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81 F-008-W-C-01984l~!U-8Q 

This document contains 120 

classified sheets l.Iicluding 

the front and back.cover. 

PHOTOGRAPHIC SYSTEM REFERENCE HANDBOOK 

FOR 

GAMBIT RECONNAISSANCE SYSTEM 

WITH 

EXTENDED ALTITIJDE CAPABILITY 

(EAC) 

VOLUME 4 

Prepared by 

BIF-008 

Under Contract 

l July 1980 

"WARNING -THIS DOCUMENT SHALL NOT BE USED AS A SOURCE FOR DE~IVATIVE CLASSIFICATION" 

Handle vta s'vEMAH 

Confto1'$ystem Only 

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25X1 
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G 

BIF-008- W-C-019841-RI-80 

Orbit 

Coordinate 

System (OCS) 

#1 

Orbit 

Coordinate 

System (OCS) 

#2 

BIF-008 Uses OCS #1 

OCS #1 Is Used In This Document 

Orbit Coordinate Systems Sign Convention 

FRONTISPIECE 

+Y 

Direction 

... 

·of Flight 

"WARNING-THIS DOCUMENT SHALL NOT BE USED AS A SOURCE FOR DERIVATIVE CLASSIFICATIONH 

Approved for Release: 2017 /02/14 C05097222 

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BIF-008- W-C-019841-RI-80 

TABLE OF CONTENTS 

VOLUt,lE 4 

PART 3 - HARDlXARE DESCRIPTIO:\ 

5.0 VIE\\'PORT DOOR SUBSYSTEM 

5.1 Ejectable Hatch 

5.2 Viewport Doors and Door Drive Linkage 

5.2.1 Viewport Door Structure 

5.2.2 Viewport Door Drive Mechanism 

5.3 Viewport Door Electronics Module 

5.3.1 Vie~~ort Door Control 

5.4 Viewport Door Subsystem Instrumentation 

5.5 Viewport Door Subsystem Command Summary 

5.5.1 HATCH EJECT Command 

5.5.2 DOOR BACKUP Command 

5.5.3 DOOR BLOW Command 

5.5.4 4V WORD Command (Bit 36: Door Open/Close) 

5.5.5 DOOR CLOSE Command (MCS) 

6.0 FOCUS DETECTION SUBSYSTEM 

6.1 System Description 

6.1.1 Focus Sensor Head Assembly (Unit 15A2) 

6.1.2 Signal Nonnalizing Module (Unit 15A3) 

Page 

3. 5-1 

3.5-1 

3.5-3 

3.5-3 

3.5-7 

3.5-9 

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3.5-19 

3.5-32 

3.5-32 

3.5-32 

3.5-32 

3.5-33 

3.5-34 

3.6-1 

3.6-1 

3.6-1 

6.1.3 Instrumentation and Control Module (Unit 15Al) 

6.1.4 Dual Photodiode Detector 

3.6-9 

3.6-9 

3.6-12 

3.6-12 

3.6-15 

3.6-15 

3.6-24 

3.6-26 

3.6-30 

3.6-30 

3.6-30 

6.1.5 Light-Emitting Diode (LED) Array 

6.2 System Operation 

6.2.1 Focus System Head Assembly 

6.2.2 Signal Nonnalizing Module 

6.2.3 Instrumentation and Control Module 

6.3 Focus Detection Subsystem Commanding 

6.3.1 Focus Electronics Power 

6.4 Instrumentation 

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VOLUME 4 

7.0 

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TABLE OF CO:t\TENTS (Continued) 

POWER DISTRIBUTION SUBSYSTEM 

7.1 Power Source 

7 .1.1 Power Distribution 

7 .1. 2 Solar Array 

7 .1. 3 Batteries 

7.2 Power Monitor and Control Unit 

7.2.1 PM and c Assembly 

7.2.2 PM and c Logic 

7.2.3 PM and c Uni point Power Return 

7.2.4 Power Conversion (+5/±15 Volts) 

7.2.5 Ampere-Hour Meter 

7.2.6 PM and C Instrumentation 

7.3 Initiator Electronics Unit 

7.3.l IEU Assembly 

7.3.2 IEU Operation 

7.3.3 IEU Logic 

7.4 PPS/DP EAC Electromagnetic Interference (EMI) 

7.4.1 Filters 

7.4.2 Grounding 

7.4.3 Power Distribution 

7.4.4 Shielding 

7.5 Instrumentation Summary 

7.6 Command Summary 

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Control 3.7-70 

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VOLU~lE 4 

8.0 

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BIF-008- W-C-019841-RI-80 

TABLE OF CONTENTS (Continued) 

ENVIRONMEi'.'TAL COJ\'TROL 

8.1 Ground Conditioning 

8.1.1 Manufacturing Environment 

8.1.2 Storage and Shipment 

8.1.3 Launch Site Ground Conditioning 

8.2 Ascent 

8.2.1 Ascent Thermal Environment 

8.2.2 Ascent Venting 

8.3 Orbital Environment 

8.3.1 Optics 

8.3.2 Film 

8.3.3 Electronic Boxes 

8.3.4 External Thermal Control Finishes 

8.3.5 Internal Design 

8.4 Instrumentation 

8.5 Environmental Control Command Summary 

8.5.1 Heater Power On 

8.5.2 Heater Power Off Commands 

8.5.3 EPSM ON Commands 

8.5.4 EPSM OFF Commands 

8.5.5 Heater Power ON/OFF (M6V Word) 

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Fi~ure 

3.5-l 

3.5-2 

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3.5-5 

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Bl F-008-W-C-019841-RI-80 

LIST OF ILLUSTRATIONS 

Title Page 

Forward Barrel and Viewport Doors 3.5-2 

Hatch Ejection Mechanism 3.5-4 

Viewport Door Drive Mechanism and Instrumentation 3.5-5 

Spider Linkage (-X View) 3.5-10 

Viewport Door Subsystem Electronics 3.5-13 

Motor Drive Control 3.5-17 

Ratio of Lens Area As A Function of Viewport Door Position 3.5-20 

Door Open Primary Mode 3.5-21 

Door Close Primary Mode 3.5-22 

Door Open Backup Mode 3.5-23 

Door Close Backup Mode 3.5-24 

Door-Blow Mode 3.5-25 

Focus Detection Subsystem Elements 3.6-2 

View Into Camera (Baffle Removed) 3.6-3 

Focus Detection Subsystem Block Diagram 3.6-4 

Focus Sensor Head Assembly 3.6-5 

Focus Detection Subsystem Optics Assembly 3.6-7 

Beam Splitter and Reticle Assembly 3.6-8 

Typical Reticle 3.6-10 

Signal Normalizing Module (Unit 15A3) 3.6-11 

Instrumentation and Control Module (Unit 15Al) 3.6-13 

Dual Photodiode Detector 3.6-14 

Optics with Dual Detector and LED Array 3.6-16 

Systems Operation Functional Block Diagram 3.6-17 

Detector and Current-to-Voltage Converter 3.6-19 

Frequency Response for Each Mode 3.6-21 

Typical Dual Channel Amplifier 3.6-22 

~ 

v 

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Figure 

3.6-16 

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LIST OF ILLUSTRATIO!\S (Continued) 

Title 

Dual Range Amp 

Typical Scaling Amplifier and Lov.· Pass Filter 

LED Oscillator and Driver 

Temperature Sensor Bias Network 

Power Decoupling Circuit 

PPS/DP EAC Power Distribution Subsystem 

SCS Power Distribution System 

SCS Solar Array 

Voltage/Load Relationship Due to Solar Panel Effect 

PM and C Assembly 

PPS/DP EAC Power Input and Filtering 

9 and 5 Operational Power and Servo Power 

Focus Electronics and Sl-PRG Power 

Focus Detection Subsystem Calibration Power 

DTU l and 2 POWER; Instrumentation Supply and Pressure 

Transducer Power 

5 Parking Brake Power 

Environmental Branches 1, 2, 4, 5, and 6 Power 

EPSM l and EPSM 2 Power 

Standard Soft Switch Circuit 

PM and C Unipoint Ground 

PPS/DP EAC Instrumentation Unipoint Ground 

IEU Cross-Strap Circuit Configuration 

!EU Simplified Command Enable Configuration 

PPS/DP EAC Pyrotechnic Subsystem Block Diagram 

Arm and Safe Plugs 

Command Receipt Instrumentation Digital-to-Analog 

Converters 

Pyro Power Voltage Monitor and Instrumentation Power 

Power Filters 

Page 

3.6-23 

3.6-25 

3.6-28 

3.6-29 

3.6-30 

3.7-2 

3.7-4 

3.7-6 

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~llllCI 

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__:;__ 

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VOLUME 4 

Figure 

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LIST OF ILLUSTR~TIO\S (Continued) 

Title 

Arm/Continuity Loops 

Multiple Relay Logic Representation 

Hatch Eject 

Viewport Door Backup and Viewport Door Blm·; 

9 Splice and Cut and 9 

5 Splice and Cut and 5 

Cut and Seal 1 

SRV 1 Arm and Transfer 

SRV 1 Separate 

Roll- In Terminate 

Roll- In Terminate 

Spinof f Disconnect 2 and EA Separate 

Cut and Seal 2 

SRV 2 Arm and Transfer 

SRV 2 Separate 

Ground Conditioning at Launch Facility 

PPS/DP EAC On-Pad Conditioning System 

Floor Plan, Gantry Clean Rooms 

Recommended Operating Limits for Clean Room 

Film Temperature vs Timekeeping Limits 

PPS/DP EAC External Thermal Control Finishes 

COM Thermal Blanket Assemblies 

Ground Heater Tape Locations 

Ground Heater Controller Schematic 

Flight Heater Branch Block Diagram 

Flight Heater Tape Locations 

Flight Heater Controller Schematic 

COA Heater Controller Temperature Sensor Locations 

EA/FA Pin-Puller Locations 

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Figure 

3.8-15 

3.8-16 

3.8-17 

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G 

BIF-008- W-C-019841-RI-80 

LIST OF ILLUSTRATIO~S (Continued) 

Title 

DRM Skin Temperature Instrumentation Points 

Supply Electronics Module Skin Temperature 

Instrumentation Points 

COA Structure Temperature Sensor Locations 

~llllCI 

....... :ii! .. ~ _jL 

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3.8-67 

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VOLUME 4 

Table 

3.5-1 

3.6-1 

3.6-2 

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3.7-2 

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3. 7-5 

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LIST OF TABLES 

Title 

Viewport Door Subsystem Instrumentation Surnn1ary 

Focus Detection Subsystem 4V WORD Command 

Focus Detection Subsystem Instrumentation 

PPS/DP EAC Power Consumption 

Pl'-l and C Power Distribution 

Pyro-Actuated Events 

Main Power Subsystem Instrumentation 

Pyro Power Subsystem Instrumentation 

Command Logic Summary 

Clean Area and Clean Room Characteristic and Usage 

Characteristics of External Thermal Control Finishes 

Ground Heater System 

Heater Controller Set Points 

Flight Heater Tape Locations 

Environmental Subsystem Instrumentation Summary 

Umbilical Instrumentation Summary 

Page 

3.5-26 

3.6-31 

3.6-32 

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5.0 VIEWPORT DOOR SUBSYSTEM 

The viewport doors, mounted on the forward barrel of the camera optics module, 

provide the means to open and close the opening through which light enters the 

PPS/DP EAC optical system. The viewport door subsystem consists of the viewport door electronics, bomb bay-tYPe doors (Figure 3.5-1) and associated 

drive linkages and motors, and an ejectable hatch covering the doors during 

shipment and launch. 

The doors are opened for photographic activity and are closed during nonactive intervals for thermal control and lighttightness. Closing prevents 

heat losses during the dark portion of the orbit and also protects against 

the possibility of direct sunlight impingement on the optics, commonly referred to as SLOP and SLOS (sunlight on primary; sunlight on stereo). Opening or closing the doors during nonphotographic intervals also aids in controlling COM temperature variations through radiant heating or cooling. 

Three modes of operation are provided by the viewport door subsystem: primary, backup, and door-blow. A description of each is provided in Section 5.3. 

5.1 Ejectable Hatch 

The ejectable hatch fits flush with the PPS/DP EAC exterior, protecting the viewport doors, and sealing the vehicle against light and contamination (rain, dust, 

etc.). The hatch is a nonstructural member of the PPS/DP EAC held to the forward 

barrel by six pin-puller assemblies. Two pyrotechnic devices are used per pin3.5-1 

~ 

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Cont ro I Sys tern On l y 
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Door Stop...:...:-." 

(Typical 2 Places) .......... 

Opening for 

Hatch Eyebol t 

(Typical 6 place 

Door Hinge 

(Typical 4 Plac 

NOTE: Figure 3,1-20 in Part 3, 

Section 1 illustrates 

the forward barrel with 

the viewport doors open. 

Bl F-008- W-C-019841-RI-80 

Viewport Door ,...,._ ____ Electronics 

be mounted in SEM) 

BIF-008 Vehicle 

Coordinates 

+Z*-X -Y 

-Z +Y +X 

Figure 3.5-1. Forward Barrel and Viewport Doors 

~ 

3.5-2 

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BIF-008- W-C-019841-RI-80 

puller, either one of which is capable of retracting the pin. Rubber snubbers on the hatch press against the doors to prevent shaking and rubber 

gaskets around the hatch edge maintain a pressure-tight seal (Figure 3.5-2). 

Four leaf springs are used to push the hatch away from the vehicle when it 

is released. Ejection normally occurs subsequent to Agena cutoff (approximately 610 seconds into flight), with a maximum limit of 30 minutes after 

launch to ensure that the hatch moves clear of the vehicle. 

5.2 Viewport Doors and Door Drive Linkage 

The vie~~ort doors are suspended on hinges and rotate about a line parallel 

to the vehicle X-axis. The door drive mechanism, illustrated in Figure 3.5-3, 

consists of torsion springs, the door actuating arms, and the primary and 

backup drive motors. A spider link mounted on the partial bulkhead of the 

forward barrel connects all of the drive components, excluding the torsion 

springs. The drive motors are supported by the same partial bulkhead and 

attach to the spider through special connecting links. 

5.2.l Viewport Door Structure 

The clamshell-shaped doors are nonstructural members of the PPS/DP EAC. Each 

door is attached to, and driven by, a door hinge assembly, which in turn is 

supported by the forward barrel box beam. Rubber seals at the outer edge of 

each door (-Z) protect the doors when butting, and provide an excellent light 

seal. A metal stop on each door is used to limit the door-open position in 

the backup and door-blow operational modes. 

The inner surface is covered by a multilayer thermal insulation blanket. A 

screen attached to the door covers the blanket to prevent excessive billowing 

3.5-3 

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Hatch 

Figure 3.5-2. 

R11hber Seal 

Ruhh£'r Snuhhc-rs 

Ejectohle Hatch 

Bl F-008- _ W-C-019841-RI-80 

Switch IMP 5587 

NOTF.: Coordini'ltes shown 

are BTF-008 Vehicle 

Coorditu1tes. 

--(SS, 1~11' opposite) 

-Y Side (+Y side opposite) 

Hatch Ejection Mechanism 

Switch SIR fSl9 

Motor Lockout 

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Viewport Door Drive Mechanism and Instrumentation 

~-~ -Y 

NOTES< 

I. T•tE PRIMARY DRIVE MOTOR, Pl!!MARV OOIVE LIMIT SW!lCHES, BACK-UP MOTOR, MOTOR DOG, CUP DOG, Btal.P PIN-Ptn .. LER, 

AND DOOR BLOW PIN-PULLER ARE SHOWN ON THE 

OPPOSHE SIOE OF THE SP·DER AND DOOR DRIVE 

LINKAGES THAN THE ACTUAL HARDWARE FOR CLAR: TY CF 11.LIJSTRATIO'll • 

2.AXES SHOWN . .IRE. BIF-008 VEHICLE COORDINATES. 

}.IN MANY CASES THE SHAPE OFACW.PONENT HAS BEEN SIJ8STANTIALLY 

MODIFIED IN ORDER TO MORE CLEA>!LY !lllJSTRAlE ITS FUNCTION 

3,5-5/3.5-6 

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as air escapes during launch, and supports the ground heater tapes which will 

be removed effective with FM-50 (reference Part 3, Section 8). Mounted at 

the center of each screen is a thermistor used to monitor temperatures during 

flight. 

5.2.1.1 Door Hinge Assembly. The door hinge assembly is shown in Figure 3.5-3. 

The hinge shaft is supported at each end by a self-aligning bearing attached 

to the vehicle box beam. The door hinges attach to the shaft between the two 

bearings. A flexible coupler at the -X end of the hinge-support shaft connects to a shorter segment which is driven by the actuating arm and a torsion 

spring. Cams on this section operate the door counter microswitches, and the 

attached sector gear drives the door position instrumentation potentiometer. 

The use of self-aligning bearings provides adequate margins of clearance between the bearings and door hinges and allows the doors to function normally 

during structural changes caused by thermal conditions. Normal hotdogging 

of the COM will not cause binding along the door-hinge line. 

5.2.2 Viewport Door Drive Mechanism 

The viewport door drive mechanism consists of those components necessary to 

operate the doors in the primary, backup and door-blow modes. 

5.2.2.1 Primary Drive Motor and Linkage. Primary drive is provided by a 

unidirectional de motor located on the +X side of the forward barrel partial 

bulkhead. The motor actuates the primary drive linkage from the spider 

through an eccentric which rotates in 180-degree increments for door open and 

door close. The primary drive linkage consists of two sections held together 

during primary mode operation by a pin-puller assembly. Two pyrotechnic 

3.5-7 

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devices are available to actuate the pin-puller upon command; either can 

generate sufficient force to retract the pin. When using the backup mode 

(pin retracted), the two parts slide, one within the other, as the spider 

rotates. 

The primary drive motor is capable of developing sufficient torque to damage 

the linkage, should binding occur between the eccentric and the flexible 

coupling on the door support shaft. Microswitches, actuated by a cam on the 

motor shaft, stop the motor when it has reached its commanded position (refer 

to Section 5.3.1.4 for primary mode operation). 

5.2.2.2 Backup Drive Motor and Linkage. In the event of a failure in the 

primary drive, a secondary drive system is available which can be commanded 

to open and close the doors after actuation of the pyrotechnic pin-puller in 

the primary drive linkage. The backup system utilizes a bidirectional drive 

motor with internal, mechanically actuated, torque-limit switches to control the motor open and close positions. 

The backup motor is attached to the partial bulkhead of the forward barrel 

and extends into the supply electronics module section of the vehicle through 

a cutout provided in the aft end of the SEM. A cup and motor dog linkage 

(reference Figure 3.5-3) connects the backup drive to the spider assembly. 

Spacing between opposite shoulders of the cup dog is sufficient to allow 

the primary drive to open and close the doors without turning the motor dog. 

In the backup mode, the doors will not begin to move until the motor dog 

contacts the shoulders of the cup dog, providing a solid link between the 

motor and door actuating arms. In operation, the backup motor will supply 

less torque than the primary drive. Binding in the door linkage will cause 

the torque-sensing switches to trip before the linkage can be damaged. 

3.5-8 

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5.2.2.3 Spider and Actuating Arms. The spider joins the primary and backup 

drives and the door actuating arms, and, in conjunction with the backup 

drive cup dog shaft, forms the door-blow mode disconnect point. The primary drive link and door arm attachment points lie on a 1.5-inch radius 

from the center of rotation. As shown in Figure 3.5-4, a pin-puller, actuated by redundant pyros, locks the spider and cup dog shaft together in 

the primary and backup modes. Retracting the pin (door-blow) after disconnecting the primary drive link allows the spider to rotate freely. The 

torsion springs will then force open the doors and hold them in the open 

position permanently. 

Operation of the door actuating arms can best be understood by referring to 

Figure 3.5-3. The arm is a two-section rod, one sliding inside the other. 

A pin fastens the two together and holds the spring retainer cap in position. 

The pin moves in a slot on the outer section as the arm extends. When opening, the pin is driven up against the end of the slot (spring relaxed) and 

the arm is effectively a solid rod driving the doors. During closing, the 

spring compresses until its force exceeds that generated by the hinge-line 

torsion spring, and door motion begins. The motor is adjusted to drive 

slightly past the door closed position, compressing the arm spring further 

to ensure that· the doors seal tightly. However, the pin does not contact 

the end of the slot. 

5.3 Viewport Door Electronics Module 

The viewport door electronics module, located on the -Y side of the SEM 

near Station 77 (reference Part 3, Section 1), provides the circuitry to 

operate the viewport door subsystem and also the telemetry to verify its 

operation. The unit interfaces with the command processor and the initiator 

electronics unit for commands, receives power from the power monitor and 

control unit, and provides instrumentation outputs to the instrumentation 

processor. 

3.5-9 

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2. Coordinates 

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For electromagnetic interference control the unit is compartmentalized with 

filters between the two sections. The "clean" side of the enclosure contains 

two small resistor-divider network circuit boards for forward barrel instrumentation and harnessing. The "dirty" side of the enclosure contains the 

relay door operations counter circuitry and the motor control circuitry. The 

entire unit is foam potted. 

5.3.l Viewport Door Control 

Figure 3.5-5 presents a simplified electrical diagram of the door control 

circuitry, showing the primary and backup door drives and the hatch eject 

and door-blow actuation signals from the initiator electronics unit. 

5.3.1.1 Hatch Eject. Ejection of the main hatch is accomplished by the actuation of six pyrotechnic pin-pullers, releasing the hatch and allowing leaf 

springs to push the hatch free from the vehicle. The circuitry controlling 

the pin-pullers is located in the initiator electronics unit along with instrumentation for command receipt and firing pulse generation verification, 

Four microswitches on the +Y and -Y sides of the hatch (two per side) form 

part of the instrumentation and control circuit. Upon release of the hatch, 

one set (+Y and -Y) provides redundant 5-volt signals through the viewport door electronics to the instrumentation processor for telemetry. The 

second set (wired in parallel) connects the primary door motor return line 

to the viewport door electronics module, enabling the primary door drive. 

5 .3.1.2 Primary to Backup Drive Switchover. Redundant latching relays are 

used to switch unregulated power (24.5 vdc nominal) from the primary to the 

backup drive circuitry upon command. These relays are reset to the primary 

mode prior to launch by the LAUNCH PRESET command from the vehicle umbilical 

line. They cannot be reset on-orbit, therefore, primary to backup switchover 

is irreversible after launch. 

3.5-11 

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3.5-12 

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Figure 3.5-5. Viewport Door Subsystem Electronics 

J 

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_.-<~---~IMP 55B7 

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DOOR POSITION INSTRUMENTATION 

POTENTIOMETERS 

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5.3.1.3 Door Open/Close Circuit. The two motor-drive relays, primary and 

backup, are operated in parallel by the DOOR OPEN/CLOSE command inputs. 

Power is provided to one of the two relays as determined by the status 

of the primary to backup switchover circuit (Section 5.3.1.2). Power 

output to the motors is fused only for the primary open/close lines, using 

two parallel 5.0-ampere fuses per line. 

5.3.1.4 Primary Drive Control and Operation. The primary drive employs 

a unidirectional de motor which, upon receipt of 24.5 vdc power (DOOR OPEN 

or DOOR CLOSE command) from the viewport door electronics, drives to the 

commanded state. To prevent door operation with the ejectable hatch in 

place, two redundant interlock switches are connected in series with the 

primary motor power return (Section 5.3.1.1). Once the hatch is ejected, 

the switches close and complete the circuit. This is the only enabling 

function necessary for primary door operation. 

Two pair of parallel redundant limit switches, actuated by a cam on the 

motor shaft, remove power from the primary motor when it reaches the commanded state. Once the door open limit switches have been actuated (circuit opened), the door motor will not operate unless the DOOR CLOSE command 

is given. When the doors reach the fully closed position, the other pair 

of drive limit switches are actuated, and the doors will not move until the 

DOOR OPEN command is given. 

The limit switches allow opposite commands to operate the subsystem only 

after the doors have completed one third to one half of their normal transition (normal transition time: 7 seconds). If an opposite command is 

given during the first part of the transition, when one of the pairs of 

switches are open, a loss of power will result and the motor will stop. 

the original command must be repeated to apply power to the motor. If both 

3.5-15 

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pairs of limit switches are closed and an opposite command is given during 

transition, the motor will satisfy the original command, and continue running (moving the doors in the reverse direction) to also satisfy the 

second command. 

S.3.1.S Backup Door Control and Operation. The backup drive can be commanded to open and close the doors after actuation of a pyrotechnic pinpuller, which disengages the primary drive link from the spider (Figure 3.S-4). 

In executing this command, the initiator electronics unit (IEU) simultaneously 

transmits a pulse to the primary-to-backup switchover circuitry in the viewport 

door electronics module, transferring power to the backup motor drive relay. 

The backup motor, as previously described, is a bidirectional de motor which 

drives the spider through a cup and dog linkage (reference Figure 3.S-3). 

The motor open and close positions are controlled by mechanically actuated 

torque-limit switches (SS and S6 on Figure 3.S-6) located inside the backup motor housing. Switches SS and S6 are shown in their positions when the 

doors are fully closed. Switch S6 is tripped to position B due to torquesensing, switch SS is not tripped and is in position A. The operation of this 

system is described for the open and close cycles as follows: 

(1) A DOOR OPEN command switches power of correct polarity 

to the motor and the motor runs allowing the torsion 

springs on the door hinges to open the doors. As the 

doors leave the closed position, switch S6 is released 

and trips back to position A. The cup dog follows the 

motor dog (the motor is restraining the springs) allowing a steady linear drive. ~Tien the doors hit the full 

open stop, the cup stops and the motor drives through 

the deadband until it hits the other cup dog shoulder. 

The sudden increase in motor torque at this point causes 

the torque-sensing mechanism to trip SS to position B 

removing power from the motor. 

~ 

3.S-16 

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(2) A DOOR CLOSE conunand switches power of correct polarity 

to the motor. The motor drives from one cup dog to the 

opposite cup dog before actually starting to close the 

doors. As the motor begins to turn, switch SS is released 

and trips back to position A. Once the cup dog is engaged, 

the motor drives linearly all the way (against the torsion 

springs) until the doors hit the fully closed stop (the 

door frame). The sudden increase in motor torque at this 

point causes the torque-sensing mechanism to trip S6 to 

position B, removing power from the motor. 

The normal transition time for the doors to operate in the backup mode is 14 

seconds. It should be noted that the backup motor will supply less opening 

torque than the primary motor drive. 

With the viewport doors closed, the motor dog and cup dog are in such a 

position that commanding DOOR BACKUP results in the doors being immediately 

driven open by the hinge-line torsion springs. They can then be closed upon 

commanding DOOR CLOSE, and the backup mode will operate normally thereafter. 

The backup mode of operation cannot be reversed to the primary mode. 

S.3.1.6 Viewport Door Blow. The DOOR BLOW command, processed in the IEU, 

does not literally blow open the doors as implied, but causes a pyrotechnic pin-puller to fire, disengaging the backup motor from the spider 

(reference Figure 3.5-3). Since the primary drive linkage is already disconnected (execution of DOOR BACKUP is necessary to enable DOOR BLOW), the 

torsion springs on the hinge-line will cause the doors to open fully. The 

doors bounce slightly before settling against the door stop and remain open. 

The torque exerted by the springs to open the doors is marginal, and it is 

very unlikely that the springs would force the doors through a mechanical 

bind which would prevent both the primary and backup motors from opening the doors. 

3.5-18 

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81 F-OOB- __ w_-c_-_0_1_9 8_4_1_-_8_0_ 

Normally, the primary drive would be used unless it malfunctions, then a 

switch-over to the backup drive and, as a last resort, the door-blow condition which leaves the doors open permanently. 

