Low thermal expansion resin material for a wiring insulating film.

Abstract: A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Description: This invention relates to a method for producing a wiring insulating film and an alpha-ray shielding layer for a large-scale integrated circuit, multi-layer wiring board and a memory element, respectively; the wiring insulating film and the alpha-ray shielding being obtained from a low thermal expansion resin material comprising a polyimide having a special chemical structure and being oriented. Organic polymers have by far larger coefficients of thermal expansion (coefficient of linear expansion), for example 4 x 10⁻⁵ K⁻¹ or larger in most cases, even at a temperature range below the glass transition temperature compared with metals and inorganic materials. Problems caused by such large coefficients of linear expansion of organic materials are remarkably numerous. It may be said therefore that all the reasons for not progressing as desired in applications and development of organic polymers are based on these problems. For example, in the case of coating, when an organic polymer is coated on a metal plate or inorganic material having a very small coefficient of thermal expansion compared with the organic polymer, there take place deformation, cracks of the film, peeling off, of the film, breaking of substrate due to thermal stress caused by differences in coefficients of thermal expansion. For example, when a coating film is formed on a silicon wafer as a protective film for LSI (large-scale integrated circuit) or IC (integrated circuit), the wafer is warped, which results in making photolithography for patterning impossible, making resolving power extremely worse, or in the case of large thermal stress, peeling a passivation film, or sometimes causing cleavage and breaking of silicon wafer per se. As mentioned above, there are a large number of problems caused by the large coefficient of linear expansion of organic polymers and there have long been desired organic polymers having a low thermal expansion coefficient. Under such circumstances, the present inventors have studied in detail the relationship between chemical structure and the thermal expansion coefficient by using many heat resistant resin materials, particularly by using various polyimides synthesized. There have been provided various kinds of polyimides, but practically synthesized or used ones are very small. Heretofore, practically synthesized, reported or marketed polyimides are those obtained by using as raw materials an aromatic diamine such as diaminodiphenyl ether, diaminodiphenylmethane, para-phenylenediamine or diaminodiphenyl sulfide, and a tetracarboxylic dianhydride such as pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride, tetracarboxydiphenyl ether dianhydride, or butanetetracarboxylic dianhydride. But these polyimides have a remarkably large coefficient of linear expansion of 4 to 6 x 10⁻⁵ K⁻¹. But the present inventors have found that polyimides having an extremely small linear expansion coefficient and remarkably excellent tensile strength compared with those mentioned above can be obtained from a special aromatic diamine and a tetracarboxylic dianhydride mentioned below. Due to their extremely small linear expansion coefficients these polyimides can be advantageously used for the production of a wiring insulating film and alpha-ray shielding film for large-scale integrated circuit memories as large-scale integrated circuit, multi-layer wiring board and memory element. JP-557805 and US-P 3,179,633 are directed to polyimides, specific ones of them having the particular structure of the polyimides used in the present invention. However, these documents give no indication as to the thermal expansion coefficient of polyimides at all nor to the problem arising by the production of composite shaped articles composed of organic or inorganic materials nor to the method of the present invention for producing a wiring insulating film or an alpha-ray shielding layer for large-scale integrated circuit memories. It is an object of this invention to provide a method for producing a wiring insulating film and alpha-ray shielding layer for large-scale integrated circuit memories described above obtained from a low thermal expansion resin material having an extremely small thermal expansion coefficient corresponding to that of an inorganic material such as a metal, ceramic or glassy material as well as excellent mechanical properties. This invention provides a method for producing a wiring insulating film to a large-scale integrated circuit (LSI) comprising coating a solution of a polyamic acid on a desired portion of the LSI, drying the solution and converting the polyamic acid