IONIZING RADIATION-SENSITIVE MATERIAL AND ITS USE FOR PREPARING A PATTERN

Abstract: An ionizing radiation-sensitive material consisting essential­ ly of a polymer (which may be a homopolymer or a copolymer) having a recurring unit represented by formula (A): (wherein X, Y¹ and Y² are the same or different and each represents hydrogen, methyl or halogen and R¹, R², R³, R⁴ and R⁵ are the same or different and each represents hydrogen, halo­ gen, C₁-C₃ alkyl, C₁-C₃ alkoxy C₁-C₃ haloalkyl or C₁-C₃ haloal­ koxy, at least some of the groups represented by X and by Y¹ and/­ or Y² being halogen atoms and at least some of the groups represented by R¹-R⁵ being haloalkyl or haloalkoxy groups) is particularly suitable for use as a negative-type resist material. It can be prepared by halogenating a nonhalogenated polymer of comparable structure and can be used in the form of an organic solvent solution to form a coating film from which, by selective irradiation, patterns may be formed.

Description: ITS USE FOR PREPARI:'a A PATTER;i . The present invention relates to a material which is sensitive to such ionizing radiation as far ultraviolet radiation, electron beams and X-rays, and which material is suitable for use as a negative-type resist. The production of electronic components, such as transistors and integrated circuits, has hitherto been carried out by coating a photoresist on a base, irradiatiny the photoresist with light through a photo-mask, dissolving the uncrosslinked part of the photoresist in a developer, and then wet-etching the part of the substrate other than the desired pattern. However, when light is used as part of this series of steps, there is a limit to the resolution which is attainable because of the diffraction of the light and, moreover, ttie wet-etching process has been unable to etch sufficiently fine patterns because of "side etching" (in which sore of the etchant goes around the edges of the pattern to its underside and undermines parts cm the pattern which should be untouched) and because of the influence of impurities in the etchant. To overcome the former problem, a technique has recently been developed in which highly accurate patterns are formed using high energy ionizing radiation, for example far ultraviolet radiation, electron beams, X-rays and the like (which have a short wave-length) in place of light. To overcome the latter problem, there has been developed an etching technique for producing fine patterns not by wet-etching but by a dry-etchin method using, for example, gas plasma, reactive ion etching, ion milling or the like. When it is intended to form a pattern by irradiation with ionizing radiation, followed by dry etching, the resist used must be sufficiently sensitive to ionizing radiation to form a fine pattern with a high degree of accuracy and, at the same time, it must be highly resistant to dry etching. Although polystyrene is known as an example of a resist material which is sensitive to ionizing radiation, it has the fault that its sensitivity to ionizing radiation is still too low. We have now discovered an ionizing radiation-sensitive material having a high degree of sensitivity to ionizing radiation, which is capable of forming a fine pattern with a good degree of accuracy and which has a hiyh resistance to dry etching. Thus, the present invention consists in an ionizing radiation-sensitive material which comprises a polymer (which may be a homopolymer or a copolymer) having a recurring unit represented by the formula (A): EMI3.1 in which: X, y1 and y2 are the same or different and each represents a hydrogen atom, a methyl group or a halogen atom; and R1, 2, R3, R4 and R5, which may be the same or different, each represents a hydrogen atom, a halogen atom, a C1-C3 alkyl group, a C1-C3 alkoxy group, a C1-C3 haloalkyl group or a C1-C3 haloalkoxy group, at least some of the groups represented by X and at least some of the groups y1 and/or Y2 in said polymer being halogen atoms and at least some of the groups represented by R1, R2, R3, R4 and R5 in said polymer being a haloalkyl or a haloalkoxy group. In the polymer employed in the present invention, the proportion of the number of recurring units represented by the aforementioned formula (A) in which X represents a halogen atom Liereinafter referred to as "recurring units (A-i)11 ] is preferably from 2 to 25% , more preferably from 5 to 20%. The proportion of the number of recurring units represented tiy the aforementioned formula (A) in which one or more of the groups represented by R1, 3 R3, R4 and R5 is a haloalkyl or a haloalkoxy group Eh#reinafter referred to as "recurring units (A-2)"1 is preferably from 3 to 40%, and more preferably from 5 to 35%. The proportion of the number of recurring units represented by the aforementioned formula (A) in which one or more of the groups represented by yl and/or Y2 is a halogen ato, Etiereinafter referred to as "recurring units (A-3)11 ] is preferably from 2 to 25%, more preferably from 5 to 0%. The percentages of units (A-1), (A-2) and (A-3) are based on the total number of recurring units in the polymer. If the proportion of the number of recurring units (A-l) increases, the resistance to dry etching increases; if the proportion of the number of recurring units (A-2) increases, the sensitivity to ionizing radiation increases; and the proportion of units (h-3) contributes to enhancement of resolution. We prefer that the sum of the percentages of recurring units (A-l), (A-2) and (A-3) should be from 7 to 70%, more preferably from 9 to o0S, based on the total number of recurring units in the polymer, although the total sum may vary depending on the method of synthesis. The total halogen content of the polymer is preferably from 1 to 50% by weight, more preferably from 1 to 45X by