# Patent

## Title
Method of adhering wire bond loops to reduce loop height

## Abstract

A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, by mounting the integrated circuit die such that the contact pad is spaced from the conductor, positioning an adhesive surface between the contact pad and the conductor on the printed circuit board, attaching wire to one of the contact pad or the conductor, drawing the wire towards the other of the contact pad or the conductor, allowing the wire to contact the adhesive surface, and, attaching the wire to the other of the contact pad of the conductor to form a wire bond adhered to the adhesive surface and a point intermediate its ends.

## Background
CROSS REFERENCES TO RELATED APPLICATION
The present application is a Continuation-In-Part of U.S. Ser. No. 11/860,539, filed Sep. 25, 2007, the contents of which are incorporated herein by cross reference.


FIELD OF THE INVENTION
The invention relates to the field of integrated circuits. In particular, the invention is directed to the wire bonds between a circuit board and the contact pads on the integrated circuit die.
CO-PENDING APPLICATIONS
The following application has been filed by the Applicant simultaneously with the present application:

    
    
        12046451 12046452 12046453
    
    


The disclosure of this co-pending application is incorporated herein by reference.
CROSS REFERENCES
Various methods, systems and apparatus relating to the present invention are disclosed in the following US Patents/Patent Applications filed by the applicant or assignee of the present invention.


















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11/124,151
11/124,160
11/124,192
11/124,175
11/124,163
11/124,149


