A method of making a Flip Chip Solder bond structure for devices with gold based metallisation

Abstract: A flip-chip solder bonding arrangement including a semiconductor substrate (40) having thereon layers of metallisation (42, 44, 46) which have a tendency to interact with a solder material, forming on said layers of metallisation (42, 44, 46) a barrier metallisation layer (44) which is not reactive with said solder material, forming solder pads (46) on the barrier layer (44) and thereafter forming solder bonds (48) with such solder pads (46) employing said solder material.

Description: The present invention relates to a method of making a flip-chip solder bonding device. Flip-chip solder bonding is now attracting significant attention as a means of providing a very high density, area interconnections between a chip and a substrate, as a bonding technique with very attractive electrical characteristics (low inductance and capacitance) for high speed electronic devices and as a method of achieving very precise alignment and separation of components for micro-optical or related application. Examples of specific applications include solder bonded thermal detector - silicon circuit hybrids for IR detection and imaging, high 'lead' count VLSI silicon IC's, flip-chip bonded GaAs devices for microwave applications and solder bonded, V-grooved silicon micro-benches for optical fibre alignment to an integrated optics (LiNbO₃) substrate. These devices all basically involve a 'chip' component and a 'substrate' component, both of which are provided with mating arrays of solderable metallisation pads (typically using CrCuAu multilayer metallisation), and either or both of which are provided with solder bumps over the solderable pads (typically using 95P:5Sn or 63Sn:37Pb solder (wt%)) as ilustrated schematically in Figure 1. Referring to Figure 1 an integrated circuit chip 2 and a substrate component 4 (which may itself be a chip) each of which having on one surface thereof a registering array of solderable metallisation pads 6, 8, and either or both of which are provided with solder bumps 10 over the solderable pads. To bond the two components, the components 2, 4 are first aligned to within the accuracy required for the solder bumps 10 to contact the corresponding wettable pad 8 or bumps (within ∼½ a pad diameter). The assembly is then raised above the melting point of the solder involved under inert or reducing conditions. The solder wets the wettable metallisation and surface tension forces then act to pull the two components into very accurate final alignment. The bonded assembly is then cooled to form a solidly bonded hybrid device structure. The final, equilibrium bond shape and spacing of the two components is controlled by the balance of surface tension and gravitational forces at the bonding temperature, and can readily be calculated for a regular array of circular bonds, knowing the individual solder bump volumes, wettable pad sizes, chip mass and solder surface tension. For large bond arrays with circular wettable pads and for low chip masses, the final solder bond geometry is that of a double truncated sphere, making calculation particularly straight forward. The process of bonding is illustrated schematically in Figure 2. It should be noted that the solder to form the bumps may be applied over areas larger than that of the wettable metallisation, using a variety of masking techniques, to provide a controlled 'dewet' ratio and allow independent control of solder bump heights from a uniform solder coating thickness, as illustrated in Figure 3. The use of 'dewet' has previously meant that the deposited solder has been in contact with aluminium or similar non-wettable metallisation, polyimide or oxide passivation, from all of which dewetting can take place. However, recent work concentrating on the flip-chip bonding of III-V semiconductor onto ceramic substrates, using gold for low resistance microstrip tracks on device and substrate, has posed some problems. Gold is employed in such devices since it is untarnishable, uncorrodable and highly reliable and is therefore preferred since such devices are often employed for military applications where high precision is required. Attempts at reflow and bonding with solder in contact with gold would lead to metallurgical interaction (gold in contact with a 95% lead-tin solder would produce low melting point phases) producing an ill-defined solder contact area and a decrease in the volume of solder forming the truncated sphere, resulting in a disastrous loss of control of bump height. Metallurgical interaction would also bring about a change in track geometry and the potential for formation of gold-tin intermetallics, lower melting point gold-lead phases and for joint embrittlement. Intersoc. conf. Thermal Phenomena in fab. and operation of elect. comp, I-therm′88, Los Angeles CA,11-13th May 1988, pgs. 67-70 describes thermal stability of ball-limited-metal (BLM) layers formed under controlled collapse solder (lead-5wt.% tin) bumps for flip-chip interconnections. All BLM layers consist of a triple-layer deposit of Cr or Ti as an adhesive, Ni, Mo, Pd, or Pt as a barrier, and Au as a surface metal. Pat.Abs.Jap,vol.4,no.44 (E-005),5/4/80 (JP-A-55152235) discloses thin film circuits in which Cr and Au are coated on an alumina substrate and an etching is provided for a desirable pattern in a reverse order to make a thin film wiring conductor. Ni is plated as a solder diffusion barrier by a resist mask on the Au. Successively, Cu and solder are in turn plated by using the mask on the Ni of the connection terminal to remove a resist. When the solder may be resolved by heating the thin film circuit, the solder remains in the connection terminal position and is not flown out on the Au. This solder connection can be established with the Au. The metal for solder diffusion barrier includes Ni, Ti, Mo, W, and Ta effective for it, and Su, Cu, Pb, Zn, Ag are used as the metal with a good solder applying property. WO-A-8701509 discloses flip chip bonding operation in which a chip is required to be accurately aligned over a pattern of electrical connector pads on a substrate body. Electrical connections between the chip and the pads on the body are formed by solder bumps which are fused to make the connections permanent. The method provides means for accurately aligning the chip by using surface tension forces which arise in the solder portions when these are fused. A solder bump having a diameter of at least 40 micrometres provides