Microwave oscillator

Abstract: A microwave oscillator to be usable with anyone of chip FET or MMIC FET or package FET, by configurating the oscilla­ tion circuit that resonance circuit (4 + 5, 26) is connected to the gate (11), an end-grounded inductor (2) is connected to the drain (12) and the source (13) is connected to output terminal (10), stable microwave oscillation is made.

Description: BACKGROUND OF THE INVENTION 1. FIELD OF THE INVENTION The present invention relates generally to a microwave oscillator and particularly to an improved microwave oscillator capable of stable oscillation even when an FET 1 other than a package FET 1 is connected thereto 2. DESCRIPTION OF THE PRIOR ART A conventional microwave oscillator has been disclosed, for instance, in Japanese Published Unexamined Patent Application No. Sho 57-26902. FIG.1 is a circuit diagram of the conventional microwave oscillator of the above-mentioned application, wherein an FET 1a is connected by its gate 11a to one end of a strip line 4a, the other end thereof being terminated by a dummy resistor 6a, by its source 13a to an output terminal 10a and also through a low pass filter 9a and a self bias resistor 8a to the ground, and by its drain 12a to a power source terminal 3a and also to one end of open-ended transmission line 19a having a length of a quarter wavelength λ g /4. A dielectric resonator 5 is coupled to the strip line 4. In the conventional microwave oscillator of the above-mentioned configuration, the 1/4 wavelength open ended transmission line 19a grounds the drain 12a in microwave frequency. When a DC power source is supplied from the power source terminal 3a, potential of the gate 11a becomes lower than the potential of the source 13a as a result of voltage drop caused by a current flowing through the self bias resistor 8a. According to the above-mentioned circuit configuration, oscillation is produced by cooperation of a negative resistance produced at the gate 11a and a resonance circuit consisting of the strip line 4a, and the dielectric resonator 5a coupled to the strip line 4a, and output of the oscillation signal is issued through the output terminal 10a. In the above-mentioned prior art circuit configuration, however. when the FET 1a is configurated in a shape of chip or the whole circuit is configurated in a monolithic integrated circuit, there arises a problem such that the negative resistance to be presented at the gate 2a is decreased, due to a decrease or elimination of stray capacity which has been existing in case of the prior art package FET 1. thereby to lower stability of the oscillation. From JP-A-59224904 a band reflection type microwave oscillator is known, comprising a FET having a gate, a source and a drain, the oscillator further comprising a band reflection type resonator coupled to the gate and output terminal coupled to the source of the FET. The known oscillator comprises a stub for grounding the drain of the FET at high frequency oscillation. The drain of the FET is grounded at high frequency through a series circuit comprising an inductor, a resistor and a capacitor at high oscillation frequency. Furthermore, the stub is coupled with the dielectric resonator, thereby a positive feedback loop of a high frequency signal from the drain of the FET through the stub, the dielectric resonator, a strip line and the gate of the FET is made. The oscillator has consequently the configurations and features of both a band reflection type microwave oscillator and a feedback type oscillator. The present invention intends to provide an improved microwave oscillator which can stably oscillate even when any FET 1 other than usually used package FET 1 is used. This object is solved by the characterizing features of claims 1 and 5. Further preferred embodiments of the invention are characterized in the subclaims. BRIEF DESCRIPTION OF THE DRAWINGS FIG.1 is the circuit diagram of the prior art microwave oscillator. FIG.2 is a circuit diagaram of a first microwave oscillator. FIG.3 is a graph showing characteristic curve of the first microwave oscillator. FIG.4 is a circuit diagram of a second microwave oscillator. FIG.5 is a graph showing characteristic of the second microwave oscillator. FIG.6 is a circuit diagram of a third microwave oscillator. FIG.7 is a graph showing a characteristic of the third microwave oscillator. FIG.8 is a diagram showing a characteristic of the third microwave oscillator. FIG.9 is a circuit diagram of a fourth microwave oscillator. FIG.10 is a diagram showing characteristic of the fourth microwave oscillator. FIG.11 is a circuit diagram of a fifth microwave oscillator. FIG.12 is a graph showing characteristic of the fifth microwave oscillator. FIG.13 is a circuit diagram of a sixth microwave oscillator. FIG.14 is a graph showing