# Patent

## Title
Charged particle beam lithography system and target positioning device

## Abstract

The invention relates to a charged particle beam lithography system comprising:

    
    
        a charged particle optical column arranged in a vacuum chamber for projecting a charged particle beam onto a target, wherein the column comprises deflecting means for deflecting the charged particle beam in a deflection direction,
        a target positioning device comprising a carrier for carrying the target, and a stage for carrying and moving the carrier along a first direction, wherein the first direction is different from the deflection direction, wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column,
        wherein the carrier is displaceably arranged on the stage and wherein the target positioning device comprises retaining means for retaining the carrier with respect to the stage in a first relative position.

## Background
The present patent application is a non-provisional application claiming the priority of provisional application No. 61/089,744, filed Aug. 18, 2008.


BACKGROUND
The present invention relates to a charged particle beam exposure system, such as a lithography system for maskless image projection, scanning and non-scanning electron microscopes, and the like.
Charged particle beam lithography systems, such as electron beam maskless lithography systems, are generally known and, relative to conventional mask based lithography systems, have the advantage of fabrication on demand as it were, due to an absence of the necessity to change and install masks or reticles. In stead, the image to be projected for the manufacture of integrated circuits is stored in a memory of a computer that controls the maskless exposure system.
The known charged particle beam exposure systems commonly comprise a charged particle column placed in a vacuum chamber. The charged particle column comprises a charged particle source including a charged particle extraction means and electrostatic lens structures for the purpose of focussing and deflecting one or a multiplicity of charged particle beams on and over a target, such as a wafer. Furthermore the charged particle column comprises modulation means for modulating the one or multiplicity of charged particle beams, depending whether the image to be projected requires an exposure at a certain location or not.
During such projection the target is guided relative to the projection area of said charged particle column, by means of a stage that supports the target. For this new type of maskless lithography, appropriate stages have hardly been designed, at least are not commercially available. Known stages, for as far as they can be adapted to maskless lithography, are mostly inappropriate at least in the sense of e.g. size, costs and vacuum compatibility.
Also electromagnetic dispersion fields as commonly present at actuators, in particularly electro-magnetic actuators, are normally not desired in such systems, because any variation in electric of magnetic fields may affect the position of charged particle beams. It is known that fluctuations in electromagnetic fields due to an electromagnetic actuator can be reduced by arranging the electromagnetic actuator at a position remote from a target-bearing surface and providing a multiple shield in the electromagnetic actuator.
It is an object of the present invention to provide a charged particle beam lithography system comprising and an operating method using a target positioning device optimized for charged particle beam exposure of a target.
SUMMARY OF THE INVENTION
According to a first aspect, the present invention provides a charged particle beam lithography system comprising:
a charged particle optical column arranged in a vacuum chamber for projecting a charged particle beam onto a target, wherein the column comprises deflecting means for deflecting the charged particle beam in a deflection direction,
a target positioning device comprising a carrier for carrying the target, and a stage for carrying and moving the carrier along a first direction, wherein the first direction is different from the deflection direction, and wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column,
wherein the carrier is displaceable arranged on the stage and wherein the target positioning device comprises retaining means for retaining the carrier with respect to the stage.
During the exposure of a target in the lithography system according to the invention, the target is moved relative to the one or more charged particle beams in the first direction by activating the first actuator, and simultaneously the defecting means in the optical column are activated for deflecting the one or more charged particle beams in the deflection direction. With such an exposure, an elongated area of the target can be exposed for projecting the image to be projected at this area. The length of this elongated area is determined by the travel range of the stage, and the width of the elongated area is determined by the extent of deflection. During the illumination of this elongated area, the target on top of the carrier is maintained essentially on the same position. After the elongated area has been illuminated, the carrier with the target on top, can be displaced such that a new area can be exposed to the charged particle beams. In order to maintain the position of the carrier relative to the stage, at least along the deflection direction, at least during a projection, the target positioning device of the invention comprises retaining means for retaining the carrier with respect to the stage. The retaining means can stably retain the stage, in particular during the driving of the stage in the first direction.
Preferably the retaining means is arranged such that when the stage is retained, there is no or at least a minimum of leakage magnetic and/or electric fields, and/or fluctuations of such fields. In this case, there is no disturbance and/or interference of the trajectory and thus of the positions of the charged particle beams.
In an embodiment the carrier is displaceable along a second direction, wherein said second direction is different from said first direction, preferably wherein said second direction is substantially the same as the deflection direction. In a further embodiment, said second direction is substantially perpendicular to the first direction, thus providing an orthogonal target positioning.
In an embodiment the stage is a first stage, and wherein the target positioning device comprises a second stage in between the carrier and the first stage, wherein the second stage is arranged for moving the carrier in the second direction, and wherein the retaining means are arranged for holding or blocking a movement of the second stage.
In a first embodiment, the retaining means comprises a piezoelectric motor for moving the carrier in the second direction. Piezoelectric motors, in particular resonant piezoelectric motors, can provide both a driving action for moving the carrier in the second direction, and a retaining action for holding the position of the carrier relative to the stage, at least during a projection. The piezoelectric motor is preferably arranged as actuator of the second stage. Using such a piezoelectric motor in the lithography system according to the invention, this motor does not require to be shielded from the charged particle optical column, at least during a retaining action. Such a piezoelectric motor can be arranged close to the carrier and the target on top, which may enhance the accuracy of the positioning of the carrier with respect to the stage. Furthermore, such the piezoelectric motor may be arranged inside a shielding means for at least partially shielding the charged particle optical column from ambient magnetic and/or electric fields.
In an embodiment, the carrier is interposed and/or restrained between two opposing piezoelectric motors. In this case any force or momentum exerted by one of the piezoelectric motors on the carrier may at least partially be compensated by a force or momentum exerted by the other of the two opposing piezoelectric motors. This provides a highly accurate and stable retaining of the carrier during the exposure of a target, and/or a highly accurate and stable moving of the carrier along the deflection direction, for example between subsequent exposures.
In a second embodiment, the retaining means comprises extendable and retractable clamping means which can be placed in an extended position for clamping and thus retaining the carrier with respect to the stage, and in a retracted position for releasing the carrier with respect to the stage and allowing a displacement of the carrier with respect to the stage. These clamping means may provide a mechanical interlocking between the carrier and the stage.
In an embodiment, the retaining means comprises releasable locking means for locking the position of the carrier with respect to the stage, and for allowing a displacement of the carrier with respect to the stage when the locking means are released. These locking means may provide a mechanical interlocking between the carrier and the stage.
In an embodiment the clamping or locking means comprises piezoelectric elements. Such piezoelectric elements can be driven by electrical signals and are highly suitable for use in the ultra clean and vacuum environment as usually required for lithography systems.
