An engineering plastic composition and an article made of the same

Abstract: An engineering plastic composition with excellent flowability, heat stability, and desirable mechanical properties is provided. The composition comprises an engineering plastic material and at least one p-quaterphenyl derivative of specific formula.

Description: BACKGROUND OF THE INVENTION 1. Field of the invention: This invention relates to an engineering plastic composition with excellent flowability, heat stability, and desirable mechanical properties, and to articles made of the same. 2. Description of the prior art: Many resins are known as engineering plastic materials. They include polyetherimide, polyarylketone, polysulfone, polyarylenesulfide, polyamide-imide, polycarbonate, polyphenyleneoxide, etc. These engineering plastic materials can be used in various kinds of articles that require a high-performance material with qualities such as excellent heat stability and mechanical properties. However, in general, the melt viscosities of engineering plastic materials are high, and as a result, the workability of the materials is poor. Therefore, it is not easy to use these engineering plastic materials for products to be formed with accuracy. For these reasons, there is a need for an engineering plastic composition that has a low melt viscosity, that is, satisfactory flowability, during molding. In general, as methods by which the melt viscosity of polymers can be lowered, the following two methods have been adopted: (1) to decrease the molecular weight of the polymer, and (2) to add a plasticizer or to add a processing aid. When the first method is used, the tensile strength, the impact strength, and other mechanical properties of the articles that are made of the polymer are worsened, and the heat stability of the articles declines. In the second method, many of the substances that can provide engineering plastic materials with plasticity have poor heat stability, so that these substances are not stable at the molding temperature for the engineering plastic materials. For these reasons, a plasticizer or processing aid that is effective with engineering plastic materials has not yet been found. Many attempts have been made to improve the moldability or workability of engineering plastic materials. The conventional methods for the improvement of the engineering plastic materials listed above will be described below in detail. (a) Polyetherimide In order to improve the moldability of polyetherimide, methods that involve the blending of polyetherimide with other thermoplastic resins have been proposed. For example, there are methods in which polyarylether with a low molecular weight is included in a blend (Japanese Laid-Open Patent Publication No. 59-12967), in which polyalkyl lactone with a molecular weight within specified limits is included in a blend (Japanese Laid-Open Patent Publication No. 60-156754), and in which a block copolymer made of vinyl aromatic compounds and diene compounds is included in a blend (Japanese Laid-Open Patent Publication No. 60-156753). However, compared to the heat stability of polyetherimide, the heat stability of all of these thermoplastic resins is low. Therefore, in these methods, the heat stability of polyetherimide compound is decreased. (b) Polyarylketone A method has been proposed in which the moldability of polyarylketone are improved by its being blended with polyphenylenesulfide (Japanese Laid-Open Patent Publication No. 57-172954). In this method, in order that the moldability will be improved sufficiently, it is necessary to include a large amount (tens of percents by weight based on the total weight of the resin) of polyphenylenesulfide in the blend. For this reason, the excellent mechanical properties of polyarylketone decline. (c) Polysulfone A method has been proposed in which a thermoplastic resin other than polysulfone is blended with polysulfone in order to improve its flowability. For example, there are the method in which polyurethane is blended with polysulfone (Japanese Laid-Open Patent Publication No. 50-144750), the method in which poly(alkylene-phenylene)ester or poly(alkylene-phenylene)ether is blended with polysulfone (Japanese Laid-Open Patent Publication No. 50-146648), the method in which a copolymer of an aromatic vinyl monomer and maleimide monomer is blended with polysulfone (Japanese Laid-Open Patent Publication No. 61-66750), and the method in which copolymer of acrylonitrile, butadiene, and styrene is blended with polysulfone (Japanese Laid-Open Patent Publication No. 56-167752). The heat stability of all of the thermoplastic resins used in the above methods is inferior to that of polysulfone. For that reason, the excellent heat stability of the polysulfone is decreased by their use. (d) Polyarylenesulfide Methods have been proposed in which solid polyethylene is added to polyarylenesulfide (Japanese Laid-Open Patent Publication No. 54-47752) and in which a block copolymer of hydrogenated conjugated dienes and aromatic compounds with one vinyl group is added to polyarylenesulfide (Japanese Laid-Open Patent Publication No. 59-217760). However, with these techniques, because the heat stability of the polymers used is inferior to that of the polyarylenesulfide, the superior heat stability of the polyarylenesulfide is decreased. (e) Polyamide-imide The method has been proposed in which an aromatic aminocarboxylic acid or its derivative or else an aromatic diamine with one of its amino groups masked is added as an agent to regulate the molecular weight when polyamide-imide is polycondensed (Japanese Laid-Open Patent Publication No. 61-44928). However, although the moldability and workability of the polyamide-imide obtained by this method are good, the density of cross-linking caused by the reaction that takes place in the polyamide-imide during the time of post-curing is decreased, so that the excellent qualities of polyamide-imide cannot be maintained. (f) Polycarbonate The glass transition temperature of polycarbonate is high (140-150°C), and its mechanical properties, dimensional stability and transparency are extremely good. Because of its mechanical properties, heat stability and other qualities, polycarbonate is suitable for use in machine parts, electrical parts, optical parts, and other products in which high performance is needed. This resin has heat stability, mechanical properties, and water absorbance superior to those of other transparent materials such as polymethylmethacrylate. However, because its melt viscosity is high, the molecules of the resin come to be oriented in the direction of the flow of the resin when a product is being molded, so that double refraction readily arises in the product obtained. Therefore, it is difficult, for example, to use polycarbonate in the manufacture of a transparent substrate for precision optical systems in which information is recorded and reproduced by the radiation of a laser beam on the substrate. When polycarbonate is used as a resin in machine parts or electrical parts, in order to increase the mechanical properties of the part, glass fibers are added to the polycarbonate. The addition of glass fibers to a polycarbonate composition further worsens the flowability; and high temperatures are needed in molding (300-360°C). If this composition is heated to 350° or more, the product may be discolored. A number of methods have been suggested to obtain a resin composition that confers low degree of double refraction by the improvement of the flowability at the time of molding of the polycarbonate. For example, there is a method in which a styrene-type copolymer is mixed with polycarbonate (Japanese Laid-Open Patent Publication Nos. 63-90556 and 63-90557), and a method in which polylactone and a styrene-type polymer are mixed with polycarbonate (Japanese Laid-Open Publication No. 63-90555). Also, methods have been suggested that involve the addition of an agent to regulate the molecular weight at the time of the preparation of the polycarbonate (Japanese Laid-Open Patent Publication Nos. 61-123625 and 63-43925). As the agent for the regulation of molecular weight, phenol with one specific aliphatic chain can be used. However, with all of these methods, the excellent heat stability and mechanical properties of the polycarbonate are greatly decreased. A method has been proposed in which an ester of aromatic carboxylic acid is added to polycarbonate (Japanese Patent Publication No. 58-13586) and another method has been proposed in which organic carbonate is added (Japanese Patent Publication No. 60-34584). However, these compounds that may function as a plasticizer or processing aid for polycarbonate are not stable at the high molding temperatures of 260-320 o C. (g) Polyphenylene oxide A mixture of polyphenylene oxide and polystyrene and a mixture of polyphenylene oxide and nylon are commercially available. However, in a composition of polyphenylene oxide that contains a large amount of polystyrene or nylon, the moldability is improved but the heat stability is decreased. When glass fibers are added to