Mixtures of polyamideimides, containing 3,4'-diaminodiphenylether as diamine component, and of a plasticizer.

Abstract: A polyimide capable of forming a self-support­ ing film, comprising a unit represented by the following formula (I) and a unit represented by the following formula (II) as main units forming the molecular chains of the poly­ imide; and an intimate mixture comprising (A) a poly­ amideimide comprising a unit of the following formula (II) and a unit of the following formula (IV) as main units forming the molecular chains of the poly­ amideimide, and (B) a plasticizing material for the polyamideimide (A).

Description: This invention relates to shapeable intimate mixtures of (A) polyamideimides obtained by using 3,4'-diaminodiphenylether as a diamine component and (B) certain plasticizers. Polyimides gained commercial acceptance as typical thermally stable resins in the early 1960s and have been used in various applications. A typical polyimide is poly-4,4'-oxydiphenylenepyromellitimide of the following formula. This polyimide has excellent thermal stability, heat resistance and flexibility, and is commercially available from E. I. du Pont de Nemours & Co. as a film under a registered trademark Kapton®. As is well known, this polyimide having the structure shown above has the difficulty that because it is insoluble and infusible, it can be fabricated only by sintering its powder at high temperatures and pressures as is the case with ceramics. This difficulty is avoided by utilizing the fact that a polyadduct, i.e. polyamic acid, obtained by reacting the starting pyromellitic dianhydride with 4,4'-hyroxydianiline at room temperature or below is soluble in polar solvents such as N-methylpyrrolidone. The polyamic acid is dry- or wet-shaped, and dehydrocyclized by the action of a cyclizing agent and/or heat-treatment during or after shaping to convert it into the polyimide having the above formula. This method generally requires heating for a long period of time during or after shaping, and water formed as a by-product by the cyclization reaction should be released out of the reaction system. This method can be applied to the formation of articles having a high specific surface area such as films or fibers, but is difficult to apply to the production of adhesives, matrix resins for composite materials, heat melt-shaping resins, etc. which are used in a form in which the by-product water can be taken out easily out of the system. U.S.-A-3,890,274 discloses phthalonitrile-terminated aromatic polyimides having an orthodicyanoaromatic radical at both ends of the polymer chain. The patent describes that when the polyimides are heated to about 180 to 300°C, or reacted with polyvalent metals, high molecular, infusible, insoluble polymers are produced. GB-A-1,457,191 discloses that a polyimide, or its obvious poly(amic acid) equivalent, including the repeating unit wherein X is or a mixture of and -CO-, n is an integer from 2 to 8, and R represents divalent aromatic groups having the formula wherein Y is a divalent linking atom or group, together with a proportion of arsenic thioarsenate, provides an adhesive composition. U.S.-A-3,996,196, a divisional of U.S.-A-3,890,274, discloses a polyimidemetallo-phthalocyanine in such a form that the aforesaid phthalonitrile-terminated aromatic polyimides are bonded by polyvalent metals. U.S.-A-4,197,397 discloses polyimides represented by the following formula wherein Ar' is a tetravalent aromatic organic radical, Ar is an n-valent aromatic organic radical, and n is a positive integer of at least 2, and the corresponding polyimide-polyamic acid. U.S.-A-4,220,750 discloses enyne polyimides lightly crosslinkable on thermal treatment including the unit wherein R is S, SO₂, CO or a divalent aromatic aliphatic or perfluoroaliphatic radical. U.S.-A-4,320,217 discloses polyimides having terminal acetylenic amide groups. The patent describes that these polyimides give crosslinked, insoluble, infusible polymers. U.S.