# Patent

## Title
Managing the operation of a semiconductor device under varying load conditions

## Abstract

A system for managing the operation of a semiconductor device in accordance with varying load conditions that affect the power being dissipated by the semiconductor device, includes a sensor for measuring a temperature related to the junction temperature of an operating semiconductor device; electronic components for measuring the real-time operating load conditions of the operating semiconductor device; and a computer that is adapted by computer executable program instructions to perform the steps of:

    
    
        (a) determining the power being dissipated by the operating semiconductor device in accordance with the measured real-time operating load conditions of the semiconductor device;
        (b) determining a dynamic temperature cutback threshold for the operating semiconductor device in accordance with the determination of the power being dissipated; and
        (c) managing the operation of the semiconductor device in accordance with the measured temperature and the dynamic temperature cutback threshold.

## Background
BACKGROUND OF THE INVENTION
The present invention pertains to managing the operation of a semiconductor device under varying load conditions that affect the power being dissipated by the semiconductor device.
The power dissipated by a semiconductor device is dissipated as heat, which causes the temperature of the semiconductor device to rise. After prolonged continuous usage, the temperature of an operating semiconductor device, such as a power amplifier, may rise to such an extent that the semiconductor device overheats and fails. In order to prevent such failure, the operation of the semiconductor device is managed by determining the junction temperature of the semiconductor device and cutting back or interrupting the operation of the semiconductor device when the junction temperature reaches a specified maximum attainable junction temperature (TJMAX) for the semiconductor device. The junction temperature is the temperature at the junction of the output transistor of the semiconductor device.
Typically a temperature related to the junction temperature of the semiconductor device is measured by a temperature sensor disposed on the case of the semiconductor device. While such a measurement provides an approximate measurement of the junction temperature, the difference between the temperature of the case at the location of the temperature sensor and the actual junction temperature varies under varying operating conditions of the semiconductor device because such difference is affected by the power dissipation of the semiconductor device.
For semiconductor devices, such as radio frequency (RF) power amplifiers that experience varying load (antenna) conditions, it is desirable to use a semiconductor device that has a specified maximum attainable junction temperature (TJMAX) that guarantees safe operating temperatures for high power-dissipation loads. However, because TJMAX is specified as an absolute maximum by the semiconductor manufacturer, the sensor temperature cutback threshold (TCB) must be overly conservative to account for the worst case power dissipation conditions which vary as the load changes for static thermal management implementations.
Also, since power dissipation is estimated to be the difference between the power supplied to the semiconductor device and the power delivered by the semiconductor device to the load, it is difficult to quantify power dissipation for non-sinusoidal time-varying signals, modulated signals, and loads that cause reflected power at high frequencies.
SUMMARY OF THE INVENTION
The present invention provides a method of managing the operation of a semiconductor device in accordance with varying load conditions that affect the power being dissipated by the semiconductor device, comprising the steps of:
(a) measuring a temperature related to the junction temperature of an operating semiconductor device;
(b) measuring the real-time operating load conditions of the operating semiconductor device;
(c) determining the power being dissipated by the operating semiconductor device in accordance with the measured real-time operating load conditions of the semiconductor device;
(d) determining a dynamic temperature cutback threshold for the operating semiconductor device in accordance with the determination of the power being dissipated; and
(e) managing the operation of the semiconductor device in accordance with the measured temperature and the dynamic temperature cutback threshold.
The present invention additionally provides a system for performing the above-described method and computer readable storage media including computer executable program instructions for causing one or more computers to perform and/or enable the steps of the respective above-described method.
Additional features of the present invention are described with reference to the detailed description of the preferred embodiments.



BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a block diagram of an exemplary embodiment of a system according to the present invention for managing the operation of a semiconductor device in accordance with varying load conditions.
FIG. 2 is a block diagram showing the generic signal processing performed by the computer in the system of FIG. 1.
FIG. 3 is a block diagram more particularly showing the power dissipation determination step shown in FIG. 2.
FIG. 4 is a block diagram more particularly showing the dynamic temperature cutback threshold determination step shown in FIG. 2.
FIG. 5 is a flow diagram for the operation management step shown in FIG. 2.



