Semiconductor device comprising a plurality of LED chips

Abstract: The semiconductor of the present invention includes the first lead electrode (101E) having a tip portion on which a plurality of semiconductor elements (102A-102D) are arranged, a plurality of the second lead electrodes (101A-101D) each having a tip portion located close to the tip portion of the first lead electrode, bonding wires (103) for electrically connecting the semiconductor elements and the tip portions of the second lead electrodes with each other, and a mold resin (104) for covering at least the tip ends of the first and second lead electrodes. Further, the invention is characterized in that the second lead electrodes are not arranged in a straight line in the plane common to the end surfaces thereof, and that the second lead electrodes are arranged in a straight line in a plane which is parallel to any of the end surfaces thereof.

Description: The present invention relates to a remodeled version of an optical semiconductor device in which a plurality of semiconductor elements are arranged on the end surface of the tip portion of a lead electrode, and a connecting area for a bonding wire, i.e. a bonding area, is formed on the end surface of the tip portion of each of other lead electrodes. Figs. 1 and 2 show conventional LED lamps, which are a type of optical semiconductor device in which a plurality of semiconductor elements are arranged on the end surface of the tip portion of a lead electrode, and a bonding area is formed on the end surface of the tip portion of each of other lead electrodes. The LED lamp shown in Fig. 1 includes three lead electrodes. One is a mount-use lead electrode 501 on the end surface of the tip portion of which a plurality of semiconductor elements, i.e. LED chips, are arranged, and the other two are bond-use lead electrodes 502 on the end surface of the tip portion of each of which a bonding area is formed. The mount-use lead electrode 501 is provided between the bond-use lead electrodes 502. Two LED chips 503 are arranged on the end surface of the tip portion of the mount-use lead electrode 501. Each of the LED chips 503 is connected to each of the bond-use lead electrodes 504 via a bonding wire 504. The bond-use lead electrodes 502 are arranged so that they locate both sides of the mount-use lead electrode at the angle of 180° with respect to each other. With this structure, the bonding wires 504 are not contact with each other, and the two LED chips 503 are separately operated. On the other hand, the LED lamp shown in Fig. 2 includes four lead electrodes. One is a mount-use lead electrode 501 on the end surface of the tip portion of which a plurality of LED chips are arranged, and the other three are bond-use lead electrodes 502 on the end surface of the tip portion of each of which a bonding area is formed. Three LED chips are arranged on the end surface of the tip portion of the mount-use lead electrode 501, and each of the LED chips 503 is connected to each of the bond-use lead electrodes 502 via a bonding wire 504. The three bond-use lead electrodes 502 of this LED lamp are arranged so that the end surfaces of the tip portions thereof make a straight line. With this structure, the bonding wires 504 locate inevitably very close to each other, and sometimes come cross with each other. JP-A-59-159577 describes an optical semiconductor device having three leads which are arranged in an almost straight line. JP-A-61-139079 describes an optical semiconductor device having three conductors inserted and fastened to a resin base in such a manner that one end surfaces of the leads shape approximately the same surface, without forming a straight line. EP-A-0 198 621 describes a semiconductor device comprising a first lead electrode on which a plurality of semiconductor elements are arranged, a plurality of second lead electrodes each having a tip portion located close to said first lead electrode, and bonding wires for electrically connecting said semiconductor elements to the tip portions of said second lead electrodes whereby said second lead electrodes are arranged such that the end surfaces of the tip ends thereof are not arranged in a straight line. It is an object of the present invention to provide an optical semiconductor device of the above-described type, in which on the one hand a plurality of bonding wires do not contact or close with each other, and on the other hand is easy in being mounted. According to the present invention, this object solved by providing an optical semiconductor device having the features of claim 1. Further improvements of the invention may be seen from the sub-claims to said claim. An optical semiconductor device according to the invention comprises a first lead electrode having a tip portion on an end surface of the tip portion a plurality of semiconductor elements being arranged, a plurality of second lead electrodes each having a tip portion located close to the tip portion of the first lead electrode, bonding wires for electrically connecting the semiconductor elements to the tip portions of the second lead electrodes, and a mold resin for covering at least the tip portions of said first and second lead electrodes, said second lead electrodes being arranged such that the end surfaces of the tip ends thereof are not arranged in a straight line. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: Figs. 1 and 2 show the appearances of conventional semiconductor devices; Fig. 3 is a front view of a semiconductor device according to an embodiment of the present invention; Fig. 4 is a side view of the semiconductor device according to the embodiment; Fig. 5 is a top view of the semiconductor device according to the embodiment; Fig. 6 is an overall view of the semiconductor device according to the embodiment; Figs. 7A and 7B depict lead electrodes in the planes 105 and 106 shown in Fig. 6, respectively; and Figs. 8 and 9 are side views showing semiconductor devices according to other embodiments of the present invention. An embodiment of the present invention will now be described in detail with reference to accompanying drawings. Figs. 3, 4, and 5 show an LED lamp according to an embodiment of the present invention, and are front, side, and top views of the LED lamp, respectively. As can be seen in Figs. 3-5, the LED lamp includes five lead electrodes 101A-101E. Of all the lead electrodes, one located at the center is a mount-use lead electrode 101E on the end surface of the tip portion of which four LED chips 102A-102D are arranged. The other four lead electrodes are bond-use lead electrodes 101A-101D on the end surface of the tip portion of each of which a connecting portion for a bonding wire is formed. The LED chips 102A-102D are connected to the bond-use lead electrodes 101A-101D, respectively, via bonding wires 103. The proximal end section of the lead electrodes 101A-101E group is sealed by a mold resin 104. In the meantime, the mount-use lead electrode 101E and the bond-use lead electrodes 101A-101E constitute, for example, a lead frame. Therefore, as can be seen in Figs. 6 and 7, the lead electrodes 101A-101E are aligned in a plane parallel to the end surfaces of the tip portions, for example, the plane denoted by reference numeral 105 in each of Figs. 6 and 7A. However, the LED lamp of the present invention is characterized in that, of the planes parallel with the end surfaces of the tip portion, there are some on which a plurality of lead electrodes are not aligned. For example, the lead electrodes 101A-101E are not aligned at least in the parallel planes located near the tip portion, as of the planes denoted by numeral reference 106 in Figs. 6 and 7. With this structure, the bond-use lead electrodes 101A-101D can be connected to the LED chips 102A-102D without the bonding wires 103 being brought into contact with each other. Such an LED lamp can be manufactured by bending bond-use lead electrodes 102 which are next to the mount-use lead electrode 101E at bending points A and B located in the mold resin 104, as can be seen in Figs. 3 and 4 under the condition that the end surface of the tip portion of each of the bond-use lead electrodes 101A-101D becomes parallel with that of the mount-use lead electrode 101E (note that the end surface of the mount-use lead electrode 101E has a plate-like shape, on which the LED chips 102A-102D are arranged). Fig. 8 shows an LED lamp according to another embodiment of the present invention. This LED lamp includes bond-use lead electrodes 101A and 101B which are bent at bending points A and B both located outside a mold resin 104. Fig. 9 shows an LED lamp according to another embodiment of the present invention. This LED lamp is of a type wherein section of lead electrodes located outside a mold resin 104, i.e. outer leads, are not aligned on a plane which is parallel to the end surface of the tip portion of each of the lead electrodes. Such an LED lamp can be manufactured, for example, by bending lead electrodes 101A and 101B at bending points C and D by a lead forming method. Thus, an adjustment of pitch of the lead electrodes 101A-101E can be easily performed. As described, according to the present invention, the tip portions of the bond-use lead electrodes 101A-101D can be two-dimensionally arranged. Therefore, even if three or more LED chips are mounted on the mount-use lead electrode, large loops as well as crossings of bonding wires can be avoided. Thus, the bonding process can be easily performed.

