METHOD FOR MANUFACTURING SEMI-CONDUCTING DEVICES AND SEMI-CONDUCTING DEVICES THUS OBTAINED

Abstract: Method for manufacturing a semi-conducting device, comprising a sensitive front side and a back side so arranged as to provide a ohmic contact, having a semi-conducting substrate, such as silicium, in the shape of a slice, which comprises making a junction on the front side of the semi-conducting substrate slice, by diffusing therein a doping material, coating the doped front side with an anti-reflecting material layer, covering by silk-screening the anti-reflecting material layer with a layer of a silver-based paste, applying by silk-screening over a large part at least of the back side from the semi-conducting substrate slice, a first layer formed by an aluminum paste, and applying by silk-screening over the first aluminum layer, a second layer the covering rate of whch lies between 10 and 40%, formed either by a paste on the basis of silver and palladium.

Description: "Method for manufacturing semi-conducting devices and semi-conducting devices thus obtained". The invention relates to a method for manu¬ facturing semi-conducting devices, particularly solar photovoltaic cells, comprising a sensitive front sur¬ face which is to be exposed to the sun radiation, and a back surface so arranged as to provide an όmic contact, as well as to the resulting semi-conducting devices. Solar cells are semi-conducting devices with a very simple structure and they are generally comprised of a slice or lamina from p-type mono- crystalline silicium, into whih has been diffused to a short depth, a donor impurity, to obtain a n- type zone which is pohto-sensitive and which is nor¬ mally to be exposed to sun radiation, and to provide a n-p junction at a shallow depth. When the sun radiation does fall on the front or top surface of the solar cell, the light will be absorbed by the material and will form holes, that is voids in the valence electron layers . The electric field inside the n-p junction has such a polarity that the minority carriers are driven to the junction. This process causes an excess charge generating a potential diffe¬ rence of about 500 to 600 mV between n-type and p- type silicium. When the cell is connected to an -^T& . OMPI outer circuit, a current will flow therein. To pro¬ vide an electric contact on the front or top surface of the solar cell, a conducting material layer is laid thereon in the shape of a grid or com . The connection on the back or bottom surface is provided by means of a metal film covering the whole surface area. Men of the art use presently the silk-screen method for manufacturing solar cells. The introduc¬ tion of the silk-screen method is motivated by the 0 experience gained during the time period 1975-1978 as it became clear that the conventional manufacturing methods, particularly as it appeared that preparing by vaporizing of the metal pattern or model on the cell front surface through a mask, were not suitable to a manufacture on a large scale of solar qells . This is true both for the production capacity and the material efficiency, and regarding the capital cc__ts. It has been first tried to apply metal con- 0 tacts or electrodes over the bottom and top surfaces by making use of silk-screen methods. The first experiments as well as the results given in the litte- rature did show that those materials which caused the less problems were silver- for the front part and 5 aluminum for the back part of n-p solar cells. It already became clear during the first tests that the best throughputs were obtained when metal inks were applied over the front part after covering the cell with an anti-reflecting layer. The paste on the Q . front or top part thus did diffuse through said anti- reflecting layer during the curing and did thus form OMPI- a weak ohmic contact. The applying of the aluminum paste as such over the back surface did not cause any marked pro¬ blem, but there was obtained a contact which could not or with difficulty only be soldered. A first possibility to obviate such drawback did lie in applying a copper layer by electroplating to obtain solderable contacts. Such process lies in applying a copper layer by electroplating over the aluminum layer and then dipping the cell into a solder bath. Copper pla ting is made by means of copper sulphate, sulfuric acid and some additives to improve said electroplating. Said method has a large advantage, notably due to the cells having a very -low series resistance and thus a high charge coefficient. However in many cases, such an advantage does not balance the numerous disadvantages linked with such a technique. The production of solar cells with such electroplating and solder bath processes did prove very weak and this being partly due to the many broken cells resulting from the loading and unloading rela¬ tive to the electroplating bath, and also due to the bad adherence of the cell metal deposit. Other drawbacks result from such technique being difficult to automatize and thus being expensive and relatively intricate, and moreover large amounts of acid have to continuously be discharged, which causes polluting problems. Another solution lies to obtain the con¬ tact with the silicium layer on the p side, in using aluminum pastes on the basis of silver powder, which metal has the advantage of providing an outstanding solderabilit . However due to the interacting bet¬ ween aluminum and silver during the thermal process, there is formed an alloy having bad solderability properties. This invention lies in obviating said draw¬ backs from the known semi-conducting devices and in providing an industrially and economically valid method allowing to improve the production of semi¬ conducting devices, and particularly photovoltaic solar cells, as well as the throughput thereof rela¬ tive to the conventional treatments, by means of me¬ tal plating of the back surface of said devices or cells, by means of a double silk-screen process. The method according to the " invention while allo- wing to avoid forming on the back side of the semi¬ conducting device an alloy having low solderability features;, is also characterized by the marked possi¬ bility of automatizing and the low capital costs required thereby, the same apparatus being usable both to form the junction and to electroplate, as well as due to the relatively low amount of chemical was¬ tes it does generate. For this purpose according to the invention, a junction is obtained on the front side of the slice from semi-conducting substrate, such as sili¬ cium by diffusing therein a doping material, the doped front side is coated with an anti-reflecting material layer, said anti-reflecting material layer is