EPOXY RESIN COMPOSITIONS

Abstract: Disclosed are epoxy resin compositions comprising a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydro­ quinone and a reaction catalyst, or a 1,1 bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. These epoxy resin compositions as prepared are in a liquid state and hence resin moldings can be manufactured therefrom by such a simple technique as casting. It is also possible to cure these resin compositions at a temperature below 150°C, and the resin moldings obtained therefrom are tough and excellent in impact resistance as well as in heat resistance.

Description: FIELD OF THE INVENTION This invention relates to epoxy resin compositions and more particularly to liquid epoxy resin compositions, from which resin moldings excellent in impact strength can be manufactured by casting techniques. BACKGROUND OF THE INVENTION Because of such preferable properties as high impact strength and high elongation, thermoplastic resins such as ABS resins and polycarbonate resins are utilized in various fields as molding materials for a variety of purposes, including of course automobiles and household electrical appliances. However, where test resin moldings or resin molding products varied in kind but small in quantity are intended to be manufactured by using such resins as mentioned above, for example ABS resins, the viscosity of the resin is not suitable fo use in cast molding even when the resins are heated to about 280°C. and, therefore, desired resin moldings cannot be manufactured therefrom by the casting technique. Thus, there is no alternative but to manufacture desired resin moldings from these resins by injection molding or the like techniques. This creates the problem that the manufacturing of the above-mentioned resin moldings from these resins relying on the injection molding or the like molding techniques cannot avoid the economic disadvantages of using expensive metal molds or the like. On the other hand, the aforesaid test resin moldings or resin molding products varied in kind but small in quantity can be manufactured at a very low cost from thermosetting resins such as epoxy resins since these thermosetting resins are in the form of monomers or oligomers when they are molded and are moldable with silicone molds or simple metal molds according to casting techniques. In cured products of thermosetting resins, however, there is the problem that the cured products are generally poor in physical properties such as impact strength and elongation, and are found to be fragile, and particularly that it is difficult to obtain resin molding products having Izod impact strengths of higher than 10 kg cm/cm. Mixing thermosetting resins with such flexibility-imparting agents as rubber and the like for the purpose of improving the cured products of said thermosetting resins in terms of such physical properties as mentioned above inversely resulted in a further problem that said cured products as obtained thereby were extremely reduced in tensile strength, flexural strength, compression strength, heat resistance or the like properties and finally no resin molding products having a good balance of physical properties could be obtained. In this connection, the specification of British Patent No. 1,087,166 discloses a process for preparing polyether resins having a molecular weight of at least 40,000. According to this patent specification, it is alleged that the desired polyether resins are obtained by reacting bisphenols or divalent phenols with diepoxy compounds in the presence of tertiary amine catalysts. Even the polyether resins as obtained in the examples of the specification of this British patent, however, still involved the problem that said polyether resins cannot be said to possess an excellent balance of various physical properties such as impact strength. OBJECT OF THE INVENTION The present invention is to solve such various problems as associated with the prior art, and an object of the invention is to provide liquid epoxy resin compositions, from which resin molding products varied in shape can be manufactured by such a simple method as casting, said resin molding products being excellent in balance of various physical properties, particularly being tough and excellent in impact strength and, moreover, in heat resistance. SUMMARY OF THE INVENTION Epoxy resin compositions of the present invention are firstly those comprising 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin i.e a 1,1-bis(4-hydroxyaryl)ethane or propane diglycidyl ether, hydroquinone and a reaction catalyst. Epoxy resin compositions of the present invention are secondly those comprising 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. The epoxy resin compositions of the present invention thus comprise a 1,1-bis(4-hydroxyaryl) ethane or propane diglycidyl ether and (a) hydroquinone and a reaction catalyst; or (b) an aminoalkyl piperazine compound selected from N-aminoalkyl piperazines in which the alkyl group has from 1 to 6 carbon atoms and N,N'-bis(aminoalkyl)piperazines in which the alkyl groups have from 1 to 6 carbon atoms; or (c) the reaction product of the aminoalkyl piperazine compound (b) with a modifier whereby the amount of modifier used is such as to react with less than 30% of the active hydrogen atoms of the aminoalkyl