Novel fluorosilicone hydrides

Abstract: Novel fluorosilicone hydrides are provided which are useful as intermediates in the preparation of epoxy-functional fluorosilicones having improved cure efficiency at low temperatures and improved resistance to solvents and fuels than analogous non-fluoro-functional epoxy-functional silicones prepared from non-fluoro-functional silicone hydrides.

Description: Background of the Invention The present invention relates to fluorosilicone hydrides. More particularly, the present invention relates to linear and branched fluorosilicone hydrides useful in the formation of epoxy-functional fluorosilicones which are combinable with onium salt photoinitiators to form improved UV-curable epoxy-functional silicone compositions. Fluorosilicone hydrides are known in the art. Reference is made, for example, to U.S. Patent Nos. 4,719,275 (Benditt et al.); 4,898,903 (Rasch et al.); 4,585,848 (Evans et al.); and 4,599,374 (Bluestein). The preparation of epoxy-functional silicones from silicone hydrides is also known in the art. Reference is made, for example, to U.S. Patent Nos. 4,279,717 (Eckberg et al.); 4,576,999 (Eckberg); and 4,640,967 (Eckberg). Hydrogensiloxanes represented by formula RMe 3-m Si - (OSiMe 2 H) m wherein m is 1 or 2 and R is a fluoroalkyl group are disclosed in EP-A-0435654 which forms part of the state of the art under Article 54(3). EP-A-0279706 discloses organopolysiloxanes of the formula H(CH 3 ) 2 SiO(R 4 2 SiO) e [(CH 3 )(CH 2 CH 2 R 5 SiO] f Si(CH 3 ) 2 H wherein R 4 is a C 1-8 hydrocarbon group, R 5 is a perfluoro alkyl group and e and f are from 0 to 100. US-A-4987203 discloses a polyorganosiloxane compound containing a fluorine containing substituent at its α-, α'- or α"- position and an epoxy linkage at its ω-position. Ultraviolet radiation-curable compositions containing epoxy-functional silicones and onium salt photoinitiators are also known in the art. Reference is again made to U.S. Patent Nos. 4,279,717 (Eckberg et al.); 4,576,999 (Eckberg); and 4,640,967 (Eckberg). The present invention is based on the discovery that the fluorosilicone hydrides of the present invention will form epoxy-functional fluorosilicones having improved cure efficiency at low temperatures and improved resistance to solvents and fuels than analogous non-fluoro-functional epoxy-functional silicones prepared from non-fluoro-functional silicone hydrides. Summary of the Invention The present invention provides hydride-functional fluorosilicones selected from the group consisting of: (A) linear hydride-functional fluorosilicones having the general formula (B) resinous hydride-functional fluorosilicones having the general formula and (c) resinous hydride-functional fluorosilicones having the general formula wherein R represents an alkyl radical having from 1 to 10 carbon atoms or a phenyl radical, R 1 represents a perfluoroalkyl radical having from 1 to 8 carbon atoms, R 2 represents an alkyl radical having from 1 to 10 carbon atoms or a phenyl radical, "a" represents a number from 1 to 100, "b" represents a number from 1 to 100, "c" represents a number from 1 to 100, and "d" represents a number from 1 to 100. Epoxy-functional fluorosilicones prepared from the fluorosilicone hydride intermediates above will have improved solvent and fuel resistance and faster cure at lower UV radiation levels. Background of the Invention In the fluorosilicone hydrides of formulas (I)-(III) above, R represents an alkyl radical having from 1 to 10 carbon atoms or a phenyl radical, R 1 represents a perfluoroalkyl radical having from 1 to 8 carbon atoms, R 2 represents an alkyl radical having from 1 to 10 carbon atoms or a phenyl radical, "a" represents a number from 1 to 100, "b" represents a number from 1 to 100, "c" represents a number from 1 to 100, and "d" represents a number from 1 to 100. Preferably, R and R 2 each represent an alkyl radical having from 1 to 4 carbon atoms. Examples of alkyl radicals represented by R and R 2 include methyl, ethyl