BURIED-GATE STRUCTURE-TYPE SEMICONDUCTOR SWITCHING DEVICE

Abstract: In manufacturing a GTO, a silicon wafer is cut away along one of the crystal planes indicated by (n11) in Miller indices, and the burried gate or the current channels are so arranged on the crystal plane that at least one longitudinal direction thereof is substantially in parallel with at least one of axes indicated by <2nn> on condition that the inner product of the plane vector and the axis vector is zero. In the GTO thus manufactured, it is possible to minimize the crystal defect density on the crystal plane and thus to realize the GTOs having uniform turned-on voltage, in particular, while increasing the controllable current markedly.

Description: Field of the Invention The present invention relates to a buried-gate structure-type semiconductor switching device and more specifically to a gate turn-off thyristor of buried gate structure type, which can increase the controllable current (a current flowing between the anode and the cathode) and make uniform the turned-on voltage (a voltage drop between the anode and the cathode). Description of the Prior Art In recent years, gate turn-off thyristors (referred to as GTO hereinafter) have widely been used in place of ordinary thyristors. This is because the GTOs can be turned off without use of any turning-off circuits including at least one inductor. Additionally, the GTO is high in efficiency and small in size, and further can control a high voltage and a large current as an excellent switching element. The above GTO can roughly be classified into two groups of surface gate type and buried gate type on the basis of the gate structure. In the surface gate GTO, since plural complicatedly-shaped gate electrodes are formed being exposed on the device surface, it is rather difficult to reliably realize a miniaturized gate structure in dependence upon the present manufacturing technique. In contrast with this, in the buried gate GTO, since a high-concentration diffusion layer used as gate is formed being buried in a semiconductor layer and further covered by another expitaxially-formed layer (called buried gate), it is relatively easy to reliably realize a miniaturized gate structure. The reason why the miniaturized gate structure is required is as follows: when the impurity atom concentration in the expitaxially formed layer is reduced, since it is possible to markedly increase the break-down voltage at the gate-cathode junction, it is possible to improve the turn-off characteristics of the GTO by applying a relatively high reverse voltage between the gate and the cathode. To further improve the turn-off characteristics, it is preferable to miniaturize the gate structure for allowing the gate current to uniformly flow through the low-resistance gate layer. In the buried gate GTO, it is further well known that when the impurity atom concentration of the diffusion layer is increased but the whole electric gate sheet resistance (determined by the total amount of dopants) is reduced to decrease the resistance of the buried gate, it is possible to obtain a large gate current, that is, to improve the turn-off characteristics of the GTO. However, in the case where the electric gate resistance is excessively reduced, there exists a problem in that crystal defects readily occur in accordance with the high concentration diffusion layer. Since these crystal defects shorten the lifetime of the minority carriers in the N-type and the P-type semiconductor layers, there exists a problem in that the GTO characteristics inevitably disperse within the device and/or among the devices. FR-A-2 299 727 shows a buried gate GTO of this type, in which the current channels of the control layer are arranged in accordance with a grid, in parallel lines, in radial lines, in concentric circus, in spiral lines or in more complex patterns. It is emphasized in this document that the surface of the holes should preferably be at least one third of the total surface of the grid and of the holes. In our patent EP-B-0 174 438, a semiconductor switching device is proposed, wherein the three semiconductor layers are parallel to a crystal plane indicated by {100} in Miller indices, and the current channels of the control layer are parallel to one or more of the crystal axes indicated by 〈100〉 in Miller indices, on the condition that the inner product of the crystal