SOLID-STATE IMAGE PICKUP ELEMENT

Abstract: A solid-state image pickup element has a plurality of image pickup picture elements (F₁₁-F mn :F′₁₁-F′ mn :E′₁₁-E′ mn ) formed of photoelectric converters (G₁₁-G mn :G′₁₁-G′ mn :U₁₁-­ U mn :Y₁₁, Y₁₂ ....., W₁₁, W₁₂, ...) and switching elements (X₁₁-X mn :X′₁₁-X′ mn :S₁₁-S mn ) generating a signal charge upon the reception of light so that signals based on the signal charges generated and amplified in response to the quantity of light incident on the photoelectric converters from the respective image pickup picture elements are led out through the switching elements, thereby forming an image pickup output signals.

Description: SPECIFICATION SOLID STATE IMAGE PICKUP DEVICE Techni#aT Field This invention relates to a solid state image pickup device having a plurality of image pickup picture units each comprising, in combination, a photoelectric transducer and a switching element for successively delivering signals, which are obtained in response to signal charge produced in the photoelectric transducers and dependent on the quantity of incident light; through the switching elements so as to generate an image pickup signal output. Technical Background There has been proposed a solid state image pickup apparatus comprising, as main components, a solid state image pickup device having an image pickup surface composed of a prescribed pattern, such as a matrix for example, of two-dimensionally arrayed rows and columns of image pickup picture units each comprising a photoelectric transducer and a switching element, and a scanning circuit for selectively energizing the switching elements in the solid state image pickup device to deliver an image pickup signal output based on signal charge produced by the photoelectric transducers in the image pickup picture units. In such a solid state image pickup device, each switching element is composed of an insulated-gate fieldeffect transistor (hereinafter referred to as a "MOS FET"), and the photoelectric transducers are composed of a multiplicity of photodetecting diodes provided respectively for the switching elements or a thin photoelectric conversion layer disposed over the two-dimentional array of the switching elements. FIG. 1 shows an equivalent circuit of the solid state image pickup device that has heretofore been proposed, and a scanning circuit and an output circuit which are required for putting the solid state image pickup device into operation. The solid state image pickup device, generally designated at 1, is composed of MOS FETs Sll to Smn serving as switching elements, respectively, and arrayed as a matrix in horizontal rows (in the direction of a arrow H) and in vertical columns (in the direction of a arrow V), and photoelectric transducers D11 to Dmn each connected to one end, for example, a source of the correcponding one of the MOS FETs S11 to Smn. These MOS FETs Sll to Smn and photoelectric transducers D11 to Dmn form an image pickup surface. Each combination of one of the MOS FETs Sll to Smn and one of the photoelectric transducers D11 to Dmn forms one of image pickup picture units E11 to Emn, an example of the embodied configuration of which is shown in FIGS. 2 and 3. FIG. 2 shows the cross section of a portion of the solid state image pickup device 1, in which one image pickup picture unit is formed in a specific construction. In this example, N-type regions 3 and 4 are formed in a P-type semiconductor substrate 2. A gate electrode 6 is disposed between and extends partly over the regions 3 and 4 with an insulating layer 5 interposed between the gate electrode 6 and the semiconductor substrate 2 so as to form a MOS FET S which is one of the MOS FETs S11 to Smn with the region 3 serving as a drain region and the region 4 as a source region. The region 3 is provided with a drain electrode 7. A photodiode is constituted by a P-N junction between the semiconductor substrate 2 and the region 4 as a photoelectric transducer D corresponding to one of the photoelectric transducers D11 to Dmn. The photodiode ¯mn serves to effect photoelectric conversion of light falling on the region 4. The semiconductor substrate 2 is grounded, and accordingly an equivalent circuit of the arrangement shown in FIG. 2 with the photoelectric transducer D comprising the photodiode can be illustrated as shown in FIG. 3, in which the photodiode forming the photoelectric transducer D is connected to the source of the MOS FET S and the anode of the photodiode is supplied with ground potential. The gates of the MOS FETs 511 to Smn which mn constitute the image pickup picture units Ell to Emn, respectively, are connected in common in each row, and the groups of the gates connected in common are coupled to m control terminals vl to vm, respectively, which are supplied with vertical scanning signals from a vertical scanning circuit 8. The drains of the MOS FETs Sll to Smn are connected in common in each column, and the groups of the drains connected in common are coupled respectively to the sources of MOS FETs T1 to Tn serving as switching elements. The MOS FETs T1 to Tn have gates connected to n control terminals hl to hn, respectively, which are supplied with horizontal scanning signals from a horizontal scanning circuit 9. The drains of the MOS FETs T1 to T are connected in common n through an output resistor 10 to a power supply 5 which supplies with an operating voltage Vv. An output terminal 12 is led from a junction between the drains connected in common of the MOS FETs T1 to Tn and the output resistor 10. The vertical scanning circuit 8 includes a shift register, for example, for issuing the vertical scanning signals through the m control terminals vl to vm to the gates of the MOS FETs S1 to Smn to successively energize the rows of the MOS FETs S11 to Smn The horizontal scanning circuit 9 includes a shift register, for example, for issuing the horizontal scanning signals having a frequency sufficiently higher than that of the vertical scanning signals from the vertical scanning circuit 8 through the n control terminals hl to hn to the gates of the MOS FETs T1 to Tn to successively energize the MOS FETs T1 to Tn The ends of the photoelectric transducers D11 to remote from the sources of the MOS FETs Sll to Smn are connected in common to a terminal 13 to which a predetermined voltage is applied. For example, in the case where the photoelectric transducers D11 to Dmn are composed-of a plurality of photodiodes, the terminal 13 is supplied with ground potential. When light from an object falls on the image pickup picture units E11 to Emn on the image pickup surface of the solid state image pickup device 1 thus constructed, the photoelectric transducers D11 to Dmn convert light energy into electric charge (electrons) which is dependent on the quantity