COMPOSITION BASED ON AN AQUEOUS DISPERSION OF AN ADDITION POLYMER

Abstract: The invention relates to a composition baesd on an aqueous dispersion of an addition polymer of one or more olefinically unsa­ turated monomers, emulsion stabilizers and/or emulsifiers and a sili­ con compound. The addition polymer comprises monomer units containing acid groups and the silicon compound used is an epoxysilane with the for­ mula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄) or phenyl, R² = alkoxy (C₁-C₄), alkyl (C₁-C₄) or phenyl, R³ and R⁴ = alkoxy (C₁-C₄) or OH The composition can be applied in adhesives and coatings.

Description: The invention relates to a composition based on an aqueous dispersion of an addition polymer of one or more olefinically unsa­ turated monomers, an emulsion stabilizer and/or emulsifier and a sili­ con compound. Optionally the composition may yet contain other usual additives. In the Netherlands patent 173974 adhesives are desbribed con­ sisting of polymeric binding agents, fillers and water, in which the polymeric binding agents comprise certain alkoxysilane compounds. These silicon compounds are added during the polymerization and are incorporated in the polymer molecule. The silicon compounds hydrolize to form hydroxyl groups. The wet tensile strength of these adhesives is insufficient. The object of the invention is to provide a composition based on an aqueous dispersion of an addition polymer of one or more olefi­ nically unsaturated monomers, an emulsion stabilizer and/or emulsi­ fiers and a silicon compound which adheres well to mineral and organic substrates, particularly also under wet conditions. The composition according to the invention provides a solu­ tion to this problem and is characterized in that the addition.polymer comprises monomer units containing acid groups and that the silicon compound used is an epoxysilane with the formula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄) or phenyl, R² = alkoxy (C₁-C₄), alkyl (C₁-C₄) or phenyl, R³ and R⁴ = alkoxy (C₁-C₄) or OH. According to a preferred embodiment of the invention, 0.1-5 %(wt), preferably about 0.3-1.5 %(wt), epoxysilane is used, based on the addition polymer. According to a further preferred embodiment of the invention, the epoxysilane is added at a pH between 1.5 and 8, more specifically at a pH between 4 and 6. Examples of suitable epoxysilane are particularly: glycidoxyalkyl trialkoxysilanes, glycidoxyphenyl trialkoxysilanes, glycidoxyalkyl dialkoxyalkylsilanes, glycidoxyphenyl dialkoxyalkylsilanes, glycidoxyalkyl dialakoxyphenylsilanes, glycidoxyphenyl dialkoxyphenylsilanes, and glycidoxyphenyl dialkoxyalkylsilanes and mixtures hereof. According to a preferred embodiment of the invention, the epoxysilane used is an epoxysilane with the formula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄), R², R³ and R⁴ = alkoxy (C₁-C₄) According to a further preferred embodiment of the invention, 3-glycidoxypropyltrimethoxysilane is used as epoxysilane. In US-A-4,032,487 and US-A-4,077,932 compositions are described consisting of acrylate dispersions based on nitrogen con­ taining monomers and epoxysilanes. In the composition according to the invention, however, an entirely different addition polymer is used because the polymer contains no amino monomer. In addition, the epoxysilane according to the invention is added at a pH between 1.5 and 8 and at a temperature between 20◊C and 30◊C. The present invention therefore relates to a simpler and cheaper composition. Aqueous dispersions of addition polymers can be prepared via processes as described in the Netherlands patents 160278 and 161769. The monomers used in the addition polymers according to the invention consist wholly or largely of monomers which do not contain any reactive groups other than the ethylenic unsaturation. Examples of these are the alkylacrylates, alkylmethacrylates, dialkylmaleates, dialkylfumarates, vinyl esters such as vinyl acetate, vinyl pro­ pionate, vinyl butyrate, vinyl pivalate, vinyl-2-ethylhexoate, vinyl stearate, vinyl laurate and/or vinyl versatate, vinyl ethers, vinyl chloride, alkenes such as ethylene, propylene or isobutene, butadiene, styrene, vinyltoluene, alphamethylstyrene