PROCESS FOR THE MANUFACTURE OF WIRE SCRIBED CIRCUIT BOARDS AND ARTICLES PRODUCED THEREBY

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

Description: This invention is related to discrete wire inter­ connections and processes for scribing conductors on a surface of a substrate to form or to modify point-­ to-point electrical connections. Processes that employ wires as the interconnection medium in the production of circuit boards are known. In one such process, known as Stitch Weld™ process, a standardized circuit board panel is utilized. The panel is comprised of pads and circuit holes representing va­ rious component sizes and pin densities of components. Interconnection is achieved by welding end points of each wire to pads on the panel. This allows wires to be looped across the board between end points. Wires typi­ cally cover the entire board thereby blocking the areas where components are to be placed. Component insertion in this process is, therefore, difficult, and automatic component insertion, in most cases, cannot be used. In US patent 4,414,741 it is suggested to place tem­ porary pins on a circuit board panel to define channels which do not interfere with component locations. Wires are routed within these channels, the temporary pins are removed and the circuit board covered by a plastic sheet which encapsulates the wires to retain them in the channels. In this process, wires still loop across the surface of the board from ends of the channels to wire termination points. Since certain portions of the circuit board are dedicated to the channels, the potential com­ ponent density of the board is greatly diminished and special holes must be drilled in the substrate to accommo­ date the temporary pins. Electrical interference and signal distortion may arise because a multiplicity of wires are positioned closely together in the channels. "Automatic Wiring Equipment For Hybrid Substrates", Pro­ ceedings of the 32nd Electronic Components Conference, May 1982, describes a process wherein a fine line of ad­ hesive is first dispensed along the desired wire paths. Wires are subsequently routed over the adhesive to bond them to the circuit board. End portions of the wires are then bonded to pads. The step of placing adhesive on the board prior to wire placement doubles the manu­ facturing time of the process and makes it inefficient. In addition, when wires cross over one another, there is no adhesion between them. US Patents 3,674,914 and 3,674,602 describe a process and apparatus wherein wire is scribed onto a surface of an insulating base. A strand of preformed wire is fed continuously onto and simultaneously fixed to the sur­ face. The wire is cut at a predetermined terminal point on the base, thereby producing a predetermined inter­ connection pattern. In practice, and as described in the patents, the wires are adhered to the surface of the base by applying adhesive to the base surface and acti­ vating the adhesive when the wires are scribed to the base. A difficulty of this process is, however, that when activated on the board, the soft adhesive may allow the wire to drift or swim before the wire becomes ad­ hesively set. This may lead to short or open circuits when the wires are not in their desired position on the board. These patents also suggest the possibility of applying adhesive to the wires prior to the scribing of the wire conductors. However, there is no teaching of how to practice this suggestion. Japanese laid-open Application No. 57-136391 describes a process wherein wires are scribed in a predetermined pattern onto an adhesive coated surface of a substrate. Laser energy is used to soften the adhesive prior to scribing the wires. GB Patent 1,504,252 describes a method of bonding and soldering insulated wires in a predetermined pattern on an insulating base support to establish electric contacts between conductive zones on the support. Adhesive used for bonding the wires is deposited on the surface of the base support as a film layer in which heated wires may be embedded. Alternatively, a dry film coated wire is pro­ posed which can be made self-adhesive by heating or passing through a suitable solvent. Processes that employ wires as the interconnection medium in the modification of printed circuit, multi­ layer and wire-scribed circuit boards are also known. These modifications may be required for different rea­ sons. A circuit interconnection sequence may have to be changed by the designer to accommodate newly designed functionality on the circuit board. A conductor may be omitted or a misconnection may be made during the design process. A circuit board modification also may be re­ quired to correct a defect on the board that occurred du­ ring manufacture. The boards are typically modified by cutting unneeded connections and using small insulated wires commonly called "jumper wires". This process of wire addition re­ quires manual soldering of the wire end points. Wires are usually looped away from the board and greater num­ bers of jumper wires are added to the board, the circuit board becomes and unwieldly mass of looped jumper wires, commonly called a "rat's nest". The rat's nest often im­ pedes or prevents the use of automatic component in­ sertion, automatic soldering equipment and automatic cir­ cuit board test equipment, thus requiring additional manual operations which are time-consuming, error-prone and costly. When high volume circuit board producers are forced to use this process, it is extremely costly because it is labor-intensive. Additionally, this process does not re­ sult in repeatable precise geometrical wire placement on all boards in a manufacturing lot. Also, defined impedance is difficult to achieve with jumper wires and reproducible electrical characteristics may be difficult to maintain. Developments in semiconductor technology have increased the functionality of semi-conductors, i.e., the number of operations performed by the semi-conductor, while de­ creasing the size of the overall semi-conductor package. This results in a greater number of contact points in a smaller area for interconnections. Because of this, the circuit board must provide for a higher density of inter­ connect per unit area. This increases the probability of omitting errors during manual modification processes. Webizky et al, "Making 100.000 Circuits Fit Where At Most 6.000 Fit Before", Electronics, Vol. 52, No. 15 (August 2, 1979) describe a process wherein one surface of a cir­ cuit board is dedicated to pattern modifications. Although this process may improve the circuit board repair time, an additional circuit layer must be added to the board to accommodate the changes, thus increasing manufacturing time and cost as well as the dimension of the circuit board package. Processes for pseudo-automatically repairing/modifying have been proposed. These include automatic positioning devices, optical light spot indicators, and laser solder­ ing equipment. These processes have helped to increase productivity, but they are still heavily dependent on manual placement of conductors or jumper wires. All the automated processes require a smooth, flat surface for modification. US Patent 4,327,124 describes a process for screen print­ ing circuit modifications on an etched printed circuit board wherein a dry photoprintable film resist is laminated on the circuit board over the existing conductors, exposed, developed and cured. To apply the modifying conductors, a metal-loaded, conductive polymer ink is applied in a screen printing operation to the film resist layer in the pattern of the conductor modifications.The circuit pattern is then covered with a copper metal powder while the conductive polymer ink is still wet. The powder