DETAILED DESCRIPTION
Referring to FIG. 1, an exemplary embodiment of a system according to the present invention includes a temperature sensor 10, a DC voltage sensor 11, an input current sensor 12, a directional coupler 14, a first envelope detector 15, a second envelope detector 16, a first RMS converter 17, a second RMS converter 19, a set of analog-to-digital converters (ADC) 20, 21, 22, 24, 25, 26 and a computer 27. This exemplary embodiment manages the operation of a semiconductor device 30, such as an RF power amplifier, that is providing power to a load 31, such as an antenna.
The temperature sensor 10 is coupled to the case of the semiconductor device 30 for measuring a temperature related to the junction temperature of the semiconductor device 30. In some embodiments, the temperature sensor 10 is mounted on the case of semiconductor device. In other embodiments the temperature sensor 10 is mounted adjacent the case of the semiconductor device 30 on a common heatsink.
The DC voltage sensor 11 and the input current sensor 12 are coupled to a circuit that supplies power to the semiconductor device 30.
The directional coupler 14 is connected between the output of the semiconductor device 30 and the input of the load 31 for providing scaled samples of the forward and reflected power.
The first envelope detector 15 is coupled between the output of the directional coupler 14 and the input of the load 31 for measuring the peak power reflected back to the semiconductor device 30 from the load 31.
The second envelope detector 16 is coupled between the output of the directional coupler 14 and the input of the load 31 for measuring the peak forward power from the semiconductor device 30 to the load 31.
The first RMS converter 17 is coupled to the output of the second peak power detector 16 for measuring the average forward power from the semiconductor device 30 to the load 31. Some of the available integrated circuit technologies enable the peak forward power and average forward power measurements to be combined into one function.
The second RMS converter 19 is coupled to the output of the input current sensor 12 for measuring the RMS current supplied to the semiconductor device 30.
A first ADC 20 is connected to the first envelope detector 15 for converting an analog output signal from the first envelope detector 15 to a digital signal PPK-RFL representative of the peak power reflected back to the semiconductor device 30 from the load 31.
A second ADC 21 is connected to the second envelope detector 16 for converting an analog output signal from the second envelope detector 16 to a digital signal PPK-FWD representative of the peak forward power from the semiconductor device 30 to the load 31.
A third ADC 22 is connected to the first RMS converter 17 for converting an analog output signal from the first RMS converter 17 to a digital signal PAV-FWD representative of the average forward power from the semiconductor device 30 to the load 31.
A fourth ADC 24 is connected to the second RMS converter 19 for converting an analog output signal from the second RMS converter 19 to a digital signal IDC representative of the RMS current supplied to the semiconductor device 30.
A fifth ADC 25 is connected to the DC voltage sensor 11 for converting an analog output signal from the DC voltage sensor 11 to a digital signal VDC representative of the DC voltage supplied to the semiconductor device 30.
A sixth ADC 26 is connected to the temperature sensor 10 for converting an analog output signal from the temperature sensor 10 to a digital signal TMEAS representative of the measured junction temperature of the semiconductor device 30.
The computer 27 contains computer readable storage media that includes computer executable program instructions for causing the computer 27 to execute the routines (processing functions) of the computer 27 that are described herein. These instructions are stored in computer readable storage media of the computer when the computer is manufactured and/or upon being downloaded via the Internet or from portable computer readable storage media containing such instructions. The computer 27 may be embodied in a combination of physically discrete computers, with the routines described herein being executed by the combination of discrete computers.
The computer 27 processes the digital signals PPK-RFL, PPK-FWD, PAV-FWD, IDC, VDC, TMEAS, which are representative of the operating load conditions and the measured junction temperature of the semiconductor device 30, to manage the operation of the semiconductor device 30, as shown in more detail in FIGS. 2, 3, 4 and 5.
Referring to FIG. 2, the computer 27 processes the digital signals PPK-RFL, PPK-FWD, PAV-FWD, IDC, VDC, to determine the power being dissipated PDISP by the operating semiconductor device 30, as shown at 34.
The computer 27 then processes a signal representative of the dissipated power PDISP to determine a dynamic temperature cutback threshold TCB for the operating semiconductor device 30, as shown at 35.
The computer 27 processes the digital signal TMEAS and the dynamic temperature cutback threshold TCB to manage the operation of the operating semiconductor device 30, as shown at 36.
Referring to FIG. 3, the computer 27 processes the digital signal PPK-FWD representative of the measured peak forward power from the semiconductor device 30 to the load 31 with the digital signal PAV-FWD representative of the measured average forward power from the semiconductor device 30 to the load 31 to determine the peak-to-average forward power ratio (PPK-FWD)/(PAV-FWD), as shown at 38.
The computer 27 then processes the peak-to-average forward power ratio (PPK-FWD)/(PAV-FWD) with the digital signal PPK-RFL representative of the peak power reflected back to the semiconductor device 30 from the load 31 to determine the average reflected power PRFL, as shown at 39.
The computer 27 then processes the average reflected power PRFL with the digital signal PAV-FWD representative of the measured average forward power from the semiconductor device 30 to the load 31 to determine the output power (PFWD-PRFL)/ILFACTOR being delivered from the semiconductor device 30, as shown at 40. ILFACTOR is the insertion loss from the semiconductor device 30 to the load 31.
The computer 27 processes the digital signal IDC representative of the RMS current being supplied to the semiconductor device 30 together with the signal VDC representative of the voltage being supplied to the semiconductor device 30 to measure the power (VDC)/(IDC) being supplied to the semiconductor device 30, as shown at 41.
The computer 27 processes a signal (PFWD-PRFL)/ILFACTOR representative of the output power being delivered from the semiconductor device with a signal (VDC)/(IDC) representative of the measured power (VDC)/(IDC) being supplied to the semiconductor device to determine the power being dissipated by the semiconductor device 30, in accordance with the equation,

