Federal Register / Vol. 86, No. 183 / Friday, September 24, 2021 / Notices 53031 

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Agenda 

Welcome and Roll Call 

Civil Rights Discussion 

Public Comment 

Next Steps 

Adjournment 

Dated: September 21, 2021. 

David Mussatt, 

Supervisory Chief, Regional Programs Unit. 

[FR Doc. 2021–20747 Filed 9–23–21; 8:45 am] 

BILLING CODE P 

DEPARTMENT OF COMMERCE 

Bureau of Industry and Security 

[Docket No. 210915–0189] 

RIN 0694–XC084 

Notice of Request for Public 

Comments on Risks in the 

Semiconductor Supply Chain 

AGENCY: Bureau of Industry and 

Security, Office of Technology 

Evaluation, U.S. Department of 

Commerce. 

ACTION: Notice of request for public 

comments. 

SUMMARY: The Department of Commerce 

(‘‘Department’’) (Bureau of Industry 

(‘‘BIS’’)) led the 100-Day Supply Chain 

Review of semiconductors and 

advanced packaging that was mandated 

by Presidential Executive Order. On 

February 24, 2021, President Biden 

issued an Executive Order on 

‘‘America’s Supply Chains,’’ which 

directs several federal agency actions to 

secure and strengthen America’s supply 

chains. This review, included in the 

White House Report ‘‘Building Resilient 

Supply Chains, Revitalizing American 

Manufacturing, and Fostering BroadBased Growth’’, identified numerous 

areas of supply chain vulnerabilities. 

The ongoing shortages in the 

semiconductor product supply chain are 

having an adverse impact on a wide 

range of industry sectors. With the goal 

of accelerating information flow across 

the various segments of the supply 

chain, identifying data gaps and 

bottlenecks in the supply chain, and 

potential inconsistent demand signals, 

the Department is seeking responses 

from interested parties (including 

domestic and foreign semiconductor 

design firms, semiconductor 

manufacturers, materials and equipment 

suppliers, as well as semiconductor 

intermediate and end-users) to the 

questions set forth in this notice. 

DATES: The due date for filing comments 

is November 8, 2021. 

ADDRESSES: Submissions: You may 

submit comments, identified by docket 

number BIS 2021–0036 or RIN 0694– 

XC084, through the Federal 

eRulemaking Portal: http://

www.regulations.gov. To submit 

comments via https://

www.regulations.gov, enter docket 

number BIS–2021–0036 on the home 

page and click ‘‘search.’’ The site will 

provide a search results page listing all 

documents associated with this docket. 

Find a reference to this notice and click 

on the link entitled ‘‘Comment Now!’’ 

(For further information on using 

https://www.regulations.gov, please 

consult the resources provided on the 

website by clicking on ‘‘How to Use 

This Site.’’) BIS requires commenters 

submitting comments via https://

www.regulations.gov to first download a 

fillable form from the BIS website at 

https://bis.doc.gov/semiconductor

FRN2021 and to then submit the filled 

out electronic form in https://

www.regulations.gov when submitting 

comments in response to docket number 

BIS 2021–0036 or RIN 0694–XC084. 

FOR FURTHER INFORMATION CONTACT: 

David Boylan, Defense Industrial Base 

Division, Office of Technology 

Evaluation, Bureau of Industry and 

Security, at 202–482–7816, 

SemiconductorStudy@bis.doc.gov. 

SUPPLEMENTARY INFORMATION: 

Background 

BIS led the Department’s 100 Day 

Supply Chain Review of 

semiconductors and advanced 

packaging that was mandated by 

Presidential Executive Order (E.O.) 

14017. On February 24, 2021, President 

Biden issued E.O. 14017 on ‘‘America’s 

Supply Chains,’’ which directs several 

federal agency actions to secure and 

strengthen America’s supply chains. 

This review, included in the White 

House Report ‘‘Building Resilient 

Supply Chains, Revitalizing American 

Manufacturing, and Fostering BroadBased Growth’’ (available at: https://

www.whitehouse.gov/wp-content/ 

uploads/2021/06/100-day-supply-chainreview-report.pdf) (last accessed 

September 3, 2021), identified 

numerous areas of supply chain 

vulnerabilities. In addition to the 

longer-term goals such as strengthening 

the domestic semiconductor 

manufacturing ecosystem and 

promoting U.S. leadership, this report 

called upon the Department to partner 

with industry to facilitate information 

flow between semiconductor producers 

and suppliers and end-users to address 

the current semiconductor shortage. The 

ongoing shortage of semiconductor 

products is having an adverse impact on 

a wide range of industry sectors. 

