An apparatus for inspecting a semiconductor device

Abstract: An inspecting apparatus is provided by which a cross section of a semiconductor device to be inspected can be easily obtained. The inspection apparatus includes a first microscope (110) for specifying a portion where the inspection of a cross section is to be effected, a rotary grinder (140) for grinding the portion specified by the first microscope (110), a second microscope (120) for monitoring the portion ground by the rotary grinder (140), and a stage (130) for fixing the semiconductor device movable relative to the first and second microscopes (110 and 120) and the rotary grinder (140).

Description: BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device inspecting apparatus for inspecting a cross section of a semiconductor device. Description of the Background Art In the following description, "semiconductor device" refers to a wafer before dicing on which a plurality of chip patterns are formed, or to a chip after dicing. An inspection checking a cross section of a semiconductor device is effected for confirming whether or not the process steps for manufacturing the semiconductor device is proper, or to analyze the cause of malfunction of a semiconductor device. A sample for such inspection is prepared by cleavage or grinding. In the former method, a portion corresponding to a cross section to be checked is scratched by means of a diamond pen or the like, and the semiconductor device is cleaved from the crack. In the latter method, a semiconductor device 200 is depressed to a rotary grinding plate by using a jig 310 for grinding, as shown in Figure 4, and the cross section to be inspected is exposed. However, the above mentioned two methods of preparing samples have the following problems. In the former method, it is very difficult to obtain accurately the cross section to be inspected. The accuracy in scratching by a diamond pen is in the order of millimeter, while the accuracy in the order of submicron is required in recent semiconductor devices formed with high density. Further, as the patterns of semiconductor devices are, in most cases, aligned linearly, the number of patterns appearing at the cross section should be as large as possible. However, it is very difficult to obtain a linear cross section by cleavage. In the latter method, it is necessary to interrupt grinding to carry out microscopic monitoring so as to determine whether or not the cross section to be inspected is obtained. Since grinding with floating abrasive grains is carried out at the final stage for finishing, the abrasive grains may enter or scrape interconnections and the like appearing on the cross section of the semiconductor device, making it difficult to obtain a fine cross section. Although it is possible to obtain a linear cross section by this method, it is difficult to align the direction of grinding with the cross section to be inspected. In addition, in both methods, aluminum used as interconnections or bonding wires in the semiconductor device extends and adheres on the cross section during cleavage or grinding, and thus it is difficult to obtain an accurate cross section. In addition, both methods require much skill, and an ordinary operator cannot do the task well. SUMMARY OF THE INVENTION It would thus be desirable to provide an apparatus for inspecting a semiconductor device by which a linear cross section to be inspected can be easily obtained. It would further be desirable to provide an apparatus for inspecting a semiconductor device by which an operator of ordinary skill can easily obtain a cross section to be inspected. There is thus provided an apparatus for inspecting a semi-conductor device, comprising: a table; a first microscope provided on said table for specifying a portion of the semi-conductor device including a cross section to be inspected; a rotary grinder provided on said table for grinding or cutting said specified portion to expose said cross section to be inspected, a mark in the field of view of said first microscope being aligned with a grinding plane of said rotary grinder; a second microscope for observing said exposed cross section; a stage movable relative to said first microscope and said rotary grinder and relative to said second microscope, and including a fixing portion for fixing said semi-conductor device to said stage; first moving means for moving said table relative to said stage; and second moving means for moving said stage relative to first and second microscopes and said rotary grinder parallel to said grinding plane. By the present invention, the cross section to be inspected of the semiconductor device can be easily and linearly obtained by any person. In addition, the cross section of the semiconductor device can be inspected immediately. In addition, since the portion to be inspected of the semiconductor device is ground by means of a rotary grinder, that is, without using floating abrasive grains, a fine cross section to be inspected can be obtained. The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of an apparatus for inspecting a semiconductor device in accordance with one embodiment of the present invention. Fig. 2 is an illustration of