Driving method for thermal printer element

Abstract: In order to carry out heat generating temperature control of high precision, a heat recording device comprises a plurality of blocks having heat generating resistors (1) which have current consumption characteristics for transit from a first current consumption state of at least a second low current consumption state for recording with a more uniform temperature independent from the thermal environment of the heat generating resistors (1). By supplying the voltage pulses in a time sharing mode an overlapping of the current consumption states can be prevented. The heat generating resistors (1) comprise different portions (7,8,10,11) which change the resistivity as soon as the temperature has reached a specific temperature value reducing the consumption current.

Description: The present invention relates to the heat recording method such as the heat sensitive recording, heat transcription recording, conduction heat sensitive recording, conduction transcription recording, thermal ink jet, etc., and the driving method of the heat generating registor in a heat recording device. The present invention relates to a heat recording method in which electric current is passed through a heat generating resistor such as the thermal head and thermal ink jet head (either one is referred to as a thermal head) or a heat generating resistor of the heat generating resistance layer of a conduction recording paper ( in the following, both of the above-described heat generating resistor and the above-described conduction heat generating resistance layer are referred to as a heat generating resistor, in order to avoid complexity) to let the heat generating resistor generate heat, and by the temperature elevation of the heating resistor due to this heat generation, carries out the recording on a recording medium. In the heat recording methods so called as the heat sensitive recording, heat transcription recording, thermal ink jet recording, conduction heat sensitive recording, conduction transcription recording, etc., the above-described heat generating resistor is made be equipped, by making a specified temperature region as a boundary, with characteristics for changing almost in step way-like such as to a lower resistance value in the lower temperature part than this temperature region and to a higher resistance value in the high temperature part, and when the temperature before applying voltage of the above-described part of the heat generating resistor is less than the above-described specified temperature region, by applying one voltage pulse to the above-described heat generatimg resistor to pass electricity, a steep temperature rise of the above-described heat generating resistor is made carried out with larger electric power consumption from the temperature before applying voltage to the above-described heat generating resistor to the above-described specified temperature region, and after the temperature has reached to the above-described specified temperature region in the above-described one voltage pulse, a mild temperature rise of the above-described heat generating resistor is made be effected with smaller electric power consumption until to the completion of the voltage application. Also, in the case when the above-described heat generating resistor is in a higher temperature than the above-described specified temperature region in the time point of the start of the above-described voltage application, by maintaining the above-described mild temperature rise state during the above-described pulse conduction, the speed of the temperature rise of the above-described heat generating resistor is changed in correspondence to the temperature before applying voltage pulses to the heat generating resistor, and together with that a kind of heat generating temperature control function such that the heat generation is effected in such a manner that the temperature rise peak temperature of the above-described heat generating resistor by the constant pulse width approaches to a constant temperature and becomes settled, and by dividing the plural number of the above-described heat generating resistors in the heat recording device and the like equipped with these heat generating resistors are divided into a plural number of blocks, and current passing pulses for heat generation are applied in time sharing per above-described heat generating resistor contained in respective blocks. In relation to at least two states of the first current consumption state for corresponding to the above-described steep temperature rise in which the consumed current values in respective heat generating resistors in the time of applying the above-described current passing pulses in the above-described heat generating resister is larger, and the second current consumption state corresponding to the above-described mild temperature rise state for consuming smaller current value largely different to the first current consumption state, and when the above-described first current consumption state drives the above-described plural number of blocks in time sharing in such a timing that the above-described first current consumption state in the time of applying current passing pulses to the heat generating resistor contained in another arbitrary block does not overlap the above-described first current consumption state in the above-described first current consumption state to the heat generating resistor contained in another arbitrary block, and further, in such a timing that the above-described second current consumption state in the time of applying current passing pulses to the heat generating resistor contained in the above-described arbitrary block and the above-described first current consumption state in the time of applying conduction pulses to the heat generating resistor contained in another block for applying conduction pulse in delay to this block, and by driving the above-described plural number of blocks in time sharing, excellent characteristics such as to reduce the driving peak current or the like in a heat recording device are realized. In the conventional heat recording method, for example, the heat sensitive recording method for recording by transmitting heat by the heat generating resister of a thermal head directly to a heat sensitive paper and the like, and in the thermal ink jet system in which air bubbles are generated with the heat generated by a heat generating resistor of a thermal head, and the liquid ink is made fly off by the pressure of these bubbles, metal compound resistors of ruthenium oxide, tantalum nitride, etc., and thermet resistors dispersed with insulating material such as silicon oxide in a high melting point metal such as tantalum and the like has been used. When suitable voltage is applied to the above-described heat generating resistor of the convetional thermal head, electric current passes through the heat generating resistor to generate Joule heat and by maintaining this state for a predetermined time, the heat energy necessary for recording is given to heat sensitive recording paper and the like. The Joule heat energy generated in the above-described heat generating resistor is determined by the resistance value of the heat generating resistor, the applied voltage, and the time for applying this voltage, and in a general heat recording device, the generated heat energy in the heat generating resister has been made agree to the most suitable value by such a process that by the heat sensitivity characteristics of the heat sensitive paper used, heat transmitting characteristics from the heat generating resistor to the heat sensitive paper, the background temperature in the circumference of the heat generating resistor, the temperature of the recording medium itself, etc., the above-described applied voltage or the voltage application time is regulated to get the most suitable recording quality or the objective recording concentration in the harmonious recording. Also, for example, in the electric conduction transcription recording method using the ink doner sheet and the like having electric conduction heat generating resistance layer and the electric conduction head, a carbon paint and the like are used as the above-described electric conduction heat generating resistance layer, and current is passed to the above described electric conduction heat generating layer by the current passing head to let the ink doner sheet itself generate heat and to melt or sublime the ink, and the ink is transcripted on the recording medium. In the same manner as that in the above-described heat sensitive recording method, it has been carried out that the most suitable recording quality or the objective recording concentration in the harmonious recording can be obtained to make the generated heat energy in the current passing heat generating resistance layer be agreed to the most suitable value by means of such conditions as the sheet resistance of the electric conductive heat generating resistance layer, the temperature of the ink doner sheet itself, electrode temperature of the current passing head, etc. In the conventional heat recording method, the adjustment of the heat energy relating to recording by the adjustment of the applied voltage and the voltage applying pulse width has been extremely troublesome, and has made the recording instrument large and expensive. Although the heat energy generated by the voltage pulse application with the heat generating resistor can be determined by the voltage or the pulse width of the above-described pulse, but the temperature of the heat generating resistor is apt to be changed by the application period of the above-described pulses, the pulse application history such as the number of continuous application, the pulse application history, that is, the heat generation history of the heat generating resistors in the circumference of the noticed heat generating resistor, the temperature of