In an embodiment the target positioning device comprises a second actuator, preferably separate from the clamping or locking means, for moving the carrier in the second direction. In this embodiment, there is no holding momentum required from this second actuator, when the position of the carrier is retained with respect to the stage by the retaining means. When the carrier is retained, the second actuator can be shut down in order to further decrease any magnetic and/or electric fields, at least during an image projection.
In an embodiment, the second actuator is arranged for reducing and/or minimizing of leakage magnetic and/or electric fields outside the second actuator, such as electromagnetic dispersion fields, at least when the second actuator is switched off.
In order to reduce the leakage of magnetic and/or electric fields, said second actuator may be provided with shielding means for at least partially shielding against leakage of magnetic and/or electric fields outside the second actuator.
Alternatively or additionally, in an embodiment the second actuator comprises an induction motor. In an embodiment the induction motor comprises a chore of non-ferromagnetic material. In an embodiment the non-ferromagnetic material comprises aluminum. Such actuators are essentially free from any magnetic material and therefore do not exhibit leakage magnetic and/or electric fields outside the actuator, at least when shut down. Using such a second actuator in the lithography system according to the invention, this second actuator does not require to be shielded from the charged particle optical column. Such a second actuator can be arranged close to the carrier and the target on top, which may enhance the accuracy of the positioning of the carrier with respect to the stage. Furthermore, such a second actuator may be arranged inside a shielding means for at least partially shielding the charged particle optical column from ambient magnetic and/or electric fields.
In contrast, the first actuator, which is driven during the projection of a charged particle beam onto the target, is preferably arranged outside an optical column shielding means which may be provided for at least partially shielding the charged particle optical column from ambient magnetic and/or electric fields. Alternatively, or in addition, the first actuator may be arranged at a distance remote from the stage. In an embodiment the target positioning device is arranged in a vacuum chamber, wherein the first actuator is placed outside the first vacuum chamber. In an embodiment the optical shielding means is arranged as a lining of said first vacuum chamber or is integrated into the wall of said first vacuum chamber.
In an embodiment the target positioning device comprises coupling means for releasably coupling the carrier to the second actuator. Due to these coupling means, the carrier can be uncoupled from the second actuator, for example when the second actuator is in the retained position with respect to the stage. In this case any momentum from the second actuator is not transferred to the carrier. More important is that in this embodiment, a second actuator can be used which is arranged for providing a short and preferably accurate stroke for moving the carrier with respect to the stage. Essentially the combination of the above-mentioned retaining means and the coupling means provide the possibility for using a short stroke second actuator. In order to displace the carrier with respect to the stage, a method can be used which comprises the steps of:
a. activating the coupling means and preferably deactivating the retaining means;
b. activating the second actuator for moving the carrier in the second direction;
c. deactivating the second actuator and preferably activating the retaining means;
d. deactivating the coupling means; and
e. activating the second actuator for returning the second actuator, in particular a drive member thereof, backwards in the second direction. In order to establish a further step in the second direction, the coupling means are again activated and the retaining means are deactivated, and the further above-mentioned steps are repeated.
In an embodiment the coupling means comprises piezo-electric elements. In an embodiment said piezo-electric elements are arranged for coupling the carrier to the second actuator in an extended position of said piezo-electric elements, and for uncoupling the carrier to the actuator in a retracted position of said piezo-electric elements. In an embodiment said piezo-electric elements are arranged such that the carrier rests on top of said second actuator, at least when the carrier is coupled to the second actuator.
According to a second aspect, the invention provides a target positioning device for a charged particle beam lithography system as described above.
According to a third aspect, the invention provides a method of projecting an image onto an area of a target in a charged particle beam lithography system as described above, in particular wherein the method comprising the steps of:
i. activating the retaining means;
ii. projecting at least a part of the image onto at least part of the area using a combination of the following steps of: activating the first actuator from moving the target in the first direction, activating the charged particle optical column for projecting the charged particle beam onto the target, and activating the deflecting means for deflecting the charged particle beam in a deflection direction;
iii. moving the charged particle optical beam outside the area and/or deactivating the charged particle optical column; and
iv. deactivating the retaining means for moving the carrier in the second direction.
According to a fourth aspect, the invention relates to a method of projecting an image onto an area of a target in the charged particle beam lithography system as described above, in particular wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column, and wherein the target positioning device comprises a piezoelectric motor for moving the carrier in the second direction, wherein the method comprises the steps of:
i. controlling the piezoelectric motor for retaining the position of the carrier against movement in the second direction;
ii. projecting at least a part of the image onto at least part of the area using a combination of the following steps of: activating the first actuator for moving the target in the first direction, activating the charged particle optical column for projecting the charged particle beam onto the target, and activating the deflecting means for deflecting the charged particle beam in a deflection direction;
iii. moving the charged particle optical beam outside the area and/or deactivating the charged particle optical column; and
iv. controlling the piezoelectric motor for moving the carrier in the second direction.
According to a fifth aspect, the invention relates to a method of projecting an image onto an area of a target in the charged particle beam lithography system as described above, in particular wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column, and wherein the target positioning device comprises a second actuator for moving the carrier in the second direction, wherein the method comprises the steps of:
i. deactivating the second actuator and activating the retaining means for retaining the position of the carrier against movement in the second direction;
ii. projecting at least a part of the image onto at least part of the area using a combination of the following steps of: activating the first actuator for moving the target in the first direction, activating the charged particle optical column for projecting the charged particle beam onto the target, and activating the deflecting means for deflecting the charged particle beam in a deflection direction;
iii. moving the charged particle optical beam outside the area and/or deactivating the charged particle optical column; and
iv. deactivating the retaining means and activating the second actuator for moving the carrier in the second direction.
In an embodiment the above-mentioned methods further comprises the step of:
v. moving the carrier in the second direction over a distance equal or smaller then the extent of the deflection of the charged particle beam by the deflecting means, in the second direction.
In an embodiment, the steps i, ii, iii, iv and v of the above-mentioned methods are repeated, preferably successively repeated.
In an embodiment of the above-mentioned methods, the charged particle optical column is deactivated by preventing the charged particle beam to reach the target. In an embodiment of the above-mentioned method, each said particle optical column is deactivated by switching off a charged particle source of the column or by switching a cathode of the charged particle source to a higher positive potential and an anode of the charged particle source, wherein said charged particle source preferably is an electron source.
The various aspects and features described and shown in the specification can be applied, individually, wherever possible. These individual aspects, in particular the aspects and features described in the attached dependent claims, can be made subject of divisional patent applications.



BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be elucidated on the basis of an exemplary embodiment shown in the attached drawings, in which:
FIG. 1 is a schematic illustration of a charged particle lithography system;
FIG. 2 is a schematic plan view of a first exemplary embodiment of a XY stage of a target positioning device according to the invention;
FIG. 3 is a schematic view in cross-section along the line I-I in FIG. 2;
FIGS. 4A and 4B schematically show a displacement of the XY stage in the first or X direction;
FIGS. 5A-5E schematically show a displacement of the XY stage in the second or Y direction;
FIG. 6 schematically shows a cross-section of the XY stage during a displacement in the X-direction;
FIG. 7 schematically shows a cross-section of the XY stage during a displacement in the Y-direction;
FIG. 8 schematically shows a second exemplary embodiment of a XY stage of a target positioning device according to the invention;
FIG. 9 schematically shows an exploded view of the XY stage of FIG. 8;
FIGS. 10A and 10B show a schematic plan view of the Y stage of FIG. 8; and
FIG. 11 schematically shows a cross-section along the line A-A in FIG. 10A.



DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 schematically shows a system 1 for charged particle beam lithography, using a massive array of parallel charged particle beams, so called cp-beams. In the present example the charged particle beams are electron beams. One of such cp-beams 2 is represented in FIG. 1.
All cp-beams are controlled separately by means of a modulator in a known manner, enabling a writing of a desired pattern on a target 3, in this case a wafer. The main advantages of this system compared to the commonly used optical systems are the writing of very small structures and the absence of expensive masks. The latter significantly reduces the start-up costs of a batch, making the present system highly advantageous for prototyping and medium volume production.
The system according to the invention consists of three major subsystems, namely a data path subsystem (not shown in FIG. 1), a charged particle optical column 4, for example an electron-optical column, and a target positioning device 5.
The charged particle optical column 4 creates a massive array of predominantly parallel, focused cp-beams 2, emerging from the bottom of the column 4. Each cp-beam is controlled by said data path. In a manner known per se, the cp-beams are switched “on” and “off” and the positions of the cp-beams are adjusted within a small range in accordance with the data. In a final part of the charged particle optical column, in fact at a projection lens 41, the cp-beams 2 are deflected back and forth, substantially transversely to a first direction X of movement of the target or wafer module 51, so as to enable writing of features, alternatively denoted structures, on the target 3.
Due to the nature of cp-beams 2, their trajectory can be changed by magnetic and/of electric fields. In the charged particle optical column 4 this is used to control the cp-beams 2 and to project the cp-beams 2 onto the target 3. In order to shield the charged particle optical column 4 from ambient magnetic and/or electric fields, which might disturb the trajectories of the cp-beams 2 and thus induces a deviation from the desired location of the cp-beams 2 on the target 3, at least the charged particle optical column 4 is provided with a shielding 6 comprising one or more layers of a u-metal. In the example as shown in FIG. 1, also the target positioning device 5 is placed inside the shielding 6. The shielding 6 is in a convenient manner arranged as a lining of the vacuum-chamber for the charged particle optical column 4 and the vacuum-chamber of the target positioning device 5. Such shielding is arranged to attenuate the earth magnetic field by a considerable extent. In the arrangement at stake, attenuation by a factor of approximately 1000 is realized.
The target positioning device 5 places a target 3 in the focal plane of the charged particle optical column 4 and moves it underneath. The target positioning device 5 comprises a target module 51 for holding a target and a stage assembly for moving the target in the first X-direction by means of a stage, further referred herein as x-stage 52, and in a second Y-direction by means of a carrier, further referred herein as y-stage 54. In this exemplary embodiment the X-direction is substantially perpendicular to the Y-direction, and the X and Y-directions form a plane which is substantially perpendicular to the charged particle optical column 4.
As discussed above, during the writing of a pattern, the cp-beams 2 are deflected back and forth transversely to the X-direction and the target 3 is moved underneath along the X-direction by moving the x-stage 52 using the first actuator 53. Such a scan results in a writing path with a width which is determined by the extent of deflection of the cp-beams 2 in the deflection direction, and with a length which is determined by the length of travel of the x-stage 52. In particular the length of the writing path can extend over the whole target 3 area.
During the writing of each writing path, essentially only the first actuator needs to be driven. In order to shield the charged particle optical column 4 during the writing of a pattern from magnetic and/or electric fields from the first actuator 53, the first actuator 53 is arranged outside the shielding 6. Thus, the shielding means 6 for the optical column 4 can also be used for shielding the charged particle optical column 4 from magnetic and/or electric fields from the first actuator 53.
