Process for making a package for accommodating electronic elements

Abstract: A process for making a package to be used for accommodating an electronic element including a metal wall (10) and a base plate (30). The metal wall (10) comprises a ring-like frame-shaped metal side wall folded from a strip. The strip (10) or the bottom plate (30) is first provided with an opening, recess or hole (20) for sealing a lead, inserting an optical fiber, or fitting a ceramic terminal. The strip (10) is then folded into a ring-like configuration. The receptive ends of the strip are hermetically sealed to one another. The bottom plate (30) is then hermetically sealed to an open lower periphery of the frame-shaped strip (10). The strip (10) and the bottom plate (30) may be integrally connected at a fold line (Figure 16).

Description: This invention relates to a process for making a package to be used for accommodating electronic elements, such as a semi-conductor chip or the like. A metal package having a circumferential wall formed of metal has been conventionally known in the prior art as a package for accommodating electronic elements. Such a package can be made by a first or a second process as mentioned below. The first process comprises a step for mechanically machining a metal block integrally to form a metal wall and base. EP-A-0 233 824 discloses a process wherein a ring-shaped metal containing iron sidewall is braized to an alumina/copper alloy base to form a package container. The second process comprises a step for cutting a hollow tube having a rectangular cross section into a ring-like shape having a predetermined width, providing said hollow tube with a hole used for installing thereto a ceramic terminal frame or the like, and thus forming the metal side wall. A metal bottom wall is hermetically attached to the side wall to close the bottom open end of the hollow tube. However, according to the first process, a large amount of laborious work and time are required, since a metal block must be machined to form an integral metal wall and base. According to the second process, a hole which is used for installing a ceramic terminal frame or the like must be formed by an electric spark process, not by a punching process. Thus, a large amount of laborious work and time are also required. The method according to claim 1 defines a simple alternative for making a package container. In one arrangement of the present invention said strip is a single strip continuously connected to the bottom plate, said single strip is folded into a rectangular shape, and said bottom plate is folded towards said folded rectangular strip. It is advantageous that said process further comprises a step for providing transverse grooves on an inner surface of said strip for forming said metal side wall, and said strip is then folded along said grooves to form a ring-like configuration. Preferably at least one of said respective ends of said side wall portion is cut along an edge thereof, so that, after said respective ends of said side wall portion are joined to each other, a groove for collecting solder or adhesive is formed between said respective ends. Thus, with the process in accordance with this invention it is no longer necessary to mechanically machine a metal block to integrally form a metal wall. Also it is no longer necessary to cut a cylindrical hollow tube having a rectangular cross section into a ring-like shape having a predetermined width. Therefore, a large amount of laborious work and time are no longer required. Thus, a metal wall of a package for this purpose can easily and rapidly be made, so that the drawbacks of the prior art as mentioned above can be overcome. In addition, a large amount of waste metal material is not generated. Also, an opening, recess or hole for sealing a lead member, for inserting an optical fiber, or for fitting a ceramic terminal can easily and rapidly be formed, since such an opening, recess or hole can be formed in advance of a flat strip material. Particular embodiments of processes in accordance with this invention will now be described with reference to the accompanying drawings, in which:- Figure 1 is a plan view illustrating a first process for making a metal wall of a package according to the present invention; Figures 2 and 3 are enlarged cross sectional views of U- or V-shaped groove shown in Figure 1; Figures 4, 5 and 6 are perspective views illustrating the first process for making a metal wall of this invention; Figure 7 is a plan view illustrating an embodiment of the first process for making a package metal wall according to the present invention; Figures 8 through 10 are perspective views illustrating the embodiment of the first process for making a package metal wall according to the present invention; Figures 11 through 13 are enlarged cross-sectional views of the strip abutting area in the first process for making a package metal wall; Figure 14 is a plan view