Epoxy resin composition

Abstract: The present invention relates to an one-packed type epoxy resin composition. An object of the present invention is to provide epoxy resin composition which have good compatibility with epoxy resin, exhibit excellent stability during storage and heat stability, can be used at about room temperature over a long period of time and an be rapidly cured at a relatively low temperature upon heating.

Description: The present invention relates to a one-pack epoxy resin composition. The epoxy resins can be converted into cured matters having excellent mechanical and electrical properties by heating and curing them and therefore, have been widely used for various molding materials, composite materials, adhesives, etc.. An object of the present invention is to provide epoxy resin compositions which have good compatibility with epoxy resins, exhibit excellent stability during storage, can be used at about room temperature over a long period of time and can be rapidly cured at a relatively low temperature upon heating. As hardeners of epoxy resins, acid anhydrides, boron trifluoride amine complexes or amine compounds, etc. have been generally used. However, hardeners having a relatively high curing temperature such as acid anhydrides or boron trifluoride amine complexes involve drawbacks that they require molding at high temperatures over long periods of time while they have excellent stability during storage. Further, boron trifluoride amine complexes involve drawbacks that they are readily inactivated due to their hygroscopic property and tend to affect the efficiency of the hardened product. On the other hand, hardeners having a relatively rapid hardening rate such as amine compounds can not only provide a shortened period of the hardening time required for molding but also reduce energy costs due to lowering the hardening temperature and costs of auxiliary materials so that they are greatly advantageous and very valuable from a practical standpoint. However, the amine compounds encounter the problem that the time period required to be useable as molding materials at about room temperature becomes markedly short and their moldability change in a short period of time so that they are unstable in operability. Furthermore, the amine compounds have a toxic problem in general and cannot be used widely. The present invention relates to a one-pack type epoxy resin composition. An object of the present invention is to provide epoxy resin compositions which have good compatibility with epoxy resin, exhibit excellent stability during storage and heat stability, can be used at about room temperature over a long period of time and can be rapidly cured at a relatively low temperature upon heating. A one-pack epoxy resin composition comprising as essential components (1), (2) and (3) described below: (1) epoxy resin (2) an organic dibasic acid represented by: HOOC(CH₂) m COOH wherein m is an integer of 5 to 18; (3) a urea derivative represented by general formula described below: wherein R₁ represents hydrogen or an alkyl group or an aromatic group which may have a substituent and R₂ represents an alkyl group. As a result of extensive investigations with an attempt to develop potential hardener compositions exhibiting a sufficient storage stability at about room temperature, providing epoxy resins capable of being rapidly cured upon heating even at a relatively low temperature and having excellent compatibility, the present inventors have accomplished the present invention. Namely, the epoxy resin is directed to epoxy resin compositions comprising: (1) epoxy resin (2) an organic dibasic acid represented by: HOOC(CH₂) m COOH wherein m is an integer of 5 to 18; (3) a urea derivative represented by general formula described below: wherein R₁ represents hydrogen or an alkyl group or an aromatic group which may have a substituent and R₂ represents an alkyl group. The one-packed epoxy resin composition of the epoxy resin exhibits excellent stability during storage, provides a prolonged usable time period at about room temperature, relatively readily cured upon heating and provides excellent adhesive property. The epoxy resins which can be used in the present invention refer to known epoxy resins and specific example include diphenylols such as diphenylolpropane, diphenylolethane and diphenylolmethane; polyglycidyl ethers of alkanes, novolak or polyglycidyl ethers of polyvalent phenols such as resol, poly(epoxyalkyl)ethers of aliphatic polyoxy compounds such as ethylene glycol, glycerine;, or glycidyl esters of aromatic and aliphatic carboxylic acids. They may be incorporated singly or in combination of at least two. The organic dibasic acids which can be used in the present invention are compounds represented by general formula described below: HOOC(CH₂) m COOH wherein m is an integer of 5 to 18. Example of the acids include pimelic acid, sebacic acid, suberic acid, azelaic acid. The amount of the acids to be used is 10 to 100 PHR, preferably approximately 15 to 50 PHR, based on the epoxy resin. The urea derivatives which can be used in the present invention are not particularly restricted but are compounds represented by general formula described below: In case where R₁ represents an alkyl group, the alkyl group is preferably a lower alkyl group such as a methyl group, an ethyl group, a propyl group, etc.; in case that R₁ represents an aromatic group, the aromatic group is preferably a phenyl group; the phenyl group may have at least one substituent such as an alkyl group (e.g., a methyl, ethyl or propyl group), or a halomethyl, haloethyl or halopropyl group, or chlorine or bromine. Further R₂ preferably represents a lower alkyl group such as a methyl group, an ethyl group or a propyl group. Therefore, preferred examples of hardening accelerators include N,N-dimethylurea, N,N-diethylurea, N-(p-chlorophenyl)-N',N'-dimethylurea and N-(m,p-dichlorophenyl)-N',N'-dimethylurea. These urea derivatives can be used singly or as admixture of two or more. The amount of the urea derivatives to be used is 1 to 30 PHR, desirably 1 to 15 PHR, based on the epoxy resin. The one-packed epoxy resin compositions according to the present invention have excellent storage stability and provides cured products having excellent properties (particularly in adhesive property and peeling rate). Hereafter the present invention will be described with reference to the example below. EXAMPLE Compositions were prepared in accordance with formulations shown in Tables 1 and 2 to evaluate curing property, adhesive property and storage stability. 1. Curing Property By differential thermal analysis, the temperature at which curing started and the peak temperature were measured. Sample: about 10 mg Standard material: alumina Rate of elevating temperature: 5 C/min 2. Gelation Time Using about 3 g of a sample, the gelation time until the sample was gelled was measured with a Yasuda Gel Time Tester. 3. Adhesive Property Tensile Shear Strength: A test piece prepared according to JIS K6850 was cured at 130°C/1H and its tensile shear strength was measured using a Tensilon BANNO Tester (manufactured by Toyo Boldwin K.K.). Temperature measured: 25°C T-Peel Strength: A test piece prepared according to JIS K6854 was cured at a given temperature and its T-Peel strength was measured with a Tensilon BANNO Tester. Peeling rate: 50 mm/min 4. Storage stability A sample was put in an oven of a given temperature and the number of days until the fluidity was lost was counted. These results are shown in Tables 3 and 4.