is pressed into the ink and the composition is cured. After the curing step, solder is applied. The solder and copper are then fused together in an infrared reflow soldering machine. This process is rather complex and has not been widely adopted. It is an object of this invention to provide a process for efficiently and accurately manufacturing inter­ connection circuit boards and the circuit boards pro­ duced thereby. Another object of this invention is to provide a process for interconnection in which the conductors can adhere to various types of surfaces and surface topographies. Still another object is to provide a process for repair­ ing or modifying boards such that the repaired or modi­ fied circuit boards can be subsequently operated on by automatic component insertion, automatic soldering and automatic testing equipment. A further object of the invention is to provide an auto­ mated process and apparatus for repairing or modifying interconnection circuit boards with repeatable precise geometric placement of conductors on the boards. The following terms used throughout the specification have the meanings as defined below: A "conductor" is at least one preformed, elongated fila­ ment having at least one portion, a "conductive portion", capable of conducting energy, such as electrical or light energy. Conductors may be coated with an insulation layer. A "substrate" is a base having a surface on which a cir­ cuit pattern may be produced. A substrate may already have a circuit pattern on its surface. "Wire or conductor scribing" is a process by which con­ ductors are applied and affixed to a substrate in a pre­ determined pattern to form a circuit pattern. "Tacky" is the property of an adhesive which enables it to form a bond of measurable strength immediately after it is brought into contact with a substrate. "Blocking" is undesired adhesion between touching layers of a material such as may occur under moderate pressure during storage or use. An "interconnection" is a process or system permitting the joining of discrete conductor connections. "C-stage" is the final stage in the reaction of certain thermosetting resins in which the material is relative­ ly insoluble and infusible. A "thermoset" material is a material that will undergo or has undergone a chemical reaction by the action of heat, ultrasonic energy, ultraviolet light etc., leading to a relatively infusible state. A "conductor end point" is the point of a conductor which can be attached to a terminal point. A "heat activatable" adhesive is a dry adhesive film or coating that is rendered tacky or fluid by application of heat or heat and pressure. A "light activatable" adhesive is a dry adhesive film or coating that is rendered tacky or fluid by application of light energy. A "hot melt adhesive" is an adhesive which is applied in a molten state and forms a bond upon cooling to a solid state. A "terminal point" is at least one point at which an inter­ connection is made with a conductor. Terminal points can be surface pads, holes or apertures with or without metallized walls, conductive cavities, conductive leads conductive fingers, or the like. The invention discloses a process for scribing a con­ ductor in a predetermined pattern onto a surface of a sub­ strate comprising at least one conductor, a substrate and an adhesive for bonding said conductor to said surface in a fixed position, said adhesive being non-tacky prior to activation, activatable by application of energy there­ to, and reverting to a solid, non-tacky condition after activation, scribing the conductor on said surface of said substrate following a predetermined path, which is characterized in that said energy for activating said ad­ hesive is applied by means of a pulsed radiation or heated fluid beam. In the preferred embodiment of the invention, the ad­ hesive is applied to the wire used in scribing the con­ ductor pattern rather than to the board surface as has been the prior practice. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface. The technique of this invention can be used in the inital manufacture of circuit boards or in the modification of pre-existing boards. In this process, the conductor is precoated with an ad­ hesive. Prior to the scribing step, the adhesive coating is solid, non-tacky, non-blocking and flexible. In the course of the scribing step the adhesive is activated to a tacky state by applying energy. The adhesive coating is capable of rapidly reverting to a solid, non-tacky condition after activation to form a bond. The adhesive coating on at least a portion of the conductor is acti­ vated prior to, or simultaneously with, scribing the con­ ductor. According to the process of this invention, the activated portion of the adhesive coating is placed in contact with and wets the substrate surface, reverts to a non-tacky state and forms a bond between the condutor and the surface. The adhesive may be cured to a C-stage or a thermoset condition subsequent to the scribing step. The adhesive coating preferably employed for the con­ ductors is a heat activatable composition which comprises (a) a film forming polymeric resin; (b) a filler and/or at least one polyfunctional compound having a polyaromatic backbone; and (c) a curing agent non-reactive under conditions providing heat activation of the adhesive, but being capable of reacting with the other components of the adhesive to cure the adhe­ sive to the C-stage. The preferred technique for activating the adhesive uses pulsed laser energy wherein the pulse repetition rate va­ ries as a function of the rate at which the wire is being scribed. The pulse energy is adjusted to provide the correct quantum of energy to activate the adhesive. Successive pulses activate adjacent or partially over­ lapping sections along the conductor length with the number of pulses per uniform length being constant. As a result, the pulse repetition rate varies as a function of speed and the energy applied along the length of the conductor is of the correct uniform value regardless of scribing speed. The interconnection circuit board according to the in­ vention includes at least one insulated conductor which is adhered to the surface of the substrate by means of a non-­ tacky, non-blocking adhesive coating at least partially encapsulating the conductor. In a cross-sectional view, the outline of the adhesive coating usually forms a characteristic bell-shaped configuration over the con­ ductor. The adhesive coating is bonded to the substrate at the points of contact between the surface and the con­ ductor. In the vicinity of conductor crossovers, the ad­ hesive forms a bond between conductors. Figures 1A through 1D show, sequentially, perspective views of circuit board modification. Fig. 1A is a perspective view with partial cut-aways showing a completed interconnection circuit board, having terminal holes, prior to insertion of components. Fig. 1B shows the circuit board of Fig. 1A wherein modi­ fication conductors have been scribed to the surface of the board according to the process of the invention. Fig. 1C is a perspective view of the modified circuit board of Fig. 1B with three components inserted. Fig. 1D shows the modified circuit board of Fig. 1C after solder is placed in the terminal holes. Fig. 1E is a perspective view of a modified multiple layer interconnection circuit board showing three layers of circuit patterns, inserted components and a via connecting the layers. Figures 2A through 2C show, sequentially, perspective views of the modification of an interconnection circuit board for surface mounted components. Fig. 2A is showing an interconnection circuit board having six terminal pads prior to addition of components. Fig. 2B is showing the