List of Intel Core processors

The following is a list of Intel Core microprocessors.

Desktop processors

Core 2

"Allendale" (65 nm, 800 MT/s)  
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 Die size: 111 mm2
 Steppings: L2, M0, G0

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)  
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 All models support: Intel VT-x
 Die size: 143 mm2
 Steppings: B2, G0

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)  
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 All models support: Intel VT-x
 All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
 Die size: 143 mm2
 Transistor count: 291 million
 Steppings: B2, G0

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s) 
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Die size: 111 mm2 (Conroe)
 Steppings: ?

"Conroe XE" (65 nm) 

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Die size: 143 mm2
 Steppings: B1, B2
 The X6900 was never publicly released.

"Kentsfield" (65 nm) 

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 Die size: 2 ×143 mm2
 Steppings: B3, G0

"Kentsfield XE" (65 nm) 

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 Die size: 2 ×143 mm2
 Steppings: B3, G0

"Wolfdale-3M" (45 nm, 1066 MT/s) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 Die size: 82 mm2
 Transistor Count: 230 million
 Steppings: M0, R0
 Models with a part number ending in "ML" instead of "M" support Intel VT-x

"Wolfdale" (45 nm, 1333 MT/s) 
All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x , Intel VT-d , Trusted Execution Technology (TXT)
 Die size: 107 mm2
 Transistor Count: 410 million
 Steppings: C0, E0

Note: The E8190 and E8290 do not support Intel VT-d.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm) 
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Intel VT-d , Trusted Execution Technology (TXT) 
 Die size: 2 × 82 mm2
 Steppings: M0, M1, R0
 All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
 Die size: 2 × 107 mm2
 Steppings: C0, C1, E0

"Yorkfield XE" (45 nm) 

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
 Intel VT-d supported by: QX9650
 Die size: 2 × 107 mm2
 Steppings: C0, C1, E0
 The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.

Core i (1st gen)

"Lynnfield" (45 nm) 

Common features:
 All the CPUs support dual-channel DDR3 RAM.
 Socket: LGA 1156
 All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 No integrated graphics.
 K processors have an unlocked multiplier and can be overclocked.

"Bloomfield" (45 nm) 

Common features:
 All the CPUs support triple-channel DDR3 RAM.
 Socket: LGA 1366
 All CPUs feature a QPI bus to the chipset (northbridge).
 Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 No integrated graphics.
 Extreme Edition processors have an unlocked multiplier and can be overclocked.

"Clarkdale" (MCP, 32 nm) 

Common features:
 All the CPUs support dual-channel DDR3 RAM.
 Socket: LGA 1156
 All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors have an unlocked multiplier and can be overclocked.

"Gulftown" (32 nm) 

Common features:
 All the CPUs support triple-channel DDR3 RAM.
 Socket: LGA 1366
 All CPUs feature a QPI bus to the chipset (northbridge).
 Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 No integrated graphics.
 X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (2nd gen)

"Sandy Bridge" (32 nm) 

Common features:
 All the CPUs support dual-channel DDR3 RAM.
 Socket: LGA 1155
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
S processors feature lower-than-normal TDP (65W on 4-core models).
T processors feature an even lower TDP (45W on 4-core models or 35W on 2-core models).
K processors are unlockable and designed for overclocking. Other processors will have limited overclocking due to chipset limitations. K models also do not support Intel TXT, Intel VT-d and vPro.
P processors disable the integrated graphics processor.
 i3-2120, i5-2400, and i7-2600 are available as embedded processors.
 The Core i3-2102, once upgraded via Intel Upgrade Service,  operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Core i (3rd gen)

"Ivy Bridge" (22 nm) 

Common features:
 All the CPUs support dual-channel DDR3 RAM.
 Socket: LGA 1155
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
S processors feature lower-than-normal TDP (65W on 4-core models).
T processors feature an even lower TDP (45W on 4-core models or 35W on 2-core models).
K processors are unlockable and designed for overclocking.
P processors disable the integrated graphics processor.
 i3-3220, i5-3550S and i7-3770 are available as embedded processors.

