Housing for electronic equipment made of a polyamide resin composition

Abstract: A polyamide resin composition comprising 100 parts by weight of a resin composition comprised of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

Description: The present invention relates to a housing for electronic equipment made of a polyamide resin composition. More particularly, but not exclusively, the present invention is concerned with a light-weight housing for electronic equipment, such as personal computers and word processors, produced by moulding a polyamide resin composition which comprises an aromatic polyamide resin, a modified polyphenylene ether resin, a liquid-crystalline polymer, a compatibilizing agent and, as an inorganic filler, a carbon fibre, mica, glass flake, and which has excellent water resistance, chemical resistance, mechanical properties, fluidity during moulding and rigidity, and is less liable to cause warpage. At the present time, there is an ever-increasing demand for the size and weight of electronic equipment, such as domestic electric appliances, telephones and OA equipment, to be reduced and the use of plastics for the housings of this equipment has been studied in the art. In particular, note book size personal computers and word processors among the above-described types of portable OA equipment are required to have a reduced size and weight due to an increase in the range of use thereof. This has caused the material used in such portable equipment to change from metals to plastics. However, the plastics currently used in the art cannot attain a satisfactory weight reduction and therefore a further reduction in weight is desired. ABS resins, AS resins, polycarbonate resins, modified polyphenylene ether resins, etc., have hitherto been studied as plastics for use in such a housing and have good mouldability, a low cost and a good appearance in the finished article. However, they do not provide satisfactory rigidity and therefore no housing suitable for practical use has been provided. Further, in a housing for portable electronic equipment, the plate thickness should be as small as possible, and a housing having a plate thickness of 3 to 5 mm and about 2 mm for a thin plate has been put to practical use. The reduction in plate thickness to 2 mm or less leads to the following problems. (a) Rigidity Since the conventional resins, such as ABS resin, have a low rigidity, if they are moulded into articles having a small plate thickness, the moulded articles become greatly deformed when exposed to a small external force. Thus they cannot protect the contents of the housing, such as liquid crystal display panels, printed circuit boards and keyboards. (b) Fluidity during Moulding When a housing having a small thickness and a large area is moulded, the resin is rapidly cooled in the mould, which increases the viscosity of the resin. This often causes the flow of the resin to stop, so that short moulding occurs. (c) Warpage Even though short moulding does not occur, the incorporation of a fibrous filler for the purpose of increasing the strength in addition to moulding under high pressure gives rise to warpage due to the anisotropy of mould shrinkage derived from the orientation of the fibre. (d) Impact Strength In moulded articles having a small plate thickness, an increase in the rigidity of the material for the purpose of preventing deformation generally lowers the impact strength. In portable electronic equipment, such as note book size personal computers and word processors, there are occasions where accidental dropping occurs which often gives rise to grazing, cracking, etc. of the housing. Since the specific gravity of the plastics is generally in the range of from 0.9 to 2.0, a further reduction in weight through a reduction in the specific gravity cannot be expected. Therefore a reduction in the plate thickness of the housing is necessary to achieve a further reduction in weight. However, the moulding of the conventional resin composition into a housing having a plate thickness of 2.0 mm or less leads to the above-described problems. Japanese Unexamined Patent Publication (Kokai) No. 4-154864 discloses a polyamide resin composition comprising a polyamide resin, a modified polyphenylene ether resin, carbon fibre and mica. The composition is described as a material for a housing having a small plate thickness for portable equipment capable of overcoming the above-described problems of the prior art. However, when an article having a very small thickness of about 1 mm is to be moulded, it is necessary to set the moulding (resin) temperature at a high value close to the decomposition temperature of the resin, to provide many gates or to increase the runner diameter for the purpose of providing fluidity. This unfavourably gives rise to the occurrence of deterioration in the resin and defects of gas accumulation in the moulded article. This has an adverse effect on the moulded article and increases defective mouldings and, hence, leads to an increase in the cost. Moreover, in the moulding of a moulded article having a very small thickness, since the injection pressure is higher than usual, warpage is liable to occur. On the other hand, liquid-crystalline polymers (thermotropic liquid-crystalline polymers) have a rigid molecular structure, form a liquid crystal in a molten state, are easily orientated by the shear force applied during moulding, exhibit a good fluidity during moulding and can provide moulded articles which have a high strength, a high flexural strength, a high modulus of elasticity, an excellent impact resistance and a small coefficient of linear expansion. An attempt has been made to modify non-liquid-crystalline polymers by taking advantage of the above-described properties of liquid-crystalline polymers by blending a liquid-crystalline polymer with a non-liquid-crystalline polymer. For example, in Polymer Engineering & Science, 27, p. 410 (1987), C. Kiss et al. report that blending of a liquid-crystalline polymer with conventional engineering plastics followed by moulding causes the liquid-crystalline polymer to be dispersed in a fibril form in the non-liquid-crystalline polymer and the modulus of elasticity to be improved by virtue of the reinforcing effect of the liquid-crystalline polymer. In Plastic Engineering, p. 39 (1987), T.S. Chung reports that blending a liquid-crystalline polymer with nylon 12 followed by moulding provides a moulded article having a small coefficient of linear expansion. Further, Japanese Unexamined Patent Publication (Kokai) No. 56-115357 discloses that fluidity can be improved by blending a liquid-crystalline polymer with a non-liquid-crystalline polymer. However, no attempt has been made to provide a housing for electronic equipment, such as personal computers and word processors, which is less susceptible to the warpage often caused in moulding an article having a small thickness, by enabling the moulding resin temperature and the filling pressure during moulding to be lowered by blending a liquid-crystalline polymer and a compatibilizing agent with a resin composition comprising a polyamide resin containing a m-xylylene group, a modified polyphenylene ether resin, a carbon fibre, mica, a glass flake, etc. Embodiments of the present invention aim to overcome the above-described drawbacks of the prior art and to provide a housing having an average plate thickness of 2 mm for use in electronic equipment, such as personal computers and word processors, comprising a moulded product of a resin composition that is excellent in water resistance, chemical resistance, fluidity during moulding, mechanical properties and rigidity and is less liable to cause warpage. According to the present invention, there is provided a housing for electronic equipment having an average plate thickness of 2 mm or less and comprising a molded product of a polyamide resin composition which comprises: (a) 100 parts by weight of a resin composition comprised of 20 to 80% by weight of an m-xylylene group-containing polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin obtainable by reacting a polyphenylene ether resin with an unsaturated aliphatic carboxylic acid or its acid anhydride, the total amount in wt% of the aromatic polyamide resin and the modified polyphenylene ether resin being 100 wt%; (b) 0.5 to 30 parts by weight of a liquid crystalline copolyester polymer having a melting point of 200 to 300°C; (c) 0.01 to 3 parts by weight of phenylenebisoxazoline; and (d) 2 to 40 parts by weight of carbon fibre and mica or glass flake. As a result of extensive and intensive studies, the present inventors have found that a housing for electronic equipment having an average plate thickness of 2 mm or less can be provided from a moulding resin composition. The housing has well-balanced properties, that is, even with a small plate thickness, it has excellent chemical resistance, mechanical properties and rigidity and is less likely to warp. The polyamide resin containing an m-xylylene group (hereinafter referred to as "MX nylon") is advantageous from the viewpoint of a balance of the mouldability, properties, etc. MX nylon is a polyamide resin synthesized by