Preparation process of polyimide

Abstract: In a process for the preparation of polyimide by reacting a diamine compound with tetracarboxylic dianhydride in a phenol based solvent, an improved process for reacting the diamine compound with tetracarboxylic dianhydride in a solution by forming separate solutions of the tetracarboxylic dianhydride and the diamine compound and mixing the solutions and/or by dissolving tetracarboxylic dianhydride in the phenol-based solvent containing an organic base.

Description: The present invention relates to a process for preparing polyimide and more particularly, relates to an improved process for preparing polyimide having good thermal stability. Polyimide obtained by the reaction of diamine compounds with tetracarboxylic acid dianhydride is excellent in mechanical strength and dimensional stability in addition to exhibiting high thermal resistance, flame retardance, electrical insulation, chemical resistance and other characteristics. Hence, polyimide has conventionally been used in many fields such as electric and electronic members, space and aeronautics parts and transportation equipment. Many preparation processes of polyimide have been investigated. For example, Japanese Patent Publication SHO 36-10999(1961) proposes a process for preparing polyimide by reacting a diamine compound with a tetracarboxylic dianhydride in an amide-based solvent to obtain a polyamic acid, the precursor of polyimide, and then carrying out chemical imidization by using imidizing agents such as acetic anhydride to prepare the polyimide having a recurring unit corresponding to the polyamic acid. The process is unfavorable from the industrial viewpoint that a long time is required for the polymerization of polyamic acid which is the precursor of polyimide and storage stability of the polyamic acid is poor. Acetic acid is formed in the imidization reaction and is difficult to remove from the desired product polyimide. When polyimide is moulded in the presence of acetic acid, problems such as foaming take place. As to a method for solving these problems, a method of preparing polyimide by reacting a diamine compound with a tetracarboxylic acid dianhydride in a phenol-based solvent such as cresol and conducting heat dehydrating reaction to obtain polyimide has been proposed in F.W. Harries et al, Applied Poly. Symposium, No. 26, p421-428(1975) and Japanese Patent Publication SHO 58-4056(1983). Such process can improve problems that occur in the process where polyamic acid is formed in the phenol based solvent and successively imidized or where polyamic acid is formed in the above amide based solvent and successively subjected to chemical imidization in acetic anhydride. The process proposed by Harris et al is to prepare a polyamic acid-cresol solution by using m-cresol as a solvent and isoquinoline as a catalyst. However, tetracarboxylic dianhydride used in the process is phenylated bisphthalic anhydride having a specific structure represented by one or other of the formulae: No example has been known disclosing the use of tetracarboxylic dianhydrides having low solubility in solvents, for example, pyromellitic dianhydride and benzophenonetetracarboxylic dianhydride which are usually used in industry. These processes also have the disadvantages that oligomers are formed by the difference of solubility in the phenol-based solvent between the diamine compound and tetracarboxylic dianhydride and contamination of oligomer impairs the thermal stability of polyimide, and that structurally modified specific tetracarboxylic dianhydride are required in order to enhance solubility in the phenol based solvent. It is therefore an object of the invention to provide a simple process for producing polyimide having excellent properties. According to the invention, in one aspect there is provided a process for preparing a polyimide by reacting a diamine compound represented by the formula: H₂N-R₁ -NH₂ in which R₁ is an aliphatic group, alicyclic group, monocyclic aromatic group, fused polycyclic aromatic group or polycyclic aromatic group which is represented by the formula: in which X₁ is a direct bond, -CH₂-, -S-,-O-,-SO₂-,-CO- Y₁ being a direct bond, -S-, -O-,-SO₂-,-CO-, with a tetracarboxylic dianhydride having the formula: in which R₂ is an aliphatic group, alicyclic group, monocyclic aromatic group, fused polycyclic aromatic group or polycyclic aromatic group which is