axis vector and the vector direction of the crystal plane is zero. With these problems in mind, therefore, it is the primary object of the present invention to provide a semiconductor device or a gate turn-off thyristor in which the current channels formed between the high impurity atom concentration diffusion layers are so arranged that the influence of crystal defects upon GTO characteristics can be minimized in dependence upon the fact that the crystal defects distribute in certain directions crystallographically, in particular, in the first N-type semiconductor layer. To achieve the above-mentioned object, the invention relates to a semiconductor as defined in claim 1, and more particularly a gate turn-off thyristor as defined in claim 6. The invention further relates to a method for manufacturing a gate turn-off thyristor as defined in claim 10. having an exposed crystal plane indicated by {n11} in Miller indices; (b) diffusing impurity atoms on both the exposed surfaces of the prepared semiconductor wafer to form a first semiconductor layer P₁ and a second semiconductor layer P₂ in accordance with diffusion method; (c) forming a pattern mask on the second semiconductor layer P₂ to form a buried gate P₂⁺⁺ and current channels CH in accordance with photo engraving process in such a way that at least one longitudinal direction of current channels CH formed between the buried gate layers P₂⁺⁺ is arranged substantially in parallel with at least one of crystal axes indicated by 〈2nn〉 on the crystal plane indicated by {n11} on condition that inner product of a specific crystal plane vector and a specific crystal axis vector is zero before forming a third semiconductor layer P₂⁻ and a fourth semiconductor layer N₂. BRIEF DESCRIPTION OF THE DRAWING The features and advantages of the semiconductor device or the gate turn-off thyristor according to the present invention over the prior-art gate turn-off thyristor will be more clearly appreciated from the following description of the preferred embodiments of the invention taken in conjunction with the accompanying drawings in which like reference symbols designate the same or similar elements or sections throughout the figures thereof and in which: Fig. 1 is a diagrammatical cross-sectional view showing a typical prior-art buried gate GTO; Fig. 2 is a graphical representation showing the relationship between the defect density in the first N-type layer N₁ and the lifetime of minority carrier in the same layer N₁, gold being diffused in the layer N₁ as lifetime shortening substance in the prior-art GTO; Fig. 3 is a graphical representation showing the relationship between the defect density in the first N-type layer N₁ and the turned-on voltage (a voltage drop between anode and cathode), gold being diffused in the layer N₁ as lifetime shortening substance in the prior-art GTO; Fig. 4 is a diagrammatical plane view when seen from the anode side, which shows the distribution of crystal defects in the prior-art GTO; Fig. 5 is a plan view showing the structure of current channels CH radially arranged between the high concentration diffusion layers P₂⁺⁺ in the prior-art GTO; Fig. 6 is a plan view showing the structure of current channels CH arranged in parallel with each other between the high concentration diffusion layers P₂⁺⁺ in a first embodiment of the GTO according to the present invention; Fig. 7 is a graphical representation showing the relationship between the anode current and the turned-on voltage (a voltage drop between the anode and the cathode) in the form of dispersion range, in which the range defined by the dotted line curves A and C indicates the dispersion obtained in the prior-art GTO and the range defined by the solid line curves A and B indicates the dispersion obtained in the first embodiment of the GTO according to the present invention; Fig. 8 is a plan view showing the structure of current channels CH arranged partially in parallel with each other between the high concentration diffusion layers P₂⁺⁺ in a second embodiment of the GTO according to the present invention; Fig. 9 is a plan view showing the structure of current channels CH arranged in parallel with each other between the high concentration diffusion layers P₂⁺⁺ in a third embodiment of the GTO according to the present invention; and Figs. 10(A) to 10(D) are illustrations for assistance in explaining the manufacturing