National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 1

CHIPS for America 

Research and Development Program

Presented by Jason Boehm and Eric Lin 

October 2022
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 2

WELCOME

• We look forward to your questions. Click the Q&A button, 

type your question, and click “Post Question” to submit.

• We will answer as many questions as possible today. 

• Visit CHIPS.gov 

• Get the strategy paper 

• Sign up for email updates
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 3

Jason Boehm

Chief of Staff

National Institute of Standards and Technology

CHIPS for America Vision
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 4

Chips are the 

foundation of the 

modern world
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Chips were invented in America

But most chips are made outside of the U.S.

Logic chip production by country, 2021 Memory chip production by country, 2021
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 6

The CHIPS and Science 

Act 

of 2022 

The CHIPS and 

Science Act 

of 2022 
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 7

CHIPS for America Vision

Economic 

Security

This act enables us to build 

more resilient supply chains 

for important components.

National 

Security

This act enables us to bring 

the most sophisticated 

technologies back to the 

U.S.

Future 

Innovation

Chips are key to the 

technologies and industries 

of the future, so we need to 

be at the forefront. This act 

will ensure long-term U.S. 

leadership in the sector.
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 8

Together with 

CHIPS 

initiatives from 

other agencies, 

including DOD, 

State, NSF, 

and Treasury

CHIPS for America Incentives

$39 billion for manufacturing

Two component programs:

1. Attract largescale investments in 

advanced technologies 

such as leading-edge logic 

and memory

2. Incentivize expansion 

of manufacturing capacity 

for mature and other types 

of semiconductors

$11 billion for R&D

• National Semiconductor 

Technology Center

• National Advanced 

Packaging Manufacturing 

Program

• Manufacturing USA 

institute(s)

• National Institute of 

Standards and Technology 

measurement science

Workforce development
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 9

Manufacturing incentives 

will spur:

Manufacturing capacity for

• Mature and current-gen chips

• New and specialty technologies

• Suppliers to the industry

Large-scale investments in 

leading-edge logic and memory 

manufacturing clusters
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 10

R&D funding will spur:

R&D collaborations between 

academia and industry 

A domestic infrastructure for 

research and prototyping 

innovations

Workforce development and 

training
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 11

Guiding Principles

Meet economic and national security needs

Ensure long-term leadership in the sector

Strengthen and expand regional clusters

Catalyze private sector investment

Generate benefits for a range of stakeholders and communities

Protect taxpayer dollars
N ational Institute of S tandar ds and Techno l o gy | U .S . Departm e n t of C ommerce 17

Summer 

2022

Fall 

2022

Winter 

2023

Spring 

2023

Summer 

2023

Fall 

2023

Winter 

2024

CHIPS & Science Act of 

2022 passed into law and 

signed by President Biden

CHIPS for America is 

launched with EO on the 

implementation of CHIPS 

and Science Act of 2022

A Strategy for the CHIPS 

for America Fund released

CHIPS Program Office 

(CPO) and CHIPS R&D 

Office are founded, senior 

leadership announced

CHIPS webinars and briefings

IAC members 

announced

Funding application process 

released; Rolling 

applications begin

Timeline

We’re just 

getting 

started... 

*Timeline is tentative

Review, Due Diligence & Funding
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Accountability

Projects must be economically viable and compatible with strategy

Beneficiaries must meet performance, reporting, audit, and oversight requirements

Beneficiaries may not send funded technology abroad or engage with countries of concern

Workers on funded construction projects to earn prevailing wages

Priority to programs that engage a diversity of participants

Public funds cannot be used for stock buybacks or dividend payments

Funds to be returned if taxpayer funds are misused
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 14

Eric Lin

Interim Director

CHIPS R&D Office

CHIPS for America

Research and Development
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 15

R&D Ecosystem Gaps

Facilities and 

equipment

Advanced 

packaging and 

testing

Metrology and 

characterization

Advanced 

manufacturing

Workforce 

development
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 16

Research & Development

National 

Semiconductor 

Technology Center

National Advanced 

Packaging 

Manufacturing 

Program

Manufacturing USA 

institutes 

(up to three)

Metrology R&D 

(NIST)

• To strengthen and advance 

U.S. leadership in R&D

• An integrated ecosystem 

that drives innovation

• In partnership with industry, 

academia, government, and 

allies

• Informed by the Industrial 

Advisory Committee 
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NATIONAL SEMICONDUCTOR

TECHNOLOGY CENTER

• A center of excellence to drive semiconductor innovation

• Public-private consortium to include academia

• Program areas to include:

• Research and prototyping

• Investment fund

• Workforce development
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NATIONAL ADVANCED PACKAGING 

