Microstrip antenna

Abstract: In the microstrip antenna a circular radiation element (2) is provided on a grounded conductive planar element (1) through a dielectrlc layer (3) having a small dielectric loss, and this radiation element resonates in TM₀₁ mode. A feed point is located at substantially the center of the circular radiation element (2), and an impedance matching device (10) is interposed between the feed point and a coaxial connector (4). The inside conductor of the impedance matching device (10) is connected to the feed point to supply energy to the radiation element (2), and an outside conductor is connected to substantially the center of the conductive planar element (1) so as to be grounded. Further, this antenna is provided on the microstrip antenna at its topmost portion in which a plurality of conductive planar elements are stacked, thereby forming the microstrip antenna which is applicable to a plurality of frequencies.

Description: BACKGROUND OF THE INVENTION Field of the Invention The present invention relates generally to microstrip antennas and more particularly to a microstrip antenna having a circular radiation element. Description of the Prior Art It has been proposed that a wireless communication system is established between a base station and a number of mobile stations via a geostationary satellite (see Japanese Patent Application No. 63-331494). Fig. 1 shows such previously-proposed wireless communication system, in which a down channel between a base station CS and a number of mobile stations M is established via a geostationary satellite STd, while an up channel between the mobile stations M and the base station CS is established via a geostationary satellite STu. The frequencies of the up channel and the down channel are selected to be, for example, 1.6 GHz and 4.2 GHz, respectively. In this wireless communication system, a user HQ such as a transportation company and the base station CS are connected via another communication network line L, by way of example. In the above-noted wireless communication system, the mobile station M side utilizes a microstrip antenna because it is simple in construction and has a low physical profile. The microstrip antenna according to the prior art will be described with reference to Figs. 2 and 3. As shown in Figs. 2 and 3, a circular radiation element 3 is laminated (i.e. stacked) on a rectangular ground plane conductor element 1 via a dielectric element 2 made of a material such as fluoroplastics having a low dielectric loss. A feed point 3f is located at the position offset from the center of the circular radiation element 3, and is connected with an inside conductor 5 of a coaxial feed line 4. Reference numeral 6 designates an outside conductor forming the coaxial feed line 4. When the circular radition element 3 in this microstrip antenna resonates in TM₁₁ mode (i.e. waveguide dominant mode), a surface current is distributed as shown by dashed lines in Fig. 2, and a directivity becomes unilateral in which a maximum gain is provided in the front direction. In the mobile wireless communication system utilizing a geostationary satellite or the like, an elevation angle of geostationary satellite as seen from a mobile station falls within a range of from about 25 to 65 degrees in the area of middle latitude. When the prior-art microstrip antenna as described above is used in the mobile station side, the maximum gain direction of antenna and the elevation angle of geostationary satellite do not coincide with each other, degenerating the antenna gain. In order to obtain a desired directivity matched with the angle of elevation of the geostationary satellite, it is generally proposed to array microstrip antennas in which a plurality of microstrip antennas are properly connected to feed radiation elements with different phases. This type of microstrip array antenna is, however, increased in size and becomes complicated in structure. The mobile station side in the above-noted wireless communication system needs independent antennas respectively corresponding to the up channel and down channel. IEEE Transactions on Antennas and Propagation (Vol. 27, No. 3, pp. 270 to 273, published on March, 1978), for example, reports a two-frequency antenna in which a non-feed circular conductor element is coaxially stacked (i.e. laminated) on the radiation element 3 of the prior-art microstrip antenna (shown in Figs. 2 and 3) via the dielectric element. This two-frequency antenna can not cover two frequencies (1.6 GHz and 4.2 GHz) whose frequency ratio is very large, for example, about 1 : 2.6 as in the case where it is utilized in the afore-noted wireless commuication system. For a comprehensive study of microwave antennas, and microstrip antennas in particular, reference may be made to "Microstrip Antennas", by I. J. Bahl, P. Bhartia, Artech House, 1982, pp 86-96. The microstrip antennas disclosed therein comprise a low-loss dielectric layer sandwiched between a grounded planar element and an overlying circular radiation element. Various excitation modes are discussed. For an example of a microstrip antenna corresponding to the preamble of claim 4, reference may be made to EP-A-0 188 087. Finally, US-A-4 651 159 discloses a circularly polarized microstrip antenna in which a circular radiative element rests on a dielectric base which is separated from the antenna substrate by an air gap, the dielectric base being supported by spacer blocks. The air gap is intended to form an additional dielectric layer. OBJECTS AND SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an improved microstrip