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 Physics
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  - Any -NIST Headquarters-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)--CHIPS Program Office---CHIPS Program Headquarters----CHIPS Program Headquarters - HQ----Opportunity & Inclusion Group---External & Government Affairs Division----External & Government Affairs – HQ---Investments Division----Investments Division – HQ---Operations Office----Operations Office – HQ---Risk Management Division----Risk Management – HQ---Strategy, Technology & Policy Division----Strategy, Technology & Policy – HQ--CHIPS Research & Development Program Office---CHIPS Research & Development Program Headquarters Division----CHIPS Research & Development Program Headquarters – HQ----Integration & Policy Office----Outreach & Partnerships Office---External R&D Partnerships Division----External R&D Partnerships – HQ----National Advanced Packaging Manufacturing Program Group----National Semiconductor Technology Center Group---Industrial Advisory Committee----Industrial Advisory Committee – HQ---Semiconductor Manufacturing Institute Division----Semiconductor Manufacturing Institute – HQ---Semiconductor Metrology & Characterization Office----Semiconductor Metrology & Characterization Office – HQ-Management Resources--Management Resources---Associate Director for Management Resources----Associate Director for Management Resources - 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HQ---Quantum Physics Division----Quantum Physics - HQ---Radiation Physics Division----Dosimetry Group----Radioactivity Group----Radiation Physics - HQ----Neutron Physics Group---Sensor Science Division----Ultraviolet Radiation Group----Sensor Science - HQ----Dimensional Metrology Group----Thermodynamic Metrology Group----Remote Sensing Group----Optical Radiation Group----Fluid Metrology Group----Surface and Interface Metrology Group---Applied Physics Division----Advanced Microwave Photonics Group----Spin Electronics Group----Applied Physics - HQ----Faint Photonics Group----Quantitative Nanostructure Characterization Group----Quantum Devices Group----Molecular and Bio-Photonics Group----Optoelectronic Manufacturing Group----Magnetic Imaging Group----Quantum Nanophotonics Group----Sources and Detectors Group---Quantum Measurement Division----Quantum Optics Group----Mass and Force Group----Quantum Measurement - HQ----Laser Cooling and Trapping Group----Fundamental Electrical Measurements Group----Applied Electrical Metrology Group----Atomic Spectroscopy Group---Quantum Sensors Division----Device Fabrication Group----Long Wavelength Sensors and Applications Group----Quantum Calorimeters Group----Quantum Electronics Group----Quantum Processing Group----Quantum Sensors Group----Quantum Sensors – HQ----Nanoscale Spin Dynamics Group----Microfabrication Group----Spin Electronics Group----Magnetics Group---Nanoscale Device Characterization Division----Atom Scale Device Group----Nanoscale Device Characterization Division - HQ----Alternative Computing Group----Nanoscale Spectroscopy Group----Advanced Electronics Group----Nanoscale Processes and Measurements Group---Physical Measurement Laboratory Office----Boulder Microfabrication Facility----Physical Measurement Laboratory- HQ----PML Information Office----Center for Nanoscale Science and Technology----Office of Weights and Measures----Boulder Laboratory Director Office-Innovation & Industry Services--Office of Advanced Manufacturing---Microelectronics Manufacturing Division----Microelectronics Manufacturing – HQ----Microelectronics Strategy and Enterprise Group----Semiconductor Coordination Group----Semiconductor Operations Group----Workforce and Equity Development Group---Office of Advanced Manufacturing----Office of Advanced Manufacturing - HQ---Partnerships and Outreach Division----Communications and Marketing Group----Education and Workforce Development Group----Partnership Engagement Group----Partnerships and Outreach – HQ----Technology Hubs Development Group---Policy and Strategy Division----Analysis and Benchmarking Group----Policy and Strategy – HQ----Strategic Planning Group---Program Operations Division----Competitions Group----Institute and Program Management Group----Performance Management Group----Program Operations - HQ--Baldrige Performance Excellence Program---Baldrige Performance Excellence Program Office----Award Process Group----Director's Office, Baldrige Performance Excellence Program----Administrative Support/Electronic Information Group----Outreach and Communications Group----Publications Management Group----Workforce Development Group--Innovation & Industry Services---Associate Director for Innovation & Industry Services----Associate Director for Innovation & Industry Services - HQ---Advanced Manufacturing Office----Advanced Manufacturing Office - HQ---Economic Analysis Office----Economic Analysis Office - HQ---Technology Partnerships Office----Technology Partnerships Office - HQ---Technology Innovation Program Office----Technology Innovation Program Office - HQ--Hollings Manufacturing Extension Partnership Program---National Platforms Division----National Platforms – HQ----Network Knowledge Management Group----Supply Chain Group---National Programs Division----National Programs- HQ---Network Learning and Strategic Competitions Division----Network Learning and Strategic Competitions - 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              High Throughput (Combinatorial) Screening Tool for Characterization of Thin Film Thermoelectrics as a Function TemperatureDescription High-throughput (combinatorial) metrologies have evolved as a useful approach to rapidly determine the composition-structure-property relationships
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