**Exhibit 10.28**

 

 

**SUBCONTRACT AGREEMENT**

 

**Between**

 

**TEAM PACIFIC CORPORATION**

 

**And**

 

**ADVANCED POWER TECHNOLOGY**

 

**January 27, 2003**

 

**To**

 

**January 26, 2006**

 

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

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This **ASSEMBLY AGREEMENT**(hereinafter referred to as “Agreement”) is entered into the          dayof           year        byand between:

 

**ADVANCED POWER TECHNOLOGY, INC.,**a corporation duly organized and existing under the laws of the United Statesof America, having its principal place of business at 405 S.W. Columbia Street,Bend, Oregon 97702, USA (hereinafter referred to as “Customer”) and

 

**TEAM PACIFIC CORPORATION**,a company duly organized and existing under the laws of Republic of thePhilippines, with registered office at Electronics Ave., FTI Complex, Taguig,Metro Manila, Philippines (hereinafter referred to as “Assembler”).

 

**WITNESSETH:**

 

WHEREAS, Assembler has previously assembledelectronics devices for Customer and has the capacity to manufacture and test modules,plastic and hermetic packages and install semiconductor devices provided byCustomer in such packages at Assembler’s facility in the Philippines; and

 

WHEREAS, Customer desires to obtain acommitment from Assembler to make available for Customer a portion ofAssembler’s production capacity described above:

 

NOW, THEREFORE, in consideration of themutual covenants contained herein, the parties agree as follows;

 

**AGREEMENT**

 

**1.0****          Definitions**

 

1.1           “ElectricallySorted Dice” shall mean Customer’s proprietary semiconductor devices.

1.2           “ProductionMaterials” shall mean materials, including electrically sorted dice, whichCustomer provides to Assembler.

1.3           “CustomerForecasts” shall have the meaning set forth in Section 3.1 below.

1.4           “FinishedProducts shall mean the completed packages with electrically sorted diceinstalled, which Assembler agrees to assemble under this Agreement.

1.5           “Year”shall mean a period of twelve months, and a year of this agreement shall be aperiod of twelve (12) months from the date of Agreement.

1.6           “WIP”shall mean work in process.

1.7           “AssemblyRelease Authorization” refers to the document sent by the Customer to theAssembler that signifies a build order.

 

**2.0****          Manufactureand Assembly and Test of Packages: Materials**

 

2.1           Assemblershall manufacture packages pursuant to orders received from Customer and shallinstall electrically sorted dice in the packages pursuant to Customer’s processspecifications, as set forth in Appendix I and Appendix VI.

 

2.2           Assembleragrees to provide all equipment, personnel, manufacturing space needed toassemble Customer’s finished product in the monthly quantities set fort inCustomer’s monthly forecast.  Assembler also guarantees enough office space for itsCustomer’s representatives and storage space for all consigned materials formodule assembly. Assembler agrees to provide the materials required for theassembly of the Finished Products other than electrically sorted dice and itemsmentioned in Appendix II and V.

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

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2.3           Customershall supply Assembler with sufficient electrically sorted dice and otherconsigned materials to allow Assembler to meet Customer’s first month’s firmcommitment as provided for in Section 3.1.

 

2.4           Assembleragrees to assemble Customer’s finished product in accordance with the mutuallyagreed upon process specifications indicated in Appendix I and Appendix VI ofthis Agreement.  Customer will giveAssembler sixty-(60) days written notice of any changes or modifications tothose specifications if those changes affect Customer’s devices.  Assembler agrees that no change/changes cantake place without Customer’s expressed, written approval to specifications forCustomer’s products designated in Appendix I and Appendix VI and in any otherdocuments that are referenced in these documents that are specific to thespecific products mentioned in the flow charts. However, Customer’s approval shall not be required for changes to correcttypographical errors (excluding typographical errors on numerical value of aprocess setting or similar error where the correction can impact production orquality) and system-related changes. Assembler agrees to furnish Customer a full copy of the specs inAppendix I and VI in the event of a change in revision.  Appendix I and Appendix VI can be amendedfrom time to time to update its content of additional devices and /or revisionsto specifications of the current list.

 

Notes:    1.Appendix I – refers to Team Assembly Flow Charts for Discrete Packages. –  change notices need the approval of PepeBona.

2. Appendix VI – refers to Team Assembly FlowCharts for ASPM (Application Specific Power Modules) – change notices need theapproval of Mark Gabler

 

2.5           Customeragrees to give Assembler a minimum of sixty-(60) days (or more depending on theleadtime of the suppliers of the material) written notice if Customer requiresany changes in materials to Assembler’s standard Bill of Materials as writtenon Assembler’s standard process specifications.

 

2.6           Customeragrees to consign equipment in Appendix IV to Assembler and Assemblerunderstands they are responsible for cost of labor for in-house calibration andmaintenance of these equipment.  The costof spare parts shall be to be borne by the Customer.  In case of major repair, and equipment has tobe sent out to original manufacturer for repair, all costs associated are to beborne by the Customer.  Customer retainsownership of these equipment.

 

2.7           Customeragrees to pay for the price of the Finished Products used for Assembler’sInternal Reliability Monitors per Appendix III. Customer will be copied on all reports.

 

**3.0****          CustomerForecasts: Orders**

 

3.1           Onor before the 15th day of each month, Customer will provideAssembler with a three-(3) month rolling forecast of all the production levelsof Assembler (a “Customer Forecast”). The first month forecast shall be [ * ] firm commitment.  The Customer Forecast for the second monthshall be [ * ] firm and the third month shall be a good faith estimate ofnumber of Finished Products to be assembled by Assembler.

 

3.2           Assembleragrees to reserve sufficient production capacity for manufacturing packages andassembling Finished Products in accordance with Section 3.1 above.  A [ * ] buffer capacity shall be reserved byAssembler in order to handle upward fluctuations of orders from customer.

 

3.3           Nothingin this Agreement shall restrict or prohibit Customer from contracting withothers for assembly services similar to those provided by Assembler under thisAgreement, provided that Assembler shall be given priority with respect tovolume covered by the Customer Forecast and provided further that Assemblermaintains a leadership position with respect to price, delivery, quality andcustomer service.

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

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3.4           Assembleragrees to provide customer WIP reports including scheduled ship dates twice perweek and monthly yield summaries.

 

3.5           Customerwill use a blanket purchase order for and every six months.

 

3.6           Subjectto the terms set forth herein, Assembler shall provide Finished Products toCustomer consistent with the releases as provided by the purchase order andsupporting purchase order number.

 

**4.0****          Paymentand Pricing**

 

4.1           Customershall pay Assembler for assembly and test of Finished Products pursuant toinvoices received by Customer within thirty (30) days from invoice date.  All invoices shall be in U.S. Dollars and allpayments shall be made to Assembler via telegraphic transfer.

 

4.2           Customershall pay Assembler for non-trade expense within 7 days from invoice date.  Brokerage, releasing fee and shippingcharges, office supplies and other advances made by Assembler in behalf of theCustomer are classified as non-trade expenses.

 

4.3           Subjectto adjustment as provided in Section 4.4 below, prices shall be as set forth inthe price schedule shown in Appendix II attached.  All prices are quoted ex-works plant, Manila.

 

4.4           IfAssembler’s direct material or labor or overhead costs related to Assembler’sperformance under this Agreement increase by more than [ * ] percent during thefirst year of this Agreement or by more than [ * ] percent during thesucceeding years of this Agreement, for any reason whatsoever, assembler maygive customer written notice of a proposal price increase.  Assembler shall endeavor to provide thejustification for such price increase to the extent possible without disclosingthe details of its cost structure. Customer shall thereafter within thirty (30) days of the date ofAssembler’s notice either; (a) notify Assembler that it accepts the priceincrease, in which case the increase shall be effective for all Finished Productsdelivered after the date of Customer’s notice; or (b) notify Assembler of itsacceptable new price.  Both parties agreeto exercise good faith and resolve on best effort basis any differences on theproposed price increase within sixty (60) days.

 

4.5           Assemblerwill 100% test products for DVSD, final test and UIS on testers supplied byCustomer.  Assembler and Customerrecognize that additional testing currently performed by Customer may be offloaded to assemblers sometime in the future. Assembler will also conduct isolation tests on SOT227 using Customer’ssupplied isolation testers.  All unitspassing through lead-to-lead isolation test, as in the case of Parallel andAnti-parallel devices shall have an additional cost adder.  All rejected units at isolation test arebillable to the customer.

 

**5.0****          Shipments**

 

5.1           Customershall ship all Production Materials and Dice to Assembler’s plant in Manila atCustomer’s expense.

 

5.2           Assemblershall ship all Finished Products assembled three (3) times per week, unless otherwise mutually agreed upon on a case tocase basis. Assembler shall insure and arrange for shipment of FinishedProducts by any reasonable method specified by Customer.  Customer shall pay all charges for shipping,insurance and in land charges on Finished Products as well as shipback ofProduction Materials and Dice.

