Copper plating of gravure rolls

Abstract: Copper plating gravure rolls with improved resistance to annealing are provided by incorporating into the electroplating bath an alkoxythio compound, preferably an alkoxylated, e.g. ethoxylated, thiodiglycol.

Description: The present invention relates to electroplating a gravure roll with a surface layer of copper. More particularly it concerns the use of a unique plating bath formulation which results in a surface coating which is ideally suited for electronic engraving. Gravure printing is a method of printing which uses an etched or engraved cylinder. Ink occupies the depressions in the cylinder and is transferred to a print medium. Surface defects on the cylinder, such as pits or spots which are too hard or too soft result in engraving errors and subsequent need for repolishing and replating which is expensive and time consuming. Since the development of automatic method of electronic engraving, the electrodeposition of copper of known physical and mechanical properties with reproducible grain size, crystal structure and hardness over the entire surface of the cylinder is desirable. The copper plating processes, typically directed towards decorative plating, have as their objective to impart levelling and brightness characteristics with little regard to precise physical properties that are important for electronic engraving. Such decorative applications are generally concerned with deposits ranging in thickness from about 12.7 to 38.1 µm (0.0005 to 0.0015 inch) while gravure rolls require deposits ranging from 10 to 20 times these thickness values. For successful electronic engraving, the copper deposits must have reproducible grain size, crystal structure and hardness. One problem associated with copper deposits involves annealing. Annealing is a tendency of the hardness of the copper deposit to decrease with time as a result of changes in crystalline size, texture, microdeformations and dislocations within the copper deposit. Certain acid copper plating baths are also known to perform differently with respect to the immersion depth of the rotating cylinder. The principal problem in this regard is annealing. This problem of recrystallization (annealing) is characteristic of totally submerged cylinder operations when using a bath designed for partial immersion such as described by U.S. Patent 4,334,966. The same holds true of partially submerged cylinder operations when using a bath designed for total immersion such as described by U.S. Patent 4,781,801. The baths described in US-A-4781801, contain, in addition to copper and sulphuric acid, a brightener which is a sulphonated sulphurized benzene, a polyether surfactant, and a heterocyclic compound having an -NC(S)N- group as part of the heterocyclic ring, e.g. 2-imidazolidinethione. It has now been discovered that by incorporating an alkoxythio compound, such as an alkoxylated 2-mercapto-ethanol or 2,2'-thiodiethanol, into such acid copper plating baths the problem of annealing can be eliminated at any level of immersion. Also it has been found that satisfactory non-annealing deposits can be obtained in the absence of any grain refining compound. Thus, so far as the present invention is concerned, the addition of a grain refining thio compound to the bath is preferred, but not essential. In one aspect therefore, the present invention provides a process for depositing copper on a gravure roll which comprises immersing the gravure roll totally or partially in an electroplating bath containing copper, sulphuric acid, a sulphonated, sulphurized hydrocarbyl compound and optionally a grain refining thio compound containing either an -NC(S)- or an -NC(S)N- group, and passing an electric current through the bath thereby to deposit copper on the gravure roll, the plating bath additionally containing at least one alkoxythio compound. In another aspect, the present invention provides a bath composition for the copper electroplating of gravure rolls, to provide a copper plated surface, which is especially suited for electronic engraving, the said bath composition comprising, in solution: a) copper; b) sulphuric acid; c) a sulphonated, sulphurized hydrocarbyl compound; optionally d) a grain refining thio compound containing an -NC(S)- or -NC(S)N- group; and e) an alkoxythio compound. The present method and bath composition produce copper coatings which have consistent hardness on storage, i.e. minimal, if any, annealing. The present method also controls treeing or excessive copper deposition at the high current ends of the gravure cylinder. The plating may be accomplished by partial or complete immersion of the cylinder in the bath. In other aspects the invention also provides a means to control the hardness and brittleness of copper layers on gravure rolls. In the electroplating baths of the present invention the copper is preferably present as copper sulphate added to the bath as copper sulphate pentahydrate. Copper concentrations are generally from about 150 to about 225 grams per litre, preferably 200 to 210, calculated as copper sulphate pentahydrate. The sulphuric acid is present in an amount generally from about 35 to about 90 grams per litre, preferably 50 to 60. The optional grain refining thio compound (d) is a thio compound containing a structural