antenna which can eliminate the defects encountered with the prior art. It is another object of the present invention to provide a single microstrip antenna which has a directivity on a vertical plane in a range of a predetermined angle of elevation and has a non-directional radiation pattern on a horizontal plane. It is still another object of the present invention to provide a microstrip antenna of a simplified arrangement which has a directivity on a vertical plane in a range of a predetermined angle of elevation in a plurality of frequency bands apart from each other and has a non-directional radiation pattern on a horizontal plane. It is a further object of the present invention to provide a microstrip antenna in which a soldering-process for connecting a portion having a large area is not needed and an antenna and a feed system can be positively connected mechanically and electrically with ease by a simple structure. It is a yet further object of the present invention to provide a microstrip antenna which is thin in structure and in which the employment of a coaxial feed line and the soldering-process for connecting a portion having a large area are not needed, and an antenna, a feed circuit and a coaxial connector can be positively connected mechanically and electrically with ease. The above-noted objects are attained, according to the invention by a microstrip antenna as defined in claims 1 and 4 According to the arrangement defined in claim 1, the main radiation beam covers a vertically-polarized wave on a vertical plane in a range of a predetermined angle of elevation, and the microstrip antenna of the invention has a non-directional on a horizontal plane. According to the arrangement of claim 4, the conductive circular element having the smallest diameter operates as a radiation element for the highest frequency band and other conductive circular elements operate as radiation elements for lower frequency bands as well as operate as ground planar conductive elements for adjacent smaller-diameter conductive circular elements, whereby the microstrip antenna of the invention is made small in size and simplified in structure and provides a directivity of a desired conical-beam shape over a plurality of frequency bands. These and other objects, features and advantages of the present invention will be apparent from the following detailed description of preferred embodiments when read in conjunction with the accompanying drawings in which like reference numerals are used to identify the same or similar part in the several views. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a pictorial and schematic representation of a mobile wireless communication system utilizing geostationary satellites according to the prior art; Fig. 2 is a top planar view of a microstrip antenna according to the prior art; Fig. 3 is a diagrammatic view of a section of the prior-art microstrip antenna, taken along line III - III of Fig. 2; Fig. 4 is a top planar view illustrating a microstrip antenna according to an embodiment of the present invention; Fig. 5 is a diagrammatic view of a section of the microstrip antenna, taken along line V - V of Fig. 4; Fig. 6 is a schematic diagram illustrating in cross-section a main component of the microstrip antenna according to the present invention; Fig. 7 is a schematic diagram to which reference will be made in explaining how the impedance of the microstrip antenna of the invention is changed with drive frequencies; Fig. 8 shows a typical H-plane radiation pattern for the microstrip antenna of the invention in which a diameter of a ground plane conductor is 160 mm; Fig. 9 shows a typical H-plane radiation pattern for the microstrip antenna of the invention in which the diameter of the ground plane conductor is 130 mm; Fig. 10 shows a typical H-plane radiation pattern for the microstrip antenna of the invention in which the diameter of the ground plane is 200 mm; Fig. 11 is a top planar view illustrating the microstrip antenna according to a second embodiment of the present invention; Fig. 12 is a diagrammatic view of a section of the microstrip antenna, taken along line XII - XII of Fig. 11; Fig. 13 shows a typical H-plane radiation pattern for the microstrip antenna of the second embodiment in which the radiation element is resonated at frequency of 4.2 GHz; Fig. 14 shows a typical H-plane radiation pattern for the microstrip antenna of the second embodiment in which the radiation element is resonated at frequency of 1.6 GHz; Fig. 15 is a schematic diagram showing a hybrid circuit used in the second embodiment of the microstrip antenna according to the present invention; Fig. 16 is a diagrammatic view of a section illustrating a microstrip antenna according to a third embodiment of the present invention; Fig. 17 is a top planar view of a main portion of the microstrip antenna, taken along line XVI - XVI of Fig. 16; Fig. 18 is a top planar view illustrating the microstrip antenna according to a fourth embodiment of the present invention; Fig. 19 is diagrammatic view of a section of the microstrip antenna, taken along line XVIII - XVIII of Fig. 18; Fig. 20 is a diagrammatic view of a section illustrating the microstrip antenna according to a fifth embodiment of the present invention; and Fig. 21 is a perspective view illustrating a hybrid circuit used in the microstrip strip antenna of Fig. 20 in the exploded state. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS A microstrip antenna according to an embodiment of the present invention will now be described with reference to Figs. 4 to 10. The arrangement of the embodiment of the present invention is represented in Figs. 4 and 5. In Figs. 4 and 5, like parts corresponding to those of Figs. 2 and 3 are marked with the same references and therefore need not be described fully. It will be seen in Figs. 4 and 5 that a circular ground planar conductive element 1 and a circular radiation element 2 have interposed therebetween a dielectric substrate 3 which has the same diameter as that of the radiation element 2 and which is made of a material such as fluoroplastics having a low dielectric loss. For example, the ground planar conductive element 1 has a diameter d₁ of 160 mm, and the radiation element 2 has a diameter d₂ of 53 mm. A thickness t3 of dielectric substrate 3 is, for example, 1.6 mm and a dielectric constant ε r of dielectric substrate 3 is about 2.6. In this embodiment, as shown in Figs. 4 and 5, a feed point 2f is provided at the center of the radiation element 2, and an impedance matching device 10 is interposed between the feed point 2f and a coaxial connector 4. As shown in Fig. 6, the impedance matching device 10 is formed by coaxially providing inside conductors 311 and 312, which have predetermined lengths and have different diameters, within a common external conductor 313. An impedance Z₀ of the microstrip antenna in this embodiment is expressed, as will be discussed below, as follows when the drive frequency is 4.185 GHz. Z 0a = 52.207Ω - j68.215Ω In association with the above-noted impedance Z₀, diameters d₁₁ and d₁₂ of inside conductors 311 and 312 are 1.0 mm and 1.5 mm, and lengths ℓ₁₁ and ℓ₁₂ thereof are 12 mm and 18 mm, respectively. Further, an inside diameter of external conductor 313 is selected to be, for example, 2.3 mm. A distant electric field of the circular microstrip antenna is generally expressed by the following equation (1) in a polar coordinate system in which the center of the radiation element assumes an original point. where V₀ = tE₀Jn(ka) B P (x) = J n-l (x) + J n+l (x) = 2n x Jn (x) B M (x) = J n-l (x) - J n+l (x) = 2 d dx Jn (x) k₀ = 2π/λ, k = k₀· εr In the equation (1), Jn(x) represents the n-order Bessel function, a the radius of radiation element, t the thickness of dielectric substrate and λ the wavelength. Further, E₀ represents a constant. In the equation (1), only the terms of ϑ and  represent the radiation pattern directivity of antenna so that, if they are represented as Dϑ and D, they yield the following equation (2). When the circular microstrip antenna resonates in the TM 0l mode, then n = 0 is established in the equation (l), accordingly, in the equation (2). Thus, the following equalities are satisfied. Hence, this modifies the equation (2) as the following equation (3) Thus, when the microstrip antenna resonates in the TM₀₁ mode, the radiation electric field of the circular microstrip antenna contains only the ϑ component and the magnitude thereof is expressed by the function of only ϑ regardless of . In other words, the radiation electric field is a vertical polarized wave and has a non-directional on a horizontal plane. The radius a of the radiation element is expressed by the following equation (4). a = x 0l c 2π εr f + α = x 0l 2π εr λ + α where d dx J₀(x₀₁) = 0 In the equation (4), α represents a correction term for the thickness t of the dielectric element, and α is obtained experimentally. The thickness t of the dielectric element is determined in association with the radiation characteristic of the antenna. The impedance seen from the feed point of the circular microstrip antenna is expressed by the following equation (5) where ρ assumes a distance between the center of the radiation element and the feed point. Z₀ ∝ Jn(kρ) If ρ = 0, all values of Bessel function higher than one-order become zero, and only the 0-order Bessel function J₀(0) taken a finite value. That is, only when the radiation element resonates in the TM 0l mode, the radiation element is fed at its center. Further, the surface current in this case is radially distributed from the central feed point to the peripheral edge as shown by dashed lines in Fig. 4 so that the directivity on the vertical plane can be prevented from being displaced unlike the case where the radiation element is fed at its feed point offset from its center. In this embodiment, let us assume that the diameters d₁ and d₂ of the ground planar conductive element 1 and the radiation element 2 are 160 mm and 53 mm and that the thickness t₃ and the dielectric constant εr of the dielectric substrate 3 are 1.6 mm and 2.6, respectively. Then, when the drive frequency is 4.185 GHz, the impedances of the antenna in the TM 0l mode in the non-existence of and in the existence of the impedance matching device 10 are given by the following equations Z 0s = 46.906Ω + j5.0215Ω Z 0a = 52.207Ω - j68.215Ω Thus, the impedances are varied in a range of frequency from 4.0 to 4.6 GHz as shown by solid and one-dot chain line curves Ls and La in Fig. 7. Further, calculating the radius of the radiation element from the equation (4) under the condition that x 0l = 3.83171 and that f = 4.185 GHz yields x₀₁ C/2πf εr ≒ 27.1 mm In practice, when the radius of the radiation element 2 is d₂/2 = 26.5 mm, the radiation element 2 resonates at the drive frequency, and a difference between the calculated radius and the radius in practice represents a correction amount α. When the diameter d₁ of the ground planar conductive element 1 is 160 mm, the directivity on the vertical plane of the antenna in this embodiment is represented as shown in Fig. 8 in which the maximum gain is provided at the elevation angle of about 45 degrees.When