COMPOSITIONS OF POLYPHENYLENE OXIDES WITH EPDM-SILICONE RUBBER

Abstract: Novel compositions comprising blends of polyphenylene oxides with EPDM-silicone rubber, and optionally a polystyrene resin. The compositions when molded exhibit improved ductility and impact strength. Included within the disclosure are methods of preparing and molding the novel compositions and the molded products obtained therefrom.

Description: Description Compositions of Poiyphenyiene Oxides with EPDM-Silicone Rubber The invention relates to improved compositions of a poiyphenyiene oxide resin, an EPDM-silicone rubber, optionally containing a polystyrene resin. The composi¬ tions when molded have improved ductility and impact strength, the .invention also includes methods of ■ preparing the novel compositions of molding articles of -any desired shape therefrom, and the molded articles produced from the compositions. 2 Background of t Invention - The poiyphenyiene ether resins are a family of engi.n-aeri.ng thermoplastics that are well known to the polymer art. These polymers may be made by a variety of catalytic and non-catalytic processes from the corresponding phenols or reactive derivatives thereof- By way of illustration, certain of the poiyphenyiene ethers are disclosed in Hay, U.S. Patent Nos. 3,306,874 and 3,306,375, and in Stamatof , U.S. Patent Nos. 3,257,357 and 3,257,353. In the Hay patents, the poiyphenyiene ethers, are prepared by an oxidative coupling reaction comprising passing an oxygen-con¬ taining gas through a reaction solution of a phenol and a metal- amine complex catalyst. Other disclosures relating to processes for preparing poiyphenyiene ether resins, including graft co- polymers of poiyphenyiene ethers with styrene type coπpounds, are found in Fox, U.S. Patent No. 3,356,761; Suπitomo, U.K. Patent No. 1,291,609; Bussink et al, U.S. Patent No. 3,337,499; Blanchard et al. U.S. Patent No. 3,219,626; Laakso et al U.S. Patent No. 3,342,892; Bor an, U.S. Patent No. 3,344,166; Hori et al U.S. Patent No. 3,384,619; Faurote et al U.S. Patent No. 3,440,217; and disclosures relating to metal based catalysts which do not include amines, are known from patents such as Wieden et al, U.S. Patent No. 3,442,385 {copper-aπidines) ; Nakashio et al U.S. " Patent No. 3,573,257 (metal-alcoholate or phenolate); Xobayashi et al U.S. Patent No. 3,455,880 (cobalt chelates) ; and the like. In the Stam toff pa-cants, the poiy¬ phenyiene ethers are produced by reacting the corresponding phenolate ion with an initiator, such as peroxy acid salt, an acid peroxide, a hypohalite, and the like, in the presence of a complexing agent. Disclosures relating to non-catalytic processes, such as oxidation with lead dioxide, silver oxide, etc. SUSSTITUTE SHEET are described in Price et al, U.S. Patent Ho. 3,382,212. CizeJc, U.S. Patent tfσ. 3,333,435 discloses poiyphenyiene ether-styrene resin compositions. All of the above-mentioned disclosures are incorporated by reference. The term "polystyrene resin" includes polymers and copolymers of styrene, alpha methyl styrene, chlorostyrene, and the like. The term "E?D-*_" includes rubbery interpoiymers of a mixture of mono-olefins and a polyene. Preferred types are those rubbery interpolymers of ethylene, an alpha-ols in, and a polyene. Rubbery interpolymers of ethylene, propylene, and a polyene are especially preferred. , The term "ΞPD -silicone rubber" includes graf * -; copolymers of HPDM with silicone rubber. An example of a SPDM-silicone rubber employed* in the present invention is that commercially manufactured and sold by Shinetsu Chemical Industry, under the name SΞP-172U. In the prior art, rubber-modified styrene resins have been admixed with poiyphenyiene ether resins to form compositions that have modified properties. The Cizek patent, U.S. Patent No. 3,333,435, discloses rubber-modified styrene resin-poi pheny- lene ether resin compositions