Electroless gold plating solution and method for plating gold therewith

Abstract: The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.

Description: BACKGROUND OF THE INVENTION The present invention relates to an electroless gold plating solution and a method for plating gold using the same. The conventional electroless gold plating solutions are composed primarily of potassium gold (I) cyanide, potassium cyanide and a borane-based compound as reducing agent as described, for example, in Plating, Vol. 57 (1970), pp. 914-920. This process can produce a plating solution capable of exhibiting a plating rate of 1 µm/hr. U.S. Patent No. 3,506,462 discloses those composed of potassium gold (I) cyanide and thiourea as a reducing agent. On the other hand, Japanese Patent Publication No. 56-20353 discloses a cyanide ion-free electroless gold plating solution comprising primarily chloroaurate (III) and hydrazine as a reducing agent. The prior techniques as described above have caused problems that as the reducing agents are consumed, the reaction products thereof are accumulated to inhibit the plating reaction, and that the stability of the solution is significantly reduced due to the reduction reactions of gold ions with the reaction products in the solution. EP-A-0 343 816 which has to be considered as prior art under Art. 54(3) EPC relates to an aqueous liquor for use as an electroless gold deposition bath, comprising a source of gold and a reducing agent, which liquor also contains a reduction-stabilising agent selected from (a) a mixture of an alkaline metal or ammonium ferrocyanide and an alkaline metal or ammonium ferricyanide, (b) 1-H-tetrazole, (c) redox mediators and (d) mixtures of any of these. SUMMARY OF THE INVENTION It is an object of the present invention to provide an electroless gold plating method which is excellent in stability to cause no accumulation of reaction products capable of reducing gold ions in the solution because of the recycling of a reducing agent, and allows the plating to proceed at a higher speed than does the prior art. The above object can be achieved by using an electroless gold plating solution as defined in claim 1. The reducing agent reduces the gold ions, and the reducing agent regenerator has a function of giving electrons to and reducing an oxidant which has been produced from oxidation of the reducing agent to change the oxidant to the reducing agent, thus the reducing agent regenerator inhibits the formation of harmful reaction products which reduce the gold ions in the plating solution. The aforementioned reducing agent regenerator is a phenyl compound represented by the following general formula: where R₁ represents either a hydroxyl group or an amino group, and each of R₂, R₃, and R₄ represents independently one group selected from hydroxyl, amino, hydrogen, halogen, methoxy, and alkyl groups. The alkyl groups should be of an enough less number of carbon atoms to be soluble in water, and preferred alkyl groups are practically selected from those having 1 to 4 carbon atoms, such as methyl, ethyl and t-butyl groups. When R₁ represents a hydroxyl group, the general formula as above represents phenol compounds. The phenol compounds should be practically selected from the group consisting of, for example, phenol, o-cresol, p-cresol, o-ethyl phenol, p-ethyl phenol, t-butyl phenol, o-amino phenol, p-amino phenol, hydroquinone, catechol, pyrogallol, methyl hydroquinone, chloro-hydroquinone, and methoxy hydroquinone. When R₁ represents an amino group, the general formula represents aromatic amine compounds. The amine compounds should be practically selected from the group consisting of, for example, aniline, o-phenylenediamine, p-phenylenediamine, o-toluidine, p-toluidine, o-ethylaniline, and p-ethylaniline. Of these reducing agent regenerators, hydroquinone and pyrogallol have remarkable effects. The aforementioned complexing agents should be preferably water soluble inorganic salts containing sulfur and oxygen, and most preferably, thiosulfate and sulfite. The reducing agents are selected from organic thiourea based compounds and derivatives thereof. The thiourea based compounds should be preferably at least one selected from the group consisting of thiourea, N-methyl thiourea, 1-acetyl thiourea, 1,3-dimethyl thiourea, and ethylene thiourea. The aforementioned gold ions should be primarily monovalent gold ions, though either monovalent or trivalent gold ions may be used, for the reason that an amount of the reducing agents to be used with monovalent gold ions is theoretically required to be only one third of the amount with trivalent gold ions. