# Patent

## Title
Epoxy resin adhesive composition and perforated floor panel for clean room comprising the same

## Abstract

The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.

## Background
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to an epoxy resin adhesive composition and a perforated floor panel for a clean room comprising the same, and, more particularly, to an epoxy resin adhesive composition which provides high adhesivity between a base material and a counter material, for example, a base panel and a resin tile, which can easily emit heat because it provides thermal conductivity and which can reduce the generation of static electricity, and a perforated floor panel for a clean room comprising the same.
2. Description of the Related Art
Generally, an epoxy resin is widely used to prepare an epoxy adhesive composition for adhering a base material and a counter material because it has excellent water resistance, adhesivity and chemical resistance. An epoxy resin adhesive composition may include a curing agent for improving curability, and additives, such as a diluent and the like, for lowering viscosity and improving workability in addition to an epoxy resin.
However, the above-mentioned epoxy resin adhesive composition is problematic in that it cannot sufficiently meet the requirement of customers, and in that, with the passage of time, its weather resistance deteriorates, thus causing a yellowing phenomenon.
Further, a conventional epoxy resin adhesive composition is problematic in that its adhesivity and chemical resistance deteriorate early because its components and composition ratio thereof are not optimized. Further, a conventional epoxy resin adhesive composition is problematic in that, with the passage of time, the epoxy resin adhesive composition gradually reacts with carbon dioxide, moisture or the like in the air, so the outer surface thereof facing the air is fatally damaged, and a brush phenomenon in which an epoxy resin becomes white occurs.
SUMMARY OF THE INVENTION
Accordingly, the present invention has been devised to solve the above-mentioned problems, and an object of the present invention is to provide an epoxy resin adhesive composition which provides high adhesivity between a base material and a counter material, for example, a base panel and a resin tile, which can easily emit heat and which is can reduce the generation of static electricity, and a perforated floor panel for a clean room comprising the same.
Another object of the present invention is to provide an epoxy resin adhesive composition which can prevent the deterioration of adhesivity even in long-term use, which can prevent the discoloration of the outer surface thereof facing the air, which can improve chemical resistance and which does not produce environmental pollutants, and a perforated floor panel for a dean room comprising the same.
In order to accomplish the above object, a first aspect of the present invention provides an epoxy resin adhesive composition, which is a two-component epoxy resin adhesive composition, including: a main material; and a curing agent, wherein the main material includes 18 ̃25.7 wt % of a basic epoxy resin, 15 ̃22.4 wt % of a modified epoxy resin, 7.3 ̃13 wt % of a polyester resin for providing adhesivity, 7 ̃19.5 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.15 ̃30.2 wt % of epoxy dam for increasing adhesivity, 6 ̃15 wt % of graphite for providing conductivity, 8 ̃30 wt % of a first filler for providing viscosity, 5 ̃45 wt % of a second filler for providing thixotropy, and 0.01 ̃10 wt % of a dispersant for dispersing the first and second fillers, the curing agent includes 14 ̃30 wt % of a middle-viscosity amide compound, 10 ̃35 wt % of a low-viscosity amide compound, 1.1 ̃8.5 wt % of a catalyst for promoting curing, 0.5 ̃15 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.01 ̃8 wt % of aminosilane for increasing adhesivity, 10 ̃60 wt % of a first filler for providing viscosity, and 3 ̃17 wt % of a second filler for providing thixotropy, and the main material and the curing agent are mixed at a weight ratio of 2:1.
In the main material, the dispersant may include alkyl ammonium and the first filler is may include calcium carbonate (CaCO3), and in the curing agent, the catalyst may include peroxide or triphenyl bismuth and the first filler may include calcium carbonate (CaCO3).
A second aspect of the present invention provides a perforated floor panel for a clean room, including: a base panel made of a metal and having a plurality of vent holes obliquely formed between upper and lower surfaces thereof; a resin tile disposed on one side of the base panel and having a plurality of vent holes corresponding to the vent holes; and the epoxy resin adhesive composition disposed between the base panel and the resin the to integrate the base panel with the resin tile.



BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic sectional view showing a perforated floor panel for a clean room according to a second embodiment of the present invention.



REFERENCE NUMERALS


    
    
        1: Perforated floor panel
        2: Base panel
        3: Resin tile
        4: Epoxy resin adhesive composition
    
    


DESCRIPTION OF THE PREFERRED EMBODIMENTS
Hereinafter, an epoxy resin adhesive composition according to a first embodiment of the present invention and a perforated floor panel for a clean room comprising the epoxy resin adhesive composition according to a second embodiment of the present invention will be described with reference to FIG. 1.
The epoxy resin adhesive composition according to a first embodiment of the present invention, which is a two-component epoxy resin adhesive composition, includes: a main material; and a curing agent, wherein the main material includes 18 ̃25.7 wt % of a basic epoxy resin, 15 ̃22.4 wt % of a modified epoxy resin, 7.3 ̃13 wt % of a polyester resin for providing adhesivity, 7 ̃19.5 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.15 ̃30.2 wt % of epoxy silane for increasing adhesivity, 6 ̃15 wt % of graphite for providing conductivity, 8 ̃30 wt % of a first filler for providing viscosity, 5 ̃45 wt % of a second filler for providing thixotropy, and 0.01 ̃10 wt % of a dispersant for dispersing the first and second fillers, the curing agent includes 14 ̃30 wt % of a middle-viscosity amide compound, 10 ̃35 wt % of a low-viscosity amide compound, 1.1 ̃8.5 wt % of a catalyst for promoting curing, 0.5 ̃15 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.01 ̃8 wt % of aminosilane for increasing adhesivity, 10 ̃60 wt % of a first filler for providing viscosity, and 3 ̃17 wt % of a second filler for providing thixotropy, and the main material and the curing agent are mixed at a weight ratio of 2:1.
In the main material, the dispersant may include alkyl ammonium and the first filler may include calcium carbonate (CaCO3), and in the curing agent, the catalyst may include to peroxide or triphenyl bismuth and the first filler may include caldum carbonate (CaCO3).
Hereinafter, the above-mentioned epoxy resin adhesive composition will be described in more detail as follows.
In the main material, the basic epoxy resin (18 ̃25.7 wt %) is a liquid resin, and reacts with a curing agent to increase adhesivity. The modified epoxy resin (15 ̃22.4 wt %) is a high-viscosity resin, and serves to provide adhesivity. The polyester resin (7.3 ̃13 wt %) is an adhesive solid resin, and provides high adhesivity when it is diluted with a solvent. The methyl ethyl ketone (MEK) solvent (7 ̃19.5 wt %) is a solvent having a ketone group, and functions to adjust viscosity. The epoxy silane (0.15 ̃30.2 wt %), which is a silane having an epoxy group, improves adhesivity, and has reactivity with a curing agent. The graphite (6 ̃15 wt %), which is composed of carbon particles, may have an average particle size of about 1.5 μm in order to increase the mixability with other components, and serves to provide conductivity. The first filler (8 ̃30 wt %) may have an average particle size of about 3 μm in order to increase the mixability with other components, and serves to provide viscosity. The second filler (5 ̃45 wt %) is extracted from day, and provides thixotropy. The dispersant (0.01 ̃10 wt %) serves to disperse the first and second fillers. The amounts of the components included in the main material may be controlled such that the components are optimally mixed with each other, adhesivity is improved, and the deterioration of adhesivity is prevented even when the epoxy resin adhesive composition is used for a long period of time.
In the curing agent, the middle-viscosity amide compound (14 ̃30 wt %) serves to improve adhesivity, and the low-viscosity amide compound (10 ̃35 wt %) serves to adjust a curing speed. The catalyst (1.1 ̃8.5 wt %) is a cure promoter, and influences curing in speed. The methyl ethyl ketone (MEK) solvent (0.5 ̃15 wt %) is a solvent having a ketone group, and serves to adjust viscosity. The aminosilane (0.01 ̃8 wt %) serves to increase adhesivity. The first filler (10 ̃60 wt %) may have an average particle size of about 3 μm in order to increase the mixability with other components, and serves to provide viscosity. The second filler (3 ̃17 wt %) serves to provide thixotropy.
Further, the main material and the curing agent may be mixed at a weight ratio of 2:1 such that they are appropriately mixed with each other, adhesivity increases, and a curing speed is suitably controlled. When the mixing ratio thereof is not 2:1, at least one of mixing effect, adhesivity and curing speed cannot be satisfied at the desired level.
Specifically, in the main material, the dispersant may include alkyl ammonium, and the first filler may include calcium carbonate (CaCO3). Further, in the curing agent, the catalyst may include a peroxide or triphenyl bismuth, and the first filler may include calcium carbonate (CaCO3).
The components, structural formulae (or functions), composition ratios (wt %) and characteristics of the main material of the epoxy resin adhesive composition are given in Table 1 below, and the components, structural formulae (or functions), composition ratios (wt %) and characteristics of the curing agent of the epoxy resin adhesive composition are given in Table 2 below.