and propyl. Most preferably, R and R 2 are each methyl. R 1 is preferably a perfluoroalkyl radical of from 1 to 4 carbon atoms, and most preferably a trifluoropropyl radical, i.e., a -CH 2 CH 2 CF 3 radical. In formulas, "a" is preferably a number ranging from 3 to 30 and most preferably from 10 to 20. Likewise, "b" is also preferably a number ranging from 3 to 30 and most preferably from 10 to 20. The letter "c" is preferably a number ranging from 1 to 20 and most preferably from 1 to 10. The letter "d" is preferably a number ranging from 1 to 20 and most preferably from 1 to 10. The fluorosilicone hydride of the formula can be prepared by blending an organic solvent solution of a fluorosilicone disiloxanol telomeric fluid of the general formula HO[(R 1 CH 2 CH 2 )(R)SiO]H, wherein R and R 1 are as previously defined herein, with increment amounts of a dialkylchlorosilane and an alkyldichlorosilane, the temperature of the reaction mixture being kept under 30°C. After addition of the dialkylchlorosilane and alkyldichlorosilane is complete, the mixture is heated to a temperature of 80 to 90°C for about 2 hours. The reaction mixture is then washed with water to reduce the acidity of the mixture. The resulting mixture is dried, filtered, and vacuum stripped to remove solvent and water. The fluorosilicone hydride of the formula can be prepared by blending an organic solvent solution of dichlorosilane and a dialkylchlorosilane with tetraalkylorthosilicate. The mixture is then added to water with the temperature kept below 50°C. The mixture separates into two phases- an organic phase and an aqueous phase. The organic phase is washed with water so as to neutralize its acid content. Water and toluene are removed by vacuum stripping and sparging with nitrogen while being heated to a temperature of 115 to 150°C. The mixture is then refluxed and the temperature is allowed to reach a temperature of 175 to 180°C, resulting in the removal of additional solvent and alcohol. The acid level of the resulting mixture is reduced by treatment of the mixture with Fuller's earth. The fluorosilicone hydride of the formula can be prepared by blending an organic solvent solution of an alkylhydrogendichlorosilane and perfluoroalkylalkyldichlorosilane with increments of a trialkoxyalkylsilane. After addition of the trialkoxyalkylsilane is complete, the mixture is stirred for 15 to 30 minutes and then added to distilled water. The temperature of the mixture is kept at a temperature of 80 to 90°C. The mixture is allowed to separate into an organic phase and an aqueous phase at a temperature of 25 to 30°C. The organic phase is washed with water until the pH of the mixture is about 6. The material is then heated to a temperature of 115 to 150°C so as to remove water, solvent, and alcohol. The temperature of the mixture is then increased to 150 to 180°C for about 1 to 3 hours and additional distillate is recovered. The mixture is treated with Celite 545 and then with Fuller's earth so as to reduce the acidity to less than 5 ppm. The linear and branched fluorosilicone hydrides of the present invention are useful as intermediates in the formation of epoxy-functional fluorosilicones which are combinable with onium salt photoinitiators to form improved UV-curable epoxy-functional silicone compositions. The epoxy-functional fluorosilicones are prepared by reacting one of the fluorosilicone hydrides of the present invention with an organic compound containing both ethylenic unsaturation and epoxide functionality in the presence of an effective amount of a precious metal catalyst for facilitating an addition cure hydrosilation reaction. Organic compounds containing both ethylenic unsaturation and epoxide functionality suitable for preparing the epoxy-functional fluorosilicones are any of a number of aliphatic or cycloaliphatic epoxy compounds having olefinic moieties which will readily undergo addition reaction to SiH functional groups. Commercially obtainable examples of such compounds include 1-methyl-4-isopropenyl cyclohexeneoxide (limoneneoxide; SCM Corp.); 2,6-dimethyl-2,3-epoxy-7-octene (SCM Corp.); and 1,4-dimethyl-4-vinylcyclohexeneoxide (Viking Chemical Co.), and 4-vinylcyclohexeneoxide. 