-A-4,321,198 discloses polyimides having acetylenic amide groups with terminal =C≡CH groups as hemi-amic acid groups. JP-A-3603/1983 discloses a process for producing a dry separation membrane of polyimide, which comprises wetting a wet coagulated membrane prepared from a dope of an aromatic polyamic acid or an aromatic polyimide with an organic solvent having a solubility parameter of 5 to 9.4, and then drying the membrane. JP-A-8513/1983 and the corresponding U.S. -A-4,528,004 disclose a process for producing a composite separation membrane of polyimide, which comprises coating a dilute solution composed of a halogenated hydrocarbon, a phenol and a soluble polyimide on a microporous membrane of an aromatic polyimide, and then drying the coated membrane. JP-A-11003/1983 and the corresponding U.S. -A-4,474,858 disclose a polyimide gas separation membrane effective for the separation of hydrogen gas and carbon monoxide from each other and the separation of nitrogen gas and oxygen gas from each other. JP-A-11006/1983 and the corresponding U.S. -A-4,528,004 disclose a process for producing a gas separation membrane of polyimide having the properties described in the above-cited JP-A-11003/1983. JP-A-95029/1986 and the corresponding EP-A-0179604 disclose "the polyimide powder for adhesion and/or coat forming, which comprises the polyimide powder being obtained by chemically imidizing a polyamic-acid having recurring units of the formula (I): where R₁ is selected from the group consisting of R₂ is selected from the group consisting of Z is selected from the group consisting of R₃ is selected from the group consisting of alkyl and aryl, and Y is selected from the group consisting of hydrogen, alkyl and aryl, with an imidizing agent, and having recurring units of the formula (II): wherein R₁ and R₂ are the same as R₁ and R₂ in the formula (I)." ( sic .) However, these documents do not at all describe polyimides in which R₁ is and Z is -O-, and R₂ is and Z is -CO-. JP-A-95030/1986 discloses a process for producing a film of a polyimide composed substantially of recurring units represented by the same formula as formula (II) in the above-cited JP-A-95029/1986, which comprises casting a solution prepared by mixing a dehydroimidization agent to an organic solvent solution of a polyamic acid having recurring units represented by the same formula as formula (I) disclosed in JP-A-95029/1986 on a support, chemically imidizing the polymer, and molding the resulting product. JP-A-95031/1986 discloses a process for producing a film which is the same as the process described in JP-A-95030/1986 except that an organic solvent solution of the polyamic acid is cast on a support and then reacted with a dehydroimidizing agent. Neither JP-A-95030/1986 nor JP-A-95031/1986 discloses a polyimide in which R₁ is and Z is -O-, and R₂ is and Z is -CO-. As the above-cited prior art references show, there have been two large trends in improving the processability of polyimides, namely (a) the production of polyimides which can be molded and thereafter heat-cured by attaching to the terminals of oligoimide, groups which cure by addition reaction to form bonds having good thermal stability, and (b) the production of thermoplastic polyimides having modified main-chain structures. These trends will be described briefly with reference to specific examples. As examples of the former, PBR series using Nadic acid anhydride terminals (developed by NASA, U. S. A.) and Termid® using phenylacetylene groups have gained commercial acceptance. The resins of the former, however, have the defect that after the resins have reached a B-stage, long periods of time are required to form cured resins by the reaction of the terminal groups, and the resulting cured resins do not have entirely good flexibility. In contrast, the latter polyimides, when heated to temperatures before the fusing temperature, have reduced strength and are likely to undergo fracture. However, they have the advantage that they can be molded to cured resin articles by melt-fusing within short periods of time, and they are essentially high-molecular-weight linear polymers and have excellent flexibility. Hence, they can be used preferably in applications requiring flexibility, for example as adhesives. NR150 of E. I. du Pont de Nemours & Co., polyimide 2080 of Up-John Co. and LARC-TPI developed by NASA may be cited as resins falling within the polyamides (b) above. It is said that NR150 has a structure represented by the following formula Since it uses a special fluorine-containing tetracarboxylic dianhydride, its price becomes very high. Polyimide 2080 is considered to be obtained by the reaction of benzophenonetetracarboxylic acid dianhydride, 4,4'-diphenylmethane diisocyanate and tolylene diisocyanate. It is said that this polyimide is