A METHOD OF FORMING ELECTRODES ON CERAMIC BODIES TO PROVIDE ELECTRONIC COMPONENTS

Abstract: A method of forming electrodes or conductors (10, 34) on ceramic bodies (12, 24) to provide capacitors, varistors and like electronic ceramic components, by coating an electroconductive paste on desired surfaces (26, 28) of each ceramic body and baking the coatings. In order to provide a less expensive substitute for the silver paste heretofore used for this purpose, there is employed a zinc paste consisting principally of spherical zinc particles, with an additive or additives selected from among glass frits, metal oxides, and organometallic compounds. Pasted with a vehicle, the zinc powder with or without an additive or additives is coated on ceramic bodies, and the coatings are baked at a temperature intermediate the melting and boiling points of zinc, thereby forming base layers (22) on the ceramic bodies. Then a solderable overlay (30) is formed on each base layer by plating a more solderable metal such as nickel or copper thereon.

Description: A method of forming electrodes on ceramic bodies to provide electronic components The present invention pertains to a method of creating electrodes or conductors on ceramic bodies ip the manufacture of some electronic ceramic components, comprising the steps of coating an electroconductive paste on desired surfaces of each ceramic body and baking the coatings. As is well known, in the fabrication of such electronic components using ceramic materials as capacitors, varistors, thermistors and vibrators, the electrodes or conductors are formed by baking the coatings of electroconductive pastes on ceramic bodies. Typical of such pastes as heretofore used is what is known as a silver paste, composed of powdered silver, a glass frit, and a vehicle or the liquid ingredient or ingredients of the paste. The silver paste is itself an excellent material for the purposes. When used for the electrodes of ceramic capacitors, for example, it can provide desired capacitance, dielectric loss tangent (the tangent of the dielectric loss angle), bond strength between the formed electrodes and the ceramic bodies, and easy solderability of leads to the electrodes. Offsetting all these advantages, however, is the expensiveness of silver, a precious metal, which adds very much to the costs of the electronic components. This invention remedies the noted problem of the prior art and provides a novel method of fabricating electrodes or conductors on ceramic bodies to provide desired electronic components, with use of a remarkably less expensive substitute for the conventional silver paste. The electrodes or conductors prepared by the inventive method are notable for their favorable electrical and mechanical properties, in addition to their inexpensiveness. The inventive method dictates the use of an electroconductive paste composed of pulverized zinc and a vehicle, with or without one or more of additives such as glass frits, metal oxides, and organometallic compounds. This paste for use with the inventive method will hereinafter be referred to as the zinc paste for simplicity and in contradistinction to the conventional silver paste. In accordance with the method of this invention, stated in brief, the zinc paste is coated on desired surfaces of a ceramic body. The zinc paste coatings are baked or fired at a temperature ranging from the melting point to boiling point of zinc, thereby forming electroconductive base layers on the ceramic body. Then an overlay of a more solderable metal is plated on each base layer. Zinc melts at 4190 C. and boils at 9070 C. Baked at a temperature between these limits, the zinc paste coatings form electroconductive base layers firmly adhering to the ceramic body. These zinc base layers are poor in solderability, however. By plating a more solderable metal on the base layers, as by electrolytic or electroless plating of nickel or copper, there can be obtained electrodes of desired solderability. The electronic components having their their electrodes thus fabricated from the zinc paste, with the solderable overlays, are almost as favorable in electrical and mechanical properties as those having the conventional silver electrodes. As regards the inexpensiveness of the electrodes produced by the inventive method, suffice it to say that powdered zinc is available at approximately 1/200 the cost of powdered silver. The above and other features and advantages of this invention and the manner of attaining them will become more apparent, and the invention itself will best be understood, from a study of the following more detailed description taken together with the attached drawings, in which: Figure 1 is a fragmentary sectional view diagrammatically illustrating, on a greatly magnified scale, a conductive region formed on a ceramic body from the zinc paste by the method of the present invention, the view being explanatory of the way in which the unoxidized interiors of the individual zinc particles become fused to each other on baking; Figure 2 is a diametrical section through a ceramic capacitor having a pair of electroconductive base layers fabricated by the method of the invention; ; Figure 3 is also a diametrical section through the ceramic capacitor of Figure 2, showing the capacitor after the creation of solderable overlays on the base layers to complete the electrodes by the method of the invention; and Figure 4 is a plan view explanatory of the way in which the ceramic capacitor of Figure 3 is tested as to the strength with which the electrodes adhere to the ceramic body against tensile stress. The present invention suggests the use of the zinc paste composed principally of pulverized zinc, preferably in the form of spherical particles with an average size ranging from 0.1 to 30.0 microns, for the fabrication of the electrodes or conductors of some electronic ceramic components. In most cases the zinc paste may contain an additive or additives chosen from among various glass frits, organometallic compounds, and metal oxides, the preferred examples of which will be recited subsequently. Pasted with a suitable vehicle, the zinc powder together with or without the selected additive or additives can be.coated on desired surfaces of ceramic bodies in any known or suitable manner. The subsequent firing of the zinc paste coatings, however, must be conducted in the temperature range specified for the zinc paste by the invention. This temperature range is from the melting point to boiling point of zinc. How the zinc paste forms conductive regions on ceramic bodies, and why it should be baked in the above specified temperature range, will now be discussed with reference to Figure 1. The discussion will also make clear that the use of zinc powder as the main ingredient of the paste