"Sandy Bridge-E" (32 nm) 

Common features:
 All the CPUs support quad-channel DDR3-1600 RAM.
 Socket: LGA 2011
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 No integrated graphics.
 K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (4th gen)

"Haswell-DT" (22 nm) 

Common features:
 All the CPUs support dual-channel DDR3 RAM.
 Socket: LGA 1150
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
S processors feature lower-than-normal TDP (65W on 4-core models).
T processors feature an even lower TDP (45W on 4-core models or 35W on 2-core models).
K processors are unlockable and designed for overclocking.
 The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

"Haswell-H" (MCP, quad-core, 22 nm) 
Common features:
 All the CPUs support dual-channel DDR3 RAM.
 Socket: BGA 1364 (soldered)
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.

"Ivy Bridge-E" (22 nm) 

Common features:
 All the CPUs support quad-channel DDR3-1866 RAM.
 Socket: LGA 2011
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 No integrated graphics.
 K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (5th gen)

"Broadwell-H" (14 nm) 

Common features:
 All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
 Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.

"Haswell-E" (22 nm) 

Common features:
 All the CPUs support quad-channel DDR4-2133 RAM.
 Socket: LGA 2011-3
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes.
 No integrated graphics.
 K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (6th gen)

"Skylake-S" (14 nm) 

Common features:
 All the CPUs support dual-channel DDR4 or DDR3L RAM.
 Socket: LGA 1151
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors are unlockable and designed for overclocking.

"Skylake-H" (14 nm)  
Common features:
 All the CPUs support dual-channel DDR4 or DDR3L RAM.
 Socket: BGA 1440 (soldered)
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.

"Broadwell-E" (14 nm) 

Common features:
 All the CPUs support quad-channel DDR4-2400 RAM.
 Socket: LGA 2011-3
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes.
 No integrated graphics.
 K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (7th gen)

"Kaby Lake-S" (14 nm) 

Common features:
 All the CPUs support dual-channel DDR4 or DDR3L RAM.
 Socket: LGA 1151
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors are unlockable and designed for overclocking.

"Skylake-X" (7xxx) 

Common features:
 All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
 Socket: LGA 2066
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes.
 No integrated graphics.
 X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

"Kaby Lake-X" (14 nm) 

Common features:
 All the CPUs support quad-channel DDR4-2666 RAM.
 Socket: LGA 2066
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 All CPUs provide 16 lanes of PCIe 3.0.
 No integrated graphics.
 X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (8th gen)

"Coffee Lake-S" 
Common features:
 All the CPUs support dual-channel DDR4 RAM.
 Socket: LGA 1151-2
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors are unlockable and designed for overclocking.

Core i (9th gen)

"Coffee Lake-R" 

Common features:
 All the CPUs support dual-channel DDR4 RAM.
 Socket: LGA 1151-2
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors are unlockable and designed for overclocking.
 i9-9900KS has all-core boost clock of 5.0 GHz.

"Skylake-X" (9xxx) 

Common features:
 All the CPUs support quad-channel DDR4-2666 RAM.
 Socket: LGA 2066
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 All CPU models provide 44 lanes of PCIe 3.0.
 No integrated graphics.
 X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

"Coffee Lake-H" (14 nm)

Core i (10th gen)

"Comet Lake-S" (14 nm) 

Common features:
 All the CPUs support dual-channel DDR4 RAM.
 Socket: LGA 1200
 All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors are unlockable and designed for overclocking.
 i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

"Comet Lake-S" (refresh) 

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:
 All the CPUs support dual-channel DDR4 RAM.
 Socket: LGA 1200
 All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 K processors are unlockable and designed for overclocking.
 All models support Turbo Boost 2.0.

"Cascade Lake-X" (10xxx) 

Common features:
 All the CPUs support quad-channel DDR4-2933 RAM.
 Socket: LGA 2066
 All CPUs feature a DMI 3.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 All CPU models provide 48 lanes of PCIe 3.0.
 No integrated graphics.
 X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Core i (11th gen)

"Rocket Lake-S" (14 nm) 

Common features:
 All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.
 Socket: LGA 1200
 All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
 L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
 L2 cache: 512 KB per core.
 K processors are unlockable and designed for overclocking.
 i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core i (12th gen)

"Alder Lake-S" (Intel 7) 

