DIELECTRIC MATERIAL FOR HIGH FREQUENCY AND RESONATOR MADE THEREOF, AND MANUFACTURE THEREOF

Abstract: A dielectric material for high frequencies, wherein a glass, an oxide aggregate having a dielectric constant whose temperature coefficient τ ε is positive, and an oxide aggregate having a dielectric constant whose temperature coefficient #tau#ε is negative are used, these are blended in a predetermined volumetric ratio, the temperature coefficient τ ε of high frequency dielectric material is about -12 ppm/°C. Thereby the temperature coefficient τ f of the resonance frequency of the high-frequency resonator made of the dielectric material is about zero.

Description: Field of the Invention This invention relates to a high-frequency dielectric material suitable for a high-frequency resonator, a resonator, and methods for producing the same. Background Art As substrate materials for use in electrical and electronic printed circuit boards, there have been developed some which can be sintered at low temperature. Using these, it is possible to sinter the substrate material, conductors, resistors and the like, simultaneously and integrally, at a low temperature of or below 1,000 °C, for example. Such low-temperature sintered boards are used at frequencies in the low-frequency band of, for example, about 0.5 GHz or lower, and as the substrate material there is generally used a low sintering temperature material containing glass having a softening point of about 700 - 900 °C and Al 2 O 3 aggregate. The inventors test-fabricated a high-frequency resonator by laminating dielectric layers formed using the low sintering temperature material mentioned above and forming a strip line between these dielectric layers to obtain a tri-plate circuit. However, the dielectric constant of the dielectric layers formed using the low sintering temperature material varied with temperature. For example, the dielectric constant temperature coefficient τε at a frequency of 2 GHz was about 130 ppm/°C. It was thus found that when the resonator is used in a high frequency band, for example at a frequency of 0.5GHz or higher, its resonant frequency varies greatly with temperature, making it difficult to use in practical applications. An object of the invention is to provide a high frequency dielectric material which improves the resonant frequency temperature characteristics of a high frequency resonator, and a resonator using such a high frequency dielectric material. The invention provides a high frequency dielectric material containing glass, an oxide with a positive dielectric constant temperature coefficient Tε and an oxide with a negative dielectric constant temperature coefficient Tε, the composition of the glass being 50-70 mole % SiO 2 ; 5-20 mole % Al 2 O 3 ; 0-10 mole % B 2 O 3 ; and 25-45 mole % of one or more alkaline earth oxides. The invention also provides a resonator comprising at least a strip line between dielectric layers, said layers comprising a high frequency dielectric material as set out in the preceding paragraph. The invention further provides a method of producing a resonator comprising the steps of: (i) providing aluminium oxide, titanium oxide, and glass having a composition 50-70 mole % SiO 2 ; 5-20 mole % Al 2 O 3 ; 0-10 mole % B 2 O 3 ; and 25-45 mole % of one or more alkaline earth oxides, the volume ratio of glass to (glass plus aluminium oxide plus titanium oxide) being 50% to 80%, and the volume ratio of titanium oxide to (aluminium oxide plus titanium oxide) being 40% to 60%, and mixing them to obtain a high frequency dielectric material; and (ii) using the high frequency dielectric material to form a laminate of dielectric layers, forming a strip line of electrically conductive material in the laminate, and sintering the result to obtain a resonator, the dielectric constant temperature coefficient of the laminate being -40 to +20 ppm/°C. Further features of the invention are set out in the description of preferred embodiments, which follows, and in the appended claims, to which reference should be made. Japanese patent specification JP-A-3-45556 discloses a low temperature firing composition for a ceramic circuit board which contains 5-35 weight percent CaTiO 3 , 15-45 weight percent Al 2 O 3 , and 40-60 weight percent