Process for bonding water penetrable cellulosic particles

Abstract: A substitute for amino and phenolic resins is disclosed. It is used in the polycondensation of such resins based on form­ aldehyde for bonding water penetrable cellulosic particles. The substitute comprises an aqueous solution of a) either at least one aldehyde together with at least one amide and/or together with at least one phenol, or a non-­ resinous condensation product of formaldehyde and urea, and b) a sugar or a sugar derivative or their by-products or a starch or its degradation products or a mixture thereof, and/­ or c) a raw and/or treated lignosulfonate. This substitute also reduces the free formaldehyde of the resulting board without impairing the other properties thereof.

Description: The present invention relates to a process for bonding water penetrable cellulosic particles by polycondensation of amino or phenolic resins based on formaldehyde, which allows lower amounts of resin solids to be used, while at the same time the free formaldehyde of the resulting board is reduced without imparting any loss in bonding strength, without requiring any extra steps in the production, without changing the curing rate of the production, without causing any problem to the boilers when burning particleboard sander dust or edges from cutting saws and without reducing the tack properties of the resin mixture. FR-A-2 406 658 proposes that the problem of the reduction of unwanted formaldehyde odour in binders for boards is solved by including in the resin an excess of urea. US-A-4 186 242 illustrates that a further conventional way of overcoming this problem is by inclusion of ammonium lignosulfonates. Furthermore, it is known from BE-A-832 584 that a proportion of binder can be replaced directly by the same weight of a sulfonate salt. GB-A-1 038 077 is concerned with a binder composition which comprises a reducing sugar or a sugar which will hydrolyze to form a reducing sugar, a urea formaldehyde component comprising a mixture of urea and formaldehyde and/or a condensation product of urea and formaldehyde, and furfuryl alcohol. This composition can be used in the preparation of cores and molds for foundry purposes. EP-A-41 745 equally teaches to add lignosulfonates to formaldehyde binder compositions as this improves certain properties including the formaldehyde emission. GB-A-624 437 discloses a composition containing formaldehyde, urea, phenol, soluble starch, sodium carbonate and water, serving for the production of a synthetic resin. GB-A-1 333 470 discloses a solution containing a phenol/formaldehyde/urea resin and sodium lignosulfonate. GB-A-1 293 744 discloses a solution containing a phenol/formaldehyde/urea resin and ammonium lignosulfonate. US-A-4 339 361 describes a method for preparing a water-dilutable, thermosetting, low free phenol containing resole from an aqueous formaldehyde solution, phenol and corn syrup. The closest prior art is GB-A-136 008, Example 6, Sample 1, which describes the addition of an aqueous solution of dextrose and urea to a urea-formaldehyde resin formulation in order to reduce the free formaldehyde of the boards produced using this glue formulation. Broadly, GB-A-2 136 008 is directed to a formaldehyde binder when for use in boards prepared from lignocellulosic materials using adhesives based on formaldehyde, which comprises a solution of (a) at least one organic hydroxy compound with the exception of C₁₋₄ monohydric aliphatic alcohols and b) at least one amide in water; and to a process for preparing boards from lignocellulosic materials using an adhesive based on formaldehyde, wherein the claimed formaldehyde binder is added to the adhesive. The process of the present invention is characterized in that a part of such resins is replaced by a substitute consisting of an aqueous solution having a pH of 6 to 14 of a) at least one aldehyde together with at least one amide and/or together with at least one phenol, and b) a sugar or a sugar derivate or molasses or a starch