Adhesive composition

Abstract: An adhesive composition containing biological calcium compound as an adhesion improver. The biological calcium compound can be selected from, for example, hydroxyapatite, seashells and egg shells. The adhesive composition can give good adhesion to metals without surface pretreatment.

Description: The present invention relates to an adhesive composition. Conventionally, to adhere metals such as aluminum, the metal surface to be adhered was generally pretreated with chemical treatment such as FPL etching and phosphoric acid anodization. It was intended to obtain a firm adhesive performance by removing the surface soiling, oil, or weak oxide film to form a strong oxide film, or roughening the surface by etching or the like. In the case of an adhesive which requires pretreatment of the adherend chemically or physically, considering the working efficiency and total cost of adhesion, it is extremely complicated in operation for use in assembly of constituent parts of electric products (devices), furniture, automobiles, or the like. It is therefore considered a very important improvement to change the design of the adhesive so as to exhibit a favorable adhesion without resort to the existing pretreatment process. There have been proposed adhesives presenting favorable adhesion by applying them directly onto metal surfaces without pretreatment. For example, the Japanese Official Patent Provisional Publication, Showa 63-6074, proposes a water-based dispersion adhesive prepared by adding monovalent sodium phosphate or trimethyl phosphate to an ethylene-based ionomer resin dispersion. This adhesive is used in adhesion of aluminum foil with the ethylene-based ionomer resin film or polyester film, and as compared with other adhesives not containing sodium phosphate or trimethyl phosphate, the 180° peeling-off strength is improved. The Japanese Official Patent Gazette, Heisei 2-8633, proposes a curable polyurethane adhesive composition comprising diphenylmethane diisocyanate modified matter, polyol, and organic phosphate compound possessing at least one -SH group. This adhesive is used in adhesion of an iron piece treated by sand blasting, and stainless steel, aluminum, copper, zinc, tin, and zinc plated chromatetreated material, and the peeling strength is improved as compared with an adhesive not containing the organic phosphate compound. The adhesives proposed in these two publications possess satisfactory adhesive power, but the adhesive strength is not sufficient when used in applications requiring greater adhesion such as adhesion of metal to metal for automobiles. JP-A-63154779 discloses an adhesive composition containing hydroxyapatite filler in an acrylic resin, for adhering ceramics to metals, particularly for dental use . JP-A-59172570 discloses an adhesive for bonding a woven fabric liner to the interior of a water pipe; it contains limestone filler in one or both of the resin and hardener of a 2-pack epoxy adhesive, the particular resin/hardener combination specified giving operating advantage in the working environment concerned. The invention presents an adhesive composition containing hydroxyapatite (HAp) as an adhesion improver. The present inventors, as a result of accumulated studies for solving the problems involved in conventional adhesives, have discovered that in conventional adhesives sodium phosphate, trimethyl phosphate, or organic phosphate compound (capable of bonding with the oxide film chemically) was used to enhance bonding force with the oxide film of a metal surface which is not pretreated on the adhered surface, but that interaction of these compounds with matrix composition was not sufficiently taken into consideration. Accordingly, the inventors considered that the compounds to be added to improve the bonding force of the adhesive with the oxide film of the nonpretreated metal surface could improve the adhesive power of the entire adhesive if they could exhibit an interaction also with the matrix composition in the adhesive layer. HAp is a bio-Ca compound; bio-Ca compounds are biological derivatives among compounds