Au-Sn transient liquid bonding in high performance laminates

Abstract: A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

Description: The present invention relates to high density printed circuit board (PCB) composites and to methods of making electrical interconnections between laminated layers of the composite. The performance of high speed computers increasingly demands higher performance packaging and interconnection methods, from the printed circuit board (PCB) level on up. As semiconductor devices are developed to be operated with higher frequencies and shorter rise-times, the properties of the PCB substrates become more important. In order to build working high density laminated PCBs, it is necessary to employ high performance polymers as the dielectric material. The high performance polymers are those which have very low dielectric constants, typically below 3 and even below 2, in order to permit higher line densities without causing shorting, electromagnetic inductance or crosstalk between conductors. They also require lamination temperatures higher than those required by higher dielectric polymers, such as epoxy, which requires a laminating temperature of about or below 200 °C. Among these high performance polymers are fluorocarbon polymers, such as PTFE (polytetrafluorethylene), PFA (PTFE and perfluoroalkoxy vinyl ether copolymer), polyimides, fluorinated polyimides, fluorinated cyanate esters, polysiloxane imioles, and polyphenyl quinoxilines. In order to electrically interconnect levels of circuitry in the Z-direction, i.e. in the direction normal to the plane, metallized through holes and vias are conventionally formed therebetween. The term via is used when the opening terminates internally in a laminate layer, such as at a ground plane; the term through hole is used when the penetration continues to the opposite surface. For present purposes the term through hole will be used to encompass both through holes and vias. As the required wiring density of higher performance printed circuit boards increases, the number of signal layers in the structure increases. Consequently, the number of interconnections between signal layers also significantly increases. The number of interconnections between signal layers is too high to be accommodated by conventional plated through hole (PTH) techniques. The limitation is due to the difficulties in drilling smaller holes, i.e. smaller than 152.4 µm (6 mil), and plating in high aspect ratio holes (ratio of length to diameter). It is clear therefore that the complexity of multilayer structures required for both first and second level high density packages cannot be achieved by conventional PCB or MLC (multilevel ceramic) technologies due to the process limitations of the conventional methods. A new method of interconnection other than soldered, plated through holes or screened vias is required. Development of a parallel process, i.e. simultaneous lamination and interconnection, enables the fabrication of the multilayer structures by combining subunits or building blocks built, tested and repaired separately. The possibility of testing and repair of the subunits will greatly enhance overall product yield. Parallel processing is also very attractive in terms of shortened process time, and consequent overall cost savings. While the concept of parallel processing typically either by parallel plates or by vacuum lamination is very attractive, it demands a new method of achieving electrical interconnections, often having high current carrying capabilities. One way of achieving interconnection is to prepare an eyelet shaped conductive pad called a land. As used in the practice of the present invention, the land provides a place where electrical contact can be made to a corresponding land at the surface of a second dielectric layer to which the first is to be laminated. In order to electrically connect two pads, conventional soldering may be an acceptable means in some situations. For example, a solder can be applied to the pads by an appropriate method, such as screening or plating, and reflowed during lamination. When the pads are connected to metallized holes, it is also possible to fill the holes with a solder. An optimized methodof this kind for forming electrical interconnections between laminate layers for a printed circuit board is disclosed in US-Patent 4 788 766. In this method solder material is applied to lands on the laminate layers. The solder material is preferably indium or a eutectic tin-lead alloy. In the lamination process the solder material on lands that face each other form interconnections by means of solid-state diffusion or by fusion in the molten state respectively. Adjacent laminate layers are separated by a dielectric bonding layer having apertures. However, in high density packaging, with