Epoxy resin composition

Abstract: An epoxy resin composition is disclosed, which comprises the following components: (A) a bifunctional epoxy resin; (B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin; (C) a dihydroxybiphenyl compound represented by the following general formula: wherein R₁, R₂, R₃ and R₄, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and (D) an aromatic amine, wherein said components (A), (B), (C) and (D) are used in amounts satisfying the following conditions: 1/0.1 ≧ a/b ≧ 1/1.2 10/1 ≧ (a + b)/c ≧ 1/1 1/0.8 ≧ (a + b - c)/d ≧ 1/1.5 wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents the molar number of NH groups in component (D). The epoxy resin composition is improved not only in storage stability, handling property and heat resestance but also in mechanical properties.

Description: The present invention relates to an epoxy resin composition improved in storage stability, hot wet property and mechanical properties such as elongation. Composite materials prepared from this epoxy resin composition are suitable for use in aircraft, automobiles and other industrial applications. Because of their excellent adhesion and rigidity properties, epoxy resins have been used extensively as matrix resins for composite materials. In particular, bisphenol A epoxy resins are used most commonly because of their good handling property and balanced physical properties but their use is limited to applications where high heat resistance is not required. Compositions chiefly composed of N,N,N′,N′-tetraglycidyl diaminodiphenylmethane and 4,4′-diaminodiphenyl sulfone have been used extensively in applications where high heat resistance is required. In spite of their high heat resistance and rigidity, the use of these compositions is again limited by their low elongation and toughness. With a view to solving this problem, the present inventors previously proposed a novel improved epoxy resin composition in Unexamined published Japanese Patent Application (JP-A) No. 63-10618, including a bifunctional epoxy resin, a trifunctional epoxy resin, a bisphenol compound and a dicyandiamide or other hardeners. EP-A-0 249 263 reveals an epoxy resin composition comprising a bifunctional epoxy resin, a trifunctional epoxy resin, a diamine or a diphenol. The present inventors conducted intensive studies in order to develop an epoxy resin that is improved not only in storage stability, handling property and heat resistance but also in mechanical properties such as toughness and elongation and as a result, they have accomplished the present invention. The present invention relates to an epoxy resin composition which comprises the following components: (A) a bifunctional epoxy resin; (B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin; (C) a dihydroxybiphenyl compound represented by the following general formula: wherein R₁, R₂, R₃ and R₄, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and (D) an aromatic amine, wherein the components (A), (B), (C) and (D) are used in amounts satisfying the following conditions: 1/0.1 ≧ a/b ≧ 1/1.2 10/1 ≧ (a + b)/c ≧ 1/1 1/0.8 ≧ (a + b - c)/d ≧ 1/1.5 wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents the molar number of active hydrogen atoms of NH groups in component (D). Examples of the bifunctional epoxy resin of component (A) used in the present invention include a bisphenol epoxy type resin such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, brominated products thereof, and a bisphenol S epoxy resin. For example, bisphenol epoxy type resin is represented by the following general formula: For providing improved toughness, a bisphenol A epoxy resin or a bisphenol F epoxy resin is desirably used as a major component. The ratio of epoxy groups in the epoxy resin (A) to those in the trifunctional and/or tetrafunctional epoxy resin (B) is in the range of 1/0.1 to 1/1.2, preferably 1/0.2 to 1/1.0, when expressed by a/b. If the ratio is greater than 1/0.1, the resistance of the final resin composition to hot water and chemicals is reduced. If the ratio is smaller than 1/1.2, toughness is so much reduced as to cause a decrease not only in the efficiency of the use of reinforcing materials but also in the compressive strength of the final resin composition after impact. Component (B) of the resin composition of the present invention is a trifunctional or