Soldering apparatus of a reflow type

Abstract: A soldering apparatus (4) of a reflow type contains a preheating chamber (8, 9) and a reflow chamber (10) which are provided with a plurality of heaters (11) for heating printed circuit boards (1) with chips (2) temporarily mounted thereon with solder pastes (3) during conveyance by a conveyor (5). The heaters (11) are provided with a screening member (26) and/or a partition member (12) so as to prevent direct radiation of radiant heat from the heaters (11) into the chambers and onto the printed circuit boards (1) and to provide a unform air flow so as to be blown uniformly onto the printed circuit boards (1). The heaters (11) are arranged so as to heat them in such a manner as to ascend temperatures in the order from an inlet (6) to an outlet (7) so as to become higher with a predetermined temperature differential from the previous heater, thus removing bubbles generated upon fusion of the solder pastes (3) and minimizing a heat shock exerted on the chips (2) when they are heated. The soldering apparatus is further provided with a combustion unit (20) with a catalyst (23) for removing fume and odoring gases generated in the chamber and for circulating the heated air after removal of such fume and gases. These arrangement can provide printed circuit boards of higher quality and with high productivity.

Description: The present invention relates to a soldering apparatus of a reflow type and, more particularly, to a soldering apparatus of a reflow type in which electric parts such as chips temporarily mounted on a printed circuit board are soldered with solder preforms or solder pastes in a reflow chamber of the soldering apparatus after preheating them in a preheating chamber thereof. A conventional soldering apparatus of the reflow type is arranged so that printed circuit boards on which chips have been temporarily mounted with solder preforms, solder pastes or adhesives are then exposed to heated air or far infrared rays to fuse or melt the solder preforms or the like, thus soldering the chips on the printed circuit boards. One conventional soldering apparatus of the reflow type (see JP-A-63-180,368) is shown in cross-sectional side view in FIG 2 of the accompanying drawings, in which printed circuit boards 101 with chips 102 temporarily mounted thereon with solder paste 103 are placed on a belt conveyor 105 of a metal network being conveyed in a direction shown by the arrow A. The soldering apparatus 104 is provided with a first preheating chamber 106 and a second preheating chamber 107 at positions along the direction of conveyance of the belt conveyor 105 and symmetrically and vertically interposing the belt conveyor 105. The first and second preheating chambers 106 and 107 are provided each with an air inlet 106a and 107a and an air discharge outlet 106b and 107b, respectively. Air is sucked into the chambers 106 and 107 through the air inlets 106a and 107a, respectively, and the air is heated with a heater 109, such as a sheathed heater or a far infrared ray heater, mounted at their respective air discharge outlets 106b and 107b to temperatures as high as approximately 140 °C, for example, below the fusion point of the solder paste 103 or the like, thus preheating the printed circuit boards 101 being conveyed in the chambers 106 and 107. The preheated printed circuit boards 101 are then conveyed to a reflow chamber 108 in the soldering apparatus 104, which is provided at a discharge exit 108b thereof with a heater 110, such as a sheathed heater or far infrared ray heater. The printed circuit boards 101 are in turn heated with air sucked from an air inlet 108a by the heater 110 at temperatures as high as 215°C, at the fusion point of the solder paste or the like or higher, thus soldering the chips 102 on the printed circuit boards 101. The heated air is discharged through the discharge outlet 108b. The preheating chambers 106 and 107 and the reflow chamber 108 are further provided each with a fan 111 which is connected through a rotary shaft 112 to each other and to a motor 113. The fans 111 then ventilate heated air in and from the chambers in a direction given by the arrow B. The soldering apparatus 104 is also provided with a cooling fan 114 for cooling the fused or melted solder paste 103 to solidify it and ensure the fixed mounting of the chips 102 to the printed circuit boards 101. The heater 109 or 110, such as a sheathed heater or a far infrared ray heater, generates radiant heat containing far infrared rays, and the far infrared rays have the advantage that they are likely to heat even the inside of the chips 102 as compared with a heating system applying a thermal conduction of heated air. It is to be noted, however, that, as the solder paste 103 has a larger reflectance than the chips 102, the far infrared rays require a longer time for heating the solder paste 103 than for heating the chips 102, whereby the chips 102 are heated earlier than the solder paste 103 and it takes a longer time to solder the chips 102. In a heating system using the heater 109 or 110 it is more difficult to set heating requirements than in a heating system using heated air because there are many varieties and sizes of printed circuit boards 101. Furthermore, when a reflecting plate is provided for reflecting heat from the heater 109, 110, the reflecting surface may be coated by flux scattering from the solder pastes 103, thereby decreasing the thermal efficiency of the heater 109, 110. The air heated by the heaters 109 in the first and second preheating chambers 106 and 107 is ventilated downwardly by means of rotation of the ventilating fan 111, but this causes turbulence to occur. The heating by the air in a turbulent state in association with the heater 109, 110 has the tendency to cause irregularity in the heating of the printed circuit boards 101, particularly in a direction perpendicular to the direction (shown by the arrow A) of conveyance of the printed circuit boards 101, namely, in