RANDOM ACCESS MEMORY DEVICE FORMED ON A SEMICONDUCTOR SUBSTRATE HAVING AN ARRAY OF MEMORY CELLS DIVIDED IN SUB-ARRAYS

Abstract: A random access memory (DRAM) device formed on a semiconductor substrate having an array of memory cells (MC) which are divided in several sub-arrays (MCA 0 . . 3). The device has memory blocks each containing one of the subarrays, a word decoder (WD0 . .3) and column decoder (CD0 . .3). Each of the memory blocks (MC) is selected in­ dependently to perform an access operation and refresh operation. As long as different memory blocks (MC) are se­ lected for respective operations, the both operations are performed in paralle, however when the same memory block (MC) is selected for both operations, namely double selected, a comparison circuit (43) detects the double selec­ tion and the priority to one of both operations are determin­ ed and perform the operation selected preferentially. Usu­ ally, the refresh oriented operation is allowed. However, in order to decrease 'busy ratio' of the device, the refresh ac­ cess operations is performed preferentially. Further compli­ cated operation for priority selection, is performed accord­ ing to a predetermined schedule memorized in a priority providing means (46, 48). In addition, a common word bus line (CWLi) is proposed for accessing each memory blocks, namely each sub-arrays, in order to reduce common word lines for realizing a further high packing density of the DRAM device. This common bus line is also applicable to other device such as a static RAM.

Description: BACKGROUND OF THE INVENTION The present invention relates to a dynamic random access memory (DRAM) device formed on a semiconductor substrate, having a high memory density. Particularly, it relates to a device having an array of memory cells which are divided into several sub-arrays of the memory cells. It further relates to a control system for selecting the sub-arrays of memory cells for a refresh operation and an access operation thereto, and overcoming its double selection problem of the same sub-array in order to reduce the 'busy ratio'. It still relates to a bus line commonly used for several sub-arrays in order to reduce the relevant word decoders. Referring to the technological background a static random access memory device (RAM) is known from the "IEEE Journal of Solid-State Circuits" pp 578-585. This device comprises a memory, sub-arrays, a common word decoder, common word bus lines for selecting word lines on said sub-arrays, N pairs of block selection lines and N pairs of switching means (NANDs) selectively connecting the common word bus lines to their associated word lines. These features in combination are prior art for realising a known RAM-device. The organization of a prior art dynamic random access memory (DRAM) of 4M bits, for example, is schematically shown in Fig. 1. The DRAM has approximately 4.2 M pieces of memory cells MC arranged in a relatively long rectangular matrix of 512X8192 cells. Memory cells disposed in matrix are connected to one of 8192 pieces of bit lines BL0 to BL8191 and one of 512 pieces of word lines WL0 to WL511. The DRAM is designed to have fairly short bit lines to reduce parasitic capacitance of the associated bit line to achieve a fairly high speed operation and differential output signals of high voltage. Accessing to a memory cell MC is performed through a word line WL and a bit line BL selected respectively by a word decoder WD and a column decoder CD. An output signal of a memory cell MC is amplified by a sense amplifier SA (SA0 to SA8192) connected to the associated bit line and outputted to an outer circuit. Although a DRAM has an advantage of small power consumption in comparison with other RAM such as a static RAM, still the power consumption of the DRAM of extraordinary high capacity such as 4M bits is a serious problem to be solved. Assuming that each bit line BL of the DRAM of Fig.1 has capacitance of 0.5 pF, the power source voltage Vcc is 5V, and the operation cycle time is 200 ns, the power consumption of the DRAM becomes approximately 0.5W and the average current 100mA. This power consumption affects adversely for junction temperature of the associated semiconductor devices such as metal oxide semiconductor field effect transistors (MOS FETs). In a DRAM, a refresh operation is indispensable. Because the memory data in memory cells are achieved by charge stored in the capacitance of the relevant cells, and may be lost gradually by junction leakage of the MOS FETs. Thus the memory data are required to be refreshed within an adequate time. Accordingly, the stored data are periodically read from the memory cells and rewritten thereinto. During the refresh operation, all memory cells belonging to one row of the matrix array is refreshed simultaneously, making all the bit lines and relevant sense amplifiers busy. Therefore, the refresh operation and the access operation are not applicable to the array at the same time. The refresh operation is performed sequentially with all rows, namely all word lines, of the DRAM and refresh cycle time for every memory cell is predetermined such as 8 ms at present. Therefore, with a memory cell of Fig.1, the refresh operation is performed with a time interval of approximately 16 µs (8 ms/512 = 15.6 µs) for each word line from one to the next in sequence. The time necessary for completing one refresh operation is 200 ns. In an ordinary DRAM, as described above, access operation and refresh operation can not be performed simultaneously. In order to avoid the above double operation, a refresh controller is attached to the memory device, putting priority to the refresh operation and making the access operation wait during the refresh