advanced dielectric materials, the use of such a solder is inadequate for making the land-to-land electrical contact. To give an example of the dimensions involved, in one high density package, Cu line thickness is 8 microns. It is 250 microns between lands. There are either one or two lines between lands, and the linewidth is either 25 microns or 50 microns. The closeness of adjacent lands and their small dimensions present the potential for solder bridging, shorting between the pads caused by the melted solder squeezed out during lamination. The problem is exacerbated by the fact that the laminated layers can be built up successively to fifty or more layers, with repeated soldering followed by repeated lamination under heat and pressure. Each time the lamination would occur, solder would reflow, and the opportunity for bridging would be presented anew. In FR-A-1 480 145 a method for connecting objects consisting of or being metallized with a first metal. Prior to the connection on one of the objects to be connected a layer or layers of a second metal or of an alloy having a substantially lower melting point than the first metal is deposited on one of the objects. During the connection at a temperature lying between the melting points of the metals the two metals or the first metal and the alloy form an alloy having a melting point being higher than the formation temperature of the alloy. Transient liquid bonding (TLB) is a diffusion bonding technique which involves depositing on different conductive surfaces metals which together are capable of forming a eutectic melt. The surfaces to be bonded must be comprised of a highly conductive material such as copper, and are coated with the metals, brought into physical contact with one another and are heated above the eutectic temperature to form a melt. Solidification of this thin, liquid region bonds the metallic surfaces together. Recent work, such as described in copending EP-A-1-0 365 807, "Bonding of Metallic Surfaces", has applied the techniques of transient liquid bonding to connect the copper terminal pins of surface mounted semiconductor devices to copper lands on a second level electronic package such as a printed circuit board or card. Since the TLB process does not require the use of flux and uses minimal amounts of solder, bridging is reduced as compared to conventional soldering. A solder which, having formed a eutectic melt at a low temperature, would solidify to form an alloy which would not then melt until a temperature is reached that is higher than temperatures required in subsequent device processing, without forming brittle intermetallics in the process, would provide many advantages over known techniques. If the soldering could be performed simultaneously with the lamination of the multilayer high performance board, the joining would be a more efficient and reliable process than heretofore. The present invention as claimed is concerned with interconnecting laminated layers within the high density PCB. In particular, the present invention is concerned with bonding the metallic lands at a first dielectric laminate surface with corresponding lands on a surface of a second dielectric laminate surface, while at the same time the first surface of the dielectric is bonding together the two dielectric laminates. This procedure is repeated until the number of laminates desired is cojoined to form a composite, or preferably all the layers or subunits are stacked and joined at once. In either case, each time the process is repeated, the underlying laminates are exposed to the temperature and pressure cycles required by the particular polymer of the laminate to effect a secure composite. High performance polymers may call for a lamination temperature of about 390 °C, as in the case of PTFE. A temperature of 390 °C is above the melting point of conventional PbSn solder, the melting point of which is about in the range of 183-320 °C. A SnPb solder will be subject to remelt each time a lamination is performed. Not only does the thermal cycling present a repeated risk that the remelted solder will bridge, but the risk is also presented that with each cycle, more and more copper from the land will be dissolved into the solder to form brittle intermetallics, degenerating the integrity of the connection. Of course, the risk of bridging is particularly acute at the close dimensions of the high density PCB. A method for bonding first and second highly conductive contact surfaces having the features in the preamble of claim 1 is disclosed in the article "Controlled Composition Gang Bond Chip Interconnection" by W. C. Ward, published in the IBM Technical Disclosure Bulletin, Vol. 23, No. 2, July 1980, page 540, which teaches a method to reduce or eliminate the electromigration potential of gold-tin connected packages