Printed circuit-board and fabric therefor

Abstract: A fabric for a printed circuit-board characterized by that it is composed of one or more fiber(s) (1A, 1B) selected from the group consisting of polyether ether ketone fiber, polyetherimide fiber and polysulphone fiber, and glass fiber (2A, 2B), and a printed circuit-board employing the fabric as its base material.

Description: The present invention relates to a fabric for use in the manufacture of printed circuit-boards used for computers, communication device, etc., to laminates comprising such fabrics and to printed circuit-boards comprising such laminates. RELATED ART Generally, glass-epoxy laminates are used as printed circuit-boards; recently performances required for printed circuit-boards have become so diversified due to developments in this field that in some cases the glass-epoxy laminates cannot satisfy requirements. For instance, since a high speed signal propagation is associated with increased operating speed, a printed circuit-board of a low dielectric constant which is highly reliable even when used at a fast operating speed is required. In compliance with this requirement, thermoplastic resins of a low dielectric constant, such as polytetrafluoro-ethylene, polysulphone, polyethylene, polybutadiene, have been examined; and fabrics of polytetrafluoro-ethylene fiber, aromatic polyamide fiber, quartz fiber, etc. have been examined. However, the above-mentioned printed circuit-boards prepared by the prior art methods have problems as to processability, reliability as printed circuit-boards, and cost. Therefore, they cannot as yet sufficiently meet requirements. Because a propagation delay of signal and a distortion of digital pulse shape are seen as problems associated with increasing speed of information processing, printed circuit-boards prepared with materials of low dielectric constant are demanded. However, the development of such substrate base materials has been delayed; a sufficient response to the above demand has not occurred. Further, fabric of D-glass fiber, quartz fiber and polyamide fiber have been used on trial as materials for substrates for special use. But they have been found unsatisfactory in both cost and properties. In Specification FR-A-2607997 there is disclosed, as a substrate in the production of printed circuit boards, one or more superposed layers of synthetic organic fiber and/or glass fiber. OBJECT AND SUMMARY OF THE INVENTION The object of the present invention is to provide at low cost a fabric for use in making printed circuit-boards having a low dielectric constant, for both general use and as a board for high-speed information processing; and a printed circuit-board made therefrom. The object described above is achieved with a fabric with the features defined in claim 1. The fabric for making printed circuit-boards comprises one or more fibers selected from the group consisting of polyether ether ketone (PEEK), polyether imide (PEI) and polysulphone (PSF), and glass fiber selected from the group consisting of E-glass fiber, S-glass fiber and D-glass fiber. Further, the invention provides a laminate with the features defined in claim 4, and a printed circuit board with the features defined in claim 5. BRIEF DESCRIPTION OF DRAWINGS Figures 1, 2 and 3 each is a schematic model showing the weave type of the present fabric. Figure 1 shows regular basket weave; Figure 2 shows even side twill weave; and Figure 3 shows plain weave. The following symbols denote the respective yarns or materials: A: warp, 1A: glass fiber yarn, 2A: a thermoplastic resin fiber yarn, B: weft, 1B: glass fiber yarn, 2B: a thermoplastic resin fiber yarn. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS In the present invention, E-glass fiber, S-glass fiber (glass fiber with a high tensile strength) and D-glass fiber (glass fiber with a low dielectric constant) are used as the glass fiber for the substrate. There is no restriction as to how these resin fibers and glass fibers should be woven; any weave type is possible so long as it is plain basket weave (regular mat weave), even side twill weave or the like. It is preferred that the glass fiber yarns and the PEEK, PEI or PSF fiber yarns are woven into both the warp and weft uniformly; it is more preferred that these yarns are woven into both the warp and the weft every alternate yarn. Further, it is also possible that hybrid yarns are prepared by doubling/twisting and mix spinning the glass fiber yarns and the PEEK, PEI or PSF fiber yarns at a fixed blending ratio; and then the hybrid yarns are used for weaving. In any case, it is desirable to obtain as far as possible a uniformly mixed condition of the glass fiber yarn and the PEEK, PEI or PSF fiber yarn in order to realize the object of the present invention described above, e.g. by doubling/twisting, mix spinning, etc.. The blend ratio of the glass fiber yarn is as follows, considering the balance of dielectric constant and strength of the substrate. 1 ○ E-glass: 1 to 40 wt%; 2 ○ S-glass: 1 to 50 wt%; 3 ○ D-glass: 1 to 65 wt%. A theoretical dielectric constant (1 MHz) of a fabric can be kept of 3.5 or less when the fabric is woven with a blending ratio from the above-mentioned range. Surprisingly a substrate thus prepared has a dielectric constant almost equal to the theoretical value and said dielectric constant hardly increases after the severe treatment test. Furthermore, it is desirable that a sizing requiring no desizing is used in the glass fiber yarn to be employed for the fabric of the present invention. Usually, a sizing mainly composed of starch and lubricant is used in the glass fiber yarn spinning process; and it is burned out by heating after weaving. In the case of the fabric of the present invention, a sizing requiring no desizing is desirable because heating cannot be carried out due to mix weaving of the organic fiber yarns and the glass fiber yarns. A printed circuit-board with high reliability and a low dielectric constant even at faster operating speeds can be obtained with the above-mentioned fabric. There are known dielectric materials including polytetrafluoro-ethylene fiber, aromatic polyamide fiber, etc. as shown in Table 1. However, polytetrafluoro-ethylene fiber has no adhesion to the matrix resin which is used for the production of the substrate; it is not suitable for a substrate of a printed circuit-board to be used under severe conditions for a long period. Aromatic polyamide fiber is also often used; however, it is not satisfactory in view of its cost and performance, because its dielectric constant of 3.8 is not so low. Materials Dielectric constant (1 MHz) Materials Dielectric constant (1 MHz) Polytetrafluoroethylene 2.1 Aromatic polyamide 3.8 PSF 3.1 D-glass 4.3 PEI 3.15 S-glass 5.5 PEEK 3.2 E-glass 6.9 Super-drawing polyethylene (dielectric constant: 2.0), polyethylene terephthalate (PET) (2.7), polyphenylene sulphide (PPS) (3.5), etc. are known as thermoplastic resin fibers with a low dielectric constant. Super-drawing polyethylene is, however, poor in adhesion to matrix resins like polytetrafluoroethylene. PET has a good adhesion to matrix resin; but it has a problem with its heat resistance. And PPS is also poor in adhesion to epoxy resin. It is presumed that a physical entanglement between PPS and matrix resin on the interface is unlikely to occur due to high crystallinity of PPS. On the contrary, each of PEEK fiber, PEI fiber and PSF fiber has a good adhesion to a matrix resin fiber. Further, PEEK fiber and PEI fiber each possesses another good characteristic in that the heat resistance to soldering of a laminate made of a fabric which is obtained by mix-weaving a glass fiber and PEEK fiber or PEI fiber, is, contrary to expectations, better than that of a laminate made of a fabric of glass fiber only. This is presumed to be due to a physical entanglement between one of the PEEK, PEI or PSF fibers and the matrix resin occuring in microstructure on the interface of the resin fiber, leading to a good adhesion interface, because, unlike PPS, none of PEEK, PEI and PSF have high crystallinity. It is unthinkable that these phenomena might occur on the interface between the glass fiber (mineral fiber) and the matrix resin. As shown in Table-1, PEEK fiber, PEI fiber and PSF fiber each used in the fabric of the present invention have a dielectric constant of 3.1 to 3.2. In addition, these fibers have good adhesion to epoxy resin and polyimide resin which are used as the matrix resins. A fabric