covered by silk-screening with a paste layer on the basis of silver, the silver-based paste is subjected to a controlled heat treatment,overamain part a ' t least of the back side from the semi-conducting substrate slice is applied a first layer comprised of an aluminum paste, and over said first aluminum layer is applied by silk-screening, a second layer the 5 covering rate of which lies between 10 and 40% and which is formed either by a paste on the basis of silver and palladium with a palladium proportion of at least 25% by weight, in which case the first alu¬ minum layer is applied over the whole said back side, 10 or by a silver paste, in which case the first alumi¬ num layer is applied over a substantial proportion ' of the semi-conducting substrate slice, and the second silver layer is applied into openings provi¬ ded in the first aluminum paste layer, while insuring 15 a satisfactory covering of the aluminum paste, said first and second layers being subjected to a control¬ led heat treatment after the application thereof. In a preferred embodiment, said second silver paste layer is applied into the openings from the 20 first aluminum paste layer as well as on that surface portion from the first layer which surrounds said openings. In another embodiment of the invention, a junction is formed on the front side of the semi- 25 conducting substrate slice, such as silicium, by diffusing therein a doping material, the doped front side is coated with an anti-reflecting material layer, said anti-reflecting material layer is covered by silk-screening with a silver-based paste layer, said -**** 0 silver-based paste layer is subjected to a controlled heat treatment, on the back side of the semi-conduc*- ting substrate slice is applied by silk-screening, a first layer formed by a silver paste the covering rate of which . lies between 10 and 40%, and on that portion of the back side which is not covered with the silver paste and over a portion from the first silver layer, is applied by silk-screening a second layer comprised of an aluminum paste, said first and second layers being subjected to a controlled heat treatment after the application thereof. In a particularly preferred embodiment of the invention, after the application thereof, said first and second layers are each dried respectively at a temperature about 150° for about 10 minutes, and then subjected to curing for about one hour up to a maximum curing temperature about 550° to 800°C, or else said first and second layers are then sub¬ jected simultaneously after drying of the second layer, to curing for about one hour up to a maximum curing temperature about 650° to 800°C, said maximum curing temperature being retained in both cases, for about 8 to 10 minutes, while keeping a temperatures gradient of no more than 50°C/min. In another embodiment of the invention, said junction is obtained by diffusing from a phosphorus- doped paste layer which is applied by silk-screening over the front side of the semi-conducting substrate slice, said phosphorus paste being comprised of a phosphorus compound selected from polyphosphoric acid and esters of polyphosphoric acid, a solvent such as for example butylcarbitol acetate, butylcellulose acetate, ethylene-glycol ' ethers or diethylene-glycol ethers, and colloidal silica, the phosphorus propor¬ tion in the paste lying preferably between about 10 and 15% by weight. In still another preferred embodiment, said silver-based paste covering the anti-reflecting material layer contains about 3 to.6% by weight tin. In a particularly advantageous embodiment of the invention, after the application thereof, said silver paste layer with tin is dried at a tempe¬ rature in the range of 100°C for about 10 minutes and said layer is then subjected to curing for about one hour up to a maximum curing temperature about 780° to 820°C, the maximum curing temperature being retained for about 5 minutes, while keeping a temperature gradient of no more than 50°C/min. The invention further comprises the semi¬ conducting devices, particularly the photovoltaic solar cells, which are obtained with said method. Other details and features of the invention will stand out from the following description, given by way of non limitative example and with reference to the accompanying drawings, in which : Figure 1 is a diagrammatic section view of the back part from a solar cell according to the invention. Figure 2 is a diagrammatic section view through another embodiment of the back part from a solar cell according to the invention. Figure 3 is a diagrammatic section view through still another embodiment of the back part from a solar cell according to the invention. In the various figures, the same reference numerals pertain to similar elements. The following description pertains particu¬ larly to the manufacture of solar cells on the basis of silicium. It is clear that most of the steps in the method according to the invention may also be applied to the manufacture of other semi-conducting components, such as for example solar cells from other materials than silicium, power-generating components and generally, when it is a matter of combining the techniques pertaining to semi-conduc¬ tors and to thick films. The silicium slices, generally with a dia¬ meter about 7,62 cm and a thickness about 300 microns are attacked by polishing in a first step, to obtain a perfectly plane surface devoid of any impurity and bump due to sawing on the surface. Cherrical etching is generally more advantageous from the economic point of view, than mechanical .poli- shing . Moreover such an operation takes less time. During chemical etching , the silicium slices are dipped into an etching bath on the basis of nitric acid, hydrogen fluoride and glacial acetic acid. A particularly suitable etching bath will have for this purpose, the following composition : 64% nitric acid (at 65%) , 16% hydrogen fluoride (at 48%) , and 20% glacial acetic acid. The reaction time is dependent on the liquid temperature and the amount of liquid having reacted. After chemical etching, the silicium slices or laminae are dried in acetone vapours. The acetone temperature lies generally between 50° and ~- ΕE 55°C. This operation occurs by holding the silicium slices above an acetone bath. However care should be taken due to the inflammability of acetone. After such first attack, slices are obtained with a thickness about 250 to 300 microns. The slices are marked with a diamond to determine the front side thereof. A junction may be obtained on the front side of said silicium slices, in two different ways. The first way lies in making the junction by diffusion in the gaseous phase; such technique is presently per¬ fectly