Short Abstracts
S1-1 Information Security 

Smart Grid and Cyber Security 

Annabelle Lee, Computer Security Division, Information Technology Laboratory, 

National Institute of Standard and Technology 

The talk will give an overview of the Smart Grid Interoperability Panel - Cyber 

Security Working Group that is lead by NIST. We are addressing the high level cyber 

security requirements for the Smart Grid. 

FIPS 140-3 Non-Invasive Attack Testing 

Hirofumi Sakane, Research Center for Information Security, National Institute of 

Advanced Industrial Science and Technology, and Computer Security Division, 

National Institute of Standards and Technology 

Various information security standards are in effect worldwide. These standards are 

updated periodically to address new attack and defense technologies. Thus, FIPS 

140-3 is planned to supersede FIPS 140-2, the current federal standard on security 

requirements for cryptographic modules. 

This talk summarizes the joint effort NIST and AIST have undertaken to update 

portions of FIPS 140-2. In this talk we introduce Non-Invasive Attacks, which the 

draft standard FIPS 140-3 addresses in a new section. We also briefly discuss 

information security concerns in Smart Grid technologies, using smart meters and EV 

charging systems as examples. The Cyber Security Coordination Task Group has 

listed all applicable existing information security standards to be reviewed. FIPS 

140-2 is listed as a guide to cryptographic suites. We expect that once FIPS 140-3 is 

signed off, it will supersede FIPS 140-2 for Smart Grid Cyber Security as well. 
S1-2 Solid State Lighting 

Development of Photometric Measurement Techniques for Solid 

State Lighting (SSL) 

Tatsuya Zama, Photometry and Radiometry Division, National Metrology Institute of 

Japan (NMIJ), AIST 

 Reducing energy consumption is necessary for reducing carbon dioxide (CO2) 

emissions. Modern society consumes considerable amount of energy for lighting, 

therefore improving luminous efficiency (the ratio of total luminous flux to power: 

lm/W) of light sources is important. Solid State Lighting(SSL) are expected to 

become widely used in the near future because SSL has the potential to achieve higher 

luminous efficiency. However the evaluation of the luminous flux of SSL is not easy 

and it is consequently indispensable to develop luminous flux evaluation method for 

SSL and to ensure reliability of luminous efficiency of SSL. A substitution method 

using a standard lamp with an integrating sphere has been traditionally used to 

evaluate total luminous flux of light sources. However, the substitution method cannot 

be applied to most of SSL products, whose angular intensity distribution differs from 

standard lamp. If the angular intensity distribution of the lamp under-test is different 

from that of the standard lamp, the uncertainty of total luminous flux is mainly due to 

spatial non-uniformity of the wall reflectance in integrating sphere, 

 In the presentation, we mention a beam scanner, which is designed jointly by AIST 

and NIST, for evaluating the non-uniformity, and also mention briefly the present 

state of our research of photometric measurement for Light-Emitting Diodes(LEDs) 

and SSL . 

NIST’s Role in Standardization of Solid State Lighting 

Yoshi Ohno, Optical Technology Division, Physics Laboratory, National Institute of 

Standard and Technology

This presentation will first overview the approaches taken by the U.S. Department of 

Energy and Environmental Protection Agency to promote solid state lighting (SSL) in 

the USA, through the Energy Star and several other programs. Several new national 

standards have been developed in American National Standards Institute (ANSI) and 

Illuminating Engineering Society of North America (IESNA) to support the Energy 

Star SSL program, and NIST took leading roles in developing some of the standards 

developed. Energy Star also requires an accreditation program for testing laboratories 

in this field, which has been developed by the Optical Technology Division and 

National Voluntary Laboratory Accreditation Program (NVLAP) at NIST. Our 

Division provides technical support for the NVLAP SSL program including technical 

assessment and round robin testing for SSL. We work closely with the Department of 

Energy on these activities. 

