MECHANICAL PART MOUNTING CHASSIS

Abstract: This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread on the substrate surface.

Description: BACKGROUND OF THE INVENTION Field of the Invention This invention relates to a mechanical part mounting chassis and a method for manufacturing thereof, and is particularly concerned with the mechanical part mounting chassis preferable for mounting mechanical parts in electric products such as household electric appliances, OA equipment and the like which are intended for public welfare. Description of the Prior Art As disclosed in U.S. Patent No. 4,445,159 and Japanese Patent Publication No. 9934/1982, a conventional mechanical part mounting chassis is functional as a base board for mounting mechanical parts thereon, however, the situation is such that electric wiring and lighting means are disposed in the product independently of each other, each occupying its own space. Then, a portion using optical signals such as light emitting element, flashlight lamp and the like as the lighting means involves an electric circuit, wires and other components which are incidental thereto, which greatly hinders miniaturization and weight reduction. A chassis according to the first part of claim 1 is described in GB-A-2 000 913. This chassis also fulfils the functions of a circuit board and serves for mechanical and electrical purposes. Moving mechanical components need position sensors. Conventionally, these sensors are switches or optical sensors which are arranged close to the mechanical components. Therefore, a long wiring is required and the assembly work has to be carried out by hand resulting in high production costs and a poor reliability. SUMMARY OF THE INVENTION It is therefore an object of the invention to provide a chassis which is cost effective in production, reliable in operation and allows to minimize the size of an apparatus comprising electronic and mechanic parts. Further it is an object of the invention to provide a cost-saving method of manufacturing the chassis. This object is solved by the chassis according to claim 1 and the manufacturing method of claim 6. A preferred embodiment is a chassis for a magnetic recording apparatus. That is, a magnetic recording apparatus wherein an electric circuit for driving or controlling each mechanism or the optical circuit, and further a control panel, a display panel or a lighting means to each mechanical part are provided in addition on a substrate mounted with a magnetic recording medium, a mechanical part for driving the medium, and a magnetic head scanning the mechanical part for recording a signal and reading the recorded signal. The optical circuit constituting a part of the lighting means is buried in the substrate and/or kept creeping on the substrate surface. Each of the embodiments comprises, in short, integrated circuits with a base on which mechanical parts are mounted. However, the circuits in the product need not all be integrated. A configuration in which only some of the circuits are integrated may also be constructed, or the chassis itself can be divided, or a plurality of chassis can be combined. (Substrate) Since the structure is rigid, it is desirable that a metallic plate, a compound molding, i.e. outsert molding, of a metallic plate and resin, a resin board, wherein a metal piece is buried in the resin board, i.e. insert molding, a ceramic plate and the like is used for the substrate. In particular, the outsert molding, resin board and insert molding are practical. Further, it is desirable that a printed circuit board or a photowave guide itself be applied to the substrate. In this case, a material and a shape, chiefly thickness, will be selected preferably for the substrate in consideration of rigidity. Further, reinforcement of these circuit boards with another substrate (through buildup or insertion) is within the scope of this invention. The conception of the chassis in the invention also implies a casing (provided with a chassis function inside) for the product itself. (Circuit) The circuit implies at least either an electric circuit or optical circuit. A means for providing the circuit additionally on the substrate comprises burying, for example, all or a part of electric wire and an optical fiber in a resinous substrate. If the circuit is a printed circuit or a photowave guide type, then the substrate itself can be applied to these circuit boards as described above, or the circuit boards can be built upon the substrate surface (that is, the substrate working as a circuit at the same time can be reinforced by building up another plate-like member thereon.) For a printed circuit board, the circuit portion consists of a continuity through hole and a printed circuit. The circuit is formed through a normal process such as, for example, pattern chemical plating, full-additive process, panel chemical plating, electroplating, chemical/electric plating. A material with clear optical path will be selected for the photowave guide and the optical fiber, and particularly resin is preferable for molding and strength. Further, the electric and optical circuit can be formed on the same plane or stacked one upon the other. In the latter case, it is particularly convenient when a film optical circuit is built upon the electric circuit. Further, the invention can be embodied by designing the electric circuit