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

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**6.0****          Taxes,Permits, Approvals**

 

6.1           Assemblershall have the sole responsibility to pay any and all import duties, taxes andother charges levied by government authorities in the Philippines upon, or inconnection with, any transaction covered by this Agreement.

 

6.2           Assemblershall have the sole responsibility to obtain all permits, licenses and approvalfrom government authorities in the Philippines necessary for the performance ofthis Agreement to comply with any requirement to file this Agreement with anygovernment authority in the Philippines.

 

6.3           UponCustomer’s request, Assembler shall promptly provide Customer with any and allinformation and documentation as may by required for customs clearance into theUnited States or the Philippines.

 

**7.0****          Compliancewith Laws**

 

Each party shall comply with laws andregulations applicable to it in the performance of its obligations pursuant tothis Agreement.

 

**8.0****          Ownership**

 

All electrically sorted dice, ProductionMaterials provided by Customer and Finished Products shall be and all timesremain the property of Customer. Assembler agrees that it will not place nor permit to stand any lien ofother encumbrance against electrically sorted dice, Production Materialsprovided by Customer or Finished Products.

 

**9.0****          Warranty**

 

Assembler warrants that the products to beassembled, open/short, final tested (on some package types), isolation testedand shipped hereunder shall have been assembled, open/short tested, finaltested (on some package types), isolation tested and shipped in conformity withspecifications of both Assembler and Customer.

 

In the event that theFinished Products do not conform with the specifications as defined in AppendixI and Appendix VI, or to any future updates to the specifications duly approvedby Customer, Assembler shall credit the price paid by Customer plus theacquisition cost or manufacturing cost of die and acquisition cost of consignedmaterials, or assemble similar devices for Customer at no charge, at Customer’ssole option.  Customer shall declareacquisition cost or manufacturing cost of die in the Assembly ReleaseAuthorization and provide Assembler with the list of prices of consignedmaterials. Such list of prices shall be updated on a monthly basis or wheneverthere is a change in the price of the materials listed.

 

Assembler shall have no obligation under anywarranty set forth above in the event that:

a. The Finished Products have failed as aresult of catastrophe or fault or negligence of Customer or its Customers;

 

b. The Finished Products have been modifiedby Customer or its Customers in a way which affects the performance of

the Finished Products.

 

c. The Finished Products have not beenstored, maintained or used by Customer or its Customers in accordance with

Customer’s standard operating and/ormaintenance instructions.

 

Assembler makes no warranty of fitness forpurpose in respect of the products assembled, open/short tested, isolationtested and shipped hereunder.

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

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**10.0****        Confidentiality**

 

Assembler and Customer agree, shall cause itsemployees, subcontractors, customers and agents, during the term of thisAgreement and thereafter to keep confidential and not disclose to third partiesor use, except as expressly authorized in writing by both parties or asrequired by legally constituted authority or in the course of performing itobligations hereunder, any confidential information covered by thisAgreement.  Confidential informationshall include Customer’s and Assembler’s written specifications and all otherinformation provided and identified by both parties as confidential or whichAssembler or Customer has reason to know is treated by one party asconfidential, including all materials and components, whether supplied by theCustomer or by the Assembler.

 

**11.0****        Indemnification**

 

Each party shall defend and hold harmless theother party, its agents, employees and other representatives from and againstand shall indemnify each such person for any liability, loss, costs expensesand damages to such person arising out of any act, neglect, default or omissionof it or any agents, employees or other representatives in connection with thisAgreement.  The indemnifying party shallhave the right to control the defense, compromise or settlement of any thirdparty claim, action or suit involving the indemnifying party and theindemnified party shall cooperate and furnish such records, information andtestimony as may reasonably be requested by the indemnifying party, theindemnified party shall be entitled to participate in, but no direct, thedefense of any such claim, action or proceeding with counsel of its ownchoice.  Nothing herein is intended to orshall relieve any party from liability for its own act, omission or negligence.

 

**12.0****        Termsand Termination**

 

12.1         ThisAgreement shall continue in full force and effect for a period of thirty six(36) months from the date of this Agreement unless earlier terminated asprovided below in this section.  Anannual review shall be done by either party in order to consider any changethat may affect the condition of the business between Assembler and APT.  Priceshowever,  are subject to change at anytime if mutually agreed upon by Assembler and the Customer.

 

12.2         Eitherparty may terminate this Agreement in the event that the other party defaultsin the performance of its obligations under this Agreement and the default hasnot been remedied to the reasonable satisfaction of the non defaulting partywithin ninety (90) days after receipt by the defaulting party of written noticeof the default.

 

12.3         Customermay terminate this Agreement after giving Assembler ninety (90) days’ writtennotice of its intention to do so if Assembler and Customer cannot agree on (a)mutually acceptable price increases as provided in section 4.4 or (b) anymodification to Customer’s process specifications proposed by either party.

 

12.4         Customermay terminate this Agreement immediately as provided in Section 13.2.  Assembler may terminate the Agreementimmediately in the event the Customer fails or refuses to pay any outstandingbilling of Assembler under this Agreement.

 

12.5         Upontermination of this Agreement, at Customer’s request, Assembler shallimmediately deliver to Customer all electrically sorted dice, ProductionMaterials provided by Customer, and Finished Products in its possession.  And the Customer shall pay outstandingbilling of Assembler consistent with the payment terms as described in Section4.1 including all materials purchased by Assembler for the manufacture of theCustomer’s products.

 

12.6         Upontermination or expiration of the term of this Agreement, the rights andobligations of the parties under this Agreement shall end, and neither partyshall have claim for termination damages, against the other; provided, however,that the following provisions shall survive termination of this Agreement: (a)Customer’s payment obligations specified in Section 4; (b) Assemler’sobligations specified in Section 6 and 8; (c) any law, order, proclamation,regulation, ordinance, demand or requirement of any government or (d) any otheracts whatsoever, whether 

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

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similar or dissimilar to those enumeratedabove that are beyond the reasonable control of either party to this Agreement,the party so affected, upon giving prompt notice to the other party, shall beexcused from the performance of the obligation or obligations so prevented,restricted or interfered with, provided the affected party uses its bestefforts to rectify, avoid or remove such causes on nonperformance.

 

**13.0****        ForceMajeure**

 

13.1         Subjectto the limitation provided in 13.2 below, if the performance of this Agreementor any obligation provided herein is prevented, restricted or interfered withby reason of (a) fire, explosion, plant breakdown, failure of machinery, strikeor labor dispute, whether creating significant property damage or failure ofsources of supply of raw materials, supplies, power or water, (b) war, policeactions, conflicts involving armed forces, revolutions, insurrections or civilcommotion, (c) any law, order, proclamation, regulation, ordinance demand orrequirement of any government or (d) any other acts whatsoever, whether similaror dissimilar to those enumerated above that are beyond the reasonable controlof either party to this Agreement, the party so affected, upon giving promptnotice to the other party, shall be excused from the performance of theobligation or obligations so prevented, restricted or interfered with, providedthe affected party uses its best efforts to rectify, avoid or remove suchcauses of nonperformance.

 

13.2         Ifany condition described in 13.1 above shall prevent, restrict or interfere withAssembler’s performance of any obligation hereunder for a period of sixty (60)or more days, Customer shall have the right immediately to terminate thisAgreement without prior notice to Assembler and at no cost to Customer.

 

**14.0****        Limitationsof Liability**

 

In no event shall customer have any liabilityto Assembler or any other person for consequential, incidental, indirect orspecial damages of any nature whatsoever (including without limitation, lostrevenues, lost profits, delays or loss of use) arising out of or in any wayrelated to Customer’s performance or nonperformance of this Agreement.  Customer’s liability to Assembler uponexpiration or termination of this Agreement for any reason, with or withoutcauses, shall be limited to payment for Finished Products on order at the timeof termination and materials purchased by Assembler for the manufacture of theCustomer’s products.  These limits willapply to all claims, including without limitation contract, indemnify and tort.

 

**15.0****        General**

 

15.1         Interpretationand Governing Laws.  This Agreement shallbe interpreted in accordance with the plain English meaning of its terms exceptfor the industry accepted abbreviations and shall be governed by the laws ofCalifornia, USA, excluding choice of laws rules and excluding the UnitedNations Convention on the International Sale of Goods.

 

15.2         Venue,Attorneys Fees.  Assembler consents topersonal jurisdiction over it by the state and federal courts of California inconnection with any dispute arising out of this Agreement.  In any action to enforce or interpret thisAgreement, the prevailing party shall be entitled to recover reasonable costsand attorneys fees at trial, on appeal, and on any petition for review.

 

15.3         Notices.  Any notice or report permitted or required bythis Agreement shall be deemed given if delivered personally or sent by FirstClass Mail, postage prepaid, addressed to the other party at the address firstwritten above or at such other address as designated by the party by writtennotice, or by confirmed telex or facsimile. If notice is given by mail and the date of the notice affects eitherparty’s rights under this Agreement, the effective date of the notice shall beseven (7) days after the date of mailing or the date the notice is receivedwhichever is earlier.

