SYRETT DECLARATION

EXHIBIT 4

REDACTED VERSION

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 1 of 33
From: 

Sent: 

To: 

Arda Ian, Kayvan < kayvan.ardalan@bain.com > 

Tuesday, July 07, 2015 1:51 AM 

Faintuch, Amir 

QX0092 

Cc: Evans, Aicha; Topol, Robert J; Tan, Hang; Hill, Brice; Miller, Chi K; Sasaki, Steven K; 

Pandey, Parth 

Subject: RE: PEG Benchmarking 

Attachments: 150702 iCDG Benchmarking vShared (3).pptx 

All, 

Attached is the latest rev of the material. Please feel free to come back to me with questions/comments. Wil l greatly 

appreciate your input. 

Thanks to Parth and Steve for helping on Intel resource levels. 

Best, 

Kayvan 

-----Original Message-----

From: Faintuch, Amir [mailto:amir.faintuch@intel.com] 

Sent: Monday, June 22, 2015 11:39 AM 

To: Arda Ian, Kayvan 

Cc: Evans, Aicha; Topol, RobertJ; Tan, Hang; Hill, Brice; Miller, Chi K 

Subject: Re: PEG Benchmarking 

Kayvan 

Thx. 

One more at to look at it is that the assumptions during 2011-2013 were also very conservative. 

Even if the numbers are less then the estimated comparisons of 9.5-lOk which I believe is accurate and let's assume it's 

only 8k ( very conservative) still iCDG is missing -1500-2000 HC. (fora smaller output) Amir 

On Jun 19, 2015, at 10:56 AM, Arda Ian, Kayvan <kayvan.ardalan@bain.com<mailto:kayvan.ardalan@bain.com» wrote: 

Amir, 

Thanks. We will work with Rob and team and get to the bottom of this quickly. It's relatively straightforward. 

Stacy is recalling work from 2011 and 2012 where TOTAL SOC HC was similar across both companies. QCOM thru 

acquisition and aggressive hiring has ramped up headcount significantly. Chart below shows total mobile HC by year for 

both companies. 

[cid:image001.png@01DOAA7E.99733590] 

We reviewed this work with Chi and Josh last year prior to the 2015 plan conversations. Now the 'double click' to see 

how Aicha group fairs vs QCOM is what you are referring to. 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957504 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 2 of 33
QX0092 

A few important points to add to this discussion: 

* Our product output is significantly less than QCOM 

* While Aicha group is smaller, the chart above suggests that other areas in PEG are likely bigger than comp 

* Finally, QCOM is going through a cost transformation program and I would expect that their HC will reduce 

somewhere in the 10-15% range 

We will have all of this clearly spelled out and make the math tie so there is no confusion and no information 

asymmetry. 

Best, 

Kayvan 

From : Faintuch, Amir [mailto:amir.faintuch@intel.com] 

Sent: Friday, June 19, 2015 9:55 AM 

To: Arda Ian, Kayvan; Evans, Ai cha; Topal, Robert J 

Cc: Tan, Hang; Hill, Brice; Miller, Chi K; Faintuch, Amir 

Subject: RE: PEG Benchmarking 

Importance: High 

Kayvan 

Thanks .. I am leaving tomorrow on vacation and work out of Israel for few weeks 

I talked to Aicha and Rob on feedback we got from Stacy that past Bain analysis indicated that our cellular spend was 

matching competition. 

Your recent (good) analysis indicates QCOM at 9.5-lOK and MTK at 8K+ Vs. Intel so clearly we are underspending to 

meet comp. w/ the apple to apple road maps. 

David C also confirmed that in the past Bain advice Intel that the spending was similar to the comp .... hence come the 

question (info) we need to address - why we believe we have such a large gap Vs our past analysis 

I think that the gap is real and that is a real issue in our ability to execute with the budget we have ... we face it every day 

now ... 

Pis work w/ Rob and team on that task .. we need to get to the bottom of it by m/o next week pis Thx much for reaching 

out Amir 

From : Ardalan, Kayvan [mailto:kayvan.ardalan@bain.com] 

Sent: Thursday, June 18, 2015 2:17 PM 

To: Faintuch, Amir 

Cc: Tan, Hang 

Subject: PEG Benchmarking 

Amir, 

I wanted to get time with you to review the past and current work we have done on PEG benchmarking. Who should I 

coordinate with to get on your calendar? 

2 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957505 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 3 of 33
Best, 

Kayvan Ardalan, Ph.D. 

Partner 

Bain & Company, Inc. I 1901 Ave of the Stars I LA, CA 90067 I USA 

tel : (1) 310 229 3086 mobile: (1) 310 962 4360 mailto:kayvan.ardalan@bain.com I web: 

www.bain.com<http://www.bain.com> 

Assistant: Evelyn Roman 

Tel: {310) 229-3121 

mailto:evelyn.roman@bain.com<mailto:kayvan.ardalan@bain.com> 

QX0092 

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This e-mail, including any attachments, contains confidential information of Bain & Company, Inc. ("Bain") and/or its 

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3 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957506 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 4 of 33
QX0092 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957507 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 5 of 33
QX0092 

Executive Summary 

• Historically, Intel and QCOM investment in mobile SOC has been on par but 

QCOM product output 2-3X Intel 

• In 2015, QCOM mobile SOC HC expected to be 10-20% greater than Intel 

driven by: 

- QCOM aggressive hiring to maintain mobile leadership & CSR acquisition 

- Intel re-org of MCG and de-scoping of BXT leading to migration of HC to Core products 

• This difference is particularly pronounced within iCDG (modem, CNV & SoFIA) 

- iCDG and QCOM comparable HC at -8k and -1 Ok, respectively (BB only) 

• However, Intel overall mobile productivity still lags QCOM by -50°/o, largely 

driven by Intel supporting multiple architectures (e.g. SoFIA, BXT, CHV) 

• To address HC gap, Intel should address the capabilities gap while exploring 

options of converging arch. and driving engineering efficiencies throughout PEG 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957508 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 6 of 33
Mobile engineering HC has seen steady growth 

Intel Qualcomm 

Mobile Engineering HC CAGR Mobile Engineering HC 

25 ' 12-'14 25 2015 BB HC reduced Total 9% +15% -10% -15% 

due to re-org. & 101 c-o-· Broxton de-scoping +30% .-v 19 .. 6k : 

20 20 10+ ; CSR i 

tv 16.7k "-'16.7k GB -10% "'17 . Ok . · · . ;!~_!_~_

1 • 15 15 

GB not GB not 

avail. avail. 

