Header device

Abstract: A header device (10) for receiving an IC card or pack (30), comprises a housing (11), which includes an IC-pack holder (12) having an opening (121) through which the IC pack (30) is inserted into and removed from the housing, and a pair of first levers (21) projecting into the IC-pack holder (12) so as to abut an end por­ tion (31) of the IC pack (30), and a pair of second levers (22) located outside the holder. The first and second levers (22, 23) are coupled to each other at their respective proximal ends (211, 221), so that they are immovable relative to each other. The coupled levers (21, 22) are rotatably mounted on the housing (11). If the IC pack (30) is inserted into the housing (11) through the opening (12), the end portion (31) of the IC pack pushes the respective first levers (21), thereby rotating both the first and second levers (21, 22) in a first rotation direction. Then, if the second levers (22) are rotated in a second rotation direction reverse to the first rotation direction, the first levers (21) push the IC pack out of the housing.

Description: The present invention relates to a header device, and more particularly, to a header device which connects an IC pack, having a semiconductor circuit therein, to another semiconductor circuit. Header devices of this type are used to connect a flat IC pack or card to an external circuit, such as a circuit of a main apparatus. The IC pack contains a semiconductor circuit, e.g., a memory, CPU, etc. These conventional header devices are arranged so that the IC pack can be inserted into an IC-pack holder of a header housing, which is formed of an insulator. A number of conductive pins are arranged on an interior end face of the housing opposite to an open face thereof. The connector pins are connected to or disconnected from their corresponding socket terminals, which are located on the leading end portion of the IC pack. Thus, the IC pack can be connected to or disconnected from the external apparatus by inserting it into or drawing it out from the IC-pack holder of the header housing. US-A-4466680 describes an electric connector equipped with a lever which rotates within a holder unit and is spring biassed. The rotating lever is locked in place to secure a memory device plugged into the holder unit and can be released by an eject button. US-A-4128288 describes a connector for receiving a device whereby the device is placed within the connector initially without engagement between electrical terminals. When the device is fully inserted a complex arrangment of spring biassing means, multipoint camming means and displacement means enable electrical contact between the electrical terminals. This arrangement is relatively expensive to produce and connection and disconnection is carried out in two stages. In prior art connectors described above, a considerable force is required to remove the connector pins on the holder or header housing from the socket terminals on the associated device e.g. an IC pack it receives, in order to secure satisfactory electrical contact between them. These pins and terminals have come to be arranged with a higher density, with the increase of the packaging density of those semiconductor circuits which carry them. The device is pulled by hand when it is to be removed from the header housing. However, a number of connector pins and socket terminals are arranged densely, and the disconnection of the pins from the terminals requires a substantial force. In removing the device from the housing, therefore, the device must be pulled with a great force, against the fitting friction between the pins and terminals. Since the device is removed manually, moreover, the direction of the removal is not fixed, so that the pins or terminals may possibly be broken or bent. Accordingly, an object of the present invention is to provide a header device which permits easy removal of an IC pack therefrom, and more specifically, facilitates the removal of the IC pack despite the use of a number of connector pins. Another object of the invention is to provide a header device which permits the removal of the IC pack without entailing any damage to the pins or terminals. The present invention is concerned with a header device for a flat IC pack having at least one electrical terminal, the header device comprising a header housing including an IC-pack holder, an opening communicating with the IC-pack holder so that the IC pack is inserted into or withdrawn from the IC-pack holder through the opening in a first or second direction, respectively, and an electrical terminal opposite the opening adapted to fittingly engage with the electrical terminal of the IC pack when the IC-pack is inserted into the IC-pack holder through the opening in the first direction as is known. The present invention is characterized by at least one operating means including a first lever with a first free end located inside the IC-pack holder of the header housing and a first connecting end, a second lever with a second free end located outside the IC-pack holder and a second connecting end, and support means connected to the first and second connecting ends of the levers and supporting the first and second levers for rotating together about an axis, so that the second lever partly rotates as the first lever is forced to partly rotate about the axis by the IC pack contacting the first free end of the first lever as the IC pack is inserted in the first direction into the IC-pack holder, and said second free end of the second lever can be partly rotated by a force acting in the first direction in order that the IC pack in the IC-pack holder of the header housing is pushed in the second direction, by the first free end of the first lever. In the header device of the invention constructed in this manner, if the IC pack is pushed deep into the IC-pack holder of the header housing, a first lever, having the first free end, is pushed and rotated rearward by the pack. At the same time, a second lever, having the second free end, rotates forward or toward the opening in the IC-pack holder. If the second lever is rotated rearward, the first lever moves toward the opening in the IC-pack holder. After the IC pack is pushed out by the first lever, moving in this manner, it can be removed from the header housing. Thus, with use of the header device constructed in this manner, the IC pack can be both inserted and removed by a pushing operation. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: Fig. 1 is a perspective view of a header device according to an embodiment of the present invention; Fig. 2 is a perspective view showing operating means of the header device of Fig. 1; Figs. 3A and 3B show a state such that an IC pack is fully inserted in the header device of Fig. 1, in which Fig. 3A is a schematic top view, and Fig. 3B is a sectional view taken along line X-X of Fig. 1; and Figs. 4A and 4B, which correspond to Figs. 3A and 3B, respectively, show a state such that the IC pack is pushed out of the header device by operating means according to the invention. A header device according to an embodiment of the present invention will now be described in detail with reference to the accompanying drawings. In the external perspective view of Fig. 1, header device 10 is composed basically of housing 11. Defined inside header housing 11 is IC-pack holder 12 in which IC pack 30 is to be held. A plurality of conductive pins 13 are arranged on that wall which is opposite to opening 121 of holder 12. Pins 13 are adapted to be connected individually to socket terminals (not shown), which are fixed to the leading end portion 31 of IC pack 30 in holder 12. Thus, if pack 30 is inserted into holder 12 through opening 121, a semiconductor circuit mounted on pack 30 is connected to the circuit of a main apparatus (not shown) to which header device 10 is attached by pins 13. Header housing 11 is provided with a pair of operating means 201 and 202 which are situated individually on two opposite sides of IC pack 30, with respect to the insertion direction thereof, at interior portion 122 of IC-pack holder 12. As shown in Fig. 2, operating means 201 includes first and second levers 21 and 22 which are connected, at connecting ends 211 and 221, respectively, to coupling portion 24. First lever 23 has free end 212. Second lever has free end 222. Operating means 202 is also constructed in this manner. Operating means 201 and 202 are fitted individually in a pair of apertures on IC-pack holder 12. Operating means 201 and 202 are rotatably supported by their corresponding shafts 23, which are mounted on housing 11 so as to extend perpendicular to the plane of IC pack 30. First levers 21 are designed so that they can move from interior portion 122 of IC-pack holder 12 toward opening 121 (and in the reverse direction) when operating means 201 and 202 rotate. Second levers 22 are designed so as to rotate over top wall 14 of housing 11 as the operating means rotate. In this embodiment, first and second levers 21 and 22 are fixed at an angle of about 120° to each other, as shown in Fig. 2. When second lever 22 is rotated in the direction indicated by an arrow 1 in Fig. 2, first lever 21 moves in the direction opposite to the moving direction of the second lever. Second lever 22, which is used as an operating piece, is longer than first lever 21 which serves as a driving piece. In accordance with the ratio between the radii of the rotation of levers 21 and 22, the operative force of first lever 21 is enhanced by second lever 22, and is then transmitted as a driving force for IC pack 30. In the header device constructed in this manner, if IC pack 30 is pushed manually into IC-pack holder 12 through opening 121, leading end face 31 of pack 30 first abuts against free end 212 of each first lever 21. If pack 30 continues to be pushed in further, first lever 21 is pushed deep into holder 12, and second lever 22, which is formed integrally with the first lever, moves towards opening 121. Figs. 3A and 3B show a state after IC pack 30 is inserted. In this state, the socket terminals (not shown) of pack 30 and the connector pins 13 of header device 10 are connected. In removing IC pack 30, second levers 22 of operating means 201 and 202 are pushed in the direction of pack insertion. As levers 22 rotate in this manner, free ends 212 of first levers 21 push IC pack 30 toward opening 121 so that pack 30 further projects from the housing, as shown in Figs. 4A and 4B. In this state, the conductive pins 13 of device 10 are off the socket terminals of pack 30, so that the pack can be removed easily by hand. In the header device according to the embodiment described above, the IC pack can be inserted by being pushed in, and can be removed by pushing second levers 22. In general, a pushing operation is easier than a pulling operation. Thus, the IC pack can be inserted and removed more efficiently. In this embodiment, in particular, second lever 22 is longer than first lever 21, so that it can be operated easily, even if the number of the conductive pins of the header device is so large that a great force would be required for the removal. The respective second levers of the paired operating means can be operated simultaneously by means of one suitable operating member located halfway between the operating means. The operating means of the header device of the present invention may be one in number. In this case, it is situated in a position such that the IC pack can be removed easily by operating the second lever.

