-Reinforced Composites: Materials, Manufacturing, and Design reference. After producing flow induced shear, sufficient time is allowed for thermosetting to lock in the 5 resultant orientation in the matrix resin. The temperature of the composite can then be raised, if required, to complete the cure of the matrix resin. The temperature at which pressure is applied to induce orientation of the matrix resin depends principally upon the curable mesogenic thermoset resin system used. The temperatures which are typically employed preferably range from 20°C to 260°C, more preferably from 60°C to 240°C , most preferably from 80°C to 200°C . For certain of the curable mesogenic thermoset resin systems, holding at a specific temperature is required before the application of flow induced shear. This is needed in order to develop liquid crystal character which occurs as a result of B-staging (prepolymerization) of the resin. The B-staging times which are typically encountered for development of liquid crystal character can range from 1 minute to 24 hours or longer depending upon the particular curable mesogenic thermoset resin system used and the temperature employed. The pressure required to produce flow induced shear of the matrix resin depends principally upon the viscosity of the curable mesogenic thermoset resin system while in the liquid crystal state. The pressures which are typically employed preferably range from 0 to 10,000 psig, more preferably from 1 to 1000 psig, most preferably from 5 to 100 psig. ADDITIONAL ORIENTATION METHODS During processing and/or cure of the composite into a part, electric and/or magnetic fields can be applied for the purpose of further orienting or modifying the orientation of the liquid crystal moieties contained or developed therein and oriented by flow induced shear in the interstices of the continuous fiber reinforcement. As specific examples of these methods, Finkelmann, et al, Macromol. Chem., Volume 180, pages 803 to 806 (March 1979) induced orientation in thermotropic methacrylate copolymers containing mesogenic side chain groups decoupled from the main chain via flexible spacers in an electric field. Orientation of mesogenic side chain groups decoupled from the polymer main chain via flexible spacers in a magnetic field has been demonstrated by Roth and Kruecke, Macromol. Chem., Volume 187, pages 2655 to 2662 (November 1986). Magnetic field induced orientation of mesogenic main chain containing polymers has been demonstrated by Moore, et al, ACS Polymeric Material Sciences and Engineering, Volume 52, pages 84 to 86 (April-May 1985). Magnetic and electric field orientation of low molecular weight mesogenic compounds is discussed by W. R. Krigbaum in Polymer Liguid Crystals, pages 275 to 309 (1982) published by Academic Press, Inc.. OTHER COMPONENTS The mesogenic thermoset resin plus any curing agent and/or curing catalyst used in the present invention can be blended with other materials such as solvents or diluents, fillers, pigments, dyes, flow modifiers, thickeners, reinforcing agents, mold release agents, wetting agents, stabilizers, fire retardant agents, surfactants or any combination thereof. These additives are added in functionally equivalent amounts, for example, the pigments and/or dyes are added in quantities which will provide the composition with the desired color; however, they are suitably employed in amounts of from zero to 20, more suitably from 0.5 to 5, most suitably from 0.5 to 3 percent by weight based upon the weight of the total blended composition. Solvents or diluents which can be employed herein include, for example, hydrocarbons, ketones, glycol ethers, aliphatic ethers, ;lic ethers, esters, amides or any combination thereof. Particularly suitable solvents or diluents include, for example, toluene, benzene, xylene, methyl ethyl ketone, methyl isobutyl ketone, diethyiene glycol methyl ether, dipropylene glycol methyl ether, dimethylformamide, N-methylpyrrolidinone, tetrahydrofuran, propylene glycol methyl ether or any combination thereof. The modifiers such as thickeners, flow modifiers and the like can be suitably employed