containing calcium, for example, compounds formed by calcification. Other practical examples of bio-Ca compound include: seashells (e.g. scallop, clam, short-necked clam, freshwater clam), egg shell, and limestone, and may be used with HAp. The bio-Ca compound used in the invention is preferably cleaned, crushed, and used in powder form of a mean particle size of 10 µm or less; with greater particle sizes the adhesion performance may be poor. In the invention the bio-Ca compound does not include materials obtained by chemical synthesis, such as light calcium carbonate, its high purity flour, and calcium compound reagents. HAp is an inorganic filler whose typical structural formula is M 10 (ZO 4 ) 6 (OH) 2 [where M is Ca or Pb and Z is As, P, or V], and it is generally Ca 10 (PO 4 ) 6 (OH) 2 . Some HAp used in the invention contains impurities (0.1 to 0.5 ppm generally),but there is no performance problem due to this. The amount of bio-Ca compound used is not particularly limited, but is preferably 1 to 8 parts by weight (hereinafter "parts" means "parts by weight") per 100 parts of matrix composition. Out of this range, the additive effect of the bio-Ca compound may not be optimum. The adhesive composition of the present invention includes a matrix component selected from isocyanate compounds possessing two or more isocyanate groups and epoxy resins (optionally modified with toughener such as rubber) ; other thermoplastic elastic polymers such as rubber and thermoplastic elastomer may be included. The matrix composition may be a combination - depending on end use of the adhesive or the like. As combinations,for example, modified resins of epoxy resin and reactive elastomer, and a polymer blend of isocyanate compound and polyester resin may be listed. An isocyanate compound possessing two or more isocyanate groups to be used in the present invention is for example, a urethane prepolymer. The urethane prepolymer is desired to have an amine equivalent of 450 to 1,500, or more preferably 500 to 800. A urethane prepolymer having such a range of amine equivalents has the number-average molecular weight of, for example, 1,000 to 4,000. If the amine equivalent (or the number-average molecular weight) is lower than the specified range, since the molecular weight is small, the toughness after crosslinking may be insufficient, and above this range the viscosity becomes very high and handling may be difficult. The isocyanate compound to be used herein is not particularly limited as long as it possesses two or more isocyanate groups. Examples of the urethane prepolymer include, for example, isocyanate derivatives such as tolylenediisocyanate-based urethane prepolymer, methylenediphenyldiisocyanate-based urethane prepolymer, hexamethylenediisocyanate-based urethane prepolymer, and xylylenediisocyanate-based urethane prepolymer, isophoronediisocyanate-based urethane prepolymer, which may be used alone or in combination of two or more. When using the above-mentioned isocyanate compound possessing two or more isocyanate groups as matrix component, an epoxy resin or the like may be used as required for the purpose of improving adhesion. The formulating ratio of the isocyanate compound and epoxy resin is, for example, 5 to 25 parts of the epoxy resin to 100 parts of the isocyanate compound. As epoxy resin for use in the present invention, there is no particular limitation as long as the compound possesses two or more epoxy groups, and typical examples are an epoxy resin of bisphenol A type, an epoxy resin of bisphenol F type, an epoxy resin of phenol novolak type, and their modified resins, which may be used either alone or in combination of two or more. The epoxy resin preferably has an epoxy equivalent of 180 to 700, or more preferably 180 to 200. If the epoxy equivalent is lower than the above range, the molecular weight is low and brittleness may result; if higher, the molecular weight becomes high and the resin may solidify and is hard to handle. When using the above epoxy resin as matrix composition, various reactive elastomers may be used for enhancing the adhesion property