TABLE 1







Epoxy resin adhesive composition - main material












Component

Composition



Main
(raw
Structural formula
ratio



material
material)
(or function)
(wt %)
Characteristics






Basic
CH2OCHCH2—
 18~25.7
It is a liquid resin, it reacts



epoxy resin
(OC6H4C(CH3)

with a curing agent to




2C6H4OCH2CH(OH)

increase adhesivity and




CH2)m-OC6H4C(CH3)

hardness, it contains a




2C6H4OCH2CHOCH2

reactive diluent, it






deteriorates the viscosity






of a product in winter, and






it is easily used.



Modified
Rubber modified epoxy
 15~22.4
It is a high-viscosity liquid



epoxy resin


resin, and it provides






adhesivity.



Polyester
Tackiness improver
7.3~13 
It is an adhesive solid resin,



resin


and it provides strong






adhesivity when diluted in






a solvent.



MEK
CH3COC2H5
 7~19.5
It is a solvent having a



solvent


ketone group, and it is






used to adjust viscosity.



Epoxy
CH2OCH—(Si2)n-
0.15~30.2 
It is a silane having an



silane
CHOCH2

epoxy group, it is used to






improve adhesivity, and it






has reactivity to a curing






agent.



Graphite
C
6~15
It is composed of carbon






particles, it has an






average particle size of






1.5 micron, and it is used






to provide conductivity.



First filler
CaCo3
8~30
It includes spherical CaCo3






particles having an average






particle size of 3 micron,






and it reduces production






cost and provides viscous






characteristics.



Second
Thixotropy improver
5~45
It is extracted from clay,



filler


it is provides strong






thixotropy when added to a






raw material, and it serves






to prevent precipitation.



Dispersant
Alkyl ammonium
0.01~10  
It helps a filler to be






dispersed, and it serves to






prevent precipitation and






to decrease viscosity






somewhat.
















TABLE 2







Epoxy resin adhesive composition - curing agent












Component

Composition



Curing
(raw
Structural formula
ratio



agent
material)
(or function)
(wt %)
Characteristics






Middle-
—(NH—(CH2)5—CO)n-
14~30
It is an amide curing



viscosity
CH═CHCH2NH2

agent, it is solidified



amide


and crosslinked by the



compound


bonding of an amine






group and an epoxy






group at the end






thereof, it has middle






viscosity, and it






serves to improve






adhesivity.



Low-

10~35
It is an intermediate



viscosity


curing agent between



amide


amide and amine, it has



compound


low viscosity and low






adhesivity, it is






easily used to adjust






viscosity, and it is






used to control curing






speed because it has






very high reactivity.



Catalyst
Peroxide or
1.1~8.5
It influences curing




triphenyl bismuth

speed.



MEK solvent
CH3COC2H5
0.5~15 
It is a solvent having






a ketone group, and it






is used to adjust






viscosity.



Aminosilane
NH2CH2CH═CH—
0.01~8  
It is a silane having




(SiH2)n-CH═CH—

an epoxy group, and it




CH2NH2

is used to improve






adhesivity.