in amounts of from zero to 10, more suitably from 0.5 to 6, most suitably from 0.5 to 4 percent by weight based upon the weight of the total composition. Suitable fillers which can be employed herein include, for example, inorganic oxides, ceramic microspheres, plastic microspheres, glass microspheres, inorganic whiskers, CaC0 3 or any combination thereof. The fillers can be employed in amounts suitably from zero to 50, more suitably from 1 to 25, most suitably from 2 to 10 percent by weight based upon the weight of the mesogenic thermoset resin plus any curing agent and/or curing catalyst used. The following examples are illustrative of the present invention, but are not to be construed as to limiting its scope in any manner. EXAMPLE 1 A. Synthesis of 4,4'-Dihvdroxy-alpha-methylstilbene Phenol (752.8 grams, 8.0 moles), chloroacetone (384.77 grams, 4.0 moles as chloroacetone) and methylene chloride (600 grams) were added to a reactor and cooled to - 10 C C with stirring under a nitrogen atmosphere. The chloroacetone used was a commercial grade containing 96.25% chloroacetone, 0.05% acetone, 3.05% 1,1-dichloroacetone and 0.60% mesityl oxide. Concentrated sulfuric acid (392.32 grams, 4.0 moles) was added dropwise to the stirred solution over a forty minute period and so as to maintain the reaction temperature between -11°C and -9°C. After 150 minutes of post reaction between a -11°C to - 9°C temperature range, the viscous, orange colored oil product was mixed with iced deionized water (1000 milliliters). The oil product was separated then washed with a second portion (1000 milliliters) and then a third portion (1000 milliliters) of deionized water. After separation, the recovered oil product was added to a pair of 2 liter beakers along with ethanol (250 milliliters) and stirred to provide solutions. Deionized water (250 milliliters) was added to the stirred solutions and heating commences. As the temperature of the mixture increased, the stirred mixture began to clear. Each time clearing was observed, sufficient deionized water was added to induce cloudiness, followed by continuation of the mixing and heating. Once the temperature reached 90°C , a massive precipitation of white crystalline plates occured and was followed by immediate coalesence of the precipitated product to an oil. The oil layer was recovered by decantation of the water layer and ethanol (250 milliliters) was added. Deionized water was again added to the stirred solutions as heating commenced, in an amount sufficient to induce cloudiness each time clearing was observed. Once the temperature reached 70 C C , a massive precipitation of white crystalline plates again occured. At this time, stirring was stopped, sufficient deionized water was added to fill both of the beakers and the crystalline slurries were chilled to 4°C and held therein for 16 hours. The crystalline product was recovered by filtration of the chilled crystalline slurries, added to a beaker along with deionized water (1000 milliliters), then stirred with heating to 100°C . After maintaining the stirred slurry at 100°C for thirty minutes, the crystalline product was recovered by filtration then again combined with deionized water (1000 milliliters) and stirred with heating to 100°C . The crystalline product was recovered by filtration then dried in a vacuum oven at 100 C C and 5mm Hg to a constant weight of 478.8 grams. Proton magnetic resonance spectroscopy and infrared spectrophotometric analysis confirmed the product structure. B. Epoxidation of 4,4'-dihvdroxy-alpha-methylstilbene 4,4'-Dihydroxy-alpha-methylstilbene (452.58 grams, 4.0 hydroxyl equivalents) prepared using the method delineated in A above, epichlorohydrin (1850.6 grams, 20.0 moles), deionized water (160.9 grams, 8.0 percent by weight of the epichlorohydrin used) and isopropanol (996.5 grams, 35 percent by weight of the epichlorohydrin used) were added to a reactor and heated to 50°C with stirring under a nitrogen atmosphere. Once the 50°C reaction temperature was achieved, sodium hydroxide (144.0 grams, 3.60 moles) dissolved in deionized water (576 grams) was added dropwise to the