A SEMICONDUCTOR LASER DEVICE

Abstract: A semiconductor laser device comprising a multi-layered crystal structure containing an active layer (3) for laser oscil­ lation on a V-stripe channeled substrate (1), wherein regions (100) by means of which carrier within said active layer (3) is prevented from diffusing outside of said active layer are disposed facing each other with an optical waveguide (W) therebetween which is formed by the absorption of light by the shoulder portions of the striped channel (7). The distance between the regions (100) is narrower (W₁) than the width (W) of said optical waveguide in the vicinity of both facets and wider (W₂) than the the width of said optical waveguide inside of both facets.

Description: This invention relates to an index guided semiconductor laser device which attains laser oscillation at an extremely low threshold current level without creating astigmatism. Conventional semiconductor laser devices are classified into two groups, gain-guided semiconductor laser devices and index guided semiconductor laser devices, according to their optical waveguiding mechanism. Index guided semiconductor laser devices are superior to gain-guided semiconductor laser devices in view of transverse mode stabilization which is important in practical use. Index guided semiconductor laser devices having a variety of structures have been proposed, typical examples of which are BH (buried heterostructure) lasers and VSIS (V-channeled substrate inner stripe) lasers. Figure 2(A) of the accompanying drawings shows a conventional BH laser device, in which a multi-layered crystal structure having the width W is formed into a stripe on a p-GaAs substrate 1 so as to function as a laser oscillation operating area. The multi-layered crystal structure constitutes a double-heterostructure which is composed of a p-GaAlAs cladding layer 2, a GaAlAs active layer 3, an n-GaAlAs cladding layer 4, and an n-GaAs cap layer 5. A substance 15 having a low refractive index is buried outside of the active layer 3, resulting in an index guided structure creating no astigmatism and having a threshold current of as small as about 10mA. However, if a proper refractive index is not applied to the burying layer 15 and if a proper width is not applied to the waveguide, the device will oscillate in a high-order transverse mode. Thus, the BH laser device is disadvantageous in that it is restricted by production conditions. Figure 2(B) shows a conventional VSIS laser device, which is produced as follows: On a p-GaAs substrate 1 , an n-GaAs current blocking layer 6 is formed by liquid phase epitaxy. Then, a striped V-channel having the width W is formed in the substrate 1 through the current blocking layer 6 , resulting in a current path. Then, on the current blocking layer 6 including the V-channel, a p-GaAlAs cladding layer 2 , a GaAlAs active layer 3 , an n-GaAlAs cladding layer 4 , and an n-GaAs cap layer 5 are successively formed by liquid phase epitaxy, resulting in a double-heterostructure for laser oscillation operation. Even when the width W of the waveguide is set at a value of as large as 4-7 µm, since laser light outside of the waveguide within the active layer 3 is absorbed by the substrate 1 , high-order mode gain is suppressed and a high-order transverse mode does not occur. However, the threshold current of this VSIS laser device is 40-60 mA, which is very much higher than that of the BH laser device. Moreover, the astigmatism arising from this VSIS laser device is as large as 10-20 µm. The reason why the threshold current of the VSIS laser device becomes high is as follows: Current injected into the device is confined within the inner striped structure formed by the current blocking layer 6 , but carrier injected into the active layer 3 diffuses into the outside of the active layer 3 , resulting in carrier unusable for laser oscillation. Figure 3 shows the distribution of carrier density n in the junction direction y within the active layer of the VSIS laser device, indicating that when the waveguide width W is 4 µm, carrier at the shaded areas (corresponding to the outside of the waveguide) is unusable for laser oscillation. The unusable carrier results in unnecessary light and/or the generation of unnecessary heat, causing a decrease in reliability of the device. Moreover, the above-mentioned large astigmatism of the VSIS laser device arises because light outside of the waveguide is absorbed by the substrate and the wave front of said outside light is propagated later than that of light inside of the waveguide. It is an object of the present invention to provide a semiconductor laser device which, overcomes the