# Patent

## Title
Transparent overlapping LED die layers

## Abstract

A first layer of inorganic first vertical LED dies (VLEDs) of a first color is printed on a conductor surface. A first transparent conductor layer is deposited over the first VLEDs to electrically contact top electrodes of the first VLEDs. An electrically insulated second layer of second VLEDs of a second color is printed over the first transparent conductor layer, and an electrically insulated third layer of third VLEDs of a third color is printed over the first transparent conductor layer. For a color display, the VLEDs are printed in an addressable pixel array. Since the VLEDs are printed as an ink, the overlying VLEDs in a pixel are not vertically aligned, so there is little blockage of light. If the structure is used for general illumination, the VLEDs do not need to be printed in pixel areas.

## Background
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. application Ser. No. 14/150,199, filed Jan. 8, 2014, by Bradley Steven Oraw, which claims priority to U.S. provisional application Ser. No. 61/759,137 filed Jan. 31, 2013 by Bradley Steven Oraw, both assigned to the present assignee and incorporated herein by reference.


FIELD OF THE INVENTION
This invention relates to forming a plurality of overlapping, transparent light emitting diode (LED) layers and, in particular, to a printing method for forming such LED layers using vertical printing of microscopic LED dies.
BACKGROUND
FIG. 1 generally illustrates a prior art technique for forming a wide area light sheet or panel using LEDs. A starting substrate 10 may be Mylar or other type of polymer sheet, or even a metal sheet. A conductor layer 12 is then deposited over the substrate 10, such as by printing. The substrate 10 and/or conductor layer 12 is preferably reflective. A reflective film may also be provided on the front or back surface of the substrate 10.
An LED ink is provided, which comprises microscopic vertical LEDs 14 (e.g., 30 microns in diameter) uniformly infused in a solvent. The LEDs are initially formed as metallized semiconductor layers on a carrier wafer. Trenches are photolithographically etched through the semiconductors layers and the metal layers to define the boundaries of each LED. The back surface of the carrier wafer is then thinned until the individual LEDs are separated. The LEDs are then dispersed in the solvent to create the ink.
The LED ink is screen printed over the conductor layer 12. The orientation of the LEDs can be controlled by providing a relatively tall top electrode 16 (e.g., the anode electrode), so that the top electrode 16 orients upward by taking the fluid path of least resistance through the solvent after printing. The LED ink is heated to evaporate the solvent, and the bottom cathode electrode 18 and conductor layer 12 are annealed to create an ohmic cathode connection.
A dielectric 19 is deposited and etched to expose the top electrode 16.
A transparent conductor layer 20 is then printed to contact the top electrodes 16.
Metal bus bars 22 and 24 are then printed and cured to electrically contact the conductor layers 12 and 20 along their edges. A suitable voltage differential applied to the bus bars 22/24 turns on the LEDs 14. Although the microscopic LEDs 14 are randomly distributed, they are fairly uniformly distributed over the area of the flat sheet due to the large number of LEDs printed. There may be millions of LEDs 14 printed on a one square meter substrate 10. The fabrication process may be performed under atmospheric conditions.
The LEDs 14 in the monolayer, within a defined area, are connected in parallel by the conductor layers 12/20 since the LEDs 14 have the same orientation. If many LEDs 14 are connected in parallel, the driving voltage must approximately equal the voltage drop of a single LED 14 and the current is relatively high. The high current flowing laterally through at least the thin transparent conductor layer 20 creates a significant IR drop, since typical transparent conductors may have a conductivity of 1 ohm/square. This results in power loss and heat, lowering the efficiency of the lamp. Making the transparent conductor layer 20 thicker adds cost and increases the light absorption by the layer 20.
Further detail of forming such a light source by printing microscopic vertical LEDs, and controlling their orientation on a substrate, can be found in US application publication US 2012/0164796, entitled, Method of Manufacturing a Printable Composition of Liquid or Gel Suspension of Diodes, assigned to the present assignee and incorporated herein by reference.
