PACEMAKER OUTPUT SWITCH PROTECTION

Abstract: A protected output switch for an implantable medical device, such as a pacemaker, is disclosed. Through this output switch, a stimulation pulse is delivered from an internal storage element to an output terminal. The output switch includes a first N-channel MOSFET switch (N1) having its source terminal (S1) connected to the internal storage element (SSV) and its drain terminal (D1) connected to the output terminal (13, 16). The gate terminal (G1) of the N-channel MOSFET switch is connected to appropriate logic switching signals (15). Included as part of the output switch is a second N-channel MOSFET switch (N3) having its source terminal (S3) connected to the P-well terminal of the first N-channel MOSFET switch, its drain terminal (D3) connected to the internal storage element (SSV), and its gate terminal (G3) connected to the output terminal. This second switch (N3) serves to block any potentials, whether internal or external, from being applied to the base of a parasitic NPN bipolar transistor (Q3) that exists within the output switch. Should such NPN bipolar transistor be turned on, large potentially destructive currents could flow through the output switch.

Description: BACKGROUND OF THE INVENTION The present invention relates to a switch according to the prior art portion of claim 1. More particularly, the present invention relates to an output switch for a pacemaker. Such a switch is known from DE-A-2 015 815. The function of a pacemaker is to provide a stimulation pulse to a desired location in or on the heart whenever the heart needs to contract. Modern pacemakers allow the amplitude of the stimulation pulse to be programmably controlled. The desired amplitude of the stimulation pulse is stored within a storage element inside of the pacemaker, typically a capacitor. At the appropriate time, this storage element is switchably connected through an output switch to an output terminal of the pacemaker. The output terminal of the pacemaker, in turn, is connected to the desired location of the heart by means of a suitable conductive lead. This lead has at its distal end an electrode tip through which the stimulation pulse is presented to the heart tissue or fluids. A suitable electrical return path from the heart back to the pacemaker is also provided either through the conductive body tissue and fluids back to the pacemaker case (unipolar pacing) or through a ring electrode positioned on the pacemaker lead near the electrode tip (bipolar pacing). The output switch that is used to switchably connect the storage element to the output terminal of the pacemaker comprises a semiconductor solid state switch. In recent years, such switches have employed metal oxide semiconductor field effect transistor (MOSFET) devices. (For purposes of this application, the term "MOSFET" will be used to broadly describe all types of semiconductor switches wherein an applied gate voltage selectively inhibits or enhances a conductive channel between source and drain terminals.) MOSFET type switches are generally preferred over other types of semi-conductor switches, such as bipolar transistors, because of their low power consumption. That is, a MOSFET switch device consumes power only during the transition from an ON to an OFF state, or from an OFF to an ON state. In contrast, a bipolar switch typically consumes power continuously while in an ON state. Further, MOSFET type devices are more compatible with, and in fact can be employed as part of, the complementary metal oxide semiconductor (CMOS) circuits that comprise the digital logic circuits of a modern pacemaker. That is, the output switch is advantageously realized using the same type of semiconductor switches that are used within the digital and analog portions of the pacemakers, thereby allowing the switch to be fabricated as part of the same semiconductor chip (on the same semiconductor substrate) as the other pacemaker circuits. This sharing of the semiconductor substrate allows the pacemaker circuits to be realized in a smaller space, thereby allowing the overall pacemaker to be smaller in size. Unfortunately, the fabrication of MOSFET devices on a semiconductor substrate often results in the existence of parasitic bipolar transistors within the same substrate. (As used herein, the term "parasitic" refers to an unwanted circuit element that is an unavoidable adjunct of a wanted circuit element. That is, the bipolar transistor is an unwanted circuit element that is an unavoidable adjunct of a wanted circuit element -- the MOSFET device.) The presence of a parasitic bipolar transistor can cause many problems. For example, a typical MOSFET configuration provides the equivalent of a bipolar PNP and NPN parasitic transistors, configured in an arrangement that is equi valent to a silicon controlled rectifier (SCR). This equivalent SCR, if triggered, can cause the substrate to become "latched" and inoperable. Accordingly, precautions must be taken in order to prevent any parasitic SCR configurations from triggering and latching. The problem of parasitic bipolar transistors is