METHOD AND APPARATUS FOR DEPOSITION OF FLUID AND GASEOUS MEDIA ON SUBSTRATES FOR THEIR TRANSPORT

Abstract: Method and apparatus (10) for deposition of fluid and gaseous media on substrates (18), comprising a cabin (32), in which series of segments (34, 36, 38...68) are located aside a central passage (80, 96). Media, flowing through apertures between these segments towards and along substrates, passing through the passage, create micro-sized cushions (20, 22) aside such substrates for floating, transport and processing thereof.

Description: / METHODANDAPPARATUSFORDEPOSITIONOFFLUIDANDGASEOUS : MEDIAONSUBSTRATESFORTHEIRTRANSPORT The invention relates to a method and apparatus to apply a film of fluid medium on a surface. Thereby use is made of submicro-filtered ga¬ seous environment for this surface during the applying of such a film. The substrates, processed in that ωay, can be used in the micro- 5 electronica ωith the processing of silicon ωafers, and the like. In the Dutch Patent Application No. 8 101 440 of the Applicant an appa ratus is disclosed for the applying of fluid medium an a substrate, where¬ by a guide mail has been used, along which the surface of the substrate to be processed is displaceable under direct contact with the mall, before in 10 the process section medium is fed to this substrate. Thereby under vacuum force such substrate is urged against this ωall. By extending the outlets of the media towards near the extension of this guide wall a micro passage B is obtained between the separation walls of such outlets and the substrate in ωhich passage media can flow along this substrate to the discharge 15 channel. The disadvantages of the apparatus with guide walls for the substrates are the following: 1. During the displacement of the substrate under vacuum force along such wall submicro particles can be removed from this substrate and as contami- 20 nation affect the applied coating. 2. Via vacuum channels, positioned in such guide ωall, coating or other medium can be suctioπed on and seal off these channels. 3. After passing of the coating supply channel, the substrate can again take its original shape, with due to deformation thereof the touching of 25 the passage wall of the cabin. 4. The suction forces can be too small, with irregularities in width of the passage and consequently variations in supply and discharge of the media. 5. There is no supply possible of high pressurized media to the substrate. 6. Variation in thickness of the substrate can cause a damage thereof. 30 7. After the applying of coating, the coated substrate surface may not be touched. With the apparatus and method according to the invention these short¬ comings are eliminated. Thereby the creation and maintaining of such a media cushions in the passage aside the substrates, that at least the cεn- 35 tral section of such substrates cannot touch the wall of the supply- and discharge channels. The substrates, used in the micro-electronica, have very small vari|^r , - ι Consequently, the passage sections aside these substrates can be very nar row with a corresponding low consumption of media to maintain such cushion The very limited height of the media cushions enable a large force of pro cess media on the substrates with consequently a strong whirling action i these passage sections of the media. Due to this whirling action the pro¬ cessing is very intensive and so the length of processing is restricted. Also a continuous displacement of the substrates is possible during the processing. The consumption of fluids and gaseous medium per substrate processed is limited and completely allowable in view of the high cost price of such substrates. Further details regarding the apparatus and method follow from the description of the following Figures: Figure 1 is an enlarged perspective detail of the cabin, through which by means αf micro media cushions the substrates are transported without contact with the environment. Figure 2 is a vertical cross section of an apparatus, in which the cabin according to Figure 1 is used. Figure 3 is a horizontal cross section of the apparatus according to Figure 2. Figure 4 is " an enlarged detail of the cross section according to Fi¬ gure 2 at the inlet section thereof. Figure 5 is an enlarged detail of the cross section according to Figure 2 at the discharge section thereof. Figure 6 shows a segment package with supply— and discharge channels. Figure 7 is a partial cross section of the apparatus according to Figure 2, in ωhich over two segments supply channels for gaseous medium are shown. Figure 8 is a longitudinal cross section of the segment according to Figure 7. Figure 9 is an enlarged detail of the segment according to Figure 8. Figure 10 is a cross section of the apparatus according to Figure 2 with supply- and discharge channels for various media. Figure 11 is a side view of a segment, in which discharge channels for media are located. Figure 12 is a cross section over line 12-12 of the segment accor¬ ding to Figure 11. Figure 13 is a side view of a segment, in ωhich channels for fluid medium are positioned. Figure 14 is a cross section over line 14-14 of the segment according to Figure 13. Figure 15 is a detail of the apparatus according to Figure 2,whereby at one side the height of the medium cushion is greater than at the other side. Figure 16 is a detail of the apparatus according to Figure 2,whereby a sharply bended substrate section is shown. Figure 17 is a vertical cross section of an apparatus with on one side a smooth guide ωall for substrates to pass through. Figure 18 is a vertical longitudinal section of an apparatus, ωith on one side both guideωall sections and micro medium cushion sections. Figure 19 is a cross section of a modified apparatus,which at one side is provided ωith vacuum holders for the substrates,mounted on a turn table. Figure 20 is a cross section of a turn table section ωith a modified structure of the vacuum holder. Figure^l is a cross section of a station for cleaning or rinsing. Figure 22 is an enlarged cross section near the substrate of the station according to Figure 21. Figure 23 is an enlarged cross section of the inlet of the discharge channel of the station according to Figure 21. Figure 24 is a longitudinal cross section of a station for rinsing and folloωiπg drying of the substrate. Figure 25 is an enlarged detail of another embodiment of the station for cleaning of the substrates. Figure 26 is an enlarged cross section of the supply- and discharge channel of the station according to Figure 25. Figure 27 shows the outlet of a supply channel for fluid medium near the end of a substrate. Figure 28 shows the outlet of another channel for fluid medium. Figure 