polycondensing m-xylylenediamine or a diamine mixture comprising 60% by weight or more of m-xylylenediamine and 40% by weight or less of p-xylylenediamine with an α,ω-straight-chain aliphatic dibasic acid having 6 to 12 carbon atoms, for example, adipic acid, sebacic acid, suberic acid, undecanoic acid or dodecanoic diacid. Among MX nylons, those synthesized by using adipic acid are particularly favourable from the viewpoint of a balance of mouldability, properties, etc. The polyphenylene ether resin used to form the modified polyphenylene ether resin preferably has in its main chain a structural unit represented by the following general formula: wherein R 1 represents a lower alkyl group having 1 to 3 carbon atoms and R 2 and R 3 represent a hydrogen atom or a lower alkyl group having 1 to 3 carbon atoms. The polyphenylene ether resin may be a homopolymer copolymer or a graft polymer. Specific examples of the polyphenylene ether resin include poly(2,6-dimethyl-1,4-phenylene)ether, poly(2,6-diethyl-1,4-phenylene)ether, poly(2,6-dipropyl-1,4-phenylene)ether, poly(2-methyl-6-ethyl-1,4-phenylene)ether and poly(2-methyl-6-propyl-1,4-phenylene)ether, and poly(2,6-dimethyl-1,4-phenylene)ether and 2,6-dimethylphenol and 2,3,6 trimethylphenol copolymers, and graft polymers comprising these polymers and styrene grafted thereon are particularly preferred. The modified polyphenylene ether resin is produced by reacting a polyphenylene ether resin and an unsaturated aliphatic carboxylic acid or its acid anhydride with each other in a melt-mixed state in the absence of a catalyst, or by reacting a polyphenylene ether resin with an unsaturated aliphatic carboxylic acid or its acid anhydride in the presence of a catalyst. When an acid anhydride of an unsaturated aliphatic carboxylic acid is used for modification of the polyphenylene ether resin, the acid anhydride of the unsaturated aliphatic carboxylic acid and the polyphenylene ether resin are reacted together in a melt-mixed state in the absence of a catalyst to provide a modified polyphenylene ether resin. In this case, although there is no particular limitation on the melt mixing method and use may be made of a kneader, a banbury mixer, an extruder, etc., the use of an extruder is preferred from the viewpoint of the operation. Examples of the acid anhydride of the unsaturated aliphatic carboxylic acid include maleic anhydride, itaconic anhydride and citraconic anhydride. Maleic anhydride is particularly preferred. The proportion of the above-described acid anhydride necessary for the modification of the polyphenylene ether resin is 0.01 to 10 parts by weight, preferably 0.1 to 1 part by weight, based on 100 parts by weight of the polyphenylene ether resin. When the proportion of the above-described acid anhydride is less than 0.01 part by weight based on 100 parts of the polyphenylene ether resin, the improvement of the compatibility of the polyphenylene ether resin with the polyamide resin is so small that it is difficult to provide a tough composition. On the other hand, when the proportion of the acid anhydride is 10 parts by weight or more based on 100 parts by weight of the polyphenylene ether resin, excess acid anhydride is heat-decomposed, which gives rise to problems from a practical viewpoint, such as a lowering in heat resistance and poor appearance. When an unsaturated aliphatic carboxylic acid is used for modification of the polyphenylene ether resin, if necessary, radical generators, such as benzoyl epoxide and dicumyl peroxide, may be used as a catalyst. The proportion of the modified polyphenylene ether resin is 80 to 20% by weight in comparison with 20 to 80% by weight of the polyamide resin mixture. This is because, when the proportion of modified polyphenylene ether resin exceeds 80 parts by weight in comparison with 20 parts by weight of polyamide resin mixture, the fluidity is so poor that the mouldability becomes lower. On the other hand, when the proportion of modified polyphenylene ether resin is less than 20 parts by weight in comparison with 80 parts by weight of polyamide resin mixture, the mould shrinkage derived from the crystallinity of the polyamide resin becomes so large that the warpage of the moulded article cannot be sufficiently alleviated. Specific examples of the liquid-crystalline polymer used in the present invention include a copolyester comprising p-hydroxybenzoic acid and ethylene terephthalate, a copolyester comprising 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid, a copolyester comprising p-hydroxybenzoic acid, terephthalic acid and a dihydric phenol and a