# Patent

## Title
Semiconductor device and method for manufacturing the same

## Abstract

A semiconductor device is formed in such a manner that a first insulator, a first oxide semiconductor, and a first conductor are formed; the first conductor is processed to form a second conductor; the first oxide semiconductor is processed to form a second oxide semiconductor; a second insulator is formed over the second conductor; a third insulator is formed over the second insulator; a fourth insulator is formed over the third insulator; the fourth insulator, the third insulator, the second insulator, and the second conductor are selectively processed to partly expose the second oxide semiconductor; a fifth insulator is formed over the second oxide semiconductor and the fourth insulator; and a third conductor is formed over the fifth insulator and then chemical mechanical polishing treatment is performed to expose a top surface of the fourth insulator.

## Background
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to, for example, a transistor and a semiconductor device. The present invention relates to, for example, a method for manufacturing a transistor and a semiconductor device. The present invention relates to, for example, a display device, a light-emitting device, a lighting device, a power storage device, a memory device, an imaging device, a processor, and an electronic device. The present invention relates to a method for manufacturing a display device, a liquid crystal display device, a light-emitting device, a memory device, an imaging device, and an electronic device. The present invention relates to a driving method of a display device, a liquid crystal display device, a light-emitting device, a memory device, an imaging device, or an electronic device.
Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, and a manufacturing method. In addition, one embodiment of the present invention relates to a process, a machine, manufacture, or a composition of matter.
In this specification and the like, a semiconductor device generally means a device that can function by utilizing semiconductor characteristics. A display device, a light-emitting device, a lighting device, an electro-optical device, a semiconductor circuit, and an electronic device include a semiconductor device in some cases.
2. Description of the Related Art
A technique for forming a transistor by using a semiconductor over a substrate having an insulating surface has attracted attention. The transistor is applied to a wide range of semiconductor devices such as an integrated circuit and a display device. Silicon is known as a semiconductor applicable to a transistor.
As silicon which is used as a semiconductor of a transistor, either amorphous silicon or polycrystalline silicon is used depending on the purpose. For example, in the case of a transistor included in a large display device, it is preferable to use amorphous silicon, which can be used to form a film on a large substrate with the established technique. On the other hand, in the case of a transistor included in a high-performance display device where driver circuits are formed over the same substrate, it is preferred to use polycrystalline silicon, which can form a transistor having high field-effect mobility. As a method for forming polycrystalline silicon, high-temperature heat treatment or laser light treatment which is performed on amorphous silicon has been known.
In recent years, transistors using oxide semiconductors (typically, In—Ga—Zn oxide) have been actively developed.
Oxide semiconductors have been researched since early times. In 1988, there was a disclosure of a crystal In—Ga—Zn oxide that can be used for a semiconductor element (see Patent Document 1). In 1995, a transistor using an oxide semiconductor was invented, and its electrical characteristics were disclosed (see Patent Document 2).
In 2014, it was reported that a transistor including a crystalline In—Ga—Zn oxide has more excellent electrical characteristics and higher reliability than a transistor including an amorphous In—Ga—Zn oxide (see Non-Patent Document 1). Non-Patent Document 1 reports that a crystal boundary is not clearly observed in an In—Ga—Zn oxide including a c-axis aligned crystalline oxide semiconductor (CAAC-OS).
REFERENCE
Patent Document


    [Patent Document 1] Japanese Published Patent Application No. S63-239117
    [Patent Document 2] Japanese Translation of PCT International Application No. H11-505377


Non-Patent Document


    [Non-Patent Document 1] S. Yamazaki, The Electrochemical Society Transactions, 2014, vol. 64(10), pp. 155-164


SUMMARY OF THE INVENTION
In miniaturization of a semiconductor element, the parasitic capacitance in a transistor and in the vicinity of the transistor is a major problem.
In the case where parasitic capacitance exists in a channel (e.g., between a source electrode and a drain electrode) and the vicinity of the channel, a time for charging the parasitic capacitance is needed in the transistor operation; thus, not only the responsiveness of the transistor but the responsiveness of the semiconductor device is lowered.
It becomes more difficult to control various steps of manufacturing transistors (in particular, film formation, processing, and the like) as the miniaturization advances, and variations due to manufacturing steps significantly affect transistor characteristics and reliability.
An object of one embodiment of the present invention is to provide a miniaturized transistor. Another object is to provide a transistor with low parasitic capacitance. Another object is to provide a transistor with high frequency characteristics. Another object is to provide a transistor with favorable electrical characteristics. Another object is to provide a transistor having stable electrical characteristics. Another object is to provide a transistor having low off-state current. Another object is to provide a novel transistor. Another object is to provide a semiconductor device including the transistor. Another object is to provide a semiconductor device that operates at high speed. Another object is to provide a novel semiconductor device. Another object is to provide a module including any of the above semiconductor devices. Another object is to provide an electronic device including any of the above semiconductor devices or the module.
Another object is to provide a semiconductor device including the transistor. Another object is to provide a display device including the semiconductor device. Another object is to provide a display module including the display device. Another object is to provide an electronic device including the semiconductor device, the display device, or the display module. Another object is to provide a novel semiconductor device. Another object is to provide a novel display device. Another object is to provide a novel display module. Another object is to provide a novel electronic device.
Note that the descriptions of these objects do not disturb the existence of other objects. In one embodiment of the present invention, there is no need to achieve all the objects. Other objects will be apparent from and can be derived from the description of the specification, the drawings, the claims, and the like.
One embodiment of the present invention is a method for manufacturing a semiconductor device including steps of: forming a first insulator; forming a first oxide semiconductor over the first insulator; forming a first conductor over the first oxide semiconductor; processing the first conductor to form a second conductor; processing the first oxide semiconductor to form a second oxide semiconductor; forming a second insulator over the second conductor; forming a third insulator over the second insulator; forming a fourth insulator over the third insulator; selectively processing the fourth insulator to partly expose the third insulator; selectively processing the exposed third insulator to partly expose the second insulator; selectively processing the exposed second insulator to partly expose the second conductor; selectively processing the exposed second conductor to partly expose the second oxide semiconductor; forming a fifth insulator over the second oxide semiconductor and the fourth insulator; and forming a third conductor over the fifth insulator and then performing chemical mechanical polishing treatment to expose a top surface of the fourth insulator.
Another embodiment of the present invention is a method for manufacturing a semiconductor device including steps of: forming a first insulator; forming a first oxide semiconductor over the first insulator; processing the first oxide semiconductor to form a second oxide semiconductor; forming a first conductor over the second oxide semiconductor; processing the first conductor to form a second conductor; forming a second insulator over the second conductor; forming a third insulator over the second insulator; forming a fourth insulator over the third insulator; selectively processing the fourth insulator to partly expose the third insulator; selectively processing the exposed third insulator to partly expose the second insulator; selectively processing the exposed second insulator to partly expose the second conductor; selectively processing the exposed second conductor to partly expose the second oxide semiconductor; forming a fifth insulator over the second oxide semiconductor and the fourth insulator; and forming a third conductor over the fifth insulator and then performing chemical mechanical polishing treatment to expose a top surface of the fourth insulator.
Another embodiment of the present invention is a method for manufacturing a semiconductor device including steps of: forming a first insulator; forming a first oxide semiconductor over the first insulator; forming a first conductor over the first oxide semiconductor; processing the first conductor to form a second conductor; processing the first oxide semiconductor to form a second oxide semiconductor; forming a second insulator over the second conductor; forming a third insulator over the second insulator; selectively processing the third insulator to partly expose the second insulator; selectively processing the exposed second insulator to partly expose the second conductor; selectively processing the exposed second conductor to partly expose the second oxide semiconductor; forming a sacrifice layer over the exposed second oxide semiconductor and the third insulator and then performing chemical mechanical polishing treatment to expose a top surface of the third insulator; forming a fourth insulator over the third insulator and the sacrifice layer; selectively processing the fourth insulator to expose a top surface of the sacrifice layer; processing the sacrifice layer to partly expose the second oxide semiconductor; forming a fifth insulator over the second oxide semiconductor and the fourth insulator; and forming a third conductor over the fifth insulator and then performing chemical mechanical polishing treatment to expose a top surface of the fourth insulator.
In each of the above embodiments, after the formation of the fifth insulator, a third oxide semiconductor may be formed over the fifth insulator, and the third conductor may be formed over the third oxide semiconductor.
In each of the above embodiments, the first oxide semiconductor may have a stacked-layer structure including two or more layers.
In each of the above embodiments, the second insulator may be an insulator with a surface planarized by chemical mechanical polishing treatment.
In each of the above embodiments, the third conductor may have a stacked-layer structure including two or more layers.
In each of the above embodiments, the third conductor may include copper.
Another embodiment of the present invention is a semiconductor device including a first insulator over a substrate; a first semiconductor over the first insulator; a second semiconductor over the first semiconductor; a first conductor and a second conductor over the second semiconductor; a second insulator over the first insulator, the first conductor, and the second conductor; a third insulator over the second insulator; a fourth insulator over the third insulator; a third semiconductor over the second semiconductor; a fifth insulator over the third semiconductor; and a third conductor over the fifth insulator. The area of a top surface of the third conductor is larger than that of a bottom surface thereof when seen from the above. The third insulator has a higher relative dielectric constant than the second insulator.
In the above embodiment, the third conductor may have a stacked-layer structure including two or more layers.
In each of the above embodiments, the third conductor may include copper.
A miniaturized transistor can be provided. A transistor with small parasitic capacitance can be provided. A transistor with high frequency characteristics can be provided. A transistor with favorable electrical characteristics can be provided. A transistor with stable electrical characteristics can be provided. A transistor with low off-state current can be provided. A novel transistor can be provided. A semiconductor device including the transistor can be provided. A semiconductor device which can operate at high speed can be provided. A novel semiconductor device can be provided. A module including the semiconductor device can be provided. An electronic device including the semiconductor device or the module can be provided.
A semiconductor device including the transistor can be provided. A display device including the semiconductor device can be provided. A display module including the display device can be provided. An electronic device including the semiconductor device, the display device, or the display module can be provided. A novel semiconductor device can be provided. A novel display device can be provided. A novel display module can be provided. A novel electronic device can be provided.
Note that the description of these effects does not disturb the existence of other effects. One embodiment of the present invention does not necessarily achieve all the effects listed above. Other effects will be apparent from and can be derived from the description of the specification, the drawings, the claims, and the like.



BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A to 1C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 2A to 2C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 3A to 3C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 4A to 4C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 5A to 5C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 6A to 6C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 7A to 7C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 8A to 8D are cross-sectional views each illustrating a transistor of one embodiment of the present invention.
FIG. 9 is a band diagram of a transistor of one embodiment of the present invention.
FIGS. 10A to 10D are Cs-corrected high-resolution TEM images of a cross section of a CAAC-OS and a cross-sectional schematic view of a CAAC-OS.
FIGS. 11A to 11D are Cs-corrected high-resolution TEM images of a plane of a CAAC-OS.
FIGS. 12A to 12C show structural analysis of a CAAC-OS and a single crystal oxide semiconductor by XRD.
FIGS. 13A and 13B show electron diffraction patterns of a CAAC-OS.
FIG. 14 shows a change in crystal part of an In—Ga—Zn oxide induced by electron irradiation.
FIGS. 15A to 15C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 16A to 16C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 17A to 17C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 18A to 18C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 19A to 19C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 20A to 20C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 21A to 21C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 22A to 22C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 23A to 23C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 24A to 24C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 25A to 25C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 26A to 26C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 27A to 27C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 28A and 28B are each a circuit diagram of a memory device of one embodiment of the present invention.
FIG. 29 is a cross-sectional view illustrating a semiconductor device of one embodiment of the present invention.
FIG. 30 is a cross-sectional view illustrating a semiconductor device of one embodiment of the present invention.
FIGS. 31A and 31B are each a circuit diagram of a semiconductor device of one embodiment of the present invention.
FIG. 32 is a block diagrams illustrating a CPU of one embodiment of the present invention.
FIG. 33 is a circuit diagram of a memory element of one embodiment of the present invention;
FIGS. 34A to 34C are a top view and circuit diagrams of a display device of one embodiment of the present invention;
FIGS. 35A to 35F each illustrate an electronic device of one embodiment of the present invention.
FIGS. 36A to 36C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 37A to 37C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.
FIGS. 38A to 38C are a top view and cross-sectional views illustrating a transistor of one embodiment of the present invention.



DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the description below, and it is easily understood by those skilled in the art that modes and details disclosed herein can be modified in various ways. Furthermore, the present invention is not construed as being limited to description of the embodiments. In describing structures of the present invention with reference to the drawings, common reference numerals are used for the same portions in different drawings. Note that the same hatched pattern is applied to similar parts, and the similar parts are not especially denoted by reference numerals in some cases.
Note that the size, the thickness of films (layers), or regions in drawings is sometimes exaggerated for simplicity.
A voltage usually refers to a potential difference between a given potential and a reference potential (e.g., a source potential or a ground potential (GND)). A voltage can be referred to as a potential and vice versa. In general, a potential (a voltage) is relative and is determined depending on the difference relative to a reference potential. Therefore, even a “ground potential,” for example, is not necessarily 0 V. For example, in some cases, a “ground potential” is the lowest potential in a circuit. In other cases, a “ground potential” is a moderate potential in a circuit. In those cases, a positive potential and a negative potential are set using the potential as a reference.
In this specification and the like, when it is explicitly described that X and Y are connected, the case where X and Y are electrically connected, the case where X and Y are functionally connected, and the case where X and Y are directly connected are included therein. Accordingly, another element may be provided between elements having a connection relation illustrated in drawings and texts, without being limited to a predetermined connection relation, for example, the connection relation illustrated in the drawings and the texts.
Note that the ordinal numbers such as “first” and “second” in this specification are used for convenience and do not denote the order of steps or the stacking order of layers. Therefore, for example, the term “first” can be replaced with the term “second”, “third”, or the like as appropriate. In addition, the ordinal numbers in this specification and the like do not correspond to the ordinal numbers which specify one embodiment of the present invention in some cases.
Note that an impurity in a semiconductor refers to, for example, elements other than the main components of a semiconductor layer. For example, an element with a concentration of lower than 0.1 atomic % is an impurity. When an impurity is contained, the density of states (DOS) may be formed in a semiconductor, the carrier mobility may be decreased, or the crystallinity may be decreased, for example. In the case where the semiconductor is an oxide semiconductor, examples of an impurity which changes characteristics of the semiconductor include Group 1 elements, Group 2 elements, Group 14 elements, Group 15 elements, and transition metals other than the main components; specifically, there are hydrogen (included in water), lithium, sodium, silicon, boron, phosphorus, carbon, and nitrogen, for example. In the case of an oxide semiconductor, oxygen vacancy may be formed by entry of impurities such as hydrogen. Furthermore, when the semiconductor is silicon layer, examples of an impurity which changes the characteristics of the semiconductor include oxygen, Group 1 elements except hydrogen, Group 2 elements, Group 13 elements, and Group 15 elements.
Note that the channel length refers to, for example, a distance between a source (a source region or a source electrode) and a drain (a drain region or a drain electrode) in a region where a semiconductor (or a portion where a current flows in a semiconductor when a transistor is on) and a gate electrode overlap with each other or a region where a channel is formed in a top view of the transistor. In one transistor, channel lengths in all regions are not necessarily the same. In other words, the channel length of one transistor is not limited to one value in some cases. Therefore, in this specification, the channel length is any one of values, the maximum value, the minimum value, or the average value in a region where a channel is formed.
The channel width refers to, for example, the length of a portion where a source and a drain face each other in a region where a semiconductor (or a portion where a current flows in a semiconductor when a transistor is on) and a gate electrode overlap with each other, or a region where a channel is formed, in a top view. In one transistor, channel widths in all regions are not necessarily the same. In other words, the channel width of one transistor is not limited to one value in some cases. Therefore, in this specification, a channel width is any one of values, the maximum value, the minimum value, or the average value in a region where a channel is formed.
Note that depending on transistor structures, a channel width in a region where a channel is formed actually (hereinafter referred to as an effective channel width) is different from a channel width shown in a top view of a transistor (hereinafter referred to as an apparent channel width) in some cases. For example, in a transistor having a three-dimensional structure, an effective channel width is greater than an apparent channel width shown in a top view of the transistor, and its influence cannot be ignored in some cases. For example, in a miniaturized transistor having a three-dimensional structure, the proportion of a channel region formed in a side surface of a semiconductor is high in some cases. In that case, an effective channel width obtained when a channel is actually formed is greater than an apparent channel width shown in the top view.
In a transistor having a three-dimensional structure, an effective channel width is difficult to measure in some cases. For example, to estimate an effective channel width from a design value, it is necessary to assume that the shape of a semiconductor is known as an assumption condition. Therefore, in the case where the shape of a semiconductor is not known accurately, it is difficult to measure an effective channel width accurately.
Therefore, in this specification, in a top view of a transistor, an apparent channel width that is a length of a portion where a source and a drain face each other in a region where a semiconductor and a gate electrode overlap with each other is referred to as a surrounded channel width (SCW) in some cases. Furthermore, in this specification, in the case where the term “channel width” is simply used, it may denote a surrounded channel width and an apparent channel width. Alternatively, in this specification, in the case where the term “channel width” is simply used, it may denote an effective channel width in some cases. Note that the values of a channel length, a channel width, an effective channel width, an apparent channel width, a surrounded channel width, and the like can be determined by obtaining and analyzing a cross-sectional TEM image and the like.
Note that in the case where electric field mobility, a current value per channel width, and the like of a transistor are obtained by calculation, a surrounded channel width may be used for the calculation. In that case, a value different from one in the case where an effective channel width is used for the calculation is obtained in some cases.
Note that in this specification, the description “A has a shape such that an end portion extends beyond an end portion of B” may indicate, for example, the case where at least one of end portions of A is positioned on an outer side than at least one of end portions of B in a top view or a cross-sectional view. Thus, the description “A has a shape such that an end portion extends beyond an end portion of B” can be alternately referred to as the description “one of end portions of A is positioned on an outer side than one of end portions of B in a top view”, for example.
In this specification, the term “parallel” indicates that the angle formed between two straight lines is greater than or equal to −10° and less than or equal to 10°, and accordingly also includes the case where the angle is greater than or equal to −5° and less than or equal to 5°. A term “substantially parallel” indicates that the angle formed between two straight lines is greater than or equal to −30° and less than or equal to 30°. A term “perpendicular” indicates that the angle formed between two straight lines is greater than or equal to −80° and less than or equal to 100°, and accordingly also includes the case where the angle is greater than or equal to 85° and less than or equal to 95°. A term “substantially perpendicular” indicates that the angle formed between two straight lines is greater than or equal to 60° and less than or equal to 120°.
In this specification, trigonal and rhombohedral crystal systems are included in a hexagonal crystal system.
In this specification, a term “semiconductor” can be referred to as an “oxide semiconductor”. As the semiconductor, a Group 14 semiconductor such as silicon or germanium; a compound semiconductor such as silicon carbide, germanium silicide, gallium arsenide, indium phosphide, zinc selenide, cadmium sulfide, or an oxide semiconductor; a carbon nanotube; graphene; or an organic semiconductor can be used.
Note that in this specification and the like, a “silicon oxynitride film” refers to a film that includes oxygen at a higher proportion than nitrogen, and a “silicon nitride oxide film” refers to a film that includes nitrogen at a higher proportion than oxygen.
Note that in the case where at least one specific example is described in a diagram or text described in one embodiment in this specification and the like, it will be readily appreciated by those skilled in the art that a broader concept of the specific example can be derived. Therefore, in the diagram or the text described in one embodiment, in the case where at least one specific example is described, a broader concept of the specific example is disclosed as one embodiment of the invention, and one embodiment of the invention can be constituted. The embodiment of the present invention is clear.
Note that in this specification and the like, a content described in at least a diagram (or may be part of the diagram) is disclosed as one embodiment of the invention, and one embodiment of the invention can be constituted. Therefore, when a certain content is described in a diagram, the content is disclosed as one embodiment of the invention even when the content is not described with a text, and one embodiment of the invention can be constituted. In a similar manner, part of a diagram, which is taken out from the diagram, is disclosed as one embodiment of the invention, and one embodiment of the invention can be constituted. The embodiment of the present invention is clear.
In addition, contents that are not specified in any text or drawing in the specification can be excluded from one embodiment of the invention. Alternatively, when the range of a value that is defined by the maximum and minimum values is described, part of the range is appropriately narrowed or part of the range is removed, whereby one embodiment of the invention excluding part of the range can be constituted. In this manner, it is possible to specify the technical scope of one embodiment of the present invention so that a conventional technology is excluded, for example.
Embodiment 1
In this embodiment, examples of a transistor which is a semiconductor device of an embodiment of the present invention and an example of a method for manufacturing the transistor will be described.
FIGS. 1A to 1C illustrate a transistor 100 of an embodiment of the present invention. FIG. 1A is a top view of the transistor 100, FIG. 1B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 1A, and FIG. 1C is a cross-sectional view taken along dashed-dotted line A3-A4 in FIG. 1A. The transistor 100 includes a substrate 201; an insulator 205; a semiconductor 213a; a semiconductor 213b; a semiconductor 213c; a conductor 215a; a conductor 215b; an insulator 223; a conductor 225; an insulator 210; an insulator 212; an insulator 214; an insulator 216; a conductor 217a; a conductor 217b; a conductor 219a; and a conductor 219b. 
The conductor 225 functions as a gate electrode of the transistor 100. The conductors 215a and 215b function as a source electrode and a drain electrode of the transistor 100. The insulator 223 functions as a gate insulator.
Although the transistor 100 illustrated in FIGS. 1A to 1C includes three layers, i.e., the semiconductors 213a, 213b, and 213c as a semiconductor, one embodiment of the present invention is not limited thereto. The transistor 100 may include any one or two of the three layers or may include four or more layers.
The area of a top surface of the conductor 225 is larger than that of a bottom surface thereof when seen from the above. The conductor 225 functions as a gate electrode of the transistor 100 and also functions as a wiring to be connected to the gate electrode. The conductor 225 functioning as the gate electrode and the wiring can be formed easily by a dual damascene method.
Next, a method for manufacturing the transistor 100 illustrated in FIGS. 1A to 1C will be described with reference to FIGS. 2A to 2C, FIGS. 3A to 3C, FIGS. 4A to 4C, FIGS. 5A to 5C, FIGS. 6A to 6C, and FIGS. 7A to 7C.
FIG. 2A, FIG. 3A, FIG. 4A, FIG. 5A, FIG. 6A, and FIG. 7A are top views illustrating a method for manufacturing the transistor 100 of one embodiment of the present invention. FIG. 2B, FIG. 3B, FIG. 4B, FIG. 5B, FIG. 6B, and FIG. 7B are each a cross-sectional view taken along dashed-dotted line A1-A2 shown in the corresponding top view. FIG. 2C, FIG. 3C, FIG. 4C, FIG. 5C, FIG. 6C, and FIG. 7C are each a cross-sectional view taken along dashed-dotted line A3-A4 shown in the corresponding top view.
First, the substrate 201 is prepared.
As the substrate 201, for example, an insulator substrate, a semiconductor substrate, or a conductor substrate may be used. As the insulator substrate, a glass substrate, a quartz substrate, a sapphire substrate, a stabilized zirconia substrate (e.g., an yttria-stabilized zirconia substrate), or a resin substrate is used, for example. As the semiconductor substrate, for example, a single material semiconductor substrate made of silicon, germanium, or the like; a compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide; or the like is used. A semiconductor substrate in which an insulator region is provided in the above semiconductor substrate, e.g., a silicon on insulator (SOI) substrate or the like is used. As the conductor substrate, a graphite substrate, a metal substrate, an alloy substrate, a conductive resin substrate, or the like is used. A substrate including a metal nitride, a substrate including a metal oxide, or the like is used. An insulator substrate provided with a conductor or a semiconductor, a semiconductor substrate provided with a conductor or an insulator, a conductor substrate provided with a semiconductor or an insulator, or the like is used. Alternatively, any of these substrates over which an element is provided may be used. As the element provided over the substrate, a capacitor, a resistor, a switching element, a light-emitting element, a memory element, or the like is used.
As the substrate 201, a flexible substrate may be used. Note that to provide a transistor on the flexible substrate, there is also a method in which a transistor is formed over a non-flexible substrate, and the transistor is then separated and transferred to the substrate 201 which is a flexible substrate. In that case, a separation layer is preferably provided between the non-flexible substrate and the transistor. As the substrate 201, a sheet, a film, or foil containing a fiber may be used. The substrate 201 may have elasticity. The substrate 201 may have a property of returning to its original shape when bending or pulling is stopped. Alternatively, the substrate 201 may have a property of not returning to its original shape. The thickness of the substrate 201 is, for example, greater than or equal to 5 μm and less than or equal to 1000 μm, preferably greater than or equal to 10 μm and less than or equal to 700 μm, or further preferably greater than or equal to 15 μm and less than or equal to 500 μm. When the substrate 201 has a small thickness, the weight of the semiconductor device can be reduced. When the substrate 201 has a small thickness, even in the case of using glass or the like, the substrate 201 may have elasticity or a property of returning to its original shape when bending or pulling is stopped. Therefore, an impact applied to the semiconductor device over the substrate 201, which is caused by dropping or the like, can be reduced. That is, a durable semiconductor device can be provided.
For the substrate 201 which is a flexible substrate, metal, an alloy, resin, glass, or fiber thereof can be used, for example. The flexible substrate 201 preferably has a lower coefficient of linear expansion because deformation due to an environment is suppressed. The flexible substrate 201 is formed using, for example, a material whose coefficient of linear expansion is lower than or equal to 1×10−3/K, lower than or equal to 5×10−5/K, or lower than or equal to 1×10−5/K. Examples of the resin include polyester, polyolefin, polyamide (e.g., nylon or aramid), polyimide, polycarbonate, and acrylic. In particular, aramid is preferably used for the flexible substrate 201 because of its low coefficient of linear expansion.
Next, the insulator 205 is formed. The insulator 205 can be formed by a sputtering method, a chemical vapor deposition (CVD) method, an MBE method, a pulsed laser deposition (PLD) method, an atomic layer deposition (ALD) method, or the like.
The insulator 205 may be formed to have, for example, a single-layer structure or a stacked-layer structure including an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum. The insulator 205 may be formed using, for example, aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
The insulator 205 is preferably an insulator containing excess oxygen. The insulator 205 is preferably an insulator containing a hydrogen trap.
Here, an insulator containing excess oxygen is an insulator that may release oxygen, the amount of which is higher than or equal to 1×1018 atoms/cm3, higher than or equal to 1×1019 atoms/cm3, or higher than or equal to 1×1020 atoms/cm3 (converted into the number of oxygen atoms) in thermal desorption spectroscopy (TDS) analysis in the range of a film surface temperature of 100° C. to 700° C. or 100° C. to 500° C.
A method for measuring the amount of released oxygen using TDS is described below.
The total amount of released gas from a measurement sample in TDS analysis is proportional to the integral value of the ion intensity of the released gas. Then, comparison with a reference sample is made, whereby the total amount of released gas can be calculated.
For example, the number of released oxygen molecules (NO2) from a measurement sample can be calculated according to the following formula using the TDS results of a silicon substrate containing hydrogen at a predetermined density, which is a reference sample, and the TDS results of the measurement sample. Here, all gases having a mass-to-charge ratio of 32 which are obtained in the TDS analysis are assumed to originate from an oxygen molecule. Note that CH3OH, which is a gas having the mass-to-charge ratio of 32, is not taken into consideration because it is unlikely to be present. Further, an oxygen molecule including an oxygen atom having a mass number of 17 or 18 which is an isotope of an oxygen atom is also not taken into consideration because the proportion of such a molecule in the natural world is minimal.