operation. Since read/write operation time is also 200 ns, the ratio of the waiting time of read/write operation to the cycle time is 1.25% (200 ns/16 µs). Hereinafter, this ratio is referred to as a 'busy ratio'. When the scale of a storage device is not so large, the busy ratio is naturally small and has not been a serious matter. However, as the scale of a DRAM is enlarged and the number of word lines and bit lines are increased, the busy ratio will increase, becoming one of problems peculiar to a large scale DRAMs. Generally, an array of a DRAM having a great number of memory cells is divided into several subsections of memory cells, such as two, four or eight subsections as described in the report by John G. Posa, on page 122, Electronics, May 22, 1980. Particularly, the partitioned array subsections, hereinafter this subsections are referred to as a sub-array, may be used as partial devices, and it is possible to shut down unused sub-arrays to conserve active power. The DRAM device handled in the present invention, disclosed as follows, also has such a configuration of memory cells, namely an array of sub-arrays, aiming at saving of power consumption. The partition of a memory cell array is also advantageous to achieve a high speed operation due to shortened word lines and bit lines. On the other hand, additional peripheral circuits become necessary such as word decoders for each sub-array and a sub-array selection circuit. Particularly, a sub-array must not be selected for a refresh operation and an access operation at the same time by the same reason described above. SUMMARY OF THE INVENTION The object of the present invention is to reduce operation power consumption of a large capacity DRAM device formed on a semiconductor substrate and/or to provide a DRAM having sub-arrays of memory cells with a control system thereof in order to reduce its busy ratio. Still another object of the present invention is to provide a RAM device formed on a semiconductor substrate having several sub-arrays of memory cells with a control bus line which can reduce the total number of word decoders of the sub-arrays. The dynamic random access memory (DRAM) device according to the present invention is specified by Claim 1. It has an array of memory cells arranged in a matrix and separated in several subsections, or sub-arrays, the number of which being selected usually as two, four, eight etc. A word decoder and a column decoder are attached to each sub-array, forming a memory block (hereinafter simply a 'block'). The DRAM device has an access peripheral circuit outputting signals for selecting a specified block and signals for accessing a memory cell therein, and a refresh peripheral circuit outputting signals for selecting a block and signals for refreshing all the memory cells sequentially in a predetermined order. The present invention functionally is characterised in that the access peripheral circuit and the refresh peripheral circuit can operate independently unlike the prior art DRAMs. Accordingly the refresh operation and the access operation can be performed simultaneously for different sub-arrays or blocks. However, when both operations are happened to be performed with the same block, the priority must be determined to be given to the refresh operation or to the access operation such that the busy ratio of the total device comes to the minimum. For this purpose, a block selection control circuit is disposed in the DRAM device for processing the above-mentioned block selection signals. The circuit contains a comparison circuit for detecting a simultaneous occurrence of the selections for an access operation and a refresh operation at the same block. In addition, in order to reduce the total number or word decoders which are disposed individually in each blocks, an improved word bus line is proposed enabling the use of one common word decoder for every block. Furthermore, there is proposed another modified bus line, through which two or more word lines of the associated memory block can be selected. As the result, the number of common word lines of the word bus line can be reduced to half or less. Details of these features and advantages of the present invention will become clear from a reading of the detailed description and claims of the invention with reference to the accompanying drawings, wherein like numerals refer to like parts. BRIEF DESCRIPTION OF THE DRAWINGS Fig.1 is a schematic diagram of a prior art DRAM device, illustrating the configuration of memory cell array and relevant peripheral circuits. Fig.2(a) is a block diagram of the first embodiment of the present invention, illustrating a total configuration of a DRAM device formed on a semiconductor substrate. Fig.2(b) is a schematic wiring diagram of a interface circuit contained in a dotted circle of Fig.2(a), illustrating an interface circuit. Fig.3 is a block diagram of the refresh peripheral circuit of the DRAM device shown in Fig.2(a). Fig.4 is a block diagram of the refresh peripheral circuit of the DRAM device shown in Fig.2(a). Fig.5(a) is a block diagram of the block selection peripheral circuit of Fig.2(a). Fig.5(b) is a wiring diagram of the access block selection invalid circuit shown in Fig.5(a). Fig.6 is a block diagram of the block selection peripheral circuit shown in Fig.2(a). Fig.7 is a time chart illustrating a consecutive occurrence of two double selection for refresh and access operations. Fig.8 is a time chart illustrating an occurrence of only one double selection for refresh and access operations. Fig.9 is a time chart illustrating a quick outputting of the second time double selection signal after the occurrence of the first time double selection for refresh and access