ELECTROCONDUCTIVE ARTICLES AND A METHOD OF PRODUCING THE SAME

Abstract: An electroconductive article comprises a polar group-­ containing high polymeric substrate, and an electroconduc­ tive layer of cupric sulfide formed therein, and is produced by immersing the polar group-containing high polymeric substrate in an aqueous solution containing a bivalent copper compound and a reducing agent or an aqueous solution containing a monovalent copper compound, and at the same time or subsequently treating it in a solution of a sulfur releasable substance.

Description: ELECTROCONDUCTIVE ARTICLES AND A METHOD OF PRODUCING THE SAME This invention relates to electroconductive articles and to a method of producing the same. As electroconductive polymer materials, there have hitherto been3known fibers and films obtained by adhering cuprpus sulfide as an electroconductive layer to high molecular weight substances having a nitrile group such as acrylic fibers and acrylic films. These materials arejproduced by utilizing coordinate bonds of monovalent copper ions to nitrile groups as a copper dyeing process. In this case. the cuprous sulfide (Cu2S) of the electroconductive layer actually has a composition CUxS (1.75 < x < 2) slightly deviated from the stoichiometric quantity and is reported to exhibit the behaviour of a P-type semiconductor. However, the electroconductive articles having cuprous sulfide as the electroconductive layer thereof exhibit unsatisfactory electroconductivity. On the other hand, it is known that cupric sulfide (CuS) exhibits an electroconductivity higher by at least a figure than than that of cuprous sulfide (Cux5, 1.75 < x < 2). However, bivalent copper ion has poor coordination ability to the functional group of the polymer material as compared with monovalent copper ion, so that it is very difficult to produce electroconductive articles containing cupric sulfide as the electroconductive layer. The present inventors have made various studies with respect to electroconductive articles utilizing the electroconductivity of cupric sulfide, and have found that electroconductive articles having a high electroconductivity can be produced by treating a high polymeric substrate provided with cuprous sulfide as an electroconductive layer in a solution of a sulfur releasable substance to convert the greater part of the electroconductive layer into cupric sulfide without adversely affecting the adhesion performance of the electroconductive layer to the high polymeric substrate. According to the first aspect of the invention, there is provided an electroconductive article compri-sing a polar group-containing high polymeric substrate, and an electroconductive layer of cupric sulfide formed therein. According to a second aspect of the invention, there is provided a method of producing an electroconductive article, comprising immersing a polar group-containing high polymeric substrate in an aqueous solution containing a bivalent copper compound and a reducing agent or an aqueous solution containing a monovalent copper compound, and at the same time or subsequently treating it in a solution of a sulfur releasable substance The polar group-containing high polymeric substrate may be a high molecular weight substance containing a polar group selected from nitrile, urethane, urea, amido, hydroxyl, ether and ester groups, and suitable high polymeric substrates include nitrile group-containing polymers, polyvinyl chloride containing polyurethanes, polyamides, polyesters, polyethers and polyvinyl alcohols. Suitable nitrile group containing polymers are acrylic fibers; nitrile group-containing polyurethane foams (for example polyurethane foam containing polyol grafted with acrylonitrile); acrylonitrile; methacrylonitrile; ethacrylonitrile; derivatives of a-substituted acrylonitrile such as a-propyl acrylonitrile; vinylidene cyanide; homopolymers of a compound containing at least one nitrile group in its molecule such as a-methylene glutaronitrile; and copolymers of the nitrile group-containing compound with a copolymerizable unsaturated vinyl compound (for example, acrylic acid, methacrylic acid or an ester thereof; acrylamide; vinyl acetate; vinyl chloride; vinylidene chloride; vinylsulfonic acid; methallyl sulfonic acid, p-styrene sulfonic acid or a salt thereof; dimethyl or diethyl aminoethyl ester of acrylic or methacrylic acid: N-substituted aminopropyl esters: N-substituted aminobutyl esters; vinylpyridine). The polyvinyl chloride containing polyurethane foams are generally known as foams of a grade having flame retardant properties and may easily be produced