board of Fig. 2A with two insulated conductorscribed to the surface of the board according to the process of the invention. Fig. 2C is a perspective view of the board of Fig. 2B sub­ sequent to addition of a surface-attached component. Fig. 3A is a perspective view of a circuit board having six terminal holes and two suface-attached components on which two modification conductors have been scribed. Fig. 3B is a perspective view showing a circuit board having conductive surface pads modified after component placement. Fig. 4A is a perspective view of a prefabricated circuit board format having twenty predrilled standardized metallized terminal holes in standardized locations. Fig. 4B is showing the circuit board format of Fig. 4A with two conductors scribed between terminal holes and soldered to said holes to make the interconnections. Fig. 4C is showing the circuit board format of Fig. 4B having a leaded component inserted into the terminal holes. Figures 5A through 5C, show, sequentially perspective views of the fabrication of a non-standardized inter­ connection circuit board having eight terminal holes and eight terminal pads. Fig. 5A is showing a circuit board panel having terminal holes and pads which is to be scribed with conductors according to the process of the invention. Fig. 5B is showing the panel of Fig. 5A after three ad­ hesive-coated conductors have been scribed between terminal points. Fig. 5C is showing the panel of Fig. 5B after components have been inserted and attached to the panel. Fig. 6 is a cross-sectional view of a circuit board including adhesive coated conductors adhered to both sides of the board. The invention is hereinafter described in detail with and adhesive coated conductor scribed in a predetermined pattern on a surface of a substrate. The adhesive is activated as the conductor is being scribed to form a bond holding the conductor in place. The circuit board is preferably thereafter cured to pro­ vide a permanent thermoset bond for the conductor pattern. Prior to activation, the adhesive coating is non-tacky, non-blocking and flexible, thus permitting handling and manipulation prior to and during scribing. The coated con­ ductor may be stored on a spool for easy storage and access and does not adhere to or leave residue which will clog the apparatus used to scribe the conductors. The ad­ hesive coating, in its activated state, provides ad­ hesion between the conductor and the surface of the sub­ strate of sufficient strength to allow the formation and subsequent preservation of conductor inflections on the surface. The adhesvie coatings used in the practice of the in­ vention are able to adhere to a wide variety of materials which are used on or comprise the surfaces of substrates useful in the interconnection circuit board industry, in­ cluding insulating and conductive surfaces. The substrate can be a blank circuit substrate or a cir­ cuit substrate having etched foil power and ground con­ ductors or the like, an electronic interconnection board, including a discrete-wired circuit board, a standard printed circuit board, a multilayer circuit board, a cir­ cuit board with components thereon, or a circuit board at any other stage of construction. Upon activation, the adhesive coating becomes tacky and can bond the conductor to the substrate surface. Once the adhesive coating is activated and the conductor applied and bonded to the surface, the adhesive coating rapidly reverts to a solid, non-tacky condition without any sub­ stantial change in the adhesive coating's conformation or volume. This reversion occurs in about 50 to 200 milli­ seconds which is sufficiently short to allow the conductor pattern to retain dimensional stability, thus limiting or substantially avoiding relative movement of the bonded conductors with respect to each other and the substrate surface. The adhesive coating and, if present, one or more under­ lying layer(s) of insulation should be removable at the endpoints of the conductor. When the insulation is removed, electrical connections can be made between the scribed conductor and the terminal points. The removal process is hereinafter referred to as "stripping". The bond formed by the adhesive coating employed in the practice of the invention can withstand any subsequent processing that is typically performed during the fabri­ cation of a circuit board. It is resistant to chemicals used during manufacture, such as cleaning solutions, solder flux and the like. One suitable, non-tacky, non-blocking, flexible adhesive coating composition comprises: (a) a first component comprised of a film forming polymeric resin (1) having an average molecular weight (M w ) between about 10.000 and about 100.000 and (2) having an epoxide, hydroxyl or unsaturated functionality greater than 2, said polymeric resin being selected from the group consisting of polyesters, polyurethanes, poly­ ethers, epoxies, allyl polymers and acrylics; (b) a second component selected from the group consisting of a filler, polyfunctional compounds and mixtures thereof, said polyfunctional compounds having an average molecular weight below about 7.000 and cont­ aining a polyphenol backbone, the weight ratio of said first component to said second component being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initiating a reaction with the functional groups of the polymeric resin to form crosslinks and cure the poly­ meric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the temperatures required to activate the adhesive composition, said curing agent being present in an amount sufficient to C-stage the polymeric resin; said composition being flexible, and in the C-stage capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when ex­ posed to dichloromethane at 25°C for 10 seconds. The adhesive coating may be thermoplastic or thermo­ setting. The coating may be composed of an adhesive comprising components selected from high molecular weight polyester, high molecular weight phenoxy resins, high mo­ lecular weight polyurethane, high molecular weight epoxy resins and polyolefins. Other compositions used in the adhesive coating of the in­ vention are set forth in co-pending patent application No. ........ entitled "Heat activatable Adhesive For Wire Scribed Circuits". The conductor coating may be made up of two or more layers. One layer may be an adhesive and the other lay­ er(s) may serve other functions. For example, an ad­ hesive layer may be applied to the conductor and a pro­ tective outer layer may be applied over it which can be dissipated by exposure to an energy source. The outer dry coating allows handling and spooling. The inner coating may be tacky with surface wetting characteristics. In another embodiment, the coating may contain micro-­ encapsulated regions of low viscosity, such as cyano­ acrylate, that can be released on exposure to pressure. When the encapsulated regions open, the adhesive proper­ ties of the coating are activated. A number of techniques are known which are suitable for applying the adhesive coating to conductors. During the scribing process of the invention, the con­ ductor preferably is automatically placed on and bonded to the substrate surface along a predetermined path. The substrate surface preferably is mounted on a movable work table. The conductor is fed to the substrate surface from a scribing head assembly and laid on the substrate surface by moving the work table relative on the scribing head assembly and by rotating said scribing head assembly in the direction of table movement. The wire scribing head assembly and the table movement are preferably numerically controlled. As the conductor is fed toward the surface, and just prior to its reaching it, the portions of the