Method for molding and vulcanizing of rubber

Abstract: A method for molding a rubber compound concurrently with vulcanizing thereof utilizing the technique of high or very high frequency dielectric heating is disclosed. An apparatus for molding the rubber compound concurrently with vulcanizing thereof is composed of a high voltage power source (10), a vacuum tube (12) where electric waves are generated, a pair of electrode plates (14A, 14B), a molding means (16A, 16B) having low dielectric loss coefficients and sulfur corrosion resistance. The power source (10), vacuum tube (12) and electrodes plates (14A, 14B) are electrically interconnected. Molding means (16A, 16B) attached is to an inner surface of one of the electrode plates to hold the rubber compound (15). The rubber compound is formed of a rubber material and other constituents to raise the value of dielectric loss coefficient of the rubber to more than 0.20. The waves generated are determined in the HF (high-frequency) or VHF (very high-frequency) band range for effectively carrying out dielectric heating.

Description: The present invention relates to a method for molding and vulcanizing rubber. More specifically, the present invention relates to a method for vulcanizing a rubber compound concurrently with molding thereof utilizing high frequency or very high frequency dielectric heating. Generally, natural rubber (NR) and compound rubber such as styrene butadiene rubber (SBR), isobutylene isoprene rubber (IIR), nitrile butadiene rubber (NBR), isoprene rubber (IR), chloroprene rubber (CR) and etylene propylene copolymer (EPDM) have been utilized widely in various fields because of their elasticity, flexibility and gas and/or liquid sealing properties. Typically, the elastic properties of rubber are highly increased by the vulcanization technique. For vulcanization of rubber, there are various methods in the field which require heat treatment of the rubber at 120 to 200 °C for a predetermined duration. However, the heating is time consuming because the thermal conductivity of rubber is very low. Therefore, dielectric heating which maintains high energy efficiency by utilizing a material's exothermic properties has been applied to vulcanization. Dielectric heating is based on dielectric loss caused by the movement of dielectric polarized molecules in an electric field, according to Van der Waals force therebetween. When utilizing this method, dielectrics are heated uniformly and rapidly from within, generating heat by themselves. As is well known in the art, calorific power (Pv) is generated per unit volume at a unit duration is defined by the following formula; Pv = 5/9fε'tanδE² x 10-¹² (W/cm³) (1) wherein f : frequency, ε' : dielectric constant, tanδ : dielectric dissipation factor E : electric field strength. As shown in the above formula (1), the calorific power is directly proportional to the dielectric loss factor which is represented as a product of the dielectric constant and the dielectric dissipation factor, i.e., ε'tanδ, the frequency f, and the square of electric field strength. Generally, NR and rubber compounds as previously mentioned have low dielectric loss factor (ε'tanδ) as shown in the following Table 1. Dielectric loss of rubber ε' at 20 °C tanδ in 1MHz ε'tanδ NR 2.0 0.003 0.006 SBR 2.0 0.003 0.006 IIR 2.0 0.001 0.002 NBR 2.0 0.0005 0.001 IR 2.0 0.002 0.004 EPDM 2.0 0.0005 0.001 CR 2.0 0.03 0.09 It is clear from the formula (1), that f or E must be high in order to increase the temperature for heating. However, generating sufficiently high electric field strength causes frequent discharging in an apparatus and causes safety problems and also lacks operational simplicity. Taking all the above into consideration, microwave dielectric heating at ultra high frequencies (UHF) has been applied for vulcanizing rubber. Japanese Patent First Publication (Tokkai) No. 54-152082) and Japanese Patent First Publication No. 56-4925 disclose methods for vulcanizing rubber which is compounded of exothermic agents which utilize microwave dielectric heating at 2450 MHz (a UHF frequency). As previously mentioned, rubber compounds, when vulcanized have a relatively low dielectric loss factor ε'tan δ, so the frequency (2450 MHz) is determined for inducing exothermic reaction. Exothermic agents, such as carbon black is blended in the rubber in order to promote the exothermic reaction. Typical methods of microwave dielectric heating are used in both disclosures. Microwaves generated in a magnetron generator are irradiated onthe rubber compound located in an applicator through an waveguide. Thus, the rubber may be heated sufficiently for vulcanization by microwave irradiation. US-A-4 481 159, on which the preambles of claims 1 and 8 are based, discloses a method and apparatus for high-frequency dielectric heating of a rubber compound, in which either the rubber compound or the inner surface of the mold containing it is made of a material having a high dielectric