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 Nanotechnology
      Nanofabrication / manufacturing


      
      Tools and Instruments
  
  Keyword
Organizational Unit
  
  
  - Any -NIST Headquarters-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)--CHIPS Program Office---CHIPS Program Headquarters----CHIPS Program Headquarters - HQ----Opportunity & Inclusion Group---External & Government Affairs Division----External & Government Affairs – HQ---Investments Division----Investments Division – HQ---Operations Office----Operations Office – HQ---Risk Management Division----Risk Management – HQ---Strategy, Technology & Policy Division----Strategy, Technology & Policy – HQ--CHIPS Research & Development Program Office---CHIPS Research & Development Program Headquarters Division----CHIPS Research & Development Program Headquarters – HQ----Integration & Policy Office----Outreach & Partnerships Office---External R&D Partnerships Division----External R&D Partnerships – HQ----National Advanced Packaging Manufacturing Program Group----National Semiconductor Technology Center Group---Industrial Advisory Committee----Industrial Advisory Committee – HQ---Semiconductor Manufacturing Institute Division----Semiconductor Manufacturing Institute – HQ---Semiconductor Metrology & Characterization Office----Semiconductor Metrology & Characterization Office – HQ-Management Resources--Management Resources---Associate Director for Management Resources----Associate Director for Management Resources - HQ---Business Operations Office----Boulder Business Operations Group----Business Operations Office - HQ----External Partnerships Group----Operations and Customer Management Support Group----Project Management Office---Emergency Services Office----Emergency Management, Preparedness and Coordination Group----Emergency Services - HQ----Fire Protection Group----Security Systems and Access Control Group---Equal Employment Opportunity and Accessibility Office----Equal Employment Opportunity and Accessibility - HQ---NIST Research Library and Museum----Research Library Group----Digital Services and Publishing Group----NIST Research Library and Museum - HQ---Fabrication Technology Office----Fabrication Technology Office - HQ--Office of Facilities and Property Management---Boulder Design and Construction Division----Boulder Design and Construction - HQ----Facilities Improvement (Boulder) Group----Reimbursable Work Group----Facilities Modernization (Boulder) Group---Gaithersburg Design and Construction Division----Facilities Improvement (Gaithersburg) Group----Reimbursable Work (Gaithersburg) Group----Facilities Library, Archives, and As-Built (Gaithersburg) Group----Construction Contract Management Group----Facilities Modernization (Gaithersburg) Group----Gaithersburg Design and Construction - HQ---Gaithersburg Facility Maintenance Division----Building Management (Gaithersburg) Group----Operations Engineering Group----Gaithersburg Facility Maintenance - HQ----Facilities Enhancement Group----Operations and Maintenance (Gaithersburg) Group----Planning, Estimating and Materials Group----Steam and Chilled Water Generation Plant Group---Facilities Services Division----Logistics Group----Materials Management (Gaithersburg) Group----Site Services Group----Facilities Services Division - HQ---Boulder Facilities Maintenance Division----Engineering and Management Group----Site Support Group----Safety and Compliance Group----Building Management and Maintenance Group----Boulder Facilities Maintenance- HQ----Support Services Group---Emergency Services Division----Police Services----Security Systems and Access Control Group----Fire Protection Group----Emergency Services - HQ----Emergency Management, Preparedness and Coordination Group---Office of Facilities and Property Management----Capital Asset Management and Facilities Planning Group----OFPM Program Management Office----Office of Facilities and Property Management - HQ----Boulder Site Management Group----Administrative Operations Group----Program Office----Reimbursement Projects Group----Safety, Health and Compliance Group--Office of Acquisition and Agreements Management---Office of Acquisition and Agreements Management----Administrative Support and Document Control Group----Office of Acquisition and Agreements Management - HQ----Policy and Compliance Group----Reimbursable Agreements Coordination Office---Grants Management Division----Grants Management - HQ---Acquisition Management