conductor's ad­ hesive coating which is to be placed in contact with the surface is activated. The conductor is brought into close proximity with the substrate surface sebsequent to or simultaneously with activation. The activated portion of the adhesive coating contacts and adheres to the substrate surface, forming a bond between the conductor and the sub­ strate surface. The energy used for activating the adhesive coating is applied by means of pulsed radiation or heated fluid beam. The level of the energy should be sufficient to activate the adhesive, but not to damage the conductor or the substrate surface. Radiant energy sourceswhich can be used in the practice of the invention include laser and focussed infrared radiation. The activating sources may be used alone or in combination. The preferred activating energy source is one or more pulsed laser beam(s). The energy output and spot size of the laser beams is controllable. A laser beam may be di­ rected at a selected portion of the adhesive coating on the surface of the conductor needed to form a bond with the substrate. A multiplicity of energy beams or beam splitting techniques can be provided. One energy beam may be used for activating the adhesive coating, while another energy beam may be used for other purposes such as stripping or soldering. In order to activate the adhesive coating, an energy beam is directed to a point on the conductor at or before the projected point of contact between the conductor and the substrate surface. The adhesive coating is activated at or prior to contacting the substrate surface such that it is in a tacky state when the conductor contacts the surface. Preferably, a pulsed laser beam is used for activating the adhesive coating; more preferably, a CO₂ laser beam which emits infrared radiation is used. The laser energy is directed at the desired requisite area on the adhesive coating, i.e., the underneath portion adjacent the sub­ strate contact point, and discharged in the form of a pulsed beam. The pulses can be created by interrupting the emission of a continuous wave laser beam by turning the power on and off, or by "Q-switching" using electro­ optic or mechanical shutters or acousto-optic couplers. The laser beam pulses are substantially uniform pulses with an energy content adjusted for existing conditions (e.g. beam focus, adhesive activation requirements etc.) so that the energy is sufficient to activate the ad­ hesive without damaging the conductor or surrounding surfaces. Therefore, the product of the pulse amplitude (energy level) and pulse width (pulse duration) should be constant. The "spot size" should be chosen as the minimum diameter large enough to allow easy alignment with the conductor. Larger spot sizes diffuse energy due to the Gaussian energy distribution of the beam and, hence, are undesirable. The pulses are preferably discharged at such a rate that the spots partially overlap on the con­ ductor so as to expose and activate the adhesive coating efficiently and evenly. A pulse is emitted each time a predetermined length of conductor is traversed. Once spot size has been chosen, pulse amplitude and pulse width are adjusted to produce sufficient energy to acti­ vate the exposed area of adhesive coating without damag­ ing surrounding surfaces. The adjustment of the pulse energy content also takes into account conditions such as laser efficiency, wire size, and the particular adhesive requirement. Since the number of pulses is constant per uniform length, the pulse repetition rate is a function of the speed at which the wire is being scribed. If a 20 watt continuous-wave CO₂ laser is used, and the scribing speed is between about 5 and 15 m/minute, the pulse width selected should be 200 to 2000 micro­ seconds, and the spot size selected should be from 0.5 to 2.5 mm in diameter. If wire handling equipment is fast enough, bonding speeds as high as, e.g., 25 m/min. can be achieved. In this context, reference is made to co­ pending patent application No. ........ entitled "Method of Manufacturing Interconnection Circuit Boards". Scribing speed may vary often and considerably during the scribing process. When the scribing process starts, there is an acceleration to running speed, during which time the coating of the conductor would be inconsistent. Emission of a fixed number of constant energy pulses per uniform length of movement obviates these problems. Each unit area of the conductor receives the same amount of energy regardless of the scribing speed. After contact of the conductor and the adhesive coating with the substrate surface,the adhesive coating loses energy and reverts to a solid, non-tacky state thus bond­ ing the conductor or the subatrate.The conductor is scribed between terminal points in this fashion. After the conductor pattern is fixed onto the substrate, a separate curing step may be performed by baking, ex­ posure to heat, UV radiation and the like. The adhesive coating preferably includes a curing agent which is non-­ reactive under conditions that activiate the adhesive during the scribing operation, but which can be made re­ active to provide a permanent thermoset bond at higher temperatures or by applying UV radiation. EXAMPLE 1 An elongated preformed wire conductor, e.g., a copper wire of 0.1 mm diameter, plated with approximately 0.5 µm of silver is covered with a layer of polyurethane in­ sulation, 38 µm thick. The conductor is further provided with an adhesive coating having the following dry weight composition: high molecular weight polyurethane acrylate 100 g epoxy acrylate 15 g Polyisocyanurate of toluene di­ isocyanate 9.8 g UV curing agent 3.5 g 4-methoxyphenol 0.5 g The corresponding net weight composition, ready for coat­ ing, is as follows: high molecular weight polyurethane acrylate (32% solution) 333.3 g epoxy acrylate 15.0 g polyisocyanurate (50% solution) 19.6 g UV curing agent 3.5 g 4-methoxyphenol 0.5 g and toluene in an amount of 7 weight percent of the total. The adhesive coating composition is applied to the in­ sulated conductor by repeatedly passing the conductor through the wet adhesive coating composition and series of diamond dies of increasing diameter. The wire conductor is passed through the wet adhesive coating com­ position, then through a diamond die, then an oven to remove residual solvents from the applied adhesive coating. This process is repeated until the conductor diameter is 266.7 ± 5.1 µm. The wire conductor is then spooled for storage. After the wire conductor is scribed in a pre­ determined pattern on the surface of a substrate, the adhesive coating can be cured by exposure to an UV light source of at least 15 joules/cm². EXAMPLE 2 A wire conductor is coated in accordance with the method described in Example 1 with an adhesive coating having the following dry weight composition: polyester having a molecular weight of about 25.000 100 g blocked isocyanate 30 g fumed silica 7.5 g zirconium silicate 5.0 g orange pigment 1.5 g methylethyl ketone (MEK) solvent 20 g The corresponding wet weight composition is as follows: polyester (molecular weight of about 20.000) 192.3 g blocked isocyanate 40.0 g fumed silica 7.5 g zirconium silicate 5.0 g orange pigment 1.5 g methylethyl ketone 20.0 The adhesive-coated wire conductor is fed through a wire scribing head. The substrate on which the wire conductor is to be scribed is a standard printed circuit board having on its surface a copper conductor pattern formed by etching and a solder mask. As the conductor is fed through the scribing head, a stream of hot air having a temperature of about 120° to 150°C is aimed at the con­ ductor in order to activate the adhesive coating, which remains melted and, therefore, activated for approximate­ ly 