Semiconductor integrated circuit

Abstract: A semiconductor integrated circuit of the present invention comprises a memory cell array (AND, OR) and sense amplifiers (SAi) connected to memory cells in the memory cell array through read lines (RLi) and having a pattern width greater than the pattern width of the memory cells. The sense amplifiers are arranged in a matrix.

Description: The present invention relates to an improvement in the layout of a semiconductor integrated circuit such as a programmable logic array (PLA), and in a preferred embodiment, to an arrangement of sense amplifiers each having a pattern width greater than that of a memory cell in a memory cell array. A conventional PLA has a structure, for example, as shown in Fig. 1. In Fig. 1, numerals in0 to in2 denote input signals, 41 a control input buffer, and AND an AND array section (User programable AND array). The AND array section can program the presence/absence of connection between its input and output lines. Numerals SA10 to SA15 denote sense amplifiers having input terminals connected to the output lines of the AND array section. Symbol OR denotes an OR array section (User programable OR array). The OR array section can program the presence/absence of connection between its input lines (output lines of sense amplifiers SA10 to SA15) and its output lines. Numerals SA20 to SA23 denote sense amplifiers having input terminals connected to the output lines of the OR array section. The programming devices employed in the AND array section and OR array section are, for example, erasable programmable read-only memories (EPROMs) or electrically erasable programmable read-only memories (EEPROMs). Fig. 2 is a circuit diagram showing a circuit in which EEPROM cells 50 are used as programming devices in the AND array section. Each output line (product terms) of the AND array section is connected to a sense amplifier SAi (i=0...5) having a CMOS (complementary insulated gate type) structure. Fig. 3 is a circuit diagram showing a circuit in which EEPROM cells 50 are used as programming devices in the OR array section. Each output line (product terms) of the OR array section is connected to a CMOS sense amplifier SA2i (i=0...3). In Figs. 2 and 3, the EEPROM cell 50 is constructed such that a floating gate type memory cell transistor 51 and a memory cell selection MOS transistor 52 are connected in series. One end of the memory cell transistor 51 is connected to a read line RLi or RLi'. A control gate of the memory cell transistor 51 is connected to a control gate line CG. One end of the memory cell section transistor 52 is connected to a write line WLi or WLi'. In the AND array section, a gate of each memory cell selection transistor 52 is connected to one of complementary output lines RG0, RG0 to RG2, RG2 of the control input buffer 41. In the OR array section, the gate of each memory cell selection transistor 52 is connected to one of outputs 0 to 5 of sense amplifiers SA10 to SA15. Each of the CMOS sense amplifiers SA1i and SA2i, when they have static structures as shown in Figs. 2 and 3, comprises seven P-channel transistors TP and four N-channel transistors TN. In addition, complementary pre-charge signals PR, PR are used as control signals. Normally, each memory cell 50 is fabricated with a minimum design standard. By contrast, the sense amplifier SA1i (SA2i) cannot be manufactured with a minimum design standard. The reason is that the sense amplifiers SA1i and SA2i must sense a slight change in the state of the read line RLi connected to memory cell 50 and also quickly amplify and transmit the signal of the read line RLi. Furthermore, the sense amplifier SAli (SA2i) requires 11 transistors in relation to the two transistors 51 and 52 of memory cell 50. Thus, the pattern width of the sense amplifier SA1i (SA2i) is considerably greater than that of the memory cell 50. In the conventional PLA, however, the sense amplifiers SA1i (SA2i) connected to corresponding output lines are arranged in a line. The pattern of the PLA shown in Fig. 1 is shown in Fig. 4. As can be understood from Fig. 4, the total width of the sense amplifiers on the output side of the AND array section is greater than the total width of the AND array width and control input buffer. Similarly, the total width of the sense amplifiers on the output side of the OR array section is greater than the total width of the OR array section. In addition, a wiring region 70 must be provided to connect the memory cells 50 and the sense amplifiers SA1i and SA2i. The wiring region 70 becomes larger, as the ratio of the total width of the sense amplifiers to that of the memory cells increases and as the number of output lines increases. The increase in wiring region 70 incurs the increase in die size of the PLA integrated circuit. Further, the read lines RLi and RLi' connected to the memory cells 50 become longer. As a result, the load capacitance and resistance of read lines RLi and RLi' increase and the read-out operation speed cannot be increased. The present invention has been devised to solve the above problem, and its objects, which are satisfied by preferred embodiments of the invention, are to make the width of the memory cell array smaller than the total width of the sense amplifiers, to reduce the wiring region for connecting the memory cells and the sense amplifier, to reduce the die size and to increase the read operation speed. Reference is made to EP-A-0 031 659 and US-A-4 456 977, each of which discloses a dynamic type RAM (DRAM) wherein