Process for fabricating a thin film semiconductor device

Abstract: There is disclosed a semiconductor device comprising a silicon film formed on a substrate having at least a surface formed of an insulative material, the silicon film being heat-treated at a temperature below 600 °C and being partially coated with a silicon oxide film formed by electronic cyclotron resonance plasma CVD.

Description: This invention relates to a process for fabricating a thin film semiconductor device by low-temperature processing the steps of which are conducted at a maximum temperature equal to or lower than about 600°C. Recently, accompanying the enlargement of screens of liquid crystal displays, and increases of their resolutions, the driving method for liquid crystal displays has changed from the simple matrix method to the active matrix method, and increasingly larger volumes of information can be displayed. The active matrix method enables a liquid crystal display to have more than hundred thousands of picture elements, and has one switching transistor for each picture element. As substrates for such liquid crystal displays, transparent insulative substrates are employed, such as fused quartz plates, glass or others, which enable transparent-type displays to be obtained. But in order to advance the enlargement of the display screen and its price reduction it is essential to use inexpensive ordinary glass as an insulative substrate. In these circumstances, a process for fabricating thin film transistors for operating an active matrix liquid crystal display on an inexpensive glass substrate with high performance, retaining this economy has been required. As the channel semiconductor layer of a thin film transistor, usually amorphous silicon or polycrystalline silicon is used, but polycrystalline silicon, which has higher operational speed, is more advantageous for the case that a thin film transistor is integrated up to the driving circuit. Conventionally in fabricating such thin film transistor, thermal oxidation has been used to form a gate insulating layer. That is, to form the gate insulating layer after the formation of a channel silicon layer, a substrate is inserted into an oxidizing ambient atmosphere containing oxygen (O 2 ), laughing gas (N 2 O), vapor (H 2 O), etc. to raise its temperature to 800 - about 1100 °C and partially oxidize the channel silicon layer. On the other hand, various processes have been tried in fabricating thin film semiconductor devices using polycrystalline silicon at maximum processing temperatures below about 600 °C at which inexpensive ordinary glass can be used. They are exemplified by the process in which a channel semiconductor layer is formed by low pressure chemical vapor deposition (LPCVD), and then a gate insulating film is formed by electronic cyclotron resonance plasma CVD (ECR-PECVD) and is further subjected to hydrogenation by e.g., hydrogen plasma radiation. They are also exemplified by the process in which an amorphous silicon thin film is deposited on a channel semiconductor layer, then is heat-treated for about 24 hours at 600 °C, and then a gate insulating film is formed by atmospheric pressure chemical vapor deposition (APCVD) and is subjected to hydrogen treatment (Japanese J. Appl. Phys. 30L 84, üL91). But a number of problems have been pointed out with the above-described prior art processes. Firstly, a problem with the formation of an SiO 2 film by thermal oxidation is the heat resistance of thin film layers and a substrate below the oxide film because the formation of the oxide film involves heat treatment at a high temperature above 800 °C. For example, in the fabrication of switching transistors for a large screen liquid crystal display, nothing other than very expensive fused quartz can stand the high temperatures. In three-dimensional LSI devices as well, this thermal oxidation cannot be practically used because the lower layer transistors are deteriorated by the high temperatures. Next, a problem with the process in which a channel semiconductor layer is formed by LPCVD, and a gate insulating film is formed by ECR-PECVD and is further subjected to hydrogen plasma treatment is that the resultant thin film semiconductor has a mobility as low as 4 - 5 cm 2 / V·sec., which is so far insufficient for thin film semiconductor devices. In addition, this hydrogenation treatment, which is conducted for the improvement of properties of the thin film semiconductor device, etches parts of the various thin films thereof with the adverse result that some of a number of the thin film semiconductor devices are broken. A problem with the process in which an amorphous silicon thin film is deposited on a channel semiconductor layer and is subjected to heat treatment at about 600 °C, and then a gate insulating film is formed by APCVD and is subjected to hydrogenation treatment by hydrogen plasma radiation or others is that the resultant thin film semiconductor device has an interface trap level as high as about 10 12 , and exhibits properties of the depletion-type