Silicone composition which does not cause faulty conduction at electrical contacts, and method for preventing conduction faults

Abstract: A silicone composition containing a carboxylic acid amide which develops a vapor pressure during its use in an electrical device prevents faulty conduct ion at electrical contacts which are caused by silicone vapor. Electrical devices made by bringing the vapor of the carboxylic acid in the presence of the silicone vapor exhibit extended useful lives.

Description: The present invention takes as its object the introduction of both a method and a silicone composition which, when used in the vicinity of electrical contacts in an open system or when used in sealed or semi-sealed electrical devices, electrical equipment, or electronic devices which contain electrical contacts, will not cause conduction faults at electrical contacts for long periods of time even without the removal of organosiloxane oligomer and will not cause conduction faults at electrical contacts for long periods of time even for the use of a combination of organopolysiloxane plus organosiloxane oligomer or organosilane or the use of a composition based on organosiloxane oligomer or organosilane. US-A 5 039 735 discloses room temperature vulcanizable organopolysiloxane compositions which are useful as masking material for electric or electronic parts which require dipping in a solder melt. The composition comprises a specific type of amide compound for readily releasing the composition from electric or electronic parts after having been vulcanized and dipped in a hot soldering bath. The specific amide compound used is a monocarboxylic acid amide. Moreover, it is known from US-A 4 888 374 to improve the releasing property of a silicone rubber composition which comprises an organopolysiloxane and a curing catalyst by the addition of N, N'-alkylene bisamide having not less than 10 carbon atoms. Such compositions are particularly effective for molding in a mold or covering a wire core. In EP-A 0 266 183 a method for preventing the poor conduction at electrical switch contact which is caused by organopolysiloxane gas is disclosed. For this purpose nitrogenous base gases are used which can be aliphatic amines or aromatic amines. US-A 3 799 919 discloses a silicon composition containing a diorganopolysiloxane, a crosslinking agent, an organotin compound and a nitrogen containing compound. The nitrogen containing compound is selected from various substituted and unsubstituted monocarboxylic acid amides as well as cyclic carboxylic acid amides. The compositions of US-A 3 799 919 are used as surface treating composition. The present invention relates to a silicone composition which does not cause faulty conduction at electrical contacts comprising silicone containing silicone vapor with a degree of polymerization of 2 to 25 and a carboxylic acid amide selected from dicarboxylic acid amides represented by the following general formula wherein A represents a divalent C₁ ₋ ₄ aliphatic hydrocarbon group, n = zero or 1, R¹ and R² independently represent hydrogen or C₁ to C₅ alkyl; secondary and tertiary amides as represented by the following general formulas wherein R and R¹ independently are hydrogen or C₁ to C₅ alkyl groups, the triamide of citric acid or aceto acetamide. The present invention also relates to an electrical device comprising at least one electrical contact and silicone having present silicone vapor with a degree of polymerization of 2 to 25 where said silicone vapor can come into contact with at least one of the electrical contacts and cause faulty conduction wherein the improvement comprises there being in composition with the silicone a carboxylic acid amide selected from monocarboxylic acid amides represented by the following general formula wherein R, R¹ and R² independently are hydrogen or C₁ to C₅ alkyl groups; dicarboxylic acid amides represented by the following general formula wherein A represents a divalent C₁ ₋ ₄ aliphatic hydrocarbon group, n = zero or 1, R¹ and R² independently represent hydrogen or C₁ to C₅ alkyl; secondary and tertiary amides as represented by the following general formulas wherein R and R¹ independently are hydrogen or C₁ to C₅ alkyl groups, cyclic carboxylic acid amides, the triamide of citric acid or aceto acetamide. The present invention also relates to a method for preventing conduction faults at electrical contacts which are caused by silicone vapor comprising bringing about in the silicone vapor the presence of vapor of a carboxylic acid amide during the use of an electrical device having at least one electrical contact wherein the silicone vapor is in combination