METAL OR PLASTIC CLAD POLYVINAL RESIN LAMINATES

Abstract: A reaction-injection-molding process for manufacturing metal foil or plastic film clad reinforced resin substrate lami­ nates which are useful as electrical circuit boards and EMI/RFI shielding components is provided.

Description: METAL OR PLASTIC-CLAD POLYVINYL RESIN LAMINATES The invention relates to laminates of reinforced ethylenically unsaturated resins bonded to metal foils and/or plastic films and especially to a reaction injection-molding process for their manufacture. Electrical circuit boards are prepared by laminating metal sheets, for example, copper sheets, with sheets of electrical insulating material such as glass fiber reinforced unsaturated polyester resin sheets. Such electrical circuit boards may be either rigid or flexible and are further classified as single-sided (metal foil on one side of the insulating material only), double-sided (metal foil on both sides of the insulating material) or multi-layered. Electrical insulating materials is a base or support for the metal sheets bonded thereto. The National Electrical Manufacturers Association (NEMA) has established standards for various base materials. Standards for polyester glass-mat sheet laminates have been established by NEMA such as grades GPO-1, GPO-2 and GPO-3. Some products of this invention meet these standards. Normally the metal foil, usually copper foil, is secured to the reinforced plastic sheet by means of a suitable adhesive. For example, U.S. Patent No. 3,700,538 discloses adhesive bonding ccpper foil to resin-impregnated fiber glass cloth using polyimide resin adhesive. It is also known to add an adhesion promoter to the insulating base material. For example, U.S. Patent Nos. 3,477,900 and 3,149,021 disclose that when the insulating base material comprises methylmethacrylate resin then unsaturated polyester may be added to the resin as an adhesion promoter to bond a copper foil. However, these patents disclose that an increase in the proportion of polyester is generally accompanied by a decrease in an adhesion of the copper foil to the resinous base. U.S. 4,420,509 and 4,093,768 disclose procedures for preparing polyester resin-copper clad laminates. These processes require several steps or expensive continuously operating equipment for their manufacture. The present commercial practice used to produce copper-clad laminates for printed circuit boards involves either molding prepreg materials with a copper foil placed on one or two sides or bonding a copper foil to molded laminates using a separate process step. In either process prepreg materials are prepared before molding takes place. The prepregging operation is a completely independent process step and it requires additional machinery, processing technology, processing time, labor and energy. Essentially the process requires passing a reinforcing glass cloth through a solution of resin, evaporating the solvent, heat treating the resin saturated cloth to a prepreg, and sectioning the prepreg to a predetermined geometry. Molding prepreg materials to form a composite of several ply laminates also requires capital investment and high energy consumption because prepreg materials are normally molded in an autoclave or press at high temperatures, for example, 3500F for epoxy for an extended period of time. Molding times of one hour are typical. In the case of bonding copper foil after the prepreg molding, the metal cladding operation requires not only an added processing step but introduces additional problems with bonding strength and surface smoothness. The present invention employs reaction injection molding (RIM) and resin transfer molding (RTM) technology to produce metal and organic filmclad laminates using a single injection step. The process involves placing a metal foil or a plastic film of known thickness on the cavity side of a heated metal mold, placing a fiberglass mat of predetermined weight over the metal foil or plastic film within the dimensions of the cavity, closing the mold and injecting a reaction injection processable ethylenically unsaturated resin into the mold to impregnate the glass cloth while simultaneously bonding the foil to produce a laminate. After a predetermined mold residence time at a predetermined cure temperature, the mold