copolyester comprising phenylhydroquinone and styrohydroquinone. The liquid-crystalline polymers (thermotropic liquid-crystalline polymers) have a rigid molecular structure, form a liquid crystal in a molten state, are easily orientated by shear forces applied during moulding, exhibit a good fluidity during moulding and can provide moulded articles having a high strength, a high flexural strength, a high modulus of elasticity, an excellent impact resistance and a small coefficient of linear expansion. In the housing of the present invention, a liquid crystalline polymer is blended with a polyamide resin composition comprising a polyamide resin containing a m-xylylene group and a modified polyphenylene ether resin. Carbon fibre and mica or a glass flake is added thereto to provide a moulding resin composition having an improved fluidity which enables the moulding resin temperature and filling pressure to be lowered during moulding. Thus a housing can be provided which is less susceptible to warpage often caused during moulding of an article having a small thickness. The liquid-crystalline polymer has a melting point of 200 to 300°C. The reason for this is that the resin composition comprising a polyamide resin mixture and a modified polyphenylene ether resin has a melting point of about 240°C and no useful blend can be provided if the kneading temperature does not overlap with the moulding temperature. The amount of the liquid-crystalline polymer is in the range of from 0.5 to 30 parts by weight based on 100 parts by weight of the resin composition comprising a polyamide resin containing a m-xylylene group and a modified polyphenylene ether. The reason for this is as follows. When the amount of the liquid-crystalline polymer is 0.5 parts by weight or less, no significant improvement in the blend can be attained, so that the moulding resin temperature and filling pressure cannot be lowered, which makes it difficult to provide a moulded article less susceptible to warpage. On the other hand, when the amount of the liquid-crystalline polymer is 30 parts by weight or more, the orientation and anisotropy of the liquid-crystalline polymer per se become so large that problems of an increase in the warpage and a lowering in the strength of weld lines occur. When nylon and a liquid-crystalline polymer (LCP) are blended with each other, a reacting agent (a compatibilizing agent) is used to enhance the compatibility of both substances, which contributes to an improvement in the mechanical strength of the moulded article. Representative examples of a reacting agent for the LCP-nylon system known in the art include phenylenebisoxazoline (PBO) compounds described in Japanese Unexamined Patent Publication (Kokai) No. 3-215548. PBO is useful for LCP having a terminal carboxyl group (for example, LC-5000 manufactured by Unitika Ltd.). The above-described PBO is added in an amount of about 0.01 to 3 parts by weight, preferably 0.1 to 0.5 part by weight, based on 100 parts by weight of the resin. This is because when the amount is less than 0.01 parts by weight, no effect can be attained by the addition of the reacting agent, while when the amount of addition exceeds 3 parts by weight, the excessive amount of the reacting agent causes the viscosity to increase. In the resin composition of the present invention, 2 to 40 parts by weight of carbon fibre and mica or glass fibre, a glass bead, glass flake, and various minerals, are used as a reinforcing material. Carbon fibre reduces the weight and increases the strength, and scaly mica, a glass flake prevents warpage. The carbon fibre is not particularly limited as long as it can be used as a reinforcing material for the resin and may be either roving or chopped strands. In general, the carbon fibre preferably has a fibre length of 0.1 to 25 mm, preferably 1 to 6 mm, and an average fibre diameter of 7 to 20 µm. When the fibre length is excessively large, the degree of warpage deformation of the moulded article becomes large, while when the fibre length is small, the reinforcing effect for the strength and rigidity is poor. Although the above-described carbon fibre may have an untreated surface or a surface subjected to a treatment with a coupling agent, such as a silane coupling agent or a titanate coupling agent, a carbon fibre treated with a coupling agent is preferred. The carbon fibre may be any of a carbon fibre derived from PAN and a carbon fibre derived from pitch. The amount of carbon fibre is 2 to 30 parts by weight based on 100 parts by weight of the resin composition comprising a polyamide resin composition, a