Easily peelable semiconductive resin composition

Abstract: An easily peelable semiconductive resin composi­ tion comprising 100 parts by weight of ethylene-vinyl acetate copolymer-based polymer component, 1 to 20 parts by weight of waxy aliphatic hydrocarbon, and 50 parts by weight or more of furnace carbon black having an arithmetic mean particle size of 25 to 40 nm, iodine adsorption of 40 to 60 mg/g, and DBP oil absorption (by JIS A method) of 120 to 150 ml/100 g.

Description: FIELD OF THE INVENTION This invention relates to a semiconductive resin composition suitably used for the formation of the external semiconductive layer of the plastic-insulated electric power cables, especially to an easily peelable semiconductive resin composition which can form an external semiconductive layer improved in both adhesion to and peeling from the crosslinked polyethylene insulator. BACKGROUND OF THE INVENTION Generally, the external semiconductive layer of the plastic-insulated electric cables, particularly of those insulated with a crosslinked polyethylene, is formed by extrusion. It is necessary for the external semiconductive layer to tightly adhere to the crosslinked polyethylene insulator in order to avoid generation of corona discharge. There is also a demand, on the other hand, that the external semiconductive layer should be easily removed in the case of terminal treatment of the cable without giving any damage to the insulator. Accordingly, there is a demand for an external semiconductive layer which efficiently adheres in the normal state but which is easily peeled in the case of need. Such a semiconductive layer can be obtained by using, as a base material, a polymer having no affinity with the crosslinked polyethylene insulator. Conventionally used base material is an ethylene-vinyl acetate copolymer. To attain satisfactory peeling properties, however, those with high vinyl acetate concentration (e.g., with 45 % by weight or higher) or a vinyl chloride-grafted copolymer should be used. Such semiconductive layers result in poor thermal resistance and mechanical strength, and also, a satisfactory extrusion workability was not obtained. SUMMARY OF THE INVENTION The present invention have been made to solve the aforesaid problems. Thus it is an object of the present invention to provide an easily peelable semiconductive resin composition with improved peeling property, thermal resistance, and mechanical properties, as well as excellent extrusion workability. The semiconductive resin composition of the present invention comprises 100 parts by weight of ethylene-vinyl acetate copolymer-based polymer component, 1 to 20 parts by weight of waxy aliphatic hydrocarbon, and 50 parts by weight or more of furnace carbon black having an arithmetic mean particle size of 25 to 40 mµ, iodine absorption of 40 to 60 mg/g, and DBP oil absorption (by JIS A method) of 120 to 150 mℓ/100g. The polymer component in the present invention may be the ethylene vinyl acetate copolymer alone or a combination thereof with another polymer. The ethylene-vinyl acetate copolymer as the base polymer is not particularly limited, however, it is preferable that the vinyl acetate content is in the range of 20 to 55% by weight. When the content is less than 20% by weight, a satisfactory peeling property is not achieved, and when the content exceeds 55% by weight, the mechanical strength of the semiconductive layer tends to decrease. One of the preferable polymer components in the present invention is the blend of the ethylene-vinyl acetate copolymer and an aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer. This polymer component may further improve the peeling property. The aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer to be used in the present invention is a copolymer obtained by graft-copolymerization of aromatic vinyl monomers such as styrene, methyl styrene, and α-methyl styrene, to an ethylene-vinyl acetate copolymer containing 20% by weight or more of vinyl acetate. The content of the aromatic vinyl monomer to be incorporated into the aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer is preferably from 5 to 60% by weight. Further, the polymer component should desirably contain 95 to 50% by weight of ethylene-vinyl acetate copolymer and 5 to 50% by weight of aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer. The aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer of less than 5% by weight has little contribution to the peeling property, and that of more than 50% by weight decreases the mechanical strength of the semiconductive layer. A chief feature of the present invention resides in that a waxy aliphatic hydrocarbon and a special furnace carbon black having an arithmetic mean particle size of 25 to 40 mµ, an iodine adsorption of 40 to 60 mg/g, a DBP oil absorption (by JIS A method) of 120 to 150 mℓ/100 g, are used together. This