Semiconductor integrated circuit having i/o terminals allowing independent connection test

Abstract: A semiconductor integrated circuit comprises a plurality of input/output terminals, a test mode input circuit having a mode setting input and for generating a mode control signal, a plurality of test buffer circuits provided for the input/output terminals in one-to-one relation and each having a first terminal connected to a corresponding input/output terminal and a second terminal connected to receive a signal to be supplied to the corresponding input/output terminal or to output a signal inputted through the corresponding input/output terminal. Each test buffer circuit also includes a mode control input connected to receive the mode control signal from the test mode input circuit. When the mode control signal is in a first condition, each test buffer circuit operates to supply a predetermined logical signal to the corresponding input/output terminal so that the predetermined logical signal is outputted from all the input/output terminals. When the mode control signal is in a second condition different from the first condition, each test buffer circuit operates to output a signal supplied to the first or second terminal to the second or first terminal.

Description: The present invention relates to a semiconductor integrated circuit, and more specifically to a semiconductor integrated circuit having a function allowing a test for checking whether or not input/output terminals of the integrated circuit are properly connected to wirings on a circuit board after the integrated circuit is assembled on the circuit board. In this specification, the term "input/output terminal" is used to include not only a terminal used for both of an input and an output, but also a terminal used for only an input and a terminal used for only an output. Description of related art Conventionally, semiconductor integrated-circuits have not been internally provided with a test circuit for checking a wiring condition after the integrated circuit is assembled on a wiring substrate or printed circuit board. Therefore, a function test for the system realized on the printed circuit board has been performed for each printed circuit board, instead of a connection test between each integrated circuit and the printed circuit board. Alternatively, an assemble testing has been conducted by a function test of the integrated circuit assembled on the printed circuit board by use of an in-circuit tester or likes. In general, however, the function test for the overall printed circuit board requires a great amount of time and a large number of steps in order to perform all functions of the circuit board, the closer the function of the circuit board becomes to the function of the overall system. A semiconductor integrated circuit according to the preamble of claim 1 is disclosed in US-A-4 704 484. This semiconductor integrated circuit comprises a plurality of test mode input circuit for a plurality of test buffer circuits. Therefore, these circuits occupy a large amount of space on the chip. It is therefore an object of the present invention to provide a semiconductor integrated circuit having an internal test function and which may be realized with a decrease chip area for the testing circuits. It is a further object of the invention to provide a semiconductor integrated circuit allowing a connection of test of inupt/output terminals of integrated circuit after it is assembled and wired on the circuit board, and independently of other integrated circuits assembled on the same circuit board. This object is achieved by a semiconductor integrated circuit as defined in claim 1; the dependent claims are related to further developments of the invention. The above and other objects, features and advantages of the present invention will be apparent from the following description of preferred embodiments of the invention with reference to the accompanying drawings. Brief Description of the Drawings Figure 1 is an input/output terminal connection layout diagram of an embodiment of the integrated circuit in accordance with the present invention; Figure 2A is a block diagram of an embodiment of the test mode input buffer circuit used in the integrated circuit shown in Figure 1; Figure 2B is a truth table illustrating the relation between an input and an output of the test mode input buffer circuit shown in Figure 2A; Figure 2C is a circuit diagram of an input interface block which can be used in the integrated circuit shown in Figure 1 and can be controlled by the test mode input buffer circuit shown in Figure 2A; Figure 2D is a block diagram of an output interface block which can be used in the integrated circuit shown in Figure 1 and can be controlled by the test mode input buffer circuit shown in Figure 2A; Figure 2E is a truth table illustrating the relation between an input and an output of the output interface block shown in Figure 2D when it is controlled by the test mode input buffer circuit shown in Figure 2A; Figure 2F is a block diagram of a tristate output interface block which can be used in the integrated circuit shown in Figure 1 and can be controlled by the test mode input buffer circuit shown in Figure 2A; Figure 2G is a truth table illustrating the relation between an input and an output of the tristate output interface block shown in Figure 2F when it is controlled by the test mode input buffer circuit shown in Figure 2A; Figure 2H is a block diagram of a bidirectional interface block which can be used in the integrated circuit shown in Figure 1 and can be controlled by the test mode input buffer circuit shown in Figure 2A; Figure 3A is a truth table