4-Vinylcyclohexeneoxide is preferred. The precious metal catalyst for the hydrosilation reactions involved in the preparation of the epoxy-functional fluorosilicones may be selected from the group of platinum-metal complexes which includes complexes of ruthenium, rhodium, palladium, osmium, iridium, and platinum. A fluorosilicone hydride of formula (I ) above will form an epoxy-functional fluorosilicone of the formula A fluorosilicone hydride of formula (II) above will form an epoxy-functional fluorosilicone of the formula A fluorosilicone hydride of formula (III) above will form an epoxy-functional fluorosilicone of the formula In the epoxy-functional fluorosilicones of formulas (VI)-(VIII) above, R, R 1 , R 2 , "a", "b", "c" and "d" are as previously defined herein. E represents an epoxy-functional organic group of from 2 to 20 carbon atoms. UV-curable epoxy-functional fluorosilicone compositions are formed by mixing the epoxy-functional fluorosilicones described above with an onium salt photoinitator or combination of onium salt photoinitators. The preferred onium salts for preparing the UV-curable epoxy-functional fluorosilicone compositions are the diaryliodonium salts such as those disclosed in U.S. Patent No. 4,882,201, which is incorporated herein by reference. Specific examples of other suitable diaryl iodonium salts include 4-octyloxyphenylphenyl-iodoniumhexafluoroantimonate, bis(dodecyl phenyl)iodonium hexafluoroarsenate and bis(dodecyl phenyl)iodonium hexafluoroantimonate. The most preferred of these iodonium salts is 4-octyloxyphenylphenyl-iodoniumhexafluoroantimonate. The amount of onium salt catalyst used in the preparation of the UV-curable epoxy-functional fluorosilicone compositions is not critical, so long as proper polymerization is effected. As with any catalyst, it is preferable to use the smallest effective amount possible. Catalyst levels of from 0.5%-5.0% by weight have been found suitable. The UV-curable compositions of this invention are cured by exposing the mixture containing the epoxy-functional fluorosilicone and the onium salt photoinitiator or combination of onium salt photoinitiators to an amount of ultraviolet radiation sufficient to cure the composition. A key advantage of the UV-curable epoxy-functional silicone compositions formed from the fluorosilicone hydrides of this invention is their cure efficiency. These UV-curable epoxy-functional fluorosilicone compositions will cure on exposure to a UV radiation flux of from 10 to 200 millijoules/cm 2 for a cure time of from 0.005 to 0.1 seconds when two focused 300 watt/2.54cm (inch) medium pressure mercury vapor UV lamps are used for curing. In order that those skilled in the art might be better able to practice the present invention, the following examples are given by way of illustration and not by way of limitation. Experimental Example 1 (Comparative) A fluorosilicone disiloxanol telomeric fluid of the formula HO[(CF 3 CH 2 CH 2 )(CH 3 )SiO]H with a hydroxy content of 6.2% (447.0 grams) was mixed with 500.0 grams (625 mls) of reagent grade toluene. The mixture was stirred and maintained under a blanket of nitrogen while adding 275 milligrams (239 grams) of dimethylchlorosilane which was 88.7% reactive as determined by gas chromatography. The reaction had to be cooled periodically with an ice-acetone bath to keep the temperature below 30°C. Each addition of the chlorosilane caused the mixture to initially become very hazy but subsequently it became clear within a short period of time. The addition was completed within 30 minutes then the contents of the vessel were heated at 80°C for 2 hours. The reaction mixture was washed seven times with 500 milliliter portions of water to take the acidity level (HCI) down from 11,520 ppm to 8.6 ppm. The material was dried over