MICROMECHANICAL COMPRESSOR CASCADE AND METHOD OF INCREASING THE PRESSURE AT EXTREMELY LOW OPERATING PRESSURE

Abstract: The micromechanical compressor cascade comprises a plu­ rality of tandem-connected micromechanical membrane pumps (P1...Pn) with a stroke chamber volume decreasing in the flow direction of the pump medium, one or several parall­ el-connected input/output channels (D11-A...Dnm-A, D11-B...Dnm-B, C11-A...Cnm-A, C11-B...Cnm-B) on the long sides of the stroke chambers (P1-A, P1-B...Pn-A, Pn-B) for interconnecting the individual membrane pumps (Pn), as well as valves (V11-A...Vnm-A, V11-B...Vnm-B) accommodated in the input/output channels and preventing the pump medium from flowing back. By electrostatic attraction forces, the various membranes (Mn) are energized sub­ stantially synchronously to resonance oscillations of the same frequency and deflection, building up the necessary operating pressure (Δp) in all membrane pumps (Pn). The pump medium is moved from the stroke chamber (P1-B) of a membrane pump (P1) into the stroke chamber (P2-A) of smaller volume of the respective next membrane pump (P2) through the input/output channels. The substantially synchronous movement of the pump medium through all membrane pumps (Pn) of the compressor cascade leads to its compression, and the pressure at the end of the compressor cascade increases according to the reduction in volume in the stroke chambers (Pn-A, Pn-B).

Description: The invention relates to a micromechanical compressor cascade and a method of increasing the pressure at extremely low operating pressure. The micromechanical compressor cascade may be used to cool semiconductor devices and for pneumatic controls or be employed in actuators and sensors. In addition to the heat exchanger and the expansion nozzle or engine, compressors, for example, belong to the major components of a cooling system. The cooling effect is obtained by rapid expansion of the operating medium through the expansion nozzle or by slow expansion in the case of an expansion engine. A survey of different cooling systems is contained in "Cryocoolers", Part 1: Fundamentals, by G. Walker, Plenum Press; an example of a highly compact conventional cooling system, the "Small Integral Stirling Cooling Engine", being shown in Fig. 1.2 of that citation. The essential elements of a cooling system are integrated in a component measuring only a few cubic centimeters. A micromechanical cooling system is presented by W.A. Little in "Design and construction of microminiature cryogenic refrigerators", AIP Proceedings of Future Trends in Superconductive Electronics, Charlottesville, University of Virginia, 1987. In the "Joule-Thomson Minirefrigeration System", the different elements, such as heat exchanger, expansion nozzle, gas inlet/outlet regions and liquid collector, are produced micromechanically in one piece of silicon. The flow channels of the heat exchanger have a diameter of 100 µm at a total channel length of about 25 cm and must be capable of withstanding a gas pressure of about 70 bar. The temperature difference between gas inlet and expansion nozzle is limited by the high thermal conductivity of the silicon. "Sensors and Actuators", 15 (1988) 153-167, by H.T.G. van Lintel et al., describes a micropump realized by micromachining a silicon wafer of about 5 cm diameter. The micropump has a glass-silicon-glass sandwich structure comprising 1 or 2 pump chambers and 2 to 3 valves. The operating pressure is built up by applying a voltage to the piezoelectric double-layer pump membrane. The cascade effect is used by Keesom in his "Cascade Air Liquefier" (Fig. 2.7 in "Cryogenic Engineering" by Russel B. Scott, D. van Nostrand Company, Inc.) for air liquefication by four series-connected evaporator systems for liquids of progressively lower boiling points. DE 32 02 324 A1 describes a heat pump comprising a condenser consisting of several parallel-connected identical compressors, the membrane centers of which are pressed together by mechanical forces during the operating cycle, compressing gas and transferring it to heat exchangers. Compressors for cooling small components, such as microelectronic chips, must meet stringent requirements with regard to their geometric dimensions and compactness. The compressors are advantageously integrated in the chip substrate or the module. High operating pressures in micromechanical cooling systems reduce their reliability, rendering the control of the individual membrane pumps extremely elaborate. The above-described problem is solved by the features of the claims. For this purpose, the invention utilizes the higher pump efficiency obtained from the cascade effect combined with a lower power consumption obtained by tandem-connecting a plurality of micromechanical membrane pumps. The latter are arranged such that their compression effect is controllable. The arrangement and design of the membrane pumps are such that compression may be effected at a low operating pressure, that all membranes may be