to work partly as an optical circuit. Then, the optical fiber is capable of using that of glass, quartz or resin. (Resin Component) The resin component includes a clear portion to allow the light to pass. In this case, it is desirable that the optical path portion and portions for the mechanical part and the mechanical part mounting part be formed solidly of a clear resin or that the optical path portion and those for the mechanical part and the mechanical part mounting part be formed of a different resin each. Further, it is convenient that each part be fixed through a part mounting (fixing) hole within the substrate plane by means of a collar larger than the diameter of the hole. (Resin) If the substrate is made of resin, then the resin will be selected preferably from among those in which a macromolecule having a glass transition temperature of 80°C or higher is a principal component, or at least one kind of macromolecular material selected particularly from a group comprising polycarbonate, polysulfone and polyacrylate or a compound material for which an inorganic matter is compounded thereto. A resin in which a macromolecule having a glass transition temperature of 80°C or higher will be preferable for the resin component where a printed circuit board is utilized for the substrate or outsert molding is employed, and particularly polycarbonate, acrylonitrile-styrene copolymer, polysulfone, polyacrylate will be utilized preferably. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1, Fig. 6, Fig. 7 and Fig. 16 are schematic plan views of a mechanical parts mounting chassis embodying the invention; Fig. 2, Fig. 3, Fig. 8, Fig. 12, Fig. 13, Fig. 14, Fig. 15 and Fig. 17 are schematic sectional views of a mechanical parts mounting chassis embodying the invention; Fig. 4 is a schematic sectional view representing a state wherein an electric part is combined with Fig. 3; Fig. 5 is a schematic plan view of a conventional mechanical parts mounting chassis; Fig. 9 is a schematic sectional view representing a state wherein an electric part is combined with Fig. 8; Fig. 10 is a characteristic drawing showing the relation between glass transition temperature and secular change of a resin component; Fig. 11 and Fig. 18 are mold sectional views representing a process for molding a mechanical part mounting chassis embodying the invention each. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Fig. 1 is a schematic plan view of a chassis for a video tape recorder which is given in one embodiment of this invention. A chassis 1 is made of resin. Two tape guide holes 2, a video head installing hole 3 and a driving capstan motor mounting hole 4 are perforated in the chassis 1. A reference numeral 5 denotes a position for mounting a driving capstan motor, and this portion protrudes from a surface of the chassis 1. A circumference 6 of the guide hole 2 also protrudes likewise from the surface of the chassis 1. Electric wiring 7 is arranged on the surface of the chassis 1. Where the electric wiring 7 is exposed on the chassis surface as illustrated, it is desirable that the circuit be covered with an insulating layer 8 as shown in Fig. 2. Fig. 2 is a schematic sectional view of a chassis for a video tape recorder. In the example, each electric wiring line 7 is covered with the insulating layer 8. A reference numeral 9 denotes a resin structural part given in one example. Fig. 3 represents another embodiment of the chassis for video tape recorder. In the example, each electric wiring line 7 is buried in the chassis 1 of resinous material. In the three examples given as above, a short wire 11 is sufficient enough to connect an electric part (video head 10 in Fig. 4) mounted on the chassis 1, thereby satisfying lightweight and miniaturization requirements. Further, since the wire 11 can be minimized in length, the wire can be kept from hindering an operation of each mechanical part. Then, the wire 11 is bundled to fixation, so that a space for lead-in to the electric circuit board can be saved. Fig. 5 is a schematic plan view of the inside of a display panel for indicating an operating state in a conventional magnetic recording apparatus. As will be apparent from the figure, a lighting mechanism including a plurality of flashlight lamps 12 is provided hitherto. Reference numerals 13 and 14 denote a light receiving element and a light emitting element respectively, both of which are signal generating means for checking the running state of a magnetic recording medium. Then, the flashlight lamp 12, light receiving element 13 and light emitting element 14 are employed as separate components in one product, so that an electric circuit 15 is formed also in a plural set accordingly. Consequently, such conventional construction inevitably allows a portion for lighting concern to occupy fairly a lot of space. Fig. 6 represents one example of a chassis (display panel for indicating an operating state in the magnetic recording apparatus) relating to a mode of operation of the invention for removing the above-mentioned defect. As illustrated, an optical circuit 17 is disposed on the surface of the chassis 1. A reference numeral 16 denotes a light source, and the said light source can be limited to a single component according to the embodiment, thereby eliminating the need for multiple components of electric circuits and flashlight