It is common to connect discrete LEDs in series by using printed circuit boards and other techniques. By connecting LEDs in series, the driving voltage increases and the driving current is lowered. However, such electrical interconnections are impractical for printed LEDs, since the LEDs are randomly positioned and microscopic. Further, using lateral conductors to connect a layer of LEDs in series uses significant substrate area, creating noticeable dark areas between the LEDs and lowering the brightness-to-area ratio of the lamp.
What is needed is a practical and cost-effective technique for connecting printed LEDs in series while still obtaining a high density of LEDs for a good brightness-to-area ratio.
What is also needed are techniques that make use of the transparency of the LED die layers to create other types of LED devices, such as color displays.
SUMMARY
In one embodiment, microscopic LEDs are infused in a solvent to form an LED ink for printing, such as screen printing. The LEDs are vertical LEDs, with one electrode (e.g., an anode) on top and the other electrode (e.g., a cathode) on the bottom.
A substrate is provided with a first conductor layer. The LEDs are printed, as a monolayer, on the conductor layer, with their anode electrodes orientated up, and the bottom cathode electrodes are annealed to make ohmic contact to the first conductor layer.
A dielectric is deposited over the LEDs, followed by a transparent second conductor layer, which makes ohmic contact with all of the top anode electrodes. Therefore, this first layer of LEDs is connected in parallel by the first and second conductor layers.
Over the second conductor layer is printed a second monolayer of LEDs, which may be identical to the first layer of LEDs. A dielectric is deposited over the second layer of LEDs, and a transparent third conductor layer is deposited, which makes ohmic contact to the anode electrodes of the second layer of LEDs. Therefore, the second layer of LEDs is connected in parallel by the second conductor layer and the third conductor layer.
The first layer of LEDs is connected in series with the second layer of LEDs, since the anode electrodes of the first layer of LEDs are connected to the cathode electrodes of the second layer of LEDs via the second conductor layer. Since the LEDs are randomly arranged in each layer (i.e., not vertically aligned), the light from the LEDs in the first layer will typically have a direct path through the overlying dielectric layer and transparent conductor layers.
The transparent second conductor layer may be made very thin since, most of the current through the second conductor layer flows vertically and only slightly laterally until it is conducted by an LED in the second LED layer. Therefore, there is little light attenuation by the second conductor layer and very little power loss.
Metal bus bars are printed along opposite edges of all the conductor layers for good current distribution across the conductor layers. Thin metal runners may be printed between the bus bars to improve the current distribution for large area light sheets.
A driving voltage is coupled between the first conductor layer and the third conductor layer to turn on all the LEDs with the proper orientation. Since the LEDs are in series, the current conducted by the conductor layers is one half of the current which would have been conducted had all the LEDs been connected in parallel.
Additional LED layers may be printed to connect additional LEDs in series and further lower the current.
By lowering the current through the conductors, the conductors have a lower IR drop and/or may be made thinner.
Additionally, since the overall density of the series-connected LEDs is greater than the density of lateral-connected LEDs (since the series-connected LED layers overlap), the brightness-to-area ratio is greatly increased.
In another embodiment, a dielectric layer may be inserted over the transparent second conductor layer, and another transparent conductor layer may be printed over the dielectric layer for contacting the bottom cathode electrodes of the second layer of LEDs. This allows completely independent control over the driving of the first layer of LEDs and the second layer of LEDs. This also provides the option of externally connecting the LEDs in series.
By independently driving the layers of LEDs, the LEDs may be different types and colors, and the overall combined color may be dynamically controlled. Therefore, full color pixels may be formed by overlapping small areas of red, green, and blue LEDs, or phosphor-converted LEDs, where the RGB LED dies in each pixel are addressable to control pixel color. In this way, a very large, roll-up flexible color display can be formed by printing.
A phosphor or quantum dot layer may be added to wavelength-convert some of the LED light to generate any color.
The light sheet may be fabricated using a conveyor system at atmospheric pressures.
Other embodiments are described.



BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a simplified cross-section of a prior art light sheet with an array of vertical LEDs sandwiched between two conductor layers to connect the LEDs in parallel.
FIG. 2 is a simplified cross-section of a light sheet in accordance with one embodiment of the invention during fabrication.
FIG. 3 illustrates the light sheet of FIG. 2 after additional fabrication steps to form two layers of LEDs in series.
FIG. 4 is a top down view of only the top layer of LEDs in FIG. 3, where FIG. 3 is taken along line 3-3 in FIG. 4.
FIG. 5 illustrates a current path through two LEDs in series and also illustrates light rays emitted from the top surfaces of two LEDs.
FIG. 6 illustrates another embodiment of the invention using two voltage/current sources to drive the respective LED layers for independent control of the two layers.
FIG. 7 illustrates another embodiment of the invention where there is a dielectric layer between the two middle conductor layers to enable a variety of electrical connections between the two LED layers.
FIG. 8 illustrates how the embodiments may be inexpensively and quickly fabricated using a conveyor system at atmospheric pressures.
FIG. 9 is a cross-section of a small portion of a color display, or color-adjustable lamp, where transparent layers of red, green, and blue LED dies, or phosphor-converted LED dies, overlap, and where, for a color display, the LED dies are printed in pixel locations such that various pixel colors are achievable.
FIG. 10 is a front view of a portion of a color display showing RGB pixels.