5.3.1.7 Vignetting (Incomplete Viewport Door Opening). The principal 

effect of having the viewport doors only partially open is a reduction 

in photographic exposure. Providing that the doors open wider than 

some minimum amount, this result can be compensated for by commanding 

a wider exposure slit than that which would normally be used. Expected 

values of exposure reduction versus door position are presented in 

Figure 3.5-7. 

Failure of the doors to open fully, or close fully, can often be detected by 

variations in the focus detector input levels. As such, the focus detector 

instrumentation can provide useful additional information in conjunction 

with the normal door instrumentation. 

5.3.1,8 Operational Waveforms. The following graphs (Figures 3.5-8 through 

3.5-12)present typical door position and motor current traces, as applicable, 

for the primary, backup, and door-blow modes. The current amplitudes and door 

transition times are typical and should not be taken as representative of 

any one vehicle. For specific values, refer to the Flight Model Calibration 

Book supplied with each vehicle. 

5.4 VieWEort Door Subsystem Instrumentation 

Table 3.5-1 summarizes the instrumentation associated with the viewport doors. 

3.5-19 

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BIF-008- W-C-019841-RI-80 

TABLE 3. 5-1 

VIEWPORT DOOR SUBSYSTEM INSTRUMENTATION SUM!'v!ARY 

IMP Title 

5100 Viewport Door Position +Y 

5104 Viewport Door Position -Y 

5111 Temperature Viewport Door 

Inside Insulation -Y 

V-1 

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(J1 

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5114 Temperature Viewport Door 

Inside Insulation +Y 

5146 Viewport Door Operation 

Handle via BYE.MAN 

Control System Only 

Description 

A notentiometer located on the +Y door hinge is turned 

a sector gear as the door moves (see Figure 3.5-3). 

The notentiometer is part of a resistance network 

door electronics. The netof the door 

Door closed - 3,6v (0°) 

Door open - 0.5v (62°) 

Similar to IMP 5100, the potentiometer is located on 

the -Y door 

at the center of the -Y door 

screen monitors the tempera-

-Y door. A load resistor in the 

processor (IP) reduces the output 

le levels. The output is nonlinear, 

from 40F (4.95v) to lOOF 

Similar to IMP 5111, monitors the temperature 

inside the +Y door. The output, processed in the 

IP, is nearly linear from 32F (1.15v) to lOOF (3.2v). 

Microswitches actuated by earns on the viewport 

door hinge-line, when closed, send a controlled power 

se to the door operations counter circuit in the 

electronics. Two microswitches are 

door. One switch is closed when the door 

is closed and the other switch is closed when the door 

is open. The +Y and -Y switches for each state are 

in series. Both must work to increment the counter 

3.5 -3 and 3,5-5). The counter 

circuit whose occurs in eight 

TAD C:lliP811i'I' G 

Power 

+5 vdc 

+15 vdc 

+15 vdc 

+S vdc 

+15 vdc 

(24. 5 vdc) 

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5090 

Title 

Crab, Stereo, and Door 

Current 

Handle via BYEMAN 

Control System Only 

Bl F-00.8- W-C-019841-RI-80 

TABLE 3.5-1 

Description 

discrete steps as follows: 

Door Operation Counter 

Ste~ Door Position Volts 

-- 1 Closed 1.0 

2 Open 3.0 

3 Closed 1.5 

4 Open 3.5 

5 Closed 2.0 

6 Open 4.0 

7 Closed 2.5 

8 Open 4.5 

completion of Step 8, the counter recycles. the 

circuit is such that the count is not altered by removal or reapplication of power. 

Unregulated (24.5-vdc) power is used to operate the 

latchim~ relays. 

A current-sensing resistor in the power return line in 

the PM and C generates a voltage proportional to the 

currents for the crab and stereo servos, and 

the viewport door motor and electronics. The signal 

ified within the PM and C to produce a linear 

0.2v (0.0 amp) to S.Ov (6 amps). 

Power 

±15 vdc 

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5587 

5588 

5035 

5122 

Title 

Hatch Eject +5 vdc 

Hatch Eject +15 vdc 

Stereo Drive Transfer 

Bit 1,2, Viewport Door 

Open/Close, Crab 

Polarity +/-

CBM*** for IEU (#7) 

*Least Significant Bit 

**Most Significant Bit 

***Command Bit Monitor 

Handle via BYEMAfll 

Control System Only 

BIF-008- W-C-019841-RI-80 

TABLE 3.5-1 (CONT'D) 

Description 

A microswitch located under the -Y side of the main 

hatch is released when the hatch is ejectel:i. The 

associated resistor network is located in the viewport door electronics and indicates 0.5 vdc (hatch 

in place) or 4.5 vdc (hatch ejected). Output is 

digitized in the DTU yielding a binary signal: 

11 011 = Hatch in place 

"l" = Hatch ejected 

Similar to IMP 5587, the microswitch is located 

under the +Y side of the main hatch. 

Latching relays tracking the command input relays 

of the command processor monitor the receipt of 

commands from the 1 control section and 

feed either O.Ov or 5.0v to an integrated circuit D/A 

converter. Four relays and one 4-bit D/A converter form the IMP. Output occurs in sixteen 

(16) discrete steps ranging from 0.25v to 4.75v 

in 0.3v increments: 

Power 

+5 vdc 

+15 vdc 

+5/±15 vdc 

Bit 1 (LSB)* = Stereo Drive Transfer Bit 1 (14V WORD Bit 27) 

Bit 2 = Stereo Drive Transfer Bit 2 (14V WORD Bit 28) 

Bit 3 = Viewport Door Open/Close 

Bit 4 (MSB)**= Crab Polarity +/-

Latching relays, operating in parallel with the command +15 vdc 

relays of the IEU, monitor the receipt of commands from 

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5123 CBM for IEU (#8) 

5548 Hatch Eject 1 

5549 Hatch Eject 2 

5550 Hatch Eject 3 

Handle vi a BY EM AN 

Control Systm Only 

BIF-008- W-C-019841-RI-80 

TABLE 3.5-1 (CONT'D) 

D~scription 

the satellite control section. Four relays and a resistance network form a D/A converter whose output 

occurs in sixteen (16) d~screte steps ranging from 

0.2Sv to 4.75v in 0.3v increments: 

Bit 1 (LSB) 

Bit 2 

Bit 3 

Bit 4 (MSB) 

Similar to IMP 5122: 

Minimal Arm 1 Enable 

= Vi~wport Door Blow A 

= Viewport Door Backup A 

Hatch Cover Eject A 

Bit 1 (LSB) = Minimal Arm 1 and 2 Enable 

Bit 2 = Viewport Door Blow B 

Bit 3 = Viewport Door Backup B 

Bit 4 (MSB) = Hatch Cover Eject B 

A latching relay in the initiator electronics unit 

monitors generation of a pyro firing pulse for pyro 

l in the hatch. The output is connected either to 

instrumentation return or, when closed by a firing 

pulse, to +S vdc in series with an isolation resistor. 

Tl1e output is digitized by the DTU, resulting in a 

binary signal: 

"0" = Quiescent 

"1" = Fired 

Power 

+5 vdc 

+5 vdc 

Similar to IMP 5548, monitors the firing pulse output to +5 vdc 

pyro 2 in the hatch. 

Similar to IMP 5548, monitors the firing pulse output to +5 vdc 

pyro 3 in the hatch. 

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IMP Title 

5551 Hatch Eject 4 

5552 Hatch Eject 5 

5553 Hatch Eject 6 

5554 Hatch Eject 7 

Hatch ect 8 

vi 

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Vt 

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vi 

0 

5557 Hatch ect 10 

5558 Hatch Eject 11 

5559 Hatch Eject 12 

5560 Backup Motor Actuate 1 

5561 Backup Motor Actuate 2 

Handle vi a BY EM AN 

Control System Only 

BIF-008- W-C-019841-RI-80 

TABLE 3.5-1 (CONT'D) 

Des_s:!iptj._oD_ f:ower 

Similar to IMP 5548, monitors the firing pulse output +5 vdc 

to pyro 4 in the hatch. 

s lar to IMP 5548, monitors the firing pulse output +5 vdc 

to pyro 5 in the hatch. 

s lar to IMP 5548, monitors the firing pulse output +5 vdc 

to pyro 6 in the hatch. )> 

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0 

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c. 

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0 

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0'1 

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to pyro 12 in the hatch. 

Similar to IMP 5548, monitors the firing pulse output +5 vdc 

to pyro 1 in the primary motor linkage to the spider 

(reference Figure 3.5-3). 

Similar to IMP 5548, monitors the firing pulse output +5 vdc 

to pyro 2 in the prima'ry motor linkage to the spider. 

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5562 Viewport Door Blow 1 

5563 

5059 Focus 

5231 

5105 

Handle via BYEMAN 

Control System Only 

Door Blow 2 

Irradiation Level 

Irradiation Level 

1 B) 

Bl F-008-___ W-C- _:___:_:_:__:.: 1-RI-80 

TABLE 3.5-1 

Description 

to IMP 5548, 

1 in the b 

F 

s to IMP 

voltage 

ment ranges 

to 3.75v 

to 

pulse out1 inkage to the 

se output 

the spider. 

focus electronics 

electronics 

energy on 

from 

signal 

s 

lar to IMP 5231, monitors the Channel B 

detector 

Power 

---

+5 vdc 

+5 vdc 

±15 vdc 

±15 vdc 

±15 vdc 

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5.5.1 

5.5.2 

5.5.3 

Approved for Release: 2017 /02/14 C05097222 

G 

BIF-008- W-C-019841-RI-80 

Viewport Door Subsystem Command Summary 

HATCH EJECT Command 

(P02570, P01570, P03570) 

Function: 

Interlocks: 

Comments: 

This command applies power to the pyros in the 

pin-pullers which release the hatch covering the 

viewport door. 

Successful completion of hatch ejection enables 

the primary viewport door motor-drive circuits. 

The hatch should be ejected no later than 30 

minutes after liftoff to insure that it is 

sufficiently separated from the vehicle. 

DOOR BACKUP Command 

(P02575, P01575, P03575) 

Function: 

Interlocks: 

Comments: 

This command applies power to the pyros which 

disengage the primary viewport door drive motor. 

Power is switched to the backup door motor. 

This command enables the DOOR BLOW command. 

This command is irreversible. 

This command is not normally given except in the 

event of a primary mode failure. 

DOOR BLOW Command 

(P02574, P01574, P03574) 

Function: 

Interlocks: 

This command applies power to the pyros which 

disengage the backup motor from the door drive 

linkage. 

This command permanently opens the viewport doors. 

This command is enabled by the DOOR BACKUP command. 

3.5-32 

Approved for Release: 2017 /02/14 C05097222 

Handle vi a BY EM AN 

Control System Only 
5.5.4 

Comments: 

Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

This command is irreversible. 

This command should be used only in extreme situations, since the viewport doors cannot be closed 

and the camera optics module will be unable to 

sustain its required temperature. 

4V WORD Command (Bit 36: Door Open/Close) 

(4V0252bZ, 4V0152bZ, 4V0352bZ) 

Function: 

Interlocks: 

Comments: 

This command is the normal means of operating the 

viewport doors. It also controls the focus subsystem and S-1/PRG operate and calibrate modes. 

The bit functions are: 

Bit 

Implicit 

35-1 

35-0 

36-1 

36-0 

~;=~ } 38-1 

38-0 

Function 

Spare 

FEP ON, S-1/PRG Enable, S-1/PRG Power ON 

FEP OFF, S-1 /PRG Power OFF 

Door Open 

Door Close 

Focus Calibrate Modes 

(In desired sequence; 

reference Part 3, 

Section 6) 

The viewport door primary motor-drive circuits are 

enabled by successful ejection of the viewport door 

hatch. 

This is the only command which opens the viewport 

doors except for DOOR BLOW. 

The viewport doors require approximately seven 

seconds to move from one position to the opposite 

position in the primary mode. Once commanded to a 

position, the opposite command should not be given 

for at least three seconds. 

In the backup mode, the doors require approximately 

14 seconds transit time and, once commanded to a 

position, the opposite position should not be commanded for at least 15 seconds. 

3.5-33 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYEMAN 

Control System Only 
5.5.5 

Approved for Release: 2017 /02/14 C05097222 

BIF-008- ~-C-019841-RI-80 

DOOR CLOSE Command (MCS) 

(MN00127) 

Function: 

Comments: 

This command closes the viewport doors in either 

the primary or backup modes. 

The doors will take approximately seven seconds to 

close in the primary mode and 14 seconds to close 

in the backup mode. 

There are no commands in the MCS to open the doors. 

3.5-34 

Approved for Release: 2017 /02/14 C05097222 

Handle vi a BY EM AN 

Control System Only 
Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

6.0 FOCUS DETECTION SUBSYSTEM 

The focus detection subsystem is a self-contained electro-optical device consisting of three subassemblies; the focus sensor head assembly, the instrumentation and control module, and the signal normalizing module. The three 

subassemblies are pictured in Figure 3.6-1, and shown installed in the dual 

platen camera in Figure 3.6-2. A block diagram of the focus detection subsystem is shown in Figure 3.6-3. 

6.1 System Description 

A brief description of each of the three modules comprising the focus detection subsystem is included below. 

6.1.1 Focus Sensor Head Assembly (Unit 15A2) 

The focus sensor head assembly consists of two basic modules; the frame and 

optics assembly and the dual detector and signal processing module. The focus 

sensor head assembly is approximately 5.50 inches by 4.75 inches by 3 inches. 

The assembly weighs less than 2.5 pounds. A pictorial drawing of the focus 

sensor head assembly is provided in Figure 3.6-4. 

"WARNING-THIS DOCUMENT SHALL NOT BE USED AS A SOURCE FOR DERIVATIVE CLASSIFICATION" 

3.6-1 

~G 

Approved for Release: 2017 /02/14 C05097222 

Hand l e v i a BY EM AN 

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Dual Detection and 

Signal Processing Module 

Connector 

to Camera I 

/ 

Focus Sensor 

Instrumentation and 

Control 

Figure 3.6-1. Focus 

Bl f-008- W-C-019841-RI-80 

Temperature 

Sensor Location 

Optics 

Assembly 

Subsystem Elements 

Signal Normalizing 

Module 

+X 

+Z 

'l •+Y 

BIF-008 Vehicle 

Coordinates 

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5-Inch Folding Mirror 

(Showing Reflection of 

Handle via BYEMAN 

C.Ontrol Sys tan On 1 y 

Camera 

Connector 

Bl F-008- W-C-019841-RI-80 

Focus Detector Folding Mirror ,,__ (Reticle Mask Visible) 

Baffle 

Mounting Surface 

+Z 

.__---•.+Y 

+X Out of Page 

BIF-008 Vehicle 

Coordinates 

Figure 3.6-2. View into Camera (Baffle Removed) 

Tb P §fEDE..T G 

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Control System On 

--

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LED and Frame 

Assembly 

Dual Detector 

Process 

Module 

* Frame 

Sensor Head Assembly 

*Calibration 

Figure 3.6-3. Focus Detection Sub 

* Dual 

BIF-008- W-C-019841-RI-80 

Signal 

Normalizing 

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Block Diagram 

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Locating Pins 

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Frame 

I .,.+Y 

h . +X BIF-008 Ve icle 

Coordinates 

I ... +z 

Dual Detector and Signal 

Processing Module 

+X 

BIF-008 Vehicle 

Coordinates 

Connector to Instrumentation 

and Control Module 

BIF-008 Vehicle 

Coordinates 

+Z 

I ... +Y 

Optics 

Assembly 

(!) 

@ 

@) 

Bl F-008- W-C-019841-Rl-80 

Mounting Shim 

(3 Places) 

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Electrically Isolated 

from Camera 

Connector to Signal 

Normalization Module 

Figure 3.6-4. Focus S~nsor Head Assembly 

Handle via BYEMAN 

Control System Only 

"WARNING -THIS DOCUMENT SHALL NOT BE USED AS A SOURCE FOR DERIVATIVE CLASSIFICATION" 

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Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

6.1.1.1 Frame and Optics Assembly. The frame and optics assembly consists 

of a black, anodized aluminum alloy frame to which the optical elements of 

the focus detection subsystem are mounted. The frame also provides mounting 

surfaces for the dual detector and signal processing module. The frame is 

shim-mounted to the 9 pivot frame of the dual platen camera. Correct rotational alignment is assured by special pins on the frame which engage holes 

in the pivot frame. 

The optics assembly is shown in Figure 3.6-5. (See also Figure 2.5-8 found 

in Volume 1 of this document.) The zero-power achromat provides compensation 

for the dispersion arising in the beam splitter. The incoming light cone is 

deflected 90 degrees by the folding mirror and enters the beam splitter and 

reticle assembly (see Figure 3.6-6). The beam splitter divides the energy 

into transmitted (T) and reflected (R) portions for both Channel A (near) 

and Channel B (far) reticles. As described in Section 2.5, the four-reticle 

arrangement reduces the effect of polarization of the focus indication. 

The folding mirror is a 45-degree glass prism having a surface irregularity 

limit of 0.010 A RMS (at 632.8 nm). The reflecting surface is silvered with 

a high reflectance multilayer coating. (This coating is the same as that 

employed on the stereo mirror.) 

The beam splitter, constructed of FK-51 glass, is of conventional design with 

the transmitted and reflected optical path being equal to within 2A at 632.8 nm. 

Transmittance and reflectance of each unit are measured for unpolarized and 

for plane-polarized light in planes both perpendicular and parallel to the 

plane of incidence. 

The reticles are constructed in matched sets of four from FK-51 glass, coated 

wit~ chrome on one side to a minimum density of 2.4. The coating is etched to 

~ 

3.6-6 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYEMAN 

Control System Only 
+Z 

t ? +Y 

~+X BIF-008 Vehicle 

Coordinates 

Approved for Release: 2017 /02/14 C05097222 

BIF-OOS- W-C-019841-RI-80 

Reticles 

Beam 

Splitter 

Mirror 

Lens 

(Zero-Power Achromat) 

Figure 3.6-5. Focus Detection Subsystem Optics Assembly 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYEMAN 

Control System Only 
Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

- e 45-Degree Chevron Reticle, 14 lpmm 

+Z 

BIF-008 Vehicle 

Coordinates 

Light 

Image Motion 

Figure 3.6-6. Beam Splitte~ and Reticle Assembly 

3.6-8 

Approved for Release: 2017 /02/14 C05097222 

Handle vi a BY EM AN 

Control System Only -
Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

generate a 45-degree chevron reticle pattern having a spatial frequency of 

14 lpmm.* A typical reticle is illustrated in Figure 3.6-7. The reticles are 

bonded to the beam splitter with optical cement. Reticles TA and TB are 

superimposed with reticles RB and RA respectively within 0.001 inch to maximize 

scene correlation. 

6.1.1.2 Dual Detector and Signal Processing Module. The dual detector and 

signal processing module consists of two enclosures which are mechanically 

mounted together. The upper one (-Z direction as installed) houses two component 

boards. The lower one (+Z as installed) houses one component board and contains 

the thermistor which provides data on the module temperature. The enclosures 

form an electrostatic shield around the sensitive circuitry within. 

6 .1. 2 Signal Normalizing Module (Unit 15A3) 

Mechanically, the signal normalizing module consists of an aluminum base on 

which are mounted studs and spacers supporting three component board assemblies. 

The base also has three tapped holes for attachment to the dual platen camera 

housing and a 9-pin microminiature receptacle which provides for electrical 

connection to the focus sensor head assembly. A welded aluminum sheet cover 

attaches to the base with four flathead screws to complete the assembly. 

Figure 3.6-8 shows the signal normalizing module. 

The module is nearly cubical, measuring approximately 2.9 inches by 2.8 inches 

by 2.9 inches. The weight of the module is less than 1.5 pounds. 

6. 1. 3 Instrumentation and Control Module (Unit 15Al) 

The instrumentation and control module is constructed of an L-shaped aluminum 

base and a welded aluminum cover attached by four flathead screws. The base 

*The ±45-degree pattern was selected to eliminate the effect of astigmatism on 

focus sensor indication. 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYEMAN 

Control System Only 
0 

Lil . 

N 

Approved for Release: 2017 /02/14 C05097222 

0.23 NOTES: 

0.402 

G 

BIF-008- W-C-019841-RI-80 

1. Reticle spacing = 14 lines/mm 

at 45° (one line = 1 line and one 

space, equal width) 

2. Reticle shown is for_reflected 

energy and Channel B. 

3. All dimensions are in inches. 

Coated 

Typical (4 Places)_ 

Detai 1 (30X) 

i..ml----111111o+-+--0 • 16 

Typical Reticle (3X) 

\ 

Figure 3.6-7. Typical Reticle 

3.6-10 

Approved 

~ 

for Release: 2017 /02/14 C05097222 

Hand l e v i a BY EM AN 

Cont ro 1 Sys tern On l y 
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Bl F-008- W-C-019841-RI-80 

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Figure 3.6-8. Signal Normalizing Module 

(Unit 15A3) 

3. 6-11 

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incorporates three tapped holes for mounting to the dual platen camera. Studs 

and spacers are provided for securing four component board assemblies. A 

cable passes through the base and is terminated in a 31-pin, microminiature, 

plug-type connector. This cable carries power and signals between the focus 

detection subsystem and the dual platen camera. A 25-pin microminiature receptacle is also mounted to the base to provide the electrical connection to 

the focus sensor head assembly. The instrumentation and control module is 

shown in Figure 3.6-9. 

The module weighs under 1.5 pounds and measures approximately 3.6 inches 

by 2.5 inches by 2.8 inches. 

6.1.4 Dual Photodiode Detector 

The dual photodiode detector consists of a black oxidized stainless steel housing within which are mounted two carefully matched pairs of enhanced sensitivity 

silicone photodiodes operating in the photovoltaic mode. The diodes are insulated from the housing by high-alumina ceramic insulators and the whole assembly 

is ruggedized by use of RTV-60 potting material. Protection is provided by fused 

quartz glass covers which are held in place by beveled edges and sealed by epoxy 

optical cement. The dual photodiode dc.:tc.:ctor ::s shown in Figure 3.6-10. 

6.1. 5 Light-Emitting Diode (LED) Array 

The LED array is made up of eight red (650 run) GaAsP, hermetically sealed and 

matched LED's mounted to a circuit board 2.50 inches long and just under 0.438 

inch wide. The board is attached to an aluminum frame. This frame attaches to 

the head assembly in such a manner as to allow the LED's to illuminate the face 

of the beam splitter not facing the dual detector or the folding mirror. The 

diodes are connected in series-parallel for reliability and power savings. The 

diodes are procured in sets of 10, matched so that the output lobes are within 

a IO-degree angle from center. A represen_tation of .the optics assembly with the 

·'WARNING-THIS DOCUMENT SHALL NOT BE USED AS A SOURCE FOR DERIVATIVE CLASSIFICATION 

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dual photodiode detector and the LED array is shown in Figure 3.6-11. 

6.2 System Operation 

Theoretical and developmental considerations are treated in Part 2, Section 5, 

while this section describes the system hardware. A functional block diagram 

is shown in Figure 3.6-12. 

6.2.1 Focus System Head Assembly 

Operationally, the focus system head assembly accepts optical signals (moving 

scenes), converts these optical signals to electrical signals, amplifies these 

signals, and converts the ac signals to de levels. 

6.2.1.1 Optics Assembly. The optics assembly receives a portion of the incoming scene energy at a point 0.75 inch off the main optical axis. The 

scene is spatially filtered by the 45-degree chevron reticles located equidistantly ahead of (Channel A) and behind (Channel B) the nominal focal plane. 

These optical signals represent samples of the ±45°, 14 lpnun, off-axis MTF 

curve at the reticle focus positions. 

6.2.1.2 Dual Detector and Signal Processing Module. The optical signals 

which result when the moving scene passes over the reticles at a 45-degree 

angle are linearly converted to their electrical analogs by the dual photodiode detector module. These electrical signals have a de range of from 0.5 

microamp to 100 mic!oamps and a range of ac modulation (211 to 2967 Hz) from 

0.066 nanoamp to 59.5 nanoamps RMS. 

The two signals from the dual photodiode detector module are routed to a 

current-to-voltage converter (see Figure 3.6-13). The virtual ground configuration is required to obtain the desired frequency response with the high 

shunt capacity of the large-area photodiodes and to allow interconnection 

~ 

3.6-15 

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of the photodiodes. The load resistor associated with this stage is sized to 

to maximize signal-to-noise ratio. 

Channels A and B have signal amplifiers following the current-to-voltage converters 

which have been carefully gain matched to allow no more than 1% difference between 

the A and B channel responses. 

The signal amplifiers allow two possible gain-bandpass signal responses for each 

channel. One bandpass, termed the "Modified Mode", processes signals with 

frequency between 2967 Hz and 850 Hz (image velocities of 11.8 to 3.37 

respectively). For signals between 850 Hz and 211 Hz, the other bandpass or 

"Normal Mode" would be selected. Center frequency gain of the Modified Mode 

occurs at 2000 Hz and amplifies the signal by 9400. The Normal Mode peaks at 

850 Hz with a gain of 3500. Figure 3.6-14 shows the frequency responses for each 

mode. 

The signal amplifiers are composed of three real pole active bandpass amplification 

stages each having fixed gain and frequency response. Figure 3.6-15 shows an 

amplifier typical of one of these stages. The fixed gain stages are followed by 

a selectable bandpass section which provides two possible real pole active filters 

for each channel, either of which can be toggled into the signal processing path. 

This combination provides the two ranges of gain and bandpass. Figure 3.6-16 

shows the dual range amplifier. As shown, relay contacts are used to change both 

the feed forward and the feedback capacitor values which create the filter breakpoints and the gain. The relays are pulsed from Command Processor outputs. 

The amplification accumulated by this series of amplifier stages provides from 

0.05 volt to 5.0 volts (depending on the incoming signal) at the input to the 

RMS-to-de converters. 

The RMS variation for each channel is converted to a de signal proportional to 

the amplitude of the true RMS signal. The signal-processing to determine the 

degree and direction of defocus is performed on these de signals in the signal 

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normalizing module. Additional outputs are obtained through a buffer amplifier 

for each channel which provides a de level proportional to the average irradiance 

incident on the photodiode. 

6.2.2 Signal Normalizing Module 

The signal nonnalizing module receives the de signals from the dual detector and 

signal processing module. The de signals (Channel A and Channel B) are presented 

to a difference amplifier and a summing amplifier. The sum and difference signals 

are input to a divider whose output is proportional to 2 (A-B)/(A+B). Scaling 

amplifiers provide outputs in the desired voltage range. 

6.2.2.1 Difference Amplifier. The difference amplifier has an amplification of 

2.94, hence the output is 2.94 (A-B). The range of differences presented to the 

difference amplifier is -3.4 volts to +3.4 volts, therefore the output range is 

-10 volts to +10 volts. The difference amplifier has to be accurate for a 1.7-

percent error condition at the SO-millivolt level of de input, or 0.8S millivolt. 

The operational amplifier is selected to have an offset voltage of less than 

0.07 millivolt to minimize error at this level. 

The output of the difference amplifier is presented to a scaling amplifier and 

low-pass filter. This amplifier is scaled to cover the range of a minimum 7.Spercent error at the SO-millivolt level (3.7S millivolts) and a maximum error of 

lS percent at l.2S volts (187.S millivolts) for conditions of both A greater 

than Band B greater than A. A reference level of 2.S volts is established for 

the A equal to B case. This output is telemetered to the ground as the focus 

difference signal (IMP Sl08). The low-pass filter cuts off at 0.11 Hz (time 

constant= l.S seconds). A typical scaling amplifier and low-pass filter is shown 

in Figure 3. 6-17. 

6.2.2.2 Summing Amplifier - The range of sums presented to the sununing amplifier 

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~Figure 3. 6-17. Typical Scalil}g Amplifier and Low-Pass Filter 

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inverting amplifier having unity amplification. The offset voltage of the summing 

amplifier is typically 0.2 millivolt. 