weight, and most preferably from 1 to 25% by weight. When X-rays are used as the ionizing radiation, a relatively highly halogenated product is preferred to enhance absorption of the X-rays. In this case, the total halogen content of the polymer is preferably from 5 to 5#% by weight. The percentaye halogen contents given herein are based on the total weight of the polymer. For the purposes of the present invention, a recurring unit represented by the aforementioned formula (A) in which the group represented by X is a halogen atom, one or more of the groups represented by R1, R2, R3, R4 and R5 is a haloalkyl or haloalkoxy group and at least one of Y1 and y2 is a halogen atom is counted thrice, once as a.recurring unit (A-l), once as a recurring unit (A-2), and once as a recurring unit (A-3). Similarly, for example, a recurring unit in which X and at least one of Y1 and Y2 represent halogen atoms, whilst R1, R2, R3, R4 and R5 represent hydrogen atoins, alkyl groups, alkoxy groups or halogen atoms is counted twice, once as a recurring unit (A-l) and once as a recurring unit (A-3). In the recurring units represented by formula (A), we prefer that R1, R2, R3, R4 and R5 should each represent a hydrogen atom, a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a propoxy group, a chlorine atom, d bromine atom, an iodine atom, a fluorine atom, a chloromethyl group, a bromomethyl group, a chloroethyl group, a chloropropyl group, a chloromethoxy group, an iodomethoxy group, a bromomethoxy group, an iodopropyl group, a chloroethoxy group, a chloropropoxy group, a dichloroethyl group, a dibromomethyl group, a diiodonethyl group, a dichloroethyl group, a dibromoethyl group, a dichloropropyl group, a dibromopropyl group, a dichlorornethoxy group, a dibromomethoxy group, a diiodomethoxy group, a dichloroethoxy group, a dibromoethoxy group, a dichloropropoxy group, a dibromopropoxy group, a trichloromethyl group, a tribromomethyl group, a tricilloroethyl group, a tribromoethyl group, a trichloromethoxy graup or a tribromomethoxy group. We particularly prefer that one of the groups represented by R1, R2,R3, R4 and R5 should be a methyl, chloromethyl, bromomethyl, dichloromethyl or dibromornethyl group and the others should be hydrogen atoms. In the recurring units of formula (A), where X, y1 and Y2 represent halogen atoms, they are preferably chlorine, bromine, fluorine and iodine atoms and the atoms represented by X, Y1 and Y2 may be the same or different. The polymer may contain t#o or more different kinds of halogen atom. other recurring units which can form a copolymer in combination with the recurring unit or units represented by formula (A) include: units derived from ethylenically unsaturated compounds, such as etnyl acrylate, butyl acrylate, glycidyl acrylate, ethyl methacrylate, butyl methacrylate, glycidyl methacrylate, a-vinylnaphthalene, #-vinyl naphthalene, 2-vinylpyridine, 4-vinylpyridine, maleic anhydride anu vinyl acetate; units derived from conjugated dienes, such as butadiene or isoprene; and halogenated units corresponding to the aforementioned ethylenically unsaturated and conjugated diene units. However, the proportion of the number of other such recurring units is preferably less than 50% and more preferably less than 20%, based on the total number of recurring units in the copolymer, in order to achieve adequate sensitivity of the copolymer to ionizing radiation and adequate resistance to dry etching. The molecular weight of the polymer employed in the present invention is not critical, although a higher molecular weight is preferred in order to achieve high sensitivity to ionizing radiation, whereas a lower molecular weight is preferred in order to facilitate handling when formins a resist film. The range of number average molecular weights satisfying these two contradictory requirements is preferably from 10,000 to 1,500,000, and more preferably from 10,000 to 1,000,000, as measured by a membrane osmometer. The polymer employed in tile present invention may be prepared, for example, by polymeriziny a monomeric material comprising at least one monomer of formula (B): EMI8.1 (wherein: R11 R12 R13 R14 and R15, which may be the same or different, each represents a hydrogen atom, a C1-C3 alkyl group or a C1-C3 alkoxy group, provided that R11, R12, R13, R14 and R15 do not all simultaneously represent hydrogen atoms; ; and Z1, Z2 and Z3 are the same or different and each represents a hydrogen atom, a fluorine atom or a methyl group, provided that when z1 represents a methyl group, Z2 and Z3 both represent hydrogen atoms), optionally together with at least one monomer of formula (C): : EMI8.2 (wherein Z4, Z5 and z6 are the same or different and each represents a hydrogen atom, a fluorine atom, or a methyl group, provided that, when Z1 in the general formula (3) represents a methyl group Z4 represents a hydrogen atom) with a halogenatiny reagent under free radical conditions, for instance, in the presence of a radical-generating ayent or under irradiation with light or ultraviolet rays. Two preferred embodiments (1) and (2) of this production process are given below. (1) A process which comprises polymerizing a monomeric material comprising at least one monomer represented by the general formula (D): EMI9.1 same meanings as defined in the general formula (B) ] , or a monomeric material comprising at least one monomer represented by the general formula (D) and at least one monomer represented by the general formula (E): : EMI10.1 [ wherein Z4, Z5 and z6 have the same meanings as defined in the general formula (C) ] , and subsequently, radically halogenating the resulting polymer, in the form of a solution in a solvent or swollen with a solvent, with a compound having a halogen radical-generating ability (such as t-butyl