# Patent

## Title
Semiconductor device, manufacturing method of semiconductor device, and electronic device

## Abstract

Provided is a semiconductor device which can suppress an increase in oxygen vacancies in an oxide semiconductor layer and a manufacturing method of the semiconductor device. The semiconductor device includes a first oxide semiconductor layer over the first insulating layer; a second oxide semiconductor layer over the first oxide semiconductor layer; a third oxide semiconductor layer over the second oxide semiconductor layer; a source electrode layer and a drain electrode layer each over the third oxide semiconductor layer; a fourth semiconductor layer over the source and drain electrode layers, and the third oxide semiconductor layer; a gate insulating layer over the fourth oxide semiconductor layer; a gate electrode layer over the gate electrode layer and overlapping with the source and drain electrode layers, and the fourth oxide semiconductor layer; and a second insulating layer over the first insulating layer, and the source, gate, and drain electrode layers.

## Background
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an object, a method, or a manufacturing method. The present invention relates to a process, a machine, manufacture, or a composition of matter. In particular, the present invention relates to, for example, a semiconductor device, a display device, a light-emitting device, a power storage device, an imaging device, a driving method thereof, or a manufacturing method thereof. In particular, one embodiment of the present invention relates to a semiconductor device or a manufacturing method of the semiconductor device.
In this specification and the like, a semiconductor device generally means a device that can function by utilizing semiconductor characteristics. A transistor and a semiconductor circuit are embodiments of semiconductor devices. In some cases, a storage device, a display device, or an electronic device includes a semiconductor device.
2. Description of the Related Art
A technique by which a transistor is formed using a semiconductor film formed over a substrate having an insulating surface has been attracting attention. The transistor is applied to a wide range of electronic devices, such as an integrated circuit (IC) or an image display device (display device). A silicon-based semiconductor material is widely known as a material for a semiconductor thin film applicable to a transistor. As another material, an oxide semiconductor has been attracting attention.
For example, a transistor whose active layer includes an amorphous oxide semiconductor containing indium (In), gallium (Ga), and zinc (Zn) is disclosed in Patent Document 1.
REFERENCE
Patent Document
[Patent Document 1] Japanese Published Patent Application No. 2006-165528
SUMMARY OF THE INVENTION
It is known that an oxygen vacancy in an oxide semiconductor contributes to the formation of a donor; thus, in the case where the oxide semiconductor is used for a channel formation region of a transistor, an oxide semiconductor layer including as few oxygen vacancies as possible is preferably used.
However, even when an oxide semiconductor layer includes few oxygen vacancies initially, oxygen vacancies can be increased in number by various causes in a manufacturing process of a transistor. An increase in oxygen vacancies in an oxide semiconductor layer can cause poor electrical characteristics in some cases; for example, the transistor becomes normally-on, leakage current increases, or threshold voltage is shifted due to stress application.
It is also known that there are some causes of variation in electrical characteristics other than oxygen vacancies; for example, an interface state or the existence of impurities in the vicinity of a channel can cause poor electrical characteristics.
An object of one embodiment of the present invention is to provide a semiconductor device in which the amount of oxygen vacancies in an oxide semiconductor layer can be reduced. Another object is to provide a semiconductor device in which the amount of interface states in the vicinity of the oxide semiconductor layer can be reduced. Another object is to provide a semiconductor device having favorable electrical characteristics. Another object is to provide a semiconductor device having high reliability. Another object is to provide a semiconductor device with low power consumption. Another object is to provide a semiconductor device that can be manufactured in a simple process. Another object is to provide a novel semiconductor device or the like. Another object is to provide a manufacturing method of the semiconductor device.
The descriptions of these objects do not disturb the existence of other objects. Note that in one embodiment of the present invention, there is no need to achieve all the objects. Other objects will be apparent from and can be derived from the description of the specification, the drawings, the claims, and the like.
One embodiment of the present invention is a semiconductor device including a first insulating layer; a first oxide semiconductor layer over the first insulating layer; a second oxide semiconductor layer over the first oxide semiconductor layer; a third oxide semiconductor layer over the second oxide semiconductor layer; a source electrode layer and a drain electrode layer each over the third oxide semiconductor layer; a fourth semiconductor layer over the source electrode layer, the drain electrode layer, and the third oxide semiconductor layer; a gate insulating layer over the fourth oxide semiconductor layer; a gate electrode layer over the gate insulating layer and overlapping with the source electrode layer, the drain electrode layer, and the fourth oxide semiconductor layer; and a second insulating layer over the first insulating layer, the source electrode layer, the gate electrode layer, and the drain electrode layer.
One embodiment of the present invention is a semiconductor device including a first insulating layer; a first oxide semiconductor layer over the first insulating layer; a second oxide semiconductor layer over the first oxide semiconductor layer; a third oxide semiconductor layer over the second oxide semiconductor layer; a source electrode layer and a drain electrode layer each over the third oxide semiconductor layer; a fourth oxide semiconductor layer over the source electrode layer, the drain electrode layer, and the third oxide semiconductor layer; a gate insulating layer over the fourth oxide semiconductor layer; a gate electrode layer over the gate insulating layer and overlapping with the source electrode layer, the drain electrode layer, and the fourth oxide semiconductor layer; an intermediate layer over the first insulating layer, the source electrode layer, the gate electrode layer, and the drain electrode layer; and a second insulating layer over the first insulating layer and the intermediate layer. The intermediate layer surrounds an outer periphery of each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer.
The second insulating layer preferably has a barrier property against water, hydrogen, and oxygen.
The second insulating layer preferably has a function of supplying oxygen.
The second insulating layer preferably comprises aluminum oxide.
The intermediate layer preferably has a barrier property against water, hydrogen, and oxygen.
The intermediate layer preferably comprises any one of aluminum oxide, hafnium oxide, zirconium oxide, titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, tellurium oxide, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride, cobalt nitride, silicon nitride, manganese nitride, and hafnium nitride.
One embodiment of the present invention is a manufacturing method of a semiconductor device including steps of forming a first insulating layer; forming a first oxide semiconductor film over the first insulating layer; adding oxygen to the first oxide semiconductor film; forming a second oxide semiconductor film over the first oxide semiconductor film; forming a third oxide semiconductor film over the second oxide semiconductor film; forming a first conductive film over the third oxide semiconductor film; forming a first conductive layer by etching the first conductive film with use of a first resist mask; forming a first oxide semiconductor layer, a second oxide semiconductor layer, and a third oxide semiconductor layer by selectively etching the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with use of the first conductive layer as a mask; forming a source electrode layer and a drain electrode layer by selectively etching the first conductive layer with use of a second resist mask; forming a fourth oxide semiconductor film over the first insulating layer, the source electrode layer, the drain electrode layer, and the third oxide semiconductor layer; forming a second insulating film over the fourth oxide semiconductor film; forming a second conductive film over the second insulating film; forming a gate electrode layer by selectively etching the second conductive film with use of a third resist mask; forming a fourth oxide semiconductor layer and a gate insulating layer by selectively etching the fourth oxide semiconductor film and the second insulating film with use of a fourth resist mask; and forming a third insulating layer over the first insulating layer, the source electrode layer, the gate electrode layer, and the drain electrode layer.
One embodiment of the present invention is a manufacturing method of a semiconductor device including steps of forming a first insulating layer; forming a first oxide semiconductor film over the first insulating layer; adding oxygen to the first oxide semiconductor film; forming a second oxide semiconductor film over the first oxide semiconductor film; forming a third oxide semiconductor film over the second oxide semiconductor film; forming a first conductive film over the third oxide semiconductor film; forming a first conductive layer by etching the first conductive film with use of a first resist mask; forming a first oxide semiconductor layer, a second oxide semiconductor layer, and a third oxide semiconductor layer by selectively etching the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with use of the first conductive layer as a mask; forming a source electrode layer and a drain electrode layer by selectively etching the first conductive layer with use of a second resist mask; forming a fourth oxide semiconductor film over the first insulating layer, the source electrode layer, the drain electrode layer, and the third oxide semiconductor layer; forming a second insulating film over the fourth oxide semiconductor film; forming a second conductive film over the second insulating film; forming a gate electrode layer by selectively etching the second conductive film with use of a third resist mask; forming a fourth oxide semiconductor layer and a gate insulating layer by selectively etching the fourth oxide semiconductor film, and the second insulating film with use of a fourth resist mask; forming an intermediate film over the first insulating layer, the source electrode layer, the gate electrode layer, and the drain electrode layer; forming an intermediate layer by selectively etching the intermediate film with use of a resist mask so that the intermediate layer surrounds an outer periphery of each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer; and forming a third insulating layer over the first insulating layer and the intermediate layer.
The third insulating layer is formed preferably by a sputtering method.
The intermediate film is formed preferably by an ALD method.
The third insulating layer preferably comprises aluminum oxide.
The intermediate film preferably comprises any one of aluminum oxide, hafnium oxide, zirconium oxide, titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, tellurium oxide, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride, cobalt nitride, silicon nitride, manganese nitride, and hafnium nitride.
One embodiment of the present invention is an electronic device including the semiconductor device, a microphone, a speaker, and a housing.
According to one embodiment of the present invention, a semiconductor device in which the amount of oxygen vacancies in an oxide semiconductor layer can be reduced, a semiconductor device in which the amount of interface states in the vicinity of the oxide semiconductor layer can be reduced, a semiconductor device having favorable electrical characteristics, a semiconductor device having high reliability, a semiconductor device with low power consumption, a semiconductor device that can be manufactured in a simple process, a novel semiconductor device or the like, or a manufacturing method of the semiconductor device can be provided.
Note that the description of these effects does not disturb the existence of other effects. One embodiment of the present invention does not necessarily achieve all the effects listed above. Other effects will be apparent from and can be derived from the description of the specification, the drawings, the claims, and the like.



BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A to 1C are a top view and cross-sectional views illustrating a transistor.
FIGS. 2A to 2D are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 3A to 3E are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 4A to 4D are band diagrams of oxide semiconductor layers.
FIGS. 5A to 5D illustrate ALD deposition mechanism.
FIGS. 6A and 6B are schematic views of an ALD apparatus.
FIGS. 7A to 7C are a top view and cross-sectional views illustrating a transistor.
FIGS. 8A to 8E are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 9A to 9C are a top view and cross-sectional views illustrating a transistor.
FIGS. 10A to 10D are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 11A to 11D are a top view and cross-sectional views illustrating a transistor.
FIGS. 12A to 12D are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 13A to 13E are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 14A to 14C are a top view and cross-sectional views illustrating a transistor.
FIGS. 15A to 15D are cross-sectional views illustrating a manufacturing method of a transistor.
FIGS. 16A to 16D are Cs-corrected high-resolution TEM images of a cross section of a CAAC-OS and a cross-sectional schematic view of the CAAC-OS.
FIGS. 17A to 17D are Cs-corrected high-resolution TEM images of a plane of a CAAC-OS.
FIGS. 18A to 18C show structural analysis of a CAAC-OS and a single crystal oxide semiconductor by XRD.
FIGS. 19A and 19B show electron diffraction patterns of a CAAC-OS.
FIG. 20 shows a change of crystal parts of In—Ga—Zn oxide owing to electron irradiation.
FIGS. 21A to 21D are cross-sectional views and circuit diagrams of a semiconductor device.
FIGS. 22A to 22C are a cross-sectional view and circuit diagrams of a semiconductor device.
FIGS. 23A and 23B are plan views of an imaging device.
FIGS. 24A and 24B are plan views of pixels of an imaging device.
FIGS. 25A and 25B are cross-sectional views of an imaging device.
FIGS. 26A and 26B are cross-sectional views of an imaging device.
FIG. 27 illustrates a configuration example of an RF tag.
FIG. 28 illustrates a structure example of a CPU.
FIG. 29 is a circuit diagram of a memory element.
FIGS. 30A to 30C illustrate a configuration example of a display device and circuit diagrams of pixels.
FIG. 31 illustrates a display module.
FIGS. 32A and 32B are perspective views illustrating a cross-sectional structure of a package using a lead frame interposer.
FIGS. 33A to 33E are diagrams illustrating electronic devices.
FIGS. 34A to 34D are diagrams illustrating electronic devices.
FIGS. 35A to 35C are diagrams illustrating electronic devices.
FIGS. 36A to 36F are diagrams illustrating electronic devices.
FIG. 37 shows results of TDS measurement.
FIG. 38 shows results of TDS measurement.
FIG. 39 shows results of TDS measurement.
FIG. 40 is a cross-sectional view of manufactured transistors.
FIGS. 41A and 41B show results of electrical characteristics of the transistors.



