LOW-MELTING POLYIMIDE COPOLYMERS AND THE PREPARATION THEREOF

Abstract: A low-melting copolyimide contains 30 to 90 mole% of imide repeating units of the formula: (b) 10 to 70 mole% of imide repeating units of the formula: the copolymer having a logarithmic viscosity number of 0.1 to 5 dl/g when measured in concentrated sulphuric acid at a temperature of 30 ± 0.01°C at a concentration of 0.5 g/dl. The copolymers are prepared by the polycondensation of appropriate tetracarboxylic anhydries and diamines to form a precursor which is subsequently converted to the polymer. (c), optionally, imide repeating units of the formula: and R⁵ is a carbocyclic aromatic group having 6 to 50 carbon atoms, but when R⁴ is

Description: The present invention relates to melt-mouldable low-melting polymide copolymers and the preparation thereof. Polyimides are widely used as protective and insulating materials in electronic equipment and are also used as adhesive materials, films and structural materials, because they are organic polymers having high heat resistance and good electrical and mechanical characteristics. However, conventional polyimides have high melting points or glass transition temperatures, which are above or in the vicinity of the thermal decomposition temperatures of most polyimides. Thus, it is usually difficult to melt-mould polyimides. As a result, the moulding of polyimides has been carried out almost entirely with the moulding techniques employed for thermosetting resins, for example, by coating and calcining a precursor or a soluble polyimide solution of the polyimide, or by compression-moulding a powdered polyimide at high temperature and pressure. A polyimide capable of being processed by the moulding techniques for thermoplastic resins, such as extrusion and injection moulding, would lead to an improvement in productivity and make possible the moulding of articles having various shapes. Accordingly, various proposals have been made for meltable polyimides. For example, in JP-A-203132/1986, there is suggested a crystalline silicone imide copolymer and in JP-A-250031/1986 there is described a specific pyromellitic imide copolymer as a meltable polyimide copolymer. However, the copolymers referred to in JP-A-2031132/1986 have melting points of from 140 to 210°C, judging from the values given in the examples, and it seems that heat resistance has been sacrificed in order to improve mouldability. In JP-A-250031/1986, it is said that the proposed copolymer can be moulded into a film by melt-press at 400°C. However, no melting point for the copolymer is given and it is not apparent whether or not the copolymer is, in fact, a crystalline polymer. In general, even polyimides comprising an aromatic skeleton as the main component are partially decomposed at temperatures above 450°C, so that articles moulded therefrom will be noticeably coloured. From the point of view of ease of moulding, a practical temperature for extrusion and injection moulding is usually about 50°C above the melting point of the polyimide. Thus, it is preferable that the polyimide has a melting point of 400°C or less, and additionally in view of intended uses where heat resistance is required, the polyimide preferably has a melting point of 300°C or more. Thus polyimides having melting points of 300 to 400°C are very valuable. It is an object of the invention to provide a polyimide having a melting point of about 300 to 400°C and also to provide a method for preparing such a polyimide. According to a first embodiment of the invention there is provided a low-melting polyimide containing (a) 30 to 90 mole% of imide repeating units of the formula: (b) 10 to 70 mole% of imide repeating units of the formula: (in which R¹ is a group and/or and (c), optionally, imide repeating units of the formula: (in which R⁴ is a group and/or and R⁵ is a carbocyclic aromatic group having 6 to 50 carbon atoms, but when R⁴ is R⁵ is not a group and when R⁵ is R⁴ is not a group the copolymer having a logarithmic viscosity number of 0.1 to 5 dl/g when measured in concentrated sulphuric acid at a temperature of 30 ± 0.01°C at a concentration of 0.5 g/dl. In accordance with a second embodiment of the invention there is provided a method of preparing a polyimide as defined above which method comprises the steps of (a) reacting a diacid anhydride component composed of A¹ mole of a compound of the formula: and A² mole of a compound of the following formula: (in which R² is a group with a diamine component composed of B¹ mole of a compound of the formula: B² mole of a compound of the formula: NH₂-R¹-HN₂ (VII) (in which R¹ has the meaning defined above). and B³ mole of a compound of the formula: NH₂-R³-HN₂ (VIII) (in which R³ is a carbocyclic aromatic group having 6 to 50 carbon atoms, other than a group the relationship between A¹, A², B¹, B² and B³ meeting the requirements set out in the formulae: 40 ≦ 100A¹/(A¹+A²) ≦ 100 (IX) 30 ≦ 100B¹/(B¹+B²+B³) ≦ 90 (X) 10 ≦ 100B²/(B¹+B²+B³) ≦ 70 (XI) 0 ≦ 100B³/(B¹+B²+B³) ≦ 60 (XII) the reaction being carried out at a temperature of 0 to 200°C under conditions such that the anhydride of formula (IV) (which accounts for at least 30 mole% of the total anhydride) is reacted with the diamine of formula (VI) (which accounts for at least 30 mole% of the total diamine) and the anhydride of formula (IV) (which accounts for at least 10 mole% of the total anhydride) is reacted with the diamine of formula (VII) (which accounts for at least 10 mole% of the total diamine), in order to form a polyimide precursor; and (b) heating the precursor to a temperature of 100 to 400°C or adding an imide formation accelerator thereto and converting the precursor into the imide at a relatively low temperature of 10 to 100°C. The polyimide copolymer of the invention can be prepared as described above. The reaction is performed under conditions such that the anhydride of formula (IV) is reacted with the diamine of formula (VI) and the anhydride of formula (IV) is reacted with the diamine of formula (VII). Providing these conditions are satisfied, the starting materials (IV), (V), (VI), (VII) and (VIII) can be mixed together at one time and reacted. Alternatively, after reaction between compounds (IV) and (VI), the compounds (IV) and (VII) may be reacted. In some cases, the compounds (IV) and (VI) may be first reacted with each other, and afterward the compounds (IV) and (VII) may be then reacted, and the reaction between the compound (IV) and (VI) may be performed again. In addition, these operations may be repeated for different starting materials in order to obtain a multi-block copolymer. Examples of tetracarboxylic acid dianhydrides of formula (V) include pyromellitic acid dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, 2,3,3′,4′-benzophenonetetracarboxylic acid dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and bis(3,4-dicarboxyphenyl)sulphone dianhydride. Examples of diamines of formula (VII) include methaphenylenediamine and 3,4′-diaminodiphenyl ether. Examples of diamine of formula (VIII) include 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphide, 4,4′-di(meta-aminophenoxy)diphenyl sulphone, 4,4′-di(paraaminophenoxy)diphenyl sulphone, paraphenylenediamine, benzidine, 2,2′-diaminobenzophenone, 4,4′-diaminobenzophenone, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 1,5-diaminonaphthalene, 1,8-diaminonophthalene and 2,2-bis[4-(4-aminophenyoxy)phenyl]hexaphloropropane. Preferred reaction solvents include, for example, N-methyl-2-pyrrolidone, dimethylacetamide, dimethylformamide, dimethyl sulphoxide, tetramethylurea, pyridine, dimethyl sulphone, hexamethylphosphone, methylformamide and N-acetyl-2-pyrrolidone. These may be used alone or in admixture. It is preferred that the total amount of the diacid anhydrides is substantially equimolar to that of the total diamines. This facilities the formation of a polymer having a high molecular weight. The reaction solvent is preferably used in an amount of 50% by weight or more based on the total amount of the raw materials and the solvent. If the amount of the solvent is less than this level, stirring is at times difficult. After the above-mentioned five kinds of raw materials (in the case of the minimum, three kinds of raw materials) have been fed to a reactor at one time or dividedly, the reaction is performed at a temperature of 0 to 200°C for several hours or several tens of hours. In this case, it is necessary that the reaction is carried out under conditions that the acid anhydride represented by the formula (IV) which accounts for at least 30 mole% of the whole diacid anhydride is reacted with the diamine represented by the formula (VI) which accounts for at least 30 mole% of the whole diamine and under conditions that the acid anhydride represented by the formula (IV) which accounts for at least 10 mole% of the whole diacid anhydride is reacted with the diamine represented by the formula (VII) which accounts for at least 10 mole% of the whole diamine, as described above. As a result of the reaction, a polyimide precursor solution is obtained. This solution is then heated up to a temperature of 100 to 400°C, or alternatively when an acid anhydride