Division----Acquisition Management - HQ----Acquisition Operations----Acquisition Operations----Acquisition Policy and Reimbursable Agreements--Office of Information Systems Management---Applications Systems Division----Applications Systems - HQ---Research Services Office----Research Services Office - HQ---Business Systems Division----Business Systems Division - HQ---Information Technology Security & Networking Division----Information Technology Security & Networking - HQ---Identity, Credential, and Access Management Division----Identity, Credential, and Access Management - HQ---Customer Access and Support Division----Customer Access and Support - HQ---Infrastructure Services Division----Infrastructure Services Division - HQ---Office of Information Systems Management----Office of Information Systems Management - HQ---Innovation and Solutions Division----Innovation and Solutions Division - HQ---Platform Services Division----Platform Services Division - HQ--Office of Human Resources Management---Operations and Strategic Programs Division----Operations and Strategic Program - HQ---Human Resources Management Office----Human Resources Management Office - HQ---Compensation, Recognition, and Effectiveness Division----Compensation, Recognition, and Effectiveness - HQ--Office of Safety, Health and Environment---Office of Safety, Health and Environment----Office of Safety, Health and Environment - HQ---Gaithersburg Safety, Health and Environment Division----Safety and Health Group----Gaithersburg Safety, Health and Environment - HQ----Fire and Facilities Safety Group----Environmental Management Group---Radiation Safety Division----Radiation Facilities Group----Program Development and Compliance Group----Radiation Safety - HQ---Boulder Safety, Health and Environment Division----Boulder Safety, Health and Environment - HQ--Office of Financial Resource Management---Financial Systems and Reporting Division----CBS Core Support Group----CBS Feeder System Support Group----Financial Systems and Reporting Division - HQ----Financial Statements Group----Data Control Group----Reconciliations Group---Office of Financial Resource Management----Office of Financial Resource Management - HQ----Internal Controls Management & Evaluation Office----Enterprise Risk Management Office---Finance Division----Finance - HQ----Financial Statements Group----Data Control and Cost Execution Group----Accounts Payable Purchase Orders, Grants & Foreign Payments----Accounts Payable Contracts and Government Group----Receivables Group----Reconciliations Group----Travel Group---Financial Operations Division----Travel Group----Agreements Group----Accounts Receivable Group----Accounts Payable II Group----Financial Operations - HQ----Accounts Payable Group---Budget Division----Technical and Extramural Programs Group----Institutional Support and Facilities Group----Budget - HQ----Formulation and Financial Management Group-Laboratory Programs--Communications Technology Laboratory---RF Technology Division----High-Speed Waveform Metrology Group----Superconductive Electronics Group----Metrology for Wireless Systems Group----Guided Wave Electromagnetics Group----Electromagnetic Fields Group----RF Technology Division - HQ---Smart Connected Systems Division----IoT Devices and Infrastructures Group----Networked Control Systems Group----Smart Connected Manufacturing Systems Group----Smart Grid Group----Transformational Networks and Services Group---Spectrum Technology and Research Division----Applied Systems Metrology Group----Fiber Sources and Applications Group----Shared Spectrum Metrology Group----Spectrum Technology and Research – HQ---Wireless Networks Division----Internet Technologies Research Group----Radio Access and Propagation Metrology Group----Wireless Networks Division - HQ----Wireless Systems Innovation and Performance Group---Public Safety Communications Research Division----Public Safety Communications Research Division - HQ----Advanced Communications Research Group----Network Operations Group---Communications Technology Laboratory HQ----Communications Technology Laboratory HQ Gp----Boulder Laboratory Director Office----Communication Test Coordination Office--Engineering Laboratory---Building Energy and Environment Division----Building Energy and Environment - HQ----Mechanical Systems and Controls Group----Indoor Air Quality and Ventilation Group----HVAC&R Equipment Performance Group----Heat Transfer and Alternative Energy Systems