Adhesive composition

Abstract: The compound represented by the formula [I] wherein n is zero or a positive number, Z is H or fluoralkyl group of 1 to 18 carbon atoms, and a reaction product thereof with (meth)acrylic acid, are useful as an effective component for an adhesive composition.

Description: The present invention relates to a novel adhesive composition comprising a fluorine-containing epoxy resin or fluorine-containing epoxy (meth)acrylate resin. With a development in optical communication, requirements are increased for organic materials which are suitable to mold a lens or prism or to adhere to an optical part with an another part. Particularly, it is required for an optical adhesive used to adhere to an optical part (1) to be low in refractive index in order to match with a glass or like optical part in refractive index, and (2) to be cured at a low temperature in order not to afford a high temperature to the neighboring parts in the adhesion process. Conventionally, epoxy resin compositions have been employed for that purpose; see e.g. US-A-3 879 430 and 4 045 408 and EP-A-239 351. Since usually available bisphenol A type epoxy resins are too high in refractive index (1.55 to 1.58), an adhesive composition which is low in refractive index and contains a bisphenol A type epoxy resin having introduced fluorine atom therein is disclosed, for example, in Japanese Patent Application No. 217794/1983. However, these conventional compositions are still high in refractive index (1.51 to 1.58) and have a drawback that the reflection loss is large at the interface with quartz (refractive index 1.46), another optical part. Further, light returning by reflection from the interface lies a defect to render unstable the operation of laser diode light source. An object of the invention is to provide an adhesive composition which is free from the defect of the conventional epoxy resin having a high refractive index, and is excellent in water-resistance, heat-resistance and adhesive strength, etc. The present invention relates to an adhesive composition which is characterized by comprising a photopolymerization initiator or curing agent and the compound represented by the formula [I] wherein n is a number of from 0.1 to 4 and Z is a fluoroalkyl group of 1 to 18 carbon atoms. The present invention relates to an another adhesive composition which is characterized by comprising a polymerization initiator and the compound represented by the formula [II] wherein n is a number of from 0.1 to 4, Z is a fluoroalkyl group of 1 to 18 carbon atoms, Y is H or CH₃. The present adhesive composition way contain, as other components, for example, conventional epoxy resin, acrylate resins such as epoxy (meth)acrylate resin, urethane acrylate and polybutadiene acrylate and modified products thereof, diluent, curing agent, initiator and coupling agent. The amount of the fluorine-containing compound of the formula (I) or (II) in the adhesive composition is preferably at least 1% by weight in order to lower the refractive index and enhance water-resistance, heat-resistance and adhesive strength. With less than this amount, the effects are lowered. Examples of epoxy compounds of the formula (I) of the present invention are compounds having the following structure. In the above, n is as defined above. Further, epoxy acrylate compounds of the formula (II) of the present invention include compounds having the following structure and a mixture thereof. In the above, n is as defined above. With respect to the epoxy compound of the formula (I) and the epoxy acrylate compound of the formula (II), n is 0.1 to 4 because the compound having a n-value larger than 4 is solid and is difficult to coat. In the present adhesive composition, examples of epoxy resins conjointly used with the epoxy resin of the formula (I) are those having the following structure, novolak epoxy resin, o-cresol novolak epoxy resin and epoxied polybutadiene. (n is as defined above.) Examples of useful curing agents are polyamines, polyols and acid anhydrides, which are conventionally used for epoxy resins. Polyamines include diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), dipropylenetriamine (DPTA), bis(hexamethylene)triamine, 1,3,6-trisaminomethylcyclohexane (TMAH), trimethylhexamethylenediamine (TMD), polyetherpolyamines, diethylaminopropylamine (DEAPA), menthanediamine (MDA), isophoronediamine (IPD), bis(4-amino-3-methylcyclohexyl)-methane, N-aminoethylpiperazine (AEP), m-xylylenediamine (MXDA), m-phenylenediamine (MPDA), diaminodiphenylmethane (DDM), diaminodiphenylsulfone (DDS), 3,9-bis (3 -aminopropyl)-2,4,8,10-tetraspiro[5,5]undecane (ATU) and cyanoethylated polyamines. In addition, polyamideamines can be used which are prepared mainly by condensation of dimer acid and polyamine. Examples of polyamideamines are Tomide (trade name, same as hereinafter, Fuji chemical Ind. Ltd.), Versamide (Henkel Hakusui Ltd. ), Laquamide (Dainippon Ink and Chemicals, Inc. ), Polymide (Sanyo Chemical Industries Ltd. ), EPOMIK (Mitsui Petrochemical Co., Ltd. ) and Sunmide (Sanwa Chemicals Co., Ltd. ). Examples of polyols are phenol novolak, o-cresol novolak, polyvinyl phenol, bromide thereof, 2,2-bis(4′-oxyphenyl)propane and 2,2-bis(4′-oxyphenyl)perfluoropropane. Examples of acid anhydrides are anhydride of each of phthalic acid, trimellitic acid, pyromellitic acid and benzophenonetetracarboxylic acid; anhydride of each of maleic acid, succinic acid, tetrahydrophthalic acid and methyltetrahydrophthalic acid; anhydride of each of methylnadic acid, dodecenylsuccinic acid, hexahydrophthalic acid, methylhexahydrophthalic acid and methylcyclohexenetetracarboxylic acid; anhydride of each of chlorendic acid and tetrabromophthalic acid. The catalyst for thermal curing includes imidazoles, Lewis acids and the like, which are used for curing the conventional epoxy resins. Examples of imidazoles are 2-methylimidazole (2MZ), 2-ethyl-4-methylimidazole (2E4MZ), 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole (2PZ), 1-benzyl-2-methylimidazole (1B2MZ), 1-cyanoethyl-2-methylimidazole (2MZCM), 1-cyanoethyl-2 -ethyl-4-methylimidazole (2E4MZ·CN), 1-cyanoethyl -2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium· trimellitate, 1-cyanoethyl-2-phenylimidazolium· trimellitate (2PZ·CNS), 2-methylimidazolium· isocyanurate, 2-phenylimidazolium·isocyanurate, 2,4-diamino -6-[2-methylimidazolyl-(1)]-ethyl-s-triazine (2MZ-AZINE), 2,4-diamino-6-[2-ethyl-4-methyl-imidazolyl-(1)]-ethyl-s-triazine (2E4MZ-AZINE) and 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ). Lewis acids include boron trifluoride (BF₃), zinc chloride (ZnCl₂), tin tetrachloride (SnCl₄), aluminum chloride (AlCl₃), phosphorus pentafluoride (PF₅), arsenic pentafluoride (AsF₅) and antimony pentafluoride (SbF₅), and are used usually in the form of an amine-complex. As a curing catalyst in photopolymerization are used diazonium salts, sulfonium salts, iodonium salts, selenium salts and like compounds, which are known to be effective for epoxy resins. The diazonium salt is represented by the formula A: Ar-N₂⁺X⁻ (A) Ar includes for example o-, m- or p- nitrophenyl, methoxyphenyl, 2,5-dichlorophenyl, p-(N-morpholino)phenyl and 2,5-diethoxy-4-(p-trimercapto)phenyl. X⁻ is an anion and includes BF₄⁻, FeCl₄⁻, PF₆⁻, AsF₆⁻ and SbF₆⁻. As a sulfonium salt are used bis[4-(diphenylsulfonio)phenyl]sulfide-bis-hexafluorophosphate and bis[4-(diphenylsulfonio)phenyl]sulfide-bis-hexafluoroantimonate, and compounds disclosed on page 15, line 24 to page 18, line 1 of Japanese examined patent publication No. 42688/1984. As a iodonium salt are used di(4-tert-butylphenyl)iodoniumhexafluorophosphate and di(4-tert-butylphenyl)iodoniumhexafluoroantimonate, and compounds disclosed on page 11, line 28 to page 12, line 30 of Japanese examined patent publication No. 42688/1984. Selenium salts include triphenylseleniumhexafluoroantimonate, 4-tert-butylphenyldiphenyltetrafluoroborate and 2,3-dimethylphenyldiphenylhexafluoroantimonate. Examples of diluting agents are butyl glycidyl ether, 2-ethylhexyl glycidyl ether and like alkyl (C 2∼25 ) monoglycidyl ether, butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, dodecanediol diglycidyl ether, pentaerythritol polyglycidyl ether, trimethylolpropane polyglycidyl ether, glycerol polyglycidyl ether, phenyl glycidyl ether, resorcin diglycidyl ether, p-tert-butylphenyl glycidyl ether, allyl glycidyl ether, tetrafluoropropyl glycidyl ether, octafluoropentyl glycidyl ether, dodecafluorooctyl diglycidyl ether, styrene oxide, limonene monoxide, α-pinene epoxide, β-pinene epoxide, cyclohexene epoxide, cyclooctene epoxide, vinylcyclohexene dioxide and the compounds of the following formulae (Q is H, Cℓ, Br, C 1∼18 alkyl or C 1∼18 fluoroalkyl) (Y is H or CH₃) As a coupling agent (epoxy type) is used carbon functional silane coupling agent such as γ-mercaptopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane and β-(3,4-expoxycyclohexyl)ethyltrimethoxysilane. In the present adhesive composition, the epoxy (meth)acrylate compound of the formula (II) can be mixed with a known reactive oligomer or prepolymer having at least one