Coaxial conductor interconnection wiring board

Abstract: A coaxial conductor interconnection wiring board characterised by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.

Description: BACKGROUND OF THE INVENTION This invention relates to a coaxial conductor interconnection wiring board and a process for producing the same, as known e.g. from EP-A-0 219 815. With the development of electronic devices, wiring boards having a very high wiring density have been required. As such wiring boards having a very high wiring density, there are known wiring boards using wires as a necessary wiring pattern (hereinafter referred to as "multi-wire wiring board", e.g. Japanese Patent Examined Publication No. 45-21434) and multi-layer printed wiring boards. In highly densified wiring boards, the crosstalk noise among neighboring wires or signal conductor lines becomes an important problem. In order to solve such a problem, there are proposed various processes for shielding wiring boards, for example, a process for making signal conductor lines and a grounding pattern by build-up method (Japanese Patent Examined Publication No. 58-54520), a process for using an electroconductive coating film as a shield (Japanese Patent Unexamines Publication No. 51-71961), a process for providing a conductive shield surrounding insulated wire conductors by plating method (U.S. Patent No. 4,646,436), etc. But these processes are insufficient for solving the problem of crosstalk noise. On the other hand, in order to improve these shielding processes, there are proposed processes for using a so-called coaxial conductor covered with a conductive shield on an outer insulating layer surrounding a signal conductor (U.S. Patent Nos. 4,679,321 and 4,743,710). When such coaxial conductors are used, connections of a central signal conductor and a conductive shield of the coaxial conductor with other conductors become a problem. According to U.S. Patent No. 4,743,710, there are proposed two processes. According to a first process (shown in Figs. 1A to 1E of said U.S. Patent), it is necessary to remove an electroconductive substance, and a conductive shield and insulation of the coaxial conductor using a focussed laser at a portion to be connected, while retaining only a central signal conductor. But when the laser energy is made small so as not to remove the central signal conductor of coaxial conductor, removal of the portions to be removed cannot be carried out completely. In contrast, when the laser energy is made large so as to remove the portions to be removed completely, the central signal conductor is also vaporized or damaged. Thus, it is difficult to determine conditions satisfying both requirements and to maintain such a laser energy constantly. Further, according to the description at lines 58 to 67 on column 3 of said U.S. Patent, the central signal conductor reflects the CO 2 laser energy and other organic materials can be removed. But since the organic ground layer (here, an electroconductive paste is imaged) has high electroconductivity, the shielding effect becomes small. According to a second process (shown in Figs. 2A to 2F of said U.S. Patent), it is necessary to etch back selectively the conductive shield of coaxial conductor exposed to an inner wall of hole. In order to attain such a selective etch back, it is necessary to use different materials for the conductive shield and the central signal conductor of the coaxial conductor. Further, this means that it is difficult to insulate the inner portion of hole including the selectively etched back portion and a surface of the ground layer. When different materials are used for the conductive shield and the central signal conductor of coaxial conductor, the decay of signal of central signal conductor becomes larger in the case of using a poor electroconductive material for the central signal conductor of coaxial conductor, while the shielding effect becomes smaller in the reverse case. Further, when the conductive shield of coaxial conductor is selectively etched back, very small vacant spaces are formed in the etched back portions. It is difficult to fill such vacant spaces with a resin solution, and even if filled with the resin solution, generation of undesirable voids is inevitable due to vaporization of a solvent contained in the resin solution. SUMMARY OF THE INVENTION It is an object of the present invention to provide a coaxial conductor interconnection wiring board without crosstalk noise, excellent in shielding effect and suitable for high speed signal management, and a process