the supporting substrate of the thermal head, the temperature of the ink doner sheet and the liquid ink, the environmental temperature, etc. In the heat recording mechanism, the magnitude of the heat energy generated in the heat generating resistor does not become a problem, but it depends on the temperature of the color generating layer in the heat sensitive paper and the temperature of the ink layer, or in other words, it depends to the temperature of the heat generating resistor. Therefore, when it is desired to make the temperature in the time of heat generation be uniform in order to obtain a uniformly recorded heat recording, the heat generating resistor must be made generate heat after determining the adjustment of the above-described application voltage or the voltage application pulse width in such a manner that the temperature of the heat generating resistor rises up till to the specified temperature, by collecting or presuming the thermal environmental information and thermal history information in which the heat generating resistor is put at the moment of generating heat as described above. The information collecting means, presuming means, and recording condition determining means have extremely large load on hard wares such as various kinds of temperature sensors for detecting the temperature of the thermal head substrate and the environmental temperature, memories for memorising the recorded data of the past for grasping the recorded history, simulators such as the CPU for effecting arithmetic treatment, gate circuit, etc. Also, the software for supporting these hard wares is also extremely complicated. Especially, in a large sized high precision heat recording device having large number of heat generating resistors and the device for effecting harmonious recording, the treated information becomes abundant, and the formation of the device in large size and high price can not be avoided, and there is such a case in which the recording quality is sacrified. Also, the treating time for the information collection, presumption, and the determination of the recording conditions is also subjected to the restrict of the CPU and the like and has become an obstacle to high speed recording. Further, although a glaze layer is provided in a thermal head as a temperature preserving layer for enhancing the heat efficiency in general, but since this glaze layer is made by thick film process, the fluctuation of thickness reaches more than ± 20% of the average value, and the heat preserving effect by this glaze layer in the individual thermal head becomes to fluctuate randomly large. Therefore, how much exactly the information of the thermal environment of the heat generating resistor is caught in such a manner as described above, and is treated, heat generation temperature control of high precision can not be carried out due to the fluctuation of the thermal characteristics of the thermal head. If it is desired to carry out the heat generating temperature control of higher precision, the fluctuation of the thermal characteristics of individual thermal head must be taken into consideration as a control parameter, and large sacrifice should be paid on the mass productivity in such a manner that adjustment is carried out for each one of the recording instrument. Also, when the case of exchanging the thermal head in the recording instrument is considered, it is substantially almost difficult to adjust the setting of the recording instrument to the individual characteristics of the thermal head. The fluctuation of the heat capacity and the heat resistance is also present in the circumferential part of the heat generating resistance layer in the current passing heat recording, and there is the same problem as that in the case of the above-described thermal head. JP-A-2 034 361 describes already measurements to minimize the deterioration of the quality of a thermal print by providing a thermistor material with a positive resistance-temperature characteristics in the heating resistor. The same suggestion is made in JP-A 61 035 265 which teaches the use of a resisting device having a positive resistance characteristics connected to a heat generating element for the purpose of automatically reducing the currence through the resisting device if the temperature exceeds a certain temperature limit, so that even for a long time heat generation the highest temperature can be kept on a constant level. Also JP-A- 62 181 162 teaches measurments to prevent overheating from occuring in continuous printing and contrive a reduction in current consumption by the use of a resisting device the electrical resistance of which is varied by a phase transition at a temperature between 50°C to 100°C, in order to reduce the currence and to stabilize the currence to a predetermined level and further to reduce the current consumption in a continuous printing. The change of the electrical resistance of an electro-thermal conversion element in a liquid injection recording system is disclosed in EP-A-267 567 in order to harmonize recording. It is an object of the invention to provide a temperature control of high precision, in order to compensate the fluctuation of the thermal characteristics of the thermal head of a printing device so that even an exchange of the thermal head with deviating thermal characteristics due to mass production does not deteriorate the high printing quality. This should be particularly true for very sensitive printing paper in which the temperature of the color generating layer is quite critical so that the printing quality depends very closely on the temperature of the heat generating resistor. The solution is provided by the invention as claimed in claim 1. A further embodiment of the invention is subject of a subclaim. The present invention has been carried out in order to solve various kinds of problems for making the temperature of the above-described heat generating resistor uniform, and sweeps off the complication of the temperature control of the heat generating resistor such as that in conventional cases, by letting to have self temperature control function in which the temperature of the heat generating resistor is let not to rise more than the specified temperature, and further, intends to realize the excellent characterics thereof with a lower peak current. The present invention makes the heat generating resister have the characteristics for changing almost stairway-like, by making a specified temperature region as the boundary, to a lower resistance value in the lower temperature part than this temperature region, and to a higher resistance value in the high temperature part, and when the temperature before applying voltage of the above-described part of the heat generating resister is less than the above-described specified temperature region, by applying one voltage pulse to pass the current, from the temperature before applying voltage of the above-described heat generating resistor until to the above-described specified temperature region, the steep temperature rise of the above-described heat generating resistor is carried out in a short time with larger electric power consumption, and after reaching the above-described specified temperature region in the above-described one voltage pulse, until to the completion of the voltage application, a mild temperature rise of the above-described heat generating resistor is carried out with smaller electric power consumption to effect recording, and also, in the case when the above-described heat generating resistor is at a higher temperature than the above-described specified temperature region, during the above-described electrical passing of the pulse, the above-described mild temperature rise state is maintained to carry out recording, and together with that, a plural number of the above-described heat generating resistors in the heat recording device thus improved are divided into a plural number of blocks, and in the timing of drive of the block for applying current passing pulses for heat generation in time sharing per above-described heat generating resistors contained in these respective blocks, and in relation to at least two states of the first current consumption state corresponding to the above-described steep temperature rise in which the consumption current value in respective heat generating resistor in the time of the above-described current passing pulse in the above-described heat generating resistor is larger, and the second current consumption state corresponding to the above-described mild temperature rise state in which the smaller current value largely different from that in the first current consumption state, and the above-described plural number of blocks are driven in time sharing in such a timing that the above-described first current consumption state in the time of applying the current passing pulse to the heat generating resistor contained in the above-described arbitrary block does not overlap the above-described first current consumption state in the time of applying the current passing pulse to the heat generating resistor contained in another arbitrary block, and further, in such a timing that the above-described second current consumption state in the time of applying current passing pulse to the heat generating resistor contained in the above-described arbitrary block and the above-described first electric current consuming state in the time of applying current passing pulse to the heat generating resistor contained in another block which applies current passing pulse in delay to this block. When the heat generating resistor is at a higher temperature than the above-described specified temperature region, the heat generating resistor is assumed to be the first heater, then, when it is at a lower temperature than the above-described specified temperature region, it becomes in such a manner that the other second heater becomes to have been parallely combined to the above-described