represented by the formula: in which X₂ is a direct bond, -CH₂-, -S-, -O-, -SO₂-, -CO-, Y₂ is a direct bond, -S-, -O- -SO₂- -CO- or -CH₂-. to prepare a polyimide having a recurring unit represented by the formula: in which R₁ and R₂ are as defined above, comprising the steps of preparing separate solutions of the diamine compound and of the tetracarboxylic dianhydride in phenol-based solvents selected from phenol, m-cresol, o-cresol, p-cresol, cresylic acid, ethylphenol, isopropylphenol, tertbutylphenol, xylenol, chlorophenol, dichlorophenol, phenylphenol and mixtures thereof, mixing the resultant solutions and reacting at a temperature of from 100 to 300°C to prepare the corresponding polyimide. According to the invention in another aspect there is provided a process for preparing a polyimide having a recurring unit represented by the formula: in which R₁ and R₂ are as defined above, comprising the steps of preparing separate solutions of the diamine compound and of the tetracarboxylic dianhydride in phenol-based solvents selected from phenol, m-cresol, o-cresol, p-cresol, cresylic acid, ethylphenol, isopropylphenol, tertbutylphenol, xylenol, chlorophenol, dichlorophenol, phenylphenol and mixtures thereof, mixing the resultant solutions and reacting at a temperature of from 100 to 300°C to prepare the corresponding polyimide. by reacting a diamine compound represented by the formula: H₂N-R₁ -NH₂ in which R₁ is as defined above, with a tetracarboxylic dianhydride having the formula: in which R₂ is as defined above. the said process comprising the steps of mixing the separate solutions of the diamine and of the tetracarboxylic dianhydride, reacting the diamine compound and the tetracarboxylic dianhydride at a temperature of 100°C or less in the presence of an organic base selected from triethylamine, tributylamine, tripentylamine, N,N-dimethylaniline, N,N-diethylaniline, pyridine, α-picoline, β-picoline, γ-picoline, 2,4-lutidine, 2,6-lutidine, quinoline and isoquinoline in a phenol based solvent selected from phenol, m-cresol, o-cresol, p-cresol, cresylic acid, ethylphenol, isopropylphenol, tetbutylphenol, xylenol, chlorophenol, dichlorophenol, phenylphenol and mixtures thereof to obtain a solution of a polyamic acid represented by the formula: in which R₁ and R₂ are as defined above, and heating the polyamic acid solution to a temperature of from 100 to 300°C to prepare in solution the corresponding polyimide by removal of reaction water and thereafter separating out the polyimide so formed. Polyimide prepared according to the invention, has essentially excellent properties, and is free from problems such as poor imidization ratio resulting from its production process, contamination of oligomer components formed, and multiple-phase contamination accompanied by insufficient removal of residual solvent, and accordingly liberated from disadvantages such as a decrease in thermal resistance and deterioration of processing ability due to these problems. Thus the process of the invention provides an improved process for preparing polyimide. High thermal resistance, excellent physical properties and improved processing ability will further be required for future polyimides. The process of the invention can produce polyimide capable of meeting such requirements and utilization of the process is greatly expected. Further, the process for preparing a polyimide in the invention can be conducted in the phenol-based solvent by polymerization of a polyamic acid and successive imide-ring closure by heat. The process is of course simple and easy in workability, and can readily remove contaminants which lead to lower thermal stability of the polyimide. Consequently, the process is extremely excellent in industry and also suitable for a mass production system. Exemplary diamine compounds for use in the process of the invention include ethylenediamine, m-aminobenzylamine and p-aminobenzylamine where R₁ is an aliphatic group ; 1,4-diaminocyclohexane where R₁ is an alicyclic group ; m-phenylenediamine, o-phenylenediamine and p-phenylenediamine where R₁ is a monocyclic aromatic group ; 2,6-diaminonaphthalene where R₁ is a fused polycyclic aromatic group; 4,4'-diaminobiphenyl and 4,3'-diaminobiphenyl where R₁ is a polycyclic aromatic group connected through a direct bond ; and