 All the CPUs support dual-channel DDR4-3200 RAM and DDR5-4800 RAM
 Socket: LGA 1700
 All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 L1 cache:
 P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 L2 cache:
 P-cores: 1.25 MB per core.
 E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
 All the CPUs provide 16 PCIe 5.0 lanes and 4 PCIe 4.0 lanes, but support may vary depending on motherboard and chipsets.
 K-suffix processors are unlockable and designed for overclocking.
 i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core i (13th gen)

"Raptor Lake-S" (Intel 7) 

 All the CPUs support dual-channel DDR4-3200 RAM and DDR5-5600 RAM
 Socket: LGA 1700
 All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 L1 cache:
 P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 L2 cache:
 P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
 E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
 All the CPUs provide 16 PCIe 5.0 lanes and 4 PCIe 4.0 lanes, but support may vary depending on motherboard and chipsets.
 K-suffix processors are unlockable and designed for overclocking.
 i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core i (14th gen)

Raptor Lake-S Refresh 

 All the CPUs support dual-channel DDR4-3200 RAM and DDR5-5600 RAM
 Socket: LGA 1700
 All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
 L1 cache:
 P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
 E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
 L2 cache:
 P-cores: 2 MB per core.
 E-cores: 4 MB per E-core cluster.
 All the CPUs provide 16 PCIe 5.0 lanes and 4 PCIe 4.0 lanes, but support may vary depending on motherboard and chipsets.
 K-suffix processors are unlockable and designed for overclocking.
 i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Mobile processors

Core

"Yonah"

Core 2

"Merom-L" (65 nm)  

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Die size: 81 mm2
 Steppings: A1

"Merom", "Merom-2M" (standard-voltage, 65 nm)  

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
 Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
 Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
 Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
 Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
 Die size: 143 mm2 (Merom), 111 mm2 (Merom-2M)
 Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
 All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm) 

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
 Die size: 143 mm2
 Steppings: B2, E1, G0, G2

"Merom-2M" (ultra-low-voltage, 65 nm) 

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
 Die size: 111 mm2
 Steppings: L2, M0

"Merom XE" (65 nm)  

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
 Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
 Die size: 143 mm2
 Steppings: E1, G0

"Penryn-L" (45 nm)  

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
 Die size: 82 mm2
 228 million transistors
 Package size: 22 mm × 22 mm
 Steppings: M0, R0

"Penryn" (Apple iMac specific, 45 nm) 

 Die size: 107 mm2
 The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
 Steppings: C0, E0

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)  

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)
 T6570, T6670, all T8xxx and T9xxx models support Intel VT-x
 All T9xxx models support Trusted Execution Technology (TXT)
 T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.
Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.
 Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M)
 Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)  

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450), Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 Select Apple subsets of P7000 series processors support Intel VT-x.
 Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
 Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M)
 Package size: 35 mm × 35 mm
 Transistors: 410 million 
 Steppings: (Core microarchitecture 45nm steppings) 
C0, E0 (Penryn) 
M0, R0 (Penryn-3M)
stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 Die size: 107 mm2
 Package size: 22 mm × 22 mm
 Steppings: C0, E0

"Penryn" (low-voltage, 45 nm, Small Form Factor) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
 Die size: 107 mm2
 Package size: 22 mm × 22 mm
 Steppings: C0, E0

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
 Die size: 107 mm2
 Package size: 22 mm × 22 mm
 Steppings: M0, R0

"Penryn XE" (45 nm)  

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Penryn XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s and 533–1066 MT/s.
 Die size: 107 mm2
 Steppings: C0, E0

"Penryn QC" (45 nm)  

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
 Die size: 2 × 107 mm2
 Steppings: E0

"Penryn QC XE" (45 nm)  

 This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
 Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
 Package size: 35 mm × 35 mm
 Die size: 2 × 107 mm2
 Steppings: E0

Core i (1st gen)

"Clarksfield" 

Common features:
 All the CPUs support dual-channel DDR3-1333 RAM.
 Socket: G1
 All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 No integrated graphics.
 XM processors have an unlocked multiplier and can be overclocked.

"Arrandale" 

Common features:
 All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
 Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
 All CPUs feature a DMI 1.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.

Core i (2nd gen)

"Sandy Bridge" 

Common features:
 All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
 Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 XM-suffix models have an unlocked multiplier and can be overclocked.

Core i (3rd gen)

"Ivy Bridge" 

Common features:
 All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
 Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 XM-suffix models have an unlocked multiplier and can be overclocked.