or are commercially available. Suitable such foams are polyurethane foams containing 2 to 100 parts by weight, preferably 5 to 40 parts by weight, of finely divided polyvinyl chloride based on 100 parts by weight of polyol an example of which is a flexible polyurethane foam containing polyvinyl chloride, zinc oxide and antimony trioxide. When the content of polyvinyl chloride is less than 2 parts by weight, the adhesion of copper sulfide may be insufficient and it may be difficult to obtain practical electroconductivity, while when the polyvinyl chloride content exceeds 100 parts by weight, the effect of improving the electroconductivity becomes saturated and the viscosity of the mixed liquid consisting mainly of polyol increases to make good foaming difficult and also the properties of the resulting foam are degraded. This polyurethane foam can easily be produced by compounding polyvinyl chloride dispersed polyol with polyisocyanate, foaming agent, catalyst, foak stabilizer and other additives and then foaming it. The shape of the polar group-containing high polymeric substrate (hereinafter referred to as polymer substrate) is not critical and may be in the form of fiber, film, foam, powder, or sheet. According to the invention, an electroconductive layer of a cuprous compound is first formed in the polymer substrate by immersing the polymer substrate in an aqueous solution containing a bivalent copper compound and a reducing agent or an aqueous solution containing a monovalent copper compound. In this case, it is preferable that the immersion treatment is carried out by gradually heating from room temperature to a temperature of 50-12OOC. Moreover, the immersion time is dependent upon the concentration of the copper compound used and the treating temperature, but it is preferably about 90 minutes for obtaining good adhesion of copper compound when the polymer substrate is immersed, for example, in an aqueous solution having a concentration of cuprous chloride of 0.4 moQ/Q at 600C. The monovalent copper compound may be suitably cuprous chloride, cuprous iodide, cuprous cyanide, or cuprous thiocyanate. The bivalent copper compound may be suitably cupric sulfate, cupric chloride, cupric nitrate, cupric acetate, or cupric oxalate. The reducing agent may be suitably metallic copper, ferrous sulfate, sodium hypophosphite, hydroxylamine or a salt thereof, ammonium vanadate, furfural, and glucose. In case of using the monovalent copper compound, a dissolving aid such as hydrochloric acid or ammonium chloride may be added, if necessary. Moreover, in the aqueous solution containing the cupric copper compound and the reducing agent, cupric ion is reduced to cuprous ion suitably at 90-1200C at pH = 1.5-4.0, whereby the resulting cuprous ion is bonded by coordination to the polar group of the polymer substrate. In order to efficiently enhance the adhesion of the cuprous compound to the polymer substrate, it is preferred that the surface of the polymer substrate is previously roughened by treating with an aqueous alkali solution or by removing cell membranes from the foam as the substrate according to an explosive process and then treating with the aqueous alkali solution. The amount of the cuprous compound adhered to the polymer substrate is preferably not less than 1S by weight, more preferably not less than 3% by weight. According to the invention, the thus treated polymer substrate is treated in a solution of a sulfur releasable substance during or after the above immersion treatment, whereby a sulfurization reaction is caused to convert the cuprous compound into cupric sulfide. In this case, the concentration (by molar ratio) of sulfur in the solution is preferably not more than 3 times, more preferably not more than 2 times, the concentration of the cuprous compound. Most preferably, the molar ratio of the sulfur concentration to the cuprous ion concentration is 1:1. The term "sulfur releasable substance" used herein means substances capable of releasing sulfur atoms and/or sulfur ions, examples of which include elemental sulfur, sodium thiosulfate, sodium sulfide, sodium hydrogensulfite, sulfurous acid, sodium dithionite, dithionous acid, Rongalit (trade name), ammonium sulfide, potassium sulfide, ammonium polysulfide, sodium polysulfide, potassium polysulfide, sulfur dioxide and hydrogen sulfide. The solution of sulfur releasable substance may be suitably a solution of elemental sulfur in benzene, toluene, xylene, ether or alcohol. In this case, an amine for generating free sulfur from the sulfur solution, such as n-butylamine, ethanolamine, morpholine, ethylenediamine