a characteristic of the sixth microwave oscillator. FIG.15 is a MMIC chip pattern diagram of a microwave oscillator of a preferred embodiment. FIG.16 is an equivalent circuit diagram of the preferred embodiment. FIG.17 is a partial circuit diagram of a microwave oscillator utilizing MMIC of the preferred embodiment of FIG.15. FIG.18, FIG.19 and FIG.20 are equivalent circuit diagrams of MMICs of the microwave oscillator of another embodiment of the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENT The preferred embodiments in accordance with the present invention are disclosed hereinafter with reference to FIG.2 and subsequent drawings. FIG.2 is a circuit diagram of a first microwave oscillator, wherein a chip FET 1 is connected by its gate 11 to one end of a strip line 4, the other end thereof being terminated by a dummy resistor 6, by its source 13 to an output terminal 10, and also through a self bias resistor 8 and a 1/4 wavelength transmission line 9 to the ground, and by its drain 12 through an inductive element 2 to a power source terminal 3, which is grounded through a bypass capacitor 7. The operation of the microwave oscillator shown in FIG.2 is elucidated. Non-grounded end of the 1/4 wavelength transmission line 9 forms an open end in microwave frequency, hence this functions as a kind of low pass filter which passes only bias current, and the oscillation output is transmitted only to the output terminal 10. The dielectric resonator 5 which has a high Q value and the strip line 4 constitute a known resonance circuit, which oscillates at a resonance frequency of the dielectric resonator 5. The inductive element 2 has a function to increase negative resistance which is made at the oscillation frequency at the gate 11 when the drain 12 of the chip FET 1 is grounded. A graph of FIG.3 Shows a relation between reflection coefficient |Γ G |at the oscillatioin frequency of FET 1 seen from its gate 11 which shows negative resistance at the oscillation frequency induced at the gate 11 vs. the value of the inductance of the inductive element 2 for n chip FET 1, obtained by computation. As shown in FIG.3, grounding the drain 12 through the inductive element 2 of 1.9 nH enables obtaining higher negative resistance at the gate 11 than direct grounding in microwave frequency. And the grounding through the 1.9 nH inductive element 2 relieves amplitude condition of the oscillation conditiion of the resonation circuit consisting of the strip line 4 and the dielectric resonator 5, thereby to stabilize the oscillation, and the oscillation is stabilized. As mentioned above, according to this device by grounding the drain 12 of the chip FET 1 through the inductive element 2, a stable microwave oscillator is obtainable. FIG.4 is a circuit diagram of a second microwave oscillator. In this oscillator, a capacitor 14 is inserted between the source 13 and the output terminal 10, and other parts and components are configurated the same as the first oscillator. The operation of the microwave oscillator shown in FIG.4 is elucidated. Like the oscillator of FIG.2, non-grounded end of the 1/4 wavelength transmission line 9 forms an opend in microwave frequency, and this function as a kind of low pass filter which passes only bias current and oscillation output is transmitted only to the output terminal 10. The dielectric resonator 5 which has a high Q value and tile strip line 4 constitute a known resonance circuit, which oscillates at a resonance frequency of the dielectric resonator 5. The inductive element 2 has a function to increase negative resistance which is made at the oscillation frequency at the gate 11 when the drain 12 of the chip FET 1 is grounded. The operation of the parts other than the capacitor 14 is similar to the oscillator of FIG.2. The capacitor 14 functions to increase the negative resistance at the gate 11 of the FET 1 at the oscillation frequency. A graph of FIG.5 shows a relation between reflection coefficient |Γ G |the oscillation frequency of FET 1 seen from its gate 11 which shows a negative resistance at the oscillation frequency (for instance, 10.75 GHz) induced at the gate 11 vs. the valaue of capacitance of the capacitor 14 for a chip FET 1, obtained by computation. As shown in FIG.5, when the capacitance of the capacitor 14 is 0.6 PF, the negative resistance of the gate becomes maximum, and the value of the negative resistance becomes higher than that of FIG.2 wherein there is no capacitor 14; that is by providing the capacitor 14, a more stable microwave oscillator can be constituted. Furthermore, since the output terminal 10 and the source 13 are isolated by the capacitor 14 with respect to direct current, there is no need of inserting DC cut capacitor at the output terminal, and hence, number of total electronic components