Positive type light-senstitive composition

Abstract: A positive type light-sensitive composition having less layer shrinkage by baking after exposing, less layer decrease in developing, a good profile and a high resolution comprises: (a) a resin which is insoluble in water and soluble in an alkaline aqueous solution, (b) a compound which generates acid by irradiation with active rays or radial rays, and (c) an acid decomposable dissolution inhibitor, having a molecular weight of not more than 3,000 and having groups decomposable by the action of the generated acid to increase the solubility of said inhibitor in an alkaline developing solution, wherein said inhibitor (c) is at least one compound selected from the group consisiting of (i) compounds having two of said acid decomposable groups which are separated by 10 or more bonded atoms excluding the atoms constituting the acid decomposable groups, or (ii) compounds having at least three of said acid decomposable groups, and two of said groups which are at the farthest positions are separated by 9 or more bonded atoms excluding the atoms constituting the acid decomposable groups.

Description: The present invention relates to a positive type light-sensitive composition which can be used in the manufacturing of a lithographic printing plate or a semiconductor such as an integrated circuit (IC), or in the manufacturing of a circuit board for a liquid crystal, a thermal head and other devices made by photofabrication. A composition containing an alkali soluble resin and a naphthoquinonediazide compound as a light-sensitive substance are generally used as a positive type photoresist composition. For example, a novolak type phenol resin/naphthoquinonediazide-substituted compound is disclosed in US-A-3,666,473, 4,115,128 and 4,173,470. An example of a (novolak resin consisting of cresol-formaldehyde)/trihydroxybenzophenone-1,2-naphthoquinonediazide sulfonic acid ester is disclosed in Introduction to Microlithography written by L.F. Thompson (ACS Publication, No. 219, pp. 112 to 121). In such a novolak type photoresist consisting of a novolak resin and a quinoneazide compound, the novolak resin provides high durability to a plasma etching, and the naphthoquinonediazide compound acts as an dissolution inhibitor agent. Naphthoquinonediazide has the characteristic that it loses dissolution inhibiting capability and increases alkali solubility of a novolak resin when it is subjected to light irradiation to generate carboxylic acid. Many positive type photoresists containing the novolak resin and naphthoquinonediazide type light-sensitive material have been developed and put into practical use, and sufficient results have been obtained in line width processing of about 0.8 to 2 µm. In an integrated circuit, however, integration is being increased more and more, and in the manufacturing of a semiconductor substrate such as ultra LSI(large scale integration), there is a need to process an ultra fine pattern consisting of a line width not more than 0,5 µm. In order to achieve this needed resolution, the wavelength used in exposing equipment for photolithography is shifted more and more to a shorter wavelength, and recently, far ultraviolet rays and eximer laser rays (XeCl, KrF and ArF) have been investigated. The use of a resist consisting of a conventional novolak resin and a naphthoquinonediazide compound for forming a lithographic pattern using far ultraviolet rays or eximer laser rays makes it difficult for the rays to reach the bottom of the resist because of strong absorption by the novolak resin and naphthoquinonediazide in the far ultraviolet region and only a low sensitive and tapered pattern can be obtained. One of the means for solving such a problem is a chemical sensitization series resist composition described in US-A-4,491,628 and EP-A-249,139. A chemical sensitization series positive type resist composition is a pattern forming material in which acid is generated in an exposed portion by irradiation with, for example, far ultraviolet rays, and the solubilities of the irradiated portion and the nonirradiated portion with an active radial rays in a developing solution are changed by the reaction in which the acid is used as a catalyst to form a pattern on a substrate. For example, the combination of a compound generating acid by photodecomposition with acetal or an O - or N-acetal compound is described in JP-A-48-89003(US-A-3,779,778; the term"JP-A" as used herewith means an unexamined Japanese patent application), the combination with an orthoester or an amidacetal compound is described in JP-A-51-120714 (US-A-4,101,323), the combination with a polymer having an acetal or ketal group on a principal chain is described in JP-A-53-133429 (US-A-4,247,611), the combination with an enol ether compound is described in JP-A-55-12995 (US-A-4,248,957), the combination with an N-acylimino-carbonate compound is described in JP-A-55-126236 (US-A-4,250,247), the combination with a polymer having an orthoester group on a principal chain is described in JP-A-56-17345 (US-A-4,311,782), the combination with a tertiary alkyl ester compound is described in JP-A-60-3625, the combination with a silyl ester compound is described in JP-A-60-10247, and the combination with a silyl ether compound is described in JP-A-60-37549 and JP-A-60-121446 (these publications correspond to US-A-4,752,552). These combinations have quantum yields theoretically exceeding 1 and therefore, they show high light-sensitivity. Similarly, there are systems which are decomposed by heating in the presence of acid to become alkali soluble while stable over time at room temperature. Examples thereof include combined systems of compounds generating acids by exposing and esters having tertiary or secondary carbons (for example, t-butyl and 2-cyclohexenyl) or carbonic acid esters, described in, for example, JP-A-59-45439 (US-A-4,491,628), JP-A-60-3625, JP-A-62-229242 (US-A-4,837,124 and 4,968,581), JP-A-63-27829 (EP-A-249139), JP-A-63-36240 (US-A-4,939,070), and JP-A-63-250642 (EP-A-284868), Polym. Eng. Sci. , vol. 23, pp. 1012 (1983), ACS. Sym. vol. 242, pp. ll (1984), Semiconductor World, November 1987, pp. 91, Micromolecules , vol. 21, pp. 1475 (1988), and SPIE, vol. 920, pp. 42 (1988). These systems also have high sensitivities and have small absorptions in the deep-UV region compared with a naphthoquinonediazide/novolak resin system. Accordingly, they can become an effective system for shifting the wavelength of a light source to a shorter wavelength as described above. The above positive type chemical sensitization resist can be classified roughly as (i) a three component system consisting of an alkali soluble resin, a compound generating acid upon exposure with radial rays (a photo acid generating agent) and a dissolution inhibitor used for an alkali soluble resin and having a group decomposable with acid and (ii) a two component system consisting of a resin having a group which is decomposed by the reaction with acid to become alkali soluble and a photo acid generating agent. In case of the two component system, there has been a problem that the resist layer shrinks by baking after exposure because of the increase in the content of an acid decomposition group in the resin. Also, in the three component system, there has been a problem that the decrease in a layer during development becomes large because of an insufficient dissolution inhibiting performance with respect to an alkali soluble resin, which markedly deteriorates the resist profile. The three component system, however, is a favorable system since there is a large selection of raw materials therefor, and therefore, the development of an acid decomposable compound having an excellent dissolution inhibitor performance, which can be used in this system, is needed. EP-A-424124 discloses a positive-acting photoresist composition comprising: (i) an alkali-soluble binder comprising a plurality of phenol groups, (ii) an iodonium salt of the general formula: in which: Ar 1 and Ar 2 independently represent aromatic or heteroaromatic