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a reaction scheme for illustrating a major reaction and a side reaction in the plating reaction when thiourea was added as a reducing agent, Figure 2 shows a reaction scheme of the present invention for avoidance of the major reaction in the plating reaction when hydroquinone was added as a reducing agent regenerator Figure 3 shows a reaction scheme for avoidance of the side reaction in the plating reaction when hydroquinone was added as a reducing agent regenerator Figure 4 shows a reaction scheme for explaining the relaxation of the rate-determinating step of the plating reaction owing to the addition of a reducing agent regenerator Figure 5 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of hydroquinone as a reducing agent regenerator in accordance with the present invention, and those of Comparative Examples using no hydroquinone or no thiourea, Figure 6 shows a flow chart illustrating a process for preparing samples to be used in electroless gold plating, Figure 7 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of thiourea as a reducing agent for each of the electroless gold plating solutions of the present invention using a reducing agent regenerator and those of Comparative Examples using no reducing agent regenerator, Figure 8 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of 1-acetyl thiourea as a reducing agent for each of the electroless gold plating solutions of the present invention using a reducing agent regenerator and those of Comparative Examples using no reducing agent regenerator, Figure 9 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of N-methyl thiourea as a reducing agent for each of the electroless gold plating solutions of the present invention using a reducing agent regenerator and those of Comparative Examples using no reducing agent regenerator, Figure 10 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of ethylene thiourea as a reducing agent for each of the electroless gold plating solutions of the present invention using a reducing agent regenerator and those of Comparative Examples using no reducing agent regenerator, Figure 11 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of 1,3-dimethyl thiourea as a reducing agent for each of the electroless gold plating solutions of the present invention using a reducing agent regenerator and those of Comparative Examples using no reducing agent regenerator, Figure 12 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of pyrogallol in accordance with the present invention, as compared with those of Comparative Examples using no pyrogallol or no thiourea, Figure 13 shows characteristic curves indicating the relationship between a rate of gold deposition and a concentration of catechol in accordance with the present invention, as compared with those of Comparative Examples using no catechol or no thiourea, Figure 14 shows the stability of an electroless gold plating solution under no loading in the oxygen-containing atmosphere, and Figure 15 shows a diagrammatical view of an apparatus employed for producing the results of Figure 14. DESCRIPTION OF PREFERRED EMBODIMENTS The present invention will be described below in detail. Instability of prior art electroless gold plating solutions may be in part attributed to reduction of gold ions with reaction products produced from the reducing agents in the solutions. For example, processes of a plating reaction and an oxidation reaction with oxygen when thiourea is used as a reducing agent are shown in Figure 1. In the figure, the reaction process designated as [A] is a major reaction of the plating reaction, where thiourea reduces gold ions while the thiourea is converted through an oxidant (R) to an intermediate compound (b). Further the compound (b) is converted through a route [D] to final reaction products (d), (e) and (f). It has been confirmed that these compounds (d) to (f) do not reduce gold ions in the plating solutions, even if they accumulated. A portion of the intermediate compound (b) is converted through a route [E] to a final reaction product (h), formamidine sulfinic acid. This reaction product (h) has been confirmed to reduce gold ions in the solution even at a very small concentration of the product. On the other hand, a route [B] represents a mechanism of the side oxidation reaction with oxygen where a reducing agent, thiourea (a) is converted to an oxidant (R) with oxygen being reduced, which oxidant dimerizes to produce an intermediate compound (b). Thus, the reaction is the same as the plating reaction, except that the species reduced by the thiourea is different from that in the plating reaction. As the concentration of the reducing agent is increased, therefore, a rate of plating is increased, and at the same time the side oxidation reaction of the reducing agent with oxygen is also accelerated causing precipitation of gold due to reduction of gold ions with the reaction products in the solution so that the stability of the solution is significantly impaired. An approach tried by the present inventors to remove physically oxygen so as to avoid the route [B] was to perform the plating reaction bubbling of nitrogen gas, and alternatively, while preventing the solution from contacting an external atmosphere by a saturated hydrocarbon oil film. The results obtained under no loading are shown in Figure 14 where the abscissa represents a period of time until gold precipitation occurs. An apparatus for the experiments is shown in Figure 15. Figure 14 indicates the effects of oxygen on the stability of the plating solutions. The oil film and the nitrogen gas bubbling resulted in a relatively high stability, whereas air bubbling (air contains about 20% oxygen) reduced significantly the stability of the solutions. From this fact, it could be confirmed that oxygen has a great influence on the stability of the plating solutions. In order to achieve an enhancement in the stability of the electroless gold plating solutions and an increase in the plating rate, however, only removal of oxygen is inefficient, because the plating reaction proceeding along the route [A] alone allows a portion of the intermediate produced