A batch fabrication process for magnetic heads

Abstract: A process for the batch fabrication of an array of shielded magnetoresistive (MR) read transducers comprises the steps of depositing a layer (34) of magnetic shield material over the entire surface of a substrate (10), depositing a first non-magnetic gap layer (36) and sputter depositing a layer (38) of MR sensor material in the presence of a magnetic field for orienting the anisotropy axes of the layer of MR sensor material in a chosen direction. The MR sensor layer (38) and the first gap layer (36) are patterned to produce a plurality of MR read transducers, and the first magnetic shield layer (34) is then patterned to produce a first shield for each of the MR read transducers. A second gap layer (26) and a second shield layer (28) are patterned to produce a second shield for each of the MR read transducers.

Description: The present invention relates to a process for the batch fabrication of magnetic heads which include a magnetoresistive (MR) read transducer. Known magnetoresistive (MR) sensors or heads are capable of reading data from a surface at great linear densities. An MR sensor detects magnetic field signals through the resistance changes of a read element made from a magneto-resistive material as a function of the amount and direction of magnetic flux being sensed by the MR element. The drive towards increased recording density has led to the requirement for narrower recording tracks and increased linear recording density along the tracks. In order for an MR read head to be capable of reading data from a magnetic medium at these high recording densities, the MR element must be incorporated in the gap between two soft magnetic shields. To efficiently produce the small MR sensors which are necessary to meet these requirements, a batch fabrication process must be used. U.S.-A-4,195,323 and U.S.-A-4,489,484 disclose a batch fabrication method in which an inductive write transducer and a shielded MR read transducer form an array of read/write transducers. The transducers are fabricated on a wafer and then diced into individual transducers so that the thickness of the wafer establishes the length of the slider for the read/write transducer. The shields are patterned individually for each MR read transducer. U.S.-A- 4,354,212 discloses an MR sensor in which hard magnetic bias layers are provided on each side of the MR layer, and the MR structure is enclosed between two shields. No batch fabrication technique is disclosed, but an orienting field of 7.53 A/m (600 Oersted) is used in the process described for producing individual sensors. EP-A-0,171,956 discloses a batch fabrication process for MR heads in which a permalloy shield is deposited onto an electrical insulation layer on a substrate. The permalloy is then removed from selected areas before depositing a magnetoresistive layer in a magnetic field. Prior art MR sensors in which the MR element was produced by a sputter deposition process have either been unacceptable or have had a large spread in sensor characteristics. This problem was due to the orienting magnetic field (Ho) required to set the induced axis of the MR layer in a preferred direction. To effectively orient the MR layer shunted by the shield underneath. To effectively orient the MR layer the orienting field Ho must exceed by some margin the demagnetizing field (Hd) of the first shield which, in a specific embodiment, has been calculated to be over 1.25A/m (100 Oe). The orienting field Ho in the sputtering system is less than 0.38/m (30 Oe), so the direction of the easy axis of the MR layer and of other layers such as biasing layers, for example, is undefined, which can lead to unacceptable sensor characteristics. However, if a higher magnetic field is used in the sputtering system, the thickness uniformity of the MR layer is adversely affected due to field plasma interactions. The prior art does not disclose a batch fabrication process for sputter deposited shielded MR read transducers in which the MR elements are of uniform thickness and magnetically oriented uniformly in a chosen direction. According to the present invention there is provided a process for batch fabrication of a plurality of magnetic heads each comprising a magnetoresistive (MR) read transducer, the magnetic heads being formed in a plurality of rows on a substrate, each of the rows having a plurality of magnetic heads therein, the method being characterised by the steps of: depositing a first layer of magnetic material over a substrate of a predetermined thickness; depositing a layer of suitably electrically insulating material of a predetermined thickness over the entire first layer of magnetic material; sputter depositing, in the presence of a magnetic field, a