loss factor. However, in the prior constructions, the rubber cannot be mold easily in the applicator during irradiation. Therefore, vulcanizing and molding must be done separately, requiring two steps. This increases manufacturing cost and complexity as well as requiring additional time for molding. It is therefore the principle object of the present invention to provide a method for molding and vulcanizing rubber utilizing dielectric heating techniques at relatively lower frequencies than the prior art without the necessity of direct irradiation. It is another object of the present invention to provide an apparatus having a simple construction for molding rubber concurrently with vulcanization. It is a further object of the present invention to provide a composition for a rubber compound which is optimally suited for exothermic reaction under conditions of dielectric heating. The invention provides a method for molding a rubber compound concurrently with vulcanizing comprising the steps of: regulating the dielectric loss factor of the rubber compound to more than 0.20 by incorporating alkylene glycol and chlorinated rubber therein; supplying said rubber compound into a molding co-operating with a pair of electrode plates holding the mold between them; and pressing said mold and performing dielectric heating at a frequency of less than 100 MHz to vulcanize the rubber compound concurrently with molding thereof to a rubber article having a desired volume and shape, wherein the said heating is directly capplied to the mold via the electrode plates. The compound may includes 5 parts by weight of alkylene glycol with 30 parts by weight of chlorinated rubber to 100 parts by weight of a rubber material. The molding means may be formed of fluorine or silicon resin. The frequency supplied to the electrode plates is preferably, at a value of 40 MHz. The invention also provides an apparatus for molding a rubber compound concurrently with vulcanizing, comprising: a high voltage power source; a vacuum tube to generate electric waves; and a pair of electrode plates; wherein the said power source, vacuum tube and electrode plates are electrically interconnected; characterised in that a mold having a low dielectric loss coefficient co-operates with the said pair of electrode plates holding the molding between them. According to the present invention, as the composition of the rubber compound is determined so as to raise the dielectric loss factor up to the value of more than 0.20, the rubber compound can be vulcanized under the frequency of less than 100 MHz. Therefore, the technique of the high frequency or very high frequency dielectric heating can be applied to the vulcanization, then the electric power can be supplied through the lead path and the electrode plates without directly irradiation, the molding means for molding the rubber can be attached directly to the plates. Thus, the molding of the rubber can be accomplished concurrently with vulcanizing thereof. When using the above apparatus, construction of the apparatus can be simplified and required step for molding the rubber can be reduced to one step, therefore labor intensive can be improved. Furthermore, time for molding can be consumed and manufacturing cost can be reduced. The present invention will be understood from the detailed description given hereinbelow and from the accompanying drawing of the preferred embodiment which is given for explanation and understanding only and is not intended to imply limitation to the invention. In the drawing; Fig. 1 is a representative circuit schematic for an apparatus for molding and vulcanizing rubber according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT For the purpose of solving the above-mentioned problems, high frequency or very high frequency dielectric heating techniques are applied for molding and vulcanizing the rubber, taking advantage of the characteristic arrangements therefore, i.e., the rubber is placed between two electrode plates and high frequency or very high frequency is applied to the rubber through lead path and the electrode plates. In this arrangement, molding means can be attached to the electrode plates directly, then molding can be accomplished concurrently with vulcanization. Fig. 1 shows a schematic circuit of an apparatus for high frequency or very high frequency dielectric heating. Referring now to Fig. 1, the numeral 10 generally designates a high voltage power source, numeral 11 designates a choke means. High or very high frequency waves are generated by a vacuum tube 12 which acts as a generator and, through a matching device 13, the waves are supplied to a pair of electrode plates 14A and 14B. A rubber compound 15 to be molded and vulcanized is located between a lower die cavity 16A and an upper die cavity 16B attached directly to inner surfaces of the electrode plates 14A and 14B, respectively. The lower and upper die cavities 16A and 16B are formed of such as silicon or fluorine