# Patent

## Title
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same

## Abstract

A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:

## Background
CROSS-REFERENCE TO RELATED APPLICATION
Korean Patent Application No. 10-2015-0100672, filed on Jul. 15, 2015, in the Korean Intellectual Property Office, and entitled: “Phosphonium Compound, Epoxy Resin Composition Including the Same and Semiconductor Device Prepared Using the Same,” is incorporated by reference herein in its entirety.
BACKGROUND
1. Field
Embodiments relate to a phosphonium compound, an epoxy resin composition including the same, and a semiconductor device prepared using the same.
2. Description of the Related Art
Transfer molding may be used as a method of packaging semiconductor devices, such as integrated circuits (ICs) and large scale integration (LSI) chips, with epoxy resin compositions to obtain semiconductor devices due to its advantages of low cost and suitability for mass production. In transfer molding, modification of epoxy resins or phenol resins as curing agents may lead to improvement in characteristics and reliability of semiconductor devices.
Such epoxy resin compositions include an epoxy resin, a curing agent, a curing catalyst, and the like. As the curing catalyst, imidazole catalysts, amine catalysts, and phosphine catalysts may be used.
SUMMARY
Embodiments are directed to a phosphonium compound, an epoxy resin composition including the same, and a semiconductor device prepared using the same.
The embodiments may be realized by providing a phosphonium compound represented by Formula 1:




wherein, in Formula 1, R1, R2, R3, and R4 are each independently a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; R5, R6, and R7 are each independently hydrogen, a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; and M is an alkali metal.
R1, R2, R3, and R4 may each independently be a C6 to C30 aryl group.
At least one of R1, R2, R3, and R4 may be substituted with a hydroxyl group.
M may be sodium or potassium.
The phosphonium compound represented by Formula 1 may be represented by one of the following Formulae 1a to 1h:
















The embodiments may be realized by providing an epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, wherein the curing catalyst includes the phosphonium compound according to an embodiment.
The epoxy resin may include a bisphenol A epoxy resin, a bisphenol F epoxy resin, a phenol novolac epoxy resin, a tert-butyl catechol epoxy resin, a naphthalene epoxy resin, a glycidylamine epoxy resin, a cresol novolac epoxy resin, a biphenyl epoxy resin, a linear aliphatic epoxy resin, a cycloaliphatic epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, a cyclohexane dimethanol epoxy resin, a trimethylol epoxy resin, or a halogenated epoxy resin.
The curing agent may include a phenol resin.
The curing agent may include a phenol aralkyl phenol resin, a phenol novolac phenol resin, a xyloc phenol resin, a cresol novolac phenol resin, a naphthol phenol resin, a terpene phenol resin, a polyfunctional phenol resin, a dicyclopentadiene-based phenol resin, a novolac phenol resin synthesized from bisphenol A and resorcinol, a polyhydric phenolic compound, an acid anhydride, or an aromatic amine.
The curing catalyst may be present in the epoxy resin composition in an amount of about 0.01 wt % to about 5 wt %, in terms of solid content.
The phosphonium compound may be present in the curing catalyst in an amount of about 10 wt % to about 100 wt %, based on a total weight of the curing catalyst.
The epoxy resin composition may have a curing shrinkage rate of less than about 0.34%, as calculated according to Equation 1:
<Equation 1>

Curing shrinkage=(|C−D/C)×100

wherein, in Equation 1, C is a length of a specimen obtained by transfer molding of the epoxy resin composition at 175° C. under a load of 70 kgf/cm2, and D is a length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.
The epoxy resin composition may have a storage stability of about 85% or more, as calculated according to Equation 2:
<Equation 2>

Storage stability=(F1/F0)×100

wherein, in Equation 2, F1 is a flow length in inches of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm2 in accordance with EMMI-1-66, and F0 is an initial flow length in inches of the epoxy resin composition.
The embodiments may be realized by providing a semiconductor device encapsulated with the epoxy resin composition according to an embodiment.
The embodiments may be realized by providing a method of encapsulating a semiconductor device, the method including encapsulating the semiconductor device with the epoxy resin composition according to an embodiment.



BRIEF DESCRIPTION OF THE DRAWINGS
Features will be apparent to those of skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:
FIG. 1 illustrates a cross-sectional view of a semiconductor device according to one embodiment.
FIG. 2 illustrates a cross-sectional view of a semiconductor device according to another embodiment.
FIG. 3 illustrates a cross-sectional view of a semiconductor device according to a further embodiment.
FIG. 4 illustrates a cross-sectional view of a semiconductor device according to yet another embodiment.
FIG. 5 illustrates a cross-sectional view of a semiconductor device according to yet another embodiment.



