Charge pump circuit

Abstract: Voltage drops in a charge pump circuit may be substantially eliminated by functionally replacing the charge transfer diodes with analog switches (M5,M6). The power stage that drives a charge transfer capacitor (C1) may draw the heavy current peaks needed to drive the capacitor directly from the supply line (Vcc) thus preventing voltage drops across a voltage regulator and utilizes a bootstrap capacitor (Cb) for maintaining a conductive state during an entire half cycle of oscillation. The analog switches (M5,M6) may be driven in phase opposition by a CMOS inverter (M7,M8) or by two distinct comparators (A1,A2).

Description: 1. Field of the invention The present invention concerns an integrated charge pump circuit for implementing a voltage multiplier in integrated circuits operating with a relatively low supply voltage. The circuit is particularly suited for driving a high-side driver power device of a half-bridge output stage employing integrated DMOS transistors. 2. Description of the prior art Integration in the same chip of complex systems often composed of distinct circuit sections that are necessarily realized with structuraly and functionally different devices, erasing and programming of read only memory cells, optimization of the driving conditions of integrated power devices in a half-bridge configuration, require or benefit from the availability of a biasing or driving voltage higher than the supply voltage of the integrated circuit. Often these requirements are satisfied by integrating special voltage multiplying circuits capable of producing, on an output ballast capacitance (storage capacitance) a voltage that is higher than the supply voltage (VCC). These circuits are commonly referred to as voltage multipliers or charge pump circuits. A basic diagram of a charge pump circuit is depicted in Fig. 1. Basically, the capacitor C2 stores electric charge that is fed thereto by transferring (pumping) the charge momentarily stored in a transfer capacitance C1 through a transfer diode D2. The intermittent charging of C1 through a diode D1 connected to VCC, and the discharging of the electric charge stored therein into the output capacitance C2, are controlled by a free-running local oscillator (OSC LOC). At steady state, the circuit operates as follows. During an initial half cycle, the output of the local oscillator OSC LOC is low and the capacitance C1 charges through the diode D1 to a voltage given by: VCC-Vd, where Vd represents the voltage drop across the charge diode D1. In the following half cycle, the output of the oscillator goes to a voltage VR, the node A assumes the voltage given by: VCC+VR-Vd, and the capacitance C1, discharges the electric charge that was stored therein during the preceding half cycle in the output storage capacitance C2. The capacitance C2, assumes the voltage VCP given by the following relation: VCP=VCC+VR-2·Vd It may be observed that for: VR=VCC, the circuit becomes substantially a voltage duplicator and provides an output voltage equal to twice the supply voltage less the voltage drop across the diodes. Of course, the circuit may be composed of an N-number of such a basic circuit module, in order to obtain an output voltage that is N-time the supply voltage less N-time the ohmic drop across a diode. A practical embodiment of this type of circuit is depicted in Fig. 2. A regulated reference voltage VR is obtained, in the most simple case, by using a common voltage regulating stage composed of the transistor Q1, the resistor R1, the diode D3 and the Zener diode DZ1. By considering the voltage across the direct biased base-emitter junction of transistor Q1, given approximately by: Vbe 1 =Vd 3 , where Vd 3 is the voltage across the diode D3, the regulated voltage VR will be given by the following relations: VR=VZ for VCC>VZ+Vdrop VR=VCC-Vdrop for VCC<VZ+Vdrop where VCC is the supply voltage, VZ is the Zener voltage and Vdrop is the sum of the junction voltage Vbe 1 and of the voltage drop across the resistance R1 due to the current absorbed by the base of the regulating transistor Q1. In a typical circuit as the one depicted in Fig. 2, Vdrop is about 1.2 V. However in a large number of applications, a relatively high current may be required and therefore the transistor Q1 is often replaced by a Darlington pair. In this last instance, Vdrop is about 2V. The voltage regulating stage provides a regulated supply to the local oscillator OSC LOC and to the power stage that is made by the two MOS transistors M1 and M2. The power stage has the function of driving the charge and discharge of the pump capacitance C1. When the load connected to a multiplied voltage source is relatively heavy and/or the transistors that are connected to the VCP line switch at a high frequency, relatively large capacitances are needed both for C1 (in the order of 10 nF) and for C2 (several hundreds of nF). As a consequence, the power stage (M1-M2) must be capable of delivering relatively large peaks of current (in the order of ten mA). The drawbacks of a conventional circuit configuration as the one described above are the following: a) Throughout the range of the supply voltage, the voltage drop across the transfer diodes D1 and D2 (equivalent to about 1.4 V) is "subtracted" from the output voltage VCP, as may be observed by considering the following relation: VCP=VCC+VZ-2*Vd