Integrated circuit device having signal discrimination circuit and method of testing the same

Abstract: An integrated circuit device formed on a chip (10) includes a pair of signal input terminals (2, 3), a signal discriminating circuit (1) having a pair of input terminals (A, B) coupled to the signal input terminals, for comparing a data signal and a reference signal supplied through the input terminals and for determining whether or not the level of said data signal is higher than that of said reference signal, a pair of test signal terminals (5, 6) to which a predetermined voltage (E T ) is applied, and a voltage dividing circuit (4) for dividing the predetermined voltage to thereby generate a test signal (ERa) to be supplied to the signal discriminating circuit through the input terminals.

Description: BACKGROUND OF THE INVENTION The present invention generally relates to an integrated circuit device having a signal discrimination circuit, and more particularly to an improvement in testing the signal discrimination circuit by use of a very small voltage. Further, the present invention relates to a method of testing the integrated circuit device. An integrated circuit device having a signal discrimination circuit is known. For example, a signal discrimination circuit is formed by an emitter coupled logic circuit which determines an output logic based on relation in potential between a pair of input signals consisting of a data signal and a reference signal. When testing such a signal discrimination circuit, it is required to supply the signal discrimination circuit with a pair of test signals having a very small potential difference. When testing a signal discrimination circuit as described above in a step of production of an integrated circuit device having the signal discrimination circuit, an automatic IC tester having a power source device for use in test, such as "4145B" marketed by YHP or "T3340" marketed by Advantest. The automatic IC tester can generate a pair of test signals having a very small potential difference. The generated test signals are applied to input terminals of the signal discrimination circuit, and logic levels derived from the signal discrimination circuit are monitored. Then it is determined whether the signal discrimination circuit can operate correctly on the bases of the monitored logic levels. The aforementioned IC tester "4145B" has the following specification: i) voltage range: ±20V ii) precision: ±(0.1% + 10mV + 0.4Ω x Io) where Io is an output current. The aforementioned IC tester "T3340" has the following specification: i) voltage range: ±2V, ±8V ii) precision: for ±2V, ±(0.2% + 2mV + 0.6mV/10mA) for ±8V ±(0.2% + 4mV + 0.6mV/10mA) However, the aforementioned method has the following disadvantages. The very small test signals are directly supplied to the input terminals of the signal discrimination circuit to be tested. Thus, test is influenced by an absolute error of the power source device built in the IC tester. Generally, the absolute error of the typical power source device is approximately equal to 2mV. This value of the absolute error is substantially constant independent of a magnitude of the output voltage derived from the power source device. When it is assumed that the output voltage derived from the power source device is equal to 10mV, the ratio of the absolute error to the output voltage is 20% (= (2mV/10mV) x 100%). Thus, precision in test contains a 20% error. It is noted that even a highly regulated power source device contains an absolute error in the output signal without exception. For this reason, when such a power source device is used in a very narrow voltage range, the ratio of the absolute error to the output is large and thus precision in test is poor. GB-A-2 085 171 discloses an LSI chip logic testing system resident on an LSI chip. The test data is input serially to an input shift register and fed in parallel via gates to the logic function under test. The response thereto is output to an output shift register via gates. The main inputs and outputs to logic function are connected thereto by gates. The register and the gates are controlled by shift register enabled by an external control signal. By appropriate operation of the gates normal operation of the function may be monitored or a separate test signal may be introduced. From JP-A-57 157164 a testing method for reliability in thermo-acceleration of integrated circuits is known. It is to prevent the breakage of a coder at the turning on of a power source eliminating the need for an exclusive square wave oscillator by inputting easy to generate square signals into an analogue signal input terminal. These square signals