operations. Fig.10 is a block diagram, illustrating the circuit block configuration of the fourth embodiment. Fig.11 is a partial schematic wiring diagram of a word bus line with regard to a sub-array of memory cells. Fig.12 is a schematic wiring diagram of a word bus line having an improved block selection bus line. Fig.13 is a block diagram of a word bus line of wider use for RAM devices. Fig.14 is a wiring diagram of word bus line of the preceding figure. Fig.15 is a time chart illustrating potential variation of relevant points of the circuit of Fig.14 under operation for explaining the function of the circuit. DESCRIPTION OF THE PREFERRED EMBODIMENTS Circuit configuration of the embodiments of the present invention is shown in a block diagram of Fig.2(a), comprising memory blocks 10 to 13, an refresh peripheral circuit 20, an access peripheral circuit 30 and block selection peripheral circuit 40. The array of memory cells of 512X8192 (approximately 4.2 M cells) are divided into four blocks 10, 11, 12, and 13, each having a sub-array, MCA0 to MCA3, of 512X2048 memory cells, a word decoder, WD0 to WD3, and a column decoder, CD0 to CD3 (in the figure, only MCA0, WD0, and CD0 are shown). The total array has the same long rectangular shape as that of prior art one of Fig.1. In the block 10, for example, the sub-array MCA0 has 512 word lines WD0 to WD511 and 2048 bit lines BL0 to BL2047. Sense amplifiers SA0 to SA2047 are disposed at the end of corresponding bit lines. Other blocks have also similar circuits to those of the block 10. By a block selection peripheral circuit 40, one of the blocks is selected for a refresh or an access operation. The DRAM device has also a refresh peripheral circuit 20 and an access peripheral circuit 30. These circuits 20, 30, and 40 are commonly used for each block, 10, 11, 12, or 13 through bus lines. The access peripheral circuit 30, receiving outer address signals ADR supplied from a central processing unit (CPU) of the relevant computer, outputs access address signals of two bits of upper rank, AA9 and AA10, to the block selection peripheral circuit 40, and access address signals of 9 bits of lower rank, AA0 to AA8, to the word decorders WD0 to WD3 of each sub-array respectively through an access bus line 39. The refresh peripheral circuit 20 has a refresh timer 21 thereinside for generating a refresh clock signals as shown in a block diagram of Fig.3 and Fig.4. The refresh cycle time is 4 µs which is a quarter of that of 16 µs of the prior art DRAM described before. This is because the refresh operation is performed sequentially to all memory cells of the DRAM device in its nature. The total refresh operation of the device is completed with a cycle, starting from the word line WL0 of the sub-array MCA0, for example, and ending at the word line WL511 of the sub-array MCA0. Then moves to the next sub-array MCA1, and finally ends at the word line WL511 of the sub-array MCA3. Since each memory cell should be refreshed within 8 ms in order to maintain its storing memory data, the total refresh operation cycle time must be shorter than 8 mS. The clock signals are counted by a refresh address counter 22, generating and sending refresh address signals of 11 bits, RA0 to RA10, to a refresh address buffer 23. Two bits of upper rank RA9 and RA10 is used for selecting the blocks 10 to 13, and nine bits of lower rank, RA0 to RA8 are sent to each word decoder WD0 to WD3 through a refresh bus line 29 and used for selecting the word lines WL0 to WL511 of each of sub-arrays MCA0 to MCA3. Of course, in the access operation, column selection address signals are generated and supplied to the column lines of each sub-array, description of which is omitted for simplicity hereby. Fig.2(b) is a connection diagram, illustrating the interface circuit designated by a dotted circle in Fig.2(a). The function of the circuit is apparent. For example, when the block 10 is refreshed, a refresh block selection signal RBS0 (described later) from the circuit 40 and an refresh address signal RA0 from the circuit 20 are sent to a gate GRA0 making the gate conductive. Thus the signal RA0 is sent to the word decoder WD0. Other signals RA1 to RA8 are also sent to the word decoder WD0 in the similar manner, selecting a word line of the sub-array MCA0. For access operation, the transportation of relevant signals from the access peripheral circuit 30 is performed in the similar manner. The block selection peripheral circuit 40, as shown in a block diagram of Fig.5(a) or Fig.6, comprises a refresh block selection decoder 41 for decoding the refresh address signals RA9 and RA10, outputting refresh block selection signals RBS0 to RBS3 to select the block to be refreshed, and an access block selection decoder 42 for decoding access block selection signals AA9 and AA10, outputting access block pre-selection signals PABS0 to PABS3 for preliminary selection of the block to be accessed. The block selection peripheral circuit 40 further includes a block selection signal comparison circuit 43 and access block selection signal invalid circuit 45 as shown in Fig.5(a). As mentioned above, the refresh block selection operation is performed sequentially while access block selection operation is performed according to the requirement for reading or writing and rather at random. As the result, access operation and refresh operation may happen to occur simultaneously in the same block. This doubled selection of a block is detected by the block selection signal comparison circuit 43. Since the selection of the memory blocks 10 to 13 are done by the output signals RBS0 to RBS3 from the decoder 41 for refresh operation and the output signals PABS0 to PABS3 from the decoder 42 for access