bis(3-aminophenyl) ether, (3-aminophenyl)(4-aminophenyl) ether, bis(4-aminophenyl) ether, bis(3-aminophenyl) sulfide, (3-aminophenyl)(4-aminophenyl) sulfide, bis(4-aminophenyl) sulfide, bis(3-aminophenyl) sulfoxide, (3-aminophenyl)(4-aminophenyl) sulfoxide, bis(4-aminophenyl) sulfoxide, bis(3-aminophenyl) sulfone, (3-aminophenyl)(4-aminophenyl) sulfone, bis(4-aminophenyl) sulfone, 3,3'-diaminobenzophenone, 3,4'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, bis [4-(3-aminophenoxy)phenyl] methane, bis [4-(4-aminophenoxy)phenyl] methane, 1,1-bis [4-(3-aminophenoxy)phenyl] ethane, 1,1-bis [4-(4-aminophenoxy)phenyl] ethane, 1,2-bis [4-(3-aminophenoxy)phenyl] ethane, 1,2-bis [4-(4-aminophenoxy)phenyl] ethane, 2,2-bis [4-(3-aminophenoxy)phenyl] propane, 2,2-bis [4-(4-aminophenoxy)phenyl] propane, 2,2-bis [4-(3-aminophenoxy)phenyl] butane, 2,2-bis [4-(4-aminophenoxy)phenyl] butane, 2,2-bis [4-(3-aminophenoxy)phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4-(4-aminophenoxy)phenyl] -1,1,1,3,3,3-hexafluoropropane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(3)-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis [4-(3-aminophenoxy)biphenyl] ketone, bis [4-(4-aminophenoxy)biphenyl] ketone, bis [4-(3-aminophenoxy)phenyl] sulfide, bis [4-(4-aminophenoxy)phenyl] sulfide, bis [4-(3-aminophenoxy)phenyl] sulfoxide, bis [4-(4-aminophenoxy)phenyl] sulfoxide, bis [4-(3-aminophenoxy)phenyl] sulfone, bis [4-(4-aminophenoxy)phenyl] sulfone, bis [4-(3-aminophenoxy)phenyl] ether, bis [4-(4-aminophenoxy)phenyl] ether, 1,4-bis [4-(3-aminophenoxy)benzoyl] benzene, 1,3-bis [4-(3-aminophenoxy)benzoyl] benzene, 4,4'-bis [3-(4-aminophenoxy)benzoyl] diphenyl ether, 4,4'-bis [3-(3-aminophenoxy)benzoyl] diphenyl ether, 4,4'-bis [4-(4-amino-α , α-dimethylbenzyl)phenoxy] benzophenone, 4,4'-bis [4-(4-amino-α , α-dimethylbenzyl)phenoxy] diphenyl sulfone, and bis [4-(4-aminophenoxy)phenyl] sulfone where R₁ is a polycyclic aromatic group connected to each other through a bridge member. Exemplary tetracarboxylic dianhydrides for use in the process of the present invention include ethylenetetracarboxylic dianhydride and butanetetracarboxylic dianhydride where R₂ is an aliphatic group; cyclopentanetetracarboxylic dianhydride and cyclohexanetetracarboxylic dianhydride where R₂ is an alicyclic group; 1,2,3,4-benzenetetracarboxylic dianhydride and pyromellitic dianhydride where R₂ is a monocyclic aromatic group; 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride and 1,2,7,8-phenanthrenetetracarboxylic dianhydride where R₂ is a fused polycyclic aromatic group; 3,3',4,4'-biphenyltetracarboxylic dianhydride and 2,2',3,3'-biphenyltetracarboxylic dianhydride where R₂ is a polycyclic aromatic group connected through a direct bond ; and 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, bis(2,3-dicarboxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl) sulfone dianhydride, bis(2,3-dicarboxyphenyl) sulfone dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 4,4'-(p-phenylenedioxy)diphthalic dianhydride and 4,4'-(m-phenylenedioxy)diphthalic dianhydride where R₂ is a polycyclic aromatic group connected through a bridge member. The organic base which can be present in the preparation of a monomer solution includes, for example, triethylamine, tributylamine, tripentylamine, N,N-dimethylaniline, N,N-diethylaniline, pyridine, α-picoline, β-picoline, γ-picoline, 2,4-lutidine, 2,6-lutidine, quinoline and isoquinoline. Pyridine and γ-picoline are preferred. In the preparation of polyimide which is suitable for use as a moulding material, for example, monoamine or dicarboxylic acid anhydride is generally added as an end capper of polymer chain end in the polymerization step or may also be present in the preparation step of a polyamic acid solution. Exemplary dicarboxylic anhydrides which can be used as an end capper of polymer chain end include phthalic anhydride, 2,3-benzophenonedicarboxylic anhydride, 3,4-benzophenonedicarboxylic anhydride, 2,3-dicarboxyphenyl phenyl ether anhydride, 3,4-dicarboxyphenyl phenyl ether anhydride, 2,3-biphenyldicarboxylic acid anhydride, 3,4-biphenyldicarboxylic anhydride, 2,3-dicarboxyphenyl phenyl sulfone anhydride, 3,4-dicarboxyphenyl phenyl sulfone anhydride, 2,3-dicarboxyphenyl phenyl sulfide anhydride, 3,4-dicarboxyphenyl phenyl sulfide anhydride, 1,2-naphthalenedicarboxylic anhydride, 2,3-naphthalenedicarboxylic anhydride, 1,8-naphthalenedicarboxylic anhydride, 1,2-anthracenedicarboxylic anhydride, 2,3-anthracenedicarboxylic anhydride and 1,9-anthracenedicarboxylic anhydride. Exemplary