Method and apparatus for measuring three-dimensional configuration of wire-shaped object in a short time

Abstract: A method of measuring a wire-shaped object (1, 11) comprises a scanning step of scanning a light beam (LB) on the surface of the wire-shaped object (1, 11), a detection step of detecting a reflected light (RL) reflected from the surface of the wire-shaped object (1, 11) by a plurality of optical sensor cells (21), the optical sensor cells (21) being mounted on an inner wall (2a) of a reflected light detection unit (2, 20) located over the wire-shaped object (1, 11); and a measurement step of measuring a three-dimensional configuration of the wire-shaped object (1, 11) in accordance with output signals from the plurality of optical sensor cells (21), whereby, the three-dimensional configuration of the wire-shaped object (1, 11) is automatically measured in a short time.

Description: BACKGROUND Of THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for measuring a wire-shaped object, more particularly, to a method and an apparatus for measuring a three-dimensional configuration of a bonding wire for a semiconductor device in a short time, by using a light beam projection method. Note, this bonding wire is, for example, for an electrical connection between a semiconductor chip and a lead frame, or an IC chip and a package, and the present invention is applied to detect an abnormal approach portion and an abnormal connection portion between two adjacent bonding wires or a bonding wire and a semiconductor chip (substrate), by measuring a three-dimensional configuration thereof. 2. Description of the Related Art Recently, the number of bonding wires connected between a semiconductor chip (IC chip) and a lead frame (package) has multiplied, in accordance with a high densification and miniaturization of the semiconductor chip; for example, is not unusual for one semiconductor chip to include more than one hundred bonding wires. In such a semiconductor chip including over one hundred bonding wires, a wire pitch (space between adjacent bonding wires) is very narrow, e.g., about 0.2 mm, and thus production errors may frequently occur due to a short-circuiting between adjacent bonding wires or a bonding wire and a semiconductor chip, during a wire-bonding process and the like In the prior art, the test for detecting the production errors is carried out by a manual visual observation using a microscope, and thus the accuracy and speed of the test are limited. Further, in the prior art, the shape of the bonding wire is only measured two-dimensionally, in a horizontal plane, and thus a defective portion of an extreme approach, or a short-circuiting between the wire and a semiconductor chip located under the wire, cannot be detected in a vertical plane. In consideration of the above, many methods and apparatuses for measuring a three-dimensional configuration of a wire-shaped object (bonding wire) have been disclosed. In the prior art, three methods are used to measure a three-dimensional configuration of a bonding wire, i.e., a floodlight method, a stereoscopic vision method, and a variable focus method. Concretely, in the prior art, apparatuses for measuring a three-dimensional configuration of a wire-shaped object (for example, a bonding wire) are disclosed in Unexamined Japanese Patent Publication (Kokai) Nos. 63-6679, 1-116405, and 1-246841, but, these apparatuses require a long time for measuring the three-dimensional configuration of the bonding wire, and further, some of these apparatuses cannot correctly measure the three-dimensional configuration of the bonding wire. Another inspection system for detecting the shape of a three-dimensional object is disclosed in EP-A-0 346 015. The system uses an optical system to create a beam scanning the object in a lateral direction, and an inclined mirror to re-direct the light reflected from the object back through the scanning system so as to be collimated onto a fixed optical detector. The position of the collimated spot along the detector is used to derive a height information of the object. Finally, a camera-based system for circuit board inspection is disclosed in EP-A-0 341 806. The viewing field and lighting conditions are automatically changed depending on the specific tasks being undertaken, e.g. checking for absent components, checking soldered joints and detecting unwanted solder bridges. SUMMARY OF THE INVENTION An object of the present invention is to provide a method and apparatus for measuring a wire-shaped object, by which an automatic measurement of a bonding wire can be made in a short time. The method according to the present invention involves the steps of scanning a light beam focused onto the surface of said wires using a light beam scanning means; detecting light reflected from said wires using reflected light detection means; calculating positional information of said wires on the basis of output signals received from said reflected light detection means using calculation means, and reconstructing a three-dimensional configuration of said wires using the results obtained from said calculation means, characterized in that said reflected light detection means comprises an array of optical sensor cells distributed over a three-dimensional surface around and facing the bonding wires of said semiconductor chip, said surface coinciding with an inner wall of the reflected light detection means, said light beam being made to pass through an opening at a top portion of said inner wall; said scanning by said scanning means is performed by relative scanning movement of the light beam along edges of the chip, and in that said calculating step involves calculating the direction of the bright lines drawn by the light reflected by the surface of the wires in accordance with the output signals from said array of optical sensor cells and with an address of an optical sensor cell receiving said reflected light. The apparatus according to the present invention comprises : a light beam scanning means for scanning a light beam focused onto the surface of said wire-shaped object; a reflected light detection means responsive to light reflected from said wires; calculation means, receiving output signals from said light detection means for calculating positional information of said wires, reconstruction means, receiving an output of said calculation means, for reconstructing a three-dimensional configuration of said wire shaped body by the results obtained from said calculation means, characterized in that said light detection means comprises an array of optical cells distributed