POLYMERS OF HIGH REFRACTIVE INDEX AND HIGH HEAT DISTORTION TEMPERATURE

Abstract: Polymerizable compositions comprising epichalcogen resin, polythiol, and cyclic anhydride are useful for preparing polymerizates of high refractive index and high heat distortion temperature.

Description: POLYMERS OF HIGH REFRACTIVE INDEX AND HIGH HEAT DISTORTION TEMPERATURE Aliphatic polyol poly(allyl carbonate) monomer, most notably diethylene glycol bis(allyl carbonate), has for many years been used in producing ophthalmic lenses. Such lenses exhibit refractive indices that are sufficient for many, if not most, ophthalmic applications. There is a need, however, for polymeric lenses of higher refractive indices than those ordinarily provided by polymers of aliphatic polyol poly(allyl carbonate). This need centers around the desire to reduce the volume of material required to produce a lens of given size, minimum thickness, and optical correction, which volumetric reduction can be achieved through use of polymeric materials having higher refractive indices. Polymers of various types and descriptions which have such higher refractive indices are indeed known. High refractive index is not the only criterion, however. The polymer must also possess other physical properties which render it satisfactory for ophthalmic lenses. Among such physical properties are high heat distortion temperature and for most ophthalmic applications, acceptably low yellowness. Some polymers have satisfactorily high refractive indices, but fail to exhibit one or more other satisfactory physical properties. Most thermoset organic ophthalmic lens blanks and some lenses are produced from polymerizable compositions by casting procedures. It is therefore highly desirable that the polymerizable compositions be pourable at the casting temperature. Satisfying this characteristic imposes an additional constraint on systems for producing high refractive index lenses. The search for those polymerizable compositions which are castable and capable of producing polymers exhibiting higher than usual refractive indices and other satisfactory physical properties, therefore continues. High refractive index lenses produced by polymerizing a resin having at least two epoxy groups and/or epithio groups in one molecule with a polythiol is known. See, for example, published application 089/10575, the disclosure of which is, in its entirety, incorporated by reference. The resulting polymers often have high refractive indices, but the heat distortion temperatures are often low. Polymers produced by polymerizing resins having at least two epoxy groups with cyclic anhydrides is also known. See, for example United States Patent No. 2,324,483, the entire disclosure of which is incorporated herein by reference. The resulting polymers frequently have satisfactorily high heat distortion temperatures, but the refractive indices are usually low. Polymerizable compositions have now been found which are capable of producing polymers of high refractive indices, high heat distortion temperatures, and other physical properties satisfactory for ophthalmic purposes. Accordingly, one embodiment of the invention is a polymerizable, homogeneous composition comprising: (a) epichalcogen resin having an average epichalcogen functionality of at least about 1.5 wherein each epichalcogen group is independently an epoxy group or an epithio group; (b) polythiol having an average thiol functionality of at least about 2; and (c) cyclic anhydride. Another embodiment of the invention is a polymerizate produced by polymerizing a polymerizable, homogeneous composition comprising: (a) epichalcogen resin having an average epichalcogen functionality of at least about 1.5 wherein each epichalcogen group is independently an epoxy group or an epithio group; (b) polythiol having an average thiol functionality of at least about 2; and (c) cyclic anhydride, the polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. As used herein and in the claims, epoxy means epoxyethyl which is also known as oxiranyl; epithio means epithioethyl; epichalcogen groups mean epoxy groups and epithio groups; and epichalcogen resin means a compound containing one or more epichalcogen groups or a mixture of such compounds. The epichalcogen resin may be aliphatic, but it usually contains one or more aromatic groups. Although the epichalcogen resin may contain epoxy groups, epithio groups, or both epoxy and epithio groups, most frequently all of the epichalcogen groups are epoxy groups in which case the epichalcogen resin is classified as an epoxy resin. The average epichalcogen functionality is the average number of epichalcogen groups per molecule of epichalcogen resin. The average epichalcogen functionality of the epichalcogen resin is at least about 1.5. Often the average epichalcogen functionality is at least about 2. At least about 2.2 is preferred. In most cases the average epichalcogen functionality is from about 1.5 to about 4. Frequently it is from about 2 to about 3.7. From about 2 to about 2.5 is preferred. Many epichalcogen resins are known. They are usually, but not always, produced by reacting compounds containing at least two active hydrogens with epihalohydrin such as epichlorohydrin or epibromohydrin, and/or l-halo-2,3-epithiopropane such as l-chloro-2,3-epithiopropane or l-bromo-2,3-epithiopropane. Examples of classes of compounds having active hydrogen groups include compounds having two or more a ino groups, the bisphenols, the chlorinated bisphenols, the brominated bisphenols, the polyhydric phenols, the novolak resins, the cresol novolak resins, the aliphatic polyols, compounds having two or more carboxyl groups, and compounds having two or more isocyanate groups. Many specific examples of epichalcogen resins are disclosed in published application