DETAILED DESCRIPTION OF THE INVENTION
Embodiments will be described in detail with reference to the drawings. Note that the present invention is not limited to the following description. It will be readily appreciated by those skilled in the art that modes and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. The present invention therefore should not be construed as being limited to the following description of the embodiments. In structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and the description thereof is not repeated in some cases. The same components are denoted by different hatching patterns in different drawings, or the hatching patterns are omitted in some cases.
For example, in this specification and the like, an explicit description “X and Y are connected” means that X and Y are electrically connected, X and Y are functionally connected, and X and Y are directly connected. Accordingly, without being limited to a predetermined connection relationship, for example, a connection relationship shown in drawings or texts, another connection relationship is included in the drawings or the texts.
Here, each of X and Y denotes an object (e.g., a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, or a layer).
Examples of the case where X and Y are directly connected include the case where an element that enables electrical connection between X and Y (e.g., a switch, a transistor, a capacitor, an inductor, a resistor, a diode, a display element, a light-emitting element, or a load) is not connected between X and Y, and the case where X and Y are connected without the element that enables electrical connection between X and Y provided therebetween.
For example, in the case where X and Y are electrically connected, one or more elements that enable electrical connection between X and Y (e.g., a switch, a transistor, a capacitor, an inductor, a resistor, a diode, a display element, a light-emitting element, or a load) can be connected between X and Y. Note that the switch is controlled to be turned on or off. That is, the switch is conducting or not conducting (is turned on or off) to determine whether current flows therethrough or not. Alternatively, the switch has a function of selecting and changing a current path. Note that the case where X and Y are electrically connected includes the case where X and Y are directly connected.
For example, in the case where X and Y are functionally connected, one or more circuits that enable functional connection between X and Y (e.g., a logic circuit such as an inverter, a NAND circuit, or a NOR circuit; a signal converter circuit such as a D/A converter circuit, an A/D converter circuit, or a gamma correction circuit; a potential level converter circuit such as a power supply circuit (e.g., a step-up circuit or a step-down circuit) or a level shifter circuit for changing the potential level of a signal; a voltage source; a current source; a switching circuit; an amplifier circuit such as a circuit that can increase signal amplitude, the amount of current, or the like, an operational amplifier, a differential amplifier circuit, a source follower circuit, or a buffer circuit; a signal generation circuit; a storage circuit; or a control circuit) can be connected between X and Y. Note that for example, in the case where a signal output from X is transmitted to Y even when another circuit is provided between X and Y, X and Y are functionally connected. The case where X and Y are functionally connected includes the case where X and Y are directly connected and X and Y are electrically connected.
Note that in this specification and the like, an explicit description “X and Y are electrically connected” means that X and Y are electrically connected (i.e., the case where X and Y are connected with another element or another circuit provided therebetween), X and Y are functionally connected (i.e., the case where X and Y are functionally connected with another circuit provided therebetween), and X and Y are directly connected (i.e., the case where X and Y are connected without another element or another circuit provided therebetween). That is, in this specification and the like, the explicit description “X and Y are electrically connected” is the same as the explicit description “X and Y are connected.”
For example, the case where a source (or a first terminal or the like) of a transistor is electrically connected to X through (or not through) Z1 and a drain (or a second terminal or the like) of the transistor is electrically connected to Y through (or not through) Z2, or the case where a source (or a first terminal or the like) of a transistor is directly connected to part of Z1 and another part of Z1 is directly connected to X while a drain (or a second terminal or the like) of the transistor is directly connected to part of Z2 and another part of Z2 is directly connected to Y, can be expressed by using any of the following expressions.
The expressions include, for example, “X, Y, a source (or a first terminal or the like) of a transistor, and a drain (or a second terminal or the like) of the transistor are electrically connected to each other, and X, the source (or the first terminal or the like) of the transistor, the drain (or the second terminal or the like) of the transistor, and Y are electrically connected to each other in that order,” “a source (or a first terminal or the like) of a transistor is electrically connected to X, a drain (or a second terminal or the like) of the transistor is electrically connected to Y, and X, the source (or the first terminal or the like) of the transistor, the drain (or the second terminal or the like) of the transistor, and Y are electrically connected to each other in that order,” and “X is electrically connected to Y through a source (or a first terminal or the like) and a drain (or a second terminal or the like) of a transistor, and X, the source (or the first terminal or the like) of the transistor, the drain (or the second terminal or the like) of the transistor, and Y are connected in that order.” When the connection order in a circuit structure is defined by an expression similar to the above examples, a source (or a first terminal or the like) and a drain (or a second terminal or the like) of a transistor can be distinguished from each other to specify the technical scope.
Other examples of the expressions include “a source (or a first terminal or the like) of a transistor is electrically connected to X through at least a first connection path, the first connection path does not include a second connection path, the second connection path is a path between the source (or the first terminal or the like) of the transistor and a drain (or a second terminal or the like) of the transistor, Z1 is on the first connection path, the drain (or the second terminal or the like) of the transistor is electrically connected to Y through at least a third connection path, the third connection path does not include the second connection path, and Z2 is on the third connection path.” It is also possible to use the expression “a source (or a first terminal or the like) of a transistor is electrically connected to X through at least Z1 on a first connection path, the first connection path does not include a second connection path, the second connection path includes a connection path through the transistor, a drain (or a second terminal or the like) of the transistor is electrically connected to Y through at least Z2 on a third connection path, and the third connection path does not include the second connection path.” Still another example of the expressions is “a source (or a first terminal or the like) of a transistor is electrically connected to X through at least Z1 on a first electrical path, the first electrical path does not include a second electrical path, the second electrical path is an electrical path from the source (or the first terminal or the like) of the transistor to a drain (or a second terminal or the like) of the transistor, the drain (or the second terminal or the like) of the transistor is electrically connected to Y through at least Z2 on a third electrical path, the third electrical path does not include a fourth electrical path, and the fourth electrical path is an electrical path from the drain (or the second terminal or the like) of the transistor to the source (or the first terminal or the like) of the transistor.” When the connection path in a circuit structure is defined by an expression similar to the above examples, a source (or a first terminal or the like) and a drain (or a second terminal or the like) of a transistor can be distinguished from each other to specify the technical scope.
Note that these expressions are examples and there is no limitation on the expressions. Here, X, Y, Z1, and Z2 each denote an object (e.g., a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, or a layer).
Even when independent components are electrically connected to each other in a circuit diagram, one component has functions of a plurality of components in some cases. For example, when part of a wiring also functions as an electrode, one conductive film functions as the wiring and the electrode. Thus, the term “electrical connection” in this specification also means such a case where one conductive film has functions of a plurality of components.
Embodiments will be described in detail with reference to drawings. Note that the present invention is not limited to the description below, and it is easily understood by those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the present invention should not be interpreted as being limited to the content of the embodiments below. Note that in the structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description of such portions is not repeated.
<Notes on the Description for Drawings>
In this specification, terms for describing arrangement, such as “over” and “under”, are used for convenience to describe a positional relation between components with reference to drawings. Furthermore, the positional relation between components is changed as appropriate in accordance with a direction in which each component is described. Thus, there is no limitation on terms used in this specification, and description can be made appropriately depending on the situation.
The term “over” or “below” does not necessarily mean that a component is placed directly on or directly below and directly in contact with another component. For example, the expression “electrode B over insulating layer A” does not necessarily mean that the electrode B is on and in direct contact with the insulating layer A and can mean the case where another component is provided between the insulating layer A and the electrode B.
In this specification, the term “parallel” indicates that the angle formed between two straight lines is greater than or equal to −10° and less than or equal to 10°, and accordingly also includes the case where the angle is greater than or equal to −5° and less than or equal to 5°. The term “substantially parallel” indicates that the angle formed between two straight lines is greater than or equal to −30° and less than or equal to 30°. The term “perpendicular” indicates that the angle formed between two straight lines is greater than or equal to 80° and less than or equal to 100°, and accordingly includes the case where the angle is greater than or equal to 85° and less than or equal to 95°. The term “substantially perpendicular” indicates that the angle formed between two straight lines is greater than or equal to 60° and less than or equal to 120°.
In this specification, trigonal and rhombohedral crystal systems are included in a hexagonal crystal system.
In drawings, the size, the layer thickness, or the region is determined arbitrarily for description convenience. Therefore, the size, the layer thickness, or the region is not limited to the illustrated scale. Note that the drawings are schematically shown for clarity, and embodiments of the present invention are not limited to shapes or values shown in the drawings.
In drawings such as plan views (also referred to as layout views) and perspective views, some of components might not be illustrated for clarity of the drawings.
The expression “being the same” may refer to having the same area or having the same shape. In addition, the expression “being the same” include a case of “being substantially the same” because a manufacturing process might cause some differences.
<Notes on Expressions that can be Rephrased>
In this specification and the like, in describing connections of a transistor, expressions “one of a source and a drain” (or a first electrode or a first terminal) and “the other of the source and the drain” (or a second electrode or a second terminal) are used. This is because a source and a drain of a transistor are interchangeable depending on the structure, operation conditions, or the like of the transistor. Note that the source or the drain of the transistor can also be referred to as a source (or drain) terminal, a source (or drain) electrode, or the like as appropriate depending on the situation.
In addition, in this specification and the like, the term such as an “electrode” or a “wiring” does not limit a function of the component. For example, an “electrode” is used as part of a “wiring” in some cases, and vice versa. Further, the term “electrode” or “wiring” can also mean a combination of a plurality of “electrodes” and “wirings” formed in an integrated manner.
In this specification and the like, a transistor is an element having at least three terminals: a gate, a drain, and a source. The transistor has a channel region between the drain (a drain terminal, a drain region, or a drain electrode) and the source (a source terminal, a source region, or a source electrode), and current can flow through the drain, the channel region, and the source.
Since the source and the drain of the transistor change depending on the structure, operating conditions, and the like of the transistor, it is difficult to define which is a source or a drain. Thus, a portion that functions as a source or a portion is not referred to as a source or a drain in some cases. In that case, one of the source and the drain might be referred to as a first electrode, and the other of the source and the drain might be referred to as a second electrode.
In this specification, ordinal numbers such as first, second, and third are used to avoid confusion among components, and thus do not limit the number of the components.
In this specification and the like, a structure in which a flexible printed circuit (FPC), a tape carrier package (TCP), or the like is attached to a substrate of a display panel, or a structure in which an integrated circuit (IC) is directly mounted on a substrate by a chip on glass (COG) method is referred to as a display device in some cases.
Note that the terms “film” and “layer” can be interchanged with each other depending on the case or circumstances. For example, the term “conductive layer” can be changed into the term “conductive film” in some cases. In addition, the term “insulating film” can be changed into the term “insulating layer” in some cases.
<<Connection>>
In this specification, when it is described that “A and B are connected to each other”, the case where A and B are electrically connected to each other is included in addition to the case where A and B are directly connected to each other. Here, the expression “A and B are electrically connected” means the case where electric signals can be transmitted and received between A and B when an object having any electric action exists between A and B.
Note that a content (or may be part of the content) described in one embodiment may be applied to, combined with, or replaced by a different content (or may be part of the different content) described in the embodiment and/or a content (or may be part of the content) described in one or a plurality of different embodiments.
Note that in each embodiment, a content described in the embodiment is a content described with reference to a variety of diagrams or a content described with a text described in this specification.
Note that by combining a diagram (or may be part of the diagram) illustrated in one embodiment with another part of the diagram, a different diagram (or may be part of the different diagram) illustrated in the embodiment, and/or a diagram (or may be part of the diagram) illustrated in one or a plurality of different embodiments, much more diagrams can be formed.
Embodiment 1
In this embodiment, a semiconductor device which is one embodiment of the present invention and its manufacturing method is described with reference to drawings.
FIGS. 1A to 1C are a top view and cross-sectional views of a transistor 10 of one embodiment of the present invention: FIG. 1A is a top view, FIG. 1B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 1A, and FIG. 1C is a cross-sectional view taken along dashed-dotted line B1-B2 in FIG. 1A. Note that in FIG. 1A, some components are scaled up or down in size or omitted for easy understanding. The directions of dashed-dotted lines A1-A2 and B1-B2 can be referred to as a channel length direction and a channel width direction, respectively.
The transistor 10 includes an insulating layer 110 over a substrate 100; an oxide semiconductor layer 121, an oxide semiconductor layer 122, and an oxide semiconductor layer 123 over the insulating layer 110; a source electrode layer 130 and a drain electrode layer 140 over the oxide semiconductor layer 123; an oxide semiconductor layer 124 over the insulating layer 110, the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123, the source electrode layer 130, and the drain electrode layer 140; a gate insulating layer 150 over the oxide semiconductor layer 124; and a gate electrode layer 160 over the gate insulating layer 150. Although the gate electrode layer 160 in this example is a stacked layer of a gate electrode layer 161 and a gate electrode layer 162, it may be a single layer. In the transistor 10, end portions of the oxide semiconductor layer 124 and the gate insulating layer 150 are located on the outer side of the gate electrode layer 160. An insulating layer 170 may be provided over the gate insulating layer 150 and the gate electrode layer 160. An insulating layer 180 formed of oxide may be provided over the insulating layer 170. The insulating layer 170 and the insulating layer 180 may be provided as needed and another insulating layer may be provided thereover. A conductive layer 190 can be provided over the insulating layer 180. The structure described here is characterized by its high heat dissipation effect: heat generated by the operation of the transistor 10 in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 can be sufficiently released because the oxide semiconductor layer 123 and the oxide semiconductor layer 124 are in contact with the source electrode layer 130 and the drain electrode layer 140.
In the transistor 10, in the channel width direction, the gate electrode layer 160 faces the side surfaces of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 with the gate insulating layer 150 therebetween as shown in FIG. 1C. In other words, the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 are surrounded by electric field of the gate electrode layer 160 in the channel width direction when voltage is applied to the gate electrode layer 160. The transistor structure in which an oxide semiconductor layer is surrounded by electric field of the gate electrode layer 160 is referred to as a surrounded channel (s-channel) structure. The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 are collectively referred to as an oxide semiconductor layer 120. When a transistor having the s-channel structure (s-channel transistor) is in the on state, a channel is formed in the entire oxide semiconductor layer 120 (bulk), so that the on-state current is increased. When the s-channel transistor) is in the off state, the entire channel region formed in the oxide semiconductor layer 120 is depleted; as a result, the off-state current can be further reduced.
<Channel Length>
Note that the channel length refers to, for example, a distance between a source (a source region or a source electrode) and a drain (a drain region or a drain electrode) in a region where a semiconductor (or a portion where a current flows in a semiconductor when a transistor is on) and a gate electrode overlap with each other or a region where a channel is formed in a top view of the transistor. In one transistor, channel lengths in all regions are not necessarily the same. In other words, the channel length of one transistor is not fixed to one value in some cases. Therefore, in this specification, the channel length is any one of values, the maximum value, the minimum value, or the average value in a region where a channel is formed.
<Channel Width>
Note that the channel width refers to, for example, the length of a portion where a source and a drain face each other in a region where a semiconductor (or a portion where a current flows in a semiconductor when a transistor is on) and a gate electrode overlap with each other, or a region where a channel is formed, in the plan view. In one transistor, channel widths in all regions are not necessarily the same value. In other words, the channel width of one transistor is not fixed to one value in some cases. Therefore, in this specification, the channel width is any one of values, the maximum value, the minimum value, or the average value in a region where a channel is formed.
Note that depending on transistor structures, a channel width in a region where a channel is actually formed (hereinafter referred to as an effective channel width) is different from a channel width shown in a top view of a transistor (hereinafter referred to as an apparent channel width) in some cases. For example, in a transistor having a three-dimensional structure, an effective channel width is greater than an apparent channel width shown in a top view of the transistor, and its influence cannot be ignored in some cases. For example, in a miniaturized transistor having a three-dimensional structure, the proportion of a channel region formed in a side surface of a semiconductor is high in some cases. In that case, an effective channel width obtained when a channel is actually formed is greater than an apparent channel width shown in the top view.
In a transistor having a three-dimensional structure, an effective channel width is difficult to measure in some cases. For example, estimation of an effective channel width from a design value requires an assumption that the shape of a semiconductor is known. Therefore, without accurate information on the shape of a semiconductor, it is difficult to measure an effective channel width accurately.
<SCW>
Therefore, in this specification, in a top view of a transistor, an apparent channel width that is a length of a portion where a source and a drain face each other in a region where a semiconductor and a gate electrode overlap with each other is referred to as a surrounded channel width (SCW) in some cases. Further, in this specification, in the case where the term “channel width” is simply used, it may denote a surrounded channel width and an apparent channel width. Alternatively, in this specification, in the case where the term “channel width” is simply used, it may denote an effective channel width in some cases. Note that the values of a channel length, a channel width, an effective channel width, an apparent channel width, a surrounded channel width, and the like can be determined by obtaining and analyzing a cross-sectional TEM image and the like.
Note that in the case where field-effect mobility, a current value per channel width, and the like of a transistor are obtained by calculation, a surrounded channel width may be used for the calculation. In that case, a value different from the value obtained by calculation using an effective channel width is obtained in some cases.
<Structure of Transistor>
A structure of a transistor of one embodiment of the present invention will be described.
<<Substrate 100>>
A glass substrate, a ceramic substrate, a quartz substrate, a sapphire substrate, or the like can be used as the substrate 100. Alternatively, a single crystal semiconductor substrate or a polycrystalline semiconductor substrate of silicon, silicon carbide, or the like, a compound semiconductor substrate of silicon germanium or the like, a semiconductor-on-insulator (SOI) substrate, or the like may be used. Still alternatively, any of these substrates provided with a semiconductor element may be used. The substrate 100 is not limited to a simple supporting substrate, and may be a substrate where a device such as a transistor is formed. In that case, one of the gate electrode layer 160, the source electrode layer 130, and the drain electrode layer 140 of the transistor may be electrically connected to another device.
Alternatively, a flexible substrate may be used as the substrate 100. As a method for providing the transistor over a flexible substrate, there is a method in which the transistor is formed over a non-flexible substrate and then the transistor is separated and transferred to the substrate 100 which is a flexible substrate. In that case, a separation layer is preferably provided between the non-flexible substrate and the transistor. As the substrate 100, a sheet, a film, or a foil containing a fiber may be used. The substrate 100 may have elasticity. The substrate 100 may have a property of returning to its original shape when bending or pulling is stopped. Alternatively, the substrate 100 may have a property of not returning to its original shape. The substrate 100 has a thickness of, for example, greater than or equal to 5 μm and less than or equal to 700 μm, preferably greater than or equal to 10 μm and less than or equal to 500 μm, more preferably greater than or equal to 15 μm and less than or equal to 300 μm. When the substrate 100 has a small thickness, the weight of the semiconductor device can be reduced. When the substrate 100 has a small thickness, even in the case of using glass or the like, the substrate 100 may have elasticity or a property of returning to its original shape when bending or pulling is stopped. Therefore, an impact applied to the semiconductor device over the substrate 100, which is caused by dropping or the like, can be reduced. That is, a durable semiconductor device can be provided.
For the substrate 100 which is a flexible substrate, metal, an alloy, resin, glass, or fiber thereof can be used, for example. The flexible substrate 100 preferably has a lower coefficient of linear expansion because deformation due to an environment is suppressed. The flexible substrate 100 is formed using, for example, a material whose coefficient of linear expansion is lower than or equal to 1×10−3/K, lower than or equal to 5×10−5/K, or lower than or equal to 1×10−5/K. Examples of the resin include polyester, polyolefin, polyamide (e.g., nylon or aramid), polyimide, polycarbonate, acrylic, and polytetrafluoroethylene (PTFE). In particular, aramid is preferably used for the flexible substrate 100 because of its low coefficient of linear expansion.
<<Insulating Layer 110>>
The insulating layer 110 can have a function of supplying oxygen to the oxide semiconductor layer 120 as well as a function of preventing diffusion of impurities from the substrate 100. For this reason, the insulating layer 110 is preferably an insulating film containing oxygen and further preferably, the insulating layer 110 is an insulating film containing oxygen in which the oxygen content is higher than that in the stoichiometric composition. The insulating layer 110 is a film of which the amount of released oxygen when converted into oxygen atoms is 1.0×1019 atoms/cm3 or more in TDS analysis. Note that the temperature of the film surface in the TDS analysis is preferably higher than or equal to 100° C. and lower than or equal to 700° C., or higher than or equal to 100° C. and lower than or equal to 500° C. In the case where the substrate 100 is provided with another device as described above, the insulating layer 110 also has a function as an interlayer insulating film. In that case, the insulating layer 110 is preferably subjected to planarization treatment such as chemical mechanical polishing (CMP) treatment so as to have a flat surface.
<<Oxide Semiconductor Layers 121, 122, 123, and 124>>
The oxide semiconductor layer 123 is an oxide semiconductor film containing In or Zn and typically contains In—Ga oxide, In—Zn oxide, In—Mg oxide, Zn—Mg oxide, or In-M-Zn oxide (M is Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd).
An oxide semiconductor that can be used for each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 preferably contains at least indium (In) or zinc (Zn). Alternatively, both In and Zn are preferably contained. In order to reduce fluctuations in electrical characteristics of the transistors including the oxide semiconductor, the oxide semiconductor preferably contains a stabilizer in addition to In and Zn.
As a stabilizer, gallium (Ga), tin (Sn), hafnium (Hf), aluminum (Al), zirconium (Zr), and the like can be given. As another stabilizer, lanthanoid such as lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), or lutetium (Lu) can be given.
Note that in the case where the oxide semiconductor layer 123 is In-M-Zn oxide, the proportion of In and the proportion of M, not taking Zn and O into consideration, are preferably greater than or equal to 25 atomic % and less than 75 atomic %, respectively, further preferably greater than or equal to 34 atomic % and less than 66 atomic %, respectively.
The indium and gallium contents in the oxide semiconductor layer 123 can be compared with each other by time-of-flight secondary ion mass spectrometry (TOF-SIMS), X-ray photoelectron spectrometry (XPS), or inductively coupled plasma mass spectrometry (ICP-MS).
Since the oxide semiconductor layer 123 has an energy gap of 2 eV or more, preferably 2.5 eV or more, further preferably 3 eV or more, the off-state current of the transistor 10 can be low.
The thickness of the oxide semiconductor layer 123 is larger than or equal to 3 nm and smaller than or equal to 200 nm, preferably larger than or equal to 3 nm and smaller than or equal to 100 nm, further preferably larger than or equal to 3 nm and smaller than or equal to 50 nm.
Each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is an oxide semiconductor layer including one or more elements contained in the oxide semiconductor layer 123. Thus, interface scattering is unlikely to occur at the interfaces between the oxide semiconductor layer 123 and the oxide semiconductor layer 122 and between the oxide semiconductor layer 123 and the oxide semiconductor layer 124. The movement of carriers is not hindered at the interfaces accordingly, and the transistor 10 can have high field-effect mobility.
Each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is typically In—Ga oxide, In—Zn oxide, In—Mg oxide, Ga—Zn oxide, Zn—Mg oxide, or In-M-Zn oxide (M is Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd), and has the energy level at the conduction band minimum that is closer to a vacuum level than that of the oxide semiconductor layer 123 is. Typically, a difference between the energy level at the conduction band minimum of the oxide semiconductor layer 123 and the energy level at the conduction band minimum of each of the oxide semiconductor layers 121, 122, and 124 is greater than or equal to 0.05 eV, greater than or equal to 0.07 eV, greater than or equal to 0.1 eV, or greater than or equal to 0.2 eV and also less than or equal to 2 eV, less than or equal to 1 eV, less than or equal to 0.5 eV, or less than or equal to 0.4 eV. That is, the difference between the electron affinity of the oxide semiconductor layer 123 and the electron affinity of each of the oxide semiconductor layers 121, 122, and 124 is greater than or equal to 0.05 eV, greater than or equal to 0.07 eV, greater than or equal to 0.1 eV, or greater than or equal to 0.2 eV and also less than or equal to 2 eV, less than or equal to 1 eV, less than or equal to 0.5 eV, or less than or equal to 0.4 eV. Note that the electron affinity refers to a difference between the vacuum level and the energy level at the conduction band minimum.
When each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 contain a larger amount of Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd in an atomic ratio than the amount of In in an atomic ratio, any of the following effects may be obtained.
(1) The energy gap of each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is widened.
(2) The electron affinity of each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is reduced.
(3) Impurities from the outside are blocked.
(4) An insulating property of each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is higher than that of the oxide semiconductor layer 123.
(5) Oxygen vacancies are less likely to be generated in the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 because Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, and Nd are metal elements that can be strongly bonded to oxygen.
Since the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 have higher insulating properties than the oxide semiconductor layer 123, they each have a function of a gate insulating film.
In the case where the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 are each In-M-Zn oxide, the proportion of In and the proportion of M, not taking Zn and O into consideration, are less than 50 atomic % and greater than or equal to 50 atomic %, respectively, and preferably less than 25 atomic % and greater than or equal to 75 atomic %, respectively.
Further, in the case where the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 are each In-M-Zn oxide (M is Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd), the proportion of M atoms (M is Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd) in each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is higher than that in the oxide semiconductor layer 123. Typically, the proportion of M in each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is higher than or equal to 1.5 times, preferably higher than or equal to twice, further preferably higher than or equal to three times as high as that in the oxide semiconductor layer 123. Any of the above-described elements represented by M is more strongly bonded to oxygen than indium is, and thus has a function of suppressing generation of oxygen vacancies in the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124. That is, oxygen vacancies are less likely to be generated in the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 than in the oxide semiconductor layer 123.
The indium content in the oxide semiconductor layer 123 is preferably higher than those in the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124. In an oxide semiconductor, an s orbital of heavy metal mainly contributes to carrier transfer. When the proportion of In in the oxide semiconductor is increased, overlap of s orbitals is likely to be increased. Therefore, oxide having a composition in which the proportion of In is higher than that of M has higher mobility than oxide having a composition in which the proportion of In is equal to or lower than that of M. Thus, with the use of oxide having a high content of indium for the oxide semiconductor layer 123, a transistor having high field-effect mobility can be obtained.
In the case where the oxide semiconductor layer 123 includes In-M-Zn oxide (M is Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd) and a target having the atomic ratio of metal elements of In:M:Zn=x1:y1:z1 is used for forming the oxide semiconductor layer 123, x1/y1 is preferably greater than or equal to 1⁄3 and less than or equal to 6, further preferably greater than or equal to 1 and less than or equal to 6, and z1/y1 is preferably greater than or equal to 1⁄3 and less than or equal to 6, further preferably greater than or equal to 1 and less than or equal to 6. Note that when z1/y1 is greater than or equal to 1 and less than or equal to 6, a c-axis aligned crystalline oxide semiconductor (CAAC-OS) film is easily formed as the oxide semiconductor layer 123. Typical examples of the atomic ratio of metal elements of the target include In:M:Zn=1:1:1, 1:1:1.2, 2:1:1.5, 2:1:2.3, 2:1:3, 3:1:2, 4:2:3, and 4:2:4.1.
In the case where the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 include In-M-Zn oxide (M is Al, Ti, Ga, Y, Zr, Sn, La, Ce, Mg, or Nd) and a target having the atomic ratio of metal elements of In:M:Zn=x2:y2:z2 is used for forming the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124, x2/y2 is preferably less than x1/y1, and z2/y2 is preferably greater than or equal to 1⁄3 and less than or equal to 6, further preferably greater than or equal to 1 and less than or equal to 6. Note that when z2/y2 is greater than or equal to 1 and less than or equal to 6, a CAAC-OS film is easily formed as the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124. Typical examples of the atomic ratio of the metal elements of the target are In:M:Zn=1:3:2, 1:3:4, 1:3:6, 1:3:8, 1:4:4, 1:4:5, 1:4:6, 1:4:7, 1:4:8, 1:5:5, 1:5:6, 1:5:7, 1:5:8, 1:6:8, 1:6:4, 1:9:6, and the like.
In each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124, the proportion of each atom in the above-described atomic ratio varies within a range of ±40% as an error.
Alternatively, the oxide semiconductor layer 124 can be metal oxide, such as aluminum oxide, gallium oxide, hafnium oxide, silicon oxide, germanium oxide, or zirconia oxide; or the metal oxide may be provided over the oxide semiconductor layer 124.
The atomic ratio is not limited to those described above, and may be appropriately set in accordance with needed semiconductor characteristics.
The oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 may have the same composition. For example, the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 may be an In—Ga—Zn oxide with an atomic ratio of In:Ga:Zn=1:3:2, 1:3:4, or 1:4:5.
Alternatively, the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 may have different compositions. For example, the oxide semiconductor layer 121 and the oxide semiconductor layer 124 may be In—Ga—Zn oxide with an atomic ratio of In:Ga:Zn=1:3:2 and In—Ga—Zn oxide film with an atomic ratio of In:Ga:Zn=1:3:4 or 1:4:5, respectively.
The thickness of each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 is preferably larger than or equal to 3 nm and smaller than or equal to 100 nm or larger than or equal to 3 nm and smaller than or equal to 50 nm.
The thickness of the oxide semiconductor layer 123 may be larger than, equal to, or less than that of at least the oxide semiconductor layer 121. If the thickness of the oxide semiconductor layer 123 is larger than that of the oxide semiconductor layer 121, the on-state current of the transistor can be increased. The thickness of the oxide semiconductor layer 121 may be determined as appropriate as long as formation of an interface state at the interface with the oxide semiconductor layer 123 can be inhibited. For example, the thickness of the oxide semiconductor layer 123 is larger than that of the oxide semiconductor layer 121, preferably 2 or more times, more preferably 4 or more times, still more preferably 6 or more times as large as that of the oxide semiconductor layer 121. In the case where there is no need to increase the on-state current of the transistor, the thickness of the oxide semiconductor layer 121 may be larger than or equal to that of the oxide semiconductor layer 123. In this case, more oxygen can be added to the oxide semiconductor layer 121, and oxygen vacancies in the oxide semiconductor layer 123 can be reduced by heat treatment, which leads to stabilization of electrical characteristics of the semiconductor device.
The thickness of the oxide semiconductor layer 124 may be determined as appropriate, in a manner similar to that of the oxide semiconductor layer 121, as long as formation of an interface state at the interface with the oxide semiconductor layer 123 is inhibited. For example, the thickness of the oxide semiconductor layer 124 may be set smaller than or equal to that of the oxide semiconductor layer 121. The thickness of the oxide semiconductor layer 124 is preferably small, thereby preventing the electric field due to the gate electrode layer 161 and the gate electrode layer 162 from being difficult to reach the oxide semiconductor layer 123. To prevent oxygen contained in the oxide semiconductor layer 124 from diffusing to the source and drain electrode layers 130 and 140 and oxidizing the source and drain electrode layers 130 and 140, it is preferable that the thickness of the oxide semiconductor layer 124 be small. For example, the thickness of the oxide semiconductor layer 124 is smaller than that of the oxide semiconductor layer 123. Note that the thickness of the oxide semiconductor layer 124 is not limited to the above, and may be determined as appropriate in accordance with the driving voltage of the transistor in consideration of the withstand voltage of the gate insulating layer 117.