of a zincborosilicate glass as main components. This has a low volume temperature coefficient. The composition of a particular Example thereof is shown in the table below, in comparison with the material of the present invention. D1, wt. % D1, mol % Present claim 1, mol % SiO 2 35 45.81 50-70 B 2 O 3 15 16.95 0-10 Al 2 O 3 5 3.85 5-20 ZnO 20 19.33 one or more alkaline earth metal oxides PbO 20 7.05 CaO 5 7.01 25-45 In the practice of the present invention, an oxide aggregate material with a positive dielectric constant temperature coefficient Tε, an oxide aggregate material with a negative dielectric constant temperature coefficient Tε, and glass can be mixed in a prescribed mixing ratio to constitute a high frequency dielectric material whose Tε approaches zero. The high frequency dielectric material can be used to obtain a resonator whose resonant frequency temperature coefficient τf approaches zero. As a result, there can be realised a high frequency resonator whose resonant frequency varies little with temperature change even when used in a high frequency band, for example at a frequency of 0.5 GHz or higher. BRIEF EXPLANATION OF THE DRAWINGS Figure 1 is a partial sectional view of a voltage controlled oscillator using the resonator of this invention and Figure 2 is perspective view of a voltage controlled oscillator using the resonator of this invention. BEST MODE FOR CARRYING OUT THE INVENTION The specific constitution of the invention will now be explained. The high-frequency dielectric material of this invention can be sintered at a temperature below around 1,000 °C, for example at a temperature of around 800 - 1,000 °C, and is a substrate material for a resonator to be used at a frequency of 0.5 GHz or higher, for example at a temperature of 0.5 GHz - 2 GHz. It contains glass and oxide aggregates. As the oxide aggregates there is used an oxide aggregate with a positive dielectric constant temperature coefficient τε and an oxide aggregate with a negative τε. As examples of oxide aggregates with a positive τε there can, for example, be mentioned magnesium titanate (MgTiO 3 ), aluminum oxide (Al 2 O 3 ), R 2 Ti 2 O 7 (where R is one or more lanthanoids), Ca 2 Nb 2 O 7 , SrZrO 3 , SrZrO 3 and the like. While these can be used singly or in combinations of two or more, from the point of low reactivity with glass at the time of sintering and other factors, it is preferable to use one or more of MgTiO 3 , Al 2 O 3 , R 2 Ti 2 O 7 and SrZrO 3 , and particularly preferable to use MgTiO 3 or Al 2 O 3 . At 2 GHz and -40 - 125 °C, the τε of these is about 80 - 300 ppm/°C, the τε of MgTiO 3 being about +100 ppm/°C and the τε of Al 2 O 3 being about 120 ppm/°C. Their mean coefficient of thermal expansion α at 40 - 290 °C is about 6 - 12 x 10 -6 deg -1 , particularly about 6 - 10 x 10 -6 deg -1 , the α of MgTiO 3 being about 9.7 x 10 -6 deg -1 and the α of Al 2 O 3 being about 7.2 x 10 -6 deg -1 . As examples of oxide aggregates with a negative τε there can, for example, be mentioned calcium titanate (CaTiO 3 ), strontium titanate (SrTiO 3 ), titanium oxide (TiO 2 ), SnO 2 ·TiO 2 , ZrTiO 4 , Ba 2 Ti 9 O 20 , Sr 2 Nb 2 O 7 , SrSnO 3 and the like. While these can be used singly or in combinations of two or more, from the point of low reactivity with glass at the time of sintering and other factors, it is preferable to use one or more of CaTiO 3 , SrTiO 3 and TiO 2 . At 2 GHz the τε of these is about -30 - -4,000 ppm/°C, the τε of CaTiO 3 being about -1600 ppm/°C the τε of SrTiO 3 being about -3400 ppm/°C and the τε of TiO 2 being about -920 ppm/°C. Their mean coefficient of thermal expansion α at 40 - 290 °C is about 6 - 12 x 10 -6 deg -1 , the α of CaTiO 3 being about 11.2 x 10 -6 deg -1 , the α of CaTiO 3 being about 11.2 x 10 -6 deg -1 , the α of SrTiO 3 being about 9.4 x 10 -6 deg -1 , and the α of TiO 2 being about 7.1 x 10 -6 deg -1 . In the case of these, the composition of the oxide aggregate used can diverge somewhat from the stoichiometric composition and there can be used a mixture including a divergent oxide or a mixture of divergent oxides. It should be mentioned that Japanese Patent Public Disclosure No. Hei 4-82297, a prior application with respect to the present application, proposes reducing the resonant frequency