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 TOOLS & INSTRUMENTS

NanoFab Tool: Oxford Plasmalab 100 Inductively Coupled Plasma (ICP) Metal Etcher
    
  Photograph of the Oxford Plasmalab 100 inductively coupled plasma etcher.Photograph of the Oxford Plasmalab 100 inductively coupled plasma etcher.
  
      The Oxford Plasmalab 100 inductively coupled plasma (ICP) etcher is a multipurpose chlorine based system that provides users with selective etching of III-V group semiconductors as well as metals. The tool is equipped with a temperature controlled electrode to help users tailor their etch feature profiles. The manual load system can accommodate substrates ranging from 200 mm diameter wafers down to small pieces.

Specifications/Capabilities
      
                          Inductively coupled plasma (ICP) power source: up to 2500 W at 2.4 MHz.
	Radio frequency (RF) power source: up to 600 W at 13.56 MHz.
	Electrode temperature range: -150 °C to 300 °C.
	Process Gases: Ar, He, N2, O2, BCl3, CF4, CH4, Cl2, H2, HBr, SF6 and SiCl4
	Controlled etching of Al, Al2O3, Cr, Cr2O3, Mo and Ti.
              Usage Information
        
Supported Sample Sizes
                                Maximum wafer diameter: 200 mm (8 in).
	Wafer diameters: 75 mm (3 in), 100 mm (4 in) - default, 150 mm (6 in), and 200 mm (8 in).
	Small pieces supported: Yes.
              Typical Applications
      
                          Optical device fabrication.
	General device patterning.Back to the NanoFab Equipment List
  Nanotechnology and Nanofabrication / manufacturing
  
            Organizations
      
      NIST HeadquartersLaboratory ProgramsPhysical Measurement LaboratoryPhysical Measurement Laboratory OfficeCenter for Nanoscale Science and Technology
              Details
        
NEMO Name
                                Oxford Metal Etcher

Location
                                Building 215 Rm. A106 (Cleanroom)
  Campus
                    Gaithersburg
              Hours of Operation
      
                          Cleanroom hours

Tool Reservation Rules
      
                          Minimum Reservation Time: 30 minutes.
	Maximum Reservation Time: 4 hours.
	Adjacent Reservations Permitted: Yes.
	Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
	Restrictions: Photoresist edge bead must be removed.
Contact
      
        

Primary Engineer
        Lei Chen
    
      
  lei.chen@nist.gov
  (301) 975-2908

  

Backup Engineers
        Jessie Zhang
    
      
  chen.zhang@nist.gov
  (301) 975-4565

  Robert Ilic
    
      
  robert.ilic@nist.gov
  (301) 975-3712

  

General Contact
        NanoFab Dryetch
  nogtech@nist.gov
  (301) 975-8672
  100 Bureau Drive, Stop 6201 
  Gaithersburg,
  MD 20899-6201

    
    Created June 22, 2014, Updated October 6, 2023
 HEADQUARTERS
            100 Bureau Drive
              Gaithersburg, MD 20899301-975-2000
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