A resin composition

Abstract: A resin composition comprising 5 to 95 parts by weight of a saponified product of an ethylene-vinyl acetate copolymer (A) having an ethylene content of 20 to 60 mol% and a degree of saponification of at least 90% and 95 to 5 parts by weight of a styrene-based polymer (B) having mainly syndiotactic configuration has gas barrier properties and markedly improved heat resistance. In a molding comprising the resin composition, contents (food) can be stored for a long period of time at ambient temperature. Moreover, after retort sterilization, the container can be heated by boiling, or in a microwave oven or a grill oven (at 220 to 240°C) in the condition that the contents (food) are placed in the container.

Description: This is a divisional application from EP-0 363 895 which concerns a multi-layer material having gas barrier properties and high heat resistance. 1. Field of the Invention The present invention relates to a resin composition to produce a molding having gas barrier properties and high heat resistance. More particularly the present invention relates to a resin composition to produce a molding (especially containers) which can be transported at ambient temperature, because retort sterilization (high temperature steam) is possible and can be stored for a long period of time, and further which has such high gas barrier properties as to permit heating directly by boiling, or in an electric range or a grill oven (220 to 240°C) without transferring its contents (food) into another container. 2. Description of the Related Arts Various resin containers are on the market, advertizing that the contents placed in the containers, after refrigeration transportation, can be heated by boiling, or in an electric range or a grill oven (not more than 220°C) without transferring the contents into another container. Most of these containers are made of crystalline thermoplastic resins such as polyester (C-PET), polypropylene and poly(4-methylpentene). If these containers are put in grill ovens or oven toasters presently used in homes, problems such as distortion of container often occur because the temperature rises above the temperature to which the containers can withstand. It has therefore been desired to develop a container which can overcome the above problems and which has excellent heat resistance, satisfying the requirements of the market. Compounding the general-purpose polystyrene and EVOH is known as described in, for example, Japanese Patent Application Laid-Open No. 75239/1975. Although this composition shows improvement in hygroscopicity, oil resistance and gas barrier properties to a certain extent, machanical characteristics are insignificantly improved and moreover heat resistance is low. Thus the composition cannot be used in, for example, microwave oven or oven ranges. SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition to produce moldings (especially containers) which has gas barrier properties and in which food can be stored for a long period of time. Another object of the present invention is to provide a resin composition to produce moldings (especially containers) which has gas barrier properties and can be used to store food, and which is free from deformation even if heated in microwave oven or grill oven. The above objects can be attained by using a composition of (A) EVOH and (B) a styrene-based polymer having mainly syndiotactic configuration (hereinafter sometimes referred to as "SPS"). That is, the present invention provides a resin composition comprising (A) a saponified product of an ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60 mol% and a degree of saponification of at least 90% and (B) a styrene-based polymer having mainly syndiotactic configuration, with the weight ratio of (A) to (B), (A)/(B), being 5/95 to 95/5. Description of the preferred embodiments As a result of studies on blending various heat resistant resins and various gas barrier resins, it has been found that among a number of resins, a blend of SPS and EVOH is markedly excellent in moldability and characteristics of the resulting molding. For example, if EVOH is blended with polycarbonate or polyester, the heat stability of EVOH is not improved, while on the other hand, if EVOH is blended with SPS, the heat stability of EVOH is unexpectedly improved. If an acrylonitrile-based resin or a vinylidene chloride-based resin used as a gas barrier resin is blended with SPS, the resulting composition is unsuitable for practical use because coloration and generation of