DETAILED DESCRIPTION
Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey exemplary implementations to those skilled in the art.
In the drawing figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when a layer or element is referred to as being “on” another layer or element, it can be directly on the other layer or element, or intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. Like reference numerals refer to like elements throughout.
As used herein, the term “substituted” in “substituted or unsubstituted” means that at least one hydrogen atom in the corresponding functional group is substituted or replaced with a hydroxyl group, a halogen atom, an amino group, a nitro group, a cyano group, a C1 to C20 alkyl group, a C1 to C20 haloalkyl group, a C6 to C30 aryl group, a C3 to C30 heteroaryl group, a C3 to C10 cycloalkyl group, a C3 to C10 heterocycloalkyl group, a C7 to C30 arylalkyl group, or a C1 to C30 heteroalkyl group. The term “halo” means fluorine, chlorine, iodine, or bromine.
As used herein, the term “aryl group” refers to a substituent in which all elements in the cyclic substituent have p-orbitals and the p-orbitals form a conjugated system. Aryl groups include mono- or fused functional groups (namely, rings of carbon atoms which share adjacent electron pairs). The term “unsubstituted aryl group” refers to a monocyclic or fused polycyclic C6 to C30 aryl group. Examples of unsubstituted aryl groups may include phenyl groups, biphenyl groups, naphthyl groups, naphthol groups, and anthracenyl groups.
As used herein, the term “heteroaryl group” means a C6 to C30 aryl group in which a ring comprises carbon atoms and 1 to 3 heteroatoms selected from nitrogen, oxygen, sulfur and phosphorus. Examples of heteroaryl groups may include pyridinyl, pyrazinyl, pyrimidyl, pyridazinyl, triazinyl, quinolinyl, isoquinolinyl, quinoxalinyl, acridinyl, quinazolinyl, cinnolinyl, phthalazinyl, thiazolyl, benzothiazolyl, isoxazolyl, benzisoxazolyl, oxazolyl, benzoxazolyl, pyrazolyl, indazolyl, imidazolyl, benzimidazolyl, purinyl, thiophenyl, benzothiophenyl, furanyl, benzofuranyl, and isobenzofuranyl.
As used herein, the term “hetero” refers to an atom selected from nitrogen, oxygen, sulfur, or phosphorus.
In accordance with an embodiment, a phosphonium compound may include, e.g., a phosphonium cation and an anion having silicon (Si) and an alkali metal at the same time. In an implementation, the phosphonium compound may be represented by Formula 1.




In Formula 1, R1, R2, R3, and R4 may each independently be or include, e.g., a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom. R5, R6, and R7 may each independently be or include, e.g., hydrogen, a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom. M may be, e.g., an alkali metal.
In an implementation, R1, R2, R3, and R4 may each independently be a C6 to C30 aryl group.
In an implementation, at least one of R1, R2, R3, and R4 may be substituted with a hydroxyl group.
In an implementation, M may be, e.g., sodium (Na) or potassium (K).
In an implementation, the phosphonium compound may be represented by one of the following Formulae 1a to 1h.
















According to an embodiment, the phosphonium compound may be included in a composition that includes, e.g., an epoxy resin, a curing agent, and/or an inorganic filler, so as to be used as a latent curing catalyst.
The phosphonium compound may help provide an epoxy resin composition capable of accelerating curing of an epoxy resin and a curing agent and capable of securing low temperature curability and high storage stability while minimizing viscosity change in a mixture including the epoxy resin, the curing agent and the like within desired ranges of time and temperature. For example, proceeding of curing reaction may cause an increase in viscosity and deterioration in flowability when the epoxy resin composition is liquid, and may exhibit viscosity when the epoxy resin composition is solid. The phosphonium compound may catalyze curing only at a desired curing temperature without any curing activity at temperature deviating from a desired curing temperature range, and it is possible to store the epoxy resin composition for a long time without an undesirable viscosity change.
In accordance with an embodiment, an epoxy resin composition may include, e.g., an epoxy resin, a curing agent, an inorganic filler, and/or a curing catalyst.
Epoxy Resin
In an implementation, the epoxy resin may have two or more epoxy groups per molecule. Examples of epoxy resins may include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, tert-butyl catechol type epoxy resins, naphthalene type epoxy resins, glycidyl amine type epoxy resins, cresol novolac type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, cycloaliphatic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane dimethanol type epoxy resins, trimethylol type epoxy resins, and halogenated epoxy resins. These epoxy resins may be used alone or in combination thereof. In an implementation, the epoxy resins may have two or more epoxy groups and one or more hydroxyl groups per molecule. In an implementation, the epoxy resins may include at least one of solid phase epoxy resins and liquid phase epoxy resins. In an implementation, the solid phase epoxy resin may be used.
In an implementation, the epoxy resin may be, e.g., a biphenyl type epoxy resin represented by Formula 2 or a phenol aralkyl type epoxy resin represented by Formula 3.




In Formula 2, R may be, e.g., a C1 to C4 alkyl group, and n may be, e.g., 0 to 7 on average.




In Formula 3, n may be, e.g., 1 to 7 on average.
In an implementation, the epoxy resin may be present in an amount of about 2 wt % to about 17 wt %, e.g., about 3 wt % to about 15 wt % or about 3 wt % to about 12 wt % in the composition in terms of solid content. Within this range, the composition may help secure curability.
Curing Agent
In an implementation, the curing agent may include, e.g., phenolaralkyl type phenol resins, phenol novolac type phenol resins, xyloc type phenol resins, cresol novolac type phenol resins, naphthol type phenol resins, terpene type phenol resins, multifunctional phenol resins, dicyclopentadiene-based phenol resins, novolac type phenol resins synthesized from bisphenol A and resol, polyhydric phenol compounds (e.g., tris(hydroxyphenyl)methane and dihydroxybiphenyl), acid anhydrides (e.g., maleic anhydride and phthalic anhydride), aromatic amines (e.g., meta-phenylenediamine, diaminodiphenylmethane and diaminodiphenylsulfone), or the like. In an implementation, the curing agent may be a phenol resin having one or more hydroxyl groups.
In an implementation, the curing agent may be a xyloc type phenol resin represented by Formula 4 or a phenolaralkyl type phenol resin represented by Formula 5.




In Formula 4, n may be, e.g., 0 to 7 on average.