as required. They may be blended at 5 to 100 parts to 100 parts of epoxy resin. Thermoplastic elastic polymers for use in the invention are not particularly limited, and typical examples are thermoplastic elastomers such as chloroprene-based rubber, SBR (styrene-butadiene two-dimensional random copolymer), SBS (styrene-butadiene-styrene three-dimensional block copolymer), SIS (styrene-isoprene-styrene three-dimensional block copolymer), EVA (ethylene-vinyl acetate copolymer), and α-olefin copolymer. The adhesive composition of the present invention may contain one or more components, as required, in addition to the above ingredients. For example, solvent, hardener, curing accelerator, tackifier resin, wax, and antioxidant may be cited. The forementioned isocyanate compound is hardened in the presence of moisture contained in the air or atmosphere, or by a curing agent, and forms a three-dimensional crosslinked structure. As the hardener, for example, a compound having one or more active hydrogens (called an active hydrogen compound) is used. Practical examples of such compounds include aromatic polyamine, aliphatic polyamine, polyol, polycarboxylic acid, polyamide, and phenols, which may be used either alone or in combination of two or more. When using a hardener, the formulating is not particularly defined, but it is desired to add it in a theoretically ideal amount derived by calculating the stoichiometric ratio between the forementioned isocyanate compound and the active hydrogen compound. When using epoxy resin, a hardener and curing accelerator are used. In the present invention, when using an epoxy resin in the matrix composition, an aromatic polyamine, aliphatic polyamine, thiol, polymercaptane or the like may be used as the hardener, and tertiary amine, carboxylic acid, phenol, or addition product of an epoxy resin with a compound having a tertiary amino group may be used as the curing accelerator. The amount of the hardener is determined by calculating the stoichiometric ratio between the epoxy resin and the active hydrogen compound. The curing accelerator is added at 1 to 10 wt.% (based on the whole weight of epoxy resin), for example. As a toughener for the epoxy resin, for example, it is also possible to add a reactive elastomer which is other liquid rubber or epoxy resin modified thereby. The formulating ratio of forementioned other components is not particularly limited, but may be, for example, 0 to 100 parts to 100 parts of isocyanate compound. The adhesive composition of the present invention may be used as a reactive hot melt adhesive by using the above isocyanate compound and HAp. In this case, usually, curing of the isocyanate compound occurs due to moisture. Also, by using a thermoplastic urethane prepolymer as the isocyanate compound and HAp, it may be used as a reactive hot melt adhesive. The adhesive composition of the present invention may be used in adhesion between metals (for example, iron, aluminum, zinc, copper), or adhesion of a metal and another adherend (for example, glass, plastic, timber). When applied to the adherend, the thickness is, for example, 0.3 to 0.5 mm. In the case of metals, if coated without pretreatment, it is bonded with an oxide film to build up a strong adhesion property. If a film of an oily substance exists on the surface, it also displays powerful adhesion. Accordingly, the adhesive composition of the invention, for example, may be used in adhesion between metals for automobiles, between glass and metal, or between plastic and metal. The adhesive composition of the invention may also be used as a sealant. Other bio-Ca compound added as adhesive improver interacts with an oxide film on a metal surface, or may interact with the matrix composition in the adhesive. Accordingly, without carrying out pretreatment (for example, chemical treatment) of the metal surface, adhering is possible, and the adhesion property may be excellent for long periods. When an isocyanate compound is used in the matrix composition, curing reaction occurs between the isocyanate compound and active hydrogen compound, thereby forming a