with a silicone and has a degree of polymerization of 2 to 25, wherein the carboylic acid amide preferably is selected from monocarboxylic acid amides represented by the following general formula wherein R, R¹, and R² independently are hydrogen or C₁ to C₅ alkyl; dicarboxylic acid amides represented by the following general formula wherein A represents a divalent C₁ ₋ ₄ aliphatic hydrocarbon group, n = zero or 1, R¹ and R² independently represent hydrogen or C₁ to C₅ alkyl; secondary and tertiary amides as represented by the following general formulas wherein R and R¹ indepndently are hydrogen or C₁ to C₅ alkyl, cyclic carboxylic acid amides, the triamide of citric acid and aceto acetamide. Within the context of the present invention, electrical contacts comprise not only contacts which open and close an electrical circuit by contact and separation movements (e. g., contacts in relays and switches) and contacts which switch an electric circuit by a sliding motion, but also the brushes and commutators of motors in which the current-flow circuit is switched by sliding accompanying motor rotation. The electrical devices include electrical equipment and electronic devices. The silicone forming the basis for the present invention's silicone composition may be anything labeled as a silicone in the concerned art, such as organopolysiloxanes. Mixtures of two or more types of silicones may be used here, and mixtures with non-silicone components are also usable. The organopolysiloxane may be a liquid, gum, soft solid, or solid at room temperature, and its molecular structure may be straight chain, branched chain, network, or cyclic. It may or may not contain reactive groups such the vinyl group, allyl group, silanol group, alkoxy group, hydrosilyl group, or mercaptoalkyl group. It may be a homopolymer or copolymer or a block copolymer with other polymers. Monvalent hydrocarbon groups are typical examples of the organic groups in the organopolysiloxane bonded to the silicon atoms through a silicon-carbon linkage. Typical examples in this regard are methyl, ethyl, propyl, octyl, phenyl, 2-phenylpropyl, and the aforesaid vinyl and allyl groups. Silicones which consist of only organopolysiloxane are exemplified by diorganopolysiloxane oils e. g., trimethylsiloxy-terminated dimethylpolysiloxane oils, dimethylphenylsiloxy-terminated methylphenylpolysiloxane oils or dimethylphenylsiloxy-terminated dimethylsiloxane methylphenylsiloxane copolymer oils, and trimethylsiloxy-terminated dimethylsiloxane-methyloctylsiloxane copolymer oils, and trimethylsiloxy-terminated dimethylsiloxane-methylsiloxane copolymer oils. Silicones which are composed of organopolysiloxane and a non-silicone component are exemplified by silicone greases composed of diorganopolysiloxane oil and a metal soap such as a lithium soap; silicone compounds composed of diorganopolysiloxane oil and a thickener such as fumed silica, zinc oxide powder, aluminum oxide poder, boron nitride, or carbon black; thermosetting silicone rubber compositions which are composed of diorganopolysiloxane gum such as silanol-terminated dimethylpolysiloxane gum, dimethylvinylsiloxy-terminated dimethylpolysiloxane gum, dimethylvinylsiloxy-terminated dimethylsiloxane-methylphenylsiloxane copolymer gum, and dimethylvinylsiloxy-terminated dimethylsiloxane-methylvinylsiloxane copolymer gum, reinforcing filler such as fumed silica or precipitated silica, and organoperoxide; low temperature-curing silicone gel compositions composed of vinyl-containing diorganopolysiloxane such as dimethylvinylsiloxy-terminated dimethylpolysiloxane, organohydrogenpolysiloxane, and platinum catalyst; low temperature-curing silicone rubber compositions composed of vinyl-containing diorganopolysiloxane, organohydrogenpolysiloxane, platinum-type catalyst, and optional reinforcing filler; thermosetting silicone resin compositions composed of silanol-containing organopolysiloxane resin and a condensation reaction catalyst such as a heavy metal carboxylate; low temperature-curing silicone resin compositions composed of vinyl-containing organopolysiloxane resin, organohydrogenpolysiloxane, and platinum-type catalyst; and ultraviolet-curing organopolysiloxane compositions composed of vinyl-containing organopolysiloxane, organohydrogenpolysiloxane or mercaptoalkyl-containing organopolysiloxane, and sensitizer. Silicones composed of organopolysiloxane, organosilane, and a non-silicone component are exemplified by room temperature-curable silicone rubber compositions composed of silanol-terminated diorganopolysiloxane, organosilane crosslinker such as methyltrimethoxysilane, methyltri(methyl ethyl ketoxime)silane, methyltriacetoxysilane, and