IC connection/disconnection mechanism and method for carrying out the connection/disconnection

Abstract: An IC connection/disconnection mechanism and a method for carrying out the same comprises a lifting plate (3) for mounting and lifting the IC (1) having a lead frame thereon, a measuring socket (2) mounted on a base (6) and having terminals (2B) capable of contacting the terminals (1B) of the IC (1), stoppers (5) mounted on the base (6), first springs (4) coiled around stoppers (5) for supporting the lifting plate (3), a pusher (9) having recesses at both sides thereof in which presser pins (7) are housed corresponding to the stoppers (5), and second springs (8) coiled around the presser pins (7) and having resilience force greater than that of the first springs (4). Due to difference of the resilience forces of the first and the second springs (4, 8), firstly the pusher (9) is moved away from the lifting plate (3), then the lifting plate (3) makes the IC (1) move away from the measuring socket (2).

Description: The present invention relates to an IC (integrated circuit) connection/disconnection mechanism and a method for carrying out an IC connection/disconnection, especially to a mechanism for connecting and disconnecting a flat type IC having the lead frame therearound to and from a measuring device or socket. A prior art connection/disconnection mechanism and a method for carrying out such a connection will be described. The typical flat type IC in a manufacturing process as shown in Fig. 5 has an IC 1, a plurality of terminals 1B integrated with the IC 1 at a periphery thereof, and a lead frame integrated with the IC 1, having guide holes 1A, positioned in the manner to surround the IC 1 but severed from the IC 1 after completion of a test thereof. The test of the IC 1 is carried out for measuring a normal function or operation of the IC with use of the measuring socket (not shown) in the manner that firstly, the IC 1 having the lead frame 1C is usually positioned over the measuring socket having guide pins (not shown) corresponding to the guide holes 1A of the lead frame, secondly, the guide pins of the measuring socket are inserted into the guide holes 1A of the IC 1 so that the IC 1 is set on the measuring socket. After completion of the test, the guide holes 1A of the lead frame 1C of the IC 1 are moved away and extracted from the guide pins of the measuring socket whereby the IC 1 is removed from the socket. Such an absorbing mechanism for detachably mounting the IC 1 on the measuring socket is disclosed in Japanese Utility Model Application No. 62-129377 (published as JP-U-6434190). However, the absorbing mechanism has the problem that the lead frame is not extracted from the guide pins due to deformation of the lead frame or guide holes. It is in object of the present invention to provide an IC connection/disconnection mechanism and a method for carrying out an IC connection/disconnection for preventing a lead frame of the IC from being deformed as it is extracted from a measuring socket at the time of disconnection operation thereof so that the IC can be connected to and disconnected from the measuring socket with ease for assuring the test of the IC in a stable condition. To achieve the above object, an IC connection/disconnection mechanism of the present invention comprises the features of claim 1. Furthermore, a method for carrying out an IC connection/disconnection comprising the steps of claim 3 is provided. The above and other objects, features and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings. Fig. 1 is an arrangement of an IC connection/disconnection mechanism; Fig. 2 is a perspective view of assistance in explaining relationship of an IC, a measuring socket attached to a base, and lifting plate which are respectively constituents of the IC connection/disconnection mechanism; Fig. 3 is a view of assistance in explaining a movement of a pusher which is a constituent of the IC connection/disconnection mechanism, Fig. 4 is a view of assistance in explaining a state where the pusher contacts the IC; and Fig. 5 is a plan view of a flat type IC having a lead frame therearound. A preferred embodiment of the present invention will be described with reference to Figs. 1 to 4. The IC connection/disconnection mechanism comprises an IC 1 having a plurality of terminals 1B provided at peripheral surface thereof and a lead frame 1C detachably integrated therewith and having a plurality of guide holes 1A, a measuring socket 2 attached to a base 6 which is positioned under the IC 1 and having a plurality of measuring terminals 2B corresponding to a plurality of terminals 1B for contacting a plurality of terminals 1B of the IC 1 and guide pins 2A corresponding to the guide holes 1A of the lead frame 1C for inserting into the guide holes 1A, a lifting plate 3 having an opening 3A corresponding to the socket 2 at the central portion thereof for receiving, supporting