10 10 

BB 14% 

5 5 

0 0 

2011 2012 2013 2014 2015F 2011 2012 2013 2014 2015F 

Blue .-v8.8k "'11.0k N/A rv l4.2k rvl4.Qk Blue rv9,2k rv ll.5k rv l 5.0k .-v 17.3k N/A Badges Badges 

Green N/A "'3. lk N/A "'2.5k "'2.7k Green N/A rv l.Sk "'2.0k rv2.3 k N/A Badges Badges 

Notes: QCOM '11-'12 HC excludes all Corp R&D {27% of rev) and '13-'14 includes mobile Corp R&D with <3yr time-to-rev. 

*Total and BB CAGR includes HC from the CSR acquisition. 

Source: linkedl n rofi les· ualcomm benchmarkin · ex ert interviews· lit search 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

CAGR* 

'12-'l~ 

Total 23% 

GB 24% 

BB 23% 

QX0092 

0 Aggressive hiring between 2012 

and 2013 aimed at maintaining 

mobile leadership and mirroring 

top-line growth 

2012 Earnings Call: 

"Leadership across multiple 

technologies required to succeed in 

mobile remains our strategic priority 

for our business, and we are 

increasing our R&D investments in 

fiscal 2013, including investments in 

our modem, the AP and driving new 

process technologies, as well as our 

reference design effort. 11 

Steven M. Mollenkopf 

President and COO, Qualcomm 

8 20 13 to 2014 increase driven by 

CSR acquisition adding another 

1K, primarily in connectivity 

e Qualcomm in the middle of a 

cost transformat ion program 

(investor activism); Mobile R&D 

likely to be cut by 10- 15% 

I NTEL-QCOM007957509 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 7 of 33
Intel lagging in product output 

INTEL 

Smartphone & Tablet SOC unique dies 

(by scheduled PRQ date) 

8 

6 

4 

2 

0 2011 

SKUs 2 

Cumulative 10-12 Complexity 

OS Support 

SKU Type 

- Base/ New Arch 

- Die Change 

IXJ Canceled 

.. Schedule slips 

2012 

4 

28-32 

Android/Linux, 

Process Node 

- - 20nm 

m m 

2013 2014 

8 8 

18-20 40-42 

Windows Phone, Windows 

3 

2015 

TBD 

TBD 

QUALCOMM 

Smartphone & Tablet SOC unique dies 

(by sampling date) 

8 

8 

6 

4 

2 

0 2011 2012 2013 2014 

SKUs 10 14 32 12 

Cumulative 15-20 25-30 30-35 >45 Complexity 

QX0092 

2015 

N/A 

N/A 

OS Support Android/ Linux, Windows Phone, Windows RT 

Note: Cherrytrail Die 1 1st customer PRQ targeted for WW'52 2014, *BXT proof-of-concept stepping in 2015, PRQ slipped to Ql/2 2016 

Source: Intel roadmaps, QCOM website, pdadb.net, lit search, Bain Analysis 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY INTEL-QCOM007957510 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 8 of 33
Comparison of iCDG comparable R&D investment 

SoFIA/GNV /WWAN/CNVt Qualcomm 

As of date 

Comparable R&D HC 

Super Burden Rate {$/yr)* 

SoC 

Modem 

CNV 

Process 

node 

Total R&D $ 

3 Year Unique Die Output 

{'15-17) 

Average Die Complexity 

3 Year Unique Die Output 

('15- 17) 

ITM relative to QCOMl 

3 Year Unique Die Output 

('15- 17) 

Process node cadence 

Node intercept relative2 

to initial node availability 

R&D HC / Cumulative Unique Dies 

(Soc, WWAN, & CNV) 

Note: Temp/green badge employees not included in HC; 

Current 2014 

7.7k N9.Sk 

rv$23Qk 

rv$2.2B 

5 "' 15-17** 

4-5 

,.,.,,3 ,.,.,,3 

< 1 year NA 

8 5-7 

24-48 Months 24-48 Months 

""24 Months 24-36 Months 

484 380 

t Headcount includes all individuals working on iCDG Related products: SoFIA, GNV, WWAN, or CNV (including CCG/SSG). 

*super burden rate includes salary, BTI, and other per BB overhead; Qualcomm super burden is segment specific 

* *details of die output are in backup 1Intel has closed the gap to QCOM on modem feature releases to under 1 year, MDTK at N 3 years 

2Defined as the time between process qualification and first product PRQ 

Source: Bain Analysis; Linkedln; Analyst Reports; PECA 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE A ITORNEYS' EYES ONLY 

QX0092 

2015 MTK comparable HC 

expected to be N8.5k (15-

20% increase from ' 14) 

I MediaTek 

2014 

,v].25k 

rv$ 140k 

-$1.0B 

rv20-24** 

rv 4-5 

rv2 

rv3 Years 

3-5 

24-48 Months 

24-36 Months 

259 

I 

INTEL-QCOM007957511 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 9 of 33
QX0092 

Intel overall mobile productivity lags QCOM by -50%; gap narrower 

for iCDG at -20% 

All Mobile 

Mobile HC ('12-' 14 avg) / unique Soc 

dies ('12-' 14 avg) 

-49% 

6K 

5.1 

4 

2 

0 

I ntel QCOM 

Mobile HC ('12-' 14 avg) / Soc SKUs 

{'12-' 14 avg) 

3K -63% 

2.3 

2 

1 

0 

Intel QCOM 

Notes: Intel HC data unavailable for 2013; therefore only 2012 and 2014 were used for Intel's productivity calculation. 

Source: Linkedl n profiles; Qualcomm benchmarking; expert interviews; lit search 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

iCDG 

iCDG HC ('15) / unique dies including Soc, 

WWAN and CNV ( ' 15-' 17 cumulative) 

600 -21% 

500 484 

400 

300 

200 

100 

0 

Intel QCOM 

(iCDG) (iCDG comp.) 

