Semiconductor device constituting bipolar transistor

Abstract: Base regions (32, 33) of first and second stage transistors are formed in semiconductor substrate (31) consisting of low and high resistivity collector layers (311, 312), and emitter regions (34, 35) are formed in the respective base regions. The emitter region of the second stage transistor has an interdigital structure with a plurality of finger portions (37 to 44), and emitter surface electrode (47) is formed on the emitter region of the second stage transistor. The second stage transistor emitter surface electrode has extending por­ tion (471) at a position spaced apart from a transistor operation region where the finger portions are formed. Emitter connection electrode (48) is formed on the extending portion, and a lead is connected by soldering or the like to the emitter connection electrode. In a portion of the emitter surface electrode extending from the emitter connection electrode to the transistor oper­ ation region, slits (472, 473) are formed such that they are bypassed by emitter current so that the lead resis­ tance from each finger portion to the emitter connection electrode is substantially uniform.

Description: This invention relates to a semiconductor device constituting a bipolar transistor and, more particularly, to a bipolar transistor, in which a connector portion for connecting an emitter surface electrode section formed in correspondence to an emitter region to an external circuit is formed on the emitter surface electrode for the purpose of electric connection. IBM technical disclosure bulletin Vol. 19 No. 2 July 1976 discloses a comb shaped emitter where the central portion of the emitter contact area is for wire bonding and so no emitter diffusion region exists there. This results in a longitudinal slot in the part of the emitter which underlies the emitter contact. GB 1211959 discloses a comb, or double comb shaped emitter having fingers extending from a web and having a resistance built into the device between the fingers and the web. This is done by having a layer of metal formed on the web, and a layer of metal formed on each finger. The metal on the fingers and the metal on the web are formed in end to end relationship with a gap between. The resistance between the fingers and the web is predetermined by the gap. A semiconductor device constituting a bipolar transistor has two Darlington-connected transistor elements. Figs. 14A and 14B show a prior art semiconductor device with two Darlington-connected transistors. The device comprises semiconductor substrate 11 which consists of N⁺ type low resistivity collector layer 111 and N⁻ type high resistivity collector layer 112. Semiconductor substrate 11 constitutes collector regions of two, i.e. first and second stage, transistors in Darlington connection. Collector electrode 12 is formed on the back side of semiconductor substrate 11. In high resistivity collector layer 112 of the substrate, base regions 13 and 14 of the respective first and second stage transistors are formed by P type impurity diffusion. In base regions 13 and 14, respective emitter regions 15 and 16 are formed by N⁺ type impurity diffusion. Emitter region 16 has an interdigital structure to provide an increased edge length so as to improve such characteristics as current capacity and current amplification factor. The interdigital structure is realized by forming a plurality of finger portions 160 to 169. Emitter region 15 likewise has an interdigital structure. Surface electrode 17 is formed in correspondence to the base region of the first stage transistor. Surface electrode 18 is formed in correspondence to emitter region 15 of the firsts stage transistor and base region 14 of the second stage transistor. Surface electrode 19 is formed on emitter region 16 of the second stage transistor. Electrode 20 is formed on a central portion of surface electrode 17 for connecting the base to an external circuit. Likewise, electrode 21 is formed on a central portion of emitter surface electrode 19 of the second stage transistor for connecting the emitter to the external circuit. Lead lines are connected, by soldering for instance, to the surfaces of electrodes 20 and 21. With the transistor circuit having the above structure, by applying a positive bias voltage to base surface electrode 17, a base current is caused to flow from base region 13 of the first stage transistor to emitter region 15 thereof to render the first transistor in the Darlington connection operative. When the first stage transistor is rendered operative, a collector current corresponding to the magnitude of the current amplification factor of the transistor is caused to flow from low resistivity collector layer 111 to high resistivity collector layer 112 and thence to emitter region 15 of the first stage transistor, whereby an amplifying operation is performed. When a large current is caused to flow through emitter region 16 of the second stage transistor of the semiconductor device having the above structure, the resistance of surface electrode 19 with