NO2=NH2/SH2×SO2×α

The value NH2 is obtained by conversion of the amount of hydrogen molecules desorbed from the reference sample into densities. The value SH2 is the integral value of ion intensity in the case where the reference sample is subjected to the TDS analysis. Here, the reference value of the reference sample is set to NH2/SH2. SO2 is the integral value of ion intensity when the measurement sample is analyzed by TDS. The value α is a coefficient affecting the ion intensity in the TDS analysis. Refer to Japanese Published Patent Application No. H6-275697 for details of the above formula. The amount of released oxygen was measured with a thermal desorption spectroscopy apparatus produced by ESCO Ltd., EMD-WA1000S/W using a silicon substrate containing a certain amount of hydrogen atoms as the reference sample.
Furthermore, in the TDS analysis, oxygen is partly detected as an oxygen atom. The ratio between oxygen molecules and oxygen atoms can be calculated from the ionization rate of the oxygen molecules. Note that, since the above α includes the ionization rate of the oxygen molecules, the amount of the released oxygen atoms can also be estimated through the evaluation of the amount of the released oxygen molecules.
Note that NO2 is the amount of the released oxygen molecules. The amount of released oxygen in the case of being converted into oxygen atoms is twice the amount of the released oxygen molecules.
Furthermore, the insulator from which oxygen is released by heat treatment may contain a peroxide radical. Specifically, the spin density attributed to the peroxide radical is greater than or equal to 5×1017 spins/cm3. Note that the insulator containing a peroxide radical may have an asymmetric signal with a g factor of approximately 2.01 in electron spin resonance (ESR).
The insulator 205 may have a function of preventing diffusion of impurities from the substrate 201.
Next, semiconductors which are to be the semiconductors 213a and 213b are formed. The semiconductors which are to be the semiconductors 213a and 213b can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. It is particularly preferable to use a facing-target sputtering apparatus. Note that in this specification and the like, deposition using a facing-target sputtering apparatus can also be referred to as vapor deposition sputtering (VDSP).
The use of the facing-target sputtering apparatus can reduce plasma damage induced during deposition of the semiconductor. Accordingly, oxygen vacancies in the semiconductor can be reduced. In addition, the use of the facing-target sputtering apparatus allows deposition in high vacuum. In that case, impurity concentration (e.g., concentration of hydrogen, a rare gas (such as argon), or water) in the deposited semiconductor can be reduced.
Next, heat treatment is preferably performed. The heat treatment can reduce hydrogen concentration in the semiconductor to be the semiconductor 213a and in the semiconductor to be the semiconductor 213b in some cases. In addition, the heat treatment can reduce oxygen vacancies in the semiconductor to be the semiconductor 213a and in the semiconductor to be the semiconductor 213b in some cases. The heat treatment can be performed at a temperature higher than or equal to 250° C. and lower than or equal to 650° C., preferably higher than or equal to 450° C. and lower than or equal to 600° C., further preferably higher than or equal to 520° C. and lower than or equal to 570° C. The heat treatment is performed in an inert gas atmosphere or an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more. The heat treatment may be performed under a reduced pressure. Alternatively, the heat treatment may be performed in such a manner that heat treatment is performed in an inert gas atmosphere, and then another heat treatment is performed in an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more in order to compensate desorbed oxygen. By the heat treatment, crystallinity of the semiconductor can be increased and impurities such as hydrogen and water can be removed.
Next, a conductor to be the conductor 202 is formed. The conductor can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
The conductor may be formed to have a single-layer structure or a stacked-layer structure including a conductor containing, for example, one or more kinds of boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, silver, indium, tin, tantalum, platinum, strontium, iridium, and tungsten. An alloy or a compound of the above element may be used, for example, and a conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin, and oxygen, a conductor containing titanium and nitrogen, or the like may be used.
Next, a resist or the like is formed over the conductor, and processing is performed using the resist or the like to form the conductor 202 and the semiconductors 213a and 213b (see FIGS. 2A to 2C).
Alternatively, after the formation of the conductor 202, the semiconductors may be processed using the conductor 202 as a mask to form the semiconductors 213a and 213b. 
Note that when the semiconductor 213a is formed, part of the insulator 205 may be etched and thinned in some cases. That is, the insulator 205 may have a protruding portion in a region in contact with the semiconductor 213a. 
Next, an insulator 209 is formed (see FIGS. 3A to 3C). The insulator 209 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. Alternatively, the insulator 209 can be formed by a spin coating method, a dipping method, a droplet discharging method (such as an ink-jet method), a printing method (such as screen printing or offset printing), a doctor knife method, a roll coater method, a curtain coater method, or the like.
The insulator 209 may be formed to have, for example, a single-layer structure or a stacked-layer structure including an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum. The insulator 209 may be formed using, for example, aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
The insulator 209 may be formed to have a flat top surface. For example, the top surface of the insulator 209 may have planarity immediately after the film formation. Alternatively, after the film formation, an upper portion of the insulator 209 may be removed so that the top surface of the insulator 209 becomes parallel to a reference surface such as a rear surface of the substrate. Such treatment is referred to as planarization treatment. As the planarization treatment, for example, chemical mechanical polishing (CMP) treatment, dry etching treatment, or the like can be performed. However, the top surface of the insulator 209 is not necessarily flat.
Next, an insulator 211 and an insulator 213 are formed (see FIGS. 4A to 4C). The insulators 211 and 213 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. Alternatively, the insulators 211 and 213 can be formed by a spin coating method, a dipping method, a droplet discharging method (such as an ink-jet method), a printing method (such as screen printing or offset printing), a doctor knife method, a roll coater method, a curtain coater method, or the like.
The insulators 211 and 213 may each be formed to have, for example, a single-layer structure or a stacked-layer structure including an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum. The insulators 211 and 213 may each be formed using, for example, aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
The insulator 211 preferably functions as a barrier layer. The insulator 211 has, for example, a function of blocking oxygen and/or hydrogen. Alternatively, the insulator 211 preferably has a higher capability of blocking oxygen and/or hydrogen than the insulators 205 and 209, for example.
The insulator 211 preferably functions as a stopper in CMP treatment.
Next, a resist or the like is formed over the insulator 213, and the insulator 213 is selectively processed using the resist or the like so that part of the insulator 211 is exposed, whereby the insulator 214 is formed (see FIGS. 5A to 5C). Thus, by the selective removal of the insulator 213, a groove where a wiring is to be formed later is formed.
Next, a resist or the like is formed over the insulator 211 and the insulator 214, and the insulator 211, the insulator 209, and the conductor 202 are selectively processed using the resist or the like so that part of the semiconductor 213b is exposed, whereby the insulator 212, the insulator 210, the conductor 215a, and the conductor 215b are formed (see FIGS. 6A to 6C).
Note that the insulator 211, the insulator 209, and the conductor 202 may be processed collectively or individually.
Although there is a step between the insulator 214 and the insulator 212 in FIGS. 6A to 6C, one embodiment of the present invention is not limited thereto. As illustrated in FIGS. 37A to 37C, no step may be formed between the insulator 214 and the insulator 212. As illustrated in FIGS. 38A to 38C, steps may be formed between the insulator 210 and the conductors 215a and 215b. 
Next, a semiconductor to be the semiconductor 213c is formed. The semiconductor to be the semiconductor 213c can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. It is particularly preferable to use a facing-target sputtering apparatus. Exposed surfaces of the semiconductor 213b and the conductors 215a and 215b may be etched before the formation of the semiconductor to be the semiconductor 213c. Rare-gas-containing plasma, for example, can be used for the etching. Alternatively, wet etching may be employed. After the etching, the semiconductor to be the semiconductor 213c is successively formed without being exposed to the air, which can prevent impurities from entering interfaces between the semiconductor to be the semiconductor 213c and the semiconductor 213b and between the semiconductor to be the semiconductor 213c and the conductors 215a and 215b. In some cases, impurities at an interface between films are diffused more easily than impurities in a film. Thus, reduction of the entry of impurities can stabilize the electrical characteristics of the transistor.
The use of the facing-target sputtering apparatus can reduce plasma damage induced during deposition of the semiconductor. Accordingly, oxygen vacancies in the semiconductor can be reduced. In addition, the use of the facing-target sputtering apparatus allows deposition in high vacuum. In that case, impurity concentration (e.g., concentration of hydrogen, a rare gas (such as argon), or water) in the deposited semiconductor can be reduced.
Next, an insulator to be the insulator 223 is formed. The insulator to be the insulator 223 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. Note that successive film formation of the semiconductor to be the semiconductor 213c and the insulator to be the insulator 223 without exposure to the air can reduce entry of impurities into the films and their interface.
The insulator to be the insulator 223 may be formed to have a single-layer structure or a stacked-layer structure including an insulator containing, for example, boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum. The insulator to be the insulator 223 may be formed using, for example, aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
Next, a conductor to be the conductor 225 is formed, and then CMP treatment is performed, whereby the semiconductor 213c, the insulator 223, and the conductor 225 are formed (see FIGS. 7A to 7C).
A conductor to be the conductor 225 can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, an electrolytic plating method, a coating method, or the like. It is particularly preferable to use an electrolytic plating method or a metal CVD (MCVD) method with excellent step coverage.
The conductor 225 may be formed to have a single-layer structure or a stacked-layer structure including a conductor containing, for example, one or more kinds of copper, boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, silver, indium, tin, tantalum, platinum, strontium, iridium, and tungsten. An alloy or a compound of the above element may be used, for example, and a conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin, and oxygen, a conductor containing titanium and nitrogen, or the like may be used.
As described above, a method in which a groove is formed in an insulator first, a conductor is formed over an entire surface, and the entire surface is polished by CMP treatment or the like is referred to as a damascene method. The conductor 225 is formed by a damascene method. A method for forming a wiring portion and a conductor portion in a layer under the wiring portion is referred to as a dual damascene method. The dual damascene method includes a step of forming a groove in a layer where the conductor portion is to be formed and a groove where a wiring portion is to be formed, a step of depositing a conductor to be the wiring portion and the conductor portion, a step of removing the conductor other than the wiring portion and the conductor portion by a CMP method, and the like.
Next, the insulator 216 is formed over the insulator 214 and the conductor 225. The insulator 216 may be formed by a method similar to that used for the insulator 214 and the like.
Next, a resist or the like is formed over the insulator 216, and the insulator 210, the insulator 212, the insulator 214, and the insulator 216 are processed using the resist or the like, so that the conductors 215a and 215b are partly exposed.
Next, a conductive film is formed over the insulator 216, and then CMP treatment is performed to expose a surface of the insulator 216, whereby the conductors 217a and 217b are formed.
Next, after a conductive film is formed over the insulator 216 and the conductors 217a and 217b, a resist or the like is formed over the conductive film, and the conductive film is processed using the resist or the like to form the conductors 219a and 219b. 
The conductors 217a and 217b formed in this manner each function as a plug that connects wirings. The conductors 219a and 219b each function as a wiring.
Although the conductors 217a and 217b are formed in a step different from a step of forming the conductors 219a and 219b in the above description, one embodiment of the present invention is not limited thereto. For example, after the insulator 210, the insulator 212, the insulator 214, and the insulator 216 are processed to partly expose the conductors 215a and 215b, a conductor is formed and processed with a resist or the like to form the conductors 217a and 217b and the conductors 219a and 219b in the same step.
Through the above process, the transistor 100 of one embodiment of the present invention, which is illustrated in FIGS. 1A to 1C, can be manufactured.
As in the transistor 100 illustrated in FIGS. 1A to 1C, the semiconductor 213b can be electrically surrounded by an electric field of the conductor 225 (a structure in which a semiconductor is electrically surrounded by an electric field of a conductor is referred to as a surrounded channel (s-channel) structure). Therefore, a channel is formed in a top surface and a side surface of the semiconductor 213b. In the s-channel structure, a large amount of current can flow between a source and a drain of a transistor, so that high current in an on state (on-state current) can be achieved.
In the case where the transistor has the s-channel structure, a channel is formed also in the side surface of the semiconductor 213b, and thus as the semiconductor 213b is thicker, a channel formation region is increased. In other words, the thicker the semiconductor 213b is, the higher the on-state current of the transistor is. The semiconductor 213b may have a region with a thickness of, for example, greater than or equal to 20 nm, preferably greater than or equal to 40 nm, further preferably greater than or equal to 60 nm, and still further preferably greater than or equal to 100 nm. Note that the semiconductor 213b has a region with a thickness of, for example, less than or equal to 300 nm, preferably less than or equal to 200 nm, further preferably less than or equal to 150 nm because the productivity of the semiconductor device might be decreased.
The s-channel structure is suitable for a miniaturized transistor because a high on-state current can be obtained. A semiconductor device including the miniaturized transistor can have a high integration degree and high density. For example, the transistor includes a region having a channel length of preferably less than or equal to 40 nm, further preferably less than or equal to 30 nm, and still further preferably less than or equal to 20 nm and a region having a channel width of preferably less than or equal to 40 nm, further preferably less than or equal to 30 nm, and still further preferably less than or equal to 20 nm.
Note that as illustrated in FIG. 8A, a structure in which a conductor 203 is provided in a lower layer of the insulator 205 may be employed. The conductor 203 and the conductor 225 may be electrically connected to each other through a conductor 217c (see FIG. 8D).
The conductor 203 can be formed by a sputtering method, a chemical vapor deposition (CVD) method, a molecular beam epitaxy (MBE) method, a pulsed laser deposition (PLD) method, an atomic layer deposition (ALD) method, or the like.
The conductor 203 may be formed to have a single-layer structure or a stacked-layer structure including a conductor containing, for example, one or more kinds of boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, silver, indium, tin, tantalum, platinum, strontium, iridium, and tungsten. An alloy or a compound of the above element may be used, for example, and a conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin, and oxygen, a conductor containing titanium and nitrogen, or the like may be used.
The conductor 217c may be formed in a manner similar to that of the conductors 217a and 217b. 
The area of the top surface of the conductor 225 is larger than that of the bottom surface thereof when seen from the above.
The insulator 212 preferably has a higher relative dielectric constant than the insulator 210.
The conductor 225 functions as a first gate electrode (also referred to as a front gate electrode) of the transistor 100. The conductor 203 functions as a second gate electrode (also referred to as a back gate electrode) of the transistor 100.
In this embodiment, the transistor 100 is a top-gate transistor; however, one embodiment of the present invention is not limited thereto. For example, a bottom-gate structure may be employed, in which case the conductor 203 serves as a front gate electrode and the conductor 225 serves as a back gate electrode in the transistor illustrated in FIGS. 8A and 8B. A structure without the conductor 225 may be used.
Note that the transistor in this embodiment has, although not limited to, a structure (top-contact structure) in which the top surface of a semiconductor is in contact with a source electrode and a drain electrode. The transistor may have, for example, a structure (bottom-contact structure) in which the bottom surface of a semiconductor is in contact with a source electrode and a drain electrode.
Furthermore, the transistor in this embodiment has, although not limited to, a structure in which a gate electrode partly overlaps with a source electrode and a drain electrode. Alternatively, the transistor may have, for example, a structure in which a gate electrode does not overlap with a source electrode and a drain electrode.
<Semiconductor>
As described in this embodiment, placing the semiconductor 213a under the semiconductor 213b and placing the semiconductor 213c over the semiconductor 213b can increase electrical characteristics of the transistor in some cases.
The semiconductor 213b is an oxide semiconductor containing indium, for example. The semiconductor 213b can have high carrier mobility (electron mobility) by containing indium, for example. The semiconductor 213b preferably contains an element M The element M is preferably aluminum, gallium, yttrium, tin, or the like. Other elements which can be used as the element M are boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, magnesium, tungsten, and the like. Note that two or more of the above elements may be used in combination as the element M The element M is an element having a high bonding energy with oxygen, for example. The element M is an element whose bonding energy with oxygen is higher than that of indium. The element M is an element that can increase the energy gap of the oxide semiconductor, for example. Furthermore, the semiconductor 213b preferably contains zinc. When the oxide semiconductor contains zinc, the oxide semiconductor is easily to be crystallized, for example.
Note that the semiconductor 213b is not limited to the oxide semiconductor containing indium. The semiconductor 213b may be, for example, an oxide semiconductor which does not contain indium and contains zinc, an oxide semiconductor which does not contain indium and contains gallium, or an oxide semiconductor which does not contain indium and contains tin, e.g., a zinc tin oxide or a gallium tin oxide.
For the semiconductor 213b, an oxide with a wide energy gap is used. For example, the energy gap of the semiconductor 213b is greater than or equal to 2.5 eV and less than or equal to 4.2 eV, preferably greater than or equal to 2.8 eV and less than or equal to 3.8 eV, and further preferably greater than or equal to 3 eV and less than or equal to 3.5 eV.
For example, the semiconductor 213a and the semiconductor 213c are oxide semiconductors including one or more, or two or more elements other than oxygen included in the semiconductor 213b. Since the semiconductor 213a and the semiconductor 213c each include one or more elements, or two or more elements other than oxygen included in the semiconductor 213b, a defect state is less likely to be formed at the interface between the semiconductor 213a and the semiconductor 213b and the interface between the semiconductor 213b and the semiconductor 213c. 
The semiconductor 213a, the semiconductor 213b, and the semiconductor 213c preferably contain at least indium. In the case of using an In-M-Zn oxide as the semiconductor 213a, when a summation of In and M is assumed to be 100 atomic %, the proportions of In and M are preferably set to be less than 50 atomic % and greater than 50 atomic %, respectively, and further preferably less than 25 atomic % and greater than 75 atomic %, respectively. In the case of using an In-M-Zn oxide as the semiconductor 213b, when a summation of In and M is assumed to be 100 atomic %, the proportions of In and M are preferably set to be greater than 25 atomic % and less than 75 atomic %, respectively, and further preferably greater than 34 atomic % and less than 66 atomic %, respectively. In the case of using an In-M-Zn oxide as the semiconductor 213c, when a summation of In and M is assumed to be 100 atomic %, the proportions of In and Mare preferably set to be less than 50 atomic % and greater than 50 atomic %, respectively, and further preferably less than 25 atomic % and greater than 75 atomic %, respectively. Note that the semiconductor 213c may be an oxide that is a type the same as that of the semiconductor 213a. Note that the semiconductor 213a and/or the semiconductor 213c do/does not necessarily contain indium in some cases. For example, the semiconductor 213a and/or the semiconductor 213c may be gallium oxide. Note that the atomic ratios of the elements included in the semiconductor 213a, the semiconductor 213b, and the semiconductor 213c are not necessarily simple ratios of integers.