of incident light falling on the image pickup picture units Ell to Emn. The electric charge is then stored in a junction capacitor formed at each P-N junction (the P-N junction between the semiconductor substrate 4 and the region 4 in FIG. 2) forming each of the photodiodes serving as the photoelectric transducers D11 to Dmn That is, the generated electric charge is stored in the respective sources of the MOS FETs Sll to Smn as signal charge. Signals based on the signal charge stored in the sources of the MOS FETs Sll to Smn are delivered to the output terminal 12 to produce an image pcikup signal output when the rows of the MOS FETs Sll to Smn are selectively turned on by the vertical scanning signals issued from the vertical scanning circuit 8 and the MOS FETs T1 to Tn are selectively turned on by the horizontal scanning signals issued from the horizontal scanning circuit 9. The previously proposed solid state image pickup device of the above described construction, however, suffers from the following drawbacks: The proportion of the area of photoelectric transducer to the whole in each image pickup picture unit cannot be increased and therefore each image pickup picture unit is of low sensitivity. Although, for obtaining higher resolution, it is desired that the area of each image pickup picture unit be reduced so that image pickup picture units be provided as many as possible on the image pickup surface, since each image pickup picture unit requires a prescribed area for the photoelectric transducer, the entire area of each image pickup picture unit cannot be smaller than an area required to keep such a prescrived area for the photoelectric transducer. Accordingly, it is difficult to improve the resolution thereby. Further, assuming that a capacitance value of the junction capacitor at the P-N junction forming each photoelectric transducer is expressed with Cj, the maximum quantity Qm of signal charge that can be stored in the junction capacitor is given by the equation: Qm Qm where VB stands for a substrate voltage applied to the semiconductor substrate, which corresponds to ground potential in the foregoing example. When more electric charge is provided to be stored in the photoelectric transducer, the source potential of the MOS FET which serves as a switching element connected to the photoelectric transducer is reduced to be lower than the potential of the semiconductor substrate and consequently a parasitic transistor inserted in parallel between the source and drain of the MOS FET (for example, an NPN transistor with a collector formed by the drain region 3, a base formed by the semiconductor substrate 2 and an emitter formed by the source region 4 in FIG. 2, which shown in the equivalent circuit of FIG. 3 as connected parallel to the MOS FET S as indicated by the broken lines) is made conductive to allow the charge exceeding the quantity Cj ¯ (Vv * V3) to flow therethrough to the drain of the MOS FET. This drained charge then causes an undesired phenomenon known as so-called blooming. The value of (VV V V3) cannot be selected to be appreciably large because of limitations in respect of potential durability of the switching element, increment of load or burden on the scanning circuit and so on. As a result of this, the quantity E should be relatively small, and the dynamic range of the image pickup signal output cannot be widened The foregoing drawbacks make it difficult to incorporate the conventional solid state image pickup device as mentioned above to high-sensitivity still-image pickup apparatus with a high-speed shutter mechanism and highresolution image pickup apparatus. Disclosure of the Invention With the foregoing difficulties in view, it is an object of the present invention to provide a solid state image pickup device having a plurality of image pickup picture units each composed of a photoelectric transducer and a switching element, which delivers signals based on signal charge generated in response to the quantity of light falling on the photoelectric transducers and then amplified, through the switching elements, so as to produce an image pickup signal output, and thereby to eliminate the shortcomings encountered with a previously proposed solid state image pickup device. The solid state image pickup device according to the present invention is constituted in such a manner that each of a plurality of image pickup picture units composed of photoelectric transducers and switching elements is operative to produce signal charge dependent on the quantity of incident light and to amplify the produced signal charge. According to one embodiment, the switching element in each image pickup picture unit comprises a bipolar transistor which is capable of amplifying the signal charge generated by the corresponding photoelectirc transducer in response to the quantity of light falling thereon, and signals based on the amplified signal charge are selectively delivered from the image pickup picture units. According to another embodiment, the photoelectric transducer in each image pickup picture unit is operative to generate signal charge dependent on the quantity of incident light and also to amplify the generated signal charge. With the solid state image pickup device thus constituted according to the present invention, high image pickup sensitivity can be realized and an image pickup signal output with an improved signal-to-noise ratio can be obtained without having the area of the photoelectric transducers enlarged. Further, with the solid state image pickup device of the present invention, blooming is prevented from causing and a dynamic range of an image pickup signal output is widened. Brief Description of the Drawings FIG. 1 is an equivalent circuit diagram schematically showing a conventional solid state image pickup device and its peripheral circuits; FIGS. 2 and 3 are a cross-sectional view and an equivalent circuit diagram, respectively, illustrating the configuration of a portion of the solid state image pickup device shown in FIG. 1; FIG. 4 is an equivalent circuit diagram schematically showing a solid state image pickup device according to an embodiment of the present invention and its peripheral circuits; FIGS. 5 and 6 are a cross-sectional view and an equivalent circuit diagram, respectively, illustrating the configuration of a portion of the solid state image pcikup device shown in FIG. 4; FIGS. 7, 8, 9 and 10 are waveform diagrams and characteristic diagrams used for explaining the operation of the solid state image pickup device shown in FIG. 4; FIG. 11 is an equivalent circuit diagram schematically showing a solid state image pickup device according to another embodiment of the present invention and its peripheral circuits; FIGS. 12 and 13 are waveform diagrams used for explaining