In the case where the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 have different compositions from one another, the interfaces thereof can be observed by scanning transmission electron microscopy (STEM).
<Hydrogen Concentration>
Hydrogen contained in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 reacts with oxygen bonded to a metal atom to be water, and in addition, an oxygen vacancy is formed in a lattice from which oxygen is released (or a portion from which oxygen is released). An electron serving as a carrier can be generated due to entry of hydrogen into the oxygen vacancy or due to bonding of part of hydrogen to oxygen bonded to a metal element. Thus, a transistor including an oxide semiconductor which contains hydrogen is likely to be normally on.
Accordingly, it is preferable that hydrogen be reduced as much as possible as well as the oxygen vacancies in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. The concentrations of hydrogen in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, which are obtained by secondary ion mass spectrometry (SIMS), are higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 2×1020 atoms/cm3, preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1019 atoms/cm3, further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 1×1019 atoms/cm3, still further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3. As a result, the transistor 10 can have positive threshold voltage (normally-off characteristics).
<Concentrations of Carbon and Silicon>
When silicon and carbon, which are elements belonging to Group 14, are contained in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, oxygen vacancies are increased and an n-type region is formed in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. It is therefore preferable to reduce the concentrations of silicon and carbon in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. The concentrations of silicon and carbon in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, which are obtained by SIMS, are desirably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 1×1019 atoms/cm3, further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3, still further preferably higher than or equal to 1×1016 atoms/cm3 and lower than or equal to 2×1018 atoms/cm3. As a result, the transistor 10 has positive threshold voltage (normally-off characteristics).
<Concentration of Alkali Metal>
Alkali metal and alkaline earth metal can generate carriers when bonded to an oxide semiconductor, which can increase the off-state current of the transistor. It is thus preferable to reduce the concentrations of alkali metal and alkaline earth metal in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. For example, the concentrations of alkali metal and alkaline earth metal in the oxide semiconductor layers 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, which are obtained by SIMS, are lower than or equal to 1×1018 atoms/cm3, preferably lower than or equal to 2×1016 atoms/cm3. As a result, the transistor 10 has positive threshold voltage (normally-off characteristics).
<Concentration of Nitrogen>
When nitrogen is contained in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, an electron serving as a carrier is generated and accordingly carrier density is increased, so that n-type regions are formed. Thus, when an oxide semiconductor contains nitrogen, a transistor including the oxide semiconductor is likely to be normally on. Thus, it is preferable that nitrogen be reduced as much as possible in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. For example, the concentrations of nitrogen in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and at the interfaces between the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, which are obtained by SIMS, are preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 5×1019 atoms/cm3, further preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 5×1018 atoms/cm3, still further preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 1×1018 atoms/cm3, still further preferably higher than or equal to 1×1015 atoms/cm3 and lower than or equal to 5×1017 atoms/cm3. As a result, the transistor 10 has positive threshold voltage (normally-off characteristics).
<Carrier Density>
The carrier densities of the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 can be lowered by reduction in impurities in the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. The carrier densities the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 is 1×1015/cm3 or less, preferably 1×1013/cm3 or less, further preferably less than 8×1011/cm3, still further preferably less than 1×1011/cm3, and yet still further preferably less than 1×1010/cm3 and 1×10−9/cm3 or more.
When an oxide semiconductor film having a low impurity concentration and a low density of defect states is used as each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, a transistor including the oxide semiconductor layers can have more excellent electrical characteristics. Here, the state in which the impurity concentration is low and the density of defect states is low (the amount of oxygen vacancies is small) is described as “highly purified intrinsic” or “substantially highly purified intrinsic.” A highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor has few carrier generation sources, and thus has a low carrier density in some cases. Thus, a transistor including the oxide semiconductor film in which a channel region is formed is likely to have positive threshold voltage (normally-off characteristics). A highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states and accordingly has few carrier traps in some cases. Further, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has an extremely low off-state current; the off-state current can be less than or equal to the measurement limit of a semiconductor parameter analyzer, i.e., less than or equal to 1×10−13 A, at a voltage between a source electrode and a drain electrode (drain voltage) of from 1 V to 10 V. Thus, the transistor whose channel region is formed in the oxide semiconductor film has a small variation in electrical characteristics and high reliability in some cases.
A transistor in which a highly purified oxide semiconductor film is used for a channel formation region exhibits extremely low off-state current. For example, in the case where the voltage between the source and the drain is set to approximately 0.1 V 5 V, or 10 V, the off-state current standardized on the channel width of the transistor can be as low as several yoctoamperes per micrometer to several zeptoamperes per micrometer.
The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 may have a non-single crystal structure, for example. The non-single crystal structure includes a CAAC-OS which is described later, a polycrystalline structure, a microcrystalline structure, or an amorphous structure, for example. Among the non-single crystal structure, the amorphous structure has the highest density of defect states, whereas the CAAC-OS has the lowest density of defect states.
The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 may have a microcrystalline structure, for example. The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 which have the microcrystalline structure each include a microcrystal with a size greater than or equal to 1 nm and less than 10 nm, for example. Alternatively, the oxide semiconductor films which have the microcrystalline structure have a mixed phase structure where crystal parts (each of which is greater than or equal to 1 nm and less than 10 nm) are distributed in an amorphous phase.
The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 may have an amorphous structure, for example. The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 which have the amorphous structure each have disordered atomic arrangement and no crystalline component, for example. Alternatively, the oxide semiconductor films which have an amorphous structure have, for example, an absolutely amorphous structure and no crystal part.
Note that the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 may each be a mixed film including regions having two or more of the following structures: a CAAC-OS, a microcrystalline structure, and an amorphous structure. The mixed film, for example, has a single-layer structure including a region having an amorphous structure, a region having a microcrystalline structure, and a region of a CAAC-OS. Alternatively, the mixed film may have a stacked-layer structure including a region having an amorphous structure, a region having a microcrystalline structure, and a region of a CAAC-OS, for example.
Note that the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 may have a single-crystal structure, for example.
By providing an oxide semiconductor film in which oxygen vacancies are less likely to be generated than in the oxide semiconductor layer 123, over and under and in contact with the oxide semiconductor layer 123, oxygen vacancies in the oxide semiconductor layer 123 can be reduced. Further, since the oxide semiconductor layer 123 is in contact with the oxide semiconductor layer 122 and the oxide semiconductor layer 124 containing one or more metal elements forming the oxide semiconductor layer 123, the density of interface states at the interface between the oxide semiconductor layer 121 and the oxide semiconductor layer 123 and at the interface between the oxide semiconductor layer 123 and the oxide semiconductor film 124 is extremely low. Thus, after oxygen is added to the oxide semiconductor layer 122 and the oxide semiconductor layer 124, the oxygen is transferred from the oxide semiconductor layer 122 and the oxide semiconductor layer 124 to the oxide semiconductor layer 123 by heat treatment; however, the oxygen is hardly trapped by the interface states at this time, and the oxygen in the oxide semiconductor layer 122 and the oxide semiconductor layer 124 can be efficiently transferred to the oxide semiconductor layer 123. Accordingly, oxygen vacancies in the oxide semiconductor layer 123 can be reduced. Since oxygen is added to the oxide semiconductor layer 122 and the oxide semiconductor layer 124, oxygen vacancies in the oxide semiconductor layer 122 and the oxide semiconductor layer 124 can be reduced. In other words, the density of localized states of at least the oxide semiconductor layer 123 can be reduced.
In addition, when the oxide semiconductor layer 123 is in contact with an insulating film including a different constituent element (e.g., a gate insulating film including a silicon oxide film), an interface state is sometimes formed and the interface state forms a channel. At this time, a second transistor having a different threshold voltage appears, so that an apparent threshold voltage of the transistor is varied. However, since the oxide semiconductor layer 122 and the oxide semiconductor layer 124 containing one or more kinds of metal elements forming the oxide semiconductor layer 123 are in contact with the oxide semiconductor layer 123, an interface state is not easily formed at the interfaces between the oxide semiconductor layer 122 and the oxide semiconductor layer 123 and between the oxide semiconductor layer 124 and the oxide semiconductor layer 123.
The oxide semiconductor layer 121 and the oxide semiconductor layer 124 function as barrier films that prevent constituent elements of the insulating layer 110 and the gate insulating layer 150 from entering the oxide semiconductor layer 123 and forming an impurity state.
For example, in the case of using a silicon-containing insulating film as the insulating layer 110 or the gate insulating layer 150, silicon in the gate insulating layer 150 or carbon which might be contained in the insulating layer 110 or the gate insulating layer 150 enters the oxide semiconductor layer 121 or the oxide semiconductor layer 124 to a depth of several nanometers from the interface in some cases. An impurity, such as silicon or carbon, entering the oxide semiconductor layer 123 forms an impurity state. The impurity state serves as a donor to generate an electron; thus, an n-type semiconductor might be formed.
However, when each thickness of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is larger than several nanometers, the impurity such as silicon or carbon does not reach the oxide semiconductor layer 123, so that the influence of impurity states is reduced.
Thus, providing the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 makes it possible to reduce variations in electrical characteristics of the transistor, such as threshold voltage.
In the case where a channel is formed at interfaces between the gate insulating layer 150 and the oxide semiconductor layer 123, interface scattering occurs at the interfaces and the field-effect mobility of the transistor is decreased. However, since the oxide semiconductor layer 122 and the oxide semiconductor layer 124 containing one or more kinds of metal elements forming the oxide semiconductor layer 123 are provided in contact with the oxide semiconductor layer 123, scattering of carriers does not easily occur at the interfaces between the oxide semiconductor layer 123 and each of the oxide semiconductor layer 122 and the oxide semiconductor layer 124, and thus the field-effect mobility of the transistor can be increased.
In this embodiment, the amount of oxygen vacancies in the oxide semiconductor layer 123, and further the amount of oxygen vacancies in the oxide semiconductor layer 122 and the oxide semiconductor layer 124 in contact with the oxide semiconductor layer 123 can be reduced; thus, the density of localized states of the oxide semiconductor layer 123 can be reduced. As a result, the transistor 10 in this embodiment has small variations in threshold voltage and high reliability. Further, the transistor 10 of this embodiment has excellent electric characteristics.
An insulating film containing silicon is often used as a gate insulating layer of a transistor. For the above-described reason, it is preferable that a region of the oxide semiconductor layer, which serves as a channel, be not in contact with the gate insulating layer as in the transistor of one embodiment of the present invention. In the case where a channel is formed at the interface between the gate insulating layer and the oxide semiconductor layer, scattering of carriers occurs at the interface, whereby the field-effect mobility of the transistor is reduced in some cases. Also from the view of the above, it is preferable that the region of the oxide semiconductor layer, which serves as a channel, be separated from the gate insulating layer.
Accordingly, with the oxide semiconductor layer 120 having a stacked-layer structure including the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124, a channel can be formed in the oxide semiconductor layer 123; thus, the transistor can have a high field-effect mobility and stable electrical characteristics.
Note that the four oxide semiconductor layers are not necessarily provided and can be a single layer, two layers, three layers, or five or more layers. In the case of a single layer, a layer corresponding to the oxide semiconductor layer 123, which is described in this embodiment, can be used.
<Band Structure>
Here, a band structure is described. For easy understanding, the band structure is illustrated with the energy levels (Ec) between C1-C2, that is, at the conduction band minimum of the gate insulating layer 110, the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, the oxide semiconductor layer 124, and the gate insulating layer 150.
As illustrated in FIGS. 4A and 4B, the energy at the conduction band minimum changes continuously within the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. This can be understood also from the fact that the constituent elements are common among the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 and oxygen is easily diffused among them. Thus, the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 have a continuous physical property although they are a stack of films having different compositions.
The oxide semiconductor films, which contain the same main components and are stacked, are not simply stacked but formed to have continuous junction (here, particularly a U-shaped (U shape) well structure where the energy at the conduction band minimum is continuously changed between the films). In other words, a stacked-layer structure is formed such that there exists no impurities which form a defect level such as a trap center or a recombination center at each interface. If impurities are mixed between the films in the stacked multilayer film, the continuity of the energy band is lost and carriers disappear by a trap or recombination at the interface.
Although Ec of the oxide semiconductor layer 121, Ec of the oxide semiconductor layer 122, and Ec of the oxide semiconductor layer 124 are equal to each other in FIG. 4B, they may be different as shown in FIGS. 4C and 4D.
As illustrated in FIGS. 4B and 4C, the oxide semiconductor layer 123 serves as a well and a channel of the transistor 10 is formed in the oxide semiconductor layer 123. Note that a channel having a U-shaped well structure in which the energy at the conduction band minimum continuously changes like the one formed in the oxide semiconductor layer 123, can also be referred to as a buried channel.
Note that trap levels due to impurities or defects can be formed in the vicinity of the interface between an insulating film such as a silicon oxide film and the oxide semiconductor layer 121 and the oxide semiconductor layer 124. The oxide semiconductor layer 123 can be distanced away from the trap levels owing to existence of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124. However, when the energy difference between Ec of the oxide semiconductor layer 121, the oxide semiconductor layer 122, or the oxide semiconductor layer 124 and Ec of the oxide semiconductor layer 123 is small, an electron in the oxide semiconductor layer 123 can go over the energy difference and reach the trap level. When electrons to be negative charge are captured by the trap levels, a negative fixed charge is generated at the interface with the insulating film, whereby the threshold voltage of the transistor is shifted in the positive direction. In addition, a trap is not fixed and characteristics can be changed in a long-time preservation test of a transistor.
Thus, to reduce a change in the threshold voltage of the transistor, an energy difference between the Ec of the oxide semiconductor layer 123 and the Ec of each of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 is necessary. The energy difference is preferably greater than or equal to 0.1 eV, further preferably greater than or equal to 0.2 eV.
The oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124 preferably include a crystal. In particular, when a crystal in which c-axes are aligned is used, the transistor can have stable electrical characteristics.
In the band structure illustrated in FIG. 4B, In—Ga oxide (e.g., with an atomic ratio of In:Ga=7:93) or gallium oxide may be provided between the oxide semiconductor layer 123 and the gate insulating layer 150 without providing the oxide semiconductor layer 124. Alternatively, In—Ga oxide or gallium oxide may be provided between the oxide semiconductor layer 124 and the gate insulating layer 150.
As the oxide semiconductor layer 123, an oxide having an electron affinity higher than those of the oxide semiconductor layers 121, 122, and 124 is used. The oxide semiconductor used for the oxide semiconductor layer 123 has, for example, an electron affinity higher than that of each of the oxide semiconductor films 107 and 115 by 0.07 eV or higher and 1.3 eV or lower, preferably 0.1 eV or higher and 0.7 eV or lower, and further preferably 0.2 eV or higher and 0.4 eV or lower.
Since the transistor described in this embodiment includes the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 that each include one or more kinds of metal elements included in the oxide semiconductor layer 123, interface states can be reduced at the interface between the oxide semiconductor layer 122 and the oxide semiconductor layer 123 and the interface between the oxide semiconductor layer 124 and the oxide semiconductor layer 123. Thus, providing the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 124 makes it possible to reduce variations or changes in electrical characteristics of the transistor, such as threshold voltage.
When a channel is formed at the interface between the gate insulating layer 150 and the oxide semiconductor layer 123, interface scattering occurs at the interface and the field-effect mobility of the transistor may decrease in some cases. In the transistor of this structure, however, the oxide semiconductor layer 124 includes one or more kinds of metal elements included in the semiconductor layer 123. Therefore, scattering of carriers is unlikely to occur at the interface between the semiconductor layer 124 and the oxide semiconductor layer 123, and thus the field-effect mobility of the transistor can be increased.
<<Source Electrode Layer 130 and Drain Electrode Layer 140>>
The source electrode layer 130 and the drain electrode layer 140 are preferably a conductive layer having a single-layer structure or a stacked-layer structure and containing a low-resistance material selected from copper (Cu), tungsten (W), molybdenum (Mo), gold (Au), aluminum (Al), manganese (Mn), titanium (Ti), tantalum (Ta), nickel (Ni), chromium (Cr), lead (Pb), tin (Sn), iron (Fe), cobalt (Co), ruthenium (Ru), platinum (Pt), iridium (Ir), and strontium (Sr), an alloy of such a low-resistance material, or a compound containing any of these materials as its main component. For example, in the case of stacking layers, the lower conductive layer which is in contact with the oxide semiconductor layer 123 contains a material which is easily combined with oxygen, and the upper conductive layer contains a highly oxidation-resistant material. It is preferable to use a high-melting-point material, such as tungsten or molybdenum, which has both heat resistance and conductivity. In addition, the plug is preferably formed using a low-resistance conductive material such as aluminum or copper. The plug is preferably formed using a Cu—Mn alloy, since in that case, manganese oxide formed at the interface with an insulator containing oxygen has a function of preventing Cu diffusion.
When the conductive material that is easily bonded to oxygen is in contact with an oxide semiconductor layer, a phenomenon occurs in which oxygen in the oxide semiconductor layer is diffused to the conductive material that is easily bonded to oxygen. Oxygen vacancies are generated in the vicinity of a region which is in the oxide semiconductor layer and is in contact with the source electrode layer or the drain electrode layer. Hydrogen slightly contained in the film enters the oxygen vacancies, whereby the region is markedly changed to an n-type region. Accordingly, the n-type region can serve as a source or a drain of the transistor.
For example, a stacked-layer structure using W and Pt for the lower conductive layer and the upper conductive layer, respectively can suppress oxidation of the conductive layers caused by being in contact with the insulating layer 170 while an oxide semiconductor in contact with the conductive layers becomes n-type.
<<Gate Insulating Layer 150>>
The gate insulating layer 150 can be formed using, for example, an insulating film containing one or more of aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide. The gate insulating layer 150 may be a stack of any of the above materials. The gate insulating layer 150 may contain lanthanum (La), nitrogen, or zirconium (Zr) as an impurity.
An example of a stacked-layer structure of the gate insulating layer 150 will be described. The gate insulating layer 150 includes, for example, oxygen, nitrogen, silicon, or hafnium. Specifically, the gate insulating layer 150 preferably includes hafnium oxide and silicon oxide or silicon oxynitride.
Hafnium oxide has higher dielectric constant than silicon oxide and silicon oxynitride. Therefore, by using hafnium oxide or aluminum oxide, the thickness of the insulating layer 160 can be larger than silicon oxide; thus, leakage current due to tunnel current can be low. That is, it is possible to provide a transistor with a low off-state current. Moreover, hafnium oxide with a crystalline structure has higher dielectric constant than hafnium oxide with an amorphous structure. Therefore, it is preferable to use hafnium oxide with a crystalline structure in order to provide a transistor with a low off-state current. Examples of the crystalline structure include a monoclinic crystal structure and a cubic crystal structure. Note that one embodiment of the present invention is not limited to the above examples.
In some cases, an interface state due to a defect exists in hafnium oxide having a crystalline structure in a formation surface where the hafnium oxide having the crystalline structure is formed. The interface state serves as a trap center in some cases. Therefore, when hafnium oxide is provided near a channel region of a transistor, the electrical characteristics of the transistor might deteriorate because of the interface state. In order to reduce the adverse effect of the interface state, in some cases, it is preferable to separate the channel region of the transistor and the hafnium oxide from each other by providing another film therebetween. The film has a buffer function. The film having a buffer function may be included in the gate insulating layer 150 or included in the oxide semiconductor film. That is, the film having a buffer function can be formed using silicon oxide, silicon oxynitride, an oxide semiconductor, or the like. Note that the film having a buffer function is formed using, for example, a semiconductor or an insulator having a larger energy gap than a semiconductor to be the channel region. Alternatively, the film having a buffer function is formed using, for example, a semiconductor or an insulator having lower electron affinity than a semiconductor to be the channel region. Further alternatively, the film having a buffer function is formed using, for example, a semiconductor or an insulator having higher ionization energy than a semiconductor to be the channel region.
In some cases, the threshold voltage of a transistor can be controlled by trapping an electric charge in an interface state (trap center) in hafnium oxide having the above-described crystalline structure in the formation surface where the hafnium oxide having the above-described crystalline structure is formed. In order to make the electric charge exist stably, for example, an insulator having a larger energy gap than hafnium oxide may be provided between the channel region and the hafnium oxide. Alternatively, a semiconductor or an insulator having lower electron affinity than hafnium oxide may be provided. The film having a buffer function may be formed using a semiconductor or an insulator having higher ionization energy than hafnium oxide. With the use of such an insulator, an electric charge trapped in the interface state is less likely to be released; accordingly, the electric charge can be held for a long period of time.
Examples of such an insulator include silicon oxide and silicon oxynitride. In order to make the interface state in the gate insulating layer 150 trap an electric charge, an electron may be transferred from an oxide semiconductor film toward the gate electrode layer 160. As a specific example, the potential of the gate electrode layer 160 is kept higher than the potential of the source electrode layer 130 or the drain electrode layer 140 under high temperature conditions (e.g., a temperature higher than or equal to 125° C. and lower than or equal to 450° C., typically higher than or equal to 150° C. and lower than or equal to 300° C.) for one second or longer, typically for one minute or longer.
The threshold voltage of a transistor in which a predetermined amount of electrons are trapped in interface states in the gate insulating layer 150 or the like shifts in the positive direction. The amount of electrons to be trapped (the amount of change in threshold voltage) can be controlled by adjusting a voltage of the gate electrode layer 160 or time in which the voltage is applied. Note that a location in which an electric charge is trapped is not necessarily limited to the inside of the gate insulating layer 150 as long as an electric charge can be trapped therein. A stacked film having a similar structure may be used as another insulating layer.
<<Gate Electrode Layer 160>>
A conductive film of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ru, Ag, Ta, W, or the like can be used for the gate electrode layer 160. The gate electrode layer 160 may have a stacked-layer structure. Any of these materials may be used for the gate electrode layer 162. A conductive film containing nitrogen, such as a nitride of the above material, may be used for the gate electrode layer 161.
<<Insulating Layer 170>>
The insulating layer 170 can be provided over the gate insulating layer 150 and the gate electrode layer 162. The insulating layer 170 can contain at least one of aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide.
An aluminum oxide film is preferably included in the insulating layer 170. The aluminum oxide film can prevent penetration by both oxygen and impurities, such as hydrogen and moisture. Accordingly, the aluminum oxide film is suitable for use as a protective film that has the following prevention effects: during and after the manufacturing process of the transistor, entry of impurities, such as hydrogen and moisture, which cause variations in the electrical characteristics of the transistor, into the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124; release of oxygen, which is the main component of the oxide semiconductor layers, from the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124; and unnecessary release of oxygen from the insulating layer 110.
The insulating layer 170 is preferably a film having oxygen supply capability, in which case oxygen can be supplied to oxygen vacancies in the oxide semiconductors and the transistor characteristics can be improved.
<<Insulating Layer 180>>
Further, the insulating layer 180 is preferably formed over the insulating layer 170. The insulating layer 180 can be formed using an insulating film containing one or more of magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide. The insulating layer 180 may be a stack of any of the above materials.
Here, the insulating layer 180 preferably contains oxygen more than that in the stoichiometric composition. Oxygen released from the insulating layer 180 can be diffused into the channel formation region in the oxide semiconductor layer 120 through the gate insulating layer 150, so that oxygen vacancies formed in the channel formation region can be filled with the oxygen. In this manner, stable electrical characteristics of the transistor can be achieved.
<Manufacturing Method of Transistor>
Next, a manufacturing method of a semiconductor device of this embodiment is described with reference to FIGS. 2A to 2D and FIGS. 3A to 3E. Note that the same parts as those in the above transistor structure are not described here. The direction of A1-A2 and that of B1-B2 in FIGS. 2A to 2D and FIGS. 3A to 3E can be respectively referred to as a channel length direction in FIGS. 1A and 1B and a channel width direction in FIGS. 1A and 1C.
In this embodiment, the layers included in the transistor (i.e., the insulating layer, the oxide semiconductor layer, the conductive layer, and the like) can be formed by any of a sputtering method, a chemical vapor deposition (CVD) method, a vacuum evaporation method, and a pulsed laser deposition (PLD) method. Alternatively, a coating method or a printing method can be used. Although the sputtering method and a plasma-enhanced chemical vapor deposition (PECVD) method are typical examples of the film formation method, a thermal CVD method may be used. As the thermal CVD method, a metal organic chemical vapor deposition (MOCVD) method or an atomic layer deposition (ALD) method may be used, for example.
<Thermal CVD Method>
A thermal CVD method has an advantage that no defect due to plasma damage is generated since it does not utilize plasma for forming a film.
Deposition by a thermal CVD method may be performed in such a manner that a source gas and an oxidizer are supplied to the chamber at a time, the pressure in a chamber is set to an atmospheric pressure or a reduced pressure, and reaction is caused in the vicinity of the substrate or over the substrate.
The variety of films such as the metal film, the semiconductor film, and the inorganic insulating film which have been disclosed in the above embodiments can be formed by a thermal CVD method, such as a MOCVD method or an ALD method. For example, in the case where an In—Ga—Zn—O film is formed, trimethylindium, trimethylgallium, and dimethylzinc can be used. Note that the chemical formula of trimethylindium is (CH3)3In. The chemical formula of trimethylgallium is (CH3)3Ga. The chemical formula of dimethylzinc is Zn(CH3)2. Without limitation to the above combination, triethylgallium (chemical formula: Ga(C2H5)3) can be used instead of trimethylgallium, and diethylzinc (chemical formula: Zn(C2H5)2) can be used instead of dimethylzinc.
<ALD Method>
In a conventional deposition apparatus utilizing a CVD method, one or more kinds of source gases (precursors) for reaction are supplied to a chamber at the same time at the time of deposition. In a deposition apparatus utilizing an ALD method, precursors for reaction are sequentially introduced into a chamber, and then the sequence of the gas introduction is repeated. For example, two or more kinds of precursors are sequentially supplied to the chamber by switching respective switching valves (also referred to as high-speed valves). For example, a first precursor is introduced, an inert gas (e.g., argon or nitrogen) or the like is introduced after the introduction of the first precursor so that the plural kinds of precursors are not mixed, and then a second precursor is introduced. Alternatively, the first precursor may be exhausted by vacuum evacuation instead of the introduction of the inert gas, and then the second precursor may be introduced.
FIGS. 5A to 5D illustrate a deposition process by an ALD method. First precursors 601 are adsorbed onto a substrate surface (see FIG. 5A), whereby a first monolayer is formed (see FIG. 5B). At this time, metal atoms and the like included in the precursors can be bonded to hydroxyl groups that exist at the substrate surface. The metal atoms may be bonded to alkyl groups such as methyl groups or ethyl groups. The first monolayer reacts with second precursors 602 introduced after the first precursors 601 are evacuated (see FIG. 5C), whereby a second monolayer is stacked over the first monolayer. Thus, a thin film is formed (see FIG. 5D). For example, in the case where an oxidizer is included in the second precursors, the oxidizer chemically reacts with metal atoms included in the first precursors or an alkyl group bonded to metal atoms, whereby an oxide film can be formed.
An ALD method is a deposition method based on a surface chemical reaction, by which precursors are adsorbed onto a surface and adsorbing is stopped by a self-terminating mechanism, whereby a layer is formed. For example, precursors such as trimethylaluminum react with hydroxyl groups (OH groups) that exist at the surface. At this time, only a surface reaction due to heating occurs; therefore, the precursors come into contact with the surface and metal atoms or the like in the precursors can be adsorbed onto the surface by thermal energy. The precursors have characteristics of, for example, having a high vapor pressure, being thermally stable before being deposited and not dissolving, and being chemically adsorbed onto a substrate at a high speed. Since the precursors are introduced in a state of a gas, when the first precursors and the second precursors, which are alternately introduced, have enough time to be diffused, a film can be formed with good coverage even onto a region having unevenness with a high aspect ratio.
In an ALD method, the sequence of the gas introduction is repeated a plurality of times until a desired thickness is obtained, whereby a thin film with excellent step coverage can be formed. The thickness of the thin film can be adjusted by the number of repetition times of the sequence of the gas introduction; therefore, an ALD method makes it possible to accurately adjust a thickness. The deposition rate can be increased and the impurity concentration in the film can be reduced by improving the evacuation capability.
ALD methods include an ALD method using heating (thermal ALD method) and an ALD method using plasma (plasma ALD method). In the thermal ALD method, precursors react using thermal energy, and in the plasma ALD method, precursors react in a state of a radical.
By an ALD method, an extremely thin film can be formed with high accuracy. In addition, the coverage of an uneven surface with the film and the film density of the film are high.
<Plasma ALD>
Alternatively, when the plasma ALD method is employed, the film can be formed at a lower temperature than when the thermal ALD method is employed. With the plasma ALD method, for example, the film can be formed without decreasing the deposition rate even at 100° C. or lower. Moreover, in the plasma ALD method, nitrogen radicals can be formed by plasma; thus, a nitride film as well as an oxide film can be formed.
In addition, oxidizability of an oxidizer can be enhanced by the plasma ALD method. Thus, precursors remaining in a plasma ALD film or organic components released from precursors can be reduced. In addition, carbon, chlorine, hydrogen, and the like in the film can be reduced. Therefore, a film with low impurity concentration can be formed.
In the case of using the plasma ALD, inductively coupled plasma (ICP) is used. Accordingly, plasma can be generated at a place apart from the substrate, so that plasma damage to the substrate or a film on which the protection film is formed can be inhibited.
As described above, with the plasma ALD method, the process temperature can be lowered and the coverage of the surface can be increased as compared with other deposition methods, and the film can be deposited successfully. Thus, entry of water and hydrogen from the outside can be inhibited, leading to an improvement of the reliability of characteristics of the transistor.
<ALD Apparatus>
FIG. 6A illustrates an example of a deposition apparatus utilizing an ALD method. The deposition apparatus utilizing an ALD method includes a deposition chamber (chamber 1701), source material supply portions 1711a and 1711b, high-speed valves 1712a and 1712b which are flow rate controllers, source material introduction ports 1713a and 1713b, a source material exhaust port 1714, and an evacuation unit 1715. The source material introduction ports 1713a and 1713b provided in the chamber 1701 are connected to the source material supply portions 1711a and 1711b, respectively, through supply tubes and valves. The source material exhaust port 1714 is connected to the evacuation unit 1715 through an exhaust tube, a valve, and a pressure controller.
A substrate holder 1716 with a heater is provided in the chamber, and a substrate 1700 over which a film is formed is provided over the substrate holder.
In the source material supply portions 1711a and 1711b, a precursor is formed from a solid source material or a liquid source material by using a vaporizer, a heating unit, or the like. Alternatively, the source material supply portions 1711a and 1711b may supply a precursor.
Although two source material supply portions 1711a and 1711b are provided as an example, without limitation thereon, three or more source material supply portions may be provided. The high-speed valves 1712a and 1712b can be accurately controlled by time, and a precursor and an inert gas are supplied by the high-speed valves 1712a and 1712b. The high-speed valves 1712a and 1712b are flow rate controllers for a precursor, and can also be referred to as flow rate controllers for an inert gas.
In the deposition apparatus illustrated in FIG. 6A, a thin film is formed over a surface of the substrate 1700 in the following manner: the substrate 1700 is transferred to put on the substrate holder 1716, the chamber 1701 is sealed, the substrate 1700 is heated to a desired temperature (e.g., higher than or equal to 100° C. or higher than or equal to 150° C.) by heating the substrate holder 1716 with a heater; and supply of a precursor, evacuation with the evacuation unit 1715, supply of an inert gas, and evacuation with the evacuation unit 1715 are repeated.