In Formula 5, n may be, e.g., 1 to 7.
In an implementation, the curing agent may be present in an amount of about 0.5 wt % to about 13 wt %, e.g., about 1 wt % to about 10 wt % or about 2 wt % to about 8 wt % in the epoxy resin composition in terms of solid content. Within this range, the composition may help secure curability.
Inorganic Filler
In an implementation, the epoxy resin composition may further include an inorganic filler. The inorganic filler may help improve mechanical properties of the epoxy resin composition while reducing stress in the epoxy resin composition. Examples of the inorganic filler may include fused silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide, and glass fibers.
Fused silica having a low coefficient of linear expansion may be used with a view toward stress reduction. The fused silica refers to amorphous silica having a specific gravity of 2.3 or less. The fused silica may be prepared by melting crystalline silica or may include amorphous silica products synthesized from various raw materials. In an implementation, the inorganic filler may include about 40 wt % to about 100 wt % of a fused silica mixture based on the total weight of the inorganic fillers, wherein the fused silica mixture includes about 50 wt % to about 99 wt % of spherical fused silica having an average particle diameter of about 5 μm to about 30 μm and about 1 wt % to about 50 wt % of spherical fused silica having an average particle diameter of about 0.001 μm to about 1 μm. In an implementation, the inorganic filler may also be adjusted to a maximum particle diameter of about 45 μm, about 55 μm or about 75 μm, depending upon application of the epoxy resin composition. In an implementation, the spherical fused silica may include conductive carbon as a foreign substance on the surface of silica, and/or the spherical fused silica to incorporate a smaller amount of polar foreign substances.
In an implementation, the inorganic filler may be present in a suitable amount depending upon desired physical properties of the epoxy resin composition, e.g., moldability, low-stress properties, and high-temperature strength. In an implementation, the inorganic filler may be present in an amount of about 70 wt % to about 95 wt %, e.g., about 75 wt % to about 92 wt %, in the epoxy resin composition in terms of solid content. Within this range, the epoxy resin composition can secure good flame retardancy, flowability, and reliability.
Curing Catalyst
In an implementation, the epoxy resin composition may include a curing catalyst including the phosphonium compound represented by Formula 1. In an implementation, the phosphonium compound may be present in an amount of about 0.01 wt % to about 5 wt %, e.g., about 0.02 wt % to about 1.5 wt % or about 0.05 wt % to about 1.5 wt %, in the epoxy resin composition in terms of solid content. Within this range, the epoxy resin composition may help secure flowability without delaying time for curing reaction.
In an implementation, the epoxy resin composition may further include a non-phosphonium curing catalyst that does not contain phosphonium. Examples of non-phosphonium curing catalysts may include tertiary amines, organometallic compounds, organophosphorus compounds, imidazole, boron compounds, and the like. Examples of tertiary amines may include benzyldimethylamine, triethanolamine, triethylenediamine, diethylaminoethanol, tri(dimethylaminomethyl)phenol, 2,2-(dimethylaminomethyl)phenol, 2,4,6-tris(diaminomethyl)phenol, tri-2-ethyl hexanoate, and the like. Examples of organometallic compounds include chromium acetylacetonate, zinc acetylacetonate, nickel acetylacetonate, and the like. Examples of organophosphorus compounds may include tris-4-methoxyphosphine, triphenylphosphine, triphenylphosphinetriphenylborane, triphenylphosphine-1,4-benzoquinone adducts, and the like. Examples of imidazoles may include 2-methylimidazole, 2-phenylimidazole, 2-aminoimidazole, 2-methyl-1-vinylimidazole, 2-ethyl-4-methylimidazole, 2-heptadecyl imidazole, and the like. Examples of boron compounds may include triphenylphosphine tetraphenyl borate, tetraphenyl borate, trifluoroborane-n-hexylamine, trifluoroborane monoethylamine, tetrafluoroborane triethylamine, tetrafluoroboraneamine, and the like. In an implementation, it is possible to use 1,5-diazabicyclo[4.3.0]non-5-ene (DBN), 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU), and a phenol novolac resin salt. In an implementation, the organophosphorus compounds, the boron compounds, and the amines or imidazole curing accelerators may be used alone or in combination.
Adducts obtained by pre-reacting an epoxy resin or a curing agent may be used as the curing catalyst.
In an implementation, the phosphonium compound may be present in the curing catalyst in an amount of about 10 wt % to about 100 wt %, e.g., about 60 wt % to about 100 wt %, based on a total weight of the curing catalyst. Within this range, the epoxy resin composition may help secure flowability without delaying time for curing reaction.
In an implementation, the curing catalyst may be present in an amount of about 0.01 wt % to about 5 wt %, e.g., about 0.02 wt % to about 1.5 wt % or about 0.05 wt % to about 1.5 wt %, in the epoxy resin composition in terms of solid content. Within this range, the epoxy resin composition may help secure flowability without delaying time for curing reaction.
In an implementation, the composition may further include an additive. In an implementation, the additive may include, e.g., a coupling agent, a release agent, a stress reliever, a crosslinking enhancer, a leveling agent, and/or a coloring agent.
In an implementation, the coupling agent may include at least one of epoxysilane, aminosilane, mercaptosilane, alkylsilane, and alkoxysilane. In an implementation, the coupling agent may be present in an amount of about 0.1 wt % to about 1 wt % in the epoxy resin composition.
In an implementation, the release agent may include at least one of paraffin wax, ester wax, higher fatty acids, metal salts of higher fatty acids, natural fatty acids, and natural fatty acid metal salts. In an implementation, the release agent may be present in an amount of about 0.1 wt % to about 1 wt % in the epoxy resin composition.
In an implementation, the stress reliever may include at least one of modified silicone oil, silicone elastomers, silicone powder, and silicone resin, without being limited thereto. In an implementation, the stress reliever may be present in an amount of about 6.5 wt % or less, e.g., about 1 wt % or less or about 0.1 wt % to about 1 wt % in the epoxy resin composition. As the modified silicone oil, a suitable silicone polymer having good heat resistance may be used. In an implementation, the modified silicone oil may include about 0.05 wt % to about 1.5 wt % of a silicone oil mixture based on the total weight of the epoxy resin composition, wherein the mixture includes at least one selected from the group consisting of silicone oil having an epoxy functional group, silicone oil having an amine functional group, silicone oil having a carboxyl functional group, and a combination thereof. If the amount of the silicone oil is greater than 1.5 wt %, surface contamination occurs easily and lengthy resin bleed can be encountered. If the amount of the silicone oil is less than 0.05 wt %, there can be a problem in that sufficiently low modulus of elasticity cannot be obtained. In an implementation, silicone powder having a median particle diameter of about 15 μm or less may be used in that the powder may not deteriorate moldability. In an implementation, the silicone powder may be present in an amount of about 5 wt % or less, e.g., about 0.1 wt % to about 5 wt %, based on a total weight of the epoxy resin composition.
In an implementation, the additive may be present in an amount of about 0.1 wt % to about 10 wt %, e.g., about 0.1 wt % to about 3 wt %, in the epoxy resin composition.
The epoxy resin composition may be curable at low temperature. For example, a curing initiation temperature may be about 90° C. to about 120° C. Within this range, the epoxy resin composition may be sufficiently cured at low temperature, thereby securing curing at low temperature.
In an implementation, the epoxy resin composition may have a flow length of about 59 inches to about 80 inches, e.g., about 70 inches to about 78 inches, as measured using a transfer molding press at 175° C. under a load of 70 kgf/cm2 in accordance with EMMI-1-66. Within this range, the epoxy resin composition may be used for desired applications.
In an implementation, the epoxy resin composition may have a curing shrinkage rate of less than about 0.34%, e.g., about 0.01% to about 0.32%, as calculated according to Equation 1, below. Within this range, the curing shrinkage rate may be low, and the epoxy resin composition thus may be used for in a broad range of applications requiring such an epoxy resin composition in encapsulation of semiconductor devices, adhesive films, insulating resin sheets such as prepregs and the like, circuit substrates, solder resists, underfills, die bonding materials, and component replenishing resins.
<Equation 1>