resins. A concave portion is formed in the lower die cavity 16A so as to hold the rubber 15. Concurrently with carrying out high frequency dielectric heating, both die cavities 16A and 16B are brought into contact with each other and pressurized, thus press molding the rubber compound is carried out while vulcanizing. However, there is certain problem in the above method. Dielectric loss in the rubber compound to be vulcanized is relatively low, as previously shown in Table 1. Therefore, from Table 1 and the formula (1), the frequency required can not be in a range of less than 100 MHz, theoretically. The heat quantity (H) required for increasing the rubber's temperature up to ΔT °C is indicated in following formula (2); H = SCΔT (cal) (2) wherein, S: specific gravity of the rubber compound, C: specific heat thereof, An output (W) required for the high frequency power source to increase the temperature up to ΔT °C during t seconds is indicated in following formula (3): W = 4.186SCΔT/t (watt) (3) Calorific power (Pv) previously indicated in the formula (1) is also indicated in following formula (4): Pv = W/Ad (4) wherein, A: surface area of the compounded rubber d: distance between the electrodes Assuming the voltage between the electrodes is determined 5 KV/cm, the frequency required can be calculated by the following substitute formula (5), obtained from the formula (1) and (4): For example, in the case of vulcanizing a rubber compound containing NR, if the specific gravity thereof is 1.1, the specific heat is 0.45, and the dielectric loss factor ε'tanδ = 0.012, the required frequency to raise the temperature of the rubber up to 200 °C during 5 seconds can be calculated by the above formula (5) as follows; Theoretically, from the above result, in the case of an NR compound (or other rubber compound such as SBR, IIR, NBR, IR, EPDM or CR), having conventional composition, exothermic reaction can not occur by dielectric heating at a frequency of less than 100 MHz. Example 1. Various rubber compounds having conventional composition were vulcanized using high frequency dielectric heating at a frequency of 40 MHz. The vulcanizing was carried out utilizing the apparatus previously described and shown in Fig. 1. The obtained results are shown in the following Table 2. From the above, it may be clearly understood that rubber compounds having conventional composition can not be vulcanized at frequencies of 40 MHz. Theoretically, the dielectric constant, the dielectric dissipation factor, and the dielectric loss factor required to accomplish high frequency dielectric heating at a frequency less than 100 MHz are preferably determined at ε' = 4.0, tanδ = 0.05, and ε'tanδ = 0.20, respectively. In order to obtain the above values, various experiments for obtaining preferable compositions of rubber have been performed by the piesent inventors. A composition of alkylene glycol and chlorinated rubber was discovered which exhibits preferable characteristics suitable to the method of the invention. Example 2. Various rubber compounds having preferred compositions as described above were vulcanized using high frequency dielectric heating at a frequency of 40 MHz. Vulcanizing was carried out utilizing the apparatus previously described and shown in Fig. 1. The obtained results are shown in the following Table 3. It is clear that incorporation of 5 parts by weight of alkylene glycol with 30 parts by weight of chlorinated rubber to 100 parts by weight of rubber material can raise the values of ε' and tanδ. Therefore, the value of the dielectric loss factor ε'tanδ can also be increased. As shown in Table 3, when subjecting a rubber compound having composition as in Table 3 to high frequency dielectric heating, vulcanization is well accomplished utilizing the apparatus shown in Fig. 1. Thus, according to the above composition and the construction of the apparatus as described, molding of rubber can be suitably accomplished while vulcanizing. Therefore, molding and vulcanizing can be reduced to a single step, and, as the result, manufacturing costs and time can be reduced. While the present invention has been disclosed in terms of the preferred embodiment in order to facilitate better understanding thereof, it should be appreciated that the invention can be embodied in various ways without departing front the principles thereof. For example, in the apparatus of the present invention, while the molding means is formed of fluorine or silicon resins in the description, the molding means may alternatively be formed of any materials having a low dielectric loss factor, and sulfur corrosion resistance. Additionally, various compositions of the rubber compound may be utilized which enables the dielectric loss factor to reach a value of more than 0.20. Furthermore, frequencies in the range of 10 to 100 MHz, HF or VHF area can be used for molding and vulcanization even though the frequency value of 40 MHz was used in the above-mentioned example.