11/124,152
11/124,173
11/124,155
7,236,271
11/124,174
11/124,194
11/124,164


11/124,200
11/124,195
11/124,166
11/124,150
11/124,172
11/124,165
11/124,186


11/124,185
11/124,184
11/124,182
11/124,201
11/124,171
11/124,181
11/124,161


11/124,156
11/124,191
11/124,159
11/124,176
11/124,188
11/124,170
11/124,187


11/124,189
11/124,190
11/124,180
11/124,193
11/124,183
11/124,178
11/124,177


11/124,148
11/124,168
11/124,167
11/124,179
11/124,169
11/187,976
11/188,011


11/188,014
11/482,979
11/735,490
11/853,018
11/944,450
12/023,815
12/035,414


11/228,540
11/228,500
11/228,501
11/228,530
11/228,490
11/228,531
11/228,504


11/228,533
11/228,502
11/228,507
11/228,482
11/228,505
11/228,497
11/228,487


11/228,529
11/228,484
11/228,489
11/228,518
11/228,536
11/228,496
11/228,488


11/228,506
11/228,516
11/228,526
11/228,539
11/228,538
11/228,524
11/228,523


11/228,519
11/228,528
11/228,527
11/228,525
11/228,520
11/228,498
11/228,511


11/228,522
11/228,515
11/228,537
11/228,534
11/228,491
11/228,499
11/228,509


11/228,492
11/228,493
11/228,510
11/228,508
11/228,512
11/228,514
11/228,494


11/228,495
11/228,486
11/228,481
11/228,477
11/228,485
11/228,483
11/228,521


11/228,517
11/228,532
11/228,513
11/228,503
11/228,480
11/228,535
11/228,478


11/228,479
12/035,419
6,238,115
6,386,535
6,398,344
6,612,240
6,752,549


6,805,049
6,971,313
6,899,480
6,860,664
6,925,935
6,966,636
7,024,995


7,284,852
6,926,455
7,056,038
6,869,172
7,021,843
6,988,845
6,964,533


6,981,809
7,284,822
7,258,067
7,322,757
7,222,941
7,284,925
7,278,795


7,249,904
11/737,726
11/772,240
11/863,246
11/863,145
11/865,650
6,087,638


6,340,222
6,041,600
6,299,300
6,067,797
6,286,935
6,044,646
6,382,769


6,787,051
6,938,990
11/242,916
11/144,799
11/198,235
11/861,282
11/861,284


11/766,052
7,152,972
11/592,996
D529952
6,390,605
6,322,195
6,612,110


6,480,089
6,460,778
6,305,788
6,426,014
6,364,453
6,457,795
6,315,399


6,338,548
7,040,736
6,938,992
6,994,425
6,863,379
6,540,319
6,994,421


6,984,019
7,008,043
6,997,544
6,328,431
6,991,310
10/965,772
7,140,723


6,328,425
6,982,184
7,267,423
7,134,741
7,066,577
7,152,945
7,303,689


7,021,744
6,991,320
7,155,911
11/107,799
6,595,624
7,152,943
7,125,103


7,328,971
7,290,857
7,285,437
7,229,151
11/330,058
7,237,873
11/329,163


11/442,180
11/450,431
7,213,907
6,417,757
11/482,951
11/545,566
11/583,826


11/604,315
11/604,323
11/643,845
11/706,950
11/730,399
11/749,121
11/753,549


11/834,630
11/935,389
11/869,670
7,095,309
11/945,157
11/957,473
11/967,235


12/017,896
6,854,825
6,623,106
6,672,707
6,575,561
6,817,700
6,588,885


7,075,677
6,428,139
6,575,549
6,846,692
6,425,971
7,063,993
6,383,833


6,955,414
6,412,908
6,746,105
6,953,236
6,412,904
7,128,388
6,398,343


6,652,071
6,793,323
6,659,590
6,676,245
7,201,460
6,464,332
6,659,593


6,478,406
6,978,613
6,439,693
6,502,306
6,966,111
6,863,369
6,428,142


6,874,868
6,390,591
6,799,828
6,896,358
7,018,016
10/296,534
6,328,417


6,322,194
6,382,779
6,629,745
6,565,193
6,609,786
6,609,787
6,439,908


6,684,503
6,843,551
6,764,166
6,561,617
10/510,092
6,557,970
6,546,628


10/510,098
6,652,074
6,820,968
7,175,260
6,682,174
7,303,262
6,648,453


6,834,932
6,682,176
6,998,062
6,767,077
7,278,717
6,755,509
10/534,813


6,692,108
10/534,811
6,672,709
7,303,263
7,086,718
10/534,881
6,672,710


10/534,812
6,669,334
7,322,686
7,152,958
7,281,782
6,824,246
7,264,336


6,669,333
10/534,815
6,820,967
7,306,326
6,736,489
7,264,335
6,719,406


7,222,943
7,188,419
7,168,166
6,974,209
7,086,719
6,974,210
7,195,338


7,252,775
7,101,025
11/474,281
11/485,258
11/706,304
11/706,324
11/706,326


11/706,321
11/772,239
11/782,598
11/829,941
11/852,991
11/852,986
11/936,062


11/934,027
11/955,028
12/034,578
12/036,908
11/763,440
11/763,442
11/246,687


11/246,718
7,322,681
11/246,686
11/246,703
11/246,691
11/246,711
11/246,690


11/246,712
11/246,717
11/246,709
11/246,700
11/246,701
11/246,702
11/246,668


11/246,697
11/246,698
11/246,699
11/246,675
11/246,674
11/246,667
11/829,957


11/829,960
11/829,961
11/829,962
11/829,963
11/829,966
11/829,967
11/829,968


11/829,969
11/946,839
11/946,838
11/946,837
11/951,230
7,156,508
7,159,972


7,083,271
7,165,834
7,080,894
7,201,469
7,090,336
7,156,489
10/760,233


10/760,246
7,083,257
7,258,422
7,255,423
7,219,980
10/760,253
10/760,255


10/760,209
7,118,192
10/760,194
7,322,672
7,077,505
7,198,354
7,077,504


10/760,189
7,198,355
10/760,232
7,322,676
7,152,959
7,213,906
7,178,901


7,222,938
7,108,353
7,104,629
11/446,227
11/454,904
11/472,345
11/474,273


7,261,401
11/474,279
11/482,939
7,328,972
7,322,673
7,306,324
7,306,325


11/603,824
11/601,756
11/601,672
7,303,261
11/653,253
11/706,328
11/706,299


11/706,965
11/737,080
11/737,041
11/778,062
11/778,566
11/782,593
11/934,018


11/945,157
11/951,095
11/951,828
11/954,906
11/954,949
11/967,226
7,303,930


11/246,672
11/246,673
11/246,683
11/246,682
60/939,086
11/860,538
11/860,539


11/860,540
11/860,541
11/860,542
11/936,060
11/877,667
11/877,668
7,246,886


7,128,400
7,108,355
6,991,322
7,287,836
7,118,197
10/728,784
10/728,783


7,077,493
6,962,402
10/728,803
7,147,308
10/728,779
7,118,198
7,168,790


7,172,270
7,229,155
6,830,318
7,195,342
7,175,261
10/773,183
7,108,356


7,118,202
10/773,186
7,134,744
10/773,185
7,134,743
7,182,439
7,210,768


10/773,187
7,134,745
7,156,484
7,118,201
7,111,926
10/773,184
7,018,021


11/060,751
11/060,805
11/188,017
7,128,402
11/298,774
11/329,157
11/490,041


11/501,767
7,284,839
7,246,885
7,229,156
11/505,846
11/505,857
7,293,858


11/524,908
11/524,938
7,258,427
11/524,912
7,278,716
11/592,995
11/603,825


11/649,773
11/650,549
11/653,237
11/706,378
11/706,962
11/749,118
11/754,937


11/749,120
11/744,885
11/779,850
11/765,439
11/842,950
11/839,539
11/926,121


12/025,621
11/097,308
11/097,309
7,246,876
11/097,299
11/097,310
11/097,213


7,328,978
7,334,876
7,147,306
7,261,394
11/764,806
11/782,595
11/965,696


12/027,286
11/482,953
11/482,977
11/544,778
11/544,779
11/764,808
11/756,624


11/756,625
11/756,626
11/756,627
11/756,628
11/756,629
11/756,630
11/756,631


7,156,289
7,178,718
7,225,979
11/712,434
11/084,796
11/084,742
11/084,806


09/575,197
09/575,197
7,079,712
7,079,712
6,825,945
6,825,945
7,330,974


7,330,974
6,813,039
6,813,039
7,190,474
6,987,506
6,987,506
6,824,044


7,038,797
7,038,797
6,980,318
6,980,318
6,816,274
6,816,274
7,102,772


7,102,772
09/575,186
09/575,186
6,681,045
6,681,045
6,678,499
6,679,420


6,963,845
6,976,220
6,728,000
6,728,000
7,110,126
7,173,722
7,173,722


6,976,035
6,813,558
6,766,942
6,965,454
6,995,859
7,088,459
7,088,459


6,720,985
7,286,113
6,922,779
6,978,019
6,847,883
7,131,058
7,295,839


09/607,843
09/693,690
6,959,298
6,973,450
7,150,404
6,965,882
7,233,924


09/575,181
09/575,181
09/722,174
7,175,079
7,162,259
6,718,061
10/291,523


10/291,471
7,012,710
6,825,956
10/291,481
7,222,098
10/291,825
7,263,508


7,031,010
6,972,864
6,862,105
7,009,738
6,989,911
6,982,807
10/291,576


6,829,387
6,714,678
6,644,545
6,609,653
6,651,879
10/291,555
7,293,240


10/291,592
10/291,542
7,044,363
7,004,390
6,867,880
7,034,953
6,987,581


7,216,224
10/291,821
7,162,269
7,162,222
7,290,210
7,293,233
7,293,234


6,850,931
6,865,570
6,847,961
10/685,523
10/685,583
7,162,442
10/685,584


7,159,784
10/804,034
10/793,933
6,889,896
10/831,232
7,174,056
6,996,274


7,162,088
10/943,874
10/943,872
10/944,044
7,259,884
10/944,043
7,167,270


10/943,877
6,986,459
10/954,170
7,181,448
10/981,626
10/981,616
7,324,989


7,231,293
7,174,329
10/992,713
7,295,922
7,200,591
11/020,106
11/020,260


11/020,321
11/020,319
11/026,045
11/059,696
11/051,032
11/059,674
11/107,944


11/107,941
11/082,940
11/082,815
11/082,827
11/082,829
6,991,153
6,991,154


11/124,256
11/123,136
11/154,676
7,322,524
11/182,002
11/202,251
11/202,252


11/202,253
11/203,200
11/202,218
11/206,778
11/203,424
11/222,977
7,327,485


11/227,239
11/286,334
7,225,402
11/329,187
11/349,143
11/491,225
11/491,121


11/442,428
11/454,902
11/442,385
11/478,590
7,271,931
11/520,170
11/603,057


11/706,964
11/739,032
11/739,014