also described in US-A-3,667,009. According to this reference, the problem is avoided by structuring the semiconductor in such a way that parasitic bipolar transistors cannot appear. Therefore, the reference does not deal with the problem of existing parasitic bipolar transistors. The output switch circuits of modern pacemakers comprise suitable N-channel and P-channel MOSFET devices. With the use of such devices there also exists a parasitic NPN transistor having its collector coupled to the supply voltage V DD of the pacemaker, its emitter connected to the output line of the pacemaker, and its base connected to the stored stimulation voltage, SSV, of the pacemaker. Depending upon whether the storage element holding the stored stimulation charge is fully charged or discharged, the potential actually applied to the base of the parasitic transistor may vary between V DD and SSV. In any event, if the output line of the pacemaker is subjected to a potential that is lower than the potential applied to the base of the parasitic transistor, the bipolar NPN transistor will turn ON. When the bipolar transistor turns ON in this fashion, it connects the supply voltage, V DD , to the output line through its collector and emitter terminals. This action further connects the stored stimulation voltage, SSV, to the output line through the base-emitter terminals of the bipolar transistor. Thus, any potential on the output line that is lower than SSV turns this NPN parasitic bipolar transistor ON, thereby causing large currents to flow from V DD and/or SSV to the output terminal. Such large output currents, even if only transient in nature, can potentially damage the output switching circuitry. Moreover, the flow of such currents needlessly depletes the limited energy of the pacemaker's battery. Attempts have been made in the prior art to limit the magnitude of any such large transient currents that might flow when a negative potential appears on the output line. However, such current limiting devices typically require the use of additional discrete components, which additional discrete components not only add to the bulk and expense of the pacemaker, but their effectiveness at limiting the magnitude of the transient currents may be dependent upon the magnitude of the triggering negative potential appearing on the output line of the pacemaker. Hence, whereas such limiting devices may be effective at limiting the value of the transient currents to less than destructive values when a nominal negative potential appears on the output line, they may not be effective when a greater than normal negative potential appears on the output line. Further, even if such limiting devices prevent the transient currents from reaching destructive amplitudes, they do not prevent the needless depletion of the pacemaker's battery. Unfortunately, it is not uncommon for the output line of the pacemaker to have applied thereto a potential that is lower than the the stored stimulation voltage, SSV. The most common situation where this might occur would be the application of a defibrilation pulse or pulses to the patient wearing the pacemaker. Numerous other external factors could also cause the output line to go sufficiently negative to turn the parasitic transistor ON. Further, in addition to these external sources of a negative turn-on potential, it is also possible for internal sources of a negative potential to turn the parasitic transistor ON. Hence, both external and internal sources of a negative potential can possibly trigger potentially destructive transient currents within the output switching circuitry. Accordingly, there is a need in the pacemaker art for preventing such transient currents from flowing in the output switch circuitry in the event that the output line of the pacemaker is subjected to a negative potential, either from internal or external sources. SUMMARY OF THE INVENTION The disadvantages and limitations of the background art discussed above are overcome by the present invention as stated in the claims. The present invention prevents, not just limits, transient currents from flowing through the output switching circuits of a pacemaker when the output line of the pacemaker goes more negative than the stored stimulation voltage, SSV. This condition (of the output line going more negative than SSV) is especially likely to occur during defibrillation, but could also occur at other times. As described previously, the output switch of an implanted pacemaker switchably connects the stored stimulation voltage, SSV, to the output terminal of the pacemaker. The output terminal, in turn, is connected in conventional manner, via a suitable lead, to a desired stimulation location in or on the patient's heart. The output switch comprises at least an N-channel MOSFET device. (A P-channel MOSFET device is sometimes optionally used in parallel with the N-channel device.) Unfortunately, a parasitic NPN bipolar transistor results from the fabrication of such an N-channel MOSFET switch. The bipolar parasitic transistor may disadvantageously turn ON whenever the output terminal is subjected