illustrating a second process for making a metal wall of a package according to the present invention; Figures 15 is a plan view illustrating an embodiment of the second process for making a metal wall of a package according to the present invention; Figures 16 and 17 are perspective views illustrating a second process for making a metal wall according to the present invention; Figures 18 through 22 are enlarged cross-sectional views of the strip abutting area in the second process for making a package metal wall; Figures 23 and 24 are plan views illustrating first and second processes for making a metal wall according to the present invention; Figure 25 is a perspective view of a package using a metal wall which is made in accordance with the present invention; and, Figures 26 through 29 are cross-sectional views of the package shown in Fig. 25. Figs 1-6 show a preferred embodiment of a first process for making a metal wall of a package according to the present invention, particularly steps for forming thereof. As shown in Fig. 1, a strip 10 for forming a package metal side wall. The strip 10 is a metal plate made of Koval (Fe-Bi-Co alloy), 42 Alloy (Fe-Ni Alloy) or the like, having a thermal coefficient matching with a ceramic terminal frame or a glass material for hermetically sealing lead members and a good wetting characteristic with respect to solder material. Such a strip is made by cutting the metal plate, such as an etching process, a punching process, a wire-cut electric spark process or the like. As shown in the enlarged views of Figs. 2 and 3, the strip 10 is provided at the several positions to be folded on the inner surface thereof with grooves 12 each having a U- or V-shaped cross-section. The grooves 12 can be formed by, such as, a half etching process, a punching process, or the like. Also, the strip 10 is provided at predetermined positions with transverse openings or recesses 20 to which respective ceramic terminals (not shown) are inserted. The openings 20 can be formed by an etching process, a punching process, a wire-cut electric spark process, or the like. The strip 10 may be provided, in place of or in addition to the ceramic terminal insertion openings 20, with openings for inserting optical fibers or hermetically sealing leads, in accordance with a type of the metal wall structure constituted by itself. It is advantageous that these grooves 12 and openings 20 can be simultaneously formed at the time of cutting the strip 10 itself from a metal plate. Such grooves 12 and openings 20 can also be formed before or after the strip 10 itself is made by cutting the same from a metal plate. As shown in Fig. 4, the strip 10 is then folded inward along the U- or V-shaped grooves 12 provided at the predetermined several positions on the inner surface thereof, so that a ring-shaped rectangular frame, each corner being defined by 90 ° , is formed as shown in Fig. 5. The respective ends of the strip 10 are mutually joined and fixedly, hermetically connected to each other by a welding process. The ends of the strip 10 may also be hermetically connected by using a suitable adhesion. Then, the lower opening of the ring-shaped rectangular folded strip 10 is hermetically closed by a bottom metal plate 30 by a soldering process, using such as a silver-solder. Otherwise, the ring-shaped rectangular folded strip 10 may be hermetically connected to the bottom metal plate 30 by a suitable adhesion or a glass material. The metal strip 10 and the bottom plate 30 may be set in a suitable positioning means made of a heat resistance carbon material, so that both the metal strip 10 and the bottom plate 30 are mutually positioned to each other, and then they are inserted into a high temperature furnace in which the respective ends of the metal strip 10 and both the metal strip 10 and the bottom plate 30 are simultaneously adhered by soldering. The respective ends of the metal strip 10 and both the metal strip 10 and the bottom plate 30 may not be simultaneously adhered, but the respective ends of the metal strip 10 may be first adhered to each other by soldering and then both the metal strip 10 and the bottom plate 30 may be adhered to each other by soldering. Thus, as shown in Fig. 6, there is obtained a metal wall 40 having opposite side walls 42 and opposite end walls 44. Each of the end walls is provided at the predetermined position with the opening or recess 20. A more detailed embodiment of the first process for making the metal wall 40 as shown in Figs. 1 through 6 will now be described with reference to Figs. 7 through 13. Fig. 7 is similar to Fig. 1 and shows a preferred embodiment of the first process for making the metal wall. A metal strip 10 is provided at a predetermined position with a relatively large circular hole 24 for inserting an optical fiber. On the other hand, the metal bottom plate 30 is provided at predetermined positions with relatively small several circular holes 22 for