Semiconductor device and a method of fabricating the same

Abstract: In a semiconductor device according to the present invention, a diffusion region (5,7) on the surface of an output region 84) for a substrate electric potential and a element segregation region (6) under a field insulating layer (2) are electrically connected together, at the end portion of the field insulating layer (2) and in the diffusion region (5,7). Thus, the substrate electric potential can be easily output at the surface of the output region, even if the diffusion region (5,7) on the surface of the output region is formed shallow by a low temperature thermal treatment due to a fine designing of the semiconductor device. In the fabrication process according to the present invention, after formation, by patterning, of the protruded output region (4) of the substrate electric potential with its end portion being tapered, impurities are implanted in the tapered portion. Therefore, the diffusion region (5,7) on the surface of the output region and the element segregation region (6) under the field insulating region (2) are electrically connected together through the diffusion region (5,7) on the tapered portion, which allows easy output of the substrate electric potential from the surface of the output region (4), even if the diffusion region on the surface of the output region is formed shallow by lower temperature thermal treatment due to a fine designing of semiconductor device. The process of patterning the output region in the form of a protruded shape is also required, but the process is completed through a procedure using only one ion implantation and one low temperature thermal treatment (selective oxidation), thereby significantly simplifying the fabrication process.

Description: BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an output structure for a substrate electric potential in a semiconductor device in which an output region for the substrate electric potential is enclosed by a field insulating layer formed by LOCOS (selective oxidation), and a method of producing the output structure of the substrate electric potential. Prior Art As shown in Fig. 3, the structure of a conventional semiconductor device, in particular of an output region of the substrate electric potential, comprises, for example an element segregation region 23 selectively formed in an N-type epitaxial layer 22 formed on a P-type silicon substrate 21, a field insulating layer 24 selectively formed with LOCOS at a portion corresponding to the element segregation region 23 on the epitaxial layer 22, and a P-type impurity diffusion region 26 (exhibited in dotted line) formed on a surface of an output region 25 enclosed by the field insulating layer and passed through the epitaxial layer 22. In order to reduce the diffusion in the horizontal direction, as well as to improve the precision in the pattern consistency concerning photolithography technique or the like, and optimize the epitaxial layer (for example, optimization of concentration and thickness), in relation to the fine designing of semiconductor device, variable processes regarding semiconductor devices in particular thermal treatment for diffusion of impurities, has recently been carried out at low temperature. Such treatment at low temperature simultaneously means the reduction in the diffusion depth xj of impurities. However, since the diffusion region 26 in the output region for the substrate electric potential, shown in Fig. 3, requires diffusion into a deeper depth, a diffusion depth xj cannot be obtained even through the reduction in the thickness of the epitaxial layer 22. Accordingly, the epitaxial layer 22 cannot be passed through, as is exhibited in solid line, causing inconvenience such as difficulty in the output of the substrate electric potential. As shown in Fig. 4, there is thus considerable a method comprising preliminary forming a diffusion region (pseudo embedding region) 27 of a P-type identical to a type of an element segregation region 23, under an output region 25 for the substrate electric potential at the time of forming the element segregation region 23, and constituting a diffusion region 26 and the above-mentioned diffusion region 27 so that they might communicate together, when the diffusion region 26 is formed on the surface of the contact region 25 of the substrate electric potential in the following process. However, the above-mentioned method involves inconvenience of complex fabrication process as in conventional cases. That is, the method requires ion implantation and thermal treatment at high temperature, for forming the element segregation region 23 and the diffusion region 27, and it also requires ion implantation and thermal treatment at low temperature, for forming the diffusion region 26, involving inconvenience of complex process and high fabrication cost. SUMMARY OF THE INVENTION It is accordingly an object of the present invention to provide a semiconductor device where the output of a substrate electric potential can be easily carried out on the surface of an output region even under