operation, the double selection of a block is detected by comparing above output signals of two groups to each other. For example, when the signal RBS0 and the signal PABS0 are selected simultaneously, that is, the block 10 is selected doubly, access block selection signals are held for waiting, and a busy signal BSY is outputted to a terminal connected to an outside circuit such as a CPU. Fig.6 is block diagram of a modified block selection peripheral circuit 40, additionally having a priority providing means comprising a precedent state memory 48 and a refresh/access selection circuit 46. When the refresh signals are to be held, a refresh address increment invalid signal NINC is outputted to the refresh peripheral circuit 20 as described later. Now, the first embodiment is described, wherein the refresh operation keeps the priority over the access operation. Block diagrams of the refresh peripheral circuit 20 and the block selection peripheral circuit 40 are illustrated respectively in Fig.3 and Fig.5(a). As shown in Fig.5(a), when a double selection signal EQ indicating that the relevant block is selected doubly is outputted, the signal EQ is reversed and converted to an access invalid signal ANAS, and inputted to an access block selection invalid circuit 45. At the same time, the double selection signal EQ is also outputted as a busy signal BSY to the relevant outside circuit such as a CPU of a computer, for instance, to stop further access operation. The access block selection invalid circuit 45 is composed as shown in Fig.5(b). The circuit 45 comprises four 'AND'-gates GABS0 to GABS3. To each gate , one of the pre-access block selection signals and the signal ANAS are to be inputted. When the signal ANAS is H, indicating no double selection, the signals PABS0 to PABS3 can pass through the gates and outputted unchanged as the signals ABS0 to ABS3 respectively. When the signal ANAS is L, indicating the occurrence of a double selection, the gates are not opened, outputting L signals. In other words, all the pre-access block selection signals PABS0 to PABS3 are forced to be converted into '0' logicals even though the signals contain some '1' logicals. As the result, one of four blocks is selected by the refresh block selection signals RBS0 to RBS3, whereby one of them is '1' logical and the others are '0' logicals. As described above, one refresh operation is performed in every 4 µs and each refresh operation takes 200 ns. Usually both operations are performed in parallel. The probability of selecting one block for a refresh operation and an access operation at the same time becomes then 200ns/4µs/4 = 1.25%, which is the same value as that of the prior art DRAM device of Fig.1. In other words, the busy ratio remains unchanged. However, it becomes possible to enable only one of the sub-arrays at a time to reduce power consumption down to approximately a quarter. This is ascribed to the refresh peripheral circuit 20 and access peripheral circuit 30, both of which are originally independently operatable of each other and are controlled by the block selection peripheral circuit 40 to overcome a double selection of a block. The second embodiment is then proposed to further improve the busy ratio. Hereby, one of refresh operation and access operation is preferentially conducted according to a predetermined priority such that the busy ratio of the device comes to the minimum. The second embodiment may be referred to as an access priority type circuit, while the first embodiment as an refresh priority type. An access operation has a priority over a simultaneously occurred refresh operation, and if the doubled selection of a block may happen below a predetermined times, N times, further access operations are performed preferentially. The rough block diagram of the second embodiment is the same as that of the first embodiment shown in Fig.2(a). However, in the second embodiment, when a double selection occurs at one of the blocks, a refresh increment invalid signal NINC is sent from the block selection peripheral circuit 40 to the refresh address counter 22 as shown in Fig.3. Fig.6 shows a block diagram of the block selection peripheral circuit 40 of Fig.2(a). For simplicity, a case of N=1 will be described in the following. A refresh/access selection circuit 46 and a refresh block selection invalid circuit 47 are disposed newly. In this embodiment, pre-refresh block selection signals PRBS0 to PRBS3 from a refresh block selection decoder 42 are controlled by the refresh block selection circuit 47. On receiving a double selection signal EQ from the block selection comparison circuit 43 for the first time, the refresh/access selection circuit 46 outputs a refresh invalid signal RNAS of '1' logical to invalidate all signals RBS0 to RBS3 from the circuit 47, converting the signals into '0' logicals. Hereby, the access invalid signal ANAS is kept in '0' logical, allowing the output signals of the decoder 42 to pass the circuit 45. This preferential access state of the relevant block is memorized in a preceding state memory circuit 48. Simultaneously, a refresh address increment signal NINC from the block selection peripheral circuit 40 is sent to the counter 22 to make the counter 22 (Fig.3) temporarily stop its increment operation for N times (hereby N is taken as 1). Accordingly, the following refresh address signal RA0 to RA3 remains as the same logicals as those of the stopped ones. When the next refresh cycle comes and another double selection signal EQ is inputted, the probability of which is 1/4, the signal RNAS is converted to '0' logical to provide the next refresh operation with priority, because the refresh waiting signal RWS from the preceding state memory