over a three-dimensional surface around and facing the bonding wires of said semiconductor chip, said surface coinciding with an inner wall of the reflected light detection means, said light beam passing through an opening at a top portion of said inner wall; said light beam scanning means performs said scanning by relative movement of the light beam along edges of the chip, and in that said calculation means comprises means for calculating the direction of the bright lines drawn by the light reflected by the surface of the wires in accordance with the output signals from said plurality of optical sensor cells and with an address of an optical sensor cell receiving said reflected light. The reflected light detection unit may be formed as a hemisphere-shaped dome or a half polyhedron shape. The light beam scanning unit may comprise: a beam source for generating a light beam; a group of lenses for enlarging a diameter of the light beam output from the beam source; a vibrating mirror for a linear scanning of the light beam; and a focusing lens for focusing the light beam onto the surface of the wire-shaped object. The top portion of the reflected light detection unit may have an opening in the form of a slit, and the light beam scanned by the light beam scanning unit may impinge on the wire-shaped object through the slit of the reflected light detection unit. The bonding wire may connect the semiconductor chip to a lead frame. The semiconductor chip and the lead frame may be placed on a detection table. The detection table may be movable in an X-Y plane and rotatable around a Z-axis. The apparatus may further comprise: a defect discrimination unit for discriminating the quality of the reconstructed data output from the reconstruction unit by comparing the reconstructed data with a reference three-dimensional data; a control unit for controlling the movement of the detection table and for controlling the operations of the direction discrimination unit, the reconstruction unit, and the defect discrimination unit; and an output unit for receiving and outputting the results obtained from the defect discrimination unit. The light beam scanning unit may comprise: a beam source for generating a light beam; a group of lenses for enlarging a diameter of the light beam output from the beam source; a first vibrating mirror for scanning the light beam in an X-direction; a second vibrating mirror for scanning the light beam in a Y-direction; and a focusing lens for focusing the light beam onto the surface of the bonding wire. The top portion of the reflected light detection unit may have a circular opening allowing a passage therethrough of the light beam scanned in both an X-direction and a Y-direction by the light beam scanning unit. The light beam may be scanned in a square-shape along the circumference of the semiconductor chip. Further, the light beam may be scanned as going and returning along each side of the semiconductor chip. The calculation unit may be constituted by a neural network, and the reconstruction unit may be constituted by an angle calculation unit. The apparatus may further comprise: a control unit; a scanning position control unit for controlling the light beam scanning unit in accordance with control signals output from the control unit; a dictionary unit for prestoring reference position and direction data; a comparison unit for comparing the results of the angle calculation unit with the reference position and direction data output from the dictionary unit; and a defect output unit for receiving and outputting the compared results from the comparison unit. BRIEF DESCRIPTION Of THE DRAWINGS The present invention will be more clearly understood from the description of the preferred embodiments as set forth below with reference to the accompanying drawings, wherein: Figures 1A to 1D are diagrams indicating various bonding wire connections between a semiconductor chip and a lead frame; Figure 2 is a diagram indicating a problem with a bonding wire connected between the semiconductor chip and the lead frame; Figures 3A to 3C are diagrams for explaining examples of methods of measuring a three-dimensional configuration of a bonding wire according to the prior art; Figure 4 is a diagram indicating an embodiment of an apparatus for measuring a three-dimensional configuration of a wire-shaped object according to the present invention; Figures 5A and 5B are diagrams for explaining light reflected from a surface of the wire-shaped object; Figure 6 is a diagram for explaining a bright line detected by an inner wall of a dome shown in Fig. 4; Figure 7 is a conceptual diagram for reconstructing a three-dimensional configuration of the wire-shaped object by discriminating each direction of the reflected light; Figure 8A is a diagram indicating a modification of the embodiment apparatus shown in Fig. 4; Figure 8B is a diagram indicating a part of the modification shown in Fig. 8A; Figure 9 is a diagram indicating reflected light when an axis of the wire-shaped object is located orthogonally to the light beam; Figure 10 is a diagram indicating reflected light when the axis of the wire-shaped object is located obliquely to the light beam; Figure 11 is a diagram indicating a bright line drawn on the inner wall of the dome; Figure 12 is a diagram indicating another embodiment of an apparatus for measuring a three-dimensional configuration of a wire-shaped object according to the present invention; Figure 13A is a diagram indicating a configuration of a neural network shown in Fig. 12; Figure 13B is a diagram indicating angles obtained by the neural network shown in Fig. 13A; Figure 13C is a diagram indicating a conceptual configuration of the memory unit shown in Fig. 13A; and Figures 14A to 14C are diagrams for explaining scan operations in the embodiment of the apparatus shown in Fig. 12. DESCRIPTION OF THE PREFERRED EMBODIMENTS First, various bonding wire connections between a semiconductor chip and a lead frame, and examples of a method of measuring a three-dimensional configuration of a bonding wire according to the prior art will be explained. Figures 1A to 1D are diagrams indicating various bonding wire connections between a semiconductor chip and a lead frame, wherein, Fig. 1A indicates a normal, or preferable condition of the connected bonding wire, and Figs. 1B to 1D indicate abnormal, or defective conditions of the connected bonding wires, respectively. In Figs. 1A to 1D, reference numerals 401a to 401d denote bonding wires, 402 and 403 denote parts of a lead frame, and 404 denotes a semiconductor chip (IC chip). Note, as shown in