these blends, the heat stability and mechanical properties of the mixtures obtained are excellent, but the flowability is poor and the moldability declines. Other methods have also been proposed. For example, there is a method in which a copolymer of a vinyl aromatic compound and an unsaturated dicarboxylic anhydride is blended with polyphenylene oxide (Japanese Laid-Open Patent Publication No. 58-42648); there is another method in which polyalkylene glycol is blended with polyphenylene oxide (Japanese Laid-Open Patent Publication No. 59-20354). In these methods also, however, the mechanical properties and heat stability of the polyphenylene oxide are worsened. The p-quaterphenyl derivatives used in this invention have been known for many years. For example, methods for preparing these p-quaterphenyl derivatives are described in Journal of the Chemical Society 1379-85 (1940); in Synthesis 537-538 (1978); and in Japanese Laid-Open Patent Publication No. 61-293932. However, the p-quaterphenyl derivatives have high melting point and rigidity, so that there are very few cases in which p-quaterphenyl derivatives are used as additives for plastic materials. As one of the very few examples, Soviet Patent No. 186124 (10.14,1966) discloses the use of 4,4'''-dihydroxy-p-quaterphenyl as an agent for prevention of coloration in the preparation of polyamide by condensation polymerization. US-A-926 008 (Weaver et al.) describes copolyester molding compositions having good processability by way of reduction in necessary processing temperatures and pressures. The compositions include copolyesters of bisphenol-A with terephthalic acids and one or more of the poly(phenylethers) of the formula wherein n = 1-4 and R is selected from H, halogen phenyl, or lower alkyl substituted phenyl, or p-quaterphenyl. SUMMARY OF THE INVENTION An engineering plastic composition, which overcomes the above-discussed and numerous other disadvantages and deficiencies of the prior art comprises an engineering plastic material and one or more p-quaterphenyl derivatives selected from the group consisting of the compound of formula I and II: wherein R¹ and R², independently, are -H, -COCH₃, -CH₂CH₂OH, -CH₂CH₂OH, -CH₂CH₂OCOCH₃, -CH₂CH(CH₃)OH, -CH₂CH(CH₃)OCOCH₃, or alkyl containing from 1 to 15 carbon atoms, wherein said engineering plastic material consists of one material or a blend of materials selected from the group consisting of polyetherimide, polyarylketone, polysulfone, polyarylenesulfide, polyamideimide, polycarbonate, and polyphenyleneoxide, and wherein said one or more p-quaterphenyl derivatives are present in a total amount of from 0.1 to 15 parts by weight for each 100 parts by weight of said engineering plastic material. In a preferred embodiment, the one or more p-quaterphenyl derivatives are present in a total amount of from 0.5 to 12 parts by weight for each 100 parts by weight of the engineering plastic material. In a preferred embodiment, the composition further comprises reinforcing fibers, wherein the reinforcing fibers are present in an amount of 0.1 to 400 parts by weight for each 100 parts by weight of the engineering plastic material. In a preferred embodiment, the reinforcing fiber is present in an amount of from 5 to 200 parts by weight for each 100 parts by weight of the engineering plastic material. This invention also includes an article obtained from the engineering plastic composition mentioned above. Thus, the invention described herein makes possible the objectives of: (1) providing an engineering plastic composition that has excellent moldability because of its low melt viscosity, excellent heat stability, and superior mechanical properties that originate from the said engineering plastic material contained therein; (2) providing an engineering plastic composition that can be used in electronic products, film, sheets, pipes, and the like, in which high heat stability and superior mechanical properties are needed, and in paints, adhesives, fibers, and the like in which high heat stability is needed; (3) providing an engineering plastic composition that has excellent flowability even when it contains reinforcing fibers, so that the moldability are satisfactory, and also has the excellent qualities described in (1) and (2) above; (4) providing an engineering plastic composition that confers a very low degree of double refraction on the products that it is used to form (polycarbonate products, in particular) because the orientation of resin molecules at the time of formation is extremely small; and (5) providing an article obtained from the above-mentioned engineering plastic composition, which have superior heat stability and mechanical properties. DESCRIPTION OF THE PREFERRED EMBODIMENTS This invention is accomplished by the knowledge of the inventors that the melt viscosity of engineering plastic materials is significantly decreased when a p-quaterphenyl derivative is added thereto. Engineering plastic materials that can be used in this invention include polyetherimide, polyarylketone, polysulfone, polyarylenesulfide, polyamide-imide, polycarbonate and polyphenyleneoxide. The polyetherimide mentioned above is a polymer that has essentially ether-bonds and imide bonds. The polymer with a repeating unit of formula IV as the major component is preferred: wherein Ar¹ is a divalent aromatic group that contains at least one six-membered carbon ring, such as, for example, wherein X¹ is -O-, -S-, -CO-, -SO₂- -SO-, or alkylene that contains 1 to 5 carbon atoms. Ar² is a divalent aromatic group, such as, for example, wherein X² is -O-, -S-, -CO-, -SO₂-, -SO-, or alkylene that contains 1 to 5 carbon atoms. In this invention, the polyetherimide with a repeating unit of the following formula as the main component is particularly preferred, for example, ULTEM®, available from GE Corp. As the polyarylketone mentioned above, a polymer with a repeating unit of formula V as the main component is preferred: wherein the Ar³ groups, independently, are divalent aromatic groups with at least one six-membered carbon ring such as, for example, or the like. X³ are, independently, -O-, -CO-, or a direct bond, and n is an integer from 0 to 3. In this invention, polyarylketone that has the repeating unit V-I and polyarylketone that has the repeating unit V-II are particularly preferred: Examples of polymers with the repeating unit of formula V-I include VICTREX PEEK® available from ICI Corp. Examples of polymers with the repeating unit of the formula V-II include ULTRAPEK® available from BASF Corp. As the polysulfone that can be used in the present invention, a polysulfone with a repeating unit of formula VI or VII is particularly suitable. Examples of polysulfones of formula VI include VICTREX PES®, available from ICI Corp., and examples of polysulfones of formula VII include UDEL®, available from UCC Corp. Polyarylenesulfide that can be used in the present invention includes polyphenylenesulfide, poly-4,4'-diphenylenesulfide, poly-2,4-tolylenesulfide, a copolymer synthesized by a reaction of p-dichlorobenzene and 2,4-dichlorotoluene with sodium sulfide, etc. Polyphenylenesulfide with a repeating unit of the following formula as the main component is particularly preferred: These polyphenylenesulfides include RYTON® available from Phillips Oil Corp., FORTRON® available from Kureha Kagaku Corp., SUPCE® available from GE Corp., TORPREN® available from Torpren Corp., etc. The polyamide-imide that can be used in the present invention is a polymer that essentially has amide linkages and imide linkages, and in particular, a polymer with a repeating unit of formula IX as the main component is preferred: wherein Ar⁵ is a divalent aromatic group with at least one six-membered carbon ring. Examples of Ar⁵ include wherein X⁵ is -O-, -S-, -CO-, SO₂-, -SO-, or alkylene that contains 1 to 5 carbon atoms. Examples of such a polyamide-imide includes TORLON® available from Amoco Performance Products Corp., TI-5000® available from Toray Corp., etc. As the polycarbonate that can be used in the present invention, a polymer with a repeating unit of formula X as the main component is preferred: wherein X⁶ is -O-, -S-, -CO-, -SO₂-, -SO-, or a divalent aliphatic group, alicyclic group, or phenylsubstituted alkylene that contains 1 to 10 carbon atoms. In this invention, a polycarbonate with a repeating unit of the following formula as the main component is particularly suitable: Examples of the polycarbonate include IUPILON® available from Mitsubishi Gas Kagaku Corp., PANLITE® available from Teijin Kasei Corp., NOVAREX® available from Mitsubishi Kasei Co., Ltd., LEXAN® available from GE Corp., MAKROLON® available from Bayer Corp., etc. As the polyphenyleneoxide that can be used in the present invention, a polymer with a repeating unit of formula XI as the main component is preferred: wherein X⁷ is alkyl that contains 1 to 4 carbon atoms, alkoxy that contains 1 to 4 carbon atoms, or halogen. In this invention, polyphenyleneoxide with the repeating unit of the following formula as the main component is particularly preferred: Polyphenylene oxide is not sold