In the deposition apparatus illustrated in FIG. 6A, an insulating layer formed using an oxide (including a composite oxide) containing one or more elements selected from hafnium, aluminum, tantalum, zirconium, and the like can be formed by selecting a source material (e.g., a volatile organometallic compound) used for the source material supply portions 1711a and 1711b appropriately. Specifically, it is possible to use an insulating layer formed using hafnium oxide, an insulating layer formed using aluminum oxide, an insulating layer formed using hafnium silicate, or an insulating layer formed using aluminum silicate. Alternatively, a thin film, e.g., a metal layer such as a tungsten layer or a titanium layer, or a nitride layer such as a titanium nitride layer can be formed by selecting a source material (e.g., a volatile organometallic compound) used for the source material supply portions 1711a and 1711b appropriately.
For example, in the case where a hafnium oxide layer is formed by a deposition apparatus using an ALD method, two kinds of gases, i.e., ozone (O3) as an oxidizer and a precursor which is obtained by vaporizing liquid containing a solvent and a hafnium precursor compound (hafnium alkoxide or hafnium amide such as tetrakis(dimethylamide)hafnium (TDMAH)) are used. In this case, the first precursor supplied from the source material supply portion 1711a is TDMAH, and the second precursor supplied from the source material supply portion 1711b is ozone. Note that the chemical formula of tetrakis(dimethylamide)hafnium is Hf[N(CH3)2]4. Examples of another material include tetrakis(ethylmethylamide)hafnium. Note that nitrogen has a function of eliminating charge trap states. Therefore, when the precursor contains nitrogen, a hafnium oxide film having low density of charge trap states can be formed.
In the case where an aluminum oxide layer is formed by a deposition apparatus utilizing an ALD method, two kinds of gases, e.g., H2O as an oxidizer and a precursor which is obtained by vaporizing liquid containing a solvent and an aluminum precursor compound (e.g., trimethylaluminum (TMA)) are used. In this case, the first precursor supplied from the source material supply portion 1711a is TMA, and the second precursor supplied from the source material supply portion 1711b is H2O. Note that the chemical formula of trimethylaluminum is Al(CH3)3. Examples of another material liquid include tris(dimethylamide)aluminum, triisobutylaluminum, and aluminum tris(2,2,6,6-tetramethyl-3,5-heptanedionate).
For example, in the case where a silicon oxide film is formed by a deposition apparatus using an ALD method, hexachlorodisilane is adsorbed on a surface where a film is to be formed, chlorine contained in the adsorbate is removed, and radicals of an oxidizing gas (e.g., O2 or dinitrogen monoxide) are supplied to react with the adsorbate.
For example, in the case where a tungsten film is formed using a deposition apparatus employing ALD, a WF6 gas and a B2H6 gas are sequentially introduced plural times to form an initial tungsten film, and then a WF6 gas and an H2 gas are introduced at a time, so that a tungsten film is formed. Note that an SiH4 gas may be used instead of a B2H6 gas.
For example, in the case where an oxide semiconductor film, e.g., an In—Ga—Zn—O film is formed using a deposition apparatus employing ALD, an In(CH3)3 gas and an O3 gas are sequentially introduced plural times to form an InO2 layer, a Ga(CH3)3 gas and an O3 gas are introduced at a time to form a GaO layer, and then a Zn(CH3)2 gas and an O3 gas are introduced at a time to form a ZnO layer. Note that the order of these layers is not limited to this example. A mixed compound layer such as an In—Ga—O layer, an In—Zn—O layer, or a Ga—Zn—O layer may be formed by using these gases. Note that although an H2O gas which is obtained by bubbling water with an inert gas such as Ar may be used instead of an O3 gas, it is preferable to use an O3 gas, which does not contain H. Instead of an In(CH3)3 gas, an In(C2H5)3 gas may be used. Instead of a Ga(CH3)3 gas, a Ga(C2H5)3 gas may be used. A Zn(CH3)2 gas may be used.
<Formation of Insulating Layer 110>
The insulating layer 110 and an oxide semiconductor film 121a are formed over the substrate 100 as shown in FIG. 2A. The insulating layer 110 can be formed by a plasma CVD method, a thermal CVD method (an MOCVD method, an ALD method), a sputtering method, or the like with use of an oxide insulating film of aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, tantalum oxide, or the like; a nitride insulating film of silicon nitride, silicon nitride oxide, aluminum nitride, aluminum nitride oxide, or the like; or a mixed material of any of these. Alternatively, these materials may be stacked, in which case at least an upper layer of the stacked layer which is in contact with the oxide semiconductor film 121a is preferably formed using a material containing excess oxygen that can serve as a supply source of oxygen to the oxide semiconductor layer 123.
As the insulating layer 110 in this embodiment, a 100-nm-thick silicon oxynitride film can be formed by a plasma CVD method.
Next, heat treatment may be performed to release water, hydrogen, or the like contained in the insulating layer 110. As a result, the concentration of water, hydrogen, or the like contained in the insulating layer 110 that is to be formed later can be reduced. The heat treatment can reduce the amount of water, hydrogen, or the like diffused into the oxide semiconductor film 121a. 
<Formation of Oxide Semiconductor Film 121a>
The oxide semiconductor film 121a, which is to be the oxide semiconductor layer 121, can be formed by a sputtering method, an MOCVD method, a PLD method, or the like, and a sputtering method is preferable. As a sputtering method, an RF sputtering method, a DC sputtering method, an AC sputtering method, or the like can be used.
When the oxide semiconductor film 121a is formed by a sputtering method, it is preferable that each chamber of the sputtering apparatus be able to be evacuated to a high vacuum (about 5×10−7 Pa to 1×10−4 Pa) by an adsorption vacuum pump such as a cryopump and that the chamber be able to heat a substrate over which a film is to be deposited to 100° C. or higher, preferably 400° C. or higher so that water and the like acting as impurities in the oxide semiconductor can be removed as much as possible. Alternatively, a combination of a turbo molecular pump and a cold trap is preferably used to prevent back-flow of a gas containing a carbon component, moisture, or the like from an exhaust system into the chamber. Alternatively, a combination of a turbo molecular pump and a cryopump may be used as an exhaust system.
Not only high vacuum evacuation in a chamber but also high purity of a sputtering gas is necessary to obtain a high-purity intrinsic oxide semiconductor. When a highly purified gas having a dew point of −40° C. or lower, preferably −80° C. or lower, more preferably −100° C. or lower is used as an oxygen gas or an argon gas used as a sputtering gas, moisture or the like can be prevented from entering an oxide semiconductor as much as possible.
As a sputtering gas, a rare gas (typically argon), an oxygen gas, or a mixed gas of a rare gas and oxygen is used as appropriate. In the case of using the mixed gas of a rare gas and oxygen, the proportion of oxygen to a rare gas is preferably increased.
Note that, for example, in the case where the oxide semiconductor film is formed by a sputtering method at a substrate temperature higher than or equal to 150° C. and lower than or equal to 750° C., preferably higher than or equal to 150° C. and lower than or equal to 450° C., further preferably higher than or equal to 200° C. and lower than or equal to 420° C., the oxide semiconductor film can be a CAAC-OS film.
In this embodiment, an In—Ga—Zn oxide film (In:Ga:Zn=1:3:4 [atomic ratio]) having a thickness of 10 nm to 30 nm is formed by a sputtering method as the oxide semiconductor film 121a. 
<Oxygen Addition>
Next, oxygen is added to the oxide semiconductor film 121a to form an oxide semiconductor film 121b as shown in FIG. 2B.
As the oxygen 108 added to the oxide semiconductor film 121a, at least one kind selected from oxygen radicals, oxygen atoms, oxygen atomic ions, oxygen molecular ions, and the like is used. As a method for adding the oxygen 108 to the oxide semiconductor film 121a, an ion doping method, an ion implantation method, a plasma immersion ion implantation method, or the like can be used.
In the case of using an ion implantation method as the method for adding the oxygen 108 to the oxide semiconductor layer 121, oxygen atomic ions or oxygen molecular ions can be used as the oxygen 108. The use of oxygen molecular ions can reduce damage to the oxide semiconductor layer 121. Oxygen molecular ions are broken down into oxygen atomic ions at the surface of the oxide semiconductor layer 121, and the oxygen atomic ions are added to the oxide semiconductor layer 121. Since energy for breaking oxygen molecules down into oxygen atoms is used, the energy per oxygen atomic ion in the case of adding oxygen molecular ions to the oxide semiconductor layer 121 is lower than that in the case of adding oxygen atomic ions to the oxide semiconductor layer 121. Therefore, in the case of adding oxygen molecular ions to the oxide semiconductor layer 121, damage to the oxide semiconductor layer 121 can be reduced.
By using oxygen molecular ions, the energy of each oxygen atomic ion injected to the insulating layer 110 is lowered, which makes the injected oxygen atomic ion be positioned in a shallow region. Accordingly, oxygen atoms easily move by later heat treatment, so that more oxygen can be supplied to an oxide semiconductor layer 123 that is to be formed later.
In the case of injecting oxygen molecular ions, the energy per oxygen atomic ion is low as compared with the case of injecting oxygen atomic ions. Thus, by using oxygen molecular ions for injection, the acceleration voltage can be increased and throughput can be increased. Moreover, by using oxygen molecular ions for injection, the dose can be half of the amount that is necessary in the case of using oxygen atomic ions. As a result, throughput can be increased.
In the case of adding oxygen to the oxide semiconductor film 121a, it is preferable that oxygen be added to the oxide semiconductor film 121a so that a peak of the concentration profile of oxygen atomic ions is located in the oxide semiconductor film 121a. In that case, the acceleration voltage for implantation can be lowered as compared to the case where oxygen atomic ions are implanted into the insulating layer 110, and damage to the insulating layer 110 can be reduced. In other words, defects in the insulating layer 110 can be reduced, and variations in electrical characteristics of the transistor can be reduced. Furthermore, in the case where oxygen is added to the oxide semiconductor film 121a so that the amount of added oxygen atoms at the interface between the insulating layer 110 and the oxide semiconductor film 121a is less than 1×1021 atoms/cm3, less than 1×1020 atoms/cm3, or less than 1×1019 atoms/cm3, the amount of oxygen added to the insulating layer 110 that is to be formed later can be reduced. As a result, damage to the insulating layer 110 can be reduced, suppressing variation in the electrical characteristics of the transistor.
Plasma treatment (plasma immersion ion implantation method) in which the oxide semiconductor layer 121 is exposed to plasma generated in an atmosphere containing oxygen may be performed, to add oxygen to the oxide semiconductor film 121a. As the atmosphere containing oxygen, an atmosphere containing an oxidation gas such as oxygen, ozone, dinitrogen monoxide, or nitrogen dioxide can be given. Note that it is preferable that the oxide semiconductor film 121a be exposed to plasma generated in a state where bias is applied on the substrate 100 side, because the amount of oxygen added to the oxide semiconductor film 121a can be increased. As an example of an apparatus with which such plasma treatment is performed, an ashing apparatus is given.
In this embodiment, oxygen molecular ions are added to the oxide semiconductor film 121a by an ion implantation method with a dose of 1×1016/cm2 at an acceleration voltage of 5 keV.
Through the above-described steps, an oxide semiconductor film 121a to which oxygen is added as illustrated in FIG. 2B can be formed. As a result, the number of oxygen vacancies in the oxide semiconductor layer 123 can be reduced by heat treatment in a later step. Note that the oxide semiconductor film 121b to which oxygen is added has a low film density compared with the oxide semiconductor film 121a to which oxygen is not added.
<Formation of Oxide Semiconductor Layers 122 and 123>
Next, an oxide semiconductor film 122a and an oxide semiconductor film 123a are formed over the oxide semiconductor film 121b to which oxygen is added. The oxide semiconductor film 122a and the oxide semiconductor film 123a can be formed in a manner similar to the oxide semiconductor film 121a. 
The material of the oxide semiconductor film 122a is selected so that the oxide semiconductor film 122a can have a lower electron affinity than the oxide semiconductor film 123a. 
The indium content of the oxide semiconductor film 123a is preferably higher than those of the oxide semiconductor film 121a, the oxide semiconductor film 122a, and the oxide semiconductor film 124a. In an oxide semiconductor, the s orbital of heavy metal mainly contributes to carrier transfer, and when the proportion of In in the oxide semiconductor is increased, overlap of the s orbitals is likely to be increased. Therefore, an oxide having a composition in which the proportion of In is higher than that of Ga has higher mobility than an oxide having a composition in which the proportion of In is equal to or lower than that of Ga. Thus, with the use of an oxide having a high indium content for the oxide semiconductor layer 123, a transistor having high mobility can be achieved.
When a sputtering method is used to form the oxide semiconductor film 122a and the oxide semiconductor film 123a, the oxide semiconductor film 122a and the oxide semiconductor film 123a can be successively formed without exposing to the air with use of a multi-chamber sputtering apparatus In that case, entry of unnecessary impurities and the like into the interface between the oxide semiconductor film 122a and the oxide semiconductor film 123a can be prevented and the interface states can be reduced accordingly. Thus, the electrical characteristics of a transistor can be stabilized, particularly in a reliability test.
If the oxide semiconductor film 121b is damaged by addition of oxygen, the oxide semiconductor layer 123, which is a main conduction path, can keep a distance from the damaged part thanks to the existence of the oxide semiconductor layer 122. Thus, the electrical characteristics of a transistor can be stabilized, particularly in a reliability test.
In this embodiment, an In—Ga—Zn oxide film (In:Ga:Zn=1:3:4 [atomic ratio]) having a thickness of 10 nm can be formed by a sputtering method as the oxide semiconductor film 122a. In addition, an In—Ga—Zn oxide film (In:Ga:Zn=1:1:1 [atomic ratio]) having a thickness of 15 nm can be formed by a sputtering method as the oxide semiconductor film 123a. 
The amount of oxygen vacancies in the oxide semiconductor film 123a can be reduced by heat treatment after the oxide semiconductor film 122a and the oxide semiconductor film 123a are formed.
Next, heat treatment is performed so that part of oxygen contained in the oxide semiconductor film 121b to which oxygen is added can be transferred to the oxide semiconductor film 123a; consequently, oxygen vacancies in the oxide semiconductor film 123a can be reduced. This oxide semiconductor film 123a with reduced oxygen vacancies is represented as the oxide semiconductor film 123b. Oxygen vacancies in the oxide semiconductor film 121b to which oxygen is added can be reduced. This oxide semiconductor film is represented as the oxide semiconductor film 121c in FIG. 2C. Hydrogen, water, and the like contained in the oxide semiconductor film 121c and the oxide semiconductor film 122a to which oxygen is added and the oxide semiconductor film 123b can be released. This reduces the amount of impurities contained in the oxide semiconductor film 121c and the oxide semiconductor film 122a to which oxygen has been added and the oxide semiconductor film 123b. 
The temperature of heat treatment is preferably within the range of temperatures at which oxygen is transferred from the oxide semiconductor film 121b to which oxygen is added to the oxide semiconductor film 123a. The temperature is typically higher than or equal to 250° C. and lower than the strain point of the substrate, preferably higher than or equal to 300° C. and lower than or equal to 650° C., further preferably higher than or equal to 350° C. and lower than or equal to 550° C.
The heat treatment is performed under an inert gas atmosphere containing nitrogen or a rare gas such as helium, neon, argon, xenon, or krypton. Further, after heat treatment performed in an inert gas atmosphere, heat treatment may be additionally performed in an oxygen atmosphere or a dry air atmosphere (air whose dew point is lower than or equal to −80° C., preferably lower than or equal to −100° C., further preferably lower than or equal to −120° C.). The treatment may be performed under reduced pressure. Note that it is preferable that hydrogen, water, and the like be not contained in an inert gas and oxygen, like the dry air, and the dew point is preferably lower than or equal to −80° C., further preferably lower than or equal to −100° C. The treatment time is 3 minutes to 24 hours.
In the heat treatment, instead of an electric furnace, any device for heating an object by heat conduction or heat radiation from a heating element, such as a resistance heating element, may be used. For example, an RTA (rapid thermal annealing) apparatus, such as a GRTA (gas rapid thermal annealing) apparatus or an LRTA (lamp rapid thermal annealing) apparatus, can be used. The LRTA apparatus is an apparatus for heating an object to be processed by radiation of light (an electromagnetic wave) emitted from a lamp, such as a halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressure sodium lamp, or a high pressure mercury lamp. The GRTA apparatus is an apparatus for heat treatment using a high-temperature gas. As the high-temperature gas, an inert gas, such as nitrogen or a rare gas like argon, is used.
Note that the first heat treatment may be performed after etching for forming the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 described later.
In this embodiment, after heat treatment is performed at 450° C. for one hour in a nitrogen atmosphere, heat treatment is performed at 450° C. for one hour in an oxygen atmosphere.
Through the above-described steps, oxygen vacancies and impurities such as hydrogen and water in the oxide semiconductor films can be reduced. The oxide semiconductor films can have low density of localized states.
Note that the oxide semiconductor film 122a can prevent oxygen added to the oxide semiconductor film 121b from being diffused to the outside, and the oxide semiconductor layer 123 can be formed at high temperatures. In that case, oxygen added to the oxide semiconductor film 121b when the oxide semiconductor layer 123 is formed can be diffused into the oxide semiconductor layer without heat treatment performed after the oxide semiconductor films 122a and 123a to reduce oxygen vacancies. This can improve the productivity of a semiconductor device.
The heat treatment may be performed in a later step, not this step. In other words, in another heating step performed later, part of oxygen contained in the oxide semiconductor film 121b to which oxygen is added may be transferred to the oxide semiconductor film 123a. Thus, the number of heating steps can be reduced and the productivity can be increased.
<Formation of Conductive Film 130a>
Next, a conductive film 130a to be the source electrode layer 130 and the drain electrode layer 140 is formed over the oxide semiconductor layer 123 (see FIG. 3C). The conductive film 130a is formed by a sputtering method, a chemical vapor deposition (CVD) method such as a metal organic chemical vapor deposition (MOCVD) method, a metal chemical deposition method, an atomic layer deposition (ALD) method, or a plasma-enhanced chemical vapor deposition (PECVD) method, an evaporation method, a pulsed laser deposition (PLD) method, or the like.
As a preferable material of the conductive film 130a, a single-layer structure or a layered structure of a conductive film containing a low-resistance material selected from copper (Cu), tungsten (W), molybdenum (Mo), gold (Au), aluminum (Al), manganese (Mn), titanium (Ti), tantalum (Ta), nickel (Ni), chromium (Cr), lead (Pb), tin (Sn), iron (Fe), cobalt (Co), ruthenium (Ru), platinum (Pt), iridium (Ir), and strontium (Sr), an alloy of such a low-resistance material, or a compound containing such a material as its main component. For example, in the case of stacking layers, the lower conductive layer which is in contact with the oxide semiconductor layer 123 contains a material which is easily combined with oxygen, and the upper conductive layer contains a highly oxidation-resistant material. It is preferable to use a high-melting-point material which has both heat resistance and conductivity, such as tungsten or molybdenum. In addition, a low-resistance conductive material, such as aluminum or copper, is preferable. A Cu—Mn alloy is also preferable, in which case manganese oxide formed at the interface with an insulator containing oxygen has a function of preventing Cu diffusion.
As the conductive film 130a in this embodiment, a tungsten film having a thickness of 20 nm to 100 nm can be formed by a sputtering method.
The conductive layer 130b formed by processing the conductive film 130a can have a function of a hard mask in the subsequent step and a function of a source electrode and a drain electrode; thus, the number of steps can be reduced. Thus, the semiconductor manufacturing process can be shortened.
Then, a resist mask is formed through a lithography process. The conductive film 130a is selectively etched using the resist mask, so that the conductive layer 130b is formed. The resist over the conductive layer 130b is removed. The oxide semiconductor film 123b, the oxide semiconductor film 122a, and the oxide semiconductor film 121c are selectively etched using the conductive layer 130b as a hard mask, so that the island-shaped oxide semiconductor layers 123, 122, and 121 can be formed (see FIG. 2D). Dry etching can be used here. Note that the use of the conductive layer 130b as a hard mask for etching for the oxide semiconductor layer can reduce edge roughness of the etched oxide semiconductor layers as compared to the case of using a resist mask.
<Formation of Source Electrode Layer 130, Drain Electrode Layer 140, and Gate Insulating Layer 150>
Next, a resist mask is formed over the conductive layer 130b by a lithography process, and the conductive layer 130b is etched and divided using the resist mask, so that the source electrode layer 130 and the drain electrode layer 140 can be formed (see FIG. 3A).
Note that in the case where a transistor having an extremely short channel length is formed, at least the conductive layer in a region to divide the conductive layer 130b to be the source electrode layer 130 and the drain electrode layer 140 is etched using a resist mask that is processed by a method suitable for micropatterning, such as electron beam exposure, liquid immersion exposure, or EUV exposure. Note that in the case of forming the resist mask by electron beam exposure, a positive resist mask is used, so that an exposed region can be minimized and throughput can be improved. In the above manner, a transistor having a channel length of 100 nm or less, further, 30 nm or less can be formed. Alternatively, minute processing may be performed by an exposure technology which uses light with an extremely short wavelength (e.g., extreme ultraviolet (EUV)), X-rays, or the like.
Note that the order of formation the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, the source electrode layer 130, and the drain electrode layer 140 can be reversed. For example, a gap may be first formed in the conductive film which is to be the source electrode layer 130 and the drain electrode layer 140 and then the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 are formed.
In this embodiment, the source electrode layer 130 and the drain electrode layer 140 can be formed in the following manner: a resist mask is formed over the tungsten layer which is formed as the conductive layer 130b, and then, dry etching using a chlorine-based or fluorine-based gas is performed using the resist mask.
After the source electrode layer 130 and the drain electrode layer 140 are formed, cleaning treatment is preferably performed to remove an etching residue. The cleaning treatment can prevent a short circuit between the source electrode layer 130 and the drain electrode layer 140. The cleaning treatment can be performed using an alkaline solution such as a tetramethylammonium hydroxide (TMAH) solution, an acidic solution such as diluted hydrofluoric acid, an oxalic acid solution, or a phosphoric acid solution. By the cleaning treatment, part of the oxide semiconductor layer 123 is etched to have a depression.
<Formation of Oxide Semiconductor Layer 124>
The oxide semiconductor film 124a used as the oxide semiconductor layer 124 can be formed similarly to the oxide semiconductor film 121a. The materials can be selected so that the electron affinity of the oxide semiconductor film 124a can be smaller than that of the oxide semiconductor film 123a. 
A 5-nm-thick In—Ga—Zn oxide film (In:Ga:Zn=1:3:2 [atomic ratio]) can be formed as the oxide semiconductor film 124a in this embodiment.
<Formation of Insulating Film 150a>
Next, an insulating film 150a to be the gate insulating layer 150 is formed over the oxide semiconductor film 123a. The insulating film 150a can be formed using aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, tantalum oxide, or the like. The insulating film 150a may be a stack containing any of these materials. The insulating film 150a can be formed by a sputtering method, a CVD method such as a plasma CVD method, a MOCVD method, or an ALD method, an MBE method, or the like. The insulating film 150a can be formed by a method similar to that of the insulating layer 110 as appropriate.
In this embodiment, a 10-nm-thick silicon oxynitride film is formed by a plasma CVD method as the insulating film 150a. 
<Formation of Conductive Films 161a and 162a>
Next, a conductive film 161a (not illustrated) to be the gate electrode layer 161 and a conductive film 162b (not illustrated) to be the gate electrode layer 162 are formed over the insulating film 150a. For example, aluminum (Al), titanium (Ti), chromium (Cr), cobalt (Co), nickel (Ni), copper (Cu), yttrium (Y), zirconium (Zr), molybdenum (Mo), ruthenium (Ru), silver (Ag), tantalum (Ta), and tungsten (W), or an alloy material containing any of these as its main component can be used for the conductive films 161a and 162b. The conductive films 161a and 162b can be formed by a sputtering method, a CVD method, or the like. The conductive film 161a may be formed using a conductive film containing nitrogen or a stack including the conductive film and a conductive film containing nitrogen.
In this embodiment, a 10-nm-thick titanium nitride film is formed by a sputtering method as the conductive film 161a, and a 30-nm-thick tungsten film is stacked thereover as the conductive film 162b. 
Then, a mask is formed over the conductive film 161a and the conductive film 162b by a lithography process. The conductive film 161a and the conductive film 162b are selectively etched using the mask to form the gate electrode layer 161 and the gate electrode layer 162 (see FIG. 3B).
Then, a resist mask is formed over the gate electrode layer 161, the gate electrode layer 162, and the insulating film 150a by a lithography process. The mask has a larger area than the mask for forming the gate electrode layer 161 and the gate electrode layer 162. The insulating film 150a and the oxide semiconductor film 124a are selectively etched using the mask, so that the gate insulating layer 150 and the oxide semiconductor layer 124 can be formed (see FIG. 3C).
In the transistor 10, by providing the oxide semiconductor layer 124 in which oxygen vacancies are unlikely to occur, release of oxygen from side surfaces of the oxide semiconductor layer 123 in the channel width direction is suppressed, so that generation of oxygen vacancies can be suppressed. As a result, a transistor which has improved electrical characteristics and high reliability can be provided.
As shown in FIG. 3D, an insulating film 170a and an insulating film 180a are formed in this order over the insulating layer 110, the gate insulating layer 150, the source electrode layer 130, the drain electrode layer 140, the oxide semiconductor layer 124, the gate insulating layer 150, the gate electrode layer 161, and the gate electrode layer 162.
<<Formation of Insulating Films 170a and 180a>>
The insulating film 170a and the insulating film 180a can be formed using a material, a method, and the like similar to those of the insulating layer 110.
The insulating film 170a is preferably an aluminum oxide film formed by a sputtering method. Sputtering gas used for forming the aluminum oxide film preferably contains oxygen gas. The percentage of the oxygen gas to the whole deposition gas is more than or equal to 1% and less than or equal to 100%, preferably more than or equal to 4% and less than or equal to 100%, further preferably more than or equal to 10% and less than or equal to 100%. When the flow ratio of oxygen is 1% or more, the insulating film 170a and insulating layers in contact with the insulating film 170a can contain excess oxygen. Thereby, oxygen can be added to the layers in contact with the insulating film 170a. As a result, oxygen vacancies that exist in the oxide semiconductor can be further reduced and characteristics of the transistor can be improved.
In the case where the insulating film 180a is an oxide insulating film containing oxygen in excess of the stoichiometric composition, it can be formed by a CVD method, a sputtering method, or the like. Alternatively, after the oxide insulating film is formed by a CVD method, a sputtering method, or the like, oxygen may be added to the oxide insulating film by an ion implantation method, an ion doping method, plasma treatment, or the like.
In this embodiment, the insulating film 170a having a thickness from 20 nm to 40 nm can be formed using aluminum oxide as a sputtering target and sputtering gas contains 50% of oxygen molecules. A 150-nm-thick silicon oxynitride film is formed by a plasma CVD method as the insulating film 180a. 
Next, heat treatment may be performed. The temperature of the heat treatment is typically higher than or equal to 150° C. and lower than the strain point of the substrate, preferably higher than or equal to 250° C. and lower than or equal to 500° C., further preferably higher than or equal to 300° C. and lower than or equal to 450° C.
In this embodiment, heat treatment is performed at 400° C. in an oxygen atmosphere for one hour.
<<Formation of Conductive Layer 190>>
Next, openings are formed in the insulating film 170a and the insulating film 180b, so that the insulating layer 170 and the insulating layer 180 are formed. Then, a conductive film 190a (not illustrated) is formed over the insulating layer 180.
The conductive film 190a can be formed by similar material and method to those of the conductive film 130a. 
After the conductive film 190a is formed, a mask is formed by a lithography process. The conductive film 190a is selectively etched using the mask, whereby the conductive layer 190 can be formed (see FIG. 3E).
In this embodiment, the conductive layer 190 can be formed by stacking a 20-nm-thick titanium film, a 30-nm-thick titanium nitride film, a 50-nm-thick aluminum film, and a 50-nm-thick titanium nitride film by a sputtering method.
Through the above-described steps, the density of localized states of the oxide semiconductor films is lowered, and thus a transistor with excellent electrical characteristics can be manufactured. In addition, a highly reliable transistor in which a variation in electric characteristics with time or a variation in electric characteristics due to a stress test is small can be manufactured.
<Modification Example 1 of Transistor 10>
A transistor 11 which is a modification example of the transistor 10 shown in FIGS. 1A to 1C will be described with reference to FIGS. 7A to 7C. The difference between the transistors 10 and 11 is the shape of the source electrode layer 130 and the drain electrode layer 140.
FIGS. 7A to 7C are a top view and cross-sectional views of the transistor 11. FIG. 7A is a top view of the transistor 11. FIG. 7B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 7A. FIG. 7C is a cross-sectional view taken along dashed-dotted line B1-B2 in FIG. 7A.
The transistor 11 includes the oxide semiconductor layer 124 in contact with the oxide semiconductor layer 123, the source electrode layer 130, and the drain electrode layer 140, and the gate insulating layer 150 in contact with the oxide semiconductor layer 124. The gate insulating layer 150 includes a region in contact with the gate electrode layer 161.
In the channel length direction, one end of the source electrode layer 130 and one end of the drain electrode layer 140 included in the transistor 11 are located outside the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 and can cover the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123, which is the difference from the transistor 10. Note that the cross section in the channel width direction of the transistor 11 in FIG. 7C can be similar to that of the transistor 10.
A manufacturing method of the transistor 11 will be described. Through the steps shown in FIGS. 2A to 2D, the insulating layer 110, the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 are formed over the substrate 100.
Next, the conductive film 130a is removed. A conductive layer 131a (not illustrated) is formed and a resist mask is formed by a lithography process, so that the source electrode layer 130 and the drain electrode layer 140 are formed (see FIG. 8A).
Then, the steps similar to those for forming the transistor 10 are performed, so that the transistor 11 can be completed (see FIGS. 8B to 8E).
<Modification Example 2 of Transistor 10>
FIGS. 9A to 9C are a top view and cross-sectional views of the transistor 12 included in a semiconductor device. FIG. 9A is a top view of the transistor 12. FIG. 9B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 9A. FIG. 9C is a cross-sectional view taken along dashed-dotted line B1-B2 in FIG. 9A.
The transistor 12 includes the oxide semiconductor layer 124 in contact with the oxide semiconductor layer 123, the source electrode layer 130, and the drain electrode layer 140, and the gate insulating layer 150 in contact with the oxide semiconductor layer 124. The gate insulating layer 150 includes a region in contact with the gate electrode layer 161.
One end of each of the oxide semiconductor layer 124 and the gate insulating layer 150 of the transistor 12 is located outside the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123: the oxide semiconductor layer 124 and the gate insulating layer 150 can cover the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 and can suppress oxygen diffusion from the ends of the oxide semiconductor layers to the outside.
A manufacturing method of the transistor 12 is described below. As shown in FIG. 10A, the insulating layer 110, the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, the source electrode layer 130, the drain electrode layer 140, the oxide semiconductor film 124a, the insulating film 150a, the gate electrode layer 161, and the gate electrode layer 162 are formed over the substrate 100 through the steps shown in FIGS. 2A to 2D and FIG. 3A.
Next, a resist mask is formed over the oxide semiconductor film 124a and the insulating film 150a to cover the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123 by a lithography process. The insulating film 150a and the oxide semiconductor film 124a are selectively etched by a dry etching, so that the oxide semiconductor layer 124 and the gate insulating layer 150 are formed (see FIG. 10B).
Then, the steps similar to those for forming the transistor 10 are performed, so that the transistor 12 can be completed (see FIGS. 10C and 10D).
<Modification Example 3 of Transistor 10>
FIGS. 11A to 11D are a top view and cross-sectional views of a transistor 13 included in a semiconductor device. FIG. 11A is a top view of the transistor 13. FIG. 11B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 11A. FIG. 11C is a cross-sectional view taken along dashed-dotted line B1-B2 in FIG. 11A. FIG. 11D is a modification example of FIG. 11C.
The transistor 13 is different from the transistor 10 in that a backgate electrode layer 105 is provided under and in contact with the insulating layer 110. Although the backgate electrode layer 105 is not electrically connected to the gate electrode layers 161 and 162 and has different potentials from the gate electrode layers 161 and 162 in FIG. 11C, they may be electrically connected and supplied with the same potential as shown in FIG. 11D. The transistor characteristics can be improved owing to a backgate electrode; in particular, the threshold voltage of the transistor can be controlled.
A manufacturing method of the transistor 13 is described. First, a conductive film 105a is formed over the substrate 100. A resist mask is formed by a lithography process, and the conductive film 105a is selectively etched to form the backgate electrode layer 105. Then, the insulating layer 110 and the oxide semiconductor film 121a are formed over the backgate electrode layer 105 (see FIG. 12A). The transistor 12 can be completed through the steps similar to those for forming the transistor 10 as shown in FIGS. 12B, 12C, 12D, 13A, 13B, 13C, 13D, and 13E.
This embodiment can be combined as appropriate with any of the other embodiments and examples in this specification.
Embodiment 2
In this embodiment, a transistor having a structure which is different from the structures of the transistor 10, the transistor 11, the transistor 12, and the transistor 13 described in Embodiment 1 and a method for manufacturing the transistor will be described.
FIGS. 14A, 14B, and 14C are a top view and cross-sectional views of a transistor 14 of one embodiment of the present invention. FIG. 14A is a top view. FIG. 14B is a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 14A. FIG. 14C is a cross-sectional view taken along dashed-dotted line B1-B2 in FIG. 14A. In FIG. 14A, some components are scaled up or down in size or omitted for easy understanding. In addition, the direction of dashed-dotted line A1-A2 and the direction of dashed-dotted line B1-B2 are sometimes referred to as a channel length direction and a channel width direction, respectively.
The transistor 14 shown in FIGS. 14A, 14B, and 14C includes an insulating layer 171 under the insulating layer 170. Ends of the insulating layer 171 are located inside those of the insulating layer 170. The insulating layer 171 covers the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124. In addition, the shape of the conductive layer 190 and the presence of a conductive layer 191 in the cross-sectional view of FIG. 14B are different from the transistor 10, the transistor 11, the transistor 12, and the transistor 13. The transistor 10, the transistor 11, the transistor 12, and the transistor 13 can have the structure similar to the transistor 14. The conductive layer 191 can include a material similar to the conductive layer 190.
<<Insulating Layer 171>>
The insulating layer 171 can be formed using an insulating film containing at least one of aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide.
A film having a barrier property is preferably used for the insulating layer 171. For example, the insulating layer 171 preferably includes an aluminum oxide film. The aluminum oxide film has a barrier property for blocking both oxygen and impurities, such as hydrogen and moisture. During and after the manufacturing process of the transistor, the aluminum oxide film can suitably function as a protective film that has effects of preventing entry of impurities such as hydrogen and moisture, which cause variations in the electrical characteristics of the transistor, into the oxide semiconductor layer 120, preventing release of oxygen, which is a main component of the oxide semiconductor layer 120, from the oxide semiconductor layer, and preventing unnecessary release of oxygen from the insulating layer 110. Furthermore, oxygen contained in the aluminum oxide film can be diffused into the oxide semiconductor layer 120.
<Manufacturing Method of Transistor 14>
A manufacturing method of the transistor 14 will be described. First, the backgate electrode layer 105, the insulating layer 110, the oxide semiconductor layers 121, 122, and 123, the source electrode layer 130, and the drain electrode layer 140 are formed similarly to the transistor 13 through the steps shown in FIGS. 12A, 12B, 12C, 12D, and FIG. 13A.
