Arrangement for polishing and size-regulation in a process for pulverization and separation

Abstract: The apparatus comprises fixed polishing and size-regulating means (150) that lie on a fixed disc member (151) with the central region communicating with an inlet opening (152) for the material to be treated and are provided with a series of fixed pins (154) in a plurality of rotational orbits (a), movable polishing and size-regulating means that lie on a rotatable disc member (161) capable of being rotationally driven in opposition to said fixed disc member (151) and are provided with a series of movable pins (164) in a plurality of rotational orbits (b) different from those for said fixed pins (154) ; and sorting means (171, 172) that lie on the outer periphery of the combined fixed/movable pins (154, 164) for arbitrarily sorting out the material having a desired or lower particle size and communicate with a discharge port (182), and removal means (174) for removing the material having a desired or higher particle size through a removal port (173), said material to be treated being capable of being polished and size-regulated between said fixed pins (154) and said movable pins (164). The apparatus is designed to treat squeezed small pieces (12) obtained by crushing a molded resin article (11) having a resin film on its surface, this film (14) being previously removed.

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an arrangement for polishing and size-regulation of powder materials obtained from molded powder articles including a relatively soft, molded resin article which are crushed to obtain a coarse particle-form of powder materials including a relatively soft resin material, the powder materials being then regulated in terms of size and granulated. More specifically, the apparatus of the present invention may be used in: A pulverizing and separating process in which a variety of molded resin articles covered on their surfaces with resin films composed mainly of a resin material for decorating and/or protecting purposes are crushed into a plurality of a coarse particle-form of small pieces and the resin films are separated and removed from the small piece to regenerate them as a raw-form of resin material; A pulverizing, separating and size-regulating process wherein the resin material mentioned above is regulated to a suitable particle size, if required, to regenerate it in the form of a resin material comprising particles lying in a given particle diameter range, so that second-mentioned resin material can be recycled; A pulverizing and separating process wherein a conductive material such as copper or aluminum is separated by pulverization from a covering material that is used with insulating electrical wires or cords, for instance, vinyl chloride, crosslinked polyethylene or synthetic rubber; and A separating process wherein plastics that are insulators for various components such as computer or word processor components are separated from metals that are conductors inclusive of semi-conductors or a process for separating insulators from conductors. 2. Description of the Prior Art Generally, resin articles shaped and formed of resin materials such as a variety of naturally occurring or synthetic resins are now used in many applications, both in many types and in large amounts, incidental to a variety of life styles. At present, however, such various problems as mentioned below arise in connection with their post-use treatments. As well known in the art, most of resin materials constituting molded resin articles are characterized by their own properties, say, they have excellent water resistance and weather resistance and are difficult to corrode, but they spew about large amounts of harmful gases and fumes that are undesired in view of society and environment, for instance, when incinerated in an incinerator for disposal purposes. In addition, there is a disadvantage that the resin material melts occurring during incineration are deposited onto the inner wall of the incinerator, presenting a risk of doing damage to it. Warding off this defect may be achieved by laying the molded resin articles underground. However, since they remain uncorroded over an extended period, they appear to present another factor for environmental disruption. On the other hand, such resin materials will yearly be exhausted due to resource depletion, and it is now demanded and recognized that the post-use resin materials must be recycled without disposal. For such recycling or regenerating purposes, what types of resins are used are indicated on the molded resin articles. Usually or in most cases, molded resin articles to be recycled for the recycling purposes mentioned above are provided on their surfaces with resin films for decorating, say, polishing, matting and coloring purposes or with a view to improving their properties such as wear resistance and weather resistance much more considerably or, in other words, protecting them. As an example, about 75% by weight material of a car is now recycled, but most of it is a metal material and the rest or 25% is rejected in the form of dust, in which about 30% by weight of plastics are contained. For instance, bumper parts for various vehicles or carriers are usually produced by applying a polyester urethane type coat of about 15 µm to 30 µm in thickness onto a substrate member made of polypropylene and having a thickness of about 2.5 mm to 5 mm. Generally, the resin films coated on the surfaces of the molded resin articles are formed with the use of resin materials differing those forming such articles in terms of type and properties, or alternatively formed of resin materials of different colors. When such resin materials of varying types and with varying properties and colors are recycled as such, not only are articles obtained by this recycling much inferior in terms of mechanical properties such as impact strength, but any surface smoothness and color as desired cannot be obtained as well. Until now, the molded resin articles to be recovered have usually be recycled for each resin material having the same type and properties with the foregoing in mind. In this respect, these articles could be pulverized by abrasive means, for example as disclosed in the German Utility Model DE-U-9 114 085. However, the resin films coated on the surfaces of molded resin articles are so relatively thin and have so strong adhesion strength that they cannot easily peel off ; that is, they are likely to have various undesired troubles and so do not well fit for mechanical treatments, because throughputs are low even by relying upon mechanical peeling and discriminating means such as well-known shot blasting. Another disadvantage is that when it is intended to peel and discriminate off such resin films by pulverizer means such as ball-milling, they cannot rather peel off, because they melt by frictional heat occurring during pulverization. For instance, when it is intended to feed the materials to be treated into a specific treating zone through a feeding opening such as a hopper, on the other hand, the materials build up even in the hopper and so agglomerate mutually and are made compact enough to provide a solid matter that is not fed into the hopper in a stable manner. To add to this, there may be another disadvantage that clogging or other trouble is likely to occur among the individual materials to be treated in the treating zone. In order to subject the resin materials differing in type and properties to a separation-by-dissolution treatment with the use of an organic solvent that allows them to be associated with each other, it is required that the polypropylene material itself be denatured, and the