WIRING BOARD

Abstract: A wiring board having a reliable and cheaply fabricated wiring circuit which can be easily formed in a fine form enabling the semiconductor devices to be more densely integrated in further reduced thickness, reduced size and at reduced cost, the wiring board capable of being sealed in a plastic package. A thin dielectric film (2) is formed on the surface of a metal plate (1), and a semiconductor element (8) is mounted on the surface of the dielectric (2) or on the exposed surface of the metal plate (1). On the dielectric (2), thin multilayered wiring films (3), (4) and (5) are formed by sequential vapor deposition of a conductor layer of aluminum; an adhesive layer of chromium, or titanium or a laminate thereof; a diffused barrier layer of nickel, or copper or laminate thereof; and a corrosion preventing/wire-bonding layer of gold. The wiring may comprise an adhesive layer of any one of chromium, aluminum or titanium, or a laminate thereof, a conductor layer of copper and a gold layer that are formed in the order mentioned, or may comprise a conductor layer of aluminum, a barrier layer of nickel and a gold layer formed in the order mentioned. The thin-film wiring can be finely formed with ease enabling the wiring conductors to be highly densely fabricated. Moreover, the wiring composed of aluminum or copper can be cheaply formed.

Description: Technical Field The present invention relates to a wiring board for mounting electrical elements such as semiconductor elements. Background Art There are known numerous products equipped with signal or power source wirings including functional elements such as semiconductor elements. Such known products, as described e.g. in GB-A-1 527 108 with a wiring layer structure of Ti/Pd/Cr/Ni/Au, include hybrid IC's and various IC packages. In recent days, new products have been developed in which an alumina wiring board, as described e.g. in US-A-4 420 364 with a structure of Al/Ni/Au, or a printed wiring board provided with Ag-Pd wirings formed by screen printing is mounted in a so-called plastic package which utilizes lead frames and resin sealing and which is easy to automate and can be manufactured at low cost. These products can carry a plurality of elements. Efforts are now being made to develop more highly integrated semiconductor devices which are lighter, thinner, shorter, smaller and less expensive. A wiring board which can cope with the requirement and can be built into a plastic package is required. But, the above-described wiring boards have a problem in that it is difficult to increase their density and reduce their thickness beyond a certain point by reducing the wire diameter. The same is true with the printed wiring board. Also, the printed wiring board has another problem in that when mounting elements, especially when bonding with wires, the adhesive tends to soften. An object of the present invention is to provide a wiring board which is free of the above problems and which satisfies the above requirements. Disclosure of the Invention In order to solve the above problems, according to the present invention, there is provided a wiring board comprising a metal plate made of a lead frame material, a thin-film dielectric layer formed on the surface of the metal plate, an electric element being adapted to be mounted on the surface of the dielectric layer or on an exposed surface of the metal plate, and signal and/or power source wiring layers on the dielectric layer. Each wiring layer should be in the form of (1) a laminate formed by laminating, by vapor phase deposition or by plating, a conductive layer of aluminum, an adhesive layer made of chromium, titanium or a laminate thereof, a diffusion barrier layer made of nickel, copper or a laminate thereof, and a corrosion-preventive and wire bonding layer made of gold, (2) a laminate formed by laminating, by vapor phase deposition or by plating, an adhesive layer made of chromium, aluminum, titanium or a laminate comprising at least two of chromium, aluminum and titanium, a conductive layer of copper, and a corrosion-preventive and wire bonding layer made of gold, or (3) a laminate formed by laminating, by vapor phase deposition or by plating, a conductive layer of aluminum, a diffusion barrier layer made of nickel, and a corrosion-preventive and wire bonding layer made of gold. Aluminum and copper are metals available at low cost. Generally, gold is used for film wiring. Since gold is a precious metal, it is fairly expensive. Thus, by making the conductive layer from aluminum or copper, the material cost of the board can be reduced markedly. But, in case of the resin-sealed type, the wirings made of aluminum or copper tend to corrode due to the high hygroscopicity of resin. Also, a gold wire bonding connection has a problem in that intermetallic compounds tend to produce due to thermal diffusion between gold and aluminum, thereby increasing the electrical resistance and reducing the strength at the connection. A gold-copper connection has a problem in that the bonding properties are not good. Moreover, wiring layers tend to peel off easily due to poor adhesion of the copper wiring layer to the dielectric layer. According to one aspect of the present invention, in order to prevent the corrosion of wirings and to improve the adhesion when bonding with gold wires (by preventing the formation of compounds), an adhesive layer made of