the operation of the solid state image pickup device shown in FIG. 11; FIGS. 14 and 15 are a cross-sectional view and an equivalent circuit diagram, respectively, illustrating the configuration of a solid state image pickup device according to further another embodiment of the present invention; FIG. 16 is an equivalent circuit diagram schematically showing the solid state image pickup device having the portion illustrated in FIGS. 14 and 15 and its peripheral circuits; FIGS. 17 and 18 are cross-sectional views showing portions of solid state image pickup devices according to other embodiments, respectively, of the present invention; FIGS. 19 and 20 are a cross-sectional view and an equivalent circuit diagram, respectively, illustrating the configuration of a portion of a solid state image pickup device according to a further embodiment of the present invention; FIG. 21 is an equivalent circuit diagram schematically showing the solid state image pickup device having the portion illustrated in FIGS. 19 and 20 and its peripheral circuits; and FIGS. 22 and 23 are cross-sectional views showing portions of solid state image pickup devices according to still further embodiments, respectively, of the present invention. Embodiments most preferable for working of the Invention Most preferable embodiments of the present invention will be described with reference to FIGS. 4 through 23. FIG. 4 shows an equivalent circuit of a solid state image pickup device according to one embodiment of the present invention together with a scanning circuit and an output circuit necessary for putting the solid state image pickup device into operation. This solid state image pickup device according to the present invention which is designated at 20 in its entirety, has an image pickup surface containing image pickup picture units F11 to Fmn arrayed in the same manner as the image pickup picture units Ell to Emn in the solid state image pickup device 1 illustrated in FIG. 1. Each of the image pickup picture units F11 to Fmn is composed of one of photoelectric transducers #G11 to Gmn for generating signal charge in response to light falling thereon, and one of NPN type bipolar transistors (hereinafter referred to simply as "transistors") X11 to Xmn serving as switching elements and arrayed as a matrix in rows and columns. The transistors X11 to Xmn have drains connected respectively to the photoelectric transducers G11 to Gmn The emitters of the transistors X11 to Xmn in respective row are connected in common to control terminals vl to vm, respectively, which are supplied with vertical scanning signals from the vertical scanning circuit 8, and the collectors of the transistors Xli to Xmn in respective columns are connected in common to the sources, respectively, of MOS FETs T1 to Tn serving as switching elements. The remaining portion is constructed in the same manner as the solid state image pickup device 1 shown in FIG. 1. Elements and parts in FIG. 4 corresponding to those in FIG. 1 are marked with the same references and detailed description thereof will be omitted. A specific structure of each of the image pickup picture units F11 to Fmn of the solid state image pickup device 20 of the present invention is illustrated in FIG. 5. FIG. 5 shows a cross section of an area where one image pickup picture unit is formed in the specific structure of the image pickup device 20. An N-type region 22 is formed in a P-type semiconductor substrate 21 and a P-type region 23 is formed in the region 22. Further, an N-type region 24 is formed in the region 23. With these region 22, 23 and 24 serving respectively as a collector, a base and an emitter, a transistor X which is one of the NPN-type transistors X11 to Xmn is formed. A collector electrode 25, a base electrode 26, and an emitter electrode 27 are disposed to contact with the regions 22, 23 and 24, respectively. The portion containing the transistor X is covered by an insulating layer 28 except for the electrode 25, 26 and 27. Over the area in which the transistor X is thus formed, there is placed another insulating layer 29 except for the base electrode 26. This insulating layer 29 is covered with an electrode 30 which-is composed of an aluminum layer, for example, and connected with the base electrode 26. A photoelectric conversion layer 31 composed of a thin film of chalcogenides is deposited over the electrode 30, and a transparent electrode (target electrode) 32 is formed on the photoelectric conversion layer 31. The photoelectric conversion layer 31 spreading over the area where the transistor X is formed includes a portion which serves as a photoelectric transducer G which is one of the photoelectric transducers G11 to Gmn Therefore, in this example, the photoelectric transducers G11 - Gmn are constituted by respective portions of the photoelectric conversion layer 31 extending over the image pickup surface. The photoelectric transducer G and the transistor X jointly form one F of the image pickup picture units F11 to Fmn, to which light from an object enters through the target electrode 32. The semiconductor substrate 21 is supplied with the substrate voltage VB, and the target electrode 32 is supplied with a target voltage VT (Vv 2 VT > 0)from a terminal 13. - The arrangement of FIG. 5 can be shown as an equivalent circuit of FIG. 6 in which one terminal of the photoelectric transducer G is connected to the base of the transistor X and the other terminal of the photoelectric transducer G is supplied with the target voltage VT. The collector of the transistor X is connected to one of the MOS FETs T1 to Tn, and the emitter thereof connected to one of the control terminals vl to vm. When light from an object falls on the image pickup picture units F11 to Fmn on the image pickup surface of the solid state image pickup device 20 thus constituted, the photoelectric transducers G11 to Gmn effect photoelectric conversion to produce electrons and holes as electric charge dependent on the quantity of incident light falling thereon. Then, signals based on the holes which are signal charge are delivered to the output terminal 12 to produce an image pickup signal output when the rows of the transistors X11 to Xmn are selectively turned on by the vertical scanning signals issued from the vertical scanning circuit 8 to the emitters of the transist.ors X11 to Xmn, and the MOS FETs T1 to Tn are selectively turned on by the horizontal scanning signals issued from the horizontal scanning circuit 9. For such vertical and horizontal scanning operation, the vertical scanning circuit 8 supplies to m control terminals vl to vm with vertical scanning signals 0 vl to vi vm, respectively, as shown in FIG. 7A, and the horizontal scanning circuit 9 supplies to n control terminals hl to hn with horizontal scanning signals # hl to ¯hn respectively, as shown in FIG. 7B. The vertical scanning signals vl to contain m pulses #vl to taking a low level during a period th corresponding to one horizontal period of a video signal and being generated successively in a period tv corresponding to one vertical period. The horizontal scanning signals fhl to #Xhn contain n pulses Ohl to 9 hn each having a high level during a short period and being generated successively in a period corresponding to each of the pulses 9v1 to QP vm in the vertical scanning signals #vl to dvm. The transistors Xll to Xmn are turned on when their emitters are supplied with the pulses #vl to @'v in the vertical scanning signals #vl to #vm,to and the MOS FETs Tl to Tn are turned on when their gates are supplied with pulses to to #hn in the horizontal scanning signals #hl to #hn. The pulse #hn. vi in the vertical scanning signal #vl delivered from the vertical scanning circuit 8 is first applied to the emitters of the transistors X11 to Xln which constitute the first row to energize the transistors X11 to Xln. During the period of the pulse #vl, the pulses #hl to in the horizontal scanning signals #hl hl to Xhn from the horizontal scanning circuit 3 are successively applied to the gates of the MOS FET Tl to Tn, respectively, to energize the MOS FET T1 to Tn, successively. Signal currents corresponding to the signal stored in the bases of the transistors X11 to Xln are now allowed to flow through the output resistor 10, a path between the drain and source of each of the MOS FETs T1 to Tn and a path between the collector and emitter of each of the transistors X11 to Xln. As a result, an image pickup signal output produced by the image pickup picture units F11 to Fln containing respectively the transistors X11 to Xln is obtained at the output terminal 12. Then, the pulse #v2 in the vertical scanning signal #v2 is supplied to the emitters of the transistors X21 to X2n which constitute the next row to energize these transistors X21 to X2n, and the MOS FET T1 to Tn are successively rendered conductive by the pulses çhl to çhn in the horizontal scanning signals to Xhn. Therefore, an image pickup signal output produced by the image pickup picture units F21 to F2n containing respectively the transistors X21 to X2n is obtained at the output terminal 12. Likewise, image pickup signal outputs produced by the successive image pickup picture units up to the image pickup picture units Fml to Fmn containing respectively the transistors Xml to X are delivered to the output terminal 12 mn successively in the period tv corresponding to one vertical period. Then, the foregoing cycle of operation is repeated. Now, the operation of one image pickup picture unit F on the image pickup surface of the solid state image pickup device 20 will be considered with reference to FIGS. 5 and 6. When light from an object falls through the target electrode 32 on a portion of the photoelectric conversion layer 31 forming the photoelectric transducer G in the image pickup picture unit F, electrons and holes are produced in the photoelectric conversion layer 31 in response to the quantity of incident light. While the electrons are trapped by the target electrode 32 supplied with the target voltage VT (VT > 0),. the holes are collected as signal charge to the base electrode 26 of the transistor X and stored in the base of the transistor X. When the transistor X is turned on by the pulse of low level in the vertical scanning signal applied to the emitter thereof, a current flows from the collector to emitter thereof. The current continues to flow until the holes stored in the base of the transistor X are completely reunited with electrons flowing into the transistor X from the emitter thereof. At this time, electric charge Qc flowing from the collector to emitter of the transistor X is given as Qc = hfex ¯ Q5, where Qs stands for the signal charge or the holes stored in the base of the transistor X and hfex stands for the current amplification factor hfe of the transistor X. Therefore, the signal charge generated in response to the quantity of incident light is amplified to be hfex times as much by the transistor X, and a signal current corresponding to the amplified signal charge flows through the transistor X. In general, the current amplification factor hfe of a transistor is of a considerably large value, and hence the image pickup picture unit F can perform an image pickup operation with a high degree of sensitivity. With the solid state image pickup device of the present invention, since the signal currents corresponding to the amplified signal charge generated by the image pickup picture units F11 to Fmn flow through the MOS FETs T1 to T and the output resistor 10 in the manner described n above to produce the image pickup signal output at the output terminal 12, the sensitivity of the image pickup device is highly increased and the image pickup signal output thus produced has an excellent signal-to-noise ratio. By keeping the level of the high-level portions other than the pulses #Çvl to ç vm of the vertical scanning signals fvl to Xvm to be higher than the level of the target v1 vm voltage VT, the transistors X11 to Xmn, except some of them selected to be turned on, are prevented from being undesirably turned on, so that blooming is avoided. In selectively energizing the transistors X11 to Xmn, an operating collector current 1c of each of the EMI17.1 accompanying the base, VBE stands for the voltage appearing between the base and emitter, and VE stands for the emitter potential. In the case where the falling edge of each of the pulses Çvl to Çvm in the vertical scanning signals #vm supplied to the emitters of the transistors X11 to Xmn vm has a linear slope from a level Lh of the high-level portion to a level L1 of the low-level portion of the vertical scanning signals #vl to #vm in a period tb corresponding to a horizontal blanking period within the period th corresponding to the horizontal period as shown in FIG. 8A, the relationship: : EMI17.2 is established and the foregoing relationship can be satisfied. Accordingly, when such vertical scanning signals #vl to #vm as shown in FIG. 8A are used, the operating collector current Ic of each of the transistors X11 to Xmn is made constant regardless of the quantity of the signal charge stored in the base. In such a case, the pulses #hl to #hn in the horizontal scanning signal d#fhl to #Xhn are arranged to be successively generated in a period t. corresponding to a video period within the period tv corresponding to the horizontal period. Since each of the transistors X11 to Xmn is an ordinary bipolar transistor, the operating collector current 1c and the current amplification factor hfe thereof have such a relationshiop as shown in FIG. 9 therebetween. When