Figs. 1A to 1D, the bonding wire (401a to 401d) is used to electrically connect the semiconductor chip 404 and the lead frame 403, or an IC chip and a package. As shown in Fig. 1A, a normal bonding wire 401a is connected between the semiconductor chip 404 and the lead frame 403 by a preferable length of the bonding wire 401a, or a preferable three-dimensional configuration thereof. Conversely, as shown in Figs. 1B to 1D, abnormal bonding wires 401b to 401d are connected between the semiconductor chip 404 and the lead frame 403 due to a defective three-dimensional configuration of the bonding wires 401b to 401d. Namely, Fig. 1B indicates a state when the bonding wire 401b is slack, Fig. 1C indicates a state when the bonding wire 401c is under an excessive strain, and Fig. 1D indicates a state when the bonding wire 401d sags. These state of the bonding wires 401b to 401d shown in Figs. 1A to 1D may cause production errors due to a short-circuiting between adjacent bonding wires or a bonding wire and a semiconductor chip, and consequently, the above defective states of the bonding wires 401b to 401d shown in Figs. 1A to 1D must be avoided by measuring the three-dimensional configurations thereof. In the prior art, when testing or detecting such production errors, the defective portions (defective bonding wires) are generally detected manually by an observation of the connection portions of the bonding wires, using a microscope. In the method and the apparatus for the measuring wire-shaped object according to the prior art, however, the test for detecting the production errors is carried out by a manual visual observation, and thus the accuracy and speed of the test are limited. Further, in the prior art, the shape of the bonding wire is measured only two-dimensionally, or on a horizontal plane, and thus a defective portion of an extreme approach between the wires (extremely small space between adjacent wires) in the horizontal plane can be detected, but a defective portion of an extreme approach between the wire and a substrate (or a semiconductor chip) located under the wire cannot be detected in a vertical plane. Figure 2 indicates a problem with a bonding wire connected between the semiconductor chip and the lead frame. In Fig. 2, reference numerals 411 and 412 denote bonding wires, 402 and 403 denote parts of a lead frame, and 404 denotes a semiconductor chip. Note, the bonding wire 411 is connected between the semiconductor chip 404 and the lead frame 403 in a preferable state, and the bonding wire 412 is connected between the semiconductor chip 404 and the lead frame 403 in a defective state. As shown in Fig. 2, the two wires 411 and 412 are observed as two adjacent lines by a microscope (observation direction). Namely, data for a Z-axis direction (or height direction) cannot be detected by the microscope, and only two-dimensional data for an X-axis and a Y-axis in a horizontal plane are observed. For example, when the wire 412 is given an extreme approach to a corner of the semiconductor chip 404 in the Z-direction, as shown by a reference dd in Fig. 2, this defective state cannot be observed by a microscope as in the prior art. In consideration of the above, a plurality of methods and apparatuses for measuring a three-dimensional configuration of a wire-shaped object (bonding wire) have been studied and provided. Figures 3A to 3C are diagrams for explaining examples of methods of measuring a three-dimensional configuration of a bonding wire according to the prior art. Note, Fig. 3A indicates an example of a floodlight method, Fig. 3B indicates an example of a stereoscopic vision method, and Fig. 3C indicates an example of a variable focus method of measuring a three-dimensional configuration of a bonding wire (wire-shaped object), respectively. In Fig. 3A, reference numeral 301 denotes a bonding wire, 302 denotes a lens, 303 denotes a telecamera, and 304a to 304e denote light sources. In this device using the floodlight method, each of the light sources 304a to 304e successively impinges a light beam onto a surface of the bonding wire 301, and light reflected from the surface of the bonding wire 301 is detected by the telecamera 303 through the lens 302. Consequently, the three-dimensional configuration of the bonding wire is determined (measured) by combining the reflected lights corresponding to the light sources 304a to 304e detected by the telecamera 302. Note, in this prior art example, a plurality of light sources 304a to 304e are used such that each of the light sources 304a to 304e successively impinges a light beam onto the surface of the bonding wire 301, and thus it takes a long time to determine the three-dimensional configuration of the bonding wire. In Fig. 3B, reference numerals 351 to 352 denote telecameras. In this device using the stereoscopic vision method, the bonding wire 301 is lit from various directions, and the reflected lights are detected by two telecameras 351, 352, so that a stereoscopic image of the bonding wire 301 can be obtained by the two telecameras 351, 352. In this prior art example, however, two telecameras 351, 352 and an image processing unit for constructing a three-dimensional configuration of the bonding wire are required, and thus the cost of the apparatus is high. In Fig. 3C, reference numeral 306 denotes a lens(group of lenses) by which a focal point thereof can be moved. In this device using the variable focus method, the focal point of the lens 306 is varied from a front focus to a rear focus, or an in-and-out of focus state, at each measuring point of the bonding wire 301, and all of the in-focus points are combined to determine the three-dimensional configuration of the bonding wire 301. In this prior art, however, the in-focus point for each of the measuring point is obtained by varying the focal point from the front focus to the rear focus using a mechanical system, and thus it takes a long time to determine the three-dimensional configuration of the bonding wire. Further, currently, the three-dimensional configuration of the bonding wire cannot be correctly determined by using the variable focus method of mechanical system. Note, a method and an apparatus of a wire-shaped object according to the present invention uses the floodlight method (which including a light beam projection method), whereby an abnormal approached portion and an abnormal connection portion between two adjacent bonding wires or a bonding wire and a semiconductor chip (substrate) can be correctly measured in a short time. Next, preferred embodiments of an apparatus for measuring a three-dimensional configuration