by itself commercially, but only as a mixture with other resins. For example, mixtures with styrene-type resins such as polystyrene, styrene-acrylonitrile copolymer, styrene-acrylonitrile-butadiene copolymer, styrene-methylmethacrylate copolymer; or with nylon are commercially available. This kind of product includes NORYL® and NORYL GTX® available from GE Corp., XYRON® available from Asahi Kasei Co., etc. Generally, 20-400 parts by weight of a styrene-type resin or nylon is mixed with 100 parts by weight of the polyphenyleneoxide. An engineering plastic composition of this invention comprises an engineering plastic material and at least one p-quaterphenyl derivative selected from the group consisting of the compounds of formulae I and II: wherein R¹ and R², independently, are -H, -COCH₃, -CH₂CH₂OH, -CH₂CH₂OCOCH₃, -CH₂CH(CH₃)OH, -CH₂CH(CH₃)OCOCH₃, or alkyl containing from 1 to 15 carbon atoms. The alkyl may be straight or branched. The p-quaterphenyl derivatives of formula I include 4,4‴-dihydroxy-p-quaterphenyl, 4,4‴-di(2-hydroxyethoxy)-p-quaterphenyl, 4,4‴-diacetoxy-p-quaterphenyl, 4,4‴-di(2-acetoxyethoxy)-p-quaterphenyl, 4,4‴-di(2-hydroxyisopropoxy)-p-quaterphenyl, 4,4‴-di(2-acetoxyisopropoxy)-p-quaterphenyl, 4,4‴-dimethoxy-p-quaterphenyl, 4,4‴-diethoxy-p-quaterphenyl, 4,4‴-dipropoxy-p-quaterphenyl, 4,4‴-dibutoxy-p-quaterphenyl, 4,4‴-dipentyloxy-p-quaterphenyl, 4,4‴-dihexyloxy-p-quaterphenyl, 4,4‴-diheptyloxy-p-quaterphenyl, 4,4‴-dioctyloxy-p-quaterphenyl, 4,4‴-dinonyloxy-p-quaterphenyl, 4,4‴-didecyloxy-p-quaterphenyl, 4,4‴-diundecyloxy-p-quaterphenyl, 4,4‴-didodecyloxy-p-quaterphenyl, 4,4‴-ditridecyloxy-p-quaterphenyl, 4,4‴-ditetradecyloxy-p-quaterphenyl, 4,4‴-dipentadecyloxy-p-quaterphenyl, etc. The p-quaterphenyl derivatives of formula II include 4-hydroxy-p-quaterphenyl, 4-(2-hydroxyethoxy)-p-quaterphenyl, 4-acetoxy-p-quaterphenyl, 4-(2-acetoxyethoxy)-p-quaterphenyl, 4-(2-hydroxyisopropoxy)-p-quaterphenyl, 4-(2-acetoxyisopropoxy)-p-quaterphenyl, 4-methoxy-p-quaterphenyl, 4-ethoxy-p-quaterphenyl, 4-propoxy-p-quaterphenyl, 4-butoxy-p-quaterphenyl, 4-pentyloxy-p-quaterphenyl, 4-hexyloxy-p-quaterphenyl, 4-heptyloxy-p-quaterphenyl, 4-octyloxy-p-quaterphenyl, 4-nonyloxy-p-quaterphenyl, 4-decyloxy-p-quaterphenyl, 4-undecyloxy-p-quaterphenyl, 4-dodecyloxy-p-quaterphenyl, 4-tridecyloxy-p-quaterphenyl, 4-tetradecyloxy-p-quaterphenyl, 4-pentadecyloxy-p-quaterphenyl, etc. The preparations of representative compounds from among the various p-quaterphenyl derivatives with formulae I and II will be described. (a) 4,4'''-Dihydroxy-p-quaterphenyl (of formula I, with R¹ and R² both -H) can be obtained by the method described in Journal of the Chemical Society , 1379-85 (1940). Also, 4,4'''-dihydroxy-p-quaterphenyl can be obtained by the following method. First, 4-hydroxy-4'-bromobiphenyl is heated to react under pressure in the presence of alkali with use of a palladium catalyst, resulting in sodium salt of 4,4'''-dihydroxy-p-quaterphenyl. Then, acid is added to precipitate 4,4'''-dihydroxy-p-quaterphenyl. (b) 4,4'''-Diacetoxy-p-quaterphenyl (of formula I, with R¹ and R² both -COCH₃) can be obtained by the acetoxylation of the compound obtained in section a above. (c) 4,4'''-Di(2-hydroxyethoxy)-p-quaterphenyl (of formula I, with R¹ and R² both -CH₂CH₂OH) can be obtained by the addition of ethylene oxide to the compound obtained in section a above. (d) 4,4'''-Di(2-acetoxyethoxy)-p-quaterphenyl (of formula I, with R¹ and R² both -CH₂CH₂OCOCH₃) can be obtained by the acetoxylation of the compound obtained in section c above. (e) 4,4‴ -Di(2-hydroxyisopropoxy)-p-quaterphenyl (of formula I, with R¹ and R² both -CH₂CH(CH₃)OH) can be obtained by the addition of propylene oxide to the compound obtained in section a above. (f) 4,4‴-Di(2-acetoxyisopropoxy)-p-quaterphenyl (of formula I, with R¹ and R² both -CH₂CH(CH₃)OCOCH₃) can be obtained by the acetoxylation of the compound obtained in section e above. (g) Dialkoxylated p-quaterphenyl (of formula I, with R¹ and R² alkyl groups with 1-15 carbon atoms) can be obtained by the etherification of the compound obtained in section a above by a well-known method. If the number of carbon atoms of R¹ or R² is more than 15, the liquid-crystal transition temperature of this compound becomes low. If a compound with such a low liquid-crystal transition temperature is added in the engineering plastic composition, the heat stability of the engineering plastic material will be lowered. (h) 4-Hydroxy-p-quaterphenyl (of formula II, with R¹ -H) can be obtained by the demethylation of the compound obtained in section n below. (i) 4-Acetoxy-p-quaterphenyl (of formula II, with R¹ -COCH₃) can be obtained by the acetoxylation of the compound obtained in section h above. (j) 4-(2-Hydroxyethoxy)-p-quaterphenyl (of formula II, with R¹ -CH₂CH₂OH) can be obtained by the addition of ethylene oxide to the compound obtained in section h above. (k) 4-(2-Acetoxyethoxy)-p-quaterphenyl (of formula II, with R¹ -CH₂CH₂OCOCH₃) can be obtained by the acetoxylation of the compound obtained in section j above. (l) 4-(2-Hydroxyisopropoxy)-p-quaterphenyl (of formula II, with R¹ -CH₂CH(CH₃)OH) can be obtained by the addition of propylene oxide to the compound obtained in section h above. (m) 4-(2-Acetoxyisopropoxy)-p-quaterphenyl (of formula II, with R¹ -CH₂CH(CH₃ )OCOCH₃) can be obtained by the acetoxylation of the compound obtained in section l above. (n) Monoalkoxylated p-quaterphenyl (of formula II, with R¹ an alkyl group with 1-15 carbon atoms) can be obtained by using the method of Kumada et al. ( Bulletin of the Chemical Society of Japan , 49 (7) 1958 (1976)), which involves a cross-coupling reaction of halogenated alkoxybiphenyl with Grignard reagent of biphenyl using Ni catalyst. If the number of carbon atoms of R¹ is more than 15, the liquid crystal transition temperature of the compound will be low. An engineering plastic composition according to this invention can be prepared by the commonly known methods. For example, there is the method of causing adhesion between granules of the engineering plastic material and powder of p-quaterphenyl derivatives by mixing the granules of the engineering plastic material and powder of the p-quaterphenyl derivatives together. Also, there is the method in which the engineering plastic material and the p-quaterphenyl derivative are melted and mixed together. In order to mix the engineering plastic material and p-quaterphenyl derivatives uniformly, methods for melting and kneading by the use of an extruder, kneader, plastograph, or the like are particularly preferred. In this invention, per 100 parts by weight of the engineering plastic material, the p-quaterphenyl derivative is used at the proportion of 0.1-15 parts by weight, preferably at the proportion of 0.5-12 parts by weight, and more preferably at the proportion of 0.7-10 parts by weight. If the proportion of the p-quaterphenyl derivative is less than 0.1 part by weight per 100 parts by weight of the engineering plastic material, the melt viscosity of the engineering plastic material does not decrease. If the proportion of the p-quaterphenyl derivative is more than 15 parts by weight per 100 parts by weight of the engineering plastic material, the melt viscosity of the engineering plastic material does not decrease so much below a certain value, and the properties of the engineering plastic material, such as its heat stability and mechanical properties, are worsened. Accordingly, per 100 parts by weight of the engineering plastic material, the p-quaterphenyl derivative should be used at the proportion of 0.1-15 parts by weight. Any of the p-quaterphenyl derivatives or a mixture thereof can be used. In the composition of this invention that contains engineering plastic materials and p-quaterphenyl derivatives, it is possible to include reinforcing fibers for the purposes of increasing the heat stability and improving the mechanical properties, provided that the composition is suitable for practical use. Per 100 parts by weight of the engineering plastic material, reinforcing fibers can be added at the proportion of 1.0-400 parts by weight, and preferably at the proportion of 5-200 parts by weight. If the proportion of the reinforcing fibers is less than 1.0 part by weight per 100 parts by weight of the engineering plastic material, the additive effect by which the mechanical strength of the engineering plastic composition is increased is small. If the proportion of the reinforcing fibers is more than 400 parts by weight per 100 parts by weight of the engineering plastic material, the melt viscosity of the mixture becomes higher, and the moldability of the mixture is poor. As reinforcing fibers, glass fibers, carbon fibers, boron fibers, silicon carbide fibers, graphite fibers, alumina fibers, amorphous-metal fibers, silicon-titanium-carbon inorganic fibers, aramide fibers, and the like can be used for preference. In particular, glass fibers with a diameter of 1-50µm and the length of 0.1 mm to 5 cm that are used to reinforced plastics are suitable for use. In the engineering plastic composition of this