Crosslinkable aqueous developable photoresist compositions

Abstract: High sensitivity, high contrast, heat-stable resist compositions for use in deep UV, i-line e-beam and x-ray lithography. These compositions comprise a film-forming polymer having aromatic rings activated for electrophilic substitution, an acid catalyzable crosslinking agent which forms a hydroxy-stabilized carbonium ion, and a photoacid generator. The compositions are aqueous base developable.

Description: The present invention relates to aqueous base developable photoresist compositions and processes forming lithographic patterns therewith. There has been a continuing desire in the electronics industry to obtain higher circuit density in microelectronic devices. To achieve the higher degree of integration necessary to meet the ground rules for such devices, the microelectronic industry has sought to develop improved lithographic tools and techniques which in turn have increased the demand for new photoresists which enhance the resolution of lithographic patterns in such photoresist films. Aqueous base developable photoresist compositions which crosslink through electrophilic aromatic substitution have been disclosed in Reck et al., SPIE Regional Technical Conference on Photopolymers , Ellenville, NY, 63 (1988). Such formulations are characterized by having 3 structural components which include (a) an aromatic moiety, such as poly(4-hydroxystyrene) or novolak, which is susceptible to electrophilic aromatic substitution (b) a stable substance which is capable upon reaction with acid, of generating an electrophile, viz ., a carbocationic species whose precursor is the acetate of an aryl methylol, and (c) a photoacid generator which is an onium salt such as triphenylsulfonium hexafluoroantimonate. Upon exposure latent images are formed due to the chemical changes caused by the photoacid generation which include acetate hydrolysis, benzylic carbonium ion formation, and partial crosslinking of the aromatic resin. When the film is baked briefly after exposure, the acid cleaves the acetate group of the latent electrophile to produce a benzylic carbocationic species which reacts immediately with the surrounding phenolic resin to form new carbon-carbon bonds. Such formation of new carbon-carbon bonds results in an increase in molecular weight of the resin or its crosslinking, thereby drastically altering its solubility properties. Subsequent development in dilute base affords a negative-tone image of the mask. (Systems which included novolak resins were said to exhibit an unacceptable high optical density in deep UV). US-A-No. 4 810 601 to Allen et al. is concerned with the formation of negative tone patterns by crosslinking an aromatic compound with a monomeric or polymeric source of polyfunctional carbonium ions. Diacetoxymethylbenzene and trisacetoxymesitylene were used with triphenylsulfonium hexafluoroantimonate to crosslink a poly(p-hydroxystyrene) matrix resin. The imaged resist was aqueous base developable. Poly(vinylbenzylacetate) was used as a polymeric polyfunctional carbonium ion generator to crosslink Bisphenol A. The resist patterns formed with these systems were briefly baked and then developed with an organic solvent such as acetone. EP-A-No. EP 0 361 907 is directed to photoresist compositions which are useful for deep UV image reversal processes which comprise an organic film-forming material, an oxime sulfonate photoacid generator, and an additive which can crosslink the film-forming material and increase the positive photospeed of the composition. The additives have the general formula RO-CH 2 -A-CH 2 -OR where A is a monomeric aromatic hydrocarbon having one or more fused or unfused, separated or unseparated rings and each R unit is independently H, (C 1 -C 6 )alkyl, (C 3 -C 6 )cycloalkyl, aryl or arylalkyl. The additives have the general formula wherein R 1 , R 4 , R 5 , R 6 are independently H, (C 1 -C 6 )alkyl, (C 3 -C 6 ) cycloalkyl, aryl, arylalkyl or OR 2 ; and R 2 , R 3 are independently H, (C 1 -C 6 )alkyl, (C 3 -C 6 )cycloalkyl, aryl, or arylalkyl. US-A-No. 4 404 272 to Stalhofen is concerned with aqueous developable light sensitive compositions comprising novolak resins having biominated phenol units. These compositions may includehot curable hydroxymethylphenol deritives