the tendency of the reduction in impurity-diffusion depth due to the fine designing of semiconductor device. It is another object of the present invention to simplify the fabrication process of the semiconductor device. According to one aspect of the present invention there is provided a semiconductor device comprising a substrate of a first conduction type; an epitaxial mesa structure of a second conduction type on said substrate, said mesa structure comprising a top surface and outwardly sloping sidewalls; a diffused layer of the first conduction type continuously extending over the whole surface including said mesa and extending a predetermined depth into said substrate at those regions which are on either side of said mesa structure; and a field insulating layer formed on said diffused layer at those regions not on said top surface of said mesa structure, the exposed region of said diffused layer at the top surface of said mesa thus providing an output region for a contact to the substrate. According to anot er aspect of the present invention there is provided a method for producing the semiconductor, comprising the steps of forming, on a substrate of a first conduction type, an epitaxial layer of a second conduction type; patterning said epitaxial layer to form a mesa structure with a top surface and outwardly sloping sidewalls; ion implanting impurities of a first conduction type into the whole surface of the resulting structure; forming, subsequently, by selective thermal oxidation a field insulating layer on those surfaces ofthe resulting structure excluding the top surface of said mesa structure, whereby the impurities implanted in the ion implanting step diffuse to form a diffused layer having first, second and third diffusion regions, the first diffusion region being formed in the top surface of said mesa structure and the second diffusion region being formed beneath said field insulating layer and extending through the epitaxial layer and into the substrate, said second diffusion region being electrically connected to said first diffusion region by said third diffusion region formed on the outwardly sloping sidewalls of said mesa structure. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a constitutional view showing the semiconductor device of the present invention. Fig. 2 is schedule drawings showing a fabrication process of a semiconductor device of the present invention. Fig. 3 is a constitutional view showing a conventional semiconductor device. Fig. 4 is a constitutional view showing another conventional device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A semiconductor device of the present invention is comprised as follows. An element segregation region 6 is composed of a first conduction type diffusion region under a field insulating layer 2. The element segregation region 6 is in electrical contact with the surface 4a of an output region 4 for the substrate electric potential via a first conduction type diffusion region 7. Further, a process of fabricating the semiconductor device, in accordance with the present invention, comprises formation, by patterning, of an output region 4 of protruded form for the substrate electric potential with its end portion being tapered, ion implanting impurities of a first conduction type into an overall surface including the surface 4a and tapered portion 4b of the output region 4 for the substrate electric potential, subsequently forming selectively the field insulating layer 2 with selective oxidation, and forming first conduction type diffusion regions 5, 6 and 7 continuously from the surface 4a of the output region 4 for the substrate electric potential to the bottom of the field insulating layer 2. The embodiments of the present invention will now be explained with reference to Figs. 1 and 2. Fig. 1 is a constitutional view showing the semiconductor device of the present invention, more particularly a structure of the output portion for the substrate electric potential. In the figure, reference numeral 1 is a silicon substrate, 2 is a field insulating layer composed of SiO₂ or the like, 3 is a electrode for outputting the substrate electric potential. As shown in the figure, a diffusion region 5 of a first conduction type, for example, P-type, is formed on a surface 4a of an output region 4 for the substrate electric potential, the output region being enclosed by a field insulating layer 2. Further, a P-type element segregation region 6 is formed under the field insulating layer 2, and the diffusion region 5 on the surface 4a of the output region for the substrate electric potential is formed to connect with the element segregation region 6 via the P-type diffusion region 7 formed in proximity to the field insulating layer 2. A fabrication process of the semiconductor device of the present invention shown in Fig. 1, namely, a structure of the output region for the substrate electric potential, is explained with reference to the schedule drawings shown in Fig. 2. The corresponding parts to those in Fig. 2 are represented by the same symbols, separately. As shown in Fig. 2A, after