have an appropriate amplitude made by two serially connected resistors working as a voltage divider. A general object of the present invention is to provide an integrated circuit device having a signal discrimination circuit in which the aforementioned disadvantages are got rid of. A more specific object of the present invention is to provide an integrated circuit device having a signal discrimination circuit in which there is provided a circuit which makes it possible to test the signal discrimination circuit with higher precision. The above objects of the present invention can be achieved by an integrated circuit device according to the characterizing portion of Claim 1. Yet another object of the present invention is to provide a method of testing the integrated circuit as claimed in any of claims 1-19. This object of the present invention is achieved by a method according to the characterizing portion of claim 20. Additional objects, features, and advantages of the present invention will become apparent from the following detailed description when read in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG.1 is a circuit diagram of a first preferred embodiment of the present invention; FIG.2 is a circuit diagram of a signal discrimination circuit used in the circuit shown in FIG.1; FIG.3 is a circuit diagram of a second preferred embodiment of the present invention; FIG.4 is a circuit diagram of a variation of the second embodiment shown in FIG.3: FIG.5 is a circuit diagram of a third preferred embodiment of the present invention; FIG.6 is a circuit diagram of a fourth preferred embodiment of the present invention; FIG.7 is a block diagram of a fifth preferred embodiment of the present invention; FIGS.8A, 8B and 8C are block diagrams of first, second and third examples of a switch circuit used in the fifth embodiment shown in FIG.7; FIG.9 is a circuit diagram of a sixth embodiment of the present invention; and FIG.10 is a circuit diagram of a variation of the sixth embodiment shown in FIG.9. DESCRIPTION OF THE PREFERRED EMBODIMENTS A description is given of a first preferred embodiment of the present invention with reference to FIGS.1 and 2. Referring to FIG.1, a signal discrimination circuit 1 discriminates a very-small signal (data signal) from a signal applied thereto together with a reference signal through signal lines L1 and L2 connected to a pair of signal input terminals (pads) 2 and 3 mounted on an edge of a chip 10, respectively. For example, the signal discrimination circuit 1 is provided in an integrated circuit for use in communications. An example of the structure for the signal discrimination circuit 1 is illustrated in FIG.2. Referring to FIG.2, the signal discrimination circuit 1 is formed by an emitter-coupled logic circuit, which includes emitter-coupled transistors T1, T2, an emitter-follower output transistor T3, emitter-follower input transistors T4, T5, resistors R1, R2, R3, R4 and R5, and a constant current source I₁. The signal discrimination circuit 1 sets the output logic to "H (high)" level when a pair of signals applied to input terminals A and B thereof have a potential relation of A > B. On the other hand, the signal discrimination circuit 1 sets the output logic to "L (low)" level when the signals applied to the terminals A and B have a potential relation of A < B. Normally, one of the signals applied to the terminals A and B is a reference level (signal), and the other signal is a data signal compared with the reference level in order to determine whether the level of data to be compared is equal to or higher than the reference level. In FIG.1, the input terminal A is provided with the data signal, and the input terminal B is provided with the reference signal. Alternatively, the input terminals A and B may be supplied with the reference level and the data signal, respectively. The signal discrimination circuit 1 is supplied with a positive power source V CCa and a negative power power V EEa . Turning to FIG.1, signal lines L1a and L2a branch from the signal lines L1 and L2, respectively. The signal lines L1a and L2a are connected to emitters of transistors T11 and T12, respectively. The collectors of the transistors T11 and T12 are connected to a positive power source line V CC , and the bases thereof are connected to the respective ends of a resistor Ra. The resistor Ra forms a resistor network NW together with resistors Rb and Rc. The ends of the resistor network NW are connected to respective signal lines L3 and L4, which are connected to a pair of test signal terminals (pads) 5 and 6 mounted on the edge of the chip 10, respectively. The resistor network NW and the transistors T11 and T12 form