from the reducing agent to convert along the route [E] resulting in the final product (h) which adversely affects the solutions. Therefore, the present inventors considered that such a reducing agent recycling process as inhibiting the reaction through the route [C] would be necessary. The present inventors had an interest in the oxidant (R) and got an idea of adding a reducing agent regenerator for changing the active oxidant (R) to a starting neutral reducing agent (a). It is important that the reducing agent regenerator, for example, hydroquinone, should be water soluble, apt to release electrons, converted to inert reaction products, and incapable of reducing gold ions in the solution as described above. Although the reducing agent regenerators have also an ability of causing gold plating, such is a secondary function. The primary function of the regenerators is to reduce and restore the reaction intermediate produced from the reducing agent with gold ions being reduced to the original reducing agent. That is, the reducing agent regenerators should be excellent in reactivity with the oxidant, but poor in reactivity with gold ions. Therefore, the reduction of gold ions should be mostly due to the action of the reducing agent. As can be seen from the reaction mechanisms shown in Figures 2 and 3, the reducing agent regenerators are believed to function in the process where gold ions are reduced with thiourea which is converted to an oxidant (R), while a reducing agent regenerator, hydroquinone gives electrons to the oxidant which is restored to the starting reducing agent (a) with the hydroquinone itself being converted to a stable oxidant. Therefore, even if either the primary reaction [A] or the secondary reaction [B] proceeds, the reaction does not proceed along the route [C], and the reducing agent is always recycled so that no reaction product (h) capable of reducing gold ions in the solution is produced, thereby enhancing the stability of the solution. Furthermore, a higher plating rate as shown in Figure 5 can be achieved as illustrated in Example 22 later. That is, the Figure shows characteristic curves representing the relationship between the gold deposition rate and the concentration of the reducing agent regenerator (here hydroquinone) in solution, and it can be noted that an extraordinarily high deposition rate was obtained according to the present invention as shown in curve 1, comparing with Comparative Examples, curves 2 and 3. This can be explained with reference to Figure 4 as follows: thiourea is in equilibrium with a thiol type in an aqueous solution. This thiol type is the ionic species which pertains directly to the reduction of gold ions, that is, the sulfur atoms become prone to release electrons allowing the plating reaction to proceed. It is believed, therefore, that the rate-determining step of the plating reaction lies in dissociation of the reducing agents. One of the functions of the reducing agent regenerators is to facilitate this dissociation of the reducing agent. As the reducing agent regenerators have a smaller pKa than the reducing agent, removal of protons from the thiol type of thiourea can be easily caused. As a result, the rate-determining step is relaxed to increase a concentration of ions of the reducing agent resulting in enhancement of the plating reaction. Thus, among various reducing agent regenerators, those having a smaller pKa, such as hydroquinone and pyrogallol, have been used to achieve remarkable effects. Practical examples of the electroless gold plating solutions as disclosed above will be described hereunder. (1) Preparation of samples: A copper plate of 3.0 cm x 3.0 cm in area and 0.3 mm in thickness was first coated with a nickel film of a thickness of 2 µm using a conventional nickel electroplating solution, and then coated with a gold film of a thickness of 1 µm using a conventional gold electroplating solution in accordance with the process shown in Figure 6. (2) Electroless plating treatment on samples: Samples were washed with a degreasing liquid, and then with a diluted hydrochloric acid, and rinsed with water. After the samples were dried by blowing nitrogen gas, they were weighed. These samples were immersed for 3 hours in a plating solution having a composition as indicated in Examples 1 to 16 shown in Tables 1 to 4. The thickness of gold films after 3 hours was measured by a gravimetric method. In order to evaluate the stability of the electroless gold plating solutions containing a reducing agent regenerator of the present invention, a period of time until a precipitation of gold occurred (solution decomposition period) was determined. The temperature (solution temperature) and pH of plating solutions are also indicated in each of the Tables. In the column of solution composition, the marks * and o ○ designate a reducing agent and a reducing agent regenerator, respectively. These tables indicate also gold film thicknesses using no reducing agent regenerator as Comparative Examples which had the same composition as that of the plating solution in Examples 1 to 16, except that no reducing agent regenerator marked with o ○ was used. With any one of the plating solutions in Examples 1 to 16, deposited gold films were clear yellow in color, and no precipitation was observed in the solutions. It could be concluded from the results indicated in these tables that the gold films in the case of