of a wire-shaped object according to the present invention will be explained below. Figure 4 is a diagram indicating an embodiment of an apparatus for measuring a three-dimensional configuration of a wire-shaped object according to the present invention. In Fig. 4, reference numeral 1 denotes a bonding wire (wire-shaped object), 2 denotes a dome for detecting reflected light (or a bright line), 3 denotes a light beam scanning unit, 4 denotes a plurality of amplifiers, 5 denotes a calculation unit, and 6 denotes a reconstruction unit. Note, the bonding wire 1 includes a surface having a regular reflection and a circular section. The light beam scanning unit 3, which is used to scan a light beam onto a surface of the bonding wire 1, comprises a beam source 31 for generating a light beam (or a laser beam), a group of lenses 32 for enlarging the diameter of the light beam output from the beam source 31, a vibrating mirror 33 for a linear scanning of the light beam, and a focusing lens 34 for focusing the light beam LB onto the surface of the bonding wire 1. Namely, a scanning line SL, which is a locus of a focal point of the light beam LB, is formed on the bonding wire 1 (or a plane at the position of the bonding wire) by the light beam scanning unit 3. The dome 2, which has a hemispherical shape and is located over the bonding wire 1, includes a plurality of optical sensor cells 21 mounted on an inner wall 2a (as indicated in Fig. 6) of the dome 2. Note, a slit 2b is formed on a top of the dome 2 to allow the light beam LB to pass therethrough. Further, a detection surface of each of the sensor cells 21 faces the bonding wire 1, and an address indicating a position in the dome 2 is provided for each of the sensor cells 21. Furthermore, output signals of the sensor cells 21 are applied to corresponding amplifiers 4, and output signals of the amplifiers 4 are applied to the calculation unit 5. The calculation unit 5 is used to calculate a projected direction of reflected light (RL) on the inner wall of the dome 2. Note, the reflected light, which will be explained later in detail, is a light reflected by the surface of the bonding wire 1 in accordance with the scanning line SL. The reconstruction unit 6 is used to reconstruct a three-dimensional configuration of the bonding wire 1 by receiving the results of the calculation unit 5. Note, as shown in Fig. 4, the dome 2 preferably has a hemispherical shape, but the shape of the dome (reflected light detection unit) 2 is not limited thereto. Namely, the shape of the reflected right detection unit 2 can be a polygon. When forming the reflected right detection unit 2 as a polyhedron, preferably a plurality of planes forming the polyhedron are defined. Further, the reflected right detection unit 2 need not have a closed plane, but a plurality of optical sensor cells 21 should be mounted on the inner wall 2a, and thus the reflected right detection unit 2 can be constituted by a net. When the reflected right detection unit 2 is formed as a net, a semiconductor chip position in the reflected right detection unit 2 can be observed from the outer position of the reflected right detection unit 2. Figures 5A and 5B are diagrams for explaining light reflected from a surface of the wire-shaped object, and Figure 6 is a diagram for explaining a bright line detected by an inner wall of a dome shown in Fig. 4. As shown in Fig. 5A, for example, when scanning a light beam LB at right angles to an axis 10 of the wire-shaped object 11 (bonding wire 1), all reflected light RL passes through the same plane 12 at right angles to the axis 10 of the wire-shaped object 11. On the other hand, as shown in Fig. 5B, when scanning a light beam at specific angle ϑ to the axis 10 of the wire-shaped object 11, the reflected light passes through a specific curvature plane 13 without passing through the above plane 12. As shown in Fig. 6, a bright line BL, which is curved in accordance with the angle ϑ between the light beam and the axis 10 of the wire-shaped object 11, is drawn on the inner wall 2a of the dome 2 by the plane (13). Note, the angle ϑ between the direction of the light beam LB and the axis 10 of the wire-shaped object 11 is required to determine over 45 degrees. Namely, when the angle ϑ is specified below 45 degrees, the light reflected from the surface of the wire-shaped object 11 cannot be reached to the inner wall 2a of the dome 2 . In the above, positions of the bright line BL are determined by positions of the optical sensors 21 detecting the bright line BL. Further, the slant (or a curve) of the bright line BL is determined by an arrangement of the optical sensors 21 detecting the bright line BL. Furthermore, when a diameter of the wire-shaped object 11 (bonding wire 1) is previously known, the slope of the bright line BL can be obtained in the directions of a plurality of positions of the bright line BL. As described above, in the embodiment of the apparatus for measuring the three-dimensional configuration of the wire-shaped object according to the present invention, when a light beam LB is linearly scanned on a surface of the wire-shaped object including a surface having a regular reflection and a circular section, a bright line BL formed on an inner wall 2a of a dome 2 by reflected light BL is detected by a plurality of optical sensors 21 mounted on the inner wall 2a of the dome 2. Further, the positions and the curvature of the bright line BL are calculated by the results detected by the optical sensors 21, and a three-dimensional configuration of the wire shaped body is reconstructed thereby. Note, a position or a curvature of the bright line is changed in accordance with a height or angle of the wire. Figure 7 is a conceptual diagram for a reconstruction of a three-dimensional configuration of the wire-shaped object formed by discriminating each direction of the reflected light (bright line). As shown in Fig. 7, the entire three-dimensional configuration of the wire-shaped object 11 is reconstructed by combining the calculated results of the small areas of the wire-shaped object 11. Figure 8A is a diagram indicating a modification of the embodiment apparatus shown in Fig. 4, and Figure 8B is a diagram indicating a part of the modification shown in Fig. 8A. In Fig. 8A, reference numeral 1 denotes a bonding wire, 3 denotes a light beam scanning unit, 41 to 4n denote amplifiers, 5 denotes a direction discrimination unit (calculation unit), 6 denotes a reconstruction unit, 7 denotes a defect discrimination unit, 8 denotes a control unit, 9 denotes an output unit, 10 denotes a semiconductor chip, 