a voltage division circuit 4. In operation, the aforementioned IC tester is connected to the test signal terminals 5 and 6, and applies a test voltage E T defined by a test data signal and a test reference signal to the test signal terminals 5 and 6. The applied test voltage E T is divided by the resistors Ra, Rb and Rc of the resistor network NW. When Ra = 1, and Rb = Rc = 4.5 , the voltage division ratio is 10:1. Thus, a voltage of ERa (= E T /10) appears across the resistor Ra. The potential of an end (node) N1 of the resistor Ra is drawn to the signal line L1a through the base and emitter of the transistor T11. Similarly, the potential of the other end (node) N2 of the resistor Ra is drawn to the signal line L1b through the base and emitter of the transistor T12. When characteristics of the transistor T11 are the same as those of the transistor T12, the voltage difference between the signal lines L1a and L2a is equal to the aforementioned voltage ERa. The signal discrimination circuit 1 determines its output logic in accordance with the voltage difference. It is now considered that a very small voltage equal to 10mV is applied to the device in order to test the signal discrimination circuit 1. Assuming that the voltage division ratio of the resistor network NW is 10:1 as described previously, the IC tester is adjusted so as to output 100mV (= 10mV x 10). For example, when the IC tester has a 0.1% rating error and an absolute error of 2mV, the 10mV test signal derived therefrom has a total error ΔV equal to 2.01mV (= 10mV x 0.1% + 2mV), which corresponds to a 20% error. On the other hand, the 100mV test signal derived from the IC tester has the total error ΔV equal to O.21mV (= 2.1/10), which corresponds to a 2% error. That is, the test signal can be selected by the voltage division ratio of the resistor network NW so that the test signal is of a voltage higher than the very small voltage necessary for test. It follows that the ratio of absolute error to the test signal output can relatively be reduced. Thus, the very small voltage test signal to be applied to the input terminals A and B of the signal discrimination circuit 1 can be made more precise than the conventional small voltage test signal which is derived from the IC tester and supplied directly to the signal discrimination circuit 1. One may feel concern about a change of input impedance of the signal discrimination circuit 1 due to the presence of the resistor network NW. However, there is no need of such apprehension because the base-emitter junctions of the transistors T11 and T12 are interposed between the resistor network NW and the signal discrimination circuit 1 in the reverse direction. Additionally, the presence of the transistors T11 and T12 makes it possible to determine the voltage division ratio on the basis of only the resistors Ra, Rb and Rc without taking into account the input impedance of the signal discrimination circuit 1. It should be appreciated that the test signal applied to the test signal terminals 5 and 6 is very larger than the conventional test signal. The large test signal is less influenced by noise which is present around signal cables extending from the IC tester. It is preferable that the resistors Ra, Rb and Rc are formed by diffusion resistors. In actuality, a plurality of diffusion resistors are formed on the chip 10, and some of the diffusion resistors are used for forming the resistor Ra, and some of the diffusion resistors are used for forming the resistor Rb. Similarly, some of the diffusion resistors are used for forming the resistor Rc. It is to be noted that each of the diffusion resistances has almost the same error in resistance since those resistors are produced at the same time by the same process. It is to be further noted that the voltage ERa obtained across the resistor Ra is based on the voltage division ratio by the resistor network and therefore errors in resistance of the resistors Ra, Rb and Rc are cancelled. Thereby, the voltage ERa contains less error. Alternatively, polysilicon resistors can be used for forming the resistors Ra, Rb and Rc. A description is given of a second preferred embodiment of the present invention with reference to FIG.3. An essential feature of the second embodiment is that the emitters of the transistors T11 and T12 are connected to a negative power source V EE through resistors R11 and R12, respectively. The second embodiment is effective to a case where the input impedance of the signal discrimination circuit 1 is considerably low. A configuration shown in FIG.4 is particularly effective to a case where the input impedance of the signal discrimination circuit 1 is extremely low. Referring to