can be decreased. FIG.6 is a circuit diagram of a third microwave oscillator which has similar circuit configuration as the circuit of FIG.4, except that a second capacitord 15 is connected between the output terminal 10 and the ground. The operation of the microwave oscillator shown in FIG.6 is similar to the foregoing oscillator of FIG.4, excespt that the capacitor 15 functions to increase the reflection coefficient |Γ G |at the oscillation frequency of FET 1 seen from its gate 11. A graph of FIG.7 shows a relation between reflection coefficient |Γ G | at the oscillation frequency of FET 1 seen from its gate 11 which shows negative resistance at the oscillation frequency induced at the gate 11 vs. the value of capacitance of the capacitor 15, with respect to a use of a chip FET 1 wherein the inductance of the inductive element 2 is 1.5 nH, and the capacitance of the capacitor 14 is 0.7 PF and the oscillation frequency is 10.75 GHz. As shown in FIG.7, when the capacitance of the capacitor 15 is 0.4 PF, the negative resistance becomes maximum, and the reflection coefficient |Γ G | becomes larger than the maximum value of the oscillator of FIG.4 wherein no capacitor 15 is provided. Furthermore, in the oscillator of FIG.6, as a result of providing the capacitors 14 and 15, the lond impedance of the microwave oscillator can be varied fnr a wide range. FIG.8 is a Smith chart showing the load impedance seen from the lond side of the source 13 of the embodiment of FIG.6. And the chart shows that for the impedance seen from the source terminal 13 can adopt any point within the range R 1 designated by hatching in FIG.8. Accordingly, by the configuration of the oscillator of FIG.6, it is possible to select the load impedance seen from the source 13 is selected in a wide range; and hence by appropriately selecting the capacitances of the capacitors 14 and 15 the reflection coefficient of the FET 1 seen from the gate 11 can be maintained large, thereby providing a microwave oscillator which is highly resistive against impedance variation of the load. As has been described, by appropriately selecting the values of the inductive element 2 and the capacitors 14 and 15, a more stable microwave oscillator than those oscillators of FIG.2 and FIG.4 is obtainable. FIG.9 is a circuit diagram of a fourth microwave oscillator, wherein a chip FET 1 is connected by its gate 11 to one end of a strip line 4, the other end thereof being to terminated by a dummy resistor 6, by its source 13 through a capacitor 14 and a inductive strip line 17 of a length 1 2 to an output terminal 10, and also through a self bias resistor 8 and a 1/4 wavelength transmission line 9 to the ground, and by its drain 12 through an inductive strip line 18 of length of 1 3 to a power source terminal 3, which is grounded through a bypass capacitor 7. Furthermore, an open ended capacitive strip line 16 of 1 1 length and having a characteristic impedance of Z 01 is connected to the output line 10. The operation of the microwave oscillator configurated as FIG. 9 is elucidated. Non-grounded end of the 1/4 wavelength transmission line 9 forms an open end in microwave frequency, hence this functions as a kind of low pass filter which passes only bias current, and the oscillation output is transmitted only to the output terminal 10. The dielectric resonator 5 which has a high Q value and the strip line 4 constitute a known resonance circuit, which oscillates at a resonance frequency of the dielectric resonator 5. The inductive strip line 18 is designed to work as inductive component for oscillation frequency by known principle and hence by selectively setting the length 1 3 and its characteristic impedance Z 0 , it fuctions to increase the negative resistance at the gate 11 at the oscillation frequency. The capacitor 14 functions to increase the negative resistance at the gate 11 at the oscillation frequency. The open ended capacitive strip line 16 is designed such that its length is shorter than λg/4 so that it serves as capacitive components in the oscillation frequency. Accordingly, by appropriately selecting the characteristic impedances Z 01 and Z 02 as well as lenghths 1 1 , 1 2 of the strip lines 16 and 17, respectively, the variable range of impedance seen from the source 13 of the FET 1 to the load can be made further widely than the oscillator of FIG.6. FIG.10 is a Smith chart showing impedance seen from the source 13 of the chip FET 1 to the load of the microwave oscillator of FIG.9. The impedance of load from the source 13 to the load can be selected at any point within the range R 2 shown by hatching in FIG.10, by varying capacitance value of the capacitor 14, characteristic impedance Z 01 and length 1 1 of the capacitive open ended strip line 16 and characteristic impedance Z 2 and length 1 