a field of view of the first microscope. Fig. 3 is an illustration showing a field of view of the first microscope during grinding. Fig. 4 shows a conventional method of grinding a semiconductor device. DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to Figs. 1 to 3. In the following description, the X direction, Y direction and Z direction are as shown by the arrows in Fig. 1. An apparatus 100 for inspecting a semiconductor device in accordance with the present invention includes a first microscope 110 for specifying a portion of a semiconductor device 200 at which cross section is to be inspected, a rotary grinder 140 for grinding the portion specified by the first microscope 110, a second microscope 120 for inspecting the portion ground by the rotary grinder 140, and a stage 130 for fixing the semiconductor device movable relative to the first and second microscopes 110 and 120 and the rotary grinder 140. The stage 130 for fixing the semiconductor device includes a fixing portion 131 for fixing semiconductor device 200, a base plate 132 through which a screw 134 passes through, and a rotary table 133 provided on the base plate 132 for rotating, in  direction, the fixing portion 131. The screw 134 is rotated by a pulse motor 135 and moves the stage 130 for fixing the semiconductor device in the direction of the X axis. In the figure, the reference numeral 136 denotes a clip for fixing the semiconductor device 200 with respect to the fixing portion 131. The reference numeral 137 denotes a screw for fine adjustment of the rotary table 133. The first microscope 110 is to monitor the surface of the semiconductor device 200 fixed on the stage 130 for fixing the semiconductor device, and is attached at an end portion of an arm 151 provided on stage 150. The first microscope 110 includes an objective lens 111 of 100 magnifications, and an ocular of 10 to 20 magnifications. The enlarged image can be monitored by a display, not shown, through a video camera 113. A unit for slight movement 152 for slightly moving the first microscope 110 in the directions of X and Y axis are provided between the arm 151 and first microscope 110. A hair line HL is provided as shown in Fig. 2 in the first microscope 110. A portion of the hair line HL indicating the center of the field of view, that is, the central hair line HLC made longer than others. The center HLC of the hair line HL is set to be aligned with the portion to be ground by the rotary grinder 140. Therefore, if the stage 130 fixing the semiconductor device is moved to the side of the rotary grinder 140 with the expected cross section A (shown by the dotted line in Fig. 3), that is, the cross section to be inspected of the semiconductor device 200 aligned with the center HLC the expected cross section A is ground, and the cross section to be inspected is exposed. The rotary grinder 140 is for grinding the semiconductor device 200, and detachably attached at a flange portion 143 and an end of a driving axis 142 of a motor 141 provided on the stage 150. A screw 147 is provided at a casing of the motor 141, which is movable up and down, that is, movable in the Z direction by means of a pulse motor 144. A pair of guide arms 145 is provided at the casing, ensuring the upward and downward movement. The grain size of the abrasive grains of the rotary grinder 140 depends on the semiconductor device 200 to be ground, and generally, #8000 or #10000 is used. The stage 150 provided with the first microscope 110 and the rotary grinder 140 is movable in the Y direction by a screw 154 and a pulse motor 153. The second microscope 120 is provided at a position where the objective lens 122 is aligned with the cross section of the semiconductor device 200 so that the semiconductor device 200 can be monitored in the direction of the Y axis, that is, the direction orthogonally crossing the first microscope 110, so as to monitor the cross section of the semiconductor device 200. The second microscope 120 is attached on the unit for slight movement 121 which can slightly move the second microscope 120 in the X, Y and Z directions. The objective lens 122 is adapted to have 100 magnifications, and the ocular 123 has 10 to 20 magnifications, and the field of view can be seen on a display, not shown, through a TV camera 124. The inspection of the semiconductor device 200 by the apparatus for inspecting the semiconductor device having the above structure will be described. In order to reduce the amount of grinding as much as possible, the semiconductor device 200 is cleaved at a portion as near as possible to the cross section to be inspected, that is, the expected cross section A. A semiconductor device 200 to be inspected is fixed on a fixing portion 131 of the stage 130 for fixing the semiconductor device. At this time, the semiconductor device 200 is fixed such that the expected cross section A is within at least the field of view of the first microscope 110. The fixed semiconductor device 200 is monitored by the first microscope 110, and the rotary table 133 and the pulse motor 153 are adjusted so that the expected cross section A is aligned with the center HLC of the hair line HL. When the expected cross section A is aligned with