INTEL-QCOM007957512 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 10 of 33
iCDG projected R&D spend as 0 

Revenue 

R&D spe 

Note: Qualcomm includes $4.38 in mobile R&D expense 

Source: Bain Analysis; Linkedln; Analyst Reports 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

$18.78 

$4.38 

2014 

20% 

MediaTek (iCDG 

Comparable) 

$5.08 

$1.08 

QX0092 

INTEL-QCOM007957513 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 11 of 33
QX0092 

Breakdown of Intel current mobile R&D HC 

INTEL MOBILE R&D HEADCOUNT AND 

DIE OUTPUT BY SEGMENT 

Mobile R&D headcount {'15) and unique die 

output {'15-'17 cumulative) 

100% 

80 

60 

40 

20 

0 

14k 

Headcount 

(BB Only) 

21 dies 

Die Output 

HC per 

Unique Die 

Overall: 0 . 7k 

iCDG: O.Sk 

,------------------ I 

: *Other iCDG includes : 

: HC outside iCDG 

, working on iCDG , I I 

, products (e.g. CCG) , ·------------------_, 

POTENTIAL ACTION IMPLICATIONS 

0 Address capability gaps 

- Hire externally to bring in capabilities required 

to fill the gaps 

f) De-scope/ converge architectures 

- Explore options on BXT, CHV - understand 

tradeoffs 

- Convergence of architectures to focus on iCDG 

products can free up over 2k functional HC 

(assumes IP HC will stay in their roles) 

E) Drive engineering efficiencies 

throughput PEG 

- Cutting productivity gap vs. QCOM in half can 

free up over 3k HC 

Note: Assumes IP groups for CPU, GPU & Media, Imaging, and Other IP have not changed from November 2014 benchmarking. 

iCDG Products include SOFIA, GNV, WWAN, and CNV. 

Source: Bain Analysis 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957514 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 12 of 33
Next Steps 

• Further understand tradeoffs from de-scoping/converging architectures -

impact on resource, revenue, etc. 

• Develop plans to accelerate engineering efficiencies across PEG 

QX0092 

• Determine HC plan for iCDG that differentiates between capability and pure 

HC gaps 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY INTEL-QCOM007957515 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 13 of 33
Appendix 

Additional data on Intel & comp. R&D HC allocation, product output 

Detailed product roadmap of QCOM, MTK, Intel 

Benchmarking methodology & function category definition 

QX0092 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY INTEL-QCOM007957516 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 14 of 33
Breakdown of Intel vs. QCOM mobile R&D HC 

CATEGORY INTEL QCOM 

2,469 3,600-3,800 

1,749 2, 150-2,450 

415 500-600 

1,374 1,000-1,200 

484 400-450 

1,538 1,200-1,500 

8,029 ( 570/o ) "'9,400 ( 540/o) 

780 1,500- 1,700 

976 1,600- 1,800 

380 100-200 

3,838 4,300-4 ,600 

Total Soc Complexity 40-42 > 45 

Notes: Qualcomm figures as of November 2014 *QCOM DSP 300-400HC. **Based on 2013 Qualcomm Sustainability Report. Includes HC from 

recent acquisitions, including: Wilocity, Black Sand, and Arteris. Does not include IoT/Embedded or Corporate R&D functions. CNV and Other IP 

include HC added through the CSR acquisition. 

Source: Linkedln profiles; expert interviews; lit search 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

HC DIFFERENCE 

(1, 150-1,350) 

(400-700) 

( 100-200) 

150-350 

50-100 

(700-900) 

(600-800) 

200-300 

(700- 1,000) 

Company D w/higher 

functional HC 

INTEL-QCOM007957517 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 15 of 33
Detailed breakdown of Intel current mobile R&D HC 

iCDG PRODUCTS 

HC outside iCDG OTHER MOBILE 

CATEGORY iCDG HC on iCDG products {BXT, CHV, ANN) 

2,469 

1,749 

415 

1,374 

2 482 

288 1,250 

360 10 410 

331 75 570 

100 90 190 

707 345 1,168 

618 600 400 

Note: Assumes IP groups for CPU, GPU & Media, Imaging, and Other IP have not changed from November 2014 benchmarking. 

iCDG Products include SOFIA, GNV, WWAN, and CNV. 

Source: Bain Analysis 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

TOTAL MOBILE 

2,469 

1,749 

415 

1,374 

484 

1,538 

780 

976 

380 

1,970 

1,618 

INTEL-QCOM007957518 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 16 of 33
PEG resources by segment and function 

100% 

80 

60 

40 

20 

0 

Mobile R&D accounts for 

,..., 50% of PEG staff 

6 .6k 

Val & Test 

soc Int 

Cust.-Facing Eng. 

Platform I nt 

4.6k 

Soc Int 

Imaging 

Val & Test 

iCDG Other Mobile Atom 

(SoFIA, GLV, WWAN, CNV) (BXT, CHV, ANN) 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

12.2k 

Other Products 

(Core) 

QX0092 

Total = 23.4K 

I Functional Groups I 

IP Groups 

INTEL-QCOM007957519 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 17 of 33
QCOM: comparable R&D at -$2.2B and 9-1 Ok HC 

Qualcomm Mobile Headcount 

(k employees) 

20K 

16-18 

15 

10 

5 

0 

2014 Total 

Mobile R&D 

Corresponding 

R&D Spend "'4 .3B 

($8) 

(2.8-3.4) Platform Int 

Val & Test 

(3.7-4.5) (0.4-0.5) 

Adjustments for scope of activities 

Non-comparable Perf Socs Customer 

IP Design Development** Support/ FAE 

"'(0.9B) tv{1.2B) "'(0. 1B) 

QCOM 2014 

Comparable 

"'2 .2B 

Note: HC includes 650-750 heads from the CSR acquisition. Excludes HC dedicated to snapdragon 800 series products, all other 

products assumed comparable to iCDG. Temp/green badge employees not included. 100% of GPU & Media, CPU, and Imaging 

excluded. All but 300 employees from Other IP (DSP, Audio, Security, etc.) excluded. 60% of Platform Int., Validation & Test, and Soc 

Integration excluded as part of Snapdragon 800. 50% of Customer Support/FAE excluded as part of Snapdragon 800. 

Source: Bain Analysis; Llnkedin; Analyst Reports 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

PRELIMINARY DIRECTIONAL 

FUNCTIONAL BREAKDOWN 

Total 9k-10k 

DA/TFM 100-150 

Other IP* 300-350 

Cust. Facing 400-450 

SoC I nt. 600-650 

Val. & Test 650-700 

Platform I nt. 1,350-1,500 

CNV 2,150- 2,400 

WWAN 3 ,450-3 ,800 

· t I 14 

I NTEL-QCOM007957520 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 18 of 33
QX0092 

MediaTek: comparable R&D at -$1.0B and 6.5-8k HC 

MediaTek Headcount 

(2014, k employees) 

10 

9.5-10.5 

8 

6 

4 

2 

(1.5-2.0) (0.3-0.4) 

(0.4-0.8) 

Adjustment for scope of activities 

Expected mobile 

R&D growth of 

15%-20% for 

2015 

6.5-8.0 

SoC Int. 

