TAPED SEMICONDUCTOR ELEMENTS

Abstract: A structure of a tape of consecutive semiconductor elements is constructed so that each of N consecutive semiconductor elements from the nth element to the (n + N-1)th element has a characteristic within a predetermined characteristic deviation range, and also each of N consecu­ tive elements from the (n + 1 )th element to the (n + N)th element has a characteristic within that characteristic devia­ tion range. Thus, when assembling a circuit or device using N elements starting from an element at any desired position, e.g., when using N elements from the nth element to the (n + N-1)th element, if, for example, the nth element is defective because of an error in mounting or another problem, it is possible to assemble the circuit or device using the N elements from the (n + 1 )th element to the (n + N)th element.

Description: DESCRIPTION TITLE OF THE INVENTION TAPING BODY OF SEMICONDUCTOR PARTS TECHNICAL FIELD This invention relates to a taping body of semiconductor parts in which various kinds of semiconductor parts, for example, semiconductor variable capacitance elements, so-called variable capacitors are aligned on a tape and packed, namely, so-called taped. BACKGROUND ART In VHF and UHF tuners of, for example, a television receiver, a plurality of variable capacitors are used in one tuner. In this case, it is desired that the C-V characteristics of the variable capacitors used in the same tuner are made as uniform as possible, and the characteristics are requested to lie within a predetermined deviation value. Accordingly, in the variable capacitors of this kind, their C-V characteristics are measured and variable capacitors of N number, for example, 4 to 8 necessary for one tuner are grouped into a set by N number each, for example, 4 with their characteristics lying within a predetermined deviation value. That is, the variable capacitors of N number, for example, 4 in each group are so grouped that their C-V characteristics lie within the predetermined deviation value and every grouped unit is assembled into one circuit or instrument, for example, a tuner, When small assembly parts such as variable capacitors of this kind is handled, if they are individually handled, the handling of these assembly parts become complicated and bad goods are caused during the handling thereof. Therefore, to avoid these defects, to facilitate and to make the work be carried out automatically in which each group of parts as mentioned above is assembled into one circuit or instrument of various kinds, as shown by a schematic cross-sectional view in Fig. 1, a taping body is employed, in which a plurality of semiconductor parts 3, for example, variable capacitors are aligned and packed with a predetermined spacing, namely, so-called taped. This taping body is-such one in which as, for example, shown in Fig. 1, semiconductor parts 3, for example, variable capacitors are gripped between resin tapes 1 and 2 having flexibility, the both tapes 1 and 2 are pressed to each other on the parts surrounding the variable capacitors and the parts 3 are each aligned with the predetermined spacing in the longitudinal direction of the tapes 1 and 2 are then packaged. In such a taping body 4, for example, 2400 parts are aligned in it, and this taping body 4 is wound around a reel 5 as shown in Fig. 2. Upon assembling circuits or instruments, the taping body 4 is supplied from this reel 5. The semiconductor parts 3 aligned on the taping body 4 are sequentially taken out from their packaged places in the arder of the alignment and then mounted on a predetermined portion thereby to assemble various circuits or instruments. In this case, in the taping body 4, the parts 3 the characteristics of which lie within the predetermined characteristic deviation value are aligned such that those with the number necessary for one circuit or instrument, for example, N are aligned as a set (group) and these are separately aligned at every groups G1 G2 ¯¯¯ as shown in Fig. 3. Between adjacent groups G1 and G2 ¯'. are provided portions E1, E2 in which the parts 3, for example, are not packaged or attached with marks and the like whereby the parts are indicated at each group. In Fig. 3, reference numeral 6 designates a feeding perforation corresponding to a so-called sprocket which is used to move the taping body 4 in its longitudinal direction. When each of the parts packed in the taping body 4 is mounted, each group is assembled into one circuit or instrument. In the taping body thus made, the characteristics of the respective assembly parts are selected to lie within the predetermined deviation value only within each group, and the mutual characteristics of the parts between the adjacent groups, for example, the part disposed at the end of one group and the part disposed at the beginning of the adjoining group are not taken into consideration. As a result, the characteristics thereof do not always lie within the predetermined deviation value. Therefore, when the taping body of semiconductor parts of such kind is used to assemble and produce the circuit or the instrument, if any one part within one group becomes a defective product due to mis-mounting or the like, other parts of (N - 1) number in this group have to be abandoned and the parts of other group have to be used. OBJECT OF INVENTION This invention is to provide a taping body of semiconductor parts capable of removing such loss of parts and troublesome handling. DISCLOSURE OF INVENTION According to this invention, in a taping body in which semiconductor parts are sequentially taped, if the number of the semiconductor parts assembled into one circuit or one instrument is taken as N, the parts are so taped that the characteristic of each of the semiconductor parts of N number succeeding from an n-th one to (n+N - l)-th one may lie within a predetermined characteristic deviation value and the characteristic of each of the semiconductor parts of N number succeeding from an (n+l)-th one to an (n+N)-th one may lie within the predetermined characteristic deviation value. Further, in this invention; the taping treatment is carried out such that the characteristic of each of the semiconductor parts of N number succeeding from an n-th one at the end of a first taping body having a predetermined length to an (n+N-l)-th one at the beginning of a second taping body having a predetermined length may lie within a predetermined characteristic deviation value and that the characteristic of each of the semiconductor parts of N number succeeding from an (n+ l)-th one of the first taping body to an (n+N)-th one of the second taping body may lie within the predetermined characteristic deviation value. BRIEF DESCRIPTION OF DRAWINGS Fig. 1 is a schematic cross-sectional view useful for explaining a taping body of semiconductor parts; Fig. 2 is a perspective view illustrating a state that the taping body is wound around a reel; Fig. 3 is a plan view illustrating a main part