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                                                                   EXHIBIT 10.10
                                Letter of Intent

                                  Summus, Ltd.

           434 Fayetteville Street mall - Suite 600, Raleigh, NC 27601

                     919-8077-5600 (main) 919-807-5601 (fax)

Mr. Hank Byun
Samsung Electronics of America, Inc.
105 Challenger Road
Ridgefield Park, NJ

Dear Mr. Byun:

         We are pleased to present this non-binding letter of intent ("LOI")
which documents the proposal and intent of Summus, Ltd. ("SUMMUS"), Samsung
Electronics of America, Inc., ("SAMSUNG"), and High Speed Net Solutions, Inc.
("HSNS"), with respect to certain business relationships as described below. As
the parties have previously discussed, SUMMUS is engaged in the research,
development, licensing and sale of its Dynamic WaveletTM based technologies and
products ("SUMMUS Technology"), which technology embodies substantial know-how
and other intellectual property which are the sole and exclusive property of
SUMMUS, and which are protected by applicable domestic and foreign patent,
trademark and copyright laws. The parties to this letter envision a joint
development agreement or similar arrangement whereby SUMMUS Technologies may be
applied and modified, and other technologies developed, for particular
applications with respect to certain semiconductor, consumer electronics and
computer hardware and software products and systems of SAMSUNG. HSNS shall
participate in these negotiations and discussions in its role as a marketing
partner with SUMMUS. The parties to this letter intend to conduct good faith
negotiations to better define the terms and conditions of proposed business
projects outlined herein, with a goal of developing and executing a definitive
agreement (the "Agreement") containing the specific terms and conditions. This
letter is not intended to nor does it create any legal or binding obligations on
any of the parties hereto except as expressly herein.

         Our understanding of the proposed project(s) and arrangements are as
follows:

         1. Apply SUMMUS Dynamic WaveletTM technology to SAMSUNG products The
parties shall enter into a joint development agreement and related agreements to
integrate and optimize SUMMUS Dynamic WaveletTM technology on SAMSUNG's
strategic digital signal processor ("DSP") platform for sale as a semiconductor
component. The parties envision that SUMMUS will grant a nonexclusive,
royalty-bearing license to SAMSUNG for the use of such technology in such
applications. Such royalty shall be based upon the sale of the DSP chip set by
SAMSUNG containing SUMMUS technology. Such work will include payment of
nonrecurring engineering fees from SAMSUNG to SUMMUS in an amount to be agreed
upon.

         2. This proposal is subject to the preparation and execution of a
mutually satisfactory definitive agreement (the "Agreement"), containing such
terms and conditions regarding licensing, ownership of inventions and payments
as the parties shall agree upon. This proposal is further subject to the
completion of a technical due diligence investigation by SUMMUS and SAMSUNG with
respect to each such party's technology and to fulfill the obligations of the
Agreement.

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         Upon acceptance by you of this letter, we shall commence the drafting
of a definitive agreement for your review and comment. The parties will use the
their best efforts to complete negotiations and execute the Agreement on or
before April 15, 2000.

         3. SAMSUNG and SUMMUS agree to provide each other with reasonable
access to each other's personnel, documents and technology to enable each party
to ascertain the feasibility of the above proposed Agreement. SAMSUNG and SUMMUS
mutually agree that each may become aware of information of the other of a
confidential nature concerning the technologies and business of such party
during the course of the technical due diligence investigation. SAMSUNG and
SUMMUS specifically agree that any such information will be used only for
purposes of effecting the transactions contemplated by this letter and for no
other purpose. No rights or licenses to any party's intellectual property are
granted or conveyed to any person in any respect by virtue of this letter or the
negotiations contemplated hereby. All parties to this letter agree that each
party will hold any information regarding the other in strict confidence and
will not disclose it except to persons participating in this transaction,
including the parties' attorneys and accountants or other advisors, until such
time as such information is no longer confidential other than by reason of a
violation of this paragraph or the Confidentiality Agreement executed March 15,
1999, by and between SAMSUNG and SUMMUS. SAMSUNG and SUMMUS acknowledge and
confirm the Confidentiality Agreement, and further acknowledge and agree that
the requirements of this paragraph 3 shall not diminish or limit any provisions
of such Confidentiality Agreement.

         4. Each of the parties shall pay its own expenses in connection with
the negotiation and execution of the Agreement.

         5. SAMSUNG and SUMMUS will make this relationship public at a mutually
agreeable time that will be communicated in writing, but no later than 30 days
after the signing of the definitive agreement.

         6. SAMSUNG and SUMMUS acknowledge that HSNS has served as marketing
agent in assisting to develop the proposed business venture between the two
companies.

         7. SUMMUS hereby acknowledges that it has entered into a Master License
Agreement ("MLA") with HSNS dated February 14, 2000 and that the terms and
conditions of the Agreement shall not violate HSNS's rights under the MLA.

         8. As a pre-condition to the execution of the Agreement, SUMMUS shall
obtain an opinion from HSNS counsel that the term of the Agreement does not
violate the right so HSNS under the terms of the MLA and shall also obtain a
waiver from HSNS in which HSNS agrees not to enforce against Samsung or its
successors, assigns, licensees or sublicenses any rights of HSNS that may be
infringed by the exercise of rights under the Agreement.

         If the foregoing is acceptable, SAMSUNG and HSNS should sign and date a
copy of this letter and return it to us. This letter is intended to evidence the
preliminary understandings that we have reached regarding the proposed
transactions and our mutual intent to negotiate in good faith to enter into the
Agreement. This letter does not obligate the parties to enter into any agreement
or engage in any business transactions or endeavors, including, without
limitation, those outlined herein. The parties hereto acknowledge and agree that
execution of the Agreement shall be subject to appraisal of upper management and
legal counsel of the parties. However, by acceptance of this letter, the parties
hereto each agree to be bound by paragraphs 6 and 7 and 8.

                                           Sincerely,
                                           /s/ W. Bradford Silvernail
                                           W. Bradford Silvernail
                                           Chief Executive Officer, Summus, Ltd.

SAMSUNG                                     HSNS
By: /s/ Hank Byun                           By: /s/ Andrew Fox
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Date:      2/5/00                           Date:     2/15/00
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cc:      M. G. Boyd                 M.H. Baik
         Dr. B. Jawerth             K. Park