hermetically sealing lead members (not shown). These holes 24 and 22 are formed, respectively, on the metal strip 10 before it is folded to a ring-shaped rectangular frame and on the metal bottom plate 30 before it is fixed to the rectangular frame of metal strip 10. In the same manner as the embodiment shown in Figs. 1 to 6, the strip 10 is provided at the several positions to be folded on the inner surface thereof with grooves 12 each having a U- or V-shaped cross-section. Thus, the same members or portions are indicated by the same reference numerals as Figs. 1-6. Figs. 8 through 13 show another preferred embodiment of the first process for making the metal wall. In this embodiment, as shown in Fig. 8, at least one of the respective ends of the metal strip 10 is cut along an edge thereof. As shown in detail in Figs. 11 and 12, one end of the metal strip 10 is provided at the inner edge thereof with an inclined cut. Otherwise, as shown in Fig. 13, one end of the metal strip 10 is provided at the inner edge thereof with a L-shaped cut groove 14. Thus, when a ring-shaped rectangular frame is formed from the metal strip 10 by joining the respective ends together with respect to each other, the solder or adhesion material can be collected in this L-shaped groove 14. As shown in Fig. 11, a rod-like solder material 18 is fitted into the adhesion collecting groove 14 of the metal strip 10 and then the work is put into a high temperature furnace in which the solder material 18 is permeated in the abutting face between the respective ends of the metal strip 10. As shown in Figs. 12 and 13, the respective ends of the metal strip 10 are hermetically sealed to each other by the solder material 18. Otherwise, a thin flat solder (not shown) for sealring may be inserted into the abutting gap between the respective end faces of the metal strip 10 and then the work may be put into a high temperature furnace, in which the solder is permeated in the abutting gap between the respective ends of the metal strip 10. Thus, the respective ends of the metal strip 10 may be hermetically sealed to each other by the solder. The solder material can be accummulated in layers in thick in the adhesion collecting groove 14 of the metal strip 10 due to the surface tension exerted on the solder material. Thus, the sealing effect on the abutting faces between the respective ends of the metal strip 10 can be improved. Also, the solder material can be collected in the adhesion collecting groove 14 due to surface tension to prevent the solder material from flowing out of the collecting groove 14. The reasons why the sealing effect on the abutting faces is improved are as follows. In general, when the metal strip 10 is folded into a rectangular frame, the folded portions are not always bent correctly at 90 ° , but readily deformed or bent with respect to the side edges of the strip 10. Thus, the abutting portion between the respective ends of the metal strip 10 are not always flat, but in many cases uneven. In that case, the respective ends of the metal strip 10 do not contact each other in a surface contact, but in a point contact or a line contact. In this case, a solder material cannot uniformly be permeated in the abutting gap. Thus, unfavorable voids or leak passage (not shown) would be generated in the solder material between the respective ends of the metal strip 10. Thus, the sealing effect of the metal strip 10 would be affected. In order to overcome the problems as mentioned above, it would be proposed that an amount of the solder material be increased. In this case, however, the unfavorable voids or leak passages generated in the solder material could not be reduced, but it would become difficult to find such voids or leak passages, since the thickness of the solder material was increased. In addition, a stress would be exerted on the solder material due to the difference in thermal expansion coefficient between the metal wall and the solder material. The solder material would flow out and attach on the unfavorable portions. According to the present invention, however, since the adhesion collecting groove 14 is provided along the transverse edge between the respective ends of the strip 10, the solder material can be accummulated in layers in thick in the adhesion collecting groove 14 of the metal strip 10 due to the surface tension exerted on the solder material. Thus, the solder material can be collected in the adhesion collecting groove 14 due to a surface tension and the sealing effect on the abutting faces between the respective ends of the metal strip 10 can be improved. Fig. 14 shows a preferred embodiment of a second process for making a metal wall of a package. In this embodiment, a metal strip 100 is similar to that shown in Fig. 1 by itself. But the metal strip 100 is integrally and continuously connected at an intermediate portion of the lower edge thereof to a bottom metal plate 300, which is provided at the