respect to the emitter region can not be ignored. More specifically, due to a voltage drop caused by the resistance noted above, the potential on emitter region 16 is increased. Therefore, the bias voltage between base and emitter regions 14 and 16 becomes lower with the distance from emitter connection electrode 21. In a portion enclosed by dashed line A in Fig. 14A, currents Ia and Ib flowing from the side of finger portions 161 and 166, and currents Ic and Id flowing from the side of finger portions 160 and 165, which are remoter from emitter connection electrode 21 than finger portions 161 and 166, are combined. The currents noted above, therefore, include portions which pass through the same path. For this reason, in finger portions 160 and 165 voltage drops due to currents Ia and Ib are added to voltage drops due to currents Ic and Id from these portions. This means a further increase of the potential on emitter region 16 of the second stage transistor, and hence a further reduction of the bias voltage. Therefore, the transistor operation is restricted in areas spaced apart from emitter connection electrode 21, that is, it takes place only in the neighborhood of emitter connection electrode 21. This localization of the transistor operation results in reduction of the current capacity and current amplification factor of the transistor. While a bipolar transistor having the Darlington connection structure has been shown as prior art, the same problem is encountered in the case of a single transistor structure. For transistor structures for high power purposes, therefore, particular considerations have to be given to the current capacity reduction due to the localization of the transistor operation. An object of the invention is to provide a semiconductor device constituting a bipolar transistor which can effectively reduce localication of the transistor operation in the neighborhood of the emitter connection electrode even in case when a large current flows, thus improving transistor characteristics such as current capacity and the current amplification factor. Another object of the invention is to provide a semiconductor device constituting a bipolar transistor such that the distances of current paths from transistor operation zones to the emitter connection electrode are substantially equal. A further object of the invention is to provide a semiconductor device constituting a bipolar transistor which can improve the reliability of the emitter connection electrode section by suppressing the temperature rise in this section. The semiconductor device according to the present invention is defined by the appended claims. According to one embodiment, the emitter is formed such that it has an interdigital structure to improve transistor characteristics such as the current capacity and current amplification factor, the distances from the individual finger portions of the emitter surface electrode to the emitter connection electrode are made substantially equal. Localization of transistor characteristics thus can be improved to obtain effective improvement of transistor characteristics such as the current capacity and current amplification factor, and the semiconductor device can be effectively used for high power purposes. This invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: Fig. 1A is a plan view showing an embodiment of the semiconductor device according to the invention: Fig. 1B is a sectional view taken along line b-b in Fig. 1B; Fig. 2 is a view showing an equivalent circuit of the semiconductor device; Fig. 3 is a fragmentary plan view, in an enlarged scale, showing the semiconductor device shown in Fig. 1A, particularly in the neighborhood of an emitter connection electrode; Fig. 4 is a graph for explaining the current distribution in the emitter surface electrode of the semiconductor device; Fig. 5 is a graph showing the relation between the collector current and current amplification factor; Fig. 6A is a plan view showing a second embodiment of the semiconductor device according to the invention; Fig. 6B is a sectional view taken along line b-b in Fig. 6A; Fig. 7 is a fragmentary plan view, in an enlarged scale, showing an emitter surface electrode of the semiconductor device shown in Fig. 6A; Fig. 8A is a plan view showing a third embodiment of the semiconductor device according to the invention; Fig. 8B is a sectional view taken along line b-b in Fig. 8A; Fig. 9 is a plan view showing an emitter region of the embodiment of Fig. 6A; Figs 10A and 10B are perspective views for explaining heat distribution in semiconductor devices; Fig. 11 is a graph showing temperatures in various parts of the semiconductor devices shown in Figs. 10A and 10B; Fig. 12A is a plan view showing a fourth embodiment of the semiconductor device according to the invention; Fig. 12B is a fragmentary plan view, in an enlarged scale, showing a portion enclosed in a dashed circle in Fig. 12A; Fig. 12C is a fragmentary sectional view taken along line c-c in Fig. 12B; Fig. 13 is a schematic plan view showing a fifth embodiment of the