or its degradation products or a mixture thereof, and/or c) a raw and/or treated lignosulfonate, the weight ration of a) to b) and/or c) being 1.0 to 15.0:1. GB-A-2 136 008 however gives no indication how to obtain boards with considerably better internal bond strength and thickness swelling and while substantially maintaining the level of free formaldehyde emission. Preferably the substitute contains 40 to 52% by weight of water. The aldehyde is preferably formaldehyde, for example in the form of paraformaldehyde, or acetaldehyde. The amide is preferably mainly urea or thiourea or their homologues or melamine, benzoguanamine or dicyandiamide or their homologues. The phenol is preferably phenol itself or resorcinol. Among the sugars and sugar derivatives and mixtures thereof, dextrose, glucose, fructose or sucrose or mixtures thereof such as corn syrup are most preferred. Among the starches, wheat starch, modified starches, dextrin glue are interesting. Examples of raw lignosulfonates are black liquor and similar products, and examples of treated lignosulfonates are sodium, calcium and ammonium lignosulfonate. The combination of a) with b) and/or c) presents a synergistic behaviour. If the single components are added alone to the resin they do not give good boards, but if they are added in combination, they exhibit an improvement in the board properties obtained. The substitute used in the present process (calculated as 100 % solids) may substitute as much as 30 % of the resin solids used. Said substitute is not added in quantities equal to the quantities substituted. It is added in quantities from 50 to 90 % of the amount of resin substituted (calculations referred to by weight and referring to all products as 100 % solids). The substitute used in the present process may therefore, because of its synergistic behaviour, substitute the resin in quantities from 110 % up to 200 % of its own weight. When added to lower amounts e.g. up to 15 % there is a considerable increase in the properties of the end product. When added to higher levels, i.e. up to 30 %, no difference is imparted to the properties of the end product but the free formaldehyde is considerably reduced and the amount of resin saved is considerably increased. Bonding is effected by curing the resin mixture at elevated temperatures and pressures according to the methods well known in the art. The substitute may be used in all types of products where amino and phenolic resins are used for bonding lignocellulosic products, whether these are wood particles for particleboard production using a flat press, or a calender or wood veneers such as in plywood production. It is very interesting to note that the product has also good tack. This property otherwise called "green strength" is desired in some types of particleboard plants, specially the plants with multi opening press and in plywood factories, specially those having a pre-press. The quality of boards produced was controlled weekly for a period of six months and no reduction in the properties was observed. This proves that no polymer degradation occurs and that the ageing properties of the boards are comparable to the ones normally produced. The substitute used in the present process can be prepared by plain mixing of the components. In order to obtain an acceptable shelf-life of the substitute, a base is added to adjust the pH to a value in the range of 6 to 14. Substitutes so far known in the art to substitute resin have not succeeded in substituting such high levels of resin by using lower amounts of the substitute and reducing simultaneously the free formaldehyde of the boards, without imparting any loss in bonding strength, without requiring any extra steps in the production, without changing the curing rate of the production, without causing any problems to the boilers when burning particleboard sander dust or edges from cutting saws and without reducing the tack of the resin mixture. In particular, certain known substituents are lignosulfonates, sodium