Elements that are similar or identical in the various figures are labeled with the same numeral.
DETAILED DESCRIPTION
The GaN-based micro-LEDs used in embodiments of the present invention are less than a third the diameter of human hair, rendering them essentially invisible to the naked eye when the LEDs are sparsely spread across a substrate to be illuminated. The number of micro-LED devices per unit area may be freely adjusted when applying the micro-LEDs to the substrate. A well dispersed random distribution across the surface can produce nearly any desirable surface brightness. Lamps well in excess of 10,000 cd/m2 have been demonstrated by the assignee. The LEDs may be infused in a solvent and printed as an ink using screen printing or other forms of printing, and the orientations of the LEDs on the substrate are controllable by, for example, the shape of the top electrode. A tall electrode causes the tall electrode to be the top electrode about 90% of the time. Further detail of forming a light source by printing a monolayer of microscopic vertical LEDs, controlling their orientation on a substrate, and connecting them in parallel can be found in US application publication US 2012/0164796, entitled, Method of Manufacturing a Printable Composition of Liquid or Gel Suspension of Diodes, assigned to the present assignee and incorporated herein by reference.
In contrast to the prior art FIG. 1, the present invention forms any number of printed LEDs in series by printing overlapping layers of LEDs to reduce the current through the conductor layers and increase the density of LEDs to increase the brightness-to-area ratio.
FIG. 2 illustrates one embodiment of an inventive light sheet (or panel) during fabrication.
In one embodiment, an LED wafer, containing many thousands of vertical LEDs, is fabricated so that the metal anode electrode 16 for each LED 14 has a small footprint to allow light to escape the anode side, and the metal cathode electrode 18 for each LED 14 forms a bottom reflector for each LED 14. The anode and cathode surfaces may be opposite to those shown. The top surface of the LEDs 14 may be roughened by etching to increase light extraction (i.e., decrease internal reflections).
The LEDs 14 are completely formed on the wafer, including the anode and cathode metallizations, by using one or more carrier wafers during the processing and removing the growth substrate to gain access to both LED surfaces for metallization. After the LEDs are formed on the wafer, trenches are photolithographically defined and etched in the front surface of the wafer around each LED, to a depth equal to the bottom electrode, so that each LED has a diameter of about 30 microns and a thickness of about 6 microns. A preferred shape of each LED is hexagonal. The back surface of the wafer is then thinned until the LEDs are singulated. The LEDs 14 of FIG. 2 result. The microscopic LEDs 14 are then uniformly infused in a solvent to form an LED ink for printing, such as screen printing.
Many other ways can be used to form the LEDs 14, and the LEDs 14 do not need to be microscopic or printed for the present invention to apply.
If it is desired for the anode electrodes 16 to be oriented in a direction opposite to the substrate 10 after printing, the electrodes 16 are made tall so that the LEDs are rotated in the solvent, by fluid pressure, as they settle on the substrate surface. The LEDs rotate to an orientation of least resistance. Over 90% like orientation has been achieved, although satisfactory performance may be achieved with over 75% of the LEDs being in the same orientation.
The starting substrate 10 is preferably as thin as practical for ease of handling, low weight, and low cost, and provides suitable mechanical strength to the light sheet. The substrate 10 may be a suitable polymer, such as Mylar or PMMA, and may be dispensed from a roll. The substrate 10 can be any size, such as one square meter across, since no vacuum processing is needed for fabrication, and the process may be performed using a conveyor system. In one embodiment, the bottom surface of the substrate 10 has a thin reflective metal film deposited on it.
On top of the substrate 10 is deposited a conductor layer 12, such as a metal layer formed of copper, aluminum, or an alloy. The conductor layer 12 is preferably reflective to visible light.
The LEDs 14 are then printed on the conductor layer 12 such as by screen printing with a suitable mesh to allow the LEDs to pass through and control the thickness of the layer. The LEDs 14 will be printed as a monolayer and be fairly uniformly distributed over the substrate 10. Any other suitable deposition process may be used. In the example of FIG. 2, the LEDs 14 are oriented so that the anode electrodes 16 are the top electrodes.
The LED ink solvent is then evaporated by heat, such as using lamps. The LEDs 14 are then annealed in an optical furnace, also using lamps, to rapidly heat the electrodes to form an ohmic connection between the bottom cathode electrodes 18 and the conductor layer 12. Millions of LEDs 14 may be deposited in the single layer.
A transparent dielectric layer 19 is then printed over the entire surface to encapsulate the LEDs 14 and secure them in position. The top surface of the dielectric layer 19 is then blanket etched, such as by a wet etching or mechanical etching, to expose the top anode electrodes 16.
A transparent conductor layer 20 is then printed over the dielectric layer 19 to electrically contact the electrodes 16. The conductor layer 20 may be ITO or may include silver nanowires. The electrodes 16 may be annealed in an optical furnace to create good ohmic contact to the conductor layer 20.
As shown in FIG. 3, another transparent conductor layer 32 is printed over the conductor layer 20.