Other 

o....._ _________________________________ _ 

Total R&D DTV 

Corresponding 

R&D S pend "'1.48 "'(0 .28) 

($8 ) 

PC Optical Other 

"'(0 . 18) "'(0 . 18) 

MTK 2014 

Comparable 

Nl.08 

Note: Temp/green badge employees not included. Comparable headcount excludes 100% of the follow groups: DTV (mStar 

acquisition), PC Optical, ISP, Media, Display, and Other IP. Soc Int., WWAN, and CNV allocation based on Linkedin benchmarking 

*Other includes consumer DVD, LCD monitor, STB, etc. 

Source: Bain Anal sis· Linkedi n· Anal st Re orts · Lit Search 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

PRELIMINARY DIRECTIONAL 

MTK heavily investing in 

mobile R&D in '15 to fund 

international expansion 

"Higher spending continues in 

2015 for [MediaTek] to stay 

aggressive on L TE. " 

Credit Suisse, Feb 2015 

"The meaningful part [ of R&D 

increase] we'll still be 

investing into our handset 

business ... our market share 

is still very low. That's why 

we 're trying to increase the 

investment to try to grab 

this [L TE} opportunity." 

MediaTek CFO, Feb 2015 

· t I 1 s 

I NTEL-QCOM007957521 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 19 of 33
QX0092 

Intel: R&D a nd -7.7k HC on iCDG products 

Intel Mobile R&D 

(k Headcount) 

15K 14.2 

10 

5 

WWAN 

Reductions 

,--"-.,, 

-1.0 

Additions 

,--"-.,, 

0.9 

Re-org. group changes 

14.0 

WWAN 

-7.4 

Non-iCDG 

mobile 

6.6 

WWAN 

1.1 

Non-iCDG HC on 

iCDG products 

Includes "'1,000 

headcount 

outside of PEG 

(CCG & SSG) 

7.7 

WWAN o...._ _____________________________________________ _ 

Corresponding 

R&D Spend 

($8) 

2014 Mobile 

R&D HC 

Current Mobile 

R&D HC 

iCDG Headcount 

Note: Assumes IP groups for CPU, GPU & Media, Imaging, and Other I P have not changed from November benchmarking. iCDG 

Products include SoFIA, GNV, WWAN, and CNV. Assumes a full burden rate of $200K. 

Source: Bain Analysis, Intel org. database 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

Total Current HC 

for iCDG Products 

I NTEL-QCOM007957522 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 20 of 33
QX0092 

Intel is catching up on IP cadence while competitiveness gaps remain 

( except CPU) 

2012 2013 2014 2015 I 

•

Krait 

.I 

Saltwell 

I I 

Minor updates every ~1yr l 

Silvermo • nt : 

I 

A57 : Hydra 

y: "X 

Ai

• rmont Goldmont I 

• 

• 

• 

• 

Ad 320 

y 

~ 400MP 

y 

I 

I 

,Ad 330 

y A 

Gen 7 

~300MP 

BYT 

I 

I 

•Ad 420 I 

I 

~SOOMP 

• 

I 

~400

~ MP 

: MOOR I 

I 

I 

I 

Ad 430 

Tl 

Gen •8 I 

I 

I 

I 

~ llO@MP I 

' ~ 4S'OMP 

Ci/tT 

I 

I 

Ad 435 

..... A 

Gen 9 

~lSOOMP 

T A 

~1200MP 

BXT 

l l ac BT4.1,ll~gn 2x2,lln/ac : llac,NFC 

___ .._,, .._,, , .__ ·------ .,,. -.... ,.-. 

Y'~ I :A. ... 

Cat3,Rel.9 

B1,11bgn 

,LhP 

BT~.1,llac , LnP 

Cat4,CA, Cat6/7,3CA, Cat10,3/4CA, 

Rel.10 Rel.lo Rel.11 

- --""-----"-.... ~------""::.:--io---:t'!x 

7160 7260 7360 

Cat3, Cat6,2CA, Cat9/10, 3CA, 

Rel.9 Rel.10 Rel.11 C ..... Intel Major IP Update ..... QCOM Maj or IP Update • Intel Leading 

CADENCE 

Tick/Tock ("' 1 yr) 

vs. 2-2.Syr 

(w/rvlyr updates) 

Both "-' l yr 

Both "'lyr arch 

and "'6mth SW 

Both "-' l yr 

Both "' l yr 

COMPETITIVENESS 

Leading on Perf./W for single 

and multi-threaded 

et itive in perf tablet; 

ing for entry segments 

s in cost, integration, 

tion,and low-power 

ered by CSR M&A) 

wing gap from 2 years 

follower ( 1 yr) through 

not integrated in BXT 

Other IP gaps include media and memory =i 

Comparable • Intel Lagging 

Note:* CPU, GPU, ISP dates reflect first soc sampling using IP; CNV and WWAN dates reflect first discrete chip sampling 

Source: Lit. Search; Company Web; Client Analysis; Bain Analysis 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957523 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 21 of 33
$25 

$20 

$15 

$10 

$5 

4C A7 - 1 .2GH 

SGXS44MP1 

1XLPDDR2·1066 

WCDMA HSPA+ 

No Int. Modem 

MT6592 91 88 2.6 

8/6/4C A7 - 1 .7- 2.0GHz 

Mali-450MP4 

1XLPDDR3·1066 

HSPA+ / CNV 

2014 2015 2016 

min~ j 2+2C A72 A53 I 

1 GX6250 1 

1 2X32LPDDR3 : 

,_ .Lif.Qlt6.zc.t _ . 

MT6755 

8C A53 -2G 

- Mall-T860MP2 

MT6752/6732 f S,,;) 1x32 LPDDR3 

CNV/LTECat 6 CDMA2k 

8C A53 - 1 .7 M rfi7§3 

Hali-T762 SCA53-TBD 

1xLPDDR3 Ma/l-T720MP3 

CNV/LTECat 4 CNV/LTE Cat 4 

CDMA2k 

MT6732 = fuse MT6735 

4C A53 - 1.5 

Mall-T720MP2 

CNV/LTECat4 

CDMA2k 

,- JfTJit):SS - I 1 4CA53 : 

~C~~(L_!'~c_:>~~ 

MT8 173 MTS273 

QX0092 

! Left edge of boxes approx imates PRQ ! 

