CIRCUIT PROTECTION DEVICE

Abstract: Electrical devices which comprise at least one metal elec­ trode and a conductive polymer element in contact therewith, wherein the metal surface which contacts the conductive polymer has a roughened or otherwise treated surface to improve its adhesion to the conductive poiymer. The metal electrode is preferably an electrodeposited foil or a solid or stranded wire having an electrodeposited coating thereon. The conductive polymer preferably exhibits PTC behavior. The devices include heaters and circuit protection devices. The improved adhesion results in improved physical and electrical stability, and broadens the range of conductive polymer compositions which can be used in a number of applications.

Description: This invention relates to a circuit protection device comprising a conductive polymer Conductive polymers are well known. They comprise a particulate conductive filler which is dispersed in, or otherwise held together by, an organic polymer. They can be used in heaters and circuit protection devices, and may exhibit what is known as PTC (positive temperature coefficient) or ZTC (zero temperature coefficient) behavior. Documents describing conductive polymer compositions and devices comprising them include U.S. Patents Nos. 2,952,761, 2,978,665, 3,243,753, 3,351,882, 3,571,777, 3,757,086, 3,793,716, 3,823,217, 3,858,144, 3,861,029, 3,950,604, 4,017,715, 4,072,848, 4,085,286, 4,117,312, 4,177,376, 4,177,446, 4,188,276, 4,237,441, 4,242,573, 4,246,468, 4,250,400, 4,252,692, 4,255,698, 4,271,350, 4,272,471, 4,304,987, 4,309,596, 4,309,597, 4,314,230, 4,314,231, 4,315,237, 4,317,027, 4,318,881, 4,327,351, 4,330,704, 4,334,351, 4,352,083, 4,361,799, 4,388,607, 4,398,084, 4,413,301, 4,425,397, 4,426,339, 4,426,633, 4,427,877, 4,435,639, 4,429,216, 4,442,139, 4,459,473, 4,481,498, 4,476,450, 4,502,929; 4,514,620, 4,517,449, 4,534,889, and 4,560,498; J. Applied Polymer Science 19 , 813-815 (1975), Klason and Kubat; Polymer Engineering and Science 18 , 649-653 (1978), Narkis et al; and European Application Nos. 38,713, 38,714, 38,718, 74,281, 92,406, 119,807, 133,748, 134,145, 144,187, 157,640, 158,410, 175,550 and 176,284. The electrodes which have been used with conductive polymers include solid and stranded wires, metal foils, and expanded and perforated metal sheets. We have now discovered that improved physical and electrical properties can be obtained through the use of electrodes which have a microrough surface which is in direct physical and electrical contact with the conductive polymer. The term "microrough" is used herein to denote a surface comprising irregularities which (a) protrude from the surface by a distance of at least 0.03 x 10⁻⁶m, preferably at least 0.1 x 10⁻⁶m, particularly 0.1 to 100 x 10⁻⁶m, and (b) have at least one dimension parallel to the surface which (i) is at most 500 x10⁻⁶m, preferably at most 100 x 10⁻⁶m, particularly at most 10 x 10⁻⁶m, and (ii) is preferably at least 0.03 x 10⁻⁶m, particularly at least 0.1 x 10⁻⁶m. The irregularities can be of the shape produced by electrodeposition, eg. generally spherical nodules protruding from the surface, or they can be of a different shape. Articles including an irregular surface layer to increase the ability of adhesion are known in the prior art. For example, US 4454379 describes a shielding tape which is designed for mechanical protection and electrostatic screening of electrical power and communications cables. The tape comprises a metal foil, an adhesion promoting conductive coating, and an outer layer. The adhesion promoting coating may be a thin layer of copper-copper oxide particles deposited in random clusters. This nodularized surface area provides increased surface area for adhesion bonding. The present invention provides a circuit protection device having a resistance at 230°C of less then 100 ohms, which comprises: (1) an element composed of a conductive polymer, and (2) at least one metal electrode, comprising electrodeposited nickel, having a microrough surface which (a) is in direct physical contact with the conductive polymer element and (b) comprises irregularities which protrude from the surface by a distance of 0.1 to 100 x 10⁻⁶m and has at least one dimension parallel to the surface which is at most 500 x 10⁻⁶m. The method of preparing the microrough surface of the circuit protection device is by electrodeposition, the microrough surface being the surface which is exposed to the electrolyte. For example, electrodeposited foils and foils on which a layer of the same or different metal has been formed by electrodeposition (particularly electrodeposited copper and nickel foils) are very useful when laminar electrodes are needed; and solid or stranded wires on which a layer of the same or different metal has been formed by electrodeposition (particularly copper wires on which a nickel coating has been formed by electrodeposition) are very useful when columnar electrodes are needed. The microrough surface can if desired be treated to change its chemical characteristics. For example, an electrodeposited metal foil can be passivated (i.e. rendered inactive or less chemically reactive) by an appropriate treatment, eg. one which provides a coating thereon of a water-stable oxide, especially a zinc-nickel or nickel treatment of an electrodeposited copper foil. Such treatment is for example desirable where the metal may catalyse degradation of the conductive polymer. Such treatment can also be carried out so as to provide appropriate acid-base interactions wit the conductive polymer. Through the use of microrough surfaces on the electrodes, the range of conductive polymers which can be used is increased. For example, when using a conventional metal foil, it is often necessary for the conductive polymer to include a polar copolymer or other polymeric ingredient which provides improved adhesion to the metal foil but whose presence detracts from the desired electrical characteristics. Such an ingredient is not required when using a microrough electrode. Thus this invention makes it possible to use a wider range of conductive polymers (both PTC and ZTC), especially in situations in which separation of the electrode and the conductive polymer is an anticipated problem, either as a result of flexing, different coefficients of expansion, exposure to solvents, eg. diesel fuel, or thermal or electrical shock. Suitable conductive polymers are disclosed in the documents incorporated herein by reference. Preferred conductive polymers include those based on polyolefins, particularly high density polyethylene, and those based on fluoropolymers, particularly polyvinylidene fluoride. Advantages of the improved adhesion include the ability to punch very small parts from foil laminates and substantially improved electrical stability, even when exposed to high voltages. Circuit protection devices according to the invention have, a resistance of less than 100 ohms, preferably less then 25 ohms, especially less than 1 ohm. Very small laminar devices, having at least one laminar dimension which is less than o.51cm (0.2 inch), eg. less than o.38cm (0.15 inch), and even smaller, such as less than o.25cm (0.1 inch), can be prepared by punching a foil laminate. Other useful devices include self-limiting heaters, especially flexible sheet heaters having a total surface area of at least 6.45cm² (1.0 square inch), eg. at least 161cm² (5 square inches). The present invention has been found to be of particular value for circuit protection devices comprising columnar electrodes, e.g. solid or stranded wires, which are embedded in a PTC conductive polymer. We have found that in many such devices, when using conventional wires, it is desirable to coat the wires with a graphite-containing composition before contacting them with the molten conductive polymer, in order to obtain devices with satisfactory stability. By using electrodes having a microrough surface, devices of comparable or better stability can be obtained without the use of such a coating. The invention is illustrated by the following Examples. EXAMPLE 1 6200 g. of high density polyethylene (Marlex 6003 available from Phillips Petroleum), 5310 g. of carbon black (Statex G available from Columbian Chemicals), 7955 g. of titanium oxide (TiPure R101 available from du Pont) and 205 g. of antioxidant were tumble-blended, mixed in a Banbury mixer, melt-extruded into a water bath and chopped into pellets. After drying, the pellets were extruded as a sheet 8.25 inch (21.0 cm) wide and 0.030 inch (0.076 cm) thick, and samples 6 inch (15.3 cm) square were cut from the sheet. Each sample was laminated between two metal foils 6 x 6 x 0.0014 inch in a heated press at 260°C and 4,000 lb. pressure for 2 minutes, followed by 7,000 lb. pressure for 3 minutes. The metal foils were electrodeposited copper foils which had been passivated with nickel and zinc on the surface adjacent the sample. Such foils are available from Yates Industries under the trade name TEX-1. Disc-shaped devices 0.125 inch (0.318 cm) in diameter were punched from the laminates. A 24 AWG nickel-plated steel lead was attached to each metal foil on each device. The devices were then encapsulated by an epoxy resin which was cured at 110°C for 3 hours. EXAMPLE 2 8092 g. of Marlex 6003, 8071 g.. of Statex G and 276 g. of antioxidant were converted into pellets by the procedure used in Example 1, and encapsulated disc-shaped devices were prepared from those pellets by the procedure used in Example 1. EXAMPLE 3 7945 g. of high density polyethylene (Marlex 6003 available from Phillips Petroleum), 7200 g. of carbon black (Statex G available from Columbian Chemicals) and 263 of antioxidant were mixed together, melt-extruded into a water bath and chopped into pellets. After drying, 12,185 g. of the pellets were mixed with 4726 g. of alumina trihydrate (Hydral 705 available from Alcoa), melt-extruded into a water bath and chopped into pellets. After drying the pellets were melt-extruded through a crosshead die around two preheated 22 AWG solid copper wires that had been electroplated with nickel to a nominal thickness of 300 to 500 microinch (0.762-1.27 mm). The resulting strip (about 0.58 by 0.25 cm) was irradiated to 75 Mrad using a 1 MeV electron beam. The irradiated strip was cut into lengths of about 1cm long, from which circuit protection devices were prepared in which the conductive polymer element was about 0.76 cm long and the electrodes extended from one side of the PTC element by about 0.25 cm.