PDISP=(VDC)(IDC)−{(PFWD−PRFL)/ILFACTOR}  [Eq. 1]

as shown at 42.

Referring to FIG. 4, the computer 27 then processes a signal PDISP representative of the power being dissipated by the semiconductor device 30 with a signal representative of the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device 30, a signal representative of the specified thermal resistance Rθ(C-S) from the case of the semiconductor device 30 to the temperature sensor 10, and a signal TJMAX representative of the specified maximum attainable junction temperature of the semiconductor device 30 to determine the dynamic temperature cutback threshold TCB in accordance with:

TCB=TJMAX−{PDISP}{Rθ(J-C)}−{PDISP}{Rθ(C-S)}  [Eq. 2]

This determination of the dynamic temperature cutback threshold TCB compensates for variations in the difference between the temperature measured by the temperature sensor 10 and the actual junction temperature that are caused by the physical separation of the junction from the temperature sensor 10, the particular temperature sensor mounting technique and variations in the power dissipation of the semiconductor device 30 under varying operating conditions, such as waveform, frequency and load variations.
This temperature difference is a function of the power currently being dissipated PDISP by the semiconductor device and both a thermal resistance Rθ(J-C) that exists between the junction of the semiconductor device 30 and the case of the semiconductor device 30 and a thermal resistance Rθ(C-S) that exists between the case of the semiconductor device 30 and the temperature sensor 10. As the dissipated power increases the difference between the measured junction temperature and the actual junction temperature also increases.
The thermal resistance Rθ(C-S) is a constant specified by the manufacturer of the semiconductor device 30.
The thermal resistance Rθ(C-S) is a constant specified for the particular mounting of the temperature sensor 10 in relation to the semiconductor device 30. In some embodiments the temperature sensor 10 is mounted on the semiconductor device and in other embodiments the temperature sensor 10 is mounted adjacent the case of the semiconductor device 30 on a common heatsink.
FIG. 5 is a flow diagram for management of the semiconductor operation by the computer 27 in accordance with the measured temperature TMEAS of the semiconductor device 30 and the dynamic temperature cutback threshold TCB.
There are five modes of operation, as shown in the flow diagram. These modes of operation are described in a generic sense, because the semiconductor management operation described herein can be used for semiconductor devices other than those included in a power amplifier.
In the Idle mode, no power is applied to the semiconductor device 30. During this mode, measurements of the following six variables are taken as described above, but not processed by the computer 27: (1) the peak power reflected back to the semiconductor device 30 from the load 31, (2) the peak forward power from the semiconductor device 30 to the load 31, (3) the average forward power from the semiconductor device 30 to the load 31, (4) the RMS current supplied to the semiconductor device 30, (5) the DC voltage supplied to the semiconductor device 30, and (6) the junction temperature of the semiconductor device 30.
In the Full Power mode, maximum power is applied to the semiconductor device 30; measurements of the above described six variables are taken periodically; and the digital signals PPK-RFL, PPK-FWD, PAV-FWD, IDC, TMEAS provided by the set of ADC's 20, 21, 22, 24, 25, 26 are processed by the computer 27.
In the Set Cutback mode, maximum power is applied to the semiconductor device 30, and the dynamic temperature cutback threshold TCB is updated by the computer 27 in accordance with Equation 2.
In the Cutback mode, which is initiated when the measured junction temperature TMEAS exceeds the dynamic temperature cutback threshold TCB, the power supplied to the semiconductor device 30 is reduced, and the dynamic temperature cutback threshold TCB is updated by the computer 27 in accordance with Equation 2.
In the Failsafe mode, power is not supplied to the semiconductor device 30.
With reference to the flow diagram, TCB is the current dynamic cutback temperature threshold; Tnorm is the temperature threshold to return to the normal Full Power mode of operation; Tfault is the temperature threshold for cutting off the power supplied to the semiconductor device 30; TΔrec is a temperature change (decrease) required to return to the normal Full Power mode of operation; and tsettle is the settling time allowed after a power level adjustment.