vinyltri(isopropenoxy)silane, condensation reaction catalyst such as tetrabutyl titanate, dibutyltin dilaurate, and tin octoate, and optional filler such as fumed silica, fine quartz powder, titanium dioxide, calcium carbonate, and carbon black; and room temperature-curable silicone resin compositions composed of silanol group-containing organopolysiloxane resin, organosilane cross linker, and condensation reaction catalyst. Silicones composed of organopolysiloxane, organosiloxane oligomer, and a non-silicone component are exemplified by room temperature-curable silicone rubber compositions composed of silanol-terminated diorganopolysiloxane, the partial hydrolysis condensate of ethyl silicate, condensation reaction catalyst, and optional filler; silicones in which a low-viscosity silicone oil (e. g., trimethylsiloxy-terminated dimethylsiloxane oligomer) is added to a thermosetting silicone rubber composition or low temperature-curable silicone rubber composition as described above in order to improve the release properties; and silicones in which a low-viscosity methylvinylsiloxane oligomer is added to a thermosetting silicone rubber composition or low temperature-curable silicone rubber composition as described above for reinforcement. Silicones composed of organosilane and a non-silicone component are exemplified by coatings composed of tetraalkoxysilane, organotrialkoxysilane, and condensation reaction catalyst. Some types of the above-described diorganopolysiloxane oils, diorganopolysiloxane gums, silanol-terminated diorganopolysiloxanes, vinyl-containing diorganopolysiloxanes, and organopolysiloxane resins are generally prepared by equilibration polymerization from diorganosiloxane oligomer with degree of polymerization (DP) of 2 to 6, for example, starting from cyclic diorganosiloxane oligomers, silanol-terminated diorganosiloxane oligomers, and hexaorganodisiloxanes, using an acid or base catalyst. As a result, they obligatorily contain approximately 5 to 10 weight% organosiloxane oligomer with DP of 2 to 25. This cannot be removed to a sufficient degree even by heating in vacuo, and 1 to 5 weight% will remain. DP is the number of diorganosiloxane units bonded together to make a organopolysiloxane, and in the present invention the number of diorganosiloxane units which make up the silicone vapor. Among these organosiloxane oligomers, those lacking the silanol group, such as cyclic diorganosiloxane oligomers and triorganosiloxy-terminated diorganosiloxane oligomers, have relatively high vapor pressures. Among these molecules, not participating in the cross linking reaction, volatilize at room temperature or upon heating to cause conduction faults at electrical contacts. Moreover, in the case of the intentional addition of organosiloxane oligomer, non-crosslinking silanol-free material, such as the above-described low-viscosity silicone oils, may cause conduction faults at electrical contacts in a similar manner. Even in the case of organosiloxane oligomer or organosilane which does participate in crosslinking, depending on the components of the silicone composition faulty conduction at electrical contacts may still be caused by their volatilization when they have a relatively high vapor pressure. Silicone within the context of the present invention encompasses all silicones which contain these organosiloxane oligomers or organosilanes capable of causing conduction faults at electrical contacts, but also those silicones which, during the course of their application, can generate fault-inducing organosiloxane oligomer although it did not originally contain organosiloxane oligomer or organosilane capable, of causing conduction faults at electrical contacts. No particular restriction is placed on the type of carboxylic acid amide employed by the present method for preventing conduction faults, but examples in this regard are monoamides such as formamide, acetamide, propionamide, butyramide, benzamide, and acetoacetamide; diamides such as oxamide, malonamide, and succinamide; triamides such as the triamide of citric acid; compounds in which part or all of the nitrogen-bonded hydrogen atoms in the aforementioned carboxylic acid amides are substituted with hydrocarbon groups such as alkyl groups, cycloalkyl groups, or phenyl groups; and also secondary amides and tertiary amides. It is essential that the carboxylic acid amide used within the context of the present invention develop a vapor pressure within the temperature range of use of the electrical device including electrical equipment and electronic device. As long as it exhibits a vapor pressure, it may be a liquid or solid at room