crosslinked structure. when an epoxy resin is used in the matrix composition, an epoxy ring (oxilane ring) of the epoxy resin reacts with the active hydrogen in active hydrogen compound to open the ring forming a three-dimensional crosslinked structure in series, thereby forming a tough adhesive layer. When a thermoplastic elastic polymer is used in the matrix composition, although chemical interaction does not occur in the solvent type, adhesion property is revealed by evaporating solvent; in a hot melt type the hot melt material is cooled to room temperature to reveal the adhesion property. The adhesive compositions of the present invention are as -described above; in actual adhesion operation, pretreatment of metal surfaces is unnecessary, and excellent adhesion can be obtained. Embodiments of the present invention are described below together with comparison examples, but the invention is not limited to the undermentioned embodiments. - Example 1 - Using 8.0 parts of urethane prepolymer (produced by Takeda Chemical Industries, Ltd.) having an amine equivalent of 650, which is synthesized from TDI (tolylenediisocyanate) and PTMG (poly (oxytetramethylene) glycol), 1.0 part of aromatic polyamine (made by Ciba-Geigy (Japan) Ltd., amine value of 8.0 to 8.9 mol/kg, licuid), and 0.1 part of HAp (tradename "Hydroxyapatite BC" of Nitta Gelatin Inc., mean particle size 5 µm, particle size distribution in a range of 4 to 12 µm, granular), an adhesive composition was prepared by agitating and mixing (until the HAp becomes uniform) in a 100 ml polyethylene (PE) beaker at room temperature. - Examples 2 to 4 and Comparison 1 - Adhesive compositions were prepared by the same procedure as in Example 1 as shown in Table 1. For the adhesive compositions obtained, the peeling strength was investigated, and the results are shown in Table 1. For measurement of peeling strength, an aluminum plate of 150 mm x 150 mm x 0.3 mm thickness was used without surface treatment. On this aluminum plate, the adhesive composition was applied at a coating thickness of 0.3 to 0.4 mm by means of a doctor blade, and two aluminum plates were applied together with insertion of a 0.4 mm spacer. The curing was under conditions of 160°C, 15 minutes, and 50 kg/cm 2 by means of a heat press. Afterwards, the test piece was cut to 25 mm width, and the stationary adhesive peeling strength was measured at a temperature of 23°C, in 65% RH, at crosshead speed of 300 mm/min by means of Instron type autograph model S-2000 made by Shimadzu Corporation. This method conforms to JIS K 6854-77. The fracture extent was classified as A for adhesive failure, AC for mixed adhesive/cohesive failure, and C for cohesive failure, by observing the portions peeled at the time of peeling strength measurement. Comparison 1 Example 1 Example 2 Example 3 Example 4 Formulation (parts) Urethane prepolymer 8.0 8.0 8.0 8.0 8.0 Polyamine 1.0 1.0 1.0 1.0 1.0 HAp - 0.1 0.5 0.8 1.0 T-peel strength [kg/25 mm] 15.8 22.5 29.0 25.0 19.3 Fracture type A AC C AC A As shown in Table 1, by varying the amount of HAp, the adhesion reaches a peak at a certain ratio, that is at 0.5 parts per 8.0 parts of isocyanate compound. Examples 5 to 8 Adhesive compositions were prepared by the same procedure as in Examples 1 to 4, except that the HAp had a mean particle size of 8 µm and a particle size distribution of 4 to 12 µm. For these adhesive compositions, exactly the same results as in Examples 1 to 4 were obtained. - Examples 9, 10 and Comparison 2- Adhesive compositions were prepared by the same procedure as in Example 1 as shown in Table 2. The epoxy resin A is an elastomer-modified epoxy resin (epoxy equivalent 300) produced by Mitsui Toatsu Chemicals Inc. The polyamine and HAp were the same as in Example 1. Using the adhesive compositions obtained, the peeling strength and fracture type were investigated by the same procedure as above except that the curing time was 45 minutes; the results are shown in Table 2. Comparison 2 Example 9 Example 10 Formulation (parts) Epoxy resin A 10.0 10.0 10.0 Polyamine 2.0 2.0 2.0 HAp - 0.5 1.0 T-peel strength [kg/25 mm] 8.0 