Method of manufacturing a chemically adsorbed film

Abstract: This invention aims to form uniformly and effectively an ultra thin chemical adsorbing film having an excellent water repellent property, oil repellent property, and contamination-proof property on the surface of a substrate by chemically adsorbing in a gas phase atmosphere. A chemically adsorbed film can be formed on any type of substrate and in a short time by chemically adsorbing a chlorosilane based surface-active agent on the surface of a substrate having active hydrogen groups. Further, a chemically adsorbed monomolecular film, or a polymer film, can be formed on any type of substrate and in a short time by forming a siloxane based monomolecular film or a polysiloxane adsorbed film in a gas atmosphere having a chlorosilane based surface-active agent having plurality of chlorosilyl groups.

Description: This invention relates to a method of forming a chemically adsorbed monomolecular film on the surface of a substrate in a gas phase atmosphere. The invention also relates to a method of laminating a chemically adsorbed monomolecular film via a siloxane based chemically adsorbed monomolecular film. Previously, the LB method (Langmuir Blodgett method) or a liquid phase adsorption method was used to form a monomolecular film. In the LB method, a straight chain molecule having a hydrophilic group and a water-repelling group is layered on a water surface, and the water is manipulated to deposit the layer on a substrate surface. In the LB method, which is an essentially wet process, a monomolecular film is fixed to the substrate by only Van der Waals' force and mechanical strength is weak. The chemical adsorption method using a liquid phase is a method of forming a monomolecular film via silicon bonding. The method includes dipping and holding a substrate in a non-aqueous solvent in which a molecule containing a carbon chain and having an active silane group at one end is reacted with an active hydrogen of a hydroxyl group on the surface of the substrate. The principle of forming a chemically adsorbed monomolecular film in the solution abovementioned is to form a monomolecular film by initiating a dehydrochlorination reaction between a hydroxyl group on the surface of the substrate and a chlorosilyl group of the chlorosilane based adsorbent. In this manufacturing method, a monomolecular film can be obtained by dipping and holding a substrate such as a metal in an adsorptive liquid in which a chlorosilane based surface active material is dissolved in a non-aqueous solvent. (For reference, see the specification of US-A-4,673,474, J.Am.Soc. 1983, 105, 674-676 (Sagiv), "Thin solid Films", 99 (1983) 235-241(Sagiv), "The American Physical Society" Vol.39, No.7 (1989)). The chemically adsorbed monomolecular film, which can be obtained by the method abovementioned, bonds to the surface of the substrate via a strong chemical bond. The film does not separate from the substrate as long as the surface of the substrate is not scraped. However, this method is also a wet process, utilizing a chemical reaction in a solvent in the liquid state. The chemical adsorption method using a liquid phase requires two to three hours to absorb at room temperature and to form a satisfactory adsorbing film, since the adsorbing reagent is diluted with solvent. In addition, in the wet method, the types of solvent and substrates for adsorption are very severely limited, since some of the substrates can be damaged by the solvent or hydrochloric acid which is generated in the adsorption reaction. Further, the used solvent often contains minute particles of dust, and pinholes are easily generated in an ultra thin film. In addition, the substrate itself may swell or be dissolved by some types of solvents. Furthermore, in forming a monomolecular film by the wet process abovementioned, contamination of the liquid solution cannot be easily avoided. For example, in forming a monomolecular film for an electronic device such as an insulated film for a capacitor, electronic, optical or precision parts such as a protective film for a laser disk, contamination is needed to be avoided as much as possible. In forming a thin film by deposition of a monomolecular film, the wet process abovementioned requires washing and drying of the substrate. As a result, contamination and the number of man-days are increased. On the other hand, there are dry processes for forming organic ultra thin films such as plasma polymerization and vacuum deposition methods. In these methods abovementioned, the types of molecules which can be obtained are limited very severely, and forming a monomolecular film can be very difficult. This invention aims to provide a method of forming a monomolecular film by a method using a gas phase to solve the problems abovementioned. Further, this invention aims to provide a method in which the type of substrate is not limited, an adsorbing solvent is not required, and an adsorbed film can be formed effectively in a short time. Further, this invention aims to form a pinhole-free chemically adsorbed film firmly on a substrate having a uniformly thin thickness and to improve the efficiency of film formation. GB-A-1508587 discloses a process of preparing a treated powder for use in an electrostatic dry powder coating operation, in which a powder consisting of semi-conductive particles is treated with an organic dihalo- or trihalo-silane in gaseous form and is then subjected to a post-treatment in which the powder is reacted with water vapor to provide the particles with a surface layer of improved electrical resistivity. The present invention provides a method of forming a chemically adsorbed monomolecular film in a gas phase on a surface of a substrate containing active hydrogen groups, said method comprising the steps of: placing a