a widthwise direction thereof. In other words, a difference in temperatures is likely to occur between a middle portion of the printed circuit board 101 and both end portions in a widthwise direction thereof. If such printed circuit boards 101 are conveyed for soldering to the reflow chamber 108 where the air is likewise in a turbulent flow, the solder pastes 103 are fused in such an irregular state that a uniform soldering cannot be ensured. In view of the above state of the art it would be desirable to provide a soldering apparatus of a reflow type capable of blocking radiant heat including far infrared rays generated from the heaters and as a consequence removing an impact of radiant heat upon printed circuit boards due to far infrared rays, whilst preheating the printed circuit boards as a whole at uniform temperatures in the preheating chambers and fusing the solder paste in uniform manner in the reflow chamber. The soldering apparatus of a reflow type of the present invention, like that of Fig. 2, comprises a conveyor means for conveying a printed circuit board on which a chip is temporarily mounted with a solder paste successively through at least one preheating chamber for preheating the printed circuit board and a reflow chamber for soldering the chip on the printed circuit board by fusion of the solder paste. Each of the preheating and reflow chambers has a fan for ventilating air in the chamber, a heater for heating air in the chamber, and an air inlet and an air outlet for circulating air heated by the heater. The soldering apparatus of the present invention is characterized in that each of the heaters is mounted on a side wall of its respective chamber, in that each of the air ventilating fans is located in its chamber downstream of the heater thereof in the air circulation between air inlet and air outlet, and in that each chamber includes a screening member mounted along the heater so as to prevent direct radiation of radiant heat into the chamber and onto a circuit board on the conveyor means. In preferred embodiments of the apparatus of the present invention, the preheating and/or reflow chambers may be provided with a flow transforming member in order to heat the printed circuit boards in uniform manner by transforming flow of heated air into a laminar flow. With this preferred arrangement, the radiant heat generated from the heaters can be blocked, preventing the heating of the printed circuit boards by the radiant heat. Furthermore, the air heated in the preheating chamber and in the reflow chamber is blown to the printed circuit boards as a whole in uniform manner by allowing the heated air to pass through the air flow transforming member as a laminar flow, in addition to forcible circulation of the heated air by rotation of the ventilating fans. A preferred embodiment of a soldering apparatus of a reflow type in accordance with the invention will now be described in detail with reference to Fig. 1 of the accompanying drawings which shows a cross-sectional side view of the apparatus. Referring to FIG. 1, the preferred embodiment of the soldering apparatus 4 according to the present invention is shown to comprise a first preheating chamber 8, a second preheating chamber 9, and a reflow chamber 10, each of the first and second preheating chambers 8 and 9 and the reflow chamber 10 each being symmetrically disposed so as to vertically interpose a belt conveyor 5 of a metal network. The first preheating chamber 8 is disposed at a position upstream of the second preheating chamber 9 with respect to the belt conveyor 5, and the reflow chamber 10 is disposed at a position downstream of the second preheating chamber 9 with respect thereto. This arrangement permits the heating of a printed circuit board 1 on which a chip 2 is temporarily mounted through a solder paste 3 successively during horizontal movement of the belt conveyor 5 that conveys the printed circuit board 1 in the direction indicated by the arrow A. The conveyor means may be a conveyor chain with holding claws for holding printed circuit boards. The first preheating chamber 8 is provided with a heater 11a, such as a sheathed heater, far infrared rays heater or the like, on a side wall 8a of the chamber, and air therein is heated at approximately 160 °C, heating the printed circuit boards 1 to rapidly raise their temperatures to approximately 140 °C. The first preheating chamber 8 is further provided with a screening plate 26a in parallel to an inner surface of the outer wall 8a so as to block radiation of radiant heat containing far infrared rays generated from the heater 11a into the first preheating chamber 8. The screening plate 26a forms a heating sub-chamber 27a in association with the side wall 8a on which the heater 11a is mounted, and the provision of the screening plate 26a prevents radiant heat from radiating onto the printed circuit boards 1 with the chips 2 mounted thereon. On the first preheating chamber 8 is mounted a ventilating fan 28a operable by a motor 29a for circulating the heated air in the chamber, such as multiblade fan or the like. A flow passage (not shown) is provided communicating the heating sub-chamber 27a with the inside of the ventilating fan 28a, through which the air which is heated in the heating sub-chamber 27a by the heater 11a flows into the ventillating fan 28a and the heated air is circulated in the first preheating chamber 8. The first preheating chamber 8 is provided with an air outlet 30a at a position underneath the chamber, and the air outlet 30a in turn is provided with an flow transforming plate 32a at a position underneath the chamber so as to face the printed circuit boards 1 on the conveyor 5. The air flow transforming plate 32a serves to transform a turbulent air flow in the chamber into a laminar flow. The heated air withdrawn from the first preheating chamber 8 thus flows as a laminar flow through the air flow transforming plate 32a in the direction as shown by the arrow B and is blown uniformly onto