to a voltage lower than SSV. Such turn-on action allows potentially damaging transient currents to flow from V V DD or SSV to the lower potential output line. The output switch configuration of the present invention advantageously prevents such transient currents from flowing by preventing the parasitic bipolar transistor from turning ON. This is accomplished by inserting a blocking MOSFET switch in the base of the parasitic bipolar transistor. The blocking MOSFET switch is opened whenever the output line goes lower in potential than SSV, which is likely to occur when a defibrilation pulse is applied to the patient's chest. It is a feature of the present invention to prevent, not just limit, transient currents from flowing through the output switching circuitry of a pacemaker whenever the output line of the pacemaker is momentarily subjected to a lower voltage potential than a stored stimulation voltage. A related feature of the invention prevents such transient currents from flowing through the output switching circuitry whenever the output line of the pacemaker is subjected to a lower voltage potential than the stored stimulation voltage regardless of the magnitude of the lower potential applied to the output line. It is another feature of the present invention to provide output switch protection for an implanted pacemaker using components that form an integral part of the same semiconductor substrate as the output switching circuitry and other pacemaker circuits without the need of additional discrete components. Yet another feature of the invention provides a MOSFET control switch in the output switch circuitry of a pacemaker that switchably blocks the base terminal of a parasitic bipolar transistor present in the output switch circuitry from receiving any base current, thereby preventing such bipolar transistors from turning ON. A still further feature prevents such parasitic bipolar transistor present in the output MOSFET switching circuitry from turning ON whenever the pacemaker's output line goes lower in potential than a stored stimulation voltage. BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will be more apparent from the following more particular description thereof, presented in conjunction with the following drawings, wherein: Fig. 1 is a simplified schematic/block diagram of the output switch configuration of an implanted pacemaker; Fig. 2 is a schematic diagram of the MOSFET output switch SW1 of Fig. 1; Fig. 3A is a simplified cross-sectional view of an N-channel MOSFET device and a P-channel MOSFET device fabricated on the same substrate; Fig. 3B is a schematic diagram illustrating how the PNPN configuration of Fig. 3a can result in an equivalent SCR comprised of PN P transistor Q1 and NPN transistor Q2, which SCR could latch and draw large destructive currents; Fig. 4 is a schematic diagram of the N-channel MOSFET output switch and the equivalent parasitic NPN transistor Q3 that remains even after the equivalent parasitic NPN transistor Q2 of Fig. 3b has been clamped OFF with connection 32; Fig. 5 is a schematic diagram of the pacemaker output switch of the present invention; Fig. 6 is a simplified cross-sectional view of the substrate on which the N-channel switches used in the output switch of Fig. 5 are fabricated; and Fig. 7 is a schematic diagram of the N-channel portion of the output switch of Fig. 5, including the equivalent parasitic bipolar NPN transistor Q3. DETAILED DESCRIPTION OF THE INVENTION The following description is of the best presently contemplated mode of carrying out the invention. This description is not to be taken in a limiting sense but is made merely for the purpose of describing the general principles of the invention. The scope of the invention should be determined with reference to the appended claims. It is noted that in the description that follows, and more particularly when reference is made to the drawings, that like numerals are used to describe like parts throughout. Referring first to Fig. 1, there is shown a simplified schematic/block diagram of the output switch configuration 10 of an implanted pacemaker. In general, the output switch circuitry 10 includes a battery 11, a positive terminal of which is designated as V V DD , and the negative terminal of which is designated as SS . In the usual configuration, the positive terminal V DD on the battery 11 is connected to a reference electrode 20 of the pacemaker. A storage capacitor C1 is connected between the positive battery terminal V DD and switch SW1. A charge pump circuit 12 is connected between the negative terminal V SS of battery 11 and switch SW1. It is the function of the charge pump 12 to place a charge on the capacitor C1 equal to the stimulation potential that is to be delivered to the patient's heart 18. This charge may be greater than V SS due to voltage multiplying techniques used within the charge pump circuit 12. The charge pump circuit 12 may be of conventional design. The charge or potential that is stored on capacitor C1 is designated in the figures as the stored stimulated voltage, SSV. When it is desired to deliver a