Next, as shown in FIGS. 15A and 15B, the oxide semiconductor layer 124, the gate insulating layer 150, the gate electrode layer 161, and the gate electrode layer 162 are formed over the insulating layer 110, the source electrode layer 130, the drain electrode layer 140, and the oxide semiconductor layer 123.
Next, an insulating film 171a (not illustrated) is formed. The insulating film 171a is formed desirably by an ALD method. The use of an ALD method can form the insulating film 171a uniformly even on uneven portions. The thickness of the insulating film 171a is desirably more than or equal to 3 nm and less than 100 nm, preferably more than or equal to 5 nm and less than 50 nm, further preferably more than or equal to 5 nm and less than 30 nm.
The insulating film 171a is dry-etched using a resist mask, so that the insulating layer 171 is formed. Here, ends of the insulating layer 171 are located outside ends of the oxide semiconductor layer 121, the oxide semiconductor layer 122, and the oxide semiconductor layer 123. The insulating layer 171 covers each side surfaces of the oxide semiconductor layer 121, the oxide semiconductor layer 122, the oxide semiconductor layer 123, and the oxide semiconductor layer 124; each side surface and a top surface of the gate insulating layer 150; each side surfaces of the gate electrode layer 161 and the gate electrode layer 162; and a top surface of the gate electrode layer 162 without any space (see FIG. 15C).
The insulating layer 171 can prevent entry of moisture, hydrogen, and the like to the oxide semiconductor layer and oxygen diffusion to the outside from the oxide semiconductor layer, leading to the improvement of transistor characteristics, particularly long-term reliability of transistor operation.
Next, the insulating film 170a is formed. The insulating film 170a is preferably formed by a sputtering method. When a sputtering method is used, sputtering gas preferably contains oxygen gas. The percentage of the oxygen gas to the whole gas is more than or equal to 1% and less than or equal to 100%, preferably more than or equal to 4% and less than or equal to 100%, further preferably more than or equal to 10% and less than or equal to 100%. When the flow ratio of oxygen is 1% or more, more oxygen can be supplied to the insulating films or the insulating layer in contact with the insulating films so as to make an oxygen-excess state. As a result, oxygen vacancies that exist in the oxide semiconductor can be further reduced and characteristics of the transistor can be improved.
Note that the insulating layer 171 the insulating layer 170 can be replaced with each other.
Next, an insulating film 180a is formed. A resist mask is formed over the insulating film 180a, and openings are formed in the insulating film 170a and the insulating film 180a using the resist mask to form the insulating layer 170 and the insulating layer 180. Then, a conductive film 190a (not illustrated) is formed in the openings. The conductive film 190a is planarized by chemical mechanical polishing (CMP), whereby the conductive layers 190 can be formed. In addition, a conductive film 191a is formed. A resist mask is formed over the conductive film 191a and a dry etching is performed, whereby the conductive layers 191 can be formed (see FIG. 15D).
In the transistor 14 in FIGS. 14A to 14C, the oxide semiconductor has a four-layer structure of the first oxide semiconductor layer 121, the second oxide semiconductor layer 122, the third oxide semiconductor 123, and the oxide semiconductor layer 124; however, the oxide semiconductor may have a single-layer structure using a material corresponding to that of the second oxide semiconductor layer 123.
Note that this embodiment can be combined as appropriate with any of the other embodiments and examples in this specification.
Embodiment 3
<Improvement of Characteristics in Miniaturization>
High integration of a semiconductor device requires miniaturization of a transistor. However, it is known that miniaturization of a transistor causes deterioration of electrical characteristics of the transistor. A decrease in channel width causes a reduction in on-state current.
In the transistor of one embodiment of the present invention shown in FIGS. 1A to 1C, for example, as described above, the third oxide semiconductor layer 123 is formed so as to cover the oxide semiconductor layer 123 where a channel is formed and the channel formation layer and the gate insulating film are not in contact with each other. Accordingly, scattering of carriers at the interface between the channel formation layer and the gate insulating layer can be reduced and the on-state current of the transistor can be increased.
In the transistor of one embodiment of the present invention, the gate electrode layer 161 and the gate electrode layer 162 are formed to electrically surround the oxide semiconductor layer 123, which is to be a channel, in the channel width direction; accordingly, a gate electric field is applied to the oxide semiconductor layer 123 in the side surface direction in addition to the perpendicular direction. In other words, a gate electric field is applied to the oxide semiconductor layer entirely, so that current flows in the whole of the oxide semiconductor layer 123, leading to a further increase in on-state current.
In the transistor of one embodiment of the present invention, the oxide semiconductor layer 123 is formed over the oxide semiconductor layer 121 and the oxide semiconductor layer 122, so that an interface state is less likely to be formed. In addition, impurities do not enter the oxide semiconductor layer 123 from above and below because the oxide semiconductor layer 123 is positioned at the middle. Therefore, the transistor can achieve not only the increase in the on-state current of the transistor but also stabilization of the threshold voltage and a reduction in the S value (subthreshold value). Thus, Icut (current when gate voltage VG is 0 V) can be reduced and power consumption can be reduced. Further, since the threshold voltage of the transistor becomes stable, long-term reliability of the semiconductor device can be improved.
Although an example where a channel or the like is formed in the oxide semiconductor layer 120 or the like is described in this embodiment, one embodiment of the present invention is not limited thereto. For example, depending on cases or conditions, a channel, the vicinity of the channel, a source region, a drain region, or the like may be formed using a material containing silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, an organic semiconductor, or the like.
This embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.
Embodiment 4
In this embodiment, an oxide semiconductor film that can be used for a transistor of one embodiment of the present invention is described.
<Oxide Semiconductor Structure>
The structure of an oxide semiconductor is described below.
An oxide semiconductor is classified into a single crystal oxide semiconductor and a non-single-crystal oxide semiconductor. Examples of a non-single-crystal oxide semiconductor include a c-axis aligned crystalline oxide semiconductor (CAAC-OS), a polycrystalline oxide semiconductor, a nanocrystalline oxide semiconductor (nc-OS), an amorphous-like oxide semiconductor (a-like OS), and an amorphous oxide semiconductor.
From another perspective, an oxide semiconductor is classified into an amorphous oxide semiconductor and a crystalline oxide semiconductor. Examples of a crystalline oxide semiconductor include a single crystal oxide semiconductor, a CAAC-OS, a polycrystalline oxide semiconductor, and an nc-OS.
It is known that an amorphous structure is generally defined as being metastable and unfixed, and being isotropic and having no non-uniform structure. In other words, an amorphous structure has a flexible bond angle and a short-range order but does not have a long-range order.
This means that an inherently stable oxide semiconductor cannot be regarded as a completely amorphous oxide semiconductor. Moreover, an oxide semiconductor that is not isotropic (e.g., an oxide semiconductor that has a periodic structure in a microscopic region) cannot be regarded as a completely amorphous oxide semiconductor. Note that an a-like OS has a periodic structure in a microscopic region, but at the same time has a void and has an unstable structure. For this reason, an a-like OS has physical properties similar to those of an amorphous oxide semiconductor.
<CAAC-OS>
First, a CAAC-OS is described.
A CAAC-OS is one of oxide semiconductors having a plurality of c-axis aligned crystal parts (also referred to as pellets).
In a combined analysis image (also referred to as a high-resolution TEM image) of a bright-field image and a diffraction pattern of a CAAC-OS, which is obtained using a transmission electron microscope (TEM), a plurality of pellets can be observed. However, in the high-resolution TEM image, a boundary between pellets, that is, a grain boundary is not clearly observed. Thus, in the CAAC-OS, a reduction in electron mobility due to the grain boundary is less likely to occur.
The CAAC-OS observed with a TEM is described below. FIG. 16A shows a high-resolution TEM image of a cross section of the CAAC-OS layer which is observed from a direction substantially parallel to the sample surface. The high-resolution TEM image is obtained with a spherical aberration corrector function. The high-resolution TEM image obtained with a spherical aberration corrector function is particularly referred to as a Cs-corrected high-resolution TEM image. The Cs-corrected high-resolution TEM image can be obtained with, for example, an atomic resolution analytical electron microscope JEM-ARM200F manufactured by JEOL Ltd.
FIG. 16B is an enlarged Cs-corrected high-resolution TEM image of a region (1) in FIG. 16A. FIG. 16B shows that metal atoms are arranged in a layered manner in a pellet. Each metal atom layer has a configuration reflecting unevenness of a surface over which the CAAC-OS is formed (hereinafter, the surface is referred to as a formation surface) or a top surface of the CAAC-OS, and is arranged parallel to the formation surface or the top surface of the CAAC-OS.
As shown in FIG. 16B, the CAAC-OS film has a characteristic atomic arrangement. The characteristic atomic arrangement is denoted by an auxiliary line in FIG. 16C. FIGS. 16B and 16C prove that the size of a pellet is greater than or equal to 1 nm or greater than or equal to 3 nm, and the size of a space caused by tilt of the pellets is approximately 0.8 nm. Therefore, the pellet can also be referred to as a nanocrystal (nc). Furthermore, the CAAC-OS can also be referred to as an oxide semiconductor including c-axis aligned nanocrystals (CANC).
Here, according to the Cs-corrected high-resolution TEM images, the schematic arrangement of pellets 5100 of a CAAC-OS layer over a substrate 5120 is illustrated by such a structure in which bricks or blocks are stacked (see FIG. 16D). The part in which the pellets are tilted as observed in FIG. 16C corresponds to a region 5161 shown in FIG. 16D.
FIG. 17A shows a Cs-corrected high-resolution TEM image of a plane of the CAAC-OS observed from a direction substantially perpendicular to the sample surface. FIGS. 17B, 17C, and 17D are enlarged Cs-corrected high-resolution TEM images of regions (1), (2), and (3) in FIG. 17A, respectively. FIGS. 17B, 17C, and 17D indicate that metal atoms are arranged in a triangular, quadrangular, or hexagonal configuration in a pellet. However, there is no regularity of arrangement of metal atoms between different pellets.
Next, a CAAC-OS analyzed by X-ray diffraction (XRD) is described. For example, when the structure of a CAAC-OS including an InGaZnO4 crystal is analyzed by an out-of-plane method, a peak appears at a diffraction angle (2θ) of around 31° as shown in FIG. 18A. This peak is derived from the (009) plane of the InGaZnO4 crystal, which indicates that crystals in the CAAC-OS have c-axis alignment, and that the c-axes are aligned in a direction substantially perpendicular to the formation surface or the top surface of the CAAC-OS.
Note that in structural analysis of the CAAC-OS by an out-of-plane method, another peak may appear when 2θ is around 36°, in addition to the peak at 2θ of around 31°. The peak of 2θ at around 36° indicates that a crystal having no c-axis alignment is included in part of the CAAC-OS. It is preferable that in the CAAC-OS analyzed by an out-of-plane method, a peak appear when 2θ is around 31° and that a peak not appear when 2θ is around 36°.
On the other hand, in structural analysis of the CAAC-OS by an in-plane method in which an X-ray is incident on a sample in a direction substantially perpendicular to the c-axis, a peak appears when 2θ is around 56°. This peak is derived from the (110) plane of the InGaZnO4 crystal. In the case of the CAAC-OS, when analysis (φ scan) is performed with 2θ fixed at around 56° and with the sample rotated using a normal vector of the sample surface as an axis (φ axis), as shown in FIG. 18B, a peak is not clearly observed. In contrast, in the case of a single crystal oxide semiconductor of InGaZnO4, when f scan is performed with 2θ fixed at around 56°, as shown in FIG. 18C, six peaks which are derived from crystal planes equivalent to the (110) plane are observed. Accordingly, the structural analysis using XRD shows that the directions of a-axes and b-axes are irregularly oriented in the CAAC-OS.
Next, a CAAC-OS analyzed by electron diffraction is described. For example, when an electron beam with a probe diameter of 300 nm is incident on a CAAC-OS including an InGaZnO4 crystal in a direction parallel to the sample surface, a diffraction pattern (also referred to as a selected-area transmission electron diffraction pattern) shown in FIG. 19A can be obtained. In this diffraction pattern, spots derived from the (009) plane of an InGaZnO4 crystal are included. Thus, the electron diffraction also indicates that pellets included in the CAAC-OS have c-axis alignment and that the c-axes are aligned in a direction substantially perpendicular to the formation surface or the top surface of the CAAC-OS. Meanwhile, FIG. 19B shows a diffraction pattern obtained in such a manner that an electron beam with a probe diameter of 300 nm is incident on the same sample in a direction perpendicular to the sample surface. As shown in FIG. 19B, a ring-like diffraction pattern is observed. Thus, the electron diffraction also indicates that the a-axes and b-axes of the pellets included in the CAAC-OS do not have regular alignment. The first ring in FIG. 19B is considered to be derived from the (010) plane, the (100) plane, and the like of the InGaZnO4 crystal. Furthermore, it is supposed that the second ring in FIG. 19B is derived from the (110) plane and the like.
As described above, the CAAC-OS is an oxide semiconductor with high crystallinity. Entry of impurities, formation of defects, or the like might decrease the crystallinity of an oxide semiconductor. This means that the CAAC-OS has small amounts of impurities and defects (e.g., oxygen vacancies).
Note that the impurity means an element other than the main components of the oxide semiconductor, such as hydrogen, carbon, silicon, or a transition metal element. For example, an element (specifically, silicon or the like) having higher strength of bonding to oxygen than a metal element included in an oxide semiconductor extracts oxygen from the oxide semiconductor, which results in disorder of the atomic arrangement and reduced crystallinity of the oxide semiconductor. A heavy metal such as iron or nickel, argon, carbon dioxide, or the like has a large atomic radius (or molecular radius), and thus disturbs the atomic arrangement of the oxide semiconductor and decreases crystallinity.
The characteristics of an oxide semiconductor having impurities or defects might be changed by light, heat, or the like. Impurities included in the oxide semiconductor might serve as carrier traps or carrier generation sources, for example. Furthermore, oxygen vacancy in the oxide semiconductor serves as a carrier trap or serves as a carrier generation source when hydrogen is captured therein.
The CAAC-OS having small amounts of impurities and oxygen vacancy is an oxide semiconductor film with low carrier density (specifically, lower than 8×1011/cm3, preferably lower than 1×1011/cm3, further preferably lower than 1×1010/cm3, and is higher than or equal to 1×10−9/cm3). Such an oxide semiconductor is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. A CAAC-OS has a low impurity concentration and a low density of defect states. Thus, the CAAC-OS can be referred to as an oxide semiconductor having stable characteristics.
<nc-OS>
Next, an nc-OS is described.
An nc-OS has a region in which a crystal part is observed and a region in which a crystal part is not clearly observed in a high-resolution TEM image. In most cases, the size of a crystal part included in the nc-OS is greater than or equal to 1 nm and less than or equal to 10 nm, or greater than or equal to 1 nm and less than or equal to 3 nm. Note that an oxide semiconductor including a crystal part whose size is greater than 10 nm and less than or equal to 100 nm is sometimes referred to as a microcrystalline oxide semiconductor. In a high-resolution TEM image of the nc-OS, for example, a grain boundary is not clearly observed in some cases. Note that there is a possibility that the origin of the nanocrystal is the same as that of a pellet in a CAAC-OS. Therefore, a crystal part of the nc-OS may be referred to as a pellet in the following description.
In the nc-OS, a microscopic region (for example, a region with a size greater than or equal to 1 nm and less than or equal to 10 nm, in particular, a region with a size greater than or equal to 1 nm and less than or equal to 3 nm) has a periodic atomic arrangement. There is no regularity of crystal orientation between different pellets in the nc-OS. Thus, the orientation of the whole film is not observed. Accordingly, the nc-OS cannot be distinguished from an a-like OS and an amorphous oxide semiconductor, depending on an analysis method. For example, when the nc-OS is analyzed by an out-of-plane method using an X-ray beam having a diameter larger than the size of a pellet, a peak which shows a crystal plane does not appear. Furthermore, a diffraction pattern like a halo pattern is observed when the nc-OS is subjected to electron diffraction using an electron beam with a probe diameter (e.g., 50 nm or larger) that is larger than the size of a pellet. Meanwhile, spots appear in a nanobeam electron diffraction pattern of the nc-OS when an electron beam having a probe diameter close to or smaller than the size of a pellet is applied. Moreover, in a nanobeam electron diffraction pattern of the nc-OS, regions with high luminance in a circular (ring) pattern are shown in some cases. Also in a nanobeam electron diffraction pattern of the nc-OS layer, a plurality of spots is shown in a ring-like region in some cases.
Since there is no regularity of crystal orientation between the pellets (nanocrystals) as mentioned above, the nc-OS can also be referred to as an oxide semiconductor including random aligned nanocrystals (RANC) or an oxide semiconductor including non-aligned nanocrystals (NANC).
The nc-OS is an oxide semiconductor that has high regularity as compared to an amorphous oxide semiconductor. Therefore, the nc-OS is likely to have a lower density of defect states than an a-like OS and an amorphous oxide semiconductor. Note that there is no regularity of crystal orientation between different pellets in the nc-OS. Therefore, the nc-OS has a higher density of defect states than the CAAC-OS.
<a-Like OS>
An a-like OS is an oxide semiconductor having a structure between the nc-OS and the amorphous oxide semiconductor.
In a high-resolution TEM image of the a-like OS, a void may be observed. Furthermore, in the high-resolution TEM image, there are a region where a crystal part is clearly observed and a region where a crystal part is not observed.
The a-like OS has an unstable structure because it includes a void. To verify that an a-like OS has an unstable structure as compared with a CAAC-OS and an nc-OS, a change in structure caused by electron irradiation is described below.
An a-like OS (sample A), an nc-OS (sample B), and a CAAC-OS (sample C) are prepared as samples subjected to electron irradiation. Each of the samples is an In—Ga—Zn oxide.
First, a high-resolution cross-sectional TEM image of each sample is obtained. The high-resolution cross-sectional TEM images show that all the samples have crystal parts.
Note that which part is regarded as a crystal part is determined as follows. It is known that a unit cell of the InGaZnO4 crystal has a structure in which nine layers including three In—O layers and six Ga—Zn—O layers are stacked in the c-axis direction. The distance between the adjacent layers is equivalent to the lattice spacing on the (009) plane (also referred to as d value). The value is calculated to be 0.29 nm from crystal structural analysis. Accordingly, a portion where the lattice spacing between lattice fringes is greater than or equal to 0.28 nm and less than or equal to 0.30 nm is regarded as a crystal part of InGaZnO4. Each of lattice fringes corresponds to the a-b plane of the InGaZnO4 crystal.
FIG. 20 shows change in the average size of crystal parts (at 22 points to 45 points) in each sample. Note that the crystal part size corresponds to the length of a lattice fringe. FIG. 20 indicates that the crystal part size in the a-like OS increases with an increase in the cumulative electron dose. Specifically, as shown by (1) in FIG. 20, a crystal part of approximately 1.2 nm at the start of TEM observation (the crystal part is also referred to as an initial nucleus) grows to a size of approximately 2.6 nm at a cumulative electron dose of 4.2×108 e−/nm2. In contrast, the crystal part size in the nc-OS and the CAAC-OS shows little change from the start of electron irradiation to a cumulative electron dose of 4.2×108 e−/nm2. Specifically, as shown by (2) and (3) in FIG. 20, the average crystal sizes in an nc-OS and a CAAC-OS are approximately 1.4 nm and approximately 2.1 nm, respectively, regardless of the cumulative electron dose.
In this manner, growth of the crystal part in the a-like OS is induced by electron irradiation. In contrast, in the nc-OS and the CAAC-OS, growth of the crystal part is hardly induced by electron irradiation. Therefore, the a-like OS has an unstable structure as compared with the nc-OS and the CAAC-OS.
The a-like OS has a lower density than the nc-OS and the CAAC-OS because it includes a void. Specifically, the density of the a-like OS is higher than or equal to 78.6% and lower than 92.3% of the density of the single crystal oxide semiconductor having the same composition. The density of each of the nc-OS and the CAAC-OS is higher than or equal to 92.3% and lower than 100% of the density of the single crystal oxide semiconductor having the same composition. Note that it is difficult to deposit an oxide semiconductor having a density of lower than 78% of the density of the single crystal oxide semiconductor.
For example, in the case of an oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, the density of single crystal InGaZnO4 with a rhombohedral crystal structure is 6.357 g/cm3. Accordingly, in the case of the oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, the density of the a-like OS is higher than or equal to 5.0 g/cm3 and lower than 5.9 g/cm3. For example, in the case of the oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, the density of each of the nc-OS and the CAAC-OS is higher than or equal to 5.9 g/cm3 and lower than 6.3 g/cm3.
Note that there is a possibility that an oxide semiconductor having a certain composition cannot exist in a single crystal structure. In that case, single crystal oxide semiconductors with different compositions are combined at an adequate ratio, which makes it possible to calculate density equivalent to that of a single crystal oxide semiconductor with the desired composition. The density of a single crystal oxide semiconductor having the desired composition can be calculated using a weighted average according to the combination ratio of the single crystal oxide semiconductors with different compositions. Note that it is preferable to use as few kinds of single crystal oxide semiconductors as possible to calculate the density.
As described above, oxide semiconductors have various structures and various properties. Note that an oxide semiconductor may be a stacked layer including two or more of an amorphous oxide semiconductor, an a-like OS, an nc-OS, and a CAAC-OS, for example. This embodiment can be combined with any of the other embodiments in this specification as appropriate.
Embodiment 5
In this embodiment, an example of a circuit including the transistor of one embodiment of the present invention is described with reference to drawings.
<Cross-Sectional Structure>
FIG. 21A is a cross-sectional view of a semiconductor device of one embodiment of the present invention. In FIG. 21A, X1-X2 direction and Y1-Y2 direction represents a channel length direction and a channel width direction, respectively. The semiconductor device illustrated in FIG. 21A includes a transistor 2200 containing a first semiconductor material in a lower portion and a transistor 2100 containing a second semiconductor material in an upper portion. In FIG. 21A, an example is described in which the transistor described in the above embodiment as an example is used as the transistor 2100 containing the second semiconductor material. A cross-sectional view of the transistors in a channel length direction is on the left side of a dashed-dotted line, and a cross-sectional view of the transistors in a channel width direction is on the right side of the dashed-dotted line.
Here, the first semiconductor material and the second semiconductor material are preferably materials having different band gaps. For example, the first semiconductor material can be a semiconductor material other than an oxide semiconductor (examples of such a semiconductor material include silicon (including strained silicon), germanium, silicon germanium, silicon carbide, gallium arsenide, aluminum gallium arsenide, indium phosphide, gallium nitride, and an organic semiconductor), and the second semiconductor material can be an oxide semiconductor. A transistor using a material other than an oxide semiconductor, such as single crystal silicon, can operate at high speed easily. In contrast, a transistor using an oxide semiconductor and described in the above embodiment as an example has excellent subthreshold characteristics and a minute structure. Furthermore, the transistor can operate at a high speed because of its high switching speed and has low leakage current because of its low off-state current.
The transistor 2200 may be either an n-channel transistor or a p-channel transistor, and an appropriate transistor may be used in accordance with a circuit. Furthermore, the specific structure of the semiconductor device, such as the material or the structure used for the semiconductor device, is not necessarily limited to those described here except for the use of the transistor of one embodiment of the present invention which uses an oxide semiconductor.
FIG. 21A illustrates a structure in which the transistor 2100 is provided over the transistor 2200 with an insulator 2201 and an insulator 2207 provided therebetween. A plurality of wirings 2202 are provided between the transistor 2200 and the transistor 2100. Furthermore, wirings and electrodes provided over and under the insulators are electrically connected to each other through a plurality of plugs 2203 embedded in the insulators. An insulator 2204 covering the transistor 2100 and a wiring 2205 over the insulator 2204 are provided.
The stack of the two kinds of transistors reduces the area occupied by the circuit, allowing a plurality of circuits to be highly integrated.
Here, in the case where a silicon-based semiconductor material is used for the transistor 2200 provided in a lower portion, hydrogen in an insulator provided in the vicinity of the semiconductor film of the transistor 2200 terminates dangling bonds of silicon; accordingly, the reliability of the transistor 2200 can be improved. Meanwhile, in the case where an oxide semiconductor is used for the transistor 2100 provided in an upper portion, hydrogen in an insulator provided in the vicinity of the semiconductor film of the transistor 2100 becomes a factor of generating carriers in the oxide semiconductor; thus, the reliability of the transistor 2100 might be decreased. Therefore, in the case where the transistor 2100 using an oxide semiconductor is provided over the transistor 2200 using a silicon-based semiconductor material, it is particularly effective that the insulator 2207 having a function of preventing diffusion of hydrogen is provided between the transistors 2100 and 2200. The insulator 2207 makes hydrogen remain in the lower portion, thereby improving the reliability of the transistor 2200. In addition, since the insulator 2207 suppresses diffusion of hydrogen from the lower portion to the upper portion, the reliability of the transistor 2100 can also be improved.
The insulator 2207 can be, for example, formed using aluminum oxide, aluminum oxynitride, gallium oxide, gallium oxynitride, yttrium oxide, yttrium oxynitride, hafnium oxide, hafnium oxynitride, or yttria-stabilized zirconia (YSZ).
Furthermore, a blocking film 2208 (corresponding to the insulating layer 180) having a function of preventing diffusion of hydrogen is preferably formed over the transistor 2100 to cover the transistor 2100 including an oxide semiconductor film. For the blocking film 2208, a material that is similar to that of the insulator 2207 can be used, and in particular, an aluminum oxide film is preferably used. The aluminum oxide film has a high shielding (blocking) effect of preventing penetration of both oxygen and impurities such as hydrogen and moisture. Thus, by using the aluminum oxide film as the blocking film 2208 covering the transistor 2100, release of oxygen from the oxide semiconductor film included in the transistor 2100 can be prevented and entry of water and hydrogen into the oxide semiconductor film can be prevented.
Note that the transistor 2200 can be a transistor of various types without being limited to a planar type transistor. For example, the transistor 2200 can be a fin-type transistor, a tri-gate transistor, or the like. An example of a cross-sectional view in this case is shown in FIG. 21D. An insulator 2212 is provided over a semiconductor substrate 2211. The semiconductor substrate 2211 includes a projecting portion with a thin tip (also referred to a fin). Note that an insulator may be provided over the projecting portion. The insulator functions as a mask for preventing the semiconductor substrate 2211 from being etched when the projecting portion is formed. The projecting portion does not necessarily have the thin tip; a projecting portion with a cuboid-like projecting portion and a projecting portion with a thick tip are permitted, for example. A gate insulator 2214 is provided over the projecting portion of the semiconductor substrate 2211, and a gate electrode 2213 is provided over the gate insulator 2214. Source and drain regions 2215 are formed in the semiconductor substrate 2211. Note that here is shown an example in which the semiconductor substrate 2211 includes the projecting portion; however, a semiconductor device of one embodiment of the present invention is not limited thereto. For example, a semiconductor region having a projecting portion may be formed by processing an SOI substrate.
<Circuit Configuration Example>
In the above structure, electrodes of the transistor 2100 and the transistor 2200 can be connected in a variety of ways; thus, a variety of circuits can be formed. Examples of circuit configurations which can be achieved by using a semiconductor device of one embodiment of the present invention are shown below.
<CMOS Inverter Circuit>
A circuit diagram in FIG. 21B shows a configuration of a CMOS inverter in which the p-channel transistor 2200 and the n-channel transistor 2100 are connected to each other in series and in which gates of them are connected to each other.
<CMOS Analog Switch>
A circuit diagram in FIG. 21C shows a configuration in which sources of the transistors 2100 and 2200 are connected to each other and drains of the transistors 2100 and 2200 are connected to each other. In FIG. 21A, X1-X2 direction and Y1-Y2 direction represents a channel length direction and a channel width direction, respectively. With such a configuration, the transistors can function as a CMOS analog switch.
<Memory Device Example>
An example of a semiconductor device (memory device) which includes the transistor of one embodiment of the present invention, which can retain stored data even when not powered, and which has an unlimited number of write cycles is shown in FIGS. 22A to 22C.
The semiconductor device illustrated in FIG. 22A includes a transistor 3200 using a first semiconductor material, a transistor 3300 using a second semiconductor material, and a capacitor 3400. Note that any of the transistors in Embodiment 1 to 3 can be used as the transistor 3300.
FIG. 22B is a cross-sectional view of the semiconductor device illustrated in FIG. 22A. The semiconductor device in the cross-sectional view has a structure in which the transistor 3300 is provided with a back gate; however, a structure without a back gate may be employed.
The transistor 3300 is a transistor in which a channel is formed in a semiconductor layer including an oxide semiconductor. Since the off-state current of the transistor 3300 is low, stored data can be retained for a long period. In other words, power consumption can be sufficiently reduced because a semiconductor memory device in which refresh operation is unnecessary or the frequency of refresh operation is extremely low can be provided.
In FIG. 22A, a first wiring 3001 is electrically connected to a source electrode of the transistor 3200. A second wiring 3002 is electrically connected to a drain electrode of the transistor 3200. A third wiring 3003 is electrically connected to one of a source electrode and a drain electrode of the transistor 3300. A fourth wiring 3004 is electrically connected to a gate electrode of the transistor 3300. A gate electrode of the transistor 3200 is electrically connected to the other of the source electrode and the drain electrode of the transistor 3300 and one electrode of the capacitor 3400. A fifth wiring 3005 is electrically connected to the other electrode of the capacitor 3400.
The semiconductor device in FIG. 22A has a feature that the potential of the gate electrode of the transistor 3200 can be retained, and thus enables writing, retaining, and reading of data as follows.
Writing and retaining of data are described. First, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned on, so that the transistor 3300 is turned on. Accordingly, the potential of the third wiring 3003 is supplied to the gate electrode of the transistor 3200 and the capacitor 3400. That is, a predetermined charge is supplied to the gate electrode of the transistor 3200 (writing). Here, one of two kinds of charges providing different potential levels (hereinafter referred to as a low-level charge and a high-level charge) is supplied. After that, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned off, so that the transistor 3300 is turned off. Thus, the charge supplied to the gate electrode of the transistor 3200 is held (retaining).
Since the off-state current of the transistor 3300 is extremely low, the charge of the gate of the transistor 3200 is retained for a long time.
Next, reading of data is described. An appropriate potential (a reading potential) is supplied to the fifth wiring 3005 while a predetermined potential (a constant potential) is supplied to the first wiring 3001, whereby the potential of the second wiring 3002 varies depending on the amount of charge retained in the gate of the transistor 3200. This is because in the case of using an n-channel transistor as the transistor 3200, an apparent threshold voltage Vth_H at the time when the high-level charge is given to the gate electrode of the transistor 3200 is lower than an apparent threshold voltage Vth_L at the time when the low-level charge is given to the gate electrode of the transistor 3200. Here, an apparent threshold voltage refers to the potential of the fifth wiring 3005 which is needed to turn on the transistor 3200. Thus, the potential of the fifth wiring 3005 is set to a potential V0 which is between Vth_H and Vth_L, whereby charge supplied to the gate of the transistor 3200 can be determined. For example, in the case where the high-level charge is supplied to the gate electrode of the transistor 3200 in writing and the potential of the fifth wiring 3005 is V0 (>Vth_H), the transistor 3200 is turned on. In the case where the low-level charge is supplied to the gate electrode of the transistor 3200 in writing, even when the potential of the fifth wiring 3005 is V0 (<Vth_L), the transistor 3200 remains off. Thus, the data retained in the gate electrode of the transistor 3200 can be read by determining the potential of the second wiring 3002.
Note that in the case where memory cells are arrayed to be used, it is necessary that only data of a desired memory cell be able to be read. In the case where such reading is not performed, the fifth wiring 3005 may be supplied with a potential at which the transistor 3200 is turned off regardless of the state of the gate, that is, a potential lower than Vth_H. Alternatively, the fifth wiring 3005 may be supplied with a potential at which the transistor 3200 is turned on regardless of the state of the gate, that is, a potential higher than Vth_L.
The semiconductor device illustrated in FIG. 22C is different from the semiconductor device illustrated in FIG. 22A in that the transistor 3200 is not provided. Also in this case, writing and retaining operation of data can be performed in a manner similar to the semiconductor device illustrated in FIG. 22A.
Next, reading of data is described. When the transistor 3300 is turned on, the third wiring 3003 which is in a floating state and the capacitor 3400 are electrically connected to each other, and the charge is redistributed between the third wiring 3003 and the capacitor 3400. As a result, the potential of the third wiring 3003 is changed. The amount of change in the potential of the third wiring 3003 varies depending on the potential of a first terminal of the capacitor 3400 (or the charge accumulated in the capacitor 3400).
For example, the potential of the third wiring 3003 after the charge redistribution is (CB×VB0+C×V)/(CB+C), where V is the potential of the first terminal of the capacitor 3400, C is the capacitance of the capacitor 3400, CB is the capacitance component of the third wiring 3003, and VB0 is the potential of the third wiring 3003 before the charge redistribution. Thus, it can be found that, assuming that the memory cell is in either of two states in which the potential of the first terminal of the capacitor 3400 is V1 and V0 (V1>V0), the potential of the third wiring 3003 in the case of retaining the potential V1 (=(CB×VB0+C×V1)/(CB+C)) is higher than the potential of the third wiring 3003 in the case of retaining the potential V0 (=(CB×VB0+C×V0)/(CB+C)).
Then, by comparing the potential of the third wiring 3003 with a predetermined potential, data can be read.
In this case, a transistor including the first semiconductor material may be used for a driver circuit for driving a memory cell, and a transistor including the second semiconductor material may be stacked over the driver circuit as the transistor 3300.
When including a transistor in which a channel formation region is formed using an oxide semiconductor and which has an extremely low off-state current, the semiconductor device described in this embodiment can retain stored data for an extremely long time. In other words, refresh operation becomes unnecessary or the frequency of the refresh operation can be extremely low, which leads to a sufficient reduction in power consumption. Moreover, stored data can be retained for a long time even when power is not supplied (note that a potential is preferably fixed).
Further, in the semiconductor device described in this embodiment, high voltage is not needed for writing data and there is no problem of deterioration of elements. Unlike in a conventional nonvolatile memory, for example, it is not necessary to inject and extract electrons into and from a floating gate; thus, a problem such as deterioration of a gate insulating film hardly occurs. That is, the semiconductor device of the disclosed invention does not have a limit on the number of times data can be rewritten, which is a problem of a conventional nonvolatile memory, and the reliability thereof is drastically improved. Furthermore, data is written depending on the state of the transistor (on or off), whereby high-speed operation can be easily achieved.