by confining the tin to the bond interface between two gold layers. It is therefore an object of this invention to provide a method for electrically interconnecting laminate layers at designated lands of a multilayer high performance laminated composite. It is a further object of the invention to provide a method for electrically interconnecting laminate layers at designated lands of a multilayer high performance PCB reliably, despite subsequent lamination procedures. It is a further object of the invention to provide a method of simultaneously electrically interconnecting laminate layers at designated lands of a multilayer high performance PCB and laminating together at least two levels of high performance dielectric layers. It is another object of the invention to provide a high density printed circuit board containing high performance polymer layers wherein the risk of bridging minimized and wherein the interconnections have sufficient ductility and strength required to maintain joint integrity. These and other objects of the present invention are achieved by a method as disclosed in claim 1 and by a high density printed circuit board as disclosed in claim 12. The inventive method uses a transient liquid bonding technique wherein one metal, such as gold, is deposited on a land and another metal, such as tin, is deposited on the corresponding land with which it is to be connected. The choice of the metals is determined by the following requirement: When the metal coated lands are contacted and first heated to a melting temperature that is both at least slightly above that which is necessary to form a binary eutectic solder composition and then is heated up to the processing temperature of the particular dielectric polymer system involved, the solder alloy composition resulting upon solidification will remain solid throughout subsequent dielectric processing temperatures. The solid solder alloy will also, of course, remain solid throughout the composite in the event a semiconductor chip device is solder mounted thereon. The metallurgical joints connecting the individual polymer layers of the composite should not remelt during chip joining which, in the typical controlled collapse chip connection (C4) process, takes place at a peak temperature of about 360 °C. Other objects and advantages of the present invention will be apparent from the following descriptions of preferred embodiments and the drawings, in which: Figure 1 shows the known Au-Sn phase diagram; Figure 2 shows a Differential Scanning Calorimetric (DSC) thermogram in which is apparent three thermograms, corresponding to three stages in the AuSn state as the temperature is increased at a constant rate; Figure 3 shows a DSC at a slower heating rate than seen in Figure 2; Figure 4 shows the percentage of the Au-20wt%Sn eutectic reacted v. time at four different temperatures; Figure 5a shows schematically the metal coated lands before and 5b initially after bonding. 5c shows the lands after completion of the lamination; Figure 6 shows AuSn eutectic partially reacted with Au; Figure 7 is an Scanning Electron Micrograph (SEM) of a group A sample bonded to a coating of 3 microns of Au on a Cu foil coupon; (Group A samples were sequentially plated with 5 microns of gold and 2 microns of tin - nominal.) Figure 8 is an SEM of a group B sample bonded to a coating of 3 microns of Au on a Cu foil coupon; (Group B samples were sequentially plated with 3 microns of Au and 1.3 microns of Sn -nominal.) Figure 9 is a Backscattered Electron (BSE) image of the Figure 8 sample; Figure 10 is an Electron Dispersion Spectrum (EDS) of the center of the Figure 9 image. In the preparation of high performance circuit boards, discrete circuitized low dielectric polymer layers made, for example, of PTFE, optionally including also reinforcement and filler material, are laminated at about 390 °C and about 3,45 MPa (500 psi). In the present invention the electrical interconnections between the circuitized layers are achieved by joining the lands of the metallized through holes in the separate dielectric layers simultaneously during lamination under the extreme laminating conditions required by the high performance polymer. To accomplish the joining, a metallurgical system must be chosen whose initial melting point is below the laminating temperature, but increases during exposure to the temperatures of the lamination so that the final melting point is significantly higher than the peak laminating temperature. The laminating temperature is determined by either the glass transition temperature or by the melting point of the particular polymer. This joining was achieved by reacting two metals with differing melting points. In such a process, the bonding temperature is above the melting point of the lower melting point metal and the