substrate in a vacuum vessel at decreased pressure or filled with dry atmosphere and contacting a chlorosilane based surface adsorbent having a reactive chlorosilyl group at one end or an alkoxysilane based surface adsorbent having a reactive alkoxysilyl group at one end in a gas phase with said surface of said substrate and initiating a condensation reaction in a gas phase atmosphere, removing unreacted chlorosilane or alkoxysilane based surface adsorbent from the vacuum vessel by evacuation, and contacting the surface of the substrate with water or water vapor. It is preferable in this invention that the chlorosilane based surface adsorbent is represented by CH 3 -(R) m -SiCl n X 3-n or CF 3 -(CF 2 ) p -(R) m -SiCl n X 3-n , where p represents 0 or an integer, m represents 0 or 1, R represents a hydrocarbon group containing a methylene group, vinylene group, ethynylene group, a silicon group or an oxygen group, X represents hydrogen, a lower alkyl group or lower alkoxy group, and n represents an integer from 1 to 3. It is preferable in this invention that the chlorosilane based surface adsorbent is selected from CH 3 (CH 2 ) 9 SiCl 3 , CH 3 (CH 2 ) 15 SiCl 3 , CH 3 CH 2 O(CH 2 ) 15 SiCl 3 , CH 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , CF 3 CH 2 O(CH 2 ) 15 SiCl 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , F(CF 2 ) 4 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 9 SiCl 3 , CF 3 COO(CH 2 ) 15 SiCl 3 and CF 3 (CF 2 ) 5 (CH 2 ) 2 SiCl 3 . It is preferable in this invention that the substrate is selected from the group consisting of metal, ceramics, glass, plastic, a semiconductor, an inorganic shaped solid and an organic shaped solid. It is preferable in this invention that the substrate surface is plastic which has been made hydrophilic by treating with a plasma containing oxygen or in a corona atmosphere. It is preferable in this invention that the surface of the substrate is contacted with an alkoxysilane based surface adsorbent which is heated to at least 50°C to initiate the condensation reaction. It is preferable in this invention that the chlorosilane based surface adsorbent is a silane compound having chlorine atoms. It is preferable in this invention that the silane compound having chlorine atoms is selected from SiCl 4 , SiHCl 3 , SiH 2 Cl 2 or Cl-(SiCl 2 O) n -SiCl 3 herein n represents an integer. It is preferable in this invention that the gas phase of the surface adsorbent is produced by heating the chlorosilane or alkoxysilane based surface adsorbent or bubbling the chlorosilane or alkoxysilane based surface adsorbent or the adsorbent solution containing a chlorosilane or alkoxysilane based surface adsorbent by using a dry inert gas as a carrier. It is preferable in this invention that the vacuum vessel is at a decreased pressure lower than at least 1.33 mPa (10 -5 Torr). It is preferable in this invention that the surface of the substrate is irradiated by ultraviolet rays at the same time when the reactive gas is introduced. Fig. 1 is a sectional view showing the forming a monomolecular film of the invention, which is enlarged to a molecular level. Fig. 2 is a sectional view showing the forming an inner layer film on the surface of substrate, which is enlarged to a molecular level. Fig. 3 is a sectional view showing the forming an inner layer film on the surface of a substrate, which is enlarged to a molecular level. Fig. 4 is a sectional view showing a laminated layer on a substrate, which is enlarged to molecular level. According to the invention, an adsorbed monomolecular film can be formed on the surface of a substrate by contacting a silane based surface adsorbent having an active silicon group at one end with the surface of a substrate in a gas phase atmosphere to cause a condensing reaction. According to the method abovementioned, an adsorbing solvent is not required and a pinhole-free adsorbing film can be formed having a uniformly thin thickness on the surface of the substrate in a short time, effectively. A chemically adsorbed film can be formed more effectively and with a higher reaction by using a chlorosilane based adsorbent or an alkoxysilane based adsorbent as the silane based surface adsorbent and by using a dehydrochlorination reaction or a de-alcohol reaction as the condensing reaction. According to one aspect of the invention, a pinhole-free chemically adsorbed monomolecular laminated film having a uniformly ultra thin thickness, which is excellent in heat-resistance and durability as a monomolecular outer layer film, is formed by chemically bonding layers of a monomolecular layer film through a siloxane inner monomolecular layer film on a substitute surface. By adsorbing and layering the straight chain molecule as a silane based adsorbent containing a chlorosilane group, a dehydrochlorination reaction is brought about between -OH groups of an inner siloxane based monomolecular film, which has numerous -SiOH groups and which are formed on the surface of a substrate in the step abovementioned, and an outer monomolecular layer film, is chemically bonded to the substrate via -SiO bonds. As a result, a chemically bonded outer layer film is formed which is extremely excellent in close adherence. After removing atoms or molecules which cause contamination on the surface of a substrate by decreasing pressure such as by evacuation, a silane based surface adsorbent having an active silane group at one end and a material containing a straight carbon chain having a plurality of chemical bonds of chlorine and a silicon group (a chlorosilane group; -SiCl n X 3-n , n represents 1, 2, 3 and X represents a functional group : chemical adsorbent) are introduced to the surface of the substrate or to the surface of a chemically adsorbed film beforbond to chemically react with hydrophilic groups on the surface of the