chromium, titanium or a laminate thereof is formed on an aluminum layer as a conductive layer; a diffusion barrier layer made of nickel, copper or a laminate thereof is formed further thereon; and a gold layer is further formed thereon. In another aspect of the present invention, a diffusion barrier layer made of nickel is formed on an aluminum layer as a conductive layer; and a gold layer is further formed thereon. In yet another aspect of the invention the conductive layer is made from copper, an adhesive layer made of chromium, aluminum, titanium or a laminate thereof is formed on the dielectric layer; a conductive layer of copper is formed thereon; and a corrosion-preventive and wire bonding gold layer is laminated further thereon. These wirings should be formed by vapor phase deposition or by plating, because with these methods, the films can be miniaturized easily, i.e. the wiring width can be easily reduced to 100 microns or less, which is difficult with the screen printing method. Considering the fact that the wirings have to have a conductivity of 100 m /mm or less, the aluminum or copper layer has to be fairly thick, i.e. 5 microns or more. But their mass-productivity is known to be very high. The adhesive layer is provided to increase the adhesion between the aluminum conductive layer and the diffusion barrier layer or between the copper conductive layer and the dielectric layer. Its thickness should preferably be between 0.01 micron and 0.5 micron regardless of whether it is made of a single metal or a laminate of different metals. If 0.01 micron or less, sufficient adhesion is difficult to come by. If 0.5 micron or more, the cost for forming the film will become too high. The thickness of the diffusion barrier layer should be within the range of 0.05 micron or more and 5 microns or less. If the thickness is 0.05 micron or less, no diffusion barrier effect will be manifested. If 5 microns or more, the film forming cost will become too high. The thickness of the gold film layer should preferably be between 0.05 micron and 0.5 micron. If the thickness is 0.05 micron or less, it will be difficult to expect sufficient corrosion prevention or good wire bonding properties. If 0.5 micron or more, material cost will be too high, thereby increasing the cost of the end product. The above-described arrangement can offer a wiring board having fine wirings and having good reliability even if it is used in the resin-sealed package. But by forming an inorganic dielectric film made of e.g. alumina as the dielectric layer directly on the metal board, a very thin surface mounting type flat package is obtained. Also, the reliability of the printed wiring board can be kept high because the adhesive layer never softens. Brief Description of the Drawings Fig. 1 is a perspective view of one example of the wiring board according to the present invention; and Fig. 2 is a cross-sectional view showing one example of a semiconductor device using the wiring board according to the present invention. Best Mode for Embodying the Invention The figure shows an embodiment of the wiring board according to the present invention. Numeral 1 in the figure shows a metal plate as a base. A thin-film dielectric layer 2 is formed directly on the surface of the metal plate 1. A Vcc wiring 3, a GND wiring 4 and signal (I/O) wirings 5 are formed on the layer 2. The GND wiring 4 extends onto a portion where the dielectric layer 2 is partially cut out and is connected at this portion to the metal plate 1. Numeral 6 is a Vcc external lead and 7 is a GND external lead. The wirings 3, 4 and 5 are film wirings in the form of laminates having either one of the following three structures: (1) Al/Cr, Ti or a laminate thereof/Ni, Cu or a laminate thereof, (2) Cr, Al, Ti or a laminate comprising at least two of the above metals/Cu/Al, and (3) Al/Ni/Au. Power source electrodes of a semiconductor element 8 mounted on the dielectric layer 2 are connected to the Vcc wiring 3 through bonding wires 9. Its grounding electrodes are connected to the GND wiring 4. The Vcc wiring 3 and the GND wiring 4 are connected to the Vcc external lead 6 and the GND external lead 7, respectively, through the bonding wires 9. Signal electrodes of the element 8 are eventually connected to a signal external lead (not shown) having a shape similar to the leads 6 and 7. But if the signal wirings 5 are provided as in the embodiment, at least some of the signal electrodes are connected to the external lead via the wirings 5. With this arrangement, the dielectric layer 2 serves as an insulating layer between 1 and 3 and between 5 and 3 with respect to the direct current source. Thus, a bypass capacitor is created over the entire area where the Vcc wiring 3 is formed, with metal plate 1 and wiring 3 as electrodes. This serves to prevent the entry of noise when switching the element 8. The following is a more detailed description of the preferred embodiments. (Embodiment 1) A surface-mounting type resin-sealed 132-pin plastic flat package (PQFP) 10 (Fig. 2) was prepared which had a CMOS digital logic IC as a semiconductor element mounted on the wiring board according to the present invention (shown in Fig. 1). A plastic body of this package was 24 x 24 x 4 mm and had 33 external lead pins along each side with the pin pitch of 0.64 mm. The area of the Vcc wiring which corresponds to 3 in Fig. 1 was set to be 40 mm² in order that the connection