Image forming apparatus

Abstract: An image forming apparatus having a plurality of electron emitting devices [2] and luminescent members [3] arranged into a matrix form on one surface of a substrate [1]. As rows of electron emitting devices are successively driven, each luminescent member emits light according to a voltage applied to it or other members in accordance with an image information signal, when irradiated with a beam from one of the electron emitting devices mated with it.

Description: This invention relates to an image forming apparatus using an electron emitting device. From FR 2 647 580 an image forming apparatus is known comprising a plurality of electron emitting elements and a plurality of image forming members which form an image when irradiated with electron beams emitted from said electron emitting elements, wherein said electron emitting elements and said image forming members are juxtaposed on surface of a substantially planar substrate. A thin type image forming apparatus is known which has a plurality of electron emitting devices disposed along a plane, and image forming members (which emit light, or are charged or changed in color or quality by collision of electrons, e.g., members formed of a luminescent material or a resist material) which respectively face the electron emitting devices, and on which an image is formed by irradiation with electrons beams emitted from the electron emitting devices. Fig. 12 schematically shows an example of such an image forming aparatus, that is, a conventional electron beam display apparatus. The electron beam display apparatus shown in Fig. 12 has a construction in which modulation electrodes are disposed between electron emitting devices and an image forming members opposed to each other. More specifically, this image forming apparatus has a rear plate 91, support members 92, wiring electrodes 93, electron emission sections 94, electron passage holes 95, modulation electrodes 96, a glass plate 97, a transparent electrode 98, and luminescent members 99 (image forming members 99). The glass plate 97, the transparent electrode 98 and the luminescent members 99 constitute a face plate 100. The luminescent members have luminous points 101. The electron emitting sections 94 of the electron emitting devices (constituted of components 92, 93, and 94) are formed by a thin film formation technique as a hollow structure such that the wiring electrodes do not contact the rear plate 91. The modulation electrodes 96 are disposed in a space defined above the electron emitting sections 94 (in the electron emitting direction) and therefore have the holes 95 for passage of emitted electrode beams. In this electron beam display apparatus, a voltage is applied to each wiring electrode 93 to heat the hollow-structure electron emitting sections 94 to emit electrons from the same, voltages are applied to the modulation electrodes 96 to modulate the flows of the emitted electrons in accordance with an information signal, and the electrons are extracted through the passage holes 95 and are accelerated to collide against the luminescent members 99. The wiring electrodes 93 and the modulation electrodes 96 form an X-Y matrix to effect image display on the luminescent members 99, i.e., image forming members. In the above-described conventional image forming apparatus, however, the image forming members (luminescent members) are disposed in the space above the electron emitting devices (in the electron emitting direction) so as to face the electron emitting devices), and the following problems are therefore encountered. 1 ○ When each image forming member or a gas in the device (residual gas) is irradiated with an electron beam, ions (positive ions) are generated. These ions are accelerated in the direction opposite to the direction of acceleration of electrons by the high voltage for accelerating electrons. Consequently, these positive ions collide against and damage the electron emitting devices. The extent of damage thereby caused is seriously large if the device is driven under a condition that the degree of vacuum inside the device is not higher than a level at 10 -5 torr. Even if high vacuum is maintained in the device, the same damage is caused during a long-time continuous operation of the device. Such damage to the electron emitting devices results in a reduction in the electron emission rate (electron emission efficiency) and, in the worst case, breakdown of the device. With respect to the performance of the image forming apparatus, a reduction in the contrast of the image formed on the image forming members (luminance unevenness or luminance fluctuation of the luminescent members) is caused. 2 ○ It is difficult to strictly align the positions of the image forming members (luminescent members) and the electron emitting sections of the electron emitting devices in a horizontal direction, and a small deviation of the position results in a considerable reduction in the contrast of the formed image (luminance unevenness or a luminance fluctuation of the luminescent image). 