As the semiconductor 213b, an oxide having an electron affinity higher than those of the semiconductor 213a and the semiconductor 213c is used. For example, as the semiconductor 213b, an oxide having an electron affinity higher than those of the semiconductor 213a and the semiconductor 213c by 0.07 eV or higher and 1.3 eV or lower, preferably 0.1 eV or higher and 0.7 eV or lower, and further preferably 0.15 eV or higher and 0.4 eV or lower is used. Note that the electron affinity refers to an energy gap between the vacuum level and the bottom of the conduction band.
An indium gallium oxide has a small electron affinity and a high oxygen-blocking property. Therefore, the semiconductor 213c preferably includes an indium gallium oxide. The gallium atomic ratio [Ga/(In+Ga)] is, for example, higher than or equal to 70%, preferably higher than or equal to 80%, and further preferably higher than or equal to 90%.
When gate voltage is applied to such a transistor in which the semiconductor 213a is placed under the semiconductor 213b and the semiconductor 213c is placed over the semiconductor 213b, a channel is formed in the semiconductor 213b whose electron affinity is the highest among the semiconductor 213a, the semiconductor 213b, and the semiconductor 213c. 
Here, in some cases, a region where the semiconductor 213a and the semiconductor 213b are mixed is provided between the semiconductor 213a and the semiconductor 213b. In addition, a region where the semiconductor 213b and the semiconductor 213c are mixed is formed between the semiconductor 213b and the semiconductor 213c in some cases. The mixed region has a low density of defect states. For that reason, the stack including the semiconductor 213a, the semiconductor 213b, and the semiconductor 213c has a band structure where energy at each interface and in the vicinity of the interface is changed continuously (continuous junction) (see FIG. 9). Note that boundaries of the semiconductor 213a, the semiconductor 213b, and the semiconductor 213c are not clear in some cases.
At this time, electrons move mainly in the semiconductor 213b, not in the semiconductor 213a and the semiconductor 213c. As described above, when the density of defect states at the interface between the semiconductor 213a and the semiconductor 213b and the density of defect states at the interface between the semiconductor 213b and the semiconductor 213c are decreased, electron movement in the semiconductor 213b is less likely to be inhibited and the on-state current of the transistor can be increased.
As factors of inhibiting electron movement are decreased, the on-state current of the transistor can be increased. For example, in the case where there is no factor of inhibiting electron movement, electrons are assumed to be moved efficiently. Electron movement is inhibited, for example, in the case where physical unevenness in a channel formation region is large.
To increase the on-state current of the transistor, for example, root mean square (RMS) roughness with a measurement area of 1 μm×1 μm of a top surface or a bottom surface of the semiconductor 213b (a formation surface; here, a top surface of the semiconductor 213a) is less than 1 nm, preferably less than 0.6 nm, further preferably less than 0.5 nm, and still further preferably less than 0.4 nm. The average surface roughness (also referred to as Ra) with the measurement area of 1 μm×1 μm is less than 1 nm, preferably less than 0.6 nm, further preferably less than 0.5 nm, and still further preferably less than 0.4 nm. The maximum difference (P-V) with the measurement area of 1 μm×1 μm is less than 10 nm, preferably less than 9 nm, further preferably less than 8 nm, and still further preferably less than 7 nm. RMS roughness, Ra, and P-V can be measured using a scanning probe microscope SPA-500 manufactured by SII Nano Technology Inc.
Moreover, the thickness of the semiconductor 213c is preferably as small as possible to increase the on-state current of the transistor. For example, the semiconductor 213c has a region with a thickness less than 10 nm, preferably less than or equal to 5 nm, and further preferably less than or equal to 3 nm, for example. Meanwhile, the semiconductor 213c has a function of blocking entry of elements other than oxygen (such as hydrogen and silicon) included in the adjacent insulator into the semiconductor 213b where a channel is formed. For this reason, it is preferable that the semiconductor 213c have a certain thickness. For example, the semiconductor 213c has a region with a thickness greater than or equal to 0.3 nm, preferably greater than or equal to 1 nm, and further preferably greater than or equal to 2 nm, for example. The semiconductor 213c preferably has an oxygen blocking property to suppress outward diffusion of oxygen released from the insulator 205 and the like.
To improve the reliability, preferably, the thickness of the semiconductor 213a is large and the thickness of the semiconductor 213c is small. For example, the semiconductor 213a has a region with a thickness greater than or equal to 10 nm, preferably greater than or equal to 20 nm, further preferably greater than or equal to 40 nm, and still further preferably greater than or equal to 60 nm. When the thickness of the semiconductor 213a is made large, a distance from an interface between the adjacent insulator and the semiconductor 213a to the semiconductor 213b in which a channel is formed can be large. Since the productivity of the semiconductor device might be decreased, the semiconductor 213a has a region with a thickness of, for example, less than or equal to 200 nm, preferably less than or equal to 120 nm, and further preferably less than or equal to 80 nm.
For example, a region with a silicon concentration measured by secondary ion mass spectrometry (SIMS) of higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 1×1019 atoms/cm3, preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3, further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 2×1018 atoms/cm3 is provided between the semiconductor 213b and the semiconductor 213a. A region with a silicon concentration measured by SIMS of higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 1×1019 atoms/cm3, preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3, further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 2×1018 atoms/cm3 is provided between the semiconductor 213b and the semiconductor 213c. 
It is preferable to reduce the concentrations of hydrogen in the semiconductor 213a and the semiconductor 213c in order to reduce the concentration of hydrogen in the semiconductor 213b. The semiconductors 213a and 213c each have a region in which the concentration of hydrogen measured by SIMS is higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 2×1020 atoms/cm3, preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1019 atoms/cm3, further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 1×1019 atoms/cm3, still further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3. It is preferable to reduce the concentration of nitrogen in the semiconductor 213a and the semiconductor 213c in order to reduce the concentration of nitrogen in the semiconductor 213b. The semiconductor 213a and the semiconductor 213c each include a region with a nitrogen concentration measured by SIMS of higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 5×1019 atoms/cm3, preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3, further preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 1×1018 atoms/cm3, and still further preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 5×1017 atoms/cm3.
The above three-layer structure is an example. For example, a two-layer structure without the semiconductor 213a or the semiconductor 213c may be employed. A four-layer structure in which any one of the semiconductors described as examples of the semiconductor 213a, the semiconductor 213b, and the semiconductor 213c is provided under or over the semiconductor 213a or under or over the semiconductor 213c may be employed. An n-layer structure (n is an integer of 5 or more) in which any one of the semiconductors described as examples of the semiconductor 213a, the semiconductor 213b, and the semiconductor 213c is provided at two or more of the following positions: over the semiconductor 213a, under the semiconductor 213a, over the semiconductor 213c, and under the semiconductor 213c may be employed.
<Structure of Oxide Semiconductor>
Structures of an oxide semiconductor that can be used as the above semiconductor will be described below.
An oxide semiconductor is classified into a single crystal oxide semiconductor and a non-single-crystal oxide semiconductor. Examples of a non-single-crystal oxide semiconductor include a c-axis aligned crystalline oxide semiconductor (CAAC-OS), a polycrystalline oxide semiconductor, a nanocrystalline oxide semiconductor (nc-OS), an amorphous-like oxide semiconductor (a-like OS), and an amorphous oxide semiconductor.
From another perspective, an oxide semiconductor is classified into an amorphous oxide semiconductor and a crystalline oxide semiconductor. Examples of a crystalline oxide semiconductor include a single crystal oxide semiconductor, a CAAC-OS, a polycrystalline oxide semiconductor, and an nc-OS.
It is known that an amorphous structure is generally defined as being metastable and unfixed, and being isotropic and having no non-uniform structure. In other words, an amorphous structure has a flexible bond angle and a short-range order but does not have a long-range order.
This means that an inherently stable oxide semiconductor cannot be regarded as a completely amorphous oxide semiconductor. Moreover, an oxide semiconductor that is not isotropic (e.g., an oxide semiconductor that has a periodic structure in a microscopic region) cannot be regarded as a completely amorphous oxide semiconductor. Note that an a-like OS has a periodic structure in a microscopic region, but at the same time has a void and has an unstable structure. For this reason, an a-like OS has physical properties similar to those of an amorphous oxide semiconductor.
<CAAC-OS>
First, a CAAC-OS is described.
A CAAC-OS is one of oxide semiconductors having a plurality of c-axis aligned crystal parts (also referred to as pellets).
In a combined analysis image (also referred to as a high-resolution TEM image) of a bright-field image and a diffraction pattern of a CAAC-OS, which is obtained using a transmission electron microscope (TEM), a plurality of pellets can be observed. However, in the high-resolution TEM image, a boundary between pellets, that is, a grain boundary is not clearly observed. Thus, in the CAAC-OS, a reduction in electron mobility due to the grain boundary is less likely to occur. The pellet is preferably larger than or equal to 1 nm and further preferably larger than or equal to 3 nm.
The CAAC-OS observed with a TEM is described below. FIG. 10A shows a high-resolution TEM image of a cross section of the CAAC-OS, which is observed from a direction substantially parallel to the sample surface. The high-resolution TEM image is obtained with a spherical aberration corrector function. The high-resolution TEM image obtained with a spherical aberration corrector function is particularly referred to as a Cs-corrected high-resolution TEM image. Note that the Cs-corrected high-resolution TEM image can be obtained with, for example, an atomic resolution analytical electron microscope JEM-ARM200F manufactured by JEOL Ltd.
FIG. 10B is an enlarged Cs-corrected high-resolution TEM image of a region (1) in FIG. 10A. FIG. 10B shows that metal atoms are arranged in a layered manner in a pellet. Each metal atom layer has a configuration reflecting unevenness of a surface over which the CAAC-OS is formed (hereinafter, the surface is referred to as a formation surface) or a top surface of the CAAC-OS, and is arranged parallel to the formation surface or the top surface of the CAAC-OS.
As shown in FIG. 10B, the CAAC-OS has a characteristic atomic arrangement. The characteristic atomic arrangement is denoted by an auxiliary line in FIG. 10C. FIGS. 10B and 10C prove that the size of a pellet is greater than or equal to 1 nm or greater than or equal to 3 nm, and the space between the pellets caused by the tilt is approximately 0.8 nm. Therefore, the pellet can also be referred to as a nanocrystal (nc). Furthermore, the CAAC-OS can also be referred to as an oxide semiconductor including c-axis aligned nanocrystals (CANC).
Here, according to the Cs-corrected high-resolution TEM images, the schematic arrangement of pellets 5100 of a CAAC-OS over a substrate 5120 is illustrated by such a structure in which bricks or blocks are stacked (see FIG. 10D). The part in which the pellets are tilted as observed in FIG. 10C corresponds to a region 5161 shown in FIG. 10D.
FIG. 11A shows a Cs-corrected high-resolution TEM image of a plane of the CAAC-OS observed from a direction substantially perpendicular to the sample surface. FIGS. 11B, 11C, and 11D are enlarged Cs-corrected high-resolution TEM images of regions (1), (2), and (3) in FIG. 11A, respectively. FIGS. 11B, 11C, and 11D indicate that metal atoms are arranged in a triangular, quadrangular, or hexagonal configuration in a pellet. However, there is no regularity of arrangement of metal atoms between different pellets.
Next, a CAAC-OS analyzed by X-ray diffraction (XRD) is described. For example, when the structure of a CAAC-OS including an InGaZnO4 crystal is analyzed by an out-of-plane method, a peak appears at a diffraction angle (2θ) of around 31° as shown in FIG. 12A. This peak is derived from the (009) plane of the InGaZnO4 crystal, which indicates that crystals in the CAAC-OS have c-axis alignment, and that the c-axes are aligned in a direction substantially perpendicular to the formation surface or the top surface of the CAAC-OS.
Note that in structural analysis of the CAAC-OS by an out-of-plane method, another peak may appear when 2θ is around 36°, in addition to the peak at 2θ of around 31°. The peak of 2θ at around 36° indicates that a crystal having no c-axis alignment is included in part of the CAAC-OS. It is preferable that in the CAAC-OS analyzed by an out-of-plane method, a peak appear when 2θ is around 31° and that a peak not appear when 2θ is around 36°.
On the other hand, in structural analysis of the CAAC-OS by an in-plane method in which an X-ray is incident on a sample in a direction substantially perpendicular to the c-axis, a peak appears when 2θ is around 56°. This peak is derived from the (110) plane of the InGaZnO4 crystal. In the case of the CAAC-OS, when analysis (φ scan) is performed with 2θ fixed at around 56° and with the sample rotated using a normal vector of the sample surface as an axis (φ axis), as shown in FIG. 12B, a peak is not clearly observed. In contrast, in the case of a single crystal oxide semiconductor of InGaZnO4, when φ scan is performed with 2θ fixed at around 56°, as shown in FIG. 12C, six peaks which are assigned to crystal planes equivalent to the (110) plane are observed. Accordingly, the structural analysis using XRD shows that the directions of a-axes and b-axes are irregularly oriented in the CAAC-OS.
Next, a CAAC-OS analyzed by electron diffraction is described. For example, when an electron beam with a probe diameter of 300 nm is incident on a CAAC-OS including an InGaZnO4 crystal in a direction parallel to the sample surface, a diffraction pattern (also referred to as a selected-area transmission electron diffraction pattern) shown in FIG. 13A can be obtained. In this diffraction pattern, spots derived from the (009) plane of an InGaZnO4 crystal are included. Thus, the electron diffraction also indicates that pellets included in the CAAC-OS have c-axis alignment and that the c-axes are aligned in a direction substantially perpendicular to the formation surface or the top surface of the CAAC-OS. Meanwhile, FIG. 13B shows a diffraction pattern obtained in such a manner that an electron beam with a probe diameter of 300 nm is incident on the same sample in a direction perpendicular to the sample surface. As shown in FIG. 13B, a ring-like diffraction pattern is observed. Thus, the electron diffraction also indicates that the a-axes and b-axes of the pellets included in the CAAC-OS do not have regular alignment. The first ring in FIG. 13B is considered to be derived from the (010) plane, the (100) plane, and the like of the InGaZnO4 crystal. The second ring in FIG. 13B is considered to be derived from the (110) plane and the like.
As described above, the CAAC-OS is an oxide semiconductor with high crystallinity. Entry of impurities, formation of defects, or the like might decrease the crystallinity of an oxide semiconductor. This means that the CAAC-OS has negligible amounts of impurities and defects (e.g., oxygen vacancies).
Note that the impurity means an element other than the main components of the oxide semiconductor, such as hydrogen, carbon, silicon, or a transition metal element. For example, an element (specifically, silicon or the like) having higher strength of bonding to oxygen than a metal element included in an oxide semiconductor extracts oxygen from the oxide semiconductor, which results in disorder of the atomic arrangement and reduced crystallinity of the oxide semiconductor. A heavy metal such as iron or nickel, argon, carbon dioxide, or the like has a large atomic radius (or molecular radius), and thus disturbs the atomic arrangement of the oxide semiconductor and decreases crystallinity.
The characteristics of an oxide semiconductor having impurities or defects might be changed by light, heat, or the like. Impurities contained in the oxide semiconductor might serve as carrier traps or carrier generation sources, for example. Furthermore, oxygen vacancies in the oxide semiconductor might serve as carrier traps or serve as carrier generation sources when hydrogen is captured therein.
The CAAC-OS having small amounts of impurities and oxygen vacancies is an oxide semiconductor with low carrier density. Specifically, an oxide semiconductor with a carrier density of lower than 8×1011/cm3, preferably lower than 1×1011/cm3, further preferably lower than 1×1010/cm3, and higher than or equal to 1×10−9/cm3 can be used. Such an oxide semiconductor is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. A CAAC-OS has a low impurity concentration and a low density of defect states. Thus, the CAAC-OS can be referred to as an oxide semiconductor having stable characteristics.
<nc-OS>
Next, an nc-OS is described.
An nc-OS has a region in which a crystal part is observed and a region in which a crystal part is not clearly observed in a high-resolution TEM image. In most cases, the size of a crystal part included in the nc-OS is greater than or equal to 1 nm and less than or equal to 10 nm, or greater than or equal to 1 nm and less than or equal to 3 nm. An oxide semiconductor including a crystal part whose size is greater than 10 nm and less than or equal to 100 nm can be referred to as a microcrystalline oxide semiconductor. In a high-resolution TEM image of the nc-OS, for example, a grain boundary is not clearly observed in some cases. Note that there is a possibility that the origin of the nanocrystal is the same as that of a pellet in a CAAC-OS. Therefore, a crystal part of the nc-OS may be referred to as a pellet in the following description.
In the nc-OS, a microscopic region (for example, a region with a size greater than or equal to 1 nm and less than or equal to 10 nm, in particular, a region with a size greater than or equal to 1 nm and less than or equal to 3 nm) has a periodic atomic arrangement. There is no regularity of crystal orientation between different pellets in the nc-OS. Thus, the orientation of the whole film is not observed. Accordingly, the nc-OS cannot be distinguished from an a-like OS or an amorphous oxide semiconductor, depending on an analysis method. For example, when the nc-OS is analyzed by an out-of-plane method using an X-ray beam having a diameter larger than the size of a pellet, a peak which shows a crystal plane cannot be detected. Furthermore, a diffraction pattern like a halo pattern is observed when the nc-OS is subjected to electron diffraction using an electron beam with a probe diameter (e.g., 50 nm or larger) that is larger than the size of a pellet. Meanwhile, spots appear in a nanobeam electron diffraction pattern of the nc-OS when an electron beam having a probe diameter close to or smaller than the size of a pellet is applied. Moreover, in a nanobeam electron diffraction pattern of the nc-OS, regions with high luminance in a circular (ring) pattern are shown in some cases. Also in a nanobeam electron diffraction pattern of the nc-OS, a plurality of spots is shown in a ring-like region in some cases.
Since there is no regularity of crystal orientation between the pellets (nanocrystals) as mentioned above, the nc-OS can also be referred to as an oxide semiconductor including random aligned nanocrystals (RANC) or an oxide semiconductor including non-aligned nanocrystals (NANC).
The nc-OS is an oxide semiconductor that has high regularity as compared with an amorphous oxide semiconductor. Therefore, the nc-OS is likely to have a lower density of defect states than an a-like OS and an amorphous oxide semiconductor. Note that there is no regularity of crystal orientation between different pellets in the nc-OS. Therefore, the nc-OS has a higher density of defect states than the CAAC-OS.
<a-Like OS>
An a-like OS has a structure intermediate between those of the nc-OS and the amorphous oxide semiconductor.
In a high-resolution TEM image of the a-like OS, a void may be observed. Furthermore, in the high-resolution TEM image, there are a region where a crystal part is clearly observed and a region where a crystal part is not observed.
The a-like OS has an unstable structure because it contains a void. To verify that an a-like OS has an unstable structure as compared with a CAAC-OS and an nc-OS, a change in structure caused by electron irradiation is described below.