 

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15.4         EntireAgreement: Modification.  This Agreementcontains the entire agreement and understanding between and among the partieswith respect to the subject matter hereof, and unless otherwise provided inthis Agreement, no modification or waiver of any of the provisions, or anyfuture representation, promise, or addition, shall be binding upon the partiesunless made in writing and signed by both parties.

 

15.5         Waiver. The failure of either party to enforceat any time any provisions of this Agreement shall not be construed to be awaiver of such provision or of the right thereafter to enforce each and everyprovision of this Agreement.  No waiverby either party to this Agreement, either express or implied, of any breach of anyterm, condition or obligation of this agreement shall be construed as a waiverof any subsequent breach of that term, condition or obligation or of any otherterm, condition or obligation of this Agreement.

 

15.6         Assignment:  Binding Effect. Neither party shall assign,transfer, or sell its rights under this Agreement or delegate its dutieshereunder without the prior written consent of the other parties hereto.  This Agreement shall be binding upon andinure to the benefit of the parties hereto and their successors and permittedassigns.

 

15.7         Severability.  If any provision, term or other portion ofthis Agreement shall be held invalid, illegal or unenforceable by any court ofcompetent jurisdiction, the remaining portion shall remain in force and effect.

 

15.8         Heading.  Headings used this agreement are forconvenience only and shall not be construed as a part of or affect theconstruction or interpretation of any provision of this Agreement.

 

15.9         ExportControl.  Assembler understands thatCustomer is subject to regulation by United States government agencies, whichrestrict export or diversion of Finished Products and Production Materials orinformation provided by Customer to Assembler hereunder.  Regardless of any disclosure by Customer toAssembler of an ultimate destination of Finished Products or any informationdisclosed hereunder, Assembler warrants that it will not export in any manner,either directly or indirectly, any product or information without fistobtaining all necessary approvals from appropriate U.S. governmentagencies.  Assembler acknowledges thatthe regulation of product export is in continuous modification.  Assembler agrees to complete all documents andmeet all requirements arising out of such modifications.

 

15.10       Customershall, at its expense, supply Assembler with jigs and fixtures (ie: graphiteboats) to allow Assembler to perform its obligation under this agreement. If incase forecast goes up and additional jigs and fixtures are required, Customershall, at its expense provide additional jigs and fixtures. This also coversnew devices with new configuration. Assembler, however, is responsible forreplacement of these jigs and fixtures in case of damage and normal wear andtear.

 

15.11       GoverningLanguage. This Agreement may be translated into a language other than Englishversion of the Agreement control the rights and obligations of the partiesregardless of subsequent translation and regardless of any reliance by anyparty upon such translation.  Allcommunications and notices to this Agreement shall be in English.

 

In Witness whereof, the parties have causedthe Agreement to be executed as of the date first set forth above.

 

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| **TEAM PACIFIC CORPORATION**                     | **ADVANCED POWER TECHNOLOGY, INC.**            |
|--------------------------------------------------|------------------------------------------------|
| By:                                              | By:                                            |
|                                             |                                           |
|                                             |                                           |
|                                             |                                           |
| **Ceferino F. Bautista**                         | **Russell Crecraft**                           |
| Senior Vice President – Sales and Marketing | Vice President – Manufacturing Operations |

 

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#### **APPENDIXI**

 

## **PROCESSSPECIFICATIONS**

 

**DISCRETE:**

** **
| **EFFECTIVITY  DATE/ DATE  POSTED** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                       |
|-------------------------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------|
| October 11,2004                     |       | TAFC-1064         |       | 31                         |       | TPC TO-247 ASSY. PROCESS FLOWCHART                       |
| October 19,2004                     |       | TAFC-1066         |       | 29                         |       | TPC SOT-227 PROCESS FLOWCHART                            |
| May 4, 2004                         |       | TAFC-1175         |       | 19                         |       | TPC TO-264 PROCESS FLOWCHART                             |
| July 7, 2004                        |       | TAFC-1195         |       | 8                          |       | TPC TO-3/TO-66 MILITARY PROCESS FLOWCHART                |
| July 7, 2004                        |       | TAFC-1208         |       | 12                         |       | TPC TO-268 (D3PAK) PROCESS FLOWCHART                     |
| May 7, 2003                         |       | TAFC-1211         |       | 5                          |       | TPC EXT TO-247 ASSEMBLY PROCESS FLOWCHART                |
| 14-Mar-95                           |       | D3P ENGG          |       | F                          |       | D3PAK PACKAGE OUTLINE DRAWING                            |
| 23 Mar 98                           |       | PD-247-5          |       | 3                          |       | TO-247 PACKAGE OUTLINE DRAWING                           |
| 23 Mar 98                           |       | PD-EXT-2473       |       | 1                          |       | EXT 247 PACKAGE OUTLINE DRAWING (MAX247, TO-247 HOLELESS |
| 05 March 99                         |       | PO-0001-P         |       | 1                          |       | TO-264 PACKAGE OUTLINE DRAWING TEAM STANDARD             |
| 22 Nov 02                           |       | PO-0006-P         |       | 3                          |       | SOT-227 PACKAGE OUTLINE DRAWING                          |

 

 
| Revision Date : | November 23, 2004        |   |
|-----------------|--------------------------|--------|
| Approved by:    |                     |
|            |                     |   |
|            | Luisa Merana – Team |
|            |                     |
|            |                     |   |
|            | Russell Crecraft - APT   |

 

 

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#### ** **

#### **APPENDIXI**

 

## **PROCESSSPECIFICATIONS**

 

**DISCRETE:**

** **
| **EFFECTIVITY  DATE/ DATE  POSTED** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                       |
|-------------------------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------|
| Sept. 11, 2003                      |       | TAFC-1064         |       | 26                         |       | TPC TO-247 ASSY. PROCESS FLOWCHART                       |
| Sept. 09, 2003                      |       | TAFC-1066         |       | 25                         |       | TPC SOT-227 PROCESS FLOWCHART                            |
| Sept. 11, 2003                      |       | TAFC-1175         |       | 16                         |       | TPC TO-264 PROCESS FLOWCHART                             |
| May 7, 2003                         |       | TAFC-1195         |       | 7                          |       | TPC TO-3/TO-66 MILITARY PROCESS FLOWCHART                |
| Sept. 09, 2003                      |       | TAFC-1208         |       | 11                         |       | TPC TO-268 (D3PAK) PROCESS FLOWCHART                     |
| May 7, 2003                         |       | TAFC-1211         |       | 5                          |       | TPC EXT TO-247 ASSEMBLY PROCESS FLOWCHART                |
| 14-Mar-95                           |       | D3P ENGG          |       | F                          |       | D3PAK PACKAGE OUTLINE DRAWING                            |
| 23 Mar 98                           |       | PD-247-5          |       | 3                          |       | TO-247 PACKAGE OUTLINE DRAWING                           |
| 23 Mar 98                           |       | PD-EXT-2473       |       | 1                          |       | EXT 247 PACKAGE OUTLINE DRAWING (MAX247, TO-247 HOLELESS |
| 05 March 99                         |       | PO-0001-P         |       | 1                          |       | TO-264 PACKAGE OUTLINE DRAWING TEAM STANDARD             |
| 22 Nov 02                           |       | PO-0006-P         |       | 3                          |       | SOT-227 PACKAGE OUTLINE DRAWING                          |

 

 
| Revision Date : | October 13, 2003         |   |
|-----------------|--------------------------|--------|
| Approved by:    |                     |
|            |                     |   |
|            | Luisa Merana – Team |   |
|            |                     |
|            |                     |   |
|            | Russell Crecraft - APT   |

 

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#### **APPENDIXI**

 

## **PROCESSSPECIFICATIONS**

 

**DISCRETE:**

** **
| **EFFECTIVITY  DATE/ DATE  POSTED** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                       |
|-------------------------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------|
| May 7, 2003                         |       | TAFC-1064         |       | 23                         |       | TPC TO-247 ASSY. PROCESS FLOWCHART                       |
| May 7, 2003                         |       | TAFC-1066         |       | 23                         |       | TPC SOT-227 PROCESS FLOWCHART                            |
| May 7, 2003                         |       | TAFC-1175         |       | 14                         |       | TPC TO-264 PROCESS FLOWCHART                             |
| May 7, 2003                         |       | TAFC-1195         |       | 7                          |       | TPC TO-3/TO-66 MILITARY PROCESS FLOWCHART                |
| May 8, 2003                         |       | TAFC-1208         |       | 9                          |       | TPC TO-268 (D3PAK) PROCESS FLOWCHART                     |
| May 7, 2003                         |       | TAFC-1211         |       | 5                          |       | TPC EXT TO-247 ASSEMBLY PROCESS FLOWCHART                |
| 07-Mar-95                           |       | D3P ENGG          |       | F                          |       | D3PAK PACKAGE OUTLINE DRAWING                            |
| 23 Mar 98                           |       | PD-247-5          |       | 3                          |       | TO-247 PACKAGE OUTLINE DRAWING                           |
| 23 Mar 98                           |       | PD-EXT-2473       |       | 1                          |       | EXT 247 PACKAGE OUTLINE DRAWING (MAX247, TO-247 HOLELESS |
| 05 March 99                         |       | PO-0001-P         |       | 1                          |       | TO-264 PACKAGE OUTLINE DRAWING TEAM STANDARD             |
| 22 Nov 02                           |       | PO-0006-P         |       | 3                          |       | SOT-227 PACKAGE OUTLINE DRAWING                          |

