Method of producing a thin-film magnetic head as well as a thin-film magnetic head producible by means of the method

Abstract: A method is based on using a carrier (1) on which an electrically conducting plating-base (2) is provided, on which by means of electroplating, flux conductors (4a, 4b) and a magnetically insulating layer (8) are grown. This provides a planar structure on which an electrically insulating layer (9) and a magneto-resistance element (10) are applied. The plating-base (2) also constitutes the gap layer.

Description: The invention relates to a method of producing a thin-film magnetic head having a magneto-resistance element, starting from a carrier, on which a first magnetically insulating layer is deposited, on which flux conductors and at least between the flux conductors a second magnetically insulating layer are deposited, whereafter on the flux conductors and the second magnetically insulating layer an electrically insulating layer is deposited on which a magneto-resistance element is applied. The invention also relates to a thin-film magnetic head including a magnetic carrier on which a first non-magnetic layer is present on which flux conductors and a second non-magnetic insulating layer are located, which second non-magnetic layer is arranged at least between the flux conductors, an electrically insulating layer on which a magneto-resistance element is present at least opposite the second non-magnetic layer being located on the flux conductors and on the second non-magnetic layer. A method and a thin-film magnetic head as described in the opening paragraph are disclosed in the JP-A 62-146115A. In the prior-art magnetic head the magneto-resistance element bridges a leading and a trailing flux conductor and the magneto-resistance element is located outside the magnetic yoke constituted by the flux conductors and a carrier. This significantly improves the efficiency of the thin-film magnetic head compared with a magnetic head in which the magneto-resistance element is located inside the yoke between the carrier and the flux conductors. In the prior-art method, the flux conductors are deposited by means of sputtering and are structured by an ion etching procedure. In such a method a magnetic layer is first deposited, which is coated by a shielding layer, for example a photoresist. This shielding layer is thereafter structured, for example by exposing the layer locally to light. By doing so the photoresist is developed, whereafter the exposed portion is removed. Thereafter the magnetic layer can be structured by means of the ion etching procedure. The prior-art method has the disadvantage that a relatively large number of manufacturing steps must be carried out for the formation of the flux conductors, causing the method to be time-consuming and consequently rather expensive. An object of the invention is to provide a method of producing a thin-film magnetic head by means of which a thin-film magnetic head having good magnetic properties and a very simple head structure may be obtained in a simple and fast manner. The method according to the invention includes the steps of depositing an electrically conductive non-magnetic plating base on a magnetic carrier, depositing photolacquer resist walls on the plating base, depositing magnetic layer portions between the photolacquer resist walls on the plating base by electroplating for forming flux conductors, removing the photolacquer resist walls, depositing a non-magnetic layer between the flux conductors on the plating-base to isolate the flux conductors one from another, depositing an electrically insulating layer on the non-magnetic layer and the flux conductors, and depositing a magnetic resistance layer on the electrically insulating layer for forming the magneto-resistance element. This method renders the possibility to apply the flux conductors by electroplating, for which less process steps are required than in the prior-art method. As the plating-base also constitutes the gap layer, it may be relatively thick, which is advantageous for the electroplating process and there are no limitations to the choice of the gap length. In this respect the method according to the invention differs from prior-art electroplating processes in which the gap length is enlarged because of the fact that an electrically conducting and a magnetically non-conducting layer, serving as the basis for the electroplating process, is deposited on the first magnetically insulating layer. It is also known to deposit an electrically as well as a magnetically conducting layer on the first magnetically insulating layer. This does not put any limitations to the choice of the gap lengths, but such a layer may disadvantageously influence the magnetic properties of the flux conductors. An additional advantage of the method according to the invention is that the plating-base can also function as a bias winding for driving the magneto-resistance element. Moreover depositing the flux conductors by means of electroplating requires less time and is therefore also cheaper than forming the flux conductors by means of sputtering and structuring. It is noted that from IEEE Transactions on Magnetics, vol. 25, no. 5, September 89, p. 3686-3688 a process for making thin film head-slider devices is known, which process includes the step of depositing molybdenum as non-magnetic plating base material on an oxidized silicon substrate, depositing