Claims: An optical semiconductor device, comprising a first lead electrode (101E) having a tip portion, on an end surface of which a plurality of semiconductor elements (102A to 102D) are arranged; at least three second lead electrodes (101A to 101D) each having a tip portion adjacent to the tip portion of said first lead electrode (101E), the end surfaces of the tip portions of said first and second lead electrodes (101E, 101A to 101D) facing in one direction; bonding wires (103) electrically connecting said semiconductor elements (102A to 102D) to the tip portions of said second lead electrodes (101A to 101D); and a mold resin (104) covering at least the tip portions of said first and second lead electrodes (101E, 101A to 101D) ; said first and second lead electrodes (101E, 101A to 101D) being formed such that they form a straight line in at least one plane (105) parallel to the tip portions of said first and second lead electrodes (101E, 101A to 101D) ; but that the centers of the tip portions of said second lead electrodes (101A to 101D) are not arranged in a straight line. The optical semiconductor device as claimed in claim 1, wherein said first and second lead electrodes (101E, 101A to 101D) each comprise sections which respectively are located outside said mold resin (104) and form a straight line in at least one plane (105) parallel to the tip portions of said first and second lead electrodes (101E, 101A to 101D). The optical semiconductor device as claimed in claim 1, wherein said first and second lead electrodes (101E, 101A to 101D) each comprise sections which respectively are located outside said mold resin (104) and form a non-straight line in at least one plane parallel to the tip portions of said first and second lead electrodes (101E, 101A to 101D). The optical semiconductor device as claimed in claim 1, wherein said first and second lead electrodes (101E, 101A to 101D) each comprise sections which respectively are located within said mold resin (104) and form a non-straight line in at least one plane parallel to the tip portions of said first and second lead electrodes (101E, 101A to 101D).

Inventors: TAKAHASHI NOZOMU, TAKAHASHI, NOZOMU, Takahashi, Nozomu, c/o Intellectual Property Div.
Applicants: TOSHIBA KK, KABUSHIKI KAISHA TOSHIBA
Application year: 1991
Main classification: H01L33
IPC codes: H01L25, H01L33