temperature coefficient τf by using of Al 2 O 3 and TiO 2 in combination. Thus, in this application, this combined use is excluded from the claimed high-frequency dielectric material. A special way of using the combination will, however, be proposed. The invention does not particularly limit the mixing ratio of the oxide aggregate with positive τε and the oxide aggregate with negative τε. In suffices to appropriately select the mixing ratio in the light of the τε of the oxide aggregates used, the τε of the glass, the mixing ratio of the aggregates and the glass and the like so as to cause the τε of the high-frequency dielectric material to approach a prescribed value, namely, so as to cause the resonant frequency temperature coefficient τf of the resonator to approach zero. Although the mean grain diameter of the oxide aggregates is not particularly limited, it is preferably about 0.5 - 3 µm. When the mean grain diameter is below this range, sheet formation is difficult, and when it exceeds this range, the material of the resonator comes to lack strength. Since as mentioned earlier, the high-frequency dielectric material of this invention is sintered at 1,000 °C or lower, it is preferable to use a glass with a softening point of around 700 - 900 °C. When the softening point exceeds 900 °C, sintering at a temperature of 1,000 °C or lower becomes difficult, and when it is less than 700 °C, the binder does not remove easily during sheet formation, giving rise to a problem regarding insulating property. Although the composition of the glass used is not particularly limited, the following composition is preferable from the point that it enables a high-strength substrate to be obtained at a sintering temperature not higher than 1,000 °C. SiO 2 : 50 - 70 mol % Al 2 O 3 : 5 - 20 mol % One or more alkaline earth metal oxides : 25 - 45 mol %, B 2 O 3 : 0 - 10 mol %, In this case, as the alkaline earth metal oxides it is preferable to use one or more of SrO, CaO and MgO, and more preferable to use all three of these in combination. Where all three are used, it is preferable for the SrO content to be 15 - 30 mol %, the CaO content to be 1 - 8 mol % and the MgO content to be 1 - 7%. The mean coefficient of thermal expansion α at 40 - 290 °C of a glass of this composition is about 5.5 - 6.5 x 10 -6 deg -1 and the dielectric constant temperature coefficient τε thereof at 2 GHz, -40 - 125 °C is about 150 - 170 ppm/°C. This way of reducing the τε of the dielectric material and the dielectric layers and of lowering the τf of the resonator, when a glass of this type is used, is not disclosed in the aforesaid public disclosure. The softening point and coefficient of thermal expansion α can be measured using a differential thermal expansion meter. τε can be calculated from the measured τf of an actually fabricated dielectric resonator using the following equation. Equation τε = -2 (τ εf + α) In this case, τf is determined by measuring the resonant frequency at 10 °C intervals between -50 °C and +50 °C, using a constant temperature bath. Otherwise, it is possible, for instance, to prepare an approximately 1.4 mm square, 60 mm sample of prescribed shape, determine its dielectric constant by the method of perturbation and calculate τε therefrom. In these cases, the α and τε of the oxide aggregates and glass can be measured using a sintered mass of the aggregate alone or the glass. Although the mean grain diameter of the glass is not particularly limited, a glass with a mean grain diameter of about 1 - 2.5 µm is ordinarily used from the point of formability etc. The glass content is preferably 50 - 80 % by volume, more preferably 65 - 75 % by volume, based on the total of oxide aggregates and glass. An excessively high glass content degrades the sinterability and an excessively low one lowers the dielectric's resistance to bending. When an Al 2 O 3 aggregate ( τε > 0) and a TiO 2 aggregate ( τε < 0) are used together with a glass of the aforesaid composition ( τε > 0), the TiO 2 aggregate content is preferably 40 - 60 % by volume, more preferably 45 - 55 % by volume, based on the total of Al 2 O 3 aggregate and TiO 2 aggregate. When the TiO 2 aggregate content is higher than the aforesaid range, the τε of the high-frequency dielectric material