PROCESS AND ARRANGEMENT TO INCREASE THE RELIABILITY OF THE METALLIZATION OF BORINGS IN THE PRODUCTION OF MULTILAYER PRINTED CIRCUITS

Abstract: A process for establishing durable and reliable contact between different layers of multilayer, preferably four-layer, printed circuit cards. In the four-layer cards which are bonded together and connected by means of borings the two outer layers e.g. the first and the fourth, are used for sign leading and card connection; the inner layers, e.g. the second and the third, are used for earthing and for the supply voltage. The distinctive feature of the process is that the boring connecting the outer, e.g. the first and/or the fourth, and the inner, e.g. the second and/or the third layers are before being metallized, rebored with a greater diameter from the appropriate direction up to the intermediate layer with the help of an electronically controlled bit. During this process the reaching of the intermediate layer is sensed and after having reached the required depth within this layer, the forward movement of the bit is stopped. After having made the necessary number of great diameter borings, their cylindrical jackets and the envelopes of the cones in the conducting layers are coated with copper in the known way. The present invention relates to a device, too, connected with the bore preferably for the process described above. The distinctive feature is that the bit enlarging the diameter of the borings has a device automatically regulating its forward movement, an electronic control and a sensor circuit. The bore (14) is in rigid contact with the controlled, automatic device (15) regulating its forward movement. The controlling input of this device (15) is connected with the output (a) of the electronic controll (16); the input of the electronic control (16) is connected with the output (b) of the sensor circuit (17). This circuit has two inputs, one (c) connected to the bore (14), the other (d) to the inner conducting layers of the multilayer printed circuit (13).

Description: PROCESS AND ARRANGEMENT TO INCREASE THE RELIABILITY OP THE METALLIZATION OP BORINGS IN THE PRODUCTION OP MULTILAYER PRINTED CIRCUITS Seen after the appearance of the mounting 'techniques of twaβided printed circuits a demand emerged to produce more than two layers placed collaterally. This was on the one hand necessary so that supply voltage and earthing connection could he arranged more conveniently and reliably, and on the other hand so that component density could " be increased. The contacts between components have two basic -functions: to ensure a suitable supply voltage and earthing, and to conduct signs between the circuits. The diameter of the supply voltage and earthing leads is considerably greater than that of the sign leads. Even when using two-sided printed wiring an effort has been made to separate the supply voltage and earthing leads. One of the aost common ways is to supply the cards with separate rail contacts for the supply voltage and earthing. Thus the diameter of the leads is much greater and it is easier to plan the sign leads because the layers of the printed circuit are reserved exclusively for the latter. This solution, 'however, has not proved to be completely suitable, as mounting is difficult and a great deal of space ia needed. The appearance «f printed circuits of more than two layers aeant further progress. Pour-layer printed circuits are the most commonj in these the tw» inner layers take ever the rβle «f the supply voltage aad - 2 - -earthing rails, the outer layers used for the sign leads. This solution has several advantages. The supply voltage and earthing leads can have a great surface area and at the ' same time a great diameter, but they do not take up any space on the mounting side, and it is thus easier to place the sign leads. A further advantage is that the surface layer ensures excellent screening between the two outer layers, and enables the sign leads on the outer surface to fuaction as a sort of waveguide. This means that the circuits are faster and there is less n»ise. Not only four, but printed circuits of more than four layers are also used, but these are much less common. Below we mainly discuss four-layer printed circuits, which have the supply voltage and earthing leads in the inner layers. * Contact between the layers of multilayer printed circuits is ensured by metallized borings. Metallized borings connect layers in which the conducting copper layer is in contact with the boring. If we want no contact, an insulator ring or insulator mash has to be put around the boring. Figure 1 shows the section of a four-layer printed card, ith earthing (1) and supply voltage (2) in the inner layers. The shaded part symbolizes conducting metal layers. The metallized borhg on the left side of the figure conducts the earthing lead to both outer layers, the boring in the middle the supply voltage lead. The bor^g at the far right has no contact either with the earthing or with the supply voltage lead, but connects the sign leads on the two outer layers of the printed circuit card. The thic-cness of the individual conducting layers is usually 35 Micron, the diaβ-±er of the boring varies between 0.8 and 1.2 aβ. The moat frequent cause ef failure «f aultii-yer printed circuits is a gap between the inner conducting layer and the metallized boring. This failure is high¬ ly inconvenient as it cannot be discovered by simple checking and, if there is a alight bend in the card, may not always be apparent. It is also inconvenient from the viewpoint of the ageing of the printed circuit card since such a gap can occur at any time as a consequence of normal mechanical use. This means that in industrial environments where a great degree of reliability is necessary, multilayer printed circuit cards are, even today, used with the utmost reserve. The -Sequent gap between the inner conducting layer and the metallized boring is a consewuence of present technology. Following