lamps. The example is effective subsidiarily in decreasing a working power from retrenching the light source and others. Fig. 7 is a plan view of a mode of operation wherein the electric circuit formed of the wire 11 is formed integrally with resin so as to be buried internally with only a connection terminal 18 exposed, and Fig. 8 is a sectional view thereof. This can be so formed by pouring a fused resin in a mold with the wire 11 fixed therein. In this case, the electric circuit is not only formed concurrently but also strengthened by the wire 11, therefore strength and rigidity of the base will be enhanced. Further, since the wire has a lower coefficient of thermal expansion than resin, dimensional variation due to temperature can be reduced. In this case, as shown in Fig. 9, a part of the wire is exposed near the electric part (video head), which can be connected otherwise through the short wire 11. If an optical fiber is buried instead of all or a part of the wire 11 in each example described above, an optical signal or both electrical and optical signals can be transmitted. The use of glass and quartz for the optical fiber may ensure a similar strengthening effect as in the case of the above-mentioned wire. For a magnetic recording apparatus, the internal temperature during most operation may rise as high as 60°C, or up to 70°C during recording and tracking; therefore, if the glass transition temperature of the macromolecule which is a principal component of resin is lower than that, then it becomes rubbery, so that dimensional accuracy of the base deteriorates. Now, if maximum temperature rise is taken into consideration, a tolerance of about 10°C will be necessary. That is, it is desirable that a resin in which a macromolecule with a glass transition temperature of 80°C or higher is a principal component. The higher the glass transition temperature, the better the dimensional stability results. Fig. 10 shows the relation between glass transition temperature Tg and secular change δ of the macromolecule working as a principal component of the resin. Here, the secular change is indicated by the difference between the flatness of a plate 100 mm long, 50 mm wide and 3 mm thick extruded and then heated at 70°C for 960 hours continuously and the flatness of that plate before heating. As will be apparent from the figure, that of glass transition temperature Tg 70°C or below results in a large physical change; therefore, Tg exceeding 70°C will be preferable. Then, an alphabetical symbol given to each point in the figure denotes the kind of material. That is, A represents nylon 6, B represents polyacetal, C represents polypropylene, D represents polymethyl methacrylate, E represents acrylonitrile-styrene copolymer, F represents polystyrene, G represents polycarbonate, H represents polysulfone, and I represents polyallylate. Then, the drawing shows that for which glass fiber is not blended and that for which glass fiber is blended at 30% by weight. From the figure, it is understood that a small physical change ensues particularly from polycarbonate, polysulfone and polyallylate, and the small physical change may further be secured from blending glass fiber therewith. Then, a symbol O indicates that for which glass fiber is not blended, and another symbol · indicates that for which glass fiber is blended. Fig. 11 is a mold sectional view indicating a process for unifying a circuit with the chassis. For forming the electric circuit and the chassis integrally, a through hole 21 other than a hole 20 is provided on a printed circuit board 19 with the electric circuit formed thereon in such manner as will not cut the electric circuit. First, the printed circuit board 19 is fixed in a metal mold 22, a resin is poured therein from a gate 23 through a runner 24, and the resin structural part 9 is formed on both sides of the printed circuit board 19 through the hole 21. The resin structural part 9 has a collar 25, and the collar is larger than a diameter of the through hole 21. Each resin structural part 9 is fixed on the printed circuit board 19 through the collar 25. Then, Fig. 11 shows the state wherein the resin is on the way to flowing into the metal mold, and thus the resin has not yet flowed perfectly in a cavity 26. In the example, if the electric circuit is exposed on the chassis surface, then it will preferably be covered with an insulating layer as described hereinbefore, however, it is also useful to have the runner 24 spread along the circuit. According to the method, the connecting wire 11 coming out of the electric part can be soldered to the through hole 20 plated with a metal therein to conductivity and thus connected to the printed circuit board 19 through a conductive paste or other means. Here, a multi-layer printed circuit board can also be used as the printed circuit board 19. In each example described as above, since the electric part (motor, solenoid or the like) on the chassis and the electric circuit are kept close to each other, the wiring can be held to a minimum. Accordingly, the size and weight of the finished product are reduced, thereby satisfying miniaturization and lightweight requirements. Further, as shown in Fig. 12 to Fig. 14, when a clear resin is used, it works not only as a mere resin structural part but also as a prism, lens and the like at the same time. That is, a