wherein the rubber component is of the unsaturated type such as polymers and copolymers of butadiene. The physical properties of these compositions are such that it appears that many of the properties of the styrene resins have been upgraded, while the moldability of the poiyphenyiene ethers are improved. SUESτ.TϋlΕ SHEET Na ashio et al U.S. Patent No. 3,653,945 discloses tnat from 0.5 to 15% by weight of an EPDM- odified styrene resin may be used to upgrade the impact strength of polyethylene ether resins. In Cooper et al, U.S. Patent No. 3,943,191 it is ' disclosed that when the highly unsaturated rubber used in compositions of the type disclosed by CizeJc, is replaced with EPDM rubber that has a low degree of residual unsaturation, the thermal oxidative staJbility and color stability are improved. The ΞPDM rubber in the Cooper et al compositions is comprised substantially of particles in the range of 3-8 microns. The impact strength of the Cooper et al compositions is superior to that of a polypropylene ether resin alone or that of similar compositions comprised of unmodified poly¬ styrene; however, the impact strength of the Cooper et al compositions is inferior to that of similar compositions co priseα of polystyrene modified with polybutadiene rubber, such as a composition known as FG-S34 available from Foster-Grant Co. As is disclosed in U.S. Patent So. 3,981,841, the impact strength of the Cooper et al compositions can be improved by incorporating therein impact modifiers such as an emulsion- graf-teά ΞPDM polystyrene copolyser. U.S. Patent No. 4,152,315 incorporated herein by reference, discloses that a composition of a poiyphenyiene ether resin and an alkeπyl aromatic resin modified with an EPDM rubber comprised of particles having a median diameter less than about two microns, preferably about 0.5 to 1.5 microns, is a very useful thermo¬ plastic molding material having good thermal oxidative stability and good room temperature impact strength but inferior low temperature impact strength. SUBSTITUTE SHEET ( OMPI IPO In U.S. Patent 4,102,850 it is disclosed that the addition of small amounts of mineral oil to the polymerizing mixture of styrene and EPDH rubber produces _ε?DM-modifieά polystyrene which yields blends with poiyphenyiene oxide having significantly better low-temperature impact strength than blends made from EPDM-polystyrene mace without the mineral oil. In U.S. Patent No. 3,737,479 it is disclosed that the addition of a silicone such as a polyorgar.osiloxane, which is fluid,to poiyphenyiene oxide or to poiyphenyiene oxide- polystyrene blends improves Gardner impact strength but not Izod impact strength (see Col. 1, lines -54-57 of U.S. Patent 3,737,479) . It has now been found when small amounts of a graft copolyiaer of E?DM with silicone rubber is blended wi-ch a poiyphenyiene oxide resin, and optionally with a polystyrene resin, blends can be obtained which are substantially improved in ductility and Izod impact strength both at room temperature and low temperature. Description of the Invention - The above-enumerated advantages are achieved with the novel high impact strength polymer compositions of the subject invention which comprise, in their broadest aspects, compositions of (a) a poiypπe.nylene oxide (also referred to as a poiyphenyiene ether) (b) an EPDM-silicone rubber (also referred to as a graft copolymer of EPDM with silicone rubber or a polyorganosiloxane) and, optionally (c) a polystyrene resin. BAD ORIGINAL ■ i ϊiEJCt OMPI W The EPDM rubbers, that is, rubbery interpolymers comprising mixtures of ono-olefins and a polyene, with which the silicone rubber is grafted include those prepared from ethylene, an alpha-olefin, and a polyene. Preferred types comprise 10-90 mole percent of ethylene, 10-90 percent of an alpha-olefin containing 3-1S carbon 'atoms, and 0.1-12 mole per¬ cent of a polyene that is a non-conjugated cyclic