METHOD FOR FORMING A METAL OXIDE FILM

Abstract: This invention relates to a method for forming a metal oxide film having good characteristic properties. In the method which comprises feeding an atomized or gasified starting material to a substrate (1;16) to form a metal oxide film on the substrate (1;16), the improvement comprising a first film formation step wherein the substrate (1;16) is heated to form a first metal oxide film having a good degree of orientation of crystals and a second film formation step wherein a second metal oxide film is formed on the first metal oxide film under substrate temperature conditions different from those in the first film formation step to form a second metal oxide film having a degree of orientation of crystals in conformity with that of the first metal oxide film.

Description: This invention relates to a method for forming a metal oxide film with good characteristic properties. For the formation of metal oxide films which are used in solar cells or liquid crystal displays, c.g. a transparent conductive film formed on a substrate, there are known several methods wherein such films are formed on a heated substrate by so-called CVD methods, spray methods and vacuum deposition methods. As the transparent conductive film formed on the substrate by such methods as mentioned above, there have been widely employed thin films mainly composed of tin oxide which has good electric characteristics. This thin film has utility as a transparent electrode for electronic parts or devices. The formation method of the transparent conductive film is particularly described with respect to the case where a transparent electrode used in solar cell is formed. Initially, there is provided a soda lime glass substrate on which a film of silicon dioxide (SiO₂) has been formed on the surface. Separately, a solution of starting materials for the film is provided wherein stannic chloride (SnCl₄·5H₂O) and ammonium fluoride (NH₄F) or antimony chloride (SbCl₃) is dissolved in water used as a solvent. Also, there is provided a film formation apparatus which includes a means for keeping and heating the substrate, a means of spraying the solution, and a means for feeding the spray. The substrate is set in the film formation apparatus wherein it is heated to a temperature of about 400°C and the spray of the starting solution is released against the surface of the substrate for a given time thereby forming a film of tin oxide on the substrate surface. Thereafter, the substrate is removed from the apparatus. The substrate temperature at which the film is formed gives a great influence on the electrical and physical characteristics of the formed transparent conductive film. More particularly, when the substrate temperature is high, the specific resistance which is one of electric characteristics of the film lowers and the light transmittance which is one of physical characteristics of the film becomes better. Although a diffraction intensity of the (100) plane on the X-ray diffraction pattern chart is recognized, the crystals of the film grow in random directions. Such a transparent conductive film has a low degree of orientation of the crystals, so that the light transmitted through the film is not repeatedly reflected at the interface with a semiconductive film having the photoelectric conversion action and thus, the film becomes poor in the action of confining the light therein. Accordingly, such a transparent conductive film is not suitable for use as a transparent electrode for solar cell. On the other hand, when the substrate temperature is made low at the time of the film formation, the resultant film has a good degree of orientation of the crystals with an increasing action of confining the light in the semiconductive film. However, the specific resistance which is one of electric characteristics of the transparent conductive film increases with a lowering of light transmittance which is one of physical characteristics. When measured by means of an X-ray diffractometer, such a film has a large diffraction intensity at the (200) plane. The substrate temperature of 400°C which has been used in known film formation procedures is determined in consideration of the relation between the substrate temperature during the formation of the film and the characteristics of the formed transparent conductive film. In the prior art formation methods of metal oxide film, it has been considered necessary to carefully control the substrate temperature within a narrow range in the vicinity of 400°C and to form a metal oxide film on the substrate. The chemical vapor deposition process wherein a gasified starting material is supplied toward the substrate to form a metal oxide film also