Curing shrinkage=(|C−D|/C)×100

In Equation 1, C is the length of a specimen obtained by transfer molding of the epoxy resin composition at 175° C. under a load of 70 kgf/cm2, and D is the length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.
The epoxy resin composition may have a storage stability of about 85% or more, as calculated according to Equation 2.
<Equation 2>

Storage stability=(F1/F0)×100

In Equation 2, F1 is the flow length (in inches) of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm2 in accordance with EMMI-1-66, and F0 is the initial flow length (in inches) of the epoxy resin composition.
In the epoxy resin composition, the epoxy resin may be used alone or in the form of adducts, such as a melt master batch, obtained by pre-reacting the epoxy resin with an additive, such as a curing agent, a curing catalyst, a release agent, a coupling agent, and a stress reliever. In an implementation, the epoxy resin composition may be prepared by uniformly mixing all components of the resin composition using a suitable mixer, such as a Henschel mixer or a Lodige mixer, followed by melt-kneading in a roll mill or a kneader at about 90° C. to about 120° C., cooling, and pulverizing.
In an implementation, the epoxy resin composition according to an embodiment may be used in a broad range of applications requiring such an epoxy resin composition in encapsulation of semiconductor devices, adhesive films, insulating resin sheets such as prepregs and the like, circuit boards, solder resists, underfills, die bonding materials, and component replenishing resins.
Semiconductor Device
Another embodiments provides a semiconductor device encapsulated with the epoxy resin composition as set forth above.
In an implementation, the semiconductor device may include, e.g., quad flat packages (QFPs), quad flat no-lead packages (QFNs), small outline packages (SOPS), small outline no-lead packages (SONs), chip size packages (CSPs), or ball grid arrays (BGAs).
The semiconductor device according to an embodiment may be encapsulated with the epoxy resin composition.
FIG. 1 illustrates a cross-sectional view of a semiconductor device according to one embodiment. Referring to FIG. 1, a semiconductor device 100 according to this embodiment may include, e.g., a wiring board wiring board 10, bumps 30 formed on the wiring board 10, and a semiconductor chip 20 formed on the bumps 30. A gap between the wiring board 10 and the semiconductor chip 20 may be encapsulated with an epoxy resin composition 40. The epoxy resin composition may be an epoxy resin composition according to embodiments.
FIG. 2 illustrates a cross-sectional view of a semiconductor device according to another embodiment. Referring to FIG. 2, a semiconductor device 200 according to this embodiment may include, e.g., a wiring board 10, bumps 30 formed on the wiring board 10, and a semiconductor chip 20 formed on the bumps 30. A gap between the wiring board 10 and the semiconductor chip 20 and the entirety of a top surface of the semiconductor chip 20 may be encapsulated with an epoxy resin composition 40. The epoxy resin composition may be an epoxy resin composition according to embodiments.
FIG. 3 illustrates a cross-sectional view of a semiconductor device according to a further embodiment. Referring to FIG. 3, a semiconductor device 300 according to this embodiment may include, e.g., a wiring board 10, bumps 30 formed on the wiring board 10, and a semiconductor chip 20 formed on the bumps 30. A gap between the wiring board 10 and the semiconductor chip 20 and the entirety of a side surface of the semiconductor chip 20 except for a top surface of the semiconductor chip 20 may be encapsulated with an epoxy resin composition 40. The epoxy resin composition may be an epoxy resin composition according to embodiments of the present invention.
FIG. 4 illustrates a cross-sectional view of a semiconductor device according to yet another embodiment. Referring to FIG. 4, in a semiconductor device 400 according to this embodiment, a semiconductor chip 20 may be bonded to an upper surface of a die pad 50 through a cured die-bonding material 60 so as to be connected to a lead frame 80 through a wire 70. All of the semiconductor chip 20, the die pad 50, and the cured die-bonding material 60 may be encapsulated with an epoxy resin composition 40. The epoxy resin composition may be an epoxy resin composition according to embodiments.
FIG. 5 illustrates a cross-sectional view of a semiconductor device according to yet another embodiment. Referring to FIG. 5, a semiconductor chip 20 may be secured to an upper surface of a wiring board 10 through a cured die-bonding material 60. The semiconductor chip 20 may be connected to the wiring board 10 through a wire 70. Bumps 30 may be formed on a lower surface of the wiring board 10. Only the surface of the wiring board 10 with the semiconductor chip 20 mounted thereon may be encapsulated with an epoxy resin composition 40. The epoxy resin composition may be an epoxy resin composition according to embodiments.
In FIGS. 1 to 5, the size of each wiring board, die pad, bump, and semiconductor chip, the thickness of a layer of the cured die-bonding material, the numbers of bumps, the length of the wire and lead frame may be modified.
In an implementation, the semiconductor device may be encapsulated commonly with the epoxy resin composition by low-pressure transfer molding. In an implementation, the semiconductor device may also be molded by injection molding, casting, and the like.
The following Examples and Comparative Examples are provided in order to highlight characteristics of one or more embodiments, but it will be understood that the Examples and Comparative Examples are not to be construed as limiting the scope of the embodiments, nor are the Comparative Examples to be construed as being outside the scope of the embodiments. Further, it will be understood that the embodiments are not limited to the particular details described in the Examples and Comparative Examples.
EXAMPLE
Preparative Example 1
Preparation of Phosphonium Compound Represented by Formula 1a
48.1 g of 2,3-dihydroxynaphthalene was added to 50 g of ethanol (EtOH), followed by adding 21.6 g of 25% sodium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 41 g of tetraphenylphosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 78 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1a (yield: 95%).