In the flow diagram, temperature thresholds are denoted by Tsub(default), where T represents a temperature value, sub is the subscript defining the specific threshold, and the (default) field represents a qualifier that denotes an initialization value. Variables without the (default) qualifier represent current values instead of initialization values. For example, Twarn(default) denotes the initialization value of the warning temperature threshold, while Twarn denotes the current value of the warning temperature threshold. The delay value tsettle is used to allow for a settling time after a power level is changed in order to ignore any small transients caused by the power level changing.
Referring to the flow diagram, the management operation starts running in the Idle mode. In this mode the default settings are entered for the warning Twarn, fault Tfault, and normal Tnorm temperature thresholds. At this time the settling time tsettle is initialized as well as the mode of operation. When power is initially applied to the semiconductor device 30, the Full Power mode commences and the temperature thresholds and the settling time are reinitialized. All possible modes can return to the Idle mode by user intervention (not shown).
During the Full Power mode, the computer 27 ignores the digital signals PPK-RFL, PPK-FWD, PAV-FWD, IDC, VDC, TMEAS provided by the set of ADC's until a settling time has passed tsettle. After the system has stabilized, the dynamic cutback temperature threshold TCB is determined in accordance with Equation 2. If the current dynamic cutback temperature threshold TCB is less than the warning cutback temperature Twarn, the warning cutback temperature is set to the newly calculated dynamic cutback temperature threshold TCB. The computer 27 then determines if the measured sensor temperature TMEAS exceeds the warning cutback temperature Twarn. If this is the case, the power supplied to the semiconductor device 30 is reduced, and the management operation enters the Cutback mode. If the measured sensor temperature TMEAS has not exceeded the warning temperature the warning threshold is updated until the management operation either returns to the Idle mode or enters the In Cutback mode. It is important to note that the dynamic cutback temperature threshold TCB is degraded during an iteration of the management operation only when it is necessary to do so in order to prevent thermal runaway or repetitive stresses from incrementally damaging the semiconductor device 30.
Upon entering the Cutback mode the settling time is reinitialized to allow any transients from the power cutback to pass prior to beginning to update the fault threshold. The Cutback mode of management operation is similar to that of the Full Power mode, with the exception that the fault threshold Tfault is updated with the current dynamic cutback temperature threshold TCB. Should the measured sensor temperature TMEAS exceed the fault threshold, the management operation will enter the Failsafe mode in which power is removed from the semiconductor device 30 and then return to the Idle mode.
Although not shown in the flow diagram, the management operation returns to a previous Full Power mode when the normal temperature threshold (Tnorm) is reached. The normal temperature threshold is based on the current dynamic cutback temperature threshold TCB minus an offset TΔrec. Accordingly, if a transient event causes the semiconductor device 30 to dissipate such an amount of power in a short period of time as to cause a cutback, the management operation can recover should the measured junction temperature TMEAS decrease below the normal threshold Tnorm. In this situation the management operation can begin to provide full power to the semiconductor device 30, but the lower temperature cutback threshold TCB is retained.
Regarding the method claims, except for those steps that can only occur in the sequence in which they are recited, and except for those steps for which the occurrence of a given sequence is specifically recited or must be inferred, the steps of the method claims do not have to occur in the sequence in which they are recited.
The benefits specifically stated herein do not necessarily apply to every conceivable embodiment of the present invention. Further, such stated benefits of the present invention are only examples and should not be construed as the only benefits of the present invention.
While the above description contains many specificities, these should not be construed as limitations on the scope of the present invention, but rather as examples of the preferred embodiments described herein. Other variations are possible and the scope of the present invention should be determined not by the embodiments described herein but rather by the claims and their legal equivalents.