2 of the strip line 17. The realizable range R 2 is made wider than the realizable range of the impedance seen from the source to the load of FIG.6. Accordingly, in the oscillator of FIG.9, it is possible to select the load impedance in more wide range than the embodiment of FIG.6. Furthnermore, by appropriately selecting the constants of the circuit components, the reflection coefficient |Γ G | seen from the gate 11 of the FET 1 to the load can be retained large, and a microwave oscillator which is very much stable at impedance variation of load is obtainable. Fig.11 is a circuit diagram of a fifth microwave oscillator. In this oscillator, chip FET 1 is connected by its gate 11 to one end of a strip line 4 of characteristic impedance of 50 Ω, the other end thereof being terminated by the dummy resistor 6, by its source 13 to an output terminal 10, and also through a self-bias resistor 8 and a 1/4 wavelength transmission line 9 to the ground, and by its drain 12 through an inductive element 2 to a power source terminal 3, witch is grounded through a capacitor 7. The operation of the microwave oscillator shown in FIG.11 is elucidated. Non-grounded end of the 1/4 wavelength transmission line 9 forms an open end at microwave frequency, hence this functions as a kind of low pass filter which passes only DC bias current, and the oscillation output is transmitted to the output terminal 10 only. The dielectric resonator 5 which has a high Q value and the strip line 4 constitute a known resonance circuit, which oscillates at a resonance frequency of the dielectric resonator 5. The inductive element 2 has a function to increase negative resistance which is made at the oscillation frequency at the gate 11 when the drain 12 of the chip FET 1 is grounded. The capacitor 19 functions to further increase the reflection coefficient |Γ G | at the oscillation frequency of FET 1 seen from its gate 11. A graph of FIG.12 shows a relation between reflection coefficient |Γ G | at the oscillation frequency of FET 1 seen from its gate 11 which shows negative resistance at tile oscillation frequency induced at the gate 11 vs. the value of capacitance of the capacitor 19 with respect to a use of a chip FET 1, wherein the inductance of the inductive element 2 is 1.5 nH, and the oscillation frequency is 10.75 GHz. As shown in FIG.12, when the capacitance of the capacitor 19 is 0.3 PF, n higher negative resistance at the gate 11 is obtainable than a case without such capacitor 19; that is the provision of the capacitor 19 releaves the oscillation condition of the oscillator constituted by the strip line 4 and the dielectric resonator 5, thereby to stabilize the oscillation. FIG.13 is a circuit diagram of a microwave oscillator of still another oscillator. In this oscillator, a capacitor 20 is inserted between the source 13 and the output terminal 10, in the circuit of FIG.11; and other parts and components are configurated the same as the oscillator of FIG.11. The operation of the microwave oscillator shown in FIG.13 is elucidated. Like the oscillator of FIG.11, non-grounded end of the 1/4 wavelength transmission line 9 forms an open end in microwave frequency, and this functions as a kind of low pass filter which passes only DC bias current and oscillation output is transmitted to the output terminal 10 only. The dielectric resonator 5 which has a high Q value and the strip line 4 constitute a known resonance circuit, which oscillates at n resonance frequency of the dielectric resonator 5. The capacitor 20 functions to increase negative resistance at the gate 11 of the FET 1 at the oscillation frequency more extensively than the case of the circuit of FIG.11. A graph of FIG.14 shows a relation between reflection coefficient [Γ G | at the oscillation frequency of FET 1 seen from its gate 11 which shows a negative resistance at the oscillation frequency (for instance, 10.75 GHz) induced at the gate 11 vs. the value of the capacitance of the capacitor 20 for a chip FET I, obtained by computation. As shown in FIG.14, when the capacitance of the capacitor 20 is 0.3, a higher negative resistance at the gate 11 of the FET 1 is obtainable than in the case without the insertion of the capacitor 20, and the oscillation condition of the resonation circuit consisting of the strip line 4 and the dielectric resonator 5 is eased, and more stable microwave oscillator is constituted. Furthermore, since the output terminal 10 and the source 13 are isolated by the capacitor 20 with respect to direct current, there is no need of inserting a DC stop capacitor at the output terminal, and hence number of total electronic components can be decreased. In the above-mentioned oscillators, the FET used is chip FET, but of course package FET 1 may be used, and the same function nnd performance are