Carrier for film carrier type semiconductor device

Abstract: An opening (3) is formed at the central part of a substrate (100), and a recessed part (4) for holding a film carrier type IC (10) is formed in the periphery of the opening. Fixing hooks (5) are provided in the recessed part that are mutually opposed with the opening in between. In particular, the projections (5a, 6a) in the upper part of the fixing hooks are tapered to facilitate the insertion of the fixing hooks into the sprocket holes (15).

Description: The present invention relates to a carrier for film carrier type semiconductor device, and more particularly, to a carrier which holds a film carrier type semiconductor device by engaging the fixing hooks with the sprocket holes of the film carrier. The fabrication process of a film carrier type semiconductor device (IC) is roughly as follows. First, a foil of metal such as copper is attached to an insulating base film made of a flexible resin such as polyimide having sprocket holes for conveyance and positioning and a device hole for housing a semiconductor chip, and leads and pads for electrical selection with desired shapes are formed by patterning the metallic foil to constitute a film carrier. Next, a semiconductor chip having metallic protrusions formed in advance on the electrical terminals, is prepared, follwed by the bonding of the leads of the film carrier and the protrusions of the semiconductor chip by means of thermocompression or eutectic welding, completing a film carrier type IC. A film carrier type IC formed as above is subjected to electrical selection or a bias test which is carried out through the contacts that make contact with the pads of the film carrier type. In preparation for these types of test the semiconductor chip may be resin sealed by resin potting, for the purpose of assuring the reliability of the chip and protecting it from mechanical shock. In mounting the film carrier type IC on a printed board, the leads are cut to desired lengths, the semiconductor chip is fixed onto the printed board, then the leads are outer-bonded to the bonding pads formed on the printed board. For a film carrier type IC, it is possible to perform bonding simultaneously regardless of the number of leads, as described above, so that the bonding speed can be high. Moreover, the IC is of a tape type film carrier and it is smallsized, thin and light-weight compared with other semiconductor devices, so it is easier to automate the process. However, the film carrier type IC has a defect that deformation or slivering tend to be generated in the leads formed on its surface, because of the flexibility of the base film that constitutes the film carrier. In order to eliminate the defects mechanically protecting and reinforcing the film carrier type ICs after cutting the film carrier type ICs into individual pieces occurs. Each piece of the cut film carrier type IC is generally mounted on an IC (referred to simply as a carrier hereinafter) when the IC is subjected to the fabrication processes such as resin sealing and electrical selection, or when the IC is shipped. The conventional carrier comprises a square substrate made of resin or the like, an opening formed at the central part of the substrate, a recessed part for holding a film carrier type IC formed in the periphery of the opening, fixing hooks to be inserted in the sprocket holes of the film carrier tape, formed in the recessed part and placed facing each other with the opening in between, a direction displaying notch formed at one of the corners of the substrate, first holes for receiving pins, in alignment with the sprocket holes of the film carrier for positioning of the IC, second holes for receiving pins, when needed, in alignment with the tooling holes formed in the base film, carrier fixing notches formed in the periphery of the substrate for positioning the carrier, and the like. Among carriers constituted as above, there are a type which completely fix the IC and a type which holds the IC in a state that permits a degree of movement, although only slightly, when a film carrier type IC is mounted on the carrier. In a carrier of the type where the film carrier type IC is completely fixed with fixing hooks, the positioning of the contacts and the IC pads has to be carried out by means of carrier fixing notches, so there is a defect that the positioning accuracy is unsatisfactory. In contrast, in a carrier of the type where the film carrier type IC is held with a margin of movement, a rough alignment of the contacts and the pads is done by means of the carrier fixing notches, and the final positioning can be accomplished by passing the pins through the sprocket holes on the tooling holes of the film carrier. Consequently, the carrier of the type with a margin of movement is more generally used. It is to be mentioned that the "margin of movement" when a film carrier type with 35mm width is employed is about 0.05 to 0.15mm. The fixing hooks provided in the carrier are either provided in a size having the above-mentioned margin so as to be positioned at the