second layer of magnetic material of a predetermined thickness over the entire layer of electrically insulating material, the magnetic field being operable to orient the second layer of magnetic material in a preferred direction; patterning the second layer of magnetic material to form a plurality of MR read transducers, each having its easy axis in a selected direction; depositing and patterning conductor leads; and patterning the first layer of magnetic material to form a shield for each of the MR transducers whereby the predetermined thickness and orientation thereof are maintained. How the invention can be carried out will now be described by way of example, with reference to the accompanying drawings, in which : - Fig. 1 is a sketch showing a three-dimensional view of a substrate, showing some parts in an exploded view, upon which an array of magnetoresistive (MR) read transducers are produced in a batch fabrication method; Fig. 2 is a perspective view of a plurality of MR read heads as constructed at an intermediate stage of a method embodying the present invention; Fig. 3 is a section on line 3-3 of Fig. 1 taken after deposition of the sensor layer; Fig. 4 is a section on line 3-3 of fig. 1 taken after patterning of the sensor and conductor layers; Fig. 5 is a section on line 3-3 of Fig. 1 taken after patterning of the layers of electrically insulating material and the first shield layer; and Fig. 6 is a view of a completed MR read transducer as seen from the air bearing surface. A batch fabrication process for magnetoresistive (MR) read heads commences with the preparation a nonmagnetic substrate 10 (Fig. 1) having a thickness T which, when added to the thickness of the deposited MR read head assemblies 12, will equal the length of finished head sliders 14. As known in the art, a thin film inductive head (not shown) may also be produced on the same head slider 14 so that both read and write transducers are on the same slider 14. The MR read head assemblies 12 comprise a first magnetic shield member 16 (Fig. 2) which is deposited on substrate 10, and upon which is deposited a first nonmagnetic gap layer 15. An MR sensor element 20 is deposited and each end of sensor element 20 is contacted by an individual one of electrically conductive leads 22 and 24. A second nonmagnetic gap layer 26 (Fig. 6) and a second magnetic shield member 28 (Fig. 6) complete the MR read head assemblies 12. When the MR read head assemblies 12 have been formed on the substrate 10, the substrate 10 is cut into rows 11 (Fig. 1) and then into individual head sliders 14 so that the MR sensor element 20 is located at an air bearing surface 15 at the trailing end of the slider 14. The process for batch fabrication of the shielded MR read head assemblies comprises the steps of (see Fig. 3) depositing a first layer 34 of magnetic material over the entire substrate 10 to serve, when patterned, as the first shield member 16 for each of the MR read head assemblies. The magnetic material may comprise any material suitable for use as a shield such as NiFe, for example. The magnetic shield material may be deposited by any suitable technique such as sputtering or plating, for example. A layer 36 of insulating material, such as SiO 2 , for example, is deposited over the entire shield layer 34 to electrically isolate the MR sensor element from the first shield member. A layer 38 of MR sensor material (see Fig. 3) is deposited over the entire layer 36 of insulating material to a desired thickness which must be closely controlled so that the characteristics of each of the MR read head assemblies will be substantially the same. The layer 38 of MR sensor material is deposited by sputtering in the presence of an orienting magnetic field (Ho). The orienting field Ho in the sputtering system is about 0.38A/m (30 Oe), and the demagnetizing field (Hd) in this case, Hd produced by full film shield layer 34, is less than 0.013A/m (one Oe). The condition for proper alignment of the easy axis (Ea) of the MR layer is that Ho>>Hd, and this condition is met in this deposition system since the MR sensor layer 38 experiences an orienting field exceeding 0.25A/m (20 Oe) which is sufficient for inducing an Ea along the field direction. The MR sensor layer 38 is then patterned (see Fig. 4) to define the desired MR sensor 20 shape (Fig. 2) for each of the MR read head assemblies. Should additional layers, such as biasing layers, for example, be part of the MR sensor, they would also be patterned at this stage of the process. The conductor leads 22 and 24 are then deposited and patterned (see Figs. 2 and 4) to define the active region of the MR sensor, i.e. the part of the MR sensor extending between the inner edges of conductor leads 22 and 24. A second insulation layer 