first heater in the circuit of the above-described heat generating resistor. Therefore, in the case when a constant voltage is applied, when the temperature of the heat generating resistor is lower than the above-described specified temperature region, the electric conduction to the above-described first heater and the electric conduction to the above-described second heater are carried out at the same time, and the consumption ccurrent in the heat generating resistor rises up steeply. When the temperature reaches the above-described specified temperature region, or is in a higher temperature, the above-described second heator stops electric conduction due to the rise of the resistance value, or becomes in the electric conduction state of minute current, and there is almost only the conduction current to the first heater. That is, the above-described second heater plays the role of an auxiliary heater until the temperature of the heat generating resister rises up to the above-described specified temperature region. Also, the consumption current in the heat generating resistor transits from the state of a larger current to the state of a lower current by making the above-described specified temperature region as a boundary. Therefore, the above-described heat generating resistor itself becomes to have the action of controlling the heat generating amount by changing the heat generating time of the above-described auxiliary heater in correspondence to the temperature of the above-described heat generating resister directly before applying voltage pulses. As a result, recording with more uniform temperature can be realized under every thermal environment of the heat generating resistor. Also, in the case when electric conduction is started to respective heat generating resistors in the same timing, when a plural number of heat generating resistors are desired to be driven, the total current in the time until the temperature of the heat generating resistor reaches the above-described specified temperature region becomes an extremely large value, but when the above-described plural number of heat generating resistors are divided into a plural number of blocks, the peak current decreases in correspondence to the number of this division. Further, when the above-described first current consumption state only is made be in a state of not being overlapped by the electric conduction drive to the above-described respective blocks, and the above-described second electric current consumption state is passed with current in a timing in which it does not matter that it overlaps to the first and second current consumption states of another blocks, although the total effective current increases, the above-described second heator of any one of the block is passed with current in ordinary times, and the state in which at least any of one of the above-described first heater is passed with current can be formed, and as a result, the total current value at an arbitrary time becomes not to make stairway-like large variation, and the fluctuation of the output of electric source current becomes absent. Also, since the electric conduction time of the above-described respective blocks are partially overlapped, the time for finishing the electric conduction to all of the every blocks may be a slight one. Explanation will be given on the detail of the present invention by means of embodiments. Fig.1 is a plan diagram of the thermal head in the first embodiment of the present invention; Fig.2 is a sectional diagram of the heat generating resistor of the thermal head of Fig.1; Fig.3 is a plan diagram of the heat generating resistor in the second embodiment of the present invention; Figs.4 and 5 are sectional diagrams of respective heat generating resistors in Fig.3; Fig.6 is a plan diagram of A-A' and B-B' of heat generating resistors in an embodiment of the present invention: Fig.7 is the C-C' sectional diagram of the heat generating resistor of Fig.6; Fig.8 is a plan diagram of the heat generating resistor in the 5th embodiment of the present invention; Fig.9 is the D-D' sectional diagram of the heat generating resistor of Fig.8; Figs.10, 11, and 12 are diagrams for representing the surface temperature change of the heat generating resistors in the embodiment of the present invention; Figs.13 and 14 are diagrams for representing the change in the continuous heat generation of the surface temperature of the heat generating resistor in the embodiment of the present invention; Figs.15 and 16 are diagrams for representing the temperature change in the harmonious control of the surface temperature of the heat generating resistor in the embodiment of the present invention; Figs.17 and 18 are diagrams for representing the distribution of surface temperature of the heat generating resistor in the embodiment of the present invention; Fig.19 is an essential part sectional diagram of the current passing heat sensitive recording device in the 7th embodiment of the present invention; Fig.20 is a sectional diagram of the current passing transcription use ink donor sheet in the 8th embodiment of the present invention; Fig.21 is an essential part sectional diagram in the 8th embodiment of the present invention; Figs.22 and 24 are the timing charts for representing the drive timing and the current waveform of the heat generating resistor in the embodiment of the present invention; Fig.23 is a diagram for represennting the drive current waveform of the heat generating resistor in the embodiment of the present invention; and Fig.25 is a diagram for representing the resistance value characteristics of the resistor constituting the heat generating resistor in the embodiment of the present invention. The First Embodiment Fig.1 is a plan diagram of the thermal head used in the heat sensitive recording and the like relating to the driving method of the present invention, and Fig.2 is a sectional diagram or the heat generating resistor part of this thermal head. On a substrate (6) of a glazing treated alumina ceramic and the like is provided the heat generating resistor (1) of a thin film consisting of a material having characteristics of metallic electric conductivity in the low temperature side with the boundary at about 150°C, and of semiconductor-like electric conductivity in the high temperature side. One terminal of this heat generating resister is connected to an individual electrode (2) and another terminal is connected to the first common electrode (3). The above-described individual electrode is connected to the switching element (4) of the current of a transistor and the like. Numeral (5) denotes the second common electrode connected to the above-described switching element (4). As a thermal head, it does not matter that the above-described switching element (4) and the second common electrode (5) are not provided, and are provided separately as a recording device. By opening and closing the above-described switching element (4), while giving positive potential to the above-described first common electrode and negative potential to the above-described second common electrode, voltage pulses are applied to the above-described heat generating resistor (1). When voltage pulses are applied to the heat generating resistor (1), suitable electric power consumption is brought about to generate the Joule heat by the applied voltage and the resistance value of the heat generating resistor (1), and the temperature rise of the heat generating resistor(1) is started. In the case at present, when it is assumed that the above-described heat generating resistor is in the low temperature phase of the above-described metal semiconductor phase transition, that is, in the metal phase, then, the resistance value becomes to be in a lower value, and becomes in the state of larger electric power consumption to bring about a steep temperature rise. Fig.10 is a diadram for representing the time change of the surface temperature (71) of the above-described heat generating resistor (1) accompanying to the above-described pulse application. In this figure, T c represents the temperature of the metal semiconductor phase transition in the electric conductivity of the above-described heat generating resistor, and t on the application start time of the above-described pulse, t p the time for that the above-described heat generating resistor surface temperature reaches to the above-described phase transition temperature (T c ), and t off the application finish time of the above-described pulse. In the interval from t p till to t off , the above-described heat generating resistor (4) is present as a heat generating resistor having higher resistance value by the metal semiconductor phase transition, and the surface temperature of this heat generating resistor carries out mild rise almost from the vicinity of the above-described phase transition temperature T c . The actual heat generating resistor temperature can be a little higher than the above-described T c from thermal inertia due to the heat capacity and heat resistance of the heat generating resistor itself and the structural member of the circumference. The surface temperature rise of the heat generating resistor from t on to t p in the case when the area of the heat generating resistor (1) is assumed to be 0.015 mm² in correspondence to the heat generating resistor density of 8 dot/mm, the resistance value in the low temperature side of the heat generating resistor about 500 Ω, the resistance value in the high temperature side about 2000 Ω, and the applied voltage 20 V, when a heat absorbing material such as a heat sensitive paper, etc. is not contacted to the surface of the heat generating resistor, the temperature reaches to T c of about 150°C, which should be said to be the base temperature of the above-described heat generating resistor, from t on of room temperature state in a time of less than about 0.2 milli sec, and further, reaches the temperature of above about 300°C