temperature, but it is preferred that it be a liquid at room temperature or that it be a solid at room temperature which becomes a liquid at elevated temperatures. Unless it has a suitably high vapor pressure, its proportion in the organosiloxane oligomer or organosilane vapor may be too small. In contrast to this, when its vapor pressure is too high, it will be discharged too rapidly from the silicone composition or cured product therefrom, and it cannot then exercise its function (preventing conduction faults at electrical contacts) for extended periods of time. It is therefore preferred that the carboxylic acid amide have a vapor pressure. of 0.001 to 100 torr at 25 degrees Centigrade. Operating on the above considerations, monocarboxylic acid amides represented by the following general formula R, R¹, and R² = hydrogen or C₁ to C₅ alkyl and dicarboxylic acid amides represented by the following general formula A = divalent C₁₋₄ aliphatic hydrocarbon group, n = zero or 1, R¹ and R² defined as above are preferred. Among these, formamide and compounds in which either R¹ or R² is alkyl are even more preferred. Secondary and tertiary amides as represented by the general formulas R and R¹ are defined as above may also be used, and cyclic carboxylic acid amides may also be employed. The silicone composition should contain approximately 0.01 to 5 weight% carboxylic acid amide referred to the silicone, and 0.05 to 2 weight% is even more suitable. These content values apply to the silicone composition after heat treatment or thermosetting when it will be used after heat treatment or thermosetting. The carboxylic acid amide should be added in larger quantities in the case of larger contents of conduction fault-generating organosiloxane oligomer or organosilane, and in smaller quantities in the case of smaller contents. Furthermore, two or more types of carboxylic acid amides may be used in combination. In addition to silicone and vapor pressure-developing carboxylic acid amide, the silicone composition of the present invention may contain non-silicone components as described above which are used in combination with silicone. It may also contain those non-silicone components typically used in silicone compositions, such as pigments, heat stabilizers, and flame retardants. In order to bring about the presence of carboxylic acid amide vapor in the silicone vapor, the carboxylic acid amide may be placed in the silicone composition, but the following methods, given as examples, are also available. IN THE CASE OF ELECTRICAL CONTACTS IN AN OPEN SYSTEM: 1. Vapor pressure-developing carboxylic acid amide is installed in the vicinity of the silicone, silicone composition, or cured product therefrom which is the source of the silicone vapor. 2. Vapor pressure-developing carboxylic acid amide is sprayed or coated on the silicone, silicone composition, or cured product therefrom which is the source of the silicone vapor. 3. Carboxylic acid amide vapor is sprayed on the silicone, silicone composition, or cured product therefrom which is the source of the silicone vapor. 4. Vapor pressure-developing carboxylic acid amide is adsorbed onto the cured silicone which is the source of the silicone vapor. IN THE CASE OF ELECTRICAL CONTACTS WITHIN A SEALED OR SEMI-SEALED ELECTRICAL DEVICE, ELECTRICAL EQUIPMENT, OR ELECTRONIC DEVICE WHICH ALSO CONTAINS A SILICONE VAPOR-GENERATING SILICONE, SILICONE COMPOSITION, OR CURED PRODUCT THEREFROM: 1. Vapor pressure-developing carboxylic acid amide is installed within the device or instrument. 2. Carboxylic acid amide vapor is fed into the device or instrument. 3. Application of methods 2. to 4. listed above for electrical contacts in an open system. The following methods may be used to install the vapor pressure-developing carboxylic acid amide: said carboxylic acid amide may be installed placed in an open container; said carboxylic acid amide may be installed adsorbed or placed in a solid, for example, sponge, rubber, textiles, felt, mineral powder; said carboxylic acid amide may be installed mixed with a fluid, for example, organic solvents, mineral oil, greases. Furthermore, the installed carboxylic acid amide may be heated. It remains unclear as to why faulty conduction at electrical contacts may be averted for long periods of time by placing carboxylic acid amide in the silicone composition or by bringing about the presence of carboxylic acid amide vapor in the silicone vapor. However, it is thought that the carboxylic acid amide gradually evaporates from the silicone composition, cured product there from, or carboxylic acid amide-containing material, that its vapor is decomposed by electrical energy