invention, it is possible to include stabilizers, flame retardants, antistatic agents, mold releasing agents, pigments, and the like within the limits in which the practical properties of the composition are not worsened, for the purposes of increasing heat stability or improving the mechanical properties, etc. Articles are obtained from the engineering plastic composition by compression molding, extrusion molding, injection molding, blow-molding, or similar melt-molding techniques. The article may be machine parts, parts for electronic products, film, pipes, etc., that have excellent heat stability, mechanical properties, and the like. When polycarbonate is the engineering plastic material used in the composition, it is possible to obtain optical molded products, for example, optical disks, various kinds of lenses, and so on, that are transparent and have very low degree of double refraction. Examples Below, this invention will be explained with reference to examples. The properties of the engineering plastic compositions obtained in the following examples and comparative examples were evaluated by the following methods. Measurement of physical properties (a) Liquid-crystal transition temperature The liquid-crystal transition temperature was defined as the first peak of a heat absorbance curve measured with an apparatus for differential thermal analysis. (b) Melt viscosity The average of the results of tests measured three times by the method of JIS K7210 (flowability test; auxiliary test) with a Koka-type flow tester, was calculated. The measurements were done with a plunger with the cross-sectional area of 1 cm², a die that was 10 mm long with a 1 mm diameter, and a load of 100 kg. The temperature used is given in the corresponding tables of examples. (c) Mechanical properties (tensile modulus, tensile strength, and elongation at rupture) Measurements were done by the method of ASTM D638. The sample was stretched at the rate of 25 mm/min. (d) Deflection temperature Measurement was done with a load of 18.6 kg/cm² by the method of ASTM D648. (e) Spiral flow The flow length of the sample when injection-molded at an injection pressure of 2200 kg/cm², a molding temperature of 340-350°C, and a mold temperature of 200°C in a mold that had a spiral-shaped groove 5 mm wide and 2.5 mm deep was measured. (f) Double refraction and light transmission The double refraction of a portion 40 mm from the center of a disk with a diameter of 130 mm and a thickness of 1.2 mm made by injection molding of the sample was measured by means of a polarization microscope. The degree of light transmission of the portion is also measured by means of a haze meter. Preparation of p-quaterphenyl derivatives (A) 4,4‴-Dihydroxy-p-quaterphenyl Into an 1-liter stainless steel autoclave were added 60.0 g of 4-hydroxy-4′-bromobiphenyl, 100 g of methanol, 300 g of a 10% (by weight) aqueous solution of sodium hydroxide, and 13 g of a palladium-carbon containing 5% by weight of palladium and a reaction was carried out at 120° for 4 hours under 5 atmospheric pressures. The precipitated disodium salt of 4,4‴-dihydroxy-p-quaterphenyl was filtered and dissolved into N,N-dimethyl-formamide. The catalyst was removed by filtration with heating at 60°C. An addition of dilute sulfuric acid to the filtrate gave white crystalline powder of 4,4‴-dihydroxy-p-quaterphenyl (DHQ), which was purified by washing with methanol. The liquid-crystal transition temperature of the DHQ was 336°C. (B) 4-4‴-Diacetoxy-p-quaterphenyl By the reaction of the DHQ obtained in section (A) mentioned above with acetic anhydride, 4,4‴-diacetoxy-p-quaterphenyl (DAQ) was obtained. The liquid-crystal transition temperature of the DAQ was 340°C. (C) 4,4‴-Di(2-hydroxyethoxy)-p-quaterphenyl By the reaction of the DHQ obtained in section (A) mentioned above with ethylene oxide, 4,4‴-di(2-hydroxyethoxy)-p-quaterphenyl (DHEQ) was obtained. The liquid-crystal transition temperature of the DHEQ was 403°C. (D) 4,4‴-Di(2-acetoxyethoxy)-p-quaterphenyl By the reaction of the DHEQ obtained in section (C) mentioned above with acetic anhydride, 4,4‴-di(2-acetoxyethoxy)-p-quaterphenyl (DAEQ) was obtained. The liquid-crystal transition temperature of the DAEQ was 329°C. (E) 4,4‴-Dimethoxy-p-quaterphenyl Except for the use of 4-methoxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-dimethoxy-p-quaterphenyl (DMQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DMQ was 340°C. (F) 4,4‴-Diethoxy-p-quaterphenyl Except for the use of 4-ethoxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-diethoxy-p-quaterphenyl (DEQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DEQ was 356°C. (G) 4,4‴-Dipropoxy-p-quaterphenyl Except for the use of 4-propoxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-dipropoxy-p-quaterphenyl (DPQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DPQ was 335°C. (H) 4,4‴-Dibutoxy-p-quaterphenyl Except for the use of 4-butoxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-dibutoxy-p-quaterphenyl (DBQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DBQ was 335°C. (I) 4,4‴-Diheptyloxy-p-quaterphenyl Except for the use of 4-heptyloxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-diheptyloxy-p-quaterphenyl (DHPQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DHPQ was 299°C. (J) 4,4‴-Dioctyloxy-p-quaterphenyl Except for the use of 4-octyloxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-dioctyloxy-p-quaterphenyl (DOQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DOQ was 294°C. (K) 4,4‴-Didodecyloxy-p-quaterphenyl Except for the use of 4-dodecyloxy-4′-bromobiphenyl instead of the 4-hydroxy-4′-bromobiphenyl, 4,4‴-didodecyloxy-p-quaterphenyl (DDQ) was obtained according to the procedure of section (A) mentioned above. The liquid-crystal transition temperature of the DDQ was 266°C. (L) 4-Metoxy-p-quaterphenyl By use of a cross-coupling reaction of Grignard reagent with a halogen compound by Ni catalyst, 4-metoxy-p-quaterphenyl was obtained (Kumada et al., Bulletin of the Chemical Society of Japan , 49(7) , 1958 (1976)). First, 3.6 g (150 mmol) of magnesium was put in a three-necked flask that was completely dry, and under a nitrogen atmosphere, 150 ml of anhydrous tetrahydrofuran (THF) that contained 33.6 g (132 mmol) of 4-bromobiphenyl was added dropwise with a dropping funnel. After 20 ml had been added, the reaction was started by the addition of 0.02 g of iodine at room temperature. The entire amount of the THF solution was added over a period of about 1 hour. An exothermic reaction proceeded, and the reaction mixture became pale brown. Then, the mixture was stirred for 2 hours at room temperature to complete the reaction. Grignard reagent was thus obtained. In another 1-liter three-necked flask, 31.5 g (120 mmol) of 4-bromo-4′-metoxybiphenyl and 108 mg (0.2 mmol) of NiCl₂(1,3-bis(diphenylphosphino)propane) (NiCl₂(dppp)) were added, which were dissolved into 500 ml of anhydrous THF. This solution was kept at 0°C under a nitrogen atmosphere, and the Grignard reagent was added dropwise over a period of about 1 hour with stirring. During the addition, the orange color of the Ni catalyst disappeared, and the reaction mixture became brown. The reaction mixture was then refluxed with stirring for 5 hours to complete the reaction. After the reaction, the precipitated white solid was filtered, and washed with a small amount of THF. Recrystallization from sulforane gave 30.6 g (yield, 76%) of 4-metoxy-p-quaterphenyl (MQ). The liquid-crystal transition temparature of the MQ was 328°C. (M) 4-Hydroxy-p-quaterphenyl First, 25.2 g (75 mmol) of MQ obtained in section (L) mentioned above was suspended to 500 ml of methylene chloride in an 1-liter three-necked flask. To this suspension, 50 ml of a methylene chloride solution containing 19.0 g (75 mmol) of boron tribromide was added dropwise over a period of about 30 minutes with stirring under a nitrogen atmosphere. Then, the reaction mixture was refluxed for 10 hours with stirring under the nitrogen atmosphere. After the reaction was completed, the flask was cooled, and the solids that precipitated were obtained by filtration. The solids were washed with methylene chloride and dried. Then the solid was recrystallized with dimethylsulfoxide. In this way, 21.6 g (yield, 89%) of 4-hydroxy-p-quaterphenyl (HQ) was obtained as a white solid. The liquid-crystal transition temperature of HQ was 352°C. (N) 4-(2-Hydroxyethoxy)-p-quaterphenyl First, 19.2 g (60 mmol) of the HQ obtained in section (M) mentioned above was put in an 1-liter three-necked flask, and dissolved by the addition of 500 ml of sulforane. To this solution, 7.92 g (90 mmol) of ethylene carbonate was added, and the mixture was heated under a nitrogen atmosphere. Then 0.1 g of K₂CO₃ was added at the reflux temperature of sulforane, and reflux was continued for 4 hours with stirring. After the reaction was completed, the reaction mixture was filtered and the filtrate was cooled. The white solid that was precipitated was collected by filtration and dried. In this way, 18.38 g (yield, 83%) of 4-(2-hydroxyethoxy)-p-quaterphenyl (HEQ) was