sufficient for heat sensitive recording in about 1 milli sec. Since the heat resistance in the circumference of the heat generating resistor and the thermal characteristics of the heat capacity changes with the glaze thickness of the above-described glazed substrate of the thermal head, the thickness of the protection layer coated on the surface of the heat generating resistor, this time becomes individually different accompanying to the structure of the thermal head. However, the above-described base temperature of the heat generating resistor is determined by the above-described phase transition temperature T c owned by the material constituting this heating resistor and is not dependent on the thermal characteristics of the thermal head as described above and the structure of the thermal head, and makes the temperature of the heat generating resistor rise up to the temperature level of the above-described T c in an extremely short time. As has been explained in the conventional technical problematic points, in the thermal head, although there exists the fluctuation of thermal characteristics such as the heat dispersing characteristics and the like for the heat generating resistor, but although this fluctuation appears in the time constant of the temperature rise and cooling above the above-described T c , that is, after the above-described t p , and the fluctuation of the temperature rise gradient from the above-described t on to t p , that is, a little fluctuation in the time of t p , but there is no case where the value of the above-described T c itself is fluctuated. However, the color generating mechanism in the heat recording is a chemical reaction by the heat of the heat generating agent in the direct heat sensitive system and the reaction velocity depends on temperature, and in the heat transcription system and the thermal ink jet, it depends on the physical phase change such as the physical melting, sublimation, and evaporation of the ink, and recording is governed by the temperature of the ink. Therefore, in the present invention, in which recording is controlled at the middle point of the temperature rise by the constant temperature T c , in comparison with the case where the temperature can not be directly controlled such as in conventional cases, the effect of the fluctuation of the thermal characteristics of the thermal head and the like to the recording characteristics becomes to be small by far, Also, the fluctuation of the resistance value can be caused by the resistance film thickness, etc, without questionning the kind of the thermal head and the like related to the present invention, but although this fluctuation appears, in the heat recording device of the present invention, as the fluctuation of the time from the temperature of the above-described t on to T c and in the temperature rise gradient from t p to t off , but the above-described T c is the proper one to the substance and has no relationship to the resistance value itself, and in the same manner as in the case of the above-described thermal characteristics fluctuation, the effect of the resistance value fluctuation to the recording characteristics is extremely little. When it is desired that the temperature rise gradient by the fluctuation of the resistance value of the above-described heat generating resistor and the peak temperature fluctuation at the time t off be made smaller and more uniform, it will do that the applied voltage or current is adjusted in such a manner that they become uniform in the electric power by making to agree to the size of the heat generating resistor resistance value in the phase of the semiconductor electric conductivity in the high temperature side of the above-described heat generating resistor, or the electric power from t p to t off (in reality, from t on to t off ) is adjusted. Further, when more severe uniformity is required, it will do that the applied voltage is adjusted in agreement to the size of the resistance value of the heat generating resistor in the phase of the metallic electric conductivity in the low temperature side. In this case, it is intended to make the temperature gradient from t on to t p , that is, to the above-described T c be uniform, and the time itself from t on to t p can not be directly adjusted, and the voltage adjustment or current adjustment only can be carried out. The time from t on to t p in the general heat recording device of the present invention is extremely shorter than the time from t on to t off , and since it has been self controlled by the temperature T c , the adjustment effect to the recording characteristics are displayed stronger in the high temperature side between the interval from t p to t off . Therefore, in the case of adjusting the applied voltage or current in such a manner as to become uniform in the electric power by making agree to the size of the resistance value of the heat generating resistor in the phase of the semiconductor electric conductivity in the high temperature side of the above-described heat generating resistor, the effect of the above-described adjustment from t on to t p may be neglected. On the contrary, in the case of adjustment of the applied voltage and current in agreement to the size of the resistance value of the heat generating resistor in the phase of the metallic electric conductivity in the above-described low temperature side, it is necessary to notice the effect of this adjustment to the temperature behaviour from t p to t off . As described above, although the effect of the fluctuation of thermal characteristics of the thermal head and the fluctuation of the resistance value to the recording characteristics is extremely little in the case of the present invention, when the above-described phase transition temperature, that is, the intermediate control temperature T c shown in Fig.10 is the higher and the nearer to the peak temperature T p necessary to sufficient recording, more uniform recording becomes possible. Also, when the electric power consumption in the high temperature side is the smaller in comparison with the electric power consumption in the side of a lower temperature than T c , or in the case when the constant voltage driving has been considered, the resistance value is higher in the high temperature side than in the lower side, and the difference is the larger, and the more uniform recording becomes possible. Especially, in the case when the conditions for effecting the more uniform recording as described above has been both satisfied in a highly sufficient degree, the control of the concentration harmony in the boat sensitive recording and the like can be realized simply and with highly precise harmony by the control of the pulse applying time from t on to t off . Although the temperature of the metal semiconductor transition of the above-described heat generating resistor has been set as about 150°C in the above-described embodiment, but in a high speed heat recording device requested with higher peak temperature, a vehicle mounted heat recording device for using high temperature color generating heat sensitive paper, and a thermal ink jet for recording short pulses, when the heat generating resistor is made be a heat generating resistor of high phase transition temperature such as 200°C, 250°C, etc., and when the resistance value as a heat generating resister is made low (or, the applied voltage is high) to make the electric power large, the color generation reaction and the like of the heat sensitive paper occurs sufficiently in a short time by the high temperature, and even by the short applied pulse width (t off -t on ) of the time from the above-described t p to t off , the heat generating peak temperature can be surely obtained, and a uniform recording becomes possible. On the contrary, in the thermal head and the like of a low speed low electric power consumption type, it will do that the resistance value of the low temperature side and the resistance value in the high temperature side are made higher (or the applied voltage is made low, to let temperature rise occur gradually to T c , and further, let it gradually reach to the peak temperature. In this case, since the peak temperature requires not to be too high, it will do that the above-described phase transition temperature T c is made be lowered to 120°C, etc. The Second Embodiment Fig.3 is a diagram for explaining the second embodiment of the present invention, and shows a plan view of the essential part of a thermal head equipped with a heat generating resister of the constitution connected between the individual electrode (2) and the common electrode (3) is connected in parallel to the first resistor (7) comprising ordinary heat generating resistor materials such as tantalum nitride, thermet, etc., and the above-described first resistor (7) and the second resistor (8) consisting of a film pattern for effecting the metal/nonmetal (insulator) phase transition are formed into a laminated layer Fig.4 is a sectional diagram in the line A-A' of this heat generating resistor, and Fig.5 is a sectional diagram in the line B-B'. In the case when voltage is applied to the above-described individual electrode (2) and the common electrode (3), when the temperature at that time is lower than the above-described phase transition temperature T c2 of the above-described second resistor (8), the heat generation for dedicating recording is generated in the first resistor (7) and the second resistor (8), and when the temperature of the heat generating resistor (that is, the temperature of the second resistor) reaches the above-described T c2 , the second resistor is changed in a non-metal (or changed in an insulator), and gives heat generation in such a degree as almost negligible, when compared with that in the heat generation in the first resistor. Therefore, in this state, only slight heat generation is found in comparison with the heat generating state in a temperature lower than the above-described