7,336,389
11/830,848
11/830,849
11/839,542


11/866,394
11/934,077
11/951,874
12/015,487
12/023,860
12/023,005
12/036,266


7,068,382
7,068,382
7,007,851
6,957,921
6,457,883
10/743,671
7,044,381


11/203,205
7,094,910
7,091,344
7,122,685
7,038,066
7,099,019
7,062,651


7,062,651
6,789,194
6,789,194
6,789,191
6,789,191
10/900,129
7,278,018


10/913,350
10/982,975
10/983,029
11/331,109
6,644,642
6,644,642
6,502,614


6,502,614
6,622,999
6,622,999
6,669,385
6,669,385
6,827,116
7,011,128


10/949,307
6,549,935
6,549,935
6,987,573
6,987,573
6,727,996
6,727,996


6,591,884
6,591,884
6,439,706
6,439,706
6,760,119
6,760,119
7,295,332


7,295,332
7,064,851
6,826,547
6,290,349
6,290,349
6,428,155
6,428,155


6,785,016
6,785,016
6,831,682
6,741,871
6,927,871
6,980,306
6,965,439


6,840,606
7,036,918
6,977,746
6,970,264
7,068,389
7,093,991
7,190,491


10/901,154
10/932,044
10/962,412
7,177,054
10/962,552
10/965,733
10/965,933


10/974,742
10/982,974
7,180,609
10/986,375
11/107,817
7,292,363
11/149,160


11/206,756
11/250,465
7,202,959
11/653,219
11/706,309
11/730,389
11/730,392


60/953,443
11/866,387
60,974,077
6,982,798
6,870,966
6,870,966
6,822,639


6,822,639
6,474,888
6,627,870
6,724,374
6,788,982
7,263,270
6,788,293


6,946,672
6,737,591
6,737,591
7,091,960
09/693,514
6,792,165
7,105,753


6,795,593
6,980,704
6,768,821
7,132,612
7,041,916
6,797,895
7,015,901


7,289,882
7,148,644
10/778,056
10/778,058
10/778,060
10/778,059
10/778,063


10/778,062
10/778,061
10/778,057
7,096,199
7,286,887
10/917,467
10/917,466


7,324,859
7,218,978
7,245,294
7,277,085
7,187,370
10/917,436
10/943,856


10/919,379
7,019,319
10/943,878
10/943,849
7,043,096
7,148,499
11/144,840


11/155,556
11/155,557
11/193,481
11/193,435
11/193,482
11/193,479
7,336,267


11/281,671
11/298,474
7,245,760
11/488,832
11/495,814
11/495,823
11/495,822


11/495,821
11/495,820
11/653,242
11/754,370
60/911,260
11/829,936
11/839,494


11/866,305
11/866,313
11/866,324
11/866,336
11/866,348
11/866,359
11/970,951


12/036,264
7,055,739
7,055,739
7,233,320
7,233,320
6,830,196
6,830,196


6,832,717
6,832,717
7,182,247
7,120,853
7,082,562
6,843,420
10/291,718


6,789,731
7,057,608
6,766,944
6,766,945
7,289,103
10/291,559
7,299,969


7,264,173
10/409,864
7,108,192
10/537,159
7,111,791
7,077,333
6,983,878


10/786,631
7,134,598
10/893,372
6,929,186
6,994,264
7,017,826
7,014,123


7,134,601
7,150,396
10/971,146
7,017,823
7,025,276
7,284,701
7,080,780


11/074,802
7,334,739
11/749,158
11/842,948
12/015,477
12/025,746
12/025,747


12/025,748
12/025,749
12/025,750
12/025,751
12/025,754
12/025,756
12/025,757


12/025,759
12/025,760
12/025,761
12/025,762
12/025,764
12/025,765
12/025,766


12/025,767
12/025,768
10/492,169
10/492,152
10/492,168
10/492,161
7,308,148


10/502,575
10/531,229
10/683,151
10/531,733
10/683,040
10/510,391
10/919,260


10/510,392
10/778,090
11/944,404
11/936,638
12/031,615
6,957,768
6,957,768


09/575,172
09/575,172
7,170,499
7,170,499
7,106,888
7,106,888
7,123,239


7,123,239
6,982,701
6,982,703
7,227,527
6,786,397
6,947,027
6,975,299


7,139,431
7,048,178
7,118,025
6,839,053
7,015,900
7,010,147
7,133,557


6,914,593
10/291,546
6,938,826
7,278,566
7,123,245
6,992,662
7,190,346


11/074,800
11/074,782
11/074,777
11/075,917
7,221,781
11/102,843
7,213,756


11/188,016
7,180,507
7,263,225
7,287,688
11/737,094
11/753,570
11/782,596


11/865,711
12/036,904
11/856,061
11/856,062
11/856,064
11/856,066
11/672,522


11/672,950
11/672,947
11/672,891
11/672,954
11/672,533
11/754,310
11/754,321


11/754,320
11/754,319
11/754,318
11/754,317
11/754,316
11/754,315
11/754,314


11/754,313
11/754,312
11/754,311
12/015,507
12/015,508
12/015,509
12/015,510


12/015,511
12/015,512
12/015,513
6,593,166
7,132,679
6,940,088
7,119,357


7,307,272
6,755,513
6,974,204
6,409,323
7,055,930
6,281,912
6,893,109


6,604,810
6,824,242
6,318,920
7,210,867
6,488,422
6,655,786
6,457,810


6,485,135
6,796,731
6,904,678
6,641,253
7,125,106
6,786,658
7,097,273


6,824,245
7,222,947
6,918,649
6,860,581
6,929,351
7,063,404
6,969,150


7,004,652
6,871,938
6,905,194
6,846,059
6,997,626
7,303,256
7,029,098


6,966,625
7,114,794
7,207,646
7,077,496
7,284,831
11/072,529
7,152,938


7,182,434
7,182,430
7,306,317
7,032,993
7,325,905
11/155,545
11/144,813


7,172,266
7,258,430
7,128,392
7,210,866
7,306,322
11/505,933
11/540,727


11/635,480
11/707,946
11/706,303
11/709,084
11/730,776
11/744,143
11/779,845


11/782,589
11/863,256
11/940,302
11/940,235
11/955,359
12/019,583
12/019,566


12/036,910
11/066,161
11/066,160
11/066,159
11/066,158
7,287,831
11/875,936


12/017,818
6,804,030
6,807,315
6,771,811
6,683,996
7,271,936
7,304,771


6,965,691
7,058,219
7,289,681
7,187,807
7,181,063
11/338,783
11/603,823


11/650,536
12/025,633
10/727,181
10/727,162
10/727,163
10/727,245
7,121,639


7,165,824
7,152,942
10/727,157
7,181,572
7,096,137
7,302,592
7,278,034


7,188,282
10/727,159
10/727,180
10/727,179
10/727,192
10/727,274
10/727,164


10/727,161
10/727,198
10/727,158
10/754,536
10/754,938
10/727,227
10/727,160


10/934,720
7,171,323
7,278,697
11/442,131
11/474,278
11/488,853
7,328,115


11/749,750
11/749,749
11/955,127
11/951,213
10/296,522
6,795,215
7,070,098


7,154,638
6,805,419
6,859,289
6,977,751
6,398,332
6,394,573
6,622,923


6,747,760
6,921,144
10/884,881
7,092,112
7,192,106
11/039,866
7,173,739


6,986,560
7,008,033
11/148,237
7,222,780
7,270,391
7,150,510
11/478,599


11/499,749
11/521,388
11/738,518
11/482,981
11/743,662
11/743,661
11/743,659


11/743,655
11/743,657
11/752,900
11/926,109
11/927,163
11/929,567
7,195,328


7,182,422
11/650,537
11/712,540
10/854,521
10/854,522
10/854,488
7,281,330


10/854,503
10/854,504
10/854,509
7,188,928
7,093,989
10/854,497
10/854,495


10/854,498
10/854,511
10/854,512
10/854,525
10/854,526
10/854,516
7,252,353


10/854,515
7,267,417
10/854,505
10/854,493
7,275,805
7,314,261
10/854,490


7,281,777
7,290,852
10/854,528
10/854,523
10/854,527
10/854,524
10/854,520


10/854,514
10/854,519
10/854,513
10/854,499
10/854,501
7,266,661
7,243,193


10/854,518
10/854,517
10/934,628
7,163,345
7,322,666
11/601,757
11/706,295


11/735,881
11/748,483
11/749,123
11/766,061
11/775,135
11/772,235
11/778,569


11/829,942
11/870,342
11/935,274
11/937,239
11/961,907
11/961,940
11/961,961


11/014,731
D529081
D541848
D528597
6,924,907
6,712,452
6,416,160


6,238,043
6,958,826
6,812,972
6,553,459
6,967,741
6,956,669
6,903,766


6,804,026
7,259,889
6,975,429
10/636,234
10/636,233
7,301,567
10/636,216


7,274,485
7,139,084
7,173,735
7,068,394
7,286,182
7,086,644
7,250,977


7,146,281
7,023,567
7,136,183
7,083,254
6,796,651
7,061,643
7,057,758


6,894,810
6,995,871
7,085,010
7,092,126
7,123,382
7,061,650
10/853,143


6,986,573
6,974,212
7,307,756
7,173,737
10/954,168
7,246,868
11/065,357


7,137,699
11/107,798
7,148,994
7,077,497
11/176,372
7,248,376
11/225,158


7,306,321
7,173,729
11/442,132
11/478,607
11/503,085
11/545,502
11/583,943


11/585,946
11/653,239
11/653,238
11/764,781
11/764,782
11/779,884
11/845,666


11/872,637
11/944,401
11/940,215
11/544,764
11/544,765
11/544,772
11/544,773


11/544,774
11/544,775
11/544,776
11/544,766
11/544,767
11/544,771
11/544,770


11/544,769
11/544,777
11/544,768
11/544,763
11/293,804
11/293,840
11/293,803


11/293,833
11/293,834
11/293,835
11/293,836
11/293,837
11/293,792
11/293,794


11/293,839
11/293,826
11/293,829
11/293,830
11/293,827
11/293,828
7,270,494


11/293,823
11/293,824
11/293,831
11/293,815
11/293,819
11/293,818
11/293,817


11/293,816
11/838,875
11/482,978
11/640,356
11/640,357
11/640,358
11/640,359


11/640,360
11/640,355
11/679,786
11/872,714
10/760,254
10/760,210
10/760,202


7,201,468
10/760,198
10/760,249
7,234,802
7,303,255
7,287,846
7,156,511


10/760,264
7,258,432
7,097,291
10/760,222
10/760,248
7,083,273
10/760,192


10/760,203
10/760,204
10/760,205
10/760,206
10/760,267
10/760,270
7,198,352


10/760,271
7,303,251
7,201,470
7,121,655
7,293,861
7,232,208
7,328,985


10/760,261
7,083,272
7,261,400
11/474,272
11/474,315
7,311,387
11/583,874


7,303,258
11/706,322
11/706,968
11/749,119
11/749,157
11/779,848