involves similar problems although a desirable range of the substrate temperature differs from that used in the afore-described methods. Even when, however, the metal oxide film is formed on the substrate while precisely controlling the substrate temperature, the optical, electric and physical characteristics of the formed metal oxide film, more or less, suffer the influences of the substrate temperature. If the thus formed metal oxide film is applied as a transparent conductive film, the specific resistance of the oxide film is usually low and has a good light transmittance, but with an attendant problem that the film formed is poor in the degree of orientation. One method for forming a metal oxide film on a vitreous substrate is described in the EP-A- o 305 928 which employs this CVD method. The approach described there does not solve the problem of the substrate temperature being too high for oriented growth of the crystals, if during deposition the electrical properties for the tin oxide layer shall be reached. It deals mainly with the problem of gaining uniform thickness of the deposited layer. It is accordingly an object of the invention to provide a method for forming a metal oxide film which overcomes the problems of the prior art. To achieve the above object, the features of the characterizing portion of the main claim are proposed. According to the method of the invention, the substrate temperature at the initial stage of the formation of the film is suppressed low, so that the crystal planes of the formed film spirally grow thereby giving a good degree of orientation. Especially, when the metal oxide film is a tin oxide film, the temperature range within which there is obtained a film with a good degree of orientation is from 350 to 450°C when a sprayed material is transferred toward the substrate and from 350 to 420°C when a gasified material is fed toward the substrate. When another film is formed on the first-mentioned film at higher temperatures, the resultant crystals are oriented according to the crystals of the lower film. This makes a textured film surface, so that transmitted light is repeatedly reflected in the semiconductive film having the action of the photoelectric conversion with an increasing action of confining the light therein. In addition, the film has a low specific resistance which is an electric characteristic and a good light transmittance as a physical characteristic. The above and other objects, features and advantages of the present invention will become more apparent from the folllowing description taken in conjunction with the accompanying drawings. Fig. 1 is a schematic illustrative view of an apparatus for carrying out the method of the invention; Fig. 2 is a schematic side view, in cross section, of another apparatus for carrying out the method of the invention, and Fig. 3 is a section taken along line A-A of Fig. 2. Preferable embodiments of the formation method of a metal oxide film according to the invention are particularly described. Example 1 A film formation apparatus using a spraying technique, which was used in this example is described with referrence to Fig. 1. This apparatus includes a film formation chamber 3 provided with a heating plate 2 for heating a substrate 1, and an atomizing unit 4 for atomizing a starting solution. The atomizing unit 4 and the film formation chamber 3 are connected through a pipe 5, and the starting solution is atomized in the atomizing unit 4 and is passed into the film formation chamber 3 wherein the atomized solution is in contact with the substrate 1 heated in the chamber 3, thereby forming a film on the substrate 1. The substrate 1 used was a soda lime glass substrate on which a silicon dioxide film had been preliminarily formed. 25 g of stannic chloride (SnCl₄·5H₂O) and 200 mol% of ammonium fluoride (NH₄F) relative to the tin atom were, respectively, weighed and dissolved in 150 ml of water, to which 10 ml of ethyl alcohol was further added, followed by agitation to obtain a starting solution. After the provision of the substrate 1 and the starting solution, the substrate 1 was placed on the heating plate 2 in the film formation chamber 3 of the film formation apparatus. The substrate 1 was heated on the plate 2 to keep the surface temperature at 400°C. On the other hand, the starting solution was placed in the spraying unit 4 wherein it was atomized and sprayed toward the substrate 1 maintained at a surface temperature of 400°C thereby forming an SnO₂ film. The SnO₂ film formed in this stage had a thickness of about 0,15 µm (1500 angstroms). Subsequently, the atomization or spraying in the atomizing unit 4 was stopped, under which the substrate was allowed to stand in the film formation