Inserts encapsulated with a thermoplastic sheet material via multi-stage compression molding

Abstract: This invention relates to inserts (1), such as transformers, that are encapsulated, via a multi-stage compression molding process, with at least one thermoplastic sheet material (6) and that do not experience significant visible cracking during heat cycling.

Description: BACKGROUND This invention relates to inserts, particularly electrically functional devices containing metal, such as transformers, sensors, solenoids, and circuit boards, that are encapsulated with at least one layer of a thermoplastic sheet material via a multi-stage compression molding process. Inserts have been encapsulated in the past with polymeric resins for reasons of environmental protection, thermal conductivity, electrical insulation, shielding, and protection against chemicals. Such encapsulation is usually done via extrusion and injection molding processes (for example, US-A-4,632,798 - Eickman, the disclosure of which forms the preambles of the independent claims of the present invention). The resultant encapsulated inserts are, in some cases, and especially if the inserts are electrical in nature, exposed to heat for long periods of time. It has been found that in some cases, the encapsulated layer of such encapsulated devices can crack extensively during exposure to this heat or during thermal cycling. It is believed that this cracking of the encapsulation layer occurs because of differences in the coefficient of thermal expansion, resin shrinkage, or inadequate mechanical properties, each of which could be due to fiber attrition in the resin and/or resin degradation that could occur during extrusion and/or injection molding operations. US-A-4,891,176 discloses a method for manufacturing a panel, such as an automotive panel, using the resin transfer molding (RTM) process. The method includes the steps of preforming a first mat of glass fibers into a shape approximating one side of the panel and, similarly, preforming a second mat of glass fibers into a shape approximating a second side of the panel. A urethane core is sandwiched in between the preformed mats to thereby form a premolded assembly. This premolded assembly is placed into a mold and a settable resin is injected into the mold to form the panel. EP-A-0,254,363 discloses a method for manufacturing a panel, for example an automobile panel, which method is charaterized in that a prefabricated filling of foam plastic is placed in a mold cavity between two layers of reinforced plastic, and that in a pressing process using heat and pressure said two layers of reinforced plastic are fused to each other while they enclose the foam plastic. EP-A-0,375,851 teaches an encapsulated electrical or electronic device having a first layer of electrically insulating material which is then covered by another resin layer filled with thermally conductive fibers such as mesophase pitch based carbon fibers. It was an object of the present invention to develop an encapsulated insert that does not experience extensive, preferably even slight, visual cracking during thermal cycling. In the present invention, it was found that such an encapsulated insert could be prepared. More specifically, it was found that such an insert could be prepared by using at least one layer of a thermoplastic sheet material to encapsulate the insert and further by encapsulating the insert via a multi-stage compression molding process. Any insert can be encapsulated via the multi-stage compression molding processes described herein using the thermoplastic sheet material described herein. Examples of inserts to which the present invention is particularly applicable include electrically functional devices, such as transformers and parts thereof, solenoids, sensors, and circuit boards, and other metal devices that are exposed to heat for extended periods of time or that undergo thermal cycling. SUMMARY OF THE INVENTION This invention relates to inserts encapsulated, by multi-stage compression molding processes, in at least one layer of a thermoplastic sheet material. The resultant insert does not experience significant visible cracking during thermal cycling. The present invention is particularly useful in making encapsulated electrical inserts, such as transformers, solenoids, sensors, circuit boards, and other devices that undergo exposure to heat for extended periods of time. The invention further relates to a multi-stage compression molding process for encapsulating an electrically functional device insert containing metal encapsulated with at least one layer of a thermoplastic sheet material being comprised of a thermoplastic polymeric material and a glass fiber material. DETAILED DESCRIPTION OF THE INVENTION The present invention specifically relates to an electrically functional device insert containing metal encapsulated with at least one layer of a thermoplastic material, characterized by said thermoplastic material being a thermoplastic sheet material and being comprised of a thermoplastic polymeric material and a glass