hypochlorite, t-butyl hypoiodite, chlorine or bromine) in the presence of a radical-generating agent (such as 4,4' azobisisobutyronitrile, benzoyl peroxide or lauroyl peroxide) or under irradiation with light or ultraviolet-rays as described in, for example, the Journal of Americal Chemical Society, Vol. 82, 108 (1960). (2) h process which comprises polymerizing a monomeric material comprisiflj at least one monomer represented by the general formula (D) or a monomeric material comprising at least one monomer represented by the general formula (D) and at least one monomer represented by the general formula (E), and subsequently, radically halogenating the resulting polymer, in the form of a solution in a solvent or swollen with a solvent, with an k'-lialogenated compound (such as k-chlorosuccinimide, ¯J-bromosuccinimide or ìX-bromo- acetamide) in the presence of the said radical-generating agent or under irradiation with light or ultraviolet-rays as described in, for example, the Journal of Americal Chemical Society, Vol. 7, 2fizz (1952). Examples of monomers which may be represented by general formula (D) and which can be used to prepare the polymer employed in the present invention include o-methylstyrene, m-methylstyrene, p-methylstyrene, p-ethylstyrene, o-ethylstyrene, m-ethyl styrene, p-methoxystyrene, o-methoxystyrene, m-niethoxystyrene, a-methyl-p-methylstyrene and #-methyl -p-methoxystyrere. A single one of these monomers or a combination of any two or ore of them may be used. Examples of mononiers wiiich may be represented by general formula (E) include a-methylstyrene and styrene itself. Again, a single one of these monomers may be used or two or more of them may be used. Examples of monomers which may be polymerized in addition to the monomers represented by general formulae (D) and (;) include, for example: acrylic esters, such as ethyl acrylate, butyl acrylate, or glycidyl acrylate; tiethacrylic esters, such as ethyl methacrylate, butyl methacrylate or glycidyl methacrylate; aromatic vinyl compounds other than the monomers represented by general formulae (D) and (5), such as #-vinylnaphthalene, #-vinylnaphthalene, 2-vinylpyridine or 4-vinylpyridine; maleic anhydride; vinyl acetate; and conjugated dienes, such as butadiene or isoprene. The proportion of recurring units of formula (B) to the total recurring units in the polymer from which the polymer of the inventi#on is prepared is preferably from 20 to 100%, nore preferably from 30 to 100%, in order to enhance the sensitivity of the polymer of the invention to ionizing radiation. The proportion of recurring units represented by general formula (C) to the total number of recurring units in the initial polymer from which the polymer of the invention is prepared is preferably fron 0 to 80%, more preferably from 0 to 70%. The number average molecular weight of this initial polymer is preferably from ,0 to 150,000, more preferably from 8,000 to 100,000. In processes (1) and (2), the solvent used in the halogenation reaction is preferably a solvent which does not interact with halogen radicals. For this reason, we particularly prefer to use benzene or a halosenated hydrocarbon, such as carbon tetrachloride, carbon tetrabroiide or 1,1,2-trichloroethane. In order to achieve a polymer having the desired degree of halogenation, it is generally necessary to control the halogenation in both Processes (1) and (2). In Process (1), the degree of halogenation is generally controlled by varying the amount of the compound which is capable of generating halogen radicals. In Process (2), it is controlled by varying the amount of the N-halogenated compound. For both Processes (1) and (2), the reaction conditions are as follows. The concentration in the reaction mixture of polymer to be halogenated is preferably from 3 to 20% by weight. When a radical-#enerating agent is used, the amount of said agent is preferably from 0.01 to 5 parts by weight, per 100 parts by weight of the polymer to be halogenated. The reaction temperature is preferably from 4G C to 00 C. When halogenating under the influence of light or ultraviolet radiation, the intensity of the light or ultraviolet radiation may be varied, dependiny upon the desired degree of haloyenation. In order to stabilize the polymer haviny recurring units of formula (A), a stabilizer miay be incorporated in an amount of from 0.5 to 5% by weight. Examples of suitable stabilizers include: hydroxyaromatic compounds, such as hydroquinone, methoxyphenol, #-t-butylcatechol, and 2,2'- methylenebis(6-t-butyl-4-ethylphenol); quinones such as benzoquinone, p-toluquinone, and p-xyloquinone; amines such as phenyl -#-naphthyl amine, and e,p'-dipheny#phenyl enediamine; and sulphur compounds, such as dilauryl thiodipropionate, 4,4'-thiobis(6-t-butyl-3-methylphenol), 2,2'-thiobis(6-t-butyl- 4-methylphenol) and 2-(3,5-di-t-butyl-4-hydroxyanilino)-4,6bis(N-octylthio)-s-triazine. The process of the present invention for foniiiny patterns employing the ionizing radiation sensitive material of the present invention preferably comprises the steps: (1) forming a coating film of the ionizing radiation-sensitive material on a substrate, preferably using the material in the form of an organic solvent solution, by forming a film of the solution and then removing the solvent; (2) irradiating the desired parts of the coating film with ionizing radiation; (3) treating the coating film with a developing agent; and (4) treating the coating film with a rinsing agent. in step (1), the organic solvent used is preferably a petroleum fraction, such as xylene, ethylbenzene, or toluene. The concentration of the ionizing radiation-sensitive material in the solution cannot be specified generally, as it is determined in accordance with the thickness of the film to be