of a prior art taping body of semiconductor parts; and Fig. 4 is a plan view of a main part of an embodiment of a taping body of semiconductor parts according to the present invention. BEST MODE FOR CARRYING OUR THE INVENTION In this invention, as, for example, shown in Fig. 4, similarly to Fig. 1, the semiconductor parts 3, for example, the variable capacitors are aligned between the two resin tapes 1 and 2 having flexibility with a predetermined spacing along the longitudinal direction of each of the tapes 1 and 2. The tapes 1 and 2 are then laminated by, for example, hot press at their portions surrounding the parts 3 to thereby carry out the alignment packaging, namely, the taping. In the figure, reference numeral 14 designates the whole of the taping body of the semiconductor parts of this invention. When a circuit or instrument to be assembled is, for example, a tuner of a television receiver, the number of the semiconductor parts 3, for example, the variable capacitors used in one tuner ranges from 4 to 8 and the characteristic of each of variable capacitors used in the same tuner has to lie within a capacity deviation value ranging from, for example, 2.5 to 3.5 %. In this case, according to this invention, regarding variable capacitors of N number adjacent to one another in the taping body 14, the respective variable capacitors 3 each having the characteristic lying within the above capacity deviation value of 2.5 to 3.0% are aligned. The variable capacitors are selected such that when adjacent N variable capacitors are taken out from any of the places in the alignment, the characteristic of each variable capacitor lies within the capacity deviation value ranging from 2.5 to 3.0%. For example, let us consider the semiconductor parts 3 which are serially arrayed in the rìght-hand direction in Fig. 4. When semiconductor parts of N number are used as one unit, the parts of N number succeeding from an n-th one to an (n+N-l)-th one are selected from the semiconductor parts having the characteristics which lie within the predetermined characteristic deviation value. Further, regarding the semiconductor parts of N number succeeding from an (n+l)-th one to an (n+N)-th one, the semiconductor parts having the characteristic which lie within the predetermined deviation value are aligned. That is, the semiconductor parts are selected and then aligned such that any of adjacent N parts 3 may have the characteristic which lie within the predetermined deviation value. Further, this taping body 14 having the predetermined length is wound around one reel as mentioned before. When a large number of circuits or instruments in which these parts 3 are used, regarding a plurality of reels which are used in sequence, succeeding N parts from the parts 3 at the end side of one reel to those at the beginning side of the following reel are similarly selected to have their characteristics lying within the predetermined deviation value. In this invention, the parts are not grouped into a set at every N parts which are used as one unit in each taping body 14 but the parts 3 are serially aligned and then taped. While the characteristics of the parts 3 which are aligned and packaged with such alignment relation are measured beforehand, in practice, regarding semiconductor elements cut out from the same wafer, the semiconductor elements adjacent to each other on the wafer have an inclination that their characteristics are approximated to each other. Therefore, when the array relation among the respective semiconductor elements on the wafer is considered and the elements which are adjacent to each other are sequentially taken out, it is possible to select the elements the characteristics of which are approximated to each other. Accordingly, it is relatively easy to take out and array the elements whose characteristics lie within the above deviation value. The measurement of C-V characteristic of this part 3, for example, the variable capacitors is carried out after a large number of elements formed on the semiconductor wafer are separated by pelletizing the wafer, a separated one is bonded on, for example, a header or casing having two terminals and subjected to resin mold as required so as to provide the parts 3. The C-V characteristic is such one that capacity values C of each element under such conditions as being supplied with predetermined voltages, for example, 2V, 7V, 12V, 14V, 20V, 25V and so on are measured. The elements having the measured values lying within the above predetermined deviation value are taken out and taped. In accordance with the taping body 14 of the semiconductor parts of this invention, upon assembling various circuits, instruments and so on, if parts of N number which are adjacent to each other are sequentially used as each unit, it is possible to assemble various circuits or instruments which have the predetermined characteristics. While, for example, when the parts of N number from N-th one to (n +N - th one are assembled into a circuit or instrument, if the n-th one, for example, becomes defective due to the mis-mount or the like, regarding the set of N number, it is not necessary to exclude parts of (N -11 number succeeding from (n+ l)-th one to (n+N-l)-th one unlike the prior art but the parts of N number counting from (n+ l)-th one, namely, up to (n+N)-th one. are used to be-asseibled into the circuit or the instrument. That is, it is possible to save the parts of (N-l) number succeeding from (n+l)-th one to (n+N-l)-th one. Therefore, according to this invention, it is possible to reduce the number of parts which may not be used and left in the taping body, with the result that the efficient assembling and the decrease of the manufacturing cost can be expected.

Claims: CLAIMS 1. A taping body of semiconductor parts in which semiconductor parts are sequentially taped, wherein charachteristic of each of said semiconductor parts of N number succeeding from an n-th one to an (n+N- l)-th one lies within a predetermined characteristic deviation value and characteristic of each of said semiconductor parts of N number succeeding from an (n+ 1) -th one to an (n+N)-th one lies within said predetermined characteristic deviation value, 2. A taping body of semiconductor parts according to claim 1, in which characteristic of each of said semiconductor parts of N number succeeding from an n-th one positioned at the end of a first taping body having a predetermined length to an (n + N - 1) -th one at the beginning of a second taping body having a predetermined length lies within a predetermined deviation value and characteristic of each of said semiconductor parts of N number succeeding from an (n+l)-th one of said first taping body and to an (n+Nl-th one of said second taping body lies also within said predetermined characteristic deviation value.

Inventors: IGARASHI, TSUTOMU, MATSUMOTO, SHIGEO
Applicants: SONY CORPORATION
Application year: 1984
Main classification: H05K13
IPC codes: H05K13, B65B15