Semiconductor memory device

Abstract: In a semiconductor memory device having memory cells (21 i , 21 i+1 disposed at intersections of bit lines (BL, BL ) and word lines (WL i , WL i+1 ) and operating on an internal power source voltage (V D ) which is lower than an external power source voltage for the memory device, sense amplifiers (41) are activated by a voltage on a drive common node (NS), and a comparator (110) is activated by the control signal (PAS) and compares the voltage on the common node (PS) with the internal power source voltage (V D ). The comparator has an output which is in a first state when the common node (PS) voltage is not higher than the reference voltage (V R ) and which is in a second state when the common node (PS) voltage exceeds the reference voltage (V R ). A latch circuit (120) is turned from a first state to a second state when the control signal (PAS) is turned active, thereby to activate the comparator (110) and a power source supply circuit (130, 132) which then supplies a drive voltage to the common node (PS). The latch circuit is turned from the first state to the second state when the output of the comparator (110) is turned to the second state. The latch circuit deactivates the comparator (110) when it is turned to the first state.

Description: The present invention relates to a circuit for supplying charge to a sense amplifier in a memory device during a memory read operation, in particular for a device such as a dynamic RAM (random access memory) or a static RAM. A circuit for reducing power consumption in the drive lines of a semiconductor memory is disclosed in US-A-4 873 673. Another conventional technique in this field is disclosed in Technical Paper of the Institute of Electronics, Information and Communication Engineers of Japan, 89n[67] (1989-6-2), Koike, et al "55ns 16Mb DRAM with Built-in-Self-Test Function Using Micro-Program ROM", pp. 79-80. As described in this publication, the cell size of a semiconductor memory device, e.g., a dynamic RAM of a large capacity, is small, so the breakdown voltage of the transistor forming the cell array is low. To improve the reliability, the power source voltage V CC (e.g. 5 V) needs to be lowered. Accordingly, use is made of a power source supply control section which produces, from the externally-supplied power source voltage (primary or main power source voltage) V CC an internal (secondary or auxiliary) power source voltage VD (e.g. 3.3V), which is then used for driving the memory cell array. An example of such a dynamic RAM is shown in Fig. 2. Fig. 2 is a circuit diagram of the pertinent portion of the conventional semiconductor memory device. The semiconductor memory device is a dynamic RAM, comprising a memory cell array section 10, and a power source supply control section 60 for supplying a drive voltage to the memory cell array 10. The memory cell array section 10 comprises a data storage memory cell section 20, a transfer gate section 30 for transferring data of the memory cell section 20, a sense amplifier section 40 for sensing and amplifying a minute read voltage from the memory cell section 20, and a column decode section 60 for selecting the output of the sense amplifier section 40. In the memory cell section 20, a plurality of memory cells (only two of them, 21 i , 21 i+1 , being illustrated) are disposed in a matrix arrangement, at intersections of a plurality of pairs of bit lines, such as BL, BL , a plurality of word lines, such as WL i , WL i+1 . The memory cells 21 i , 21 i+1 and so on are formed of MOS transistors having a short gate length, so it is made to operate on an internal or auxiliary power source voltage V D (e.g., 3.3V) of a lower level than the main power source V CC (e.g., 5V). The transfer gate section 30 is comprised of a plurality of pairs of n-channel MOS transistors (hereinafter referred to as NMOSTs) 31, 32 and so on, and which are turned on and off on the basis of a control signal TG to couple or isolate the pairs of bit lines BL, BL , etc. and the pair of sense amplifier nodes SA, SA , etc. The drains of the NMOSTs 31 and 32 are connected to the bit lines BL, BL , and their sources are connected to the sense amplifier nodes SA, SA , and their gates are commonly connected to receive the control signal TG. The sense amplifier section 40 is comprised of a plurality of p-channel sense amplifiers 41 and so on, and n-channel sense amplifiers 42 and so on, connected to the respective pairs of bit lines BL, BL . For instance, the p-channel sense amplifiers 41 are comprised of two p-channel MOS transistors (hereinafter referred to as PMOSTs) 41a and 41b. The PMOST 41a has its drain connected to the sense amplifier node SA, its source connected to sense amplifier drive common node PS, and its gate connected to the sense amplifier node SA . The PMOST 41b has its drain connected to the sense amplifier node SA , its source connected to the common node PS, and its gate connected to the sense amplifier node SA. The n-channel sense amplifiers 42 are comprised of two n-channel MOSTs 42a and 42b. The NMOST 42a has its drain connected to the sense amplifier node SA, its source connected to sense amplifier drive common node NS, and its gate connected to the sense amplifier node SA . The PMOST 42b has its drain connected to the sense amplifier node SA , its source connected to