respective ends thereof with U-shaped recesses 320 for fitting screws for mounting this metal wall onto a printed board or the like. The metal strip 100 and the metal bottom plate 300 are made of a single metal plate, such as Koval, 42 alloy or the like, and obtained by integrally cutting the same by a punching process, an etching process, a wire-cut electric spark process. The metal strip 100 is provided on the inner surface thereof at the several positions (four positions in the drawing) to be folded with transverse grooves 120 each having a U- or V-shaped cross-section. On the other hand, the metal bottom plate 300 is also provided on the inner surface thereof and at the boundary position between the metal strip 100 and the metal bottom plate 300 with a longitudinal groove 340 having a U- or V-shaped cross-section. These grooves 120 and 340 can be formed by a half-etching process or a punching process. The metal strip 100 is provided at a predetermined positions with longitudinal openings 200 for fitting ceramic terminals (not shown). Such openings 200 can be formed by a punching process or an etching process. The strip 100 may be provided, in place of or in addition to the ceramic terminal insertion openings 200, with openings for inserting optical fibers or hermetically sealing leads, in accordance with a type of the metal wall structure constituted by itself. It is advantageous that these grooves 120, 340 and openings 200 can be simultaneously formed at the time of cutting the strip 100 and the bottom metal plate 300 themselves from a metal plate. Such grooves 120, 340 and openings 200 may also be formed before or after the strip 100 and the bottom plate 300 are made by cutting the same from a metal plate. Then, the strip 100 is folded inward along the several U- or V-shaped grooves 120 provided at the predetermined several positions on the inner surface thereof, so that a ring-shaped rectangular frame, each corner being defined by 90° is obtained from the metal strip 100 except for the metal bottom plate 300. The respective ends of the strip 100 are mutually joined and fixedly, hermetically connected to each other by a welding or soldering process to obtain a ring-shaped rectangular frame. The ends of the strip 100 may be hermetically connected by using any suitable adhesion. Then, the lower opening of the rectangular folded strip 100 is hermetically closed by the bottom plate 300 by a soldering process, using such as a silver-solder. Otherwise, the rectangular folded strip 100 may be hermetically connected to the bottom plate 300 by suitable adhesion or glass material. The strip 100 and the bottom plate 300 may be set in a suitable positioning means (not shown) made of a heat resistance carbon material, so that both the strip 100 and the bottom plate 300 are mutually positioned to each other, and then they are inserted into a high temperature furnace in which the respective ends of the strip 100 and both the the metal strip 100 and the bottom plate 30 are simultaneously adhered to each other by soldering. The respective ends of the strip 100 and both the strip 100 and the bottom plate 300 may not be simultaneously adhered to each other, but the respective ends of the strip 100 may be first adhered to each other by soldering and then both the metal strip 100 and the bottom plate 300 may be adhered to each other by soldering. Thus, there is obtained a metal wall made of Koval, 42 alloy, or the like provided at the side walls thereof with the openings 200 for fitting ceramic terminals. Fig. 15 shows another embodiment, similar to that shown in Fig. 14, for making a metal wall of a package. In this embodiment, before the bottom plate 300 is folded toward the strip 100, the bottom plate 300 is provided on predetermined positions on the surface thereof with a plurality of small circular holes 220 for hermetically sealing leads. On the other hand, the strip 100 has no such holes for fitting ceramic terminals. The bottom plate 300 may be provided, in place of or in addition to the lead sealing holes 220, with openings for inserting optical fibers or fitting ceramic terminals, in accordance with a type of the metal wall structure constituted by itself. In the same manner as the embodiment shown in Fig. 14, the metal bottom plate 300 is provided on the surface thereof at the several positions with holes 220 for sealing lead members (not shown). Thus, the same members or portions are indicated by the same reference numerals as Fig. 14. Figs. 16 through 22 show another preferred embodiment of the second process for making the metal wall. In this embodiment, in the same manner as the first process as shown in Figs. 8 though 13, at least one of the respective ends of the metal strip 100 is cut along an edge thereof. As shown in detail in Figs. 18 and 19, or in Fig. 20, one end or the respective ends of the metal strip 100 is provided at the inner edge thereof with an inclined cut. Otherwise, as shown in