1H NMR (300 MHz, DMSO) δ 8.01-7.91 (m, 4H), 7.84-7.69 (m, 16H), 7.33 (dd, J=6.0, 3.3 Hz, 6H), 6.92 (dd, J=6.0, 3.3 Hz, 6H), 6.48 (s, 6H).
Preparative Example 2
Preparation of Phosphonium Compound Represented by Formula 1b
48.1 g of 2,3-dihydroxynaphthalene was added to 50 g of ethanol (EtOH), followed by adding 28.1 g of 25% potassium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 43 g of tetraphenylphosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 79 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1b (yield: 89%).




1H NMR (300 MHz, DMSO) δ 8.04-7.96 (m, 4H), 7.82-7.73 (m, 16H), 7.39 (dd, J=6.1, 3.3 Hz, 6H), 6.99 (dd, J=6.1, 3.3 Hz, 6H), 6.53 (s, 6H).
Preparative Example 3
Preparation of Phosphonium Compound Represented by Formula 1c
48.1 g of 2,3-dihydroxynaphthalene was added to 50 g of ethanol (EtOH), followed by adding 21.6 g of 25% sodium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 43 g of triphenyl(4-hydroxyphenyl)phosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 80 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1c (yield: 91%).




1H NMR (300 MHz, DMSO) δ δ 7.95-7.91 (m, 3H), 7.82-7.65 (m, 12H), 7.48 (dd, J=12.3, 8.8 Hz, 6H), 7.30 (dd, J=6.0, 3.3 Hz, 2H), 7.14 (dd, J=8.8, 2.9 Hz, 6H), 6.89 (dd, J=6.0, 3.3 Hz, 2H), 6.44 (s, 6H).
Preparative Example 4
Preparation of Phosphonium Compound Represented by Formula 1d
48.1 g of 2,3-dihydroxynaphthalene was added to 50 g of ethanol (EtOH), followed by adding 21.6 g of 25% potassium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 43 g of triphenyl(4-hydroxyphenyl)phosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 77 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1d (yield: 88%).




1H NMR (300 MHz, DMSO) δ δ 7.91-7.85 (m, 3H), 7.73-7.60 (m, 12H), 7.41 (dd, J=12.1, 8.7 Hz, 6H), 7.27 (dd, J=6.0, 3.3 Hz, 2H), 7.10 (dd, J=8.7, 3.1 Hz, 6H), 6.83 (dd, J=6.0, 3.3 Hz, 2H), 6.40 (s, 6H).
Preparative Example 5
Preparation of Phosphonium Compound Represented by Formula 1e
33.0 g of pyrocatechol was added to 50 g of ethanol (EtOH), followed by adding 21.6 g of 25% sodium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 41 g of tetraphenylphosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 60 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1e (yield: 84%).




1H NMR (300 MHz, DMSO) δ 8.02-7.91 (m, 4H), 7.89-7.67 (m, 16H), 6.17 (s, 12H).
Preparative Example 6
Preparation of Phosphonium Compound Represented by Formula 1f
33.0 g of pyrocatechol was added to 50 g of ethanol (EtOH), followed by adding 28.1 g of 25% potassium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 41 g of tetraphenylphosphonium bromide previously dissolved in 50 g of ethanol (EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 57 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1e (yield: 80%).




1H NMR (300 MHz, DMSO) δ 8.12-7.99 (m, 4H), 7.88-7.63 (m, 16H), 6.23 (s, 12H).
Preparative Example 7
Preparation of Phosphonium Compound Represented by Formula 1 g
37.2 g of 4-methylcatechol was added to 50 g of ethanol (EtOH), followed by adding 21.6 g of 25% sodium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 41 g of tetraphenylphosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 59 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1 g (yield: 78%).