or acrylonitrile. Mixtures of these monomers are also used. In many cases also monomers are used, in relatively small amounts, e.g. between 0.1 and 10 %(wt), which, in addition to the ethylenic unsaturation, also contain other reactive groups such as carboxyl groups, sulphonic acid groups, phosphate groups, amide groups, hydroxyl groups, alkoxymethyl amide groups or epoxy groups. Examples of such monomers are acrylic acid, methacrylic acid, fumaric acid, maleic acid, crotonic acid, itaconic acid, hydroxyethylacrylate, hydroxyethylmethacrylate, hydroxypropyl­ methacrylate, ethyleneglycolmonoallylether, N-methylolacrylamide, N-­ methylolmethacrylamide, n-butoxymethylacrylamide, acrylamidopropane­ sulphonic acid, n-butoxymethylmethacrylamide, glycidylacrylate, glyci­ dylmethacrylate, allylglycidylether and vinylsulphonic acid. In amounts up to 10 %(wt) at most, alkenically poly­ unsaturated monomers, such as triallylcyanurate, divinylmaleate, divi­ nyladipate, vinylcrotonate and ethyleneglycoldiacrylate ester, can be used. According to a preferred embodiment of the invention, styre neacrylate copolymer is applied as addition polymer comprising monomer units containing acid groups. According to a further preferred embodiment of the invention the addition polymer contains at least 2 %(wt) and preferably between 2 %(wt) and 10 %(wt), more specifically between 4 %(wt) and 8 %(wt) monomer units containing acid groups, relative to the addition polymer. Preferably acrylic acid and/or methacrylic acid and/or itaco­ nic acid are used as monomer units containing acid groups. The acid used may also be phosphoric acid esters of hydroxyethyl-­ (meth)-acrylate. The addition polymer may be in the form of a dispersion powder or in the form of an aqueous dispersion. As catalyst systems for the polymerization of the olefini­ cally unsaturated monomers initiators can be used which dissolve either in the aqueous phase or in the monomer or in both. Examples of suitable types of compounds are persulphates, hydrogen peroxides, organic peroxides, such as hydroperoxides and azo compounds, whether or not in combination with reductants. Depending on the nature of the monomers and on the desired properties of the polymer and on the desired size of the polymer particles, various kinds of emulsifiers can be used either separately or in combination. Generally both anionic and non-ionic emulsifiers can be used. Optionally, protective colloids can also be used. In many cases a mixture of an anionic and a non-ionic emulsifier is the most satisfactory. A few examples of suitable classes of compounds are alkylbenzenesulphonates and alkyl (C₁₀-C₁₈) sulphates, mono/dialkylphosphates, (C₁₀-C₁₈) fatty acid salts, polyglycolethers of (C₈-C₁₈) alcohols or alkylphenols and block copolymers of ethylene oxide and propylene oxide. The amount of emulsifier or combination of emulsifiers used depends on the type of monomer and on the type of emulsifier. Generally an amount between 0.1 and 10 %(wt) is used, based on the total amount of solid, and more specifically an amount between 0.5 and 5 %(wt). The polymerization can be effected by first producing a pre-­ emulsion of the monomers and a part of the total amount of water and emulsifiers and subsequently starting the polymerization with the aid of a catalyst whereas the metering time of the pre-emulsion and the catalyst is between 2 and 5 hours. On the other hand it is possible to first polymerize part of the monomers in emulsion and to add more monomers stepwise, separately or mixed. In addition, it is possible to first polymerize a monomer or a combination of monomers of a certain type and to subsequently add other monomers or combinations of mono­ mers, so that polymer particles with a laminated structure are formed. The concentration of acid groups can be different for each layer for instance with a high concentration of acid groups on the outside of the particle and a low concentration in the centre of the particle. The amount of acid required may then be less than 2.0 %(wt), for example between 0.5 and 1.0 %(wt), based on the total polymer. A sur­ vey of various possible polymerization methods is to be found in the Netherlands