2017 

.. 

fi!1!~1!m,lt 

: GX7450 1 

1 LPDDR3/LPDDR4 : 

'-.Lif.Qlt~2CA-, 

L---MT6952 --~ 

: SC A53 - 1.7+ GHz : 

Mall· TS34 or 824 1 CNV / LTECat6 1 L-----------" 

,----------.-J ~------ --- - I 

4C A53 - 1.5GHz I 

Mali-TS24 1 

1 CNV / LTECat6 : 

'------------· 

2018 2019 

! 1 '"·' GX9650 u,A::nH ! 1 o 4xLPDDR4·3667 1 

l - - ..lJl;.Cid, J.Q.t_ - - I 

i ,2+} ;:aeCJ:~ m,s An:~ an :. 1 GXS250 o 

o LPDDR3 I 

l - _LJE C;iJ J;2CA.. - J 

, ,---------____ _..: ___ 

---

__ ~ 

, SC Ananke - 1.7GHz 1 

, Ma/1-1924 1 

t 2xLPDDR4-3200 {16) : 1 CNV / LTECat9 1 ,_ ----------- -

,-- ----; -.,-.- -1 

1--------, 

• 4C Ananke - 1.7GHz 1 

Mal/·T824 I 1 2KLPDDR4·2400 1 

: __ CNV / LTECat6 _ I 

, ------~ -----.. , ___ MT6832 _ _ _ _ , 

I 4C Mercury - 1.5GHz I 

: Mali-T7xx/Custom I 

1 1XLPDDR3-1600 : 

l _ _ c_Ny j .l,!.E_C~~ - _ , 

I MT6771 (L TE) 1 

I 4C Mercury - 1.xGHz I 

1 LPDDR3·1600 1 

1 LTEcat 4 : 

•- -LCll'Jl.LJ121/JOS. _, 

1--- - __ _j 1 SC Ananke - 2GHz? I 

, Mall· TlOxx, 2x2 Uac: I 2xLPDDR4·3200 {16) 1 1 CNV / LTE Cat9 1 1_ - - - - - - - - - - - -

,-- - - -- - - --i 1----~ • 4C Ananke - 2GHz7 , 

I Ma/1-lOXX 1 2xLPDDR4-2400 , 

: __ CNV/LTECat6 _ I 

; __ MT6842 ___ ~ 

I 4C Mercury - 1.5GHz , 

: Mali- T7xx/Custom , 

1 1XLPDDR3•1600 I 

L _ CNV t:LTECat6 _ 1 

' MT6781 (L TE~ 1 

: 4C Mercury- t .x Hz I 

1 LPDDR3·1600 : 

1 LTEcat4 1 1 __ I.J;Ji',l/.Jt2J./IQS.. _ , 

2+ 2C A72/AS3 - 2.0GHz 

GX6250 

2xLP0DR3·1866 

i CU~Efli ! t.2+2C Artemis/A53 - 2.0GHz: 12+2c Pro/Ananke - 1.8GHz: 

I GX6250 I I GX7250 I 

2015-2017: 20-24 dies 

Avg Complexity score - 4-5 1 2X32 LP0DR3·1S66 o 1 4XLPDDR4·3100 l--- -l--------...1,;;;;.:;.;;~;:;.;:;:.i.... ___ ~ ====;;;;;;;;:.- -i-~.;;..;;.;..;~~;.._..-la __ 

· t I 1 a 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957524 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 22 of 33
Mediatek 2015 -17 24 dies represented on the roadmap. Lower end of the range assuming MTK does not deliver all the entry dies projected here 

201510 dies 6797,6795,6796,6755,6753,6735,6735M,6580,6570, 8173 

20167 dies 6897,6896,6952,6932,68xx cat4, 68xx 3G,8273 

20177 dies 6997, 6996, 7052, 7032, 6832, 6771, 8373 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

I NTEL-QCOM007957525 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 23 of 33
YIU 

$30 

$25 

• $20 

$15 

$10 

$5 

; I • • : I • ' • • t ' 

4C KRT- 1.5/1.7GH 

A320 - 400MHz 

2xlPDDR2·1067 

2.C KRT ... 1.?GHz 

A3 l0 - 400MHz 

2xlPOOR.3'o 10615 LTE cat 3, OCHSPA+ 

z A305 - 400MHz 

1XLPOOR2·800 

A -1 Hz 

A203 - 320MHz 

lxlPOORl-400 

8x74/A8/AC 

14c Krait400 - 2.26-2.45 GH, 

A330 

2xl.P0DR3·1600/1867 

LTE Cat 4 2CA 

8084 

4C KRT450 ( LPAE)- 2.7GHz 

A420 

2xlPOOR3•1600/00R3l• 

1867/No Comms' 

8928 

4C A7 1.4·• 1.6GHz 

•C KRT l.?GHz A305/1xlPD0R3 

5 . 

2016 

I 

I 4 

L----

4+4C A72 1.8/A53 

A510 

2x32 LPDDRJ· 1866 

LTECat 6 2CA 

8956 = fused 2+4C 

ao•~ --·-·· 

QX0092 

! Left edge of boxes approximates PRQ ! 

2017 

100 4x1E X 

2018 

I 

I 

·-- - - - - - - - - - - - - - - .. 

, 8977 8957 ' . 

I 

: 4+4C A72/A53 2.0/1.5: 

, A515 1 o 4x16 LPDDR4-2400 1 

I LTE Cat 9/10 3CA I 

: 8957 = fused 2+4C : 

L------------• 

JH UfHZlli! HI 1 4+4C Pro/Ananke : 

