Federal Register / Vol. 87, No. 15 / Monday, January 24, 2022 / Notices 3501 

Æ Emerging materials 

Æ Heterogeneous integration, chip 

stacking, and related technologies. 

Æ High-density substrates 

Æ Metrology 

Æ Modeling and simulation 

Æ Package-level design/codesign tools 

for electrical, thermal and mechanical 

design of complex packages 

Æ Printed circuit boards 

Æ Safety and security 

Æ Software, firmware, new concepts in 

programming 

Æ Standards 

Æ Test solutions to assure yield in 

complex packages 

Æ Thermal solutions 

Æ Tooling 

Æ Other? 

3. A proposed National Advanced 

Packaging Manufacturing Program could 

be oriented to address multiple needs, 

including but not limited to 

prototyping, the provision of pilot lines, 

work force development, and supply 

chain development. Please describe the 

most critical needs on which the 

program should focus. 

4. What attributes are the most 

important for a National Advanced 

Packaging Manufacturing Program to 

deliver? Examples include but are not 

limited to: 

Æ ‘‘Leading edge’’ tools 

Æ Characterization services 

Æ Collaboration across multiple 

universities and multiple companies 

Æ Development of education and 

workforce development 

infrastructure, including building a 

pipeline of skilled workers 

Æ Easy to access facility, with different 

processes and tools 

Æ Expert resident staff for custom 

development 

Æ International participation 

Æ Intellectual property protection for 

inventors 

Æ Open access to intellectual property 

Æ Post fabrication infrastructure 

Æ Other? 

5. What factors are critical to enable 

a National Advanced Packaging 

Manufacturing Program to provide a 

successful packaging R&D hub(s)? 

6. Identify processes, equipment, 

measurement capabilities, 

environmental conditions, and training 

facilities that are most crucial for 

facilities provided by a National 

Advanced Packaging Manufacturing 

Program. How might organizations 

access such facilities? 

7. How closely aligned should the 

capabilities enabled by a National 

Advanced Packaging Manufacturing 

Program be with those provided by the 

NSTC? 

8. How should the National Advanced 

Packaging Manufacturing Program 

connect to National Network for 

Semiconductor R&D, authorized by Sec. 

9903 of the FY 2021 NDAA? What 

considerations should be given to 

ensure strong integration between the 

two efforts? Should there be overlap in 

the technology readiness levels served 

by each program? 

9. Describe anticipated needs in 

education and workforce development, 

including retraining and upskilling, in 

the semiconductor packaging area. How 

adequate is it currently, and what are 

future expectations of need? How 

should the workforce training pipeline 

be developed? 

Semiconductor Workforce 

1. What are the greatest occupational 

or skills shortages facing employers in 

the semiconductor sector? What are the 

consequences of those shortages with 

respect to the domestic operation of 

employers in the sector? Considering all 

aspects of building, equipping, and 

running semiconductor manufacturing 

and R&D facilities, what actions have 

been taken to address these shortages, 

how effective have they been, and what 

gaps remain? 

2. What strategies have been most 

effective in addressing the shortages? 

Which states or countries have created 

the most effective strategies for different 

types of workforce needs to build, 

equip, and run semiconductor 

manufacturing and R&D facilities? 

What industry or other credentials do 

employers use, or could use, to train 

and hire workers to fill needed 

positions? To what extent do employers 

in the semiconductor sector partner 

with government institutions such as 

local workforce boards, economic 

development organizations, or 

Manufacturing Extension Partnership 

centers, or international partners to 

establish training and/or skill 

certification programs? To what extent 

do employers in the semiconductor 

sector partner with other employers to 

create joint training programs? 

3. What types of apprenticeship 

programs or existing partnerships 

involving workforce development issues 

in the semiconductor sector should the 

Department be aware of? What role can 

unionized labor play in worker training 

and workforce development, including 

for economically disadvantaged 

individuals? 

4. What have been successful 

mechanisms used by employers in the 

semiconductor sector to work with local 

high schools, career and technical 

education programs, community 

colleges, or universities to recruit and 

train workers? 

5. Are there any current or planned 

initiatives in the semiconductor sector 

to strengthen and expand the 

recruitment of women and 

underrepresented minorities, including 

promotion of such careers at K–12 

levels? 