With the goal of facilitating the flow 

of information across the various 

segments of the supply chain, 

identifying data gaps and bottlenecks in 

the supply chain, and potential 

inconsistent demand signals, the 

Department is seeking responses from 

interested parties (including domestic 

and foreign semiconductor design firms, 

semiconductor and microelectronics 

manufacturers, materials and equipment 

suppliers, as well as semiconductor 

53032 Federal Register / Vol. 86, No. 183 / Friday, September 24, 2021 / Notices 

product intermediate and end-users) to 

the questions set forth in this notice. 

Information submitted in response to 

this request may contain business 

proprietary information, which will not 

be published and will be protected from 

disclosure, provided the submitters 

follow the instructions below for 

submitting confidential business 

information in the public comments. 

Written Comments 

Interested parties are invited to 

submit written comments, data, 

analyses, or information pertinent to 

this request to BIS’s Office of 

Technology Evaluation no later than 

November 8, 2021. 

While the Department invites input 

from all interested parties, it is 

particularly interested in obtaining 

information from foreign and domestic 

entities that actively participate in the 

semiconductor product supply chain at 

any level (e.g., semiconductor design, 

front end semiconductor wafer 

fabrication, semiconductor assembly 

test and packaging, microelectronics 

assembly, intermediate and end-users of 

semiconductors and microelectronics, 

distributors of such products, as well as 

entities supporting semiconductor and 

microelectronics manufacturing as 

providers of materials and equipment). 

To allow for aggregation and 

comparison of data from multiple 

respondents, the Department has posted 

a fillable form on the BIS website that 

commenters must download and fill out 

for submission to https://

www.regulations.gov. See the ADDRESSES

section of this notice for where to find 

the fillable forms. 

The Department is specifically 

seeking the following information and 

data: 

1. For semiconductor product design, 

front and back-end manufacturers and 

microelectronics assemblers, and their 

suppliers and distributors: 

a. Identify your company’s role in the 

semiconductor product supply chain. 

b. Indicate the technology nodes (in 

nanometers), semiconductor material 

types, and device types that this 

organization is capable of providing 

(design and/or manufacture). 

c. For any integrated circuits you 

produce—whether fabricated at your 

own facilities or elsewhere—identify the 

primary integrated circuit type, product 

type, relevant technology nodes (in 

nanometers), and actuals or estimates of 

annual sales for the years 2019, 2020, 

and 2021 based on anticipated end use. 

d. For the semiconductor products 

that your organization sells, identify 

those with the largest order backlog. 

Then for the total and for each product, 

identify the product attributes, sales in 

the past month, and location of 

fabrication and package/assembly. 

i. List each product’s top three current 

customers and the estimated percentage 

of that product’s sales accounted for by 

each customer. 

e. For each phase of the production 

process, identify whether your 

organization carries out the step 

internally or externally. For your 

organization’s top semiconductor 

products, estimate each product’s (a) 

2019 lead time and (b) current lead time 

(in days), both overall and for each 

phase of the production process. 

Provide an explanation of any current 

delays or bottlenecks. 

f. For your organization’s top 

semiconductor products, list each 

product’s typical and current inventory 

(in days), for finished product, inprogress product, and inbound product. 

Provide an explanation for any changes 

in inventory practices. 

g. What are the primary disruptions or 

bottlenecks that have affected your 

ability to provide products to customers 

in the last year? 

h. What is your organization’s bookto-bill ratio for the past three years? 

Explain any changes. 

i. If the demand for your products 

exceeds your capacity, what is the 

primary method by which your 

organization allocates the available 

supply? 

j. Does your organization have 

available capacity? If yes, what is 

preventing the filling of that capacity? 

k. Is your organization considering 

increasing its capacity? If yes, in what 

ways, over what timeframe, and what 

impediments exist to such an increase? 

What factors does your organization 

consider when evaluating whether to 

increase capacity? 

l. Has your organization changed its 

material and/or equipment purchasing 

levels or practices in the past three 

years? 

m. What single change (and to which 

portion of the supply chain) would most 

significantly increase your ability to 

supply semiconductor products in the 

next six months? 

2. Questions for intermediate users 

and end users of semiconductor 

products or integrated circuits: 

a. Identify your type of business and 

the types of products you sell. 

b. What are the (general) applications 

for the semiconductor products and 

integrated circuits that you purchase? 

c. For the semiconductor products 

that your organization purchases, 

identify those that present the greatest 

challenge for your organization to 

acquire. Then for each product, identify 

the product attributes and purchases in 

2019 and 2021, as well as average 

monthly orders in 2021. Then estimate 

the quantity of each product your 

organization would purchase in the next 

six months barring any production 

constraints as well as the amount your 

organization expects to actually be able 

to purchase. For each of your 

organization’s top semiconductor 

products, estimate each product’s lead 

times and your organization’s inventory 

for (a) 2019 and (b) currently (in days). 

