IC test clip with flexible contacts

Abstract: A test clip is provided, of the type that has multiple contacts that engage the leads of an IC (integrated circuit) device with closely spaced leads, which can be constructed reliably and at low cost. The test clip includes a flat flexible cable, (52, Figure 5) mounted on the clip housing (30), the cable having parallel conductors mounted on an insulative layer. The lower ends (58) of the conductors serve as lead-engaging contacts, and have exposed inner surfaces that directly engage largely vertical parts (60) of the IC device leads, A stiffener (70) formed by a sheet of stiff but flexible material, is attached to the lower portion of the cable on its outer surface, the stiffener having a lower portion that biases the lower ends of the conductors towards the leads. A circuit board (40) is mounted on the clip housing to lie in a horizontal plane, and has contact pads (80) on its lower surface. The flexible cable is bent so its upper end extends horizontally and has exposed upper conductor ends (92) that connect to the pads on the lower surface of the circuit board, the pads being connected to contact elements (36) of connectors on the upper surface of the circuit board.

Description: Test clips are used to temporarily connect to the leads of IC (integrated circuit) devices. High density circuits are generally in the form of flat packages having a rectangular body and multiple leads extending from two or four sides of the body to the circuit board. Present test clip used rows of individual contacts, each stamped or photo-fabricated to small tolerances. Each contact is placed in an individual slot of a plastic housing which separates adjacent contacts by thin barriers. IC devices are becoming available with greater number of leads, with the pitch size, or distance between the centres of adjacent leads, becoming increasingly smaller. Such smaller IC devices enable the production of smaller sophisticated electronic devices. IC devices are currently available with fifty leads on each of four sides, having a 0.5mm (0.02 inch) lead pitch side and it is expected that IC devices will soon be available with lead pitch sizes of 0.4mm and 0.3mm. As the pitch size decreases, the size and tolerances of the very thin contacts and of the insulator barrier walls between adjacent contacts, becomes extremely small. There is a question as to whether the present technology can be used to produce reliable test clips for such IC devices even at high prices. The problem is compounded by the fact that existing IC devices as well as recently announced new ones are not well standardised. United States of America Patent Number US-A-4190311 describes a low profile test clip adapter in which a connector is mounted in a housing and has two rows of spring contacts which are moulded into a plastics body and have upper insulation displacement contacts to which are connected the ends of individual conductors of a flat cable. The body has a pair of arms which are pivotally mounted on opposite sides of the body and have spaced fingers which serve as separators for the spring contacts. The arms are resiliently biased on the pivotal connection such that the fingers are urged between the contacts and its engagement with the body of an integrated circuit to be tested. Such a construction is complex and expensive to manufacture and it is difficult to produce a reliable device for use with integrated circuits of small lead separation. United States of America Patent Number US-A-4554505 discloses a socket for testing a leadless chip carrier but which is not suitable for connecting to a leaded integrated circuit where mounted on a printed circuit board. United States of America Patent Number US-A-5087877 describes a test contact fixture using flexible circuit tape for testing an IC mounted in "a tape automated bonded package" with horizontal leads and is not suitable for connecting to a leaded integrated circuit when mounted on a printed circuit board. The present invention seeks to provide a test clip which is suitable for connection to a leaded integrated circuit package when mounted on a printed circuit board which clip is reliable and cheap to manufacture and which can be constructed so as to permit use with ICs of small lead separation. A test clip which could be manufactured at moderate cost to reliably engage the leads of IC devices having leads spaced at very small pitch sizes, would be of considerable value in the testing of IC circuit devices. According to one aspect of the invention there is provided a test clip which can test an integrated circuit device having a device body with a body upper portion of predetermined size and a body bottom that can rest substantially on a face of an IC holding circuit board device and also having a plurality of leads extending from each of a plurality of