MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

Abstract: A multilayer printed wiring board produced by buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through-studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by buildup process a conductive paste on the roughened surface.

Description: BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a multilayer printed wiring board for use with electronic devices, components, etc., and more particularly to a multilayer printed wiring board which has a high density and is excellent in heat dissipating properties. Description of the Prior Art Paralleling with an increasing tendency toward the miniaturization of devices and advancement in the electronic industry, there has been an ever increasing trend to aim at the production of printed wiring boards which permit high-density mounting. Also, there has been a tendency toward forming both a power supply circuit and signal circuits on a single printed wiring board (PWB) and further there has been a demand for high-density mounting and improved heat dissipating properties. In the past, as a PWB capable of ensuring high-density mounting, a multilayer printed wiring board has been used widely in which a plurality of double-sides copper-clad glass-epoxy resin boards each formed with a printed wiring pattern on its laminated copper foil by the subtractive process are laminated and the necessary conductive paths are provided by plated through-holes. However, the resin boards are made of resins which are inferior in heat conductivity and they are also thick with the resulting deterioration of the heat dissipating properties. Thus, while ceramic multilayer wiring boards utilizing the thick film printing have been used widely, there have been disadvantages that they are much expensive, tend to be damaged by mechanical stresses and have limitations in size. Futher, while metal cored substrate utilizing good heat dissipating properties of metals have been used in the fields requiring the heat dissipating properties, they must be of multilayer structures in order to attain the desired high-density mounting. One method (I) to produce a multilayer structure is the use of plated through-holes. More specifically, as shown in Figs, 2a to 2c, the method comprises laminating a copper foil 23 through an insulation laminate 22 to each side of an aluminum substrate 20 formed with through-holes 21 preliminarily (Figs, 2a and 2b), forming through-holes 24 in the portions of the copper foils 23 corresponding to the through-holes 21 (Fig. 2c), and forming a plated copper layer on the insides of the through-holes by an electroless plating process or an electroplating process. Another method (II) comprises, as shown in Fig. 3, bonding a metal foil, e.g., copper foil to one side of a metal substrate 31 through an insulation laminate 32 and removing the unwanted portions of the copper foil by the subtractive process to form a first layer printed wiring pattern 33 of the desired design, and forming interlaminar conductors (hereinafter referred to as through studs), interlaminar insulation laminates and a second layer printed wiring pattern by the use of an insulating material and a conductive paste. More specifically, as for example, in Fig. 3 a through stud 35 made of a cured conductive paste is formed at each of the desired positions on the first layer printed wiring pattern 33 on the insulation laminate 32, and a second layer printed wiring pattern 36 is printed with a conductive paste and cured through interlaminar insulation laminates 34-1 and 34-2. Then, in order to meet the need for a multilayer printed wiring board which is excellent in heat dissipating properties and low in cost, it is desirable to use a substrate combining the heat conductivity of a metal and the economy and electric insulating properties of a resin. However, of the previously mentioned methods of producing multilayer printed wiring boards of the type employing a metal cored substrate, the previously mentioned method (I) employing the plated through-holes is not suitable for the production of a high-density multilayer printed wiring board which attaches importance to the heat dissipating properties, since the essential aim of using the substrate or its excellent heat dissipating properties are ruined by the presence of the insulation laminates on its sides. On the other hand, the method (II) employing the conductive paste layers and the insulation laminates is disadvantageous in that the conductivity of the cured conductive paste is low and that there is a limitation to the allowable current. To improve on this point, a method has been proposed in which a metal plating, e.g., copper plating (37 in Fig. 3) is additionally applied onto the cured conductive paste on the top layer printed wiring pattern. However, this method is also disadvantageous in that while the conductivity is increased greatly, a temperature rise due to the flow of a large current is so large that there is a limitation to the allowable current carrying capacity. Such