tetrafunctional epoxy resin which may be used either on their own or as an admixture. Illustrative trifunctional epoxy resins include N,N,O-triglycidyl-p-aminophenol, N,N,O-triglycidyl-m-aminophenol, N,N,O-triglycidyl-4-amino-m-cresol, N,N,O-triglycidyl-5-amino-o-cresol, and 1,1,1-(triglycidyl-oxyphenyl)methane. Among these, N,N,O-triglycidyl compounds are particularly preferred to provide improved solvent resistance. Examples of the tetrafunctional epoxy resin that can be used as component (B) include N,N,N′,N′-tetraglycidyldiaminodiphenylmethane, N,N,N′,N′-tetraglycidyl-4,4′-(4-aminophenyl)-p-diisopropylbenzene and 1,1,2,2-(tetraglycidyloxyphenyl)ethane. Examples of the 4,4′-dihydroxybiphenyl compound to be used as component (C) in the present invention include 4,4′-dihydroxybiphenyl and 4,4′-dihydroxy-3,3′,5,5′-tetra-tert-butylbiphenyl. The amount of use of component (C) is determined in such a way that the proportions of components (A), (B) and (C) satisfy the condition: 10/1 ≧ (a + b)/c ≧ 1/1 wherein a, b and c are defined above. If the ratio defined above exceeds 10/1, it sometimes occurs that the final resin composition does not have satisfactory wet heat resistance or toughness. If the ratio is smaller than 1/1, heat and solvent resistance is reduced to an undesirably low level. The preferred range is from 10/1 to 1.5/1. Examples of the aromatic amine used as component (D) in the present invention include 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfone, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylether and trimethylene-bis(4-aminobenzoate). Among these, 4,4′-diaminodiphenyl sulfone and 3,3′-diaminodiphenyl sulfone are particularly preferred. Depending on the purpose of use, a cure accelerator may be used in combination with component (D). Specific examples of the cure accelerator include boron trifluoride amine complexes such as boron trifluoride monoethylamine complex and imidazoles. The amount of use of the component (D) is determined in such a way that the proportions of components (A) - (D) satisfy the condition: 1/0.8 ≧ (a + b - c)/d ≧ 1/1.5 wherein a, b, c and d are defined as above. A particularly preferred range is from 1/0.9 to 1/1.2. If the ratio defined above is greater than 1/0.8, the resin composition will cure insufficiently to provide satisfactory solvent and heat resistance. If the ratio is less than 1/1.5, water and solvent resistance will decrease to an undesirably low level. In a preferred embodiment of the present invention, component (C) (dihydroxybiphenyl compound) is allowed to react preliminary with all or part of component (A) (bifunctional epoxy resin) and all of component (B) (trifunctional and/or tetrafunctional epoxy resin) under such conditions that at least 80%, preferably at least 90%, of the phenolic OH groups in component (C) react with the epoxy groups in components (A) and (B). If less than 80% of the phenolic OH groups reacts with the epoxy groups, the preliminary reaction will offer no benefit. The molar ratio between epoxy groups in components (A) and (B) to be used in the preliminary reaction is within the range of from 1/0.3 to 1/3.0, preferably from 1/0.5 to 1/2.0. If the ratio is greater than 1/0.3, it sometimes occurs that the final resin composition does not have satisfactory resistance to hot water and solvents. If the ratio is smaller than 1/3.0, gelation can occur during the preliminary reaction. The amount of component (C) to be used in the preliminary reaction is determined in such a way that the proportions of components (A), (B) and (C) to be used in the preliminary reaction satisfy the condition: 5/1 ≧ (a + b)/c ≧ 0.9/1 wherein a, b and c are defined above. If the ratio defined above is greater than 5/1, satisfactory wet heat resistance cannot be attained. If the ratio is smaller than 0.9/1, the preliminary reaction will not proceed efficiently on account of increased viscosity. The epoxy resin composition of the present invention permits the use of another epoxy resin as component (E) in an amount that will not upset the overall balance between various physical properties of the composition. A typical example of such additional epoxy resin is a novolak epoxy resin. The amount of component (E), if used at all, preferably does not exceed 20% of the total weight of the epoxy resin components (A), (B) and (E). If component (E) is