chloride or mixtures of formaldehyde with urea and sodium chloride. It is well known that lignosulfonates may not be used for quantities higher than 10 %; otherwise, board properties will be reduced. It is also known that the addition of halide salt alone succeeds in substituting part of the resin with the following limitations: High substitutions, higher than 6 to 8 %, may not be obtained, otherwise the board properties will deteriorate. Substitution is obtained in ratios 1:1, while in the case of the substitute according to the present invention it is 1.1 to 2.0:1. When particleboard sander dust or edges from cutting saws are burnt in boilers, the latter are plugged within a few hours. Tack is reduced when sodium chloride is added to the resin mixtures. When mixtures of sodium chloride with urea and formaldehyde are used the following shortcomings are present : The presence of salt in the mixture causes severe problems in the boilers when sander dust or cutting saw edges of boards are burnt. That is caused because the presence of salt reduces the melting point of the mixture and as a result a molten mass deposits in the boiler forming a glass like deposit which adheres on the boiler thus plugging it. The other shortcoming of this product is the fact that tack is severely reduced, thus making it difficult to use in the plywood industry where there is a pre-press and in particleboard plants where a multi opening press is present requiring green strength of the mat. The substitute used in the present process overcomes all of the above shortcomings. The substitute used in the present process provides yet another advantage. Apart from substituting up to 30 % of the resin by adding only 50 to 90 % of the resin solids substituted, and reducing the free formaldehyde of boards, it reduces also the free formaldehyde in the production hall where workers are exposed to formaldehyde fumes. The following Examples illustrate the invention. Example 1 Three samples were prepared according to the following formulations : Sample No. 1 2 3 parts by weight Formaldehyde 100 % 185 - 133 Urea 100 % 370 - 266 Molasses 100 % - 555 156 Water 445 445 445 1000 1000 1000 The above mentioned samples were prepared by plain mixing at room temperature until the solids were completely dissolved. The pH of the final products was adjusted to 7.5 to 8.0. Glue formulations were then prepared as follows : Glue formulation No. 0 1 2 3 parts by weight Urea formaldehyde resin (65 % solids) 108.9 81.7 81.7 81.7 Water 13.8 13.8 13.8 13.8 Sample 1 - 27.2 - - Sample 2 - - 27.2 - Sample 3 - - - 27.2 Ammonium chloride (20%) 7.1 7.1 7.1 7.1 No. 0: Glue formulation is the blank and does not include any of the above mentioned samples. No. 1: Glue formulation includes sample 1, whereby only formaldehyde and urea are included. No. 2: Glue formulation includes sample 2 whereby only molasses are included. No. 3: Glue formulation includes sample 3 whereby all three ingredients are added, namely, formaldehyde, urea and molasses. Sample 3 represents the product according to the present invention. These glue formulations were used separately to spray a constant quantity of dried wood chips. The sprayed wood chips were then formed into a mat having a normal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions : Press temperature 200 °C Press time 9 sec/mm Pressure 33 kp/cm² Boards were then tested and the results are reported in the following table. Glue formulation No. 0 1 2 3 Density (kg/m³) 582 591 583 582 Thickness (mm) 15.4 15.2 15.5 15.4 Internal bond (kg/cm²) 7.1 6.5 5.0 7.2 2 hrs thickness swelling (%) 11.1 11.3 17.5 12.1 24 hrs thickness swelling (%) 20.3 22.5 30.3 22.3 Free formaldehyde (mg/100 g dry board) 24.1 18.3 21.8 18.7 Moisture content (%) 5.5 5.0 5.3 5.0 It can be noticed from the above mentioned table that while all three samples reduce the free formaldehyde of boards, only sample 3 including the components according to the present invention gives boards equivalent to the blank, without deterioration