temperature rise is a problem which is mainly concerned with the through studs. SUMMARY OF THE INVENTION With a view to overcoming the foregoing deficiencies in the prior art, it is the primary object of the present invention to provide a multilayer printed wiring board in which conductor paths or through studs between the respective layer printed wiring patterns are high in reliability, which are excellent in heat dissipating properties and which ensures high-density mounting. In accordance with the invention as claimed, there is thus provided a multilayer printed wiring board including a metal core made of aluminum, iron, copper, an insulation laminate disposed on the metal core and at least two layers of printed wiring patterns laminated to the insulation laminate through another insulation laminate. Particularly, the first layer of printed wiring pattern closer to the metal core is a metal layer whose one surface on the side of said second layer of printed wiring pattern is formed into a rough surface such that the average value of the differences in height between its peaks and valleys is 1µm or over and the second layer of printed wiring pattern and through studs between the printed wiring patterns are made of a cured conductive paste. A method for producing an embodiment of such a multilayer printed wiring board comprises the steps of forming a first layer printed wiring pattern by the subtractive process on a metal foil layer of a metal-clad insulating metal cored substrate made by bonding together through an insulation laminate a metal foil formed at least on one side thereof with a rough surface whose average value of the differences in height between its peaks and valleys is 1 µm or over and a metal core with the rough surface serving as a nonbonding surface, forming a plurality of through studs made of cured resin-type conductive paste to provide conduction between the first layer printed wiring pattern and a second layer printed wiring pattern to be formed next and a second insulation laminate for providing insulation spaces in between the first layer printed wiring pattern and insulation between the first and second printed wiring patterns,and forming the second layer printed wiring pattern by screen printing a desired pattern on the surface of the through studs and the second insulation laminate by the use of a resin-type conductive paste, curing the paste and applying an electroless plating onto the cured paste. In accordance with an embodiment of the invention, by virtue of the fact that the through studs made of the cured resin-type conductive paste are provided on the roughened surface of the first layer printed wiring pattern to ensure a satisfactory contact between the conductive metal powder in the paste and the first layer printed wiring pattern, the generation of heat is decreased and the allowable current value is increased, thereby fully ensuring the effects of the use of the metal core which is excellent in heat dissipating properties. The above and other objects, features and advantages of the invention will become more apparent from the following detailed description taken in conjunction with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a sectional view for explaining the construction of a two-layer printed wiring board according to an embodiment of the invention. Figs. 2a to 2c and Fig. 3 are sectional views useful for explaining conventional two-layer printed wiring board production methods. Figs. 4a to 4h are sectional views for explaining the method for producing the two-layer printed wiring board according to the embodiment of the invention. Fig. 5 is a schematic diagram for explaining the circuit construction used with examples and a comparative example. DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the invention which is applied to the production of a two-layer printed wiring board will now be described with reference to Figs. 4a to 4h. In the Figures, a metal core 11 and a metal foil 13 are bonded together under the application of heat and pressure through an insulationlaminate 12 having good adhesive properties to obtain a metal foil clad-insulated metal cored substrate (Fig. 4a). While such materials as aluminum, copper, iron and their alloys may be used as materials for the metal core, preferably aluminum and its alloys which are relatively low in cost, excellent in heat conductivity and requiring no corrosion resisting treatment and the like are suitable materials. Also, these materials may be used in the form coated with an oxide layer on the surface thereof. The insulation laminate must possess adhesive properties for bonding the metal core and the metal foil together and electrical insulating properties and a composite material mainly composed of a resin and an inorganic material is preferred. Suitable resins may include, for example, epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol,butyral modified phenol resin, and the inorganic material used for the purpose of providing the desired molding properties and reducing the thermal coefficient