odor vigorously occur. On the contrary, in the case of the blend of EVOH and SPS in the present invention, such problems do not occur. When SPS and EVOH are blended, the resulting composition has unexpected gas barrier properties which are much superior to those of compositions of other polymers and EVOH. Although the reason for this is unclear, it is suspected that in the blend of SPS and EVOH, EVOH forms a specific stereostructure. In the present invention, EVOH (A) is a saponified product of an ethylene-vinyl acetate copolymer, having an ethylene content of 20 to 60 mol%, preferably 25 to 50 mol% and a degree of saponification of at least 90%, preferably at least 95%. If the ethylene content is less than 20 mol%, melt moldability is poor. On the other hand, if it is more than 60 mol%, gas barrier properties are poor. If the degree of saponification is less than 90%, gas barrier properties and heat stability are poor. EVOH may be copolymerized with other comonomers such as propylene, butylene, unsaturated carboxylic acids or their esters (e.g., (metha)acrylic acid, (metha)acrylic acid (e.g., methyl or ethyl) ester), vinyl silane compounds (e.g., vinyltrimethoxysilane or triethoxysilane), and vinylpyrrolidone (e.g., N-vinylpyrrolidone). Moreover EVOH may be blended with plasticizers, thermal stabilizers, unltraviolet absorbers, antioxidants, colorants, fillers and other resins (e.g., polyamide, partially saponified ethylene-vinyl acetate copolymer), The melt index (MI) (190°C, load of 2,160 g) is preferably 0.1 to 50 g/10 min and more preferably 0.5 to 20 g/10 min. A styrene-based polymer having mainly syndiotactic configuration (SPS) to be used as (B) in the present invention is a new material completely different from the conventional atactic polystyrene and has crystallization behavior and heat resistant characteristics as described in Japanese Patent Laid-Open Nos. 104818/1987, 187708/1987, 257948/1987, 257950/1987 and 77905/1988. This styrene-based polymer has a stereostructure that is mainly a syndiotactic structure, i.e., phenyl groups or substituted phenyl groups as side chains are located alternately at opposite positions relative to the main chain composed of carbon-carbon bonds, and its tacticity is quantitatively determined by a nuclear magnetic resonance (NMR) method. The tacticity as determined by NMR can be indicated in terms of proportion of structural units continuously connected to each other, i.e., a diad in which two structural units are connected to each other, a triad in which three structural units are connected to each other, and a pentad in which five structural units are connected to each other. SPS of the present invention has syndiotactic configuration such that the proportion in a racemic diad is at least 85%, or the proportion in a racemic pentad is at least 35%. SPS includes polystyrene, poly(alkylstyrene), poly(halogenated styrene), poly(alkoxystyrene), poly(vinyl benzoate) and their mixtures, and copolymers containing the above polymers as main components. The poly(alkylstyrene) includes polymethylstyrene, polyethylstyrene, polyisopropylstyrene and poly(tert-butylstyrene), The poly(halogenated styrene) includes polychlorostyrene and polybromostyrene. The poly(alkoxystyrene) includes polymethoxystyrene and polyethoxystyrene and the copolymer includes a copolymer of styrene and paramethylstyrene. The styrene-based polymer to be used in the present invention is not critical in molecular weight. The weight average molecular weight is preferably at least 10,000 and particularly preferably 50,000 to 3,000,000. If the weight average molecular weight is less than 10,000, stretching cannot be carried out sufficiently. The molecular weight distribution is not critical and may be narrow or broad. Such styrene-based polymers having mainly syndiotactic configuration can be produced by polymerizing styrene-based monomers (monomers corresponding to the above styrene-based polymers) in the presence of e.g., an inert hydrocarbon or in the absence of a solvent by the use of a catalyst comprising a titanium compound and a condensate of water and trialkylaluminum (see Japanese Patent Application Laid-Open No. 187708/1987). Within the range such that they do not deteriorate the objects of the present invention, other thermoplastic resins, rubbers, inorganic fillers, colorants, antioxidants, ultraviolet absorbers, cross-linking agents, crystallization accelerators, anti-static agent and the like can be blended with SPS. In connection with the weight ratio of EVOH (A) to SPS (B) in the