1H NMR (300 MHz, DMSO) δ 8.03-7.91 (m, 4H), 7.86-7.70 (m, 16H), 6.06-5.91 (m, 3H), 2.04 (s, 3H).
Preparative Example 8
Preparation of Phosphonium Compound Represented by Formula 1h
37.2 g of 4-methylcatechol was added to 50 g of ethanol (EtOH), followed by adding 28.1 g of 25% potassium methoxide solution, which in turn was completely dissolved while reacting at ambient temperature for 30 minutes. Then, 20.8 g of tetraethyl orthosilicate was added, followed by reaction at ambient temperature for 10 minutes. To the solution, a solution of 41 g of tetraphenylphosphonium bromide (previously dissolved in 50 g of EtOH) was slowly added and the mixture was allowed to further react for 30 minutes. The resulting grey solid was filtered to remove a solvent component of the solution at low pressure, thereby obtaining 56 g of a compound. The compound was identified based on NMR data as a compound represented by Formula 1g (yield: 74%).




1H NMR (300 MHz, DMSO) δ 8.11-7.98 (m, 4H), 7.96-7.81 (m, 16H), 6.03-5.94 (m, 3H), 2.14 (s, 3H).
Details of the components used in the Examples and Comparative Examples were as follows.
(A) Epoxy Resin
NC-3000 (produced by Nippon Kayaku), a biphenyl type epoxy resin, was used.
(B) Curing agent
HE100C-10 (produced by Air Water), a xyloc type phenol resin, was used.
(C) Curing Catalyst
Compounds prepared in Preparative Examples 1 to 8 were used as (C1) to (C8), respectively.
(C9) A phosphonium compound represented by the following Formula 6 was used.




(C10) Triphenyl Phosphine
(C11) An adduct of triphenyl phosphine and 1,4-benzoquinone
(D) Inorganic filler: A mixture of spherical fused silica having an average particle diameter of 18 μm and spherical fused silica having an average particle diameter of 0.5 μm (in a weight ratio of 9:1) was used.
(E) Coupling Agent
A mixture of (e1) mercaptopropyl trimethoxy silane, KBM-803 (produced by Shin-etsu Co., Ltd.) and (e2) methyl trimethoxy silane, SZ-6070 (produced by Dow Corning Chemical Co., Ltd.) was used.
(F) Additive
(f1) Carnauba wax as a mold release agent, and (f2) Carbon black, MA-600 (produced by Matsushita Chemical Co., Ltd.) as a coloring agent, were used.
Examples and Comparative Examples
The components were weighed as listed in Table 1 (unit: parts by weight) and uniformly mixed using a Henschel mixer to prepare first powder compositions. Then, each of the compositions was melt-kneaded by a continuous kneader at 95° C., cooled, and pulverized to prepare an epoxy resin composition for encapsulation of a semiconductor device.










TABLE 1










Comparative



Example
Example



















1
2
3
4
5
6
7
8
1
2
3






















(A)
8.5
8.5
8.5
8.5
8.5
8.5
8.5
8.5
8.5
8.5
8.5


(B)
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2



















(C)
C1
0.3
—
—
—
—
—
—
—
—
—
—



C2
—
0.3
—
—
—
—
—
—
—
—
—



C3
—
—
0.3
—
—
—
—
—
—
—
—



C4
—
—
—
0.3
—
—
—
—
—
—
—



C5
—
—
—
—
0.3
—
—
—
—
—
—



C6
—
—
—
—
—
0.3
—
—
—
—
—



C7
—
—
—
—
—
—
0.3
—
—
—
—



C8
—
—
—
—
—
—
—
0.3
—
—
—



C9
—
—
—
—
—
—
—
—
0.3
—
—



C10
—
—
—
—
—
—
—
—
—
0.3
—



C11
—
—
—
—
—
—
—
—
—
—
0.3


















(D)
85
85
85
85
85
85
85
85
85
85
85



















(E)
(e1)
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2



(e2)
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2


(F)
(f1)
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3



(f2)
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3


















Total
100
100
100
100
100
100
100
100
100
100
100









The epoxy resin compositions prepared in the Examples and Comparative Examples and packages in which the corresponding epoxy resin composition was employed were evaluated for their physical properties (listed in Table 2, below) by way of the following measuring methods.
(1) Flowability (inches): The flow length of each of the epoxy resin compositions was measured using a transfer molding press in a test mold at 175° C. under a load of 70 kgf/cm2 in accordance with EMMI-1-66. EMMI-1-66 is a method of evaluating the molding flow of a resin to injection or transfer molding in which the melt is injected into a spiral runner of constant trapezoidal cross section with numbered and subdivided centimeters marked along the runner. The mold is filled from a sprue at the center of the spiral and pressure is maintained until flow stops, the number just aft of the molded-spiral tip giving the flow distance. A higher measured value indicates better flowability.
(2) Curing shrinkage (%): Each of the epoxy resin compositions was molded using a transfer molding press in an ASTM mold for flexural strength specimen construction at 175° C. and 70 kgf/cm2 to obtain a molded specimen (125×12.6×6.4 mm). The specimen was subjected to post-molding curing (PMC) in an oven at 170° C. to 180° C. for 4 hours. After cooling, the length of the specimen was measured using calipers. Curing shrinkage of the epoxy resin composition was calculated according to Equation 1.
<Equation 1>

