HEAT ACTIVATABLE ADHESIVE FOR WIRE SCRIBED CIRCUITS

Abstract: A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­ sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­ urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ ating a reactio n with the functional groups of the poly­ meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­ vate the adhesive composition, said curing agent being pre­ sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­ tion is suitable for bonding wire to a surface, to another wire or to itself.

Description: This invention relates to an adhesive coating composition which can be heat activated without becoming C-staged, and later can be C-staged. More particularly, this invention relates to such adhesice coating compositions which are non-blocking and suitable for bonding a wire to a surface, to another wire or to itself. Heat activatable adhesive compositions can be applied to a substrate as a thin, non-tacky film, can be heat activated and when activated, become and remain tacky for a period of time after activation. Most heat activated thermoplastic adhesives resolidify rapidly upon cooling and have a short open time, i.e.,after activation of the adhesive, it remains aggressively tacky and bondable below the activation temperature for only a short time. Bonding operations must be carried out quickly. In many bonding operations, it is necessary to employ adhesive compositions which result in adhesive bonds exhibiting resistance to elevated temperatures. It is known that improved temperature resistance of adhesive compositions can be achieved by the incorporation of crosslinking into the compositions. Particular crosslinking agents known in the art include polyepoxides and optional epoxy polymerization catalysts, wherein crosslinking is achieved by reactions with available sites in the base polymers. Crosslinking of an ethylene/vinyl acetate/vinyl alcohol terpolymer using isophthaloyol biscaprolactum or vinyl triethoxy silane is achieved before heat activation, but a higher level of performance is attained by additional crosslinking induced by a heat cure after application of the adhesive. Another example of thermal crosslinking is the polyamino bis maleimide class of flexible polyimides. These compositions can be hot melt extruded up to 150°C and undergo crosslinking at temperature above 150°C. Thermosetting adhesive compositions are known which combine polyisocyanates with binders which contain groups that are reactive toward isocyanate groups. However, considerable difficulties result from the fact that the isocyanate group reacts with the envisaged reactant, e.g., a polyol or a polyamine, at as low as room temperature. As a result, it is extremely difficult to formulate a combination having a long shelf life. In order to overcome this difficulty, two-component systems are frequently used. The reactants are stored in separate formulations, which are mixed only just before application; the reaction then takes place spontaneously or is accelerated by heat and/or a catalyst. Disadvantages of this system are the necessity for separate formulation and storage of the two components, the difficulties in precise metering and thorough mixing before application, and the danger of blockage of the mixing apparatus and applicator as a result of premature reaction. Another conventional method of preparing polyisocyanate materials having a long shelf life starts from non-cross-linking prepolymers which contain only a small amount of free isocyanate, atmospheric moisture serving as the crosslinking agent. The disadvantage is that the hardening, which begins at the surface, extends only very slowly to the deeper regions of the coating, so that the final properties are acquired only after weeks or months. No hardening at all occurs between large areas or in cavities. Stable systems also can be formulated if the polyisocyanate is first reacted with a monofunctional reactant. The resulting adduct is referred to as a blocked isocyanate if it is less heat-stable than the product of the crosslinking reaction to be carried out subsequently. Under the action of heat, the blocking agent is eliminated, and the polyisocyanate undergoes crosslinking, forming more heat-stable bonds. Such formulations have technical and economic disadvantages: if the blocking agent remains in the crosslinking material, it changes the properties of the latter; if it vaporizes, it either has to be recovered or has to be removed from waste air. Also known are polyisocyanates which melt above 100°C to 130°C, and which, with special polyols, give combinations which have long shelf lives and which can be hardened by heating to give coatings for fabrics or woven hoses. The industrial disadvantage of these combinations is that products having a long shelf life can be obtained only with a very small number of polyols having a special composition; therefore, these combinations are suitable only for a limited number of uses. In US patents 3,646,572 and 4,097,684 is described a catalytic adhesive for wire scribed circuit boards which comprises a flexible adhesive resin, alone or in combination with thermosetting resins. The flexible adhesive resins include epoxy resins, polyvinyl acetal resins, polyvinyl alcohol, polyvinyl acetate, natural and synthetic rubbers and acrylic polymers and copolymers. Preferred for use as the adhesive resin are natural and synthetid rubbers such as chlorinated rubber, butadieneacrylonitrile copolymers, and acrylic polymers and copolymers. The adhesive layer is in the form of a partially cured thermosetting resin which is non-tacking at room temperature, but which, upon application of heat below the thermosetting temperature, becomes malleable and provides an adhesive bond when heated momentarily and cooled. In a step of the