In the exemplary embodiment as shown in FIG. 1, the first actuator 53 is arranged inside the vacuum chamber 50 of the target positioning device 5. Alternatively, the first actuator 53 may be arranged outside the vacuum chamber 50 of the target positioning device 5.
Furthermore, both the first actuator 53 and the stage 52 are rigidly connected with respect to each other. In the example shown in FIG. 1, both the first actuator 53 and the stage 52 are rigidly connected to the a base plate 503. This rigid connection ensures that a proper alignment of the actuator or motor 53 with respect to the stage 52 is maintained. In an embodiment, the base plate 503 is arranged to provide a highly stiff construction, preferably with a low coefficient of thermal expansion. In an embodiment the base plate 503 comprises a granite slab or a granite table top.
During the writing of a writing path, thus when the cp-beams 2 are projected onto the target 3, essentially only the first actuator 53 is driven (except maybe for performing small corrections in a Z-direction, which is substantially perpendicular to the XY-plane). During any other movements, other than during writing, magnetic and/or electric fields and fluctuations therein are allowable. Thus the actuators for moving the target positioning device 5 in the Y- and/or Z-direction are placed inside the shielding 6 for the optical column 4.
When moving the target 3 along the Y-direction, for example for moving the target 3 towards a next writing path after a previous writing path has been written, the cp-beams 2 can be prevented to reach the target 3, for example by switching off the beams 2, and/or the target 3 can be moved to a location where the cp-beams 2 are outside the area on the target 3 which is to be illuminated by the cp-beams 2. During this movement in the Y-direction, magnetic and/or electric fields and fluctuations therein are allowable.
For example, the target positioning device 5 can be moved in X-direction, such that the cp-beams 2 fall onto a beam sensor 7, as shown in FIG. 1, which is placed on the x-stage 52 adjacent to the target table 51. During the movement in the Y-direction, the beam sensor 7 may be used for measuring characteristic properties of the cp-beams 2 prior to writing a next writing path.
An exemplary embodiment of the target positioning device 5 is shown in more detail in FIGS. 2 and 3. In this embodiment, the target positioning device 5 comprises a support frame 55 with two linear bearings 56 which extend in the X-direction. The level of the centre of gravity 57 of the target positioning device 5 lies in a plane through the bearings 56.
The bearings 56 support the x-stage 52 and allow for a smooth movement of the x-stage 52 along the X-direction. For driving the x-stage 52, two first or x-actuators 53 are provided. These x-actuators 53 are placed outside the shielding 6. Each of the x-actuators 53 comprises a push-pull rod 58 which extends through the shielding 6 and connects to the x-stage 52. As shown in FIG. 3, the point of application where the x-actuator 53 via the push-pull rod 58 applies force to the x-stage 52 is positioned at the level of the centre of gravity 57 of the target positioning device 5.
On top of the x-stage 52, the y-stage 54 is placed. The y-stage 54 comprises a short stroke actuator 59 which will be described in more detail below.
On top of the y-stage 54, a target module 51 is placed. This target module 51 may be provided with a short stroke stage with six degrees of freedom, on top of which a target table is placed for holding a target.
As shown in FIGS. 4A en 4B, the target module 51 can be moved along the X-direction by extending or retracting the push-pull rods 58 by the first actuators 53.
FIGS. 5A-5E schematically show the functioning of the short stroke actuator 59 of the y-stage 54. FIGS. 6 and 7 schematically show a cross-section of the y-stage along the line II-II of FIGS. 5A-5E. Activated piezoelectric elements are presented with a shaded or hatched area in these figures.
When the x-stage 52 is driven for performing a writing of a pattern, the position of the target module 51 on the y-stage 54 is fixed and retained. In order to retain the position of target module 51 on the y-stage 54 with respect to the x-stage 52 in the Y-direction, the y-stage 54 is provided with first piezo-electric elements 541 which can be placed in a retaining position as shown in FIGS. 6 and 5A, in which the piezo-electric elements 541 clamp the y-stage 54 between sidewalls 521 of the x-stage 52. In order to provide the correct position in the Z-direction, the y-stage 54 is provided with second piezo-electric elements 542 which can be placed in a supporting position as shown in FIGS. 6 and 5A, in which the piezo-electric elements 542 rest on the x-stage 52.
For moving the y-stage 54 in the Y-direction, the first piezo-electric elements 541 are placed in a release position as shown in FIGS. 7 and SB, in which the piezo-electric elements 541 are retracted and do not provide a clamping force on the sidewalls 521 of the x-stage 52. Furthermore, the y-stage 54 is provided with third piezo-electric elements 543 which can be placed in a supporting position as shown in FIGS. 7 and SB, in which the piezo-electric elements 543 and thus the y-stage 54 rests on the short stroke actuator 59, and the y-stage 54 is coupled to the actuator 59 by the coupling means 543. Note that in the retained or locked position as shown in FIGS. 6 and 5A, the third piezo-electric elements 543 are retracted and the y-stage 54 is not supported by the short stroke actuator 59.