29 shows a detail of still another station for rinsing. Figure 30 is an enlarged cross section of a series channels of a dryer. Figure 31 is a cross section of a segment of an oven,in ωhich a heating element is located. Figure 32 is an enlarged cross section of an oven,in which segments according to Figure 31 are located. Figure 33 is an enlarged section of a series of channels of a station for the appliance of fluid for improved adhesion of coating. Figure 34 is a moc.ified structure of the station according to Figure 33 Figure 35 is the station '.ccordiπg to Fir.ure 33 ωith •= hi * h vacuum discharge channel placed in front of it. Figure 35 is an enlarged s-.ction of an outl=t of a supply channel for 5 co-ting. Figure 37 shoωs an enlarged section of trie channel of Figure 36. Figure 38 is *** section of a coating station,in ωhich tωo thin films of coating are successively applied on the substrate ωith in between drying. Figure 39 is an enlarged section of a coating a combi- Gnation of thinner and gaseous medium is fed over the applied film. Figure 40 shoωs a series of coating stations ωith in bεtωeεn drying. Figure 41 shoωs the filling up of a stεppεd substrate surface ωith a series of applied coatings. Figure 42 is a sectional vieω of part of the coating station according to Figure 40 together ωith a coating and oven station to apply a thin top coat on the thick under coat. Figure 43 schematically shoωs the appliance of such coatings. Figure 44 is a sectional vieω of a coating station, herεin a gaseous medium acts s a transport means for thinner in vapor phase. Figure 45 is an enlarged sectional vieω of the inlet of a discharge channel of the station according to Figure 44. Figure 46 is a longtudinal section of a coating station,ωhsrεiπ a film of water is fei over the applied coating. Figure 47 is an enlarged sectional view of the inlet of the discharge channel of the station according to Figure 45. Figure 48 is a sectional view of a station for the urπing of develop¬ ing ag * :nt over the substrate. Figurε 49 is a-, enlarged longtudinal section of the outlet of the sup¬ ply channels for the developing agent and the gaseous medium. Figure 50 is an enlarged sectional view of the outlet for develoer. Figure 51 shows the urging of developing agent in different positions of the substrate. Figure 52 is an enlarged sectional vi=w of a station for urging a do¬ sing agent over the substrare. Figurε 53 is a sectional view of a modified coping station. In Figurε 1 part of tha apparatus 10 is shoωn. Thεreby by εans of suc¬ cessive segments 12 ωith in bεtωεεn positioned narroω supply channεls 14 for mεdia and discharge channels for such media at both sides of the sub— OMP strate 1S micro medium cushions 20 and 22 are maintained. In that way no mechanical contact can taka place between at least sides 24 and 26 o f the substrates and the interior of the cabin. In Figures 2 and 3 again this apparatus is shoωn. Thereby the subst-3- tes 18 are transported from the supply station and via take-over station 30 to cabin 32.In this cabin the applying of media on these substrates ta¬ ke place,whereby the passing of the following stations: cleaning 34,drying 35,rinsing 38,drying and oven 40,adhesion ccat 42, drying 44,first coat 46,drying 48,oven 50,cooling 52,second coat 54, drying 5δ,oven 53,cooling 60,third coat 62, rying 64,oven 65 and cooling 68. There after the substrates are fed into thε take-over station 70 and brought to the discharge station 72. In the supply station by means of the vacuum block 74 of transporter 76 a substrate is taken from casse.te 78,transported to take-over station 30,brought toguide 82 and by means of transport medium 90 via the narrow passage 80 in the inlet section 84 is urged into the cabin,see Figure 4. In this section on both sides of passage 80 a number of segments 120 are positioned,ωherεin supply channεls .-.6 for transport medium 90 are lo¬ cated,see also Figure 7,and segments 210 ωith vacuum channεls 88,sεe Fi¬ gure 11. The processed substrate sntεrs the discharge section 94 of cabin 32, ωith again on both sides of passage 96 a number of segments 120 and 210 and in betωeεn series of supply channels 36 for medium 90 and vacuum chan¬ nels 88.Thereaftar the substrates are fed into the transport section98, see Figure 5. In view of production spεed and consumption of medium it is important, that in cabin 32 successive substrates are close together and contact each other.Therefore,the combination of forces on thε substrates are greater in the supply section then in discharge section. Furthermore it is important,that the transport spesd of the substrates remains the same.In view' of this transport section two guide structures 100 and 102 are positioned,of ωhich notches 104,successively beforε thε substrates positionεd,by mεans of mεchaπis a 106 transport these substra¬ tes over guide 10S to the take-over section 110. Thereafter vacuum block 112 of transport achanisme 114 transport such substrate to a free place 116 of cassεtt:. 118. The inlet- and discharge s-ctions of the cabin function as an air lock preventing air to enter the cabin. Such in combination ωith the substra¬ tes. In Figure 6 stations are shown for successive processing of the substrates,passing through. In Figure 7 a cross section is shown of cabin 10, ωith a side view of two identical segments 120, in which channels 122 for gaseous transport medium are located, see also Figures 8 and 9. This agent can preferably be nitrogen ωith fine filtering thereof. In the upper cabin wall for each segment two supply channels 126 and 128 are positionεd and ωhereby segment channels 130 and 132 correspond ωith these channels. These channels communicate ωith a relative wide main channel 134, in return communicating with a great number of extremely narrow branch channels 136. Spread channels 138 connect the branch channels with common ultra narrow channel 140 and so ωith the cabin passage. Channels 136 have a considerably higher flow resistance for the medi¬ um as passage sections 142 and 144 aside the substrate 18, see Figures 15 and 16. In that way each spread channel 138 is supplied with an almost constant flow of medium and such almost independant on thε widths of pas— sage sections 142 and 144. Therefore, if during the ' rocessing section 142 becomes larger than section 144, as is shown in Figures 15 and 16, in passage section 148 a considerably higher prεssurε will be εstablished than in passage section 146 and ultimately ωith a minimum width of this section this pressure will become thε high thrust pressure in spread chan- nel 134. In the other, ϊen wide passage section 146.the pressure will drop to a very low value. In that way a pressure difference of 2 