formed, however, we generally employ a solution- having a concentration of from 5 to 3ú% by weight. In step (2), the amount of ionizing radiation employed will vary depending upon the chemical structure, molecular weight and the like of the ionizing radiation-sensitive material and thus cannot be determined uniquely. However, as is well known in the art, the irradiation is effected until the desired parts of the coating film have been sufficiently cross-linked. In step (3), the treatment with the developing agent is designed to dissolve the uncrosslinked portions of the coating film and remove them from the film. This developing agent may be any good solvent for dissolving the ionizing radiation-sensitive material and its nature is not particularly critical. The solvent is preferably an organic solvent, such as benzene, toluene, xylene, cyclohexane, ethylcycloilexane, decahydronaphthalene (e.g. that sold under the Trade ilark DECALI;-#11), ethylene glycol monoethyl ether acetate, methyl ethyl ketone, methyl isobutyl ketone, isoamyl acetate, 2-nitropropane or i,i,2-trichloroethane or an organic solvent comprising one or more of these as the major component. The tenperature at which the film is treated with the developing agent is usually from 200C to 300C and the time required is generally from 5 seconds to 5 minutes. In step (4), treatment with the rinsing agent is designed to extract the developing agent from cross-linked parts of the coating film which have been swollen by the developing agent. The nature of the rinsing agent is not critical, although it should be compatible with the developing agent and should also be a poor solvent for the ionizing radiationsensitive material. Suitable liquids which may be used as the rinsing agent include, for example, alcohols and organic solvents containing at least 10S by weight of an alcohol having from 1 to 6 carbon atoms. Suitable such alcohols include isobutanol, t-butanol , heptanol, 2-butanol, ethanol, methanol, ethylene gylcol and amyl alcohol. In addition, these alcohols may be used in admixture with one or more of the same solvents as are exemplified above for use as the developing agent. The temperature for treatment with the rinsing agent is usually from 2C"C to 300C arid the time required is usually from 5 seconds to 5 minutes. The rinsing treatment may be conducted twice or thrice, using different rinsing agents. When the ionizing radiation-sensitive material employed and the process conditions are in accordance with the preferred embodiments described above, it is possible to form a fine pattern with a high degree of accuracy and with a high resistance to dry etching. The invention is further illustrated by the following Examples and with reference to the accompanying drawing, which shows the characteristic curve showing the sensitivity of the coating film obtained in Examples 3 and 4 and Comparative Example o. However, the Examples are merely by way of illustration and not by way of limitation. Example 1 A magnetic stirrer was introduced into a round-bottom flask, and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 320 g of cyclohexane and 35.4-g of p-metnyl styrene were introduced to form a homogeneous solution, and then the temperaure of the solution was kept at 500 C. Subsequently, under a stream of nitrogen, 0.80 ml of a 0.50 mole/liter solution of n-butyllithium in cyclohexane was added to initiate the polymerization. The polymerization conversion reached 91.5% in 120 minutes. The resulting reaction mixture was poured into methanol containing 2,6-di-t-butyl-p-cresol to recover pmethylstyrene polymer. It was dried under reduced pressure at 4000 for 16 hours. In a round-bottom flask was placed 11.8 g of the dried polymer, and the air in the flask was replaced with nitrogen, after which 224 g of carbon tetrachloride, 96 mg of 4,4'-azobisisobutyronitrile and 3.5 g of t-butyl hypochlorite were added and the resulting mixture was subjected to reaction for 90 minutes while keeping the temperature of the mixture at 700 C. The reaction mixture was poured into methanol containing 2,2l-methylene-bis(6-t- butyl-4-methylphenol) to separate the product which was then recovered. By analyzing the product by means of a H-nuclear magnetic resonance apparatus (JNM-4H-100, manufactured by Nippon Denshi), it was found that the peak due to the hydrogen of methyl group in the vicinity of 6 = 2.2 #ppm and the peak due to the hydrogen of methyl group in the vicinity of 6 = 1.8 ppm, which were seen in the starting polymer, became small. Moreover, 13 by analyzing the product by means of a L nuc. magnetic resonance apparatus (JNM-FX-l00, manufactured by Nippon Denshi), absorption due to chloromethyl group was newly observed at 6 = 46.1 ppm and further absorptions due to EMI19.1 and due to EMI19.2 were observed at 6 =.68 - 76 ppm and 6 = 51 - 55 ppm, respectively. From this fact, it was confirmed that the methyl group in the polymer and the methylene and methine groups in the main chain were chlorinated. Analyzing in detail these nuclear magnetic resonance spectra, the recurring units (A-l), (A-2) and (A-3) were confirmed to be contained in proportions of 7.5%, 16% and 6.5%, respectively. Furthermore, the chlorine content was 8.3% by weight and the number average molecular weight was 4.5 x 105 as measured by a membrane osmometer. The product obtained above was dissolved in xylene to form a 6.5% by weight solution. The solution was put on a silicon wafer having a thermally oxidized layer (0.7 Vm in thickness), and the assembly was rotated first at 200 r.p.m. for 2 seconds and subsequently at 4,000 r.p.m. for 30 seconds to coat the solution on the wafer. The solvent was volatilized away by a heat-treatment at 800C for 30 minutes to obtain a coating film having a thickness of 0.5 vm formed