## Claims

1. A method of managing the operation of a semiconductor device in accordance with varying load conditions that affect the power being dissipated by the semiconductor device, comprising the steps of:
(a) measuring a temperature related to the junction temperature of an operating semiconductor device;
(b) measuring the real-time operating load conditions of the operating semiconductor device;
(c) determining the power being dissipated by the operating semiconductor device in accordance with the measured real-time operating load conditions of the semiconductor device;
(d) determining a dynamic temperature cutback threshold for the operating semiconductor device in accordance with the determination of the power being dissipated; and
(e) managing the operation of the semiconductor device in accordance with the measured temperature and the dynamic temperature cutback threshold.

2. A method according to claim 1, wherein step (b) comprises the steps of;
(f) measuring the power being supplied to the semiconductor device;
(g) measuring the forward power from the semiconductor device to a load;
(h) measuring the power reflected back to the semiconductor device from the load; and
wherein step (c) comprises the step of:
(i) processing signals representative of the power (VDC)(IDC) being supplied to the semiconductor device, the forward power PFWD from the semiconductor device to a load, and the power reflected PRFL back to the semiconductor device from the load to determine the power being dissipated PDISP by the semiconductor device in accordance with:


PDISP=(VDC) (IDC)−{(PFEW−PRFL)/ILFACTOR},



wherein ILFACTOR is the insertion loss factor from the semiconductor device to the load.

3. A method according to claim 2, wherein step (a) comprises the step of:
(j) using a temperature sensor mounted on or adjacent the case of the semiconductor device to measure said temperature related to the internal junction temperature of the semiconductor device; and
wherein step (d) comprises the step of;
(k) processing signals representative of the power being dissipated PDISP by the semiconductor device, the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device, the specified thermal resistance Rθ(C-S) from the case of the semiconductor device to the temperature sensor, and a specified maximum attainable junction temperature TJMAX of the semiconductor device to determine the dynamic temperature cutback threshold TCB in accordance with:


TCB=TJMAX−{PDISP}{Rθ(J-C)}−{Rθ(C-S)}.

4. A method according to claim 1, wherein step (a) comprises the step of:
(f) using a temperature sensor mounted on or adjacent the case of the semiconductor device to measure said temperature related to the internal junction temperature of the semiconductor device; and
wherein step (d) comprises the step of;
(g) processing signals representative of the power being dissipated PDISP by the semiconductor device, the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device, the specified thermal resistance Rθ(C-S) from the case of the semiconductor device to the temperature sensor, and a specified maximum attainable junction temperature TJMAX of the semiconductor device to determine the dynamic temperature cutback threshold TCB in accordance with:


TCB=TJMAX−{PDISP}{Rθ(J-C)}−{PDISP}{Rθ(C-S)}.

5. A system for managing the operation of a semiconductor device in accordance with varying load conditions that affect the power being dissipated by the semiconductor device, comprising:
means for measuring a temperature related to the junction temperature of an operating semiconductor device;
means for measuring the real-time operating load conditions of the operating semiconductor device;
computer means adapted for determining the power being dissipated by the operating semiconductor device in accordance with the measured real-time operating load conditions of the semiconductor device;
computer means adapted for determining a dynamic temperature cutback threshold for the operating semiconductor device in accordance with the determination of the power being dissipated; and
computer means adapted for managing the operation of the semiconductor device in accordance with the measured temperature and the dynamic temperature cutback threshold.

6. A system according to claim 5, wherein the means for measuring said operating conditions comprises:
means for measuring the power being supplied to the semiconductor device;
means for measuring the forward power from the semiconductor device to a load;
means for measuring the power reflected back to the semiconductor device from the load; and
wherein the computer that is adapted for determining the power being dissipated is adapted for processing signals representative of the power (VDC)(IDC) being supplied to the semiconductor device, the forward power PFWD from the semiconductor device to a load, and the power reflected PRFL back to the semiconductor device from the load to determine the power being dissipated PDISP by the semiconductor device in accordance with:


PDISP=(VDC)(IDC)−{(PFWD−PRFL)/ILFACTOR},



wherein ILFACTOR is the insertion loss factor from the semiconductor device to the load.