groups comprising of up to 10 ring atoms, which groups may optionally be linked together to include the iodine atom within a ring structure and, X - is an anion such that HX is an acid of pKa not greater than 3, and (iii) an acid cleavable compound having a nucleus of general formula (I): in which: n is 0, 1, 2 or 3, each R 1 , R 2 and R 3 independently represents hydrogen or an alkyl group comprising up to 4 carbon atoms, R 4 and R 5 independently represent hydrogen or one or more ring substituents selected from Cl, Br, F, alkyl groups comprising up to 4 carbon atoms, alkoxy groups comprising up to 4 carbon atoms and combinations thereof, and A represents a bond or a divalent linking group containing up to 10 atoms other than hydrogen. Said compositions are intended primarily for use in the preparation of lithographic printing plates. Moreover EP-A-445819 discloses a positive type photoresist composition which comprises a quinonediazide compound, an alkali-soluble resin and certain polynuclear polyphenol compounds and which exhibits excellent sensitivity, percent film retention, resolution, heat resistance, resist shape and developability. US-A-4,816,375 discloses a photosolubilizable composition containing an acid generator such as a sulfonium salt and an acid decomposable dissolution inhibitor, which can be used for photoresist compositions comprising alkali-soluble resins. The dissolution inhibitor may contain two or more silyl ether or silyl ester groups and these silyl ether or silyl ester groups may be separated by 10 or more bonded atoms. An object of the present invention is to provide a positive type light-sensitive composition having less layer shrinkage by baking (if it is conducted) after exposing, less layer decrease in developing, a good profile and high resolution. Taking note of the above various characteristics, the intensive investigations made by the present inventors have resulted in finding that the object of the present invention can be achieved by a positive type chemical sensitization system comprising an alkali soluble resin, a specific photo acid generating agent and a dissolution inhibitor having an acid decomposable group, wherein a low molecular weight compound satisfying the following conditions is used as the dissolution inhibitor to reach the present invention. That is, the present invention provides a positive type light-sensitive composition comprising: (a) a resin which is insoluble in water and soluble in an alkaline aqueous solution, (b) a compound which generates acid by irradiation with active rays or radial rays as further specified below, and (c) an acid decomposable dissolution inhibitor, having a molecular weight of not more than 3,000 and having groups decomposable by the action of the generated acid to increase the solubility of said inhibitor in an alkaline developing solution, wherein said inhibitor (c) is at least one compound selected from (i) compounds having two of said acid decomposable groups which are separated by 10 or more bonded atoms excluding the atoms constituting the acid decomposable groups, or (ii) compounds having at least three of said acid decomposable groups, and two of said groups which are at the farthest positions are separated by 9 or more bonded atoms excluding the atoms constituting the acid decomposable groups, wherein said acid decomposable group contains -COOA 0 or -OB 0 as further specified below. The three component series positive type light-sensitive composition of the present invention consists fundamentally of an acid decomposable dissolution inhibitor agent, an alkali soluble resin and a certain photo acid generating agent. The acid decomposable dissolution inhibitor controls dissolving of the alkali soluble resin in an alkaline aqueous solution, and the acid decomposable group is deprotected by acid generated by exposing to accelerate solubility of the resin in an alkaline aqueous solution. Dissolution inhibitors in which the skeletons thereof consist of naphthalene, biphenyl and diphenyl cycloalkane are disclosed in JP-A-63-27829 and JP-A-3-198059. However, they have a small dissolution inhibitor performance to an alkali soluble resin and therefore are insufficient in profile and a resolution. The compounds used in the present invention will be explained below in detail. Acid decomposable dissolution inhibitor [the component (c) of the composition of present invention] The acid decomposable dissolution inhibitor used as the component (c) in the present invention is a compound having two groups which can be decomposed by acid in the structure thereof, in which the two acid decomposable groups are separated by at least 10, preferably at least 11 and further preferably at least 12 bonded atoms excluding the atoms constituting the acid decomposable groups, or the compound having at least three acid decomposable groups, in which two of the acid decomposable groups at the farthest positions are separated by at least 9, preferably at least 10 and further preferably at least 11 bonded atoms excluding the atoms constituting the acid decomposable groups. The acid decomposable groups are preferably separated by not more than 50 bonded atoms and more preferably by not more than 30 bonded atoms. The number of the bonded atoms is counted in the direction so that the number of the bonded atoms becomes smallest. In the present invention, it has been found that if in the acid decomposable dissolution inhibitor which has three or more, preferably four or more acid decomposable groups, or also in the compound having two acid decomposable groups, the acid decomposable groups are separated from each other by some fixed distance, the dissolution inhibitor performance to the alkali soluble resin is markedly improved. The distance between the acid decomposable groups in the present invention is shown by the number of the bonded atoms present therebetween excluding the atoms constituting the acid decomposable groups. For example, in case of the following compounds (1) and (2), the distance between the acid decomposable groups each corresponds to four bonded atoms, in case of the compound (3), it corresponds to twelve bonded atoms, and in the case of the compound (4), it corresponds to eleven bonded atoms. The acid decomposable group contains -COOA 0 or -OB 0 . The groups -O-B 0 and -COO-A 0 are acid decomposable groups which become -OH and -COOH, respectively, by an action of the acid generated from the photo acid generating agent. A 0 and B° are defined below. The acid decomposable dissolution inhibitor may have plural acid decomposable groups on one benzene ring, but it is preferable that the compound is composed of a skeleton having one acid decomposable group on one benzene ring. Further, the molecular weight of the acid decomposable dissolution inhibitor of the composition of the present invention is 3000 or less, preferably 500 to 3000, and further preferably 1000 to 2500. In the preferred embodiment of the present invention, -R 0 (COO-A 0 ) n' (n'≥1) or -Ar-O-B 0 can represent the acid decomposable group containing a -COO-A 0 or -O-B 0 group, wherein A 0 represents a -C(R 01 )(R 02 )(R 03 ), or -C(R 04 ) (R 05 )-OR 06 group; B 0 represents a A 0 or -COO-A 0 group; R 01 , R 02 , R 03 , R 04 and R 05 each may be the same or different and each represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, or substituted groups thereof, and R 06 represents an alkyl group, an aryl group, or substituted groups thererof, provided that at least two of R 01 to R 03 each are groups other than a hydrogen atom and provided that two of R 01 to R 03 and R 04 to R 06 may be combined with each other to form a ring; R 0 represents a di- or more valent (e.g., trivalent) aliphatic or aromatic hydrocarbon group (e.g., alkylene, arylene) which may have a substituent; and Ar represents a monocyclic or polycyclic, di- or more valent aromatic group which may have a substituent. The preferred alkyl group has 1 to 4 carbon atoms (e.g., methyl, ethyl, propyl, n-butyl, sec-butyl and t-butyl), the preferred cycloalkyl group has 3 to 10 carbon atoms (e.g., cyclopropyl, cyclobutyl, cyclohexyl, and adamantyl), the preferred alkenyl group has 2 to 4 carbon atoms (e.g., vinyl, propenyl, alkyl and butenyl), and the preferred aryl group has 6 to 14 carbon atoms (e.g., phenyl, xylyl, toluyl, cumenyl, naphthyl and anthracenyl). In the present invention the number of carbon atoms includes that of the substituent on the group. Examples of the substituents for R 0 , R 01 , to R 06 and Ar include a hydroxy group, a halogen atom (e.g., fluorine, chlorine, bromine and iodine atoms), a nitro group, a cyano group, an alkyl group described above, an alkoxy group (e.g., methoxy, ethoxy, hydroxyethoxy, propoxy, hydroxypropoxy, n-butoxy, isobutoxy, sec-butoxy, and t-butoxy), an alkoxycarbonyl group (e.g., methoxycarbonyl and ethoxy carbonyl), and aralkyl group (e.g., benzyl, phenethyl, and cumyl), an aralkyloxy group (e.g., benzyloxy), an acyl group (e.g., formyl, acetyl, butyryl, benzoyl, and valeryl), an acyloxy group (e.g., butyryloxy and benzoyloxy) an alkenyl group as described hereinabove, an alkenyloxy group (e.g., vinyloxy, propenyloxy, allyloxy and butenyloxy), an aryl group as described hereinabove, an aryloxy group (e.g., phenoxy), and an aryloxycarbonyl group (e.g., phenyloxycarbonyl). The group represented by -COOA 0 or -OB 0 is preferably a cumyl ester group, an acetal group, a tetrahydropyranyl ether group, an enol ether group, an enol ester group, a tertiary alkyl ether group, a tertiary alkyl ester group, or a tertiary alkyl carbonate group. It is more preferably a tertiary alkyl ester group, a tertiary alkyl carbonate group, a cumyl ester group, or a tetrahydropyranyl ether group. Preferably the compounds are prepared by bonding the group shown above, i.e., a -R 0 (COO-A 0 ) n' group or a B 0 group for protecting, to a part or all of the phenolic OH groups of the polyhydroxy compounds described in JP-A-1-289946, JP-A-1-289947, JP-A-2-2560, JP-A-3-128959, JP-A-3-158855, JP-A-3-179353 (EP-A-416544), JP-A-3-191351 (EP-A-458988), JP-A-3-200251, JP-A-3-200252 (US-A-5,112,719), JP-A-3-200253, JP-A-3-200254, JP-A-3-200255, JP-A-3-259149, JP-A-3-279958 JP-A-3-279959 JP-A-4-1650, JP-A-4-1651, JP-A-4-11260, JP-A-4-12356, JP-A-4-12357, JP-A-4-271349, Japanese Patent Application 3-230790, Japanese Patent Application 3-320438, Japanese Patent Application 4-25157, Japanese Patent Application 4-52732, Japanese Patent Application 4-103215, Japanese Patent Application 4-104542, Japanese Patent Application 4-107885, Japanese Patent Application 4-107889 and Japanese Patent Application No. 4-152195. The polyhydroxy compounds described in JP-A-1-289946, JP-A-3-128959, JP-A-3-158855, JP-A-3-179353 (EP-A-416,544), JP-A-3-200251, JP-A-3-200252 (US-A-5,112,719), JP-A-3-200255, JP-A-3-259149, JP-A-3-279958/ JP-A-4-1650, 4-11260, JP-A-4-12356, JP-A-4-12357, Japanese Patent Application 4-25157, Japanese Patent Application 4-103215, Japanese Patent Application 4-104542, Japanese Patent Application 4-107885, Japanese Patent Application 4-107889, and Japanese Patent Application No. 4-152195 are more preferred. The compounds represented by Formulas (I) to (XVI) are preferably used as the compound (c). In the following formulas the groups containing the acid decomposable group (-COOA 0 or -OB 0 ) should be positioned so that the number of the bonded atoms satisfies the definitions disclosed hereinabove. In the above formulas, R 1 , R 2 , R 3 R 4 are the same or different, and each represents a hydrogen atom, a -R 0 (COO-A 0 ) n' (n'≥1) group or a B 0 group (R 0 ,A 0 and B 0 and n' have the same definitions as hereinbefore: the same also hereinafter) provided that at least two of groups represented by R 1 , R 2 , R 3 or R 4 each represents -R 0 (COO-A 0 ) n' (n'≥1) or B 0 ; R 1 represents -CO-, -COO-, -NHCONH-, -NHCOO-, -O-, -S-, -SO- , -SO 2 -, -SO 3 -, or wherein G is 2 to 6, provided that when G is 2, at least one of R 4 and R 5 is an alkyl group; R 4 and R 5 are t:he same or different, and each represents a hydrogen atom, an alkyl group, an alkoxy group, -OH, -COOH, -CN, a halogen atom, -R 6 -COOR 7 , or -R 8 -OH; R 6 and R 8 each represents an alkylene group; R 7 represents a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; R 2 , R 3 , R 9 to R 12 , R 15 , R 17 to R 21 , R 25 to R 27 , R 30 to R 32 , R 37 to R 42 , R 46 to R 49 , and R 51 are the same or different, and each represents a hydrogen atom, a hydroxy group, an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an aryl group, an aryloxy group, an aralkyl group, an aralkyloxy group, a halogen atom, a nitro group, a carboxyl group, a cyano group, or -N(R 13 )(R 14 ) where R 13 and R 14 each represents an alkyl group and an aryl group; R 16 represents a single bond, an alkylene group or wherein R 22 and R 24 are the same or different, and each represents a single bond, an alkylene group, -O-, -S-, -CO-, or a carboxyl group; and R 23 represents a hydrogen atom, an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an aryl group, a nitro group, a hydroxy group, a cyano group, a carboxyl group, -O-R 0 (COO-A 0 ) n' or -O-B 0 ; R 28 and R 29 are the same or different, and each represents a methylene group, a lower alkyl-substituted methylene group, a halomethylene group, or an alkoxymethylene group (in the present invention a lower alkyl group is an alkyl group having 1 to 4 carbon atoms); R 33 to R 36 are the same or different, and each represents a hydrogen atom or an alkyl group; R 43 to R 45 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxy group, an acyl group, or an acyloxy group; R 50 represents a hydrogen atom, -R 0 (COO-A 0 ) n' , -B 0 , or R 52 to R 53 are the same or different, and each represents a hydrogen atom, a lower alkyl group, a lower haloalkyl group, or an aryl group; R 54 to R 57 are the same or different, and each represents a hydrogen atom, a hydroxy group, a halogen atom, a nitro group, a cyano group, a carbonyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an aralkyl group, an aralkyloxy group, an acyl group, an acyloxy group, an alkenyl group, an alkenyloxy group, an aryl group, an aryloxy group, or an aryloxycarbonyl group; R represents -O-R 0 (COO-A 0 ) n' , -O-B 0 or a hydroxy group provided that at least two of the R groups each represents -O-R 0 (COO-A 0 ) n' or -O-B 0 and that groups represented by the same symbol may be not necessarily the same group; Y represents -CO- or -SO 2 -; Z and B each represents a single bond or -O-; A represents a methylene group, a lower alkyl-substituted methylene group, a halomethylene group, or an alkoxymethylene group; E represents a single bond or an oxymethylene group; When subscripts a to z and a1 to y1 are plural, the groups in parenthesis may be the same or different; a to q, s, t, v, g1 to i1, k1 to m1, o1, q1, s1, and u1 each represents 0 or an integer of 1 to 5; r, u, w, x, y, z, a1 to f1, p1, r1, t1, and v1 to x1 each represents 0 or an integer of 1 to 4; j1, n1, z1, a2, b2, c2, and d2 each represents 0 or an integer of 1 to 3, provided that at least one of z1, a2, b2, c2, and d2 is 1 or more; yl represents an integer of 3 to 8 Wherein (a+b), (e+f+g), (k+ℓ+m), (q+r+s), (w+x+y), (cl+dl), (gl+hl+il+jl), (ol+pl), and (sl+tl)≧2; (j1+n1)≦3; (r+u), (w+z), (x+al), (y+bl), (cl+el), (dl+fl), (pl+rl), (tl+vl), (xl+wl)≦4, but in formula (V), (w+z) and(x+al)≦5; and (a+c), (b+d), (e+h), (f+i), (g+j), (k+n), (1+o), (m+p), (q+t), (s+v), (gl+kl), (hl+ll), (il+ml), (ol+ql), and (sl+ul)≦5. wherein R 58 represents an organic group such as an alkylene group, an alkenylene group, an arylene group, a single bond, -S-, -SO-, or -(O=)S(=O)-; and R 59 represents a hydrogen atom, a monovalent organic group such as those recited hereinbefore as examples of substituents for R 0 , or R 60 to R 64 are the same or different and each represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, -O-R 0 (COO-A 0 ) n' or -O-B 0 , provided that at least two of R 60 to R 64 (each of the at least two groups may be positioned at any of the benzene rings in formula (XIII)) each represents -O-R 0 (COO-A 0 ) n' or-O-B 0 ; groups represented by the same symbols may