sides of the body with each lead having an outer lead part extending at least partially downwardly toward the IC circuit board, the test clip including a clip housing with locating walls that closely engage the circuit device body to locate the housing with respect to the device body, at least one connector having a plurality of contact elements, and a plurality of lead-engaging contacts mounted on the clip housing and having lower portions that can each be resiliently biased against one of the outer lead parts, wherein a flat flexible cable is mounted on the clip housing, the cable having a flexible insulative material and a plurality of parallel conductors mounted on the insulative material, the conductors having lower ends that have inner surfaces which are exposed to enable them to directly engage the outer lead parts and that form said lead-engaging contacts, the conductors having upper ends that are connected to the connector contact elements. According to another aspect of the invention there is provided a method of electrically connecting a test clip to two rows of leads at opposite sides of an integrated circuit device that has a device body, wherein each row of leads has largely vertical outer lead parts, the test clip being obtained by constructing it with a housing having walls designed closely to engage the device body and with at least one connector having multiple connector contact elements on the housing mounting a flat flexible cable with upper and lower ends on the test clip housing, the cable having a layer of flexible insulative material and a plurality of parallel conductors having exposed lower and upper ends, with the conductor upper ends electrically connected to the connector contact elements, and the conductor lower ends forming opposite rows of contacts of the test clip and having inner surfaces positioned to press against the outer lead parts, said method further including the step of moving the test clip down against the integrated circuit device body so that the locating walls closely engage the device body and the lower contact ends wipe across the outer lead parts. The present invention preferably provides a test clip which can be used with integrated circuit devices having leads spaced at a fine pitch, and which can be constructed at moderate cost. Preferably lead-engaging contacts are formed by the conductors of a flat flexible cable which is mounted on the housing of the test clip. The cable conductors have lower ends with inner surfaces that are exposed to enable them to directly engage the leads of the IC device. A stiffener formed of a sheet of resilient material may be attached to a lower portion of the cable at the outer side of the conductor lower ends, which stiffener resiliently biases the conductor lower ends against the leads of the IC device. A circuit board may be mounted on the clip housing to lie in a horizontal plane, the board having a lower surface with a row of conductive pads and the cable being bent so its upper end lies under the circuit board, with the upper ends of the conductors having upper surfaces that are exposed and which engage the conductive pads on the circuit board. Constructional embodiments of the present invention will now be described by way of example with reference to the accompanying drawings, wherein:- Figure 1 is a simplified isometric view of a test clip constructed in accordance with the present invention, and showing it lying above an integrated circuit device that is mounted on a circuit board; Figure 2 is a side elevation view of the test clip of Figure 1; Figure 3 is a sectional view of the test clip of Figure 2; Figure 4 is a plan view of the test clip of Figure 2; Figure 5 is an enlarged view of a portion of the test clip of Figure 3, showing it engaged with an integrated circuit device; Figure 5A is a sectional view of a portion of the flat flexible cable assembly of Figure 5; Figure 6 is an enlarged view of a portion of the test clip of Figure 5, but without an integrated circuit device; Figure 7 is a partially sectional bottom view of the test clip of Figure 2; Figure 8 is a partial isometric view of the flat flexible cable of Figure 5; Figure 9 is a sectional isometric view of a portion of the test clip housing of Figure 3; Figure 10 is a view of a portion of a test clip of Figure 3, showing it in the process of engaging the integrated circuit device; Figure 11 is a view taken on the line 11 -11 of Figure 10, but showing only a portion of the test clip; Figure 12 is a view similar to that of Figure 10, but with the test clip fully installed on the integrated circuit device; Figure 13 is a view similar to that of Figure 11, but with the test clip fully installed on the integrated circuit device; Figure 14 is a rear view of a flat flexible cable assembly constructed in accordance with another embodiment of the