T c2 , and the temperature rise on the surface of the heat generating resistor changes in the same manner as that in the figure of representing the temperature change of Fig.10. The surface temperature rise of the heat generating resistor from t on to t p is, when the area of the heat generating registor (7, 8) is taken to be 0.015 mm² corresponding to the heat generating resistor density of 8 dot/mm, the resistance value of the first resistor as 2200 Ω, the resistance value in the lower temperature side than the above-described T c of the second resistor as about 650 Ω, and the resistance value in the high temperature side as 20 kΩ. Then, the parallel resistance value is below the temperature of the above-described T c2 is about 500 Ω, and above T c2 becomes about 2000 Ω, and the resistance value characteristicsis equal to the case of the above-described first embodiment are obtained, and therefore, the heat generating characteristics are also approximately equal. Although in the above-described resistance value example, the second resistor has effected the resistance change of about 30 times by making T c2 as the boundary, but by the selection of the material, the one which changes more than 2 orders is also possible. Although in the first embodiment, 2 ways of resistance values have been realized in the near position of T c2 , but since in the second embodiment, they are realized with parallel resistance, the freedom of material selection for realizing the necessary resistance value is high. The Third Embodiment When the resistance value design is carrird out in such a manner as that the consumption electric power per area becomes low to a certain extent in the temperature above the above-described T c2 , by utilizing the structure of the above-described second embodiment having high freedom of material selection, then, as shown in Fig.11 in the changing curve (72) of the heat generating resistor surface temperature, even if stationary electric consumption has been carried out by applying DC voltage, the heat generating resistor surface temperature reaches the equelibrium temperature T e where the heat generation and the heat dissipation becomes equal to that in a temperature range where the heat generating resistor is not burnt out, and the above-described equelibrium temperature T e can be maintained as far as the voltage application is not finished. Although it is possible to form the state for maintaining the equelibrium temperature even by using a sole ordinary resistor such as the above-described first resistor, but in the case of the present invention, since the temperature control such as the bias temperature is carried out at the above-described T c2 , which is a temperature a little lower than the above-described equelibrium temperature T e , the above-described equelibrium temperature T e is difficult to be shaken by the temperature conditions of the circumference, and since the temperature rise till to T c2 is helped by the heat generation of the above-described second resistor, so that there is such a merit that the equelibrium temperature T e is reached in a shorter and slight time fluctuation. When the equelibrium temperature T e stabilized in such a manner as described above is realized, the reproducibility of the harmonious recording control by the timing control of t off can be enhanced, and a hamonious lettering excellent in quality can be provided. The Fourth Embodiment It is also possible to constitute the above-described first resistor (7) in the second embodiment with a material for effecting the transition of metal/nonmetal. (or, insulator/semiconductor) at T c1 , which is different to the phase transition temperature T c2 of the above-described first resistor (7). For example, when the phase transition temperature T c1 of the first resistor is taken as 200°C, and the phase transition temperature of the second resistor as 150°C, and a constant voltage is applied to the heat generating resistor of such constitution as that the surface temperature of the heat generating resistor shows such a behaviour as shown in the change curve (73) of the heat generating resistor surface temperature of Fig.12. A steep temperature rise is carried out from t on for starting voltage application to the temperature T c2 , and next, to T c1 , and a mild temperature rise is carried out, and the subsequent temperature rise becomes a mild rise or a stabilized state not to rise above T c1 . The conditions for effecting temperature rise not to above this temperature T c1 are such that the parallel resistance value of the above-described first and second resistors in the temperature above the above-described T c1 is high, and the heat generation is insufficient to let the temperature rise up to above T c1 be carried out, and while the above-described second resistor is continued to be voltage applied at a temperature in the vicinity of the above described T c1 , to realize the state in which the above-described phase transition from the metal phase to the non-metal phase and from non-metal phase to metal phase is continued to occur. When such a state is realized, the harmonious recording can be easily carried out in the same manner as in the case of realizing the above-described equelibrium temperature T e , and since the region of high temperature, that is, from T c2 to T c1 , is made to have a little mild temperature gradient, the heat shock to the circumference of the heat generating resistor in the high temperature part is softened, and therefore, the heat generating resistor becomes to get a heat generating structure having high reliability. The manner of the temperature change of the heat generating resistor surface in the case when the heat generating resistor structures of the first and second embodiments shown in Figs.1 and 3 have been driven with continuous pulses such as has been shown in Fig.13, and also, the manner of the temperature change of the heat generating resistor surface in the case when the heat generating resistor structures of the third and fourth embodiments have been driven with continuous pulses, has been shown in Fig.14. The intermediate temperature T c for rising up in steep gradient and for reaching from the first pulse to the n th pulse is constant, and although the temperature rise time by the first pulse becomes a little longer in such a grade that the initial background temperature of the heat generating resistor is low, but after the second pulse, the heat generation curve becomes to be almost the same. In such a manner as described above, without carrying out utterly the control on the driving, the self control to a constant heat generation temperature can be carried out. Although the fact that the heat generating temperature rise time is long does not become especially a problem, but in the case when a strict recording concentration is required, the peak temperature preserving time may be uniformly controlled by elongating the applied pulse width for such a grade that the temperature rise is long, in the case only when the first pulse, that is, the back ground temperature is low. In the recording device for carrying out harmonious recording, it is a general performance that the harmonious control is carried out by the length of the applied pulse width irrespective of the kind of devices such as the direct heat sensitive system, sublimation transcription system, and electric conduction recording. In the conventional heat recording method, since the peak temperature of the heat generating resistor has become largely changed together with the length of the pulse width, the harmonious control has been difficult, but in the present invention, since at least the intermediate temperature of the heat generation and temperature rise procedure is self controlled to a constant value, it is possible to carry out harmonious control in which the heat generation peak temperature and the total energy given to the ink and the like are controlled with good reproducibility, and especially in the third and fourth embodiments, the state in which the peak temperature is more uniform can be realized, and strict harmony can be realized. Although in the conventional examples, there is such a case that the relative concentration control of about 64 harmonies is carried out, but, in the absolute control, at most 16 harmonies are the limit. However, in the thermal head in the present invention, as is evident by the above-described explanation, the absolute concentration control is easy, and 128 harmonies and 256 harmonies are also possible. Fig.15 is a diagram representing the temperature waveform of the heat generating resistor surface temperature versus the applied pulse width to the heat generating resistor in the heat recording method of the first and second embodiments of the present invention in the hamonious control, and Fig.16 is a diagram for representing the temperature waveform of the similar heat generating resistor surface temperature of the third and fourth embodiments. In respective figures, although the heat generating resistor temperature waveforms (18-1, 20-1) by the first harmonious pulses (19-1, 21-1) are starting the cooling depression in the middle of the temperature rise procedure, but even in the harmonious pulse setting such as described above, when the final terminal of the almost all of the pulses to the n th harmony is after the time for reaching the self controlled intermediate temperature T c (or T c2 ), the harmonious precision becomes to be the high one. The Fifth Embodiment In the above-described second embodiment shown in Figs. 3, 4, and 5, although the plane shapes of the above-described first resistor and the second resistor were the same, but there is such a case where the first resistor (10) and the second resistor (11) are paralleled as in Fig.6. Fig.7 is a C-C' sectional diagram of the heat generating resistor in Fig.6. The shape of this first resistor (10) agrees with the external shape of the heat generating