A SEMICONDUCTOR DEVICE HAVING HIGH RESISTANCE TO ELECTROSTATIC AND ELECTROMAGNETIC INDUCTION

Abstract: A semiconductor device is disclosed with a conductive on-chip shield film (8) formed on its surface. The on-chip shield film (8) is patterned in a manner substantially com­ plementary to the pattern of the wiring layer (5) of the semi­ conductor device so that the shield film (8) does not cover portions of the semiconductor device which are covered by the wiring-pattern layer (5). In this manner, the on-chip shield film (8) of the semiconductor device provides high resistance to electrostatic and electromagnetic induction while main­ taining the ability of the device to withstand changes in ambient temperature.

Description: The present invention relates to a semiconductor device having a high resistance to electrostatic and electromagnetic induction, and, more particularly, to an improved shield for a semiconductor device which provides high resistance to electrostatic and electromagnetic induction without reducing the ability of the semiconductor device to withstand adverse environmental conditions. Semiconductor devices have been used in an ever increasing variety of applications, such as integrated circuits (ICs) and photocouplers. As the fields of application have increased, semiconductor devices have also been subjected to more adverse environmental conditions. As an example, in many applications the air surrounding the semiconductor device is teeming with electromagnetic waves. These waves tend to induce currents in the metallic or conductive portions of the device and cause erroneous and/or faulty operation. Further, in many present day applications semiconductor devices are coupled to circuits wherein large surge voltages, caused by the switching of power circuits, occur in the power line. These voltages, like electromagnetic waves, tend to induce unwanted currents which result in erroneous operation. To protect semiconductor devices from operation failure due to such electromagnetic waves and surge voltages, on-chip shield structures have been developed. Such structures generally comprise an insulating film formed over the entire surface of the semiconductor device. For example, Japanese Patent Disclosure No. 60-4257 describes a method for improving IC resistance to electromagnetic radiation by utilizing an on-chip shield. Also, Japanese Patent Disclosure No. 52-79789 describes an on-chip shield for preventing operation failures due to surge voltage induction in a photocoupling semiconductor. However, the above described on-chip shields are subject to failure or temporary operational errors when used in an environment with significant temperature variations. As a result, the device cannot be reliably operated under varying temperature conditions. In GB patent no. 1 345 744, a conductive shield film is disclosed for a semiconductor device corresponding to the precharacterizing part of claim 1. The arrangement of the shield film is substantially complementary to the wiring pattern. However, the disclosed device still doesn't provide adequate insulation without losing some shielding effects. It is desirable, therefore to provide a semiconductor device with an improved shielding from electromagnetic waves and power line surge voltages. Further, it is desirable to provide such a device which is also substantially impervious to significant temperature variations. It is also desirable to provide such a device which is particularly suited for use with optical coupling devices. As always, it is desirable to provide such a device while maintaining high yield and simultaneously minimizing production costs. It is, therefore, an object of the present invention to provide a semiconductor device with an on-chip shield structure which prevents operation errors caused by electromagnetically or electrostatically induced currents. It is another object of the present invention to provide an on-chip structure for preventing operation errors caused by electrostatic and electromagnetic induction without reducing the ability of the semi-conductor device to withstand significant temperature variations. It is a further object of the present invention to provide an improved on-chip structure for a semiconductor device which can be provided without sacrificing manufacturing yield or increasing production costs. The present invention addresses the foregoing objects by providing a semiconductor device having an , inexpensive and reliable shielding and by providing a method for reliably shielding a semiconductor device, wherein the resulting semiconductor device is substantially impervious to significant temperature variations. A semiconductor device in accordance with the present invention includes a semiconductor element formed in a semiconductor substrate. A first insulating layer is provided over the semiconductor substrate and is covered by a wiring-pattern layer. A second insulating layer is formed over the wiring-pattern layer. A conductive shield connected to ground is provided to cover the semiconductor device and is arranged to complement the wiring-pattern layer such that the conductive shield film does not substantially cover those portions of the semiconductor device which are covered by the wiring-pattern layer but overlaps those portions of the wiring-pattern layer which are at ground potential. By constructing the conductive shield film so as to complement the wiring-pattern layer, undesirable electrical contact therebetween is prevented. A method in accordance with the present invention is claimed in claim 6. Further features, objects and advantages of the invention will become apparent from a reading of the following detailed Description, taken in conjunction with the drawings, in which: Figure 1 is a sectional view of a photocoupler including an optical transmitter and receiver; Figure 2 is a sectional view of a semiconductor device constructed