Integrated circuit package

Abstract: Integrated circuit package comprising at least one active integrated circuit chip (1) mounted and electrically connected to a power supply distribution wiring and a chip interconnection and signal wiring both formed on the topsurface of a passive semicon­ ductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented. Spaced wells (4) of a first conductivity type are pro­ vided in the surface of said carrier of a second conductivity type. The power supply distribution wiring comprises first and second conductive lines (5, 6) within a first wiring level (WL1). Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship. Said first and second conductive lines are connected to first and second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor.

Description: This invention relates to integrated circuit packages comprising at least one active integrated circuit chip mounted and electrically connected to a power supply distribution wiring and a chip interconnection signal wiring formed on the top surface of a semiconductor interconnection carrier in which a power supply decoupling capacitor is implemented. As very large scale integrated (VLSI) circuits tend to get more complex, there is a need to switch more output driver circuits and internal latches at a faster rate in order to increase their performance. This increase in the switching rate results in an increase in the amount of electrical noise associated therewith. Various techniques have been utilized in the art to minimize the level of noise associated with the increase in the magnitude of the switching rate. One known technique for reducing the level of noise is to incorporate discrete capacitors as a decoupling capacitance between associated pins of the power supply voltage. Generally, the discrete capacitor, which is mounted at a distance from the semiconductor chip, is electrically coupled thereto by a plurality of power wiring lines or large power buses. These power wiring lines typically represent long inductance paths. Moreover, as the switching rate of the current flowing in the plurality of wiring lines increases, a voltage drop develops thereacross. The voltage drop is viewed as unwanted power distribution noise. One technique of minimizing the inductance path is to move the discrete capacitor as close as possible to the semiconductor chip. However, in view of either the layout of the wiring lines associated with the semiconductor chip or the physical dimensions of the discrete capacitor, the discrete capacitor cannot be positioned such that there is no voltage drop or noise. Additionally, the discrete capacitors used for this purpose are usually high-frequency, low-inductance capacitors which increase the cost associated with the use of this technique. The noise level created by the increase in the rate of current switching limits the performance and the number of simultaneously switchable VLSI circuits. Consequently, there is a need for a technique which reduces the noise associated with the increase in the rate of current switching and which minimizes the inductance paths and the cost associated therewith. Narken et. al. "Low Capacitive Wire Path Through High Dielectric Constant Material", IBM TDB 22, No. 12, 5330-1 (May 1980), describes a decoupling capacitor located in a multilayer structure directly below a chip with wires extending to the dielectric material of the capacitors. The arrangement is intended to minimize the inductance of the structure. Lussow "Internal Capacitors And Resistors For Multi-layer Ceramic Modules" IBM TDB 20, No. 9, 3436-7 (February 1978), describes a multilayer ceramic module with capacitors incorporated within the green sheet structure. In these prior art chip carriers it is a problem to provide capacitors with relatively high values located near the chips and to provide ultra-low inductance connections between the chips and the capacitors. High-performance packages will require on-module decoupling capacitors to suppress simultaneous switching noise. Such capacitors should have minimum inductance, ideally zero inductance. For this reason EP-A 0 083 405 discloses a ceramic carrier for any number of VLSI chips, the carrier including a build-in capacitor structure. There are aligned connector lines extending in opposite directions to eliminate out magnetic flux induced by currents in the leads to the capacitor. The capacitor comprises multiple segments which are located within the body of the carrier and which are connected such that they are adapted to easy mechanical or laser deletion for altering the capacitance of the capacitor or for removing defects after fabrication. Instead of using ceramic carriers, a packaging technique using silicon as a mulit-chip carrier is disclosed in the publication "IEEE Transactions and Components, Hybrids and Manufacturing Technology", Vol. CGMT-7, No. 2, June 1984, pp. 193 to 196. The multiple integrated circuit chips are flip-chip or face-down bonded which involves physically locating and bonding the pads of the circuit chips to corresponding pads of the wiring layers provided on the interconnection carrier. This packaging technique offers considerable advantages. Since the photoengraving technology used in the interconnection carrier and on the chips is identical, very high packaging densities are achieved, with minimum area requirements for interconnections. Furthermore, low-cost packaging can be achieved, since the carrier utilizes conventional integrated processes, and semiconductor material defects are tolerable as there are no active