resistor, and the second resistor (11) is formed at the a part in a shape in which a slit b is opened in the central part of the heat generating resistor. On the above-described second resistor (11) is laminated the above-described first resistor (10). When voltage pulses are applied to the heat generating resistor of this fifth embodiment to let it generate heat, the change in the temperature rise procedure of the heat generating resistor surface temperature distribution of the C-C' sectional surface in Fig.6 becomes such as the distribution curve (77) of the heat generating resistor surface temperature distribution of Fig.18. The a part where the above-described first resistor and the second resistor are laminated carries out prompt temperature rise until it reaches to the temperature T c , and the b part becomes the valley of the temperature. When the a part exdeeds the temperature T c , in the total region a and b, there is the heat generation by the above-described first resistor only, and carries out mild heat generation uniformly. In the state above this T c , the heat in the a part of the circumference diffuses into the b part which has formed the valley of the above-described temperature, and the surface temperature distribution of the heat generating resistor sectional surface approaches to a trapezoid shape, and in contrary to that the temperature distribution in the conventional heat generating resistor becomes a temperature peak in the central part, it forms a heat generation distribution faithful to the shape of the heat generating resistor. The Sixth Embodiment As shown in the plan diagram of the heat generating resistor in Fig.8, and the D-D' sectional diagram of this heat generating resistor in Fig.9, when the second resistor (11) in Figs.6 and 7 is provided, on the contrary, in the b part and is not provided in the a part, then, such as the distribution curve (76) of the heat generating resistor surface temperature shown in Fig.17, the temperature peak of the b part, that is, the heat generating resistor central part becomes sharper than that of the conventional one, and since the temperature is the higher, Tc has the more tendency of approaching to the conventional sharpness, so that the utilization of this embodiment in the net point system harmonious method by the applied energy adjustment in the heat sensitive recording brings about the improvement of the reproducibility of the harmonious region of the low concentration (small area), which has been difficult heretofore. Also, it is also suitable to the air bubble generation in a liquid ink which requires spontaneous high temperature, such as in the thermal ink jet. The Seventh Embodiment Although the above description has related to the embodiments for uniformly control the heat generation temperature of the heat generating resistor for applying heat to the recording medium such as the heat sensitive paper, or the ink doner sheet for being transcripted on a recoding medium, or a liquid ink, but in the current passing heat recording method, in which voltage pulses are applied by a current passing head which has a current passing electrode to the heat sensitive paper withn a heat generating layer and the ink doner sheet, and the heat sensitive paper and the ink doner sheet itself generates heat to record by use of a laminated heat generating layer having the first resistance layer comprising an ordinary heat generating resistance material such as a carbon paint as the above-described heat generating layer, and the second resistance layer comprising materials for effecting the phase transition of metal/non-metal, for example, at the temperature T c2 , the uniformity of the recording can be devised by the uniform self control of the heat generation intermediate temperature. In the following, explanation will be given on the embodiment of the present invention in this current passing heat recording. Fig.19 is a sectional diagram of a current passing heat sensitive recording device, and the current passing heat sensitive recording paper (50) comprises a color generating recording layer (51), the above-described second phase transition layer (52), and the above-described first ordinary resistance layer (53), and this second resistor layer (52) is a layer formed by uniformly painting or vapor evaporating a material comprising a main component made with an elementary material, in which electric conductivity changes metallic in the low temperature side of a specified temperature region and changes non-metallic in the high temperature side. Althogh the specified temperature region T c2 for effecting the change of the above-described electric conductivity should give difference by the recording device such as high speed recording type, low consumption electric power type, harmonious recording type, etc., but for example, from about 100°C to 150°C is preferable. The above-described current passing heat sensitive recording paper (50) applies voltage pulses between the current passing electrode (61) and the return path electrode (62) in the state in which the above-described current passing heat sensitive recording paper is pinched between the platen (66) and the current passing head (60) to let the above-described first and second resistance layers (52, 53) generate heat. When the above-described laminated heat generating layer reaches the heat generating above-described temperature T c2 , the resistance value in the above-described second resistance layer (53) rises suddenly up, and becomes almost not to dedicate to heat generation, and a mild temperature rise of the color generating layer (51) is brought about by the heat generation of the above-described first resistance layer (52), and color generation is carried out. The 8 th Embodiment Fig.20 is a sectional diagram of a current passing transcription use ink donor sheet provided with a heat melting ink layer (56), an electric conduction layer (54), and a mixed heat generating resistance layer (55) dispersed with the second resistance particles (58) comprising a material having elementary materials in which the electric conductivity carries out metallic change in the low temperature side of the specified temperature T c2 , and non-metallic change in the high temperature side, as the main component and the first resistance particles (57). Fig.21 is a sectional diagram of a current passing recording device using this ink donor sheet, and the current between the current passing electrode (61) of the current passing head and the return path electrode (65) provided in a position a little separated from this current passing head mainly flows to the depth direction of this layer. The above-described second resistance particles (58) for effecting phase transition and the above-described first resistance particles (57) constitute a parallel circuit between the above-described current passing electrode (61) and the above-described electric conduction layer (54), and both ones dedicate to heat generation below the above-described specified temperature T c2 , and the second resistance particles become almost not dedicate to heat generation above T c2 . The above-described mixed heat generating resistance layer (55) and the electric conduction layer (54) may be not provided in the ink donor sheet, and may be provided in a sheet another than the ink donor sheet as a heat generating sheet. In an embodiment using a material layer (or particles) for effecting metal/non-metal transition and an ordinary resistance layer (or particles) in the heat generating layer of the above-described Figs.19 and 21, in the same manner as in the case of the heat recording used the thermal head equipped with the first and second resistors in the above-described second embodiment, the above-described heat generating resistance layer quickly rises the temperature to the asbove-described specified temperature (T c or T c2 ), without depending to the current passing voltage, current passing time, temperature of the current passing head, the temperature before current passing of the current passing heat sensitive paper containing a heat generating resistance layer, the platen, and the environmental temperature, etc., and thereafter, a mild temperature rise is carried out. Therefore, the heat generating peak temperature is liable to realize a stabilized temperature by making the above-described specified temperature (T c or T c ) as the base, and the heat control in the conventional manner is not required, and uniform heat recording can be realized. Embodiments Related to the Driving Method of the Present Invention Next, the method of heat generation and driving of the present invention in all the above described embodiments will be explained by referring to embodiments. Fig.23 shows the waveform (41) of the current flowing in the heat generating resistor and heat generating resistance layer, when voltage pulses such as (42) are applied to the above-described respective heat generating registers and heat generating resistance layer. In the case when the heat generating resistor temperature before passing current is below T c (or T c2 ), for example, the resistance value of the second resistor in the above-described second embodiment is low, and the resistance value as a heat generating resistor has become the paralleled resistance value of the first resistor and the resistance value in the second low state, and more current flows through them. This state continues until the time t p when the second resistor reaches the temperature region of T c2 , where it transits to the high temperature phase, and after this time, the current value becomes in a reduced state in the extent such as the resistance value of the second resistor has been increased, and this state is continued till to the final terminal of the current passing pulses. In the case of constant voltage driving, the resistance value of the heat generating resistor becomes about 500Ω before t p , and when it is 2000Ω after t p , the