The LED ink is then again printed over the conductor layer 32 to form a second layer of LEDs 14, which may be identical to the LEDs 14 in the first layer or different. In one embodiment, all the LEDs 14 are the same and emit blue light. A phosphor layer, to be later deposited, is used to cause the light sheet to emit white light or any other color.
In another embodiment, the conductor layers 20 and 32 are formed as a single layer, and the electrodes in the first and second layers of LEDs 14 are annealed in a single step to make ohmic contact to both sides of the conductor layer.
The following steps may be identical to those described with respect to FIG. 2. The LED ink solvent is then evaporated by heat, such as using lamps. The LEDs 14 in the second layer are then annealed in an optical furnace to rapidly heat the electrodes to form an ohmic connection between the bottom cathode electrodes 18 and the conductor layer 32.
A transparent dielectric layer 34 is then printed over the entire surface to encapsulate the LEDs 14 and secure them in position. The top surface of the dielectric layer 34 is then blanket etched, such as by a wet etching or mechanical etching, to expose the top anode electrodes 16.
A transparent conductor layer 36 is then printed over the dielectric layer 34 to electrically contact the electrodes 16. The conductor layer 36 may be ITO or may include silver nanowires. The electrodes 16 may be annealed in an optical furnace to create good ohmic contact to the conductor layer 36.
The LEDs 14 in each layer are thus connected in parallel, and the two layers of LEDs 14 are connected in series. Additional overlapping layers of LEDs 14 may be printed to add more LEDs in series.
The various layers are printed so that edge areas of the conductor layers 12, 32, and 36 are exposed.
Metal bus bars 40-45 are then screen printed along opposite edges of the conductor layers 12, 32, and 36 for connection to one or more voltage/current sources. The metal is then annealed by an optical furnace. The bus bars will ultimately be connected to a voltage differential for turning on the LEDs 14. The points of connection between the bus bars and the driving voltage leads should be at least on two ends of each bus bar to more uniformly distribute current along the bus bars. The bus bars on opposite edges of a conductor layer are shorted together, either by the printed metal or an external connection.
The bus bars 42 and 43, connected to the middle conductor layer 32, are optional if the two layers of LEDs 14 are to be driven by a single voltage/current source.
FIG. 4 is a top down view of the structure of FIG. 3, where FIG. 3 is taken along line 3-3 in FIG. 4. Only the second layer of LEDs 14 is illustrated for simplicity. The LEDs 14 in the first layer would also be visible in a top down view, since the various layers are transparent and the LEDs 14 in the layers would be offset due to their random positions in the layers.
If the light sheet is wide, there will be a significant IR drop across at least the transparent conductor layer 36. Thin metal runners 46 may be printed along the surface of the conductor layer 36 between the two bus bars 44 and 45 to cause the conductor layer 36 to have a more uniform voltage, resulting in more uniform current spreading.
The resulting structure may be less than 1 mm thick.
FIG. 5 illustrates the structure of FIG. 3 when a driving voltage 48 is applied across the conductor layers 12 and 36 to turn all the LEDs 14 on. The same driving voltage 48 is applied to the opposite edges of the conductor layers 12 and 36 via the bus bars 40, 41, 44, and 45. Current 50 spreads along the bottom conductor layer 12 (which may be metal) and enters the cathode electrodes 18 of each of the LEDs 14. The current flows vertically through each of the LEDs 14 in the first layer, then flows both vertically and slightly laterally through the conductor layers 20 and 32 until conducted by an LED 14 in the second layer of LEDs 14. The conductor layers 20 and 32 may be very thin since the current through them does not flow laterally a significant distance. Further, the conductor layers 20 and 32 may be made more transparent by reducing their conductivity without significant power loss.
The current 50 flows vertically generally through the nearest overlying LEDs 14 and completes the circuit through the top transparent conductor layer 36.
Since the various layers are very thin and transparent, and the conductor layer 12 or the substrate 10 is reflective, there is little light absorption. There is also less IR loss since the current supplied to the conductor layers 12 and 36 is one-half that supplied to the conductor layers 12 and 20 in FIG. 1.
Since the two layers of LEDs 14 in FIG. 5 have twice the density as the single layer of LEDs 14 in FIG. 1, the brightness-to-area ratio is doubled. FIG. 5 illustrates light rays 52 and 54 being emitted from two LEDs 14. Since the LEDs 14 are extremely small and randomly positioned (not vertically aligned), the LEDs 14 in the second layer will typically not directly overlie the LEDs 14 in the first layer. Hence, a majority of light exiting the LEDs in the first layer is not blocked by the LEDs in the second layer. Further, since the bottom electrodes 18 of the LEDs are reflective, any impinging light is reflected and ultimately exits the light sheet. The relative size of the LEDs 14 in FIG. 5 is greatly exaggerated, and the spacings of the LEDs 14 are greatly compressed for ease of illustration.
FIG. 6 illustrates how the driving voltages for the two layers of LEDs 14 can be independent by coupling one voltage V1 between the conductor layers 12 and 32, and coupling another voltage V2 between the conductor layers 32 and 36. This is useful when the LEDs 14 in the different layers are different types of LEDs 14 or it is desired to make one layer of LEDs 14 brighter than the other layer. The current 55 is shown flowing through the series LEDs 14 and to the voltage/current supplies.