the center of the hair line HLC, the stage 130 for fixing the semiconductor device is moved in the X direction so that the semiconductor device 200 is ground by the rotary grinder 140. The speed of feeding of the stage 130 during grinding is preferably set at about 0.2mm/sec., and the speed of rotation of the rotary grinder 140 is preferably set to 10000rpm to 30000rpm. The grinding is effected with a cooled water for washing injected from an injection nozzle 146 provided near the rotary grinder 140. When a cross section to be inspected is obtained by grinding, the stage 130 fixing the semiconductor device is moved in the direction of the second microscope 120. Since the objective lens 122 of the second microscope 120 is provided to be aligned with the cross section of the semiconductor device 200, the cross section of the semiconductor device 200 can be inspected only by moving the stage 130 fixing the semiconductor device to a prescribed position. The cross section is displayed on a display, not shown, through a TV camera 124. The semiconductor device 200 may be taken out from the stage 130 fixing the semiconductor device, and it may be inspected by other inspection equipment such as an electron microscope, if necessary. Although the expected cross section A is obtained by only one step of grinding in the above described embodiment, a plurality of steps of grinding may be necessary, as the amount of grinding at one time is set to be several microns or less. In such a case, table 150 is moved in the Y direction by means of the pulse motor 153 at the end of every grinding, and grinding is repeated for a plurality of times until the expected cross section is obtained. Although the semiconductor device 200 was subjected to cleavage in advance so as to reduce the amount of grinding, a rotary grinder 140 for cutting and not for grinding may be provided on the apparatus 100 for inspecting the semiconductor device, so as to cut the device in the similar manner as grinding by the rotary grinder 140, and then grinding may be done with the rotary grinder 140 exchanged. Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the scope of the present invention being limited only by the terms of the appended claims.

Claims: An apparatus for inspecting a semi-conductor device (200), comprising: a table (150); a first microscope (110) provided on said table (150) for specifying a portion of the semi-conductor device (200) including a cross section to be inspected; a rotary grinder (140) provided on said table (150) for grinding or cutting said specified portion to expose said cross section to be inspected, a mark (HLC;HL) in the field of view of said first microscope (110) being aligned with a grinding plane of said rotary grinder (140); a second microscope (120) for observing said exposed cross section; a stage (130) movable relative to said first microscope (110) and said rotary grinder (140) and relative to said second microscope (120), and including a fixing portion (131) for fixing said semi-conductor device (200) to said stage (130); first moving means (153,154) for moving said table (150) relative to said stage (130); and second moving means (134,135) for moving said stage (130) relative to said first and second microscopes (110,120) and said rotary grinder (140) parallel to said grinding plane. An apparatus as claimed in claim 1 wherein said fixing portion (131) is connected via a rotary table (133) to a base portion (132) of said stage (130). An apparatus as claimed in claim 1 or claim 2 further comprising an injection nozzle (146) located near the rotary grinder (140) for injecting cooled water onto the rotary grinder (140). An apparatus as claimed in any one of the preceding claims wherein a centre line (HLC) of the field of view of said first microscope (110) is aligned with the grinding plane of said rotary grinder (140). An apparatus as claimed in claim 4 including means (152) for moving said first microscope (110) in mutually orthogonal directions (X,Y) respectively parallel to and perpendicular to said grinding plane relative to said table (150) to align said centre line (HLC) with said grinding plane. An apparatus as claimed in any one of the preceding claims including means (144,145,147) for raising and lowering said rotary grinder (140) with respect to said table (150), said raising and lowering means (144,145,147) including a screw and pulse motor assembly (144,147) and a pair of guide arms (145) between a motor (141) coupled to drive said rotary grinder (140) and said table (150) for ensuring the upward and downward movement of said rotary grinder (140) with respect to said table (150). An apparatus as claimed in any one of the preceding claims wherein said second microscope (120) includes a TV camera (124) enabling remote viewing of said exposed cross section. An apparatus as claimed in any one of the preceding claims wherein said first moving means (153,154) and said second moving means (134,135) each include a screw (154,134) rotated by a pulse motor (153,135).

Inventors: NAKANO AKIHIKO, NAKANO, AKIHIKO
Applicants: SHARP KK, SHARP KABUSHIKI KAISHA
Application year: 1992
Main classification: H01L21
IPC codes: G01N1, H01L21, G01N21, B24B37, G01R31