A method for fabricating a semiconductor device comprising simultaneous growing of epitaxial and polycristalline Si layers over a selectively oxydized Si substrate, by vapor deposition

Abstract: An epitaxial silicon layer (4) is formed on a surface of a silicon substrate (1) simultaneously with the forming of a polycrystalline silicon layer (5) on a silicon dioxide (SiO₂) layer (3), previously formed on the silicon substrate (1) using a low pressure silicon vapor deposition method, employing a silicon hydride gas, particularly disilane (Si₂H₆), as a silicon source gas. The crystal growing temperature is comprised between 780°C to 950°C and a reaction gas pressure ranging from 30 torrs to 300 torrs is preferred. An extended silicon epitaxial region (a) is achieved under a higher temperature and a higher gas pressure, and with a substrate (1) of (1 0 0) orientation. A polysilicon layer (5) having an even surface and joining smoothly to the epitaxial silicon layer (4) which is simultaneously formed, is obtained under a lower temperature and a lower gas pressure, and with a substrate (1) of a (1 1 1) orientation.

Description: The present invention relates to a fabrication method of a semiconductor device having a high speed performance. Particularly, it relates to a method including a vapor deposition step for simultaneously forming an epitaxial silicon (Si) layer and a polycrystalline silicon layer over a silicon substrate which is partially covered with a silicon dioxide (SiO₂) layer. In recent LSI technology, reduction of parasitic capacitance of semiconductur devices has been an important factor to obtain a high speed performance of the semiconductor devices. In a metal-oxide-semiconductor (MOS) field effect transistor (FET), for example, a structure with an elevated source-drain region is adopted. In a bipolar IC, an elevated base contact region made of polycrystalline silicon (hereinafter, referred to as 'polysilicon') is used in order to reduce the capacitance of a base region. A semiconductor device including the above-described MOS FET and bipolar transistor, such as a complementary MOS FET, is also fabricated. Fig. 1 is a cross-sectional view schematically illustrating a structure of an MOS FET having elevated source-drain regions. In Fig. 1, 51 designates a p⁻-type silicon substrate, for example, 52 designates a field oxide insulating layer, 53 designates a p-type channel region, 54 designates a gate insulating layer, 55 designates a gate electrode, 56 designates an n⁺-type source region, 57 designates an n⁺-type elevated source region, 58 designates an n⁺-type drain region, 59 designates an n⁺-type elevated drain region, ES designates an epitaxial silicon layer, and PS designates a polysilicon layer. In the following figures, like reference numerals and letters designate like parts throughout all the specification. Fig. 2 is a cross-sectional view schematically illustrating a bipolar IC having an elevated base contact region. In Fig. 2, 51a designates a p⁻-type silicon substrate, 60 designates an n⁺-type buried layer, 61 designates an n⁻-type collector region, 62 designates a p-type base region, 63 designates a p-type elevated base contact region, 64 designates an insulating layer, and 65 designates an n⁺-type emitter region. In the above semiconductor devices, the channel region 53, the source region 56, the drain region 58, and the base region 62 are formed in the epitaxial silicon layer ES, and the elevated source region 57, the elevated drain region 59, and the elevated base contact region 63, are formed on the polysilicon layer PS which is formed over the field oxide insulating layer 52. During the fabrication step, it is desirable that both of the epitaxial silicon layer ES and the polysilicon layer PS are simultaneously grown, respectively on the silicon substrate 51 or 51a and on the field oxide insulating layer 52. Fig. 3 is a cross-sectional view of a semiconductor device in the fabrication stage, illustrating a substantiallly schematic structure thereof. A polysilicon layer 5 is formed on a field oxide insulating layer 3 of silicon dioxide (SiO₂) which is disposed on the silicon substrate 1, and an epitaxial silicon layer 4 having a top surface 6 is formed over an exposed surface 2 of the silicon substrate 1. In accordance with a known fabrication method, the silicon substrate 1 is activated prior to the simultaneous growing of the epitaxial silicon layer 4 and the polysilicon layer 5 over the silicon substrate by vapor deposition, in order to form stable epitaxial silicon layer 