illustrating another example of the relation between an input and an output of the test mode input buffer circuit shown in Figure 2A; Figure 3B is a block diagram of an output interface block which can be used in the integrated circuit shown in Figure 1 and can be controlled by the test mode input buffer circuit operating in accordance with the truth table shown in Figure 3A; Figure 3C is a truth table illustrating the relation between an input and an output of the output interface block shown in Figure 3B when it is controlled by the test mode input buffer circuit operating in accordance with the truth table shown in Figure 3A; Figure 3D is a truth table illustrating the relation between an input and an output of the tristate output interface block shown in Figure 2F when it is controlled by the test mode input buffer circuit operating in accordance with the truth table shown in Figure 3A; Figure 4 is an input/output terminal connection layout diagram of another embodiment of the integrated circuit in accordance with the present invention; and Figure 5 is a diagrammatic view of integrated circuits in accordance with the present invention assembled on a signal circuit board for illustrating a manner for testing the integrated circuits in accordance with the present invention. Description of the Preferred embodiments Referring to Figure 1, there is shown an input/output terminal connection layout diagram of an embodiment of the integrated circuit in accordance with the present invention. The shown embodiment includes an integrated circuit chip 10, which comprises a text mode input buffer 12 having two mode setting inputs 14 and 16 for receiving a pair of mode setting signals A and B from an external. The text mode input buffer 12 outputs a pair of mode control signals C and D onto two mode control lines 18 and 20 formed on the integrated circuit chip 10. The mode control lines 18 and 20 are connected to all input/output buffers 22 which are formed for all input/output terminals in one-to-one relation on the integrated circuit chip 10. The integrated circuit chip 10 includes various function circuits such as a processing unit, memories, registers, controller, etc, but these function circuits are omitted from Figure 1 for simplification of drawing, since these function circuits are not important to the spirit of the invention. Turning to Figure 2A and 2B, there are respectively shown a block of the test mode input buffer 12 and a truth table showing the relation between the input and the output of the test mode input buffer 12. As seen from the truth table shown in Figure 2B, the mode setting signals A and B are outputted as the mode control signals C and D, respectively, without modification. Therefore, the test mode input buffer 12 can be formed of two non-inverting input buffers 12A and 12B provided for protection from electrostatic breakdown. In the shown embodiment, a logical combination of the mode control signals C and D means the followings: When both of the mode control signals C and D are at a logical value "0", it means that all the input/output interface blocks perform a function inherent to the respective input/output interface blocks. Namely, an input buffer acts as an input buffer, and an output buffer acts as an output buffer. When the mode control signals C and D are at a logical value "0" and at a logical value "1", respectively, it means that all input/output terminals are forcibly brought to a logical value "0". When the mode control signals C and D are at a logical value "1" and at a logical value "0", respectively, it means that all input/output terminals are forcibly brought to a logical value "1". Therefore, in the latter two cases, an input buffer does not function as an input buffer, and an output buffer does not function as an output buffer. Finally, a combination of the mode control signals C and D both of which are at a logical value "1" is not used. Referring to Figure 2C, there is shown a test circuit in accordance with the present invention, combined with an input terminal of the integrated circuit chip. In the shown input buffer, an input terminal 24 is connected through a resistive component R to commonly connected gates of a PMOS transistor 26 and an NMOS transistor 28 of a CMOS circuit 29. A source of the PMOS transistor 26 is connected to a high voltage V DD , and a source of the NMOS transistor 28 is connected to a low voltage V SS . Commonly connected drains of the PMOS transistor 26 and the NMOS transistor 28 are connected for example to an internal logic circuit (not shown) formed in the integrated circuit chip. Therefore, CMOS circuit 29 forms an inverting input buffer. The above mentioned structure of the input buffer is well-known to the persons skilled in the art. In accordance with the present invention, a CMOS output circuit is added to the above mentioned structure of the input buffer. The CMOS output circuit includes a PMOS transistor 30 having a source connected to the high voltage V DD and an NMOS transistor 32 having a source connected to the low voltage V SS . Drains of the PMOS transistor 30 and the NMOS transistor 32 are commonly connected to the input terminal 24. A gate of the PMOS transistor 30 is connected through an inverter 34 to the mode control line 18 so as to receive an inverted signal of the mode control signal C, and a gate of the NMOS transistor 32 is connected directly to the mode control line 20 to receive the mode control signal D. In the above mentioned circuit, when both of the mode control signals C and D are "0", both of the PMOS transistor 30 and the NMOS transistor 32 are off, and therefore, a signal applied to the input terminal 24 is supplied