6. To what extent, and for what 

occupations, do organizations in the 

semiconductor sector use the H1–B 

Program to fill positions? 

7. Are there opportunities to design 

the semiconductor incentive program to 

ensure that worker skills shortages do 

not hinder companies from expanding 

operations? 

Sreenivas Ramaswamy, 

Senior Policy Advisor, Office of Policy and 

Strategic Planning, U.S. Department of 

Commerce. 

[FR Doc. 2022–01305 Filed 1–21–22; 8:45 am] 

BILLING CODE 3510–20–P 

DEPARTMENT OF COMMERCE 

National Institute of Standards and 

Technology (NIST) 

Information Collection Activities; 

Submission to the Office of 

Management and Budget (OMB) for 

Review and Approval; Comment 

Request; Baldrige Executive Fellows 

Program 

The Department of Commerce will 

submit the following information 

collection request to the Office of 

Management and Budget (OMB) for 

review and clearance in accordance 

with the Paperwork Reduction Act of 

1995, on or after the date of publication 

of this notice. We invite the general 

public and other Federal agencies to 

comment on proposed, and continuing 

information collections, which helps us 

assess the impact of our information 

collection requirements and minimize 

the public’s reporting burden. Public 

comments were previously requested 

via the Federal Register on November 

16, 2021, during a 60-day comment 

period. This notice allows for an 

additional 30 days for public comments. 

Agency: National Institute of 

Standards and Technology (NIST), 

Commerce. 

Title: Baldrige Executive Fellows 

Program. 

OMB Control Number: 0693–0076. 

Form Number(s): None. 

Type of Request: Regular, extension of 

current information collection. 

Number of Respondents: 24 per year. 

Average Hours per Response: 1 hour 

to gather materials. 


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3502 Federal Register / Vol. 87, No. 15 / Monday, January 24, 2022 / Notices 

Burden Hours: 24. 

Needs and Uses: Collection needed to 

obtain information to select applicants 

for the Baldrige Executive Fellows 

Program, a professional development 

fellowship offered by the Baldrige 

Performance Excellence Program. 

Affected Public: Business, health care, 

education, or other for-profit 

organizations; health care, education, 

and other non-profit organizations; and 

individuals. 

Frequency: Annually. 

Respondent’s Obligation: Voluntary. 

This information collection request 

may be viewed at www.reginfo.gov. 

Follow the instructions to view the 

Department of Commerce collections 

currently under review by OMB. 

Written comments and 

recommendations for the proposed 

information collection should be 

submitted within 30 days of the 

publication of this notice on the 

following website www.reginfo.gov/ 

public/do/PRAMain. Find this 

particular information collection by 

selecting ‘‘Currently under 30-day 

Review—Open for Public Comments’’ or 

by using the search function and 

entering either the title of the collection 

or the OMB Control Number 0693–0076. 

Sheleen Dumas, 

Department PRA Clearance Officer, Office of 

the Chief Information Officer, Commerce 

Department. 

[FR Doc. 2022–01265 Filed 1–21–22; 8:45 am] 

BILLING CODE 3510–13–P 

DEPARTMENT OF COMMERCE 

National Institute of Standards and 

Technology 

[Docket No. 211115–0232] 

Announcing Issuance of Federal 

Information Processing Standard 

(FIPS) 201–3, Personal Identity 

Verification (PIV) of Federal Employees 

and Contractors 

AGENCY: National Institute of Standards 

and Technology (NIST), Commerce. 

ACTION: Notice. 

SUMMARY: This notice announces the 

Secretary of Commerce’s approval of 

Federal Information Processing 

Standard (FIPS) Publication 201–3, 

Personal Identity Verification (PIV) of 

Federal Employees and Contractors. 

FIPS 201–3 includes clarifications to 

existing text, additional text in cases 

where there were ambiguities, 

adaptation to changes in the 

environment since the publication of 

FIPS 201–2, and specific changes 

requested by Federal agencies and 

implementers. 

DATES: FIPS 201–3 is effective on 

January 24, 2022. 

ADDRESSES: FIPS 201–3 is available 

electronically from the NIST website at: 

https://csrc.nist.gov/publications/fips. 