current value decreases to 1/4 after tp. Strictly, the resistance value of the above-described first resistor has a little temperature dependency, and when it is a general thermet resistor, it has a resistance temperature coefficient of several hundred ppm/°C, and also, the above-described second resistor also has a little temperature dependency of the resistance value even in the temperature region separated from the phase transition temperature region where the resistance value changes largely, so that a little variation of the current value is present even in the pulse application time zone before the time tp and in the pulse application time zone after t p . Also, the above-described current value is subjected to the influence of the L and C components of the heat generating resistor circuit. However, the influence to these above-described current values is extremely slight in comparison with the current value change in the vicinity of the above-described time t p . By the way, in the heat recording devices of respective systems, the recording picture image is displayed with a plural number of dots, and for example, in the case of a thermal head, many number of minute heat generating resistors are equipped, and respective heat generating resistors make the above-described dots be displayed. Since the electric source device provided in the above-described recording device can not be made large thoughtlessly, so that in general, the above-described plural number of heat generating resisters are divided into a plural number of blocks, and the time sharing drive for applying current passing pulses per these blocks is carried out, and the maximum electric power, that is, the maximum current in the recording is made small. In the recording device according to the present invention, since a large current change occurs in the current passing pulse of one dot, even if the dividing drive for not overlapping the driving time of the respective blocks such as shown in Fig.22 is carried out, there is generated the loss in the current capacity. However, when the time shift amount of driving of respective blocks such as shown in Fig.24 is per the time from t on to t p in Fig.23, and the number of heat generating resistors in one block is set to be few, the variation of the current, which the above-described electric source supplies, becomes little, and the total current can be suppressed. Fig.24 is an example of the timing chart showing the pulse (46-i) applying time in the block division drive, which has made the above-described consideration as the base, and the current waveform (45-i) of the corresponding block. The shift time of the above-described division drive is dt. The peak current part (the part corresponding to (44) in Fig.23) of the N th block overlaps to the small current part (the part corresponding to (43) of Fig.23), and the peak current part of the N+1 th block also overlaps to the small current part of another block. Although it has already been described, the time from t on to t p , which becomes the above-described peak current part, makes a little variation by the initial temperature of the heat generating resistor related, and becomes longer the lower temperature the above-described initial temperature is. This is due to the fact that the heat generating resistor requires the more time to raise the temperature till to the above-described temperature T c when it raise the temperature from the lower temperature. Since it is desired from the electric source efficiency that the time from the above-described t on to t p does not overlap between the above-described respective blocks even spontaneously, so that it will be good to carry out the division drive of the block in the timing having set d t a little longer than the time from t on to t off in the lowest performance assuring temperature of the recording device related. Also, there is such a case that the temperature in the circumference of the heat generating resistor or the heat sensitive resistance layer is sensed, and let d t to change in correspondence to this temperature. When the block is driven such as Fig.24, in comparison with the case that the block has been driven in the timing such as in Fig 22, the driving of all blocks can be completed in a short time, and becomes useful in making the recording high speed. In the case when the division drive has been carried out in the time shift of d t which is a sufficiently short time in comparison with the applied pulse width (the time from t on to t off ), there is such an advantage in the fidelity of the recording as described in the following, other than the advantage to make the electric source efficient. When the case of the thermal head is taken as an example, although a plural number of heat generating resisters are arranged linearly, and recording is carried out by continuously and relatively making the heat sensitive recording paper sheet in perpendicular direction, but, for example, in the case when a straight line of the line width corresponding to 1 dot in the direction of the row of the above-described heat generating resistors is intended to be recorded, if the shift time d t of the block division is so long as can not be neglected in comparison with the time in which the heat sensitive paper sheet relatively travels the distance of the line width corresponding to the above-described 1 dot, the above-described straight line becomes to be a stairway-like line corresponding to the position of the above-described block. However, in the above-described division method in which d t has been shortened and the division number has been increased, the stairway-like step difference becomes slight in correspondence to the shortness of d t , and is represented as a straight line in which the above-described stop difference is not prominent. Therefore, the method of the present invention is an extremely useful method in the use as a plotter of a figure. By the way, as the substance for effecting the above-described one series of metal/non-metal (or, insulator/semiconductor) transition, there are vanadium system compounds. By doping a minute amount of Cr in vanadium oxide, the change of the electric conductivity corresponding to metal/non-metal (or, insulator/semiconductor) is generated in a region of the temperature higher than room temperature. In the higher temperature side, non-metallic electric conductivity is obtained, and in the lower temperature side metallic electric conductivity is obtained. Both vanadium and vanadium oxide are high melting point substances, and are possible to be used as a heat generating resistor. The film formation by the thin film process by use of sputtering is possible to be used for a heat generating resistance film. The production by the thick film process in which the compound is made as a powder and is mixed with a binder, or is made into an organic metal compound to be mixed with a binder is also possible. In the above-described 8 th embodiment ( the embodiment in the current passing heat recording), particles in which the particle diameter is properly arranged uniformly to about the thickness of the heat generating resistance layer are used. In any of the above-described cases, the component of the vanadium oxide formed into a film or properly arranged in the particle size requires at least a polycrystalline structure. In the case of sputtering, the method in which an alloy target of metallic vanadium and chromium, or a metallic vanadium target buried with chromium is sputtered by use of argon and oxygen gas, the method in which a target formed by sintering the mixture of vanadium oxide powder and chromium oxide powder by use of argon gas or by use of argon gas mixed with minute amount of oxygen in carrying out sputtering, and the like can be used in the methods. In any of the sputtering processes, although it is desirable that the temperature of the film adhering part is above several hundred °C, but there is also the method for increasing the crystallizing properties by carrying out laser irradiation after the film formation or by carrying out vacuum annealing heat treatment. In the case when a suitable amount of Cr has been doped, since the electric conductivity changes for 2 to 3 orders, so that when the device is used as a heat generating resistor and the heat generating resistance layer of a current passing heat sensitive paper, the consumption electric power value changes for 2 to 3 orders, and from the view point as the heat recording, it accompanies substantially the change of heat generation/non heat generation. Therefore, when it is parallely inserted in an ordinary resister such as tantalum nitride, thermet, etc., the heat generating resistors of the above-described one series of embodiments can be realized. When the ratio of Cr for doping in the above-described vanadium oxide is changed, it is possible to change the above-described transition temperature, and the setting of the temperature of the above-described one series of intermediate temperatures T c becomes possible. In the vanadium oxide not doped with Cr, although the ratio of the resistance value change is little, and is a mild change for the temperature, but at about 400°C as the boundary, there is the temperature rise of nearly one order, and can be used in the heat generating resistor of such a solitary material constitution as in the first embodiment according to the present invention, and is also possible as a heat generating resistor material combined with an ordinary resistor material. For example, in the above-described second embodiment, although the first resistor and the second resistor has been provided as another layers of the resistance films, if the phase transition material such as vanadium oxide, etc. can preserve its phase transition characteristics in a film of mixed structure with other metal (for example, tantalum), a heat generating resistor can be formed as a mixed film. In this case, the product becomes a solitary