through the inverting input buffer (of the PMOS transistor 26 and the NMOS transistor 28) to the internal circuit of the integrated circuit chip. Namely, the input buffer acts as an input buffer. However, when the mode control signals C and D are "0" and "1", respectively, the PMOS transistor 30 is off but the NMOS transistor 32 is turned on. Therefore, the input terminal 24 is forcibly brought to the low voltage V SS . Namely the input terminal 24 outputs the logical value "0", and the input buffer no longer acts as an input buffer. In addition, when the mode control signals C and D are "1" and "0", respectively, the PMOS transistor 30 is turned on and the NMOS transistor 32 is off. Therefore, the input terminal 24 is forcibly brought to the high voltage V DD , namely to the logical value "1". Since the inverting input buffer is formed of the CMOS circuit, the input terminal 24 has a high impedance. Therefore, the input terminal can selectively output the logical value "1" or "0" by adding only the CMOS output circuit (composed of the PMOS transistor 30 and the NMOS transistor 32) to the input terminal 24. Referring to Figure 2D, there is shown a test circuit in accordance with the present invention, combined with an output terminal of the integrated circuit chip. An output terminal 36 is connected to an output of an inverting output buffer 38, which has been ordinarily used in conventional output buffer circuit. An input of the inverting output buffer 38 is connected to an output of a pre-buffer 40, which has a specific function in accordance with the present invention. Namely, the pre-buffer 40 has a first input connected to receive an internal signal I to be outputted from the integrated circuit through the output terminal 36, and second and third inputs connected to the mode control lines 18 and 20 to receive the mode control signals C and D, respectively. This pre-buffer 40 is formed of a decoder which can realize a logic function shown in the truth table shown in Figure 2E. A specific construction of the pre-buffer 40 is omitted, but the pre-buffer 40 could be easily assembled by persons skilled in the art since the logical function is given. As seen from the table shown in Figure 2E, the circuit shown in Figure 2D functions as follows: When both of the mode control signals C and D are "0", the internal signal I is outputted as it is through the output terminal 36. Namely, the circuit shown in Figure 2D acts as an output buffer. However, when the mode control signals C and D are "0" and "1", respectively, the circuit shown in Figure 2D outputs the logical value "0" to the output terminal 36. In addition, when the mode control signals C and D are "1" and "0", respectively, the circuit shown in Figure 2D outputs the logical value "1" to the output terminal 36. Namely, in the latter two cases, the circuit shown in Figure 2D no longer acts as an output buffer. Referring to Figure 2F, there is shown a test circuit in accordance with the present invention, combined with a tristate output buffer terminal of the integrated circuit chip. The shown circuit includes a pre-buffer 42, which has a first input connected to receive an internal signal I to be outputted through an output terminal, second and third inputs connected to the mode control lines 18 and 20 to receive the mode control signals C and D, respectively, and a fourth input connected to receive an enable signal E from an internal circuit (not shown) of the integrated circuit chip. The pre-buffer 42 also has a first output and a second output connected to a CMOS circuit 43. Specifically, the first output of the pre-buffer 42 is connected to a gate of a PMOS transistor 44 having a source connected to a high voltage V DD , and the second output of the pre-buffer 42 is connected to a gate of an NMOS transistor 46 having a source connected to a low voltage V SS . Commonly connected drains of the PMOS transistor 44 and the NMOS transistor 46 are connected to an output terminal 48. As seen from Figure 2F, the PMOS transistor 44 and the NMOS transistor 46 are in a CMOS circuit structure, and therefore, an explanation of an operation of the circuit will be omitted since it is well known to persons skilled in the art or since it can be understand from the description of the circuit shown in Figure 2C. On the other hand, the pre-buffer 42 is formed to realize a logic function shown in the truth table of Figure 2G. A specific construction of the pre-buffer 42 is omitted, since the pre-buffer 40 could be easily assembled by persons skilled in the art in accordance with the logical function given. As seen from the table shown in Figure 2G, the circuit shown in Figure 2F functions as follows: When all of the mode control signals C and D and the enable signal E are "0", the internal signal I is outputted as it is through the output terminal 48. Namely, the circuit shown in Figure 2F acts as an output buffer. When the enable signal E is "1", both of the two transistors 44 and 46 are rendered off, and therefore, the output terminal 48 is brought into a high impedance condition. However, when the mode control signals C and D are "0" and "1", respectively, the circuit shown in Figure 2F outputs the logical value "0" to the output terminal 48, regardless of the logical values of the internal signal I and the enable signal E. In addition, when the mode control signals C and D are "1" and "0", respectively, the circuit shown in Figure 2F outputs the logical value "1". Namely, in these cases, the circuit shown in Figure 2F no longer acts as an output buffer. Turning to Figure 2H, there is shown a test circuit in accordance with the present invention, combined with a bidirectional