11.2 10.4 Fracture type A AC A As shown in Table 2, in the adhesive compositions using the epoxy resin as a matrix component, the adhesion property was improved by adding the HAp. - Examples 11, 12 and Comparisons 3, 4 - Adhesive compositions were prepared by the same procedure as in Example 1 as shown in Table 3. The urethane prepolymer, polyamine, and HAp were as in Example 1. The epoxy resin B was an epoxy resin of bisphenol A type (epoxy equivalent 190) produced by Dainippon Ink And Chemicals, Inc.,the epoxy resin C was an epoxy resin of bisphenol A type (epoxy equivalent 190) of Yuka Shell Epoxy Co., and DICY was dicyandiamide produced by Nippon Carbide Co., Ltd. Using the adhesive compositions obtained, the peeling strength and fracture mode were investigated as in Example 1; the results are shown in Table 3. Comparison 3 Example 11 Comparison 4 Example 12 Formulation (parts) Urethane prepolymer 8.0 8.0 8.0 8.0 Epoxy resin B 2.0 2.0 - - Epoxy resin C - - 2.0 2.0 Polyamine 1.0 1.0 1.0 1.0 DICY 0.2 0.2 0.2 0.2 HAp - 0.5 - 0.5 T-peel strength [kg/25 mm] 25.6 35.0 25.6 35.0 Fracture type AC C AC C As shown in Table 3, in the adhesive compositions which used an isocyanate compound as a matrix component (optionally with epoxy resin for improvement of adhesive performance) the peeling strength was improved by inclusion of HAp. - Example 13 and Comparisons 5 to 7 - Adhesive compositions were prepared by the same procedure as in Example 1 as shown in Table 4. The urethane prepolymer, polyamine and HAp used were the same as those in Example 1. The epoxy resin D was an epoxy resin of naphthalene type (epoxy equivalent 146) produced by Dainippon Ink And Chemicals, Inc. Using the adhesive compositions obtained, the peeling strength and fracture mode were studied as in Example 1; the results are shown in Table 4. Comparison 5 Example 13 Comparison 6 Comparison 7 Formulation (parts) Urethane prepolymer 8.0 8.0 8.0 8.0 Epoxy resin D 2.0 2.0 2.0 2.0 Polyamine 1.0 1.0 1.0 1.0 DICY 0.2 0.2 0.2 0.2 HAp - 0.5 - - Sodium metaphosphate - - 0.5 - Dipotassium hydrogen phosphate - - - 0.5 T-peel strength [kg/25 mm] 28.5 40.4 30.6 23.8 Fracture type AC C AC AC As shown in Table 4, in Example 13 using HAp without phosphate compound, the peeling strength is extremely high as compared with Comparison 5. Also, as compared with Comparisons 6, 7 using other phosphate compounds the peeling strength is very high. Thus, comparing HAp with other phosphates, HAp brings about the best result. A factor in this favorable result is considered to be bonding between hydroxy groups of the HAp and isocyanate groups of the urethane prepolymer. In the phosphates used in Comparisons (such as sodium metaphosphate and dipotassium hydrogen phosphate) the hydroxy group is not present in the composition and chemical interaction does not occur; this is considered to be why the adhesive performance was lower than the embodiments using HAp. Incidentally, in the Japanese Official Patent Gazette Heisei 2-8633, an example of adding an organic phosphate compound possessing a -SH group (thiol group) at one terminal end is disclosed, but the -SH group is poor in reactivity as compared with the OH group. Considering synthesis of the organic phosphate compound or addition conditions, the synthesis is complicated and its cost is high, and such a material is not available commercially. By contrast, in the Examples, using the easily available and inexpensive HAp, superior performance is obtained. - Examples 14, 15 and Comparisons 8, 9 - Adhesive compositions were prepared by the same procedure as in Example 1, as shown in Table 5. The epoxy resins A, B, D and DICY were the same as those used above. The latent hardener A was a product of Ajinomoto Co., 'Inc., being an addition reaction product of an epoxy resin with a compound having a tertiary amino group. using the adhesive compositions obtained, the lap shear strength was investigated according to the following procedure, and the results are shown in Table 5. Aluminum plates of 25 mm by 100 mm by 1.6 mm thickness (standard test pieces of Nippon Test Panel Co., Ltd.) were used