amplifiers for amplifying data of the memory cells are arranged in a matrix. According to the invention there is provided a programmable logic array in the form of a semiconductor integrated circuit comprising: an AND array section comprising a matrix of cells, each of which is constituted by a program element and a selection transistor, an OR array section comprising a matrix of cells, each of which is constituted by a program element and a selection transistor, a plurality of first sense amplifiers, provided between said AND array section and said OR array section, for receiving output signals output from said AND array section and supplying the output signals to said OR array section, and a plurality of second sense amplifiers, provided in a region adjacent to said OR array section, for receiving output signals output from said OR array section, said first sense amplifiers being arranged in a matrix and said second sense amplifiers being arranged in a matrix. This invention can be more fully understood from the following detailed description, given by way of example, when taken in conjunction with the accompanying drawings, in which: Fig. 1 is a block diagram showing a basic structure of a PLA; Fig. 2 is a circuit diagram showing one output line of the AND array section shown in Fig. 1, in which EEPROM cells are used as programming devices, and a sense amplifier connected to the output line; Fig. 3 is a circuit diagram showing one output line of the OR array section, in the case where EEPROM cells are used as programming devices in the OR array section (in Fig. 1), and a sense amplifier connected to the output line; Fig. 4 shows a conventional design pattern of the PLA shown in Fig. 1; Fig. 5 shows a pattern of a PLA according to an embodiment of the present invention; Fig. 6 shows a pattern in which power lines are arranged within the sense amplifier array shown in Fig. 5; and Figs. 7 and 8 show patterns of ALAS according to other embodiments of the invention. Embodiments of the present invention will now be described with reference to the accompanying drawings. Fig. 5 shows a basic structure of a PLA according to an embodiment of the invention. The PLA structure of Fig. 5 differs from that of Fig. 4 in that sense amplifiers SAi are arranged in a plurality of lines in the region except the signal wiring region. Specifically, there are provided a first sense amplifier array 11 and a second sense amplifier array 12. In Figs. 1 and 4, common structural elements are denoted by like reference numerals, and a detailed description thereof is omitted. In the PLA shown in Fig. 5, the AND array section AND has six input lines and six output lines. The sense amplifiers SA10 to SA15 composing the first sense amplifier array 11 are arranged in a matrix of 3 × 2. The OR array section OR has six input lines and four output lines. The sense amplifiers SA20 to SA23 constituting the second sense amplifier array 12 are arranged in a matrix of 2 × 2. The sense amplifier SA10 (in the first row and first column) in the first sense amplifier array 11 has an input terminal connected to the first output line of the AND array section AND and an output terminal connected to the first input line of the OR array section OR. The sense amplifier SA11 (in the first row and second column) has an input terminal connected to the second output line of the AND array section AND and an output terminal connected to the second input line of the OR array section OR. The sense amplifier SA12 (in the second row and first column) has an input terminal connected to the third output line of the AND array section AND and an output terminal connected to the third input line of the OR array section OR. The sense amplifier SA13 (in the second row and second column) has an input terminal connected to the fourth output line of the AND array section AND and an output terminal connected to the fourth input line of the OR array section OR. The sense amplifier SA14 (in the third row and first column) has an input terminal connected to the fifth output line of the AND array section AND and an output terminal connected to the fifth input line of the OR array section OR. The sense amplifier SA15 (in the third row and second column) has an input terminal connected to the sixth output line of the AND array section AND and an output terminal connected to the sixth input line of the OR array section OR. The first output line of the OR array section OR is connected to an input terminal of the sense amplifier SA20 (in the first row and first column) of the second sense amplifier array 12. The second output line is connected to an input terminal of the sense amplifier SA21 (in the first row and second column). The third output line is connected to an input terminal of the sense amplifier SA22 (in the second row and second column). The fourth output line is connected to an input terminal of the sense amplifier SA23 (in the second row and second column). As can be seen from Fig. 5, the total width of the sense amplifiers in the first sense amplifier array 11 (the longitudinal length of the sense amplifier array) is smaller than the total of the width of the AND array and the width of the control input buffer. The total width of the sense amplifiers in the second sense amplifier array 12 is substantially equal to the width of the OR array. The total length (in the row direction) of the OR array section OR and second sense amplifier array 12 is substantially equal to the total width of the AND array and control input buffer. The