The output of the summing amplifier in the signal processing module is fed into 

a piecewise-linear scaling amplifier and low-pass filter. The piecewise linear 

amplifier consists of two operational amplifiers with a zener diode in the feedback 

path of the first amplifier. This zener diode establishes the piecewise linear 

breakpoint. For an input signal of 0.1 to 1.5 volts, the amplification of the twosection amplifier is 2.5 and for an input signal of 1.5 volts to 10 volts, the 

amplification is 0.118. The low-pass filter has the same cut off frequency as 

the filter in the difference circuit; i.e., 0.11 Hz. This level is presented to 

the telemetry circuit as IMP 5059, focus signal strength. 

6.2.2.3 Divider. The divider accepts inputs from the difference amplifier and 

the summing amplifier. The difference amplifier feeds the "numerator" input 

while the summing amplifier feeds the "denominator" input. 

The divider output, representing 2(A-B)/(A+B) is routed simultaneously to two 

scaling amplifiers and low-pass filters in the instrumentation and control module. 

The divider output is 62.5 millivolts/I-percent difference. For every 1.7 percent 

error between the output of the rms/dc converters, the divider output changes 

62.5 millivolts. 

6.2.3 Instrumentation and Control Module 

The instrumentation and control module contains the scaling amplifiers and lowpass filters for the focus correction signals, the LED oscillator and driver, 

scaling amplifiers for the average irradiation signals, and the temperature 

sensor bias network. 

6.2.3.1 Focus Correction Signal Instrumentation. The output of the divider in 

the signal normalizing module is presented to the two scaling amplifier and lowpass filter sections in the instrumentation and control module. 

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have a reference voltage adjustment so that both sections may be made equal to 

2.5 volts for the A= B condition (50 millivolts to 5 vdc level). Both filters 

have the same cut off frequency (0.11 Hz) as the other amplifiers described 

earlier. 

The output of the scaling amplifier and low-pass filter section with the coarse 

sensitivity is referred to as the focus correction signal, coarse (IMP 5107). 

For a defocus condition of +0.0033 inch (B > A) to -0.0033 inch (A> B)*, the output ranges from 0.5 volt to 4.5 volts for a sensitivity of -0.6 volt/0.001 inch. 

The output of the scaling amplifier and low-pass filter section having the fine 

sensitivity is referred to as the focus correction signal, fine (IMP 5067). 

For a defocus condition of -0.0020 inch (B >A) to +0.0020 inch (A> B)*, the 

output ranges from 0.5 volt to 4.5 volts for a sensitivity of 1.0 volt/0.001 inch. 

6.2.3.2 LED Oscillator and Driver. The LED array is driven, on command, by the 

oscillator and driver at one of four possible frequencies (300 Hz, 850 Hz, 1025 Hz 

and 1600 Hz) and one of two amplitudes as seen at the output of the RMS-to-de 

converter (250 millivolts and 2.5 volts). Figure 3.6-18 shows a schematic of the 

LED oscillator. Depending on the state of the frequency range select, either the 

300 Hz and 850 Hz pair (distinguished by the frequency select switch position) 

or the 1250 Hz and 1600 Hz pair of signal frequencies drives the LED array. (The 

frequency range select is slave to the "Hi-Lo" command bit.) Because of the 

manner in which the circuit is commanded, only 6 of the 8 possible combinations 

of amplitude and frequency are used. Two of the eight states produce the OFF 

case (see Section 6.3, Focus Detection Subsystem Commanding). 

6.2.3.3 Scaling Amplifiers. The scaling amplifiers operate on the de irradiance 

signal (see Section 6.2.1.2) whose source is the buffer amplifiers and low-pass 

filters in the dual detector and signal processing module. The scaling amplifier 

amplification is set to yield a 5-volt output when the de level current into the 

current-to-voltage converter is 80 microamperes. The low-pass filter has a cut 

off of approximately 1 Hz. Figure 3.6-17 shows a typical scaling amplifier. 

*Defocus indicates reticle position relative to best focus {positive reference 

towards the Ross corrector). 

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BIF-008- W-C-019841-RI-80 

The average irradiation level for Channel A appears as IMP 5231 and for Channel B 

as 5105. 

6.2.3.4 Temperature Sensor Bias Network. The thermistor temperature sensor is 

located on the base of the dual detector and signal processing module (see 

Figure 3.6-1). The bias network, shown in Figure 3.6-19, is located in the 

instrumentation and control module. The network is designed such that a 2.5-volt I 

output is obtained at 70F. 

Thermistor 

Dual Detector 

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Module Instrumentation and 

Controle Module 

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Figure 3.6-19. Temperature Sensor Bias Network 

6.2.3.5 Power Decoupling. The small signal level requirements for the dual 

channel amplifiers result in a need to decouple the ±15-volt power from the power 

monitor and control unit power supply. 

This decoupling is accomplished by a series inductor and by shunting any ac present 

on the + or -15-volt power lines to ground (power return) through capacitors, as 

illustrated in Figure 3.6-20. 

~ 

3.6-29 

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+15v 

-15v 

(Electrolytic) (Ceramic) 

(Decoupled) 

Figure 3.6-20. Power Decoupling Circuit 

6.3 Focus Detection Subsystem Commanding 

The focus detection subsystem is commanded explicitly by the focus electronics 

ON/OFF commands available through the extended command system. Additionally, 

the 9 OFF, 5 OFF and 9/5 OFF commands through the minimal command system will 

turn the focus detection subsystem off. The focus sensor operates in either 

the HI or LO mode. Switching is implicit with the HI/LO altitude mode selection command. 

6.3.l Focus Electronics Power 

Bits 35, 37 and 38 of these 4V command words control the focus detection subsystem. (Bit 36 controls the viewport door.) 

Table 3.6-1 summarizes the function of the appropriate bits with respect to 

the focus detection subsystem. (Other subsystems may be controlled in parallel 

by these bits.) 

6.4 Instrumentation 

There are seven instrumentation points associated with the focus detection subsystem. Table 3.6.2 summarizes the pertinent information for these seven points. 

"'WARNING-THIS DOCUMENT SHALL NOT BE USED ASA SOURCE FOR DERIVATIVE CLASSIFICATION"" 

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TABLE 3.6-1 

FOCUS DETECTION SUBSYSTEM 4V WORD COMMAND 

FOCUS Command 

(4V0252bZ, 4V0152bZ, 4V0352bZ, Bits 35, 37, 38) 

Bit 

35-1 

35-0 

36-1 

36-0 

37-1} 37-0 

38-1 

38-0 

Bit 

37--0 - 38-0 

37-1 38-0 

37-1 38-1 

37-0 38-1 

Function 

- -

*FEP ON, Sl - PRG ENABLE, Sl - PRG Powe~ ON 

FEP OFF , Sl - PRG Power OFF 

DOOR OPEN 

DOOR CLOSE 

Focus Calibrate Modes 

(See Below) 

Focus 

**Focus 

**Focus 

**Focus 

Calibrate 

Calibrate 

Calibrate 

Calibrate 

OFF, Sl-PRG Calibrate OFF 

ON, High Frequency, Low Amplitude 

ON, High Frequency, High Amplitude 

ON, Low Frequency, High Amplitude 

*Telemetry power must be_ ON to provide FEP (focus electronics power). 

**See Section 6.2.3.2. The Focus Cal Modes are modified by the Altitude Select 

commands. 

TO:·~~~ ~"'-·-

Approved for Release: 2017 /02/14 C05097222 

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TABLE 3.6-2 

FOCUS DETECTION SUBSYSTEM INSTRUMENTATION 

Title 

Temperature, Focus Sensor Head 

Focus Signal Strength (A+B) 

Focus Correction Signal, Fine 

Description Power 

A thermistor, located in the dual detector and ±15vdc 

signal processing module, monitors the focussensor head temperature, producing a linear 

output from 60F (4.8v) to 75F (2.0v). The 

processing electronics are located in the ininstrumentation and control module. 

The output is related to the sum of the Channel ±15 vdc 

A and Channel B RMS signal levels. The instrumentation signal is piecewise linear in segments 

from 0 volt signal strength (O.Ov output) to 1.5 

volts signal strength (3.75v output), and from 

1.5 volts signal strength (3.75v output) to 10 

volts signal strength (4.75v output). 

The correction signal is derived from the dif- ±15 vdc 

ference in RMS signal levels between Channels A 

and B, normalized by the sum of the RMS levels. 

A=B (zero defocus) is set at 2. 5 vol ts and the 

slope is - 1.0 volts/0.001 inch defocus, where 

defocus indicates the position of the reticle 

midplane relative to the point of best focus. 

Defocus at the 9 platen (X ) is related to 

p 

defocus at the focus detector (XR) by the 

following equation: 

x X = R 

p 0.8524 

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5105 

5107 

5108 

5231 

5002 

Title 

Average Irradiation Level 

Focus Correction 

Coarse 

Average 

(Channel 

Cal On/Off, PEP 

Cal 

Level 

*Least Significant Bit 

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TABLE 3.6-2 

diodes, 

to 

Similar 

0.5 

Bit 1 

BIF-008- W-C-019841-RI-80 

Description Power 

average de signal level ±15 vdc 

detectors. Calienergy incident on the photois linear from 0 foot-candles 

.Ov). 

5067. but a sensitivity of ±15 vdc 

to IMP 

dif- ±15 vdc 

Channel A 

iz module. 

1 from -187.5mv 

B. 

command input remoni tor the resatellite control 

or 5.0v to an inconverter. Four relays 

converter form the IMP. Outdiscrete steps ranging 

0.3v-increments: 

±15 vdc 

+5/±15 vdc 

* = Cal On/Off 

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Focus Power Monitor, 

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Focus Calibration Monitor, 

+15 vdc 

Focus Calibration Monitor, 

-15 vdc 

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Bl F-008- W-C-019841-RI-80 

TABLE 3.6-2 (CONT'D) 

Description Power 

Bit 2 = FEP On/Off 

Bit 3 = Cal Bit A/A (command Bit 38; 

Bit 1 in the focus electronics) 

Bit 4 (MSB)** = Cal Bit B/B (command Bit 37; 

Bit 2 in the focus electronics) 

A voltage divider circuit connected across the +15 vdc 

focus power +15v feed in the PM and C monitors 

the voltage level, Output is digitized in the 

DTU to yield a binary signal (On/Off), 

11 011 = Off 

"1" = On 

circuit (LED photo- -1 vdc 

LED powered by the -15v 

in the PM and C monitors the 

level. The instrumentation 

is zed in the DTU to yield a binary 

(On/Off). 

11 011 = Off 

"1" = On 

Similar to IMP 5594, monitors the +15v focus +15 vdc 

calihration power. 

Similar to IMP 5595, monitors the -15v focus 

calibration power. 

-15/+5 vdc 

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BIF-008-W-C-019841-RI-80 

7.0 POWER DISTRIBUTION SUBSYSTEM 

The power required by the Photographic Payload Section/Dual Platen Extended 

Altitude Capability (PPS/DP EAC) for orbital operation is supplied by a single 

power bus located in the satellite control section (SCS). The bus, which 

operates from a parallel combination of batteries and solar panels, delivers 

direct current in the range of 22.0 to 29.7 volts (24.5 volts nominal). 

Power is received in the PPS/DP EAC by the power monitor and control unit 

(PM and C) and the initiator electronics unit (IEU). These two provide a 

controlled interface between the PPS/DP EAC and SCS portions of the vehicle and 

act as power distribution centers within the PPS/DP EAC, the IEU for pyrotechnic 

power and the PM and C for all other power. To conserve battery energy during 

the pad cycle, the ground heater subsystem is powered directly through a vehicle 

umbilical line. After launch, the ground heaters are totally inoperative. 

Figure 3.7-1 presents a block diagram of the power distribution subsystem. 

Although the SCS power source is a unibus system, the PPS/DP EAC uses multibus 

nomenclature that is a carry-over from an earlier power supply system. 

7.1 Power Source 

The power source is the responsibility of Lockheed Missiles and Space Company 

(LMSC). The information in this section was provided to BIF-008 by LMSC as 

representative data for Vehicle 48. The data is not guaranteed to be the most 

recent figures and should be used for general information only. 

Approved for Release: 2017 /02/14 C05097222 

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Flight 

Environmental 

Subsystem 

PPS/DP EAC 

Operational 

Subsystems 

Pyrotechnic 

Device 

Take-up 

Power 

Viewport Door 

Motor Switchover 

Signal 

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Figure 3.7-1. PPS/DP EAC Power Distribution Subsystem 

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BIF-008- W-C-019841-RI-80 

7 .1.1 Power Distribution 

Figure 3.7-2 illustrates the SCS power distribution system. All PPS/DP EAC 

flight power is received from the main and pyro busses which are in turn connected to the battery bus. The connecting switches (Sl and S2 on Figure 3. 

7-2) are operable only on the ground and thus the system acts as a single 

bus and is treated as such. The battery bus is fed by a parallel combination 

of batteries and the solar panel arrays. Normally 4 to 5 batteries are provided, however, the system can carry up to 8 batteries if necessary. The 

voltage level at the PPS/DP EAC interface exhibits maximum transients of ±3 

volts within the lower and upper limits of 22.0 to 29.7 volts. 

7 .1. 2 Solar Array 

The solar array consists of 4 panels, two on each side of the SCS, with the 

inboard panels able to be disconnected from the battery bus upon command. 

The panels are approximately ten square feet each, and together are expected 

to supply 6 to 7 amp-hours/rev on a sun-synchronous orbit, with a peak current 

of 16 amperes. As shown in Figure 3.7-2, each panel consists of four separate sections. The four inboard sections on each side can be switched together by command as follows: 

(1) Disconnect/connect sections 1 and 2 

(2) Disconnect/connect section 3 

(3) Disconnect/connect section 4 

The result is that sections 5 through 8 on both sides are always connected. 

Sections 1 through 4 can be totally disconnected, or sections 1 and 2 can be 

Approved for Release: 2017 /02/14 C05097222 

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(A) HIGH RANGE 

(A) LOW RANGE 

VEHICLE RETURN BUS 

AGE POWER 

VEHICLE POWER TO AGE l l 

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MAIN BUS 

TlM VOLTMETER 

CURRENT 

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Figure 3.7-2. SCS Power 

BIF-008- W-C-019841-RI-80 

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connected to give half output from each inboard panel and then build up to 

full power from the inboard panels in steps of one-quarter. The panels are 

attached to the vehicle near the aft end of the SCS as shown in Figure 3.7-3. 

Hinges at the SCS, and between panels, allow them to be folded against the 

SCS for launch. Once on-orbit, they are deployed upon command. 

7 .1. 3 Batteries 

The batteries are silver zinc type, each weighing approximately 170 pounds. 

Each battery is able to deliver 750 amp-hours of energy (nominal). The 

number of batteries needed is mainly a function of flight duration, and will 

be determined by LMSC. After initial charge, the batteries begin operation 

in the "peroxide region" which is characterized by large voltage transients 

from the no-load to loaded state (i.e., supplying power). This behavior disappears after a small portion of the battery energy has been used. Therefore, 

the batteries are normally pre-conditioned (depleted slightly) before launch 

to ensure any voltage variations remain within specified limits. 

The batteries will exhibit a second source of voltage variation (other than 

normal loading) which is caused by the solar panels. The panels are connected 

to the battery bus for the flight duration. Any time the bus electrical load 

is less than the current supplied by the solar panels, the excess current will 

be charging the batteries. When the bus load exceeds the solar panel current, 

the batteries will supply the additional energy. Due to the chemistry of the 

batteries, the terminal voltage will be higher in the charging state than in 

the discharging state, and a terminal voltage step will occur as the battery 

alternates between charging and discharging conditions. The time constant 

of this change is approximately 1 millisecond at the SCS unibus. 

For example: Assume the solar panels are supplying 10 amperes. As long as 

the current drain on the power supply is less than 10 amperes, 

the batteries will be charging, and the bus voltage will be stable. 

Approved for Release: 2017 /02/14 C05097222 

Hand! e v1 a BY EM AN 

Control System Only 
Approved for Release: 2017 /02/14 C05097222 

BI F-008- W-C-019841-RI-80 

+Z 

i 

i 

-Z 

BIF-008 Vehicle 

Coordinates 

NOTE: The drawing is based on the 

LMSC System Concept Design Review 

for Vehicle 48 (January, 1974). 

Reference LMSC publications for 

accurate design data. 

Figure 3.7-3. SCS Solar Array 

3.7-6 

Approved for Release: 2017 /02/14 C05097222 

+Y Outboard 

Panel 

+Y Inboard 

Panel 

-Y Inboard Panel 

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Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

As soon as the load exceeds 10 amperes, the batteries 

will be discharging, supplying the additional current, 

and the supply voltage will drop. Figure 3.7-4 illustrates this condition. A result of this phenomenom is 

a periodic voltage variation (period approximately 1/3 

second) when the roll joint is operated due to the pulse 

train characteristics of the current load for the roll 

joint drive. 

-Time __ ____..,.. 

Time 

Figure 3.7-4. Voltage/Load Relationship Due 

to Solar Panel Effect 

~ 

3.7-7 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYEMAN 

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Approved for Release: 2017 /02/14 C05097222 

Bl F-008-_W-C-019841-RI-80 

7.2 Power Monitor and Control Unit 

The PM and C serves as the main power distribution and measurement center for 

the PPS/DP EAC and as a controlled interface with the SCS. Input power 

comes from the SCS bus on 11 feedlines (with 10 power returns) that are 

labelled in three groups; primary power (2 lines), emergency (BUSS) power 

(5 lines) and heater power (4 lines). The PM and C distributes this power to 

units within the PPS/DP EAC, either through commandable switch circuits, or 

directly to the using units. For certain functions, the PM and C switching 

provides logic control in conjunction with the command logic in the command 

processor. The PM and C also converts and regulates the BUSS power line 

voltage for use by the PPS/DP EAC instrumentation and focus detection subsystems, 

and provides current information and total ampere-hour consumption through 

internal instrumentation. In addition, the PPS/DP EAC unipoint ground is 

established within the PM and C. All load current, except pyrotechnic current is returned to this point. 

A power consumption estimate for the PPS/DP EAC is presented in Table 3. 7-1. 

Figures used to derive this table are based on computerized mission simulations 

and engineering estimates. This table is included only as a general guideline. Exact correlation between it and actual results cannot be expected, 

as power consumption can vary widely from mission-to-mission due to differing 

orbital parameters and operational procedures. 

7.2.1 PM and C Assembly 

The PM and C is located on the +Y side of the film supply enclosure (reference 

Part 3, Section 1). The unit is approximately 14" x 12" x 9" and weighs about 

20 pounds. It consists of a stack of 4 metal boards and the top and bottom 

covers (see Figure 3.7-5). Boards A3, A4, and AS are shaped like open-top boxes 

in which components mount, and are stacked, and bolted together. This stack is 

secured to the A2 board which is a flat metal plate containing the major power 

dissipating components and forming the mounting feet of the unit. The top and bottom covers bolt to the entire stack. The top cover supports the electrical inter3.7-8 

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9 OP ON 

5 OP ON 

9 & 5 OP ON 

Pyro Idle Load 

Telemetry Loads 

DTU 1 or 2 

(.N ±lSv Regulator . +Sv Regulator '-.] 

I Pressure Transducer ID 

Event Loads 

9 F ilrn Drive 

5 Film Drive 

9 SRC 

5 SRC 

9 NPA 

Primary 

B/U 

5 NPA 

Primary 

B/U 

9 VEM (A & B Avg) 

5 VEM (A & B Avg) 

Handle via BYEMAN 

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Typical 1 Current (ma) 

54 

237 

246 

411 

0 .1 

495 

Note 3 

Note 3 

Note 3 

570 

450 

1080 

1130 

540 

530 

560 

540 

1120 

1000 

BIF-008- W-C-019841-RI-80 

TABLE 3.7-1 

EAC POWER CONSUMPTION 

Voltage Power 60-Day 2 Total 

(volts) (watts) Operating Time (hrs) (watt-hrs) 

24.5 1.32 1292 1709 

24.5 5.8 106 614.8 

24.5 6.0 42 252 

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24.5 13. 72 0.14 1.92 

24.5 13.23 

24.5 27.44 1.4 38.4 

24.5 24.5 0.6 14.7 

~T G 
~T_.cL BIF-008-W-C-019841-RI-80 

TABLE 3.7-1 (CONT'D) 

Typical 1 Voltage Power 60-Day Total 

Load Current (ma) (vol ts) (watts) QE.erating Time (hrsf (watt-hrs) --

Event Loads 

9 Take-up Cycle* 

Supply Full; Take-up 1 Empty } 3370 (avg) 24.5 82.6 1.3 (note 4) 107 .4 Supply ~ Full; Take-up 1 Full 

Supply~ Full; Take-up 2 Empty} 2250 (av ) 

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Viewport Doors Open 220 24.5 5.39 2.7 14.55 

Viewport Doors Close 450 24.5 11.02 3.1 34.16 

Viewport Doors Open (B/U) 500 24.5 12.25 

Viewport Doors Close (B/U) 600 24.5 14.70 

5 Parking Brake 1500 24.5 36.75 2.8 102.9 

*Assumes Film Drive OFF; 5 T/U in primary mode. 

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Branch 1 

Branch 2 

Branch 4 

Branch 5 

Branch 6 

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EPSM 2 

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Typical 1 Current 

1050 

1520 

3270 

2570 

1050 

1250 

1250 

TABLE 3.7-1 (CONT'D) 

Voltage Power 

(vol ts) 

24.5 25.7 

24.5 37.2 

24.5 80.1 

24.5 63.0 

24.5 25.7 

24.5 30.6 

24.5 30.6 

BIF-008- W-C-019841-RI-80 

60-Day 

- l 

-

-

-

-

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(hrs) 2 Total 

(watt-hrs) 

7,350 (Note 6) 

Total watt-hours 14,679.76 

Total = 599.2 

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TABLE 3.7-1 NOTES 

(1) Currents from des estimates or tests. 

VI 

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(3) 

(4) 

estimates, or extrapolated 

Included in DTU power 

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5-

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an 

1, and 

(5) The focus subsystem operates 

load indicated represents 

(6) Heater power 

thermal finish, and operating 

with a sun-synchronous 

light side (CDOL) and door 

7,350 watt-hours are 

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Figure 3 .7-5. PM and C Assembly 

3.7-13 

Approved for~G e ease: 2017 /02/14 C05097222 

Handle via BYEMAN 

Cont ro I S ys t em Only 
Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

face connectors and input filter capacitors between feed and return on the 

emergency and primary power lines (see Figure 3.7-6). Components on the 

various boards are soldered to terminals, and point-to-point wiring is 

used for interconnection. A harness assembly connects the boards to each 

other and to the interface connectors. 

The A4 and AS boards are devoted to power controller circuits. The A3 

board contains the current flow instrumentation circuitry, and the A2 board 

contains the ±15-volt instrumentation regulator, the +S-volt instrumentation 

regulator, the ampere-hour meter, and the unipoint power return. 

7.2.2 PM and C Logic 

Power is distributed and controlled by the PM and C in accordance with Table 

3.7-2, using the applicable logic shown in Figures 3.7-7 through 3.7-13. Unswitched signifies direct connection of the power to the output function. In 

general, overload protection is provided only for those functions not essential to recovery and/or accomplishment of the primary mission objectives. 

The four-digit codes listed on the logic diagrams are assigned by BIF-008, 

and are used in the 9 x 5 Interconnection Diagram to allow tracing of signals 

and power through the PPS/DP EAC cabling. The codes in parenthesis following many function titles are command word codes. For an explanation of the 

command code format, and also of the logic symbols used, refer to Part 3, 

Section 9. 

7.2.2.1 PM and C Switching Circuits. The switch control commands are pulses 

received from the command processor which activate soft switching circuits 

within the PM and C. These circuits consist of a latching relay paralleled 

by a hybrid circuit rise- and fall-time control device (Figure 3.7-14). Upon 

3.7-14 

Approved for Release: 2017 /02/14 C05097222 

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TABLE 3. 7-2 

PM AND C POWER 

- _..,. _____ .,... . .,, ... 

9 CEA Power 

5 CEA Power 

Door 

Door 

Door 

Crab Servo Power 

Stereo Servo Power 

Sl-PRG 

BIF-008- W-C-019841-RI-Brr 

Logic Overload 

p· re Protection 

Unswitched none 

I Unswi tched none 

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Power* 6A 

Power* O.SA 

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TABLE 3.7-2 (CONT'D) 

Function 

CP Power 

IEU Power 

DTU 1 Power 

DTU 2 Power 

Pressure Transducer Power (IMP 5019) 

+5 vdc Regulator** 

+15 vdc Regulator** 

-15 vdc Regulator** 

9 FPLLE Power 

FCE Power 

5 FPLLE Power 

FHE Power 

EPSM 1 Heater Power 

EPSM 2 Heater Power 

Bl F-008- W-C-019841-RI-80 

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Unswitched none 

Unswitched none 

2 parallel lA fuses 

2 parallel lA fuses 

3.7-10 2 parallel 0.2A fuses 

2 parallel 0.5A fuses 

} 2 parallel 4A fuses 

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none 

3.7-7 none 

none 

3.7-13 none 

3.7-13 none 

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TABLE 3. 7-2 

Branch 1 Power 

2 Power 

5 Brake Power 

Branch 4 Power 

Branch 5 Power 

6 

+15 vdc Out to Misc 

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Focus E 

Focus 

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5 vdc 

Bl F-008- W-C-019841-RI-80• 

Figure 

3.7-12 

3.7-12 

3.7-11 

3.7-12 

3.7-12 

3.7-12 

3.7-8 

3.7-9 

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3.7-8 

3.7-9 

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11 

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2 parallel 3A fuses 

2 parallel I.SA fuses 

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Electronic Overlaod 

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Approved for Release: 2017 /02/14 C05097222 

PRIMARY 

POWER 

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Figure 3.7-7. 9 and 5 Operational Power and Servo Power 

3.7-19 

Approved for Release: 2017 /02/14 C05097222 

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s 1 

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Figure 3.7-10. 

BIF-008- W-C-019841-RI-801 

EMERGENCY POWER 

* DTU 1 ANO 2 VOLTAGE MONITORS ARE LOCATED IN 

THE INSTRUMENTATION PROCESSOR 

** !MP 5019 

(IN SEM) 

DTU I and 2 Power; Instrumentation Supply 

and Pressure Transducer Power 

1A 

~ DTU 1 POllER* 

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5 SUPPLY 

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Approved for Release: 2017 /02/14 C05097222 

,-- 4500 ENVIRONMENTAL POWER ----+-~ 

BRANCH l ON 

4501 ENVIRONMENTAL POWER ----~ 

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BRANCH 1 

BIF-008- W-C-019841-RI-80 

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1-------1 4502 ENVIRONMENTAL POWER -----!-----! BRANCH 2 ON 1----------ENVIRONMENTAL 

BRANCH 2 POWER 

BRANCH 2"' 4503 ENVIRONMENTAL POWER -----+------! BRANCH 2 Off 1----------JMP 5578 

450B 

4509 

4510 

4511 

ENVIRONMENTAL POWER BRANCH 5 ON 

ENVIRON MENTAL POwER BRANCH 5 Off 

ENV JRONMENTAL POWER BRANCH 6 ON 

ENVIRONMENTAL POWER BRANCH 6 OFF 

*CIRCUIT IDENTICAL TO BRANCH 1 

Figure 3.7-12. 

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BRANCH 4* 

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BRANCH 5 POWER 

BRANCH 5'* 

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BRANCH 6 POWER 

SRA.NCH 6 '* 

IMP 5582 

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~ 

3.7-24 

Handle via BYEtvlAN 

Cont ro 1 Sys tern On 1 y 

Approved for Release: 2017 /02/14 C05097222 
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~TG 
Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

receipt of the leading edge of a command pulse, the controller (soft switch) 

ramps the line voltage smoothly to the load in approximately 250 μsec. The 

relay receives the command pulse simultaneously and transfers in about 5 msec. 