the diameters d₁ of the ground planar conductive element 1 are 130 mm and 200 mm, the elevation angles at which the maximum gain is provided are changed as about 50 degrees and 40 degrees as shown in Figs. 9 and 10, respectively. As described above, the main radiation beam of the microstrip antenna in this embodiment can cover the range of elevation angles of the geostationary satellite in the above-mentioned middle latitude area. Further, since the microstrip antenna in this embodiment is non-lateral directivity on the horizontal plane, this microstrip antenna is suitable for application to the mobile station in the wireless communication system utilizing the geostationary satellite. Furthermore, the main radiation beam can be directed to the underside by increasing the dielectric constant of the dielectric substrate 3. In addition, the ground planar conductive element 1 is prepared in the separated form of the portion contacting with the dielectric substrate 3 and its peripheral portion, and they may be connected electrically and mechanically. The microstrip antenna according to a second embodiment of the present invention will be described with reference to Figs. 11 and 12. As shown in Figs. 11 and 12, a circular conductive element 13 having a middle-sized diameter is coaxially stacked on a circular ground planar conductive element 11 having a largest diameter via a dielectric layer 12 having a large diameter and made of a material such as fluoroplastics of low dielectric loss. A circular conductive element 15 having a small diameter is coaxially stacked on the circular conductive element 13 via a dielectric layer 14 having a small diameter. In this embodiment, radiuses r₁₁, r₁₃ and r₁₅ of the respective circular conductive elements 11, 13 and 15 are selected to be 90 mm, 55 mm and 26.5 mm, and dielectric constants εr and thicknesses t₁₂ and t₁₄ of the dielectric layers 12 and 14 are selected to be 2.6 and 3.2 mm, respectively. As shown in Fig. 11, feed points 13f₁ and 13f₂ are respectively provided on the circular conductive element 13 having the middle-sized diameter at two positions equally offset from the center of the conductive element 13 by the distance r f and having an angular spacing ϑ therebetween. A feed point 15f is provided at the center of the circular conductive element 15 having the small diameter. In this embodiment, the offset distance r f of the feed points 13 f1 and 13 f2 and the angular spacing ϑ between the feed points 13 f1 and 13 f2 are respectively determined as r f = 33 mm, and ϑ = 135 degrees, by way of example. As shown in Fig. 12, the feed points 13f₁ and 13f₂ of the circular conductive element 13 having the middle-sized diameter are respectively connected with coaxial feed lines 21 and 22. The outside conductor of the feed line 21 and the outside conductor 24 of the feed line 22 are both connected to the ground planar conductive element 11. The feed point 15f of the circular conductive element 15 having the small diameter is connected with an inside conductor 26 of a coaxial feed line 25, and an outside conductor 27 of the feed line 25 is connected to the ground planar conductive element 11. In this embodiment, the middle-sized diameter circular conductive element 13 is electrically connected at its center to the ground planar conductive element 11 by a through-hole forming-process, whereby the outside conductor 27 of the coaxial feed line 25 is connected to the central portion of the middle-sized diameter circular conductive element 13. The operation of this embodiment will be described as follows. The circular conductive element 15 of a small diameter is fed at its center and its radius r₁₅ is 26.5 mm, whereby it resonates at the frequency of 4.2 GHz in the TM₀₁ mode and becomes a radiation element for radiating a vertically-polarized wave. In that event, the circular conductive element 13 functions as a ground planar conductive element relative to the circular conductive element 15 so that it provides a directivity on a vertical plane in which its main beam falls in a range of desired angle of elevation as shown in Fig. 13. The circular conductive element 13, on the other hand, resonates in the TM₂₁ mode by a signal having a frequency of 1.6 GHz applied to the first feed point 13 f1 having the impedance of 50Ω and at a reference phase (0 degree) and to the second feed point 13 f2 having the impedance 50Ω and at a phase of -90 degrees. Thus, the circular conductive element 13 becomes a circular polarized wave radiation element which provides a desired directivity on a vertical plane as shown in Fig. 14. Since the impedance at the center of the radiation element is fundamentally 0Ω in other modes than the TM₀₁ mode, in this embodiment, the operation of the microstrip antenna in this embodiment can be stabilized by connecting the central portion of the cicular conductive element 13 of a middle-sized diameter to the ground planar conductive element 11. In this embodiment, the microstrip antenna is driven to emit a radiation wave of conical beam shape in which a desired directivity does not need the gain in the front direction, whereby the circumstance in the front direction hardly affects the characteristic of the microstrip antenna. From this viewpoint, the antenna for the high frequency band is stacked at the center of the antenna for the low frequency band, whereby a predetermined directivity can be provided by the microstrip antenna of small size and having a simplified arrangement according to this embodiment. If the drive frequencies become close to each other, the resonant frequency of the circular