When the y-stage 54 rests on the short stroke actuator 59, as shown in FIG. 5B, the actuator 59 can make a short stroke in the Y-direction, as shown in FIG. 5C. During this stroke, the actuator 59 thus moves the target module 51 on the y-stage 54 in the Y-direction.
After moving the y-stage 54 in the Y-direction over a desired distance Y+, the second piezo-electric elements 542 are extended, the third piezo-electric elements 543 are retracted and the y-stage 54 is now supported by the x-stage 54 by the second piezo-electric elements 542 and is free from the short stroke actuator 59. Subsequently the first piezo-electric elements 541 are placed in a retaining position, in which the piezo-electric elements 541 clamp the y-stage 54 between sidewalls 521 of the x-stage 52, as shown in FIG. 5D.
Subsequently, the short stroke actuator 59 may return to its original position by moving back over a distance Y-, which results in the same situation for the short stroke actuator 59 is shown in FIG. 5A.
By repeating this procedure, the y-stage 54 can be moved stepwise along the Y-direction. When the short stroke actuator 59 initially is placed on the left-hand side, as shown in FIG. 5A, the y-stage 54 can be stepwise moved to the right. When the short stroke actuator 59 initially is placed on the right-hand side, as shown in FIG. 5D, the y-stage 54 can be stepwise moved to the left.
In a second exemplary embodiment as shown in FIG. 8, the XY-stage comprises two X-stage bases 86, both arranged on top of a common base plate 85. Each X-stage base 86 carries an X-stage carriage 861. The X-stage carriages 861 are provided with flexures 862 (see FIG. 9) for connecting a Y-beam 84 to the X-stage carriages 861. The Y-beam 84 bridges the space between the X-stages and is provided with interface members 842 for connecting to the flexures 862.
The Y-beam comprises a Y-stage having a Y-carriage 844 or carrier for carrying a target module (not shown). In particular, in use the target is arranged on top of a target module, and the target module is arranged on top of the Y-stage via an interface plate 81. The Y-carriage 844 or carrier is provided with interface pins 843, as shown in FIG. 10B, where the interface plate 81 is removed.
In particular the interface pins 843 may provide a kinematic mount in order to accurately position the target module on the carrier or Y-carriage 844. A mount is said to be kinematic when the number of degrees of freedom (axes of free motion) and the number physical constraints applied to the mount total six. The side of the interface plate 81 facing the Y-carriage 844 is therefore provided with a “cone, groove, and flat” mount schematically illustrated in FIG. 10A, wherein the interface pins 843 are retained in the groove and cone respectively by resilient members or springs 811.
As shown in the cross-section of FIG. 11, the Y-beam 84 provides a common base plate for two parallel arranged linear stages 845, 846. The carriages of these stages 845, 846 are pre-stressed and provide for the required stiffness of the construction.
In this embodiment the Y-carriage 844 is on the one hand rigidly connected to the carriage of the first stage 846 via a rigid interface 847, and is on the other hand connected to the carriage of the second stage 845 via 35 a flexure 848 in order to absorb any thermal expansion of the stages 845, 846 and/or the Y-carriage 844.
Furthermore, at least one of the stages 845, 846, in this embodiment the second stage 845 is used, is provided with a ruler 96, which in cooperation with a linear encoder head 95 can provide positional information of the Y-carriage in the second or Y-direction.
In this embodiment both opposite side faces of the Y-beam 84, which extent along the Y-direction, are provided with a piezoelectric motor 91, 91′, which both have extending members 92, 92′ which are driven via piezoelectric elements. The extending member 92, 92′may act on the adjacent ceramic driving plates 93, 93′, which are arranged on opposite side faces of the Y-carriage 844, on the one hand for retaining the position of the Y-carriage 844 with respect to the Y-beam 84, and on the other hand for moving the Y-carriage 844 along the stages 845, 846 of the Y-beam 84. In this exemplary embodiment, the Y-carriage 844 or carrier is interposed and restrained between two opposing piezoelectric motors 91, 91′.
It is to be understood that the above description is included to illustrate the operation of the preferred embodiments and is not meant to limit the scope of the invention. From the above discussion, many variations will be apparent to one skilled in the art that would yet be encompassed by the spirit an scope of the present invention.
For example, in stead of using piezo-electric elements, also other actuator may be used for clamping and thus retaining the carrier to the stage. Such alternative actuators may comprise pneumatic, hydraulic or other types of mechanical actuators.
The target positioning device with the retaining means according to the invention can thus be suitably be arranged to minimize variation in electric of magnetic fields that may disturb the trajectories of the charged particle beams, and thus to optimize a target positioning device for use in a charged particle exposure system, such as a lithography system for mask less image projection, in particular a multi-beam charged particle exposure system.