semiconductor device according to the invention; Fig. 14A is a plan view showing a prior art semiconductor device; and Fig. 14B is a sectional view taken along line b-b in Fig. 14A. Figs. 1A and 1B show an embodiment of the semiconductor device. The device is a bipolar transistor having two Darlington-connected transistors. The two, i.e., first and second stage, transistors in Darlington connection are formed on semiconductor substrate 31. Semiconductor substrate 31 consists of N⁺ type low resistivity collector layer 311 with an N type impurity concentration of 1 × 10²⁰ atoms/cm³ or above, and N⁻ type high resistivity collector layer 312 with an N type impurity concentration of approximately 1 × 10¹⁴ atoms/cm³. Base regions 32 and 33 of the respective first and second stage transistors in Darlington connection are formed in high resistivity collector layer 312 of semiconductor substrate 31. In base regions 32 and 33, the P type impurity concentration is set to be approximately 1 × 10¹⁶ to 1 × 10¹⁷ atoms/cm³. In base regions 32 and 33, N⁺ type emitter regions 34 and 35 of the first and second transistors are formed respectively with their N type impurity concentration set to 1 × 10²⁰ atoms/cm³. Collector electrode 313 is formed on the back side of semiconductor substrate 31. As shown in Fig. 1A, base regions 32 and 33 of the first and second stage transistors are electrically connected to each other by connection paths 36. Although not shown in detail, a resistive layer is formed on connection paths 36, so that resistor R1 is serially inserted between base regions 32 and 33. Emitter region 35 of the second stage transistor has an interdigital structure. It has a plurality of finger portions 37 to 40 having a finger-like shape from a plan view and directed in one direction. It also has other finger portions 41 to 44 which are directed in the opposite direction. The distance between adjacent finger portions is set to be approximately 120 µm. Emitter region 34 of the first stage transistor also has an interdigital structure. Base surface electrode 45 is formed on base region 32 of the first stage transistor. Surface electrode 46 is formed on the surface of first stage transistor emitter region 34 and second stage transistor base region 33. Emitter surface electrode 47 of second stage transistor is formed on to the second stage transistor emitter region 35. In a central portion of emitter region 35 between finger portions 35 to 40, on one hand, and finger portions 41 to 44, on the other, an aperture is formed to expose portion 331 of base region 33. In this aperture, base region 33 and surface electrode 47 are electrically connected to each other. Although not shown in detail, base region 33 and surface electrode 47 are coupled to each other via the resistance of resistor R2. Emitter surface electrode 47 is formed such that it corresponds to emitter region 35 inclusive of the finger portions. It also has perpendicular portion 471 which extends in a direction perpendicular to the direction in which finger portions 37 to 44 extend. Emitter connection electrode 48 is formed on perpendicular portion 471 of emitter surface electrode 47 which is located outside an emitter operation zone occupied by finger portions 37 to 44. Emitter region 35 of the second stage transistor has perpendicular portions 351 and 352 respectively extending from the stems of finger portions 37 and 41 toward emitter connection electrode 48. Exposed base region portion 331 is formed between perpendicular portions 351 and 352. In perpendicular portions 351 and 352 of the emitter region, substantially no transistor operation is provided. Emitter surface electrode 47 of the second stage transistor has slits 472 and 473 extending from the stem of perpendicular portion 471 and crossing a line connecting finger portions 37 and 41. The emitter current flows along or bypasses slits 472 and 473. Slits 472 and 473 are formed in emitter surface electrode 47 as follows. An oxide film is first formed on a portion of semiconductor substrate 31 where there is a PN junction formed by impurity diffusion. Then, a thin film of a conductor, e.g., aluminum, constituting the emitter surface electrode is formed over the entire semiconductor substrate inclusive of the oxide film. Thereafter, a predetermined portion of the conductor thin film including a portion over the oxide film is removed, whereby slits 472 and 473 are formed. Emitter connection electrode 48 is formed as a metalized layer on perpendicular portion 471 of emitter surface electrode 47. Portion 471 thus is made to be a lead connection terminal, to which a lead is connected by means of soldering. In the first stage transistor, emitter region 34 has an interdigital structure with a plurality of finger portions with one end of each finger extending up to connection paths 36. Base surface electrode 45 which is formed on base region 32 of the first stage transistor, has finger portions occupying spaces between adjacent ones of finger portions 37 to 44 of second stage transistor emitter region 35. Lead-out region 451 is formed