carbon-carbon double bond in the molecule. Examples threof are shown below. (1) Ethylenically unsaturated polyesters obtained by condensation oligomerization of a polybasic carboxylic acid, polyol and ethylenically unsaturated monocarboxylic acid (2) Adducts obtained by the reaction of a polyepoxy compound and ethylenically unsaturated monocarboxylic acid (3) Esters prepared by the reaction of a polyetherpolyol and ethylenically unsaturated monocarboxylic acid (4) Ethylenically unsaturated polyurethanes prepared by reacting a polyisocyanate compound and hydroxyalkyl ester of an ethylenically unsaturated monocarboxylic acid Diallyl phthalate prepolymer, diallyl isophthalate prepolymer and diallyl terephthalate prepolymer can also be used. More specific example of the polyester (1) is an oligoester (meth)acrylate obtained by condensation oligomerization of maleic anhydride, propylene glycol and (meth)acrylic acid. More specific examples of the adducts (2) are an epoxy (meth)acrylate obtained from a bisphenol A diglycidyl ether and (meth)acrylic acid, and an epoxy (meth)acrylate obtained from a hydrogenated bisphenol A epoxide and (meth)acrylic acid. More specific examples of the esters (3) are a polyethylene glycol di(meth)acrylate and polytetraethylene glycol di(meth)acrylate. More specific example of the polyurethane (4) is a urethane (meth)acrylate, which is obtained by reacting an ethylene glycol and excess of diisocyanate compound to form a urethane prepolymer having isocyanate groups in both terminals and then by reacting therewith 2-hydroxyethyl (meth)acrylate. Examples of initiators for curing are (a) a thermal polymerization initiator and (b) photopolymerization initiator. The thermal polymerization initiator includes 2,2′-azobisisobutyronitrile, 2,2′-azobis(2,4-dimethylvaleronitrile), 1-phenylethyl)azodiphenylmethane, 2,2′-azobis(4-methoxy-2,4-dimethylvaleronitrile), dimethyl-2,2′-azobisisobutyrate, 2,2′-azobis(2-methylbutyronitrile), 1,1-azobis(1 -cyclohexanecarbonitrile), 2-(carbomoylazo)-isobutyronitrile, 2,2′-azobis(2,4,4-trimethylpentane), 2-phenylazo-2,4-dimethyl-4-methoxyvaleronitrile, 2,2′-azobis(2-methylpropane) and like azo compounds; benzoyl peroxide, p-chlorobenzoyl peroxide and like diacyl peroxides; methyl ethyl ketone peroxide, cyclohexanone peroxide and like ketone peroxides; tert-butyl perbenzoate, tert-butyl peroxy -2-ethylhexoate and like peresters; tert-butyl hydroperoxide, cumene hydroperoxide and like hydroperoxides; di-tert-butyl peroxide, di-sec-butyl peroxide, dicumyl peroxide and like dialkyl peroxides; and diaryl peroxides. The photopolymerization initiator includes 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, benzophenone, methyl o-benzoylbenzoate, benzoin isobutyl ether, 2-chlorothioxanthone and 1-(4-isopropylphenyl)-2 -hydroxy-2-methylpropane-1-one. Examples of reactive diluents are styrene, 1,6-hexanediol di(meth)acrylate, isobornyl (meth)acrylate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, butylene glycol dimethacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, lauryl acrylate, modified dicyclopentynyl acrylate, glycidyl methacrylate, tetrahydrofurfuryl acrylate, 1,3-butylene glycol dimethacrylate and the compounds of the following formulae having a carbon-carbon double bond (R is C₁ ∼ C₁₈ alkyl) (Q is as defined above) (R is C₁ ∼ C₁₈ alkyl) (Y : H or CH₃). Further, it is possible to add trimethoxysilylpropyl (meth)acrylate and like coupling agent to the present adhesive composition. The present adhesive composition affords a cured product which has a low refractive index and can match with quartz and like optical parts in refractive index, and is excellent in water-resistance, heat-resistance and adhesive strength. Accordingly, the present adhesive composition is useful as an optical adhesive composition for optical parts used in photocommunication system. The invention will be described in more detail below by showing Reference Examples, Examples and Comparison Examples. Fig. 1 - 1 is a horizontal sectional view of the test piece for adhesion test made from BK 7 glass plate, Fig. 1 - 2 is a plane schematic view thereof. Fig. 2 - 1 is a horizontal sectinal view of the test piece for heat resistance test made from a glass plate, Fig. 2 - 2 is a plane schematic view thereof. Fig. 3 is a schematic view of a test piece for reflection attenuation test, and Fig. 4 is a graph showing a dependency of the reflection attenuation amount on the refractive index. 