unit represented by one of the formulae: Examples of such thio compounds include thiocarbamates (I), including dithiocarbamates and their derivatives, and thioureas (II) and their derivatives. Specific examples include 2-imidazolidinethione (MW 102.17), 1,1'-thiocarbonyldiimidazole (MW 178.22), and 2-thiohydantoin (MW 116.14). Amounts of grain refining compound may range from 0.5 to 5 mg/l. Suitable alkoxythio compounds, component (e), are represented by the formulae: H(OR) n S(RO) n H (III) and R₁-S(RO) n H (IV) wherein n is an average number of 1 to about 20, preferably 6 to about 12, more preferably about 9, R is an alkylene group having from 1 to about 8, preferably 2 to about 4 carbon atoms, and R₁ is hydrogen or an alkyl group having from 1 to about 12 carbon atoms, preferably 1 to about 6. R is preferably an ethylene, propylene or butylene group, preferably an ethylene group. R₁ is preferably hydrogen or a methyl, ethyl, propyl or butyl group. Preferably, the alkoxythio compound is represented by formula (III). These materials are generally known as alkoxylated thiols, preferably alkoxylated thiodiglycols, more preferably ethoxylated thiodiglycols. An example of an ethoxylated thiodiglycol is Pegol™ TDG-1250 which is available commercially from Rhone-Poulenc Inc. of Princeton, New Jersey. The alkoxythio compounds are generally present in an amount from 0.01 to about 1.0 gram per litre, preferably 0.05 to 0.1. Component (c) is a sulphonated, sulphurized hydrocarbyl compound. Preferably, the hydrocarbyl compound is an aromatic or aliphatic hydrocarbon, preferably an aromatic hydrocarbon. Examples of aromatic hydrocarbons include benzenes, including alkyl benzenes, phenols and aromatic amines, preferably benzenes. The hydrocarbyl compounds are sulphurized by the use of sulphur chloride, sulphuryl chloride or thionyl chloride at the sulphurizing agents. Elemental sulphur and alkali metal sulphides or mixtures thereof may also be used. Alternatively, commercially available thio-aromatic compounds, such as thioanthracene, diphenol sulphide, diphenol disulphide, thiophenol and the like may be used to form the sulphonated sulphurized hydrocarbyl compounds. The sulphurized hydrocarbyl compounds are then sulphonated according to well known procedures using fuming sulphuric acid, sulphur trioxide or cholorosulphuric acid to form brightening agents for use in the present invention. Sulphonation may also occur prior to sulphurization of the hydrocarbyl compounds. Suitable sulphonated sulphurized hydrocarbyl compounds and methods for preparing them are disclosed in U.S. Patent 2,424,887 and to which reference should be made. Generally, the sulphonated, sulphurized hydrocarbyl compound is present in the plating bath in an amount from about 1 mg/l to about 100 mg/l, preferably about 10 to about 40, more preferably about 15 to about 25. Generally, the bath should contain from about 20 to about 80 ppm chloride ion, prefarably about 40 to about 60 ppm, more preferably 50 ppm. The chloride ion is added as hydrochloric acid. The plating is applied to the roll in a plating bath with a temperature ranging from about 21°C to about 49°C, preferably from about 24°C to about 32°C. Higher temperatures may be employed but at the expense of greater cost due to the increased concentration and consumption of additives necessary to produce the desired result. In order to achieve high deposition rates and develop a uniform deposit, the roll is normally rotated on its axis to develop a surface feed of about 28 m²/min (300 ft²/min). The current density may be from about 6.46 to 51.67 amps/dm² of roll surface (60 to 480 amps/ft²), preferably from about 10.76 to 26.91 amps/dm² (100 to 250 amps/ft²) more preferably about 10.76 to 21.53 amps/dm² (100 to 200 amps/ft²). Plating is continued until the deposit has a thickness in the range 0.127 to 0.508 mm or thereabouts (0.005 to 0.02 inches), preferably from 0.254 to 0.508 mm (0.01 to 0.02 inches). The deposit typically has a Rockwell T hardness of about 91 to about 92 as plated with no loss after standing at room temperature for a prolonged period of time. Ductility of the deposit is determined on the foil by flexing it 180°. Ductile foil will fold whereas a brittle foil will break. Furthermore, the copper deposit is improved upon for the purpose of this gravure application by substituting this discovered compound in place of the typical polyether surfactants as noted in the following examples. Reference Example A A plating bath is prepared by adding 210 g/l of copper sulphate pentahydrate, 60 g/l of sulphuric acid, 50 ppm of chloride added as hydrochloric acid, 20 mg/l of sulphurized benzene sulphonate and 80 mg/l of polyether surfactant (Pluracol™ P-710) to a vessel. A gravure roll 15 cms (6 ins.) long and 5 cms (2 ins.) in diameter is plated completely submerged in the bath at 27°C at a current density of 16.15 amps/dm² (150 amps/ft²) while being rotated at 27.9 m²/min (300 ft²/min) to produce a copper deposit 0.127 mm (0.005 inch) thick, which has a Vickers hardness of 168. The deposit of copper obtained has a grainy matte surface with a semi-bright appearance in the extreme high current density areas. The copper deposit is removed from the cylinder as a Ballard foil and a sample of the deposit anneals to a Vickers