4 and polysilicon layer 5. The activation process is carried out, for example, by bombarding the surface of the substrate with argon ions. The activation is considered to create silicon nuclei in a uniform distribution over the surfaces of the field oxide insulating layer 3 and the exposed silicon substrate 1. The epitaxial silicon layer 4 and the polysilicon layer 5 are formed simultaneously by vapor deposition under normal pressure, using a silicon source gas, such as silicon hydride (silane) gas, and a carrier gas such as hydrogen gas. The vapor deposition condition may be as follows : normal gas pressure (100 kPa ; 760 torrs), crystal growth temperature ranging from 950° to 1050°C, silicon sourse gas consisting in monosilane (SiH₄), the carrier gas consisting in hydrogen (H₂). The above-described prior art technology shows some disadvantages. Fig. 4 is a cross-sectional view, partially illustrating the epitaxial silicon layer ES and the polysilicon layer PS formed,respectively, on the silicon substrate 51 and the field oxide insulating layer 52, in a silicon vapor deposition step. The boundary surface (transition surface) between the epitaxial silicon layer ES and the polysilicon layer PS may show a discontinuous portion having a sharp V shaped groove or crevasse C₁, and the polysilicon layer PS formed on the field oxide insulating layer 52 tends to have a substantially rough surface containing a number of granular peaks and deep dimples C₂. Such uneven surface of the polysilicon layer PS causes unstable electrical connection to other circuit elements formed on the substrate, and the associated source region, drain region, or base region, degrading the performance of the device and reducing the fabrication yield of the device. In another prior art vapor deposition technology, in order to reduce the unevenness of the surface of the grown polysilicon layer, the surface of a silicon dioxide (SiO₂) layer to be subjected to silicon vapor deposition, is covered previously by a silicon nitride (Si₃N₄) film, whereby the above-described surface activation of the substrate by argon ion bombardment is unnecessary. The silicon source gas employed is silane (SiH₄) gas. The gas pressure is normal, and the crystal growth temperature is rather high, ranging from 1100°C to 1150°C. The result is favorable. However, this vapor deposition method requires complicated fabrication steps, increasing the fabrication cost, and causing various problems due to the high temperature treatment. Furthermore, shrinkage of the epitaxial silicon layer occurs. As shown in Fig. 3, the top surface 6 of the epitaxial silicon layer 4 is shrinked as compared with the bottom surface 2, namely, the originally exposed silicon surface on the silicon substrate 1. As a result, the available active area for a semiconductor device to be formed is reduced, resulting in degrading the integration density of the device, and requiring an undesirable high accuracy of mask alignment in the subsequent fabrication steps. This phenomenon is considered to be caused by a lower growth rate of the epitaxial silicon layer compared to that of the polysilicon layer. Before proceeding further, the problem of crystal growth temperature in a silicon vapor deposition process will be discussed. In general, when carrying out a silicon vapor deposition process for fabricating a semiconductor device, it is desirable to keep the crystal growth temperature as low as possible, because high crystal growth temperature causes various problems. For example, in the device shown in Fig. 3, auto-doping of the relevant epitaxial silicon layer 4 is caused at a high crystal growth temperature which accelerates diffusion of dopants contained in the silicon substrate 1 into the epitaxial silicon layer 4, altering the dopant density of the epitaxial silicon layer 4. Consequently, the device may show undesirable resulting electrical characteristics, reducing the fabrication yield of the device. Meanwhile, in the above-described case where a field oxide insulating layer is formed on a silicon substrate in an earlier stage of the fabrication process of the semiconductor device, thermal stresses generated in a marginal zone along the interface between the field oxide insulating layer 3 and the silicon substrate 1, may cause some crystal defects. Subsequent high temperature treatments may increase the thermal stresses substantially, further extending the crystal defects in the marginal zone, and thus degrading the quality of the device. From this point of view, reduction of the crystal