is no arbitary choice but an outcome of extensive experimentation. Explanatory of the unique behavior of the zinc paste on firing, Figure 1 is a greatly magnified, fragmentary section through, for instance, a ceramic capacitor comprising an electroconductive base layer 10, forming a part of one of its electrodes, and a ceramic body 12. The base layer 10 is made from the zinc paste, coated on the ceramic body 12 and baked at a temperature anywhere between the melting and boiling points of zinc. When so heated, each zinc particle 14, herein shown to be of spherical shape, under goes oxidation and bears an oxide cladding 16. If the zinc powder has been mixed with an additive or additives chosen from the above listed substances, the additive or additives fill the interstices of the zinc particles, as identified by the reference numeral 18. Consequently the oxidation of the zinc powder does not proceed deep into each particle 14. With the continued application of heat the unoxidized interiors 20 of the zinc particles melt and expand at a greater rate than their oxide claddings 16, until the zinc interiors disrupt the oxide claddings and become bridged to each other as shown. Thus is fabricated the coherently bonded base layer 10 having good electrical conductivity and firmly adhering to the ceramic body 12. It will also have been seen that the additive or additives in the zinc paste function as inorganic binder and zinc oxidation in hibitor or retarder, making it possible to bake the zinc paste coatings in atmosphere. The base layer 10 produced as above has one weakness, namely, poor solderability. In accordance with the method of this invention, therefore, an overlay of a more solderable metal is formed by plating on the base layer to complete the electrode. Such solderable overlays can be created by electroless or electrolytic plating of, typically, nickel or copper, as will be detailed later. Described hereinbelow are Examples of the invention, dealing with specific examples of the zinc paste as actually produced, and with the physical properties of ceramic capacitors that had their electrodes fabricated from the zinc paste examples by the method of the invention. These Examples, however, are meant purely to illustrate or explain and not to impose limitations upon the invention. Examples 1-48 The following zinc powder, glass frits, organotitanium (organometallic) compounds, metal oxides, and vehicle were prepared to formulate zinc pastes of various possible compositions in accordance with the invention: Zinc powder: Spherical particles with diameters ranging from 0.1 to 30.0 microns. The zinc powder was of such purity as to contain approximately 0.01% by weight of impurities such as cadmium and iron. Glass frits: One composed of litharge (PbO), borix oxide (B2 3) and silica (SiO2), consisting of 325-mesh particles and having a softening point of 5600 C., and another composed of zinc oxide (ZnO), B2O3 and SiO2, also consisting of 325-mesh particles and having a softening point of 660 C. Organotitanium (organometallic) compounds: Tetrakisstearoxytitanium, Ti(O-C17H35)4, in powder form with a particle size up to 30 microns, and di-i-propoxybisacetylacetonatetitanium, Ti(O-iC3H7)2[OC(CH3)CHCOCH3]2, in the form of a solution, with toluene as the solvent. Metal oxides: Red lead oxide (Pb304), bismuth trioxide (Bi203), praseodymia (Pr6O11), black copper oxide (CuO), and cadmium oxide (CdO), all in powder form with a particle size ranging from 0.1 to 15.0 microns. Vehicle: Alpha-terpineol admixed with 5% by weight ethylcellulose as an organic binder. These ingredients were mixed together in various combinations set forth in Tables 1 and 2, to prepare 48 zinc pastes of different compositions. The zinc pastes contain the zinc powder and the vehicle as the two essential ingredients, so that Tables 1 and 2, as well as all the following tables, list only the additives used and their proportions in weight parts with respect to 100 parts by weight of the zinc powder. For simplicity the capitals A, B, C and D are used in all the tables given herein to refer to the following additives more specifically recited above: A: The PbO-B20 3-Si 02 glass frit. B: The ZnO-B203-SiO2 glass frit. C: Ti(O-C17H35)4 (organometallic compound). D: Ti(O-iC3H7)2(0C(CH3)CHCOCH3)2 (organometallic compound). The tabulated weight parts of the additive D are exclusive of the toluene used as the solvent. The amount of the vehicle (alpha-terpineol) was approximately 20% of the weight of the zinc powder, or in cases of the use of an additive additives, of the total weight of the zinc powder and the additive or additives. Thus, as is seen from Tables 1 and 2, the zinc paste of Example 1 consists only of the zinc powder and the vehicle. The zinc pastes of Examples 2-4 consist of 100 parts by weight of the zinc powder, 0.01-10.00 parts by weight of the PbO-B203-SiO2 glass frit, and the vehicle. The zinc pastes of Examples 5-7 consist of 100 parts by weight of the zinc powder, 0.01-15.00 parts by weight of the Ti(O-C17H35)4 powder, and the vehicle. The zinc pastes of Examples 8-10 consist of 100 parts by weight of the zinc powder, 0.01-10.00 parts by weight of the PbO-B203-SiO2 glass frit, 0.01-14 99 parts by weight of the Ti(O-Ct7H35)4 powder, and the vehicle. The zinc pastes of Examples 11-19 consist of 100 parts by weight of the zinc powder, 0.0110.00 parts by weight of the PbO-B203-SiO2 glass frit, 0.015.00 parts by weight of either of the Bi203, Pr6O11 and CuO powders, and the vehicle. The zinc pastes of Examples 2028 consist of 100 parts by weight of the zinc powder, 0.0115.00 parts by weight of the Ti(O-C17H35)4 powder, 0.01 5.00 parts by weight of either of the CdO, pb3O4 and Bi2O3 powders, and the vehicle. The zinc pastes of Examples 2937 consist of 100 parts by weight of the zinc powder, 0.0110.00 parts by weight of either of the Pr6011, CuO and CdO powders, and the vehicle. The zinc pastes of Examples 3839 and 43-47 consist of 100 parts by weight of the zinc powder, 1.0 part by weight each of two or more of the PbO-B203-SiO2 and ZnO-B203-SiO2 glass frits and the Ti(O-C17H35 ) 4 and Ti(O-iC3H7)2(OC(CH3)CHCOCH3)2 powders, 1.0 part by weight of either of the Bi2O3, Pb304, CuO, Pr6O11 and CdO powders, and the vehicle. The zinc pastes of Examples 40-42 and 48 consist of 100 parts by weight of the zinc powder, 1.0 part by weight each of three or all of the PbO-B203 SiO2 and ZnO-B2 0 3-SiO2 glass frits and the Ti(O-C17H35 )4 and Ti(O-iC3H7)2[OC(CH3)CHCOCH3]2 powders, and the vehicle. The 48 different mixtures, as above, of the above enumerated ingredients were agitated for approximately 15 hours to prepare the zinc pastes of Examples 1-48. These zinc pastes are the starting materials for the fabrication of electrodes or conductors on ceramic bodies by the