and lifting the IC 1, stoppers 5 mounted on the base 6 for supporting the lifting plate 3 and composed of upper portions 5a attached to the lifting plate 3 at the four corners thereof and lower portions 5b located under the lifting plate 3 and having gaps g for determining a range of vertical movement of the lifting plate 3 between the lower portions 5b and the lifting plate 3, first springs 4 coiled around the lower portions 5b and the upper portion 5a between the lifting plate 3 and the base 6, a pusher 9 positioned over the lifting plate 3 having recesses at both sides thereof in which presser pins 7 are housed to be positioned on the stoppers 5, second springs 8 coiled around the presser pins 7 in the recesses, and a drive mechanism 10 such as an air cylinder for driving the pusher 9 vertically. The IC connection/disconnection mechanism further includes a pressure reducing valve 11 for regulating the pressure to be supplied to the drive mechanism 10 depending on a type of the ICs so that the vertical movement of the pusher 9 is regulated. Resilience force of the second springs 8 is set to be greater than that of the first springs 4. A method for carrying out the IC connection/disconnection will be described. An operation for contacting or connecting the IC 1 with the socket 2 will be first described. The guide pins 2A of the socket are inserted into the guide holes 1A of the IC 1, then the IC 1 is placed on the lifting plate 3 (Fig. 2). At the state in the arrangement of Fig. 1, the pusher 9 is lowered by the forward actuation of the drive mechanism 10 whereby firstly, the presser pins 7 contact the upper stoppers 5a of the stoppers 5, secondly, the first springs 4 are constricted with lowering motion of the upper stoppers 5, thirdly, the lifting plate 3 brings into contact with the lower stoppers 5b and stops in a state where the gap g is reduced to zero as shown in Fig. 3. The second springs 8 is not constricted in the state of Fig. 3. At the state of Fig. 4, further lowering motion of the pusher 9 make the second springs 8 constircted so that the pusher 9 is lowered in proportion to the amount of constriction of the second springs 8 and contact the IC 1 for thereby permitting the terminals 1B of the IC 1 to contact the measuring terminals 2B of the socket 2. An operation for disconnecting the IC 1 from the socket 2 will be then described. At the state of Fig. 4, the pusher 9 is rised by the reverse actuation of the drive mechanism 10 whereby the second springs 8 are released from the constriction thereof and the pusher 9 is moved away from the lifting plate 3 as shown in Fig. 3. Further rising of the pusher 9 makes the second springs 4 release from the constriction thereof for thereby rising the lifting plate 3 with the resilience force thereof whereby the guide pins 2A are moved away or disconnected from the guide holes 1A of the IC 1. In summary, the IC connection/disconnection is carried out in the steps of firstly inserting the guide pins 2A of the socket 2 into the guide holes 1A of the IC 1 to thereby place the IC 1 on a lifting plate 3, secondly, lowering the pusher 9 by forward actuation of the drive mechanism 10 for allowing the presser pins 7 of the pusher 9 to contact the lifting plate 3 so that the first springs 4 are constricted, thirdly, further lowering the pusher 9 by further forward actuation of the drive mechanism 10 to constrict the second spring 8 so that the terminals 1B of the IC 1 contact and connect to the measuring terminals 2B of the socket 2, fourthly, rising the pusher 9 by reverse actuation of the drive mechanism 10 for allowing the second springs 8 to release from the constriction thereof so that the pusher 9 is moved away from the IC 1, and fifthly further rising the pusher 9 by further reverse actuation of the drive mechanism 10 for allowing the first spring 4 to release from the constriction thereof to thereby rise the lifting plate 3, whereby the guide pin 2A is moved away from the guide hole 1A. That is, due to the difference of the resilience forces of the first and second springs 4, 8, firstly the pusher 9 is moved away from the lifting plate 3, then the lifting plate 3 makes the IC 1 move away from the socket 2. With the arrangement of the IC connection/disconnection mechanism of the present invention, inasmuch as the second springs held in the pusher have resilience force greater than that of the first springs for supporting the lifting plate so that the IC is lifted by the lifting plate, it is not necessary to adjust the height of the pusher and the presser pins relative to the IC whereby the IC can be connected to and disconnected from the socket which assures the precise measurement of the IC in a stable condition. Furthermore, inasmuch as the vertical movement of the pusher is regulated by the pressure reducing valve, the contact pressure of the pusher with respect to the IC can be regulated according to the type of the ICs.