the usual technology the cards forming the multilayer printed circuit are bonded together, and the borings made with an extremely hard, high- speed rotation bit. The borings are first coated mechanically with a thin copper layer, and are then electroplated to make the copper layer thicker, The fundamental problem of this technology is that during boring the b--alc insulator layer of the printed ' circuit card heats and smears. As the bore passes the middle, conducting layer, this smeared insulator material covers the latter, and in the next technological phase, the metallizing of the boring, there is insufficient contact between the metal coating and the middle conducting layer. The problem is aggravated by the fact that the usual thickness of this middle metal layer is no greater than about 35 micron, so even without smearing the two metal layers are connected only by means of a 35 micron • high cylindrical jacket. Figure 2 shows an enlarged picture of a boring. The middle, earthing layer (4) is conducted through the insulator layers (3) to the two outer conducting layera. Smearing (6), however. increases the resistance between the two metal layers and could even insulate them completely. Several methods have been elaborated to solve this technological problem. A common feature of these methods is that the smears are removed from the boring before the metallizing procedure. Older methods used chemical etching, but this is a health hazard and it is very difficult to determine the appropriate etching period. If this is too long the wall of the boring within the insulating material becomes coarse, leaving no smooth surface needed for metallizing. The latest method is to remove 3meared insulating material by plasma etching, but this needs very expensive equipment. Another disadvantage of etching is that the copper becomes .hard and brittle. On the other hand, etching attacks and removes the insulator material, but not the metal itself. This means that after the etching, copper rises from the surface of the boring and touches the copper used for metallizing over a greater area. Pigur 3 shews the boring of a four-layer printed circuit after etching and prior to bβring. The figure shows that as a consequence of boring the insulator layers (7) are deeper than the conducting layers (8), The aim of our invention is to eliminate simultaneously all the difficulties mentioned above and to provide a process that ensures durable, reliable connection between one of the inner and one of the outer layers of a multilayer printed circuit card. The reliability of the metallized boring is ensured as contact with the middle layer is not only via the edges of the conducting layers, but via a greater surface area βf the given conducting layer, and the effects βf the smearing of the inaulatβr material are eliminated. The said aim of this invention is thus to eosur. durable, reliable contact between the outer and inner conducting layers when producing multilayer printed circuit cards. This distinctive feature of the process described in the invention is that the connection between the inner and outer layers is made more reliable by enlarging that part of the surface area of the inner layer that can be metallized. This is achieved by adding a further technological step to the usual process. After having made the borings in the usual way, those to be connected with one of the inner conducting layers are rebored with a greater diameter, not to their full length, but just up to the inner conducting layer. The same result is obtained if we start by first making the borings up to the inner conducting layer and after this the full-length borings with the usual diameter. The technological steps after this are the ones that are commonly used. The intermediate technological step is shewn in Fig, 4, The figure shows a section of a fcur-layer printed circuit card, where the metallized boring on the left conducts the printed wiring of the earthing (9) to the two outer surfaces, while the boring to the right the supply voltage lead (10). For comparison, Figure 1 shows the usual solution. Figure 4 shows clearly that now the -toner conducting layer and the metallized boring are connected not only by a 35 micron high cylindrical jacket, but also by an envelope of a cone which has a much greater surface area, and it is also shows that if this envelope of a cone is used the likelihood of a smear of the insulator material is less, thereby increasing the reliability of the cards to a great extent. Figure 5 showa the result βf a variation to this process. Here the boring with greater diameter extends from the surface to the inner conducting layer, and the other one from the surface on the opposite side to another conducting layer. Figure 7 shows the solution for printed circuits of more than four layers, when the inner layers also contain sign leads which have to be connected gaivaπicai- ly. In this case we can use the described process by boring from both sides up to the layers (18) and (19), Figure 6 shows the arrangement of the equipment used in this process. The greatest problem is caused by the forward movement of the bit enlarging the boring having to be stopped very suddenly so as net to make the metal of the inner conducting layer too thin. According to the arrangement of the invention the bore is connected rigidly (14) with an electronically controlled device (15) pushing it forward. The electronic control (16) of this device (15) is activated by a 3ensor circuit (17) that secses contact between metals. As the two inner layers conduct supply voltage and earthing, these layers have outer connectors. If the resistance between these outer connectors and the bore decreases, the bore has reached the inner metal layer and this is sensed by the sensor circuit. Other solutions are possible to control the forward movement of the bit. Instead of a sensor circuit sensing contact between the metals a sensor circuit sensing change in capacity could be used.