monoamine compounds which can be used as the end capper of polymer end include aniline, o-toluidine, m-toluidine, p-toluidine, 2,3-xylidine, 2,4-xylidine, 2,5-xylidine, 2,6-xylidine, 3,4-xylidine, 3,5-xylidine, o-chloroaniline, m-chloroaniline, p-chloroaniline, o-bromoaniline, m-bromoaniline, p-bromoaniline, o-nitroaniline, m-nitroaniline, p-nitroaniline, o-aminophenol, m-aminophenol, p-aminophenol, o-anisidine, m-anisidine, p-anisidine, o-phenetidine, m-phenetidine, p-phenetidine, o-aminobenzaldehyde, m-aminobenzaldehyde, p-aminobenzaldehyde, o-aminobenzotrifluoride, m-aminobenzotrifluoride, p-aminobenzotrifluoride, o-aminobenzonitrile, m-aminobenzonitrile, p-aminobenzonitrile, 2-aminobiphenyl, 3-aminobiphenyl, 4-aminobiphenyl, 2-aminophenyl phenyl ether, 3-aminophenyl phenyl ether, 4-aminophenyl phenyl ether, 2-aminobenzophenone, 4-aminobenzophenone, 4-aminobenzophenone, 2-aminophenyl phenyl sulfide, 3-aminophenyl phenyl sulfide, 4-aminophenyl phenyl sulfide, 2-aminophenyl phenyl sulfone, 3-aminophenyl phenyl sulfone, 4-aminophenyl phenyl sulfone, α-naphthlamine, β-naphthylamine, 1-amino-2-naphthol, 2-amino-1-naphthol, 4-amino-1-naphthol, 5-amino-1-naphthol, 5-amino-2-naphthol, 7-amino-9-naphthol, 8-amino-1-naphthol, 8-amino-2-naphthol, 1-aminoanthracene, 2-aminoanthracene and 9-aminoanthracene. The above mentioned various monomers and agents may be used in accordance the following embodiments in the process of the invention. 1/ According to a first embodiment of the present invention one dissolves the diamine compound and the tetracarboxylic dianhydride in individual phenol-based solvents and starts polymerization by mixing both solutions. In the practice of the process, the diamine compound and the tetracarboxylic dianhydride are reacted to obtain the polyimide by preparing monomer solutions containing the diamine compound and the tetracarboxylic dianhydride respectively in the individual phenol-based solvent, mixing both solutions and reacting at temperature of from 100 to 300 °C to obtain the corresponding polyimide. The concentration of the separately prepared monomer solutions will depending upon the monomer species and the kind of the phenol-based solvent, and no particular limitation is imposed on the concentration. The concentration is generally from 5 to 50 wt %, preferably from 10 to 30 wt % in view of workability. The temperature of the monomer solutions is usually 200 °C or less, preferably 100 °C or less. In preparing the monomer solution, the monomer solvent mixture may be heated in the above temperature range. The reaction temperature is from 100 to 300 °C, preferably from 150 to 250 °C. No particular restriction is placed upon the reaction pressure. Atmospheric pressure is sufficient for carrying out the reaction. The reaction time is different depending upon the type of the solvent and reaction temperature, and a time of 4 to 24 hours is usually sufficient for the reaction. 2/ According to a second embodiment of the present invention comprises, in the above process 1, one dissolves the tetracarboxylic dianhydride in a phenol-based solvent containing the organic base. In the practice of the process, the diamine compound and the tetracarboxylic dianhydride are reacted to obtain the polyimide by preparing a monomer solution obtained by dissolving the diamine compound in the phenol-based solvent and another monomer solution obtained by dissolving the tetracarboxylic dianhydride in the phenol-based solvent in the presence of the organic base, mixing both solutions and reacting at a temperature of from 100 to 300°C to obtain the corresponding polyimide. In the preparation of the monomer solution containing the tetracarboxlic dianhydride in the phenol-based solvent, the amount of the organic base which is present in the phenol-based solvent will depend upon the monomer species and the kind of the phenol-based solvent. The amount is usually from 10 to 1000 mole %, preferably from 100 to 300 mole % of the monomer. The presence of the organic base in the separately prepared solution of the diamine compound in the phenol-based solvent does not cause a problem. Further, the concentration of the monomer solutions, the mixing temperature of the monomer solutions and, the other reaction conditions can be the same as in the above process for the preparation of polyimide. 