in accordance with one embodiment of the present invention; and Figure 3 is a plan view of the semiconductor device of Figure 2. The present invention is based on findings obtained through extensive study directed to semiconductor devices with on-chip conductive shield structures having various arrangements. The study revealed that conventional semiconductor devices with on-chip conductive shields were unreliable because undesirable electrical contact occurred between the conductive shield film covering the surface of the semiconductor device and the metal wiring layer integrated therein. This adverse electrical contact is believed to be primarily due to differences in the thermal expansion coefficients of the metal wiring layer, the conductive shield film and an insulating film formed between the wiring layer and the conductive shield film. The difference in thermal expansion coefficients, coupled with temperature variations during operation, results in small pinholes being formed in the insulating film. These pinholes grow with time to cause adverse electrical contact between the metal wiring layer and the conductive shield film. Therefore, reliable shielding is provided in temperature varying conditions by constructing the conductive shield in such a manner to prevent undesired electrical contact with the wiring layer. This is accomplished by patterning the conductive shield film such that it does not substantially cover those portions of the semiconductor device above the wiring-pattern layer. The present invention can be applied to photocoupler light-receiving elements. With reference to Figure 1, a photocoupler usually comprises a light-emitting chip 10 on a first lead frame 11. Light-receiving chip 12 is mounted on a second lead frame 13, and light guide 14 is interposed between chips 10 and 12. The above elements are encapsulated in mass 15. When an input signal is supplied to light-emitting chip 10, the chip emits light toward light-receiving chip 12 via light guide 14. The light-receiving chip then provides an electrical signal output in response to receipt of the light emitted by light-emitting chip 10. Theoretically, unless the input signal is supplied, the output signal will not be generated. However, in conventional photocouplers the output signal often appears without supplying the input signal. This occurs because light guide 14, which is usually made of a resin such as silicone, acts as a dielectric so that capacitance is created between chips 10 and 12. Therefore, when a voltage difference occurs between chips 10 and 12, such as may be caused by a surge voltage, current flows in light-receiving chip 12 resulting in faulty operation of the photocoupler. A photocoupler is provided which does not exhibit faulty operation in response to electromagnetically or electrostatically induced currents. This is accomplished by providing an on-chip shield which acts as an electrode on the side of the light-receiving chip to receive electrostatic or electromagnetic energy. As a result, current flows to ground through the shield rather than through the photocoupler, thereby eliminating faulty operation. Referring to Figure 2, a cross sectional illustration of light-receiving chip 12 is provided. Chip 12 comprises a p-type silicon substrate 1 including photodiode element 2 and photocurrent amplifying npn transistor 3. The surface of substrate 1 is covered with silicon oxide film 4 which may be on the order of 1.5 µm. Wiring-pattern layer 5, obtained by depositing an aluminum film as is known in the art, is formed on film 4. Typically, wiring layer 5 may be on the order of 10 µm to 100 µm wide. Layer 5 is in ohmic contact with the impurity regions of photodiode 2 and transistor 3 through corresponding contact holes in oxide film 4. Wide bonding pads 5' are formed as terminals for layers 5. An insulating film 6, such as Chemical Vapor Deposition (CVD) SiO₂ film or polyimide film, is formed over layer 5. Bonding windows 7 are formed in film 6 to expose corresponding bonding pads 5'. Transparent conductive film 8, such as a polysilicon or indium-tin oxide (ITO) layer, is formed on film 6 and has a thickness of approximately 1 µm. A bonding window is formed in film 8 and bonding wires 9 are connected to exposed pads 5'. Film 8 is constructed to prevent undesirable electrical contact with layer 5. This is accomplished by patterning film 8 to be substantially complementary to layer 5. To this end, openings are formed in film 8 at positions corresponding to layers 5 such that the edge of layer 5 is substantially aligned with that of the openings in film 8. In this manner, small pinholes which may be formed in temperature varying environments will not result in undesirable electrical contact between the conductive shield and the wiring layer. Accordingly, reliable operation is not sacrificed as a result of shielding the semiconductor device from electrostatically and electromagnetically induced currents. Film 8 is coupled to ground potential. This may be accomplished in any conventional manner known in the art. Contact holes (not shown) are provided in insulating film 6 for coupling film 8 with the grounded portions of wiring pattern layer 5. As described above, film 8 and layer 5 are formed in a substantially complementary pattern. However, the term "complementary" does not exclude any overlap between layers 8 and 5. According to the present invention, complementary patterns include cases where the overlap between layers 8 and 5 is small and the edge of film 8 is not quite flush with the edge of layer 5 along the lateral direction. Complementary patterns also include cases where the edge of film 8 is slightly remote from layer 5 along the lateral direction such that a portion of the semiconductor device not covered by layer 5 is also not covered by film 8. In the latter case it has been found that sufficient shielding can be obtained even if