the common node NS, and its gate connected to the sense amplifier node SA. The column decode section 50 comprises a plurality of pairs of NMOSTs 51, 52 for connecting and disconnecting the pairs of the sense amplifier nodes SA, SA and so on, and the pairs of data lines DB, DB and so on, and their gates are controlled by the column decoder output signal CL. The power source supply control section 60 comprises a current mirror amplifier 70 serving as a comparing and amplifying means, and PMOST 80 and NMOST 81 serving as a power source supply means. The current mirror amplifler 70 is activated by a control signal PAS, and compares and amplifies the voltage on the p-channel sense amplifier drive common node PS and a reference voltage V R of the same level as the auxiliary power source voltage V D . It is comprised of two PMOSTs 71 and 72, and three NMOST 73, 74 and 75. The PMOST 80 serving as the power supply means has its drain and source respectively connected to the main power source voltage V CC and the common node PS, and its gate connected to the output of the amplifier 70. The NMOST 81 has its drain and source connected to the ground potential V SS and the n-channel sense amplifier drive common node NS, and its gate connected to receive the control signal PAS. The operation of the circuit shown in Fig. 2 is described with reference to Fig. 3. The read operation in which the memory cell 21 i is selected is as follows: First, at time t0, the word line WL i is raised to the High level, V D +Vt+α (Vt: threshold voltage of NMOST; and α : a certain predetermined margin), and data is read from the memory cell 21 i to the bit line BL. As a result, the potential on the bit line BL and the sense amplifier node SA varies by the amount of the read signal from the precharge level (e.g., V D /2). At time t1, the control signal PAS is raised to the High level (=V CC ), and the NMOST 81 is turned on, and the n-channel sense amplifier drive common node NS varies to the Low level (=V SS ). At the same time, the NMOST 75 is turned on, and the amplifier 70 is activated, and by virtue of the Low level output of the amplifier 70, the PMOST 80 is turned on, and the p-channel sense amplifier drive common node PS is pulled up to the High level (=V D ). As a result, by the sensing and amplifying action of the p-channel sense amplifier 41 and the n-channel sense amplifier 42, charging and discharging of the pair of the sense amplifier nodes SA, SA and the pair of bit lines BL, BL are commenced. At time t2, the common node PS reaches the V D level and the output of the amplifier 70 rises to the High level, and the PMOST 80 is turned off, and supply of electric charge from the main power source voltage V CC to the p-channel sense amplifier 41 is terminated. The parasitic capacitance (=RC value) of the pair of bit lines BL, BL is large compared with the parasitic capacitance of the pair of sense amplifier nodes SA, SA . Accordingly, accompanying the rise in the level of one of the bit lines BL, BL having the higher potential (e.g.,, BL ), the level of one of the sense amplifier nodes SA, SA having the higher potential (e.g., SA ), and the level of the common node PS are lowered, and the PMOST 80 is again turned on. The PMOST 80 is thus turned on and off repetitively several times, and up to time t4 when the bit line BL having the higher potential reaches the V D level, electric charge to the p-channel sense amplifier 41 is intermittently supplied. At time t3, after the potential difference between the pair of sense amplifier nodes SA, SA becomes sufficient, the column decoder output signal CL is raised, and the NMOST 51 and 52 are turned on, and the read data is transferred to the pair of data lines DB, DB . In preparation for rewriting in the memory cell 21 i , the control signal TG is raised to the level of V D +Vt+α . Then, at time t4, the potential on the bit lines BL, BL become equal to the potentials on the sense amplifier nodes SA, SA . The data on the sense amplifier nodes SA and SA are thereby rewritten in the memory cell 21 1 . The word line is thereafter lowered. The device of the above-described configuration had the following drawbacks. (i) In the conventional device, the control signal PAS is raised to the High level at time tl, to activate the current mirror amplifier 70, so that the amplifier 70 is kept activated. The power consumption at the amplifier 70 is therefore large. (ii) The PMOST 80 is repetitively turned on and off during time t2 to t4, and electric charge is repetitively supplied from the main power source V CC to the p-channel sense amplifier 41 so time required for completing charging of the bit line BL or BL is long. An object of the present invention is to provide a semiconductor memory device in which the power consumption at the current mirror amplifier is reduced, and the time for completing the charging of the bit line is shortened. To solve the problems described above, the invention provides circuit as specified in claim 1 for supplying charge to a sense amplifier in a memory device during a memory read operation, comprising: a main source of charge switchable between an on state and an off state; a source for a control signal (PAS); and comparing means, including means to enable and inhibit operation thereof, for comparing the voltage at a node (PS, N9) supplied with charge by