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https://www.nist.gov/laboratories/tools-instruments/nanofab-tool-reactive-ion-etcher-unaxis-790-right

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TOOLS & INSTRUMENTS

# NanoFab Tool: Reactive Ion Etcher Unaxis 790 Right

The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch polymer and dielectric materials. It can also use argon to physically etch metals. The large chamber can accommodate substrates ranging from 200 mm diameter wafers down to small pieces.

## Specifications/Capabilities

                    - Radio frequency (RF) power source: up to 500 W at 13.56 MHz.
                    - Electrode temperature range: 0 °C to 70 °C.
                    - Process Gases: Ar, O 2 , CF 4 , CHF 3 , and SF 6
                    - Reactive ion etching of silicon, silicon oxide and silicon nitride.

## Usage Information

### Supported Sample Sizes

                      - Maximum wafer diameter: 200 mm (8 in).
                      - Small pieces supported: Yes.

## Typical Applications

                    - Anisotropic thin film etching.
                    - Photoresist descum.
                    - Silicon nitride membrane fabrication.
                    - Physical etching of metals.

## Back to the NanoFab Equipment List

NanotechnologyNanofabrication / manufacturing

## Organizations

                          - NIST Headquarters
                            - Laboratory Programs
                              - Physical Measurement Laboratory
                                - Physical Measurement Laboratory Office
                                  - Center for Nanoscale Science and Technology

## Details

## Hours of Operation

Cleanroom hours

## Tool Reservation Rules

                    - Minimum Reservation Time: 30 minutes.
                    - Maximum Reservation Time: 4 hours.
                    - Adjacent Reservations Permitted: Yes.
                    - Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.

## Contact

### Primary Engineer

                    -  Lei Chen  lei.chen@nist.gov      (301) 975-2908   

### Backup Engineers

                    -  Jessie Zhang  chen.zhang@nist.gov      (301) 975-4565   
                    -  Robert Ilic  robert.ilic@nist.gov      (301) 975-3712   

### General Contact

                    -      NanoFab Dryetch    nogtech@nist.gov      (301) 975-8672          100 Bureau Drive, Stop 6201   Gaithersburg,  MD 20899-6201   

### HEADQUARTERS

301-975-2000

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