invention; Figure 15 is a sectional view of a test clip constructed in accordance with another embodiment of the invention, and shown in conjunction with an integrated circuit device, with the left half of the figure showing the test clip fully installed and the right half showing the test clip only partially installed; Figure 16 is a sectional view of a test clip constructed in accordance with another embodiment of the invention in conjunction with an integrated circuit device, with the test clip fully installed; and Figure 17 is similar to that of Figure 16, but with the test clip only partially installed on the integrated circuit device. Figure 1 shows a test clip 10 of the present invention, which can be lowered onto a surface mounted IC (integrated circuit) device 12. The IC device has been mounted on an IC-holding circuit board device 14 of electronic equipment. The particular IC device is a CQFP (ceramic quad flat pack) IC device which includes fifty two leads 16 projecting horizontally from a body 18, including thirteen leads projecting from each of the four sides 21 - 24 of the body. As shown in Figure 3, the test clip includes a clip housing 30 with locating walls 32 that engage the body of the IC device, to accurately locate the test clip with respect to the body of the IC device. The clip has a plurality of lead-engaging contacts 34 which engage the leads of the IC device. The lead-engaging contacts 34 are electrically coupled to connector contact elements 36 of a header or connector 38. The connector 38 lies on a test clip interconnect circuit board 40 which is, in turn, mounted on the clip housing 30. As shown in Figure 5, the lead-engaging contacts 34 are formed by the conductors 50 of a flat flexible cable 52. As shown in Figure 5A, the cable 52 includes insulation 53 formed by at least one layer 54, and preferably also a second layer 56, of flexible insulative material. A plurality of parallel conductors such as 50A, 50B, etc. are mounted on the insulation and sandwiched between the two layers thereof. The flexible insulation material of insulation 53 is thin and of low resilience, so that it and the copper conductors therein can be easily bent and so they tend to retain the bend. Referring to Figure 6, the conductors 50 have lower ends 58 that serve as the lead-engaging contacts 34 to engage the leads 16 (Figure 5) of the IC device 12. The leads 16 generally have horizontal top and bottom parts that are connected by a largely vertical part 60, and the cable conductor lower ends 58 engage the lead parts 60. The insulation 53 of the flexible cable is terminated below the location 62 to leave the conductors 50 exposed below the locations 62, although it is only necessary that the inner surfaces 64 of the conductors be exposed. As mentioned above, the copper conductors 50 are flexible but are not very resilient. A stiffener 70 is applied to the outer side 72 of the flexible cable, with the stiffener having a lower portion 74 which backs up the lower ends 58 of the conductors. The stiffener 70 is formed of a sheet of resilient material which is stiffer than, and preferably more than twice as stiff, as the combined layers of insulation of the cable 52, That is, when the cable assembly, including the stiffener undergoes a given deflection such as 0.5mm during engagement with a lead part, the assembly offers a resistance to such deflection which is more than three times the resistance offered in the absence of the stiffener. The stiffener resiliently resists bending, to press the conductor lower ends 58 firmly against the largely vertical parts 60 of the IC device leads 16. It would be possible to construct the cable insulation 53 of thick highly resilient material, and to expose the lower ends of only the inner sides of the conductors. However, such highly resilient material might be difficult to handle in a highly bent condition, such as where it is bent to a 90° angle, and it is also possible that such highly resilient material would crack when maintained at such a sharp bend. Also, it is difficult to remove insulation on only one side of the conductors. Instead, it is preferable to remove insulation from around the entire lower ends of the conductors, and then attach the stiffener to the cable as shown. It is desirable that each conductor lower end press against a lead part with a force of about fifty grams (where the leads are spaced 1mm apart). The lower portion 74 (Figure 6) of the cable extending below the hood-supported location, is of a height to supply 650 grams force after deflection to the position 74A, to supply the desired force for thirteen conductors. The use of the flat flexible cable 52 (Figure 5) facilitates connection of the cable conductors 50 to the contact elements 36 of the connector 38 that is mounted on the circuit board 40. The circuit board 40 is formed with a row of