resin composition of the present invention, (A):(B) is 5:95 to 95:5 and preferably 7:93 to 70:30, and most preferably 10:90 to 50:50. If (A):(B) is less than 5:95, the gas barrier properties are unsatisfactory. On the other hand, if (A):(B) is more than 95:5, the degree of thermal shrinkage increases and when heated at 240°C in an oven, the resulting container is readily colored. Uniformly dispersing EVOH and SPS is highly important because it exerts strong influences on the performance of the final container product. Thus a suitable method for preparing the resin composition is one in which EVOH and SPS are dry blended, melt extruded, and pelletized. It is desirable that an adhesive resin having adhesive properties (for example, an adhesive resin (C) as described hereinafter) to both of EVOH and SPS is added in an amount of 0.5 to 30 parts by weight, preferably 1 to 10 parts by weight per 100 parts by weight of the composition in order to more uniformly disperse EVOH and SPS, thereby removing unevenness in quality of the container product and further improving impact resistance. There are no special limitations on the adhesive resin (C). Preferred Examples of the adhesive resin (C) are acid anhydride-modified products of olefin or diene-based polymers such as (1) polymers from graft polymerization of unsaturated carboxylic acid or its anhydride (e.g., maleic anhydride) to olefin-based polymers or copolymers (e.g., low density polyethylene (LDPE), linear low density polyethylene (LLDPE), super low density polyethylene (SLDPE), an ethylene-vinyl acetate copolymer, an ethylene-(meth)acrylic acid copolymer, and an ethylene-(meth)acrylic acid ester (methyl ester or ethyl ester)), (2) acid anhydride (e.g., maleic anhydride) modified product of hydrogenated styrene-butadiene copolymer, (3) acid anhydride modified product of liquid butanediene, and (4) acid anhydride modified product of ethylenepropylene-diene copolymer. A plasticizer, a thermal stabilizer, an ultraviolet ray absorber, an antioxidant, a colorant, a filler, a resin (e.g., polyamide and a partially saponified ethylene-vinyl acetate copolymer), a crystallization accelerator and the like can be blended. Moldings obtained using the resin composition of the present invention include a film, a sheet, a container (cup) obtained by vacuum forming and/or pressure forming of a sheet, a preform, e.g., a parison, a container (bottle) obtained by blow molding a parison, a pipe, a parison obtained by cutting a pipe and a container (bottle) obtained by blow molding the parison, and a container (bottle) obtained by direct blow. The film includes a cover material and a pouch. These may be a single layer comprising a composition of (A) and (B), or may be multi-layer containing at least one layer of the composition of (A) and (B). In production of a multi-layer material with at least one layer of the resin composition of the present invention, it is preferred for the multi-layer material to be produced by coextrusion of a resin composition (blend) of (A) and (B) and a thermoplastic resin. In addition, the multi-layer material can be produced by, for example, a dry lamination method, an extrusion lamination method, a coinjection method, or a solution coating method. In some cases, each layer is stretched (uniaxially or biaxially) before or after lamination, or after lamination, further thermally fixed. In many cases, placing an adhesive resin (C) layer between the blend (composition) layer and the thermoplastic resin layer is desirable because it enables firmly bonding both layers together. The layer structure of multi-layer material using the resin composition of the present invention can include; blend layer/layer (A), blend layer/layer (B), blend layer/blend layer, blend layer/layer (A)/layer (B), layer (B)/blend layer/layer (A)/layer (B), blend layer/thermoplastic (TR) layer, blend layer/layer (A)/layer (TR), and those resulting sandwiching of layer (C) between at least one layer (A)/layer (B). In production of a molding, particularly a container by thermal molding, heat treatment of the molding in a die (mold), heated to a sufficient temperature to achieve a desired degree of crystallization, imparts heat resistance to the molding. The temperature range of the die is 90 to 250°C and preferably 120 to 220°C, and the molding is held in the die for 1 to 120 seconds, preferably 2 to 40 seconds. On the other hand, in production of a container by fabrication of a sheet or a parison, the container is quenched immediately after molding to minimize the degree