in addition to the heat conductivity may be composed of glass cloth or powdered talc, quartz, alumina, titania. Such insulation laminate is preliminarily applied and dried on either one or both of the metal core and the metal foil and then the bonding is effected. If necessary from the characteristic point view, it is effective to apply a different one or ones onto it. The thickness of the insulation laminate 12 should preferably be between 0.03 and 0.1 mm in consideration of the desired electrical insulation and heat conductivity. Copper and aluminum foils of good conductivity may be used for the metal foil and particularly the copper foil having good working properties is suited for the purpose. While it is conceivable to use a method of effecting the bonding by employing a metal foil whose surface on the second layer pattern side is preliminarily roughened in such a manner that the average value of the differences in height between its peakes and valleys is 1 µm or over and another method of roughening the surface of the metal foil after the bonding operation, it is preferable to use a preliminarily roughened foil since the roughening after the formation of a pattern deteriorates the dimensional accuracy of the wiring and since it is difficult to uniformly roughen the surface of the pattern. While any of such chemical methods as chemical etching, electrochemical solution and electrodeposition and such physical methods as honing and sandblasting may be used as the method of roughening the surface of the metal foil, the method employing the electrodeposition is preferred from the productivity point of view. The roughness of the roughened surface is given in terms of the average value of the differences in height between its peaks and valleys corresponding to the 10-point average roughness according to the JIS Specification B601 and its value must be 1 µm or over, particularly preferably in the range between 2 µm and 6 µm. The roughened surface roughness of less than 1 µm result in an unsatisfactry contact between the roughened surface of the first layer printed wiring pattern of the metal foil and the metal particles in the conductive paste thus failing to increase the current carrying capacity. On the other hand, any unnecessarily large roughened surface roughness is not preferred since there is the danger of deteriorating the dielectric strength of the insulation laminate, although the current carrying capacity can be increased. Then, the undesired portions of the metal foil are removed by etching in accordance with the conventional method so as to form a first layer printed wiring pattern 13 as shown in Fig. 4b. Then, as shown in Fig. 4d, a conductive paste is cured to provide through studs 15 forming conductive paths between the first-layer and second-layer printed wiring patterns and also an insulation laminate 14 made of an insulating material is provided for insulation between the portions of the first layer printed wiring pattern and between the two layer printed wiring patterns. The conductive paste may be such that it has a specific resistance between 1 x 10⁻⁵Ωcm and 1 x 10⁻³Ωcm after curing. The conductive metal powder contained in the paste may be silver, copper, silver-plated copper, silver-plated nickel or the like and copper powder is well suited from the cost point of view. In particular, it is preferable to use a resin-type copper paste employing spherical copper powder particles having holes therein. This type of paste is well suited, because forming the shape of the copper powder particles into particularly a spherical or granular shape has the effect of remarkably improving the printing performance and moreover the presence of holes inside the copper powder particles has the effect of decreasing the specific gravity of the copper powder to prevent the copper powder from sinking in the paste and accomplishing the desired porosity that satisfactorily ensures the probability of contact between the copper particles in the cured paste with a relatively small loading weight (as compared with spherical powder particles having no holes), thereby ensuring stable high conductivity. In addition to the composite material compositions described by way of examples in connection with the insulation laminate 12, such resins as ultraviolet-curing resins, e.g. acrylic resins and such inorganic materials as clays, barium sulfate and calcium carbonate may be used as insulating materials for forming such insulation laminates. If it is necessary from the characteristic point of view, the use of a laminate of different composite materials is effective. It is to be noted that while there is no particularly determined order in which through studs and an insulation laminate are formed, where an insulation laminate is formed by screen printing and curing a thermosetting-type insulating paste, the formation of through studs should preferably be effected as shown in Fig. 4c. The reason is that if the screen printing of the insulating paste is effected first, there is the danger of the insulating