at the surface of the electrical contacts, and that this decomposition product inhibits conversion of the simultaneously evaporated organosiloxane oligomer or organosilane into silica or silicon carbide. The silicone composition of the present invention is simply and easily prepared by mixing silicone with a vapor pressure-developing carboxylic acid amide; or by admixing a vapor pressure-developing carboxylic acid amide into a silicone composition already prepared from silicone and non-silicone components other than the vapor pressure-developing carboxylic acid amide; or by mixing silicone, vapor pressure-developing carboxylic acid amide, and non-silicone components other than the vapor pressure-developing carboxylic acid amide. This mixing may be carried out with moderate heating, with the addition of organic solvent, or in an emulsified state. The silicone composition of the present invention, either directly or after curing, is highly qualified for use in the vicinity of electrical contacts in open systems, and, in the form of various materials (for example, electrical-insulating materials, conductive materials, protective coatings, adhesives, sealants, lubricants), is highly qualified for use in sealed or semi-sealed electrical devices, electrical instruments, and electronic devices which contain electrical contacts. When the silicone composition of the present invention is heat treated or thermoset, conditions must be selected which minimize volatilization or scatter of the carboxylic acid amide. EXAMPLES The present invention is explained below with reference to illustrative examples. The following applies in the examples and comparison examples: parts = weight parts, the viscosity and plasticity were measured at 25 degrees Centigrade, D₄ = cyclic dimethylsiloxane tetramer, D₁₀ = cyclic dimethylsiloxane decamer, D₂₁ = cyclic dimethylsiloxane 21-mer, and D₂₄ and D₂₅ are defined similarly. A load switching test was conducted on electrical switch contacts as follows. SEALED SYSTEM LOAD SWITCHING TEST METHOD FOR ELECTRICAL SWITCH CONTACTS: A microrelay with 8 electrical switch contacts was installed in a sealable 1 L container, and a device was set up which could operate these contacts from the outside. 5 Grams silicone composition or cured product therefrom was placed in the container, the container was then sealed, and an electrical switching test was conducted under the following conditions. voltage across each contact: 24 volts DC load across each contact: 200 ohms (R load) switching frequency for each contact: 5 cycles per second (5 Hz) testing temperature: 70 degrees Centigrade The contact resistance at each contact. was measured using the voltage-drop method and was recorded with a multipen recorder. Contact failure was scored when the contact resistance value reached 10 ohms. The contact life was defined as the number of contact switching cycles until contact failure. The number of switching cycles to the first failure among the eight contacts was defined as the first failure life, and the number of switching cycles until the failure of 4 contacts was defined as the 50% failure life. SEMI-SEALED SYSTEM LOAD SWITCHING TEST METHOD FOR ELECTRICAL SWITCH CONTACTS: This test was conducted the same as for the above-described sealed system load switching test for electrical switch contacts, with the single exception that the instant test used a container having two holes (1 cm diameter) placed symmetrically at the centers of the sides in place of the sealable 1 L container used in the above-described sealed system load switching test for electrical switch contacts. EXAMPLES 1 and 2 100 Parts hydroxyl-terminated dimethylpolysiloxane (viscosity = 4,000 centistokes, D₄ to D₁₀ content = 0.76 weight%, D₄ to D₂₅ content = 2.0 weight%), 4 parts ethyl silicate, and 0.4 parts dibutyltin dilaurate were mixed to homogeneity to afford a condensation-reacting room temperature-curable silicone rubber composition. With regard to the carboxylic acid amide, compounds as reported in Table 1 were respectively added in the quantities reported in Table 1 foLlowed by mixing to homogeneity. Each obtained mixture was coated on a teflon sheet and cured by standing for 24 hours at room temperature. The obtained cured silicone rubber sheets were subjected to the sealed system load switching test on electrical switch contacts, and the results are reported in Table 1 as Examples 1 and 2. For comparison, the condensation-reacting room temperature-curable silicone rubber composition described above was cured as above without the addition of any carboxylic acid amide. This was then tested by the same load switching test on electrical switch