A sealable contamination-proof container package for wafers

Abstract: A sealable contamination proof container package bottom and top for storing and transporting a plurality of substrate or wafers in a robotic wafer carrier. The package bottom includes four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positioned on a vertical edge, opposing hook latches on opposing sides, opposing hand grip recesses on the opposing sides and a raised bottom surface for package stacking. The package top includes four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positioned on the vertical surface, opposing hook catches on the opposing side, a top surface with raised stacking surfaces, and two rows of wafer support springs positioned on bars on the underside of the top surface. The package top and bottom halves provide that the robotic wafer carrier mates between the package top and package bottom with the wafers or substrates in the carrier. The package top and bottom mate with the upper lip engaged with the lower lip, and the catches of the top engage with the latches of the bottom. The package halves are designed in such a fashion as to prevent wafer or substrate damage upon opening, in that the top package half is moved in a direction coinciding to the plane of the wafers or substrates with respect to positioning of the catches and latches on the package side. Appropriate sides of the package top and bottom are plumb with each other providing for a flush perimeter for ease of taping. The raised top portion of the top package half and the recessed bottom of the bottom package half provides for stacking of like packages. In an alternative embodiment, opposing rows of articulated cantilevered horizontal arms with centering V grooves on each end for engaging a wafer, disk or substrate extend inwardly from the edges of an arced top surface in the package top.

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention - The present invention pertains to a package, and more particularly, pertains to a package for the storing and transporting of semiconductor wafers, disks or substrates in a robotic wafer carrier. The package includes articulated cantilevered horizontal arms with centering V grooves for engaging the wafers, disks or substrates. 2. Description of the Prior Art - Prior art packages have usually lifted from the end. This end lifting caused stress and strain on the end wafers, and sometimes caused breakage as the top slid against the plane of one or more wafers. Further, most prior art packages have opened from the ends, rather than opening from the sides, which resulted in damage from the spring tension on the last tooth and then on the last semiconductor wafer, disk or substrate. Prior art devices also included wafer hold down members which slid against the periphery of the contained wafer substrate causing an abrasive scraping action which dislodged or caused small particles to break loose near the peripheral edge of the wafer substrate and allowing particle contaminants to invade the otherwise clean interior of the substrate package. The present invention overcomes the disadvantages of the prior art by providing a package which opens on the side, and by providing articulated cantilevered horizontal arms with centering V grooves which do not scrape or grate upon the wafer substrates, but instead flexingly engage them. SUMMARY OF THE INVENTION The general purpose of the present invention is to provide a package for wafers, disks or substrates which opens from the sides and evenly secures and prevents contamination of the wafers, disks or substrates. Abbreviations used in the description below for the term "wafers, disks or substrates" include the terms "wafers", "substrates or wafers" and "wafer substrates". In a first aspect the present invention provides a sealable contamination-proof container package as defined in Claim 1 herein. EP-A-0 343 762, an application filed but not published prior to the date of filing of the present application, discloses a sealable contamination-proof container package bottom and top for storing and transporting a plurality of wafers or substrates in a wafer carrier comprising: a. a package bottom including four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positional on said vertical surface, opposing hook latches on opposing sides, opposing hand grip recesses on the opposing sides and a raised bottom surface for package stacking; and b. a package top including four sides, a continuous vertical surface for tape sealing, and surrounding the four sides, a lip positioned on said vertical surface, opposing hook catches on the opposing sides, a top surface with a raised stacking surface, and two rows of wafer support springs on two bar linkages positioned on the underside of the top surface whereby the package top and bottom halves provide that the wafer carrier mates between the package top and the package bottom with the wafers or substrates in the carrier. Significant aspects and features of the present invention include a semiconductor wafer, disk or substrate package which opens from the sides, which thereby equally provides spring pressure on the wafers. The handle is located under the lock assembly. The perimeter of the package is tapable, and further seals the locks. The locks are of such a configuration as to allow a plurality of human fingers