22 denotes a detection table (X-Y stage), and 40 denotes a lead frame. The light beam scanning unit 3 comprises a beam source 31 for generating a light beam (or a laser beam), a group of lenses 32 for enlarging a diameter of the light beam output from the beam source 31, a vibrating mirror 33 for a linear scanning of the light beam, and a focusing lens 34 for focusing the light beam LB onto the surface of the bonding wire 1. Namely, a scanning line SL, which is a locus of a focal point of the light beam LB, is formed on the bonding wire by the light beam scanning unit 3. As shown in Fig. 8A, the detection table 22 can be moved in an X-Y plane and can be rotated around a Z-axis (at the center of the detection table 22) to scan a light beam LB on all of the bonding wires 1 through a slit 2b of the dome 2 in accordance with output signals of the control unit 8. Further, as shown in Figs. 8A and 8B, a plurality of semiconductor chips 10, which are connected to the lead frame 22 by a plurality of bonding wires 1, are placed on the detection table 22, and the light beam LB is scanned at the required positions (test portions) of the bonding wires 1, or the scanning line SL is placed at the required positions of the bonding wires 1 by a parallel and rotational displacement of the detection table 22. The dome 2, which is formed as a hemisphere, is provided over the detection table 22. Note, a slit 2a is formed on a top of the dome 2 to allow the passage of the light beam LB through the dome 2, and the light beam LB impinges on a test portion (required position) of the bonding wire 1. Note, the bonding wire 1 includes a surface of a regular reflection and a circular section. Further, the dome 2 is preferably formed as a hemisphere, but the shape of the dome (reflected right detection unit) 2 is not limited thereto. Namely, the shape of the reflected right detection unit 2 can be a polygon. Further, the reflected right detection unit 2 need not have a closed plane, but a plurality of optical sensor cells 21 should be mounted on the inner wall 2a, and thus the reflected right detection unit 2 can be constituted by a net. When the reflected right detection unit 2 is formed as a net, the semiconductor chip 10 and the lead frame 40 positioned in the dome 2 and placed on the detection table 22 can be observed from the outer position of the dome 2. In the dome 2, a plurality of optical sensor cells 21 are mounted on an inner wall 2a of the dome 2, and a detection surface of each of the sensor cells 21 faces the bonding wire 1. Note, an address indicating a position in the dome 2 is provided for each of the sensor cells 21, output signals of the sensor cells 21 are applied to corresponding amplifiers 41 to 4n, and output signals of the amplifiers 41 to 4n are applied to the direction discrimination unit (calculation unit) 5. Note, if the dome 2 is assumed to be an earth, the above address is given by an intersection coordinate defined by a longitude  (0 to 360 degrees) for an equatorial direction and a latitude λ (0 to 90 degrees) for a polar direction. For example, in a coordinate plane divided by one-degree, the total number of the intersection points are specified to 360 × 90 = 32,400, and thus, when defining a resolution to one-degree, the optical sensor cells 21 are supplied as 32,400 pieces, each including an address from (0, λ0) to (360, λ90), respectively. Furthermore, for example, in a coordinate plane divided by ten-degrees, the total number of the intersection points are specified as 36 × 9 = 324, and thus, when defining a resolution to ten-degrees, the optical sensor cells 21 are supplied as 324 pieces, each including an address from (0, λ0), (10, λ0), (20, λ0), ..., (360, λ0), (360, λ10), ..., (360, λ90), respectively. In the above, each of the optical sensor cells 21 detects reflected light RL reflected from a measuring portion in accordance with the scan operation of the light beam LB, and each of the optical sensor cells 21 outputs an electrical signal by a conversion from the reflected light RL. As described above, an address indicating a position in the dome 2 is provided for each of the sensor cells 21, and output signals of the sensor cells 21 are applied to corresponding amplifiers 41 to 4n provided for each of the addresses. Further, output signals of the amplifiers 41 to 4n are applied to the direction discrimination unit (calculation unit) 5. In the direction discrimination unit 5, a center position of a bright line BL (with reference to Fig. 6) formed (drawn) on the inner wall 2a of the dome 2 by the reflected light RL, and a curved state (curvature) is discriminated therefrom. Note, if it is assumed that a length of the bright line is L, the center position is indicated by an address Ai of the point at L/2. For example, when only  (longitude) of the address is changed, it is determined that the bright line BL is drawn for the direction of a specific latitude line passing through a pole point. Further, when only λ (latitude) of the address is changed, it is determined that the bright line BL is drawn for the direction of a specific longitude line in parallel to the equatorial plane. Furthermore, when both  (longitude) and λ (latitude) of the address are changed, it is discriminated that the bright line BL is drawn for the direction of a curved line not in parallel to the longitude line and the latitude line, and the curvature thereof is obtained by a changing of the addresses. The reconstruction unit 6 reconstructs a three-dimensional configuration of a measurement portion (bonding wire 1) corresponding to the bright line BL, by using the above discriminated results, i.e., the center position, the direction or the curvature of the bright line. The defect discrimination unit 7 discriminates the quality of the reconstructed data by comparing it with a previously stored reference three-dimensional data (reference data of the measurement portion), and outputs the results to an output unit 9, e,g., a display device, a printer, and the like. Note, the control unit 8 is used to control the parallel displacement of the detection table 22 in the X-Y plane or the rotational displacement around the Z-axis of the detection table 22, and is used to output various signals for controlling the operations of the direction discrimination unit 5, the reconstruction unit 6, and the defect discrimination unit 7. Next, examples of the operation of the present invention will be explained with reference to Figs. 9 to 11. Figure 9 is a diagram indicating reflected light when an axis of the wire-shaped object is located orthogonally to the light beam. In