modified polyphenylene ether resin and a liquid-crystalline polymer. This is because, when the amount of carbon fibre is less than 2 parts by weight, the reinforcing effect for strength and rigidity is small, while when it exceeds 30 parts by weight, the production of the composition is hindered, so that the fluidity lowers during moulding, which makes it difficult to mould an article having a small plate thickness. Since the mica and glass flake used in the present invention are in the form of a foil or a scale, they are effective for preventing the warpage deformation of the moulded article and further effective for enhancing the rigidity of the material composition. The average particle diameter of the mica or glass flake used in embodiments of the present invention is 150µm or less, preferably 80µm or less. As with the carbon fibre, the mica or glass flake used in the present invention preferably has a surface subjected to a treatment with various coupling agents. The proportion of glass flake or carbon fibre is 2 to 30 parts by weight based on 100 parts by weight of the resin composition comprising a polyamide resin, a modified polyphenylene ether resin and a liquid-crystalline polymer. The reason for this is as follows. When the amount of mica or glass fibre is less than 2 parts by weight, neither the effect of improving rigidity nor the effect of preventing warpage can be attained. On the other hand, when it exceeds 30 parts by weight, fluidity during moulding becomes so low that it becomes difficult to mould an article having a small plate thickness. It is to be noted that the total amount of carbon fibre and mica or the total amount of carbon fibre and glass flake should not exceed 40 parts by weight. The specific gravity of the resin composition of the housing of the present invention is preferably 1.35 or less, preferably 1.30 or less and is used mainly for reducing the weight of the housing. When the specific gravity exceeds 1.35, the weight of the housing increases, which renders the resin composition unsuitable for practical use. The elastic modulus in flexure of the housing of the present invention is preferably 100,000 kgf/cm 2 or more, still preferably 120,000 kgf/cm 2 or more. When the elastic modulus in flexure is less than 100,000 kgf/cm 2 , the deflection of the housing under load becomes so large that it often becomes difficult to provide housing having a small plate thickness and a high strength. The fluidity of the resin composition used in the housing of the present invention is preferably 120 mm or more, more preferably 150 mm or more in terms of a bar flow length as measured at a resin temperature of 270°C, a mould temperature of 120°C and an injection pressure of 1600 kgf/cm 2 using a cavity having a depth of 1 mm and a width of 10 mm. When the bar flow length is smaller than 120 mm, short shot occurs or, even though the filling can be successfully conducted, the filling pressure becomes so high that the appearance of the moulded article becomes poor due to the occurrence of warpage or the like. This makes it difficult to effect moulding of an article having a reduced plate thickness and a reduced weight. In order to improve the impact resistance of the housing, the polyamide resin composition may incorporate a rubber component, such as a polybutadiene/styrene copolymer, a polybutadiene/acrylonitrile copolymer, a polybutadiene/acrylonitrile/styrene copolymer, a polystyrene/ethylene/butylene copolymer or an ethylene/propylene copolymer. Since, however, the addition of the rubber component lowers rigidity, the proportion of the rubber component is preferably up to 10 parts by weight, and more preferably up to 5 parts by weight, based on 100 parts by weight of the polyamide resin composition. Further, glass fibres, potassium titanate fibres or whiskers of zinc oxide may be incorporated into the polyamide resin composition. Since, however, the incorporation of these materials gives rise to an increase in the specific gravity, the tolerance of the materials is 10% by weight or less and the total amount of the inorganic fillers should not exceed 40% of the polyamide resin composition. Further, if necessary, various additives, for example, stabilizers, dyes, pigments, release materials, fillers and flame retardants, may be properly incorporated in the polyamide resin composition. The resin composition can be produced by melt-mixing using a conventional single-screw or twin-screw extruder. The housing of the present invention can be subjected to electroless plating by any conventional method used as a measure against EMI. Conventional