bar or even more is possible between both passage sections 144 and 146 with such large thrusts on the substrate 18,that automatically this substrate will be brought tα a po¬ sition,whereby the force as a result of differences in pressure corres¬ pond with the local own forces in this substrate. All media work together to maintain both cushions 20aπd 22,wherεas the structurε of the sεgmεπt packagεs on both s-idεs of the passage is the 2 same. Therεby on εach cm substrata surface on both sides over 200 media thrusts can work on such substrate. In Figure 16 is shown, how due to increases in temperature a consi¬ derable bending of substrate 18 has taken place. An increased flow of warm medium through wide passage section 146 and a restricted flow of such medium through narrow section 1 4 will result in a larger temperature increase at side 150 than at side 152 ωith consequently a stretching of the substrate to a balance position. To prevent the wearing of the extremely narrow channels in segments 5 113 and 120, these channels are covered with a layer wear resistant mats- rial 154, see also Figure 9. The corresponding sections of plate 156 can also be provided ωith such layer, as can also be thε case with the ends 153 and 160. Packages 162 and 164 are enclosed positioned in upper cabin section 166 and lower cabin section 168, see also Figure 10. The segmεnts have polished surfaces with very narrow tolerances in their dimensions. In the side walls 170 and 172 of these cabin sections channels 178, 180,182 and 184 are located, whereas in the othεr wall sections aside chan nels 126 and 128 a channel 136 can be positioned. These channels extend over a certain length of thε cabin and can ssparately be connected with supply or discharge piping. In the cabin walls seal strips 188 are mounted aside these channels. In the side ωalls in grooves 174 circular seal strips 176 are postiαnεd. In mounted position of the cabin sections 190 and 192 of the sag-πeuts rest against mounting strips 194 and 196. Asidε these strips seal strips 200 and 202 are positionεd, ωhereas by mεaπs of bolts 204 thε uppεr and loωar cabin sections are connected ωith each other. Jithin the scope of the invention these strips 194 and 196 can have a considerable size and can extend over the whole length of the cabin. In Figure 11 segment 210 is shown, in ωhich a roomy vacuum channel 212 is located, see also Figure 12. The ends of this channel correspond ωith the channels 178 and 182, located in the cabin sections 165 and 168. This channel 212 is via a great number of branch channels 214 connected ωith common channel 216. In thesε channels narrow sεctions 218 are located to prevent a too easy discharge of medium via such a channel. The flow resistance of such channel is of great importance for the high vacuum chan¬ nels 334, see Figure 35 and 338, see Figure 38. Thereby in the passage sections betwεen thε substratε and thε sεgmεnt areas around such inlet of thε vacuum channel 214 a high vacuum can be established and maintained, whεreas near other inlets of this group of channels no substratε section has to bε presεnt. Such is periodically the case ωith almost circular sub¬ strates. In Figurε 13 segment 220 is shown, ωherein supply of fluid medium takes place.Thε main channel 222 is ωith its end 224 connected ωith channel 180 of the cabin sections 166 and 168.This channel is via a great number of extremely narrow channels 226 connected with seperatε sprεad channεls 228,which in turn are connected with the εxtremely narrow common channel 230,see also Figure 1 .Thereby a great number of small ωall sec- tions 232 serve to maintain a constant width of this channel230,if an adjacent segment urges against such segment.These channels may also be provided with a layer 234 of wear resistant material,as is also the case with the corrεsponding sεctions of the adjacent segment. Uithin the scope of the invention other profiles of the channels are possible and so also thε number of channels can be different. In Figure 17 cabiπ32'is shown,whereby only in the lower part 168'sεg- mεnts are positioned under the creation of various process stations.The upper part 166'of the cabin consists of a guide 236,along ωhich the sub¬ strates 18 are displaceable. In Figure 18 the cabin according to Figure 17 is shown again,however with .in the upper section 166'also a number αf process stations. As a result a banding of the substrates or other deformations due to too great differences in temperature are prevented. In Figure 19 the upper part of the cabin 23" is a turn table 238, on which a number of vacuum holders 240 are mounted to suction the substrates 18 thereon. In the lower part section 242 ^ is positioned for processing of substrates. By means of one or more setting devices 244 per vacuum holder thε distance between the corresponding substrate and the segments of the . lower cabin part can be changed. In Figure 20 vacuum holder 240' urges against the notches 248 of turn¬ table 238' and such under the force of spring 246. The from sections 242' flowing media urge the substratε upwardly against the force of spring 246 with the maintaining of the narrow process passage between the segments and the substrate. In Figure 21 part of the entrance 80 of the cabin and a cleaning sta¬ tion 34 is shown. The passage is created by two packages 256, in which several supply channels 86 for gaseous medium 90 and discharge channels 88 are positionεd. The gasεous medium, flowing through thε passage sεctions 142 and 144, maintain therewith cushions 258 and 260 and also contribute to the transport thrust, which is applied on the substrate in trεansport direction. Thereupon betωeεn successive segments 12 a great number of combina¬ tions of supply channels 262 for whether or not hot fluid cleaning medium 264, supply channels 266 for gaseous medium 268 and in between positioned discharge channels 270 are located, sεε also Figures 22 and 23. The under high pressure via channel 262 supplied cleaning agent 264 moves through the passage section 272 towards the vacuum channel 270 unde a hefty whirling and touching of the substrate surface 274, uith a remova 5 of contamination from this surface and transport therεof in the flow. The via channel 268 supplied gases floω in opposite direction via pas sage section 276 to vacuum channel 270 and thereby remove such cleaning media from the substrate and urgε it toωards this discharge channel. Afte passing of a great number of combinations all contamination is removed fr the substrate. In Figure 24 the substrate has enterεd the drying station 36, ωhich station consists of sεg ent packages 286, ωherεby a number of combinations of supply channels 278 far gaseous mεdium 280 and vacuum