7. A system according to claim 5, wherein the means for measuring said temperature related to the internal junction temperature of the semiconductor device comprises a temperature sensor disposed on or adjacent the case of the semiconductor device; and
wherein the computer that is adapted for determining a dynamic temperature cutback threshold is adapted for processing signals representative of the power being dissipated PDISP by the semiconductor device, the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device, the specified thermal resistance Rθ(C-S) from the case of the semiconductor device to the temperature sensor, and a specified maximum attainable junction temperature TJMAX of the semiconductor device to determine the dynamic temperature cutback threshold TCB in accordance with:


TCB=TJMAX−{PDISP}{Rθ(J-C)}−{PDISP}{Rθ(C-S)}.

8. A system according to claim 5, wherein the means for measuring said temperature related to the internal junction temperature of the semiconductor device comprises a temperature sensor disposed on or adjacent the case of the semiconductor device; and
wherein the computer that is adapted for determining a dynamic temperature cutback threshold is adapted for processing signals representative of the power being dissipated PDISP by the semiconductor device, the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device, the specified thermal resistance Rθ(C-S) from the case of the semiconductor device to the temperature sensor, and a specified maximum attainable junction temperature TJMAX of the semiconductor device to determine the dynamic temperature cutback threshold TCB in accordance with:


TCB=TJMAX−{PDISP}{Rθ(J-C)}−{PDISP}{Rθ(C-S)}.

9. A non-transitory computer readable storage medium for use with a computer in a system for managing the operation of a semiconductor device in accordance with varying load conditions that affect the power being dissipated by the semiconductor device; said system comprising: means for measuring a temperature related to the junction temperature of an operating semiconductor device; means for measuring the real-time operating load conditions of the operating semiconductor device; and said computer,
wherein the computer readable storage medium contains computer executable program instructions for causing the computer to perform the steps of:
(a) determining the power being dissipated by the operating semiconductor device in accordance with the measured real-time operating load conditions of the semiconductor device;
(b) determining a dynamic temperature cutback threshold for the operating semiconductor device in accordance with the determination of the power being dissipated; and
(c) managing the operation of the semiconductor device in accordance with the measured temperature and the dynamic temperature cutback threshold.

10. A non-transitory computer readable storage medium according to claim 9, wherein the means for measuring the real-time operating load conditions of the operating semiconductor device is adapted for measuring the power being supplied to the semiconductor device, the forward power from the semiconductor device to a load; and the power reflected back to the semiconductor device from the load; and
wherein the computer readable storage medium contains computer executable program instructions for causing the computer to perform step (a) by processing signals representative of the power (VDC)(IDC) being supplied to the semiconductor device, the forward power PFWD from the semiconductor device to a load, and the power reflected PRFL back to the semiconductor device from the load to determine the power being dissipated PDISP by the semiconductor device in accordance with:


PDISP=(VDC)(IDC)−{(PFWD−PRFL)/ILFACTOR},



wherein ILFACTOR is the insertion loss factor from the semiconductor device to the load.

11. A non-transitory computer readable storage medium according to claim 10, wherein the temperature related to the internal junction temperature of the semiconductor device is measured by using a temperature sensor mounted on or adjacent the case of the semiconductor device; and
wherein the computer readable storage medium contains computer executable program instructions for causing the computer to perform step (b) by processing signals representative of the power being dissipated PDISP by the semiconductor device, the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device, the specified thermal resistance Rθ(C-S) from the case of the semiconductor device to the temperature sensor, and a specified maximum attainable junction temperature TJMAX of the semiconductor device to determine the dynamic temperature cutback threshold TCB in accordance with:


TCB=TJMAX−{PDISP}{Rθ(J-C)}−{PDISP}{Rθ(C-S)}.

12. A non-transitory computer readable storage medium according to claim 9, wherein the temperature related to the internal junction temperature of the semiconductor device is measured by using a temperature sensor mounted on or adjacent the case of the semiconductor device; and
wherein the computer readable storage medium contains computer executable program instructions for causing the computer to perform step (b) by processing signals representative of the power being dissipated PDISP by the semiconductor device, the specified thermal resistance Rθ(J-C) from the semiconductor junction to the case of the semiconductor device, the specified thermal resistance Rθ(C-S) from the case of the semiconductor device to the temperature sensor, and a specified maximum attainable junction temperature TJMAX of the semiconductor device to determine the dynamic temperature cutback threshold TCB in accordance with:


TCB=TJMAX−{PDISP}{Rθ(J-C)}−{PDISP}{Rθ(C-S)}.