0.5 seconds. The scribing speed is 13 mm per second. The hot air stream is, therefore, aimed at a point on the conductor approximately 1.5 mm above the surface, allowing the adhesive coating to melt continuously as the conductor is continuously fed through the scribing head and through a roller. The roller serves to impress the conductor onto the surface. The adhesive coating is still fluid when the conductor contacts the surface and resoli­ difies and becomes non-tacky within about 1 second, thus bonding the conductor and maintaining its positional stability. After the conductor has been scribed in the predetermined pattern, the adhesive coating is fully cured by baking in an oven at a temperature of 150°C. EXAMPLE 3 A wire conductor coated with an adhesive coating as described in Example 1 is scribed onto a printed circuit board in accordance with the method of Example 2, employ­ ing a pulsed laser as the energy source. A Laakman Eelctro-Optics, Inc. model RF 165 sealed CO₂ laser is used havig a radio frequency-excited waveguide, a power output of 20 watts CW (continuous wave), a Gaussian (TEM₀₀) beam shape and a maximum modulation frequency of 10 KHz. The laser energy is discharged at the wire conductor in the form of a pulsed beam. The pulse width of the beam is 200 µsec. and the pulse amplitude 200 watts. The spot is approximately circular and has a diameter of 1 mm. The beam is pulsed when the conductor has been scribed 0.2mm. The scribing speed is 5 m/min. The spot size and pulse frequency are adjusted so that each section of conductor receives about five overlapping laser pulses. The acti­ vated adhesive coating is contacted with the surface of the substrate and,losing energy, becomes non-tacky thus forming a bond with the surface within about 200 milli­ seconds. When all conductors of the predetermined pattern have been scribed, the adhesive coating is fully cured by exposure to UV light. EXAMPLE 4 A wire conductor coated with an adhesive is scribed to the surface of a substrate according to the procedure of Example 3. The adhesive coating is a mixture of 100 g dry weight, or 166.67 g as wet weight, polyether having carboxyl groups adducted onto the polyether backbone and crosslinked with toluene di-isocyanate, 166.7 g propy­ lene glycolmonomethylethyl acetate (PMA) and 25 g MEK. The wire conductor is coated in accordance with the pro­ cedure described in Example 1. EXAMPLE 5 A wire conductor is coated with the adhesive coating composition of Example 1 in accordance with the method described in the same Example. The adhesive coating is activated in accordance with the method described in Example 3. However, the conductor is scribed to the sur­ face of a previously fabricated discrete wire inter­ connection board over existing wires and between two terminal points in order to modify the interconnections on the board. EXAMPLE 6 A heat activatable adhesive was prepared with a blend of a B-staged polymer of a high molecular weight, allylic urethane, and a B-staged epoxy acrylate. The B-stage mechanism is the reaction of polyisocyarunate with the hydroxyl groups of both polymers. An UV initiated, free radical curing agent was incorporated in the blend to enable complete curing to a C-stage composition through the allylic and acrylic groups on the polymers. Copper wire of 0.1 mm in diameter covered with a layer of polyurethane insulation to a diameter of 0.14 mm was coated with a uniform layer of said adhesive composition. The outside diameter of the wire with the dry, heat acti­ vatableadhesive coating was 0.26 mm to 0.27 mm. The wire was coated and stored in areas where UV light was ex­ cluded and wound on a spool for storage until use. The wire coated with the heat activatable adhesive was scribed to printed wiring boards to modify the conductive pattern. During the scribing process, the wire was automatically placed on and bonded to the surface of the printed wiring board, the surface of which comprised solder mask areas, epoxy substrate areas and exposed metal areas. As the wire was fed towards the surface, and just prior to reaching it, the portion of the heat activatable ad­ hesive coating which would contact the surface was ex­ posed to a pulsed CO₂ laser beam. The pulse amplitude of the beam was 20 watts. The spot was approximately circu­ lar and had a diameter of 1 mm. The beam was pulsed when the wire had been scribed about 0.2 mm. The scribing speed was about 5 m/min. Spot size and pulse frequency were ad­ justed so that each section of heat activatable adhesive coated wire received about five overlapping laser pulses. The activated adhesive coating contacted the surface of the printed wiring board and the adhesive coating became non-tacky and formed a solid bond with the surface in about 200 milliseconds. The wire was thus securely bonded by the adhesive to the solder mask, epoxy substrate and exposed metal areas as well as to other scribed wires. After all the wires to modify the conductive pattern had been scribed, the board was exposed to 19.5 joules/cm² of UV light to cure the heat activated adhesive to the C-stage. Printed wiring boards with the wire scribed conduct­ ors were soldered at 265°C for 10 seconds. There was no failure of the adhesive bond between the wires and the substrate, and no visible evidence of attack on or damage to the adhesive coating. The boards were placed in dichloromethane for 10 seconds, dried in air at am­ bient temperature for 10 minutes and examined with the aid of a microscope. They showed no failure of the ad­ hesive bond between the wires and the substrate, and no pitting, crazing or other indication of attack on the adhesive coating. EXAMPLE 7 A heat activatable adhesive coating composition was pre­ pared based on a diacrylate ester of a diepoxy bisphenol A resin combined with a solid epoxy resin. The solid epoxy resin had an epoxy equivalent weight of 1600. In order to make a non-blocking adhesive formulation, the molecular weight of the epoxy resin was increased from 3200 to over 35000 by reacting it with a polyamide curing agent. Similarly, the molecular weight of the diacrylate ester was modified with 3 g of a polyisocyanurate per 100 g of epoxy acrylate ester to partially cure or B-stage the system and increase the molecular weight from 830 to 5500. The epoxy acrylate ester and the polyisocyanurate were refluxed at 80°C for 30 min. to B-stage the epoxy acrylate ester before adding the other components to the adhesive. A free radical initiator was also added to the heat acti­ vatable adhesive formulation to cure the adhesive to the C-stage after it has been used to bond scribed wires to a board. For thermal curing, dicumyl peroxide was added. Dicumyl peroxide generated free radicals at temperatures in excess of 150°C. For UV light curing, 2,2-dimethoxy-­ 2-phenylacetophenone was used as a free radical generator. The adhesive was refluxed at 80°C for 30 min. to B-stage the adhesive before coating the wire. The resulting composition was dissolved in methyl ethyl ketone to make a solution with 20% solids. The solution was applied to an insulated wire with an outside dia­ meter of 0.14 mm, and the adhesive coating was dried with forced air at 65°C.The overall diameter of the wire was increased to 0.23 mm (64%). The heat activatable ad­ hesive coated wire was scribed to an FR-4 substrate with hot air jet activation, as in Example 2. The adhesive bond of wire to the substrate was much lower than in Example 2. Wires coated with the same adhesive solution to obtain an overall diameter of 0.26 mm (85% increase) and scribed onto a board resulted in good adhesion, showing that heavier coating of adhesive on the wire is prefer­ able. When the conductor is an insulated metallic wire, electri­ cal and mechanical terminations are made at each terminal point on the substrate. The metal core of the insulated wire is exposed in order to make the termination. The adhesive coating and insulation layers are stripped to expose the conductive portion. Selected portions of an insulated wire may be stripped of adhesive coating or insulation, or both, by mechanical stripping, using two opposing knife edges brought close enough together to penetrate the conductor coatings with­ out damaging the conductive portion of the conductor. The knives then slide along the conductor to scrape off ex­ cess material. Another method used for mechanical stripping is an abrasive jet: abrasive particles are sprayed at high velocity in a concentrated stream on the conductor to remove the insulation layer and adhesive coating. Insulation layer and adhesive coating may be chemically stripped using a solvent. Other stripping methods depending on the composition of the wire insulation include low temperature and high temperature thermal stripping. Preferably, adhesive coating-and insulation stripping is accomplished with a laser beam. The energy of the im­ pinging laser beam vaporizes the coatings. There are at least two methods of removing the adhesive coating and insulation layer using laser energy. According to a first method, a laser beam with a spot size large in comparison to the diameter of the conductor is aimed and pulsed at least once at the section of the adhesive coating to be removed. Although the large spot size results in a relatively large area for strip­ ping, the laser energy may be so diffuse along the outer edges of the spot that it may not be sufficient to complete­ ly vaporize the adhesive coating and insulation layer. In­ creasing duration of the laser beam radiation for better vaporization may cause heat conduction along the con­ ductor, causing the adhesive coating to bubble and boil beyond the irradiated area. This method may also entail damage to the environment surrounding the conductor. According to a second, preferred laser method, a small spot is scanned along a predetermined length of con­ ductor by moving the laser beam along the stationary conductor or by moving the conductor, keeping the beam stationary, or moving both. This results in a higher energy concentration for the same laser output power. This method removes the coatings more efficiently leaving a cleaner metal surface. Preferably, the diameter of the spot is approximately five times the diameter of the con­ ductor if a CO₂ laser beam is used. The frequency of the scanning can be adjusted according to the different ma­ terials to be removed. A vacuum may be used to remove debris and a gas jet to blow off the residue left on the conductor. A reflector placed on the side of the conductor opposite the side from which the energy is discharged can be used to strip the far side of the conductor. Alternatively, multiple laser beams can be aimed at opposed sides of the conductor, or the conductor can be rotated to re­ move adhesive coating and insulation layer all around the conductor. Energy can be conducted through the con­ ductor to remove the adhesive coating and/or insulation layer. An Excimer™ laser emitting ultraviolet radiation is also suitable in the stripping process. A laser beam from an Excimer laser source vaporizes the organic ma­ terials coating the wire conductor by "photo-decomposi­ tion" and without affecting the conductor. After the conductor end points are stripped, they can be electrically and mechanically connected to terminal points. Termination of the conductor can be accomplished according to any method known to those skilled in the art. Terminal points can be surface pads, holes or apertures with or without metallized walls, conductive cavities, component leads, conductive fingers, etc. Surface pad terminations may be used to interconnect surface attached components, or to modify circuit boards having circuit holes in which the holes are already filled with solder. Termination of a scribed conductor to a surface pad can be accomplished by solder reflow methods, heating, laser soldering, welding or the like. The stripped end of a scribed wire conductor can be in­ serted into a circuit hole and electrically and mechani­ cally terminated by soldering, or the like. Termination may also be accomplished by mechanically drilling through wires to form holes in the substrate and then metallizing, or plating, the drilled holes. Leaded components may be inserted into circuit holes on the substrate after the wire conductors have been in­ serted in the holes and prior to termination. The adhesive coated conductor may be stripped before placement on a surface or just prior to termination. Pre­ ferably, the wire is stripped and cut by an appropriate apparatus just prior to termination. Thus, a conductor may be scribed and stripped along the length sufficient to provide metallized wire for two end points: one to end a scribed length of conductor, and another to start a new length of conductor. The conductor is cut at a middle point along the stripped section for this purpose. Fig. 1A shows an interconnection circuit board 110a having etched power and ground planes 111a and 113a on which conductors 116a have been placed. A dielectric layer with surface 115a has been applied over the con­ ductors. Circuit holes 120a have been drilled and the hole walls metallized in order to provide electrical access between the conductors 116a and the conductors on the opposite surface as well as the outside world. If it is desired to modify the circuit board depicted in Fig. 1A, such modification can be accomplished according to the process of this invention as described below. Figure 1B shows the interconnection circuit board 110b of Fig. 1A as modified in accordance with the process of this invention. Conductor 130b having an adhesive coating 140b is applied, for example, to surface 115b along the predetermined route from circuit hole 126b to circuit hole 128b. The adhesive coating 140b is removed by stripping, e.g., with a laser, from conductor 130b prior to the conductor's insertion into circuit hole 126b at segment 132b. Segment 132b is inserted into cir­ cuit hole 126b and the adhesive coating 140b activated, e.g., with a repeated laser beam pulse. The conductor 130b is then scribed onto surface 115b. The now tacky, activated adhesive coating provides continuous adhesion as it is scribed and contacts the surface 115b between the conductor 130b and the surface 115b. Conductor 130b is scribed in a predetermined pattern until it reaches circuit hole 128b, which is plated through. Here, the ad­ hesive coating 140b is again stripped from conductor 130b, leaving the conductor exposed at segment 134b, which is inserted into plated through hole 128b. The connection between circuit holes 122b and 124b has been severed by drilling a hole 150b into the board. An additional conductor path is similarly provided by applying adhesive coated conductor 135b in a defined, predetermined and repeatable location reaching from terminal point 122b to terminal point 129b. Both termi­ nal points are metallized circuit holes. Connection to hole walls is made by known technologies and preferably by soldering, welding or the like. Fig. 1C shows modified interconnection circuit board 110c after modification conductor 130c has been placed as shown in Fig. 1B. Once the modifications are made, com­ ponents 160c may be placed in the circuit holes of the interconnection circuit board in the appropriate locations. A component lead 165c can occupy the same circuit hole barrel as conductor 130c. Once the conductors and compo­ nent are in place, electrical and mechanical termination can be made by soldering, for