piperazine compound. Since these epoxy resin compositions as prepared are in a liquid state, resin molding products can be manufactured therefrom by such a simple method as casting. Furthermore, the present epoxy resin compositions can be cured at a temperature below 150 o C. to manufacture, according to the above-mentioned method, desired resin molding products which are tough and excellent in impact strength as well as in heat resistance. BRIEF DESCRIPTION OF THE DRAWING FIG.1 is a diagram showing a relationship between the measured values of physical properties of resin molding products obtained and the HQ/AD molar ratios, said resin molding products being obtained from epoxy resin compositions comprising 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether, hydroquinone and a reaction catalyst, in which mixtures of hydroquinone (shown as HQ) and 1,1-bis(4-hydroxyphenyl)ethane (shown as AD) are used in various proportions. DETAILED DESCRIPTION OF THE INVENTION The epoxy resin compositions of the present invention are illustrated below in more detail. The first epoxy resin compositions as aforesaid are explained, to begin with. These epoxy resin compositions comprise 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydroquinone and a reaction catalyst. Preferably used as the 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resins are those which are in a liquid state at room temperature (25 o C). Such epoxy resins include, for example, glycidyl ethers of 1,1-bis(4-hydroxyphenyl) ethane, i.e. 1,1-bis(4-hydroxyphenyl)-ethane diglycidyl ether, 1,1-bis(4-hydroxyphenyl)ethane di-β-methyl-glycidyl ether and glycidyl ethers of 1 , 1-bis(4-hydroxyphenyl)propane, i.e. 1,1-bis(4-hydroxyphenyl)propane diglycidyl ether. Of these epoxy resins, 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether is particularly prefered since the epoxy resin composition prepared using this epoxy resin is low in viscosity and, moreover, the resin molding product obtained therefrom is excellent in impact strength. In the first epoxy resin compositions of the present invention hydroquinone which is a dihydric phenol is used in combination with the 1,1-bis(4-hydroxyaryl)lower alkane type epoxy resin. Under certain circumstances, furthermore, a dihydric phenol other than hydroquinone can also be used in combination with the hydroquinone. Dihydric phenols other than hydroquinone include resorcinol, bis(4-hydroxyphenyl)methane, 2,2-bis(4-hydroxyphenyl)propane (so-called bisphenol A), 1,1-bis(4-hydroxyphenyl)ethane (so-called bisphenol AD), 2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane, or dihydric phenols obtained by reacting dihydric phenols with both terminals of epoxy resins which are diglycidyl ethers of the above-mentioned dihydric phenols, which dissolve in the aforesaid 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resins. Of these dihydric phenols, 1,1-bis(4-hydroxyphenyl)ethane (so-called bisphenol AD) is preferred. Such dihydric phenols other than hydroquinone as mentioned above are used in combination with hydroquinone. Where the dihydric phenol other than hydroquinone is 1,1-bis(4-hydroxyphenyl)ethane, however, the hydroquinone and 1,1-bis(4-hydroxyphenyl)ethane are conveniently used in such a proportion that the molar ratio of hydroquinone/1,1-bis(4-hydroxyphenyl)ethane is in the range of from 100/0 to 20/80. The use of 1,1-bis(4-hydroxyphenyl)ethane in an amount exceeding the above range is not preferable as a radical decrease in impact strength (Izod impact strength) of the resulting resin molding product is brought about (see Figure 1). Usable as the reaction catalst in the present invention are those which dissolve in mixtures of 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resins and hydroquinone and which are capable of acting as reaction catalysts for said mixtures. Useful reaction catalysts include, for example, quaternary ammomium salts such as benzyl triethylammonium chloride and tetraethyl ammonium bromide; tertiary amines such as N,N-benzyldimethylamine and p-dimethylaminobenzaldehyde; imidazoles such as 2-ethyl-4-methyl-imidazole; phosphines such as triphenylphosphine; and quaternary phosphonium salts such as triphenylethylphosphonium halide. The first epoxy resin compositions of the present invention contain the above-mentioned components as essential ingredients thereof, wherein 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resins and dihydric phenol (hydroquinone, or hydroquinone and a dihydric phenol other than hydroquinone) are preferably used in such a proportion that the ratio of hydroxy equivalent of the dihydric phenol/epoxy equivalent is in the range from about 0.8 to about 1.2. The use of the dihydric phenol in an amount smaller than the above-mentioned range is not preferable since the molecular weight of the resulting resin molding product decreases and a resin molding product which is tough and excellent in impact strength can not be obtained. On the other hand, the use of the dihydric phenol in an amount greater than the above-mentioned ratio is not preferable since the amount of unreacted dihydric phenol present in the resulting resin molding product increases and a resin molding product which is tough and excellent in impact strength can not be obtained. The reaction catalyst is preferably used in an