chamber 3 and the temperature of the heating plate 2 was increased so that the surface temperature of the substrate was raised to 530°C and maintained at this level. In this condition, the atomized solution in the atomizing unit 4 was applied onto the substrate 1 whose surface temperature was maintained at 530°C to form a transparent conductive film. By the formation of the transparent conductive film by two stages, the total thickness of the formed film reached 0,5 µm (5000 angstroms). The specific resistance of the SnO₂ film was found to be 6 x 10⁻⁴ Ω · cm and the overall transmittance was 77%. As a result of the X-ray diffraction analysis of the film, only a diffraction peak of the (200) plane of SnO₂ was observed. Example 2 The general procedure of Example 1 was repeated except that antimony chloride (SbCl₃) used instead of NH₄F as dissolved in the starting solution, that the amount of Sb atom relative to Sn atom was 3 mol%, and that the substrate temperature at the formation of the first transparent electrode film was changed from 400°C to 420°C, thereby forming a transparent coductive film. The specific resistance of the thus formed SnO₂ film was 1 x 10⁻³ Ω · cm and the overall transmittance was 82%. As a result of the X-ray diffraction analysis of the film, only a diffraction peak of the (200) plane of SnO₂ was observed. Example 3 The general procedure of Example 1 was repeated except that the substrate temperature at the time of formation of the first transparent conductive film was 450°C in place of 400°C. As a result, the specific resistance of the SnO₂ film was 5 x 10⁻⁴Ω · cm and the overall transmittance was 78%. As a result of the X-ray diffraction analysis of the film, only a diffraction peak of the (200) plane of SnO₂ was observed. Example 4 The general procedure of Example 1 was repeated except that the substrate temperature at the time of formation of the second transparent conductive film was 480°C in place of 530°C. As a result, the specific resistance of the SnO₂ film was 7 x 10⁻⁴ Ω · cm and the overall transmittance was 77%. As a result of the X-ray diffraction analysis of the film, only a diffraction peak of the (200) plane of SnO₂ was observed. Example 5 A film formation apparatus used was one which has a tunnel furnace capable of heating and feeding a substrate. This type of film formation apparatus is described with reference to Figs.2 and 3. The apparatus has an atomizer 11 for atomizing a starting solution by means of a sprayer 12. At the upper portion of the atomizer 11 is provided a nozzle 13 for film formation through which the atomized solution is released, and the nozzle is opened at the left side of the film formation chamber 14 as viewed in Fig. 2. An exhaust duct 15 is provided at the right side of the film formation chamber 14, by which the atomized solution fed from the atomizer 11 is passed from the nozzle 13 through the film formation chamber 14 and discharged from the exhaust duct 15. As is shown in the sectional view of Fig. 3, the film formation chamber 14 is in the form of a continuous tunnel-like passage which is established by a furnace floor 17 and side walls 28, 28 to close the bottom and both sides thereof. At opposite sides of the side walls 28, 28, there are provided chin-shaped projections for holding a substrate 16 at opposite sides thereof. The held substrate 16 is used as an upper side of the film formation chamber 14 to complete the tunnel. The substrate 16 is arranged in a row and is fed at a given speed in the direction of the arrow shown in Fig. 2. On the substrate 16 are provided a soacking plate 18 and a heater 19, and the substrate 16 is heated through the soaking plate 18 by means of the heater 19. In this example, the temperature of the substrate 16 was so set as to be 450°C in the vicinity of the nozzle 13 and to be 530°C in the vicinity of the spray inlet of the exhaust duct 15. Accordingly, the temperature of the substrate 16 was 450°C at the initial stage of forming the tin oxide film. As the substrate 16 moved toward the right direction as viewed in Fig. 2, the temperature is gradually increased to a maximum level of 530°C at the last stage of film formation. The substrate 16 used was a glass substrate as used in Example 1 and an atomized solution was fed from the nozzle 13 toward the substrate 16, so that a film of tin oxide was formed on the surface of the substate 16. The thickness of the thus formed film was about 0,5 µm (5000 angstroms) and only a diffraction peak of the (200) plane of SnO₂ was observed. The specific resistance was 5 x 10⁻⁴ Ω·cm and the overall transmittance was 78%. Example 6 A starting material was gasified using the same apparatus as set out in Example 5 and fed from the nozzle