said source of charge, with a reference voltage (VR) and outputting a signal dependent on said comparison for use in switching the source; characterised by latch means for turning on the source of charge and causing the comparing means to be enabled in response to a predetermined change in the control signal (PAS), and for turning off the source of charge and causing the comparing means to be inhibited in response to a predetermined change in the signal output by the comparing means. When the control signal changes to a given state, the latch means changes state, and the comparing means and the main charge source are thereby activated. The main source then supplies charge to the node, for activating the sense amplifier so that it can sense and amplifies a small bit line potential for the memory. The potential on the node may be compared with the reference voltage by the comparing means, and when the potential on the common node is raised to a given level, the latching means may be returned to its initial first state. Then, the operation of the comparing means may be terminated. The period for which the comparing means is activated is therefore shortened, and the power consumption is reduced. A semiconductor memory incorporating the inventive circuit may further be provided with an auxiliary charge source operative to supply charge to the node when the control signal is in a predetermined state and the main source of the charge is in its off state. The auxiliary source may be activated to supply a drive voltage to the node. This drive voltage may be supplied continuously via the node to a memory sense amplifier that senses and amplifies data from memory cells of the device via bit lines, so the time taken to complete the charging, for example, of a bit line is shortened, and the operation speed is further increased. The semiconductor memory may further be provided with a monitoring circuit for monitoring the transfer of charge from the bit lines to the sense amplifiers during a memory ready operation and for enabling operation of the comparing means in response thereto. The potential circuit and the monitors the voltage level on the bit line, on the basis of the voltage at the node. The result of monitoring lags behind the voltage rise, for example on the node. The lagging result of monitoring is compared with the reference voltage at the comparing means, so the operation for returning the latching means to its initial responsive to the output of the comparing means, lags, and, as a result, the first power source supply means continues supplying the drive voltage for a longer period, and raises the common node above the second power course voltage. As a result, the charging and discharging of the bit line by the sense amplifier are made at a higher speed. In order that the invention may be more fully understood two embodiments will now be described, reference being had to the accompanying drawings, in which: Fig. 1 is a circuit diagram showing the pertinent portion of a semiconductor memory device of a first embodiment of the invention. Fig. 2 is a circuit diagram showing the pertinent portion of the semiconductor memory device in the prior art. Fig. 3 is a waveform diagram showing the operation of the circuit of Fig. 2. Fig. 4 is a circuit diagram showing a one-shot pulse generating circuit in Fig. 1. Fig. 5 is a waveform diagram showing the operation of the circuit of Fig. 1. Fig. 6 is a circuit diagram showing the pertinent portion of a second embodiment of the invention. Fig. 7 is a waveform diagram showing the operation of the circuit of Fig. 6. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment Fig. 1 is a circuit diagram of the pertinent portion of the semiconductor memory device of an embodiment of the invention. Elements common with the elements in the prior art of Fig. 2 are given identical reference marks. The semiconductor memory device is a dynamic RAM, and comprises a memory cell array section 10 identical to that of the prior art, and a power source voltage supply control section 100 which differs from that of the prior art. The power source voltage supply control section 100 supplies a drive voltage to the memory cell array 10, and is comprised of a comparator 110, which also has the function of amplification, a latch circuit 120, serving as a latching means, inverters 130 and 131 for inverting the signal, a PMOST 132 and an NMOST 134 serving as a main power source supply means, and a PMOST 133 serving as an auxiliary power source supply means. The NMOST 134 serves also as part of the auxiliary power source supply means. The comparator 110 is in the form of a current mirror amplifier which compares and amplifies the reference voltage V R (the same level as the auxiliary voltage V D <V CC ) and the voltage on the p-channel sense amplifier drive common node PS, and is comprised of PMOSTs 111 and 112, and NMOSTs 113, 114 and 115 connected as illustrated. The sources of the PMOSTs 111 and 112 are connected to the power source voltage V CC , and their gates are commonly connected to the drain node N1 of the PMOST 112. The source node N1 of the PMOST 112 is connected via the NMOST 113 to a node N3, and the gate of the NMOST 113 is connected to the common node PS. The drain node of the PMOST 113 is connected via the NMOST 114 to the node N3. The gate of the NMOST 114 is connected