## Claims

1. A charged particle beam lithography system (1) comprising:
a charged particle optical column (4) arranged in a vacuum chamber for writing a charged particle beam (2) on a wafer, wherein the column comprises deflecting means (41) for deflecting the charged particle beam (2) in a deflection direction (Y),
a target positioning device (5) comprising a carrier (51, 54; 844) for carrying the wafer (3), which carrier (51, 54; 844) is provided with opposite side faces, said target positioning device further comprising a stage (52; 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier (51, 54; 844) are arranged between and facing said opposing sidewalls (521) of said stage and parallel to said sidewalls, wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the first direction (X) is different from the deflection direction (Y), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
wherein the carrier (51, 54; 844) is displaceably arranged on the stage (52; 84), and is displaceable relative to said stage along a second direction which is different from said first direction and parallel to said sidewalls, and wherein the stage, at the opposing side walls comprises clamping means (541) comprising two opposed piezoelectric elements for releasably clamping said opposite side faces of the carrier (51, 54; 844) therebetween such that the position of the carrier is locked with respect to the stage (52; 84) in a first relative position,
wherein the clamping means (541; 91, 92, 91′, 92′) are arranged for being activated for locking the carrier (51, 54; 844) in said first relative position with respect to the stage (52; 84) before writing the charged particle beam (2) on the wafer (3),
wherein the carrier is at least one of interposed and restrained between said two opposed piezoelectric elements (541; 91, 91 ′).

2. A charged particle beam lithography system (1) comprising:
a charged panicle optical column (4) arranged in a vacuum chamber for writing a charged particle beam (2) on a wafer, wherein the column comprises deflecting means (41) for deflecting the charged particle beam (2) in a deflection direction (Y),
a target positioning device (5) comprising a carrier (51, 54; 844) for carrying the wafer (3), which carrier is provided with opposite side faces, said target positioning device further comprising a stage (52; 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier are arranged between and facing said opposing sidewalls of said stage and parallel to said sidewalls, wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the first direction (X) is different from the deflection direction (Y), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wailer,
wherein the carrier (51, 54; 844) is displaceably arranged on the stage (52; 84), and is displaceable relative to said stage along a second direction which is different from said first direction and parallel to said sidewalls, and wherein the carrier, at said opposite side laces, comprises clamping means (541) comprising two opposed piezoelectric elements for releasably clamping the carrier (51, 54; 844) between said opposing sidewalls of the stage such that the position of the carrier is locked with respect to the stage (52; 84) in a first relative position,
wherein the clamping means (541; 91, 92, 91′, 92′) are arranged for being activated for locking the carrier (51, 54; 844) in said first relative position with respect to the stage (52; 84) before writing the charged particle beam (2) on the wafer (3),
wherein the carrier is at least one of interposed and restrained between said two opposed piezoelectric elements (541; 91, 91′).