Group---Intelligent Systems Division----Intelligent Systems - HQ----Manipulation and Mobility Systems Group----Cognition and Collaboration Systems Group----Production Systems Group----Sensing and Perception Systems Group---Materials and Structural Systems Division----Earthquake Engineering Group----Infrastructure Materials Group----Inorganic Materials Group----Community Resilience Group----Materials and Structural Systems - HQ----Polymeric Materials Group----Structures Group---Engineering Laboratory Office----Applied Economics Office----Engineering Laboratory - HQ----Engineering Laboratory Data, Security, Technology Group---Fire Research Division----National Fire Research Laboratory Group----Wildland Urban Interface Fire Group----Flammability Reduction Group----Fire Research - HQ----Engineered Fire Safety Group----Fire Fighting Technology Group---Systems Integration Division----Life Cycle Engineering Group----Process Engineering Group----Information Modeling and Testing Group----Systems Integration - HQ--Information Technology Laboratory---Applied Cybersecurity Division----Applied Cybersecurity - HQ----Cybersecurity and Privacy Applications Group----National Cybersecurity Center of Excellence----Trusted Identity Initiative Group----NICE---Computer Security Division----Computer Security - HQ----Cryptographic Technology Group----Secure Systems and Applications Group----Security Components and Mechanisms Group----Security Test, Validation and Measurement Group----Security Engineering and Risk Management Group---Applied and Computational Mathematics Division----Mathematical Software Group----Mathematical Analysis and Modeling Group----Computing and Communications Theory Group----High Performance Computing and Visualization Group----Applied and Computational Mathematics - HQ---Statistical Engineering Division----Applied and Computational Statistics Group----Statistical Design, Analysis, and Modeling Group----Statistical Engineering - HQ---Software and Systems Division----Systems Interoperability Group----Software Quality Group----Software and Systems - HQ----Cyber Infrastructure Group----Information Systems Group---Information Access Division----Information Access - HQ----Image Group----Multimodal Information Group----Retrieval Group----Visualization and Usability Group---Information Technology Laboratory Office----Office of Computational Science for Metrology----Office of Emerging Technologies----Office of IT Standardization----Office of Government and Industrial Liaison----Information Technology Laboratory Office - HQ----Office of Chief Cybersecurity Advisor--Laboratory Programs---Research Protections Office----Research Protections Office - HQ---Standards Coordination Office----International Standards Policy and Coordination Group----Standards and Conformity Assessment Services Group----Standards Coordination Office - HQ----National Voluntary Laboratory Accreditation Program (NVLAP)---Special Programs Office----Special Programs Office-HQ----Law Enforcement Standards Office---Associate Director for Laboratory Programs----Associate Director for Laboratory Programs - HQ--Material Measurement Laboratory---Office of Reference Materials----Business and Quality Management Group----Business Application Development, Support, and Security Group----Sales and Customer Services Group----Publication and Web Services Group----Office of Reference Materials - HQ----Materials and Physical Services Group---Office of Data and Informatics----Office of Data and Informatics - HQ----Data Services Group----Data Sciences Group---Biosystems and Biomaterials Division----Biomarker and Genomic Sciences Group----Cellular Engineering Group----Biomaterials Group----Genome-Scale Measurements Group----Complex Microbial Systems Group----Cell Systems Science Group----Biosystems and Biomaterials Division - HQ---Chemical Sciences Division----Biochemical and Exposure Science Group----Chemical Informatics Group----Optical Measurements Group----Chemical Process and Nuclear Measurements Group----Gas Sensing Metrology Group----Inorganic Chemical Metrology Group----Biospecimen Science Group----Environmental Chemical Sciences Group----Chemical Sciences Division - HQ----Marine Biochemical Sciences Group----Organic Chemical Metrology Group---Biomolecular Measurement Division----Biomolecular Structure and Function Group----Mass Spectrometry Data Center Group----Bioprocess Measurements Group----Bioanalytical Science Group----Biomolecular Measurement