1 : BK 7 glass plate, 2,4,7 : adhesive composition and adhesion portion, 3 : slide glass, 5 : optical fiber, 6 : protective tube. Reference Example 1 To 100mℓ of toluene were added 18.0g (0.25 mole) of acrylic acid and 103g (0.1 mole) of Compound A having the following formula. Thereto were added 1 g of trimethylbenzylammonium chloride and 0.1g of p-methoxyphenol and the mixture was heated to reflux with stirring. After 14 hours, the heating was stopped and the mixture was cooled to room temperature. The reaction mixture was washed with a saturated aqueous solution of sodium chloride until the aqueous layer does not indicate acidity and then dried over anhydrous sodium sulfate. Thereto was added 0.1g of p-methoxyphenol and the mixture was heated at 80 to 90°C at a pressure of 1.3 to 2.6 mbar (1 to 2mmHg) to remove the solvent and the compound of the formula [II] wherein n was 0.1, Y was H and Z was C₈F₁₇ (Compound B) was obtained in a yield of 98g as a viscous liquid. IR (liquid film, cm⁻¹) 3400 OH, 2900 CH, CH₂, 1722 C=O, 1635 C=C , 1402 C=C Reference Example 2 The compound of the formula [II] wherein n was 0.1, Y was CH₃ and Z was C₈F₁₇ (Compound C) was obtained in a yield of 93g in the same manner as in Reference Example 1 except that 21.5g of methacrylic acid was used in place of acrylic acid. IR (liquid film, cm⁻¹) 3400 OH, 2900 CH, CH₂, 1725 C=O, 1640 C=C , 1404 C=C Example 1 To Compound A having the epoxy equivalent of 514 and refractive index of 1.391 was added, as a curing agent, polyether polyamine (PEPA) which is a polyamine type curing agent or boron trifluoride monoethylamine complex (BMA) which is a catalyst for thermal curing, to prepare adhesive compositions. The compositions were cured and checked for refractive index, adhesiveness, glass transition temperature (Tg) and resistance to hot water. The results were given in Table 1. In the above, the refractive index (η D ²⁰) was measured by sodium D line at 589.3µm at 20°C with use of Abbé's refractometer. As the adhesiveness, shear adhesive strength was measured at 23°C and at a tensile speed of 5 mm/min. with use of a BK 7 glass test piece shown in Fig.1. Tg was measured by Differential Scanning Calorimetry (DSC). Fig.1-1 is a horizontal sectional view of the test piece for adhesion test made from BK 7 glass plate, Fig. 1 - 2 is a plane schematic view thereof, and 1 is BK 7 glass plate, 2 adhesive composition and adhesion portion. The unit of numerals in Figures is mm. Heat resistance was checked by measuring a time for separation of a glass test piece shown in Fig. 2 after the immersion in hot water of 80°C. Fig. 2 - 1 is a horizontal sectional view of the test piece for heat resistance test made from a glass plate, Fig. 2 - 2 is a plane schematic view thereof, and 3 is a slide glass, 4 adhesive composition and adhesion portion. The unit of numerals in Figures is mm. The adhesive composition was cured at 65°C for 6 hours in case of using polyetherpolyamine as a curing agent and at 120°C for 3 hours in case of boron trifluoride monoethylamine. The followings are an abbreviated name and structure of the diluting agents used. BDDE : 1,4-Butanediol diglycidyl ether In the below are shown an abbreviated name and structure of the compound used in Comparison Example. Example 2 An adhesive composition containing Compound B was cured by irradiation of ultraviolet ray of 100 mJ/cm². The cured product was checked in the same manner as in Example 1 in the refractive index, adhesive strength, Tg and resistance to hot water. In the below are shown an abbreviated name and structure of the compound used for comparison. Shown below is an abbreviated name and structure of the diluting agent used. As a photopolymerization initiator was used benzoin isobutyl ether (BBE). The results were given in Table 2.

Claims: An adhesive composition comprising a photopolymerization initiator or curing agent and the compound represented by the formula [I] wherein n is a number of from 0.1 to 4 and Z is a fluoroalkyl group of 1 to 18 carbon atoms. An adhesive composition comprising a polymerization initiator and the compound represented by the formula [II] wherein n is a number of from 0.1 to 4, Z is a fluoroalkyl group of 1 to 18 carbon atoms, Y is H or CH₃.

Inventors: KOBAYASHI HIDEO, KUBO MOTONOBU, MARUNO TOHRU, MURATA NORIO, NAKAMURA KOZABURO, SHIMIZU YOSHIKI, KOBAYASHI, HIDEO, KUBO, MOTONOBU, MARUNO, TOHRU, MURATA, NORIO, NAKAMURA, KOZABURO, SHIMIZU, YOSHIKI
Applicants: DAIKIN IND LTD, NIPPON TELEGRAPH & TELEPHONE, DAIKIN INDUSTRIES, LIMITED, NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Application year: 1988
Main classification: C09J4
IPC codes: C08F299, C08G59, C07D303