need of using a melting-by-heating step or other additional steps lowers throughputs. This in turn causes treating equipment to be excessively increased in size, offering an economical problem and, besides, poses much difficulty due to the need of post-treatments such as the step of neutralizing the used solvent. The problems associated with the recovery of the resin materials mentioned above, for the most part, are true of powder materials other than them. In some cases, resin films must be released and removed from such articles of resin material as mentioned above, for example, resin materials deposited with said resin films on them or powder materials containing resin materials alone. When the material to be treated is so relatively hard that it must be pulverized within a given particle diameter range, or when it is relatively soft, it is often required to be granulated with the particle diameters lying within a given range. In addition, these operations should be carried out by a single treating apparatus. However, there is still no treating arrangement meeting and accommodating to such demands, although this is partly because of such considerations as mentioned above. Further, when it is intended to recycle copper, aluminum or other material that are conductors by removing a covering insulator material from insulated electrical wires or cords, the conductor portions are pulled out of the covering material while it is torn in the lengthwise direction. Alternatively, lengthwise cutouts are provided in the covering material, and the wires or cords are then cut to a given length. After that, torsion is induced in the cut wires or cords to separate the covering material from the conductors. The Canadian patent N° 980068 discloses a method of reclaiming material from insulated wires having interior conductor metal and a surrounding electrically insulating case. According to this method, each piece of insulating wire is squeezed between hard surfaces on a pair of rotating cylindrical rolls. However, these conventional means for releasing off covering insulator materials physically or torsionally have some defects or, in other words, they are low in separation efficiency or are unpractical. Burning off the covering material that is an insulator is easy to carry out, but poses some problem, i.e., gives rise to spewing about harmful gases or large amounts of fume and reducing the serviceability of the furnace. In the case of computers and word processors no longer well-enough to use, a number of conductors inclusive of semiconductors and other parts incorporated in them are simply thrown away with them. As well known in the art, many metals such as semiconductors are used while molded with plastics that are conductors, and so are desired to be recovered and recycled in view of making effective use of resources. However, never until now are any effective means meeting such demand proposed. SUMMARY OF THE INVENTION Having been accomplished chiefly to provide a solution to the problems associated with the prior art, the present invention has for its object to provide an apparatus for polishing and granulating a powder material which can be produced by a pulverizing and separating process for separating and removing a resin film from a molded resin article having a resin film on its surface, thereby recovering a raw-form of resin material, said process comprising the steps of first crushing the molded resin article into a plurality of small pieces, and next, squeezing said plurality of small pieces, resin film coatings released by squeezing being removed. According to the present invention, the apparatus comprises fixed polishing and size-regulating means that lies on a fixed disc member with the central region communicating with an inlet opening for the material to be treated and is provided with a series of fixed pins in a plurality of rotational orbits, movable polishing and size-regulating means that lies on a rotatable disc member capable of being rotationally driven in opposition to said fixed disc member and is provided with a series of movable pins in a plurality of rotational orbits different from those for said fixed pins, and sorting means that lies on the outer periphery of the combined fixed/movable pins for arbitrarily sorting out the material having a desired or lower particle size and communicates with a discharge port, and removal means for removing the material having a desired or higher particle size through a removal port, said material to be treated being capable of being polished and size-regulated between said fixed pins and said movable pins. BRIEF DESCRIPTION OF THE DRAWINGS For a fuller understanding of the nature and objects of the invention, reference should be made to the following detailed description, taken in connection with the accompanying drawings, in which: Figure 1 is a perspective view that provides a conceptual and schematic representation of one example of the molded resin article which is to be treated by the present invention and one example of the small piece obtained by crushing said molded resin article; Figure 2 is a process chart of the treating steps, which provides a principal and schematic representation of the general aspect of a first example of a process for pulverizing and separating a resin material that is an example of the material to be treated by the invention; Figure 3 is a process chart of the treating steps, which provides a principal and schematic representation of the general aspect of a second example of a process for pulverizing and separating a resin material that is an example of the material to be treated by the invention; Figure 4 is a process chart of the treating steps, which provides a principal and schematic representation of the general aspect of a third example of a process of pulverizing, separating and granulating a powder material; Figure 5 is a perspective view illustration one example of a wire materials made up of a conductor and an insulator; Figure 6 is a constructional view showing one means for applying compression impacts to the wire mentioned above; Figure 7 is a longitudinally sectioned view that provides a schematic representation of the general aspect of the polishing and granulating arrangement used in each of the process examples; Figure 8 is a front view for illustrating the polishing and size-regulating actions in Fig. 7; and Figure 9 is a process chart of the treating steps that provides a principal and schematic representation of the general aspect of the more practical, fourth example of the process for pulverizing, separating and granulating a resin material according to the invention, when used practically. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT In the ensuing disclosure, the term "resin material" refers to a resin material to be recovered from a molded resin article; the word "crushing" to breaking or cutting for obtaining the small piece or material to be treated, which is well fit for the treatments according to the invention in terms of shape and size; the word "separation" to removing and separating a resin film and an insulator from the surface of the small piece to be treated; the term "size regulation" to regulating the small piece to be treated, from which the resin film has been removed, or the material to be treated, to a size that lies in a given particle diameter range and is well fit for recycling as by polishing or cutting, or alternatively regulating the minuscule piece to be treated, from which the resin film has bee removed, or the material to be treated, to a given size by chamfering the corners thereof as by polishing or cutting; the term "powder material to, in a broad sense, a powder material to be recovered from molded powder articles formed of ceramic materials including resin materials, a powder material that is relatively hard and easy-to-pulverize powder piece or lump, or a powder material that is relatively soft and easy-to-granulate piece or lump; the word "pulverization" to pulverizing the material to be treated, for instance, a piece or lump crushed to a size suitable for the treatments of the invention, and is understood to include frictional crushing in a broad sense; and the word "granulation" to granulating the material to be treated, which has been crushed, with a given thickness or a given particle diameter range, or alternatively regulating the above-mentioned relatively soft material to be treated to a given thickness or a given particle diameter range suitable for recycling. FIGS. 1 THROUGH 3 Fig. 1 is a perspective view that provides a conceptual and schematic representation of one example of the molded resin article to be treated and one example of the small piece to be treated, which is obtained by crushing that resin article, for instance, a bumper member applicable to a variety of vehicles or carriers and one example of the small piece to be treated, which is obtained by crushing that bumper. Referring now to Fig. 1, the molded resin article 11 to be treated is made up of a basic or substrate member 13 (that will hereinafter be chiefly referred to as the resin material to be recovered) formed of a first resin material (for instance, polypropylene in the case of a vehicle's bumper member) and a resin film 14 (that will hereinafter be chiefly referred to as the resin film to be removed) coated on the front side of the basic member 13, which is formed by a resin coating material composed mainly of a second resin material (for instance, polyurethane in the case of a vehicle's bumper member). As illustrated, the resin article 11 is optionally crushed to small pieces of the desired size or, in this case, the small pieces 12 to be treated. According to the present invention, the small pieces 12 are basically treated, as mentioned below. More illustratively, the resin film 14 to be removed is completely released from the resin material 13 to be recovered, which forms each small piece 12, whereby said resin material 13 is immediately recovered as a raw-form of resin material. Alternatively, that raw-form of resin material 13 is subsequently size-regulated in a form suitable for recycling or in a given particle diameter range, whereby it is recovered as the size-regulated, particulate resin material 15 (that will hereinafter be chiefly called the size-regulated resin material to be recovered), as will be described later. The molded resin articles 11 that can be treated by the invention include not only the car's bumper member mentioned above but also any molded resin articles that may be formed of any recoverable and recyclable, naturally occurring resin or synthetic resin materials by any desired molding or forming means and have at least on parts of their surfaces coated films for decorative, say, polishing, matting and coloring purposes or protective, say, wear-resistant and weather-resistant purposes, said coated films being capable of releasable from said molded resin articles by the application of compression impacts. The small pieces 12 to be treated may be those obtained by crushing molded resin article 11 to the required size as by a cutter mill 201, as will be described later. In the case of the bumper member mentioned above, for instance, the substrate member of polypropylene having a thickness of about 2.5 mm, which is coated with a polyurethane film of 25 µm in thickness, could be cut or otherwise crushed to a piece of about 20 x 20 mm in size. In what follows, reference will be made to the means for treating the molded resin article 11 to recover the resin material 13 or the size-regulated resin material 15. As already stated, Fig. 2 is a series of views of the treating steps, which provides a principal and schematic representation of the general aspect of a first example of a process for pulverizing, separating and size-regulating that resin material. When the first process mentioned above is practically used, applying the required compression impact to the small piece 12 obtained by crushing the molded resin article 11 as by the cutter mill 201 is achieved by using a compression impact applicator 20 that applies the compression impact to the small piece 12 to release and remove the resin film 14 from the resin material 13 to be recovered. In the first process mentioned above, while fine vibrations are applied between the compression impact-applying members of the compression impact applicator 20, the small pieces 12 to be treated are submitted to compression impacts resulting from fine vibrations which are continuously applied to them, causing them to receive the required squeezing and elongating actions, whereby the resin material 13 to be recovered is easily cleared of, and separated from, the resin film 14 coated thereon due to variations in the internal stresses applied to the resin material 13 and resin film 14 forming the small pieces 12, for instance, due to a difference in the internal stresses between the resin material 13 that is relatively easy to squeeze and elongate and the resin film 14 that is relatively difficult to squeeze and elongate. Since the resin film 14 is separated and removed from the resin material 13 in this manner, the resin material 13 can be recovered in the form of a raw-form of resin material, as desired. In connection with the first process, it is noted that while peeling the resin film 14 off the resin material 13, which form together the small pieces 12 to be treated, has been described as occurring only through the squeezing action incidental to the action of the compression impact applicator 20, it is not always required to make use of this compression impact applicator 20 alone; in other words, any equipment of other construction may be used as well, if it provides peeling means that can apply compression impacts based on fine vibrations to the small pieces 12 to be treated, in a continuous manner as needed, so that they can be squeezed and elongated. Figs. 3 represents principally and schematically the general aspects of the steps of the illustrative, second example of the process for pulverizing, separating and size-regulating resin material. FIG. 3 According this second example of process, the compression impact applicator 20 is used to release and separate resin film 14 to remove from the resin material 13 to be recovered, both forming the small pieces 12 to be treated. It is here noted that these examples of processes provide means as to what is to be done when the resin film 14 is relatively firmly deposited on the resin material 13 and so some small pieces are discharged while the resin film 14 remains deposited onto the resin material 13; in other words, they provide means for re-pulverizing the small piece 12 with the resin film 14 remaining deposited onto the resin material 13 and then subjecting the resulting powder to polishing and size regulation. According to the second example of process, as can be seen from Fig. 3, the molded resin article 11 is first subjected to primary crushing at a primary crushing step 101 as by a cutter mill 201 until all the crushed particles pass through a given mesh screen provided with pores having a given diameter by means of punching. After that, the crushed particles are subjected to a first sieving 101a, whereby small pieces 12 are left on the oversize side 101b, while a small amount of the resin film 14 released during the primary crushing is removed on the undersize side 101c. Then, the small pieces 12 left on