A SEMICONDUCTOR LASER DEVICE

Abstract: A semiconductor laser device comprising a double-heterostructure that is composed of an active layer (15) and a pair of cladding layers (13,17) sandwiching the active layer (15) therebetween, a striped structure in which current injected into the laser device is confined, the striped structure being constituted by a part of the double-heterostructure, and optical guiding layers (14,16) positioned between one cladding layer (13) and the active layer (15) and between the active layer (15) and the other cladding layer (17), wherein the resistance of one optical guiding layer (16) positioned at the striped structure side is higher than that of the other optical guiding layer (14) positioned opposite to the striped structure side.

Description: BACKGROUND OF THE INVENTION 1.Field of the invention: This invention relates to a semiconductor laser device that attains laser oscillation at an extremely low threshold current level. 2.Description of the prior art: Conventional semiconductor laser devices are classified into two groups, gain-guided semiconductor laser devices and index guided semiconductor laser devices, according to their optical waveguiding mechanism. Index guided semiconductor laser devices are superior to gain-guided semiconductor laser devices in view of transverse mode stabilization that is important in practical use. Index guided semiconductor laser devices having a variety of structures have been proposed, in which light and current are confined within a narrow excitation region, so that the threshold current level for laser oscillation can be reduced. Typical examples of such laser devices that attain a low threshold current level are buried heterostructure (BH) laser devices and ridge-waveguide laser devices. Figure 2 shows a buried heterostructure laser device, which is produced as follows: A double-heterostructure, in which an active layer 3 for laser oscillation is sandwiched between a pair of cladding layers 2 and 4 is formed on a substrate 1, and then a cap layer 5 is formed, followed by etching to form a striped mesa. The area outside of the mesa is buried with a material 6 having a low refractive index, resulting in a waveguide with a width w of as narrow as about 2 µm so that a fundamental transverse mode oscillation can be achieved at a low threshold current level at about 10 mA or less. In order to effectively confine current within the mesa region that is essential to laser oscillation, the burying layer 6 must be constituted by a high resistive layer or by a multi-layer having a pn junction that is reverse to that of the mesa region. However, since the burying layer 6 is grown after the formation of the mesa region, an energy level arises at the interface between the burying layer 6 and the mesa region, which causes ineffective current of about 2-10 mA that flows through the said interface without passing through the active region. The proportion of the ineffective current to a total amount of current increases with a decrease in the width w of the waveguide, which causes a limitation of the lowering of the threshold current level of the laser device. Figure 3 shows a ridge-waveguide laser device, which is produced as follows: A double-heterostructure where an active layer 3 is sandwiched between the n- and p-cladding layers 2 and 4 is formed on a substrate 1, and then a cap layer 5 is formed, followed by etching to remove portions that reach the p-cladding layer 4 positioned above the active layer 3, resulting in a striped mesa, so that the effective refractive-index of the portion of the p-cladding layer 4 other than the mesa becomes lower than that of the mesa. The ridge-waveguide laser device is different from the BH laser device in that the entire area of the active layer 3 remains without being etched, and accordingly current injected into the ridge-waveguide laser device flows through the active layer 3. However, since a part of the p-cladding layer 4 of the ridge-waveguide laser device exists outside of the mesa, current injected into the ridge-waveguide laser device diffuses from the mesa of the p-cladding layer 4 into the portion of the p-cladding layer 4 other than the mesa, as indicated by arrow marks in Figure 3. An amount of current, which flows into a portion other than the portion of the active layer 3 positioned below the mesa within which laser light is confined, becomes ineffective current, causing an increase in