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https://www.nist.gov/laboratories/tools-instruments/nanofab-tool-oxford-plasmapro-100-inductively-coupled-plasma-icp-0

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TOOLS & INSTRUMENTS

# NanoFab Tool: Oxford PlasmaPro 100 Inductively Coupled Plasma (ICP) Dielectric Etcher

Photograph of the Oxford PlasmaPro 100 Inductively Coupled Plasma (ICP) Dielectric Etcher.

The Oxford PlasmaPro100 ICP dielectric etcher is a system that allows anisotropic etching of silicon oxide and silicon nitride. The tool is equipped with multiple etch gases and a temperature-controlled electrode. The manual wafer load system can accommodate substrates ranging from 200 mm diameter wafers down to small pieces.

## Specifications/Capabilities

                    - The Cobra ICP etch sources produce a high density of reactive species at low pressure.
                    - Full area process gas inlet showerhead for uniform gas distribution.
                    - Electrode temperature range: -150 °C to +400 °C.
                    - Wafer clamping with Helium backside cooling.
                    - Process Gases: Ar, He, N 2 , O 2 , H 2 , CHF 3 , CF 4 , C 4 F 8 , C 2 F 6  and SF 6
                    - Controlled profile etching.
                    - Wafer diameters: 75 mm, 100 mm (default), 150 mm, and 200 mm.
                    - Small pieces supported: Yes.

## Typical Applications

                    - SiO 2  and Si 3 N 4  based device fabrication.

## Back to the NanoFab Equipment List

Nanofabrication / manufacturing

## Organizations

                          - NIST Headquarters
                            - Laboratory Programs
                              - Physical Measurement Laboratory
                                - Physical Measurement Laboratory Office
                                  - Center for Nanoscale Science and Technology

## Details

## Hours of Operation

Cleanroom hours

## Tool Reservation Rules

Minimum Reservation Time: 30 minutes.Maximum Reservation Time: 4 hours.Adjacent Reservations Permitted: Yes.Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.Restrictions: Photoresist edge bead must be removed.

## Contact

### Primary Engineer

                    -  Lei Chen  lei.chen@nist.gov      (301) 975-2908   

### Backup Engineers

                    -  Robert Ilic  robert.ilic@nist.gov      (301) 975-3712   
                    -  Jessie Zhang  chen.zhang@nist.gov      (301) 975-4565   

### General Contact

                    -      NanoFab Dryetch    nogtech@nist.gov      (301) 975-8672          100 Bureau Drive, Stop 6201   Gaithersburg,  MD 20899-6201   

### HEADQUARTERS

301-975-2000

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