paste bleeding over the first layer printed wiring pattern of the metal foil and forming a thin insulating film, thereby deteriorating the reliability in conduction between the first layer printed wiring pattern and the through studs. However, this does not apply to a case where a UV curing development-type insulating paste, dry film or the like having a good resolution is used. Then, as shown in Fig. 4f, a second layer printed wiring pattern is formed by buildup process and curing a conductive paste. In this case, it is desirable to preliminarily make the lower layer surface as flat as possible by mechanical grinding as shown in Fig. 4e. The reason is that the printing accuracy of the conductive paste is enhanced with a decrease in the irregularities on the undercoat. Also, where the surface of the through studs is completely covered with an insulating material, the through stud surface on the second printed wiring pattern side can be fully exposed by grinding. In addition, the compositions mentioned in connection with the description of the through studs can be used for the conductive paste and similarly a resin-type conductive paste employing spherical copper powder particles having holes is well suited. Further, a printed wiring pattern formed by the use of this conductive paste can be particularly used advantageously as a chemically plated undercoat pattern. In other words, generally the amount of conductive metal powder in a resin-type conductive paste shows a loading weight representing a minimum specific resistance. Thus, in the past, where an electroless plating is applied to the surface of a printed wiring pattern formed with a conductive paste so as to impart a high degree of conductivity, a paste filled with more conductive metal powder than the loading weight representing the minimum specific resistance is used and the metal is exposed considerably to the surface of the pattern formed with the conductive paste. In the case of the resin-type conductive paste employing spherical copper powder particles having holes, the copper powder is not easily caused to sink due to the presence of the holes in the particles and moreover their spherical shape tends to facilitate the exposure of the heads of the individual copper particles. Thus, particularly there is a feature that without increasing the copper powder loading weight, it is possible to provide a uniform plated wiring pattern with a high deposition rate and high plate adhesion to the conductor surface. Then, as shown in Fig. 4g, a metal layer 17 is formed on the second layer printed wiring pattern 16 by electroless plating. This operation is performed for the reason that the conductivity of the conductive paste is low as compared with the metal thus limiting the allowable current of the resulting wiring pattern, and this operation may be eliminated if the required current is low. In addition, there is no particular limitation to the method and type of the electroless plating. While the electroless plating of gold, silver, copper, nickel or the like is applicable a method of applying a nickel-boron alloy electroless plating 17-1 and then applying an electroless copper plating 17-2 to form a printed wiring pattern is excellent in solderability and free from the occurrence of any soldering erosion. Also, it is desirable to perform a treatment, such as mechanical grinding, solvent treating or chemical treating as a preliminarily treatment before the electroless plating. The following are specific examples of the actual production of multilayer printed wiring boards according to the present invention. Example 1 After the surface of an aluminum plate of 1.5 mm thick and 500 mm square had been activated by alkali etching, a copper foil (35 µm thick) having one side (referred to as M side) roughened to a 10 point average roughness of 8 µm according to the JIS Specification B0601 and the other side (referred to as an S side) roughened to 3.2 µm was bonded with the M side serving as a bonding surface to the aluminum plate under the application of heat 170 °C and pressure of 50 kg/cm² through an insulation laminate formed by applying and curing a resin composition including alumina 50 % (weight %, the same applies hereinafter) and polyamide-imide resin 50 % to a thickness of 50 µm and an epoxy resin composition containing silica 50 %, thereby preparing a copper-clad aluminum plate. Then, a piece was cut from the resulting copper-clad aluminum plate to a size of 100 mm long and 150 mm wide and then in accordance with the conventional method a resist was formed with a dry film and etched by a ferric chloride solution, thereby forming a first layer printed wiring pattern. Note that the M and S sides were roughened by an electrochemical deposition process. Then, using a resin-type copper paste prepared by mixing 85 % of spherical copper powder particles having holes and an average particle size of 10.8 µm, 15 % of resol-type phenol resin (nonvolatile content) and a small amount of oleic acid with a solvent consisting of ethyl Carbitol, a through stud