the operating collector current 1c becomes Io, the current amplification factor hfe takes the maximum value. Further, the operating collector current Ic and a noise level have such a relationship as shown in FIG. 10 therebetween. The noise level is reduced to be the minimum value when the operating collector current Ic becomes 1p Therefore, when the slope of the falling edge of each of the pulses #vl to in vmin the vertical scanning signals # vl to #vm as illustrated in FIG. 8A is selected to be EMI18.1 each of the transistors X11 to Xmn is used with the maximum current amplification factor during the conductive state thereof, so that the image pickup sensitivity is further increased. Otherwise, when the falling slope is-selected to be EMI18.2 each of the transistors X11 to Xmn is used with the lowest noise level during the conductive state thereof, so that an image pickup signal output with an improved signal-to-noise ratio is obtained. FIG. 11 is an equivalent circuit digram showning a solid state image pcikup device according to another embodiment of the present invention together with a scanning circuit and an output circuit required for causing the solid state image pickup device to operate. Elements and parts in FIG. 11 corresponding to those of FIG. 4 are marked with the same references. The solid state image pickup device of this example, which is designated at 20' in its entirety, has an image pickup surface composed of image pcikup picture units F'11 to F'mn arrayed in the same manner as the image pickup picture units F11 to Fmn in the solid state image pickup device 20 illustrated in FIG. 4. Each of the image pickup picture units F'11 to F'mn contains one of photoelectric trnasducers G'11 to G'mn which is formed by a portion of a photoelectric conversion layer composed of a thin film of amorphous silicon. A transparent target electrode placed on the photoelectric conversion layer is supplied with a negative target voltage Vt so that electrons are selected to serve as signal charge out of electrons and holes generated upon incidence of light. The image pcikup picture units F'11 to F' include mn also PNP-type transistors X'11 to X'mn serving as witching elements, respectively. The transistors X'11 to X'mn have collectors, bases, and emitters connected in the same manner as those of the transistors Xll to Xmn in the solid state image pickup device 20. Furthermore, other portions are arranged in the same manner as the solid state image pickup device 20. In this embodiment, however, vertical scanning signals #vl to #vm which are supplied to the emitters of the transistors X'11 to X'mn from the vertical scanning circuit 8 have pulses #v1 to (p' taking a high vm level during the period th corresponding to one horizontal period, respectively, as shown in FIG. 12A. These m pulses #'V1 to #'vm are successively generated in the period tv corresponding to one vertical period. As illustrated in FIG. 12B, horizontal scanning signals #hl to # hn are hl hn identical to those shown in FIG. 7B. The level of the pulses ?'vl to #'vm in the vertical scanning signals to to is selected to be higher than the operating voltage Vv, and the level of low level portions other than the pulses #'vl l to'vm of the vertical scanning signals #vl to #vl #vm is selected to be lower than the target voltage VT. According to this embodiment, electrons generated by the photoelectric transducers G'11 to G 'mn in response to the quantity of incident light in the image pickup picture units F'11 to F'mn are stored as signal charge in the bases of the transistors X'11 to X'mn. When each of the transistors X 11 to X'mn is turned on, the signal charge stored in the base thereof is amplified to be multiplied by the current amplification factor hfe, and a signal current corresponding to amplified signal charge then flows through each of the transistors X' to X' . The signal currents corresponding 11 mn to the signal charge generated and amplified by the image pickup picture units F'11 to F' mn flow via the MOS FETs T1 to Tn through the output resistor 10, so that an image pickup signal output can be obtained from the output terminal 12. Thus, the solid state image pickup device of this embodiment produces the image pickup signal output having an excellent signal-to-noise ratio and free from the problem of blooming with high image pickup sensitivity, and has the same advantages as the above-described solid state image pickup device 20. In teh case where the rising edge of each of the high level pulsesvl to #'vm in the vertical scanning signals Xvl to Xvm is sloped from the low level L1 to the vl vm high level Lh in the period tb corresponding to the horizontal blanking period within the period th corresponding to one horizontal period, as shown in FIG. 13, and the slope of the rising edge is selected to be EMI21.1 where C'cwhere cstands for the capacitance at the base of each of the transistors X'11 to X'mn, I'o for the operating collector current with which the current amplification factor hfe of each of the transistors X'11 to X'mn takes the maximum value, and I' for p the operating collector current with which the noise level in each of the transistors X'11 to X'mn takes the munimum value, the same advantages as those accompanying the foregoing solid state image pickup device 20 resulted from inclination of the falling edge of each of the pulses #vl to #vm in the scanning signals #vl to # vm at a particular scope, can be obtained. In the foregoing solid state image pcikup devices 20 and 20' shown in FIGS. 4 and 11, respectively, the lines connecting the emitters of the horizontal rows of the transistors Xll to Xmn or the transistors X'11 to #'X' in common may be made of metal-silicide so as to provide low resistance and thereby to be advantageous for a high-speed switching operation. Further, in each of the foregoing embodiments, the image pickup surface comprises a matrix of a plurality of image pickup picture units each composed of a photoelectric transducer and a transistor. However, the solid state image pickup device of the present invention may be constituted as a line image sensor having an image pickup surface comprising a single row of image pickup picture units each composed of a photoelectric transducer and a transistor. FIG. 14 shows a cross section of an image pickup picture unit in a solid state image pickup device according to further another embodiment of the present invention. Like the conventional arrangement of FIG. 2, N-type regions 3 and 4 are provided in a P-type semiconductor substrate 2, and a MOS FET S is formed with the regions 3 and 4 serving as drain and source regions, respectively. The MOS FET S has a gate electrode 6 disposed between and extending partly over these regions with an insulating layer 5 interposed between