into polyimide to form the wiring insulating film, characterized in that the polyimide has as repeating unit at least one member selected from the group consisting of: Furthermore there is provided a method for producing a wiring insulating film as defined above for a multi-layer wiring board comprising a wiring and layers of the wiring insulating film, a method for producing an alpha-ray shielding layer for a memory element comprising a semi-conductor element and an alpha-ray shielding layer coated on said semi-conductor element comprising coating a solution of polyamic acid on a desired portion of the semi-conductor element, drying the solution and converting the polyamic acid into polyimide to form alpha-ray shielding layer, said polyimide being the same as defined above. Fig. 1 is a graph showing coefficients of thermal expansion of various materials. Fig. 2 is a cross-sectional view of LSI having a multi-layer wiring structure. Fig. 3 is a cross-sectional view of a memory element having an α-rays shielding layer. Fig. 4 is a cross-sectional view of a metal core wiring board mounting a film-carrier type LSI. Fig. 5 is a cross-sectional view of a metal-plate-based printed circuit mounting a LSI bonded by lead wire. Fig. 6 is a graph showing properties of the polyimides used in this invention. Fig. 7 is a graph showing the behavior of thermal expansion for No. D1. Fig. 8 is a graph showing the behavior of thermal expansion for No. A2. Fig. 9 is a graph showing the behavior of thermal expansion for No. A3. Fig. 10 is a graph showing the behavior of thermal expansion for No. F3 Fig. 11 is a graph showing coefficients of thermal expansion for polyimides. Fig. 12 are diffractograms for bifix-cured polyimides. Fig. 13 are diffractograms for A3 films. And Fig. 14 are drawings showing conformations of polyimides. The chemical structure as main chain of the low thermal expansion polyimide of this invention includes, for example, the following units : wherein R is an alkyl group, a fluorinated alkyl group, an alkoxy group, a fluorinated alkoxy group, an acyl group or a halogen; ℓ is zero or an integer of 1 to 4; m is zero or an integer of 1 to 2; and n is zero or an integer of 1 to 3. The low thermal expansion resin material described in this invention has lower thermal expansion, higher strength, higher elasticity and higher heat resistance than other polymers, even if the molecular arrangement of the resin material is random. When the resin material of this invention is subjected to a molecular orientation treatment, these properties are by far improved. Generally speaking, aromatic polymers are rigid but disadvantageously brittle, In order to make the whole polymer flexible, there is introduced a flexible bond such as -O-, -S-, -(CH₂) p - (p is an integer of 1 or more), -(CF₂) p -, or the like thereinto. Alternatively, when the bonding position of aromatic rings takes at an O- or m-position, the whole polymer becomes flexible. The same things can be applied to polyimides. Polyimides now industrially produced have bondings selected from the above-mentioned ones. Such polyimides have a high thermal expansion coefficient. Thus, they are not well suited for the production of a wiring insulating film and an alpha-ray shielding layer for large-scale integrated circuit memories based on the grounds of the above. The low thermal expansion polyimides of this invention include the following repeating units: wherein R, ℓ, m and n are as mentioned above; and k is zero or an integer of 1 to 3. Fig. 1 is a graph showing thermal expansion coefficients of various materials. As shown in Fig. 1, general organic polymers have larger thermal expansion coefficients than metals and ceramics, but the oriented polyimide of this invention has a clearly smaller thermal expansion coefficient compared with the general organic polymers. That the thermal expansion coefficient is as small as those of inorganic materials such as metals and ceramics means that when the resin material is used in combination with these inorganic materials, there take place no thermal stress nor warfage due to the same dimensional change upon temperature changes: this is very important from an industrial point of view. It is not too much to say that the most important defect of conventional organic materials is that the thermal expansion coefficient of the organic materials are by far larger than that of the inorganic materials. The low thermal expansion polyimide used for this invention can be produced by polymerization of an aromatic aminodicarboxylic acid derivative, or by reaction of an aromatic diamine or an aromatic diisocyanate with an aromatic tetracarboxylic acid derivative. The derivative of tetracarboxylic acid means an ester, an acid