developed and well known from the men of the art. The second technique, as already stated herein¬ before, lies in forming the junction by diffusing from a paste applied by silk-screening; this technique has been substantially improved within the scope of this invention and has given in some conditions, better results, and efficiencies than the technique of diffu¬ sion in the gaseous phase. Both said techniques will be described hereinafter. a) Forming a junction by diffusing from the gaseous phase : A first step in the forming of a junction lies in cleaning with nitric acid at a temperature of about 80°C. The object of this operation is to insure that the surface is completely clean, in such . a way tlat diffusing may occur as homogeneously as possible over the complete surface area, and to pre¬ vent some impurities from entering the silicium during the diffusion process, which process is per¬ formed at a very high temperature. To dispose of the oxide which develops during the cleaning, the silicium slices are for example dipped in sequence in a solution with 5% hydrogen fluoride. There is then performed a water cleaning and a drying in acetone vapours, as for the drying step during polishing of said slices. The silicium slices are then brought into a diffusion oven and arranged on a boat-shaped piece of quartz. The slices are set upright on the quartz boat by introducing same through small slits which have been provided therein. A normal diffusion batch comprises about 30 cells. Use can be made for this purpose of a " indberg -"-type diffusion oven. The oven is fed with oxygen as well as with a small nitrogen flow, which is fed as bubbles through a doping material source, for example P0C1 (phosphorus oxychloride) before entering ' the tunnel oven. It must be understood that the use of other doping materials than phosphorus, such as for instance antimonium or arsenic, might be considered. Said phosphorus oxy¬ chloride is a liquid which is present inside a small tank secured to the oven side wall. Said small nitro¬ gen flow thus takes the phosphorus atoms along inside the oven which has a temperature about 920°C. The doping phosphorus will settle down on the silicium and diffuse therein from the surface in a perfectly reproductible way. After diffusing for about 20 minutes, a junction depth about 0.4 micron deep is obtained, which means a layer resistance about 20 to 30 ohms per square. Diffusing from the gaseous phase occurs everywhere over the siliciumslice, in such a way that the interfering junction being formed on the slice back side has to be removed by chemical etching. The useful junction on the front part is protected against the etching liquid by means for instance, of a photolacquer (Shipley 1350 H) . The etching or chemical-attack liquid is preferably comprised of water, nitric acid and hydrogen fluoride; a particu¬ larly suitable etching bath coriains for example 50% water, 40% nitric acid (at 65%) , and 10% hydrogen fluoride (at 48%) . After dipping for one or two minutes in the bath, it is insured that a layer a few microns thick has been removed by etching. The photolacquer is then removed in fuming nitric acid, after which cleaning of the silicium slices is performed with nitric acid (65%) at 80°C and then by means of an aqueous solution from hydrogen fluoride at 5%*. b) Forming a junction by diffusing from a paste applied by silk-screening. Another method according to the invention for forming a junction, lies in diffusing from doped layers which have in turn been applied by a silk- screen process . In such a case, a doped layer is applied by silk-screening, from which layer the impurities are left to diffuse into the silicium slices, at a temperature from about 900° to 950°C. Preparing the diffusion paste requires caution as regards etching of the screen during the silk-screen process by means of the paste. Tests have shown that when the paste is prepared on the basis of phosphorus pentoxide (P O ) as active func- tional material, said material is changed under the action ofmoisture traces, into phosphoric acid which attacks directly the screen. It is thus imperative to apply the functional material as polyphosphoric 5 acid. it has been noted according to the invention, that polyphosphoric acid converted into a silk- screening paste does not attack the screen, as oppo¬ sed to phosphorus pentoxide. Preparing the paste does actually occur in two steps : - ~ lθ (l) Preparing the functional material ; (2) converting said material into a paste which may be applied by silk-screening (2) . (1) Functional material : Use is made for this purpose, either direc- 15 tly of polyphosphoric acid, or of esters from poly¬ phosphoric acid. Polyphosphoric acid is obtained by reacting phosphoric acid (H PO. at 300%) with phosphorus pen¬ toxide. The molecular ratio lies about 20 (H PO. at 20 100%/P 0 0_) . The mixture is slightly heated and after i. 5 about 10 minutes, there is obtained a homogeneous product. Cooling is performed inside a dryer. The phosphorus amount by weight in this product is normally about 29 to 30%. The ethyl ester from polyphosphoric 25 acid is also a product of great interest. Said ethyl ester is the product from reacting tri-ethyl phosphate and phosphorus pentoxide. The molecular ratio, bet¬ ween both said reagents (tri-ethyl phosphate/P 0 ) lies between 4 and 14; a ratio of 8 is normally 30 used. It has been noted according to the invention, that with smaller molecular ratios, the reaction occurs faster, but then during preparing of the paste proper, the possibilities of mixing with the solvent are worse. On the other hand, with higher ratios, the reaction occurs more slowly, but the mixing possibilities are getting better. The normal reaction temperature is 2lO°C and the reaction is performed with backflow. ' After a few hours, the reaction is stopped, that is when the tri-ethyl phosphate has reacted. This is noticed due to a very strong increase in the temperature of the resi¬ due and a high vapour generating. Care should be taken not to let the reaction last for too long; this might generate small brownish flakes, which would require filtering the diluted residue * but would lower the paste quality. The phosphorus amount by weight which is finally present in the residue, which will be dependent on the functional material, lies between 22 and 30%, and this according to the conditions under which the reaction is performed. Instead of ethyl ester of polyphosphoric acid, use may be made of other esters of polyphosphoric acid, such as the butyl ester of polyphosphoric acid. in . this case, use will be made of tri-butyl phosphate instead of t i-ethyl phosphate. (2) Converting into a silk-screening paste. The