obtained. The liquid-crystal transition temperature of HEQ was 335°C. Polyetherimide composition Examples 1-3 and Comparative Examples 1-3 One hundred parts by weight of polyetherimide (GE Corp., ULTEM® 1000) and each of the predetermined amounts of DHQ listed in Table 1 were melted and mixed with in a plastograph at 360°C for 3 minutes, resulting in a polyetherimide composition. The melt viscosity of each of the polyetherimide compositions was measured at 340°C. These results are shown in Table 1. A sheet 1 mm thick and a sheet 4 mm thick were obtained by compression-molding of the polyetherimide composition at 340°C for 2 minutes at the pressure of 150 kg/cm². The mechanical properties of a sheet 1 mm thick and deflection temperature of a sheet 4 mm thick were measured; the results are shown in Table 1. Examples 4-6 and Comparative Examples 4 and 5 Polyetherimide compositions were prepared in the same way as in Example 1, except that DHEQ was used instead of DHQ in the amounts shown in Table 2 and that the fusion temperature was 420°C. The temperature for the measurement of the melt viscosity was 400°C. A sheet 1 mm thick and a sheet 4 mm thick were obtained by injection molding of the polyetherimide composition. The injection pressure for the composition was 1700 kg,/cm², the molding temperature was 400°C, and the temperature of the mold was 120°C. In the same way as for Example 1, the properties of these sheet were evaluated. The results are shown in Table 2. Examples 7-9 and Comparative Examples 6 and 7 Polyetherimide compositions were prepared in the same way as in Example 1, except that DAEQ was used instead of DHQ in the amounts shown in Table 3. In the same way as in Example 1, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 3. Examples 10-12 and Comparative Examples 8 and 9 Polyetherimide compositions were prepared in the same way as in Example 1, except that DMQ was used instead of DHQ in the amounts shown in Table 4, and that the fusion temperature was 420°C. In the same way as in Example 4, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 4. Examples 13-15 and Comparative Examples 10 and 11 Polyetherimide compositions were prepared in the same way as in Example 1, except that DBQ was used instead of DHQ in the amounts shown in Table 5. In the same way as in Example 1, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 5. Examples 16-18 and Comparative Examples 12 and 13 Polyetherimide compositions were prepared in the same way as in Example 1, except that HEQ was used instead of DHQ in the amounts shown in Table 6. In the same way as in Example 1, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 6. Polyarylketone composition Examples 19-21 and Comparative Examples 14-16 One hundred parts by weight of polyetheretherketone (ICI Corp., VICTREX PEEK® 15P-F) and each of the predetermined amounts of DHQ listed in Table 7 were melted and mixed with in a plastograph at 370°C for 3 minutes, resulting in a polyetheretherketone composition. The melt viscosity of each of the compositions was measured at the temperature of 360°C. The polyetheretherketone composition was compression-molded for 2 minutes at the pressure of 150 kg/cm² and the temperature of 360°C to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of these sheets were evaluated in the same way as in Example 1 and the results are shown in Table 7. Examples 22-24 and Comparative Example 17 Polyetheretherketone compositions were prepared in the same way as in Example 19, except that DHEQ was used instead of DHQ in the amounts shown in Table 8, and that the fusion temperature was 420°C. The polyetheretherketone composition was compression-molded for 2 minutes at the pressure of 150 kg/cm² and the temperature of 340°C to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of both the composition and these sheets were evaluated in the same way as in Example 19 and the results are shown in Table 8. Examples 25-27 and Comparative Examples 18 and 19 Polyetheretherketone compositions were prepared in the same way as in Example 19, except that DAEQ was used instead of DHQ in the amounts shown in Table 9. In the same way as in Example 19, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 9. Examples 28-30 and Comparative Examples 20 and 21 Polyetheretherketone compositions were prepared in the same way as in Example 19, except that DEQ was used instead of DHQ in the amounts shown in Table 10. In the same way as in Example 19, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 10. Examples 31-33 and Comparative Examples 22 and 23 Polyetheretherketone compositions were prepared in the same way as in Example 19, except that DBQ was used instead of DHQ in the amounts shown in Table 11. In the same way as in Example 19, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 11. Examples 34-36 and Comparative Examples 24 and 25 Polyetheretherketone compositions were prepared in the same way as in Example 19, except that HQ was used instead of DHQ in the amounts shown in Table 12. In the same way as in Example 19, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 12. Polysulfone composition Examples 37-39 and Comparative Examples 26-28 One hundred parts by weight of polysulfone (ICI Corp., VICTREX PES® 4800G) and each of the predetermined amounts of DHQ listed in Table 13 were melted and mixed with together in a plastograph at 360°C for 3 minutes, resulting in a polysulfone composition. The melt viscosity of each of the compositions was measured at the temperature of 350°C. The polysulfone composition was compression-molded for 2 minutes at the pressure of 150 kg/cm² and the temperature of 360°C to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of both the composition and these sheets were evaluated in the same way as in Example 1 and the results are shown in Table 13. Examples 40-42 and Comparative Examples 29 and 30 Polysulfone compositions were prepared in the same way as in Example 37, except that DAQ was used instead of DHQ in the amounts shown in Table 14. In the same way as in Example 37, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 14. Examples 43-45 and Comparative Examples 31 and 32 Polysulfone compositions were prepared in the same way as in Example 37, except that DHEQ was used instead of DHQ in the amounts shown in Table 15, and that the fusion temperature was 400°C. In the same way as in Example 37, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 15. Examples 46-48 and Comparative Examples 33 and 34 Polysulfone compositions were prepared in the same way as in Example 37, except that DAEQ was used instead of DHQ in the amounts shown in Table 16. In the same way as in Example 37, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 16. Examples 49-51 and Comparative Examples 35 and 36 Polysulfone compositions were prepared in the same way as in Example 37, except that DBQ was used instead of DHQ in the amounts shown in Table 17. In the same way as in Example 37, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 17. Examples 52-54 and Comparative Examples 37 and 38 Polysulfone compositions were prepared in the same way as in Example 37, except that HQ was used instead of DHQ in the amounts shown in Table 18. In the same way as in Example 37, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 18. Examples 55-57 and Comparative Example 39 Polysulfone compositions were prepared in the same way as in Example 37 except for the use of 100 parts by weight of polysulfone (UCC Corp. UDEL® P-1700) and the predetermined amounts of DHQ, DAEQ, and DBQ shown in Table 19. Sheets were obtained in the same way as in Example 37, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 19. Polyphenylenesulflde composition Examples 58-60 and Comparative Examples 40-42 One hundred parts by weight of polyphenylenesulfide (Torpren Corp., TORPREN®T-4), and each of the predetermined amounts of DHQ listed in Table 20 were melted and mixed with together in a plastograph at 350°C for 3 minutes, resulting in a polyphenylenesulfide composition. The polyphenylenesulfide composition was compression-molded for 2 minutes at the pressure of 150 kg/cm² and the temperature of 350°C to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of both the composition and these sheets were evaluated in the same way as in Example 1 and the results are shown in Table 20. Examples 61-63 and Comparative Examples 43 and 44 Polyphenylenesulfide compositions were prepared in the same way as in Example 58, except that DHEQ was used instead of DHQ in the amounts shown in Table 21, and that the fusion temperature was 400°C. In the same way as in Example 58, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 21. Examples 64-66 and Comparative Examples 45 and 46 Polyphenylenesulfide compositions were prepared in the same way as in Example 61, except that DAEQ was used instead of DHQ in the amounts shown in Table 22. In the same way as in Example 58, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 22. Examples 67-69 and Comparative Examples 47 and 48 Polyphenylenesulfide compositions were prepared in the same way as in Example 58, except that DBQ was