conductive pads 80 on its lower surface 82, the pads 80 being connected by means of plated-through holes 84 and conductive traces 86 on the upper surface 88 of the board to the contact elements 36. The flat cable 52 is bent by an angle of about 90° at 90, With the upper ends 92 of the conductors 50 also being exposed, at least at their upper surfaces. The upper ends 92 of the conductors press against the conductive pads 80 on the circuit board, and may be soldered thereto. Thus, the conductors of the flat cable 52 not only form the lead-engaging contacts 34, but also carry signals to the circuit board 40 on which the connector 38 is mounted. The test clip housing 30 includes a hood 100 with a lower portion 102 that lies against the outer surface of the stiffener 70 to "back it up" and maintain the stiffener 70 in a vertical plane. The hood also has an upper portion 104 that lies under and supports the circuit board 40 on the housing. The hood upper portion 104 supports the horizontal upper portion 106 of the cable and presses the cable conductor upper ends 92 against the conductive pads 80 on the circuit board. It is possible to rely solely on the pressure of the hood against the circuit board to assure electrical connection between the conductors and the conductive pads 80, although soldering can increase the reliability of the connection. Figure 3 shows that the clip housing 30 includes a centre part 110 which comprises a base 112 of square cross section and a pair of panels 114, 116 mounted at opposite sides of the base. Figure 9 shows a sectional view of the centre part 110, showing that it includes the rigid base 112 and the pair of panels 114, 116 mounted on the base. The base has two pairs of locating walls or legs 121 - 124 which locate the clip housing against two opposite sides of the IC device body. Each of the panels 114, 116 has a pair of locking fingers 131 - 134 which locate the test clip on two other opposite sides of the IC device body, and which also lock the test clip to the device body to resist removal of the test clip. Figures 10 and 11 show the test clip as it approaches a final position, with the locking finger at 132A being deflected from its initial orientation at 132 by the body 18 of the IC device. The finger at 132A is also guiding the test clip so the lower ends of the cable conductors (not shown in this figure) engage the largely vertical lead part 60 of the IC device. The locating legs such as 123 of the base of the housing central part, are also accurately positioning the test clip on the IC device. Figure 12 shows the clip in the fully installed position, where the fingers such as 132 have deflected under a lower portion 18L of the IC device body to lock the clip in place. As shown in Figure 3, the panels such as 114 are mounted on the base 112 by screws 140 at a location spaced considerably above the bottom of the panels. This allows the panels to flex to allow the locking fingers such as 132 to readily deflect. As shown in Figure 9, the centre portion 110 of the clip housing forms vertically extending edge portion such as 142, 144 which closely receive corresponding flexible cable assemblies such as assembly 150. Each assembly 150 includes the cable 52 with the stiffener 70 thereon. The width of the groove formed between the edge portions, in the direction parallel to the width of the cable 52, is slightly less than the width of the cable. The cable assembly can be installed by pressing it in place until the inner surface of the cable lies against a large area flat wall 146. The cable assembly 150 is trapped between the opposite side edges 142 of the groove which preferably have outer tips that are angled slightly toward each other. As shown in Figure 6, the hood 100 has a lower portion 152 which lies closely around the cable assembly 150 to retain it in the centre part 110 of the clip housing. The hood has a lower edge at 154 which can engage the stiffener 70, so that only the stiffener portion below the location 154 flexes outwardly. As shown in Figure 3, most of the clip parts are formed of plastic, with the metal parts comprising the conductors of the cable, the connector contact element 36, traces on the circuit board 40, and screws 160 of the circuit board. The parts are assembled by first forcing a metal insert 162 upwardly through a hole in the central part 110 of the housing up to the position shown. The circuit board 40 and hood 100 are placed in position and screws 160 installed. Finally, a handle 164 is installed by screwing it into the insert 162, the handle holding down the circuit board 40 and serving as the handle to hold and manipulate the test clip. In a test clip that applicant has constructed, for use with the IC device 12 which has thirteen leads on each of four sides spaced at a pitch of 1mm, the overall width of the test clip was 4.3cm, and the sizes