obtainable; furthermore all the circuit or a part of the circuit may be constituted as MMIC. Though a dielectric resonator 5 is used in the above-mentioned oscillators, other type of resonator or resonance circuit may be used. Instead of the use of electronic components such as, inductive element or capacitor, of lumped parametric constant in the oscillators of FIGs. 2, 4, 6, 11 or 13, the electronics components may be those of distributed constant circuit of the equivalent characteristic. Furthermore, in the oscillator of FIG.9, either one or both of the strip lines 17 and 18 may be realized by inductive element (of the lumped parametric constant). Besides, in the circuit of FIG.9, instead of the capacitive open ended strip line 16, a capacitive closed ended strip line may be used, or alternatively a capacitor of lumped parametric constant component such as MIM capacitor may be used. It is no need to mention that optimum values of the inductive element 2, strip lines 16, 17 and 18, capacitors 14, 15, 19 and 20 may be different from the values disclosed in the oscillator, depending on the characteristic of the FET 1. In the microwave oscillator of the above-mentioned configulations, in order to impress a lower voltage on the gate 11 of the FET 1 than the source 13, the dummy resistor 6 of, for instance, about 50 Ω is actually grounded with respect to DC current. That is, in order to make the voltage of the gate 11 to the ground potential, it is necessary to ground one end of the dummy resistor 6 by making a through-hole on a microwave substrate. That is, grounding of the resonance circuit by some means has been required. Furthermore, in such configuration, there is a problem that if the gate 11 of the FET 1 is grounded with a low resistance with respect to DC current, there is a possibility of a large current flows from the gate 11 to the source 13 of the FET 1, that is, in forward direction of the gate current, in positive half cycle of oscillation, since the oscillation is a large amplitude operation of the FET 1, thereby to shorten the lifetime of the FET 1. FIG.15, FIG.16 and FIG.17 show a preferred embodiment of the invention wherein the above-mentioned problem of undesirable flow of large current from the gate 11 to the source at the oscillation is dissolved. FIG.15 shows a pattern of an MMIC chip, FIG.16 is an equivalent circuit diagram of the MMIC chip of FIG.15 and FIG.17 is a drawing of a microwave oscillator using the MMIC chip. The corresponding parts and components with the preceding embodiments are designated by the same reference numerals. In FIG.15, FIG.16 and FIG.17, the MMIC chip 21 is connected in a drain-grounded circuit. The source 13 of the FET 1 is grounded through a series connection of a self-bins resistor 8 and a 1/4 wavelength strip line 9. To the gate 11 of the FET 1, a series connection of a DC stop capacitor 22 and a strip line 23 having characteristic impedance of 50 Ω is connected. A high resistance resistor 24 is connected between the gate 11 of the FET 1 and a junction point A between the self-bias resistor 8 and the 1/4 wavelength strip line 9. The drain 12 of the FET 1 is connected through a shortcircuiting stab 2' and a bypass capacitor 7 to the ground, and the junction point between the shortcircuiting stab 2' and the capacitor 7 is connected to a positive voltage feeding point 3', wherefrom a bias voltage is fed. The source 13 is connected through a series connection of a capacitor 14 and a strip line 25 of characteristic impedance of 50 Ω to the output terminal 10. A resonance circuit 26 comprises a dielectric resosnator 5, a strip line 4, a dummy resistor 6 of 50 Ω and an open ended 1/4 wavelength strip line 28. The dielectric resonator 5 is electromagnetically coupled with the strip line 4 and the 1/4 wavelength strip line 28. The 50 Ω dummy resistor 6 is not grounded with respect to DC current. By connecting the terminal 29 of the MMIC chip 21 to the resonance circuit 26, as seen from the terminal 29, the MMIC chip 21 having a negative resistance reacts with the dielectric resonator 5, so that the oscillation frequency of the microwave oscillator is controlled by the resonance frequency of the dielectric resonator 5. Oscillation output is supplied to a load connected to the output terminal 10 of the MMIC chip. In the embodiments shown in FIGs. 15, 16 and 17, grounding with respect to DC current of the gate 11 of the FET 1 is made through a high resistance resistor 24 formed inside the MMIC chip 21. Therefore, there is no need of providing a grounding circuit on the side of the resonance circuit unit 26, and the configuration of the resonance circuit 26 is simplified. Furthermore, possibility of occurrence of dangerous large current in the FET 1 at oscillation can be prevented by selection of the value of