substrate or chemically adsorbed film to form siloxane bonds. Thus, a monomolecular layer film can be formed. As a result, contaminants may be in the monomolecular film can be decreased. In previous methods, a chemical adsorbent was dissolved in a great amount of solvent. Thus, a chemically adsorbed film was easily effected by the purity of the solvent. On the other hand, according to the invention, the lower level of contamination depends only on the degree of purity of chemical adsorbent. Thus contamination can be decreased by increasing the degree of purity of the chemical adsorbent. Further, water or hydrogen chloride molecules are not an obstacle to chemical adsorption since the water or hydrogen chloride can be easily removed by diffusing. Chemical adsorption is completed when hydrophilic group reaction sites have run out. After forming a chemically adsorbed monomolecular film, a monomolecular film having a uniform thickness can be obtained by evacuation to remove unreacted chemically adsorbed molecules which is adsorbed on the surface of chemically adsorbing film physically. Then, a monomolecular film can be formed automatically. By using a material containing a straight carbon chain having a plurality of chemical bonds of chlorine and silicon (-SiCl n X 3-n group, n represents 1, 2, 3 and X represents a functional group), a chemically adsorbed film can be laminated on a substrate surface within a vacuum vessel by introducing water vapor as the reactive gas or introducing hydrogen gas and oxygen gas and irradiating with ultraviolet rays to react with unreacted chemical bonds of chlorine and silicon to form a silanol group after evacuation to remove a material containing unreacted chemical bonds of chlorine and silicon. Then, contamination of the laminated chemically adsorbing film can be avoided. A substrate having hydroxyl groups including a metal such as Al, Cu, stainless steal, ceramics, glass, plastic, a semiconductor, an inorganic shaped solid, an organic shaped solid and other hydrophilic substrates on the surface can be used in this invention. A substrate having no hydroxyl groups on the surface can be used in the invention by pre-treating the surface of the substrate at 100W for twenty minutes in a plasma atmosphere including oxygen, or treating the surface of substrate with corona to render the surface hydrophilic, i.e., to introduce hydroxyl groups to the surface of the substrate. Polyamide resin and polyurethane resin do not need a surface treatment since they have imino groups (>NH) on the surface. The hydrogen of the imino group (>NH) and the chlorosilyl group of the chemical adsorbent are used to bring about a dehydrochlorination to form a siloxane bond. SiCl 4 , SiHCl 3 , SiH 2 Cl 2 , and Cl-(SiCl 2 O) n -SiCl 3 (n represents an integer) can be used as a material containing a chlorosilyl group to form an inner layer film in the invention. It is preferable to use SiCl 4 since this molecule is small and reactive with hydroxyl groups. Thus a great effect of making a surface of a substrate hydrophilic can be obtained. Non-aqueous gas such as dry nitrogen can be used as the gas atmosphere having a material containing a chlorosilyl group. In forming an outer surface layer film, as numerous hydroxyl groups are formed on the surface of an inner layer film, the hydroxyl groups can be reacted with a hydrocarbon based adsorbent having a chlorosilyl group or a fluorocarbon based adsorbent. When the surface of the substrate is highly hydrophilic, the surface layer film can be formed on the surface of a substrate directly, and forming an inner layer film is not necessary. According to the invention a monomolecular film is formed on the surface of a substrate by a gas phase method in a decreased pressure atmosphere. Some oxides, metals, ceramics, glass, plastic and semiconductors can be used as a material for the substrate. Of course, a plastic film on which surface abovementioned materials are deposited, or a laser disk, on which surface a recording material is applied, can be used as a substrate. A chemically adsorbed film can be formed densely on the substrate covered with hydrophilic groups. A hydrocarbon group having an active hydrogen group such as a hydroxyl group, a carbonyl group, an imino group or an imino group can be used as a hydrophilic group. For example, a hydroxyl group can be prepared as a hydrophilic group by dipping and holding a substrate in a nitric acid solution and followed by washing with pure water. After the substrate is dried, it is placed in a vacuum vessel. When the desirable degree of a vacuum is obtained, a chemical adsorbent is introduced and contacted with the surface of the substrate in a gas atmosphere to cause a chemical adsorption reaction. A chemical adsorbent having a high vapor pressure at room temperature can be used for the gasphase adsorbent by using an inert gas such as dehydrated and dried argon or nitrogen as a carrier gas. A chemical adsorbent in the liquid phase at room temperature can be used as vapor by heating higher than the boiling point or by bubbling dehydrated and dried argon and nitrogen as a carrier gas to pass through the chemical adsorbent. A chemical adsorbent in the solid state at room temperature can be provided by placing in an incrucible and heating higher than the boiling point to be vaporized. The chemical adsorbent having reactive silane groups, which reacted with the hydrophilic active hydrogen on the surface of the substrate, was carried to the surface of the substrate and formed a siloxane bond. Thus a chemically adsorbed monomolecular film can be formed via the siloxane bond abovementioned. A reaction was carried out in a gas phase atmosphere i. e., in a decreased pressure atmosphere or non-aqueous and inert gas atmosphere, and hydrogen chloride which was generated by the chemical