functional material is diluted with coo¬ ling, until there is obtained a solution containing about 10 to 15% and preferably 12% by weight, of phosphorus. Diluting of the functional material normally occurs by means of butylcarbitol acetate or butylcellulose acetate; other solvents which - ~ might be used within the scope of this invention, are ethylen glycol and diethylen glycol ethers, such as monobutyl, monoethyl, monomethyl, dimethyl, and die- thyl ethers of diethylene glycol. Said reaction product as diluted is very liquid and cannot be used for silk-screening. It is thickened up to the required viscosity with a particular colloidal . form of silica, such as aerosil. The aerosil is a very pure silicium dioxide formed of spherical parti- cles with very small diameters (mean value from 10 to 20 microns) and which as* such, has a very large 2 specific surface area (50 to 350 m /gr) . As the aerosil absorbs mois.ture , said material has first to be dried before being used. The silica proportion is dependent on the kind of silica being used and comprises, for example, 7.7% by weight for "aerosol 130". Another material which can be used for this purpose is "Cab-0-Sil" from Cabot Corporation, or other colloidal forms from silicium oxide. The residue obtained on the silicium slice, after silk-screening with phosphorus-diffusion paste and after drying at a temperature about 150°C, to expel the solvent, is a dispersion of silicium dio¬ xide in the material containing the phosphorus. The layer is strongly viscous, but not solid. The layer of phosphorus-doped paste, after drying at a tempera¬ ture in the range of 150°C, is then subjected to curing to cause diffusing of the phosphorus for a period of time between 45 minutes and 1.5 hours, up to a maximum curing temperature about 900° to 95θ°C, the maximum curing temperature being retained for about 15 to 20 minutes, while keeping a temperature gradient no higher than about 50°C/minute. During the feeding of the phosphorus-doping material during the diffusion step at a temperature of 900°-950°C, the paste clearly flows down the edges of the cell and forms a short-circuit to the metal contact on the back side thereof. The edges of the cells obtained in this way have thus to be treated to remove the leak remains which might interfere with the cell effi- ciency. However the resulting junction on the cell edges may easily be removed by arranging hundreds of cells on one another and by "dry" etching the resulting cylinder in a plasma equipement. The application proper of the phosphorus- based starting material is made inside a continuous oven, by controlling the temperature in the above- defined way. The remaining layer, after the diffu¬ sion step, is removed by chemical etching with an aqueous solution of hydrogen fluoride, for example at 48%, such chemical etching being followed by cleaning with water and drying in acetone vapours . Due to the phosphorus doping material ente¬ ring in this case, but on the front side, there thus occurs no interfering junction on the slice back side, which does not have thereby to be treated with an etchant. The application as well as the drying and curing operations for the phosphorus-doped paste layer are preferably made according to the invention, in a nitrogen atmosphere. As already stated, the conventional phosphorus diffusion process occurs inside an open tunnel-oven inside which the silicium slices are arranged vertically in a quartz "boat" , the phosphorus source being the phosphorus oxichlori- - de. Said conventional process has, as the use there¬ of for manufacturing solar cells is contemplated, two substantial drawbacks relative to the diffusion pro¬ cess according to the invention performed from a paste which is applied by silk-screening : a) It is a discontinuous process. A determined num¬ ber (usually a few tens, possibly a few hundreds slices) of slices have to be arranged on a quartz "boat" . The boat has to be slipped inside the oven and removed the_t__£rom, and it must be unloaded. b) Due to the silicium -slices being arranged verti¬ cally, the diffusion occurs not only on the front side, but also on the back side of said slices. This causes forming of an interfering junction on the back side. Such interfering diffusion may only be removed cell by cell, generally by using chemical etching aqueous baths. According to the invention, said drawbacks are obviated when use is made of the silk-screen technique as described hereinabove to apply a doped paste, and when using a heat treatment inside a con¬ tinuous ove . On the one hand, as regards point (a) , it is clear that an automatic silk-screen machine which works in combination with a continuous oven (for example belt conveyor) , is a continuous process . On the other hand, as regards point (b) , it will be noted that due to the use of a silk-screeningstep, the doping material is applied but on the cell front side. During the heat treatment, while the cells are arranged horizontally on the movable belt inside the continuous oven, the junction will be formed but on the front side, together, as mentioned herein- above, with an interfering junction which is only formed on the cell edges, but which does not extend on the back side thereof, as this occurs with the conventional diffusion method. As already stated, the junction which is formed on the cell edges may easily be removed with a plasma equipment. The doped front side of the silicium slices is then coated, in a way known per se, with an anti- reflecting material layer. Reckoning a mean value of 4 for the reflection index of the silicium, a 36% reflection is obtained on the silicium surface with an incidence at right angle. Such reflection may be lowered by laying down a layer between the air layer and the silicium layer, which layer would have a refraction index = 2. In such a case, the reflection is zero for a wave length = 4 n .d, formula in which d is the thickness ARL of the anti-reflecting layer. When such a minimum reflecting is desired for Λ - 7000. A , this occurs with a layer thickness ' d = £≥ 1 = = ft 8 7 75ς AA . Sc«ev, β er«alι aving a refraction index lying about 2 may be used for solar cells; particularly suitable materials are as follows : SiO„, TiO with x -= 1,2, etc, Ta_0_, and 2 x 2 5 mixtures of these various substances. ithin the scope of this invention, use is preferably made of TiO which is applied by the so-called "spin-on" process. A few drops of TiO in a solvent laid down on the silicium slice, which is rotated at about 3000 rev/ in., give the required thickness to the anti-reflecting layer (ARL) . Said solvent is vapo¬ rized at a temperature about 250°C and there remains an uniform layer with a blue colouring. The