contacts, and these results are also reported in Table 1 as Comparison Example 1. EXAMPLES 3 and 4 100 Parts hydroxyl-terminated dimethylpolysiloxane (viscosity = 12,000 centistokes, D₄ to D₁₀ content = 0.62 weight%, D₄ to D₂₄ content = 2.2 weight%), 5 parts of the methyltrioximesilane reported in Table 2, and 0.5 parts dibutyltin dilaurate catalyst were mixed to homogeneity to afford a condensation-reacting room temperature-curable silicone rubber composition. To this composition was added, with mixing to homogeneity, carboxylic acid amide as reported in Table 2 in the quantity reported in Table 2. The obtained mixtures were respectively coated on teflon sheets and cured by standing at room temperature for 100 hours. The obtained cured silicone rubber sheets were then subjected to the sealed system load switching test on electrical switch contacts, and the obtained results are reported in Table 2 as Examples 3 and 4. For comparison, the condensation-reacting room temperature-curable silicone rubber composition described above was cured as above without the addition of any carboxylic acid amide. This was then tested by the same load switching test on electrical switch contacts, and these results are also reported in Table 2 as Comparison Example 2. EXAMPLES 5 and 6 100 Parts dimethylvinylsiloxy-terminated dimethylpolysiloxane (viscosity = 2,000 centistokes, D₄ to D₁₀ content = 1.3 weight%, D₄ to D₂₅ content = 2.1 weight%), 3 parts trimethylsiloxy-terminated methylhydrogenpolysiloxane (viscosity = 10 centistokes), and 0.1 part divinyltetramethyldisiloxane were mixed by stirring, followed by the addition with mixing of an ethanolic chloroplatinic acid solution (platinum weight = 15 ppm based on the total polysiloxane quantity) as catalyst to afford an addition-reacting curable organopolysiloxane composition. To this composition was added, with mixing to homogeneity, carboxylic acid amide as reported in Table 3 in the quantity reported in Table 3. The obtained mixture was cured by maintenance at room temperature for 24 hours. The resulting cured silicone rubber was subjected to the sealed system load switching test on electrical switch contacts according to the method described above, and these results are reported in Table 3 as Examples 5 and 6. For comparison, the addition-reacting curable organopolysiloxane composition described above was cured as above without the addition of any carboxylic acid amide. The obtained cured silicone rubber was then tested by the same load switching test on electrical switch contacts, and these results are also reported in Table 3 as Comparison Example 3. EXAMPLE 7 0.5 Parts N,N-diethylformamide as the carboxylic acid amide was added with mixing to homogeneity to 100 parts trimethylsiloxy-terminated dimethylpolysiloxane oil (viscosity = 2,000 centistokes, D₄ to D₁₀ content = 1.2 weight%, D₄ to D₂₅ content = 2.4 weight%), and 5 g of the obtained mixture was placed in a laboratory dish. This was then placed and sealed in a test container and subjected to the sealed system load switching test on electrical switch contacts, the results of which are reported in Table 4 as Example 7. For comparison, the trimethylsiloxy-terminated dimethylpolysiloxane oil alone was subjected to the same load switching test on electrical switch contacts, and these results are also reported in Table 4 as Comparison Example 4. EXAMPLE 8 A cured silicone rubber sheet prepared as in Example 1 was subjected to the semi-sealed system load switching test on electrical switch contacts, and these results are reported in Table 5. For comparison, a cured silicone rubber sheet prepared as in Comparison Example 1 was subjected to the semi-sealed system load switching test on electrical switch contacts, and these results are reported in Table 5 as Comparison Example 5. EXAMPLES 9 and 10 5 Grams trimethylsiloxy-terminated dimethylpolysiloxane oil (viscosity = 2,000 centistokes, D₄ to D₁₀ content = 0.8 weight%, D₄ to D₂₅ content = 1.5 weight%) and, as the carboxylic acid amide, 5 g of a compound as reported in Table 6, were placed in separate laboratory dishes, which were then placed in a container for sealed system load switching testing. After sealing, sealed system load switching testing on electrical switch contacts was conducted, and these results are reported in Table 6. For comparison, the carboxylic acid amide was omitted and only the preceding dimethylpolysiloxane oil was placed in the sealed system load switching test container. After sealing, load switching testing on electrical switch contacts was carried out, and these results are also reported in Table 6 as Comparison Example 6. Table 6 makes it clear