amount of 0.01-2% by weight based on the total weight of 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and divalent phenol used. The first epoxy resin compositions of the present invention may be prepared by first dissolving the dihydric phenol including hydroquinone, while heating to about 50-180°, preferably 80-150°C., in 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, and then adding to the resulting mixture the reaction catalyst. The first epoxy resin compositions of the present invention can also be mixed further, within the object and scope of the invention, with other epoxy resins, for example, glycidyl esters of aromatic dicarboxylic acids or glycidyl ethers of other polhydric phenols, for example, trihydric phenols. The first epoxy resin composition obtained in this manner is cast in a simple mold, for example, a silicone or epoxy resin mold or an aluminum metal mold, and heated generally at about 100-180 o C, preferably about 100-150 o C., for about 1-15 hours, preferably about 3-5 hours, whereby the composition undergoes reaction to form a polymer which give a tough resin molding product. In that case, when a resin molding product to be manufactured has a complicated shape, the reaction may be carried out under reduced pressure in order to prevent occurrence of air-bubble voids in the resulting resin molding product. As mentioned previously, the first epoxy resin compositions of the present invention as prepared are in a liquid state at an ordinary temperature and can be subjected to casting, and hence the compositions can be molded with a simple mold and, at the same time, the resulting resin molding products are excellent in impact strength, elongation, mold shrinkage factor and dimensional accuracy, and are tough and exhibit well-balanced physical properties. Therefore, the first epoxy resin composition of the present invention can also be used effectively in the field of molding products where polycarbonate resins or the like have heretofore been used. Furthermore, in the first epoxy resin compositions of the present invention, the characteristic feature thereof, to which stress should be laid, resides in the fact that as the dihydric phenol there is used hydroquinone or a mixture of hydroquinone and other dihydric phenol. By virtue of this characteristic feature of the present first epoxy resin compositions, the resin molding products obtained therefrom have quite high impact strength in comparison with those obtained from epoxy resin compositions in which dihydric phenols other than hydroquinone are used alone. Next, the second epoxy resin compositions of the present invention are illustrated hereinafter. The second epoxy resin compositions of the present invention comprise 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. The 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resins used in the second epoxy resin compositions are the same as the 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin used in the present first epoxy resin compositions, and particularly preferable is 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether. In the present second epoxy resin compositions, N-aminoalkyl-substituted piperazines or modified products thereof are used in combination with the 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin. Usable as the N-aminoalkyl-substituted piperazine are N-aminoalkyl piperazines or N,N'-bis(aminoalkyl) piperazines, the alkyl group of which is a lower alkyl group having generally 1-6 carbon atoms, preferably 2-4 carbon atoms, particularly preferable are N-aminoethyl piperazine, N-aminopropyl piperazine, N,N'-bis(aminoethyl)piperazine or N,N'-bis(aminopropyl)piperazine. The N-aminoalkyl-substituted piperazines can also be used as modified products thereof and, in this case, usable modifiers therefor include, for example, propylene oxide, n-butyl glycidyl ether, phenyl glycidyl ether, epoxy compounds such as bisphenol A type epoxy resin, acrylonitrile, acrylic esters, maleic anhydride, vinyl compounds such as maleimide, ketone compounds such as methyl isobutyl ketone, and compounds capable of reacting with a part (less than 30%) of the active hydrogen of N-aminoalkyl-substituted piperazines. By the use of such modified products of the N-aminoalkyl-substituted piperazines, the cure rate of epoxy resins can be controlled, the formation of salt by the reaction of the epoxy resin with carbon dioxide present in air can be prevented, or toxicity or skin irritation can be reduced. The second epoxy resin compositions of the present invention contain the above-mentioned components as essential ingredients thereof, wherein the 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or modified product thereof are preferably used in such a proportion that the equivalent ratio of the epoxy group of the former to the active hydrogen of the latter is in the range of from 0.8 to 1.2, preferably from 0.9 to 1.1. The use of these ingredients in a proportion outside the above-mentioned range is not preferable since the proportion of unreacted epoxy or amino groups in the composition becomes excessively high and no resin molding product having sufficient strength and heat resistance is obtained. In addition to the above-mentioned two essential ingredients, the second epoxy resin compositions of the present