inexpensive, but since it has methylene and methyl groups in the main and side chains, it is unstable to oxidation and has inferior thermal stability. It was reported that LARC-TPI has a structure of the following formula: It has excellent heat melt-adhesion. It has been pointed out however that since it starts from 3,3'-diaminobenzophenone, a special diamine, as a starting material and is composed of considerably rigid benzophenone bonds alone, it has insufficient flexibilty in certain applications. Aromatic polyamideimides containing an aromatic tricarboxylic acid or an aromatic tricarboxylic acid anhydride as an acid component, which differ from the aromatic polyimides described above, have also been known heretofore. JP-A-180352/1983 discloses a process for producing an aromatic polyamideimide from the aforesaid acid component and an aromatic diamine in the presence of a dehydration catalyst using a solvent containing sulfolane. Example 6 of this patent document describes that 20g (0.1 mole) of 3,4'-diaminodiphenylether and 19.2g (0.1 mole) of trimellitic anhydride were polycondensed in a large amount of solvent (160 ml of sulfolane) to give pale yellow polyamideimide having a reduced viscosity of 1.056 dl/g in a yield of 97.6%. JP-A-160140/1984 and 42424/1985 and corresponding EP-A-2 119,719 disclose a radiation-sensitive composition characterized by comprising: (1) a polymer [I] containing repeating units (A) represented by the following formula: wherein R¹ is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R² is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R³ is a hydrogen atom or an ammonium ion, n is an integer of 1 or 2, and COOR³ is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound [II] having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic secondary or tertiary amine compound [III] which is chemically inactive with actinic radiation. However, this document fails to give any specific description of a polyamide-imide between trimellitic anhydride and 3,4'-diaminodiphenylether as the polymer [I]. According to this invention, new polyamide imides having 3,4'-diaminodiphenyl ether as a diamine component, have now been devised. Accordingly, the present invention provides a shapeable intimate mixture comprising: (A) a polyamideimide comprising a unit of formula (II) and a unit of formula (IV) wherein units of formulae (IV) and (II) provide at least 50% of the entire units forming the molecular chains of the polyamideimide and (B) a plasticizing material for the polyamideimide (A) having a boiling point of least 300°C, a molecular weight of not more than 1,000, which is compatible, but substantially non-reactive, with the polyamideimide and which is selected from an imide compound formula (1)-a wherein A¹ is a divalent aromatic group which may be substituted, R¹ is an n-valent aromatic radical or linear or cyclic aliphatic radical which may be substituted, and n is 1 or 2, provided that the imide ring in the above formula is 5- or 6-membered, an imide compound of formula (1)-b wherein A² is a tetravalent aromatic radical which may be substituted, and R² is a monovalent linear or cyclic aliphatic radical which may be substituted, provided that the imide ring in the above formula is 5- to 6-membered, a trialkyl isocyanurate of formula (I)-c wherein R³ is a monovalent alkyl group, and a diphenyl compound of formula (1)-d Ar-A³-Ar (1)-d wherein A³ is -O-, -SO₂-, -CO- or an alkylene group and Ar is an aromatic radical; the proportion of the polyamideimide (A) being 40 to 90% by weight based on the total amount of the polyamideimide (A) and plasticizing material (B). In the polyamideimide (a) constituting the intimate mixture of this invention, the total proportion of the unit of formula (IV) and the unit of formula (II) is at least 50% based on the entire units forming the polyamideimide molecular chains. Preferably, the proportion of the unit of formula (IV) and the unit of formula (II) directly bonded to each other is at least 50% based on the total proportion of the unit of formula (IV) and the unit of formula (II). Above all, it is preferred that the total proportion of the unit of formula (IV) and the unit of formula (II) directly bonded to each other be at least 50% based on the entire units forming the polyamideimide molecular chains. The polyamideimide (a) may comprise the units of formulae (IV) and (II) as main units