method of the invention. The particular electronic ceramic component chosen to illustrate the invention was the capacitor. The dielectric ceramic bodies of capacitors, on which the above prepared zinc pastes were to be coated and baked to provide electrodes, were fabricated through the following procedure. There was first prepared a ceramic mixture of 98.8 mole % strontium titanate (SrTiO3), 0.8 mole % germanium dioxide (GeO2), and 0.4 mole % niobium oxide (Nb205), admixed with polyvinyl alcohol as an organic binder. After having been agitated, the admixture was molded into discs at a pressure of approximately one ton per square centimeter. The disc-like moldings were then baked for three hours at a temperature of 14200 C. in a furnace, in which there was a reductive atmosphere of 98% by capacity molecular nitrogen (N2) and 2% by capacity molecular hydrogen (H2). The ceramic discs thus formed had each a diameter of eight millimeters (mm) and a thickness of 0.4 mm. The ceramic discs were then coated with a PbO-B203-Bi203 glass paste. The coated ceramic discs were heated to and held for three hours at a temperature of 12000 C., thereby causing diffusion of the glass ingredients into the ceramic to insulate its particles. With the zinc pastes and the ceramic discs prepared as in the foregoing, these were processed into capacitors, as shown in Figures 2 and 3, by the method of this invention. First, for the fabrication of electroconductive base layers 22 on the opposite faces of each ceramic disc 24 as in Figure 2, each zinc paste was coated or "printed" on one face 26 of each of several ceramic discs through a 200-mesh Teflon (trademark) screen. The coated discs were introduced into a drying furnace for drying the coatings at 1500 C. for 10 minutes. Then each zinc paste was coated on the other faces 28 of the discs, and the coatings were likewise dried. Then, placed on an iron net, the ceramic discs with the dried coatings were introduced into a tunnel-shaped heater, in which the coatings were baked at approximately 7000 C., intermediate the melting point (419 C.) and boiling point (9070 C.) of zinc, for 10 minutes in exposure to atmosphere. The coated ceramic discs were held in the heater for a total of 40 minutes including the time for raising and lowering its temperature. Thus were completed the conductive base layers 22 on the ceramic discs 24. Each base layer had a diameter of 7.8 mm and a thickness of 15 microns. The next step is the formation of solderable overlays on the base layers 22 on the ceramic discs. The electroless nickel plating method was adopted for this purpose in these particular Examples of the invention. Preparatory to electroless plating, the articles of Figure 2 were cleaned by 10 minutes immersion in an aqueous solution containing 10% by weight ammonia, with a pH of 14, at a temperature of 200 C. For the electroless nickel plating of the cleaned articles a bath was prepared which was composed of 20 grams per liter (g/l) of nickel sulfate (Niso4.6H20), 40 g/l of potassium-sodium tartrate (KNaC4H406.2H20) and 2.3 g/l of sodium borohydride (NaBH4). The pH of this plating bath was set at 12.5 by the addition of sodium hydroxide (NaOH). The articles of Figure 2 were immersed for approximately 10 minutes in the nickel plating bath, which had been heated to and held at 500 C. After being rinsed with water, the nickel-plated articles were dried by being held in a drying furnace at about 1500 C. for 30 minutes. Figure 3 shows at 30 the solderable overlays thus created by the electroless nickel plating on the base layers 22 of each ceramic capacitor 32. Each solderable overlay 30 had a thickness of about two microns. The reference numeral 34 in this figure generally denotes each electrode or conductor, comprising the base layer 22 and the solderable overlay 30, of each capacitor 32. The ceramic capacitors 32 with the Zn-Ni electrodes 34 were then tested as to capacitance, dielectric loss tangent, the solderability of the electrodes, and the strength with which the electrodes adhere to the ceramic discs 24 against pulling stress. Tables 1 and 2 represent the results. In these and all the following tables each listed value is the average of 10 samples. Also, in all the tables given herein, the capacitances of the capacitors represent the values measured at a frequency of 1 kHz, in nanofarads (nF). The dielectric loss tangents of the capacitors represent 100 times the values measured at 1 kHz. For the actual values of dielectric loss tangent, therefore, the tabulated figures should be multiplied by 10 2. The solderability of the Zn-Ni electrodes 34 was ascertained through the following procedure. The electrodes were first treated with a flux containing rosin and isopropyl alcohol in a weight ratio of one to nine. The capacitors 32 with the thus pretreated electrodes 34 were then dipped for about three seconds in a bath of lead(Pb)-tin (Sn) solder heated to a temperature of 2500 C. The total weight of the Pb-Sn solder adhering in hemispherical shape to the pair of electrodes 34 of each capacitor, on its withdrawal from the molten solder bath, was measured. In Tables 1 and 2 and all the following tables the solderability of each capacitor is described as "excellent" if the total weight of the solder attached to its electrodes was more than 50 milligrams (mg), and as "good" if the total weight was in the range of 20-50 mg. The lower limit of acceptable solderability was set at 20 mg because, as has been ascertained by experiment, terminals could then be soldered to the electrodes without difficulty. Figure 4 is explanatory of the method employed for measurement of the strength with which the Zn-Ni electrodes 34 of each capacitor 32 adhere to the ceramic disc 24 against tensile load. Two annealed copper wires 36 and 38 were prepared for each capacitor to be tested, each wire having a length of 35 mm and a diameter of 0.6 mm. Each wire was bent at a point approximately 4 mm from one end into an angle of 1300.. The bent ends 40 and 42 of the wires were soldered to the respective electrodes 34, or to their nickel overlays 30, each with use of about 30 mg of solder. -In thus soldering the wires to the electrodes their shank portions 44 and 46 were laid parallel to each other, with a spacing of some 5 mm. Then, with one wire 36 held against movement, the other was pulled slowly in the arrow marked direction via a spring scale, until either of the electrodes came off the ceramic disc. The reading in kilograms (kg) of the spring scale at that instant is given in the tables as the tensile strength of each capacitor. TABLE 1 Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 1 ........... ........... ........... 53 1.49 Good 1.0 2 0.01 ........... ........... 54 1.32 Good 1.2 3 1.00 ........... ........... 