for producing the same. The present invention provides a coaxial conductor interconnection wiring board comprising a ground layer, an insulating substrate formed on the ground layer, an adhesive insulating layer formed on the insulating substrate, at least one coaxial conductor with a conductive shield fixed on a surface of the adhesive insulating layer, an insulating layer covering the coaxial conductor, at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor with the inner wall of the metallised conductive hole being connected to the central signal conductor, a portion of the conductive shield of the coaxial conductor being removed in the region of the connection to the conductive hole, a metal layer connecting the conductive shield of the coaxial conductor to the ground layer, and an additional insulating layer including an insulating resin, which additional insulating layer surrounds the metallised conductive hole and a part of the additional insulating layer in the region of the conductive hole is surrounded by the metal connecting layer. The present invention also provides a process for producing a coaxial conductor interconnection wiring board which process comprises the steps of: fixing a plurality of coaxial conductors on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam so as to remove unnecessary portions for forming connection metal layers, removing only a portion of a conductive shield of the coaxial conductors retained by said laser beam in the exposing step by etching, forming the connection metal layers by plating on said exposed insulating substrate, and exposed insulating layer and adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers, and for connecting the conductive shield of the coaxial conductor to the ground layer, filling the unnecessary portions removed by the laser beam with an insulating resin, drilling a hole in the insulating resin to expose a terminal of a central signal conductor and a conductor insulating layer of the coaxial conductors or a cross-section thereof and to be insulated from the conductive shield and the connection metal layers and the ground layer formed in the step of forming the connection metal layers and metallising an inner wall of the hole drilled in the drilling step. The invention further provides a process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam to remove unnecessary portions for forming connection metal layers, forming the connection metal layers by plating on an exposed conductive shield of a coaxial conductor, the exposed insulating layer and the adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers and for connecting the conductive shield of the coaxial conductor to the ground layers, filling the unnecessary portions removed by the laser beams with an insulating resin, removing a portion of the insulating resin by exposing to the laser beam in a range narrower than connecting portions of the connection metal layers by forming a hole while exposing a terminal of the coaxial conductor including a central signal conductor, a conductor insulating layer and the conductive shield and the ground layers formed around the coaxial conductor to the resulting hole, removing the conductive shield of coaxial conductor exposed to the hole by etching, filling the unnecessary portions removed by the laser beam with another insulating resin, drilling an additional hole at a portion filled with the other insulating resin to expose terminals of the central signal conductor and the conductor insulating layer of coaxial conductor or cross-section thereof and to be insulated from the conductive shield of coaxial conductor, and the ground layer and the connection metal layers formed in the step of removing the portion of the insulating resin, and metallising an inner wall of the additional hole drilled in the drilling step. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partly cross-sectional and perspective view of an example of the wiring board of the present invention. Figs. 2 to 13 are cross-sectional and perspective views and cross-sectional views explaining the processes for producing the wiring board of the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENTS One example of the wiring board of the present invention has the structure as shown in Fig. 1 (hereinafter referred to as "connection metal layer built-in type"). The connection metal layer built-in type wiring board shown in Fig. 1 comprises a ground layer (1), an insulating substrate (2) formed thereon, an adhesive insulating layer (3) formed on the insulating substrate (2), at