front side of the silicium slices is metallized by making use again of a silk-screening process. It is well known that titanium improves the contact between silicium and silver. Use is made in this case for metallizing the front side, of a silver paste in the form of a thick film, which may be obtained commercially under the Trade Name ES 5964, to which is added some proportion of Ti. It has been noted in this aspect, in a way known per se, that particularly good results were obtained by adding 4 to 7% titanium powder to the silver pasie Once applied over the.front side of the sili- cium slice, the titanium-enriched silver paste layer is dried to a temperature about 100°C for about 10 minutes and it is then subjected to curing for about one hour up to a maximum curing temperature about 850° to 860°C. Such temperatures do indeed allow to obtain generally a good ohmic contact. On the other hand, it has been noticed that the short- circuit current decreased with the increase in tem¬ perature, due to degrading of the minor charge carriers. This is a well-known phenomenon!* in the semi-conductor technology. While a higher sintering temperature gives an improved contact and consequently a better char¬ ge factor, there results also therefrom a degrading of the short-circuit current, in such a way that an optimum curing temperature appears to lie about 860°C. The curing profile is such that the cells remain for about 5 minutes at the peak temperature, while keeping a temperature gradient no higher than 50°C/min. Even if the peak temperature during said heat treatment should be high enough for the paste to be suitably sintered, which also improves the conductivity of the layer and enhances forming of a low enough contact resistance with the silicium, it has been noticed that the impurities which are present in the silver paste diffuse all the more rapidly in the silicium as the peak temperature rises during the sinteringprocess. When adding an element to the silver paste which lowers the melting point, it is possible to perform the sin¬ tering process at lower temperatures. It is clear that use should be made for that purpose, of ele¬ ments which either do not diffuse into silicium, or do not influence adversely the junction proper- ties of the solar cell. It has been noticed according to the invention, that the tin and anti- monium elements did fulfill both conditions. Excel¬ lent results have been obtained by adding to the silver paste, about 3 to 6% and preferably 5% by weight tin. Such tin addition allows to lower by about 50° to 70°C the maximum sintering temperature of the metallizing on the front side (for example 860°C without tin down to 800°C when using tin) , which allows obtaining higher ' short-circuit cur¬ rents and better efficiencies,. For instance, as for the silver paste with titanium, the silver paste with tin is dried after application thereof, at a temperature about 100°C for about 10 minutes, but it is then subjected to curing for about one hour up to a maximum curing temperature about 780° to 820°C, the maximum curing temperature being also retained for about 5 minutes, while keeping a temperature gradient no higher than 50°C/min. Very similar results have been obtained by adding to the silver paste, about 3 to 7% by weight antimonium, and preferably 5% by weight antimonium, such antimonium addition, as well as the tin addi¬ tion, has also allowed to lower substantially the maximum sintering temperature (by about 50° to 70°C) for the metallizing on the front side, and thus to obtain the same advantages as with the tin addition. In the case of blending antimonium, the layer of silver paste with antimonium is dried after the application thereof, at a temperature about 100°C for about 10 minutes and it is then subjected to curing for about.one hour up to a maximum curing temperature about 760° to 840°C, the maximum curing temperature being retained for about 5 minutes, while keeping a temperature gradient no higher than 50°C/min. By lowering the curing temperature by about 50° to 70°C, there is thus obtained a current gain about - + 1 mA/cm2 , which corresponds to a relative current gain about 4%. Another very substantial advantage, as it has precisely been stated, resul¬ ting from this curing temperature lowering lies in the smaller diffusing of the impurities from the metallizing paste into the junction at a shallow depth, which results besides a better efficiency of the method as mentioned,na lower leak current and a better reproducing possibility. For metallizing the back side of the cells, use is made of an aluminum paste which is applied by silk-screening, as for example that aluminum paste commercially available under the Trade Name of Engelhardt T-2497. Even while said aluminum pastes applied by silk-screening allow to obtain a good ohmic contact, they have for drawback a rather bad soldering capacity. This is the reason why it is required to apply over the aluminum, a layer which may be soldered. One solution to obviate this drawback lies as already stated, in applying a copper layer by electroplating. As already stated, such technology is relatively intricate and large amounts of acid have to be continuously discharged, which causes polluting problems. On the other hand, should it happen that one or more cells draw for whatever reason, more current, a larger copper amount will settle in this location. This results in the current flow further increasing, which causes the deposit of even more copper and this to the expense of the other cells. Due to this ron-propor- tional distribution of the current, there is thus ob¬ tained a cumulating action as some cells obtain more -^ x ^E current, which causes a rougher grain during the deposit as well as stresses in the layer being deposited, which may become so strong tlst a bad adherence may result therefrom. Another solution lies in using aluminum pastes on the basis of silver powder but as stated previously, due to the interaction between aluminum and silver during the heat process, there occurs an alloy having bad solderability eatures . For all these reasons, another method has been searched for to obtain a solderable contact on the back side. According to the invention, a solution has been found with a method making use of an additional silk-screening step, ©ver the aluminum layer applied by silk-screening, there is laid also by silk-screening, a second layer the covering rate of which on the aluminum layer lies between 10 and 40%, preferably between 15 and 25%, said second layer being comprised either of a paste on the basis of silver and palladium the proportion of palladium of which is at least 25% by weight, and preferably lying between 30 and 45% by