FIG.4, transistors T21, T22, and resistors R21 and R22 are added to the configuration of FIG.3 so that emitter follower circuits are cascaded by two stages for each of the signal lines L1a and L2a. In the first and second embodiments, the power sources V CC and V EE may be identical to or different from the power sources V CCa and V EEa , respectively. When V CC > V CCa and V EE < V EEa , it is possible to set the test signal voltages higher than V CCa and V EEa . This setting of the test signal is desirable in view of test environments. A description is given of a third embodiment with reference to FIG.5, in which those parts which are the same as those in the previous figures are the same reference numerals. The third embodiment is suitable for a case where the signal discrimination circuit 1 has a large input impedance. The third embodiment is especially effective to a signal discrimination circuit which includes an emitter-coupled logic circuit, such as the signal discrimination circuit 1 shown in FIG.2. The third embodiment is formed by eliminating the transistors T11 and T12 from the configuration shown in FIG.1 and connecting the ends of the resistor Ra directly to the input terminals A and B of the signal discrimination circuit 1. In the third embodiment, the voltage applied between the input terminals A and B of the signal discrimination circuit 1 is based on the values of the resistors Ra, Rb and Rc. It is necessary to set resistance of the resistor Ra considerably smaller than the input impedance between the input terminals A and B of the signal discrimination circuit 1. Table 1 shows values of essential parameters in the third embodiment. Ra Rb Rc R1 R2 R3 I₁ 10Ω 45Ω 45Ω 450Ω 450Ω 2kΩ 2mA A description is given of a fourth embodiment of the present invention with reference to FIG.6, in which those parts that are the same as those shown in the previous figures are the same as the same reference numerals. An essential feature of the fourth embodiment is that transistors T11 and T31 are darlington-connected, and transistors T12 and T32 are darlington-connected. The darlington connection is used for minimizing current drawn from the resistor network NW so that the divided voltage generated across the resistor Ra is not influenced. The collectors of the transistors T11 and T31 are connected to ground, and the collectors of the transistors T12 and T32 are connected to ground. Pads P1 and P6 correspond to the aforementioned terminals 5 and 6, respectively. Pads P2 and P3 correspond to the aforementioned terminal 2. Pads P4 and P5 correspond to the aforementioned terminal 3. The signal discrimination circuit 1 shown in FIG.6 includes transistors T4 and T5 and resistors R6 through R9. The resistors R6 and R7 are connected to the base of the transistor T4, and the resistors R8 and R9 are connected to the base of the transistor T5. The transistors T4 and T5 form a current switch. The signal discrimination circuit 1 of the fourth embodiment is tested so as to find characteristics exhibited in a state which slightly deviates from a state where the transistors T4 and T5 pass the same current. In test, a voltage of 1.01V for example is applied between the pads P1 and P6. At this time, the resistor Ra generates a very small voltage of 0.01V across both the ends thereof. The generated voltage is applied to the bases of the transistors T4 and T5 through the transistors T11, T31, T12 and T32 and the pads P2 - P5. Thereby, the signal discrimination circuit 1 can be tested by a very small voltage of 0.01V. In this case, Rb = Rc = 500Ω , Ra = 10Ω, R6 = R8 = 150Ω, and R7 = R9 = 160Ω. Further, the potential of the node (connection) of the resistors Rb and Ra is equal to -0.5V, and the potential of the node of the resistors Ra and Rc is equal to -0.51V. Moreover, the potentials of the bases of the transistors T4 and T5 are equal to -1.9V and -1.91V, respectively. It is noted that in each of the aforementioned embodiments, the voltage division circuit 4 including the resistor network NW is connected in an ordinary operation in which the signal discrimination circuit 1 processes data supplied thereto through the signal input terminals 2 and 3. In this case, a parasitic capacitance of the voltage division circuit 4 viewed from the signal input terminals 2 and 3 is coupled to the input terminals A and B of the signal discrimination circuit 1. Therefore, there is a possibility that the parasitic capacitance prevents the signal discrimination circuit 1 from operating at high speeds. A fifth embodiment is intended to overcome this problem. A description is given of the fifth embodiment of the present invention with reference to FIG.7. Referring to FIG.7, the