and other minor units. The minor other unit is at least one unit selected from the group consisting of a unit represented by the following formula (V) -HNCO-Ar¹-CONH-Ar²- (V) wherein Ar¹ and Ar² are identical or different and each represents a divalent aromatic group having 6 to 20 carbon atoms, a unit represented by the following formula (VI) -Ar³-CONH- (VI) whrein Ar³ is the same as defined for Ar¹, a unit represented by the following formula (VII) wherein Ar⁴ represents a tetravalent aromatic group having 6 to 20 carbon atoms, and Ar⁵ is the same as Ar¹, and a unit represented by the following formula (VIII) wherein Ar⁶ represents an aromatic group having 6 to 20 carbon atoms, and Ar⁷ is the same as defined for Ar¹, provided that Ar⁷ is not a 3,4'-diphenyl ether group. These minor units are contained in a proportion smaller than the total proportion of the unit of formula (IV) and the unit of formula (II). Examples of the aromatic groups having 6 to 20 carbon atoms represented by Ar¹ to Ar⁷ in formulae (V) to (VIII) are a benzene ring and 2 or 3 benzene rings bonded to each other directly or via carbon, oxygen, sulfur, etc. More specifically, groups of the following formulae are suitable. A polyamideimide having higher heat resistance can be formed, for example, by introducing the unit of formula (VII) in which Ar⁴ is Polyamideimides having higher alkali resistance or mechanical properties can be formed, for example, by introducing the unit of formula (V) in which Ar¹ is or the unit of formula (VI) in which Ar³ is The unit of formula (VIII) in which Ar⁶ is can also be introduced. Ar² in formula (V) and Ar⁴ in formula (VII) may be a 3,4'-diphenylether group or another aromatic group, but Ar⁷ in formula (VIII) is an aromatic group other than 3,4'-diphenyl ether group. Such other aromatic groups are derived from diamines such as m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylether, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, bis(m- or p-aminophenoxy)-1,3-benzene and bis(m- or p-aminophenoxy)-1,4-benzene. The above polyamideimide has an inherent viscosity [η inh ], measured at 30°C in N-methylpyrrolidone, of preferably at least 0.2, more preferably at least 0.3, especially preferably 0.4 to 1.5. A polyamideimide having an inherent viscosity of less than about 0.2 does not give a self-supporting film, but even such a low-molecular-weight polyamideimide gives a flexible film by forming a film from it and then treating the film under heat or otherwise to induce after-polymerization or after-curing. Polyamideimides which can be suitably used in this invention have a glass transition point of 150 to 300°C. The glass transition point is measured by the TMA penetration method. In general formula (1)-a for the plasticizer used in the present invention, examples of the divalent aromatic radical represented by A¹ are 1,2-phenylene, 1,2-, 2,3- or 1,3-naphthylene, and 5,6,7,8-tetrahydro-1,2- or 2,3-naphthylene groups. These groups may be substituted by substituents which are non-reactive with the polyamideimide. Examples of the substituents are lower alkyl groups such as methyl and ethyl, lower alkoxy groups such as methoxy and ethoxy, halogen atoms such as chlorine and bromine, a nitro group, a phenyl group, a phenoxy group and a cyclohexyl group which may be substituted by a methyl group. Examples of the n-valent (n=1 or 2) aromatic radical for R¹ include monovalent (n=1) aromatic radicals such as a phenyl group, a naphthyl group, a 5,6,7,8-tetrahydro-1-, 2- or 3-naphthyl group and the groups wherein Z is -O-, -SO₂ or -CH₂-, and divalent aromatic radicals such as 1,2-phenylene group, 1,2- 2,3- or 1,8-naphthylene groupu, a 5,6,7,8-tetrahydro-1,2-, or 2,3-naphthylene group and groups of the formula wherein Z is -O-, -SO₂- or -CH₂-. Examples of the n-valent (n=1 or 2) aliphatic radical include monovalent aliphatic radicals for example linear alkyl groups having 1 to 18 carbon atoms such as methyl, ethyl, butyl, hexyl, heptyl, octyl, nonyl, decyl, dodecyl, myristyl and stearyl and 5- or 6-membered cycloalkyl groups such as cyclohexyl or cyclopentyl; and divalent aliphatic groups, for example linear alkylene groups having 2 to 12 carbon atoms such as ethylene, trimethylene, tetramethylene, hexamethylene, octamethylene, decamethylene and dodecamethylene, cycloalkylene groups such as a 1,3- or 1,4-cyclohexylene group, and the group These groups represented