Comments that were received on the 

proposed changes will also be published 

electronically at https://csrc.nist.gov/ 

projects/piv and at https://

www.regulations.gov. 

FOR FURTHER INFORMATION CONTACT: 

Hildegard Ferraiolo, (301) 975–6972, 

National Institute of Standards and 

Technology, 100 Bureau Drive, Mail 

Stop 8930, Gaithersburg, MD 20899– 

8930, email: hildegard.ferraiolo@

nist.gov, or Andrew Regenscheid, (301) 

975–5155, andrew.regenscheid@

nist.gov. 

SUPPLEMENTARY INFORMATION: FIPS 201 

establishes a standard for a Personal 

Identity Verification (PIV) system 

(Standard) that meets the control and 

security objectives of Homeland 

Security Presidential Directive-12 

(HSPD–12). It is based on secure and 

reliable forms of identity credentials 

issued by the Federal Government to its 

employees and contractors. These 

credentials are used by mechanisms that 

authenticate individuals who require 

access to federally controlled facilities, 

information systems, and applications. 

This Standard addresses requirements 

for initial identity proofing, 

infrastructure to support 

interoperability of identity credentials, 

and accreditation of organizations 

issuing PIV credentials. 

FIPS 201 was issued on 2005 (70 FR 

17975) in response to HSPD–12. 

Subsequent revisions included FIPS 

201–1, published in 2006 and FIPS 201– 

2 (version in effect), published in 2013 

(78 FR 54626). In consideration of 

technological advancements over the 

last five years and specific requests for 

changes from United States Government 

(USG) stakeholders, NIST determined 

that a third revision of FIPS 201 was 

warranted. NIST received numerous 

change requests, some of which, after 

analysis and coordination with the 

Office of Management and Budget 

(OMB) and USG stakeholders, were 

incorporated in a proposed draft of FIPS 

201–3. Other change requests 

incorporated in the draft resulted from 

the 2019 Business Requirements 

Meeting held at NIST. The meeting 

focused on business requirements of 

Federal departments and agencies. On 

November 3, 2020, a notice was 

published in the Federal Register (85 

FR 69599), soliciting public comments 

on the draft FIPS 201–3. During the 

public comment period, a virtual public 

workshop was hosted by NIST on 

December 9, 2020. 

The scope of changes reflected in 

FIPS 201–3 include the following: 

• Alignment with current NIST 

technical guidelines on identity 

management, OMB policy guidelines, 

and changes in commercially-available 

technologies and services. 

• Accommodation of additional types 

of authenticators through an expanded 

definition of Derived PIV credentials. 

• Focus on the use of federation to 

facilitate interoperability and 

interagency trust. 

• Addition of supervised remote 

identity proofing processes. 

• Removal of previously deprecated 

Cardholder Unique Identifier (CHUID) 

authentication mechanism and 

deprecation of the symmetric card 

authentication key and visual 

authentication mechanisms (VIS). 

• Support for secure messaging 

authentication mechanism (SM–AUTH). 

Comments and questions regarding 

the draft were submitted by USG 

organizations, private sector 

organizations, and private individuals. 

NIST made several changes to the draft 

FIPS 201–3 based on the public 

comments received. 

Many commenters asked for 

clarification of the text of the Standard 

and/or recommended editorial and/or 

formatting changes. Other commenters 

suggested modifying the requirements 

and asked questions concerning the 

implementation of the Standard. All of 

the suggestions, questions, and 

recommendations within the scope of 

this FIPS were carefully reviewed, and 

changes were made to the Standard, 

where appropriate. Some commenters 

submitted questions or raised issues that 

were related but outside the scope of 

this FIPS. Comments that were outside 

the scope of this FIPS, but that were 

within the scope of one of the related 

Special Publications, were deferred for 

later consideration in the context of the 

revisions to these Special Publications. 

The disposition of each comment that 

was received has been provided along 

with the comments at https://

csrc.nist.gov. 

The following is a summary and 

analysis of the comments received 

during the public comment period, and 

NIST’s responses to them: 

1. Comment: Some commenters 

inquired about the effective date of the 

Standard. Commenters also inquired 

about the implementation schedule 

associated with the changes introduced 

in the Standard, once the Standard is in 

effect. 


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