Claims: Patent claims: 1. A proce ' ss for establishing durable and reliable contact between different layers of multilayer, preferably four-layer, printed. circuit cards where in the four-layer cards which are bonded together and connected by means of borings the two outer layers e.g. the first and the fourth, are used for sign leading and card connection and- the inner layers, e.g. the second and the third, are used for earthing and for the supply voltage, c h a r a c t e r i z in that the boring connecting the outer, e.g. the first and/or fourth, and the inner, e.g. the second and/or the third layers are, before being metallized, rebored with a greater diameter from the appropriate direction up to the intermediate layer with the help of an electronical- ly controlled bit and during this process the reaching of the intermediate layer is sensed and, after having reached the required depth within this layer, the forward movement of the bit is stopped, furthermore after having made the necessary number of great diameter borings. their cylindrical jackets and the envelopes of the cones i.n the conducting layers are coated with metal e.g. copper in the known way. 2. A process according to claim 1, where starting with multilayer, bonded printed circuit carda without borings, where the outer layers, e.g. the first and the fourth, are used for sign leading and card connection, while the inner ones, e.g. the second and the third, are used for earthing and supply voltage, c h a r a c t e r i z e d in that before making the borings with the usual diameters connecting the outer e.g. the first and/or the fourth, and the inner, e.g. the second and/or the third layers, the borings are made with a bit with a greater than usual diameter, which is electronically controlled,furthermore Jaaving reached the determined depth, the forward movement of the bit ia stopped and after thia, the full-length borin a with usual diameter are made and their cylindrical jackets and the envelopes of the conea in the conducting layers are coated with copper in the known way. 3, A device mounted preferably on a boring machine for realizing the proceas according to claima 1 and 2, c h a r a c t e r i z e d in that the bit enlarging the diameter of the borings has a ievice automatically regulating its forward moveπ-en-. , an electronic control and a sensor circuit and the bore (14) is in rigid contact with the controlled automatic device (15) regulating its forward movement, further the controlling input of this device (15) is connected with the output (a) of the electronic control (16) the input of the electronic control (16) is connected with the output (b) i5of the sensor circuit (17) and this circuit Es IF O inputs, one (c) connected to the bore (14), the other (d) to the inner conducting layers of the multilayer printed circuit (13). 4. The device according to claim 3, c h a r a c t e r i z e d in that the sensor circuit (17) senses metal contact. 5« A device according to claim 3, c h a r a c t e r i z e d in that the sensor circuit (17) senses the change in capacity.

Inventors: BANKI FERENC, LUKACS JOZSEF, NYITRAI ZOLTAN, BANKI, FERENC, LUKACS, JOZSEF, NYITRAI, ZOLTAN
Applicants: MTA KOEZPONTI FIZ KUTATO INTEZ, MTA KOEZPONTI FIZIKAI KUTATO INTEZETE
Application year: 1985
Main classification: H05K3
IPC codes: B23B35, H05K1, H05K3