of 1.0 mm in diameter and 0.03 mm in height was formed at each of given portions by the buildup process and cured at 180°C for 30 minutes. Note that the spherical copper powder particles with holes was produced by the following method. Molten copper of 1700°C was sprayed under a pressure of 1 kg/cm² against a water bed turning along with a drum within a rotary drum and a high-pressure nitrogen gas of 20 kg/cm² was sprayed against the molten copper from the oblique side to effect a primary atomization of it. Then, the molten copper was impinged on the water bed to effect a secondary atomization, collected from the water, dried, placed in a hydrogen gas of 250 °C for 30 minutes so as to reduce its surface oxidation and classified by a classifier, thereby obtaining spherical copper powder particles having the maximum particle size of 50 µm and the average particle size of 10.8 µm. The porosity was 10.5 % and the apparent density was 3.52 g/cm³. Then, an insulating paste of an epoxy resin containing 30 % of silica was printed by the screen printing process over the surface excluding the through stud portions and cured under the application of heat of 150°C for 30 minutes. Then, the surface of the assembly was ground by the use of a three-reel scrub grinder having three buffing rolls #600, #600 and #800. Then, a resin-type copper paste of the previously mentioned type was used to print a second layer printed wiring pattern by the buildup process and similarly cured at 180°C for 30 minutes, thereby forming a printed wiring pattern layer of about 20 µm. Then, after the printed wiring board had been immersed in a 10 % HCl for 10 minutes to clean its surface, the prinetd wiring board was immersed in an electroless nickel plating bath (NICRAD-741: Okuno Chemical Ind. Co., Ltd.) (65°C, pH7.1) for 15 minutes, thereby applying an NiB (B content was about 0.9 %) plating of about 3.5 µm thick. Then, the printed wiring board was immersed in an electroless copper plating bath (ELC-HS; Uemura Kogyosha K.K.) (65 °C) for 2 hours to apply a copper plating of about 8 µm thick. Example 2 A multilayer printed wiring board according to the invention was produced in the same manner as Example 1 except that a copper-clad aluminum plate was formed by using a copper foil (35 µm) having the same M side as in Example 1 and a smooth S side and then the 10-point average roughness of the S side was made 1.1 µm by the sandblasting treatment. Example 3 After the surface of an aluminum plate had been coated with an oxide film of 6 µm thick by anodic oxidation, a copper foil of 35 µm thick having the M side roughened to 8 µm (average roughness of JIS-B0601) and the S side roughened to 4.5 µm was bonded with the M side serving as a bonding surface to the aluminum plate under the application of heat and pressure through an insulation laminate formed by coating and curing an epoxy resin composition including alumina 65 weight % to a thickness of about 70 µm, thereby preparing a copper-clad aluminum plate of 250 mm X 250 mm square. Then, a first layer printed wiring pattern was formed in the same manner as Example 1. Then, using a resin-type copper paste prepared in the same manner as Example 1 using spherical copper powder particles of an average particle size of 2.7 µm, a through stud of 1.0 mm in diameter and 0.03 mm in height was formed at each of given portion on the pattern by the buildup process and cured at 150°C for 30 minutes. Then, an insulating resin paste of an epoxy resin containing 30 % of silica was printed by the buildup process over the surface excluding the through stud portions and cured under the application of heat of 150 °C for 30 minutes. Then, after the surface of the assembly was ground by the use of an abrasive paper, a second layer printed wiring pattern was formed by the buildup process using the resin-type copper paste of the same type as of Example 1 and cured at 180°C for 30 minutes, thereby forming a printed wiring pattern layer of about 20 µm thick. After that, the NiB plating was applied to the layer in the same manner as Example 1. Comparative Example A comparative multilayer printed wiring board was produced in the same manner as in Example 1 except that the S side roughness of a copper foil was 0.4 µm. With the multilayer printed wiring boards produced in these Examples and Comparative Example, a dc current was supplied to the wiring of the following construction and the temperature of each printed wiring board was measured by a thermocouple. The results are shown in terms of the differences from the room temperature in the following Table 1. Note that the circuit construction is as shown in Fig. 5 and the wiring dimentions are as follows. First layer printed wiring pattern (41): width 0.5 mm, total length 60 mm. Second layer printed wiring pattern (42): width 1 mm, total length 30 mm. Through studs (43): 1 mm, four studs. With the foregoing examples, it is ascertained that the allowable current flowing through the printed wiring of the PWB can be increased in accordance with the present invention.