MANUFACTURING PROGRAM

• To expand and grow U.S. capacity in advanced 

packaging

• Capture available market share in packaging revenue

• Pilot facility for testing and integration of new processes

• A network of public private partnerships with 

universities, industry, and other government agencies 

focused on a range of issues including:

• Substrate technology

• Heterogeneous integration

• Wafer and panel-based approaches

• Tooling and automation
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 19

NIST METROLOGY R&D

• Measurement science for new materials and packaging

• Physical metrology for next-generation microelectronics

• Computation and data

• Virtualization and automation

• Reference materials and data, and calibrations

• Standards for processes, cybersecurity, and test 

methods

https://nvlpubs.nist.gov/nistpubs/

CHIPS/NIST.CHIPS.1000.pdf
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 20

Metrology Grand Challenges

Metrology for materials purity and properties

Future microelectronics manufacturing

Advanced packaging

Security of devices across the supply chain

Modeling and simulating semiconductor materials, designs and components

Improve the manufacturing process

Standardize new materials, processes and equipment
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 21

MANUFACTURING USA INSTITUTE(S)

• At least one new public-private partner institute in the 

Manufacturing USA network

• To advance research and commercialization of 

semiconductor manufacturing technologies

• Pre-competitive collaboration among researchers and 

manufacturers

• Virtualization, simulation, and automation

• Workforce training
22

Institutes Address the “Scale-Up” Gap

Readiness Levels (1-10)

Source: GAO analysis of data provided by Manufacturing USA institutes. | GAO-22-103979
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Manufacturing USA Network Today
Published October 13, 2022

Comments close on Nov 28

Request for Information (RFI)

24

https://www.federalregister.gov/documents/2022/10/13/2022-22221/

manufacturing-usa-semiconductor-institutes
Three public webinars scheduled

• October 20, 2022 1:00 PM - 2:00 PM ET

• November 2, 2022 11:00 AM - 12:00 PM ET

• November 16, 2022 2:00 PM - 3:00 PM ET

Register at https://www.nist.gov/oam/manufacturing-usa-semiconductor-institute-rfi

RFI Informational Webinars

25
26

Manufacturing USA: We Want Your Input

RFI open from Oct. 13, 2022 – Nov. 28, 2022

Provide comments at www.regulations.gov 

enter NIST-2022-0002 in the search field

Email us at MfgRFI@nist.gov

“RFI Response: Manufacturing USA semiconductor institutes” in the subject line
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 27

INDUSTRIAL ADVISORY COMMITTEE 

ADVISES THE SECRETARY OF COMMERCE ON

• The science and technology needs of the nation’s 

domestic microelectronics industry

• The national strategy on microelectronics research

• The research and development programs and other 

advanced microelectronics activities funded through 

CHIPS for America 

• Opportunities for new public-private partnerships

DOES NOT ADVISE ON

• The CHIPS incentives program
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Mike Splinter

Chair

MRS Business 

and Technology

Advisors

Susan Feindt

Vice-Chair

Analog 

Devices

Ken Joyce

Brewer 

Science

James Ang

Pacific 

Northwest 

National 

Laboratory

Daniel 

Armbrust

Silicon 

Catalyst

Susie 

Armstrong

Qualcomm

Ahmad 

Bahai

Texas 

Instruments

Bill Chappell

Microsoft

Michael Fritze

Potomac 

Institute for 

Policy Studies

Charles Gray

Ford Motor 

Company

Carol 

Handwerker

Purdue 

University

Deirdre 

Hanford

Synopsys

Rajarao

Jammy

MITRE 

Engenuity

Ann Kelleher

Intel 

Corporation

Mukesh 

Khare

IBM 

Research

Meredith 

LaBeau

Calumet 

Electronics

Tsu-Jae King 

Liu

University of 

California 

Berkley

Om 

Nalamasu

Applied 

Materials

Debo 

Olaosebikan

Kepler 

Computing

Willy Shih

Harvard 

Business 

School

Brandon 

Tucker

Washtenaw 

Community 

College

H.S. Philip 

Wong

Stanford 

University

Anthony Yen

ASML 

Technology 

Center

Alex 

Oscilowski

TEL America

Ecosystem/

Industry Customers Academia/Other Stakeholders

IAC Members
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Stay Engaged

• R&D next steps

• NSTC White Paper expected no sooner 

than February 2023

(6 months from enactment)

• Additional steps to be shared after that

• Learn more

• Visit CHIPS.gov

• Read the Implementation Strategy

• Join our mailing list
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 30

Question and Answers
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 31

Q&A function on the righthand side of your screen. 
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 32

Click the Q&A button, type out your question, and click “Post Question”. 

Q&A Button
National Institute of Standards and Technolog y | U.S. Departme nt of Commerce 33

Thank you for attending