on one corner of semiconductor substrate 11, and base connection electrode 49 is formed on lead-out region 451. Although not shown, a base lead is connected by means of soldering to base connection electrode 49. The arrangement of emitter surface electrode 47, which is formed on predetermined areas of first stage transistor emitter region 34 and second stage transistor base region 33, will be further described. Surface electrode 47 is formed on the inner side of first stage transistor emitter region 34. In second stage transistor base region 33, finger-like base electrode portions 51 to 56 are formed such that they occupy spaces between adjacent ones of finger portions 37 to 44 of second stage transistor emitter region 35. Connecting portion 57 electrically connecting fingerlike base electrode portions 53 and 56 is also formed. Finger-like base electrode portions 58 and 59 are further formed extending along respective finger portions 37 and 41 of emitter toward emitter connection terminal 48. Fig. 2 shows an equivalent circuit of the semiconductor device having the above construction. As is shown, first and second stage transistors Tr1 and Tr2 are Darlington connected. In this equivalent circuit, parts like those in the semiconductor device shown in Figs. 1A and 1B are designated by like reference numerals. Fig. 3 shows emitter connection electrode 48 and the neighborhood thereof in an enlarged scale. End 591 of finger-like base electrode portion 59 is spaced apart by distance ℓ from perpendicular portion 352 of emitter region 35. Oxide film 60 is formed on the principal surface of semiconductor substrate 31 to protect PN junctions formed in the principal surface. Further, surface protective film 61 is formed on various electrodes. The semiconductor device having the above construction operates in the same way as the prior art semiconductor device shown in Fig. 14. In the above semiconductor device, emitter connection electrode 48 is provided not in the area surrounded by second stage transistor emitter region 35, in which heat readily builds up, but on perpendicular portion 471 projecting from this area. Therefore, even when a large current is caused to flow in second stage transistor emitter region 35 to cause generation of heat in the collector region right beneath the emitter region so as to elevate the temperature thereof, the influence of heat is reduced in the area near emitter connection electrode 48. Thus, it is possible to effectively reduce the thermal fatigue the connection portion of the lead connected to emitter connection electrode 48. However, with emitter connection electrode 48 provided at a position spaced apart from the operative zone of emitter region 35, the distances of individual points in emitter region 35 from emitter connection electrode 48 differ greatly. For example, finger portions 37, 38, 41 and 42 are spaced apart by smaller distances from emitter connection electrode 48 than finger portions 39, 40, 43 and 44. For this reason, when the current flowing in second stage transistor emitter region 35 is increased, the current paths from individual portions of emitter surface electrode 47 to emitter connection electrode 48 offer different resistances. In correspondence to these differences, localization is produced in the transistor operation to deteriorate transistor characteristics such as the current capacity and current amplification factor. In the embodiment of the semiconductor device described above, however, slits 472 and 473 are formed in second stage transistor emitter surface electrode 47. Therefore, current I flowing through finger portions 37 and 41 bypasses slits 472 and 473, as shown in Fig. 3, that is, the length of the current path is increased. More particularly, the resistance of the lead, through which current I flows, is increased in correspondence to the increase in the current path length. For example, it is possible to make the distances of finger portions 39, 40, 43 and 44 from emitter connection electrode 48 substantially equal, and as a whole the lead resistance is uniform from individual points of emitter surface electrode 47 to emitter connection electrode 48. For this reason, the potential distribution of emitter region 35 of the second stage transistor is made uniform, and the polarization of the transistor operation is sufficiently alleviated. Figs. 4 and 5 show results of experiments conducted by the inventor. In Fig. 4, the abscissa is taken for the distance of each point of emitter region 35 from emitter connection electrode 48, and the ordinate is taken for emitter current Ie at each point. The overall emitter current I E is 8 A, and collector-emitter voltage V, as detected, is approximately 3 V. In Fig. 4, curve A is obtained in the case where slits 472 and 473 are not provided, emitter current I E being reduced with an increase of the distance from emitter connection electrode 48. With slits 472 and 473 provided as in this embodiment, emitter current I E is uniform, as is represented by curve B. Fig. 5 shows current amplification factor h fe plotted against