to the reference voltage V R . The node N3 is connected via the NMOST 115 to the ground potential V SS . The node N2 is connected to the latch circuit 120. The latch circuit 120 latches the rise of the High level, for example, of the control signal PAS. In other words, the latch circuit 120 can assume either of a first state and a second state, and is turned from the first state to the second state when the control signal PAS rises from the Low level to the High level, and is turned from the first state to the second state when the output of the comparator 110 at the node N2 rises. When the latch circuit 120 is in the second state, its output, at a node N6, is High to activate the comparator 110 and turns on the PMOST 132. When the latch circuit 120 is in the first state, its output, at the node N6, is Low to deactivate the comparator 110 and turn off the PMOST 132. The latch circuit 120 is comprised of one-shot pulse generator circuits 121 and 122, and NAND gates 124 and 125. The control signal PAS is connected via the one-shot pulse generator circuit 121 to the node N4, which is connected to one input of the NAND gate 124. The output of the NAND gate 124 is connected to the node N6, which is connected to one input of the NAND gate 125. The control signal PAS is connected to another input of the NAND gate 125. A third input of the NAND gate 125 is connected to a node N8, which is connected to the output of the one-shot pulse generator circuit 122, of which the input is connected to the node N2, later described. The output of the NAND gate 125 is connected to a node N5, which is connected to a second input of the NAND gate 124. In this way, the NAND gates 124 and 125 are crossed coupled. The node N6 is connected via the inverter 130 and the node N7 to the gate of the PMOST 132, and the source of the PMOST 132 is connected to the power source voltage V CC , and its drain is connected to the p-channel sense amplifier drive common node PS. The control signal PAS is connected via the inverter 131 to the gate of the PMOST 133, and the source of the PMOST 133 is connected to the auxiliary power source voltage V D , and its drain is connected to the common node PS. The control signal PAS is connected to the gate of the NMOST 134, and the source of the NMOST 134 is connected to the ground potential V SS , and its drain is connected to the n-channel sense amplifier drive common node NS. Fig. 4 is a circuit diagram showing an example of the one-shot pulse generator circuit 121 or 122 in Fig. 1. The one-shot pulse generator circuit 121 or 122 is a circuit for generating an inverted single pulse at the rising edge of the input signal, and is comprised of a cascaded inverters 140 to 142, and capacitors 143 to 145 connected between the outputs of the inverters 140 to 142 and the ground potential V SS , and a NAND gate 146 performing a logical NAND operation on the input signal and the output signal of the inverter 142. The operation of the circuit shown in Fig. 1 will now be described with reference to Fig. 5. The reading operation in the case when the memory cell 21 i in Fig. 1 is selected will now be described. At time t0, the word line WL i is raised to the High level, V D +Vt+α (Vt: threshold voltage of NMOST; and α : a certain predetermined margin), and data is read from the memory cell 21 i to the bit line BL. As a result, the potential on the bit line BL and the sense amplifier node SA varies by the amount of the read signal from the precharge level (V D /2). At time t1, the control signal PAS is raised to the High level (=V CC ), then the NMOST 134 is turned on and the PMOST 133 is turned on via the inverter 131. Furthermore, responsive to the rise of the control signal PAS, an inverted one-shot pulse is output from the one-shot pulse generator circuit 121 to the node N4. The fall of the node N4 is transferred through the NAND gates 124 and 125, and the output node N6 of the NAND gate 124 rises, and the output node N5 of the NAND gate 125 falls. The crossed-coupled NAND gates 124 and 125 are held in this state. Thus, the latch circuit 120 is turned from the first state to the second state responsive to the rise of the control signal PAS and is held in the second state. The rise of the node N6 is transferred through the inverter 130 and the node N7, and the PMOST 132 is turned on, and the NMOST 115 is turned on, and the comparator 110 is activated. As the NMOST 115 is turned on a current flows through the node N2, the NMOST 114, the node N3, and the NMOST 115 and to the ground V SS . As a result, the potential on the node N2 falls a little. As the NMOST 134 is turned on, the n-channel sense amplifier drive common node NS is pulled down to the ground level V SS . Furthermore, as the PMOST 132 is turned on, the p-channel sense amplifier drive node PS is raised toward the auxiliary power source voltage V D level. Then, the p-channel sense amplifier 41 and the n-channel sense amplifier 42 are activated, and because of their sensing and amplifying operation, one of the sense amplifier nodes, e.g., SA , and one of the bit line, e.g., BL , which are higher are charged and those which are lower, e.g., SA and BL, are discharged. At time t2, when the p-channel sense amplifier drive common node PS reaches the V D level, the node N2 will be at the power source voltage V CC level. That is, when the common