of the other parts were as proportionately shown in Figure 3. As indicated in Figure 7, the test clip has a vertical axis 170 and has first and second vertical centre planes 172, 174, each extending through the vertical axis 170. Those parts whose surfaces face largely towards the axis 170 or towards a corresponding one of the centre planes 172, 174 can be considered the inner surfaces, while those which face away can be considered the outer surfaces. The test clip is symmetrical about the plane 172 and is symmetrical about the plane 174, and includes four flat flexible cable assemblies. it should be noted that while terms such as "vertical", "horizontal", "upper", "lower", etc. have been used herein to aid in the description of the invention, the test clip can be used in any orientation with respect to gravity. Figure 14 illustrates a portion of a modified stiffener 70X which has a lower portion 74X with multiple slots 75 dividing the lower portion into a plurality of fingers 77. The stiffener 70X is used in place of the stiffener 70 of Figure 6, and is positioned so each stiffener finger 77 lies against one of the conductor lower ends 58. The modified stiffener 70X allows each conductor lower end to flex more easily, but requires precise placement of the stiffener on the cable. Figure 15 illustrates another test clip 180, with the right side of the figure showing the test clip at 180A in an open or upper position prior to full engagement with the iC device 12, and with the left side showing the clip at 180B in the fully engaged or closed position. The test clip includes a housing 182 with a lower portion having locating and locking walls that position the housing accurately on the body 18 of the IC device. Flat flexible cables such as 186, 188 have middle parts that are fixed to the housing by a ring 190. A hood device 192 is permanently attached to a circuit board assembly 194, and both are movable up and down. The cable has an upper end 196 which is trapped between an upper portion 198 of the hood device and the circuit board. The cable upper end has exposed conductors engaged with conductive traces on the lower surface of the circuit board assembly, which connect to contact elements 200 of a connector 202 on the circuit board. The cable has a lower end 204 where the conductors are exposed and preferably backed by a stiffener sheet, with the ring 190 and housing centre bending the cable so the lower end 204 tends to extend away from the largely vertical lead part 60. When the hood is moved down as shown at 180B, a lower end 206 of the hood deflects the lower end 204 of the cable assembly against the lead part 60. Figure 17 shows another test clip 210 which is shown in the open position at 210A. Each flat flexible cable 212 includes a stiffener that urges it away from engagement with IC device lead parts 60. However, when a hood 214 is moved downwardly, as shown in Figure 16, a lower part 216 of the hood deflects a lower part 218 of the cable assembly against the lead part 60. In this embodiment of the invention, the upper end 220 of the cable assembly 212 does not move with respect to a connector 222 to which it is connected. The insulative body 224 of the connector serves as an interconnect circuit board on which connector elements 226 are mounted which connect to the flat cable conductors. Thus, the invention provides a test clip with contacts for engaging the leads extending from the sides of an integrated circuit device, which may be of low cost and which may be more easily constructed to engage leads at a fine pitch such as 1mm, 0.5mm and less. This is accomplished by the use of a flat flexible cable which is mounted on the housing of the test clip and whose lower end includes conductors with at least their inner surfaces exposed to directly contact the leads of the IC device to serve as contacts that engage the leads. While the cable includes insulation of flexible material, the resilience of the lower ends of the conductors is enhanced by attaching a stiffener to the cable, with the stiffener being in the form of a resilient sheet lying on the outer side of the cable and preferably directly against the outer side of the conductor lower ends to resiliently resist deflection of the conductor lower ends. The cable is preferably bent so its upper end extends largely horizontally and the upper ends of the conductor lie horizontally against the conductive pads on the lower surface of a circuit board. The test clip housing can be accurately positioned with respect to the body of the integrated circuit device by locating walls which engage the corners of the body. The corners can include locking fingers mounted on a separate panel, which can readily deflect by bending of the panel, to pass downwardly across the body of the IC device and position a bottom of the finger under the outside of the body.