I 2.0/J.5 I 

1 A518 1 

1 4x16LPDDR4·3200 ' 

o LTECat ll/12 3/4CA 1 

I I 

, 8958 = fused 2+4C : l------------

2019 

r : z,m,o,uu 11 1 4+ 4C Pro/Ananke 

2.2/1.5 

A618 

I 

I 

I 

I 

o 4Xl6LPDDR4·4200 I 

oLTECat ll/12 J/4CAI 

I I 

• 8959 = fused 2+4C 1 

,_ -- -- -------· 

1xLPD•t:i.1200 r'---''--:::l T::,E:-:-C-at_

4

_l_C_A,-.....1 

LTE Cat3 

SC A53 

1.7GHz/1GHz 

A405 

lxLPOOR3·1600 

LTE Cat 4 SC A53 1.7 /1.2 SC A53 1.9/ 1.2 

4C A 1 - 1.2GHz 

A305 

LTE Cat 4 CA 

z A305 - 450MHz 

1XLP0DR2·1067 

8x12 

4C A7 - 1.2GHz 

A302 

1XLPOOR2·600 

2C A7 - 1.2GHz 

A302 

lxlPOOR2·600 

A405 

8936 = fused 4C 1XLPDDR3·1866 

LTEcat 7 2CA 

8929 

SC AS3 1.4GH z/lGHz 

A405 

1xlP0DR3• 1600 

C A53 - 1.2G L TE Cat 4 

A306 

CNV/LTECat4/ 

H42+ TOS 

8909 08 3 

4C A7 - 1.2GHz 

A304 

CNV /l TE cat 4 

2x10MHz CA 

A50x 

1XLPDDR3·1866 r-~ .;.i , a~) '051 19955,- -, i----!.~.li~~3.L __ j SC A53 1.8GHz/1GHz I 1 A405+ I 

: 2xLPDDR4·2400 1 

L- - - _ .J.RGt~ - - -- ~ 

LTECat 7 2CA 

SC Ananke 1.8GHz 

A505 

I 2x16 LPDDR4·3200 1 : ____ L TE Cat 9 _ _ _ o 

L - - - - ~--:,,_ -1 , 4+4C Artemis or 1 ' BC Ananke 2.27 1 1 A507, 2x2 Hae I 

: 2X32 LPDDR4·32001 

L _ L TE Cat 9 3CA _ I 

SC/ 4C AS3 - 1.5GHz t 8?20 ~ 

1 4C A53 1.5GHz 1 

,- - - 0 30 - -, I 4C Ananke 1.8GHz ' 

A505 

j:..: 4C An~-: 2.27 ~ A40X 

LTE Cat 4 2CA 1 A405+ 

1 2xLPDDR4•2400 I 

I ___ L USat.§ _ __ ..! 1 2X16 LPDDR4·2400 I 

~ ____ LTE Cat 6 ___ _ : 

' A507, 2x21lac? 1 

: 2xl 6 LPDDR4-3200I , __ _1.I{Q;>tt __ ~ 

~-~c~f~h~1n~ ;:..:::191•::::~ ~:.:-.:-:ans: :::~ 1 A306 : : 4C Mercury - 1.2GHz: : 4C Mercury - 1.5GHz: 

1 CNV/LTE Cat6 / 1 1 LTE Cat 6 1 1 LTE Cat 6 1 

ll1!J2.+./"lQSL2'i.JQSDAo l.-- - - - - - - - - - ' L ___________ , 

2015-2017 : 15-17 dies 

Avg Complex ity score - 4-5 BxOS = 3G only 

~ ----891X ____ I ~-- - - 89xx __ _; 

: 4C Merc~io; 1.2GHz 1 !'4C Ma~ry _ t.Sl.Hz : 

: CNV/H41/LTE at4 : ~---L~~~~~ ---: ,...,.,_,..., 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957526 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 24 of 33
2015 -17 15 dies represented on the roadmap. Adding 2 more for the higher end of range 

20154 dies 8976. 8952, 8929, 8909 

20165 dies8977,8953, 8937, 8913, 8931 

20176 dies8978, 8941, 8920,8930,891 x,8914 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

I NTEL-QCOM007957527 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 25 of 33
Internal Planning Modem Roadmap 

Left edge as PRQ/ PV (58) 

02 

I • 

03 04 01 02 

V2 enhancements: 

03 04 01 

28 nm XMMTM 7262VJ 23 bands· 

X-GOLD"' 726G, SMARTi"' 4.SP3 LTE Cat 6 

V3 Enhancements: 

TDD Cat 6 DL 2CA 40MHz 

Addtl. 2CA band combinations (V3.0) 

Enhanced MultiSIM (V3.!J. Optional: GPS/G~ YBei1cil.fiQ11eo 

PR PV: Q2.15 ()(3GlGJL(ljlltS~Mij X-PMU 

0 2 

36, 

3GPP Rel.11 2a2~ann~s·' 

FDD-DL 2CA 40MHz, Cat 6, 

300/50Mbps 

LTE FDO/TOO DL 3CA; 60 MH TE Cat 1 

LTE FDO/TDD Cat 9, 450/50 Mbps 

TOO 2CA UL (intra band cont.)-> Cat 

10 MDT, MTC, eM8MS, eICIC 

LTE / WiFi antenna sharing 

PRQ/ PV: Dec 14 

XMMTM 7260/7262 Vl I 2a nm 

X-GOLD"' 726G, SMARTi"' 4,0 23 bands• 

CG1960 T a 6 

3GPP Rel.10 

LTE FOO DL ZCA 30MHz, Cat 6, 

225/SOMbps 

LTE TDD 20MHz, Cat 4, 150/50 Mbps 

DC-HSPA+ 42 / 11 Mbps (Cat 24/7) 

TD-SCDMA 2.8/2.2 Mbps 

Multi-SIM w/ XMM"'' 2230: DSDA 

AnyRAT/2G and SGLTE 

Envelope Tracking; GPS/GLONASS 

PR PV: Jun 14 

XMMTM 55 M 

X-GOLD"' 625 , SMARTi"' UE2J;: nm J 

XMM"'' 6250 + TRX w ith integr. 3GPRQ/ PV: Mar 14; X-GOLD62SM: PRQ: 

28nm 

23 bands' 

LTE cat6 

TO-SCOMA 2.8/2.2; 

feICIC, CoMP UL, FOO/TOD TM9 

HSDPA Cat 24, 42 Mbps 

HSUPA Cat 7, llMbps 

LTE / WiFi antenna sharing 

Multi-SIM: DR·DSDS, DSDA / SGLTE 

Optional: 

GPS/GLONASS/Beidou/Galileo 

with CG2000/CG2100 

Pending CRs for ,,V2" (PRQ Dec 18 • 

TBO): 

Joint FOO/TDD CA;eMBMS TDD; UL4QAM 

RF cost down opt. w/ SMARTin• 4sengine 

PRQ/PV: Oct 15 

X·Gffl.DTM 746G?X·PMU 7416 0 2 

!MARY:~ 6 / 6_i:, fadea.vQU t 

3GPP Rel. 12 14 nm 

LTE FDD/TDD DL 48 4CA; up LTE Cat 1 O 

80MHz 

LTE FDD/TDD Cat 12+, 600/150 Mbps 

Joint FOO/TDD CA; 