on the wafer. After irradiating it with deep ultraviolet rays through a mask by means of an exposer (PLA-521 F, manufactured by CANON, INC.), it was developed with Cellosolve acetate for 1 minute and then rinsed with a mixed solution of methyl ethyl ketone and isopropyl alcohol (1:1 by volume) for 1 minute. As a result, it was found that an image of 0.6 um could be resolved with a high fidelity to mask by an irradiation energy of 6.8 mJ/cm2. Example 2 A magnetic stirrer was placed in a roundbottom flask, and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 577 g of cyclohexane, 49.9 g of styrene and 14.2 g of o-methylstyrene were introduced into the flask to form a homogeneous solution, after which the temperature of the solution was kept at 6,00 C. Subsequently, under a stream of nitrogen, 2.4 ml of a 0.25 mole/liter solution of n-butyllithium in cyclohexane was added to the solution to initiate the polymerization. The polymerization conversion reached 100% in 60 minutes. Thus, the reaction mixture was poured into methanol containing 2,V'-methylene-bis(6-t-butyl-4-ethylphenol) to recover the resulting styrene-o-methylstyrene copolymer. The copolymer was dried under reduced pressure at 400C for 16 hours. Then, 10.7 g of the copolymer thus obtained was placed in a round-bottom flask and the air in the flask was replaced with nitrogen, after which 224 g of l,1,2-trichloroethane, 96 mg of 4,4'-azobisisobutyronitrile and 4.2 g of N-chlorosuccinimide were added and the resulting solution was subjected to reaction for 1.5 hours while keeping the temperature of the solution at 700C. The reaction product was poured into methanol containing 2,2'-methylene-bis(6-t-butyl4-ethylphenol) to separate the product, which was then recovered. Its chlorine content was 7.0% by weight. Analyzing the structure of the product in the same manner as in Example 1, it was confirmed that the recurring units (A-l), (A-2) and (A-3) were contained in proportions of 8.5%, 12% and 7.5%, respectively. Furthermore, the chlorine content was 8.5% by weight and the number average molecular weight was 2.3 x 105 as measured by a membrane osmometer. The product obtained above was dissolved in xylene to form an 8.5% by weight solution. The solution was put on a silicon wafer having a thermally oxidized layer (0.7 pm in thickness) and the assembly was rotated first at 200 r.p.m. for 2 seconds and subsequently at 4,000 r.p.m. for 30 seconds to coat the wafer with the solution. The solvent was volatilized away by a heattreatment at 800C for 30 minutes to obtain a coating film having a thickness of 0.5 vm formed on the wafer. After irradiating it with deep ultraviolet rays through a mask using an exposer, it was developed with Cellosolve acetate for 1 minute and then rinsed with a mixed solution of methyl ethyl ketone and isopropyl alcohol (1:1 by volume) for 1 minute. As a result, it was found that an image of 0.6 pm was resolved with a high fidelity to mask by a deep ultraviolet irradiation energy of 7.8 mJ/cm . Example 3 In the same manner as in Example 1, a coating film having a thickness of 0.5 vm was formed on silicon wafer having a thermally oxidized layer. Subsequently, the resulting assembly was irradiated with electron beams at an acceleration voltage of 20 kV, developed with Cellosolve acetate for 1 minute, and then rinsed with a mixed solution of methyl ethyl ketone and isopropyl alcohol (1:1 by volume) for 1 minute. As a result, the irradiation energy of the electron beams at the gel point was 0.45 C/cm2, and the characteristic curve regarding sensitivity (relation between the yield of residual resist thickness and the irradiation energy) was as shown in the accompanying drawings. Example 4 A magnetic stirrer was introduced into a round-bottom flask, and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 320 g of cyclohexane and 3-5.4 g of p-methylstyrene were introduced to form a homogeneous solution, and then the temperature of the solution was kept at 500 C. Subsequently, under a stream of nitrogen, 0.11 ml of a 0.25 mole/liter solution of n-butyllithium in cyclohexane was added to initiate the polymerization. The polymerization conversion reached 99% in 120 minutes. The resulting reaction mixture was poured into methanol containing 2,6-di-t-butyl-p-cresol to recover pmetylstyrene polymer. It was dried under reduced pressure at 400C for 16 hours. In a round-bottom flask wasplaced 11.8 g of the dried polymer, and the air in the flask was replaced with nitrogen, after which 150 ml of 1,1,2-trichloroethane, 95 mg of 4,4'-azobisisobutyronitrile and 4.0 g of t-butyl hypochlorite were added and the resulting mixture was subjected to reaction for 90 minutes while keeping the temperature of the mixture at 700 C. The reaction mixture was poured into methanol containing 2,2'-methylene-bis(6-t-butyl-4methylphenol) to separate the product which was then recovered. Analyzing the structure of the product in the same manner as in Example 1, it was confirmed that the recurring units (A-1), (A-2) and (A-3) were contained in proportions of 8%, 18% and 7%, respecti¯rely, The number average molecular weight of the product was 3 x 105 as measured by a membrane osmometer, and the chlorine content was 9.1% by weight. Using the product obtained above, a coating film having a thickness of 0.5 pm was formed on a silicon wafer having a thermally oxidized layer in the same manner as in Example 1, and was tested on electron beam irradiation characteristics. The coated silicon wafer was irradiated with electron beam at an acceleration voltage of 20 kV, and thereafter, development with Cellosolve acetate was conducted for 1 minute, and rinsing with a mixed solution of methyl ethyl ketone and isopropanol (1:1 by volume) was conducted for 1 minute. The characteristic curve