61 0.86 Excellent 2.3 4 10.00 ........... ........... 55 1.33 Good 1.3 5 ........... 0.01 ........... 54 1.40 Good 1.2 6 ........... 5.00 ........... 60 0.96 Excellent 1.8 7 ........... 15.00 ........... 55 1.33 Good 1.2 8 0.01 0.01 ........... 54 1.34 Good 1.4 9 0.01 14.99 ........... 53 1.39 Good 1.1 10 10.00 0.01 ........... 56 1.38 Good 1.2 TABLE 1 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 11 0.01 ........... Bi2O3, 0.01 56 1.30 Good 1.3 12 0.01 ........... Bi2O3, 5.00 55 1.35 Good 1.2 13 10.00 ........... Bi2O3 5.00 54 1.39 Good 1.3 14 0.01 ........... Pr6O11, 0.01 55 1.34 Good 1.1 15 0.01 ........... Pr6O11, 5.00 54 1.40 Good 1.3 16 10.00 ........... Pr6O11, 5.00 54 1.41 Good 1.2 17 0.01 ........... CuO, 0.01 55 1.37 Good 1.2 18 0.01 ........... CuO, 5.00 56 1.32 Good 1.2 19 10.00 ........... CuO, 5.00 55 1.39 Good 1.3 TABLE 1 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 20 ........... 0.01 CdO, 0.01 55 1.32 Good 1.2 21 ........... 0.01 CdO, 5.00 55 1.33 Good 1.2 22 ........... 15.00 CdO, 5.00 55 1.36 Good 1.3 23 ........... 0.01 Pb3O4, 0.01 54 1.40 Good 1.2 24 ........... 0.01 Pb3O4, 5.00 55 1.37 Good 1.2 25 ........... 15.00 Pb3O4, 5.00 54 1.39 Good 1.3 26 ........... 0.01 Bi2O3, 0.01 55 1.32 Good 1.2 27 ........... 0.01 Bi2O3, 5.00 55 1.36 Good 1.3 28 ........... 15.00 Bi2O3, 5.00 54 1.40 Good 1.0 TABLE 1 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 29 ........... ........... Pr6O11, 0.01 55 1.35 Good 1.2 30 ........... ........... Pr6O11, 0.50 59 1.00 Good 2.1 31 ........... ........... Pr6O11, 10.00 54 1.36 Good 1.3 32 ........... ........... CuO, 0.01 54 1.37 Good 1.1 33 ........... ........... CuO, 0.50 59 0.96 Good 2.0 34 ........... ........... CuO, 10.00 55 1.38 Good 1.2 35 ........... ........... CuO, 0.01 54 1.35 Good 1.2 36 ........... ........... CuO, 0.50 60 0.93 Good 2.2 37 ........... ........... CuO, 10.00 55 1.34 Good 1.2 TABLE 2 Zinc paste composition Capacitor properties Organometallic Dielectric Glass frits, compounds, Dielectric weight part weight part Metal oxide Capaci- loss Solder- Tensile in use and tance, tangent, ability strength, Examples A B C D weight part nF kg x 10-2 38 1.0 ... 1.0 ... Bi2O3, 1.00 64 0.59 Excellent 2.2 39 1.0 ... 1.0 ... Pb3O4, 1.00 64 0.58 Excellent 2.3 40 1.0 1.0 1.0 ... ........... 63 0.62 Excellent 2.1 41 1.0 1.0 ... 1.0 ........... 65 0.54 Excellent 2.4 42 1.0 ... 1.0 1.0 ........... 64 0.55 Excellent 2.4 43 1.0 1.0 1.0 ... CuO, 1.00 64 0.56 Excellent 2.3 44 1.0 1.0 ... 1.0 Pr6O11, 1.00 63 0.61 Excellent 2.1 45 1.0 ... 1.0 1.0 CdO, 1.00 64 0.58 Excellent 2.1 46 ... 1.0 1.0 1.0 Bi2O3, 1.00 64 0.60 Good 2.2 47 1.0 1.0 1.0 1.0 Pb3O4, 1.00 64 0.57 Excellent 2.3 48 1.0 1.0 1.0 1.0 ........... 64 0.58 Excellent 2.3 It will certainly redound to a better appreciation of the advantages of this invention to compare the above tabulated electrical and mechanical properties of the capacitors manufactured by the inventive method with those of the conventional capacitors with the familiar silver electrodes. Thus the conventional capacitors were fabricated by the following method usually adopted in the industry. A silver paste was prepared which was composed of 60% by weight of spherical silver particles sized from 0.1 to 3.0 microns, 2% by weight PbO-B 203 -Si02 glass frit with a softening point of 5500 C., and 20% by weight of a vehicle. The silver paste was coated on opposite faces of SrTiO3 ceramic discs identical with those used in the above Examples of the invention. The coatings were baked at a temperature less than the melting point of silver, thereby completing capacitor electrodes each with a diameter of 7.8 mm and a thickness of three microns. Measured under the same conditions as those specified above, the capacitance of the thus fabricated conventional capacitors averaged 47 nF, their dielectric loss tangent 0.56 x 10 2, the weight of the solder attached to each pair of electrodes about 50 mg, and their tensile strength 1.5 kg. From these results, and in consideration of the characteristics of the capacitors with the silver electrodes, the acceptable criteria of the four physical properties in question for any capacitors with SrTiO3 ceramic bodies will now be determined as follows: capacitance, not less than 47 nF; dielectric loss tangent, not more than 1.5 x 10 2 the amount of solder attached to each pair of electrodes, not less than 20 mg; and tensile strength, not less than 0.5 kg. An inspection of Tables 1 and 2 will reveal that the capacitors with their electrodes made of the zinc base layers and the nickel overlays, and with the zinc base layers containing or not containing one or more of the listed additives, all satisfy the above criteria of capacitance, dielectric loss tangent, solderability, and tensile strength. Consider the capacitors of Examples 3, 6, 30, 33, 36, 38-48 in particular. Their capacitances and tensile strengths are far better than those of the conventional SrTiO3 capacitors with the silver electrodes. For a given capacitance, therefore, the method of this invention makes it possible to reduce the size of capacitors of this class. Further, since the inventive method allows the firing of the zinc paste coatings on ceramic bodies in atmosphere, and the production of the solderable overlays by plating, the capacitors are mass producible, and at drastically reduced costs because of the cheapness of zinc compared with silver. The following experiment will prove that the provision of the solderable overlays on the zinc electrodes in accordance with the method of the invention is essential for the utility of the electronic ceramic components incorporating such electrodes or conductors. Ceramic capacitors with only the zinc base layers 22, as in Figure 2, were tested as to the four physical properties in question under the same conditions as above. Their capacitance, dielectric loss tangent, and tensile strength were approximately equivalent to those of the capacitors having the solderable overlays plated on the base layers. However, when the capacitors were dipped for three seconds in a bath of molten Pb-Sn solder at 2500 C., after treating their zinc layers with a rosin flux, no solder at all adhered to the zinc layers. The other three properties of these capacitors were therefore measured after soldering leads to their zinc layers with application of ultrasonic vibration. Examples 49-96 In these Examples it was experimented if the solderable overlays could be formed on the zinc base layers on ceramic bodies not only by electroless nickel plating but also by electroplating of the same metal, to provide capacitors that were just as favorable in the electrical and mechanical properties as the capacitors of Examples 1-48. The particular electroplating method tried here was what was known as barrel plating. Except in