simultaneously energized to resonance oscillations and both stroke chambers of a membrane pump are used for the actual compression process. The compressor cascade described in the invention may be integrated in electronic components, such as semiconductor chips. It may be michromechanically produced with other components, such as heat exchanger and expansion nozzle and be integrated in a very compact miniature cooling system. The micromechanical production process of silicon technology permits a considerable miniaturization of the compressor cascade, thus affording a high complexity combined with a high pump speed. One way of carrying out the invention is described in detail below with reference to drawings which illustrate only one specific embodiment, in which Figs. 1a and 1b each show a cross-sectional view of a compressor cascade element with three membrane pumps along planes S1 and S2; Fig. 2 is a sectional plan view of a compressor cascade element with two membrane pumps, Fig. 2 ashowing the area of the A-plate, Fig. 2b the membrane and the valve plane, and Fig. 2c the area of the B-plate; Fig. 3 is a schematic of the tandem-connected membrane pumps in the compressor cascade; Fig. 4 is a miniature cooling element with the compressor cascade according to the invention and further components required for the cooling elements, Fig. 4a being a plan view and Fig. 4b being a cross-sectional view; Fig. 5 is a cooling system housing accommodating several miniature cooling elements illustrated in Fig. 4. The compressor cascade element of Figs. 1a and b consists of three tandem-connected micromechanical membrane pumps P1, P2 and P3. They belong to a compressor cascade which may comprise hundreds of such membrane pumps P1...Pn. Each membrane pump has two identically sized stroke chambers P1-A and P1-B, P2-A and P2-B, P3-A and P3-B. The stroke chambers are fabricated in two opposed plates A and B by standard etch techniques used to produce integrated circuits, such as reactive ion etching, reactive ion beam etching, isotropic etching, etc. These etch techniques are described inter alia by K. Petersen in "Techniques and Applications of Silicon Integrated Micromechanics" in RJ3047 (37942) 2/4/81. The plate material may be various conductive and semiconductive materials, such as silicon, which are micromechanically processable. The opposed stroke chambers belonging to a pump are separated from each other by a thin membrane M1, M2, M3. The individual membrane pumps are connected by input/out-put channels D21-A, D31-A, D41-A, D21-B, D31-B, C11-A, C21-A, C11-B, C21-B and C31-B containing valves V11-B, V21-A, V31-B, V11-A, V21-B. The membranes and valves may consists of a thin foil, resting on plate A or plate B, or of a foil arranged between plates A and B. The membranes and valves may be produced by using the coating, lithography and etch methods known from the production of electronic circuits, such as evaporation, different methods of chemical vapor deposition (CVD), high-resolution optical or X-ray lithography methods, as well as isotropic and anisotropic etch techniques. An electric voltage UM is applied to the membrane. Suitable foil materials are metals, such as aluminum or copper, metallically coated synthetic foils or metallically coated silicon dioxide. A process cycle for producing the membranes is described, for example, by K.E. Petersen in "IBM Technical Disclosure Bulletin", Vol. 21, No. 9, February 1979, pp. 3768-3769 for the production of electrostatically controlled micromechanical storage elements of amorphous films. The valves prevent the pump medium from flowing back and open in the flow direction of the pump medium. They may be shaped as cantilever beams which are only opened by the mechanical pressure of the pump medium, or as electrostatically controlled switches, as described by K.E. Petersen in "IEEE Transactions On Electronic Devices" 25 (1978) 215. The cantilever beams close automatically in response to the bias of their material. Fig. 2 a is a plan view of the stroke chambers P1-A and P2-A in the area of the A-plate and Fig. 2c of the stroke chambers P1-B and P2-B in the area of the B-plate of the membrane pumps P1 and P2. All stroke chambers have the same width W, but their length L1 and L2 differs. The membrane pumps are positioned such that the length and thus the volume decrease in the flow direction of the medium of the respective next membrane pump. The long sides of the stroke chambers are fitted with input/output channels D21-A to D24-A, D21-B to D24-B and C11-A to C14-A, C11-B to C14-B. With an elongated shape of the pump chambers, a plurality of input/output channels may be arranged in the long sides. This increases the channel cross-section, leading to a high throughput of the pump medium. For a special embodiment, the width W of the stroke chambers is 20 µm, the length L1 of the membrane pump P1 100 µm and the height of the membrane pumps Pn 3 µm. Fig. 2b shows a plan view of the membranes M1 and M2 and on their long sides the