for VCC>VZ-Vdrop; b) In case of a relatively low supply voltage (e.g. VCC<VZ+Vdrop), also the voltage drop across the voltage regulator (Vdrop ≃ 2V) subtracts from the available output voltage VCP, as may be observed from the following relation: VCP=2*VCC-Vdrop-2Vd for VCC<VZ+Vdrop; Both voltage drops contribute to limit the efficiency of the circuit when operating with a low supply voltage; c) The current driving the pump capacitance C1, which may have relatively large peaks is drawn from the regulated voltage line VR. This implies the need of properly designing the voltage regulator, that is employing large size components. The document FR-A-2321144 discloses a charge pump circuit suitable for generating a negative voltage from a positive supply voltage wherein the functions of the two diodes of the conventional circuit configuration are performed by a pair of CMOS bistable circuits driven by a clock signal F. OBJECTIVES AND SUMMARY OF THE INVENTION The main aim of the present invention is to satisfy the need for an integrated charge pump circuit that will maintain unaltered its efficiency also with a low supply voltage and will not require a voltage regulating device dimensioned for a relatively high current level. These objectives are reached by the integrated circuit object of the present invention. The circuit is characterized by the fact that the electric charge transfer devices that, according to a conventional configuration, are functionally constituted by diodes (D1 and D2), are replaced with switches implemented by a complementary pair of MOS transistors formed in two distinct pockets of the integrated circuit. In this way, the voltage drops across the charge transfer devices may be substantially reduced. Moreover, by employing a half-bridge power stage, provided with a "bootstrap" capacitance, the voltage drop (Vdrop) across the voltage regulating stage may also be avoided. The two complementary MOS transistors that replace the two charge transfer diodes to and from the pump capacitance C1, are connected in phase opposition, in practice forming a first CMOS pair (inverter). The state of conduction and of interdiction of the two complementary transistors forming the CMOS pair is maintained for an entire half cycle of oscillation by a second CMOS pair (inverter) which, together with the first CMOS pair, constitutes a bistable circuit, commonly referred to as a latch or flip-flop. The half-bridge power stage is functionally connected between the supply node VCC and ground and may be formed with DMOS devices (e.g. with VDMOS transistors). The power device constituting so-called the high-side driver of the half-bridge power stage is controlled by an inverting stage. The inverting stage may be driven by the signal generated by the local oscillator and functionally is connected between the regulated voltage line and ground. Conversely, the other power device of the stage (low-side driver) may be driven directly by the signal produced by the local oscillator. Claim 1 discloses the integrated charge pump circuit of the invention. Claims 2 to 4 relate to preferred embodiments of the invention. Claim 5 discloses the integrated voltage multiplier employing the integrated charge pump circuit of the invention. Claim 6 relates to a preferred embodiment of the voltage multiplier. BRIEF DESCRIPTION OF THE DRAWINGS The different aspects and advantages of the circuit of the invention will become more evident through the following description of several important embodiments and by referring to the attached drawings, wherein Figures 1 and 2 show a charge pump circuit according to the prior art, as described above; Figure 3 shows a pump circuit made in accordance with the present invention; Figure 4 is a partial functional diagram of an alternative embodiment of the charge tranfer devices; Figure 5 is a block diagram of a voltage multiplier by an even number, employing the charge pump circuit of the present invention; and Figure 6 is a block diagram of a voltage multiplier by an odd number, employing a charge pump circuit of the present invention. DESCRIPTION OF PREFERRED EMBODIMENTS By referring to the diagram of Fig. 3, the operation of the charge pump stage of the invention is as follows. 1. Operation of the power stage of the charge pump circuit During a first half cycle, when the output of the local oscillator OSC LOC is high (at the regulated voltage VR), the power transistor M1 (high-side driver) is OFF and the power transistor M2 (low-side driver) is ON. Therefore, the output node M of the half-bridge power stage is at ground potential and the bootstrap capacitance Cb charges through the transistor Q2 to the regulated voltage VR present on the node R. During the successive half cycle of oscillation, when the output of the oscillator commutes from the voltage VR to ground potential, M2 is switched-OFF and M1 is switched-ON, thus "shortcircuiting" the node R (to which the bootstrap capacitance Cb is connected) to the gate of M1, through the transistor M3. As a consequence, the output node M of the half-bridge stage takes a voltage VR' and the power transistor M1 is kept on during the entire half cycle by the charge stored in the bootstrap capacitance Cb. The voltage VR', assumed by the driving node M, will have the following values: VR'=VZ+VBE for VCC>VZ+VBE VR'=VCC for VCC<VZ+VBE The transistor Q3 and the Zener DZ2 have the purpose of limiting the voltage on the node M to the value VR', given by the first one of the above-indicated equations. In fact, once the required voltage is reached (i.e. VZ+VBE) , the transistor Q3 switches-OFF the power transistor M1, thus preventing an unnecessary consumption of current through the power transistor M1 itself. 