HEAT RADIATION REFLECTING GLASS AND PREPARATION THEREOF

Abstract: A heat radiation reflecting glass comprises a transparent nickel-copper alloy layer formed by a chemical plating process on a glass plate.

Description: BACKGROUND OF THE INVENTION: FIELD OF THE INVENTION: The present invention relates to a heat radiating reflecting glass having excellent characteristics of high heat radiation reflectivity and excellent durability. DESCRIPTION OF THE PRIOR ARTS: Glass plates having each thin transparent or translucent metal layer made of silver, nickel or aluminum which reflect or intercept heat radiation of solar or radiant heat have been known as heat radiation reflecting glass plates and have been used as a single glass late, an insulating glass unit or a laminated glass plate in buildings, Vehicles and various apparatuses and instruments. The heat radiation reflecting glasses having a metal layer formed by a chemical plating hive an advantage of a low cost, because an economical apparatus can be used for the preparation in comparison with a vacuum deposition process or a spluttering process. Among the chemical coating process, a product having a copper layer has the optimum heat radiation reflec tii:t, hossever. it has not satisfactory corrosion resistance to have not a desired d.urabffity. On the other hand, a product having a nickel layer has a desired corrosion resistance and enough durability but has inferior heat radiation reflectivity to that of the copper layer. SUMMARY OF THE INVENTION: It is an object of the present invention to provide a heat radiation reflecting glass prepared by a chemical plating process which has not the above-mentioned disadvantages. The foregoing and other objects of the present invention have been attained by providing a heat radiation reflecting glass having a transparent nickel-copper alloy layer formed by depositing said nickel-copper alloy on a glass plate by a chemical plating process whereby imparting advantages of both of a nickel component and a copper component to give excellent heat radiation reflectivity of K value (heat-transfer coefficient) of upto 2.0 and SC (shading coefficient) of upto 0.20 and excellent corrosion resistance in a low cost. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS: The transparent nickel-copper alloy layer formed by the chemical plating process preferably comprises 1 to 25 wt.% of Ni component and 75 to 99 wt.% of Cu component. When Ni content is more than 25 wt.%, the heat radiation reflectivity is disadvantageously too low whereas when it is less than 1 wit.96, the corrosion resistance is not satisfactory. When Cu content is more than 99 wt.%, the corrosion resistance is not satisfactory whereas when it. is less than 75 wt.%, the heat radiation reflectivity is disadvantageously too low. It is preferable to incorporate Pd component in the transparent nickel-copper alloy layer. The Pd content is preferably upto 100 ppm especially 2 to 80 ppm by weight based on the alloy layer. When the Pd content is more than 100 ppm, the ratio of the Ni component is disadvantageously excess whereas it is less than 1 ppm, the ratio of the Ni component is disadvantageously remarkably low. Thus, the ratio of Ni component can be controlled to 1 to 25 wt. %. It is possible to incorporate a boron component in the transparent nickel-copper alloy layer. The transparent nickel-copperboron alloy layer preferably comprises 1 to 20 wt. % Ni component, 75 to 99 wt.% of Cu component and upto 5 wt.% of B component; especially 1 to 10 wt.% of Ni component, 89 to 99 wt.% of Cu component and 6.001 to 1 wt.% of B component. When the B content is more than 5 wt.