the printed circuit boards 1 being conveyed by the belt conveyor 5. The second preheating chamber 9 has substantially the same structure as described immediately hereinabove for the first preheating chamber 8. As shown in FIG. 1, identical elements are provided with identical reference numerals to which reference symbol "b" is added. More specifically, for example, the second preheating chamber 9 is likewise provided with a heater 11b for heating air therein at temperatures as high as 140°C so as to heat the printed circuit boards 1 and retain them at 140°C in stable manner while they are conveyed by the belt conveyor 5. The printed circuit boards 1 are then conveyed to the reflow chamber 10 which in turn is substantially the same as the first preheating chamber 8, so that identical elements are provided with identical reference numeral but with reference symbol "c" after the reference numeral. The air heated in the heating sub-chambers 27a, 27b, and 27c of the preheating chambers 8 and 9 and the reflow chamber 10 flows through the flow passage therefrom into the chamber and is blown by the ventilating fans 28a, 28b, and 28c, respectively, onto the printed circuit boards 1 in the direction shown by the arrow B. More specifically, the heated air withdrawn through the air flow transforming plates 32a, 32b, and 32c at the air outlets 30a, 30b, and 30c is allowed to circulate in the soldering apparatus 4 and is then sucked again into the heating sub-chambers 27a, 27b, and 27c, respectively. The turbulent flow of heated air caused by the fans 28a, 28b and 28c is converted into a laminar flow by passing the heated air through the flow transforming plates 32a, 32b, and 32c, thus blowing the air in uniform manner onto the printed circuit boards 1 and as a consequence heating them uniformly in a widthwise direction of the printed circuit board 1. The uniform heating of the printed circuit boards 1 in the widthwise direction in the respective first preheating chambers 8 and 9 and in the reflow chamber 10, respectively, permits a uniform fusion of the solder pastes 3, causing no irregularity on soldering and providing printed circuit boards 1 of higher quality. Although it is preferred that the air flow transforming plate 32 be disposed in each of the first preheating chambers 8 and 9 and also in the reflow chamber 10, it is possible to provide only the reflow chamber 10 with the air flow transforming plate 32c. In the apparatus, no radiant heat from the heater 11 is used to heat the printed circuit boards 1, so that it will take a longer time to fuse or melt the solder pastes 3. However, the time may be shortened by an increase in a flow velocity of the heated air. The illustrated arrangement of the soldering apparatus according to the present invention can prevent damage of chips due to heat to premature fusion of the solder pastes prior to the heating of the printed circuit boards, thereby providing printed circuit boards with chips of higher quality. Furthermore an easy adjustment of temperatures in the chambers is permitted because the air in the chambers is heated by the heaters mounted within the chambers. Thus productivity is improved to a greater extent. The preheating chambers and the reflow chamber are provided at their air outlet portions facing the belt conveyor with an air flow transforming member so that the heated air is blown as a laminar flow onto the printed circuit boards in uniform manner, thus helping to prevent irregularities in fusing the solder pastes and soldering the chips. The provision of the heaters in the preheating chambers upstream of the ventilating fans permits uniform preheating of the printed circuit boards so that the printed circuit boards conveyed to the reflow chamber can be uniformly heated, leading to a uniform fusion of the solder paste. This has the advantage of reducing irregularities in soldering so that printed circuit boards of uniform and higher quality can be produced.

Claims: A soldering apparatus of a reflow type, comprising: a conveyor means (5), for conveying a printed circuit board (1) on which a chip (2) is temporarily mounted with a solder paste (3) successively through a preheating chamber (8;9) for preheating the printed circuit board and a reflow chamber (10) for soldering the chip on the printed circuit board by fusion of the solder paste, each of said chambers (8;9;10) having a fan (28a;28b;28c) for ventilating air in the chamber, a heater (11a;11b;11c) for heating air in the chamber, and an air inlet (30a;30b;30c) and an air outlet (31a;31b;31c) for circulating air heated by the heater, characterized in that: each of said heaters (11a;11b;11c) is mounted on a side wall of its respective chamber (8;9;10), in that each of said fans (28a;28b;28c) is located in its chamber (8;9;10) downstream of the heater (11a;11b;11c) thereof in the air circulation between air inlet (30a;30b;30c) and air outlet (31a;31b;31c), and in that each chamber (8;9;10) includes a screening member (26a;26b;26c) mounted along the heater (11a;11b;11c) so as to prevent direct radiation of radiant heat into the chamber and onto a printed circuit board (1) on the conveyor means (5). A soldering apparatus as claimed in Claim 1, wherein the preheating chamber (8;9) is provided at an air outlet portion (31a;31b) with an air flow transforming member (32a;32b) for providing a uniform flow of heated air in the preheating chamber. A soldering apparatus as claimed in Claim 1 or Claim 2, wherein the reflow chamber (10) is provided at an air outlet portion with an air flow transforming member (32c) for providing a uniform flow of heated air in the reflow chamber. A soldering apparatus as claimed in any preceding claim, wherein there are two said preheating chambers arranged one after the other in the path of travel (A) of said conveyor means (5).

Inventors: KONDO KENSHI, KONDO, KENSHI
Applicants: NIPPON DENNETSU KEIKI KK, NIHON DEN-NETSU KEIKI CO., LTD.
Application year: 1989
Main classification: H05K3
IPC codes: B23K1