used instead of DHQ in the amounts shown in Table 23. In the same way as in Example 58, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 23. Examples 70-72 and Comparative Examples 49 and 50 Polyphenylenesulfide compositions were prepared in the same way as in Example 58, except that HQ was used instead of DHQ in the amounts shown in Table 24. In the same way as in Example 58, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 24. Polyamide-imide composition Examples 73-75 and Comparative Examples 51-53 Polyamide-imide compositions were prepared by mixing 100 parts by weight of polyamide-imide (Amoco Performance Products Corp., Torlon®-4203L) and the predetermined amounts of DHQ listed in Table 25, and the mixture was dried at 120°C for 8 hours. The polyamide-imide composition obtained was injection-molded and its spiral flow was measured. Next, injection molding was done to give a sheet 1 mm thick and a sheet 4 mm thick. The injection pressure for the composition was 2200 kg/cm², the molding temperature was 340-350°C and the temperature of the mold was 200°C. These sheets were postcured at 165°C for 24 hours, at 245°C for 24 hours, and at 260°C for 24 hours, and the properties of both the composition and the sheets were evaluated in the same way as in Example 1. The results are shown in Table 25. Examples 76-78 and Comparative Examples 54 and 55 Polyamide-imide compositions were prepared in the same way as in Example 73, except that DPQ was used instead of DHQ in the amounts shown in Table 26. In the same way as in Example 73, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 26. Examples 79-81 and Comparative Examples 56 and 57 Polyamide-imide compositions were prepared in the same way as in Example 73, except that MQ was used instead of DHQ in the amounts shown in Table 27. In the same way as in Example 73, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 27. Polycarbonate composition Examples 82-84 and Comparative Examples 58-60 One hundred parts by weight of polycarbonate (Teijin Kasei Corp., PANLITE® L-1225L) and each of the predetermined amounts of DHQ listed in Table 28 were melted and mixed with together in a plastograph at 340°C for 3 minutes, resulting in a polycarbonate composition. The melt viscosity of each of the compositions was measured at the temperature of 300°C. The composition was supplied to an injection molding machine, and molded at the injection pressure of 1400 kg/cm². The molding temperature was 340°C, and the temperature of the mold was 100°C. A disk was formed that had a diameter of 130 mm and a thickness of 1.2 mm. The double refraction and the degree of light transmission of a portion of this plate 40 mm from the center of the disk were measured. The composition that was mixed in a plastograph was compression-molded for 2 minutes at the pressure of 150 kg/cm² and the temperature of 340°C to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of these sheets were evaluated in the same way as in Example 1, and the results are shown in Table 28. Examples 85-87 and Comparative Examples 61-63 One hundred parts by weight of glass-fiber reinforced polycarbonate (Teijin Kasei Co. Ltd., PANLITE® G-3130; 30 wt% glass fibers, with glass fibers 20 µm diameter and 0.2-1.0 mm long) and each of the predetermined amounts of DHQ shown in Table 29 were melted and mixed with together in a plastograph at 340°C for 3 minutes, resulting in a polycarbonate composition. The melt viscosity of each of the compositions was measured at 260°C. The composition was compression-molded in the same way as in Example 82 to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of these sheets were evaluated, and the results are shown in Table 29. Examples 88-90 and Comparative Examples 64 and 65 Polycarbonate compositions were prepared in the same way as in Example 82, except that DDQ was used instead of DHQ in the amounts shown in Table 30. In the same way as in Example 82, a disk and sheets were obtained, and the properties of the composition, the disk and the sheets were evaluated. The results are shown in Table 30. Examples 91-93 and Comparative Examples 66 and 67 Polycarbonate compositions were prepared in the same way as in Example 85, except that DDQ was used instead of DHQ in the amounts shown in Table 31. In the same way as in Example 85, sheets were obtained, and the properties of the composition and the sheets were evaluated. The results are shown in Table 31. Examples 94-96 and Comparative Examples 68 and 69 Polycarbonate compositions were prepared in the same way as in Example 82, except that MQ was used instead of DHQ in the amounts shown in Table 32. In the same way as in Example 82, a disk and sheets were obtained, and the properties of the composition, the disk and the sheets were evaluated. The results are shown in Table 32. Examples 97-99 and Comparative Examples 70 and 71 Polycarbonate compositions were prepared in the same way as in Example 85, except that MQ was used instead of DHQ in the amounts shown in Table 33. In the same way as in Example 85, sheets were obtained, and the properties of the composition and the sheets were evaluated. The results are shown in Table 33. Polyphenyleneoxide composition Examples 100-102 and Comparative Examples 72-74 One hundred parts by weight of modified polyphenyleneoxide (GE Corp., NORYL®-PPO 534J) and each of the predetermined amounts of DOQ listed in Table 34 were melted and mixed with together in a plastograph at 300°C for 3 minutes, resulting in a polyphenyleneoxide composition. The melt viscosity of each of the compositions was measured at the temperature of 300°C. The polyphenyleneoxide composition was compression-molded for 2 minutes at the pressure of 150 kg/cm² and the temperature of 320°C to give a sheet 1 mm thick and a sheet 4 mm thick. The properties of these sheets were evaluated in the same way as in Example 1 and the results are shown in Table 34. Examples 103-105 and Comparative Examples 75-77 Polyphenyleneoxide compositions were prepared in the same way as in Example 100, except that 100 parts by weight of glass-fiber reinforced polyphenyleneoxide (GE, Corp. NORYL®-GFN3J, 30 wt% glass fibers, with glass fibers 20 µm diameter and 0.2-1.0 mm long) and the amounts of DOQ listed in Table 35 were used. In the same way as in Example 100, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 35. Examples 106-108 and Comparative Examples 78 and 79 Polyphenyleneoxide compositions were prepared in the same way as in Example 100, except that DDQ was used instead of DOQ in the amounts shown in Table 36. In the same way as in Example 100, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 36. Examples 109-111 and Comparative Examples 80 and 81 Polyphenyleneoxide compositions were prepared in the same way as in Example 103, except that DDQ was used instead of DOQ in the amounts shown in Table 37. In the same way as in Example 100, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 37. Examples 112-114 and Comparative Examples 82 and 83 Polyphenyleneoxide compositions were prepared in the same way as in Example 100, except that MQ was used instead of DOQ in the amounts shown in Table 38. In the same way as in Example 100, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 38. Examples 115-117 and Comparative Examples 84 and 85 Polyphenyleneoxide compositions were prepared in the same way as in Example 103, except that MQ was used instead of DOQ in the amounts shown in Table 39. In the same way as in Example 100, sheets were obtained, and the properties of both the composition and the sheets were evaluated. The results are shown in Table 39. Examples Comparative Examples 1 2 3 1 2 3 Amount of DHQ (parts by weight) 1 5 10 0 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 340°C) 8.2 6.3 3.9 12.0 11.0 2.8 Tensile modulus (×10⁴kg/cm²) 3.0 3.2 3.1 3.1 3.1 3.0 Tensile strength (kg/cm²) 1070 1100 1120 1080 1070 840 Elongation at rupture (%) 62 56 53 63 60 32 Deflection temperature (°C) 199 198 197 200 200 181 DHQ: 4, 4'''-Dihydroxy-p-quaterphenyl Examples Comparative Examples 4 5 6 4 5 Amount of DHEQ (parts by weight) 1 5 10 0 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 400°C) 1.02 0.46 0.21 1.60 0.19 Tensile strength (kg/cm²) 1100 1070 1060 1070 850 Deflection temperature (°C) 200 199 197 201 183 DHEQ : 4, 4'''-Di(2-hydroxyethoxy)-p-quaterphenyl Examples Comparative Examples 7 8 9 6 7 Amount of DAEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 340°C) 7.9 6.6 3.2 11.0 3.0 Tensile modulus (x10⁴kg/cm²) 3.0 3.1 3.2 3.1 3.0 Tensile strength (kg/cm²) 1090 1060 1100 1070 790 Elongation at rupture (%) 61 59 50 61 27 Deflection temperature(°C) 200 199 196 200 185 DAEQ : 4, 4'''-Di(2-acetoxyethoxy)-p-quaterphenyl Examples Comparative Examples 10 11 12 8 9 Amount of DMQ (parts by weight) 0.5 3 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 340°C) 9.0 6.2 3.2 11.0 3.1 Tensile modulus (×10⁴kg/cm²) 3.1 3.3 3.2 3.0 3.2 Tensile strength (kg/cm²) 1080 1090 1100 1080 820 Elongation at rupture (%) 62 61 60 63 49 Deflection temperature(°C) 200 199 197 200 190 DMQ : 4, 4'''-Dimethoxy-p-quaterphenyl Examples Comparative