PROCESS FOR PRODUCING POLYAMIDE FILM

Abstract: A process for producing polyamide film comprising melt-extruding a polyamide resin which contains a metal compound and which has a melting resistivity of less than 1.5 × 10⁵ ohms.cm at 260°C into a film, bringing said melt-extruded film into intimate contact with a rotary quenching roll electrostatically, and drawing said film as it is quickly quenched and solidified. The film thus obtained exhibits markedly increased adhesiveness electrostatically. Therefore, even if the drawing speed of the rotary quenching roll is increased, no air is trapped between the roll and the film. Hence, a film is obtained having uniform thickness and increased clarity.

Description: Field of the Invention The present invention relates to a process for preparing a polyamide film having excellent uniformity of thickness with high efficiency. Background of the Invention A polyamide film is widely applied to the field of various wrappings which make use of its characteristics such as toughness, impact resistance, proof against pinholes, barrier property against oxygen and the like. In recent years, a demand for a polyamide film increases with the growth of retort foods so that it is desirable to provide a film having a high quality and a low price. Methods of preparing a polyamide film conventionally include inflation method and melt extrusion method through T-die method. In case that a polyamide film is obtained by T-die method, a molten film extruded through a die is casted onto a cooling revolving roller. At this time, in order to make a film and a cooling revolving roller come closely into contact, there are carried out some methods that air is sprayed through an air-knife (hereinafter referring to "air-knife method"), a charge is educed on a molten film to contact the film by static electricity (hereinafter referring to "static electricity contact method"), and the like. However, casting through such air-knife method and static electricity contact method rolls up air between a cooling revolving roller and a film by reason of an accompanying air current which is caused by revolution in a high haul-off speed so that a uniform film can not be obtained. The static electricity contact method, which is, for example, disclosed in Japanese Patent Publication No. 6142/1962, is a method wherein an electrode, for example, which has wire type, is inserted between a die and a cooling roller to provide a static charge for a film article, so that the film article is closely contacted onto the cooling roller with static electricity whereby uniformity of thickness and transparency of a formed film are improved. According to such method, a molten extruded film article is closely contacted onto a cooling roller by static electricity to be cooled, and hence, there can be efficiently obtained a thermoplastic resin film. Further, as to a polyamide resin, there is disclosed a cooling method for a polyamide type thermoplastic polymer film which characterized by subjecting a film to corona discharge at a condition of streama corona discharge, educing of a charge on a molten film and contacting it closely onto a cooling revolving roller with static electricity (cf. Japanese Patent Laid Open Publication No. 17559/1980, which corresponds to a Japanese Serial No. JP-A-5517559 and also to US-A-4,268,464). This document relates to a process for preparing a polyamide type film by melt-extrusion and electrostatic pinning, but does not disclose any addition of metal compound to the polyamide and subsequent decrease in melt specific resistance which leads to improvement of film-forming properties. It is also known that this method is successful for a synthetic resin having a melt specific resistance of not more than 6.0 x 10⁶ Ωcm (cf. Japanese Patent Laid Open Publication No. 105930/1981). However, such method has also insufficient adhesion when a revolution velocity of a cooling roller is raised for growth of production efficiency, so that air is rolled up between a sheet and a cooling revolving roller at a partial area. At that area, the heat transfer between a cooling roller and a sheet is decreased to produce inequality of cooling effect among sufficient contact areas and insufficient contact areas so that uniformity of thickness and transparency of a sheet article become remarkably worse to damage a value of an article. Moreover, when a sheet is subsequently subjected to uniaxial or biaxial orientation, it may be impossible to produce a film or a sheet itself because of breakage of a sheet in a stretching stage. It is an object of the present invention to provide an art for preparing a polyamide resin sheet with a high speed and high efficiency and without a damage of uniformity