of the board properties. Example 2 This example proves the synergistic behaviour existing between formaldehyde, urea and lignosulfonates. For this purpose the following samples were prepared : Sample No. 1 2 3 parts by weight Formaldehyde (100 %) 185 - 133 Urea (100 %) 370 - 266 Calcium lignosulfonate (100 %) - 555 156 Water 445 445 445 1000 1000 1000 The above mentioned samples were prepared by plain mixing at room temperature until the solids were completely dissolved. The pH of the final products was adjusted to 7.5 to 8.0. Glue formulation No. 0 1 2 3 parts by weight Urea formaldehyde resin (65 % solids) 108.9 81.7 81.7 81.7 Water 13.8 13.8 13.8 13.8 Sample 1 - 27.2 - - Sample 2 - - 27.2 - Sample 3 - - - 27.2 Ammonium chloride (20%) 7.1 7.1 7.1 7.1 These glue formulations were used separately to spray a constant quantity of dried wood chips. The sprayed wood chips were then formed into a mat having a nominal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions : Press temperature 200 °C Press time 9 sec/mm Pressure 33 kp/cm² Boards were then tested and the results are reported in the following table : Glue formulation No. 0 1 2 3 Density (kg/m³) 580 591 590 584 Thickness (mm) 15.5 15.2 15.0 15.1 Internal bond (kg/cm²) 7.0 6.3 5.4 6.9 2 hrs thickness swelling (%) 11.2 11.3 17.8 11.8 24 hrs thickness swelling (%) 20.6 22.5 29.5 23.8 Free formaldehyde (mg/100 g dry board) 23.9 19.8 18.5 17.8 Moisture content (%) 5.8 5.0 4.5 4.8 It will be noticed from the above mentioned figures that boards produced with plain lignosulfonates, sample 2, have the worst results. Boards obtained with all three components according to our present invention, sample 3, have the best results. Actually boards of sample 3 are equivalent to the blank, 0, which is the resin mixture without any substitute, while giving at the same time a reduction in the free formaldehyde of the boards. Example 3 In this example two samples are illustrated whereby the ratio of formaldehyde to urea is different from the one used in the previous examples. Also the weight ratio between components a) and b) is different from the one of examples 1 and 2. The following samples were prepared : Sample No. 1 2 parts by weight Formaldehyde (100 %) 133 133 Urea (100 %) 177 177 Molasses (100 %) 156 - Dextrin glue (100 %) 30 - Calcium lignosulfonate (100 %) - 186 Water 504 504 1000 1000 The above mentioned samples were prepared by plain mixing at room temperature until the solids were completely dissolved. The pH of the final products was adjusted to 7.5 to 8.0. Glue formulations were then prepared as follows : Glue formulation No. 0 1 2 parts by weight Urea formaldehyde resin (65 % solids) 108.9 87.1 87.1 Water 13.8 13.8 13.8 Sample 1 - 21.8 - Sample 2 - - 21.8 Ammonium chloride (20%) 7.1 7.1 7.1 These glue formulations were used separately to spray a constant quantity of dried wood chips. The sprayed wood chips were then formed into a mat having a nominal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions : Press temperature 200 °C Press time 9 sec/mm Pressure 33 kp/cm² Boards were then tested and the results are reported in the following table : Glue formulation No. 0 1 2 Density (kg/m³) 573 595 587 Thickness (mm) 15.1 15.4 15.2 Internal bond (kg/cm²) 8.1 8.7 8.9 2 hrs thickness swelling (%) 10.5 10.0 9.8 24 hrs thickness swelling (%) 19.9 19.3 18.7 Free formaldehyde (mg 100 g dry board) 46.6 39.2 34.3 Moisture content (%) 5.9 5.3 5.0 It can be noticed from the above mentioned table that samples 1 and 2 including the solution according to the present invention give boards equivalent to the blank, sample 0, while giving a significant free formaldehyde reduction and resin saving. Example 4 This is a laboratory test for plywood using a phenolic resin. The following samples were prepared: Sample No. 1 2 parts by weight Phenol (100%) 180 200 Formaldehyde (100%) 80 100 Molasses (100%) 120 180 Ammonium lignosulfonate (100%) 200 - Water 420 520 Total 1000 1000 The samples were prepared by plain mixing at room temperature