an air bearing layer of a hard non-magnetic material, providing windows in the air bearing layer, depositing NiFe layers and plating NiFe layers reaching down to the molybdenum plating base through the windows for forming permalloy pole pieces, making gap defining fences in hard carbon films on top of molybdenum seed layers, with the molybdenum acting as a stop for a reactive ion etching of the carbon, completing the head elements, overcoating the obtained composition, and etching away the substrate and the molybdenum base using the permalloy pole pieces, the carbon gap-filter and the air bearing layer as etching stop in order to form an air bearing surface. This known process leads to a magnetic head structure of which the planes of the films is parallel to the air bearing surface. The throat height of the gap is perpendicular to those planes. For a structure in which the magneto-resistance element is located outside of the yoke, it is necessary for the space between the leading and the trailing flux conductors to be planarized. This may, for example, be achieved by depositing an excess of insulating material by means of sputtering, evaporating or CVD (chemical vapour deposition), whereafter the superfluous material is removed by etching. A further method, which is used in the prior-art method, is filling up the space between the flux conductors by means of a spin-coating procedure and depositing the electrically insulating layer on the flux conductor by means of this same procedure. These techniques for the deposition of the electrically insulating layer are time-consuming and therefore rather expensive. An embodiment of the method according to the invention, in which the said disadvantages do not occur, is characterized, in that the non-magnetic layer is formed by depositing by electroplating an electrically conducting non-magnetic layer on the plating-base at least between the flux conductors. This provides the advantage that a flat layer having a constant thickness grows during the electroplating process. An additional advantage is the speed of the electroplating process. A further advantage is that the electrically floating flux conductors of the prior-art magnetic head are now electrically interconnected, which results in a reduced electrical noise caused by static charging of the flux conductors due to friction with a magnetic medium and reduces the risk of ESC (electro-static discharge). A practical embodiment of the method according to the invention, suitable for growing a second magnetically insulating layer via electroplating, is characterized, in that before the photolacquer resist walls are removed an electrically insulating shielding layer is deposited at least on the flux conductors, whereafter the assembly of magnetic layer portions, shielding layer and photolacquer resist walls are structured in such a manner that only the flux conductors having a portion of the shielding layer thereon remain, whereafter further photolacquer resist walls are deposited on the plating-base, after which at least between the flux conductors and the further photolacquer resist walls the electrically conducting non-magnetic layer for the formation of the non-magnetic layer is deposited by electroplating whereafter the said portion of the shielding layer and the further photolacquer resist walls are removed. An embodiment of the method according to the invention is characterized in that, during the deposition of the magnetic layer portions on the plating-base further magnetic layers are grown by electroplating in addition to the flux conductors, whereafter on the magnetic layer portions and the photolacquer resist walls the shielding layer is deposited on which, at least in the region of the flux conductors, photolacquer resist walls are deposited, whereafter on structuring also the photolacquer resist walls are removed. This practical method has for its advantage that the magnetic layer portions are grown by electroplating over a larger surface area than in the embodiments described in the foregoing. Consequently, the electric current will be distributed more uniformly over the surface during the procedure, causing the growth to be achieved more uniformly and with an increased degree of controllability. The thin-film magnetic head according to the invention is characterized, in that the first non-magnetic layer is an electrically conducting plating-base. As the transducing gap is formed by only one layer, a well-defined gap length is obtained. A suitable electrically conducting plating-base is, for example, an Au layer. An embodiment of the thin-film magnetic head according to the invention, is characterized, in that the second non-magnetic layer is made of an electrically conducting material. Thus it is possible to form the second non-magnetic layer as an electroplated layer. By making the thickness of said second layer equal to the thickness of the flux conductors, a flat layer is obtained, which during production is advantageous for the deposition of the magneto-resistance element. A suitable material for the second magnetically insulating layer is Cu. The invention will now be described in greater detail with reference to embodiments of the method and of the thin-film magnetic head shown in the accompanying Figures by way of example. Therein: Figs. 1 to 5 are cross-sectional views of intermediate products during the method according to the invention, Fig. 6 is a plan