11/782,590


11/855,152
11/855,151
11/870,327
11/934,780
11/935,992
11/951,193
12/017,327


12/015,273
12/036,882
11/014,764
11/014,763
7,331,663
11/014,747
7,328,973


11/014,760
11/014,757
7,303,252
7,249,822
11/014,762
7,311,382
11/014,723


11/014,756
11/014,736
11/014,759
11/014,758
11/014,725
7,331,660
11/014,738


11/014,737
7,322,684
7,322,685
7,311,381
7,270,405
7,303,268
11/014,735


11/014,734
11/014,719
11/014,750
11/014,749
7,249,833
11/758,640
11/775,143


11/838,877
11/944,453
11/944,633
11/955,065
12/003,952
12/007,818
12/007,817


12/071,187
11/014,769
11/014,729
7,331,661
11/014,733
7,300,140
11/014,755


11/014,765
11/014,766
11/014,740
7,284,816
7,284,845
7,255,430
11/014,744


7,328,984
11/014,768
7,322,671
11/014,718
11/014,717
11/014,716
11/014,732


11/014,742
11/097,268
11/097,185
11/097,184
11/778,567
11/852,958
11/852,907


11/872,038
11/955,093
11/961,578
12/022,023
12/023,000
12/023,018
12/031,582


12/043,708
11/293,820
11/293,813
11/293,822
11/293,812
11/293,821
11/293,814


11/293,793
11/293,842
11/293,811
11/293,807
11/293,806
11/293,805
11/293,810


11/688,863
11/688,864
11/688,865
11/688,866
11/688,867
11/688,868
11/688,869


11/688,871
11/688,872
11/688,873
11/741,766
12/014,767
12/014,768
12/014,769


12/014,770
12/014,771
12/014,772
12/014,773
12/014,774
12/014,775
12/014,776


12/014,777
12/014,778
12/014,779
12/014,780
12/014,781
12/014,782
12/014,783


12/014,784
12/014,785
12/014,787
12/014,788
12/014,789
12/014,790
12/014,791


12/014,792
12/014,793
12/014,794
12/014,796
12/014,798
12/014,801
12/014,803


12/014,804
12/014,805
12/014,806
12/014,807
61/034,147
11/482,982
11/482,983


11/482,984
11/495,818
11/495,819
11/677,049
11/677,050
11/677,051
11/872,719


11/872,718
61/033,357
7,306,320
11/934,781
D528156
10/760,180
7,111,935


10/760,213
10/760,219
10/760,237
7,261,482
10/760,220
7,002,664
10/760,252


10/760,265
7,088,420
11/446,233
11/503,083
11/503,081
11/516,487
11/599,312


6,364,451
6,533,390
6,454,378
7,224,478
6,559,969
6,896,362
7,057,760


6,982,799
11/202,107
11/743,672
11/744,126
11/743,673
7,093,494
7,143,652


7,089,797
7,159,467
7,234,357
7,124,643
7,121,145
7,089,790
7,194,901


6,968,744
7,089,798
7,240,560
7,137,302
11/442,177
7,171,855
7,260,995


7,260,993
7,165,460
7,222,538
7,258,019
11/543,047
7,258,020
11/604,324


7,334,480
11/706,305
11/707,056
11/744,211
11/767,526
11/779,846
11/764,227


11/829,943
11/829,944
12/015,390
12/031,475
6,454,482
6,808,330
6,527,365


6,474,773
6,550,997
7,093,923
6,957,923
7,131,724
10/949,288
7,168,867


7,125,098
11/706,966
11/185,722
7,249,901
7,188,930
11/014,728
11/014,727


D536031
D531214
7,237,888
7,168,654
7,201,272
6,991,098
7,217,051


6,944,970
10/760,215
7,108,434
10/760,257
7,210,407
7,186,042
10/760,266


6,920,704
7,217,049
10/760,214
10/760,260
7,147,102
7,287,828
7,249,838


10/760,241
10/962,413
10/962,427
7,261,477
7,225,739
10/962,402
10/962,425


10/962,428
7,191,978
10/962,426
10/962,409
10/962,417
10/962,403
7,163,287


7,258,415
7,322,677
7,258,424
10/962,410
7,195,412
7,207,670
7,270,401


7,220,072
11/474,267
11/544,547
11/585,925
11/593,000
11/706,298
11/706,296


11/706,327
11/730,760
11/730,407
11/730,787
11/735,977
11/736,527
11/753,566


11/754,359
11/778,061
11/765,398
11/778,556
11/829,937
11/780,470
11/866,399


11/223,262
11/223,018
11/223,114
11/955,366
7,322,761
11/223,021
11/223,020


11/223,019
11/014,730
D541849
29/279,123
6,716,666
6,949,217
6,750,083


7,014,451
6,777,259
6,923,524
6,557,978
6,991,207
6,766,998
6,967,354


6,759,723
6,870,259
10/853,270
6,925,875
10/898,214
7,095,109
7,145,696


10/976,081
7,193,482
7,134,739
7,222,939
7,164,501
7,118,186
7,201,523


7,226,159
7,249,839
7,108,343
7,154,626
7,079,292
10/980,184
7,233,421


7,063,408
10/983,082
10/982,804
7,032,996
10/982,834
10/982,833
10/982,817


7,217,046
6,948,870
7,195,336
7,070,257
10/986,813
10/986,785
7,093,922


6,988,789
10/986,788
7,246,871
10/992,748
10/992,747
7,187,468
10/992,828


7,196,814
10/992,754
7,268,911
7,265,869
7,128,384
7,164,505
7,284,805


7,025,434
7,298,519
7,280,244
7,206,098
7,265,877
7,193,743
7,168,777


11/006,734
7,195,329
7,198,346
7,281,786
11/013,363
11/013,881
6,959,983


7,128,386
7,097,104
11/013,636
7,083,261
7,070,258
7,083,275
7,110,139


6,994,419
6,935,725
11/026,046
7,178,892
7,219,429
6,988,784
11/026,135


7,289,156
11/064,005
7,284,976
7,178,903
7,273,274
7,083,256
7,325,986


7,278,707
7,325,918
6,974,206
11/064,004
7,066,588
7,222,940
11/075,918


7,018,025
7,221,867
7,290,863
7,188,938
7,021,742
7,083,262
7,192,119


11/083,021
7,036,912
7,175,256
7,182,441
7,083,258
7,114,796
7,147,302


11/084,757
7,219,982
7,118,195
7,229,153
6,991,318
7,108,346
11/248,429


11/239,031
7,178,899
7,066,579
11/281,419
20060087544
11/329,188
11/329,140


7,270,397
7,258,425
7,237,874
7,152,961
7,333,235
7,207,658
11/484,744


7,311,257
7,207,659
11/525,857
11/540,569
11/583,869
11/592,985
11/585,947


7,306,307
11/604,316
11/604,309
11/604,303
11/643,844
7,329,061
11/655,940


11/653,320
7,278,713
11/706,381
11/706,323
11/706,963
11/713,660
7,290,853


11/696,186
11/730,390
11/737,139
11/737,749
11/740,273
11/749,122
11/754,361


11/766,043
11/764,775
11/768,872
11/775,156
11/779,271
11/779,272
11/829,938


11/839,502
11/858,852
11/862,188
11/859,790
11/872,618
11/923,651
11/950,255


11/930,001
11/955,362
12/015,368
11/965,718
6,485,123
6,425,657
6,488,358


7,021,746
6,712,986
6,981,757
6,505,912
6,439,694
6,364,461
6,378,990


6,425,658
6,488,361
6,814,429
6,471,336
6,457,813
6,540,331
6,454,396


6,464,325
6,443,559
6,435,664
6,412,914
6,488,360
6,550,896
6,439,695


6,447,100
09/900,160
6,488,359
6,637,873
10/485,738
6,618,117
10/485,737


6,803,989
7,234,801
7,044,589
7,163,273
6,416,154
6,547,364
10/485,744


6,644,771
7,152,939
6,565,181
7,325,897
6,857,719
7,255,414
6,702,417


7,284,843
6,918,654
7,070,265
6,616,271
6,652,078
6,503,408
6,607,263


7,111,924
6,623,108
6,698,867
6,488,362
6,625,874
6,921,153
7,198,356


6,536,874
6,425,651
6,435,667
10/509,997
6,527,374
7,334,873
6,582,059


10/510,152
6,513,908
7,246,883
6,540,332
6,547,368
7,070,256
6,508,546


10/510,151
6,679,584
7,303,254
6,857,724
10/509,998
6,652,052
10/509,999


6,672,706
10/510,096
6,688,719
6,712,924
6,588,886
7,077,508
7,207,654


6,935,724
6,927,786
6,988,787
6,899,415
6,672,708
6,644,767
6,874,866


6,830,316
6,994,420
6,954,254
7,086,720
7,240,992
7,267,424
7,128,397


7,084,951
7,156,496
7,066,578
7,101,023
11/165,027
11/202,235
11/225,157


7,159,965
7,255,424
11/349,519
7,137,686
7,201,472
7,287,829
11/504,602


7,216,957
11/520,572
11/583,858
11/583,895
11/585,976
11/635,488
7,278,712


11/706,952
11/706,307
7,287,827
11/944,451
11/740,287
11/754,367
11/758,643


11/778,572
11/859,791
11/863,260
11/874,178
11/936,064
11/951,983
12/015,483


6,916,082
6,786,570
10/753,478
6,848,780
6,966,633
7,179,395
6,969,153


6,979,075
7,132,056
6,832,828
6,860,590
6,905,620
6,786,574
6,824,252


7,097,282
6,997,545
6,971,734
6,918,652
6,978,990
6,863,105
10/780,624


7,194,629
10/791,792
6,890,059
6,988,785
6,830,315
7,246,881
7,125,102


7,028,474
7,066,575
6,986,202
7,044,584
7,210,762
7,032,992
7,140,720


7,207,656
7,285,170
11/048,748
7,008,041
7,011,390
7,048,868
7,014,785


7,131,717
7,284,826
7,331,101
7,182,436
7,104,631
7,240,993
7,290,859


11/202,217
7,172,265
7,284,837
7,066,573
11/298,635
7,152,949
7,334,877


11/442,133
7,326,357
7,156,492
11/478,588
7,331,653
7,287,834
11/525,861


11/583,939
11/545,504
7,284,326
11/635,485
11/730,391
11/730,788
11/749,148


11/749,149
11/749,152
11/749,151
11/759,886
11/865,668
11/874,168
11/874,203


11/971,182
12/021,086
12/015,441
11/965,722
6,824,257
7,270,475
6,971,811


6,878,564
6,921,145
6,890,052
7,021,747
6,929,345
6,811,242
6,916,087


6,905,195
6,899,416
6,883,906
6,955,428
7,284,834
6,932,459
6,962,410


7,033,008
6,962,409
7,013,641
7,204,580
7,032,997
6,998,278
7,004,563


6,910,755
6,969,142
6,938,994
7,188,935
10/959,049
7,134,740
6,997,537


7,004,567
6,916,091
7,077,588
6,918,707
6,923,583
6,953,295