gives a synergetic effect resulting in an improved peeling property and an improved extrusion workability due to the lowered viscosity. Examples of waxy aliphatic hydrocarbons include paraffine wax, microcrystalline wax, and petrolatum, all of which normally have a molecular weight of 1,000 or less. The amount of the waxy aliphatic hydrocarbon to be incorporated is restricted to 1 to 20 parts by weight per 100 parts by weight of the polymer component, wherein a content of less than 1 part by weight is insufficient to improve peeling properties and extrusion workability, whereas a content exceeding 20 parts by weight damages thermal resistance. The arithmetic mean particle size of the special furnace carbon black in the present invention is obtained by electron microscopic method. When particles smaller than 25 mµ are used, extrusion workability is damaged by increasing viscosity. When particles exceeding 40 mµ are used, sufficient conductivity cannot be obtained. An iodine adsorption of less than 40 mg/g gives insufficient conductivity and that in excess of 60 mg/g increases the viscosity of the composite and deteriorates the extrusion workability. DBP oil absorption is measured by JIS A method. When it is lower than 120 mℓ/100 g, conductivity obtained is not high enough, and a value higher than 150 mℓ/100 g increases the viscosity of the composition and adversely affects the extrusion workability. The special furnace carbon black should be added in an amount of 50 parts by weight or more per 100 parts by weight of the polymer component. If the amount is less than this limit, no satisfactory conductivity is obtained. Acetylene black may be used together with the above special furnace carbon black so far as the viscosity of the composition is not increased to a large extent. Lubricants and antioxidants may be added in addition to the aforesaid components. Aliphatic alcohols, fatty acids, esters of fatty acids, metal salts of fatty acids, fatty acid amides, and the like are the examples of the lubricants. Those may be used singly or in combinations of two or more thereof. Specific antioxidants include thiobisphenols, alkylidenebisphenols, alkylphenols, hydroxybenzyl compounds, aminophenols, hydroxyphenylpropionates, secondary aromatic amines, thioethers, phosphites, phosphonites, etc. These may be used independently or in combinations of two or more. The composition of the present invention may be crosslinked. Organic peroxides are generally used for a crosslinking agent in the present case. Dicumyl peroxides, 1,3-bis(tert-butylperoxyisopropyl)benzene, 2,2-dimethyl-2,5-di(tert-butylperoxy)hexine-3 are specific examples for dialkyl peroxides suitable for use as the crosslinking agent. The present invention is now illustrated in greater detail with reference to nonlimiting Examples and Comparative Examples. In these examples, all percents and parts are by weight unless otherwise indicated. EXAMPLES The indicated components were kneaded with a Bambury mixer to give the compositions for Examples 1 to 10 and Comparative Examples 1 to 10 shown below. The thus-obtained mixtures each was fed to a 65-mm extruder to form a 0.7 mm thick external semiconductive layer together with a 0.7 mm thick internal semiconductive layer and a 4 mm thick crosslinked polyethylene insulater on an annealed copper twisted wire conductor having a cross sectional area of 150 mm² by extrusion coating using a common head. Then, the coated product was heated at 230°C for crosslinking to manufacture an electric power cable insulated with a crosslinked polyethylene. The crosslinked polyethylene insulating layer was formed using a composition comprising 100 parts by weight of low density polyethylene (having a density of 0.920 g/cm³ and a melt index of 1.0 g/10 min), 2.5 parts by weight of dicumyl peroxide as the crosslinking agent and 0.25 parts by weight of 4,4′-thio-bis(3-methyl-6-tert-butylphenol). The temperature of the extruder was set in the direction from the feeding zone to the metering zone, as follows: C₁=100°C, C₂=110°C, C₃=115°C, and the die temperature of 120°C. EXAMPLE 1 EXAMPLE 2 EXAMPLE 3 EXAMPLE 4 EXAMPLE 5 EXAMPLE 6 EXAMPLE 7 EXAMPLE 8 EXAMPLE 9 EXAMPLE 10 COMPARATIVE EXAMPLE 1 COMPARATIVE EXAMPLE 2 COMPARATIVE EXAMPLE 3 COMPARATIVE EXAMPLE 4 COMPARATIVE EXAMPLE 5 COMPARATIVE EXAMPLE 6 COMPARATIVE EXAMPLE 7 COMPARATIVE EXAMPLE 8 COMPARATIVE EXAMPLE 9 COMPARATIVE EXAMPLE 10 The compositions given above and the cables prepared using thereof were evaluated and the results are given in Table 1. Evaluation were made according to the following. Peel strength : Force necessary to peel the outer semiconductive layer off the cable was measured at room temperature according to the AEIC-CS5-82 standard. Volume resistivity : Measured according to the AEIC-CS5-82 standard. Tensile strength : The semiconductive layer peeled off the cable was measured following the JIS