to enhance adhesion of the compostion to the substrate. The derivitives include where R is a hydrogen atom, a lower alkyl group, or a lower acyl group, preferable a hydrogen atom, R' is an alkyl, alkoxy, cycloalkyl, aryl, aryloxy, acyl or aralkyl group or a halogen atom, X is a single bond or one the groups S, O, CO or CR'R 2 , preferably a prop- 2, 2-ylene group, and Y is a hydrogen atom or, preferably, a CH 2 OH group, R 1 and R 2 being identical or different and representing hydrogen atoms or substituted or unsubstituted alkyl groups which can be linked to one another to form a ring, and not more than two of the substituents Y being hydrogen atoms. These results depend upon the cleaveage of an acetate or an orthocarboxylic compound to give positive images. Further compositions comprising a film-forming aromatic polymer, an acid-catalyzable crosslinking agent forming a stabilized carbonium ion upon reaction with acid, and a radiation degradable acid generator are known from EP-A-0436174 and EP-A-0282724. The present invention relates to aqueous base developable photoresist compositions for generating negative tone resist images on a substrate. These compositions comprise, in admixture, (a) a film- forming aromatic polymer resin having functional groups which activate the resin to aromatic electrophilic substitution, (b) an acid catalyzable crosslinking agent which is a polyfunctional monomer selected from the group consisting of 2,6-dihydroxymethylphenol and 2,2', 6,6'-tetra-hydroxymethyl Bisphenol A which forms a stabilized carbonium ion upon reaction with acid, and (c) a radiation degradable acid generator which is adapted to absorb imaging radiation to form an acid which acid reacts with the crosslinking agent to crosslink the composition in the exposed regions, and which acid generator is selected from the group consisting of metallic and non-metallic onium salts on non-metallic sulfonic acid precursors. The activating groups are phenolic hydroxy groups in aromatic polymeric resins such as poly(hydroxystyrene), poly(hydroxy-styrene-co-t-butyloxy-carbonyloxystyrene), poly(hydroxystyrene-co-hydroxymethylstyrene), poly(hydroxystyrene-co-acetoxymethylstyrene), and novolak resin. The claimed composition can be used in a method of using new resist compositions for generating negative tone resist images on a substrate which comprises the steps of: (a) coating the substrate with a film comprising the composition of claim 1, (b) imagewise exposing the film with radiation to cause crosslinking in the exposed part ion of the film, and (c) developing this film with an aqueous base developer. An oligomeric additive which preferentialy enhances the dissolution rate of the unimaged areas while the crosslinked areas are essentially unaffected by the metal ion free basic developer is preferred when the composition is used for e-beam imaging. These novel compositions afford high contrast and high sensitivity sub-half micron patterns and allow a wide process latitude necessary for printing high density patterns of varying dimensions. The present compositions are sensitive to deep UV, e-Beam and x-ray and are easily adapted for sensitivity to i-line and g-line radiation by incorporating in the resist composition an appropriate sensitizer or an energy transfer agent. The polyfunctional carbonium ion precursors of this invention according to claim 1 are readily available materials without complex or expensive synthesis which in addition to being cost effective give excellent overall resist performance. A more thorough disclosure of the present invention is presented in the detailed description which follows and in the accompanying drawings. Figs. 1 through 4 are photomicrographs showing images made using the compositions of the invention. The present invention relates to high sensitivity, high contrast aqueous base developable photoresist compositions for generating negative tone resist images on a substrate. These compositions are specified in claim 1. The compositions are halogen free and are compatable with metal ion free developers. The crosslinking agent forms hydroxy stabilized benzyl carbonium ions. The crosslinking agent is a polyfunctional monomer selected from the group consisting 2,6-dihydroxymethyl-phenol and 2,2',6,6'tetra-hydroxymethyl Bisphenol A. The activating groups