adsoption reaction was carried away from the surface of the substrate rapidly by diffusing. As a result, a secondary chemical reaction such as slowing of the adsorbing reaction or corrosion of the substrate by hydrogen chloride can be prevented. The phenomena abovementioned is one of the advantages of the chemical adsorption in the gas phase. In the gas phase, the density of the thermal motion of the molecules which prevents a reactive product from diffusing is much lower than that in a liquid phase, and a reactive product can be diffused very rapidly. On a gas phase chemical adsorption, a hydrophilic group having an active hydrogen as a reaction site was used up by the adsorption reaction, the adsorbing reaction was terminated automatically and then a chemically adsorbed film was formed. After that, the vacuum vessel was evacuated to separate and remove molecules of unreacted chemical adsorbent which were adsorbed physically on the surface of the substrate. In the process abovementioned, heating the substrate at a temperature which does not decompose the chemically adsorbed monomolecular film is an effective means to promote separating and removing the molecules of the unreacted chemical adsorbent. A silane based surface adsorbent having a chlorosilyl group (-SiCl n X 3-n ) or an alkoxysilane group (-Si(OA) n X 3-n ) at one end and a fluorocarbon group at another end can be used as a chemical adsorbent (where n represents an integer from one to three, X represents hydrogen, a lower alkyl group or a lower alkoxy group, and A represents a lower alkyl group). Among the silane based surface adsorbents abovementioned, it is preferable to use a chlorosilane based surface adsorbent since the chemical reaction can be carried out at room temperature to form a chemically adsorbed monomolecular film. Among the chlorosilane based surface adsorbents, it is preferable to use a trichlorosilane chemical adsorbent (where n represents 3) as adsorption molecules to form the siloxane bonds. It is preferable to use a silane based surface adsorbent having a straight chain shape to improve the density of the adsorbing molecules. More particularly, it is preferable to use a chlorosilane based adsorbent represented by CH 3 -(R) m -SiCl n X 3-n , or CF 3 -(CF 2 ) p -(R) m -SiCl n X 3-n , (where p represents 0 or an integer, m represents 0 or 1, R represents a hydrocarbon group containing a methylene group, vinylene group (-CH=CH-), ethynylene group (-C≡C-), a silicon group (Si-), or an oxygen atom, (-O-), X represents hydrogen, a lower alkyl group or lower alkoxyl group, and n represents an integer from 1 to 3). More particularly, CH 3 (CH 2 ) 9 SiCl 3 , CH 3 (CH 2 ) 15 SiCl 3 , CH 3 CH 2 O(CH 2 ) 15 SiCl 3 , CH 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , CF 3 CH 2 O(CH 2 ) 15 SiCl 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , F(CF 2 ) 4 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 9 SiCl 3 , CF 3 COO(CH 2 ) 15 SiCl 3 , CF 3 (CF 2 ) 5 (CH 2 ) 2 SiCl 3 can be used. Further, it is preferable that the R group in the above formula contains a vinylene group or an ethynylene group, since the non-saturated bond can be polymerized by a catalyst, light or irradiation with a high energy beam to form a firmer monomolecular film having bonds between molecules. Further it is preferable to use a silane based surface agent containing a fluorocarbon group, since the silane surface agent containing a fluorocarbon group has an excellent water-repellent effect and electric insulation property. Another embodiment of the invention concerns forming a laminated film by a gas phase method at a decreased pressure atmosphere. A material containing a straight carbon chain having a plurality of chemical bonds of chlorine and silicon (i.e., a -SiCl n X 3-n (chlorosilyl) group where n represents 1, 2, 3 and X represents a functional group) as a chemical adsorbent was bubbled using an inert gas such as dehydrated and dried argon or nitrogen as a carrier gas to carry to the surface of the substrate in the gas phase to be chemically adsorbed by exposing to the surface of the substrate (adsorbing step). After the adsorbing step, material containing unreacted chlorosilyl groups which was physically adsorbed to the surface of the substrate was separated or removed (removing step) by evacuating the vessel. Then unreacted chlorosilyl groups of the chemically adsorbed material were reacted with steam introduced to the surface of the substrate or reacted by introducing hydrogen gas and oxygen gas to the surface of the substrate and irradiating with ultraviolet rays to form silanol groups to form a monomolecular layer film. A process of forming a monomolecular adsorbed film comprised the steps abovementioned. After the process of forming a monomolecular adsorbed film on which surface numerous hydroxyl groups exist, the chemically adsorbed monomolecular film can be laminated by repeating the step of forming a monomolecular adsorbed film (i.e., a step of forming a chemically adsorbed film). Thus, a monomolecular laminated film can be formed. After forming a chemically adsorbed monomolecular film with an adsorbent having a plurality of chlorosilyl groups by the step abovementioned, a fluorocarbon monomolecular film can be formed by exposing the adsorbent to the surface of the chemically adsorbed film abovementioned in the gas phase by heating the silane based adsorbent containing a fluorocarbon group or by bubbling the adsorbent with an inert gas such as dehydrated and dried argon or nitrogen as a carrier gas to chemically react with silanol groups contained on the surface of the chemically adsorbed film, and then a monomolecular laminated film can be formed. It is preferable to use the step abovementioned, since a silane based surface adsorbent containing a fluorocarbon group can be densely and