Flagless semiconductor package

Abstract: A molded semiconductor package having a flagless leadframe (22) wherein a semiconductor die (10) is disposed in or above a die opening (20) of a leadframe (22). This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings (34) to protect high stress areas of the semiconductor die (10) from damage and heat spreaders (46) to more effectively spread heat dissipated by the semiconductor die (10).

Description: This invention relates, in general, to molded semiconductor packages, and more particularly to a molded semiconductor package having a flagless leadframe. Molded semiconductor packages generally comprise a semiconductor die mounted on the flag of a metal leadframe wherein the semiconductor die is electrically connected to the leads of the metal leadframe by wire bonds. The semiconductor die, the wire bonds and the leadframe, excepting the leads, are then encapsulated in plastic. There are many problems inherent with this type of package. These problems include the package being relatively thick, asymmetric, and having a maximum number of material interfaces. An asymmetric package creates increased bonding stresses that act on the die while material interfaces cause a molded semiconductor package to be more susceptible to failure during vapor phase, solder dip, infra red and high stress testing. A prominent test for molded semiconductor packages is to saturate them with moisture or water vapor, followed within a short time by immersion in either a solvent vapor or a liquid solder at or above the soldering temperature. Water absorption in some currently used plastic molded packages has been measured by a weight gain of 0.4%. Upon sudden heating, this water will vaporize and rapidly build up pressure. This results in packages that may crack, and in extreme cases, literally blow apart. This test is particular destructive if there is condensed water in package voids that generally occur at the material interfaces. Even if the molding is perfect, voids may still be produced as a result of mechanical stresses in the package due to thermal expansion differences between the molding compound, mounting flag and silicon die. Cracks in the molding compound have occurred between the die and flag, die and molding compound and the flag and molding compound. It is also common for voids to occur at the die bond areas. Cracks and separations in the molded semiconductor packages are especially detrimental in that they cause damage to the wire bonds as well as to the die. It is common for large amounts of stress to act upon the semiconductor die, especially at the sides and corners as a crack propagates throughout the plastic molding compound. Commonly, a separation of the passivation layer from the remainder of the die results and causes damage to the metal circuitry of the semiconductor die. Of course, this results in failure of the semiconductor device. Therefore, it would be highly desirable to have a molded semiconductor package that is thin, symmetrical so as to eliminate various bonding stresses and has a minimum number of material interfaces so as to reduce the number of voids contained therein. Another problem commonly encountered with the use of molded semiconductor packages is that of heat dissipation. It is desirable for heat to flow out of the package through the metal leads because only a minimal amount of heat will actually flow out through the plastic encapsulation itself. Heat often encounters difficulty in flowing from the die to the leads and is essentially trapped within the plastic package. This heat is liable to cause temperature cycling damage due to the thermal expansion coefficient mismatch of the various materials as well as inhibiting device performance. Therefore, an improved thermal path would also be highly desirable. The following references are representative of the prior art. French patent 2 456 390 discloses a lead tap for TAB bonding wherein a semiconductor die is TAB bonded directly to leads of the leadframe to make electrical connections between the leadframe and the semiconductor die. Various embodiments show an organic film disposed beneath the TAB lead tape for support. United States patent no. 4,680,613 issued to Daniels et al and entitled 'Low Impedance Package for Integrated Circuit Die discloses a dual in-line semiconductor package wherein a die is disposed in a die opening of a leadframe. The die itself is physically mounted on a ground plane and not the