the sieve are squeezed and peeled off at a squeezing/peeling step 102 with the applicator 20, and then subjected to a second sieving or a two-stage sieving, say, a first sieving 102a1 and a second sieving 102a2. More specifically, the resin material 13 to be recovered is subjected to sufficient squeezing and accelerated peeling at the first sieving stage 102a1 and made so flat and increased in size that it is left behind on the oversize side 102b. When there is not always any need of size-regulating such a material 13 of large size, it is passed into a polishing/size-regulating step 103, where it is polished and size-regulated with a polishing/size-regulating unit 150 that will be explained later at great length, whereby the corners or edges of the resin material 13 that are made up of polished and size-regulated particles are so rounded that it can be recovered as a resin material 15 consisting of size-regulated particles. At the second sieving stage 102a2, on the other hand, there are left behind small pieces 12 of smaller size that have not been subjected to sufficient squeezing and so undergone limited peeling. Such small pieces 12 of smaller size are fed back to the squeezing/peeling step 102, where they are again squeezed. On the undersize side 102c, the resin film 14 or the like is peeled off and removed by such repeated squeezing. Turning again to the resin material 13 of larger size that have been left behind on the oversize 102b side, when there is need of regulating it in terms of size, it is subsequently re-pulverized at the next re-pulverizing step 104 as by a disc mill 202, whence it is passed into a third sieving step 104a, so that the thus re-pulverized small pieces 12 are left behind on the oversize 104b side, while the resin material 13 is separated off on the undersize 104c side. Note that at the time of re-pulverization, the resin film 14 is removed off. Referring here to the small pieces 12 left behind on the oversize 104b side, they may be fed back to the re-pulverization step 104 under they reach an undersize level, or may alternatively be sieved over and over. The resin material 13 separated as mentioned above, on the other hand, is subsequently passed into the next polishing/size-regulating step 105, where it is polished and size-regulated as by a pin mill 203, so that it can be recovers a resin material 15 with the particle diameter lying in a given particle diameter range. As will be apparent to those skilled in the art, the second example of process enables the steps to be variously combined with one another, as desired, and to be used in any desired combination depending on what purposes it is used for. It is noted that a preferable example of the construction of the polishing/size-regulating unit 150 mentioned above is illustrated in Figs. 7 and 8. FIG. 4 Fig. 4 represents a specific, third example of process for pulverizing the material to be treated, for instance, a relatively hard powder material obtained by crushing a molded powder article and/or size-regulating and granulating the material to be treated, for instance, a relatively soft powder material, in which compression impact applicators are used as the pulverizer or the size-regulating/granulating unit. As can be best seen from Fig. 4, the material 17 to be treated is pulverized, as shown at 111, or granulated, as shown at 112, with the use of the compression impact applicator 30. FIGS. 7 AND 8 Fig. 7 is a longitudinally sectioned view that provides a schematic illustration of the general construction of one example of the polishing/granulating unit 150 used by the second example of process for polishing and size-regulating the resin material 13 from which the resin film 14 has been removed, so that it can be recovered as the size-regulated resin material 15 with the corners being rounded as a whole. Likewise, Fig. 8 is a front view for illustrating the polishing and size-regulating actions of the above-mentioned unit 150. Referring here to the construction of the arrangement shown in Figs. 7 and 8, the polishing/size-regulating unit 150 includes a feeding inlet 152 for the material 17 to be treated, such as small pieces 12 obtained by crushing the molded resin article 11 or those obtained by crushing the molded powder article 16, a fixed disk member 151 that is open at a central region and communicates there with the feeding inlet 152, a fixed end plate member 153 joined to the fixed disc member 151 on the side of a side plate member 155 and a rotatable disc member 161 that is opposite to the fixed disc member 151 on the side of the fixed end plate member 153 and through a polishing/size-regulating space 181 and is rotationally rotated by a horizontally extending rotary shaft 162. Note that the rotary shaft 162 is rotationally supported by bearings 163 and 163. The fixed disc member 151 is provided thereon with a series of fixed pins 154 in a plurality of rotational orbits a, and the rotatable disc member 161 is provided thereon with a series of movable pins 164 that lie in alternate relation to the fixed pins 154 and in a plurality of orbits b different from those for the fixed pins 154. Between these fixed and movable pins 154 and 164, the polishing and size-regulating actions are obtained. Further, between the outside of the rotatable disc member 161 and the side plate member 155, there is a screen 171 of given mesh that is provided with pores of a desired diameter by punching, which is spaced away from a discharge space 182. Below the discharge space 182 there is a discharge opening 172, and at a lower region of the interior of the polishing/size-regulating space 181 there is an outlet opening 173. Note that the outlet opening 173 is provided with a plug valve 174 that places it under opening/closing control. According to the polishing/size-regulating unit 150 of the construction mentioned above, as the small pieces 12 or the material 17 to be treated are fed into the feeding inlet 152, they are subjected to both the polishing/size-regulating action and the centrifugal action at the central region of the polishing/size-regulating space 181 and between the fixed and movable pins 154 and 164. Then, they approach the outer periphery of the unit while being polished and size-regulated, and the resultant polished and size-regulated powders pass through the screen 171 into the discharge space 182, whence such powders are discharged through the discharge opening 172 to the outside. The size-regulated resin material 15 with the corners being generally rounded or the size-regulated powder material is removed through the outlet opening 173 by opening the plug valve 173. When the outlet opening 173 communicates with the feeding inlet 152 while the plug valve 174 remains open, the size-regulated resin material 15 removed through the outlet opening 173 or the size-regulated powder material may be fed back to the feeding inlet 152, thus making continuous polishing and size-regulation feasible. The compression impact applicator 20 mentioned above have been explained as applied to releasing and separating the resin film 14 from the resin material 13, both forming the small pieces 12 to be treated. It is noted, however, that such applicators have application not only in the releasing and separation of the resin film 14 from the resin material 13 but also in the pulverization of the relatively hard material to be treated and/or the size-regulation or granulation of the relatively soft material to be treated, for instance, the material obtained by the pulverization of spice such as peppers as well as pulses, e.g., coffee bean, green tea and wood chips, although not illustrated. In other words, they may be easily applicable as a pulverizer, a size