invention can include, if necessary, diluents, flexibilizers, flame retardants, fillers and other additives. The diluents are used for decreasing the viscosity of the epoxy resin compounds, and are used usually in an amount of about 20% by weight based on the 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin. Usable as the diluents are, for example, monoepoxides such as butyl glycidyl ether, aryl glycidyl ethers such as phenyl glycidyl ether and cresyl glycidyl ether; diepoxides such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, vinyl cyclohexene dioxide and diglycidyl aniline; and triepoxides such as trimethylol propane triglycidyl ether and glycerine triglycidyl ether. The flexibilizers which are usable include, for example, polypropylene glycol, polyethylene glycol and carboxy-terminated nitrile rubber, and they are used generally in a proportion of less than about 20% by weight based on the 1,1-bis(4-hydroxyaryl)alkane type epoxy resin. Usable as the flame retardants are, for example, bromine containing compounds such as dibromocresyl glycidyl ether, tetrabromobisphenol A, tetrabromobisphenol AD and hexabromobenzene, phosphorus containing compounds such as tris(chloro-ethyl)phosphate and tris(dichloropropyl)phosphate, and antimony trioxide. The fillers are used for the purpose of improving heat resistance, decreasing coefficient of linear expansion, improving heat conductivity and improving dimensional stability, and include for example inorganic fillers such as silica, talc and calcium carbonate, to which silane coupling agents, anti-foam agents and thixotropy imparting agents are suitably added. The second epoxy resin compositions of the present invention may he prepared by simply mixing together the above-mentioned components. The second epoxy compositions of the present invention obtained in the manner now described are cast in a simple mold, for example, a silicone or epoxy resin mold or an aluminum metal mold, and heated generally at about 20-150 o C., preferably about 40-100 o C., for about 0.5-5 hours, preferably about 0.5-3 hours, whereby the composition undergoes reaction to give resin molding products which are excellent in heat resistance and tough, and excellent in impact strength. In that case, when the resin molding products are complicated in shape, the reaction may be carried out under reduced pressure in order to prevent the occurrence of air-bubble voids in the resulting resin molding products. As mentioned hereinabove, the second epoxy resin compositions are in a liquid state at an ordinary temperature and can be subjected to casting, and hence they can be molded with a simple mold and, at the same time, the resin molding products obtained therefrom are excellent in such physical propeties as heat resistance, impact strength, elongation, mold shrinkage factor and dimensional accuracy, and are tough, exhibiting well-balanced physical properties. The present invention is illustrated below with reference to examples, but it should be construed that the invention is in no way limited to those examples. In the following examples, percentages and parts are by weight unless otherwise indicated. Example 1 In a mixture of 100 parts of 1,1-bis(4-hydroxyphenyl) ethane diglycidyl ether (epoxy equivalent 173, viscosity 3000 cps) as an epoxy resin and 31 parts of hydroquinone therein dissolved at 150 o C was dissolved 0.7 part of a triphenyl phosphine as a reaction catalyst. The liquid epoxy resin composition thus obtained was cast in a simple silicone rubber resin mold, and said composition was allowed to undergo reaction at 100 o C for 3 hours. After cooling to room temperature, a resin molding product formed in the mold was released therefrom. Example 2 The same procedure as in Example 1 was repeated, except that the amount of the triphenyl phosphine used was increased to 1.4 parts. Example 3 Example 2 was repeated in the same manner as in Example 1, except that a mixture of 9.3 parts of hydroquinone and 42.7 parts of 1,1-bis(4-hydroxyphenyl)ethane was used as a divalent phenol. Example 4 Example 2 was repeated in the same manner as in Example 1, except that a mixture of 15.3 parts of hydroquinone and 30.5 parts of 1,1-bis(4-hydroxyphenyl)ethane was used as a divalent phenol. Example 5 In a mixture of 100 parts of 1,1-bis(4-hydroxyphenyl)ethane di-β-methyl-glycidyl ether (epoxy equivalent 175, viscosity 3400 c.p.s.) as an epoxy resin and 31 parts of hydroquinone therein dissolved at 150 o C was dissolved 0.7 part of triphenyl phosphine as a reaction catalyst. The liquid epoxy resin composition thus obtained was cast in a simple silicone rubber resin mold, and said composition was allowed to undergo reaction at 100 o C for 3 hours. After cooling to room temperature, a resin molding product formed in the mold was released therefrom. Comparative Example 1 In a mixture of 100 parts of 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether (epoxy equivalent 190, viscosity 14,000 cps) and 29 parts of hydroquinone therein dissolved at 130 o C. was dissolved 1.4 parts of a triphenyl phosphine reaction catalyst. The liquid epoxy resin composition thus obtained was cast in a simple silicone rubber resin mold, and said composition was allowed to undergo reaction at 120 o C for 5 hours. After cooling to room temperature, a resin molding