fiber material and said encapsulation being accomplished by a multi-stage compression molding process comprising the steps of (a) fastening the insert to an upper punch of a compression molding die assembly, which contains a mold, such that a part of the insert is exposed for encapsulation, (b) lowering the punch into the compression molding die assembly cavity until the insert is forced into the thermoplastic sheet material, said thermoplastic sheet material having been placed at the bottom of the mold in an amount sufficient to encapsulate the exposed part of the insert, said thermoplastic sheet material having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material, (c) applying 3,447-20,684 kPa of pressure to the mold until the temperature of the mold is reduced to below the melting point of the thermoplastic polymeric material, at which time the pressure is reduced to 0 kPa, (d) repeating the process of steps (a)-(c) for the parts of the insert that are not encapsulated until the entire insert is encapsulated with the thermoplastic sheet material, and (e) optionally sealing any parting line resulting from the multi-stage compression molding process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. The present invention further relates to an electrically functional device insert containing metal encapsulated with at least one layer of a thermoplastic material, characterized by said thermoplastic material being a thermoplastic sheet material and being comprised of a thermoplastic polymeric material and a glass fiber material and said encapsulation being accomplished by a multi-stage compression molding process comprising the steps of (a) placing the insert in the bottom of a compression molding die assembly cavity, equipped with a mold and an upper punch, such that one part of the insert is exposed for encapsulation and the remaining part of the insert is protected from encapsulation by one or more isolation inserts, (b) arranging the thermoplastic sheet material over the part of the insert to be encapsulated, (c) heating the mold (3) to slightly below the melt temperature of the thermoplastic polymeric material, said thermoplastic sheet material having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material, (d) closing the mold cavity by lowering the punch completely into the cavity (2) and the mold, (e) applying 3,447-20,684 kPa of pressure to the mold while lowering the molding temperature to below the melting point of the thermoplastic polymeric material, at which time, pressure is reduced to 0 kPa, (f) repeating the process of steps (a)-(e) for the parts of the insert that are not encapsulated until the entire insert is encapsulated, and (g) optionally sealing any parting line resulting from the multi-stage compression molding/process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. The present invention also relates to a multi-stage compression molding process for encapsulating an electrically functional device insert containing metal encapsulated with at least one layer of a thermoplastic sheet material being comprised of a thermoplastic polymeric material and a glass fiber material characterized by the steps of (a) fastening the insert to an upper punch of a compression molding die assembly, which contains a mold, such that a part of the insert is exposed for encapsulation, (b) lowering the punch into the compression molding die assembly cavity until the insert (1) is forced into the thermoplastic sheet material, said thermoplastic sheet material having been placed at the bottom of the mold in an amount sufficient to encapsulate the exposed part of the insert, said thermoplastic sheet material having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material, (c) applying 3,447-20,684 kPa of pressure to the mold until the temperature of the mold is reduced to below the melting point of the thermoplastic polymeric material, at which time the pressure is reduced to 0 kPa, (d) repeating the process of steps (a)-(c) for the parts of the insert that are not encapsulated until the entire insert is encapsulated with the thermoplastic sheet material, and (e) optionally sealing any parting line resulting from the multi-stage compression molding process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. The present invention further relates to a multi-stage compression molding process for encapsulating an electrically functional device insert containing metal encapsulated with at least one layer of a thermoplastic sheet material being comprised of a thermoplastic polymeric material and a glass fiber material characterized by the steps of (a) placing the insert in the bottom of a compression molding die assembly cavity, equipped with a mold and an upper punch, such that one part of the insert is exposed for encapsulation and the remaining part of the insert is protected from encapsulation by one or more isolation inserts, (b) arranging the thermoplastic sheet material over the part of the insert to be encapsulated, (c) heating the mold to slightly below the melt temperature of the thermoplastic