Core i (4th gen)

"Haswell-MB" 

Common features:
 All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
 Socket: G3.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 MX-suffix models have an unlocked multiplier and can be overclocked.

"Haswell-ULT" 

Common features:
 All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
 Socket: BGA 1168.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.

"Haswell-ULX" 

Common features:
 All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
 Socket: BGA 1168.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.

"Haswell-H" 

Common features:
 All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
 Socket: BGA 1364.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
 i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Core i (5th gen)

"Broadwell-U" 

Common features:
 All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
 Socket: BGA 1168.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.

"Broadwell-H" 

Common features:
 All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
 Socket: BGA 1364.
 All CPUs feature a DMI 2.0 bus to the chipset (PCH).
 L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
 L2 cache: 256 KB per core.
 Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.

Core i (6th gen)

"Skylake-U" (14 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down (except 6006U)
 i5s and up support Turbo Boost
 All i7s support Intel TSX-NI
 Core i5 models 6300U and higher also support Intel vPro, Intel TXT, and Intel TSX-NI.
 Core i7 models 6600U and higher also support Intel vPro, Intel TXT.

"Skylake-H" (MCP, 14 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, Smart Cache.
 i3s and i7s have Hyper-threading, Intel TSX-NI
 i5s and up have Turbo Boost and configurable TDP (cTDP) down (45W→35W).
 Die size: 122 mm (i7s)
 Embedded models support ECC memory
 Non-embedded i5 models also support .
 Core i5-6440HQ also supports Intel TXT.
 Embedded models also support Intel vPro, Intel TXT.
 Core i5-6440EQ supports ECC memory.
 Core i7-6820HQ, Core i7-6920HQ, and embedded models also support Intel vPro, Intel TXT.
 Core i7-6820HK, Core i7-6820HQ, Core i7-6920HQ, and embedded models also support Intel TSX-NI.
 Core i7-6820HK features an unlocked multiplier, allowing it to be overclocked.

Core i (7th gen)

"Kaby Lake-U" (14 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down (except 7020U).
 i5s and up support Turbo Boost
 Low power models i5-7300U and i5-7360U also support Intel vPro, Intel TXT.

"Kaby Lake-H" (14 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache.
 i3s and i7s support Hyper-threading.
 i5s and up support Turbo Boost, Intel TSX-NI, and configurable TDP (cTDP) down.
 i5-7400 and up also support Intel vPro, Intel TXT.
 i7-7800 and up also support Intel TSX-NI
 i7-7820HQ, i7-7920HQ and embedded models also support Intel vPro, Intel TXT.
i7-7820HK features an unlocked multiplier, allowing it to be overclocked.

"Kaby Lake-Y" (14 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, Intel TSX-NI, and configurable TDP (cTDP).
 i5-7Y57, and all i7 models also support Intel vPro, Intel TXT.

Core i (8th gen)

"Coffee Lake-U" (14 nm)

"Coffee Lake-H" (14 nm) 

 No support for AVX-512
 Overclocking: unlocked multiplier on HK models; locked multiplier on H models.
 Thermal Velocity Boost available on i7 and up.

"Coffee Lake-B" (14 nm)

"Kaby Lake Refresh" (14 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

"Kaby Lake-G" (14 nm)

"Amber Lake-Y" (14 nm)

"Whiskey Lake-U" (14 nm)

"Cannon Lake-U" (10 nm)

Core i (9th gen)

"Coffee Lake-H" 

 No support for AVX-512
 Overclocking: unlocked multiplier on HK models; locked multiplier on H models.
 Thermal Velocity Boost available on i7 and up.

Core i (10th gen)

"Comet Lake-U" (14 nm) 

 i5-10310U also supports Intel vPro, Intel TXT.
 i7-10610U, 10810U also support Intel vPro.

"Comet Lake-H" (14 nm) 

 No support for AVX-512
 i9-10885H also supports Intel vPro, Intel TXT.
 i9-10885H supports cTDP down to 35 W; 19-10980HK supports cTDP up to 65 W.

"Ice Lake-U" (10 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, FMA3, SGX, Speed Shift Technology (SST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, and configurable TDP (cTDP).
 SHA supported on i5s

"Ice Lake-Y" (10 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, FMA3, SGX, Speed Shift Technology (SST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, and configurable TDP (cTDP) (except 1000NG4).
 SHA supported on i5s.