3 ○ It is difficult to maintain a certain distance between the image forming members (luminescent members) and the electron emitting sections of the electron emitting devices, and a change in this distance (due to an impact or a thermal deformation during driving) results in an unintended reduction in the contrast of the formed image (luminance unevenness or a luminance fluctuation of the luminescent image). 4 ○ Further, by the phenomena of the problems 2 ○ and 3 ○, color unevenness is caused in the case of an image forming apparatus having image forming members formed of multicolor luminescent materials having colors red, green and blue, resulting in a deterioration in color reproducibility according to information signal. The present invention has been achieved in consideration of the above-described problems, and an object of the present invention is to provide an image forming apparatus capable of obtaining a high-contrast clear image and having a long life. Another object of the present invention is to provide an image forming apparatus capable of forming a full-color image with reduced color unevenness and improved in color reproducibility. Still another object of the present invention is to provide an image forming apparatus which does not require strict positioning of the image forming members and the electron emitting sections of the electron emitting devices, and which can easily be manufactured. This object is achieved by an image forming apparatus according to claim 1. The invention is further developed by the features mentioned in the subclaims. BRIEF DESCRIPTION OF THE DRAWINGS Figs. 1 and 8 to 10 are schematic diagrams of the construction of an image forming apparatus, of which Figs 8-10 are in accordance with the present invention; Fig. 2 is a diagram relating electron emission characteristics of a surface conduction type emitting device; Figs. 3 to 5 are diagrams of a method of driving the image forming apparatus; Fig. 6 is a diagram showing ion damage in a conventional image forming apparatus; Fig. 7 is a diagram showing ion damage in the image forming apparatus, Fig. 11 is a diagram of a method of the driving the image forming apparatus having X-Y matrix structure of the present invention. Fig. 12 is a schematic diagram of the construction of the conventional image forming apparatus. DESCRIPTION OF THE PREFERRED EMBODIMENTS An image forming apparatus be described below. The image forming apparatus is mainly characterized in that electron emitting elements and image forming members are juxtaposed on one substrate surface. More specifically, electron emitting elements and image forming members are arranged on the same substrate surface, as shown in Fig. 1. Fig. 1 shows a substrate 1 (rear plate), an electron emitting element 2, an image forming member 3, a face plate 4, and a support frame 5. In the image forming apparatus having such a construction, an electron emitting element constituting an electron emitting device may comprises a hot cathode or cold cathode used as an electron source for conventional image forming apparatuses. In the case of a hot cathode, however, the electron emission efficiency and the response speed are reduced by thermal diffusion to the substrate. Also, there is a possibility of a change in the quality of image forming members and, therefore, hot cathodes and image forming members cannot be arranged at a high density. For these reasons, it is preferred that a cold cathode, such as an element of a later-described surface conduction type emission device or a semiconductor electron emission device, is used for the electron emitting element. Among cold cathode type electron emitting elements, that of a surface conduction type emission device is used particularly preferably because of the following and other advantages. If it is applied to the image forming apparatus, 1) a high electron emission efficiency can be obtained, 2) the device structure can be achieved and the electron emitting device can easily be manufactured, since this type of electron emitting device has a simple structure, 3) a multiplicity of electron emitting devices can be arranged and formed on one substrate, 4) a high response speed can be achieved, and 5) the luminance contrast can be further improved. A surface conduction type device is, for example, a cold cathode device made public by M.I.Elison et al. (Radio) Eng. Electron. Phys., volume 10, pp 1290 to 1296, 1965) in which a voltage is applied between electrodes (device electrodes) which are provided on a substrate surface and between which a small-area thin film (electron emission section) is formed, and a current thereby flows parallel to the thin film surface to emit electrons. SnO 2 (Sb) thin film is used for this cold cathode device developed by Elison et al. Other cold cathode devices of this type having different thin films are known. For example, one using Au thin film (G.Dittmer: "Thin Solid Films", Volume 9, p 317, 1972), one using ITO thin film (M.Hartwell and C.G.Fonstad: "IEEE Trans. ED Conf.", p 519, 1975) and one using carbon thin film (Hisa Araki et al.: "Vacuum", volume 26, No. 1, p 22, 1983) have been reported. The surface conduction type device comprises, as well as those mentioned above, one in which electron emission sections are formed by dispersing fine metallic