eutectic, the reaction of forming a eutectic proceeding through wetting the lands and subsequent interdiffusion of the two metals to form a homogenous joint composition. As a result of the reaction, the melting point of the joint is raised and a solid joint is achieved. The joint thus formed will not melt again when reheated to at least the laminating temperature of the particular dielectric polymer. Several metals systems were tried on the basis of their phase diagrams. Copper and tin were one candidate pair of metals. By alloying Cu and Sn to form bronze, the melting point is raised from the melting point of tin (232 °C) to above 800 °C. However, Cu and Sn when first reacted form a CuSn intermetallic which is extremely brittle, and so this metal pair was rejected. Of several systems evaluated, including PbSn, AuSn, AuAu and CuSn, only AuSn satisfied all requirements. It is known that if the AuSn alloy system were too tin rich, i.e. greater than about 20wt.% tin, the bond tends to be brittle. Generally, the ratio of Au/Sn should be at least equal to about 1.5. AuSn20wt.% eutectic melts at about 280 °C. By reacting it with Au the melting point is raised to above about 490 °C. The resulting composition has the ductility and strength required to maintain joint integrity even when reheated to high performance polymer laminating temperatures. From the AuSn phase diagram, shown in Figure 1, it can be seen that several AuSn intermetallics may form when gold and tin are in contact. With the solid Sn (with some Au dissolved), and solid Au (with some Sn dissolved), these four intermetallics can form different eutectic and peritectic systems. Because these phases and systems are the equilibrium ones, however, they may not occur when Au and Sn are heated up. The phases actually formed during heating will be determined by the kinetics of the reaction. Experiments were run on copper coupons to simulate the joining of copper lands in the laminate. The kinetics was studied using samples with three different initial Au and Sn thicknesses, called group A, group B and Group C. For group A samples, 5 microns of gold and 2 microns of tin (nominal) were plated sequentially on Cu foil coupons; for group B samples 3 microns of gold and 2 microns of tin (nominal) were plated sequentially on Cu foil coupons. (Actually, DSC measurements showed the Sn in group B samples to be closer to 1.3 microns.) For group C samples, 20 microns of gold and 3 microns of tin (nominal) were plated sequentially on copper foil coupons. Plated coupons of groups A and B were laminated at 390 °C for 30 minutes at a pressure of 3,45 MPa (500 psi) to copper foil coupons plated with 3 microns gold. Prior to gold plating the copper surfaces had been etched with sodium persulfate and dipped into 10% sulfuric acid for cleaning. The gold plating was carried out at a current density of 10.3 mA/cm². A cyanide gold salt bath containing 32 grams/liter gold metal was adjusted to a pH of 5.5 with citrate and phosphate buffer salts and was operated at 135 °F. Under these conditions the bath operated at 99% current efficiency and yielded a gold deposit of 60-90 Knoop hardness. Tin was plated from a stannous sulfate (15g/l Sn)/sulfuric acid (10% vol.) bath at a current density of 10.5 mA/cm². There was no pretreatment of the gold surface prior to plating tin. Coupons of 4,76 mm (3/16") diameter were punched out from the foil for the heat treatment and DSC measurement. A Perkin-Elmer Differential Scanning Calorimeter was used to measure the endotherm due to the melting of the alloy in a nitrogen atmosphere. Figure 2 shows a DSC thermogram of a group C sample heated at a rate of 100 °C/min up to 320 °C. Three endotherms, which occurred at 218 °C, 257 °C, and 287 °C, are apparent in the thermogram. These endotherms corresponded to: the eutectic reaction, Sn + Au4Sn-->L, at 217 °C; the peritectic reaction, Au4Sn + AuSn2-->L, at 252 °C; and the eutectic reaction, AuSn + beta-->L, at 280 °C. Any discrepancies in the measured melting point and the ones in the phase diagram were most likely due to the thermal lag associated with the fast heating rate. The above results showed that at a heating of 100 °C/minute, four possible intermetallics formed. The four intermetallics and Sn then formed two eutectic systems and one peritectic system, as mentioned above. The peritectic reaction at 309 °C was not observed. No endotherm at the melting point of pure Sn, 232 °C, was detected, indicating that Sn had reacted completely with Au. When the heating rate was lowered, the endotherms corresponding to the reaction at 217 °C and 252 °C became less pronounced. At heating rates at and below 20 °C/minute, the only endotherm observed was from the eutectic reaction, AuSn + beta-->L, shown in Figure 3. To characterize the reaction quantitatively, the heat of