aforementioned process, after the wire conductor pattern is completed, it is permanently bonded to the substrate by pressing the wire conductors into the adhesive layer with heat and pressure, further curing the adhesive, or, by covering the wire conductors with a glass cloth reinforced, epoxy prepreg and then laminating the wire conductors into the adhesive with heat and pressure. Adhesives of this composition have been used commercially for many years in the manufacture of wire scribed circuit boards. In the aforementioned laminating step, occasionally, the hydraulic pressure of the melted epoxy resin, and partially melted adhesive layer beneath moves the wire conductors. Attempts to eliminate this "wire swimming" by increasing the partial cure of the adhesive before writing, or by baking after the wire conductor pattern had been completed, or by modifying the laminating conditions were not successful. Furthermore, the volume resistivity of layers of this type of adhesive is about 1 x 10⁴ to 1 x 10⁶ Megohms because high rubber content is needed to give tack for ultrasonic or heat bonding of the wire to the adhesive. In some applications requiring high insulation resistance, higher volume resitivity is desired. It is an object of this invention to provide an adhesive coating composition which is non-tacky at room temperature and activatable upon application of sufficient heat or ultrasonic energy without becoming C-staged and later can be C-staged. It is also an object of this invention to provide an adhesive coating composition for wire scribed circuits with a volume resistivity, over the temperature range from 20°C to 120°C, which is at least an order of magnitude greater than the volume resistivity achieved with the prior art adhesives used for wire scribed circuits. Another object of this invention is to provide an adhesive which may contain up to 25% volatiles for facile ultrasonic activation, and also remains non-tacky in the absence of heat and pressure. It is a further object of this invention to provide a substrate with an adhesive coating thereon for preparation of wire scribed circuit boards. Still another object of this invention is to provide an adhesive coating for wire which is non-blocking to itself and other surfaces, and which is flexible prior to activation and which can adhere a wire to another coated wire or to an insulating substrate with a bond strength greater than 30 grams on 0.1 mm diameter wire. Unless otherwise defined herein, the terms used in this application are defined as set forth in the American Society for Testing and Materials Standard D907-82. By 'heat activatable adhesive' is meant a dry adhesive film that can be rendered tacky or fluid by application of heat or ultrasonic energy or heat and pressure. By 'hot melt adhesive' is meant an adhesive that is applied in a molten state and forms a bond on cooling to a solid state. By 'B-stage' is meant an intermediate stage in the reaction of certain thermosetting resins in which the material softens when heated and swells when in contact with certain liquids, but may not entirely fuse or dissolve. The resin in an uncured thermosetting adhesive is usually in this B-stage. By 'blocked curing agent' is meant a curing agent or hardener which has been rendered unreactive and can be reactivated as desired by physical or chemical means. By 'blocking' is meant an undesired adhesion between touching layers of a materials such as occurs under moderate pressure during storage or use. By 'bond strength' is meant the unit load applied in tension, compression, flexure, peel, impact, cleavage, or shear, required to break an adhesive assembly with failure occurring in or near the plane of the bond. By 'C-stage' is meant the final stage in the reaction of certain thermosetting resins in which the material is relatively insoluble and infusible. Certain thermosetting resins in a fully cured adhesive layer are in this C-stage. By 'doctor-bar or blade' is meant a scraper mechanism that regulates the amount of adhesive on the spreader rolls or on the surface being coated. By 'doctor-roll' is meant a roller mechanism that is revolving at a different surface speed, or in an opposite direction, resulting in a wiping action for regulating the adhesive supplied to the spreader roll. By "filler" is meant a relatively non-adhesive substance added to an adhesive to improve its working properties, permanence, strength, or other qualities. By "tack" is meant the property of an adhesive that enables it to form a bond of measurable strength immediately after adhesive and adherent are brought into contact under low pressure. By "thermoplastic" is meant a material which will repeatably soften when heated and harden when cooled. By "thermoset" is meant a material that will undergo or has undergone a chemical reaction by the action of heat, catalysts, ultraviolet light, etc. leading to a relatively infusible state. By "T g " is meant the glass transition temperature, the temperature at which an amorphous high polymer changes from a brittle vitrous state to a plastic state. By "onset of T g " is meant the beginning of a glass transition in the blend of polymers in an adhesive as measured by differential scanning, calorimetric or thermal mechanical analysis. By "onset of T m " is meant the beginning of a polymer melting in the blend of polymers in an adhesive as measured by thermal mechanical analysis. By "wire scribing" is meant affixing a wire to an insulating base to form an interconnection pattern. The solid, non-blocking adhesive composition of this invention which is thermosetting and can be heat-activated to its tacky state upon application of sufficient heat or ultrasonic energy without becoming C-staged and which, upon dissipation of said energy, rapidly returns to its non-activated state, comprises