FIG. 6 also shows the use of a printed phosphor layer 56 over the top surface of the conductor layer 36. The phosphor layer 56 passes some of the blue LED light and converts a portion of the LED light to another wavelength, such as yellow (shown as light ray 58). The combination of the light may be white or other color. Other wavelength-converting layers may be used, such as a quantum dot layer.
FIG. 7 illustrates the use of an additional transparent dielectric layer 58 between the conductor layers 32 and 20. Metal bus bars 60 and 61 are formed on the edges of the conductor layer 20. The dielectric layer 58 electrically insulates the two layers of LEDs 14 to create a 4-terminal light sheet. The two layers of LEDs 14 are show driven by the voltages V1 and V2. The layers of LEDs 14 may be connected in series by an external connection, shorting the conductor layer 20 to the conductor layer 32. The configuration of FIG. 7 may be useful if the LEDs 14 in each layer are different types of LEDs, requiring different driving voltages and currents to produce the desired brightness.
In all the embodiments, a single light sheet may be formed by multiple areas of LEDs tiled on a single substrate, where each separate area of LEDs comprises LEDs electrically connected in parallel and series by the various conductor layers. As an example, one strip of LEDs may be electrically isolated from an adjacent strip as a result of the pattern used during the screen printing of the LEDs and conductor layers. In this way, the separate strips may be connected together in series and/or parallel, or isolated, by metal patterns on the light sheet to achieve the desired electrical characteristics of the light sheet. Dividing the LEDs into areas also reduces the required current for each conductor layer and improves reliability in the event of a short or open circuit. Each strip may be a centimeter wide or less and contain thousands of LEDs. By enabling driving the strips with different voltages, different types of LEDs (having different forward voltages) may be used in adjacent strips to combine the different colors from the strips. In one embodiment, red, green, and blue LEDs are in adjacent narrow strips to create white light without a phosphor.
A single light sheet may be more than a meter across and any length. Each of the figures may represent a single strip or area in a larger light sheet or may represent the entire light sheet. The various metal bus bars may be interconnected in any manner.
The substrate 10 may be provided with a release layer to allow the remaining layers to be removed from the substrate 10, creating a more efficient light sheet having a thickness of only 20-80 microns. Such a light sheet is extremely flexible and may be adhered to another type of substrate, including a fabric for clothing.
The light sheets can be used for general illumination, displays, backlights, indicator lights, etc.
Since all the layers may be printed and heated using lamps, the light sheet may be manufactured using a conveyor system at atmospheric pressures, as shown in FIG. 8. FIG. 8 illustrates the substrate 10 being dispensed from a roll 64. The substrate 10 is moved under various process stations to print layers, heat/cure/anneal the layers, and etch the layers, as described above. Shown in FIG. 8 are a transparent conductor printing station 70, an LED ink printing station 72, a metal printing station 74, an optical cure/anneal station 76, and a wet or dry etching station 78.
FIG. 9 illustrates a variation in the structure of FIG. 7, where each transparent layer of the printed microscopic inorganic vertical LED dies (VLEDs) may be controlled independently, and there are three layers of red, green, and blue LED dies. In another embodiment, the LED dies may all be GaN-based and emit blue light from their active layer, but red and green phosphors are used to create the red and green colors.
FIG. 9 is a cross-section of a small portion of a color display showing only two pixels in a 2-D array of pixels.
Over a flexible conductor layer 80 on a substrate 10, such as the substrate 10 in FIG. 7, microscopic red LED dies 82 (or blue LED dies with a red phosphor) are printed in small pixel areas 84, such as shown by the pixel areas 84 of the color display 85 of FIG. 10. As previously described, the bottom electrodes of the red LED dies 82 contact the conductor layer 80. A transparent dielectric layer 86 fills the area between the red LED dies 82. A transparent conductor layer 88 is then deposited over the red LED dies 82 to connect each of the red LED dies 82 in a pixel area 84 in parallel. The size of the pixel area 84, and the number of LED dies in each pixel area 84, will depend on the total size of the color display and the pixel resolution. For example, each pixel area 84 may, on average, contain 2-10 LED dies. The exact number of LED dies per pixel area 84 will be essentially random as a result of the printing process but, since the red LED dies 82 are uniformly distributed in the LED ink, there should be only a small range of LED dies within each pixel area 84.
A transparent dielectric layer 89 is then deposited to insulate the top of the conductor layer 88.
A similar process is then performed to deposit a transparent conductor layer 90, green LED dies 92, transparent dielectric layer 93 between the green LED dies 92, and a top conductor layer 94 for the green LED die layer. This is followed by a similar process to form the blue LED die layer comprising a transparent dielectric layer 96, a transparent conductor layer 98, blue LED dies 100, a transparent dielectric layer 101 between the blue LED dies, and a top transparent conductor layer 102.
Since the LED dies have an opaque reflective bottom electrode, there is little downward light emitted from the LED dies. The dielectric layers may be formed of a resilient material so there will be no delamination between layers if the resulting display is rolled up.