conductive element 13 of a middle-sized diameter is lowered by the influence of the upper dielectric layer 14 (see Fig. 12). While in the second embodiment the feed points 13 f1 and 13 f2 of the circular conductive element 13 of a middle-sized diameter are respectively supplied with the high frequency signals having the predetermined phase difference therebetween from the coaxial feed lines 21 and 22 as described above, the overall arrangement of the microstrip antenna system can be made more compact in size by utilizing a hybrid circuit 30 shown in Fig. 15. Referring to Fig. 15, if one copper foil 32 of a double-faced copper-bonded laminate layer 32 using fluoroplastics having a thickness of, for example, 0.8 mm is constructed as shown in Fig. 15 and the hybrid circuit 30 is supplied with a signal from its input terminal IN, then the left-hand side of the hybrid circuit 30 from its point A becomes symmetrical with respect to both the vertical and horizontal directions. The lengths of its portions of lines BC and BD are selected to be substantially 1/4 of the effective wavelength, and the signal power at the point A is equally divided and fed to two output terminals O₁ and O₂. Simultaneously, the phase of the signal at the output terminal O₂ is delayed by 90 degrees. In Fig. 15, reference letter T designates a terminating resistor terminal. If the distance between the two output terminals O₁ and O₂ is selected to be equal to the distance between the feed points 13f₁ and 13f₂ shown in Fig. 11, then the hybrid circuit 30 is bonded back to back with the ground planar conductive element 11, whereby the corresponding output terminals and the feed points can be connected by conductor pins (not shown) with ease. When such a matching circuit and the small diameter portion of the above-noted antenna are formed from the double-faced copper-bonding laminate plate and are bonded to the ground planar conductive element 11 and the middle-sized diameter circular conductive element 13, in order to more positively couple them mechanically and electrically, it is usual that the other small-diameter circular conductive element of the small diameter portion of the antenna is soldered to the middle-sized diameter circular conductive element 13 and the ground planar conductive element of the matching circuit is soldered to the ground planar conductive element 11 of the antenna. In that event, the portion to be soldered is not exposed so that only the small diameter portion and the peripheral edge portion of the matching circuit can be soldered according to the normal soldering-process. Thus, the soldering-process is difficult to make. The connected portion of relatively large area can be soldered over the whole area by a reflowing-process utilizing a solder having a low melting point, which needs plenty of time. Also, there is presented such a problem that the fluctuation of relative positions of respective portions can not be restricted without difficulty. Further, the microstrip antenna of the invention is driven in the SHF (super high frequency) band so that the length of the connection pin, which connects the feed point 15f of the small-diameter circular conductive element 15 and the antenna side terminal of the matching circuit, becomes important for the predetermined dimensions illustrated in the example of Fig. 6. Therefore, the disturbance of impedance at that portion exerts a bad influence upon a transmission characteristic. In a third embodiment of the present invention, as shown in Fig. 16, the hybrid or matching circuit 30 is comprised of a fluoroplastic layer 31 having a proper thickness, and a conductive element 32 forming one of a double-faced copper-bonding laminate layer and a conductive element 33 forming the other conductive element of the double-faced copper-bonding laminate layer, wherein the fluoroplastic layer 31 is interposed between the conductive elements 32 and 33, the conductive element 32 is employed as the ground planar conductive element and the conductive element 33 is arranged to have a predetermined pattern. The ground planar conductive element 32 is brought in contact with the ground planar conductive element 11 of the antenna. Further, as shown in Fig. 16, a screw 41 made of a conductive material extends from the center of the small-diameter circular conductive element 15 of the antenna through the inside of a through-hole conductive layer 17 formed between the middle-sized diameter circular conductive element 13 and the ground planar conductive element 11 so as to project to the underside of an antenna side terminal 30a of the matching circuit 30. In the intermediate portion of the screw 41, its diameter d₄₁ and the inner diameter D₁₇ of through-hole conductive layer 17 (refer to Fig. 17) are selected so as to satisfy the following equation (6) D₁₇/d₄₁ ≒ 2.3 The intermediate portion of the screw 41 and the through-hole conductive layer 17 provided as the outside conductor constitute a coaxial line whose characteristic impedance is 50Ω. As shown in Fig. 16, a screw thread is threaded on the tip end portion of the screw 41 and is engaged with a nut 42 made of a conductive material, whereby the small-diameter portion and the large-diameter portion of the antenna and the matching circuit 30 are fastened together. Thus, the center of the small-diameter circular conductive element 15, i.e. the feed point and the antenna side terminal 30a of the matching circuit 30 are connected via the conductive screw 41 and the conductive nut 42. An inside conductor 26 of a semi-rigid coaxial feed line 25C is soldered to the other terminal of