leads of a leadframe. From European patent publication EP-A- 0198194 there is known a molded flagless semiconductor package comprising a lead frame, of which leads overlap the die and are wire bonded thereto. Summary of the Invention According to the present invention there is provided a molded semiconductor package as claimed in claim 1. Exemplary embodiments of the present invention will now be described with reference to the accompanying drawings. Brief Description of the Drawings FIG. 1 is an enlarged top-view of a portion of a first embodiment of the present invention; FIG. 2 is an enlarged cross-sectional view of a portion of the first embodiment of the present invention taken from line 2-2 of FIG. 1; FIG. 3 is an enlarged top-view of a portion of a second embodiment of the present invention FIG. 4 is an enlarged cross-sectional view of a portion of the second embodiment of the present invention taken from line 4-4 of FIG. 3; FIG. 5 is an enlarged top-view of a portion of a third embodiment of the present invention; FIG. 6 is an enlarged cross-sectional view of a portion of the third embodiment of the present invention taken from line 6-6 of FIG. 5; FIG. 7 is an enlarged top view of a portion of a fourth embodiment of the present invention; FIG. 8 is an enlarged cross-sectional view of a portion of the fourth embodiment of the present invention taken from line 8-8 of FIG. 7; Detailed Description of the Invention FIG. 1 is an enlarged top view and FIG. 2 is an enlarged cross-sectional view taken from line 2-2 of FIG. 1 of portions of a molded semiconductor package having a flagless leadframe 22a. A semiconductor die 10a includes a first surface 12a, a second surface 14a, sides 16a and corners 18a. Semiconductor die 10a is disposed in die opening 20a of leadframe 22a which is larger than the periphery of semiconductor die 10a in this embodiment. Leadframe 22a further includes corner leads 24a which serve to bond semiconductor die 10a to leadframe 22a and electrical bonding leads 28a which serve as electrical contacts to the semiconductor package. In this embodiment, an organic adhesive 26a is employed to bond die bonding leads 24a to semiconductor die 10a at corners 18a although an alternative adhesive could be used. Leads other than corner leads 24a may be used to bond semiconductor die 10a to leadframe 22a. For example, certain leads 28a could be bonded to semiconductor die 10a at its sides 16a, in which case corner leads 24a could be used to make electrical contacts. Electrical bonding leads 28a are selectively wire bonded to semiconductor die 10a to form the electrical contacts. One skilled in the art will recognize that electrical bonding leads 28a may be included in leadframe 22a to enhance heat dissipation. An encapsulation 30a is shown disposed about semiconductor die 10a as well as portions of corner leads 24a and electrical bonding leads 28a. One skilled in the art will understand that the wire bonds (not shown) are also encapsulated by encapsulation 30a. It should be noted that electrical bonding leads 28a extend from encapsulation 30a to serve as external contacts to the molded package. Encapsulation 30a is comprised of molded plastic in this embodiment, however, it should be understood that many well known encapsulates may be employed. It should be noted that the semiconductor package illustrated by FIGS. 1 and 2 is substantially symmetrical. This is because leads 24a and 28a are essentially coplanar with semiconductor die 10a. Because the package is symmetrical, some stresses are reduced and semiconductor die 10a is subject to lesser amounts of stress. Further, the absence of a flag in leadframe 22a allows for a thinner package which is always desirable to save space. Additionally, there are a limited number of material interfaces because there is no flag and no die bond material bonding semiconductor die 10a thereto. FIG. 3 is an enlarged top view and FIG. 4 is an enlarged cross-sectional view taken from line 4-4 of FIG. 3, of portions of a molded semiconductor package having a flagless leadframe 22b. In this embodiment, the periphery of semiconductor die 10b is larger than die opening 20b, depicted by dotted line 32. Second surface 14b of semiconductor die 10b is bonded to leadframe 22b above die opening 20b. Again, semiconductor die 10b is bonded to leadframe 22b by organic adhesive 26b although other adhesives may be employed. Although the embodiment depicted in FIG.s 3 and 4 is not symmetrical, it includes