regarding sensitivity of the coating film obtained is shown in the accompanying drawings. The irradiation energy at the gel point upon irradiation with electron beam was 0.3 pC/cm2. Example 5 The image formed by irradiating with deep ultraviolet rays at 6.8 mJ/cm2 in Example 1, the image formed by irradiating with deep ultraviolet rays at 7.8 mJ/cm2 in Example 2, and the image formed by irradiating with electron beams at an acceleration voltage of 10 kV at 1.0 pC/cm2 in Example 4 were subjected to reactive ion etching and the conditions that the power was 100 W, and the gas pressure was 15 Pa using tetrafluorocarbon/oxygen (95/5 volume ratio) as an etching gas in a parallel plate dry etching reactor to investigate the resistance to dry etching. The relative etching speeds when the etching speed of image of commercially available polymetyl methacrylate electron beam resist was assumed as 1.0 are shown in Table 1. Table 1 EMI25.1 <SEP> Image <SEP> Relative <SEP> etching <SEP> speed <tb> Example <SEP> 1 <SEP> 0.40 <tb> Example <SEP> 2 <SEP> 0.45 <tb> Example <SEP> 4 <SEP> 0.40 <tb> Example 6 A magnetic stirrer was introduced into a roundbottom flask, and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 320 g of cyclohexane and 35.4 g of methyl styrene were introduced to form a homogeneous solution, and then the temperature of the solution was kept at 50 C. Subsequently, under a stream of nitrogen, 0.60 ml of a 0.50 mole/liter solution of n-butyllithium in cyclohexane was added to initiate the polymerization. The polymerization conversion reached 92.0% in 120 minutes. The resulting reaction mixture was poured into methanol containing 2,6-di-t-butyl-p-cresol to recover pmethylstyrene polymer. It was dried under reduced pressure at 400C for 16 hours. In a round-bottom flask was placed 11.8 g of the dried polymer, and the air in the flask was replaced with nitrogen, after which 236 g of benzene, 96 mg of 4,4'-azobisisobutyronitrile and 10.9 g of t-butyl hypochlorite were added and the resulting mixture was subjected to reaction for 90 minutes while keeping the temperature of the mixture at 700 C. The reaction mixture was poured into methanol containing 2,2 '-methylene-bis (6-t-butyl-4-methylphenol) to separate the product which was then recovered. By analyzing the product by means of a lH-nuclear magnetic resonance apparatus (JNM-4H-100, manufactured by Nippon Denshi), it was found that the peak due to the hydrogen of methyl group in the vicinity of 6 = 2.2 ppm and the peak due to the hydrogen of methine group in the vicinity of 6 = 1.8 ppm, which peaks were observed in the starting polymer, became small. Furthermore, by analyzing the 13 product by means of C-nuclear magnetic resonance apparatus (JNM-FX-100, manufactured by Nippon Denshi), absorption due to chloromethyl group was newly observed at 6 = 46.1 ppm, and absorption due to dichloromethyl group was also observed at 6 = 71.8 ppm. Moreover, there were also observed #road absorption due to EMI26.1 at 6 = 68 - 76 ppm and absorption due to EMI26.2 at 6 = 51 - 55 ppm. From this fact, it was confirmed that the methyl group of the polymer and methylene and methine groups in the main chain had been chlorinated. Therefore, it was confirmed that the resulting polymer contained the following recurring units belonging to the recurring units (A-i), (A-2) and (A-3): EMI27.1 Further, the chlorine content was 20.9% by weight and the number average molecular weight was 6.0 x 105 as measured by a membrane osmometer. The product obtained above was dissolved in xylene to prepare a 4.8% by weight solution, and this solution was placed on a silicon wafer having a thermally oxidized layer having a thickness of 0.7 ijm, and coating was conducted by rotating the silicon wafer at 200 rpm for 2 sec and subsequently at 4,000 rpm for 30 sec. Further, the coated silicon wafer was heat-treated at.800C for 30 min. to volatilize the solvent away, upon which a coating film having a thickness of 0.5 um was formed on the wafer. This sample was irradiated through a mask with aluminum Ka rays as the X-rays, and then developed with Cellosolve acetate for 1 min, and subsequently rinsed with a mixed solution of methyl ethyl ketone/ isopropanol (1:1 by volume) for 1 min. As a result, it was found that an image having a line width of 0.6 was resolved with a fidelity to the mask at an X-rays irradiation energy of 14 mJ/cm2. Example 7 A magnetic stirrer was introduced into a round-bottom flask, and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 320 g of cyclohexane and 35.4 g of p-methylstyrene were introduced to form a homogeneous solution, and then the temperature of the solution was kept at 500 C. Subsequently, under a stream of nitrogen, 0.45 ml of a 0.25 mole/liter solution of n-butyllithium in cyclohexane was added to initiate the polymerization. The polymerization conversion reached 100% in 120 minutes. The resulting reaction mixture was poured into methanol containing 2,6-di-t-butyl-p-cresol to recover p-methylstyrene polymer. It was dried under reduced pressure at 400C for 16 hours. In a round-bottom flask was placed 11.8 g of the dried polymer, and the air in the flask was replaced with nitrogen, after which 236 g of benzene, 96 mg of 4,41-azobisisobutyronitrile and 41 g of tbutyl hypochlorite were added and the resulting mixture was subjected to reaction for 90 minutes while keeping the temperature of the mixture at 700 C. The reaction mixture was poured into methanol containing 2,2'methylene-bis (6-t-butyl-4 -methylphenol) to separate the product which was then recovered. In the same manner as in Example 6, the structure of the product was analyzed to confirm that the product contained the following recurring units belonging to the recurring units (A-l), (A-2) and (A-3): EMI29.1 The chlorine