Examples 13 14 15 10 11 Amount of DBQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 340°C) 8.0 5.9 3.5 11.0 2.8 Tensile modulus (×10⁴kg/cm²) 3.0 3.2 3.0 3.0 3.0 Tensile strength (kg/cm²) 1070 1100 1090 1070 820 Elongation at rupture (%) 62 56 52 60 11 Deflection temperature(°C) 199 199 198 200 190 DBQ : 4, 4'''-Dibutoxy-p-quaterphenyl Examples Comparative Examples 16 17 18 12 13 Amount of HEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 340°C) 8.8 7.9 4.4 11.0 3.1 Tensile modulus (×10⁴kg/cm²) 3.0 3.0 3.0 3.1 2.9 Tensile strength (kg/cm²) 1070 1090 1090 1060 830 Elongation at rupture (%) 61 55 53 60 20 Deflection temperature (°C) 198 198 196 200 191 HEQ : 4-(2-Hydroxyethoxy)-p-quaterphenyl Examples Comparative Examples 19 20 21 14 15 16 Amount of DHQ (parts by weight) 1 5 10 0 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 360°C) 1.5 1.0 0.7 2.3 2.2 0.7 Tensile modulus (×10⁴kg/cm²) 3.4 3.4 3.5 3.4 3.4 3.5 Tensile strength (kg/cm²) 970 980 960 960 970 670 Elongation at rupture (%) 69 65 56 73 70 10 Deflection temperature(°C) 150 148 148 151 151 139 DHQ : 4, 4'''-Dihydroxy-p-quaterphenyl Examples Comparative Example 22 23 24 17 Amount of DHEQ (parts by weight) 1 5 10 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 360°C) 1.00 0.98 0.65 0.62 Tensile strength (kg/cm²) 980 970 970 710 Deflection temperature(°C) 149 149 147 138 DHEQ : 4, 4'''-Di(2-hydroxyethoxy)-p-quaterphenyl Examples Comparative Examples 25 26 27 18 19 Amount of DAEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 360°C) 1.6 1.2 0.8 2.2 0.7 Tensile modulus (×10⁴kg/cm²) 3.4 3.4 3.5 3.4 3.5 Tensile strength (kg/cm²) 970 960 950 970 680 Elongation at rupture (%) 68 64 63 70 29 Deflection temperature(°C) 150 148 147 151 138 DAEQ : 4, 4'''-Di(2-acetoxyethoxy)-p-quaterphenyl Examples Comparative Examples 28 29 30 20 21 Amount of DEQ (parts by weight) 0.5 3 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 360°C) 1.7 1.1 0.7 2.2 0.7 Tensile modulus (×10⁴kg/cm²) 3.4 3.5 3.5 3.5 3.3 Tensile strength (kg/cm²) 970 980 980 960 810 Elongation at rupture (%) 71 71 69 72 25 Deflection temperature(°C) 151 150 148 151 139 DEQ : 4, 4'''-Diethoxy-p-quaterphenyl Examples Comparative Examples 31 32 33 22 23 Amount of DBQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 360°C) 1.3 1.0 0.7 2.2 0.7 Tensile modulus (×10⁴kg/cm²) 3.5 3.4 3.4 3.4 3.5 Tensile strength (kg/cm²) 970 980 960 970 970 Elongation at rupture (%) 69 65 57 70 21 Deflection temperature(°C) 150 150 149 151 140 DBQ : 4, 4'''-Dibutoxy-p-quaterphenyl Examples Comparative Examples 34 35 36 24 25 Amount of HQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 360°C) 1.9 1.1 0.9 2.2 0.7 Tensile modulus (×10⁴kg/cm²) 3.4 3.4 3.3 3.4 3.4 Tensile strength (kg/cm²) 970 970 950 960 620 Elongation at rupture (%) 65 60 55 70 12 Deflection temperature(°C) 150 150 149 151 140 HQ : 4-Hydroxy-p-quaterphenyl Examples Comparative Examples 37 38 39 26 27 28 Amount of DHQ (parts by weight) 1 5 10 0 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 350°C) 5.1 3.9 2.5 6.3 6.2 2.3 Tensile modulus (×10⁴kg/cm²) 1.4 1.5 1.5 1.4 1.4 1.5 Tensile strength (kg/cm²) 850 840 830 840 840 500 Elongation at rupture (%) 63 60 57 65 66 10 Deflection temperature(°C) 200 200 199 201 201 188 DHQ : 4, 4'''-Dihydroxy-p-quaterphenyl Examples Comparative Examples 40 41 42 29 30 Amount of DAQ (parts by weight) 0.5 3 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 350°C) 5.0 3.5 2.0 6.2 1.8 Tensile modulus (×10⁴kg/cm²) 1.4 1.5 1.5 1.4 1.3 Tensile strength (kg/cm²) 840 850 840 830 560 Elongation at rupture (%) 64 62 60 64 32 Deflection temperature(°C) 201 200 197 201 190 DAQ : 4, 4'''-Diacetoxy-p-quaterphenyl Examples Comparative Examples 43 44 45 31 32 Amount of DHEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 350°C) 4.5 3.2 3.0 6.2 2.5 Tensile modulus (×10⁴kg/cm²) 1.4 1.4 1.3 1.4 1.3 Tensile strength (kg/cm²) 840 840 830 840 480 Elongation at rupture (%) 64 62 56 65 12 Deflection temperature(°C) 200 199 198 201 189 DHEQ : 4, 4'''-Di(2-hydroxyethoxy)-p-quaterphenyl Examples Comparative Examples 46 47 48 33 34 Amount of DAEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise ( 10² Pas)) (at 350°C) 4.8 3.6 2.7 6.1 2.4 Tensile modulus (×10⁴kg/cm²) 1.4 1.4 1.5 1.4 1.5 Tensile strength (kg/cm²) 830 850 860 840 520 Elongation at rupture (%) 66 63 55 67 13 Deflection temperature(°C) 201 198 197 201 190 DAEQ : 4, 4'''-Di(2-acetoxyethoxy)-p-quaterphenyl Examples Comparative Examples 49 50 51 35 36 Amount of DBQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 350°C) 4.8 3.2 2.1 6.2 2.0 Tensile modulus (×10⁴kg/cm²) 1.4 1.5 1.4 1.4 1.5 Tensile strength (kg/cm²) 850 840 840 840 520 Elongation at rupture (%) 63 60 55 66 22 Deflection temperature(°C) 200 200 199 201 191 DBQ : 4, 4'''-Dibutoxy-p-quaterphenyl Examples Comparative Examples 52 53 54 37 38 Amount of HQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 350°C) 5.0 4.3 2.7 6.3 2.5 Tensile modulus (×10⁴kg/cm²) 1.4 1.4 1.3 1.4 1.2 Tensile strength (kg/cm²) 840 840 830 830 500 Elongation at rupture (%) 60 60 58 65 10 Deflection temperature(°C) 201 200 197 201 193 HQ : 4-Hydroxy-p-quaterphenyl Exapmles Comparative Example 55 56 57 39 Amount (parts by weight) DHQ 5 0 0 0 DAEQ 0 5 0 0 DBQ 0 0 5 0 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 350°C) 6.3 6.5 6.1 12.0 Tensile modulus (×10⁴kg/cm²) 2.4 2.4 2.3 2.4 Tensile strength (kg/cm²) 730 740 730 730 Elongation at rupture (%) 72 73 73 76 Deflection temperature (°C) 174 174 175 176 DHQ : 4, 4'''-Dihydroxy-p-quaterphenyl DAEQ : 4, 4'''-Di(2-acetoxyethoxy)-p-quaterphenyl DBQ : 4, 4'''-Dibutoxy-p-quaterphenyl Examples Comparative Examples 58 59 60 40 41 42 Amount of DHQ (parts by weight) 1 5 10 0 0.05 20 Physical properties Melt viscosity (×10² poise (× 10¹ Pas)) (at 340°C) 5.8 4.6 2.8 8.4 8.2 2.5 Tensile modulus (×10⁴kg/cm²) 2.4 2.5 2.4 2.4 2.5 2.5 Tensile strength (kg/cm²) 540 540 530 540 530 360 Elongation at rupture (%) 5.0 4.8 4.7 5.2 5.1 3.1 Deflection temperature(°C) 104 103 102 105 105 92 DHQ : 4, 4'''-Dihydroxy-p-quaterphenyl Examples Comparative Examples 61 62 63 43 44 Amount of DHEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10² poise (× 10¹ Pas)) (at 340°C) 6.0 5.5 3.1 8.3 2.8 Tensile modulus (×10⁴kg/cm²) 2.4 2.4 2.4 2.4 2.3 Tensile strength (kg/cm²) 540 530 520 540 310 Elongation at rupture (%) 5.1 4.8 4.6 5.2 2.8 Deflection temperature(°C) 104 103 102 105 91 DHEQ : 4, 4'''-Di(2-hydroxyethoxy)-p-quaterphenyl Examples Comparative Examples 64 65 66 45 46 Amount of DAEQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10² poise (× 10¹ Pas)) (at 340°C) 5.5 4.3 2.5 8.2 2.5 Tensile modulus (×10⁴kg/cm²) 2.4 2.5 2.4 2.5 2.5 Tensile strength (kg/cm²) 540 540 550 530 330 Elongation at rupture (%) 5.0 4.8 4.7 5.1 3.1 Deflection temperature(°C) 104 103 102 105 91 DAEQ : 4, 4'''-Di(2-acetoxyethoxy)-p-quaterphenyl Examples Comparative Examples 67 68 69 47 48 Amount of DBQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10² poise (× 10¹ Pas)) (at 340°C) 5.4 4.1 2.5 8.2 2.4 Tensile modulus (×10⁴kg/cm²) 2.3 2.5 2.5 2.5 2.5 Tensile strength (kg/cm²) 540 530 540 530 340 Elongation at rupture (%) 4.9 4.7 4.6 5.1 2.9 Deflection temperature(°C) 104 102 101 105 89 DBQ : 4, 4'''-Dibutoxy-p-quaterphenyl Examples Comparative Examples 70 71 72 49 50 Amount of HQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10² poise (× 10¹ Pas)) (at 340°C) 5.4 3.9 2.6 8.2 2.0 Tensile modulus (×10⁴kg/cm²) 2.4 2.4 2.4 2.3 2.4 Tensile strength (kg/cm²) 530 530 540 530 320 Elongation at rupture(%) 4.9 4.7 4.6 5.0 2.0 Deflection temperature(°C) 103 103 100 105 90 HQ : 4-Hydroxy-p-quaterphenyl Examples Comparative Examples 73 74 75 51 52 53 Amount of DHQ (parts by weight) 1 5 10 0 0.05 20 Physical properties Spiral flow (cm) 12.3 18.2 28.7 9.5 9.7 30.2 Tensile modulus (×10⁴kg/cm²) 5.0 4.9 4.9 5.1 5.1 3.8 Tensile strength (kg/cm²) 1850 1870 1880 1900 1900 1520 Elongation at rupture (%) 11 10 10 12 12 5 Deflection temperature(°C) 272 270 269 274 274 258 DHQ: 4, 4'''-Dihydroxy-p-quaterphenyl Examples Comparative Examples 76 77 78 54 55 Amount of DPQ (parts by weight) 0.5 3 10 0.05 20 Physical properties Spiral flow (cm) 11.5 16.5 28.5 9.6 29.1 Tensile modulus (×10⁴kg/cm²) 5.1 5.2 5.2 5.1 4.8 Tensile strength (kg/cm²) 1900 1910 1910 1900 1600 Elongation at rupture (%) 11 11 10 12 6 Deflection temperature(°C) 274 272 271 274 259 DPQ: 4, 4'''-Dipropoxy-p-quaterphenyl Examples Comparative Examples 79 80 81 56 57 Amount of MQ (parts by weight) 1 5 10 0.05 20 Physical properties Spiral flow (cm) 13.0 19.1 27.5 9.6 30.0 Tensile modulus (×10⁴kg/cm²) 5.0 4.9 4.9 5.0 4.0 Tensile strength (kg/cm²) 1860 1850 1850 1800 1500 Elongation at rupture (%) 11 10 10 11 4 Deflection temperature(°C) 273 271 270 274 255 MQ: 4-Methoxy-p-quaterphenyl Examples Comparative Examples 82 83 84 58 59 60 Amount of DHQ (parts by weight) 1 4 7 0 0.03 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 0.7 0.5 0.3 1.1 1.1 0.3 Tensile modulus (×10⁴kg/cm²) 1.8 1.8 1.7 1.9 1.9 1.3 Tensile strength (kg/cm²) 610 600 610 620 620 480 Elongation at rupture (%) 135 130 130 140 138 95 Deflection temperature (°C) 128 127 126 129 129 