the gate electrode 6 and the semiconductor substrate 2, and a drain electrode 7. In this embodiment, a P-type region 114 is formed in the source region 4, and an N-type region 115 is formed in the region 114. These regions 114 and 115 together with the region 4 constitute an NPN-type phototransistor U with the region 4 serving as a collector region, the region 114 as a base region and the region 115 as an emitter region. The phototransistor U constitutes one photoelectric transducer D' connected to the source of the MOS FET S. The phototransistor U has an emitter electrode 116. Light from an object falls on the base region 114 of the phototransistor U. The semiconductor substrate 2 is supplied with the substrate voltage VB and the emitter electrode 116 is supplied with the voltage VE, and accordingly the image pickup picture unit in the solid state image pickup device of this example in which the photoelectric transducer D' is composed of the phototransistor U is illustrated by way of an equivalent circuit in FIG. 15 in which the collector of the phototransistor U forming the photoelectric transducer D' is connected to the source of the MOS FET S and the emitter of the phototransistor U is supplied with the voltage VE. FIG. 16 shows an equivalent circuit of a solid state image pickup device having an image pickup surface comprising a matrix of image pickup picture units each composed of the MOS FET S and the phototransistor U as described above, together with a scanning circuit and an output circuit necessary for causing the solid state image pickup device to operate. In FIG. 16, elements and parts corresponding to those of FIG. 1 are marked with the same references and detailed description thereof will be omitted. The solid state image pickup device of this example which is designated at 1' in its entirety, has an image pickup surface comprising a martix of image pickup picture units E'11 to E'mn. Each of the image pickup picture units E'11 to E'mn comprises one of MOS FETs SI to Smn and one of phototransistors U11 to Umn, which are represented as the MOS FET S and the phototransistor U in FIGS. 14 and 15. The phototransistors U11 to U constitute photoelectric transducers. The mn phototransistors U11 to Umn have emitters connected in common to a terminal 117 supplied with the voltage VE. Other portions are arranged in the same manner as the solid state image pickup device 1 shown in FIG. 1. The voltage VE, the substrate voltage VB imposed on the semiconductor substrate, and the operating voltage Vv are selected to meet the relationship: Vv > VE 2t VB When light from an object falls on the image pickup picture units E'11 to E' of the solid state image pickup mn device 1' thus constituted, each of the phototransistors U11 to Umn forming the photoelectric transducers generates signal charge dependent on the quantity of incident light and amplifies the generated signal charge. The amplified signal charge is then stored in the source of one of the MOS FETs Sll to Smn Such operation in one of the image pickup picture units E' to E' will be described with reference to 11 mn FIGS. 14 and 15. When light falls on one U of the phototransistors U11 to Umn, photoelectric conversion is effected at the junction between the base and collector of the phototransistor U, that is, the P-N junction between the regions 114 and 4, to generate pairs of electrons and holes dependent on the quantity of incident light. The generated electrons flow as signal charge into the region 4, and the generated holes flow into the region 114. As a result of this, the base potential of the phototransistor U is raised to forward-bias the junction between the base and emitter, and since the relationship VV VE 2! VB is satisfied, a current flows from the collector to emitter of the phototransistor U. The electric charge Qc flowing from the collector of the phototransistor U and stored in the source of the MOS FET S at this time is amplified to be Q = (1 + hfe) ¯ Qs by the c amplifying operation with the current amplification factor hfe of the phototransistor U, where Is isthe signal charge flowing from the base to the collwctor of the phototransistor U. Therefore, the phototransistor U is operative to generate signal charge dependent on the quantity of light falling thereon and also to amplify the generated signal charge to be 1 + hfe times as much. The amplified signal charge is then stored in a stray capacitor accompanying the source of the MOS FET S. Then, signals based on the signal charge amplified and stored in the sources of the MOS FETs Sll to Smn of the image pickup picture units E11 to Emn in the foregoing manner are delivered to the output terminal 12 to produce an image pickup signal output when the MOS FETs Sll to Smn and T1 to Tn are selectively turned on in the same manner as those of the solid state image pickup device 1 illustrated in FIG. 1. With the above solid state image pickup device 1' of the invention, since the signal charge is amplified at places where it is generated, the image pickup sensitivity is remarkably increased and an image pickup signal output with an excellent signal-to-noise ratio can be produced. Further, when the signal charge is stored, the collector potential of each of the phototransistors U11 to Umn, that is, the source potential of each of the MOS FET Sll to Smn is not reduced to be lower than the potential VE based on the voltage VE supplied thereto and the relationship: VV < VE < VB is satisfied as aforesaid. Accordingly, a parasitic transistor inserted in parallel between the source and drain of each of the MOS FETs Sll to Smn (for example, an NPN-type transistor with a collector composed of the drain region 3, a base of the semiconductor substrate 2, and an emitter of the source region 4 as shown in FIG. 14 and shown by broken lines in an equivalent circuit of FIG. 15 as being connected parallel to the MOS FET S) never be turned on. Therefore, no signal charge flows from the sources to the drains of the MOS FETs S11 to Smn through the parasitic transistors, and blooming can be avoided. Assuming that the stray capacitance accompanying the source of each of the MOS FETs S1 to Smn is indicated by Cc, the maximum quantity Q'm of signal charge stored in the stray capacitance-Ce can be expressed with the equation: : Q m cc (VV ¯ VE) The stray capacitance Cc is extremely large because it is the parallel-connected sum of the capacitance between the collector and base of each of the phototransistors U11 to Umn (the capacitance between the regions 4 and 114) and the capacitance between the source of each of the MOS FETs Sll to Smn and the semiconductor substrate (the capacitance between the region 4 and the semiconductor substrate 2). Consequently, the maximum quantity Q'm can be of a large-value and the dynamic