semiconductor device, which is so far insufficient for the thin film semiconductor device. In addition, the same problem as that involved in the hydrogenation treatment in the previous process is still unsolved, with the adverse result that thin film semiconductor devices cannot be fabricated homogeneously and stably on a large area. In these circumstances has been expected a thin film semiconductor device which has a high mobility and, on the other hand, a clean MOS interface and a low interface trap level, and does not exhibit depletion, and a process which can fabricate such thin film semiconductor devices having these advantages homogeneously and stably on a large area and is free from the hydrogenation treatment in the fabricating steps of such thin film semiconductor devices. The document IEDM 89, pp. 157 to 160, addresses the problems involved in the low temperature process of poly-Si TFTs with a maximum processing temperature of about 600 °C. In this document the following process is suggested: The surface of the poly-Si film is cleaned just before the deposition of the gate insulator without any subsequent exposure to the atmosphere. ECR (Electron Cyclotron Resonance) plasma CVD is mentioned as one of the promising candidates to control MOS interface. In this technology, the poly-Si surface is cleaned by O 2 plasma, followed by the insulator deposition without breaking the vacuum condition. For the grain growth of the poly-Si film at low temperature, laser annealing and solid phase grain growth techniques are said to be candidates. In the solid phase grain growth, the poly-Si film is annealed at around 600 °C for as long as several tens of hours. The document EP-A-0 383 230 discloses a process including forming an amorphous Si film on a substrate by plasma CVD or low pressure plasma CVD on an insulating amorphous material, patterning the film by etching, recrystallizing the film by heat treatment and forming a gate oxide by thermal oxidation, sputtering or the like. An object of this invention is to provide process of fabricating a thin film semiconductor device by low-temperature processing whose maximum processing temperature is below about 600 °C, which has good semiconductor properties, and a process for fabricating such thin film semiconductor devices homogeneously and stably on a large area. This object is achieved with a process as claimed in claim 1. A preferred embodiment of the invention is subject-matter of the dependent claim. The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not to be considered as limiting the present invention. FIG. 1 is a schematic view of the electronic cyclotron resonance plasma CVD device used in the example of this invention; FIGs. 2A to 2F show sectional views of the silicon thin film semiconductor device according to an example of this invention in the respective fabrication steps; and FIG. 3 is a view explaining an effect of this invention. Example FIGs. 2A to 2F show sectional views of the steps for fabricating a silicon thin film semiconductor device constituting a MIS field-effect transistor. In the Example a 235 mm square-quartz glass was used as an insulative substrate 801. The kind and the size of the substrate 801 can be any as long as the substrate 801 is a substrate or a substrate material which can withstand 600 °C. For example, a three-dimensional LSI formed on a silicon wafer can be used as the substrate. A substrate SiO 2 film 802 was deposited by atmospheric pressure chemical vapor deposition (APCVD) on the top surface of the quartz glass 801 which has been subjected to organic cleaning and acid cleaning. This SiO 2 film was deposited using 120 SCCM of silane, 840 SCCM of oxygen and 140 SLM of nitrogen at a 300 °C substrate temperature. The depositing speed was 3.9 Å/sec. and the depositing time was 8 minutes 33 seconds. Then a silicon thin film 803 having a dopant as donors or acceptors added was deposited by low pressure chemical vapor deposition (LPCVD) (FIG. 2A). In the Example this silicon thin film 803 was deposited in a 1500 Å-thickness, using phosphorus as the dopant, and 0.03 SCCM of phosphine (PH 3 ) and 200 SCCM of silane (SiH 4 ) as the raw material gas at a 600 °C depositing temperature. The depositing speed was 30 Å/min, and the sheet resistance immediately after the deposition was 1951 Ω/square. Then a resist was formed on the silicon thin film 803, and the silicon thin film 803 was patterned by a mixed plasma of carbon tetrafluoride (PH 3 ), oxygen (O 2 ), nitrogen (N), etc., and a source and a drain region 804 were formed. Then soil and natural oxide films on the surfaces of the regions 804 were removed, and then immediately an amorphous silicon thin film 805 was deposited by LPCVD (FIG. 2B). In the Example, in the low pressure CVD device, its reaction chamber was made of quartz glass. Around the outside of the reaction chamber there was disposed a heater having three separate zones. The three zones were adjusted so that a required soaking zone could be formed near the center of the reaction chamber. The