by R¹ may be substituted by the same substituents as described above with regard to A¹. R¹ is preferably the aromatic radical rather than the aliphatic radical in view of the performance and heat resistance of the imide compounds as a molding aid. In formula (1)-b for the plasticizer used in the present invention, examples of preferred tetravalent aromatic radical for A² are monocyclic, fused ring and polycyclic tetravalent aromatic groups represented by the following formula. (Z is as defined hereinabove). The same linear alkyl groups having 1 to 18 carbon atoms and 5- or 6-membered cyclic alkyl groups as exemplified above for R¹ in formula (1)-a may be cited as examples of the monovalent linear or cyclic aliphatic radical for R². The groups exemplified with regard to A² and R² may be substituted by the same substituents as described above with regard to A¹. Examples of the monovalent alkyl group for R³ in formula (1)-c for the plasticizer used in the present invention are linear alkyl groups having 1 to 10 carbon atoms such as methyl, ethyl, propyl, butyl, hexyl, octyl and decyl. Examples of the alkylene group for A³ in formula (1)-d for the plasticizer used in the present invention are linear alkylene groups having 2 to 4 carbon atoms such as ethylene, trimethylene and tetramethylene. A³ is preferably -O-, -SO₂- and -CO-. Ar in formula (1)-d is preferably the same as R¹ with n=1 and may be substituted by the same substituents (e.g., phenylphenoxy, phenyl, or phenoxy) as defined for A¹. Examples of the imide compounds of formula (1)-a include those in which n is 1, such as N-methylphthalimide, N-ethylphthalimide, N-octylphthalimide, N-laurylphthalimide, N-myristylphthalimide, N-stearylphthalimide, N-ethyl-1,8-naphthalimide, N-lauryl-1,8-naphthalimide, N-myristyl-1,8-naphthalimide, N-cetyl-1,8-naphthalimide, and N-stearyl-1,8-naphthalimide; and those in which n is 2, such as N,N'-ethylenebisphthalimide, N,N'-tetramethylenebisphthalimide, N,N-hexamethylenebisphthalimide, N,N'-octamethylenebisphthalimide, N,N'-decamethylenebisphthalimide, N,N'-dodecamethylenebisphthalimide, N,N'-neopentylenebisphthalimide, N,N'-tetramethylenebis(1,8-naphthalimide), N,N'-hexamethylenebis(1,8-naphthalimide), N,N'-octamethylenebis(1,8-naphthalimide), N,N'-decamethylenebis(1,8-naphthalimide), N,N'-dodecamethylenebis(1,8-naphthalimide), N,N'-1,4-cyclohexylenebisphthalimide, 1-phthalimide-3-phthalimidemethyl-3,5,5-trimethylcyclohexane, N,N'-2,2,4-trimethylhexamethylenebisphthalimide, N,N'-2,4,4-trimethylhexaemethylenebisphthalimide, 4,4'-bisphehalimide diphenyl ether, 3,4'-bisphthalimide diphenyl ether, 3,3'-bisphthalimide diphenylsulfone, and 4,4'-bisphthalimide diphenylmethane. Examples of the imide compounds represented by the formula (1)-b incluide N,N'-diethylpyromellimide, N,N'-dibutylpyromellitimide, N,N'-dihexylpyromellitimide, N,N'-dioctylpyromellitimide, N,N'-didecylpyromellitimide, N,N'-dilaurylpyromellitimide, N,N'-dicyclohexyl pyromellitimide, and N,N'-diethyl-1,4,5,8-naphthalenetetracarboxylic 1,8-, 4,5-diimide. The imide compounds represented by formula (1)-a may be produced by a known method from the corresponding acid anhydrides and organic amines. Examples of the compounds represented by formula (1)-c are triethyl isocyanurate, tributyl isocyanurate, trihexyl isocyanurate and trioctyl isocyanurate. Examples of the compounds represented by formula (1)-d include diphenylsulfone, 4,4'-diphenoxydiphenylsulfone, 4,4'-bis(4- or 3- or 3-chlorophenoxy)diphenylsulfone, 4,4'-bis(4- or 3- or 2-phenylphenoxy)diphenylsulfone, 4,4'-bis(4- or 3- or 2-t-butylphenoxy)diphenylsulfone, 4,4'-bis(4- or 3- or 2-octylphenoxy)diphenylsulfone, and 4,4'-bis(alpha- or beta-naphthyloxy)diphenylsulfone. Of the above, the compounds of formula (1)-d are preferred, and above all, diphenylsulfone is preferred. The intimate mixture of this invention preferably contains the polyamideimide (A) in a proportion of 60 to 90% by weight, more preferably 60 to 80% by weight, based on the total amount of the polyamideimide (A) and the plasticizing material (B). The intimate mixture of this invention can be produced by thermally condensing an acid component composed mainly of trimellitic acid and/or trimellitic anhydride and a diamine component composed mainly of 3,4'-diaminodiphenyl ether and/or its lower aliphatic carboxylic acid amide in the presence of the plasticizer described above. The