range of the image pickup signal output can be greately widened. FIGS. 17 and 18 show cross-sectional views of image pickup picture units of solid state image pickup devices according to other embodiments of the present invention. In the embodiment shown in FIG. 17, a MOS FET $ serving as a switching element is of the same configuration as illustrated in FIG. 4. However, a phototransistor U forming a photoelectric transducer D' is arranged to have an emitter composed of an N-type region 118 formed independently in a semiconductor substrate 2, a base composed of a P-type region 119 formed in the region 118, and a collector composed of an N-type thin region 120 formed in the region 119. The collector region 120 and a region 4 serving as a source region of the MOS FET S are connected by an electrode 121 with an insulating layer 5 interposed therebetween. An emitter electrode 116 is disposed on the emitter region 118. Light from an object falls on the collector region 120 of the phototransistor U. The region 120 is thin, and the P-N junction between the base and collector for effecting photoelectric conversion, that is, the P-N junction between the regions 119 and 120, is located in a shallow position below the surface of the device. Accordingly, the sensitivity to blue light is particularly improved. In the embodiment of FIG. 18, a MOS FET S serving as a switching element is also of the same configuration as illustrated in FIG. 4, but a phototransistor U forming a photoelectric transducer D' has a different configuration. An N-type region 122 is formed to be continuous to a source region 4 of the MOS FET S, and a P-type region 123 is embedded in the region 122. A P+-type thin region 124 is connected to the P-type region 123 and exposed on the surface. An Ntype region 125 is formed in the region 123 in such a manner that the thickness of a portion of the region 123, which is sandwiched between the regions 125 and 122, is reduced. The phototransistor U thus formed has a collector composed of the region 122, a base of the regions 123 and 124, and an emitter of the region 125. An insulating layer 5 is deposited on the surface except for the regions 124 and 125, and an emitter electrode 126 is placed on the region 125. Light from an object falls on the base region 124. Since the region 120 is thin, the P-N junction between the base and collector for effecting photoelectric conversion, that is, the P-N junction between the regions 124 and 122, is located in a shallow position below the surface of the device in the same manner as the arrangement of FIG. 17. Accordingly, the sensitivity to blue is particularly improved. Because the region 124 is of the P+-type, the junction capacitance between the regions 122 and 124 is large. Therefore, the stray capacitance accompanying the source of the MOS FET S where signal charge are stored is large, so that the maximum quantity of signal charge stored therein is increased with the result that the dynamic range of an image pickup signal output can be widened. Further, due to the reduced thickness of the region 123 between the regions 122 and 125, the base of the phototransistor U has the reduced width, and therefore the phototransistor U acts as a vartical NPN-type transistor having a large current amplification factor hfe for performing effective amplification of generated signal charge. FIG. 19 illustrates, in cross section, a portion of a solid state image pickup device according to a further embodiment of the invention, in which an image pickup picture unit is formed. In this embodiment, a MOS FET S serving as a switching element is of the same configuration as shown in FIG. 14, and a P-type region 126 is formed in a source region 4 of the MOS FET S with an N-type region 127 formed therein. The regions 126, 127 and 4 jointly constitute an NPN-type transistor w having a collector composed of the region 4, a base of the region 126, and an emitter of the region 127. A base electrode 128 is placed on the region 126, and an amitter electrode 129 is placed on the region 127. An insulating layer 130 is deposited on the surface except for the base electrode 128, and an electrode 131 in the form of a layer is placed on the insulating layer 130 and connected to the emitter electrode 129. A photoelectric conversion layer 132 comprising a thin film of chalcogenides is disposed over the electrode layer 131, and a transparent electrode (ta-rget electrode) 133 is deposited on the photoelectric conversion layer 132. A portion of the photoelectric conversion layer 132 extending over both the MOS FET S and the transistor W forms a signal charge generator Y which will operate on the principle of photoelectric conversion. With this embodiment, a photoelectric transducer D" connected to the source of the MOS FET S functioning as a switching element is composed of the signal charge generator Y formed by a portion of the photoelectric conversion layer 132 and the tr-ansistor W with its base connected to the signal charge generator Y. The transistor W serves to amplify signal charge generated by the signal charge generator Y. The semiconductor substrate 2 is suplied with the substrate voltage VBr the emitter electrode 129 with the voltage VE, and the target electrode 133 with the target voltage VT (VT > 0). The configuration of FIG. i9 is represented by an equivalent circuit of FIG. 20 in which the collector of the transistor W is connected to the source of the MOS FET S and the base thereof is connected to one terminal of the signal charge generator Y, and the voltage VE is imposed on the emitter of the transistor W and the target voltage VT on the other terminal of the signal charge generator Y. FIG. 21 shows an equivalent circuit diagram of the solid state image pickup device having the image pickup picture units each constituted as shown in FIGS. 19 and 20, and a scanning circuit in a similar representation to FIG. 16. (Only a portion of the circuit is shown, with the rest omitted from illustration.) In FIG. 21, elements and parts corresponding to those of FIG. 16 are marked with the same references. The solid state image pickup device, which is designated at 1" in its entirety, has transistors W11? W12,.. and signal charge generators Yll, Y12, , each shown as the transistor W and the signal charge generator Y, respectively, in FIGS. 19 and 20, in place of the phototransistors U11 to Umn in the solid state image pickup device 1' shown in FIG. 16. The transistors will, W12, . have emitters connected in common to a terminal 117 supplied with a voltage VE, and the signal charge generators Yllt Y12 ¯. have terminals connected in common to a terminal 134 supplied with a target voltage VT. Other portions are arranged in the same manner as the solid state image pickup device 1' illustrated in FIG. 16. The