Claims: An IC connection/disconnection mechanism for an IC (1) having a plurality of terminals (1B) provided at peripheral surface thereof and a lead frame (1C) detachably integrated therewith and having guide holes (1A); the IC connection/disconnection mechanism comprising: a measuring socket (2) attached to a base (6), to be positioned under the IC (1) and having a plurality of measuring terminals (2B) corresponding to the plurality of terminals (1B) and for contacting the plurality of terminals (1B) of the IC(1), and guide pins (2A) corresponding to the guide holes (1A) of the lead frame for inserting into the guide holes (1A) of the IC (1); a lifting plate (3) having an opening (3A) corresponding to the socket (2) at the central portion thereof for receiving, supporting and lifting the IC (1); stoppers (5) mounted on the base (6) for supporting the lifting plate (3) and composed of upper portions (5a) attached to the lifting plate (3) at the four corners thereof and lower portions (5b) located under the lifting plate (3) and having gaps (g) between the lower portions (5b) and the lifting plate (3) for determining a range of vertical movement of the lifting plate (3); first springs (4) coiled around the lower portions (5b) between the lifting plate (3) and the base (6); a pusher (9) positioned over the lifting plate (3) having recesses at both sides thereof in which presser pins (7) are housed to be positioned on the stoppers (5); second springs (8) coiled around the presser pins (7) in the recesses, the resilience force of the second springs (8) being greater than that of the first springs (4); and a drive mechanism (10) for driving the pusher (9) vertically. An IC connection/disconnection mechanism in accordance with Claim 1, further including a pressure reducing valve (11) for regulating the pressure to be supplied to the drive mechanism (10) depending on the type of the ICs so that the vertical movement of the pusher (9) is regulated. A method for carrying out an IC connection/disconnection comprising the steps of: (1) inserting guide pins (2A) of a socket (2) into guide holes (1A) of an IC (1) to thereby place the IC (1) on a lifting plate (3); (2) lowering a pusher (9) by forward actuation of a drive mechanism (10) for allowing presser pins (7) of the pusher (9) to contact the lifting plate (3) so that first springs (4) are constricted; (3) further lowering the pusher (9) by further forward actuation of the drive mechanism (10) to constrict second springs (8) so that terminals (1B) of the IC (1) contact and connect to measuring terminals (2B) of the socket (2); (4) rising the pusher (9) by reverse actuation of the drive mechanism (10) for allowing the second springs (8) to release from the constriction thereof so that the pusher (9) is moved away from the IC; and (5) further rising the pusher (9) by further reverse actuation of the drive mechanism (10) for allowing the first springs (4) to release from the constriction thereof to thereby rise the lifting plate (3), whereby the guide pins (2A) are moved away from the guide holes (1A).

Inventors: MITSUI OSAMU, YAJIMA ATSUSHI, MITSUI, OSAMU, YAJIMA, ATSUSHI
Applicants: ANDO ELECTRIC, ANDO ELECTRIC CO., LTD.
Application year: 1989
Main classification: G01R31
IPC codes: H01L21, H05K7, G01R31, H01R13