silica gel then filtered through Diatomaceous Earth and vacuum stripped on rotary vacuum with water aspiration while heating to 65°C. A clear fluid (507.26 grams, 84% yield) was obtained with a hydrogen content of 0.15 % by weight and a very strong Si-H band in the infrared spectroscopy (IR) at 2130 cm -1 . The average degree of polymerization was 4.3. The product had the following formula: Example 2 (Comparative) 500.0 grams of a fluorosilicone disiloxanol telomeric fluid of the formula HO[(CF 3 CH 2 CH 2 )(CH 3 )SiO]H having a hydroxy content of 3.56% were mixed with 500 grams of toluene. In a manner similar to that followed in Example 1, 185 milliliters (161 grams) of dimethylchlorosilane was added to the resulting mixture. The temperature of the mixture was maintained below 30°C and the addition was complete in 3 hours and 15 minutes. The mixture was refluxed for 2 hours at 85-87°C. The reactive mixture was washed with water until free of acid and then dried over silica gel, filtered and vacuum stripped to provide 451.64 grams (77.5% yield) of a clear fluid having a viscosity of 144 mPa·s (centipoise) at 25°C and a refractive index of 1.3766 at 25°C. The IR indicates Si-H and the hydrogen content was found to be 0.068 weight % and the specific gravity was 1.25 g/cc. Gas chromatographic analysis indicates that seven components with the major peak corresponding to 58.8%. The average degree of polymerization was 18. The product had the following formula: Example 3 Fluorosilicone dichlorosilane (480 grams) was mixed with dimethylchlorosilane (376 grams) while in toluene (800 milliliters) under a blanket of nitrogen. With stirring, 222 grams of tetraethylorthosilicate were added to this mixture. With stirring, the reaction mixture was added to 500 millilters of water with the temperature being kept below 50°C with an ice-water bath. The layers were separated and the top layer saved. The top layer was washed with water until the acid content was neutral as determined by the litmus test. The water and toluene were removed by vacuum stripping and were sparged with nitrogen while being heated to 150°C. The mixture was refluxed during which the temperature was allowed to reach 178°C, resulting in the removal of an additional 80 milliliters of toluene and alcohol. The resulting material was treated with sufficient amount of Fuller's Earth to reduce the acid level to 10 ppm. 345 grams of fluid having a hydroxy content of 0.588% were recovered. FTIR indicated an Si-H bond at 2140 cm+/-1. The product had the following structure: Example 4 A resin containing a greater amount of fluorosilicone was prepared in a manner similar to the fluorosilicone prepared in Example 3 except that the amount of methyl-3,3,3-trifluoropropyl dichlorosilane was 844 grams. 828.96 grams of product were recovered and was treated several times with Fuller's Earth to reduce the HCI level from 394 ppm to 15 ppm. The specific gravity of this product was 1.1058 and the hydride content was 0.35%. 759.61 grams of the final product were recovered. The final product had the formula Example 5 Methylhydrogendichlorosilane (282.0 grams) and 633 grams of 3,3,3-trifluoropropylmethyldichlorosilane were dissolved in dry toluene (695 mls) while under a nitrogen blanket. To this mixture was added with agitation, 136.2 grams of trimethoxymethylsilane. After the addition was complete, the mixture was stirred for 30 minutes prior to adding it to 497 grams of distilled water. External cooling was applied with a wet-ice bath to keep the temperature at about 40°C. When the reaction temperature subsided to 28°C, the mixture was allowed to separate into phases. The organic phase was then washed with water until the pH was approximately 6. The material was then heated while agitating under a slight nitrogen purge to a temperature of about 148°C. Approximately 680 mls of solvent, water, and alcohol were removed. The vessel temperature was then increased to 180°C over a period of 4 hours with a Barrett moisture trap