particles as described later. Preferably, with respect to the form of the surface conduction type emission device, the sheet resistance of the thin film (electron emission section) is 10 3 to 10 9 Ω/□ and the distance between the electrodes is 0.01 to 100 µm. It is advantageous to use such a surface conduction type emission device another respect. That is, in a surface conduction type emission device, electrons emitted from the electron emission section formed between the electrodes fly by obtaining a component of velocity to the positive side during the application of the voltage the electron beam path is largely deflected toward the positive electrode. As is apparent from Fig. 2, use of an electron emitting device having a large degree of deflection of the electron beam path in a horizontal direction is particularly preferred for the present invention, which is characterized in that electron emitting devices and image forming members are juxtaposed on a substrate surface. Fig. 2 shows an insulating substrate 1, a positive-side device electrode, a negative-side device electrode 1 and an electron emission section. The arrow in Fig. 2 indicates an electron beam path. Any member can be used as the image forming member in the above-described arrangement, so long as it is formed of a material which emits light or is charged, changed in color or quality, or deformed by being irradiated with electron beams emitted from the electron emitting element. For example, it may be formed of a luminescent material or a resist material. If a luminescent material is used for the image forming member, an image formed thereon is a light emitting (luminescent) image, and the image forming members may be formed of materials which emit three primary colors, red, green and blue to form a full-color luminescent image. The shape and the constituent material of the substrate on which the electron emitting element and the image forming member described above are formed, are not particularly limited, so long as it can support the electron emitting element and the image forming member. However, preferably, the substrate has a uniform thickness and is flat. As described later, if wiring electrodes of electron emitting devices and image forming members are directly laminated on the substrate surface, the substrate is formed of an insulating material to maintain electrical insulation between wiring electrodes. Essential component members of the image forming apparatus are the electron emitting element, the image forming member and the substrate described above. However, the face plate 4, the support frame 5 and other members are provided as desired, as shown in Fig. 1. Also, it is preferable to set the vacuum in the panel container formed by the substrate (rear plate) 1, the face plate 4 and the support frame 5 as shown in Fig. 1 to 10 -5 to 10 -7 torr by considering electron emitting characteristics of the electron emitting device. An example of a basic form of the image forming apparatus will now be described below in detail. It is preferable for the image forming apparatus to have an auxiliary means for reinforcing the effect of irradiation of the image forming member with electron beams. This auxiliary means is used to deflect, toward the image forming member, the locus of a beam of electrons emitted from the electron emitting element so that the electron beam can efficiently reach the image forming member. Such an auxiliary means comprises a means for applying a voltage to the image forming member. For example, this voltage application means is constituted of, as shown in Fig. 3, an auxiliary electrode 9 disposed below the image forming member 3, and an auxiliary power source 10 connected to the auxiliary electrode 9; it is a means for setting a potential of the image forming member. The voltage applied to the image forming member by this voltage application means is a constant voltage such that the potential of the image forming member is set to a level higher than the ground potential (0 V), i.e., a positive level. In a case where the above-described surface conduction type emission device is used, the above auxiliary means can sufficiently reinforce the effect of irradiation of the image forming member with emitted electrons even if the voltage applied to the image forming member is low, since the surface conduction type emission device makes electrons fly to the image forming member. Because the applied voltage can be reduced, the interval of the disposition of the electron emitting device and the image forming member (the distance therebetween) can be reduced. Therefore the density at which a plurality of electron emitting elements and a plurality of image forming members are arranged into a matrix form as described later can be increased. In a case where a beam of electrons emitted from the electron emitting device of the image forming apparatus is modulated in accordance with an information signal (the electron emission is changed in an on-off manner), a modulation means other than the indispensable components including the electron emitting element and the image forming member is additionally provided. In the image forming apparatus, such a