circuit 48 is in '1' logical. Thereafter, the memory circuit 48 is reset and the signal ANAS is made '0' logical preparing for further operation. Fig.7 is a time chart of the associated various signals illustrating a case wherein two consecutive double selection operations occur in the block 11 which is selected by the signals PRBS1 and PABS1. At the first double selection signified by (1) in the chart, the signal RNAS1 is '1' logical and the signal ANAS is '0' logical, allowing the access operation to be done preferentially, and at the second double selection signified by (2), the signal ANAS is '1' logical and RNAS is '0' logical, allowing the refresh signals which are held at the preceding time to be done preferentially. Namely, signal RBS1 is in '1' logical and ABS1 is in '0' logical. Fig.8 is also a time chart illustrating a case wherein the second time double selection of block 11 has not occurred, namely the signals PRBS1 and PRBS2 occurred simultaneously at different blocks 11 and 12 respectively. In the case, the refresh operation held at the preceding time is executed to recover the preceding signal. Assuming that the access operation to a block is random, the probability of selecting a specified block, hereby the block 11, becomes 1/4. Thus the busy ratio of the total device is reduced to 0.31 %, 1/4 of the former one, 1.25 %. Therefore, the waiting times of refresh operation N is taken larger, two times for instance, the busy ratio can be expected reduced remarkably. On the other hand, the refresh time of some of memory cells are prolonged and exceeds a limit time for securing the memory data stored therein in the worst case. Although this probability is extremely low and may not become a problem in practical use, the third embodiment is proposed to overcome the above defect. The block diagram of the third embodiment is shown in Fig.2(a) and those of the block selection peripheral circuit 40 and the refresh peripheral circuit 20 are shown respectively in Fig.6 and Fig.4. The refresh timer 21 of Fig.4 sends out clock pulses periodically with a cycle time of 4 µs. On receiving a refresh address increment invalid signal NINC, the next refresh clock signal is sent from the refresh timer 21 to the refresh address counter 22 after a interval of 200 ns, not the refresh cycle time of 4 µs. Consequently, as shown in a time chart of Fig.9, after the first time double selection (1), a pre-refresh block selection signal PRBS1, the second time double selection signal, is outputted with a time interval of 200 ns, not waiting for 4 µs, to the same block 11. The actual prolonged time is only 200 ns, which is a small time length to be negligible in comparison with the refresh cycle time 4 µs. By this system, consecutive double selections of a block more than two times can be overcome by providing them with priority successively in a similar manner to that described above. Hereinafter, a further improvement of the DRAM device for higher packing density will be described. In the above embodiments, as shown in Fig.2(a), each block has each own word decoder which occupies a considerable area on the semiconductor substrate of the relevant DRAM device. This is undesirable for higher packing density of the device. The number of word decoders must be reduced by the common usage thereof. In the following fourth embodiment, a pair of word bus lines is proposed to realize the reduction of the relevant word decoders and still to enable a refresh operation and an access operation at different blocks simultaneously. Fig.10 is a block diagram of the fourth embodiment, illustrating only the mutual relation between memory cell sub-arrays MCA0 to MCA3, two common word decoder CWDR and CWDL, and a word bus line connecting above members. With this configuration, only two word decorders are sufficient to drive four sub-arrays, performing mutually independent refresh operation and access operation simultaneously in a similar manner to that described above. Only a pair of i-th word lines WL0i to WL3i contained respectively in the arrays MCA0 to MCA3 are shown in solid lines and another one in dotted line and other word lines are not shown in the figure. The word decoders are not attached to every sub-arrays or blocks but two common word decoders CWDR and CWDL are disposed on the chip of the DRAM device. A common word bus line CWBi comprises two common word lines CWLRi and CWLLi connected respectively to the common word decoders CWDR and CWDL. Each word line WL0i to WL3i of each sub-arrays MCA0 to MCA3 has two word selection gates ('AND' gates) GR0, GL0, to GR3, GL3 at each own both ends for selecting the common word decoders CWDR and CWDL. These word lines and common word lines run in parallel on the chip. While block selection lines L0 to L3 for the common word decoder CWDL, and another block selection lines lines R0 to R3, for the word decoder CWDR run in parallel with bit lines (not shown in Fig.10 but shown in Fig.2(a)). The block selection lines R0, L0 are connected to respective word line WL0, through the 'AND' gates GR0, GL0, etc. Thus, to the block selection gate GR0, for instance, output signals from the common word decorder CWDR and block selection line R0 are inputted. To the block selection gate GL0, output signals from the common word decoder CWDL and the block selection line L0 are inputted. To other gates, signals are inputted in the similar manner. As the result, any word line of any block can be selected or accessed by the associated signals from the common word decoder CWDR or CWDL and one of block selection lines. The block selection signals (not shown) are supplied from the block selection peripheral circuit 40 of Fig.2(a), and the word decoder selection signals (not shown) are supplied from a word decoder selection circuit (not shown). Fig.11 is a partial schematic wiring diagram of one of memory cell sub-arrays MCA1, illustrating the block selection gate GR1 and GL1 of the preceding figure. The gate GR1 comprises MOS FETs Q1 and Q2, while the gate GL1 comprises MOS FETs Q3 and Q4. The MOS FETs Q2 and Q4 are used for bootstrapping of the gate voltage of the MOS FETs Q3 and Q4 respectively: the power source voltage Vcc is applied to gate electrodes of the MOS FETs Q2 and Q4. Shifting the block selection line R1 to H, namely to Vcc, the capacitance of the gate node of the MOS FET Q1 is charged. Subsequently, the common word line CWLRi is enabled, shifting the voltage of the gate electrode of the MOS FET Q1 above Vcc and making the MOS FET Q1 definitely conductive. Thus the potential Vcc is provided to the word line WL1i, and the word line WL1i is selected. The function of the MOS FET Q3 for the common word decoder CWDL is the same as MOS FET Q1. Thus, in the DRAM device of the fourth embodiment, an access operation is performed by the common word decoder CWDR, for instance, and a refresh operation can be done by another common word decoder CWDL at the same time. Therefore, both operations are performed independently of each other. Seeing from another different point of view, the word lines of the memory cell sub-arrays of the DRAM device shown in Fig.10 and Fig.11, each word lines of each sub-array can be controlled by one of two common word decoders selectively. This is a feature of the block selection bus line of the fourth embodiment. However, with the fourth embodiment, each word line of the sub-arrays needs two common word lines for the common word decoders CWDL and CWDR. These common word lines are usually made of aluminum and disposed in the same layer. Therefore, in a DRAM device of high parking density, this results in a too crowded arrangement of the common word lines on the surface of the substrate and generates some fabrication difficulty. Fig.12 is a schematic wiring diagram of the fifth embodiment, illustrating its improved block selection bus line, enabling the reduction of the common word lines CWLR or CWLL by half, or by quarter, and the like. Common word lines CWLR and CWLL can select one of two word lines WL1 and WL1', for instance, in conjunction with doubled block selection lines R1, R1' and L1, L1' through a pair of 'AND' gates GR1, GR1' and GL1, GL1'. In this manner, a common word line can select one of two word lines of a memory cell sub-array. As the result, in total, the number of the common word lines is reduced by half, serving to relax a dense density of the common word lines. Furthermore, if the block selection lines are doubled such as R1, R1', R1'', and R1'''; L1, L1', L1'', and L1''', the common word decoder CWDR or CWDL can control four word lines CWL of the sub-array. Of course, the common word decoders CWDL and CWDR can be arranged on one side area of the sub-arrays and the block selection gates are not limited to be arranged between the sub-arrays as shown in Fig.10, Fig.11 and Fig.12. Various arrangement configuration can be considered. A more generalized bus line of Fig.12 is illustrated as the sixth embodiment in a block diagram of Fig.13. The bus line of this type is supposed to be applicable to a memory device formed on a semiconductor substrate having an array of a large number of memory cells arranged in a matrix which are further divided into sub-arrays. This block selection bus line aims at the reduction of the common word lines CWLi by half, or by quarter, and the like, and the configuration and function principle of this bus line is the same as that of the fifth embodiment except that only one word decoder CWD is disposed unlike two decoders of the fifth embodiment. With regard to the sub-array MCA0, for example, the configuration of this block selection bus line is described. A common word line CWLi can select one of two associated word lines WL0 and WL0' of the sub-array MCA1, in conjunction with doubled block selection lines NO and NO' through a pair of 'AND' gates GO and GO'. The common word line CWLi can select one of two word lines WL0 and WL0' of the sub-array MCA0. Thus, the total number of the common word lines CWL is reduced by half, serving to relax a high density of the common word lines. Furthermore, if the block selection lines are doubled such as NO, NO', NO'', and NO''', the common word decoder CWD can control four word lines of the sub-array. Fig.14 is a wiring diagram of the block selection bus line associated with the sub-array MCA0, for example. The block selection gate GO comprises two MOS FETs Q1 and Q3 and the gate GO' comprises two MOS FETS Q2 and Q2'. The power source voltage Vcc is applied to gate electrodes of the MOS FETs Q1 and Q2. The gate electrodes of MOS FETs Q5 and Q6 are connected to reversed block selection lines NO and NO' taking reversed potential to those of the block selection lines NO and NO', thus the MOS FETs Q5 and Q6 are used for clamping the word lines WL0 and WL0' to the ground during non-selected period. The function of the bus line is described referring to a wave form time chart of Fig.15. A clamping circuit CL is attached as shown on the left side of the figure. Before the word selection operation, the clock signal ø is in H state, making MOS FET Q8 'ON'. When the common word line CWLi is in H state, the ground clamping of the common word line CWLi is released, and when the common word line CWLi is in L state, the common word line CWLi is clamped to Vss. Then the clock signal ø descends sharply making the MOS FET Q8 off, thus releasing the ground clamp of the common word line CWLi by the clamping circuit CL . Before