or open-chain diehe having 5-20 carbon atoms. Especially preferred are those alpha-olefins having 3-10 carbon atoms and non-conjugated cyclic or open-chain dienes having 5—10 carbon atoms. Useful EPDM rubbers include the ethylene-propylene- ethylidene norbornene terpolymer and those described in P.itchie, Vinyl and Allied Polymer, Vol. 1, Page 121 (1963) , which is incorporated herein by reference. The preferred ΞPDM rubbery interpolymers are those comprised of ethylene, propylene, and 5-ethylidene-2-norbomene, of ethylene, propylene, and 1,4-hex- adiene; and of ethylene, propylene, and dicylopentadiene. A preferred ΞPDM rubber is ΞPCA- 387 manufactured by the 3.F. Goodrich Chemical Co. The silicones, or the polyorgano-siloxanes, which are grafted to the ΞPDM rubbers are__characterized by a molecular backbone of alternate atoms of silicon and oxygen, wi-h organic groups attached to the silicon atoms. The types of organic groups, and the extent of crosslin age between the molecules will determine whether the polyorganosiioxane will be fluids, elastomers, rubbers, or gums. S -5« . - - , -> ■ ■*• 4 -,-. - • =- * — » O H WIPO Any of the usual well-Jtaown liquid or gum-like chain stopped polyorganosiloxanes may be used in connection with this invention. Such polyorganosiloxanes may be prepared, for example, by the hydrolysis of hydrolyzable aliphatic- or aromatic-sub¬ stituted silanes, such as dialiphatic dihalosilanes, for example dimethyldichlorosilane, followed by complete or partial con¬ densation of the hydrolysis product. They may also be prepared for example by hydrolyzing mixtures of hydrolyzable diorgano- substitu ' ted silanes either among themselves or with hydrolyzable silanes containing for example, three organic radicals s bstituteo oπ the silicon atom, for instance, trimethylchlorosilane. A further method for preparing the organo-substituteά polysiloxanes comprises hydrolyzing a diorgano-substituted άi- halosilane, isolating the hydrolysis product and effecting re¬ action between the hydrolyzed product and, e.g., hexamethyl disiloxane in the presence of suifuric acid. .More specific directions for t_τehydrolysis of hydrolyzable organo-substituted silanes to form organo-substituted polysiloxanes may be four.ά, for example, in patents and in the literature now available in the art. By the term "hydrolyzable organo-substituted silanes" it is intended to mean derivatives of SiE t, which contain hvcroiy- zable groups of radicals, for example, halogens, a ino croups, alkoxy, aryloxy, acyloxy, radicals, and che like, in addition to τ__he organic groups substituted directly on the silicor. ato . that are joined to the silicon through carbon-silicon lir-λacεs. Examples of such organic radicals are aliphatic radicals includ¬ ing alkyl radicals, for example, methyl, ethyl, propyl, isopropyl, BAD ORIGINAL OMPI ' butyl, and the like; alicyclic radicals, for example, cyclopentyl,- cyclohexyi, and tne like; aryl radicals, for example, phenyl, diphenyl, naphthyl, anthracyl, and the like; aralkyl radicals, for example, benzyl, phenethyl, and the like, alkaryl radicals, for example, tolyl, xylyl, and the like; heterocyclic radicals; as well as hydrolyzable silanes containing two different organic radicals, for example, methyl and phenyl radicals, and the like; attached tothe-silicon atom. If desired, the above- mentioned radicals may also contain substituents substituted thereon, for instance, halogens, e.g., di-, tri-, and tetra- chlorophenylchlorosilanes, for example, trichlorophenyltrichloro- silane, tetrachlorophenyltrichlorosilane, and the like. The mono- chlorosilanes, of course, act as chain stoppers. Eydroiysis of the above silanes or mixtures of silanes_ results in the formation of silanols i.e. , organo-substituted silanes containing hydroxyl groups substituted directly on the silicon, which hydroxy groups, almost immediately condense