node PS reaches the V D level, the node N1 falls from the V CC level to the V SS level, and as a result, the output node N2 returns to the V CC level. Then, an inverted one-shot pules is generated on the output node N8 of the one-shot pulse generator circuit 122 in the latch circuit 120 generates, and this one-shot pulse is input to the NAND gate 125, with the result that the output node N6 of the NAND gate 124 falls from the High level to the Low level. In other words, the latch circuit 120 is returned from the second state to the first state. The fall of the node N6 is transferred via the inverter 130, and the PMOST 132 is turned off, and the supply of the electric charge from the power source voltage V CC to the p-channel sense amplifier 41 is terminated, and the NMOST 115 is turned off and the comparator 110 is deactivated. After this, the supply of the electric charge to the p-channel sense amplifier 42 is made only from the auxiliary power source voltage V D via the PMOST 133. When an adequate potential difference is created between the pair of sense amplifier nodes SA and SA , at time t3, the column decoder output signal CL is raised to the High level to turn on the NMOSTs 51 and 52, thereby to transfer the data from the pair of sense amplifier nodes SA and SA to the pair of data lines DB and DB . Furthermore, in preparation for the rewriting in the memory cell 21 i , the control signal TG is raised from the V D level to the V D +Vt+α level, and the potentials on the bit lines BL and BL are made equal to the potentials on the sense amplifier nodes SA and SA . The potentials on the sense amplifier nodes SA and SA are thereby written via the bit lines into the memory cell 21 i . After this, the word lines WL i are lowered to the Low level (= 0 V). This first embodiment has the following advantages: (a) Since the latch circuit 120 is provided, responsive to the rise of the control signal PAS, the output node N6 of the latch circuit 120 is raised to the High level and the PMOST 132 is turned on, and the supply of electric charge to the p-channel sense amplifier 41 is conducted, and the comparator 110 is activated. When the common node PS rises to the V D level, the output node N2 of the comparator 110 becomes the V CC level, and the output node N6 of the latch circuit 120 becomes the Low level, and the comparator 110 is deactivated. Accordingly, the time for which the comparator 110 is activated is minimized, and the current through the comparator 110 is reduced, and the power consumption is reduced. (b) The PMOST 133 is provided as an auxiliary power source supply means, and is on for the period for which the control signal PAS is at the High level, and the electric charge is supplied from the auxiliary power source voltage V D to the p-channel sense amplifier 41. Accordingly, after the PMOST 132 has been turned off, the PMOST 133 keeps supplying the electric charge to the p-channel sense ampllfier 41, and the time for charging the bit line BL or BL is shortened, and the operation speed is heightened. Second Embodiment Fig. 6 is a circuit diagram showing the pertinent portion of the semiconductor memory device of a second embodiment of the invention. Elements identical to those in Fig. 1 are given identical or common reference marks. The power source voltage supply control section 100A of this semiconductor memory device differs from that of Fig. 1 in that, in place of the PMOST 133 and the inverter 131, a monitor circuit 150 serving as a monitor means is provided. In other respects, the configuration is identical to the power source voltage supply control section 100 of Fig. 1. The monitor circuit 150 is disposed between the p-channel sense amplifier drive common node PS and the input node N9 of the comparator 110, and has the functions of monitoring the voltage level of the higher one of the bit lines BL and BL , and applying the result of the monitoring to the input node N9. The monitor circuit 150 comprises a NMOST 51 having the same characteristics as the NMOSTs 31 and 32 in the transfer gate section 30, and a bit line capacitor 152 formed of a MOS capacitor or the like. The drain and the source of the NMOST 151 are connected to the common node PS and the input node N9 of the comparator 110, and the gate of the NMOST 151 is connected to receive the control signal TG. The input node N9 is connected via the bit line capacitor 152 to the ground potential V SS . The operation of the circuit shown in Fig. 6 will now be described with reference to Fig. 7. For example, let us assume that the memory cell 21 i is selected for reading, as in the description of the operation of the circuit of Fig. 1. At time t0, the word line WL i is raised to the High level, V D +Vt+α , and as in the waveform of Fig. 5, the potential on the bit line BL and the sense amplifier node SA varies by the amount of the read signal from the precharge level (e.g., V D /2). At time t1, the control signal PAS is raised to the High level (=V CC ). Then, the NMOST 134 is turned on, and the n-channel sense amplifier drive common node NS falls to V SS level. At the same time, as in Fig. 5, the rise of the output node N6 of the latch circuit 120 turns on the PMOST 132, and turns on the NMOST 115, to activate the comparator 110. When the PMOST 132 is turned on, the p-channel sense amplifier drive common node PS is raised to