channels 282 are locatεd in. thεsε packages. Drying of the substrate 18 takes place by means of hot gases 280, streaming through the passage section 284 along such substrate. The segment package 286 can also be part of a rinsing section 38, whe¬ reby via channels 262 a stream of rinsing fluid 288, as for instance de- ionized water, alcohol or thinner is urged. In Figures 25 and 26 another arrangement of channεls 262', 266' and 270' for the cleaning station or the rinsing station is shown. Thereby the gases 268 flow via passage section toωards discharge channel 270' and whereby the via supply channel 262' supplied cleaning medium 264 or rin¬ sing medium 288 is urged into the whirling stream of gases. Within thε scope of thε iπvεntion othεr arrangements of channels are possiblε, as for instancε combinations of only supply channels for fluid medium and discharge channels. Thereby possibly only in the last part of such station thε usε of supply channεls for gasaous medium. In Figure 27 the end 292 of substrate 18 has just passed behind the oppositely located discharge channels 262 with the only limited coverage of side ωall 294 of this substrate with cleaning or rinsing agεnt 264/288. In Figure 28 the end 292 of the substrata has passed the oppositely located supply channels 266 for gaseous medium 268 and whereby such flows of gases debouch into passage 296, wherein a negative pressure is main- tained. Therεfrom such gases are suctionεd into not occupiεd discharge channεls. The cleaning medium 264 and rinsing medium 288 can also be urged to— ωard the substrate 18, in passage sections 304 and 306 due to heat transfe heating of the substrate takes place and thereupon via discharge channels 308 discharge of thesε gases occu rs. Thε oven can consist of a great nu — bεr of such combinations of channεls. The hεating of thε substrate occurs vsry gradually and at thε same timε on both sidεs with minimum differences in temperature. The gases can already be heated outside the cabin. However it is also possible, that part of such heating or all heating takes place in thε cabin. In Figurεs 31 and 32 in sεgmεnt 310 of insulating material an electric hεating element is positioned and ωherεby on two sidεs of this segmεπt sεctions 314 and 316 are glued. It is also possiblε, that such an εlεmaπt is located in a groovε of a metal segmεnt. The heat transfer to the substratε is very effective and very fast, bεcausε thε volumε of the substratε oftεn is vεry limitεd. Furthεrmorε, the warm gasεs hit all lεft over moisture on the substrate with fastest removal of it. Because the increase in temperature of the substrate takes place on two sides with no or allowable deformations of this substrate, the front section of the substrate can already have passed this αven, the mid sec¬ tion be located in thε oven, whereas the rear end of the substrate is still in the rinsing section, as is indicated in Figure 2. In that way the dimensions of thε apparatus 10 in transport direction are very limitεd and such also because of the limited length of the sta¬ tions. The cooling-off station 52,see Figure 32, consists of the same pack¬ ages as shown in station 36 according to Figure 24 and ωhereby gasεs, strεaming along the substrate, provide for a gradual, fast and local cool¬ ing off . In Figure 33 part of the adhesion promotor station 42 is shoωn. Via channel 318 supply of such fluid 320 takes place. This fluid thereby flαωs in thε passage section 328 toωards the discharge channel 324. Here also the removal from the substrate of thε excessive fluid by means of gaseous medium, supplied via channel 326 and urged trough passagε section 328 to vacuum channel 324. Whether or not such section can consist of a number of such combinations of channels. In Figure 34 another arrangemεnt of chaπnεls is shown, with succεs- sivεly supply channel 318' for the promotor, supply channel 326' for thε gaseous medium and the discharge channel 324'. Thereby thε width of the passage section 332 increasεsin the transport direction. To effectively apply such fluid on a profiled surface of the substra¬ te without the inclusion of gas remnants, it is possible to make uss of OR 11 the station 42", as shown in Figurε 35. Thereby repeatedly before the applying of fluid 320 via channel 318", by means of high vacuum channel 334 a very high vacuum is drawn in the passage section 336. Thε fluid is now able to fill up all steps in the substrate surface and ωhereby by mεans of a via channel 326" supplied ωarm gas 328 the rem val of removable fluid medium takas place and drying of the film fluid, left behind on the substrate can take place. Thereby it is possible, that such an additional channel 334 is also positioned behind channel 326 or 32 " to ωithdraω thinner, ωhich due to the high vacuum, is brought into vapor phase. In Figures 36,37 and 38 the first coat station 46 is shoωn.Thereby the combination of channels consists successivεly of: high vacuum channel 338, chan- * εl 340 for the supply of coating 342, dis¬ charge channel 344 and channel 346 for supply of ωhether or not ωarm gaseous medium -48. Thereupon possibly a high vacuum channel 338. In passage section 350 a high vacuum is drawn by high vacuum channel 338, with consequently in the steps 352 of the substrate there is no or almost no gaseous medium left behind. The via channel 340 supplied coa¬ ting 342 fills thesε stεps without inclusion of another medium, ωhich is of greatest importance for an ultimately regular film of coating. The coating fills also the total passage section 354 toωards the vacuum chan¬ nel 344. Gaseous medium 348, supplied through channel 346, flows in. opposite direction through passage section 356 towards this discharge channel un— der stripping off of the excessive coating from thε substratε surfacε 358 This stripping off of coating co-operates ωith the micro-meniscus effect of thε coating 345, ωhich as a column moves along the ωall section 360 of the discharge channel 344 and by means of the vacuum in this channel is drawn from the substrate and out of the passage section 354. Thereby this column of coating exercisεs a pulling cohesion force on the thin film of coating, left behind on the substrate. Dependent on the viscosity of the coating thε thickness various. With a very low viscosity of the coating also in the stεps a vary thin film of coating ωill be lεft behind, see Figure 37 . This coating station 46 is combined shoωn with the drying-, oven- and cooling-off stations 48, 50 and 52, following thereupon. The number of combinations of channels can vary to meet thε dεmands. By using warm gaseous medium, through which in particular a very thin film of coating is heated very fast, and by applying a high vacuum in the discharge channels with consequently a lowering of the boiling point of thε thinner in the coating, such thinner is evaporated out of the film coating very fast. As a result, an extremely fast drying of the coating layer occurs. In the second coating station 54 with identical vacuum—,supply- and 5 discharge channels the applying of a second coating layer takes place, whereafter again in the successive stations 56, 58 and 60 by means of gaseous medium drying, hardening and cooling-off of this second coating layer takes place. In Figurε 39 anothεr εmbodiment 46' of the coating station is shown, 10 wherεby through channel 362 a thinner 364 for the coating 342 in vapor phase or mist is urged towards thε strεam of gasεous εdium 348, flowing through passage-section 356* to the discharge channel 344'. This thinner helps to remove a thinned top coat from the coating layer, applied on the substrate. 