 

 
| Revision Date : | May 9, 2003              |   |
|-----------------|--------------------------|--------|
| Approved by:    |                     |
|            |                     |   |
|            | Luisa Merana – Team |   |
|            |                     |
|            |                     |   |
|            | Russell Crecraft - APT   |

 

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#### **APPENDIXI**

 

## **PROCESSSPECIFICATIONS**

 

**DISCRETE:**

** **
| **EFFECTIVITY  DATE** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                       |
|-----------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------|
| 12 May 02             |       | TAFC-1064         |       | 22                         |       | TPC TO-247 ASSY. PROCESS FLOWCHART                       |
| 22 May 02             |       | TAFC-1066         |       | 22                         |       | TPC SOT-227 PROCESS FLOWCHART                            |
| 10 May 02             |       | TAFC-1175         |       | 13                         |       | TPC TO-264 PROCESS FLOWCHART                             |
| 11-Sept-01            |       | TAFC-1195         |       | 6                          |       | TPC TO-3/TO-66 MILITARY PROCESS FLOWCHART                |
| 22 May 02             |       | TAFC-1208         |       | 8                          |       | TPC TO-268 (D3PAK) PROCESS FLOWCHART                     |
| 04 Sept 02            |       | TAFC-1211         |       | 4                          |       | TPC EXT TO-247 ASSEMBLY PROCESS FLOWCHART                |
| 07-Mar-95             |       | D3P ENGG          |       | F                          |       | D3PAK PACKAGE OUTLINE DRAWING                            |
| 23 Mar 98             |       | PD-247-5          |       | 3                          |       | TO-247 PACKAGE OUTLINE DRAWING                           |
| 23 Mar 98             |       | PD-EXT-2473       |       | 1                          |       | EXT 247 PACKAGE OUTLINE DRAWING (MAX247, TO-247 HOLELESS |
| 05 March 99           |       | PO-0001-P         |       | 1                          |       | TO-264 PACKAGE OUTLINE DRAWING TEAM STANDARD             |
| 22 Nov 02             |       | PO-0006-P         |       | 3                          |       | SOT-227 PACKAGE OUTLINE DRAWING                          |

 

 
| Revision Date : | 3 December 2002          |   |
|-----------------|--------------------------|--------|
| Approved by:    |                     |
|            |                     |   |
|            | Luisa Merana – Team |
|            |                     |
|            |                     |   |
|            | Russell Crecraft - APT   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

13

----

 

**ADDENDUM TO APPENDIX II**

**APT PRICE TABLE FOR THE YEAR 2003**

**Revision made May 16 2003 – to reflect priceson SOT-227 effective July 2003**

Revised prices of SOT-227 and TO-247effective March 1, 2003 were based on immediate reduction that Team can extend.

 

**STANDARD TO 247 & HOLELESS TO247**

 
| ** **                                                                        | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **       | ** ** | **HYSOL**                      | ** ** |
|-----------------------------------------------------------------------------------|------------|------------|------------|--------------------------------|------------|------------------|------------|--------------------------------|------------|
| ** **                                                                        | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** |
| STD TO 247 W/SINGLE DIE TO247 SINGLE DIE  W/O CATHODE WIRE AUTO TRIM/AUTO LEADCUT |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
| ** **                                                                        | ** ** | ** ** | ** ** | ** **                     | ** ** | ** **       | ** ** | ** **                     | ** ** |
| STANDARD TO247 DUAL DIE                                                           |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
| ** **                                                                        | ** ** | ** ** | ** ** | ** **                     | ** ** | ** **       | ** ** | ** **                     | ** ** |
| STD TO247 SINGLE DIE W/CATHODE WIRE, W/O  CENTER LEAD, MAN L/CUT                  |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
| ** **                                                                        | ** ** | ** ** | ** ** | ** **                     | ** ** | ** **       | ** ** | ** **                     | ** ** |
| STD TO247 DUAL DIE W/CATHODE WIRE, W/O  CENTER LEAD, MAN L/CUT                    |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
| ** **                                                                        | ** ** | ** ** | ** ** | ** **                     | ** ** | ** **       | ** ** | ** **                     | ** ** |
| STD TO247 RF104/114 APT SUPPLIES SUBSTRATES                                       |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
| ** **                                                                        | ** ** | ** ** | ** ** | ** **                     | ** ** | ** **       | ** ** | ** **                     | ** ** |
| STD TO247 RF 105/125 APT SUPPLIES  SUBSTRATES                                     |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                                                                              |       |       |       |                           |       |             |       |                           |       |
| HOLELESS TO247 SINGLE DIE                                                         |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                                                                              |       |       |       |                           |       |             |       |                           |       |
| HOLELESS TO247 DUAL DIE                                                           |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |

 
| TEST  PRICE W/ OR W/O UIS                        | [  * ] |
|--------------------------------------------------|--------|
| COST  DEDUCTION FOR DICE RCVD SAWN (1DIE)        | [  * ] |
| COST  DEDUCTION FOR DICE RCVD SAWN (2DIE)        | [  * ] |
|                                             |   |
| QUICK TURN ADDER [ * ]  SINCE DIE, [ * ] PCS MAX |   |
| [ * ] ALL OTHER, [ * ] PCS MAX                   |

 

ADDITIONAL PROVISIONS

*ALL TO247 BASE PRICES INCLUDE O/S TEST, MARK, SOLDER DIP, SHIPPINGTUBES, & BOXES

*THE US$[ * ] REDUCTION IN PRICE APPLIES ONLLY TO DEVICES USING KOBESELECTIVE PLATED LEADFRAME AND DO NOT APPLY TO RF DEVICES AND THOSE DEVICES WITHDOWNBONDS

* TEAM SUPPLIES ALL MATERIALS EXCEPT DIE UNLESS OTHERWISE STATED HEREIN

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

14

----

 

**STANDARD SOT  227**

 
| ** **                                                                              | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **          | ** ** | **HYSOL**        | ** ** |
|-----------------------------------------------------------------------------------------|------------|------------|------------|--------------------------------|------------|---------------------|------------|------------------|------------|
| ** **                                                                              | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **PRICE EFF.  TBA** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **PRICE EFF.  TBA** | ** ** |
| SOT227 SINGLE DIE USING THERMIC EDGE &  CERAMTEC SUBSTRATE & WTD FRAME+WTD BASE |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| SOT227 DUAL DIE USING WTD BASE & FRAME                                              |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| SOT 227 3 DIE USING WTD BASE & FRAME                                                |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| 1/2, PARALLEL/ANTI-PARALLELP/FRED                                                       |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| 1/2H, PARALLEL/ANTI PARALLEL/FRED Single  die, paddle-less thin alumina with DBC        |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| PFC                                                                                     |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| RF (32W) APT SUPPLIES CTR SUBTRATE                                                      |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                                    |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| INDUCTOR COIL APT SUPPLIES L/FRAME &  SUBSTRATE                                     |       | BASE PRICE |       | [ * ]                          |       |                |       | [ * ]            |       | [ * ] |   |   |   |

 

SOT-2CONTINUED:
| COST  ADDER FOR MANUAL UIS                  |   | [  * ]                           |     |
|---------------------------------------------|--------|----------------------------------|----------|
| COST  ADDER FOR SOLDER PLATE                |   | [  * ]                           |     |
| PRICE  FOR MANUAL FINAL TEST P/AP (2D)      |   | [  * ]                           |     |
| PRICE  FOR DVSD, FT, Q+&NO UIS          |   | [  * ]                           |     |
| PRICE  FOR UIS, DVSD, FT, Q+                |   | [  * ]                           |     |
| COST  FOR REDUCTION FOR DICE RCVD SAWN      |   | [  * ]                           | (AP)     |
|                                        |   | [  * ]                           | (DUAL)   |
|                                        |   | [  * ]                           | (P)      |
|                                        |   | [  * ]                           | (SINGLE) |
| QUICK TURN ADDER                            |   | [  * ] SINGLE DIE, [ * ] PCS MAX |
|                                        |   | [  * ] ALL OTHER, [ * ] PCS MAX  |
| COST  ADDER FOR P/AP ISOLATION LEAD TO LEAD |   | [  * ]                           |     |
| ON  DEVICE 4XX-XXXX DIODE ONLY              |   |                             |     |
| COST  ADDER FOR PAD C USING LARGE           |   | [  * ]                           |     |
| ALUMINUM  NITRIDE SUBSTRATE                 |   |                             |     |

 

**PRICEEFFECTIVE JULY 1, 2003 — WILL DEPEND ON THE ACTUAL CHANGE IN MATERIAL SUPPLIERFROM WTD TO SDI**

 