collector current I C in case when a voltage of 5 V is applied between the collector and base electrodes. The solid curve is obtained where slits 402 and 403 are provided as in the embodiment, while the dashed curve corresponds to the case where slits 472 and 473 are not provided. More specifically, with the construction of the embodiment with an increase of collector current I C , the difference in the current amplification factor is increased compared to the case where there are no slits. More specifically, since the lead resistance is uniform from each point of emitter surface electrode 47 to emitter connection electrode 48, the localization of transistor operation is alleviated in case when the collector current is increased. In the semiconductor device of the embodiment, end 591 of finger-like base electrode portion 59 is spaced apart by distance ℓ from perpendicular portion 352 of emitter region 35, as shown in an enlarged scale in Fig. 3. A portion of current that is injected from surface electrode 46 into base region 33 of the second stage transistor flows through that portion of base region 33 which extends between end 591 and portion 352, to the neighborhood of emitter connection electrode 48. The amount of current becomes smaller, the greater distance ℓ is. By setting distance ℓ to be sufficiently large, it is possible to suppress the transistor operation in the neighborhood of emitter connection electrode 48 where the transistor operation is liable to be localized. In this embodiment, finger-like base electrode portions 58 and 59 are arranged symmetrically, and end 581 of finger-like base electrode portion 58 is comparatively close to perpendicular portion 351 of emitter region 35. However, for the purpose of suppressing the transistor operation in the neighborhood of emitter connection electrode 48, it is possible to have end 518 spaced apart by a greater distance from perpendicular portion 481, specifically, by redvcing the length of fingerlike base electrode portion 58. Figs. 6A and 6B show a second embodiment of the invention. Like the first embodiment, semiconductor substrate 31 consists of low resistivity collector layer 311 and high resistivity collector layer 312. Base regions 32 and 33 of respective first and second stage transistors are formed in substrate 31. Emitter regions 34 and 35 of the first and second stage transistors are formed in respective base regions 32 and 33. Emitter region 35 of the second stage transistor has a plurality of finger portions 37a to 37g and 41a to 41g in a symmetrical arrangement. Surface electrode 45 of the first stage transistor is formed on the first stage transistor base region. Surface electrode 46 is formed on predetermined surface areas of first stage transistor emitter region 34 and second stage transistor base region 33. Emitter surface electrode 47 is formed on the surface of second stage transistor emitter region 35. Emitter connection electrode 48 is formed on a central portion of emitter region 35. Base connection electrode 49 is formed on base region 32. In this embodiment, emitter surface electrode 47 has slits 474 and 475. Slit 474 is formed in a portion between the space portion between finger portions 37c and 37e and emitter connection electrode 48, while slit 475 is formed in a portion between the space portion between finger portions 41c and 41e and electrode 48. Further, emitter surface electrode 47 has slits 476, 477, 478 and 479 respectively extending from ends of space portions corresponding to the stems of finger portions 37a, 41a, 37g and 41g toward emitter connection electrode 48. In this embodiment, current I D flowing in finger portions 37d and 41d bypasses slits 474 and 475, as shown by arrows in Fig. 6A. Thus, the lead resistance from finger portions 37d and 41d to emitter connection electrode 48 is increased. The transistor operation in the neighborhood of these areas is thus suppressed, thus alleviating the phenomenon of localization of the transistor operation. Fig. 7 shows, to an enlarged scale, emitter connection electrode 48 shown in Fig. 6A. If slits 476 and 477 are absent, the potential is determined by the lead resistance of emitter surface electrode 47 and current flowing therein. Assuming that the sheet resistance of second stage emitter surface electrode 47 is R and that current I1 is flowing from points F and G, since current from individual points are combined, potential V F at point F with reference to point E is given as V F = 2I1·R(ℓ2/W) (1) Potential V R at point G with reference to point E is the sum of potential V F noted above and a voltage drop produced when current I1 flows by distance ℓ, and is given as V R = 2I1·R(ℓ2/W) + I1·R{ℓ1/(1-α)W} (2) From equations 1 and 2, the potential difference between points G and F is V R - V F = I1·R{ℓ1/(1-α)W} > 0 (3) Since this value can not be reduced to zero, a potential difference is produced at all time between points G and F. For this reason, the transistor operation is localized toward point F at all times. In contrast, with slits 474 and 475 provided as in this embodiment, they