intermolecularly(intercondense) splitting out water to give the siloxane linkages mentioned previously. Such intercondensations are accelerated by acidic materials, for example, sulf ric acid, hydrochloric acid, ferric chloride, and the like, as well as by basic materials, for example, sodium hydroxide, potassiu_r. hydro¬ xide, and the like.. As a result of the hydrolysis and conden¬ sation, organo-substituted polysiloxanes may be produced which are partially or completely condensed and which may have on an average up to as high as three organic radicals substituted per silicon atom, but preferably from 1.S8 to 2.25 organic groups per silicon atom. BAD ORIGlNAb SUBSTITUTE SHEET OMPI Λ. WIPO Other directions for preparing the organopoiysiloxane compositions employed in the practice of the present invention are disclosed and claimed in U.S. 2,469,888 and 2,469,890, granted I to the present assignee on May 10, 19-49. Chain-stopped organopoiysiloxane gums are also useful in connection with the invention. These are highly viscous masses or gummy, elastic solids depending on the state of condensation, the condensing agent employed, and the starting organopoiysiloxane used to make the gummy material. A typical gummy organopoiy¬ siloxane is obtained by the condensation of a liquid organopoiy¬ siloxane containing an average of from about 1.95, preferably from about 1.98 to about 2.05 organic groups per silicon atcεr. The usual condensing agents which may be employed and which are well known in the art include, for instance, ferric chloride hexahydrata, phenyl phosphoryl chloride, alkaline condensing agents such as potassium hydroxide, sodium hydroxide and the like. These con¬ vertible organopolysiloxanes generally contain polymeric di- organopolysilosanes which may contain, for example, about 2 mole percent copolyτnerized mono-organopolysiloxane for example, copolymerized mono methylsiloxane. Generally, the starting liquid organopoiysiloxane is one which contains about 1.999 to 2.01, inclusive organic groups, for example, methyl groups, per silicon atom and where more than about 90 percent, preferably 95 percent, of the silicon atoms in the polysiloxane contain two silicon-bonded alkyl groups. A typically useful gu is prepared by mixing together about 95 mole percent octaraethylcycloetetra- siloxane, and about 5 mole percent octaphenyleclotetrasiloxane, at a temperature from about 15 Q°C. to 175°C. for about 4 hours with about 0.01 percent potassium hydroxide based on the weight BAD ORIGINA SUBSTITUTE SHEET O PI of the siloxane, until a highly viscous, gιr__my solid is obtained. Generally, the amount ox σctaphenylcyclotetrasiloxane can be varied up to about 20 mole percent of the total mixture for the purpose of the invention. A preferred family of polyorganosiloxanes for use in this invention comprises those of the formula: wherein R is alkyl, haloalkyl, aryl, aralkyl, alkaryl, alkoxy, aryloxy, and halogena ed derivatives of the aforesaid aryl, aralkyl, alkaryl, alkoxy or aryloxy groups. and R are (lower) alkyl or phenyl, and m is an integer of such a value that the polysiloxane is a rubber at ambient temperatures, e.g., " about 25 β C., said rubber being of high molecular weight. R~, R , and R can also be alkenyl, for example, vinyl, allyl, or butenyl. The (lower) alkyl groups in the polyorganosiloxanes will contain from 1 to 5 carbon atoms, straight chain and branch¬ ed. Special mention is made of a preferred class of poly¬ organosiloxanes, which includes polyπiethylphenyl-siicxane poly- dimethylsiloxane, polydiphenylsiloxane and copolymers such as BAD ORIGIN^ • <r _-_- < J i_ _. i__. i __-, <_Jr _. ι ___• -_-. I methylphenyl and dime h lpol siloxane copoiyrae , Exceptionally good properties have been found with EPD -silicones prepared from a poly dimethyl siloxane rubber and 2?DK. The poiyphenyiene oxides with which this invention is concerned are those having the repeating