polymeric material, said thermoplastic sheet material having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material, (d) closing the mold cavity by lowering the punch completely into the cavity and the mold, (e) applying 3,447-20,684 kPa of pressure to the mold while lowering the molding temperature to below the melting point of the thermoplastic polymeric material, at which time, pressure is reduced to 0 kPa, (f) repeating the process of steps (a)-(e) for the parts of the insert that are not encapsulated until the entire insert is encapsulated, and (g) optionally sealing any parting line resulting from the multi-stage compression molding/process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. Particular embodiments of the invention are disclosed in the dependent claims. In the present invention, an insert is encapsulated via the multi-stage compression molding processes described herein using at least one layer of a thermoplastic sheet material. The thermoplastic sheet material used herein is prepared from a thermoplastic polymeric material and glass fiber material. It contains preferably 5-55 weight percent, more preferably 10-50 weight percent, of the glass fiber material. The preceding weight percent are based upon the weight of the thermoplastic polymeric material and the glass fiber material only. The thermoplastic polymeric material used in the thermoplastic sheet material can be in the form of fibers, pellets or flakes. Useful thermoplastic polymeric materials include polyesters (preferably polyethylene terephthalate), polyamides, acrylics, thermoplastic elastomers or rubbers (such as copolyetheresters, an example of which is Hytrel®, manufactured by Du Pont, and partially cross-linked halogenated polyolefin alloys compounded with plasticizers and stabilizers, an example of which is Alcryn®, manufactured by Du Pont), and polyolefins (such as polypropylene). The glass fiber material used in the thermoplastic sheet material can be comprised of glass fibers only or can be a mixture of fibers, flakes, or spheres, provided that glass fiber is present in the glass material. Preferably, it is comprised of all fiber. In addition to the thermoplastic polymeric material and the glass fiber material, the thermoplastic sheet material can contain other additives, such as antioxidants, flame retardants, and/or viscosity modifiers. If it is desired that an encapsulation layer around the insert be electrically insulating, then it is preferred that the insert be encapsulated with at least one layer of a thermoplastic sheet material that is prepared from polyethylene terephthalate fiber (an example of which is Dacron®) and that contains 5-55 weight percent, preferably 10-50 weight percent, glass fiber. If it is desired that an encapsulation layer around the insert be thermally conductive, then the insert should be encapsulated with at least one layer of a thermoplastic sheet material that additionally contains 5-60 weight percent, preferably 10-45 weight percent, of at least one thermally conductive material, such as carbon fibers, metal coated carbon fibers, metal powders, metal fibers, coke, carbon black, carbon powder, or mixtures thereof. The preferred thermally conductive thermoplastic sheet material contains 30-45 weight percent polyethylene terephthalate fiber, 5-35 weight percent glass fiber, and about 35-50 weight percent carbon fiber that is centrifugally spun from a mesophase pitch (as described in U.S. Patent 4,861,653, incorporated herein by reference). The thermoplastic sheet material, and a preform thereof, is prepared as described in European Patent Application 0341977, which corresponds to co-pending U.S. patent application serial number 07/315,836, incorporated herein by reference. The insert can be encapsulated with one or more layers of the same or varying thermoplastic sheet material. For electrical devices, and in particular for transformers, it is recommended that the insert be encapsulated with at least one layer of a thermally conductive thermoplastic sheet material and at least one layer of an electrically insulating thermoplastic sheet material. In the present invention, encapsulation of the insert in the thermoplastic sheet material is accomplished via a multi-stage compression molding process. In the first stage, one part of the insert is encapsulated by a compression molding process and in the subsequent stages, the other parts of the insert are encapsulated by a compression molding process until the entire insert is encapsulated. Preferably, the entire encapsulation process is completed by encapsulating the top part of the insert and then encapsulating the bottom part of the insert in two compression molding operations. However, depending upon the complexity of the insert being encapsulated, it should be understood that more than two compression molding operations may be required for full encapsulation. An example of the compression molding process is described more specifically by reference to Figure 1 and Figure 2 . Figure 1 shows the first part encapsulation for an insert that is a transformer. In