is opened to demold the finished clad RIM laminate. The present invention includes a process for manufacturing metal or plastic film clad polyvinyl isocyanurate-glass fiber laminates which are useful as electrical circuit boards, EMI/RFI shielding components, and other applications. Electrical circuit boards usually employ a copper or other metal foil which is subsequently etched away to leave behind portions of metal foil as electrical conductors. The foil thickness is customarily measured in terms of the number of ounces of metal per square foot of the foil. Electrodeposited copper foil is generally used in the manufacture of electrical circuit boards. Electro-deposited foil is produced by plating on stainless steel drums from which the copper foil is continuously stripped. The inner surface of the resulting foil exhibits a smooth finish whereas the outer surface is coarse thereby promoting improved bonding with the increased surface area. The thickness of the foil is controlled by adjusting the solution concentration and the electrical and mechanical parameters of the plating process. Generally, electrical circuit boards employ copper foil of 1 or 2 ounces per square foot thickness. Foils of 1 ounce per square foot have an approximate thickness of 0.0014 inch (0.0036 cm) whereas 2 ounce foils have an approximate thickness of 0.0028 inch (0.0071 cm). The copper foil used in the following examples had a thickness of 0.001 inch with one surface oxidized to enhance bonding between the copper foil and substrates. Therefore, the copper foil was placed in the cavity with the oxidized surface facing away from the mold surface. Plastic films made of VICTREXe polyethersulfone (PES), nylon, polyester, VICTREXe PEEK (polyether ether ketone), Kaptone polyimide, polycarbonate, or polyvinylidene floride can be placed in the cavity instead of the copper foil to form either decorative or insulating surface layer or to control surface texture. A VICTREX PES film made of the 300 P grade with 0.002 inch thickness was demonstrated to form a good bond with the polyvinyl isocyanurate - glass fiber laminates. Glass fibers are used to reinforce the polyvinylisocyanurate resins in the process of the present invention. Glass is particularly useful as a reinforcing agent because of its high tensile strength, high modulus of elasticity, ability to be formed to small diameter fibers, inertness and low specific gravity compared to equally strong fibers. In the process of the invention, it is preferred to use glass mat of randomly oriented continuous glass strand having an areal weight of about 3 ounces per square foot. In general, in the process of the present invention, the weight of the glass fiber mat used ranges up to about 40% by weight of the laminates. Resins which are reaction injectionable may be selected from ethylenically unsaturated polyesters, vinylesters, polyesterurethanes, methylmethacrylate, vinylisocyanurates, and polyurethanes, polyepoxies, nylons, and blends thereof. The ethylenically unsaturated reaction injection molding material preferably may contain at least 50% by weight of a polyisocyanurate such as poly(1 ,3 ,5-tri-R-substituted-S-triazine-2 ,4 ,6 trione) wherein the R group contains ethylenic unsaturation or groups reactive with ethylenically unsaturated materials. R groups may also be linked with epoxy, polyurethane and polyester resins. Such isocyanurates are represented by U.S. Patent Nos. 2,952,665; 3,041,313; 3,821,098; 3,850,770; 3,719,638; 3,437,500; 3,947,736; 3,762,269 and preferably materials described in U.S. 4,128,537 and 4,195,146. The preferred materials are made by reacting polyisocyanate with a monohydric alcohol containing a vinylidene group in the presence of a catalyst to form an isocyanate containing urethane and thereafter catalytically-trimerizing the isocyanate containing urethane to form an ethylenically unsaturated isocyanurate. The ethylenically unsaturated isocyanurate may be homopolymerized or copolymerized with ethylenically unsaturated monomers to form high molecular weight polymers having excellent physical properties. The polyisocyanurate resins used in the process are usually monomer solutions of isocyanurate based on toluene diisocyanate and hydroxypropyl methacrylate which are soluble in at least one of the following free