hardness of 136 when it is subjected to an accelerated annealing test by heating the sample to 100°C for 1 hour in an oven. Example I The bath of Reference Example A is modified by replacing the polyether surfactant (Pluracol™ P-710) with 40 mg/l of Pegol™ TDG-1250, an ethoxylated 2,2'-thiodiethanol, and a gravure roll was plated using the same parameters. The deposit of copper so obtained has a uniform semi-bright appearance and an as plated hardness of 200 Vickers. A sample of the deposit does not anneal when it was subjected to the heretofore described accelerated annealing test. Example II A gravure roll is plated in the bath of Example I at the same parameters except the level of immersion is 30%. The deposit of copper obtained has a uniform semi-bright appearance and an as plated hardness of 198 Vickers. A sample of the deposit does not anneal when it is subjected to the accelerated annealing test. Example III The bath of Example I is modified by the addition of 3 mg/l of 2-imidazolidinethione as a grain refining compound and a gravure roll is plated using the same parameters. The deposit of copper obtained has a uniform bright appearance and an as plated hardness of 225 Vickers. A sample of the deposit does not anneal when it is subjected to the accelerated annealing test. Example IV A gravure roll is plated in the bath of Example III at the same parameters except that the level of immersion is 30%. The deposit of copper obtained has a uniform bright appearance and an as plated hardness of 220 Vickers. A sample of the deposit does not anneal when it is subjected to the accelerated annealing test. Example V A plating bath is prepared containing 210 g/l of copper sulphate pentahydrate, 60 g/l of sulphuric acid and 50 ppm of chloride added as hydrochloric acid. A first premixed make-up aqueous additive package (A) is formulated to contain 2.5 g/l of the sulphurized benzene sulphonate and 10 g/l of Pegol™ TDG-1250. Premix concentrate (A) is then added to the above-described bath to give a concentration of 0.4% of premix concentrate (A) in the bath. A second premix aqueous concentrate (B) is formulated to contain 5 g/l of the sulphurized benzene sulphonate 20 g/l of Pegol™ TDG-1250 and 1.68 g/l of 2-imidazolidinethione of which is added to the bath in an amount sufficient to give a 0.2% concentration of premix concentrate (B) in the bath. A gravure roll is plated 50% submerged at 29°C at 21.53 amps/dm² (200 amps/ft²) while being rotated at 27.9 m²/min (300 ft²/min) to produce a deposit 0.508 mm (0.020 inch) thick with a Vickers hardness of 220. The deposit on the cylinder demonstrates good engravability by the electronic method. The deposit hardness does not change from the as plated values for the presently monitored 5 months. It should be noted that the bath in Example V has been tested under commercial conditions. The bath has been operated continuously as a two shift operation with weekend shutdown periods of one to two days. Over a current density range of 0.16 to 0.32 amps/cm² (1 to 2 amps/in²) and a temperature range 24°C to 41°C at various levels of cylinder submersions, including 25%, 50%, 75% and 100% immersion, the bath has produced copper deposits for electronic engraving that do not anneal. A further advantage to the combined use of the prescribed additives is the ability to adjust the internal stress properties of the copper deposit. The capability of providing a copper deposit of desired stress is a significant advantage in gravure operations employing the Ballard Process where the copper foil is removed from the cylinder, as well as in other electro-forming applications. Another advantage to the combined use of the prescribed additives is the ability to control the operating bath by Hull Cell analysis as indicated in the following table. Generally the bath is controlled by placing a sample of the bath in a Hull Cell; forming a deposit on a panel in the Hull Cell; determining the roughness or brightness of the deposit on the panel by comparison to a control panel or a brightness range; and, depending on the results obtained in the Hull Cell, adding to the bath a mixture containing an alkoxythio compound (e) a sulphonated, sulphurized hydrocarbyl compound (c), and optionally the grain refining thio compound (d), thereby to control the roughness and/or brightness of the copper deposit obtained using that bath. Panel 1-1 1-2 2-1 Example V CuS0₄5H₂O 210 g/l 210 g/l See Ex. V for details of composition used H₂SO₄ 60 g/l 60 g/l HCl 51 ppm 51 ppm Premix A (see Ex. V) 0.4%W Premix B (see Ex. V) 0.2%W Results smooth satin semi-bright HCD to MCD dull MCD to LCD bright rough HCD/Haze smooth HCD bright to LCD HCD = High Current Density MCD = Mid Current Density LCD = Low Current Density As can be seen from the above data, control of plating bath may occur by adding Premix A or Premix B. Premix A controls roughness of the panel deposit and Premix B controls brightness. By examining the panel produced from the Hull cell and using brightness and/or roughness specifications, an operator may control the plating by adding quantities of Premix A or Premix B. For instance, if the panel has roughness at the high current density, an operator may add Premix A to the bath. An operator may be human or mechanical, such as pumps controlled by a computer.