be the same or different; X represents a divalent organic group, preferably a substituted or unsubstituted alkylene or arylene group; and e2 represents 0 or 1. R 65 to R 68 are the same or different, and each represents a hydrogen group, a hydroxy atom, a halogen atom, an alkyl group, an alkoxy group, or an alkenyl group; R 69 to R 70 represents a hydrogen atom, an alkyl group, or wherein R 5 represents a hydroxy group, a -O-R 0 (COO-A 0 ) n , group or a -O-B 0 group; and at least two of the R 5 groups each represents -O-R 0 (COC-A 0 ) n , or -O-B 0 ; f2 and h2 each represents 0 or 1; g2 represents 0 or an integer of 1 to 4; and the groups having the same symbols may be the same or different. wherein R 71 to R 77 are the same or different, and each represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, a nitro group, an alkenyl group, an aryl group, an aralkyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an acyloxy group, an acyl group, an aralkyloxy group, or an aryloxy group; and R 6 represents a hydroxyl group, a -O-R 0 (COO-A 0 ) n' group or a -O-B 0 group, and at least two of the R 6 groups each represents a -O-R 0 (COO-A 0 ) n' group or -O-B 0 group. wherein R 78 represents a hydrogen atom or an alkyl group; R 79 to R 82 represents a hydroxy group, a hydrogen atom, a halogen atom, an alkyl group, or an alkoxy group; R 7 represents a hydroxy group, a -O-R 0 (COO-A 0 ) n' group, or a -OB 0 group, at least two of the R 7 groups each representing a -O-R 0 (COO-A 0 ) n' group or a -O- B 0 group; and the groups having the same symbols may be the same on different. In the definitions for groups in formulae (I) to (XVI), the preferred carbon numbers and examples for an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, and substituents where specifically not explained are the same as those explained in the definitions for A 0 and B 0 hereinabove. Furthermore, in formulae (I) to (XVI), preferably, an aralkyl group has 7 to 11 carbon atoms (e.g., benzyl, phenethyl, and cumyl), an acyl group has 1 to 6 carbon atoms (e.g., formyl, acetyl, butyryl, benzoyl, and valeryl), an alkoxy group has 1 to 4 carbon atoms (e.g., methoxy, ethoxy, hydroxyethoxy, propoxy, hydroxypropoxy, n-butoxy, isobutoxy, sec-butoxy, and t-butoxy), an alkenyloxy group has 2 to 4 carbon atoms (e.g., vinyloxy, propenyloxy, allyloxy, and butenyloxy), an aryloxy group has 6 to 10 carbon atoms (e.g., phenoxy), an aralkyloxy group has 7 to 11 carbon atoms (e.g., benzyloxy), an acyloxy group has 1 to 6 carbon atoms (e.g., butyryloxy), an alkoxycarbonyl group has 2 to 5 carbon atoms (e.g., methoxycarbonyl and ethoxycarbonyl), an aryloxycarbonyl group has 7 to 11 carbon atoms (e.g., phenyloxycarbonyl), an alkylene group has 1 to 4 carbon atoms (e.g., methylene and ethylene), an alkenylene group has 3 to 5 carbon atoms, and an arylene group has 6 to 14 carbon atoms. Methods for preparing polyhydroxy compounds used for preparing compounds represented by formulae (I) to (XVI) are disclosed in the following literatures. Formula (I): JP-A-3-279958 Formula (II): JP-A-4-11260 (Compounds are obtained according on the method disclosed in DE-A-1,930,333 or Journal of Chemical Society, (1954), Page 985) Formula (III): JP-A-179353, JP-A-4-1650, JP-A-4-12356, and JP-A-1-2357 Formula (IV): JP-A-3-200253, and JP-A-3-259149 Formulae (V) and (VI): Japanese Patent Application 3-62150 (Compounds are obtained according on the method of H.L. Rohatgi disclosed in Indian J. Appl. Chem. Vol. 21, No. 3, (1958) 177. The compounds are commercially available.) Formula (VII): JP-A-64-76047 Formula (VIII): JP-A-1-289946, JP-A-3-158855, JP-A-200252, and JP-A-3-259149 Formula (IX): JP-A-1-289947 and JP-A-279959 Formula (X): JP-A-60-163043 Formula (XI): JP--A-3-279958 Formula (XII): Japanese Patent Application 3-320438 (Compounds are obtained according on the method disclosed in JP-A-56-55328.) Formula (XIII): Japanese Patent Application 4-104542 (Compounds are obtained according on the method disclosed in JP-A-49-250.) Formula (XIV): Japanese Patent Application 4-107889 (Compounds are obtained according on the method disclosed in JP-A-55-162728 using p-hydroxyphenylketone compounds which can be obtained according on the method disclosed in Chemische Berichte Vol. 74, pp. 1772 (1941). The compounds can also be obtained according to the method disclosed in US-A-2,965,611.) Formula (XV): Japanese Patent Application 4-107889 (Compounds are obtained according on the method disclosed in JP-A-55-162728.) Formula (XVI): Japanese Patent Application 4-103215 (Compounds are obtained according on the method disclosed in US-A-3,891,673.) Illustrated examples of the skeletons of preferred compounds (c) are shown below: wherein R 50 is R in the above compounds (1) to (63) represents a hydrogen atom or a group containing -COOA 0 or -OB 0 such as -CH 2 COO-C(CH 3 ) 2 C 6 H 5 , -COOC 4 H 9 (t), -CH 2 -COOC 4 H 9 provided that at least two or at least three (depending on the number of bonded atoms therebetween) of the R groups are groups other than a hydrogen atom and they are positioned so that the definition for the number of the bonded atoms between the acid decomposable groups is satisfied. The groups represented by R may be the same or different. Method for producing compound (c) by substituting a hydrogen atom in the polyhydroxy compound with an acid decomposable group are well known. Typical examples for the methods are shown below. i) Introducing of-COOC(CH 2 ) 3 can be conducted by the method disclosed in J. Frechet et. al., Polymer , Vol. 24, August, 995 (1983), i.e., by reacting a polyhydrodroxy compound with di-t-butylcarbonate in the presence of a basic catalyst. ii) Introducing of a tetrahydropyranyl group can be conducted by the method disclosed in H.N. Grant et. at., Helv. Chem. Acta. 46, 415 (1963), i.e., by reacting a polyhydroxy compound with 3,4-dihydro-2H-pyran in the presence of an acidic catalyst. The proportion of the compounds (c) used in the present invention is from 3 to 50% by weight, preferably 5 to 35% by weight based on the entire weight of the light-sensitive composition (excluding a solvent). Alkali soluble resin [the component (a) of the composition of the present invention Any alkali soluble resin conventionally used in this field can be used in the present invention as long as the resin is substantially water insoluble and soluble in an alkaline aqueous solution. Examples of the resin used in the present invention include a novolak resin, a hydrogenated novolak resin, an acetone-pyrogallol resin, polyhydroxystyrene, a halogen- or alkyl-substituted polyhydroxystyrene, a hydroxystyrene-N-substituted maleimide copolymer, a partially O-alkylated or O-acylated polyhydroxystyrene, a styrenemaleic acid anhydride copolymer, and a carboxyl group-containing methacrylate type resin, a derivative thereof, and the mixture thereof, but the present invention is not limited to these resins. The particularly preferred alkali soluble resins are a novolak resin and polyhydroxystyrene. The novolak resin can be prepared by subjecting a prescribed monomer as a main component to addition condensation with aldehydes in the presence of an acid catalyst. The following monomers can be used singly or in combination of two or more as the prescribed monomer: cresols such as phenol, m-cresol, p-cresol, and o-cresol; xylenols such as 2,5-xylenol, 3,5-xylenol, 3,4-xylenol, and 2,3-xylenol, alkylphenols such as methylphenol, p-ethylphenol, o-ethylphenol, p-t-butylphenol, p-octylphenol, and 2,3,5-trimethylphenol; alkoxyphenols such as p-methoxyphenol, m-methoxyphenol, 3,5-dimethoxyphenol, 2-methoxy-4-methylphenol, methoxyphenol, p-ethoxyphenol, m-propoxyphenol, p-propoxyphenol, m-butoxyphenol, and p-butoxyphenol; bisalkylphenols such as 2-methyl-4-isopropylphenol; and hydroxy aromatic compounds such as m-chlorophenol, p-chlorophenol, o-chlorophenol, dihydroxybiphenyl, bisphenol A, phenylphenol, resorcinol, and naphthol. The present invention, however,is not limited to the above monomers. Examples of aldehydes, useful in the present invention include