of crystallization occuring after molding. It is desirable that the sheet or parison is heated as quickly as possible and thermally molded, and the heat molding temperature range is 90 to 280°C and preferably 100 to 280°C. The stretch ratio is, as an area ratio, not more than 20 times and preferably 3 to 15 times. Heat resistance is imparted to the container obtained by thermal molding, by treating the container in a die heated to a temperature sufficient to achieve the desired degree of crystallization. The temperature range of the die is 150 to 240°C and suitably 160 to 230°C, and the container is held in the die for 1 to 200 seconds and suitably 2 to 60 seconds. Care must be taken in removing the container from the die because the container is high in temperature and it is soft. In some cases, the shape of the container is adjusted by again placing the container in a die maintained at a low temperature or blowing cool air into the inside of the die. In the container thus obtained, the degree of thermal shrinkage of the barrel portion of the container (in the longitudinal direction) is not more than 10% and preferably not more than 6% even when the container is heated for 30 minutes in an oven range maintained at 240°C. Even if the container is treated under the same conditions as in retort sterilization (120°C, 30 minutes) and further heated for 30 minutes in an oven range maintained at 240°C, no distortion of the container considered due to delamination in the inside is observed. Scraps obtained by trimming in production of a molding (single-layer or multi-layer material) are pulverized and recovered as such or after pelletization. There are no special limitations as to a method of recovering scraps. For example, a method in which the scraps are pulverized, and after drying when they are wet, dry blended with the SPS, a method in which the pulverized scraps are pelletized and then dry blended with the SPS, and a method in which the pulverized scraps and the SPS are blended and pelletized can be employed. The proportion of the pulverized scraps to be blended (proportion based on the total weight of SPS and pulverized scraps) is usually about 5 to 95% by weight. At this time, in order to increase dispersability and thermal stability, and prevent distortion at the time of molding, it is sometimes preferred that one or more of an antioxidant, a dispersing agent, a compatibilizer and if necessary, a colorant be added. In some cases, the scraps recovered (Reg) are compounded to the aforementioned blend layer or are formed into a layer provided near the blend layer. The thickness of the molding is not critical. In general, the total thickness of the barrel portion is 200 to 3,000 µm, and the thickness ratio of the blend layer is 5 to 100%, suitably 10 to 80% based on the total thickness. The crystallinity of SPS layer in the multi-layer material is preferably at least 30% and more preferably at least 35%. If the crystallinity is less than 30%, heat resistance in the multi-layer material is not sufficient in some cases. The desired crystallinity can be obtained by stretching, molding such as blow molding and pressure molding, and heat treatment. The molding of the present invention as obtained above, particularly a container has excellent gas barrier properties and can be subjected to retort sterilization. Thus the container can be used to store food at ambient temperature for a long period of time. Moreover since the container is a food wrapping container having good heat resistance, the contents in the container can be heated by boiling, or in a microwave oven or a grill oven range (220 to 240°C), without transferring them into another container. The present invention is described in greater detail with reference to the following examples. Reference Example 1 (Production of Polystyrene having Mainly Syndiotactic Configuration) 2 L (L=liter) of toluene as a solvent, and 5 mmol of tetraethoxytitanium and 500 mmol (as aluminum atom) of methylaluminoxane as catalyst components were placed in a reactor, and 15 L of styrene was introduced into the reactor and polymerized at 55°C for 4 hours. After completion of the reaction, the reaction product was washed with a mixed solution of hydrochloric acid and methanol to decompose and remove the catalyst components, and then dried to obtain 2.5 kg of a styrene-based polymer (polystyrene). This polymer was extracted with methyl ethyl ketone as a solvent in a Soxhlet's extractor to obtain an extraction residue of 97% by weight. The weight average molecular weight