Example 49, as represented in Tables 3 and 4, zinc powder of the grade set forth in connection with Examples 148 was admixed with one or more of the glass frits, organotitanium compounds, and metal oxides specified previously, in various proportions expressed in weight parts with respect to 100 parts by weight of the zinc powder. The zinc powder with or without one or more of the additives was processed into 48 different zinc pastes of Examples 49-96 with use of the same vehicle and through the same procedure as in Examples 1-48. The procedure of Examples 1-48 was also followed in fabricating electroconductive zinc base layers on SrTiO3 ceramic discs as in Figure 2. Preparatory to the barrel plating of solderable overlays on the base layers, the articles of Figure 2 were cleaned by immersion in a 10% by weight aqueous solution of ammonia. Then the cleaned articles were introduced into a nickel electroplating bath containing 300 g/l of nickel sulfamate, Wi(SO3NH2)2, 5 g/l of nickel chloride, NiC12.6H20, and 40 g/l of boric acid, H3B03. At a temperature of 600 C. and a current density of four amperes per square decimeter (A/dm2), nickel was barrel plated on the zinc base layers to provide solderable overlays as in Figure 3. The plated articles were then rinsed with water. The thus completed capacitors with the Zn-Ni electrodes were tested as to capacitance, dielectric loss tangent, solder ability, and tensile strength by the same methods as in Examples 1-48. Tables 3 and 4 represent the results. The tabulated results demonstrate that the noted properties of the capacitors are just as favorable if the solderable overlays of their electrodes are formed by electroplating of nickel, as when they are created by electroless nickel plating. TABLE 3 Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 49 ........... ........... ........... 53 1.48 Good 0.9 50 0.01 ........... ........... 55 1.30 Good 1.3 51 5.00 ........... ........... 62 0.88 Excellent 2.4 52 10.00 ........... ........... 55 1.34 Good 1.3 53 ........... 0.01 ........... 54 1.39 Good 1.2 54 ........... 5.00 ........... 60 0.98 Excellent 1.6 55 ........... 15.00 ........... 56 1.34 Good 1.2 56 0.01 0.01 ........... 54 1.33 Good 1.3 57 0.01 14.99 ........... 54 1.37 Good 1.2 58 10.00 0.01 ........... 55 1.36 Good 1.2 TABLE 3 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 59 0.01 ........... CdO, 0.01 55 1.30 Good 1.2 60 0.01 ........... CdO, 5.00 56 1.33 Good 1.2 61 10.00 ........... CdO, 5.00 55 1.37 Good 1.3 62 0.01 ........... Pb3O4, 0.01 56 1.28 Good 1.1 63 0.01 ........... Pb3O4, 5.00 56 1.34 Good 1.2 64 10.00 ........... Pb3O4, 5.00 56 1.36 Good 1.1 65 0.01 ........... Bi2O3, 0.01 56 1.31 Good 1.2 66 0.01 ........... Bi2O3, 5.00 55 1.34 Good 1.3 67 10.00 ........... Bi2O3, 5.00 55 1.38 Good 1.1 TABLE 3 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 68 ........... 0.01 Pr6O11, 0.01 55 1.34 Good 1.2 69 ........... 0.01 Pr6O11, 5.00 55 1.39 Good 1.2 70 ........... 15.00 Pr6O11, 5.00 54 1.39 Good 1.1 71 ........... 0.01 CuO, 0.01 55 1.35 Good 1.2 72 ........... 0.01 CuO, 5.00 55 1.37 Good 1.3 73 ........... 15.00 CuO, 5.00 54 1.39 Good 1.1 74 ........... 0.01 CdO, 0.01 55 1.35 Good 1.2 75 ........... 0.01 CdO, 5.00 56 1.33 Good 1.2 76 ........... 15.00 CdO, 5.00 55 1.36 Good 1.1 TABLE 3 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 77 ........... ........... Pb3O4, 0.01 54 1.35 Good 1.1 78 ........... ........... Pb3O4, 0.50 59 0.98 Good 2.0 79 ........... ........... Pb3O4, 10.00 54 1.34 Good 1.2 80 ........... ........... Bi2O3, 0.01 53 1.36 Good 1.1 81 ........... ........... Bi2O3, 0.50 59 0.99 Good 1.9 82 ........... ........... Bi2O3, 10.00 54 1.36 Good 1.2 83 ........... ........... Pr6O11, 0.01 55 1.35 Good 1.2 84 ........... ........... Pr6O11, 0.50 58 1.01 Good 2.0 85 ........... ........... Pr6O11, 10.00 54 1.35 Good 1.2 TABLE 4 Zinc paste composition Capacitor properties Organometallic Glass frits, compounds, Dielectric weight part weight part Metal oxide Capaci- loss Solder- Tensile in use and tance, tangent, ability strength, Examples A B C D weight part nF kg x 10-2 86 1.0 ... 1.0 ... CuO, 1.0 64 0.58 Excellent 2.1 87 1.0 ... 1.0 ... Pr6O11, 1.0 63 0,62 Excellent 2.0 88 1.0 1.0 1.0 ... ........... 64 0.59 Excellent 2.2 89 1.0 1.0 ... 1.0 ........... 64 0,59 Good 2.3 90 1.0 ... 1.0 1.0 ........... 63 0,62 Excellent 2.1 91 1.0 1.0 1.0 ... CdO, 1.0 65 0,53 Excellent 2.4 92 1.0 1.0 ... 1.0 Bi2O3, 1.0 64 0.57 Excellent 2.5 93 1.0 .. 1.0 1.0 Pb3O4, 1.0 64 0,57 Excellent 2.e 94 ... 1.0 1.0 1.0 CuO, 1.0 65 0.55 Excellent 2.5 95 1.0 1.0 1.0 1.0 Pr6O11, 1.0 64 0.58 Excellent 2.3 96 1.0 1.0 1.0 1.0 ........... 64 0.58 Excellent 2.2 Examples 97-144 The purpose of these Examples was to ascertain the results of the fabrication of the solder able overlays of capacitor electrodes by electroless copper plating. Thus 48 zinc pastes of Examples 97-144 were prepared by use of the same zinc powder, glass frits, organotitanium compounds, metal oxides, and vehicle as in Examples 1-48, in various combinations and proportions set forth in Tables 5 and 6, and through the same procedure as in Examples 1-48. These zinc pastes were processed into electroconductive base layers on SrTiO3 ceramic discs, as in Figure 2, also through the same procedure as in Examples 1-48. The thus produced articles were then treated with a 10% by weight aqueous solution of sodium hydroxide (NaOH). For the electroless copper plating of solderable overlays the cleaned articles were dipped for 10 minutes in a plating bath containing 35 g/l of copper sulfate (Cu2S04.5H20), 70 g/l of KNaC4H4O6.2H2O, 49 g/l of NaOH, and 160 ml/l of a 37% aqueous solution of formaldehyde (formalin). The temperature of the copper plating bath was 400 C., and the articles were introduced into this bath at a rate of two per milliliter. The plated articles were rinsed with water, thereby completing the plating of solderable overlays of copper on the zinc base layers. The capacitance, dielectric loss tangent, solderability, and tensile strength of the completed capacitors were measured by the same methods as in Examples 1-48. Tables 5 and 6 give the results, proving that the properties of the capacitors having the solderable overlays formed by electroless copper plating are just as favorable as those of the capacitors of Examples 1-48 and 49-96. TABLE 5 Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 97 ............ ........... ........... 54 1.47 Good 1.1 98 0.01 ............ ............ 55 1.26 Excellent 1.3 99 5.00 ............ ............ 61 0.79 Excellent 2.4 100 10.00 ........... ........... 56 1.31 Good 1.4 101 ........... 0.01 ........... 55 1.34 Excellent 1.4 102 ........... 5.00 ........... 61 0.89 Excellent 2.0 103 ........... 15.00 ........... 56 1.26 Good 1.4 104 0.01 0.01 ........... 