6,921,221


7,001,008
7,168,167
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20060038853
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11/442,134
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11/785,108
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11/834,635
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11/869,684
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11/955,358
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12/030,755
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12/031,598












BACKGROUND OF THE INVENTION
An integrated circuit fabricated on the silicon wafer is often referred to as a ‘die’. For the purposes of this specification, the term die will be used as a reference to an integrated circuit fabricated on a wafer substrate using lithographic the well known etching and deposition techniques commonly used in semiconductor fabrication. Integrated circuit (IC) dies are electrically connected to printed circuit boards by wire bonds. The wire bonds are very thin wires—around 25 to 40 microns in diameter—extending from contact pads along the side of the wafer substrate to contacts on the printed circuit board (PCB). Wire bonding is a widely used electrical interconnection technique because of the speed and accuracy of modern wire bonding machines, commonly referred to as wirebonders.
Wirebonders are automated devices that weld small lengths of wire from conductors on the PCB to the contact pads on an integrated circuit die. Wire is fed through a bonding tool that uses some combination of pressure, heat and/or ultra-sonic energy to attach the wire to the bond pads via a solid phase welding process. The two most common types of wire bonder are referred to as wedge bond and ball bond. These refer to the bonding tool and the configuration of the wire bond itself. With both types of wirebonders, the individual wire bonds extend in an arc from the bond pad on the integrated circuit (IC) die to the conductor on the PCB. This is because wires from the contact pads to the PCB are made longer than necessary to accommodate changes in the gap between the PCB and the bonds pads due to thermal expansion, flex in the components and so on.
To protect and strengthen the wire bonds, they are sealed within a bead of epoxy called encapsulant. The top of the wire arc is often about 300 microns above the contact pads although some wire bonding may extend even higher. As the name suggests, the encapsulant needs to encapsulate the full length of the wire so the encapsulant bead will extend 500 microns to 600 microns proud of the contact pads.
If the die is purely an electronic microprocessor, there is little need to keep close control of the encapsulant bead dimensions. However, if the die is a micro-electro mechanical systems (MEMS) device with an active upper surface, it may be necessary or desirable to bring the active surface of the die onto close proximity with another surface. One such situation applies to inkjet printheads. The proximity of the print media to the nozzle array influences the print quality. Similarly, if a cleaning surface is wiped across the nozzles, the bead of encapsulant can hamper the wiping contact.
Another problems arises because of sides of the encapsulant bead are not straight. One commonly used technique for depositing the encapsulant involves extruding it from a needle directly onto the line of wire bonds. The encapsulant volume and placement on the die is not very accurate. Variations in the pressure from the pump or slight non-uniformities in the speed of the needle cause the side of the bead contacting the active surface to be reasonably crooked. As the side of the bead is not straight, it has to be generously spaced from any active parts on the active surface to comfortably accommodate the perturbations. Spacing the electrical contacts away from the active portions (say for example, inkjet nozzles) of the active surface uses up valuable wafer real estate and reduces the number of dies that can be fabricated from a wafer disc.
In light of the widespread use of inkjet printheads, the invention will be described with specific reference to its application in this field. However, the ordinary worker will appreciate that this is purely illustrative and the invention is equally applicable to other integrated circuits wire bonded to a PCB or other support structure.
SUMMARY OF THE INVENTION
According to a first aspect, the present invention provides a method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure, the method comprising the steps of:
electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting structure with a respective wire bond, each of the wire bonds extending in an arc from the contact pad to the conductor; and,
pushing on each of the wire bonds individually to collapse the arc and plastically deform the wire bond such that the plastic deformation maintains the wire bond in a flatter profile shape.
The strength of the wire bond is known to be relatively small; of the order of 3 to 5 grams force. However, the Applicant's work has found that the wire bond structure is robust enough to withstand a certain degree of work hardening from plastic deformation. The arc of the wire bond can be deformed into a flatter profile without compromising the electrical connection with the PCB. The Applicant's above referenced U.S. Ser. No. 11/860,539 discloses a technique for simultaneously pushing some or all of the wire loops in the line of wire bonds. This so called gang wire pushing technique is effective but further development has shown that individually collapsing each wire bond is more controlled and easier to implement in a high volume manufacturing process.
Preferably, adjacent wire bonds in the line of wire bonds are sequentially pushed. In a further preferred form, the step of forming the line of wire bonds uses a wirebonder that has a bonding tool for moving between the contacts pads and their respective corresponding conductors, and the line of wires bonds are sequentially pushed by a wire engaging structure on the wirebonder. Preferably, the wire engaging structure and the bonding tools are configured for synchronized movement. Preferably, the wire engaging structure pushes the wire bond immediately adjacent the wire bond currently being formed by the bonding tool. Preferably, the wirebonder is a wedge type wirebonder and the bonding tool is a wedge with a wire clamp at a distal end such that during use, the wire clamp holds a piece of wire in contact with one of the contact pads on the die to form a weld connection before moving to the corresponding conductor on the PCB to weld the other end of the wire and formal wire bond, and the wire engaging structure has a wire pushing surface that contacts the wire bond, the wire pushing surface is adjacent to, and 1.0 mm to 1.6 mm behind the wire clamp with respect to the movement of the wedge towards the IC die. In a particularly preferred form, the wire pushing surface is between 50 microns to 400 microns closer to the PCB and the wire clamp. In some embodiments, the line of wire bonds does not extend more than 150 microns above the contact pads of the IC die. In preferred embodiments, the line of wire bonds does not extend more than 50 microns above the contact pads of the IC die. In a particularly preferred form, the wire bonds are attached to the contact pads with a bond strength greater than 3 g force.
Preferably the contact pads are spaced from the corresponding conductors on the PCB by more than 1 mm. In a further preferred form, the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB. In some embodiments, the PCB has a support structure and the flex PCB and need to the support structure such that the conductors are adjacent the contact pads on the die. In particular embodiments, the support structure has a chip mounting area for supporting the die, the die having a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors. In a particularly preferred form, the support structure is a liquid crystal polymer (LCP) molding. Preferably, the active surface has functional elements spaced less than 260 microns from the contacts pads of the die. In a particularly preferred form, the die is an inkjet printhead IC and the functional elements are nozzles through which ink is ejected. In some embodiments, the support structure is a liquid crystal polymer (LCP) molding.