structural unit of the formula: wherein the oxygen ether atom of one unit is connected to the benzene nucleus of the next adjoining unit, n is a positive integer and is at least 50 / and each Q is a onovalent sub- stituent selected from the group consisting of hydrogen, halogen, hydrocarbon radicals free of a tertiary alpha-carbon atom, halo- hydrocarbon radicals having at least two carbon atoms between the halogen atom and the phenyl nucleus and being free of a tertiary alpha-carbon atom, hydrocarbonoxy radicals being free of a tertiary alpha-carbon atom, and halohydrocarbonoxy r≥ciais, having at least 2 carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary alpha-carbon a.os. _Exa=?les of suitable polymers may be found in the above referenced patents of Hay. The preferred poiyphenyiene oxides may be represented by the following formula: BAD ORIGINAL -gfO RE OMPI wherein Q is a monovalent substituent selected from the group consisting of hydrogen, hydrocarbon radicals * free of a tertiary aipha-carbon atom, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary aipha-carbon atom, hydrocarbcncxy radi¬ cals free of a tertiary alpha-carbon atom, and halohydrocarbonoxy radicals having at least two carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary alpha-carbon atom. One but not both Q's can be halogen; and n may represent any whole .integer greater than 50. Typical examples of the monovalent hydrocarbon radi¬ cals that Q may be in the above formula are: alkyl including cycloalkyl, e.g., methyl, ethyl, propyl, butyl, secondary butyl, cyclobutyl, amyl, cyclopentyl, hexyl, cyclσhexyl, methycyclo- hexyl, e hylrlohexyl, octyi, decyl, oc-cadecyl, etc.; alkenyl, including cycloaikenyl, e.g., vinyl, allyl, butenyl, cyciobutenyi, isopenteuyl, cyclopenter.yl, linolyl, e c; alkynyl, e.g., prαpargyL- etc; aryl, including alkaryl, e.g., phenyl tolyl, ethylphenyl, xylyl, naphthyl, methylnaphthyl, etc.; aralkyl, e.g., be syl, phenylethyl, phεnyi ropyi, tolylethyl, etc. The monovalent halo hydrocarbon radicals may be the same as the hydrocarbon radicals, as outlined above, except methyl and alpha-haioaiXyi ra iαals, BAD ORIGINAL wherein one or more of the hydrogen atoms are replaced by halogen, to produce balo ydrocarbσn radi.ca.ls having at least two carbon atoms between the halogen and the free valence, examples of which are: 2-chloroethyl, 2-bromoethyl, 2-fiuoroethyl^ 2,2-dichloroethyl, 2- and 3-bromopro?yi, 2,2-difluoro-3-iodopropyJ_,. 2,3-, and 4-brozπobutyl, 2- , 3-, 4-, and 5-fluoroamyl, 2-chloro- vinyl, 2- and 3- bromoallyl, 2- and 3-fiuoropropargyl, mono-, di- tri-, tetra and pentachlorophenyl, mono-, di-, tri- and tetra- bromotolyl, chloroethylphenyl, ethylchlorophenyl, fluoroxylyl, • ohloronaphthyl, bromobensyl, iodophenylethyl, phenylchloroethyl, bromotolylethyl, etc. Typical examples of the monovalent hydrocarboπoxy radicals are: methoxy, ethoxy, propoxy, isopropoxy, buccxy, secondary butoxy, tertiary butoxy, amcxy, aliyloxy, beπzyloxy, etc., the monovalent halohydrocarboπ radicals .***ay be the sa_xe as the above oxyhydrocarbons, except methoxy and alpha-haloalkoxy radicals, where one or more of the hydrogens are replaced by' a halogen, i.e., fluorine, chlorine, brσπine, or iodine, to pro¬ duce halohydrocarbonoxy radicals, having at least two carbon atoms _between the halogen and the free valence, a few typical examples of which are 2-chloroethoxy, 2-bromoethyoxy, 2-fiuoro- ethoxy, 2,2-dichloroethox , 2- and 3-bromopropoxy, 2,2-difluoro 3-chloropropoxy, 2-, 3-, .and 4-iodobutoxy, 2-chlorovinoxy, and chioroethylphenoxy, ethyiphenoxy, ethyichlorophenoxy, iodoxyloxy, chloroaphthoxy, chlorophenyiethox , phenylchioroethoxy, bromotolylethoxy, etc. Typical examples of poiyphenyiene oxides which may be employed in this invention are: BAD ORIGI 5UECT:7UTΞ SHEET i . poly-(2,6- iπet yl-l,4-phenyieneJoxide, poly-(2,ό-άieth