3. Charged particle beam lithography system according to claim 1 or claim 2, wherein the clamping means is arranged for at least minimizing leakage magnetic and/or electric fields and/or fluctuations of such fields, at least when the carrier is clamped to the stage.

4. Charged particle beam lithography system according to claim 1 or claim 2, wherein the clamping means comprises extendable and retractable clamping means which can be placed in an extended position for clamping and retaining the carrier with respect to the stage, and in a retracted position for releasing the carrier with respect to the stage and allowing a displacement of the carrier with respect to the stage.

5. Charged particle beam lithography system according to claim 4, wherein the clamping means comprises piezoelectric elements.

6. Charged particle beam lithography system according to claim 1 or claim 2, wherein the clamping means comprises a piezoelectric motor for moving the carrier in the second direction (Y).

7. Charged particle beam lithography system according to claim 6, wherein the carrier is interposed and/or restrained between two opposed piezoelectric motors adapted for moving the carrier relative to the stage in the second direction (Y).

8. Charged particle beam lithography system according to claim 1 or claim 2, wherein the target positioning device comprises a second actuator (59; 91,91′) for moving the carrier in the second direction (Y), wherein said second actuator is a short-stroke actuator.

9. Charged particle beam lithography system according to claim 8, wherein the second actuator is arranged for minimizing of leakage magnetic and/or electric fields outside the second actuator, such as electromagnetic dispersion fields, at least when the second actuator is switched off.

10. Charged particle beam lithography system according to claim 8, wherein the second actuator comprises an induction motor.

11. Charged particle beam lithography system according to claim 10, wherein the induction motor comprises a core of a non-ferromagnetic material.

12. Charged particle beam lithography system according to claim 8, wherein the target positioning device comprises coupling means (543) for releasably coupling the carrier to the second actuator.

13. Charged particle beam lithography system according to claim 12, wherein the coupling means is arranged for at least minimizing leakage magnetic and/or electric fields and/or fluctuations of such fields, at least when the carrier is not coupled to the second actuator.

14. Charged particle beam lithography system according to claim 12, wherein the coupling means comprises piezo-electric elements.

15. Charged particle beam lithography system according to claim 1 or claim 2, wherein the optical column shielding means (6) is arranged as a lining of the vacuum chamber.

16. Charged particle beam lithography system according to claim 1 or claim 2, wherein the first actuator is arranged outside the vacuum chamber.

17. A target positioning device for a charged particle beam lithography system according to claim 1 or claim 2.

18. Method of projecting an image onto an area of a wafer in a charged particle beam lithography system according to claim 1 or claim 2, comprising the steps of:
i, activating the clamping means for locking the position of the carrier with respect to the stage in the second direction;
ii. writing at least a part of the image onto at least part of the area using a combination of the following steps of:
activating the first actuator for moving the wafer in the first direction, wherein said first actuator is adapted for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
activating the charged particle optical column for writing the charged particle beam onto the wafer, and
activating the deflecting means for deflecting the charged particle beam in a deflection direction;
iii. moving the charged particle optical beam outside the area and/or deactivating the charged particle optical column; and
iv. deactivating the clamping means for uncoupling the carrier from the stage, and subsequently moving the carrier relative to said stage in the second direction which is different from said first direction.

19. Method of writing an image onto an area of a wafer in a charged particle beam lithography system according to claim 6, comprising the steps of:
i. controlling the piezoelectric motor for retaining the position of the stage against movement in the second direction;
ii, writing at least a part of the image onto at least part of the area using a combination of the following steps of:
activating the first actuator for moving the wafer in the first direction, wherein said first actuator is adapted for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
activating the charged particle optical column for writing the charged particle beam onto the wafer, and
activating the deflecting means for deflecting the charged particle beam in a deflection direction;
iii. moving the charged particle optical beam outside the area and/or deactivating the charged particle optical column; and
iv. controlling the piezoelectric motor for moving the carrier in the second direction which is different from said first direction.

20. Method of writing an image onto an area of a wafer in a charged particle beam lithography system according to claim 8, comprising the steps of:
i. deactivating the second actuator and activating the clamping means for retaining the position of the stage against movement in the second direction;
ii. writing at least a part of the image onto at least part of the area using a combination of the following steps of:
activating the first actuator for moving the wafer in the first direction which is different from said second direction, wherein said first actuator is adapted for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
activating the charged particle optical column for writing the charged particle beam onto the wafer, and
activating the deflecting means for deflecting the charged particle beam in a deflection direction;
iii. moving the charged particle optical beam outside the area and/or deactivating the charged particle optical column; and
iv. deactivating the clamping means for uncoupling the carrier from the stage and subsequently activating the second actuator for moving the carrier in the second direction.