for a printed circuit-board can be processed, while controlling a theoretical dielectric constant of the fabric of 3.5 or lower, by mix-weaving of the glass fiber and PEEK fiber, PEI fiber or PSF fiber, and a printed circuit-board made therefrom can meet the mechanical strength required for the substrate. The printed circuit-board thus obtained is far cheaper and endures sufficiently a high speed processing with a low dielectric constant; and it has a good balance of cost and performance, in comparison with the use of Teflon® or aromatic polyamide fiber yarn. A calculated dielectric constant of the fabric for the substrate can be controlled at 3.5 or lower by respectively controlling volume fractions of the resin fiber and the glass fiber, which are obtained by calculation of Expression (1) 1/ε f = V R x 1/ε R + V g x 1/ε g (1) where ε f : dielectric constant of the fabric ε R : dielectric constant of the resin fiber ε g : dielectric constant of the glass fiber V R : volume fraction of the resin fiber V g : volume fraction of the glass fiber The values of dielectric constants of E-glass, S-glass and D-glass are shown respectively in Table 1. In the case of mix-weaving the glass fiber with PEEK fiber, PEI fiber or PSF fiber, the upper limit of blending ratio in weight of the glass fiber is 40% or less for E-glass fiber; 50% for S-glass fiber; 65% for D-glass fiber, in order to keep the theoretical dielectric constant of the mix-woven fabric at 3.5 or less. At a blending ratio below the upper limit, the glass fiber is properly blended considering a balance of cost according to the use of the printed circuit-board. In the connection of the method of weaving the fabric to get the uniformity of low dielectric constant of the substrate, a plain weaving is preferred for the use of doubled/twisted yarn or blended yarn of the glass fiber and the PEEK, PEI or PSF fiber; and a uniformly dispersed texture of fabric is preferred for mix-weaving the glass fiber and the PEEK, PEI or PSF fiber, e.g., the basket plain weaving is favorable. Usually a sizing is used for the glass fiber. Considering an affinity and adhesion of the sizing to the matrix resin, the sizing without a necessity of desizing is desirable for the glass fiber used in the fabric of the present invention. The usual continuous glass fiber for weaving is sized with starch type sizing at the time of fiber forming. This sizing reduces the adhesion effect between the matrix resin and the glass fiber and interferes with penetration of the matrix resin between filaments constituting the yarn; in other words, the sizing interferes with impregnation of the matrix resin. Therefore, in the past, after a reinforcing cloth was prepared by weaving the continuous glass fiber, the sizing was burned out in an oven, and then the cloth was impregnated with the resin. However, the continuous glass fiber and the thermoplastic resin fiber yarn are jointly woven in the fabric of the present invention; therefore, the sizing adhering to the continuous glass fiber cannot be removed by burning after weaving. And the use of continuous glass fiber to which the starch type sizing is applied causes problems such as a decrease of adhesive strength between the resin and the continuous glass fiber and insufficiency of resin impregnation in some cases. Thus, a sizing which increases the adhesion effect between the matrix resin and the continuous glass fiber, and enables the resin to be well impregnated, is suitable for the continuous glass fiber to be used in the fabric of the present invention, e.g., it has the following composition. (1) Film-forming agent One or more resin(s) selected from the group consisting of epoxy resin, ethylene oxide-modified epoxy resin, amine-modified epoxy resin, urethane resin and urethane-modified polyester resin, or a mixture thereof is used. Further, vinyl acetate resin, ethylene-vinyl acetate resin, low molecular polyester resin, etc. which are often used for glass roving, are also usable. (2) Silane coupling agent One or more compound(s) selected from a group consisting of γ-aminopropyltriethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-metacryloxypropyltrimethoxysilane, vinyltri-β-methoxyethoxysilane, hydrochlorinated or dehydrochlorinated