3. According to a third embodiment of the present invention one reacts the diamine compound with the tetracarboxylic dianhydride in the phenol-based solvent in the presence of the organic base. In the practice of this process, the diamine compound and the tetracarboxylic dianhydride are reacted in the presence of the organic base in the phenol-based solvent to obtain a solution of polyamic acid represented by the formula: in which R₁ and R₂ are defined above and the solution is successively heated to a temperature of from 100 to 300°C to prepare the corresponding polyimide in solution. That is, in conducting the process, the diamine compound and the tetracarboxylic dianhydride are directly added to the phenol-based solvent containing the organic base and reacted to form a solution containing the resultant polyamic acid. the solution is successively heated to a temperature of 100 to 300°C to obtain the corresponding polyimide. In preparing the polyamic acid solution by such process, the amount of the organic base which is present in the phenol-based solvent is usually from 0.1 to 10 moles, preferably from 1.0 to 3.0 moles per mole of the tetracarboxylic dianhydride. For the polyamic acid solution, the concentration of the polyamic acid is preferably from 5 to 50% by weight. The amounts of the diamine compound and the tetracarboxylic dianhydride which are added to the phenol-based solvent containing the organic base will depend upon the monomer species and the kind of the phenol-based solvent and no particular limitation is imposed upon the amount. The amount of each monomer is usually from 5 to 50 wt %, preferably from 10 to 30 wt % in view of workability. The proportion of the diamine compound to the tetracarboxylic dianhydride is in the range of from 0.8 to 1.2, preferably from 0.9 to 1.0. In the most common procedures, the organic base and the diamine compound are added to the phenol-based solvent and then the tetracarboxylic dianhydride is added by portions to the resulting mixture. The reaction temperature for preparing the polyamic acid solution is 100°C or less, preferably 60°C or less. No particular restriction is placed on the reaction pressure. The reaction can be sufficiently carried out under atmospheric pressure. Reaction time is different depending upon the monomer species, the kind of the solvent and the reaction temperature. The reaction is usually carried out for a time sufficient to complete formation of the polyamic acid. A reaction time of from 1 to 24 hours is usually satisfactory. The polyamic acid solution thus obtained is converted to the corresponding polyimide by heating to a temperature of from 100 300°C while removing the water generated by the imidizing ring-closure reaction. The reaction temperature in the imidizing ring-closure is preferably at least 150 °C. No particular limitation is put on the reaction pressure. The reaction can be satisfactorily carried out under atmospheric pressure. The reaction time will depend upon the kind of the solvent and the reaction temperature. A reaction time of from 4 to 24 hours is usually satisfactory. The present invention will hereinafter be illustrated further in detail by way of Examples and Comparative Examples. Physical properties in the Examples and Comparative Examples were measured by the following methods. (1) Inherent viscosity( η ) : 0.50 g of polyimide powder was dissolved by hearing in 100 m ℓ of a solvent mixture composed of p-chlorophenol/phenol in ratio of 9/1 by weight and the viscosity of the solution was measured at 35 °C. (2) Glass transition temperature (Tg) : Measured by DSC (Shimadzu DT-40 Series DSC-41M) Example 1 To a reaction vessel equipped with a stirrer, reflux condenser, water separator, nitrogen inlet tube and discharge port, 42.29 g (0.194 mole) of pyromellitic dianhydride, 1.78 g (0.012 mole) of phthalic anhydride, 15.8 g (0.2 mole) of pyridine and 195.6 g of m-cresol were charged. Pyromellitic dianhydride and phthalic anhydride were dissolved with stirring under nitrogen atmosphere to prepare 255.5 g of monomer solution A. To the same reaction vessel as above 29.2 g (0.1 mole) of 1,3-bis(3-aminophenoxy)benzene and 79.54 g of m-cresol were charged and heated to 50 °C with stirring under nitrogen atmosphere to dissolve 1,3-bis(3-aminophenoxy)benzene. Thus 108.8 g of monomer solution B was separately prepared. To the monomer solution B, 127.7 g of monomer solution A was added under a nitrogen atmosphere and heated to 202 °C with stirring while distilling out 3.6 cm³ of water. The