SEMICONDUCTOR LASER

Abstract: A distributed feedback semiconductor laser has gain producing regions formed by superlattice regions (5) sepa­ rated by semiconductor regions 4) with a greater band gap, and which are transparent to laser radiation. These regions are between guide layers (3,7) which in turn are between cladding layers (2,8) of the semiconductor laser. The semi­ conductor regions (4) of greater band gap are preferably formed by disordering superlattice regions by diffusing or implanting an impurity therein, as this permits them to be formed with little lattice damage. The result is a semiconduc­ tor which oscillates in a single longitudinal mode, has a low threshold current, and exhibits a good mode stability against reflected light.

Description: The present invention relates to a wavelength stabilized semiconductor laser. The stabilization of wavelength in a semiconductor laser is achieved by using laser radiation with distributed feedback based on a change in refractive index or/and distributed feedback based on a change in gain. At an early stage in the development of distributed feedback (abbreviated to 'DFB') lasers, a double heterostructure was fabricated in such a way that a GaAs layer, acting as a laser active layer, was provided with a grating structure and was sandwiched between two semiconductor layers (p-type GaAlAs and n-type GaAlAs) having wider band gaps and having opposite conductivity types. With such a laser, the refractive index of GaAs is higher than that of GaAlAs, and therefore coupling based on the change in index arises. Also, the laser active layer itself changes in thickness periodically in the direction of propagation of the laser' radiation, and therefore coupling based on the change in gain also arises. In this system, the active layer having a high density of carriers is directly corrugated, and nonradiative recombination of the carriers occurs due to lattice damage at the corrugated hetero-interface. For this reason, lasing took place only at low temperatures of 80-150°K (Nakamura et al., IEEE J. of Quantum Electronics, Vol. QE-11, No. 7, 436 (1975)). In order to solve this problem, an arrangement in which a corrugated part and a laser active layer were separated (separate-confinement heterostructure: SCH) was adopted (H.C.Casey et al., Appl. Phys. Lett. 27 , 142 (1975) and K.Aiki et al., Appl. Phys. Lett. 27 , 145 (1975)). Thus, the injected carriers were prevented from causing non-radiative recombination due to the damage near the corrugation, and lasing became possible at room temperatures. With this laser, the gain is uniform in the direction of propagation of the laser radiation, so there is no coupling based on gain, and only coupling based on modulation of the refractive index arises. Therefore, the longitudinal modes of the laser include two modes near the Bragg frequency having equal gains, so that when reflected light enters the laser, the longitudinal modes change, causing noise. In order to prevent the reflected light affecting the stability of the lasing, it is possible for the distributed feedback to be based on gain coupling, so that the longitudinal mode of the laser may be brought into agreement with the Bragg frequency itself (H.Kogelnik, J. of Appl. Phys. 43 , 2327 (1972)). Thus, in order to obtain a frequency-stabilized laser in which little or no noise is generated by reflected feedback light from the surroundings (such as an optical fiber), and which operates stably at room temperature, it is necessary for the distributed feedback of gain to be due to the laser active region itself and also necessary to contrive a method and a structure for preventing the occurrence of lattice damage. A structure is described in Japanese Patent Application Laid-open No. 50-114186 in which, in order to obtain distributed feedback due to gain, a double hetero-region including a laser active layer is removed by ion milling or chemical etching, and then GaAlAs is buried by liquid phase epitaxy (LPE). It is known, however, that etching by ion milling causes a large amount of damage. With chemical etching, slits more than 1 µm deep cannot be formed at pitches of several thousand Å (10Å = 1nm), and the intended purpose cannot be met. Japanese Patent Application Laid-open No. 51-71684 discloses a distributed feedback laser in which GaAs doped with Cr is provided periodically between the p-side electrode and p-type GaAlAs cladding layer of the laser. This imposes a periodicity on injection current density in the propagation direction of propagation of the laser radiation. However, a cladding layer 1-1.5 µm thick is required in order to confine the laser radiation in the thickness direction of a crystal, and achieve low loss, and the current density for the distributed feedback becomes uniform in the active layer due to the spread of current. There has been proposed a method wherein, in order to prevent this effect, protons etc. are periodically implanted directly in an active layer so as to establish a distributed current density (Japanese Patent Application Laid-open No. 52-45888). However, a laser with the protons implanted in the active layer involves a large amount of damage and this proposal has not been put into practical use even for controlling the transverse mode of the laser. JP-A-59-139691 discloses a semiconductor laser having a periodic structure formed on a superlattice multi-quantum-well active layer by