patent application 7309796. The reaction temperature during the polymerization may be between -15◊C and 100◊C, preferably between 20◊C and 90◊C. If the polymeriza­ tion is carried out below 0◊C, an antifreeze like ethyleneglycol must be added. During the polymerization other compounds may also be pre­ sent, for instance chain length regulators, such as mercaptans, and buffers, such as sodium bicarbonate. In addition, substances like plasticizers, crosslinking agents, flow-promoting agents, thickeners, colourants or pigments, etc. may be present during the polymerization or be added after the polymerization. The pH of the dispersion can be adjusted with ammonia, amines or lye. It is also possible to react part of the acid groups after the polymerization with calcium ions or zinc ions, such as calcium acetate or zinc ammonium acetate, in such a manner that at least 2 %(wt), preferably 4 %(wt), of acid groups remains, relative to the addition polymer. The epoxysilane is preferably added after the polymerization of the addition polymer. The epoxysilane may, however, also be added during the polymerization. In addition, a combination of polymerizable vinyl­ silane and epoxysilane may be used, in which case the vinylsilane is added during the polymerization and the epoxysilane after the poly­ merization. The composition according to the invention is used, for instance, as raw material for the adhesive industry, for coatings such as synthetic plastering materials, coating agents for the building industry, paints, etc. The invention is further elucidated by means of the following examples without, however, being restricted thereto. Example I A mixture consisting of an aqueous pre-emulsion of the mono­ mers styrene, butylacrylate and acrylic acid (weight ratio 45/50/5) is polymerized at 80 ◊C with 2.5 %(wt) of an anionic emulsifier (nonyl­ phenyl 10 ethylene oxide sulphate), based on the monomers. The metering time of the pre-emulsion is 3 hours. As catalyst 0,5 % by weight of ammoniumpersulfate is used. After 2 hours' after-reaction at 85◊C, the dispersion formed is cooled to 25 ◊C and subsequently 1.25 % of 3-glycidoxypropyltrimethoxysilane (relative to the addition polymer) is added. The pH, between 2,0 and 3,0, is brought to 5.0 using ammonia. The dry substance content of the dispersion is 50 %. The minimum film-forming temperature (MFT) is 16◊C (measured according to DIN 53787). Example II The process of example I is repeated with the difference that 0.75 %(wt) instead of 1.25 %(wt) of 3-glycidoxypropyltrimethoxysilane is added. Example III The process of example I is repeated with the difference that 2 %(wt) instead of 1.25 %(wt) of 3-glycidoxypropyltrimethoxysilane is added. Comparative example 1 The process of example I is repeated with the difference that 1.25 %(wt) of an incorporated vinyltris(2-methoxyethoxysilane) is pre­ sent instead of 3-glycidoxypropyltrimethoxysilane. Example IV The process of example I is repeated with the difference that the styrene/butylacrylate/acrylic acid weight ratio is 48/47/5. The amount of 3-glycidoxypropyltrimethoxysilane is 1.25 %, based on the addition polymer. The MFT is 23 ◊C. Example V The process of example I is repeated with the difference that 8 %(wt) acrylic acid is used instead of 5 %(wt) acrylic acid. Comparative example 2 The process of example I is repeated, but now with addition of methyltrimethoxysilane (1.25 %(wt), based on the monomer) instead of 3-glycidoxypropyltrimethoxysilane. Example VI The dispersion subsequently serve as the base for tile adhe­ sives with the following compositions: This composition is mixed for ten minutes, upon which 8 parts by weight of 2-amino-2methylpropanol 95 % (ex Angus GmbH) and water are added in a weight ratio of 1 : 1. Of these tile adhesives the tensile strength is determined with the aid of ceramic tiles, 5 × 5 cm, glued to concrete tiles (DIN 18156). Tile adhesives of a good dispersion may be required to have a wet tensile strength of at least 0.50 N/mm². These examples show that the tensile strength requirement is complied with excellently by the addition, to the addition polymer according to the invention, of an epoxysilane according to the invention.