Preferably, the wire bonds are covered in a bead of encapsulant, the bead of encapsulant extending less than 200 microns above the active surface of the die.
Preferably, the wire bonds are covered in a bead of encapsulant, the bead of encapsulant having a profiled surface that is flat, parallel to and spaced less than 100 microns from the active surface.
Preferably, the line of wire bonds are covered in a bead of encapsulant, the bead of encapsulant having a profiled surface that is flat and inclined relative to the active surface.
Preferably, the wire bonds are covered in a bead of encapsulant, the encapsulant being an epoxy material that is thixotropic when uncured.
Preferably, the wire bonds are covered in a bead of encapsulant, the encapsulant being an epoxy material has a viscosity greater than 700 cp when uncured.
In a particular embodiment, the printhead IC is mounted in a printer such that during use the nozzles are less than 100 microns from the paper path.
According to a second aspect, the present invention provides a wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board, the wirebonder comprising:
a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board; and,
a wire engaging structure for deforming the wire bonds.
Preferably, the wire engaging structure pushes on the wire bonds to plastically deform them.
Preferably, the wire engaging structure is configured to push the wire bonds onto an adhesive surface positioned between the integrated circuit and the conductors of the printed circuit board.
Preferably, the wire engaging structure is flexible relative to the bonding tool.
Preferably, the wire engaging structure is configured for synchronized movement with the bonding tool.
Preferably, the bonding tool moves from the integrated circuit to the conductors when forming one of the wire bonds and the wire engaging structure has a wire pushing surface positioned 1.0 mm to 1.6 mm behind the bonding tool with respect to its direction of movement when forming the wire bonds.
Preferably, the integrated circuit die is mounted to a supporting surface and the wire pushing surface is 50 microns to 400 microns closer to the supporting surface than the bonding tool. Preferably, the wirebonder is a wedge type wirebonder and the bonding tool is a wedge with a wire clamp at a distal end such that during use, the wire clamp holds a piece of wire in contact with one of the contact pads on the die to form a weld connection before moving to the corresponding conductor on the PCB to weld the other end of the wire and formal wire bond. Preferably, the wire pushing surface is formed from a material that has a hardness less than that of the wire bonds.
Preferably, the wire bonds are formed from lengths of wire with a gauge between 15 microns and 75 microns. In a particularly preferred form, the gauge is about 25 microns.
In some embodiments, the wire bonds attach to respective contact pads on the IC die and the wire bonds do not extend more than 150 microns above the contact pads of the IC die. In preferred embodiments, the line of wire bonds does not extend more than 50 microns above the contact pads of the IC die.
Preferably the contact pads are spaced from the corresponding conductors on the PCB by more than 1 mm. In a further preferred form, the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB. In some embodiments, the PCB has a support structure and the flex PCB and need to the support structure such that the conductors are adjacent the contact pads on the die. In particular embodiments, the support structure has a chip mounting area for supporting the die, the die having a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors. In a particularly preferred form, the support structure is a liquid crystal polymer (LCP) molding. Preferably, the active surface has functional elements spaced less than 260 microns from the contacts pads of the die. In a particularly preferred form, the die is an inkjet printhead IC and the functional elements are nozzles through which ink is ejected. In some embodiments, the support structure is a liquid crystal polymer (LCP) molding.
According to a third aspect, the present invention provides an electronic device comprising:
an integrated circuit die with a plurality of contacts pads;
a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively;
wire bonds electrically connecting each of the contact pads to the corresponding conductors; and,
an adhesive surface positioned between the contacts pads and the corresponding conductors; wherein,
the wire bonds are secured to the adhesive surface.
According to a fourth aspect, the present invention provides a method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, the method comprising the steps of:
mounting the integrated circuit die such that the contact pad is spaced from the conductor;
positioning an adhesive surface between the contact pad and the conductor on the printed circuit board;
attaching wire to one of the contact pad or the conductor;
drawing the wire towards the other of the contact pad or the conductor;
allowing the wire to contact the adhesive surface; and,
attaching the wire to the other of the contact pad of the conductor to form a wire bond adhered to the adhesive surface and a point intermediate its ends.
These aspects of the invention are placed on the realisation that wire bonds can be adhered to an underlying supporting structure without detrimental effects to their bond strength or function. Adhering the wire bonds between their ends provides a reliable and control production in the wire bond loop height. The resulting wire bond heights can be smaller than that achieved by inducing plastic deformation as the individual wire is unable to spring back up when the wire engaging structure disengages. It will be appreciated that plastically deforming a wire bond also involves initially elastically deforming the wire. The elastic deformation is removed when the wire pushing structure is retracted.
The wire bond can be adhered while the bonds are being formed by the wirebonder without any modification to the bonding tool. The applicant has found that wire bond is will typically allow the wire to touch the surface between the die and the conductors on the printed circuit board as the bond is being formed. Once the wire has been welded to the contact pad on the die, the bonding tool draws is towards the conductors on the printed circuit board. As it is drawn across the gap between the die and printed circuit board, the wire drapes downwardly and rests on the underlying surface. The only once the bonding tool has welded the other end of the wire to the conductor, and the wire clamp immediately behind the bonding tool breaks off the feed wire by pulling until tensile failure, does residual tension in the loop cause it to bow upwards. If the wire is brought down to touch an adhesive surface before the ultrasonic weld on the printed circuit board, it is not able to bow upwards.
Preferably, the wire bond is moved into contact with the adhesive surface by a wirebonder is the wire bond is being formed.
Preferably, the adhesive surface is one side of a double-sided adhesive tape. Preferably, the integrated circuit die and the PCB are mounted to a supporting structure such that they are adjacent and spaced from each other. Preferably, the PCB is a flexible PCB and the supporting structure is a liquid crystal polymer (LCP) molding. Preferably, the integrated circuit die is mounted to the supporting structure by a die attach film, and the adhesive surface is provided by a portion of the die attach film.