Provide an explanation of any current 

delays or bottlenecks. 

d. What are the primary disruptions 

or bottlenecks that have affected your 

ability to provide products to customers 

in the last year? 

e. Is your organization limiting 

production due to lack of available 

semiconductors? Explain. 

f. What percentage of your current 

production has your organization had to 

defer, delay, reject, or suspend in the 

past year? Explain. 

g. Is your organization considering or 

carrying out new investments to 

mitigate semiconductor sourcing 

difficulties? Explain. 

h. What semiconductor product types 

are most in short supply and by what 

estimated percentage relative to your 

demand? What is your view of the root 

cause? 

i. Has your organization changed its 

material and/or equipment purchasing 

levels or practices in the past three 

years? 

j. What single change (and to which 

portion of the supply chain) would most 

significantly increase your ability to 

purchase semiconductors in the next six 

months? 

k. What percentage of your orders are 

fulfilled by distributors versus through 

direct purchase orders to semiconductor 

product manufacturers? 

l. For the semiconductor products 

your organization purchases, how long 

(in months) are the typical purchase 

commitments? How, if at all, do your 

organization’s purchase commitments 

differ for products in short supply? 

m. Has your organization faced ‘‘decommits’’ (defined as a notification from 

a supplier that expected or committed 

supply will not be delivered in the 

agreed-upon time and quantity) in 

recent months? If this is a significant 

issue, please explain (e.g., nature of 

product, supplier, impact). 

Requirements for Written Comments 

The https://www.regulations.gov 

website allows users to provide 

comments by filling in a ‘‘Type 

Comment’’ field, or by attaching a 

document using an ‘‘Upload File’’ field. 

Federal Register / Vol. 86, No. 183 / Friday, September 24, 2021 / Notices 53033 

1See Emulsion Styrene-Butadiene Rubber From 

Brazil: Preliminary Results of Antidumping Duty 

Administrative Review; 2019–2020, 86 FR 30401 

(June 8, 2021) (Preliminary Results), and 

accompanying Preliminary Decision Memorandum 

(PDM). 

2 Id. 

3Commerce placed on the record of this 

proceeding excerpts of the questionnaire response 

of Industrias Negromex S.A. de C.V. (Negromex), a 

respondent in the 2019–2020 administrative review 

emulsion styrene-butadiene rubber from Mexico. 

The excerpts of the questionnaire response related 

to Negromex’s claim that its merchandise classified 

as ‘‘Grade E1778R’’ is equivalent to the 

International Institute of Synthetic Rubber 

Producers Grade E1763 merchandise. See 

Memorandum, ‘‘Soliciting Comments on Product 

Grading,’’ dated August 9, 2021. 

4See Lion Elastomers, LLC (the petitioner)’s 

Letter, ‘‘Antidumping Review of the Antidumping 

Duty Order on Emulsion Styrene Butadiene Rubber 

(E–SBR) from Brazil and Mexico: Lion Elastomers, 

LLC’s Comments on Product Grading,’’ dated 

August 19, 2021; see also Negromex and its 

affiliated U.S. importer, Dynasol, LLC’s Letter, 

‘‘Emulsion Styrene Butadiene Rubber from Brazil 

and Mexico Comments on Product Grading,’’ dated 

August 20, 2021. 

5See Preliminary Results, 86 FR 30401, and 

accompanying PDM at 2–6. 

As noted above, commenters will be 

required to use the BIS fillable form 

available on the BIS website when 

submitting comments in https://

www.regulations.gov. The Department 

prefers that any additional comments be 

provided in a separate attached 

document. The Department prefers 

supplemental submissions in Microsoft 

Word (.doc files) or Adobe Acrobat (.pdf 

files). If the submission is in an 

application format other than Microsoft 

Word, Microsoft Excel, or Adobe 

Acrobat, please indicate the name of the 

application in the ‘‘Type Comment’’ 

field. Please do not attach separate cover 

letters to electronic submissions; rather, 

include any information that might 

appear in a cover letter within the 

comments. Similarly, to the extent 

possible, please include any exhibits, 

annexes, or other attachments in the 

same file, so that the submission 

consists of one supplemental file 

instead of multiple additional files. 

Comments (both public comments and 

non-confidential versions of comments 

containing business confidential 

information) will be placed in the 

docket and open to public inspection. 

Comments may be viewed on https://

www.regulations.gov by entering docket 

number BIS–2021–0036 in the search 

field on the home page. 