The conductor layers 80, 90, and 98 may form Y conductor strips (going into and out of the drawing sheet) to “vertically” address any pixel color in any pixel, and the conductor layers 88, 94, and 102 may form orthogonal X conductor strips to “horizontally” address any pixel color in any pixel. The pixel color at the intersection of energized X and Y conductor strips is addressable to independently control the overall color emitted by each pixel 84. The addressing of a particular color within a pixel can be considered a Z address.
The various Y conductor strips for each pixel are electrically isolated in the “horizontal” direction from the other Y conductor strips, and the various X conductor strips for each pixel are electrically isolated in the “vertical” direction from the other X conductor strips so that the RGB LED dies in each pixel can be independently controlled. This may be done by screen printing the conductor layers, where the screen has the desired pixel pattern, or the conductor layers may be cut (ablated) using a laser.
Since the LED dies are printed in a non-deterministic pattern in each pixel area 84, the LED dies will not directly overlap each other in the vertical direction, so that emitted light is not blocked. Any amount of expected blockage by overlapping LED dies can be compensated for when energizing the LED dies of the various colors to achieve the desired combined pixel color.
Relatively small tiles of pixel arrays may be connected together to form a color display of any size.
FIG. 9 shows a red light ray 106, a green light ray 107, and a blue light ray 108 being emitted by the three layers of LED dies in the leftmost pixel area 84. The LED dies in each layer may be energized simultaneously or energized using time division multiplexing (TDM). Pulse width modulation (PWM) at a frequency above 30 Hz, to avoid perceptible flicker, may be used to create the desired perceived brightness of each pixel color, which enables the LED dies to be driven at the optimal current. Accordingly, both TWM and PWM may be used to achieve the desired pixel color with no flicker.
FIG. 7 illustrates further details of only two of the RGB LED layers, where the conductor layers of each color in a pixel terminate in metal traces (the bus bars 40, 42, 44, and 60) that act as the X and Y addressing lines. The metal bus bars may be opaque, such as plated copper, since they run between the pixels. An opaque layer between the pixels may be printed to reduce cross-talk.
FIG. 9 also illustrates a suitable addressing circuit 110 that applies a current through the LED dies in each addressed pixel to create a desired image. There is independent drive control of each color in each pixel. Many types of addressing schemes may be used, such as a rapid scanning of the pixels.
A controller 112 may be used to control the addressing circuit 110 using buffered image codes that convey the brightness of each pixel color in each frame.
In another embodiment, the controllable RGB LEDs may serve as a controllable backlight for a liquid crystal display (LCD), where a backlight pixel is energized at the same time that an associated LCD pixel (acting like a light shutter) is activated to pass selected components of the RGB light to output a desired color for that pixel. The LCD pixels that are “closed” will have a non-energized backlight pixel behind it. If the LCD uses a scanning sequence to activate its pixels, the backlight uses the same scanning sequence to activate its pixels. In this way, a large amount of power is conserved by not energizing the entire backlight all the time. Additionally, by not energizing all the backlight pixels at the same time, darker “blacks” can be displayed.
In another embodiment, pixels are not formed and the RGB LED layers are independently controlled to produce a desired overall color temperature for general illumination or backlighting.
The individual LED dies are less than 200 microns in diameter and preferably about 30 microns or less in diameter. In a large rectangular display of about five meters wide, there may be 1000 pixels in the horizontal direction. Each pixel is therefore about 5 mm per side, for an area of 25 mm2 per pixel. If each LED die in a pixel in a single layer has an area of about 0.1 mm2, and there are about five LED dies in each pixel in a single layer, only about 2% of the area in each pixel in a single layer will consist of LED dies. Therefore, there will be very little blockage of light by overlapping LED dies. Since each pixel may consist of 15 or more LED dies, high pixel brightness can be obtained for outside daytime viewing.
The pixels in the array of pixels are considered substantially identical even though there may be a small range of variation in the numbers of each type of LED die in each pixel as an inherent result of the printing process. If desired, the resulting display can be tested to determine the differences between the pixels, and compensation factors can be applied to each pixel color to compensate for the different numbers of VLEDs in each pixel color. These compensation factors may be applied to the currents for the pixels or to the PWM of the pixel color. Since the overlapping LED light sheets can be bent, any shape display or lamp may be formed. The three LED layers may be less than 1 mm thick.
In one embodiment, the LED dies are printed upside down from the orientation shown in FIG. 7 or FIG. 9, so the light is emitted through the transparent substrate 10, such as a clear PET film. In that way, the LED layers are protected by the substrate 10.
The order of colors in the various layers may be varied for optimal performance.
The entire color display may be printed using the roll-to-roll process depicted in FIG. 8 under atmospheric conditions.
While particular embodiments of the present invention have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from this invention in its broader aspects and, therefore, the appended claims are to encompass within their scope all such changes and modifications as fall within the true spirit and scope of this invention.