voltage division circuit 4 is coupled to the signal discrimination circuit 1 through a switch circuit 13. When the signal discrimination circuit 1 is tested, the switch circuit 13 connects the voltage division circuit 4 to the signal discrimination circuit 1. On the other hand, in the ordinary mode, the switch circuit 13 keeps the voltage division circuit 4 disconnected from the signal discrimination circuit 1. A first example of the switch circuit 13 shown in FIG.7 is illustrated in FIG.8A. Referring to FIG.8A, the switch circuit 13 is formed by a switch 13a. A first contact of the switch 13a is provided between the signal input terminal 2 and a terminal 14 to which the voltage division circuit 4 is connected. A second contact of the switch 13a is provided between the signal input terminal 3 and a terminal 15 to which the voltage division circuit 4 is connected. in the test mode, the first and second contacts of the switch 13a are closed. A second example of the switch circuit shown in FIG.7 is illustrated in FIG.8B. Referring to FIG.8B, the switch circuit 13 is formed by a pair of fuses 13b. After the signal discrimination circuit 1 is tested, the fuses 13a are melted by passing current from the terminals 5 and 6 so that the voltage division circuit 4 is disconnected from the signal discrimination circuit 1. A third example of the switch circuit 13 is illustrated in FIG.8C. Referring to FIG.8C, the switch circuit 13 is formed by a pair of FET (MOS) transistors 13c. The gates of the FET transistors 13c are connected to terminals 16 and 17, and the remaining terminals thereof are connected to the voltage division circuit 4 and the signal discrimination circuit 1. In the test mode, gate signals are applied to the terminals 16 and 17 so that the FET transistors 13c pass signals from the voltage division circuit 4 to the signal discrimination circuit 1. A description is given of a sixth embodiment of the present invention with reference to FIG.9. The sixth embodiment corresponds to an improvement of the first embodiment shown in FIG.1. The sixth embodiment is configured by providing resistors R10 and R11 between the bases and emitters of the transistors T11 and T12 of the first embodiment, respectively. The combination of the transistor T11 and the resistor R10 functions as a protection element against electrostatic breakdown. Similarly, the combination of the transistor T12 and the resistor R11 functions as a protection element against electrostatic breakdown. Of course, the transistors T11 and T12 provide the original function as described previously with reference to FIG.1. When a high voltage due to a positive charge is applied to the signal input terminal 2 (data), the applied charge passes through the signal line L1, the resistor R10, the base and collector of the transistor T11 and the power source Vcc in this order so that the signal discrimination circuit 1 is protected from high voltage. The transistor T12 and the resistor R11 operate in the same manner when a high voltage is applied to the signal input terminal 3 (reference). In this case, a charge passes through the signal line L2, the resistor R11, the base and collector of the transistor T12 and the power source Vcc in this order. When a high voltage due to a negative charge is applied to the terminal 2, a high voltage is applied between the collector and base of the transistor T11 through the resistor R10, the line L1 and the terminal 2. Thereby, the collector-base junction of the transistor T11 is broken down so that a base current passes through the transistor T11. Thereby, the transistor T11 is turned ON, which increases the potential of the line L1 up to the power source potential Vcc. In this manner, the signal discrimination circuit 1 is protected from high voltages due to negative charges. The transistor T12 and the resistor R11 operate in the same manner when a high voltage due to a negative charge is applied to the terminal 3. A variation of the sixth embodiment is shown in FIG.10. An essential feature of the variation is that Schottky diodes D1 and D2 are provided as shown in FIG.10. The anode and cathode of the Schottky diode D1 are connected to the base of the transistor T11 and the resistor R10, respectively. The anode and cathode of the Schottky diode D2 are connected to the base of the transistor T12 and the resistor R11, respectively. The Schottky diodes D1 and D2 helps the transistors T11 and T12 turn ON with ease when a high voltage due to a negative charge is applied to the terminals 2 and 3. The present invention is not limited to the aforementioned embodiments, and variations and modifications may be made without departing from the scope of the claims.

