SEMICONDUCTOR DEVICE COMPRISING DIELECTRIC ISOLATION REGIONS

Abstract: Devices formed in a semiconductor integrated circuit device are electrically isolated by a pair of narrow and deep grooves (9), thick oxide films (14) formed on the surfaces of the grooves and a thick oxide film (15) formed on a surface of an area between the grooves.

Description: SEMICONDUCTOR DEVICE The present invention relates to a semiconductor device, and more particularly to a semiconductor device in which a plurality of semiconductor devices are electrically isolated from each other by grooves formed in a semiconductor substrate. An isolation method of isolating semiconductor devices by forming grooves in a semiconductor substrate and filling the grooves with'insulative material requires a smaller space -and attains a smaller parasitic capacitance than a PN junction isolation method and it is suitable to a high integration and high speed LSI. However, in this method, if the grooves on the surface after the insulating material has been filled in the grooves are wide, it is difficult to flatten the surface and a very complex process is required to flatten the surface. Accordingly, the width of the grooves is restricted to facilitate the flattening. However, when the width of the isolation grooves is restricted, a parasitic active regions are created in the devices on the opposite sides of the groove and a wiring capacitance increases, which results in a reduction of an operation speed of the circuit. It is an object of the present invention to provide a semiconductor device which can reduce a stray capacity of wiring on a passive region without complexing a manufacturing process. The isolation in accordance with the present invention uses a combination of- a pair of narrow and deep grooves, thick oxide films on the surfaces of the grooves and a thick oxide film on a surface area between the grooves. Figs. 1 to 8 show manufacturing steps of one embodiment of the present invention Figs. 9 to 12 show manufacturing steps of a second embodiment of the present invention, Figs. 13 and 14 show manufacturing steps of a third embodiment of the present inve#ntio#n#, and Figs. 15 to 17 show manufacturing steps of other embodiments of the present invention. The fact that a propagation delay time of 0.3 ns/gate with an isolation capacitance of 0.2 pF is attained by forming grooves in a semiconductor integrated circuit substrate is disclosed in an article Japanese Journal of Applied Physics, Volume 21 (1982) Supplement 21 - 1, pages 37 - 40, two of the authors of which are the inventors of the present invention. U.S. Patent 4,396,460 invented by the authors of the above article and filed on May 21, 1982 discloses a method for flattening an area of a wide isolation groove. A first embodiment concerning the manufacture of a bipolar integrated circuit is now explained. As shown in Fig. 1, a collector buried layer 2 of a thickness of 0.5 - 3 ijm is formed in a surface of a Si substrate 1 having a plane orientation (100), a Si epitaxial layer (having a thickness of 0.5 - 3 vm, preferably 1 - 1.5 #m) which serves as an active region of a transistor is formed thereon, the surface thereof is oxidized to form a SiO2 film 4 having a thickness of 0.05 - 0.10 vm, and a Si3N4 film 5 is formed thereon by a well-known CVD process. Then, the Si3N4 film 5 at areas 6, 7, 8 and 28 in which grooves are to be formed as shown in Fig. 2 are selectively removed by a dry-etching process using a conventional photo-etching method, and''the surface is again photo-etched to remove the exposed areas 8 and 28 of the SiO2 film 4 while leaving the SiO2 film 4 at an area of shallow isolation groove 6 and at a center area 7 of a wide isolation area 8-7-8 having Åa width of 0.5 to 2000 Wm to form openings 8 and 28 at areas in which deep device isolation grooves are to be formed. The widths of the openings 6, 8 and 28 are preferably equal to or narrower than the depths of the grooves to be described later, from a standpoint of later flattening process. Then, as shown in Fig. 3, generally vertical grooves 9 are formed in the Si layer 3 by a well-known dry etching process such as a reactive sputter etching usin#g the SiO2 film 4 of the areas 6 and 7 as a mask. Before dry etching, the SiO2 film 4 may be etched to widen the openings 6, 8 and 28 to diverge the tops of the grooves upward to enhance the flatness of the surface. This shape is hereinafter referred to as a Y-shaped groove. The flatness of this Y shaped groove is advantagepus to a multi-layered integrated circuit structure having an element or wiring stacked on the other element. The groove 9 extends through the Si expitaxial layer 3 and into the collector buried layer 2 by approximately 0.5 vm. The exposed areas of the SiO2 