%, the heat radiation reflectivity is disadvantageously low. The advantages of both of the Ni component and the Cu component have been imparted by the combination of the Ni component, the Cu component and the B component to give the heat radiation reflecting glass having excellent heat radiation reflectivity such as a heat-transfer coefficient (K value) of upto 2.0 and a shading coefficient (SC) of upto 0.20 and excellent corrosion resistance. Of course, it is preferable to incorporate upto 100 ppm of the Pd component in the transparent Ni-Cu-B alloy layer from the above-mentioned viewpoint. The transparent nickel-copper alloy layer of the present invention preferably has a thickness of 50 to 1000 R especially 100 to 700 A so as to impart a desired transparency and desired optical characteristics such as heat radiation reflectivity and transmissivity. A hue of the nickel-copper alloy layer of the present invention can be controlled in a range of neutral to copper color by selecting the Ni content. For example, the neutral color is given by increasing the Ni content whereas the copper color is given by decreasing the Ni content. The nickel-copper alloy layer of the present invention means a layer comprising a nickel-copper alloy as the main component and ineludes the nickel-copper alloy layer containing Pd component and the Ni-Cu-B alloy layer or the alloy layer containing a small amount of the other component. In the preparation of the transparent nickel-copper alloy layer on the glass plate, a nickel salt, a copper salt and a reducing agent for reducing said nickel salt and said copper salt are applied in the presence of the Pd salt on the surface of the glass plate to chemically reduce said nickel salt and said copper salt to form. the nickel-copper alloy layer. As one embodiment, the nickel-copper alloy layer is formed by the following steps. (1) The surface of the glass plate is cleaned.by rinsing with water or a detergent or polishing with an abrasive such as cerium Qx.:ide, (2) The surface of. the glass plate is rinsed with water preferably distilled water or deionized water after contacting it with a dilute aqueous solution of a tin salt such as stannous chloride for a short time at about room temperature. (3) If necessary, the surface is further treated with a dilute aqueous solution of a palladium salt such as palladium chloride and then is rinsed with water. (4) The nickel salt, the copper salt, and the reducing agent for reducing the nickel salt and the copper salt are applied in the presence of the palladium salt on the glass plate to chemically reduce the nickel salt and the copper salt at substantially the same time to deposit the nickel-copper alloy layer. (5) The glass plate having the nickel-copper alloy layer is rinsed with water. In the process for forming the transparent nickel-copperboron alloy layer on the glass plate, the step (4) of the preparation of the nickel-copper alloy layer is substituted by the following step. The nickel salt, the copper salt and an alkali borohydride or a borane amine as a reducing agent for the nickel salt and the copper salt are applied in the presence of the palladium salt to chemically deposit the nickel-copper-boron alloy layer. The following processes can be considered as the process for applying the nickel salt, the copper salt and the reducing agent in the presence of the palladium salt on the glass plate. A process for spraying at the same time both of a solution of the nickel salt, a solution of the copper salt and a solution of the palladium salt or both of a solution of the nickel salt and the copper salt and a solution of the reducing agent. A process for spraying a mixture of three or four kinds of the solutions. A process for coating a mixture of four kinds of the solutions on the glass plate by a roll coating etc. A process for spraying the solution of the nickel salt, the solution of the copper salt, the solution of the palladium salt or the mixture thereof by mixing them in a spray gun in a form of a single solution. The other similar processes. As the solution of the nickel salt and the solution of the copper salt used for-the formation of the nickel-copper alloy layer, various formulations for the nickel salt and the copper salt can be used. As the solution of the nickel salt, it is possible to use a solution of an inorganic or organic nickel salt such as nickel chloride, nickel sulfate, nickel acetate or a mixture of two or more nickel salts and a chelating agent such as Rochelle salt, EDTA,EDTA-2Na, sodiujn citrate and sodium gluconate; a pH buffering agent and a pIl rnodifier or the solution containing a desired additive especially ,an aqueous