Claims: An integrated circuit device formed on a chip (10) including a pair of signal input terminals (2,3), signal discriminating means (1) having a pair of input terminals (A,B) coupled to said signal input terminals, for comparing a data signal (DATA) and a reference signal (REF) supplied through said input terminals (2,3) and for determining whether or not the level of said data signal is higher than that of said reference signal, and a pair of test signal terminals (5,6) to which a predetermined potential difference (E T ) is supplied, characterized in that said integrated circuit device further comprises: voltage dividing means (4) for dividing that predetermined potential difference (E T ) to thereby generate a test signal (ERa) to be supplied to said signal discriminating means (1) through said input terminals, said voltage dividing means (4) and said test signal discriminating means (1) being provided on the same chip and said test signal (ERa) generated by the voltage dividing means being a pair of signals having a slight voltage difference. An integrated circuit device as claimed in claim 1, characterized in that said voltage dividing means (4) includes a resistor network (NW) composed of a plurality of resistors (Ra, Rb, Rc) connected in series, and in that said resistor network has a pair of nodes (N1, N2) through which said test signal is output, and said nodes are directly connected to said pair of input terminals (A, B) of said signal discriminating means (1). An integrated circuit device as claimed in claim 1, characterized in that said voltage dividing means (4) includes a resistor network (NW) composed of a plurality of resistors (Ra, Rb, Rc) connected in series, and said resistor network has a pair of nodes (N1, N2) through which said test signal is output, and in that said voltage dividing means further includes coupling means, connected between said resistor network means and said pair of input terminals (A, B) of said signal discriminating means (1), for providing said signal discriminating means with said test signal derived from said resistor network means. An integrated circuit device as claimed in claim 3, characterized in that said coupling means includes first and second transistors (T11, T12) each having a base, a collector and an emitter, and the bases of said first and second transistors are connected to the respective nodes (N1, N2) of said resistor network (NW), and in that the collectors of said first and second transistors are coupled to a power source (V CC ), and the emitters of said first and second transistors are connected to the respective input terminals (A, B) of said signal discriminating means (1). An integrated circuit device as claimed in claim 4, characterized in that said coupling means includes first and second resistors (R11, R12) provided for the first and second transistors (T11, T12), respectively, and said first and second resistors are connected between the emitters of said first and second transistors and a second power source (V EE ) so that each of said first and second transistors serves as an emitter follower transistor. An integrated circuit device as claimed in any of claims 3 to 5, characterized in that said coupling means includes emitter follower transistors (T11, T21; T12, T22) of a plurality of stages provided for each of the nodes (N1, N2) of said resistor network means (NW). An integrated circuit device as claimed in any of claims 3 to 5, characterized in that said coupling means includes darlington-connected transistors (T11, T31; T21, T32) provided for each of the nodes (N1, N2) of said resistor network means (NW). An integrated circuit device as claimed in claim 4 or 5, characterized in that said coupling means includes first and second resistors (R10, R11), and in that said first resistor is connected between the emitter and base of said first transistor (T11), and said second resistor is connected between the emitter and base of said second transistor (T12). An integrated circuit device as claimed in claim 4 or 5, characterized in that said coupling means includes a first circuit composed of a first resistor (R10) and a first Schottky diode (D1) connected in series, and a second circuit composed of a second resistor (R11) and a second Schottky diode (D2) connected in series, and in that said first circuit is connected between the emitter and base of said first transistor (T11), and said second circuit is connected between the emitter and the base of said second transistor (T12). An integrated circuit device as claimed in any of claims 1 to 9, further comprising switching means (13), provided between said voltage dividing means (4) and said signal discriminating means (1), for connecting said voltage dividing means and said signal discriminating means when said signal discriminating means is tested by applying said test signal (ERa) to said signal discrimination means. An integrated circuit device as claimed in claim 10, characterized in that said switching means (13) comprises a switch (13a) having two contacts provided between said pair of nodes (N1, N2) of said voltage dividing means (4) and said pair of input terminals (A, B) of said signal discriminating means (1). An integrated circuit device as claimed in claim 10, characterized in that said switching means (13) includes a pair of fuses (13b) provided between said pair of nodes (N1, N2) of said voltage dividing means (4) and said pair of input terminals (A, B) of said signal discriminating means (1). An integrated circuit device as claimed in claim 10, characterized in that said switching means (13) includes first and second transistor gates (13c) provided between said pair of nodes (N1, N2) of said voltage dividing means (4) and said pair of input terminals (A, B) of said signal discriminating means (1), and gate signals are applied to said first and second transistors when the signal discriminating means is tested. An integrated circuit device as claimed in claim 2, characterized in that each of said resistors (Ra, Rb, Rc) of said resistor network means (NW) is formed by a plurality of diffusion resistors. An integrated circuit device as claimed in claim 2, characterized in that each of said resistors (Ra, Rb, Rc) of said resistor network means (NW) is formed by a plurality of polysilicon resistors. An integrated circuit device as claimed in claim 2, characterized in that said resistor network means (NW) is composed of first, second and third resistors (Ra, Rb, Rc) connected in series in this order, and said test signal is drawn from both the ends of said second resistor (Rb). An integrated circuit device as claimed in any of claims 1 to 15, characterized in that the voltage (ERa) of said test signal is smaller than said predetermined voltage (E T ) applied to said test signal terminals. An integrated circuit device as claimed in any of claims 1 to 15, characterized in that said signal discriminating means (1) includes an emitter-coupled logic circuit (T4, T5) which determines its output logic based on relation in potential between said input terminals (A, B). An integrated circuit device as claimed in any of claims 4, 5, 8, and 9, characterized in that said first transistor (T11) has the same characteristics as said second transistor (T12). A method of testing an integrated circuit device formed on a chip as claimed in any of claims 1-19, said integrated circuit including; a pair of signal input terminals (2, 3), signal discriminating means (1) having a pair of input terminals (A, B) coupled to said signal input terminals, for comparing a data signal (DATA) and a reference signal (REF) supplied through said input terminals and for determining whether or not the level of said data signal is higher than that of said reference signal, a pair of test signal terminals (5, 6) to which a first pair of test signals having a first potential difference (E T ) is applied, voltage dividing means (4) for dividing said first potential difference to thereby generate a second pair of test signals having a second potential difference (ERa) less than said first potential difference, and switching means (13), provided between said voltage dividing means (4) and said signal discriminating means (1), for selectively connecting said voltage dividing means and said signal discriminating means, said method comprising the steps of: connecting said voltage dividing means (4) and said signal discrimination means (1) through said switching means (13); supplying said pair of test signal terminals (5, 6) with said first pair of test signals (E T ) forming said first potential difference; supplying said signal discriminating means (1) with said second pair of test signals (ERa) having said second voltage difference derived from said voltage dividing means; determining whether said signal discriminating means (1) correctly discerns whether one of said second pair of test signals is higher than the other test signal; and disconnecting said voltage dividing means (4) from said signal discriminating means (1) by said switching means (13). A method as claimed in claim 20, characterized in that said voltage dividing means (4) includes a resistor network (NW) composed of a plurality of resistors (Ra, Rb, Rc) connected in series, and in that said resistor network has a pair of nodes (N1, N2) through which said second pair of test signals is output, and said nodes are directly connected to said pair of input terminals (A, B) of said signal discriminating means (1). A method as claimed in claim 20 or 21, characterized in that said switching means includes switch contacts (13a). A method as claimed in anyone of claims 20 to 22, characterized in that said signal discriminating means includes an emitter-coupled logic circuit (T1, T2, T3). A method as claimed in claim 20, 21 or 23, characterized in that said switching means includes fuses (13b). A method as claimed in claim 20, 21 or 23, characterized in that said switching means includes field effect transistors (13c).

Inventors: OGAWA KAZUMI, TANAKA MASAHIRO, TOMITA KAZUHIRO, OGAWA, KAZUMI, TANAKA, MASAHIRO, TOMITA, KAZUHIRO
Applicants: FUJITSU LTD, FUJITSU VLSI LTD, FUJITSU LIMITED, FUJITSU VLSI LIMITED
Application year: 1989
Main classification: G01R31
IPC codes: G01R31