formaldehyde, paraformaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, phenyl-acetaldehyde, α-phenylpropionaldehyde, β-phenylpropionaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, p-ethylbenzaldehyde, p-n-butylbenzaldehyde, furfural, and chloracetaldehyde and an acetal compound thereof, for example, chloroacetaldehyde diethylacetal. Of those, formaldehyde is preferably used. These aldehydes are used singly or in combination of two or more. Examples of the acid catalyst include hydrochloric acid, sulfuric acid, formic acid, acetic acid, and oxalic acid. The weight-average molecular weight of the novolak resin thus obtained is preferably in the range of 1,000 to 30,000. A molecular weight less than 1,000 increases layer shrinkage in the unexposed portion after developing, and a molecular weight exceeding 30,000 decreases developing speed. A particularly preferred molecular weight is 2,000 to 20,000. The weight-average molecular weight is defined by the polystyrene-converted value of gel permeation chromatography. These alkali soluble resins may be used as a mixture of two or more. The proportion of the alkali soluble resin used in the present invention is preferably 50 to 97% by weight, more preferably 60 to 90% by weight based on t:he entire weight of the light-sensitive composition (excluding solvent). The compound generating acid by active rays or radial rays [the component (b) of the composition of the present invention] The component (b) is decomposed by active rays or radial rays such as UV, deep UV, X ray and electron rays to generate an acid. Specifically, component (b) of the compositions of the present invention is a sulfonium salt represented by Formula (PAG4): wherein R 3 , R 4 and R 5 each represents a substituted or unsubstituted alkyl group or an aryl group. Preferred groups include an aryl group having 6 to 14 carbon atoms, an alkyl group having 1 to 8 carbon atoms, and a substituted derivative thereof. Preferred substituents include an alkoxy group having 1 to 8 carbon atoms, an alkyl group having 1 to 8 carbon atoms, a nitro group, a carboxyl group, a hydroxy group, and a halogen atom for the aryl group, and an alkoxy group having 1 to 8 carbon atoms, a carboxyl group, and an alkoxycarbonyl group having 1 to 8 carbon atoms group for the alkyl group. Z - represents a paired anion, for example, BF 4 - , AsF 6 - , PF 6 - , SbF 6 - , SiF 6 -2 , and ClO 4 - , a perfluoroalkanesulfonic acid anion such as CF 3 SO 3 - , and a pentafluorobenzenesulfonic acid anion, a condensed polynuclear aromatic sulfonic acid anion such as a naphthalene-l-sulfonic acid anion, an anthraquinonesulfonic acid anion, and a dye containing a sulfonic acid group, but the present invention is not limited thereto. At least two of R 3 , R 4 and R 5 may be combined via a single bond or substituent thereof. The following compounds are illustrate examples thereof, The above onium salts represented by Formula (PAG4) are publicly known and can be synthesized by the methods described in, for example, J. Am. Chem. Soc., by J.W. Knapczyk et al, 91, 145 (1969), J. Org. Chem., by A.L. Maycok et al, 35, 2532 (1970), Bull. Soc. Chem. Belg. , by E. Goethas et al, 73, 546 (1964), J. Am. Chem. Soc. , by H.M. Leicester, 51, 3587 (1929), J. Polym. Chem. Ed. , by J.V. Ceivello et al, 18, 2677 (1980), US-A-2,807,648 and 4,247,473, and JP-A-53-101331 (US-A-4,151,175). The amount of these compounds which are decomposed by active rays and radial rays to generate acids is usually in the range of 0.001 to 40% by weight, preferably 0.01 to 20% by weight, and more preferably 0.1 to 5% by weight based on the entire weight of the light-sensitive composition (excluding solvent). The light-sensitive composition of the present invention can further contain a dye, a pigment, a plasticizer, a surface active agent, a photosensitizer, and a compound having two or more phenolic OH groups which accelerate solubility in a developing solution, if desired. The amount of these compounds is preferably not more than 30% by weight based on the entire weight of the light sensitive composition (excluding solvent). An oily dye and a base dye are available as a preferred dye. Specific examples include Oil Yellow #101, Oil Yellow #103, Oil Pink #312, Oil Green BG, Oil Blue BOS, Oil Blue #603, Oil Black BY, Oil Black BS, Oil Black T-505 (the above are manufactured by Orient Chemical Ind. Co., Ltd.), Crystal Violet (CI42555), Methyl Violet (CI42535), Rhodamine B (CI45170B), Malachite Green (CI42000), and Methylene Blue (CI52015). Further, the following spectral sensitizers can be added, and the light-sensitive composition of the present invention can be sensitized to a wavelength region longer than far ultraviolet in which a photo acid generating agent used has no absorption to provide the light-sensitive composition of the present invention with a sensitivity to i line (365 nm) or g line (436 nm). Preferred spectral sensitizers include benzophenone, p,p'-tetraethylmethyldiaminobenzophenone, p,p'-tetraethylethylaminobenzophenone, 2-chlorothio-xanthone, anthrone, 9-ethoxyanthracene, anthracene, pyrene, perylene, phenothiazine, benzil, acridine orange, benzoflavin, Setoflavin-T, 9,10-diphenylanthracene, 9-fluorenone, acetophenone, phenathrene, 2-nitrofluorene, 5-nitroacenaphthene, benzoquinone, 2-chloro-4-nitro-aniline, N-acetyl-p-nitroaniline, p-nitroaniline, N-acetyl-4-nitro-1-naphthylamine, picramide, anthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1,2-benzanthraquinone, 3-methyl-1,3-diaza-1,9-benzanthrone, dibenzalacetone, 1,2-naphthoquinone, 3,3'-carbonyl-bis-(5,7-dimethoxycarbonylcoumarin), and coronene, but the present invention is not limited thereto. The light-sensitive composition of the present invention, which is dissolved in a solvent dissolving the above respective components, is coated on a support. Preferred as the solvent used herewith are ethylene dichloride, cyclohexanone, cyclopentanone, 2-heptanone, γ-butyrolactone, methyl ethyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, 2-methoxyethyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, toluene, ethyl acetate, methyl lactate, ethyl lactate, methyl methoxypropionate, ethyl ethoxypropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, N,N-dimethylformamide, dimethylsulfoxide, N-methylpyrrolidone, and tetrahydrofuran. These solvents are used singly or in combination. A surface active agent can be added as well to the above solvents. Examples include nonionic type surface active agents including polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether, polyoxyethylene alkyl aryl ethers such as polyoxyethylene octylphenol ether and polyoxyethylene nonylphenol ether, polyoxyethylene/polyoxypropylene block copolymers, sorbitan fatty acid esters such as sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sobitan trioleate, and sorbitan tristearate, and polyoxyethylene sorbitan fatty acid esters such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, and polyoxyethylene sorbitan tristearate; fluorine containing surface active agents such as F Top EF 301, EF 303 and EF 352 (manufactured by Shin Akita Kasei Co., Ltd.), Megafac® F 171 and F 173 (manufactured by Dainippon Ink Co., Ltd.), Florade® FC 430 and FC 431 (manufactured by Sumitomo Three M Co., Ltd.), Asahi Guard® AG 710, and Surfron S-382, SC-101, SC-102, SC-103, SC-104, SC-105, and SC-106 (manufactured by Asahi Glass Co., Ltd.); an organosiloxane polymer KP 341 (Shin-etsu Chemical Ind. Co., Ltd.); and an acrylic acid type or methacrylic acid type (co)polymer Polyflow® No. 75 and No. 95 (Kyoeisha Oil & Fat Chemical Co., Ltd.). The amount of these surface active agents added is usually two parts by weight or less, preferably 1 part by weight or less per 100 parts by weight of the solid matters contained in the composition of the present invention. These surface active agents may be added singly or in combination. The above light--sensitive composition is coated on a substrate (for example, silicon coated with silicon dioxide) used for manufacturing a precision integrated circuit element by a suitable coating