the high resistance resistor 24 connected across the source 13 and the gate 11 to be from several KΩ to several tens KΩ, and thereby, deterioration of lifetime of MMIC is prevented. FIG.18 is circuit diagram of a still other embodiment of MMIC oscillator embodying the present invention, wherein difference from the configuration of FIG.16 is that the circuit of FIG.18 has a bypass capacitor 30 connected between the source 13 and the ground, to make the circuit a source-grounded oscillator, whereas the circuit of FIG.16 is of a drain grounded oscillator. Other parts and components are the same as the circuit of FIGs. 16 and 17. The source 13 of the MMIC chip 31 is grounded through a series connection of a 1/4 wavelength strip line 9 and a self-bias resistor 8, and the source 13 is further grounded by a bypass capacitor 30. The gate 11 of the FET is connected through a series connection of a DC stop capacitor 22 and a strip line 23 of a characteristic impedance of 50 Ω to a resonance circuit connection terminal 29. A junction point B between the self-bias resistor 8 and the 1/4 wavelength strip line 9 is connected through a high resistance resistor 24 formed on the MMIC to the gate 11. The drain 12 of the FET 1 is connected through an output matching circuit configurated by series-connected strip lines 32 and 33; and junction point between the strip lines 32 and 33 is connected through a DC stop capacitor 34 to an output terminal 37, and the other end of the output matching circuit 33 is connected to a drain-bias-feeding terminal 36 and also is grounded through a bypass capacitor 35. The circuit issues oscillation output from the output terminal 37 by connection of a resonation circuit 26 shown in FIG.17 to the terminal 29. Since the grounding of the gate 11 of the FET with respect to DC voltage is made through the high resistance resistor 24 formed in the MMIC chip 31, there is no need of providing a grounding terminal for the gate 11 of the FET 1 on the side of the resonance circuit 26. Therefore, the configuration of the resonance circuit is simplified. Furthermore, by selecting the resistance of the resistor 24 high, for instance from several KΩ to several tens KΩ, the dangerous large forward gate current at the oscillation can be suppressed. FIG.19 is an equivalent circuit diagram of another embodiment of the MMIC in accordance with the present invention. Principal difference from the foregoing embodiment of FIG.16 is that, this embodiment of FIG.19 utilizes a negative bias voltage, whereas the embodiment of FIG.16 uses the positive bias power source. Therefore, in the circuit of FIG.19, one end of the shortcircuiting stab 2' is grounded. And the 1/4 wavelength strip line 9 is bypassed by a bypass capacitor 38 with respect to the oscillation frequency. As the bias power source of the MMIC chip 39, a negative voltage is impressed from the source bias terminal 40, and other parts are the same as those of FIG.16. In the embodiment of FIG.19, wherein the negative bias power source is used, the gate 11 becomes the same potential as that of the source bias terminal 40, whereas if the gate 11 is grounded through the resonation circuit the gate 11 becomes ground potential and a normal bias voltage fails to be impressed on the gate 11. In this embodiment of FIG.19, however, normal bias voltages are impressed on respective electrodes of the FET 1, and therefore, the negative bias voltage can be used. Furthermore. the effects obtained in the embodiment of FIG.16 are also enjoyable in this embodiment. FIG.20 is an equivalent circuit diagram of a still other embodiment of MMIC oscillator embodying the present invention, wherein difference from the configuration of FIG.16 and FIG.19 is that the circuit of FIG.20 has both the bypass capacitor 7 to bypass the end of the shsortcircuiting stab 2' and a bypass capacitor 38 to bypass the end of the 1/4 wavelength strip line 9, both at the oscillation frequency. Other parts and components are the same as the circuits of FIG.16 and FIG.19. The drain bias terminal 3 and the source bias terminal 40 are impressed with bias voltages, and are grounded with respect to DC voltage. If the voltage to be impressed on the drain bias terminal 3 is selected to be higher than the voltage to be impressed on the source bias terminal 40, selection of polarities of the bias voltage becomes free. In the embodiment of FIG.20, besides the effect of free selection of the polarities of the bias voltages, other effects of the embodiments of FIG.16 and FIG.19 are enjoyable. In the aforementioned embodiments, the capacities and the inductors may be replaced with capacitive elements such as capacitive strip lines and the inductive elements such as inductive strip lines, respectively, and the same operation and function are obtainable thereby.