a) a film-forming polymeric resin, or first component, having a hydroxyl or unsaturated functionality greater than about 2 and selected from the group of polyols consisting of polyester resins, polyurethanes, polyether resins, epoxy resins, and combinations thereof, said resin having been reacted to the B-stage with a first curing agent which was present either in less than a stoichiometric quantity, or was capable of reacting with functional groups that were present at concentrations of three or less on the polymeric chain, said B-staged resin having an average molecular weight between 10.000 and 100.000, and said first curing agent being a polyisocyanate, polyisocyanurate or free radical initiator, and having been present in an amount sufficient to react with 10 to 60% of the hydroxyl groups to B-stage the polymeric resin sufficiently to provide the composition with non-blocking properties; b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below 7.000, or mixtures thereof, the weight ratio of said first component to said second component being between 1,5 : 1 and 9 : 1; and c) a second curing agent which is capable of initiating a reaction with the hydroxyl groups of the polymeric resin form cross-links and cure the polymeric resin to the C-stage upon application of sufficient energy, said second curing agent being non-reactive or blocked when the adhesive composition is activated; said composition being flexible, and in the C-stage capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 288°C and does not soften when exposed for 10 seconds to dichloromethane at 25°C. In one embodiment of the invention, the composition as described hereinabove wherein the film forming polymeric resin is an epoxy resin which has been reacted to a B-stage polymer having an average molecular weight greater than 30.000; and comprising a polyfunctional resin having an average molecular weight below 5.000 and containing a polyphenol backbone, and the weight ratio of said first to said second component being between 1 : 1 and 3 : 1; and comprising a curing agent which is capable of reacting or initiating a reaction with the functional groups of at least one of the resins to form crosslinks and cure the resin to a C-stage upon application of sufficient energy, said curing agent being non-reactive or blocked at the conditions which will activate the adhesive composition, said curing agent being present in an amount sufficient to C-stage at least one of the resins; said composition, in the C-stage, being capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and which does not soften when exposed for 10 seconds to dichloromethane at 25°C. Suitable film forming polymeric resins according to this invention may be obtained by using a polyol intrinsically having an average molecular weight between 10.000 and 100.000, preferably greater than 15.000, more preferably greater than 30.000, and preferably less than 70.000, or by reacting a low molecular weight polyol of this invention to a B-stage with a curing agent which is present either in less than a stoichiometric quantity or is capable of reacting with three or less functional groups that were present at low concentrations on the polymer chain. Preferably, the curing agent used for B-staging the low molecular weight polyol is an isocyanate or an amide. The film forming polymeric resins used in this invention provide adhesion and flexibility for the adhesive composition. Adhesion to a variety of surfaces is enhanced by polar groups along the polymer chain. Flexibility of the adhesive composition is provided by internal plasticization of aliphatic portions of the polymeric resin. Suitable polyesters include those prepared from (1) one or more diacids selected from saturated and unsaturated aliphatic dicarboxylic acids containing from 4 to 10 carbon atoms, aromatic dicarboxylic acids selected from terephthalic acid, isophthalic acid, phthalic acid, 4,4'-diphenylthioether dicarboxylic acid, 4,4'-diphenylamine dicarboxylic acid, and saturated and unsaturated aliphatic dimer acids (i.e., the polymerized product of two molecules of an unsaturated fatty acid containing 12 to 16 carbon atoms) and mixtures and derivatives thereof; and (2) one or more saturated or unsaturated aliphatic diols containing from 2 to 12 carbon atoms, long chain aliphatic diols having an average molecular weight of 200 to 4000, polyethylene oxide and polypropylene oxide polymers and copolymers, and allyl ethers of polyethylene and polypropylene oxide, and polyhydroxyl compounds such as glycerine, trimethylolpropane and neopentyl alcohol and mixtures and derivatives thereof. Suitable epoxy resins include diglycidylethers of bisphenol A having epoxy equivalent weights of 400 to 6000, diglycidylethers of halogenated bisphenol A having epoxy equivalent weights of 450 to 2000, epoxy novolacs or polyglycidyl-ethers of phenol-formaldehyde, polyglycidyl ethers of tetraphenylethane and polyglycidyl ethers of resorcinol. Also suitable are very high molecular weight copolymers of bisphenol A and epichlorhydrin with molecular weights over 50.000. Preferred epoxy resins are diglycidylethers of bisphenol A having epoxy equivalent weights of 1000 to 6000. Suitable polyurethanes include the reaction products of diisocyanates and polyesters, polyethers or polyester/polyether copolymers. Preferred polyurethanes are those containing aliphatic linkages of 100 to 1000 daltons. It is also preferred that the polyurethanes contain some aromatic groups (e.g., isophthalate or terphthalate ester linkages groups or toluene diurethane groups). More preferably, the polyurethanes contain allyl, methallyl, acrylic or methacrylic groups. The film forming polymeric resin has an epoxide, hydroxyl or unsaturated functionality greater than 2. The functionality is available for