substrate was placed horizontally in the territory of the soaking zone to deposit the amorphous silicon thin film 805. For the deposition of the amorphous silicon thin film 805, 100 SCCM of silane (Si 2 H 6 ) as the raw material gas), and 100 SCCM of helium as the dilution gas were used. The depositing temperature was 450 °C. In the Example, the exhaustion of the low pressure CVD furnace used in the formation of the amorphous silicon thin film 805 was conducted by a mechanical pump and a rotary pump directly connected to the former. There was provided a conductance valve between the mechanical pump and the reaction furnace. This conductance valve was suitably opened and closed so that the reaction chamber interior pressure could be adjusted and maintained as required. In the Example the reaction chamber interior pressure was retained at 306 mtorr during the deposition of the amorphous silicon thin film 805. The amorphous silicon thin film 805 was deposited in a 307 Å-thickness at a 18.07 Å/min. depositing speed. A resist was formed on the thus-deposited amorphous silicon thin film 805. Then the resist was patterned by a mixed plasma of carbon tetrafluoride (PH 3 ), oxygen (O 2 ), nitrogen (N), etc.. That of the amorphous silicon thin film 805 at the position where a channel region was to be formed was left unremoved. Subsequently this substrate was cleaned with boiling 60 %-concentration nitric acid. Then the substrate was immersed in 20 seconds in 1.67 % hydrofluoric acid aqueous solution to remove the remaining natural oxide films at the positions where a source and a drain region 804, and a channel region were to be formed. When the clean silicon film was exposed, immediately an oxygen plasma 807 was radiated to the exposed silicon film by a electronic cyclotron resonance plasma CVD device (ECR-PECVD device) (FIG. 2C). The ECR-PECVD device used in the Example is schematically shown in FIG.1. The oxygen plasma was formed by guiding 2.45 GHz microwaves to a reaction chamber 202 through a waveguide 201 and feeding 100 SCCM of oxygen from the gas-feed pipe 203 The reaction chamber interior pressure was 1.84 mtorr and the output of the microwaves was 2500 W. An outside coil 204 was provided around the outside of the reaction chamber for applying a magnetic field of 875 Gauss to the oxygen plasma so that the electrons in the plasma satisfied the ECR condition. The substrate 205 was placed perpendicular to the plasma, and the substrate temperature was kept 300 °C by the heater 206. On these conditions the oxygen plasma 807 was radiated for 8 minutes 20 seconds to oxidize that of the amorphous silicon thin film 808 left at the position for the channel region to be formed in, and an SiO 2 film 808 which was to be a part of a gate insulating film was formed. Below the part which was to be a part of the gate insulating layer that of the amorphous silicon thin film 809 which was to be the channel region was left. (FIG. 2E). Successively, with the vacuum maintained, an SiO 2 film 810 which was to be the gate insulating layer was deposited. This SiO 2 film 810 was deposited using 60 SCCM of silane and 100 SCCM of oxygen at a 2250 microwave output, a 300 °C substrate temperature and for 18.7 seconds. The reaction chamber pressure was 2.62 mtorr. The thus-formed multi-layer films were measured by a multi-wavelength dispersive ellipsometry (multi-wavelength spectroellipsometry, MOSS-ES 4G, by Soaplar). The remaining amorphous silicon film 809 which was to be formed in the channel portion had 205 Å. The SiO 2 film formed by the oxidation of the amorphous silicon film 808 had 120 Å. The SiO 2 film 810 had 1500 Å. At the wavelength of 632.8 nm the refractive indices of the SiO 2 film 808 and the SiO 2 film 810 were 1.42 and 1.40 respectively. Then the thus-prepared substrate was inserted in a 600 °C-electric furnace and was heat-treated for 48 hours. At this time, the electric furnace was kept supplied with 99.999 % or higher purity nitrogen gas at 20 I/min. to maintain an inert ambient atmosphere. This heat-treatment at 600 °C in the inert ambient atmosphere crystallized the amorphous silicon left on the part which was to be the channel region to be transformed into a silicon thin film 811 constituting the channel region (FIG. 2E). Subsequently this substrate was placed again into the ECR-PECVD to radiate a hydrogen plasma to the heat-treated substrate. The hydrogen plasma was formed using 100 SCCM of hydrogen at a 300 °C substrate temperature and a 2000 W microwave output. In this state, the reaction chamber interior pressure was 1.97 mtorr, and the hydrogen plasma radiation was conducted for 45 minutes. Then chrome was deposited in 1500 Å by sputtering. A gate electrode 812 was formed by patterning. At this time the sheet resistance was 1.36 Ω/square. A contact hole was formed in the gate insulating film, and a source and a drain electrode 813 were formed by sputtering or other techniques, and a transistor was completed by patterning (FIG. 2F). In the Example, as the material of the source and the drain