Electronics Manufacturing Data Request Sheet

Re: Greenhouse Gas Reporting Program: Proposed Amendments and Confidentiality Determinations for Subpart I

Commenters are encourage to submit available data with their comments using the four worksheets in this workbook, as applic

Direct your comments to Docket ID No. EPA–HQ–OAR–2011-0028. The EPA’s policy is that all comments received will be i

online at http://www.regulations.gov, including any personal information provided, unless the comment includes information c

whose disclosure is restricted by statute. 

Do not submit information that you consider to be CBI or otherwise protected through http://www.regulations.gov or e

hand/courier delivery address listed above, attention: Docket ID No. EPA-HQ-OAR-2011-0028. The http://www.regulations.g

know your identity or contact information unless you provide it in the body of your comment. If you send an email comment d

email address will be automatically captured and included as part of the comment that is placed in the public docket and made 

recommends that you include your name and other contact information in the body of your comment and with any disk or CD-

difficulties and cannot contact you for clarification, the EPA may not be able to consider your comment. Electronic files shoul

any defects or viruses.
ations for Subpart I

 this workbook, as applicable. 

mments received will be included in the public docket without change and may be made available 

nt includes information claimed to be confidential business information (CBI) or other information 

ww.regulations.gov or email. Send or deliver information identified as CBI to only the mail or 

http://www.regulations.gov website is an “anonymous access” system, which means the EPA will not 

end an email comment directly to the EPA without going through http://www.regulations.gov, your 

public docket and made available on the Internet. If you submit an electronic comment, the EPA 

nd with any disk or CD-ROM you submit. If the EPA cannot read your comment due to technical 

nt. Electronic files should avoid the use of special characters, any form of encryption, and be free of 
Electronics Manufacturing Data Request Sheet: Semiconductor Gas Utilization and By-product Formation Ra

Name

Telephone

Email

Organization

Location of Study Date of 

Measurement

Substrate Size 

(Si wafer - mm)

Measurement 

Method / Protocol

Number of Wafers 

in Study

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

Commenters are encouraged to submit available data regarding gas utilization and by-product formation rates for any of the pr

types or sub-types in the semiconductor manufacturing industry that could be used to further update the default emission factor

semiconductors using this "Electronics Manufacturing Data Request Sheet."

Contact Information
35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50
y-product Formation Rate Data

Achieved ISMI 

Fluorine target 

mass balance >90%

Explanation if 

Mass Balance 

Target was not Met

Equipment 

Manufacturer 

Name

Equipment 

Model 

Number

Equipment 

Platform Type

FUBAR

ation rates for any of the process 

e the default emission factors for 

Equipment 

Process 

Chamber Type

Process Number Process Gas CAS Lookup

Specify "Other fGHG" Name

Specify "Other fGHG" CAS No.

Specify “Other fGHG” Chemical 

Formula

Process Type

Epoxy1 8596 CH3CH3CH3

Specify "Other Process 

Type" Name

Estimate of U.S. share 

of selected process 

usage category

Film Type Etched Specify "Other" Film 

Type (if applicable)

metal etch

Epoxy

Additional Information 

Regarding Film Type 

Etched

Feature Type 

Etched Specify "Other" Feature

Emission 

Factor (1-Ui)

Relative 

Standard 

Deviation

Best Feature

BCF4

BCF4 Relative 

Standard 

Deviation

BC2F6

BC2F6 

Relative 

Standard 

Deviation

BC3F8

BC3F8 

Relative 

Standard 

Deviation

BC4F6

BC4F6 

Relative 

Standard 

Deviation

BC4F8

BC4F8 

Relative 

Standard 

Deviation

BCHF3

BCHF3 

Relative 

Standard 

Deviation

B-Other-1

B-Other-1 Relative 

Standard Deviation

Specify "BOther-1"

Electronics Manufacturing Data Request Sheet: MEMS, LCD, and PV Gas Utilization and By-product Forma

Name

Telephone

Email

Organization

Location of Study Date of 

Measurement Substrate Size

Specify units of 

Substrate Size 

(e.g., mm)

Measurement 

Method / Protocol

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

Commenters are encouraged to submit available data regarding gas utilization and by-product formation rates for any of the pro

in the MEMS, LCD, or PV manufacturing industry that could be used to further update the default emission factors for MEMS

"Electronics Manufacturing Data Request Sheet."

