Method of patterning a layer

Abstract: An antireflection coating (16) for use with a photolithographic process comprises a layer of organic material that planarizes the surface upon which a photoresist layer (21) is deposited, is highly absorptive of deep ultraviolet actinic light, and can be plasma etched along with an underlying metal layer (11), thereby obviating the need for a separate step to remove the exposed antireflection coating prior to metal etch.

Description: This invention relates to a method of making a semiconductor wafer by providing the wafer with an anti-reflective coating above a layer of conductors. One step in the fabrication of semiconductor devices such as integrated circuits is the formation of a conductor pattern over a semiconductor substrate through photolithographic masking and etching. A photoresist coating over a metal layer is selectively exposed to actinic light directed through a mask defining the desired conductor pattern. After photoresist development, the photoresist layer constitutes a mask having openings defining the desired conductor pattern which are used to permit selective etching of the exposed portions of the metal layer to leave the desired conductor pattern overlying the substrate. The etching is often done in a plasma etch reactor in which a plasma of ions reacts with and etches away the exposed metal portions. Trends toward increased circuit density require a shorter wavelength of the actinic light used for exposing the photoresist, a higher degree of control of surface geometry, and substantial elimination of spurious reflections of the actinic light. It has been recognized that a separate antireflection coating should often be included between the metal film and the photoresist film to prevent exposure of photoresist by reflected components. Deep ultraviolet light is of a sufficiently short wavelength to permit definition within submicron tolerances. However, most substrates are more highly reflective of deep ultraviolet light than longer wavelengths, thereby increasing the need for an effective antireflection coating. PCT International Publication No. WO 90/03598 discloses a process for etching a pattern using an antireflection coating capable of planarizing the surface of the wafer. UK patent application GB 2170649A discloses the simultaneous plasma etching of an antireflective layer and the layer to be patterned. European patent application EP-A-264650 discloses the use of polysulfones as antireflective layers. According to the present invention there is provided a method as defined in claim 1. The invention uses as an antireflection coating for a photolithographic process a layer of organic material that planarizes the surface upon which the photoresist layer is to be deposited, is highly absorptive of deep ultraviolet actinic light, and can be plasma etched along with an underlying metal layer, thereby obviating the need for a separate step to remove the exposed antireflection coating prior to metal etch. To give planarization, the organic material is initially a fluid which is deposited and spun onto the substrate surface such that, after spinning, it settles to a thickness greater than the height of any non-uniformity on the substrate surface. Thereafter, the antireflection coating hardens to provide a planar top surface for conventional coating by spinning of the photoresist material. The photoresist layer is therefore planarized and is made to have a uniform thickness as required for high definition deep ultraviolet lithography. The fluid deposited as the antireflection coating may be a polymer precursor which hardens to form a polymer layer, or it may be a polymer dissolved in a liquid carrier which is hardened through evaporation of the liquid carrier. Several examples of appropriate materials will be given which can be plasma etched simultaneously with an underlying metal layer. These and other objects, features and advantages of the invention will be better understood from a consideration of the following detailed description taken in conjunction with the accompanying drawing. Brief Description of the Drawing FIG. 1 is a flow diagram of a method for photolithographically masking and etching semiconductor devices such as integrated circuits in accordance with an illustrative embodiment of the invention; and FIGs. 2-5 illustrate a coated semiconductor substrate at various stages of the method depicted in FIG. 5. Detailed Description Referring to FIG. 1, there is shown a flow chart depicting successive steps in the photolithographic masking and etching of a layer such as a metal layer overlying a semiconductor substrate. Referring to FIG. 2, the method is intended to create a conductor pattern in a conductive film 11 which overlies a semiconductor substrate 12 and is typically insulated from the substrate by a dielectric layer 13 of a material such as silicon dioxide. Referring again to FIG. 1, the first step 15 of the method is to spin an antireflection coating (ARC) on the upper surface of the metal film 11; that is, to deposit a fluid antireflection coating on a surface and then distribute it by spinning the substrate, in a manner well known in the art. Referring to FIG. 2, the fluid antireflection coating 16 that is spread over the surface of the metal layer 11 is of sufficient viscosity and sufficient thickness to be at least thicker, and preferably three times as thick as, the height of the most prominent surface irregularity on the surface of the metal film 11. As will be discussed more fully below, a polymer precursor or a polymer dissolved in a liquid carrier can be devised to meet the these requirements. A surface irregularity 17 may occur due to an irregularity on the surface of the semiconductor substrate 12 with the layers 13 and 11 conforming to that irregularity so that it is manifested on the upper surface of metal layer 11, as illustrated at 17. As shown in FIG. 1, the second step 18 is to permit the fluid antireflection coating to settle and harden. If a polymer precursor is used, the hardening is the step of polymerization, and if the fluid 16 is a polymer in a carrier, the hardening results from the evaporation of the carrier. Referring again to FIG. 2, this step results in a planarized upper surface 19 of the coating 16. Referring again to FIG. 1, the next step 20 is to coat the upper surface 19 with a layer of photoresist. The photoresist is deposited and distributed, again, by spinning, as is well known in the art which results in a photoresist layer 21 shown in FIG. 3. Because of the planarization of the upper surface 19 of antireflection coating 16, the photoresist layer 21 can be made to have a highly uniform thickness and a highly planar upper surface which are desired for accurate selective exposure by deep ultraviolet light, that is, light having a very short wavelength. The next step 23 of FIG. 1 is to expose selectively the photoresist to deep ultraviolet light. As shown in FIG. 4, the photoresist coating 21 is exposed to ultraviolet light 24 transmitted through an opening in a mask 25. As is known in the art, development of the photoresist coating produces openings 27 in the photoresist coating describing the desired pattern to be formed in the metal layer 11. In accordance with the invention, the antireflection coating and the metal film are simultaneously plasma etched as indicated by step 29 of FIG. 1. Plasmas of halogen compounds are typically used to anisotropically etch metals such as aluminum. Plasma etching requires that the substrate be placed in a reactor in which a plasma is formed by electrically ionizing a reactive gas consisting of CCl 4 . The reactor may be a reactor such as that available from the Applied Materials Corporation of Santa Clara, California, known as the Model 5000 reactor. Referring to FIG. 5, the antireflection coating 16 is reactive with the halogen plasma and so it etches along with the aluminum conductor 11. The patterned photoresist 21 is not etched by the plasma and therefore constitutes a mask for defining the etched pattern in both the antireflection coating and the metal layer 11. After the plasma etch, the photoresist layer 21 and the antireflection coating 16 may be removed by etching, as is known, so as to leave the patterned conductive metal film 11. In one successful embodiment of the method, polybutylsulfone dissolved in chlorobenzene was used as the antireflection coating. Such coating may contain a dye or ultraviolet absorbing material such as bis-(4-azidophenyl)ether, which has a strong absorption in the two hundred fifty to two hundred eighty nanometer range. Deep ultraviolet light in general can be considered as light having wavelengths of less than about three hundred nanometers. The actinic wavelength used of course corresponds to the absorption band of the ARC. A potentially more useful embodiment would be to use as the fluid antireflection coating a liquid precursor of a polysulfone or a polyaldehyde. The hardening of step 18 of FIG. 2 would then occur by polymerizing the precursor. These materials are known to have a low resistance to a halogen plasma etch, and they can be thermally or photochemically polymerized. Another ARC resin that could be used would be poly(methyl)pentenesulfone. This is chemically similar to polybutylsulfone and should be unstable in the plasma environment as is required for plasma etching.