40 is deposited (Fig. 5) to electrically isolate the MR sensor 20 from the second shield member 28 as well as to passivate the sensor structure from subsequent processing steps. Now that the easy axis of the sensor layers as well as the sensor structure is defined, the electrically insulating layers 36 and 40 and the first shield layer 34 are patterned (Fig. 5). Either a dry etch or a chemical etch process can be used. When using a dry etch process such as ion milling, for example, all three layers 36, 38 and 40 are patterned using a single masking step. In a case where a chemical etch process is used, two separate masking steps can be used, one for the layers 36 and 40 of insulating material, and a second mask for etching the first shield layer 34. The second shield layer is then deposited and patterned (Fig 6) to produce a second magnetic shield 28 for each of the MR read head assemblies 12 and a protective coating 29 is then deposited and patterned. This processing completes each of the assemblies so that they can then be cut into rows and then into individual assemblies as described above and as shown in Fig. 6. The process of the present invention has the advantage of reducing the demagnetizing field of the first shield layer to a sufficiently small magnitude such as less than 0.013A/m (1 Oe), for example, in its unpatterned state. This level of demagnetizing field permits a preset direction of the easy axis of the MR layer to be established by the field normally present in the sputtering system. This level of demagnetizing field also permits a reduction of the strength of the orienting field within the sputtering system and still retains a defined easy axis direction. This change results in improved thickness control of the MR layer. Both the easy axis alignment and the improved thickness control enhance the stability and reproducability of the MR sensor characteristics of the MR sensor assemblies fabricated by the described process. While the MR sensor has been described as having a single layer, it will be apparent to those skilled in the art that additional layers for properly biasing the sensor, for example, can also be included in the process without materially changing the process. In addition, the second shield layer can be deposited prior to patterning the first shield layer 34. After that the second shield layer, electrically insulating layers 36 and 38, and the first shield layer 34 can be patterned simultaneously or sequentially.

Claims: A process for batch fabrication of a plurality of magnetic heads each comprising a magnetoresistive (MR) read transducer, the magnetic heads being formed in a plurality of rows on a substrate, each of the rows having a plurality of magnetic heads therein, the method being characterised by the steps of: depositing a first layer (34) of magnetic material over a substrate (10) of a predetermined thickness; depositing a layer (36) of suitably electrically insulating material of a predetermined thickness over the entire first layer of magnetic material; sputter depositing, in the presence of a magnetic field, a second layer (38) of magnetic material of a predetermined thickness over the entire layer (36) of electrically insulating material, the magnetic field being operable to orient the second layer (38) of magnetic material in a preferred direction; patterning the second layer (38) of magnetic material to form a plurality of MR read transducers, each having its easy axis in a selected direction; depositing and patterning conductor leads (22, 24); and patterning the first layer (34) of magnetic material to form a shield for each of the MR transducers whereby the predetermined thickness and orientation thereof are maintained. A process as claimed in claim 1, additionally comprising depositing a second layer (40) of suitable electrically insulating material of a predetermined thickness over the second layer of magnetic material; depositing a third layer of magnetic material over the second layer of magnetic material; and patterning the second layer of electrically insulating material and the third layer of magnetic material to form a second shield for each of the MR read transducers. A process as claimed in claim 2, wherein the step of patterning the second layer (40) of electrically insulating material and the third layer of magnetic material is carried out prior to the step of patterning the first layer of magnetic material. A process as claimed in any preceding claim, comprising the additional step of cutting up the structure to provide a plurality of individual magnetic heads.

Inventors: KROUNBI MOHAMAD T, KROUNBI, MOHAMAD T.
Applicants: IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION
Application year: 1989
Main classification: G11B5
IPC codes: G11B5