radical polymerizable ethylenically unsaturated monomers such as: divinylbenzene, styrene, methylacrylate, methylmethacrylate, ethylacrylate, ethylmethacrylate, 2-ethylhexylacrylate, 2-ethylhexylmethacrylate, butylacrylate, butylmethacrylate, tetramethyleneglycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, neopentylglycol diacrylate, 1,3-butyleneglycol diacrylate, 2,3-dibromopropylacrylate, 2,3-dibromopropylmethacrylate, cyclohexylacrylate, cyclohexylmethacrylate, acrylic acid, methacrylic acid, hydroxyethylacrylate, hydroxyethylmethacrylate, hydroxypropylacrylate, hydroxypropylmethacrylate, chlorostyrene, acrylonitrile, vinylidene chloride, vinylacetate, vinylstearate, vinyltoluene, hexanediol diacrylate, hexanediol dimethacrylate and mixtures thereof. The term soluble means that at least 2 grams of the isocyanurate compositions can be dissolved in 100 grams of at least one of the above-listed ethylenically unsaturated monomers of 250C. The ethylenically unsaturated isocyanurate resin is prepared by reacting an aromatic polyisocyanate with one of the above-described vinylidene carbonyloxyalkanols to form an isocyanate containing urethane and then trimerizing the isocyanate-containing urethane until essentially all isocyanate groups have reacted to form the ethylenically unsaturated monomer. It is believed that the preferred unsaturated isocyanurate monomer compositions are a mixture of isocyanurates characterized by the following: R"(R')x+1 wherein R" is an aromatic radical free of a group which is reacted with an isocyanate group and is obtained by removing the isocyanate groups from an aromatic polyisocyanate wherein x is an integer which is one less than the number of isocyanate groups present in the polyisocyanate wherein each R' is independently EMI7.1 with the proviso that at least one R' is Formula I and each terminal R' is Formula II wherein R"' is a monovalent organic radical having the formula obtained by removing a hydroxyl group from a vinylidene carbonyloxyalkanol characterized by formula (1) through (5) recited below and where each R"#' is independently -H or EMI8.1 EMI8.2 and wherein the total number of isocyanurate rings in each polymer molecule is less than about 400. The unsaturated isocyanurate resins may be homopolymerized and preferably copolymerized with one or more other ethylenically unsaturated copolymerizable monomer. Usually the unsaturated isocyanuric composition is copolymerized with a copolymerizable monomer in which the isocyanurate resin is dissolved as described above. The amount of solvent monomer employed may vary over a very wide range, however, it is preferred that about a 50% solution of isocyanurate resin in ethylenically unsaturated monomer solution be employed. However, a monomer solvent used will range from 30 to 80% by weight of the total composition. The unsaturated isocyanurate resin solutions may be polymerized or cured in accordance with polymerization conditions conventional in the art for the polymerization of ethylenically unsaturated materials. Isocyanurates employed in this invention particularly styrene solutions of isocyanurates made with toluene diisocyanates or polymethylenepolyphenyl polyisocyanate and hydroxypropylmethacrylate, hydroxyethylmethacrylate or hydroxypropylacrylate are less sensitive to oxygen than conventional vinyl systems in yielding tack free surfaces. In general, the polymerization may be carried out by reacting the unsaturated isocyanurate in the presence of a polymerization initiator. Suitable polymerization initiators include the various peroxide initiators such as benzoyl peroxide, methylethylketone peroxide, di(2-ethylhexyl)peroxydicarbonate, t-butylperbenzoate, dicumyl peroxide and t-butylhydroperoxide. Other polymerization catalysts which may be used also include azo-type initiators such as azobisisobutyronitrile. The amount of the initiator employed is usually very small, for example, from 1 part of initiator per 1,000 parts of polymerizable mixture to about 5 per 100 parts of said mixture. It is desirable to start polymerization with the application of external heat. In such cases it is customary to add an accelerator to the system. Suitable accelerators include cobalt, manganese, lead, and iron compounds such as cobalt naphthenate and manganese naphthenate and