l-1, -phenylene)oxide, poly-(2,6-άibutyl—1,4-phenylene)oxide, poly-(2,ό-dilauryl-l,4-phenylene}oxide, poly-(2,6-dipropyl-l,4-phenylene)oxide, poly-(2,S-dimethoxy, -1,4-phenylene)oxide, poly-(2-* ** .eτ*.hyl-6-phenyl-l,4-phenyiane)oxide, poly-(2-methoxy-δ-ethoxy-i,4-phenylene)oxide, poly-(2,6-di (chlorophenoxy) -1,4-phenylenε)oxide, poly-(2,6-di-(chloroethyl)-1,4-ρhenylene)oxide, poly-{2-methyl-6-isobutyl-l,4-phenylene)oxide, poly (2-6- diphenyl-phenylene)oxide, poly-(2-chloro-6-methyl-l,4-ρhenylene) oxide, etc. The especially preferred poiyphenyiene oxides are those having alkyl groups of 1-4 carbon atoms, disubsti -ed ortho to the oxygen ether atom, i.e., in the formula immediately above, the Q's are each C- j -C. alkyl and most preferably ___athyl. The most preferred poiyphenyiene oxide is, therefore, poly(2,5- dime hyl-1, -phenylene)oxide. The polystyrene resin is one having at least 25 percent by weight, polymer units derived from the compound having the formula: | S ORIGINAL is wherein R is hydrogen, (lower ) alkyl of 1 to 6 carbon atoms, or halogen; 2 is hydrogen, any of the halogens, (lower) alkyl of from 1 to 6 carbon atoms or vinyl and p is a whole number equal to from 0 to 5. The term "styrene resin" as used herein and in the appended claims, and defined by the above formula, includes, by way of illustration, homopolymers, such as homopolystyrene and polychlorostyrane; the modified polystyrenes, sucit as rubber modified high impact polystyrene, and the styrene containing co¬ polymers, such as the styrene-acrylonitrile copolymers (SΛN) , styrene-butadiene copolymers, styrene-acrylonitrile alpha-alky1 styrene copolymers, styrene-acrylonitrile butadiene copolymers (A3S) , poly-alpha-methylstyrene, copolymers of ethylvinylbenzene and divinylbenzene, and the like. The preferred styrene resins is a homopolystyrene such as Dylene 8G polystyrene hon.opolyr_.er sold by Sinclair-Koppers Co. • The EPDM - silicone rubber can be prepared by graft polymerization of ΞPDM with a polyorganosiloxane or silicone mentioned above, as for example, by intimately mixing the re- actants, then heating with a free radical source, for example, benzoyl peroxide or benzene bis-sulfoπyl azide The Ξ?D_-_- silicone may contain up to about 50% of fumed silica. The compositions of the subject invention can be formed, for example, by first dry mixing the components to form a premix, and then passing the premix through an extruder at an elevated temperature, for example, about 500°?. to 600°F. Extrusion has been found to be the preferred manner of' blending the components according to this invention as this method has been found to give the greatest degree of homogeneity. BAD ORIGIN OMPI SUBST TUI C U-'-' The aπount of the E?D-*_-silicone ruboer which may be added to the poiyphenyiene oxide, or the product of poiypheny¬ iene oxide with styrene resin, is that amount of EPDM-silicone rubber which does not cause grass lamination in the molded product. In general, it has been foundthat there can be in¬ corporated up to about 15% by weight of EPDM-silicone rubber, the preferred range being from about 3% to about 12% of ΞΞDM- silicone rubber in the compositions. -It has been found that the poiyphenyiene oxides and the styrene resins are combinable with each other in all pro¬ portions. Consequently, compositions comprising from about 1 to about 15 percent by weight of ΞPDK-silicone rubber from 1 to 99.9 percent by weight of poiyphenyiene ether and fro— 0 to 98 percent by weight styrene resin are included within the scope of this invention. In general, compositions containing from about 1 to about 15 percent of ΞPDM-silicone rubber, from about 30 to about 99% percent of poiyphenyiene oxide and from 0 to about 70 percent styrene resin exhibit the best properties and these compositions are preferred. Also, the compositions can contain up to 30 percent of triarylphosphate, for example triphenyl phosphate, to improve processabiiity and flame re¬ sistance. Description of the Preferred Embodiments - The following examples are sat forth as further illustration of the invention and are not to be construed as limiting the invention thereto. The parts are by weight. BAD OWG1NAL • *___!