Process for forming implanted regions with lowered channeling risk on semiconductors

Abstract: A process for forming implanted regions with lowered channelling risk on semiconductors, wherein the semiconductor devices include at least one layer of polycrystalline silicon (7) which covers all isolation regions (5) and active areas (4) which are liable to a channelling phenomena and wherein the process includes masking (10) the areas or regions to be implanted on the polycrystalline layer, implanting a first dopant species having a high atomic weight to amorphize the polycrystalline silicon in any unmasked areas (12), removing the masking layer, and implanting a second dopant species over the entire semiconductor.

Description: 1. Field of the Invention This invention relates to a process for forming implanted regions with lowered channelling risk on semiconductors. More specifically, the invention concerns a process applied to semiconductor electronic devices having at least one layer of polycrystalline silicon which covers both isolation regions and active areas liable to channelling phenomena. In particular the process relates to the formation of resistors in doped polycrystalline silicon. 2. Discussion of the Related Art As is well known, in the manufacture of several semiconductor electronic devices, and specifically the manufacture of static random access memories (SRAMs), ample recourse is made to ion implantation techniques for doping both buried regions of the semiconductor and thin polycrystalline layers. Such is the case, for instance, with the formation of resistors in thin polysilicon films covering active areas and/or isolation regions of a SRAM storage cell. These resistors are generally formed by implantation in the polycrystalline layer covering the so-called field oxide regions which are located at the boundaries of the active channel region of a field-effect transistor constituting said storage cell. Normally, such resistors are formed by implanting boron ions in the thin polycrystalline film. However, during the implantation step, there may occur a so-called channelling phenomena, wherein some ions are channelled along preferential directions defined by the crystalline nature of the film and which penetrate the semiconductor as far as the substrate underlies the polycrystalline layer, thereby altering the electric characteristics of the device. The extent of the channelling phenomenon is tied to various parameters, such as the thickness of the thin film, atomic species implanted, implanting power, and the like. Boron is, in fact, one of the atomic species which is most susceptible to the channelling phenomenon. In many cases, the phenomenon is enhanced by the size of the grains which make up the thin polycrystalline layer. The size of these grains is generally of a comparable order to the layer thickness dimension. As an example, note that channelling phenomena have been detected in a substrate with boron implantations performed at 25 keV on polycrystalline silicon 2000-Angstrom thick. To obviate this serious drawback, the prior art has proposed a first method which consists of implanting different species effective to make the polycrystalline layer somehow "amorphous", thereby reducing the proportion of dopant affected by the channelling phenomenon. It has been found, for instance, that an implantation of boron fluoride (BF2) can achieve a dual goal. It quickly amorphizes the polysilicon and attenuates the channelling risk by resisting migration of the boron ions, and it still allows the resistor implantation. An example of this prior art method is disclosed in the European Patent Application No. 0 524 025 wherein in a layer of amorphous silicon or polysilicon BF 2 is implanted. However, this prior art method has a drawback in that fluorine ions which are left in the polycrystalline layer harm the electrical characteristics of the resistors formed therein. A second prior art proposed method requires an oxidation of the polycrystalline silicon before the resistors are implanted. In fact, the oxide layer can effectively oppose the travel of the ions which are penetrating the substrate by channelling. It will be appreciated, however, that this second proposed method introduces an additional process step, resulting in a more costly process of manufacture of the corresponding devices. Another proposed method could be that of masking the areas of the device which are not to be implanted by the resistor implantation step, using a photoresist. However, this method would also introduce a cost-intensive additional step in the manufacturing process. Accordingly, it is an object of this invention to provide a process for forming implanted regions with low channelling risk, wherein the process includes peculiar functional features to effectively overcome the above-mentioned drawbacks associated with the prior art methods. SUMMARY OF THE INVENTION The present invention comprises a method of manufacturing semiconductor devices by providing a selective polysilicon pre-amorphizing layer limited to specific areas of the semiconductor device as defined in method claim 1. The features and advantages of a process according to the invention will become apparent from the following description of an embodiment thereof, given by way of example and not of limitation with reference to the steps of making a semiconductor electronic device as illustrated by the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS In the drawings: Figures 1 to 4 are cross sectional views of a semiconductor device showing, the semiconductor electronic device being subjected to various steps of the process according to this invention; Figure 5 is an enlarged view, of the device as shown in Figure 4; and. Figure 6 is another view of the device as shown in Figures 1 to 4, showing a final implementation step of the process according to the present invention. DETAILED DESCRIPTION With reference to Figure 1, generally and schematically shown at 1 is a semiconductor electronic device formed on a monocrystalline silicon substrate or wafer 2. In this specific case, the device 1 is a field-effect transistor intended for forming a static random access storage cell, e.g. of the type known as SRAM (Static Random Access Memory). The transistor 1 is formed on an N doped epitaxial layer 3 which covers the substrate 2. A channel region 4 is defined in the epitaxial layer 3 and is limited by opposite isolation regions 5 comprising so-called field oxide. Understandably, the transistor 1 also includes so-called drain and source active areas, not shown because these would only be visible in a different vertical cross-section plane from that shown in Figures 1 to 6. Referring to Figure 2, a thin layer of gate oxide 6 is grown on the channel region 4, to a thickness within the range of 100 to 200 Angstroms (10 to 20nm). The process according to this invention (10 to 20nm) provides, at this point, a channel region 4 implanting step. This is a conventional step which is carried out using a dopant 9 of the N type, e. g. , phosphorous. Referring to Figure 3, the basic structure described thus far is covered with a polycrystalline silicon layer 7 having a thickness of few thousands of Angstroms, e. g. 2000 Angstroms (200nm). Above the channel region 4, this polycrystalline layer 7 provides the gate terminal for the transistor 1. More particularly, and depending on the processes used to manufacture SRAM storage devices, the polycrystalline layer 7 may serve various functions. It is worth noting, for example, that the areas overlying the gate oxide 6 are usually intended for forming the gate electrode, and the areas overlying the field oxide 5 for forming resistors, while other regions overlying active areas may be used to establish local interconnections. Referring to Fig. 4, the process according to the present invention now provides for the step of ion implantation of predetermined areas 8 of the polycrystalline layer 7 overlying the field oxide 5. Such areas are intended for forming P-doped resistors. This is accomplished by first placing a masking layer over the areas 8 in which said resistors are to be formed. Masking these areas may be performed conventionally by means of a photoresist layer. Subsequently, in accordance with the present invention, a heavy implantation of the unmasked areas is performed using a dopant species 11 of the N type which has a high atomic weight, such as arsenic or phosphorous. Preferably, the implant dosage is selected to be in a range between 1X1015 and 1X1016 ions/cm2. However, an implant dosage at higher or different concentrations is also contemplated by the present invention, e. g. in the range 5X1014 to 1X1016 ions/cm2. Referring to Figure 5, this heavy implantation step causes the polycrystalline layer 7 which overlies the channel region 4 of the device 1 and is unprotected by the photoresist 10 to become amorphous. Thus, in essence, an amorphized zone 12 is provided in the polycrystalline layer 7 directly over the channel region 4. This implantation step also enables the gate region of the device 1 to be doped. Accordingly, the process of this invention will keep the number of the steps required to form the storage cell in MOS technology unaltered. Thus, the present invention method is more economical than the prior art methods. The final step of the process according to the present invention is a step of doping the resistors 8 by implantation as shown in Figure 6. However, this step is preceded by removal of the photoresist 10 which protected the areas reserved for such resistors. The doping step is carried out using a medium or low dosage of a dopant 13 of the P type, such as boron. Preferably, the implant dosage is selected between 1X1012 and 1X1015 ions/cm2. The dopant is applied across the entire wafer using no masking step. Basically, the two last-named steps of the inventive process will provide, first, selective pre-amorphization of just those areas which might be affected by the channelling phenomenon, and then controlled implantation of the polycrystalline layer for forming the resistors. It should be pointed out that the pre-amorphization of the polycrystalline layer is only performed in zones overlying active areas, where the channelling phenomenon could cause harm. The process of this invention does solve the technical problems associated with the prior art methods and also affords a number of advantages. For example, the channelling risk during resistor implantation is minimized, without burdening the process with additional steps. In addition, the process according to the present invention avoids the introduction in the semiconductor device of atomic species which are not strictly required for making the various discrete active areas. Of course, the process of this invention may be changed and modified within the scope of protection contemplated by this invention.In particular, the atomic species utilized in the two discrete implantation steps could be phosphorous and antimony. Having thus described one particular embodiment of the invention, various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention. Accordingly, the foregoing description is by way of example only and is not intended as limiting.