are phenolic hydroxy groups in aromatic polymeric resins such as poly(hydro-xystyrene), poly(hydroxystyrene-co-hydroxyme-thylstyrene), poly(hydroxystyrene-co-acetoxy-methylstyrene), and novolak resin. The claimed composition can be used for generating negative tone resist images on a substrate comprising the steps of: (a) coating the substrate with a film comprising the composition of claim 1; (b) imagewise exposing of the film to mid or deep UV radiation to cause crosslinking of the resin in the exposed portion of the film; and, (c) developing said film with an aqueous base developer to yield a negative resist pattern. In the first step of the process, a suitable substrate such as silicon, silicon oxide, silicon nitride or gallium arsenide is coated with a film comprising the resist composition which is dissolved in a suitable organic solvent. The aromatic polymer resin has functional groups which are preferably phenolic hydroxy groups, which activate the aromatic ring to electrophilic aromatic substitution. Typically such aromatic polymer resins will be activated ring systems such a polyhydroxy-styrene or novolak resins. These materials include co-polymers thereof and should be considered to comprise poly(hydroxystyrene), poly(hydroxystyrene-co-hydroxymethylstyrene), poly(hydroxy- styrene-coacetoxymethylstyrene) alkyl substituted polyvinyl phenols and novolak resins such as cresol novolak, ethylphenol novolaks, xylenol novolaks, etc. The acid catalyzable crosslinking agent is a carbonium ion precursor as defined in claim 1. The function groups are leaving groups in the formation of carbonium ions. The photospeed of the resist composition maybe adjusted by the selection of the leaving group. The hydroxy (-OH) group is most tightly bound to the benzyl carbon needing more energy to remove it, thus causing a relatively slow photospeed. Alkoxy is less tightly bound and this gives a faster photospeed. Acetate being a much better leaving group gives even further enhanced photospeed. Compositions are forumlated with imaging tools in mind. For a formulation suitable for i-line imaging where the exposure tools have an abundance of radiation imaging intesity, the preferred compositions use the hydroxymethyl derivatives; whereas for deep UV imaging, formulations having acetate leaving groups are preferred since the exposure tools operate at much lower intensity at 250 nm (except for excimer laser tools). The crosslinking agents of the present invention are polyfunctional carbonium ions precursor monomers as defined in claim 1. Suitable photoacid generators for use in the present invention include radiation degradable acid generators (sometimes known as photoacids). These photoacids include metallic and non-metallic onium salts and non-metallic sulfonic acid precursors which generate strong acids upon exposure to radiation. Typical of the onium salts are diaryliodonium and triarylsulfonium salts. These photoacids may include the well known diaryl iodonium and triarylsulfonium metalate salts as well as diphenyliodonium triflate, di(t-butylphenyl)-iodonium triflate, triphenyl- sulfonium triflate and tri(t-butylphenyl) sulfonium triflate, as well as the corresponding tosylates and benzene sulfonates. Among the non-metallic sulfonic acid precursors which generate strong acids upon exposure to radiation are N-sulfonyloxyimides of the form where R is selected from the group consisting of toluene, benzene, -CF 3 , -CF 2 CF 3 , -CF 2 CF 2 H, -(CF 2 ) n -Z where n = 1 to 4, where Z is H, alkyl, aryl, where m = 1 to 5, where X any Y either (1) form a cyclic or polycyclic ring which may contain one or more hetero atoms, (2) form a fused aromatic ring, (3) may be independently H, alkyl or aryl, (4) may be attached to another sulfonyloxyimide-containing residue, or (5) may be attached to a polymeric chain or backbone. The film may also comprise an aromatic dye which functions to absorb substantially all imaging mid and deep UV radiation incident on the film during the process before it reaches the substrate. The imaging mid and deep UV radiation used to process the present invention preferably has a wave length of from about 200 to about 370 nm. Suitable dyes include phenoxymethyl anthracene, anthracenemethanol, 9,10-diphenylanthracene, and phenanthracene and biphenyl derivatives. This