stimulation pulse to the heart 18, the switch SW1 closes in response to a control signal delivered on signal line 15 from output switch logic 14. Closure of switch SW1 allows the stored stimulation voltage to be connected to the output signal line 13. Thus, the SSV side of capacitor C1 may be viewed as a source node, and output line 13 may be viewed as a destination node, with switch SW1 connecting the source node to the destination node in response to a control signal. The output signal line 13 is coupled through coupling capacitor C2 to the pacemaker output terminal 16. A suitable pacemaker lead 19 is connected to the output terminal 16. The lead 19 is positioned on or in a desired location of the heart 18. At the distal end of the lead 19 is an electrode tip 17 which is in electrical contact with the heart tissue or fluids. Thus, when switch SW1 is closed, the stored stimulation voltage SSV is delivered through output signal line 13, coupling capacitor C2, output terminal 16, and lead 19 to the electrode tip 17. An electrical return path 21 to a reference terminal 20 of the pacemaker is provided either by the conductive body tissue or fluids, if a unipolar pacing lead is employed, or by a ring electrode (not shown) if a bipolar pacing lead is employed. Any charge remaining on coupling capacitor C2 as a result of current flow from terminal 16 to terminal 20 is bled off by resistor R2. Thus, the voltage on C2 is restored to the same value as prior to closure of switch SW1. It is thus apparent from Fig. 1 that the stimulation pulse provided at the output terminal 16 is a negative pulse having a reference level of V DD and a magnitude of SSV. Such a system is often referred to as a "positive ground" system inasmuch as the positive terminal V DD of the battery 11 is utilized as the reference potential for operation of the electrical circuits within the output switch configuration 10. Referring next to Fig. 2, there is shown a schematic diagram of the output switch SW1 as has been commonly used in prior art devices. The switch configuration includes an N-channel MOSFET switch N1 in parallel with an optional P-channel MOSFET switch P2. The source terminal S1 of the switch N1 is connected to the source terminal S2 of switch P2. Similarly, the drain terminal D1 of N1 is connected to the drain terminal D2 of switch P2. The gate terminal G1 of switch N1 is connected to the output switch logic 14 via signal line 15. Similarly, the gate terminal G2 of switch P2 is connected to the output switch logic 14 by an appropriate signal line 15′. (The control signal on signal line 15′ is of the opposite polarity as the control signal on signal line 15.) In operation, it is desired that both switch N1 and P2 be ON at the same time. The N-channel switch N1 is used to pass the higher magnitude SSV potentials, while the P-channel switch P2 is used to pass the lower magnitude SSV potentials. Referring next to Fig. 3A, there is shown a simplified cross sectional view of a semiconductor substrate 22 on which the MOSFET swithces N1 and P2 have been fabricated. The substrate 22 is doped with N- carriers. The switch P2 is fabricated within this N- doped substrate by selectively creating regions 28 and 29 that are doped with P+ carriers. As indicated in Fig. 3A, region 28 functions as the source S2 of switch P2, while region 29 functions as the drain P2 of switch P2. A metal oxide insulating layer 23, only a portion of which is shown in Fig. 3A, is then deposited over the surface of the substrate 22. A metal or polysilicon gate layer G2 is then deposited over the insulating layer 22 so as to be over the substrate region lying between the P+ region 28 and the P+ region 29. When a negative voltage is applied to gate G2 (relative to the potential of the substrate 22), a region or channel of P+ carriers is enhanced between the source and drain terminals 28 and 29. This enhanced P-channel allows current to flow from the source S2 to the drain D2 (or, depending upon the polarity of the potential applied between S1 and D1, from the drain D2 to the source S2). Hence, this type of switch is referred to as a P-channel device because a P-channel is enhanced therein upon application of a proper polarity gate voltage, thereby allowing current to flow between the source and drain terminals. In order to fabricate an N-channel switch in a N-substrate, it is first necessary to create a P-well 24 within the substrate 22. This is done by doping the region 24 with P-carriers. Within this P-well 24, regions 26 and 27 are created having N+ carriers doped therein. The region 26 functions as the source terminal S1, and the region 27 functions as the drain terminal D1, of the switch N1. After the oxide insulating layer 23 is deposited over the P-well 24, a metal or polysilicon gate layer G1 is deposited over the region between the N+ regions 26 and 27. A positive voltage applied to the gate G1 enhances an N-channel between the regions 26 and 27, thereby allowing current to flow therebetween. Not shown in Fig. 3A are the metal interconnected lines that are used to electrically connect the regions of the