addition of the reducing agent regenerators had a larger thickness as compared with those in Comparative Examples using no reducing agent regenerator, and that the plating solutions containing any one of the reducing agent regenerators were much more stable than the prior art plating solutions. Example 17 In order to study the effects of the reducing agent regenerators (marked with o ○ ), each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour in each of the electroless plating solutions Nos. 1 to 4 of the present invention with varying concentrations of thiourea as reducing agent (marked with *). The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l o ○ Hydroquinone 0.00027 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, * thiourea: No. 1 0.0025 mol/l No. 2 0.0066 mol/l No. 3 0.0164 mol/l No. 4 0.0328 mol/l The thickness of the gold films deposited after one hour from each plating solution as above under forced stirring was evaluated by a gravimetric method. With the plating solutions containing no reducing agent regenerator, similar measurements were conducted. The results are shown in Figure 7. In the Figure, curves 4 and 5 were plotted from the results in the example containing a reducing agent regenerator of the present invention and Comparative Example, respectively. Example 18 For the same purpose as in Example 17, each of the samples prepared in the same way as in the forementioned Examples was immersed for one hour in each of the electroless plating solutions Nos. 5 to 9 of the present invention with varying concentrations of 1-acetyl thiourea. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l o ○ Hydroquinone 0.00027 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, * 1-acetyl thiourea: No. 5 0.0025 mol/l No. 6 0.0066 mol/l No. 7 0.0164 mol/l No. 8 0.0328 mol/l No. 9 0.0493 mol/l The-thickness of the gold films deposited after one hour from each plating solution as above under forced stirring was evaluated by the gravimetric method. With the plating solutions containing no reducing agent regenerator of hydroquinone, similar measurements were conducted as comparative experiments. The results are shown in Figure 8 in terms of the inventive experiments and of the comparative experiments, respectively. Example 19 For the same purpose as in Example 17, each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour in each of the electroless plating solutions Nos. 10 to 14 of the present invention with varying concentrations of N-methyl thiourea. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l o ○ Hydroquinone 0.00027 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, * N-methyl thiourea: No. 10 0.0025 mol/l No. 11 0.0066 mol/l No. 12 0.0164 mol/l No. 13 0.0328 mol/l No. 14 0.0493 mol/l The thickness of the gold films deposited after one hour from each plating solution as above under forced stirring was evaluated by the gravimetric method. With the plating solutions containing no reducing agent regenerator of hydroquinone, similar measurements were conducted as comparative experiments. The results are shown in Figure 9. In the Figure, curves 8 and 9 indicate the results of the present invention and those of the comparative experiments, respectively. Example 20 For the same purpose as in Example 17, each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour in each of the electroless plating solutions Nos. 15 to 18 of the present invention with varying concentrations of ethylene thiourea. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l o ○ Hydroquinone 0.00027 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, * ethylene thiourea: No. 15 0.0025 mol/l No. 16 0.0066 mol/l No. 17 0.0328 mol/l No. 18 0.0493 mol/l The thickness of the gold films deposited after one hour from each plating solution as above under forced stirring was evaluated by the gravimetric method. With the plating solutions containing no reducing agent regenerator of hydroquinone, similar measurements were conducted as comparative experiments. The results are shown in Figure 10. In the Figure, curves 10 and 11 indicate the results of the present invention and those of the comparative experiments, respectively. Example 21 For the same purpose as in Example 17, each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour in each of the electroless plating solutions Nos. 19 to 23 of the present invention with varying concentrations of 1,3-dimethyl thiourea. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l o ○ Hydroquinone 0.00027 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, * 1,3-dimethyl thiourea: No. 19 0.0025 mol/l No. 20 0.0066 mol/l No. 21 0.0164 mol/l No. 22 0.0328 mol/l No. 23 0.0493 mol/l The thickness of the gold films deposited after one hour from each plating solution as above under forced stirring was evaluated by the gravimetric method. With the plating solutions containing no reducing agent regenerator of hydroquinone, similar measurements were conducted as comparative experiments. The results are shown in Figure 11. In the Figure, curves 12 and 13 represent the results of the present invention and those of the comparative experiments, respectively. With any one of the plating solutions of Examples 17 to 21, the deposited gold films were clear yellow in color, and no precipitation was observed in the solutions. Example 22 Each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour under indicated conditions in each of the electroless plating solutions Nos. 24 to 28 having the indicated composition of the present invention. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l * Thiourea 0.016 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, o ○ hydroquinone: No. 24 0.00023 mol/l No. 25 0.00046 mol/l No. 26 0.0010 mol/l No. 27 0.0046 mol/l No. 28 0.014 mol/l The thickness of the gold films deposited after one hour from each plating solution as above under forced stirring was evaluated by the gravimetric method. With the plating solutions containing no thiourea, similar measurements were conducted as comparative experiments. The results are shown in Figure 5. In the Figure, curve 1 represents the results of the present invention, curve 2 the comparative experiment containing no o ○ hydroquinone (reducing agent regenerator), and curve 3 the a comparative experiment containing no * thiourea (reducing agent). It is apparent from the results that the present invention could achieve a gold depositing rate 2 to 3 times as large as that of the prior art. Example 23 Each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour under indicated conditions in each of the electroless plating solutions Nos. 29 to 31 having the indicated composition of the present invention. Composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l * Thiourea 0.016 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, o ○ pyrogallol: No. 29 0.00023 mol/l No. 30 0.0046 mol/l No. 31 0.010 mol/l The thickness of the gold films deposited after one hour from each plating solution as described above under forced stirring was evaluated by the gravimetric method. The deposited gold films were clear yellow in color, and no precipitation was observed in the solutions. The results of the measurements are shown in Figure 12. In the Figure, curve 14 represents the results of the present invention, curve 15 the comparative experiment containing no o ○ pyrogallol (reducing agent regenerator), and curve 16 the comparative experiment containing no * thiourea (reducing agent). Even with no thiourea being added, the use of 0.039 mol/l pyrogallol led to a gold deposition rate of 0.23 µm/hr. Example 24 Each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour under indicated conditions in each of the electroless plating solutions Nos. 32 to 34 having the indicated composition of the present invention. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l * Thiourea 0.016 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, o ○ catechol: No. 32 0.00023 mol/l No. 33 0.0046 mol/l No. 34 0.023 mol/l The thickness of the gold films deposited after one hour from each plating solution as described above under forced stirring was evaluated by the gravimetric method. The deposited gold films were lusterless and clear yellow in color, and no precipitation was observed in the solutions. The results of the measurements are shown in Figure 13. In the Figure, curve 17 represents the results of the present invention, curve 18 the comparative experiment containing no o ○ catechol (reducing agent regenerator), and curve 19 the comparative experiment containing no * thiourea (reducing agent). Example 25 Each of the samples prepared in the same way as in the aforementioned Examples was immersed for one hour under indicated conditions in each of the electroless plating solutions Nos. 35 to 37 having the indicated composition of the present invention. The composition of the plating solution and plating conditions: Sodium chloroaurate (III) 0.012 mol/l Sodium thiosulfate 0.1 mol/l * Thiourea 0.016 mol/l Sodium sulfite 0.4 mol/l Borax 0.13 mol/l Solution temperature 80 °C pH 9.0 Relative to the above composition, o ○ methyl hydroquinone: No. 35 0.00023 mol/l No. 36 0.0046 mol/l No. 37 0.023 mol/l The thickness of the gold films deposited after one hour from each plating solution as described above under forced stirring was evaluated by the gravimetric method. The deposited gold films were lusterless and clear yellow in color, and no precipitation was observed in the solutions. From the Examples as described above, the following may be concluded: The addition of the reducing agent regenerators to the plating solutions allows the restoration of reaction intermediates, which have been produced from the reducing agents after reducing gold ions, to the original reducing agents so that the reducing agents are always recycled and no reaction product capable of reducing gold ions is produced. Therefore, the stability of the solutions has been enhanced. As the reducing agent regenerators have a smaller pKa than those of the reducing agents, removal of protons from the reducing agents is effected to increase the concentration of ions of the reducing agents. The increase of the concentration of ions of the reducing agents leads to an increase in the plating rate, because the dissociation of the reducing agents is the rate-determining step. In order to ensure that the reducing agent regenerators are soluble in the plating solutions and inert after the reaction was conducted, they must have a benzene ring and a hydrophilic substituent as R₁ of either hydroxyl or amino group. Moreover, in order to inhibit an addition reaction to the benzene ring, the substituents R₂ to R₄ should preferably have a substituent introduced. For preserving the solubility in the plating solutions, R₂ to R₄ should be selected from the group consisting of hydroxyl