Figure 1 , the insert (1) (i.e., the transformer) would be inserted into the mold cavity (2) of a compression molding die assembly having a mold (3) and an upper punch (4). The part of the insert that is not to be encapsulated during the first part encapsulation would be isolated from the compression molding operation by an isolation insert (5). If the insert being encapsulated contains exposed wires (7), as in the case of a transformer, then it is recommended that the exposed wires be protected from the encapsulation operation by a hollow slide (8) that is standard in the industry. After the first stage encapsulation is complete, the hollow slide would be retracted toward the punch; it can be replaced by a non-conductive wire holder that would serve to isolate the wiring from any encapsulating material that is conductive. The enclosed wiring then would serve as the base for external electrical connections. The thermoplastic sheet material (6) (or a preform thereof, as discussed below) would be placed over the exposed part of the insert to be encapsulated. Enough material should be used to encapsulate the entire exposed part of the insert. The thermoplastic sheet material, or a preform thereof, would optionally, and preferably be heated in an external oven to above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material before being placed over the insert to be encapsulated. The temperature of the mold would be kept near the melt temperature of the thermoplastic polymeric material in the thermoplastic sheet material. The insert to be encapsulated is preferably not pre-heated. The mold would then be closed off by lowering the upper punch (4) completely into the mold cavity (2), thereby forcing the thermoplastic sheet material around the exposed surfaces of the insert. Pressure in the mold would be raised to 3,447-20,684 kPa (500-3,000 pounds per square inch), with 3,447-6,095 kPa (500-1,000 pounds per square inch) being preferred. The mold temperature would then be lowered to below the melting point of the thermoplastic polymeric material in the thermoplastic sheet material, after which time, molding pressure would be lowered to 0 kPa (0 pounds per square inch) and the upper punch would be raised above the mold. The time needed to complete this encapsulation step, from the time the thermoplastic sheet material, or preform thereof, is placed over the insert until the upper punch is raised would be about 10-20 minutes. Instead of using the thermoplastic sheet material as is, it is preferred to use a preform of the thermoplastic sheet material. A preform is preferred because it has only 10%-20% of the bulk density of the thermoplastic sheet material. A preform of the thermoplastic sheet material, which can be one layer or, more commonly, multi-layered, can be made in the form of a flat plate, said plate being either partially or fully consolidated by pressing the thermoplastic sheet material in an earlier operation. Alternatively, a preform can be formed into either the full or partial shape of the insert to be encapsulated. In such a case, such partially or fully formed preforms are prepared by heated and pressing the thermoplastic sheet material in an earlier operation. An example of how to prepare a preform from a thermoplastic sheet material is found in European Patent Application 0341977, described above. After the insert has been encapsulated as described above for the first stage encapsulation, it would then be turned over in the mold cavity, the isolation insert (5) would be removed from the compression molding die assembly and replaced by one adapted to the partly encapsulated insert (5'), and another part of the insert would be encapsulated by the same process described above. This second stage encapsulation process is shown in Figure 2 . (Structures in Figure 2 that are numbered the same as in Figure 1 are meant to represent the same structure as in Figure 1 .) In Figure 2 , the first stage encapsulation is shown by (6) and the second stage encapsulation is shown by (9). The traditional way to encapsulate an insert via compression molding techniques is to place the insert in the mold cavity, place the encapsulating material (or preform thereof) around the insert, close the mold, and apply heat until the encapsulation process is complete. Such a process is acceptable but there is always a desire, especially with electrical devices such as transformers, to reduce the residence time of an insert in a hot mold because it is possible that the function of the insert may be damaged if exposed to excessive heat during encapsulation. It has been found that the residence time of the insert in the mold during the encapsulation/compression molding operation can be reduced by following the procedure illustrated in Figure 3 . In Figure 3 , the insert to be encapsulated (11) would be fastened to the end of an unheated punch (12) (as opposed to putting the device in the mold cavity) of a compression molding assembly. The insert can be fastened to the punch with, for example, bolts (13). Isolation inserts (14) can be