cross-linking with a curing agent to C-stage the adhesive composition. Examples of unsaturated functional groups include vinyl, allylic, methallylic, and acrylic, methacrylic and 1-propenyl groups. The adhesive composition may contain one or more polyfunctional compounds containing polyaromatic backbones and having an average molecular weight below 7000, and preferably between 500 and 5000, one or more fillers, or mixtures thereof. The polyfunctional compound serves a dual purpose: (1) it provides the C-staged adhesive composition with high.temperature and solvent resistance; and (2) is enhances the non-blocking properties of the C-stageable adhesive composition, especially when the polyfunctional compound is B-staged or B-staged together with the film forming polymeric resin. Suitable polyfunctional compounds containing polyaromatic backbones include (1) epoxy resins and epoxy novolac resins such as diglycidylethers of bisphenol A, polyglycidylethers of phenol-formaldehyde, polyglycidylethers of tetraphenylethanes, and polyglycidylethers of resorcinol; (2) polyaromatic compounds having acryloyloxy or methacryloyloxy and allyl, methallyl or 1-propenyl groups in the molecule, acrylate and methacrylate esters of di- and polyepoxides; (3) polyaromatic epoxide resins having at least two epoxide groups and at least two photopolymerizable groups per average molecule; and (4) polyisocyanates and polyisocyanurates containing multiple aromatic groups, e.g., triisocyanurates of toluene diisocyanates. The filler enhances the non-blocking properties of the adhesive composition. Moreover, the filler reinforces, and controls shrinkage during cure of the adhesive composition. Examples of suitable fillers include inorganic carbonates, oxides, sulfates, sulfides, calcium carbonate, calcium sulfate, barytes, blanc fixe, zinc sulfide silica, diatomaceous earth, clays, magnesium silicate, wollastonite, alumina hydrate, zinc oxide, titanium dioxide, ziconias, zirconium silicate,and organic fillers such as organic pigments and insoluble polymer powders. Preferred fillers include alumina trihydrate, silica, zirconium silicate and polyethylene powders. The selection of the curing agent to crosslink the functional groups and cure the adhesive composition to C-stage will depend on the functional groups available. If the functional groups are hydroxyl, the curing agent may be selected from blocked isocyanates which, at temperatures above 75°C, preferably above 100°C, unblock. If the functional groups available in the B-adhesive composition are epoxide, the curing agent is selected from latent epoxy curing agents such as dicyandiamide and the boron trifluoride-monoethylamine complex. Other latent curing agent systems believed to be suitable include anhydride curing agents with latent catalysts including dodecenyl succinic anhydride, chlorendic anhydride, hexahydrophthalic anhydride, NADIC methyl anhydride, phthalic anhydride, succinic anhydride and tetrahydrophthalic anhydride. Latent catalysts for use with anhydride curing agents include boron trifluoride-monoethylamine complex, quaternary ammonium halides such as benzyltrimethylammonium chloride, stannous octoate, zinc stearate, extra-coordinate siliconate salts, triethanolamine borate, triethanolamine titanate and quaternary phosphonium compounds such as methyltrioctyl-phosphonium dimethylphosphate, tetrabutylphosphonium acetate, methyltributylphosphonium dimethylphosphate, benzyltriphenylphosphonium chloride, tetrabutylphosphonium chloride, methytriphenylphosphonium dimethyl phosphate and triphenylethylphosphonium iodide. Also suitable for cross linking epoxide groups are blocked Lewis acid catalysts which can be unblocked by UV radiation. The blocked Lewis acid catalysts include aromatic iodonium complex salts. If the functional groups available for curing the adhesive composition to C-stage are unsaturated carbon-carbon double bonds, a free radical initiator is used as curing agent. Suitable free radical initiators which are activated by heat include 1,1'-azobis(cyclohexane carbonitrile), dicumyl peroxide, 1,1'-bis(tert-butylperoxy)-diisopropylbenzene and the like. Suitable free radical photoinitiators include benzoin, benzoin alkyl ethers, benzil ketals, dialkoxyacetophenones, di- and trichloroacetophenones, benzophenone, 4,4'-dimethyl-aminobenzophenone, thioxanthone derivatives such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone and the like, fluorenone, dibenzosuberone, 6,11,-dihydrodibenzothiepin-11-one, 2-chlor-6,11-dihydro-dibenzothiepin-11-one, and quinones such as anthraquinone, 2-ethylanthraquinone, tertiary butyl anthraquinone, and anthraquinone sulfonate. Preferred is 2,2-dimethoxyphenyl-2-acetophenone. The adhesive coating compositions may contain additives such as flow control agents and wetting agents to improve the wire coating process; pigments or colorants; and surface lubricants to enhance anti-blocking properties. Such conventional additives are well known to those skilled in the art. It has been discovered that the ratio of film forming resin to filler and/or polyfunctional compound should be in the range from 1.5 : 1 to 9 : 1. Preferably, the ratio is between 2 : 1 and 7 : 1. It has been found that when the ratio is below 1.5 : 1, the adhesive composition, when B-staged, forms a poor film and is difficult to uniformly coat on the wire, and when C-staged, the adhesive composition is brittle and may crack or brake under stress. When the ratio is above 9 : 1, the adhesive composition, when C-staged, does not have resistance to molten solder at 260°C and becomes crazed, pitted or stress corrodes when exposed to dichloromethane at 25°C for one minute. The polymeric resin may be formed by reacting polyisocyanates with a low molecular weight polymer having a hydroxyl functionality greater than 