above-described disadvantages and deficiencies of the known devices. A semiconductor laser device in accordance with the present invention, comprises a multi-layered crystal structure containing an active layer for laser oscillation on a V-stripe channeled substrate, wherein regions by means of which carriers within said active layer are prevented from diffusing outside of said active layer are disposed facing each other with an optical waveguide therebetween which is formed by the absorption of light by the shoulder portions of the V-striped channel, the distance between said regions being narrower than the width of the V-striped channel in the vicinity of both facets and wider than the width of the V-striped channel inside of both facets, that means in the remaining part. The regions for preventing carriers from diffusing outside of said active layer are, in a preferred embodiment, composed of burying layers having a greater energy gap than said active layer. Thus, the invention described herein makes possible (1) a semiconductor laser device which oscillates at a low threshold current level; (2) a semiconductor laser device which does not create astigmatism; and (3) a semiconductor laser device which does not create a high-order transverse mode. The invention is described further hereinafter, by way of example, with reference to the accompanying drawings, in which: Figure 1(A) is a plane view showing a semiconductor laser device constructed in accordance with the present invention; Figures 1(B) and 1(C), respectively, are front sectional views on lines X₁-X₂ and Y₁-Y₂ in Figure 1(A); Figure 1(D) is a graph showing the carrier density distribution of a semiconductor laser device in accordance with this invention; Figures 2(A) and 2(B), respectively, are front sectional views showing a conventional BH laser device and a conventional VSIS laser device; and Figure 3 is a graph showing the carrier density distribution of the conventional VSIS laser device shown in Figure 2(B). A VSIS semiconductor laser device in accordance with the present invention contains regions by means of which carriers within the active layer are prevented from diffusing outside of the waveguide. The distance between said regions is narrower than the width of the V-channel in the vicinity of both facets of the device and wider than the width of the V-channel inside of both facets, that means in the remaining part. Figures 1(A), 1(B) and 1(C) show a semiconductor laser device of this invention, which comprises a p-GaAs substrate 1, an n-GaAs current blocking layer 6, a p-GaAlAs cladding layer 2, a GaAlAs active layer 3, an n-GaAlAs cladding layer 4, and an n-GaAs cap layer 5 in that order. This device has a V-striped channel 7 having a width W in the center of the substrate 1 in such a manner that the channel 7 reaches the substrate 1 through the current blocking layer 6. Buried regions 100 indicated by the shaded areas are disposed facing each other with the V-striped channel 7 therebetween. The distance therebetween is W₁ in the vicinity of both facets 20 of the device and W₂ inside of the facets 20, wherein W₁<W<W₂. Each of the buried regions 100 is composed of a p-GaAlAs burying layer 8, an n-GaAlAs burying layer 9 and an n-GaAs burying layer 10, which are positioned in that order on the current blocking layer 6 outside of the V-channel 7 . The AlAs mole fraction (i.e., x ) in each of the Ga₁- x Al x As burying layers 8 and 9 is larger than that of the active layer 3. Reference numerals 11 and 12 identify an n-sided electrode and a p-sided electrode, respectively. Light from the active layer 3 is absorbed by the current blocking layer 6 , resulting in an index-optical waveguide within the active layer 3 according to VSIS laser operation theory, so that the width of the optical waveguide becomes equal to the width W of the V-striped channel 7 . Carrier within the active layer 3 is prevented from diffusing by the burying layers 8 and 9 , and the carrier density distributions shown in Figure 1(D) are exhibited, wherein curve ℓ₁ is the distribution in the vicinity of the facets and curve ℓ₂ is the distribution inside of the facets, indicating that unusable carrier of said VSIS laser device of this invention shown by the shaded areas is remarkably smaller than that of the conventional VSIS laser device shown in Figure 3 , resulting in a remarkable decrease in the oscillation threshold current level. As shown in Figure 1(C) , the VSIS laser device of this invention has the same index waveguide as a BH laser device, and accordingly, astigmatism does not occur. Moreover, as shown in Figure 1(B) , the optical waveguide is formed according to VSIS laser