or piperidine, may be added to promote the sulfurization reaction. In the sulfur solution, the concentration of sulfur is preferably within a range of 0.5-3% by weight, and the concentration of amine is preferably within a range of 0.1-3% by weight. In addition to the sulfur solution, an aqueous solution of the sulfur releasable substance such as ammonium sulfide, sodium sulfide, potassium sulfide, ammonium polysulfide. sodium polysulfide and potassium polysulfide may also be used. In this case, the concentration of such a sulfur releasable substance is preferably within a range of 2-20% by weight. Furthermore, an aqueous solution obtained by blowing a sulfur-containing gas such as sulfur dioxide or hydrogen sulfide into water may be used as the solution of the sulfur releasable substance. The sulfurization treatment with the solution of sulfur releasable substance is generally carried out at a temperature above room temperature. preferably at a temperature of 50-120 0C. For example, when the treating temperature is 600C, the treating time is suitably about 90 minutes. As the treating temperature rises, the treating time is shortened, but when the treating temperature exceeds 120 C, the strength of the resulting electroconductive article adversely lowers. Moreover, the treating time can be shortened by irradiating the solution of sulphur releasable substance with ultraviolet rays, electron radiation or y-rays. In particular when a polyvinyl chloride containing polyurethane foam is used as the polymer substrate, the adhesion of cupric sulfide is higher than the case of using a polymer substrate other than the above polyurethane foam even if the sulfurization treatment is carried out at the same temperature for the same time, and the electroconductivity is generally improved. In the electroconductive article according to the invention, the amount of cupric sulfide adhered to the polymer substrate is preferably not less than 1% by weight, more preferably 3 to 30% by weight. When the -asount of cupric sulfide is less than 1t by weight, the desired electreconductivity may not be obtained, while when the cupric sulphide amount exceeds 30% by weight, the electroconductivity may become substantially saturated and the properties of the article such as strength and flexibility may deteriorate. It is preferable that the cuprous compound as the electroconductive layer is completely changed into cupric sulfide by the sulfurization treatment because the electroconductivity of the resulting article is then highest. However, when at least 208 of the cuprous compound is converted into the cupric compound. the electroconductivity is at least 2 times that of an electroconductive layer composed of only the cuprous compound, which can sufficiently be put into practical use. The electroconductive articles according to the invention may be widely used for various applications, for example wall coverings, ceilings and floor coverings in dark rooms as a radio wave absorbing material; as gaskets and the like in office supplies and OA supplies as an electromagnetic wave shielding material; as molded laminates with unsaturated polyester resin in parabolic antennae as a radio wave reflecting material; as sheet heating resistance elements and tape-like heating resistance elements as a heating resistor; as foam for the prevention of static faults as a material in the field of static electricity; as static shielding material in the field of electron materials; as conductive mats for collectors; and as electroflooring mats, sleeping mats, mattresses, and small size mats for hot compresses and the like as a material for low frequency or static treatment. In particular, when a polyvinyl chloride containing polyurethane foam is used as a polymer substrate, the copper sulfide is absorbed by the foam in a uniformly dispersed state, so that the resulting electroconductive article has excellent electroconductivity and still retains good foam texture, and also the burning speed is notably slow as compared with a conventional article because of its flame retardant properties, which makes it suitable for use in interior parts of automobiles. The invention will be further described with reference to the following illustrative Examples. In these examples, all percentages are by weight unless otherwise stated. Example 1 A woven cloth (thickness: 1.1 mm) obtained by knitting acryl fibers (Sandarlan SS-N¯, made by Nippon Sanmo Senshokfl K.K.) into a tortoise-shell form was treated with an aqueous solution containing 1 moQ/t of cupric sulfate and 1 soQ/Q of sodium thiosulfate to form cuprous