ULTRASONIC WAVE PROBE

Abstract: An ultrasonic wave probe manufactured without the troublesome wiring between the piezoelectric vibrator and the transmission/reception circuit. The ultrasonic wave probe is constituted by sticking the array of the vibrators to a semiconductor wafer₁ on which the transmission/reception integrated circuits for the array of the vibrators are formed, with conductive bonding agent. Each signal transmission/reception integrated circuit corresponds to the arrangement of signal electrodes of the piezoelectric vibrators. Further, on the side of the semiconductor wafer, to which the vibrators are stuck, exposed are the conductive buried layers connected to the output terminals of the transmission circuits and to the input terminals of the reception circuits.

Description: Technical Field: The present invention relates to a probe used for ultrasonic diagnostic apparatus. More specifically, the invention relates to an ultrasonic probe in which the wiring for electrical connection between the piezoelectric vibrators and signal sending/receiving circuits are eliminated. Background Art: An ultrasonic probe has its individual piezoelectric vibrators connected to signal sending/receiving circuits, by which drive signals are supplied to the piezoelectric vibrators and signals detected by the piezoelectric vibrators are received. A conventional probe has signal sending/receiving circuits formed of component parts that are fabricated by being integrated, and the probe with the integrated circuits built therein has its piezoelectric vibrators and integrated circuits connected electrically through conductive wires. Fig. 5 is a perspective diagram showing an example of the conventional probes. In the figure, reference numeral 1 denotes piezoelectric vibrators that consitute the major part of the probe, and 2 are electronic circuits in connection with the piezoelectric vibrators, with both parts being connected together through connecting conductors 3 that are conductive wires, a flexible substrate, or the like. Fig. 6 shows another example of prior art. In the figure, portions identical to those of Fig. 5 are referred to by the same symbols. In the figure, indicated by 4 is a common electrode of piezoelectric vibrators 1, and 5 are signal electrodes of individual piezoelectric vibrators 1. Since the piezoelectric vibrators and integrated circuits of these conventional probes are connected through conductive wires as mentioned above, the number of electrical wirings increases in the case of a large number of piezoelectric vibrators such as a two-dimensional vibrator array, making the connection much difficult. Document EP-A-0 294 826 describes an ultrasonic probe comprising a vibrator array and a printed wiring board which is directly bonded to back electrodes of piezoelectric elements of the array. Contact areas on the printed wiring board are arranged to meet respective individual piezoelectric vibrators. The contact areas are formed of a conductive layer which is partially covered by an insulation and exposed at the relevant contact areas. However the wiring formed in this wiring board has also to be connected to sending/receiving circuits, similar to the arrangement of Fig. 6. Disclosure of the Invention: An object of the present invention is to realize an ultrasonic probe that is rid of the awkwardness of the wiring between the piezoelectric vibrators and signal sending/receiving circuits in the probe. The inventive ultrasonic probe comprises the features as defined in claim 1. Brief Explanation of the Drawings: Fig. 1 is a perspective diagram of the ultrasonic probe based on an embodiment of this invention. Fig. 2 is a conceptual diagram showing the detailed structure of the ultrasonic probe shown in Fig. 1. Fig. 3 shows an example of the electrical arrangement of the ultrasonic probe shown in Fig. 1. Fig. 4 is a diagram showing an example of the method of fabricating the integrated circuits on the semiconductor wafer of the ultrasonic probe shown in Fig. 1. Fig. 5 is a diagram showing an example of the conventional ultrasonic probes. Fig. 6 is a diagram showing another example of the conventional ultrasonic probes. Best Mode for Carrying Out the Invention: An embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective diagram of the ultrasonic probe based on an embodiment of this invention. In the figure, reference numeral 1 denotes multiple piezoelectric vibrators, which are arranged in a two-dimensional matrix to form a two-dimensional vibrator array of the ultrasonic probe. 11 is a semiconductor wafer, and 41 are individual integrated circuits (elemental ICs) that are fabricated on the wafer 11 in correspondence to the piezoelectric vibrators. 42 is a peripheral circuit connected to the elemental ICs 41, and it includes a control circuit and adding circuit. The wafer 11 is glued to the two-dimensional vibrator array by means of conductive adhesive or the like. 43 is a common electrode of the piezoelectric vibrators 1, with an acoustic matching layer 44 being provided in contact with it. The transmission and reception of the ultrasonic wave take place through this acoustic matching layer for an object under test that is located beneath the device in the figure. 45 are signal lines that connect the integrated circuits on the wafer 11 to the main unit of the ultrasonic diagnostic apparatus. The surface of the semiconductor wafer on which the integrated circuits are fabricated, is covered with a proper protective layer, which is further overlaid by a backing material when necessary. Fig. 2 is a detailed diagram showing an example of the linked state of one piezoelectric vibrator and the associated elemental IC. Shown by (a) of Fig. 2 is a conceptual cross-sectional diagram, and (b) is a corresponding electrical equivalent circuit diagram. Shown here for example as an integrated circuit is the final output stage of the drive circuit of a piezoelectric vibrator. In the diagram (a) of Fig. 2, reference numeral 1 is a piezoelectric vibrator, 4 is a common electrode, and 5 is a signal electrode. 11 is a semiconductor wafer, which is glued to the signal electrode 5 of the piezoelectric vibrator 1 by means of conductive adhesive 12. Fabricated on the semiconductor wafer 11 are a resistor 15 and transistor 23 to be connected to the piezoelectric vibrator 1. The resistor 15 is formed as an n-type layer by the injection of phosphor between isolation layers 13 and 14, while the transistor 23 is formed as an npn-type transistor having its collector 19, base 20 and emitter 21 formed between the isolation layers 14 and 22. One end of the resistor 15 and the collector 19 of the transistor 23 are connected by an aluminum wire 17 formed on the oxide layer 18. The resistor 15 has its another end led out to the power supply line. The transistor 23 has its base 20 led out to the drive signal source and its emitter 21 led out to the ground through an aluminum wire 24. A buried layer 16 of n + type is formed on the surface of the wafer 11 on the side of the piezoelectric vibrator, and it is exposed to the rear surface of the wafer 11. This buried layer 16 is connected to the collector 19 of the transistor 23 inside the wafer 11. The buried layer 16 has its exposed portion connected electrically by the conductive adhesive 12 to the signal electrode 5 of the piezoelectric vibrator. Consequently, the driving transistor 23 and the piezoelectric vibrator 1 are connected electrically without using a lead wire. The input terminal of the receiving circuit that receives the detected signal of the piezoelectric vibrator 1 is connected to the signal electrode of the piezoelectric vibrator 1 by using the buried layer 16 or another buried layer formed in the same manner. In this manner, even if the probe has an extremely large number of piezoelectric vibrators, such as a two-dimensionally arrayed probe, individual piezoelectric vibrators and signal sending/ receiving circuits can be connected very easily. A cut 26 is to separate adjacent piezoelectric vibrators. The cut 26 does not divide the wafer 11 into pieces. Fig. 3 is a diagram showing an example of the electrical arrangement of the integrated circuits formed on the wafer 11 of the ultrasonic probe shown in Fig. 1. An electric circuit included in the elemental IC for each piezoelectric vibrator includes a sending amplifier 51, a receiving amplifier 52 and a send/receive mode switch 53. An electric circuit included in the peripheral circuit 42 includes a transmission control circuit 50, an A/D converter 54, a delay circuit 55, a switch control circuit 56 and an adding circuit 57. The arrangement of these electric circuits is identical to that of the sending/receiving circuit section of the usual diagnostic apparatus. Fig. 4 is a diagram showing an example of the method of fabricating the integrated circuits on the semiconductor wafer of the ultrasonic probe. On the semiconductor wafer, the elemental ICs, which are arranged in the array pitch (100-500 µm) of the piezoelectric vibrators 1, and the peripheral circuit are formed, and IC chip blocks 61 of the size of matrix of the vibrator array are cut out of the wafer. The elemental IC 41 has an arrangement of multiple, e.g., four, same electronic circuits 62, and after the characteristic test, all but one circuit are disconnected by using the laser trimming technique or the like. Consequently, it becomes possible to enhance the yield of signal sending/receiving circuits fabricated on the semiconductor wafer. List of reference signs 1 PIEZOELECTRIC VIBRATOR 2 ELECTRONIC CIRCUIT 3 CONNECTING CONDUCTOR 4 COMMON ELECTRODE 5 SIGNAL ELECTRODE 11 WAFER 12 CONDUCTIVE ADHESIVE 13 ISOLATION LAYER 14 ISOLATION LAYER B 15 RESISTOR 16 BURIED LAYER 17 ALUMINUM WIRE A 18 OXIDE LAYER 19 COLLECTOR 20 BASE 21 EMITTER 22 ISOLATION LAYER 23 TRANSISTOR 24 ALUMINUM WIRE B 26 CUT 41 ELEMENTAL IC 42 CONTROL CIRCUIT & ADDING CIRCUIT 43 COMMON ELECTRODE 44 ACOUSTIC MATCHING LAYER 45 PROBE CABLE 50 WAVE TRANSMISSION CONTROL 51 SENDING AMPLIFIER 52 RECEIVING AMPLIFIER 54 AD CONVERTER 55 DELAY CIRCUIT 56 SWITCH CONTROL CIRCUIT 57 ADDING CIRCUIT 61 IC CHIP BLOCK 62 INTEGRATED ELECTRONIC CIRCUIT 63 WIRING 64 CUT SECTION

