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  NIST Headquarters-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)--CHIPS Program Office---CHIPS Program Headquarters----CHIPS Program Headquarters - HQ----Opportunity & Inclusion Group---External & Government Affairs Division----External & Government Affairs – HQ---Investments Division----Investments Division – HQ---Operations Office----Operations Office – HQ---Risk Management Division----Risk Management – HQ---Strategy, Technology & Policy Division----Strategy, Technology & Policy – HQ--CHIPS Research & Development Program Office---CHIPS Research & Development Program Headquarters Division----CHIPS Research & Development Program Headquarters – HQ----Integration & Policy Office----Outreach & Partnerships Office---External R&D Partnerships Division----External R&D Partnerships – HQ----National Advanced Packaging Manufacturing Program Group----National Semiconductor Technology Center Group---Industrial Advisory Committee----Industrial Advisory Committee – HQ---Semiconductor Manufacturing Institute Division----Semiconductor Manufacturing Institute – HQ---Semiconductor Metrology & Characterization Office----Semiconductor Metrology & Characterization Office – HQ-Management Resources--Management Resources---Associate Director for Management Resources----Associate Director for Management Resources - 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HQ----Boulder Site Management Group----Administrative Operations Group----Program Office----Reimbursement Projects Group----Safety, Health and Compliance Group--Office of Acquisition and Agreements Management---Office of Acquisition and Agreements Management----Administrative Support and Document Control Group----Office of Acquisition and Agreements Management - HQ----Policy and Compliance Group----Reimbursable Agreements Coordination Office---Grants Management Division----Grants Management - HQ---Acquisition Management Division----Acquisition Management - HQ----Acquisition Operations----Acquisition Operations----Acquisition Policy and Reimbursable Agreements--Office of Information Systems Management---Applications Systems Division----Applications Systems - HQ---Research Services Office----Research Services Office - HQ---Business Systems Division----Business Systems Division - HQ---Information Technology Security & Networking Division----Information Technology Security & Networking - HQ---Identity, Credential, and Access Management Division----Identity, Credential, and Access Management - HQ---Customer Access and Support Division----Customer Access and Support - HQ---Infrastructure Services Division----Infrastructure Services Division - HQ---Office of Information Systems Management----Office of Information Systems Management - HQ---Innovation and Solutions Division----Innovation and Solutions Division - HQ---Platform Services Division----Platform Services Division - HQ--Office of Human Resources Management---Operations and Strategic Programs Division----Operations and Strategic Program - HQ---Human Resources Management Office----Human Resources Management Office - HQ---Compensation, Recognition, and Effectiveness Division----Compensation, Recognition, and Effectiveness - HQ--Office of Safety, Health and Environment---Office of Safety, Health and Environment----Office of Safety, Health and Environment - HQ---Gaithersburg Safety, Health and Environment Division----Safety and Health Group----Gaithersburg Safety, Health and Environment - HQ----Fire and Facilities Safety Group----Environmental Management Group---Radiation Safety Division----Radiation Facilities Group----Program Development and Compliance Group----Radiation Safety - 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HQ---Quantum Physics Division----Quantum Physics - HQ---Radiation Physics Division----Dosimetry Group----Radioactivity Group----Radiation Physics - HQ----Neutron Physics Group---Sensor Science Division----Ultraviolet Radiation Group----Sensor Science - HQ----Dimensional Metrology Group----Thermodynamic Metrology Group----Remote Sensing Group----Optical Radiation Group----Fluid Metrology Group----Surface and Interface Metrology Group---Applied Physics Division----Advanced Microwave Photonics Group----Spin Electronics Group----Applied Physics - HQ----Faint Photonics Group----Quantitative Nanostructure Characterization Group----Quantum Devices Group----Molecular and Bio-Photonics Group----Optoelectronic Manufacturing Group----Magnetic Imaging Group----Quantum Nanophotonics Group----Sources and Detectors Group---Quantum Measurement Division----Quantum Optics Group----Mass and Force Group----Quantum Measurement - HQ----Laser Cooling and Trapping Group----Fundamental Electrical Measurements Group----Applied Electrical Metrology Group----Atomic Spectroscopy Group---Quantum Sensors Division----Device Fabrication Group----Long Wavelength Sensors and Applications Group----Quantum Calorimeters Group----Quantum Electronics Group----Quantum Processing Group----Quantum Sensors Group----Quantum Sensors – HQ----Nanoscale Spin