BRIEF DESCRIPTION OF THE DRAWINGS
Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings, in which:
FIG. 1 is a schematic representation of a common prior art technique for applying a bead of encapsulant to wire bonds;
FIG. 2 is a schematic representation of a die mounted to a supporting structure with a chip mounting area raised relative to the flex PCB mounting area;
FIGS. 3A, 3B and 3C are schematic representations of the encapsulant bead being profiled into a desired shape using a moveable blade;
FIGS. 4A to 4D are schematic representations of wire bonds being profiled by plastic deformation;
FIGS. 5A and 5B show the encapsulant bead height reductions for plastically deformed wire bonds;
FIGS. 6A to 6C show the encapsulant bead being applied to the wire bonds using the profiling blade;
FIGS. 7A and 7B show the profiling blade being used to control the encapsulant bead front on the surface of the die;
FIG. 8 shows the wire pusher mounted to the wirebonder;
FIG. 9 shows the wire pusher and the wire bonder in profile; and,
FIG. 10 shows the wire bonds adhered to the LCP molding between the die and the flex PCB.



DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
FIG. 1 shows a common technique used for applying a bead encapsulant to wire bonds. A die 4 is mounted to a supporting structure 6 adjacent the edge of a flex PCB 8 (flexible printed circuit board). The die 4 has a line of contact pads 10 along one edge and the flex PCB 8 has corresponding bond pads 12. Wire bonds 16 extend from the bond pads 10 to the bonds pads 12. Power and data is transmitted to the die 4 via conductive traces 14 in the flex PCB 8. This is a simplified representation of the dies mounted within many electronic devices. The printhead IC dies mounted to the LCP (liquid crystal polymer) molding to receive print data from an adjacent flex PCB, as described in U.S. Ser. No. 11/014,769 incorporated herein by cross reference, is one example of this type of die mounting arrangement. The ordinary worker will appreciate that the die may also be mounted directly to a hard PCB with traces formed thereon.
The wire bonds 16 are covered in a bead on encapsulant 2 to protect and reinforce the bonds. The encapsulant 2 is dispensed from a discharge needle 18 directly onto the wire bonds 16. Often the encapsulant bead 2 is three separate beads—two beads of so-called ‘dam’ encapsulant 20, and one bead of ‘fill’ encapsulant 22. The dam encapsulant 20 has a higher viscosity than the fill encapsulant 22, and serves to form a channel to hold the fill encapsulant bead. The height H of the bead 2 above the die 4 is usually about 500-600 microns. In most electronic devices, this does not pose a problem. However, if the die has an active surface that needs to operate in close proximity to another surface, this bead can be an obstruction.
Elevating the Die Relative to the Flex PCB
FIG. 2 shows a stepped support structure 6 that has raised the chip mounting area 26 relative to the PCB mounting area 24 (or at least the area mounting the PCB bonds pads 12). With the die 4 on a raised chip mounting area 26, the arc of the wire bonds 16 are lower relative to active surface 28 of the die 4. In fact, the end of the wire bond 16 attached to the contact pad 10 can be the apex of the arc (bearing in mind that the wire bond arc is intended to accommodate some relative movement of the die and PCB). When the wire bonds 16 are covered with encapsulant 2, the bead has a reduced height H above the active surface 28 of the die 4. If the bead of encapsulant 2 uses two beads of dam encapsulant 24 and a fill encapsulant 22, the positions, volumes and viscosities of the beads need to take the step into account. Bead heights less than 100 microns are easily achievable, and with additional measures, such as wire arc collapsing and bead profiling (discussed below), bead height of less than 50 microns are possible.
With the die 4 raised above the flex PCB 8 by 410 microns, the height of the wire bonds 16 above the die is about 34 microns. With the die raised 610 microns above the flex PCB, the wire bond height is around 20 microns. Raising the die even further has shown little or no further reduction in wire bond height with a step of 710 microns having a wire bond height of around 20 microns.
Shaping the Encapsulant Bead with a Profiling Blade
FIGS. 3A to 3C show the encapsulant 2 being profiled with a profiling blade 30. The support structure 6 is again stepped to reduce the height of the wire bonds 16 above the die 4. Before the epoxy encapsulant 2 has cured, the profiling blade 30 moves across the die 4 and wire bonds in a predetermined path. As shown in FIG. 3B, the blade 30 displaces the top of the bead 30 to its flex PCB side to form a flat top surface 32 that is at a significantly reduced height H above the die 4.
The encapsulant bead 2 may be a plurality of separate beads as shown in FIGS. 1 and 2, or a single bead of one material. However, for close dimensional control of the profiled encapsulant, the encapsulant materials used should be thixotropic—that is, once deposited from the discharge needle, or profiled by the blade 30, the material should not flow under its own weight, but rather hold its form until it cures. This requires the epoxy to have an uncured viscosity greater than about 700 cp. A suitable encapsulant is DYMAX 9001-E-v3.1 Chip Encapsulant produced by Dymax Corporation with a viscosity of approximately 800 cp when uncured. The blade 30 may be ceramic (glass) or metal and preferably about 200 microns thick.
It will be appreciated that the relative movement of the blade 30 and the die 4 can be precisely controlled. This allows the height H to be determined by the tolerance of the wire bonding process. As long as H is greater than the nominal height of the wire bond arc above the die, plus the maximum tolerance, the encapsulant 2 will cover and protect the wire bonds 16. With this technique, the height H can be easily reduced from 500-600 microns to less than 300 microns. If the heights of the wire bond arcs are also reduced, the height H of the encapsulant bead can be less than 100 microns. The Applicant uses this technique to profile encapsulant on printhead dies down to a height of 50 microns at its lowest point. As shown in FIG. 3C, the lowest point is at the encapsulant front and the blade 30 forms an inclined face 32 in the top of the bead 2. The inclined face is utilized by the printhead maintenance system when cleaning the paper dust and dried ink from the nozzle face. This illustrates the technique's ability to not just reduce the height of the encapsulant bead, but to form a surface that can perform functions other than just encapsulate the wire bonds. The edge profile of the blade and the path of the blade relative to the die can be configured to form a surface that has a multitude of shapes for a variety of purposes.
Plastic Deformation of the Wire Bond Arcs
FIGS. 4A to 4C show another technique for lowering the profile of wire bonds. FIG. 4A shows the die 4 connected to the flex PCB 8 via the wire bonds 16. While the stepped support structure 6 has lowered the height of the wire bond arcs compared to a flat supporting structure, the wire bonds still have a natural tendency to bow upwards rather than downwards towards the corner of the step. The wires 16 are typically about 32 microns in diameter and have a pull force of about 3 to 5 grams force. The pull force is the tensile load necessary to break the connection to the contact pad 10 or the bond pad 12. Given the fragility of these structures (one of the reasons encapsulant is applied), conventional wisdom is to avoid any contact between the wire bond arcs and other solid surfaces.
As shown in FIG. 4B, the arc of the wire bonds 16 can be collapsed by a wire pusher 34. The wire pusher 34 displaces the wire bond 16 enough to elastically and plastically deform the arc. The Applicants have shown that contact with the wire pusher 34 can cause localized work hardening in the wire, but as long as the pushing force is not excessive, it does not break. The end of the wire pusher 34 is rounded to avoid stress concentration points. The wire pusher may be a stylus for engaging single wire bonds or a blade that pushes on multiple wire bonds simultaneously.
Referring now to FIG. 4C, the wire pusher 34 is retracted and the wire springs back toward its original shape to relieve the elastic deformation. However, the plastic deformation remains and the wire bond height above the die 4 is much reduced. Testing has shown that an initial wire bond loop height of 200 microns can be reduced to about 35 microns using this technique. Tests have also shown that the pull strength of the plastically deformed wires remains at about 3 to 5 grams force.
The collapse of the wire bonds is uncontrolled and leaves the wire bonds somewhat randomly deformed. However, pushing the wire bonds closer to the die provides more uniformly shaped collapsed wire bonds. The Applicant's work has shown that engaging the wires about 200 to 300 microns for the die provides the best results.
As shown in FIG. 4D, the die 4 and the flex PCB 8 are mounted to a flat support structure 6. As discussed above, this means the original loop height of the wire bond arc is much higher—approximately 400 microns above the die 4. Consequently, the wire has more plastic deformation when the loop is collapsed by the wire pusher. Even so, the Applicants results show that the residual loop height after pushing is about 20-50 microns.
FIGS. 5A and 5B show the collapsed wire bonds 16 covered with an encapsulant bead 2. Even without bead profiling prior to curing, the height H of the bead above the die is much less than the bead necessary to encapsulate the original undeformed wire loops.
Applying Encapsulant with Profiling Blade
FIGS. 6A, 6B and 6C show the application of the encapsulant bead using the profiling blade 30 instead of a discharge needle (see FIGS. 1 and 2). As previously discussed, the flowrate of encapsulant from the discharge needle can vary and this gives rise to large variations on the position of the encapsulant front on the active surface of the die 4. Consequently, any functional elements in the active surface of the die need to be sufficiently spaced from the contacts pads 10 to allow for the meandering encapsulant front.
Applying the encapsulant with the profiling blade avoids the problems caused by the flowrate fluctuations from the discharge needle. As shown in FIG. 6A, the bead of encapsulant 40 can be formed on the profiling blade 30 by simply dipping it into a reservoir of uncured encapsulant epoxy. Of course, the bead 40 may also be formed by any other convenient method, such as running the discharge needle along one end of the blade 30.
FIG. 6B show the blade 30 having been lowered to touch the bead 40 onto the die 4. When the encapsulant material touches the die surface, it wets and wicks along the surface while remaining pinned to the edge of the blade. The blade 30 is held at a predetermined height above the die 4 and moved over the bead 2 to flatten and lower its profile. The encapsulant displaced from the top of the bead 2 by the blade 30, spreads over the PCB side of the bead 2. It is not relevant if the encapsulant spreads further over the PCB than necessary. As long as the wire bonds 16 and the bonds pads 12 are covered, any additional encapsulant on the PCB 8 surface is not detrimental.
In FIG. 6C, the wire bond 16 height has been reduced by collapsing the arc in accordance with the techniques discussed above. As previously discussed, the bead 2 deposited by the discharge needle need not be as big to cover the wire bond 16 once it has been collapsed. Furthermore, the blade 30 can be brought closer to the die 4 without contacting wire bonds 16 when profiling the encapsulant 2. Hence the bead profile in FIG. 6C is substantially lower than that of FIG. 6B.
Encapsulant Front Control
When the encapsulant material is dispensed from the discharge needle, minor variations in the flowrate can cause the bead to bulge at points of higher flow. Consequently, the side of the bead that contacts the active surface of the die is not straight, but has significant perturbations. These perturbations have to be accommodated between the contact pads and any functional elements on the active surface. The spacing between the contacts pads and the functional elements consumes valuable ‘chip real estate’. The Applicant has previously developed printhead dies with a spacing of 260 microns between the contact pads and the first row of nozzles. Better control of the encapsulant front reduces the space between the contacts and operational elements, and so the overall dimensions of the die. Hence the design can be more compact and more chips fabricated from the original wafer disc.
As shown in FIGS. 7A and 7B, the profiling blade 30 is used to control the front 36 of the bead of encapsulant 2. The blade 30 is positioned over the die 4 to define a gap 42 between its lower edge and the active surface 28. As the discharge needle 18 dispenses the encapsulant material 44, it flows onto the active surface, one side of the blade and a fillet of the material extends through the gap 42. Because of the flow restriction created by the gap, flow variations have a reduced effect on the dimensions of the fillet that flows through the gap. Therefore the encapsulant front 36 closely corresponds to the line of the lower edge of the blade 30.
As shown in FIG. 7B, the profiling blade 30 is already in position to profile the encapsulant bead 2 once it has been dispensed from the discharge needle. The blade 30 simply moves over the die 4 in a direction away from the nozzles 38. This keeps the encapsulant front 36 in place and flattens the profile of the encapsulant bead 2 over the wire bonds 16.
Collapsing the Wire Bonds Arcs with the Wirebonder
FIGS. 8 and 9 show a technique for individually deforming each of the wire bond arcs using the wirebonder. This has several advantages over the technique shown in FIGS. 4A to 4C described in the “PLASTIC DEFORMATION OF THE WIRE BOND ARCS” section above. Firstly, deforming the wire bonds as they are being attached by the wirebonder is more time efficient than pushing the line of wire bonds as a separate production step. Secondly, it has been found that individually engaging and deforming each wire in the line of wire bonds provides uniform results in terms of wire deformation and bond strength.
FIG. 8 is a schematic perspective of a wirebonder 46 forming the individual wire bonds 16 between the contact pads 10 and the conductors 12 on the flex PCB 8. The printhead IC 4 is shown adhered to one side of the die attach film 58. In turn, the die attach film 58 is attached to the LCP molding 6. Laser ablated holes through the die attach film 58 feed ink to the array of nozzles 38. The LCP molding six has a stepped surface 60 so that the printhead IC 4 is raised relative to the flex PCB eight. As discussed above this helps to reduce the height of the wire bonds 16.
The wire bonder 46 is commonly known in the industry as a “wedge type” wire bonder. The wedge 48 receives a stock of feed wire 56 at its tip. Using some combination of pressure, heat and ultrasonic energy, the end of the wire bond 16 is welded to one of the conductors 12 on the flex PCB 8, or one of the contact pads 10 on the printhead integrated circuit 4. FIG. 8 includes an enlarged inset showing the connection between the wire bond 16 and the conductor 12. The end of the wire has a flatten section 54 created by the tip of wedge 48. Adjacent to flatten section 54 is a neck portion 52 where the wire 16 transitions to its circular cross section. This neck section of the wire is work hardened and particularly prone to plastic deformation. In light of the greater propensity for plastic deformation at the neck portion 52, the wire bonder 46 is fitted with a wire engaging structure 50 pushes on the wire bond 16 in this region. However, the wire engaging structure 50 to not contact the wire bonds 16 too close to the neck portion 52 is this can break the wire. The skilled worker will appreciate the work hardening increases the brittleness of the metal. The applicant's testing has found that positioning the wire engaging structure 50 so that its tip is between 1.0 mm and 1.6 mm behind the tip of the wedge (with respect to its movement from the die to the flex) and 50 microns to 600 microns below the tip of the wedge produces suitable results. In particular, the best results were achieved with the tip of the wire engaging structure 50 positioned 1.2 mm to 1.5 mm behind the tip the wedge, and 100 microns to 300 microns below the tip of the wedge. This configuration gave wire bonds 16 less than 50 microns above the nozzle array 38, each with a bond strength between 3.5 g and 5 g.
The wire engaging structure 50 is formed from a material with the surface hardness less than that of the wire. This avoids surface indentations on the wire which may later become stress concentration sites.
Adhering the Wire Bond to Reduce Loop Heights
FIG. 10 is a schematic section view of another technique used to reduce the height of the wire bond loops. An adhesive surface 62 is positioned on the LCP molding 6, between the contact pads 10 of the printhead IC 4 and the corresponding conductor 12 on the flex PCB 8. The Applicant has found that a wirebonder will usually allow the wire bond 16 to drape downwards and touch the surface between the die and PCB while the wire is bonded to the PCB conductor. Once the wire has been welded to the contact pad on the die, the bonding tool draws it towards the conductors on the printed circuit board. As it is drawn across the gap between the die and printed circuit board, the wire drapes downwardly and rests on the underlying surface. Once the bonding tool has welded the other end of the wire to the conductor, and the wire clamp immediately behind the bonding tool breaks off the feed wire by pulling until tensile failure, the residual tension in the loop cause it to bow upwards. By positioning adhesive 62 at the point of contact between the wire and the LCP 6, the wire bond 16 is unable to bow upwards to the same height.
The adhesive surface 62 may be double sided tape, an adhesive paste or resin jetted onto the LCP 6 when the die 4 and the flex 8 are fixed, or it could simply be an extension of the die attach film 58.
The invention has been described herein by way of example only. The ordinary will readily recognize many variations and modifications which do not depart from the spirit and scope of the broad inventive concept.