without surface treatment. The adhesive compositions were coated on both of two aluminum plates, which were joined in an overlapping area of 12.5 mm x 25.0 mm, clamped under pressure with a clip (pressure, 50 kg/cm 2 ), and separately cured under two curing conditions of 120°C for 30 minutes and 160°C for 30 minutes. For the test pieces obtained, conforming to JIS K 6850, the stationary lap shear strength was measured in an atmosphere of 23°C and 65% RH by means of Instron type Shimadzu autograph S-2000 at a crosshead speed of 50 mm/min. The lap shear strength was expressed by dividing the measured strength by the overlapping area. A substrate break of 150 kg/cm 2 ≦ indicates that an aluminum plate was cut off at 150 kg/cm 2 or more. The fracture mode was classified into C for cohesive failure, AC for adhesive/cohesive failure, and A for adhesive failure, by observing the fracture state of the adhesive layer on the overlapped surface. Example 14 Comparison 8 Example 15 Comparison 9 Formulation (parts) Epoxy resin B 10.0 10.0 - - Epoxy resin D - - 10.0 10.0 Epoxy resin A 2.5 2.5 2.5 2.5 HAp 0.5 - 0.5 - DICY 0.2 0.2 0.2 0.2 Latent hardener A 0.2 0.2 0.2 0.2 Polyamine 2.7 2.7 4.1 4.1 Lap shear strength (kg/cm 2 ) (curing condition; 120°C, 30 min) and fracture type 54.4 AC 31.9 AC 96.6 AC 87.6 AC Lap shear strength (kg/cm 2 ) (curing condition; 160°C; 30 min) and fracture type 150≦ Substrate break 130 C 150≦ Substrate break 130 C As shown in Table 5, the strength was evidently different between the HAp series and HAp-free series. When the curing temperature was changed from 120°C to 160°C, a more obvious difference was observed. This is considered to be because the HAp is effective as adhesion improver for aluminum for the same reason explained above. - Example 16 - Into a separating flask was placed 100 parts of a copolymer diol of polyhexamethylene adipate and polyneopentylene adipate made by Nippon Polyurethane Kogyo Co., Ltd., which was warmed to 100°C at a reduced pressure of 3 mmHg to be dehydrated for 2 hours. Then 25 parts MDI (methylenediphenyldiisocyanate) was charged under a nitrogen stream and reaction was conducted for 4 hours at 95°C, whereby a polyester-based urethane prepolymer was obtained. At this time, the amine equivalent was about 1250. With 70 parts of this urethane prepolymer, 30 parts of saturated polyester resin made by Nippon Gosei Kagaku Co., Ltd. was mingled under a nitrogen stream during 30 minutes at 120°C. To the mixture obtained was added 5 parts of hydroxyapatite BC (made by Nitta Gelatin Inc., mean particle size 4 - 5 µm, particle size distribution 4 - 12 µm, powder), whereby a reactive hot melt adhesive was obtained. - Example 17 and Comparisons 10, 11 - Reactive hot melt adhesives (adhesive compositions) were obtained by the same procedure as in Example 16 as shown in Table 6. The polyester-based urethane prepolymer was the same as used in Example 16. For the reactive hot melt adhesive of Examples 16,17 and Comparisons 10, 11 the melt viscosity, complete cured adhesion, and fracture type (evaluation as mentioned above) were investigated, and the results are shown in Table 6. The complete cured adhesion was measured by coating the adhesive compositions in a molten state and applying the adherends (the forementioned two aluminum plates) and, after letting stand for 1 week at 23°C and 65% RH, by measuring the stationary peeling strength by the same procedure. Example 16 Example 17 Comparison 10 Comparison 11 Formulation (parts) Urethane prepolymer 70 50 70 50 Saturated polyester resin 30 50 30 50 HAp 5 5 - - Melt viscosity [cP] (120°C) 35,000 45,000 27,000 32,000 Complete cured adhesion (T-peel strength) [kg/25 mm] 25.0 20.0 14.5 12.0 Fracture type AC AC A A As shown in Table 6, in reactive hot melt adhesives, the peeling strength is much increased by adding HAp. - Example 18 and Comparisons 12 to 14 Adhesive compositions were obtained by the same procedure as in Example 1, as shown in Table The components were the same as above. 