An a-like OS (sample A), an nc-OS (sample B), and a CAAC-OS (sample C) are prepared as samples subjected to electron irradiation. Each of the samples is an In—Ga—Zn oxide.
First, a high-resolution cross-sectional TEM image of each sample is obtained. The high-resolution cross-sectional TEM images show that all the samples have crystal parts.
Note that which part is regarded as a crystal part is determined as follows. It is known that a unit cell of the InGaZnO4 crystal has a structure in which nine layers including three In—O layers and six Ga—Zn—O layers are stacked in the c-axis direction. The distance between the adjacent layers is equivalent to the lattice spacing on the (009) plane (also referred to as d value). The value is calculated to be 0.29 nm from crystal structural analysis. Accordingly, a portion where the lattice spacing between lattice fringes is greater than or equal to 0.28 nm and less than or equal to 0.30 nm is regarded as a crystal part of InGaZnO4. Each of lattice fringes corresponds to the a-b plane of the InGaZnO4 crystal.
FIG. 14 shows change in the average size of crystal parts (at 22 points to 45 points) in each sample. Note that the crystal part size corresponds to the length of a lattice fringe. FIG. 14 indicates that the crystal part size in the a-like OS increases with an increase in the cumulative electron dose. Specifically, as shown by (1) in FIG. 14, a crystal part of approximately 1.2 nm (also referred to as an initial nucleus) at the start of TEM observation grows to a size of approximately 2.6 nm at a cumulative electron dose of 4.2×108 e−/nm2. In contrast, the crystal part size in the nc-OS and the CAAC-OS shows little change from the start of electron irradiation to a cumulative electron dose of 4.2×108 e−/nm2. Specifically, as shown by (2) and (3) in FIG. 14, the average crystal sizes in an nc-OS and a CAAC-OS are approximately 1.4 nm and approximately 2.1 nm, respectively, regardless of the cumulative electron dose.
In this manner, growth of the crystal part in the a-like OS is induced by electron irradiation. In contrast, in the nc-OS and the CAAC-OS, growth of the crystal part is hardly induced by electron irradiation. Therefore, the a-like OS has an unstable structure as compared with the nc-OS and the CAAC-OS.
The a-like OS has a lower density than the nc-OS and the CAAC-OS because it contains a void. Specifically, the density of the a-like OS is higher than or equal to 78.6% and lower than 92.3% of the density of the single crystal oxide semiconductor having the same composition. The density of each of the nc-OS and the CAAC-OS is higher than or equal to 92.3% and lower than 100% of the density of the single crystal oxide semiconductor having the same composition. Note that it is difficult to deposit an oxide semiconductor having a density of lower than 78% of the density of the single crystal oxide semiconductor.
For example, in the case of an oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, the density of single crystal InGaZnO4 with a rhombohedral crystal structure is 6.357 g/cm3. Accordingly, in the case of the oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, the density of the a-like OS is higher than or equal to 5.0 g/cm3 and lower than 5.9 g/cm3. For example, in the case of the oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, the density of each of the nc-OS and the CAAC-OS is higher than or equal to 5.9 g/cm3 and lower than 6.3 g/cm3.
Note that single crystals with the same composition do not exist in some cases. In that case, single crystal oxide semiconductors with different compositions are combined at an adequate ratio, which makes it possible to calculate density equivalent to that of a single crystal oxide semiconductor with the desired composition. The density of a single crystal oxide semiconductor having the desired composition can be calculated using a weighted average according to the combination ratio of the single crystal oxide semiconductors with different compositions. Note that it is preferable to use as few kinds of single crystal oxide semiconductors as possible to calculate the density.
As described above, oxide semiconductors have various structures and various properties. Note that an oxide semiconductor may be a stacked layer including two or more of an amorphous oxide semiconductor, an a-like OS, an nc-OS, and a CAAC-OS, for example.
In Embodiment 1, one embodiment of the present invention has been described. Note that one embodiment of the present invention is not limited to the above examples. That is, since various embodiments of the present invention are disclosed in Embodiment 1 and Embodiments 2 to 5, one embodiment of the present invention is not limited to a specific embodiment. The example in which an oxide semiconductor is used as a semiconductor has been described as one embodiment of the present invention; however, one embodiment of the present invention is not limited thereto. Depending on cases or conditions, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used in one embodiment of the present invention.
The structure and method described in this embodiment can be implemented by being combined as appropriate with any of the other structures and methods described in the other embodiments.
Embodiment 2
In this embodiment, a method for manufacturing a transistor, which is partly different from that of the transistor in Embodiment 1, is described. The transistor in this embodiment differs from the transistor in Embodiment 1 in that a conductor functioning as a source electrode and a drain electrode also functions as a wiring.
FIG. 15A, FIG. 16A, FIG. 17A, FIG. 18A, and FIG. 19A are top views illustrating a method for manufacturing a transistor. FIG. 15B, FIG. 16B, FIG. 17B, FIG. 18B, and FIG. 19B are each a cross-sectional view taken along dashed-dotted line A1-A2 shown in the corresponding top view. FIG. 15C, FIG. 16C, FIG. 17C, FIG. 18C, and FIG. 19C are each a cross-sectional view taken along dashed-dotted line A3-A4 shown in the corresponding top view. Note that for portions shown by the same reference numerals in the other embodiment, refer to the description in the other embodiment.
First, the substrate 201 is prepared.
Next, the insulator 205 is formed.
Next, a semiconductor is formed. The semiconductor can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like. Note that the semiconductor may be a single layer or a stacked layer including two or more layers. Here, a semiconductor including two layers is formed.
Next, heat treatment is preferably performed. The heat treatment can reduce the hydrogen concentration of the semiconductor in some cases. Furthermore, oxygen vacancies in the semiconductor can be reduced in some cases. The heat treatment can be performed at a temperature higher than or equal to 250° C. and lower than or equal to 650° C., preferably higher than or equal to 450° C. and lower than or equal to 600° C., and further preferably higher than or equal to 520° C. and lower than or equal to 570° C. The heat treatment is performed in an inert gas atmosphere or an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more. The heat treatment may be performed under a reduced pressure. Alternatively, the heat treatment may be performed in such a manner that heat treatment is performed in an inert gas atmosphere, and then another heat treatment is performed in an atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or 10% or more in order to compensate desorbed oxygen. By the heat treatment, crystallinity of the semiconductor can be increased and impurities such as hydrogen and water can be removed.
Next, a resist or the like is formed over the semiconductor, and processing is performed using the resist or the like to form the semiconductors 213a and 213b (see FIGS. 15A to 15C).
Next, a conductor to be the conductor 203 is formed. The conductor can be formed by a sputtering method, a CVD method, an MBE method, a PLD method, an ALD method, or the like.
The conductor may be formed to have a single-layer structure or a stacked-layer structure including a conductor containing, for example, one or more kinds of boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, silver, indium, tin, tantalum, platinum, strontium, iridium, and tungsten. An alloy or a compound of the above element may be used, for example, and a conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin, and oxygen, a conductor containing titanium and nitrogen, or the like may be used.
Next, a resist or the like is formed over the conductor and processing is performed using the resist or the like, whereby the conductor 203 is formed (see FIGS. 16A to 16C).
Note that although the conductor 203 illustrated in FIGS. 16A to 16C is formed to cover the semiconductors 213a and 213b, one embodiment of the present invention is not limited thereto. For example, a structure in which a conductor 204 is formed only over the semiconductors 213a and 213b as illustrated in FIG. 36B may be employed.
Next, the insulator 209 is formed.
The insulator 209 may be formed to have a flat top surface. For example, the top surface of the insulator 209 may have planarity immediately after the film formation. Alternatively, after the film formation, an upper portion of the insulator 209 may be removed so that the top surface of the insulator 209 becomes parallel to a reference surface such as a rear surface of the substrate. Such treatment is referred to as planarization treatment. As the planarization treatment, for example, chemical mechanical polishing (CMP) treatment, dry etching treatment, or the like can be performed. However, the top surface of the insulator 209 is not necessarily flat.
Next, the insulator 211 and the insulator 213 are formed (see FIGS. 17A to 17C).
Next, as in Embodiment 1, the insulator 213, the insulator 211, the insulator 209, and the conductor 203 are processed to partly expose the semiconductor 213b, so that the insulator 214, the insulator 212, the insulator 210, a conductor 216a, and a conductor 216b are formed (see FIGS. 18A to 18C).
Next, as in Embodiment 1, the semiconductor 213c, the insulator 223, and the conductor 225 are formed (see FIGS. 19A to 19C).
As described above, a method in which a groove is formed in an insulator first, a conductor is formed over an entire surface, and the entire surface is polished by CMP treatment or the like is referred to as a damascene method. The conductor 225 is formed by a damascene method. A method including a step of forming a groove where a wiring portion is to be formed and a step of forming a groove in a layer under the wiring portion is referred to as a dual damascene method. The dual damascene method includes a step of forming a groove in a lower layer and a groove where a wiring portion is to be formed, a step of depositing a material to be the wiring portion, a step of removing the wiring material other than the wiring portion by a CMP method, and the like.
Furthermore, as in Embodiment 1, the insulator 216, the conductor 217a, the conductor 217b, the conductor 219a, and the conductor 219b may be formed.
Through the above process, the transistor of one embodiment of the present invention can be manufactured.
The area of the top surface of the conductor 225 is larger than that of the bottom surface thereof when seen from the above.
The insulator 212 preferably has a higher relative dielectric constant than the insulator 210.
In Embodiment 2, one embodiment of the present invention has been described. Note that one embodiment of the present invention is not limited to the above examples. That is, since various embodiments of the present invention are disclosed in Embodiment 2, Embodiment 1, and Embodiments 3 to 5, one embodiment of the present invention is not limited to a specific embodiment. The example in which an oxide semiconductor is used as a semiconductor has been described as one embodiment of the present invention; however, one embodiment of the present invention is not limited thereto. Depending on cases or conditions, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used in one embodiment of the present invention.
The structure and method described in this embodiment can be implemented by being combined as appropriate with any of the other structures and methods described in the other embodiments.
Embodiment 3
In this embodiment, a method for manufacturing a transistor, which is partly different from any of the methods for manufacturing the transistors in Embodiments 1 and 2, is described.
FIG. 20A, FIG. 21A, FIG. 22A, FIG. 23A, and FIG. 24A are top views illustrating a method for manufacturing a transistor. FIG. 20B, FIG. 21B, FIG. 22B, FIG. 23B, and FIG. 24B are each a cross-sectional view taken along dashed-dotted line A1-A2 shown in the corresponding top view. FIG. 20C, FIG. 21C, FIG. 22C, FIG. 23C, and FIG. 24C are each a cross-sectional view taken along dashed-dotted line A3-A4 shown in the corresponding top view. Note that for portions shown by the same reference numerals in the other embodiment, refer to the description in the other embodiment.
First, the steps up to the step which is illustrated in FIGS. 3A to 3C and described in Embodiment 1 are performed.
Next, the insulator 211 is formed over the insulator 209 (see FIGS. 20A to 20C).
Next, a resist or the like is formed over the insulator 211, and processing is performed using the resist or the like to partly expose the semiconductor 213b, so that the insulator 212, the insulator 210, the conductor 215a, and the conductor 215b are formed (see FIGS. 21A to 21C).
Next, a semiconductor to be a semiconductor 213d and an insulator to be an insulator 234 are formed. After that, a conductor to be a conductor 226 is formed so as to fill a groove formed in the insulator 210 and the insulator 212, and then CMP treatment is performed so that a surface of the insulator 212 is exposed, whereby the semiconductor 213d, the insulator 234, and the conductor 226 are formed (see FIGS. 22A to 22C).
Next, an insulator is formed over the insulator 212 and processed to form the insulator 214 (see FIGS. 23A to 23C).
Next, a conductor to be a conductor 235 is formed so as to fill a groove in the insulator 214, and CMP treatment is performed so that a surface of the insulator 214 is exposed, whereby the conductor 235 is formed (see FIGS. 24A to 24C).
A method in which a groove is formed in an insulator first, a conductor is formed on an entire surface, and the entire surface is polished by CMP treatment or the like as described above is referred to as a damascene method. The conductor 226 and the conductor 235 are formed by a damascene method. A method in which a groove where a wiring portion is formed and a groove formed in a layer under the wiring portion are individually filled with a conductor as in this embodiment is referred to as a single damascene method.
Furthermore, as in Embodiment 1, the insulator 216, the conductor 217a, the conductor 217b, the conductor 219a, and the conductor 219b may be formed.
Through the above process, the transistor of one embodiment of the present invention can be manufactured.
The area of the conductor 235 is larger than that of the conductor 226 when seen from the above.
The insulator 212 preferably has a higher relative dielectric constant than the insulator 210.
In Embodiment 3, one embodiment of the present invention has been described. Note that one embodiment of the present invention is not limited to the above examples. That is, since various embodiments of the present invention are disclosed in Embodiment 3 and Embodiments 1, 2, 4, and 5, one embodiment of the present invention is not limited to a specific embodiment. The example in which an oxide semiconductor is used as a semiconductor has been described as one embodiment of the present invention; however, one embodiment of the present invention is not limited thereto. Depending on cases or conditions, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used in one embodiment of the present invention.
The structure and method described in this embodiment can be implemented by being combined as appropriate with any of the other structures and methods described in the other embodiments.
Embodiment 4
In this embodiment, a method for manufacturing a transistor, which is partly different from any of the methods for manufacturing the transistors in Embodiments 1 and 2, is described.
FIG. 25A, FIG. 26A, and FIG. 27A are top views illustrating a method for manufacturing a transistor. FIG. 25B, FIG. 26B, and FIG. 27B are each a cross-sectional view taken along dashed-dotted line A1-A2 shown in the corresponding top view. FIG. 25C, FIG. 26C, and FIG. 27C are each a cross-sectional view taken along dashed-dotted line A3-A4 shown in the corresponding top view. Note that for portions shown by the same reference numerals in the other embodiment, refer to the description in the other embodiment.
First, the steps up to the step which is illustrated in FIGS. 21A to 21C and described in Embodiment 3 are performed.
Next, a sacrifice layer to be a sacrifice layer 240 is formed, and then CMP treatment is performed so that the surface of the insulator 212 is exposed, whereby the sacrifice layer 240 is formed (see FIGS. 25A to 25C).
Next, an insulator is formed over the insulator 212 and processed to form the insulator 214 (see FIGS. 26A to 26C).
Next, the sacrifice layer 240 is selectively removed (see FIGS. 27A to 27C). The sacrifice layer 240 is preferably removed by wet etching.
Next, the steps after the step illustrated in FIGS. 7A to 7C in Embodiment 1 are performed.
Through the above process, the transistor of one embodiment of the present invention can be manufactured.
The area of the top surface of the conductor 225 is larger than that of the bottom surface thereof when seen from the above.
The insulator 212 preferably has a higher relative dielectric constant than the insulator 210.
In Embodiment 4, one embodiment of the present invention has been described. Note that one embodiment of the present invention is not limited to the above examples. That is, since various embodiments of the present invention are disclosed in Embodiment 4 and Embodiments 1, 2, 3, and 5, one embodiment of the present invention is not limited to a specific embodiment. The example in which an oxide semiconductor is used as a semiconductor has been described as one embodiment of the present invention; however, one embodiment of the present invention is not limited thereto. Depending on cases or conditions, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like may be used in one embodiment of the present invention.
The structure and method described in this embodiment can be implemented by being combined as appropriate with any of the other structures and methods described in the other embodiments.
Embodiment 5
Memory Device 1
An example of a semiconductor device (memory device) which includes the transistor of one embodiment of the present invention, which can retain stored data even when not powered, and which has an unlimited number of write cycles is shown in FIGS. 28A and 28B.
The semiconductor device illustrated in FIG. 28A includes a transistor 3200 using a first semiconductor, a transistor 3300 using a second semiconductor, and a capacitor 3400. Note that any of the above-described transistors can be used as the transistor 3300.
The transistor 3300 is preferably a transistor with low off-state current. For example, a transistor including an oxide semiconductor can be used as the transistor 3300, for example. Since the off-state current of the transistor 3300 is low, stored data can be retained for a long period at a predetermined node of the semiconductor device. In other words, power consumption of the semiconductor device can be reduced because refresh operation becomes unnecessary or the frequency of refresh operation can be extremely low.
In FIG. 28A, a first wiring 3001 is electrically connected to a source of the transistor 3200. A second wiring 3002 is electrically connected to a drain of the transistor 3200. A third wiring 3003 is electrically connected to one of the source and the drain of the transistor 3300. A fourth wiring 3004 is electrically connected to the gate of the transistor 3300. The gate of the transistor 3200 and the other of the source and the drain of the transistor 3300 are electrically connected to the one electrode of the capacitor 3400. A fifth wiring 3005 is electrically connected to the other electrode of the capacitor 3400.
The semiconductor device in FIG. 28A has a feature that the potential of the gate of the transistor 3200 can be retained, and thus enables writing, retaining, and reading of data as follows.
Writing and retaining of data are described. First, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is on, so that the transistor 3300 is turned on. Accordingly, the potential of the third wiring 3003 is supplied to a node FG where the gate of the transistor 3200 and the one electrode of the capacitor 3400 are electrically connected to each other. That is, a predetermined charge is supplied to the gate of the transistor 3200 (writing). Here, one of two kinds of charges providing different potential levels (hereinafter referred to as a low-level charge and a high-level charge) is supplied. After that, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is off, so that the transistor 3300 is turned off Thus, the charge is held at the node FG (retaining).
Since the off-state current of the transistor 3300 is low, the charge of the node FG is retained for a long time.
Next, reading of data is described. An appropriate potential (a reading potential) is supplied to the fifth wiring 3005 while a predetermined potential (a constant potential) is supplied to the first wiring 3001, whereby the potential of the second wiring 3002 varies depending on the amount of charge retained in the node FG. This is because in the case of using an n-channel transistor as the transistor 3200, an apparent threshold voltage Vth_H at the time when the high-level charge is given to the gate of the transistor 3200 is lower than an apparent threshold voltage Vth_L at the time when the low-level charge is given to the gate of the transistor 3200. Here, an apparent threshold voltage refers to the potential of the fifth wiring 3005 which is needed to make the transistor 3200 be in “on state”. Thus, the potential of the fifth wiring 3005 is set to a potential V0 which is between Vth_H and Vth_L, whereby charge supplied to the node FG can be determined. For example, in the case where the high-level charge is supplied to the node FG in writing and the potential of the fifth wiring 3005 is V0 (>Vth_H), the transistor 3200 is brought into “on state”. In the case where the low-level charge is supplied to the node FG in writing, even when the potential of the fifth wiring 3005 is V0 (<Vth_L), the transistor 3200 still remains in “off state”. Thus, the data retained in the node FG can be read by determining the potential of the second wiring 3002.