least one coaxial conductor (4) with a desired configuration fixed on the surface of the adhesive insulating layer (3), an insulating layer (11) covering the coaxial conductor (4), and at least one conductive hole (8) an inner wall of which is covered with a metal film connected to a central signal conductor (7) of coaxial conductor (4), the conductive shield (5) of coaxial conductor being connected to the ground layer (1) by connection metal layers (6'), the inner wall metallized conductive hole (8) being connected to the central signal conductor (7) of coaxial conductor using the coaxial conductor (4) from which a part of the conductive shield (5) has been selectively removed. As a result, the connecting portion can form a coaxial conductor structure by making the metallized hole (8) a central signal conductor, the insulating resin (11) surrounding the hole (8), and the connection metal layer (6') surrounding a part of the insulating resin. Such a wiring board can be produced by process as shown in Figs. 2, 3 and 5-13. One process comprises: (A) fixing a plurality of coaxial conductors (4) with a desired configuration on the adhesive insulating layer (3) formed on the insulating substrate (2) (shown in Fig. 2), (B) forming the insulating layer (11) on the coaxial conductors (4) (not shown in a drawing), (C) exposing parts of the insulating layer (11), the adhesive insulating layer (3) and the insulating substrate (2) to laser beam so as to remove unnecessary portions for forming the connection metal layers (6') (shown in Fig. 3), (D) removing only a part of the conductive shield (5) retained by laser beam removal in the step (C) by etching (not shown in a drawing), (E) forming the connection metal layers (6') by plating on exposed conductor insulating layer (9) in the case when an adhesive layer having plating metal depositing properties is formed on the surface of the conductor insulating layer (9) (the surface of fluorine resin or polyimide being generally smooth and not plated) and exposed insulating layer (11) and adhesive insulating layer (3), and the whole surfaces of the insulating substrate (2) and the insulating layer (11) to form the ground layers (1), and for connecting at least two ground layers (1) and for connecting the conductive shield (5) of coaxial conductor to the ground layer (1) (shown in Fig. 5), (F) filling the portion removed by the laser beam with an insulating resin (21) (shown in Fig. 6), (G) drilling a hole at the portion filled with the insulating resin (21) so as to expose terminals of the central signal conductor (7) and the conductor insulating layer (9) of coaxial conductor or crosssection thereof and so as to be insulated from the conductive shield (5) of coaxial conductor and the connection metal layers (6') and the ground layer (1) formed in the step (E) (shown in Fig. 7), and (H) metallizing the inner wall of the hole drilled in the step (G) to obtain the wiring board shown in Fig. 1. Another process for producing the wiring board of Fig. 1 comprises; (A) fixing a plurality of coaxial conductors (4) with a desired configuration on the adhesive insulating layer (3) formed on the insulating substrate (2) (shown in Fig. 2), (B) forming the insulating layer (11) on the coaxial conductors (4) (not shown in a drawing), (C) exposing parts of the insulating layer (11), the adhesive insulating layer (3) and the insulating substrate (2) to laser beam so as to remove unnecessary portions for forming the connection metal layers (6') (shown in Fig. 3), (D) forming the connection metal layers (6') by plating on exposed conductive shield (5), exposed insulating layer (11) and adhesive insulating layer (3), and the whole surfaces of the insulating substrate (2) and the insulating layer (11) to form the ground layers (1), and for connecting at least two ground layers (1) and for connecting the conductive shield (5) of coaxial conductor to the ground layer (1) (shown in Fig. 8), (E) filling the portion removed by the laser beam in the step (D) with an insulating resin (21) (shown in Fig. 9), (F) removing a part of the insulating resin (21) by exposing to laser beam in a range narrower than the connecting portions of the connection metal layers (6') while exposing the terminal of the coaxial conductor (4) including the central signal conductor (7), the conductor insulating layer (9) and the conductive shield (5) and the ground layers formed around the coaxial conductor (4) to the resulting hole (shown in Fig. 10), (G) removing the conductive shield (5) of coaxial conductor exposed to the hole by