restrict current path, and potential V F at point F with reference to point E, which is the voltage drop due to current I1 flowing from point F, is given as V F 1 = I1·R(ℓ2/αW) (4) Potential V R at point G with reference to point E is V R 1 = I1·R{(ℓ1+ℓ2)/(1-α)W} (5) From equations 4 and 5, the potential difference between points G and F is given as V R 1 - V F 1 = I1·R·[{(ℓ1+ℓ2)/(1-α)W} - (ℓ2/αW)] (6) The value in equation 6 may be made zero by satisfying a condition {(ℓ1+ℓ2)/(1-α)W = ℓ2/αW (7) If we set ℓ1 = ℓ2, equation 7 is reduced to 2ℓ1/(1-α)W = ℓ1/αW α = 1/3 It is to be understood that the potential difference between points G and F can be eliminated by setting the distance from point P1 to end of the space portion between finger portions 41b and 41c and intermediate line S to be one-third of the distance from point P1 to slit 475. In this way, it is possible to obtain a uniform potential distribution over the entire area of second stage transistor emitter surface electrode 47, and the localization of the transistor operation can be sufficiently alleviated. Figs. 8A and 8B show a third embodiment of the invention. This embodiment constitutes a single bipolar transistor, which is constructed in the same manner as the second stage transistor in the embodiment shown in Fig. 1. In Figs. 8A and 8B parts like those in Figs. 1A and 1B are designated by like reference numerals and are not described any further. In this embodiment, emitter and base connection electrodes 48 and 49 are formed at positions outside transistor operation zone 350 of emitter region 35 shown in Fig. 9. For example, where at least two sides of the emitter connection electrode section are in contact with the transistor operation zone, heat generated in the emitter region at the time of the transistor operation is efficiently transmitted to the emitter connection electrode section. Thus, excessive heat is transmitted to the solder portion connecting the lead to the lead connection terminal. In this case, it is difficult to ensure sufficient reliability of the connection portion. Fig. 10A shows the state of heat distribution in a case where base and emitter connection electrodes A and B are formed collectively along one side of the surface of semiconductor substrate as in the above embodiment. With connection electrodes A and B provided at positions outside the emitter region such that they have only one side facing the emitter region, the temperature rise of connection electrodes A and B can be sufficiently suppressed. In contrast, where either one of two connection electrodes a and b, e.g., electrode b, is provided in the transistor operation zone as shown in Fig. 10B, that is, in the case of the arrangement as shown in Fig. 14A, connection electrode b is formed in the zone of heat generation due to the transistor operation, so that the temperature of electrode b is extremely elevated. Fig. 10A shows the example shown in Fig. 8A, and Fig. 10B shows the example shown in Fig. 14A. Fig. 11 shows temperatures produced under the conditions that the second stage transistor emitter current is I E , collector-emitter voltage is 10 V, and the on-off cycle frequency is 20 Hz. In Figure 11, A, B, a and b respectively show the temperatures of electrodes A, B, a and b shown in Figs. 10A and 10B. It is confirmed that temperature A of emitter connection electrode 48 is approximately 30°C lower than the case of the example of Fig. 14A. Figs. 12A to 12C show a fourth embodiment. This example is a multi-emitter type bipolar transistor. Like the preceding embodiments, semiconductor substrate 31 consists of low resistivity collector layer 311 and high resistivity collector layer 312, and emitter region 35 is formed in base region 33 formed in substrate 31. Actually, a plurality of regions are formed as emitter region 35 in base region 33. Each emitter region 35 constitutes a transistor unit together with base region 33, high resistivity collector layer 312 and low resistivity collector layer 311. Slits 472 and 473 are formed in the emitter surface electrode which is formed over the entire surface of the device such that the lead resistance with respect to emitter connection electrode is uniform. The above embodiments of the invention are by no means limitative. For example, while the above embodiments concern PNP bipolar transistors, the invention is applicable to NPN types as well. Further, it is possible to connect two or more bipolar transistors. Fig. 13 schematically shows a fifth embodiment of the invention. In this embodiment, emitter connection electrode 48 is provided on an end portion of emitter region 35. Slits 472 and 473 formed in emitter surface electrode 47 are formed such that they extend in a direction perpendicular to the finger portions of emitter connection electrode. Further, slits 474 and 475 are formed such that they extend from the stem of finger portions. Slits 474 and 475 may have bent end portions extending toward emitter connection electrode 48. Of course, the slits formed in emitter surface electrode 47 may have bent or curved configurations.