recovering an additional 20 ml of distillate. The material was then treated with Celite 545, followed by Fuller's earth to bring the acidity down to less than 5.0 ppm. A clear fluid (524 grams, 71.3% yield) was obtained which had an SiH absorbance in the FTIR at 2130 cm -1 , and the hydride content was found by gas evolution to be 0.36 weight %. The specific gravity at 25°C was 1.093 g/cc and the refractive index at 25°C was 1.3762. The Brookfield viscosity was found to be 28.8 mPa·s (centipoise) at 25°C. Example 6 Methyldichlorosilane (378 grams) and 3,3,3-trifluoropropylmethyldichlorosilane (1266 grams) were dissolved in 1200 mls of dry toluene while under a nitrogen blanket. Tetraethylorthosilicate (223 grams) was then added to the mixture with agitation. After 30 minutes, this mixture was added incrementally to 650 grams of water. The reaction vessel was cooled with an ice-water bath to keep the temperature of less than 40°C. When the addition was complete, the mixture was agitated until the temperature reached 28°C. The mixture was allowed to separate into phases and the organic layer washed with water until the pH was approximately 6. The mixture was then heated to 115°C while agitating under a slight purge of nitrogen to remove toluene, water, and alcohol. The temperature was then increased to 150°C and held there for 3 hours, recovering an additional 20 mls of distillate in the Barrett moisture trap. The temperature was then increased to 180°C with the recovery of 15 mls of distillate for a total recovery of 950 mls of solvent, water, alcohol, and other volatiles. The product was filtered through Celite 545 and then Fuller's earth. Treatment with Fuller's earth was repeated until the acidity was less than 5.0 ppm. A clear fluid (724 grams, 57% yield) was recovered which had a hydride content by gaseous evolution of 0.14 weight %. The FTIR showed SiH at 2130 cm -1 and the Brookfield viscosity was 64 mPa·s (centipoise) at 25°C. The specific gravity was 1.205 g/cc at 26°C and the RI at 24°C was 1.3763. The final product had the formula

Claims: A hydride-functional fluorosilicone selected from the group consisting of: (A) linear hydride-functional fluorosilicones having the general formula (B) resinous hydride-functional fluorosilicones having the general formula and (C) resinous hydride-functional fluorosilicones having the general formula wherein R represents an alkyl radical having from 1 to 10 carbon atoms or a phenyl radical, R 1 represents a perfluoroalkyl radical having from 1 to 8 carbon atoms, R 2 represents an alkyl radical having from 1 to 10 carbon atoms or a phenyl radical, "a" represents a number from 1 to 100, "b" represents a number from 1 to 100, "c" represents a number from 1 to 100, and "d" represents a number from 1 to 100. An hydride-functional fluorosilicone according to claim 1 wherein R 1 represents a perfluoroalkyl radical having from 1 to 4 carbon atoms. An hydride-functional fluorosilicone according to claim 2 wherein R 1 represents the radical -CF3. An hydride-functional fluorosilicone according to claim 1 wherein R and R 2 each represents an alkyl radical having from 1 to 4 carbon atoms. An hydride-functional fluorosilicone according to claim 4 wherein R and R 2 are each methyl radicals. An hydride-functional fluorosilicone according to claim 1 wherein "a" represents a number from 3 to 30. An hydride-functional fluorosilicone according to claim 6 wherein "a" represents a number from 10 to 20. An hydride-functional fluorosilicone according to claim 1 wherein "b" represents a number from 3 to 30. An hydride-functional fluorosilicone according to claim 8 wherein "b" represents a number from 10 to 20. An hydride-functional fluorosilicone according to claim 1 wherein "c" represents a number from about 1 to 20.

Inventors: EVANS EDWIN ROBERT, JERAM EDWARD MATTHEW, EVANS, EDWIN ROBERT, JERAM, EDWARD MATTHEW
Applicants: GEN ELECTRIC, GENERAL ELECTRIC COMPANY
Application year: 1992
Main classification: C08G77
IPC codes: C07F7, C08G77