devices. However, there is the option of using the carrier for active devices. Continuing this packaging technology, the PCT application WO 86/02 490 discloses integrated circuit packages comprising integrated circuit chips mounted and electrically connected to a power supply distribution wiring and a chip interconnection signal wiring formed on the surface of a semiconductor interconnection carrier in which a power supply decoupling capacitor is implemented. The silicon carrier is highly doped to render it relatively conductive. A substantially planar metallization layer is formed overlaying the top-surface of the carrier. A dielectric layer is under laying a major portion of the top surface metallization layer. This portion of the metallization layer forms one plate of the carrier-size decoupling capacitor. Additionally, a continuous metallization layer is formed on the bottom surface of the carrier. The conductive carrier itself and the bottom surface layer form the other plate of this capacitor. Whenever electrical connection is between a pad on the chip and the upper surface layer, the carrier-size capacitor is also connected to the chip in low-inductance fashion for effective decoupling. In Microelectronics Journal, Vol. 16(2),p. 30-37, a package for ultra-high speed GaAs ICs is proposed in which a high resistivity Si substrate consisting of inter-digitated, reverse biased pn junctions for bypass capacitors is used as a chip carrier. These presently known and available packages have been developed mainly for bipolar chip applications. In the meantime, industry has switched from bipolar to CMOS technology on a large scale. CMOS technology offers new possibilities, that means, very high density, low power consumption, and integratability of full processor units on one chip. The available packages are optimized for multichip processor units for high power consumption and high performance bipolar chips. These packages have to support high DC-currents on power lines and even on signal lines. The CMOS VLSI technique puts new requirements on the package. The CMOS VLSI chips require very high current surges on the power supplies. Therefore a new and CMOS optimized package concept is required. The invention as claimed overcomes the problems associated with the requirement of reducing the noise caused by the increase in the rate of current switching. The invention provides an improved electronic package in which semiconductor chips are mounted on a semiconductor interconnection carrier and in which decoupling capacitors are an integrated part of the power distribution system. The chip carrier proposed is specially designed for fast and high-density CMOS applications. In order to support high-speed CMOS chips, there is a decoupling capacitor integrated in the carrier. The wiring on the chip carrier is laid out for lowest capacity and minimized impedance. Ways of carrying out the invention are described in detail below with reference to drawings which illustrate specific embodiments, in which: Fig. 1 shows a simplified plan view of an integrated circuit package, Fig. 2 shows a sectional view of the package of Fig. 1, Fig. 3 shows a simplified plan view of a section of an integrated circuit package not forming part of the Claimed invention, Fig. 4 shows a sectional view of the package of Fig. 3, Figs. 5 and 6 show simplified sectional views of first and second embodiments of the carrier structure in a package in accordance with the invention. The schematic plan view of Fig. 1 relates to an integrated circuit package comprising a passive semiconductor interconnection carrier 2 on the top-surface of which nine active circuit chips 1 are arranged, for instance. As can be seen from the schematic cross-section of Fig. 2, the flip-chip or face down bonding concept is used to connect the chips to the wiring (not shown) arranged on the top surface of the carrier 2.This concept involves physically locating and bonding the pads of the active circuit chips to the corresponding pads in the wiring on the interconnection carrier 2. To form the resistance bond and to separate the chip and the carrier, a metallic bump 15 is formed on the circuit chip 1, or on the carrier 2, or on both. There are, of course, a variety of compatible metal systems which serve this purpose, each having relative advantages over the others. Systems used are ultrasonic bonding, thermocompression bonding, and solder reflow bonding. The passive interconnection carrier 2 includes a decoupling capacitor system which, according to the invention, is optimized with respect to noise problems induced by high density and high switching rates of the circuit chips 1. The arrangement of the decoupling capacitors, the necessary power supply distribution wiring, and the chip interconnection signal wiring is described in prefer detail below with reference to Figs. 3 to 6. The schematic plan-view of an integrated circuit package shown in Fig. 3 and the cross-section along line A-A of this package shown in a similar arrangement in Fig. 4 include a section of a semiconductor inter-connection carrier 2 which preferably consists of monocrystalline silicon. This carrier 2 is highly P+ doped. In the surface of carrier 2 there are N+ wells which are preferably produced by implantation or diffusion of appropriate doping material. In the preferred embodiment, these wells consists of regularly arranged parallel stripes 4 distributed across the carrier 2. Within a first wiring level WL1, first conductive lines 5 are directly arranged on the surface of that stripes 4. These, preferably