Fig. 9, reference numeral 101 denotes a tube body, and 100 denotes a space frame model. Note, in Fig. 9, the space frame model 100 covered by virtual lines indicates a three-dimensional space, and a tube body 101 in contact with two opposite surfaces 100a and 100b indicates, for example, a part of a wire-shaped object 11 (or bonding wire 1). First, when scanning and impinging a light beam (LB) onto a surface of the tube body 101 having a surface with a regular reflection and a circular section (101a), as described above, reflected light RL from the surface of the tube body 101 passes through the same plane at right angles to the tube body 101. Namely, as shown in Fig. 9, when scanning a light beam (LB) along a plane PL1 at right angles to an axis of the tube body 101 from the upper position in the drawing, a scanning line SL1 is formed on the surface of the tube body 101. The reflected light (shown by an arrow in Fig. 9) is reflected from the surface of the tube body 101 to various directions in accordance with a curvature of the surface of the tube body 101. Note, all reflected light passes through the same plane at right angles to the axis of the tube body 101, i.e., the plane PL1. Therefore, a bright line BL1, shown by a broken line in the drawing, is drawn on an inner wall (2a) of the dome (2), along a curved surface of the inner wall. Note, this bright line BL1 coincides with the scanning direction of the light beam (LB), or the plane PL1, and the bright line BL1 passes through a pole point (top position) of the dome. Figure 10 is a diagram indicating a reflected light when the axis of the wire-shaped object is located obliquely to the light beam. In Fig. 10, reference numeral 201 denotes a tube body which indicates a part of a wire-shaped object 11 (or bonding wire 1), and 200 denotes a space frame model. Next, when scanning and impinging a light beam (LB) along a plane PL2 onto a surface of the tilting tube body 201 having a surface with a regular reflection and a circular section, a scanning line SL2 formed on the surface of the tube body 201 is defined as an ellipse, which has the same shape as an end face 201a of the tube body 201, and a reflected light from the scanning line SL2 does not pass through the plane PL2 but passes through a curvature plane having an inclined angle is determined in accordance with a slope of the tilting tube body 201. Therefore, a bright line BL2 drawn on the inner wall (2a) of the dome (2) by reflected light (RL) is shown as a specific curved line, Note, the specific curved line of the reflected light is determined by a curve of the curved surface and a curvature of the inner wall of the dome, and further, the positions of the bright line BL2 are shifted from the pole point of the dome in accordance with an angle between the tube body 201 and the plane PL2. Figure 11 is a diagram indicating a bright line drawn on the inner wall of the dome. Note, in Fig. 11, a hemisphere shaped inner wall (2a) of the dome (2) is shown in a flat plane. In Fig. 11, a circle SS surrounding the circumferences thereof denotes an equator, and a center PP of the circle denotes a pole point. Further, in Fig. 11, a broken line denotes a scanning direction of a light beam (LB), and the light beam is scanned from the top to the bottom along the broken line in the drawing. Note, each of four lines AA to DD indicated by connecting a plurality of arrows denotes a bright line, respectively. Concretely, the bright line AA corresponds to the above case shown in Fig. 9, and the bright lines BB and CC correspond to the above case shown in Fig. 10. In the four lines AA to DD in Fig. 11, for example, one arrow denotes data detected by one optical sensor cell (21). Namely, in Fig. 11, the bright line AA indicates that the tube body 101 is at right angles to the light beam (or the plane PL1), and the bright lines BB and CC indicate that the tube body 201 is inclined to the light beam (or the plane PL2) by a specific value. The inclined value is obtained by the value of the shift of the pole point. Further, the bright line DD indicates that the tube body 101 is rotated relative to a light beam axis by a specific value, as in the case shown in Fig. 9. When a new detection is carried out by another optical cell, in response to the scan operation of the light beam, a direction of the arrow, or a direction of the reflected light, is discriminated by the address change between two of the new and the old optical sensors. Consequently, the curve of the bright line and the positional data of the center of the bright line are obtained by combining the plurality of arrows. As described above, a three-dimensional configuration of a tube body (a wire-shaped object 11, or a bonding wire 1) can be measured by the position and the curvature of the bright line, and thus a quality of the tube body, for example, a pitch of the adjacent bonding wires or an abnormal approach between the wire and the chip can be discriminated. Consequently, an accuracy of the test can be increased, and the test becomes suitable for an automatic measurement. Figure 12 is a diagram indicating another embodiment of an apparatus for measuring a three-dimensional configuration of a wire-shaped object according to the present invention. When comparing the configuration shown in Fig. 12 with that shown in Fig. 8A, a light beam scanning unit 30, a top portion 20b′ of the dome 20, and processing units 51 to 54, and 70 to 90 of this embodiment shown in Fig. 12 are different from that shown in Fig. 8A. First, as shown in Fig. 12, in this embodiment, the light beam scanning unit 30 comprises two vibration mirrors 331 and 332 for scanning the light beam LB in both an X-direction and a Y-direction. Namely, in the embodiment shown in Fig. 8A, the light beam LB can be scanned in only a Y-direction. Note, in Fig. 12, the lenses 32 and 34 shown in Fig. 8A are omitted. Next, as shown in Fig. 12, the top portion 20b′ of the dome 20 has a circular opening for the light beam LB scanned by the light beam scanning unit 30. Namely, the light beam LB is scanned, or moved in both the X-direction and the Y-direction, and thus the shape of the top portion 20b′ is preferably a circle. If the top portion of the dome 20 (2) is a slit along the Y-direction as shown in Fig. 8A, the scanning in the X-direction, or a movement of the light beam along the X-direction, cannot be obtained. Further, as shown in Fig. 12, output signals of the optical sensor cells 21 are applied to the neural network 51 through a plurality of amplifiers 41 to 4n, and output signals of the neural network 51 are applied to the