anhydride, an acid chloride, or the like. Considering the synthesis process, the use of an acid anhydride is preferred. The polymerization can generally be carried out at 0 to 200°C in a solvent such as N-methylpyrrolidone (NMP), dimethyl formamide (DMF), dimethyl acetamide (DMAC), dimethyl sulfoxide (DMSO), dimethyl sulfate, sulfolane, butyrolactone, cresol, phenol, halogenated phenol, cyclohexane, dioxane, etc., alone or as a mixture thereof. Examples of the aromatic aminodicarboxylic acid derivative are 4-aminophthalic acid, 4-amino-5-methylphthalic acid, 4-(p-anilino)-phthalic acid, 4-(3,5-dimethyl-4-anilino)-phthalic acid, esters thereof, acid anhydrides thereof, acid chlorides thereof, etc. These aminodicarboxylic acid derivatives can be used alone or as a mixture thereof. Examples of the aromatic diamine are p-phenylenediamine, 2,5-diaminotoluene, 2,5-diaminoxylene, diaminodurene, 2,3,5,6-tetramethyl-p-phenylenediamine, 2,5-diaminobenzotrifluoride, 2,5-diaminoanisole, 2,5-diaminoacetophenone, 2,5-diaminobenzophenone, 2,5-diaminodiphenyl, 2,5-diaminofluorobenzene, benzidine, o-tolidine, m-tolidine, 3,3',5,5'-tetramethylbenzidine, 3,3'-dimethoxybenzidine, 3,3'-di(trifluoromethyl)benzidine, 3,3'-diacetylbenzidine, 3,3'-difluorobenzidine, octafluorobenzidine, 4,4''-diaminoterphenyl, 4,4'''-diaminoquaterphenyl, etc. These diamines can be used alone or as a mixture thereof. It can also be possible to use diisocyanate compounds of these aromatic diamines. Examples of the aromatic tetracarboxylic acid derivatives are pyromellitic acid, methylpyromellitic acid, dimethylpyromellitic acid, di(trifluoromethyl)pyromellitic acid, 3,3',4,4'-biphenyltetracarboxylic acid, 5,5'-dimethyl-3,3',4,4'-biphenyltetracarboxylic acid, p-(3,4-dicarboxyphenyl)benzene, esters thereof, acid anhydrides thereof, acid chlorides thereof, etc. These tetracarboxylic acid derivatives can be used alone or as a mixture thereof. The polyimide of this invention is, even if not oriented, lower in thermal expansion, higher in strength, and higher in elasticity, than other polymers, but when the molecular chain is oriented, these properties are by far highly enhanced. For example, the molecular chain can be oriented by stretching a film-like article uniaxially or biaxially. It is known that an aromatic polyimide generally becomes lower in thermal expansion, higher in elasticity and higher in strength by an orientation treatment, but such effects are by far small compared with the effects in this invention. The orientation of polymer chain can be effected by not only stretching of a film using a stretcher but also applying shrinkage caused by a curing reaction of polyimide or during a procedure from a precursor varnish to polyimide shape article or shrinkage caused by evaporation of the solvent. For example, by preventing the shrinkage at the time of curing of a varnish coated, the orientation of molecular chain becomes possible. The stretching amount by curing shrinkage is very small compared with a conventional stretching method, but even such an orientation treatment is sufficiently effective in the polyimide of this invention. In the case of stretching a film-like shaped article, when a completely cured material is to be stretched, the stretching should be conducted at a very high temperature because of extremely high glass transition temperature of polyimide, and even if stretched at such a high temperature, the orientation is very difficult due to very strong intermolecular cohesive force. In order to orient easily, it is preferable to stretch at a state of containing a solvent to some extent or at a state of polyamide-acid having a low glass transition temperature to orient the molecule, followed by complete curing. That the polyimide of this invention is very low in thermal expansion is quite different from the common knowledge of conventional polymers and thus cannot be expected from prior art. Reasons for this seem to be that the polyimide of this invention has an almost linear structure as shown in Fig. 14 (I) and (II). The polyimide of this invention is very low in thermal expansion but in some cases slightly brittle. In such a case, the brittleness of the polyimide of this invention can be improved by blending or copolymerization with other one or more polymers without remarkably increasing the thermal expansion coefficient. It is also possible to adjust the thermal expansion coefficient of the polyimide used for the method of this invention by blending or copolymerization with other one or more polymers considering the thermal expansion coefficient of inorganic material in the case of forming a composite shaped article. From the viewpoint of heat resistance, the use of polyimide as other polymers is preferred. Such a polyimide