growth temperature appears to be key point of the silicon vapor deposition process. It is well known that a low pressure vapor deposition technique is effective to decrease the crystal growth temperature of the silicon vapor deposition for forming an epitaxial silicon layer on a silicon substrate. In IEEE Transaction On Electronic Devices, Vol. Ed. 29, No. 4, April 1982, pages 491 to 497, E. Krullmann et al reported that, in a silicon vapor deposition process, the crystal growth temperature could be lowered by approximately 100°C to 150°C by reducing the deposition gas pressure from 100 kPa (760 torrs) to 5.3 kPa (40 torrs), monosilane (SiH₄) and dichlorosilane (SiH₂Cl₂) being employed as silicon source gas. In Japanese Laid Open Patent Application, No. 159421/1987, one of the inventors of the present invention and others proposed a vapor deposition method for forming an epitaxial silicon layer over a silicon substrate, utilizing a silicon dioxide (SiO₂) layer as a mask, by using disilane (Si₂H₆) gas as silicon source gas. A low crystal growth temperature of 700° is obtained under a gas pressure of .4 kPa (3 torrs). Further, one of the inventors of the present invention and others reported a low pressure vapor phase silicon epitaxy, using disilane (Si₂H₆), in Extended Abstracts of the 18th International Conference on Solid State Devices and Materials, Tokyo, 1986, on pages 49-52. The dissociation energy of the disilane (Si₂H₆) is smaller than that of monosilane (SiH₄) gas conventionally used in a silicon vapor deposition. It is considered that the low dissociation energy of the disilane (Si₂H₆) serves to provide the dissociated silicon atoms with sufficient energy to migrate over the deposited surface freely. This explains why the disilane (Si₂H₆) gas enables the silicon epitaxial growth under a low crystal growth temperature. However, a vapor deposition method for simultaneously forming the epitaxial silicon layer and the polysilicon layer at a low crystal growth temperature has not been yet realized. In an article by S.M. Fischer et al. (Solid State Technology 29, No. 1, pp 107-112), there is disclosed a method for selective silicon-on-silicon epitaxy with uniform polycrystalline silicon on oxide over-growth. The method uses monosilane (SiH₄) gas, and crystal growth temperature is still as high as 975°C. An object of the present invention is to provide a method for fabricating a semiconductor device comprising a step of simultaneously forming an epitaxial silicon layer over a surface of a silicon substrate, and a polysilicon layer over a surface of a silicon dioxide (SiO₂) layer formed on the silicon substrate by a vapor deposition process. Another object of the present invention is to provide such a method for obtaining on the above-described silicon substrate, an epitaxial silicon layer and a polysilicon layer, both layers being continuously connected to each other, and the polysilicon layer having a favorably even surface, suitable for assuring electrical conductivity of the polysilicon layer, and for forming stacking elements over the polysilicon layer. Still another object of the present invention is to provide such a method for obtaining, on the above described silicon substrate, an epitaxial silicon layer having an extended top surface with a larger area than that of the bottom surface thereof, serving to provide high integration density. A further object of the present invention is to provide a method allowing the silicon vapor deposition process to be performed under a low crystal growth temperature, in order to reduce defects caused by a high temperature treatment. A still further object of the present invention is to provide a simple and inexpensive method for simultaneously forming an epitaxial silicon layer and a polysilicon layer to reduce the fabrication cost of the semiconductor device. According to the invention, the method of fabricating a semiconductor device, comprises the steps of (a) forming a silicon dioxide (SiO₂) layer on a portion of a surface of a silicon (Si) substrate, and (b) simultaneously forming an epitaxial silicon layer (ES) on another portion of said surface of the silicon substrate and a poly-crystalline silicon layer (PS) on said silicon dioxide layer, both layers being continuously connected to each other, by a low pressure vapor deposition process utilizing a silicon hydride gas, is characterized in that said silicon substrate has a major surface of (111) orientation, whereby a polycrystalline silicon layer (PS) having a smooth surface is formed through said