modulation means is provided in such a manner that (1) the image formation means has a modulation means (Fig. 4) or (2) the electron emitting device has a modulation means (Fig. 5). In the case (1), the modulation means has a voltage application means for applying a voltage to the image forming member in accordance with an information signal. For example, this voltage application means includes, as shown in Fig. 4, an electrode (modulating electrode) 11 disposed below the image forming member 3, and a modulation circuit 12 for changing the voltage applied to the electrode 11 in accordance with the information signal. For example, an electron beam is modulated in accordance with the information signal by the modulation means in such a manner that the irradiation of the image forming member with the electron beam is effected by applying a voltage higher than the ground potential (0 V), i.e., a positive voltage to the modulation electrode, and is stopped by applying a negative voltage to the modulation electrode. In the case (2), the modulation means includes a voltage application means for applying a voltage to the electron emitting element in accordance with an information signal. For example, this voltage application means includes, as shown in Fig. 5, a modulation circuit 12 for changing the voltage applied to the electron emitting element 2 in accordance with the information signal. For example, an electron beam may be modulated in accordance with the information signal by the modulation means in such a manner that the power source for applying the voltage to the electron emitting element 2 is turned on/off. In the image forming apparatus having the modulation means (1), the components 11 and 12 shown in Fig. 4 correspond to auxiliary means 9 and 10 shown in Fig. 3. That is, the modulation means or the auxiliary means is selected according to whether or not it is supplied with an image information signal. It is preferable to provide such an auxiliary means or modulation means. The above-described image forming apparatus specifically has a construction in which an electron emitting element and an image forming member are juxtaposed on one substrate surface, and all the problems 1 ○ to 3 ○ of the conventional image forming apparatuses can thereby be solved. The reason why the image forming apparatus has an effect of solving the problem 1 ○ (the problem of damage to the electron emitting element) in particular among the above-described problems is still not clear. However, it may be clarified to some extent as described below. Fig. 6 shows a schematic cross-sectional view of the construction of a conventional image forming apparatus (electron beam display), and Fig. 7 is a schematic cross-sectional view of the construction of an image forming apparatus. In the conventional image forming apparatus (Fig. 6), an electron 16 emitted from the electron emitting element 2 is accelerated by an acceleration voltage Va applied to the transparent electrode 14 (from a power source 15), and collides against a portion of the image forming member (luminescent member) 3 located generally perpendicularly above the position on the electron emitting element 2 from which the electron has been emitted to excite the luminescent member 3 to emit light to form an image. At this time, positive ions 17 generated by the collision of the electron beam against a gas existing between the electron emitting element 2 and the luminescent member 3 or the collision against the luminescent member 3 are accelerated by the acceleration voltage Va in the direction opposite to that of the acceleration of the electron 16 to collide against the electron emitting element 2. The extent of ionization of the residual gas is particularly large if the degree of vacuum in the device is not higher than a level at 10 -5 torr, or if the amount of residual gas is increased during long-time use of the device. Ions thereby caused collide against the electron emitting element 2 and damage the same so that the electron emission rate (electron emission efficiency) is seriously reduced, resulting a reduction in the life of the device. In contrast, as shown in Fig. 7, the electron emitting element 2 and the image forming member 3 to which the acceleration voltage Va is applied are juxtaposed, and electron 16 emitted form the electron emitting element 2 is accelerated by the acceleration voltage Va while the direction of its flying is thereby deflected, and collides against the image forming member 3. During this flying process, the electron beam also generates ions (positive ions) 17 from the residual gas and the image forming member. However, the mass of the ions is much greater than that of the electron and, therefore, the locus of the ions is not substantially deflected by the same force of the electric field as that applied to the electron. There is therefore substantially no possibility of collision of the ions against the electron emitting element 2 disposed by the side of and on the same plane as the image forming member 3 and, hence, substantially no possibility of damage to the electron emitting device. The electron emitting device is preferably a linear electron emitting device having