of thickness and transparency through overcoming of the defects of such prior art. Summary of the Invention According to the present invention, there is provided a process for preparing a polyamide film which comprises melt-extruding, in a form of a film, a polyamide resin having a metal compound dissolved therein, said metal compound being incorporated in an amount of 0.0005 to 10 % by weight based on the weight of the polyamide resin so that the resulting polyamide resin has a melt specific resistance of not more than 1.5 X 10⁵ Ωcm at 260°C, contacting the melt-extruded film closely with a cooling revolving roller through static electricity and taking up the film with cooling rapidly to solidify, and a process for preparing an oriented polyamide film which comprises further stretching the resulting film at a ratio of not less than 1.1 times in at least one direction. According to the present invention, there can be obtained a polyamide film having an excellent uniformity of thickness and transparency with high efficiency. The present invention enables a polyamide type resin to have a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C to improve an adhesion based on static electricity remarkably by incorporating a suitable amount of compounds into a polyamide type resin so that there can be obtained an unoriented polyamide film and an oriented polyamide film having an excellent uniformity of thickness with high efficiency. A polyamide type resin containing no metal compound usually have a melt specific resistance at 260 °C of 1 x 10⁵ Ωcm to 5 x 10⁵ Ωcm for nylon 6, nylon 66 and polymethaxylyleneadipamide, and 5 x 10⁵ to 10 x 10⁵ Ωcm for nylon 12, which are included in a thermoplastic synthetic resin having a melt specific resistance of not more than 6.0 x 10⁵ Ωcm disclosed in Japanese Patent Laid Open Publication No. 105930/1981. However, it has been found that a polyamide resin containing a metal compound having a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C has remarkable increased adhesion through static electricity in comparison with a starting material polyamide having no metal compound. Detailed Description of the Invention The polyamide type resins used in the present invention include nylon 6, nylon 66, nylon 12, polymethaxylyleneadipamide homopolymer or copolymer, and the like. In addition, there can be used a thermoplastic polyamide having an ability to form a film. These polyamide resins usually have a melt specific resistance of more than 1 x 10⁵ Ωcm at 260 °C when they have no metal compound. These polyamide may be used in an admixture thereof. Further, these resins may also have a small amount of organic and inorganic compounds such as other resins, a lubricant, an anti-static agent, a colorant and the like. The metal compounds used in the present invention include halides, oxygen acid compounds of sulfur, oxygen acid compounds of phosphorus, hydroxides, organic carboxylic acid salts, organic sulfonic acids of alkali matals, alkaline earth metals, aluminium group element, transition metals, and the like, particularly sodium chloride, lithium chloride, potassium chloride, magnesium chloride, calcium chloride, aluminium chloride, zinc chloride, copper chloride, cobalt chloride, sodium bromide, lithium bromide, magnesium bromide, potassium iodide, sodium iodide, sodium sulfate, magnesium sulfate, zinc sulfate, sodium phosphate, potassium phosphate, sodium phosphite, sodium hypophosphite, potassium hypophosphite, sodium hydroxide, lithium hydroxyde, sodium stearate, potassium stearate, magnesium stearate, calcium stearate, aluminium stearate, zinc stearate, potassium oleate, sodium acetate, potassium acetate, sodium benzoate, sodium laurylsulfonate, sodium benzensulfonate, ethylene ionomer, and the like. In addition to the above, there may be directly bound a metal base with a polyamide chain by incorporating a compound containing a metal base having an ability to form an amide bond such as 5-sodium sulfoisophthalate. In the present invention, there can be used any polyamide having a metal compound therein and a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C, and the metal compounds are not limited to the above. As to metals having small ionization potential such as alkali metals, alkaline earth metals and the like, there can be used a simple substance per se. These metal compounds are incorporated in an amount of 0.0005 to 10 % by weight (in a metal content of 0.0003 to 3 % by weight, preferably 0.0003 to 0.5 % by weight) based on the weight of the polyamide resin so that there can be obtained the polyamide resin having a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C. When the amount of the metal compound is less than 0.0005 % by