Claims: A band reflection type microwave oscillator comprising a FET (1) having a gate (11), a source (13) and a drain (12), a band reflection type resonator (4, 5, 6) coupled to the gate (11), a first inductive element (2') whose first terminal is connected to said drain (12) and whose second terminal is connected to a DC power source (3'), and an output terminal (10) which is coupled to said source (13), characterized in that said first inductive element (2') has an inductance for providing increased negative resistance at the gate of said FET (1) at the oscillation frequency of said microwave oscillator, a capacitor (7) being connected between ground and said second terminal of said first inductive element (2') to short-circuit to ground said last mentioned terminal at an oscillation frequency of said resonator (5), a series connection of a first resistor (8) of a relatively low resistance and a 1/4 wavelength strip line (9) is connected to said source (13) at said first resistor and is connected to the ground at said 1/4 wavelength strip line (9), and a second resistor (24) of a relatively high resistance is connected between said gate (11) and the junction point (A) between said first resistor (8) and said 1/4 wavelength strip line (9). An oscillator in accordance with claim 1, characterized in that a microwave resonator (26) composed of a strip line (4), a dielectric resonator (5) electromagnetically coupled to said strip line (4) and a dummy resistor (6) which is connected to said strip line (4) and is isolated from the ground with respect to DC current microwave frequency current, out is grounded with respect to an oscillation frequency is connected to said gate (11) of said FET (1) through a strip line (23) and a capacitor. An oscillator in accordance with claim 1, characterized in that one end of said 1/4 wavelength strip line (9) is bypassed by a bypass capacitive element (38) and the other end of said 1/4 wavelength strip line (9) is connected to said source (13) through said first resistor (8), and an inductive element (2') connected to said drain (12) of said FET (1) is grounded by a second bypass capacitive element (7). An oscillator in accordance with claim 1, characterized in that a DC blocking element (22) is provided between the gate (11) of said FET (1) and said microwave resonator (26). A band reflection type microwave oscillator comprising a FET (1) having a gate (11), a source (13) and a drain (12) coupled to a bias-feeding terminal (36) and a band reflection type resonator (4, 5, 6) coupled to said gate (11), characterized in that a capacitance (30) is connected between said source (13) and the ground, an output terminal (37) is connected to said drain (12), a series connection circuit of a first resistor (8) of a relatively low resistance and a 1/4 wavelength strip line (9) is coupled at said first resistor to said source (13) and is coupled at 1/4 wavelength strip line (9) to ground, and a second resistor (24) of a relatively high resistance is coupled between said gate (11) and a junction of said first resistor (8) and said 1/4 wavelength strip line (9).

Inventors: MEKATA TSUYOSHI, SAKA HIROSHI, TANAKA TOSHIHIDE, MEKATA, TSUYOSHI, SAKA, HIROSHI, TANAKA, TOSHIHIDE
Applicants: MATSUSHITA ELECTRIC IND CO LTD, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Application year: 1986
Main classification: H03B5
IPC codes: H03B5