Note that in the case where memory cells are arrayed, it is necessary that data of a desired memory cell be read in read operation. A configuration in which only data of a desired memory cell can be read by supplying a potential at which the transistor 3200 is in “off state” regardless of the electric charge supplied to the node FG, that is, a potential lower than Vth_H to the fifth wiring 3005 of memory cells from which data is not read may be employed. Alternatively, a configuration in which only data of a desired memory cell can be read by supplying a potential at which the transistor 3200 is brought into “on state” regardless of the electric charge supplied to the node FG, that is, a potential higher than Vth_L to the fifth wiring 3005 of memory cells from which data is not read may be employed.
<Structure 2 of Semiconductor Device>
FIG. 29 is a cross-sectional view of the semiconductor device of FIG. 28A. The semiconductor device shown in FIG. 29 includes the transistor 3200, the transistor 3300, and the capacitor 3400. The transistor 3300 and the capacitor 3400 are provided over the transistor 3200. Although an example where the transistor illustrated in FIGS. 1A to 1C is used as the transistor 3300 is shown, a semiconductor device of one embodiment of the present invention is not limited thereto. Therefore, the description regarding the above-mentioned transistors is referred to as appropriate.
The transistor 3200 illustrated in FIG. 29 is a transistor using a semiconductor substrate 450. The transistor 3200 includes a region 474a in the semiconductor substrate 450, a region 474b in the semiconductor substrate 450, an insulator 462, and a conductor 454.
In the transistor 3200, the regions 474a and 474b have a function as a source region and a drain region. The insulator 462 has a function as a gate insulator. The conductor 454 has a function as a gate electrode. Therefore, resistance of a channel formation region can be controlled by a potential applied to the conductor 454. In other words, conduction or non-conduction between the region 474a and the region 474b can be controlled by the potential applied to the conductor 454.
As the semiconductor substrate 450, a semiconductor substrate of silicon, germanium, or the like, or a compound semiconductor substrate of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide can be used, for example. A single crystal silicon substrate is preferably used as the semiconductor substrate 450.
For the semiconductor substrate 450, a semiconductor substrate including impurities imparting n-type conductivity is used. However, a semiconductor substrate including impurities imparting p-type conductivity may be used as the semiconductor substrate 450. In that case, a well including impurities imparting the n-type conductivity may be provided in a region where the transistor 3200 is formed. Alternatively, the semiconductor substrate 450 may be an i-type semiconductor substrate.
A top surface of the semiconductor substrate 450 preferably has a (110) plane. Then, on-state characteristics of the transistor 3200 can be improved.
The regions 474a and 474b are regions including impurities imparting the p-type conductivity. Accordingly, the transistor 3200 has a structure of a p-channel transistor.
Although the case where the transistor 3200 is a p-channel transistor is described, the transistor 3200 may be an n-channel transistor.
Note that the transistor 3200 is separated from an adjacent transistor by a region 460 and the like. The region 460 is an insulating region.
The semiconductor device illustrated in FIG. 29 includes the insulator 464, the insulator 466, the insulator 468, the insulator 470, the insulator 472, the insulator 475, the insulator 402, the insulator 410, the insulator 408, the insulator 409, the insulator 428, the insulator 465, the insulator 467, the insulator 469, the conductor 480a, the conductor 480b, the conductor 480b, the conductor 480c, the conductor 478a, the conductor 478b, the conductor 478c, the conductor 476a, the conductor 476b, the conductor 476c, a conductor 479a, a conductor 479b, a conductor 479c, the conductor 477a, the conductor 477b, the conductor 477c, the conductor 484a, the conductor 484b, the conductor 484c, the conductor 484d, the conductor 483a, the conductor 483b, the conductor 483c, the conductor 483d, the conductor 485a, the conductor 485b, the conductor 485c, the conductor 485d, the conductor 487a, the conductor 487b, the conductor 487c, a conductor 488a, a conductor 488b, a conductor 488c, the conductor 490a, the conductor 490b, the conductor 489a, the conductor 489b, the conductor 491a, the conductor 491b, the conductor 491c, the conductor 492a, the conductor 492b, the conductor 492c, the conductor 494, the semiconductor 406a, the semiconductor 406b, and the semiconductor 406c. 
The insulator 464 is provided over the transistor 3200. The insulator 466 is provided over the insulator 464. The insulator 468 is provided over the insulator 466. The insulator 470 is provided over the insulator 468. The insulator 472 is provided over the insulator 470. The insulator 475 is provided over the insulator 472. The transistor 3300 is provided over the insulator 475. The insulators 408 and 409 are provided over the transistor 3300. The insulator 428 is provided over the insulator 409. The insulator 465 is provided over the insulator 428. The capacitor 3400 is provided over the insulator 465. The insulator 469 is provided over the capacitor 3400.
The insulator 464 includes an opening reaching the region 474a, an opening reaching the region 474b, and an opening reaching the conductor 454. In the openings, the conductor 480a, the conductor 480b, and the conductor 480c are embedded.
In addition, the insulator 466 includes an opening reaching the conductor 480a, an opening reaching the conductor 480b, and an opening reaching the conductor 480c. In the openings, the conductor 478a, the conductor 478b, and the conductor 478c are embedded.
The insulator 468 includes an opening reaching the conductor 478a, an opening reaching the conductor 478b, and an opening reaching the conductor 478c. In the openings, the conductor 476a, the conductor 476b, and the conductor 476c are embedded.
The insulator 470 includes the conductor 479a, the conductor 479b, and the conductor 479c. The insulator 472 includes an opening reaching the conductor 479a through the insulator 470, an opening reaching the conductor 479b through the insulator 470, and an opening reaching the conductor 479c through the insulator 470. In the openings, the conductor 477a, the conductor 477b, and the conductor 477c are embedded.
Furthermore, the insulator 475 includes an opening overlapping with the channel formation region of the transistor 3300, an opening reaching the conductor 477a, an opening reaching the conductor 477b, and an opening reaching the conductor 477c. In the openings, the conductor 484a, the conductor 484b, the conductor 484c, and the conductor 484d are embedded.
The conductor 484d may have a function as a bottom gate electrode of the transistor 3300. Electric characteristics such as the threshold voltage of the transistor 3300 may be controlled by application of a constant potential to the conductor 484d, for example. Further alternatively, for example, the conductor 484d and the top gate electrode of the transistor 3300 may be electrically connected to each other. Thus, the on-state current of the transistor 3300 can be increased. A punch-through phenomenon can be suppressed; thus, stable electric characteristics in the saturation region of the transistor 3300 can be obtained.
The insulator 428 includes an opening reaching a conductor serving as one of a source electrode and a drain electrode of the transistor 3300 through the insulators 408, 409, and 410; an opening reaching a conductor serving as the other of the source electrode and the drain electrode of the transistor 3300 through the insulators 408, 409, and 410; an opening reaching the conductor 484b through the insulators 408, 409, 410, and 402; and an opening reaching a conductor serving as the gate electrode of the transistor 3300. In the openings, the conductor 483a, the conductor 483b, the conductor 483c, and the conductor 483d are embedded.
The insulator 465 includes the conductor 485a in contact with the conductor 483a, the conductor 485b in contact with the conductor 483b, the conductor 485c in contact with the conductor 483c, and the conductor 485d in contact with the conductor 483d. The insulator 465 includes an opening reaching the conductor 485a, an opening reaching the conductor 485b, and an opening reaching the conductor 485c. In the openings, the conductor 487a, the conductor 487b, and the conductor 487c are embedded.
The insulator 467 includes the conductor 488a in contact with the conductor 487a, the conductor 488b in contact with the conductor 487b, and the conductor 488c in contact with the conductor 487c. The insulator 467 also includes an opening reaching the conductor 488a and an opening reaching the conductor 488b. In the openings, the conductor 490a and the conductor 490b are embedded. The conductor 488c is in contact with the conductor 494 serving as one of electrodes of the capacitor 3400.
The insulator 469 includes the conductor 489a in contact with the conductor 490a and the conductor 489b in contact with the conductor 490b. The insulator 469 also includes an opening reaching the conductor 489a, an opening reaching the conductor 489b, and an opening reaching the conductor 496 serving as the other of the electrodes of the capacitor 3400. In the openings, the conductor 491a, the conductor 491b, and the conductor 491c are embedded.
The conductor 492a in contact with the conductor 491a, the conductor 492b in contact with the conductor 491b, and the conductor 492c in contact with the conductor 491c are provided over the insulator 469.
The insulators 464, 466, 468, 470, 472, 475, 402, 410, 408, 409, 428, 465, 467, and 469 may each be formed to have, for example, a single-layer structure or a stacked-layer structure including an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum. The insulator 464 may be formed using, for example, aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
At least one of the insulators 464, 466, 468, 470, 472, 475, 402, 410, 408, 409, 428, 465, 467, and 469 preferably has a function of blocking oxygen and impurities such as hydrogen. When an insulator that has a function of blocking oxygen and impurities such as hydrogen is placed near the transistor 3300, the electrical characteristics of the transistor 3300 can be stable.
An insulator with a function of blocking oxygen and impurities such as hydrogen may have a single-layer structure or a stacked-layer structure including an insulator containing, for example, boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum.
The conductors 480a, 480b, 480c, 478a, 478b, 478c, 476a, 476b, 476c, 479a, 479b, 479c, 477a, 477b, 477c, 484a, 484b, 484c, 484d, 483a, 483b, 483c, 483d, 485a, 485b, 485c, 485d, 487a, 487b, 487c, 488a, 488b, 488c, 490a, 490b, 489a, 489b, 491a, 491b, 491c, 492a, 492b, and 492c may be formed to have a single-layer structure or a stacked-layer structure including a conductor containing, for example, one or more kinds of boron, nitrogen, oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium, silver, indium, tin, tantalum, and tungsten. An alloy or a compound of the above element may be used, for example, and a conductor containing aluminum, a conductor containing copper and titanium, a conductor containing copper and manganese, a conductor containing indium, tin, and oxygen, a conductor containing titanium and nitrogen, or the like may be used.
The source or drain of the transistor 3200 is electrically connected to the conductor that is one of the source electrode and the drain electrode of the transistor 3300 through the conductor 480a, the conductor 478a, the conductor 476a, the conductor 479a, the conductor 477a, the conductor 484a, and the conductor 483a. The conductor 454 that is the gate electrode of the transistor 3200 is electrically connected to the conductor that is the other of the source electrode and the drain electrode of the transistor 3300 through the conductor 480c, the conductor 478c, the conductor 476c, the conductor 479c, the conductor 477c, the conductor 484c, and the conductor 483c. 
The capacitor 3400 includes one of the source electrode and the drain electrode of the transistor 3300; the conductor 494 electrically connected to the one of the electrodes of the capacitor 3400 through the conductors 483c, 485c, 487c, and 488c; the insulator 498; and the conductor 496 serving as the other of the electrodes of the capacitor 3400. Note that it is preferable that the capacitor 3400 be formed above or below the transistor 3300 because a reduction in size of the semiconductor device can be achieved.
For the structures of other components, the description of FIGS. 1A to 1C and the like can be referred to as appropriate.
A semiconductor device in FIG. 30 is the same as the semiconductor device in FIG. 29 except the structure of the transistor 3200. Therefore, the description of the semiconductor device in FIG. 29 is referred to for the semiconductor device in FIG. 30. Specifically, in the semiconductor device in FIG. 30, the transistor 3200 is a FIN-type transistor. The effective channel width is increased in the FIN-type transistor 3200, whereby the on-state characteristics of the transistor 3200 can be improved. In addition, since contribution of the electric field of the gate electrode can be increased, the off-state characteristics of the transistor 3200 can be improved. Note that the transistor 3200 may be either a p-channel transistor or an n-channel transistor.
<Memory Device 2>
The semiconductor device in FIG. 28B is different from the semiconductor device in FIG. 28A in that the transistor 3200 is not provided. Also in this case, data can be written and retained in a manner similar to that of the semiconductor device in FIG. 28A.
Reading of data in the semiconductor device in FIG. 28B is described. When the transistor 3300 is brought into on state, the third wiring 3003 which is in a floating state and the capacitor 3400 are brought into conduction, and the charge is redistributed between the third wiring 3003 and the capacitor 3400. As a result, the potential of the third wiring 3003 is changed. The amount of change in the potential of the third wiring 3003 varies depending on the potential of the one electrode of the capacitor 3400 (or the charge accumulated in the capacitor 3400).
For example, the potential of the third wiring 3003 after the charge redistribution is (CB×VB0+C×V)/(CB+C), where V is the potential of the one electrode of the capacitor 3400, C is the capacitance of the capacitor 3400, CB is the capacitance component of the third wiring 3003, and VB0 is the potential of the third wiring 3003 before the charge redistribution. Thus, it can be found that, assuming that the memory cell is in either of two states in which the potential of the one electrode of the capacitor 3400 is V1 and V0 (V1>V0), the potential of the third wiring 3003 in the case of retaining the potential V1 (=(CB×VB0+C×V1)/(CB+C)) is higher than the potential of the third wiring 3003 in the case of retaining the potential V0 (=(CB×VB0+C×V0)/(CB+C)).
Then, by comparing the potential of the third wiring 3003 with a predetermined potential, data can be read.
In this case, a transistor including the first semiconductor may be used for a driver circuit for driving a memory cell, and a transistor including the second semiconductor may be stacked over the driver circuit as the transistor 3300.
When including a transistor using an oxide semiconductor and having a low off-state current, the semiconductor device described above can retain stored data for a long time. In other words, power consumption of the semiconductor device can be reduced because refresh operation becomes unnecessary or the frequency of refresh operation can be extremely low. Moreover, stored data can be retained for a long time even when power is not supplied (note that a potential is preferably fixed).
In the semiconductor device, high voltage is not needed for writing data and deterioration of elements is less likely to occur. Unlike in a conventional nonvolatile memory, for example, it is not necessary to inject and extract electrons into and from a floating gate; thus, a problem such as deterioration of an insulator is not caused. That is, the semiconductor device of one embodiment of the present invention does not have a limit on the number of times data can be rewritten, which is a problem of a conventional nonvolatile memory, and the reliability thereof is drastically improved. Furthermore, data is written depending on the on/off state of the transistor, whereby high-speed operation can be achieved.
(CMOS Circuit)
A circuit diagram in FIG. 31A shows a configuration of a CMOS circuit in which the p-channel transistor 2200 and the n-channel transistor 2100 are connected to each other in series and in which gates of them are connected to each other.
(Analog Switch)
A circuit diagram in FIG. 31B shows a configuration in which sources of the transistors 2100 and 2200 are connected to each other and drains of the transistors 2100 and 2200 are connected to each other. With such a configuration, the transistors can function as an analog switch.
<CPU>
A CPU including a semiconductor device such as any of the above-described transistors or the above-described memory device is described below.
FIG. 32 is a block diagram illustrating a configuration example of a CPU including any of the above-described transistors as a component.
The CPU illustrated in FIG. 32 includes, over a substrate 1190, an arithmetic logic unit (ALU) 1191, an ALU controller 1192, an instruction decoder 1193, an interrupt controller 1194, a timing controller 1195, a register 1196, a register controller 1197, a bus interface 1198, a rewritable ROM 1199, and a ROM interface 1189. A semiconductor substrate, an SOI substrate, a glass substrate, or the like is used as the substrate 1190. The ROM 1199 and the ROM interface 1189 may be provided over a separate chip. Needless to say, the CPU in FIG. 32 is just an example in which the configuration has been simplified, and an actual CPU has various configurations depending on the application. For example, the CPU may have the following configuration: a structure including the CPU illustrated in FIG. 32 or an arithmetic circuit is considered as one core; a plurality of the cores are included; and the cores operate in parallel. The number of bits that the CPU can process in an internal arithmetic circuit or in a data bus can be 8, 16, 32, or 64, for example.
An instruction that is input to the CPU through the bus interface 1198 is input to the instruction decoder 1193 and decoded therein, and then, input to the ALU controller 1192, the interrupt controller 1194, the register controller 1197, and the timing controller 1195.
The ALU controller 1192, the interrupt controller 1194, the register controller 1197, and the timing controller 1195 conduct various controls in accordance with the decoded instruction. Specifically, the ALU controller 1192 generates signals for controlling the operation of the ALU 1191. While the CPU is executing a program, the interrupt controller 1194 processes an interrupt request from an external input/output device or a peripheral circuit depending on its priority or a mask state. The register controller 1197 generates an address of the register 1196, and reads/writes data from/to the register 1196 depending on the state of the CPU.
The timing controller 1195 generates signals for controlling operation timings of the ALU 1191, the ALU controller 1192, the instruction decoder 1193, the interrupt controller 1194, and the register controller 1197. For example, the timing controller 1195 includes an internal clock generator for generating an internal clock signal on the basis of a reference clock signal, and supplies the internal clock signal to the above circuits.
In the CPU illustrated in FIG. 32, a memory cell is provided in the register 1196. For the memory cell of the register 1196, any of the above-described transistors, the above-described memory device, or the like can be used.
In the CPU illustrated in FIG. 32, the register controller 1197 selects operation of holding data in the register 1196 in accordance with an instruction from the ALU 1191. That is, the register controller 1197 selects whether data is held by a flip-flop or by a capacitor in the memory cell included in the register 1196. When data holding by the flip-flop is selected, a power supply voltage is supplied to the memory cell in the register 1196. When data holding by the capacitor is selected, the data is rewritten in the capacitor, and supply of power supply voltage to the memory cell in the register 1196 can be stopped.
FIG. 33 is an example of a circuit diagram of a memory element that can be used as the register 1196. A memory element 1200 includes a circuit 1201 in which stored data is volatile when power supply is stopped, a circuit 1202 in which stored data is nonvolatile even when power supply is stopped, a switch 1203, a switch 1204, a logic element 1206, a capacitor 1207, and a circuit 1220 having a selecting function. The circuit 1202 includes a capacitor 1208, a transistor 1209, and a transistor 1210. Note that the memory element 1200 may further include another element such as a diode, a resistor, or an inductor, as needed.
Here, the above-described memory device can be used as the circuit 1202. When supply of a power supply voltage to the memory element 1200 is stopped, GND (0 V) or a potential at which the transistor 1209 in the circuit 1202 is turned off continues to be input to a gate of the transistor 1209. For example, the gate of the transistor 1209 is grounded through a load such as a resistor.
Shown here is an example in which the switch 1203 is a transistor 1213 having one conductivity type (e.g., an n-channel transistor) and the switch 1204 is a transistor 1214 having a conductivity type opposite to the one conductivity type (e.g., a p-channel transistor). A first terminal of the switch 1203 corresponds to one of a source and a drain of the transistor 1213, a second terminal of the switch 1203 corresponds to the other of the source and the drain of the transistor 1213, and conduction or non-conduction between the first terminal and the second terminal of the switch 1203 (i.e., the on/off state of the transistor 1213) is selected by a control signal RD input to a gate of the transistor 1213. A first terminal of the switch 1204 corresponds to one of a source and a drain of the transistor 1214, a second terminal of the switch 1204 corresponds to the other of the source and the drain of the transistor 1214, and conduction or non-conduction between the first terminal and the second terminal of the switch 1204 (i.e., the on/off state of the transistor 1214) is selected by the control signal RD input to a gate of the transistor 1214.