First
CaCo3 (filler having
10~60
It includes spherical



filler
surface pores)

CaCo3 particles having






an average particle






size of 3 micron, and






it reduces production






cost and provides






viscous characteristics.



Second
Thixotropy improver
 3~17
It is extracted from



filler
(filler having no

clay, it is provides




surface pores)

strong thixotropy when






added to a raw material,






and it serves to prevent






precipitation (powder






form).









The main materials of the epoxy resin adhesive compositions of Example 1 and Comparative Example 1 to 4 are given in Table 3 below, and the curing agents of the epoxy resin adhesive compositions of Example 1 and Comparative Example 1 to 4 are given in Table 3 below.







TABLE 3







Epoxy resin adhesive composition - main material


Main material













Component
Structural formula
Ex. 1
Comp. Ex. 1
Comp. Ex. 2
Comp. Ex. 3
Comp. Ex. 4


(raw material)
(or function)
(wt %)
(wt %)
(wt %)
(wt %)
(wt %)
















Basic epoxy
CH2OCHCH2—(OC6H4C(CH3)2C6H4OCH2CH(OH)CH2)m-
 18~25.7
20
16.3
23
15.3


resin
OC6H4C(CH3)2C6H4OCH2CHOCH2







Modified
Rubber modified
 15~22.4
19
14
22
14


epoxy resin
epoxy







Polyester
Tackiness
7.3~13 
17.3
9
0
2


resin
improver







MEK solvent
CH3COC2H5
 7~19.5
20
27
20.3
34


Epoxy silane
CH2OCH—(Si2)n-CHOCH2
0.15~30.2 
0.5
0.5
0.5
0.5


Graphite
C
6~15
0
11
11
11


First filler
CaCo3
8~30
13
12
13
13


Second filler
Thixotropy
5~45
10
10
10
10



improver







Dispersant
Alkyl ammonium
0.01~10  
0.2
0.2
0.2
0.2












Total
100
100
100
100
100
















TABLE 4







Epoxy resin adhesive composition - curing agent


Curing agent













Component
Structural formula
Ex. 1
Comp. Ex. 1
Comp. Ex. 2
Comp. Ex. 3
Comp. Ex. 4


(raw material)
(or function)
(wt %)
(wt %)
(wt %)
(wt %)
(wt %)
















Middle-viscosity
—(NH—(CH2)5—CO)n-CH═CHCH2NH2
14~30
20
22
20
18


amide compound








Low-viscosity

10~35
20
22
20
18


amide compound








Catalyst
Peroxide or
1.1~8.5
4
0
4
6



triphenyl bismuth







MEK solvent
CH3COC2H5
0.5~15 
1.4
1.4
1.4
3.4


Aminosilane
NH2CH2CH═CH—(SiH2)n-CH═CH—CH2NH2
0.01~8  
0.6
0.6
0.6
0.6


First filler
CaCo3
10~60
40
40
40
40


Second filler
Thixotropy improver
 3~17
14
14
14
14












Total
100
100
100
100
100









The test results of physical properties of the epoxy resin adhesive composition obtained by mixing the main material of Example 1 given in Table 3 above with the curing agent of Example 1 given in Table 4 and the test results of physical properties of each of the epoxy resin adhesive compositions obtained by mixing the main materials of Comparative Examples 1 to 4 given in Table 3 above with the curing agents of Comparative Examples 1 to 4 given in Table 4 are given in Table 5 below. It can be ascertained from Table 5 that the epoxy resin adhesive composition of Example 1 exhibits excellent physical properties when it has the above-mentioned components and it) composition ratio.







TABLE 5







Test results














Ex. 1
Comp. Ex. 1
Comp. Ex. 2
Comp. Ex. 3
Comp. Ex. 4
Remarks





Mixing ratio
2:1
2:1
2:1
2:1
2:1



Phenomenon
normal curing speed
normal curing speed
slowly cured speed
normal curing speed
slowly cured




normal adhesivity
normal adhesivity
insufficient adhesivity
normal adhesivity
nonadhesive




normal initial
insufficient initial
insufficient initial
initial tackiness
thixotropy




tackiness
tackiness
tackiness
none
none



Conductivity
105~6
not measured
109~10
105~6
106~7
PRS-801 was used


(Ω)





(ASTM F 150)









The test results of adhesivity of the epoxy resin adhesive compositions of Example 1 and Comparative Examples 1 to 4 are given in Table 6 below. It can be ascertained from Table 6 that the epoxy resin adhesive composition of Example 1 exhibits high adhesivity when it has the above-mentioned components and composition ratio.