tertiary amines such as dimethylaniline. Additional RIM processable polymers can be used as a matrix material in copper-clad RIM laminates. For example, unsaturated polyesters, flame retardant unsaturated polyesters and polyurethanes are a more economic choice of matrix material for EMItRFI (electromagnetic interference/radio frequency interference) shielding applications. Vinyl isocyanurate, however, offers high temperature properties, corrosion resistance and dimensional stability. The solids content of the vinyl isocyanurate in styrene can be varied according to the specific viscosity or property requirement. Vinyl maleate urethanes (VMU), flame retardant and corrosion resistant polyester resins (Atlace resins) by ICI Americas Inc. can also be used for the matrix material of the invention. In addition, the Derakanee vinylesters by Dow Chemicals can be used. RIM processable epoxies, polymethylmethacrylate and the nylons are other candidates for matrix material. Polymer alloys or blends are other classes of materials for the matrix material. For example, alloys of unsaturated polyester/vinylesters and polyurethanes of various compositions can give a range of properties as disclosed in Hutchinson U.S. Patent 3,700,752 on "Interpenetrating Thickening Process Technology." Other polymer blends forming IPN (interpenetrating polymer network) such as epoxy/polyurethane blends can also serve as matrix materials for copper-clad reaction injection molded laminates. The reinforcing fibers in metal-clad RIM laminates of the invention can be either based on glass, aramid fibers, graphite fibers, steel fibers, inorganic fibers such as boron and alumina or a blend of these. The fiber content can be widely varied. Fiber orientation can be varied to meet a specific functional requirement. Construction can be varied from random mat to woven or even knit structures. For the production of components with a complex shape, the reinforcing fibers can be preshaped by a "preform" process. According to generally accepted reaction injection molding practice, two reacting component blends one labelled "A" and the other labelled "B" are forced into an impingement mixer and immediately thereafter injected into a closed mold containing reinforcing fiber and a thin sheet of a metal foil or plastic film which lies on one or more surfaces of the mold. Typically an "A" component is a ethylenically unsaturated monomer solution containing vinyl isocyanurate resin, free radical catalyst and a modifier while the "B" blend contains a similar amount of vinyl isocyanurate resin dissolved in ethylenically unsaturated monomer, an accelerator catalyst and modifier such as antifoam agents, coloring matter, pigment, anti-oxidants and the like. Usually the blend of the "A" component and "B" component are designed to have nearly the same viscosity, however, it is not critical to the practice of this invention that the viscosities be identically matched. It is sufficient to have the "A" and the "B" component free flowing at the mixing head. Under most circumstances the "A" and "B" components are preheated to temperatures ranging from 26-50 C. However, for most applications it is preferred to have the mold preheated to establish a fast reaction and reduce the mold residence time. The following examples will serve to illustrate but not limit the practice of the invention wherein all portions discussed are expressed as parts by weight unless otherwise specified. Preparation I Into a chemical reactor equipped with agitator, condenser, gas pipe connections, vents and portholes which is first flushed with nitrogen and thereafter sparged with 2 cfm. air and 6 cfm. nitrogen s added 680 parts of hydroxypropylmethacrylate and agitated at 30 revolutions per minute. Thereafter, 2.5 parts copper acetate catalyst, 12 parts of 20% solution of t-butyl catecrhol and 5743 parts styrene is charged to the reactor. The contents of the reactor are adjusted to 420 i 20C and thereafter sparged with 3-4 cfm. nitrogen. Under increased agitation 50-60 revolution per minute 3063 parts of toluene diisocyanate is added at a rate of 60-70 parts per minute in four 766 part portions. After the first 766 part portion is added the temperature is permitted to rise to 650C. After the second portion the temperature is permitted to rise to 780 