Claims: A method of electroplating a gravure roll, which comprises totally or partially immersing the roll in an aqueous copper-plating bath containing, in solution: a) copper b) sulphuric acid, c) a sulphonated, sulphurized hydrocarbyl compound, and optionally d) a grain refining thio compound containing an -NC(S)- or -NC(S)N- group; and passing an electric current through the bath to deposit a layer of copper on the surface of the roll, characterised in that the bath additionally contains (e) an alkoxythio compound. A method according to claim 1, wherein the alkoxythio compound is of the formula H(OR) n S(RO) n H or R₁S(RO) n H where R is C₁-C₈ alkylene; R₁ is hydrogen or C₁-C₁₂ alkyl; and each n independently has a value or average value in the range 1 to 20. A method according to claim 2, wherein, in said formulae: R is C₂-C₄ alkylene; R₁ is C₁-C₆ alkyl; and each n independently has a value or average value in the range 7 to 11. A method according to claim 1, wherein the alkoxythio compound is an ethoxylated thiodiglycol. A method according to any one of claims 1-4, wherein the alkoxythio compound is present in the bath in an amount of from 0.01 to 1.0 g/l, preferably 0.05 to 0.1 g/l. A method according to any one of claims 1-5, wherein the bath contains: (a) 150 to 225 g/l, preferably 200 to 210 g/l of copper sulphate pentahydrate; (b) 35 to 90 g/l, preferably 50 to 60 g/l sulphuric acid; (c) 1 to 100 mg/l, preferably 10 to 40 mg/l of the sulphonated sulphurized hydrocarbyl compound; and (d) 0 5 to 5.0 mg/l of the grain refining thio compound. A method according to claim 6, wherein the bath also contains from 20 to 80 ppm chloride ion, preferably 40 to 60 ppm. A method according to any one of claims 1-7, wherein the grain refining compound (d) is 2-thiohydantoin, 2-imidazolidinethione or 1,1'-thiocarbonyldiimidazole. A method according to any one of claims 1-8, wherein the electroplating is carried out at a current density of from 6.46 to 51.67 amps/dm², preferably 10.76 to 21.53 amps/dm². An electroplating bath composition comprising, in aqueous solution: (a) copper; (b) sulphuric acid; (c) a sulphonated, sulphurized hydrocarbyl compound and optionally (d) a grain refining thio compound containing an -NC(S)- or -NC(S)N- group; characterised in that the composition also contains (e) an alkoxythio compound. A composition according to claim 10, wherein the alkoxythio compound is as defined in any one of claims 2-4. A composition according to claim 10 or 11 containing: (a) 150 to 225 g/l, preferably 200 to 210 g/l, of copper sulphate pentahydrate; (b) 35 to 90 g/l, preferably 50 to 60 g/l, sulphuric acid; (c) 1 to 100 mg/l, preferably 10 to 40 mg/l of the sulphonated, sulphurized hydrocarbyl compound; (d) 0.5 to 5.0 mg/l of the grain refining thio compound; and (e) 0.01 to 1.0 g/l, preferably 0.05 to 0.1 g/l of the alkoxythio compound. A composition according to claim 12, which also contains 20 to 80 ppm chloride ion, preferably 40 to 60 ppm. A composition according to any one of claims 10-13, wherein the thio grain refining compound (d) is 2-thiohydantoin, 2-imidazolidinethione or 1,1'-thiocarbonyldiimidazole. A method of controlling the roughness and/or brightness of a copper deposit during the electroplating of a gravure roll in an aqueous copper plating bath containing, in solution: a) copper; b) sulphuric acid; c) a sulphonated, sulphurized hydrocarbyl compound; and optionally d) a grain refining thio compound containing an -NC(S)- or -NC(S)N- group, which comprises: i) taking a sample from the bath; ii) transferring the sample to a Hull cell; iii) forming a deposit on a panel in the Hull cell using said sample; iv) determining the roughness and/or brightness of the deposit formed on the panel in the Hull cell; and v) adding to the bath, depending upon the results determined in step iv), a mixture containing an alkoxythio compound, a sulphonated, sulphurized hydrocarbyl compound and optionally additional grain refining compound thereby to control the roughtness and/or brightness of the copper deposit on the roll. A method according to claim 15, wherein the alkoxythio compound is a compound as defined in any one of claims 2-4.

Inventors: FRISBY C RICHARD, FRISBY, C. RICHARD
Applicants: ROHCO INC MCGEAN, MCGEAN-ROHCO, INC.
Application year: 1991
Main classification: C25D3
IPC codes: B41C1, C25D3, C25D7, F16C13