At the end of the controller time-out period (approximately 50 msec), the 

soft switch turns off, leaving the relay contacts to carry the load. An OFF 

command works in a similar fashion. The command pulse activates the controller which turns on in parallel with the closed relay contact. The relay 

contacts open in about 5 msec. The controller is now carrying the load. 

After the time-out period (50 msec), the controller ramps the voltage off. 

Since the controller does not distinguish between commands, redundant OFF 

commands will cause the controller to provide power to the output line for 

the 50 msec time-out period. 

7.2.2.2 9 and 5 Operational Power and Servo Power Switching. The PM and C 

incorporates redundant soft switches for the control of 9 operational power 

and for the control of 5 operational power to preserve the redundancy provided by logic channels A and Bin the command processor (see Figure 3.7-7). 

Each pair of switches is interconnected such that power cannot be provided 

simultaneously through both. In the event that one switch fails in the ON 

position, this interconnection gives a means to turn power OFF by commanding 

OP ON in the opposite channel. Normal use will not turn both switches on 

at once, since it results in t>oirning power OFF. (As an operational constraint, 

CP logic channels are not to be switched while operational power is ON) . If 

this does occur, power will be then supplied through one channel whenever the 

opposite channel is turned OFF. 

As shown in the logic diagram, the operational power commands also control the 

servo power switches. The outputs are connected such that servo power is on 

whenever either 9 OP or 5 OP is on. 

3.7-27 

G 

Approved for Release: 2017 /02/14 C05097222 

Handle vi a BY EM AN 

Control Sys tern On l y 
Approved for Release: 2017 /02/14 C05097222 

Bl F-008- W-C-019841-RI-80 

7.2.2.3 Focus Electronics Operating and Calibration Power and Sl-PRG Power. 

The focus electronics power ON/OFF and focus calibrate power ON/OFF command 

pulses from the CP control separate soft switches for the +15-and -15-volt 

focus operating power and for the +15-and -15-volt focus calibration power* 

(see Figures 3.7-8 and 3.7-9 respectively). To prevent the application of 

only +15-or -15-volt power, each set of switches is interconnected such that 

both must operate for power to be supplied. The ±15-volt power is derived 

from the instrumentation power regulator. Therefore, either DTU 1 or DTU 2 

must be on to provide power to the regulator circuit. 

The focus electronics power ON/OFF pulses from the CP control a third relay 

which switches 24.5-volt power to the Sl-PRG electronics. The switch is 

turned on by the focus operating power ON signal and is turned off by either 

the focus operating power OFF signal or the Sl-PRG DISABLE command. 

7.2.2.4 DTU 1 and DTU 2 Power. The DTU 1 and DTU 2 soft switches are interconnected to prevent the application of power to DTU 1 and 2 simultaneously 

(Figure 3.7-10). A command that attempts to turn both on results in power 

being removed from both. A situation is then created in which DTU 2 will 

receive power when DTU 1 is turned off, and DTU 1 will receive power when 

DTU 2 is turned off. The logic will be restored to normal operation by turning both switches off. 

The DTU switches also control power to the instrumentation voltage regulators 

and to the pressure transducer (IMP 5019) in the supply electronics module. 

Power is supplied when either DTU 1 or DTU 2 is ON. 

*Focus calibration power is turned on when either calibration bit is in the 

logic 1 state (see the CP logic diagram in Part 3, Section 9). 

3.7-28 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYEMAN 

Control Sys tern On 1 y 
Approved for Release: 2017 /02/14 C05097222 

BIF-008-W-C-019841-RI-80 

7.2.2.5 5 Parking Brake Power. Power for the 5 parking brake is supplied 

through a simple soft switch circuit in the PM and C (Figure 3.7-11) using 

the same logic as environmental branch power switches. The circuitry which 

is used to inhibit the parking brake when 5 operational power is ON is located in the 5 supply assembly. The power is interrupted whenever 5 OP is ON, 

and the circuitry is not enabled again until both 5 OP and 5 parking brake 

power are OFF (reference the 5 Film Handling Subsystem logic diagram in 

Part 3, Section 2). 

7.2.3 PM and C Unipoint Power Return 

The power returns from all PPS/DP EAC loads, except pyrotechnic loads, are connected within the PM and C to form a single power return point such that the 

potential between each return and all others approaches zero. This unipoint 

power ground is located on the A2 board and consists of a number of terminals 

connected in daisy-chain fashion. Since very small voltage differences are 

generated along the chain with return current flow, and since current surges 

cause corresponding voltage variations, the unipoint is structured very carefully to minimize these effects. Figure 3.7-15 shows the return path from a 

current flow viewpoint. As a general guideline, conductors that provide the 

reference point for the instrumentation processor unipoint instrumentation 

return are at the lowest potential; redundant returns for the same function 

are kept on the same or adjacent terminals of the daisy-chain; and loads with 

similar characteristics (heavy current users, operating system loads, and loads 

with EMI filters) are kept together to form the three branches of the chain. 

The resistors shown provide the sense voltage for the total current sensor. 

The previously mentioned instrumentation system unipoint return, which provides 

a reference for all instrumentation in the PPS/DP EAC is located in the 

instrumentation processor and is connected to the PM and C unipoint power 

return according to Figure 3.7-16. 

3.7-29 

Approved for Release: 2017 /02/14 C05097222 

Handle vi a BY EM AN 

Control System Only 
CURRENT 

SENSE 

RESISTORS 

NOTE: CODE NUMBERS REFER 

TO PMAC CIRCUIT 

BOARD CONNECTIONS 

*FROM INSTRUMENTATION CURRENT 

SENSING RESISTOR IN PM&C 

Approved for Release: 2017 /02/14 C05097222 

219 *CRAB, STEREO 

VIEWPORT DOOR 

228 FHE 

235 FHE 

209 5 CEA 

210 9 CEA 

218 5 FPLLE 

217 5 FPLLE 

234 9 FPLLE 

241 9 FPLLE 

207 

208 

217 

216 

225 

226 

233 

232 

BIF-OOS- W-C-019841-RI-80 

PM&C (A2 BOARD) 

SPARE 

TO JUNCHON BOX: J217, PINE (SPARE) 

Sl-PRG 

PM&C (AS BOARD) 

PM&C ( A4 BOARD) 215 CP 

*ENV BRANCH 4 

*ENV BRANCH 5 

224 !EU 

223 PRESSURE TRANSDUCER 

230 AHM; TEST CONNECTOR 

PR!, EMR, AND HTR POWER 

238 •rnv BRANCHES 1 AND 6; EPSM 1 ANO 2 

239 *ENV BRANCH 2; 5 PARKING BRAKE 

240 PM&C (Al BOARD: F!LTER 

CAPAC !TORS) 

!MP 5091 >----MAIN POWER 

AMPERE-HOUR 

METER PICKUP 

TO SCS BUS RETURN 

CURRENT 

Figure 3.7-15. PM and C Unipoint Ground 

3.7-30 

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Figure 3.7-16. 

OTHER PPS/OP EAC 

INSTRUMENTATION 

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BIF-008- W-C-019841-RI-80 

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7.2.4 Power Conversion (+5/±15 Volts) 

Within the PM and C, power to the +5-and ±15-volt regulated supplies is 

provided from the emergency feed through the DTU power switches (see Figure 

3.7-10). The +5-volt supply consists of a series-pass, integrated circuit 

regulator with power boost transistors, and is regulated to ±0.025 volt with 

an allowable load current up to 175 ma. The regulator incorporates electronic current limiting which reduces the output voltage to zero as the load 

approaches a short circuit. 

A saturable transformer switching inverter circuit provides the ±15-volt 

regulated power. The transformer secondary is center tapped, with the voltage 

from each end to center exceeding 15-volts. The inverter is preceded by a 

series-pass pre-regulator, and followed by two integrated circuit, seriespass post-regulators, one each for +15 volts and -15 volts. Both outputs 

are regulated to ±0.075 volt and each can supply up to 400 ma. Electronic 

current limiting is used in the circuit which reduces both the +15-and 

-15-volt output voltages to zero as the +15-volt load approaches a short 

circuit, but reduces only the -15-volt supply in the event of an overload on 

its output. The zero potential reference and power return point for the 

supplies is at the instrumentation subsystem unipoint ground, which is in 

the instrumentation processor (reference Figure 3.7-16). 

7.2.5 Ampere-Hour Meter 

The ampere-hour meter (AHM) is a separate box approximately 611 x 3" x 2" and 

weighing about 2.5 pounds which is bolted to the A2 board in the PM and C. 

Power is provided from the primary bus using two external 0.5-ampere fuses 

in parallel for overload protection. The meter monitors and integrates total 

PPS/DP EAC operating current (except pyro current) through a current-sense 

coil around the 10 return conductors from the unipoint ground to the SCS bus 

(see Figure 3.7-15). 

3.7-32 

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Three instrumentation outputs (coarse, medium, and fine) are produced, the 

sum of which corresponds to total main power consumption. Each is an 8-

level counter that runs from 0.0 to 4.9 volts and resets. The fine sensor 

increments once for each 2 ampere-hours, the medium once for each 16 amperehours, and the coarse once for each 128 ampere-hours. If power is removed, 

the meter resets to zero. 

7.2.6 PM and C Instrumentation 

In addition to the ampere-hour meter instrumentation, there are three other 

groups of monitors in the PM and C; input power voltage monitors, switched 

power voltage monitors, and instantaneous current monitors. Each switch 

monitor provides a parallel output to a test connector on the PM and C 

through an isolation resistor as well as an instrumentation output for telemetry. 

7.2.6.1 Main Power Voltage monitors. There are three monitors in this group; 

one each for the primary, emergency (BUSS), and heater power buses in the 

PM and C. The same basic circuit is employed for all three, and consists 

of a simple voltage divider with the +5-volt instrumentation power used to 

provide a bias level. 

The output connects to the digital telemetry unit (DTU) by way of the instrumentation processor. 

7.2.6.2 Switched Power Voltage Monitors. All switched power outputs (excluding DTU 1 and DTU 2 power) are monitored by voltage divider instrumentation circuits as illustrated in Figure 3.7-14. The signals are sent to the 

DTU where they are digitized to yield a binary level (on/off) output. The 

voltage monitors for DTU 1 and DTU 2 are located in the instrumentation processor, and are also digitized in the DTU. The-+5-and ±15-volt regulators, 

which are powered through the DTU switches, are monitored by voltage divider 

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circuits in the instrumentation processor, and the outputs are maintained as 

analog signals by the DTU. 

7.2.6.3 Instantaneous Current Monitors. Located on the PM and C A3 board, 

the various current monitors measure real-time current flow. Some monitor 

the power of only one function, others monitor the combined current flow of 

multiple functions as listed: 

(1) IMP 5090 Crab, stereo, and door current 

(2) IMP 5091 Main power current 

(excluding pyro power) 

(3) IMP 5133 Env. current branch 1, branch 6, 

EPSM 1, and EPSM 2 

(4) IMP 5134 Env. current branch 2, and 

5 parking brake current 

(5) IMP 5135 Env. current branch 4 

(6) IMP 5136 Env. current branch 5 

The monitors consist of sense resistors in the power return line(s) which 

provide a voltage proportional to return line current to an operational 

amplifier. The amplifier scales the output to levels compatible with DTU 

input requirements and, in some cases, also provides a fixed voltage offset 

to the signal level. 

7.3 Initiator Electronics Unit 

The IEU is a separate subsystem within the PPS/DP EAC which controls all pyrotechnic functions, and termination-related events. It provides a controlled 

interface for its associated commands between the PPS/DP EAC and SCS, and 

contains enabling logic to prevent execution of potentially catastrophic command 

sequences. Provision is also made to accommodate the end-to-end electronics 

pyrotechnic testing (reference Part 4, Section 4). Following testing the 

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LAUNCH PRESET signal resets the box to the no-event occurred state. At 

the launch pad, this signal is supplied through a vehicle umbilical line. 

Each pyrotechnic function within the PPS/DP EAC is controlled by two independent 

pyrotechnic devices which provide redundant actuation of the mechanism, and 

each pyrotechnic device is powered from a separate line and relay within 

the IEU. There are only two non pyrotechnic functions controlled by the 

IEU. The first involves the switchover of take-up motor control signals 

from SRV 1 to SRV 2. The second is an output to the viewport door electronics 

which transfers drive control from the primary to the backup motor (reference Part 3, Section 5). 

7.3.1 IEU Assembly 

The IEU is physically located on the +Y side of the film supply enclosure 

wall (reference Part 3, Section 1). The unit measures 8.2" x 7.7" x 18" 

excluding mounting feet, and weighs slightly under 34 pounds. Internally, 

the IEU is composed of a stack of 21 printed wiring boards which interface with 

the PPS/DP EAC through 11 electrical connectors mounted on the housing. 

Electrical components are planar mounted to the boards, with larger, discrete 

components bonded to the boards. Point-to-point wiring through plated holes 

at one edge of each board connects the boards to the assembly harness. 

The board stack is compression packaged with foam-filled panels at each 

end of the stack acting as compression plates. Foam shims between the 

boards serve to separate them and carry the compressive loads, and also act 

to dampen high frequency vibrations of the boards. 

7.3.2 IEU Operation 

The IEU pyrotechnic firing circuitry consists of normally open power switches. On 

receipt of a command pulse, each switch closes in response to and for the 

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duration of its controlling command pulse, and passes current to the load. 

Additional circuitry directs the 9 and 5 take-up motor power, and performs the minimal ARM command enabling functions (SWRTC 1 and SWRTC 2)*. 

There are 19 command inputs (not counting multiple commands which perform 

the same task) accepted by the IEU. All but four of the 19 command inputs 

actuate pyrotechnic devices as part of their function. In normal operation, 

redundant commands are given for each of these functions, from separate ECS** 

decoders. In the event of an ECS failure, the MCS** can be used as a backup 

for mission termination event commands. There are no commands in the MCS for 

the SPLICE/CUT or ROLL-IN TERMINATE events. 

Commands are received on individual lines in the form of controlled pulses 

from the ECS/MCS command decoders, and are coupled through relays in the 

IEU to provide the required interface isolation. Decoupling diodes on the 

input lines act as logical "OR" gates to connect redundant commands and 

prevent feedback into the SCS. The VIEWPORT DOOR BACKUP command is the one 

exception to the rule in that it operates relays not only in the IEU, but 

also in the viewport door electronics unit. 

Each ECS and MCS protected command has a switched return line associated with 

that particular command. ECS and MCS normal commands have common return wires. 

The SWRTC 1 and SWRTC 2 MCS commands have return lines which are common to 

the normal returns. For more detail on operation of the command subsystem, 

refer to Part 3, Section 9. 

IEU power is received from both the PM and C and the SCS power bus. Power inputs referred to as unregulated power A and unregulated power B are separate 

* Secure Word Real Time Commands. Reference Part 3, Section 9. 

**Extended Command Subsystem/Minimal Command Subsystem. 

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unswitched inputs from the PM and C providing 24.S volts nominal (22.0 to 

29.7 volts maximum) for relay operation. Instrumentation power (+Sand 

±15 vdc) is supplied by the instrumentation voltage regulators which are 

also in the PM and C and is filtered in the IEU at the input. Pyro firing 

power is derived from the SCS bus on nine input and nine return lines in twisted, 

shielded pairs. The minimum current to be supplied for each pyrotechnic 

event is controlled by interface agreement with LMSC, and is generally set 

at or near the "twice all-fire"* level based on maximum load resistance. 

Table 3.7-3 lists all PPS/DP EAC pyrotechnic events and the minimum currents 

required. 

7.3.2.1 Cross-strap and Enabling Circuitry. Two redundant, cross-strapped 

command processing blocks referred to as command sections A and B comprise 

the IEU logic circuits. Redundant commands from ECS decoders A and B and the 

MCS decoder (as available) are logically connected such that any one 

command is able to operate both IEU circuits (see Figure 3.7-17). The two 

sides are powered separately by the A and B unregulated power inputs, which 

enables the cross-strap circuitry to be checked by providing power to only 

one side during testing. 

The enabling circuit is used for operations where it is necessary to prevent 

execution of improper command sequences, and is designed to maintain the 

established cross-strap configuration for the second event. A typical command 

enable circuit is presented in Figure 3.7-18. 

The schematics of Figures 3.7-17 and 3.7-18 have been greatly simplified, and 

do not show all the components involved. The latching and nonlatching relays 

have two diodes in series across the coils for EMI suppression. Relays with 

a potential shorted-coil failure mode are isolated from the circuits with pro-

*The all-fire current level is established by the device manufacturer. 

3.7-37 

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Command Event 

HATCH EJECT 

Actuate hatch pin-pullers (6) 

to initiate ejection of viewport door cover. 

VIEWPORT DOOR BACKUP 

Backup door drive actuation. 

VIEWPORT DOOR BLOW 

Permanently opens viewport 

doors. 

9 SPLICE AND CUT 

Operates 9 spl mechanism. 

Connects 9 T/U signal to 

T/U 1 and T/U 2 . 

Enables 9 ROLL-IN TERMINATE. 

5 SPLICE AND CUT 

Operates 5 splicer mechanism. 

Connects 5 T/U signal to 

T/U 1 and T/U 2. 

Enables 5 ROLL-IN TERMINATE. 

TABLE 3.7-3 

PYRO-ACTUATED EVENTS 

Type of Device 

Pin-puller SQ16A-SQ21A 

SQ16B-SQ21B 

Pin-puller SQ22A/SQ22B 

Pin-puller SQ23A/SQ23B 

Latch release 34SQ1/34SQ2 

(dimple motors) 

Latch release 49SQ1/49SQ2 

(dimple motors) 

*Current levels and conditions under which they are required are controlled by 

BIF-008 Interface Specification 1401-304-8. 

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Minimum Current 

Required* (am2eres) 

50.00 

9.02 

9.02 

8.66 

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CUT AND SEAL 1 

Actuates: 

Cutter/sealer 1, 

Cutter/sealer 3, 

Cutter/sealer 4, 

9 TSRT, 

5 TSRT 

ARM 1 

Activates SRV 1 recovery 

batteries. 

Enables TRANSFER 1. 

TRANSFER 1 

Activates SRV 1 thermal 

batteries. 

Starts SRV 1 recovery programmer timer. 

Actuates in-flight disconnect 1. 

Enables SEPARATE 1. 

Separation of !FD 1 releases 

blast shield valve. 

SEPARATE 1 

Actuates SRV 1 pin-pullers to 

initiate ejection. 

Actuates spinoff disconnect 1. 

Handle via BYEMAN 

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BIF-008- W-C-019841-RI-80 

TABLE 3.7-3 (CONT'D) 

Type of Device 

Latch release 

(dimple motors) 

Battery activation 

squibs 

Thermal battery 

match 

Delayed action disconnect 

Pin-puller ( +Z) 

Pin-puller (-Z) 

Disconnect 

Pyros 

Internal to SRV 1 

35SQ1/35SQ2 

48SQ1/ 48SQ2 

36SQ1/36SQ2 

50SQ1/50SQ2 

Internal to SRV 1 

Internal to SRV 1 

SQ15A/SQ15B 

SQ13A/SQ13B 

SQ14A/SQ14B 

SQllA/SQllB 

Minimum Current 

Required (amperes) 

55.70 

27.38 

28.40 

26.10 

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SPINOFF DISCONNECT 2 

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Handle via BYEMAN 

TABLE 3.7-3 

.:!2:'.Ee of Device Pyros 

Disconnect S012A/S012B 

release Internal to SRV 2 

Battery Internal to SRV 2 

Thermal battery Internal to SRV 2 

Pin-puller ( +Z) SQ8A/SQ8B 

Pin-puller ( -Z) SQ9A/SQ9B 

BIF-008- W-C-019841-RI-80 

Minimum Current 

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9.23 

26.10 

17.80 

27.38 

29.50 

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Figure 3.7-18. IEU Simplified Command Enable Configuration 

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tective resistors. The digital-to-analog converter referenced for instrumentation is a resistor ladder network that accepts four separate inputs. 

7.3.2.2 IEU Command and Pyro Pulse Outputs. The DOOR BACKUP command is the 

only command output from the IEU. The command pulse received from the SCS 

is diode decoupled in the IEU and then fed through a protective resistor to 

the viewport door electronics, where it operates the primary-to-backup motor 

switchover relays. At the same time, the command also operates instrumentation and pyro firing circuit relays in the IEU. 

Pyrotechnic device firing pulse outputs are produced by simple relay contact 

closings. The circuits consist of nonlatching relays operated by unregulated 

power that close for the duration of the command pulse, connecting the pyrotechnic device bridgewire in series with the pyro power source. At all other 

times, the pyro feed is connected to the pyro power return to maintain a protective short circuit across the bridgewire. 

As shown in Figure 3.7-19, the pyro output pulse feed and return lines are 

routed through removable arm plugs located throughout the forward portion 

of the vehicle. To prevent possible actuation of a pyrotechnic device during 

assembly and testing, the arm plugs are replaced by safe plugs which short 

circuit the bridgewire of the device, or test plugs are placed between the 

arm plug and vehicle connector to insert protective load resistors in series 

with the bridgewire leads. 

For FM-52, all BIF-008 manufactured hardware will use test plugs to protect 

the pyrotechnic devices and provide for end-to-end electronics testing. Safe 

plugs will be used only on SRV 1 and SRV 2. Figure 3.7-20 illustrates the 

typical arm and safe plug wiring schemes. For more detail on the test plugs, 

refer to Part 4, Section 4. 

3.7-43 

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3.7-44 

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7.3.2.3 Timing and Overload Protection. Pyrotechnic device firing pulse 

outputs are delivered to the load within 10 msec of command receipt (i.e., 

pulse is at 90% of full amplitude). Where multiple devices are fired by 

the same command, all output pulses occur within 4 msec of each other. 

To protect the IEU pyro power from overload conditions caused by shorted 

bridgewires, outputs are delivered through fuses or fusible ballast resistors. These are sized so as to allow minimum current to the load in 

the event it is shorted, but in no case constrains the current to less than 

twice all-fire under normal conditions. Under shorted conditions, the time 

to blow ballast resistors is less than 5 seconds. 

7.3.2.4 EMI Control. Due to the potentially catastrophic nature of inadvertent actuation of pyro mechanisms, special EMI controls have been incorporated in the IEU subsystem ranging from isolation and shielding of 

the PPS/SCS pyro power feed and return lines to preferred techniques for 

running pyro cables through the PPS/DP EAC. The following are some examples 

of the controls utilized: 

(1) Each pyrotechnic device is connected to a twisted, 

shielded pair of wires. 

(2) The pyro end of each shield is grounded to its associated 

connector which is in turn connected to the vehicle 

structure through the pyro receptacle. 

(3) The IEU end of each shield is grounded to the IEU chassis, 

which is secured to the vehicle structure. 

(4) Pyro cables are routed in close proximity to the vehicle 

structure, wherever possible. 

(5) Insofar as possible, pyro cables are routed separately 

at a distance of at least one inch from all non pyro cables. 

3.7-48 

Approved for Release: 2017 /02/14 C05097222 

Handle via BYH-IAN 

Control System Only 
Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

7.3.2.5 IEU Instrumentation. The IEU generates both analog and discrete 

instrumentation signals. Analog instrumentation consists of nine command 

receipt monitors and the pyro voltage monitor. Discrete instrumentation 

outputs are provided by instrumentation relays monitoring each pyro output line. 

7.3.2.5.1 Command Receipt Instrumentation. Each command receipt monitor 

consists of a four-input, resistive ladder digital-to-analog (D/A) converter. 

Latching relays monitor the receipt of commands and either ground the inputs or connect them to the instrumentation supply as shown in Figure 3.7-21. 

The converter produces a 16-level output ranging from 0.25 volt to 4.75 

volts in 0.3-volt increments that indicates the state of each of the four 

unique inputs. 

Redundant commands from ECS decoders A and B are monitored by separate command 

receipt relays. Where possible, the A and B signals are connected to different D/A converters, one of which is powered from the +5-volt instrumentation supply, and the other from the +15-volt instrumentation supply. Excluding monitors for the secure word real-time commands (SWRTC 1 and SWRTC 2), 

the MCS command monitor relay outputs are connected in parallel with both the 

ECS decoder A and decoder B instrumentation relay outputs. 

7.3.2.5.2 Pyro Voltage Monitor. Pyro power voltage is monitored by a high 

input impedance circuit as illustrated in Figure 3.7-22 which produces a voltage output proportional to the pyro voltage input. The high input impedance 

serves to reduce steady state current drain from the pyro bus to less than 

100 μamps, and provides effective isolation between the instrumentation and 

power circuits. Also shown in Figure 3.7-22 are the inductor-capacitor 

filter networks which filter all instrumentation power entering the IEU. 

3.7-49 

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7.3.2.5.3 Pyro Output Line Discrete Monitors. Each pyro firing output 

pulse operates a latching relay which switches instrumentation voltage to 

a discrete output (high/low state) instrumentation point. A parallel 

output from each point is fed to the Jll connector of the IEU through an 

isolation resistor for hardline testing. 

7.3.2.5.4 Continuity Loops. Two continuity loops in the PPS/DP EAC monitor 

the presence of arm plugs by establishing a series circuit through the plugs. 

The processing circuitry and outputs are located in the instrumentation processor as shown in the loop diagram of Figure 3.7-23. Provision is made in 

the IEU to accommodate both loops, with loop one passing through the IEU 

arm plug (W99). 

The presence of an arm plug is indicated by a short circuit through the plug. 

A safe plug or test plug places a 3KQ resistor in series with the loop. Each 

loop output is converted to a binary signal in the DTU and, therefore, indicates only that all arm plugs are in place, or that one or more are missing. 

Continuity loop one passes through six arm plugs in the PPS/DP EAC and 

seven arm plugs in SRV 1. Continuity loop two passes through five arm 

plugs in the PPS/DP EAC and seven arm plugs in SRV 2. 

7.3.3 IEU Logic 

The IEU operational logic drawings employ standard logic notation, with minor 

exceptions. Nonlatching relays are represented by logic gates, and latching 

relays by set-reset flip-flops. Where several pyrotechnic devices are fired 

by one command, the nonlatching_ relays are combined into a singJe gate and a 

number representing the actual quantity of relays involved is placed at the 

output (reference Figure 3.7-24). 

3.7-52 

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Figure 3.7-24 Multiple Relay Logic Representation 

Figures 3.7-25 through 3,7-35 illustrate the logic. To maintain clarity, the 

diagrams have been simplified in several areas. As a result the following are 

not shown: 

(1) Command returns 

(2) Instrumentation test point outputs 

(3) Redundant circuitry for sections A and B, 

(reference Figure 3.7-17) 

(4) Output fuses and fusible resistors 

Descriptions of selected functions are provided in the following sections. 

7.3.3.l Viewport Door Backup and Blow Modes. The DOOR BACKUP command from 

ECS decoder A and/or B switches two non-latching pyro power control relays 

which provide power to actuate the primary motor linkage pin-puller. The 

command is also fed directly from the IEU to the viewport door electronics 

to switch power from the primary to the backup motor. In addition, the command operates a latching relay in the IEU that enables the DOOR BLOW command 

circuitry (see Figure 3.7-26). 

When enabled, a DOOR BLOW command from ECS decoder A and/or B will switch 2 

non-latching relays that provide power to operate the backup linkage pin-puller. 

No output is provided to the viewport door electronics to disable the backup 

motor circuit. 

3.7-55 

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.--------illt--------PP 6329 C/S 2-1 

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4238 CUT ANO SEAL 2 (P02577) -----+-+-----<S 

4239 CUT AND SEAL 2 (P01577) -----+-1111---t---I 

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BIT 1 

IMP 5121 BIT 1 

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3.7-66 

~---1--e---------PP 6293 ABUC 1 

IMP 5530 

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IMP 5531 

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7.3.3.2 SPLICE AND CUT and ROLL-IN TERMINATE (9 or 5). The 9 and 5 SPLICE 

AND CUT and ROLL-IN TERMINATE functions operate identically (Figures 3.7-27 

and 3.7-28). The following applies to either. 