TABLE 6






Adhesivity
Remarks







Example 1
71.3 kg/cm2O| 
F108-2B was used (ASTM 4541)


Comp. Example 1
50.8 kg/cm2
′′


Comp. Example 2
33.6 kg/cm2
′′


Comp. Example 3
47.7 kg/cm2
′′


Comp. Example 4
25.8 kg/cm2
′′









Meanwhile, FIG. 1 is a schematic sectional view showing a perforated floor panel for a clean room according to a second embodiment of the present invention.
As shown in FIG. 1, the perforated floor panel 1 for a dean room according to the second embodiment of the present invention includes: a base panel 2 made of a metal and having a plurality of vent holes obliquely formed between upper and lower surfaces thereof; a resin tile 3 disposed on one side of the base panel 2 and having a plurality of vent holes corresponding to the vent holes; and the epoxy resin adhesive composition 4 according to the first embodiment of the present invention disposed between the base panel 2 and the resin tile 3 to integrate the base panel 2 with the resin tile 3.
The vent holes of the base panel 2 may be previously formed by casting or may be formed by punching after casting, and the vent holes of the resin tile 3 may be formed by punching after attaching the resin tile 3 to the base panel 2. In the base panel 2 and the resin tile 3, the term “obliquely” means a direction perpendicular to the base panel 2 or the resin tile 3 and a direction inclined to the base panel 2 or the resin tile 3. When the epoxy resin adhesive composition 4 is applied to the upper surface of the base panel 2 and then the resin tile 3 is aligned and attached to the applied epoxy resin adhesive composition 4, this epoxy resin adhesive composition 4 is cured with the passage of time, thus strongly attaching the resin tile 2 to the base panel 2.
As described above, the epoxy resin adhesive composition according to the first embodiment of the present invention has components and composition ratios thereof that are different from those of a conventional adhesive composition. Therefore, when this epoxy resin adhesive composition is disposed between the base panel and resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin becomes high, heat is easily discharged to the outside by graphite or the like having conductivity, and the generation of static electricity can be reduced.
Further, since the perforated floor panel for a clean room according to the second embodiment of the present invention includes the epoxy resin adhesive composition according to the first embodiment of the present invention applied between the base panel and the resin tile, the deterioration of adhesivity can be prevented even when it is used for a long period of time, the discoloration of the outer surface thereof facing the air can be prevented, and environmental pollutants are not produced.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

## Claims

1. An epoxy resin adhesive composition, which is a two-component epoxy resin adhesive composition, comprising:
a main material; and a curing agent,
wherein the main material comprises 1 ̃25.7 wt % of a basic epoxy resin based on the total weight of the main material, 0.15 ̃22.4 wt % of a modified epoxy resin, 7.3 ̃13 wt % of a polyester resin for providing adhesivity, 7 ̃19.5 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.15 ̃30.2 wt % of epoxy silane for increasing adhesivity, 6 ̃15 wt % of graphite for providing conductivity, 8 ̃30 wt % of a first filler for providing viscosity, 5 ̃45 wt % of a second filler for providing thixotropy, and 0.01 ̃10 wt % of a dispersant for dispersing the first and second fillers,
the curing agent comprises 14 ̃30 wt % of a middle-viscosity amide compound based on the total weight of the curing agent, 10 ̃35 wt % of a low-viscosity amide compound, 1.1 ̃8.5 wt % of a catalyst for promoting curing, 0.5 ̃15 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 001 ̃8 wt % of aminosilane for increasing adhesivity, 10 ̃60 wt % of a first tiller for providing viscosity, and 3 ̃17 wt % of a second filler for providing thixotropy, and the main material and the curing agent are mixed at a weight ratio of 2:1.

