METHOD FOR GROWING A GAAS SINGLE CRYSTAL BY PULLING FROM GAAS MELT

Abstract: In an apparatus for growing a GaAs single crystal from its melt (4), As vapor which is controlled appropriately of its pressure is applied from an As chamber (11) to the surface of the GaAs melt (4) in a vessel (2) throughout the growing process through an As passage (10) communicating between the melt vessel (2) and the As chamber (11), while estab­ lishing a gentle temperature gradient in the passage (10) leading from the GaAs melt vessel (2) to the As chamber (11). Whereby, a GaAs single crystal having a large diameter and a good crystal perfection with minimized deviation from stoichiometry and minimized lattice dislocation can be obtained.

Description: APPARATUS FOR GROWING A GaAs SINGLE CRYSTAL BY PULLING FROM GaAs MELT Background of the invention a) Field of the invention: The present invention relates to an apparatus for growing a GaAs single crystal by pulling up from a melt thereof. b) Description of the prior art: As well known, single crystals of GaAs which is a compound semiconductor are used as the substrates for the fabrication of various semiconductor devices such as light-emitting diodes, laser diodes or microwave diodes, and such crystals are used also as the material for fabricating semiconductor devices such as transistors and semiconductor integrated circuits which are operated at high speeds, in view of the fact that GaAs has an electron mobility of 8500 cm2/V.sec which is more than 5 times greater than that of silicon. As a matter of course, it is desired that GaAs single crystals which are employed as the substrates for the fabrication of those devices as mentioned above have a superior crystal habit. Conventionally, GaAs single crystals have been grown by relying on, for example, horizontal Bridgman method and or the LEC (Liquid Encapsulated Czochralski) method in which the growth zone is sealed off with a B203 capsule. The Bridgman method employs a quartz tube, which leads to such drawbacks that there is a difficulty of obtaining a single crystal of a large diameter, and that, since it has been usual to grow a crystal in the (111) orientation, there is the necessity to cut the crystal obliquely to the (111) orientation instead of normal thereto in order to obtain a substrate having a (100) face which frequently is used in various semiconductor devices, and this necessity results in the lack of uniformity of the impurity concentration in the substrate, and further that although a semi-insulating, i.e. highly resistive, substrate can be obtained usually by doping an impurity such as Cr or O or both, such an impurity requires to be doped at a high temperature of around 800 C or above, and it cannot be doped with stability. The LEC method, on the other hand, enables one to obtain a crystal of a large diameter in the (100) face, but since it employs a B203 layer as the sealing or encapsulating member, this brings about a large temperature gradient of about 100--3000C/cm between the GaAs melt and the seed crystal, so that defects such as lattice dislocation tend to be induced during the crystal growth. Besides these conventional methods, there has been practiced such method as Czochralski's pulling method. This latter method, however, has drawbacks similar to those mentioned above. There are further important problems about GaAs crystals, as will be discussed below. Unlike Si crystals, a GaAs crystal which is a compound semiconductor is made by compounding two elements of Ga and As. In addition, the vapor pressures of the Ga element and of the As element have a great divergence over each other, and the vapor pressure of As is by far the greater than that of the vapor pressure of Ga. Thus, the GaAs crystal which is grown by the conventional methods exhibits a considerably great deviation from stoichiometric composition. In the usual growth process, As atoms tend to present a shortage within the GaAs crystal, leading to the development of defects such as As vacancies or lattice dislocation, or the defect due to combination of As vacancies and the atoms of an impurity. Recent researches have made it clear that a deviation of the crystal being grown from stoichiometric composition most greatly affects the characteristics or the life of the device fabricated by this crystal. The present inventor earlier proposed a method of solving this problem in the technical field of epitaxial growth of compound semicondcutor crystals by supplying the vapor of As during the growth process, with a very high degree of success. In the technical field of producing a single crystal by relying on the pulling method, however, there has not been considered a growth apparatus in which the problem of deviation from stoichiometry is taken into account. Summary of the invention It is, therefore, the object of the present invention to provide a new apparatus for growing a GaAs single crystal by pulling it up out of a melt thereof which eliminates the drawbacks of the abovesaid conventional methods of growing a GaAs single crystal, and which is capable of producing a large-size GaAs single crystal having a good crystal habit due to minimized deviation from stoichiometric composition. Brief description of the drawing Fig. 1 is a diagrammatic