WO89/10575 and elsewhere. The preferred epichalcogen resins are the epoxy resins and of these, the aromatic-containing epoxy resins are especially preferred. Examples of aromatic-containing epoxy resins include the diglycidyl ethers of polyphenol compounds such as bisphenol A, tetrabromobisphenol A, tetrachlorobisphenol A, bisphenol B, bisphenol C, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol P, bisphenol S, bisphenol Z, bisphenol AP, bisphenol ACP, 4, 'ethylidenebis[phenol] , and hydroxychlor. Other examples of aromatic-containing epoxy resins include the polyglycidyl ethers of catechol, resorcinol, hydroquinone, pyrogallol, phloroglucinol, novolak resin, cresol novolak resin, phthalic acid, isophthalic acid, and terephthalic acid. The polythiol may contain one or more aromatic groups or it may be aliphatic. In most cases the polythiol is aliphatic. The average thiol functionality is the average number of thiol groups per molecule of polythiol. The average thiol functionality of the polythiol is at least about 2. Often the average thiol functionality is at least about 3. At least about 4 is preferred. In most cases the average thiol functionality is from about 2 to about 6. Frequently it is from about 3 to about 6. From about 4 to about 6 is preferred. The polythiols are themselves well known. Many classes and specific examples of polythiols are disclosed in published application 089/10575 and elsewhere. The preferred polythiols are derivatives of 1,2,3-trimethylolpropane, pentaerythritol, or dipentaerythritol. Examples of these include 1,2,3-trimethylolpropane tri(thioglycolate), 1,2,3-trimethylolpropane tri(3-mercaptopropionate), pentaerythritol tetra(thioglycolate), pentaerythritol tetra(3-mercaptopropionate), dipentaerythritol hexa(thioglycolate), dipentaerythritol hexa(3-mercaptopropionate), and tetrakis(2-mercaptoethylthiomethyl)methane. The cyclic anhydrides are those anhydride compounds in which the anhydride group is part of a ring. These compounds are well known to the art. Examples include succinic anhydride, dodecenylsuccinic anhydride, maleic anhydride, dichloromaleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, hexahydromethylphthalic anhydride, maleic anhydride adduct of cyclopentadiene, maleic anhydride adduct of methylcyclopentadiene, chlorendic anhydride, and pyromellitic dianhydride. Further examples include the chlorinated and/or bro inated derivatives of succinic anhydride, dodecenylsuccinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, hexahydromethylphthalic anhydride, maleic anhydride adduct of cyclopentadiene, maleic anhydride adduct of methylcyclopentadiene, and pyromellitic dianhydride. As used herein and in the claims, the equivalency of an anhydride or mixture of anhydrides is based on the anhydride group per se, and not upon the carboxylic acid groups upon opening the ring. As used herein and in the claims, "aromatic content" means the weight fraction of the material of reference which consists of aromatic ring atoms and any hydrogen atoms directly attached to such atoms, multiplied by 100. Aromatic content is expressed as weight percent. The aromatic content and the sulfur content of the polymerizable, homogeneous composition may vary widely, but usually the aromatic content is at least about 23 weight percent of the composition and the sulfur content is at least about 1.9 weight percent of the composition. Often the aromatic content is from about 23 to about 36 weight percent and the sulfur content is from about 1.9 to about 12 weight percent. An aromatic content of from about 27 to about 36 weight percent and a sulfur content of from about 6 to about 11 weight percent are preferred. The ratio of equivalents of epichalcogen groups to the sum of the equivalents of thiol groups and the equivalents of anhydride groups in the polymerizable, homogeneous composition may also vary widely. In most cases the ratio is from about 0.5:1 to about 1.5:1. Frequently the ratio is from about 0.75:1 to about 1.25:1. Preferably the ratio is about 1:1. The equivalent ratio of thiol groups to anhydride groups in the polymerizable, homogeneous composition is also susceptible to wide variation. Usually the equivalent ratio of thiol groups to anhydride groups in the composition is from about 0.25:1 to about 20:1. Frequently the equivalent ratio is from about 1:1 to about 20:1. From about 3:1 to about 20:1 is preferred. In addition to the epichalcogen resin, polythiol, and cyclic anhydride, the polymerizable composition may also optionally contain various other materials. Examples of such optional materials include other polymers, polyols, polycarboxylic acids, ethylenically unsaturated aromatic-containing compounds, catalysts, mold release agents, dyes, oxidative stabilizers, and ultraviolet light absorbers. This listing of optional ingredients is by no means exhaustive. These and other ingredients may be employed in their customary amounts for their customary purposes so long as they do not seriously interfere with good polymer formulating practice. Preferably, the polymerizable, homogeneous composition contains catalyst to increase the rate of polymerization. There are many different types of polymerization catalysts that can be used, but ordinarily tertiary amine or organo tin catalysts are employed. Examples of such catalysts include triethylamine, dibutyl tin dilaurate, stannous octoate, and butyl stannoic acid. The organo tin catalysts are preferred. When used, the amount of polymerization catalyst present in the polymerizable, homogeneous composition may be widely varied. Ordinarily the polymerization catalyst constitutes from about 50 to about 10000 parts of polymerization catalyst per million parts of polymerizable, homogeneous composition by weight. The amount of polymerization catalyst used in any particular