sulfide as an electroconductive layer. Then, five samples were cut out from this treated cloth at a size of 54 mm in fiber continuing direction and 50 mm in a direction perpendicular thereto. Among them, four examples were subjected to sulfurization treatment under the following conditions, respectively. Treatment 1: The sample was immersed in a toluene solution of 1% of sulfur for 1 day. Treatment 2: The sample was immersed in a toluene solution of 1% sulfur and 1% morpholine for I day. Treatment 3 : The sample was immersed in a toluene solution of 1% of sulfur and 1% of n-butylamine for 1 day. Treatment 4 : Immediately after the sample was immersed in a toluene solution of 1% of sulfur, it was exposed to ultraviolet rays generated from a high pressure mercury lamp (power : 4 kW, made by Toshiba Corporation) for 30 seconds. These four samples after the above treatment were thoroughly washed with toluene, dried, coated at both ends in fiber continuing direction with an electroconductive silver paint (Dotite D-550, trade name, made by Fujikura Kasai K.K.) over a width of 2 mm, and left to stand for more than 2 hours, to which was connected a copper electrode, and thereafter the surface resistance of the sample cloth with a side of 50 mm was measured by means of a resistance measuring device. Also, the value of resistance in the non-treated sample was measured. The measured results are shown in the following Table 1. The treated samples turned green or deep green, while the non-treated sample was olive. Table 1 EMI12.1 <tb> <SEP> Surface <SEP> ; <SEP> <SEP> Volume <tb> <SEP> Sample <SEP> resistance <SEP> resistivity <tb> <SEP> ##cm <SEP> <tb> non-treated <SEP> 28.3 <SEP> 3.11 <tb> treatment <SEP> 1 <SEP> 10.5 <SEP> 1.16 <tb> treatment <SEP> 2 <SEP> 9.5 <SEP> 1.05 <tb> treatment <SEP> 3 <SEP> 6.6 <SEP> 0.73 <tb> treatment <SEP> 4 <SEP> 8.6 <SEP> 0.95 <tb> As a result of X-ray diffraction on these samples, the non-treated samples showed diffraction peaks corresponding to Cul 8S at diffraction angles 20 of 46.30, 32.l and 27.70, while the treated samples showed reduced diffraction peaks of Cul 8S of the order of the reduction of the resistance and showed new diffraction peaks corresponding to CuS at 28 of 47.80, 31.70 and 29.20. Example 2 The same four samples as in Example 1 were immersed in an aqueous solution of 5% of ammonium polysulfide under conditions as shown in the following Table 2 and then the surface resistance in fiber continuing direction was measured by the same method as described in Example 1 to obtain results as shown in Table 2. Table 2 EMI13.1 <tb> <SEP> Immersing <SEP> Immersing <SEP> Surface <SEP> Volume <tb> No. <SEP> temperature <SEP> time <SEP> resistance <SEP> resistivity <tb> <SEP> 0C <SEP> <SEP> hr <SEP> Q <SEP> <SEP> ()#cm <SEP> <tb> <SEP> 1 <SEP> 25 <SEP> 0.5 <SEP> 11.4 <SEP> 1.25 <tb> <SEP> 2 <SEP> 25 <SEP> 2 <SEP> 6.1 <SEP> 0.67 <tb> <SEP> 3 <SEP> 60 <SEP> 0.5 <SEP> 4.7 <SEP> 0.52 <tb> <SEP> 4 <SEP> 60 <SEP> 2 <SEP> 4.7 <SEP> 0.52 <tb> non-treated <SEP> sample <SEP> 28.3 <SEP> 3.11 <tb> As a result of measurement by X-ray diffraction of the sample treated under the condition No. 4, the peaks of Cu1,8S near 28 of 46.30, 32.10 and 27.7 substantially disappeared, and peaks of CuS at 20 of 47.80, 31.70 and 29.20 clearly appeared. Example 3 To 100 parts by weight of polymer polyol containing 20% of acrylonitrile were added 4.4 parts by weight of water, 48.5 parts by weight of TDI-80 (trade name) and given amounts of foam stabilizer and catalyst to produce a nitrile group-eontaiflingpolyurethane foam with a density of 0.025 g/cm3, from which cell membranes were removed by an explosive process. The thus obtained foam was immersed in an aqueous solution of 15% of sodium hydroxide for 30 minutes, washed with water, dried, subjected to a heat treatment in an aqueous solution containing 0.1 mo#/# of cupric sulfate and 0.1 moQ/Q of sodium thiosulfate at 600C for 60 minutes, washed with water and dried to obtain a greyish black foam. This foam had a volume resistivity of 17.8 n ¯ cm. Then, the foam was immersed in an aqueous solution of 5% of ammonium polysulfide at 600C for 20 minutes, washed with water and dried to obtain a black foam. The latter foam had a volume resistivity of 2.72 Q¯cm. Example 4 A solution of 3.3% of powdery polyacrylonitrile in dimethylformamide was applied to a glass plate, from which a film of 5 pm in thickness was formed by a solvent evaporation process. This film was treated in an aqueous solution containing 0.05 moQ/Q of each of cupric sulfate and sodium thiosulfate at 600C for 90 minutes to obtain an