product of N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane and γ-(2-aminoethyl)-aminopropylmethyldimethoxysilane, or a mixture thereof. (3) Cationic surfactant Quaternary ammonium type or amine type, or a mixture thereof. (4) Lubricant One or more compound(s) selected from the group consisting of silicone type, wax type and ester wax type or a mixture thereof. The sizing containing various components belonging to items (1) to (4) is suitably used in a loading ratio of 0.2 to 1.0 wt%. In the sizing prepared by mixing the several components cited above, the epoxy resin, urethane resin and modified products thereof are compatible with the matrix resin, while the silane coupling agent increases the adhesion effect between the matrix resin and the surface of the glass fiber. Therefore, the sizing applied to the surface of the glass fiber filaments acts as an adhesive between the matrix resin and the glass fiber. Unlike a starch type of sizing, the matrix resin can easily penetrate into the glass fiber yarn because the sizing is compatible with the matrix resin; i.e., an impregnation is likely to occur. Therefore, a fabric for the printed circuit-board which can satisfy the mechanical strength requirement of it, can be obtained by using glass fiber to which is applied a sizing prepared by mixing the components cited above. The printed circuit-board of the present invention can be manufactured as follows. First, a resin-impregnated base material is prepared by impregnating a fabric of the invention with a matrix resin such as an epoxy resin. Then a laminate having a low dielectric constant can be obtained by laminating/forming one or more base materials. The matrix resin and the number of resin-impregnated base material pieces to be used are determined in compliance with the purpose of use of the laminate. In addition to epoxy resin, polyester resin, polyimide resin, etc. can be used as a matrix resin. However, epoxy resin is the preferred resin for use in the manufacture of a fabric of the present invention. Example The present invention is illustrated in more detail in the examples below; however, the invention is not limited to these examples. The method of evaluation of the laminates in the examples is as follows. (i) Dielectric constant The laminates which were immersed in boiling water for two hours after preparation and those which were left alone at room temperature for two hours after preparation were respectively tested according to JIS C6481 5.12. (ii) Insulation resistance The same samples as mentioned in (i) were tested according to JIS C 6481 5.11. (iii) Percentage of water absorption The laminates were treated at 133°C for 75 min. in a pressure cooker after preparation; and the treated laminates were tested according to JIS C 6481 5.14. The percentage of water absorption was calculated from a difference between weights before and after the treatment. (iv) Heat resistance of solder The test was carried out according to JIS C 6481 5.5: i.e., the laminates were entirely etched to remove copper foil, then treated at 133°C for 75 min. in a pressure cooker. The laminates thus treated were soldered at 260°C for 20 seconds, after which the blistering (interlaminar delamination) condition was checked visually. (v) Bending strength The laminates were tested according to JIS C 6481 5.8. [Example 1] Laminates were prepared from a fabric which was woven using PEI fiber yarn as the fiber yarn with a low dielectric constant and S-glass fiber yarn as the glass fiber yarn under the following conditions. The conditions of weaving and those of fabrication of the laminates were as follows. 1) Fabric (a) Used yarn: PEI fiber yarn 1215 denier (36 filaments) S-glass fiber yarn TCK 37 1/0 1Z (b) Sizing Composition for S-glass fiber yarn: Ethylene oxide-added epoxy resin 3.0% γ-aminopropyltriethoxysilane 0.5% Tetraethylenepentaminedistearate 0.05% Polyethylene emulsion 0.1% (c) Weaving type: Basket plain weave (d) Weaving count Warp: PEI fiber yarn 19 ends S-glass fiber yarn 19 ends Woof: PEI fiber yarns 18 ends S-glass fiber yarn 18 ends 2) Matrix resin: G-10 composition (epoxy resin) 3) Forming of laminate: Temperature: 170°C Pressure: 50 kg/cm², 90 min. [Example 2] Laminates were obtained by the same operation as in Example 1, except that PEEK fiber yarn was used as the resin fiber yarn with a low dielectric constant. [Comparative example] The fabric for the printed circuit-board was woven using the E-glass fiber yarn only; then laminates were prepared using this fabric and tested. 