MEASURING TRANSDUCER, IN PARTICULAR FOR MEDICAL APPLICATIONS

Abstract: A measuring transducer for medical applications com­ prises a two part housing (6, 7) with a fluid inlet (1) and a fluid outlet (2) along a common axis (4). A solid state sensor chip is exposed with its sensing portion (19) to the fluid. Another portion of the sensor chip is sealed against the fluid and is provided with electrically conductive connector pads (22). The sensor chip (8) is held in a first part (6) of the housing and a second part (7) is in sealed contact with the first part and closes a chamber (11) in which the sensing portion (19) is exposed to the fluid. Electrical connectors (10) are provided in the first part (6) of the housing and are adapted to connect the connector pads (22) of the sensor chip (8) to an external circuitry. In case of a solid state pressure sensor, the chip (8) is fixed to a substrate (17) having a coefficient of thermal expansion matched to the coefficient of the sensor chip.

Description: Measuring Transducer, in particular for Medical Applications The invention relates to a measuring transducer which in particular is useful for medical applications such as extra corporal measuring of pressure, oxygen content or other physical or chemical properties. It is the main object of the invention to disclose a disposable and inexpensive, but nevertheless, reliable and accurate transducer which can be reliably cleaned and pre-sterilized, can be easily at tacked to a fluid tubing, and can be used in connection with different diagnosis, patient monitoring or therapy equipment such as infusion apparatus, respirators or other equipment for medical care. These objects are achieved by the invention as characterized in claim 1. Forming the housing of two parts supporting the sensor chip between them, facilitates sealing of the transducer and simultaneously provides mechanical protection of the sensitive transducer element or sensor against mechanical stress, in particular during transport, storage and installation. Preferred modifications and improvements are described in the subclaims. For a better understanding reference is made to the attached drawings in which two embodiments of the transducer are shown as follows: Figure 1 shows a top view of the transducer and Figure 2 a sectional view along Line Il-Il in Figure 1. Figure 3 shows a perspective view of the upper part of the housing and Figure 4 the lower part of the housing with the sensor chip and adjusting circuitry in serted. Figure 5 shows an enlarged sectional view through a first embodiment showing part of Figure 2 with the sensor chip and the means for sealing the two parts of the housing. Figure 6 is an orthogonal view along sectional line VI-VI in Figure 5. Figures 7 and 8 are a similar showing of a second embodi ment. As best can be seen from Figure 1 the housing has a T-shaped configuration consisting of a fluid inlet 1, a fluid outlet 2 and a central box-like part 3 which extends rectangularly with respect to the common axis 4 of inlet 1 and outlet 2. Sensor housing 3 has a fluid passage 5 which is aligned with inlet 1 and outlet 2 forming a straightforward fluid channel through which the fluid under measurement can be passed. Sensor housing 3 consists (see Figure 2) of a first or bottom part 6 and a second or cover part 7. The first part 6 supports the sensor chip 8, a thin film or thick film substrate 9 and electrical connectors 10 which in the shown embodiment are pin connectors but could also be cable connectors or other electrical connecting means to external circuitry. The second part 7 of the housing is provided with the cylindrical fluid channel 5 extending along the same axis 4 as inlet 1 and outlet 2 and therewith forming a straight fluid passage. The second part 7 of the housing closes two chambers 11 and 12 formed between the two parts 6 and 7 of the housing. Chamber 11 communicates with passage 5 and in one of its wall portions the sensing portion of sensor chip 8 is exposed to the fluid entering inlet 1. The other chamber 12 is sealed against chamber 11 and contains he thin film or thick film substrate 9 which has provided thereon several adjusting resistors which can be trimmed with respect to their resistance either by laser trimming or sandblasting before the two parts of the housing are fixed together. Cover part 7 further has an opening 13 to the outside which may be used as a vent opening or as a filling hole for filing chamber 12 with epoxy resin or other electrically isolating fill protecting the adjusting resistors and the circuitry on film substrate 9, which may also include an amplifier. If the sensor chip contains a solid state pressure sensor in the form of a silicon diaphragm with integrated strainsensitive resistors, bottom porti±x# 6 is provided with an opening 14 communicating with the bottom side of the sensing portion of sensor chip 8 and therewith forming a vent opening for the pressure sensor. Instead of electrical connectors 10 in the form of connector pins, a cable might be directly fixed, preferrably cast to bottom part 6 of the housing and its wires cast into this bottom part. Connector pins 