The Optical Technology Division also conducts research needed for new standards on 

measurement and test methods for LEDs and SSL products. We recently developed a 

practical method for measurement of high-power LEDs to solve the difficulty in 

reproducible measurements of LEDs at high temperature conditions. Based on this 
method, new standards are being developed in the International Commission on 

Illumination (CIE) and IESNA committees led by NIST. We also recently started 

Vision Science project to address the color quality issues of solid state lighting . The 

existing standard for color rendering is obsolete and creating several problems with 

white LED sources. We developed a new metric for color quality of light sources to 

solve these problems, which is proposed for a new standard in the CIE. We also 

started a new research on measurement of LED lifetime, under support by DOE, to 

develop further standards on this subject. 

Standard committees are the grate places for us to learn the problems and needs in the 

industry, and we feedback our research to new standards solving the problems, 

forming a good cycle of cooperation between NIST and the industry. 
S1-3 3D Imaging 

3D Trends, Opportunities and Challenges 

Chris Chinnock, Board Member 3D @ Home Consortium and President, Insight 

Media 

Stereoscopic 3D has suddenly become a very hot topic of interest. TV makers, PC 

makers, camera companies, entertainment, sporting and gaming content creators and 

broadcasters are all getting behind this effort. This talk will provide a high level view 

of all of this activity. It will highlight some of the key trends, key players and 

important milestones these players hope to achieve in 3D. We will also note some 

potential problems with the adoption of 3D including human factors issues. 

3D Image Safety: R&D for standardization of guidelines 

Hiroyasu Ujike, Institute for Human Science and Biomedical Engineering, AIST 

In the wake of “3D film” pronouncement in Hollywood, the 3D market are now about 

to expand internationally. However, there is a concern about undesirable biomedical 

effects caused by 3D images. To resolve the issue, we need to establish “3D Image 

Safety” based on ergonomics, and to develop international standard of 3D image 

guidelines. 

To do this, we are now working on development of scientific reference database, 

measurements of biomedical effects, and development of 3D image evaluation system. 

In the talk, the progress of our those activities and the future plan will be introduced. 
S2-1 Thickness 

Development of Thin Film Standards for Thickness Metrology by Xray Reflectometry 

Yasushi Azuma, Material Characterization Division, National Metrology Institute of 

Japan, National Institute of Advanced Industrial Science and Technology 

Film thickness standard materials of a SiO2/Si ultra-thin film and a GaAs/AlAs super 

lattice have been development in order to calibrate measurement results and to 

improve accuracy of metrology. The target thickness of the each layer is less than 10 

nm with uncertainty of less than the thickness of 1 monolayer. The certified value was 

determined based on the calibrated X-ray wavelength and angle by X-ray 

reflectometry (XRR). It is traceable to the International System of Units (SI). The 

NMIJ’s traceable XRR was equipped with an encoder calibrated with the national 

angle standard established in NMIJ. In addition, the traceable XRR also has a self 

angle calibration system similar the national standard. 

One considerable problem to the thickness certification is an influence of 

contamination on the surfaces. In order to improve accuracy, there is one of a solution 

that the contaminants are removed and the surfaces are protected from re-adsorption 

of them during the measurement. These results will be presented at the symposium. 

NIST SI-traceable X-Ray Reflectometry (XRR) Measurement 

Capabilities for Thin Films: Instrumentation and Data Analysis 

Donald Windover, Ceramics Division, Materials Science and Engineering Laboratory, 

National Institute of Standard and Technology 

Our X-ray metrology (XRM) project team at the National Institute of Standards and 

Technology (NIST) works exclusively in developing Standard Reference Materials 

(SRMs) for the powder diffraction (PD), high-resolution x-ray diffraction (HRXRD), 

and X-ray reflectometry (XRR) communities. In this presentation we will show, our 

approach to SRM development, our current progress in the development of 

instrumentation and data analysis methods for XRR, and any potential areas for 

collaboration between AIST/NMIJ and NIST in XRR standards development. 