can be obtained from a diamine and a tetracarboxylic acid or a derivative thereof mentioned below. Examples of such a diamine are m-phenylenediamine, 4,4'-diaminodiphenyl methane, 1,2-bis(anilino)ethane, 4,4'-diaminodiphenyl ether, diaminodiphenyl sulfone, 2,2-bis(p-aminophenyl)propane, 2,2-bis(p-aminophenyl)hexafluoropropane, 3,3'-dimethyl-4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, diaminotoluene, diaminobenzotrifluoride, 1,4-bis(p-aminophenoxy)benzene, 4,4'-bis(p-aminophenoxy)biphenyl, 2,2-bis{4-(p-aminophenoxy)phenyl}propane, diaminoanthraquinone, 4,4'-bis(3-aminophenoxyphenyl)diphenyl sulfone, 1,3-bis(anilino)hexafluoropropane, 1,4-bis(anilino)octafluorobutane, 1,5-bis(anilino)decafluoropentane, 1,7-bis(anilino)tetradecafluoroheptane, diaminosiloxanes represented by the formula: or by the formula: wherein R₅ and R₇ are independently a divalent organic group such as alkylene, phenylene, substituted phenylene, etc.; R₄ and R₆ are independently a monovalent organic group such as alkyl, phenyl, substituted phenyl, etc.; and p and q are independently integers of 1 or more, 2,2-bis{4-(p-aminophenoxy)phenyl}hexafluoropropane, 2,2-bis{4-(3-aminophenoxy)phenyl}hexafluoropropane, 2,2-bis{4-(2-aminophenoxy)phenyl}hexafluoropropane, 2,2-bis{4-(4-aminophenoxy)-3,5-dimethylphenyl}hexafluoro propane, 2,2-bis{4-(4-aminophenoxy)-3,5-bis(trifluoromethyl)phenyl}hexafluoropropane, p-bis(4-amino-2-trifluoromethylphenoxy)benzene, 4,4'-bis(4-amino-2-trifluoromethylphenoxy)biphenyl, 4,4'-bis(4-amino-3-trifluoromethylphenoxy)biphenyl, 4,4'-bis(4-amino-2-trifluoromethylphenoxy)diphenyl sulfone, 4,4'-bis(3-amino-5-trifluoromethylphenoxy)diphenyl sulfone, 2,2-bis{4-(4-amino-3-trifluoromethylphenoxy)phenyl}hexafluoropropane and the like. It is also possible to use aromatic diisocyanates obtained by reacting these diamines with phosgene such as tolylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, diphenyl ether diisocyanate, phenylene-1,3-diisocyanate, etc. These diamines and diisocyanates can be used alone or as a mixture thereof. Examples of such a tetracarboxylic acid or a derivative thereof are 2,3,3',4'-tetracarboxydiphenyl, 3,3',4,4'-tetracarboxydiphenyl ether, 2,3,3',4'-tetracarboxydiphenyl ether, 3,3',4,4'-tetracarboxybenzophenone, 2,3,3',4'-tetracarboxybenzophenone, 2,3,6,7-tetracarboxynaphthalene, 1,4,5,7-tetracarboxynaphthalene, 1,2,5,6-tetracarboxynaphthalene, 3,3',4,4'-tetracarboxydiphenylmethane, 2,2-bis(3,4-dicarboxyphenyl)propane, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane, 3,3',4,4'-tetracarboxydiphenyl sulfone, 3,4,9,10-tetracarboxyphenylene, 2,2-bis{4-(3,4-dicarboxyphenoxy)phenyl}propane, 2,2-bis{4-(3,4-dicarboxyphenoxy)phenyl}hexafluoropropane, butanetetracarboxylic acid, cyclopentanetetracarboxylic acid, esters thereof, acid anhydrides thereof, acid chlorides thereof, etc. These tetracarboxylic acids or derivatives thereof can be used alone or as a mixture thereof. The polyimide of this invention can be modified with a compound having one or more reactive functional groups or by introducing a crosslinked structure or ladder structure thereinto, as mentioned below. (i) Modification with a compound of the formula (X) to introduce one or more pyrrolone rings or isoindoloquinazolinedione rings. wherein R¹ is an aromatic organic group having a valance of 2 + x; Z is a NH₂ group, CONH₂ group or SO₂NH₂ group and is positioned at an ortho position to the amino groups; and x is 1 or 2. (ii) Modification with an amine, diamine, dicarboxylic acid, tricarboxylic acid, tetracarboxylic acid, or a derivative of these compounds, these compounds having at least one polymerizable unsaturated bond, to form a crosslinked structure at the time of curing. Examples of these unsaturated compounds are maleic acid, nadic acid, tetrahydrophthalic acid, ethynylaniline, and derivatives thereof. (iii) Modification with an aromatic amine having a phenolic hydroxyl group or a carboxyl group to form a cross-linked structure by using a crosslinking agent reactive with the phenolic hydroxyl group or carboxyl group. In order to shape the low thermal expansion polyimide and an inorganic material into one body to form a composite shaped article, adhesiveness is important in this invention. As the inorganic material, there can be used metals such as Cu, Cr, Au, Ag, Ni, Al, Fe, Co, Zn, Pb, Sn, Ti, Mo, Pd, etc., alloys thereof, Si, SiC, SiO₂, Si₃N₄, Al₂O₃, BN and the like ceramics, Fe₂O₃, semiconductors such as Ga·As, glass, etc. in the form of film, plate, powder, fiber, etc. In order pertain strong adhesiveness, it is preferable to roughen the surface of inorganic material, or to subject the inorganic material to a surface treatment with a silane coupling agent, a titanate coupling agent, aluminum