10 are electrically connected by wires 15 to the circuitry on film substrate 9. In the case of a cable being directly cast into housing part 6, the end portions of the cable wires can be soldered to substrate 9. Flexible connecting wires 16 provide electrical connection between the sensor chip 8 and the thin film or thick film substrate 9. The configuration of the transducer permits to use the same housing for different types of sensors such as pressure sensor, oxygen sensor or sensors for other physical or chemical properties of a fluid flowing from inlet 1 to outlet 2 of the housing. When used for medical applications, a reliable electrical isolation between the elec trical circuitry and the flowing fluid is an essential requirement. With reference to Figures 5 to 8 two embodirents of the detailed structure of the sensor chip, its supporting substrate and the electrical and fluid tight isolating means will be described. For maintaining a good fluid tight and electrical isolation, it is important that in particular in case of a pressure sensing chip no mechanical stress at the border surfaces between the sensor chip and the housing is generated during operation. Such stress could be generated by changing temperatures or temperature differences or by mechanical forces. In order to prevent any mechanical influence of this kind acting upon the sensor chip and its condition sensitive portions, the sensor chip 8 in Figures 5 to 8 is supported by a substrate 17 having about the same coefficient of thermal expansion as the sensor chip 8. As the sensor chip mainly consists of silicon having a linear expansion coefficient of 30 x 10 7 mm/mm#C, this substrate 17 preferrably consists of silicon or FeNiCo (50 x 10 mm/mm C) or Pyrexglass (33 x 10 mn/mnoC) or Ni-Fe 36 (16 x 10 mn/mmOC). Even a substrate made of stainless steel (130 x 10 7 mm/mrn0C) might be useful. The substrate can also consist of silicon or ceramics. If a metallic substrate is used, the corrosion durability of the metal can be improved by galvanic treatment and heating the substrate in reducing atmosphere. For fixing the sensor chip 8 to the substrate 16 suitable adhesives may be used or in the case of a pyrex glass substrate, the polished surfaces of the chip and of the pyrex glass substrate are brought into intimate contact by electrostatical forces at a temperature below the transformation temperature of the glass so that diffusion between the two parts will take place. Substrate 17 carries sensor chip 8 and in Figure 5 is provided with a passage 18 connecting the lower side of pressure-sensitive silicon diaphragm 19 to space 12. This space 12 via opening 13 (see Figure 2) communicates with the atmosphere. Instead of hole 13 a channel could be provided in parallel to con nectar pins 10. A fluid tight sealing between fluid chamber 11 and chamber 12 is achieved by inserting a silicon rubber ring 20 between those front surfaces of housing parts 6 and 7 which surround fluid chamber 11. Instead of a separate silicon rubber ring 20, a ring of silicon rubber adhesive or another type of adhesive may be used for achieving a fluid tight engagement between the two parts of the housing. In addition the engaging surfaces 21 of the two parts of the housing are either fixed to each other by an appropriate adhesive or by ultrasonic welding. The silicon rubber sheet or adhesive ring 20 provides good electrical isolation of the fluid against the electrical circuitry on film substrate 9 and the connections to the external circuitry. For connecting the sensor chip 8 to the circuitry on film substrate 9 connector pads 22 are provided on sensor chip 8 and are by means of flexible and therewith strain-free wires 16 electrically connected to the circuitry on film substrate 9. In the second embodiment shown in Figures 7 and 8 the space 12 above film substrate 9 is filled with a casting resin 23, e.g. epoxy resin for protecting the resistors on substrate 9 and the associated circuitry and connecting wires. In order to expose the bottom side of pressuresensitive diaphragm 19 to the atmosphere channel 18a in supporting substrate 17a in this case extends downward and ports into hole 14 extending through the base portion 6 of the housing. The surface of sensor chip 8 which is exposed to the fluid, i.e. in particular sensing portion 19, is covered by an electrically insulating layer 24 in order to maintain electrical safety of a patient during defibrillation or other electrical treatment. In case of a pressure sensor the venting channels 14, 18 can also be used for calibrating the sensor at different pressures and/or temperatures. The thick film or thin film resistors on film substrate 9 are used for balancing and calibrating the transducer and for this purpose can be changed with respect to their resistance value either by laser trimming or sandblasting. If the sensor chip 8 is not responsive to pressure but to another physical or biological condition such as oxygen content, the linear expansion matched substrate 17 and the venting openings 14, 18 can be deleted. The sensor chip 8 then can merely be mounted in a trough-shaped portion of part 6 of the housing.

