GAS LASER APPARATUS

Abstract: A gas laser apparatus is disclosed in which first and second holding members (12, 13) are provided at an end portion of a discharge tube (3), a reflecting mirror (11) is disposed between the holding members through sealing members (21A, 21B), and an absorbing groove (23) is provided in a peripheral portion (11A) of the reflecting mirror. When the holding members are pressed against each other by clamping means (22) to hold the reflecting mirror therebetween, the deformation of the reflecting mirror due to the above pressure is absorbed by the absorbing groove, and therefore no fine wrinkle is produced in the surface of the reflecting mirror. Accordingly, laser light reflected back from the reflecting mirror has not been subjected to diffused reflection. That is, the laser output can be made higher.

Description: GAS LASER APPARATUS The present invention relates to a laser apparatus provided with an improved reflecting mirror. In a general gas laser apparatus, a discharge tube is filled with a gas medium, for example, a mixed gas containing C02 gas, N2 gas, He gas and others, and electrodes, for example, a cathode and an anode are disposed within the discharge tube. When a d.c. voltage is applied between the cathode and anode, glow discharge is generated between these electrodes. At this time, population inversion is maintained in the gas medium by the glow discharge, and thus laser light is generated. The laser light travels back and forth between an output mirror and a reflecting mirror which are provided at opposite ends of the discharge tube, in such a manner that the spacing between these mirrors acts as a resonator, and leaves the discharge tube through a central portion of the output mirror. Thus, the output mirror and reflecting mirror are heated by the laser light. In order to suppress a temperature rise at these mirrors, a coolant path is provided in a peripheral portion of each mirror. The structure of the coolant path of the reflecting mirror will be explained below, by way of example. The reflecting mirror is generally made of oxygen free copper, and a peripheral portion of the reflecting mirror is held between a pair of holding plates, that is, first and second holding plates. These holding plates form the coolant path along the circumference of the reflecting mirror. Cooling water flows into the coolant path through a supply pipe and flows out through an exit pipe, to cool the reflecting mirror. In order to prevent the cooling water from flowing on the reflecting mirror, the reflecting mirror is held between the first and second holding plates in such a manner that each holding plate is pressed against the reflecting mirror through a sealing member, for example, an O-ring. Thus, the reflecting mirror is applied with a pressure which is directed from opposite surfaces of the reflecting mirror to the inside thereof. Accordingly, wrinkles are generated on a reflecting surface of the reflecting mirror in a region between the peripheral portion of the reflecting mirror and the center axis thereof. In other words, strain causing an uneven reflecting surface is generated. The laser light incident upon such a reflecting surface is subjected to diffused reflection, and therefore the laser output is lowered. An object of the present invention is to provide a laser apparatus having a high laser output. In order to attain the above object, a reflecting mirror according to the present invention has an absorbing groove which is provided along the circumference of the reflecting mirror. When holding means is pressed against the reflecting mirror, that portion of a reflecting surface which is applied with the pressure, is extended toward the center axis of the reflecting mirror, and such extension is absorbed by the absorbing groove. Thus, there is no danger of an uneven reflecting surface appearing between the groove and the axis of the reflecting mirror, and therefore the laser output is never lowered. The present invention will be apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: Fig. 1 is a vertical sectional view showing an embodiment of a gas laser apparatus according to the present invention. Fig. 2A is a detail sectional view taken along the line IIA-IIA of Fig. 1. Fig. 2B is a sectional view taken along the line IIB-IIB of Fig. 2A. Fig. 3A is a vertical sectional view of the reflecting mirror shown in Fig. 1. Fig. 3B is a vertical sectional detail view showing a main part of the reflecting mirror shown in Fig. 3A. Now, explanation will be made of an axial-flow type gas laser apparatus 1 which is an embodiment of the present invention, with reference to Figs. 1, 2A and 2B. A discharge tube 2 includes therein a discharge chamber 3, and a gas medium 5 is introduced into the discharge chamber 3 through an inlet 4 in a direction indicated by an arrow. The gas medium 5 is a mixed gas containing C02 gas, N2 gas, He gas and others, and flows out through an outlet 6 which is provided at an end portion of the discharge tube 2 opposite to the inlet 4. When glow discharge is generated between a cathode 7 and an anode 8 both arranged in the discharge chamber 3, population inversion occurs in the gas medium 5, to generate laser