Claims: A multilayer printed wiring board comprising: a metal core (11); a first insulation laminate (12) disposed on said metal core; at least first (13) and second (16) layers of printed wiring patterns laminated to said first insulation laminate, said first layer of printed wiring pattern comprising a metal layer whose one surface on the side of said second layer of printed wiring pattern is roughened in a manner that an average value of differences in height between peaks and valleys thereof is 1 µm or over, said second layer of printed wiring pattern being made of a cured conductive paste; a second insulation laminate (14) disposed between the layers of printed wiring patterns to electrically insulate said first and second layers of printed wiring patterns from each other; and a plurality of through studs (15) forming conducting paths between said first layer of printed wiring pattern and said second layer of printed wiring pattern, said through studs being made of a cured conductive paste, whereby said multilayer printed wiring board has excellent heat dissipating properties. A multilayer printed wiring board according to claim 1, wherein said metal core comprises an aluminum plate. A multilayer printed wiring board according to claim 1, wherein said metal core comprises an aluminum plate having an oxide coating on a surface thereof. A multilayer printed wiring board according to claim 1, wherein said insulation laminate disposed on said metal core is a composite material comprising mainly a resin and an inorganic material. A multilayer printed wiring board according to claim 1, wherein said first insulation laminate disposed on said metal core is a laminate comprising a plurality of different composite materials each comprising mainly a resin and an inorganic material. A multilayer printed wiring board according to claim 4 or 5, wherein said resin is a material or a mixture of two or more materials selected from the group consisting of epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol, and butyral modified phenol resins. A multilayer printed wiring board according to claim 4 or 5, wherein said inorganic material is a material or a mixture of two or more materials selected from the group consisting of glass cloth and powdered talc, quartz, alumina and titania. A multilayer printed wiring board according to claim 1, wherein the second layer printed wiring pattern side metal surface of said first layer printed wiring pattern is a roughened surface whose average value of differences in height between peaks and valleys thereof is between 2 and 6 µm. A Multilayer printed wiring board according to claim 1, wherein the roughened surface of said first layer printed wiring pattern is formed by an electrochemical deposition process. A multilayer printed wiring board according to claim 1, wherein said first layer printed wiring pattern comprises a metal foil bonded to said metal core through said first insulation laminate. A multilayer printed wiring board according to claim 10, wherein said metal foil is a copper foil. A multilayer printed wiring board according to claim 1, wherein said second insulation laminate for electrically insulating said first-layer and second-layer printed wiring patterns is a composite material comprising mainly a resin and an inorganic material. A multilayer printed wiring board according to claim 1, wherein said second insulation laminate is a laminate comprising a plurality of different composite materials each comprising mainly a resin and an inorganic material. A multilayer printed wiring board according to claim 12 or 13, wherein said resin is a material or a mixture of two or more materials selected from the group consisting of epoxy, phenol,polyamide-imide, polyimide, nitrile-rubber modified phenol, butyral modified phenol and acrylic resins. A multilayer printed wiring board according to claim 12 or 13, wherein said inorganic material is a material or a mixture of two or materials selected from the group consisting of powdered talc, clay, barium sulfate, calcium carbonate, quartz, silica, alumina and titania. A multilayer printed wiring board according to claim 1, wherein said conductive paste comprises a resin-type copper paste containing spherical copper powder particles as a conductive filler. A multilayer printed wiring board according to claim 16, wherein said copper powder particles have a hole therein. A multilayer printed wiring board according to claim 1, wherein a metal layer (17) is formed by electroless plating on a part or whole of the surface of said second layer printed wiring pattern. A multilayer printed wiring board according to claim 18, wherein said plated metal layer comprises nickel-boron alloy electroless plating (17-1) and copper electroless plating (17-2). A method for producing a multilayer printed wiring board comprising the following sequence of steps: a) forming a first layer of printed wiring pattern (13) by a subtractive process on a metal foil layer of a metal foil-clad insulated metal core comprising a metal foil having at least one surface thereof roughened such that an average value of differences in height between peaks and