Claims: Claims: 1. Measuring transducer, in particular for medical applica tions, comprising a housing with a fluid inlet (1) and a solid state sensor chip (8) located in said housing, characterized in that a) a sensing portion (19) of the sensor chip (8) is ex posed to the fluid; b) another portion of the sensor chip (8) is sealed against the fluid and is provided with electrically conductive connector pads (22); c) the sensor chip (8) is held in a first part (6) of the housing; d) a second part (7) of the housing is in sealed contact with said first part (6) and closes a chamber (11) in which the sensor chip (8) is exposed to the fluid; e) electrical connectors (10) are provided in the first part (6) of the housing and are adapted to connect the connector pads (22) of the sensor chip (8) to an external circuitry. 2. Transducer according to claim 1, c h a r a c t e r i z e d i n t h a t both parts (6, 7) of the housing are fixed to each other and sealed against each other by means of an adhesive, preferably silicon rubber. 3. Transducer according to claim 1, c h a r a c t e r i z e d i n t h a t both parts (6, 7) of the housing are fixed to each other and sealed against each other by means of a sealing material (20), preferably silicon rubber, and by ultrasonic welding along the edges (21) of the two parts. 4. Transducer according to one of claims 1 to 3, c h a r a c t e r i z e d i n t h a t the first part (6) of the housing (6, 7) supports a thick film or thin film substrate (9) with adjusting resistors and/or signal con verting circuitry thereon, whereat strain-free wire con nections (16) are provided between the circuitry on said film substrate (9) and the connector pads (22) of the sensor chip (8). 5. Transducer according to claim 4, c h a r a c t e r i z e d i n t h a t the connector pads (22) are provided on a portion of the sensor chip (8) which extends into a space (12) of the housing in which the film sub strate (9) is located. 6. Transducer according to claim 5, c h a r a c t e r i z e d i n t h a t the connector pads (22) and the film substrate (9) are covered by an electrically isolat ing layer. 7. Transducer according to claim 6, c h a r a c t e r i z e d i n t h a t the isolating layer is part of an epoxy resin fill (23) of said space (12). 8. Transducer according to one of claims 1 to 7, in par ticular pressure sensor comprising a solid state pressure sensor, c h a r a c t e r i z e d i n t h a t the sensor chip (8) is fixed to a substrate (17) having a coefficient of thermal expansion matched to the co efficient of the sensor chip and said substrate (17) is held in the first part (6) of the housing. 9. Transducer according to claim 8 with a pressure sensitive chip, c h a r a c t e r i z e d i n t h a t the sensing portion (19) of the sensor chip (8) is covered by an electrically insulating layer (24). 10. Transducer according to claims 8 or 9, c h a r a c t e r i z e d i n t h a t the sensor substrate (17) comprises a hole (18) or¯channel (18a) communicating with that side of the sensor chip (8) which is not exposed to the fluid. 11. Transducer according to claim 10, c h a r a c t e r i z e d i n t h a t the hole (18) or chan#e1'#Y8t## communicates with the ambient space outside the housing (6, 7). 12. Transducer according to one of claims 1 to 11, c h a r a c t e r i z e d i n t h a t the sensor sub strate (17) consists of glass or ceramics. 13. Transducer according to one of claims 1 to 11, c h a r a c t e r i z e d i n t h a t a sensor substrate (17) consists of metal. 14. Transducer according to one of claims 1 to 13, c h a r a c t e r i z e d i n t h a t the inlet (1), the outlet (2) and a straight fluid channel (5) in the second part (7) of the housing are aligned along a common axis (4). 15. Transducer according to claim 4, c h a r a c t e r i z e d i n t h a t a box-shaped part of the housing (6, 7) enclosing the sensor chip (8), the film substrate (9) and the electrical connectors (10), projects away from said axis (4).

Inventors: KUYPERS, MARTINUS HENRICUS
Applicants: PPG HELLIGE B.V.
Application year: 1984
Main classification: G01L9
IPC codes: A61B5, G01L9, G01L19