reaction was further conducted at 202 °C for 4 hours. The reaction mixture was thereafter cooled to room temperature and poured into 1.5 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a light yellow polyimide powder. The polyimide powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hrs under a nitrogen atmosphere to obtain 46.92 g (98.5 % yield) of polyimide powder. The polyimide had η of 0.51 d ℓ/g, Tg of 221 °C and 1 % weight loss temperature was 521°C. Comparative Example 1 To the same reaction vessel as used in Example 1, 29.2 g (0.1 mole) of 1,3-bis(3-aminophenoxy)benzene and 177.3 g of N-methyl-2-pyrrolidone was charged and 21.15 g (0.097 mole) of pyromellitic dianhydride was added by portions with caution to prevent temperature rise of the solution. The mixture was stirred for 20 hours at room temperature to obtain a polyamic acid solution. To the polyamic acid solution, 0.888 g (0.006 mole) of phthalic anhydride was added at room temperature under a nitrogen atmosphere and further stirred for an hour. Thereafter 7.9 g (0.1 mole) of pyridine and 40.8 g (0.4 mole) of acetic anhydride were added to the solution and stirred for 10 hours at room temperature. The reaction mixture was poured into 1.5 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a light yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 46.68 g (98 % yield) of polyimide powder. The polyimide powder thus obtained had η of 0.50 d ℓ/g and Tg of 221°C. However, the 1 % weight loss temperature was 479 °C. Comparative Example 2 To the same reaction vessel as used in Example 1, 29.2 g (0.1 mole) of 1,3-bis(3-aminophenoxy)benzene, 21.15 g (0.097 mole) of pyromellitic dianhydride, 0.888 g (0.006 mole) of phthalic anhydride, 7.9 g (0.1 mole) of pyridine and 177.3 g of m-cresol were charged and heated to 202 °C with stirring under a nitrogen atmosphere while distilling out 3.6 cm³ of water. After reacting further for 4 hours at 202 °C, the reaction mixture was cooled to room temperature and poured into 1.5 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a light yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 46.97 g (98.6 % yield) of polyimide powder. The polyimide powder had η of 0.51 d ℓ/g, Tg of 221 °C and 1 % weight loss temperature of 498 °C. Example 2 To the same reaction vessel as used in Example 1, 14.92 g (0.068 mole) of pyromellitic dianhydride, 1.066 g (0.0072 mole) of phthalic anhydride, 5.70 g (0.0726 mole) of pyridine and 68.9 g of m-cresol were charged. Pyromellitic dianhydride and phthalic anhydride were dissolved with stirring under a nitrogen atmosphere to obtain 90.57 g of monomer solution C. In the next step, the same reaction vessel as above was charged with 22.1 g (0.06 mole) of 4,4'-bis(3-aminophenoxy)biphenyl and 60.0 g of m-cresol. The mixture was heated to 50 °C with stirring under nitrogen atmosphere to obtain 82.11 g of separate monomer solution D. To the monomer solution D, 75.48 g of monomer solution C was added under nitrogen atmosphere and heated to 202 °C with stirring while distilling out 2.1 cm³ of water. The reaction was further conducted at 202 °C for 4 hours. The reaction mixture was thereafter cooled to room temperature and poured into 1.5 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 32.6 g (98 % yield) of polyimide powder. The polyimide powder had η of 0.50 d ℓ/g, Tg of 252 °C and 1 % weight loss temperature of 540 °C. Example 3 To the same reaction vessel as used in Example 1, 62.15 g (0.193 mole) of 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2.79 g (0.03 mole) of γ-picoline and 310.7 g of phenol were charged and the mixture was heated to 120 °C with stirring under a nitrogen atmosphere to obtain 375.6 g of monomer solution E. In the next step, 21.2 g (0.1 mole) of 3,3'-diaminobenzophenone and 57.6 g of phenol were charged to the same reaction vessel as used in Example 1 and heated to 90 °C with stirring under a nitrogen atmosphere to obtain 78.8 g of separate monomer solution F. To the monomer solution F, 187.8 g of monomer solution E was added and heated to 182 °C with stirring while distilling out 3.6 cm³ of water. The reaction was further conducted at 182 °C for 4 hours. The reaction mixture was then cooled to 50 °C and poured into 1.5 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a light yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 47.2 g (97 % yield) of polyimide powder. The polyimide powder had η of 0.50 