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TOOLS & INSTRUMENTS

# NanoFab Tool:  Atomic Layer Deposition

The Oxford FlexAL atomic layer deposition (ALD) system supports plasma and thermal ALD coating processes with precise ultrathin and pinhole free films. The system deposits films with thicknesses ranging from one atomic layer to several nanometers on a variety of substrate materials and can accommodate substrates ranging from 200 mm diameter wafers down to small pieces. Standard processes include silicon dioxide, hafnium oxide, aluminum oxide, and platinum.

## Specifications/Capabilities

                    - Precisely controlled ultrathin and pinhole free film coating.
                    - Film thicknesses ranging from one atomic layer to nanometers.
                    - Maximum temperature: 300 °C.
                    - Maximum ICP power: 300 W.
                    - Maximum RF power: 300 W.
                    - Standard deposition processes:	                       - Silicon dioxide.
                      - Hafnium oxide.
                      - Aluminum oxide.
                      - Platinum.

## Usage Information

### Supported Sample Sizes

                      - Maximum wafer diameter: 200 mm (8 in).
                      - Small pieces supported: Yes.

## Typical Applications

                    - Nanolaminates coatings.
                    - Nanostructure conformal coatings.
                    - High-aspect ratio feature coatings.

## Back to the NanoFab Equipment List

NanotechnologyNanofabrication / manufacturing

## Organizations

                          - NIST Headquarters
                            - Laboratory Programs
                              - Physical Measurement Laboratory
                                - Physical Measurement Laboratory Office
                                  - Center for Nanoscale Science and Technology

## Details

## Hours of Operation

Cleanroom hours

## Tool Reservation Rules

                    - Minimum Reservation Time: 1 hour.
                    - Maximum Reservation Time: 24 hours.
                    - Adjacent Reservations Permitted: Yes.
                    - Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
                    - Restrictions: No photoresist or plastic substrates.

## Contact

### Primary Engineer

                    -  Lei Chen  lei.chen@nist.gov      (301) 975-2908   

### Backup Engineer

                    -  Gerard Henein  gerard.henein@nist.gov      (301) 975-5645   
                    -  Jessie Zhang  chen.zhang@nist.gov      (301) 975-4565   

### General Contact

                    -      NanoFab Deposition    nanofab_deposition@nist.gov      (301) 975-8672          100 Bureau Drive, Stop 6201   Gaithersburg,  MD 20899-6201   

### HEADQUARTERS

301-975-2000

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