weight, it shows less improved adhesion with static electricity. When the amount of the metal compound is over than 10 % by weight, it induces undesirable lower properties of the film. However the present invention is not limited by the range itself of the amount of the incorporated metal compound. The metal compound may be incorporated by any methods such as adding it into a starting monomer before polymerization, adding it during polymerization, adding it on an extraction stage, adding it during the drying of pellets. It is essential that the metal compound is contained in the resulting melt-extruded polyamide resin, and the present invention is not limited by the method for adding. For contacting the film with a cooling revolving roller through static electricity in the present invention, it is preferable to subjecting the film to a corona discharge in a form of strema corona to educe the charge (cf. Japanese Patent Laid Open PUblication No. 17559/1980). However, the present invention is not limited only to such method, and there can be employed an apparatus which disposes an usual high potential charge electrode closer to a molten film to give charge, an apparatus for contacting by using static electricity with an air-knife, and an apparatus which educes the charge contrary to a high potential charge electrode on a cooling revolving roller by covering the cooling revolving roller with a dielectric material, and the like. The polyamide resin containing a metal compound and having a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C has improved adhesion of molten resin by static electricity onto the cooling revolving roller of these apparatus in comparison with a polyamide resin containing no metal compound. The take-up rate of an unoriented film in the present invention is not particularly limited. When the take-up rate is increased, a uniform unoriented film can not be obtained by rolling up of air between the cooling revolving roller and the molten film. When a conventional polyamide resin containing no metal compound and having a melt specific resistance of not less than 1.5 x 10⁵ Ωcm is taken-up onto a cooling revolving roller through static electricity method, the maximum take-up rate is usually 10 to 20 m/minute, on the other hand, the present invention prevents rolling up of air between the cooling revolving roller and the molten film at a rate of over the above maximum rate to give an unoriented film having an uniform thickness. The unoriented polyamide film per se is preferably used for wrapping of foods. Further, the unoriented polyamide film is preferably stretched at a ratio of not less than 1.1 times in one direction, more preferably each 2.0 to 5.0 times in two directions intersected at a right angle to give a biaxial oriented film so that the film is preferable for various wrapping films because of its further improved mechanical strength, transparency and oxygen barrier property. When a polyamide type resin obtained from lactam and aminocarboxylic acid such as nylon 6 is used as polyamide of the present invention, an extraction stage for a monomer and an oligomer is required during a stage of preparing a raw material. In such case, when the polymerization is carried out after incorporating of a metal compound into a polymerization raw material, the metal compound may be partially eluted to decrease adhesion by static electricity. In such case, it is rather preferable to add a metal compound after polymerization The methods for incorporating of the metal compound include a method in which a metal compound is directly incorporated into a polyamide type resin in a rotary dryer and the like, a method in which other polyamide containing a metal compound is incorporated, and a method in which an ethylene type ionomer resin is incorporated. When the metal compound is directly incorporated, a stable adhesion by static electricity may not be obtained because of localizing of the metal compound, and hence, it is preferable to incorporate other polymers having a metal compound and an ethylene type ionomer resin so as to obtain uniform melt specific resistance. Alternatively, when a metal base is chemically bound with a main chain of a polyamide resin, an improved adhesion by static electricity is preferably maintained even after extraction stage. Among polyamide resins, a polyamide type resin having an aromatic residue has more improved adhesion by static electricity than that of an aliphatic polyamide resin. However, nylon 6 and nylon 66 have most economical advantage so that they are widely used. It is preferable to copolymerize aromatic diamine, dicarboxylic acid or aminocarboxylic acid with nylon 6 and nylon 66 because of improved adhesion by static electricity. The