and robotic actuators to disengage the lock. Finally, the bottom and the top of the package engage with respect to other like packages for stacking purposes. The package is also aesthetically pleasing by the formation of the surfaces of the package, and the radius geometry on top and bottom are to provide structural support. Another significant aspect and feature of the present invention is opposing upper rows of horizontally aligned wafer support articulated cantilevered horizontal arms with centering V grooves on the under side of the arced top surface which flexingly engage wafers, disks or substrates. The wafer, disk or substrate is captured in the V groove with minimal contact across the edges of the wafer, disk or substrate. Other significant aspects and features include articulated cantilevered horizontal arms with centering V grooves which provide minimized stress and optimized tension about the wafer, disk or substrate. The V grooves center about the edges of the wafers, disks or substrates. The horizontal arm with the V groove provides enhanced memory for maintaining the wafer, disk or substrate in the carrier. The V grooves are integrally supported on the articulated cantilevered horizontal arms. Further significant aspects and features include a package of see through polymer such as a polypropylene or like polymer material to ensure arm and V groove alignment with the wafers, disks or substrates. Having thus described the embodiments of the present invention, it is a principal object hereof to provide a package for transporting and storing of semiconductor wafers, disks or substrates. Objects of the present invention include a high technology state-of-the-art wafer package for storing and transporting semiconductor wafers, disks or substrates which unlocks and opens from either side. Another object of the present invention is horizontally aligned wafer support articulated cantilevered horizontal arms with centering V grooves for flex engagement of wafers, disks or substrates. A further object of the present invention is to provide articulated cantilevered horizontal arms with centering V grooves. There is now described, by way of example and with reference to the accompanying drawings, a container package (alternatively referred to as a "substrate package) according to a preferred embodiment of the present invention. In the drawings: FIG. 1 illustrates a perspective view of the package; FIG. 2 illustrates a perspective view of the wafer carrier; FIG. 3 illustrates a top view of the bottom member; FIG. 4 illustrates a bottom view of the bottom member; FIG. 5 illustrates an end view of the bottom member; FIG. 6 illustrates a bottom view of the top member; FIG. 7 illustrates a top view of the top member; FIG. 8 illustrates a cutaway exploded side view in partial cross section of the substrate package; FIG. 9 illustrates an exploded cutaway end view in cross section of the substrate package; FIG. 10 illustrates an end view of the wafer support springs; FIG. 11 illustrates a side view of the wafer support springs row; FIG. 12 illustrates a bottom view of the wafer support springs; FIG. 13 illustrates a top view of the wafer carrier; FIG. 14 illustrates a sectional profile view of the divider ribs and wafer pockets; FIG. 15 illustrates a cutaway view of the wafer carrier; FIG. 16 illustrates a cutaway side view of substrate wafers in the substrate package; FIG. 17 illustrates a cross-sectional end view of the assembled substrate package; FIG. 18 illustrates an isometric view of the articulated cantilevered horizontal arm with a centering V groove engaging a wafer, disk or substrate; FIG. 19 illustrates a top view of the wafer carrier in the bottom member; and, FIG. 20 illustrates stacked substrate packages. FIG. 1 illustrates a perspective view of a package 210, the present invention, for the storage and transportation of substrates or wafers. The package includes a bottom member 212 and a top member 214 engaged to environmentally contain and transport or store a wafer carrier 216, which is illustrated in FIG. 2. The bottom member 212 includes sides 218, 220, 222 and 224; a continuous vertical member 226 for taping, including planar surfaces 226a, 226b, 226c and 226d with rounded vertical corners therebetween; and a latch recess 228 located within the planar surface 226a and a corresponding latch recess 230 located within planar surface 226c. A handle recess 232 is set back from the side 218, and a like opposing recess 233 is set back from side 222 as illustrated in FIG. 3. A locating recess index member 234 for indexing a wafer carrier 216 is set back from side 220, and includes wall members 220a, 220b, wall member 234a between wall members 220a and 220b and a horizontal planar member 234b intersecting wall members 220a, 220b and 234a. A continuous lip member 236, as also illustrated in FIG. 3, locates at the upper portion of the continuous vertical member 226 to mate with a corresponding lip in the top member 214 as later described in detail. Upper planar bottom surfaces 239 and 241, with a cylindrical section member 240 including ends 240a and 240b disposed thereupon and extending downwardly from and between the upper planar surfaces 239 and 241, locates between the lower portions of the sides 220 and 224 as illustrated in FIG. 3. Channels 242 and 244 locate parallel to sides 218 