etching, and a cladding layer deposited thereon. According to the present invention, there is provided a distributed feedback semiconductor laser having means for providing distributed feedback at a wavelength of laser radiation; wherein the means for providing distributed feedback is a periodic structure formed in an active region which comprises a plurality of superlattice regions separated by semiconductor regions having a band gap greater than that of the superlattice regions; each superlattice region includes a multi-quantum well; and the superlattice regions are arranged to act as gain regions. The essence of the present invention is as follows. A DFB semiconductor laser with modulation for a gain according to the present invention has a structure which, in order to attain the distributed gain necessary for the modulation of the gain, has a periodic arrangement of semiconductor superlattice regions (which regions produce the gain), and regions of a greater band gap (which are transparent to the laser radiation). These regions of greater band gap are preferably formed by disordering superlattice regions by introducing an impurity therein. The period (∧) of the structure may be determined in accordance with the following general formula: where λ denotes the lasing wavelength of the laser, ℓ denotes the order of the periodic structure (corresponding to a diffraction grating), and n g denotes the effective index of a waveguide for mode. The thickness of active regions, consisting of the superlattice regions, is usually approximately 0.1 µm to 1.0 µm. Therefore the thickness of the disordered regions is the same or similar. The interdiffusion of the superlattice is such that an impurity is introduced into predetermined regions by the process of diffusion, ion implantation or the like, whereupon annealing is carried out. When the lateral diffusion of the impurity is considered, the thickness of the disordered regions should be, at most, nearly equal to the period. Interdiffusion of a superlattice is, per se, taught in the following papers: (1) W.D.Laidig et al.: Appl. Phys. Lett. 38 , 776 (1981) - "Disorder of an AlAs-GaAs superlattice by impurity diffusion". (2) J.J.Coleman et al.: Appl. Phys. Lett. 40 , 904 (1982) - "Disorder of an AlAs-GaAs superlattice by silicon implantation". For a GaAs/GaAlAs system, this technique is achieved when a superlattice of GaAs/GaAlAs or the like is doped with an impurity such as, for example, Zn or Si to approximately 1 x 10¹⁹ atoms/cm³ by diffusion or ion implantation and is subjected to annealing, whereby Ga and Al in the superlattice interdiffuse until the superlattice becomes a homogeneous alloy of GlAlAs. By applying this phenomenon to a GaAs/GaAlAs multi-quantum well (MQW) type laser active layer, the interdiffusion is induced periodically in the direction of propagation of the laser radiation, and non-gaining regions transparent to the laser radiation are formed. In general, when the superlattice structure is disordered, the regions have a band gap which is effectively greater than that of the multi-quantum regions, so currents do not flow through the interdiffused regions. Thus, the periodic distribution of the gain regions intended first is attained. It has been confirmed by observation with a transmission electron microscope that no lattice mismatch is involved in the boundary between the superlattice and each region where the superlattice has been nullified by interdiffusion, and the distributed feedback of the gain has been achieved without causing point defects or edge dislocations. Embodiments of the invention will now be described in detail, by way of example, with reference to the accompanying drawings in which: Fig. 1 is a sectional view of a distributed feedback semiconductor laser fabricated according to the present invention, taken along a plane containing a resonator; Fig. 2 is a perspective view showing an example of a distributed feedback semiconductor laser employing a buried structure; and Fig. 3 is a plan view showing a mask pattern for ion implantation. Embodiment 1: An embodiment will be described with reference to Fig. 1. This figure is a sectional view taken along a plane parallel to the direction of propagation of laser radiation, and enlarges part of a periodic structure. On a p-type GaAs substrate 1, there were successively grown by well-known molecular beam epitaxy (MBE) a p-type Ga 0.65 Al 0.35 As cladding layer 2 (3 µm thick), a p-type Ga 0.7 Al 0.3 As optical guide layer 3 (0.7 µm thick), an MQW laser active layer 5 (five GaAs layers each being 80 Å thick and five Ga 0.7 Al 0.3 As layers each being 60 Å thick were stacked alternately), and an n-type Ga 0.7 Al 0.3 As optical guide layer 7 (500 Å thick). A layer 6 is a protector for the MQW active layer, and may satisfactorily be made of a Ga 1-x Al x As layer which has a value of x similar to that of the optical guide layer. On the laminated structure thus prepared, Mo was evaporated to 1000 Å as a mask for ion implantation. A grating of photoresist having a period of 2580 Å was made on the Mo film by a holographic photoresist exposure method, and a grating pattern was etched in the Mo by well-known dry etching which employed CCl₂F₂ gas. Si ions were implanted at a dose of 10¹⁴ /cm² by 200 keV. After the Mo mask was removed, the surface of the wafer was etched slightly. Thereafter, an n-type Ga 0.65 Al 0.35 As cladding layer 8 (1.5 µm thick) and an