C-3005 standard. Those having the tensile strength of 1.0 kg/mm² or more were evaluated 'good' and those lower than 1.0 kg/mm² were evaluated 'poor'. Heat aging resistance : The semiconductive layer peeled off the cable was aged in a gear-oven aging tester at 135°C for 7 days according to the IEC standardized method. Those maintaining both tensile strength and elongation in the range from 75% to 125% of the initial values were evaluated 'good' and those showing values out of the above were evaluated 'poor'. Mooney viscosity (ML₁+₄): Evaluations were made on semiconductive compositions at 120°C. Those having values of 50 or less had good extrusion workability. The samples of Example 1 to 10 of the present invention on the whole had good peeling strength, volume resistivity, mechanical strength, thermal resistance, and viscosity for the composition, except for the sample using an ethylene-vinyl acetate copolymer containing 19% by weight of vinyl acetate which showed a somewhat increased peeling strength. Comparative Examples 1 and 2 used an ethylenevinyl acetate copolymer containing 60% by weight of vinyl acetate and a vinyl chloride-ethylene-vinyl acetate terpolymer, respectively. In these cases, both mechanical strength and thermal resistance are insufficient. Moreover, Mooney viscosity was so high that extrusion workability was deteriorated. Comparative Excamlple 3 used less paraffin wax than the limit defined in the present invention. In such a case, peeling strength was increased and also the extrusion workability is somewhat damaged. Comparative Example 4, on the contrary, used more paraffin wax than the limit of the invention. In this case, the heat aging resistance is insufficient. Comparative Example 5 used furnace carbon black in an amount less than the limit of the present invention that the volume resistivity is too increased. Comparative Examples from 6 to 10 used furnace carbon black in an amount out of the content range limited in the present invention that volume resistivity or extrusion workability was deteriorated despite the good peeling property. While the invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof.

Claims: An easily peelable semiconductive resin composition comprising 100 parts by weight of ethylene-vinyl acetate copolymer (I) containing 20 to 55% by weight of vinyl acetate optionally blended with an aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer obtained by graft-copolymerization of an aromatic vinyl monomer to an ethylene-vinyl acetate copolymer (II), 1 to 20 parts by weight of a waxy aliphatic hydrocarbon, and 50 parts by weight or more of furnace carbon black having an arithmetic mean particle size of 25 to 40 nm, an iodine adsorption of 40 to 60 mg/g, and a DBP oil absorption (by JIS A method) of 120 to 150 ml/100 g. The easily peelable semiconductive resin composition as in claim 1, wherein 95 to 50% by weight of the ethylene-vinyl acetate copolymer (I) are blended with 5 to 50% by weight of the aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer. The easily peelable semiconductive resin composition as in claim 1, wherein the ethylene-vinyl acetate copolymer (II) contains 20% by weight or more of vinyl acetate. The easily peelable semiconductive resin composition as in claim 1, wherein the aromatic vinyl monomer-modified ethylene-vinyl acetate copolymer contains 5 to 60% by weight of aromatic vinyl monomer. The easily peelable semiconductive resin composition as in claim 1, wherein the aromatic vinyl monomer is styrene. The easily peelable semiconductive resin composition as claimed in claim 1, wherein the waxy hydrocarbon is paraffin wax. The easily peelable semiconductive resin composition as in claim 1, wherein the waxy hydrocarbon is microcrystalline wax. The easily peelable semiconductive resin composition as claimed in claim 1, wherein the composition further comprises an antioxidant. The easily peelable semiconductive resin composition as in claim 8, wherein the antioxidant is 4,4′-thiobis(3-methyl-6-t-butyl-phenol). The easily peelable semiconductive resin composition as in claim 1, wherein the composition further comprises a crosslinking agent. The easily peelable semiconductive resin composition as in claim 10, wherein the crosslinking agent is 1,3-bis(tert-butylperoxyisopropyl)benzene. The easily peelable semiconductive resin composition as in claim 1, wherein the composition further comprises an acetylene black by such an amount that it does not greatly increase the viscosity of the composition.

Inventors: WATANABE KIYOSHI HITACHI CABLE, YAGYU HIDEKI HITACHI CABLE LTD, YAMAZAKI TAKANORI HITACHI CABL, WATANABE, KIYOSHI HITACHI CABLE LTD., YAGYU, HIDEKI HITACHI CABLE LTD., YAMAZAKI, TAKANORI HITACHI CABLE LTD.
Applicants: HITACHI CABLE, HITACHI CABLE, LTD.
Application year: 1988
Main classification: H01B1
IPC codes: C08L23, C08L31, H01B1, C09C1, C08L91, C08L51, C08K3