operation theory, and thus a high-order transverse mode does not occur. Therefore, this VSIS laser device is also advantageous in that the width W₁ of the waveguide in the vicinity of the facets 20 can be set at a wider value than that of a conventional BH laser device, and the optical density in the vicinity of the facets can be maintained at a low level. By way of example only, the semiconductor laser device of this invention shown in Figures 1(A) to 1(C) can be produced using a GaAs/GaAlAs compound semiconductor, as follows: On the (100) face of a p-GaAs substrate 1 , an n-GaAs current blocking layer 6 having a thickness of 0.8 µm is epitaxially grown. Then, a V-striped channel 7 having a depth of 1.2 µm and a width (W) of 5 µm is formed in the substrate through the current blocking layer 6 by photolithography and a chemical etching technique, resulting in a current path. Then, on the current blocking layer 6 including the V-channel 7 , a p-Ga 0.7 Al 0.3 As cladding layer 2, a p-Ga 0.95 Al 0.05 As active layer 3, an n-Ga 0.7 Al 0.3 As cladding layer 4, and an n-GaAs cap layer 5 are successively formed by liquid phase epitaxy, resulting in a double-heterostructure multi-layered crystal for laser oscillation. Then, grooves are formed on both sides of the V-channel 7 from the cap layer 5 to the current blocking layer 6, as indicated by the shaded parts shown in Figure 1(A), by a reactive ion etching technique. The distance W₁ between the grooves in the vicinity of the facets 20 is 4 µm and the width W₂ therebetween inside of the facets 20 is 7 µm. Then, the grooves are filled with a p-Ga 0.8 Al 0.2 As burying layer 8, an n-Ga 0.8 Al 0.2 As burying layer 9, and an n-GaAs burying layer 10, which are successively formed by liquid phase epitaxy. Since the burying layers 8 and 9 have a greater energy gap than the active layer 3, they can prevent carrier from diffusing to the outside thereof. Then, the upper face of each of the n-GaAs cap layer 5 and the n-GaAs burying layer 10 and the back face of the p-GaAs substrate 1 are subjected to a vapor deposition treatment with metal materials of Au-Ge and Au-Zn, respectively, and subjected to a heating treatment to form an n-sided electrode 11 of an alloy of Au-Ge and a p-sided electrode 12 of an alloy of Au-Zn, respectively, followed by cleaving to form a Fabry-Pérot resonator having an internal cavity length of 250 µm. Then, the resonator is mounted on a copper plate by means of a soldering material such as In in such a manner that the face of the n-sided electrode 11 faces the copper plate, resulting in a semiconductor laser device unit in accordance with this invention. A semiconductor laser device made as above oscillated with a wavelength of 820 nm at a threshold current of as low as about 15 mA. The beam waist in the junction direction was in accord with that in the direction perpendicular to the junction direction and these beam waists were positioned at each of the facets, so that no astigmatism could be observed. The laser device attained continuous laser oscillation in a stabilized fundamental transverse mode at an optical output of 30 mW or more. The semiconductor laser device of this invention is not limited to the GaAs/GaAlAs system, but is applicable to other heterostructure semiconductor materials such as the InP/InGaAsP system, etc. As a growth method for the growth of semiconductor layers, not only liquid phase epitaxy, but also metal organic-chemical vapor deposition (MO-CVD), vapor phase epitaxy (VPE), molecular beam epitaxy (MBE), etc., can be used.

Claims: A semiconductor laser device comprising a multilayered crystal structure containing an active layer (3) for laser oscillation on a V-stripe channeled substrate (1), characterised in that regions (100) by means of which carriers within said active layer (3) are prevented from diffusing outside of said active layer are disposed facing each other with an optical waveguide (W) therebetween which is formed by the absorption of light by the shoulder portions of the V-striped channel (7), the distance between said regions (100) being narrower (W₁) than the width of the V-striped channel (W) in the vicinity of both facets and wider (W₂) than the width of the V-striped channel (W) in the remaining part. A semiconductor laser device as claimed in claim 1, wherein said regions (100) for preventing carriers from diffusing outside of said active layer are composed of burying layers (8) having a greater energy gap than said active layer (3).

Inventors: MAEI, SHIGEKI, MIYAUCHI, NOBUYUKI, MORIMOTO, TAIJI, YAMAMOTO, SABURO
Applicants: SHARP KABUSHIKI KAISHA
Application year: 1986
Main classification: H01S3
IPC codes: H01S5