15 In Figurε 40 the successive coating stations 46, 54, 62 and 366 are shown with repeatedly the following drying-, oven— and cooling-off sta¬ tions. It is possible to fill up the steps, located in the substrates, as is suhoω.n i■n cF-i-gures 4-1, 1 *-*' B, J C, * D, ' E. 20 In Figure 41 the step 368 is pτ£—treated and has arrived in a vacu- mized area. In Station 46 the applying of the first coating layer 370 has taken place, sea Figure 41 B, in station 54 the second layer 372, sεε Fi- gure 41 , in station 64 thε third layεr 374 on top of thε sεcond layεr, see Figure 41 , and in station 366 the fourth layer 376 on the third 25 layer, sεε Figure 41 . As a result, such a step is completely filled ωith coating and is an almost smooth surfacε of thε appliεd coating layer achiεved. In Figurε 42 the apparatus 10 is provided with the additional coating station 378, whereby on the fourth layer 376, see Figure 43 , an extremely 30 thin coating layer 380 is applied, seε Figure 43 • With the above described processing it is possible to apply a great number of coating layers on a substrate over a cabin length of 20-40 cm. Thereby the quality of thε combined coating layers can be much highεr as with thε εxisting apparatus, bεcause: 351. no contamination in thε coating; 2. no εxtreme escape of air or gasεs out of thε appliεd coating; and 3. a shortεr escapε distance for the vaporizεd thinner during the processing. In Figure 44 coating station 46" is shown, whereby the thinner as a mist or in vapor phase is brought in the gaseous medium 348. During the m ving of this thinner saturated medium over the applied coating, see also Figure 45, the top layer of this coating is thinned and can be removed near the inlet of the discharge channel 344", 5 Ih Figure 46 a coating station 46''' is shown, whereby through chann 382 water or othεr non thinning fluid is urgεd to the passage sεction 356 ' * ' and this fluid as an εxtrεmεly thin film 384 covεrs thε alrεady applied coating 342. By means of gaseous medium 348 such film is urged towards thε dischargε channεl 344'", see also Figurε 47. This film helps to remove coating from thε alrεady applied coating layer 386. Within thε scopε of the invention still other variations in the arraπ ge ent of channels in the coating station are possiblε. . In Figure 48 a station 388 is a part of the apparatus. Thereby a dεvεloping agent 392 is urged towards and ovεr the substratε 18. In this stations use is made of a number of similar or almost similar combination of channels. Such a combination consists of a high vacuum channel 338, supply channel 390 for the developing agent 392, two channels 394 and 396 for the supply of gaseous medium 398 and discharge channel 400. At the up¬ per side of the cabin similar combinations are located to urge developing- or other agεnt to the substrate. The combination of gases and devεloping agent flows through passagε sεction along thε substratε. Due to the vacumizεd steps 404 of the substra te thesε steps become totally fillεd ωith .this agent, whirling therein. The under high pressure suppliεd gases movε through passage sεction 406 ωith an accompanying strong whirling action and such in particular in thε steps 404. By means of a successivεly rεpeating of this processing a co pletε rεmoval of all rεmovablε coating from the substrate is achieved. In Figure 50 a detail of the outlet 408 of channεl 388 for the dεve- loping agεnt 390 is shown, whereby this agεnt under very high prεssurε and speed is urged toward thε substratε. In this αutlεt a narrow sεction 410 and a widεniπg 412 are located for faster removal of * coating from the steps 404. Because the passage for the substrates contains no moving ele επt, such passage may bε filled with thε media. In a following station sεction 414, sεε also Figure 48, a number of combinations of supply channels for gasεous medium 418 and vacuum channεls 420 removε such a cloud of εdia. In Figurε 51 such a mist of devεloping agent 390 and gasεs 398 in passgs sεction 422 is shoωn after passing of the supply channel 390 by the substrate. p In Figure 51 is shown, how such a cloud by means of gaseous medium 418 is urged towards the high vacuum channel 420. After the passing of such station the substratε moves through a rin- 5 sing station. In Figurε 52 thε station 424 of thε apparatus is shown, whεrεin dopant as fluid or gasεous medium is urged towards the substratε and such undεr an εxtrεmεly high prεssurs. Through channel 426 thε dopant 428 is urgεd towards this substrate, effects thε surfacε of thε substrate in passage 10 section 430 and is removed through discharge channel 432. Here again a preferred withdrawal of gasεs through a high vacuum channel bεfore thε procεssing. Furthεrmorε, via chanπεl 434 gasεous msdium 436 is suppliεd for rε oval of residue dopant 440 in passagε section 438 and such in particular from thε steps 442. 15 In the station such combination of channεls successively repεats. Furthermore, after channel 434 a high vacuum channel can be positionεd. In Figure 53 a modification 424' of this station is shown. Therεby in thε upper and lower cabin part thε repeated combinations of high vacuum channel 444, channel 426' for supply αf dopant 428, four channels 446, 20 448, 450 and 452 for gaseous medium 436 and a high vacuum channel 454. Thereby the dopant ωith a hefty whirling action is moving through this passagε section. On one sidε of the substratε other media can be supplied to the substrate. 25 As dopant for instance arsεnicum or phosphor can be used ωith exact volumes per second of processing. A transport system and the processes as above described can be used in conjunction ωith plasma εtching, magnetron sputtering and othεr com¬ plex procεssεs. 30 Furthermore, in the apparatus stations for pattern εxposurε and mεasurεmεnts can bε locatεd.

