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Note: Representatives submitting on behalf of an organization must enter information below.

Requestor Representative:

Section 301 Investigation: China's Acts, Policies, and Practices Related to Technology 

Transfer, Intellectual Property, and Innovation - Form to Request Exclusion of Product

When submitting a product exclusion request using this form, enter the specified 

information in the following fields and explain the basis and rationale for your statements. 

By completing this form, you certify that the information provided is complete and 

correct to the best of your knowledge. 

1. Indicate whether the comment contains business confidential information (BCI), is a public

document, or is a public version of a BCI document.

3.

2. Please provide a complete and detailed description of the product of concern:

4.

5. Requestor's relationship to the product:

CONTINUED BELOW

*

10-digit HTSUS item number* for product you wish to address in this product exclusion request:

Use numerical characters only with no special characters (example: 1023456789). For help in finding

the HTSUS item number associated with your product, see https://hts.usitc.gov/

1

7.

6. Does this submission in regulations.gov include additional attachments?

Please indicate whether any additional attachment contains business confidential

information (BCI), is a public document, or is a public version of a BCI document.

VERSION 1

Requestor Information

Requestor Name (Last, First):
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8. Is this product, or a comparable product, available from sources in the United States?:

VERSION 1

11. Please provide information in support your request, taking account of the instructions

provided in Section B of the Federal Register notice (note: text entered below can extend

beyond the apparent size of this box).

9. Is this product, or a comparable product, available from sources in third countries?:

10. Please provide the value and quantity (with units) of the Chinese-origin product of concern

that you purchased for each calendar year specified. Limit this figure to the products

purchased by your firm (or by members of your trade association) alone. Please provide

estimates if precise figures are unavailable.

2016 Value:

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2017 Quantity:
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Chip Technology: 

1: TSN

3: standard InGaN 

4: AlGaAs (RECLED)

5: HOP 2000 

6: Standard InGalP 

9: TSN low current 

B: HOP 2000 

C: ATON 

D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) 

F: Thinfilm InGaAlP 

G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) 

K: InGaAlP low current 

S: standard InGaN low current 

0: TSN 

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Encapsulant Type / Lens Properties

7: Colorless clear or white volume conversion 

(resin encapsulation) 

S: Silicone (with or without diffuser)

Wavelength Emission Color Color coordinates according 

(Ȝdom typ.) CIE 1931/Emission color: 

A: 617 nm amber W: white

S: 633 nm super red UW: ultra white 

T: 528 nm true green CB: color on demand blue 

Y: 587 nm yellow CG: color on demand green 

O: 606 nm orange CL: color on demand lagune 

G: 570 nm green 

P: 560 nm pure green 

R: 625 nm red 

B: 470 nm blue 

H: 645 nm hyper-red 

V: 505 nm verde green

L: Light

emitting

diode

Package Type 

T: TOPLED 

Lead / Package Properties 

6: folded leads 

7: reverse gullwing leads 

T: folded leads, improved corrosion stability 

Au-LF), w/o TiO2 jetting 

V: folded leads and UX:3 w/ improved 

corrosion stability (Au-LF), TiO2 jetting 

Type Designation System 

L A T 6 7 6