55 1.27 Excellent 1.6 105 0.01 14.99 ........... 55 1.29 Good 1.3 106 10.00 0.01 ........... 54 1.26 Good 1.3 TABLE 5 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 107 0.01 ............ CuO, 0.01 55 1.36 Good 1.3 108 0.01 ............ CuO, 5.00 56 1.31 Good 1.3 109 10.00 ............ CuO, 5.00 56 1.38 Good 1.2 110 0.01 ............ Pb3O4, 0.01 56 1.29 Good 1.2 111 0.01 ............ Pb3O4, 5.00 56 1.34 Good 1.2 112 10.00 ............ Pb3O4, 5.00 55 1.35 Good 1.1 113 0.01 ............ CdO, 0.01 55 1.31 Good 1.3 114 0.01 ............ CdO, 5.00 55 1.33 Good 1.2 115 10.00 ............ CdO, 5.00 56 1.39 Good 1.2 TABLE 5 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 116 ........... 0.01 Bi2O3, 0.01 56 1.29 Good 1.2 117 ........... 0.01 Bi2O3, 5.00 56 1.35 Good 1.3 118 ........... 15.00 Bi2O3 5.00 55 1.36 Good 1.2 119 ........... 0.01 Pr6O11, 0.01 56 1.21 Good 1.3 120 ........... 0.01 Pr6O11, 5.00 55 1.36 Good 1.1 121 ........... 15.00 Pr6O11, 5.00 54 1.38 Good 1.2 122 ........... 0.01 CuO, 0.01 55 1.36 Good 1.2 123 ........... 0.01 CuO, 5.00 56 1.37 Good 1.3 124 ........... 15.00 CuO, 5.00 55 1.40 Good 1.1 Zinc paste composition Capacitor properties Organometallic Dielectric Glass frit compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 125 ........... ........... CdO, 0.01 54 1.36 Good 1.2 126 ........... ........... CdO, 0.50 58 0,92 Excellent 2.0 127 ........... ........... CdO, 10.00 55 1.37 Good 1.2 128 ........... ........... Pb3O4, 0.01 54 1.35 Good 1.2 129 ........... ........... Pb3O4, 0.50 59 0.96 Excellent 2.1 130 ........... ........... Pb3O4, 10.00 54 1.36 Good 1.3 131 ........... ........... Bi2O3, 0.01 54 1.35 Good 1.1 132 ........... ........... Bi2O3, 0,50 58 0.98 Excellent 2.2 133 ........... ........... Bi2O3, 10.00 54 1.37 Good 1.3 TABLE 6 Zinc paste composition Capacitor propertiesOrgano Organometallic Glase frits, compounds, Dielectric weight part weight part Metal oxide Capaci- loss Solder- Tensile in use and tance, tangent, ability strength, Examples A B C D weight part nF kg x 10-2 134 1.0 ... 1.0 ... CdO, 1.0 63 0.61 Excellent 2.2 135 1.0 ... 1.0 ... Bi2O3, 1.0 64 0.58 Excellent 2.3 136 1.0 1.0 1.0 ... ........... 64 0.59 Good 2.3 137 1.0 1.0 ... 1.0 ........... 63 0.62 Excellent 2.1 138 1.0 ... 1.0 1.0 ........... 64 0.63 Excellent 2.1 139 1.0 1.0 1.0 ... Pb3O4, 1.0 65 0.56 Excellent 2.2 140 1.0 1.0 ... 1.0 CuO, 1.0 64 0.56 Excellent 2.3 141 1.0 ... 1.0 1.0 Pr6O11, 1.0 64 0.58 Excellent 2.2 142 ... 1.0 1.0 1.0 CdO, 1.0 65 0.54 Excellent 2.5 143 1.0 1.0 1.0 1.0 Bi2O3, 1.0 64 0.56 Excellent 2.4 144 1.0 1.0 1.0 1.0 ........... 64 0.57 Excellent 2.3 Examples 145-192 The electroplating of copper was tried as another possible method of creating solderable overlays on the zinc base layers of ceramic capacitors. As set forth in Tables 7 and 8, 48 different zinc pastes of Examples 145-192 were prepared by use of the same zinc powder, glass frits, organotitanium compounds, metal oxides, and vehicle as in Examples 1-48, in various combinations and proportions, and through the same procedure as in Examples 1-48. By use of these zinc pastes the base layers on SrTiO3 ceramic discs were fabricated as in Figure 2 also through the same procedure as in Examples 1-48. These articles were subsequently treated with a 10% by weight aqueous solution of NaOH. For the electroplating of copper on the zinc base layers formed as above on the ceramic discs, there was used an electroplating bath containing 65 g/l of copper pyrophosphate (Cu2P207.3H20), 25 g/l of copper particles, 250 g/l of potassium pyrophosphate (K4P207), 2 ml/l of ammonia water, and 20 g/l of potassium nitrate (KN03). At a temperature of 600 C. and a current density of 2 A/dm , the cleaned articles were barrel plated with copper for 10 minutes. Then the articles were rinsed with water. The thus completed capacitors with the Zn-Cu electrodes were tested as to capacitance, dielectric loss tangent, solderability, and tensile strength by the same methods as in Examples 1-48. As represented in Tables 7 and 8, the results proved to be as favorable as those with the capacitors of the preceding Examples. TABLE 7 Zinc paste composition Capacitor properties Organometallic Dielectric Glase frits, compound Metal oxide Cpaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 145 ........... ........... ........... 53 1.48 Good 1.0 146 0.01 ........... ........... 55 1.31 Good 1.2 147 5.00 ........... ........... 62 0.84 Good 2.1 148 15.00 ........... ........... 56 1.31 Excellent 1.3 149 ........... 0.01 ........... 54 1.36 Good 1.3 150 ........... 5.00 ........... 60 0.92 Excellent 1.9 151 ........... 15.00 ........... 55 1.30 Excellent 1.3 152 0.01 0.01 ........... 55 1.31 Good 1.4 153 0.01 14.99 ........... 54 1.35 Good 1.2 154 10.00 0.01 ........... 55 1.36 Good 1.3 TABLE 7 - Continued Zinc paste composition Capacitor properties Organometallic Dielectric Glase frits, compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 155 0.01 ........... Pb3O4, 0.01 56 1.26 Good 1.2 156 0.01 ........... Pb3O4, 5.00 57 1.32 Good 1.3 157 10.00 ........... Pb3O4, 5.00 56 1.33 Good 1.2 158 0.01 ........... Bi2O3, 0.01 55 1.30 Good 1.2 159 0.01 ........... Bi2O3, 5.00 55 1.34 Good 1.3 160 10.00 ........... Bi2O3, 5.00 54 1.29 Good 1.2 161 0.01 ........... Pr6O11, 0.01 55 1.31 Good 1.2 162 0.01 ........... Pr6O11, 5.00 55 1.40 Good 1.4 163 10.00 ........... Pr6O11, 5.00 54 1.36 Good 1.2 TABLE 7 - Continued Zinc paste composition Capacitor properties Organometallic Dielctric Glase frits, compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 164 ........... 0.01 CuO, 0.01 55 1.35 Good 1.3 165 ........... 0.01 CuO, 5.00 55 1.36 Good 1.3 166 ........... 15.00 CuO, 5.00 55 1.39 Good 1.2 167 ........... 0.01 CdO, 0.01 55 1.30 Good 1.2 168 ........... 0.01 CdO, 5.00 56 1.31 Good 1.3 169 ........... 15.00 CdO, 5.00 55 1.35 Good 1.2 170 ........... 0.01 Pb3O4, 0.01 54 1.39 Good 1.3 171 ........... 0.01 Pb3O4, 5.00 55 1.36 Good 1.3 172 ........... 15.00 Pb3O4, 5.00 54 1.38 Good 1.2 TABLE 7 - Continued Zinc paste composition Capacitor propertiesOrgano Organometallic Dielectric Glase frits, compound Metal oxide Capaci- loss Solder- Tensile A, C, in use and tance, tangent, ability strength, Examples weight part weight part weight part nF kg x 10-2 173 ........... ........... Bi2O3, 0.01 53 1.34 Good 1.1 174 ........... ........... Bi2O3, 0.50 59 0.98 Excellent 2.0 175 ........... ........... Bi2O3, 10.00 54 1.36 Excellent 1.2 176 ........... ........... Pr6O11, 0.01 55 1.37 Good 1.2 177 ........... ........... Pr6O11, 0.50 59 0.99 Excellent 1.9 178 ........... ........... Pr6O11, 10.00 54 1.35 Excellent 1.2 179 ........... ........... CuO, 0.01 54 1.37 Good 1.1 180 ........... ........... CuO, 0.50 60 0.95 Excellent 2.2 181 ........... ........... CuO, 10.00 55 1.36 Excellent 1.2 TABLE 8 Zinc paste composition Capacitor propertiesOrgano Organometallic Glase frits, compounds, Dielectric weight part weight part Metal oxide Capaci- loss Solder- Tensile in use and tance, tangent, ability strength, Examples A B C D weight part nF kg x 10-2 182 1.0 ... 