Upon command, two nonlatching relays provide actuation power to the splicer 

mechanism dimple motor squibs to initiate the SPLICE/CUT operation. The command also operates two latching relays which connect the SRV 1 take-up 

signal electrically in parallel with the take-up in SRV 2. Therefore, whenever a take-up cycle is performed, both take-up spools (one in SRV 1 and one 

in SRV 2) are powered. A third latching relay operated by the SPLICE AND CUT 

command enables the ROLL-IN TERMINATE command circuitry. Execution of ROLLIN TERMINATE then removes the take-up control signal from SRV 1. 

7.3.3.3. SWRTC 1 and SWRTC 2. The two secure word real-time commands (SWRTC 1 

and 2) from the MCS provide command protection for the SRV 1 and SRV 2 ARM 

command processing circuits. SWRTC 1 enables SRV 1 ARM from the MCS. SWRTC 2 

enables both SRV 1 ARM and SRV 2 ARM from the MCS. Execution of the ECS ARM 

commands is not affected by SWRTC 1 or SWRTC 2. Instrumentation monitoring 

the receipt of SWRTC 1 and SWRTC 2 is interconnected in such a way that no 

indication of command receipt will be given if SWRTC 2 is executed without 

having executed SWRTC 1 (reference Figure 3. 7-30). 

7.3.3.4 ARM/TRANSFER/SEPARATE. To prevent execution of an incorrect command sequence, SRV ARM enables SRV TRANSFER, which enables SRV SEPARATE 

(see Figures 3.7-30 and 3.7-31 for SRV 1 and 3.7-34 and 3.7-35 for SRV 2). 

The SRV 1 and SRV 2 ARM and TRANSFER commands function identically. SRV ARM 

powers the recovery battery activation squibs. SRV TRANSFER powers the deorbit subsystem thermal battery activation matches, and the SRV in-flight 

disconnect squibs. 

3.7-69 

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SRV 1 and SRV 2 SEPARATE are somewhat different in their operation. SRV 1 

SEPARATE powers squibs in the two pin-puller assemblies holding SRV 1, and 

powers the squibs for spinoff disconnect 1. SRV 2 SEPARATE powers only the 

two pin-pullers which are holding SRV 2. 

7.4 PPS/DP EAC Electromagnetic Interference (EMI) Control 

The object of the EMI control effort is to ensure that the PPS/DP EAC 

subsystems function compatibly, and that, when the PPS/DP EAC is integrated 

with the SCS, and subsequently put into operation, there will be no malfunctions 

or interactions between systems due to electromagnetic interference. A common 

baseline, MIL-E-6051-C, is used by all associate contractors for their system 

testing and hardware design to guarantee a sufficient margin between the 

emission level of EMI generated during operation, and the existing threshold 

of susceptibility which would cause a malfunction. 

The "EMI Control Plan", BIF-008 specification 1402-524, provides detailed 

requirements for the design and test of new hardware. The specification 

uses MIL-STD-461A Notice 3, and MIL-STD-462 Notice 2,as a general basis for 

its requirements, with some modification to fit the particular circumstances 

of the PPS/DP EAC. For example, a higher power fluctuation test is required 

due to the use of solar power panels on the SCS. 

In order to make the individual components comply with the requirements, and 

to prevent interaction when the components are connected to form subsystems, 

the following have been given special consideration. 

7.4.1 Filters 

EMI filtering has been kept to a minimum in order to prevent ac currents 

from being coupled into the structure through the filter ground to structure, 

3.7-70 

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and then coupling into other systems which also have filters tied to the 

structure. To eliminate much of the need for filters, all power switching 

circuits* are designed with voltage rise-and fall-time controls (excluding 

pyro firing circuitry in the IEU). However, in the case of brush-type de 

motors, the commutator switching transients must be suppressed by means of 

filters tied to the structure. 

7.4.2 Grounding 

At the complete system level (PPS/SCS), the main power, pyro power, and 

telemetry systems are all tied to the structure at a single point (located 

in the SCS) to eliminate current flowing through the structure. All power 

returns in the PPS/DP EAC are isolated from the structure. The main power returns are connected together at the unipoint ground in the PM and C and 

this in turn is carried back to the SCS unibus return which is tied to structural ground. Pyro power is isolated from all other power in the PPS/DP EAC 

and is returned on isolated lines from the IEU to the unibus return. Telemetry power in the PPS/DP EAC is referenced to the telemetry unipoint which 

is located in the instrumentation processor and is tied to the main power 

unipoint in the PM and C. 

To eliminate additional sources of EMI caused by grounding techniques, all 

components in the PPS/DP EAC are attached to the system structure with a resistance of 2.5 milliohms or less. The resistance between one point on 

the structure and any other point is held to less than 10 milliohms. 

*Voltage changes of 5 volts or less, and associated current changes of 10 

milliamperes or less on control or signal lines are not required to meet 

EMI restrictions. 

3. 7-71 

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7.4.3 Power Distribution 

Large capacitors are connected from the SCS power input lines to the unipoint 

ground in the PM and C (reference Figure 3.7-6). Placed at this point, 

they have the greatest effect in reducing the amplitude of noise on the 

power input lines, and limiting the coupling of power line noise between 

components. As an added measure, all power lines between components are 

twisted with their corresponding return line using at least three turns 

per foot. 

7.4.4 Shielding 

Shielded wires which pass through noncoaxial connectors have their shields 

carried through the connector on a separate pin, with the length of unshielded wire held to a minimum. The shielding on all pyro lines is 

connected to the structure only at the pyro connector and IEU ends. 

7.5 Instrumentation Summary 

Tables 3.7-4 and 3.7-5 summarize the instrumentation associated with the 

main and pyro power subsystems respectively. Instrumentation circuits 

monitoring the actual occurrence of events, such as the SRV separation 

monitors, are not included here as they are too numerous. Reference 

should be made to the appropriate sections of Part 3 for these points. 

7.6 Command Summary 

Table 3.7-6 summarizes the command logic circuits for the IEU and the PM and 

C and references the appropriate logic diagrams. No attempt is made to describe each individual command involved. Instead, the table lists a section 

to which reference can be made for a description of all commands associated 

with a particular function. 

3.7-72 

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TABLE 3.7-4 

MAIN POWER SUBSYSTEM INSTRUMENTATION* 

IMP 

5002 

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5004 

TITLE 

Cal ON/OFF, FEP ON/OFF, 

cal bit A/A, cal bit B/B 

1, 2' 4 

and 5 parking brake ON/OFF 

Environmental branch 5, 6, 

EPSM 1, EPSM 2 ON/OFF 

DESCRIPTION 

Latching relays tracking the command input 

relays of the command processor monitor the 

receipt of commands from the satellite control section and feed either O.Ov or 5.0v 

to an integrated circuit D/A converter. 

Output occurs in sixteen discrete steps 

ranging from 0.25v to 4.75v in 0.3v increments: 

Bit 1 (LSB)** = Cal ON/OFF 

Bit 2 = FEP ON/OFF 

Bit 3 Cal bit A/A 

4 (MSB)*** =Cal bit B/B 

Similar to IMP 5002: 

Bit 1 (LSB) Environmental branch 1 ON/OFF 

B 2 = Environmental branch 2 ON/OFF 

3 = 5 parking brake ON/OFF 

Bit 4 (MSB) Environmental branch 4 ON/OFF 

Similar to IMP 5002: 

Bit 1 (LSB) = Environmental branch 5 ON/OFF 

Bit 2 = Environmental branch 6 ON/OFF 

Bit 3 = EPSM 1 ON/OFF 

Bit 4 (MSB) = EPSM 2 ON/OFF 

*Primary, Emergency (BUSS), and Heater Power 

**Least Significant Bit 

***Most Significant Bit 

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TABLE 3.7-4 (CONT'D) 

IMP TITLE 

5007 5 focus drive enable/inhibit, 

5 minus/stop, 5 plus/stop, 

Sl-PRG cal ON/OFF 

5024 

5029 

5032 

5130 

9 focus drive enable/inhibit 

9 minus/stop, 9 plus/stop, 

Sl-PRG disable/enable 

9 CAM ON/OFF, 5 CAM ON/OFF, 

9 OP ON/OFF, 5 OP ON/OFF 

PCM * 1 ON/OFF, PCM 2 ON/OFF, 

FDS bits 9, 10 

BUSS power supply 

DESCRIPTION 

Similar to IMP 5002: 

Bit 1 (LSB) = 5 focus drive enable/inhibit 

Bit 2 = 5 minus/stop 

Bit 3 = 5 plus/stop 

Bit 4 (MSB) = Sl-PRG cal ON/OFF 

Similar to IMP 5002: 

Bit 1 (LSB) = 9 focus drive enable/inhibit 

Bit 2 = 9 minus/stop 

Bit 3 = 9 plus/stop 

Bit 4 (MSB) = Sl-PRG disable/enable 

Similar to IMP 5002: 

Bit 1 (LSB) = 9 CAM ON/OFF 

Bit 2 = 5 CAM ON/OFF 

Bit 3 :::: 9 OP ON/OFF 

Bit 4 (MSB) = 5 OP ON/OFF 

Similar to IMP 5002: 

Bit 1 (LSB) = PCM 1 ON/OFF 

Bit 2 = PCM 2 ON/OFF 

Bit 3 = FDS bit 9 

Bit 4 (MSB) = FDS bit 10 

A voltage divider network located in the 

PM and C monitors the voltage level of the 

emergency (BUSS) power supply. The output 

is linear and ranges from 0.2v (0 busvolts) to 4.8v (35 bus-volts). 

*Pulse Code Modulation (used to indicate digital telemetry unit). 

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5141 

5090 

5091 

5133 

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TITLE 

Environmental power supply 

Primary PPS power supply 

Crab, stereo, and door current 

Main power current 

Environmental current 

branch 6, EPSM 1, EPSM 2 

1, 

DESCRIPTION 

Similar to IMP 5130; monitors the voltage 

level of the heater (environmental) power 

in the PM and C. 

Similar to IMP 5130; monitors the voltage 

level of the primary power input in the 

PM and C. 

A current sensing resistor in the power return line in the PM and C generates a voltage 

proportional to the combined currents for 

the crab and stereo servos, and the viewdoor motor and electronics. The signal is amplified within the PM and C to 

a linear output that ranges from 

.0 amp) to 5.0v (6.0 amps). 

Three parallel current sensing resistors in 

series between the primary, emergency, and 

heater power return lines to the SCS and 

the return lines from PPS/DP EAC subsystems 

generate a voltage proportional to the 

EAC main power usage. The signal is amin the PM and C to produce an output 

that ranges from O.Ov (0.0 arno) to 5.llv 

(35 

Similar to IMP 5090, the sensor monitors 

the combined currents for environmental 

1 and 6, and EPSM 1 and 2. The 

is linear and ranges from 0.2v (0.0 

to 4.48v (4.0 amps). 

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TABLE 3.7-4 (CONT'D) 

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5134 

5135 

5136 

5138 

5139 

5140 

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TITLE 

Environmental current branch 2, 

and 5 parking brake current 

Environmental current branch 4 

Environmental current branch 5 

PPS main power consumption 

(coarse) 

PPS main power consumption 

(medium) 

PPS main power consumption 

(fine) 

DESCRIPTION 

Similar to IMP 5090; the sensor indicates 

the combined currents for environmental 

branch 2, and the 5 parking brake. The output is linear and ranges from 0.18v (O.O 

amp) to 5.0v (5.0 amps). 

Similar to IMP 5090; the sensor indicates 

the environmental branch 4 current drain. 

The output is linear from 0.2v (0.0 amp) 

to 4.87v (6.0 amps). 

Similar to IMP 5090; the sensor indicates 

the environmental branch 5 current drain. 

The output is linear from 0.18v (0.0 amp) 

to 5.0v (5.0 amps). 

A triple output ampere-hour meter located 

in the PM and C senses by magnetic pick-up the 

current in the PPS/DP EAC main power return 

lines to the SCS. The current levels are 

integrated over time to indicate total 

PPS/DP EAC power consumption (excluding pyro 

power). The meter cycles in 0.7v increments (steps) from O.Ov to 4.9v for each 

range. One cycle (8 steps) for the fine is 

16 ampere-hours and is one step for the 

medium. Eight steps of the medium (128 

ampere-hours) produce one step of the 

coarse. The sum of the readings on all 

three ranges is the total PPS/DP EAC main 

power consumption. The meter is reset 

automatically if power is removed. 

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±15 vdc 

±15 vdc 

24.5 vdc 

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TABLE 3.7-4 

IMP 

5196 

5198 

5200 

5577 

5578 

Handle via BYEMAN 

Con tro 1 System On 1 y 

TITLE 

+15 vdc supply 

+5 vdc supply 

-15 vdc supply 

Environmental branch 1 voltage 

monitor 

Environmental branch 2 voltage 

monitor 

DESCRIPTION 

A divider circuit in the instrumentation 

processor produces a voltage proportional 

to the voltage level of the +15 vdc reguThe output is linear from 

supply level) to 4.0v (15.0v 

level). 

A divider network in the instrumentation 

processor produces a voltage proportional 

to the voltage level of the +5v regulated 

The output varies linearly from 

.Ov supply level) to 4.0v (5.0v 

level). 

network uses the +5 vdc 

as a bias source, produces an 

proportional to the voltage level of 

the -15 vdc supply. The output is linear 

from 4.0v (O.Ov supply level) to 1.0v 

15.0v supply level). 

A voltage divider network across the environmental branch 1 power feed in the PM and C 

monitors the voltage output level. The 

is converted in the DTU to yield a 

s - - . ---

"0" = Off 

"1" = On 

Similar to IMP 5577; monitors the environmental branch 2 power feed. 

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TABLE 3.7-4 (CONT'D) 

IMP 

5580 

5581 

5582 

5583 

5584 v.:i 

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5589 

5590 

5591 

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TITLE 

Environmental branch 4 voltage 

monitor 

Environmental branch 5 voltage 

monitor 

Environmental branch 6 voltage 

monitor 

EPSM 1 voltage monitor 

EPSM 2 voltage monitor 

Servo voltage monitor 

DTU 1 on/off 

DTU 2 on/off 

9 OP voltage monitor 

DESCRIPTION -

Similar to IMP 5577; monitors the environmental branch 4 power feed. 

Similar to IMP 5577; monitors the environmental branch 5 power feed. 

Similar to IMP 5577; monitors the environmental branch 6 power feed. 

Similar to IMP 5577; monitors the EPSM 1 

power feed. 

Similar to IMP 5577; monitors the EPSM 2 

power feed. 

Similar to IMP 5577; monitors the servo 

power feed . 

A voltage divider network in the instrumentation processor is connected across the 

main power feed to DTU 1, and produces a 

voltage proportional to the main voltage. 

The output is converted in the DTU to yield 

a binary signal (on/off): 

"0" = Off 

"1" = On 

Similar to IMP 5589; monitors the DTU 2 

power feed. 

Similar to IMP 5577; monitors the 9 operational power feed. 

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5 OP voltage monitor 

Focus power monitor +15 vdc 

Focus power monitor -15 vdc 

Focus calibration monitor 

+15 vdc 

Focus calibration monitor 

-15 vdc 

Sl-PRG power monitor 

BIF-008-W-C-019841-RI-80 

TABLE 3.7-4 (CONT'D) 

DESCRIPTION 

Similar to IMP 5577; monitors the 5 operational power feed. 

Similar to IMP 5577; monitors the +15v 

focus power feed. 

An optical isolator circuit (LED and phototransistor) with the LED connected across 

the -15v focus power feed in the PM and C 

monitors the voltage level. The output 

converted in the DTU to yield a binary 

(on/off): 

"0" Off 

"1" On 

Similar to IMP 5577; monitors the +15v 

focus calibration power . 

Similar to IMP 5595; monitors the -15v 

focus calibration power . 

Similar to IMP 5577; monitors the Sl-PRG 

power feed. 

5616 5 parking brake voltage monitor Similar to IMP 5577; monitors the 5 parking 

brake power feed. 

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Control System Only ~T 

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CBM IEU 

CBM for IEU 

CBM for IEU 

*A refers to ECS decoder A. 

Hand! e vi a BY EM AN 

Control System Only 

BIF-008- W-C-019841-RI-80 

TABLE 3.7-5 

PYRO POWER SUBSYSTEM INSTRUMENTATION 

DESCRIPTION 

which operate in parallel with 

relays of the IEU 

from the satellite 

Four relays and a resistance 

converter, the output of which 

occurs in sixteen discrete steps ranging from 0.25v 

to 4.75v in 0.3v increments: 

1 

2 

3 

Bit 4 

= TRANSFER 2A* 

ARM 2A 

= TRANSFER lA 

= ARM lA 

ar to IMP 5109: 

Bit 1 (LSB) = SEPARATE 2A 

2 EA SEPARATE A 

3 EA DISCONNECT A 

4 (MSB) = SEPARATE lA 

to IMP 5109: 

Bit 1 (LSB) = TRANSFER 2B 

Bit 2 = ARM 2B 

Bit 3 = TRANSFER 

4 (MSB) = ARM 1B 

Similar to IMP 5109: 

1 (LSB) = SEPARATE 2B 

Bit 2 = EA SEPARATE B 

Bit 3 = EA DISCONNECT B 

Bit 4 (MSB) = SEPARATE lB 

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CBM for IEU (#5) 

CBM for IEU (#6) 

CBM for IEU (#7) 

CBM for IEU (#8) 

CBM for IEU (#9) 

Bl F-008- W-C-019841.,.RI-80_ 

TABLE 3.7-5 (CONT'D) 

DESCRIPTION POWER 

Similar to IMP 5109: +15 vdc 

Bit 1 (LSB) = CUT AND SEAL 2A 

Bit 2 = CUT AND SEAL lA 

Bit 3 = 5 SPLICE AND CUT A 

Bit 4 (MSB) = 9 SPLICE AND CUT A 

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Bit 1 (LSB) = 5 ROLL-IN TERMINATE B 

Bit 2 = 9 ROLL-IN TERMINATE B 

Bit 3 = 5 ROLL-IN TERMINATE A 

Bit 4 (MSB) = 9 ROLL-IN TERMINATE A 

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TABLE 3.7-5 (CONT'D) 

IMP TITLE DESCRIPTION 

5152 Pyro voltage IEU A high input impedance voltage monitor circuit in the IEU monitors the pyro power 

voltage input from the satellite control 

section. The signal is scaled to levels 

compatible with DTU input requirements and 

ranges linearly from 0.2v (O.O bus-volts) 

to 4.54v (30 bus-volts). 

5576 Arm/Continuity, 1 A series loop passes through 13 connectors 

in the PPS/DP EAC to monitor the presence or 

absence of the arm plugs or safe/test plugs. 

Each arm plug puts a jumper wire in series 

with the loop while each safe or test plug 

places a 3KQ resistance in series with the 

loop. The output of the processing circuitry 

in the instrumentation processor is converted 

to a binary signal in the DTU which indicates 

that all arm plugs are in place or that one or 

more arm plugs are missing or have been replaced 

by safe or test plugs. 

5614 Arm/Continuity, 2 Similar to IMP 5576; loop 2 contains only 

12 arm plug sockets. 

IMPs 5500 through 

5563 

Handle via BYE.MAN 

1 System On 

The circuits for IMPs 5500 through 5563 are identical. 

The pyro firing pulse output operates a latching relay 

in the IEU, the output of which is either connected to 

instrumentation return (quiescent) or to +5v (fired). 

A resistor in series with the output isolates the monitor 

circuit from the DTU. The output is converted in the DTU 

to a binary signal: 

"0" = Quiescent 

"1" = Fired 

The title of each IMP indicates the pyrotechnic device 

actuator being fired by the monitored pulse: 

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TABLE 3.7-5 

TITLE 

SRV 1, arm 1 

SRV 1, arm 2 

SRV 1, 

SRV 1, 

SRV 1, 

SRV 1, 

SRV 1, 

SRV 1, 

transfer, 

transfer, 

transfer, 

transfer, 

thermal battery 1 

SRV 1, separate 

SRV 1, 

SRV 1, 

SRV 1, 

SRV 2, 

SRV 2, 

SRV 2, 

SRV 2, 

Spino ff 

Spinof f 

EA 

EA separate 

EA separate 

EA separate 

EA separate 276° 

EA separate 276° 

SRV 2, arm 1 

SRV 2, arm 2 

IFD 1 

IFD 1 

2 

1 

2 

+Z 1 

2 

1 

2 

2 

2 

1 

2 

1 

2 

SRV 2, transfer, thermal 

SRV 2, transfer, thermal 

SRV 2, transfer, IFD 1 1 

SRV 2, transfer, IFD 1 2 

Aft backup cutter 1 

Aft backup cutter 2 

9 splice/cut 1 

9 splice/cut 2 

5 splice/cut 1 

5 splice/cut 2 

2 

1 

1 

1 

2 

BIF-008~W-C-Ol9841-RI-80 

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5541 

5542 

5543 

5544 

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5548 

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5554 

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5556 

5557 

5558 

5559 

5560 

5561 

5562 

5563 

Handle vi a BYEMAN 

Control System Only 

TITLE 

Cut/seal 1 1 

Cut/seal 1 2 

Cut/seal 3 1 

Cut/seal 3 2 

TSRT 5 1 

TSRT 5 2 

TSRT 9 1 

TSRT 9 2 

Cut/seal 4 1 

Cut/seal 4 2 

Cut/seal 2 1 

Cut/seal 2 2 

Hatch eject 1 

Hatch eject 2 

Hatch eject 3 

Hatch eject 4 

Hatch eject 5 

Hatch eject 6 

Hatch eject 7 

Hatch eject 8 

Hatch eject 9 

Hatch eject 10 

Hatch eject 11 

Hatch eject 12 

Backup motor actuate 1 

Backup motor actuate 2 

Viewport door blow 1 

Viewport door Blow 2 

BIF-008- W-C-019841-RI-80_ 

TABLE 3.7-5 (CONT'D) 

DESCRIPTION POWER 

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FUNCTION(S) 

9 and 5 operational power 

and servo power 

Sl-PRG power ON/OFF 

Focus electronics power ON/OFF 

Focus calibration power ON/OFF 

DTU 1 and 2 power ON/OFF 

5 parking brake power ON/OFF 

Environmental branch power ON/OFF 

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00 Viewport door backup U1 Viewport door blow 

9 Spl and cut and 

9 roll-in terminate 

5 splice and cut and 

5 roll-in terminate 

Cut and seal 1 

SRV 1 arm and transfer 

SRV 1 separate 

Spinoff disconnect 2 and 

EA separate 

Cut and seal 2 

SRV 2 arm and transfer 

SRV 2 separate 

Handle via BYEMAN 

Control System Only 

TABLE 3. 7-6 

COMMAND LOGIC SUMMARY 

LOGIC 

3.7-7 

3.7-8 

3.7-8 

3.7-9 

3. 7-10 

3.7-11 

3.7-12 

3.7 13 

3.7-25 

3.7-

3.7-26 

3. 7-27 

3.7-28 

3.7-29 

3.7-30 

3.7-31 

3.7-32 

3.7-33 

3.7-34 

3.7-35 

BIF-008- W-C-019841-RI-80 

COMMAND 

DESCRIPTION 

Part 3, Section 2 

Part 3, Section 13 )> 

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BIF-008- W-C-019841-RI-80 

This page intentionally blank 

3.7-86 

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BIF-008- W-C-019841-RI-80 

8.0 ENVIRONMENTAL CONTROL 

Control of the PPS/DP EAC internal environment is required from initial 

fabrication through recovery of the exposed film. This includes control of 

temperature, humidity, pressure, and particulate contamination, as well as 

control of skin temperatures and temperatures of the internal components 

within prescribed ranges (particularly of optics, films and electronic 

components) . 

Throughout the manufacturing and assembly cycles, environmental control is 

provided by factory facilities, the PPS/DP EAC shipping container and shipping 

jackets, and launch pad facilities. Ground powered heaters and conditioned 

air flow are used during the prelaunch period following gantry rollback. 

Flight hardware design provides the required thermal control during the 

ascent, orbital, and recovery phases. This is accomplished by passive means 

to the greatest extent possible, using flight heaters where required to 

supplement the passive control. The external finish (paint pattern) is 

designed to maintain the average skin temperature at the required level with 

a minimum of variation. Internal radiation and conduction isolation are 

used to decouple internal components from the skins and force them to react 

to the average temperature. 

8.1 Ground Conditioning 

During the manufacturing, shipping, and launch-pad phases, control of temperature, humidity, and contamination is required. Condensates must be kept from 

all internal payload parts so that correct reflectance can be maintained on 

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BIF-008- W-C-019841-RI-80 

optical surfaces. Excessive dirt must be kept from the slit blades and precision mechanical components to prevent streaking or physical damage to the film, 

and jamming of moving parts. The film emulsions must not become moisturesoftened or film transport rollers may become contaminated. The film must be 

protected from overheating, because the rate of sensitometric deterioration 

becomes significant at temperatures above 90F. 

8 .1.1 Manufacturing Environment 

To prevent any reduction in final product performance, all flight hardware 

manufacturing and testing is performed in controlled environments in which 

temperature, humidity, component materials, and especially cleanliness are 

controlled factors. 

Small bits of contamination or foreign material can jam gears, bearings and 

other moving parts. Microscopic bits of contamination on the camera slit can 

cause low exposure streaks and loss of information on the film. 

Cleanliness is controlled as follows: 

a. Facility 

b. Hardware 

c. Film 

The manufacturing and testing areas are maintained 

to provide a clean environment. 

All prime and support equipment is kept clean. 

Contaminant samples are analyzed periodically 

to determine their source and measures are 

taken to eliminate or control the contaminant 

sources. 

Extreme attention is given to handling and cleanliness of film. The camera slit is the most 

critical area with respect to cleanliness. Film 

acts as a conveyor belt for contamination since 

it passes within a few mils of the slit. Each 

handling step associated with the film is accomplished in a carefully controlled clean environment, the film is frequently cleaned, and any 

contaminants are collected and analyzed. 

3.8-2 

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Photographic film is extremely sensitive to certain materials and will be 

degraded if brought into contact with them. All materials in or around 

prime hardware are considered for film compatibility. Materials or parts 

used must be included in the Reliability Approved Parts List. Everything on 

this list has been fog tested for compatibility with film. 

8.1.1.l Manufacturing and Testing Facilities. Various controlled areas and 

clean rooms are maintained for all prime hardware manufacturing and testing. 

BIF-008 facilities include Class II and III cleanliness controlled areas, and 

Class IV and VI clean room facilities for this activity as defined in the 

BIF-008 contamination control handbook. In general, the greater the numerical 

designation, the stricter the controls are over contamination. The Class IV 

and VI clean rooms correspond to class 100,000 and class 100 clean rooms respectively as defined in Federal Standard 209B. 

Table 3.8-1 presents general characteristics of the BIF-008 clean area and 

clean room facilities, and lists typical examples of usage. 

8.1.1.2 Special Cleaning Tasks and Tests. At various times during component, 

module, and PPS/DP EAC assembly level manufacturing, critical components 

are cleaned and/or tested to assure control of particulate contamination. 

8.1.1.2.1 Camera Inspection and Cleaning. After vibration testing of the 

camera, the assembly is partially disassembled in a laminar-flow tent and 

thoroughly cleaned with special vacuum equipment. It is inspected using 

black light which illuminates contaminant particles. 

The 9 and 5 camera slits are tested for contamination by exposing film. Following 

the exposure test, each slit is carefully cleaned using special probes to remove 

any contaminant shown in the exposure test. 