illustration, partly in section, showing an embodiment, according to the present invention, of the apparatus for growing a GaAs single crystal by pulling it out of a melt thereof. Detailed description of the preferred embodiment The present invention will hereunder be described in detail with respect to a preferred embodiment in conjunction with the accompanying drawing. Fig. 1 is an embodiment of the present invention showing the apparatus for growing a GaAs single crystal by pulling it up out of the melt thereof. In this drawing, reference numeral 1 represents a quartz tube; 2 a GaAs melt vessel made of carbon; 3 a crucible made of such material as quartz or pBN (pyrolytic Boron Nitride) for containing GaAs melt 4; 5 a GaAs seed crystal; 6 a pullup rod to pull up a crystal grown from a seed crystal; 7 a ground-and-fit adjoining sealing portion of the rod 6 and a cover 8 made of quartz or sapphire which will be described later; 8 said cover having a ground-and-fit portion 9 established relative to the wall of said vessel 2 made of carbon, and into said cover opens a narrow tube 10 which has a small diameter and which communicates with a chamber 11 containing As 12; 30 a housing made of such material as As203 for supporting the vessel 2, and this housing 30 is connected to a rotary rod 13 intended to rotate the crucible 3; 14 and 15 stainless steel plates, respectively, for supporting said quartz tube 1; 16 and 17 sealing members, respectively, such as O-ring or gasket; 20 a radio frequency induction working coil for heating the vessel 2 made of carbon and accordingly the crucible 3; 21 a power supply such as radio frequency oscillator; 22 a radio frequency induction working coil for heating the chamber 11 containing As 12 and connected to the power supply 23 such as a radio frequency oscillator; 24 a thermometer for measuring the temperature at the interface between the seed crystal 5 and the melt 4; 26 a thermometer for measuring the temperature of As 12 which is supplied into the carbon-made vessel 2; 25 and 27 temperatureadjusting members, respectively, for controlling the electric power of the power supplies 21 and 23, respectively; and 28 a window for observation and the measurement of temperature of the seed crystal 5, the melt 4 and As 12. The grown crystal is pulled up from the melt in the following manner. The GaAs melt 4 is heated to about 1240 C whichiscloseto the melting point of GaAs by radio frequency induction to render it to the melt state. After the temperature of the melt 4 has become constant and stable, the seed crystal 5 secured to the tip of the pull-up rod 6 is brought into contact with the melt 4. After the seed crystal has effected an appropriate necking with the melt 4, the seed crystal 5 which is attached to the tip of the pull-up rod 6 is pulled upwardly while gently rotating the rod, so thatasingle crystal is grown progressively at the tip of the seed crystal. The temperature of the As chamber 11 is set constant to insure that an optimum vapor pressure Popt of As is supplied to the surface of the melt 4 throughout the single crystal growth process. This supply of As vapor is an indispensable requirement of the present invention. The optimum vapor pressure of As is appxcirnately given by: p -2.6x106 (-l.05ev/kT) (Torr). Therefore, when the opt exp temperature of the GaAs is assumed to be 12300C, its P t may be regarded as being about 820 Torr. opt The As temperature TAs is given, if the diameter of the narrow tube 10 connecting the As chamber and the carbon-made vessel 2 is small, by the following formula: EMI7.1 wherein: PAs and TAs represent the vapor pressure -and the temperature of As gas in the As chamber 11, respectively; TGaAs represents the temperature of the GaAs melt; and PGaAs represents the vapor pressure of As vaporizing from the GaAs melt, and assumes a value close to Popt Accordingly, if TGaAS is assumed to be 1240"C, and PGaAs is assumed to be 820 Torr, it is only necessary to determine the values of TAs and PAs so as to be EMI8.1 EMI8.2 Since PAs is determined by the value of TAs, it is only necessary to set the temperature TAs In order to secure stoichiometric perfection of the GaAs single crystal which is grown, it is necessary to effect a strict controlling of the deviation from stoichiometry, i.e. to control the deviation at a value + 0.10C or lower. What is also important is the temperature gradient across the As-containing region 11 and the melt region 4. It is necessary to arrange so that this temperature gradient is gentle with a continuous temperature distribution, and to arrange especially the temperature gradient in the region close to the-interface between the melt 4 and the solid state grown crystal so as to be gentle not to admit the inducement therein of any lattice dislocation. Realization of the temperature distribution of the melt region, the As region and their intermediate regions, may employ not only the RF induction heating as shown in the embodiment, but also any conventional heating method such as resistance heating. The temperature in the region leading from the carbon-made vessel 2 to the As chamber 11 desirably is arranged to be constantly higher than the temperature of the As 12 itself to avoid the deposition of As on to, for example, the