solution, As the solution of the copper salt, it is possible ta use a solution of a copper salt such as copper nitrate, copper sulfate1 copper acetate or a mixture of two or more copper salts and a chelating agent, a pH buffering agent and a pH modifier if necessary, a desired additive as used in the nickel solution, especially an aqueous solution. As the solution of the palladium salt, it is possible to use a solution of a palladium salt such as palladium chloride, palladium nitrate and palladium sulfate, especially an aqueous solution of the palladium salt A concentration of the nickel salt in the nickel salt solution is preferably in-a range of 0.01 to 1% and a concentration of the copper salt in the copper salt solution is preferably in a range of Q,02 to 2%, The reducing agent solution is a solution of a reducing agent for reducing the nickel salt and the copper salt to form the nickel-copper alloy layer such as solutions of formaldehyde, reducing sugars, Rochelle salt, tartaric acid or sodium hypophosphite especially the aqueous solution. The spraying process is the optimum as the process for applying these solutions on the glass plate. It is especially preferable to apply these solutions at the same time. In the process of the present invention, the palladium salt is present in the deposition of the metals by reducing the copper salt and the nickel salt whereby the nickel-copper alloy layer can be effectively formed by the effect of the palladium salt. When the palladium salt is not present, it is not easy to deposit nickel component and it is not easy ta form a nickel-copper alloy layer containing 1 to 25 wt.% of nickel component, It is preferable to contain the palladium salt at a concentration of 1 to 100 ppm in the solution for plating nickel and copper. When it is more than 100 ppm, the ratio of Ni component in the alloy layer Is. too much and the heat reflectivity is disadvantageously low whereas when it is less than 1 ppm, the ratio of Ni component in the alloy layer is too small, and the durability of the alloy layer is disadvantageously inferior When the transparent nickel-copper alloy layer containing boron component is formed an the glass plate, for example, the boron çom. pound is used as the reducing agent to apply it in the formation of the alloy layer, The boron compound is preferably to reduce the nickel salt and the copper salt sometimes the palladium salt to form the nickelcopper-boron alloy layer so as to incorporate the boron component in the nickel-copper layer. It is optimum to use alkali borohydride and borane amine. The alkali borohydrides can be sodium borohydride, potassium borohydride and lithium borohydride. The borane amines can be borane amine, borane dimethylamine, borane diethylamine and borane trimethylamine. When the alkali borohydride is used, any toxic gas is not generated to obtain the nickel-copper-boron alloy layer without a public pollution though a toxic gas is generated in the conventional chemical plating process using formaline etc. A time for chemical plating in the deposition of the nickelcopper alloy layer is preferably in a range of 30 second to 20 minute especially about 1 minute to 10 minute. A temperature of the-solutions of the nickel salt, the copper salt and the palladium salt, the solution of the reducing agent or the solution of these salts and the reducing agent is preferably in a range of 10 to 600C especially about 300C. Velocities for depositions of the nicekl salt and the copper salt are different depending upon the variation of the temperature in the chemical plating. lt'is important to maintain the temperature in the chemical plating to be +30C ih view of th prevention of color ununiformity. A temperature of the substrate in the chemical plating is preferably in a range of 10 to 600C especially about room temperature. A spraying rate and a plating time are selected so as to obtain a desired thickness of the alloy layer. In the present invention, it is possible to form a protective coating or the other functional layer as a top coating on the nickelcopper alloy layer formed on the glass plate or to carry out a chemical treatment, or to form