example. Fig. 1D shows the interconnection circuit board 110d after electrical and mechanical interconnection has been made by soldering. The component leads 165d and conduct­ ors 130d have been soldered in holes 120d, leaving a fillet of solder 170d providing electrical and mechanical interconnection. Fig. 1E shows a multiple layer interconnection circuit board 180e having an etched power layer 182e, an etched ground layer 184e and en etched signal layer 186e. Modi­ fication conductors 130e have been scribed to the surface of board 180e to provide a new signal interconnection pattern. Fig. 2A shows an interconnection circuit board 200a having surface pads 240a. A short conductor 231a is located on surface 215a and interconnects surface pads 241a and 242a. Fig. 2B shows the interconnection circuit board 200b of Fig. 2A as modified in accordance with the process of this invention to add conductors 232b and 234b. A conductor, e.g., 232b, is first stripped of thr adhesive coating and insulation layer at one end and attached to a surface pad 240b by soldering, welding or the like. This attach­ ment provides electrical and mechanical interconnection at the surface pad terminal point. Conductor 232b is then scribed and bonded by the activated adhesive coating 233b along its path. The other end of conductor 232b is then stripped and attached to surface pad 243b. Conduct­ or 234b is similarly scribed, bonded, and stripped to interconnect the appropriate surface pads. Fig. 2C shows the completed interconnection board of Figures 2A and 2B with surface component 210c attached. Fig. 3A shows modification of an interconnection circuit board on which is located a surface-attached component 312a in a dual-in-line package 310a. Duplicate parallel re­ pair holes 320a were provided in the board design to allow access to terminal points after component insertion. This type of interconnection circuit board can be modified even after components have been attached or iserted.The method for modifying is shown in Figures 1A - 1D. Conductor 330a having adhesive coating 340a is stripped at one end and the stripped portion inserted into cir­ cuit hole 335a. Conductor 330a is then routed and affixed to surface 315a. When conductor 330a reaches terminal point 336a, it is again stripped and inserted into the circuit hole barrel 338a. Electrical termination can be made as the conductors are inserted into the plated through holes at the terminal points, or at a later stage, e.g., by soldering. Fig. 3B shows another modification technique for an inter­¸ connection circuit board on which are located surface-­ attached components and lead-inserted components. Dupli­ cate parallel repair surface pads 335b are provided in the board design to allow access to terminal points after com­ ponent insertion and attachment. This type of inter­ connection circuit board can be modified using the tech­ nique previously described and shown in Figures 2A - 2C. Conductor 330b having adhesive coating 340b and an in­ sulation layer is stripped at one end. The stripped portion is affixed to surface pad 335b. Conductor 330b is then routed and affixed to surface 315b by activated adhesive coating 340b. When conductor 330b reaches termi­ nal point 336b, it is stripped at the other end and affixed to surface pad 338b at that terminal point. Electrical termination can be made as the conductors are affixed to the suface pads at the terminal points by soldering or the like. Fig. 4A shows a standardized prefabricated panel of pads and holes suitable for various component sizes and pin densities. The components which are to be used are matched to the existing pads and holes on the panel. The lo­ cations and sizes of the circuit board holes are standard­ ized to accommodate a variety of different circuit con­ figurations utilizing the same basic panel. Basic panel 410a contains power and ground planes 420a and 430a. Cir­ cuit holes 450a are drilled and metallized prior to scribing conductors. Surrounding the holes are conductive pads 470a for eventual termination of conductors. Fig. 4B shows basic standardized panel 410b of Fig. 4A with adhesive coated conductors 482b and 484b providing an electrical interconnect. Adhesive coating 486b bonds conductors 482b and 484b to surface 400b. Fig. 4B further illustrates how the adhesive coating 486b provides ad­ equate bond at crossover 480b of conductors. Adhesive coating 486b appears between conductors 482b and 484b at crossover 480b. Conductor 482b having an adhesive coating 486b is stripped at one end and the stripped portion is affixed to surface pad 472b. Conductor 482b is then routed and affixed to surface 400b. When conductor 482b reaches terminal point 422b, it is again stripped and affixed to surface pad 474b by soldering. Electrical connection can be made as des­ cribed hereinbefore. Fig. 4C shows the completed circuit board 410c with lead inserted component 465c mounted thereon. The leads 460c of the component 465c are subsequently mechanically and electrically connected to the circuit board 410c, e.g., by soldering. Figures 5A and 5C illustrate the construction of a new circuit board using the process of this invention. Fig. 5A shows the starting circuit board panel with etched power and ground planes 520a and 530a. Circuit holes 540a and 542a are drilled and then metallized, and surface pads 544a and 545a formed around holes 540a and 542a. Surface pads 548a and 549a are placed on the surface 500a for surface attachment of components. Fig. 5B shows the prefabricated panel 510b as it appears after adhesive coated conductors 582b, 584b and 592b have been scribed on its surface. The adhesive coating is activated as the conductors are being scribed and serves to bond conductors 582b, 584b amd 592b to sur­ face 500b. Adhesive coating 586b also provides adequate bonding at the crossover 580b of conductors 582b and 584b. Sequentially, conductor 582b can be first stripped at one end and the stripped portion attached to surface pad 572 b by soldering. Conductor 582b is then scribed to surface 500b and when it reaches terminal point 522b, its endpoint is stripped and soldered to surface pad 574b at that terminal point. Conductor 592b is stripped and soldered to surface pad 544b, then routed and affixed to surface 500b and when it reaches terminal point 524b, the other end is stripped and soldered to surface pad 546b. Electrical connection is made when the conductors are affixed to the surface pads at the terminal points by soldering or the like. Conductor 584 is similarly stripped, scribed and connected between terminal points. The completed circuit board with components mounted thereon appears as shown in Fig. 5C. Fig. 6 shows another embodiment of the invention wherein adhesive coated conductors are applied to both sides of the circuit board and thereafter encapsulated. The initial circuit board 610 is constructed including interior ground and power planes 612 and 614 as well as printed surface conductors 618 and 620 which can provide terminal pads and, if desired, a conductor interconnect­ ion pattern. Adhesive coated conductors 622 are then added to the upper surface of the board with stripped ends connected to terminal pads like terminal pad 620. Similarly, adhesive coated conductors 624 are added to the lower surface with stripped ends connected to termi­ nal pads like terminal pad 618. Thereafter, the surface conductors are encapsulated by encapsulating layers 626 and 628. The thus encapsulated board 610 is then drilled and the drilled holes metallized (616) to provide terminal holes 630 connected to the interior conductors and layers. Components 632 can thereafter be mounted with leads 634 inserted into the terminal holes and connected by solder (not shown).