n-type GaAs cap layer 9 were grown by the molecular beam epitaxy. Subsequently, the resultant structure was annealed at 800 °C under an arsenic overpressure for 1 hour. In Fig. 1, numeral 5 designates GaAs/GaAlAs superlattice regions which are regions producing a laser gain, and numeral 4 regions in which the superlattice has been interdiffused by Si ions and which are non-gaining regions transparent to the laser radiation. The laser had a total length of 500 µm, and regions at both the ends of the laser each being 50 µm long were entirely doped with the Si to nullify the superlattice, in order to suppress the occurrence of the Fabry-Perot mode. The annealed wafer was subjected to a process similar to that of an ordinary buried heterostructure semiconductor laser (buried heterostructure semiconductor lasers have been reported by N. Chinone et al. in Appl. Phys. Lett. 35 , 523, 1979, and so forth), to render the stripe width of the active layer 1 µm and to provide buried regions of GaAlAs 16. More specifically, a mesa region of predetermined width was formed in the traveling direction of the laser, whereupon semiconductor layers were grown on both the side surfaces thereof in order to confine the radiation in the mesa region (buried regions). Next, an insulator film 9 of an SiO₂ film or the like was formed except a current injection region which corresponded to the top of the mesa, and an electrode 10 was formed thereon. In addition, an electrode 11 was formed on the rear surface of the semiconductor substrate. Fig. 2 is a perspective view of the present example, in which the interior of the crystal is clearly shown by cutting parts of the example. Symbols denote the same portions as in Fig. 1. The threshold value of lasing was 25 mA, and the lasing wavelength was 838 nm. The occurrence of noise was examined by reflecting part of the laser radiation with a mirror so as to return it into the laser resonator. As a result, the laser operated stably up to a reflected light intensity which was double that of a conventional DFB laser having a diffraction grating. From the viewpoint of the stabilization of the single longitudinal mode which forms the first object of the present invention, the buried heterostructure is not always necessary, but the typical buried heterostructure for stabilizing the transverse mode was used in the present embodiment. Naturally, the existing means for stabilizing the transverse mode can be freely used conjointly with the present invention. Embodiment 2: While Embodiment 1 was an example employing the p-type substrate, the present invention can of course be performed quite similarly even with an n-type substrate. On an n-type GaAs (plane orientation: 100) substrate, there were grown by molecular beam epitaxy an n-Ga 0.65 Al 0.35 As cladding layer 3 µm thick, an n-type Ga 0.7 Al 0.3 As optical guide layer 0.7 µm thick, an undoped multi-quantum well laser active layer (five GaAs layers each being 80 Å thick and five Ga 0.7 Al 0.3 As layers each being 35 Å thick were stacked alternately) and a p-type Ga 0.7 Al 0.3 As buffer layer (500 Å thick). Subsequently, Si ions were implanted as in Embodiment 1 by ordinary ion implantation, and the resultant structure was annealed, thereby to obtain a structure having a period of 2600 Å in which superlattice regions and disordered regions were alternately arrayed in the laser active layer. Thenceforth, the same method as in Embodiment 1 was used to fabricate a distributed feedback semiconductor laser. As a dummy wafer, a wafer having quite the same structure as a laser was subjected to steps similar to those of the foregoing device, that is, it was provided with regions implanted with Si ions and regions not implanted and was then annealed. When the refractive indices of both the wafers were measured at the lasing wavelength of the laser, no difference was observed within the range of a measurement accuracy. This indicates that, in the wafer of this embodiment, the distributed feedback of refractive index is not involved, only the distributed feedback of gain arising. The threshold value of the lasing of the foregoing semiconductor laser was 30 mA, and the stability of the laser aginst reflected light was improved to seven times that of a prior-art DFB laser. Embodiment 3: While the examples mentioned above employed the semiconductor material GaAs-GaAlAs, it is needless to say that the present invention can be performed with other materials. A similar distributed feedback semiconductor laser can be obtained even when the essential portions of the semiconductor laser are formed by growing on a p-type GaAs substrate a p-type GaAs cladding layer (3 µm thick), an In 0.18 Ga 0.82 As/GaAs-system multi-quantum well layer (five well layers each being 70 Å thick and five barrier layers each being 40 Å thick were stacked alternately) and an n-type GaAs cap layer 300 Å thick. The respective layers mentioned above may be formed using MO-CVD (Metal-organic Chemical Vapor Deposition). Likewise to the previous embodiments, Si ions are implanted through a grating-like mask, an n-type GaAs cladding layer was further grown, and the resultant structure is thereafter annealed at 800 °C for 1.5 hours. Thus, the object can be achieved. The same object can be accomplished even when an InP substrate is used. For example, an n-InP cladding layer, an undoped InGaAs/InGaAlAs multi-quantum well laser active layer and a p-InP layer 200 