steps of a gate turn-off thyristor including four PNPN semiconductor layers of buried low-resistance layer type according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS To facilitate understanding of the present invention, a reference will be made to a prior-art GTO of buried gate type, by way of example, with reference to the attached drawings. Fig. 1 is a cross-sectional view of a typical prior-art disc-shaped GTO including four PNPN semiconductor layers of buried low electric resistance layer type. The GTO includes an anode electrode A, a cathode electrode K and a gate electrode G. The four PNPN semiconductor layers are a first P-type layer P₁ formed in contact with the anode electrode A, a first N-type layer N₁ formed in contact with the first P-type layer P₁, a second P-type layer P₂, P₂⁻ formed in contact with the first N-type layer N₁ and the gate electrode G, and a second N-type layer N₂ formed in the second P-type layer P₂⁻ in contact with the cathode electrode K. The second P-type layer P₂, P₂⁻ includes a medium impurity atom concentration P-type layer P₂ formed in contact with the first N-type layer N₁, a low impurity atom concentration (high electric resistance) layer P₂⁻ in contact with the gate electrode G and the second N-type layer N₂, and a high impurity atom concentration (low electric resistance) layer P₂⁺⁺ radially arranged and buried in the medium concentration layer P₂ and under the low concentration layer P₂⁻. Further, as best seen in Fig. 5, a plurality of current channels CH are formed between the high concentration (low resistance) layers P₂⁺⁺. The turn-on and turn-off operations of the GTO of buried gate type will be described hereinbelow. When a gating voltage is applied to turn on the GTO between the gate electrode G and the cathode electrode K (G: positive; K: negative) under the condition that a forward bias voltage is applied between the anode electrode A and the cathode electrode K, the gate current flows from the gate electrode G to the cathode electrode K by way of the high resistance layer P₂⁻, the low resistance layer P₂⁺⁺, and the high resistance layer P₂⁻. Since electrons flow from the cathode electrode K to the gate electrode G, some electrons transfer from the cathode electrode K to the anode electrode A through the low resistance layer P₂⁺⁺ in order to turn on the GTO. When the GTO is turned on, GTO current flows from the anode electrode A to the cathode electrode K through the current channels CH formed between the low-resistance layers P₂⁺⁺ of miniaturized structure. In contrast with this, when a reverse gating voltage is applied to turn off the GTO between the gate electrode G and the cathode electrode K (G: negative; K: positive) under the condition that an anode current flows from the anode A to the cathode K, the reverse gate current flows from the cathode electrode K to the gate electrode G by way of the high resistance layer P₂⁻, the low resistance layer P₂⁺⁺, and the high resistance layer P₂⁻. Since electrons flow from the gate electrode G to the cathode electrode K, electrons flowing from the cathode electrode K to the anode electrode A are reduced in order to turn off the GTO. In the GTO as described above, when the impurity atom concentration in the expitaxial layer P₂⁻ is reduced, since it is possible to markedly increase the break-down voltage at the gate-cathode junction, it is possible to improve the turn-off characteristics of the GTO by applying a relatively high reverse voltage between the gate G and the cathode K. To further improve the turn-off characteristics, it is preferable to minimize the gate structure P₂⁺⁺ and CH. In the buried gate GTO, it is further well known that when the impurity atom concentration of the diffusion layer (low resistance layer) P₂⁺⁺ is increased but the layer resistance determined by the total amount of dope is reduced to decrease the electric resistance of the whole buried gate P₂⁺⁺, it is possible to obtain a large gate current, that is, to improve the turn-off characteristics of the GTO. However, in the case where the whole gate resistance is excessively reduced, there exists a problem in that crystal defects readily occur in accordance with the high concentration diffusion layer P₂⁺⁺. Since these defects shorten the lifetime of the minority carriers in the N-type and the P-type semiconductor layers N₁ and P₂, the GTO characteristics