approximate centers of the sprocket holes, or given a construction in which the width of the fixing hooks is chosen small and the centers of the fixing hooks are shifted to the outside of the centers of the sprocket holes, that is, so as to prevent an increase in the margin by giving a larger spacing between the opposing fixing hooks. However, the carrier according to the prior art described in the above has a drawback in that when the fixing hooks are inserted into the sprocket holes, the projections formed in their upper parts tend to deform the sprocket holes. In particular, when the width of the fixing hooks is large, the deformation of the sprocket holes by the hooks is large so that they cause damages to the sprocket holes or deformation to the leads. However, if the width of the fixing hooks is made small to overcome some disadvantages, the margin between the fixing hooks and the sprocket holes becomes large. The deformation of the sprocket holes at the time of insertion of the fixing hooks can be made small, and there may arise cases in which the positioning holes are damaged by the positioning pins at the time of insertion of the pins into the sprocket holes or the tooling holes, making it impossible to obtain an accurate positioning. When the margin is reduced by shifting the fixing hooks toward the outside, the deformation in the sprocket holes at the time of insertion of the fixing hooks becomes large as has been stated above. As a measure against this, in the Japanese Patent Laid Open No. 59-72746 and Japanese Patent Laid Open No. 61-90453 there are proposed two-piece type carriers which employ two sheets of carriers that have respectively male and female fixing hooks, and are used by sandwiching a film carrier type IC between them. In this case, however, it has a defect in that it leads to an increase in the cost because there is required the manufacture of two sheets of carriers with similar shapes. US-A-4.069.496 discloses a carrier or fixture for a film carrier type semiconductor device in which locating lugs have protrusions on both transversely-facing sides; the preamble of claim 1 is based on this document. It is an object of the present invention to provide a carrier for a film carrier type IC which enables reduction of the damage to the sprocket holes and the deformation of the leads by minimising the deformation of the film carrier which tends to occur during mounting the film carrier type IC. In the carrier for film carrier type IC according to the present invention there is provided a carrier for a film carrier type semiconductor device having an insulating base film in which a plurality of sprocket holes are formed, said carrier comprising: a substrate having an upper surface and an opening at a central part; a recess formed in the periphery of said opening and extending downwardly from said upper surface, for holding said film carrier type semiconductor device; a first fixing hook array comprising a plurality of fixing hooks arranged in a first direction and formed in said recess; and a second fixing hook array comprising a plurality of fixing hooks arranged in said first direction and formed in said recess, said second array being separated from said first array in a second direction which is perpendicular to said first direction, the opening being between said first and second arrays; each of said fixing hooks of said first and second arrays being constructed for insertion into a respective sprocket hole and including: a pillar upstanding from said recess, said pillar having a projection extending in said first direction from an upper section of a side surface of said pillar which faces in said first direction; characterised in that the pillar of each of said fixing hooks of said first and second arrays has a pair of opposite side surfaces each facing in the second direction, and a protrusion (6A) extending in said second direction from only one of said pair of opposite surfaces at a lower portion thereof, the protrusions of each of said fixing hooks of said first array extending from the same one of said opposite surfaces of said pillars and said protrusions of each of said fixing hooks of the second array extending from the other of said opposite side surfaces of said pillars, so that, when an insulating base film is held by the first and second arrays with the pillars disposed centrally in respective sprocket holes, the width of a pillar in the second direction occupies approximately one third of the width of the respective sprocket hole, and a space formed in the respective sprocket hole between said protrusion and said insulating base film is smaller than a space formed in said sprocket hole between the other of said opposite side surfaces of said pillar and said insulating base film, said protrusions defining with the adjacent edges of their respective sprocket holes the margin of movement of the base film on the carrier. Preferably the protrusions on the pillars of the fixing hooks of both arrays each extend in the second direction away from the said opening. The projection may have a tapered upper