that, when the vapor of a carboxylic acid amide is present in the cyclic dimethylsiloxane oligomer vapor, the contact failure life is substantially extended over the situation prevailing when the electrical switch contacts are in contact with only the cyclic dimethylsiloxane oligomer vapor which has evaporated from the dimethylpolysiloxane oil. EXAMPLE 11 A butyl rubber sheet (50 x 50 x 2 mm) was immersed for one week in N-ethylacetamide heated to 50 degrees Centigrade. It was then removed and its surface was wiped clean. This sample and 5 g silicone rubber (1) (D₄ to D₁₀ content = 1.0 weight%, D₄ to D₂₅ content = 2.1 weight%) were then placed in a test container. Silicone rubber (1) was obtained by the room temperature curing of a room temperature-curable organopolysiloxane composition composed of 100 parts hydroxyl-terminated dimethylpolysiloxane (viscosity = 12,000 centistokes), 5 parts methyltri(methyl ethyl ketoxime)silane, and 0.5 parts dibutyltin dilaurate. After sealing, the sealed system load switching test on electrical switch contacts was carried out, and the obtained results are reported in Table 7 as Example 11. In the test of Comparison Example 7, 5 g of the room temperature-cured silicone rubber (1) and a butyl rubber sheet (50 x 50 x 2 mm) identical to the preceding, but not immersed in N-ethylacetamide, were sealed in the test container. The load switching test on electrical switch contacts was carried out as above, and these results are also reported in Table 7 as Comparison Example 7. Because the silicone composition of the present invention is based on silicone and contains a carboxylic acid amide which develops a vapor pressure, when used directly or after curing in the vicinity of electrical contacts in an open system or in sealed or semi-sealed electrical devices including electrical equipment and electronic devices which contain electrical contacts, it characteristically will not cause for extended periods of time those conduction faults at electrical contacts which may be caused by the vapor of contained organosilane oligomer or the vapor of contained organosilane. Moreover, the method of the present invention, in which the presence of the vapor of a carboxylic acid amide in silicone vapor is brought about, characteristically prevents silicone vapor-induced conduction faults at electrical contacts for extended periods of time.

Claims: A silicone composition which does not cause faulty conduction at electrical contacts comprising silicone containing silicone vapor with a degree of polymerization of 2 to 25 and a carboxylic acid amide selected from dicarboxylic acid amides represented by the following general formula wherein A represents a divalent C₁ ₋ ₄ aliphatic hydrocarbon group, n = zero or 1, R¹ and R² independently represent hydrogen or C₁ to C₅ alkyl; secondary and tertiary amides as represented by the following general formulas wherein R and R¹ independently are hydrogen or C₁ to C₅ alkyl groups; aceto acetamide or triamide of citric acid. An electrical device comprising at least one electrical contact and silicone having present silicone vapor with a degree of polymerization of 2 to 25 where said silicone vapor can come into contact with at least one of the electrical contacts and cause faulty conduction wherein the improvement comprises there being in composition with the silicone a carboxylic acid amide selected from monocarboxylic acid amides represented by the following general formula wherein R, R¹, and R² independently are hydrogen or C₁ to C₅ alkyl; dicarboxylic acid amides represented by the following general formula wherein A represents a divalent C₁ ₋ ₄ aliphatic hydrocarbon group, n = zero or 1, R¹ and R² independently represent hydrogen or C₁ to C₅ alkyl; secondary and tertiary amides as represented by the following general formula wherein R and R¹ independently are hydrogen or C₁ to C₅ alkyl groups; cyclic carboxylic acid amides; the triamide of citric acid or aceto acetamide, A method for preventing conduction faults at electrical contacts which are caused by silicone vapor comprising bringing about in the silicone vapor the presence of vapor of a carboxylic acid amide during the use of an electrical device having at least one electrical contact wherein the silicone vapor is in combination with a silicone and has a degree of polymerization of 2 to 25, the carboxylic acid amide developing a vapor pressure at the use temperature of the electrical contact.

Inventors: ASAI HIROYUKI, ASAI, HIROYUKI
Applicants: DOW CORNING TORAY SILICONE, DOW CORNING TORAY SILICONE COMPANY, LIMITED
Application year: 1990
Main classification: C08L83
IPC codes: H01B3, H01H1, C08L83, C08K5