until the solids here completely dissolved. The pH of the final products was brought to 10.0 by means of addition of sodium hydroxide. These samples were used in a glue formulation as follows: Glue formulation No. 0 1 2 parts by weight Phenol formaldehyde glue (100%) 100 80 80 Hardener (calcium carbonate: wheat flour - weight ratio 50:50) 60 60 60 Water 107 90 90 Sample 1 - 30.77 - Sample 2 - - 30.77 Wheat flour - - 10 Total 267 260.77 270.77 Viscosity (mPa.s) 1200 1300 1100 The above mentioned glue formulations were used to spread both sides of the core veneer for 3 ply boards. Boards were then introduced in a cold press where they were pressed under the following conditions: Press time 8 minutes Pressure 10 kp/cm² All boards gave very good tack properties. They were then pressed in a hot press under the following conditions: Press temperature 130°C Press time 3.5 minutes Pressure 12 kp/cm² These boards were tested as follows: They were immersed for 24 hours in water at 60°C. After this they were introduced in water at 20°C for one hour and then the knife test was carried out. Results were as follows: Glue formulation No. 0 1 2 Grading 10/10 10/10 10/10 The knife test is carried out as follows: Plywood samples are placed in water under pressure for 30 minutes and then in vacuum for another 30 minutes. Samples are then scraped with a knife on the surface until the top veneer comes off and the core shows up. The grading depends on the amount of fibers showing in the core after the top veneer was scraped off. When gluing is satisfactory, the surface that appears after scraping with the knife must still be covered with fibers. When it is completely covered with fibers grading is 10 (excellent). As more clean spots appear and less fibers, grading is diminished. A grading of 8 is still satisfactory, and it means that the surface is mainly covered with fibers with only a few clean spots appearing. Lower grading is unsatisfactory. Example 5 Two samples were prepared according to the following formulations: Sample No. 1 2 parts by weight Formaldehyde (100%) 100 140 Urea (100%) 140 190 Melamine (100%) 100 110 Molasses (100%) - 110 Ammonium lignosulfonate (100%) 150 - Water 510 450 Total 1000 1000 The above mentioned samples were prepared by plain mixing at 25 to 30°C until the solids were completely dissolved. The pH of the final products was adjusted to 8.5 to 10.0. Glue formulations were then prepared as follows: These glue formulations were used separately to spray a constant quantity of dried wood chips with 12% dry glue/dry wood. The sprayed wood chips were then formed into a mat having a normal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions: Press temperature 200°C Press time 10 sec/mm Pressure 35 kp/cm² Boards were then tested and the results are reported in the following table. Glue formulation No. 0 1 2 Density (kg/m³) 686 687 685 Thickness (mm) 15.9 15.7 15.7 Internal bond (kg/cm²) 6.6 6.5 6.4 2 hrs thickness swelling (%) 3.2 3.2 2.9 24 hrs thickness swelling (%) 9.2 9.0 8.5 V-100 (kg/cm²) 1.6 1.5 1.6 The V-100 test is carried out as follows: The samples to be tested are placed in water at 20 ± 5°C. This water is warmed up in 1 to 2 hours to 100°C. The water temperature is kept at 100°C for 2 hours. It is important that there is a space of at least 15 mm on all sides of every sample so as to make sure that water is freely introduced in the samples. The samples are then introduced for at least 1 hour in a refrigerator at 2 ± 5°C. Water is then allowed to drip and the wet samples are tested again for internal bond. Example 6 The following example will illustrate the fact that products according to our present invention may be produced by means of a variety of raw materials. Samples were prepared according to the following formulations: Sample No. 1 2 3 parts by weight Paraformaldehyde 350 - - Precondensate 80% - 50 - Acetaldehyde 100 % - - 130 Urea 100% 150 12 200 Sucrose 100% 50 100 - Molasses 100% 50 150 - Ammonium lignosulfate 100% - 230 210 Dextrin 100% - 