reaction is accelerated by a brief heating of the wafer from 60 to 110°C for one to three minutes. The imaged areas are thus rendered less soluble or insoluble as compared to the unexposed areas which are removed by developing in metal ion free developer such as tetramethylammonium hydroxide (TMAH). The imaged areas are thus left behind. In an alternative embodiment of the present invention for i-line and g-line applications, requisite sensitizer or energy transfer agent is preferably also included in the formulation. One such sensitizer preferred for i-line application is anthracenemethanol. For sensitivity to long wavelength radiation, other sensitizers such as acenaphthalene, thioxanthone, methyl-2-naphthyl ketone, 4-acetylbiphenyl, and 1,2-benzofluorene may be included in the resist formulation. In yet another embodiment of the present invention for sensitzing the above formulation to e-beam and x-ray radiation, in the preferred formulation an oligomeric polyether diol is incorporated, for example, when in the above formulation polytetrahydrofuran (Mol. Wt. 200-1000) is added as 0.1 to 2% of the total solids, the resist process window and contrast gamma are significantly enhanced. Other such additives that are effective in the same manner are polyethylene glycol (Mol. Wt. 200-1000) and polypropylene glycol (Mol. 200-1000). The compositions are carried in a solvent or solvent system which is adapted to efficient film-forming for the composition. The needs which the solvents fill include providing uniform coating with complete coverage of the resist components in a substrate. The solvent must evaporate at a temperature such that the photoactivity of the resist is not adversely impacted in the drying step after coating of the resist. The solvents should be safe to handle, convenient to use, and as inexpensive as can be found since they take no part in the operation of the photoresist after its application and coating. The solvent will be polar or mostly polar and will include alcohol and alcohol derivateves as well as alcohol-ether, alcohol-ester and ester-ether solvents. Typical of these solvents are propylene glycol monomethyl ether acetate (PM acetate), ethyl-3-ethoxypropionate or EEP (ether-esters), methyoxypropanol, ethoxypropanol, and butoxypropanol (alcohol-ether). Other solvents will become apparent to those of skill in the art. When the photoresist compositions are compounded for use in e-beam exposure processes it is further desired to provide an agent to prevent excess or background crosslinking due to proximity and like effects. In that mixture there is included an oligomeric diol ether additive which improves image contrast. The preferred diol ethers are polytetrahydrofuran, polyethylene glycol and polypropylene glycol. When such oligomer diol ether additive is used, it is also preferred that there be a cosolvent so that the solvent system is, for example, comprised of an ester-ether and an alcohol ether. An example of such solvent-cosolvent system is PM acetate and 1-methoxy-2-propanol. In the second step of the process of the present invention, the film is imagewise exposed to mid or deep UV radiation to crosslink the aromatic polymer in the exposed region of the film. Suitable radiation sources include various mercury arc lamps and deuterium or excimer laser sources. The film may also be imaged with e-beam or x-ray radiation. In the third step of the process of the present invention, the film is contacted with an aqueous base developer to yield negative tone wet-developed images. The developers include potassium hydroxide (KOH) and metal ion-free (MIF) bases such as tetraalkyl ammonium hydroxide. Tetramethylammonium hydroxide (TMAH) is most preferred. The following examples are only illustrative examples for explaining a process which can be carried out also with compositions according to claim 1 : they do not make use of the crosslinking agents according to the invention. Example 1 2,6-bis(acetoxymethyl)-p-cresol was compounded into a photoresist formulation such that there was 17.47 % ( w / w ) poly-(p-hydroxystyrene), 1.22% ( w / w ) 2,6-bis(acetoxymethyl)-p-cresol, 0.54% ( w / w ) 9-anthracene methanol, 79.56%( w / w ) PM acetate propylene glycol methyl ether acetate and 1.22% ( w / w ) MDT (trifluoromethylsulfonyloxybicyclo[2.2.1]-hept-5-ene-2,3-dicarboximide), a