etching (not shown in a drawing), (H) filling the portion removed by the laser beam in the step (F) with an insulating resin (22) (shown in Fig. 11), (I) drilling a hole (8) at the portion filled with the insulating resin (22) so as to expose terminals of the central signal conductor (7) and the conductive insulating layer (9) of coaxial conductor or cross-section thereof and so as to be insulated from the conductive shield (5) of coaxial conductor, and the ground layer (1) and the connection metal layers (6') formed in the step (F) (shown in Fig. 12), and (J) metallizing the inner wall of the hole drilled in the step (I) (shown in Fig. 13). As the insulating substrate (2), there can be used commercially available ones such as an epoxy resin substrate, a phenol resin substrate, a fluorine resin substrate; cloth or paper using inorganic fibers such as glass cloth, glass paper, etc; cloth or paper using organic fibers such as cellulose, aramide, nylon fibers, polyester fibers, etc., impregnated with an epoxy resin, a phenol resin, etc. or coated with a dispersion of a fluorine resin, followed by baking; the above-mentioned resins mixed with an inorganic filler such as glass short fibers; organic polymer films such as a polyimide film, a polyester film, a polyethylene film, a polypropylene film, a polyamideimide film, a polyether ketone film, a polyetherimide film, a fluorine-containing polymer film such as polytetrafluoroethylene film, etc. It is also possible to use photocurable resins, and the resins mentioned above mixed with a catalyst for electroless plating. As the adhesive insulating layer (3), there can be used resin compositions which can adhere coaxial conductors thereto, for example, containing natural rubber or synthetic rubber and an epoxy resin as major components. As the coaxial conductor (4), there can be used commercially available ones. In order to obtain higher density and to improve wiring workability, it is preferable to use a coaxial conductor as shown in Fig. 4 wherein numeral 5 denotes a conductive shield, numeral 7 denotes a central signal conductor, numeral 9 denotes a conductor insulating layer, and numeral 13 denotes a conductor adhesive layer excellent in adhesive strength with the adhesive insulating layer (3). As the conductor adhesive layer (13), there can be used polyvinyl butyral/epoxy resin, nylon/phenol resin, and the like. As the central signal conductor (7) of coaxial conductor (4), there can be used a single wire or twisted ones. The central signal conductor can have a diameter of 30 to 80 µm and can be made of copper, a copper alloy, aluminum, an aluminum alloy, or can be a copper-clad music wire, or wires made of the materials mentioned above and plated with gold, silver, or tin. The conductive shield (5) of coaxial conductor can be formed by plating copper or a copper alloy, or by winding a wire of 20 to 30 µm in diameter made of copper, a copper alloy, aluminum, or an aluminum alloy or a copper-clad music wire on the surface of the conductor insulating layer (9). Further, the conductive shield (5) can be formed by winding a strip of copper or a copper alloy, or a strip of copper- or copper alloy-clad foil. As the conductor insulating layer (9), there can be used a polyimide, a polyamideimide, a fluorine resin, a methylpentene resin, etc. As the insulating layer (11), there can be used glass, an epoxy prepreg together with glass-epoxy prepreg, glass-polyimide prepreg, etc., these materials being formed by a press laminate method. Alternatively, the insulating layer (11) can be formed by coating an epoxy resin varnish or a polyimide varnish. As the laser beam, it is preferable to use CO 2 laser. It is also possible to use YAG laser, excimer laser, or the like, singly or in combination with CO 2 laser. As the insulating resins (21) and (22) for filling the hole removed by the laser beam, there can be used an epoxy resin, a phenol resin, a polyimide resin, etc. Preferable resins are those having the same properties as the insulating substrate (2). The thus produced wiring board is excellent in preventing the crosstalk noise due to the use of the coaxial conductors with the special connection method. Further, since distances of connecting portion between the central signal conductor (7) and other circuits, and connecting portion between the conductive shield (7) and the ground layer (1) can be made small, influences on signals due to deviation of the designed impedance can be minimized. Further, in the connection metal layer built-in type wiring board, since the connection metal layers (6') take a structure corresponding to the conductive shield (5) of coaxial conductor and the metallized inner wall of the conductive hole (8) take a structure corresponding to the central signal conductor (7) of coaxial conductor, the effects of using the coaxial conductor are further enhanced. The present invention is illustrated by way of the following Examples, in which all parts and percents are by weight, unless otherwise specified. In the following Examples, the following resin compositions were used. [Composition I] A composition was prepared by mixing 300 g of the following resins with a solution of 50 g of N-methyl-2-pyrrolidone dissolving 1 g of palladium chloride. Ethylene glycol monoethyl ether acetate (ethyl Cellosolve acetate; mfd. by Tokyo Kasei Kogyo Co., Ltd.) 600 g/l Epoxy resin (Epikote 1001, mfd. by Yuka Shell Epoxy Co., Ltd.) 109 g/l Acrylonitrile-butadiene copolymer rubber (Nitrile Rubber Nipol DN 401, mfd. by Nippon Zeon Co., Ltd.) 20 g/l Phenol resin (Hitanol 2400, mfd. by Hitachi Chemical Co., Ltd.) 60 g/l Acrylonitrile-butadiene copolymer (Nipol 1432J, mfd. by Nippon Zeon Co., Ltd.) 144 g/l Silicon dioxide powder (Crystalite VX-X, mfd. by Tatsumori K.K.) 50 g/l [Composition II] Phenoxy resin (phenotohto YP-50, mfd. by Tohto Kasei Co., Ltd.) 100 parts Methylated melamine (Melan 523, mfd. by Hitachi Chemical Co., Ltd.) 15 parts Glass short fibers (AGP-01BZ, mfd. by Asahi-Schwebel Co., Ltd.) 35 parts m-Bromobenzoic acid (mfd. by Wako Pure Chemical Industries, Ltd.) 0.3 part Palladium catalyst for electroless plating (Cat. #11, mfd. by Hitachi Chemical Co., Ltd.) 2.5 part Ethyl Cellosolve acetate (mfd. by Tokyo Kasei Kogyo Co., Ltd.) 220 parts [Composition III] Example 1 A glass-polyimide insulating plate of 0.2 mm thick and cured completely was prepared. A dry film of 100 µm thick was made from Composition I and laminated on a surface of the substrate by pressing at 150°C and 10 kg/cm 2 for 10 minutes. Then, coaxial conductors having an outer diameter of 0.22 mm, a diameter of the central signal conductor of 0.075 mm, the thickness of the conductive shield of 0.01 mm, and the conductor insulating layer made from a fluorine resin (the surface of the conductor insulating layer (9) being smooth, and thus not plated) were wired in the desired pattern according to a wiring rule so as to make the wiring density 2 wires/2.54 mm and the wire pitch 0.4 mm using a numerical value controlling wiring machine. Then, a dry film of 180 µm thick made from Composition II was laminated on the coaxial conductor positioned surface and pressed at 150°C and 10 kg/cm 2 for 10 minutes, followed by pressing with heating at 170°C and 30 kg/cm 2 for 90 minutes to obtain an integrated structure. Focused CO 2 laser beam having a spot diameter of 200 µm was irradiated with an output of 45 W on a portion of the resulting substrate to be formed into a connection metal layer to remove the resin so as to make a hole diameter 2 mm and so as to expose the conductive shield of coaxial conductor when viewed from both sides of the substrate. Then, the exposed conductive shield was removed by etching using a cupric chloride solution. The resulting substrate was washed, provided with a catalyst for electroless plating, accelerated in adhesion, and dipped in an electroless copper plating solution (Hid-410, a trade name, mfd. by Hitachi Chemical Co., Ltd.) for 10 hours to form a copper plated layer of 25 µm thick. No copper plating was deposited on the conductor insulating layer of coaxial conductor at this time. The resulting substrate, an inner plate prepared by an etched foil method, a glass-polyimide-made prepreg (GIA-67N, a trade name, mfd. by Hitachi Chemical Co., Ltd.) and a copper foil were laminated and pressed at 180°C and 30 kg/cm 2 for 90 minutes to obtain an integrated structure. As a result, the hole was filled with the polyimide resin contained in the glass-polyimide prepreg. Then, desired portions of the resulting substrate and the portions from which the conductive shield had been removed and not contacted with the above-mentioned conductive shield were drilled to form holes of 0.8 mm in diameter, followed by washing, providing with a catalyst for electroless plating, accelerating in adhesion and conducting electroless copper plating to form copper plated layers of about 35 µm thick on inner wall of the hole and the surface of copper foil. Etching resists were formed on necessary portions such as pads and terminals for mounting electronic parts to remove unnecessary copper by etching to produce a wiring board as shown