a reduced number of material interfaces because it contains no flag and does not have a complete layer of die bond material. The reduced number of material interfaces creates fewer voids within the semiconductor package thereby making it less susceptible to moisture saturation. FIG. 5 illustrates an enlarged top view and FIG. 6 is an enlarged cross-sectional view taken from line 6-6 of FIG. 5 of portions of a molded semiconductor package having a flagless leadframe 22c. This embodiment further includes a guard ring 34. Guard ring 34 is a part of leadframe 22c in this embodiment and is comprised of the same material as leadframe 22c. It can be seen that guard ring 24 attaches to support leads 36 of leadframe 22c. Guard ring 34 is not physically connected to electrical bonding leads 28c and therefore, does not hinder electrical connections within the package. Guard ring 34 defines the periphery of die opening 20c. Semiconductor die 10c is disposed in die opening 20c and is bonded thereto by organic adhesive 26c at its corners 18c. Again, it should be understood that semiconductor die 10c may be bonded to guard ring 34 of leadframe 22c by organic adhesive 26c or another adhesive at its sides 16c. Because guard ring 34 protects the high stress sides 16c and corners 18c of semiconductor die 10c, stress does not readily damage it and the lifetime of the semiconductor package is thereby increased. Again, it should be noted that a symmetrical package has been created. This is extremely beneficial for the reasons discussed earlier. FIG. 7 is an enlarged top view and FIG. 8 is an enlarged cross-sectional view taken from line 8-8 of FIG. 7 of portions of a molded semiconductor package having a flagless leadframe 22d. This embodiment includes a guard ring 38 that is not part of leadframe 22d. Guard ring 38 may be comprised of metal, plastic, silicon, ceramic or one of many other materials having coefficient of thermal expansion similar to the material of leadframe 22d. It should be understood guard ring 38 may be comprised of a different material than leadframe 22d. Guard ring 38 is disposed around semiconductor die 10d and is bonded thereto by organic adhesive 26d. Again, semiconductor die 10d is bonded to guard ring 38 at corners 18d, however, it should be understood that bonding may occur at sides 16d. Guard ring 38 is also bonded to leads 42 of leadframe 22d. Although an organic adhesive 40 is employed in this embodiment to adhere leads 42 to guard ring 38, it should be understood that many other adhesives may be used. Guard ring 38 serves to protect the high stress areas of semiconductor die 10d as does guard ring 34, discussed earlier. Again, the resulting package is relatively thin, substantially symmetrical and has a minimum number of material interfaces due to the exclusion of a leadframe flag.

Claims: A molded semiconductor package having a flagless leadframe (22a-22d) comprising: a semiconductor die (10a-10d) having a first surface (12a-12d), a second surface (14a-14d), sides (16a-16d) and corners (18a-18d); a flagless leadframe (22a-22d) including leads (24a-24d, 28a-28d), some of said leads (24a-24d) of said leadframe (22a-22d) being electrically insulatingly adhesively bonded to the periphery of said semiconductor die (10a-10d) thereby physically supporting the die and further, other of said leads (28a-28d) of said leadframe extending towards said semiconductor die (10a-10d) and spaced therefrom and being electrically connected to said semiconductor die (10a-10d) by wire bonding; and an encapsulation (30a-30d) disposed about said semiconductor die (10a-10d) and part of said leadframe (22a-22d). The package of claim 1 wherein said some of said leads extend to overlie the die and are bonded to said second surface (14b) of said semiconductor die (10b). The molded semiconductor package of claim 1 , said some of said leads non-overlyingly extend to adjacent the semiconductor die (10a, 10c, 10d), the leadframe (22a, 22c, 22d) being disposed essentially coplanar with said semiconductor die (10a, 10c, 10d) and said leadframe (22a, 22c, 22d) being bonded to said sides or corners of said die (10a, 10c, 10d).

Inventors: HAWKINS GEORGE WAYNE, HUNTER WILLIAM LESLIE, LESK ISRAEL ARNOLD, MCSHANE MICHAEL B, THOMAS RONALD E, HAWKINS, GEORGE WAYNE, HUNTER, WILLIAM LESLIE, LESK, ISRAEL ARNOLD, MCSHANE, MICHAEL B., THOMAS, RONALD E.
Applicants: MOTOROLA INC, MOTOROLA, INC.
Application year: 1989
Main classification: H01L23
IPC codes: H01L23