1) Fabric (a) Used yarn: ECG37 1/0 1Z both for warp and weft (b) Sizing for E-glass fiber yarn: Starch type (c) Weaving type: Plain weave (d) Weaving count (number of yarn/25 mm) Warp: 19, Weft: 18 (e) Subjected to epoxysilane treatment (Z6040) after usual heating treatment 2) Matrix resin: G-10, composition (epoxy resin) 3) Forming of laminate: Temperature: 170°C Pressure: 50 kg/cm², 90 min. The laminates obtained in Examples 1 and 2 and the Comparative example were tested according to the method of evaluation mentioned above. The obtained results were shown in Table 2. Example 1 Example 2 Comparative example Dielectric const. A 3.56 3.51 4.54 (1 MHz) D-2/100 3.72 3.75 4.80 Insulation resistance A 5.0x10¹⁴ 2.0x10¹⁴ 4.3x10¹⁴ Ω D-2/100 1.5x10¹² 8.2x10¹¹ 1.0x10¹² Percentage of water absorption % (PCT 133°C 75 min.) 0.98 1.02 1.08 Blistering (PCT 133°C 75 min. 260°C 20 sec) Did not occur Did not occur Occurred Bending strength kg/mm² 38.9 37.4 54.6 Number of lamination Ply 4 4 8 Thickness of laminate mm 1.47 1.45 1.48 As shown in Table 2, the laminates prepared in Example 1 and 2 have dielectric constants meeting the dielectric characteristics which are required by the printed circuit-board industry today; and they also have other electric characteristic, heat resistance, etc. equal to or better than those of the laminate prepared in the Comparative example. Although the bending strength of the laminates of Examples 1 and 2 is poorer than that of the Comparative example, a level of bending strength not less than that of the Examples raises no problem in ordinary use. As described above, the fabric of the present invention permits the production of printed circuit-boards which can keep the balance of dielectric and other characteristics and cost. And further, a printed circuit-board which has dielectric characteristics in compliance with its proposed use can be obtained by changing the blending ratio of the glass fiber. Because the fabric of the present invention needs neither heating nor surface treatment, which processes are necessary for fabrics usually used for making printed X circuit-boards, the invention has the merit that the fabric production process is simplified.

Claims: A fabric for use in the manufacture of a printed circuit-board which comprises organic fibers and glass fibers, characterised in that the fabric consists essentially of at least one resin fiber selected from the group consisting of polyether ether ketone fiber, polyetherimide fiber and polysulphone fiber, and at least one glass fiber selected from the group consisting of E-glass fiber, S-glass fiber and D-glass fiber, wherein (i) when the glass fiber is E-glass fiber the proportion of glass fiber in the fabric is 1 to 40% by weight, (ii) when the glass fiber is S-glass fiber the proportion of glass fiber in the fabric is 1 to 50% by weight, and (iii) when the glass fiber is D-glass fiber the proportion of glass fiber in the fabric is 1 to 65% by weight. A fabric according to claim 1 wherein the glass fiber is sized with a sizing agent comprising (i) a film-forming agent which is composed of one or more resin(s) selected from the group consisting of epoxy resin, amine-modified epoxy resin, ethylene oxide-modified epoxy resin, urethane resin, urethane-modified polyester resin and a mixture thereof, (ii) a silane coupling agent and (iii) a cationic surfactant. A fabric according to claim 1 or 2 which is a woven fabric. A laminate for use in the manufacture of a printed circuit board, comprising one or more substrates each of which is a fabric according to any of claims 1 to 3. A printed circuit board comprising a laminate as claimed in claim 4.

Inventors: FUJII MIKIYA, INOGUCHI HIROKAZU, KASAI SHIN, KATO KEIICHI, WATANABE SHOICHI, FUJII, MIKIYA, INOGUCHI, HIROKAZU, KASAI, SHIN, KATO, KEIICHI, WATANABE, SHOICHI
Applicants: NITTO BOSEKI CO LTD, NITTO BOSEKI CO., LTD.
Application year: 1989
Main classification: H05K1
IPC codes: B32B17, H05K1, D03D15, D03D1