plasticizer is used in such a proportion that the concentration of the resulting polymer is preferably at last 50% by weight, more preferably at least 60% by weight, especially preferably at least 70% by weight. The thermal condensation is carried out usually at 200 to 350°C, preferably 250 to 320°C, especially preferably 260 to 310°C. Preferably, the thermal condensation is carried out under atmospheric pressure to elevated pressure, and as required, under such reduced pressures as not to cause evaporation of the plasticizing material. It is carried out in an atmosphere of an inert gas such as nitrogen or argon. The thermal condensation reaction is desirably carried out in the presence of a small amount of a catalyst for promoting the reaction between the aromatic amino group and the carboxyl group, such as phosphorus compounds, boron compounds, or heteropolyacids. Examples of the phosphorus compounds are trimethyl phosphite, triethyl phosphite, triphenyl phosphite, phosphoric acid, triphenylphosphine, polyphosphoric acid, phosphoric acid, phosphorous acid and hypophosphorous acid. Boric acid is an example of the boron. There can also be used a condensing agent which participates in the condensation reaction between the aromatic amino acid and the carboxyl group and itself changes to promote the amide-forming reaction. Examples of the condensing agent are a combination of triphenylphosphine and pyridine, diphenyl sulfite, diphenyl carbonate, diaryl esters of dicarboxylic acids such as diphenyl terephthalate, and compounds represented by the following formula wherein R⁴ represents an aromatic group having 6 to 20 carbon atoms, aliphatic groups having 2 to 10 carbon atoms, or a bond, and the two lactam rings are 5- to 7-membered, such as Water formed as a result of the thermal condensation reaction is removed out of the reaction system. The condensing agent is preferably added in such an amount that after removing water formed as a result of imidization, it induces reaction of the 4-carboxyl group of the trimellitic acid residue with all remaining amino groups. According to this invention, the polyamideimide is obtained as an intimate mixture with a plasticizing material therefor. This intimate mixture is characterized by being shapable at temperature considerably lower, for example about 100°C lower, than the temperature at which the polyamideimide alone can be shaped. The plasticizing material can be removed by treating the shaped article or if required, small masses of the product before shaping, with a solvent capable of dissolving the plasticized product but incapable of dissolving the polyamideimide. Examples of preferred solvents used for this purpose include aromatic hydrocarbons, halogenated aliphatic hydrocarbons, aliphatic ketones, aliphatic esters, and cyclic ethers. Specific examples are toluene, xylene, methylene chloride, chloroform, acetone, methyl ethyl ketone, methyl acetate, ethyl acetate and dioxane. The polyamideimide used in this invention can be one which when undergoing heat-treatment after shaping, locally permits introduction of a crosslinked structure. Introduction of a crosslinked structure increases the heat resistance of the polymer in use. The easiest and most effective method of introducing such a crosslinked structure is to add an aromatic triamine or tetramine to the reaction mixture in the final stage of the polymerization reaction or to the resulting polymer, shape the polymer in the non-crosslinked state and heat-treat the shaped product thereby to introduce a crosslinked structure by reaction with the terminal groups. Examples of such a triamine or tetramine are 2,4,4'-triaminodiphenyl ether, 1,3,5- or 1,2,4-triaminobenzene, and 3,3',4,4'-tetraminodiphenyl ether. On the other hand, it is possible to use tri-functional or higher polycarboxylic acids (e.g., trimesic acid or its derivatives) for the aromatic amino groups as a crosslinking agent. Conversely, if the reactive amino groups of the polymer are blocked by adding a highly reactive mono-functional compound such as a monoaryl carboxylate (e.g., phenyl benzoate), N-benzoyl caprolactone, or a dicarboxylic acid anhydride (e.g., phthalic anhydride) in the last stage of polymerization or during the molding of the polymer, the thermal stability of the polymer can be increased while inhibiting coloration. The polyamideimide constituting the intimate mixture of this invention