regulator or a granulator by controlling and presetting their operating conditions depending on how the material is treated as well as on its properties and nature, especially by regulating the directional fine vibrations in association with the preset gap between the inner and outer compression impact-applying members. When the above-mentioned applicator is used as the pulverizer for treating such a material as a relatively hard powder material, it is required to preset the conditions for the directional fine vibrations such that their amplitudes are reduced while their intensities are increased much considerably in view of the properties of that material that it is, on the one hand, relatively soft but, on the other hand, low in viscosity and fragile. With this pulverizer operated as in the manner mentioned above, the material fed in it is pulverized by a certain type of vigorous and continuous beating action resulting from the vibrations that are slight in amplitude but strong in intensity. Consequently, this material can be pulverized efficiently, effectively, satisfactorily and easily. When the above-mentioned applicator is used as the size-regulating/granulating unit for treating such a material as a relatively soft powder material, by contrast, it is required to preset the conditions for the directional fine vibrations such that their amplitudes are increased while their intensities are somewhat reduced in view of the properties of that material that it is, on the one hand, relatively soft but, on the other hand, high in viscosity and nerve. With this unit operated as in the manner mentioned above, the material fed in it is effectively subjected to the rolling and kneading actions resulting from the fine vibrations that are applied between the inner and outer compression impact-applying surfaces and are increased in amplitude and somewhat reduced in intensity, whereby it is size-regulated or granulated within the required particle diameter range, or alternatively whereby the powders of the material are entangled with one another, so that they can be size-regulated or granulated within the required particle diameter range. Consequently, granulation can again occur efficiently, effectively, satisfactorily and easily. FIGS. 5 and 6 Fig. 5 represents a wire materials in which a conductor e is covered with an insulator i , such as an insulated electrical wire or cord, and a cut wire piece S' , and Fig. 6 illustrates one typical means for applying to this cut wire piece S' fine vibration-induced compression impacts. The wire material S to be treated here may be an insulated electrical wire or cord or, may generally be made by covering the conductor e with the insulator i . For instance, it may be a single- or double-core cord in which a stranded conductor of copper is covered as with polyethylene, vinyl chloride resin or synthetic rubber such as styrene-butadiene type rubber or an insulated electrical wire in which a copper or aluminum wire is covered as with polyethylene, crosslinked polyethylene, polyvinyl chloride or synthetic rubber. The cut wire piece S' that should have an easy-to-handle length may be obtained by cutting that wire material. Fine vibration-induced compression impacts are applied to such a cut wire piece S' . The conductor e of the cut wire piece S' is squeezed by such fine vibration-induced compression impacts, so that it can be driven in a scaly form out of the insulator i due to plastic deformation. Driving this conductor e out of the insulator i may be achieved due to the elasticity of the insulator i composed mainly of synthetic resin or rubber, because the conductor 3 squeezed in a scaly form can pass through the insulator i . One typical means for applying fine vibration-induced compression impacts to the cut wire piece S' is schematically illustrated in Fig. 2. This compression impact-applying means includes a pair of compression impact-applying members T and T' having their compression impact-applying surfaces t and t' that are opposite to and spaced away from each other with a gap x into which the cut wire piece S' is fed. With the two members finely vibrated or one finely vibrated with respect to the other, the cut wire pieces S' fed into the gap are subjected to compression impacts while they are finely vibrated. In this connection, it is noted that the compression impact-applying surfaces t and t' of the compression impact-applying members T and T' are not too much worn away, because they receive stress from the cut wire pieces S' and their powders obtained by pulverization. Further it is noted that since the fine vibration-induced compression impacts reduce the generation of heat on the impact-applying surfaces, not only is it possible to prevent the insulator i of the cut wire piece S' from being fused out during the impact treatment, but it is also possible to prevent the re-deposition of the insulator separated or released off to the scaly conductor e . When the cut wire pieces S' are fed in this state between the inner and outer compression impact-applying members, they are sandwiched between the impact-applying surfaces, inducing a certain resistance between the inner and outer compression impact-applying members. After that, the inner compression impact-applying surface comes successively into circular engagement with the cut wire pieces S' , so that they can receive compression impacts induced by fine vibrations occurring in a substantially horizontal direction with circular motion. Upon the cut wire pieces S' receiving the compression impacts inducted by fine vibrations occurring in a substantially horizontal direction with circular motion, they turn direction from time to time by such fine vibrations with circular motion, so that they can be pulled in a direction that allows them to be most easily squeezed and separated off with respect to the inner and outer compression impact-applying surfaces, and they can turn direction from time to time within the inner and outer compression impact-applying surfaces, thus ensuring that the conductors e are driven out of the insulators i in a scaly form. Especially when the process mentioned above is performed dry, the conductors e are driven out of the cut wire pieces S' in a scaly form for separation from the insulators i . It is noted, however, that the conductors e are recovered in a flaky form, but the insulators i are left in the form of a relatively large lump. A discrete mixture of the conductors e with the insulators i may be sorted out as with a vibration feeder. For experimental purposes, a cord made up of a copper cable covered vinyl chloride resin was cut to a length of 10 mm, and was then treated with a compression impact of 12.0 G in the above-mentioned arrangement including an inner compression impact-applying member of 100 mm in diameter. As a result, the covering material remained nearly intact and the copper cable portions were separated from the covering material in a flaky form. Likewise, metals that are conductors including semiconductors will be capable of being separated and recovered from semiconductor chips for computers, word processors or the like and plastics that are insulators for other parts molded with plastics. FIG. 9 Referring to Fig. 9 that shows a principal and schematic process chart of a fourth example of a practical process for pulverizing, separating and granulating a resin material according to the invention. The process shown in Fig. 9 involves the following treating steps to be carried out. (a) "Primary Crushing" Step 250 This "primary crushing" step 250 is provided to crush the molded resin article or a resin material in the form of a molded powder article for the purpose of obtaining small pieces 12. The "primary crushing" means used, for instance, may be such a cutter mill 201 as already mentioned or a cutter mill having a screen provided with pores of about 4.0 m/m in diameter by means of punching. At the "primary crushing" step 250 the molded resin article is primarily crushed by the cutter mill 201, giving some small pieces 12 of such a size that they do not pass through the screen having pores of a predetermined size, about 4.0 m/m in diameter, even when undergoing such primary crushing action. These small pieces are continuously and repeatedly subjected to the primary crushing until the given size is reached. Some small pieces 12 that have been primarily crushed at least to the predetermined size, on the other hand, pass through the screen. Then, the small pieces 12 that have passed through the screen are sieved by a sieving unit 400 preset at a mesh size of about 1.0 m/m. This sieving enables some small pieces 12 that have not passed through the screen to be left behind on the unit for removal and the resin film 14 or the like that have passed through the screen to be discharged from below the unit. (b) "Primary Compressing and Releasing-1" Step 251 This "primary compressing and releasing-1" step 251 is provided to subject the small pieces 12 obtained at the "primary crushing" step 250 mentioned above to the compressing and releasing treatment at the primary stage. For the compressing and releasing means at the first stage, for instance, use is made of the compression impact applicator 20 modified such that it includes a compression impact applicator 301 built up of a pair of compression impact-applying units arranged vertically, each comprising an inner and outer compression impact-applying surfaces with a clearance of about 2.0 m/m located between them by inserting a suitable damper therebetween, and a screening unit 401 having a mesh size preset at about 2.5 m/m for screening out the small pieces 12 elongated with a somewhat large size by receiving the compression and releasing actions applied by the applicators 301 mentioned just above. At this "primary compressing and releasing-1" step 251, the small pieces 12 crushed to a predetermined size by the primary crushing treatment at the "primary crushing" step 250 are subjected seriatim to the primary compressing and releasing actions between the two sets of the inner and outer compression impact-applying surfaces of the compression impact applicator 301, each with a clearance of about 2.0 m/m, so that they can be elongated with a somewhat large size by receiving the compression impacts applied. With this elongation, a large portion of the resin films 14 is released from the small pieces, and the thus treated pieces are screened out by the screening unit 401 having a mesh size preset at about 2.5 m/m, so that the small pieces 12 from which the resin films 14 have been released, although containing some small pieces with the resin films 14 still deposited on them, are left on the screen for removal, while the thus screened-out resin films 14, although containing some small pieces 12, are discharged from below the screen. (c) "Secondary Compressing and Releasing-2" Step 252 This "secondary compressing and releasing-2" step 252 is provided to subject the small pieces of a somewhat large size to the compressing and releasing treatment at the secondary stage, said small pieces having been elongated with a somewhat large size by receiving the primary compressing and releasing treatment at the "primary compressing and releasing-1" step 251 and left on the screen unit 401. For the compressing and releasing means used at the secondary stage, use is made of a compression impact applicator 302 built up of a pair of compression impact-applying units arranged vertically, each comprising the inner and outer compression impact-applying surfaces with a clearance of about 1.0 m/m located between them by inserting a suitable damper therebetween, and a screening unit 402 having a mesh size preset at about 2.5 m/m for screening out the small pieces 12 elongated with a larger size by receiving the compression and releasing actions applied by the applicators 302 mentioned just above, as in the above-mentioned case. At this "secondary compressing and releasing-2" step 252, the small pieces 12 elongated to a predetermined size by the primary treatment at the "primary compressing and releasing-1" step 251 are subjected seriatim to the secondary compressing and releasing actions between the two sets of the inner and outer compression impact-applying surfaces of the compression impact applicator 301, each with a clearance of about 1.0 m/m, so that they can be elongated with a larger size by again receiving the compression impacts applied. With this elongation, some of the remaining resin films 14 are released out, and the thus treated pieces are screened out by the screening unit 402 having a mesh size preset at about 2.5 m/m, so that the small pieces 12 from which the resin films 14 have been released, although containing some small pieces with the resin films 14 still deposited on them, are left on the screen for removal, while the thus screened-out resin films 14, although containing some small pieces 12, are discharged from below the screen. (d) "Cutting, Dispersing and Releasing" Step 253 This "cutting, dispersing and releasing" step 253 is provided to cut, disperse and release the small pieces 12 elongated to a larger size by receiving the secondary compressing and releasing treatment at the "secondary compressing and releasing-2" step 252 and left on the screen unit 402 with a larger size in view of the requirements for the subsequent treatment, for instance, the need of regulating the particle diameter of the resin material 15 to be finally recovered to within a predetermined particle diameter range or cut, disperse and release such small pieces as the re-primary crushing treatment. For the cutting, dispersing and releasing means used, use is made of a cutter mill 202 provided with a screen having pores of about 6.0 m/m in diameter that are formed by punching and a screening unit 403 having a mesh size preset at about 1.0 m/m for screening out the small pieces 12 that have been cut and dispersed with the required size by receiving the cutting, dispersing and releasing actions of the cutter mill 202. At this "cutting, dispersing and releasing" step 253, the small pieces 12 elongated to a predetermined size by the secondary treatment at the "secondary compressing and releasing-2" step 252 receives the cutting, dispersing and releasing actions by the cutter mill 202, so that they are again cut to a predetermined size, while some small pieces still contain the resin films 14 to be removed. With this re-cutting, some of the remaining resin films 14 are released out, and there are left in the screen small pieces which have not passed through the screen having a given mesh size, about 6.0 m/m even upon receiving the primary crushing action. Such small pieces 12 are repeatedly and continuously cut and dispersed until they reach a predetermined size. On the other hand, the small pieces 12 are obtained by being cut to at least a predetermined size and so passing through the screen. The small pieces 12 that have passed through the screen are again screened out through the screening unit 403 having a mesh size preset at about 1.0 m/m. As a result of this screening, the small pieces 12, some of which remain deposited on them with the resin films 14, are left on the screen, while the resin films 14, some of which are associated with the small pieces 12, are discharged from the screen. It is noted that this "cutting, dispersing and releasing" step may be dispensed with, if there is no need of regulating