materials for a housing having a small plate thickness suitable for portable equipment include aromatic polyamide/modified polyphenylene ether alloys. However, in order to mould a housing having a small plate thickness and a large area, the filling pressure and moulding resin temperature have to be increased forcibly to pour the resin into the mould. This has given rise to large problems such as short shot or warpage of the moulded article and a deterioration of the resin. However, in the housing of the present invention, a liquid-crystalline polymer is blended with an aromatic polyamide/modified polyphenylene ether system, and a compatibilizing agent, a carbon fibre, mica and a glass flake are further added thereto to improve the fluidity and other properties of the resin. This enables the resin temperature and filling pressure during moulding to be improved, so that it becomes possible to provide a housing less liable to cause warpage. Since this housing is characterized by a small plate thickness, a high strength and a less liability to cause warpage, it can be used as a housing for electronic equipment for personal computers, word processors, etc. A reduction in the size and weight of domestic electric appliances, toys, telephones and OA equipment can be attained by using the housing of the present invention. In particular, the plate thickness is reduced to 2.0 mm or less and can be reduced even further to 1 mm or less, which contributes to a significant reduction in the size and weight of the OA equipment, such as note book size and very small personal computers and word processors. EXAMPLES The present invention will now be described in more detail with reference to the following Examples and with reference to the accompanying drawings, in which: Fig. 1A is perspective view of an LCD cover prepared in certain examples; Fig. 1B is a cross-sectional view of a part of the LCD cover of Fig. 1A; Figs. 1C to 1E are precise rear, front and side views of the LCD cover, respectively; Fig. 2A is a perspective view of a bottom cover of a housing for a very small size personal computer prepared in other examples; Fig. 2B is a cross-sectional views of a part of the housing of Fig. 2A; Figs. 2C and 2D are precise top and cross-sectional views of the housing, respectively; Fig. 3 is an example of the results of measurement of warpage of the moulded article; and Fig. 4 is a thermogravimetric curve of a polyamide resin composition. The following methods were used for evaluation. (1) Specific gravity: ASTM D792 (2) Flexural strength: ASTM D790 (3) Elastic modulus in flexure: ASTM D790 (4) Izod impact strength: ASTM D256 (1/4 in., notched) (5) Heat distortion temperature: ASTM D648 (6) Flow length: The fluidity (bar flow length) was measured by moulding using a mould (temperature: 120°C) having a width of 10 mm and a thickness of mm under an injection pressure of 1600 kgf/cm 2 . (7) Mouldability: A cover moulding for the liquid crystal display portion (hereinafter referred to as the "LCD cover") of a note book size personal computer, as shown in Figs. 1A to 1E and a bottom cover for a housing for a very small size personal computer, as shown in Figs. 2A to 2E were moulded to evaluate mouldability. Injection moulding was effected using a four-point gate.The LCD cover shown in Figs. 1A to 1E has dimensions of L (length) = 295 mm, W (width) = 170 mm, H (height) = 6 mm, T 0 (plate thickness on the whole) = 1 mm and T 1 (plate thickness in part) = 2 mm. The bottom cover shown in Figs. 2A to 2E has dimensions of l (length) = 210 mm, w (width) = 149 mm, h (height) = 12 mm, t (plate thickness) = 0.8 mm. Four gates G are provided on the back of the box. (8) Warpage: The flatness of the moulded articles shown in Figs. 1 and 2 was measured with a three-dimensional measuring device 24 hrs after the completion of moulding. The number of measurement points was 38 (7 points for each of 4 longitudinal lines and 5 points for each of 2 transverse lines) in plane. An example of the measurement is shown in Fig. 3. Example 1 100 parts by weight of a polyphenylene ether resin represented by the following formula: where n is about 100, was heat-melted and mixed with 1 part by weight of maleic anhydride to provide a maleic-anhydride-modified polyphenylene ether resin (hereinafter referred to as "maleic-anhydride-modified PPE"). Since the modified resin is non-crystalline, although it has no clear melting point, it becomes melted at 240 to 250°C. The maleic anhydride serves as an agent for compatibilizing nylon with the polyphenylene ether resin. Poly-m-xyleneadipamide (hereinafter