alcholate, aluminum chelate, zirconium chelate, aluminum acetylacetone, etc. These surface treating agents can be added to the low thermal expansion polyimide. The adhesivenss of the polyimide to inorganic materials can be improved by modifying the polyimide with a siloxane containing diamine, or a tetracarboxylic acid or a derivative thereof. The low thermal expansion resin material of this invention may include one or more inorganic powders, organic powders, metal powders, fibers, chopped strands in order to further lower the thermal expansion coefficient, to enhance elasticity or to control fluidity. The composite shaped article obtained by shaping the low thermal expansion resin material and the inorganic material into one body can be as follows: (1) IC or LSI having a carrier film (2) LSI having a wiring insulating film (3) LSI having a moisture resistant protective film (4) LSI having an α-rays shielding film (5) a semiconductor having a passivation film (6) a metal core printed board having a polyimide insulating film The composite shaped articles of this invention obtained by shaping the low thermal expansion resin material and the inorganic material into one body will be explained referring to the drawings. Fig. 2 is a cross-sectional view of LSI having a multi-layer wiring structure. Numeral 3 denotes a silicon wafer, 4 a SiO₂ film, 5 Al (aluminum) wiring, and 6 an insulating thin film of the low thermal expansion polyimide. When the insulating thin film is formed by a spin coating method, level differences of aluminum wiring can remarkably be lessened to give a flat and highly reliable wiring structure. Further since the thermal expansion is very low, stress to the element is very small. When the thermal stress is large, there arise cracks in the element. Further, the low thermal expansion resin material used for the method of this invention can easily be processed. This etching speed is about 2 times as fast as that of a conventional polyimide. In Fig. 2, when the surface layer 6 is made of an inorganic film such as SiO₂ film produced by a chemical vapor deposition (CVD) method, moisture resistance can be improved. In such a case, when the underlying insulating film is made from a conventional polyimide, there take place cracks on the surface inorganic film. Therefore, the underlying insulating film should be made from the polyimide of this invention. The wiring insulating film may be contained in the LSI between a silicon wafer and wiring or between wiring and wiring. The wiring insulating film may cover a silicon wafer having formed wiring thereon. Fig. 3 is a cross-sectional view of a memory element having an α-rays shielding layer. Numeral 7 denotes a wiring layer and 8 a lead wire. When the low thermal expansion polyimide 9 is used as α-rays shielding layer, since differences in thermal expansion coefficients among the silicon wafer 1 and the wiring layer 7 are very small, there take place no cracks nor peeling due to thermal stress as in the case of using a conventional polymer, and there arises no problem of lowering in resolving power at the time of patterning of a photoresist due to warpage of the wafer. Further, since the polyimide of this invention is remarkably excellent in heat resistance compared with conventional polyimides, it is suitable for use in glass encapsulated semiconductor element. The pyrolysis rate of the polyimide of this invention is about 1/10 of that of conventional ones. In an insulating film for an LSI shown in Figs. 2 and 3 it is demonstrated that the shrinkage at the time of curing is prevented by the silicon wafer to show low thermal expansion. Fig. 4 shows a cross-sectional view of a metal core wiring board (a metal-plate-base printed wiring board) having mounted a film-carrier type LSI. Numeral 10 denotes a metal substrate, 11 a LSI chip produced by a film-carrier method, 12 a carrier film using the low thermal expansion polyimide, and 13 a terminal. Since the carrier film 12 is made from the low thermal expansion polyimide, there can be obtained LSI 11 with high accuracy and high density. Further, since the stress applied to a solder ball 14 for bonding is reduced remarkably, breaking as a result of fatigue is also reduced. Further, by applying the low thermal expansion polyimide to an insulating film 16 at a wiring portion 15 formed on the metal substrate 10, there can be obtain a printed wiring board without crook, which results in making high accuracy high density assembly possible. Fig. 5 is a cross-sectional view of a metal-plate-based printed circuit having mounted a LSI bonded by lead wire. Numeral 17 denotes a LSI chip obtained by a lead-wire bonding method. Other numerals are the same as those in Fig. 4, etc. application, although not