the word line selection operation, the block selection lines NO and NO' are in H state, putting the gate nodes NO1 and NO1' of respective MOS FETs Q3 and Q4 in H state. The selection of the block selection line NO is achieved by lowering the block selection line NO' to L state. As the block selection line NO' is lowered, the gate node NO1' of the MOS FET Q4 also descends. Subsequently, the common word line CWLi is ascended by the common word decoder CWD, the potential of the node NO1 is pushed up higher than Vcc by a bootstrap effect, raising the potential of the word line WL0 up to Vcc. Thus the word line WL0 is selected. The voltage of the node NO3 of the clamp circuit CL is also shown in Fig.15, descending when the common word line CWLi is in H state. With other sub-arrays, the circuit functions in the same manner. By increasing the number N of selection lines (N is taken as 4, 8, etc.), the number of word lines controlled by one common word line can be increased to N lines, further simplifying the structure of the word decoder. The present invention may be embodied in other forms without departing from the scope thereof. The presently disclosed embodiments are, therefore, to be considered as illustrative and not restrictive. The scope of the invention is indicated in the appended claims rather than the foregoing description. All modifications which come within the meaning and the equivalency of the claims are therefore, to be embraced therein.

Claims: A dynamic random access memory device formed on a semiconductor substrate having an array of dynamic memory cells (MC) arranged in a matrix, said array being divided into a plurality of sub-arrays (10 - 13) of said memory cells (MC) comprising: a plurality of memory blocks each including one of said sub-arrays (10-13) and the associated peripheral means therewith; an access peripheral circuit (30) for outputting access address signals (AA0...10) for access operation, said access address signals (AA0...10) being used partially for selecting one of said memory blocks, and partially for accessing one of said memory cells (MC) of said sub-array (10-13) contained in said memory block thus selected; a refresh peripheral circuit (20) for outputting refresh address signals (RA0...10) for refreshing operation, characterized in that said refresh address signals (RA0...10) are used partially for selecting one of said memory blocks and partially for refreshing said memory cells (MC) of said memory block thus selected sequentially and cyclically according to a predetermined refresh timing schedule; and that a block selection peripheral circuit (40) is provided for detecting a double selection, namely simultaneous selection of the same memory block for said access operation and said refresh operation, for selectively implementing said access operation and said refresh operation; whereby, when none of said double selection is detected, said refresh operation and said access operation are allowed to be performed in parallel, and when said double selection is detected the preferantial implementation of said refresh operation or said access operation is performed according to a predetermined schedule of priority to one of both operations under the control of said block selection peripheral circuit (40). A dynamic random access memory device according to claim 1, characterized in that said block selection peripheral circuit (40) comprises: a first decoder (41) outputting refresh block selection signals (RBS0..3) by decoding inputted said refresh address signals (RA9, RA10); a second decoder (42) outputting access block selection signals (PABS0..3) by decoding inputted said access address signals (AA9, AA10); a comparison circuit (43) for detecting said double selection of the same memory block by comparing said access block selection signals (PABS0..3) with said refresh block selection signals (RBS0..3) and outputting a double selection signal (EQ) when said double selection is detected; and an access signal invalid circuit (45), receiving said access block selection signals (PABS0...3) and said double selection signal (EQ), and selectively invalidating said access block selection signals, such that said access block selection signals are allowed to be outputted when no said double selection is detected, and are invalidated when said double selection is detected, thus, said refresh operation is preferentially performed over said access operation. A dynamic random access memory device according to claim 1, characterized in that said block selection peripheral circuit (40) comprises; a first decoder (41) outputting refresh block selection signals (PRBS0...3) by decoding inputted said refresh address signals (RA9, RA10); a second decoder (42) outputting access block selection signals (PABS0..3) by decoding inputted said access address signals (AA9, AA10); a comparison circuit (43) for detecting said double selection of the same memory block by comparing said access block selection signals (PABS0..3) with refresh block selection signals (PRBS0..3), and outputting a double selection signal (EQ) when said double selection is detected; a refresh signal invalid circuit (47) for receiving said refresh block selection signals (PRBS0..3) and said double selection signal (EQ) and selectively invalidating said refresh block selection signals; an access signal invalid circuit (45) for receiving said access block selection signals (PABS 0..3) and said double selection signal (EQ) and selectively invalidating said access block selection signals; and a priority providing means (46, 48) having a predetermined priority schedule stored thereinside, such that when said double selection signal (EQ) is sent from said comparison circuit (43) to