Note that in this specification and the like, it might be possible for those skilled in the art to constitute one embodiment of the invention even when portions to which all the terminals of an active element (e.g., a transistor or a diode), a passive element (e.g., a capacitor or a resistor), or the like are connected are not specified. In other words, one embodiment of the invention can be clear even when connection portions are not specified. Further, in the case where a connection portion is disclosed in this specification and the like, it can be determined that one embodiment of the invention in which a connection portion is not specified is disclosed in this specification and the like, in some cases. In particular, in the case where the number of portions to which the terminal is connected might be plural, it is not necessary to specify the portions to which the terminal is connected. Therefore, it might be possible to constitute one embodiment of the invention by specifying only portions to which some of terminals of an active element (e.g., a transistor or a diode), a passive element (e.g., a capacitor or a resistor), or the like are connected.
Note that in this specification and the like, it might be possible for those skilled in the art to specify the invention when at least the connection portion of a circuit is specified. Alternatively, it might be possible for those skilled in the art to specify the invention when at least a function of a circuit is specified. In other words, when a function of a circuit is specified, one embodiment of the invention can be clear. Furthermore, it can be determined that one embodiment of the invention whose function is specified is disclosed in this specification and the like. Therefore, when a connection portion of a circuit is specified, the circuit is disclosed as one embodiment of the invention even when a function is not specified, and one embodiment of the invention can be constituted. Alternatively, when a function of a circuit is specified, the circuit is disclosed as one embodiment of the invention even when a connection portion is not specified, and one embodiment of the invention can be constituted.
Note that in this specification and the like, in a diagram or a text described in one embodiment, it is possible to take out part of the diagram or the text and constitute an embodiment of the invention. Thus, in the case where a diagram or a text related to a certain portion is described, the context taken out from part of the diagram or the text is also disclosed as one embodiment of the invention, and one embodiment of the invention can be constituted. Therefore, for example, in a diagram or text in which one or more active elements (e.g., transistors or diodes), wirings, passive elements (e.g., capacitors or resistors), conductive layers, insulating layers, semiconductor layers, organic materials, inorganic materials, components, devices, operating methods, manufacturing methods, or the like are described, part of the diagram or the text is taken out, and one embodiment of the invention can be constituted. For example, from a circuit diagram in which N circuit elements (e.g., transistors or capacitors; N is an integer) are provided, it is possible to constitute one embodiment of the invention by taking out M circuit elements (e.g., transistors or capacitors; M is an integer, where M<N). As another example, it is possible to constitute one embodiment of the invention by taking out M layers (M is an integer, where M<N) from a cross-sectional view in which N layers (N is an integer) are provided. As another example, it is possible to constitute one embodiment of the invention by taking out M elements (M is an integer, where M<N) from a flow chart in which N elements (N is an integer) are provided.
<Imaging Device>
An imaging device of one embodiment of the present invention is described below.
FIG. 23A is a plan view illustrating an example of an imaging device 200 of one embodiment of the present invention. The imaging device 200 includes a pixel portion 210 and peripheral circuits for driving the pixel portion 210 (a peripheral circuit 260, a peripheral circuit 270, a peripheral circuit 280, and a peripheral circuit 290). The pixel portion 210 includes a plurality of pixels 211 arranged in a matrix with p rows and q columns (p and q are each a natural number greater than or equal to 2). The peripheral circuit 260, the peripheral circuit 270, the peripheral circuit 280, and the peripheral circuit 290 are each connected to a plurality of pixels 211, and a signal for driving the plurality of pixels 211 is supplied. In this specification and the like, in some cases, “a peripheral circuit” or “a driver circuit” indicates all of the peripheral circuits 260, 270, 280, and 290. For example, the peripheral circuit 260 can be regarded as part of the peripheral circuit.
The imaging device 200 preferably includes a light source 291. The light source 291 can emit detection light P1.
The peripheral circuit includes at least one of a logic circuit, a switch, a buffer, an amplifier circuit, and a converter circuit. The peripheral circuit may be provided over a substrate where the pixel portion 210 is formed. Part or the whole of the peripheral circuit may be mounted using a semiconductor device such as an IC. Note that as the peripheral circuit, one or more of the peripheral circuits 260, 270, 280, and 290 may be omitted.
As illustrated in FIG. 23B, the pixels 211 may be provided to be inclined in the pixel portion 210 included in the imaging device 200. When the pixels 211 are obliquely arranged, the distance between pixels (pitch) can be shortened in the row direction and the column direction. Accordingly, the quality of an image taken with the imaging device 200 can be improved.
<Configuration Example 1 of Pixel>
The pixel 211 included in the imaging device 200 is formed with a plurality of subpixels 212, and each subpixel 212 is combined with a filter which transmits light with a specific wavelength band (color filter), whereby data for achieving color image display can be obtained.
FIG. 24A is a plan view showing an example of the pixel 211 with which a color image is obtained. The pixel 211 illustrated in FIG. 24A includes a subpixel 212 provided with a color filter transmitting light with a red (R) wavelength band (also referred to as a subpixel 212R), a subpixel 212 provided with a color filter transmitting light with a green (G) wavelength band (also referred to as a subpixel 212G), and a subpixel 212 provided with a color filter transmitting light with a blue (B) wavelength band (also referred to as a subpixel 212B). The subpixel 212 can function as a photosensor.
The subpixel 212 (the subpixel 212R, the subpixel 212G, and the subpixel 212B) is electrically connected to a wiring 231, a wiring 247, a wiring 248, a wiring 249, and a wiring 250. In addition, the subpixel 212R, the subpixel 212G, and the subpixel 212B are connected to respective wirings 253 which are independent from one another. In this specification and the like, for example, the wiring 248 and the wiring 249 that are connected to the pixel 211 in the n-th row (n is an integer greater than or equal to 1 and less than or equal to p) are referred to as a wiring 248[n] and a wiring 249[n]. For example, the wiring 253 connected to the pixel 211 in the m-th column (in is an integer greater than or equal to 1 and less than or equal to q) is referred to as a wiring 253[m]. Note that in FIG. 24A, the wirings 253 connected to the subpixel 212R, the subpixel 212G, and the subpixel 212B in the pixel 211 in the m-th column are referred to as a wiring 253[m]R, a wiring 253[m]G, and a wiring 253[m]B. The subpixels 212 are electrically connected to the peripheral circuit through the above wirings.
The imaging device 200 has a structure in which the subpixel 212 is electrically connected to the subpixel 212 in an adjacent pixel 211 which is provided with a color filter transmitting light with the same wavelength band as the subpixel 212, via a switch. FIG. 24B shows a connection example of the subpixels 212: the subpixel 212 in the pixel 211 arranged in an n-th row and an m-th column and the subpixel 212 in the adjacent pixel 211 arranged in an (n+1)-th row and the m-th column. In FIG. 24B, the subpixel 212R arranged in the n-th row and the m-th column and the subpixel 212R arranged in the (n+1)-th row and the m-th column are connected to each other via a switch 201. The subpixel 212G arranged in the n-th row and the m-th column and the subpixel 212G arranged in the (n+1)-th row and the m-th column are connected to each other via a switch 202. The subpixel 212B arranged in the n-th row and the m-th column and the subpixel 212B arranged in the (n+1)-th row and the m-th column are connected to each other via a switch 203.
The color filter used in the subpixel 212 is not limited to red (R), green (G), and blue (B) color filters, and color filters that transmit light of cyan (C), yellow (Y), and magenta (M) may be used. By provision of the subpixels 212 that sense light with three different wavelength bands in one pixel 211, a full-color image can be obtained.
The pixel 211 including the subpixel 212 provided with a color filter transmitting yellow (Y) light may be provided, in addition to the subpixels 212 provided with the color filters transmitting red (R), green (G), and blue (B) light. The pixel 211 including the subpixel 212 provided with a color filter transmitting blue (B) light may be provided, in addition to the subpixels 212 provided with the color filters transmitting cyan (C), yellow (Y), and magenta (M) light. When the subpixels 212 sensing light with four different wavelength bands are provided in one pixel 211, the reproducibility of colors of an obtained image can be increased.
For example, in FIG. 24A, in regard to the subpixel 212 sensing a red wavelength band, the subpixel 212 sensing a green wavelength band, and the subpixel 212 sensing a blue wavelength band, the pixel number ratio (or the light receiving area ratio) thereof is not necessarily 1:1:1. For example, the Bayer arrangement in which the pixel number ratio (the light receiving area ratio) is set at red:green:blue=1:2:1 may be employed. Alternatively, the pixel number ratio (the light receiving area ratio) of red and green to blue may be 1:6:1.
Although the number of subpixels 212 provided in the pixel 211 may be one, two or more subpixels are preferably provided. For example, when two or more subpixels 212 sensing the same wavelength band are provided, the redundancy is increased, and the reliability of the imaging device 200 can be increased.
When an infrared (IR) filter that transmits infrared light and absorbs or reflects visible light is used as the filter, the imaging device 200 that senses infrared light can be achieved.
Furthermore, when a neutral density (ND) filter (dark filter) is used, output saturation which occurs when a large amount of light enters a photoelectric conversion element (light-receiving element) can be prevented. With a combination of ND filters with different dimming capabilities, the dynamic range of the imaging device can be increased.
Besides the above-described filter, the pixel 211 may be provided with a lens. An arrangement example of the pixel 211, a filter 254, and a lens 255 is described with cross-sectional views in FIGS. 25A and 25B. With the lens 255, the photoelectric conversion element can receive incident light efficiently. Specifically, as illustrated in FIG. 25A, light 256 enters a photoelectric conversion element 220 through the lens 255, the filter 254 (a filter 254R, a filter 254G, and a filter 254B), a pixel circuit 230, and the like which are provided in the pixel 211.
However, as indicated by a region surrounded with dashed-dotted lines, part of the light 256 indicated by arrows might be blocked by some wirings 257. Thus, a preferable structure is that the lens 255 and the filter 254 are provided on the photoelectric conversion element 220 side, so that the photoelectric conversion element 220 can efficiently receive the light 256 as illustrated in FIG. 25B. When the light 256 enters the photoelectric conversion element 220 from the photoelectric conversion element 220 side, the imaging device 200 with high sensitivity can be provided.
As the photoelectric conversion element 220 illustrated in FIGS. 25A and 25B, a photoelectric conversion element in which a p-n junction or a p-i-n junction is formed may be used.
The photoelectric conversion element 220 may be formed using a substance that has a function of absorbing a radiation and generating electric charges. Examples of the substance that has a function of absorbing a radiation and generating electric charges include selenium, lead iodide, mercury iodide, gallium arsenide, cadmium telluride, and cadmium zinc alloy.
For example, when selenium is used for the photoelectric conversion element 220, the photoelectric conversion element 220 can have a light absorption coefficient in a wide wavelength range, such as visible light, ultraviolet light, infrared light, X-rays, and gamma rays.
One pixel 211 included in the imaging device 200 may include the subpixel 212 with a first filter in addition to the subpixel 212 illustrated in FIGS. 24A and 24B.
<Configuration Example 2 of Pixel>
An example of a pixel including a transistor using silicon and a transistor using an oxide semiconductor is described below.
FIGS. 26A and 26B are each a cross-sectional view of an element included in an imaging device.
The imaging device illustrated in FIG. 26A includes a transistor 351 including silicon over a silicon substrate 300, transistors 352 and 353 which include an oxide semiconductor and are stacked over the transistor 351, and a photodiode 360 provided in a silicon substrate 300 and including an anode 361 and a cathode 362. The transistors and the photodiode 360 are electrically connected to various plugs 370 and wirings 371. In addition, an anode 361 of the photodiode 360 is electrically connected to the plug 370 through a low-resistance region 363.
The imaging device includes a layer 310 including the transistor 351 provided on the silicon substrate 300 and the photodiode 360 provided in the silicon substrate 300, a layer 320 which is in contact with the layer 310 and includes the wirings 371, a layer 330 which is in contact with the layer 320 and includes the transistors 352 and 353, and a layer 340 which is in contact with the layer 330 and includes a wiring 372 and a wiring 373.
Note that in the example of cross-sectional view in FIG. 26A, a light-receiving surface of the photodiode 360 is provided on the side opposite to a surface of the silicon substrate 300 where the transistor 351 is formed. With the structure, an optical path can be obtained without the influence by the transistors or wirings, and therefore, a pixel with a high aperture ratio can be formed. Thus, a pixel with a high aperture ratio can be formed. Note that the light-receiving surface of the photodiode 360 can be the same as the surface where the transistor 351 is formed.
In the case of forming a pixel with use of transistors, the layer 310 may include the transistor. Alternatively, the layer 310 may be omitted, and the pixel may include only transistors.
In addition, in the cross-sectional view in FIG. 26A, the photodiode 360 in the layer 310 and the transistor in the layer 330 can be formed so as to overlap with each other. Thus, the degree of integration of pixels can be increased. In other words, the resolution of the imaging device can be increased.
An imaging device shown in FIG. 26B includes a photodiode 365 in the layer 340 and over the transistor. In FIG. 26B, the layer 310 includes the transistor 351 and a transistor 352 using silicon, the layer 320 includes the wiring 371, the layer 330 includes the transistor 352 and the transistor 353 using an oxide semiconductor layer, the layer 340 includes the photodiode 365. The photodiode 365 includes a semiconductor layer 365, a semiconductor layer 366, a semiconductor layer 367, and a semiconductor layer 368, and is electrically connected to the wiring 373 and a wiring 374 through the plug 370.
The element structure shown in FIG. 26B can increase the aperture ratio.
Alternatively, a PIN diode element formed using an amorphous silicon film, a microcrystalline silicon film, or the like may be used as the photodiode 365. In the photodiode 365, an n-type semiconductor layer 368, an i-type semiconductor layer 367, and a p-type semiconductor layer 366 are stacked in this order. The i-type semiconductor layer 367 is preferably formed using amorphous silicon. The p-type semiconductor layer 366 and the n-type semiconductor layer 368 can each be formed using amorphous silicon, microcrystalline silicon, or the like which includes a dopant imparting the corresponding conductivity type. A photodiode in which the photodiode 365 is formed using amorphous silicon has high sensitivity in a visible light wavelength region, and therefore can easily sense weak visible light.
This embodiment can be combined as appropriate with any of the other embodiments and examples in this specification.
Embodiment 6
<RF Tag>
In this embodiment, an RF tag that includes the transistor described in the above embodiments or the memory device described in the above embodiment is described with reference to FIG. 27.
The RF tag of this embodiment includes a memory circuit, stores necessary data in the memory circuit, and transmits and receives data to/from the outside by using contactless means, for example, wireless communication. With these features, the RF tag can be used for an individual authentication system in which an object or the like is recognized by reading the individual information, for example. Note that the RF tag is required to have extremely high reliability in order to be used for this purpose.
A configuration of the RF tag will be described with reference to FIG. 27. FIG. 27 is a block diagram illustrating a configuration example of an RF tag.
As shown in FIG. 27, an RF tag 800 includes an antenna 804 which receives a radio signal 803 that is transmitted from an antenna 802 connected to a communication device 801 (also referred to as an interrogator, a reader/writer, or the like). The RF tag 800 includes a rectifier circuit 805, a constant voltage circuit 806, a demodulation circuit 807, a modulation circuit 808, a logic circuit 809, a memory circuit 810, and a ROM 811. A transistor having a rectifying function included in the demodulation circuit 807 may be formed using a material which enables a reverse current to be low enough, for example, an oxide semiconductor. This can suppress the phenomenon of a rectifying function becoming weaker due to generation of a reverse current and prevent saturation of the output from the demodulation circuit. In other words, the input to the demodulation circuit and the output from the demodulation circuit can have a relation closer to a linear relation. Note that data transmission methods are roughly classified into the following three methods: an electromagnetic coupling method in which a pair of coils is provided so as to face each other and communicates with each other by mutual induction, an electromagnetic induction method in which communication is performed using an induction field, and a radio wave method in which communication is performed using a radio wave. Any of these methods can be used in the RF tag 800 described in this embodiment.
Next, the structure of each circuit will be described. The antenna 804 exchanges the radio signal 803 with the antenna 802 which is connected to the communication device 801. The rectifier circuit 805 generates an input potential by rectification, for example, half-wave voltage doubler rectification of an input alternating signal generated by reception of a radio signal at the antenna 804 and smoothing of the rectified signal with a capacitor provided in a later stage in the rectifier circuit 805. Note that a limiter circuit may be provided on an input side or an output side of the rectifier circuit 805. The limiter circuit controls electric power so that electric power which is higher than or equal to certain electric power is not input to a circuit in a later stage if the amplitude of the input alternating signal is high and an internal generation voltage is high.
The constant voltage circuit 806 generates a stable power supply voltage from an input potential and supplies it to each circuit. Note that the constant voltage circuit 806 may include a reset signal generation circuit. The reset signal generation circuit is a circuit which generates a reset signal of the logic circuit 809 by utilizing rise of the stable power supply voltage.
The demodulation circuit 807 demodulates the input alternating signal by envelope detection and generates the demodulated signal. Further, the modulation circuit 808 performs modulation in accordance with data to be output from the antenna 804.
The logic circuit 809 analyzes and processes the demodulated signal. The memory circuit 810 holds the input data and includes a row decoder, a column decoder, a memory region, and the like. Further, the ROM 811 stores an identification number (ID) or the like and outputs it in accordance with processing.
Note that the decision whether each circuit described above is provided or not can be made as appropriate as needed.
Here, the memory circuit described in the above embodiment can be used as the memory circuit 810. Since the memory circuit including the transistor of one embodiment of the present invention can retain data even when not powered, the memory circuit including the transistor can be favorably used for an RF tag. Furthermore, the memory circuit including the transistor of one embodiment of the present invention needs power (voltage) needed for data writing significantly lower than that needed in a conventional nonvolatile memory; thus, it is possible to prevent a difference between the maximum communication range in data reading and that in data writing. In addition, it is possible to suppress malfunction or incorrect writing which is caused by power shortage in data writing.
Since the memory circuit of one embodiment of the present invention can be used as a nonvolatile memory, it can also be used as the ROM 811. In this case, it is preferable that a manufacturer separately prepare a command for writing data to the ROM 811 so that a user cannot rewrite data freely. Since the manufacturer gives identification numbers before shipment and then starts shipment of products, instead of putting identification numbers to all the manufactured RF tags, it is possible to put identification numbers to only good products to be shipped. Thus, the identification numbers of the shipped products are in series and customer management corresponding to the shipped products is easily performed.
This embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.
Embodiment 7
In this embodiment, a CPU that includes the memory device described in the above embodiment is described.
FIG. 28 is a block diagram illustrating a configuration example of a CPU at least partly including any of the transistors described in the above embodiments as a component.
<Circuit Diagram of CPU>
The CPU illustrated in FIG. 28 includes, over a substrate 1190, an arithmetic logic unit (ALU) 1191, an ALU controller 1192, an instruction decoder 1193, an interrupt controller 1194, a tuning controller 1195, a register 1196, a register controller 1197, a bus interface 1198, a rewritable ROM 1199, and a ROM interface 1189. A semiconductor substrate, an SOI substrate, a glass substrate, or the like is used as the substrate 1190. The ROM 1199 and the ROM interface 1189 may be provided over a separate chip. Needless to say, the CPU in FIG. 28 is just an example in which the configuration is simplified, and an actual CPU may have a variety of configurations depending on the application. For example, the CPU may have the following configuration: a structure including the CPU illustrated in FIG. 28 or an arithmetic circuit is considered as one core; a plurality of the cores are included; and the cores operate in parallel. The number of bits that the CPU can process in an internal arithmetic circuit or in a data bus can be 8, 16, 32, or 64, for example.
An instruction that is input to the CPU through the bus interface 1198 is input to the instruction decoder 1193 and decoded therein, and then, input to the ALU controller 1192, the interrupt controller 1194, the register controller 1197, and the timing controller 1195.
The ALU controller 1192, the interrupt controller 1194, the register controller 1197, and the timing controller 1195 conduct various controls in accordance with the decoded instruction. Specifically, the ALU controller 1192 generates signals for controlling the operation of the ALU 1191. While the CPU is executing a program, the interrupt controller 1194 judges an interrupt request from an external input/output device or a peripheral circuit on the basis of its priority or a mask state, and processes the request. The register controller 1197 generates an address of the register 1196, and reads/writes data from/to the register 1196 in accordance with the state of the CPU.
The timing controller 1195 generates signals for controlling operation timings of the ALU 1191, the ALU controller 1192, the instruction decoder 1193, the interrupt controller 1194, and the register controller 1197. For example, the timing controller 1195 includes an internal clock generator for generating an internal clock signal based on a reference clock signal, and supplies the internal clock signal to the above circuits.
In the CPU illustrated in FIG. 28, a memory cell is provided in the register 1196. For the memory cell of the register 1196, any of the transistors described in Embodiments 1 to 3 can be used.
In the CPU illustrated in FIG. 28, the register controller 1197 selects operation of retaining data in the register 1196 in accordance with an instruction from the ALU 1191. That is, the register controller 1197 selects whether data is retained by a flip-flop or by a capacitor in the memory cell included in the register 1196. When data retaining by the flip-flop is selected, a power supply voltage is supplied to the memory cell in the register 1196. When data retaining by the capacitor is selected, the data is rewritten in the capacitor, and supply of power supply voltage to the memory cell in the register 1196 can be stopped.
<Memory Circuit>
FIG. 29 is an example of a circuit diagram of a memory element that can be used as the register 1196. A memory element 1200 includes a circuit 1201 in which stored data is volatile when power supply is stopped, a circuit 1202 in which stored data is nonvolatile even when power supply is stopped, a switch 1203, a switch 1204, a logic element 1206, a capacitor 1207, and a circuit 1220 having a selecting function. The circuit 1202 includes a capacitor 1208, a transistor 1209, and a transistor 1210. Note that the memory element 1200 may further include another element such as a diode, a resistor, or an inductor, as needed.
Here, the memory device described in the above embodiment can be used as the circuit 1202. When supply of a power supply voltage to the memory element 1200 is stopped, a ground potential (0 V) or a potential at which the transistor 1209 in the circuit 1202 is turned off continues to be input to a gate of the transistor 1209. For example, a first gate of the transistor 1209 is grounded through a load such as a resistor.
Shown here is an example in which the switch 1203 is a transistor 1213 having one conductivity type (e.g., an n-channel transistor) and the switch 1204 is a transistor 1214 having a conductivity type opposite to the one conductivity type (e.g., a p-channel transistor). A first terminal of the switch 1203 corresponds to one of a source and a drain of the transistor 1213, a second terminal of the switch 1203 corresponds to the other of the source and the drain of the transistor 1213, and conduction or non-conduction between the first terminal and the second terminal of the switch 1203 (i.e., the on/off state of the transistor 1213) is selected by a control signal RD input to a gate of the transistor 1213. A first terminal of the switch 1204 corresponds to one of a source and a drain of the transistor 1214, a second terminal of the switch 1204 corresponds to the other of the source and the drain of the transistor 1214, and conduction or non-conduction between the first terminal and the second terminal of the switch 1204 (i.e., the on/off state of the transistor 1214) is selected by the control signal RD input to a gate of the transistor 1214.
One of a source and a drain of the transistor 1209 is electrically connected to one of a pair of electrodes of the capacitor 1208 and a gate of the transistor 1210. Here, the connection portion is referred to as a node M2. One of a source and a drain of the transistor 1210 is electrically connected to a line which can supply a low power supply potential (e.g., a GND line), and the other thereof is electrically connected to the first terminal of the switch 1203 (the one of the source and the drain of the transistor 1213). The second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is electrically connected to the first terminal of the switch 1204 (the one of the source and the drain of the transistor 1214). The second terminal of the switch 1204 (the other of the source and the drain of the transistor 1214) is electrically connected to a line which can supply a power supply potential VDD. The second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213), the first terminal of the switch 1204 (the one of the source and the drain of the transistor 1214), an input terminal of the logic element 1206, and one of a pair of electrodes of the capacitor 1207 are electrically connected to each other. Here, the connection portion is referred to as a node M1. The other of the pair of electrodes of the capacitor 1207 can be supplied with a constant potential. For example, the other of the pair of electrodes of the capacitor 1207 can be supplied with a low power supply potential (e.g., GND) or a high power supply potential (e.g., VDD). The other of the pair of electrodes of the capacitor 1207 is electrically connected to the line which can supply a low power supply potential (e.g., a GND line). The other of the pair of electrodes of the capacitor 1208 can be supplied with a constant potential. For example, the other of the pair of electrodes of the capacitor 1208 can be supplied with a low power supply potential (e.g., GND) or a high power supply potential (e.g., VDD). The other of the pair of electrodes of the capacitor 1208 is electrically connected to the line which can supply a low power supply potential (e.g., a GND line).
The capacitor 1207 and the capacitor 1208 are not necessarily provided as long as the parasitic capacitance of the transistor, the wiring, or the like is actively utilized.
A control signal WE is input to the first gate (first gate electrode) of the transistor 1209. As for each of the switch 1203 and the switch 1204, a conduction state or a non-conduction state between the first terminal and the second terminal is selected by the control signal RD which is different from the control signal WE. When the first terminal and the second terminal of one of the switches are in the conduction state, the first terminal and the second terminal of the other of the switches are in the non-conduction state.
Note that the transistor 1209 in FIG. 29 has a structure with a second gate (second gate electrode: back gate). The control signal WE can be input to the first gate and the control signal WE2 can be input to the second gate. The control signal WE2 is a signal having a constant potential. As the constant potential, for example, a ground potential GND or a potential lower than a source potential of the transistor 1209 is selected. The control signal WE2 is a potential signal for controlling the threshold voltage of the transistor 1209, and Icut of the transistor 1209 can be further reduced. The control signal WE2 may be a signal having the same potential as that of the control signal WE. Note that as the transistor 1209, a transistor without a second gate may be used.
A signal corresponding to data retained in the circuit 1201 is input to the other of the source and the drain of the transistor 1209. FIG. 28 illustrates an example in which a signal output from the circuit 1201 is input to the other of the source and the drain of the transistor 1209. The logic value of a signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is inverted by the logic element 1206, and the inverted signal is input to the circuit 1201 through the circuit 1220.
In the example of FIG. 29, a signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) is input to the circuit 1201 through the logic element 1206 and the circuit 1220; however, one embodiment of the present invention is not limited thereto. The signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) may be input to the circuit 1201 without its logic value being inverted. For example, in the case where the circuit 1201 includes a node in which a signal obtained by inversion of the logic value of a signal input from the input terminal is retained, the signal output from the second terminal of the switch 1203 (the other of the source and the drain of the transistor 1213) can be input to the node.
In FIG. 29, the transistors included in the memory element 1200 except for the transistor 1209 can each be a transistor in which a channel is formed in a layer formed using a semiconductor other than an oxide semiconductor or in the substrate 1190. For example, the transistor can be a transistor whose channel is formed in a silicon layer or a silicon substrate. Alternatively, all the transistors in the memory element 1200 may be a transistor in which a channel is formed in an oxide semiconductor layer. Further alternatively, in the memory element 1200, a transistor in which a channel is formed in an oxide semiconductor layer can be included besides the transistor 1209, and a transistor in which a channel is formed in a layer including a semiconductor other than an oxide semiconductor or the substrate 1190 can be used for the reset of the transistors.
As the circuit 1201 in FIG. 29, for example, a flip-flop circuit can be used. As the logic element 1206, for example, an inverter or a clocked inverter can be used.
In a period during which the memory element 1200 is not supplied with the power supply voltage, the semiconductor device of one embodiment of the present invention can retain data stored in the circuit 1201 by the capacitor 1208 which is provided in the circuit 1202.
The off-state current of a transistor in which a channel is formed in an oxide semiconductor layer is extremely low. For example, the off-state current of a transistor in which a channel is formed in an oxide semiconductor layer is significantly lower than that of a transistor in which a channel is formed in silicon having crystallinity. Thus, when the transistor is used as the transistor 1209, a signal held in the capacitor 1208 is retained for a long time also in a period during which the power supply voltage is not supplied to the memory element 1200. The memory element 1200 can accordingly retain the stored content (data) also in a period during which the supply of the power supply voltage is stopped.
Since the above-described memory element performs pre-charge operation with the switch 1203 and the switch 1204, the time required for the circuit 1201 to retain original data again after the supply of the power supply voltage is restarted can be shortened.
In the circuit 1202, a signal retained by the capacitor 1208 is input to the gate of the transistor 1210. Therefore, after supply of the power supply voltage to the memory element 1200 is restarted, the signal retained by the capacitor 1208 can be converted into the one corresponding to the state (the on state or the off state) of the transistor 1210 to be read from the circuit 1202. Consequently, an original signal can be accurately read even when a potential corresponding to the signal retained by the capacitor 1208 varies to some degree.
By applying the above-described memory element 1200 to a memory device such as a register or a cache memory included in a processor, data in the memory device can be prevented from being lost owing to the stop of the supply of the power supply voltage. Furthermore, shortly after the supply of the power supply voltage is restarted, the memory device can be returned to the same state as that before the power supply is stopped. Therefore, the power supply can be stopped even for a short time in the processor or one or a plurality of logic circuits included in the processor, resulting in lower power consumption.
Although the memory element 1200 is used in a CPU in this embodiment, the memory element 1200 can also be used in an LSI such as a digital signal processor (DSP), a custom LSI, or a programmable logic device (PLD), and a radio frequency (RF) tag.
This embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.
Embodiment 8
In this embodiment, configuration examples of a display device using a transistor of one embodiment of the present invention are described.
<Circuit Configuration Example of Display Device>
FIG. 30A is a top view of the display device of one embodiment of the present invention. FIG. 30B is a circuit diagram illustrating a pixel circuit that can be used in the case where a liquid crystal element is used in a pixel in the display device of one embodiment of the present invention. FIG. 30C is a circuit diagram illustrating a pixel circuit that can be used in the case where an organic EL element is used in a pixel in the display device of one embodiment of the present invention.
The transistor in the pixel portion can be formed in accordance with Embodiments 1 to 3. The transistor can be easily formed as an n-channel transistor, and thus part of a driver circuit that can be formed using an n-channel transistor can be formed over the same substrate as the transistor of the pixel portion. With the use of any of the transistors described in the above embodiments for the pixel portion or the driver circuit in this manner, a highly reliable display device can be provided.
FIG. 30A illustrates an example of a top view of an active matrix display device. A pixel portion 701, a first scan line driver circuit 702, a second scan line driver circuit 703, and a signal line driver circuit 704 are formed over a substrate 700 of the display device. In the pixel portion 701, a plurality of signal lines extended from the signal line driver circuit 704 are arranged and a plurality of scan lines extended from the first scan line driver circuit 702 and the second scan line driver circuit 703 are arranged. Note that pixels which include display elements are provided in a matrix in respective regions where the scan lines and the signal lines intersect with each other. The substrate 700 of the display device is connected to a timing control circuit (also referred to as a controller or a controller IC) through a connection portion such as a flexible printed circuit (FPC).
In FIG. 30A, the first scan line driver circuit 702, the second scan line driver circuit 703, and the signal line driver circuit 704 are formed over the substrate 700 where the pixel portion 701 is formed. Accordingly, the number of components which are provided outside, such as a driver circuit, can be reduced, so that a reduction in cost can be achieved. Furthermore, if the driver circuit is provided outside the substrate 700, wirings would need to be extended and the number of wiring connections would increase. When the driver circuit is provided over the substrate 700, the number of wiring connections can be reduced. Consequently, an improvement in reliability or yield can be achieved. One or more of the first scan line driver circuit 702, the second scan line driver circuit 703, and the signal line driver circuit 704 may be mounted on the substrate 700 or provided outside the substrate 700.
<Liquid Crystal Display Device>
FIG. 30B illustrates an example of a circuit configuration of the pixel. Here, a pixel circuit which is applicable to a pixel of a VA liquid crystal display device is illustrated as an example.
This pixel circuit can be applied to a structure in which one pixel includes a plurality of pixel electrode layers. The pixel electrode layers are connected to different transistors, and the transistors can be driven with different gate signals. Accordingly, signals applied to individual pixel electrode layers in a multi-domain pixel can be controlled independently.
A gate wiring 712 of a transistor 716 and a gate wiring 713 of a transistor 717 are separated so that different gate signals can be supplied thereto. In contrast, a data line 714 is shared by the transistors 716 and 717. The transistor described in any of Embodiments 1 to 3 can be used as appropriate as each of the transistors 716 and 717. Thus, a highly reliable liquid crystal display device can be provided.