electroconductive film having a volume resistivity of 0.58 # cm. This film was further immersed in a toluene solution of 1% of sulfur and 1% of n-butylamine at 600C for 60 minutes, washed and dried to obtain an electroconductive film having a volume resistivity of 0.09 # cm. Examples 5 and 6 To 100 parts by weight of polymer polyol containing 20% of acrylonitrile were added 4.4 parts by weight of water, 48.5 parts by weight of TDI-80 and given amounts of foam stabilizer and catalyst to form a foam with a density of 0.0250 g/cm3, from which cell membranes were removed by an explosive process. The resulting foam was immersed in an aqeuous solution containing 15% by weight of sodium hydroxide for 60 minutes, washed with water, dried and again immersed in a solution of 39.6 g of cuprous chloride and 8 g of hydrochloric acid in 1 # of water at 600C for 90 minutes (Example 5) or 120 minutes (Example 6). Thereafter, the foam was lightly washed with water, immersed in an aqueous solution of 5% by weight of ammonium polysulfide at 600C for 30 minutes, washed with water and dried. The thus obtained foam turned deep blackish green and had surface resistance (ps) and volume resistivity (pv) as shown in the following Table 3. As a result of measurement by X-ray diffraction, diffraction peaks corresponding to CuS appeared at 26 of 29.2 , 31.70 and 47.80 in all samples. Moreover, the adhesion rate (% by weight) of CuS is shown in Table 3. Table 3 EMI15.1 <tb> <SEP> Immersing <SEP> Adhesion <tb> Example <SEP> time <SEP> in <SEP> rate <SEP> Ps <SEP> pv <tb> <SEP> CuCl2 <SEP> (wt.%) <SEP> (#) <SEP> (##cm) <tb> <SEP> (min.) <SEP> <SEP> (wt.%) <SEP> <tb> <SEP> 5 <SEP> 90 <SEP> 6.9 <SEP> 1.1 <SEP> x <SEP> 102 <SEP> 1.5 <SEP> x <SEP> 102 <tb> <SEP> 6 <SEP> 120 <SEP> 7.7 <SEP> 8.5 <SEP> 1.1 <SEP> x <SEP> 10 <tb> Comparative Example 1 The same foam as used in Example 5 was immersed in an aqueous solution of 15% by weight of sodium hydroxide for 60 minutes, washed with water, dried and immersed in an aqueous solution containing 39.6 g/± of cuprous chloride, 8 g/± of hydrochloric acid and 5% by weight of ammonium polysulfide at 600C for 60 minutes. Then, the thus treated foam was washed with water and dried to obtain a foam having a substantially unchanged color, surface resistance and volume resistivity of not less than 107 and no diffraction peak of CuS as measured from X-ray diffraction. On the other hand, blackish green powder produced in the reaction liquid showed diffraction peaks corresponding to CuS as measured from X-ray diffraction. It is understood from the above that CuS is produced by one-step process but does not adhere to the surface of the foam. Example 7 A flexible ether-series polyurethane foam with a size of 10 cm x 10 cm x 1 cm, whose cell membrane were removed by an explosive process, was immersed in an aqueous solution of 15% by weight of sodium hydroxide for I hour, washed with water, immersed in 500 cc of an aqueous solution of 0.10 moQ/Q of cupric sulfate at 600C for 60 minutes and then held in the same solution further containing 500 cc of an aqueous solution of 0.10 mo±/± of sodium thiosulfate at 600C for 60 minutes. The thus treated foam was washed with water and dried to obtain a blackish brown foam having a volume resistivity of 7.6 x 102 n cm. Then, this foam was immersed in an aqueous solution of 5% by weight of ammonium polysulfide at 600c for 30 minutes, washed with water and dried to obtain a blackish green foam having a volume resistivity of 1.7 x 102 Q cm. This shows that the electro- conductivity is improved by the sulfurization treatment. As a result of measurement by X-ray diffraction, the foam before the treatment with ammonium polysulfide showed diffraction peaks corresponding to Cul 8S at 26 of 46.30, 32.10 and 27.7 , while the foam after the treatment with ammonium polysulfide showed diffraction peaks at 20 of 47.80, 31.70 and 29.20, which corresponded to CuS. Example 8 An open-cell, flexible ester series polyurethane foam was treated by the same procedure as described in Example 7. As a result, the foam after the treatment with cupric sulfate and sodium thiosulfate was blackish brown and had a volume resistivity of not less than 107 R¯cm, while the foam after the treatment with ammonium polysulfide turned blackish green and had a volume resistivity of 2.4 x 102 R¯cm. Further, the latter foam clearly showed diffraction peaks of CuS as measured from X-ray diffraction. Example 9 The same flexible ester series polyurethane foam as used in Example 8 was treated by the same procedure as described in Example 7, except that the foam was first immersed