in Fig. 1. Example 2 A glass-polyimide insulating plate of 0.2 mm thick and cured completely was prepared. A dry film of 100 µm thick was made from Composition I and laminated on a surface of the circuit substrate by pressing at 150°C and 10 kg/cm 2 for 10 minutes. Then, coaxial conductors having an outer diameter of 0.22 mm, a diameter of the central signal conductor of 0.075 mm, the thickness of the conductive shield of 0.01 mm, the conductor insulating layer made from a fluorine resin, the conductor insulating layer being covered with as adhesive resin an epoxy resin layer mixed with aluminum silicate adsorbing palladium which is a catalyst for plating, the epoxy resin layer being covered with a copper film obtained by electroless plating as a conductive shield, were wired in the desired pattern according to a wiring rule so as to make the wiring density 2 wires/2.54 mm and the wire pitch 0.4 mm using a numerical value controlling wiring machine. Then, a dry film of 180 µm thick made from Composition II was laminated on the coaxial conductor positioned surface and pressed at 150°C and 10 kg/cm 2 for 10 minutes, followed by pressing with heating at 170°C and 30 kg/cm 2 for 90 minutes to obtain an integrated structure. Focused CO 2 laser beam having a spot diameter of 200 µm was irradiated with an output of 45 W on a portion of the resulting substrate to be formed into a connection metal layer to remove the resin so as to make a hole diameter 4 mm and so as to expose the conductive shield of coaxial conductor when viewed from both sides of the substrate. The resulting substrate was washed, provided with a catalyst for electroless plating, accelerated in adhesion, and dipped in an electroless copper plating solution (Hid-410, a trade name, mfd. by Hitachi Chemical Co., Ltd.) for 10 hours to form a copper plated layer of 25 µm thick. Then, Composition III was coated on surfaces of the substrate and the portion removed by the laser, followed by curing of the resin by sandwiching with a pair of stainless steel plates at 170°C and 30 kg/cm 2 for 90 minutes. Further, the portion to be formed into a connection metal layer was exposed to CO 2 laser of which spot diameter was focussed to 200 µm with an output of 45 W to remove the resin so as to make the hole diameter 2 mm, resulting in exposing the conductive shield of coaxial conductor so that the exposed conductive shield was able to be seen from the both sides of the substrate. Then, the exposed conductive shield was removed by etching using an aqueous solution of cupric chloride. In the next place, Composition III was coated on surfaces of the substrate and the portion removed by the laser, followed by curing of the resin by sandwiching with a pair of stainless steel plates at 170°C and 30 kg/cm 2 for 90 minutes. The resulting substrate, an inner plate prepared by an etched foil method, a glass-polyimide-made prepreg (G1A-67N, a trade name, mfd. by Hitachi Chemical Co., Ltd.) and a copper foil were laminated and pressed at 180°C and 30 kg/cm 2 for 90 minutes to obtain an integrated structure. Then, desired portions of the resulting substrate and the portions from which the conductive shield had been removed and not contacted with the above-mentioned conductive shield were drilled to form holes of 0.8 mm in diameter, followed by washing, providing with a catalyst for electroless plating, accelerating in adhesion, and conducting electroless copper plating to form copper plated layers of about 35 µm thick on inner wall of the hole and the surface of copper foil. Etching resists were formed on necessary portions such as pads and terminals for mounting electronic parts to remove unnecessary copper by etching to produce a wiring board (not shown in a drawing). The wiring boards produced in Examples 1 and 2 showed no crosstalk noise when measured under the following conditions: Distance between conductors: 0.4 mm Length of conductors positioned in parallel: 30 cm Induction pulse potential: 5 V Induction pulse width: 500 ns Induction pulse rise time: 1 ns On the other hand, when a land on the surface of wiring board connected to the central signal conductor of coaxial conductor, and a land formed on very near place thereof and connected to the ground layer were terminated with a resistance of 50 ohms, distance of wave form by reflection was not generated nor observed. As explained above, the wiring board excellent in controlling the crosstalk noise and controlling the interference by reflection can easy be obtained and effectively be produced according to the present invention.