3.8-3 

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Level 

Class II 

Class III 

Class IV 

Class VI 

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TABLE 3.8-1 

CLEAN AREA A.ND CLEA:\ ROOM CHAIV\CTERISTICS 

AND USAGE 

General Characteristics 

Positive pressure 

Entry restricted to authorized 

personnel 

Wet mopping of floor; wet wiping 

of all equipment 

Special clean room garment usage 

(coats, hats) 

Equipment and material restricted 

to approved design 

Maintenance of clean, filtered air 

Controls of a Class II area plus: 

Full clean-room type garments 

(coat, hood, boots) 

Operations restricted to nondirt generating 

Greater restrictions on airborne 

particle contamination 

Controls of a Class III area plus: 

Air shower entries 

More frequent wet mopping and 

wet wiping 

Greater restrictions on manufacturing operations 

Greater restrictions on airborne 

particle contamination (Federal 

Class 100, 000) 

Laminar-flow tent 

Airborne particle contamination 

per Federal Class 100 

G 

For assemblies requiring 

some dirt generating operations not permitted in 

Class III or higher areas 

(e.g., thermal and electrical 

assembly steps for the COA, 

thermal blanket and electronic box construction) 

For assemblies not requiring 

microscopic contaminant 

control but requiring greater 

control than Class II clean 

areas offer (e.g., COA, servos, 

film supplies and take-ups) 

For critical assemblies whose 

performance and reliability 

depend on cleanliness (e.g., 

the camera, all major modules) 

For final cleaning of the 

camera and subsequent operations which expose the 

camera 

Hand 1 e vi a BY EM AN 

Control System On! y 

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Bl F-008- W-C-019841-RI-80 

After testing and cleaning, the camera is sealed with ultraclean plastic to 

prevent future contamination. 

8.1.1.2.2 Film Handling. Film is shipped from the vendor in a specially designed container which is prepared for use and certified by the contamination 

control group. 

The vendor takes precautions to prevent film contamination by wrapping the 

spool in an ultraclean, antistatic plastic bag. The spool is sealed in its 

shipping container. 

Film is unpacked in a Class VI clean area in total darkness. Contamination 

samples are taken and analyzed. 

8.1.1.2.3 COM Bellows Assembly. The bellows is assembled to the camera in 

a Class VI laminar-flow tent. During bellows assembly, the camera opening and 

bellows are inspected with black light and thoroughly cleaned. After assembly, 

the bellows opening is sealed. 

8.1.1.2.4 SEM Film Supply Enclosure. Precautions are taken to keep the film 

supply enclosure (FSE) area closed unless work is required inside. The FSE 

walls are coated with a noncuring adhesive to trap contaminants, and therefore 

cannot be cleaned. 

8.1.1.2.5 DRM Film Tunnels. The DRM film tunnels and gaskets are thoroughly 

cleaned during assembly. After cleaning, the openings are sealed with ultraclean plastic until ready for mating. 

8.1.1.2.6 PPS/DP EAC Cleaning and Testing. Slit exposure tests are made at 

the final PPS/DP EAC level of assembly to show any particles on the slit-blade 

edges that could cause local narrowing of the slit and resultant low exposure 

streaks in the end use. 

3.8-5 

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BIF-008- W-C-019841-RI-80 

A special vacuum probe is used to clean the 9 and 5 slit blades to remove any 

contaminant. 

Thermal surf aces on all external structures, and thermal blankets, are sensitive 

to contamination and are handled at all times with gloves. The external thermal finish receives a final cleaning with freon and water-dampened, lint-free 

wipes during final PPS/DP EAC assembly. 

8 .1. 2 Storage and Shipment 

Strict control of all environmental factors is maintained throughout any storage period required, either at the factory or other locations, and through the 

transportation cycle. Maintaining the necessary conditions requires cooperation 

among all parties involved: BIF-008, the United States Air Force, and Lockheed 

Missiles and Space Company (LMSC). Procedures for storage and shipment are discussed in Part 4, Section 5 of this document. 

8.1. 3 Launch Site Ground Conditioning 

The requirement for launch site ground conditioning of the PPS/DP EAC begins 

at the time the PPS/DP EAC is removed from its shipping container. Suitable 

protection is provided by the container and auxiliary equipment up to this time. 

Figure 3.8-1 provides a graphic summary of the required ground conditions and 

will aid in understanding the following data. 

The purpose of the ground conditioning system is twofold: 

(1) to precondition the PPS/DP EAC components to their 

on-orbit temperature levels, and 

(2) to prevent moisture and other foreign material 

(dust, dirt) from entering the vehicle. 

3.8-6 

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BIF-008- W-C-019841-RI-80 

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Launch Facility 36 Psychrometric Conditions Envelope 

Saturation 100% Relative Humidity 

PPS/DP EAC Shipping Van Control Limits 

On-Pad SEM Control Limits 

On-Pad COM Control s 

On-Pad DRM Control 

Normal ___ ---"'-

Short Periods--

30 

29 

40 

55 

Dry Bulb Temperature (F) 

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Figure 3.8-1. Ground Conditioning at Launch Facility 

Handt e vi a BY EMAH 

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75 80 

120 

119 

"'--85% RH 

110 

50% RH 

46% RH 

RH 

RH 

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The ground conditioning system is designed to provide adequate protection 

against the launch facility weather extremes as presented in the psychrometric summary for the launch facility. This United States Air Force (USAF) 

Air Weather Service document, for the period 1959 through 1962, shows the 

coldest dry-bulb temperature as 29F (with a specific humidity of 23 grains 

of moisture per pound of dry air) and the highest dew-point temperature to 

be 72F. 

During the transfer phase (from the shipping container to the gantry clean 

room), the shipping jackets covering the PPS/DP EAC provide protection from dirt 

and dust as well as moisture. The jackets, constructed of polyurethane 

foam, also off er a good deal of thermal insulation from the external environment. Jacket openings are provided to allow access to the PPS/DP EAC handling 

rings and for exposing the aft area for mating with the satellite control 

section (SCS). In the event of inclement weather, mating is postponed. After 

mating, the shipping jackets are removed as required, and all jackets are 

removed prior to gantry rollback. 

The prime concern during the transfer phase is the prevention of internal 

condensation that could be caused by either the intrusion of warm, moist 

air into a vehicle whose temperature is less than the dew point of the introduced air, or by allowing the PPS/DP EAC to cool to SSF or less (SSF is the 

maximum dew-point temperature of the PPS/DP EAC in the shipping container). The 

possibility of intrusion of warm air is eliminated by keeping the structure 

vents and ports tightly sealed until conditioned air is supplied. Protection against cooling of the PPS/DP EAC to SSF is provided by the heater jackets 

if there is a long delay between removal from the container and the conunencement of conditioned air flow or ground-heater actuation. 

8.1.3.1 Launch Pad. Environmental control on the pad is accomplished by 

maintaining positive pressure in the PPS/DP EAC with conditioned air, and by 

self-contained heaters located in the COM, the FSE, the SRV's, and the film 

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chutes (reference Section 8.3.5.4). The on-pad conditioning configuration 

is shown in Figure 3.8-2. Environmental control necessary within the SEM 

and DRM is established by the requirement to maintain the film supply enclosure temperature and relative humidity at levels such that film emulsions 

will not become moisture-softened. Environmental control is maintained by the 

heaters on the film supply enclosure walls and by operational limitations 

on the duration of PPS/DP EAC exposure to ambient temperatures below 40F or 

above 80F with the gantry rolled back. 

The COM components require much closer temperature control because of the 

greater temperature sensitivity and the long thermal time constants of the 

mirrors. The COM temperatures must be as close as possible to the on-orbit 

equilibrium temperatures or the optics could take nearly a day to stabilize. 

The COM is held at 67 ± 2F by the use of conditioned air and the COM ground 

heaters. 

The positive pressure created by the conditioned air also serves to prevent 

foreign material from entering the PPS/DP EAC. A thermistor, located inside 

the COM near the air inlet, monitors the temperature of the incoming ground 

air. The output of this sensor (umbilical (BIL) point 8010) is available 

only through an SCS umbilical line. 

8.1.3.1.1 Gantry Clean Room. The gantry clean room was established for 

controlled-environment storage of certain equipment and to perform film 

handling and other critical operations as required during the prelaunch 

period. Two areas are provided: 

(1) a clean work station (Area A) 

(2) a clean room (Area B/C) 

Figure 3.8-3 shows a floor plan of the areas. 

3.8-9 

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- PPS/DP EAC 

,flight 

I Insulation 

Blankets 

Ground 

scs 

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B!F-008- W-C-019841-RI-80 

Ground-Powered Heaters 

Flight Insulation Blankets 

Leakage Air Flow Only 

Filter 

Lift-Off 

Umbilical 

~I 

1 I 

' 

l Ground Power 

1576 watts (Max.) 

26-36v de 

w = 70 lb/min 

T = 65 to 70F with special 

requirements on 

transients 

A.H. = 21 grains H20/lb 

dry air maximum 

Air Cleanliness: Class 

100,000 per Fed Std 

209a 

Ground 

Air 

Conditioner 

Figure 3.8-2. PPS/DP EAC On-Pad Conditioning System 

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BIF-008- W-C-019841-RI-80 

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8.1.3.1.2 Clean Work Station (Area A). This area is defined as a clean area 

suitable for the handling, storage, and cleaning of testing devices and critical mechanical items. The area was built in conformance with Federal Standard 

209a and provides the following controlled environment: 

Air Temperature 

Air Change 

Differential pressure 

(inside to outside ambient) 

Humidity 

Dust-control filter 

70 ± SF 

1 every 10 minutes 

0.03 to O.OS psig 

<SO percent RH 

High-efficiency particulate 

air, 99.97 percent efficiency 

for 0.3 micrometer particles. 

Conditioned air is supplied only when a vehicle is in position; however, an 

auxiliary air conditioner may be used between pad cycles. 

8.1.3.1.3 Clean Room (Area B/C). This area encloses a portion of the PPS/DP EAC 

(from the approximate middle of the ejectable hatch, forward) and is capable 

of providing an environment suitable for operations requiring access to the 

film path. Although this type of operation is no longer performed due to 

the implementation of the "factory-to-pad" concept,* the capability does 

exist and could be activated under extraordinary circumstances. 

This area was built in compliance with Federal Standard 209a, Section 40.1.1 

through 40.1.8 and BIF-008 manual 401-119, Chapter 18, and is designed for a 

*Refer to Part 4, Section 3. 

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maximum of six people. It provides the following controlled environment. 

Air temperature 70 ± SF 

Air change 1 every 3 minutes 

Differential pressure 

(inside to outside ambient) 

Humidity 

Cleanliness 

Filter 

0.03 to 0.06 psig 

<45 percent RH* 

Class 100,000 per Fed Std 209a 

High-efficiency particulate 

air, 99.97 percent efficiency 

for 0.3 micrometer particles. 

8,1,3,1.4 General. A portable dehumidifier is maintained in the clean room 

during the times that a vehicle is not in position. In the event of air 

conditioning failure, no outside air can enter the controlled areas. 

Conditioned air will exhaust from the vehicle into the clean room when access 

panels are removed. Figure 3.8-4 shows the recommended lower limit of flow of 

conditioned air to the vehicle versus clean room pressure. 

8.1.3.2 Prelaunch. Throughout the prelaunch period following gantry rollback, 

the PPS/DP EAC is entirely exposed to the external environment. During this time, 

ground heaters together with the flow of conditioned air are used to continue 

the conditioning of the COA to its operating temperature and to provide condensation protection. 

As only leakage air flow is experienced in the SEM/DRM, an analysis was necessary 

to determine what internal temperatures might be expected on a hot launch day 

* During film handling and arming operations, the relative humidity of the 

room will be maintained between 40 and 55 percent. 

3.8-13 

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Recommended· 

Lower Limit 70 ·---··- __________________ __;_ ______ ------------- ' Safe Operating : 

Region 

(Flow from 

Vehicle to 

Clean Room) 

50 - --

' ,_ __ -·· -- _,,. __ _ 

-----------~----

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l 

+ -

___ ____.___ __ _ 

0 -----------~-

o. o 0.2 0.4 0.6 0.8 1. 0 1.2 1,4 1.6 1.8 2.0 

Clean Room Pressurization (Inches of Water) 

Figure 3.8-4. Recommended Operating Limits for Clean Room 

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BIF-008-~-C-019841-RI-80 

(Part 2, Section 14.1.2). No problems were identified by this analysis. Although a high film temperature was calculated in the lower (-Z) EA travel 

viewer box, it is not considered a problem since that portion of the film is 

not used for photography and the predicted temperature did not approach a 

level where the physical properties of the film would be of concern. 

Cold launch day conditions were also analyzed to determine what cooldown rate 

might be expected in the film supply enclosure in the event of a SEM ground 

heater failure. That analysis (Part 2, Section 14.1.1) resulted in a general 

equation for predicting supply temperature as a function of exposure time 

and external temperature which, when combined with a knowledge of dew-point 

temperature within the supply, allows determination of the time available 

before condensation occurs. 

8.2 Ascent 

During the ascent phase, both temperature and internal pressures must 

be maintained within specified limits. Skin temperatures must be 

limited to 400F maximum, a requirement imposed by external finish 

adhesives. In addition, the temperatures of pin-pullers and electronic 

units must remain below the specification limits. Internal pressures are 

controlled by design provisions which permit all sections of the PPS/DP EAC 

to vent air during ascent without damage to components, bulkheads, or the 

structure itself. 

8.2.l Ascent Thermal Environment 

The ascent heat pulse experience is of short duration (approximately 3 minutes), 

and is determined by the selected trajectory. The trajectory, together with the 

emittance of the external skin finish and the skin thickness, primarily determine the skin temperatures. Although the external patterns are designed 

3.8-15 

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mainly to meet the orbital requirements, the use of large areas of highemittance materials is of advantage during the ascent phase. 

The thermal capacitance of the internal SEM components, together with appropriate radiation resistances, serve to limit the temperatures experienced by 

the components. The use of fiberglass insulation in conduction paths from 

the skin to component mounts, and the application of a low-emittance finish 

to the internal skin surfaces isolate the internal components from the SEM 

skin. This isolation is needed to meet the orbital passive requirements but 

also serves the ascent requirements. 

For pin-pullers mounted near the skin, the thermal capacity of the skin and 

substructure, together with conduction isolation, established to a great 

degree by substructure to skin contact conduction resistances, is sufficient 

to maintain temperatures within acceptable limits*. 

Satisfactory component temperatures are predicted for lift-off temperatures 

of 80F or less. For lift-off temperatures greater than 80F, a one-revolution 

cooldown period may be required to return all components to their operating 

ranges (reference Part 2, Section 14.2). 

8.2.2 Ascent Venting 

All sections of the PPS/DP EAC are provided with openings or other means to 

permit internal venting during ascent, and in turn, the entire PPS/DP EAC is 

vented into the SCS through four filtered openings in the Station 285 bulkhead. 

*Reference BIF-008-W-N-012057-0H-73, B2 Dual Recovery Module Ascent Thermal 

Structure Load Test Report. 

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Electronic boxes (except the mirror positioning servos) are not sealed units 

and, therefore, vent by natural leakage. The film path enclosure (the film 

tunnels, FSE, camera, and SRV's) is a sealed system which is vented by six 

poppet valves (cracking pressure 0.29 psid) and a fixed orifice vent. Relief 

valves on the SRV's open at a higher pressure and will assist in venting only 

if that pressure is exceeded. 

Air which is contained among the layers of the multilayer, aluminized Mylar 

insulation must be vented rapidly enough during ascent to prevent excessive 

balloning of the blanket and possible reduction of its usefulness. Additionally, interlayer pressures must be close to ambient during orbit to 

prevent gaseous conduction from reducing the insulating value of the blanket. 

Holes are used to allow trapped air to escape in a controlled manner from the 

space between the layers of the insulation blanket. 

Analysis of PPS/DP EAC venting was performed using a computer program which has 

the capability of analyzing interrelated, multivolume configurations. The 

results of this effort were presented to LMSC for incorporation in the combined vehicle venting model (PPS/DP EAC-SCS-Titan), and are summarized in 

Part 2, Section 13. Locations of the various PPS/DP EAC vent openings are 

described in Part 3. Section 1. 

8.3 Orbital Environment 

Orbital thermal requirements include control of optics temperatures within 

defined ranges so that the full potential of the optical system may be realized, control of film temperatures to avoid deterioration of the film at high 

temperatures or brittleness at low temperatures, and control of electronic 

box temperatures to within design ranges. This control is provided by passive 

means to the greatest extent possible with a minimum of heater power being 

consumed. Flight parameters include minimum altitude ranges between 65 and 

85 nautical miles with beta angles between +60 and -60 degrees, and also the 

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extended altitude parameters with range of 68 to 400 nautical miles with beta 

angles of +40 and -40 degrees. The minimum or extended altitude range shall be 

determined and set before launch. 

In the near-vacuum of space, outgassing of materials must also be controlled. 

Liquids or gases may be exhausted from materials in the PPS/DP EAC which could fog 

the film or build up on the optical surfaces, reducing their performance. For 

this reason, and for safety considerations in manufacturing and testing, no 

components (excluding the film) are used in the PPS/DP EAC which exhaust liquids 

or gases that are corrosive, explosive, noxious, or moisture-generating, or which 

can cause fogging of photographically sensitive materials. 

Film despooling during orbital flight results in water vapor within the FSE (film 

outgassing). The pressure generated within the film path enclosure is controlled 

by a fixed orifice vent on the FSE sidewall which allows the water vapor to vent. 

8.3.l Optics 

The PPS/DP EAC optical components are required to be maintained at 70 ±SF. 

Experience has shown that the temperatures vary much less than this, remaining 

close to the flight heater set point (65F). Achieving this degree of control is 

accomplished both through hardware design and operational techniques. The 

hardware design aspects, involving conductive and radiative isolation of the 

optical components from structural temperature variations are discussed in 

Section 8.3.5.3. 

Operational techniques basically involve restricting the times at which the 

viewport doors may be opened, and the length of time they may remain open. The 

use of low-coefficient-of-expansion materials for the mirrors has reduced the 

transient thermal effects associated with viewport door open time under either 

door open darkside (DOD) or door open lightside (DOL) conditions. Although 

long DOL times create a thermal gradient (6T) from front-to-back on the 

stereo mirror, experience cannot identify any resultant degradation. HowG 

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ever, as the incident energy increases the overall COA temperature, a defocusing condition does occur. The amount of defocus is a function of door open 

time, has an observed effect on best electrical focus (BEF) provided by the 

focus detection subsystem, and affects photographic focus in a similar way. 

A model of this effect has been developed and is used in the operational software to adjust the platen position as a function of DOL time and thereby maintain the correct focus setting. The upper temperature limit is controllable, 

and can be stabilized by using controlled amounts of DOD time to cool the COA 

as necessary. Extremely long DOD times, which would result in a net energy 

loss and increase heater power consumption, are restricted by operational 

considerations. 

In addition to thermal control, contamination of the optical surfaces and the 

resultant performance loss is also of major concern on-orbit. By eliminating 

the largest source of contamination (material outgassing) the problem is virtually eliminated. Only in the area of the Ross Corrector is there need for 

any further efforts. The last Ross element seals the film path and is subject 

to contamination from both film outgassing and particles shed from the film. 

Particulate control is achieved by thoroughly cleaning the film prior to 

loading in the vehicle. Outgassing of water vapor is controlled by the fixed 

vent on the FSE sidewall. 

8.3.2 Film 

Applicable films begin to deteriorate at temperatures above 90F, with an absolute tolerable temperature of 125F. Keeping limits for spooled high-resolution aerial negative films as a function of temperature and relative 

humidity are presented in Figure 3.8-5 along with the limiting envelopes, 

which are independent of relative humidity. Additional information on the 

physical characteristics and sensitometric behavior of film is provided in 

Part 2, Section 7. 

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High-Resolution Aerial 

Negative Films (Spooled 

Conditions) 

Type S0-255 Color Film 

(Limiting Envelope) 

Limit 

Envel 

for Black and 

White Film 

----·----·-·---··· ··--+ ·-··----·-·----------- ---1 

100 1000 10000 

Time (Hours) 

Figure 3.8-5. Film Temperature vs Time Keeping Limits 

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8.3.3 Electronic Boxes 

To simplify the design of stable electronics, the sink temperature operating 

limits for PPS/DP EAC boxes were established at 30F minimum and llOF maximum. 

For several boxes, the maximum limit was established at lOOF in order to maintain 

the 30F minimum and limit the calibration range to 70F. 

8.3.4 External Thennal Control Finishes 

Orbital temperature control is made as passive as possible by means of the 

external finish pattern selection. This is accomplished by designing the pattern 

to minimize the variation of the average (space and time average) skin temperature 

throughout the range of the design orbital parameters. Internal conduction and 

radiation resistances are provided to force internal components to react to the 

skin average temperature. 

The PPS/DP EAC external finish patterns are illustrated in Figure 3.8-6 and 

described in Table 3.8-2. To cope with the full range of altitudes and beta 

angles, three DRM patterns are required. This is necessitiated by the large 

variations of aerodynamic heating which are experienced by the conic sections 

(EA and FA) . The basic SEM pattern is designed to encompass the entire design 

range of minimum altitudes and beta angles. A second SEM pattern is available 

for beta angles of +48 to -48 degrees, while a third SEM pattern is optimized 

for the +16 to -4 sun-synchronous range of beta angles. A fourth SEM pattern 

is available for extended altitudes to 500 nautical miles with beta angles of 

+40 to -40 degrees. Six COM patterns, each capable of the full design range 

of minimum altitude, are provided. The COM pattern selection offers an optimization with respect to beta angle with an accompanying savings of environmental 

heater power and also provides symmetric and asymmetric beta angles of +40 and 

-40 degrees for the extended altitude range patterns. 

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SRV Forebody: 

Blast Shield: 

Kapton MLI blanket 

on forward face for 

protection against 

aerodynamic heating 

during second half 

of mission. 

Multiple coatings 

provided by associate contractor. 

Hilfidi e vi a BYEMAl'I 

Control Sy st.., On! y 

EA and FA: 

Three patterns; one for minimum 

altitudes between 67 nmi and 85 

nmi, one for minimum altitudes 

between 65 and 73 nmi, and one 

for altitudes between 68 and 

500 nmi. 

Figure 3.8-6. 

SEM: 

One pattern for beta angles between -60° 

and+60°. A second pattern for beta angles +Z between -48° and +48°. A third pattern for 

-4° to +16° beta angle (sun-synchronous) range. 

A fourth pattern for extended altitudes to 

400 nmi and beta angles between +40° and -40° 

See Table 3.8-2 for detailed characteristics 

of finish. 

Nine two-inch wide Ti tapes added to -Z quad. for 

extended mode only (38.2% Titanium/60.8% black 

a/c = 0.85/0.58). 

COM: 

Six patterns• each having top and bottom quadrants 

painted black, or black with titanium (-Z). The side 

quadrants are optimized for ranges of beta angles as fol lows: 

B Range 

-30° to +30° 

-48° to +48° 

-60° to +60° 

- 4° to +16" 

(sun synchronous) 

-40° to +40° 

[

0° to +40° 

Asymmetr.1 c 

[

-40° to 0° 

Asymmetric 

Percent White Paint 

13.8 

20.2 

24.4 

0.0 +y quad 

24.4 -Y quad 

17 .0 

0.0 +Y quad 

39.3 -Y quad 

39.3 +Y quad 

0.0 -Y quad 

PPS/DP EAC External Thermal Control Finishes 

Percent Aluminum 

Foi 1 Tape 

86.2 

79. 8 

75 .6 

100. O +Y quad 

75.6 -Y quad 

83.0 

100.0 +Y quad 

60. 7 -Y quad 

60. 7 +Y quad 

100.0 -Y quad 

..'!. 

-Y 

a/< 

0.16/0.15 

0.16/0. 22 

0.16/0. 24 

0.15/0.04 

0.16/0.24 

0.16/0.18 

0.15/0.04 

0.17/0.36 

0.17/0.36 

0.15/0.04 

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FA 

FA 

EA 

and 

FA** 

EA 

EA 

EA 

FA 

FA 

SEM: 

Minimum Altitude 

Range 

(nmi} 

68 to 500 

(non-extended mode) 

67 to 85 

65 to 73 

68 to 500 

67 to 85 

65 to 73 

*a = solar absorptance 

E = infrared emittance 

Bl F-008- W-C-019841-RI-80 

TABLE 3.8-2 

CHARACTERISTICS OF EXTERNAL THERMAL CONTROL FINISHES 

Beta Angle 

Range 

(Degrees) 

±40 

±60 

±60 

±40 

±60 

±60 

Paint Pattern 

Three black segments one 60° area centered on +Z axes the 

other two 30° to 60° off -Z axes on both sides (a/E = 

0.96/0.89). One 50% black/50% titanium segment for 60° 

centered on -Z axes (a/E = 0.83/0.50) and two segments 30° 

to 60° off +Z axes on both sides which are 85% titanium/15% 

black (a/E = 0.74/0.22). Remainder is a mixture of black, 

white, and aluminum as follows: 

35% black/15% white/50% aluminum (a/E = 0.44/0.46). 

120° black on +Z -Z axes (a/E 

0.96/0.89).* mixture of bl , white, and 

aluminum 1 as lows: 

20% black/40% white/40% aluminum (a/E 0.33/0.54) 

0% black/ white/ aluminum (a/E = 0.19/0.66) 

15% black/45% white/40% aluminum (a/s 0.29/0. 

10% black/6% white/40% aluminum (a/s = 0.23/0.17) 

10% black/35% white/55% aluminum (a/s = 0.25/0.41) 

47° black segments centered on +Z and -Z axes (a/s 

0.96/0.89). Remainder is a mixture of white and aluminum 

longitudinal stripes as follows: 

**Titanium will be painted black 

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Minimum Altitude Beta 

Module 

SEM 

SEM 

COM 

Range 

(nmi) 

65 to 85 

(extended 

68 to 400 

*** 

*SEM panels will be replaced. 

Handle via BYEMAN 

System Onl 

Range 

(Degrees) 

±60 

±48 

-4 to +16 

±40 

TABLE 3.8-2 

Bl F-008- W-C-019841-RI-80 

Paint Pattern 

E ; 0.16/0.20) with 23% aluminum 

acent to the -Z black segment (a/£ 

aluminum (a/E • 0.16/0.15) with 23% aluminum 

located adjacent to the -z black segment (a/E = 

.04) . 

aluminum (a/E = 0.16/0.20) on -Y side and a 

of the +Y side adjacent to the +Z black segment . 

aluminum (a/£ = 0.15/0.04) remainder of 

+Y side. 

black segment centered on +Z axes and 47° black segment 

centered on -Z axes with adiacent 50% titanium/SO% black 

See 3.8-6. 

on each side of -z black segment. 

aluminum (a/£ = 0.16/0.20). 

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To implement this multiple pattern approach, a master pattern is applied to the PPS/DP 

EAC in the factory with the appropriate modifications, consisting of tape removal, 

painting of titanium foil and SEM panel replacement in the field upon identification 

of the flight parameters.* Painting of titanium and SHI panels replacement will 

be done in the factory if the selected pattern has been established early enough. 

Since repeated removal and replacement of the vehicle access panels could result 

in damage to the tape, a special application procedure is followed. The forward 

edge of each tape strip is wrapped under, while the trailing edge is cut flush with 

the edge of the skin. In this way, sufficient clearance is allowed between the 

tape stripes, and the leading edge is held securely to withstand the ascent 

environment. 

The materials used for external thermal control surfaces are: 

a. Aluminum foil tape 

b. White silicone elastomer paint 

c. Black silicone elastomer paint 

d. Titanium foil tape 

The black and white paints are silicone elastomeric base with appropriate pigments 

to achieve the desired absorptance and emittance. The black paint has values of 

0.96 and 0.89 for solar absorptance and infrared emittance respectively. The white 

paint has corresponding values of 0.20 and 0.86, and the aluminum foil tape used 

for the aluminum portion of the finish has corresponding values of 0.15 and 0.04. 