the threshold current level of the ridge-waveguide laser device. "Electronics Letters" 21 , 1025 (1985) discloses a ridgewaveguide separate confinement GaAs/GaAlAs heterostructure laser comprising guiding layers between the active layer and the cladding layers. These structures have a minimum threshold current of 8mA at a cavity length of 300µm. The threshold current may be reduced by incorporating a superlattice buffer layer into the laser structure. GB-A-2 100 501 discloses a buried heterostructure laser including guiding layers between the active layer and the cladding layers. In both of these documents, both guiding layers have the same doping level, although the guiding layer positioned above the active layer is doped p-type whereas the guiding layer positioned beneath the active layer is doped n-type. "Soviet Technical Physics Letters" 12 , 574 (1986) discloses a PbS/PbSSe/PbSnSe heterostructure laser employing guiding layers between the active layer and the cladding layers, an upper guiding layer being doped p-type (p=8x10¹⁷ cm⁻³) and a lower guiding layer being doped n-type (n=1x10¹⁸ cm⁻³). SUMMARY OF THE INVENTION A semiconductor laser device according to this invention, which overcomes the above-discussed and numerous other disadvantages and deficiencies of the prior art, comprises a double-heterostructure that is composed of an active layer and a pair of cladding layers sandwiching said active layer therebetween; a striped structure in which current injected into said laser device is confined, said striped structure being constituted by a part of one of said cladding layers; a first optical guiding layer positioned between one cladding layer and said active layer, and a second optical guiding layer positioned between said other cladding layer and the active layer, said semiconductor laser device being characterised in that the electrical resistance of the optical guiding layer closer to the striped structure is higher than the resistance of the optical guiding layer further from the striped structure; and in that the thickness of a portion of a cladding layer outside the striped structure, said cladding layer being positioned at the striped structure side, is 50nm or less. In a preferred embodiment, the striped structure is formed into a mesa or a ridge. Thus, the invention described herein makes possible the objectives of (1) providing a semiconductor laser device with a ridge-waveguide type current path or a mesa-waveguide type current path in which the diffusion of current injected into the said laser device in the transverse direction is suppressed so that ineffective current that does not contribute to laser oscillation becomes minimal, thereby attaining the lowering of the threshold current level of the said laser device, and (2) providing a semiconductor laser device in which since an unetched active layer is used and an energy level does not arise at the interface between the active layer and the burying layer, a high yield of the said laser device and a high reliability can be attained, which is useful in practical applications. BRIEF DESCRIPTION OF THE DRAWINGS This invention may be better understood and its numerous objects and advantages will become apparent to those skilled in the art by reference to the accompanying drawings as follows: Figure 1 is a front sectional view showing a semiconductor laser device of this invention. Figure 2 is a front sectional view showing a conventional BH laser device. Figure 3 is a front sectional view showing a conventional ridge-waveguide laser device. Figure 4 is a front sectional view showing another semiconductor laser device of this invention. DESCRIPTION OF THE PREFERRED EMBODIMENTS Example 1 Figure 1 shows a semiconductor laser device, which is produced as follows: On an n-GaAs substrate (Si = 2 x 10¹⁸cm⁻³)11, an n-GaAs buffer layer (Si = 2 x 10¹⁸cm⁻³; the thickness thereof being 0.5 µm)12, an n-Al 0.7 Ga 0.3 As cladding layer (Si = 2 x 10¹⁸cm⁻³; the thickness thereof being 1.4 µm)13, an n-Al x Ga 1-x As GRIN (graded-index) layer ( Si = 5 x 10¹⁷cm⁻³; the thickness thereof being 0.2 µm)14, an undoped GaAs quantum well active layer (the thickness thereof being 60 Å; 1Å=0.1 nm)15, an unintentionally doped Al x Ga 1-x As GRIN layer (p∼10¹⁵cm⁻³; the thickness thereof being 0.2 µm)16, a p-Al 0.7 Ga 0.3 As cladding layer ( Be = 5 x 10¹⁷cm⁻³; the thickness thereof being 1.4 µm)17, and a p-GaAs cap layer (Be = 5 x 10¹⁸cm⁻³; the thickness thereof