vapor deposition process, which is carried out at a substrate temperature comprised between 780°C and 950°C, utilizing disilane (Si₂H₆) gas as silicon hydride gas under a gas pressure comprised between 4 kPa (30 torrs) and 40 kPa (300 torrs). The relevant vapor deposition conditions are selected depending on the desired feature of the grown layer. For obtaining an epitaxial silicon layer and a polysilicon layer which are smoothly connected, and for providing the polysilicon layer with a substantially even top surface, a low gas pressure ranging from 4kPa (30 torrs) to around 13 kPa (100 torrs) and a low crystal growth temperature ranging from 780° to around 850°C, are preferred. In order to obtain an epitaxial silicon layer having a top surface area larger than that of the bottom surface area, a gas pressure ranging from 4 kPa (30 torrs) to 40 kPa (300 torrs), and a crystal growth temperature ranging from 780°C to 950°C, are preferred. In the method according to the present invention, under the above described vapor deposition conditions, a (111) oriented silicon substrate permits to obtain an even top surface of the grown layer. These together with other objects, features and advantages of the present invention will be more apparent from the reading of the following description made with reference to the accompanying drawings wherein : Fig. 1 is a cross-sectional view illustrating a structure of a MOS FET having elevated source-drain regions ; Fig. 2 is a cross-sectional view illustrating a bipolar IC having an elevated base contact region ; Fig. 3 is a cross-sectional view of a semiconductor device in a prior art silicon vapor deposition stage ; Fig. 4 is a partial cross-sectional view of a polysilicon layer formed using a prior art method, schematically illustrating structural defects thereof ; Fig. 5(a) to (e) are cross-sectional views illustrating the structure of a MOS FET such as the one of Fig. 1 at different successive steps of a fabrication process; Fig. 6 is a diagram illustrating a vapor deposition apparatus used in carrying out the invention ; Fig. 7 is a time diagram of the temperature of the wafer during the vapor deposition step of the above process; Fig. 8 is a time diagram of the gas pressure inside the relevant reaction chamber in the vapor deposition step; Fig. 9 is a schematic cross-sectional view, illustrating the structure of a substrate being subject to the silicon vapor deposition in another fabrication process; Fig. 10 is a schematic cross-sectional view, illustrating the structure of a substrate being subject to a silicon vapor deposition step in an embodiment of the method according to the invention ; Fig. 11 shows diagrams illustrating the relationship between the crystal growth temperature and the lateral extension length of the grown epitaxial silicon layer under a reaction gas pressure of 8 kPa (60 torrs); Fig. 12 shows a diagram illustrating the relationship between the reaction gas pressure and the depth of dimples formed on a polysilicon layer under a crystal growth temperature of 940°C; and Fig. 13 shows diagrams illustrating the relationship between the reaction gas pressure and the lateral extension length of an epitaxial silicon layer of the grown epitaxial silicon layer under a crystal growth temperature of 940°C. An embodiment of a vapor deposition apparatus used in carrying out the present invention is schematically illustrated in Fig. 6. A reaction chamber 32 comprises a bell jar 30, being vacuum tightly mounted on a metallic base plate 31. The inner diameter of the bell jar is 30 cm and the height is 60 cm. A wafer 34 to be processed is placed on a susceptor (not shown) mounted on a graphite heater 33 which is controllably powered from an electrical power source 43 through wirings 42 to heat the wafer 34. Reaction gas mixture for vapor deposition is introduced into the reaction chamber 32 through a supplying pipe 35, and showered onto the wafer 34 through a perforated head 44. Nitrogen (N₂) gas, hydrogen (H₂) gas, disilane (Si₂H₆) gas, and dopant gas, such as phosphine (PH₃) gas for n-type doping, or diborane (B₂H₆) gas for p-type doping, are respectively supplied from respective gas bottles (not shown), and the supply and the flow rate of each gas are respectively controlled through valves 27, 28, 29 and 25, and mass-flow meters 36, 37, 38 and 26. These gas valves and mass-flow meters are arranged in parallel as represented in Fig. 6. The reaction chamber 32 is evacuated through several pores 39 opened in the base plate 31 by operating a conventional