The titanium foil has corresponding values of 0. 70 and 0 .10. 

The following considerations apply to the determination of the external patterns: 

a. A high solar absorptance material is required on the vehicle 

top to absorb sufficient solar energy to maintain temperatures 

above lower limits during a low energy, 0-degree beta angle 

orbit. 

*Reference BIF-008-W-C-017752-RH-79 (drawing 1405-223), PPS/DP Operational Finishes. 

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8.3.5 

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b. High solar absorptance/high infrared emittance materials are 

used on the PPS/DP EAC bottom to take advantage of the 

stabilizing influence of the relatively constant (with respect 

to beta) flux inputs (earth emittance and albedo). 

c. Low solar absorptance/low infrared emittance materials are 

used on the PPS/DP EAC sides to attenuate the temperature 

extremes between orbits due to the large variation of incident 

flux as a function of beta angle. 

d. High infrared emittance surfaces are of advantage in rejecting 

energy resulting from aerodynamic heating at low altitudes. 

Internal Design 

Environmental control within each module involves several design techniques. 

Insulation blankets, electrical heaters, and low-emittance finishes on the 

inside skin, as well as selection of materials for their heat conduction 

characteristics (isolating or conducting heat) all contribute to thermal 

control in the PPS/DP EAC. Electromagnetic interference (ENI) is controlled 

through proper grounding of electrical units and other components, by restricting power switching rates, and through shielding of cables susceptible 

to EMI problems. Stray light entering the vehicle when the viewport doors 

are open is controlled within the COA and camera by low reflectance coatings 

and baffles (reference Part 3, Sections 1 and 2). Venting of the vehicle 

during ascent, and of the FSE on-orbit, has been discussed previously in 

Sections 8.2.1 and 8.3 respectively. 

Various combinations of the thermal control design techniques are used within 

each module of the PPS/DP EAC. As an added concern, the DRM must also be 

protected from SRV 1 retro-rocket exhaust during the recovery sequence. 

8.3.5.1 Dual Recovery Module. The DRM is temperature controlled on-orbit 

by passive means with the exception of the satellite reentry vehicles (SRV's). 

3.8-28 

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Although heater circuits are provided in both SRV l* and SRV 2, passive control 

is such that SRV 2 heaters are not required during orbital flight. 

Because the conduction paths between the SRV's and the DRM, as well as the 

conduction paths between the film chutes and the DRJ-.1 are not large, the temperatures of the internal components are controlled primarily by radiant heat 

transfer. 

The interior of the ejectable adapter (EA) forward of the blast shield is 

covered with an aluminized tape which provides a decoupling of the SRV 1 

thrust cone and retro-rocket (which are also aluminized) from the skins. 

The improved blast shield (IBS), located in the EA, consists of an aluminized 

fabric shield with a Kapton multilayer insulation (MLI) blanket attached to 

the forward surface. This provides an effective barrier against the external 

environment during the second half of the flight as well as a radiation barrier between the EA and the FA during ascent and the first half of the flight. 

The IBS, in conjunction with the cutter/sealer and tunnel seal and record 

trap (TSRT) mechanisms which seal the film tunnels in the fixed adapter, 

also serves to protect the PPS/DP EAC from contamination by exhaust gases 

at the time of SRV l retrofire. 

MLI blankets (see Section 8.3.5.3) are used throughout the Dru.1 to enclose 

film path components. These blankets serve to decouple the film path components from the skins and force them to respond to a local average environment. In addition, a temperature stabilizing effect is realized by radiation 

"tunneling" effects within the chutes. 

*SRV 1 internal temperatures and heater power requirements are primarily established by the SRV associate contractor's thermal design. 

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8.3.5.2 Supply Electronics Module. SEM orbital thermal control is accomlished entirely by passive means. The SEM is designed such that the film 

supply enclosure (FSE) is centrally located. Electronic boxes are mounted 

to rails located on the FSE sidewalls and to webs (reference Part 3, 

Section 1). Fiberglass spacers are used to achieve conduction isolation of 

the equipment mounts and the FSE from the external skin and longerons. A 

fiberglass spacer is also used between the FSE and the SEM forward ring to 

attenuate the influence of the DRM. Conductive contact is maintained between the electronic boxes and their mounting rails to assist in rejection 

of internal power dissipation. 

Radiation isolation of the SEM interior is provided by use of low-emittance 

surface finishes on the interior of the SEM skins, the forward surface of the 

SEM/DRM bulkhead, and the aft surface of the FSE at the SEM/COM interface. 

Additional isolation of the COM from the SEM is achieved by the use of 

multilayer insulation blankets on the COM. 

SEM components are finished with high-emittance black finishes to facilitate 

the rejection of internal power dissipation. The FSE is also coated with a 

high-emittance black finish both inside and out. This coating is of advantage in reducing SEM internal temperature gradients. The exterior of the +Z 

and -Z FSE panels, because of their close proximity to the skin, are aluminized to decouple them from the rapid changes of skin temperature. 

To achieve compatibility with the COM, the SEM external paint pattern is adjusted to maintain the SEM aft bulkhead average temperature below the set 

point of the COM heaters. This arrangement prevents a net heat transfer from 

the SEM to the COM and allows the COM to be controlled by its heaters. Maintenance of the SEM aft bulkhead temperature close to the COM heater set point 

is desired to minimize the heater power consumption. 

3.8-30 

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--------------

8.3.5.3 Camera Optics Module. COM temperature control is provided by a 

flight heater system supplemented to the greatest extent possible by passive control techniques. 

Conductive heat transfer between the external structure and the COA is controlled by minimizing the number of physical contacts between them and by 

using flight-proven, high thermal resistance materials and configurations at 

the necessary contact points. Specifically, the COA is mounted to the external structure at only three places; two A-frame structures forward, and 

one uniball joint in the center of the aft bulkhead. Thermal conduction resistance (R) is a function of path length (L), material conductivity (k), 

and cross-sectional area (A) for heat flow in the following relationship: 

L 

R =ff· 

High thermal-conduction resistance is achieved by designing long paths having 

small cross-sectional areas for conductive heat flow and by using materials 

(plastics, titanium) which have a low conductivity. 

The two A-frame arms are constructed of titanium, and the hinges are isolated 

from the COM support ring by insulation blocks. The aft bulkhead is isolated 

from the COM structural ring and skin by a fiberglass splice. 

Within the COA, temperatures are smoothed by a high-radiation exchange and 

the optics are further isolated. The finish of the mirrors is such that the 

thermal resistance between any part of the mirrors and its surrounding environment is relatively high (compared to the thermal resistance between any 

other components). Consequently, the mirrors respond to the average temperature within the COA rather than any locally high or low temperature. 

Power dissipating components within the COA (servo mechanisms and primary 

camera) are finished with low-emittance surfaces to further decouple them 

from the optical components. 

3.8-31 

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BIF-008- W-C-019841-RI-80 

---------------

Multilayer insulation blankets are used to insulate the COA from the external 

structure to prevent the COA from reacting to short-term local variations in 

the external structure skin temperature. Figure 3.8-7, an exploded diagram, 

shows the location of these thermal blankets. As shown, blankets are provided 

at the COM forward bulkhead to provide isolation from the SEM as well as at 

the end bell to provide isolation from the SCS. A low-emittance, aluminized 

bulkhead aft of the COA provides further isolation from the SCS. 

All blankets, excluding those on the viewport doors and on the blast shield, 

are constructed of aluminized Mylar sheets. Each blanket consists of 50 layers 

of embossed, 0.25-mil thick, aluminized Mylar, with an outer layer on each 

side of plain 1-mil thick aluminized Mylar. The layers are tied together with 

fiberglass cord and buttons (with button covers). Venting holes 0.050 inch 

in diameter, spaced on 3-inch centers, allow air to escape from between the 

layers during launch and during transportation by aircraft. For ease of 

assembly and removal, the blankets attach to the structure using Velcro pads. 

The blankets on the end bell and camera cover include electrical heater tapes 

on the inner surface. 

The viewport door and blast shield blankets use Kapton in place of Mylar to 

allow the blast shield blanket and leading edges of the door blankets to 

withstand the high temperatures encountered at low altitudes. The blast 

shield blanket also incorporates a separator material between layers for 

increased effectiveness. 

The COM external paint pattern is designed such that the average temperature 

at hot orbital conditions (low altitude, high beta angle) is equal to the 

heater system set point. Adequate heater capacity is provided to heat the 

COA to the heater set point under cold orbital conditions (high altitude, 

zero beta angle). Six COM external paint patterns are available, allowing 

pattern optimization with respect to beta angle range. 

3.8-32 

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Figure 3.8c7. COM Thermal Blanket Assemblies 

BIF-008- W-C-019841-RI-80 

COM TI-IERMAL BLANKET ASSEMBLIES 

Item Title 

A Bianket Assy, Thermal, Camera Cover* 

B Blanket Assy, Thermal, Camera Housing 

c Blanket Assy, Thermal, Bulkhead 

D Blanket Assy, Thermal, Transition Collar 

E Blanket Assy, Thermal, Bay Area, Upper -Y 

F Blanket Assy, Thermal, +Y Aft 

G Blanket Assy, Thermal, -Y Aft 

H Blanket Assy, Thermal, +Z Aft 

Blanket Assy, Thermal, -Z Aft 

J Blanket Assy, Thermal, Bay Area, Upper +Y 

K Blanket Assy, Thermal, Bay Area, Lower +Y 

L Blanket Assy, Thermal, Bay Area, Lower -Y 

M Blanket Assy, Thermal, Cables, +Y 

N Blanket Assy, Thermal, Cables, -Y 

0 Blanket Assy, Thermal, End Bell* 

p Blanket Assy, Thermal, Bay Door 

*Contains electrical heater tapes. 

3.8-33/3,8-34 

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The heater system design attains high reliability through the use of many small 

heaters, so that an individual failure, either ON or OFF, cannot upset the thermal 

balance of the payload. There are 35 separate heaters and controllers surrounding the COA, with heater sizes varying from 2 to 6 watts. The set point (heater 

ON) tolerance (±0.3F) and hysteresis (0.6F maximum) of the controllers allow 

only very small temperature differences to occur between adjacent heater systems. 

Predictions of COM heater power consumption for each paint pattern are shown 

in Part 2, Section 14, Figures 2.14-13 through 2.14-16, for varying conditions 

of beta angle, minimum altitude, and time of year. Maximum, expected, and 

minimum values, as determined by the external finish properties, are included 

in the figures. The total PPS/DP EAC heater power requirement is determined by 

summing the COM requirement and the SRV 1 requirement. 

8.3.5.3.1 Temperature Induced Curvature (Hotdogging). Another consideration 

in the design of the COM is "hotdogging" (the bending of the external structure) resulting from a nonuniform circumferential temperature distribution. 

Hotdogging is of concern as it causes misalignment of the COA optical axis 

with respect to the SCS axis which, if uncorrected, would result in pointing errors. The derivation of the misalignment is presented in Part 2, 

Section 14.6.2; the magnitude of the misalignment is shown as a function of 

external structure radii of curvature in Figure 2.14-19; and a discussion of 

the method used to implement the correction in the pointing software is 

included in Section 14.3.3.4. 

Displacements between components of the film handlin~ system also result from 

hotdogging. Radii of Ry= 17,000 inches and R2 = 25,000 inches have been included in the film tracking budget and are considered as the operating curvature limits of the system. The design of the COM external paint pattern 

ensures that these curvatures will not be exceeded for all conditions of 

level orbital flight. Predicted curvatures for an orbit having a 0-degree 

beta angle and a 60-degree beta angle orbit are shown in Figures 2.14-17 

and 2.14-18 respectively. 

3.8-35 

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In addition to the operating curvature limits, a nonoperating curvature limit 

has been imposed on the PPS/DP EAC to avoid interference between the internal 

and external structures which could occur at large curvatures. A hardware 

review and analysis* identified those areas at which interference is predicted and is the basis for the nonoperating curvature limits for the 

PPS/DP EAC illustrated in Figure 2.14-32. 

8.3.5.4 PPS/DP EAC Electrical Heaters. The passive thermal control features 

of the PPS/DP EAC are supplemented by electrical heaters both at the launch 

pad (by the ground heater system) and on-orbit (by the flight heaters). The 

ground heater system cannot be used on-orbit as it is powered only through 

the vehicle umbilical line. 

The heater systems consist of many individual heater assemblies, each having 

three components: 

(1) An insulated resistance heater strip (tape which enables 

uniform heating of large surface areas), or several 

strips electrically connected (parallel or series), 

(2) A precision thermistor mounted in the heater area to monitor temperature, and 

(3) An electronic controller to monitor thermistor output and 

switch power to the heater as needed. 

8.3.5.4.1 Ground Heater System. The ground heaters are divided into zones as 

follows: 

Zone 

1 

2 

Location 

SEM 

Stereo-Mirror Bay 

Station Number 

77 

77 

34.5 

- 136 

*Reference BIF-008-W-N-014194-0H-75, PPS/DP Radius of Curvature Study and 

Part 2, Section 14.6.2 of this document. 

3.8-36 

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Zone 

4 

5 

6 

Location 

COA Tube Forward, Middle 

DRM 

COA Tube Aft + End Bell 

-----·--------~ 

Station Number 

136 - 223 

34.5 - (-56.07) 

223 - 285 

In each zone there are several heaters which are resistive tapes bonded to 

the various structures with contact adhesive, except HR72 and HR73 which are 

part of the end bell insulation blanket. The heater tapes are approximately 

0.6-inch wide and are covered by aluminum overlay tape over their entire 

length. The heater controllers, heaters and their associated loads are listed in Table 3.8-3. Heater locations are shown in Figure 3.8-8. 

Figure 3.8-9 is a simplified diagram of the ground heater controller used to 

power all ground heaters except those in the satellite reentry vehicles. Twenty four of these ground controllers are used on each vehicle. The ground 

heater controller applies power to the heater whenever the temperature of the 

sensor located near the heater drops to 65 ±0.3F. The OFF trip-point is 

+0.6F maximum above the ON trip-point. 

The temperature sensor is a thermistor that has a nominal resistance of 

70.77 K~ at 65F. The sensor and resistors Rl, R3, and R4 form a temperature 

dependent resistance bridge. AR1 is a type 741 operational amplifier which 

compares the voltage at the center of the bridge. Assuming that the sensor 

temperature is sufficiently low, the voltage at the inverting input of AR1 

will be less than that at the noninverting input. The voltage at the output 

of ARI will rapidly increase turning Ql and Q2 on. Feedback through RS increases the voltage at the noninverting input above its former value (hysteresis). When the sensor temperature is sufficiently high, the voltage at the 

output of ARI will decrease turning Q2 off. 

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BI F-008- W-C-019841-RI-80 

----------~ 

TABLE 3.8-3 

GROUND HEATER SYSTEM 

Heater Heater Nominal 

Zone Controller Designation Location Power (watts) 

(at 31 volts) 

1 ASO HSORl in series with FSE -Y Side, Exterior 85.4 

HSOR2 

1 ASl HSlRl FSE -Y Side, Exterior 85.4 

1 A52 H52Rl SES +X Side, Aft Bulkhead 85.4 

1 A53 H53Rl FSE +Y Side, Exterior 85.4 

1 A54 H54Rl in series with FSE +Y Side, Exterior 85.4 

H54R2 

1 ASS HSSRl FSE +Z Panel, Exterior 85.4 

1 A56 H56Rl SES -X Side, Forward Bulkhead 85.4 

1 A57 H57Rl FSE -Z Panel, Exterior 85.4 

2 A102 HR61A in parallel Front Tape Support Screen 67.4 

with HR61B 

2 A103 HR62A in parallel COA Hood, Exterior 51.9 

with HR62B 

2 A104 HR63A, HR63B, HR63C, COA Hood, Exterior 64.1 

HR63D in parallel 

2 * SRV 1 44 

2 * SRV 2 44 

3 Al OS HR64A in parallel COA Forward, Interior 60.4 

with HR64B 

*Heaters, sensors, and controllers are provided by General Electric Reentry and 

Environmental Systems Division (GE RESD) . Each heater is a rectangular strip 

5.50 inches by 8.20 inches. Four strips are used in each SRV (one per quadrant) 

and are mounted within the recoverable capsule portion of the SRV. The ON trippoint temperature is 67 ± 3F. 

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Control System Only 
Heater 

Zone Controller 

4 A106 

4 A107 

4 A108 

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5 A70 

5 A71 

6 A109 

6 AHO 

6 Alll 

6 A112 

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Bl F-OOB- W-C-019841-RI-80 

TABLE 3.8-3 (CONT'D) 

Heater 

Designation 

HR65A in parallel 

with HR65B 

HR66A in parallel 

with HR66B 

HR68A in parallel 

with HR68B 

H60R1, H60R2, H60R3, 

H60R4, H60RS in 

parallel 

H70R1 in parallel 

with H70R2 

H71Rl in parallel 

with H71R2 

HR70A in parallel 

with HR70B 

HR71A in parallel 

with HR71B 

HR72 

HR73 

Nominal 

Location Power (watts) 

(at 31 volts) 

COA Forward, Interior 70.7 

COA Forward, Interior 70.7 

COA Middle, Interior 70.7 

EA Film Tunnels 16.1 

FA Film Tunnels 14.9 

FA Film Tunnels 14.9 

COA Aft End, Interior 70.7 

COA Aft End, Interior 76.9 

Primary Mirror -Z Blanket 28.6 

Primary Mirror +Z Blanket 28.6 

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8.3.5.4.2 Flight Heater System. Flight heater power is supplied by the main 

batteries in the satellite control section (SCS) through the heater-power feedlines and returns in the power monitor and control unit (PM and C). These power 

feedlines end in terminal strips which divide the heaters into branches as 

follows: 

Branch 

1 

2 

4 

5 

6 

*EPSM 1 

*EPSM 2 

SRV 1 

Stereo-Mirror 

COA Forward, 

COA Aft 

SRV 2 

SRV 1 

SRV 2 

Bay 

Middle 

Station Number 

77 - 136 

136 - 223 

223 - 270 + end bell 

In each branch there are several heaters (see Figure 3.8-10). COM heaters are 

resistive tapes bonded to the various structures with contact adhesive, except 

HR2, HR3, and HR48 which are part of the insulation blankets, and HRl which is 

a discrete wirewound resistor. The heater tapes are approximately 0.6 inch 

wide and are covered by aluminum overlay tape over their entire length. Power 

to the branches is controlled by commandable power switches in the PM and C 

unit, and power to each heater is controlled by an electronic circuit (heater 

controller). Table 3.8-4 lists the ON and OFF trip-points of the heater controllers. The various heaters and their associated power loads are listed in 

Table 3.8-5, and the location shown in Figure 3.8-11. 

* Supplied through the BUSS (emergency) power feedlines and returns in the PM and C. 

3.8-42 

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Heater 

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Switch 

I 

I 

L_ - - - - - ------ __ I 

SRV 1 

Mirror Bay 

STA 77-136 

COA, Forward 

STA 136-223 

COA Aft, and 

End Bell 

STA 223-285 

SRV 2 

SRV l 

Rec. 

Batt. 

SRV 2 

Rec. 

Batt. 

} 2 Heaters 

25 watts 

} 

7 Heaters 

38 watts 

} 14 

Heaters 

81 watts 

} 

12 Heaters 

64 watts 

} 

2 Heaters 

25 watts 

} 

l Heater 

(2 tapes in 

parallel) 

30 watts 

} 

1 Heater 

(2 tapes in 

parallel) 

30 watts 

Figure 3.8-10. Flight Heater Branch Block Diagram 

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COM 

SRV Capsules (Branches 

1 and 6) * 

SRV Batteries (EPSM 1 

and 2)* 

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TABLE 3.8-4 

HEATER CONTROLLER SET POINTS 

ON OFF 

(degrees F) (degrees F) 

65 ± 0.3 

35 ± 4 

+0.6 maximum from on point 

+2 to +5 from on point with 

backup thermostat to switch 

off at 67F nominal 

Controller switches heaters 

off at lOOF nominal 

A simplified diagram of the flight heater controller used to power all orbital 

heaters except those in SRV 1 and 2 is shown in Figure 3.8-12. Thirty three 

of these controllers are used in each vehicle. The flight heater controller 

applies power to the heater whenever the temperature of the sensor located 

near the heater drops to 65 ± 0.3F (see Figure 3.8-13 for sensor locations). 

The OFF trip-point is +0.6F maximum above the ON trip-point. 

The temperature sensor is a thermistor that has a nominal resistance of 

70.77 K~ at 65F. The sensor and resistor Rl form a temperature dependent voltage divider. Assuming that the sensor temperature is sufficiently high, the 

heater controller is in the OFF state and the transistors in the heater controller are in the following states: 

Ql OFF 

Q2 ON 

Q3 ON 

Q4 OFF 

Q5 OFF 

*Heater controllers are provided by the SRV associate contractor. The SRV 

battery heaters are not normally powered until near recovery time. 

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G 

TABLE 3.8-5 

FLIGHT HEATER TAPE LOCATIONS 

Location and Remarks 

1. Shaft to Spherical Bearing: 

Spot heater (wirewound resistor) 

on end bell 

2. +Z Primary Mirror Insulation Blanket: 

Heater attached to -X surface of 

blanket 

3. -Z Primary Mirror Insulation Blanket: 

Heater attached to -X surface of 

blanket 

4. End Bell: 

Heater tapes located inside end bell, 

in three 120-degree zones beginning 

at +Z axis 

5. COA Aft End (Sta 223 to 270): 

Heater tapes arranged parallel to X 

axis, between longerons, in six 60-

degree zones, symmetrical about the 

Z axis, on the outside of the COA 

6. COA Middle (Sta 180 to 223): 

Heater tapes arranged parallel to X 

axis, between longerons, in six 60-

degree zones, symmetrical about the 

Z axis, on the outside of the COA 

7. COA Forward End (Sta 136 to 180): 

Heater tapes arranged parallel to X 

axis, between longerons, in six 60-

degree zones, symmetrical about the 

Z axis, on the outside of the COA 

8. COA A-Frames: 

Heater tapes located inside the COA 

directly beneath the 2 A-frame 

mounts (Sta 139) 

TO~ 

Env 

Branch 

5 

5 

5 

5 

5 

4 

4 

4 

_G_ 

Number 

of 

Heaters 

1 

(HR1) 

1 

(HR2) 

1 

(HR3) 

3 

(HR4-H46) 

6 

(HR7-HR12) 

6 

(HR13-HR18) 

6 

(HR19-HR24) 

2 

(HR25,HR26) 

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Single Heater 

Power Input 

(watts) 

(at 24.5 v) 

2 

6 

6 

4.2 

6.2 

6.2 

6.2 

3.4 

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81 F-008- W-C-019841-RI-80 

-----~-~-- ------

TABLE 3.8-5 (CONT'D) 

Location and Remarks 

9. Heater Tape Support Screen (Sta 78-96), 

and COA Hood (Sta 96-136): 

Heater tapes arranged parallel to X 

axis, between longerons, in four 60-

degree zones (approximate), symmetrical about Z axis, on outside of 

structure ("A" heater tapes on the 

screen; "B" heater tapes on the COA 

hood) 

10. Shield Assembly (Sta 78): 

Zigzag pattern running symmetrically 

about Z axis 

11. Camera Cover Insulation Blanket: 

Heater attached to camera housing 

side of blanket 

12. SRV - Orbital: 

Heaters, sensors, and controllers 

provided by GE RESD. Two circumferential strips, 1.75 inches wide 

and 38 inches long inside the recoverable capsule 

13. SRV Recovery Batteries: 

Heaters, sensors, and controllers 

provided by GE RESD. Heaters are 

internal to the batteries (2 per 

SRV) 

Env 

Branch 

2 

2 

2 

Number 

of 

Heaters 

4 

(HR27A/B, HR28A/B, 

HR29A/B, HR30A/B; 

each pair in series: 

2 

(HR33, HR34) 

1 

1 (SRV 1) 4 

6 (SRV 2) (2 each SRV) 

Single Heater 

Power Input 

(watts) 

(at 24.5 v) 

5.4 

5,1 

6 

12.5 

EPSM 1 (SRV 1) 2 30 

EPSM 2 (SRV 2) (2 tapes in parallel, each SRV) 

3.8-46 

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PPS/DP EAC Station Number (Inches) 

70 100 

77 

-Z ~~-+---.....--~~-+-~-

+Y ---+----

-Y ---+----------+---

BIF-008 

Vehicle 

Coordinates 

I 

136 

150 200 250 

223 244 

.A I RTll 

.AIRT8 

.j.RT7 

-Z l --

Notes: 

1. RT1, RT4 - RT6 are on the end bell; 

RT2 and RT3 are on the primary 

mirror blankets 

RT33 and RT34 are on the front surface 

of the tape support screen; 

RT48 is on the camera cover blanket. 

2. The numerical number of each sensor 

corresponds to the numerical number 

of the heater it controls. 

Figure 3.8-13. COA Heater Controller Temperature Sensor Locations 

Hand! e vi a BY EM AN 

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270 

180 

225 

270 

315 

0 

45 

90 

135 

180 

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As the temperature decreases, the base voltage of Ql increases until Ql starts 

turning on. As Ql starts turning on, the current through Q3 begins decreasing 

until the trip-point is reached where Q4 turns on, which turns on QS, applying 

power to the heater. Heat supplied by the heater decreases the resistance of 

the thermistor lowering the voltage at the base of Ql. The collector voltage 

of Ql increases turning Q3 on, Q4 off and QS off. The thermistor turn-off resistance is less than the turn-on resistance (hysteresis) since, when Q4 turns 

on, the emitter voltage of Q3 is increased above its former value requiring a 

higher base voltage for Q3 to turn on again. 

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25X1 
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8.3.5.6 Thermal Control During SRV and EA Ejection Sequences. The operational 

sequence for SRV ejection includes nose aft flight for up to three revolutions, 

a pitchdown and hold maneuver during ejection, and then a pitchup or retrim 

maneuver to return the PPS/DP EAC to a level attitude*. The EA is ejected while 

the PPS/DP EAC is in a nose aft, level attitude. No restrictions are placed on 

recovery maneuvers for EA or SRV 2 ejection. However, since the predicted 

COM curvature during a recovery revolution could exceed the operating curvature constraint, it is required that the COM be in a nonoperating state 

(viewport door operation and film movement prohibited) during the recovery 

revolution. This constraint applies to SRV 1 ejection as well. 

Additional problems arise during the ejection sequence for SRV 1 which are not 

of concern during EA or SRV 2 ejection. To meet these, special operational 

techniques have been established to ensure proper thermal control. Particular 

emphasis is given to limiting skin temperatures and COM curvature, and to 

limiting EA/FA pin-puller temperatures due to localized aerodynamic heating 

during pitchdown at low altitudes**; The techniques employed depend on the 

minimum altitude range at the time of the ejection sequence, and can include 

high-rate powered pitch maneuvers and roll joint rotation of the PPS/DP EAC to a 

specified position. A powered pitch (as opposed to an inertial pitch) reduces 

the length of time spent in a non-level attitude. PPS/DP EAC rotation provides a 

more favorable orientation of the EA/FA pin-pullers with respect to the windstream (see Figure 3.8-14). 

Requirements and recommendations for SRV 1 ejection are summarized by minimum 

altitude range: 

(1) Less than 68 nmi: Powered pitchdown and powered retrim 

immediately after ejection are required. 

Dwell time in pitchdown state must be minimized. 

* Refer to Part 3, Section 12 for a further description of the recovery sequence. 