becomes too small (lower than -40 ppm/°C, for example), and when the TiO 2 content is below the aforesaid range, the τε of the high-frequency dielectric material becomes to large (higher than 20 ppm/°C, for example). In a preferred embodiment, MgTiO 3 or Al 2 O 3 aggregate ( τε > 0) is used with CaTiO 3 aggregate ( τε < 0). In this case, the CaTiO 3 content of the oxide aggregates is, for similar reasons, preferably 5 - 20 % by volume. Further, it is preferable to use MgTiO 3 or Al 2 O 3 aggregate ( τε > 0) with SrTiO 3 aggregate ( τε < 0). For similar reasons, it is preferable for SrTiO 3 content of the oxide aggregates to be 2 - 10 % by volume. A combination of MgTiO 3 aggregate ( τε > 0) and TiO 2 aggregate ( τε < 0) is also preferable. The TiO 2 content of the oxide aggregates is, for similar reasons, preferably 10 -20 % by volume. Thus, in this invention, for lowering the τf of the resonator, the τε of the high-frequency dielectric material is brought near a prescribed value by adjusting the content ratio by volume of the τε > 0 oxide aggregate and the τε < oxide aggregate in accordance with the τε and α of the glass, the glass content, the τε and α of the τε > 0 oxide aggregate and the τε and α of the τε < 0 oxide aggregate and the like. In this case, it is preferable to cause the dielectric constant temperature coefficient τε of the high-frequency dielectric material at a frequency of 2 GHz and -40 - 125 °C to become -40 - 20 ppm/°C, more preferably to become -25 - +5 ppm/°C, and ideally to cause τε to become such that, in accordance with the equation τε = -2 (τ f + α) , τf becomes zero. Where the α of the dielectric is about 6.0 x 10 -6 deg -1 , for example, a τε of about -12 ppm/°C is preferable. It should be noted that it is possible to obtain a τf of -15 - +15 ppm/°C, particularly of -10 - +10 ppm/°C, and further of -5 - +5 ppm/°C. Further, the mean coefficient of thermal expansion α at 40 - 290 °C of the dielectric layers or substrate obtained by sintering the high-frequency dielectric material of the invention is about 6.3 - 6.7 x 10 -6 deg -1 and the relative dielectric constant thereof is about 8 - 20, particularly 8 - 12, and further 10 - 11. Prior to being sintered, the high-frequency dielectric material is made into a slurry by addition of a vehicle. As examples of the vehicle there can be listed binders such as ethyl cellulose, polyvinyl butyral, methacrylic resin and butyl methacrylate, solvents such as terpineol, Butyl Carbitol, Butyl Carbitol Acetate, acetate, toluene, alcohol and xylene, and various dispersants, activators, plasticizers etc. Desired ones of these can be appropriately selected according to purpose. The amount of the vehicle added is preferably about 65 - 85 % by weight based on the total amount of oxide aggregates and glass as 100 parts by weight. Next, a voltage controlled oscillator (VCO) having a resonator consisting of dielectric layers formed using the high-frequency dielectric material of the present invention will be explained with reference to a preferred example shown in Figure 1. (Figure 1 is a partial sectional view of the voltage controlled oscillator.) The voltage controlled oscillator 1 using the resonator according to this invention is used at a frequency of 0.5 GHz or higher, particularly 0.5 - 2 GHz. As illustrated, it comprises a laminate 2 formed by integrally laminating dielectric layers 21, 23, 25 and 27 and has a strip line 3 at least between the dielectric layers 23 and 25 of the laminate 2. The shape, dimensions, number etc. of the strip line are not particularly specified and can be appropriately decided according to purpose or the like. If required, an internal conductor 7 is further formed between the dielectric layers 23 and 25. In such case, the internal conductor 7 is formed in the pattern of, for example, a coil conductor or a capacitor terminal, or in any of various other patterns as desired in the light of the purpose or application. Further, ground planes 4 are formed between the dielectric layers 23 and 21 and on the dielectric layer 27. At this time, the strip line 3 is positioned between the ground planes 4 , 4. External conductors 6 are formed on the laminate 2. The external conductors 6 are electrically connected with the strip line 3, the ground