the matching circuit 30. An outside conductor 27 of this coaxial feed line 25C is soldered to the ground planar conductive element 11. Although the feed point 13f of the middle-sized diameter circular conductive element 13 is also connected to a phase difference feed circuit of strip line type by a feed pin, they are not shown for simplicity. In the third embodiment, since the microstrip antenna is constructed as described above, the central feed point of the small-diameter circular conductive element 15 of the antenna and the terminal 30a of the matching circuit 30 can be positively connected via the conductive screw 41 and the conductive nut 42. Simultaneously, the small diameter portion and the large diameter portion of the antenna and the matching circuit 30 can be coupled positively. Since the above three members are coupled by the screw 41 and the nut 42, they can be coupled with great ease, which provides an improved working efficiency. Further, the central portion of the screw 41 and the through-hole conductive layer 17 constitute the coaxial line having the characteristic impedance of 50Ω so that no trouble occurs relative to the matching circuit 30. In addition, it is possible to determine the dimensions of the respective portions of the matching circuit 30 including the through-hole portion. While in the third embodiment a dielectric element is not provided inside of the through-hole conductive layer 17 and air exists therein as described above, if a spacer made of fluoroplastics is filled inside of the through-hole conductive layer 17, it is possible to restrict the position of the screw 41 more accurately. In this case, the diameter d₄₁ of the screw 41 and the inner diameter D₁₇ of the through-hole conductive layer 17 are selected as D₁₇/d₄₁ ≒ 3.2 In the foregoing, specific inductive capacity of fluoroplastics is selected as about 2. Further, if a conductive bonding agent is interposed between the two ground planar conductive elements 11 and 32 of the antenna and the matching circuit 30 and between the middle-sized diameter circular conductive element 13 and the small-diameter circular conductive element 16 of the antenna respectively, then mechanical strength of the antenna can be increased. Furthermore, while in the third embodiment the screw 41 and the nut 42 are used as the fastening members as described above, they may be replaced with a screw having threads on its respective ends and two nuts. In that event, if a nut having a large diameter is used, then it becomes possible to increase the pressing area. A fourth embodiment of the present invention will be described hereinbelow with reference to Figs. 18 and 19. Referring to Figs. 18 and 19, there is shown a conductive substrate 101 which is made of an aluminum plate whose thickness is, for example, 3 mm. A plurality of screw apertures 102 are formed through the conductive substrate 101, on its peripheral edge portion, and the ground planar conductive element 11 is brought in contact with one surface of the conductive substrate 101 and the antenna is then fixed thereto by inserting screws Sa into the apertures 102. Through-holes 103 and 105 are bored through the conductive substrate 101 in association with two feed points 13f₁ and 13f₂ of the middle-diameter circular conductive element 13 of the antenna and the feed point 15f of the small diameter circular conductive element 15 of the antenna, respectively. A hybrid circuit 30A is mounted on the other surface of the conductive substrate 101 by screws Sb while its ground planar conductive element 132 being brought in contact with the conductive substrate 101 as shown in Fig. 19. One output terminal 34₂ of the hybrid circuit 30A and one feed point 13f₂ of the middle-sized diameter circular conductive element 13 are soldered to respective ends of a feed pin 104 which extends through the through-hole 103 of the conductive substrate 101, thus the output terminal 34₂ and the feed point 13f₂ being connected to each other. The other feed point 13f₁, though not shown, and an output terminal 34₁ are similarly connected. As shown in Figs. 18 and 19, an inside conductor 123 of a semi-rigid coaxial feed line 22C is soldered to an input terminal 35 of the hybrid circuit 30A. The coaxial feed line 22C is secured to the conductive substrate 101 by a support metal fitting 107, screws Sc and the like. While the feed point 15f of the small-diameter conductive element 15 is also connected to the strip line type matching circuit by a feed pin 106 which extends through the through-hole 105 of the conductive substrate 101, this will not be shown in detail for simplicity. According to the fourth embodiment, the microstrip antenna is constructed as described above, whereby the ground planar conductive element 11 of the antenna and the ground planar conductive element 132 of the hybrid circuit 30A are positively connected via the conductive substrate 101. Simultaneously, the outside conductor 124 of the coaxial feed line 22C and the ground planar conductive element 132 of the hybrid circuit 30A are positively connected in a like manner. The two ground planar conductive elements 11 and 132 are connected via the screws Sa, Sb and the conductive substrate 101 with great ease, which provides an improved working efficiency. While in the fourth embodiment the antenna and the hybrid circuit 30A are both provided with the ground planar conductive elements 11 and 132, the ground planar conductive elements 11 and 132 may be removed. Further, it is possible to make the conductive substrate 101 light in weight by reducing the thickness of the conductive