ADDITIONALPROVISIONS

*ALLSOT BASE PRICES INCLUDE O/S & ISOLATION TEST, MOUNTING HARDWARE(SCREW/NUTS/WASHERS), SHIPPING TUBES & BOXES

*ALLSOT ASSEMBLY ASSUMES THE USE OF ALN SUBSTRATES (MIN CONDUCTIVITY IS 170 W/C)

*TEAMSUPPLIES ALL MATERIALS EXCEPT DICE UNLESS OTHERWISE STATED HEREIN

 

----

[ * ] = CONFIDENTIAL TREATMENTREQUESTED  

 

15

----

 

**STANDARD TO-264**

 
| ** **                | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **       | ** ** | **HYSOL**                      | ** ** |
|---------------------------|------------|------------|------------|--------------------------------|------------|------------------|------------|--------------------------------|------------|
| ** **                | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** |
| STD TO-264 SINGLE DIE     |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                      |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 DUAL DIE (8W)  |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                      |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 DUAL DIE (12W) |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                      |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 (3 DIE)        |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                      |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 with substrate |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                      |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 HOLELESS       |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |

 

 
| COST  ADDER FOR MANUAL UIS         |   | [  * ]                           |     |
|------------------------------------|--------|----------------------------------|----------|
| COST  ADDER FOR THERMAPHASE        |   | [  * ]                           |     |
| COST  REDUCTION FOR DICE RCVD SAWN |   | [  * ]                           | (SINGLE) |
|                               |   | [  * ]                           | (DUAL)   |
| QUICK TURN ADDER                   |   | [  * ] SINGLE DIE, [ * ] PCS MAX |

 

ADDITIONALPROVISIONS

*ALLTO-264 BASE PRICES INCLUDE O/S TEST, FINAL TEST, MARK, SOLDER DIP, FINAL TEST,SHIPPING TUBES & BOXES

*TEAMSUPPLIES ALL MATERIALS EXCEPT DIE UNLESS OTHERWISE STATED HEREIN

 

**STANDARD D3PAK**

 
| ** **            | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **       | ** ** | **HYSOL**                      | ** ** |
|-----------------------|------------|------------|------------|--------------------------------|------------|------------------|------------|--------------------------------|------------|
| ** **            | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** |
| STD TO-268 SINGLE DIE |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                  |       |       |       |                           |       |             |       |                           |       |
| STD TO-268 DUAL DIE   |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                  |       |       |       |                           |       |             |       |                           |       |
| STD TO-268 RF (D3)    |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |

 
| COST  ADDER FOR MANUAL UIS         |   | [  * ]                           |
|------------------------------------|--------|----------------------------------|
| COST  ADDER FOR FINAL TEST         |   | [  * ]                           |
| COST  ADDER FOR TAPE & REEL    |   | [  * ]                           |
| COST  REDUCTION FOR DICE RCVD SAWN |   | [  * ]                           |
| QUICK TURN ADDER                   |   | [  * ] SINGLE DIE, [ * ] PCS MAX |

 

**NOTE:**[ * ]**PRICE FOR TO-268 (S) IS EFFECTIVE MAY 10, 2002**

 

ADDITIONALPROVISIONS

*ALLD3PAK BASE PRICE INCLUDE O/S TEST, MARK, SOLDER PLATE, SHIPPING TUBES &BOXES

*TEAMSUPPLIES ALL MATERIALS EXCEPT DIE UNLESS OTHERWISE STATED HEREIN.

 

**TO-3**

 
| ** **                                        | ** ** | **PRICE EFF.  March 1, 2003** | ** ** |
|---------------------------------------------------|------------|-------------------------------|------------|
| TO-3 SINGLE  DIE                                  |       |                          |       |
| APT SUPPLIES  HEADERS AND CANS                    | BASE PRICE |                          | [ * ]      |   |
|                                              |       |                          |       |   |
| QUICK  TURN ADDER [ * ] SINGLE DIE, [ * ] PCS MAX |       |
|                                                   |            |                               |            |  |  |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED  

 

16

----

 

ADDITIONALPROVISIONS

*ALLTO3 BASE PRICES INCLUDE O/S TEST, MARK, SOLDER DIP, SHIPPING TUBES & BOXES

 

**DIE PREP**

 
| ** **               | ** ** | **PRICE EFF.  March 1, 2003** | ** ** |
|--------------------------|------------|-------------------------------|------------|
| APT SUPPLIES WAFFLE PACK | BASE PRICE |                          | [ * ]      |   |
|                          |            |                               |            |  |

 
| ** **                | ** ** | **PRICE EFF.  March 1, 2003** | ** ** |
|---------------------------|------------|-------------------------------|------------|
| TEAM SUPPLIES WAFFLE PACK | BASE PRICE |                          | [ * ]      |   |
|                           |            |                               |            |  |

 

 
| Signed  by:       |   |
|-------------------|--------|
|              |   |
| Russell  Crecraft | Date:  |
| APT               |   |
|              |   |
|              |   |
| Luisa  Merana     | Date:  |
| Team  Pacific     |   |

 

----

[ * ] = CONFIDENTIAL TREATMENTREQUESTED  

 

17

----

 

**APPENDIXII**

**APT PRICETABLE FOR THE YEAR 2003**

Revised prices ofSOT-227 and TO-247 effective March 1, 2003 were based on immediate reductionthat Team can extend.

 

**STANDARD TO 247 & HOLELESSTO247**

 
| ** **                                                                        | ** ** | ** ** | ** ** | **KTMC**                      | ** ** | ** **       | ** ** | **HYSOL**                     | ** ** |
|-----------------------------------------------------------------------------------|------------|------------|------------|-------------------------------|------------|------------------|------------|-------------------------------|------------|
| ** **                                                                        | ** ** | ** ** | ** ** | **PRICE EFF. March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF. March 1,  2003** | ** ** |
| STD TO 247  W/SINGLE DIE TO247 SINGLE DIE W/O CATHODE WIRE AUTO TRIM/AUTO LEADCUT |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         |       |
|                                                                              | ** ** | ** ** | ** ** | ** **                    | ** ** | ** **       | ** ** | ** **                    | ** ** |
| STANDARD TO247  DUAL DIE                                                          |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         | ** ** |
|                                                                              | ** ** | ** ** | ** ** | ** **                    | ** ** | ** **       | ** ** | ** **                    | ** ** |
| STD TO247 SINGLE  DIE W/CATHODE WIRE, W/O CENTER LEAD, MAN L/CUT                  |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         | ** ** |
|                                                                              | ** ** | ** ** | ** ** | ** **                    | ** ** | ** **       | ** ** | ** **                    | ** ** |
| STD TO247 DUAL  DIE W/CATHODE WIRE, W/O CENTER LEAD, MAN L/CUT                    |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         | ** ** |
|                                                                              | ** ** | ** ** | ** ** | ** **                    | ** ** | ** **       | ** ** | ** **                    | ** ** |
| STD TO247  RF104/114 APT SUPPLIES SUBSTRATES                                      |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         | ** ** |
|                                                                              |       |       |       |                          |       |             |       |                          |       |
| STD TO247 RF  105/125 APT SUPPLIES SUBSTRATES                                     |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         |       |
|                                                                              |       |       |       |                          |       |             |       |                          |       |
| HOLELESS TO247  SINGLE DIE                                                        |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         |       |
|                                                                              |       |       |       |                          |       |             |       |                          |       |
| HOLELESS TO247  DUAL DIE                                                          |       | BASE PRICE |       | [ * ]                         |       | [ * ]            |       | [ * ]                         |       |

 
| TEST PRICE W/ OR W/O  UIS                 |                                             | [ * ]                           |
|-------------------------------------------|--------------------------------------------------|---------------------------------|
| COST DEDUCTION FOR DICE  RCVD SAWN (1DIE) |                                             | [ * ]                           |
| COST DEDUCTION FOR DICE  RCVD SAWN (2DIE) |                                             | [ * ]                           |
|                                      | QUICK TURN ADDER [ * ]  SINCE DIE, [ * ] PCS MAX |                            |   |
|                                      |                                             | [ * ] ALL OTHER, [ * ]  PCS MAX |   |   |
|                                           |                                                  |                                 |  |  |

 

ADDITIONALPROVISIONS

*ALL TO247 BASEPRICES INCLUDE O/S TEST, MARK, SOLDER DIP, SHIPPING TUBES, & BOXES

*THE US$[ * ] REDUCTION IN PRICE APPLIES ONLLY TO DEVICES USING KOBESELECTIVE PLATED LEADFRAME AND DO NOT APPLY TO RF DEVICES AND THOSE DEVICESWITH DOWNBONDS

* TEAM SUPPLIESALL MATERIALS EXCEPT DIE UNLESS OTHERWISE STATED HEREIN

 