plane 4 and the internal conductor 7 by conductors in respective through-holes 5. As the strip line 3, ground planes 4, internal conductor 7 and conductors in the through-holes 5, it is preferable, from the point of placing priority on good conductivity and the like, to use conductors consisting predominantly of Ag or Cu, particularly of Ag in cases where the sintering is to be conducted in an oxygen-containing atmosphere such as air. As the external conductors 6, it is preferable, from the point anti-migration property, solder eatability, solder wettability and the like, to use a conductor consisting predominantly of Ag or Cu and particularly a conductor containing Ag together with Pd and/or Pt in cases where the sintering is to be conducted in an oxygen-containing atmosphere such as air. Such a resonator is fabricated as follows, for example. First, an internal conductor paste and an external conductor paste are separately prepared. These pastes contain a conductor powder, glass frit at about 1 - 5 % by weight based on the conductor powder, and a vehicle. Next, green sheets for constituting the dielectric layers are prepared. Specifically, a slurry of the aforementioned high-frequency dielectric material according to the invention is used to fabricate a prescribed number of green sheets by, for example, the doctor blade method. Next, the through-holes 5 are formed in the green sheets with a punching machine or a die press, and then the internal conductor paste is printed onto the respective green sheets by, for example, the screen printing method, so as to form the internal conductor 7, strip line 3 and ground planes 4 in prescribed patterns, and to fill the through-holes 5. Following this, the green sheets are stacked and pressed into a green sheet laminate by a hot press (at about 40 - 120 °C, 50 - 1,000 Kgf/cm 2 ). If necessary, the resulting green sheet laminate is subjected to binder removal and formation of cutting notches. The green sheet laminate is then sintered into an integral body, ordinarily in air, at a temperature not higher than 1,000 °C, particularly about 800 - 1,000 °C, for about 10 minutes, thereby obtaining a resonator having the strip line 3 between the dielectric layers 23 and 25. In addition, the external conductors paste is printed by the screen printing technique or the like and sintered to form the external conductors 6. The external conductors 6 are preferably sintered simultaneously with the dielectric layers 21, 23, 25 and 27. Then prescribed surface-mounted components 8 are soldered to the external conductors 6 and, if required, an insulating cladding layer is formed. The voltage controlled oscillator (VCO) 1 shown in Figure 2 is thus obtained. The resonator described above is only one example of the invention. It is not subject to any particular restrictions and can be of various forms insofar as it has a TEM line or other such strip line between dielectric layers and can be used at a frequency of not less than 0.5GHz. The resonant frequency of the resonator is usually in the range of 0.5-2 GHz. Specifically, the resonator according to the invention can be applied as a filter such as a high-pass filter, low-pass filter, band-pass filter or band-elimination filter or the like or as a wave-separation filter obtained by combining the foregoing filters, deplexer, voltage controlled resonator or the like. INDUSTRIAL APPLICABILITY The resonant frequency of the resonator according to this invention varies little with temperature change. EXAMPLE Concrete examples of the invention will now be shown, and the invention explained in further detail. Example no. 1 A high-frequency dielectric material No. 1 according to the invention was prepared to comprise glass powder of a mean particle diameter of 1.9 µm : 70 % by volume; Al 2 O 3 powder of a mean particle diameter of 1.5 µm : 15 % by volume; and TiO 2 powder of a mean particle diameter of 1.0 µm : 15 % by volume. 