**Reference BIF-008-W-C-003745-0H-74, Summary: Pin-puller Thermal Analysis. 

3.8-52 

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49 Unrotated Pin-puller Positions 

Q Rotated Pin-puller Positions 

SRV 1/EA 

Interface 

EA/FA 

Interface 

-Z 

( +Z) 

\

+Roll 

(- Roll BIF-008) 

// ~ 36.5° / Note: Coordinate system shown 

is unrotated LMSC system 

viewed looking aft (BIF-008 

coordinates in parentheses). +Z 

(- ) 

t Velocity 

Vector 

Figure 3.8-14. EA/FA Pin-Puller Locations 

3. 8- 5 3 

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(2) Greater than 68 nmi, but less than 73 nmi: Inertial (nonpowered) 

pitchdown is acceptable; either powered 

retrim or PPS/DP EAC rotation during entire 

sequence is requ1red. 

(3) Greater than 73 nmi: No restrictions. 

( 4) All altitudes: PPS/DP EAC rotation is recommended. 

8.4 Instrumentation 

Table 3.8-6 summarizes those instrumentation points related to the PPS/DP EAC 

environment which are monitored on-orbit. Figures 3.8-15 through 3.8-17 

illustrate the locations of the DRM and SEM skin temperature sensors, and 

the COA structure temperature sensors respectively. Figures in Part 3, 

Section 1 illustrate the locations of all other temperature sensing thermistors except those within the satellite reentry vehicles (SRV's). For 

the locations of thermistors within the SRV's, refer to Part 3, Section 12. 

While they are not flight monitors, the umbilical instrumentation points 

(BIL's) are useful environmental monitors at the launch pad. For this 

reason, a summary of these points is provided in Table 3.8-7. 

3.8-54 

_G_ 

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TABLE 3.8-6 

ENVIRONMENTAL SUBSYSTEM INSTRUMENTATION SUMMARY 

Title 

Environmental Branches 1,2, 

and 4, and 5 Parking Brake 

On/Off 

Environmental Branch 5,6, 

EPSM 1, EPSM 2 On/Off 

BUSS Power Supply 

Environmental Power Supply 

Description Power 

Latching relays tracking the command input 

relays of the command processor monitor the 

receipt of commands from the satellite control section and feed either O.Ov or 5.0v 

to an integrated circuit D/A converter. 

Four relays and one 4-bit D/A converter 

form the IMP. Output occurs in s 

+5/±15 vdc 

crete from O. to 4.75v 

in 0.3v 

Bit 1 = Env 

2 Env 

Bit 3 5 

Bit 4 (MSB) Env 

Similar to IMP 5003: +5/±15 vdc 

Bit 1 (LSB) = Env Branch 5 On/Off 

Bit 2 = Env Branch 6 On/Off 

Bit 3 = EPSM 1 On/Off 

Bit 4 (MSB) EPSM 2 On/Off 

A fixed resistor divider network in the +5 vdc 

PM&C monitors the voltage at the PM&C on 

the BUSS (Emergency) power input lines 

the satellite control section (SCS). The 

output is linear from O.Ov (0.2v output) to 35v 

(4.83v output). 

Similar to IMP 5130, monitors the voltage 

at the PM&C on the environmental power input lines from the SCS. 

+5 vdc 

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Title 

Environmental Branch 1 

Voltage Monitor 

Environmental Branch 2 

Voltage Mani tor 

Environmental Branch 4 

Voltage Mani tor 

Environmental Branch 5 

Voltage Mani tor 

Environmental Branch 6 

Voltage Monitor 

EPSM 1 Volt~ge Monitor 

EPSM 2 Voltage Monitor 

BIF-008- W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Description Power 

--

A two resistor voltage divider circuit con- Self 

nected across the branch 1 power feed line 

in the PM&C monitors the voltage level. 

Output is digitized in the DTU to yield a 

binary signal (On/Off). 

"0'' = Off )> 

"1" = On "O 

"O 

..., 

0 

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c. power feed in the PM&C. -

0 

..., 

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Environmental Current 

Branch 1, Branch 6, 

EPSM 1, and EPSM 2 

Environmental Current 

Branch 2, and 5 

Brake Current 

Current 

Branch 4 

Current 

Branch 5 

Film Path Pressure 

Bl F-008- W-C-019841-RI-80 

TABLE 3. 

Description 

A current 

branches 1 

Simi to 

resistor in the power regenerates a voltage 

currents for 

and EPSM 1 and 2. 

the is proporcurrent branch 2, 

. The output is 

(0.18v) to 5.0 

Simi to IMP 5133, a 

orooortional to . from 0.0 to 

Similar to IMP 5133, produces a voltage 

orooortional to the branch 5 current drain. 

A diaphragm responds to slight differential 

FSE with reis located on 

each side of the diaphragm to sense the 

motion. The corresponding inductance changes 

Power 

±15 vdc 

±15 vdc 

±15 vdc 

±15 vdc 

24.5 vdc 

(DTU switched 

power) 

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Blast Shield Valve 

Temperature, Primary Film 

Supply 

Temperature, Camera Housing 

Temperature Focus Sensor 

Head 

Bl F-008- W-C-019841-RI-80 

TABLE 3,8-6 (CONT'D) 

Description 

determine the frequency of an oscillator 

which is demodulated into a proportional analog 

output voltage. The range of the IMP is 0 mm 

of Hg (0.37v) to 4.63 mm of Hg (5.0v). 

A potentiometer attached to the blast shield 

valve monitors the valve position, providing 

a linear output from 0°, or closed (4.5v), 

to 70°, or open ©.5v). 

A thermistor, mounted on the back of the 9 

film quantity sensor assembly, monitors the 

temperature near the 9 supply spool. The 

output is scaled in the instrumentation 

processor producing a nonlinear signal from 

lOF (4.75v) to 130F (0.54v). 

Power 

+5 vdc 

+15 vdc 

A thermistor mounted on the +Z surface of ±15 vdc 

the camera housing, centered on the X-axis 

at approximately station 79.2, monitors the 

internal temperature. The output is processed in the housing, producing a nonlinear signal from 30F (4.82v) to lOOF (l.02v). 

A thermistor mounted on the base plate (-Z) ±15 vdc 

of the RMS to DC converter module in the 

focus sensor head assembly monitors the focus 

sensor head temperature. The output is processed by an integrated circuit differential 

amplifier in the focus detector instrumentation 

and control module, producing a linear signal from 

60F (4.75v) to 80F (l.06v). 

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BIF-008- W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Title 

Temperature, 5 lt Frame 

Temperature, 9 Tilt Frame 

Supply , Film 

#2 Temperature, 

SRV 2 

#2 Battery Temperature, 

SRV 1 

Description 

A thermistor mounted on the outer side of 

the 5 pivot frame near the platen drive 

motor monitors the frame temperature. 

Process circuitry is located in 

camera housing. The output is linear from 

60F (4.5v) to 80F (0.87v). 

Similar to IMP 5060, The thermistor is 

mounted on outer of the 9 pivot 

near the platen motor. 

Power 

±15 vdc 

±15 vdc 

A stor, mounted on the +Y s of +15 vdc 

5 supply frame near the supply spool support, 

The output 

A thermistor, mounted on the -X side of the +5 vdc 

number 2 recovery battery in SRV 2, monitors 

the battery temperature. The IMP output is 

provided by a resistor/thermistor voltage 

divider circuit SRV 2, yielding a nonlinear signal from 30F (3.8v) to 130F (l.35v). 

Identical to IMP 5078, a thermistor on the 

-X side of recovery battery number 2 in 

SRV 1 monitors the battery temperature. 

+5 vdc 

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5099 

5ll0 

5111 

5112 

5113 

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Title 

Temperature, Stereo Mirror 

Temperature, Corrector, 

Camera Spacer 

Temperature, Viewport Door 

Inside Insulation -Y 

Temperature, Lens Tube 

Forward, Sta 175, 279 

Degrees 

Temperature Lens Tube Aft, 

Sta 244, 5 Degrees 

BIF-008~ W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Description Power 

A thermistor, mounted on the back surface ±15 vdc 

of the stereo mirror, monitors the mirror 

temperature. The output is processed by an 

integrated circuit differential amplifier in 

the instrumentation processor, producing a 

linear signal from 60F (4.75v) to 80F 

(l.06v). 

Similar to IMP 5099, the thermistor is ±15 vdc 

mounted on the top plate of the Ross 

Corrector, at the +Y edge approximately 

2 3/4 inches from the camera interface . 

A thermistor, located at the center of the +15 vdc 

-Y viewport door heater tape support screen, 

monitors the temperature inside the -Y door. 

A load resistor in the instrumentation 

processor (IP) reduces the output to acceptable levels. The output is nonlinear, 

ranging from 40F (4.95v) to lOOF (l.4v). 

A circuit, identical to that used for IMP +15 vdc 

5111, monitors the COA temperature. The 

thermistor is mounted on the COA structure 

at station 175, 279 degrees, and, with a resistor in the IP, forms a voltage divider network producing a nonlinear signal from 40F 

(4.95v) to lOOF (l.4v). 

Similar to IMP 5099, the thermistor is 

mounted on the inner surf ace of the COA 

at station 244, 5 degrees. 

±15 vdc 

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IMP 

5114 

5115 

5120 

5145 

5150 

5155 

Handle via BYEMAN 

Control Sys tan Only 

Title 

Temperature Viewport Door 

Inside Insulation +Y 

Temperature Lens Tube 

Forward, Sta 175, 

99 Degrees 

Temperature Insulation 

Inner, Sta 108, 7 Degrees 

Temperature Primary Mirror 

2 (-Y) 

Temperature Primary Mirror 

1 ( +Y) 

Temperature, Insulation 

Inner, Sta 244, 

186 Degrees 

B!F-008- W-C-019841-RI-80 

TABLE 3,8-6 (CONT'D) 

Description 

A thermistor, located at the center of the 

+Y viewport door on the heater tape support 

screen, monitors the temperature inside the 

+Y door. The thermistor, and a resistor in 

the IP, form a voltage divider network 

yielding a nearly linear output from 32F 

(l.15v) to lOOF (3.2v). 

Similar to IMP 5099, the thermistor is 

mounted on the outer surface of the COA at 

station 175, 99 degrees. 

Similar to IMP 5099, the thermistor is 

mounted on the COA structure at station 108, 

7 degrees. 

A thermistor, mounted on the front surface 

of the primary mirror, approximately 8 

inches from the center along the -Y axis, 

monitors the primary mirror surface temperature. The thermistor, and a resistor in the 

IP, form a voltage divider network yielding 

a nonlinear signal from 40F (4.5v) to lOOF 

(1.25v). 

Similar to IMP 5099, the thermistor is 

mounted on the front surface of the primary 

mirror, approximately 8 inches from the 

center, along the +Y axis. 

Similar to IMP 5099, the thermistor is 

mounted on the COA structure at station 244, 

186 degrees. 

Power 

+5 vdc 

±15 vdc 

±15 vdc 

±15 vdc 

±15 vdc 

±15 vdc 

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5235 

5236 

5238 

5239 

5240 

5241 

5242 

Handle vi a BYE.MAN 

System Only 

Bl F-008- W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Title 

Temperature SRV 1 Film 

Take-up Assembly 

Temperature SRV 2 Film 

Take-up Assembly 

Temperature SRV 1 Recovery 

Battery +Y Side 

Temperature SRV 2 Recovery 

Battery +Y Side 

Temperature SRV 1 Thrust Cone 

Retro Attach Point 

Temperature SRV 2 Thrust Cone 

Retro Attach Point 

Temperature SEM Internal, 

+Y 

Description 

Similar to IMP 5013, the instrumentation 

thermistor is glued to a take-up frame cross 

member, and is centered on the Z axis just 

below (-Z) the 5 wobble roller. 

Similar to IMP 5235, monitors the temperature of T/U 2. 

Similar to IMP 5078, the thermistor is 

mounted on the -X side of recovery battery 

number one in SRV 1 • 

Similar to IMP 5078, the thermistor is 

mounted on the -X side of recovery battery 

number one in SRV 2. 

A resistor/thermistor voltage divider circuit with the thermistor mounted on the 

thrust cone retro attach point at approximately 345 degrees. The output is nonlinear, ranging from lOF (4.15v) to 140F 

(l.15v). 

Similar to IMP 5240, monitors the temperature of the T/C retro attach point in SRV 2. 

A resistor/thermistor voltage divider circuit, with the thermistor attached to a 

mounting rail on the FSE +Y exterior near 

the 9 camera electronics assembly, monitors 

the SEM temperature. The output is nonlinear from 20F (0.55v) to 120F (4.14v). 

Power 

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+15 vdc 

+5 vdc 

+5 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

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5243 

5244 

5245 

5246 

5247 

5248 

5249 

Handle via BYEMAN 

C.Ontrol System Only 

Title 

Temperature SEM Internal, 

RSE/RAM-5 

Temperature SRV 1 Forebody 

Liner Skirt, X Axis 

SRV 2 

, X Axis 

SRV 1 Forebody 

Liner Skirt, +45 

Temperature SRV 2 Forebody 

Liner Skirt, +45 Degrees 

Temperature SRV 1 Forebody 

Liner, -45 Degrees 

Temperature SRV 2 Forebody 

Liner Skirt, -45 Degrees 

BIF-008- W-C-019841-RI-80 

TABLE 3,8-6 (CONT'D) 

Description 

Similar to IMP 5114, the thermistor is 

mounted on the 5 supply assembly splicer 

mechanism mounting pad. 

A resistor/thermistor voltage divider circuit, with the thermistor mounted inside the 

forebody on the X axis, monitors the SRV 1 

forebody temperature. The output is linear 

from -150F (1.53v) to 300F (5.0v). 

Similar to IMP 5244, monitors SRV 2 

f orebody t • 

mounted ins 

ly -38, +45 

monitors the forebody temperature. 

output is nonlinear from -150F (1.88v) 

to +200F (5.0v). 

Similar to IMP 5246, monitors the SRV 2 

forebody temperature. 

Similar to IMP 5244, the thermistor is 

mounted inside the forebody at approximately 

station -38, -45 degrees. 

Similar to IMP 5246, the thermistor is 

mounted inside the forebody at approximately 

station -38, -45 degrees. 

Power 

+5 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

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5250 

5251 

5252 

5253 

5254 

5255 

5256 

Handle via BYEMAN 

Control System Only 

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- BIF-008- W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Title 

Temperature Skin Fixed Adapter 

Sta 16, +Z 

Temperature Skin FA, 

Sta 16, +Y 

Temperature Skin FA, 

Sta 16, -Z 

Temperature Skin FA, 

Sta 16, -Y 

Temperature Skin SEM, 

Sta 57.5, +Z 

Temperature Skin SEM, 

Sta 63.5, +Y 

Temperature Skin SEM, 

Sta 57.5, -Z 

Description 

A resistor/thermistor voltage divider circuit mounted to the internal side of the 

skin in the fixed adapter (FA) at station 

16, +Z monitors the skin temperature. The 

output is nonlinear from -50F (0.16v) to 

+200F (4.5v). 

Similar to IMP 5250, the thermistor is 

mounted inside the FA skin at station 16, 

+Y. 

Similar to IMP 5250, the thermistor is 

mounted inside the FA skin at station 16, 

-Z. 

Similar to IMP 5250, the thermistor is 

mounted inside the FA skin at station 16, 

-Y. 

A resistor/thermistor voltage divider circuit located near the SEM skin on the surface of a longeron at station 57.5, +Z. The 

output is nonlinear from -50F (0.03v) to 

+400F (4.8v). 

Similar to IMP 5254, the thermistor is 

mounted near the SEM skin at station 63.5, 

+Y. 

Similar to IMP 5254, the thermistor is 

mounted near the SEM skin at station 57.5, 

-Z. 

Power 

+5 vdc 

+5 vdc 

+5 vdc 

+5 vdc 

+5 vdc 

+5 vdc 

+5 vdc 

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5257 

5258 

5259 

5260 

5261 

5262 

5263 

Handle via BYEMAN 

Control Sy stern Only 

BIF-008- W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Title 

Temperature Skin SEM, 

Sta 63.5, -Y 

Temperature Skin EA, 

Sta -9.7, 335 Degrees 

Temperature Skin EA, 

Sta -9.7, 244 Degrees 

Temperature Skin EA, 

Sta -9.7, 117 Degrees 

Temperature SEM Internal, 

+Y Side, CP Mounting Rail 

Temperature SEM Internal, 

+Y Side, PM&C Mounting Rail 

Temperature SEM Internal, 

-Y Side, 5 FPLL Aft 

Mounting Rail 

Description 

Similar to IMP 5254, the thermistor is 

mounted near the SEM skin at station 63,5, 

-Y. 

A resistor/thermistor voltage divider circuit with the thermistor mounted on the inside surface of the ejectable adapter (EA) 

skin at station -9.7, 335 degrees monitors 

the EA temperature. The output is nearly 

linear from O.OF (1.55v) to 700F (4.2v). 

Similar to IMP 5258, the thermistor is 

mounted on the inside surface of the skin at 

station -9.7, 244 degrees. 

Similar to IMP 5258, the thermistor is 

mounted on the inside surface of the skin 

at station -9.7, 117 degrees. 

Power 

+5 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

Similar to IMP 5242, the thermistor is lo- +15 vdc 

cated on the -X side of the command processor (CP) mounting tray. 

Similar to IMP 5242, the thermistor is +15 vdc 

mounted near the lower (-Z) foot of the 

PM&C on the mounting rail attached to the FSE 

+Y wall at station 53. 

Similar to IMP 5242, the thermistor is 

mounted on the lower (-Z) portion of the 5 

frequency phase lock loop electronic 

(FPLLE) aft mounting rail on the FSE -Y 

side at station 52. 

+15 vdc 

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5302 

5303 

5330 

5331 

5375 

Handle via BYEMAN 

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Title 

Temperature SEM Internal, 

-Y Side, IP Mounting Rail 

Temperature SEM Internal, 

RSE/RAM-9 

Temperature SEM Internal, 

Sta 76 

Temperature Telemetry Unit 

Section 1 

Temperature Telemetry Unit 

Section 2 

Differential Temperature, 

Stereo Mirror Lower 

BIF-008- W-C-019841-RI-80 

TABLE 3.8-6 (CONT'D) 

Description 

Similar to IMP 5242, the thermistor is 

mounted near the upper (+Z) foot of the instrumentation processor (IP) mounting rail 

attached to the FSE -Y side at station 45. 

Similar to IMP 5114, the thermistor is located on the 9 supply assembly splicer 

mechanism mounting pad. 

Similar to IMP 5242, the thermistor is located on the SEM aft bulkhead, external to 

the FSE . 

The temperature inside digital telemetry 

unit 1 (DTU 1) is monitored by a thermistor 

located on the power supply board. The output is nonlinear from -20F (5.05v) to +155F 

(0. 7v) 

Similar to IMP 5330, monitors the temperature inside DTU 2. 

Two matched thermistors are mounted in the 

front and back plates of the stereo mirror. 

The two outputs are processed by a differential amplifier in the instrumentation processor, producing a differential temperature signal, 6T (front minus back), ranging 

linearly from -I.OF (0.5v) to +3.0F (4.98v). 

Power 

+15 vdc 

+5 vdc 

+15 vdc 

+15 vdc 

+15 vdc 

±15 vdc 

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Approved for Release: 2017 /02/14 C05097222 

BIF-008-_W-C-019841-RI-80 I 

+Z 

+Z 

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- ----- -- ------ l-' 

Station -9.7 

Ejectable Adapter 

(Looking Aft) 

Station 16.0 

-r--I ---------l-----a---- -

Fixed Adapter 

(Looking Aft) 

Figure 3.8-15. ORM Skin Temperature Instrumentation Points 

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Approved for Release: 2017 /02/14 C05097222 

Han d 1 e v i a BY EM AN 

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+Z 

-Z 

BIF-008 Vehicle 

Coordinates 

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Approved for Release: 2017 /02/14 C05097222 

BIF-008- W-C-019841-RI-80 

__ IMP 5254 

~--Sta 63.5 

Sta 57.5 

IMP 5257 

\ 

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Sta 77.14 

IMP 5256 

Sta 34,5 

Figure 3.8-16. Supply Electronics Module Skin Temperature Instrumentation 

Points 

3 ~ 8- 68 

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BIF-008- W-C-019841-RI-801 

TABLE 3.8-7 

UMBILICAL INSTRUMENTATION SUMMARY 

Title 

Differential Temperature, 

Stereo Mirror Lower 

Temperature Primary 

Mirror 1 ( +Y) 

Temperature, Corrector, 

Camera Spacer 

Temperature, Lens Tube 

Forward, Sta 175, 

279 Degrees 

The output of IMP 5375 (see Table 3.8-6) is 

monitored at the umbilical output. An isolation resistor is placed in series between 

the normal IMP output and the BIL output in 

the instrumentation processor (IP). 

The output of IMP 5150 ee Table 3.8-6) 

monitored at the umbil output. An isolation resistor pl in between 

normal IMP output and the BIL output 

IP. 

output ee Table 3.8-6) 

monitored at output. An isoresistor es 

normal IMP output the BIL output in 

IP. 

The output of IMP 5110 (see Table 3.8-6) is 

monitored at the umbilical output. An isolation resistor placed in series between 

the normal IMP output and the BIL output in 

the IP. 

The output of IMP 5112 (see Table 3.8-6) is 

monitored at the umbilical output. An isolation resistor is placed in series between 

the normal IMP output and the BIL output in 

the IP. 

Power 

±15 vdc 

±15 vdc 

+5 

±15 vdc 

+15 vdc 

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Title 

Temperature Primary 

Mirror 2 (-Y) 

Temperature, Inlet Air 

Temperature Stereo Mirror 

BI F-008- W-C-019841-RI-80 1 

TABLE 3.8-7 (CONT'D) 

Description 

The output of IMP 5145 (see Table 3.8-6) is 

monitored at the umbilical output. An isolation resistor is placed in series between 

the normal IMP output and the BIL output in 

the IP. 

Power 

+15 vdc 

A thermistor located inside the PPS/DP EAC +15 vdc 

near the umbilical conditioned air inlet 

monitors the temperature of the incoming air. 

The thermistor and a resistor in the IP form 

a voltage divider circuit whose output is 

non-linear from 60F (4.4v) to lOOF (2.lv). 

Although powered whenever the instrumentation 

power is on, the output is available only 

through the umbilical line, it is not 

monitored on-orbit. 

The output of IMP 5099 (see Table 3.8-6) is ±15 vdc 

monitored at the umbilical output. An isolation resistor is placed in series between 

the normal IMP output and the BIL output in 

the IP. 

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8.5 Environmental Control Command Summary 

8.5.l 

8.5.2 

8.5.3 

Heater Power On ,. +:.- "J:C/.) 

« :--::-:!J~1} 

_) 

Function: This command provides power to all heater branches, 

including EPSM 1 and. B.~~~ qi,. and;_~t;:P,rtjle::d):.-parkimg 

brake 

Interlocks: 

.. f 

Commanding 5 OP ~· ,S)[F,~,g/,2 ;R\J_NOUT ~ w4..Jil:J}lisa.t>J::e the 

5 parking brake circuit. Removing 5 operational power 

wi,l l, re.p?ve til~:t dts .. ~p_l~:; .if tl\~r5 parking b:r..ake power 

i,!? c;iff; , Othef~,is~, J~~rn, :4Jsable wilJ not be removed 

untii both 5 o:P·and 5 parking brake power are off. 

Heater Power Off Commands 

1 

HEATER BRANCH 1 OFF (N02755jf'NG17!s, 

HEATER BRANCH 2 OFF (N0275l~~c·Ntii7Sf 

H~ATER"BRANCR 4..-0FF (N02V4e: NO:n!46: 

HEATER BRAN6H :;5 ©FF·:. ~N02't~3~-::c Neh V4'.3, 

HI;ATER 3BlμNCH 6-0FF (N02?<4_2·: N9!~~p, - .... ,r~ ior~ ""...-~' ~-~,.t sq ~ :).~'£..B 

N03755) 

N03751) 

N03746) 

N03743) 

N03742) 

These commands\!remO.~-~ower from ·tit~ indicated heater 

branches. '.«: i Jic:I:i. -v·-

Function: 

EPSM On Commands 

~ >:,::q:t t-\~ 

~1-s~qG 

9·.r-t~q2 

·J - • t. 

>2( 

,:_, ! ( 

. <JillSM<tl:i ON (N02~7'471;~ 1'ro'1741;">'.NW:f4 £ 

ERBM; i::ivo:N: (Nm26BSi, ·{'f.01165S.fcNOJ3 ;::s;o:Ht. 'i ~r·ni::::: 

,. ":;· .. ,. 1 :~1e.-·1 l:Q. :~£ ) n './lC C;-_~.Qnfdrrrr1,~~.:: 

Function: These commands proyi<le powe! to the orpital heaters in 

'°'I d_s d :~ I [ i ·: khef'L~ifdica ted 'BRvY~ ~ 1;'1n· SRV1'('1J. EefSM 2 in SRV 2) • •. • .• • i1 _,. ... ' '-~ , .. J,:,. i·-~-r~,~ :1 :;rit' .f.Sf.!Q.t.::T.B":f:)q(' r.--'!,"<-~511 ~).~. {l...,J ::L,t~-:rr· ~- _ ... Oi..f · .• - ~,, 

:A.!3'rf Cmnmmt'$ :2 'LiNq~_aJ:i1 igi~~en: ±1:n1kfi'eV:~.1bG::-i'~n:S '.'P!~or to recovery of 

-sor ~ci .Jo;r · : ' 0I 'Mle£_tass·o~ia'tce€FS'RY,::~if~~e~d~,!1-_g br('tne SRV temperature. 

:)L.2 ·_;_'_j~tJ-:,__ r·· ;~P:: ' ,. ~ far_.·.-:. <::\) c ~L,. 00- -· _; d!- :e·.1._:'.IT 

3. 8-i2 -i~ -.. 

Approved for Release: 2017 /02/14 C05097222 

Han d l e v i a BY EM AN 

Control Sys tern On l y 
Approved for Release: 2017 /02/14 C05097222 

BIF-OOB-_W-C-019841-RI-80 

8.5.4 EPSM Off Commands 

EPSM 1 OFF (N02644, N01644, N03644) 

EPSM 2 OFF (N02745, N01745, N03745) 

Function: These commands remove power from the orbital heaters 

in the indicated SRV (EPSM 1 in SRV l; EPSM 2 in 

SRV 2). 

8. 5. 5 Heater Power On/Off . (M6V WORD) 

M6V002YZ (Bi ts 35-38, and Implicit) 

Function: This command controls the heater branch circuits, the 

DTU states, and the 5 parking brake power. 

Bit No. 

Implicit 

33-1 

33-0 

34-1 

34-0 

35-1 

35-0 

36-1 

36-0 

37-1 

37-0 

38-1 

38-0 

Spare 

DTU 1 ON 

DTU 1 OFF 

DTU.2 ON 

DTU 2 OFF 

Function 

Heater branches 1, 2, 4, 5, and 6, 

and 5 parking brake power ON 

Heater branches 1, 2, 4, 5, and 6, 

and 5 parking brake power OFF .EP.~M 1 ON 

EPSM 1 OFF 

EPSM 2 ON 

EPSM 2 OFF 

Spare 

Spare 

Interlocks: A. DTU 1 and 2 are logically interlocked to preclude 

simultaneous O'neration. Only one DTU should be 

commanded ON at any given time • 

. .. {' 

b. Commanding 5 op ON or 9/5 RUNOUT ON will disable 

the 5 parking .brake circuit. Removing 5 operational 

power will remove the disable, if the 5 parking'brake 

power is off. ,Otherwise, the disable will not be removed until both 5 OP and 5 parking brake power are 

off. 

3. 8- 73 

G 

Approved for Release: 2017 /02/14 C05097222 

Hand l e v i a BY EM AN 

Control System Only 
Approved for Release: 2017 /02/14 C05097222 

Approved for Release: 2017 /02/14 C05097222 

'':Handle vi~ BYEMAH 

Control System On! y