Fig. 21 or 22, one end or the respective ends of the metal strip 100 is provided at the inner edge thereof with a L-shaped cut groove 140. Thus, when a ring-shaped rectangular frame is formed from the metal strip 100 by joining the respective ends together with respect to each other, the solder or adhesion material can be collected in this L-shaped groove 140. As shown in Fig. 18, a rod-like solder material 180 is fitted into the adhesion collecting groove 140 of the metal strip 100 and then the work is put into a furnace (not shown), in which the solder material 180 is permeated in the abutting face between the respective ends of the metal strip 100. As shown in Figs. 12 and 13, the respective ends of the metal strip 100 are hermetically sealed to each other by the solder material 180. Otherwise, a thin flat solder (not shown) for sealring may be inserted into the abutting gap between the respective end faces of the metal strip 100 and then the work may be put into a high temperature furnace in which the solder is permeated in the abutting gap between the respective ends of the metal strip 100. Thus, the respective ends of the metal strip 100 may be hermetically sealed to each other by the solder. The solder material can be accummulated in layers in thick in the adhesion collecting groove 140 of the metal strip 100 due to the surface tension exerted on the solder material. Thus, the sealing effect on the abutting faces between the respective ends of the metal strip 100 can be improved. Also, the solder material can be collected in the adhesion collecting groove 140 due to surface tension to prevent the solder material from flowing out of the collecting groove 140. The sealing effect on the abutting faces can be improved on the same reasons as mentioned hereinbefore. In the same manner as the embodiments shown in Fig. 14 or 15. a metal plate is thus obtained and therefore the same members or portions are indicated by the same reference numerals as Fig. 14 or 15. In the above-mentioned first and second process for making a metal wall of a package, if the metal strip 10 or 100 or the metal bottom plate 300 connected to the metal strip 100 is thick enough, as shown in Figs. 2 and 3, sub grooves 16 may be provided on the outer surface of the metal strip 10 or 100 along the V- or U-shaped grooves 12 or 120, or along the groove 340 (Fig. 14). Thus, the thickness of the strip 10 or 100 is remarkably reduced at the predetermined folded positions and, therefore, the strip 10 or 100 can easily be folded. In the same manner, the metal bottom plate 300 can easily be folded toward the ring-shaped rectangular strip 100. On the other hand, if the metal strip 10 or 100 or the metal bottom plate 300 connected to the metal strip 100 is thin enough, such sub grooves 16 would no more be necessary. In this case, using a metal mold (not shown) or the like, the metal strip 10 or 100 can easily be bent or folded along the V- or U-shaped grooves 12 or 120, or along the groove 340 (Fig. 14). As shown in Figs. 4-6 or 8-10, the respective ends of the metal strip 10 or 100 may be positioned at a corner of the ring-shaped rectangular frame. Otherwise, as shown in Figs. 16 and 17, the respective ends of the metal strip 10 or 100 may be positioned at an intermediate flat portion between the adjacent corners of the ring-shaped rectangular frame. In addition, as shown in Fig. 23, an auxiliary plate 50 may be attached to the inner surface of the metal strip 10 or 100 at the respective ends thereof. Thus, the respective ends of the metal strip 10 or 100 are joined together by a soldering process with the auxiliary plate 50. As shown in Fig. 24, the respective ends of the metal strip 10 or 100 may be provided with complementary steps 60a and 60b by a half-etching process or the like. Thus, the respective ends of the metal strip 10 or 100 can be joined by soldering or the like during these complementary steps 60a and 60b are precisely positioned to each other. The respective ends of the metal strip 10 or 100 may be first provisionally adhered to each other such as by a spot welding or the like and thus they are precisely positioned to each other. Then, they are fixedly, hermetically adhered to each other by soldering or the like. In the above-mentioned first and second process for making a metal wall of a package, the metal strip 10 or 100 may be folded to be a triangular, hexagonal or octagonal shape. Fig. 25 is a perspective view of a package for accommodating an electronic element, using a metal wall which is made in accordance with the present invention as mentioned above. The metal wall 40 itself is the same as that shown in Fig. 6 and, therefore, comprises a metal strip 10 folded as a ring-shaped rectangular frame, having opposite side walls 42 and opposite end walls 44, and a bottom metal plate 30. The lower opening of the ring-shaped rectangular folded strip 10 is hermetically closed by the bottom metal plate 30. Each of the