said priority providing means (46, 48), one of said refresh operation and said access operation is preferentially implemented by invalidating one of a group of said access block selection signals and a group of said refresh block selection signals according to said predetermined priority schedule, and the block selection signals of the remained group signals are preferentially allowed to be outputted. A dynamic random access memory device according to any one of claims 1 to 3, characterized in that said memory block comprises said sub-array (MCAj; j = 0...3; 10-13) of memory cells (MC) arranged in a matrix having a plurality of word lines (WLi; i = 0...511) and a plurality of bit lines (BLk; k = 0-2047), and a plurality of sense amplifiers (SAk) each being attached to each of said bit lines (BLk) for amplifying output signals from said bit lines (BLk), a word decoder (WDj) and a column decoder (CDj), said word decoder (WDj) and said column decoder (CDj) are respectively used for selecting said word lines (WLi) and said bit lines (BLk). A dynamic random access memory device according to claim 3 or 4, characterized in that said priority providing means comprises: a memory means (48) for storing data of information regarding the precedent refresh operation or access operation; and a refresh/access selection means (46) having a memory means for storing a predetermined block selection schedule of said refresh operation and said access operation to be performed, such that said refresh block selection signals and said access block selection signals are selectively outputted according to said data stored in said memory means and said stored predetermined block selection schedule. A dynamic random access memory device according to claim 2 or 4, characterized in that said double selection signal (EQ) from said comparison circuit (43) is outputted as a busy signal (BSY) to the associated outer circuit to stop the operation thereof temporarily. A dynamic random access memory device by claim 3 or 4, characterized in that, said double selection signal (EQ) from said comparison circuit (43) is outputted as a busy signal (BSY) to the associated outer circuit to stop the operation thereof temporarily. A dynamic random access memory device according to any one of claims 1-7, characterized in that each of said plurality of memory blocks includes one of said sub-arrays (MCAj; j = 0...3) having a plurality of memory cells (MC) in a matrix, a plurality of word lines (WLi; i = 0...511) and a plurality of bit lines (BLk), a plurality of sense amplifiers (SAk) each of which is attached to each of said bit line (BLk) and a column decoder (CDj) for said bit lines (BLk) of said sub-array, said device further comprising a first common word decoder (CWDR) and a second common word decoder (CWDL) and a plurality of word bus lines, each of said word bus lines comprising a pair of common word lines disposed along each row of said memory cells (MC) of the said array comprising a first common word line (CWLRi) connected to said first common word decoder (CWDR) and a second common word line (CWLLi) connected to said second common word decoder (CWDL); each sub-array further comprising a pair of a first block selection line (R0) and a second block selection line (L0) corresponding to each column of said array; and a pair of a first switching means (GR0) and a second switching means (GL0); each of said word lines (WLi) located on said row of said array is selectively connected to said first common word line (CWLRi) by activating the first switching means (GR0) through said first common word line (CWLRi) and said first block selection line, (R0) and to said second common word line (CWLLi) by activating the second switching means (GL0) through said second common word line (CWLLi) and said second block selection line (L0); thus said word lines (WLi) of said sub-array are selectively controllable by said two common word decorders (CWDL, CWDR) (Fig. 10). A dynamic random access memory device according to claim 8, characterized in that said switching means (GR0, GL0) is a field effect transistor (MOS FET). A dynamic random access memory device according to claim 8 or 9, characterized in that said two common word decoders (CWDL, CWDR) are disposed on peripheral areas located at both sides of said array of memory cells (MCj) and said common word lines (CWLRi; CWLLi) are disposed in parallel with said row of said memory cells (MCAj) on said semiconductor substrate. A dynamic random access memory device according to any one of claims 8 to 10, characterized in that said common word bus line further comprises: N pairs of a first block selection line (R1; R1') and a second block selection line (L1, L1') corresponding to each column of said array, hereby N is an integer; and N pairs of a first switching means (GR, GR') and a second switching means (GL, GL'), each of said word lines (WL1) located on said row of said array is selectively connected to said first common word line (CWLR) by activating the corresponding one of said first switching means (GR1) through said first common word line (CWLR) and said first block selection line (R1) and to said second common word line (CWLL) by activating the corresponding one of said second switching means (GL1) through said second common word line (CWLL) and said second block selection line (L1), thus N+1 pieces of said word lines (WLi) of each of said sub-arrays (MCAj) are selectively controllable by said two common word decoders (CWDL, CWDR), thus enabling the number of said common word lines to be reduced to 1/(N+1) (Fig. 12).

Inventors: TAKEMAE, YOSHIHIRO
Applicants: FUJITSU LIMITED
Application year: 1985
Main classification: G11C5
IPC codes: G11C8, G11C7, G11C11