quartz container 8. The sealed site 9 between the carbon-made vessel 2 and the cover 8 made of quartz or sapphire, and the sealed site 7 between the pull-up rod 6 and said cover 8 both require to provide a ground-and-fit sealing of a high precision relative to each other to provide a good sealing therebetween so as to inhibit the leak of the vapor of As 12 applied to the crystal pull-up region defined between the wall of the carbon vessel 2 and the cover 8, as well as the leak of As vapor from the GaAs melt region, and also the leak of the As vapor from the pulled-up GaAs crystal. In order to obtain, by the pull-up method, a GaAs single crystal having a high crystal perfection, sufficient consideration has to be given to making a precise control of the As vapor pressure which is applied, precise temperature control of not only the regions including the GaAs melt region, but also the pull-up speed, as well as the rotation speeds of the crystal and the crucible. The controlling of the crystal which has been pulled up from the melt need only be performed while watching, through the window 28, the condition of pulling. By making a good control of the pull-up speed as well as the rotation speed of both the crystal and the crucible, it is easy to obtain a single crystal having a large diameter. In order to perform automatic controlling, it will be needless to say that a weight detector is operatively connected to the pull-up rod 6 to detect the weight of the crystal being pulled up, and to make an automatic control of the respective parameters such as the pull-up speed and the rotation speeds of the crystal as well as the crucible, all of which constitute the growth conditions. The crucible 3 and other members of the apparatus ought to be made of sufficiently pure materials so as not to allow a dissolution of atoms of unnecessary impurities to migrate into the melt and the crystal. In order to obtain, by the pull-up method, a GaAs single crystal having a perfect stoichiometric composition, it is necessary to make a strict control of the temperatures of the GaAs melt 4, the As 11 and the passage connecting them. The heating of the crucible may be effected not only by the use of such carbon vessel as shown in the embodiment, but also by the use of, for example, a heating pipe constituted by a metal which is in the liquid condition, or by the use of both. The vapor pressure of As 11 for obtaining a GaAs single crystal having a good stoichiometric composition is close to the atmospheric pressure as stated above. Accordingly, in the crystal pulling-up apparatus mentioned as an embodiment, it is not very difficult to seal off the growth region. It is needless to say that, in order to prevent possible leak of As vapor to the outside of the system, the pull-up apparatus as a whole may have a pressureresistant vessel structure. In case a pressure-resistant vessel is used, it is possible to use an inert gas such as nitrogen, argon or helium, or a mixed gas of such inert gas and As vapor, to apply a pressure into thevessel. As stated above, the apparatus for growing a GaAs single crystal by pulling it up from a melt thereof according to the present invention enables the crystal to be pulled up while applying an optimum As vapor pressure to the GaAs melt in order to give a satisfactory stoichiometric composition of the crystal being grown. Thus, this apparatus provides a crytal having a perfect stoichiometry. Accordingly, it is possible to obtain a GaAs single crystal having a large diameter and having minimized deviation from stoichiometry and minimized lattice dislocation. Thus, the present invention has a very high industrial value.

Claims: Claims: 1. An apparatus for growing a GaAs single crystal by pulling it up from a melt (4) thereof and comprising an enclosed vessel (2) containing a batch of GaAs melt and also a GaAs single crystal being formed from said melt (4) and further having an As-containing chamber (11) communicating, via a passage (10), with the GaAs melt vessel (2) for applying As vapor into a space of said vessel (2) characterized in that the apparatus is arranged that, throughout a growth process, said GaAs melt (4) in the vessel (2) is held constantly at a temperature which is either a melting point of GaAs or slightly thereabove, and also the As chamber (11) is held at a constant temperature sufficient to impart the crystal being grown an optimum As vapor pressure to cause the crystal being grown to have a good stoichiometric composition, while said passage (10) leading from the melt vessel (2) to the As chamber (11) is given a gradual temperature gradient. 2. The apparatus of claim 1, characterized in that said GaAs melt vessel (2) and said As chamber (11) are heated by radio frequency induction heater (20,22). 3. The apparatus of claim 1 or 2, characterized in that said passage (10) between said GaAs melt vessel (2) and said As chamber (11) has locally ground-and-fit sealing portions (9) of a material selected from the group consisting of quartz and sapphire to prevent a possible leak of As vapor to the outside of the apparatus.

Inventors: NISHIZAWA, JUN-ICHI
Applicants: ZAIDAN HOJIN HANDOTAI KENKYU SHINKOKAI
Application year: 1983
Main classification: C30B15
IPC codes: H01L21, C30B29, C30B15