Claims: C I A I PI S 1. Method of transport and procεssing of substratεs in a passagε of apparatus, comprising in combination: a supply through at least one supply mouth aside said passage of at least one medium to said substratεs; a dischargε through at lεast one discharge mouth asidε said passage of at lεast onε medium from said passage; and by means of at least one of said media maintaining of a medium cushion in said passage betωeeπ at least said supply channεl and said substrate. 2. Method according to Claim 1, ωhεrein over at lεast part of said passage for said substrates medium cushions are maintained on both sides of said substrates between successive mouthes of supply channεls and said substrates. 3. Method according to Claim 2, ωherein in ' said cushions the resul- tant force of said mεdium on said substrate is such, that both flat sidεs of said substratεs rεmain frεε of contact ωith cabin walls around said mouthes, 4. Apparatus, embodying the method according to Claim-2, ωherein said apparatus includes a cabin ωith a passage for substrates, extending from inlεt to outlεt and ωhεrein over at lεast part ' of said passagε in trans¬ port direction on- both sides of said passage successive mouthes for supply and discharge of said media are positioned in packages of segments. 5. Apparatus according to Claim 4, ωherεin the structurε of said ca¬ bin is such, that said substrate can move in a straight line through said passage and at least part of said passage on both sidεs thεrεof is formεd by thε ends of a number of segments, successively placed asidε each other. 6. Apparatus according to Claim 5, ωherein in a number of said sag— mεnts in at least onε side ωall thereof recεssεs are positioned for at lεast one supply- or discharge channel for medium. 7. Apparatus according to Claim 5, wherein at least part of the sidε ωall of said channεl consists of a layεr of process rεsistant or hard ma¬ terial. 8. Apparatus according to Claim 6, wherεin in a number of said seg- mεnts all outhεs, positionεd thεrεin asidε εach othεr arε connεcted with a common main channεl through a number of branched channεls. 9. Mεthod according to Claim 3, ωherein the supply of medium to said passagε through said mouthεs is such, that said supply cannot be inter- - J-RE ruptεd by a passing substrate section. 10. Apparatus according to Claim 8, wherεin in said branched channels for at lεast media, acting to maintain said medium cushions, a flow res- trictor is incorporated. 11. Apparatus according to Claim 10, ωherein said flow restriction is larger than that of the passagε section asidε said substratε betωεen suc¬ cessive mouthεs of said supply- and dischargε chaππεls ωith an avεragε hεight of said passagε sεction. 12, Apparatus according to Claim 11, ωherεin on both sides of said passagε the arrangemεπt of mouthes for thε mεdia is at lεast almost thε same. 13, Method according to Claim 3, ωherein in said passage on one sidε of- said substratε inπεr coπnectεd mεdium cushions ωith a micro-hεight thεrεof arε maintained and on thε othεr sidε of said substratε inner conπεctεd " medium cushions are maintainεd ωith a grεatεr height thεrεof, 14, Apparatus according to one of foregoing Claims, ωhsrεin on at lεast onε side of said passage for substrates at lεast such a combination of channels is positioned, thata laterally uninterrupted flow of fluid mεdium can be urgεd toωards a passing substratε- and at least part of said fluid can be removed. 15. Apparatus according to Claim 14, wherεin said combination com¬ prises at least one supply channel and one dischargε channεl for said mεdium. 16. Apparatus according to Claim 15, ωhεrein said combination com— prises in addition a supply channel for gasεous mεdium and a discharge chaπnεl for said mεdium to crεate and maintain at lεast a cushion of ga¬ seous medium in said passage section aside said substratε. 17. Apparatus according to Claim 16, ωherεin said discharge channεl for fluid mεdium is also thε discharge channel for said gasεous mεdium. 18. Apparatus according to Claim 17, ωherεin said combination also comprisεs a high vacuum channel. 19. Method of thε apparatus according to Claim 18, ωhεrεin in a pas¬ sage sεction aside such substratε a high vacuum is εstablished and thεre- upon in an adjacεnt passagε sεction fluid mεdium is urgεd towards and along said substrate sεction. 20. Method of the apparatus according to Claim 17, ωherεin through a supply channεl fluid mεdium is urgεd toωards and along said substratε, on thε same momεnt through another supply channεl gasεous medium is urged toωards and along another substrate sεction and through a combined dischargε channel thε rε ovable part of both mεdia is withdrawn. 21. Apparatus according to Claim 18, whεrein in transport direction of said substrates thε arrangement of said channels is the following: high vacuum channel, supply channel for fluid medium, discharge channel for both fluid and gaseous medium and supply channel for gaseous medium. 22. Apparatus according to Claim 18, wherein in transport direction of said substrates the arrangemεnt of said channels is the following: supply channel for fluid medium, discharge channel for both fluid- and gaseous medium and supply channel for gasεous medium. 23. Apparatus according to Claim 21, wherein said combination com¬ prises a high vacuum channel, which in transport direction of the substra tes is positioned bεhind thε supply channεl for gaseous mεdium. 24. Apparatus according to Claim 18, ωhεrεin in transport dirεction of said substratεs thε arrangement αf said channels is the following: high vacuum channel, supply channel for gaseous medium, supply.channel for fluid medium and discharge channel for both fluid- and gaseous medium. 