method such as a spinner and a coater and then is exposed through a mask, baked (usually, at 35 to 180°C, for about 5 minutes or less) and developed, whereby a superior resist pattern is obtained. The developing solution used for the light-sensitive composition of the present invention, may be aqueous alkaline solutions of alkalis including inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia; primary amines such as ethylamine and n-propylamine; secondary amines such as diethylamine and di-n-butylamine; tertiary amines such as triethylamine and methyl diethylamine; alkanolamines such as dimethylethanolamine and triethanolamine; quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; and cyclic amines such as pyrrole and piperidine. Usually, the concentration of these compounds is 10 -5 N or higher, preferably 0.001 to 1 N and the developing temperature is 0 to 100°C, preferably 5 to 60°C. Further, alcohols and surface active agents can also be added to the aqueous alkaline solutions in a suitable amount. The present invention will be explained below in further detail by reference to examples, but the invention is not limited thereto. EXAMPLES Synthesis Example-1 of a dissolution inhibitor α,α',α"-Tris(4-hydroxyphenyl)-1,3,5-triisopropylbenzene (commercially available; 20 g) was dissolved in tetrahydofuran (400 ml). Potassium tert-butoxide (14 g) was added to this solution under a nitrogen atmosphere, and the solution was stirred at room temperature for 10 minutes, followed by adding di-tert-butyldicarbonate (29.2 g). The reaction was carried out at room temperature for 3 hours, and the reaction liquid was poured into ice water to extract the product with ethyl acetate. The ethyl acetate phase was further washed with water and dried, followed by distilling off the solvent. After the crystalline solid material obtained was recrystalized (diethyl ether), it was dried, whereby the exemplified compound 31 (all of the Rs were -COOC(CH) 3 groups) (25.6 g) was obtained. Synthesis Example-2 of a dissolution inhibitor α,α',α"-Tris(4-hydroxyphenyl)-1,3,5-triisopropylbenzene (20 g) was dissolved in diethyl ether (400 ml). Added were 3,4-dihydro-2H-pyran (31.6 g) and a catalytic amount of hydrochloric acid to this solution under a nitrogen atmosphere and the reaction was carried out for 24 hours under refluxing. After finishing the reaction, a small amount of sodium hydroxide was added, followed by filtering. The solvent was distilled off from the filtrate, and the product obtained was refined by column chromatography and dried, whereby the exemplified compound 31 all of the Rs were tetrahydropyranyl groups) (22.4 g) was obtained. Synthesis Example-3 of a dissolution inhibitor There were added to an N,N-dimethylacetamide solution (120 ml) of α,α',α"-tris(4-hydroxyphenyl)-1,3,5-triisopropylbenzene (19.2 g) (0.040 mole), potassium carbonate (21.2 g) (0.15 mole) and further t-butyl bromoacetate (27.1 g) (0.14 mole), and the solution was stirred at 120°C for 7 hours. Thereafter, the reaction mixture was poured into water (1.5 ℓ) and extracted with ethyl acetate. After drying over magnesium sulfate, the extract was concentrated and refined by column chromatography (carrier: silica gel, developing solvent: ethyl acetate/n-hexane = 3/7 by volume ratio), whereby a pale yellow viscous solid material (30 g) was obtained. It was confirmed with NMR that this was the exemplified compound 31 (all of the Rs were -CH 2 COOC 4 H 9 (t)groups). Synthesis Example-4 of a dissolution inhibitor 1-[α-Methyl-α-(4'-hydroxyphenyl)ethyl]-4-[α',α'-bis(4"-hydroxyphenyl)ethyl]benzene (commercially available; 42.4 g) (0.10 mole) was dissolved in N,N-dimethylacetamide (300 ml), and potassium carbonate (49.5 g) (0.35 mole) and cumyl bromoacetate (84.8 g) (0.33 mole) were added thereto. Thereafter, the solution was stirred at 120°C for 7 hours. The reaction mixture was poured into ion exchanged water (2 ℓ). After being neutralized with acetic acid, the solution was extracted with ethyl acetate. The ethyl acetate extract was concentrated and refined in the same manner as in Synthesis Example-3, whereby the exemplified compound 18 (all of the Rs were -CH 2 COOC(CH 3 ) 2 C 6 H 5 groups) (70 g) was obtained. Synthesis Example-5 of an dissolution inhibitor There were added to an N,N-dimethylacetamide solution (120 ml) of α,α',α',α",α"-hexakis(4-hydroxyphenyl)-1,3,5-triethylbenzene (can be prepared according on the similar method disclosed in J-A-55-162728; 14.3 g) (0.020 mole), potassium carbonate (21.2 g) (0.15 mole) and further t-butyl bromoacetate (27.1 g) (0.14 mole), and the solution was stirred at 120°C for 7 hours. Thereafter, the reaction mixture was poured into water (1.5 ℓ) and extracted with ethyl acetate. After drying over magnesium sulfate, the extract was concentrated and refined by column chromatography ( carrier: silica gel, developing solvent: ethyl acetate/n-hexane = 2/8 by volume ratio), whereby a pale yellow powder (24 g) was obtained. It was confirmed with NMR that this was the exemplified compound 62 (all of the Rs were -CH 2 COO-C 4 H 9 (t) groups). Synthesis Example-6 of a dissolution inhibitor α,α',α"-Tris(4-hydroxyphenyl)-1,3,5-triisopropylbenzene (20 g) (0.042 mole) was dissolved in tetrahydofuran (THF) (400 ml). Potassium tert-butoxide (9.3 g) (0.083 mole) was added to this solution under a nitrogen atmosphere and the solution was stirred at room temperature for 10 minutes, followed by adding di-tert-butyldicarbonate (19.5 g) (0.087 mole). The reaction was carried out at room temperature for 3 hours and the reaction solution was poured into ice water to extract the product with ethyl acetate. The ethyl acetate extract was concentrated and refined by column chromatography (carrier: silica gel, developing solvent: ethyl acetate/n-hexane = 1/5 by volume ratio), whereby the exemplified compound 31 (two R's were -COOC(CH 3 ) 3 groups and one R was a hydrogen atom) (7 g) was obtained. Synthesis Example-7 of a dissolution inhibitor α,α',α"-Tris(4-hydroxyphenyl)-1,3,5-triisopropylbenzene (48.1 g) (0.10 mole) was dissolved in dimethylacetamide (300 ml) and potassium carbonate (22.1 g) (0.16 mole) and t-butyl bromoacetate (42.9 g) (0.22 mole) were added thereto. Thereafter, the solution was stirred at 120°C for 5 hours. Then, the reaction mixture was poured into ion exchanged water (2 ℓ) and extracted with ethyl acetate after neutralizing with acetic acid. The ethyl acetate extract was concentrated and refined with a column chromatography (carrier: silica gel, developing solvent: ethyl acetate/hexane = 1/5 by volume ratio), whereby the exemplified compound 31 (two R's were -CH 2 COOC 4 H 9 (t) groups and one R was a hydrogen atom) (10 g) was obtained. Synthesis example of a novolak resin m-Cresol (40 g), p-cresol (60 g), a 37% formalin aqueous solution (49 g) and oxalic acid (0.13 g) were introduced into a three neck flask, and the temperature was raised up to 100°C to carry out the reaction for 15 hours. Thereafter, the temperature was raised to 200°C, and the pressure was reduced gradually to 6.7 mbar (5 mm Hg) to remove water, unreacted monomer, formaldehyde and oxalic acid. Subsequently, the resulting melted alkali soluble novolak resin (NOV. 3) was cooled down to room temperature for recovering. The novolak resin (NOV. 3) thus obtained had a weight-average molecular weight of 7100 (converted to polystyrene). The following novolak resins in which the compositions were changed were synthesized in the same manner: NOV. 1: m-cresol/p-cresol = 60/40 (weight ratio of reactants), Mw = 12,000 NOV. 2: m-cresol/p-cresol = 50/50 ( " ), Mw = 8,700 NOV. 4: m-cresol/p-cresol/3,5-xylenol = 25/50/28 ( " ), Mw = 5,200 NOV. 5: m-cresol/2,3,5-trimethylphenol = 55/57, ( " ), Mw =5,800 The novolak resin (NOV. 3) obtained above (20g) was completely dissolved in methanol (60 g) and then water (30 g) was gradually added thereto while stirring to precipitate a resin. An upper phase was removed by decantation to recover the precipitated resin, which was heated at 40°C to dry under a reduced pressure for 24 hours, whereby the alkali