fusion of Au-20wt%Sn eutectic was measured using commercially available preforms. The heat of fusion was determined to be 27 J/g. It was calculated that 4.5 microns of Au would be needed to react with the 3-micron-plated Sn if, as preferred, the Au-20wt%Sn eutectic were to be the only product, a ratio of 1.5 microns Au/micron Sn. For the sample used in this study, the weight of the resulting eutectic would then be 1.95 mg. The product of this weight and the heat of fusion was 52.1 mJ. The measured endotherm averaged from 15 samples was found to be 53.7 mJ with a standard deviation of 3.5 mJ, which agreed with the calculated value very well. The result confirmed that at a heating rate below 20 C/min, Au-20wt%Sn eutectic was the only reaction product. After the Au-20wt%Sn eutectic is formed, it may react with the Au underneath further to form either a beta phase or an AuSn solid solution before it melts. To characterize this reaction, samples were heated at rates from 3 to 100 °C/min. and the endotherm at 280 °C was measured. The results showed that the solid state reaction between the Au-20wt%Sn eutectic and the remaining Au was insignificant in the given heating rate range. The reaction between the liquid Au-20wt%Sn eutectic and the solid Au for different temperatures was also studied and plotted in Figure 4. In this set of experiments, the samples were first heated at 100 °C/min. to 250 °C and then at 20 °C/min. to different temperatures for different lengths of time, cooled down at 100 °C/min. to 250 °C, and then heated at 20 °C/min. to 300 °C again. The extent of the reaction was determined by comparing the endotherms at 280 °C in the first and the second heating run. Figure 4 shows the percentage of the Au-20wt%Sn eutectic reacted versus time at four different temperatures. These data indicated that the initial reaction between liquid eutectic and Au was very fast; upon heating up to 295 °C, about 40% eutectic, corresponded to about 3 microns, had already reacted with Au. After the initial reaction, the reaction became slower. At 390 °C, it took about 10 minutes to complete the reaction. As the reaction proceeded the peak temperature of the original eutectic melting was found to remain as a constant in the subsequent heating. When kept at a specific temperature, the composition of the remaining liquid was at the value defined by the liquidus in the phase diagram. However, upon cooling down, the liquid composition changed along the liquidus and reached the eutectic composition again. Schematically, Figure 5a shows the metallized lands before and Figure 5b after joining by TLB. The structure in 5b remains the same after repeated lamination cycles, except that as seen in 5c, additional amounts of gold are dissolved from the lands into the AuSn eutectic. The reaction between the liquid AuSn20wt.% eutectic and the Au was studied for different temperatures. Figure 6 is an SEM photo of a sample in which Au-20wt%Sn eutectic has partially reacted with Au. The sample was cross-sectioned and etched with Technistrip, a cyanide-containing solution commonly used in Au etching. The micrograph was taken using back-scattered electrons. The contrast was used to reveal the layers in the Au-Sn section made the Cu foil invisible in the micrograph. Three distinct layers can be seen in Figure 6. The layer on the right is the unreacted Au. The dark line and the bright line between the Au and the middle layer was believed to be due to a ledge caused by etching. An energy dispension spectrometric analysis showed that the layer on the left had a composition close to 80 wt % Au, which confirmed the speculation from the DSC results that the unreacted liquid AuSn remained at the eutectic composition. The middle layer was found to have a composition close to that of beta phase. Therefore, it was concluded that above its melting point, AuSn eutectic reacted with Au to form beta phase Au5Sn. The photo also showed that the reaction proceeded by growth of the zeta phase into the eutectic. The figures indicate that the joining was complete. Figures 7 and 8 are the group A and group B samples laminated to Cu coupons plated with 3 microns of Au, respectively. The continuity of the joined through holes can be measured, e.g., using Cu stitch patterns connecting the lands on the outmost layers. The stitch patterns can be etched off after measurement. The alignment can be achieved using the fudicials laser drilled in the individual layers. The foregoing experiments showed that the AuSn20wt.% eutectic made by TLB could be used for land-to-land bonding simultaneously with high performance polymer-to high performance polymer bonding in the lamination of high density circuit boards. The technique makes it possible to achieve increased through hole density over known combinations of methods and materials.