and 220 along the lower planar bottom 238 and the long edges of the cylindrical section member 240 for accommodating the wafer carrier 216 as illustrated in FIG. 3. Stacking corner recess members 245a-245d position at the corresponding lower corner portions of the intersections of the sides 218-224 and the planar bottom 238. The top member 214 includes sides 246-252; a continuous vertical lip member 254 extending downwardly from the sides 246-252 for taping, including planar surfaces 254a-254d with rounded vertical corners therebetween; channels 256 and 258 parallel to sides 246 and 250 at the upper portion of the sides 246 and 250, respectively, for engagement of the upper regions of the wafer carrier 216; planar members 253 and 255 adjacent to channels 256 and 258 and along the upper portions of the sides 246 and 250; stacking feet 260a-260d extending from and above the respective intersections of sides 246-252 and at respective opposing ends of the channels 256 and 258 as illustrated; an arced cylindrical section 264 extending between the channels 256 and 258 and the upper portions of the sides 248 and 252; and, cylindrical section ends 264a and 264b extending downwardly from the ends of the arced cylindrical section 264. Horizontally aligned planar surfaces 262 and 263 extend horizontally from the upper portions of the sides 248 and 252 and intersect the cylindrical section ends 264a and 264b. Rows of horizontally aligned wafer support springs extend downwardly from the underside of the planar surface to gently secure wafer substrates in the wafer carrier 216, as later described in detail in the figures, particularly in FIGS. 10-12. The continuous vertical lip member 254 fits over the continuous lip member 236 of the bottom member 212 to seal the substrate package 210. The top member 214 includes catch members 270 and 272 as illustrated in FIGS. 6 and 9, and the bottom member 212 includes latch members 274 and 276 each adjacent respectively to the handle recesses 232 and 233 for secure engagement of the top member 214 to the bottom member 212 containing the wafer carrier 216. FIG. 2 illustrates a perspective view of the wafer carrier 216 including opposing sides 280 and 282; a support bar 284 extending vertically and outwardly along an end of side 280; a support bar 286 extending vertically and outwardly along an end of side 282; a configured "H" shaped member 288 and segmented rod half 290 between the support bars 284 and 286 and set back from the support bars 284 and 286; a vertically oriented planar member 292 between the rear portions and flush to the rear portions of sides 280 and 282; bottom edges 294 and 296 along the bottom portion of sides 280 and 282, respectively; a planar top edge 298 along the upper edge of side 280 and between the upper portion support bar 284 and the upper and outer portion of the planar member 292; and a like planar top edge 300 extending along the upper edge of side 282 between the upper portion of support bar 286 and the upper and outer portion of the planar member 292. Ribs 302a-302n and alternating wafer pockets 304a-304n extend vertically along the distance between the planar top edge 298 and the lower portion of side 280 near which point the ribs 302a-302n and the alternating wafer pockets 304a-304n assume a curved cross section to intersect with the lower portion of side 280. In a similar fashion, ribs 306a-306n and alternating wafer pockets 308a-308n extend vertically for the majority of the distance between the planar top edge 300 and the lower portion of side 282 near which point the ribs 302a-302n and the alternating wafer pockets 304a-304n assume a curved cross section to intersect with the lower portion of side 282. Rounded wafer pocket backs 309a-309n and 319a-319n provide for dimensional stability and extend similarly to assume a curved cross section to intersect with the lower portion of side 282, as also illustrated in FIGS. 13 and 14. The planar top edges 298 and 300 include vertically oriented positioning holes and slots 310a-310b and 311a-311b, respectively, near their outer extremities. The wafer carrier 216 also includes robotic handler slots 312 and 314 positioned in the support bars 284 and 286, respectively, and robotic handler slots 316 and 318 positioned at the rear of the wafer carrier 216 adjacent to the top edge of the planar member 292 and the upper portions of sides 280 and 282. Robotic tab members 321a and 321b position on the upper portion of the sides 280 and 282. FIG. 3 illustrates a top view of the bottom member 212 where all numerals correspond to those elements previously described. The latch recess 228 includes a latch member 274 with an angulated central support member 320a and angulated support members 320b and 320c extending from the mid-portion of the latch member 274 angularly to the lower inner most area of the latch recess 228 as also illustrated in FIG. 1. The latch member 274 is divided into latch surfaces 274a and 274b by the angulated support member 320a. Corresponding angulated latch support members 322a-322c extend in a similar fashion from beneath the latch member 276 into the latch recess 230 located above the handle recess 233. The latch member 276 is divided into latch surfaces 276a and 276b by the angulated support member 322a. The handle recess 232 is illustrated including vertically aligned