reactor over a 45 minute period and so as to induce an exothermic increase in temperature to 59°C , with subsequent maintenance of the temperature at 55 C C . Ten minutes after completion of the aqueous sodium hydroxide addition, the stirring was stopped and the aqueous layer which separated from the reaction mixture was pipetted off and discarded. Stirring resumed and after a total of twenty minutes following completion of the initial aqueous sodium hydroxide addition, a second solution of sodium hydroxide (64.0 grams, 1.60 moles) dissolved in deionized water (256.0 grams) was added to the reactor over a twenty minute period with maintenance of the 55°C reaction temperature. Fifteen minutes after completion of the aqueous sodium hydroxide addition, the recovered reaction mixture was added to a separatory funnel and washed with 1500 milliliters of deionized water. The separated organic layer was washed a second time (1500 milliliters deionized water), recovered and then rotary evaporated under vacuum to final conditions of 150°C and 1mm Hg for 120 minutes. The product was recovered (651.0 grams) as an off-white, crystalline solid having an epoxide equivalent weight (EEW) of 180.51. C. Characterization of the Diglycidyl Ether of 4,4'-Dihvdroxy-alpha-methylstilbene for Liguid Crystallinity Analysis of the diglycidyl ether from B above via crosspolarized light microscopy was completed using a microscope equipped with a programmable hot stage using a heating rate of 10°C per minute. The results are reported in Table 1. Table I The diglycidyl ether was a monotropic liquid crystal with a nematic texture observed in the microscopic analysis. D. Preparation of Unidirectional Graphite Prepreq Tape Based on the Diglycidyl Ether of 4,4'-Dihvdroxy-alpha-methylstilbene and Sulfanilamide A portion (500.0 grams) of the diglycidyl ether of 4,4'-dihydroxy-alpha- methylstilbene from B above was transferred to a metal container and then placed in an oven which was preheated to 160°C . After melt of the resin was complete, the metal container was removed from the oven and placed in a heating mantle where heating at 150°C was maintained. At a resin temperature of 150°C , sulfanilamide (119.2 grams) was added and dissolved in the resin with continuous stirring and maintenance of the 150°C temperature. Once a homogeneous blend of resin and sulfanilamide was obtained, it was cooled to 90°C by removing the metal container from the heating mantle then partially submerging it into an ambient temperature (23°C) water bath. The resin blend, which was a translucent liquid at this stage of cure, was next transferred to a machine designed for preparing unidirectional graphite prepreg. The operating conditions for the prepreg machine were a nip temperature of 92°C and a platen temperature of 139°C . The unidirectional graphite fiber used to prepare the tape was T-650/ 42 12K (unsized) manufactured by Amoco Performance Products, Inc The unidirectional graphite tape obtained (1.05 feet x 42 feet) contained an average of 30.6 weight percent of the diglycidyl ether of 4,4'-dihydroxy-alpha-methylstilbene/ sulfanilamide resin. This prepreg was collected between release paper on a cardboard roll and then stored at 0°F before use in the preparation of composite panels. E. Microscopic Observations for the Diglycidyl Ether of 4,4'-Di hyd roxy-alpha- methylstilbene and Sulfanilamide During Cure to Determine the Susceptibility to Shear Induced Orientation A portion (4.7970 grams) of the diglycidyl ether of 4,4-dihydroxy-alpha- methylstilbene from B above was placed in an oven preheated to 150°C . After melt of the resin was complete sulfanilamide (1.1441 grams) was added to the resin and the mixture was stirred periodically. After eighteen minutes, all of the sulfanilamide was dissolved, then the o homogeneous resin blend was removed from the oven and cooled to room temperature (23°C). A sample of the resin and curing agent blend was placed between two glass slides and then inserted into a hot stage preheated to 129.4°C . The blend on the hot stage was viewed with an optical microscope at 70X magnification using a crosspolarized light source. After placing the blend on the hot stage, a non-birefringent, translucent liquid was observed. On holding at 5 129.4°C , a birefringent phase was produced after 23 minutes. With continued heating at 129.4°C , the birefringent phase increased and liquid crystal textures were observed. After forty five minutes at 129.4°C , shear was applied to the resin by moving the top glass slide in one direction while holding the bottom glass slide stationary. After this application of shear, unidirectional orientation of the liquid crystal domains was observed. 