1.0 ... Pb3O4, 1.0 64 0.59 Excellent 2.2 183 1.0 ... 1.0 ... CuO, 1.0 64 0.58 Excellent 2.2 184 1.0 1.0 1.0 ... ........... 65 0.54 Excellent 2.3 185 1.0 1.0 ... 1.0 ........... 64 0.58 Excellent 2.4 186 1.0 ... 1.0 1.0 ........... 63 0.62 Excellent 2.1 187 1.0 1.0 1.0 ... Pr6O11, 1.0 64 0.57 Good 2.3 188 1.0 1.0 ... 1.0 CdO, 1.0 64 0.58 Excellent 2.3 189 1.0 ... 1.0 1.0 Bi2O3, 1.0 65 0.55 Excellent 2.5 190 ... 1.0 1.0 1.0 Pb3O4, 1.0 64 0.59 Excellent 2.3 191 1.0 1.0 1.0 1.0 CuO, 1.0 64 0.59 Excellent 2.3 192 1.0 1.0 1.0 1.0 ........... 63 0.63 Excellent 2.1 Additional experimentation in conjunction with the method of this invention has led to the following findings: 1. Zinc powder constituting the principal ingredient of the zinc paste for use with the inventive method should, for the best results, be of spherical particles with an average size ranging from 0.1 to 30.0 microns. 2. Added to zinc powder in a proportion not less than 0.01 part by weight, with respect to 100 parts by weight of the zinc powder, one or more of glass frits, organometallic compounds, and metal oxides (other than the glass frit ingredients) function as inorganic binder and zinc oxidation inhibitor, as has been explained in connection with Figure 1. Should the proportion of the selected additive or additives fall short of 0.01 part by weight, it would become difficult to uniformly disperse the additive or additives throughout the zinc paste, resulting in the fluctuations of the properties of the ceramic components having their electrodes or conductors made therefrom, on mass production. If the proportion of the additive or additives were more than about 20 parts by weight, on the other hand, then the electrodes made from the resulting zinc paste would offer too much electrical resistance. The dielectric loss tangent of the capacitors incorporating such electrodes would also become too high. 3. If a glass frit and an organotitanium compound are both to be added to zinc powder, the proportion of the glass frit should preferably be in the range of 0.01-10.00 parts by weight, and the proportion of the organotitanium compound in the range of 0.01-14.99 parts by weight, with respect to 100 parts by weight of the zinc powder. If a glass frit, an organotitanium compound and X metal oxide are all to be added to zinc powder, the proportion of the glass frit should preferably be in the range of 0.1-10.00 parts by weight, the proportion of the organotitanium compound in the range of 0.01-14.99 parts by weight, and the proportion of the metal oxide in the range of 0.01-5.00 parts by weight, with respect to 100 parts by weight of the zinc powder. 4. Preferred organotitanium compounds suitable for use in the zinc paste are, in addition to those employed in the Examples disclosed herein, tetrabutoxytitanium, Ti(O-C4H9)4, 4 9 4' di-n-butoxydibenzyltitanium, Ti(n-C4Hg)2(CH2C6H5)2, di-n butoxybistriethanolaminatetitanium, Ti(O-nC4H9)2(0C2H44 (C2H4OH)2) 2' and dihydroxybislactatetitanium, Ti(OH)2(0CH (CH3)COOH)2. More broadly, the invention allows the use of any organotitanium compound which, when the zinc paste is fired in the temperature range of about 5000 to 9000 C., will decompose to provide a titanium oxide. Such adoptable organotitanium compounds can be of either powder or liquid form. In the use of an organotitanium compound or compounds in powder form the particle size should not exceed 30 microns for the best results. If any selected organotitanium compound is used in the form of a solution, with use of a suitable solvent, then the proportion of the compound with respect to the solvent should range from 0.01 to 15.00 parts by weight. In this case, moreover, the solvent of the vehicle for pasting the mixture of zinc powder and the organotitanium compound may be decreased by an amount corresponding to that of the solvent in the organotitanium compound solution. 5. Other organometallic compounds lend themselves for use as additives as well. Examples are organotin compounds such as stannoacetate, Sn(CH3C00)2, and stannous oxalate, SnC204; organozirconium compounds such as (n-C4H90)4Zr and (C2H50)Zr; organogermanium compounds such as (C2H5)2Ge(OC2H5)2 and (C2H5)3GeOGe(C2H5)3; organosilicon compounds such as Si(CH3C00)4 and (C2H5)2SioC2H5; organolead compounds such as Pb(CH3C0O)4; organopraseodymium compounds such as Pr2(C2H4 and and organobismuch compounds such as BiC6H5O7. Any of these organometallic compounds will provide the desired results if used in an amount ranging from 0.01 to 15.00 parts by weight with respect to 100 parts by weight of zinc powder. In fact the invention allows the use of any such compound that will function as inorganic binder or oxidation inhibitor or both when the zinc powder admixed therewith and with a vehicle is baked at a temperature intermediate the softening and boiling points of zinc. 6. A variety of glass frits other than those used in the foregoing Examples can be added to zinc powder to obtain similar results. Generally, the softening points of such glass frits should be in the range of 4000 to 8000 C. Examples are a PbO-B203 glass frit with a softening point of 4300 C., a ZnO B203-SiO2 glass frit with a softening point of 6200 C., and a myriad of other known ones composed of any two or more of such substances as Pub304, PbO, BaO, SiO2, B203, ZnO, ZrO2, CaCO3, Al203, and Bi2O3. Here again the invention permits the use of any such glass frit that will perform the function of inorganic binder and/or oxidation inhibitor when the zinc paste containing the frit is baked in the specified temperature range. 7. The proportion of a glass frit or frits in use should be in the range of 0.01 to 10.00 parts by weight with respect to 100 parts by weight of the zinc powder in order to provide electrodes satisfying the above established criteria of properties. Should the proportion of the glass frit or frits exceed 10 parts by weight, the electrodes made from the resulting paste would offer too much electrical resistance, and in the case of capacitors the dielectric loss tangent would become higher than 1.5 x 10 . If the glass frit content of the zinc paste were less than 0.01 part by weight, on the other hand, then it would not function as inorganic binder or oxidation inhibitor. Also, since it would become difficult to uniformly disperse such a small amount of the glass frit or firts throughout the zinc paste, the properties of the electronic ceramic components mass-produced by use of the zinc paste would fluctuate from component to component. 