such as acetic anhydride and/or a known imide formation accelerator such as pyridine or isoquinoline is added to the solution, and the precursor is converted into an imide at a relatively low temperature of 10 to 100°C. In this way, the low-melting polyimide copolymer is obtained which contains 30 to 90 mole% of the aforesaid imide repeating unit (I), contains 10 to 70 mole% of the aforesaid imide repeating unit (II), contains or does not contain the aforesaid imide repeating unit (III), and has a logarithmic viscosity number of 0.1 to 5 dl/g when measured in concentrated sulfuric acid at a temperature of 30 ± 0.01°C at a concentration of 0.5 g/dl. In the copolymer of the present invention, the higher the proportion of the repeating unit (I) becomes, the higher the melting point of the copolymer becomes; the higher the proportion of the repeating unit (II) becomes, the lower the melting point of the copolymer becomes. It is unpreferable that the repeating unit (III) is in excess of 60 mole%, because a clear melting point is not shown on occasion. The average molecular weight of the polyimide of the present invention is such that the logarithmic viscosity number measured under the above-mentioned specific conditions is in the range of 0.1 to 5 dl/g. This logarithmic viscosity number (η inh ) referred to in the present invention would be measured from the above-mentioned measurement conditions, but it can be defined in detail as follows: η inh = (ℓn η/η o )/C wherein η is a value measured by the use of a Ubbelohde's viscometer in concentrated sulfuric acid at a concetration of 0.5 g/dl at a temperature of 30 ± 0.01°C, and η o is a value of concentrated sulfuric acid measured by the use of the Ubbelohde's viscometer at the identical temperature. When the logarithmic viscosity number is less than 0.1, the obtained copolymer has poor mechanical strength, and when it is in excess of 5, the synthesis of the copolymer was difficult. The fundamental structure of the polyimide copolymer obtained by the method of the present invention is composed of the repeating units represented by the formulae (I) and (II), and if necessary, the repeating unit of the formula (III) is further contained therein. These repeating units may be present in a random state, a block state or any other copolymerization state. Typical examples of the imide repeating unit represented by the formula (III) are as follows: The polymer of the present invention suitably has a melting point of 300 to 400°C. When the melting point of the polymer is less than 300°C, heat resistance is poor, which lowers the value of products made therefrom. On the contrary, when it is more than 400°C, a part of the polymer is thermally decomposed, so that the molded articles are noticeably colored unpreferably. Next, reference will be made to the usage of the polyimide copolymer of the present invention. Like the usual polyimide, needless to say, the polyimide copolymer of the present invention, while being in the state of the liquid precursor (polyamic acid), may be subjected to spin coating, printing, casting or the like on various substrates, and heating follows to give off the used solvent and to perform the reaction of the imide formation, thereby molding the copolymer. However, as the preferable usage, the melt-molding of the copolymer is accomplished by extruding or injection molding the powder, flakes or grains of the polyimide copolymer of the present invention which have been prepared by heating and drying the polyimide to remove volatile components such as the solvent. To sum up, the polyimide copolymer of the present invention can be molded into various molded articles, fibers, films, sheets and the like by heating the polyimide copolymer at a temperature of its melting point or more. Since having a melting point of about 300 to about 400°C, the polyimide copolymer of the present invention is excellent in heat resistance and permits the application of melt-moldings such as extrusion and injection molding. Therefore, the industrial advantage of the present invention is great. EXAMPLES Now, the present invention will be described in detail in reference to examples and comparative examples, but needless to say, the scope of the present case should not be limited by these examples. Example 1 One-liter flask equipped with a stirrer, a dropping funnel, a thermometer, a condenser and a nitrogen replacer was fixed in a thermostatic chamber. After the atmosphere in the flask had been replaced with a nitrogen gas, 500 g of dehydrated and purified N-methyl-2-pyrrolidone (hereinafter referred to