valves V11-A to B14-A and V11-B to V14-B of the two membrane pumps P1 and P2. Figs. 2a - c show the planes S1 and S2 of the cross-sectional views of Figs. 1a and 1b. Identical fixed potentials of opposite signs UA= +, UB= - are applied to plates A and B, whereas the sign of the potential UM= +/- applied to membranes M1...Mn changes constantly, reloading the membranes. By electrostatic attraction forces, the membranes are pulled towards plate A or B and made to oscillate. The membranes Mn behave like mechanical oscillators which oscillate substantially synchronously in the same direction of deflection at the resonance frequency defined by the width W. By the microstructures, high resonance frequencies may be obtained. The useful operating pressure Δp for the compression process is identical for all membrane pumps Pn. It is obtained from the electrostatic attraction force acting on membranes Mn and thus on the pump medium. During the time shown in Figs. 1a and b, the potential UM+ is applied to the membranes, with membranes M1, M2, M3 being deflected in the direction of the B-plate. The membrane deflections cause the pump medium in the stroke chambers of the B-plate P1-B, P2-B, P3-B of the membrane pumps P1, P2, P3 to be moved to the stroke chambers of the A-plate P2-A, P3-A, P4-A of the respective next membrane pumps P2, P3, P4, the flow pressure opening the valves V11-B, V21-B, V31-B arranged between the outlet channels C11-B, C21-B, C31-B and the inlet channels D21-A, D31-A, D41-A. Valves V11-A, V21-A, V31-A remain closed, preventing a flow back of the pump medium. This proceeds substantially synchronously in all membrane pumps Pn of the compressor cascade. The reloading of the membranes Mn produced by changing the potential of UM+ to UM- occurs at the time of maximum membrane deflection. In response, the membranes Mn are pulled towards the A-plate, deflecting in the direction of the latter. Accordingly, the pump medium in the stroke chambers of the A-plate of pumps P1, P2, P3 is moved to the stroke chambers of the B-plate of the respective next pumps P2, P3, P4. The valves V11-A, V21-A, V31-A are opened at that stage, whereas valves V11-B, V21-B, V31-B are closed. This also proceeds substantially synchronously in all membrane pumps Pn. During its movement through the various membrane pumps Pn of the compressor cascade, a gaseous or liquid pump medium is compressed as the volume of the stroke chambers Pn-A and Pn-B decreases, and the pressure in the stroke chamber rises according to the volume reduction within the compressor cascade. The volume reduction may proceed continuously or in steps, e.g. by connecting several compression zones. A possible kind of volume reduction of the stroke chambers is shown in Fig. 3 illustrating a cutaway portion of the compressor cascade. In this portion, the compression ratio totals 4 : 1, which is obtained by tandem-connecting two compression stages with one or two compression zones each having a compression ratio of 2 : 1 per compression stage. In one compression zone of the compressor portion the length L of the stroke chambers is also reduced at a 2 : 1 ratio. The pressure increase between two adjacent membrane pumps Pn and Pn+1 corresponds to the operating pressure Δp built up by the membranes Mn. The volume reduction may take place in arbitrarily small steps, so that this compression method at an extremely low operating pressure and a corresponding number of pumps Pn yields a high pressure increase at the end of the compressor cascade. The pressure difference between two opposed stroke chambers Pn-A and Pn-B is Δp during the compression process in the entire compressor cascade. Thus, the thin membranes Mn and the valves Vnm-A, Vnm-B are only subjected to the low operating pressure Δp of 0.001 bar compared with the relatively high gas pressure of about 70 bar in the above-mentioned Joule-Thomson system by W.A. Little. Figs. 4 and 5 show one of a number of conceivable applications for the compressor cascade described in the invention. Fig. 4a is a plan view of a miniature cooling element which, in addition to the compressor cascade, comprises further components, such as heat exchanger and expansion chamber. The compressor area and the heat exchanger as well as the heat exchanger and the expansion chamber are thermally insulated from each other by recesses preventing a heat transfer between those elements. Fig. 4b shows the compact design of the compressor. In four silicon wafers positioned on top of each other, three compressor planes are arranged. This allows a considerable increase in the power density of the compressor. In Fig. 5, several miniature cooling systems are installed in a cooling system housing which is thermally insulated and provided with a low-temperature heat absorber. In this particular embodiment, the cooling system housing is air-cooled. The invention is not limited to the above-described example but may be used in a multitude of miniature cooling systems, sensors, actuators and pneumatic controls.