LTE UL-64QAM 

LTE FDD/TDD UL 2CA; 40 MHz 

feICIC, CoMP UL/DL, TM9, TMlO, 

ePDCCH 

Enhanced voice service EVS; 

TD-SCOMA 2.8/2.2 Mbps 

D8-3C-HSDPA 63 Mbps (Cat 29); 

DC· HSUPA 11Mbps (Cat 8) 

Multi-SIM : DR-DSDS, DSDA / SGLTE 

Free running oscillator 38.4MHz 

Support of 

GPS/GLONASS/8eidou/Galileo w ith 

CG2000/CG2100 

Under discussion for V2 (PRQ Dec 16 -

T8D) 

LTE FDD/TDD 48 SCA 

LTE FDD/TDD 8X4 DL-MIMO (4 RX) 

Dual connectivity; MCO link 

aggregation 

ICS/NAICS; LTE-U; Triple-SIM (TSTS); 

LTE UL-MIMO; 

PRQ/PV: Q2.16 

Available In Planning Idea *#of bands supported on platform 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

2017 

Q3 04 

XMMTM 7560 

X-GOLD.., 756G, X-PMU 756 a 

SMARTiTM 7, Endeavour-Plus 

3GPP Rel 12 with sel. 3GPP Rel. 13 

Extension to XMM7460: 

LTE FOO/TDD DL SCA; 100MHz 

LTE FOO/TDD Cat 12+, >600/>150 

Mbps 

LTE-U (5.8GHz) 

LTE FDO/TDD UL 3CA; >40 MHz 

LTE FDO/TDD DL 256QAM 

LTE D20 (device-to-device) 

Dual connectivity 

MCO link aggregation 

DR-DSDS, DSDA AnyRAT/AnyRAT, 

(GNSS Integration into core chipset 

tbd) 

Triple-SIM (TSTS) 

PRQ/PV: Q2.17 

+3Q 

I NTEL-QCOM007957528 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 26 of 33
MDT: Mobile drive test (Mobile supported network scanning) 

MTC: Machine type communication 

elCIC: enhanced Inter Cell Interference Cancellation 

eMBMS: enhanced Multimedia Broadcast Multicast Service 

RAT: Radio Access Technology 

DR-DSDS: Dual receive Dual Sim Dual Standby 

DSDA: Dual Sim Dual Active 

SGL TE: Simultaneous GSM and L TE 

ICS: Interference cancellation and suppression 

NAICS: Network assisted interference cancellation and suppression 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

I NTEL-QCOM007957529 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 27 of 33
Internal Planning Smartphone Roadmap 

Left edge as rvQS/ Beta, PRQ/ P}(at" " 1 TTM modem & CNV in bold 

•wr1..t:':s• l)"'(•,•1•rQJ Q4 

u 

Ql 

C 

ro 

E 

~ 

~ ~ 

QJ 

0... 

Q2 

Moorefield , , 4 core 

Silvermont; SGX6430 Gfx 22 nm 

CoPOP LPDDR3 ~ XMMTM 7160, 6360 DSDS, 7260 

;:E Vl, 

Q3 Q4 

SoFIA LTE* 

Airmont Class 28 nm 

Integrated LTE Cat 4 (XG726-

based) 

Ql Q2 Q3 Q4 

Broxton 4 Core 

Goldmo

CoPOP LPDDR4 

nt; Gen 9 Gfx ~ 

LnP/CG2100/ FLP; XMMTM 73 60 

SoFIA Mid 

Airmont Class 14 nm Integrated CNV 

Integrated LTE cat. 9 3 DL CA 

Rel 11 · DSDA' SmS LcP2 PM!C 

SoFIA LTE 2 

Airmont Class Integrated LTE Cat 6 (XG726-based 

SMARTi'" 4.Ss, LnP / CG200 0, 

... 

Ql Q2 

2017 

Q3 

Idea * Sof!A LTE is our Windows 10 Mobile development vehicle, productization 

plan Is TBD 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

2018 

Q4 Ql Q2 Q3 Q4 

liJ Base/Anchor product from which derivatives would be 

=

i:l~~lthout an OS Icon support both Windows and An 

NOTE : display resolutions are for internal display 

I NTEL-QCOM007957530 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 28 of 33
QX0092 

NOA SoF L TEW left edge 

Chipset and sw roadmaps separately 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY I NTEL-QCOM007957531 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 29 of 33
Data gathering sources 

EXPERT INTERVIEWS 

• Conducted expert interviews with the 

following former employees: 

- Former Director Strategic Technology and 

Product Costing, Qualcomm 

- Former Director of Product Management, 

Qualcomm 

- Former VP, Corporate Development & Strategy, 

Qualcomm 

- Former Director of Engineering, Qualcomm 

- Former Executive Vice President, Qualcomm 

- Former Senior Advisor, MediaTek 

- Former Director of IC, MediaTek 

Former Special Advisor to CEO / Chief Strategy 

Officer, MediaTek 

- Former Business Development Manager, 

MediaTek 

- Former Engineering Director, MediaTek 

• Validated estimates of group size, allocation 

across groups, development timelines, 

burden rates, and aggregate spend 

SECONDARY SOURCES 

• Pulled data from available public sources 

including: 

- Public filings 

- Earnings call transcripts 

Investor day presentations 

- Diversity / corporate responsibility reports 

Analyst reports / forecasts 

- Company website 

- Data sheets 

- Public press 

• Utilized third-party data sources: 

- Gartner 

- !DC 

- Linley group 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

QX0092 

LINKEDIN BENCHMARKING 

• Determined search criteria to capt ure t he 

target functions 

• Sampled >4,000 Linkedln profiles and 

categorized them using job description, 

experience, and skills 

• Adjusted totals based on company and 

geography specific penetration rates 

• Validated approach using Intel group data 

I NTEL-QCOM007957532 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 30 of 33
QX0092 

QCOM HC benchmarking methodology 

Adjustment for scope of activities (iCDG comparable) 

Non-Relevant IPs O Perf. Portion of Functional O Perf. Portion of Customer 

Groups Facing 

Topdown 

Bottom 

-up 

Results 

• Utilizedd 2014 10-K headcount 

numbers (31.3K) and isolated 

R&D via "diversit y and inclusion" 

report (70%) 

• Validated top-level group size 

wit h expert interviews 

- Refined allocation with former 

Qualcomm employees at Intel 

• Performed Linkedi n 

Benchmarking 

- Sampled >4,000 Linkedln profiles 

and categorized them using job 

description, experience, and skills 

(see attached) 