simply as NMP), 38.94 g (0.106 mole) of 4,4′-bis(4-aminophenoxy)biphenyl (hereinafter referred to simply as BAPB) and 4.89 g (0.0452 mole) of methaphenylenediamine (hereinafter referred to simply as m-PDA) were added thereto, and stirring was continued to dissolve them. Afterward, 44.42 g (0.151 mole) of 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (hereinafter referred to simply as BPDA) was added to the solution in the flask slowly over 30 minutes through the dropping funnel, and reaction was continued. During this period of time, a reaction temperature was in the range of 10 to 20°C. The reaction was further continued at this temperature for 15 hours in order to obtain a viscous varnish. This varnish was then poured into a great deal of acetone, and deposited powder was collected by filtration, thereby obtaining polyamic acid powder. This powder was then heated at 300°C for 2 hours in an oven, so that a polyimide copolymer of the present invention was prepared. According to the measurement of a melting point by means of a differential scanning calorimeter, the thus prepared copolymer showed an endothermic peak at 348°C and melted. This denotation of the melting point testifies that the polymer was crystalline. Furthermore, the logarithmic viscosity number of the polymer in concentrated sulfuric acid was 0.82 dl/g. The infrared absorption spectrum of the polymer is shown in Fig. 1. The measurement of a melting point by the use of the differential scanning calorimeter DSC-1500M manufactured by Sinku-riko Co., Ltd. was carried out by raising the temperature of the polymer at a temperature rise rate of 5°C/minute, and reading the top of an endothermic peak. In the following examples, the same measurement manner was employed. Example 2 The same procedure as in Example 1 was repeated with the exception that 30.53 g (0.0829 mole) of BAPB, 8.96 g (0.0829 mole) of m-PDA and 48.76 g (0.166 mole) of BPDA were used, in order to obtain a viscous varnish. This varnish was then treated as in Example 1, whereby a polyimide copolymer of the present invention was prepared which had a melting point of 322°C by the use of a differential scanning calorimeter and a logarithmic viscosity number of 0.58 dl/g in concentrated sulfuric acid. Example 3 By using the same devices and procedure as in Example 1, 43.34 g (0.118 mole) of BAPB and 2.24 g (0.0207 mole) of m-PDA were dissolved in 500 g of NMP, and while the solution was maintained at a temperature of 20 to 30°C, 20.36 g (0.0692 mole) of BPDA was added to the solution. Stirring was continued at this temperature for 6 hours, so that the solution was uniformed. Afterward, 22.30 g (0.0692 mole) of 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride was added thereto, and reaction was further perfomed at this temperature for 3 hours in order to obtain a viscous varnish. This varnish was then added dropwise to a great deal of an isoquinoline/acetic anhydride mixed solution (volume ratio = 1/10) to obtain white powder, and the latter was then collected by filtration. The powder was then washed in acetone and then dried at 80°C for 10 hours in a vacuum dryer in order to prepare a polyimide copolymer of the present invention. With regard to the thus prepared polyimide copolymer, its melting point was 386°C when measured by a differential scanning calorimeter, and its logarithmic viscosity number in concentrated sulfuric acid was 1.3 dl/g. Example 4 By using the same devices and procedure as in Example 1, 18.59 g (0.0505 mole) of BAPB was poured into and dissolved in 500 g of NMP, and while the solution was maintained at a temperature of 20 to 30°C, 14.85 g (0.0505 mole) of BPDA was added to the solution. Reaction was performed at this temperature for 4 hours, and afterward, 8.66 g (0.0433 mole) of 3,4′-diaminodiphenyl ether (hereinafter referred to simply as 3,4′-DDE) and 12.74 g 0.0433 mole) of BPDA were added thereto. The reaction was further perfomed at this temperature for 2 hours. Additionally, 18.59 g (0.0505 mole) of BAPB and 14.85 g (0.0505 mole) of BPDA were than added thereto, and the reaction was performed for 8 hours in order to obtain a viscous varnish. This varnish was then treated as in Example 1 to obtain polyamic acid powder, and the latter was then heated at 240°C for 2 hours in an oven in order to prepare a polyimide copolymer of the present invention. With regard to the thus prepared polyimide copolymer, its melting point was 382°C when measured by a differential scanning calorimeter, and its logarithmic viscosity number in concentrated sulfuric acid was 1.8 dl/g. Example 5 By using