chemically adsorbed to the substrate on which surface has a few exposed hydroxyl groups. SiCl 4 , SiHCl 3 , SiH 2 Cl 2 , Cl(SiCl 2 O) n SiCl 3 , H k (R 1 ) 3-k Si(R 2 ) n SiCl m (R 3 ) 3-m can be used as a material having a plurality of chlorosilyl groups. In general, a material having numerous Cl-Si bonds is preferable. A silane based adsorbent can be chemically adsorbed to the material abovementioned more densely. In the above formula, n represents an integer, k or m represents an integer from 1 to 3, R 1 or R 3 represents a lower alkyl group, R 2 represents a methylene group having a carbon number greater than 1. More particularly, it is preferable to use SiCl 4 as a material containing a chemical bond of chlorine and silicon since SiCl 4 are small and reactive to hydroxyl groups and have an excellent effect making the surface of substrate hydrophilic uniformly. A monomolecular film being one layer or a laminated monomolecular is called as a chemically adsorbed monomolecular film in this invention. In a laminated monomolecular film, a laminated layer is required to be chemically bonded to another laminated layer. The invention can widely be applied to the following surfaces. Materials made of e.g. pottery, porcelain, ceramics, glass, plastic, wood, or stone are applicable as the substrate. The surface of the substrate may be also coated with paint in advance. Examples of ceramics cutlery: a kitchen knife, scissors, a knife, a cutter, a graver, a razor, hair clippers, a saw, a plane, a chisel, a gimlet, a badkin, a bit (cutting tools), a drill tip, an edge of a mixer, a juicer, a blade of a mill, a blade of a lawn mower, a punch, a straw cutter, a staple of a stapler, a can opener or a surgical knife. Examples of products in the pottery industry: products made of pottery, glass, ceramics or enameled products. For example, sanitary potteries (a chamber pot, a wash-bowl, a bathtub), tableware (a rice-bowl teacup, a dish (plate), a bowl, a teacup, a glass, a bottle, a coffee-pot (siphon), a pan, an earthenware mortar, (a cup), vases (a flower bowl, a flowerpot, a bud vase), water tanks (a breeding cistern, an aquarium water tank), chemical experiment appliances (a beaker, a reactor vessel, a test tube, a flask, a laboratory dish, condenser, a mixing rod, a stirrer, a mortar, a bat, a syringe), a bath tile, a roof tile, enameled ware, an enameled washbowl, an enameled kettle, an enameled pan. Examples of ceramics molding parts: dies for press molding, dies for cast molding, dies for injection molding, dies for transfer molding, dies for compression molding, dies for inflation molding, dies for vacuum molding, dies for blow forming, dies for extrusion molding, dies for fiber spinning, a calendar processing roll. Examples of plastics or ceramics forming molds for food: cake, cookies, bread-baking, chocolate, jelly, ice cream, oven ware, ice trays. Examples of resin(s): a polyolefin such as a polypropylene and polyethylene, a polyvinylchloride plastic, a polyamide, a polyimide, a polyamideimide, a polyester, an aromatic polyester, a polycarbonate, a polystyrene, a polysulfide, a polysulfone, a polyethersulfone, a polyphenylenesulfide, a phenolic resin, a furan resin, a urea resin, a epoxy resin, a polyurethane, a silicon resin, an ABS resin, a methacrylic resin, an acrylate resin, a polyacetal, a polyphenylene oxide, a polymethylpentene, a melamine resin, an alkyd resin, an unsaturated polyester cured resin. Examples of rubber: a styrene-butadiene rubber, a butyl rubber, a nitril rubber, a chloroprene rubber, a polyurethane rubber, a silicon rubber. Examples of ceramics, plastic or resin coating household electric appliances: a refrigerator, a freezer, an air conditioner, a juicer, a mixer, a blade of an electric fan, a lighting apparatus. a dial plate, a dryer for a perm. Examples of plastic sporting goods: skis, a fishing rod, a pole for the pole vault, a boat, a yacht, a surfboard, a fishing line, a float. Examples applying to vehicle parts: (1) ABS resin: a lamp cover, an instrument panel, trimming parts, a protector for a motorcycle. (2) Cellulose plastic: a car mark, a steering wheel (3) FRP (fiber reinforced plastics): a bumper, an engine cover (jacket) (4) Phenolic resin: a brake (5) Polyacetal: wiper gear, a gas valve (6) Polyamide: a radiator fan (7) Polyarylate (polycondensation polymerization by bisphenol A and pseudo phthalic acid): a direction indicator lamp (or lens), a cowl board lens, a relay case (8) Polybutylene terephthalate (PBT): a rear end, a front fender (9) Poly amino-bismaleimide: engine parts, a gear box, a wheel, a suspension drive system (10) Methacrylate resin: a lamp cover lens, a meter pannel and its cover, a center mark (11) Polypropylene: a bumper (12) Polyphenylene oxide : a radiator grill, a wheel cap (13) polyurethane: a bumper, a fender, an installment pannel, a fan (14) Unsaturated polyester resin: a body, a fuel tank, a heater housing, a meter pannel. Examples of plastic or resin coating office supplies: a desk, a chair, a bookshelf, a rack, a telephone stand table, a rule (measure), a drawing instrument. Examples of building materials: materials for a roof, an outer wall and interiors. Roof materials such as brick and slate. Outer wall materials such as wood (including processed manufactured wood), mortar, concrete, ceramic sizing, brick, stone, and plastic. Interior materials such as wood (including processed wood), plastic, a paper. Examples of building stones: granite, marble and others for use as a building, a building material, an architectural fixture, an ornament, a bath, a grave stone, a monument, a gatepost, a stone wall, a paving stone. A chemically adsorbed film can be formed on the surface of a substrate by forming a siloxane bond by chemically reacting hydrophilic groups on the surface of the substrate with