view of the planarized structure of flux conductors and a magnetically insulating layer of an intermediate product, Fig. 7 is a cross-sectional view of a first embodiment of the magnetic head according to the invention, and Fig. 8 is a cross-sectional view of a second embodiment of the magnetic head according to the invention. An embodiment of the method according to the invention is based on a magnetic carrier 1, a ferrite substrate in this embodiment, which also conducts the magnetic flux. On this carrier 1 a plating-base 2 of an electrically conducting and a magnetically non-conducting material is deposited, for example an Au base. Photolacquer resist walls 3 are deposited on the plating-base 2, whereafter the magnetic layer portions 4, 4a and 4b, for example of NiFe, are grown by means of electroplating on the plating-base 2. Fig. 1 is a cross-sectional view perpendicular to the carrier 1 of the intermediate product thus obtained. In addition to the flux conductors 4a and 4b, the magnetic layer portions include also magnetic auxiliary layers 4 for obtaining a large surface area, so that during the growing operation an improved distribution of the electric current in the plating-base 2 is obtained and the growth is achieved with greater control. A shielding layer 5, for example a quartz layer or a photolacquer resist layer is applied on this intermediate product, portions of these layers functioning as an electrical insulation of the flux conductors 4a and 4b in a later stage of the method. Photolacquer resist layers 6 which function as a barrier during structuring of the composite layer are applied on the assembly of magnetic layer portions 4, 4a and 4b, photolacquer resist walls 3 and the shielding layer 5. Fig. 2 shows an intermediate product previous to structuring and Fig. 3 shows the result after structuring. This structuring may for example be carried out by means of a wet chemical etching process. During structuring, the photolacquer resist walls 3, the magnetic auxiliary layers 4 and the shielding layer 5 are partly removed. The shielding layer 5 must remain on the flux conductors 4a and 4b, to prevent unwanted layers from being formed during a subsequent electroplating operation on the flux conductors in the further course of the method. During the latter electroplating process a second magnetically insulating layer 8 is deposited. It is already sufficient to deposit this layer 8 only between the flux conductors 4a and 4b. To obtain a more uniform distribution of the current and consequently a process which can be controlled to an improved extent, the layer 8 is preferably grown over a larger surface area. Further photolacquer resist walls 7 are first deposited on the plating-base 2 to define the surface on which the second magnetically insulating layer is deposited. Thereafter the insulating layer 8 is deposited until it has obtained a dimension t in a direction perpendicular to the carrier 1 equal to that of the flux conductors, as shown in Fig. 4. After removal of the shielding layer portions 5 and the further photolacquer resist walls 7 a planarized structure remains, as is shown in Fig. 5. An electrically insulating layer 9 and a magneto-resistance element 10 are deposited on this structure one after the other. The broken line 11 in the drawing indicates the location of the head face to be formed. This head face 14, see Fig. 7, is obtained after grinding of the intermediate product shown in Fig. 5. Prior to grinding a filler layer 12, for example of SiO 2 , is deposited on the magnetic head structure. Fig. 7 shows the magnetic head obtained by means of the method described in the foregoing, the head face 14 cooperating with a schematically shown magnetic information carrier 13 which is movable in the directions indicated by the double arrow A. Fig. 8 shows another embodiment of a magnetic head according to a second method, which slightly deviates from the method described in the foregoing. In this second method only the flux conductors 20 and 21 are grown by electroplating. To this end a plating layer 23 is deposited on a magnetic carrier 22. The second magnetically insulating layer and the electrically insulating layer are formed together by an insulating layer 24 which is both mechanically and electrically insulating and is made of, for example, SiO 2 . This planarized insulating layer 24 is deposited for example by sputtering or CVD (chemical vapour deposition), whereafter the superfluous material is removed by etching. A magneto-resistance element 25, a further insulating layer 26 and a filler layer 27 are arranged one after the other on this insulating layer 24. It should be noted that the invention is not limited to the embodiments shown here, but that other embodiments are also within the scope of the invention. Thus, the carrier need not te be composed entirely of magnetic material. A carrier assembled from a non-magnetic substrate with a magnetic layer deposited thereon is alternatively possible. An embodiment in which the carrier plane of the carrier is not magnetic also belongs to the possibilities. The carrier may, for example, include a magnetic substrate, having writing windings arranged thereupon which are covered with a magnetically insulating layer, on which the plating-base is then deposited. A magnetic head structure, having several transducing gaps next to each other is also possible, Fig. 6 showing an intermediate product thereof.