inevitably disperse within the devices and/or among the devices. Experiments indicate that crystal defects extending into the first N-type layer N₁ exert a serious influence upon the GTO characteristics. Fig. 2 shows the relationship between the crystal defect density in the first N-type layer N₁ and the lifetime of the minority carrier in the layer N₁. This graphical representation indicates that the higher the defect density, the shorter the lifetime of the minority carrier. Fig. 3 shows the relationship between the crystal defect density in the first N-type layer N₁ and the turn-on voltage developed between the anode and the cathode when the GTO is being turned on. This graphical representation indicates that the higher the defect density, the higher the turned-on voltage. Further, in the samples used for the above experiments, gold serving as a lifetime shortening substance is diffused at 760°C for one hour with respect to Fig. 2 and at 800°C for 30 minutes with respect to Fig. 3. The current density J is 350A/cm² in both. Here, the current density J can be defined as I/S, where I denotes the current flowing between the anode A and the cathode K; S denotes the effective cathode area (the sum total of the current channel areas). The crystal defect distribution in the GTO will be described hereinbelow. In the following description, braces { } denotes a generic crystal plane; angle brackets 〈 〉 denotes a generic crystal axis; round parentheses ( ) denotes a specific crystal plane; square brackets [ ] denotes a specific crystal axis, all being defined in accordance with Miller indices. Fig. 4 shows the crystal defect distribution of a buried gate GTO, when seen from the anode A side. The silicon wafer WA shown in Fig. 4 is cut along a specific crystal plane (111). In the drawing, the shaded portions indicates areas having a higher defect dencity as compared with portions other than the shaded areas. These defective portions can be obtained by taking only the N-type layer N₁ from the GTO and by emphasizing the defective areas by use of an etching agent such as Sirtl liquid (Trade Mark), for instance. Fig. 4 indicates that there exists a regularity with respect to the crystal defect distribution, that is, the areas having a higher defect density appear at angular intervals of 60 degrees or in the three directions indicated by [01 1 ], [1 1 0] and [ 1 01]. In an orthogonal coordinates, when a first vector A has components (a x , a y , a z ) and a second vector B has components (b x , b y , b z ), the inner product of both the vectors A and B can be expressed as A . B = a x .b x + a y .b y + a z b z Cos ϑ = A . B / | A | . | B | where | A | and | B | denote absolute values of the vectors and ϑ denotes an angle subtended by two vectors A and B. In Fig. 4, since the inner products of the three axes vector and the plane vector are all zero as follows: (1) x (0) + (1) x (1) + (1) x (-1) = 0 (1) x (1) + (1) x (-1) + (1) x (0) = 0 (1) x (-1) + (1) x (0) + (1) x (1) = 0 Cos ϑ = A.B = 0 or ϑ = 90° This indicates the plane vector (111) is perpendicular to the axis vectors [01 1 ], [0 1 0] and [ 1 01] or that the three axis vectors lie on the plane. In these high crystal defect density areas, the crystal defects spread from the high atom concentration layer P₂⁺⁺ to the anode electrode A, in the direction of the depth of the first N-type layer N₁, penetrating through the layer N₁. Further, in the case where the current channels CH or the low-resistance layer P₂⁺⁺ is arranged radially as shown in Fig. 5, it should be noted that the longitudinal directions of the current channels CH match the distribution directions in the high crystal defect density areas at angular intervals of 60 degrees. In other words, the longitudinal directions of the current channels CH are in parallel or roughly in parallel with the distribution directions of the high defect density areas in some sectorial areas. The fact that there exist high defect density areas at angular intervals of 60 degrees is a peculiar phenomenon in the case where the current channels CH are arranged on the crystal plane indicated by (111). Further, it is also possible to state that: the fact that the crystal defects spread on the crystal plane (111) is peculiar to the crystal defects. Furthermore, since the defects in the first N-type layer N₁ are mostly caused by the defects developed in the high