**STANDARDSOT 227**

 
| ** **                                                                              | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **          | ** ** | **HYSOL**        | ** ** |
|-----------------------------------------------------------------------------------------|------------|------------|------------|--------------------------------|------------|---------------------|------------|------------------|------------|
| ** **                                                                              | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **PRICE EFF.  TBA** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **PRICE EFF.  TBA** | ** ** |
| SOT227 SINGLE  DIE USING THERMIC EDGE & CERAMTEC SUBSTRATE & WTD FRAME+WTD BASE |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 
| ** **                                                                       | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **          | ** ** | **HYSOL**        | ** ** |
|----------------------------------------------------------------------------------|------------|------------|------------|--------------------------------|------------|---------------------|------------|------------------|------------|
| ** **                                                                       | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **PRICE EFF.  TBA** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **PRICE EFF.  TBA** | ** ** |
| SOT227 DUAL DIE  USING WTD BASE & FRAME                                      |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                             |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| SOT 227 3 DIE  USING WTD BASE & FRAME                                        |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                             |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| 1/2,  PARALLEL/ANTI-PARALLELP/FRED                                               |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                             |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| 1/2H,  PARALLEL/ANTI PARALLEL/FRED Single die, paddle-less thin alumina with DBC |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                             |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| PFC                                                                              |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                             |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| RF (32W) APT  SUPPLIES CTR SUBTRATE                                              |       | BASE PRICE |       | [ * ]                          |       | [ * ]               |       | [ * ]            |       | [ * ] |   | [ * ] |   |
|                                                                             |       |       |       |                           |       |                |       |             |       |   |   |   |   |
| INDUCTOR COIL  APT SUPPLIES L/FRAME & SUBSTRATE                              |       | BASE PRICE |       | [ * ]                          |       |                |       | [ * ]            |       | [ * ] |   |   |   |

 
| SOT-2 CONTINUED:                                                                                 |   |                             |   |     |
|--------------------------------------------------------------------------------------------------|--------|----------------------------------|--------|----------|
| COST  ADDER FOR MANUAL UIS                                                                       |   | [ * ]                            |   |     |
| COST  ADDER FOR SOLDER PLATE                                                                     |   | [ * ]                            |   |     |
| PRICE  FOR MANUAL FINAL TEST P/AP (2D)                                                           |   | [ * ]                            |   |     |
| PRICE  FOR DVSD, FT, Q+&NO UIS                                                               |   | [ * ]                            |   |     |
| PRICE  FOR UIS, DVSD, FT, Q+                                                                     |   | [ * ]                            |   |     |
| COST  FOR REDUCTION FOR DICE RCVD SAWN                                                           |   | [ * ]                            |   | (AP)     |
|                                                                                             |   | [ * ]                            |   | (DUAL)   |
|                                                                                             |   | [ * ]                            |   | (P)      |
|                                                                                             |   | [ * ]                            |   | (SINGLE) |
| QUICK  TURN ADDER                                                                                |   | [ * ] SINGLE DIE, [ * ]  PCS MAX |
|                                                                                             |   | [ * ] ALL OTHER, [ * ]  PCS MAX  |
| COST  ADDER FOR P/AP ISOLATION LEAD TO LEAD                                                      |   | [ * ]                            |   |     |
| ON  DEVICE 4XX-XXXX DIODE ONLY                                                                   |   |                             |   |     |
| COST  ADDER FOR PAD C USING LARGE                                                                |   | [ * ]                            |   |     |
| ALUMINUM  NITRIDE SUBSTRATE                                                                      |   |                             |   |     |
| PRICE  EFF **TBA** – WILL DEPEND ON THE ACTUAL  CHANGE IN MATERIAL SUPPLIER FROM WTD TO SDI |

 

ADDITIONAL PROVISIONS

*ALL SOT BASE PRICESINCLUDE O/S & ISOLATION TEST, MOUNTING HARDWARE (SCREW/NUTS/WASHERS),SHIPPING TUBES & BOXES

*ALL SOT ASSEMBLY ASSUMESTHE USE OF ALN SUBSTRATES (MIN CONDUCTIVITY IS 170 W/C)

*TEAM SUPPLIES ALLMATERIALS EXCEPT DICE UNLESS OTHERWISE STATED HEREIN

 

**STANDARDTO-264**

 
| ** **                | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **       | ** ** | **HYSOL**                      | ** ** |
|---------------------------|------------|------------|------------|--------------------------------|------------|------------------|------------|--------------------------------|------------|
| ** **                | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** |
| STD TO-264  SINGLE DIE    |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                      |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 DUAL  DIE (8W) |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |

 

----

[ * ] = CONFIDENTIALTREATMENT REQUESTED

 

----

 
| ** **                 | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **       | ** ** | **HYSOL**                      | ** ** |
|----------------------------|------------|------------|------------|--------------------------------|------------|------------------|------------|--------------------------------|------------|
| ** **                 | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** |
| STD TO-264 DUAL  DIE (12W) |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                       |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 (3  DIE)        |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                       |       |       |       |                           |       |             |       |                           |       |
| STD TO-264 with  substrate |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                       |       |       |       |                           |       |             |       |                           |       |
| STD TO-264  HOLELESS       |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |

 
| NOTE:  |   | Standard TO-264 dual  die (8W) price of [ * ]is effective June 01, 2001   |
|--------|--------|---------------------------------------------------------------------------|
|   |   | Standard TO-264 dual  die (12W) price of [ * ] is effective June 01, 2001 |

 
| COST  ADDER FOR MANUAL UIS         |   | [ * ]                            |   |     |
|------------------------------------|--------|----------------------------------|--------|----------|
| COST  ADDER FOR THERMAPHASE        |   | [ * ]                            |   |     |
| COST  REDUCTION FOR DICE RCVD SAWN |   | [ * ]                            |   | (SINGLE) |   |
|                               |   | [ * ]                            |   | (DUAL)   |   |
| QUICK TURN ADDER                   |   | [ * ] SINGLE DIE, [ * ]  PCS MAX |

 

ADDITIONAL PROVISIONS

*ALL TO-264 BASE PRICESINCLUDE O/S TEST, FINAL TEST, MARK, SOLDER DIP, FINAL TEST, SHIPPING TUBES& BOXES

*TEAM SUPPLIES ALLMATERIALS EXCEPT DIE UNLESS OTHERWISE STATED HEREIN

 

**STANDARDD3PAK**

 
| ** **             | ** ** | ** ** | ** ** | **KTMC**                       | ** ** | ** **       | ** ** | **HYSOL**                      | ** ** |
|------------------------|------------|------------|------------|--------------------------------|------------|------------------|------------|--------------------------------|------------|
| ** **             | ** ** | ** ** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** | **HYSOL  ADDER** | ** ** | **PRICE EFF.  March 1,  2003** | ** ** |
| STD TO-268  SINGLE DIE |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                   |       |       |       |                           |       |             |       |                           |       |
| STD TO-268 DUAL  DIE   |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |
|                   |       |       |       |                           |       |             |       |                           |       |
| STD TO-268 RF  (D3)    |       | BASE PRICE |       | [ * ]                          |       | [ * ]            |       | [ * ]                          |       |

 
| COST  ADDER FOR MANUAL UIS         |   | [ * ]                            |
|------------------------------------|--------|----------------------------------|
| COST  ADDER FOR FINAL TEST         |   | [ * ]                            |
| COST  ADDER FOR TAPE & REEL    |   | [ * ]                            |
| COST  REDUCTION FOR DICE RCVD SAWN |   | [ * ]                            |
| QUICK TURN ADDER                   |   | [ * ] SINGLE DIE, [ * ]  PCS MAX |

 
| **NOTE:**[ * ]** **PRICE**FOR TO-268 (S) IS  EFFECTIVE MAY 10, 2002** |
|----------------------------------------------------------------------------|

 

ADDITIONAL PROVISIONS

*ALL D3PAK BASE PRICEINCLUDE O/S TEST, MARK, SOLDER PLATE, SHIPPING TUBES & BOXES

*TEAM SUPPLIES ALLMATERIALS EXCEPT DIE UNLESS OTHERWISE STATED HEREIN.