being 0.5 µm)18 are successively grown by molecular beam epitaxy. The AlAs mole fraction x of the GRIN layers 14 and 16 increases parabolically in the range of 0.2 to 0.7 with distance toward the cladding layers 13 and 17 from the quantum well active layer 15. The GRIN layers 14 and 16 function as an optical guiding layer. The unintentionally doped AlGaAs layer 16 that is grown by molecular beam epitaxy is of a p type with p∼10¹⁵ cm⁻³ due to the residual carbon impurities. Then, the wafer is etched by a reactive ion beam etching technique using Cl₂ gas in such a manner that the etched portion reaches the p-cladding layer 17, resulting in a striped mesa 100. The thickness of the portion of the p-cladding layer 17 outside of the striped mesa 100 is 500 Å or less. Then, a SiNx film 19 is formed by plasma assisted chemical vapor deposition on the wafer other than the cap layer 18. A p-sided electrode 20 of AuZn/Au and an n-sided electrode 21 of AuGe/Ni/Au are formed on the upper face of the SiNx film 19 including the cap layer 18 and the back face of the substrate 11, respectively, resulting in a semiconductor laser device. When the width of the lower portion of the striped mesa and the cavity length of the semiconductor laser device was 3.5 µm and 250 µm, respectively, the semiconductor laser device attained laser oscillation with an oscillation wavelength of 840 nm at a threshold current of 4 mA. Since the semiconductor laser device is designed so that the GRIN layer 16 having a relatively high resistance (p ≦ 1 x 10¹⁵ cm⁻³ ) is positioned above the active layer 15, and moreover the GRIN layer 14 and the AlGaAs cladding layer 13, both of which have a resistance lower than that of the GRIN layer 16, are positioned below the active layer 15, the diffusion of current that is injected into the active layer 15 through the striped mesa 100 can be effectively suppressed. Thus, a quantum well semiconductor laser device with the above-mentioned GRIN-SCH structure can achieve laser oscillation at a low threshold current level. Example 2 Figure 4 shows another semiconductor laser device of this invention, which is produced as follows: A multi-layered structure having an active layer 15 that is defined by a double-heterostructure is formed on an n-GaAs substrate 11 by molecular beam epitaxy in the same way as that shown in Figure 1. Then, a striped ridge 101 is formed by the use of a SiO₂ film (not shown) that functions as a mask, and on the wafer except for the top surface of the cap layer 18 of the ridge 101, an n-GaAs current blocking layer (Si=2 x 10¹⁸ cm⁻³; the thickness thereof being 2 µm) 30 is grown. Then, the SiO₂ film is removed, followed by the formation of a p-sided electrode 20 of AuZn/Au and an n-sided electrode 21 of AuGe/Ni/Au on the upper face of the current blocking layer 30 including the cap layer 18 and the back face of the substrate 11, respectively, resulting in a ridge-waveguide semiconductor laser device. When the width of the lower portion of the striped ridge 101 and the cavity length of the said semiconductor laser device were set to be 4 µm and 250 µm, respectively, the semiconductor laser device attained laser oscillation with an oscillation wavelength of 840 nm at a threshold current level of 8 mA. Since this semiconductor laser device is designed so that the thickness of the portion of the p-cladding layer 17 other than the striped ridge 101 is as thin as 500 Å or less, the diffusion of current can be effectively suppressed, as well. In this example, light is absorbed by the n-GaAs layer 30, thereby attaining the stabilization of a trasverse mode, and accordingly laser oscillation is achieved in a fundamental transverse mode when the width of the striped ridge 101 of the semiconductor laser device is set to be about 5 µm at the maximum. However, loss of the light-absorption arises to a great extent in the semiconductor laser device, so that the threshold current level at which laser oscillation is attained by the said laser device becomes higher than that of the laser device of Example 1 shown in Figure 1. Although the above-mentioned two examples disclose that the optical guiding layer 14 positioned at the n-cladding layer side is doped with an Si dopant in a concentration of 5 x 10¹⁷ cm⁻³ (i.e., Si=5 x 10¹⁷ cm⁻³) and the optical guiding layer 16 positioned at the p-cladding layer side is unintentionally doped to be of a p-type with p∼10¹⁵ cm⁻³, the carrier concentration of the