Claims: A header device (10) for a flat IC pack (30) having at least one electrical terminal; said device comprising a header housing (11) including an IC-pack holder (12), an opening (121), communicating with the IC-pack holder so that the IC pack is inserted or withdrawn through the opening and an electrical terminal (13) opposite the opening adapted to fittingly engage the electrical terminal of the IC pack in the IC-pack holder and further comprising: at least one operating means (201, 202) including a first lever (21) with a first free end (212) located inside the IC-pack holder (12) of the header housing (11) and a first connecting end (211), a second lever (22) with a second free end (222) disposed outside the IC-pack holder, and a second connecting end (221) and support means (23, 24) connected to the first and second connecting ends of the levers and supporting the first and second levers for rotating together about an axis so that the second lever partly rotates as the first lever (21) is forced to partly rotate about the said axis by the IC-pack (30) contacting the first free end (212) of the first lever (21) as the IC pack is inserted in a first direction into the IC-pack holder, and so that said second free end (222) of the second lever can be partly rotated by a force acting in the first direction in order that the IC pack in the IC-pack holder of the header housing is pushed by the first free end in the direction opposite to the insertion direction. A header device according to Claim 1, wherein said support means of said operating means includes a coupling member (24) rotatable about said axis, said first and second levers extending from the coupling member. A header device according to Claim 2, wherein said first and second levers (21, 22) each extend on a plane parallel to a plane of the IC pack (30) defined by a longitudinal leading edge of the IC pack and the first direction of the IC pack insertion into the IC-pack holder and wherein said axis extends perpendicular to the plane of the IC pack. A header device according to Claim 2 or 3, wherein said operating means includes a shaft (23) extending along the said axis and supporting the coupling member (24). A header device according to any one of Claims 2 to 4, wherein said first and second levers (21, 22) and said coupling member (24) of said support means are moulded integrally. A header device according to any one of Claims 2 to 5, wherein said first and second levers (21, 22) and said coupling member (24) of said support means are formed of an insulating material. A header device according to any one of Claims 2 to 6, wherein the distance between the free end (212) and the connecting end (211) of said first lever (21) is shorter than that between the free end (222) and the connecting end (221) of said second lever (22). A header device according to any one of Claims 1 to 7, wherein said first and second lever (21, 22) extend in different directions, at a predetermined angle to each other. A header device according to any one of Claims 1 to 8, wherein said first free end (212) includes an arcuate surface against which the IC pack abuts, the point of contact between the IC pack and the arcuate surface being adapted to move as the IC pack moves. A header device according to any one of Claims 1 to 9, wherein there are a pair of said operating means (201, 202) which are spaced from one another in a direction perpendicular to the first direction of IC pack insertion.

Inventors: NARITA HIROSHI, NARITA, HIROSHI C/O DU PONT JAPAN LTD.
Applicants: DU PONT, E.I. DU PONT DE NEMOURS AND COMPANY
Application year: 1987
Main classification: G06K7
IPC codes: G06K7, H02K7, H01R12, G06K17, H05K5, H01R13, G06K13