evacuating system connected thereto. The gas pressure inside the reaction chamber 32 is controlled by the evacuation system comprising a mechanical booster pump 40, a rotary pump 41, a vacuum gauge 45, a leak valve 46, and a main vacuum valve 47, arranged as shown in Fig. 6. A process for growing the epitaxial silicon and polysilicon layers at a low crystal growth temperature will now be explained with reference to Figs. 5(a) to 5(e). This process will be described with respect to a MOS FET having elevated source-drain regions, as shown in Fig. 1. However, it will be understood by those skilled in the art that the methods described in the following are applicable to other semiconductor devices, such as the bipolar transistor of Fig. 2 and a combined semiconductor device including MOS FETs and bipolar transistors, like a complementary MOS FET (CMOS FET) device. A field oxide insulating layer 3 of silicon dioxide (SiO₂) is formed on a silicon substrate 1 of (100) orientation in this example, employing a selective oxidation (LOCOS) method. The layer 3 may be formed also by utilizing a conventional lithographic technology instead of the LOCOS method. The field oxide insulating layer 3 defines an active area DA for disposing the FET, as shown in Fig. 5(a). Prior to the formation of the field oxide insulating layer 3, dopant ions, such as boron (B) ions, are implanted into the area of the silicon substrate 1 where the field oxide insulating layer 3 is to be formed. The implanted dopants are thermally diffused during the forming process of the field oxide insulating layer 3, forming a p-type channel stopper 23. As well known, in a mass-production system of semiconductor devices, a number of devices such as MOS FETs are formed on a silicon wafer 34 (see Fig. 6). The substrate of Fig. 5(a), i.e. the wafer 34, is dipped in chemical mixed solution containing water (H₂O), ammonium hydroxide (NH₄OH) ,and hydrogen peroxide (H₂O₂) for ten minutes. Thereafter, the substrate is rinsed in pure water for five minutes and dried. The substrate may be further cleaned chemically by dipping it in nitric acid (HNO₃) for ten minutes. This removes the native silicon oxide thin film or other undesirable materials, formed on the surface of the substrate 1. Immediately after the chemical processing, the substrate, namely the wafer 34, is loaded within the reaction chamber 32 of the vapor deposition system illustrated in Fig. 6 for preheating followed by a silicon vapor deposition process. Referring to Fig. 5(b), Fig. 7 and 8, the preheating process and the vapor deposition process are now described. It is desirable to start both processes following the above-described chemical cleaning treatment within a short time of exposure of the wafer 34 to the environmental atmosphere, particulary at a low crystal growth temperature such as 780°C. Otherwise, the surface of the wafer 34 may be contaminated by absorption of undesirable gas molecules and formation of native silicon dioxide (SiO₂). Fig. 7 and Fig. 8 are time diagrams illustrating respectively the temperature of the wafer 34 under treatment and the gas pressure inside the reaction chamber 32 at each sub-step. The chemically cleaned wafer 34 is loaded in the reaction chamber 32 filled with nitrogen (N₂) gas under normal pressure (100 kPa; 760 torrs). Then the nitrogen (N₂) gas is evacuated by closing the valve 27, and hydrogen (H₂) gas is introduced into the chamber 32 by opening the valve 28. The gas pressure is maintained at 13 kPa (100 torrs), while the graphite heater 33 is powered to raise the temperature of the wafer 34 and maintain it at 950°C for about 10 minutes for desorption of undesirable gas molecules absorbed on the surface of the wafer 34. Thereafter, the graphite heater 33 is turned down, decreasing the wafer temperature down to 780°C, while the hydrogen (H₂) gas is kept flowing for several minutes for the desorption of undesirable gas absorbed on the wafer 34. Thus the preheating process is completed. The above-described chemical treatment immediately followed by the preheating process, eliminates the need of the above described argon ion bombardment or coverage with a silicon nitride (Si₃N₄) film over the surface of the wafer. Subsequently, disilane (Si₂H₆) gas and diborane (B₂H₆) gas under respective specified flow rates are supplied to the supplying pipe 35 by opening the relevant valves 28 and 29. The flow rate of each gas is controlled using the associated mass-flow meters 37 and 38, and the gases are mixed with the hydrogen (H₂) gas, creating a reaction gas