____„ , ; j - e*»t - —* , . m ΞXAM? 5 I 5 parts of SEP-1720 (an E?DM-silicone rubber manufactured and sold by Shinetsu Chemical Industry) , 78 parts ■of poly(2,6-dimethyl, -1,4-phenylene)oxide having an intrinsic viscosity of 0.47 dl./g. in chloroform at 30 β c., 22 parts of triphenyl phosphate, 0.5 parts of diphenyl decyl phosphite, 0.15 parts of zinc sulfide, and 0.15 parts of zinc oxide were mixed together and blended by extrusion in a Brabencer single- screw extruder, and molded into standard test bars in a one ounce screw injection molding machine, at 520°F. A control blend of the same composition, but without the EPDM-silicone rubber, was extruded and molded in the same way. The control blend had a notched Izod impact strength of 0.9 foot lbs/inch of notch at 73°?., 0.6 foot lbs./inch, at -40°?, tensile elongation of 77 percent, and a heat distortion tempera¬ ture of 213 β F. The composition containing E?DK-silicone rubber had an Izod impact strength of 1.8 foot lbs/inch at 73T., 1.0 foot lbs/inch at -40"F., tensile elongation of 93 percent, and heat distortion temperature of 202 β F. EXAMPLE II 10 parts of SEP-1720 EPDM-silicone rubber, 50 parts of poly-(2-6-dimethyl-l,4-ρhenylene) oxide having an intrinsic viscosity of 0.46 dl./g. in chloroform at 30°C- , 50 parts of Dylene 8G (a polystyrene hotsopoly er manufactured by Sinciair- Koppers Company) ,3 parts of triphenyl phosphate, 1 part of diphenyl decyl phosphite, 0.15 parts of zinc sulfide and 0.15 parts of zinc oxide were mixed and extruded and molded as des¬ cribed n Example 1, together with a control blend of the same BAD ORIGINAL 4 __ I O ϊ E __7_i. - '--.i--,' r _ - 4 .5 f *4-> s - *• — — w m~. i .*"* * -_ rE-- * » *•— 1 • composition but " without the EPDM-silicone rubber. The control had notched Izod impact strength of 0.7 foot lbs/inch of notch at 73 β F., 0.S foot lbs. at -40T., tensile elongation of 17 percent and heat distortion temperature of 240T. The composition containing the EPDM silicone rubber had an Izod impact strength of 1.8 foot lbs/inch at 73 β F., 1.0 foot lbs. at -4Q β E., tensile elongation of 51 percent and heat distortion temperature 236°?. For the polyC2,β-dimethyl-l,4-phenylene) oxide, in the above examples, there may be substituted, respectively, equal weights αf the following: poly(2-meth 1-6-ethy1-1,4-phenylene)oxide; poly(2-4*nethyl-6-propyl-l,4-ρhenylene)oxide; poly(2,6-dipropyl-i 1 4-phenyiene)oxide; poly(2-ethyl-6-propy1-1, -phenylene)oxide; * poly(2,S-diaur l-1,4-phenylen }oxide; poly(2-me hyl-6-benzy1-1,4-phenylene)oxide; poly(2,6-dimethoxy-l, -phenylene)oxide; poly(2,3,δ-triiύethyl-l-4-ρhεnyier.e)oxide; poly(2,S-diethoxy-1,4-phenylene)oxide; poly(2-methoxy-6-ethoxy-l,4-phenylene)oxide; poly(2-ethyl-5-stearyloxy-l,4-phen lene)oxide; poly(2,6-dichloro-l,4-phenyiene)oxide; poly(2,3-άi_-aethyi-5-chioro, 1,4-phenyiene)oxide; poly(2-ιπethyl-ό-phenyl-i,4-phenylane)oxid ; poly(2,6-dibenzyl-i,4-phenylene)oxide; poly(3-chloro-l,4-phenylene)oxide; pol (3 , 5-diethyl-l , -phenylene) oxide; poly (3-ethoxy-l, 4-?henyiene) oxide; BAD ORIGINS C_,Ϊ ι ~ _-τ* —"T ϊ'Ϊ tT -** '. ~ -* iϊ—rτ 4 c4__" .y lihr.pUT i poly(2-chloro-l,4-phen lene)oxide; and poly(2,5-dibromo-l,4-ρhenylene)oxide. Because of their excellent physical, mechanical, chemical, electrical and thermal properties, the polymer products of this invention have many and varied uses. For example, they can be used in molding powder formulations, either alone or mixed with other polymers and may contain various fillers, as well as reinforcements to make molded parts. They can also be used to prepared molded, or extruced articles, films, tapes and the like. The sub ' ject polymers may also be mixed with various fillers, modifying agents, etc. such as dyes, pigments, stabiliz¬ ers, plasticizers, etc. The above mentioned patents, and/or publications are incorporated herein by reference. Obviously, other codifi¬ cations and variations of the present invention are possible, in the light of the above teachings. It is, therefore, to be understood that changes may be made in the particular embodi¬ ments of the invention described which are within the full intended scope of the invention as defined by the appended cl ims. BAD ORIGINAL OMPI _