Claims: A method for molding a rubber compound (15) concurrently with vulcanizing characterised by the steps of: regulating the dielectric loss factor of the rubber compound to more than 0.20 by incorporating alkylene glycol and chlorinated rubber therein; supplying said rubber compound into a molding (16) co-operating with a pair of electrode plates (14) holding the mold between them; and pressing said mold and performing dielectric heating at a frequency of less than 100 MHz to vulcanize the rubber compound concurrently with molding thereof to a rubber article having a desired volume and shape, wherein the said heating is directly capplied to the mold via the electrode plates. The method for molding a rubber compound (15) as set forth in claim 1, wherein said compound includes; 5 parts by weight of alkylene gylcol with 30 parts by weight of chlorinated rubber to 100 parts by weight of a rubber material. The method for molding a rubber compound as set forth in claim 1 or claim 2, wherein said mold (16) is formed of fluorine resin. The method for molding a rubber compound as set forth in claim 1 or claim 2, wherein said mold (16) is formed of silicon resin. The method for molding a rubber compound as set forth in anyt one of claims 1 to 4, wherein said frequency supplied to said electrode plates (14) is determined at a value of 40 MHz. The method for molding a rubber compound as set forth in any one of claims 1 to 4, wherein said frequency supplied to said electrode plates (14) is determined in the HF (high-frequency) band range. The method for molding a rubber compound as set forth in any one of claims 1 to 4, wherein said frequency supplied to said electrode plates (14) is determined in the VHF (very high-frequency) band range. An apparatus for molding a rubber compound (15) concurrently with vulcanizing, comprising: a high voltage power source (10); a vacuum tube (12) to generate electric waves; and a pair of electrode plates (14); wherein the said power source, vacuum tube and electrode plates are electrically interconnected; characterised in that a mold (16) having a low dielectric loss coefficient co-operates with the said pair of electrode plates holding the molding between them. The apparatus for molding a rubber compound as set forth in claim 8, wherein said mold (16) is formed of fluorine resin. The apparatus for molding a rubber compound as set forth in claim 12, wherein said mold (16) is formed of silicon resin. The apparatus for molding a rubber compound as set forth in claim any one of claims 8 to 10, wherein said waves generated at said vacuum tube (12) are determined in a range of less than 100 MHz. The apparatus for molding a rubber compound as set forth in claim 11, wherein said waves are determined at 40 MHz. The apparatus for molding a rubber compound as set forth in claim any one of claims 8 to 10, wherein said waves are determined in the HF (high-frequency) band range. The apparatus for molding a rubber compound as set forth in claim any one of claims 8 to 10, wherein said waves are determined in the VHF (very high-frequency) band range.

Inventors: KAMEYAMA KEITARO C O KINUGAWA, WATANABE SHOZO C O KINUGAWA RU, KAMEYAMA, KEITARO C/O KINUGAWA RUBBER, WATANABE, SHOZO C/O KINUGAWA RUBBER
Applicants: KINUGAWA RUBBER IND, KINUGAWA RUBBER INDUSTRIAL CO., LTD.
Application year: 1990
Main classification: B29C35
IPC codes: B29C33, B29C35, B29C43, H05B6, B29K21, C08J3