2. Operation of the charge transfer switches Once the initial switch-ON transient period has terminated, the output charge storing capacitance C2 assumes a potential given by VCC-2·Vd' , where Vd' represents the voltage drop across the "body" diode of a generic power MOS structure (if M7 and M8 are integrated in the same pocket, the starting voltage assumed by the capacitance C2 will be given by VCC-Vd'', where Vd'' represents the voltage drop across the "body" diode of the pocket). As long as the voltage VCP-VCC remains lower than the threshold voltage of the CMOS transistors (M5, M6, M7 and M8), C2 will continue to charge through the diodes intrinsic to the integrated structure of the transistors. As soon as the voltage VCP-VCC becomes greater than the threshold voltage of the CMOS transistors, M5 and M6, driven by the inverting stage constituted by the CMOS pair M7 and M8, will conduct alternatively, cooperating to "pump" electric charge in C2. The steady state operation may be described as follows. During the half cycle of oscillation when the driving node M is at ground potential, the capacitance C1 charges to VCC through the MOS transistor M5, which is kept ON by the inverting stage formed by the pair of CMOS transistors M7 and M8. In fact, the transistors M5, M6, M7 and M8 are configured in a positive reaction mode (i.e. in a configuration that implements substantially a latch or a flip-flop), and as a consequence, the condition M5on, M6on, persists until the next switching of the driving node M. During the following half cycle, when the driving node M assumes the VR' potential, the electric charge that was stored in the transfer capacitance C1 during the preceding half cycle, transfers, thus charging it, into the output storage capacitance C2 through the transistor M6, which is maintained conducting during this half cycle and until a successive switching of the driving node M because of the positive reaction that is implemented through M7-M8. From the above considerations, it may be verified easily that the output voltage VCP assumes the following values: VCP=VCC+VZ+VBE for VCC>VZ+VBE VCP=2*VCC for VCC<VZ+VBE The above formulas are valid for purely capacitive loads. Of course, when the current absorbed by the load has nonnegligeable value, the internal ON-resistance of transistors M1, M2 and M5 and M6, must be kept in consideration. The circuit of the invention has remarkable advantages as compared to the known circuits. The main advantages may be indicated as follows: a) reduction of the maximum (multiplied) output voltage by a quantity equivalent to the voltage drop across the transfer diodes of the known circuits can be avoided throughout the range of the supply voltage; b) reduction of the maximum output voltage by a quantity equivalent to the voltage drop (Vdrop) through the voltage regulator, under conditions of low supply voltage, may be avoided too; c) because the half-bridge, power stage made with the power transistors M1 and M2 is electrically connected to the supply line VCC, the high current peaks that occur for driving the transfer capacitance C1 no longer need to be drawn from the voltage regulator circuit. According to an alterantive embodiment of the circuit of the invention, depicted in Fig. 4, the efficiency of the circuit may be increased further. As schematically shown in the partial diagram of Fig. 4, the MOS transistors M5 and M6 that functionally replace the diodes D1 and D2 of a conventional circuit, as depicted in Figures 1 and 2, may be separately driven in order to avoid cross-currents and return-currents at switchings. In practice this may implemented by employing two comparators: A1 and A2, or more simply two inverters, one having a low threshold for driving the N-channel transistor M5 and one having a high threshold for driving the P-channel transistor M6. In the charge pump circuit of the invention, the transistors M5 and M6 are placed into separate pockets and the pocket of M5 is biased to the bulk potential. Moreover, it is advisable to minimize the gain of the parasitic PNP transistor of the integrated structure of M6, as well as to minimize the parasitic capacitances of the R and S nodes of the circuit depicted in Fig. 3. The charge pump circuit of the invention, illustrated above for a voltage "duplicator", may constitute a building block for realizing an N-order voltage multiplier, where N may be theorethically as large as desired. A N-even multiplier is depicted in Fig. 5, wherein each three-terminal block (Blk) may be constituted by a circuit as the one composed of transistors M5, M6, M7 and M8 of Fig. 3, or by a circuit similar to the one composed of transistors M5 and M6 and of the respective driving threshold comparators A1 and A2 of Fig. 4. An N-odd multiplier is depicted in Fig. 6, wherein each three-terminal block (Blk) may be a circuit as the one composed of transistors M5, M6, M7 and M8 of Fig. 3, or a circuit as the one composed of transistors M5 and M6 and of the respective driving threshold comparators A1 and A2 of Fig. 4.