attached to the punch to prevent encapsulation of selected parts of the insert. The thermoplastic sheet material (15), or a preform thereof, would be preferably preheated in an external oven as described above and would be placed in the bottom of the mold cavity (16). The mold would be preferably pre-heated to just below the melting point of the thermoplastic polymeric material in the thermoplastic sheet material. The insert fastened to the unheated upper punch would then be forced down into the mold containing the thermoplastic sheet material (or preform thereof). The molding pressure would then be raised to 3,447-20,684 kPa (500-3,000 pounds per square inch), with 3,447-6,095 kPa (500-1,000 pounds per square inch) being preferred. The mold temperature would then be dropped to below the melting point of the thermoplastic polymeric material used in the thermoplastic sheet material and the mold pressure would be dropped to 0 kPa (0 psi). The punch would then be lifted out of the mold cavity to remove the partly encapsulated insert. Other parts of the insert would be encapsulated by the same process. By this procedure, the residence time of the insert in the heated mold is about 1-3 minutes per part (versus 10-20 minutes when the insert is placed directly in the mold and the thermoplastic sheet material is placed over the insert). The insert can be encapsulated by any of the procedures described above more than once. The procedure can be repeated to apply more of the same, or different, layers of thermoplastic sheet material. Alternatively, more than one layer of identical, or varying, thermoplastic sheet materials can be applied in a single molding operation by placing more than one layer of the same, or varying, thermoplastic sheet material on the insert to be encapsulated in the mold cavity or by making a preform from more than one layer of the same, or varying, thermoplastic sheet materials. Since the insert is encapsulated, via a multi-stage compression molding process, and since the first part encapsulation is not remelted during subsequent encapsulations, there may be a parting line between the various encapsulation/compression molding stages. The parting line can be sealed by caulking with an elastomeric material, using ultrasonic welding, or heating by induction. Sealing of the parting line provides a weather barrier and further permits the sealed parting line to act as an expansion joint between the encapsulated parts of the transformer. Alternatively, the mold in the compression molding die assembly can be designed so that the parting line between encapsulations is in the form of a tongue and groove, wherein the tongue is in the shape of a thin point that can melt easily and help seal the resultant parting line. EXAMPLES The components of the compositions of Examples C1-C7 and 1 are given in TABLE I , below. The compositions of Examples C1-C7 were prepared as follows: the PET resin was dried at 100°C and -18°C dew point for about 2 hours. The PET resin was dry blended with the other ingredients listed in TABLE 1 and then extruded in a twin screw extruder having cylinder temperatures set between 260°C-300°C. The temperature of the melt as it exited the die ranged between 280°C-300°C. The final product was chopped and dried at 100°C and -18°C dew point for about 2 hours. The thermoplastic sheet material of Example 1 was prepared from 45% PET (Dacron®) fibers, 10% glass fibers, and 45% of the carbon fibers described in U.S. Patent 4,861,653. The thermoplastic sheet material was prepared, and formed into a multi-layer preform, as directed in European Patent Application 0341977. The compositions of Examples C1-C7 were used to encapsulate a hollow cylinder having 12.7 mm (1/2") inner diameter, 25.4 mm (1") outer diameter, and 41.3 mm (1-5/8") length. The cylinder was encapsulated on its ends and outside surface with a 1.6 mm (1/16") layer of resin. Encapsulation for Examples C1-C7 was carried out by the following injection molding process: The extruded composition was dried at 100°C and -18°C dew point for about 2 hours. It was then loaded into a standard, general purpose, gradual compression screw injection molding machine. The injection machine had a cylinder temperature setting of 260°C-295°C, a mold temperature setting of 93°C, and an injection pressure of 68.8-110.3 MPa (10-16,000 psi). The temperature of the melt was 280°C-300°C. Each encapsulated metal cylinder was heated to about 200°C and held at that temperature for 3 hours. The encapsulated metal cylinder was then cooled to room temperature and held at that temperature for 6 hours. The cycle was then repeated 4 more times. The test was considered a success if no visible cracking was observed at the end of five cycles. TABLE I indicates the cycle at which cracking was visible for cylinders encapsulated with the compositions of Examples C1-C7. The thermoplastic sheet material of Example 1 was used to encapsulate a steel circular insert, shaped like a hockey puck, having 47.7 mm (1-7/8") outer diameter and 25.4 mm (1") length. The insert was encapsulated with a 4.8 