semiconductor in order to form a working circuit. However, conventional techniques can be used to realize such interconnections, including the vias that must pass through the insulating layer 23 in order to electricall y contact desired regions of the device. Included in Fig. 3A is an N+ region 30 to which the positive battery terminal V DD is connected, and a P+ region 25. The P+ region 25 provides a means for making electrical connection with the P-well 24. As indicated previously, the creation of MOSFET devices, such as switches N1 and P2, also creates parasitic bipolar transistors. For example, the P+ region 28, the N- substrate 22, and the P- region (P-well) 24 can function as a PNP bipolar transistor Q1 as shown in Fig. 3B. Similarly, the N- substrate 22, the P-well 24 and the N+ region 26 or the N+ region 27 can function as NPN transistors Q2 and Q3 (as shown in Fig. 3B). The base of bipolar transistor Q1 is coupled to V DD through an effective resistance 30′ (caused by the N+ region 30). This resistance 30′ is typically a very small resistance. As indicated in Fig. 3B, the PNP transistor Q1 and the NPN transistor Q2 are configured as a silicon controlled recitifier (SCR). In an SCR configuration, any current that begins to flow in either Q1 or Q2 operates to turn both transistors on in a latched condition. If this occurs, the supply potential V DD is effectively latched to the stored stimulation voltage point SSV, which point is connected to S1. Such latching can draw large destructive currents from V DD to SSV (destructive in the sense that the semiconductor devices and/or interconnecting metal could be damaged and become inoperable). In order to prevent an SCR configuration of the type shown in Fig. 3B, the N+ region 26 (serving as the source S1 of switch N1) is electrically connected to the P-well 24 by way of conductor 32. This has the effect of clamping the base of transistor Q2 (Fig. 3B) to the emitter of Q2, thereby preventing Q2 from turning ON. As further indicated in Fig. 3B, a second NPN transistor Q3 is also created by the fabrication of the MOSFET switch N1. This NPN transistor Q3 has as its collector the N- substrate 22. Its base is the P-well 24, and its emitter is the N+ region 27, which emitter is also the drain terminal D1 of switch N1. Unfortunately, it is not possible to clamp the base 24 of transistor Q3 to emitter 27 as was done with Q2. To do so would effectively connected the stored stimulation voltage, SSV, to the output line 13, thereby effectively shorting switch SW1. To explain how the parasitic transistor Q3 may still cause problems, reference is made to Fig. 4. In Fig. 4 a schematic diagram of the N-channel switch N1 and the parasitic transistor Q3 is shown. As is evident from Fig. 4, and as also can be determined from Fig. 3A and Fig. 3B, the base of parasitic transistor Q3 is connected to the source terminal S1 of N-channel switch N1. The emitter 27 of parasitic transistor Q3 is connected to the drain terminal D1 of N-channel switch N1, which in turn is connected to the output line 13. The collector 22 of parasitic transistor Q3 is coupled to the supply voltage V DD through the N+ region 30. In operation, if the output terminal 16 (Fig. 4) of the pacemaker has a negative voltage applied thereto, such as might occur during defibrilation or during dual chamber pacemaker operation where the other channel's output pulse provides the negative voltage, such negative voltage is momentarily coupled through capacitor C2 and appears on output line 13. If the voltage on output line 13 is below the stored stimulation voltage appearing at the base of transistor Q3, then transistor Q3 turns ON, thereby allowing large currents to flow from V DD through Q3 to the output line 13. Moreover, current can also flow from SSV through the base-emitter junction of Q3 to the output line 13. These currents can potentially be of sufficient magnitude to cause damage to the MOSFET device N1, thereby rendering the output switch of the pacemaker inoperable. Further, these currents needlessly deplete the limited stored energy of the pacemaker. In dual chamber pacemakers, the above-described problem (of applying a negative voltage to the pacemaker output terminal) is especially noticeable. Dual chamber pacemakers employ two channels, designated, for purposes here, as channel A and channel B. Each channel has an output circuit substantially as shown in Fig. 1. If the output pulse amplitude of channel A (SSV of channel A) is much lower than the pulse amplitude of channel B, the channel B output switch may conduct (close) during delivery of the channel A output pulse, thereby causing unwanted current to flow through electrode B. Such action not only needlessly depletes the limited storage energy of the pacemaker, but can also cause an unwanted tissue stimulation of the area (chamber of the heart) where electrode B is located. Referring next to Fig. 5, a schematic diagram of the output switch of the present invention is shown. This output switch configuration includes the N-channel switch N1 in parallel with the P-channel switch P2 as in Fig. 2. In