heat generating resistor film which is the same as that in the above-described first embodiment, and the simplification of the processing such as the film formation of the heat generating resistor and the patterning can be devised. Fig.25 is a diagram for representing the temperature change of the line resistance of the heat generating resistor for carrying out metal/non-metal transition in the above-described first embodiment. Since the line resistor itself changes with the film thickness and the line width, although it is a reference value, in vanadium oxide doped with about 0.5% of the above-described Cr, there is a resistance value change of about 3 orders at about 150°C as shown in the line resistance characteristics curve (31). The temperature region for generating resistance value change varies by the dope amount of Cr, and when the dope amount of Cr is increased, the temperature region of the above-described resistance value change is gradually shifted to the low temperature side. When the dope amount of Cr to vanadium exceeds several %, since the change of the resistance value increase from the low temperature side toward the high temperature side is extinguished, the object of the function of the device according to the present invention becomes difficult to be attained. As described above, since the dope amount of Cr makes the temperature characteristics of the resistance change occur, due to the microscopic inuniformity in the sample of the dope amount of Cr for vanadium, there is such a case that the change of the above-described line resistance becomes such a gently sloping one having a certain temperature width such as, for example, in the curve of Fig.25 (32). Even with such a gently sloping change as described above, the object of the function of the device according to the present invention is attained. Also, for example, when the current is passed to the heat generating resistor of one edge of 0. several mm to make it effect temperature rise, since the temperature rise is not generated spacially uniform in the heat generating resistor, so that, for example, in the case when the above-described substance has been used in the heat generating resistor of a thermal head, although the change of the resistance value as a heat generating resistor becomes apparantly such a gently sloping one as in Fig.25 (32), but in this case also, there is microscopically generated a quick temperature rise till to the above-described intermediate temperature T c and a mild temperature rise in the temperature above T c . Therefore, in order that the part where the temperature rise is slow continues quicker temperature rise and the part, where the temperature rise is quick, displaces quickly to a mild temperature rise state, the present invention has the function of correcting the temperature distribution in the heat generating resistor to more uniform direction, and in comparison with the conventional heat sensitive recording method and the like, has the advantage that the recording having higher fidelity of the recorded dots can be realized. In all the above-described embodiments, the intermediate temperature (T c ) where the temperature rise speed of the heat generating temperature rise procedure of the heat generating resistor does not change even when the recording medium such as the heat sensitive paper and the like, which are the heat absorption source, is contacted on the heat generating resistor, or is not contacted, and since above the above-described intermediate temperature it carries out milder temperature change, the deterioration and destruction of the heat generating resistor by the abnormal temperature rise of the heat generation peak temperature in the no paper supplied state of the heat generating resistor in the thermal head in the conventional heat recording is difficult in the heat generating resistor of the recording device according to the present invention. Also, high reliability is displayed for the situation such as the erroneous performance, reckless driving, etc. of the driving control circuit and CPU due to the noise, etc. The above-described facts have also common effects in that that the danger of generating in the current passing heat recording also such cases as the abnormal heat generation of current passing heat sensitive recording paper due to the circuit reckless running, etc., combustion, and destruction of the device parts such as platen and the like to enhance the reliability and safety of the device. By the way, in the devices of all embodiments, resistance characteristics of the heat generating resister, the heat sensitive resistance layer, etc., it is not necessary that the electric conductivity changes discontinuously in an especially specified temperature, and it is a matter of indifference that it carrys out continuous temperature change in a temperature region having specified width. As the resistance value change of the above-described heat generating resistor, when there is a change of about 1.5 times to 10 times, there is displayed a sufficient effect. This change amount means the real ratio of the resistance value for bringing in the electric current consumption (energy) which can reach a temperature necessary for the temperature rise by heat generation to the recording, and the resistance value of such a degree of size that the electric power consumption (energy) at least maintains the temperature of the heat generating resistor and the heat sensitive resistance layer. [ Effect of the Invention ] As has been described above, according to the present invention, 1 ○ Even to all the temperature environment wherein the heat generating resister, etc., are positioned, a temperature control having more uniformity and reproducibility becomes possible, and the recording of high quality having uniformity and reproducibility becomes possible. 2 ○ Even for the fluctuation of the thermal characteristics, it is possible to suppress the fluctuation of the recording characteristics. 3 ○ Even for the fluctuation of the heat generating resistor resistance values and the sheet resistance values of the heat sensitive resistance layer, it is possible to suppress the fluctuation of recording. 4 ○ The concentration harmonious control of high precision and the net point harmonioue control is easy. 5 ○ The temperature information collecting circuit such as the temperature detection, etc., and the recording concentration correcting circuit in the recording device can be simply carried out, and it is possible to provide the device in small size and in a cheap price. 6 ○ In relation to the reckless running proofness and the like of the heat generating resistor, the device has high reliability and safety. 7 ○ The heat generatig temperature distribution is faithful to the heat generating resistor shape, and has excellent recording quality. Also, according to the driving method of the present invention, the following excellent effects can be displayed. 8 ○ The electric source capacity can be made small. 9 ○ High speed recording is possible. The recording of a straight line by a heat generating resistor row or a current passing electrode row can be faithfully carried out. 1. heat generating resistor, 7,10. first resistor, 8,11. second resistor, 2. individual electrode, 3,5. common electrode, 4. switching element, 18-N, 20-N heat generating resistor surface temperature, 19-N, 21-N harmonious current passing pulse, 31,32 resistance value characteristics of the resistor, 41,45,47 electric current waveform, 42,46,48 current passing pulse, 50 current passing heat sensitive paper. 51 color generating recording layer, 52 first resistance layer, 53 second resistance layer. 54 electric conduction layer, 55 mixed heat generating resistance layer, 56 ink layer, 57 first resistance particles, 58 second resistance particles, 60 current passing head, 61 current passing electrode, T c ,T c1 ,T c2 phase transition temperature of the resistor, T e equelibrium temperature of heat generating resistor, t on current passing pulse application time, t off current passing pulse application finish time, t p T c reach time, d t drive shift time.

Claims: A method of driving heating resistors in a thermal recording apparatus, comprising the step of: dividing a plurality of heating resistors into a plurality of blocks, each of the heating resistors having an electrical resistance value which changes from a first lower resistance value in a lower temperature range to a second higher resistance value in a higher temperature range in a stepped manner during supply of a constant power pulse; and driving the plurality of heating resistors in the plurality of blocks by sequentially applying a pulse to each of the blocks to generate heat sequentially so that a current which is generated in the heating resistors by means of application of a constant voltage pulse changes from a first state with a large current to a second state with a small current in a stepped manner within a pulse application time, and the plurality of blocks are sequentially driven so that the first state with a large current within the pulse application time of one of the blocks does not overlap with the first state within the pulse application time of another one of the blocks. A method of driving heating resistors in a thermal recording apparatus according to claim 1; wherein the plurality of blocks are sequentially driven so that the second state with a small current within the pulse application time of one of the blocks overlaps with the first state with a large current within the pulse application time of a block which is next applied with a pulse.

Inventors: SAITA YOSHIAKI C O SEIKO INSTR, SANBONGI NORIMITSU C O SEIKO I, SATO YOSHINORI C O SEIKO INSTR, SAITA, YOSHIAKI, C/O SEIKO INSTRUMENTS INC., SANBONGI, NORIMITSU, C/O SEIKO INSTRUMENTS INC., SATO, YOSHINORI, C/O SEIKO INSTRUMENTS INC.
Applicants: SEIKO INSTR INC, SEIKO INSTRUMENTS INC.
Application year: 1991
Main classification: B41J2
IPC codes: B41J2