non-metallic sulfonic acid precursor described in U.S. Patent Application Serial No. 07/322,848 filed March 14, 1989, Attorney docket No. FI9-88-046, the disclosure of which is incorporated into the present application. This photoresist formulation was spin coated onto HMDS primed silicon wafers to form a 1.1µm thick coating. The coated wafers were baked at 90°C for one minute on a hot-plate and were then exposed with ca. 20 mJ/cm 2 of 365 nm light using a 0.45NA GCA I-line step and repeat tool. The wafers were post-exposed baked on a hot-plate at 100°C for 120 seconds. Wafers were then immersion developed in 0.17N aqueous TMAH (Fig. 1). Example 2 2,6-bis(acetoxymethyl)-p-cresol was compounded into a photoresist formulation such that there was 23.64% ( w / w ) novolak (m-cresol/p-cresol co-polymer), 2.36% ( w / w ) 2,6-bis(acetoxymethyl)-p-cresol, 70.92% ( w / w ) PM acetate and 3.07% ( w / w ) MDT. This photoresist formulation was spin coated onto HMDS primed silicon wafers to form 1.1 µm thick coatings. The coated wafers were baked for 60 seconds on a 90°C hot-plate and were then exposed with 8.0 µC/cm 2 of 50 KeV electrons. The wafers were baked after exposure for 180 seconds on a 100°C hot-plate after which they were immersion developed in 0.32N aqueous TMAH (Fig. 2). Example 3 2.6-bis(acetoxymethyl)-p-cresol was compounded into a photoresist formulation such that there was 17.56% ( w / w ) poly(p-hydroxystyrene), 1.23% ( w / w ) 2,6-bis(acetoxymethyl)-p-cresol, 79.98% ( w / w ) PM acetate and 1.23% ( w / w ) MDT. This photoresist formulation was spin coated onto HMDS primed silicon wafers to form 1.1µm thick coatings. Coated wafers were then baked for 60 seconds on a 90°C hot-plate and exposed with 4.0 mJ/cm 2 of 248 nm light using a CANON 0.37 NA excimer step and repeat tool. The wafers were baked for 120 seconds on a 100°C after exposure and immersion developed in 0.17N aqueous TMAH (Fig. 3). Example 4 The photoresist formulation used in Example 2 was spin coated onto HMDS primed silicon wafers to form 1.0 µm thick films. Coated wafers were then baked at 90°C for 60 seconds and exposed with 35 mJ/cm 2 of 10Å radiation using a Karl Süss step and repeat tool at the Brookhaven National Laboratory Synchrotron Source. The wafers were baked for 120 seconds at 100°C after exposure and immersion developed in 0.32N aqueous TMAH (Fig. 4). Example 5 A composition of 1% ( w / w ) 4,4' bis(hydroxy- ethyl)benzene, 0.67% MDT, 22.22% ( w / w ). Novolak and 76.11% ( w / w ) PM acetate was spin coated onto HMDS primed silicon wafers to form µm thick coatings. The coated wafers were baked for 60 seconds on a 90°C hotplate and were then exposed to DUV (248nm) radiation receiving a 6 mJ/cm 2 dose using a CANON 0.37NA excimer stepper. It was followed by a 90 second post exposure bake (PEB) at 80°C and development in aqueous TMAH for 90 seconds which gave 0.35 µm images. Example 6 The formulation of Example 5 was prepared and spin coated on silicon wafers as described in the above Example 5. The coated wafers were then exposed to 2.5 µC/cm 2 dose of electron beam energy at 50 KeV followed by a 90 second PEB at 90°C and development in TMAH for 120 seconds. Example 7 A composition of 2.16% ( w / w ) a,a,a',a'-tetra- methyl-1,4-benzene dimethanol, 2.16% ( w / w ) of tosylate analog of MDT (p-toluenesulfonyloxybi-cyclo[2.2.1]-hept-5-ene-2,3-dicarboximide, 21,6% poly(hydroxystyrene), 0.65% ( w / w ) anthracene- methanol, 74.43% ( w / w ) PM acetate was spin coated onto HMDS primed silicon wafers to give 1 µm thick coating. The coated wafers were baked for 60 seconds on a hotplate of 90°C and were then exposed to i-line (365 nm) radiation receiving a 100 mJ dose using a GCA 0.35NA stepper. It was followed by a 60 second PEB at 100°C and pattern development carried out in aqueous TMAH for 120 seconds. Example 8 A composition of 2.17% ( w / w ) a,a,a',a'-tetra- methyl-1,4-benzenedimethanol, 2.17% ( w / w ) tosylate analog of MDT, 21.71% ( w / w ) novolac and 73.96% ( w / w ) PM acetate was spin coated onto HMDS primed silicon wafers to give 1 µm thick coatings. The coated wafers were baked for 60 seconds on a 90°C hotplate and were then exposed to 3 µC/cm 2 dose of electron beam energy at 50 Kev. It was followed by a 90 second PEB at 90°C and development one in aqueous