films 4 and 6 between the grooves 9 are removed by wet etching process using buffered HF as on etchant (Fig. 3) Then, the Si films 3, 2 and 1 are again dryetched to form interdevice isolation grooves 10 which are shallower than the collector buried layer 2 and deep device-to-device isolation grooves 11 which extend into the collector buried layer 2 (Fig. 4). The depth of the grooves 11 is 1.5 pm - 6.5 um depending on the thicknesses of the collector buried layer 2 and the Si epitaxial layer 3. The exposed areas of the Si films 1, 2 and 3 are then oxidized using the Si3N4 film 5 as a mask to form a SiO2 film 12 having a thickness of approximately 400 nm. After the Si 3N4 film 5 used as the mask has been removed, a Si3N4 film 13 having a thickness of approximately 100 rim is formed on an entire surface, and a thick poly-Si layer 14 is formed by CVD process to fill the grooves (Fig. 5). The poly-Si 14 is then etched by isotropic etching (either dry or wet) until the surface of the Si N film 13 is exposed to flatten the surface (Fig. 6). Then, the surface of the poly-Si 14 is oxidized to form a SiO2 film 15 having a thickness of approximately 400 nm and the exposed areas of the Si 3N4 film 13 are removed and a Si3N4 film 16 having a thickness of#. approximately 100 nm is formed on the entire surface. Thus, the interdevice and device-to-device isolation processes are completed (Fig. 7). Then, a collector take-out region 17, a base region 18 and an emitter region 19 are formed by diffusion or ion implantatidn, and passivation film 16 farmed*--in-th-e step of Fig. 7 and the SIO2 film 4 are selectively etched using a mask to form a base electrode 20, an emitter electrode 21 and a collector electrode 22 to complete a transistor (Fig. 8). A conductive line 23 deposited above the filling poly-Si layer is also shown in Fig. 8. The bipolar LSI thus constructed has two thick oxide layers 12 and 15 and two Si3N4 layers 13 and 16 in the interdevice isolation area 24. Let us consider a parasitic capacitance between the conductive line 23 and the substrate 1. The dielectric constant of the Si3N4 films 13 and l6 is approximately 2 to 4 pm. The thicknesses of the films are about 100 nm. The poly-Si layer 14 is sandwiched between the films. This dielectric constant is large than that of the SiO2 film whose relative dielectric constant is approximately 2.8. Accordoly, the contribution of the Si3N4 film of 100 nm thickness to the capacitance corresponds to that of the SiO2 film of about 70 nm thickness. Accordingly, if the poly-Si film 14 is disregarded, two pairs of Si3N4 - SiO2 films have a capacitance corresponding to the SiO2 film having a thickness of 940 nm, that is, approximately 1 x TO pF/pm2. A single pair of the 100 nm thick Si3N4 film and the 50 nm thick SiO2 film has a capacitance corresponding to the SiQ2 film having a thickness of 120 nm-, that is, approximately 9 x 10 5 pF/m2 Accordingly, the parasitic capacitance of the present embodiment is one nineth of that of the prior art device. An-ele±tric resistance of the poly-Si layer 14 of Fig. 8 is in the order of 10 MQ-cm but it may be considered that a depletion layer is formed in the poly-Si lay-er 14 by an electric field applied thereto to reduce the parasitic capacitance by a certain degree. In the embodiment of Fig 8, the bottoms 25 of the two shallow grooves reach the surface of the collector buried layer 2. The thickness of the poly-Si layer 14 depends on the thicknesses of the collector buried layer 2 and the Si epitaxial layer 3. When it is not required that the shallow grooves extend to the collector buried layer, the amount of etching of the Si layer 14 for the shallow grooves in the step of Fig. 4 may be reduced. The etching step of Fig. 4 for forming the shallow grooves may be omitted. The thickness of the poly-Si layer 14 is 0 - 5.5 pm. By selecting the depth of the shallow grooves 10 to approximately one half of the thickness of the SiO2 film 12, the flatness of the surface 26 relative to the other areas is attained by thermal oxidization as shown in Fig. 9. Figs. 10 - 12 shows manufacturing steps for a se#cond embodiment shown in Fig. 9. They correspond to Figs. 4 - 6, respectively. The Si epitaxial layer 3 in the wide isolation region 7 shown in Fig. 10 is not etched. - Figs. 11 and 12 show the same steps as those shown in Figs. 5 and 6, respectively. The thickness of the Sio, film 12 shown in Fig. 11 may be. slightly larger than the thicknéss of 400 nm of the- SiO2 film shown in Fig. 5, that is, it may be 500 - 600 nm. As a result, a stray capacitance which is approximately 1/4.5 to 1/5 of that of the 120 nm thick SiO2 film is attained. The collector buried layer 42 shown in Figs. 8 and 9 is isolated by the deep groove from the other collector buried