7. For the obtained adhesive compositions, peeling strength adhesion tests were conducted and the results obtained were as shown in Table 7. For the peeling strength adhesion tests aluminum plates of 150 mm by 150 mm by 0.3 mm thickness (A-1050P specified by JIS H 4000) were used without surface treatment. On the aluminum plates, the adhesive compositions were coated at a coating thickness of 0.3 - 0.4 mm using a doctor blade; the aluminum plates were applied together by inserting a 0.4 mm spacer, and were cured in a heat press under the conditions of 120°C, 15 minutes, and 50 kg/cm 2 . The stationary peeling strength was measured in the same manner as in Examples 1 to 4. - Example 19 and Comparisons 15 to 17 Adhesive compositions were obtained by the same procedure as in Example 1, as shown in Table 8. The components were the same as above. For the obtained adhesive compositions, lap shear strength tests were conducted firstly using A-1050P aluminium plates and then using A-2024P aluminium plates of JIS H 4000, and the results are shown in Table 8. For the lap shear strength tests, the indicated aluminum plates of 25 mm by 100 mm by 1.6 mm thickness were used without surface treatment. The adhesive compositions were coated onto both of two aluminum plates, which were joined in an overlapping area of 12.5 mm x 25.0 mm, clamped under pressure with a clip (pressure 50 kg/cm 2 ), and cured under the conditions of 160°C and 30 minutes. Then, by the same procedure as in Examples 14, 15, the stationary lap shear strength was measured. - Examples 20 to 22 and Comparison 18 - Adhesive compositions were obtained by the same procedure as in Example 1, as shown in Table 9. The components were the same as above. For the obtained adhesive compositions, peeling strength adhesion tests were conducted as in Example 18, and the results as shown in Table 9, were obtained. As shown in Tables 7 to 9, when using HAp, an improvement of the adhesive power was clear in comparison with use of synthetic calcium compounds or powder other than the calcium compounds. As shown in Table 8, by using a matrix composition of epoxy type, the Lap shear strength was much improved.

Claims: An adhesive composition containing hydroxyapatite as an adhesion improver in a matrix comprising at least one component selected from (a) isocyanate compounds possessing two or more isocyanate groups; and (b) epoxy resins possessing two or more epoxy groups. A composition according to claim 1 wherein said hydroxyapatite has a mean particle size of 10µm or less. A composition according to claim 1 or 2 wherein said isocyanate compounds (a) comprise urethane prepolymers. A composition according to claim 1 or 2 wherein said epoxy resins (b) comprise reactive elastomer-modified epoxy resins. An adhesion composition according to claim 3 wherein said isocyanate compounds (a) comprise at least one urethane prepolymer selected from tolylenediisocyanate-based urethane prepolymer and methylenediphenyldiisocyanate-based urethane prepolymer. A composition according to claim 4 wherein said epoxy resins (b) comprise reactive elastomer-modified epoxy resins possessing two or more epoxy groups and an epoxy equivalent of 180 to 700. An adhesive composition according to any preceding claim wherein said matrix includes thermoplastic elastic polymer. Metal surfaces adhered by a cured composition according to any preceding claims. Aluminum metal surfaces adhered by a cured composition according to any of claims 1 to 7. A method of adhering a metal surface to an adherend which comprises sandwiching between them a composition according to any of claims 1 to 7 and curing the composition. A method according to claim 10 wherein said metal surface and said adherend are aluminum metal surfaces. A method according to claim 10 or 11 wherein a metal surface to be adhered is untreated. The use of a composition according to any of claims 1 to 7 in adhesion between an adherend and an optionally untreated aluminum metal surface.

Inventors: NAKAMURA MASAAKI, UENO SEIKI, NAKAMURA, MASAAKI, UENO, SEIKI
Applicants: NITTA GELATIN KK, NITTA GELATIN INC.
Application year: 1991
Main classification: C09J11
IPC codes: C09J11, C08K3, C09J163, C09J201, C09J133, C09J175