Excluded non-relevant groups 

- Adjusted totals based on company 

and geo- specific penetration rates 

• Validated methodology using 

Intel group data 

• N19.6K HC associated with 

mobile spl it across functional 

groups, GB/BB, and CSR 

acquisit ion 

• Determined IP groups that 

were outside iCDG scope 

• Excluded 100% of CPU, GPU & 

Media, and Imaging 

- 2. lk headcount overall 

• Det ermined only a portion of 

"Other IP" is found within iCDG 

• Excluded all but 300 

headcount to account for 

individuals associated with 

low-end I SP development 

group, audio, and security 

resources 

- Assumed same headcount as 

Intel for these groups 

• Removed N3,lk HC split 

across CPU, GPU & Media, 

I maging, and Other I P 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

• Performed expert interv iews 

with former Qualcomm 

employees to det ermine 

appropriate allocat ion to 

performance smartphone 

• Aggregate workload model: 

- Utilized experts to determine 

the cost and timeline for dev. 

of each product on Qualcomm's 

roadmap 

- Modeled the ramp-up/rampdown of to determine the peak 

HC by segment 

- Compared peak resource 

allocation using assumptions 

from each of the experts and 

averaged the results 

• Determined that 60% of 

resources are allocated to 

performance products 

• Removed tv4. 1K headcount 

• Performed expert interviews 

with former Qualcomm 

employees to determine 

appropriate allocation to 

performance smartphone 

• Allocation to performance 

based on concentrat ion of 

OEMs by segment 

• Reviewed Qualcom m's 

website for the # of OEMs 

for each of t he product lines 

and segments 

• Assumed consistent 

headcount for each 

product/OEM combination 

• Determined t hat 50% of 

resources are allocated to 

performance products 

• Removed tv .4K headcount 

I NTEL-QCOM007957533 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 31 of 33
QCOM HC category definitions 1/2 

• 

CATEGORY NAME DEFINITION 

WWAN • Architect, design, and validate wireless WAN hardware 

CNV 

CPU 

GPU and Media 

Imaging 

DSP 

Others 

and software for integrated or discrete modems 

• Next-gen standards development 

• Architect, design, and validate wireless connectivity 

hardware and software, including WiFi, Bluetooth, GNSS, 

and NFC. 

• Architect, design, and verification of CPU core (e.g. Krait 

core) 

• Integration support to Soc teams 

• Architect, design, and verification of GPU or multi-media 

HW CODECs, drivers 

• Architect, design, and verification of ISP 

• ISP drivers, algorithms, etc. 

• Architect, design, and verification of DSPs 

• Firmware and RTOS development for DSP 

• Architect, design, and verification of Audio, Security, 

Sensors, PMIC, 1/0 (HIP/SIP) 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

LINKEDIN JOB DESCRIPTION EXAMPLE 

• "Systems Engineer· LTE: Modem systems design, 

transmitter and receiver algorithm development" 

• "Principal Engineer: Delivering innovative WLAN/BT 

radio solutions " 

• "Sr. Software Engineer: Implemented components of 

the Bluetooth stack." 

• " CPU Design Engineer: Design and verification of 

advanced custom CPUs for the Snapdragon platform" 

• "Senior Engineer: Responsible for maintaining and 

delivering Adreno GPUs RTL and netlist" 

• "Staff Engineer: Developing Adreno OpenGLS 

drivers" 

• "Senior Development Engineer: Deal with ISPs for 

Snapdragon chipsets related to Statistics SW." 

• "Imaging Architect: Camera ISP pipe imaging 

architecture development and optimization." 

• "Senior Engineer: Designing DSPs as part of the 

DSP/compiler team in Austin, TX" 

• " DSP firmware Engineer: Develop RTOS and 

firmware for Hexagon DSPs" 

• "Hardware Engineer: Member of HS-USB HW Team 

(USB-UICC, HS-USB Core, Emulat ion)" 

• "Staff Engineer: Power Management IC design" 

QX0092 

I NTEL-QCOM007957534 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 32 of 33
QCOM HC category definitions 2/2 

CATEGORY NAME 

Soc Integration 

Platform 

Integration 

Validation and 

Test 

Design Automation 

& Tools/Flows/ 

Methods (DA/TFM) 

Customer-facing 

Engineering 

Corporate Research 

and Development 

DEFINITION 

• Integration of IP blocks into an IC ( e.g. Application 

Processor, 1/0, PMIC etc.) 

• Integrate overall HW/SW platform (e.g. Soc+ OS + 

drivers + other board components) 

• OS optimization 

• Develop test boards and FFRDs 

• Soc and platform-level validation and testing 

• Process engineering and foundry interface 

• Development and support for tools, including design 

automation and peripheral lab 

development/maintenance 

• Custom cell libraries 

• Customer Technical Support, Field Applications Engineer 

Early-stage, path-finding R&D that does not generate 

revenue in a 3-year period 

• Includes: Mirasol, Vuforia, materials research, robotics, 

mesh networking 

INTEL HIGHLY CONFIDENTIAL - OUTSIDE ATTORNEYS' EYES ONLY 

LINKEDIN JOB DESCRIPTION EXAMPLE 

• "Senior Engineer: Back-end design for SoCs" 

• "Engineer: Floorplanning/PnR for complex IP blocks in 

socs" 

• "Senior Engineer: Core BSP engineer" 

• "Staff Engineer: Software integration onto advanced 

mobile platforms" 

• "Senior Engineer: BSP Device Driver" 

• "Testing Engineer: Software test development and 

execution" 

• "Staff Engineer: Drive co-emulation to validate socs" 

• "Staff Engineer: NPI product and process 

qualification/evaluation" 

• "Support Engineer: providing lab support for capacityconstrained projects" 

• "Sr. Staff Engineer : standard cell library dev for 

20nm" 

• "Staff Engineer: Customer Engineering for 30 graphics 

support on Android" 

• "Field Application Engineer: Responsible for handling 

any issue customers face using Qualcomm's WiFi 

chipsets." 

• "Staff Research Engineer: MEMS (Mirasol] display 

technology" 

• "Engineer: Working in the Office of the Chief Scientist 

on compilers and Virtual Machines research" 

• "Engineer: Developing Qualcomm's NPU (Neural 

Processing Unit] with the Zeroth team" 

QX0092 

I NTEL-QCOM007957535 

Case 5:17-cv-00220-LHK Document 1193-3 Filed 01/08/19 Page 33 of 33