addition, there is included a second N-channel switch N3 having its drain terminal D3 connected to the source terminal S1 of the switch N1. The source terminal S3 of the switch N3 is connected to the P-well terminal of switch N1. Normally, as shown in Fig. 2 and Fig. 4, the P-well terminal is connected to the source terminal S1 by an appropriate electrical connection 32. (Note, that in a schematic representation, the P-well terminal of an N-channel device is depicted as an arrow pointing towards the line connecting the S1 and D1 terminals. This arrow is typically positioned adjacent to the S1 terminal.) As discussed above, this connection prevents an SCR from being formed from the parasitic bipolar transistors, and thus prevents latchup from occurring. In accordance with the present invention, however, the P-well of the N-channel switch N1 is not connected to the source S1. Rather, as shown, it is connected to the source S3 of the additional N-channel switch N3. (It is noted that the P-well of the N-channel switch N3 is connected, as usual, to the source terminal S3.) The gate G3 of switch N3 is connected through a resistor R1 to the output line 13. A diode 38 is also provided from the output line 13 to the positive supply voltage V DD . This diode 38 serves to protect the thin oxide insulating layer (layer 23 in the figures) of N3 from destructive breakdown. The resistor R1 and diode 38, hereafter referred to as gate protection circuit 40, can be realized using hybrid to monolithic techniques. Referring next to Fig. 6, a partial cross-sectional view of the output switch of the present invention is shown. Fig. 6 includes the two N-channel switches N1 and N3, and the various interconnections that are made therebetween. (Not shown is the P-channel switch P2.) Basically, the additional N-channel switch N3 is realized by inserting an additional P-well 32 into the N-substrate 22. Within the P-well 32, two additional N+ regions 34 and 36 are placed to function as the source S3 and the drain D3. The gate G3 is then realized in conventional manner by placing a metal or polysilicon layer above the region on the P-well 32 between the N+ regions 34 and 36. (Not shown in Fig. 6, but understood to be a part thereof, is the oxide insulating layer that electrically insulates the gates G1 and G3 from their respective P-wells, source regions, and drain regions.) Also, it is noted that the two N-channel switches N1 and N3 could be fabricated in the same P-well. A schematic diagram of the output switch configuration of Fig. 5, including the parasitic bipolar transistor Q3, is depicted in Fig. 7. As is evident from Fig. 7, the additional N-channel switch N3 is inserted so as to control the base current delivered to transistor Q3. Advantageously, the switch N3 opens whenever the output line 13 goes negative. This happens because the negative voltage appearing on the output line 13, from whatever source (external or internal) is coupled through r esistor R1 to gate G3. Because switch N3 is an N-channel MOSFET device, it turns OFF when a negative voltage is applied to the gate thereof. With the base circuit of transistor Q3 open in this manner, it cannot turn on when the output line 13 goes negative. Thus, no potentially destructive transient currents can flow from V DD to the output line 13. Moreover, with the switch N3 open, there is no path provided through which a current from the stored stimulation voltage SSV can flow through the base-emitter junction of Q3 to the output line 13. Thus, the blocking switch N3 prevents the parasitic transistor Q3 from turning ON, and thereby prevents undesired transient currents from flowing in the output switch circuits. It is noted that when the output line 13 is high -- when it is near V DD -- that transistor N3 is ON. Thus, the equivalent circuit configuration when the output line 13 is high is essentially that shown in Fig. 4. However, as soon as the output line starts to go more negative than SSV, the N-channel switch N3 opens, thereby preventing or blocking any currents from flowing through the parasitic transistor Q3. Advantageously, while the present invention includes an additional N-channel switch, such switch can readily be realized as an integral part of the same semiconductor substrate from which the other MOSFET devices used within the pacemaker are realized. Significantly, no additional discrete components are required, with the possible exception of resistor R1 and diode 38, which may be realized using discrete components. However, resistor R1 and diode 38 comprise a gate protection circuit 40 which can readily be realized in the same manner as are other gate protection circuits used for various other functions within the pacemaker circuits. It is further noted that with parasitic transistor Q3 having its base terminal opened by switch N3 that all current flowing through Q3 is prevented, not just limited in magnitude. This represents a significant improvement over the prior art where attempts were made to limit to nondestructive values the amount of current that could flow. The invention has been described with reference to