metallic, lines 5 form low-ohmic contacts to the stripes 4. Additionally, there are second conductive lines 6 deposited on the surface areas or the carrier 2 between the stripes 4 and the first lines 5. These lines 5 are in low-ohmic contact with the P+ carrier material. The first and second lines 5 and 6 are arranged in a comblike fashion. A first insulating layer 7 is deposited on the first wiring level WL1. On a second wiring level WL2, third and fourth conductive lines 8 and 9 are deposited on the first insulating layer 7. The third and fourth lines 8 and 9 extend orthogonally to the lines 5 and 6 of the first wiring level WL1. The third lines 8 are electrically connected to the first lines 5, whereas the fourth lines 9 are electrically connected to the second lines 6. The corresponding electrical connections are made by conductive vias 10 passing through the first isolating layer 7. A third line 8 is connected to a power supply bond pad supplying a positive voltage VD and the fourth line 9 is connected to a power supply bond pad supplying ground potential GND. This leads to the junction between the N+ stripes 4 and P+ carrier 2 being biased in a backward direction. The resultant depletion layer capacitance forms the decoupling capacitor to be implemented for the power supply of the active chips 1. The arrangement of the chips on the carrier 2 and the electrical connection to the wiring levels of this carrier are effected as follows. A second insulating layer 11 is deposited on the second wiring level WL2 including the third and fourth conductive lines 8 and 9. A third wiring level WL3, comprising the signal interconnection and signal wiring for the active chips 1, is deposited on the second insulating layer 11. Again, electrical connection vias 10 between the signal wiring and the second wiring level WL2 are provided where necessary for the active chip function and power supply. A third insulating layer 13 covers the third wiring level WL3 on which ball limitating pads 14 are arranged. The ball limitating pads 14, which are connected by further conductive vias 10 to lines of the third wiring level WL3, are provided with receive solder bumps 15. The solder bumps 15 form the electrical connection between the integrated circuits of the active chips 1 and the chip interconnection and signal wiring and the power supply distribution wiring arranged on the three wiring levels. Part of an integrated circuit package according to the invention is shown in Figs. 5 and 6. The embodiments shown in the schemata of Figs. 5, and 6 do not differ in principle from the package shown in Figs. 3 and 4. Therefore, only the portion containing the differences between both packages is depicted. Differences merely exist in the realization of the decoupling capacitor. In Figs. 3 and 4 the decoupling capacitors are formed by the depletion layer at the junction between the stripes 4 and the carrier material, whereas the embodiments of Figs. 5 and 6 use a combined junction/dielectric capacitor. In the embodiment of Fig. 5, N+ stripes 4 are again provided within the surface of the P+ carrier 2. The first and second conductive lines 5 and 6 of the first wiring level WL1 are in direct ohmic contact with the respective surfaces of the stripes 4 and the carrier 2 between there stripes 4. The technical significance in inherent in the additional feature providing for the second lines 6 to extend partly across the adjacent stripe areas but to be separated from the surfaces of the stripes by additional stripes 17 of a dielectric interlayer. A similar approach is implemented in the embodiment of Fig. 6, wherein the first lines 5 extend partly across adjacent carrier areas, being separated from the surface of the carrier 2 by additional stripes 18 of a dielectric interlayer. The common aspect of the embodiments according to Figs. 5 and 6 consists in the realization of the decoupling capacitor as a parallel connection of a junction capacitor and a dielectric capacitor. That means, the capacitances of both capacitors are added to yield a higher value. An important feature of the subject invention is the possibility of having an integrated circuit package with a passive semiconductor carrier combining active integrated circuit chips, the power supply of which including the necessary decoupling capacitors is optimized by adapting the power distribution wiring and the decoupling capacitors structure to the power pad grid of the active chips. The most important feature is that directly underneath each chip there is a power supply decoupling capacitor. The extremely close connection between chip and capacitor has almost no inductivity in series. Therefore, the capacitor serves as a decoupling capacitor for very high frequences. Additional advantages are, that the second wiring level WL2 normally contains only a few power lines and underpaths for the third wiring level WL3. In summary this means that the second wiring level WL2 has a very low wiring density. This is very advantageous with respect to a very low capacitance of the third wiring level WL3 and high process yield resulting from reduced inter-level shorts. Additional advantages are, that the first wiring level WL1 is directly connected to the silicon as described by Fig. 4. No isolation between silicon and metal layer is needed. Therefore, the interconnecting vias between the two is saved. The interface between metal layer and the silicon is insensitive to defects. This is especially true for the arrangement of Fig. 4 and some what less effective for the arrangements of Fig. 5 and 6.