Claims: A process for forming implanted regions with lowered channelling risk in a polycrystalline silicon layer on semiconductor electronic devices, wherein said semiconductor electronic devices comprise isolation region (5), active areas (4) and at least one layer (7) of polycrystalline silicon which covers both isolation regions (5) and active areas (4), said active areas (4) being liable to channelling phenomena, characterized in that it comprises the following sequential steps: masking (10) the portions (8) of said polycrystalline silicon layer (7) covering said isolation regions (5), said active areas liable to channelling staying unmasked; implanting a first dopant species (11) having polycrystalline silicon amorphizing properties, to an amorphizing thresold of the polycrystalline silicon in unmasked areas thereof; and removing the mask and implanting a second dopant species (13), of an opposite type with respect to the first dopant species, across the entire wafer. A process according to Claim 1, characterized in that said first implanting step is carried out using a dopant of the N type. A process according to Claim 1, characterized in that said second implanting step is carried out using a dopant of the P type. A process according to Claim 1, characterized in that the implant dosage for said first implanting step lies within the 5E14 to 1E16 ions/cm2 range. A process according to Claim 1, characterized in that the implant dosage for said second implanting step lies within the 1E12 to 1E15 range. A process according to Claim 1, characterized in that said masking is performed using a photoresist (10). A process according to Claim 2, characterized in that said first implanting step is carried out using arsenic, phosphorus, antimony ions. A process according to Claim 3, characterized in that said second implanting step is carried out using boron ions.

Inventors: ZACCHERINI CHIARA, ZACCHERINI, CHIARA
Applicants: ST MICROELECTRONICS SRL, STMICROELECTRONICS S.R.L.
Application year: 1993
Main classification: H01L21
IPC codes: H01L21, H01L27