All filers should name their files 

using the name of the person or entity 

submitting the comments. Anonymous 

comments are also accepted. 

Communications from agencies of the 

United States Government will not be 

made available for public inspection. 

Anyone submitting business 

confidential information should clearly 

identify the business confidential 

portion at the time of submission, file a 

statement justifying nondisclosure and 

referring to the specific legal authority 

claimed, and provide a non-confidential 

version of the submission. The BIS 

fillable form available on the BIS 

website referenced above will allow for 

an indication at the top of each page for 

whether it contains business 

confidential information. Users 

submitting a form that contains business 

confidential information, will need to 

submit a non-confidential version of the 

same form that does not contain the 

confidential business information. The 

non-confidential version of the 

submission will be placed in the public 

file on https://www.regulations.gov. For 

comments submitted electronically 

containing business confidential 

information, the file name of the 

business confidential version should 

begin with the characters ‘‘BC’’. Any 

page containing business confidential 

information must be clearly marked 

‘‘BUSINESS CONFIDENTIAL’’ on the 

top of that page. The non-confidential 

version must be clearly marked 

‘‘PUBLIC’’. The file name of the nonconfidential version should begin with 

the character ‘‘P’’. The ‘‘BC’’ and ‘‘P’’ 

should be followed by the name of the 

person or entity submitting the 

comments or rebuttal comments. If a 

public hearing is held in support of this 

assessment, a separate Federal Register 

notice will be published providing the 

date and information about the hearing. 

BIS does not maintain a separate 

public inspection facility. Requesters 

should first view the BIS’s web page, 

which can be found at https://

efoia.bis.doc.gov/ (see ‘‘Electronic 

FOIA’’ heading). If requesters cannot 

access the website, they may call 202– 

482–0795 for assistance. The records 

related to this assessment are made 

accessible in accordance with the 

regulations published in part 4 of title 

15 of the Code of Federal Regulations 

(15 CFR 4.1 through 4.11). 

Matthew S. Borman, 

Deputy Assistant Secretary for Export 

Administration. 

[FR Doc. 2021–20348 Filed 9–23–21; 8:45 am] 

BILLING CODE 3510–33–P 

DEPARTMENT OF COMMERCE 

International Trade Administration 

[A–351–849] 

Emulsion Styrene-Butadiene Rubber 

From Brazil: Final Results of 

Antidumping Duty Administrative 

Review; 2019–2020 

AGENCY: Enforcement and Compliance, 

International Trade Administration, 

Department of Commerce. 

SUMMARY: The Department of Commerce 

(Commerce) has continued to base the 

dumping margin for the sole respondent 

under review, ARLANXEO Brasil S.A. 

(ARLANXEO Brasil), on total adverse 

facts available (AFA), pursuant to 

sections 776(a) and (b) of the Tariff Act 

of 1930, as amended (the Act). The 

period of review (POR) is September 1, 

2019, through August 31, 2020. 

DATES: Applicable September 24, 2021. 

FOR FURTHER INFORMATION CONTACT: 

Drew Jackson, AD/CVD Operations, 

Office IV, Enforcement and Compliance, 

International Trade Administration, 

U.S. Department of Commerce, 1401 

Constitution Avenue NW, Washington, 

DC 20230; telephone: (202) 482–4406. 

SUPPLEMENTARY INFORMATION: 

Background 

On June 8, 2021, Commerce published 

the Preliminary Results.1 This 

administrative review covers one 

producer/exporter of subject 

merchandise, ARLANXEO Brasil. We 

invited interested parties to comment on 

the Preliminary Results.2 No party 

submitted comments on the Preliminary 

Results. Accordingly, the final results 

remain unchanged from the Preliminary 

Results. 

On August 9, 2021, after the issuance 

of the Preliminary Results, Commerce 

invited interested parties to comment on 

emulsion styrene-butadiene rubber (ESB 

rubber) grading, an issue raised by 

interested parties in the 2019–2020 

administrative review of ESB rubber 

from Mexico.3 Between August 19 and 

20, 2021, interested parties submitted 

comments on product grading.4

However, Commerce has applied total 

AFA in determining ARLANXEO 

Brasil’s weighted-average dumping 

margin in the instant administrative 

review. As such, the issue of product 

grading, which affects model matching 

in margin calculations, is moot because 

Commerce performed no margin 

calculations in this review.5 Therefore, 

Commerce has not addressed the issue 

of product grading in these final results 

of review. 

Commerce conducted this review in 

accordance with section 751(a)(1)(B) 

and (2) of the Act. 

Scope of the Order 

The merchandise covered by the 

Order is certain ESB rubber from