Dynamics Group----Microfabrication Group----Spin Electronics Group----Magnetics Group---Nanoscale Device Characterization Division----Atom Scale Device Group----Nanoscale Device Characterization Division - HQ----Alternative Computing Group----Nanoscale Spectroscopy Group----Advanced Electronics Group----Nanoscale Processes and Measurements Group---Physical Measurement Laboratory Office----Boulder Microfabrication Facility----Physical Measurement Laboratory- HQ----PML Information Office----Center for Nanoscale Science and Technology----Office of Weights and Measures----Boulder Laboratory Director Office-Innovation & Industry Services--Office of Advanced Manufacturing---Microelectronics Manufacturing Division----Microelectronics Manufacturing – HQ----Microelectronics Strategy and Enterprise Group----Semiconductor Coordination Group----Semiconductor Operations Group----Workforce and Equity Development Group---Office of Advanced Manufacturing----Office of Advanced Manufacturing - HQ---Partnerships and Outreach Division----Communications and Marketing Group----Education and Workforce Development Group----Partnership Engagement Group----Partnerships and Outreach – HQ----Technology Hubs Development Group---Policy and Strategy Division----Analysis and Benchmarking Group----Policy and Strategy – HQ----Strategic Planning Group---Program Operations Division----Competitions Group----Institute and Program Management Group----Performance Management Group----Program Operations - HQ--Baldrige Performance Excellence Program---Baldrige Performance Excellence Program Office----Award Process Group----Director's Office, Baldrige Performance Excellence Program----Administrative Support/Electronic Information Group----Outreach and Communications Group----Publications Management Group----Workforce Development Group--Innovation & Industry Services---Associate Director for Innovation & Industry Services----Associate Director for Innovation & Industry Services - HQ---Advanced Manufacturing Office----Advanced Manufacturing Office - HQ---Economic Analysis Office----Economic Analysis Office - HQ---Technology Partnerships Office----Technology Partnerships Office - HQ---Technology Innovation Program Office----Technology Innovation Program Office - HQ--Hollings Manufacturing Extension Partnership Program---National Platforms Division----National Platforms – HQ----Network Knowledge Management Group----Supply Chain Group---National Programs Division----National Programs- HQ---Network Learning and Strategic Competitions Division----Network Learning and Strategic Competitions - HQ---Outreach and External Affairs Division----Outreach and External Affairs – HQ---Performance Evaluation and Economic Impacts Division----Performance Evaluation and Economic Impacts - HQ----Performance Metrics and Evaluation Group---Regional and State Partnerships Division----Regional Management Group----Regional and State Partnerships - HQ---Network Agreements Management Division----Network Agreements Management - HQ----Node B Group----Node A Group---Internal Operations Division----Internal Operations – HQ----Center Operations and Financial Management Group---Extension Services Division----Extension Services - HQ---Hollings Manufacturing Extension Partnership Program Office----Hollings Manufacturing Extension Partnership Program - HQ-Director's Office--Director's Office---Diversity, Equity and Inclusivity Office----Diversity, Equity and Inclusivity Office - HQ---Ombuds Office----Ombuds Office - HQ---Public Affairs Office----Media Liaison Group----Video and Digital Media Production Group----Public Affairs Office - HQ----Internal Communications and Inquiries Group----Conference Program and Audiovisual Services Group----Boulder Meetings Support and Services Group----Web Content Development Group---Program Coordination Office----Program Coordination Office - HQ---Director's Office----Director's Office - HQ----Onboarding Group---Congressional and Legislative Affairs Office----Congressional and Legislative Affairs Office - HQ---Human Subjects Protection Office----Human Subjects Protection Office - HQ---Management and Organization Office----Management and Organization Office- HQ---International and Academic Affairs Office----International and Academic Affairs Office - HQ
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          Displaying 1 - 3 of 3
              Long Phan Receives American Concrete Institute (ACI) Concrete Research Council Arthur J. Boase AwardThis honor was bestowed specifically “in recognition of your research on the response of high strength/high performance concrete structures
  Dale Bentz Elected American Concrete Institute (ACI) FellowshipFor his outstanding contributions to the use of concrete materials, products, and structures in the areas of education, research
  Paul Stutzman Receives the Bryant Mather Award from ASTM Committee C01Paul was recognized for his contributions to the development of various committee standards related to quantitative analysis of Portland
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