One of a source and a drain of the transistor 1209 is electrically connected to one of a pair of electrodes of the capacitor 1208 and a gate of the transistor 1210. Here, the connection portion is referred to as a node M2. One of a source and a drain of the transistor 1210 is electrically connected to a line which can supply a low power supply potential (e.g., a GND line), and the other thereof is electrically connected to the first terminal of the switch 1203 (the one of the source and the drain of the transistor 1213). The second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is electrically connected to the first terminal of the switch 1204 (the one of the source and the drain of the transistor 1214). The second terminal of the switch 1204 (the other of the source and the drain of the transistor 1214) is electrically connected to a line which can supply a power supply potential VDD. The second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213), the first terminal of the switch 1204 (the one of the source and the drain of the transistor 1214), an input terminal of the logic element 1206, and one of a pair of electrodes of the capacitor 1207 are electrically connected to each other. Here, the connection portion is referred to as a node M1. The other of the pair of electrodes of the capacitor 1207 can be supplied with a constant potential. For example, the other of the pair of electrodes can be supplied with a low power supply potential (e.g., GND) or a high power supply potential (e.g., VDD). The other of the pair of electrodes of the capacitor 1207 is electrically connected to the line which can supply a low power supply potential (e.g., a GND line). The other of the pair of electrodes of the capacitor 1208 can be supplied with a constant potential. For example, the other of the pair of electrodes can be supplied with a low power supply potential (e.g., GND) or a high power supply potential (e.g., VDD). The other of the pair of electrodes of the capacitor 1208 is electrically connected to the line which can supply a low power supply potential (e.g., a GND line).
The capacitor 1207 and the capacitor 1208 are not necessarily provided as long as the parasitic capacitance of the transistor, the wiring, or the like is actively utilized.
A control signal WE is input to the gate of the transistor 1209. As for each of the switch 1203 and the switch 1204, a conduction state or a non-conduction state between the first terminal and the second terminal is selected by the control signal RD which is different from the control signal WE. When the first terminal and the second terminal of one of the switches are in the conduction state, the first terminal and the second terminal of the other of the switches are in the non-conduction state.
A signal corresponding to data retained in the circuit 1201 is input to the other of the source and the drain of the transistor 1209. FIG. 33 illustrates an example in which a signal output from the circuit 1201 is input to the other of the source and the drain of the transistor 1209. The logic value of a signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is inverted by the logic element 1206, and the inverted signal is input to the circuit 1201 through the circuit 1220.
In the example of FIG. 33, a signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is input to the circuit 1201 through the logic element 1206 and the circuit 1220; however, one embodiment of the present invention is not limited thereto. The signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) may be input to the circuit 1201 without its logic value being inverted. For example, in the case where the circuit 1201 includes a node in which a signal obtained by inversion of the logic value of a signal input from the input terminal is retained, the signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) can be input to the node.
In FIG. 33, the transistors included in the memory element 1200 except for the transistor 1209 can each be a transistor in which a channel is formed in a film formed using a semiconductor other than an oxide semiconductor or in the substrate 1190. For example, the transistor can be a transistor whose channel is formed in a silicon film or a silicon substrate. Alternatively, all the transistors in the memory element 1200 may be a transistor in which a channel is formed in an oxide semiconductor. Further alternatively, in the memory element 1200, a transistor in which a channel is formed in an oxide semiconductor can be included besides the transistor 1209, and a transistor in which a channel is formed in a layer using a semiconductor other than an oxide semiconductor or in the substrate 1190 can be used for the rest of the transistors.
As the circuit 1201 in FIG. 33, for example, a flip-flop circuit can be used. As the logic element 1206, for example, an inverter or a clocked inverter can be used.
In a period during which the memory element 1200 is not supplied with the power supply voltage, the semiconductor device of one embodiment of the present invention can retain data stored in the circuit 1201 by the capacitor 1208 which is provided in the circuit 1202.
The off-state current of a transistor in which a channel is formed in an oxide semiconductor is extremely low. For example, the off-state current of a transistor in which a channel is formed in an oxide semiconductor is significantly lower than that of a transistor in which a channel is formed in silicon having crystallinity. Thus, when the transistor is used as the transistor 1209, a signal held in the capacitor 1208 is retained for a long time also in a period during which the power supply voltage is not supplied to the memory element 1200. The memory element 1200 can accordingly retain the stored content (data) also in a period during which the supply of the power supply voltage is stopped.
Since the above-described memory element performs pre-charge operation with the switch 1203 and the switch 1204, the time required for the circuit 1201 to retain original data again after the supply of the power supply voltage is restarted can be shortened.
In the circuit 1202, a signal retained by the capacitor 1208 is input to the gate of the transistor 1210. Therefore, after supply of the power supply voltage to the memory element 1200 is restarted, the signal retained by the capacitor 1208 can be converted into the one corresponding to the state (the on state or the off state) of the transistor 1210 to be read from the circuit 1202. Consequently, an original signal can be accurately read even when a potential corresponding to the signal retained by the capacitor 1208 varies to some degree.
By applying the above-described memory element 1200 to a memory device such as a register or a cache memory included in a processor, data in the memory device can be prevented from being lost owing to the stop of the supply of the power supply voltage. Furthermore, shortly after the supply of the power supply voltage is restarted, the memory element can be returned to the same state as that before the power supply is stopped. Therefore, the power supply can be stopped even for a short time in the processor or one or a plurality of logic circuits included in the processor. Accordingly, power consumption can be suppressed.
Although the memory element 1200 is used in a CPU, the memory element 1200 can also be used in an LSI such as a digital signal processor (DSP), a custom LSI, or a programmable logic device (PLD), and a radio frequency integrated circuit (RF-IC).
<Display Device>
The following shows configuration examples of a display device of one embodiment of the present invention.
[Configuration Example]
FIG. 34A is a top view of a display device of one embodiment of the present invention. FIG. 34B illustrates a pixel circuit where a liquid crystal element is used for a pixel of a display device of one embodiment of the present invention. FIG. 34C illustrates a pixel circuit where an organic EL element is used for a pixel of a display device of one embodiment of the present invention.
Any of the above-described transistors can be used as a transistor used for the pixel. Here, an example in which an n-channel transistor is used is shown. Note that a transistor manufactured through the same steps as the transistor used for the pixel may be used for a driver circuit. Thus, by using any of the above-described transistors for a pixel or a driver circuit, the display device can have high display quality and/or high reliability.
FIG. 34A illustrates an example of an active matrix display device. A pixel portion 5001, a first scan line driver circuit 5002, a second scan line driver circuit 5003, and a signal line driver circuit 5004 are provided over a substrate 5000 in the display device. The pixel portion 5001 is electrically connected to the signal line driver circuit 5004 through a plurality of signal lines and is electrically connected to the first scan line driver circuit 5002 and the second scan line driver circuit 5003 through a plurality of scan lines. Pixels including display elements are provided in respective regions divided by the scan lines and the signal lines. The substrate 5000 of the display device is electrically connected to a timing control circuit (also referred to as a controller or a control IC) through a connection portion such as a flexible printed circuit (FPC).
The first scan line driver circuit 5002, the second scan line driver circuit 5003, and the signal line driver circuit 5004 are formed over the substrate 5000 where the pixel portion 5001 is formed. Therefore, the display device can be manufactured at cost lower than that in the case where a driver circuit is separately formed. Furthermore, in the case where a driver circuit is separately formed, the number of line connections is increased. By providing the driver circuit over the substrate 5000, the number of line connections can be reduced. Accordingly, the reliability and/or yield can be improved.
[Liquid Crystal Display Device]
FIG. 34B illustrates an example of a circuit configuration of the pixel. Here, a pixel circuit which is applicable to a pixel of a VA liquid crystal display device or the like is illustrated.
This pixel circuit can be used for a structure in which one pixel includes a plurality of pixel electrodes. The pixel electrodes are connected to different transistors, and the transistors can be driven with different gate signals. Accordingly, signals applied to individual pixel electrodes in a multi-domain pixel can be controlled independently.
A scan line 5012 of a transistor 5016 and a scan line 5013 of a transistor 5017 are separated so that different gate signals can be supplied thereto. In contrast, a signal line 5014 is shared by the transistors 5016 and 5017. Any of the above-described transistors can be used as appropriate as each of the transistors 5016 and 5017. Thus, the liquid crystal display device can have high display quality and/or high reliability.
A first pixel electrode is electrically connected to the transistor 5016 and a second pixel electrode is electrically connected to the transistor 5017. The first pixel electrode and the second pixel electrode are separated. There is no specific limitation on the shapes of the first pixel electrode and the second pixel electrode. For example, the first pixel electrode has a V shape.
A gate electrode of the transistor 5016 is electrically connected to the scan line 5012, and a gate electrode of the transistor 5017 is electrically connected to the scan line 5013. When different gate signals are supplied to the scan line 5012 and the scan line 5013, operation timings of the transistor 5016 and the transistor 5017 can be varied. As a result, alignment of liquid crystals can be controlled.
Furthermore, a capacitor may be formed using a capacitor line 5010, a gate insulator functioning as a dielectric, and a capacitor electrode electrically connected to the first pixel electrode or the second pixel electrode.
The pixel structure is a multi-domain structure in which a first liquid crystal element 5018 and a second liquid crystal element 5019 are provided in one pixel. The first liquid crystal element 5018 includes the first pixel electrode, a counter electrode, and a liquid crystal layer therebetween. The second liquid crystal element 5019 includes the second pixel electrode, the counter electrode, and the liquid crystal layer therebetween.
Note that a pixel circuit of the display device of one embodiment of the present invention is not limited to that shown in FIG. 34B. For example, a switch, a resistor, a capacitor, a transistor, a sensor, a logic circuit, or the like may be added to the pixel circuit shown in FIG. 34B.
[Organic EL Display Device]
FIG. 34C illustrates another example of a circuit configuration of the pixel. Here, a pixel structure of a display device using an organic EL element is shown.
In an organic EL element, by application of voltage to a light-emitting element, electrons are injected from one of a pair of electrodes included in the organic EL element and holes are injected from the other of the pair of electrodes, into a layer containing a light-emitting organic compound; thus, current flows. The electrons and holes are recombined, and thus, the light-emitting organic compound is excited. The light-emitting organic compound returns to a ground state from the excited state, thereby emitting light. Based on such a mechanism, such a light-emitting element is referred to as a current-excitation type light-emitting element.
FIG. 34C illustrates an example of a pixel circuit. Here, one pixel includes two n-channel transistors. Note that any of the above-described transistors can be used as the n-channel transistors. Furthermore, digital time grayscale driving can be employed for the pixel circuit.
The configuration of the applicable pixel circuit and operation of a pixel employing digital time grayscale driving will be described.
A pixel 5020 includes a switching transistor 5021, a driver transistor 5022, a light-emitting element 5024, and a capacitor 5023. A gate electrode of the switching transistor 5021 is connected to a scan line 5026, a first electrode (one of a source electrode and a drain electrode) of the switching transistor 5021 is connected to a signal line 5025, and a second electrode (the other of the source electrode and the drain electrode) of the switching transistor 5021 is connected to a gate electrode of the driver transistor 5022. The gate electrode of the driver transistor 5022 is connected to a power supply line 5027 through the capacitor 5023, a first electrode of the driver transistor 5022 is connected to the power supply line 5027, and a second electrode of the driver transistor 5022 is connected to a first electrode (a pixel electrode) of the light-emitting element 5024. A second electrode of the light-emitting element 5024 corresponds to a common electrode 5028. The common electrode 5028 is electrically connected to a common potential line provided over the same substrate.
As each of the switching transistor 5021 and the driver transistor 5022, any of the above-described transistors can be used. In this manner, an organic EL display device having high display quality and/or high reliability can be provided.
The potential of the second electrode (the common electrode 5028) of the light-emitting element 5024 is set to be a low power supply potential. Note that the low power supply potential is lower than a high power supply potential supplied to the power supply line 5027. For example, the low power supply potential can be GND, 0 V, or the like. The high power supply potential and the low power supply potential are set to be higher than or equal to the forward threshold voltage of the light-emitting element 5024, and the difference between the potentials is applied to the light-emitting element 5024, whereby current is supplied to the light-emitting element 5024, leading to light emission. The forward voltage of the light-emitting element 5024 refers to a voltage at which a desired luminance is obtained, and includes at least forward threshold voltage.
Note that gate capacitance of the driver transistor 5022 may be used as a substitute for the capacitor 5023 in some cases, so that the capacitor 5023 can be omitted. The gate capacitance of the driver transistor 5022 may be formed between the channel formation region and the gate electrode.
Next, a signal input to the driver transistor 5022 is described. In the case of a voltage-input voltage driving method, a video signal for turning on or off the driver transistor 5022 is input to the driver transistor 5022. In order for the driver transistor 5022 to operate in a linear region, voltage higher than the voltage of the power supply line 5027 is applied to the gate electrode of the driver transistor 5022. Note that voltage higher than or equal to voltage which is the sum of power supply line voltage and the threshold voltage Vth of the driver transistor 5022 is applied to the signal line 5025.
In the case of performing analog grayscale driving, a voltage higher than or equal to a voltage which is the sum of the forward voltage of the light-emitting element 5024 and the threshold voltage Vth of the driver transistor 5022 is applied to the gate electrode of the driver transistor 5022. A video signal by which the driver transistor 5022 is operated in a saturation region is input, so that current is supplied to the light-emitting element 5024. In order for the driver transistor 5022 to operate in a saturation region, the potential of the power supply line 5027 is set higher than the gate potential of the driver transistor 5022. When an analog video signal is used, it is possible to supply current to the light-emitting element 5024 in accordance with the video signal and perform analog grayscale driving.
Note that in the display device of one embodiment of the present invention, a pixel configuration is not limited to that shown in FIG. 34C. For example, a switch, a resistor, a capacitor, a sensor, a transistor, a logic circuit, or the like may be added to the pixel circuit shown in FIG. 34C.
In the case where any of the above-described transistors is used for the circuit shown in FIGS. 34A to 34C, the source electrode (the first electrode) is electrically connected to the low potential side and the drain electrode (the second electrode) is electrically connected to the high potential side. Furthermore, the potential of the first gate electrode may be controlled by a control circuit or the like and the potential described above as an example, e.g., a potential lower than the potential applied to the source electrode, may be input to the second gate electrode.
<Electronic Device>
The semiconductor device of one embodiment of the present invention can be used for display devices, personal computers, image reproducing devices provided with recording media (typically, devices which reproduce the content of recording media such as digital versatile discs (DVDs) and have displays for displaying the reproduced images), or the like. Other examples of electronic devices that can be equipped with the semiconductor device of one embodiment of the present invention are mobile phones, game machines including portable game consoles, portable data terminals, e-book readers, cameras such as video cameras and digital still cameras, goggle-type displays (head mounted displays), navigation systems, audio reproducing devices (e.g., car audio systems and digital audio players), copiers, facsimiles, printers, multifunction printers, automated teller machines (ATM), and vending machines. FIGS. 22A to 22F illustrate specific examples of these electronic devices.
FIG. 35A illustrates a portable game console including a housing 901, a housing 902, a display portion 903, a display portion 904, a microphone 905, a speaker 906, an operation key 907, a stylus 908, and the like. Although the portable game machine in FIG. 35A has the two display portions 903 and 904, the number of display portions included in a portable game console is not limited to this.
FIG. 35B illustrates a portable data terminal including a first housing 911, a second housing 912, a first display portion 913, a second display portion 914, a joint 915, an operation key 916, and the like. The first display portion 913 is provided in the first housing 911, and the second display portion 914 is provided in the second housing 912. The first housing 911 and the second housing 912 are connected to each other with the joint 915, and the angle between the first housing 911 and the second housing 912 can be changed with the joint 915. An image on the first display portion 913 may be switched depending on the angle between the first housing 911 and the second housing 912 at the joint 915. A display device with a position input function may be used as at least one of the first display portion 913 and the second display portion 914. Note that the position input function can be added by provision of a touch panel in a display device. Alternatively, the position input function can be added by provision of a photoelectric conversion element called a photosensor in a pixel portion of a display device.
FIG. 35C illustrates a laptop personal computer, which includes a housing 921, a display portion 922, a keyboard 923, a pointing device 924, and the like.
FIG. 35D illustrates an electric refrigerator-freezer including a housing 931, a door for a refrigerator 932, a door for a freezer 933, and the like.
FIG. 35E illustrates a video camera, which includes a first housing 941, a second housing 942, a display portion 943, operation keys 944, a lens 945, a joint 946, and the like. The operation keys 944 and the lens 945 are provided for the first housing 941, and the display portion 943 is provided for the second housing 942. The first housing 941 and the second housing 942 are connected to each other with the joint 946, and the angle between the first housing 941 and the second housing 942 can be changed with the joint 946. An image displayed on the display portion 943 may be switched in accordance with the angle at the joint 946 between the first housing 941 and the second housing 942.
FIG. 35F illustrates an ordinary vehicle including a car body 951, wheels 952, a dashboard 953, lights 954, and the like.
This application is based on Japanese Patent Application serial no. 2015-022392 filed with Japan Patent Office on Feb. 6, 2015, the entire contents of which are hereby incorporated by reference.