referred to as "nylon MXD6"), having a number average molecular weight of 16,000 and produced by polycondensing m-xylenediamine with adipic acid, has a melting point of 243°C and a structure represented by the following formula: 50 parts by weight of the maleic-anhydride-modified PPE, 50 parts by weight of nylon MXD6, 7 parts by weight of a liquid-crystalline polyester pellet (LC-5000 manufactured by Unitika Ltd.; hereinafter referred to as "LCP") comprising 80% by mole of a p-hydroxybenzoic acid residue unit and 20% by mole of an ethylene terephthalate unit, 3 parts by weight of 1,3-phenylenebisoxazoline (PBO) as a reacting agent for nylon and LCP, 10 parts by weight of a carbon fibre (Pyrofil TR06NB manufactured by Mitsubishi Rayon Co., Ltd.) and 10 parts by weight of mica (Y300D manufactured by Takara & Co., Ltd.) were dry blended with each other, and a melt-kneaded resin composition was produced by using an extruder set at 280°C. The formulation of the resin composition is shown in Table 1. The resin composition was then moulded by an injection moulding machine into a test piece specified in ASTM and evaluated. The fluidity and the moulding of an LCD cover shown in Fig. 1 were evaluated. The results of this evaluation are given in Table 1. An LCD cover having a plate thickness of 1 mm and an elastic modulus in flexure as high as 120,000 could be easily moulded with a four-point gate at a resin temperature of 270°C and a filling pressure of 1400 kg/cm 2 , and the warpage could be reduced to 1 mm or less. An example of the measurement of warpage is shown in Fig. 3. The measurement was effected for each point of 24 mm x 14 mm. The maximum value, minimum value and warpage (flatness) were, respectively, 0.4140 mm, -0.5602 mm and 0.9742 mm based on the reference value. Fig. 4 is a thermogravimetric curve (in air, temperature rise rate: 10°C /min) of the composition of Example 1. As can be seen, the reduction in weight due to thermal decomposition became large at 280°C or above. From this, it can be said that the thermal decomposition initiation temperature is about 280°C and the moulding temperature is preferably 300°C or below, still preferably 270°C or below. Example 2 A maleic-anhydride-modified PPE containing a rubber was produced in the same manner as that used in the production of the maleic-acid-modified PPE described in Example 1, except that 5 parts by weight of a polystyrene/ethylene/butyrene block copolymer (Kraton G1650 manufactured by Shell Kagaku K.K.) was blended as a rubber component based on 45 parts by weight of PPE. A resin composition was produced in the same manner as that of Example 1, except that the maleic-anhydride-modified PPE containing a rubber and polyamide 66 were used. The results are given in Table 1. The resultant resin composition was moulded and evaluated in the same manner as that of Example 1. As a result, as with Example 1, a LCD cover having a high elastic modulus in flexure, a reduced warpage and a high impact strength could be provided at low resin temperature and filling pressure. Example 3 A resin composition was produced according to the same formulation as that of Example 2, except that a glass flake (REF-15A manufactured by Nippon Sheet Glass Co., Ltd.) was used instead of mica. The results are given in Table 1. The resin composition could provide a moulded article having properties substantially equivalent to that of Example 2. Examples 4 and 5 The same maleic-anhydride-modified PPE, nylon MXD6, polyamide 66, LCP, PBO (0.3 parts), carbon fibre, mica and glass flake as those used in Examples 2 and 3 in the weight ratios specified in Table 1 were placed in a tumbler and dry-blended with each other, and resin compositions were produced in the same manner as that of Example 1. Evaluation was effected in the same manner as that of Example 1 and the results are given in Table 1. All of the samples had a good mouldability, a high elastic modulus in flexure and a warpage of 1 mm or less during moulding which were satisfactory from a practical viewpoint. Example 6 A bottom cover of a very small size personal computer box having a plate thickness of 0.8 mm shown in Fig. 2 was moulded using the same composition as that of Example 1 in the same manner as that of Example 1 at a resin temperature of 270°C and a filling pressure of 1420 kgf/cm 2 . As a result, the mouldability was good, and the warpage was as small as 0.4 mm. Example 7 A bottom cover was moulded using the same composition as that of Example 2 in the same manner as that of Example 6. As a result, as with Example 6, a good moulded article having a reduced warpage