107 Double refraction (nm) 20 12 9 26 25 - Light transmission (%) 88 86 84 91 90 65 DHQ: 4, 4 '''-Dihydroxy-p-quaterphenyl Examples Comparative Examples 85 86 87 61 62 63 Composition Polycarbonate 70 70 70 70 70 70 Glass fibers 30 30 30 30 30 30 DHQ 1 4 7 0 0.03 14 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 260°C) 6.2 0.8 0.4 26.0 25.0 0.3 Tensile strength (kg/cm²) 1240 1200 1210 1250 1240 980 Elongation at rupture (%) 3 2 2 3 3 2 Deflection temperature (°C) 146 144 143 147 147 126 DHQ: 4, 4'''-Dihydroxy-p-quaterphenyl Examples Comparative Examples 88 89 90 64 65 Amount of DDQ (parts by weight) 0.5 3 10 0.05 20 Physical properties Melt viscosity (×10² poise (× 10² Pas)) (at 300°C) 8.2 6.1 2.9 10.0 2.8 Tensile modulus (×10⁴kg/cm²) 1.9 1.8 2.0 1.9 1.9 Tensile strength (kg/cm²) 620 630 640 620 620 Elongation at rupture (%) 136 135 132 140 95 Deflection temperature (°C) 129 127 126 129 109 Double refraction (nm) 22 15 8 26 - Light transmission (%) 90 87 85 91 67 DDQ: 4, 4'''-Didodecyloxy-p-quaterphenyl Examples Comparative Examples 91 92 93 66 67 Composition Polycarbonate 70 70 70 70 70 Glass fibers 30 30 30 30 30 DDQ 0.5 3 7 0.03 14 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 260°C) 11.0 3.2 0.4 25.0 0.4 Tensile strength (kg/cm²) 1250 1260 1270 1250 1010 Elongation at rupture (%) 3 3 2 3 2 Deflection temperature (°C) 147 145 143 147 124 DDQ: 4, 4'''-Didodecyloxy-p-quaterphenyl Examples Comparative Examples 94 95 96 68 69 Amount of MQ (parts by weight)) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 0.7 0.6 0.3 1.0 0.2 Tensile modulus ( ×10⁴kg/cm²) 1.9 1.8 1.8 1.9 1.5 Tensile strength (kg/cm²) 600 600 600 610 500 Elongation at rupture (%) 135 130 130 135 90 Deflection temperature (°C) 129 128 125 129 110 Double refraction (nm) 20 12 10 25 - Light transmission (%) 89 85 83 90 60 MQ: 4-Methoxy-p-quaterphenyl Examples Comparative Examples 97 98 99 70 71 Composition Polycarbonate 70 70 70 70 70 Glass fibers 30 30 30 30 30 MQ 1 4 7 0.03 14 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 260°C) 6.0 0.8 0.4 25.0 0.5 Tensile strength (kg/cm²) 1230 1210 1200 1240 900 Elongation at rupture (%) 2 2 2 3 1 Deflection temperature (°C) 145 145 143 147 125 MQ: 4-Methoxy-p-quaterphenyl Examples Comparative Examples 100 101 102 72 73 74 Amount of DOQ (parts by weight) 1 5 10 0 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 6.1 3.9 3.0 7.5 7.4 2.9 Tensile modulus (×10⁴kg/cm²) 2.6 2.6 2.5 2.7 2.8 1.7 Tensile strength (kg/cm²) 780 770 770 790 790 610 Elongation at rupture (%) 52 50 48 55 54 31 Deflection temperature (°C) 171 168 167 172 172 158 DOQ : 4, 4'''-Dioctyloxy-p-quaterphenyl Examples Comparative Examples 103 104 105 75 76 77 Composition Polyphenyleneoxide 70 70 70 70 70 70 Glass fibers 30 30 30 30 30 30 DOQ 1 4 7 0 0.03 14 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 5.2 3.8 2.9 6.3 6.2 2.9 Tensile strength (kg/cm²) 1210 1200 1200 1200 1210 970 Tensile modulus (×10⁴kg/cm²) 7.2 7.3 7.2 7.3 7.3 5.6 Elongation at rupture (%) 5 4 4 6 3 2 Deflection temperature (°C) 141 140 140 142 142 121 DOQ: 4, 4'''-Dioctyloxy-p-quaterphenyl Examples Comparative Examples 106 107 108 78 79 Amount of DDQ (parts by weight) 0.5 3 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 6.8 4.5 2.9 7.4 2.8 Tensile strength (kg/cm²) 790 800 800 790 590 Tensile modulus (×10⁴kg/cm²) 2.6 2.7 2.7 2.7 2.7 Elongation at rupture (%) 53 52 50 54 28 Deflection temperature (°C) 172 171 168 172 159 DDQ: 4, 4'''-Didodecyloxy-p-quaterphenyl Examples Comparative Examples 109 110 111 80 81 Composition Polyphenyleneoxide 70 70 70 70 70 Glass fibers 30 30 30 30 30 DDQ 0.5 3 7 0.03 14 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 5.8 4.0 2.8 6.2 2.7 Tensile strength (kg/cm²) 1200 1210 1210 1200 950 Tensile modulus (×10⁴kg/cm²) 7.3 7.4 7.4 7.3 7.2 Elongation at rupture (%) 6 5 5 6 2 Deflection temperature (°C) 142 141 140 142 125 DDQ: 4, 4'''-Didodecyloxy-p-quaterphenyl Examples Comparative Examples 112 113 114 82 83 Amount of MQ (parts by weight) 1 5 10 0.05 20 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 6.9 4.0 3.1 7.4 2.5 Tensile strength (kg/cm²) 790 780 780 790 620 Tensile modulus ( ×10⁴kg/cm²) 2.8 2.5 2.5 2.7 1.9 Elongation at rupture (%) 50 50 45 53 25 Deflection temperature (°C) 170 167 167 172 155 MQ: 4-Methoxy-p-quaterphenyl Examples Comparative Examples 115 116 117 84 85 Composition Polyphenyleneoxide 70 70 70 70 70 Glass fibers 30 30 30 30 30 MQ 1 4 7 0.03 14 Physical properties Melt viscosity (×10³ poise (× 10² Pas)) (at 300°C) 5.6 3.9 2.8 6.3 2.7 Tensile strength (kg/cm²) 1200 1200 1180 1200 990 Tensile modulus (×10⁴kg/cm²) 7.3 7.3 7.2 7.3 5.9 Elongation at rupture (%) 5 4 4 4 1 Deflection temperature (°C) 141 140 140 142 131 MQ: 4-Methoxy-p-quaterphenyl

Claims: An engineering plastic composition comprising an engineering plastic material and one or more p-quaterphenyl derivatives selected from the group consisting of the compounds of the formula I and II: wherein R¹ and R², independently, are -H, -COCH₃, -CH₂CH₂OH, -CH₂CH₂OCOCH₃, -CH₂CH(CH₃)OH, -CH₂CH(CH₃)OCOCH₃, or alkyl containing from 1 to 15 carbon atoms, wherein said engineering plastic material consists of one material or a blend of materials selected from the group consisting of polyetherimide, polyarylketone, polysulfone, polyarylenesulfide, polyamide-imide, polycarbonate, and polyphenyleneoxide, and wherein said one or more p-quaterphenyl derivatives are present in a total amount of from 0.1 to 15 parts by weight for each 100 parts by weight of said engineering plastic material. A composition according to claim 1, further comprising reinforcing fibers, wherein said reinforcing fibers are present in an amount of 0.1 to 400 parts by weight for each 100 parts by weight of said engineering plastic material. A composition according to claim 1, wherein said compound of formula I is at least one selected from the group consisting of 4,4'''-dihydroxy-p-quaterphenyl, 4,4'''-di(2-hydroxyethoxy)-p-quaterphenyl, 4,4'''-diacetoxy-p-quaterphenyl, 4,4'''-di(2-acetoxyethoxy)-p-quaterphenyl, 4,4'''-di(2-hydroxyisopropoxy)-p-quaterphenyl, 4,4'''-di(2-acetoxyisopropoxy)-p-quaterphenyl, 4,4'''-dimethoxy-p-quaterphenyl, 4,4'''-diethoxy-p-quaterphenyl, 4,4'''-dipropoxy-p-quaterphenyl, 4,4'''-dibutoxy-p-quaterphenyl, 4,4'''-dipentyloxy-p-quaterphenyl, 4,4'''-dihexyloxy-p-quaterphenyl, 4,4'''-diheptyloxy-p-quaterphenyl, 4,4'''-dioctyloxy-p-quaterphenyl, 4,4'''-dinonyloxy-p-quaterphenyl, 4,4'''-didecyloxy-p-quaterphenyl, 4,4'''-diundecyloxy-p-quaterphenyl, 4,4'''-didodecyloxy-p-quaterphenyl, 4,4'''-ditridecyloxy-p-quaterphenyl, 4,4'''-ditetradecyloxy-p-quaterphenyl, and 4,4'''-dipentadecyloxy-p-quaterphenyl. A composition according to claim 1, wherein said compound of formula II is at least one selected from the group consisting of 4-hydroxy-p-quaterphenyl, 4-(2-hydroxyethoxy)-p-quaterphenyl, 4-acetoxy-p-quaterphenyl, 4-(2-acetoxyethoxy)-p-quaterphenyl, 4-(2-hydroxyisopropoxy)-p-quaterphenyl, 4-(2-acetoxyisopropoxy)-p-quaterphenyl, 4-methoxy-p-quaterphenyl, 4-ethoxy-p-quaterphenyl, 4-propoxy-p-quaterphenyl, 4-butoxy-p-quaterphenyl, 4-pentyloxy-p-quaterphenyl, 4-hexyloxy-p-quaterphenyl, 4-heptyloxy-p-quaterphenyl, 4-octyloxy-p-quaterphenyl, 4-nonyloxy-p-quaterphenyl, 4-decyloxy-p-quaterphenyl, 4-undecyloxy-p-quaterphenyl, 4-dodecyloxy-p-quaterphenyl, 4-tridecyloxy-p-quaterphenyl, 4-tetradecyloxy-p-quaterphenyl, and 4-pentadecyloxy-p-quaterphenyl. A composition according to claim 1, wherein said p-quaterphenyl derivative is present in an amount of from 0.5 to 12 parts by weight for each 100 parts by weight of said engineering plastic material. A composition according to claim 5 wherein said p-quaterphenyl derivative is present in an amount of from 0.7 to 10 parts by weight for each 100 parts by weight of said engineering plastic material. A composition according to claim 2, wherein said reinforcing fibers are at least one selected from the group consisting of glass fibers, carbon fibers, boron fibers, silicon carbide fibers, graphite fibers, alumina fibers, amorphous-metal fibers, silicon-titanium-carbon inorganic fibers, and aramide fibers. A composition according to claim 2, wherein said reinforcing fibers are present in an amount of from 5 to 200 parts by weight for each 100 parts by weight of said engineering plastic material. An article obtained from the engineering plastic composition of any one of claims 1 to 8 by a melt-molding technique. An article according to claim 9 wherein said melt molding technique is at least one selected from the group consisting of compression molding, extrusion molding, injection molding, and blow molding.

Inventors: DOYAMA KAZUO, KISHIMOTO DAISHIRO, NIKI AKIHIRO, OHSUGA MAKOTO, SAITO TORANOSUKE, TSUNOMACHI HIROKI, UESAKA TOSHIO, YAMAGUCHI MAKOTO, DOYAMA, KAZUO, KISHIMOTO, DAISHIRO, NIKI, AKIHIRO, OHSUGA, MAKOTO, SAITO, TORANOSUKE, TSUNOMACHI, HIROKI, UESAKA, TOSHIO, YAMAGUCHI, MAKOTO
Applicants: SANKO KAIHATSU KAGAKU KENK, SEIKISUI CHEMICAL CO LTD, K.K. SANKO KAIHATSU KAGAKU KENKYUSHO, SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA
Application year: 1989
Main classification: C08K5
IPC codes: C08K5