Composite integrated circuit device

Abstract: A composite integrated circuit device includes a semiconductor element chip (1), a positioning guide (3) formed on the semiconductor element chip (1), and an electronic element (4) set in a preset position on the semiconductor element chip in a self-alignment manner by means of the positioning guide (3) and mounted thereon.

Description: This invention relates to a composite integrated circuit device constructed by forming and integrating various types of electronic elements on a semiconductor chip and effectively used as a power integrated circuit. A monolithic semiconductor integrated circuit is formed by integrating transistors, resistors, diodes and the like in a 2-dimensional fashion on a silicon substrate. However, when such an integrated circuit is used as a power conversion circuit such as an inverter, it is difficult to make an output element with large current capacity and high withstand voltage and form the output element together with another element on one chip. Further, it is impossible to integrally form capacitors and inductances which are generally required for the power conversion circuit on a silicon chip. For this reason, in the prior art, a hybrid integrated circuit has been used as this type of power integrated circuit. However, since the hybrid integrated circuit is constructed by mounting various types of semiconductor element chips, resistors, capacitors and the like on a print circuit board or the like, problems that the occupied area increases, the wiring capacitance increases, the assembling process becomes complicated and the like occur. Further, there occurs a problem associated with radiation of a large amount of heat caused by high integration. As described above, when the power integrated circuit is constructed by using the conventional integrated circuit technology, it is difficult to enhance the current capacity and withstand voltage of the output element in a monolithic integrated circuit and therefore a problem that the occupied area and the wiring capacitance may increase will occur in a hybrid integrated circuit, and in either case, a serious problem associated with head radiation occurs. EP-A2-0 050 988 discloses a highly-doped semiconductor region having a conductivity type opposite to that of the source region in contact with the source region to cause tunnel injection. The potential level of the highly-doped region is varied by static induction effect. An insulated gate field effect transistor having a majority carrier diode and a minority carrier diode, formed in the drain region, the minority diode modulating the resistance of the drain and the majority diode decreasing sensitivity to latch up is disclosed by US 4 694 313. An insulated gate transistor formed of a lateral structure having an active layer which has a predetermined thickness is known from Patent Abstracts of Japan, vol. 7, no. 236 (E-205), 20 October 1983. A MIS semiconductor device comprising a junction diode isolated from the drain by a semiconductor well area is described by Patent Abstracts of Japan, vol. 4, no. 075 (E-013), 31 May 1980. An object of this invention is to provide a composite integrated circuit device capable of realising an output element with a large current capacity and high withstand voltage, reducing the occupied area and wiring capacitance and improving the heat radiation property. According to an aspect of the present invention, there is provided an insulated gate type device according to claim 1 and comprising: an active layer of a first conductivity type; a first base region of a second conductivity type formed in said active layer; a second base region of a first conductivity type formed in said active layer; a source layer of the first conductivity type formed in said first base region of the second conductivity type; and a drain layer of the second conductivity type formed in said second region of the first conductivity type; characterised in that: said active layer of a first conductivity type is insulatively disposed over a semiconductor substrate; a gate electrode is insulatively disposed over an area between said source layer of the first conductivity type formed in said first region base of the second conductivity type and said active layer; and a source electrode is formed in contact with said first base region of the second conductivity type and said source layer of the first conductivity type, said first and second base regions being formed with a depth to reach the bottom of said active layer. According to this invention, when a power conversion circuit or the like is formed, a large current capacity and high withstand voltage of an output element can be easily attained by integrating the output element and a gate circuit and the like for controlling the output element on different chips in a 3-dimensional fashion. Further, unlike a normal hybrid integrated circuit, an increase in the occupied area and an increase in the wiring capacitance can be suppressed. The reliability of the 3-dimensional integrated circuit can be enhanced by previously forming a positioning guide on the IC chip in order to dispose elements in a 3-dimensional fashion. Further, since the composite integrated circuit device can be formed with a small size, heat radiation can be easily attained by mounting a radiation fin on the circuit device, for example. Further, if a composite integrated circuit device constructed by integrally forming a photocoupler in a 3-dimensional fashion on an integrated circuit chip is used, transfer of signals between upper and lower sides of the circuit device can be effected without using complicated wirings and without causing useless electrical coupling. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: Fig. 1A is a cross sectional view of a composite integrated circuit device according to a first embodiment; Fig. 1B is a plan view of the composite integrated circuit device shown in Fig. 1A ; Fig. 2A is a cross sectional view of a composite integrated circuit device according to a second embodiment; Fig. 2B is a plan view of the composite integrated circuit device shown in Fig. 2A ; Fig. 3A is a cross sectional view of a composite integrated circuit device according to a third embodiment; Fig. 3B is a plan view of the composite integrated circuit device shown in Fig. 3A ; Fig. 4A is a cross sectional view of a composite integrated circuit device according to a fourth embodiment; Fig. 4B is a plan view of the composite integrated circuit device shown in Fig. 4A ; Fig. 5 is a view showing the layout of a whole IGBT of the embodiment of Fig. 2; Fig. 6 is a plan view of a circuit device constructed by combining two IGBTs having the same construction as the IGBT shown in Fig. 5 ; According to a first embodiment shown in Figs. 1A and 1B, an IGBT having a thin active layer is formed on a semiconductor element chip 1. That is, an active layer 101 of high resistance formed of n-type silicon with an extremely small thickness of approx. 1 µm is formed over the semiconductor element chip 1 with a silicon dioxide film 100 having a thickness of approx. 1 to 5 µm disposed therebetween and a p-type base layer 201 and an n-type base layer 202 are formed with a preset distance in the active layer 101. The p-type base layer 201 and the n-type base layer 202 are formed in the active layer 101 with a depth to reach the silicon dioxide film 100 formed on the bottom of the active layer. An n-type source layer 203 is formed in the p-type base layer 201 and a p-type drain layer 204 is formed in the n-type base layer 202. A gate electrode 206 is formed over an area of the p-type base layer 201 which lies between the n-type source layer 203 and the active layer 101 with a gate insulation film 205 disposed therebetween. A source electrode 207 is formed in contact with both of the p-type base layer 201 and the n-type source layer 203, and a drain electrode 208 is formed on the p-type drain layer 204. In this embodiment, since the p-type base layer 201 and the n-type base layer 202 are formed in the active layer 101 with a depth to reach the dioxide layer 100, an application voltage in a vertical direction may be shared by the dioxide film 100 when a reverse bias voltage is applied. Therefore, even when the thin active layer 101 is used, an IGBT having a high withstand voltage characteristic can be obtained. Figs. 2A and 2B show a second embodiment obtained by modifying the embodiment of Figs. 1A and 1B. In the embodiment of Figs. 1A and 1B, since the active layer 101 is a thin film, the width of the p-type base layer under the n-type source layer 203 is reduced. As a result, the element tends to be subjected to a latch-up phenomenon. In this embodiment, an n-type source layer 203 is formed of a plurality of divided source regions and therefore the resistance of the p-type base layer 201 in the lateral direction can be prevented from being excessively large. That is, according to this embodiment, an active layer 101 of high resistance formed of n-type silicon with an extremely small thickness of approx. 1 µm (1 µm = 10 -6 m) is formed over the semiconductor element chip 1 with a silicon dioxide film 100 having a thickness of approx. 1 to 5 µm disposed therebetween and a p-type base layer 201 and an n-type base layer 202 are formed with a preset distance in the active layer 101. The p-type base layer 201 and the n-type base layer 202 are formed in the active layer 101 with a depth to reach the silicon dioxide film 100 formed on the bottom of the active layer. A plurality of n-type source regions 203 are separately formed in the p-type base layer 201 and a p-type drain layer 204 is formed in the n-type base layer 202. A gate electrode 206 is formed over an area of the p-type base layer 201 which lies between the n-type source layer 203 and the active layer 101 with a gate insulation film 205 disposed therebetween. A source electrode 207 is formed in contact with both of the p-type base layer 201 and the n-type source layer 203, and a drain electrode 208 is formed on the p-type drain