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 Environmental Protection Agency 40 CFR Part 98
 CFR Correction In Title 40 of the Code of Federal Regulations, Parts 96 to 99, revised as of July 1, 2014, on pages 696 through 698, in subpart I of part 98, tables I-5 through I-7 are corrected to read as follows: Table I-5 To Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
Process type factors
Process gas iCF4
C2
                            F6
CHF3
CH2
                            F2
C3
                            F8
c− C4
                            F8
NF3 Remote
NF3
SF6
C4
                            F6a
C5
                            F8a
C4
                            F8
                            OaEtch 1-Ui
0.7
1
                            0.4
1
                            0.4
1
                            0.06
NA
1
                            0.2
NA
0.2
0.2
0.1
0.2
NAEtch BCF4
NA
1
                            0.4
1
                            0.07
1
                            0.08
NA
0.2
NA
NA
NA
1
                            0.3
0.2
NAEtch BC2
                            F6
NA
NA
NA
NA
NA
0.2
NA
NA
NA
1
                            0.2
0.2
NACVD Chamber Cleaning 1-Ui
0.9
0.6
NA
NA
0.4
0.1
0.02
0.2
NA
NA
0.1
0.1CVD Chamber Cleaning BCF4
NA
0.1
NA
NA
0.1
0.1
2
                            0.02
2
                            0.1
NA
NA
0.1
0.1CVD Chamber Cleaning BC3
                            F8
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
0.4**Notes:**
                         NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.1
                         Estimate includes multi-gas etch processes.2
                         Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.
 Table I-6 To Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing
Process type factors
Process gas iCF4
C2
                            F6
CHF3
CH2
                            F2
C3
                            F8
c− C4
                            F8
NF3 Remote
NF3
SF6Etch 1-Ui
0.6
NA
0.2
NA
NA
0.1
NA
NA
0.3Etch BCF4
NA
NA
0.07
NA
NA
0.009
NA
NA
NAEtch BCHF3
NA
NA
NA
NA
NA
0.02
NA
NA
NAEtch BC2
                            F4
NA
NA
0.05
NA
NA
NA
NA
NA
NACVD Chamber Cleaning 1-Ui
NA
NA
NA
NA
NA
NA
0.03
0.3
0.9**Notes:**
                         NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.
 Table I-7 To Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing
Process type factors
Process gas iCF4
C2
                            F6
CHF3
CH2
                            F2
C3
                            F8
c− C4
                            F8
NF3 Remote
NF3
SF6Etch 1-Ui
0.7
0.4
0.4
NA
NA
0.2
NA
NA
0.4Etch BCF4
NA
0.2
NA
NA
NA
0.1
NA
NA
NAEtch BC2
                            F6
NA
NA
NA
NA
NA
0.1
NA
NA
NACVD Chamber Cleaning 1-Ui
NA
0.6
NA
NA
0.1
0.1
NA
0.3
0.4( print page 12935)CVD Chamber Cleaning BCF4
NA
0.2
NA
NA
0.2
0.1
NA
NA
NA**Notes:**
                         NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.


[FR Doc. 2015-05549 Filed 3-11-15; 8:45 am] BILLING CODE 1505-01-D