toward substrate. The substrate temperture in the vicinity of the nozzle was 380°C and the temperature in the vicinity of the exhaust port was set at 500°C. The thickness of the resultant film was about 0,5 µm (5000 angstroms), and a diffraction peak of the (200) plane of SnO₂ was observed. The specific resistance was 5 x 10⁻⁴ Ω · cm and the overall transmittance was 78%. Comparative Example The general procedure of Example 1 was repeated except that the substrate temperature was invariably maintained constant at 400°C and the transparent conductive film was formed in a thickness of 0,5 µm (5000 angstroms). The thus formed SnO₂ film had a specific resistance of 1.2 x 10⁻³ Ω· cm and an overall transmittance of 73%. As a result of the X-ray diffraction analysis, only a diffraction peak of the (200) plane of snO₂ was observed. In Examples 1 to 4, there are shown the cases where a transparent conductive film is formed at a first substrate temperature, after which the feed of the atomized solution is stopped and the substrate temperature is increased. Thereafter, the atomized solution is again fed thereby forming another transparent conductive film on the first-mentioned film. In the industrial formation of the film, it is convenient to adopt the tunnel furnace system in consideration of the productivity. In this case, it has been confirmed that the temperature of substrate is maintained at a given level to form a film, after which a film can be formed while the temperature is continuously increased. Although the difference in substrate temperature between the initial stage of film formation and the last stage of the film formation is shown in the range of 80 to 130°C, no limitation is placed on the temperature difference. For instance, when a relatively higher temperature than the temperture in the initial stage of the film formation is used in the latter stage of the film formation, the invention can be effectively carried out. In the foregoing examples, tin oxide is used as a metal oxide film. The method of the invention is readily caried out to form an In₂O₃ film from starting InCl₃·4H₂O, SnCl₄·5H₂O and H₂O and also to form a TiO₂ film from starting TiCl₄, H₂O and CH₃OH. As will be apparent from the foregoing, a metal oxide film having good characteristics and a high degree of orientation can be readily formed without severe control of film forming conditions. For instance, when tin oxide is used, the resultant film has a low specific resistance, a good light transmittance and a good degree of orientation, and can enhance the effect of confining light in the film as a result of the photoelectric conversion action. When this film is applied as a transparent electrode of solar cell, the cell characteristics are significantly improved.

Claims: A method for forming a metal oxide film by applying an atomized or gasified starting material onto a heated substrate (1; 16), comprising a first and a second film formation step, wherein in the first step a first metal oxide film is formed on the heated substrate (1; 16), and in the second film formation step material is further applied, while holding the substrate at a preselected reaction temperature, characterized by a first film formation step, wherein the first metal oxide film having a good degree of orientation of crystals is formed on a heated substrate having a temperature in the range of from 350 to 420° C, and a second film formation step, wherein the atomized or gasified starting material is further applied under higher substrate temperature conditions than that of the substrate in the first film formation step to form a second metal oxide film on the first film, so that the metal oxide film has a degree of orientation of crystal in conformity with the degree of orientation of the first film. A method according to claim 1, wherein the metal oxide film formed on the substrate (1; 16) is a transparent conductive film. A method according to claim 1, wherein the substrate is a soda lime glass substrate. A method according to claim 1, wherein the starting material for the film to be supplied to the substrate (1; 16) is an atomized solution. A method according to claim 1, wherein the starting material for the film to be supplied to the substrate is a gasified material.

Inventors: HAYASHI, YUTAKA, ELECTR. LAB, AGENCY OF IND., IIDA, HIDEYO, IMAI, MIZUHO, ITO, ATSUO, IIDA, HIDEYO, C/O TAIYO YUDEN CO., LTD., IMAI, MIZUHO, C/O TAIYO YUDEN CO., LTD., ITO, ATSUO, C/O TAIYO YUDEN CO., LTD.
Applicants: AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY, RESEARCH DEVELOPMENT CORPORATION OF JAPAN, TAIYO YUDEN CO., LTD.
Application year: 1990
Main classification: C03C17
IPC codes: C23C16, H01L31, H01B13, G02F1, C03C17, C30B29, C30B28