2, said polymer selected from the group consisting of polyesters, polyethers, and epoxies. The solid adhesive composition of this invention also may include a polyester resin having an average molecular weight between 1000 and 15000, said polyester resin having a hydroxyl functionality greater than 2. In one embodiment, the functional groups of the film forming polymeric resin are hydroxyl and the curing agent is a blocked polyisocyanate. In another embodiment, the functional groups of the film forming polymeric resin are unsaturated double bonds such as acrylic and allylic groups, and the curing agent is a free radical initiator. It has now been found possible, by controlling the amount and type of crosslinking introduced into a C-stagable adhesive coating composition, to render said composition heat activatable until said composition is C-staged. Thus, until the adhesive coating composition of the invention is C-staged, it can be rendered tacky upon application of sufficient heat or ultrasonic energy and will rapidly resolidify upon cooling, i.e., upon dissipation of said energy. The resolidified adhesive coating composition can be C-staged which will increase the temperature resistance of the composition without altering other desirable properties, i.e., the dimensional stability and adhesive strength of the composition. In preferred compositions, e.g., crosslinking is achieved at a temperature higher than that required for heat activation through use of a polyol as defined above having a hydroxy or acrylate functionality greater than 2 and a blocked isocyanate crosslinking agent or an ultra-violet curing agent capable of reacting with either the hydroxylated or acrylated polyol and any available sites (e.g., residual functionality) in the polyol. The time for activation of the adhesive coating is preferably short. Wire scribing speeds vary up to 250 mm/sec. The normal wire scribing speed is 75 mm/sec. The adhesive is activated simultaneously with, or the instant before wire scribing to avoid activated adhesive damaging the wire feeding mechanism. The length of adhesive activated at one time is preferably less than 10 mm, and more preferably 0.1 mm. The activation time is preferably less than 1 second, more preferably in the range of 0.2 to 200 milliseconds. The temperature for activation is below or up to the unblocking temperature for the blocked curing agents. The blocked curing agents are subsequently reacted at temperatures generally higher than the heat activation temperature of the adhesive and for time periods in the range of 5 to 500 minutes. The adhesive coating compositions of this invention may be applied to substrates well in advance of the actual bonding operation. The composition may simply be activated by heat, light or ultrasonic energy when it is desired to perform the bonding operation. This permits bonding at the work site to be accomplished without the presence of flammable solvents. Regarding the means of application, the adhesive compositions of the invention may be applied to substrates as solutions in volatile organic solvents (such as butanone, toluene, xylene, glycol ethers, glycol ether acetates, and the like) by methods common to solvent-based adhesives, i. e., spray coating, doctor-blade coating, roll coating, doctor-roll coating, and the like. The result in any case is a non-tacky, solid, crosslinkable adhesive layer which dries quickly in air and which can be heat activated immediately or thereafter up to the time it is C-staged. Since the adhesive coating compositions of this invention can be applied as a solution which is then dried, they are useful for encapsulating wires or as an adhesive layer on a substrate such as a printed wiring board. The adhesive coating compositions of this invention have many advantageous properties. For example, the property of being non-blocking when in the solid form allows an adhesive-coated wire to be spooled. The heat activatable property prior to be C-staged allows the wire to adhere rapidly and easily to another substrate or to itself. The C-stagable property allows the adhesive composition to be an excellent insulator and to withstand high temperature service and harsh chemical environments. The adhesive bond between the wire and the substrate may be measured on a straight section of wire by vertically peeling the wire in a direction away from and perpendicular to the board surface, or alternatively peeling the wire in a direction along the board surface which is transverse to the cylinder axis of the wire. A C-staged adhesive according to this invention is capable of bonding a 0.1 mm diameter wire with a peel strength of 30 to 60 grams. EXAMPLE 1 A heat activatable adhesive was prepared with a blend of a B-staged polymer of a high molecular weight allylic urethane and a B-staged epoxy acrylate. The B-stage mechanism is the reaction of polyisocyanurate with the hydroxyl groups of both polymers. An UV initiated, free radical curing agent was incorporated in the blend to enable complete curing to a C-stage composition through the allylic and acrylic groups on the polymers. The adhesive was prepared from the formulation below: Preparation of the heat activatable adhesive solution. 15 g of the diacrylate epoxy ester was reacted with 9.6 g of polyisocyanurate solution for 3 hours at 95°C to B-stage the epoxy acrylate resin by crosslinking the hydroxyl groups. This produced a B-stage epoxy acrylate polymer with an average molecular weight of 5400. The allylic polyurethane resin was reacted with 10 g of polyisocyanurate solution for 1 hour at 95°C. This polymerized the resin to a B-stage polymer with an average molecular weight of 30 000 to 40 000. The two B-stage polymers were combined and refluxed for 1 hour at 95°C. Butanone was added as necessary to control viscosity. After refluxing the B-stage polymers together, the solution was cooled and 3.5 g of 2,2-dimethoxy-2-phenylacetophenone and 0.5 g of 4-methoxyphenol dissolved in 30 g of butanone were added to the polymers. The weighing dish used to weigh the 2,2-dimethoxy-2-phenylacetophenone and 4-methoxypehnol was washed three times with 20 g of butanone and the wash solvent was also added to the polymer solution. The solution was then mixed thoroughly for 30 minutes and weighed. 