a plurality of electron emission sections arranged in a row, and a plurality of such electron emitting devices and a plurality of image forming members form an X-Y matrix, although this arrangement may be changed according to use of the device. Fig. 8 is a perspective view of an image forming apparatus in accordance with an embodiment of the present invention, Fig. 9 is an enlarged perspective view of a portion of the apparatus shown in Fig. 8, and Fig. 10 is a cross-sectional view taken along the line A - A' of Fig. 9. As shown in these figures, this apparatus has electron emitting devices 610, luminescent members 616 (616r, 616g, 616b), and unillustrated voltage application means for applying predetermined voltages to luminescent members 616. Each electron emitting device 610 emits electron beams so that the corresponding group of luminescent members 616r, 616g, and 616b emit light by these electron beams in accordance with the voltages applied thereto. Luminescent members 616 thereby form an image light emission pattern in accordance with the applied voltages. Electron emitting devices 610 and luminescent members 616 are juxtaposed on a surface of an insulating substrate 612. Voltages are applied to the luminescent members 616 in each group separately and independently by voltage application means. Each electron emitting device 610 has plus and minus device electrodes 614a and 614b facing each other, and emits electrons when a voltage is applied between these electrodes. Plus and minus electrodes 614a and 614b of each electron emitting device 610 are connected to device wiring electrodes 613a and 613b, respectively. A group of electron emitting elements 610 connected to one pair of device wiring electrodes 613a and 613b forms a row of electron emitting devices which are driven simultaneously. Each of rows of luminescent members 616 perpendicular to this row of the electron emitting devices are connected by luminescent member wiring electrodes 620. Therefore a plurality of device wiring electrodes 613a and 613b and a plurality of luminescent member wiring electrodes 620 are respectively arranged in rows so as to intersect each other and to form a matrix-like pattern. Device wiring electrodes 613a and 613b and luminescent member wiring electrodes 620 are electrically insulated from each other by an insulating material 622. A face plate 619 is supported by a support frame 617 on the insulating substrate 612. Each electron emitting device 610 has an electron emitting section 615 between electrodes 614a and 614b, and is constructed as a cold cathode type such that when a voltage is applied between these electrodes, electrons are emitted from the electron emitting section 615. An example of a method of manufacturing this image forming apparatus will be described below. First, insulating substrate 612 is sufficiently washed. Device electrodes 614a and 614b and three luminescent member wiring electrodes 620 with respect to each pair of device electrodes 614a and 614b are thereafter formed of a Ni material by a vapor deposition technique and a photolithography technique ordinarily used. The luminescent member wiring electrodes 620 may be formed of any material other than Ni so long as its resulting electrical resistance is adequately small. Next, insulating layers 622 having a thickness of 3 µm are formed of SiO 2 by a vapor deposition technique. The insulating layers 622 may be formed of a material selected from glass and other ceramic materials. Thereafter, device wiring electrodes 613a and 613b are formed of a Ni material by a vapor deposition technique and an etching technique. At this time, device electrodes 614a and 614b are connected by device wiring electrodes 613a and 613b and have electron emitting sections 615 interposed between device electrodes 614a and 614b facing each other. The electrdde gap G between device electrodes 614a and 614b, which is preferably 0.1 to 10 µm, is set to 2 µm in this embodiment. The length L (Fig. 9) corresponding to each electron emitting section 615 is set to 300 µm. It is preferable to reduce the width W1 (Fig. 10) of the device electrodes 614a and 614b. In practice, however, this width is preferably 1 to 100 µm, more preferably 1 to 10 µm. Each electron emitting section 615 is formed at or in the vicinity of the center of adjacent luminescent member wiring electrodes 620. The pairs of device wiring electrodes 613a and 613b are arranged with a 1 mm pitch, and electron emitting sections 615 are arranged with a 1.5 mm pitch in the direction parallel to the device wiring electrodes. Next, ultrafine particle films are formed between opposed device electrodes 614a and 614b by a gas deposition method to provide electron emitting sections 615. Pd is used as the material of the ultrafine particles. The particle material may be selected from any other materials. Among possible materials, metallic materials, such as Ag and Au, and oxide materials, such as SnO 2 and In 2 O 3 , are preferred. In this embodiment, the diameter of Pd particles is set to about 100 Å, but this is not exclusive. Ultrafine particle films can also be formed between the electrodes by methods other than the gas deposition method, e.g., a