25. Apparatus according to Claim 18, wherεin in transport dirεction of said substratss thε arrangε εnt of said channels is such, that said dischargε channel for both fluid- and gaseous mεdium is a high vacuum channεl. 26. Apparatus according to one of foregoing Claims, wherεin its structure is such, that ωith the location of multiple succεssive combina¬ tions of channεls in transport dirεction of the substrates, betωeεn εach * of said succεssive combination of channels a segmεnt is positioπεd, of ωhich its εnd ωall extεnds farther into said passagε as the other seg- mεnts. 27. Apparatus according to onε of forεgoing Claims, ωherεin on tωo sides of said passagε for said substrates such arrangε εnts of channels arε locatεd, that by means of mεdia, suppliεd and dischargεd through said combinations, both a gaseous mεdium cushion bstωeεn thε corresponding segmεπt- and substratε sections is maintainεd and drying of said substra¬ tεs takes place. 28. Method of thε apparatus according to Claim 16, ωhεrεin, if a substrate section passes a number of said mouthes, positioned in lateral direction, a high vacuum is drawn over thε επtire width of said substratε sεction. 29. Apparatus, whεrεin at lεast one station for at lεast applying of mεdium on substrates is located and in said station a number of combinati¬ ons of channels according to at least one of the Claims 14 through 27 are positioned. 30., Apparatus according to one of foregoing Claims, ωhεrεin each seg- mεπt is provided ωith an επd ωall for thε εstablishing of said passagε for said substrates and on both εnds of said end ωall a support ωall is posi- tioned ωith a prεcisεly dεtεrminεd distance of said support ωalls to said end ωall in relation ωith the purpose of said segment. 31. Apparatus according to Claim 30, ωherεin said apparatus includεs at lεast one support, ωherεin said sεgmεnts arε successively packed ad¬ jacent each other in transport direction of said substratεs and εach of said support ωalls of said sεgmεnts rεsts upon a corrεsponding sεction of said support. 32. Apparatus according to Claim 31 , ωherein in the inside of said support a plurality of grooves arε positionεd, innεr coπnεcting a numbεr of channεls in said support for various mεdium ωith corrεspoπding εnds of chaπnεls, ' incorporatεd in said segment packages. 33. Apparatus according to one of foregoing Claims and including at least one of foregoing methods, ωherεin the supply station therεof con¬ sists of a narrow passage for substratεs ωith on two sides thεreof series of sεg επts, packεd in transport dirεction of said substratεs and contai- niπg a plurality of supply channels for gasεous mεdium and discharge channels in succession in said transport dirεction. 34. Apparatus according to Claim 33, whεrεiπ at lεast the first chaπnεl is a vacuum channel. 35. Mεthod of thε apparatus according to Claim 33, wherεin thε re- suiting forcε of said gasεous medium in said supply station is such, that a substratε, being totally in said passage or partly alrεady bεhind it, is displacεd therewith in transport direction of said substrates. 36. Apparatus according Claim 33, ωherein the dischargε station therε¬ of consists of a narroω passagε for substratεs ωith on two sidεs therεof sεries of segmεnts, packed in transport dirεction of said substratεs and containing a plurality of supply channεls for gasεous mεdium and discharge channεls in succεssion in said transport direction. 37. Apparatus according to Claim 36, wherein at lεast the last chan¬ nel is a vacuum channel. 38. Apparatus according to Claim 33, wherεin a cleaning station is locatεd, in ωhich packagεs of sεgmεnts are positioned on both sides of said passagε for urging clεaning agεnt tαωards and along substrates, pas¬ sing through. 39. Method of the apparatus according to Claim 38, ωherεin through succεssivε mouthes cleaning agent under high pressurε is urged toωards and along said substrates in a laterally unint-erruptεd strεam of agent over th entire- ωidth of said substrate, passing through. 40. Apparatus according to Claim 38, ωherein a rinsing station is lo- 5 cated, in ωhich packages of segments are positionεd on both sidεs of said passage for urging rinsing agent toωards and along substrates, passing through. 41. Method of the apparatus according to Claim 40, wherein through successive mouthes rinsing agent under high pressure is urged towards and along said substrates in a laterally uninterruptεd strεam over thε εntire width of said substratε, passing through. 42. Apparatus according to Claim 33, wherεin a coating station is lo¬ cated, in which on both sidεs of said passagε packages of segments are po- tionεd for urging media towards and along said substrates, passing through, and for a package on at least one side of said passage as process side said medium is an adhesion promoting agent. 43. Method of the apparatus according to Claim 42, whereby a stream of adhεsion promoting agεnt with an extrε εly low viscosity is urgεd to¬ wards and along said substrate in a laterally uniπterruptεd flow and by mεans of a suction forca of the dischargε channels together ωith an accom¬ panying meniscus effect and gasεous medium part of said promoting agεnt is rε ovεd and only a vary thin layer therεof remains on said substrate. 44. Method according to Claim 43, ωhεrein on thε othεr sidε of said substratε a strεam of thinning agεnt for said promoting agent is urged to- ωards and along said substrate and by means of thε suction forcε of thε dischargε chanπεls togεthεr ωith gasεous mεdium said thinning agent is at lεast almost εnti εly rεmovεd from said substrata. 