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https://www.nist.gov/laboratories/tools-instruments/nanofab-tool-suss-microtec-sb6e-wafer-bonder

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TOOLS & INSTRUMENTS

# NanoFab Tool: Suss MicroTec SB6e Wafer Bonder

The Suss MicroTec SB6e wafer bonder is a universal vacuum substrate bonder for designed for a wide range of microelectromechanical system (MEMS) applications. Prior to bonding, substrate stacks can be mechanically clamped using a transport fixture or temporarily bonded by adhesion film. The transport fixture also fits into the Suss MA6 mask aligner, allowing users to precisely pre-align their substrates before bonding.

## Specifications/Capabilities

                    - Minimum chamber vacuum: 5 x 10 -3  Pa (5 x 10 -8  bar).
                    - Maximum temperature: 500 °C.
                    - Bonding force range on a 150 mm wafer: 20 kN to 300 N.
                    - High voltage power supply for anodic bonding.
                    - Supported bonding methods: anodic, adhesive, fusion, eutectic, and glass frit.
                    - Aligned bonding support for whole wafers on MA6.
                    - Transport fixture for bonded whole wafers is compatible with the NanoFab's Suss MA6 mask aligner.

## Usage Information

### Supported Sample Sizes

                      - Maximum wafer diameter: 150 mm (6 in).
                      - Small pieces supported: Yes.
                      - MA6 aligned wafer diameters supported: 75 mm (3 in), 100 mm (4 in), and 150 mm (6 in).
                      - Maximum thickness: 10 mm.

## Typical Applications

                    - Biofluidic devices.
                    - Thermal sensors.
                    - MEMS processing.

## Back to the NanoFab Equipment List

NanotechnologyNanofabrication / manufacturing

## Organizations

                          - NIST Headquarters
                            - Laboratory Programs
                              - Physical Measurement Laboratory
                                - Physical Measurement Laboratory Office
                                  - Center for Nanoscale Science and Technology

## Details

## Hours of Operation

Cleanroom hours

## Tool Reservation Rules

                    - Minimum Reservation Time: 30 minutes.
                    - Maximum Reservation Time: 4 hours.
                    - Adjacent Reservations Permitted: Yes.
                    - Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.

## Contact

### Primary Engineer

                    -  Liya Yu  liya.yu@nist.gov      (301) 975-4590   

### Backup Engineer

                    -  Lei Chen  lei.chen@nist.gov      (301) 975-2908   

### General Contact

                    -      NanoFab Litho    nanofab_litho@nist.gov      (301) 975-8672          100 Bureau Drive, Stop 6201   Gaithersburg,  MD 20899-6201   

### HEADQUARTERS

301-975-2000

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