73 parts by weight of a vehicle was added to 100 parts by weight of this high-frequency dielectric material and the two were mixed with a ball mill to obtain a slurry. In the vehicle, an acrylic resin was used as the binder, ethyl alcohol and toluene as the solvent and phthalate as the plasticizer. The composition of the glass powder was SiO 2 : 62 mol %, Al 2 O 3 : 8 mol %; B 2 O 3 : 3 mol %; SrO : 20 mol %; CaO : 4 mol %; and MgO: 3 mol %. Its softening point was 815 °C. When Al 2 O 3 , TiO 2 and glass were independently sintered and tested for α and for relative dielectric constant ε r and τε at 2 GHz, Al 2 O 3 was found to have an α of 7.2 x 10 -6 deg -1 , a τε of +120 ppm/°C and a ε r of 9.8, TiO 2 to have an α of 7.1 x 10 -6 deg -1 , a τε of -920 ppm/°C and a ε r of 104, and the glass to have an α of 6.0 x 10 -6 deg -1 , a τε of +160 ppm/°C and a ε r of 6.5 A paste of this high-frequency dielectric material was used to prepare 0.25 mm thick green sheets by the doctor blade method. Next, the respective green sheets were printed with an Ag internal conductor paste by the screen printing method to form a strip line and ground planes, whereafter they were laminated with a hot press to obtain a green sheet laminate. The laminate was degreased and then subjected to single-stage sintering in air at a temperature of 900 °C for 10 minutes. Following this, ground plane Ag paste was printed on by the screen printing method and the result was sintered in air at a temperature of 850 °C for 10 minutes to obtain a resonator Sample No. 1 with a resonant frequency of about 2 GHz. The Sample No. 1 measured 10 mm x 10 mm x 2 mm. For comparison, a high-frequency dielectric material No. 2 was obtained in the same way except that the oxide aggregate mixture of Al 2 O 3 : 15 % by volume and TiO 2 : 15 % by volume in the high-frequency dielectric material No. 1 was replaced with Al 2 O 3 : 30 % by volume. Then a resonator Sample No. 2 with a resonant frequency of about 2 GHz was fabricated in the same way as the resonator Sample No. 1 except that the high-frequency dielectric material No. 2 was used. The Sample No. 2 measured 10 mm x 10 mm x 2 mm. Each sample obtained was measured for its resonant frequency temperature coefficient τf at -40 - 125 °C, with the results shown in Table 1. Further, the coefficients of thermal expansion α of the dielectric layers obtained by sintering the respective high-frequency dielectric materials, and the dielectric constant temperature coefficients τε were calculated from the equation set out below. The values of τε and the mean coefficients of thermal expansion α at -40 - 125 °C were as shown in Table 1. Equation : τε = -2 ( τf + α) In addition, the relative dielectric constant ε r of each high-frequency dielectric material at a frequency of 2 GHz and 25 °C was measured by the method of perturbation, with the results shown in Table 1. Sample No. High-frequency dielectric material No. Oxide aggregates ε r α (deg -1 ) τε (ppm/°C) τf (ppm/°C) 1 (Invention) 1 Al 2 O 3 /TiO 2 10.6 6.5 -12 -0.5 2 (Comparison) 2 Al 2 O 3 7.4 6.4 129.8 -58.6 The effect of the invention is obvious from the results shown in Table 1. Example no. 2 In addition to the Al 2 O 3 , TiO 2 and glass of the first example, CaTiO 3 of a mean grain diameter of 2.0 µm ( τε = -1,600 ppm/°C, α = 11.2 x 10 -6 deg -1 ), SrTiO 3 of a mean grain diameter of 2.0 µm ( τε = -3,400 ppm/°C, α = 9.4 x 10 -6 deg -1 ) and MgTiO 3 of a mean grain diameter of 2.0 µm ( τε = +100 ppm/°C, α = 9.7 x 10 -6 deg -1 ) were used, in the mixing ratios shown in Table 2, for obtaining resonators in the same way as in the first example. The results are shown in Table 2. Sample No. Glass (Vol %) τε < 0 (Vol %) τε > 0 (Vol %) ε r τf (ppm/°C) 2 (Comparison) 70.0 0 30.0 7.4 -58.6 11 (Invention) 70.0 13.5TiO 2 16.5Al 2 O 3 10.9 -7.8 1 (Invention) 70.0 15.0TiO 2 15.0Al 2 O 3 10.6 -0.5 12 (Invention) 70.0 16.5TiO 2 13.5Al 2 O 3 10.1 7.3 13 (Invention) 60.0 16.0TiO 2 24.5Al 2 O 3 11.2 7.8 14 (comparison) 100.0 0 0 6.5 -85.0 21 (Invention) 70.0 10.0CaTiO 3 20.0Al 2 O 3 9.7 9.5 22 (Invention) 60.0 8.0CaTiO 3 32.0Al 2 O 3 9.8 -4.6 31 (Invention) 70.0 9.0CaTiO 3 21.0MgTiO 3 10.4 3.1 32 (Invention) 60.0 8.0CaTiO 3 32.0MgTiO 3 11.5 -1.4 41 (Invention) 70.0 4.5SrTiO 3 25.5Al 2 O 3 8.5 1.6 42 (Invention) 60.0 4.0SrTiO 3 36.0Al 2 O 3 8.8 -4.0 51 (Invention) 70.0 4.0SrTiO 3 26.0MgTiO 3 9.7 -4.4 52 (Invention) 60.0 4.0SrTiO 3 36.0MgTiO 3 10.6 -0.4 61 (Invention) 70.0 14.5TiO 2 15.5MgTiO 3 11.3 -1.2 62 (Invention) 60.0 14.0TiO 2 26.0MgTiO 3 12.3 0.3 The effect of the invention is obvious from the results shown in Table 2.