Curing shrinkage=(|C−D|/C)×100

In Equation 1, C is the length of the specimen obtained by transfer molding of the epoxy resin composition at 175° C. under a load of 70 kgf/cm2, and D is the length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.
(3) Glass transition temperature (° C.): Glass transition temperature of each of the epoxy resin compositions prepared in the Examples and Comparative Examples was measured using a thermomechanical analyzer (TMA). Here, the TMA was set to heat the resin composition at a rate of 10° C./min from 25° C. to 300° C.
(4) Moisture absorption (%): Each of the resin compositions prepared in the Examples and Comparative Examples was molded at a mold temperature of 170° C. to 180° C., a clamp pressure of 70 kg/cm2, a transfer pressure of 1,000 psi and a transfer speed of 0.5 cm/s to 1 cm/s for a curing time of 120 sec to obtain a cured specimen in the form of a disc having a diameter of 50 mm and a thickness of 1.0 mm. The specimen was subjected to post-molding curing (PMC) in an oven at 170° C. to 180° C. for 4 hours and allowed to stand at 85° C. and 85% RH for 168 hours. The weights of the specimen before and after moisture absorption were measured. Moisture absorption of the resin composition was calculated according to Equation 3.
<Equation 3>

Moisture absorption (%)=[(Weight of the specimen after moisture absorption−Weight of the specimen before moisture absorption)÷(Weight of the specimen before moisture absorption)]×100.

(5) Adhesive strength (kgf): A copper metal element having a size adapted to a mold for adhesive strength measurement was prepared as a test piece. Each of the resin compositions prepared in the Examples and Comparative Examples was molded on the test piece at a mold temperature of 170° C. to 180° C., a clamp pressure of 70 kgf/cm2, a transfer pressure of 1,000 psi, and a transfer speed of 0.5 cm/s to 1 cm/s for a curing time of 120 sec to obtain a cured specimen. The specimen was subjected to post-molding curing (PMC) in an oven at 170° C. to 180° C. for 4 hours. The area of the epoxy resin composition in contact with the specimen was 40±1 mm2. The adhesive strength of the epoxy resin composition was measured using a universal testing machine (UTM). 12 specimens of each composition were produced. After the measurement procedure was repeated, the measured adhesive strength values were averaged.
(6) Degree of cure (Shore-D): Each of the epoxy resin compositions was cured using a multi-plunger system (MPS) equipped with a mold at 175° C. for 50 sec, 60 sec, 70 sec, 80 sec, and 90 sec to construct exposed thin quad flat packages (eTQFPs), each including a copper metal element having a width of 24 mm, a length of 24 mm and a thickness of 1 mm. The hardness values of the cured products in the packages on the mold according to the curing periods of time were directly measured using a Shore D durometer. A higher hardness value indicates better degree of cure.
(7) Storage stability (%): The flow length (in inches) of each of the epoxy resin compositions was measured in accordance with the method described in (1) while storing the compositions for 3 days in a thermo-hygrostat set to 25° C./50% RH and measuring every 24 hours. Percent (%) of the flow length after storage to the flow length immediately after preparation of the composition was calculated. A higher value indicates better storage stability. Storage stability after 72 hours of the epoxy resin composition was calculated according to Equation 2.
<Equation 2>

Storage stability=(F1/F0)×100

In Equation 2, F1 is the flow length (in inches) of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm2 in accordance with EMMI-1-66, and F0 is the initial flow length (in inches) of the epoxy resin composition.
(8) Reliability: Each of the eTQFP packages for the evaluation of flexural properties was dried at 125° C. for 24 h. After 5 cycles of thermal shock testing (1 cycle refers to a series of exposures of the package to −65° C. for 10 min, 25° C. for 10 min, and 150° C. for 10 min), the package was allowed to stand at 85° C. and 60% RH for 168 hours and treated by IR reflow three times at 260° C. for 30 sec (preconditioning). After preconditioning, the occurrence of external cracks in the package was observed using an optical microscope, and the occurrence of peeling between the epoxy resin composition and a lead frame was evaluated by scanning acoustic microscopy (C-SAM) as a non-destructive test method. External cracks of the package or peeling between the epoxy resin composition and the lead frame mean that reliability of the package cannot be guaranteed.










TABLE 2










Comparative



Example
Example


















Evaluation item
1
2
3
4
5
6
7
8
1
2
3






















Basic
Flowability (inch)
75
71
74
70
73
69
78
68
66
52
58


physical
Curing shrinkage (%)
0.31
0.32
0.31
0.32
0.31
0.32
0.31
0.30
0.34
0.42
0.40


properties
Glass transition temp. (° C.)
123
123
124
122
124
122
123
121
123
121
122