## Claims

1. An illumination structure comprising:
a first conductor surface;
a first layer of inorganic first vertical light emitting diode dies (VLEDs) distributed on the first conductor surface with spaces between the first VLEDs, the first VLEDs having a bottom electrode electrically contacting the first conductor surface;
a light-transmissive first dielectric layer laterally between the first VLEDs;
a first transparent conductor layer overlying the first VLEDs and first dielectric layer, the first VLEDs having a top electrode electrically contacting the first transparent conductor layer;
a transparent second dielectric layer overlying the first transparent conductor layer;
a second transparent conductor layer overlying the second dielectric layer;
a second layer of inorganic second VLEDs distributed on the second transparent conductor layer with spaces between the second VLEDs, the second VLEDs having a bottom electrode electrically contacting the second transparent conductor layer, the second layer of second VLEDs overlying the first layer of first VLEDs;
a light-transmissive third dielectric layer laterally between the second VLEDs; and
a third transparent conductor layer overlying the second VLEDs and third dielectric layer, the second VLEDs having a top electrode electrically contacting the third transparent conductor layer,
wherein the first VLEDs are connected in parallel by the first conductor surface and the first transparent conductor layer,
wherein the second VLEDs are connected in parallel by the second transparent conductor layer and the third transparent conductor layer, and
wherein the first VLEDs and the second VLEDs are not vertically aligned to reduce any blockage of light.

2. The structure of claim 1 wherein the first VLEDs and the second VLEDs are microscopic VLEDs randomly distributed over the first conductor surface and the second transparent conductor layer.

3. The structure of claim 1 wherein the first conductor surface is provided on a flexible substrate.

4. The structure of claim 1 wherein the third transparent conductor layer is provided on a flexible substrate and light emitted by the first VLEDs and the second VLEDs exits the substrate.

5. The structure of claim 1 wherein the first conductor surface is transparent and light emitted by the first VLEDs and the second VLEDs exits the first conductor surface.

6. The structure of claim 1 wherein the first VLEDs and the second VLEDs are formed in a single pixel in a display in an array of pixels.

7. The structure of claim 1 further comprising:
a transparent fourth dielectric layer overlying the third transparent conductor layer;
a fourth transparent conductor layer overlying the fourth dielectric layer;
a third layer of inorganic third VLEDs distributed on the fourth transparent conductor layer with spaces between the third VLEDs, the third VLEDs having a bottom electrode electrically contacting the fourth transparent conductor layer, the third layer of third VLEDs overlying the second layer of second VLEDs;
a light-transmissive fifth dielectric layer laterally between the third VLEDs; and
a fifth transparent conductor layer overlying the third VLEDs and fifth dielectric layer, the third VLEDs having a top electrode electrically contacting the fifth transparent conductor layer,
wherein the third VLEDs are connected in parallel by the fourth transparent conductor layer and the fifth transparent conductor layer, and
wherein the first VLEDs, the second VLEDs, and the third VLEDs are not vertically aligned.

8. The structure of claim 7 wherein the first VLEDs, the second VLEDs, and the third VLEDs are formed in a single pixel in a display in an array of substantially identical pixels.

9. The structure of claim 8 wherein the first VLEDs emit a first color, the second VLEDs emit a second color, and the third VLEDs emit a third color, wherein the first VLEDs, the second VLEDs, and the third VLEDs are controlled to produce an overall color output for the pixel.

10. The structure of claim 8 wherein the number of LED dies in each pixel varies due to the LED dies in each pixel being printed by an LED ink.

11. The structure of claim 8 wherein the first VLEDs are printed using a first LED ink, the second VLEDs are printed using a second LED ink, and the third VLEDs are printed using a third LED ink, wherein the first VLEDs, the second VLEDs, and the third VLEDs are randomly distributed laterally in the pixel.

12. The structure of claim 8 further comprising an addressing circuit for controlling an overall color of each pixel in the array of pixels.