situation will normally depend upon the activity of the particular catalyst under consideration and the pot-life desired. The polymerizable homogeneous compositions of the invention are usually prepared by admixing the various ingredients. Mixing may be accompanied with heating when it is desirable to hasten dissolution of any of the ingredients. However, the temperature should ordinarily be maintained below that at which substantial polymerization commences. In most cases the polymerizable homogeneous compositions of the invention are pourable. The term "pourable" as used herein and in the claims means the viscosity of the composition is sufficiently low that it can be poured into molds commonly used in casting ophthalmic lenses and lens blanks. In most cases the temperature of the polymerizable, homogeneous composition when poured into molds is usually in the range of from about 20 β C to about 100°C. The polymerizable homogeneous compositions of the invention can be polymerized (viz., cured) to form solid crosslinked polymer by the known conventional techniques for polymerizing epoxy-thiol and epoxy-anhydride systems. Preferably, polymerization is accomplished by heating the polymerizable composition to elevated temperatures. Generally polymerization is conducted at temperatures in the range of from about 50°C to about 250 β C Preferably polymerization is conducted at temperatures in the range of from about 60°C to about 150°C. In most cases the polymerizable homogeneous composition is conformed to the shape of the final solid polymerized article before polymerization. For example, the composition can be poured onto a flat surface and heated, whereby to effect polymerization and form a flat sheet. According to a still further exemplification, the polymerizable composition is placed in molds, as for instance glass or metal molds, and the molds heated to effect polymerization, thereby forming shaped articles such as lens blanks or ophthalmic lenses. The present poly erizates have refractive indices at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. Often the refractive index under the same conditions is at least about 1.58. Preferably it is at least about 1.59. The present polymerizates also have a heat distortion temperature of at least about 50°C. In many cases the heat distortion temperature is at least about 55°C. Preferably the heat distortion temperature is at least about 60°C. As used in the present specification and claims, heat distortion temperature is determined in accordance with ASTM D648-86 which is, in its entirety, incorporated herein by reference. In many cases the polymerizates of the present invention, 5 on an undyed and untinted basis, also exhibit one or more favorable properties. Among these favorable properties, may be mentioned an acceptably low yellowness. Another favorable property is a 15-second Barcol hardness of at least about 15. In many cases the 15-second Barcol hardness is at least about 20. As used herein, 10 15-second Barcol hardness is determined in accordance with ASTM D2583-81 using a Barcol Impressor and taking scale readings 15-seconds after the impressor point has penetrated the specimen. The density of most of the polymerizates of the invention is usually about 1.6 grams per cubic centimeter (g/cm ) or lower. 15 Frequently the density is about 1.35 g/cπr* or lower. As used in the present specification and claims, density is determined in accordance with ASTM C729-75 and reported for a temperature of 25°C. ASTM C729-75 is, in its entirety, incorporated herein by reference. 20 The invention is further described in conjunction with the following examples which are to be considered illustrative rather than limiting, and in which all parts are parts by weight and all percentages are percentages by weight unless otherwise specified. 25 GENERAL PROCEDURE FOR EXAMPLES 1-3 Polymerizable, homogeneous compositions were prepared by admixing epoxy resin, polythiol, cyclic anhydride, and dibutyl tin 30 dilaurate at temperatures in the range of from 50°C to 120°C to facilitate mixing and pouring into molds. Each polymerizable, homogeneous composition comprised 5000 parts of dibutyl tin dilaurate per million parts of polymerizable, homogeneous composition, by weight. Glass ophthalmic lens blank molds were surface-treated with Rain-X® silicone release agent (Unelko Corp.). The polymerizable, homogeneous compositions were poured into the surface-treated molds and the filled molds were placed in a hot air oven and exposed to the cure cycle shown in Table 1. When the cure cycle was completed, the molds were removed from the oven and allowed to cool. The resulting polymerizates were then removed from the molds and tested for various physical properties. Abbreviations for materials are shown in Table 2. The identities and amounts of epoxy resin, polythiol, and cyclic anhydride constituting the polymerizable, homogeneous compositions and the results of testing the resulting polymerizates are shown in Examples 1-3. Table 2 Abbreviations Abbreviation Material BPADGE Bisphenol A diglycidyl ether BPFDGE Bisphenol F diglycidyl ether ENR DEN™ 431 epoxy novolac resin (Dow Chemical Co.) PTMP Pentaerythritol tetramercaptopropionate NMA Maleic anhydride adduct of methylcyclopentadiene MHHPA Methyl hexahydrophthalic anhydride HHPA Hexahydrophthalic anhydride PA Phthalic anhydride EXAMPLE 1 Table 3 Table 4 Physical Properties of Polymerizates Table 6 Physical Properties of Polymerizates EXAMPLE 3 Table 7 Table 8 Physical Properties of Polymerizates Although the present invention has been described with reference to specific details of certain embodiments thereof, it is not intended that such details should be regarded as limitations upon the scope of the invention except insofar as they are included in the accompanying claims.