Claims: 1. Composition based on an aqueous dispersion of an addition polymer of one or more olefinically unsaturated monomers, emulsion stabi­ lizers and/or emulsifiers and a silicon compound, characterized in that the addition polymer comprises monomer units containing acid groups and that the silicon compound used is an epoxysilane with the formula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄) or phenyl, R² = alkoxy (C₁-C₄), alkyl (C₁-C₄) or phenyl, R³ and R⁴ = alkoxy (C₁-C₄) or OH 2. Composition according to claim 1, characterized in that 0.1 - 5 %(wt) of epoxysilane is used, relative to the addition polymer. 3. Composition according to claim 1, characterized in that the epoxy­ silane used is an epoxysilane with the formula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄), R², R³ and R⁴ = alkoxy (C₁-C₄) 4. Composition according to claim 3, characterized in that the epoxy­ silane used is 3-glycidoxypropyltrimethoxysilane. 5. Composition according to any one of claims 1-4, characterized in that the epoxysilane is added at a pH between 1.5 and 8. 6. Composition according to any one of claims 1-5, characterized in that the addition polymer used is styreneacrylate copolymer. 7. Composition according to any one of claims 1-6, characterized in that the addition polymer contains at least 2 %(wt) monomer units containing acid groups, based on the addition polymer. 8. Coating obtained with the composition according to any one of claims 1-7. 9. Adhesive obtained with the composition according to any one of claims 1-7. 10. Moulded products obtained with an adhesive according to claim 9. Claims for contacting State: AT 1. Process for the preparation of a composition by mixing an aqueous dispersion of an addition polymer of one or more olefinically unsaturated monomers, emulsion stabilizers and/or emulsifiers and a silicon compound, characterized in that the addition polymer comprises monomer units containing acid groups and that the sili­ con compound used is an epoxysilane with the formula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄) or phenyl, R² = alkoxy (C₁-C₄), alkyl (C₁-C₄) or phenyl, R³ and R⁴ = alkoxy (C₁-C₄) or OH 2. Process for the preparation of a composition according to claim 1, characterized in that 0.1 - 5 %(wt) of epoxysilane is used, rela­ tive to the addition polymer. 3. Process for the preparation of a composition according to claim 1, characterized in that the epoxysilane used is an epoxysilane with the formula where R = epoxyalkyl (C₁-C₄), R¹ = alkyl (C₁-C₄), R², R³ and R⁴ = alkoxy (C₁-C₄) 4. Process for the preparation of a composition according to claim 3, characterized in that the epoxysilane used is 3-glycidoxypropyltrimethoxysilane. 5. Process for the preparation of a composition according to any one of claims 1-4, characterized in that the epoxysilane is added at a pH between 1.5 and 8. 6. Process for the preparation of a composition according to any one of claims 1-5, characterized in that the addition polymer used is styreneacrylate copolymer. 7. Process for the preparation of a composition according to any one of claims 1-6, characterized in that the addition polymer contains at least 2 %(wt) monomer units containing acid groups, based on the addition polymer. 8. Coating obtained with the composition obtained according to any one of claims 1-7. 9. Adhesive obtained with the composition obtained according to any one of claims 1-7. 10. Moulded products obtained with an adhesive obtained according to claim 9.

Inventors: PONS, DICK ADRIAAN, SEP, WALTHERUS JACOBUS, VAN HOUT, JOHANNES BAREND
Applicants: DSM RESINS BV
Application year: 1986
Main classification: C08L25
IPC codes: C09D125, C09J125, C08K5, C08F8