an adhesive coating or the other functional layer as an under coating. The glass plate can be made of normal glass or heat radiation absorbing glass or other various glasses and also organic glasses such as polycarbonate and methacrylate. The present invention will be further illustrated by certain examples and references which are provided for purposes of illustration only and are not intended to be limiting the present invention. EXAMPLE 1: A glass plate (300 mm x 300 mm x 5 mm) was polished with ceria and rinsed with water. An aqueous solution of stannous chloride (SnCQ2; ; 0.8 g/l liter of water) was sprayed on the surface of the glass plate at a rate of 5 liter/m2 to perform a sensitizing treatment and then, the glass plate was rinsed with water and an aqueous solution of palladium chloride (PdCQ2:0.05 g/l liter of water) was sprayed on the surface of the glass plate at a rate of 5 liter/m2 to perform an activating treatment. The following solution A1 and the solution B1 were respectively sprayed on the treated surface of the glass plate by each spray-gun at a volumetric ratio of 1 : 1 at each rate of 5 liter/m2 and they were kept for 6 minutes to deposit a nickel-copper alloy layer on the glass plate by a chemical plating process. Solution A1: Cupric sulfate 1 g/liter Nickel sulfate 2 g/liter Formaline (38%) 43 ml/liter Palladium chloride 0.008 g/liter Water Balanced Solution B1: Rochelle salt 20 g/liter Sodium hydroxide 10 liter Water Balanced The resulting nickel-copper alloy layer had a thickness of 500 R and a ratio of Ni to Cu of 1: 99 by weight. In the nickel copper alloy layer, any Pd component was not found, The characteristics of the layer were measured. The results are shown in Table 1. EXAMPLE 2: A glass plate (300 mm x 300 mm x 5 mm) was polished with ceria and rinsed with water. An aqueous solution of stannous chloride (SnCl2: 0.8 g/l liter of water) was sprayed on the surface. of the glass plate at a rate of 5 liter/m2 to perform a sensitia treatment and then, the glass plate was rinsed with water and an aqueous solution of palladium chloride (PdCl2; 0,05 g/1 liter of water) was sprayed on the surface of the glass plate at a rate of 5 liter to perform an activating treatment. The following solution A2 and the solution of B2 were respectively sprayed on the treated surface of the glass plate by each spray-gun at a volumetric ratio of 1 : 1 at each rate of 5 liter/m2 and they were kept for 6 minutes to deposit a nickel-copper alloy layer on the glass plate by a chemical plating. Solution A2: Cupric sulfate 1 g/liter Nickel sulfate 2 g/liter Formaline (38%) 43 mQ/liter Palladium chloride 0.017 g/liter Water Balanced Solution B2: Rochelle salt 20 g/liter Sodium hydroxide 10 g/liter Water Balanced The resulting nickel-copper-palladium alloy layer had a thickness of 500 A and a ratio of Ni to Cu of 7 : 93 by weight and a content of Pd component of 10 ppm. The characteristics of the layer were measured. The results are shown in Table 1. The optical characteristic is shown in Figure 1 c. EXAMPLE 3: A glass plate (300 mm x 300 mm x 5 mm) was polished with ceria and rinsed with water. An aqueous solution of stannous chloride (SnCl2: 0.8 g/l liter of water) was sprayed on the surface of the glass plate at a rate of 5 liter/m2 to perform a sensitizing treatment and then, the glass plate was rinsed with water and an aqueous solution of palladium chloride (PdCQ2 :0.05 g/l liter of water) was sprayed on the surface of the glass plate at a rate of 5 liter/m2 to perform an activating treatment. The following solution A3 and the solution B3 were respectively sprayed on the treated surface of the glass plate by each spray-gun at a volumetric ratio of I : 1 at each rate of 5 liter/mê and they were kept for 6 minutes to deposit a nickel-copper-boron alloy layer on the glass plate by a chemical plating process1 Solution A3: Nickel sulfate 8g3 glilter Copper sulfate 3,7 g/liter Rochelle salt 20 liter Sodium hydroxide 10 g/lier Palladium chloride 0. Q2 gLliter Ammonia water (29% of sol.) 0.5 ml/liter Water Balanced Solution B3: Sodium hydroxide Q,25 liter Sodium borohydride t of 125. liter Water Balanced The resulting nickel-copper-boron alloy layer had a thickness of 500 A and comprised 3.4 wt.