the silane based surface adsorbent. The substrate is placed in a vacuum vessel and exposed to a silane based adsorbent having a reactive silane group at one end, which is in a gas phase. The gas phase silane based surface adsorbent is produced by heating the adsorbent or by bubbling using a dehydrated and inert gas such as argon or nitrogen as carrier. Then a monomolecular film having a uniform thickness can be formed by evacuating the vessel to remove unreacted silane based surface adsorbent. Other embodiments of forming a monomolecular film in a gas phase according to the invention will be described as follows; In one embodiment, the step of forming a monomolecular film includes an adsorbing step, a removing step and a step of forming a monomolecular film. In the adsorbing step, after placing a substrate having a hydrophilic group at the surface in a vacuum vessel, a material containing a straight chain carbon chain having a plurality of chemical bonds of chlorine and silicon (-SiCl n X 3-n group, n represents 1, 2,3 and X represents a functional group) is introduced to the surface of the substrate in a gas phase and is adsorbed on the substrate. In the removing step, after the adsorbing step, a material containing a unadsorbed chemical bond of chlorine and silicon on the surface of substrate is removed by evacuating the vessel. In the step of forming a monomolecular film, a monomolecular film containing a silanol group can be formed by reacting an unreacted chemical bond of chlorine and silicon which is contained in the material having the chemically adsorbed bond of chlorine and silicon abovementioned. Another embodiment includes a step of forming a chemically adsorbed film in which a chemically adsorbed film can be laminated by repeating the step of forming the monomolecular adsorbing film abovementioned several times. Another embodiment includes a step of laminating a chemically adsorbed monomolecular film in which after the step of forming an inner chemically adsorbed film, an outer monomolecular film can be formed by heating a silane based surface adsorbent having a reactive silane group at one end or by bubbling a silane based surface adsorbent having a reactive silane group at one end by using a dehydrated and inert gas such as argon or nitrogen as a carrier gas, which is to be exposed to the surface of the chemically adsorbed film to chemically react with the silanol groups to form siloxane bonds. It is effective to use water vapor or hydrogen gas and oxygen gas with irradiating ultraviolet rays as active gas abovementioned. Examples 1 and 2 and Figures 1 to 4 are used to describe the invention. In the examples, % represents wt% except where specifically noted. This invention will be explained more concretely by using a capacitor as a typical example. Example 1 A polypropylene film having a thickness of 4 µm was washed and was put in a vacuum vessel. A vacuum pressure of 0.133mPa (10 -6 Torr) was applied. Then an aluminum electrode was formed, having a thickness of about 100 nm, by vacuum sublimation deposition as a substrate 21. Then a surface of the substrate 21 was treated to form a hydroxyl group (-OH) as hydrophilic group. More concretely, a hydroxyl group was formed on the surface of the aluminum substrate 21 by introducing a small amount of a hydrogen gas and oxygen gas as a reactive gas on the surface of the substrate 21 and irradiating using ultraviolet rays from a mercury lamp. A steam gas can be used as the reactive gas. The supply of reactive gas was stopped and a vacuum of 0.133mPa (10 -6 Torr) was applied. Then chemical adsorption was carried out using CF 3 (CF 2 ) 7 (CH 2 ) 2 SiCl 3 as the silane based surface adsorbent having a straight carbon chain. Since the chlorosilane based surface adsorbent is liquid at room temperature, it is preferable to introduce the chlorosilane based surface adsorbent in a vacuum vessel by heating or by bubbling the chlorosilane based adsorbent with an inert gas such as dehydrated and dry argon or nitrogen as a carrier gas to carry to the surface of the substrate by fine supply pipe. A dehydrochlorination reaction was brought about between hydroxyl groups (-OH) on the surface of the substrate and the chlorine atom of the silyl group (SiCl) of the chlorosilane based surface adsorbent to form a bond as represented by formula 1 on the whole surface of the substrate. It requires about ten to thirty minutes for adsorbing. Then the supply of adsorbent was stopped to evacuate again to separate and remove unreacted molecules of the chemical adsorbent which was adsorbed physically on the surface of substrate 21. During the step of separating and removing unreacted molecules of chemical adsorbent abovementioned, heating the substrate 21 at about 120°C, which does not decompose the chemically adsorbed monomolecular film, is very effective to promote separating and removing unreacted molecules of chemical adsorbent and saves treating time. Then, steam was supplied to the surface of the substrate 21 to react with unreacted chlorosilyl groups (-SiCl) to form silanol groups (-SiOH). Moisture from the air can be used instead of steam or a lot of steam can be supplied positively. Pure water can be used. The reaction of hydrolysis is shown in formula 2. A monomolecular film 22 can be formed by forming a siloxane bond by drying and dehydrating as shown in formula 3. One layer of a monomolecular film 22 containing fluorine can be formed on an aluminum substrate 21 as shown in Figure 1. The thickness of the chemically adsorbed film 22 was 1.5 nm judging from the molecular structure. The monomolecular film 22 was firmly and chemically bonded to the substrate and did not separate at all. Further, the aluminum deposition film formed on the substrate 21 was not damaged at all. A capacitor was formed on the monomolecular film 