terminal of the integrated circuit chip. As seen from comparison between Figures 2F and 2H, the circuit shown in Figure 2H is composed of a combination of the tristate output buffer circuit shown in Figure 2F and an input buffer 50 having an input connected to an input/output terminal 52. Since the input buffer 50 has a high input impedance as seen from Figure 2C and the description with reference to Figure 2C, the logical value of the input/output terminal 52 is determined only by the logical value on the connection node between the transistors 44 and 46, and therefore, only by the operation of the pre-buffer 42. In an alternative embodiment, the combination of the mode control signal C and D both of which are the logical value "1" can be used as an instruction for a high impedance output. In this case, the truth table becomes as shown in Figure 3A. This modification will be called a second embodiment hereinafter. In the second embodiment, the test circuit connected to the input terminal can be formed similarly to that shown in Figure 2C. However, the test circuit connected to the output terminal is modified as shown in Figure 3B. Namely, the test circuit shown in Figure 3B is composed of a combination of the pre-buffer 40 shown in Figure 2D and the CMOS circuit 43 shown in Figure 2F. In this case, the relation between the internal signal I, the mode control signals C and D and the value of the output terminal 36 becomes as shown in the truth table of Figure 3C. In the second embodiment, furthermore, the tristate output circuit can be formed similarly to that shown in Figure 2F, and the relation between the internal signal I, the mode control signals C and D, the enable signal E and the value of the output terminal 48 becomes as shown in the truth table of Figure 3D. In addition, the test circuit for the bidirectional terminal is the same as that shown in Figure 2H. Referring to Figure 4, there is shown a modification of the connection layout pattern shown in Figure 1. In this modification, the test mode input buffer, the input test circuit and the output test circuits are the same as those which can be used in the embodiment shown in Figure 1. Only the connection pattern of the mode control lines 18 and 20 is different. Namely, in each pair of adjacent test circuits, if one of the adjacent test circuits has its mode control input C connected to the mode control line 18 and its mode control input D connected to the mode control line 20, the other of the adjacent test circuits has its mode control input C connected to the mode control line 20 and its mode control input D connected to the mode control line 18. With this connection layout pattern, each pair of adjacent input/output terminals of the integrated circuit chip can output different logical value at the testing time. Now, a testing method will be explained with reference to Figure 5, which illustrates three of some number of integrated circuits assembled on a single circuit board having a plurality of connection terminals. Reference Numerals 60, 70 and 80 designate integrated circuits embodying the present invention. Each of the integrated circuits 60, 70 and 80 has a pair of mode setting inputs 14 and 16. In addition, some input/output terminals of the integrated circuit 70 are connected to some input/output terminals of adjacent integrated circuits 60 and 80, and other input/output terminals of the integrated circuit 70 are connected to other circuits or terminals of the circuit board. In order to test the assembled condition of the integrated circuit 70, a pair of mode setting signals "1" and "1" are supplied to the mode setting inputs 14 and 16 of all the integrated circuits 60 and 80 connected to the integrated circuit 70, so that all the input/output terminals of the integrated circuits 60 and 80 are brought into a high impedance condition. Namely, all the input/output terminals of the integrated circuits 60 and 80 connected to the integrated circuit 70 will never supply any electric current to the integrated circuit 70. In other words, the integrated circuit 70 is isolated from the integrated circuits 60 and 80. In this condition, the connection condition between the input/output terminals of the integrated circuit 70 and the connection terminals of the circuit board can be examined by supplying the mode setting signals A and B to the mode setting inputs 14 and 16 of the integrated circuit 70 and by measuring a voltage and a current at various measuring points on the circuit board. As seen from the above description with reference to the accompanying drawings, the integrated circuit in accordance with the present invention is such that the condition of all input/output terminals can be set to a desired logical level by setting the mode setting inputs. Therefore, the connection condition between the input/output terminals of the integrated circuit and the circuit board on which the integrated circuit is assembled, can be examined without a test pattern used in the conventional in-circuit tester, and with a decreased number of testing steps and a reduced amount of time. Furthermore, in the embodiment which can cause the input/output terminals to selectively assume "0", "1" and "high impedance", it is possible to detect an electrostatic breakdown, a latch-up breakdown, etc., which are principal breakdowns occurring at the time of assembling the integrated circuits to the circuit board. If each pair of adjacent input/output terminals of an integrated circuit assumes different logic values to each other as in the modification shown in Figure 4, it is possible to detect a short-circuit between adjacent input/output terminals for example due to soldering.