mm (3/16") layer of the thermoplastic sheet material described above. Encapsulation was accomplished by the following multi-stage compression molding process: the mold of a standard compression molding die assembly was heated to 250°C. The thermoplastic sheet material, which was in the shape of a preform, was heated to 270°C in an external oven and placed in the bottom of the hot mold. The steel insert, which was not heated, was placed in the mold. Isolation inserts were placed over the top part of the insert so that only the bottom half of the insert would be encapsulated. The insert was pressed into the hot thermoplastic sheet material, thereby forcing the thermoplastic sheet material up and around the insert until it reached the isolation inserts. The molding pressure was 6,095 kPa (1,000 psi). The mold was then cooled to below 200°C, with pressure being maintained at 6,095 kPa (1,000 psi). When the temperature was below 200°C, the pressure was then dropped to 0 kPa (0 psi), the mold was dismantled, and the partially encapsulated insert was removed. The mold was then reheated to 250°C. The thermoplastic polymeric sheet material, again in the shape of a preform was heated to 270°C and placed in the mold. The encapsulated part of the partially encapsulated insert was placed in mold, with the encapsulated part of the insert acting as an integral isolation insert. The insert was pressed into the thermoplastic sheet material using a pressure of 6,095 kPa (1,000 psi). The resin was forced up and around the insert until it reached the previously encapsulated surface. The mold was then cooled to 200°C, the pressure was dropped to 0 kPa (0 psi), the mold was dismantled, and the fully encapsulated insert was removed. The multi-stage compression-molded, encapsulated cylinder of Example 1 was heat cycled as described above. No cracking was visible after 5 cycles. Example Number Thermoplastic Material Wt. % Glass (Type) Wt. % Other Additive Oven Temperature (°C) Failure C1 PET Resin - - 200 Cycle 2 C2 PET Resin 15% (Fiber) 9% EBAGMA 200 Cycle 5 2.5% TPA C3 PET Resin - 9% EBAGMA 200 Cycle 5 C4 PET Resin 15% (Micro Fiber) - 200 Cycle 3 C5 PET Resin 25% (Micro Fiber) - 200 Cycle 1 C6 PET Resin 5% Fiber - 200 Cycle 1 10% Flake C7 PET Resin 10% Fiber - 200 Cycle 1 20% Flake 1 PET Fiber 10% Fiber 45% Carbon Fiber 200 None PET = polyethylene terephthalate; EBAGMA = terpolymer of ethylene/butyl acrylate/glycidyl methacrylate; TPA = oligomer of terephthalic acid;

Claims: An electrically functional device insert (1) containing metal encapsulated with at least one layer of a thermoplastic material, characterized by said thermoplastic material being a thermoplastic sheet material (6) and being comprised of a thermoplastic polymeric material and a glass fiber material and said encapsulation being accomplished by a multi-stage compression molding process comprising the steps of (a) fastening the insert (1) to an upper punch (4) of a compression molding die assembly, which contains a mold (3), such that a part of the insert (1) is exposed for encapsulation, (b) lowering the punch (4) into the compression molding die assembly cavity (2) until the insert (1) is forced into the thermoplastic sheet material (6), said thermoplastic sheet material (6) having been placed at the bottom of the mold (3) in an amount sufficient to encapsulate the exposed part of the insert (1), said thermoplastic sheet material (6) having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material (6), (c) applying 3,447-20,684 kPa of pressure to the mold (3) until the temperature of the mold (3) is reduced to below the melting point of the thermoplastic polymeric material, at which time the pressure is reduced to 0 kPa, (d) repeating the process of steps (a)-(c) for the parts of the insert (1) that are not encapsulated until the entire insert is encapsulated with the thermoplastic sheet material (6), and (e) optionally sealing any parting line resulting from the multi-stage compression molding process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. An electrically functional device insert (1) containing metal encapsulated with at least one layer of a thermoplastic material (6), characterized by said thermoplastic material (6) being a thermoplastic sheet material (6) and being comprised of a thermoplastic polymeric material and a glass fiber material and said encapsulation being accomplished by a multi-stage compression molding process comprising the steps of (a) placing the insert (1) in the bottom of a compression molding die assembly cavity (2), equipped with a mold (3) and an upper punch (4), such that one part of the insert (1) is exposed for encapsulation and the remaining part of the insert (1) is protected from encapsulation by one or more isolation inserts (14), (b) arranging the thermoplastic sheet material (6) over the part of the insert (1) to be encapsulated, (c) heating the mold (3) to slightly below the melt temperature of the thermoplastic polymeric material, said thermoplastic sheet material (6) having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material (6), (d) closing the mold cavity (2) by lowering the punch (4) completely into the cavity (2) and the mold (3), (e) applying 3,447-20,684 kPa of pressure to the mold (3) while lowering the molding temperature to below the melting point of the thermoplastic polymeric material, at which time, pressure is reduced to 0 kPa, (f) repeating the process of steps (a)-(e) for the parts of the insert (1) that are not encapsulated until the entire insert (1) is encapsulated, and (g) optionally sealing any parting line resulting from the multi-stage compression molding/process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. The insert (1) of Claim 1 or Claim 2 encapsulated with more than one layer of the thermoplastic sheet material (6). The insert (1) of Claim 1 or Claim 2 wherein the thermoplastic sheet material (6) is comprised of polyethylene terephthalate fiber and glass fiber. The insert (1) of Claim 1 or Claim 2 wherein the thermoplastic sheet material (6) is comprised of polyethylene terephthalate fiber, glass fibers, and carbon fibers centrifugally spun from mesophase pitch. The insert (1) of Claim 1 or Claim 2 encapsulated with at least one layer of the thermoplastic sheet material (6) of Claim 4 that does not contain carbon fiber and at least one layer of the thermoplastic sheet material (6) of Claim 5. The insert (1) of Claim 1 or Claim 2 that is a transformer. A multi-stage compression molding process for encapsulating an electrically functional device insert (1) containing metal encapsulated with at least one layer of a thermoplastic sheet material being comprised of a thermoplastic polymeric material and a glass fiber material, the process comprising the steps of (a) fastening the insert (1) to an upper punch (4) of a compression molding die assembly, which contains a mold (3), such that a part of the insert (1) is exposed for encapsulation, (b) lowering the punch (4) into the compression molding die assembly cavity (2) until the insert (1) is forced into the thermoplastic sheet material (6), said thermoplastic sheet material (6) having been placed at the bottom of the mold (3) in an amount sufficient to encapsulate the exposed part of the insert (1), said thermoplastic sheet material (6) having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material (6), (c) applying 3,447-20,684 kPa of pressure to the mold (3) until the temperature of the mold (3) is reduced to below the melting point of the thermoplastic polymeric material, at which time the pressure is reduced to 0 kPa, (d) repeating the process of steps (a)-(c) for the parts of the insert (1) that are not encapsulated until the entire insert is encapsulated with the thermoplastic sheet material (6), and (e) optionally sealing any parting line resulting from the multi-stage compression molding process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. A multi-stage compression molding process for encapsulating an electrically functional device insert (1) containing metal encapsulated with at least one layer of a thermoplastic sheet material being comprised of a thermoplastic polymeric material and a glass fiber material, the process comprising the steps of (a) placing the insert (1) in the bottom of a compression molding die assembly cavity (2), equipped with a mold (3) and an upper punch (4), such that one part of the insert (1) is exposed for encapsulation and the remaining part of the insert (1) is protected from encapsulation by one or more isolation inserts (14), (b) arranging the thermoplastic sheet material (6) over the part of the insert (1) to be encapsulated, (c) heating the mold (3) to slightly below the melt temperature of the thermoplastic polymeric material (6), said thermoplastic sheet material (6) having been heated above the melting point, but below the point of degradation, of the thermoplastic polymeric material in the thermoplastic sheet material (6), (d) closing the mold cavity (2) by lowering the punch (4) completely into the cavity (2) and the mold (3), (e) applying 3,447-20,684 kPa of pressure to the mold (3) while lowering the molding temperature to below the melting point of the thermoplastic polymeric material, at which time, pressure is reduced to 0 kPa, (f) repeating the process of steps (a)-(e) for the parts of the insert (1) that are not encapsulated until the entire insert (1) is encapsulated, and (g) optionally sealing any parting line resulting from the multi-stage compression molding/process by caulking with an elastomeric material, welding by ultrasound, or heating by induction. The process of Claim 8 or Claim 9 wherein the mold (3) is designed so that any parting line on the insert resulting from the multi-stage compression moldings is in the form of a tongue and a groove, with said tongue being in the shape of a thin point.

Inventors: FOX LLOYD, SHEER LANA M, SOLENBERGER JOHN CARL, FOX, LLOYD, SHEER, LANA M., SOLENBERGER, JOHN CARL
Applicants: DU PONT, E.I. DU PONT DE NEMOURS AND COMPANY
Application year: 1992
Main classification: B29C70
IPC codes: B29C43, B29C70, H01F41, B29C65, B29K105, B29L31, B29C35