8. As metal oxides for use as additives the powders of the above enumerated Pb304 Bi203, Pr6011, CuO, and CdO, with an average particle size ranging from 0.1 to 15.00 microns, are recommended. Any of these metal oxide powders may be used in an amount ranging from 0.01 to 10.00 parts by weight with respect to 100 parts by weight of zinc powder. The metal oxide powder will then also function as inorganic binder and oxidation inhibitor. If used in an amount less less than 0.01 part by weight, it would hardly perform the intended functions. Also, by reason of the difficulty of its uniform mingling with zinc powder, the properties of the resulting electronic ceramic components would fluctuate on mass production. Should the metal oxide content of the zinc paste exceed 10 parts by weight, on the other hand, the resulting electrodes would have too much electrical resistance, and ceramic capacitors having such electrodes would have a dielectric loss tangent of over 1.5 x 10 9. The combined use of a plurality of metal oxides as additives is possible. Two or more of powdered metal oxides selected from among Pb304, Bi203, Pr6011, CuO, and CdO can conjointly function as inorganic binder and oxidation inhibitor, provided that their total proportion relative to the zinc powder is in the range of 0.01-10.00 parts by weight. 10. Additional examples of additives include litharge (PbO), lead dioxide (PbO2), red copper oxide (Cu2O), and the hydroxides, carbonates, oxalates and peroxides of various metallic elements. The use of these additives result in particu lar in the improvement of tensile strength. In short the zinc paste for use in the practice of the inventive method may contain any additive that will function as inorganic binder and/or oxidation inhibitor or retarder when the paste is baked in the required temperature range. 11. A preferred example of the vehicle for pasting zinc powder, with or without one or more of the additives set forth hereinbefore, is alpha-terpineol containing from two to 20% by weight ethylcellulose (organic binder). Nitrocellulose or polyvinyl alcohol may be added instead of ethylcellulose to alpha-terpineol. Further, in lieu of alpha-terpineol, there may be employed butyl "Carbitol" (trademark for diethylene glycol mono-n-butyl ether), butyl "Carbitol" acetate (trademark for diethylene glycol monon-butyl ether acetate), or dioctyl phthalate. Whichever substance is employed, the vehicle will evaporate when the zinc paste is baked on ceramic bodies, and so will be substantially absent from the completed electrodes. Thus a wide variety of known organic vehicles lend themselves for use as a pasting agent within the scope of the invention. The proportion of any selected vehicle should normally range from 10 to 50%, preferably from 15 to 25%, and most desirably from 19 to 21%, of the weight of the zinc powder or, if an additive or additives are used, of the combined weight of the zinc powder and the additive or additives. 12. While the baking temperature of the zinc paste can be anywhere between the melting and boiling points of zinc as aforesaid, a preferred temperature range is from 500 to 9000 C. Should the baking temperature be less than the melting point of zinc, the zinc particles would not be properly fused to each other, resulting in unduly high electrical resistance and poor tensile strength. If the zinc paste were baked at temperatures in excess of the boiling point of zinc, on the other hand, then the zinc particles would undergo oxidation to such an extent as to make the electrical resistance of the resulting electrodes inordinately high. 13. The baking time of the zinc paste can range from one minute to two hours, preferably from 10 to 50 minutes, depending upon the baking temperature. Any shorter baking time would result in very high electrical resistance of the resulting electrodes and in their poor adhesion to the ceramic bodies, while a longer baking time would also result in excessively high electrical resistance, for the reasons mentioned in connection with too low and too high baking temperatures. 12. The method of this invention finds application to the fabrication of the electrodes or conductors of a great variety of electronic ceramic components other than SrTiO3 ceramic capacitors disclosed herein. Examples are titanium dioxide ceramic capacitors and varistors, and barium titanate ceramic capacitors, thermistors and piezoelectric elements.

Claims: Claims: 1. A method of forming electrodes (34) on ceramic bodies (24) to provide electronic components (32), comprising the steps of.coating an electroconductive paste on desired surfaces (26, 28) of each ceramic body (24), and baking the coatings of the electroconductive paste, characterized in that the electroconductive paste is composed principally of zinc powder, that the coatings are baked at a temperature ranging from the melting point to boiling point of zinc, thereby forming electroconductive base layers (22) on the ceramic body, and that a solderable overlay (30) is formed on each base layer by plating a more solderable metal thereon. 2. A method of forming electrodes on ceramic bodies as claimed in claim 1, characterized in that the electroconductive paste is composed of zinc powder and a vehicle. 3. A method of forming electrodes on ceramic bodies as claimed in claim 2, characterized in that the electroconductive paste further comprises a glass frit. 4. A method of forming electrodes on ceramic bodies as claimed in claim 2 or 3, characterized in that the electroconductive paste further comprises a metal oxide. 5. A method of forming electrodes on ceramic bodies as claimed in claim 2, 3 or 4, characterized in that the electroconductive paste further comprises an organometallic compound. 6. A method of forming electrodes on ceramic bodies as claimed in any of the preceding claims, characterized in that the coatings of the electroconductive paste are baked in a temperature range of 5000 to 9000 C. and in atmosphere. 7. A method of forming electrodes on ceramic bodies as claimed in any of the preceding claims, characterized in that the more solderable metal is nickel. 8. A method of forming electrodes on ceramic bodies as claimed in any of the preceding claims, characterized in that the more solderable metal is copper. 9. A method of forming electrodes on ceramic bodies as claimed in claim 7 or 8, characterized in that the solderable overlays (30) are formed by electroless plating. 10. A method of forming electrodes on ceramic bodies as claimed in claim 7 or 8, characterized in that the solderable overlays (30) are formed by electroplating.

Inventors: KAZUO, SASAZAWA, NOBUTATSU, YAMAOKA
Applicants: TAIYO YUDEN CO., LTD.
Application year: 1982
Main classification: C04B41
IPC codes: H01G4, C04B41, H01C7, H01B1, H01L41, H01C17