Claims: A circuit protection device having a resistance at 23°C of less then 100 ohms, which comprises: (1) an element composed of a conductive polymer, and (2) at least one metal electrode, comprising electrodeposited nickel, having a microrough surface which (a) is in direct physical contact with the conductive polymer element and (b) comprises irregularities which protrude from the surface by a distance of 0.1 to 100 x 10⁻⁶m and has at least one dimension parallel to the surface which is at most 500 x 10⁻⁶m. A device according to Claim 1 wherein the microrough surface consists essentially of nodules having a diameter of 0.1 to 10 x 10⁻⁶m. A device according to any preceding Claim, which comprises two electrodes each of which comprises an electrodeposited nickel foil. A device according to any preceding Claim, which comprises two electrodes each of which is a metal wire having a coating of the same or a different metal electrodeposited thereon. A device according to any one of the preceding claims wherein the conductive polymer exhibits PTC behaviour. A device according to any one of the preceding claims which has a resistance at 23°C of less than 25 ohms.

Inventors: KLEINER, LOTHAR, MATTHIESEN, MARTIN
Applicants: RAYCHEM CORPORATION (A DELAWARE CORPORATION)
Application year: 1986
Main classification: H01B5
IPC codes: H05B3, H01L51, H01C7, H01C1, B01D35, F02B3