soluble resin (NOV. 6) was obtained. The weight-average molecular weight thereof was 8000 (converted to polystyrene). m-Cresol (85 g), p-cresol (15 g) and a 37% formalin aqueous solution (53 g) were introduced into a three neck flask and the mixture was stirred well while heating on an oil bath at 110°C. Zinc acetate dihydrate (2.4 g) was added thereto to continue heating while stirring for 5 hours. Then, the same cresol mixture (100 g) and the formalin aqueous solution (47 g) were continuously introduced into the same flask. Further, after heating and stirring were continued for 1 hour, the temperature was lowered to 80°C to add oxalic acid (0.2 g). The reaction was continued once again for 15 hours in a refluxing condition while keeping the temperature of the oil bath at 110°C. Thereafter, the content was poured into water containing 1% hydrochloric acid, and the reaction product was extracted with ethylcellosolve acetate. Then, this was moved to a vacuum distiller, and t:he temperature was raised to 200°C to remove water. Further, distillation was continued for two hours under a reduced pressure of 2.7 to 4.0 mbar (2 to 3 mm Hg) to remove the residual monomer. The resulting melted polymer was recovered from the flask, whereby the desired novolak resin (NOV. 7, Mw = 7,500) was obtained. EXAMPLES 1 TO 14 The compounds shown in the above synthetic examples were used to prepare the resists. The prescriptions therefor are shown in Table 1. COMPARATIVE EXAMPLES 1 AND 2 A t-butoxycarbonyloxystyrene polymer and a t-butoxycarbonyloxy-α-methylstyrene polymer were synthesized according to the method described in US-A-4,491,628 to prepare the two component series positive type resists. The prescriptions therefor are shown in Table 1. COMPARATIVE EXAMPLES 3, 4 AND 5 The compounds described in EP-A-249,139, di-t-butyl terephthalate, 4-t-butoxy-p-biphenyl and t-butyl-2-naphthylcarbonate, were used as the dissolution inhibitor agent to prepare the three components series positive type resists. The prescriptions therefor are shown in Table 1. The codes used in Table 1 have the following definitions: Polymers NOV. 1 to 7: novolak resins PVP: p-hydroxystyrene polymer (number-average molecular weight: 9,600) TBOCS: t-butoxycarbonyloxystyrene polymer (number-average molecular weight: 21,600) TBAMS: t-butoxycarbonyloxy-α-methylstyrene polymer ( number-average molecular weight: 46,900) Dissolution inhibitor DTBTP: di-t-butyl terephthalate TBPBP: 4-t-butoxy-p-biphenyl TBNC: t-butyl-2-naphthylcarbonate Acid Decomposable group TBOC: -OCOOC 4 H 9 (t) TBE: -OCH 2 COOC 4 H 9(t) CUE: -OCH 2 COOC(CH 3 ) 2 C 6 H 5 THP: Preparation and evaluation of the light-sensitive compositions The respective materials shown in Table 1 were dissolved in diglyme (diethylene glycol dimethyl ether; 6 g), and the solutions were filtered with a filter of 0.2 µm to prepare the resist solutions. These resist solutions were coated on a silicon wafer with a spin coater at a revolution speed of 3000 rpm, followed by drying on a vacuum adsorption type hot plate at 110°C for 60 seconds, to thereby obtain a resist layer with a layer thickness of 1.0 µm. This resist layer was subjected to an exposure with an eximer laser stepper of 248 nm KrF (NA = 0.42). After exposing, the resist layer was heated on the vacuum adsorption type hot plate at 90°C for 60 seconds and was immediately dipped in a 2.38% tetramethylammonium hydroxide (TMAH) aqueous solution at 23°C for 60 seconds, followed by rinsing with water for 30 seconds and drying. The patterns thus obtained on the silicon wafer were observed with a scanning type electron microscope to evaluate the profile of the resist. The results thereof are shown in Table 2. Sensitivity was defined by the reciprocal of the exposure necessary for reproducing a mask pattern of 0.70 µm and expressed by a value relative to that of Comparative Example 1, which was set at 1.0. Layer shrinkage was expressed in terms of the ratio of the layer thicknesses before and after exposing and baking. Resolution represents a critical resolution in the exposure necessary for reproducing a mask pattern of 0.70 µm. It can be seen from the results shown in Table 2 that the resists of the present invention have less layer shrinkage by baking after exposing and provide an excellent profile and high resolution.

Claims: A positive type light-sensitive composition comprising: (a) a resin which is insoluble in water and soluble in an alkaline aqueous solution, (b) a compound which generates acid by irradiation with active rays or radial rays and is of general formula wherein R 3 , R 4 and R 5 each represents a substituted or unsubstituted alkyl group or an aryl group; Z - represents a paired anion; and two of R 3 , R 4 and R 5 may be combined via a single bond or substituent thereof; (c) an acid decomposable dissolution inhibitor, having a molecular weight of not more than 3000 and having groups decomposable by the action of the generated acid to increase the solubility of said compound in an alkaline developing solution, wherein said dissolution inhibitor (c) is at least one compound selected from (i) compounds having two of said acid decomposable groups which are separated by 10 or more bonded atoms excluding the atoms constituting the acid decomposable groups, or (ii) compounds having at least three of said acid decomposable groups, and two of said groups which are at the farthest positions are separated by 9 or more bonded atoms excluding the atoms constituting the acid decomposable groups, wherein said acid decomposable group contains -COOA 0 or -OB 0 , wherein A 0 represents a -C(R 01 ) (R 02 ) (R 03 ) or -C(R 04 ) (R 05 )-OR 06 group; B° represents a A 0 or -COO-A 0 group; R 01 , R 02 , R 03 , R 04 and R 05 each may be the same or different and each represents a hydrogen atom, an alkyl group, a cycfoalkyl group, an alkenyl group, or an aryl group, or substituted groups thereof and R 06 represents an alkyl group, an aryl group, or substituted groups thereof, provided that at least two of R 01 to R 03 each are groups other than a hydrogen atom and provided that two of R 01 to R 03 and R 04 to R 06 may be combined with each other to form a ring. The positive type light-sensitive composition as in claim 1, wherein said acid decomposable group is -R°(COOA 0 ) n' (n'≥1) or -Ar-OB 0 , wherein R 0 represents a di- or more valent aliphatic or aromatic hydrocarbon group which may have a substituent; and Ar represents a monocyclic or polycyclic, di- or more valent aromatic group which may have a substituent. The positive type light-sensitive composition as in claim 2, wherein the substituent in the substituted group represented by R 0 , R 01 to R 06 and Ar is at least one group selected from a hydroxy group, a halogen atom, a nitro group, a cyano group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, and aralkyl group, an aralkyloxy group; an acyl group, an acyloxy group, an alkenyl group, an alkenyloxy group, aryl group, an aryloxy group, and an arylcarbonyloxy group. The positive type light-sensitive composition as in any of claims 1-3, wherein said acid decomposable dissolution inhibitor is at least one compound selected from the compounds represented by Formulas (I) to (XVI), wherein groups containing -COOA 0 or -OB 0 are positioned so that the number of the bonded atoms satisfies the definition (i) or (ii); wherein R 1 , R 2 , R 3 , R 4 are the same or different, and each represents a hydrogen atom, a -R 0 (COO-A 0 ) n' group or a B 0 group, provided that at least two of the groups represented by R 1 , R 2 , R 3 or R 4 each represents -R 0 -COOA 0 or -B 0 ; R 1 represents -CO-, -COO-, -NHCONH-, -NHCOO-, -O-, -S-, -SO- , -SO 2 -, -SO 3 -, or wherein G is 2 to 6, provided that when G is 2, at least one of R 4 and R 5 is an alkyl group; R 4 and R 5 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxy group, -OH, -COOH, -CN, a halogen atom, -R 6 -COOR 7 , or -R 8 -OH; R 6 and R 8 each represents an alkylene group; R 7 represents a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; R 2 , R 3 , R 9 to R 12 , R 15 , R 17 to R 21 , R 25 to R 27 , R 30 to R 32 , R 37 to R 42 , R 46 to R 49 , and R 51 are the same or different, and each represents a hydrogen atom, a hydroxy group, an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an aryl group, an aryloxy group, an aralkyl group, an aralkyloxy group, a halogen atom, a nitro group, a carboxyl group, a cyano group, or -N(R 13 )(R 14 ) where R 13 and R 14 each represents an alkyl group and an aryl group; R 16 represents a single bond, an alkylene group or wherein R 22 and R 24 are the same or different, and each represents a single bond, an alkylene group, -O-, -S-, -CO-, or a carboxyl group; and R 23 represents a hydrogen atom, an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an aryl group, a nitro group, a hydroxy group, a cyano group, a carboxyl group, -OR 0 (COOA 0 ) n' , or -OB 0 ; R 28 and R 29 are the same or different, and each represents a methylene group, a lower alkyl-substituted methylene group, a halomethylene group, or a an alkoxymethylene group; R 33 to R 36 are the same or different, and each represents a hydrogen atom or an alkyl group; R 43 to R 45 are the same or different, and each represents a hydrogen atom, an alkyl group, an alkoxy group, an acyl group, or an acyloxy group; R 50 represents a hydrogen atom, -R 0 (COOA 0 ) n' - or -B 0 , or R 52 to R 53 are the same or different, and each represents a hydrogen atom, a lower alkyl group, a lower haloalkyl group, or an aryl group; R 54 to R 57 are the same or different, and each represents a hydrogen atom, a hydroxy group, a halogen atom, a nitro group, a cyano group, a carbonyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an aralkyl group, an aralkyloxy group, an acyl group, an acyloxy group, an alkenyl group, an alkenyloxy group, an aryl group, an aryloxy group, or an aryloxycarbonyl group; R represents -O-R 0 (COOA 0 ) n' , -O-B 0 or a hydroxy group provided that at least two of the R groups each represents -O-R 0 (COOA 0 ) n' or -O-B 0 and that groups represented by the same symbol may be not the same group; Y represents -CO- or -SO 2 -; Z and B each represents a single bond or -O-; A represents a methylene group, a lower alkyl-substituted methylene group, a halomethylene group, or an alkoxymethylene group; E represents a single bond or an oxymethylene group; when subscripts a to z and a1 to y1 are plural, the groups in parenthesis may be the same or different; a to q, s, t, v, gl to il, kl to ml, ol, ql, sl, and ul each represents 0 or an integer of 1 to 5; r, u, w, x, y, z, al to fl, pl, rl, tl, and vl to xl each represents 0 or an integer of 1 to 4; jl, nl, zl, a2, b2, c2, and d2 each represents 0 or an integer of 1 to 3, provided that at least one of zl, a2, b2, c2, and d2 is 1 or more; yl represents an integer of 3 to 8; wherein (a+b), (e+f+g), (k+ℓ+m), (q+r+s), (w+x+y), (cl+dl), (gl+hl+il+jl), (ol+pl), and (sl+tl)≧2; (jl+nl)≦3; (r+u), (w+z), (x+al), (y+bl), (cl+el), (dl+fl), (pl+rl), (tl+vl), (xl+wl)≦4, but in formula (V), (w+z) and(x+al)≦5; and (a+c), (b+d), (e+h), (f+i), (g+j), (k+n), (l+o), (m+p), (q+t), (s+v), (gl+kl), (hl+ll), (il+ml), (ol+ql), and (sl+ul)≦5; wherein R 58 represents an alkylene group, an alkenylene group, an arylene group, a single bond, -S-, -SO-, or -(O=)S(=O)-; R 59 represents a hydrogen atom, a hydroxy group, a halogen atom, a nitro group, a cyano group, an alkyl group, an alkoxy group, an alkoxycarbonyl groups, an aralkyl group, an aralkyloxy group, an acyl group, an acyloxy group, an alkenyl group, an alkenyloxy group, an aryl group, an aryloxy group, an aryloxycarbonyl group, or wherein R 60 to R 64 are the same or different and each represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, -O-R 0 (COO-A 0 ) n' or -O-B 0 , provided that at least two of R 60 to R 64 (each of said at least two groups may be positioned at any of the benzene rings in formula (XIII)) each represents -O-R 0 (COO-A 0 ) n' or -O-B 0 ; groups represented by the same symbols may be the same or different; X represents a substituted or unsubstituted alkylene or arylene group; and e2 represents 0 or 1; wherein R 65 to R 68 are the same or different, and each represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, or an alkenyl group; R 69 to R 70 represents a hydrogen atom, an alkyl group, or R 5 represents a hydroxy group, a -O-R 0 (COO-A 0 ) n' group or a -O-B 0 group; and at least two of the R 5 groups each represents -O-R 0 (COO-A 0 ) n' or -O-B 0 ; f2 and h2 each represents 0 or 1; g2 represents 0 or an integer of l to 4; and the groups having the same symbols may be the same or different; wherein R 71 to R 77 are the same or different, and each represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, a nitro group, an alkenyl group, an aryl group, an aralkyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an acyloxy group, an acyl group, an aralkyloxy group, or an aryloxy group; and R 6 represents a hydroxyl group, a -O-R 0 (COO-A 0 ) n' group or a -O-B 0 group, and at least two of R 6 groups each represents a -O-R 0 (COO-A 0 ) n, group or -O-B 0 group; wherein R 78 represents a hydrogen atom or an alkyl group; R 79 to R 82 represents a hydroxy group, a hydrogen atom, a halogen atom, an alkyl group, or an alkoxy group; R 7 represents a hydroxyl group, a -O-R 0 (COO-A 0 ) n ' group or a -O-B 0 group, at least two of the R 7 groups each represents a -O-R 0 (COO-A 0 ) n ' group or a -O-B 0 group; and the groups having the same symbols may be the same or different. The positive type light-sensitive composition as in any of claims 1-3, wherein said acid decomposable dissolution inhitibor is at least one compound selected from the compounds represented by Formulas (53) to (55) and (57): wherein R, which may be the same or different, represents a hydrogen atom or a group containing -COOA 0 or -OB 0 as defined in claim 1, provided that at least two or at least three (depending on the number of bonded atoms therebetween) of the R groups are groups other than a hydrogen atom, and that they are positioned so that the definition (i) or (ii) for the number of the bonded atoms between the acid decomposable groups as defined in claim 1 is satisfied. The positive type light-sensitive composition as in claim 5, wherein radical R in the compounds represented by Formulas (53) to (55) and (57) is the same or different and represents The positive type light-sensitive composition as in any of claims 1-6, wherein the proportion of the acid decomposable dissolution inhibitor is from 3 to 50% by weight based on the entire weight of the light-sensitive composition (excluding a solvent). The positive type light-sensitive type composition as in any of claims 1-7, wherein said resin is at least one resin selected from a novolak resin, a hydrogenated novolak resin, an acetone-pyrogallol resin, polyhydroxystyrene, a halogen- or alkyl-substituted polyhydroxystyrene, a hydroxystyrene-N-substituted maleimide copolymer, a partially o-alkylated or o-acylated polyhydroxystyrene, a styrenemaleic acid anhydride copolymer, and a carboxyl group-containing methacrylate type resin, and a derivative thereof. The positive type light-sensitive composition as in any of claims 1-8, wherein the proportion of the resin is 50 to 97% by weight based on the entire weight of the light-sensitive composition (excluding a solvent). The positive type light-sensitive composition as in any of claims 1-9, wherein the amount of said acid generating compound is 0.001 to 40% by weight based on the entire weight of the light-sensitive composition (excluding solvent).

Inventors: AOAI TOSHIAKI, KOKUBO TADAYOSHI, KONDO SHUNICHI, UENICHI KAZUYA, YAMANAKA TSUKASA, AOAI, TOSHIAKI, KOKUBO, TADAYOSHI, KONDO, SHUNICHI, UENICHI, KAZUYA, YAMANAKA, TSUKASA, AOAI, TOSHIAKI, C/O FUJI PHOTO FILM CO., LTD., KOKUBO, TADAYOSHI, C/O FUJI PHOTO FILM CO., LTD., Kondo, Shunichi, c/o Fuji Photo Film Co., Ltd., Uenichi, Kazuya, c/o Fuji Photo Film Co., Ltd., Yamanaka, Tsukasa, c/o Fuji Photo Film Co., Ltd.
Applicants: FUJI PHOTO FILM CO LTD, FUJI PHOTO FILM CO., LTD.
Application year: 1992
Main classification: G03F7
IPC codes: H01L21, G03F7