an epitaxial layer 11 of a second conduction type, for example N-type, is formed on a silicon substrate of a first conduction type, for example P-type, an SiO2 film 12 of a film thickness of about 300 Å and a film 13 made of Si₃N₄, thickness 500 to 1500 Å (about 1000 Å in the present example) are layered in order on the whole surface of the epitaxial layer 11. As shown in Fig. 2B, patterning of the epitaxial layer 11 is carried out so as to form the output region 4 for the substrate electric potential into a protruded shape. In order words, the portion excluding the output region 4 for the substrate electric potential is removed of its given thickness, by etching with, for example, a KOH solution, hydrazine or plasma. In order that the end portions 4b of the output region 4 for the substrate electric potential may make a tapered form, the patterning of the epitaxial layer 11 is carried out by use of face orientation. The patterning of the epitaxial layer 11 is also carried out in other element forming regions in which transistors or the like are to be formed. As shown in Fig. 2C, P-type impurities, for example boron ion B⁺, are subsequently implanted into the whole surface including the surface 4a of the output region 4 for the substrate electric potential and the end portion thereof, namely the tapered portion 4b, at a high energy from 100 keV to 300 keV. In the present invention, ion implantation of an amount of 4 X 10¹⁴/cm² was carried out at the energy of about 180 keV. Boron ion B⁺ is implanted to the surface 4a of the output region 4 for the substrate electric potential and the tapered silicon surface, namely the tapered portion 4b. As shown in Fig. 2D, LOCOS (selective oxidation) is then processed, to form a field insulating layer 2, selectively, namely on the part excluding the output region 4 for the substrate electric potential. Because an Si₃N₄ film as an antioxidative film is then formed on the output region 4 for the substrate electric potential, the output region 4 for the substrate electric potential is not oxidized. Along with a P-type diffusion region 5 formed on the surface 4a for the output region 4 for the substrate electric potential, a P-type diffusion region, that is, an element segregation region 6, is also formed under the field insulating layer 2. Furthermore, a P-type diffusion region 7 is also formed on the silicon surface in proximity to the end portion of the field insulating layer 2, that is, the tapered portion 4b. Because boron ions B⁺ have been continuously implanted into the region below the field insulating layer 2, the tapered portion 4b and the surface 4a at the ion implantation process as shown in Fig. 2C, the diffusion regions 5, 6 and 7 are continuously formed at the time of such selective oxidation, to be communicated with each other. In other words, the diffusion region 5 on the surface 4a of the output region of substrate electric potential and the diffusion region 6 under the field insulating layer 2 are electrically connected together through the diffusion region 7 at the tapered portion 4b. As shown in Fig. 2E, after peeling off the SiO₂ film 12 and the Si₃N₄ film 13 on the output region 4 for the substrate electric potential, an output electrode 3 for the substrate electric potential made of Al or the like is formed on the output region 4 for the substrate electric potential to obtain the semiconductor device of the present invention. As described above, in accordance with the present invention, patterning of the epitaxial layer 11 is carried out to form the output region 4 of the substrate electric potential and the end portion 4b thereof into a protruded shape and a tapered form, and then the ion of the impurities are implanted into the tapered portion 4b, so that the diffusion region 5 on the surface 4a of the output region for the substrate electric potential and the diffusion region 6 under the field insulating layer 2 are electrically connected together, through the diffusion region 7 at the tapered portion 4b, by the subsequent selective oxidation process. In other words, the selective oxidation at such a degree that the element segregation region 6 passes through the remained epitaxial layer 11 after patterning of the portion excluding the output region 4 for the substrate electric potential, that is, the output portion for the substrate electric potential, can be arranged at low temperature thermal treatment. Thus, the substrate electric potential can be easily outputted on the surface 4a of the output region for the substrate electric potential, even if the diffusion region 5 on the surface 4a of the output region of the substrate electric potential is formed as being shallow by the low temperature thermal treatment due to the fine designing of the semiconductor devices. In view of the production process, the process of patterning the output region 4 for the substrate electric potential into a protruded form is required as well, but the process is completed through a procedure using only one ion implantation and one low temperature thermal treatment (selective oxidation), thereby dramatically