 

**TO-3**

 
| ** **                                     | ** ** | ** ** | ** ** | **PRICE EFF.  March 1, 2003** | ** ** |
|------------------------------------------------|------------|------------|------------|-------------------------------|------------|
| TO-3 SINGLE DIE  APT SUPPLIES HEADERS AND CANS |       | BASE PRICE |       | [ * ]                         |       |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

QUICK TURN ADDER [ * ] SINGLE DIE, [ * ] PCS MAX

 

ADDITIONAL PROVISIONS

*ALL TO3 BASE PRICESINCLUDE O/S TEST, MARK, SOLDER DIP, SHIPPING TUBES & BOXES

 

**DIE PREP**

 
| ** **                | ** ** | ** ** | ** ** | **PRICE EFF. March 1, 2003** | ** ** |
|---------------------------|------------|------------|------------|------------------------------|------------|
| APT SUPPLIES  WAFFLE PACK |       | BASE PRICE |       | [ * ]                        |       |

 
| ** **                 | ** ** | ** ** | ** ** | **PRICE EFF. March 1, 2003** | ** ** |
|----------------------------|------------|------------|------------|------------------------------|------------|
| TEAM SUPPLIES  WAFFLE PACK |       | BASE PRICE |       | [ * ]                        |       |

 
| Signed by:       |   |
|------------------|--------|
|             |   |
| Russell Crecraft | Date:  |
| APT              |   |
|             |   |
|             |   |
| Luisa Merana     | Date:  |
| Team Pacific     |   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

#### **APPENDIX III**

 

**ASSEMBLERINTERNAL MONITORS**

 

**PERFORMEDMONTHLY**

 

| ** **         | ** ** | **SOT-227** | ** ** | **TO-247** | ** ** | **D3PAK** | ** ** | **TO-264** | ** ** |
|--------------------|------------|-------------|------------|------------|------------|-----------|------------|------------|------------|
| TEMPERATURE  CYCLE |       | 8 PCS.      |       | 22 PCS.    |       | 8 PCS.    |       | 8 PCS.     |       |
| PRESSURE POT       |       | 8 PCS.      |       | 22 PCS.    |       | 8 PCS.    |       | 8 PCS.     |       |
| 85/85              |       | 8 PCS.      |       | 22 PCS.    |       | 8 PCS.    |       | 8 PCS.     |       |
| CORRELATION        |       | 24 PCS.     |       | 66 PCS.    |       | 24 PCS.   |       | 24 PCS     |       |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

**APPENDIXIV**

**APTCONSIGNED EQUIPMENT**

 
| ** ** | ** ** | **EQUIPMENT CONSIGNED**                     | ** ** | **MANUFACTURER**              | ** ** | **QTY**                | ** ** | **REMARKS**                                           | ** ** | **APT INVTY#**   |
|------------|------------|---------------------------------------------|------------|-------------------------------|------------|------------------------|------------|-------------------------------------------------------|------------|------------------|
| 1.0        |       | COMPUTER

- CPU  - MONITOR  - PRINTER       |       | - COMPAQ  - COMPAQ  - EPSON   |       | 1 UNIT  1 UNIT  1 UNIT |       | SN : 7930CVN60087  SN : 933BB48KABD7  SN : 2YPX005282 |       | Not Avail.       |
| 2.0        |       | D3 TEST HANDLER                             |       | Exatron                       |       | 1 UNIT                 |       | 5000 HANDLER,  SN : 5000H9801085                      |       | Not Avail.       |
| 3.0        |       | T0 247 HANDLER                              |       | Exatron                       |       | 1 UNIT                 |       | SN : H50000005125                                     |       | Not Avail.       |
| 4.0        |       | DELTA TESTER 8114-KT                        |       | TESEC                         |       | 2 UNITS                |       | SN : 41890-0338  SN : 41890-0281                      |       | 0826  Not Avail. |
| 5.0        |       | DELTA TESTER 8115-PU                        |       | TESEC                         |       | 2 UNIT                 |       | SN : 41900-0338  SN : 41900-0281                      |       | Not Avail.       |
| 6.0        |       | HIGH VOLTAGE MODEL  7818-HV                 |       | TESEC                         |       | 1 UNIT                 |       | SN : 41900-0339                                       |       | Not Avail.       |
| 7.0        |       | D3 TRIM FORM TOOL                           |       | Kras                          |       | I UNIT                 |       | SN : 41900-0340                                       |       | Not Avail.       |
| 8.0        |       | T0-247 CENTER LEAD TRIM  TOOL               |       | RB -Tech                      |       | I UNIT                 |       |                                                  |       | Not Avail.       |
| 9.0        |       | HCU HEADBOX 7819-HB                         |       | TESEC                         |       | 1 UNIT                 |       | 7819-HB                                               |       |             |
| 10.0       |       | HCU HEADBOX 9247-HB                         |       | TESEC                         |       | 1 UNIT                 |       | 9247-HB                                               |       |             |
| 11.0       |       | ISOLATION TESTER                            |       | KIKUSUI/T0SH651               |       | 1 UNIT                 |       | SN :28101279                                          |       | Not Avail.       |
| 12.0       |       | ISOLATION TESTER (TOS  8850A)               |       | KIKUSUI                       |       | 1 UNIT                 |       | SN: FB001349                                          |       | Not Avail.       |
| 13.0       |       | MANUAL TEST MODULE  80005-MB                |       | TESEC                         |       | 1 UNIT                 |       | SN : 41740-0130                                       |       | Not Avail.       |
| 14.0       |       | SOT-227 HANDLER                             |       | EXATRON                       |       | 1 UNIT                 |       | SN: H50000012128 and  5000TESTSIP0012028              |       | 0791             |
| 15.0       |       | SOT-227  HANDLER-ISOLATION TESTER INTERFACE |       | APT                           |       | 1 UNIT                 |       | SN: 120-0006                                          |       | Not Avail.       |
| 16.0       |       | SOT-227 HANDLER-SYTEM  INTERFACE            |       | APT                           |       | 1 UNIT                 |       | SN: 120-0004                                          |       | Not Avail.       |
| 17.0       |       | TESEC 8101 TT                               |       | TESEC                         |       | 1 UNIT                 |       | SN : 41840-0373                                       |       | 0825             |
| 18.0       |       | TESEC HI-CURRENT UNIT  8213-CU              |       | TESEC                         |       | 2 UNITS                |       | SN : 41950-0047  SN : 41950-0095                      |       | Not Avail.       |
| 19.0       |       | TESEC HI-CURRENT UNIT  8610-CU/J            |       | TESEC                         |       | 1 UNIT                 |       | SN : 45350-0351                                       |       | 0989             |
| 20.0       |       | TO 247 HANDLER-SYSTEM  INTERFACE            |       | APT                           |       | 1 UNIT                 |       | SN: 120-0004                                          |       | Not Avail.       |
| 21.0       |       | UIS TESTER                                  |       | ITC5510G                      |       | 2 UNITS                |       | SN : 9103  SN : 9011                                  |       | Not Avail.       |
| 22.0       |       | UIS TESTER INDUCTOR  LOAD                   |       | ITC5514B                      |       | 2 UNITS                |       | SN : 9104  SN : 8836                                  |       | Not Avail.       |
| 23.0       |       | TESEC 24 PIN SCANNER                        |       | TESEC                         |       | 1 UNIT                 |       | MODEL 9229-HB  SN 46190-0007                          |       | Not Avail.       |
| 24.0       |       | EXTERNAL TESTER HEADBOX                     |       | TESEC                         |       | 1 UNIT                 |       | MODEL 8317-MBF                                        |       | Not Avail.       |
| 25.0       |       | ASPM SCANNER SET-UP  BENCH                  |       | APT                           |       | 1 UNIT                 |       |                                                  |       | Not Avail.       |
| 26.0       |       | CURVE TRACER, 577  TEKTRONIX                |       | TUCKER                        |       | I UNIT                 |       | SN : B103490                                          |       | Not Avail.       |
| 27.0       |       | MICROPROBER                                 |       | MICROMANIPULATOR/  MODEL 6000 |       | 1 UNIT                 |       | SN : 83010                                            |       | Not Avail.       |
| 28.0       |       | ORTHODYNE MODEL 20  BONDER                  |       | ORTHODYNE                     |       | 1 UNIT                 |       | SN : 101301                                           |       | Not Avail.       |
| 29.0       |       | ORTHODYNE MODEL M360H  BONDER               |       | ORTHODYNE                     |       | 1 UNIT                 |       | SN : 0001040                                          |       | 0851             |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 
| ** ** | ** ** | **EQUIPMENT CONSIGNED**                                                                        | ** ** | **MANUFACTURER**                                                           | ** ** | **QTY**                                         | ** ** | **REMARKS**                                                         | ** ** | **APT INVTY#** |
|------------|------------|------------------------------------------------------------------------------------------------|------------|----------------------------------------------------------------------------|------------|-------------------------------------------------|------------|---------------------------------------------------------------------|------------|----------------|
| 30.0       |       | T0-247 120 CAVITIES  MOLD TOOL/LOADING FRAME                                                   |       | Mospec                                                                     |       | 1 UNIT                                          |       | SN : Not Available                                                  |       | Not Avail.     |
| 31.0       |       | D3 MOLD TOOL/LOADING  FRAME, 120 CAVITIES                                                      |       | Micro Precesion  Tooling                                                   |       | 1 UNIT                                          |       | Purchased jointly with  Motorola                                    |       | Not Avail.     |
| 32.0       |       | SOT-227 2-CHASES                                                                               |       | Samtec/Sungwoo                                                             |       | 1-CHASE ONLY                                    |       | De- commissioned                                                    |       | Not Avail.     |
| 33.0       |       | DEGREASER                                                                                      |       | SONICOR                                                                    |       | I UNIT                                          |       | SN : 102757-1298                                                    |       | Not Avail.     |
| 34.0       |       | GRANITE STONE                                                                                  |       | RAHN                                                                       |       | I UNIT                                          |       | SN : G-12944                                                        |       | Not Avail.     |
| 35.0       |       | ARBOR PRESS                                                                                    |       | Jamesville Tool  & MFG.                                                |       | I UNIT                                          |       | SN: 608-868-4711                                                    |       | Not Avail.     |
| 36.0       |       | DIGIMATIC  MINIPROCESSOR/CALIPER                                                               |       | MITUTUYO                                                                   |       | I UNIT                                          |       | SN : 7676256                                                        |       | Not Avail.     |
| 37.0       |       | WEIGHING SCALE                                                                                 |       | FUJI                                                                       |       | I UNIT                                          |       | SN : MHYOO308                                                       |       | Not Avail.     |
| 38.0       |       | REHM