particularly shown in a drawing. When a metal foil such as stainless steel foil coated with a thin film of the low thermal expansion polyimide is used as a substrate in a solar cell using amorphous silicon, the generation of cracks on the amorphous silicon thin film is reduced remarkably compared with the case of using conventional polyimides. When the low thermal expansion polyimide is used as matrix resin for fiber reinforced laminates, not only the thermal expansion coefficient at the direction along the layers by the fiber reinforcement but also that at the flatwise direction, that is, perpendicular to the direction along the layers, can be reduced. Further, since the difference in thermal expansion coefficients between the fiber material and the polyimide is small, there arises no local thermal stress nor interfacial peeling due to heat shock, and the like. When the low thermal expansion polyimide of this invention is used as a molding material, even if an insert made of a metal or ceramic is molded together, there takes place no problem of generation of cracks, cracks and deformation of the insert per se. When the low thermal expansion polyimide is used in the form of fiber, for example, as reinforcing fibers for FRP, the weight-saving is more remarkable than the use of glass fiber. Further, when it is used as multi-layer wiring board for computors, the dielectric constant becomes smaller compared with the case of using glass fiber. The composite shaped article of this invention can be shaped into one body directly or by using an adhesive or binder. Comparision of polyimides according to the present invention (PI Nos 1 to 8) with conventional polyimides (CPI Nos 1 to 16) In a four-necked flask equipped with a thermometer, a stirring apparatus, a reflux condenser, and a nitrogen introducing tube, a diamine was placed in an amount as shown in Table 1 and dissolved with 850 g of N-methyl-2-pyrrolidone (NMP). Then, the flask was dipped in a water bath at 0 to 50°C and a tetracarboxylic acid dianhydride as shown in Table 1 was added thereto while controlling the exothermic heat. After dissolving the tetracarboxylic dianhydride, the water bath was removed and the reaction was continued for about 5 hours at near room temperature to give a polyamide-acid varnish. When the viscosity of varnish became too high, stirring with heating (cooking) at 80 to 85°C was continued until the viscosity became 5 Pa.s (50 poises) at 25°C. The thermal expansion coefficient of polyimide obtained by heating a polyamide-acid was measured as follows. A varnish was coated uniformly on a glass plate by using an applicator and dried at 80 to 100°C for 30 to 60 minutes to make a film-like form. Then, the film was stripped off from the glass plate and fixed on an iron frame (bifix cure) or hung by using a spring to allow free shrinkage (free cure), and held at 200°C, 300°C or 400°C for 60 minutes to give a polyimide film of 20 to 200 µm thickness. A film of 3 mm x 80 mm was cut off and placed between two glass plates, and heated at 400°C again, followed by gradual cooling to remove residual strain. Then, dimensional change was measured under conditions of 5°C/min by using a thermal mechanical analyzer and the thermal expansion coefficient was obtained from the dimensional change amount below the glass transition temperature. As mentioned above, accurate thermal expansion coefficient cannot be measured, unless absorbed moisture or solvent in film or residual strain by imidization is removed sufficiently and the imidization reaction is substantially completed. If an absorbed moisture is present, the thermal expansion coefficient of the film is apparently measured with a lower value at a temperature range of room temperature to 150°C due to removal of moisture. Further, if the residual strain is retained or the imidization reaction is is not completed, the linear expansion coefficient is sometimes apparently measured with a lower value due to the removal of residual strain near the glass transition temperature (Tg) or shrinkage by dehydration by imidization reaction. Further, when the film is fixed on the iron frame and cured and broken during the curing, the thermal expansion coefficient is measured with a rather higher value due to insufficient orientation treatment. These should be taken into consideration. Table 1 shows thermal expansion coefficients of polyimide films after bifix cured and free cured. Further, the data on Table 1 are plotted in Fig. 6 taking the linear expansion coefficients by free cure of polyimide along the abscissa axis and the linear expansion coefficients by bifix cure of polyimide along the ordinate axis. As is clear from Fig. 6 the polyimides of this invention clearly have very low thermal expansion