surface declining continuously from an upper surface of said pillar and said protrusion may have a tapered surface declining continuously from said upper surface of said pillar. The above-mentioned and other objects, features and advantages of this invention will become more apparent by reference to the following detailed description of the invention taken by way of example and in conjunction with the accompanying drawings, in which: FIG. 1 is a plan view of a film carrier type IC to be mounted on the carrier according to the present invention; FIG. 2(A) and FIG. 2(B) are a plan view of the first embodiment of the present invention and its sectional view along the line A-A of the plan view respectively; FIG. 3(A) to FIG. 3(C) are a top view, a side view and a front view, respectively, of the neighbourhood of the fixing hook of the first embodiment; FIG. 4(A) and FIG. 4(B) are a top view and a side view, respectively, of the neighbourhood of the fixing hook of a second embodiment of the present invention; and FIG. 5(A) and FIG. 5(B) are a top view and a side view, respectively, of the neighbourhood of the fixing hook of a third embodiment of the present invention. Referring to FIG. 1, the film carrier type IC according to the present invention can be fabricated by providing, on an insulating base film 100, made of polyimide or the like, a device hole 11 for housing a semiconductor chip 14, sprocket holes 15 and tooling holes 7 for conveyance and positioning, and the like, then forming connection leads 12 to pads 13 by patterning a metallic foil formed by a deposition on the film, and bonding terminals of the semiconductor chip 14 to the tips of the leads 12 by thermocompression or eutectic welding. The film carrier type ICs thus constructed are cut about cutting lines C into individual chips, and are mounted on the carrier of the present invention for the purpose of mechanical protection and reinforcement. Referring to FIGs. 2(A) and 2(B), the first embodiment of the carrier according to the present invention comprises a square substrate 1 made of resin or the like which has an opening 3 in its central part. Around the outer edge of the opening 3 there is formed a recessed part 4 for holding the base film 10 of the film carrier type IC. In the recessed part 4 there are provided a plurality of fixing hooks 5 which (as best seen in FIG. 3) consist of pillars having hook portions 5A at the upper parts thereof. The hooks stand opposite each other with the opening 3 in between, first holes 2A that are aligned with the sprocket holes of the film carrier and second holes 2B that are aligned with the tooling holes. Further, carrier fixing notches 8 and a direction displaying notch 9 are provided along the circumference of the substrate 1. Referring to FIG. 3(A) and FIG. 3(C), the facing hook 5 is formed so as to have its center to be coincident with the center of the sprocket hole 15 of the base film 10 and its width W to be about one-third of the width of the sprocket hole 15. Since the fixing hook 5 is situated at the central part of the sprocket hole 15 which facilitates the deformation of the sprocket hole and the width of the fixing hook is made small, the possibility of damage to the sprocket hole 15 and deforming the lead at the time of holding IC 10 can be reduced. Moreover, on the outwardly-facing side of each of the pair of mutually opposing surfaces there is provided at the lower portion thereof a protrusion 6A of the thickness w' with a taper in its upper part and having a semicircular cross-sectional shape. Because of this, even if the width W of the fixing hook 5 is made small, the margin for IC 10 and the carrier, that is, the spacing d between the sprocket hole 15 and the fixing hook 5 can be freely controlled. In other words, the protrusion 6A controls the spacing d to be in the range of about 0.05 to 0.15mm so as not to damage the tooling hole 7 or the sprocket hole 15 by the positioning pins at the time of positioning of IC 10. Moreover, the protrusion 6A is provided at a position where it will not be brought into contact with the edge of the sprocket hole 15 even if the sprocket hole 15 is deformed by the projection 5A of the fixing hook 5. After IC 10 is held by the carrier the protrusion 6A controls the movement of the sprocket hole 15, that is, IC 10, and prevents the spacing d from becoming unnecessarily large. As a result of bringing the centers of the fixing hooks 5 to be coincident with the centers of the sprocket holes 15, and selecting the width W of the fixing hook to be about 0.5mm and its length L to be about 1.3mm, and the thickness w' of the protrusion 6A to be about 0.35mm, for IC 10 that has sprocket holes 15 of about 1.42mm square, it was confirmed that the resistance at the time of insertion of IC 10 to the carrier was reduced and damage to the sprocket holes 15 and the deformation of the leads 12 were hardly observable. Further, the margin between IC 10 and the carrier is also within a proper range, and no erroneous contact in the electrical selection or the like is generated. Moreover, the projection 5A