**Electronics Manufacturing Data Request Sheet**

**Re: Greenhouse Gas Reporting Program: Proposed Amendments and Confidentiality Determinations for Subpart I**

Commenters are encourage to submit available data with their comments using the four worksheets in this workbook, as applicable.

Direct your comments to Docket ID No. EPA–HQ–OAR–2011-0028. The EPA’s policy is that all comments received will be included in the public docket without change and may be made available online at http://www.regulations.gov, including any personal information provided, unless the comment includes information claimed to be confidential business information (CBI) or other information whose disclosure is restricted by statute.

**Do not submit information that you consider to be CBI or otherwise protected through http://www.regulations.gov or email** hand/courier delivery address listed above, attention: Docket ID No. EPA-HQ-OAR-2011-0028. The http://www.regulations.gov website is an “anonymous access” system, which means the EPA will not know your identity or contact information unless you provide it in the body of your comment. If you send an email comment directly to the EPA without going through http://www.regulations.gov, your email address will be automatically captured and included as part of the comment that is placed in the public docket and made available on the Internet. If you submit an electronic comment, the EPA recommends that you include your name and other contact information in the body of your comment and with any disk or CD-ROM you submit. If the EPA cannot read your comment due to technical difficulties and cannot contact you for clarification, the EPA may not be able to consider your comment. Electronic files should avoid the use of special characters, any form of encryption, and be free of any defects or viruses.**Re: Greenhouse Gas Reporting Program: Proposed Amendments and Confidentiality Determinations for Subpart I**

Commenters are encourage to submit available data with their comments using the four worksheets in this workbook, as applicable.

Direct your comments to Docket ID No. EPA–HQ–OAR–2011-0028. The EPA’s policy is that all comments received will be included in the public docket without change and may be made available online at http://www.regulations.gov, including any personal information provided, unless the comment includes information claimed to be confidential business information (CBI) or other information

**Do not submit information that you consider to be CBI or otherwise protected through http://www.regulations.gov or email**. Send or deliver information identified as CBI to only the mail or hand/courier delivery address listed above, attention: Docket ID No. EPA-HQ-OAR-2011-0028. The http://www.regulations.gov website is an “anonymous access” system, which means the EPA will not know your identity or contact information unless you provide it in the body of your comment. If you send an email comment directly to the EPA without going through http://www.regulations.gov, your email address will be automatically captured and included as part of the comment that is placed in the public docket and made available on the Internet. If you submit an electronic comment, the EPA recommends that you include your name and other contact information in the body of your comment and with any disk or CD-ROM you submit. If the EPA cannot read your comment due to technical difficulties and cannot contact you for clarification, the EPA may not be able to consider your comment. Electronic files should avoid the use of special characters, any form of encryption, and be free of

### Electronics Manufacturing Data Request Sheet: Semiconductor Gas Utilization and By-product Formation Rate Data

**Name Telephone**  **Email Organization** 

**Location of Study Date of** 

**Measurement Substrate Size** 

**(Si wafer - mm) Measurement** 

**Method / Protocol Number of Wafers**  **in Study**

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Commenters are encouraged to submit available data regarding gas utilization and by-product formation rates for any of the process types or sub-types in the semiconductor manufacturing industry that could be used to further update the default emission factors for semiconductors using this "Electronics Manufacturing Data Request Sheet."

**Contact Information**35

36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

### Electronics Manufacturing Data Request Sheet: Semiconductor Gas Utilization and By-product Formation Rate Data

**Achieved ISMI Fluorine target**  **mass balance >90% Explanation if**  **Mass Balance Target was not Met**  **Equipment**

**Manufacturer Name**  **Equipment**

**Model Number**  **Equipment**

**Platform Type**

FUBAR Commenters are encouraged to submit available data regarding gas utilization and by-product formation rates for any of the process types or sub-types in the semiconductor manufacturing industry that could be used to further update the default emission factors for**Equipment**

**Process Chamber Type**  **Process Number Process Gas**  **CAS Lookup Specify "Other f** 

**GHG" Name Specify "Other f** 

**GHG" CAS No. Specify “Other f** 

**GHG” Chemical Formula**  **Process Type**

Epoxy1 8596 CH3CH3CH3**Specify "Other Process**

**Type" Name Estimate of U.S. share** 

**of selected process usage category**  **Film Type Etched Specify "Other" Film**  **Type (if applicable)**

metal etch Epoxy**Additional Information**

**Regarding Film Type Etched**  **Feature Type**

**Etched Specify "Other" Feature**  **Emission Factor (1-U** **i )**  **Relative**

**Standard Deviation** 

Best Feature**BCF4 BCF4 Relative**  **Standard Deviation**  **BC2F6 BC2F6**  **Relative Standard**  **Deviation BC3F8**  **BC3F8 Relative**  **Standard Deviation**  **BC4F6 BC4F6** 