electrodes aluminum of a 8000 Å-thickness was used. The sheet resistance of this aluminum was 42 mΩ/square. One example of characteristics of the thus-fabricated thin film transistor (TFT) is shown in FIG. 3 at 9-a. Here Ids (ordinate) denotes a source-drain current. The measurement was conducted at Vds = 4 V and at 25 °C. The transistor had a channel length of L = 10 µm and a width of W = 100 µm. When the transistor was turned on at Vds = 4 V and Vgs = 10 V, its ON-state current was Ids = 34.5 µA. The resultant thin film semiconductor device had such good transistor characteristic. The field effect mobility of this transistor based on the saturation current region was 12.52 cm 2 /V·sec. The transistor characteristic of a thin film semiconductor device fabricated by the prior art is shown as a control at 9-b. This thin film semiconductor device fabricated by the prior art was fabricated by the same process as the Example except that the channel silicon thin film of the former was deposited at 600 °C by low pressure CVD, and the oxygen plasma was not radiated. The device for depositing the channel silicon thin film by low pressure CVD was the same as that used in the Example in depositing the amorphous silicon thin film. The channel silicon thin film was deposited in 1 252 Å-thickness using 24 SCCM of monosilane as the raw material gas at a reaction furnace interior pressure of 13.8 mtorr and a 19.00 Å/min. depositing speed. The ON-state current of the TFT fabricated by the prior art was Ids = 4.6 µA, and the field effect mobility there was 4.40 cm 2 /V·sec. As another control, a thin film semiconductor device was fabricated by the same process as the Example except that the channel silicon thin film which was deposited at 600 °C by low pressure CVD as done in the above-described prior art was subjected to oxygen plasma radiation before the deposition of the gate insulating film. The TFT characteristic of this thin film semiconductor device was measured. The TFT characteristic did not substantially change due to the oxygen plasma radiation, and the Vgs-lds curve of this TFT, which was subjected to the oxygen plasma radiation agreed with that of 9-b. The ON-state current of this TFT was Ids = 4.7 µA, and its field effect mobility was 4.44 cm 2 /V·sec. The oxygen plasma radiation is not much effective in the prior art in which the channel silicon thin film is deposited at 600 °C by low pressure CVD. The TFT characteristic of a thin film semiconductor device fabricated by further another prior art is shown at 9-c. This thin film semiconductor device was fabricated by the same process as the Example except that the oxygen plasma radiation was not conducted. That is, an amorphous silicon thin film was deposited as the channel silicon layer and then was subjected to heat-treatment at 600 °C. But the oxygen plasma radiation was not conducted before the formation of the gate insulating layer. The TFT fabricated by this prior art had a depletion of -10 V and had a poor rise characteristic. The ON-state current of this thin film semiconductor device was 12.1 µA at Vds = 4 V and Vgs = 10 V. The field effect mobility was 9.94 cm 2 /V·sec. It is seen from these results that the transistor characteristic of the thin film semiconductor device is drastically improved only when the amorphous silicon thin film which is to be the channel region is radiated with an oxygen plasma and then heat-treated to crystallize the channel silicon thin film. This is because the oxidation of the surface of the amorphous silicon film by the oxygen plasma produces clean MIS interfaces, and the crystallization is performed. Thus it is seen that the example of this invention has much better semiconductor characteristics than those fabricated by the prior art.

Claims: A process of fabricating a thin film semiconductor device by low-temperature processing the steps of which are conducted at a maximum temperature equal to or lower than about 600°C comprising: a first step of forming an amorphous silicon film on an insulating surface of a substrate, a second step of removing natural oxide films by immersing the substrate into an aqueous cleaning solution including hydrofluoric acid, a third step of radiating an oxygen plasma to the amorphous silicon film to form a first gate insulating film, a fourth step of forming a second gate insulating film by the CVD method on the first gate insulating film successively to the third step a fifth step of heat-treating the thus prepared substrate at 600°C in an inert ambient atmosphere so as to crystallize the amorphous silicon film, and a sixth step of forming a gate electrode on the second insulating film, the first to sixth steps being performed in this order. The process of claim 1, wherein said first step is for forming a silicon film for a channel region of a thin film transistor.

Inventors: LITTL THOMAS W, MIYASAKA MITSUTOSHI, LITTL, THOMAS W., MIYASAKA, MITSUTOSHI
Applicants: SEIKO EPSON CORP, SEIKO EPSON CORPORATION
Application year: 1991
Main classification: H01L29
IPC codes: H01L21, H01L29