Division - HQ----Applied Genetics Group---Applied Chemicals and Materials Division----Applied Chemicals and Materials Division - HQ----Thermodynamics Research Center Group----Thermophysical Properties of Fluids Group----Nanoscale Reliability Group----Fluid Characterization Group----Fatigue and Fracture Group---Materials Science and Engineering Division----Thermodynamics and Kinetics Group----Polymers Processing Group----Mechanical Performance Group----Polymers and Complex Fluids Group----Materials Science and Engineering Division - HQ----Functional Polymers Group----Functional Nanostructured Materials Group---Materials Measurement Science Division----Security Technologies Group----Surface and Trace Chemical Analysis Group----Nanomechanical Properties Group----Nano Materials Research Group----Materials Structure and Data Group----Microscopy and Microanalysis Research Group----Synchrotron Science Group----Materials Measurement Science Division - HQ----Data and AI-Driven Materials Science Group---Material Measurement Laboratory Office----The Material Measurement Laboratory Office of Operations Group----Material Measurement Laboratory - HQ----Genome-Scale Measurement Group--NIST Center for Neutron Research---NIST Center for Neutron Research----Research Facility Operations Group----NIST Center for Neutron Research - HQ----Reactor Operations and Engineering Group----Neutron-Condensed Matter Science Group--Physical Measurement Laboratory---Microsystems and Nanotechnology Division----Biophysical and Biomedical Measurement Group----Microsystems and Nanotechnology - HQ----Nanostructure Fabrication and Measurement Group----Photonics and Optomechanics Group---Time and Frequency Division----Atomic Devices & Instrumentation Group----Precision Photonic Synthesis Group----Quantum & Nonlinear Nanophotonics Group----Atomic Standards Group----Ion Storage Group----Neutral Atom Optical Clocks Group----Time Realization and Distribution Group----Phase Noise Metrology Group----Time and Frequency - HQ---Quantum Physics Division----Quantum Physics - HQ---Radiation Physics Division----Dosimetry Group----Radioactivity Group----Radiation Physics - HQ----Neutron Physics Group---Sensor Science Division----Ultraviolet Radiation Group----Sensor Science - HQ----Dimensional Metrology Group----Thermodynamic Metrology Group----Remote Sensing Group----Optical Radiation Group----Fluid Metrology Group----Surface and Interface Metrology Group---Applied Physics Division----Advanced Microwave Photonics Group----Spin Electronics Group----Applied Physics - HQ----Faint Photonics Group----Quantitative Nanostructure Characterization Group----Quantum Devices Group----Molecular and Bio-Photonics Group----Optoelectronic Manufacturing Group----Magnetic Imaging Group----Quantum Nanophotonics Group----Sources and Detectors Group---Quantum Measurement Division----Quantum Optics Group----Mass and Force Group----Quantum Measurement - HQ----Laser Cooling and Trapping Group----Fundamental Electrical Measurements Group----Applied Electrical Metrology Group----Atomic Spectroscopy Group---Quantum Sensors Division----Device Fabrication Group----Long Wavelength Sensors and Applications Group----Quantum Calorimeters Group----Quantum Electronics Group----Quantum Processing Group----Quantum Sensors Group----Quantum Sensors – HQ----Nanoscale Spin Dynamics Group----Microfabrication Group----Spin Electronics Group----Magnetics Group---Nanoscale Device Characterization Division----Atom Scale Device Group----Nanoscale Device Characterization Division - HQ----Alternative Computing Group----Nanoscale Spectroscopy Group----Advanced Electronics Group----Nanoscale Processes and Measurements Group---Physical Measurement Laboratory Office----Boulder Microfabrication Facility----Physical Measurement Laboratory- HQ----PML Information Office----Center for Nanoscale Science and Technology----Office of Weights and Measures----Boulder Laboratory Director Office-Innovation & Industry Services--Office of Advanced Manufacturing---Microelectronics Manufacturing Division----Microelectronics Manufacturing – HQ----Microelectronics Strategy and Enterprise Group----Semiconductor Coordination Group----Semiconductor Operations Group----Workforce and Equity Development Group---Office of Advanced Manufacturing----Office of Advanced Manufacturing - HQ---Partnerships and Outreach Division----Communications and Marketing Group----Education and Workforce Development Group----Partnership