Claims: A semiconductor device constituting a bipolar transistor, a base region (33) formed in a semiconductor substrate (31) having a collector region, an emitter region (35) formed in the base region, an emitter surface electrode (47) formed on the surface of said emitter region, and an emitter connection electrode (48) connected to the emitter surface electrode, the emitter region including an operation zone disposed closely to the emitter connection electrode and an operation zone disposed remotely from the emitter connection electrode; characterised in that the emitter surface electrode forms electrode paths between the operation zones and the emitter connection electrode; the emitter surface electrode including current bypassing means comprising slits (472, 473) formed in the emitter surface electrode so that, in use, current from a portion of the operation zone close to the emitter connection electrode flows to said emitter connection electrode by bypassing the slits to establish a substantially uniform potential distribution. The device according to claim 1, characterised in that the emitter region (35) has an interdigital shape having a plurality of finger portions (37 to 44, 37a to 37g, 41a to 41g) in a symmetrical arrangement, the emitter connection electrode being formed between opposite side portions of the symmetrical arrangement and on a line perpendicular to the direction of extension of the finger portions, the current bypassing means comprising a pair of slits (472, 473, 474, 475) formed in the emitter connection electrode (47) between the symmetrical finger portions of the emitter region on the opposite sides of the emitter connection electrode such that they extend in a direction perpendicular to the direction of extension of said finger portions. The device according to claim 1 or claim 2, characterised in that the emitter connection electrode (48) is disposed outside a region surrounded by the emitter region (35) so as to be spaced away from the said emitter region, the emitter region and emitter surface electrode (47) formed such that they extend to said emitter connection electrode, and in that a pair of slits (472 and 473) extend from a position close to stem portions of finger portions (37, 41) disposed closest to the emitter connection electrode and in a direction perpendicular to the direction of extension of said finger portions. The device according to claim 1 or claim 2, characterised in that the emitter connection electrode (48) is disposed on a central portion of the emitter region with a plurality of finger portions (37a to 37g, 41a to 41g) in a symmetrical arrangement, and in that the slits (474, 475) are located adjacent the opposite sides of the emitter connection electrode so as to face adjacent finger portions. The device according to claim 4 characterized in that slits (476 to 479) are disposed in the emitter surface electrode such that they extend from the stems of finger portions (37a, 37g, 41a, 41g) remote from the emitter connection electrode and towards the emitter connection electrode. The device according to claim 1, characterized in that a plurality of emitter regions (35) constitute a matrix in a base region formed in the semiconductor substrate (31) to form a multi-emitter type bipolar transistor, an emitter surface electrode (47) is formed such that it is common to the plurality of emitter regions with an emitter connection electrode (48) formed substantially on a central portion of an area where the plurality of emitter regions are formed and in that slits (472, 473) constituting the current bypassing means are formed in said emitter surface electrode on the opposite sides of the emitter connection electrode so that portions of said plurality of emitter regions close to said emitter connection electrode are formed on the outer side of said slits. The device according to claim 1, characterized in that the base regions (32, 33) of first and second stage transistors in Darlington connection are formed in the semiconductor substrate (31) with emitter regions (34, 35) of said first and second stage transistors formed in respective base regions (32, 33) and in that the emitter surface electrode (47) formed on the emitter region of the second stage transistor includes current bypassing means constituted by the slits (472, 473) formed in the emitter surface electrode. The device according to claim 3 characterized in that said emitter region (35) has extending portions (351, 352) extending from said transistor operation region, said emitter electrode (47) is formed such that it includes said extending portions, said base electrode (33) has finger-like portions (58, 59) having ends (581, 591) spaced apart from said extending portions of said emitter region.

Inventors: ISHIDA YOSHIKI, KATO NAOHITO, MAKINO TOMOATSU, MATSUI TAKESHI, MIYASE YOSHIYUKI, NOMURA TOHRU, YAMADA KAZUHIRO, YAMAMOTO MASAHIRO, YAMAOKA MASAMI, ISHIDA, YOSHIKI, KATO, NAOHITO, MAKINO, TOMOATSU, MATSUI, TAKESHI, MIYASE, YOSHIYUKI, NOMURA, TOHRU, YAMADA, KAZUHIRO, YAMAMOTO, MASAHIRO, YAMAOKA, MASAMI
Applicants: NIPPON DENSO CO, NIPPONDENSO CO., LTD.
Application year: 1987
Main classification: H01L29
IPC codes: H01L29