Over the past decade, we have developed a NIST metrology platform to provide 

International System of Units (SI)-traceable X-ray measurements; providing SItraceability through accurate determination of both measured angles and the X-ray 

wavelength in the system’s various optical configurations. In addition, NIST has 

developed Bayesian statistical approaches to analysis of X-ray measurements to 

estimate parameter uncertainties and to test the validity and likelihood of given 

structural models. This is particularly important for XRR data, which may, due to lack 

of phase information in measurements, support multiple possible structural models, 

with highly correlated structural parameters. 
S2-2 Thermal and Mechanical Properties 

Thermophysical Property Standard for Thin Films in Japan 

Naoyuki Taketoshi, Material properties and Metrological Statistics Division, National 

Metrology Institute of Japan, National Institute of Advanced Industrial Science and 

Technology 

Thermophysical properties of thin films are as important as electrical, magnetic, and 

optical properties of thin films in microelectronics devices, such as storage media, 

LEDs, and thermoelectric devices. In order to measure thermal diffusivities of submicrometer thin films quantitatively, a “rear heating / front probing” type (RF-type) 

light pulse thermoreflectance measurement system, which has the same configuration 

as the macroscopic laser flash method for bulk specimens, has been developed in the 

National Metrology Institute of Japan (NMIJ) of AIST. A thin film face of a substrate 

side is heated instantaneously by picosecond pump light pulses, and heat diffuses into 

the thin film. Change of the front face temperature is detected by probe light pulses 

using the thermoreflectance technique. The service of metrological standard for 

thermal diffusivity measurements of thin films using this method started in 2006 and 

reference thin film was developed in 2009. NMIJ/AIST is engaged in not only 

metrological standards, but also in standardization of the measurement method, 

technology transfer, and construction of database. Throughout these activities, NMIJ 

will help thermal management and accelerate innovation in advanced industries in 

Japan. 

Thermoelectric and Thermophysical Metrology for Energy 

Conversion Applications 

Joshua Martin, Ceramics Division, Materials Science and Engineering Laboratory, 

National Institute of Standards and Technology 

Thermoelectric phenomena enable the solid-state inter-conversion of thermal and 

electrical energy. While the low conversion efficiency of thermoelectric devices 

limits their widespread commercial practicality to niche applications, they remain an 

integral component in NASA’s radioisotope thermoelectric generators (RTG’s) for 

deep space power generation, small-scale waste-heat recovery devices, temperature 

measurement, and electronic refrigeration. In addition, thermoelectric devices are 

environmentally friendly, require minimal maintenance (no moving parts), and 

reliably offer quiet and compact operation. The continued development of new 

thermoelectric materials for high temperature power conversion applications requires 

reliable and accurate characterization of the electrical and thermal transport properties 

on a wide variety of material systems. To address these challenges, we have 

developed an integrated suite of advanced instrumentation to measure both 

thermoelectric and thermophysical properties on bulk and thin film materials. These 

include custom tools to screen candidate material systems using combinatorial 

approaches (for resistivity, the Seebeck coefficient, and thermal effusivity) and a 

novel high temperature probe for the evaluation of thermoelectric properties on bulk 

materials. This talk will provide an overview of our apparatus design and 
instrumentation, with emphasis on the techniques required to effectively manage 

uncertainty in thermoelectric measurements. 

Nano-hardness and Hardness Standards 

Koichiro Hattori, Acoustics and Vibration Metrology Division, National Metrology 

Institute of Japan, National Institute of Advanced Industrial Science and Technology 

(NMIJ-AIST) 

Instrumented indentation test (IIT) is widely used to measure the local hardness and 

elastic modulus with shallow indentation depth. In the IIT, indenter penetration 

process is monitored, and obtained force-depth curve is analyzed with using some 

methods. ISO 14577 determines the analysis method for some of hardness such as HIT

and HM, and also Indentation modulus. Main uncertainty sources are area function of 

indenter, contact point determination, frame stiffness, and the method used to analysis. 

Area function and its uncertainty is the most effective source of uncertainty, however, 

it depending on the reference used to calibration. The cause of it is that, the contact 

point is determined by some stiffness change at contact, contact point correction 

method is not detailed in the ISO, elast-plastic model used to calibration is too simple 

or arbitrary. 