adhesion by static electricity is improved with lower melt viscosity of used polyamide. In view of mechanical strength of a product and operation efficiency on preparing of a film, however, melt viscosity is preferable in a range of 250 to 4000 poise at 270 °C. It is more preferable that melt viscosity is in a range of 400 to 1800 poise, but the present invention is not limited to such range. As is seen from Examples, the polyamide resin the melt specific resistance of which becomes not more than 1.5 x 10⁵ Ωcm by incorporating the metal compound according to the present invention has remarkable improved adhesion by static electricity in comparison with that of a polyamide type resin with no metal compound, and hence, increasing of take-up rate of the cooling revolving roller does not cause a rolling up of air between the roller and the film, so that it produces a film having excellent uniformity in thickness and transparency. By using of this film, there can be also obtained an uniaxial or biaxial oriented film having excellent uniform thickness and transparency. The present invention is illustrated by the following Examples. The melt specific resistance of the resin in the present invention was calculated through a formula: ρ (specific resistance) = (S/L) x (V/I) by using a current value after 1 to 5 seconds when a stainless steel electrode was inserted into a molten resin maintained at 260 °C to give a continuous current of 100 V. In the above formula, ρ is specific resistance (Ωcm), S is area (cm²) of an electrode, L is a distance between electrodes (cm), V is voltage (V), and I is current (A). In the measurement of the present Examples, S was 0.12 cm² and L was 1.5 cm. A relative viscosity of resins in the present Examples was measured as follows: The resin was dissolved into sulfric acid (96.3 % conc.) to give a concentration of the resin of 1.0 g/100 ml, and a relative viscosity of the resulting mixture was measured through ostward viscosity meter in a constant temperature bath at 20 °C. A melt viscosity was measured at a temperature of 270 °C through Khoka type flow tester under the conditions of orifice diameter, orifice length and load in such a manner as to make a shear rate of 100 to 200 sec⁻¹. As a sample for measurement, the resin just before the measurement of maximum take-up rate was used. A melt viscosity was calculated through a following formula: wherein η (poise) is melt viscosity, a (cm) is orifice diameter, L (cm) is orifice length, P (dyne/cm²) is load and A (g/sec) is output of the resin. Each maximum take-up rate in the Examples is the maximum rate at which rolling up of air between a cooling revolving roller and a molten film can be prevented under following condition: the resin was extruded in a form of a film by an extruder with a screw having a diameter of 90 mm⊘ through T-die at 260 to 280 °C and casted onto a cooling revolving roller at 10 to 20 °C, and the resulting molten film was provided with charge from a high potential electrode and was contacted closely onto the cooling revolving roller, after which the take-up rate of the cooling revolving roller was increasing gradually. Example 1 Into a nylon 6 pellet, which has a relative viscosity of 2.6 and contains as a slipping agent 0.4 % by weight of silicon dioxide having an average particle size of 3 µm was added a trisodium phosphate 12 hydrate in a rotary vacuum dryer in such a manner as to be contained 0.05 % by weight based on the weight of the nylon 6, and the resulting resin was dried, after which the resin was extruded in a form of a film through a T-die with screw extruder having a diameter of 90 mm onto a roller at 20 °C. In such time, rolling up of air was not caused between the resin and the cooling revolving roller until the maximum take-up rate of 60 m/min so that there was obtained a transparent unoriented film having less uneveness in thickness. The resin had a melt specific resistance of 5.7 x 10⁴ Ωcm at 250 °C. Examples 2 and 3 In the same manner as described in Example 1, magnesium-bromide or zinc chloride was added in an amount in the following table and the resulting resin was subjected to casting test. Until the maximum take-up rate in the following table 1, rolling up of air between the resin and the cooling revolving roller was prevented. Reference Example 1 Into a nylon 6 being the same as those of Examples 1 to 3 which has a relative viscosity of 2.6 and contains 0.4 % by weight of silicon dioxide having an average particle size of 3 µm was dried in a rotary vacuum dryer without an addition of a metal compound, after which the resulting resin was subjected to casting test as same as in Example 1. At a take-up rate of 35 m/min, air was rolled up between the resin and