could be provided. Comparative Example 1 The preparation of a composition, moulding and evaluation were effected in the same formulation and manner as those of Example 1, except that no use was made of liquid-crystalline polymer. The results are given in Table 2. In the case of a resin temperature of 270°C, short shot occurred even when the filling pressure was increased to 2400 kgf/cm 2 . Thus the LCD cover could not be moulded. Comparative Example 2 The preparation of a composition, moulding and evaluation were effected in the same formulation and manner as those of Comparative Example 1, except that the resin temperature was 305°C. The results are given in Table 2. The increase in the resin temperature improved the fluidity and the resin composition could be moulded into a LCD cover. However, the warpage was as large as 3.5 mm. Furthermore, a deterioration in the resin and gas burning at an ultimate resin arrival point were observed. Comparative Examples 3, 4, 5 and 6 The preparation of test pieces, moulding and evaluation were effected using the same nylon MXD6, modified PPE, liquid crystalline polymer, PBO, carbon fibre and mica as those used in Example 1 according to the formulations specified in Table 2 in the same manner as that of Example 1. The results are given in Table 2. In Comparative Example 3, the content of the carbon fibre is so low that rigidity is insufficient. In Comparative Example 4, because the amount of the mica is so insufficient, the warpage of the LCD cover was 2.5 mm. In Comparative Example 5, because the amount of liquid-crystalline polymer was so small, no improvement in fluidity could be attained. In Comparative Example 6, because the amount of liquid-crystalline polymer was so large, warpage became liable to occur. Comparative Example 7 The preparation of a composition, moulding and evaluation were effected in the same formulation and manner as those of Example 6, except that no use was made of liquid-crystalline polymer. The results are given in Table 2. In the case of a resin temperature of 270°C, short shot occurred even when the filling pressure was increased to 2400 kgf/cm 2 , so that the bottom cover could not be moulded. Comparative Example 8 The preparation of a composition, moulding and evaluation were effected in the same formulation and manner as those of Example 1, except that no PBO was used as the reacting agent. The results are given in Table 2. When the composition did not contain PBO, the flexural strength, elastic modulus in flexure and impact strength were lower.

Claims: A housing for electronic equipment having an average plate thickness of 2 mm or less and comprising a molded product of a polyamide resin composition which comprises: (a) 100 parts by weight of a resin composition comprised of 20 to 80% by weight of an m-xylylene group-containing polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin obtainable by reacting a polyphenylene ether resin with an unsaturated aliphatic carboxylic acid or its acid anhydride, the total amount in wt% of the aromatic polyamide resin and the modified polyphenylene ether resin being 100 wt%; (b) 0.5 to 30 parts by weight of a liquid crystalline copolyester polymer having a melting point of 200 to 300°C; (c) 0.01 to 3 parts by weight of phenylenebisoxazoline; and (d) 2 to 40 parts by weight of carbon fibre and mica or glass flake. A housing as claimed in claim 1, wherein the m-xylylene group-containing polyamide resin is a product of a polycondensation of m-xylylenediamine with adipic acid. A housing as claimed in claim 1 or claim 2, wherein the polyamide resin composition further comprises up to 10 parts by weight, based on 100 parts by weight of the polyamide resin composition, of a rubber component. A housing as claimed in any preceding claim, wherein the resin composition has a fluidity of 120 mm or more in terms of bar flow length (as measured at a resin temperature of 270°C and an injection pressure of 1600 kgf/cm 2 ) using a cavity having a depth of 1 mm and a width of 10 mm, and wherein the housing has an elastic modulus in flexure of 100,000 kgf/cm 2 or more and a specific gravity of 1.35 or less.

Inventors: ADACHI KATSURA, ISHIZUKA MASANOBU, KIMURA KOUICHI, NISHII KOTA, ADACHI, KATSURA, ISHIZUKA, MASANOBU, KIMURA, KOUICHI, NISHII, KOTA, ADACHI, KATSURA, C/O FUJITSU LIMITED, ISHIZUKA, MASANOBU, C/O FUJITSU LIMITED, KIMURA, KOUICHI, C/O FUJITSU LIMITED, NISHII, KOTA, C/O FUJITSU LIMITED
Applicants: FUJITSU LTD, FUJITSU LIMITED
Application year: 1993
Main classification: C08L71
IPC codes: C08K3, C08L77, C08L67, C08K5, C08K7, C08L51, C08L71, H01B3