Claims: A test clip which can test an integrated circuit device (12) having a device body (18) with a body upper portion of predetermined size and a body bottom that can rest substantially on a face of an IC holding circuit board device (14) and also having a plurality of leads (16) extending from each of a plurality of sides (21 - 24) of the body with each lead having an outer lead part (60) extending at least partially downwardly toward the IC circuit board, the test clip including a clip housing (30) with locating walls (121-124) that closely engage the circuit device body (18) to locate the housing (30) with respect to the device body (18), at least one connector (38) having a plurality of contact elements (36), and a plurality of lead-engaging contacts (34) mounted on the clip housing (30) and having lower portions that can each be resiliently biased against one of the outer lead parts (60), wherein a flat flexible cable (52) is mounted on the clip housing (30), the cable (52) having a flexible insulative material (53) and a plurality of parallel conductors (50A,50B,50C) mounted on the insulative material (53), the conductors having lower ends (58) that have inner surfaces (64) which are exposed to enable them to directly engage the outer lead parts (60) and that form said lead-engaging contacts (34), the conductors (50A,50B,50C) having upper ends (92) that are connected to the connector contact elements (36). A test clip as claimed in claim 1 including a test clip circuit board assembly mounted on the clip housing (30) to lie in a horizontal plane thereon, including a test clip interconnect circuit board (40) having upper (88) and lower (82) surfaces, said at least one connector (38) being mounted on the board upper surface (88), a plurality of conductive pads (80) arranged in a row on the board lower surface (82), and a plurality of conductive traces (86) on the board upper surface (88) each of which traces connects one of the pads (80) to one of the connector contact elements (36), said cable (52) having a middle (90) and an upper end (92), the middle (90) being bent so that the upper end (92) lies facewise against the test clip board lower surface (82), the cable conductor upper ends (92) having exposed upper surfaces which engage the conductive pads (80), to thereby connect each lead to one of the connector contacts elements (36). A test clip as claimed in claim 1 or 2, wherein the clip housing (30) includes a centre part (110) with a lower end (112) forming the locating walls (121-124) that closely engage the circuit device body (18), the centre part (110) having at least one vertically extending surface (146) with opposite sides and vertical edge portions (142) projecting from said opposite sides, with said vertical edge portions (142) spaced apart by slightly less than the width of said flat flexible cable (52), the cable having its lower portion lying against the vertically extending surface (146) and trapped between the edge portions (142). A test clip as claimed in claim 1 or 2, wherein the clip housing (30) includes a centre part (110) with a lower end forming the locating walls (121-124) that closely engage the circuit device body (18), the centre part (110) having a wide vertically extending surface (146), and the flexible cable (52) having a portion mounted facewise against the vertically extending surface (146), the lower end including a base (112) having opposite sides and forming said plurality of said locating walls (121-124), and the centre part (110) also including a pair of panels (114,116) lying on opposite sides of the base (112), each panel (114,116) having a thickness less than one half the thickness of the base (112) and having an upper portion mounted thereon, and each panel (114-116) having a lower end forming at least one locking finger (131-134) with a bottom extending below the middle of the height of the circuit board body when the test clip lies on the circuit board body, with each of the locking fingers (131-134) positioned to be deflected away from the IC device body (18) as the test clip is moved down against the integrated circuit device (12), whereby to use the resilience of the panels to lock the clip housing to the integrated circuit device (12). A test clip as claimed in any one of claims 1 to 4 including a stiffener (70) comprising a sheet of resilient material which is stiffer than the cable flexible insulative material (53), the stiffener (70) being attached to the cable (52) and having a lower portion (74) laying on a side of the conductor lower ends (58) opposite the inner surfaces (64) of the conductor (50) to bias the conductor lower ends (58) toward the lead parts (60). A test clip as claimed in claim 5, wherein the stiffener (70) has a lower end portion (74X) divided into a plurality of separate fingers (77), with each finger pressing against only one of the conductor lower ends (58). A test clip as claimed in claim 5 or 6, wherein the clip housing (30) has a vertical axis (170) and has a first imaginary