7% by weight toluene was added, and then the solution was mixed for an additional 30 minutes. Application of heat activatable adhesive to wire. Copper wire 0.1 mm in diameter covered with a layer of polyurethane insulation to a diameter of 0.14 mm was coated with a uniform layer of adhesive by repetitively passing the wire through the adhesive solution, drawing the wire through a diamond die and passing it through an oven to dry the coating and remove residual solvents. For each repetition of the process, the diamond die was of larger diameter. The first die was 0.152 mm diameter and the diameter of each succeeding die was 0.0063 mm larger than the previous die. The coating process was continued until the outside diameter of the wire with the dry, heat activatable adhesive coating was 0.26 mm to 0.27 mm. The wire was wound on a spool for storage until use. The wire was coated and stored in areas where UV light wax excluded. The heat activatable adhesive coating on the wire did not block in storage. Bonding adhesive coated wire to a substrate. The wire coated with the heat activatable adhesive was wire scribed to six printed wiring boards to modify a conductive pattern on a surface of the boards. During the scribing process, the wire was automatically placed on and bonded to the surface of the printed wiring boards comprising solder mask areas, epoxy substrate areas and exposed metal areas. The printed wiring boards were mounted on a moveable work table. The wire was fed onto the surface of the boards from a scribing head assembly and laid on the board surface by moving the work table relative to the scribing head assembly and by rotating a scribing feed mechanism in a predetermined direction. The wire scribing head assembly and the table were numerically controlled. As the wire was fed toward the surface, and just prior to reaching it, the portion of the heat activatable adhesive coating which would next contact the surface was exposed to a beam from a CO₂ laser (Model RF 165®) with a radio frequency excited wave guide, 20 Watts power output CW (continuous wave), a Gaussian beam shape, and having a maximum modulation frequency of 10 kHz. The laser energy was dischared at the wire in the form of a pulsed beam. The pulse width of the beam was about 200 microseconds, and the pulse amplitude about 20 Watts. The spot from the beam was approximately circular and had a diameter of about 1 mm. The beam was pulsed when the wire had been scribed about 0.2 mm. The maximum scribing speed was about 5 m/min. The spot size and pulse frequency were adjusted so that each section of heat activatable adhesive coated wire received about five overlapping laser pulses. The activated adhesive coating contacted the surface of the printed wiring board and the adhesive coating became non-tacky and formed a solid bond with the surface in about 200 milliseconds. The wire was securely bonded by the heat activated adhesive to the solder mask, epoxy substrate and exposed metal areas as well as to other scribed wires. The bond of the wire to the surface measured by peeling the wire along the surface in a direction transverse to the wire path ranged between 40 and 90 g. When all the wires to modify the conductive pattern had been scribed to the boards, they were exposed to 19.5 joules/cm² of UV light to cure the heat activated adhesive to the C-stage. Printed wiring boards with the wire scribed conductors were soldered at 265°C for 10 seconds. There was no failure of the adhesive bond between the wires and the substrate, and no visible evidence of attack on or damage to the adhesive coating. The boards were then placed in dichloromethane for 2 minutes, dried in air at ambient temperature for 10 minutes and examined with the aid of a microscope. There was no failure of the adhesive bond between the wires and the substrate, and no pitting, crazing or other indication of attack on the adhesive coating. EXAMPLE 2 A heat activatable adhesive was formulated from a polyester resin believed to have a molecular weight of about 20 000 and a hydroxyl functionality of 2, and with a blocked isocyanate to provide a C-stage curing agent for the final cure. The ratio of resin to blocked isocyanate was 10 : 3. The formulation is as follows: The ingredients were milled together on a three roll paint mill and diluted with to 20% solids with methyl ethyl ketone for coating on wire. A film of adhesive was cast by doctor blade, dried with hot air and cured for 45 min. at 85°C, 45 min. at 120°C, and 45 min. at 155°C. After curing, the onset of T m was 120°C - 130°C. Insulated wire 0.14 mm in diameter with a copper core 0.1 mm in diameter was overcoated with a layer of the heat activatable adhesive and dried with forced hot air. The application of adhesive was repeated until the diameter of the wire plus the heat activatable adhesive was increased to 0.27 mm (at least 85% larger than the original diameter). The thus coated wire was scribed onto the surface of a glass cloth reinforced epoxy laminate (NEMA type FR-4) using a numerically controlled wire scribing head assembly and work table similar to Example 1. A hot air jet (air heated to a temperature of 120°C to 150°C)was used to activate the adhesive layer instead of the laser beam used in Example 1, and the roller on the scribing head was used to place the activated adhesive coated wire