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  - Any -NIST Headquarters-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)--CHIPS Program Office---CHIPS Program Headquarters----CHIPS Program Headquarters - HQ----Opportunity & Inclusion Group---External & Government Affairs Division----External & Government Affairs – HQ---Investments Division----Investments Division – HQ---Operations Office----Operations Office – HQ---Risk Management Division----Risk Management – HQ---Strategy, Technology & Policy Division----Strategy, Technology & Policy – HQ--CHIPS Research & Development Program Office---CHIPS Research & Development Program Headquarters Division----CHIPS Research & Development Program Headquarters – HQ----Integration & Policy Office----Outreach & Partnerships Office---External R&D Partnerships Division----External R&D Partnerships – HQ----National Advanced Packaging Manufacturing Program Group----National Semiconductor Technology Center Group---Industrial Advisory Committee----Industrial Advisory Committee – HQ---Semiconductor Manufacturing Institute Division----Semiconductor Manufacturing Institute – HQ---Semiconductor Metrology & Characterization Office----Semiconductor Metrology & Characterization Office – HQ-Management Resources--Management Resources---Associate Director for Management Resources----Associate Director for Management Resources - 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HQ----Data and AI-Driven Materials Science Group---Material Measurement Laboratory Office----The Material Measurement Laboratory Office of Operations Group----Material Measurement Laboratory - HQ----Genome-Scale Measurement Group--NIST Center for Neutron Research---NIST Center for Neutron Research----Research Facility Operations Group----NIST Center for Neutron Research - HQ----Reactor Operations and Engineering Group----Neutron-Condensed Matter Science Group--Physical Measurement Laboratory---Microsystems and Nanotechnology Division----Biophysical and Biomedical Measurement Group----Microsystems and Nanotechnology - HQ----Nanostructure Fabrication and Measurement Group----Photonics and Optomechanics Group---Time and Frequency Division----Atomic Devices & Instrumentation Group----Precision Photonic Synthesis Group----Quantum & Nonlinear Nanophotonics Group----Atomic Standards Group----Ion Storage Group----Neutral Atom Optical Clocks Group----Time Realization and Distribution Group----Phase Noise Metrology Group----Time and Frequency - HQ---Quantum Physics Division----Quantum Physics - HQ---Radiation Physics Division----Dosimetry Group----Radioactivity Group----Radiation Physics - HQ----Neutron Physics Group---Sensor Science Division----Ultraviolet Radiation Group----Sensor Science - HQ----Dimensional Metrology Group----Thermodynamic Metrology Group----Remote Sensing Group----Optical Radiation Group----Fluid Metrology Group----Surface and Interface Metrology Group---Applied Physics Division----Advanced Microwave Photonics Group----Spin Electronics Group----Applied Physics - HQ----Faint Photonics Group----Quantitative Nanostructure Characterization Group----Quantum Devices Group----Molecular and Bio-Photonics Group----Optoelectronic Manufacturing Group----Magnetic Imaging Group----Quantum Nanophotonics Group----Sources and Detectors Group---Quantum Measurement Division----Quantum Optics Group----Mass and Force Group----Quantum Measurement - HQ----Laser Cooling and Trapping Group----Fundamental Electrical Measurements Group----Applied Electrical Metrology Group----Atomic Spectroscopy Group---Quantum Sensors Division----Device Fabrication Group----Long Wavelength Sensors and Applications Group----Quantum Calorimeters Group----Quantum Electronics Group----Quantum Processing Group----Quantum Sensors Group----Quantum Sensors – HQ----Nanoscale Spin Dynamics Group----Microfabrication Group----Spin Electronics Group----Magnetics Group---Nanoscale Device Characterization Division----Atom Scale Device Group----Nanoscale Device Characterization Division - HQ----Alternative Computing Group----Nanoscale Spectroscopy Group----Advanced Electronics Group----Nanoscale Processes and Measurements Group---Physical Measurement Laboratory Office----Boulder Microfabrication Facility----Physical Measurement Laboratory- HQ----PML Information Office----Center for Nanoscale Science and Technology----Office of Weights and Measures----Boulder Laboratory Director Office-Innovation & Industry Services--Office of Advanced Manufacturing---Microelectronics Manufacturing Division----Microelectronics Manufacturing – HQ----Microelectronics Strategy and Enterprise Group----Semiconductor Coordination Group----Semiconductor Operations Group----Workforce and