weight, the aluminum layer being applied in such a case over the complete back side of the silicium slice (see figure 1) , or of a silver paste, the aluminum layer being applied in such a case over a substantial por-. tion of the back side of the silicium slice (see fi¬ gure 2) . In this latter case, as it may be seen, the aluminum layer is actually applied by means of a PI selective pattern or template, and the silver layer application is made over the silicium through ope¬ nings provided in the aluminum paste layer , as well as over that surface portion from the aluminum paste bordering said openings. If there is insured * as shown in figure 2, a large enough covering of the aluminum paste layer with the silver layer, a good ohmic contact is obtained over that portion where the aluminum is covered with silver, while the center portion where the silver lies far away enough from the aluminum, may be soldered. Said silk- screeen methods both allow opposing the forming of an aluminum-silver alloy having bad solderability properties. Inte on the basis of silver and palla- dium have however the drawback of being relatively expensive. Another solution which lies in reversing the sequence of application of said aluminum and silver layers, also allows to obtain very good resits both from the point of view of the ohmic contact as of the solderability. For this purpose according to the invention,as may be seen in figure 3, there is applied by silk-screening over the back side of the semi-conducting substrate slice, by way of first layer, the silver paste layer the covering rate of which over the back side lies between 10 and 40%, and preferably between 15 and 25%. Thereafter, there is also laid down by silk-screening over that portion of the back side which is not covered with silver paste and over a portion from the first silver layer, preferably over that surface portion of the ^^ΌREΛ OMPI silver layer adjacent to the aluminum layer or borde¬ ring same, the aluminum paste layer by way of second layer. The metallizing of the cell back side occurs in the following way. The cell back side is firstof all coated by silk-screening with aluminum paste (figures 1 and 2) . The cells are then dried at a temperature about 150°C for about 10 minutes and there is then applied thereon, still by silk-screening, the silver-palladium or silver paste, and this is again dried at a temperature about 150°C, said second layer comprising that zone where the soldering of the electric contact will occur. The cells are then sub- jected to curing inside a continuous oven for about one hour up to a maximum curing temperature about 650° to 800°C, the maximum curing temperature being retained for about 8 to 10 minutes, while keeping a temperature gradient no higher than 50°C/min. Particularly good results have been obtained by ma¬ king use of a maximum curing temperature about 660° to 720°C. The above-described operation may also be performed in two steps : applying the aluminum paste, drying at a temperature about 150°C for about lo minutes, passing through the oven for about one hour up to a maximum curing temperature about 650° to 800°C; applying the silver-palladium or silver paste, <3rying at a temperature about 150°C for about 10 minutes, again passing through the oven for about one hour at a maximum curing temperature about 650° to 800°C. The maximum curing temperature during both said steps, is also retained for about 8 to 10 minutes, while keeping a temperature gradient no higher than 50°C/min. In that case where the application sequence of the aluminum and silver layers is reversed (fi¬ gure 3) , that is when the silver layer is applied first and then the aluminum layer, the metallizing operation on the back side occurs exactly under the same treatment conditions as the ones defined above. It is imperative according to this inven¬ tion, that the maximum curing temperature be adjus¬ ted within narrow limits, because with too high a temperature, the aluminum diffuses too rapidly in the silver-palladium or silver layer, and causes a non-solderable contact to be formed. The silver paste and mostly the silver-palladium paste being very ccstly, said paste will only applied in those locations which are possibly to be soldered, in such a way that the covering rate of said layer over the aluminumJayer (figures 1 and 2) or over the silicium substrate (figure 3) will in no case be larger than 40%. The following examples illustrate the in¬ vention without however limiting same. The compari- S on examples show conventional ethcds and are given with the purpose of better showing off the advantages secured with this invention. The production tests described hereinafter have been made with a pilot production line with a capacity of about 5 KW. The production line in all of the following examples, comprises OMPI the following apparatus and has the following features : a) Diffusion oven: loading and unloading are made by hand. The oven capacity for making reproducible tests is 50 slices from 5.08 cm and 30 slices from 7.62 cm. b) Dust-free volume for all of the chemical opera¬ tions, such as polishing by chemical attack, apply¬ ing coatings or layers, chemical etching of the ° interfering junction, chemical etching of the re¬ maining layer after silk-screen diffusion. c) Device for silk-screen application and through- oven; the " drying occurs over a heated plate. In the equipement, the semi-automatic silk-screen de- vice, the drying plate and the through-oven are not coupled automatically together, in such a way that loading and unloading have to be made completely by hand. d) The copper electroplating bath is a 50-liter bath fitted with two racks allowing to treat simultaneous¬ ly 16 cells from 1.27 cm. Soldering is made by hand in a static solder bath. Rinsing is also made by hand in an ultrasonic bath. Comparison example 1. 5 In this reproduction test, a start was made with 360 slices from 7.62 cm to produce 720X/2 sli¬ ces from 7.62 cm. Said cells have been produced with a conventional method of gaseous diffusion, metalli- - zing of the front side by means of AgTi and of the ° back side by means of Al, said latter operation being followed with a conventional copper electroplating and dipping in a solder bath; 6% from the cells had mechanical flaws (mostly during electroplating) or had an efficiency lower than 8%. 