product formed in the mold was released therefrom. Comparative Example 2 Comparative Example 1 was repeated, except that a mixture of 14.5 parts of hydroquinone and 30 parts of 2,2-bis(4-hydroxyphenyl)propane was used as a divalent phenol. Comparative Example 3 In a mixture of 100 parts of 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether (epoxy equivalent 190, viscosity 14,000) and 60 parts of 2,2-bis(4-hydroxyphenyl) propane therein dissolved at 130 o C was dissolved 0.7 part of a triphenyl phosphine as a reaction catalyst. The liquid epoxy resin composition thus obtained was cast in a simple silicone rubber resin mold, and said composition was allowed to undergo reaction at 140 o C for 5 hours. After cooling to room temperature, a resin molding product formed in the mold was released therefrom. Comparative Example 4 The same procedure as in Comparative Example 1 was repeated, except that 31 parts of resorcinol was used as divalent phenol. The resin molding products obtained in the foregoing examples and comparative examples,respectively, were measured, according to JIS K-6911, in physical properties to obtain their respective values as measured were as shown in the following Table 1. Example 6 Examples 3-4 were respectively repeated but by varying the molar ratio of hydroquinone (HQ) to 1,1-bis(4-hydroxyphenyl) ethane (hereinafter indicated as AD), and physical properties of the respective resin molding products obtained were measured to obtain the results as shown in Fig. 1. From the results thus obtained, no change in impact strength of the resin molding product in the range of HQ/AD=100/0-20/80, whereas drastic decrease in impact strength comes to be observed with increasing proportion of AD in the molar ratio. Example 7 A mixture of 100 parts of 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether (epoxy equivalent 173) and 24.9 parts of N-aminoethyl piperazine was allowed to undergo reaction at 50 o C for 2 hours to prepare a test piece. Example 8 Under heating conditions of 100 o C., 9.0 parts of propylene oxide was added dropwise to 100 parts of N-aminoethyl piperazine, and the mixture was allowed to undergo for 2 hours under reflux to prepare a modified aminoalkyl piperazine. Subsequently, a mixture of 95 parts of 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether (epoxy equivalent 173), 5 parts of vinyl cyclohexene dioxide (ERL-4206, epoxy equivalent 73, a product of UCC) and 29 parts of the modified aminoalkyl piperazine prepared in the above manner was allowed to undergo reaction at 60 o C for 2 hours to prepare a test piece. Example 9 A mixture of 95 parts of 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether (epoxy equivalent 173), 5 parts of butyl glycidyl ether and 31 parts of N-aminopropyl piperazine was allowed to undergo reaction at 60 o C for 2 hours to prepare a test piece. Example 10 A modified aminoalkyl piperazine was prepared by treating 100 parts of N-aminoethyl piperazine with 19 parts of propylene oxide. Subsequently, a mixture of 100 parts of 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether (epoxy equivalent 173) and 32 parts of the modified aminoalkyl piperazine prepared in the above manner was allowed to undergo reaction at 60 o C for 2 hours to prepare a test piece. Comparative Example 5 A mixture of 100 parts of 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether (epoxy equivalent 190) and 23 parts of N-aminoethyl piperazine was allowed to undergo reaction at 50 o C for 2 hours to prepare a test piece. Comparative Example 6 A mixture of 100 parts of 1,1-bis(4-hydroxyphenyl) ethane diglycidyl ether (epoxy equivalent 173) and 14 parts of triethylene tetramine was allowed to undergo reaction at room temperature for 1 day and then at 80 o C. for 2 hours to prepare a test piece. Comparative Example 7 A mixture of 100 parts of diglycidyl hexahydrophthalate (Epomik R-540, epoxy equivalent 150, a product of Mitsui Sekiyu Kagaku Kogyo K.K.) and 28 parts of N-aminoethyl piperazine was allowed to undergo reaction at room temperature for 1 hour and then at 60 o C for 2 hours to prepare a test piece. Comparative Example 8 A mixture of 100 parts of 1,1-bis(4-hydroxyphenyl)ethane diglycidyl ether (epoxy equivalent 173), 93 parts of ethyl tetrahydrophthalic anhydride (HN-2000, a product of Hitachi Kasei Kogyo K.K.) and 0.2 part of benzyl dimethylamine was allowed to undergo reaction at 100 o C for 2 hours and then at 150°C for 4 hours to prepare a test piece. Comparative Example 9 A mixture of 90 parts of 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether (epoxy equivalent 190), 10 parts of butyl glycidyl ether and 36 parts of m-xylene diamine was allowed to undergo reaction at 60 o C for 2 hours to prepare a test piece. Comparative Example 10 A mixture of 50 parts of 2,2-bis(4-hydroxyphenyl) propane diglycidyl ether (epoxy equivalent 190), 50 parts of carboxyl-terminated nitrile rubber (Hycar-CTBN 1300x13, a product of Ube Kosan K.K.) and 11 parts of N-aminoethyl piperazine was allowed to undergo reaction at 60 o C for 2 hours to prepare a test piece. The test pieces respectively prepared in the foregoing examples and comparative examples were measured, according to JIS K-6911, for heat deflection temperature and Izod impact strength(notched) to obtain the results as shown in Table 2.