mixture. The reaction gas pressure is controlled to 8.7 kPa (65 torrs) by adjusting the evacuating system. The reaction gas is showered onto the wafer 34 through the perforated head 44. Thus, the silicon vapor deposition is implemented over the substrate at 780°C for 20 minutes. Thereby, a polysilicon layer PS and epitaxial silicon layer ES of p⁻-type are simultaneously formed over the field insulating layer 3 of silicon dioxide (SiO₂), and the exposed surface of the silicon substrate 1, respectively. Then the reaction gas is exchanged with hydrogen (H₂) gas, and the graphite heater 33 is turned off, decreasing the temperature of the substrate to the room temperature. Next, the hydrogen (H₂) gas is exchanged with nitrogen (N₂) gas under the normal pressure, and the wafer 34 is unloaded from the reaction chamber 32. The vapor deposition conditions of the above-described process are a crystal growth temperature of 780°C and a reaction gas pressure of 8.7 kPa (65 torrs). As will be described later, a reaction gas pressure ranging from 4 kPa (30 torrs) to 40 kPa (300 torrs) and a crystal growth temperature ranging from 780°C to 950°C are desirable for simultaneous deposition of the epitaxial layer and the polysilicon layer. The resulting epitaxial silicon layer ES and polysilicon layer PS are adjoined closely to each other, and the surface of the marginal region along the interface between the polysilicon layer PS and the epitaxial silicon layer ES is favorably even. Further, the surface of the polysilicon layer PS is also favorably smooth. In addition, the low crystal growth temperature eliminates various crystal defects particularly generated in the marginal region along the interface. Fig. 5(c) illustrates the structure of the MOS FET in the next step. A gate insulating film 24 of silicon dioxide (SiO₂) having a thickness of 3.10⁻⁸m is formed over the entire surface of the substrate, being followed by the formation of a polysilicon layer 105 having a thickness of 4.10⁻⁷m,employing a conventional chemical vapor deposition , (CVD) technology over the gate insulating film 24. Then, the polysilicon layer 105 is doped to have high electrical conductivity, being patterned using a lithographic technology to form a gate electrode 15 as shown in Fig. 5(d). Next, the substrate is exposed to a bombardment of arsenic (As) ions of high density utilizing the gate electrode 15 as a mask. The arsenic (As) ions are implanted into the epitaxial silicon layer ES and the polysilicon layer PS through the gate insulating film 24, and thermally diffused therein, converting the epitaxial silicon layer ES and the polysilicon layer PS to an n⁺-type layer. Thereafter, both layers are patterned using a conventional lithographic technology. Thus, an n⁺-type source region 16, an n⁺-type drain region 17, and a p⁻-type channel region 8 are formed in the epitaxial silicon layer ES, and an n⁺-type elevated source region 9 of polysilicon and an n⁺-type elevated drain region 10 of polysilicon are formed in the polysilicon layer PS as shown in Fig. 5(d). Stable electrical connections between the source region 16 and the elevated source region 9, and between the drain region 17 and the elevated drain region 10, are obtained. Next, in a conventional manner, the exposed gate insulating film 24 of silicon dioxide (SiO₂) is removed using a lithographic technology, and a blocking layer 11 of silicon dioxide (SiO₂) is selectively formed over the surface except for the exposed surface of the field insulating layer 3. Then over the entire surface of the substrate, a phospho-silicate-glass (PSG) layer 12 is formed by a conventional CVD method, in which contact windows are opened over the elevated source region 9 and the elevated drain region 10 such that surfaces of the regions 9 and 10 are exposed at the bottom of the windows. Thereafter, an aluminum source wiring 13 and an aluminum drain wiring 14 are formed on the PSG layer 12, contacting respectively the exposed source region 9 and drain region 10 through the windows. Finally, a passivation layer (not shown) is formed over the entire surface of the substrate to complete an MOS FET having an elevated source-drain region as shown in Fig. 5(e) According to another process, a simultaneous forming of a silicon layer ES and a polysilicon layer PS at a high crystal growth temperature of 940°C is described. In this process, all the conditions for the silicon vapor deposition, except for the crystal growth temperature, are the same as in the previous process. The vapor deposition is performed at 