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https://www.nist.gov/laboratories/tools-instruments/nanofab-tool-unaxis-shuttleline-inductively-coupled-plasma-icp-etcher

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TOOLS & INSTRUMENTS

# NanoFab Tool:  Unaxis Shuttleline Inductively Coupled Plasma (ICP) Etcher

Photograph of the Unaxis Shuttleline inductively coupled plasma etcher.

The Unaxis Shuttleline inductively coupled plasma (ICP) etcher is a general purpose chlorine reactive ion etcher. The high power ICP source combined with low vacuum operating pressure provides users with smooth anisotropic etch feature depths ranging from several micrometers to a few nanometers. The system can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.

## Specifications/Capabilities

                    - Inductively coupled plasma (ICP) power source: up to 2500 W at 2.4 MHz.
                    - Radio Frequency (RF) power source: up to 300 W at 13.56 MHz.
                    - Unique process gases: chlorine and boron trichloride.
                    - Anisotropic etching of silicon.

## Usage Information

### Supported Sample Sizes

                      - Maximum wafer diameter: 150 mm (6 in).
                      - Wafer diameters: 75 mm (3 in), 100 mm (4 in), and 150 mm (6 in).
                      - Small pieces supported: Yes.

## Back to the NanoFab Equipment List

NanotechnologyNanofabrication / manufacturing

## Organizations

                          - NIST Headquarters
                            - Laboratory Programs
                              - Physical Measurement Laboratory
                                - Physical Measurement Laboratory Office
                                  - Center for Nanoscale Science and Technology

## Details

## Hours of Operation

Cleanroom hours

## Tool Reservation Rules

                    - Minimum Reservation Time: 30 minutes.
                    - Maximum Reservation Time: 4 hours.
                    - Adjacent Reservations Permitted: Yes.
                    - Cancellation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
                    - Restrictions:	                       - Photoresist edge bead must be removed.

## Contact

### Primary Engineer

                    -  Lei Chen  lei.chen@nist.gov      (301) 975-2908   

### Backup Engineer

                    -  Jessie Zhang  chen.zhang@nist.gov      (301) 975-4565   

### General Contact

                    -      NanoFab Dryetch    nogtech@nist.gov      (301) 975-8672          100 Bureau Drive, Stop 6201   Gaithersburg,  MD 20899-6201   

### HEADQUARTERS

301-975-2000

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