Claims: An integrated charge pump circuit comprising: a storage capacitor (C2), functionally connected between an output node (VCP) of the circuit and a ground node, two charge transfer switching devices, functionally connected in series between a supply node coupled to a supply voltage (VCC) and said output node (VCP), a charge transfer capacitor (C1), functionally connected between an intermediate node between said two series connected devices and a driving node (M), a voltage regulator (Q1), having an input coupled to the supply node (VCC), which produces a regulated voltage (VR) from the supply voltage and has a regulator output node for outputting said regulated voltage, a local oscillator (OSC.LOC.) for producing a local oscillation signal on an output node (N) thereof; a half-bridge power stage (M1, M2), controlled by said regulated voltage (VR) and driven through an inverter (M3, M4) by said oscillator (OSC.LOC.) and which is functionally connected between a node (R) at said regulated voltage (VR) and a ground node (GND) and whose output node constitutes said driving node (M), a bootstrap capacitor (Cb) connected between said driving node (M) and a node (R) at said regulated voltage (VR), wherein said charge transfer switching devices are constituted by a pair of complementary MOS transistors (M5, M6) formed in distinct pockets of the integrated circuit, one of which is biased to a bulk potential of the integrated circuit, said complementary MOS transistors (M5, M6) being driven in phase opposition to each other by an inverter composed of a second pair of complementary MOS transistors (M7, M8) that are formed in a same pocket of the integrated circuit. The integrated charge pump circuit as defined in claim 1, wherein each one of said complementary MOS transistors (M5, M6) constituting said charge transfer switching devices is independently driven by two inverters or threshold comparators (A1, A2), respectively, having a certain triggering threshold. The integrated charge pump circuit according to claim 1, wherein said power stage (M1, M2) has means capable of limiting the maximum voltage reached by said driving node (M). The integrated charge pump circuit as defined in claim 3, wherein said limiting means are composed of a line comprising a transistor (Q3) and a Zener diode (DZ2) functionally connected between the output node of said inverter (M3, M4) driven by the oscillator (OSC.LOC.) and a ground node (GND) and said transistor (Q3) as a control terminal that is functionally connected to said driving node (M). An integrated voltage multiplier comprising a plurality (N) of three-terminal blocks, each having an input, an output and a driving terminal, functionally connected in cascade between a supply node (VCC) and an output node (VCP) of the multiplier circuit, the driving terminal of each block being connected to a charge transfer capacitor (C1, C3, ...,CN-1) and the output of each block being connected to a storage capacitor (C2, C4, ..., CN), characterized by the fact that each block is composed of a pair of complementary MOS transistors (M5, M6) formed in distinct pockets of the integrated circuit, one pocket being coupled to the bulk potential of the integrated circuit, said transistors being driven in phase opposition and functionally connected in series between said input and said output of the block, an intermediate node of connection between said transistors (M5, M6) constituting said third driving terminal of the block and a driving inverter composed of a pair of complementary MOS transistors (M7, M8), both formed into a same pocket of the integrated circuit and having an input coupled to said driving terminal and an output coupled to the gates of said complementary transistors (M5, M6). The multiplier circuit as defined in claim 5, wherein said complementary MOS transistors (M5, M6) are driven by a pair of threshold comparators or inverters (A1, A2), respectively.

Inventors: GARIBOLDI ROBERTO, PULVIRENTI FRANCESCO, GARIBOLDI, ROBERTO, PULVIRENTI, FRANCESCO
Applicants: CONS RIC MICROELETTRONICA, SGS THOMSON MICROELECTRONICS, CONSORZIO PER LA RICERCA SULLA MICROELETTRONICA NEL MEZZOGIORNO, SGS-THOMSON MICROELECTRONICS S.R.L.
Application year: 1993
Main classification: H02M3
IPC codes: H02M3, G11C17, G11C11, G11C16