in contact with the board surface as in Example 1. The bond of the wire to the surface measured by horizontally peeling the wire perpendicular to the wire path ranged between 30 and 50 g. After wire scribing, the laminate was heated to at least 120°C to crosslink the adhesive forming an infusible bond between the wire and the laminate capable of withstanding molten solder at 288°C for 10 seconds. The laminate was heated in three stages to crosslink the adhesive: 45 min. at 85°C, 45 min. at 120°C, and 45 min. at 155°C. The wire scribed circuit patterns were soldered at 260°C for 10 seconds. After soldering, no lifting or deterioration of the adhesive or of the bond between the wire and the laminate was apparent. The wire scribing was repeated except that instead of activating the adhesive layer with a laser beam or a hot air jet, it was activated ultrasonically. The ultrasonic system includes an ultrasonic generator, a power supply, a coil, a transducer, feedback elements and a stylus tip. The heat activatable adhesive coated wire was fed through the scribing heat and the stylus tip, which has a groove under which the adhesive coated wire fits. The ultrasonic transducer produced mechanical vibrations at a rate of about 25 kHz. These vibrations activated the adhesive coating and adhered the wire to the substrate. EXAMPLE 3 A heat activatable adhesive coating composition was prepared based in a diacrylate ester of a diepoxy bisphenol A resin combined with a solid epoxy resin. The diacrylate ester resin was CMD 3703 ® and the solid epoxy resin had an epoxy equivalent weight of 1600. In order to make a non-blocking adhesive formulation, the molecular weight of the epoxy resin was increased from about 3200 to over 35000 by reacting it with a polyamide curing agent. Similarly, the molecular weight of the diacrylate ester was modified with 3 g of a polyisocyanurate (DEMODUR IL ® ) per 100 g of epoxy acrylate ester to partially cure or B-stage the system and increase the molecular weight from 830 to about 5500. The epoxy acrylate ester and the polyisocyanurate were refluxed at 80°C for 30 minutes to B-stage the epoxy acrylate ester before adding the other components of the adhesive. A free radical initiator was also added to the heat activatable adhesive formulation to cure the adhesive to the C-stage after it has been used to bond scribed wires to a board. For thermal curing, dicumyl peroxide was added. Dicumyl peroxide generates free radicals at temperatures in excess of 150°C. For UV light curing, 2,2-dimethoxy-2-phenylacetophenone was used as a free radical generator. The adhesive was refluxed at 80°C for 30 minutes to B-stage the adhesive before coating the wire. The final formulation was: This composition was dissolved in methyl ethyl ketone to make a solution with 20% solids. The solution was applied to an insulated wire with an outside diameter of 0.14 mm, and the adhesive coating was dried with forced air at 65°C. The overall diameter of the wire was increased to 0.23mm (64%). The heat activatable adhesive coated wire was scribed to an FR-4 substrate with hot air jet activation, as in Example 2. The adhesive bond of the wire to the substrate was much lower than in Example 2. Wire was coated with the same adhesive solution to obtain an overall diameter of 0.26 mm (85% increase). Good adhesion was obtained by scribing the wire of 0.26 mm diameter, showing that a heavier coating of adhesive on the wire is preferable to achieve a superior bond of scribed wire to the substrate. EXAMPLE 4 A heat activatable adhesive which can be converted to a C-stage by UV radiation was formulated as follows: The epoxy diacrylate ester and the polyisocyanurate were refluxed together at 95°C for 3 hours to form a higher molecular weight epoxy acrylate before mixing the rest of the formulation together. The 2,2-dimethoxyphenyl-2-acetophenone and 4-methoxyphenol were dissolved in 5 g of butanone. The formulation was compounded on a Cowles Dispersator ® for 30 minutes to form a uniform adhesive solution. The adhesive was coated on wire as in Example 1. The wire was scribed on a printed wiring board and the adhesive cured to a C-stage as in Examp1e 1. The bond of the wire to the surface measured by peeling the wire in a direction along the surface and transverse to the wire path ranged between 85 and 110 g. After curing, the bond between the wire and the surface was not affected by soldering or by 2 minutes immersion in dichloromethane. EXAMPLE 5 The solution of heat activatable adhesive of Example 4 was doctor blade coated on an FR-4 epoxy-glass laminate. The wet film thickness of the heat activatable adhesive coating was 0.1 mm. The adhesive coating on the substrate was dried for one hour at 38°C; thereafter, the adhesive film thickness was 0.06 mm. A discrete wire conductor pattern was wire scribed on the adhesive coated laminate with copper wire having a diameter of 63 µm, polyimide insulation of 20 µm, and an outer coating of polyvinyl butyral, 8 µm thick. The wire was scribed into the heat activatable adhesive layer using ultrasonic energy as described in Example 1, except that instead with a laser beam, it was activated with an ultrasonic system. After the discrete wire conductor pattern pattern was formed, the heat activatable adhesive layer was crosslinked to a C-stage by exposure to UV light. EXAMPLE 6 A heat activatable adhesive was prepared by the procedure of Example 4 except that the polyisocyanurate was omitted, and the epoxy diacrylate ester was not refluxed or reacted prior to adding it to the adhesive solution. The formulation was as follows: The heat activatable adhesive solution was cast as a film by doctor blade in order to measure the T g . After drying and before UV radiation curing, the onset T g was 13-15°C; after UV curing to the C-stage, the