may be used in a wide range of applications, for example as a varnish, an adhesive, a film, fibers, a matrix resin for fiber-reinforced composite materials, and a molding resin for compression molding, extrusion, injection molding, etc. As a varnish, the polyamideimide is used as a solution in N-methylpyrrolidone or cresol as a main solvent as an enamelling varnish for wires and cables, and as an enamel for aluminum utensils. The polymer in powder form may be used for coating a metallic surface by applying the powdery polymer to the surface and then baking it. Films and fibers may be shaped from a solution of the polymer by the wet or dry method. They can be used for electrical insulation and as protective apparel by utilizing the good heat resistance and fire retardancy of the polymer. As an adhesive, the polyamideimide may be used as a dry film adhesive, or as a solution adhesive to be coated on an adhrend, dried and then thermally melt-bonded. The adherend may, for example, be metals, especially iron, aluminum, stainless steel and copper. When the polyamideimide is used as a matrix resin for fiber-reinforced composite materials, the polymer in the form of a solution or a powder fluidized layer is applied to the surface of reinforcing fibers to form strands, unidirectional prepregs, etc, and molded articles can be obtained from them by various techniques such as autoclave molding, press-forming, or filament winding. As a molding resin, molding compounds are prepared together with various additives, and shaped by compression molding, extrusion, injection molding, etc. The molded articles described above have a well balanced combination of heat resistance, mechanical properties and chemical resistance, and can be widely used in advanced technological fields as functional component parts of various transporting machines such as aircraft, spacecraft, automobiles and ships, electrical, electronic and automation instruments and appliances and sporting goods. In actual use, the polymers may be used as blends with various additives and other polymers. The following Examples illustrate the present invention more specifically. EXAMPLE 1 A reactor equipped with a stirrer, a nitrogen gas introducing opening and a distillation opening was charged with 20.0g of 3,4'-diaminodiphenyl ether, 19.2g of trimellitic anhydride, 0.2g of triphenyl phosphate, and 15.3g of diphenylsulfone. After purging the inside of the reactor well with nitrogen, the reaction was carried out at 280°C for 2 hours in a stream of nitrogen gas while water formed was distilled out of the reaction system. The resulting composition was transparent. The composition was then pulverized to a size of 10 to 20 mesh, immersed in acetone and extracted under heat. The resulting polymer had an inherent visosity, measured at 30°C in NMP in a concentration of 0.5 g/dl, of 0.64. COMPARATIVE EXAMPLE 1 The same reaction as in Example 1 was carried out except that 4,4'-diaminodiphenyl ether was used instead of 3,4'-diaminodiphenyl ether. In about 30 minutes after the start of the reaction, the reaction system solidified and became unable to be stirred uniformly. EXAMPLES 2-5 Example 1 was repeated except that a predetermined amount of each of he compounds shown in Table 1 below was used instead of 15.3 g of diphenylsulfone, and the reaction was carried out under the reaction conditions shown in Table 1. The resulting compositions were transparent. The compositions were each extracted with acetone in the same way as in Example 1, and the resulting polymers had the inherent viscosities shown in Table 1. Example Low-molecular-weight compound (amount added) Reaction conditions η inh Temp. (°C) Time (hrs) 2 Diphenylsulfone (8.9 g) 290 2 0.63 3 Diphenylsulfone (24.0 g) 280 7 0.68 4 4,4'-bis-(p-phenylphenoxy)diphenylsulfone (15.3 g) 290 2 0.61 5 4,4'-Diphenoxydiphenylsulfone (15.3 g) 280 3 0.66 EXAMPLES 6 AND 7 The same reactor as used in Example 1 was charged with the material shown in Table 2, 15.3g of diphenylsulfone and 0.5g of triphenyl phosphite, and the same reaction and extraction as in Example 1 were carried out. The intrinsic viscosities of the resulting polymers are shown in Table 2. Example Materials η inh 6 3,4'-diaminodiphenylether (16.0 g) 0.48 m-phenylenediamine (2.2 g) trimellitic anhydride (19.2 g) 7 3,4'-diaminodiphenyl ether (20.0 g) 0.62 trimellitic anhydride (17.3 g) diphenyl isophthalate (3.2 