TMAH for 90 seconds. Example 9 A formulation with 3.76% ( w / w ) 2,6-diacetoxy- methyl-p-cresol, 2.35% ( w / w ) MDT, 23.53% ( w / w ) novolak, and 0.376% ( w / w ) polytetrahydrofuran (Aldrich, MW 250) and 70% ( w / w ) PM acetate was spin applied to give 1.0 µm thick film after a bake at 90°C for 60 sec. E-beam exposures were carried out using 7 µC/cm 2 dose at 50Kev. After a bake at 101°C for 4 min excellent submicrom patterns were developed from 0.32N TMAH in less than 230 sec of development time. Example 10 A formulation with 3.76% ( w / w ) 2,6-diacetoxy- methyl-p-cresol, 2.35% ( w / w ) MDT, 23.47% ( w / w ) novolak, and 70.42% PM ( w / w ) acetate was spin applied to give 1.5 µm thick film after a bake at 90°C for 60 sec. The resist was exposed with e-beam using 7 µC/cm 2 dose at 50 Kev. In contrast to Example 9, after a bake at 101°C for 4 min. the unexposed areas did not show any sign of development from 0.32N TMAH for a development time of 230 sec. Example 11 A formulation with 2.6% ( w / w ) 2,6-diacetoxy- methyl-p-cresol, 2% MDT, 1% ( w / w ) anthracenemethanol, 14.4% poly(hydroxybenzylsilsesquioxane) and 80% ( w / w ) PM acetate was spin coated over a layer of hardbaked 1 µm diazoquinone novolak resin to obtain a 0.4 µm thick top resist layer. The film was baked after apply on a hot plate at 90°C for 90 sec. I-line exposure were carried out on a Canon 0.52 NA tool for 100 milliseconds followed by a postexposure bake at 100°C for 90 sec. Images down to 0.4 µm were resolved after development in 0.21 N TMAH for 60 sec. Patttern transfer with straight side walls was achieved withs O 2 RIE. Example 12 A formulation with 2.6% ( w / w ) 2,6-diacetoxy- methyl-p-cresol, 2% MDT ( w / w ), 15.4% ( w / w ) poly(hydroxy_ benzylsilsesquioxane) and 80% ( w / w ) PM acetate was spin coated over a layer of hardbaked 1 µm diazoquinone novolak resin to obtain a 0.4 µm thick top resist layer. The film was baked after application for 90 sec on a hot plate at 90°C. Deep UV exposures were carried out on a Canon 248 nm excimer laser tool (0.37NA) at a nominal dose of 27 mJ/cm 2 followed by a post exposure bake of 100°C on a hotplate for 90 sec. Excellent sub-half micron images were developed with 0.21N TMAH solution in about 60 sec. Excellent residue-free patterns were transferred into the underlayer with O 2 RIE. Example 13 A formulation with 2% ( w / w ) 2,6-diacetoxymethyl- p-cresol, 2% MDT ( w / w ), 16% ( w / w ) poly(hydroxy- benzylsilsesquioxane) and 80% PM acetate was spin coated over a layer of hardbaked 1 µm diazoquinone novalak resin to obtain a 0.4 µm thick top resist layer. The film was baked after application for 90 sec on a hot plate at 90°C. E-beam exposures were carried out using 3 µC/cm 2 dose at 50 Kev. After a bake at 100°C for 90 sec, excellent sub-half micron images were developed with 0.21N TMAH in about 1 minute. The patterns were transferred to the underlayer using O 2 RIE providing vertical sidewalls with virtually no residue. Example 14 A photoresist formulation was prepared by combining 1.69% ( w / w ) MDT, 1.69% ( w / w ) bis(hydroxy- methyl)-p-cresol) 1.90% w/w 9-anthracene methanol, 18.67% ( w / w ) cresol-formaldehyde novalak resin, 38.02% ( w / w ) 1-methoxy-2-propanol and 38.02% PM acetate. This photoresist was spin coated onto HMDS primed silicon wafers and baked at 90°C for 60 seconds to a thickness of 1.1 µm. The wafers were then exposed using a GCA 1635i i-line step and repeat tool at 30 mJ/cm 2 . After a post exposure bake at 100°C the resist was spray developed using 0.24N TMAH developer. Images with straight sidewalls were obtained down to 0.5 µm. Example 15 A formulation similar to that of Example 14 was prepared where 2.39% ( w / w ) of p-chlorobenzenesul- fonyloxy-5-norbornene-2,3-dicarboximide was substituted the MDT. The resist was processed as above. It had a sensitivity of 110 mJ/cm 2 and a profile similar to that in Example 14. Although this invention has been described with respect to specific embodiments, the details thereof are not to be construed as limitations, for it will be apparent that various embodiments, changes and modifications may be resorted to without departing from the spirit and scope thereof, and it is understood that such equivalent embodiments are intended to be included within the scope of this invention.

