The NanoFab

Vincent Luciani

NanoFab Manager
NanoFab Overview

Providing researchers world-wide customized processing 

tools for nanoscale fabrication and measurement on a 

shared-use, cost-reimbursable basis through a 

straightforward application process designed to get users 

into the facility in a few weeks.

 NanoFab Staff: 12

Process Engineers: 7 Process Technicians: 1

Administrative Support: 2 Equipment Technicians: 2

 19,000 ft2 cleanroom; 8,000 ft2 at class 100

 Advanced Nanofabrication and Metrology tools

 Additional shared-use tools outside the cleanroom

2
Outline

 Expertise

 Environment

 Tools

 Processes

 Accessibility

 Continuous Improvement

 Outreach

3
NanoFabrication Expertise

 Provide One-On-One Expert Training on Tools

 Ongoing Process Development Consulting to all users

 Over 170 Years of Process Development Experience on Staff

 Process Development Services 

 Fee Based NIST

CNST Research

NanoFab 

Operations 

Group

• Vast measurement 

science knowledgebase

• Spanning many 

technologies and 

industries

• Nanotechnology 

Scientists

• Across many facets of 

Nanotechnology

• Tool and Process 

Experts

• Experienced Process 

Engineers

 Vast Technical 

Resources to draw 

on as needed

4
The NanoFab Environment

 19,000 ft Cleanroom; 8,000 ft2 at class 100

 Raised Floor Vertical Laminar Airflow 

 Tight temperature control facilitates advanced 

processes and tools

 0.25oF Temperature Control

 2.0% Relative Humidity Control

 State-of-the-art Deionized Water Generation Plant

 Compatible with Substrate Sizes up to 150 mm dia.

 Automatic Hazardous Gas Monitoring

 Direct connection to NIST firehouse

 Multi-Camera CCTV Monitoring

 Coral Software Used for Account Tracking

5
NanoFab Tools

 Thin Films

 Sputter Deposition

 1 sputter tool dedicated to magnetic materials

 E-beam Evaporation

 Thermal Evaporation

 LPCVD

 PECVD

 Including bio-compatible Parylene

 Spin-On-Glass

 Oxidation

6
NanoFab Tools

 Reactive Ion Etching

 ICP, chlorine based metal etcher

 Deep-RIE for high aspect ratio etching

 An invaluable tool for MEMS research

 2ea Fluorine Based Multipurpose systems

 Supports research of new RIE processes

 XeF2 for rapid isotropic silicon etching

 Microwave Oxygen Asher

more RIE to come

7
NanoFab Tools

 Lithography

 Vistec VB300 E-Beam Lithography

 MA6 Front/Backside Contact Aligner

 MA8 Frontside Contact Aligner

 Nano-imprint Lithography

 Laser Pattern Generator

8
NanoFab Tools

 Metrology

 Stress Measurement Tool: Toho Technology FLX-2320

 Table-top SEM: Hitachi TM-1000 

 Scanning Electron Microscope: Zeiss Ultra-60 FESEM

 Atomic Force Microscope: Veeco Dimension 3100 

 Atomic Force Microscope: Digital Instruments/Veeco

 Dimension 3000 Contact Angle Goniometer

 Spectroscopic Ellipsometer: Woollam XLS-100

 Nanospec Reflectometer

 Nanometrics Contact Profilometer: Dektak 6M 

9
Accessibility

 The Registration Process is Straight Forward

 Forms are available on web page

 An interactive process promotes success

Submit 

Project 

Information 

Form

CNST Team 

Reviews 

Project Plan 

for safety and 

feasibility

Safety 

Training

w/exam Arrange 

Funding

CNST and 

project 

team 

discuss 

plan

Discuss 

Project with 

NanoFab 

Manager

NanoFab 

User 

Registration

/Badging

10
NanoFab Process Development

E-beam 

Lithography 

Process EBL001

E-beam 

Lithography 

Process EBL002

E-beam 

Lithography 

Process EBL003

E-beam 

Lithography 

Process EBL004

Photolith

Process CPL001

Photolith

Process CPL002

Photolith

Process CPL003

Photolith

Process CPL004

Metal Dep

Recipe SPT001

Metal Dep

Recipe SPT002

Metal Dep

Recipe SPT003

Metal Dep

Recipe SPT004

Building Blocks for 

Nanotechnology 

Development

11
Established Processes Facilitate Success

E-beam 

Lithography 

Process EBL001

E-beam 

Lithography 

Process EBL002

E-beam 

Lithography 

Process EBL003

E-beam 

Lithography 

Process EBL004

Photolith

Process CPL001

Photolith

Process CPL002

Photolith

Process CPL003

Photolith

Process CPL004

Metal Dep

Recipe SPT001

Metal Dep

Recipe SPT002

Metal Dep

Recipe SPT003

Metal Dep

Recipe SPT004

Micro-scale Gas Sensor

Dr. Yaqub Afridi NIST/SED

Magnetic Nanostructures

Prof. Sungho Jin UCSD Dr. Wenyong Wang NIST/SED

SEM image of the test 

pattern

50nm

NIST

Nanopore Device for Molecular 

Transport Measurement

NanoImprint 

Technology

Hyun Wook Ro NIST/

12
Setting New Standards in 

Nanotechnology

13

 Patterned HSQ Resist on Silicon 

 NIST/SEMATECH 

Project to create AFM 

Standards
Continuous Improvement

 New Capabilities

 JEOL JBX 6300FS E-Beam writer 4/2009

 Provides needed capacity of E-Beam Lithography

 Back up for this vital capability

 Oxford Atomic Layer Deposition System 4/2009

 2 more Oxford Multipurpose RIE Systems 4/2009

 Both are ICP systems with 12 gas input channels

 Cryo and heated substrate capability

 Nanometrics 6100 Reflectometer 3Q2009

 Improved Systems

 New Web based Project Registration 3Q2009

 Coral Based Tool Interlocks 4/2009

14
Ready for Prime Time

 The Time is right to launch Operation Outreach

 The Tool set in the NanoFab is nearing Completion

 The clean room environment has stabilized

 Staffing is complete

 Baseline Processes are in place

 We have studied our Role Models

 Established working relationships

15

CNST 

NanoFab

Cornell Berkeley

Princeton

Stanford

Univ. of 

MD.

Departm

ent of 

Energy
NanoFab Operation Outreach

Making Our Presence Known is Key to our Success

 Increased Presence at Conferences/Trade Shows

 2 Open houses planned for Q3 and Q4

 Nanofabrication Workshop in Q3

 Working with Local Tech Councils and Users Groups

 Aggressive outreach within NIST

 New Database being developed to track and maintain 

growth

16
Helping the US Make 

Measured Progress in

Nanotechnology

Outreach Tools

Continuous Expertise Improvement

Processes

Accessibility

Environment

NanoFab Summary

17