method of applying an organic metal and thereafter heat-treating this metal, which also ensures the desired device characteristics. Next, green, red and blue luminescent members 616g, 616r, and 616b are formed by a printing method to have a thickness of about 10 µm. These luminescent members are arranged in this order from a position closer to the corresponding electron emitting device 610. Luminescent members 616 may be formed by a different method, e.g., a slurry method or precipitation method. Face plate 619 is disposed on insulating substrate 612 on which the electron emitting devices and other components are formed as described above, with support frame 617 having a thickness of 5 mm interposed therebetween. Frit glass is applied between face plate 619 and support frame 617 and between insulating substrate 612 and support frame 617 and is fired at 430°C for 10 minutes or longer to bond these members. The interior of the glass container thus completed is evacuated with a vacuum pump. After a sufficient degree of vacuum has been reached, an operation for causing a current between each pair of device electrodes is performed and the glass container is finally sealed. The degree of vacuum is set to 10 -6 to 10 -7 to enable the apparatus to operate with improved stability. Next, a method of driving this apparatus will be described below. Fig. 11 is a diagram showing this driving method. When a pulse voltage of 14 V is applied between one of the pairs of device wiring electrodes 613a and 613b by a device driving circuit 641, electrons are emitted from electron emitting sections 615 of the row of electron emitting devices connected to these electrodes. Beams of electrons emitted from each electron emitting section 615 fly in the direction of the plus device electrode 614a and are thereafter changed in an on-off control manner by a ground potential or plus potential independently applied to luminescent members 616g, 616r, and 616b on the device electrode 614 side through luminescent member wiring electrodes 620 in accordance with an information signal. That is, the beam-on voltage is 100 V with respect to green luminescent member 616g, 300 V with respect to red luminescent member 616r and 500 V with respect to blue luminescent member 616b. These voltages are generated in a luminescent member driving circuit 643 based on the information signal to be applied to the luminescent wiring electrodes. The electron beam from the electron emitting device corresponding to each luminescent member to which the beam-on voltage is applied is accelerated to collide against this luminescent member to make the same emit light, thereby displaying one-line image. This applied voltage is determined by the kind of luminescent material used and the necessary luminance and is not limited to the above values. When one-line display on the luminescent members corresponding to one pair of device wiring electrodes 613a and 613b in accordance with the information signal is thereby completed, the next adjacent pair of device wiring electrodes 613a and 613b is selected, and a pulse voltage of 14 V is applied between this pair of device wiring electrodes to effect display of the next line in the same manner. This operation is repeated to form a one-frame image. That is, device wiring electrodes 613a and 613b are used as scanning electrodes, and these scanning electrodes and luminescent member wiring electrodes 620 for the groups (trios) of red, green, and blue luminescent members 616g, 616r, and 616b form an X-Y matrix to display the image. In accordance with this embodiment, each electron emitting device 610 is of a surface conduction type and is capable of being driven in response to a voltage pulse of 100 picoseconds or shorter, and therefore enables formation of 10,000 or more scanning lines in 1/30 second. Because electron beams are converged by the voltage applied to luminescent members 616 arranged on one substrate together with electron emitting devices in a horizontal direction, there is therefore no risk of electron emitting devices 610 being damaged by ion bombardment so that luminance unevenness is caused, and it is possible to uniformly form an image. That is, if a surface conduction type electron emitting device is used, electrons having an initial velocity of several bolts are emitted therefrom into a vacuum. Also, a large-screen high-definition display can be obtained at a low cost because electron emitting devices 610 and luminescent members 616 can be aligned easily and because they can be formed by the thin film manufacture techniques. Further, the distance between electron emitting sections 615 and luminescent members 616 can be determined with high accuracy, so that an image display apparatus capable of displaying a very uniform image free from luminance unevenness can be obtained. If device electrodes 614a and 614b are formed together with luminescent members 616 by a printing method, the device alignment can be effected more easily. Specifically, the apparatus is designed to irradiate a plurality of luminescent members with electron beams emitted from one electron emitting device. It is thereby possible to form pixels at a high density.