substrate 101 on its surface to which the hybrid circuit 30A is attached except its portions in contact with the hybrid circuit 30A and near the screw apertures 102 formed on the peripheral edge of the conductive substrate 101. Further, when the antenna is provided with the ground planar conductive element 11, the substrate 101 can reduce the thickness of its surface facing the antenna except its portions near the through-holes 103 and 105 and the screw aperture (not shown) for the screws Sb within the opposing area to the hybrid circuit 30A. While in the fourth embodiment the hybrid circuit 30A is the non-shield strip line type as described above, it might be a shield strip line type. A fifth embodiment of the present invention will be described with reference to Figs. 20 and 21. Referring to Fig. 20, there is provided a conductive housing 201 which is made of, for example, an aluminun. A plurality of screw apertures 202 are formed around the peripheral edge of the housing 201. A concave or recess portion 203 is formed on the central portion of the upper surface of the conductive housing 201, and a hybrid circuit 30S is accommodated within the recess 203. As shown in Fig. 21 forming an exploded view of the fifth embodiment, this hybrid circuit 30S is of a shield strip line type in which a pattern conductive element 233r is sandwiched between ground planar conductive elements 232 and 242 via dielectric layers 231 and 241. The pattern conductive element 233r in Fig. 21 and the pattern conductive element 133 in Fig. 18 are placed in an inside and outside relationship. Further, Fig. 20 is a diagrammatic view of section taken along the section line XX - XX in Fig. 21. The depth of the recess portion 203 of the conductive housing 201 is selected to be equal to the thickness of the hybrid circuit 30S, and the ground planar conductive element 11 is brought in contact with the upper ground planar conductive element 242 of the hybrid circuit 30S and the upper surface of the conductive housing 201, thus mounting the antenna by screws Sa. A coaxial connector 228 is secured to the under surface of the conductive housing 201 by screws Sb. The microstrip antenna of this embodiment is assembled in the following order: (1) The coaxial connector 228 is secured to the under surface of the conductive housing 201 by the screws Sb; (2) The main portion of the hybrid circuit 30S, i.e. the portion below its pattern conductor 233r is located within the recess 203 of the upper surface of the conductive housing 201 under the condition that the ground planar conductive element 232 is directed downward, and the input terminal 35 of the pattern conductive element 233r and the inside conductor of the coaxial connector 228 are soldered to each other; (3) Pins 4₁ and 4₂ are respectively implanted on and soldered to output terminals 34₁ and 34₂ of the pattern conductive element 233r; (4) The dielectric layer 241 and the ground planar conductive element 242 are mounted on the pattern conductive element 233r, and the pins 4₁ and 4₂ are respectively projected from through-holes 44₁ and 44₂; (5) When the antenna is mounted on the upper surface of the conductive housing 201 by screws, the upper ground planar conductive element 242 of the hybrid circuit 30S comes in contact with the ground planar conductive element 11 of the antenna, and the pins 4₁ and 4₂ are extended through the ground planar conductive element 11 and the dielectric layer 12 of the antenna and are exposed on feed points 13f₁ and 13f₂ of the middle-sized diameter circular conductive element 13; and (6) The feed points 13f₁ and 13f₂ are soldered to the corresponding pins 4₁ and 4₂, respectively. According to the fifth embodiment, the microstrip antenna is constructed as described above, whereby the ground planar conductive element 11 of the antenna and the two ground planar conductive elements 232 and 242 of the hybrid circuit 30S are positively connected via the conductive housing 201, and the outside conductor of the coaxial connector 228 and the two ground planar conductive elements 232 and 242 of the hybrid circuit 30S are positively connected in the same fashion. The connection of the ground planar conductive elements 11, 232 and 242 is effected by the screws Sa, Sb and the conductive housing 201 with great ease, which provides an improved working efficiency. While in the fifth embodiment the hybrid circuit 30S includes the ground planar conductive elements 232 and 242 as described above, the ground planar conductive elements 232 and 242 might be removed. In that event, the bottom of the recess 203 of the conductive housing 201 and the ground planar conductive element 11 of the antenna are shielded. Further, it is also possible to remove both the dielectric layer 241 and the ground planar conductive element 242 which are provided above the pattern conductive element 233r. In that event, the main portions of the pattern conductive element 233r side are properly secured to the conductive housing 201 by screws and the like. Also, the predetermined dimension of the pattern of the pattern conductive element 233r is slightly increased. Further, the under surface of the conductive housing 201 except the concave portion 203 accommodating the hybrid circuit 30S and the peripheral edge portion near the screw apertures 202 is properly reduced in thickness so that the weight of the microstrip antenna of the fifth embodiment can be reduced. While in the above-mentioned embodiments two frequency bands are employed, the present invention can be similarly applied to the case where three frequency bands or more are employed.