C, after the third portion the temperatures is permitted to rise to 900C and after the fourth portions the temperature is permitted to go to no higher than 93 C. Reaction mix is stirred for 1 hour at 900C at which time the unreacted isocyanate contents should be less than 4.5%. Reaction mix is cooled to 550C and then mixed with 18 parts N-benzyltrimethylammoniumhydroxide as a 40X methanol solution. The exothermic trimerization reaction takes place with additional cooling. The reaction mixture should not be permitted to go above 60 C. The reaction is continued until the unreacted isocyanate content ranges between 0.05-0.15Z and the viscosity ranges between 425-475 cps. At this point 6 parts of methane sulfonic acid is added to inhibit the activity of the trimerization catalyst. The styrene/polyisocyanurate resin solution is stored for later use under conditions which inhibit further polymerization. The product has a number average molecular weight of about 1160, a weight average molecular weight of 2000, and a polydispersity of about 1.9. About 95% of the iso -cyanurates present have a-molecular weight of below about 5200 and contain some isocyanurates having a molecular weight about 5200 and below about 26,000. This product has a ball and ring melting point and of about 5 C and a viscosity (50% styrene solution) of about 400-600 cps at 250C and a refractive index of about 1.557 ND20. Preparation II In equipment described in Preparation I vinylisocyanurate resin was made according to a similar mixing procedure using 5280 parts polyphen scene polymethylene polyisocyanate having 2.2-NCO groups per molecule, 4000 parts hydroxypropylmethacrylate, 9280 parts styrene, 8.4 parts catalyst, 36 parts 10% t-butyl catechol in styrene solution, 18 parts N-benzyltrimethylammonium hydroxide in 40% meth anol solution. The resin solution was stored as a 59.4Z VIC resin-in-styrene solution until used. Example 1 The RIM machine used was a displacement piston-type laboratory scale machine manufactured by Accuratio Systems Inc. (Model No. Micro RRIM-2+) having 2 gallon capacity reactant tanks and a maximum injection rate of 40-45 pounds per minute. The mold used was made of P-20 steel with the cavity dimensions measuring 12 inch x 12 inch with a 1/8th inch depth. Mold was designed to be filled from the side ("side gating system") by a RIM processible material injected through a sprue peanut mixer, and a runner. The mold was heated to 900C by circulating hot water. The copper foil used was 0.001 inch thick foil with one surface oxidized to enhance bonding between the copper foil and substrates. The copper foil was placed on the cavity with the oxidized surface facing away from the mold surface. Glass mat made by Owens Corning Fiberglass, M-8610 was randomly oriented continuous glass strand mat having 3 ounce per square foot areal weight. The glass mat was cut into 12 inch squares to fit into the mold cavity. Two plies of the glass mat were placed on top of the copper foil. The weight of the glass mat was 144 grams and predesigned to give 40Z glass content by weight in the final laminate. The height of the glass mat was about .55 inch. As the core portion of the mold closed, it compressed the glass mat to.0.125 inches. This compressive force held the glass mat in place and also resulted in a tight seal between copper foil and the cavity of the mold. The resin matrix system used was a styrene solution containing 63Z solids Vinyl Isocyanurate resin made according to preparation I. The complete formulation and some of the characteristics of the resin components are shown in Table 1. Table 1 Composition and Pro erties of the Matrix Sy tem in Example 1 Formulation "A" Component Parts by wt. 63% solids Vinyl Isocyanurate 50.0 50% Benzoyl Peroxide with Tricresyl Phosphate (Luperco ATCe by Lucidol) 3.0 t-Butyl Perbenzoate 1.0 10% 4-t-Butylcatechol in styrene 1.0 "B" Component 63% solids Vinyl Isocyanurate 50.0 6X Cobalt Naphthenate in mineral spirit 0.2 N,N' -Dimethylparatoluidine 0.8 Sag 47 (Anti-foam agent) 1 drop Properties Viscosity; Comp. A 540 cps at 60 rpm Comp. B 940 cps at 60 rpm Stability at R.T.; Both components are stable for longer than 7 days Density; Comp. A 1.08 gm/cc Comp. B 1.08 gm/cc A to B weight ratio; 1.08 Cure temp.; 9Q C Cure time; 5 min. The "A" component and "B" component were individually recirculated through the RIM machine at room temperature. The mold was heated to 900C with circulating hot water. The reactants were mixed inside the MIX head with 1,500 psi dispensing pressure. The thoroughly mixed reactants were then directed inside the closed mold to impregnate the glass mat and the copper foil. After 5 minutes mold residence time, the mold was opened and the finished part demolded. The copperclad RIM laminate produced exhibited good glass wet-out, good copper foil to laminate bonding, and flatness. The physical properties of the laminate are summerized in Table 2. Table 2 Properties of the RIM Laminate Produced In Example 1 Tensile Modulus 1.02x106 psi Tensile Strength 15,100 psi Tensile Elongation 2.3 Flexural Modulus 1.20x106 psi Flexural Strength 32,500 psi Notched Izod 14.4 ft-b/in Coefficient of Thermal Expansion 12.6x10 in/in/ F Density 1.37 gm/cc Water Absorption (24 hr) 0.40Z Glass Content 36.2X by wt. Mold Shrinkage 2 mils/in Dielectric Constant @ 10 KHz 3.7 Dissipation Factor @ 10 KHz 0.0175 Materials prepared using the same concept of - the invention can be applied to EMI/RFI (electromagnetic interference/radio frequency interference) shielding components. Typical EMI/RFI shielding properties are shown in Table 3. Table 3 EMI/RFI Shielding Properties of Copper Clad RIM Casting (without glass mat) Volume Resistivity Near 0 ohm. cm Shielding Effectiveness Higher than 30 dB Example 2 In apparatus similar to that described for Example 1, a 1/16 inch thick copper clad RIM laminate was made in a cavity having 1/16 inch thickness incorporating 20Z by weight glass reinforcement. Details for reactants employed and the physical properties of the resin casting are listed in Table 4. Table 4 59.4Z solids VIC Composition "A" Component 50 of Preparation II 50Z benzoyl peroxide with 3.5 tricresyl phosphate Trigonox 29-B75 1, l-Di-t-butvl peroxy-3,3,5-trim 1.0 ethylcyclohexane Trigonox KSM (mixed perester 0.5 solution, Noury) 59.4% solids VIC of "B" Component 50 Preparation TI 6Z cobalt naphthenate in 0.2 mineral spirit N,N' -dimethylpara- 0.8 toluidine Sag 47 1 drop (anti-foam agent) Heat Deflection Temp. @ 264 psi, C 126 Flexural3Strength R.T., 1O psi 16.9 Flexural6Mo dulus R.T., 10 psi 0.50 Notched Izod R.T., ft-lb/in 0.26 Residual Styrene by DSC, Z ¯ None Two 1/16 inch laminates were made according to Example 2 using glass mat labelled Run 1 and surfacing veil with one-half glass mat labelled Run 2. These were subjected to a standard solder bath test and held for various times at various temperatures. Results are listed in Table 5. Table 5 Copper Clad RIM Laminates Solder Bath Test Run 1 Run 2 Composition 1 copper foil 1 copper foil glass mat 1 surfacing veil (about 20Z i glass mat glass by weight) Solder Bath Test 20 sec. @ 2400C pass pass 20 sec. @ 2500C fail pass 5 sec. @ 2600C pass pass 20 sec. @ 2600C fail fail Superior adhesion of the copper foil is demonstrated by comparing the peel strength of the copper on a laminate of Example 2 with one of the leading isophthalic unsaturated polyester (Koppers 3702-5) laminate when made by same procedure. The vinyl isocyanurate laminate exhibited about 30Z higher copper peel strength 3.9 lbs./in. vs. 3.0 lbs. Iin. for the commercial laminate. Example 3 Using the same process and resin matrix system as described in Example 1, 1/8 inch thick RIM laminates were made with a 0.002" thick VICTREXt PES film clad on the laminate surface. The glass content in the laminate was around 20Z by weight. The surface appearance of the PES clad polyvinyl isocyanurate-glass fiber laminates was far superior to that of a PES clad Koppers 3702-5/glass fiber laminate. This was due to the fact that the cure shrinkage of the Vinyl Isocyanurate resin is far less than that of the Koppèrs 3702-5 isophthalic unsaturated polyester resin with styrene as a crosslinking monomer. Example 4 Using the process described in Example 1 and a 63% solids Vinyl Isocyanurate resin made according to Preparation II, a 1/8" thick laminate was made with a 0.0#060 inch thick Al coated Melinex¯ 301 PET film clad on the surface. In addition to the shiny Al metal finish achieved on the laminate surface, this laminate exhibited 0.36 ohm-cm volume resistivity which is acceptable for EMI/RFI shielding applications.