40 - Water 400 418 460 The above mentioned samples were prepared by plain mixing until the solids were completely dissolved. The pH of the final products was adjusted to 7.5 to 8.0. Glue formulations were then prepared as follows: Glue formulation No. 0 1 2 3 parts by weight Urea formaldehyde resin (65% solids) 108.9 93 93 93 Water 13.8 13.8 13.8 13.8 Sample 1 - 15.9 - - Sample 2 - - 15.9 - Sample 3 - - - 15.9 Ammonium chloride (20%) 7.1 7.1 7.1 7.1 These glue formulations were used separately to spray a constant quantity of dried of wood chips. The sprayed wood chips were then formed into a mat having a normal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions: Press temperature 200°C Press time 9 sec/mm Pressure 33 kp/cm² Boards were then tested and the results are reported in the following table: Glue formulation No. 0 1 2 3 Density (kg/m³) 600 610 590 580 Thickness (mm) 15.8 15.9 15.7 15.6 Internal bond (kg/cm²) 6.8 6.9 7.1 6.5 2 hrs thickness swelling (%) 10.5 10.3 10.1 9.9 24 hrs thickness swelling (%) 20.1 19.5 19.9 20.3 Free formaldehyde 22.3 18.0 16.2 17.1 Moisture content (%) 5.7 5.3 5.5 5.6 Boards obtained with all glue formulations are equivalent. Example 7 In this example four samples were prepared according to the following formulations: Sample No. 1 2 3 4 parts by weight Formaldehyde 100 100 100 100 Resorcinol - 50 - - Thiourea 50 - - - Urea 140 150 70 70 Benzoguanamine - - 80 - Dicyandiamide - - - 80 Wheat starch - 50 - - Dextrose - - - 50 Glucose - 50 - - Fructose - - 50 - Modified starch 50 - - - Corn syrup 60 - - - Molasses - - 50 100 Black liquor - 100 - - Sodium lignosulfonate 100 - 150 100 Water 500 500 500 500 Total 1000 1000 1000 1000 The above mentioned samples were prepared by plain mixing at 40 to 50°C until the solids were completely dissolved. The pH of the final products was adjusted to 8.5 to 10.0. Glue formulations were then prepared as follows: Glue formulation No. 0 1 2 3 4 parts by weight Urea formaldehyde resin (65%) 108.9 87.1 87.1 87.1 87.1 Water 13.8 13.8 13.8 13.8 13.8 Sample 1 - 21.8 - - - Sample 2 - - 21.8 - - Sample 3 - - - 21.8 - Sample 4 - - - - 21.8 Ammonium chloride (20%) 7.1 7.1 7.1 7.1 7.1 These glue formulations were used separately to spray a constant quantity of dried wood chips. The sprayed wood chips were then formed into a mat having a nominal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed at the following conditions: Press temperature 200°C Press time 9 sec/mm Pressure 33 kp/cm² Boards were then tested and the results are reported in the following table: Glue formulation No. 0 1 2 3 4 Density (kg/m³) 625 617 633 631 628 Thickness (mm) 15.9 15.8 16.0 16.2 16.0 Internal bond (kg/cm²) 7.0 6.9 7.1 7.2 6.8 2 hrs thickn. swelling % 12.5 12.1 13.6 13.1 12.6 24 hrs thickn. swelling % 22.5 20.7 24.7 24.0 20.9 Free formaldehyde (mg/100 g dry board) 28.8 22.5 21.7 23.0 21.9 Moisture content % 6.1 5.7 5.9 5.9 6.2 It can be noticed from the above mentioned table that samples 1 to 4 including the substitute according to the present invention give boards equivalent to the blank, sample 0, while giving a significant free formaldehyde reduction and resin saving. Example 8 Three samples were prepared according to the following formulations: Sample No. 1 2 3 parts by weight Formaldehyde 100% 135 135 135 Urea 100% 365 365 365 Sucrose 100% 10 - - Molasses 100% - 10 - Calcium lignosulfonate (100%) - - 10 Water 490 490 490 Total 1000 1000 1000 The above mentioned samples were prepared by plain mixing at 25 to 30°C until the solids were completely dissolved. The pH of the final products was adjusted to 8.5 to 10.0. Glue formulations were then prepared as follows: Glue formulation No. 0 1 2 3 parts by weight Urea formaldehyde resin (65% solids) 108.9 95.9 95.9 95.9 Water 13.8 13.8 13.8 13.8 Sample 1 - 13 - - Sample 2 - - 13 - Sample 3 - - - 13 Ammonium chloride (20% solution in water) 7.1 7.1 7.1 7.1 These glue formulations were used separately to spray a constant quantity of dried wood chips. The sprayed wood chips were