We have studied the contact point correction method with thin low-k films on silicon 

substrate as a sample. We found that the back-calculation by using Hertz theory is 

effective for soft low-k sample. Unfortunately, it is one of example, which is 

depending on the mechanical properties of sample. IIT is also one of typical industrial 

standards, that needs the unification of methods to determine the reference values. So 

we need the cooperation between NIST and AIST to harmonization the nano-hardness 

measurements. 
S3-1 Form and Dimension

AFM Probe Characterization 

Hiroshi Itoh, Research Institute of Instrumentation Frontier, AIST National Institute of 

Advanced Industrial Science and Technology 

Cantilever with sharp tip is one of the key components of atomic force microscope 

(AFM), and it is the origin of artifacts in the AFM images. A probe characterizer for 

atomic force microscope (AFM) was developed to analyze the accurate probe-shape 

and to know the resolution of each cantilever. A reference material, which includes 

accurate lines and spaces, was developed using multilayer-thin films [1]. Lines and 

spaces ranging 3nm 70nm were fabricated using Si and SiO2 multi-layers. Combshape grating with 30nm calibration grating was developed for correcting AFM 

images. Apparent probe shapes can be determined under various experimental 

parameters, and actual probe shape can be obtained under optimized set-points of 

force and feedback parameters. When rigid probes, such as carbon-nanotube probes, 

carbon-fiber probes and diamond probes, are used with probe characterizer, reliability 

of AFM images can be improved significantly. 

[1] H. Itoh, T. Fujimoto, S. Ichimura: Rev. Sci. Instrum. 77, 103704 (2006). 

Traceable AFM Dimensional Metrology at NIST: Applications and 

Areas of Collaboration 

Ndubuisi Orji, Precision Engineering Division, Manufacturing Engineering 

Laboratory, National Institute of Standard and Technology 

The talk will give an overview of the NIST traceable AFM dimensional metrology 

program. Our activities focus around AFM metrology with direct traceability to the 

SI definition of the meter using displacement interferometry. An instrument, known as 

the calibrated- atomic force microscope (C-AFM), supports applications in the optics, 

semiconductor, and other industries. It is also used to calibrate samples for standards 

suppliers and internal NIST customers. One of the on-going activities in this area is 

the development of a new traceable atomic force microscope. We will highlight some 

of the intended uses of this instrument. 

Another thrust of the group focuses specifically on applications in the semiconductor 

industry. Work in this area includes developing measurement procedures using a 

critical dimension atomic force microscope (CD-AFM), standards development, and 

tip characterization techniques. In this presentation, the goals of the two main areas 

will be described. We will highlight key strategic collaborations with industry, and 

other NMIs. Such collaborations include standards development, interlaboratory 

comparisons, and instrument development. We will also describe some of our 

activities together, and possible areas for continued work. 
Development of Metrological AFMs and Nanometer-scale Standards 

Satoshi Gonda, Length and Dimensions Division, National Metrology Institute of 

Japan, National Institute of Advanced Industrial Science and Technology 

Atomic force microscopes (AFMs) are widely used to measure surface form like the 

thickness and nano-roughness which are necessary items to control the quality of 

nanotechnology product. Although certified reference materials made of silicon or 

quartz with the size of more than 10 nanometers are available, those with the size of 

single or a few nanometers are not available at present. Atomic step and terrace 

structure developed at single crystal surface of specific materials could be intrinsic 

standard of step height, because the step height is expected to be consistent with the 

lattice constant. It is, however, still necessary to verify real atomic step height with 

traceable and dimensional measurement, because there might be shift length due to 

possible surface strain. 