atom concentration layer P₂⁺⁺, the defects appear to a greater extent on the cathode side than on the anode side within the first N-type layer N₁. In the areas where the defects appear in the longitudinal direction of the first layer N₁, the defects also readily appear in the lateral direction thereof, a great number of defects distributing in all directions in the first layer N₁. Where there exist the above-mentioned crystal defects, since the lifetime of the minority carrier is reduced in the N-type layer N₁, there exists a problem in that the turned-on voltage (A-K voltage drop) increases and further the turn-on and/or turn-off characteristics are not uniform or disperse within the same device or among the devices. In particular, the controllable current flowing between the anode A and the cathode K decreases or changes in dependence upon the non-uniformity in device characteristics. Additionally, the above-mentioned crystal defect density is influenced by the manufacturing processes and/or the history of the semiconductor wafer. In view of the above description, reference is now made to a first embodiment of the GTO according to the present invention. Fig. 6 shows the arrangement of the current channels CH formed between the high impurity atom concentration layers P₂⁺⁺, when seen from the cathode K side. The surface is obtained by cutting a silicon wafer along a generic crystal plane indicated by {111} in Miller indices. Therefore, the generic plane {111} indicates all specific crystal planes such as (111); ( 1 11), (1 1 1), (11 1 ); ( 11 1), ( 1 1 1 ), (1 11 ); and ( 111 ). The longitudinal direction of the channels CH are arranged in parallel with a generic crystal axis indicated by 〈211〉 in Miller indices. The generic axis 〈211〉 indicates all specific axes such as [211], [121], [112]; [ 2 11], [ 1 21], [ 1 12]; [2 1 1], [1 2 1], [1 1 2]; [21 1 ], [12 1 ], [11 2 ]; [ 21 1], [ 2 1 1 ], [2 11 ]; [ 12 1], [ 1 2 1 ], [1 21 ]; [ 11 2], [ 1 1 2 ], [1 12 ]; [ 211 ], [ 121 ], [ 112 ]. However, as already explained, since the condition that the axes lie on the plane is as follows: Inner product of plane vector and axis vector = 0 It is impossible to select all the specific axes lying on the generic plane {111} from the generic axis 〈211〉. For instance, if {111} is (111) then 〈211〉 is [ 2 11], [1 2 1], [11 2 ], since all the inner products of both the vectors are zero as follows: (1) x (-2) + (1) x (1) + (1) x (1) = 0 (1) x (1) + (1) x (-2) + (1) x (1) = 0 (1) x (1) + (1) x (1) + (1) x (-2) = 0 it is possible to consider that the axes [ 2 11], [1 2 1], [11 2 ] all lie on the plane (111). Similarly, if {111} is ( 1 11) then 〈211〉 is [211]; [1 1 2], [12 1 ]; [ 12 1], [ 1 1 2 ]; [ 211 ], since all the inner products of both the vectors are zero as follows: (-1) x (2) + (1) (1) + (1) (1) = 0 (-1) x (1) + (1) (-1) + (1) (2) = 0 (-1) x (1) + (1) (2) + (1) (-1) = 0 (-1) x (-1) + (1) (-2) + (1) (1) = 0 (-1) x (-1) + (1) (1) + (1) (-2) = 0 (-1) x (-2) + (1) (-1) + (1) (-1) = 0 it is possible to consider that the above six axes all lie on the plane ( 1 11). In the same manner, if the generic plane is {011}, it is possible to select any desired specific axes lying on the generic plane {011} from the generic axis 〈200〉. For instance, the plane is (011) and the axis is [200]. Similarly, if the generic plane is {211}, it is possible to select any desired specific axes lying on the generic plane {211} from the generic axis 〈222〉. For instance, the plane is (211) and the axis is [ 2 22]. If the generic plane is {311}, it is possible to select any desired specific axes lying on the generic plane {311} from the generic axis 〈233〉. For instance, the plane is (311) and the axis is [ 2 33]. In summary, if the generic plane is {n11} (n=0, 1, 2, 3...), it is possible to select any desired specific axes lying on the generic plane {n11} from the generic axis 〈2nn〉 (n=0, 1, 2, 3, ...). The above-mentioned mutual relationship between the crystal planes {n11} and the crystal axes 〈2nn〉 has been found out on the basis of peculiar characteristics of defect density in crystal and in dependence upon a great number of experiments in order to minimize the occurrence of crystal defects. Fig. 7 is a graphical representation showing the relationship between the anode current and the turned-on voltage (a voltage drop between the anode and the cathode). The range defined by two solid