g) Example 8 The same reactor as in Example 1 was charged with 20.0g of 3,4'-diaminodiphenyl ether, 19.0g of trimellitic anhydride, 23.7g of diphenylsulfone and 0.2g of triphenyl phosphite, and they were reacted at 270°C for 1 hour in a stream of nitrogen gas. At this point, part of the polymer composition was sampled and extracted, and its inherent viscosity was measured. It was 0.29. Then, 2g of N,N'-terephthaloyl biscaprolactam was added, and the mixture was reacted for 30 minutes. After the extracting treatment, the polymer had an inherent viscosity of 0.67. EXAMPLE 9 The same polyamideimide (inherent viscosity 0.61) as obtained in Example 1 and a mixture of the polyamideimide with 30% by weight of glass fibers were each injection-molded at a cylinder temperature of 280 to 310°C and a mold temperature of 165°C. The resulting molded articles had the properties shown in Table 3. Property Polyimide alone Mixture of the polyimide and glass fibers Tensile sgtrength (kg/cm²) 720 1130 Elongation (%) 4.7 3.0 Flexural strength (kg/cm²) 1150 1520 Flexural modulus (kg/cm²) 41000 100000 Heat distortion temperature (°C) 208 221

Claims: A shapeable intimate mixture comprising (A) a polyamideimide comprising a unit of formula (II) and a unit of formula (IV) wherein units of formulae (IV) and (II) provide at least 50% of the entire units forming the molecular chains of the polyamideimide and (B) a plasticizing material for the polyamideimide (A) having a boiling point of least 300°C, a molecular weight of not more than 1000, which is compatible, but substantially non-reactive, with the polyamideimide and which is selected from an imide compound formula (1)-a wherein A¹ is a divalent aromatic group which may be substituted, R¹ is an n-valent aromatic radical or linear or cyclic aliphatic radical which may be substituted, and n is 1 or 2, provided that the imide ring in the above formula is 5- or 6-membered, an imide compound of formula (1)-b wherein A² is a tetravalent aromatic radical which may be substituted, and R² is a monovalent linear or cyclic aliphatic radical which may be substituted, provided that the imide ring in the above formula is 5- or 6-membered, a trialkyl isocyanurate of formula (I)-c wherein A³ is a monovalent alkyl group, and a diphenyl compound of formula (1)-d Ar-A³-Ar (1)-d wherein R³ is -O-, -SO₂-, -CO- or an alkylene group and Ar is an aromatic radical; the proportion of the polyamideimide (A) being 40 to 90% by weight based on the total amount of the polyamideimide (A) and plasticizing material (B). An intimate mixture according to claim 1 wherein the proportion of the unit of formula (IV) and the unit of formula (II) directly bonded to each other is at least 50% of the total proportion of the unit of formula (IV) and the unit of formula (II). An intimate mixture according to claim 1 wherein the total proportion of the unit of formula (IV) and the unit of formula (II) directly bonded to each other is at least 50% based on the entire units forming the molecular chains of the polyamideimide. An intimate mixture according to any one of claims 1 to 3 wherein the polyamideimide has an inherent viscosity, measured at 30°C in N-methylpyrrolidone, of at least 0.2. An intimate mixture according to any one of claims 1 to 4 wherein the polyamideimide further comprises at least one unit selected from a unit of formula (V) -HNCO-Ar¹-CONH-Ar²- (V) wherein Ar¹ and Ar² are identical or different and each represents a divalent aromatic group having 6 to 20 carbon atoms, a unit of formula (VI) -Ar³-CONH- (VI) wherein Ar³ is the same as Ar¹, a unit of formula (VII) wherein Ar⁴ represents a tetravalent aromatic group having 6 to 20 carbon atoms, and Ar⁵ is the same as Ar¹, and a unit of formula (VIII) wherein Ar⁶ represents an aromatic group having 6 to 20 carbon atoms, and Ar⁷ is the same as Ar¹, provided that Ar⁷ is not a 3,4'-diphenyl ether group, the proportion of said at least one unit being smaller than the total proportion of the unit of formula (IV) and the unit of formula (II). An intimate mixture according to any one of claims 1 to 6 wherein the proportion of the polyamideimide (A) is 60 to 90% by weight based on the total amount of the polyamideimide (A) and the plasticizing material (B).

Inventors: HARA, SHIGEYOSHI, INATA, HIROO
Applicants: TEIJIN LIMITED
Application year: 1986
Main classification: C08G73
IPC codes: H05K1, C08G73, H05K3, C08L79