The shapes of a first pixel electrode layer electrically connected to the transistor 716 and a second pixel electrode layer electrically connected to the transistor 717 are described. The first pixel electrode layer and the second pixel electrode layer are separated by a slit. The first pixel electrode layer has a V shape and the second pixel electrode layer is provided so as to surround the first pixel electrode layer.
A gate electrode of the transistor 716 is connected to the scan line 712, and a gate electrode of the transistor 717 is connected to the scan line 713. When different gate signals are supplied to the scan line 712 and the scan line 713, operation timings of the transistor 716 and the transistor 717 can be varied. As a result, alignment of liquid crystals can be controlled.
Further, a storage capacitor may be formed using a capacitor wiring 710, a gate insulating layer functioning as a dielectric, and a capacitor electrode electrically connected to the first pixel electrode layer or the second pixel electrode layer.
The multi-domain pixel includes a first liquid crystal element 718 and a second liquid crystal element 719. The first liquid crystal element 718 includes the first pixel electrode layer, a counter electrode layer, and a liquid crystal layer therebetween. The second liquid crystal element 719 includes the second pixel electrode layer, a counter electrode layer, and a liquid crystal layer therebetween.
Note that a pixel circuit of the present invention is not limited to that shown in FIG. 30B. For example, a switch, a resistor, a capacitor, a transistor, a sensor, a logic circuit, or the like may be added to the pixel circuit illustrated in FIG. 30B.
<Organic EL Display Device>
FIG. 30C illustrates another example of a circuit configuration of the pixel. Here, a pixel structure of a display device using an organic EL element is shown.
In an organic EL element, by application of voltage to a light-emitting element, electrons are injected from one of a pair of electrodes and holes are injected from the other of the pair of electrodes, into a layer containing a light-emitting organic compound; thus, current flows. The electrons and holes are recombined, and thus, the light-emitting organic compound is excited. The light-emitting organic compound returns to a ground state from the excited state, thereby emitting light. Owing to such a mechanism, this light-emitting element is referred to as a current-excitation light-emitting element.
FIG. 30C illustrates an applicable example of a pixel circuit. Here, one pixel includes two n-channel transistors. Furthermore, digital time grayscale driving can be employed for the pixel circuit.
The configuration of the applicable pixel circuit and operation of a pixel employing digital time grayscale driving are described.
A pixel 720 includes a switching transistor 721, a driver transistor 722, a light-emitting element 724, and a capacitor 723. A gate electrode layer of the switching transistor 721 is connected to a scan line 726, a first electrode (one of a source electrode layer and a drain electrode layer) of the switching transistor 721 is connected to a signal line 725, and a second electrode (the other of the source electrode layer and the drain electrode layer) of the switching transistor 721 is connected to a gate electrode layer of the driver transistor 722. The gate electrode layer of the driver transistor 722 is connected to a power supply line 727 through the capacitor 723, a first electrode of the driver transistor 722 is connected to the power supply line 727, and a second electrode of the driver transistor 722 is connected to a first electrode (a pixel electrode) of the light-emitting element 724. A second electrode of the light-emitting element 724 corresponds to a common electrode 728. The common electrode 728 is electrically connected to a common potential line formed over the same substrate as the common electrode 728.
As the switching transistor 721 and the driver transistor 722, the transistor described in any of Embodiments 1 to 3 can be used as appropriate. In this manner, a highly reliable organic EL display device can be provided.
The potential of the second electrode (the common electrode 728) of the light-emitting element 724 is set to be a low power supply potential. Note that the low power supply potential is lower than a high power supply potential supplied to the power supply line 727. For example, the low power supply potential can be GND, 0V, or the like. The high power supply potential and the low power supply potential are set to be higher than or equal to the forward threshold voltage of the light-emitting element 724, and the difference between the potentials is applied to the light-emitting element 724, whereby current is supplied to the light-emitting element 724, leading to light emission. The forward voltage of the light-emitting element 724 refers to a voltage at which a desired luminance is obtained, and includes at least a forward threshold voltage.
Note that gate capacitance of the driver transistor 722 may be used as a substitute for the capacitor 723, so that the capacitor 723 can be omitted.
Next, a signal input to the driver transistor 722 is described. In the case of a voltage-input voltage driving method, a video signal for sufficiently turning on or off the driver transistor 722 is input to the driver transistor 722. In order for the driver transistor 722 to operate in a linear region, voltage higher than the voltage of the power supply line 727 is applied to the gate electrode layer of the driver transistor 722. Note that voltage higher than or equal to voltage which is the sum of power supply line voltage and the threshold voltage Vth of the driver transistor 722 is applied to the signal line 725.
In the case of performing analog grayscale driving, a voltage greater than or equal to a voltage which is the sum of the forward voltage of the light-emitting element 724 and the threshold voltage Vth of the driver transistor 722 is applied to the gate electrode layer of the driver transistor 722. A video signal by which the driver transistor 722 is operated in a saturation region is input, so that current is supplied to the light-emitting element 724. In order for the driver transistor 722 to operate in a saturation region, the potential of the power supply line 727 is set higher than the gate potential of the driver transistor 722. When an analog video signal is used, it is possible to supply current to the light-emitting element 724 in accordance with the video signal and perform analog grayscale driving.
Note that the configuration of the pixel circuit of the present invention is not limited to that shown in FIG. 30C. For example, a switch, a resistor, a capacitor, a sensor, a transistor, a logic circuit, or the like may be added to the pixel circuit illustrated in FIG. 30C.
In the case where the transistor shown in any of the above embodiments is used for the circuit shown in FIGS. 30A to 30C, the source electrode (the first electrode) is electrically connected to the low potential side and the drain electrode (the second electrode) is electrically connected to the high potential side. Furthermore, the potential of the first gate electrode may be controlled by a control circuit or the like and the potential described above as an example, e.g., a potential lower than the potential applied to the source electrode, may be input to the second gate electrode through a wiring that is not illustrated.
For example, in this specification and the like, a display element, a display device which is a device including a display element, a light-emitting element, and a light-emitting device which is a device including a light-emitting element can employ a variety of modes or can include a variety of elements. A display element, a display device, a light-emitting element, or a light-emitting device include at least one of the following, for example: an EL (electroluminescent) element (e.g., an EL element including organic and inorganic materials, an organic EL element, or an inorganic EL element), an LED (e.g., a white LED, a red LED, a green LED, or a blue LED), a transistor (a transistor which emits light depending on current), an electron emitter, a liquid crystal element, electronic ink, an electrophoretic element, a grating light valve (GLV), a plasma display panel (PDP), a micro electro mechanical system (MEMS), a digital micromirror device (DMD), a digital micro shutter (DMS), MIRASOL (registered trademark), an interferometric modulator display (IMOD) element, an electrowetting element, a piezoelectric ceramic display, and a display element using a carbon nanotube. Other than the above, display media whose contrast, luminance, reflectivity, transmittance, or the like is changed by electric or electromagnetic action may be included. Note that examples of display devices having EL elements include an EL display. Examples of display devices including electron emitters are a field emission display (FED) and an SED-type flat panel display (SED: surface-conduction electron-emitter display). Examples of display devices including liquid crystal elements include a liquid crystal display (e.g., a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct-view liquid crystal display, or a projection liquid crystal display). Examples of display devices including electronic ink or electrophoretic elements include electronic paper.
This embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.
Embodiment 9
In this embodiment, a display module using a semiconductor device of one embodiment of the present invention is described with reference to FIG. 31.
<Display Module>
In a display module 6000 in FIG. 31, a touch panel 6004 connected to an FPC 6003, a display panel 6006 connected to an FPC 6005, a backlight unit 6007, a frame 6009, a printed board 6010, and a battery 6011 are provided between an upper cover 6001 and a lower cover 6002. Note that the backlight unit 6007, the battery 6011, the touch panel 6004, and the like are not provided in some cases.
The semiconductor device of one embodiment of the present invention can be used for, for example, the display panel 6006 and an integrated circuit mounted on a printed circuit board.
The shapes and sizes of the upper cover 6001 and the lower cover 6002 can be changed as appropriate in accordance with the sizes of the touch panel 6004 and the display panel 6006.
The touch panel 6004 can be a resistive touch panel or a capacitive touch panel and may be formed to overlap with the display panel 6006. A counter substrate (sealing substrate) of the display panel 6006 can have a touch panel function. A photosensor may be provided in each pixel of the display panel 6006 so that an optical touch panel function is added. An electrode for a touch sensor may be provided in each pixel of the display panel 6006 so that a capacitive touch panel function is added.
The backlight unit 6007 includes a light source 6008. The light source 6008 may be provided at an end portion of the backlight unit 6007 and a light diffusing plate may be used.
The frame 6009 protects the display panel 6006 and also functions as an electromagnetic shield for blocking electromagnetic waves generated from the printed board 6010. The frame 6009 may function as a radiator plate.
The printed board 6010 has a power supply circuit and a signal processing circuit for outputting a video signal and a clock signal. As a power source for supplying power to the power supply circuit, an external commercial power source or the battery 6011 provided separately may be used. Note that the battery 6011 is not necessary in the case where a commercial power source is used.
The display module 6000 can be additionally provided with a member such as a polarizing plate, a retardation plate, or a prism sheet.
This embodiment can be combined with any of the other embodiments in this specification as appropriate.
Embodiment 10
In this embodiment, application examples of the semiconductor device in one embodiment of the present invention will be described.
<Package Using a Lead Frame Interposer>
FIG. 32A is a perspective view illustrating a cross-sectional structure of a package using a lead frame interposer. In the package illustrated in FIG. 32A, a chip 1751 corresponding to the semiconductor device of one embodiment of the present invention is connected to a terminal 1752 over an interposer 1750 by wire bonding. The terminal 1752 is placed on a surface of the interposer 1750 on which the chip 1751 is mounted. The chip 1751 may be sealed by a mold resin 1753, in which case the chip 1751 is sealed such that part of each of the terminals 1752 is exposed.
FIG. 32B illustrates the structure of a module of an electronic device (mobile phone) in which a package is mounted on a circuit board. In the module of the mobile phone in FIG. 32B, a package 1802 and a battery 1804 are mounted on a printed wiring board 1801. The printed wiring board 1801 is mounted on a panel 1800 including a display element by an FPC 1803.
Note that this embodiment can be combined as appropriate with any of the other embodiments and examples in this specification.
Embodiment 11
In this embodiment, electronic devices and lighting devices of one embodiment of the present invention will be described with reference to drawings.
<Electronic Device>
Electronic devices and lighting devices can be fabricated using the semiconductor device of one embodiment of the present invention. In addition, highly reliable electronic devices and lighting devices can be fabricated using the semiconductor device of one embodiment of the present invention. Furthermore, electronic devices and lighting devices including touch sensors with improved detection sensitivity can be fabricated using the semiconductor device of one embodiment of the present invention.
Examples of electronic devices are television devices (also referred to as TV or television receivers), monitors for computers and the like, cameras such as digital cameras and digital video cameras, digital photo frames, cellular phones (also referred to as portable telephone devices), portable game machines, portable information terminals, audio playback devices, large game machines such as pin-ball machines, and the like.
In the case of having flexibility, the light-emitting device or lighting device of one embodiment of the present invention can be incorporated along a curved inside/outside wall surface of a house or a building or a curved interior/exterior surface of a car.
Furthermore, the electronic device of one embodiment of the present invention may include a secondary battery. It is preferable that the secondary battery be capable of being charged by non-contact power transmission.
Examples of the secondary battery include a lithium ion secondary battery such as a lithium polymer battery using a gel electrolyte (lithium ion polymer battery), a lithium-ion battery, a nickel-hydride battery, a nickel-cadmium battery, an organic radical battery, a lead-acid battery, an air secondary battery, a nickel-zinc battery, and a silver-zinc battery.
The electronic device of one embodiment of the present invention may include an antenna. When a signal is received by the antenna, the electronic device can display an image, data, or the like on a display portion. When the electronic device includes a secondary battery, the antenna may be used for non-contact power transmission.
FIG. 33A illustrates a portable game machine including a housing 7101, a housing 7102, a display portion 7103, a display portion 7104, a microphone 7105, speakers 7106, an operation key 7107, a stylus 7108, and the like. The semiconductor device of one embodiment of the present invention can be used for a memory, a CPU, or the like incorporated in the housing 7102. When the semiconductor device of one embodiment of the present invention is used as the display portion 7103 or 7104, it is possible to provide a user-friendly portable game machine with quality that hardly deteriorates. Although the portable game machine illustrated in FIG. 33A includes two display portions, the display portion 7103 and the display portion 7104, the number of display portions included in the portable game machine is not limited to two.
FIG. 33B illustrates a smart watch, which includes a housing 7302, a display portion 7304, operation buttons 7311 and 7312, a connection terminal 7313, a band 7321, a clasp 7322, and the like. The semiconductor device of one embodiment of the present invention can be used for a memory, a CPU, or the like incorporated in the housing 7302.
FIG. 33C illustrates a portable information terminal, which includes a display portion 7502 incorporated in a housing 7501, operation buttons 7503, an external connection port 7504, a speaker 7505, a microphone 7506, a display portion 7502, and the like. The semiconductor device of one embodiment of the present invention can be used for a memory, a CPU, or the like incorporated in the housing 7501. Note that the display portion 7502 is small- or medium-sized but can perform full high vision, 4 k, or 8 k display because it has greatly high definition; therefore, a significantly clear image can be obtained.
FIG. 33D illustrates a video camera including a first housing 7701, a second housing 7702, a display portion 7703, operation keys 7704, a lens 7705, a joint 7706, and the like. The operation keys 7704 and the lens 7705 are provided for the first housing 7701, and the display portion 7703 is provided for the second housing 7702. The first housing 7701 and the second housing 7702 are connected to each other with the joint 7706, and the angle between the first housing 7701 and the second housing 7702 can be changed with the joint 7706. Images displayed on the display portion 7703 may be switched in accordance with the angle at the joint 7706 between the first housing 7701 and the second housing 7702. The imaging device of one embodiment of the present invention can be used in a portion corresponding to a focus of the lens 7705. The semiconductor device of one embodiment of the present invention can be used for an integrated circuit, a CPU, or the like incorporated in the first housing 7701.
FIG. 33E illustrates a digital signage including a display portion 7902 provided on a utility pole 7901. The display device of one embodiment of the present invention can be used for a control circuit of the display portion 7902.
FIG. 34A illustrates a notebook personal computer, which includes a housing 8121, a display portion 8122, a keyboard 8123, a pointing device 8124, and the like. The semiconductor device of one embodiment of the present invention can be used for a CPU, a memory, or the like incorporated in the housing 8121. Note that the display portion 8122 is small- or medium-sized but can perform 8 k display because it has greatly high definition; therefore, a significantly clear image can be obtained.
FIG. 34A is an external view of an automobile 9700. FIG. 34B illustrates a driver's seat of the automobile 9700. The automobile 9700 includes a car body 9701, wheels 9702, a dashboard 9703, lights 9704, and the like. The semiconductor device of one embodiment of the present invention can be used in a display portion and a control integrated circuit of the automobile 9700. For example, the display device or input/output device of one embodiment of the present invention can be used in display portions 9710 to 9715 illustrated in FIG. 34B.
The display portion 9710 and the display portion 9711 are display devices or input/output devices provided in an automobile windshield. The display device or input/output device of one embodiment of the present invention can be a see-through display device or input/output device, through which the opposite side can be seen, by using a light-transmitting conductive material for its electrodes. Such a see-through display device or input/output device does not hinder driver's vision during the driving of the automobile 9700. Therefore, the display device or input/output device of one embodiment of the present invention can be provided in the windshield of the automobile 9700. Note that in the case where a transistor or the like for driving the display device or input/output device is provided in the display device or input/output device, a transistor having light-transmitting properties, such as an organic transistor using an organic semiconductor material or a transistor using an oxide semiconductor, is preferably used.
The display portion 9712 is a display device provided on a pillar portion. For example, the display portion 9712 can compensate for the view hindered by the pillar portion by showing an image taken by an imaging unit provided on the car body. The display portion 9713 is a display device provided on a dashboard portion. For example, the display portion 9713 can compensate for the view hindered by the dashboard portion by showing an image taken by an imaging unit provided on the car body. That is, showing an image taken by an imaging unit provided on the outside of the car body leads to elimination of blind areas and enhancement of safety. In addition, showing an image so as to compensate for the area which a driver cannot see makes it possible for the driver to confirm safety easily and comfortably.
FIG. 34D illustrates the inside of a car in which a bench seat is used as a driver seat and a front passenger seat. A display portion 9721 is a display device provided in a door portion. For example, the display portion 9721 can compensate for the view hindered by the door portion by showing an image taken by an imaging unit provided on the car body. A display portion 9722 is a display device provided in a steering wheel. A display portion 9723 is a display device provided in the middle of a seating face of the bench seat. Note that the display device can be used as a seat heater by providing the display device on the seating face or backrest and by using heat generated by the display device as a heat source.
The display portion 9714, the display portion 9715, and the display portion 9722 can display a variety of kinds of information such as navigation data, a speedometer, a tachometer, a mileage, a fuel meter, a gearshift indicator, and air-condition setting. The content, layout, or the like of the display on the display portions can be changed freely by a user as appropriate. The information listed above can also be displayed on the display portions 9710 to 9713, 9721, and 9723. The display portions 9710 to 9715 and 9721 to 9723 can also be used as lighting devices. The display portions 9710 to 9715 and 9721 to 9723 can also be used as heating devices.
FIG. 35A illustrates an external view of a camera 8000. The camera 8000 includes a housing 8001, a display portion 8002, an operation button 8003, a shutter button 8004, a connection portion 8005, and the like. A lens 8006 can be put on the camera 8000.
The connection portion 8005 includes an electrode to connect a finder 8100, which is described below, a stroboscope, or the like.
Although the lens 8006 of the camera 8000 here is detachable from the housing 8001 for replacement, the lens 8006 may be included in the housing 8001.
Images can be taken at the press of the shutter button 8004. In addition, images can be taken at the touch of the display portion 8002 which serves as a touch panel.
The display device or input/output device of one embodiment of the present invention can be used in the display portion 8002.
FIG. 35B shows the camera 8000 with the finder 8100 connected.
The finder 8100 includes a housing 8101, a display portion 8102, a button 8103, and the like.
The housing 8101 includes a connection portion for engagement with the connection portion 8005 of the camera 8000 so that the finder 8100 can be connected to the camera 8000. The connection portion includes an electrode, and an image or the like received from the camera 8000 through the electrode can be displayed on the display portion 8102.
The button 8103 has a function of a power button, and the display portion 8102 can be turned on and off with the button 8103.
The semiconductor device of one embodiment of the present invention can be used for an integrated circuit and an image sensor included in the housing 8101.
Although the camera 8000 and the finder 8100 are separate and detachable electronic devices in FIGS. 35A and 35B, the housing 8001 of the camera 8000 may include a finder having the display device or input/output device of one embodiment of the present invention.
FIG. 35C illustrates an external view of a head-mounted display 8200.
The head-mounted display 8200 includes a mounting portion 8201, a lens 8202, a main body 8203, a display portion 8204, a cable 8205, and the like. The mounting portion 8201 includes a battery 8206.
Power is supplied from the battery 8206 to the main body 8203 through the cable 8205. The main body 8203 includes a wireless receiver or the like to receive video data, such as image data, and display it on the display portion 8204. The movement of the eyeball and the eyelid of a user is captured by a camera in the main body 8203 and then coordinates of the points the user looks at are calculated using the captured data to utilize the eye of the user as an input means.
The mounting portion 8201 may include a plurality of electrodes so as to be in contact with the user. The main body 8203 may be configured to sense current flowing through the electrodes with the movement of the user's eyeball to recognize the direction of his or her eyes. The main body 8203 may be configured to sense current flowing through the electrodes to monitor the user's pulse. The mounting portion 8201 may include sensors, such as a temperature sensor, a pressure sensor, or an acceleration sensor so that the user's biological information can be displayed on the display portion 8204. The main body 8203 may be configured to sense the movement of the user's head or the like to move an image displayed on the display portion 8204 in synchronization with the movement of the user's head or the like.
The semiconductor device of one embodiment of the present invention can be used for an integrated circuit included in the main body 8203.
At least part of this embodiment can be implemented in combination with any of the embodiments described in this specification as appropriate.
Embodiment 12
In this embodiment, application examples of an RF tag using the semiconductor device of one embodiment of the present invention will be described with reference to FIGS. 36A to 36F.
<Application Examples of RF Tag>
The RF tag is widely used and can be provided for, for example, products such as bills, coins, securities, bearer bonds, documents (e.g., driver's licenses or resident's cards, see FIG. 36A), vehicles (e.g., bicycles, see FIG. 36B), packaging containers (e.g., wrapping paper or bottles, see FIG. 36C), recording media (e.g., DVD or video tapes, see FIG. 36D), personal belongings (e.g., bags or glasses), foods, plants, animals, human bodies, clothing, household goods, medical supplies such as medicine and chemicals, and electronic devices (e.g., liquid crystal display devices, EL display devices, television sets, or cellular phones), or tags on products (see FIGS. 36E and 27F).
An RF tag 4000 of one embodiment of the present invention is fixed to a product by being attached to a surface thereof or embedded therein. For example, the RF tag 4000 is fixed to each product by being embedded in paper of a book, or embedded in an organic resin of a package. Since the RF tag 4000 of one embodiment of the present invention can be reduced in size, thickness, and weight, it can be fixed to a product without spoiling the design of the product. Furthermore, bills, coins, securities, bearer bonds, documents, or the like can have an identification function by being provided with the RF tag 4000 of one embodiment of the present invention, and the identification function can be utilized to prevent counterfeiting. Moreover, the efficiency of a system such as an inspection system can be improved by providing the RF tag of one embodiment of the present invention for packaging containers, recording media, personal belongings, foods, clothing, household goods, electronic devices, or the like. Vehicles can also have higher security against theft or the like by being provided with the RF tag of one embodiment of the present invention.
As described above, by using the RF tag including the semiconductor device of one embodiment of the present invention for each application described in this embodiment, power for operation such as writing or reading of data can be reduced, which results in an increase in the maximum communication distance. Moreover, data can be held for an extremely long period even in the state where power is not supplied; thus, the RF tag can be preferably used for application in which data is not frequently written or read.
This embodiment can be combined with any of the other embodiments and examples in this specification as appropriate.
Example 1
Evaluation results of oxygen supply capability of an aluminum oxide film formed by a sputtering method will be described.
The evaluation was performed as follows: a silicon wafer was subjected to hydrochloric acid oxidation at 950° C. to form a 100-nm-thick thermal oxidation film, and a 70-nm-thick aluminum oxide film was formed by a sputtering method over the thermal oxidation film. The aluminum oxide film was then removed by a wet etching using a mixed solution of nitric acid, acetic acid, and phosphoric acid. The amount of desorbed oxygen was measured by thermal desorption spectroscopy (TDS). An aluminum oxide target was used as a sputtering target. The pressure in a deposition chamber was 0.4 Pa. A deposition RF power was 2.5 kW. The distance between the sample and the target was 60 mm. A substrate heating temperature was 250° C. The TDS analysis was performed using a high-accuracy thermal desorption spectroscopy apparatus EMD-WA1000S manufactured by ESCO Ltd. in a film-surface temperature range from 0° C. to 600° C.
FIG. 37 shows the measurement results of the amount of thermally desorbed oxygen molecules. The horizontal axis and the vertical axis represent the proportion of oxygen molecules contained in the sputtering gas and the amount of desorbed oxygen, respectively.
As shown in FIG. 37, oxygen (oxygen atoms and oxygen molecules) is thermally desorbed from the thermal oxidation film when the gas contains oxygen molecules at 4% or more. This is because energy-retaining oxygen that has collided with the sputtering target is added into the thermal oxidation film. Oxygen (oxygen atoms and molecules) can be supplied and added to the thermal oxidation film in this manner, which leads to the improvement of reliability and normally-off characteristics of a transistor.
Example 2
Evaluation results of hydrogen barrier properties of aluminum oxide films will be described.
The evaluation was performed as follows: a silicon wafer was subjected to hydrochloric acid oxidation at 950° C. to form a 100-nm-thick thermal oxidation film, a silicon oxide film (SiOx) was formed by a sputtering method over the thermal oxidation film, and a 20-nm-thick aluminum oxide film (AlOx) was formed over the silicon oxide film by a sputtering method or an ALD method. The amount of desorbed oxygen was measured by TDS.
The silicon oxide film was formed by a sputtering method under the following conditions: a silicon oxide target was used, the deposition pressure in a chamber was 0.4 Pa, the deposition RF power was 1.5 kW, the flow rate of oxygen in sputtering gas was 50 sccm, the distance between the sample and the target was 60 mm, and the substrate heating temperature was 100° C. The aluminum oxide film was formed by a sputtering method under the following conditions: an aluminum oxide target was used, the deposition pressure in a chamber was 0.4 Pa, the deposition RF power was 2.5 kW, the flow rate of Ar sputtering gas was 25 sccm and that of oxygen sputtering gas was 25 sccm, the distance between the sample and the target was 60 mm, and the substrate heating temperature was 250° C. The aluminum oxide film was formed by an ALD method under conditions that TMA and ozone were used as a precursor and an oxidation agent, respectively, and the chamber temperature was 250° C. FIG. 38 shows the measurement results of the amount of thermally desorbed oxygen molecules.
As shown in FIG. 38, it is confirmed that oxygen was desorbed from the silicon oxide film formed by a sputtering method in the sample not including an aluminum oxide film, whereas oxygen desorption was suppressed in the samples including aluminum oxide films formed by a sputtering method and an ALD method. The results show that the aluminum oxide films have oxygen barrier properties, which leads to the improvement of reliability and normally-off characteristics of a transistor.
Example 3
Evaluation results of hydrogen barrier properties of aluminum oxide films will be described.
The evaluation was performed as follows: a silicon wafer was subjected to a plasma CVD method at 950° C. to form a 50-nm-thick silicon nitride film, and then, a 20-nm-thick aluminum oxide film (AlOx) was formed by a sputtering method or an ALD method over the silicon nitride film. The amount of desorbed hydrogen was measured by TDS.
The silicon nitride film was formed by a plasma CVD method under the following conditions: the deposition gas flow rates of silane, ammonia, and nitrogen were 60 sccm, 480 sccm, and 1000 sccm, respectively; the deposition pressure in a chamber was 300 Pa; the RF power frequency was 27 MHz; the deposition power was 350 W; the distance between electrodes was 25 mm; and the substrate heating temperature was 350° C. The aluminum oxide film was formed by a sputtering method under the following conditions: an aluminum oxide target was used, the deposition pressure in a chamber was 0.4 Pa, the deposition RF power was 2.5 kW, the flow rate of Ar sputtering gas was 25 sccm and that of oxygen sputtering gas was 25 sccm, the distance between the sample and the target was 60 mm, and the substrate heating temperature was 250° C. The aluminum oxide film was formed by an ALD method under conditions that TMA and ozone were used as a precursor and an oxidation agent, respectively, and the chamber temperature was 250° C. FIG. 39 shows the measurement results of the amount of thermally desorbed hydrogen molecules.
As shown in FIG. 39, it is confirmed that hydrogen was desorbed from the silicon oxide film formed by a sputtering method in the sample not including an aluminum oxide film, whereas hydrogen desorption was suppressed in the samples including aluminum oxide films formed by a sputtering method and an ALD method. The results show that the aluminum oxide films have hydrogen barrier properties, which leads to the improvement of reliability and normally-off characteristics of a transistor.
Example 4
Described here are results of observing a cross-section of a transistor to examine the coverage with an aluminum oxide film which was formed by an ALD method.
Samples for observation were fabricated by the method described in Embodiment 1 and were observed by scanning transmittance electron microscopy (STEM) using HD-2300 produced by Hitachi High-Technologies Corporation. FIG. 40 shows the results of observing the cross-section of the transistor by STEM.
As shown in FIG. 40, the insulating layer 110, the oxide semiconductor layer 120, the source electrode layer 130, the drain electrode layer 140, the gate insulating layer 150, and the gate electrode layer 160 are formed, and the insulating layer 171 formed by an ALD method covers the transistor without any space. This can suppress entry of impurities to the transistor and can increase the transistor characteristics.
Example 5
Evaluation results of characteristics of transistors including and not including the oxide semiconductor layer 122 will be described in this example.
The transistors were formed by the method described in Embodiment 1.
As the insulating layer 110, a 70-nm-thick silicon oxynitride film was formed by a plasma CVD method. The silicon oxynitride film was formed under the following conditions: the gas flow rates of silane and dinitrogen monoxide were 2.3 sccm and 800 sccm, respectively; the deposition pressure in a chamber was controlled to be 40 Pa using a diaphragm-type baratron sensor and an APC valve; the RF power frequency was 27 MHz; the deposition power was 50 W; the distance between electrodes was 15 mm; and the substrate heating temperature was 400° C.
The oxide semiconductor layer 121 was formed using a target of In:Ga:Zn=1:3:4 (atomic ratio) by a sputtering method to have a thickness of 30 nm. The oxide semiconductor layer 121 was formed under the following conditions: the pressure in a chamber was 0.7 Pa; the DC power was 0.5 kW; the sputtering gas flow rates of Ar gas and oxygen gas were 40 sccm and 5 sccm, respectively; the distance between the sample and the target was 60 mm; and the substrate heating temperature was 200° C.
In the oxygen addition treatment, ion implantation of 16O+ ions was performed under the following conditions: the accelerated voltage was 1 KeV and the dosage was 1×1016 ions/cm3. The oxide semiconductor layer 122 was formed to have a thickness of 10 nm by a sputtering method using a target with a proportion where In:Ga:Zn=1:3:4.
The oxide semiconductor layer 122 was formed under the following conditions: the pressure in a chamber was 0.7 Pa; the DC power was 0.5 kW; the sputtering gas flow rates of Ar gas and oxygen gas were 40 sccm and 5 sccm, respectively; the distance between the sample and the target was 60 mm; and the substrate heating temperature was 200° C.
The oxide semiconductor layer 123 was formed using a target of In:Ga:Zn=1:1:1 by a sputtering method to have a thickness of 15 nm. The oxide semiconductor layer 123 was formed under the following conditions: the pressure in a chamber was 0.7 Pa; the DC power was 0.5 kW; the sputtering gas flow rates of Ar gas and oxygen gas were 30 sccm and 15 sccm, respectively; the distance between the sample and the target was 60 mm; and the substrate heating temperature was 300° C.
As the source electrode layer 130 and the drain electrode layer 140, a 50-nm-thick tungsten film was fouled by a sputtering method. The tungsten film was formed under the following conditions: the deposition pressure in a chamber was 0.4 Pa, the deposition DC power was 1 kW, the flow rate of Ar sputtering gas was 100 sccm and that of heated Ar gas was 10 sccm, the distance between the sample and the target was 60 mm, and the substrate heating temperature was 130° C.
The oxide semiconductor layer 124 was formed using a target of In:Ga:Zn=1:3:2 by a sputtering method to have a thickness of 20 nm. The oxide semiconductor layer 124 was formed under the following conditions: the pressure in a chamber was 2.0 Pa; the DC power was 0.5 kW; the sputtering gas flow rates of Ar gas and oxygen gas were 30 sccm and 15 sccm, respectively; the distance between the sample and the target was 60 mm; and the substrate heating temperature was 300° C.
As the gate insulating layer 150, a 13-nm-thick silicon oxide film was formed by a plasma CVD method. The silicon oxide film was formed under the following conditions: the gas flow rates of silane and dinitrogen monoxide were 1 sccm and 800 sccm, respectively; the deposition pressure in a chamber was controlled to be 200 Pa using a diaphragm-type baratron sensor and an APC valve; the RF power frequency was 60 MHz; the deposition power was 150 W; the distance between electrodes was 28 mm; and the substrate heating temperature was 350° C.
A 30-nm-thick titanium nitride film and a 135-nm-thick tungsten film were formed by a sputtering method for the gate electrode layer 161 and the gate electrode layer 162, respectively. The titanium nitride film was formed under the following conditions: titanium was used as a target; the deposition pressure in a chamber was 0.2 Pa; the DC power was 12 kW; the sputtering gas flow rate of N2 gas was 50 sccm; the distance between the sample and the target was 400 mm; and the deposition temperature was room temperature. The tungsten film was formed under the following conditions: the deposition pressure in a chamber was 2.0 Pa, the deposition DC power was 4 kW, the flow rate of Ar sputtering gas was 100 sccm and that of heated Ar gas was 10 sccm, the distance between the sample and the target was 60 mm, and the substrate heating temperature was 130° C.
As the insulating layer 170, a 40-nm-thick aluminum oxide film was formed by a sputtering method. The aluminum oxide film was formed under the following conditions: an aluminum oxide target was used, the deposition pressure in a chamber was 0.4 Pa, the deposition RF power was 2.5 kW, the flow rate of Ar gas and oxygen gate in sputtering gas were each 25 sccm, the distance between the sample and the target was 60 mm, and the substrate heating temperature was 250° C.
The evaluated transistor each had a channel length (L) and a channel width (W) of 0.63 μm and 0.76 μm, respectively. FIGS. 41A and 41B show the Id-Vg characteristics when Vd are 0 V and 1.8 V. FIGS. 41A and 41B show the characteristics of the transistor not including the oxide semiconductor layer 122 and those of the transistor including the oxide semiconductor layer 122, respectively, which are also shown in Table 1.