line curves A and B indicates a dispersion range obtained by measuring the GTO according to the present invention, in which the current channels CH are arranged substantially in parallel with the generic axis 〈211〉 on a wafer cut away along the generic plane {111} as shown in Fig. 6. The range defined by two dotted line curves A and C indicates a dispersion range obtained by measuring the prior-art GTO, in which the current channels CH are arranged radially or roughly in parallel with three specific axes [01 1 ], [1 1 0] and [ 1 01] on a wafer cut away along the specific plane (111) as shown in Fig. 4. The number of GTO samples is 10 pieces, respectively. The graphical representation indicates that the dispersion range of the turned-on voltage in the GTO according to the present invention can be reduced to about 1/5 as compared with that in the prior-art GTO. Fig. 8 shows a second embodiment of the GTO according to the present invention, in which the current channels CH are arranged between the high impurity atom concentration layers P₂⁺⁺, when seen from the cathode K side. The wafer surface can be obtained by cutting a silicon crystal along the crystal plane {111} in generic expression. The channels are divided into six sections and the longitudinal directions of the channels CH are independently arranged in parallel with three axes of 〈211〉 being spaced at 60-degree angular intervals. One example of the above arrangement is as shown in Fig. 8: the crystal plane is (111); the first axis is [ 2 11]; the second axis is [1 2 1]; the third axis is [11 2 ], because the inner products of the plane vector (111) and the three axis vectors are zero, respectively. In this second embodiment, it is possible to improve the directional balance of the gate resistance on the wafer surface. Further, experiments indicate that it is possible to reduce the dispersion range of the turned-on voltage in the GTO to about 1/3 as compared with that in the prior-art GTO and additionally to increase the controllable current flowing between the anode and the cathode as much as 20 percent. Further, various observations have been made by emphasizing the defective areas by use of an etching agent, as already described hereinabove, in order to examine crystal defects in the first N-type layers N₁. The observations indicate that: in the case of the prior-art GTO in which the current channels CH are formed radially as shown in Fig. 5, a great number of crystal defects appear between the buried gate areas P₂⁺⁺ and further there exist differences in respective defect density between the devices. In contrast with this, in the case of the GTO in which the current channels CH are formed in three directions separately as shown in Fig. 8, a small number of defects appear between the buried gate areas (low-resistanced P-type layer) P₂⁺⁺. Fig. 9 shows a third embodiment of the GTO according to the present invention, in which the GTO is formed in square shape. In this embodiment, the crystal surface on which the buried gate P₂⁺⁺ is formed is obtained by cutting a silicon crystal along the crystal plane {111}, and the longitudinal direction of the current channels CH are arranged in parallel with the axis 〈211〉 similarly to the first embodiment shown in Fig. 6. The method of manufacturing the GTO according to the present invention will be described hereinbelow with reference to Figs. 10(A), (B), (C) and (D). The manufacturing steps are as follows: (1) Impurity atoms (e.g. gallium) are diffused on both the surfaces of a negative (N-type) silicon wafer cut away along one of a generic crystal plane {n11} by enclosed diffusion method in order to form a first P-type layer P₁ and a second P-type layer P₂. In the enclosed diffusion method, the silicon wafer and the gallium are enclosed within a quartz tube and then heated to an appropriate temperature at which the enclosed gallium can sufficiently diffused on both the surfaces of the silicon wafer. (2) A predetermining pattern mask of silicon oxide (SiO₂) is formed on the surface of the second P-type layer P₂ in accordance with photo engraving process and boron is selectively diffused on the layer P₂ at a relatively high impurity atom concentration rate in order to form the high concentration (low resistance) P-type layer P₂⁺⁺. In this step, the pattern mask corresponding to the current channels CH is formed so that the longitudinal