Å thick were grown on an n-type InP substrate by the MOCVD process, whereupon Si ions were implanted by the same method as in the above example. After p-InP was grown by the MOCVD process, annealing was carried out. A single longitudinal mode was oscillated by coupling based on a first-order gain grating. Embodiment 4: The mask pattern used at the step of implanting the Si ions in Embodiment 1 was replaced with one shown in Fig. 3 so as to dope a portion 13 with Si. In the figure, numeral 12 indicates the position of an active layer. This active layer is a quantum well laser active layer which is not implanted with Si, and which has a periodic structure so as to become a second-order diffraction grating in the direction 14 of a laser cavity. When a laser is fabricated by this method, the laser active layer is buried in GaAlAs of wider band gap and lower refractive index, so that the confinement of the transverse mode of the laser becomes possible. More specifically, the control of the longitudinal mode as well as the transverse mode of the laser and the confinement of carriers can be done by one process, and the burying growth based on liquid phase epitaxy as indicated in the previous embodiments is not required. The threshold value of lasing was 38 mA. As described above in conjunction with the embodiments, the present invention could establish the distributed feedback of refractive index and the distributed feedback of gain without forming a corrugated grating in a semiconductor laser and with a completely flat crystal growth plane left intact. It has been revealed by observation with a transmission electron microscope (TEM) that a crystal grown on a grating fabricated by this method is much less in the numbers of dislocations and defects of the crystal when compared with a crystal grown on the corrugated grating. This gives a favorable result to the extension of the lifetime of the laser. Another advantage of this invention is that pure gain coupling or both gain coupling and index coupling may be freely chosen by changing the thickness of a barrier in a multi-quantum well. Thus, the longitudinal mode of the laser can be selected, and a laser difficult of causing noise attributed to reflected light is provided. The above advantages are improvements in characteristics in the functional aspect of the laser. Also from the standpoint of process, a method of making a distributed feedback structure with ion implantation offers better mass-producibility than a method of making a diffraction grating with chemical etching.

Claims: A distributed feedback semiconductor laser having means (4,5) for providing distributed feedback at a wavelength of laser radiation; wherein the means (4,5) for providing distributed feedback is a periodic structure formed in an active region which comprises a plurality of superlattice regions (5) separated by semiconductor regions (4) having a band gap greater than that of the superlattice regions; each superlattice region includes a multi-quantum well; and the superlattice regions are arranged to act as gain regions. A semiconductor laser (4) according to claim 1 wherein the regions (4) having the greater band gap are disordered regions which alternate with the superlattice regions (5). A semiconductor laser according to claim 2, wherein the disordered regions, contain implanted ions. A semiconductor laser according to any one of the preceding claims, employing a buried heterostructure provided by two regions (16), the active region being formed therebetween. A semiconductor laser according to any one of the preceding claims wherein the active region is a GaAs-GaAlAs multi-quantum well layer, which is on a P-type GaAs substrate (1) covered by a P-type GaAlAs cladding layer (2) and a P-type GaAlAs optical guide layer (3); and the active region, in which the regions having greater band gap are disordered regions (4) containing implanted Si ions, is covered by an N-type GaAlAs optical guide layer (7), an N-type GaAlAs cladding layer (8) and an N-type GaAs cap layer (9). A semiconductor laser according to any of claims 1-4 wherein the active region is a GaAs-GaAlAs multi-quantum well layer, which is on an N-type GaAs substrate (1) covered by an N-type GaAlAs cladding layer (2) and an N-type GaAlAs optical guide layer (3); and the active region, in which the regions having greater band gap are disordered regions (4) containing implanted Si ions, is covered by the corresponding layers of P-type GaAs-GaAlAs semiconductor material. A semiconductor laser according to any one of claims 1 to 4, wherein the active region is a InGaAs/GaAs multi-quantum well layer, which is on a P-type GaAs substrate covered by a P-type GaAs cladding layer, and the active region, in which the regions having greater band gap are disordered regions (4) containing implanted Si ions, is covered by a N-type GaAs cladding layer. A semiconductor laser according to any one of claims 1 to 4 wherein the active region is an InGaAs/InGaAlAs multi-quantum well layer, which is an N-type InP substrate covered by an N-type cladding layer; and the active region, in which the regions having greater band gap are disordered regions (4) containing implanted Si ions, is covered by a P-type InP layer.

Inventors: FUKUZAWA, TADASHI, HIRUMA, KENJI, MATSUMURA, HIROYOSHI, NAKAMURA, HITOSHI, TSUJI, SHINJI
Applicants: HITACHI, LTD.
Application year: 1985
Main classification: H01S3
IPC codes: H01S5