Claims: CLAIMS 1. A process for preparing a metal foil or a plastic film clad laminate having at least one sheet of foil or film directly bonded to a shaped reinforced resin comprising: (a) forming a resin solution of resins selected from the group consisting of ethylenically unsaturated polyesters, vinylesters, polyesterurethanes, methylmethacrylates, vinylisocyanurates, and polyurethanes, polyepoxies, nylons, and polymer initiator catalysts to start polymerization, (b) immediately injecting said polymerizing solution under pressure into a closed heated mold cavity wherein said mold cavity has at least one surface covered by a metal foil or a plastic film, (c) permitting said polymerizing solution to cure in said mold against said metal foil or plastic film under pressure, and removing a cured metal foil or plastic film clad article from said mold. 2. A process for preparing a metal foil or a plastic film clad laminate having at least one sheet of foil or film directly bonded to a sheet of reinforced polyvinylisocyanurate resin comprising: (a) mixing a vinyl isocyanurate/ethylenically unsaturated polymer solution with a free radical catalyst to initiate addition polymerization, (b) immediately injecting said polymerizing solution under pressure into a closed heated mold cavity wherein said mold cavity has at least one surface covered by a metal foil or a plastic film, (c) permitting said polymerizing solution to cure in said mold against said metal foil or plastic film under pressure, and removing a cured metal foil or plastic film clad article from said mold. 3. A process according to either of the preceding claims, wherein said mold cavity contains a reinforcing fiberous material. 4. A process of claim 3, wherein said fiberous material is selected from the group consisting of glass, aramid fiber, graphite, metal, boron, alumina, polyamide, polyimide, and polyester. 5. A process of any one of the preceding claims, wherein a metal foil is present and is selected from the group consisting of copper, aluminum, magnesium, titanium and steel. 6. A process of any of claims 1-4, wherein plastic film is present and is selected from the group consisting of polyethersulfone, polyetheretherketone, nylon, polyester, polyimide, polycarbonate, and polyvinylidene floride. 7. A process of any one of claims 1-5, wherein said fiber reinforced material is fiberglass and said metal foil is copper. 8. A process of claim 2, or any one of claims 3-7, when dependent on claim 2, wherein said polyvinylisocyanurate resin is made by trimerizing a reaction product of a polyisocyanate selected from the group consisting of toluenediisocyanate, diphenylmethanediisocyanate, and polyphenylenepolymethylenepolyisocyanate, with stoichiometric quantities of at least one ethylenically unsaturated monomer selected from the group consisting of hydroxypropylmethacrylate, hydroxymethacrylate, hydroxypropylacrylate, hydroxyethylacrylate, pentaaerythritol tetracrylate, pentaaerythritol trimethacrylate and mixtures thereof and copolymers of said vinylisocyanurate with ethylenically unsaturated solvents. 9. A process of claim 8, wherein said enthylenically unsaturated solvent is styrene.

Inventors: BRISTOWE, WILLIAM WARREN, KIM, HONG CHUL
Applicants: ICI AMERICAS INC.
Application year: 1987
Main classification: B29C67
IPC codes: B29C70, H05K3, B32B27, H05K1, B29C45, H05K9, B29C39, B29C67