% of Ni, 96.5 wt.% of Cu and 0.1 wt.% of B. The characteristics of the layer were measured. The results are shown in Table 1. The optical characteristic is shown in Figure 1 c'. EXAMPLE 4: In accordance with the process of Example 3 except using Solution A and Solution B4 a nickel-copper-boron alloy layer was formed Solution A4: Nickel sulfate 8.3 g/liter Cupric sulfate 1.7 g/liter Rachelle salt 20 g/liter Sodium hydroxide 10 g/liter palladium chloride 0.01 g/liter Water Balanced Solution Bq: : Sodium hydroxide 0.25 g/liter Sodium borohydride 0.125 g/liter Water Balanced The resulting nickel-copper-boron alloy layer had a thickness of 500 A and comprised 2.0 wt.% of Ni and 97.9 wt.% of Cu and 0.1 wt,9 of s, The durability test result of the layer is shown in Table 1, EXAMPLE 5: In accordance with the process of Example 3 except using Solution A5 and Solution B5, a nickel-copper-boron alloy layer was formed. Solution A5: Nickel sulfate 8.3 g/liter Copper sulfate 1.7 g/liter Rochelle salt 20 g/liter Sodium hydroxide 10 g/liter Palladium chloride 0. 02 g/liter Ammonia water 0.5 mQ/liter Water Balanced Solution Bg: Sodium hydroxide 0.25 g/liter Borane amine 5 g/liter Water Balanced The resulting nickel-copper-boron alloy layer had a thickness of 500 and comprised 3.2 wt.% of Ni, 96.6 wt.% of Cu and 0.2 wt.% of B. The durability test result of the layer is shown in Table 1. REFERENCE 1: A glass plate (300 mm x 300 mm x 5 mm) was polished with ceria and rinsed with water. An aqueous solution of stannous chloride (SnC2 : 0.8 gil liter of water) was sprayed on the surface of the glass plate at a rate of 5 liter/mê to perform a sensitizing treatment and therm, the glass plate was rinsed with water and an aqueous solution of palladium chloride (PdCl2 : :0.05 gil liter of water) was sprayed on the' surface of the glass plate at a rate of 5 liter/mê to perform an activating treatment The following solution A6 and the solution Bg were respectively sprayed on the treated surface of the glass plate by each s-pray-gun at a volumetric ratio of 1 : 1 at each rate of 5 literlm2 and they were kept for 6 minutes to deposit a metal layer on the glass plate by a chemical plating process. Solution A6: Cupric sulfate 1 liter Nickel sulfate 2 liter Formaline (38%) 43 mZlliter Water Balanced Solution B6: Rochelle salt 20 liter Sodium hydroxide 10 liter Water Balanced The resulting metal layer had a thickness of 500 A and comprised about 100% of Cu (Ni was not substantially included). The characteristics of the layer were measured. The results are. shown in Table 1. REFERENCE 2: On the glass plate treated by the process of Reference 1, Solution A7 and Solution B7 were respectively sprayed by each spraygun at a volumetric ratio of about 1 : 1 at each rate of 5 liter/m2 and they were kept for 2 minutes to deposit a nickel-boron alloy layer on the glass plate by a chemical plating. Solution A7: Nickel acetate 5. 0 g/liter Sodium gluconate 9.0 g/liter Ammonia water (39%) 2.û mQ/liter Boric acid 2.5 gaiter Water Balanced Solution' B7: Sodium borohydride 0.5 g/liter Sodium hydroxide 0.2 g/liter Water Balanced The resulting nickel-boron alloy layer had a thickness of 500 The characteristics of the nickel-boron layer were measured. The results are shown in Table 1. REFERENCE 3: On the glass plate treated by the process of Reference 1, Solution A8 and Solution B8 were respectively sprayed by each spraygun at a volumetric ratio of about 1 : 1 at each rate of 5 liter2 and they were kept for 2 minutes to deposit a copper-boron alloy layer on the glass plate by a chemical plating. Solution A8: Cupric sulfate 5.0 g/liter Sodium gluconate 9. 0 g/liter Ammonia water(39%) 2. 0 mi/liter Boric acid 2. 5 g/liter Water Balanced Solution B8: Sodium borohydride 0.5 g/liter Sodium hydroxide 0. 