0 - Fabrication of Oriented Composite from Unidirectional Graphite Prepreg Tape A composite was prepared by hand layup of eight plies of unidirectional graphite prepreg tape from D above into a 12 inch by 12 inch square. The square layup was then bagged in a vacuum system for processing in an autoclave. The configuration for the vacuum bag layup thus prepared consisted of the layup sandwiched between fluoro release film and maintained 5 therein with a tacky tape dam, followed by sandwiching between layers of textured release ply. On top of the layer of textured release ply designated to be the top of the assembly was laid a caul plate, followed by a breather followed by the outer nylon bagging. Under the layer of textured release ply designated to be the bottom of the assembly was the outer nylon bagging. A bleeder was positioned at the junction of the bottom fluoro release film and textured release 0 'y layers. The vacuum bagged composite was processed and cured in an autoclave using the following parameters in the order delineated: 5 20 The 45 minutes of hold time at 248°F (120°C) was a minimum time for this particular curable resin to achieve adequate liquid crystallinity for subsequent orientation by shear stresses caused by forcing flow into the interstices between the graphite fibers. G. Mechanical Property Testing 25 Flexural properties of test pieces prepared from the composite prepared in F above were determined using an Instron machine and standard test methods (ASTM D 790). The test pieces prepared from the composite were obtained from the longitudinal (fiber) direction and from the transverse (perpendicular to fiber) direction. The results are given in Table II. 30 COMPARATIVE EXPERIMENT A Fabrication of Composite from Unidirectional Graphite Prepreg Tape Possessing Minimum Orientation Composite was prepared by hand layup using the method and materials of Example 1-F. The vacuum bagged composite was processed and cured in an autoclave using 35 the following parameters in the order delineated: Flexural properties of test pieces prepared from the composite were determined using the method of Example 1-F. The test pieces prepared from the composite were obtained from the longitudinal (fiber) direction and from the transverse (perpendicular to fiber) 25 direction. The results are given in Table II. TABLE I I

Claims: CLAIMS: 1. A method for forming a continuous fiber reinforced oriented mesogen- containing resin matrix composite which method comprises 5 (A) saturating a continuous fiber substrate material with a curable composition comprising (1) at least one mesogen-containing resin which contains an average of more than one vicinal epoxide group, thiirane group, cyanate group or vinyl ester group per molecule; and, optionally 10 (2) a curing amount of at least one curing agent and/or curing catalyst therefor; (B) arranging one or more saturated continuous fiber substrate materials formed in step (A) into a desired configuration; (C) heating the arranged saturated continuous fiber substrate material(s) from 15 step (B) to a temperature which causes the mesogen-containing resin to convert to a liquid crystalline state; (D) subjecting the heated arranged saturated continuous fiber substrate material(s) from step (C) to a pressure sufficient to cause flow induced shear in the interstices of said continuous fiber substrate; 20 (E) subjecting the continuous fiber substrate material(s) of step (D) to curing conditions either simultaneously with the application of pressure in step (D) and/or subsequent to said application of pressure; and (F) permitting the cured continuous fiber reinforced composite of step (E) to cool to room temperature; 25 thereby forming a cured continuous fiber reinforced composite containing an oriented mesogen-containing resin matrix. 