Claims: A method for making semiconductor devices comprising the steps of: making a first aluminum layer (11) on a surface of a substrate (12,13) having an upper surface containing surface irregularities, said first layer being reflective of ultraviolet light; coating the first aluminum layer with a polymer antireflection coating (16) having a thickness greater than the heights of the surface irregularities, said antireflection coating being absorptive of said ultraviolet light; coating the polymer antireflection coating with a photoresist coating (21); exposing said photoresist coating (21) to said ultraviolet actinic light which is not efficiently reflected by the antireflection coating; developing the photoresist to define therein openings (27); and using said openings to selectively etch the portions of the antireflection coating and the first layer exposed by the opening, while leaving unexposed portions thereof intact; wherein said polymer antireflection coating (16) initially comprises a precursor of a polymer which is polymerized to torm a hardened antireflection coating having a substantially planar upper surface; and said polymer precursor is selected from the group consisting of polysulfone and polyaldehyde that is coated on the substrate by depositing it in a fluid form on the substrate, spinning the substrate to distribute the precursor, and then polymerizing the precursor; CHARACTERISED IN THAT said ultraviolet light is deep ultraviolet light, that is, light having wavelengths of less than about three hundred nanometers; and said first layer and said antireflection coating are simultaneously plasma etched at regions exposed by the openings of the photoresist layer to substantially remove such regions of the first layer and antireflection coating exposed by the openings; said plasma etching step employing a reactive gas consisting of CCl 4 , the plasma formed by ionizing said CCl 4 being effective to etch both said first layer and said antireflective layer. The method of claim 1 further characterized in that: the fluid precursor is a polymer dissolved in a liquid carrier; and the hardening step comprises the step of evaporating the liquid carrier. The method of claim 1 further characterized in that: the polymer is polybutylsulfone. The method of claim 1 further characterized in that: the polymer precursor is a precursor of polysulfone. The method of claim 1 further characterized in that: the polymer precursor is a precursor of polyaldehyde.

Inventors: ZIGER DAVID H, ZIGER, DAVID H.
Applicants: AT & T CORP, AT&T CORP.
Application year: 1991
Main classification: H01L21
IPC codes: G03F7, H01L21