voltages are selected to meet the relationship: VV > V 2?V B in the same manner as those of the solid state image pickup device 1'. The operation of one of the image pickup picture units of the solid state image pickup device 1" will now be described with reference to FIGS. 19 and 20. When light falls through the target electrode 133 on the portion of the photoelectric conversion layer 132 constituting the signal charge generator Y, electrons and holes are generated in the photoelectric conversion layer 132. The electrons are trapped by the target electrode 133 supplied with the target voltage VT, and the holes are collected as signal charge to the base electrode 128 of the transistor W. As a result of this, the base potential of the transistor W is raised to forward-bias the junction between the base and emitter, and since the relationship: Vv > VE 2 VB is satisfied, a current flows from the collector to emitter of the transistor W. The electric charge Q'c flowing from the collector to emitter of the transistor W at this time is amplified to be c = (1 + hfe) Q's by the transistor W with the current amplification factor hfe, where Q's stands for the signal charge flowing into the base of the transistor w. Therefore, the transistor W amplifies the signal charge generated in response to the quantity of incident light to be 1 + hfe times as much. The amplified signal charge is discharged from the stray capacitance accompanying the source of the MOS FET S, and the potential of the source of the MOS FET S is reduced in proportion to the amplified signal charge. This is equivalent to the fact that the same quantity of electrons as that of the holes acting as the amplified signal charge is stored in the source of the MOS FET S. Then, a signal based on variations in the potential of the source of the MOS FET S are delivered to produce an image pickup signal output through the MOS FET S. The solid state image pickup device 1" of the foregoing configuration has the same effects and advantages as the solid state image pickup device 1'. FIG. 22 shows a still further embodiment which is different from the embodiments of FIGS. 19 and 22 in that a MOS FET S is of the P-channel type emplying an N-type semiconductor substrate 2, and a transistor W is of the PNPtype. A photoelectric conversion layer 132 is composed of a thin film of amorphous silicon. The target voltage VT is arranged to be a negative voltage. Electrons produced in the photoelectric transducer 132 in response to the quantity of incident light are used as signal charge and amplified by the transistor W. In this case, unlike the arrangement of FIG. 22, it is desired for a higher switching operation to have the MOS FET S of the N-channel type. In the case where the MOS FET S is of the N-channel type, a P-type well is formed in an N-type semiconductor substrate 2, and the MOS FET S is formed in the P-type well region. FIG. 23 shows one example of such an arrangement.- In FIG. 23, a region 135 serves as the P-type well region, and a MOS FET S which has drain and source regions 136 and 137 formed in the region 135 is provided. An independent P-type region 138 is formed in the semiconductor substrate 2 to provide a collector region of the transistor W. The drain region 136 of the MOS FET S and the collector region 138 of the transistor W are connected by an electrode 139, so that the transistor W is connected to the drain of the MOS FET S. The MOS FET S has a source electrode 140. Applicability For Industrial Use As described above, the solid state image pickup device of the present invention has the extremely high image pickup sensitivity and can produce an image pickup signal output which is provided with an excellent signal-tonoise ratio and a widened dynamic range, and substantially free from the problem of blooming. Accordingly, the solid state image pickup device of the present invention is suitable for use to constitute still image pickup apparatus with a high-speed shutter. Further, since the solid state image pickup device of the present invention has high-sensitivity characteristics and comprises a multiplicity of individual image pickup picture units of small areas in an image pickup surface of a fixed area, the device is also suitable for use in high-resolution image pickup apparatus.

Claims: Claims for Patent 1. A solid state image pickup device comprising image pickup picture units (F11 to Fmn; F'11 to F'mn; E'11 to 11 my composed of photoelectric transducers (G11 to Gmn; G'11 to G'mn; U11 to Umn; Y11 to Ymn' ... r Wll, W12, ¯. ) for generating signal charge upon the reception of light and switching elements (X11 to Xmn; X' 11 to X'mn 11 to Smn) electrically connected to said photoelectric transducers, wherein signals based on the signal charge generated in response to the quantity of light incident on said photoelectric transducers and then amplified are derived from said image pickup picture units through said switching elements, thereby to produce an image pickup signal output. 2. A solid state image pickup device according to claim 1, wherein said switching elements have a#function to amplify the signal charge generated in response to the quantity of light incident on said photoelectric transducers and to deliver the signals based on the amplified signal charge. 3. A solid state image pickup device according to claim 2, wherein said switching elements comprise bipolar transistors (X11 to Xmn; Xmn; to X'mn) having bases connected to said photoelectric transducers and emitters supplied with control signals, and the signals based on the signal charge generated in response to the quantity of light incident on said photoelectric transducers and amplified by said bipolar transistors are delivered through collectors of said bipolar transistors. 4. A solid state image pickup device according to claim 1, wherein said photoelectric transducers have a function to generate the signal charge dependent on the quantity of light incident thereon and to amplify the generated signal charge and the signals based on the amplified signal charge from said photoelectric transducers are delivered by said switching elements. 5. A solid state image pickup device according to claim 4, wherein said photoelectric transducers comprise phototransistors (U11 to Umn) having output terminals connected to said switching elements. 6. A solid state image pickup device according to claim 4, wherein said photoelectric transducers comprise signal charge generators (Y11, Y12, ) and amplifying transistors (W11 to W12, ¯¯ ) having bases connected to said signal charge generators and output terminals connected to said switching elements.

Inventors: MAEKAWA, TOSHIKAZU, OHTSU, KOJI, SONEDA, MITSUO
Applicants: SONY CORPORATION
Application year: 1983
Main classification: H04N5
IPC codes: H04N3, H01L27