opposing walls 324 and 326, vertical wall 328 between walls 324 and 326, and an oblique wall 330 slanting toward the center of the bottom member 212 and intersecting walls 324-328. Handle recess 233 includes similarly oriented and aligned opposing walls 332 and 334, wall 336 between walls 332 and 334, and oblique wall 338 interesting walls 332-336. Locator ribs 340 and 342 extend respectively between walls 328 and 336 and the inner side members of channels 242 and 246 and aid in structural support. FIG. 4 illustrates a bottom view of the bottom member 212 where all numerals correspond to those elements previously described. FIG. 5 illustrates an end view of the bottom member 212 where all numerals correspond to those elements previously described. Illustrated in particular is the locating recess index member 234 in side 220. The profile of the continuous lip member 236 is illustrated as 236a and 236b, where the continuous lip member 236 passes through the areas adjacent to the latch members 274 and 276, respectively. Lips 236a and 236b seal against the horizontal undersides of the continuous planar rim 259 on the package top as illustrated in FIG. 17. FIG. 6 illustrates a bottom view of the top member 214 where all numerals correspond to those elements previously described. Rows of flexible wafer support springs 350 and 352 (also referred to herein as articulated cantilevered horizontal arms) extend horizontally from the small radiused surfaces 351 and 353 which are transitions between the arced cylindrical section 264 and the channels 256 and 258, as also illustrated in Fig. 9, to gently secure wafer substrates carried in the wafer carrier 216. The flexible wafer support spring rows 350 and 352 include a plurality of wafer support spring arms (articulated cantilevered horizontal arms) 350a - 350n and 352a - 352n, respectively, and are illustrated and described further in FIGS. 10, 11 and 12. Catch members 270 and 272 position on the planar surfaces 254a and 254c, respectively. Catch member 270 includes ramped catches 270a and 270b, and catch member 272 includes ramped catches 272a and 272b. The catch members 270 and 272 of the top member 214 engage the latch members 274 and 276 of the bottom member 212 as illustrated in FIG. 7, Strengthener struts 276a - 276d are vertically aligned on the inner surface of walls 248 and 252. FIG. 7 illustrates a top view of the top member 214 where all numerals correspond to those elements previously described. FIG. 8 illustrates a cutaway exploded side view in partial cross section of the substrate package 210 prior to engagement where all numerals correspond to those elements previously described. FIG. 9 illustrates a cutaway exploded end view in partial cross section of the substrate package 210 prior to engagement where all numerals correspond to those elements previously described. The bottom member 212 is a cross section taken along line 28-28 of FIG. 3. FIG. 10 illustrates an end view along line 29-29 of FIG. 9 of the wafer support springs 352a-352n in the wafer support spring row 352 where the spring tooth 352a is described in detail. The flexible wafer support spring 352a extends horizontally from the small radius surface 356 as illustrated in FIG. 12. The flexible wafer support spring 352a includes ramped angulated walls 358 and 360. A "V" groove 362 extends between the ramped angulated walls 358 and 360 along the underside of the flexible spring tooth 352a as also illustrated in FIG. 11. The flexible wafer support springs 352a-352n are pliable, and have predetermined flexibility to engage the circumferential edges of wafer substrates in the "V" groove 362 between ramped angulated wall members 358 and 360 contained in the substrate package 210. The wafer support springs make contact with the wafer or substrate and flex the wafer support springs. FIG. 11 illustrates a side view of the wafer support spring row 352 of FIG. 10 along line 30-30 of FIG. 10 where all numerals correspond to those elements previously described. FIG. 12 illustrates a bottom view of the wafer support spring row 352 of FIG. 11 taken along line 31-31 of FIG. 10. FIG. 13 illustrates a top view of the wafer carrier 216 where all numerals correspond to those elements previously described. FIG. 14 illustrates a sectional view of the divider ribs including tooth 306n and wafer slot 308n taken along line 33-33 of FIG. 13. The tip of the rib 302n, as well as the wafer slot 308n, is smooth and rounded. FIG. 15 illustrates a cutaway side view of the wafer carrier 216 where all numerals correspond to those elements previously described. MODE OF OPERATION OF THE EMBODIMENT FIGS. 16 and 17 best illustrate the mode of operation. FIG. 16 illustrates a cutaway side view of substrates or wafers 370a-370n engaged in the package 210 where all numerals correspond to those elements previously described. The top member 214 and the bottom member 212 are illustrated in full cross section. The wafer carrier 216 is cutaway for view of the latch member 276 above the oblique wall 338. The latch recess 230 seals against the continuous vertical lip member 254. The robotic wafer carrier can be for shipping and storage, and/or processing, and can be of a suitable polymer such as polyethylene, Teflon, or other like materials. FIG. 17 illustrates the cross section of the top and bottom members 214 and 