Claims: CLAIMS : 1. A polymerizable, homogeneous composition comprising: (a) epichalcogen resin having an average epichalcogen functionality of at least about 1.5 wherein each epichalcogen group is independently an epoxy group or an epithio group; (b) polythiol having an average thiol functionality of at least about 2; and (c) cyclic anhydride. 2. The polymerizable, homogeneous composition of claim 1 wherein the aromatic content is at least about 23 weight percent and the sulfur content is at least about 1.9 weight percent. 3. The polymerizable, homogeneous composition of claim 1 wherein the ratio of equivalents of epichalcogen groups to the sum of the equivalents of thiol groups and the equivalents of anhydride groups is from about 0.5:1 to about 1.5:1 and wherein the equivalent ratio of thiol groups to anhydride groups is from about 0.25:1 to about 20:1. 4. The polymerizable, homogeneous composition of claim 1 wherein said polythiol is aliphatic. 5. The polymerizable, homogeneous composition of claim 1 which comprises polymerization catalyst. 6. The polymerizable, homogeneous composition of claim 5 wherein said polymerization catalyst constitutes from about 50 to about 10000 parts of said polymerization catalyst per million parts of said polymerizable, homogeneous composition by weight. 7. A polymerizable, homogeneous composition comprising: (a) epoxy resin having an average epoxy functionality of at least about 1.5; (b) polythiol having an average thiol functionality 5 of at least about 2; and (c) cyclic anhydride. 8. The polymerizable, homogeneous composition of claim 7 wherein the aromatic content is at least about 23 weight percent 10 and the sulfur content is at least about 1.9 weight percent. 9. The polymerizable, homogeneous composition of claim 7 wherein the aromatic content is from about 27 to about 36 weight percent and the sulfur content is from about 6 to about 11 weight 15 percent. 10. The polymerizable, homogeneous composition of claim 7 wherein the ratio of equivalents of epoxy groups to the sum of the equivalents of thiol groups and the equivalents of anhydride groups 20 is from about 0.5:1 to about 1.5:1 and wherein the equivalent ratio of thiol groups to anhydride groups is from about 0.25:1 to about 20:1. 11. The polymerizable, homogeneous composition of claim 25 10 wherein the equivalent ratio of thiol groups to anhydride groups is from about 3:1 to about 20:1. 12. The polymerizable, homogeneous composition of claim 7 wherein the average epoxy functionality of said epoxy resin is at 30 least about 2. 13. The polymerizable, homogeneous composition of claim 7 wherein the average epoxy functionality of said epoxy resin is at least about 2.2. 35 14. The polymerizable, homogeneous composition of claim 7 wherein the average thiol functionality of said polythiol is at least about 3. 15. The polymerizable, homogeneous composition of claim 7 wherein the average thiol functionality of said polythiol is at least about 4. 16. The polymerizable, homogeneous composition of claim 7 wherein said polythiol is aliphatic. 17. The polymerizable, homogeneous composition of claim 7 wherein said epoxy resin comprises diglycidyl ether of at least one polyphenol compound selected from the group consisting of bisphenol A, tetrabromobisphenol A, tetrachlorobisphenol A, bisphenol B, bisphenol C, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol P, bisphenol S, bisphenol Z, bisphenol ACP, 4,4'-methylenebis[phenol] , 4,4'-ethylidenebis[phenol] , 4,4'-propylidenebis[phenol] , and hydroxychlor. 18. The polymerizable, homogeneous composition of claim 7 wherein said epoxy resin comprises polyglycidyl ether of at least one polyphenol compound selected from the group consisting of catechol, resorcinol, hydroquinone, pyrogallol, phloroglucinol, novolak resin, cresol novolak resin, phthalic acid, isophthalic acid, and terephthalic acid. 19. The polymerizable, homogeneous composition of claim 7 wherein said polythiol comprises at least one member selected from the group consisting of 1,2,3-trimethylolpropane tri(thioglycolate), 1,2,3-trimethylolproρane tri(3-mercaptopropionate), pentaerythritol tetra(thioglycolate), pentaerythritol tetra(3-mercaptopropionate), dipentaerythritol hexa(thioglycolate), and dipentaerythritol hexa(3-mercaptopropionate). 20. The polymerizable, homogeneous composition of claim 7 wherein said cyclic anhydride comprises at least one member of the group consisting of succinic anhydride, dodecenylsuccinic anhydride, maleic anhydride, dichloromaleic anhydride, phthalic anhydride, hexahydrophthalic anhydride, hexahydromethylphthalic anhydride, maleic anhydride adduct of cyclopentadiene, maleic anhydride adduct of methylcyclopentadiene, chlorendic anhydride, and pyromellitic dianhydride. 21. The polymerizable, homogeneous composition of claim 7 which comprises polymerization catalyst. 22. The polymerizable, homogeneous composition of claim 21 wherein said polymerization catalyst constitutes from about 50 to about 10000 parts of said polymerization catalyst per million parts of said polymerizable, homogeneous composition by weight. 