940°C. Fig. 9 is a substantially schematic view of a substrate being subject to a silicon vapor deposition under the above condition. An epitaxial silicon layer 4 of 6.10⁻⁷m thickness, is grown on the silicon substrate 1, and a stable polysilicon layer 5 of 6.10⁻⁷m thickness, is formed on the field insulating layer 3. The depth of dimples formed on the surface 5a of the polysilicon layer 5, and the depth of a crevasse between the epitaxial layer 4 and the polysilicon layer 5, are small, i.e. below about 15.10⁻⁸m. The surface 6 of the epitaxial silicon layer 4 is substantially smooth. The epitaxial silicon layer 4 is laterally extended as shown in Fig. 9, the area of the top surface 6 being larger than that of the bottom surface 2. Under the above-described vapor deposition condition, the lateral extension length a of the top surface 6 reaches approximately 4.10⁻⁷m. Generally, the increase in crystal growth temperature of silicon vapor deposition, causes the silicon crystal growth rate to raise, thus enhancing the lateral extension of the grown epitaxial silicon layer. However, at a high crystal growth temperature, as already described above and schematically represented in Fig. 4, the surface of the grown polysilicon layer is roughened, and the depth of the dimples increases. A crystal growth temperature exceeding 950°C, therefore, is not practical. In an embodiment of the present invention, the simultaneous deposition of the epitaxial silicon layer and of the polysilicon layer is performed using a (1 1 1) oriented silicon substrate. All the conditions except substrate orientation are the same as those of the another process described above. An epitaxial silicon layer 4 of 0.5 µm thickness is formed on an exposed silicon surface 2 of the silicon substrate 1, simultaneously with the formation of a polysilicon layer 5 of 0.4 µm thickness on the field oxide layer 3, as shown in Fig. 10. The surface 5a of the polysilicon layer 5 is fairly smooth having a depth of dimples below 15.10⁻⁸m. In addition, the crevasse in the interface between the epitaxial silicon layer 4 and polysilicon layer 5 almost disappears. When a semiconductor device having a multi-layered structure is formed, a silicon substrate having (1 1 1) orientation is then preferably used. On the other hand, the lateral extension of the epitaxial silicon layer 4 is rather small, almost zero. An experiment was performed to examine the influence of the crystal growth temperature and the substrate orientation on the lateral extension of a grown epitaxial silicon layer. The silicon vapor deposition experiments were performed using (1 0 0) oriented and (1 1 1) oriented silicon substrates under a constant gas pressure of 8 kPa (60 torrs), and at three crystal growth temperatures, 800°C, 900°C, and 940°C. The results are represented in Fig. 11. As shown by diagrams A and B,respectively indicated as (100) and (111) in Fig. 11, corresponding to the orientation of the silicon substrate, the lateral extension length a increases with the crystal growth temperature. However, the curve A, corresponding to (1 0 0) orientation, has a knee point at around 850°C. At a lower temperature, almost a constant extension length is provided, however, at a higher temperature exceeding approximately 850°C, the extension length increases with the temperature. With respect to a silicon substrate having (1 1 1) orientation, the lateral length has a minus value below around 930°C as shown by the diagram B. It is obvious that a silicon substrate oriented (1 0 0) is more suitable when high integration density is required for the relevant MOS FET device. There will now be described an experiment which was implemented by varying reaction gas pressure under a fixed crystal growth temperature of 940°C. The relationship between the gas pressure and the depth of the dimples formed in a vapor deposited polysilicon layer, such as shown in Fig. 4, and the relation between the gas pressure and the lateral extension of the epitaxial silicon layer, were observed. The roughness of the polysilicon layer having a thickness of 10⁻⁶m, was measured with a roughness-meter, a product of Tencor Co., branded as 'Alpha-Step', employing a tracer method. The result is illustrated by the diagram of Fig. 12. When the gas pressure increases, the depth of the dimples also increases. The depth is favorably small below 2.10⁻⁷m, under a gas pressure lower than about 13 kPa (100 torrs). When the gas pressure exceeds 40 kPa (300 torrs), the depth of the dimples exceeds 6.10⁻⁷m. With a high gas pressure, dissociated