Claims: An aqueous base developable photoresist composition comprising, in admixture: (a) a film-forming aromatic polymer resin having functional groups which activate said resin to aromatic electrophilic substitution; (b) an acid catalyzable crosslinking agent which is a polyfunctional monomer selected from the group consisting of 2,6-dihydroxymethylphenol and 2,2',6,6'-tetra-hydroxymethyl Bisphenol A which forms an hydroxy stabilized carbonium ion upon reaction with acid; and, (c) a radiation degradable acid generator which forms an acid upon exposure of the photoresist composition to imaging radiation, which acid reacts with the cross-linking agent causing the composition to crosslink in the exposed regions, and, which acid generator is selected from the group consisting of metallic and non-metallic onium salts and non-metallic sulfonic acid precursors. The aqueous base developable photoresist composition of Claim 1 which further comprises an oligomeric ether diol additive having a molecular weight in the range from about 200 to 1000 and which increases the dissolution rate of the unexposed portion of the photoresist composition. The aqueous base developable photoresist composition of Claim 1 or 2 which further comprises a solvent selected from the group consisting of propylene glycol monomethyl ether acetate, ethyl-3-ethoxypropionate and ethyl lactate. The aqueous base developable photoresist composition of Claim 3 which further comprises a cosolvent selected from the group consisting of 1-methyl-2-propanol, ethoxypropanol and butoxypropanol. The aqueous base developable photoresist composition of Claim 1 wherein the nonmetallic onium salts are selected from the group consisting of diaryliodonium salts, triarylsulfonium salts, diaryliodonium and triarylsulfonium triflates, benzene sulfonates, and tosylates. The aqueous base developable photoresist composition of Claim 5 wherein the non-metallic sulfonic acid precursors are organic compounds selected in the group of N-sulfonyloxyimides of the form where R is selected from the group consisting of toluene, benzene-CF 3 , -CF 2 CF 3 , -CF 2 CF 2 H, and -(CF 2 ) n -Z, and n = 1 to 4, where Z is H, alkyl, aryl, where m = 1 to 5, where X any Y either (1) form a cyclic or polycyclic ring which may contain one or more hetero atoms, (2) form a fused aromatic ring, (3) may be independently H, alkyl or aryl, (4) may be attached to another sulfonyloxyimide-containing residue, or (5) may be attached to a polymeric chain or backbone. The aqueous developable photoresist composition of Claim 1 which further comprises an effective amount of an aromatic dye which functions as an energy transfer agent at the wavelength of the imaging radiation incident on said film during imaging. The aqueous developable photoresist composition of Claim 7 wherein said aromatic dye is selected from the group consisting of phenoxymethyl anthracene, anthracene methanol, 9,10-diphenylanthracene, and phenanchracene, and acetylbiphenyl. The aqueous base developable photoresist composition of Claim 1 wherein the oligomeric diol additive is selected from the group consisting of polytetra-hydrofuran, polyethylene glycol and polypropylene glycol. The aqueous base developable photoresist composition of Claim 1 wherein the polymer resin comprises phenolic hydroxy groups. The aqueous base developable photoresist composition of Claim 10 wherein the polymer resin is selected from the group consisting of poly(hydroxystyrene),novolak and, poly(p-hydroxy- benzyl)silsesquioxane. The aqueous developable photoresist composition of Claim 11 wherein the novolak resin is an alkylphenolformaldehyde condensation product. The aqueous developable photoresist composition of Claim 12 wherein the alkylphenol-formaldehyde condensation product is selected from the group consisting of cresol novolaks, ethylphenol novolaks, and xylenol novolaks. The aqueous base developable photoresist composition of Claim 12 wherein the phenolic hydroxy group containing polymer is selected from the group consisting of poly(p-hydroxy- benzylsilsesqui-oxane), poly-(p-hydroxyphenylsilsesquioxane), and poly(p-hydro-xyphenyl)-methylsilane.

Inventors: CONLEY WILLARD EARL, JAGANNATHAN PREMLATHA, KATNANI AHMAD DAUOD, LINEHAN LEO LAWRENCE, MIURA STEVE SEIICHI, SACHDEV HARBANS SINGH, SMITH RANDOLPH JOSEPH, WAI-LING KWONG RANEE, CONLEY, WILLARD EARL, JAGANNATHAN, PREMLATHA, KATNANI, AHMAD DAUOD, LINEHAN, LEO LAWRENCE, MIURA, STEVE SEIICHI, SACHDEV, HARBANS SINGH, SMITH, RANDOLPH JOSEPH, WAI-LING KWONG, RANEE
Applicants: IBM, INTERNATIONAL BUSINESS MACHINES
Application year: 1992
Main classification: G03F7
IPC codes: G03F7, H01L21