sense amplifiers SA10 to SA15 of the first sense amplifier array 11 are arranged in a matrix of 3 × 2, on the output side of the AND array section AND having six input lines and six output lines. Thus, a wiring region for connecting the AND array section AND and first sense amplifier array 11 is made unnecessary. The sense amplifiers SA20 to SA23 of second sense amplifier array 12 are arranged in a matrix of 2 × 2, on the output side of the OR array section OR having six input lines and four output lines. Thus, a wiring region for connecting the OR array section OR and second sense amplifier array 12 is made unnecessary. Accordingly, compared to the construction shown in Fig. 4, the chip size can be remarkably reduced and the read lines RLi and RLi' extending from memory cells 50 can be shortened. In addition, the load capacitance and resistance of the PLA are decreased and the operation speed is increased. As is shown in Fig. 6, within the sense amplifier array, a first power line VDD can be situated at least at one space between rows or columns. In addition, a second power line VSS can be situated at least at another space between rows or columns. This makes it possible to efficiently arrange the power lines within the PLA chip. The above embodiment is directed to the PLA having both AND array section AND and OR array section OR. The present invention, however, is also applicable to a PLA having at least either AND array section AND or OR array section OR. In general, the present invention is advantageously applicable to the case where the width of the sense amplifier array becomes greater than the total width of the memory cells and cell control input circuit when the sense amplifiers are arranged in a matrix, as well as to the case where the width of the wiring region for connecting the memory cells and sense amplifiers becomes greater than the width of the sense amplifier array. Fig. 7 shows a part of a PLA according to another embodiment of the invention. This embodiment is designed to decrease a delay in transmission of signals due to the parasitic capacitance of output signals. Each output line is divided lengthwise into portions. The output lines are connected to the corresponding input terminals of the sense amplifiers SAi. The outputs of the sense amplifiers SAi are supplied to OR gates 20, thus obtaining a logical sum. In this way, this invention is applicable to the case where one or more read lines RLi are connected to one row or one column of the memory cell array and the sense amplifiers SAi are connected to the corresponding read lines RLi. The present invention is also applicable to a PLA having a structure as shown in Fig. 8. In Fig. 8, one sense amplifier SAi is fabricated so as to have a width corresponding to a plurality (m) of rows (or columns) in the memory cell array. The m-rows in the memory cell array are connected selectively to one sense amplifier SAi by means of selection switch transistors SW. The present invention is not limited to the above-described PLAs. For example, this invention is applicable to a semiconductor integrated circuit comprising a memory cell array and sense amplifiers having a pattern width greater than that of the memory cell array. By arranging the sense amplifiers in a matrix, the aforementioned advantages can be obtained. According to the present invention, the sense amplifiers are arranged in a matrix, and the total width of the sense amplifiers in the sense amplifier array is less than the width of the memory cell array. Thus, the wiring region for connecting the memory cell array and sense amplifier array can be made unnecessary. Accordingly, the die size can be remarkably reduced, and the read lines from the memory cells can be shortened. In addition, the load capacitance and resistance of the read lines can be decreased and the read operation speed can be enhanced.

Claims: A programmable logic array in the form of a semiconductor integrated circuit comprising: an AND array section (AND) comprising a matrix of cells, each of which is constituted by a program element (51) and a selection transistor (52); an OR array section (OR) comprising a matrix of cells, each of which is constituted by a program element and a selection transistor; a plurality of first sense amplifiers (SA10 to SA15), provided between said AND array section (AND) and said OR array section (OR), for receiving output signals output from said AND array section (AND) and supplying the output signals to said OR array section (OR); and a plurality of second sense amplifiers (SA20 to SA23), provided in a region adjacent to said OR array section (OR), for receiving output signals output from said OR array section (OR); said first sense amplifiers (SA10 to SA15) being arranged in a matrix, and said second sense amplifiers (SA20 to SA23) being arranged in a matrix. A programmable logic array according to claim 1, characterised in that said OR array section (OR) is square, said first sense amplifiers (SA10 to SA15) are arranged on a first side of said OR array section (OR), said second sense amplifiers (SA20 to SA25) are arranged on a second side of said OR array section (OR), and said first side adjoins said second side.

Inventors: MURAKAMI HIROAKI, TAKIBA AKIRA, MURAKAMI, HIROAKI, TAKIBA, AKIRA, MURAKAMI, HIROAKI, C/O INTELLECTUAL PROPERTY DIV., TAKIBA, AKIRA, C/O INTELLECTUAL PROPERTY DIV.
Applicants: TOSHIBA KK, KABUSHIKI KAISHA TOSHIBA
Application year: 1991
Main classification: H03K19
IPC codes: G11C16, H01L21, H01L27, G11C7, G11C5, G11C17, H03K19