22 by depositing 10 nm of an aluminum film by vacuum evaporation deposition as the opposite electrode and the electric property of the capacitor was measured. According to the result, the capacitor has a lower leak current and higher electric insulation property compared to that which was made of the monomolecular film formed by the liquid phase. The obtained capacitor had a satisfactory result, and the characteristic variation which was made by a moving ion did not occur. Example 2 A polished glass as a substrate 31 which was washed and put in a vacuum vessel to reach to a vacuum of 0.133mPa (10 -6 Torr) and an aluminum electrode of about 100 nm in thickness was formed by vacuum deposition. Then the surface of the substrate was treated to form a hydroxyl group as hydrophilic group on the surface. More concretely, a hydroxyl group 32 was formed on the surface of the aluminum substrate 31 by spraying oxygen gas and hydrogen gas as the reactive gas little by little to the surface of the substrate 31 and irradiating with ultraviolet rays with a mercury lamp and then evacuating the vacuum vessel. A steam gas can be used as the reactive gas. The supplying of reactive gas was stopped to evacuate to a vacuum of 0.133mPa (10 -6 Torr). Then SiCl 4 containing a trichlorosilyl group as a material having a plurality of chlorosilyl groups (-SiCl n X 3-n group where n represents 1, 2, 3, X represents a functional group) was put in the vacuum vessel by bubbling an inert gas such as dehydrated and dried argon or nitrogen as a carrier gas in the SiCl 4 , and the obtained gas was carried out by a thin pipe to the surface of the substrate for about ten minutes to carry out the adsorbing reaction. A chlorosilyl system monomolecular film of a material containing a trichlorosilyl group 34 was formed by a dehydrochlorination reaction between a hydroxyl group 32 having a hydrophilic property formed on the surface of the substrate 31 as shown in Figure 2 and the chlorine atom of the trichlorosilyl group. By using SiCl 4 as a material containing a plurality of chlorosilyl groups, a dehydrochlorination reaction was brought about on the surface of the substrate 31 which has a few hydrophilic OH groups 32 for fixing molecules on the surface of the substrate via -SiO- bonds as shown in formula 4 and 5. Where, in general, unreacted SiCl 4 is physically adsorbed to a chlorosilyl monomolecular film. Then evacuation is carried again to separate and remove the unreacted SiCl 4 abovementioned. A silanol group was formed by reacting the unreacted chlorosilyl group of the chemically adsorbed chlorosilyl monomolecular film with steam, which was introduced to the surface of the substrate, or by reacting with hydrogen gas and oxygen gas, which were introduced to the surface of the substrate and irradiating with ultraviolet rays. Then a siloxane monomolecular layer film 35 can be formed on the surface of the substrate (formula 6 to 7) as shown in Figure 3. The obtained monomolecular film 35 was perfectly bonded to the surface of the substrate 31 via covalent bonds and did not separate at all. The obtained siloxane monomolecular film 35 had numerous -Si-OH bonds on the surface. About three times the number of hydroxyl groups were generated on the surface of the film compared to the initial number of hydroxyl groups. Chemical adsorption was carried out by using a chlorosilane based surface adsorbent having a straight carbon chain such as CF 3 (CF 2 ) 7 (CH 2 ) 2 SiCl 3 . Bubbling was carried out by passing an inert gas such as dehydrated and dried argon or nitrogen as a carrier gas through the chlorosilane based surface adsorbent in a vacuum vessel. The obtained gas was brought to the surface of the substrate by a fine pipe, on which surface the fluorocarbon system monomolecular film 36 was chemically adsorbed for ten to thirty minutes. The bond represented by formula 8 was formed on the surface of the siloxane monomolecular film 35a on the whole surface of the substrate , to form a chemically adsorbed monomolecular film 36 containing fluorine and having a thickness of about 2.0 nm, which was chemically bonded to a lower layer of the siloxane monomolecular film 35a as shown in Figure 4. The obtained monomolecular film was not separated by a peel-off test. By carrying out the process as in example 1, an opposite electrode was used to form a capacitor. The characteristics of the capacitor were evaluated and almost the same characteristics of example 1 or more excellent characteristic were obtained. According to the obtained results, the density of the chemically adsorbed monomolecular film was high. In example 1, a one layer of monomolecular film was formed. In example 2, a laminated layer of a silane based surface adsorbent containing fluorine on one layer of a siloxane monomolecular film was shown. However, the effect of the chemically adsorbed monomolecular film was not changed by laminating several layers of the chemically adsorbed monomolecular film. According to the invention, a monomolecular film having a desirable uniform thickness can be obtained by selectively chosing the length of the chain portion of the adsorbed monomolecular film or by laminating the monomolecular film, and that is a very excellent utility. In the example abovementioned, CF 3 (CF 2 ) 7 (CH 2 )SiCl 3 was used as the chlorosilane based surface adsorbent containing fluorine. Further, the hardness of the monomolecular film can be improved by adding or incorporating a vinylene group (-CH=CH-) or an ethynylene group as a carbon-carbon triple bond to the R portion of the chlorosilane based surface adsorbent, represented by CF 3 -(CF 2 ) n -(R) m -SiX p Cl 3-p (wherein n represents 0 or an integer, R represents an alkylene group, a vinylene group, an ethynylene group or a substituted group containing a silicon atom or an oxygen