coefficients compared with conventional polyimides. From the viewpoint of chemical structure, the low thermal expansion can be obtained when P-PDA, DATP, o-TOLID, and p-DATOL are used as diamine, and PMDA and BPDA are used as tetracarboxylic dianhydride. In other words, the following conditions can be summarized for giving the low thermal expansion coefficients: (1) the main skeleton has a benzene ring and an imide ring, (2) the bonding of the benzene ring is by the para-bonding, and (3) the benzene ring can contain a substituent such as a methyl group at side chains. PI Nos 9 to 14 The low thermal expansion polyimides of this invention can be blended or copolymerized with conventional polyimides having larger thermal expansion coefficients or with conventional polyamide-acid to control the thermal expansion coefficients properly. Thermal expansion coefficients of copolymerized or blended materials are shown in Table 2. As is clear from Table 2, there is almost linear relation between the copolymerization or blending ratio and the thermal expansion coefficient. This means that the control can be conducted easily. (Examination of Properties) (1) Samples A polyamide-acid varnish was prepared by reacting an aromatic diamine as listed in Table 3 with an aromatic tetracarboxylic dianhydride as listed in Table 3 in N-methyl-2-pyrrolidone at room temperature. The varnish was coated on a glass plate and dried at 100°C for 1 hour. Then, the resulting film was stripped off and cured at 200°C for 1 hour and at 400°C for 1 hour in a nitrogen gas to give a polyimide film. It was also found that behavior for thermal expansion changed when curing shrinkage was conducted freely (free cure) or shrinkage was prevented by fixing on an iron frame at one direction (unifix cure) or at two directions (bifix cure). (2) Coefficients of thermal expansion: A film of 5 mm wide, 65 mm long (between chucks) and 20 to 100 µm thick was used as sample. The sample was applied to a thermal mechanical analyzer (TMA 1500, mfd. by Shinku Riko K.K.) and measured under the conditions of 5° C/min. Since the thermal expansion coefficient had temperature-dependency, an average value between 50 to 250°C was used as a representative value. (3) Wide angle X-ray diffraction: A sample of 30 mm wide, 40 mm long and about 40 µm thick was measured by using a Geiger-Flex RAD (mfd. by Rigaku Denki Co., Ltd.) (4) Results and Discussions It was found that behavior of thermal expansion for polyimides changed variously whether curing shrinkage in the course of heat cure of polyamide-acid film to polyimide was prevented or not. Fig. 7 shows behavior of thermal expansion for polyimide No. D1 obtained from DATP and PMDA. The thermal expansion coefficient of conventional polyimide is usually 4 to 6 x 10⁻⁴ K⁻¹ and there is a dimensional change of 0.8 to 1.2% with the temperature change of from 50 to 250°C. In contrast, the polyimide of No. D1 shows dimensional change of about 0.2% (free cure) or about 0.1% (bifix cure) in the temperature range of 50 to 250°C. Fig. 8 also shows behavior of thermal expansion for polyimide No. A2. The dimensional change by the bifix cure is 0.1% or less, while that by free cure becomes as large as about 0.4% in the range of 50 to 250°C with a relative increase of thermal expansion coefficient. Using this sample (No. A2), prevention of curing shrinkage at only one axis was also studied. As a result, it was found that at the prevented direction (UFX-X) the thermal expansion coefficient became smaller and the dimensional change was almost 0% up to near 250°C. But, at the direction perpendicular to the controlled direction (UFX-Y), the behavior was almost the same as the case of free cure. That is, by a method for giving a slight curing shrinkage (linear shrinkage, about 10%) at the time of imidization, the resulting effect was the same as that obtained by stretching a conventional prepolymer several to several tens times. Similarly, behavior of thermal expansion for Nos. A3 and F3 (these being conventional polyimides) is also shown in Figs. 9 and 10. Fig. 11 shows a relationship between the chemical structures and thermal expansion coefficients. From the above results, the kinds of polyimides can roughly be divided into the following 4 groups. 