Claims: An epoxy resin composition comprising a 1,1-bis(4-hydroxyaryl) ethane or propane diglycidyl ether and (a) hydroquinone and a reaction catalyst; or (b) an aminoalkyl piperazine compound selected from N-aminoalkyl piperazines in which the alkyl group has from 1 to 6 carbon atoms and N,N'-bis(aminoalkyl)piperazines in which the alkyl groups have from 1 to 6 carbon atoms; or (c) the reaction product of the aminoalkyl piperazine compound (b) with a modifier whereby the amount of modifier used is such as to react with less than 30% of the active hydrogen atoms of the aminoalkyl piperazine compound. The epoxy resin composition as claimed in claim 1 wherein a dihydric phenol other than hydroquinone is used in combination with the hydroquinone. The epoxy resin composition as claimed in claim 2 wherein the dihydric phenol other than hydroquinone is 1,1-bis(4-hydroxyphenyl) ethane, the molar ratio of the hydroquinone to the 1,1-bis(4-hydroxyphenyl) ethane being from 100/0 to 20/80. The epoxy resin composition as claimed in any preceding claim wherein the 1,1-bis(4-hydroxyaryl) ethane or propane diglycidyl ether and dihydric phenol including hydroquinone are used in such a proportion that the equivalent ratio of the hydroxy groups of the dihydric phenol to the epoxy groups in the composition is from 0.8 to 1.2. The epoxy resin composition as claimed in claim 1 wherein the 1,1-bis(4-hydroxyaryl) ethane or propane diglycidyl ether and the aminoalkyl piperazine compound are used in such a proportion that the equivalent ratio of the epoxy groups in the composition to the active hydrogen atoms in the aminoalkyl piperazine compound is from 0.8 to 1.2. The epoxy resin composition as claimed in claim 1 wherein the 1,1-bis(4-hydroxyaryl) ethane or propane diglycidyl ether and the reaction product of the aminoalkyl piperazine compound with the modifier are used in such a proportion that the equivalent ratio of the epoxy groups in the composition to the active hydrogen atoms in the said reaction product is from 0.8 to 1.2. The epoxy resin composition as claimed in claim 1 or claim 6 wherein the modifier is selected from the group consisting of propylene oxide, n-butyl glycidyl ether, phenyl glycidyl ether, a bisphenol A epoxy resin, acrylonitrile, an acrylic ester, maleic anhydride, maleimide and methyl isobutyl ketone. The epoxy resin composition as claimed in any of claims 5 to 7 wherein the aminoalkyl piperazine compound is N-aminoethyl piperazine, N-aminopropyl piperazine, N,N'-bis(aminoethyl) piperazine or N,N'-bis(aminopropyl) piperazine. The epoxy resin composition as claimed in any preceding claim wherein the 1,1-bis(4-hydroxyaryl) ethane or propane diglycidyl ether is 1,1-bis(4-hydroxyphenyl) ethane diglycidyl ether. A resin molding obtained from an epoxy resin composition as claimed in any preceding claim.

Inventors: IWATA, TADAO, TOMINAGA, KAORU
Applicants: MITSUI SEKIYU KAGAKU KOGYO KABUSHIKI KAISHA
Application year: 1986
Main classification: C08G59
IPC codes: C08G59