V D by virtue of the main power source voltage V CC . By the sensing and amplifying action of the sense amplifiers 41 and 42, one of the sense amplifier nodes SA and SA which is higher, e.g., SA , and one of the bit lines BL and BL which is higher, e.g., BL , are charged, and the lower sense amplifier node, e.g., SA and the lower bit line, e.g., BL, are discharged. While the PMOST 132 is on, the common node PS rises beyond the V D level toward the V CC level. The common node PS thereby exceeds the V D level, and, by the action of the monitor circuit 150, the input node N9 of the comparator 110 rises to the same level as the higher one of the bit lines, e.g., BL , and until then, the output node N2 of the comparator 110 is kept lower than the V CC level. For this reason, the latch circuit 120 continues to be in the second state, and its output node N6 is kept High, so the PMOST 132 is kept on, and the supply of electric charge to the p-channel sense amplifier 41 is continued. Accordingly, charging and discharging of the sense amplifier nodes SA and SA and the bit lines BL and BL are accomplished at a high speed. After an adequate potential difference is created between the sense amplifier nodes SA and SA , at time t2, the decoder output signal CL rises, and the data is transferred to the pair of data lines DB and DB . In preparation for the rewriting into the memory cell 21 i , in the same way as in Fig. 1, the control signal TG is raised to V D +Vt+α . As a result, the level of the higher one of the bit lines, e.g., BL , rises again. But, as the common node PS and the higher one of the sense amplifier nodes, e.g., SA , have been charged above the V D level, the higher bit line BL rapidly rises, and reaches the V D level at time t3. In the same way, the input node N9 of the comparator 110 reaches the V D level, and, at this instance, the output node N2 of the comparator 110 returns to the V CC level, and the latch circuit 20 is returned from the second state to the first state, and the output node N6 falls to the Low level. This is transferred via the inverter 130 and the node N7, and the PMOST 132 is turned off, so the supply of electric charge to the p-channel sense amplifier 41 is terminated, and the NMOST 115 is turned off and the comparator 110 is deactivated. The advantages of the second embodiment are as follows: (a) Since the monitor circuit 150 is provided, it is possible to supply the electric charge, with a voltage higher than in the first embodiment, to the p-channel sense amplifier 41 via the PMOST 132 which is kept on until the higher one of the bit line, e.g., BL , reaches the V D level. Accordingly, the charging of the bit line, e.g., BL , can be completed in a shorter time, than in the first embodiment. (b) At the same time as the completion of the charging of the bit line, e.g., BL , the latch circuit 120 is returned from the second state to the first state by the output of the comparator 110, and the comparator 110 is deactivated by the output of the latch circuit 120, so the current consumed by the comparator 110 is reduced and the reduction in power consumption is achieved. The present invention is not limited to the illustrated embodiments. Examples of modifications are as follows: (i) The comparator 110 may be formed of other transistors and the like, and may be replaced by a circuit of any different configuration or any other type of comparing means. (ii) The latch circuit 120 may be formed of latch means using other gate circuits such as NOR gates. (iii) The main power source supply means and the auxiliary power source supply means may be formed of other types of transistors. The monitor circuit 150 serving as an auxiliary power source supply means may be of a circuit configuration employing other transistors and the like. (iv) The memory cell array section 10 may be formed of a circuit other than that illustrated. The invention can be applied to semiconductor memory devices, such as static RAMs, other than dynamic RAMs. As has been described, according to the invention, a latch means is provided, so by the action of the latch means, the comparing and amplifying means is deactivated immediately upon completion of the bit line charging, and the current consumed at the comparing and amplifying means is reduced, and the power consumption is thereby reduced. An auxiliary power source supply means may additionally be provided. In such a case, when the main power source supply means is off, the auxiliary power source supply means continues the supply of the electric charge from the power source to the sense amplifier until the potential on the bit line reaches a predetermined level, so the charging of the bit line is accomplished with a high speed, and the high speed operation is thereby enabled. In the embodiment of Fig. 6, in which a monitor means is provided, the return of the latch circuit from the second state to the first state responsive to the output of the comparing and amplifying means is retarded, and by means of the output of the latch means, the main power source supply means is kept on. Accordingly, the electric charge is kept supplied from the main power source to the sense amplifier until the potential on the bit line reaches a predetermined level, so the charging of the bit line is accomplished with a high speed, and the high-speed operation is possible.