TABLE 1






FIG. 37(A)
FIG. 37(B)


Oxide semiconductor layer 122
without
with

















Ion[μA]@Vd = 1.8 V, Vg = 1.8 V
0.1
0.6


μFE lin. [cm2/Vs] @Vd = 0.1 V
2.2
4.9


Vturn-on [V] @Vd = 1.8 V
0.6
0.2


S-value [mV/dec] @Vd = 0.1 V
125.9
92.5


Vth [V] @Vd = 1.8 V
1.20
0.81


μFE sat. [cm2/Vs] @Vd = 1.8 V
1.7
3.8


Id [A] @Vd = 1.8 V, Vg = 0 V
1.0E−14
1.0E−16









It was found from Table 1 that the subthreshold swing (S-value) was decreased and the on-state current was increased in the transistor including the oxide semiconductor layer 122 while it remained in the normally-off state: the transistor characteristics were improved according to one embodiment of the present invention.
This application is based on Japanese Patent Application serial no. 2014-247754 filed with Japan Patent Office on Dec. 8, 2014, the entire contents of which are hereby incorporated by reference.

## Claims

1. A semiconductor device comprising:
a first insulating layer;
a first oxide semiconductor layer over the first insulating layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a third oxide semiconductor layer over the second oxide semiconductor layer;
a source electrode layer and a drain electrode layer each over the third oxide semiconductor layer;
a fourth oxide semiconductor layer over the source electrode layer, the drain electrode layer, and the third oxide semiconductor layer;
a gate insulating layer over the fourth oxide semiconductor layer;
a gate electrode layer over the gate insulating layer and overlapping with the source electrode layer, the drain electrode layer, and the fourth oxide semiconductor layer; and
a second insulating layer over the first insulating layer, the source electrode layer, the gate electrode layer, and the drain electrode layer,
wherein the fourth oxide semiconductor layer is in contact with a side surface of the first oxide semiconductor layer, a side surface of the second oxide semiconductor layer and a side surface of the third oxide semiconductor layer in a channel width direction,
wherein an indium content of the third oxide semiconductor layer is higher than an indium content of the second oxide semiconductor layer, and
wherein oxygen is added to the first oxide semiconductor layer.

2. The semiconductor device according to claim 1, wherein the second insulating layer has a barrier property against water, hydrogen, and oxygen.

3. The semiconductor device according to claim 1, wherein the second insulating layer is capable of supplying oxygen.

4. The semiconductor device according to claim 1, wherein the second insulating layer comprises aluminum oxide.

5. An electronic device comprising the semiconductor device according to claim 1,
wherein the semiconductor device further comprises a microphone, a speaker, and a housing.

6. A semiconductor device comprising:
a first insulating layer;
a first oxide semiconductor layer over the first insulating layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a third oxide semiconductor layer over the second oxide semiconductor layer;
a source electrode layer and a drain electrode layer each over the third oxide semiconductor layer;
a fourth oxide semiconductor layer over the source electrode layer, the drain electrode layer, and the third oxide semiconductor layer;
a gate insulating layer over the fourth oxide semiconductor layer;
a gate electrode layer over the gate insulating layer and overlapping with the source electrode layer, the drain electrode layer, and the fourth oxide semiconductor layer;
an intermediate layer over the first insulating layer, the source electrode layer, the gate electrode layer, and the drain electrode layer; and
a second insulating layer over the first insulating layer and the intermediate layer,
wherein the intermediate layer surrounds an outer periphery of each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer,
wherein the fourth oxide semiconductor layer is in contact with a side surface of the first oxide semiconductor layer, a side surface of the second oxide semiconductor layer and a side surface of the third oxide semiconductor layer in a channel width direction,
wherein an indium content of the third oxide semiconductor layer is higher than an indium content of the second oxide semiconductor layer, and
wherein oxygen is added to the first oxide semiconductor layer.

7. The semiconductor device according to claim 6, wherein the second insulating layer has a barrier property against water, hydrogen, and oxygen.

8. The semiconductor device according to claim 6, wherein the second insulating layer is capable of supplying oxygen.

9. The semiconductor device according to claim 6, wherein the second insulating layer comprises aluminum oxide.

10. The semiconductor device according to claim 6, wherein the intermediate layer has a barrier property against water, hydrogen, and oxygen.

11. The semiconductor device according to claim 6, wherein the intermediate layer comprises any one of aluminum oxide, hafnium oxide, zirconium oxide, titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, tellurium oxide, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride, cobalt nitride, silicon nitride, manganese nitride, and hafnium nitride.

12. An electronic device comprising the semiconductor device according to claim 6,
wherein the semiconductor device further comprises a microphone, a speaker, and a housing.

13. The semiconductor device according to claim 1,
wherein adding oxygen is performed by an ion doping method, an ion implantation method, or a plasma immersion ion implantation method.

14. The semiconductor device according to claim 6,
wherein adding oxygen is performed by an ion doping method, an ion implantation method, or a plasma immersion ion implantation method.