n-sided optical guiding layer can be set to be 10¹⁷ cm⁻³ or more and the carrier concentration of the p-sided optical guiding layer can be set to be 10¹⁶ cm⁻³ or less, so that the resistance of the p-sided optical guiding layer becomes higher than that of the n-sided optical guiding layer and the diffusion of current in the transverse direction that is injected into the active layer through the striped mesa or ridge can be suppressed. Si, Te, Se, etc., can be used as an n-type dopant of each layer and Be, Zn, Mg, etc., can be used as a p-type dopant of each layer. Moreover, by the molecular beam epitaxy attaining the growth of layers with a high crystal purity such as that used in the above-mentioned examples, notwithstanding that the growth layers are not doped with dopants, a p-type growth layer with p∼10¹⁶ cm⁻³ can be obtained. Even when other crystal layer growth techniques such as liquid phase epitaxy, etc., are used, if n- or p-type growth layers with n∼10¹⁶ cm⁻³ or p∼10¹⁶cm⁻³ are obtained notwithstanding that the said growth layers are not doped with dopants, undoped optical guiding layers can be used as demanded. Moreover, the p-sided optical guiding layer can be of an n-type with n≦10¹⁷ cm⁻³. Since positive holes injected into the said n-optical guiding layer are a small amount of carrier, the extent of the diffusion of carrier is limited to as short as 1 µm or less so that the diffusion of current can be effectively suppressed. In addition, when the carrier concentration is 1 x 10¹⁷ cm⁻³ or less, the radiative recombination in the optical guiding layer is smaller than that in the active layer, and accordingly loss of the carrier injected as a remote junction does not become great. This invention is not limited to the laser device structure disclosed in the above-mentioned examples, any structure in which the portion of the p-cladding layer outside of the oscillating area is thinned to a thickness of 500 Å or less or removed and a current blocking function is achieved can be applied to this invention; for example, the current blocking layer 30 of the laser device shown in Figure 4 can be made of a semi-insulating material such as GaAs, AlGaAs or the like or an insulating material such as polyimide resin. Although the above-mentioned examples disclose a quantum well structure with the active layer the thickness of which is 60 Å, a growth layer having a thickness of several hundreds of angstrom to about 2000 Å can be formed as an active layer by liquid phase epitaxy, metal organic-chemical vapor deposition, etc. Moreover, the optical guiding layers are not necessarily GRIN layers, but they can be growth layers with a certain composition or can be GRIN layers the composition of which varies according to a distribution other than the parabolic distribution. The semiconductor laser device of this invention is not limited to the AlGaAs system, but is applicable to other semiconductor materials such as the InGaAsP system, the InAlGaP system, the AlGaAsSb system, the InGaAlAs system, etc.

Claims: A semiconductor laser device comprising:- a double-heterostructure that is composed of an active layer (15) and a pair of cladding layers (13, 17) sandwiching said active layer therebetween; a striped structure in which current injected into said laser device is confined, said striped structure being constituted by a part of one of said pair of cladding layers; a first optical guiding layer (14) positioned between one cladding layer (13) and said active layer (15), and a second optical guiding layer (16) positioned between said other cladding layer (17) and said active layer (15), said semiconductor laser device being characterised in that the electrical resistance of the optical guiding layer (16) closer to the striped structure is higher than the resistance of the optical guiding layer (14) further from the striped structure; and in that the thickness of a portion of a cladding layer (17) outside the striped structure, said cladding layer being positioned at the striped structure side, is 50nm or less. A semiconductor laser device according to claim 1, wherein said striped structure is formed into a mesa (100). A semiconductor laser device according to claim 1, wherein said striped structure is formed into a ridge (101).

Inventors: HAYAKAWA, TOSHIRO, KONDO, MASAFUMI, SUYAMA, TAKAHIRO, TAKAHASHI, KOSEI
Applicants: SHARP KABUSHIKI KAISHA
Application year: 1987
Main classification: H01S3
IPC codes: H01S5