212, respectively, engaged with one another over the substrates or wafers 370a-370n in the wafer carrier 216 where all numerals correspond to those elements previously described. The catch members 270 and 272 are illustrated frictionally engaging latch members 274 and 276 whereby continuous lip members 236a-236b firmly contact the continuous planar rim 259 to seal the top and bottom members 214 and 212 in the area of the catch members 270 and 272 and latch members 274 and 276. Particularly illustrated in the drawing is the interlocking and interengaging relationship of the wafer carrier 216 with respect to the top member 214 and the bottom member 212 with the substrates or wafers 370a-370n engaged between the wafer carrier 216, the top member 214 and the bottom member 212. The substrates or wafers 370a-370n are engaged between the plurality of teeth 306a-306n and opposing ribs 302a-302n which limits defined movement so that each substrate or wafer is in the center of each pair of divider teeth members. The wafer carrier 216, including the substrates or wafers 370a-370n, are first placed in the bottom member 212 so that the bottom edges 294 and 296 rest in channels 242 and 246 of the bottom member 212. The top member 214 is then positioned over the carrier containing the substrates or wafers 370a-370n. The continuous vertical lip member 254 of the top member 214 aligns over the continuous lip member 236 as also illustrated in FIG. 1. Then, the flexible wafer support springs 350a-350n and 352a-352n position tangentially in flexing engagement against the circumference of the substrates or wafers 370a-370n, and the ramped catches 270a-270b and 272a-272b partially engage against the latch members 274 and 276. The top member 214 is positioned incorporating slightly more downward pressure against the substrates or wafers 370a-370n by the plurality of wafer support springs 350a-350n and 352a-352n, which move upwardly as illustrated until the catch surfaces 274a-274b and 276a-276b fully engage the catches 270 and 272 as the top member 214 centers over the substrates or wafers 370a-370n. The upper portion of the substrates or wafers 370a-370n locate in the "V" groove 362 between the ramped angulated walls 358 and 360 to assist in uniform lateral spacing of the upper portions of the substrate wafers with respect to each other. The "V" groove 362 between the angled ends 364 and 366 assist in capture of the upper substrate or wafer circumferential surfaces. The top member 214 engages the wafer carrier 216 when the catch members 270 and 272 frictionally engage latch members 274 and 276, holding the wafer carrier 216 securely between the top and bottom members 214 and 212, respectively. More specifically, the planar members 253 and 255 contact and exert uniform downward pressure upon the planar top edges 298 and 300 of the wafer carrier 216. This exerted downward pressure is transmitted through the structure of the wafer carrier 216 to the wafer carrier bottom edges 294 and 296 which are seated in channels 242 and 244 of the bottom member 212, and is also transmitted to the channels 242 and 244 and the bottom member 212 in general. The flexible wafer support springs 350a-350n and 352a-352n gently contact the circumference of each of the substrates or wafers 370a-370n respectively in a tangential fashion to ensure seating of the substrates or wafers 370a-370n within the wafer carrier 216 and within the engaged top and bottom members 214 and 212 to minimize movement of the substrates or wafers 370a-370n. Both the wafer carrier 216 and the substrates or wafers 370a-370n are held in position by the top member 214 and the elements thereof. The spring action secures the substrates or wafers within the wafer carrier 216 and also provides an upward pressure towards the top member 214 with respect to the bottom member 212 so that when the catches and latches are disengaged from each other, the top member 214 is sprung upwardly by the action of the wafer support springs 350a - 350n and 352a - 352n against the substrates or wafers. FIG. 18 illustrates an isometric view of an articulated cantilevered horizontal arm 352a, (also referred to as like flexible wafer support spring arms 350a - 350n and 352a - 352n in spring support arm rows 350 and 352) with a centering V groove 362 engaging a wafer, disk or substrate 370a at two contact points 364 and 366. The wafer, disk or substrate 370a is supported in the V groove at each side of the V groove 362 and is centered by the action of the V groove 362 against the edges of the wafer, disk or substrate 370a. FIG. 19 shows that the wafer carrier 216 can be properly oriented and aligned in only one position with respect to the bottom member 212. The locating recess index member 234 allows only one proper orientation. The "H" shaped member 288 of the wafer carrier 216 engages over the locating recess index member 234. The vertical support bars 284 and 286 position around and about the locating recess index member 234. At the same time, planar member 292 of the wafer carrier 216 is closely juxtaposed with respect to the side 224. If the wafer carrier 216 is rotated 180° in either direction about its vertical axis, the planar member 292 of the wafer carrier 216 would have to fit in the area occupied by the locating recess index member 234 in order for the wafer carrier 216 to fit in the bottom