SEMICONDUCTOR DEVICE COMPRISING A SUPPORT BODY

Abstract: A transistor chip (1) is secured directly on to a metal plate (2), the collector of the transistor chip making direct electrical contact with the plate (2). In order to minimise the area of the plate (2) the emitter terminal (6) is arranged to overlie the collector terminal (7) with an intervening ceram­ ic insulating layer (3). The base terminal (4) is separated from the other terminals by the chip (1) and is secured to an insulating layer (3) which in turn is secured to the plate (2). All the terminals have upright extensions for providing ex­ ternal connection. The device is normally enclosed in a resin material except for connecting portions of the upright terminal extensions.

Description: "SEMICONDUCTOR DEVICE" The present invention relates to semiconductor devices and in particular to such devices in which semiconductor elements are mounted on electrically conductive plates intended to act as heat sinks. A conventional device is shown in Fig. 1 and here a semiconductor element in the form of a transistor has three terminals. More particularly,a transistor chip 1 is brazed on to a metal plate 2 commonly used as a heat sink such that the collector of the transistor makes electrical contact with the plate 2. A base electrode on the upper surface of the chip 1 is connected to the upper surface of a base terminal 4 (by means of an aluminium wire 5) fixed to the plate 2 but insulated from the latter by means of a ceramic board 3. The emitter electrode is connected (by means of an aluminium wire 5) to the upper surface of an emitter terminal 6 fixed to but insulated from the plate 2 by means of a ceramic board 3. On the other hand, since the collector is connected to the plate 2, a collector terminal 7 is brazed directly on to the plate 2 in a position spaced from the flank of the chip 1. Both the base and emitter terminals 4,6 are bent so as to extend perpendicularly to major surfaces of the plate 2 and one end of each of the terminals is arranged to protrude from a sealing resin (not shown) for enclosing (encapsulating) and protecting the chip 1. The protruding terminal portions can then be utilized to make contact with an external circuit. In this case, the portion of the collector terminal 7 secured to the plate 2 needs a certain length% to provide secure adhesive strength, so that the plate 2 must be long enough to accommodate the collect terminal 7 so that the area occupied by the semiconductor device is relatively large. It is an object of the present invention to provide a semiconductor device arranged to make optimum use of its area. According to this invention there is provided a semiconductor device comprising a support body having an electrically conductive surface to which is secured a semiconductor element having a plurality of electrodes one of which is in direct electrical contact with said conductive surface which is electrically connected to a first terminal portion, and another of which electrodes has an electrical connection to a second terminal portion overlying and supported by, but insulated from, said first terminal portion, said terminal portions having extended portions for external connection of the device. Embodiments of this invention will now be described, by way of example, with reference to the accompanying drawing in which: Fig. 1 is a perspective view of a conventional semiconductor device prior to encapsulation; Fig. 2 is a perspective view of a first form of semiconductor device embodying this invention and prior to encapsulation; and Fig. 3 is a side view of a second form of semiconductor device embodying this invention and prior to encapsulation. In Fig. 2 like reference characters designate like or corresponding portions or elements to those of the device shown in Fig. 1. The device shown in Fig. 2 comprises a similar arrangement to that shown in Fig. 1 except in that a collector terminal 7 is brazed on to the plate 2 along the edge portion of the plate opposite the edge portion carrying the base terminal 4 with the chipl positioned between the two edge portions. The emitter terminal 6 is secured to an electrically insulating ceramic board 3 secured on to the collector terminal 7 In this case, one end of the insulating board 3 is slightly exposed since the emitter terminal stops sufficiently short of upright terminal portion 71 of the collector terminal 7 to maintain insulation between the emitter and collector terminals. The terminals 4,6,7 are bent to extend upright from the relevant major surface of the plate 2 as in the device shown in Fig. 1, but in the device shown in Fig. 2 the terminal portions 61,71 have their major surfaces at right angles to each other and the upright portion 71 of the collector terminal is positioned substantially opposite the portion 61 of the emitter terminal 6. In the device shown in Fig. 2, the upright terminal portion 71 is arranged to emerge laterally from the collector terminal 7. However, as shown in Fig. 3, the upright portion 71 may be provided with its major surfaces parallel with and directly opposite the upright portion 61 of the emitter terminal. In either case, it is possible to arrange for the emitter terminal 6 to be connected to the emitter electrode by means of an aluminium wire 5 as in the conventional device. In the semiconductor device thus constructed, the length of the plate 2 needs to be only slightly greater than the length of the semiconductor chip 1 and may thus be effectively shortened by a length L compared with the device shown in Fig. 1. The embodiments described above are highly effective in making compact electronic devices because the size of the plate for supporting the semiconductor element in the semiconductor device, that is, the area occupied by the semiconductor device can be minimized by laying the terminal connected to the electrode on the exposed surface of the semiconductor element, over the terminal directly connected to the plate with an intervening layer of insulating material between the terminals. The present invention may also be applicable to other semiconductor devices such as thyristors having three terminals or those with four terminals such as transistors in Darlington pair connection. The embodiments described above thus each provide a semiconductor device comprising a support body (2) having an electrically conductive surface to which is secured a semiconductor element (1) having a plurality of electrodes one of which is in direct electrical contact with said conductive surface which is electrically connected to a first terminal portion (7), and another of which electrodes has an electrical connection (5) to a second terminal portion (6) overlying and supported by, but insulated (3) from, said first terminal portion (7), said terminal portions having extended portions (61,71) for external connection of the device.

Claims: CLAIMS:- 1. A semiconductor device comprising a support body having an electrically conductive surface to which is secured a semiconductor element having a plurality of electrodes one of which is in direct electrical contact with said conductive surface which is electrically connected to a first terminal portion, and another of which electrodes has an electrical connection to a second terminal portion overlying and supported by, but insulated from, said first terminal portion, said terminal portions having extended portions for external connection of the device. 2. A semiconductor device according to claim 1 wherein the semiconductor element has a third electrode electrically connected to a third terminal portion overlying and supported by, but insulated from, said conductive surface. 3. A semiconductor device according to claim 2 wherein said semiconductor element lies between said first and third terminal portions. 4. A semiconductor device according to claim 3 wherein said semiconductor element is a transistor and said third electrode is the base electrode. 5. A semiconductor device according to any one of the preceding claims wherein said first terminal portion comprises a conductive strip element secured to the conductive surface. 6. A semiconductor device according to any one of the preceding claims wherein said extended portions extend substantially perpendicularly relative to said conductive surface. 7. A semiconductor device according to any one of the preceding claims wherein said first terminal portion is a strip portion having a lateral extension forming said extended portion. 8. A semiconductor device according to any one of claims 1 to 6 wherein said first and second terminal portions are strip portions having their extended portions at opposite ends. 9. A semiconductor device according to any one of the preceding claims wherein said support body is a metal plate arranged to act as a heat sink.

Inventors: NIHEI, KAZUYA
Applicants: FUJI ELECTRIC CO., LTD.
Application year: 1984
Main classification: H01L23
IPC codes: H01L23