light 9. The laser light 9 thus generated travels back and forth between an output mirror 10 and a reflecting mirror 11 in such a manner that the spacing between the mirrors 10 and 11 acts as a resonator, and is taken out of the discharge chamber 3 through the output mirror 10. Each of the output mirror 10 and reflecting mirror 11 is pressed by and held between first and second holding plates 12 and 13. Since the output mirror 10 and reflecting mirror 11 are held in the same manner, explanation of a holding structure on the side of the output mirror 10 is omitted, and only a holding structure on the side of the reflecting mirror 11 will be explained below. As shown in Figs. 2A and 2B, a first annular groove 15 is provided in a peripheral portion of the first holding plate 12 spaced for apart from the center axis thereof, and a second groove 16 having a similar shape to the first groove 15 is provided in the first holding plate 12 at a position inside the first groove 15 and in the second holding plate 13 at a position corresponding to the above positon of the first holding plate 12. (That is, the second grooves 16 in the first and second holding plates are smaller in diameter than the first groove 15.) A coolant path 17 is formed between the first groove 15 and second grooves 16 along a peripheral portion llA of the reflecting mirror 11. Cooling water 19 flows into the coolant path 17 through a supply pipe 18 in directions indicated by arrows, and flows out through an exit pipe 20. In order to prevent the cooling water 19 from flowing on the reflecting mirror 11 and flowing outside the first and second holding plates 12 and 13, the first groove 15 and second grooves 16 receive sealing members 21A and 21B, for example, O-rings. When the second holding plate 13 is clamped to the first holding plate 12 by a clamping bolt 22 while keeping the first and second holding plates 12 and 13 in contact with each other, the peripheral portion llA of the reflecting mirror 11 is pressed by and held between the first and second holding plates 12 and 13 through the sealing members 21A and 21B. Now, the peripheral portion llA will be explained below in detail with reference to Figs. 2B, 3A and 3B. An absorbing groove 23 is cut from a reflecting surface 11B into the reflecting mirror 11, and a plurality of through holes 24 are provided at the absorbing groove 23, in order to cause the discharge chamber 3 to communicate with a back chamber 25 by means of the through holes 24. The back chamber 25 is formed by a recess provided in the second holding plate 13 (refer to Fig. 1) and a surface of the reflecting mirror 11 opposite to the reflecting surface. Next, the function of the absorbing groove 23 will be explained. When the clamping bolt 22 is turned in a state that the first holding plate 12 is kept in contact with the second holding plate 13, the sealing members 21A and 213 are compressed, and a pressure F is produced in directions indicated by arrows in Fig. 3A. The pressure F is applied to the peripheral portion llA in such a manner that the surface of the peripheral portion llA is pressed against the inside thereof, and therefore the peripheral portion llA is elongated in x- and x2-directions shown in Fig. 3B. The elongation in the xl-direction is prevented or absorbed by the coolant path 17, and the absorbing groove 23 can absorb the elongation in the x2-direction. Accordingly, the elongation in the x2-direction is absorbed by the absorbing groove 23, and therefore a region of the reflecting mirror 10 between the center axis thereof and the groove 23 is scarcely affected by the above elongation in the x2-direction. Thus, in this region, wrinkles are scarcely generated in the surface of the reflecting mirror, that is, strain or deformation causing an uneven surface is hard to occur. Therefore, laser light reflected back from the reflecting mirror 11 has not been subjected to diffused reflection, and thus the laser output is not lowered. In other words, the laser output becomes higher. On the other hand, when the gas laser apparatus 1 is operated, a small amount of molten metal from the electrodes 7 and 8 is deposited on the reflecting surface 11B by the glow discharge. After the operation of the gas laser apparatus 1 has been stopped, the reflecting mirror 11 is detached from the apparatus 1, and the deposited metal is removed by grinding and polishing the reflecting surface 11B, In general, the grinding and polishing operations are performed in the order of rough finishing, medium finishing and fine finishing in accordance with the state of the metal deposited on the reflecting surface. In the case where the absorbing groove is cut from the same plane as the reflecting surface, a recess is formed on the periphery of the absorbing groove when the reflecting surface is polished, and therefore it is difficult to polish the reflecting surface to a flat surface. However, the absorbing groove 23 according to the present invention is provided in the peripheral portion lIA which is made lower than the reflecting surface 11B, and therefore it is not required to polish the peripheral portion llA when the reflecting surface 11B is polished. Accordingly, it is possible to polish the