Engagement Group----Partnerships and Outreach – HQ----Technology Hubs Development Group---Policy and Strategy Division----Analysis and Benchmarking Group----Policy and Strategy – HQ----Strategic Planning Group---Program Operations Division----Competitions Group----Institute and Program Management Group----Performance Management Group----Program Operations - HQ--Baldrige Performance Excellence Program---Baldrige Performance Excellence Program Office----Award Process Group----Director's Office, Baldrige Performance Excellence Program----Administrative Support/Electronic Information Group----Outreach and Communications Group----Publications Management Group----Workforce Development Group--Innovation & Industry Services---Associate Director for Innovation & Industry Services----Associate Director for Innovation & Industry Services - HQ---Advanced Manufacturing Office----Advanced Manufacturing Office - HQ---Economic Analysis Office----Economic Analysis Office - HQ---Technology Partnerships Office----Technology Partnerships Office - HQ---Technology Innovation Program Office----Technology Innovation Program Office - HQ--Hollings Manufacturing Extension Partnership Program---National Platforms Division----National Platforms – HQ----Network Knowledge Management Group----Supply Chain Group---National Programs Division----National Programs- HQ---Network Learning and Strategic Competitions Division----Network Learning and Strategic Competitions - HQ---Outreach and External Affairs Division----Outreach and External Affairs – HQ---Performance Evaluation and Economic Impacts Division----Performance Evaluation and Economic Impacts - HQ----Performance Metrics and Evaluation Group---Regional and State Partnerships Division----Regional Management Group----Regional and State Partnerships - HQ---Network Agreements Management Division----Network Agreements Management - HQ----Node B Group----Node A Group---Internal Operations Division----Internal Operations – HQ----Center Operations and Financial Management Group---Extension Services Division----Extension Services - HQ---Hollings Manufacturing Extension Partnership Program Office----Hollings Manufacturing Extension Partnership Program - HQ-Director's Office--Director's Office---Diversity, Equity and Inclusivity Office----Diversity, Equity and Inclusivity Office - HQ---Ombuds Office----Ombuds Office - HQ---Public Affairs Office----Media Liaison Group----Video and Digital Media Production Group----Public Affairs Office - HQ----Internal Communications and Inquiries Group----Conference Program and Audiovisual Services Group----Boulder Meetings Support and Services Group----Web Content Development Group---Program Coordination Office----Program Coordination Office - HQ---Director's Office----Director's Office - HQ----Onboarding Group---Congressional and Legislative Affairs Office----Congressional and Legislative Affairs Office - HQ---Human Subjects Protection Office----Human Subjects Protection Office - HQ---Management and Organization Office----Management and Organization Office- HQ---International and Academic Affairs Office----International and Academic Affairs Office - HQ
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          Displaying 1 - 25 of 93
              Aberration-Corrected Transmission Electron Microscope (TEM)Probe corrected 200kV analytic electron microscope Resolves single atoms Chemical analytic capability (EELS, EDS) Highest resolution in electron optics (<0.1 nm
  NanoFab Tool: 4Wave IBD/BTD Cluster Sputter Deposition SystemThe 4Wave IBD/BTD cluster sputter deposition system can automatically load and unload two six target chambers to provide users a largely unattended 24/7
  NanoFab Tool:  Allied High Tech Dual Prep PH-3 Grinding and Polishing SystemThe Allied High Tech Dual Prep PH-3 grinding and polishing system is used to mechanically thin samples and polish cleaved facets in preparation for high
  NanoFab Tool:  Asylum Cypher High Resolution Atomic Force MicroscopeThe Asylum Cypher high resolution atomic force microscope (AFM) offers high resolution measurements and flexibility, allowing researchers to adapt the AFM
  NanoFab Tool:  Bachur & Associates LS-200FSX Photoresist Stabilization SystemThe Bachur & Associates LS-200FSX Photoresist Stabilization System provides deep-ultraviolet (DUV) flood exposure and resist curing. The system strengthens