Moisture absorption (%)
0.25
0.25
0.24
0.24
0.24
0.25
0.25
0.25
0.24
0.25
0.26



Adhesive strength (kgf)
77
74
75
73
76
74
76
74
74
72
74





















Evaluation
Degree of cure
50
sec
73
72
71
70
71
69
70
69
66
52
60


of
(Shore-D)
60
sec
74
73
73
71
73
70
71
71
73
60
64


packages
according to
70
sec
76
75
76
73
75
74
76
73
76
64
66



curing time
80
sec
77
77
77
75
77
76
77
76
76
67
70




90
sec
78
78
78
76
78
77
77
77
76
67
71



Storage
24
hr (%)
98
97
98
97
97
97
98
97
92
90
92



stability
48
hr (%)
94
95
94
94
94
95
96
95
89
84
88




72
hr (%)
92
93
93
92
93
92
93
93
84
74
79





















Reliability
Number of
0
0
0
0
0
0
0
0
0
0
0




packages




suffering




cracking




Number of
0
0
0
0
0
0
0
0
5
45
20




packages




suffering




peeling




Number of
88
88
88
88
88
88
88
88
88
88
88




tested




semiconductors










It may be seen that the epoxy resin compositions prepared in Examples 1 to 8 had higher flowability and lower curing shrinkage. In addition, it may be seen that the epoxy resin compositions of Examples 1 to 8 had a high degree of cure even in shorter curing periods of time, in view of curability for each curing period of time. For storage stability, it may be seen that the epoxy resin compositions of Examples 1 to 8 exhibited less change in flowability after 72 hours of storage. Further, it may be be seen that the epoxy resin compositions of Examples 1 to 8 did not suffer from cracking (and thus had excellent crack resistance) and did not suffer from peeling (and thus had excellent moisture resistance reliability.)
The compositions prepared in Comparative Examples 1 to 3 (not including the phosphonium compound represented by Formula 1) had low flowability and high curing shrinkage, had low curability for each curing period of time, and low storage stability when used in a package. Therefore, it may be seen that the compositions of Comparative Examples 1 to 3 may not achieve desired effects.
By way of summation and review, with the trend toward compact, lightweight, and high performance electronic devices, high integration of semiconductor devices has been accelerated year by year. Surface mounting of semiconductor devices may be facing increasing demand. Packaging materials for semiconductor devices may exhibit rapid curability to help improve productivity and storage stability to improve handling performance during distribution and storage.
The embodiments may provide a compound for curing catalysts which is capable of accelerating curing of an epoxy resin and curing of an epoxy resin at low temperature while minimizing viscosity change in a mixture including the compound, an epoxy resin, a curing agent, and the like even within desired ranges of time and temperature, thereby ensuring that the epoxy resin composition obtained after curing at high temperature does not exhibit an undesirable deterioration in moldability, mechanical, electrical, and chemical properties of molded products due to decrease in flowability and has high storage stability.
The embodiments may provide a compound for curing catalysts capable of accelerating curing of an epoxy resin, having good flowability upon molding and high curing strength, and capable of being rapidly cured.
The embodiments may provide a compound for curing catalysts capable of accelerating curing of an epoxy resin at low temperature.
The embodiments may provide a compound for curing catalysts having high storage stability, which may catalyze curing only at a desired curing temperature without exhibiting any curing activity at a temperature deviating from the desired curing temperature.
Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, as would be apparent to one of ordinary skill in the art as of the filing of the present application, features, characteristics, and/or elements described in connection with a particular embodiment may be used singly or in combination with features, characteristics, and/or elements described in connection with other embodiments unless otherwise specifically indicated. Accordingly, it will be understood by those of skill in the art that various changes in form and details may be made without departing from the spirit and scope of the present invention as set forth in the following claims.

## Claims

1. A phosphonium compound represented by Formula 1:



wherein, in Formula 1,
R1, R2, R3, and R4 are each independently a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom;
R5, R6, and R7 are each independently hydrogen, a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; and
M is an alkali metal.

2. The phosphonium compound as claimed in claim 1, wherein R1, R2, R3, and R4 are each independently a C6 to C30 aryl group.

3. The phosphonium compound as claimed in claim 2, wherein at least one of R1, R2, R3, and R4 is substituted with a hydroxyl group.

4. The phosphonium compound as claimed in claim 1, wherein M is sodium or potassium.

5. The phosphonium compound as claimed in claim 1, wherein the phosphonium compound represented by Formula 1 is represented by one of the following Formulae 1a to 1h:

6. An epoxy resin composition, comprising:
an epoxy resin;
a curing agent;
an inorganic filler; and
a curing catalyst, wherein the curing catalyst includes the phosphonium compound as claimed in claim 1.

7. The epoxy resin composition as claimed in claim 6, wherein the epoxy resin includes a bisphenol A epoxy resin, a bisphenol F epoxy resin, a phenol novolac epoxy resin, a tert-butyl catechol epoxy resin, a naphthalene epoxy resin, a glycidylamine epoxy resin, a cresol novolac epoxy resin, a biphenyl epoxy resin, a linear aliphatic epoxy resin, a cycloaliphatic epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, a cyclohexane dimethanol epoxy resin, a trimethylol epoxy resin, or a halogenated epoxy resin.

8. The epoxy resin composition as claimed in claim 6, wherein the curing agent includes a phenol resin.

9. The epoxy resin composition as claimed in claim 6, wherein the curing agent includes a phenol aralkyl phenol resin, a phenol novolac phenol resin, a xyloc phenol resin, a cresol novolac phenol resin, a naphthol phenol resin, a terpene phenol resin, a polyfunctional phenol resin, a dicyclopentadiene-based phenol resin, a novolac phenol resin synthesized from bisphenol A and resorcinol, a polyhydric phenolic compound, an acid anhydride, or an aromatic amine.

10. The epoxy resin composition as claimed in claim 6, wherein the curing catalyst is present in the epoxy resin composition in an amount of about 0.01 wt % to about 5 wt %, in terms of solid content.

11. The epoxy resin composition as claimed in claim 6, wherein the phosphonium compound is present in the curing catalyst in an amount of about 10 wt % to about 100 wt %, based on a total weight of the curing catalyst.

12. The epoxy resin composition as claimed in claim 6, wherein the epoxy resin composition has a curing shrinkage rate of less than about 0.34%, as calculated according to Equation 1:
<Equation 1>


Curing shrinkage=(|C−D|/C)×100


wherein, in Equation 1, C is a length of a specimen obtained by transfer molding of the epoxy resin composition at 175° C. under a load of 70 kgf/cm2, and D is a length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.

13. The epoxy resin composition as claimed in claim 6, wherein the epoxy resin composition has a storage stability of about 85% or more, as calculated according to Equation 2:
<Equation 2>


Storage stability=(F1/F0)×100


wherein, in Equation 2, F1 is a flow length in inches of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm2 in accordance with EMMI-1-66, and F0 is an initial flow length in inches of the epoxy resin composition.

14. A semiconductor device encapsulated with the epoxy resin composition as claimed in claim 6.

15. A method of encapsulating a semiconductor device, the method comprising encapsulating the semiconductor device with the epoxy resin composition as claimed in claim 1.