centre plane (172) extending through the vertical axis (170) and extending parallel to the parallel conductors (50A,50B,50C) of the cable (52) when the test clip is viewed from the bottom, the stiffener (70) having an upper portion lying above the lower stiffener portion (74), and the clip housing (30) includes a rigid hood (100) that lies immediately outside the stiffener upper portion to prevent its deflection away from the first imaginary centre plane (172), and which extends down to a location at the top of the stiffener lower portion (74), to allow outward deflection of a conductor lower end (58) only by bending of the stiffener lower portion with respect to the stiffener upper portion. A test clip as claimed in claim 5 or 6, wherein the stiffener (70) has an upper portion mounted at a fixed position on the clip housing (30), at which the stiffener lower portion (74) holds the contact lower ends away from the outer lead parts and wherein, a rigid hood (100) acting as a deflector is mounted on the clip housing and movable between first and second positions, with the deflector having a lower part (154) that, when the deflector is moved to the second position, bends the stiffener to move the conductor lower ends (58) against the outer lead parts (60). A test clip as claimed in claim 1, including an interconnect circuit board (40) mounted on the clip housing (30) to lie in a substantially horizontal plane thereon, the interconnect circuit board (40) having a lower face (82) having a row of conductive pads (80) and the connector (38) being mounted on the interconnect circuit board (40) with the contact elements (36) connected to the conductive pads (80) and wherein the flexible cable (52) is bent and has an upper end (92) extending horizontally under the interconnect circuit board, with the conductors (50A,50B,50C) having upper surfaces exposed at the cable upper end (92) and engaged with the conductive pads (80), and a hood (100) presses the cable upper end up substantially against the interconnect circuit board lower face (82). A test clip as claimed in any one of the preceding claims, wherein the lower ends (58) of the conductors (50A,50B,50C) are free to deflect outwardly and with the insulative material (53) lying on the outer side of the conductors near their lower ends (58) being free to deflect outwardly. A method of electrically connecting a test clip (10) to two rows of leads (16) at opposite sides of an integrated circuit device (12) that has a device body (18), wherein each row of leads (16) has largely vertical outer lead parts (60), the test clip being obtained by constructing it with a housing (30) having walls (121-124) designed closely to engage the device body (18) an with at least one connector (38) having multiple connector contact elements (36) on the housing (30), mounting a flat flexible cable (52) with upper and lower ends on the test clip housing (30), the cable having a layer of flexible insulative material (53) and a plurality of parallel conductors (50A,50B,50C) having exposed lower (58) and upper (92) ends, with the conductor upper ends (92) electrically connected to the connector contact elements (36), and the conductor lower ends (58) forming opposite rows of contacts of the test clip and having inner surfaces (64) positioned to press against the outer lead parts (60), said method further including the step of moving the test clip down against the integrated circuit device body (18) so that the locating walls (121 - 124) closely engage the device body and the lower contact ends (58) wipe across the outer lead parts (60). A method as claimed in claim 11 wherein, in constructing the test clip, the layer of flexible insulative material (53) is substantially non-resilient, and a stiffener (70) is attached in the form of a sheet of resilient flexible material which has more than twice the stiffness per unit area compared with said cable flexible insulative material, to an outer side of the cable (52), so that a lower portion (74) of the stiffener lies substantially against outer surfaces of the conductor lower ends (58). A method as claimed in claim 11 or 12, including mounting on the clip housing, an interconnect circuit board (40) having upper (88) and lower (82) surfaces and at least one row of conductive pads (80) on said lower surface (82), and wherein the construction of the test clip includes mounting the connector (38) on the interconnect circuit board (40) with the connector contact elements (36) connected to the conductive pads (80), the step of mounting the flat flexible cable (52) including bending and positioning the cable so that the upper end (92) extends substantially horizontally and the conductors (50A,50B,50C) at the cable upper end lie against and connect to the conductive pads (80) on the circuit board lower surface (82).

Inventors: BALYASNY MARIK, BALYASNY, MARIK
Applicants: ITT MFG ENTERPRISES INC, ITT MANUFACTURING ENTERPRISES, INC.
Application year: 1992
Main classification: G01R1
IPC codes: G01R1, G01R31