2. A method of Claim 1 wherein component (Al) is a mesogen-containing resin which contains an average of more than one vicinal epoxide or thiirane group per molecule; step (C) is conducted at a temperature of from 20°C to 260°C, preferably from 60°C to 30 240°C, most preferably from 80°C to 200°C; and step (D) is conducted at a pressure of from 0 to 10,000, preferably from 1 to 1000, more preferably from 5 to 100, psig. 3. A method of Claim 2 wherein component (A1) is a mesogen-containing resin which contains an average of more than one vicinal epoxide or thiirane group per molecule represented by the Formulas I, II or III; 35 Formula I DI D2-Y-Aπ— (Y-An)pi-Y M-CH2-C-CH 2 -M-Y-An— (Y-An)pi- >p- D2 Rl Formula II Di D2-Y-A n - — M-CH2-C-CH 2 -M-Y-A n -Y- p — D2 I I Rl •P* I Formula I wherein each Y is independently )3 (R)ιo (R)4 Dis -0-or-S-;D1 is-OHor-SH; D2is D / \ H2C C-CH2-M- R1 each M is independently (a) -0-, -S-, -NR2-, or -CO-O- where the single bonded oxygen atom attached to the carbon atom of -CO-O- is attached to the -CH2- — CH2 group, or (b) * » -CO-O— - (CHRa-CHRa-0 where a single bonded oxygen atom is attached to the CH 2 - — CH 2 group : Rl each Ra is independently hydrogen or an alkyl or haloalkyi group containing from 1 to 2 carbon atoms with the proviso that only one Ra group can be a haloalkyi group; m has a value from 1 to 100; each A is independently a direct single bond, -CR1 = CR1-, -C ≡ C-, -N = N-, -CRI = N-, -0-CO-, -NR1-CO-, -CRi = N-N = CR 1 -, -CR1 = CR1-CO-, -N=CR1-, -CO-O-, -CO-NR*-, -CO-CR1 = CR 1 -, -CO-0-N =CRi-, -CR1 =N-0-OC-, -CO-NR1-NR1-OC-, -CR1 = CR1-0-OC-, -CO-0-CR1 = CRi-, -0-OC-CR1 = CR1-, -CR1 = CR1-CO-0-, -CHRi-0-CO-CRi =CR1-, -CRi =CRi-CO-0-CHRi-, -CHR1-CO-0-CR1 =CR1-, -CRi =CRi-0-CO-CHRi-, -CO-S-, -S-OC-, -CH 2 -CH 2 -CO-0-, -0-OC-CH 2 -CH 2 -, -C = C-C s C-, -CR1 = CR1-CR1 = CR1-. N _ N -< </ \ 0 N~ N Cl -CR1=C- (Al) ■ n (Al)n- • -(Al) I £ I (Al)n- ' -(Al) (Al)n- ' 0 CN T -CH = N- -CRl=C- each A' is independently a divalent hydrocarbyl group having from 1 to 10 carbon atoms and can contain an N, O or S heteroatom; each A 1 is independently a 0 0 0 0 I I I I I I II -C- , -0-C- , -C-0- , -C-NRl- , 0 I I or -NR1-C- group ; each R is independently hydrogen or a hydrocarbyl or hydrocarbyloxy group having from 1 to 10 carbon atoms, a halogen atom, preferably chlorine or bromine, a nitro group, a nitrile group, a phenyl group or a -CO-R1 group; each R1 is independently hydrogen or a hydrocarbyl group having 1 to 3 carbon atoms; each R 2 is independently a hydrocarbyl group having from 1 to 6 carbon atoms; z has a value of one or two; n has a value of zero or one; p has a value from zero to 30; and p1 has a value from 1 to 30; and the aromatic rings or the A' group in Formula III can also contain one or more heteroatoms selected from N, O, or S, with the proviso that at least 80 percent of the molecules are para substituted by both the bridging groups (-A-) and the substituent containing the epoxide or thiirane groups as well as the substituent containing a secondary hydroxyl or thiol alkylidene group(s) which are present when p has a value greater than zero. 4. A method of Claim 3 wherein (a) component (A1) is the diglycidyl ether of 4,4'-dihydroxy-alpha-methylstilbene or a blend of the diglycidyl ether of dihydroxy-alpha-methylstilbene and the diglycidyl ether of 4,4'-isopropylidenediphenol; and (b) component (A2) is sulfanilamide, a substituted sulfanilamide, or any combination thereof. 5. The continuous fiber reinforced oriented mesogen containing resin matrix composite product produced by the method of any one of Claims 1, 2, 3 or 4.

Inventors: EARLS JIMMY D, HEFNER ROBERT E JR, JONES ROBERT E JR, EARLS, JIMMY, D., HEFNER, ROBERT, E., JR., JONES, ROBERT, E., JR.
Applicants: DOW CHEMICAL CO, THE DOW CHEMICAL COMPANY
Application year: 1993
Main classification: C08J5
IPC codes: C07D303, C08G59, C08J5, C09K19