Claims: Claims 1. A composition comprising: (a) from about 1 to about 15 percent of a graft copolymer of a rubber interpolymer of a mixture of mono-olefins and a polyene with a silicone rubber; (b) from about 30 to about 99 percent by weight of a poiyphenyiene oxide resin; and (c) from 0 to about 70 percent by weight of a styrene resin having at least 25% polymer units derived from the compound having the formula: wherein R is hydrogen, (lower) alkyl or halogen, Z is hydrogen, halogen, (lower) alkyl or vinyl, and p is a whole integer from 1 to 5. 2. The composition of Claim 1, wherein the rubber interpolymer is an interpolymer of ethylene, an alpha-olefin and a polyene. 3. The composition of Claim 2 wherein the alpha- olefin is propylene. 3IJ ORIGINS SUES . TPJ7E SHEET 4. The composition of Claim 1, wherein the silicone rubber is a polyorgaπosiloxane of the formula: wherein R ,1 is alkyl, haloalky, aryl, aralkyl, alkaryl, alkoxy, aryloxy and halogenated derivatives of the aforesaid aryl, aralkyl, alkaryl, alkoxy or aryloxy groups; or akenyl; R- and R 3 are (lower) alkyl,alkenyl, or phenyl; and m is an integer of such value that the polysiloxane is a rubber at ambie-.- temperature. , 5. The composition of Claim 1 wherein the poiyphenyiene oxide is of the formula: wherein the oxygen ether atom of one unit is connected tc the benzene nucleus of the next repeating unit, n is a positive integer and is at least 55. and each Q is a monovalent sub- stituent selected from hydrogen, halogen, hydrocarbon radicals being free of a tertiary alph -carbon atom, halohydrocarbon BAD ORIGINS !A !j _<..£._n. _*-•*-_'*. £ Cm Z°- _r-f i- E t- T OMPI •. V. PO radicals having at least two carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary alpha-carbon_, atom, hydrocarbonoxy radicals being free of a tertiary alpha- carbon atom and halohydrocarbonoxy radicals having at least 2 carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary alpha-carbon atom. 6. The composition < * -f Claim 5, wherein the poiyphenyiene oxide is poly-(2, 5-dimathyl-l,4-phenylene)σxide. 7. The composition of Claim 1 wherein the styrene resin is a homopolystyrene. 8. The composition which comprises: (a) from about 1 to about 15 percent of a graft compoly er of a rubber interpolymer of a mixture of ethylene, propylene and a polyene with a silicone rubber, (b) from about 30 to about 90 percent of poly- (2,6-dimeth 1-1,4-phanylene)oxide, and (c) from 0 to about 70 percent of a homopolystyrene. 9. The composition of Claim 1, which contains up to about 30% of a triaryl phosphate. 10. A molded composition having improved notched Izod impact strength and ductility obtained by molding the composition of Claim 1. 11. A molded composition having improved notched Izod impact strength and ductility ob-ained by molding - e comoosition of Claim 3. S e~:U ι ~ 4 -.Wi- ~~ i i' . ' -m :>"τ ϊ r i~ S *—H . - — 4 —T ■ 12. A process for preparing the composition of Claim 1, which comprises mixing components (a), (b) , and (c) and blending the mixture by ex-rusion. 13. A process according to Claim 12, wherein the blended product is ' molded into any desired shape. BAD ORIGINA

Inventors: COOPER GLENN DALE, KATCHMAN ARTHUR
Applicants: GEN ELECTRIC, GENERAL ELECTRIC CO
Application year: 1981
Main classification: C08G77
IPC codes: C08K5, C08L25, C08L71, C08L83