Proposed Rule: 

Electronics Manufactur

EPA Climate Change Division 

*This training is provided solely for informational purposes. It does not provide legal advice, have leffect, or expressly or implicitly create, expand, or limit any legal rights, obligations, responsibilitiesor benefits in regard to any person. 
Electronics Manufacturing Pro

posal: Back

g round

• Electronics manufacturing included in the Pro

Additional Sources of Fluorinated GHGs 

• Proposal Si

gned by the Administrator on Marc

2010
 

•	 Proposal published in the Federal Register on 

2010
 

– 60 day comment period ends on June 11, 2010 

• Public Hearing on April 20 2010 in Washingto

Public Hearing on April 20, 2010 in Washingto
Electronics Manufacturing 

Pro

posal: Threshold Methods

• Proposed emissions

-based threshold: 25,000 based threshold: 25,000 

mtCO

2e/year with no abatement 

El iectron

ics P d Th h ld D i 

Emission Source 

Proposed Thres

h

old Determ

i

Method 

Semiconductors IPCC Tier 1 methodA + heat transfer fluids (10% 

and etch emissions); no abatement 

MEMS IPCC Tier 1 methodA,B; no abatement LCD IPCC Tier 1 methodA IPCC Tier 1 method ; no abatement ; no abatement PV Multiply gas purchases/consumption by the app

year GWP; no abatement 

A Assume 100 percent manufacturing capacity; manufacturing capacity= the facility’s full planned deB Emission factor was derived using the IPCC Tier 1 SF6 emission factor for semiconductors. 
t t

Electronics Manufacturing Proposal: Emissions Estimating Methods
 

• Semiconductor Manufacturing- Refined Method 

– Refined process categories and default emission factors 

• Permits direct measurement of process emission factors wh

– Gas-and facility-specific heel factors to determine gas consu

• Engineering model for apportioning gas use by process cate

•	 Other Electronics Manufacturing- Modified IPCC 

Method
 

– Default emission factors for 2 broad categories (clean and e– Also includes gas-and facility-specific heel factors 

•	 All El i M f i All Electronics Manufacturing 

– Emissions from heat transfer fluids 

• Mass-balance method 

– Eii f N Emissions from N2O processes 

• Default factors or facility measurements 
t t

t t t t t

Electronics Manufacturing Proposal: Reporting Controlled Emissions 

• To report controlled emissions: To report controlled emissions: 

– Requires certification that the abatement de

installed, operated, and maintained accordinmanuf ’ ifi i d ith facturers’ specifications and either: 

(A) EPA default value of 60%, accounting for uptim

–	 Certification that the abatement system is specifically 

f F or -GHG d N GHG and N2O ba atement 

(B) Measurement using EPA DRE Protocol, accou

uptime 

–	 Permits app

li

lication of DRE values to abatement syste

using a random sampling protocol 

•	 Minimum of 3 or 20% of abatement system class 

p y erear 
f

g

•	 EPA proposed nine process categories for each wafer s

mm, 200 mm, and 300 mm) 

oposed nine process categories for each wafer s

Selected Excerpts from Proposal: Semiconductor Manufacturing

–	 See Tables I-6, I-7, I-8 (pg. 18705-18708) 

•	 EPA is proposing a range of values for each default em

factor because the Agency has not yet received sufficieselect a specific value within each range (pg 	 . 18662).

•	 In a final rule, EPA intends to publish default emission 

gas utilization and by-product formation rates for eacategory, differentiating amongst 150 mm, 200 mm awafer technology to the extent feasible (pg. 18662). 
Selected Excerpts from Proposal: 

Semiconductor Manufacturing, cont

• Request for additional data (utilization and byproduct form

– the date of measurement, 

– achievement of fluorine mass balance, – associated standard deviations of measured factors, – the relevant emissions process types and categories (for the 

q y p 

and information including but not limited to: 

– the specific measurement method used (e.g., measurement usi

ISMI Guidelines), the date of measurement the relevant emissions process types and categories (for the patterning/etching process type noting both film type and etchwhere applicable), 

–	 substrate size (i.e., 150 mm, 200 mm, or 300 mm), – 

th b f f d i h he number 

of wa

fers used in the measurement stu

dy, 

– and the equipment manufacturer name and model number wh

considered confidential (pg. 18663). 
wafe tec o wit t e ts based o t e a et et 

Selected Excerpts from Proposal: Semiconductor Manufacturing, cont

• Using additional data received, EPA intends to develop default 

emission factors for each process category using a method of aggregation similar to the 2006 IPCC factor development methodology (pg. 18663). 

• 

If additional data are received in a timely fashion, EPA may de

draft emission factors prior to issuance of the final rule and widetermine an appropriate way to promptly and clearly inform 

regulated community (pg. 18663). regulated community (pg. 18663). 

• In developing emission factors for the final rule, EPA is also 

considering developing weighted average emission factors, for 

wafer technology, wit logy, 

h t

he weig weig 

hts based on t

he 

market pe netr

rates of process recipes used in current device manufacturing practices. Such weighted emission factors, if possible, may betrepresent actual emissions from installed manufacturing equipand operating processes We request comment on using a weiand operating processes. We request comment on using a weischeme and detailed information on how it would be developed implemented (pg. 18663) 
n

For Further Information 

• See EPA’s website at: 

– http://www.epa.gov/climatechange/emissions/subpa

• Preamble and regulatory text • Technical backgro d doc ments Technical background documents • Information and Fact Sheets 

• Docket ID number: Docket ID number: 

– EPA-HQ-OAR-2009-0927 – Access via: http://www.regulations.gov Access via: http://www.regulations.gov 

• Email: GHGMRR@epa.gov 

*This training is provided solely for informational purposes. It does not provide legal advice, have leffect, or expressly or implicitly create, expand, or limit any legal rights, obligations, responsibilitiesor benefits in regard to any person.