directions of the pattern mask is substantially in parallel with at least one of the generic crystal axes 〈2nn〉 on the crystal plane {n11}. Further, in this step the specific crystal axes should be selected from the generic axes 〈2nn〉 so that the inner product of the crystal axis vector and the crystal plane vector is zero. (3) The lower impurity atom concentration (high resistance) P-type layer P₂⁻ is further formed on the low-resistance layer P₂⁺⁺ and the second layer P₂ in accordance with epitaxial growth method by which another silicon layer is grown on a silicon monocrystal in the same crystal orientation in vapor phase epitaxy. (4) another predetermined pattern mask of silicon oxide (SiO₂) is formed again on the surface of the lower concentration (high resistance) P-type layer P₂⁻ in accordance with photo engraving process and phosphorous (P) is selectively diffused on the surface of the layer P₂⁻ in order to form the second N-type layer N₂. (5) The anode electrode A, the cathode electrode K, and the gate electrode G are formed, respectively. The above embodiments have been described of the GTO in which the buried gate is formed in the second P-type layer P₂ as shown in Fig. 1. However, without being limited to these embodiments, it is possible to apply the concept of the present invention to the GTOs in which the buried gate is formed in the first N-type layer N₁. Further, it is possible to apply the present invention to various devices other than the GTOs, for instance, such as electrostatic induction type transistors, thyristors, or field effect transistors, etc. in which the crystal plane {n11} can be used and some controlling layers are formed within the device, in order to markedly reduce the serious influence of crystal defects upon the device characteristics. As described above, in the GTO according to the present invention, since the semiconductor wafer is cut away along the crystal plane {n11} and the current channels are so arranged as to be substantially in parallel with the axes 〈2nn〉 on condition that the inner product of the plane vector and the axis vector is zero, there exists an advantage such that it is possible to minimize crystal defect density on the crystal plane and thus to reduce the dispersion in the device characteristics as small as possible while increasing the controllable current markedly.

Claims: A semiconductor switching device having at least three consecutive semiconductor layers of alternating conductivity types formed substantially in parallel with a crystal plane indicated by {n11} in Miller indices, where n denotes 0, 1, 2, 3, ..., a high impurity atom concentration control layer (P₂⁺⁺) buried in one (P₂) of said at least three consecutive semiconductor layers; and a plurality of long and narrow current channels (CH) formed in said high impurity atom concentration control layer (P₂⁺⁺), an anode (A) and a cathode (K) being formed on either outer side of said at least three consecutive semiconductive layers, an anode current flowing from said anode (A) to said cathode (K) through said current channels (CH) being controlled by a control current flowing through said high impurity atom concentration control layer (P₂⁺⁺) in a direction substantially parallel to the crystal plane indicated by {n11}, characterized in that plural longitudinal directions of said current channels formed in said high impurity atom concentration control layer (P₂⁺⁺) are substantially in parallel with at least one of crystal axes indicated by 〈2nn〉 on a crystal plane indicated by {n11} in Miller indices, on the condition that the inner product of a crystal axis vector and a crystal plane vector is zero. The semiconductor switching device as set forth in claim 1, wherein said switching device is a gate turn-off thyristor. The semiconductor switching device as set forth in claim 1, wherein said switching device is a thyristor. The semiconductor switching device as set forth in claim 1, wherein said switching device is a static induction transistor. The semiconductor switching device as set forth in claim 1, wherein said switching device is an field effect transistor. A gate turn-off thyristor having four alternately different PNPN semiconductor layers formed substantially in parallel with a crystal plane indicated by an {n11} in Miller indices, where n denotes 0,1,2 ...., namely: (a) a first P-type layer P₁ having an anode; (b) a