adequate force for the alignment and it allows solder bonds having a lesser diameter to be accurately aligned between two components. Pat.Abs.Jap. Vol.10, No.293 (E-443) 4/10/86 (JP-A-61111550) describes a thin film device in which a junction wiring is made of a conductive metal such as titanium or chromium which is excellent in adhesion with a insulation substrate and does not fit to soft solder. A connection wiring is made of Au or the like, a conductive metal which fits to soft solder and is resistant to corrosion. The connection wiring is provided with circular connection seats at parts corresponding to the bumps of a chip, which is mounted via bumps on these connection seats and bonded to these pieces by the fusion of the bumps on heating. According to the invention there is provided a method of making a flip-chip solder bonding device, comprising the steps of providing a III-V semiconductor substrate, forming on said substrate a metallisation layer of a metal selected from a group consisting of gold, silver and copper, forming on said metallisation layer a barrier layer of solder non-wettable metal selected from a group consisting of chromium, titanium, tungsten and titanium-tungsten, forming solder wettable pads on the barrier layer, and thereafter forming on each of said solder wettable pads a solder bump which has greater lateral dimensions than the respective solder wettable pad. Thus in a preferred arrangement layers of metallisation are formed of gold on III-V semiconductor components and a barrier layer preferably of chromium is formed on the metallisation layers. The barrier layer is arranged so that its area is larger than the intended area for solder deposition. Although the invention is principally concerned with gold, the present invention could equally well be applied to metallisation layers of silver and copper which have similar metallurgical properties to gold. The problem does not usually arise with aluminium which is normally used for metallisation layers since aluminium will naturally form a self protective oxide coating. A preferred embodiment of the invention will now be described with reference to the accompanying drawings wherein:- Figure 1 is a schematic diagram of the known flip-chip solder bonding process; Figure 2 is a schematic view illustrating how a solder bump performs a self-aligning procedure during the formation of the solder bond; Figure 3 illustrates a method by which the height of a solder bond is controlled; Figure 4 illustrates a structure in acordance with a preferred embodiment of the invention; and, Figure 5 shows a completed solder bond with two such structures as shown in Figure 4. Referring now to the drawings, figure 4 shows a preferred embodiment of the invention wherein a substrate 40 of gallium arsenide has formed thereon gold metallisation layers 42. A barrier layer 44 of solder-inert material in this instance chromium, 44 is formed on gold layer 42. A solder wettable pad 46 is formed on barrier layer 44. Solder pad 46 forms one pad of an array of pads positioned over the substrate 40, and a corresponding barrier layer portion 44 is provided, disposed beneath each pad 46. A solder bump 48 of 95% lead, 5% tin composition is formed on solder pad 46. As shown in dotted lines, solder bump 48 in its initial state overlaps the solder pad 46 in order to provide a solder bump of the required dimensions. The solder bump is shown in full lines after it has been reflowed to make a solder bond where it has roughly the shape of a sphere extending from the solder pad 46. It will be understood that the material of the barrier layer, chromium, is non-wettable and therefore permits the use of different "dewet" ratios to achieve solder bump height control. A completed solder bond is shown in figure 5 wherein the structure of figure 4 is connected via solder bump 48 to a similar structure having a ceramic substrate 50, metallisation layers 52 of gold, a barrier metal layer 54 of chromium, and a solder pad 56. A further criterion on the dimension of the barrier metallisation area is concerned with the alignment stage of flip-chip bonding process. The barrier metallisation must be of sufficient area to prevent the solder bump on one component being in contact with gold tracks on the other component. This area is thus defined by the precision of the bonding and alignment equipment employed. To be effective as a barrier layer, the material must not interact with solder, be producible in pin-hole free layers, and act as a good diffusion barrier to solder. The barrier layer must also be non-wettable to solder, so that dewetting can take place. Chromium has been found to be effective as a barrier layer. This can be evaporated or sputtered, sputtering being the preferred method as it gives better low stress cover, good topography step coverage and good adhesion. Titanium may be a suitable alternative barrier metallisation to Cr. Utilisation of barrier metal technology has meant that it has been possible to exploit flip-chip solder bonding for MMIC devices where Au is used as a track material. Working devices have been produced by flip-chip bonding a GaAs IC containing active elements, to hybrid circuits on alumina and other microwave ceramic substrates carrying interconnects and frequency selective elements.

Claims: A method of making a flip-chip solder bonding device, comprising the steps of providing a III-V semiconductor substrate (40), forming on said substrate a metallisation layer (42) of a metal selected from a group consisting of gold, silver and copper, forming on said metallisation layer a barrier layer (44) of a solder non-wettable metal selected from a group consisting of chromium, titanium, tungsten and titanium-tungsten, forming solder wettable pads (46) on the barrier layer (44), and thereafter forming on each of said solder wettable pads (46) a solder bump (48) which has greater lateral dimensions than the respective solder wettable pad (46). A method according to Claim 1, wherein a separate barrier metallisation portion of said solder non-wettable metal is provided for each solder wettable pad of an array of solder wettable pads formed on the substrate, each barrier metallisation portion being dimensioned so as to receive the solder wettable pad.

Inventors: PEDDER DAVID JOHN, PICKERING KIM LOUISE, WARNER DAVID JOHN, PEDDER, DAVID JOHN, PICKERING, KIM LOUISE, WARNER, DAVID JOHN
Applicants: MARCONI GEC LTD, GEC-MARCONI LIMITED
Application year: 1990
Main classification: H01L21
IPC codes: H01L23, B23K35, H01L21, G02B6