to be used, the proportions of components (A), (B), (C), (D) and (E) must satisfy the following conditions: 1/0.1 ≧ a/b ≧ 1/1.2 1/0.1 ≧ (a + b + e)/c ≧ 1/0.9 1/0.8 ≧ (a + b + e - c)/d ≧ 1/1.5 wherein a, b, c and d are defined above and e is the molar number of epoxy groups in component (E). The resin composition of the present invention may optionally contain an elastomeric component such as a butadiene-acrylonitrile copolymer terminated with a carboxyl group at both ends, or a thermoplastic resin component such as polyether sulfone, polysulfone, polyether ether ketone, polyether imide or polyvinyl butyrate. The amounts in which these optional components are used may be appropriately determined within the range that will not upset the overall balance between various properties of the final resin composition. The resin composition of the present invention may also contain inorganic compounds as required and illustrative inorganic compounds that can be incorporated in the resin composition include silica powders, aerosils, micro-baloons and antimony trioxide. The resin composition of the present invention serves as an excellent matrix resin for composite materials, thus providing composite materials having improved properties such as high resistance to heat, water and impact. The composite materials produced may be reinforced with carbon fibers, glass fibers, aramid fibers, boron fibers, silicon carbide fibers, etc. These reinforcing fibers may be used in various forms such as milled fibers, chopped fibers, continuous fibers and textiles. The following examples are provided for the purpose of further illustrating the present invention but are in no way to be taken as limiting. In the examples, all "parts" are on a weight basis and the "molar ratio" refers to that of functional groups. EXAMPLES 1 TO 6 AND COMPARATIVE EXAMPLES 1 TO 6 A hundred parts of Epikote 807 (the trade name of Yuka-Shell Epoxy Co., Ltd. for bisphenol F epoxy resin; epoxy equivalent, 170), 16.6 parts of N,N,O-triglycidyl-p-aminophenol (epoxy equivalent, 94), 14.2 parts of 4,4′-dihydroxybiphenyl, and 37.9 parts of 4,4′-diaminodiphenyl sulfone were mixed well in a kneader at 60°C to form a resin composition (I). This composition was sandwiched between glass sheets and cured at 180°C for 2 hours to prepare a resin sheet. The flexural strength, elastic modulus, elongation and Tg (according to thermomechanical analysis (TMA) method) of the resin sheet were evaluated in accordance with JIS K6911. The results are shown in Table 1. The following compounds were used as components (A) - (D). (A) : Epikote 807 (B) : N,N,O-triglycidyl-p-aminophenol (C) : 4,4′-dihydroxybiphenyl (D) : 4,4′-diaminodiphenyl sulfone The symbols a, b, c and d used in Table 1 have the same meanings as already defined. As is seen from the results of Table 1, Examples of the present invention show high Tg and high elongation, while Comparative Examples show low Tg (Comparative Examples 1, 4, 5 and 6) and/or low elongation (Comparative Examples 2, 3, 5 and 6). EXAMPLES 7 TO 15 A resin composition and a resin sheet were prepared as in Example 1 except that the compounds shown in Table 2 were used as components (A) - (D). The resin sheet was subjected to the same tests as conducted in Example 1. The results are also shown in Table 2. The symbols used in Table 2 have the following meanings. A-1: Epikote 807 A-2: 2:1 (by mole) mixture of Epikote 807 and Epikote 828 which is the trade name of Yuka-Shell Epoxy Co., Ltd. for a bisphenol A diglycidyl ether type epoxy resin; epoxy equivalent, 188) B-1: N,N,O-triglycidyl-p-aminophenol B-2: N,N,O-triglycidyl-m-aminophenol B-3: N,N,O-triglycidyl-4-amino-m-cresol B-4: N,N,O-triglycidyl-5-amino-o-cresol B-5: 1,1,1-(triglycidyloxyphenyl)methane B-6: N,N,N′,N′-tetraglycidyldiaminodiphenylmethane C-1: 4,4′-dihydroxybiphenyl C-2: 4,4′-dihydroxy-3,3′,5,5′-tetra-tert-butylbiphenyl D-1: 4,4′-diaminodiphenyl sulfone D-2: 3,3′-diaminodiphenyl sulfone EXAMPLE 16 Thirty parts of Epikote 807 (component (A)), 16.6 parts of N,N,O-triglycidyl-p-aminophenol (component (B)) and 14.2 parts of 4,4′-dihydroxybiphenyl (component (C)) were subjected to a preliminary reaction for 2 hours at 130°C and thereafter cooled to 60°C. The remaining 70 parts of Epikote 807 (component (A′)) and 37.9 parts of 4,4′-diaminodiphenyl sulfone (component (D)) were added to the cooled