Claims: An one-pack epoxy resin composition comprising: (1) epoxy resin; (2) an organic dibasic acid represented by the general formula: HOOC(CH₂) m COOH wherein m is an integer of 5 to 18; (3) a urea derivative represented by the general formula: wherein R₁ represents hydrogen, an alkyl group or an aromatic group, which groups may have one or more substituents, and R₂ represents an alkyl group. A composition according to claim 1, wherein the organic dibasic acid is pimelic acid, sebacic acid, suberic acid, or azelaic acid. A composition according to claim 1 or 2, wherein the epoxy resin is at least one of diphenylols, polyglycidyl ethers of alkanes, polyglycidyl ethers of polyvalent phenols, poly(epoxyalkyl)ethers of aliphatic polyoxy compounds, and glycidyl esters of aromatic and/or aliphatic carboxy acids. A composition according to claim 1, 2 or 3, wherein R₁ and/or R₂ of the urea derivative is a methyl, ethyl or propyl group. A composition according to claim 1, 2 or 3, wherein R₁ of the urea derivative is a phenyl group, or a phenyl group substituted by least one substituent selected from methyl, ethyl, propyl, halomethyl, haloethyl, halopropyl, chlorine and bromine.

Inventors: SAKAMOTO HIROSHI CENTRAL RESEA, TAKEUCHI KOJI CENTRAL RESEARCH, SAKAMOTO, HIROSHI CENTRAL RESEARCH LABORATORIES, TAKEUCHI, KOJI CENTRAL RESEARCH LABORATORIES
Applicants: AJINOMOTO KK, AJINOMOTO CO., INC.
Application year: 1987
Main classification: C08G59
IPC codes: C08G59