reflecting surface lIB to a flat surface, and thus the laser light 9 incident on the reflecting surface llB is scarcely subjected to diffused reflection. Further, reflecting surfaces llB and llC may be formed on both sides of the reflecting mirror 11. When it is required to carry out maintenance and inspection in a hurry, the reflecting mirror 11 can be used in such a manner that one reflecting surface llB on which the molten metal has been deposited, faces the back chamber 25 and the other reflecting surface llC faces the discharge chamber 3. In the present embodiment, the discharge chamber 3 communicates with the back chamber 25 by means of the through holes 24 to make the pressure in the discharge chamber 3 equal to that in the back chamber 25, with a simple structure. The following advantages can be obtained by drilling the communicating holes 24 at the absorbing groove 23. (1) Respective positions of the communicating holes 24 are determined on the basis of the absorbing groove 23, and therefore the holes 24 can be readily provided. (2) Since the thickness of the reflecting mirror 11 at the absorbing groove 23 is smaller than the thickness of other portions of the reflecting mirror 11, the communicating holes 24 can be drilled rapidly, that is, operation efficiency is high. (3) In the case where the communicating holes 24 are provided in the reflecting mirror 11 at the absorbing groove 23, the burr is hard to produce when the holes 24 are drilled, and therefore the precious reflecting mirror 11 is never damaged by the burr. The above-mentioned communicating holes are not required in a gas laser apparatus which includes no back chamber. Further, in the foregoing description, explanation has been made on an axial-flow type gas laser apparatus according to the present invention. However, it is needless to say that the present invention is applicable to other gas laser apparatuses, for example, a cross flow type gas laser apparatus having different directions of a gas flow, a glow discharge path and a laser beam path with each other in which the laser beam path crosses orthogonally with the glow discharge path and the direction of gas flow, or the each directions are mutually crosses orthogonaly. As has been explained in the foregoing, in a laser apparatus according to the present invention, an absorbing groove is provided in a peripheral portion of a reflecting mirror to prevent strain from being produced in the reflecting mirror, and therefore the laser output can be made higher.

Claims: WHAT IS CLAIMED IS: 1. A gas laser apparatus including a discharge tube (2) provided therein with electrodes (7, 8) and filled with a gas medium (5) for generating glow discharge between said electrodes to produce population inversion in said gas medium, thereby generating laser light (9), output and reflecting mirrors (10, 11) provided on said discharge tube for causing said laser light to travel back and forth between said output and reflecting mirrors in such a manner that a spacing between said output and reflecting mirrors acts as a resonator, and holding means (12, 13) for pressing a peripheral portion (ill) of said reflecting morror (11) against said discharge tube through a sealing member (21A, 21B), wherein an absorbing groove (23) is provided in said peripheral portion (llA) of said reflecting mirror (11). 2. A gas laser apparatus according to Claim 1, wherein said peripheral portion (llA) provided with said absorbing groove (23) is formed in such a manner that a main surface of said peripheral portion (liy) is lower than a reflecting surface (lob) of said reflecting mirror (11). 3. A gas laser apparatus according to Claim 1, wherein one of a pair of main surfaces of said peripheral portion (llA) provided with said absorbing groove (23) faces a discharge chamber (3) and the other main surface faces a back chamber (25). 4. A gas laser apparatus according to Claim 3, wherein said peripheral portion (llA) provided with said absorbing groove (23) is formed in such a manner that one of said main surfaces of said peripheral portion (llA) is lower than a reflecting surface (llB) of said reflecting mirror (11). 5. A gas laser apparatus according to Claim 3, wherein a through hole (24) is provided in said peripheral portion (llA) at said absorbing groove (23) so that said discharge chamber (3) communicates with said back chamber (25) by means of said through hole (24). 6. A gas laser apparatus according to Claim 4, wherein a through hole (24) is provided in said peripheral portion (llA) at said absorbing groove (23) so that said discharge chamber (3) communicates with said back chamber (25) by means of said through hole (24). 7. A gas laser apparatus according to Claim 3, wherein a through hole (24) is provided in said peripheral portion (llA) of said reflecting mirror (11) so that said discharge chamber (3) communicates with said back chamber (25) by means of said through hole (24). 8. A gas laser apparatus according to any one of Claims 1 to 7, wherein reflecting surfaces (lib, llC) are formed on both sides of said reflecting mirror (11).

Inventors: IWAKI, KIYOEI, NEMOTO, KENICHI
Applicants: HITACHI, LTD.
Application year: 1982
Main classification: H01S3
IPC codes: H01S3