12% from the cells had an efficiency lying between 8 and 10%. Cell* ***' production according to this method, with a throughput higher than 10%, was 82%. The final throughput was 10.9%. Comparison example 2. A start is made in this example, with 330 complete slices from 7.62cm to obtain 330 subs¬ tantially square solar cells. The process being followed is identical to the process in comparison example 1. But 3% from the cells had an efficiency between 8 and 10%. The final production is but 67%, 5 which is due to the breakage during the handling for the electroplating process and mainly the break¬ age due to scribing the slices for passing from the round shape to the quasi-square shape. Example 1. A start is made in this production test with 330 quasi-square cells. Use is made in this test, of a conventional diffusion arid of a metalli¬ zing paste on the basis of silver and tin on the front side.' The lower curing temperature being used • gives a higher current. The metallizing on the back side has been obtained by means of a double silk-screen process, first of all on the basis of aluminum, and then on the basis of silver and palla¬ dium. The production was 80% and the mean effi- ciency was about 11.4%. Example 2 . A start ' is made in this test, from 450 quasi- square cells. The diffusing is performed by means of the silk-screen process and the metallizing is made by means of a Ag-Sn paste on the front side and of a paste from Al and Ag-Pd on the back side. Sawing to obtain quasi-square cells was performed after the diffusion, in such a way that part of the paste flow which is usually present on the cell ed - ges was removed. The cell production having an efficiency higher than 8%, was 92% and the cell pro¬ duction with an efficiency higher than 9%, was 86%, which is high relative to the . values obtained with the conventional methods . Example 3. A start was also made in this test, from 450 quasi-square cells . Diffusing ' is performed by means of the silk-screen process and metallizing is made by means ofan Ag-Sb paste on the front side, and of paste from Al and Ag-Pd on the back side. Sawing to obtain- quasi-square cells was also per¬ formed after the diffusion, in such a way that part of the paste flow which is usually present on the cell edges was removed. The cell production with an efficiency higher than 8%, was 94% and the cell production with an efficiency higher than 9% was 87%, which is also very high relative to the values obtained with the conventional methods. The conclusions which may be drawn from the production tes * ts as described hereinabove, may be summarized as follows : 29 - By changing from the electroplating process to the double silk-screen process according to the invention, the throughput may reach 85%. - By adding tin to that silver paste which is laid over the front side, it was possible to substantial¬ ly lower the curing temperature, which has secured a marked improvement in the throughput. The mean efficiency is 11.3% . - In a complete silk-screen process, it is present- ly possible to insure a production of 85% with a minimum efficiency of 9% for quasi-square cells. Those cells the edges of which have been entirely treated or removed, for example by making use of a plasma equipment, have a substantially higher effi- ciency. Minimum efficiencies about 11% are obtained in this case. It must be understood that the invention is not limited to the above mebodiments and that many changes may be brought therein without depar- ting from the scope of the invention as defined in the appended claims. OMPI

Claims: CLAIMS. 1. Method for manufacturing a semi-conduc¬ ting device, particularly a photovoltaic solar cell, comprising a sensitive front side and a back side ••*• so arranged as to provide a ohmic contact, having a semi-conducting substrate, such as silicium, in the shapeof a slice, which comprises making a junction on the front side of the semi-conducting substrate slice, by diffusing therein a doping material, coa- ° ting the doped front side with an anti-reflecting material layer, covering by silk-screening the anti- reflecting material layer with a layer of a silver- based paste, subjecting the silver-based paste to a controlled heat treatment, applying by silk- *-- screening over a large part at least of the back side from the semi-conducting substrate slice, a first layer formed by an aluminum paste, and apply¬ ing by silk-screening over the first aluminum layer, a second layer the covering rate of which lies 0 between 10 and 40%, formed either by a paste on the basis of silver and palladium the palladium content of which is at least 25% by weight, in which case the first aluminum layer is applied over the whole surface area of said back side, or by a silver paste, 5 in which case the first aluminum layer is applied over a large portion from the back side of the semi¬ conducting substrate slice, and the second silver layer is applied into openings provided in the first aluminum paste layer, while insuring a satisfactory 0 covering of the aluminum paste, said first and se¬ cond layers being subjected to a controlled heat -^0RE£» treatment after the application thereof. 2. Method as defined in claim 1, in which the second silver paste layer is applied into the openings from the first aluminum paste layer, as well as over that surface portion of said first layer which surrounds said openings; 3. Method as defined in eifher one of claims 1 and 2, in which said second layer of pas¬ te on the basis of silver and palladium contains between 30 and 45% by weight of palladium. 4. Method as defined in any one of claims 1 to 3, in which the covering ^aecf said second layer over the first aluminum paste layer lies between 15 and 25%. 5. Method for manufacturing a semi-conduc¬ ting device, particularly a photovoltaic solar cell, comprising a photosensitive front side and a back side so arranged as to provide an ohmic contact, having a semi- conducting substrate such as silicium , in the shape of a slice, which com¬ prises, forming a junction on the front side of the semi-conducting substrate slice, by diffusing there¬ in a doping material, coating the doped front side with an anti-reflecting material layer, covering by silk-screening said anti-reflecting material layer with a siϊer-based paste layer, subjecting said silver-based paste layer to a controlled heat treatment, applying by silk-screening over the back side of the semi-conducting substrate slice, a first layer comprised of a silver paste the covering rate of which lies between 10 and 40%, " JRE and applying by silk-screening over the back side portion which is not covered with the silver paste and over a portion from the first silver paste layer, a second layer comprised of an aluminum paste, said first and second layer being subjected to a controlled heat treatment after the application thereof. 6. Method as defined in claim 5, in which said second aluminum paste layer is applied over 0 that back side portion which is not covered with the first silver paste layer as well as over that surface portion from said first layer which is adjacent to the aluminum layer. 