the cooling revolving roller, and uneveness in thickness and opaque points were caused. The resin had a melt specific resistance of 1.8 x 10⁵ Ωcm. Example 4 A polymethaxylyleneadipamide having a relative viscosity of 2.1, which was obtained by incorporating methaxylylenediamine (440 parts by weight) and adipic acid (470 parts by weight) with trisodium phosphate 12 hydrate (1 parts by weight) and water (450 parts by weight) and subjecting to polycondensation, was extruded through T-die at 260°C in the same manner as described in Example 1 to effect casting test. As a result, rolling up of air between a resin and a cooling revolving roller was not caused at a take-up rate of over 65 m/min, and unoriented film with a uniform thickness and a good transparency was obtained. The melt specific resistance of this resin was 3.9 x 10⁴ Ωcm. Reference Example 2 Polymethaxylyleneadipamide containing no metal compound and having a relative viscosity of 2.1 was obtained in the same manner as described in Example 4, except that trisodium phosphate 12 hydrate was not added in the polycondensation. This resin was extruded through T-die at 260°C in the same manner as Example 1 and subjected to the casting test. As the result, air was rolled up between a resin and a cooling revolving roller at a take-up rate of 40 m/min and scoreline pattern was found on the resulting film. The melt specific resistance of this resin was 1.6 x 10⁵ Ωcm. Example 5 and Reference Example 3 Nylon 12 pellet having a relative viscosity of 2.1 alone or the pellet mixed with 0.4 % by weight of sodium stearate to dry was respectively subjected to the casting test in the same manner as Example 1. Each product was free from rolling up of air between a resin and a cooling revolving roller at the take-up rate up to the value shown in Table 1. Example 6 Polymethaxylyleneadipamide having a melt specific resistance of 0.23 x 10⁵ Ωcm and a relative viscosity of 2.1 was obtained by incorporating of methaxylylenediamine (440 parts by weight) and adipic acid (470 parts by weight) with trisodium phosphate 12 hydrate (5 parts by weight) and water (450 parts by weight), and subjecting to polycondensation. Then, a pellet of the above polymethaxylyleneadipamide (10 parts by weight) containing trisodium phosphate was incorporated into a pellet of polycapramide (100 parts by weight) containing 0.4 % by weight of silicon dioxide having an average particle size of 3 µm as a slipping agent and having a relative viscosity of 2.6, dried and mixed in a rotary vacuum dryer. Using of the resulting pellet, the maximum take-up rate was defined. It was free from rolling up of air between a cooling revolving roller and a molten film at a take-up rate of up to 55 m/min. The melt specific resistance of this resin was 5.5 x 10⁴ Ωcm. Example 7 (Synthesis of a polyamide resin containing a metal compound) To nylon salt (600 parts by weight) which was obtained from adipic acid and hexamethylenediamide were added water (400 parts by weight) and stearic acid (3 parts by weight), which was subjected to polycondensation to obtain nylon 66 having a melt specific resistance of 0.14 x 10⁵ Ωcm at 260 °C and a relative viscosity of 2.6. Then the maximum take-up rate was defined using the pellet which was obtained by adding a pellet of the above nylon 66 (6 parts by weight) containing the above sodium stearate with a pellet of polycapramide (100 parts by weight) containing 0.4 % by weight of silicon dioxide having an average particle size of 3 µm as a slipping agent and having a relative viscosity of 2.6, drying and mixing in a rotary vacuum dryer. As a result, air was not rolled up between a cooling revolving roller and a molten film at the rate up to 55 m/min. The melt specific resistance of this resin was 0.54 x 10⁵ Ωcm. Reference Example 4 Polymethaxylyleneadipamide having a melt specific resistance of 2.2 x 10⁵ Ωcm at 260°C and a relative viscosity of 2.1 was obtained by incorporating methaxylylenediamine (440 parts by weight) and adipic acid (470 parts by weight) with water (450 parts by weight) and subjecting to polycondensation. Then, the maximum take-up rate was defined using a pellet which was obtained by adding the above polymethaxylyleneadipamide (10 parts by weight) with a pellet of polycapramide (100 parts by weight) containing 0.4 % by weight of silicon dioxide having an average particle size of 3 µm as a slipping agent and having a relative viscosity of 2.6, drying and mixing in a rotary vacuum dryer. As the result, air was incorporated between a cooling revolving roller and a molten film at a take-up rate of 37 m/min and scoreline pattern and some opaque portion were observed. The melt specific resistance of this resin was 2.0 x 10⁵ Ωcm. Example 8 