the lateral displacement between film 8 and layer 5 is 2 to 3 micrometers. The complementary arrangement of film 8 and layer 5 includes according to the present invention, that film 8 is formed to complement the non-grounded portions of layer 5, which means that the film 8 is formed above the grounded portions of layer 5, (i.e., the portions of layer 5 which are connected to the reference or ground potential of the circuit) in addition to being formed over those portions of the semiconductor device which are not covered by any portion of layer 5. Because conductive shield film 8 is also at ground potential, pinholes which may appear in insulating film 6 in the grounded regions of layer 5 covered by film 8 will have no adverse consequence on the operation of the semiconductor device. In a further embodiment, portions of the semiconductor device especially sensitive to electrostatic or electromagnetic induction, such as the portion of wiring layer 5 around the photodiode in Figure 2, may also be covered by conductive shield film 8. The present invention also can be applied to semiconductor devices other than photocoupler light-receiving elements. In other semiconductor devices, a transparent conductive shield film may not be required and a non-transparent conductive shield film may be substituted therefor. Also, if a metal film is used as a shield film, other conductive materials, such as polysilicon, can be used for layer 5. Many combinations of conductive materials for shield film 8 and wiring layer 5 should readily come to mind. The photocoupler incorporating the above mentioned light-receiving integrated circuit was subjected to temperature cycle testing wherein the photocoupler was periodically placed in high and low temperature conditions for reliability testing. The test results indicate that failures and operational errors were almost entirely eliminated. Further, undesirable short circuits between layer 5 and film 8 caused during fabrication were greatly decreased, which in turn increased yield by 10 to 20% as compared to the conventional on-chip shield structure.

Claims: A semiconductor device having high resistance to electrostatic and electromagnetic induction comprising a semiconductor element (2, 3) formed in a semiconductor substrate (1); a first insulating film (4) formed on a surface of said semiconductor substrate (1); a wiring-pattern layer (5) formed on said first insulating film (4); a second insulating film (6) formed over said first insulating film (4) to cover said wiring-pattern layer (5); and a conductive shield film (8) connected to ground, formed over said second insulating film (6) and arranged substantially complementary to said wiring-pattern layer (5) to cover those portions of said semiconductor substrate (1) which are not covered by said wiring pattern layer (5), characterised in that said conductive shield film (8) overlaps selected portions of said wiring-pattern layer (5), and in that said selected portions are those portions of said wiring-pattern layer (5) which are at ground potential. A semiconductor device according to claim 1, characterized in that said semiconductor element comprises a light-receiving integrated circuit including a light sensitive region (2) and an amplifier element (3). A semiconductor device according to claim 2, characterised in that said conductive shield film (8) is transparent. A semiconductor device according to any of claims 1 to 3, characterised in that said selected portions of said wiring-pattern layer (5) covered by said conductive shield film (8) also include those portions of said wiring-pattern layer (5) which are especially sensitive to electrostatic and electromagnetic induction. A semiconductor device according to claim 4, characterised in that said especially sensitive portions are those portions of said wiring-pattern layer (5) formed around said light sensitive region (2) of said light receiving integrated circuit. A method for insulating a semiconductor device from electrostatic and electromagnetic induction, said semiconductor device including a semiconductor element (2, 3) in a semiconductor substrate (1), a first insulating film (4) formed on a surface of said semiconductor substrate (1), a wiring-pattern layer (5) formed on said first insulating film (4), and a second insulating film (6) covering said wiring-pattern layer (5), said method comprising: (a) covering the semiconductor device with a conductive shield film (8) by (b) disposing said conductive shield film (8) on said second insulating film (6), and (c) patterning said conductive shield film (8) to complement those portions of said wiring-pattern layer (5) which are non-grounded except for selected portions of said wiring pattern layer (5) which are especially sensitive to electrostatic and electromagnetic induction and (d) coupling said conductive shield film (8) to ground potential. A method according to claim 6, characterised in that steps (b) and (c) are performed simultaneously. A method according to claim 6 or 7, characterised by: (e) further patterning said conductive shield film (8) to complement all those portions of said wiring-pattern layer (5) which are non-grounded. A method according to claim 8, characterised in that steps (b) and (e) are performed simultaneously. A method according to claim 6, characterised in that the semiconductor device comprises a light receiving integrated circuit including a light sensitive region (2) and an amplifier (3) and wherein said selected portions of said wiring pattern layer (5) are those portions surrounding the light sensitive region (2).

Inventors: DENGO, TADAO PATENT DIVISION TOSHIBA CORP., FUKADA, IKUO PATENT DIVISION TOSHIBA CORP., KAMASAKI, KEIJI PATENT DIVISION TOSHIBA CORP., MOTOJIMA, HIDEAKI PATENT DIVISION TOSHIBA CORP.
Applicants: KABUSHIKI KAISHA TOSHIBA
Application year: 1986
Main classification: H01L23
IPC codes: H01L31, H01L21, H01L23