2. The epoxy resin adhesive composition of claim 1, wherein, in the main material, the dispersant includes alkyl ammonium and the first filler includes calcium carbonate (CaCO3), and in the curing agent, the catalyst includes peroxide or triphenyl bismuth and the first filler includes calcium carbonate (CaCO3).

3. A perforated floor panel for a clean room, comprising:
a base panel made of as metal and having as plurality of vent holes obliquely formed between upper and lower surfaces thereof;
a resin tile disposed on one side of the base panel and having a plurality of vent holes corresponding to the vent holes of the base panel; and
an epoxy resin adhesive composition disposed between the base panel and the resin tile to integrate the base panel with the resin tile
wherein the epoxy resin adhesive composition, which is a two-component epoxy resin adhesive composition, comprising: a main material; and a curing agent,

wherein the main material comprises 18 ̃25.7 wt % of a basic epoxy resin, 15 ̃22.4 wt % of a modified epoxy resin, 7.3 ̃13 wt % of a polyester resin for providing adhesivity, 7 ̃19.5 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.15 ̃30.2 wt % of epoxy silane for increasing adhesivity, 6 ̃15 wt % of graphite for providing conductivity, 8 ̃30 wt % of a first filler for providing viscosity, 5 ̃45 wt % of a second filler for providing thixotropy, and 0.01 ̃10 wt % of a dispersant for dispersing the first and second fillers, the curing agent comprises 14 ̃30 wt % of a middle-viscosity amide compound, 10 ̃35 wt % of a low-viscosity amide compound, 1.1 ̃8.5 wt % of a catalyst for promoting curing, 0.5 ̃15 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.01 ̃8 wt % of aminosilane for increasing adhesivity, 10 ̃60 wt % of a first filler for providing viscosity, and 3 ̃17 wt % of a second filler for providing thixotropy, and the main material and the curing agent are mixed at a weight ratio of 2:1.

4. The perforated floor panel for a clean room according to claim 3, wherein, in the main material, the dispersant includes alkyl ammonium and the first filler includes calcium carbonate (CaCO3), and in the curing agent, the catalyst includes peroxide or triphenyl bismuth and the first filler includes calcium carbonate (CaCO3).

5. The epoxy resin adhesive composition of claim 1, wherein the graphite includes carbon particles each having an average particle size of about 1.5 μm.

6. The epoxy resin adhesive composition of claim 1, wherein the first filler has an average particle size of about 3 μm.

7. The epoxy resin adhesive composition of claim 1, wherein the second filler is extracted from clay.

8. The epoxy resin adhesive composition of claim 1, wherein the dispersant includes alkyl ammonium.

9. The epoxy resin adhesive composition of claim 1, wherein the catalyst eludes at peroxide or triphenyl bismuth.

10. The epoxy resin adhesive composition of claim 1, wherein the first filler has surface pores.

11. The epoxy resin adhesive composition of claim 10, wherein the second tiller has no surface pores.

12. The epoxy resin adhesive composition of claim 1, wherein the basic epoxy resin has a structural formula as follows:


CH2OCHCH2-(OCH6CH4C(CH3)2C6H 4OCH2CH(OH)CH2)m-OC6H3C(CH3)2C6H4OCH2CHOCH2.

13. The epoxy resin adhesive composition of claim 1, wherein the modified epoxy resin includes a rubber modified epoxy.

14. The epoxy resin adhesive composition of claim 1, wherein the MEK solvent has a structural formula as follows:


CH3COC2H5.

15. The epoxy resin adhesive composition of claim 1, wherein the epoxy silane has a structural formula as follows:


CH20CH—(Si2)n-CHOCH2.

16. The epoxy resin adhesive composition of claim 1, wherein the middle-viscosity amide compound has a structural formula as follows:


—(NH—(CH25-CO)n-CH═CHCH2NH2.

17. The epoxy resin adhesive composition of claim 1, wherein the aminosilane has a structural formula as follows:


NH2CH2CH═CH—(SiH2)n-CH═CH—CH2NH2.