silicon atoms appear to coagulate to a few silicon nuclei, resulting in a rough surface of the polysilicon layer. The real depth of the dimple, or of the crevasse, between polysilicon granules, seems to be larger than the measured value, because the point of a tracing needle may not be able to reach the bottom of the crevasse. It is therefore preferable not to exceed a gas pressure of 40 kPa (300 torrs). On the other hand, a gas pressure lower than 4 kPa (30 torrs) is not convenient to obtain a stable and smooth polysilicon layer, because the silicon crystal growth is inactive and island-like deposited silicon granules are dispersed over the surface of the silicon dioxide (SiO₂) layer. A gas pressure ranging from 4 kPa (30 torrs) to 40 kPa (300 torrs), therefore is then preferred to obtain a stable polysilicon layer. More particularly, when a multi-layered structure is adopted in the semiconductor device to be fabricated, a lower gas pressure, ranging from 4 kPa (30 torrs) to around 13 kPa (100 torrs), is suitable, because the polysilicon layer is grown with a smooth surface. On the other hand, when high integration density is required, then a relatively higher gas pressure near 40 kPa (300 torrs) is suitable, because a fairly extended top surface is provided to the grown epitaxial silicon layer, as described next. Fig. 13 is a diagram illustrating the relationship between the reaction gas pressure and the lateral extending length of the epitaxial silicon layer under a crystal growth temperature of 940°C. As shown by curves A and B corresponding respectively to (100) and (111) orientations, the lateral extension is increased with the gas pressure on a silicon substrate of (1 0 0) orientation as well as of (1 1 1) orientation. From these curves, it is nevertheless obvious that the silicon substrate having (1 0 0) orientation is more suitable to obtain a high lateral extension. The gas pressure is limited not to exceed 40 kPa (300 torrs) as described above. Considering the results represented in Fig. 11, Fig. 12, and Fig. 13, a higher crystal growth temperature and a higher gas pressure within the indicated upper limit are desirable for manufacturing a high integration density semiconductor device. On the other hand, a lower crystal growth temperature and a lower reaction gas pressure are desirable for manufacturing a semiconductor device in which a complicated structure is further formed over the polysilicon layer grown by the vapor deposition process, such as a multilayered IC device.

Claims: A method of fabricating a semiconductor device comprising the steps of first forming a silicon dioxide (SiO₂) layer (3) on a portion of a surface of a silicon (Si) substrate (1), and second simultaneously forming an epitaxial silicon layer (ES) on another portion of said surface of the silicon substrate (1) and a poly-crystalline silicon layer (PS) on said silicon dioxide layer (3), both layers being continuously connected to each other, by a low pressure vapor deposition process utilizing a silicon hydride gas, characterized in that said silicon substrate (1) has a major surface of (111) orientation, whereby a polycrystalline silicon layer (PS) having a smooth surface is formed through said vapor deposition process, which is carried out at a substrate temperature between 780°C and 950°C, utilizing disilane (Si₂H₆) gas as silicon hydride gas under a gas pressure between 4 kPa (30 torrs) and 40 kPa (300 torrs). A method according to claim 1, characterized in that it further comprises a step of ion sputtering the surface of said silicon substrate (1) and of said silicon dioxide layer (3) between said first and second steps. A method according to claim 1 or 2, characterized in that it further comprises a step of chemical processing for cleaning the surface of said silicon substrate (1) and of said silicon dioxide layer (3) between said first and second steps. A method according to any one of claims 1 to 3, characterized in that said semiconductor device is a MOS field effect transistor. A method according to any one of claims 1 to 3, characterized in that said semiconductor device is a bipolar transistor. A method according to any one of claims 1 to 3, characterized in that said semiconductor device comprises a MOS field effect transistor and a bipolar transistor.

Inventors: KURITA KAZUYUKI, MIENO FUMITAKE, NAKAMURA SHINJI, SHIMIZU ATUO, KURITA, KAZUYUKI, MIENO, FUMITAKE, NAKAMURA, SHINJI, SHIMIZU, ATUO
Applicants: FUJITSU LTD, FUJITSU LIMITED
Application year: 1987
Main classification: H01L21
IPC codes: H01L21