the particle diameters of the recovered resin material 15. (e) "Tertiary Compressing and Releasing-3" Step 254 This "tertiary compressing and releasing-3" step 254 is provided to subject the small pieces 12 again cut and dispersed with the required size by receiving the cutting, separating and releasing treatments at the "cutting, dispersing and releasing" step 253 and left on the screen to the compressing and releasing treatments at the tertiary stage. For the compressing and releasing means used at this tertiary stage, use is made of a compression impact applicator 303 built up of a pair of compression impact-applying units arranged vertically, each comprising the inner and outer compression impact-applying surfaces with a clearance of about 0.8 m/m located between them by inserting a suitable damper therebetween, and a screening unit 404 having a mesh size preset at about 2.5 m/m for screening out the small pieces 12 elongated with a larger size by receiving the compressing and releasing actions applied by the applicator 302 mentioned just above, as in the above-mentioned case. At this "tertiary compressing and releasing-3" step 254, the resin films 14, some of which are still associated with the small pieces 12 and which are discharged from the treating steps 250 to 253 are subjected seriatim to the tertiary (final) compressing and releasing actions between the two sets of the inner and outer compression impact-applying surfaces of the compression impact applicator 303, each with a clearance of about 0.8 m/m, in association with the small pieces 12 of a somewhat large size cut, dispersed and released at the treating steps 250 to 253, so that they can be elongated with an even larger size by still again receiving the compression impacts applied. With this elongation, some of the remaining resin films 14 are released out, and the thus treated pieces are screened out by the screening unit 404 having a mesh size preset at about 2.5 m/m, so that the small pieces 12 from which the resin films 14 have been released, although containing some small pieces with the resin films 14 still deposited on them, are left on the screen for removal, while the thus screened-out resin films 14, although containing some small pieces 12, are discharged from below the screen. The resin films 14 discharged, some of which still contain the small pieces 12, are fed back as well to the compression impact applicator 301 associated with it. When screening out the resin films 14, some of which still contain the small pieces 12 and which are discharged from the steps 250 to 254 mentioned above, it is possible to reduce as much as possible the amount of the small pieces 12 contained in the resin films 14 removed from below the screen by regulating the mesh size of each of the screening units 400 to 404 to 1 mm. When the screening units 400 to 404 with a mesh size of 1 mm each are used at the treating steps 250 to 254, it is preferable to remove and separate the resin films 14, some of which still contain the small pieces 12 and which are discharged from below the screening units 400 to 404, without being subjected to the re-compressing and releasing treatments at the "tertiary compressing and releasing-3" step 254. (f) "Size-Regulating and Separating" Step 255 This "size-regulating and separating" step 255 is provided to size-regulate the small pieces 12 elongated with a somewhat large size by receiving the tertiary (final) compressing and regulating treatments at the "tertiary compressing and releasing-3" step 254 and left with a larger size on the screen by screening or, in other words, the resin material 13 to be recovered to obtain the size-regulated resin material 15 at the final stage. For the size-regulating and separating means used at this final stage, use is made of the polishing and size-regulating unit 150 already mentioned or a polishing and size-regulating unit 150 having a screen provided in it with pores of about 1.0 m/m in diameter by punching and a blower 501 for sucking the size-regulated resin material 15 as product left in the screen for removal. It is noted that in place of, or in combination with, the blower 501 mentioned above, compressed air may be supplied in a polishing and size-regulating space 181 in the polishing and size-regulating unit 150 mentioned above to stir the resin material 13 to be recovered and the resin material 13 may be fed back to the inlet opening communicating with a hole formed through the fixed end plate 153 by way of a pipe. At this "size-regulating and separating" step 255, the resin material 13 to be recovered in the form of the small pieces 12 elongated to a predetermined size by the secondary (final) treatment at the "tertiary compressing and releasing-3" step 254 is subjected to the size-regulating and separating actions by the polishing and size-regulating unit 150, so that the size-regulated resin material 15 of such a size that it does not pass through the screen having a pore size preset at about 1.0 m/m is left as product. The size-regulated resin material 15 is sucked through the blower 501 for removal, and the resin films 14 including scrap and reduced to a given size or less, which are treated just like dust, are sucked as well by the blower 603 for discharge. (e) "Classifying and Separating" Step 256 This "classifying and separating" step 256 is provide to classify the size-regulated resin material 15 that has been size-regulated and separated at the "size-regulating and separating" step 255 as product and sucked through the blower 501 for removal and the resin films 14, etc., some of which still contain dust and scrap. Used for the classifying and separating means, for instance, are a known cyclone unit 601 in the case of the classification of the former and a known back filter unit 602 in the case of the classification of the latter as well as a blower 603 needed for suction through the back filter unit 602. At this "classifying and separating" step 256, the resin material 15 as product containing dust and scrap, albeit partly, that has been size-regulated and separated at the "size-regulating and separating" step 255 is classified by the cyclone unit 601, and can then be collected as product for recovery, as desired. Dust, scrap and the like separated by the cyclone 601 are combined with the resin films 14, some of which contain dust, scrap and the like, and then separated by the back filter unit 602 under the suction by the blower 603 for collection. The thus obtained resin material 15 may immediately be used for resin molding. It is noted, however, that the resin material obtained here is not completely cleared of the resin films 14. When the resin material 15 contains the resin films 14 in a relatively low proportion, it may be applied as a resin material used for resin molding with no difficulty, if it is pulverized to a fine particle size, for instance, under 100 µm. Further, it is noted that the resin films 14, etc., collected by the back filter unit 602 may also be used as resin material, if they are pulverized to a fine particle size, for instance, under 100 µm. The resin films, if finely pulverized, may also be used as a resin material for resin molding with no difficulty. It is also noted that in this process various combinations of the treating steps may be feasible; that is, any desired combinations of the treating steps may be applied depending on what purposes that process is used for. In other words, this process may be modified in a manner that will now be explained with reference to Fig. 9. According to a fifth example of process, a soft material is treated at the "primary crushing" step 250 with the exception that the screening treatment with the screening unit 400 is