the same devices and procedure as in Example 1, 21.38 g (0.0580 mole) of BAPB, 11.62 g (0.0580 mole) of 3,4′-DDE and 12.55 g (0.0290 mole) of bis[4-(4-aminophenoxy)phenyl] sulfone was poured into and dissolved in 500 g of NMP, and while the solution was maintained at a temperature of 15 to 20°C, 42.69 g (0.145 mole) of BPDA was added to the solution. Reaction was performed for 20 hours in order to obtain a viscous varnish. This varnish was then treated as in Example 1 to obtain polyamic acid powder, and the latter was then heated at 240°C for 2 hours in an oven in order to prepare a polyimide copolymer of the present invention. With regard to the thus prepared polyimide copolymer, its melting point was 368°C when measured by a differential scanning calorimeter, and its logarithmic viscosity number in concentrated sulfuric acid was 1.9 dl/g. Example 6 By using the same devices and procedure as in Example 1, 25.67 g (0.0697 mole) of BAPB, 5.58 g (0.0279 mole) of 3.4′-DDE and 32.81 g (0.112 mole) of BPDA were poured into and dissolved in 500 g of NMP, and reaction was performed at a temperature of 10 to 20°C for 10 hours. Afterward, 18.09 g (0.0418 mole) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane was added to the solution, and the reaction was further performed for 2 hours. Additionally, 6.08 g (0.0279 mole) of pyromellitic acid dianhydride was added thereto. The reaction was further perfomed for 5 hours in order to obtain a viscous varnish. This varnish was then treated as in Example 1 to obtain polyamic acid powder, and the latter was then heated at 240°C for 2 hours in an oven in order to prepare a polyimide copolymer of the present invention. With regard to the thus prepared polyimide copolymer, its melting point was 390°C when measured by a differential scanning calorimeter, and its logarithmic viscosity number in concentrated sulfuric acid was 2.2 dl/g. Example 7 By using the same devices and method as in Example 1, 35.54 g (0.0965 mole) of BAPB, 5.52 g (0.0276 mole) of 3.4′-DDE and 1.49 g (0.0138 mole) of m-PDA were poured into and dissolved in 500 g of dimethylacetamide. Afterward, 16.22 g (0.0551 mole) of BPDA was added to the solution, and reaction was then performed at 30 to 40°C for 10 hours. Additionally, 29.61 g (0.0827 mole) of bis(3,4-dicarboxyphenyl) sulfone dianhydride was then added thereto, and the reaction was further perfomed for 6 hours in order to obtain a viscous varnish. This varnish was then treated as in Example 1 to obtain polyamic acid powder, and the latter was then heated at 240°C for 2 hours in an oven in order to prepare a polyimide copolymer of the present invention. With regard to the thus prepared polyimide copolymer, its melting point was 363°C when measured by a differential scanning calorimeter, and its logarithmic viscosity number in concentrated sulfuric acid was 1.0 dl/g. Comparative Example 1 By using the same devices and method as in Example 1, 49.06 g (0.133 mole) of BAPB was poured into and dissolved in 500 g of NMP. Afterward, 39.18 g (0.133 mole) of BPDA was added to the solution, and reaction was then performed at 20 to 30°C for 15 hours in order to obtain a viscous varnish. This varnish was then treated as in Example 1 to obtain polyamic acid powder, and the latter was then heated at 240°C for 2 hours in an oven in order to prepare a polyimide copolymer. With regard to the thus prepared polyimide copolymer, its melting point was 408°C when measured by a differential scanning calorimeter, and its logarithmic viscosity number in concentrated sulfuric acid was 2.1 dl/g. Comparative Example 2 The same procedure as in Comparative Example 1 was repeated with the exception that 35.73 g (0.178 mole) of 3,4′-DDE was used as a diamine and 52.51 g (0.178 mole) of BPDA was used as a dianhydride, in order to carry out a similar reaction and treatment, thereby obtaining a polyimide. With regard to this polyimide, its logarithmic viscosity number in concentrated sulfuric acid was 1.4 dl/g, and its melting point was absent until 450°C when measured by a differential scanning calorimeter. Comparative Example 3 The same procedure as in Comparative Example 1 was repeated with the exception that 23.71 g (0.219 mole) of m-PDA was used as a diamine and 64.53 g (0.219 mole) of BPDA was used as a dianhydride, in order to carry out a similar reaction and treatment, thereby obtaining a polyimide. With regard to this polyimide, its logarithmic viscosity number in concentrated sulfuric acid was 0.42 dl/g, and its melting point was absent until 450°C when measured by a differential scanning calorimeter.