content was 90% by weight, and the number average molecular weight was 4.0 x 105 as measured by a membrane osmometer. The product obtained above was dissolved in xylene to prepare a 5.5% by weight solution, and this solution was placed on a silicon wafer having a thermally oxidized layer having a thickness of 0.7 pm, and coating was conducted by rotating the silicon wafer at 200 rpm for 2 sec and subsequently at 4,000 rpm for 30 sec. The thus coated silicon wafer was heat-treated at 800C for 30 min to volatilize the solvent away, upon which a coating film having a thickness of 0.5 vm was formed on the wafer. This sample was irradiated through a mask with aluminum Ka rays as the X-rays, thereafter developed with Cellosolve acetate for 1 min, and then rinsed with a mixed solution of methyl ethyl ketone and isopropanol (1:1 by volume) for 1 min. As a result, it was found that an image having a line width of 0.6 vm was resolved with a fidelity to the mask at an X-rays irradiation energy of 40 mJ/cm2. Example 8 A magnetic stirrer was introduced into a round-bottom flask, and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 577 g of cyclohexane, 49.9 g of styrene and 14.2 g of o-methylstyrene were introduced to form a homogeneous solution, and then the temperature of the solution was kept at 600 C. Subsequently, under a stream of nitrogen, 2.4 ml of a 0.25 mole/liter solution of n-butyllithium in cyclohexane was added to initiate the polymerization. The polymerization conversion reached 100% in 60 minutes. The resulting reaction mixture was poured into methanol containing 2,6-di-t-butyl-p-cresol to recover styrene-omethylstyrene copolymer. It was dried under reduced pressure at 400C for 16 hours. In a round-bottom flask was placed 10.7 g of the dried copolymer, and the air in the flask was replaced with nitrogen, after which 230 g of benzene, 96 mg of 4,4'-azobisisobutyronitrile and 20.0 g of N-chlorosuccinimide were added and the resulting mixture was subjected to reaction for 90 minutes while keeping the temperature of the mixture at 700 C. The reaction mixture was poured into methanol containing 2,2 '-methylene-bis (6-t-butyl-4 -methylphenol) to separate the product which was then recovered. In the same manner as in Example 6, the structure of the product was analyzed, to find that the product contained the following recurring units belonging to the recurring units (A-1), (A-2) and (A-3): EMI31.1 The chlorine content was 28.8% by weight, and the number average molecular weight was 3.0 x 105 as measured by a membrane osmometer. The product obtained above was dissolved in xylene to prepare a 8.5% by weight solution, and this solution was placed on a silicon wafer having a thermally oxidized layer having a thickness of 0.7 pm, and coating was conducted by rotating the silicon wafer at 200 rpm for 2 sec and then at 4,000 rpm for 30 sec. The coated silicon wafer was further heat-treated at 800C for 30 min to volatilize the solvent away, upon which a coating film having a thickness of 0.5 pm was formed on the water. This sample was irradiated through a mask with aluminum Ka-rays as the X-rays, thereafter developed with Cellosolve acetate for 1 min and then rinsed with a mixed solution of methyl ethyl ketone and isopropanol (1:1 by volume) for 1 min. As a result, it was confirmed that an image having a line width of 0.6 um was resolved with a fidelity to the mask at an X-rays irradiation energy of 13 mJ/cm2. Example 9 In the same manner as in Example 5, the dry etching resistance of the resist patterns obtained in Examples 6 to 8 was tested, to obtain the results shown in Table 2. Table 2 EMI32.1 <tb> <SEP> Image <SEP> Relative <SEP> speed <tb> Example <SEP> 6 <SEP> 0.42 <tb> Example <SEP> 7 <SEP> 0.40 <tb> Example <SEP> 8 <SEP> 0.43 <tb> Comparative Example 1 A magnetic stirrer was placed into a roundbottom flask and the air in the flask was replaced with nitrogen. Under a stream of nitrogen, 481 g of cyclohexane and 52 g of styrene were introduced to form a homogeneous solution, after which the temperature of the solution was kept at 600 C. Subsequently, under a stream of nitrogen, 1.42 ml of a 0.25 mole/liter solution of n-butyllithium in cyclohexane was added to initiate the polymerization. The reaction temperature rose to 70.5 C, and the polymerization conversion reached 100% in 120 minutes. Thus, the reaction mixture was poured into methanol containing 2,2'-methylene-bis(6-t-butyl4-ethylphenol) to recover the styrene polymer. The polymer was dried under reduced pressure at 400C for 16 hours. Then, 10.4 g of the polymer thus obtained was introduced into a round-bottom flask and the air in the flask was replaced with nitrogen, after which 224 g of carbon tetrachloride, 9.7 mg of benzoyl peroxide and 60 g of t-butyl hypochlorite were added to the flask and the resulting solution was subjected to reaction for 4 hours while keeping the temperature of the solution at 900 C. The reaction mixture was poured into methanol containing 2,2'-methylene-bis(6t-butyl-4-ethylphenol) to separate the product, which was then recovered. In the same manner as in Example 1, the structure of the product was analyzed to find that 61% of the styrene unit, 21% of the recurring unit (A-1), and 18% of the recurring unit (A-3) were contained. The chlorine content was 11.8% by weight and the number average molecular weight was 6.5 x 105 as measured by a membrane osmometer. The product obtained above was formed into a solution in the same manner as in Example 1, and then the solution was coated on a silicon wafer having a thermally oxidized layer by the same procedure as in Example 1. Further, it was irradiated with deep ultraviolet rays, developed and rinsed in the same manner as in Example 1. As a result, an image of 5 um or more could barely be