- Oscilloscope  - Multimeter  - Multimeter  - Test Fixture  - Test Fixture  - GPIB Board |       | Tektronix 2430A  Fluke 73  Fluke 75  RHM 5010RTS  PCB RHM5010RTS  GPIB/TNT |       | 1 UNIT  2 UNITS  1 UNIT  1 UNIT  1 UNIT  1 UNIT |       | SN : 700102  NA

NA

BP528A

BP0365A

ASSY No. 181830E-01           |       | Not Avail.     |
| 39.0       |       | HOT CHUCK                                                                                      |       | Pacific Western  System                                                    |       | 1 UNIT                                          |       | NA                                                                  |       | 0867           |
| 40.0       |       | REHM POWER SUPPLY                                                                              |       | RHM5010RTS                                                                 |       | 1 UNIT                                          |       | BT0227                                                              |       | Not Avail.     |
| 41.0       |       | CENTROTHERM                                                                                    |       | Centrotherm GMBH  & Co.                                                |       | 1 UNIT                                          |       | MODELl VLO-180-H2-

N2H2

Documentation #:

1_31900.00.26/ 00300011 |       | 0790           |
| 42.0       |       | SIKAMA                                                                                         |       | SIKAMA  INTERNATIONAL, INC.                                                |       | 1 UNIT                                          |       | SN 01-42-136                                                        |       | Not Avail.     |
| 43.0       |       | ASPM DC ISOLATION  TESTER                                                                      |       | APT (Sefelec)                                                              |       | 1 UNIT                                          |       | SN : BT0001-01                                                      |       | Not Avail.     |

 
| Revision Date: November  26, 2002 |   |   |
|-----------------------------------|--------|--------|
|                              |   |   |
| Approved by:                      |   |   |
|                              |   |   |
|                              |   |   |
| L. Merana – Team             |   |   |
|                              |   |   |
|                              |   |   |
| R. Crecraft - APT                 |   |   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

#### **APPENDIX V**

 

**LIST OFCONSIGNED MATERIALS FOR ASPM**

 

**FBH (SP3)Materials**

 
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
|            |       |            |

 

**FB2U (SP2) Materials**

 
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
|            |       |            |
|            |       |            |
|            |       |            |

 

**REHM(MC1732CB) Materials**

**Materials**

 
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |

 

**KPT (MC1007 and MC1008)**

 
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
|            |       |            |
|            |       |            |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

**Driver /Exciter Materials**

 
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |

 

**StealthMaterials**

 
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |

 

### **Power Pack Materials**

** **
| **Description** | ** ** | **Part Number** |
|-----------------|------------|-----------------|
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |
| [ * ]           |       | [ * ]           |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

**APPENDIXVI**

** **

**TeamAssembly Flow Charts for ASPM (Application Specific Power Modules)**

 

**ASPM:**

 
| **EFFECTIVITY  DATE/DATE  POSTED** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                                               |
|------------------------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------------------------------|
| 26-Jan-01                          |       | TAFC-1213         |       | 5                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) SP2/SP3                        |
| 23 March 2004                      |       | TAFC-1221         |       | 8                          |       | TPC APT ASPM STEALTH  ASSEMBLY PROCESS FLOWCHART                                 |
| 23 March 2004                      |       | TAFC-1220         |       | 5                          |       | TPC APT ASPM  DRIVER/EXCITER ASSEMBLY PROCESS FLOWCHART                          |
| 17 June 2004                       |       | TAFC-1223         |       | 9                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) KPT ASSEMBLY PROCESS FLOWCHART |
| 11-Aug-03                          |       | TAFC-1233         |       | 2                          |       | TPC APT ASPM POWER PACK  ASSEMBLY PROCESS FLOWCHART                              |

 
| Revision Date :  November 23, 2004 |                     |
|------------------------------------|--------------------------|
|                               |                     |
| Approved by:                       |                     |
|                               |                     |   |   |
|                               | Luisa Merana – Team |   |
|                               |                     |   |
|                               |                     |   |
|                               | Russell Crecraft - APT   |   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

**APPENDIXVI**

** **

**TeamAssembly Flow Charts for ASPM (Application Specific Power Modules)**

 

**ASPM:**

 
| **EFFECTIVITY  DATE** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                                               |
|-----------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------------------------------|
| 26-Jan-01             |       | TAFC-1213         |       | 5                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) SP2/SP3                        |
| 04 Aug 03             |       | TAFC-1221         |       | 7                          |       | TPC APT ASPM STEALTH  ASSEMBLY PROCESS FLOWCHART                                 |
| 05-Sept-03            |       | TAFC-1220         |       | 3                          |       | TPC APT ASPM  DRIVER/EXCITER ASSEMBLY PROCESS FLOWCHART                          |
| May 7, 2003           |       | TAFC-1223         |       | 8                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) KPT ASSEMBLY PROCESS FLOWCHART |
| 11-Aug-01             |       | TAFC-1233         |       | 2                          |       | TPC APT ASPM POWER PACK  ASSEMBLY PROCESS FLOWCHART                              |

 

 
| Revision Date: October  13, 2003 |                     |
|----------------------------------|--------------------------|
|                             |                     |
| Approved by:                     |                     |
|                             |                     |   |
|                             | Luisa Merana – Team |   |
|                             |                     |   |
|                             |                     |   |
|                             | Russell Crecraft - APT   |   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

----

 

**APPENDIXVI**

** **

**TeamAssembly Flow Charts for ASPM (Application Specific Power Modules)**

 

**ASPM:**

 
| **EFFECTIVITY  DATE** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                                               |
|-----------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------------------------------|
| 26-Jan-01             |       | TAFC-1213         |       | 5                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) SP2/SP3                        |
| 29 Aug 02             |       | TAFC-1221         |       | 6                          |       | TPC APT ASPM STEALTH  ASSEMBLY PROCESS FLOWCHART                                 |
| 20-Nov-00             |       | TAFC-1220         |       | 2                          |       | TPC APT ASPM  DRIVER/EXCITER ASSEMBLY PROCESS FLOWCHART                          |
| May 7, 2003           |       | TAFC-1223         |       | 8                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) KPT ASSEMBLY PROCESS FLOWCHART |
| 28-Nov-01             |       | TAFC-1233         |       | 1                          |       | TPC APT ASPM POWER PACK  ASSEMBLY PROCESS FLOWCHART                              |

 

 
| Revision Date: May 9,  2003 |                     |
|-----------------------------|--------------------------|
|                        |                     |
| Approved by:                |                     |
|                        |                     |   |   |
|                        | Luisa Merana – Team |   |   |
|                        |                     |   |   |
|                        |                     |   |   |
|                        | Russell Crecraft - APT   |   |   |

 

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[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

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**APPENDIXVI**

** **

**TeamAssembly Flow Charts for ASPM (Application Specific Power Modules)**

 

**ASPM:**

 
| **EFFECTIVITY  DATE** | ** ** | **DOCUMENT  NO.** | ** ** | **ISSUE/REVISION  NUMBER** | ** ** | **DOCUMENT TITLE**                                                               |
|-----------------------|------------|-------------------|------------|----------------------------|------------|----------------------------------------------------------------------------------|
| 26-Jan-01             |       | TAFC-1213         |       | 5                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) SP2/SP3                        |
| 29 Aug 02             |       | TAFC-1221         |       | 6                          |       | TPC APT ASPM STEALTH  ASSEMBLY PROCESS FLOWCHART                                 |
| 20-Nov-00             |       | TAFC-1220         |       | 2                          |       | TPC APT ASPM  DRIVER/EXCITER ASSEMBLY PROCESS FLOWCHART                          |
| 04 Sept 02            |       | TAFC-1223         |       | 7                          |       | TPC-APT APPLICATION  SPECIFIC POWER MODULE (ASPM) KPT ASSEMBLY PROCESS FLOWCHART |
| 28-Nov-01             |       | TAFC-1233         |       | 1                          |       | TPC APT ASPM POWER PACK  ASSEMBLY PROCESS FLOWCHART                              |
| 26 Sept 02            |       | TAFC-1224         |       | 4                          |       | TPC-APT APPLICATION  SPECIFIC MODULE (ASPM) REHM                                 |

 
| Approved by: |                     |
|--------------|--------------------------|
|         |                     |   |
|         | Luisa Merana – Team |   |
|         |                     |   |
|         |                     |   |
|         | Russell Crecraft - APT   |   |

 

----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

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----

[ * ] = CONFIDENTIAL TREATMENT REQUESTED

 

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