  NanoFab Tool: Bruker Dektak 6M contact profilometerThe Bruker Dektak 6M contact profilometer measures the thickness of patterned thin films by sensing the deflections of a fine stylus riding over feature steps
  NanoFab Tool:  Bruker Dimension FastScan Atomic Force MicroscopeThe Bruker Dimension FastScan atomic force microscope (AFM) combines a high-speed scanning AFM, programmable stage control, and a user friendly interface to
  NanoFab Tool: Denton Vacuum Discovery 550 Sputtering System B104 RightThe Denton Vacuum Discovery 550 sputtering system has two direct current (DC) and two radio frequency (RF) sputtering guns which bombard targets, causing atoms
  NanoFab Tool: Denton Vacuum Discovery 550 Sputtering System B104 LeftThe Denton Vacuum Discovery 550 sputtering system has two direct current (DC) and two radio frequency (RF) sputtering guns which bombard targets, causing atoms
  NanoFab Tool:  Denton Vacuum Infinity 22 Electron Beam EvaporatorThe Denton Vacuum Infinity 22 electron beam evaporator vapor deposits thin films and is capable of loading up to six source materials for deposition. The
  NanoFab Tool: Denton Vacuum Infinity 22 Electron Beam and Thermal EvaporatorThe Denton Vacuum Infinity 22 dual source evaporator uses a choice of either electron beam evaporation or resistive heating to vapor deposit thin films
  NanoFab Tool: Ecopia Hall Effect Measurement SystemThe HMS-5500 Hall Effect measurement system is used to measure electrical resistivity, carrier density, and mobility of semiconducting materials. The system is
  NanoFab Tool:  FEI Helios NanoLab 660 Dual Beam Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) 2The FEI Helios 660 dual-beam microscope combines a monochromated field emission scanning electron microscope (FE-SEM) with an advanced focused ion beam (FIB)
  NanoFab Tool:  FEI Titan 80-300 Analytical Transmission Electron MicroscopeThe FEI Titan 80-300 scanning transmission electron microscope (STEM) is an advanced analytical field emission scanning transmission electron microscope capable
  NanoFab Tool: Filmetrics F50 UV Mapping ReflectometerThe Filmetrics F50 is an automated thin-film thickness mapping system equipped with a motorized r-theta stage that moves automatically to selected measurement
  NanoFab Tool:  First Ten Angstroms FTA125 Contact Angle GoniometerThe First Ten Angstroms FTA125 is a general purpose goniometer that can measure the contact angle and surface tension of liquid droplets on a substrate's
  NanoFab Tool:  Fischione Model 1040 NanoMill Ion MillThe Fischione Model 1040 NanoMill is a low-energy, low-angle argon ion milling instrument used for preparing ultra-thin, high-quality transmission electron
  NanoFab Tool: Four Dimensions 280DI Sheet Resistance Mapping SystemThe Four Dimensions 280DI sheet resistance mapping system uses the 4-point probe technique to measure the sheet resistance of substrates and films. The
  NanoFab Tool:  Heidelberg Instruments DWL 2000 Laser Pattern GeneratorThe Heidelberg Instruments DWL 2000 Laser Pattern Generator uses a high resolution laser to expose photoresist for substrate patterning of features as small as
  NanoFab Tool: IPEC 472, Chemical Mechanical Polisher (CMP)The CMP removes material both chemically, by use of a corrosive colloidal slurry, and mechanically, by way of a wafer carrier under controlled pressure rotating
  NanoFab Tool:  J. A. Woollam M-2000 DI Spectroscopic EllipsometerThe J. A. Woollam M-2000 DI spectroscopic ellipsometer provides fast and accurate thin film characterization over a wide spectroscopic range. The high speed CCD
  NanoFab Tool: Jeio Tech OF-12G Forced Convection OvenThe Jeio Tech OF-12G forced convection oven is used in the soft lithography processing to perform a dehydration bake prior to silanization and cure samples
  NanoFab Tool:  JEOL JBX 6300-FS Direct Write Electron Beam Lithography System (Cleanroom)The JEOL JBX 6300-FS direct write electron beam lithography system allows users to quickly and directly pattern a variety of substrate materials with features
  NanoFab Tool:  Keithley 4200 SCS Parametric Test StationThe Keithley 4200 SCS parametric test system provides in-line electrical characterization capabilities, including the ability to measure capacitance at multiple
  NanoFab Tool:  Kulicke and Soffa Model 4526 Wedge Wire BonderThe Kulicke and Soffa Model 4526 wedge wire bonder provides electrical interconnects between a device chip and package using thin aluminum or gold wires. The

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