Ionomer resin (1.5 parts by weight, produced by Mitsui Polychamical KK, Trade name: Hi-miran 1605) was added to a pellet of polycapramide (100 parts by weight) containing silicon dioxide having an average particle size of 3 µm (0.4 wt%) as a slipping agent and having a relative viscosity of 2.6, dried and mixed in a rotary vacuum dryer. Using of the resulting pellet, the maximum take-up rate was defined. It was free from rolling up of air between a cooling revolving roller and a molten film at a take-up rate of up to 59 m/min. The melt specific resistance of this resin was 5.5 x 10⁴ Ωcm. Example 9 Ionomer resin (3 parts by weight, produced by Mitsui Polychamical KK, Trade name: Hi-miran 1601) was added to a pellet of nylon 12 (100 parts by weight) having a relative viscosity of 2.1, dried and mixed in a rotary vacuum dryer. Using of the resulting pellet, the maximum take-up rate was defined. It was free from rolling up of air between a cooling revolving roller and a molten film at a take-up rate of up to 45 m/min. The melt specific resistance of this resin was 1.2 x 10⁵ Ωcm. Example 10 Ring opening polymerization was carried out by adding 0.5 parts by weight of an aqueous nylon salt solution (conc. 25 % by weight) from sodium sulfoisophthalate and hexamethylendiamine to obtain a pellet of nylon 6. Residual lactam was extracted with hot water to give a pellet of nylon 6 containing less than 1.0 % by weight of an extractable component, having a melt specific resistance of 5.4 x 10⁴ Ωcm at 260°C and a relative viscosity of 2.6. The maximum take-up rate was defined by using of the pellet dried and mixed in a rotary vacuum dryer. It was succeeded in preventing of rolling up of air between a cooling revolving roller and a molten film at the take-up rate of up to 57 m/min. Example 11 Ring opening polymerization was carried out by adding 100 parts by weight of ε-caprolactam and 5 parts by weight of an aqueous solution (conc. 25 % by weight) of hexamethylenediamine salt of sodium sulfoisophthalate to obtain a pellet of nylon 6. Residual lactam was extracted with hot water to give a pellet of nylon 6 containing less than 1.0 % by weight of an extractable component, having a melt specific resistance of 0.16 x 10⁵ Ωcm at 260°C and a relative viscosity of 2.6. The maximum take-up rate was defined by using a pellet which was obtained by adding the above pellet (5 parts by weight) to a pellet of nylon 6 having a melt specific resistance of 1.9 x 10⁵ Ωcm at 260°C and a relative viscosity of 2.6 (100 parts by weight) and drying and mixing in a rotary vacuum dryer. It was succeeded in preventing of rolling up of air between a cooling revolving roller and a molten film at a take-up rate of 57 m/min. The melt specific take-up rate of this resin was 5.3 x 10⁴ Ωcm. Example 12 An aqueous nylon salt solution of methaxylylenediamine (6.9 parts by weight) and adipic acid (7.4 parts by weight) in hot water (14.3 parts by weight) was added to ε-caprolactam (100 parts by weight), which was subjected to polycondensation reaction at 180 - 240 °C under pressure, then at 240 - 270 °C under the ambient pressure to give a pellet of a copolymerized polyamide type resin having a relative viscosity of 2.6. The pellet was treated with hot water to extract the residual lactam. Then the maximum take-up rate was defined by using a pellet which was obtained by incorporating of trisodium phosphate 12 hydrate (0.05 parts by weight) into the above pellet (100 parts by weight), mixing and drying in a rotary vacuum dryer. It was succeeded in preventing incorporation of air between a cooling revolving roller and a molten film at the rate of up to 59 m/min. The melt specific resistance of this resin was 5.9 x 10⁴ Ωcm. Example 13 An aqueous nylon salt solution of methaxylylenediamine (13.8 parts by weight) and adipic acid (14.8 parts by weight) in hot water (28.6 parts by weight) was added to ε-caprolactam (100 parts by weight), which was subjected to polycondensation reaction at 180 - 240 °C under pressure, then at 240 - 270 °C under the ambient pressure to give a pellet of a copolymerized polyamide resin having a relative viscosity of 2.6. The pellet was treated with hot water to extract the residual lactam. Then the maximum take-up rate was defined by using a pellet which was obtained by incorporating of trisodium phosphate 12 hydrate (0.05 parts by weight) into the above pellet (100 parts by weight), mixing and drying in a rotary vacuum dryer. It was succeeded in preventing incorporation of air between a cooling revolving roller and a melting film at the take-up rate up to 62 m/min. The molten specific resistance of this resin was 6.1 x 10⁴ Ωcm. Example 14 Trisodium phosphate 12 hydrate (1 % by weight) was added to a pellet