onset of T g was 22-25°C. The heat activatable adhesive solution was coated on an insulated copper wire and the wire scribed onto a printed wiring board as in Example 1. The wire scribed printed wiring board was exposed to UV light to cure the adhesive to a C-stage so that it became resistant to soldering temperatures and to solvents. EXAMPLE 7 In order to obtain a heat activatable adhesive coating for wires with even higher resistance to blocking, the formulation of Example 6 was repeated except that the softer, 16000 molecular weight urethane acrylate resin, which contains less of the aromatic toluene diisocyanate component, was not used. The formulation was as follows: A film was cast from the adhesive solution and dried. The onset T g after drying the adhesive film was 10-15°C. The adhesive was C-staged with UV light; after C-stage, the onset of T g was increased to 29-34°C and the onset of T m was 160-170°C. The adhesive solution was coated on wire and the wire scribed onto a printed wiring board as in Example 1. The bond of the wire to the surface, measured by horizontally peeling the wire perpendicular to the wire path, ranged between 80 and 105 g. Printed wiring boards with the wire scribed conductors were soldered at 265°C for 10 seconds. There was no failure of the adhesive bond between the wires and the substrate, and no visible evidence of attack on or damage to the adhesive coating. Printed wiring boards with wire scribed conductors were placed in dichloromethane for 2 minutes, dried in air at ambient temperature for 10 min. and examined with the aid of a microscope. There was no failure of the adhesive bond between the wires and the substrate, and no pitting, crazing, or other indication of solvent attack on the adhesive. After the adhesive coating was cured by UV light, the strength of the adhesive between the wire and the printed wiring board was measured by a continuous perpendicular vertical peel test. The vertical peel rate was 250 mm/min. The average peel strength on a straight line was 40 g.

Claims: A solid, non-blocking, adhesive composition which is thermosetting and can be heat-activated to its tacky state upon application of sufficient heat or ultrasonic energy without becoming C-staged and which, upon dissipation of said energy, rapidly returns to its non-activated state, said composition comprising a) a film-forming polymeric resin, or first component, having a hydroxyl or unsaturated functionality greater than 2 and selected from the group of polyols consisting of polyester resins, polyurethane resins, polyether resins, epoxy resins, and combinations thereof, said resin having been reacted to the B-stage with a first curing agent which was present either in less than a stoichiometric quantity, or was capable of reacting with functional groups that were present at concentrations of three or less on the polymeric chain, said B-staged resin having an average molecular weight between 10.000 and 100.000, and said first curing agent being a polyisocyanate, polyisocyanurate or free radical initiator, and having been present in an amount sufficient to react with 10 to 60% of the hydroxyl groups to B-stage the polymeric resin sufficiently to provide the composition with non-blocking properties; b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below 7.000, or mixtures thereof, the weight ratio of said first component to said second component being between 1,5 : 1 and 9 : 1; and c) a second curing agent which is capable of initiating a reaction with the hydroxyl groups of the polymeric resin to form crosslinks and cure the polymeric resin to the C-stage upon application of sufficient energy, said second curing agent being non-reactive or blocked when the adhesive composition is activated; said composition being flexible, and in the C-stage capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 288°C and does not soften when exposed for 10 seconds to dichloromethane at 25°C. The composition of claim 1 wherein the functional groups of the polymeric resin are hydroxyl groups and the curing agent is a blocked polyisocyanate. The composition of claim 1 wherein the functional groups of the polymeric resin are unsaturated double bonds and the curing agent is a free radical initiator. The composition of claim 2 wherein the functional groups are acrylic. The composition of claim 4 wherein the C-stage curing agent is a free radical initiator. The composition of claim 1 wherein the film-forming polymeric resin is an epoxy resin which has been reacted to a B-stage polymer having an average molecular weight grater than 30.000; and comprising a polyfunctional resin having an average molecular weight below 5.000 and containing a polyphenol backbone, and the weight ratio of said first component to said second component being between 1:1 and 3 : 1; and comprising a curing agent which is capable of reacting or initiating a reaction with the functional groups of at least one of the resins to form crosslinks and cure the resin to a C-stage upon application of sufficient energy, said curing agent being non-reactive or blocked at the conditions which will activate the adhesive composition, said curing agent being present in an amount sufficient to C-stage at least one of the resins; said composition, in the C-stage, being capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and which does not soften when exposed for 10 seconds to dichloromethane at 25°C. The composition of claim 2 wherein the polymeric resin is formed by reacting a polyamine or polyamide with a lower molecular weight polyepoxide compound.

Inventors: FRIEDRICH, MARJU JAUBE, SCHOENBERG, ANDREW JED
Applicants: ADVANCED INTERCONNECTION TECHNOLOGY, INC.
Application year: 1986
Main classification: C09J163
IPC codes: H05K3, C09J201, C09J167, C08G59, C08G18, C09J175, C09J163