angle calculation unit 52. The scanning position control unit 54 controls the light beam scanning unit 30 in accordance with control signals output from the control unit 80, and output signals of the scanning position control unit 54 are applied to the comparison unit 70. The comparison unit 70 also receives data (position and direction data) stored in the dictionary 53, output signals of the angle calculation unit 52, and control signals of the control unit 80, and compares the measured data of the wire-shaped object with reference data prestored in the dictionary 53. The results compared in the comparison unit 70 are applied to the defect output unit 90, e,g., a display device, a printer, and the like. Figure 13A is a diagram indicating a configuration of a neural network shown in Fig. 12, and figure 13B is a diagram indicating angles obtained by the neural network shown in Fig. 13A. As shown in Fig. 13A, the neural network 51 is, for example, constituted by three stages S1 to S3. Namely, the neural network 51 comprises an input layer S1, a hidden layer S2, and an output layer S3. Each of the layers S1 to S3 is constituted by a plurality of units (not shown in Fig. 13), and each unit of the hidden layer S2 is connected to all units of the input layer S1 and all units of the output layer S3. The output signals of the optical sensor cells 21 are amplified by the amplifiers 41 to 4n and applied to the input layer S1. Note, in the neural network 51, the output signals of the optical sensor cells 21 are learned in the neural network 51 by the connection weight (or connection strength) of each of the stages (or each two units provided in different stages). Note, when using the neural network 51 to calculate (obtain) a three-dimensional configuration of a bonding wire 1 (wire-shaped object 11), noise components (for example, noise light reflected from the semiconductor chip) can be deleted from the reflected light from the surface of the bonding wire 1. Concretely, the manner of learning in the neural network 51 is carried out by changing the values of a rotational angle α and a slope angle β (which are shown in Fig. 13B) and inputting the output signal of each of the optical sensor cells 21 into the neural network 51, and determining the connection weight to output correct angles α and β. Consequently, in the neural network 51, the angles α and β are calculated in a short time by using the learning function thereof. As shown in FIg. 13B, the angle α indicates a rotational angle of the bonding wire 1 (wire-shaped object 11) in a horizontal plane (X-Y plane), and the angle β indicates a slope angle of the bonding wire 1 in a vertical plane (Y-Z plane, or Z-X plane). Note, the angle β (90°- ϑ) is required to determine below 45 degrees. Namely, when the angle β is specified over 45 degrees, the light reflected from the surface of the bonding wire 1 cannot be arrived at the optical sensor cells 21 provided in the inner wall of the dome. Figure 13C is a diagram indicating a conceptual configuration of the memory unit shown in Fig. 13A. The angles α and β output from the neural network 51 are applied to a memory unit MR. Note, for example, the light beam LB is scanned on a specific bonding wire 1 in many times, and angle data at a plurality of portions of the bonding wire 1 are stored in the memory unit MR as a map. Then, combining the angle data stored in the memory unit MR, a profile (three-dimensional configuration) of the specific bonding wire 1 is obtained. Further, as described above, the output signals (for example, position and direction data of the bonding wire 1) of the angle calculation unit 52 are applied to the comparison unit 70 and are compared with reference data output from the dictionary 53. Note, the neural network 51 can be formed in various configurations. Figures 14A to 14C are diagrams for explaining scan operations in the embodiment apparatus shown in Fig. 12. In Figs. 14A to 14C, references 1a to 1d denote bonding wires, and SL (SLa to SLd, and the like) denote a scanning line. Note, as described above, with reference to Fig. 12, the light beam scanning unit 30 comprises two vibration mirrors 331 and 332 for scanning the light beam LB in both an X-direction and a Y-direction. First, an example of the scan operations of the apparatus shown in Fig. 12 is carried out such that a light beam LB is scanned in a square-shape along the circumference of the semiconductor chip 10. Namely, as shown in Fig. 14A, the light beam LB is successively scanned along a scanning line SLa, SLb, SLc, SLd, or the light beam LB is successively scanned on a center position of each of a plurality of bonding wires 1a, 1b, 1c, 1d. Note, a center position of the abnormal (defective) bonding wire (for example, shown in Figs. 1B to 1D) is not the same as that of the normal bonding wire (for example, shown in Fig. 1A), and thus the defective bonding wire can be determined by only impinging the light beam LB on the center position of the bonding wire and detecting the reflected light therefrom. Next, another example of the scan operations of the apparatus shown in Fig. 12 is carried out such that a light beam LB is scanned as describing a square-shape along the circumference of the semiconductor chip 10 in many times. Namely, as shown in Fig. 14B, the light beam LB is successively scanned along a scanning line SLa₁, SLb₁, SLc₁, SLd₁, SLa₂, SLb₂, SLc₂, SLd₂,..., or the light beam LB is successively scanned on a plurality of bonding wires 1a, 1b, 1c, 1d, 1a, 1b, 1c, 1d, ... in many times. Furthermore, still another example of the scan operations of the apparatus shown in Fig. 12 is carried out such that a light beam LB is scanned as going and returning along each side of the semiconductor chip 10. Namely, as shown in Fig. 14C, the light beam LB is successively scanned along a scanning line SLaa, SLab, SLac, or scanned on the bonding wires 1a by going and returning, and then the light beam LB is successively scanned along a scanning line SLba, SLbb, SLbc, or scanned on the bonding wires 1b by going and returning. Similarly, the bonding wires 1c and 1d are scanned by the light beam LB. In accordance with the present invention as described above, a light beam is scanned on a surface of a wire-shaped object, and light reflected from the surface of the wire-shaped object is detected by a plurality of optical sensor cells mounted on an inner wall of a reflected light detection unit. Therefore, a three-dimensional configuration of the wire-shaped object can be automatically measured from a bright line drawn on the inner wall of the reflected light detection unit.