d ℓ/g, Tg of 239 °C and 1 % weight loss temperature of 522 °C. Results of Examples 1 to 3 and Comparative Examples 1 and 2 are summarized in Table 1. Example 4 To the same reaction vessel as used in Example 1, 29.2 g (0.1 mole) of 1,3-bis(3-aminophenoxy)benzene, 15.8 g (0.2 mole) of pyridine and 185.6 g of m-cresol were charged and 21.15 g (0.097 mole) of pyromellitic dianhydride was added by portions under a nitrogen atmosphere with caution to prevent a temperature rise of the solution above 50 °C. Stirring was continued for 4 hours and 0.888 g (0.006 mole) of phthalic anhydride was added. Thereafter stirring was further continued for an hour to obtain polyamic acid as a light yellow transparent solution. The solution was heated to 202°C while distilling out 3.6 cm³ of water. The reaction was further continued at 202 °C for 4 hours. The reaction mixture was then cooled to room temperature and poured into 1.5 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a light yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 46.92 g (98.5 % yield) of polyimide powder. Polyimide powder had η of 0.51 d ℓ/g, Tg of 221 °C and 1 % weight loss temperature in air of 523 °C. Example 5 To the same reaction vessel as used in Example 1, 22.1 g (0.06 mole) of 4,4'-bis(3-aminophenoxy)biphenyl, 9.42 g (0.12 mole) of pyridine and 128.7 g of m-cresol were charged and 12.36 g (0.0567 mole) of pyromellitic dianhydride was added by portions under a nitrogen atmosphere with caution to prevent a temperature rise of the solution above 50 °C. Stirring was continued for 4 hours and 0.977 g (6.6 × 10⁻³ mole) of phthalic anhydride was added. Thereafter stirring was further continued for an hour to obtain polyamic acid as a light yellow, transparent, viscous solution. The solution was heated to 202 °C while distilling out 2 cm³ of water. The reaction was further continued at 202 °C for 4 hours. The reaction mixture was then cooled to room temperature and poured into 1 ℓ of methyl ethyl ketone. The precipitate was filtered to obtain a yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 32.6 g (98 % yield) of polyimide powder. The polyimide powder had η of 0.50 d ℓ/g, Tg of 252 °C and 1 % weight loss temperature of 542 °C. Comparative Example 3 To the same reaction vessel as used in Example 1, 22.1 g (0.06 mole) of 4,4'-bis(3-aminophenoxy)biphenyl and 128.7 g of m-cresol were charged and 12.36 g (0.0567 mole) of pyromellitic dianhydride was added by portions with caution to prevent a temperature rise of the solution above 50 °C. The reaction was continued for 4 hours and 0.977 g (6.6 × 10⁻³ mole) of phthalic anhydride was added. The reaction mixture was stirred for an hour. The reaction mixture, however, became slurry and a transparent polyamic acid solution could not be obtained. Example 6 To the same reaction vessel as used in Example 1, 21.2 g (0.1 mole) of 3,3'-diaminobenzophenone; 9.3 g (0.1 mole) γ-picoline and 200 g of phenol were charged and 31.07 g (0.0965 mole) of 3,3',4,4'-benzophenone tetracarboxylic dianhydride was added by portions under a nitrogen atmosphere with caution to prevent a temperature rise of the solution above 50 °C. Stirring was continued for 4 hours and 1.036 g (7×10⁻³ mole) of phthalic anhydride was added. Thereafter stirring was further continued for an hour to obtain polyamic acid as a light yellow, transparent, viscous solution. The solution was heated to 150 °C while distilling out 3.5 cm³ of water. The reaction was further continued at 145 to 150°C for 4 hours. The reaction mixture was then cooled to room temperature and poured into 1.5 ℓ of methyl ethyl ketone. The percipitate was filtered to obtain yellow powder. The powder was washed with methyl ethyl ketone and dried at 200 °C for 6 hours under a nitrogen atmosphere to obtain 48.2 g (97 % yield) of polyimide powder. The polyimide powder had η of 0.50 d ℓ/g, Tg of 239 °C and 1 % weight loss temperature of 519 °C. Result of Examples 1 to 6 and Comparative Examples 1 to 2 are illustrated in Table 1. Example 7 The polyimide powder obtained in Examples 1 to 6 and Comparative Examples 1 to 2 were hot pressed at 400 °C, under pressure of 50 kg/cm² to prepare press sheets. The number of fish eyes and bubbles per 25 cm² of the press sheet was counted and illustrated in Table 2. The results of Table 2 illustrate that moulded articles prepared from the polyimide powder obtained by the invention contain small numbers of fish eyes and bubbles and have good processing ability. Polyimide powder for press sheet preparation Number per 25 cm² of press sheet Fish eyes Bubbles Example 1 3 7 Example 2 0 2 Example 3 1 5 Example 4 2 8 Example 5 0 1 Example 6 2 4 Comp. Ex. 1 11 36 Comp. Ex. 2 8 21