Claims: A microstrip antenna having directivity in a vertical plane in a range of predetermined angles of elevation and a non-directional radiation pattern in a horizontal plane, suitable for establishing an up channel and a down channel with a geostationary satellite, comprising: a grounded conductive planar element (1; 11); a radiation element of substantially circular shape (2; 15); a dielectric layer (3; 14) having a small dielectric loss and provided between said planar element (1; 11) and said radiation element (2; 15); and feed means (4, 10; 25) connected to a feed point of said radiation element characterized in that said feed point is connected at the centre of said radiation element (2, 15) so that said radiation element is resonated in the TM₀₁ mode, whereby said directivity in a vertical plane is obtained. A microstrip antenna according to claim 1, wherein said feed means (4, 10; 25) includes impedance matching means (10). A microstrip antenna according to claim 2, wherein said impedance matching means (10) includes an inside conductor (26) connected to said feed point and an outside conductor (27) connected to said conductive planar element, and said inside conductor and said outside conductor are coaxially arranged. A microstrip antenna comprising: (i) a grounded conductive planar element (11); (ii) a plurality of conductive circular elements (13, 15) each being coaxially stacked on said grounded conductive planar element with an intermediate dielectric layer (12, 14) having a small dielectric loss in the sequential order of diameters thereof; (iii) a feed point (25) located at the centre of said conductive circular element (15) having the minimum diameter; characterized in that it further comprises: (iv) feed points (21, 22) provided on said other conductive circular elements (13) at positions offset from their centres, wherein said conductive circular element having the minimum diameter (15) is resonated in the TM₀₁ mode. A microstrip antenna according to claim 4, further comprising first feed means (26) connected to the feed point of said conductive circular element (15) having the minimum diameter and second feed means (21, 23) connected to the feed points of said other conductive circular elements. A microstrip antenna according to claim 5, wherein said first feed means includes an inside conductor (26) connected to said feed point (25) of said conductive circular element (15) having the minimum diameter, and an outside conductor (27) connected respectively to said other conductive circular elements (11, 13), said inside conductor and said outside conductor being coaxially arranged. A microstrip antenna according to claim 5, wherein said first feed means includes a conductive fastening member (41) extended from the underside of said conductive planar element (11) to substantially a centre of said conductive circular element (15) having the minimum diameter, said conductive circular element having the minimum diameter being fed through said fastening member. A microstrip antenna according to claim 5, wherein said second feed means includes a strip line type feed circuit (13f) mounted to said conductive circular element (13) having the maximum diameter on its surface opposite to a surface to which said conductive circular elements are stacked through a conductive substrate, and an output terminal of said feed circuit and the feed point provided on said conductive circular element are connected through said conductive substrate (11). A microstrip antenna according to claim 5, wherein said second feed means includes a conductive housing (201) in which a shield strip line type feed circuit is accommodated within a recess formed on one surface of said conductive housing and said one surface is mounted on a surface of said conductive planar element opposite to its surface on which said conductive circular elements are stacked, and a coaxial connector (228) mounted on the other surface of said conductive housing, wherein said coaxial connector and an input terminal of said feed circuit are connected via said conductive housing, and an output terminal of said feed circuit and the feed point of said antenna are connected together.

Inventors: TORIYAMA ICHIRO, TORIYAMA, ICHIRO
Applicants: SONY CORP, SONY CORPORATION
Application year: 1989
Main classification: H01Q9
IPC codes: H01Q5, H01Q9