in an aqueous solution containing 0.10 mol/l of cupric sulfate and 0.10 moQ/Q of sodium thiosulfate while gradually warming from room temperature to 600C and holding at 600C for 60 minutes. The foam after the treatment with cupric sulfate and sodium thiosulfate was blackish brown and had a volume resis tivity of not less than 107 n ¯ cm, while the foam after the treatment with ammonium polysulfide turned blackish green and had a volume resistivity of 9.6 x 10 n cm. Example 10 A flexible polyurethane foam with a density of 0.028 g/cm3 was prepared by adding 15 parts by weight of polyvinyl chloride to 100 parts by weight of polyol and then foaming it in the usual manner, from which a sample foam having a size of 10 cm x 10 cm x 1 cm was cut out. The sample foam was immersed in a solution of 25 g of cupric sulfate in 1,500 g of water at 600C for 60 minutes, and then a solution of 223 g of sodium thiosulfate in 500 g of water was added at 600C, in which was further immersed the foam for 90 minutes. Thereafter, the foam was taken out from the solution, washed with water and dried to obtain a deep blackish green foam. In the latter foam, the increment of weight was 11.2% and the volume resistivity was as low as 1.19 # cm. As a result of measurement by X-ray diffraction, peaks corresponding to CuS appeared at 20 of 29.20, 31.70 and 47.80 (X-ray used : CuKa). Example 11 A flexible polyurethane foam having a density of 0.0200 g/cm3 (hereinafter referred to as foam A) was prepared by adding 15 parts by weight of polyvinyl chloride to 100 parts by weight of polyol and then foaming in usual manner. This foam was immersed in a solution of 25 g of cupric sulfate and 199 g of sodium thiosulfate in 2,000 g of water, while gradually warming from room temperature to 600C, for 150 minutes. After the immersion treatment, the foam A was washed with water and dried to obtain a deep blackish green foam A. The foam A had an increment of weight of 6.74% and a volume resistivity of 2.05 x 10-2 Q¯cm and showed peaks corresponding to CuS as measured from X-ray diffracton. Moreover, the electroconductive foam A was subjected to a burning test according to a method of MVSS No. 302.. As a result, the burning rate was 87 mm/min, which showed that the polyvinyl chloride containing polyurethane foam after the sulfurization treatment had excellent flame retardant property. Example 12 The same foam A as used in Example 11 was immersed in a solution of 125 g of cupric sulfate in 500 g of water at 600C for 60 minutes. Then, a solution of 112 g of sodium thiosulfate in 500 g of water was added to the above solution at 600C, and the foam was further immersed therein for 90 minutes. Thereafter, the foam was washed with water and dried to obtain a blackish green foam having an adhesion rate (increment of weight) of 9.04% and a volume resistivity of 3.3 n cm. Furthermore, the foam showed peaks corresponding to CuS as measured from X-ray diffraction. Example 13 The same foam A as used in Example 11 (size 10 cm x 10 cm x 1 cm) was immersed in a solution of 79.2 g of cuprous chloride and 32 g of hydrochloric acid in 2,000 g of water at 600C for 120 minutes, lightly washed with water, dehydrated, immersed in an aqueous solution of 5% by weight of ammonium polysulfide at 600C for 30 minutes, washed with water, and dried to obtain a blackish green foam. This foam had an adhesion rate (increment of weight) of 10.1% and a volume resis tivity of 7.3 x 103 Q cm and showed peaks corresponding to CuS as measured from X-ray diffraction. As previously mentioned in detail, according to the invention, the cuprous compound adhered to the polar group-containing high polymeric substrate can directly be changed into cupric sulfide by sulfurization reaction with the solution of sulfur releasable substance. That is, according to the invention, the polymer substrate is immersed in an aqueous solution containing a bivalent copper compound and a reducing agent or an aqueous solution containing a monovalent copper compound and at the same time or subsequently treated in a solution of sulfur releasable substance, so that the electroconductive articles comprising cupric sulfide as an electroconductive layer can be efficiently produced with a high adhesion rate. Further, the number of treating steps can be reduced as compared with the prior art, and also the amount of the treating waste liquid can be made small, so that the invention has considerable advantages in industry. Moreover, the electroconductive articles according to the invention have excellent characteristics, so that they are very useful for wide applications.