reference numeral 27 denotes an optical circuit provided with a prism and lens in each figure. According to the example of each figure, the electric circuit and the optical circuit can be formed integrally. Then, a broken line and an arrow in the figures indicate the direction in which the light is transmitted. Further, after forming the resin structural part with an opaque resin, the optical circuit part can be formed with a clear resin and vice versa. Strength and rigidity are required for the resin structural part 9, and transmissivity is required for the optical circuit 27, therefore there may be a case where the resin must be selected so as to meet that purpose. In this case, it is desirable that a resin with a macromolecular glass transition temperature of 80°C or higher is a principal component as described hereinbefore. Further, a clear resin with a glass transition temperature of 80°C or higher includes, as shown in Fig. 10, polycarbonate, acrylonitrile-styrene copolymer, polystyrene, polymethyl methacrylate, however, it is desirable that polycarbonate, acrylonitrile-styrene copolymer be used particularly for physical change. As another embodiment of this invention, there is a mode wherein a film 28 forming an optical circuit thereon is built on the printed circuit board 19 shown in Fig. 15 and Fig. 16, and the through hole 21 is perforated so as not to cut the electric circuit and the optical circuit. As in the case of Fig. 11, the resin structural part 9 and the collar 25 are formed in this case. The film 28 comprises a core 29 through which the light is transmitted and a clad 30 other than that. In each example given as above, a chassis that is superior in both strength and rigidity to that of only paper phenol and glass-epoxy substrates will be obtainable from using the printed circuit board in which an iron core is incorporated. Then, in the example of Fig. 15 and Fig. 16, in which a macromolecule having a glass transition temperature of 80°C or higher is a principal component is preferable as a plastic for forming the resin structural part 9, and particularly polycarbonate, polysulfone and polyacrylate will serve well as described hereinbefore. Further, Fig. 17 represents another embodiment, wherein a flexible printed board 32 and the optical circuit film 28 are built up sequentially on a metallic substrate 31, and the resin structural part is fixed by the through hole 21 and the collar 25. In the example, the runner 24 is removed, and each resin structural part 9 is almost symmetrical on a central axis of the through hole 21. Since the runner 24 is removed, deformation of the substrate due to residual thermal stress of the resin molding is minimized, so that the chassis can be made slimmer. The manufacturing process then comprises, as shown in Fig. 18 for example, building up the flexible printed board 32 and the optical circuit film 28 sequentially on the metallic substrate 31, fixing them with a guide pin 33, and pouring a resin in the mold. It is difficult, due to space limitations, to install an electrical sensor for ensuring and controlling the position of a magnetic recording medium; however, an optical circuit will make it possible to ensure and control reasonably simply by providing a light receiving element. Accordingly, the recording precision of the apparatus can be enhanced, and recording density can also be improved.

Claims: A chassis (1) for mounting mechanical parts, including a substrate (1, 19, 31) which comprises an electrical circuit (7, 11, 19, 32), and a resin structural part (9, 25) formed integrally with said substrate (1, 19, 31) and constituting means for mounting said mechanical parts, characterized in that said structural part (9, 25) includes a transparent portion (17, 27, 29) serving as a light guide of an optical circuit (13, 16, 17, 27-30). A chassis according to claim 1, wherein said substrate (1, 19, 31) is a printed circuit board (19) reinforced by a plate-like member (31). A chassis according to claim 1 or 2, wherein said chassis is a compound molding of a metallic element (11, 31) and a resin (1, 28, 32). A chassis according to any one of claims 1 to 3, wherein said chassis is made of a resin, the light guide (17, 27, 29) consisting of a transparent resin. A chassis according to any one of claims 1 to 4, wherein means (5) for driving a recording medium, and means (10) for reading a signal recorded on said recording medium are mounted thereon. A method for manufacturing a chassis (1) for mounting mechanical parts, comprising the steps of positioning a substrate (1, 19, 31) in a mold (22), said substrate comprising an electrical circuit (7, 11, 19, 32); and pouring a resin into the mold (22) to form a resin structural part (9, 25) constituting mounting means for said mechanical parts, wherein said structural part includes a portion made of a transparent resin (17, 27, 29) and serving as a light guide of an optical circuit (13, 16, 17, 27-30). The method of claim, 6, wherein said substrate (1, 19, 31) is a printed circuit board (19) and reinforced by a plate-like member (31).

Inventors: ASANO, HIDEKI, EGUCHI, SHUJI, MIHARA, YOSHIMITSU, NARUSAWA, TUNEO, NEMOTO, MASANORI, OKABE, YOSHIAKI, TAKADA, YUKIHIKO, TAKETANI, NORIAKI, TANNO, SEIKICHI
Applicants: HITACHI, LTD.
Application year: 1985
Main classification: H05K3
IPC codes: G11B33, H05K3, G02B6, H05K1, H05K7