mixture and the ingredients were mixed well in a kneader (held at 60°C) to prepare a resin composition (II). This resin composition was tested as in Example 1. The results are shown in Table 3. EXAMPLES 17 TO 23 Tests were conducted on the samples that were prepared as in Example 16 except that the proportions of the respective components used in the preliminary reaction and the degree of this reaction (conversion of phenolic OH groups) were changed as shown in Table 3. The results are also shown in Table 3, wherein the symbol a′ denotes the molar number of epoxy groups in component (A′) and the other symbols used have the same meanings as already defined. EXAMPLES 24 TO 29 AND COMPARATIVE EXAMPLES 7 TO 12 Tests were conducted on the samples that were prepared as in Example 1 except that component B was replaced by N,N,N′,N′-tetraglycidyldiaminodiphenylmethane (tetrafunctional epoxy resin with an epoxy equivalent of 120) and that the proportions of components A, B, C and D were changed to those indicated in Table 4. The results are shown in Table 4. As is seen from the results of Table 4, Examples of the present invention show high Tg as well as high elongation, while Comparative Examples show low Tg (Comparative Examples 7, 10, 11 and 12) and/or low elongation (Comparative Examples 8, 9, 11 and 12). EXAMPLES 30 TO 35 Tests were conducted on the samples that were prepared as in Example 1 except that components A, B, C and D were changed to those shown in Table 5. The results are shown in Table 5, in which B-7 denotes N,N,N′,N′-tetraglycidyl-4,4′-(4-aminophenyl)-p-diisopropylbenzene, and the other symbols used have the same meanings as already defined above. EXAMPLES 36 TO 43 Tests were conducted on the samples that were prepared as in Example 16 except that N,N,N′,N′-tetraglycidyldiaminodiphenylmethane was used as component (B) and that the proportions of components A, B, C and D were changed to those shown in Table 6. The results are shown in Table 6. EXAMPLE 44 The resin composition (I) prepared in Example 1 was impregnated in unidirectionally collimated carbon fibers (Pyrofil® M-1 of Mitsubishi Rayon Co., Ltd.) by a hot-melt process to prepare a unidirectional prepreg having a fiber areal weight of 145 g/m² and a resin content of 35 wt%. Sheets of this prepreg were laid up to unidirectional laminate (0°)₁₆ and quasi-isotropical laminate [+45°/0°/-45°/+90°] 4s , and cured at 180°C for 2 hours to prepare a composite material. The characteristics of the composite material (i.e., 0° compressive strength at 82°C after water absorption, and compressive strength at room temperature after impact) were evaluated by the following methods. The test results were normalized for a fiber volume fraction of 60%. Hot wet property : A (0°)₁₆ laminated composite was submerged in hot water at 71°C for 14 days and thereafter subjected to a compression test in the direction of 0° at 82°C in accordance with ASTM D-695. Impact resistance : In accordance with NASA RP 1092, a panel (109.6 x 152.4 x 0.457mm³ (4x6x0.18 in.)) was fixed on a table with a hole (76.2 x 227mm² (3x5 in.)); a weight of 4.9 kg with a 12.7 mm (1/2 inch) radius nose was dropped on the center of the panel to give an impact of 67 J/cm (1,500 lbs. per inch) of panel thickness, and the panel was thereafter subjected to a compression test. The results of these evaluations are shown in Table 7. EXAMPLES 45 TO 53 Tests were conducted on the samples that were prepared as in Example 44 except that the resin compositions to be used were changed to those shown in Table 7. The results are shown in Table 7. EXAMPLE 54 Resin composition (III) was prepared as in Example 1 except that 15.0 parts of powdered polyether sulfone was further mixed with the components described in Example 1. Tests were conducted on the sample that was prepared as in Example 44 except that resin composition (III) was used in place of resin composition (I). The results are shown in Table 7. EXAMPLE 55 Resin composition (IV) was prepared as in Example 1 except that 15.0 parts of powdered polyether sulfone was further mixed with the components described in Example 24. Tests were conducted on the samples that were prepared as in Example 44 except that resin composition (IV) was used in place of resin composition (I). The results are shown in Table 7. Example No. Resin Composition 0° compressive strength at 82°C after water absorption (kg/mm²) Compressive strength at R.T. after impact (kg/mm²) 44 as prepared in Example 1 116 32 45 as prepared in Example 9 123 33 46 as prepared in Example 12 110 36 47 as prepared in Example 14 122 29 48 as prepared in Example 16 117 34 49 as prepared in Example 24 114 33 50 as prepared in Example 32 118 33 51 as prepared in Example 34 123 31 52 as prepared in Example 35 121 34 53 as prepared in Example 36 118 33 54 resin composition (III) 116 35 55 resin composition (IV) 115 34 R.T.: Room temperature