layer 2. The device isolations in the first and second embodiments were applied to devices of a bipolar semiconductor integrated circuit and to the peripheries of bonding pads (approximately 100 pm x 100 pm) and the underlying areas of the wirings from the bonding pads to the circuit components. A propagation delay time was 0.2 ns/gate. It shows an improvement of 50 % over the propagation delay time of 0.3 ns/gate shown in the article of the JJAP. Figs. 13 and 14 show a third embodiment. The shallow groove 10 shown in Fig. 10 is formed for the interdevice isolation. In Fig. 13, the step of forming the shallow groove 10 is omitted and the interdevice isolation is attained by a SiO2 film 32 having a thickness-of 400 - 600 nm formed by thermal oxidization. Fig. 14 shows a collector diffusion region 34, an emitter diffusion region 33 and a base diffusion region 35 having their diffusion regions delimited by the SiO2 film 32. Fig. 15 shows a fourth embodiment in which the width of the interdevice isolation region of the above embodiment is widened to 10 vm or longer. The surface has no step and has a smooth contour. Fig. 16 shows a fifth embodiment. The cross-sectional shape of the groove is not limited to the U-shape shown in the embodiment but a V-shape or a Y-shape or combination of#the three shapes may be used. By over-etching the SiO2 film 4 shown in Fig. 2 and isotropic-etching it by alkaline etchant (KOH or hydradin) in an early stage of Si etching to form a Y-shaped slope at the top of the deep cylindrical groove to widen the top outward, the flatness of the surface is improved as shown in Fig. 16. In the above embodiments, the filling material 14 for the isolation grooves is the poly-Si. Alternatively, other insulating material such as SiO2 or Si3N4 may be used. The thickness of the Si N film for masking or passivation is not limited to 100 nm but it may change between 30 nm and 500 nm. Fig. 17 shows an embodiment of a MOS LSI in accordance with the present invention. A source 51, a drain 52, a poly-Si gate 53 and a thin gate oxidization film 50 under the gate 53 are similar to those of a conventional MOS FET structure. An Al conductive wire 58 is contacted to the drain 52 and extends onto a SiO2 film 56 having a thickness of 200 nm to 1 pm between two grooves 55 having a depth of approximately 0.3 to 1.0 vm, and onto a passivation layer 57 (such as PSG).

Claims: CLAIMS: 1. A semiconductor integrated circuit device having a number of devices to be isolated on a Sisubstrate comprising: a pair of device isolation grooves (9) spaced from each other and extending to said Si-substrate (1); and a first layer of insulating material formed between said pair of device isolation grooves, said first layer including a thicker first silicon oxide film (15) than a second silicon oxide film (4) in device areas. 2. A semiconductor integrated circuit device according to Claim 1 further comprising: a second layer (14) of insulating material formed under said first thickersilicon oxide film (15); and a third silicon oxide film (12) formed under said insulating layer (14). 3. A semiconductor integrated circuit device according to Claim 2 wherein said grooves'(9) each has a wide opening formed by said first silicon oxide film (15). 4. A semiconductor integrated circuit device according to Claim 2 wherein said insulating material is silicon and said grooves (9) are filled with a stacked structure comprising said third silicon oxide film (12) extended beneath into said grooves and intruding into said silicon substrate (1); a first silicon nitride film (13) deposited on said third silicon oxide film (12); said silicon layer (14) deposited and filling up a groove formed by said first nitride film (13); said first silicon oxide film (15) formed in the surface of said silicon layer (14) by thermal oxidation thereof and a second silicon nitride film (13) deposited on said first silicon oxide film (15). 5. A semiconductor integrated circuit device according to Claim 3 wherein said semiconductor integrated circuit device includes MOS FET's. 6. A semiconductor integrated circuit device according to Claim 3 wherein said semiconductor integrated circuit device includes bipolar devices and said pair of grooves extend through a collector buried layer (2) formed on said silicon substrate. 7. A semiconductor device comprising: a plurality of device isolation grooves (9) having dielectric material (14) deposited on at least surfaces thereof; and an area disposed between said device isolation grooves and having a top thereof coated with a thick insulating film.

Inventors: KAWAMURA, MASAO, SAGARA, KAZUHIKO, SHIBA, TAKEO, TAMAKI, YOICHI
Applicants: HITACHI, LTD.
Application year: 1983
Main classification: H01L21
IPC codes: H01L21, H01L29