1 ○ Polyimides having small thermal expansion coefficients both in free cure and bifix cure. This group includes those obtained from a combination of o-TOLID or DATP, and PMDA. 2 ○ Polyimides having slightly large thermal expansion coefficients in the case of free cure but having about half values in the case of bifix cure. This group includes those obtained from a combination of BPDA and p-PDA, o-TOLID or DATP. 3 ○ Polyimides having considerably large thermal expansion coefficients in the case of free cure but having about half values in the case of bifix cure. This group includes those obtained from a combination of p-PDA, o-TOLID, DATP, or m-PDA, and BTDA, a combination of DDE and PMDA, or a combination of 2,4-DATO and BPDA. 4 ○ Polyimides having large thermal expansion coefficients both in free cure and bifix cure. Almost all polyimides other than those mentioned above belong to this group. On the other hand, it is well known that thermal expansion coefficients of polymers become smaller by crystallization caused by stretching. Crystallizability of polyimides was studied by using wide angle X-ray diffraction. Measured results were shown in Figs. 12 and 13 Fig. 12 shows that No. D1 belonging to the group 1 ○ has sharp reflection and thus has crystallizability. Similarly, No. C1 seems to have crystallizability to some extent. In contrast to them, Nos. A2 of the group 2 ○ and No. A3 of the group 3 ○ have slight orientation compared with No. F3 of the group 4 ○, but they seem to have no crystallizability in contrast to Nos. D1 and C1. In Fig. 13 differences due to free cure, bifix cure, UFX-X and UFX-Y were studied as to No. A2, but there is almost no difference in wide angle X-ray diffraction data. If evaluated in detail, there is a tendency that the height of the curve is lower in the case of free cure. From these results, there is a clear tendency that the stronger the crystallizability is, the smaller the thermal expansion coefficient becomes. But the controlling effect on curing shrinkage cannot be explained sufficiently by this only. The degree of order in more longer distance seems to be also important. Next place, conformations of polyimides belonging to individual groups 1 ○ to 4 ○ were studied. As shown shown in Fig. 14 it can be admitted some community to some extent. The polyimides belonging to the group 1 ○ can only take conformation wherein both the diamine and tetracarboxylic acid components lie linearly on almost the same plane as shown in Fig. 14 (I). Therefore, they are rod-like at the direction of molecular axis and rigid, as well as liable to be crystallized. The polyimides belonging to the group 2 ○ have considerably linear conformation, although take a somewhat zigzag structure due to the biphenyl of BPDA as shown in Fig. 14 (II). The polyimides belonging to the group 3 ○ can further be divided into two groups; one of which is formed from p-PDA, o-TOLID or DATP and BTDA and lies on almost the same plane as shown in Fig. 14 (III) but is hardly arranged on a straight line depending on benzophenone skeltons, and another of which turns at the ether bonds as shown in Fig. 14 (IV) and does not lie on the same plane but the skelton between two ether bonds lies linearly. The polyimides obtained from a combination of PMDA and DDM or DDS also belong to the same type. Almost all the other polyimides lose regularity by ether, thioether, methylene, ketone, or the like as shown in Fig. 14 (V).

Claims: A method for producing a wiring insulating film for a large-scale integrated circuit (LSI) comprising coating a solution of a polyamide acid on a desired portion of the LSI, drying the solution and converting the polyamide acid into polyimide to form the wiring insulating film, characterized in that the polyimide has as repeating unit at least one member selected from the group consisting of: wherein R is an alkyl group, a fluorinated alkyl group, an alkoxy group, a fluorinated alkoxy group, an acyl group, or a halogen atom: ℓ is zero or an integer of 1 to 4; m is zero or an integer of 1 to 2; n is zero or an integer of 1 to 3; and k is zero or an integer of 1 to 3. A method according to claim 1 wherein the wiring insulating film is contained in the LSI between a silicon wafer and wiring or between wiring and wiring. A method according to claim 1 wherein the wiring insulating film covers a silicon wafer having formed a wiring thereon. A method for producing a wiring insulating film as defined in claim 1 for a multi-layer wiring board comprising a wiring and layers of the wiring insulating film. A method for producing an alpha-ray shielding layer for a memory element comprising a semi-conductor element and an alpha-ray shielding layer coated on said semi-conductor element comprising coating a solution of polyamide acid on a desired portion of the semi-conductor element, drying the solution and converting the polyamide acid into polyimide to form alpha-ray shielding layer, said polyimide being the same as defined in claim 1.

Inventors: FUJISAKI, KOJI, IMAIZUMI, JUNICHI, KINJO, NORIYUKI, MIKAMI, YOSHIKATSU, NUMATA, SHUN-ICHI
Applicants: HITACHI CHEMICAL CO., LTD., HITACHI, LTD.
Application year: 1984
Main classification: C08G73
IPC codes: H01L23, C08G73, H05K1, C08L79, H01L21