Claims: 1. A process for scribing a conductor in a pre­ determined pattern onto a surface of a substrate com­ prising at least one conductor, a substrate and an ad­ hesive for bonding said conductor to said surface in a fixed position, said adhesive being non-tacky prior to activation, activatable by application of energy there­ to, and reverting to a solid, non-tacky condition after activation, scribing the conductor on said surface of said substrate following a predetermined path, characterized in that said energy for activating said adhesive is applied by means of a pulsed radiation or heated fluid beam. 2. The process of claim 1 wherein the conductor(s) is (are) scribed onto the surface between points spaced apart on the substrate, each point determining a terminal point; and wherein the adhesive is not activated at said terminal points. 3. The process of claims 1 or 2 wherein the con­ ductor(s) comprise(s) an insulated electrically conductor wire. 4. The process of claims 1 to 3 wherein the adhesive is applied during the scribing operation. 5. The process of claims 1 to 3 wherein the adhesive is applied to the substrate surface or as a coating on the conductor(s) prior to the scribing operation. 6. The process of claims 1 to 5 wherein said adhesive coating rapidly reverts to a solid, non-tacky condition after activation, and can be thermoset and C-staged in a later step by applying heat or light or both. 7. The process of claim 6 wherein the adhesive com­ prises a polymer selected from high molecular weight phenoxy resins, high molecular weight polyurethane, high molecular weight epoxy resins and polyolefins and, upon activation, is capable of adhering to a plurality of sur­ faces with different finishes or properties including the surface of a printed circuit board. 8. The process of claims 1 to 7 wherein said adhesive coating contains regions of micro-encapsulated adhesive material capable of being released by pressure, said pro­ cess comprising the further step of applying sufficient pressure to said adhesive coating to release the adhesive material at or close to the point of contact with the sub­ strate such that the adhesive material forms a bond bet­ ween the conductor and the substrate. 9. The process of claims 1 to 8 wherein the radiation beam is a pulsed laser beam, and the pulse repetition rate is a function of the scribing speed, or of the length of the conductor scribed, or a combination of both, and wherein said beam is activating a portion of the adhesive during or shortly prior to scribing the respective conductor along the activated portion of the adhesive. 10. The process of claims 2 to 9 wherein the area along the conductor scribing path irradiated by each succession pulse overlaps the area irradiated by the preceeding path. 11. The process of claim 10 wherein the areas overlap form 10 to 90% of the beam diameter. 12. The process of claims 2 to 11 wherein the pulse width of said laser pulses is from 200 to 2000 microseconds, the length of the area of adhesive coating irradiated by the pulse is from 0.5 to 2.5 mm, and the laser beam is pulsed each time a length of conductor from 0.1 to 0.25 mm is scribed. 13. The process of claims 5 to 12 wherein the sub­ strate is an interconnection circuit and wherein said circuit board is modified by scribing at least one con­ ductor onto the surface thereof from a first terminal point along a predetermined path to a second terminal point thereby forming a precise and reproducible circuit modification. 14. The process of claims 3 to 13 wherein the end portion of the conductor is stripped of the insulation layer and, if present, the adhesive coating to expose its conductive core prior to or subsequent to scribing said conductor. 15. The process of claim 14 characterized in that it comprises the steps of stripping the adhesive coating and insulation from the conductor at one end; scribing the conductor onto the surface of the substrate from said end of the conductor at a first terminal point along a predetermined path to a second terminal point; cutting the conductor in the vicinity of said second terminal point; and stripping the adhesive coating and insulation in the vicinity of the cut end. 16. The process of claims 14 or 15 wherein the strip­ ping means is selected from chemical, mechanical, and/or radiant energy means. 17. The process of claim 16 wherein said radiant energy means is a CO₂ laser beam having a spot size sufficient for evaporating the adhesive coating along with the insulation, and which is scanned repeatedly along a predetermined length of the conductor. 18. The process of claim 16 wherein said radiant energy means is an Excimer-laser beam which photo-de­ composes the insulation layer and the adhesive coating. 19. The process of claims 1 to 18 wherein the con­ ductor is cut after reaching the second terminal point by directing a laser beam of sufficient energy and proper wavelength thereto. 20. The process of claims 16 to 19 wherein the re­ spective laser beam is a second laser beam. 21. The process of claims 1 to 20 wherein the sub­ strate includes solder terminal points, and at least one end of the conductor is stripped and soldered to said terminal point by directing a second laser beam thereto. 22. The process of claims 1 to 21 wherein said termi­ nal points are plated through holes provided in the sub­ strate, and further including the steps of inserting the exposed core portion of the conductor into the said plated through hole and filling it with solder. 23. The process of claim 22 further including the step of inserting a component lead or other electrically con­ ductive material into the hole prior to soldering. 24. The process of claims 1 to 20 wherein the termi­ nal points are surface pads; and further including the steps of soldering the exposed portion of the conductor to a first surface pad; scribing said conductor along a predetermined path to the vicinity of a second surface pad; removing the insulation layer and adhesive coating from a length of the conductor; and cutting the conductor and soldering it to the second surface pad. 25. The process of claims 5 to 24 employing adhesive coated wire conductor, wherein, after scribing, the ad­ hesive is encapsulating the conductor, the cross-section of the encapsulation having a bell-shaped appearance, said adhesive being bonded to the surface of the substrate at points of contact between the surface and the conductor. 26. An article of manufacture comprising an inter­ connection board produced by employing one or more of the process steps of claims 1 to 25.

Inventors: CROWELL, JONATHAN CLARK, FRIEDRICH, MARJU LAUBE, KEOGH, RAYMOND J., MORINO, RONALD, SCHOENBERG, ANDREW JED, SWIGGETT, BRIAN EDWARD, SZENCZY, GEORGE
Applicants: KOLLMORGEN CORPORATION
Application year: 1986
Main classification: H05K7
IPC codes: H05K3, H05K7