resolved by a radiation energy of 65 mJ/cm2. Comparative Example 2 A styrene polymer was prepared in the same manner as in Comparative Example 1, except that the amount of 0.25 mole/liter solution of n-butyllithium in cyclohexane used was varied from 1.42 ml to 2.4 ml. In a round-bottom flask was placed 10.4 g of the polymer thus obtained, and the air in the flask was replaced by nitrogen, after which 400 ml of chloromethyl methyl ether was added. The resulting mixture was stirred to form a homogeneous solution. Subsequently, 4.0 ml of tin tetrachloride dissolved in 50 ml of chloromethyl methyl ether was dropped thereinto, and the resulting mixture was subjected to reaction for 60 min. The reaction product was poured into methanol containing 2,2' -methylene-bis (6-t-butyl-4-ethylphenol) to separate the product, which was then recovered. In the same manner as in Example 1, the structure of the product was analyzed to find that 80% of the styrene unit, 11% of the recurring unit (A-l) and 9% of the recurring unit (A-3) were contained. The chlorine content was 21% by weight, and the number average molecular weight was 2.0 x 10 as measured by a membrane osmometer. In the same manner as in Example 1, the product obtained above was formed into a solution, and subsequently, this solution was coated on a silicon wafer having a thermally oxidized layer in the same manner as in Example 1. Further, the relation between the yield of residual resist thickness and the irradiation energy of electron beams was investigated in the same manner as in Example 3 to obtain the result shown in the accompanying drawings. The irradiation energy at the gel point was 0.8 /cm2 which was lower in sensitivity than Examples 3 and 4. -

Claims: CLAIMS 1. An ionizing radiation-sensitive material conprisiny a polymer having a recurring unit represented by the general formula (A): EMI36.1 wherein: X, Y1 and Y2 are the same or different and each represents a hydrogen atom, a methyl group or a halogen atom; and R1, R2, R3, R4 and R5 are the same or different and each represents a hydrogen atom, a halogen atom, a C1-C3 alkyl group, a C1-C3 alkoxy group, a C1-C3 haloalkyl group or a C1-C3 haloalkoxy group, provided that at least some of the groups represented by X in said polymer are halogen atoms, at least some of the groups represented by Y1 and/or Y2 are halogen atoms and at least some of the groups represented by R1, , R3, R4 and R5 are haloalkyl or haloalkoxy groups 2. A material according to Claim 1, in which the number average molecular weight of said polymer is from 10,000 to 1,503,COG. 3. A material according to Claim 1 or Claim 2, in which the halogen content of said polymer is from 1 to 50% by weight. 4. A material according to Claim 3, in which said halogen content is from 1 to 25% by weight. 5. A material according to Claim 1 or Claim 2, in which the halogen content of said polymer is from 5 to 50% by weight. 6. A material according to any one of the preceding Claims, comprising the following recurring units: (A-l), which is a recurring unit of formula (A) in which X represents a halogen atom; (A-2), which is a recurring unit of formula (A) in which at least one of the groups represented by R1, R2, R3, R4 and R5 is a C1-C3 haloalkyl group or a C1-C3 haloalkoxy group; and (A-3), whicn is a recurring unit of fonnula (A) in which at least one of the groups represented by Y1 and Y2 is a halogen atom, the total proportion of units (A-l), (A-2) and (A-3) being from 7 to 70% of the recurring units in the polymer. 7. A process for preparing an ionizing radiation-sensitive material, which comprises halogenating, under free radical conditions, a polymer comprising a recurring unit of general formula (B): EMI38.1 (in which: R11, R12, R13, R14 and R15 are the same or different and each represents a hydrogen atom, a C1-C3 alkyl group or a C1-C3 alkoxy group, provided that R11, R12, R13, R14 and R15 do not simultaneously all represent hydrogen atoms; and Z1, z2 and Z3 are the same or different and each represents a hydrogen atom, a fluorine atom or a methyl group, provided that, when z1 represents a methyl group, ZZ and Z3 both represent hydrogen atoms) and optionally comprising a recurring unit of formula (C): EMI39.1 (in which Z4, Z5 and Z6 are the same or different and each represents a hydrogen atom, a fluorine atom or a methyl group, provided that, when z1 of the recurring unit of formula (B) represents a methyl group, Z4 represents a hydrogen atom). 8. A process according to Claim 7, in which said polymer contains from 20 to 100 of recurring units represented by formula (B), from 0 to 70% of recurring units of formula (C) and from 0 to 50% of other recurring units. 9. A process according to Claim 7 or Claim 8, in which the halogen content of said material is from 1 to 50% by weight. 10. A process according to Claim 9, in which said halogen content is from 1 to 25% by weight. 11. A process according to Claim 7 or Claim 8, in which the halogen content of said material is from 5 to 50% by weight. 12. A process for forming a pattern, which comprises the steps: (1) forming a coating film of an ionizing radiation-sensitive material on a substrate; (2) irradiating the desired parts of said coating film with ionizing radiation; (3) treating said coating film with a developing agent; and (4) treating said coating film with a rinsing agent, characterised in that said ionizing radiation-sensitive material comprises a polymer as defined in any one of claims 1 to 6 or comprises a material prepared by a process as claimed in any one of claims 7 to 11.

Inventors: HARADA, KUNIHIRO, HARITA, YOSHIYUKI, KAMOSHIDA, YOICHI, TAKATORI, MASASHIGE
Applicants: JAPAN SYNTHETIC RUBBER CO., LTD.
Application year: 1983
Main classification: G03F7
IPC codes: G03F7, C08F12, C08F212, C08F8