**Relative Standard**  **Deviation BC4F8**  **BC4F8 Relative**  **Standard Deviation**  **BCHF3 BCHF3**  **Relative Standard**  **Deviation B-Other-1** **B-Other-1 Relative**

**Standard Deviation Specify "B**  **Other-1"**

### Electronics Manufacturing Data Request Sheet: MEMS, LCD, and PV Gas Utilization and By-product Formation Rate Data

**Name Telephone**  **Email Organization** 

**Location of Study Date of** 

**Measurement Substrate Size**  **Specify units of Substrate Size**  **(e.g., mm) Measurement** 

**Method / Protocol**

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Commenters are encouraged to submit available data regarding gas utilization and by-product formation rates for any of the process types or sub-types in the MEMS, LCD, or PV manufacturing industry that could be used to further update the default emission factors for MEMS, LCD, or PV using this "Electronics Manufacturing Data Request Sheet."

**Contact Information**35

36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

### Electronics Manufacturing Data Request Sheet: MEMS, LCD, and PV Gas Utilization and By-product Formation Rate Data

**Number of Substrates in Study**  **Achieved ISMI**

**Fluorine target mass balance >90%**  **Explanation if Mass Balance**  **Target was not Met Equipment** 

**Manufacturer Name**  **Equipment**

**Model Number**  Commenters are encouraged to submit available data regarding gas utilization and by-product formation rates for any of the process types or sub-types in the MEMS, LCD, or PV manufacturing industry that could be used to further update the default emission factors for MEMS, LCD, or PV using this**Equipment**

**Platform Type Equipment** 

**Process Chamber Type**  **Process Number Process Gas** **CAS Lookup Specify "Other f**  **GHG" Name Specify "Other f** 

**GHG" CAS No. Specify “Other f** 

**GHG” Chemical Formula** **Process Type Specify "Other Process**  **Type" Name Estimate of U.S. share** 

**of selected process usage category** **Film Type Etched Specify "Other" Film**  **Type (if applicable) Additional Information**  **Regarding Film Type Etched**  **Feature Type**

**Etched Specify "Other" Feature**  **Emission Factor (1-U** **i )**  **Relative**

**Standard Deviation**  **BCF4 BCF4 Relative**  **Standard Deviation**  **BC2F6 BC2F6** 

**Relative Standard**  **Deviation BC3F8**  **BC3F8 Relative**  **Standard Deviation**  **BC4F6 BC4F6**  **Relative Standard**  **Deviation BC4F8**  **BC4F8 Relative**  **Standard Deviation** **BCHF3 BCHF3**  **Relative Standard**  **Deviation B-Other-1**  **B-Other-1 Relative Standard Deviation**  **Specify "B Other-1"** 

### Electronics Manufacturing Data Request Sheet: N2O Emission Factor

**Name Telephone**  **Email Organization** 

**Location of Study Date of** 

**Measurement Substrate Size**  **Specify units of Substrate Size**  **(e.g., mm) Measurement** 

**Method / Protocol**

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Commenters are encouraged to submit available data regarding the revised N2O emission factor using this "Electronics Manufacturing Data Request Sheet."

**Contact Information**35

36 37 38 39 40 41 42 43 44 45 46 47 48 49 50**Number of**

**Substrates or Wafers in Study**  **Equipment**

**Manufacturer Name**  **Equipment**

**Model Number**  **Equipment**

**Platform Type Equipment** 

**Process Chamber Type** **Process Number** Commenters are encouraged to submit available data regarding the revised N2O emission factor using this "Electronics**Process Type Specify "Other Process**  **Type" Name N2O Emission** 

**Factor (1-U i** **) Relative** 

**Standard Deviation** 

### Electronics Manufacturing Data Request Sheet: DRE

**Name Telephone**  **Email Organization** 

**Test Date Product Type**  **Substrate Size Specify units of**  **Substrate Size (e.g., mm)** 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Commenters are encouraged to submit available DRE data for all of the electronics manufacturing industry segments (semiconductors, MEMS, LCD, and PV) using this "Electronics Manufacturing Data Request Sheet."

**Contact Information**33

34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50**Abatement System**

**Manufacturer Abatement System**  **Model Abatement System** 

**Model Number Abatement**  **System Description**  **Date of Installation Abatement System** 

**Age (Years) Process Type**  **Specify "Other Process Type" Name**  **POU or Centralized**

**Abatement System? Gas Abated**  **CAS Lookup**  **Specify**

**"Other f GHG"**  **Name Specify** 

**"Other f GHG"**  **CAS No. Specify “Other f** 

**GHG” Chemical Formula**  **DRE Relative Standard** 

**Deviation of DRE Value**  **Was the DRE**

**Benchmark Met? Was the system** 

**properly installed, operated, and**  **maintained? Was the abatement** 

**system designed for F GHG Abatement?** **Dilution Factor Relative Standard**  **Deviation of Dilution Factor**