NMIJ’s metrological AFMs have demonstrated SI-traceable measurements of 

nanometer-scale dimensional standards. We will discuss how a metrological AFM can 

be used to ‘calibrate’ atomic fine structure. Key technologies to link nanometer-scale 

dimension to the unit of length will be mentioned. 
S3-2 Nano-carbon Materials, Carbon Nanotubes and 

Fullerenes 

Selective Extraction and Properties of Semiconducting Carbon 

Nanotubes 

Said Kazaoui, Nanotube Research Center, National Institute of Advanced Industrial Science 

and Technology

Semiconducting single-walled carbon nanotubes (s-SWNTs) are very promising 

materials in nanotechnology (transistors) and energy (photoactive material in solar 

cells). To fulfill such expectation, we have recently developed a technique to 

selectively extract very high purity and well defined s-SWNTs, without metallic 

nanotubes and catalyst using as-synthesized SWNTs. S-SWNTs were extracted using 

polyfluorene in toluene solution assisted by ultrasonication and ultracentrifugation 

techniques. 

We observed that aggregation/agglomeration of s-SWNTs influence the extraction 

yield, the solubility (polymer/organic solvent) and the optical properties 

(photoluminescence, photoconductivity). DLS method has revealed that s-SWNTs 

dispersion (mean-size ~30nm) aggregates (mean-size ~1mm) within few hours. 

Therefore, it is essential to investigate the aggregation/agglomeration mechanisms, to 

establish method to simply/reliably evaluate their state and to work toward 

international standardization. In this context the collaboration with NIST is essential. 

Optical Methods to Probe Stable Carbon Nanotube Dispersions and 

pH-induced Aggregation of Nanoparticles 

Vivek M. Prabhu, Polymers Division, Materials Science and Engineering Laboratory, 

National Institute of Standard and Technology 

The talk will give an overview of the Complex Fluids Group in the Materials Science 

and Engineering Laboratory at NIST with highlights from the Nanoparticle Assembly 

Project. Of current interest is the characterization of transport properties of 

nanoparticles when dispersed in aqueous solutions. The first part of the talk will 

describe efforts to develop fluorescence correlation spectroscopy (FCS) to 

characterize the transport properties of dispersed single-walled carbon nanotubes 

(CNT) in aqueous solutions. The intrinsic band-gap luminescence in the near-infrared 

enabled high-resolution measurements of the segmental dynamics by analysis of the 

autocorrelation function for semi-flexible rods. The methodology was applied to (6,5) 

CNT and can be extended to different chirality and diameter CNT, dispersion agents, 

and alternative solvents. This work builds upon the efforts of NIST to develop 

SWCNT reference materials. 

Nanoparticles are also a centerpiece to Health Care due to the similarity of 

interactions and size with natural nanoparticle proteins. The uptake of synthetic 

nanoparticles by different cellular compartments with disparate pH and salt conditions 

will influence nanoparticle interactions. How rapid changes in cellular environment 

influence the stability of nanoparticle dispersions is necessary for design of new 
materials, as well as classify hazards. We use dynamic light scattering to characterize 

the stability and initial stages of the kinetics of nanoparticle aggregation. This process 

was conveniently initiated by a ultraviolet light-induced pH jump. The nanoparticle 

aggregation kinetics was extremely sensitive to the solution pH and we find that the 

ultraviolet-light exposure dose is inversely correlated to the surface charge of the 

nanoparticles, effectively decreasing the electrostatic repulsion force between 

particles and leading to aggregation. 

Physicochemical Characterization of Engineered Nanoparticles: The 

measurands that influence Nano EHS 

Gerald Fraser, Optical Technology Division, Physics Laboratory, National Institute of 

Standard and Technology

From work ongoing with ISO/TC 229 a number of parameters have been identified as 

critical for characterization of nanomaterials prior to toxicological assessment. 

Through a consensus process within a Joint Task Group under the committee, these 

parameters have been assigned measurands-the quantity that is intended be measuredto aid the toxicologists in their assessments. These measurands have also been 

assigned measurement methods and appropriate caveats to consider when working in 

the nano regime. NIST is incorporating these terms, measurands and measurement 

methods into our Nano EHS program and is looking to establish collaborations to 

reduce measurement uncertainty and increase comparability of toxicological studies 

in order to rigorously establish connections between physicochemical properties and 

toxicological response.