Claims: A high frequency dielectric material containing glass, an oxide with a positive dielectric constant temperature coefficient τε and an oxide with a negative dielectric constant temperature coefficient τε, the composition of the glass being 50-70 mole % SiO 2 ; 5-20 mole % Al 2 O 3 ; 0-10 mole % B 2 O 3 ; and 25-45 mole % of one or more alkaline earth oxides. A high frequency dielectric material according to claim 1 wherein the oxide with a positive dielectric constant temperature coefficient τε is one or both of aluminium oxide and magnesium titanate, and the oxide with a negative dielectric constant temperature coefficient τε is one or more of calcium titanate, strontium titanate and titanium oxide. A high frequency dielectric material according to claim 2 which contains 5-20 volume percent of calcium titanate as the oxide with a negative dielectric constant temperature coefficient τε. A high frequency dielectric material according to claim 2 which contains 2-10 volume percent of strontium titanate as the oxide with a negative dielectric constant temperature coefficient τε. A high frequency dielectric material according to either one of claims 3 and 4 containing magnesium titanate or aluminium oxide as the oxide with a positive dielectric constant temperature coefficient τε. A high frequency dielectric material according to claim 2 which contains 10-20 volume percent of titanium oxide as the oxide with a negative dielectric constant temperature coefficient τε, and magnesium titanate as the oxide with a positive dielectric constant temperature coefficient τε. A high frequency dielectric material according to any one of claims 1 to 6, wherein the dielectric constant temperature coefficient of the glass at 2GHz, -40 to 125°C, is 150 to 170 ppm/°C, and the mean coefficient of thermal expansion thereof at 40 to 290°C is 5.5 to 6.5 x 10 -6 deg -1 . A high frequency dielectric material according to any one of claims 1 to 7, wherein the dielectric constant temperature coefficient τε thereof is -40 to +20 ppm/°C. A high frequency dielectric material according to any one of claims 1 to 8, wherein the glass content is 50 to 80 volume percent, based on the total of oxides and glass, and the softening point of the glass is 700 to 900°C. A resonator comprising at least a strip line between dielectric layers, said layers comprising a high frequency dielectric material according to any preceding claim. A method of producing a resonator comprising the steps of: (i) providing aluminium oxide, titanium oxide, and glass having a composition 50-70 mole % SiO 2 ; 5-20 mole % Al 2 O 3 ; 0-10 mole % B 2 O 3 ; and 25-45 mole % of one or more alkaline earth oxides, the volume ratio of glass to (glass plus aluminium oxide plus titanium oxide) being 50% to 80%, and the volume ratio of titanium oxide to (aluminium oxide plus titanium oxide) being 40% to 60%, and mixing them to obtain a high frequency dielectric material; and (ii) using the high frequency dielectric material to form a laminate of dielectric layers, forming a strip line of electrically conductive material in the laminate, and sintering the result to obtain a resonator, the dielectric constant temperature coefficient of the laminate being -40 to +20 ppm/°C. A method according to claim 11 wherein the glass has a dielectric constant temperature coefficient τε at 2GHz, -40 to 125°C, of 150 to 170 ppm/°C, and a mean coefficient of thermal expansion of 5.5 to 6.5 x 10 -6 deg -1 at 40 to 290°C. A method according to claim 11 or claim 12 wherein said glass, aluminium oxide and titanium oxide are mixed together in the presence of a vehicle to form a slurry.

Inventors: KAWAMURA KEIZOU, KOBAYASHI MAKOTO, KAWAMURA, KEIZOU, KOBAYASHI, MAKOTO
Applicants: TDK CORP, TDK CORPORATION
Application year: 1992
Main classification: C03C8
IPC codes: H05K1, C03C8, C03C4, H01B3