of the extraction residue was 400,000. In a 13 C-NMR analysis (solvent 1,2-dichlorobenzene) of the polymer, an absorption ascribable to syndiotactic configuration was observed at 145.35 ppm. The syndiotacticity in racemic pentad as calculated from the peak area was 96%. The melting point was 268°C. Example 1 EVOH having an ethylene content of 44 mol%, a degree of saponification of 99.4% and MI of 5.5 g/10 min. as the EVOH (A) and SPS having a syndiotacticity of 96% and a melting point of 268°C as obtained in Reference Example 1 as the SPS (B) were blended at a weight ratio of (A)/(B)=30/70. In the first place, a sheet of layer (B)/blend layer/layer (B) was produced by the use of an apparatus for production of a three layer sheet using two kinds of materials. The thickness structure was 300 µm/400 µm/300 µm. This sheet was placed on a heat molding machine and molded at a sheet temperature of 280°C to obtain a cup. At this time, the temperature-of the die was 220°C, and thermal fixation was carried out for 5 seconds. The degree of thermal shrinkage of the container with a squeezing ratio of 0.5, after heating at 240°C for 30 minutes in an oven, was 4%. Gas barrier properties of the container, after adjusting to 20°C-65%RH, were measured by the use of an O 2 barrier tester (produced by Mocon), and PO 2 of the blend layer was as good as 90 cc·20 µm/m 2 ·day·atm. Salad oil was placed in this container and after sealing with an aluminum cover, the container was subjected to high temperature steam sterilization (retort sterilization) at 121°C for 30 minutes. The container was allowed to stand for 5 days at 20°C and 65%RH. At the end of this period, the top cover was opened, the salad oil was removed and the container was heated in an oven range maintained at 240°C for 30 minutes. No distortion due to layer separation was observed and the appearance was good. Gas barrier properties (20°C, 65%RH) after heating were good such that the PO 2 of the blend layer was 100 cc·20 µm/m 2 ·day·atm. Examples 2 to 4 and Comparative Examples 1 to 2 Containers were produced in the same manner as in Example 1 except that conditions were changed as shown in Table 1. The results are shown in Table 1. Example 5 EVOH having an ethylene content of 44 mol%, a degree of saponification of 99.4% and MI of 5.5 g/10 min. as the EVOH (A) and SPS having a syndiotacticity of 96% and a melting point of 268°C as the SPS (B) were blended at a weight ratio of(A)/(B)=20/80 and pelletized with a extuder having an inside diameter of 40 mm. These pellets were molded with an injection stretch blow molding machine to produce a 300-millilitter cup with a thickness of the barrel portion of 600 µm. The injection temperature was 300°C, the blow area ratio was 4 times, the die temperature was 210°C, and the heat fixing time was 5 seconds. Gas barrier properties of the container were measured with an apparatus (produced by Mocon) under conditions of 20°C-65%RH. PO 2 of the blend layer was 100 cc·20 µm/m 2 ·day·atm. Examples 6 to 7 , and Comparative Example 3 to 5 Containers were produced in the same manner as in Example 5 except that conditions were changed as shown in Table 2. The results are shown in Table 2.

Claims: A resin composition comprising 5 to 95 parts by weight of (A) a saponified product of an ethylene-vinyl acetate copolymer having an ethylene content of 20 to 60 mol% and a degree of saponification of at least 90% and 95 to 5 parts weight of (B) a styrene-based polymer having mainly syndiotactic configuration such that the proportion in a racemic diad is at least 85%, or the proportion in a racemic pentad is at least 35%. Use of the resin composition of claim 1 for the manufacture of a multi-layer material. Use of the resin composition of claim 1 for the manufacture of a molding having gas barrier properties and a high heat resistance. A resin composition of claim 1, additionally comprising 0.5 to 30 parts by weight of an adhesive resin (C) per 100 parts by weight of the composition of (A) and (B).

Inventors: AKIRA MOCHIZUKI, KEISUKE FUNAKI, KOMEI YAMASAKI, SHIRO NAGATA, TAICHI NEGI, TAKASHI SUMITOMO, AKIRA, MOCHIZUKI, KEISUKE, FUNAKI, KOMEI, YAMASAKI, SHIRO, NAGATA, TAICHI, NEGI, TAKASHI, SUMITOMO, KEISUKE, FUNAKI, C/O IDEMITSU PETROCHEM. CO., LTD., KOMEI, YAMASAKI, C/O IDEMITSU PETROCHEM. CO., LTD., TAKASHI, SUMITOMO, C/O IDEMITSU PETROCHEM. CO.,LTD
Applicants: IDEMITSU PETROCHEMICAL CO, KURARAY CO, IDEMITSU PETROCHEMICAL CO. LTD., KURARAY CO., LTD.
Application year: 1989
Main classification: C08L25
IPC codes: B32B27, C08L29, C08L25