Claims: A semiconductor integrated circuit comprising: a plurality of input/otput terminals; first and second mode setting input terminals (14, 16); a test mode input circuit (12) having a pair of mode setting inputs connected to said first and second mode setting input terminals to receive first and second mode setting signals (A, B) and for generating first and second mode control signals (C, D); a plurality of test buffer circuits (22) provided for said input/output terminals in one-to-one relation and each having a first terminal connected to a corresponding input/output terminal (24, 36, 48, 52) and a second terminal connected to receive a signal (I) to be supplied from an internal circuit of the integrated circuit to the corresponding input/output terminal or to output to an internal circuit of the integrated circuit a signal inputted through the corresponding input/output terminal from an external circuit of the integrated circuit, characterized in that at least one of said test buffer circuits also includes: first and second mode control inputs (18, 20) connected to receive said first and second mode control signals from said test mode input circuit; a CMOS inverting buffer composed of a PMOS transistor (26) and a NMOS transistor (28) having gates commonly connected to said first terminal (24) and having drains commonly connected to said second terminal; and a CMOS circuit composed of a PMOS transistor (30) and a NMOS transistor (32) having drains commonly connected to said first terminal (24), a gate of the PMOS transistor of the CMOS circuit being connected through an inverter (34) to said first mode control line (18), and a gate of the NMOS transistor of the CMOS circuit being connected to said second mode control line (20), whereby when both of said first and second mode control signals are at a first logical value, said one test buffer circuit operates to output a signal supplied to said first terminal to said second terminal, and when only one of said first and second mode control signals is at a second logical value different from the first logical value, said one test buffer circuit operates to supply the first or second logical value to the corresponding input/output terminal so that the first or second logical value is outputted from the input/output terminal, regardless of a logical value of a signal supplied through the corresponding input/output terminal. A semiconductor integrated circuit claimed in claim 1 wherein when said first mode control signal is at the second logical value and said second mode control signal is at the first logical value, said one test buffer circuit operates to supply the second logical value to the corresponding input/output terminal so that the second logical value is outputted from the input/output terminal, regardless of a logical value of a signal supplied through corresponding input/output terminal, and when said second mode control signal is at the second logical value and said first mode control signal is at the first logical value, said one test buffer circuit operates to supply the first logical value to the corresponding input/output terminal so that the first logical value is outputted from the input/output terminal, regardless of a logical value of a signal supplied through corresponding input/output terminal. A semiconductor integrated circuit claimed in claim 2 wherein when both of said first and second mode control signals are at the second logical value, said one test buffer circuit operates to bring the corresponding input/output terminal into a high impedance condition, regardless of a logical value of a signal supplied through the corresponding input/output terminal.

Inventors: OHFUJI KAZUYOSHI C O NEC CORPO, OHFUJI, KAZUYOSHI C/O NEC CORPORATION
Applicants: NIPPON ELECTRIC CO, NEC CORPORATION
Application year: 1989
Main classification: G06F11
IPC codes: G11C7, G01R31, H03K19, H01L21, H01L27