member 212. Of course, the area of the "H" shaped member 288 below the segmented rod half 290 and between the vertical support bars 284 and 286 is accommodated by the locating recess index member 234. It is noted that the top member 214 can be placed with either of its ends adjacent to either end of the bottom member 212. The upper lips engage about the lower lips and the latches with the catches, and the interengaging relationship between the carrier, the bottom member 212 and the top member 214 about the substrates or wafers 370a-370n occurs during engagement. This interengaging relationship particularly reflects that the package is a synergistic combination which reduces and eliminates contamination of the wafers, as well as providing for storage and transportation of the substrates or wafers and providing a flush perimeter for taping of the top and bottom member 214 and 212, respectively, providing for secure shipping and storage. It is noted that the top member 214 aligns loosely with the bottom member 212 before the wafer support springs 350a-350n and 352a-352n align the substrates or wafers 370a-370n in the wafer carrier 216 on the center line of the divider ribs 302a-302n and teeth 306a-306n. It is also particularly important to note that the latches are flush, providing that the container is suitable not only of being taped, but shrink-wrapped or bagged with some suitable type of polyester, polyethylene or mylar film, further providing a non-contaminate, closed container with structural integrity. This also reduces the cost of the container and maintains structural integrity of the wafers supported therein. The wafer carrier with respect to the top member and bottom member engages with the respective components so that the substrates or wafers are in frictional engagement with the entire substrate package. FIG. 20 illustrates a side view of like substrate packages 210 stacked one upon another where all numerals correspond to those elements previously described. Like packages can be stacked by engagement of the stacking corner recess members 245a-245d of the bottom member 212 with the stacking feet 260a-260d of the top member 214 of another upper substrate package 210.

Claims: A sealable contamination-proof container package (210) for storing and transporting a plurality of wafers, disks or substrates in a wafer carrier (216), the package comprising: (a) a package bottom (212) including four sides (218, 220, 222, 224), said sides together providing a continuous vertical surface (226) for tape sealing, a lip (236) positioned on said vertical surface, opposing hook latches (274, 276) on opposing ones of said sides, opposing hand grip recesses (232, 233) on opposing ones of said sides and a raised bottom surface (240) for package stacking; and, (b) a package top (214) including four sides (246, 248, 250, 252), said sides together providing a continuous vertical surface (254) for tape sealing, a lip positioned on said vertical surface, opposing hook catches (270, 272) on opposing ones of said sides and an arced top surface (264) including raised stacking surfaces; and two opposed rows (350, 352) of articulated cantilevered horizontal arms (350a - 350n and 352a - 352n) with centering V-grooves (362), each of said rows of the articulated cantilevered horizontal arms extending horizontally from a small-radiused surface (351, 353) which is a transition between the arced top surface (264) and the associated channel (256, 258), and the articulated cantilevered horizontal arms being for flexingly engaging the wafer, disk or substrate, said two rows being positioned on the underside of the top surface at each side of said arced top, whereby together the wafer carrier mates between the package top and the package bottom when the wafers, disks or substrates are in place in the carrier. A package according to Claim 1, wherein the package top and bottom mate by means of said upper lip engaging with said lower lip, and said catches of the package top engage with said latches of the package bottom. A package according to Claim 1, wherein the package top and bottom can move in a direction coinciding to the plane of the wafers, disks or substrates with respect to positioning of said catches and latches on said package sides. A package according to Claim 1, 2 or 3, wherein said sides of the package top are plumb with the respective said sides of the package bottom, thereby providing a flush perimeter for ease of taping. A package according to any of the preceding claims, wherein the package top and package bottom are of a polypropylene material or similar material. A package according to any of the preceding claims, including means for locating the wafer carrier. A package according to any of Claims 1 to 6, which includes a wafer carrier (216). A package according to any of the preceding claims, wherein the opposed rows (350, 352) of articulated cantilevered horizontal arms (350a - 350n, 352a - 352n) gently contact the circumference of the wafers, disks or substrates (370a - 370n) in a tangential fashion to ensure seating of the wafers, disks or substrates within the wafer carrier (216) and to minimize movement therein.

Inventors: DRESSEN LARRY, GERGERSON BARRY, DRESSEN, LARRY, GERGERSON, BARRY
Applicants: EMPAK INC, EMPAK INC.
Application year: 1990
Main classification: H01L21
IPC codes: H01L21, B65D85