23. The polymerizable, homogeneous composition of claim 22 wherein said polymerization catalyst is tertiary amine or organo tin catalyst. 24. The polymerizable, homogeneous composition of claim 9 wherein: (a) said polythiol is aliphatic; (b) the ratio of equivalents of epoxy groups to the sum of the equivalents of thiol groups and the equivalents of anhydride groups is about 1:1; (c) the equivalent ratio of thiol groups to anhydride groups is from about 3:1 to about 20:1; (d) the average epoxy functionality of said epoxy resin is from about 2.2 to about 2.5; and (e) the average thiol functionality of said polythiol is from about 4 to about 6. 25. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 1, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 26. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 2, said polymerizate having a heat distortion temperature of at least about 50 β C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 27. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 3, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20 β C and a wavelength of 589.3 nanometers of at least about 1.56. 28. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 4, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 29. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 5, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 30. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 6, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 31. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 7, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 32. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 8, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 33. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 9, said polymerizate having a heat distortion temperature of at least about 50 β C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 34. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 10, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 35. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 11, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 36. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 12, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 37. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 13, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 5 nanometers of at least about 1.56. 38. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 14, said polymerizate having a heat distortion temperature of at least about 10 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 39. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 15, said 5 polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 40. The polymerizate produced by polymerizing the 0 polymerizable, homogeneous composition of claim 16, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 5 41. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 17, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 0 42. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 18, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 5 nanometers of at least about 1.56. 43. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 19, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 5 nanometers of at least about 1.56. 44. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 20, said polymerizate having a heat distortion temperature of at least about 10 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 45. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 21, said 15 polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20 β C and a wavelength of 589.3 nanometers of at least about 1.56. 46. The polymerizate produced by polymerizing the 20 polymerizable, homogeneous composition of claim 22, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20 β C and a wavelength of 589.3 nanometers of at least about 1.56. 25 47. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 23, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 nanometers of at least about 1.56. 30 48. The polymerizate produced by polymerizing the polymerizable, homogeneous composition of claim 24, said polymerizate having a heat distortion temperature of at least about 50°C and a refractive index at 20°C and a wavelength of 589.3 35 nanometers of at least about 1.56. 49. The polymerizate of Claim 25 which is in the form of a lens blank. 50. The polymerizate of Claim 25 which is in the form of an ophthalmic lens. 51. The polymerizate of Claim 39 which is in the form of a lens blank. 52. The polymerizate of Claim 39 which is in the form of an ophthalmic lens.

Inventors: COLEMAN CHARLES R, COLTON JAMES, OATES STEPHANIE J, PRABHU VAIKUNTH S, COLEMAN, CHARLES, R., COLTON, JAMES, OATES, STEPHANIE, J., PRABHU, VAIKUNTH, S.
Applicants: PPG INDUSTRIES INC, PPG INDUSTRIES, INC.
Application year: 1991
Main classification: C08G75
IPC codes: C08G59, C08G75, G02B1