Claims: 1. A polyimide copolymer having a melting point of from 300 to 400°C, as measured by differential scanning calorimitry, containing (a) 10 to 90 mole% of imide repeating units of the formula: (b) 10 to 70 mole% of imide repeating units of the formula: (in which R¹ is a group and/or and (c), optionally, up to 60 mole.% of imide repeating units of the formula: (in which R⁴ is a group and R⁵ is a carbocyclic aromatic group having 6 to 50 carbon atoms, but when R⁴ is R⁵ is not a group and when R⁵ is R⁴ is not a group the copolymer having a logarithmic viscosity number of 0.1 to 5 dl/g when measured in concentrated sulphuric acid at a temperature of 30 ± 0.01°C at a concentration of 0.5 dl/g 2. A method for preparing a low-melting copolyimide as defined in claim 1, which method comprises the steps of (a) reacting diacid anhydride component comprising A¹ mole of a compound of the formula and A² mole of a compound of formula: (in which R² is a group with a diamine component comprising B¹ mole of a compound of the formula: B² mole of a compound of the formula NH₂-R¹-HN₂ (VII) (in which R¹ has the meaning defined above). and B³ mole of a compound of the formula: NH₂-R³-NH₂ (VIII) (in which R³ is a carbocyclic aromatic group having 6 to 50 carbon atoms, other than a group the relationship between A¹, A², B¹, B² and B³ meeting the requirements set out in the formula: 40 ≦ 100A¹/(A¹+A²) ≦ 100 (IX) 30 ≦ 100B¹/(B¹+B²+B³) ≦ 90 (X) 10 ≦ 100B²/(B¹+B²+B³) ≦ 70 (XI) 0 ≦ 100B³/(B¹+B²+B³) ≦ 60 (XII) the reaction being carried out in the presence of a solvent at a temperature of 0 to 200°C under the conditions such the anhydride of formula (IV) is reacted with the diamine of formula (VI) and the anhydride of formula (IV) is reacted with the diamine of formula (VII), in order to form a polyimide precursor; and heating the precursor at 100 to 400°C or adding an imide formation accelerator thereto and converting the precursor into the imide at a relatively low temperature of 10 to 100°C. 3. A method according to Claim 2 wherein the tetracarboxylic acid dianhydride of formula (V) is pyromelitic acid dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, 2,3,3′,4′-benzophenonetetracarboxylic acid dianhdyride, bis(3,4-dicarboxyphenyl) ether dianhydride and/or bis(3,4-dicarboxyphenyl) sulphone dianhydride. 4. A method according to claim 2 or claim 3 wherein the diamine of formula (VII) is methaphenylenediamine or 3,4′-diaminodiphenyl ether. 5. A method according to any one of claims 2-4 wherein the diamine of formula (VIII( is 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphone, 4,4′-diaminodiphenyl sulphide, 4,4′-di(meta-aminophenoxy)diphenyl sulphone, 4,4′-di(para-aminophenoxy)diphenyl sulphone, para-phenylene-diamine, benzidine, 2,2′-diaminobenzophenone, 4,4′-diaminobenzophenone, 2,2-bis[4-(4-aminophenoxy)phenyl]-propane, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)- benzene, 1,5-diaminonaphthalene, 1,8-diaminonaphthalene or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane. 6. A method according to any one of claims 2-5 wherein the reaction solvent is N-methyl-2-pyrrolidone, dimethylacetamide, dimethylformamide, dimethyl sulphoxide, tetramethylurea, pyridine, dimethyl sulphone, hexamethylphosphoneamide, methylformamide or N-acetyl-2-pyrrolidone.

Inventors: KUNIMUNE, KOUICHI, MAEDA, HIROTOSHI
Applicants: CHISSO CORPORATION
Application year: 1989
Main classification: C08G73
IPC codes: C08G73