of nylon 6 having a melt viscosity of 1,400 poise and dried and mixed in a rotary vacuum dryer. The resulting pellet was extruded through a biaxial extruder to give a pellet. Further, the pellet (5 parts by weight) was added to the pellet (100 parts by weight) of nylon 6 having melt viscosity of 1,400 poise and dried and mixed in a rotary vacuum dryer, which was used to define the maximum take-up rate. As the result, the incorporation of air between a cooling revolving roller and a molten film was prevented at the rate up to 60 m/min. The melt specific resistance of this resin was 5.7 x 10⁴ Ωcm. Examples 15 and 16 In the same manner as described in Example 1, except that nylon 6 having a melt viscosity of 900 and 2,500 poise was respectively used instead of the pellet of nylon 6 having a melt viscosity of 1,400, the maximum take-up rate was defined. As the result, incorporation of air between a cooling revolving roller and molten film was prevented at the rate up to 65 m/min and 53 m/min. The melt specific resistance of these resins were 5.5 x 10⁴ Ωcm and 5.9 x 10⁴ Ωcm, respectively. Example 17 Unoriented films having a even thickness without incorporation of air between the resin and the cooling revolving roller, and unoriented film having a scorelines with incorporation of air between the resin and the cooling revolving roller, which were obtained in Examples 1 - 3, 6 - 8, 10 - 16 and Reference Example 1, were respectively stretched lengthwise through a pair of rollers having a different peripheral speed at 70 °C and stretch ratio of 3.5. Then, the resulting films were stretched transversely with a tenter at 100 °C at the ratio of 3.7, and further subjected to heat-set at 200 °C to give a film of biaxially oriented nylon 6. As the result, the unoriented films without rolling up of air afforded biaxially oriented films, while the unoriented films with rolling up air were broken in a tenter and hardly give a biaxially oriented film. And the thicknesses of the unoriented film were 150 - 200 µm, and those of the biaxially oriented films were 12 - 16 µm.

Claims: A process for preparing a polyamide type film which comprises melt-extruding, in a form of a film, a polyamide resin having a metal compound dissolved therein, said metal compound being incorporated in an amount of 0.0005 to 10 % by weight based on the weight of the polyamide resin so that the resulting polyamide resin has a melt specific resistance of not more than 1.5 × 10⁵Ωcm at 260°C, contacting the melt extruded film closely with a cooling revolving roller through static electricity and taking up the film with cooling rapidly to solidify. A process for preparing a polyamide type film according to claim 1, the polyamide resin is a composition composed of 100 parts by weight of a polyamide resin which main repeating unit is capramide and 0.01 to 30 parts by weight of a polyamide resin having a metal compound and a melt specific resistance of not more than 1.0 x 10⁵ Ωcm at 260 °C. A process for preparing a polyamide type film according to claim 1, the polyamide resin is a polyamide type resin composed of 2 to 20 % by weight of aromatic aminocarboxylic acid residue, aromatic dicarboxylic acid residue and/or aromatic diamine residue and 98 to 80 % by weight of aliphatic aminocarboxylic acid residue, aliphatic dicarboxylic acid residue and/or aliphatic diamine residue, and having a metal compound and a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C. A process for preparing a polyamide type film according to claim 1, the polyamide resin is a composition composed of 1 to 100 parts by weight of polyamide type resin (A) bound with a metal base on a main chain thereof and 99 to 0 parts by weight of polyamide type resin (B) having a melt specific resistance of not less than 1.5 x 10⁵ Ωcm at 260 °C. A process for preparing a polyamide type film according to claim 1, wherein the polyamide resin is a composition which is obtained from incorporating of 0.1 to 10 % by weight of an ethylene type ionomer resin into a polyamide resin. A process for preparing a polyamide type film according to claim 1, the polyamide resin is a polyamide type resin having a metal compound, a melt specific resistance of not more than 1.5 x 10⁵ Ωcm at 260 °C and a melt viscosity of 250 to 1800 poise at 270 °C. A process for preparing a polyamide type film according to claim 1, 2, 3, 4, 5 or 6, which further comprises stretching the resulting film at a ratio of not less than 1.1 times in at least one direction.

Inventors: HAMANO, AKITO, KUZE, KATSUAKI, MAKIMURA, OSAMU, MATSUO, MAKI, NAGAYASU, EIICHI, SUZUKI, HAJIME, TAKEUCHI, KUNIO
Applicants: TOYO BOSEKI KABUSHIKI KAISHA
Application year: 1985
Main classification: B29C47
IPC codes: B29C47, B29C55