Equity Development Group---Office of Advanced Manufacturing----Office of Advanced Manufacturing - HQ---Partnerships and Outreach Division----Communications and Marketing Group----Education and Workforce Development Group----Partnership Engagement Group----Partnerships and Outreach – HQ----Technology Hubs Development Group---Policy and Strategy Division----Analysis and Benchmarking Group----Policy and Strategy – HQ----Strategic Planning Group---Program Operations Division----Competitions Group----Institute and Program Management Group----Performance Management Group----Program Operations - HQ--Baldrige Performance Excellence Program---Baldrige Performance Excellence Program Office----Award Process Group----Director's Office, Baldrige Performance Excellence Program----Administrative Support/Electronic Information Group----Outreach and Communications Group----Publications Management Group----Workforce Development Group--Innovation & Industry Services---Associate Director for Innovation & Industry Services----Associate Director for Innovation & Industry Services - HQ---Advanced Manufacturing Office----Advanced Manufacturing Office - HQ---Economic Analysis Office----Economic Analysis Office - HQ---Technology Partnerships Office----Technology Partnerships Office - HQ---Technology Innovation Program Office----Technology Innovation Program Office - HQ--Hollings Manufacturing Extension Partnership Program---National Platforms Division----National Platforms – HQ----Network Knowledge Management Group----Supply Chain Group---National Programs Division----National Programs- HQ---Network Learning and Strategic Competitions Division----Network Learning and Strategic Competitions - HQ---Outreach and External Affairs Division----Outreach and External Affairs – HQ---Performance Evaluation and Economic Impacts Division----Performance Evaluation and Economic Impacts - HQ----Performance Metrics and Evaluation Group---Regional and State Partnerships Division----Regional Management Group----Regional and State Partnerships - HQ---Network Agreements Management Division----Network Agreements Management - HQ----Node B Group----Node A Group---Internal Operations Division----Internal Operations – HQ----Center Operations and Financial Management Group---Extension Services Division----Extension Services - HQ---Hollings Manufacturing Extension Partnership Program Office----Hollings Manufacturing Extension Partnership Program - HQ-Director's Office--Director's Office---Diversity, Equity and Inclusivity Office----Diversity, Equity and Inclusivity Office - HQ---Ombuds Office----Ombuds Office - HQ---Public Affairs Office----Media Liaison Group----Video and Digital Media Production Group----Public Affairs Office - HQ----Internal Communications and Inquiries Group----Conference Program and Audiovisual Services Group----Boulder Meetings Support and Services Group----Web Content Development Group---Program Coordination Office----Program Coordination Office - HQ---Director's Office----Director's Office - HQ----Onboarding Group---Congressional and Legislative Affairs Office----Congressional and Legislative Affairs Office - HQ---Human Subjects Protection Office----Human Subjects Protection Office - HQ---Management and Organization Office----Management and Organization Office- HQ---International and Academic Affairs Office----International and Academic Affairs Office - HQ
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              Hard X-ray Photoelectron Spectroscopy (HAXPES)The Hard X-ray Photoelectron Spectroscopy (HAXPES) end station uses a tunable, focused X-ray beam in the tender spectrum (2.0 keV to 7.5 keV) to probe the depth
  Nanocalorimeter Measurement SystemThis Nanocalorimeter Measurement System is used for nanocalorimetry measurements at fast heating rates (100 °C/s to 100,000 °C/s) and measurements of samples
  Positron Annihilation Lifetime SpectrometerPositron annihilation lifetime spectroscopy uses positrons to probe material defects/voids/free volume at the sub-nm scale. The general working principle is
  Synchrotron X-ray Diffraction (XRD)The X-ray diffraction (XRD) end station measures constructive interference of the x-ray wave with repeating atomic and interfacial structure in materials. At
  Vector Potential Photoelectron Microscope (VPPEM)The Vector Potential Photoemission Microscope endstation sits at the end of both the SST-I and SST-II beamlines, providing both soft (0.1 keV to 2.2 keV) and
  X-ray Absorption Fine Structure (XAFS)The XAFS station uses a tunable, monochromatic, and moderately high energy X-ray beam (4.5 keV to 23.5 keV) for X-ray absorption spectroscopy measurements. The
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