valleys thereof is 1 µm or over and a metal core (11) to which said metal foil is bonded through a first insulation laminate (12) with said roughened surface being as a nonbonding surface; b) curing a resin-type conductive paste to form a plurality of conductive paths or through studs (15) for current flow between said first layer of printed wiring pattern and a second layer of printed wiring pattern (16) to be formed next and forming a second insulation laminate (14) for providing insulation spaces in between said first layer of printed wiring pattern and between said first layer of printed wiring pattern and said second layer of printed wiring pattern; and c) forming said second layer of printed wiring pattern by screen printing a resin-type conductive paste in a desired pattern on the surface of said through studs and said second insulation laminate, curing the same and applying an electroless plating thereonto. A method according to claim 20, wherein in said step a), said metal foil-clad insulating metal core is formed by bonding together under the application of heat and pressure a metal foil having at least one surface thereof roughened such that an average value of differences in height between peaks and valleys thereof is 1 µm or over and a metal core through a first insulation laminate with said roughened surface being as a nonbonding surface. A method according to claim 20, wherein in said step a), said metal foil-clad insulating metal core is formed by bonding together a metal foil and a metal core through a first insulation laminate under the application of heat and pressure and then roughening a surface of said metal foil such that an average value of differences in height between peaks and valleys thereof is 1 µm or over. A method according to claim 20, wherein in said step a), said first insulation laminate is a composite material comprising mainly a resin and an inorganic material. A method according to claim 20, wherein said first insulation lamination is a laminate comprising a plurality of different composite materials each comprising mainly a resin and an inorganic material. A method according to claim 23 or 24, wherein said resin is a material or a mixture of two or more materials selected from the group consisting of epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol and butyral modified phenol resins. A method according to claim 23 or 24, wherein said inorganic material is a material or a mixture of two or more materials selected from the group consisting of powdered talc, quartz, alumina and titania. A method according to claim 20, wherein in said step b), said second insulation laminate for providing insulation spaces in between said first printed wiring pattern and between said first and second printed wiring patterns is formed after the formation of said through studs. A method according to claim 20, wherein in said step b), said through studs are formed after the formation of a part of said second insulation laminate for providing insulation spaces of said first layer printed wiring pattern, and then the remainder of said second insulation laminate for providing insulation between said first and second printing wiring patterns is formed. A method according to claim 20, wherein in said step b), said second insulation laminate for providing insulation spaces in between said first layer printed wiring pattern and between said first and second printed wiring patterns is formed first and then said through studs are formed. A method according to claim 20, wherein in said step b), said second insulation laminate is a composite material comprising mainly a resin and an inorganic material. A method according to claim 20, wherein said second insulation laminate is a laminate comprising a plurality of different composite materials each comprising mainly a resin and an inorganic material. A method according to claim 30 or 31, wherein said resin is a material or a mixture of two or more materials selected from the group consisting of epoxy, phenol, polyamide-imide, polyimide, nitrile-rubber modified phenol, butyral modified phenol, and acrylic resins. A method according to claim 30 or 31, wherein said inorganic material is a material or a mixture of two or more material selected from the group consisting of powdered talc, clay, barium sulfate, calcium carbonate, quarz, silica, alumina and titania. A method according to claim 20, wherein said step c) is performed after the surface of said through studs and said second insulation laminate have been made flat by mechanical grinding immediately before performing said step c). A method according to claim 20, wherein in said step c), said second layer printed wiring pattern is formed by forming a desired wiring pattern (16) with a resin-type conductive paste, applying a nickel-boron alloy electroless plating (17-1) to said desired wiring pattern and applying a copper electroless plating (17-2) to said nickel-boron alloy electroless plating.

Inventors: HORI, HISAKO, JINBO, TAKAMASA, SHIGA, SHOJI, SHIRAHATA, ISAO
Applicants: FURUKAWA DENKI KOGYO KABUSHIKI KAISHA
Application year: 1987
Main classification: H05K3
IPC codes: H05K3, H05K1