21. Method according to claim 20 in a charged particle beam lithography system wherein the target positioning device comprises coupling means (543) for releasably coupling the carrier to the second actuator further comprising the steps of:
a. activating the coupling means;
b. activating the second actuator for moving the carrier in the second direction;
c. deactivating the second actuator;
d. deactivating the coupling means; and
e. activating the second actuator for returning the actuator, in particular a drive member thereof, backwards in the second direction.

22. The method according to claim 20, further comprising the step of:
v, moving the carrier in the second direction over a distance equal or smaller than the extent of the deflection of the charged particle beam by the deflecting means in the second direction.

23. The method according to claim 22, wherein the steps i, ii, iii, iv and v are repeated.

24. The method according to claim 18, wherein in step iii the charged particle optical column is deactivated by preventing the charged particle beam to reach the wafer.

25. The method according to claim 24, wherein the charged particle optical column is deactivated by switching off a charged particle source of the column or by switching a cathode of the charged particle source to a higher positive potential than an anode of the charged particle source.

26. Charged particle beam lithography system according to claim 1 or claim 2, wherein said clamping means are adapted to be uncoupled from said stage during relative movement of the carrier with respect to the stage.

27. Charged particle beam lithography system according to claim 1 or claim 2, wherein the clamping means are adapted for stably retaining the carrier in said first relative position to the stage when the stage is driven in the first direction during writing of said charged particle beam on the target.

28. Charged particle beam lithography system according to claim 1 or claim 2, adapted for scanning the charged particle beam during said writing, wherein said scanning comprises moving said wafer relative to the charged particle beam in the first direction by activating the first actuator during said writing.

29. Charged particle beam lithography system according to claim 28, wherein said scanning further comprises activating the deflecting means in the optical column for deflecting the one charged particle beam in the deflection direction while said wafer is moved relative to the charged particle beam in the first direction.

30. Charged particle beam lithography system according to claim 1 or claim 2, wherein said charged particle beam lithography system is a maskless charged particle beam lithography system adapted for writing said charged particle beam on said wafer during movement of said wafer relative to said optical column.

31. Charged particle beam lithography system according to claim 1 or claim 2, wherein said clamping means (541; 91, 92, 91′, 92′), when in a released state, do not couple the stage to the carrier.

32. Charged particle beam lithography system according to claim 1 or claim 2, wherein said second direction is substantially the same as the deflection direction.

33. A charged particle beam lithography system (1) comprising:
a charged particle optical column (4)
a target positioning device (5) comprising a carrier (51,54; 844) for carrying a wafer (3), which carrier (51,54; 844) is provided with opposite side faces, said target positioning device further comprising a stage (52; 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier (51,54; 844) are arranged between and facing said opposing sidewalls (521) of said stage (52; 84), wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
wherein the carrier (51, 54; 844) is displaceably arranged on the stage (52; 84), and is displaceable relative to said stage along a second direction which is different from said first direction and wherein the stage, at the opposing side walls comprises clamping means (541) for releasably clamping said opposite side faces of the carrier (51, 54; 844) therebetween such that the position of the carrier is locked with respect to the stage (52; 84) in a first position,
wherein the clamping means (541; 91,92,91′,92′) are arranged for being activated for locking the carrier (51, 54; 844) in said first position with respect to the stage (52; 84) before writing the charged particle beam (2) on the wafer (3),
wherein the carrier is at least one of interposed and restrained between said clamping means (541; 91,91′).

34. A charged particle beam lithography system (1) comprising:
a charged particle optical column (4)
a target positioning device (5) comprising a carrier (51,54; 844) for carrying a wafer (3), which carrier is provided with opposite side faces, said target positioning device further comprising a stage (52: 84) comprising opposing sidewalls (521), wherein said opposite side faces of said carrier are arranged between and facing said opposing sidewalls of said stage, wherein said stage is adapted for carrying and moving the carrier supported by a linear bearing along a first direction (X), wherein the target positioning device (5) comprises a first actuator (53) for moving the stage (52; 84) in the first direction (X) relative to the charged particle optical column (4) over a length that extends over the whole length of the wafer,
wherein the carrier (51, 54; 844) is displaceably arranged on the stage (52; 84), and is displaceable relative to said stage along a second direction which is different from said first direction, and wherein the carrier, at said opposite side faces, comprises clamping means (541) for releasably clamping the carrier (51, 54; 844) between said opposing sidewalls of the stage such that the position of the carrier is locked with respect to the stage (52; 84) in a first position,
wherein the clamping means (541; 91,92,91′,92′) are arranged for being activated for locking the carrier (51, 54; 844) in said first position with respect to the stage (52; 84) before writing the charged particle beam (2) on the wafer (3),
wherein the carrier is at least one of interposed and restrained between said clamping means (541; 91,91′).