Claims: A method of bonding first and second highly conductive contact surfaces, comprising: coating the first contact surface with alternating layers of a first metal and a second metal, each of the layers comprising one layer of the first and second metals in predetermined proportions; coating the second contact surface with at least one layer of a metal selected from the group consisting of the said first and second metals; contacting the coated first and the second contact surfaces together; and heating the coated first and second contact surfaces at least to a first temperature where the formation of an alloy of the first and second metals is initiated which upon solidifying will remain solid up to a second temperature; characterized in that, the proportions of the first and second metals are such that said first temperature is the first eutectic point of the first and second metals where the heating is continued until the first and second metals are substantially mutually consumed; and that the alloy formed on solidifying is homogenous where the second temperature up to which the alloy remains solid is higher than the first temperature. The method recited in claim 1, wherein the step of coating the first contact surface comprises coating the first contact surface with at least one layer of gold alternately with at least one layer of tin, and the step of coating the second contact surface comprises coating the second contact surface with gold. The method recited in claim 2, wherein the ratio of total thickness of gold to total thickness of tin on the first and second contact surfaces is equal to or greater than 1.5. The method recited in claim 2 or 3, wherein the first and the second contact surfaces to be coated are comprised of copper. The method recited in claim 2, 3 or 4, wherein the thickness of tin is about 0.5 to about 5 microns. The method recited in any one of the preceding claims, wherein the first temperature is above about 280 °C to about 400 °C, and the second temperature is at least about 490 °C. The method recited in any one of the preceding claims, wherein the steps of coating the first and the second contact surfaces comprise plating the first and the second surfaces. A method of making a high density circuit board having at least one metallized through hole, comprising: providing at least two circuitized high performance dielectric polymer laminates; bonding selected lands together by the method recited in claim 1 while simultaneously subjecting the laminates to pressure and heat for a time sufficient to create a high performance dielectric-to-high performance dielectric bond; and repeating the foregoing steps until the total number of laminates desired is achieved. The method recited in claim 8, including the step of: repeating each of the foregoing steps until a high density PCB comprising a predetermined number of laminated layers is prepared. The method recited in claim 8 or 9, wherein the dielectric material in the printed circuit board is selected from the group consisting of filled and unfilled, reinforced and unreinforced fluorocarbon polymers, PFA, polyimides, fluorinated polyimides, fluorinated cyanate esters, polysiloxane imioles and polyphenyl quinoxilines. The method recited in claim 10, wherein the fluorocarbon polymer dielectric is selected from the group consisting of polytetrafluorethylene and 6F fluoropolymer. A high density circuit board, comprising: more than one circuitized dielectric layer including a high performance polymer in at least 2 adjacent layers of which is opened at least one through hole terminating in a land which is joined to a land in the adjacent dielectric layer by a solder alloy; characterized in that, the high density printed circuit board is fabricated according to the method of claim 8 and in that the solder alloy has a melting point higher than the laminating temperature of the high performance polymer. The printed circuit board recited in claim 12, further comprising at least one semiconductor device mounted thereupon. The printed circuit board recited in claim 12 or 13, wherein said solder alloy includes gold. The printed circuit board recited in any one of claims 12 to 14, wherein said solder alloy includes tin.

Inventors: DAVIS CHARLES R, HSIAO RICHARD, LOOMIS JAMES R, PARK JAE M, REID JONATHAN D, DAVIS, CHARLES R., HSIAO, RICHARD, LOOMIS, JAMES R., PARK, JAE M., REID, JONATHAN D.
Applicants: IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION
Application year: 1991
Main classification: B23K35
IPC codes: H01R43, H05K3, B23K35, H01R4