Claims: Micromechanical compressor cascade comprising several tandem-connected micromechanical membrane pumps (P1...Pn) with a volume of the stroke chambers (P1-A, P1-B...Pn-A, Pn-B) decreasing in the flow direction of the pump medium for progressively compressing the pump medium one or several parallel-connected input/output channels (D11-A...Dnm-A, D11-B...Dnm-B, C11-A...Cnm-A, C11-B...Cnm-B) on the long sides of said stroke chambers (Pn-A, Pn-B) for inter-connecting the individual membrane pumps (Pn) valves (V11-A...Vnm-A, V11-B...Vnm-B), accommodated in said input/output channels (Dnm-A, Dnm-B, Cnm-A, Cnm-B), preventing the pump medium from flowing back. Compressor cascade as claimed in claim 1, wherein a membrane pump (P1) consists of two opposed stroke chambers (P1-A, P1-B) of the same size which are separated from each other by a thin membrane (M1). Compressor cascade as claimed in claim 1 or 2, wherein all stroke chambers (P1-A...Pn-A, P1-B...Pn-B) are simultaneously produced in two opposed plates (A, B) by a micromechanical process and are separated from each other by a thin membrane (M1...Mn). Compressor cascade as claimed in any one of the claims 1 to 3, wherein the stroke chambers (P1-A...Pn-A, P1-B...Pn-B), as the volume decreases continuously, differ only with respect to their length (L1...Ln) and are all of the same width (W). Compressor cascade as claimed in any one of the claims 1 to 4, wherein the dimensions of the stroke chambers (P1-A, P1-B) have a width (W) of 20 µm and a length (L1) of 100 µm, and the height of the membrane pump (P1) is 3 µm. Compressor cascade as claimed in any one of the claims 3 to 5, wherein the material of the plates (A, B) comprises silicon. Compressor cascade as claimed in any one of the claims 3 to 6, wherein the plates (A, B) are subjected to potentials of opposite signs (+UA, -UB), and the potential (+UM, -UM) of the membranes (M1...Mn) changes. Compressor cascade as claimed in any one of the claims 1 to 7, wherein all membranes (M1...Mn) by electrostatic attraction between membrane and plates (A, B) are synchronously energized to resonance oscillations of the same frequency and deflection, building up the necessary operating pressure (Δp). Compressor cascade as claimed in claim 8, wherein the frequency of the resonance oscillations is defined by the width (W) of the stroke chambers (P1-A...Pn-A, P1-B...Pn-B). Compressor cascade as claimed in any one of the claims 1 to 9, wherein the membranes (M1...Mn) and the valves (V11-A...Vnm-A, V11-B...Vnm-B) consist of thin foils resting on one of the plates (A, B) or of a foil positioned between the two plates (A, B). Compressor cascade as claimed in claim 10, wherein the material of the thin foil consists of metals, such as aluminum or copper, or of metallically coated synthetic foils or metallically coated silicon dioxide. Compressor cascade as claimed in any one of the claims 1 to 11, wherein the valves (V11-A...Vnm-A, V11-B... Vnm-B) are shaped as a cantilever beam opening only in response to the mechanical pressure of the pump medium. Compressor cascade as claimed in any one of the claims 1 to 12, wherein the compressor cascade comprises several identical compression zones which consist of several tandem-connected micromechanical membrane pumps (Pn) with the volume of the stroke chambers (Pn-A, Pn-B) decreasing in the flow direction of the pump medium, which are connected in fan fashion to form a compression stage comprising a number of compression zones decreasing from one compression stage to the other, the compression ratio of which makes up the total compression of the compressor cascade. Method of increasing the pressure in a pump medium at extremely low operating pressure, implemented in a compressor cascade as set forth in at least one of the claims 1 to 13, comprising the steps of building up the same operating pressure (delta p) substantially synchronously in all membrane pumps (P1 ... Pn) moving the pump medium from the stroke chamber (P1-B) of one membrane pump (P1) to the stroke chamber (P2-A) of smaller volume of the respective next membrane chamber (P2) in the flow direction of the pump medium through the input/output channels (D1m-B, D1m-A, C1m-B, C1m-A), and increasing the pressure at the end of the compressor cascade by compressing the pump medium by synchronously moving it through all membrane pumps (Pn) of the compressor cascade. Miniature cooling element comprising a compressor consisting of one or several micromechanical compressor cascades as described in any one of the preceding claims 1 to 12, a heat exchanger and an expansion chamber, wherein the compressor, the heat exchanger and the expansion chamber are thermally insulated from each other. Miniature cooling element as claimed in claim 15, wherein the compressor consists of a multilayer sandwich of silicon wafers in which several compressor cascades are positioned on top of each other.

Inventors: BLUM, ARNOLD, DIPL.-ING., PERSKE, MANFRED, SCHMIDT, MANFRED, DIPL.-PHYS.
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION
Application year: 1990
Main classification: F04B45
IPC codes: F04B45, F04B43