Claims: A circuit (100) for supplying charge to a sense amplifier in a memory device during a memory read operation, comprising: a main source of charge (132) switchable between an on state and an off state; a source for a control signal (PAS); and comparing means (110), including means (115) to enable and inhibit operation thereof, for comparing the voltage at a node (PS, N9) which is connected to said sense amplifier and supplied with charge by said main source of charge (132),with a reference voltage (VR) and outputting a signal dependent on said comparison for use in switching the main source (132); characterised by latch means (120) for turning on the main source of charge (132) and causing the comparing means (110) to be enabled in response to a predetermined change in the control signal (PAS), and for turning off the main source of charge (132) and causing the comparing means (110) to be inhibited in response to a predetermined change in the signal output by the comparing means (110). A circuit according to claim 1 including an auxiliary source of charge (133) operative to supply charge to said node (PS) when the control signal (PAS) is in a predetermined state and the main source of charge (132) is in its off state. A circuit according to claim 2 wherein the auxiliary charge source (133) develops at the node (PS) a voltage which is less than can be developed by the main charge source (132). A circuit according to claim 3 wherein the auxiliary charge source (133) comprises a switch (133) connected between the node (PS) and a voltage rail (VD), the switch being controlled by the control signal (PAS). A memory device including a circuit (100) according to any preceding claim, a plurality of memory cells (21 i ,21 i+1 ) disposed at intersections of a plurality of bit lines (BL, BL ) and a plurality of word lines (WL i ,WL i+1 ), and sense amplifiers (40)for sensing and amplifying the voltage on corresponding ones of the bit lines, the sense amplifiers being connected to the node (PS) to receive charge from the circuit (100). A memory device according to claim 5 including a data line (DB) to receive data from the bit lines that have been amplified by the sense amplifiers (40). A memory device according to claim 5 or 6 including transfer gate means (30) for selectively controlling transfer of the memory cells to the sense amplifier means to be amplified thereby. A memory device according to 5, 6 or 7 including a monitoring circuit (150) for monitoring the transfer of charge from the bit lines to the sense amplifiers during a memory read operation and for enabling operation of the comparing means (110) in response thereto. A memory device according to claim 8 wherein the monitoring circuit (150) comprises a switch (151) coupling the node (PS) with the comparing means (110) and being controlled by a second control signal (TG) which changes in response to a memory read operation, and delay means (152) for delaying transfer of the voltage at said node (PS) to the comparing means in response to a change in said second control signal. A memory device according to any one of claims 4 to 9 wherein the comparing means (110) is a current mirror amplifier. A memory device according to any one of claims 4 to 10 wherein the main source of charge comprises a switch (132) coupled between a main supply rail (V CC ) and said node (PS).

Inventors: MURASHIMA YOSHIHIRO, SEKINO YOSHIMASA, MURASHIMA, YOSHIHIRO, SEKINO, YOSHIMASA, Murashima, Yoshihiro, c/o Oki Electric Ind.Co.Ltd., Sekino, Yoshimasa, c/o Oki Electric Ind.Co.Ltd.
Applicants: OKI ELECTRIC IND CO LTD, OKI ELECTRIC INDUSTRY CO., LTD.
Application year: 1991
Main classification: G11C5
IPC codes: G11C11, H01L27, H01L21, G11C5