then formed into a mat having a nominal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions: Press temperature 200°C Press time 8 sec/mm Pressure 35 kp/cm² Boards were then tested and the results are reported in the following table: Glue formulation No. 0 1 2 3 Density (kg/m³) 575 582 579 601 Thickness (mm) 15.4 15.3 15.5 15.4 Internal Bond (kg/cm²) 8.3 8.7 8.9 9.5 2 hrs thickness swelling (%) 10.3 10.8 10.6 11.1 24 hrs thickness swelling (%) 20.2 21.3 20.9 21.9 Free formaldehyde (mg/100 g dry board) 60.5 39.8 41.3 38.1 Moisture content (%) 6.0 7.1 6.8 6.5 Boards obtained with all glue formulations are equivalent. Those however that include the substitute according to the present invention have lower free formaldehyde. Example 9 Three samples were prepared according to the following formulations: Sample No. 1 2 3 parts by weight Formaldehyde 100% 85 85 85 Urea 100% 400 400 400 Sucrose 100% 32.3 - - Molasses 100% - 32.3 - Calcium lignosulfonate (100%) - - 32.3 Water 482.7 482.7 482.7 Total 1000 1000 1000 The above mentioned samples were prepared by plain mixing at 25 to 30°C until the solids were completely dissolved. The pH of the final products was adjusted to 8.5 to 10.0. Glue formulations were then prepared as follows: Glue formulation No. 0 1 2 3 parts by weight Urea formaldehyde resin (65% solids) 108.9 81.7 81.7 81.7 Water 13.8 13.8 13.8 13.8 Sample 1 - 27.2 - - Sample 2 - - 27.2 - Sample 3 - - - 27.2 Ammonium chloride (20% solution in water) 7.1 7.1 7.1 7.1 These glue formulations were used separately to spray a constant quantity of dried wood chips. The sprayed wood chips were then formed into a mat having a nominal thickness of 16 mm. These mats were then introduced into a hot press and boards were pressed under the following conditions: Press temperature 200°C Press time 8 sec/mm Pressure 35 kp/cm² Boards were then tested and the results are reported in the following table: Glue formulation No. 0 1 2 3 Density (kg/m³) 610 590 597 615 Thickness (mm) 15.9 15.7 15.6 15.9 Internal bond (kg/cm²) 7.9 8.1 8.3 8.4 2 hrs. thickness swelling (%) 9.8 10.2 10.5 10.9 24 hrs. thickness swelling (%) 20.1 21.3 20.9 21.8 Free formaldehyde (mg/100 g dry board) 40.1 15.3 17.1 16.3 Moisture content (%) 7.9 7.1 7.6 8.0 Boards obtained with all glue formulations are equivalent. Those however prepared according to the process of the present invention have a very big formaldehyde reduction and resin cost saving.

Claims: A process for bonding water penetrable cellulosic particles by polycondensation of amino or phenolic resins based on formaldehyde, characterized in that a part of such resins is replaced by a substitute consisting of an aqueous solution having a pH of 6 to 14 of a) at least one aldehyde together with at least one amide and/or together with at least one phenol, and b) a sugar or a sugar derivate or molasses or a starch or its degradation products or a mixture thereof, and/or c) a raw and/or treated lignosulfonate, the weight ratio of a) to b) and/or c) being 1.0 to 15.0:1. A process according to claim 1, characterized in that the substitute contains 40 to 52% by weight of water. A process according to claim 1 or 2, characterized in that the aldehyde is formaldehyde or acetaldehyde. A process according to one of claims 1 to 3, characterized in that the amide is urea, thiourea, melamine, benzoguanamine or dicyandiamide. A process according to one of claims 1 to 4, characterized in that the phenol is phenol itself or resorcinol. A process according to one of claims 1 to 5, characterized in that component b) is dextrose, glucose, fructose, sucrose, corn syrup, wheat starch, modified starch or dextrin glue. A process according to one of claims 1 to 6, characterized in that component c) is ammonium, sodium or calcium lignosulfonate or black liquor.

Inventors: MARKESSINI VERGOPOULOU EFTHALI, MARKESSINI, VERGOPOULOU EFTHALIA
Applicants: ENIGMA NV, ENIGMA N.V.
Application year: 1987
Main classification: C08G16
IPC codes: C08L61, C08L5, C08L97, C09K15, C08G12, C08L3, C08G14