Claims: Integrated circuit package comprising at least one active integrated circuit chip (1) mounted on and electrically connected to a power supply distribution wiring layer and a chip interconnection and signal wiring layer both formed on the top surface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented, said carrier (2) being of a first conductivity type, regularly arranged parallel stripes of spaced wells (4) of the opposite second conductivity type being provided in said surface of said carrier (2), said power supply distribution wiring layer comprising spaced first and second parallel conductive lines (5, 6) within a first wiring level (WL1), said first conductive lines (5) being deposited on the surface areas of said wells (14) in an ohmic contact relationship and said second conductive lines (6) being deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship, whereby either said first lines (5) extend partly across adjacent carrier (2) areas but are separated from the surface of said carrier areas by a dielectric interlayer (18), or said second lines (6) extend partly across the adjacent well (4) areas but are separated from the surface of said well areas by a dielectric interlayer (17), and said first and second conductive lines (5, 6) being connected to first and second terminals (VD, GND) of the power supply, respectively, so that the PN junctions between said wells (4) and the carrier material (2) embedding said wells are reverse biased, said decoupling capacitor thus being formed as a parallel connection of a junction capacitor and a dielectric capacitor. The integrated circuit package of claim 1, wherein said first and second conductive lines (5, 6) are arranged within said first wiring level (WL1) in an interlocking comblike fashion. The integrated circuit package of claim 1 or 2, wherein said power supply distribution wiring further comprises a second wiring level (WL2) having third and fourth conductive lines (8, 9), said second wiring level (WL2) is separated from the first wiring level (WL1) by a first insulating layer (7), said third conductive lines (8) are connected through vias (10) to the first lines (5), said fourth conductive lines (9) are connected through vias (10) to said second lines (6), and power pads of said chips (1) are connected to said underlying third and fourth lines (8, 9). The integrated circuit package of claim 3, wherein said third and fourth conductive lines (8, 9) are parallel lines arranged orthogonally to said first and second conductive lines (5, 6) of the first wiring level (WL1). The integrated circuit package of claim 3 or 4, wherein the grid structure of said first and second wiring levels (WL1, WL2) is adapted to the power pads of said at least one chip (1). The integrated circuit package of at least one of the claims 3 to 5, wherein said chip interconnection and signal wiring consists of one or more third wiring levels (WL3) separated from the second wiring level (WL2) by a second insulating layer (11). The integrated circuit package of claim 6, wherein the chip pads are connected to said third wiring level (WL3) by solder bumps (15).

Inventors: HAUG WERNER O DIPL-ING, KLINK ERICH ENTW-ING, KROELL KARL E DIPL-PHYS, LUDWIG THOMAS DIPL-ING, SCHETTLER HELMUT DIPL-ING, STAHL RAINER DIPL-ING, WAGNER OTTO M DIPL-ING, HAUG, WERNER O., DIPL.-ING., KLINK, ERICH, ENTW.-ING., KROELL, KARL E. DIPL.-PHYS., LUDWIG, THOMAS, DIPL.-ING., SCHETTLER, HELMUT, DIPL.-ING., STAHL, RAINER, DIPL.-ING., WAGNER, OTTO M. DIPL.-ING.
Applicants: IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION
Application year: 1989
Main classification: H01L23
IPC codes: H01L23, H01L21