7. Method as defined in either one of 5 claims 5 and 6, in which the covering rate of said first layer over the back side of the semi- conduc¬ ting substrate slice lies between 15 and 25%. 8. Method as defined in any one of claims 1 to 7, in which, after the application thereof, said first and second layers are each dried respectively at a temperature about 150° for about 10 minutes, and then subjected to curing for about one hour up to a maximum curing temperature about 650° to 800°C, said maximum curing temperature being retained for 5 about 8 to 10 minutes, while keeping a temperature gradient no higher than 50°C/min. 9. Method as defined in any one of claims 1 to 7, in which, after the application thereof, said first and second layers are each dried at a ° temperature about 150°C for about 10 minutes, and they are then subjected simultaneously after drying of the second layer, to curing for about one hour up to a maximum curing temperature about 650° to 800°C, the maximum curing temperature being re¬ tained for about 8 to 10 minutes, while keeping a temperature gradient no higher than 50°C/min. 10. Method as defined in either one of claims 8 and 9, in which the maximum curing tempera¬ ture is about 660° to 720°C. 11. Method as defined in any one of claims 1 to 10, in which the semi-conducting substrate sli¬ ce is subjected to chemical polishing before making' said junction. 12. Method as defined in claim 11, in which said semi-conducting substrate slice is dipped into.a chemical etching bath on the basis of nitric acid , hydrogen fluoride, and glacial acetic acid. 13. Method as defined in any one of claims 1 to 12 " , in which said junction is obtained by diffusing in the gaseous phase, phosphorus from phosphorus oxychloride. 14. Method as defined in claim 13, in which the interfering junction formed on the back side and edges of the semi-conducting substrate slice is removed by dipping said slice into an aqueous chemical etching bath on the basis of nitric acid and hydrogen fluoride, the front side from said sli¬ ce being coated during said dipping with a protec¬ ting lacquer. 15. Method as defined in any one of claims i to 12, in which said junction is obtained by diffu¬ sing from a layer of phosporus-doped paste applied XY ^- IJ by silk-screening over the front side of said semi¬ conducting substrate slice. 16. Method as defined in claim 15, in which the phosphorus-doped paste coπprises a phosphorus com- pound selected from polyphosphoric acid and the esters from polyphosphoric acid, a solvent and colloidal silica. 17. Method as defined in claim 16, in which the phosporus-doped paste contains from 10 0 to 15% by weight phosphorus. 18. Method as defined in either one of claims 16 and 17, in which thesolvent is selected from the group comprising the butyl carbitol ace¬ tate, butylcellulose acetate, ethylene-glycol 5 ethers and diethylene-glycol ethers. 19. Method as defined in any one of claims 15 to 18, in which the phosphorus-doped paste layer is dried at a temperature about 150°C, and it is then subjected to curing to cause diffusing of θ the phosphorus for a time period between 45 minutes and 1.5 hours up to a maximum curing temperature about 900° to 950°C, the maximum curing tempera¬ ture being retained for about 15 to 20 minutes, while keeping a temperature gradient no higher than 5 50°C/min. .20. Method as defined in any one of claims 15 to 19, in which the application as well as the drying and curing operations for the phosphorus- doped paste layer are performed under nitrogen 0 atmosphere. 21. Method as defined in any one of claims 15 to 20, in which the interfering junction formed on the edges of the semi-conducting substrate slice is removed by dry-treating with a plasma equip¬ ment. 22. Method as defined in any one of claims 15 to 21, in which after said phosphorus-diffusion step, the remaining paste layer is removed by chemi¬ cal etching with an aqueous solution of hydrogen fluoride, such chemical etching being followed with a cleaning with water and a drying in acetone va¬ pours. 23. Method as defined in any one of claims 1 to 22, in which use is made as anti-reflecting layer, of a material with a refraction factor about 2 . 24. Method as defined in claim -23, in which the anti-reflecting material is selected from the group comprising Si0 , TiO , such as TiO, Ti0_, Ta_0_ and the mixtures thereof. 2 5 25. Method as defined in any one of claims 1 to 24, in which the silver-based paste layer cove¬ ring the anti-reflecting material layer contains about 4 to 7% by weight titanium. 26. Method as defined in claim 25, in which after the application thereof, the layer of silver paste with titanium is dried at a tempera¬ ture about 100°C for about 10 minutes, and it is then subjected to curing for about one hour up to a maximum curing temperature, about 850° to 860°C, the maximum curing temperature being retained for about 5 minutes, while keeping a temperature gradient no higher than 50°C/min. 27. Method as defined in any one of claims 1 to 24, in which the silver-based paste layer cove¬ ring the anti-reflecting material layer contains about 3 to 6% by weight tin. 28. ' Method as defined in claim 27, in which after the application thereof, said silver paste layer with tin is dried at a temperature in the range of 100°C for about 10 minutes and said layer is then subjected to curing for about one hour up to a maxi- mum curing temperature about 780° to 820°C, the maximum curing temperature being retained for about 5 minutes, while keeping a temperature gradient no higher than 50°C/min. 29. Method as defined in any one of claims 1 to 24, in which the silver-based paste layer covering the anti-reflecting material contains about 3 to 7% by weight antimonium. 30. Method as defined in claim 29, in which after the application thereof, the layer of silver paste with antimonium is dried at a temperature about 100°C for about 10 minutes and it is then sub¬ jected to curing for about one hour up to a maximum curing temperature about 760° to 840°C, the maximum curing temperature being retained for about 5 minutes, while keeping a temperature gradient no higher than 50°C/min. 31. Semi-conducting device, particularly photovoltaic cell, as obtained by a method as defined in any one of claims 1 to 30. - tJRE c OMP

Inventors: FRISSON LOUIS, HONORE MIA, JANSSENS ROBERT, MERTENS ROBERT PIERRE, VAN OVERSTRAETEN ROGER, FRISSON, LOUIS, HONORE, MIA, JANSSENS, ROBERT, MERTENS, ROBERT, PIERRE, VAN OVERSTRAETEN, ROGER
Applicants: BELGE ETAT, DE BELGISCHE STAAT VERTEGENWOORDIGD DOOR DE SECRET
Application year: 1982
Main classification: H01L31
IPC codes: H01L21, H01L29, H01L31