N-channel devices formed on a N-substrate (thereby requiring the use of P-wells in order to realize the N-channel devices). The principles of the invention apply equally well to P-channel devices formed on a P-substrate (thereby requiring the use of N-wells in order to realize the P-channel devices). Similarly, the principles of the invention apply to any configuration wherein parasitic devices result that can cause undesired performance. Reference list V SS negative terminal V DD positive terminal / positive supply voltage SSV stored stimulation voltage SW1 output switch Q1 PNP transistor Q2, Q3 NPN transistor R1, R2 resistor P2 P-channel MOSFET switch / drain S1, S2, S3 source terminal D1, D2, D3 drain terminal G1, G2 gate layer / gate terminal G3 gate C1 storage capacitor C2 coupling capacitor N1 first N-channel MOSFET switch N3 second N-channel MOSFET switch 10 output switch circuitry / output switch configuration 11 battery 12 charge pump circuit 13 output signal line 14 output switch logic 15 signal line 16 output terminal 17 electrode tip 18 patient's heart 19 pacemaker lead 20 reference electrode / reference terminal 21 electrical return path 22 N- substrate /collector /semiconductor substrate 23 metal oxide insulating layer 24 P-well / P- region / base 25, 25' P+ region 26 N+ region 27 N+ region / emitter 28 P+ region / source terminal 29 P+ region / drain terminal 30 N+ region / effective resistance 32 additional P-well / conductor / electrical connection 34, 36 N+ regions 38 diode 40 gate protection circuit

Claims: A switch (SW1) in an implantable medical device for electrically connecting a first node (SSV) within the medical device to a second node (13) within the medical device, said switch (SW1) comprising a MOSFET (N1), which includes a source terminal (S1), connected to the first node (SSV), a drain terminal (D1), connected to the second node (13), a well terminal (25), connected to the source terminal (S1), and a gate terminal (G1), coupled to a control signal, and which MOSFET (N1) is formed in a well region (24) of a first polarity type (P-) within a semiconductor substrate (22) of a second polarity type (N-), said source and drain terminals (S1, D1) including regions (26, 27) of the second polarity type (N+) within the well region (24) and said well terminal (25) being electrically connected to said well region (24), characterized in that the electrical connection between the source terminal (S1) and the well terminal (25) includes a blocking switch (N3) for selectively preventing electrical signals from being applied to a base terminal of a parasitic bipolar transistor (Q3), which is formed by the structure of regions (22, 27) of the second polarity type (N-, N+) separated by the well region (24). Switch according to claim 1, characterized in that the blocking switch (N3) is a second MOSFET (N3), which includes a second source terminal (S3), a second drain terminal (D3), a second gate terminal (G3) and a second well terminal (25') and in that the second source terminal (S3) is connected to the well terminal (25) and to the second well terminal (25'), the second drain terminal (D3) is connected to the source terminal (S1) and the second gate terminal (G3) is coupled to a blocking signal, which selectively turns the second MOSFET (N3) to an ON state or an OFF state. Switch according to claim 2, characterized in that the second gate terminal (G3) is connected to the second node (13), whereby a potential on the second node (13), which is lower than a potential on the first node (SSV) will cause the second MOSFET (N3) to obtain the OFF state and thereby block any signals from being applied to the base of the parasitic bipolar transistor (Q3). Switch according to any of the preceding claims, characterized in that the blocking switch (N3) is formed on the semiconductor substrate (22). Switch according to claim 4, characterized in that the MOSFET (N1) and the blocking switch (N3) are formed in the same well region (24). Switch according to any of the preceding claims, characterized in that the switch (SW1) comprises a further MOSFET (P2), which includes a further source terminal (S2), a further drain terminal (D2) and a further gate terminal (G2) and which further MOSFET (P2) is formed on the semiconductor substrate (22), and in that the further source terminal (S2) is connected to the source terminal (S1), the further drain terminal (D2) is connected to the drain terminal (D1) and the further gate terminal (G2) is coupled to a gate signal, said gate signal being approximately synchronized with the control signal, so that both the MOSFET (N1) and the further MOSFET (P2) are in an ON state at substantially the same time in response to the control signal and the gate signal, respectively. Switch according to claim 6 in combination with claim 2, characterized in that the MOSFET (N1) and the second MOSFET (N3) are N-channel MOSFETs and in that the further MOSFET (P2) is a P-channel MOSFET.

Inventors: MORGAN, WAYNE A.
Applicants: SIEMENS AKTIENGESELLSCHAFT, SIEMENS ELEMA AB
Application year: 1987
Main classification: A61N1
IPC codes: A61N1, H03K17