2 g/liter Water Balanced The resulting copper-boron alloy layer had a thickness of 500 . The characteristics of the copper-boron layer were measured. The results are shown in Table 1. Table 1 EMI18.1 <tb> <SEP> Visible <SEP> Visible <SEP> K <SEP> value <SEP> . <SEP> Durability <tb> <SEP> Layer <SEP> transmis- <SEP> reflec- <SEP> (K <SEP> calm2. <SEP> SC <SEP> Reflective <SEP> ( <SEP> corrosion <tb> <SEP> sivity(%) <SEP> tivity(%) <SEP> hr. C) <SEP> color <SEP> resistance) <tb> <SEP> Ni-Cu <tb> Bxp. <SEP> 1 <SEP> alloy <SEP> 15 <SEP> 31 <SEP> 1.70 <SEP> 0.19 <SEP> neutral <SEP> O <tb> Exp.2 <SEP> Nal-lCoy-Pd <SEP> 16.3 <SEP> 30 <SEP> 1.76 <SEP> 0.20 <SEP> neutral <SEP> O <tb> Exp.Z <SEP> alloy <SEP> V <tb> Exp.3 <SEP> Ni-Cu-B <SEP> 15 <SEP> 32 <SEP> 1.70 <SEP> 0.18 <SEP> neutral <SEP> O <tb> alloy <tb> <SEP> Ni-Cu-B <SEP> pale <tb> Exp.4 <SEP> alloy <SEP> 15 <SEP> 33 <SEP> 1.60 <SEP> 0.17 <SEP> copper <SEP> 0 <tb> <SEP> alloy <SEP> color <tb> Exp.5 <SEP> Ni-Cu-B <SEP> 16 <SEP> 30 <SEP> 1.72 <SEP> 0.19 <SEP> neutral <SEP> O <tb> Exp.S <SEP> alloy <SEP> 16 <SEP> 30 <SEP> 1.72 <SEP> 0. <tb> Ref.1 <SEP> Cu <SEP> 16.0 <SEP> 32 <SEP> 1.60 <SEP> 0.15 <SEP> copper <tb> <SEP> color <SEP> X <tb> Ref. <SEP> 1 <SEP> Ni-B <SEP> 15.5 <SEP> 28 <SEP> 2.50 <SEP> 0,25 <SEP> neutral <SEP> . <SEP> O <SEP> 0 <tb> <SEP> alloy <tb> Ref <SEP> . <SEP> 3 <SEP> Cu <SEP> B <SEP> 15 <SEP> 33 <SEP> l <SEP> 0.17 <SEP> copper <SEP> X <tb> <SEP> alloy <tb> As it is clearly found in Table 1, the heat radiation reflecting glass of the present invention had superior thermal charac- teristics such as heat passing coefficient and shading coefficent to those of the conventional heat-transfer reflecting glass having a nickel-boron alloy layer and also had superior durability to those of the copper layer and had neutral hue to be desirable as a heat radiation reflecting glass. The durability was determined by an observation of degree of corrosion after maintaining at 30 C RH of 70% for one month, EMI19.1 non-corrosion corrosion The visible transmissivity (Tv) was measured under the light incidence from each layer of the sample of glass plate having a thickness of 5 mm. The visible reflectivity (Rv) was measured under the light incidence from the non-coated side of a glass plate coated with the layer having a thickness of 5 mm. The heat-transfer coefficient (K value) and the shading coefficient (SC) were measured for an insulating glass unit prepared by a pair of glass plates having a thickness of 5 mm and an air space of 12 mm. Figure 1 shows optical characteristics of the heat radiation reflecting glass of the present invention obtained in Example 2; and Figure 2 shows optical characteristics of the heat radiation reflecting glass of the present invention obtained in Example 3.

Claims: CLAIMS: 1) A heat radiation reflecting glass which comprises a transparent nickel-copper alloy layer formed by a chemical plating process on a glass plate. 2) The heat radiation reflecting glass according to Claim 1 wherein said transparent nickel-copper alloy layer comprises 1 to 25 wt.% of Ni component and 75 to 99 wt.% of Cu component. 3) The heat radiation reflecting glass according to Claim 1 wherein said transparent nickel-copper alloy layer comprises upto 100 ppm of Pd component. 4) The heat radiation reflecting glass according to Claim 1 wherein said transparent nickel-copper alloy layer comprises boron component. 5) The heat radiation reflecting glass according to Claim 4 wherein said transparent nickel-copper alloy layer comprises 1 to 20 wt.% of Ni component, 75 to 99 wt.% of Cu component, upto 5 wt.% of B component. 6) The heat radiation reflecting glass according to Claim 1 wherein said transparent nickel-copper alloy layer has a o thickness of 10 to 1000 A. 7) A process for preparing a heat radiation reflecting glass which comprises forming a nickel-copper alloy layer by applying a nickel salt, a copper salt and a reducing agent for reducing said salts in the presence of a palladium salt to chemically reduce said nickel salt and said copper salt. 8) The process according to Claim 7 wherein said reducing agent for reducing said nickel salt and copper salt is an alkali borohydride or a borane amine. 9) The process according to Claim 8 wherein said alkali borohydride is sodium borohydride.

Inventors: KOBAYASHI, TAKAYUKI, TAMAMURA, RYO
Applicants: ASAHI GLASS COMPANY LTD.
Application year: 1981
Main classification: C03C17
IPC codes: C23C18, C03C17