group, amino group, hydrogen atom, halide group, methoxy group, and alkyl group. If the aforementioned alkyl group is at least one of methyl, ethyl, and t-butyl groups, the solubility in the plating solutions can be maintained. Among the aforementioned water soluble inorganic salts, thiosulfates and sulfites are stable compounds. A preferred thiourea based organic compound as a reducing agent is one selected from the group consisting of thiourea, N-methyl thiourea, 1-acetyl thiourea 1,3-dimethyl thiourea, and ethylene thiourea which are soluble in the plating solutions. The use of monovalent gold ions is more economical than trivalent gold ions, because the amount of the reducing agents to be used for monovalent gold ions is theoretically required to be only one third of that for trivalent gold. The electroless gold plating reaction is a catalytic reaction so that simply upon bringing substrates in contact with gold ions in the plating solutions, the plating reaction can proceed. Substrates to be plated should be pretreated by applying coating films of gold or a metal having a lower ionization tendency than that of gold in a pattern where the electroless gold plating is required to be effected. This is for preventing a substituting reaction with coating metals in the pattern on the substrates. Moreover, in order to avoid a dissolution of foreign metals into the gold plating solutions in advance, the substrates should be preferably coated with the same metal to be plated, i.e., gold. The gold coating pattern as above is formed thin, which can be accomplished by gold-substituting deposition. The gold-substituting deposition may be performed by first forming a prime metal pattern with a metal having a higher ionization tendency than that of gold, and then forming the gold coating pattern by selectively depositing gold through substitution reaction on the prime metal pattern. If pH is lower than 6.0, the rate of the plating reaction is reduced, and if it is higher than 11.0, gold precipitation occurs in the plating solutions.

Claims: An electroless gold plating solution consisting essentially of water, gold ions, at least one complexing agent, a buffering component, a reducing agent selected from thiourea based organic compounds and derivatives thereof, and a reducing agent regenerator comprising a compound represented by the general formula: where R₁ represents either a hydroxyl group or an amino group, and each of R₂, R₃, and R₄ represents independently one member selected from hydroxyl, amino, hydrogen, halogen, methoxy, and alkyl groups, and said solution having a pH value within the range of 6.0 to 11.0. The electroless gold plating solution according to claim 1, in which said alkyl group is selected from methyl, ethyl, and t-butyl groups. The electroless gold plating solution according to claim 1 or 2, in which said complexing agent is selected from water soluble inorganic salts containing sulfur and oxygen. The electroless gold plating solution according to claim 3, in which said water soluble inorganic salts containing sulfur and oxygen comprise thiosulfate or sulfite. The electroless gold plating solution according to any of the preceding claims, in which said thiourea based organic compound is selected from thiourea, N-methyl thiourea, 1-acetyl thiourea, 1,3-dimethyl thiourea and ethylene thiourea. The electroless gold plating solution according to any of the preceding claims, in which said gold ions comprise predominantly monovalent gold ions. The electroless gold plating solution according to any of the preceding claims, wherein said buffering component comprises Borax or ammonium chloride. A process for conducting electroless gold plating by bringing a substrate into contact with an electroless gold plating solution consisting essentially of water gold ions, at least one complexing agent, a buffering component, a reducing agent selected from thiourea based organic compounds and derivatives thereof, and a reducing agent regenerator comprising a compound represented by the general formula: where R₁ represents either a hydroxyl group or an amino group, and each of R₂, R₃, and R₄ represents independently one member selected from hydroxyl, amino, hydrogen, halogen, methoxy, and alkyl groups, and said solution having a pH value within the range of 6.0 to 11.0. The process for conducting electroless gold plating according to claim 8, wherein said gold plating solution is as defined in any of claims 2 to 7. The process for conducting electroless gold plating according to claim 8 or 9, further comprising the step of pre-forming a pattern of gold coating film on said substrate to be plated, and effecting selectively electroless gold plating on said pattern of gold coating film. The process for conducting electroless gold plating according to claim 10, further comprising the step of forming a prime metal pattern of a metal having a higher ionization tendency, and then effecting selectively gold deposition on said pattern by substituting gold for said metal to form a pattern of gold coating film.

Inventors: ANDO SETSUO, INOUE TAKASHI, OKUDAIRA HIROAKI, SHIMAZAKI TAKESHI, USHIO JIRO, YOKONO HITOSHI, ANDO, SETSUO, INOUE, TAKASHI, OKUDAIRA, HIROAKI, SHIMAZAKI, TAKESHI, USHIO, JIRO, YOKONO, HITOSHI
Applicants: HITACHI CHEMICAL CO LTD, HITACHI LTD, HITACHI CHEMICAL CO., LTD., HITACHI, LTD.
Application year: 1990
Main classification: C23C18
IPC codes: C23C18