Claims: A method of determining the three-dimensional configuration of bonding wires (1, 11) having a circular cross-section connected to a semiconductor chip (404) comprising the steps of : scanning a light beam (LB) focused onto the surface of said wires (1; 11) using a light beam scanning means (3, 30); detecting light reflected from said wires (1; 11) using reflected light detection means (2); calculating positional information of said wires on the basis of output signals received from said reflected light detection means using calculation means (5, 51), and reconstructing a three-dimensional configuration of said wires (1, 11) using the results obtained from said calculation means (5, 51) characterized in that said reflected light detection means (2) comprises an array of optical sensor cells (21) distributed over a three-dimensional surface around and facing the bonding wires (1; 11) of said semiconductor chip, said surface coinciding with an inner wall (2a) of the reflected light detection means (2), said light beam being made to pass through an opening at a top portion of said inner wall (2a); said scanning by said scanning means is performed by relative scanning movement of the light beam along edges of the chip (404), and in that said calculating step involves calculating the direction of the bright lines (BL) drawn by the light reflected by the surface of the wires in accordance with the output signals from said array of optical sensor cells (21) and with an address of an optical sensor cell receiving said reflected light (RL). An apparatus for determining the three-dimensional configuration of bonding wires (1; 11) having a circular cross-section connected to a semiconductor chip (404), said apparatus comprising : a light beam scanning means (3, 30) for scanning a light beam (LB) focused onto the surface of said wire-shaped object (1, 11); a reflected light detection means (2) responsive to light reflected from said wires (1; 11); calculation means (5, 51), receiving output signals from said light detection means (21) for calculating positional information of said wires, reconstruction means (6, 52), receiving an output of said calculation means (5, 51), for reconstructing a three-dimensional configuration of said wire shaped body (1, 11) by the results obtained from said calculation means (5, 51) characterized in that said light detection means (2) comprises an array of optical cells (21) distributed over a three-dimensional surface around and facing the bonding wires (1; 11) of said semiconductor chip, said surface coinciding with an inner wall (2a) of the reflected light detection means (2), said light beam passing through an opening at a top portion of said inner wall (2a); said light beam scanning means performs said scanning by relative movement of the light beam along edges of the chip (404), and in that said calculation means (5; 51) comprises means for calculating the direction of the bright lines (BL) drawn by the light reflected by the surface of the wires in accordance with the output signals from said plurality of optical sensor cells (21) and with an address of an optical sensor cell receiving said reflected light (RL). An apparatus as claimed in claim 2, wherein said reflected light detection means (2) is formed as a hemispherical dome. An apparatus as claimed in claim 2, wherein said reflected light detection means (2) has a half polyhedron shape. An apparatus as claimed in claim 3, wherein said light beam scanning means (3) comprises : a beam source (31) for generating a light beam; a group of lenses (32) for enlarging the diameter of the light beam output from said beam source (31); a vibrating mirror (33) for a linear scanning of the light beam; and a focusing lens (34) for focusing the light beam (LB) onto the surface of said wire-shaped object (1). An apparatus as claimed in claim 5, wherein said opening in said inner wall is located at a top portion (2b) of said reflected light detection means (2) and is in the form of a slit, whereby the light beam (LB) scanned by said light beam scanning means (3) impinges on said bonding (1, 11) through the slit (2b) of said reflected light detection means (2). An apparatus as claimed in claim 6, wherein said bonding wire (1) connects said semiconductor chip (10) to a lead frame (40). An apparatus as claimed in claim 7, wherein said detection table (22) is movable in an X-Y plane and rotatable around a Z-axis. An apparatus as claimed in anv one of claims 2 to 8 wherein said calculation means (5, 51) include direction discrimination means (5), and further comprising : a defect discrimination means (7) connected to said reconstruction means (6), a control means (8) for controlling the movement of said detection table (22) and for controlling the operations of said direction discrimination means (5), said reconstruction means (6), and said defect discrimination means (7); and an output means (9) for receiving and outputting the results obtained from said defect discrimination means (7). An apparatus as claimed in claim 2, wherein said light beam scanning means (30) comprises : a beam source (31) for generating a light beam; a group of lenses (32) for enlarging the diameter of the light beam output from said beam source (31); a first vibrating mirror (331) for scanning the light beam in an X-direction; a second vibrating mirror (332) for scanning the light beam in a Y-direction; and a focusing lens (34) for focusing the light beam (LB) onto the surface of said wire-shaped object (1). An apparatus as claimed in claim 10, wherein said opening in said inner wall is located at a top portion (20b′) of said reflected light detection means (20) and has a circular shape allowing a passage therethrough of the light beam (LB) scanned in both an X-direction and a Y-direction by said light beam scanning means (30). An apparatus as claimed in claim 10, wherein the light beam (LB) is scanned in a square-shape along the circumference of said semiconductor chip (10). An apparatus as claimed in claim 10, wherein the light beam (LB) is scanned as going and returning along each side of said semiconductor chip (10). An apparatus as claimed in claim 2, wherein said calculation means is constituted by a neural network (51), and said reconstruction means is constituted by an angle calculation means (52).

Inventors: ANDO MORITOSHI, OSHIMA YOSHITAKA, TSUKAHARA HIROYUKI, ANDO, MORITOSHI, OSHIMA, YOSHITAKA, TSUKAHARA, HIROYUKI
Applicants: FUJITSU LTD, FUJITSU LIMITED
Application year: 1991
Main classification: H01L21
IPC codes: H05K13, H01L21