first N-type layer N₁ adjoining to the first P-type layer P₁; and (c) a second P-type layer including: a first impurity atom concentration layer P₂ adjoining the first N-type layer N₁; a second impurity atom concentration layer P₂⁻ adjoining the first impurity atom concentration layer P₂, a second concentration in the second impurity atom concentration layer P₂⁻ being lower than a first concentration in the first impurity atom concentration layer P₂; and a third low-resistance impurity atom concentration layer P₂⁺⁺ buried in the first impurity atom concentration layer P₂ and between the first and second layers P₂ and P₂⁻, current channels CH being formed in the third low resistance layer P₂⁺⁺; and (d) a second N-type layer N₂ formed in the second impurity atom concentration layer P₂⁻ and having a cathode characterized in that said third low-resistance impurity atom concentration layer P₂⁺⁺ is formed on a crystal plane indicated by {n11} in Miller indices and that the longitudinal directions of the current channels CH formed in the third low resistance layers P₂⁺⁺ are arranged substantially in parallel with at least one of the crystal axes indicated by 〈2nn〉 on the crystal plane {n11}, where n denotes 0,1,2,3,...., on the condition that the inner product of the crystal axis vector and the crystal plane vector is zero. The gate turn-off thyristor as set forth in claim 6, wherein said third low-resistance impurity atom concentration layer P₂⁺⁺ is formed on a generic silicon crystal plane indicated by {111} and the longitudinal directions of the current channels CH are arranged substantially in parallel with at least one of generic silicon crystal axes indicated by 〈211〉 on the generic silicon crystal plane {111}. The gate turn-off thyristor as set forth in claim 7, wherein said third low resistance impurity atom concentration layer P₂⁺⁺ is formed on a specific silicon crystal plane (111) and the longitudinal directions of the current channels CH are arranged substantially in parallel with one of specific silicon crystal axes indicated by [ 2 11], [1 2 1], [11 2 ] on the specific silicon crystal plane (111). The gate turn-off thyristor as set forth in claim 7, wherein said third low resistance impurity atom concentration layer P₂⁺⁺ is divided into six portions in a specific silicon crystal plane (111) and the longitudinal directions of triaxial current channels CH are arranged substantially in parallel with three specific silicon crystal axes indicated by [ 2 11], [1 2 1] and [11 2 ] on the specific silicon crystal plane (111), respectively. A method of manufacturing a gate turn-off thyristor, which comprises the following steps of: (a) preparing an N-type semiconductor wafer WA having an exposed crystal plane indicated by {n11} in Miller indices, where n denotes 0,1,2,3,.....; (b) diffusing impurity atoms on both the exposed surfaces of the prepared semiconductor wafer to form a first semiconductor P-type layer P₁ and a second semiconductor P-type layer P₂; (c) forming a pattern mask on the second semiconductor layer P₂ to form a P-type buried gate P₂⁺⁺ and current channels CH by a photo-engraving process in such a way that the longitudinal directions of the current channels CH formed in the buried gate layers P₂⁺⁺ are arranged substantially in parallel with at least one of the crystal axes indicated by 〈2nn〉 on the crystal plane indicated by {n11} on the condition that the inner product of a specific crystal plane vector and a specific crystal axis vector is zero; (d) diffusing impurity atoms on the second semiconductor layer P₂ through the formed pattern mask to form the P-type buried gate layers P₂⁺⁺ and the current channels CH; (e) forming a third semiconductor P-type layer P₂⁻ on the second semiconductor layer P₂ and the buried gate layer P₂⁺⁺ by an epitaxial growth method; (f) forming a pattern mask on the third semiconductor layer P₂⁻ to form a fourth semiconductor layer N₂; (g) diffusing impurity atoms on the third semiconductor layer P₂⁻ to form a fourth N-type semiconductor layer N₂; and (h) forming an anode electrode A on the first semiconductor layer P₁, a gate electrode G on the third semiconductor layer P₂⁻ and a cathode electrode K on the fourth semiconductor layer N₂.

Inventors: HAYASHI, YASUHIDE, KAWAMURA, TAKAYASU
Applicants: KABUSHIKI KAISHA MEIDENSHA
Application year: 1985
Main classification: H01L29
IPC codes: H01L29