"Amber Lake-Y" (10xxx) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) up and down.

Core i (11th gen)

"Tiger Lake-UP3" (10 nm SuperFin) 

 All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6 (except SRK08, SRK02), TB4, and configurable TDP (cTDP).
 SHA supported on i5 and up.
 1145 also supports Intel vPro, Intel TXT.
 1185G7, 1185G7E and 1185GRE also support Intel vPro, Intel TXT.
 -RE models support ECC memory.

"Tiger Lake-UP4" (10 nm SuperFin) 

 All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4, and configurable TDP (cTDP).
 SHA supported on i5s.
 1140 and 1180 also supports Intel vPro, Intel TXT.

"Tiger Lake-H" (10 nm SuperFin) 

 All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4, and configurable TDP (cTDP).
 SHA supported on i5s.
 11850H also supports Intel vPro, Intel TXT.

"Tiger Lake-H35" (10 nm SuperFin) 

 All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4, and configurable TDP (cTDP).
 SHA supported on i5s

"Tiger Lake-B" (10 nm SuperFin) 

|}

Core i (12th gen)

"Alder Lake-U" (Intel 7) 
 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, IPU6 (except SRLFU, SRLFR), TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i5 model numbers 1240 and higher also support Intel vPro, Intel TXT, and XD bit.
 All i7s support XD bit (an NX bit implementation), model numbers 1260 and higher also support Intel vPro and Intel TXT.
 Support 20 lanes (UP3) or 14 lanes (UP4) of PCI Express 4.0/3.0.
 All models support up to LPDDR5-5200 or LPDDR4X-4266 memory.
 Standard power models also support up to DDR5-4800 or DDR4-3200 memory.

"Alder Lake-P" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, IPU6, TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i5s support SHA. 1250 also supports Intel vPro, Intel TXT, and XD bit.
 i7s support XD bit (an NX bit implementation). Model numbers 1270 and higher also support Intel vPro and Intel TXT.
 All models support up to DDR5-4800, LPDDR5-5200, DDR4-3200, or LPDDR4X-4266 memory, and 20 lanes of PCI Express 4.0/3.0.

"Alder Lake-PS" (Intel 7) 

While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.

"Alder Lake-H" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i5s support Turbo Boost at 2.0, i7s and i9s at 3.0.
 i5s support SHA
 All models support up to DDR5-4800, LPDDR5-5200, DDR4-3200, or LPDDR4X-4266 memory, and 28 lanes of PCI Express 5.0/4.0.
 Embedded models also support configurable TDP (cTDP) down.
 Overclocking: unlocked multiplier on HK models; locked multiplier on H models.

"Alder Lake-HX" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 3.0, AES-NI, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i5s support SHA
 All models support up to DDR5-4800 or DDR4-3200 memory, and 20 lanes of PCI Express 5.0/4.0.
 12600HX, 12850HX and 12950HX also support Intel vPro, Intel TXT.
 12950HX supports ECC memory.
 Overclocking: partial on i9-12950HX, full on i9-12900HX.

"Alder Lake-N" (Intel 7) 

All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, AES-NI, IPU6, and GNA 3.0.
 All models support up to DDR5-4800, LPDDR5-4800, or DDR4-3200, and 9 lanes of PCI Express 3.0.

Core i (13th gen)

"Raptor Lake-U" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, IPU6 (except SRLFU), TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i7s support XD bit (an NX bit implementation)
 1365U, 1365UE and 1355U also support Intel vPro and Intel TXT.
 Intel Thermal Velocity Boost is not supported on Raptor Lake-U mobile processors.
 Support 20 lanes (UP3) of PCI Express 4.0/3.0.
 1315U and 1305U support up to LPDDR5-5200 memory, while 1315UE support up to LPDDR5-5200 memory.
 All models support up to LPDDR4X-4266 memory.
 Standard power models also support up to DDR5-5200 or DDR4-3200 memory.
 All i7 models support up to DDR5-5200, LPDDR5-6400, DDR4-3200, or LPDDR4X-4266 memory, and 20 lanes of PCI Express 4.0/3.0.