opposite end walls 44 is provided with a rectangular opening or recess 20 to which a ceramic lead terminal 70 is hermetically inserted. Fig. 26 is a cross-sectional view of the package shown in Fig. 25. Thus, the lower opening of the ring-shaped rectangular folded strip 10 is hermetically closed by a metal plate 30 made of a metal having a high thermal conductivity, such as, a copper-tungsten alloy or the like. The ceramic terminal 70 has a reversed T-shaped cross-section and, therefore, has a pair of steps 64a and 64b on which a plurality of conductive metalized lines 62 are formed. Thus, a plurality of lead members 41 are connected to the metalized lines 62. In Fig. 27, a ceramic bottom plate 50 is used in place of the metal bottom plate 30. The ceramic bottom plate 50 comprises a ceramic substrate 500 and a metalized layer 520 covering the ceramic substrate 500. It is advantageous that the ceramic substrate 500 is made of a ceramic material, such as AlN, BN, or SiC or the like, having a thermal coefficient matching with that of the ceramic terminals 60. In an embodiment shown in Fig. 28, an upper metalized layer 521 and an lower metalized layer 522 are formed on the upper and lower surfaces, respectively, of the ceramic substrate 500. Also, the ceramic substrate 500 has a plurality of via holes 540, each of which is filled with a conductive material to electrically connect the upper metalized layer 521 to the lower metalized layer 522. In another embodiment shown in Fig. 29, the entire surface of the ceramic substrate 500 is covered with a metalized layer 520. In the same manner as the embodiment shown in Fig. 28, the ceramic substrate 500 has a plurality of via holes 540, each of which is filled with a conductive material to electrically connect the upper metalized layer and the lower metalized layer formed on the upper and lower surfaces, respectively, of the ceramic substrate 500.

Claims: A process of making an electronic element package container said electronic element package comprising a ring-shaped metal sidewall and a metal bottom plate, said process comprising the steps of: (i) providing a metal strip (10,100) for forming said metal side wall said metal strip being provided with a transverse recess (20) or hole (200) for sealing a lead or fitting a ceramic terminal, or with a hole (24) for inserting an optical fiber; (ii) providing a metal plate (30,300) for forming said bottom plate; (iii) folding said metal strip to form a ring-shaped metal frame; (iv) hermetically attaching and sealing to one another the respective ends of said ring-shaped metal frame to form said ring-shaped metal sidewall; and (v) hermetically attaching and sealing said ring-shaped metal sidewall with one of its ring-shaped edges onto said metal plate to form said electronic element package container. A process according to claim 1, wherein said metal plate is provided as an integral part of said metal strip and said metal strip is folded into a rectangular shape, and then said metal plate is folded towards said rectangular ring-shaped metal sidewall. A process according to claim 1 or 2, wherein said process further comprises a step of providing transverse grooves on an inner surface of said metal strip and said metal strip is then folded along said transverse grooves in folding step (iii). A process according to claim 3, wherein each of said transverse grooves has a V- or U-shaped cross section. A process according to claim 4, wherein a small transverse groove is provided on an outer surface of said metal strip along each of said V- or U-shaped transverse grooves. A process according to any one of the preceding claims wherein at least one of said respective ends of said metal strip is cut along an edge thereof, so that after said respective ends of said metal strip are joined to each other in step (iv), a groove for collecting solder or adhesive is formed between said respective ends. A process according to any one of the preceding claims, wherein said hermetically attaching and sealing in step (iv) is carried out by a soldering process. A process according to any one of the preceding claims, wherein said hermetically attaching and sealing in step (v) is carried out by a soldering process. A process according to any one of the claims 1 and 2-8, wherein said ring-shaped metal side wall is rectangular ring-shaped. A process according to any one of the preceding claims, wherein the folded ring-shaped metal frame and said metal plate are set in a suitable positioning means, in which said ring-shaped metal frame and said metal plate are mutually positioned, and then the hermetically attaching and sealing steps (iv) and (v) are simultaneously conducted.

Inventors: HIGUCHI TSUTOMU, MIYAGAWA FUMIO, MIYAMOTO TAKAHARU, HIGUCHI, TSUTOMU, MIYAGAWA, FUMIO, MIYAMOTO, TAKAHARU
Applicants: SHINKO ELECTRIC IND CO, SHINKO ELECTRIC INDUSTRIES CO. LTD.
Application year: 1992
Main classification: H01L21
IPC codes: H01L21, H01L23