## Claims

1. A method for manufacturing a semiconductor device comprising the steps of:
forming a first insulator;
forming a first semiconductor over the first insulator;
forming a first conductor over the first semiconductor;
patterning the first conductor to form a second conductor;
patterning the first semiconductor to form a second semiconductor;
forming a second insulator over the second conductor;
forming a third insulator over the second insulator;
forming a fourth insulator over the third insulator;
removing a part of the fourth insulator to expose the third insulator;
removing a part of the third insulator to expose the second insulator;
removing a part of the second insulator to expose the second conductor;
removing a part of the second conductor to expose the second semiconductor;
forming a fifth insulator over the second semiconductor and the fourth insulator;
forming a third conductor over the fifth insulator; and
performing chemical mechanical polishing treatment to expose a top surface of the fourth insulator.

2. The method for manufacturing a semiconductor device according to claim 1, further comprising the steps of:
forming a third oxide semiconductor over the fifth insulator before the step of forming the third conductor.

3. The method for manufacturing a semiconductor device according to claim 1, wherein the first semiconductor includes two to four stacked oxide semiconductors.

4. The method for manufacturing a semiconductor device according claim 1,
wherein a surface of the second insulator is planarized by chemical mechanical polishing treatment.

5. The method for manufacturing a semiconductor device according to claim 1, wherein the third conductor includes at least two stacked conductors.

6. The method for manufacturing a semiconductor device according to claim 1, wherein the third conductor includes copper.

7. The method for manufacturing a semiconductor device according claim 1,
wherein the first semiconductor is a first oxide semiconductor, and
wherein the second semiconductor is a second oxide semiconductor.

8. A method for manufacturing a semiconductor device comprising the steps of:
forming a first insulator;
forming a first semiconductor over the first insulator;
patterning the first semiconductor to form a second semiconductor;
forming a first conductor over the second semiconductor;
patterning the first conductor to form a second conductor;
forming a second insulator over the second conductor;
forming a third insulator over the second insulator;
forming a fourth insulator over the third insulator;
removing a part of the fourth insulator to expose the third insulator;
removing a part of the third insulator to expose the second insulator;
removing a part of the second insulator to expose the second conductor;
removing a part of the second conductor to expose the second semiconductor;
forming a fifth insulator over the second semiconductor and the fourth insulator;
forming a third conductor over the fifth insulator; and
performing chemical mechanical polishing treatment to expose a top surface of the fourth insulator.

9. The method for manufacturing a semiconductor device according to claim 8, further comprising the steps of:
forming a third oxide semiconductor over the fifth insulator before the step of forming the third conductor.

10. The method for manufacturing a semiconductor device according to claim 8, wherein the first semiconductor includes two to four stacked oxide semiconductors.

11. The method for manufacturing a semiconductor device according claim 8, wherein a surface of the second insulator is planarized by chemical mechanical polishing treatment.

12. The method for manufacturing a semiconductor device according to claim 8, wherein the third conductor includes at least two stacked conductors.

13. The method for manufacturing a semiconductor device according to claim 8, wherein the third conductor includes copper.

14. The method for manufacturing a semiconductor device according to claim 8,
wherein the first semiconductor is a first oxide semiconductor, and
wherein the second semiconductor is a second oxide semiconductor.

15. A method for manufacturing a semiconductor device comprising the steps of:
forming a first insulator;
forming a first semiconductor over the first insulator;
forming a first conductor over the first semiconductor;
patterning the first conductor to form a second conductor;
patterning the first semiconductor to form a second semiconductor;
forming a second insulator over the second conductor;
forming a third insulator over the second insulator;
removing a part of the third insulator to expose the second insulator;
removing a part of the second insulator to expose the second conductor;
removing a part of the second conductor to expose the second semiconductor;
forming a sacrifice layer over the second semiconductor and the third insulator;
performing chemical mechanical polishing treatment to expose a top surface of the third insulator;
forming a fourth insulator over the third insulator and the sacrifice layer; removing a part of the fourth insulator to expose a top surface of the sacrifice layer;
removing the sacrifice layer to partly expose the second semiconductor;
forming a fifth insulator over the second semiconductor and the fourth insulator;
forming a third conductor over the fifth insulator; and
performing chemical mechanical polishing treatment to expose a top surface of the fourth insulator.

16. The method for manufacturing a semiconductor device according to claim 15, further comprising the steps of:
forming a third oxide semiconductor over the fifth insulator before the steps of forming the third conductor.

17. The method for manufacturing a semiconductor device according to claim 15, wherein the first semiconductor includes two to four stacked oxide semiconductors.

18. The method for manufacturing a semiconductor device according claim 15,
wherein a surface of the second insulator is planarized by chemical mechanical polishing treatment.

19. The method for manufacturing a semiconductor device according to claim 15, wherein the third conductor includes at least two stacked conductors.

20. The method for manufacturing a semiconductor device according to claim 15, wherein the third conductor includes copper.

21. A semiconductor device comprising:
a first insulator over a substrate;
a first semiconductor over the first insulator;
a second semiconductor over the first semiconductor;
a first conductor and a second conductor over the second semiconductor;
a second insulator over the first insulator, the first conductor, and the second conductor;
a third insulator over the second insulator;
a fourth insulator over the third insulator;
a third semiconductor over the second semiconductor;
a fifth insulator over the third semiconductor; and
a third conductor over the fifth insulator,
wherein an area of a top surface of the third conductor is larger than an area of a bottom surface of the third conductor, and
wherein a relative dielectric constant of the third insulator is higher than a relative dielectric constant of the second insulator.

22. The semiconductor device according to claim 21, wherein the third conductor includes at least two stacked conductors.

23. The semiconductor device according to claim 21, wherein the third conductor includes copper.

24. The method for manufacturing a semiconductor device according to claim 15,
wherein the first semiconductor is a first oxide semiconductor, and
wherein the second semiconductor is a second oxide semiconductor.