Claims: A method of producing a thin film magnetic head having a magneto-resistance element (10, 25), including the steps of depositing an electrically conductive non-magnetic plating base (2, 23) on a magnetic carrier (1, 22), depositing photolacquer resist walls (3) on the plating base, depositing magnetic layer portions (4a; 4b) between the photolacquer resist walls on the plating base by electroplating for forming flux conductors, removing the photolacquer resist walls, depositing a non-magnetic layer (8, 24) between the flux conductors on the plating-base to isolate the flux conductors one from another, depositing an electrically insulating layer (9, 24) on the non-magnetic layer and the flux conductors, and depositing a magnetic resistance layer on the electrically insulating layer for forming the magneto-resistance element. A method as claimed in Claim 1, characterized in that the non-magnetic layer (8) is formed by depositing by electroplating an electrically conducting non-magnetic layer on the plating-base (2) at least between the flux conductors. A method as claimed in Claim 2, characterized in that before the photolacquer resist walls (3) are removed an electrically insulating shielding layer (5) is deposited at least on the flux conductors, whereafter the assembly of magnetic layer portions (4a; 4b), shielding layer and photolacquer resist walls are structured in such a manner that only the flux conductors having a portion of the shielding layer thereon remain, whereafter further photolacquer resist walls (7) are deposited on the plating-base (2), after which at least between the flux conductors and the further photolacquer resist walls the electrically conducting non-magnetic layer for the formation of the non-magnetic layer (8) is deposited by electroplating whereafter the said portion of the shielding layer and the further photolacquer resist walls are removed. A method as claimed in Claim 3, characterized in that during the deposition of the magnetic layer portions (4a; 4b) on the plating-base (2) further magnetic auxiliary layers (4) are grown by electroplating in addition to the flux conductors, whereafter on the magnetic layer portions (4; 4a; 4b) and the photolacquer resist walls (3) the shielding layer (5) is deposited on which, at least in the region of the flux conductors, photolacquer resist walls are deposited, whereafter on structuring also the photolacquer resist walls are removed. A thin-film magnetic head producible in accordance with a method as claimed in any one of the preceding Claims, the magnetic head including a magnetic carrier (1, 22) on which a first non-magnetic layer is present on which flux conductors (4a; 4b, 20; 21) and a second non-magnetic insulating layer (8, 24) are located, which second non-magnetic layer is arranged at least between the flux conductors, an electrically insulating layer (9, 24) on which a magneto-resistance element (10, 25) is present at least opposite the second non-magnetic layer being located on the flux conductors and on the second non-magnetic layer, characterized in that the first non-magnetic layer is an electrically conducting plating-base (2, 23). A thin-film magnetic head as claimed in Claim 5, characterized in that the plating-base (2, 23) comprises Au. A thin-film magnetic head as claimed in Claim 5 or 6, characterized in that the second non-magnetic layer (8, 24) is made of an electrically conducting material. A thin-film magnetic head as claimed in Claim 7, characterized in that the second non-magnetic layer (8, 24) is a layer obtained by electroplating. A thin-film magnetic head as claimed in Claim 7 or 8, characterized in that the dimension of the second non-magnetic layer (8, 24) is at least substantially equal to that of the flux conductors (4a; 4b, 20; 21), taken in a direction perpendicular to the plating-base (2, 23). A thin-film magnetic head as claimed in Claim 7, 8 or 9, characterized in that the second non-magnetic layer (8, 24) comprises Cu.

Inventors: SOMERS GERARDUS HENRICUS JOHAN, VOERMANS ATONIUS BERNARD, SOMERS, GERARDUS HENRICUS JOHANNUS, VOERMANS, ATONIUS BERNARD
Applicants: PHILIPS ELECTRONICS NV, PHILIPS ELECTRONICS N.V.
Application year: 1991
Main classification: G11B5
IPC codes: G11B5