## Claims

1. A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with contact pads to a printed circuit board with a conductors, the die having an active surface that has functional elements and the contact pads being formed along an edge of the active surface and spaced less than 260 microns from the functional elements; the method comprising the steps of:
mounting the integrated circuit die such that the contact pads are spaced from the conductor;
positioning an adhesive surface between the contact pads and the conductors on the printed circuit board, said adhesive surface being positioned below a height of both the contact pads and the conductors;
connecting the contact pads with the conductors by welding one end of a wire bond to each contact pad and drawing a wire-bonding tool towards a respective conductor, such that part of the wire bond drapes onto the adhesive surface during wirebonding;
providing a profiling blade with an edge;
forming a bead of encapsulant material along the edge;
positioning the edge between the contact pads and the functional elements, and above the active surface at a predetermined spacing from the die; and,
moving the profiling blade away from the functional elements to cover the wire bonds with the encapsulant material while the functional elements remain exposed.

2. A method of reducing wire bond loop heights according to claim 1 wherein the wire bonds are moved into contact with the adhesive surface by a wirebonder as the wire bond is being formed.

3. A method of reducing wire bond loop heights according to claim 1 wherein the adhesive surface is one side of a double-sided adhesive tape.

4. A method of reducing wire bond loop heights according to claim 1 wherein the integrated circuit die and the PCB are mounted to a supporting structure such that they are adjacent and spaced from each other.

5. A method of reducing wire bond loop heights according to claim 1 wherein the PCB is a flexible PCB and the supporting structure is a liquid crystal polymer (LCP) molding.

6. A method of reducing wire bond loop heights according to claim 1 wherein the integrated circuit die is mounted to the supporting structure by a die attach film, and the adhesive surface is provided by a portion of the die attach film.

7. A method of reducing wire bond loop heights according to claim 1 wherein the wire bonds are formed from lengths of wire with a gauge between 15 microns and 75 microns.

8. A method of reducing wire bond loop heights according to claim 7 wherein the gauge is about 25 microns.

9. A method of reducing wire bond loop heights according to claim 7 wherein the wire bonds attach to respective contact pads on the IC die and the wire bonds do not extend more than 150 microns above the contact pads of the IC die.

10. A method of reducing wire bond loop heights according to claim 9 wherein the line of wire bonds does not extend more than 50 microns above the contact pads of the IC die.

11. A method of reducing wire bond loop heights according to claim 1 wherein the contact pads are spaced from the corresponding conductors on the PCB by more than 1 mm.

12. A method of reducing wire bond loop heights according to claim 1 wherein the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB.

13. A method of reducing wire bond loop heights according to claim 1 wherein the PCB is a flexible PCB mounted to a support structure together with the die such that the conductors are adjacent the contact pads on the die.

14. A method of reducing wire bond loop heights according to claim 13 wherein the support structure has a chip mounting area for supporting the die, the die having a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors.

15. A method of reducing wire bond loop heights according to claim 1 wherein the wire bonds are formed using aluminium wire.

16. A method of reducing wire bond loop heights according to claim 1 wherein the die is an inkjet printhead IC and the functional elements are nozzles through which ink is ejected.

17. A method of reducing wire bond loop heights according to claim 16 wherein the printhead IC is configured to be mounted in a printer such that during use the nozzles are less than 100 microns from the paper path.