Claims: CLAIMS 1. An electroconductive article characterized by comprising a polar group-containing high polymeric substrate, and an electroconductive layer of cupric sulfide. 2. An electroconductive article as claimed in claim 1, characterized in that the said polar group is selected from nitrile, urethane, urea, amido, hydroxyl, ether and ester groups. 3. An electroconductive article as claimed in claim l or 2, characterized in that the said high polymeric substrate is selected from nitrile group-containing polymers, polyvinyl chloride containing polyurethanes, polyamides, polyesters, polyethers and polyvinyl alcohols. 4. An electroconductive article as claimed in any claims 1 to 3, characterized in that the amount of cupric sulfide adhered to the said high polymeric substrate is not less than lt t ,weight. 5. An electroconductive article as claimed in claim 4, characterized in that the amount of cupric sulfide adhered to the said high polymeric substrate is 3 to 30S by weight. 6. A method of producing an electroconductive article, characterized by immersing a polar group containing high polymeric substrate in an aqueous solution containing a bivalent copper compound and a reducing agent or an aqueous solution containing a monovalent copper compound, and at the same time or subsequently treating it in a solution of a sulfur releasable substance. 7. A method as claimed in claim 6, characterized in that the said polar group is selected from nitrile, urethane, urea, amido, hydroxyl, ether and ester groups. 8. A method as claimed in claim 6 or 7, characterized in that the said high polymeric substrate is selected from nitrile group-containing polymers, polyvinyl chloride containing polyurethanes, polyamides, polyesters, polyethers and polyvinyl alcohols. 9. A method as claimed in any of claims 6 to 8, characterized in that the said bivalent copper compound is selected from cupric sulfate, cupric chloride, cupric nitrate, cupric acetate and cupric oxalate. 10. A method as claimed in any of claims 6 to 9, characterized in that the said reducing agent is selected from metallic copper, ferrous sulfate, sodium hypophosphite, hydroxylamine or a salt thereof, ammonium vanadate, furfural and glucose. 11. A method as claimed in any of claims 6 to 10, characterized in that the said monovalent copper compound is selected from cuprous chloride, cuprous iodide, cuprous cyanide and cuprous thiocyanate. 12. A method as claimed in any of claims 6 to 11. characterized in that the amount of cuprous compound adhered to the said high polymeric substrate is not less than 1% by weight. 13. A method as claimed in any of claims 6 to 12, characterized in that the said sulfur releasable substance is selected from elemental sulfur, sodium thiosulfate, sodium sulfide, sodium hydrogensulfite, sulfurous acid, sodium dithionite, dithionous acid, ammonium sulfide, potassium sulfide, ammonium polysulfide, sodium polysulfide, potassium polysulfide, sulfur dioxide and hydrogen sulfide. 14. A method as claimed in any of claims 6 to 13, characterized in that the concentration by molar ratio of sulfur in the said solution of sulfur releasable substance is not more than 3 times the concentration of cuprous compound in the immersion solution. 15. A method as claimed in any of claims 6 to 14, characterized in that the amount of cupric sulfide adhered to the said high polymeric substrate is not less than 1% by weight. 16. A method as claimed in claim 15, characterized in that the amount of cupric sulfide adhered to the said high polymeric substrate is 3 to 30% by weight.

Inventors: AOKI, MASAMI, KITAMURA, TAKASHI, OHASHI, TAKASHI
Applicants: BRIDGESTONE CORPORATION
Application year: 1985
Main classification: H01B1
IPC codes: H05K9, H05B6, H01B1