"Raptor Lake-P" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, IPU6, TB4, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i7s support XD bit (an NX bit implementation)
 1370P, 1360P and 1370PE also support Intel vPro and Intel TXT.
 All models support up to DDR5-5200, LPDDR5-5200, DDR4-3200, or LPDDR4X-4266 memory, and 20 lanes of PCI Express 4.0/3.0.

"Raptor Lake-H" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i7s support Turbo Boost at 3.0, and IPU6.
 i9s support Turbo Boost at 3.0, and Intel TXT.
 All models support up to DDR5-5200, LPDDR5-6400, DDR4-3200, or LPDDR4X-4266 memory, and 28 lanes of PCI Express 5.0/4.0.
 Overclocking: unlocked multiplier on HK models; locked multiplier on H models.
 13900H/HK also support Intel vPro.

"Raptor Lake-PX" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 3.0, AES-NI, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 i7s support IPU6
 i9s support Intel TXT
 All models support up to DDR5-5200, LPDDR5-6400, DDR4-3200, or LPDDR4X-4266 memory, and up to 28 lanes of PCI Express 5.0/4.0.

"Raptor Lake-HX" (Intel 7) 

 All models support: SSE4.1, SSE4.2, AVX, AVX2, FMA3, Speed Shift Technology (SST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 3.0, AES-NI, Smart Cache, Thread Director, DL Boost, and GNA 3.0.
 All models support up to DDR5-4800 or DDR4-3200 memory, up to 16 lanes of PCI Express 5.0, and up to 4 lanes of PCI Express 4.0.
 i9s support DDR5 speeds at 5600 MT/s.
 All models support CPU, GPU, and memory overclocking.
 i7-13850HX and i9-13950HX also support Intel vPro and ECC memory.

Embedded processors

Core i (2nd gen)

"Gladden" (32 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, EPT, Hyper-threading, Smart Cache, ECC memory.
 Transistors:
 Die size:

Core i (3rd gen)

"Gladden" (22 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, EPT, Hyper-threading, Smart Cache, ECC memory.
 Transistors:
 Die size:

See also 
 List of Intel Pentium M microprocessors
 List of Intel Celeron microprocessors
 List of Intel Pentium processors
 Intel Core
 Intel Core 2
 Comparison of Intel processors
 Enhanced Pentium M (microarchitecture)
 Intel Core (microarchitecture)
 Penryn (microarchitecture)
 Alder Lake (microprocessor)

Notes

References 

ATI provides pointer to Intel's 'Allendale', May 23, 2006
Rumoured prices and specifications for Intel Core 2, May 30, 2006
TGDaily indicates leaked release dates, July 24, 2006
Intel to unveil five Merom CPUs in July, paper says as re-reported by DigiTimes, July 17, 2006
Intel Unveils World's Best Processor, July 27, 2006
Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip, July 16, 2007
CORE 2 DUO 1333 MHZ STEPPING, July 18, 2007

External links 
 Search MDDS Database
 Intel ARK Database
SSPEC/QDF Reference (Intel)
Intel® Processor Names, Numbers and Generation List
 Intel CPU Transition Roadmap 2008-2013
 Intel Desktop CPU Roadmap 2004-2011
 Intel Core Solo mobile processor product order code table
 Intel Core Duo mobile processor product order code table
 Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet
 Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update
Intel Core 2 Duo Processors Technical Documents
 Intel Core i3 desktop processor product order code table
 Intel Core i3 mobile processor product order code table
 Intel Core i5 desktop processor product order code table
 Intel Core i5 mobile processor product order code table
 Intel Core i7 desktop processor product order code table
 Intel Core i7 mobile processor product order code table
 Intel Core i7 desktop processor Extreme Edition product order code table
 Intel Core i7 mobile processor Extreme Edition product order code table
 Intel's Core i7 web page
 Intel's Core i7 Extreme Edition web page
 Intel's Core i7 Processor Numbers
 Intel's Core i7 Extreme Edition Processor Numbers
 Intel Corporation – Processor Price List
 Intel Corporation – Processor Price List
 Intel Core X-series processors

Core
Core 2
Core i3
Core i5
Core i7
Core i9
Intel Core
Intel Core 2
Intel Core i3
Intel Core i5
Intel Core i7
Intel Core i9