45. Apparatus according to Claim 42, ωherein in transport direction of said substrates said station for applying αf adhesion promoting agent is followed by a drying station and thereafter such combination of both stations is repεatεd. 46. Method according to Claim 43, whεrein by means of high vacuum channels, in transport direction of said substratεs locatεd in front of said supply chanπεl-for adhesion promoting agent in thε passagε section asidε said substrate such a high vacuum is created and maintained, that almost no gaseous medium is lεft in stεps of thε surfacε of said substratε. 47. Apparatus according to onε of foregoing Claims, whεrεin a coating station is locatεd, in ωhich on both sidεs of said passagε packagεs of sεgmεnts arε positionεd for urging mεdium toωards and along said substratεs, passing through, and for a packagε on at least one side of said passage as process side said media in cαrporatεs a coating. 48. Method of thε apparatus according to Claim 47, wherein a flow of coating is urged toωards and along said substrate in a latεrally unintεr_ rupted floω and by mεans of a suction forcε of the discharge channsl to- gεthεr ωith an accompanying mεniscus εffεct and gasεous mεdium part of said coating is rεmovεd and only a thin layεr thεrεof rε ains on said substratε. 49. Methodaccording Claim 48, whεrεiπ on t he other sidε of said substratε a strεam of thinning agεnt for said coating is urgεd towards and along said substratε and by mεans of thε suction forcε of the discharge channels together with gasεous medium said thinning agεnt is at lεast al¬ most επtirεly rεmovεd from said substratε. 50. Apparatus according to Claim 47, whεrεin in transport dirεction of said substrates said station for applying of coating is followεd by a drying station and thεrεafter such combination of both stations is re- pεated. 51. Method according to Claim 48, whεrein by means of high vacuum channels, in transport dirεctiαn of said substrates locatεd in front of said supply channεl for coating in thε passage section asidε said substra¬ ta such a high vacuum is created and maintained, that almost no gaseous medium is lεft in steps of the surfacε of said substratε. 52. Mεthod of thε apparatus according to Claim 50, whεrein in suc¬ cessive stations on substrates, passing through, extremely thin layers of coating is appliεd and in drying stations, located in between said coa¬ ting stations drying of the appliεd coating takes place. 53. Method of Claim 52, ωherεin the supply and rεmαval of mεdia and thε nu bεr of coating stations is such, that ωith a micro-profilεd surfacε of said substratε after thε last applied layεr of coating thε surfacε of said substrate is almost flat. 54. Method of Claim 53, ωherεin in succεssive stations after thε applying of said first type of coating an end layer"of anothεr type of coating is appliεd on said combination of layers of said first coating. 55. lεthod according to Claim 48, ωhεrεin vaporized thinnεr or a mist of thinning particlεs is urgεd toωards and along said substratε, said thinnεr coπdεnsεs on thε applyεd layεr of coating and in that ωay thinning a thin top of said appliεd coating and by mεans of gaseous mεdium as a thin film is urgεd over said layεr toωards said combinεd dischargε channεl. 56. Apparatus according to Claim 47, ωherein an oven station is locatεd for hardening of the coating, appliεd on said substrate, in ωhich on tωo sidεs of said passagε packagεs of segments arε positioned for urgin hot gaseous mεdis toωard and along said substrates, passing through. 57. Apparatus according Claim 47, ωherεin a micro-ωavε oven is locate for hardening of said applied coating. 58. Method of thε apparatus according to Claim 56, ωherein on both sides of said passage via combinations of supply- and discharge channels hot gasεous medium is urged towards and along said substrates. 59. Apparatus according to one of Claims 56 or 57, whεrεin in trans— port direction of said substratεs after said oven station a cooling-off station is located and therein a numbεr of combinations of channεls accor¬ ding to Claim 29 arε positioned. ■ 60, Apparatus according to Claim 36, whεrεin a dεvεloping station is located, in which on two sides of said passagε packages of segmεnts are positioned ' for urging medium towards and along said substratεs, passing through, and therein on one side of said passage said medium is a dεvεlo¬ ping agεnt, 61 , Method of the apparatus according to Claim 60, whεrεin said dε¬ vεloping agεnt is urgεd undεr εxtrεmely high prεssurε towards said sub- strates, 62, Apparatus according to Claim 36, wherεin a plasma εtch station is locatεd, in which thε plasma sourcε is positionεd outside said cabin and said plasma in gasεous phasε is urgεd towards said substratεs, 63, Apparatus according to onε of foregoing Claims, wherεiπ the structure thereof is such, that therεin in a station coating atεrial is urgεd towards said substratε in particlεs, vapor or gaseous phasε. 64, Apparatus according Claim 63, whεrεin a procεss chamber is positi¬ oned bεtween at least tωo segments, 65, Apparatus according to one of foregoing Claims, comprising also: systεms for finε filtering of thε mεdia, sensors and systεms for control of transport spεεd of said substratεs, sεnsors for rεgulating, instrumεnts for measuring and systεms for thε rε-cycling of mεdia. OMPI

Inventors: BOK EDWARD, BOK, EDWARD
Applicants: BOK EDWARD, BOK, EDWARD
Application year: 1982
Main classification: H01L21
IPC codes: B65G51, G03F7, H01L21, H05K13