Claims: A process for preparing a polyimide by reacting a diamine compound represented by the formula: H₂N-R₁ -NH₂ in which R₁ is an aliphatic group, alicyclic group, monocyclic aromatic group, fused polycyclic aromatic group or polycyclic aromatic group which is represented by the formula: in which X₁ is a direct bond, -CH₂-, -S-,-O-,-SO₂-,-CO- Y₁ being a direct bond, -S-, -O-,-SO₂-,-CO-, with a tetracarboxylic dianhydride having the formula: in which R₂ is an aliphatic group, alicyclic group, monocyclic aromatic group, fused polycyclic aromatic group or polycyclic aromatic group which is represented by the formula: in which X₂ is a direct bond, -CH₂-, -S-, -O-, -SO₂-, -CO-, Y₂ is a direct bond, -S-, -O- -SO₂- -CO-or -CH₂-, to prepare a polyimide having a recurring unit represented by the formula: in which R₁ and R₂ are as defined above, comprising the steps of preparing separate solutions of the diamine compound and of the tetracarboxylic dianhydride in phenol-based solvents selected from phenol, m-cresol, o-cresol, p-cresol, cresylic acid, ethylphenol, isopropylphenol, tertbutylphenol, xylenol, chlorophenol, dichlorophenol, phenylphenol and mixtures thereof, mixing the resultant solutions and reacting at a temperature of from 100 to 300°C to prepare the corresponding polyimide. A process as claimed in Claim 1 in which the monomer solution of the tetracarboxylic dianhydride is prepared in the presence of an organic base. A process as claimed in Claim 2 in which the organic base is selected from triethylamine, tributylamine, tripentylamine, N,N-dimethylaniline, N,N-diethylaniline, pyridine, α-picoline, β-picoline, γ-picoline, 2,4-lutidine, 2,6-lutidine, quinoline and isoquinoline. A process as claimed in Claim 2 or Claim 3 in which the amount of the organic base present in the monomer solution of the tetracarboxylic dianhydride is from 0.1 to 10 moles per mole of the tetracarboxylic dianhydride. A process as claimed in any preceding claim in which each monomer solution has a concentration of from 5 to 50 % by weight of the diamine compound or the tetracarboxylic dianhydride. A process for preparing a polyimide having a recurring unit represented by the formula: in which R₁ and R₂ are as defined in claim 1, by reacting a diamine compound represented by the formula: H₂N-R₁ -NH₂ in which R₁ is as defined above, with a tetracarboxylic dianhydride having the formula: in which R₂ is as defined above, the said process comprising the steps of preparing separate solutions of the diamine compound and of the tetracarboxylic dianhydride in phenol based solvents selected from phenol, m-cresol, o-cresol, p-cresol, cresylic acid, ethylphenol, isopropylphenol, tert-butylphenol, xylenol, chlorophenol, dichlorophenol, phenylphenol and mixtures thereof, mixing the resultant solutions and reacting at a temperature of 100° C or less in the presence of an organic base to obtain a solution of a polymic acid represented by the formula: in which R₁ and R₂ are as defined above, and heating the polyamic acid solution to a temperature of from 100 to 300°C to prepare in solution the corresponding polyimide by removal of reaction water and thereafter separating out the polyimide so formed. A process as claimed in Claim 6 in which the amount of the organic base present is from 0.1 to 10 moles per mole of the tetracarboxylic dianhydride. A process as claimed in Claim 6 or Claim 7 in which the organic base is selected from triethylamine, tributylamine, tripentylamine, N,N-dimethylaniline, N,N-diethylaniline, pyridine, α-picoline, β-picoline, γ-picoline, 2,4-lutidine, 2,6-lutidine, quinoline and isoquinoline. A process as claimed in any of Claims 6 to 8 in which the solution of the polyamic acid has a concentration of the polyamic acid of from 5 to 50 % by weight. A process as claimed in any preceding claim in which the tetracarboxylic dianhydride is pyromellitic dianhydride.

Inventors: AKIHIRO YAMAGUCHI, HIDEAKI OIKAWA, MASAHIRO OHTA, SHOJI TAMAI, AKIHIRO, YAMAGUCHI, HIDEAKI, OIKAWA, MASAHIRO, OHTA, SHOJI, TAMAI
Applicants: MITSUI TOATSU CHEMICALS, MITSUI TOATSU CHEMICALS, INC.
Application year: 1990
Main classification: C08G73
IPC codes: C08G73