in the upper part of the fixing hook 5 is tapered to avoid the application of a sudden and large force to the sprocket holes part at the time of insertion of the fixing hook, as shown in FIG. 3(C), so that the insertion of the fixing hooks 5 to the sprocket holes 15 can be facilitated. As a result of an evaluation, it was found that a sudden and large force to the sprocket hole parts will not be applied at the time of insertion of the fixing hooks, and the time during which the sprocket holes are deformed can be made very short, as long as the angle of the taper is in the range of about 20 to 40 degrees. Therefore, the generation of damage to the sprocket holes and deformation of the leads 12 can further be reduced by giving a taper to the projections 5A to have the taper angle in the above-mentioned range. In the above, the first embodiment has been described with reference to the case where the corner section at the tip of the projection 5A has a rectangular shape as shown in FIG. 3(A), but the corner section may be given a rounded shape. By so doing, the force that is applied to the sprocket hole at the time of insertion of the fixing hook 5 can further be reduced. Referring to FIG. 4(A) and FIG. 4(B), in the second embodiment according to the present invention, the protusion 6B that is formed on a side face of the fixing hook 5 has a triangular cross-section. The remainder of the construction is the same as in the first embodiment. The protusion 6B for the second embodiment can also properly control the spacing d between the fixing hook and the sprocket hole. Referring to FIG. 5(A) and FIG. 5(B), the protusion of the third embodiment according to the present invention has a trapezoidal cross-section. Since the spacing d between the tip of the trapezoidal protusion 6C and the edge of the sprocket hole 15 can be controlled properly also in the third embodiment, it is possible to reduce the damage to the sprocket hole and deformation of the leads 12. Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense.

Claims: A carrier for a film carrier type semiconductor device (100) having an insulating base film (10) in which a plurality of sprocket holes (15) are formed, said carrier comprising: a substrate (1) having an upper surface and an opening (3) at a central part; a recess (4) formed in the periphery of said opening and extending downwardly from said upper surface, for holding said film carrier type semiconductor device; a first fixing hook array comprising a plurality of fixing hooks (5) arranged in a first direction and formed in said recess; and a second fixing hook array comprising a plurality of fixing hooks (5) arranged in said first direction and formed in said recess, said second array being separated from said first array in a second direction which is perpendicular to said first direction, the opening being between said first and second arrays; each of said fixing hooks of said first and second arrays being constructed for insertion into a respective sprocket hole and including: a pillar upstanding from said recess, said pillar having a projection (5A) extending in said first direction from an upper section of a side surface of said pillar which faces in said first direction; characterised in that the pillar of each of said fixing hooks of said first and second arrays has a pair of opposite side surfaces each facing in the second direction, and a protrusion (6A) extending in said second direction from only one of said pair of opposite surfaces at a lower portion thereof, the protrusions of each of said fixing hooks of said first array extending from the same one of said opposite surfaces of said pillars and said protrusions of each of said fixing hooks of the second array extending from the other of said opposite side surfaces of said pillars, so that, when an insulating base film is held by the first and second arrays with the pillars disposed centrally in respective sprocket holes, the width of a pillar in the second direction occupies approximately one third of the width of the respective sprocket hole and a space formed in the respective sprocket hole between said protrusion and said insulating base film is smaller than a space formed in said sprocket hole between the other of said opposite side surfaces of said pillar and said insulating base film, said protrusions defining with the adjacent edges of their respective sprocket holes the margin of movement of the base film on the carrier. The carrier as claimed in Claim 1, wherein the protrusions (6A) on the pillars of the fixing hooks of both arrays each extend in the second direction away from the said opening. The carrier as claimed in Claim 1 or Claim 2, wherein said projection has a tapered upper surface declining continuously from an upper surface of said pillar and said protrusion has a tapered surface declining continuously from said upper surface of said pillar.

Inventors: YOSHIGAI AKIRA C O NEC CORPORA, YOSHIGAI, AKIRA, C/O NEC CORPORATION
Applicants: NIPPON ELECTRIC CO, NEC CORPORATION
Application year: 1991
Main classification: H01L21
IPC codes: H01L21