Claims: An ultrasonic probe comprising a plurality of piezoelectric vibrators (1) disposed in an array, and a plurality of signal transmitting and receiving means corresponding to said plurality of piezoelectric vibrators, said means being fabricated as integrated circuits (41) on a semiconductor wafer (11), each of said plurality of transmitting and receiving means comprising a transmitting circuit with an output terminal, receiving circuit with an input terminal, and a conductive layer connected to said input terminal and said output terminal and being exposed on one surface of said semiconductor wafer (11); and said semiconductor wafer (11) and said plurality of piezoelectric vibrators (1) being attached together with a conductive adhesive (12) such that said conductive layer of each signal transmitting and receiving means is in contact with a corresponding piezoelectric vibrator (1), and such that said ultrasonic probe is formed as a unitary structure comprising said piezoelectric vibrator (1) and said signal transmitting and receiving means attached together with no additional wiring therebetween. An ultrasonic probe according to claim 1, wherein a set of signal sending/receiving circuits are fabricated for each of said piezoelectric vibrators, with one circuit among said circuit set being brought to be effective.

Inventors: MORISHITA MASAO, NODA YOSHIKATSU, SATO MASAKI, SOMA NORIHITO, MORISHITA, MASAO,, NODA, YOSHIKATSU,, SATO, MASAKI,, SOMA, NORIHITO,
Applicants: YOKOGAWA MEDICAL SYST, YOKOGAWA MEDICAL SYSTEMS, LTD
Application year: 1992
Main classification: H04R17
IPC codes: A61B8, G01N29, G01S15, B06B1, H04R17