Contact Information
35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50
ion and By-product Formation Rate Data

Number of 

Substrates in Study

Achieved ISMI 

Fluorine target 

mass balance >90%

Explanation if 

Mass Balance 

Target was not Met

Equipment 

Manufacturer 

Name

Equipment 

Model 

Number

rmation rates for any of the process types or sub-types 

ult emission factors for MEMS, LCD, or PV using this 

Equipment 

Platform Type

Equipment 

Process 

Chamber Type

Process Number Process Gas

CAS Lookup Specify "Other fGHG" Name

Specify "Other fGHG" CAS No.

Specify “Other fGHG” Chemical 

Formula

Process Type Specify "Other Process 

Type" Name

Estimate of U.S. share 

of selected process 

usage category

Film Type Etched Specify "Other" Film 

Type (if applicable)

Additional Information 

Regarding Film Type 

Etched

Feature Type 

Etched

Specify "Other" Feature

Emission 

Factor (1-U

i

)

Relative 

Standard 

Deviation

BCF4

BCF4 Relative 

Standard 

Deviation

BC2F6

BC2F6 

Relative 

Standard 

Deviation

BC3F8

BC3F8 

Relative 

Standard 

Deviation

BC4F6

BC4F6 

Relative 

Standard 

Deviation

BC4F8

BC4F8 

Relative 

Standard 

Deviation

BCHF3

BCHF3 

Relative 

Standard 

Deviation

B-Other-1 B-Other-1 Relative 

Standard Deviation

Specify "BOther-1"

Electronics Manufacturing Data Request Sheet: N2O Emission Factor

Name

Telephone

Email

Organization

Location of Study Date of 

Measurement Substrate Size

Specify units of 

Substrate Size 

(e.g., mm)

Measurement 

Method / Protocol

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

Commenters are encouraged to submit available data regarding the revised N2O emission factor using this "Electronics 

Manufacturing Data Request Sheet."

Contact Information
35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50
Number of 

Substrates or 

Wafers in Study

Equipment 

Manufacturer 

Name

Equipment 

Model 

Number

Equipment 

Platform Type

Equipment 

Process 

Chamber Type

Process Number

 using this "Electronics 

Process Type Specify "Other Process 

Type" Name

N2O Emission 

Factor (1-Ui)

Relative 

Standard 

Deviation

Electronics Manufacturing Data Request Sheet: DRE 

Name

Telephone

Email

Organization

Test Date Product Type Substrate Size

Specify units of 

Substrate Size (e.g., 

mm)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

Commenters are encouraged to submit available DRE data for all of the 

electronics manufacturing industry segments (semiconductors, MEMS, 

LCD, and PV) using this "Electronics Manufacturing Data Request Sheet."

Contact Information
33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50
Abatement System 

Manufacturer 

Abatement System 

Model

Abatement System 

Model Number

Abatement 

System 

Description

Date of Installation

Abatement System 

Age (Years) Process Type Specify "Other Process Type" Name

POU or Centralized 

Abatement System?

Gas Abated CAS 

Lookup

Specify 

"Other fGHG" 

Name

Specify 

"Other fGHG" 

CAS No.

Specify “Other fGHG” Chemical 

Formula

DRE

Relative Standard 

Deviation of DRE 

Value

Was the DRE 

Benchmark Met?

Was the system 

properly installed, 

operated, and 

maintained?

Was the abatement 

system designed for FGHG Abatement?

Dilution Factor

Relative Standard 

Deviation of 

Dilution Factor