atom, m represents 0 or 1, X represents H, an alkyl group, an alkoxy group, an alkyl substituted group containing fluorine or an alkoxy substituted group containing fluorine, and p represents 0, 1, 2 or 3), to cross-link by irradiating with an electron beam of 5 mega rad (Mrad) after the monomolecular film is formed. Trichlorosilane based surface adsorbents such as CF 3 CH 2 O(CH 2 ) 15 SiCl 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , F(CF 2 ) 4 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 9 SiCl 3 , CF 3 COO(CH 2 ) 15 SiCl 3 , CF 3 (CF 2 ) 5 (CH 2 ) 2 SiCl 3 and chlorosilane based surface adsorbents such as CF 3 CH 2 O(CH 2 ) 15 Si(CH 3 ) 2 Cl, CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 Si(CH 3 ) 2 Cl, CF 3 CH 2 O(CH 2 ) 15 Si(CH 3 )Cl 2 , CF 3 COO(CH 2 ) 15 Si(CH 3 ) 2 Cl can be used as a fluorocarbon based surface adsorbent. By using alkoxysilane based surface adsorbents such as CF 3 (CF 2 ) 7 (CH 2 ) 2 Si(OCH 3 ) 3 , CF 3 CH 2 O(CH 2 ) 15 Si(OCH 3 ) 3 , the similar effect was obtained by heating the surface adsorbent solution. A chemically adsorbed monomolecular film can be obtained in a gas phase atmosphere by using chlorosilane based adsorbents such as CH 3 (CH 2 ) 9 SiCl 3 , CH 3 (CH 2 ) 15 SiCl 3 , CH 3 CH 2 O(CH 2 ) 15 SiCl 3 , CH 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 . According to the embodiments of forming a monomolecular film as in example 1, and example 2, a chemically adsorbed film will have little of contamination since the chemical adsorption is carried out in a gas phase atmosphere. Thus, the obtained monomolecular film is suitable for use which requires surface control such as in an electronic device. Further, in layering other kinds of thin films, since the chemical adsorption is carried out in a gas phase atmosphere, it is possible to form a thin film successively in the same vessel and the number of man-days and the amount of costs are effectively decreased. The method of forming a monomolecular film abovementioned has an excellent practical value for making a tunnel device or a capacitor which requires a film having a uniform thickness. According to the method for forming a monomolecular laminated film, a chlorine atom is reacted with a hydroxyl group using a molecule containing a straight carbon chain having a highly reactive chlorosilyl group. Thus, a more dense chemically adsorbed monomolecular film can be formed than by forming a single layer of the monomolecular layer film. As has been shown, the invention is greatly beneficial to industry.

Claims: A method of forming a chemically adsorbed monomolecular film in a gas phase on a surface of a substrate containing active hydrogen groups, said method comprising the steps of: placing a substrate in a vacuum vessel at decreased pressure or filled with dry atmosphere and contacting a chlorosilane based surface adsorbent having a reactive chlorosilyl group at one end or an alkoxysilane based surface adsorbent having a reactive alkoxysilyl group at one end in a gas phase with said surface of said substrate and initiating a condensation reaction in a gas phase atmosphere, removing unreacted chlorosilane or alkoxysilane based surface adsorbent from the vacuum vessel by evacuation, and contacting the surface of the substrate with water or water vapor. The method of claim 1, wherein the chlorosilane based surface adsorbent is represented by CH 3 -(R) m -SiCl n X 3-n or CF 3 -(CF 2 ) p -(R) m -SiCl n X 3-n , where p represents 0 or an integer, m represents 0 or 1, R represents a hydrocarbon group containing a methylene group, vinylene group, ethynylene group, a silicon group or an oxygen group, X represents hydrogen, a lower alkyl group or lower alkoxy group, and n represents an integer from 1 to 3. The method of claim 2, wherein the chlorosilane based surface adsorbent is selected from CH 3 (CH 2 ) 9 SiCl 3 , CH 3 (CH 2 ) 15 SiCl 3 , CH 3 CH 2 O(CH 2 ) 15 SiCl 3 , CH 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , CF 3 CH 2 O(CH 2 ) 15 SiCl 3 , CF 3 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 , F(CF 2 ) 4 (CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 9 SiCl 3 , CF 3 COO(CH 2 ) 15 SiCl 3 , CF 3 (CF 2 ) 5 (CH 2 ) 2 SiCl 3 . The method of claim 1, wherein the substrate is selected from the group consisting of metal, ceramics, glass, plastic, a semiconductor, an inorganic shaped solid and an organic shaped solid. The method of claim 4, wherein the substrate surface is plastic which has been made hydrophilic by treating with a plasma containing oxygen or in a corona atmosphere. The method of claim 1, wherein the surface of the substrate is contacted with an alkoxysilane based surface adsorbent which is heated to at least 50°C to initiate the condensation reaction. The method of claim 1, wherein the chlorosilane based surface adsorbent is a silane compound having chlorine atoms. The method of claim 7, wherein the silane compound having chlorine atoms is selected from SiCl 4 , SiHCl 3 , SiH 2 Cl 2 or Cl-(SiCl 2 O) n -SiCl 3 wherein n represents an integer. The method of claim 1, wherein the gas phase of the surface adsorbent is produced by heating the chlorosilane or alkoxysilane based surface adsorbent or bubbling the chlorosilane or alkoxysilane based surface adsorbent or the adsorbent solution containing a chlorosilane or alkoxysilane based surface adsorbent by using a dry inert gas as a carrier. The method of claim 1, wherein the vacuum vessel is at a decreased pressure lower than 1.33 mPa (10 -5 Torr).

Inventors: HIGASHINO HIDETAKA, MINO NORIHISA, OGAWA KAZUFUMI, SOGA MAMORU, HIGASHINO, HIDETAKA, MINO, NORIHISA, OGAWA, KAZUFUMI, SOGA, MAMORU
Applicants: MATSUSHITA ELECTRIC IND CO LTD, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Application year: 1992
Main classification: B05D1
IPC codes: C09D4, B05D7, B05D1, B05D3