layer 204. According to this embodiment, since the n-type source layer 203 is formed of a plurality of divided source regions, an IGBT which is difficult to be subjected to a latch-up phenomenon can be obtained. Figs. 3A and 3B show a third embodiment obtained by modifying the embodiment of Figs. 21A and 21B. In this embodiment, the thickness of an active layer 101 is made smaller than that of the active layer in the eighteenth embodiment and an n-type source layer 203 and a p-type drain layer 204 are respectively formed in a p-type base layer 201 and an n-type base layer 202 to reach the bottom portions of the p-type base layer 201 and the n-type base layer 202 or a dioxide film 100. If the n-type source layer 203 is formed of a plurality of divided regions in the p-type base layer 201 as shown in the drawing, a portion of the p-type base layer 201 which lies below the gate electrode 206 may be short-circuited to the source electrode 207 so that the circuit device can be correctly operated. Figs. 4A and 4B show a fourth embodiment obtained by modifying the embodiment of Figs. 3A and 3B. In this embodiment, a plurality of n-type layers 211 are separately disposed in a p-type drain layer 204. Each of the n-type layers 211 is formed in the p-type drain layer 204 to reach the bottom of the p-type base layer 204 or an insulation film 100. According to this embodiment, injection of holes from the p-type drain layer 204 is suppressed to enhance the operation speed of the circuit element. Fig. 5 shows a layout pattern of the whole portion of the IGBT explained with reference to Fig. 2A, 3A or the like. The IGBT is surrounded by a silicon dioxide film 300 and therefore the element has a complete dielectric isolation structure. The pattern is made wide on the source side. As shown in the drawing, it is preferable to set the inclination angle of the side surface at approx. 60°. With this inclined structure, a depletion layer formed near an n-type base layer 202 as shown by a broken line becomes short in a portion near the oxide film 300. Therefore, an electric field at the end face is controlled, thereby making it possible to attain a high withstand voltage characteristic. Fig. 6 shows the construction of a circuit device obtained by combining two IGBTs having the same construction as that of the IGBT shown in Fig. 5. That is, first and second IGBTs are arranged in opposite directions and integrated with the side surfaces thereof set together.

Claims: An insulated gate type device comprising: an active layer (101) of a first conductivity type; a first base region (201) of a second conductivity type formed in said active layer (101); a second base region (202) of the first conductivity type formed in said active layer (101); a source layer (203) of the first conductivity type formed in said first base region (201) of the second conductivity type; and a drain layer (204) of the second conductivity type formed in said second base region (202) of the first conductivity type; characterised in that: said active layer (101) of the first conductivity type is insulatively disposed over a semiconductor substrate; a gate electrode (206) is insulatively disposed over an area between said source layer (203) of the first conductivity type formed in said first base region (201) of the second conductivity type and said active layer (101); and a source electrode (207) is formed in contact with said first base region (201) of the second conductivity type and said source layer (203) of the first conductivity type, said first and second base regions (201, 202) being formed with a depth to reach the bottom of said active layer (101). An insulated gate type device according to claim 1, further characterised in that said source layer (203) of the first conductivity type includes a plurality of separated source regions. An insulated gate type device according to claim 2, further characterised in that said active layer (101) is of an n-type active layer having a high resistance, said first base region (201) being formed of a p-type semiconductive layer, said second base region (202) being formed of an n-type semiconductive layer, and said source and drain layers being formed with a depth to reach the bottom of said active layer (101). An insulated gate type device according to claim 3, further characterised in that said drain layer (204) includes an n-type semiconductive layer (211) therein, said n-type semiconductive layer (211) includes a plurality of n-type separated regions. An insulated gate type device according to any one of claims 2, 3 or 4, further characterised in that said active layer (101) is surrounded by a dielectric isolation region (300).

Inventors: NAKAGAWA AKIO, OGURA TSUNEO, NAKAGAWA, AKIO, OGURA, TSUNEO, NAKAGAWA, AKIO, C/O INTELLECTUAL PROPERTY DIVISION, OGURA, TSUNEO, C/O INTELLECTUAL PROPERTY DIVISION
Applicants: TOKYO SHIBAURA ELECTRIC CO, TOSHIBA KK, KABUSHIKI KAISHA TOSHIBA
Application year: 1991
Main classification: H01L25
IPC codes: H01L27, H01L29, H01L25, H01L23, H01L31, H01L21