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 TOOLS & INSTRUMENTS

NanoFab Tool:  Tresky T-3000-FC3-HF Flip Chip Bonder
    
  Photograph of the Tresky T-3000-FC3-HF flip chip bonder.
  
      The Tresky T-3000-FC3-HF flip chip bonder can dispense solder pastes and epoxies, place solder preforms, and bond various types of devices onto semiconductor packages, submounts, and whole wafers. The system is equipped with a camera-based vision system to precisely align the parts that will be bonded together.

Specifications/Capabilities
      
                          Eutectic bonding.
	Ultrasonic bonding.
	Thermo-compression bonding.
	Epoxy bonding.
	X and Y motion range: 200 mm.
	Die positioning accuracy: 1 μm.
	Die spindle rotation range: 2p (360 °).
	Side-view camera for direct observation of bonding process.
	Bond force: 50 grams to 400 grams.
	Tool heat up to 400 °C.
	Substrate heat up to 400 °C.
	Inert gas blanket.
              Usage Information
        
Supported Sample Sizes
                                Maximum wafer diameter: 150 mm (6 in).
	Small pieces supported: Yes.
	Maximum thickness: 40 mm.
              Typical Applications
      
                          Chip attachment to semiconductor, opto-electronic, microwave, and other packages.Back to the NanoFab Equipment List
  Nanotechnology and Nanofabrication / manufacturing
  
            Organizations
      
      NIST HeadquartersLaboratory ProgramsPhysical Measurement LaboratoryPhysical Measurement Laboratory OfficeCenter for Nanoscale Science and Technology
              Details
        
NEMO Name
                                Flip Chip Bonder

Location
                                Building 216 Room F108
  Campus
                    Gaithersburg
              Hours of Operation
      
                          24/7 access

Tool Reservation Rules
      
                          Minimum Reservation Time: 1 hour.
	Maximum Reservation Time: 6 hours.
	Adjacent Reservations Permitted: Yes.
	Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
Contact
      
        

Primary Engineer
        Gerard Henein
    
      
  gerard.henein@nist.gov
  (301) 975-5645

  

Backup Engineer
        Joshua Schumacher
    
      
  joshua.schumacher@nist.gov
  (301) 975-8065

  

General Contact
        NanoFab Postprocess
  nanofab_postprocess@nist.gov
  (301) 975-8672
  100 Bureau Drive, Stop 6201 
  Gaithersburg,
  MD 20899-6201

    
    Created June 19, 2014, Updated February 24, 2023
 HEADQUARTERS
            100 Bureau Drive
              Gaithersburg, MD 20899301-975-2000
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