with the bonding wire 9 can be made with ease. This wiring area corresponds to the effective electrode area of the bypass capacitor created by the dielectric layer. The IC used here requires a bypass capacitor having a capacitance of about 500 pF or more. We prepared seven different kinds of wiring boards as shown in Table 1 each having a wiring laminate comprising aluminum conductive layer/adhesive layer/barrier layer/gold layer, nine different kinds of wiring boards as shown in Table 2 each having a wiring laminate comprising adhesive layer/copper conductive layer/gold layer, and seven different kinds of wiring boards as shown in Table 3 each having a wiring laminate comprising aluminum conductive layer/nickel barrier layer/gold layer. Their performances were tested before assembling. The test results showed that the wiring board Nos. 1-20, which used Al₂O₃ for the dielectric layer, had a capacitance of about 490 pF and that the board Nos. 21-23, which used SiO₂, had a capacitance of 480 pF. Also, none of the PQFP prototypes constructed from these boards produced any problematic signal (I/O) noise waveforms even when the number of simultaneous switchings of the CMOS digital logic ICs was increased. This clearly shows that the wiring boards were functioning normally. In order to evaluate the reliability, the property test was conducted again after subjecting the samples to a high-temperature shelf test at 150°C for 1000 hours. Sample Nos. 2-4, 7, 8, 10-13, 15, 16 and 19-23 showed good results. But some malfunctioning was observed for the sample Nos. 1, 5, 6, 9, 14, 17 and 18. We disassembled these samples for checking. It turned out that the malfunctions of the sample Nos. 1, 9, 14 and 18 resulted from reduction in strength of the bonding surfaces between the gold bonding wires and the wirings due to insufficient thickness of gold film. As for the sample Nos. 5, 6 and 17, diffusion of aluminum into the gold layer because of insufficient thickness of the barrier layer was observed. In other words, the barrier layer was not functioning as an effective barrier. Industrial Application As described above, the wiring board according to the present invention requires lesser space and its wiring reliability is high. Further, by the use of composite film structure as a wiring layer with a base of aluminum or copper, the entire board can be manufactured at low cost. Thus, by using the wiring board according to the present invention for various semiconductor devices, they can be highly integrated, made lighter, thinner, shorter and smaller and can be manufactured at low cost. Thus, the present invention can provide semiconductor devices which satisfy the contemporary needs.

Claims: A wiring board comprising a metal plate, an inorganic thin-film dielectric layer formed on the surface of said metal plate, an electric element being adapted to be mounted on the surface of said dielectric layer or on an exposed surface of said metal plate, and signal and/or power source wiring layers formed on said dielectric layer, a lead frame connected to said wiring layers, said each wiring layer being in the form of a laminate consisting, in the following order, of a conductive layer of aluminium with a thickness of 5 µm or more, an adhesive layer with a thickness between 0.01 µm and 0.5 µm of chromium, titanium or a laminate thereof, a diffusion barrier layer with a thickness between 0.05 µm and 5 µm of nickel, copper or a laminate thereof, and a corrosion-preventive and wire bonding layer made of gold. A wiring board comprising a metal plate, an inorganic thin-film dielectric layer formed on the surface of said metal plate, an electric element being adapted to be mounted on the surface of said dielectric layer or on an exposed surface of said metal plate, and signal and/or power source wiring layers formed on said dielectric layer, a lead frame connected to said wiring layers, said each wiring layer being in the form of a laminate consisting, in the following order, of an adhesive layer with a thickness between 0.01 µm and 0.5 µm of chromium, aluminium, titanium or a laminate comprising at least two of chromium, aluminium and titanium, a conductive layer of copper with a thickness of 5 µm or more, and a corrosion-preventive and wiring bonding layer of gold. A wiring board comprising a metal plate, an inorganic thin-film dielectric layer formed on the surface of said metal plate, an electric element being adapted to be mounted on the surface of said dielectric layer or on an exposed surface of said metal plate, and signal and/or power source wiring layers formed on said dielectric layer, a lead frame connected to said wiring layers, said each wiring layer being in the form of a laminate consisting, in the following order, of a conductive layer of aluminium with a thickness of 5 µm or more, a diffusion barrier layer of nickel with a thickness between 0.05 µm and 5 µm, and a corrosion-preventive and wire bonding layer of gold.

Inventors: BAN SHUNSUKE, HARADA KEIZO, MAEDA TAKAO, TAKIKAWA TAKATOSHI, YAMANAKA SHOSAKU, BAN, SHUNSUKE, ITAMI WORKS OF SUMITOMO EL.IND., HARADA, KEIZO, ITAMI WORKS OF SUMITOMO EL.IND.LTD., MAEDA, TAKAO, ITAMI WORKS OF SUMITOMO EL.IND.LTD., TAKIKAWA, TAKATOSHI, ITAMI WORKS OF SUMITOMO EL., YAMANAKA, SHOSAKU,
Applicants: SUMITOMO ELECTRIC INDUSTRIES, SUMITOMO ELECTRIC INDUSTRIES, LTD.
Application year: 1992
Main classification: H01L23
IPC codes: H01L23, H05K1