omitted; then at the "tertiary compressing and releasing-3" step 254, provided that a single-compressing and releasing treatment is done with a single-stage compression impact-applying unit, followed by screening with the screening unit 400; and finally at the "size-regulating and separating" step 255 provided that the polishing and size-regulating treatments are done with the pin mill of the polishing and size-regulating unit 150, whereby it is possible to recover the (size-regulated) resin material 15 that is usable for resin molding. This process gives a recovery rate of 45% and a residual resin film amount of 0.49% by weight. Further, in a sixth example of process that is provided for treating a hard material and is largely different from the process shown in Fig. 9, use is made of a compression impact applicator of a large size that has a large throughput capacity (30 to 50 kg/hr) and a pin mill (having a throughput capacity of 30 to 50 kg/hr). Explaining this with reference to Fig. 9, (1) the "primary rushing" step 250 or the "cutter mill" step 201 is done, followed by (2) the "primary compressing and releasing-2" step or a single-stage compressing and releasing treatment. Subsequently, (3) the "primary compressing and releasing-1" step or screening 401 (having a mesh size of 1.3 mm) is carried out, and (4) the "secondary compressing and releasing-2" step or a single-stage compressing and releasing treatment is again performed, immediately followed by (5) the "size-regulating and separating" step 255 or a polishing and size-regulating step using a 1.5-mm screen of the polishing and size-regulating unit 150. After that, (6) the single-stage compressing and releasing treatment is performed, followed by (6) treatment with the polishing and size-regulating unit 150 or re-polishing and size-regulating treatments using a pin mill having a 1.5-mm screen. The recovery rate is 71 to 75% and the amount of residual resin films is 0.44 to 0.46% by weight. By the screening treatment using the screening unit 401 at the above-mentioned step (3) or at the "primary compressing and releasing-1" step 251, 2 to 4% of resin films (or 5.8% by weight of (resin) film coatings) are obtained and rejected. At the size-regulating and separation steps (5) and (7) 12 to 14% (about 3.0% by weight of film coatings) and 0 to 12% (about 2.7% by weight of film coatings) are separated, and a total of about 24% of film coatings can be used as a recycling material. Through the final classifying and separating step, about 72 to 74% of the (size-regulated) resin material 15 including about 0.46% by weight of film coatings are recovered. It is noted that the above-mentioned resin material 15 containing 0.46 to 0.49% by weight of film coatings can be almost completely filtered out (to 0.15% by weight to 0.20% by weight) by making use of a known filter gauze for extruders (cf. U.S. Patent No. 4,850,840 issued to Gneuss). The following Table 1 shows the physical properties of the thus recovered polypropylene alone. Recovered, Size-Regulated Resin Material What was measured Units Grade Virgin Recovered, Size-Regulated Resin material MI g/10 min. 16.0 16.5 Density g/cm 3 0.965 0.968 HDT °C 110 109 Tensile Break Elongation % 102 84 Yield Strength kg/cm 2 191 187 Flextural Strength kg/cm 2 261 253 Modulus kg/cm 2 13,200 13,500 IZOD 23°C kgcm/cm 66 59 -30°C kgcm/cm 6.5 6.2 HRIT -30°C J 27.3 (Ductility) 28.7 (Ductility) Rockwell Hardness R scale 49 46 Gloss % 42 45 Appearance Visual o ○ o - Δ The following Table 2 shows the blend physical properties of a mixture of 30% of the same regulated resin material as referred to in Table 1 and 70% of virgin. Virgin/Recovered, Size-Regulated Resin Material = 70/30 Blend Physical Properties What was measured Units Grade Virgin Recovered, Size-Regulated Resin material MI g/10 min. 16.0 17.0 Density g/cm 3 0.965 0.966 HDT °C 110 109 Tensile Break Elongation % 102 88 Yield Strength kg/cm 2 191 190 Flextural Strength kg/cm 2 261 262 Modulus kg/cm 2 13,200 13,900 IZOD 23°C kgcm/cm 66 66 -30°C kgcm/cm 6.5 6.4 HRIT -30°C J 27.3 (Ductility) 27.1 (Ductility) Rockwell Hardness R scale 49 58 Gloss % 42 43 Appearance Visual o ○ o * Injection Molding after Dy Blending Still further, according to a seventh process, (1) the "primary crushing" step 250 or the "cutter mill" step 201 is carried out, followed by (2) the "primary compressing and releasing-1" step or a single-stage compressing and releasing treatment with a compression impact applicator having inner and outer compression impact-applying surfaces with a clearance of about 2.5 m/m. Then, (3) the "secondary compressing and releasing-2" step or the compressing and releasing treatments again occur between the inner and outer compression impact-applying surfaces with a clearance of about 2.0 m/m, followed by (4) the "tertiary compressing and releasing-3" step or a single compressing and releasing treatment, for which use is made of a compression impact applicator 301 having inner and outer compression impact-applying surfaces with a clearance of 2.0 m/m. At this stage, the (size-regulated) resin material 15 containing about 2.0% by weight of film coatings are obtained. This is immediately followed by (5) the "size-regulating and separating" step 255 or polishing and size-regulating steps making use of the polishing and size-regulating unit 150 having a 1.5-mm screen. Upon the above-mentioned steps completed, a recovery rate of about 84 to 86% is obtained with an amount of residual film coatings of 0.5% by weight. The throughput is 80 to 100 kg/hr with the above-mentioned four inlet stirring blades rotating at 20 rpm.

Claims: A polishing and size-regulating apparatus for polishing and size-regulating small pieces (12, S') of resin material, thereby recovering a raw-form of resin material, said small pieces being obtainable from a molded resin article (11, S) having a resin film (14) on its surface, by crushing the molded resin article into a plurality of small pieces (12, S'), squeezing said plurality of small pieces (12, S') by applying thereto compression impacts based on fine vibrations, and removing from time to time resin film coatings (14, i) released by said squeezing, characterized in that said apparatus comprises fixed polishing and size-regulating means (150) that lie on a fixed disc member (151) with the central region communicating with an inlet opening (152) for the material to be treated and are provided with a series of fixed pins (154) in a plurality of rotational orbits (a), movable polishing and size-regulating means that lie on a rotatable disc member (161) capable of being rotationally driven in opposition to said fixed disc member (151) and are provided with a series of movable pins (164) in a plurality of rotational orbits (b) different from those for said fixed pins (154) ; and sorting means (171, 172) that lie on the outer periphery of the combined fixed/movable pins (154, 164) for arbitrarily sorting out the material having a desired or lower particle size and communicate with a discharge port (182), and removal means (174) for removing the material having a desired or higher particle size through a removal port (173), said material to be treated being capable of being polished and size-regulated between said fixed pins (154) and said movable pins (164). A polishing and size-regulating apparatus as claimed in claim 1, characterized in that the material removed through said removal port (173) is fed back to said inlet opening (152).

Inventors: ITAKURA YUZO, NISHIBORI SADAO, ITAKURA, YUZO, NISHIBORI, SADAO
Applicants: EIN CO LTD TECHNICAL CENTER, EIN CO., LTD. TECHNICAL CENTER
Application year: 1992
Main classification: B29B17
IPC codes: B02C21, B02C13, B02C2, B29B17, B29B13