simplifying the fabrication process. In the above example, P-type and N-type are used as the first conduction type and the second conduction type, respectively, but N-type and P-type may be used as the first conduction type and the second conduction type, respectively, as well. The semiconductor device of the present invention is constituted such that the element segregation region under the field insulating region and the diffusion region on the surface of the output region for the substrate electric potential are electrically connected together at the end portion of the field insulating layer. Thus, the substrate electric potential can be easily output at the surface of the output region for the substrate electric potential, even if the diffusion region on the surface of the output region for the substrate electric potential is formed as being shallow by the low temperature thermal treatment due to the fine designing of the semiconductor device. The process of fabricating a semiconductor device, in accordance with the present invention, comprises forming, by patterning, the output region for the substrate electric potential and the end portion thereof into a protruded portion and tapered form, respectively, ion implanting of the impurities into the overall surface including the surface and tapered portion of the output region for the substrate electric potential, subsequently forming selectively a field insulating layer with selective oxidation, and simultaneously forming impurity-diffusion regions continuously from the surface of the output region for the substrate electric potential to the bottom of the field insulating layer, whereby there can be output the substrate electric potential from the surface of the output region for the substrate electric c potential, in the semiconductor device where the depth of the impurity-diffusion region is formed as being shallow due to the fine designing of semiconductor devices, and there can be achieved simplification of the fabrication process thereof.

Claims: A semiconductor device comprising: a substrate (1) of a first conduction type; an epitaxial mesa structure of a second conduction type on said substrate (1), said mesa structure comprising a top surface (4a) and outwardly sloping sidewalls; a diffused layer (5, 6, 7) of the first conduction type continuously extending over the whole surface including said mesa and extending a predetermined depth into said substrate at those regions which are on either side of said mesa structure; and a field insulating layer (2) formed on said diffused layer at those regions (6, 7) not on said top surface of said mesa structure, the exposed region (5) of said diffused layer at the top surface (4a) of said mesa thus providing an output region for a contact to the substrate. The semiconductor device according to claim 1, characterized in that the diffused layer (5, 6, 7) is of a P-type. The semiconductor device according to claim 1, characterized in that the field insulating layer (2) is composed of SiO₂. The semiconductor device according to claim 1, characterized in that an electrode (3) is provided on said exposed region (5) of said diffused layer for outputting the substrate electric potential. A method of producing the semiconductor device according to claim 1, comprising the steps of: forming, on a substrate (1) of a first conduction type, an epitaxial layer (11) of a second conduction type; patterning said epitaxial layer to form a mesa structure (4) with a top surface (4a) and outwardly sloping sidewalls; ion implanting impurities of a first conduction type into the whole surface of the resulting structure; forming, subsequently, by selective thermal oxidation a field insulating layer (2) on those surfaces of the resulting structure excluding the top surface (4a) of said mesa structure, whereby the impurities implanted in the ion implanting step diffuse to form a diffused layer (5, 6, 7) having first (5), second (6) and third (7) diffusion regions, the first diffusion region (5) being formed in the top surface (4a) of said mesa structure (4) and the second diffusion region (6) being formed beneath said field insulating layer (2) and extending through the epitaxial layer and into the substrate, said second diffusion region being electrically connected to said first diffusion region (5) by said third diffusion region (7) formed on the outwardly sloping sidewalls of said mesa structure. The method according to claim 5, characterized by the step of forming an SiO₂ film (12) and an Si₃N₄ film (13) on the whole surface of the epitaxial layer (11) after having formed said epitaxial layer (11). The method according to claim 6, characterized by finally peeling off the SiO₂ film (12) and the Si₃N₄ film (13) and forming an output electrode (3) for the substrate electric potential on said first diffusion region (5) at the top surface (4a) of said mesa structure (4).

Inventors: AIDA KICHIO, HOZUMI HIROKI, AIDA, KICHIO, HOZUMI, HIROKI
Applicants: SONY CORP, SONY CORPORATION
Application year: 1990
Main classification: H01L21
IPC codes: H01L29, H01L21, H01L23, H01L27