Claims: An image-forming apparatus comprising a plurality of electron emitting elements (610), and a plurality of image forming members (616) which form an image when irradiated with electron beams emitted from said electron emitting elements, wherein said electron emitting elements and said image forming members are juxtaposed on one surface of a substantially planar substrate (612), wherein a plurality of said image forming members fall into a plurality of groups, and the resulting groups (G) are arranged respectively so as to correspond to one of said electron emitting elements, wherein a voltage is applied independently to each of said image forming members of a group, and wherein a plurality of said electron emitting elements are disposed on said substrate surface so as to form an X-Y matrix and the plurality of said groups forms a corresponding matrix. An apparatus according to claim 1, wherein said image forming member comprises luminescent material which emits light when being irradiated with electrons. An apparatus according to claim 2, wherein said luminescent material comprises luminescent elements which emit light in three primary colors, red, green or blue, when being irradiated with electrons. An apparatus according to claim 2 or 3, wherein each group of said image forming members comprises one red, one green and one blue luminescent element. An apparatus according to one of the preceding claims, wherein said electron emitting elements are cold cathode emitting elements. An apparatus according to one of the preceding claims, wherein each of said electron emitting elements has electrodes (614a, 614b) disposed on said substrate surface and an electron emitting section (615) formed between said electrodes. An apparatus according to claim 6, wherein said electron emitting elements emit electrons from said electron emitting section, when a voltage is applied between said electrodes. An apparatus according to claim 6 or 7, characterized by device wiring electrodes (613a, 613b) for supplying a scanning voltage to a row of electron emitting elements of said matrix. An apparatus according to one of the preceding claims, characterized by image forming member wiring electrodes (620) arranged below said image forming members. An apparatus according to claim 9, wherein a voltage is applied to said image forming member wiring electrodes, the value of which is selected in accordance with the kind of luminescent material of the image forming member under which the image forming member wiring electrode is disposed. An apparatus according to one of the preceding claims, characterized by a face plate (619) which is connected with said surface of said substrate by a support frame (617). An apparatus according to claim 5, wherein said electron emitting elements are surface conduction type electron emitting elements. An apparatus according to claim 7, wherein said each group is located in a positive electrode side of said electron emitting element corresponding to the group. An apparatus according to claim 9, wherein a voltage having a value selected in accordance with an luminescence efficiency of the luminescent elements of said image forming member is applied to said wiring electrode. An apparatus according to claim 9, wherein a voltage having a value selected in accordance with a difference of said luminescent element of said image forming member in distance from said electron emitting element is applied to said wiring electrode.

Inventors: KANEKO TETSUYA, MISHINA SHINYA, NAKAMURA NAOTO, NOMURA ICHIRO, ONO HARUHITO, SUZUKI HIDETOSHI, TAKEDA TOSHIHIKO, KANEKO, TETSUYA, MISHINA, SHINYA, NAKAMURA, NAOTO, NOMURA, ICHIRO, ONO, HARUHITO, SUZUKI, HIDETOSHI, TAKEDA, TOSHIHIKO, KANEKO, TETSUYA, C/O CANON KABUSHIKI KAISHA, MISHINA, SHINYA, C/O CANON KABUSHIKI KAISHA, NAKAMURA, NAOTO, C/O CANON KABUSHIKI KAISHA, NOMURA, ICHIRO, C/O CANON KABUSHIKI KAISHA, Ono, Haruhito, c/o Canon Kabushiki Kaisha, SUZUKI, HIDETOSHI, C/O CANON KABUSHIKI KAISHA, TAKEDA, TOSHIHIKO, C/O CANON KABUSHIKI KAISHA
Applicants: CANON KK, CANON KABUSHIKI KAISHA
Application year: 1991
Main classification: H01J31
IPC codes: H01J3, H01J31