Claims: A coaxial conductor interconnection wiring board comprising a ground layer, an insulating substrate formed on the ground layer, an adhesive insulating layer formed on the insulating substrate, at least one coaxial conductor with a conductive shield fixed on a surface of the adhesive insulating layer, an insulating layer covering the coaxial conductor, at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor with the inner wall of the metallised conductive hole being connected to the central signal conductor, a portion of the conductive shield of the coaxial conductor being removed in the region of the connection to the conductive hole, a metal layer connecting the conductive shield of the coaxial conductor to the ground layer, and an additional insulating layer including an insulating resin, which additional insulating layer surrounds the metallised conductive hole and a part of the additional insulating layer in the region of the conductive hole is surrounded by the metal connecting layer. A coaxial conductor interconnection wiring board according to claim 1 which comprises at least a second coaxial conductor, the central signal conductor of which is connected to a second conductive hole and the conductive shield of which is connected to the ground layer by a second metal layer and with an additional insulating layer surrounding the second conductive hole and being surrounded by the second metal layer in the manner defined in claim 1. A coaxial conductor interconnection wiring board according to claim 1 or 2 wherein the conductive shield of the coaxial conductor is made of a wound wire of copper, a copper foil or a copper layer obtained by plating. A process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam so as to remove unnecessary portions for forming connection metal layers, removing only a portion of a conductive shield of the coaxial conductors retained by said laser beam in the exposing step by etching, forming the connection metal layers by plating on said exposed insulating substrate, and exposed insulating layer and adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers, and for connecting the conductive shield of the coaxial conductor to the ground layer, filling the unnecessary portions removed by the laser beam with an insulating resin, drilling a hole in the insulating resin to expose a terminal of a central signal conductor and a conductor insulating layer of the coaxial conductors or a cross-section thereof and to be insulated from the conductive shield and the connection metal layers and the ground layer formed in the step of forming the connection metal layers and metallising an inner wall of the hole drilled in the drilling step. A process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam to remove unnecessary portions for forming connection metal layers, forming the connection metal layers by plating on an exposed conductive shield of a coaxial conductor, the exposed insulating layer and the adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers and for connecting the conductive shield of the coaxial conductor to the ground layers, filling the unnecessary portions removed by the laser beams with an insulating resin, removing a portion of the insulating resin by exposing to the laser beam in a range narrower than connecting portions of the connection metal layers by forming a hole while exposing a terminal of the coaxial conductor including a central signal conductor, a conductor insulating layer and the conductive shield and the ground layers formed around the coaxial conductor to the resulting hole, removing the conductive shield of coaxial conductor exposed to the hole by etching, filling the unnecessary portions removed by the laser beam with another insulating resin, drilling an additional hole at a portion filled with the other insulating resin to expose terminals of the central signal conductor and the conductor insulating layer of coaxial conductor or cross-section thereof and to be insulated from the conductive shield of coaxial conductor, and the ground layer and the connection metal layers formed in the step of removing the portion of the insulating resin, and metallising an inner wall of the additional hole drilled in the drilling step. A process according to claim 4 or 5, wherein the conductive shield of the coaxial conductor is made of a wound wire of copper, a copper foil or a copper layer obtained by plating. A process according to any one of claims 4 to 6, wherein the coaxial conductor has an adhesive layer on the conductive shield. A process according to any one of claims 4 to 7, wherein the insulating layer and the adhesive insulating layer are made from a thermosetting resin or a photocurable resin containing an organic cloth, an organic filler, an inorganic particulate filler or an inorganic short-fibre filler.

Inventors: ARIKE SHIGEHARU, IWASAKI YORIO, KAMIYAMA HIROHARU, KOJIMA FUJIO, NAMAI EISAKU, OKAMURA TOSHIRO, SHIMADA YASUSHI, ARIKE, SHIGEHARU, IWASAKI, YORIO, KAMIYAMA, HIROHARU, KOJIMA, FUJIO, NAMAI, EISAKU, OKAMURA, TOSHIRO, SHIMADA, YASUSHI
Applicants: HITACHI CHEMICAL CO LTD, HITACHI CHEMICAL CO., LTD.
Application year: 1991
Main classification: H05K7
IPC codes: H05K1, H05K7, H05K3