Claims: An epoxy resin composition comprising the following components: (A) a bifunctional epoxy resin; (B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin; (C) a dihydroxybiphenyl compound represented by the following general formula: wherein R₁, R₂, R₃ and R₄, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and (D) an aromatic amine, wherein said components (A), (B), (C) and (D) are used in amounts satisfying the following conditions: 1/0.1 ≧ a/b ≧ 1/1.2 10/1 ≧ (a + b)/c ≧ 1/1 1/0.8 ≧ (a + b - c)/d ≧ 1/1.5 wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents tile molar number of active hydrogen atoms of NH groups in component (D). An epoxy resin composition as in claim 1, wherein said bifunctional epoxy resin of component (A) is a bisphenol A epoxy resin or a bisphenol F epoxy resin. An epoxy resin composition as in claim 1, wherein said component (B) is at least one member selected from the group consisting of N,N,O-triglycidyl-p-aminophenol, N,N,O-triglycidyl-m-aminophenol, N,N,O-triglycidyl-4-amino-m-cresol, N,N,O-triglycidyl-5-amino-o-cresol, 1,1,1-(triglycidyloxyphenyl)methane, N,N,N',N'-tetraglycidyldiaminodiphenylmethane, N,N,N',N'-tetraglycidyl-4,4'-(4-aminophenyl)-p-diisopropylbenzene, and 1,1,2,2-(tetraglycidyloxyphenyl)ethane. An epoxy resin composition as in claim 1, wherein said dihydroxy biphenyl compound of component (C) is 4,4'-dihydroxybiphenyl or 4,4'-dihydroxy-3,3',5,5'-tetra-tert-butylbiphenyl. An epoxy resin composition as in claim 1, wherein the aromatic amine of component (D) is 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone. An epoxy resin composition as in claim 1, wherein said resin composition comprises a preliminary reaction product obtained by allowing said component (C) to react preliminary with all or part of component (A) and all of component (B) under the condition that at least 80% of the phenolic hydroxyl groups in component (C) reacts with the epoxy groups in components (A) and (B), the proportions of components (A), (B) and (C) to be used in the preliminary reaction satisfying the conditions: 1/0.3 ≧ a/b ≧ 1/3.0 5/1 ≧ (a + b)/c ≧ 0.9/1 wherein a, b and c are defined in claim 1. An epoxy resin composition as in claim 1, wherein said resin composition furthermore comprises a novolak epoxy resin as component (E) in an amount of not more than 20% of the total weight of the epoxy resin components A, B and E, and wherein furthermore the following conditions are satisfied: 1/0.1 ≧ a/b ≧ 1/1.2 1/0.1 ≧ (a + b + e)/c ≧ 1/0.9 1/0.8 ≧ (a + b + e - c)/d ≧ 1/1.5 wherein a, b, c and d are defined above and e is a molar number of epoxy groups in component E. A composite material which comprises reinforcing fibers and an epoxy resin composition comprising the following components: (A) a bifunctional epoxy resin; (B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin; (C) a dihydroxybiphenyl compound represented by the following general formula: wherein R₁, R₂, R₃ and R₄, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and (D) an aromatic amine, wherein said components (A), (B), (C) and (D) are used in amounts satisfying the following conditions: 1/0.1 ≧ a/b ≧ 1/1.2 10/1 ≧ (a + b)/c ≧ 1/1 1/0.8 ≧ (a + b - c)/d ≧ 1/1.5 wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents the molar number of active hydrogen atoms of NH groups in component (D).

Inventors: GOTO KAZUYA C O MITSUBISHI RAY, SARUTA MASAHIRO C O MITSUBISHI, SUGIMORI MASAHIRO C O MITSUBIS, TADA HISASHI C O MITSUBISHI RA, GOTO, KAZUYA C/O MITSUBISHI RAYON CO., LTD., SARUTA, MASAHIRO C/O MITSUBISHI RAYON CO., LTD., SUGIMORI, MASAHIRO C/O MITSUBISHI RAYON CO., LTD., TADA, HISASHI C/O MITSUBISHI RAYON CO., LTD.
Applicants: MITSUBISHI RAYON CO, MITSUBISHI RAYON CO., LTD.
Application year: 1989
Main classification: C08G59
IPC codes: C08G59, C08J5, C08L63, C08K7