Exhibit 4.50

ASSIGNMENT AGREEMENT

This Assignment Agreement (the Agreement) is made and entered into
as of April 12, 2007 by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of the Republic of China (the ROC) and having its principal office of business located at No. 1, R&D Rd. 1, Science Park,
Hsinchu, Taiwan, ROC (the Assignor) and ChipMOS TECHNOLOGIES (Bermuda) LTD., a company organized under the laws of Bermuda and having its principal office of business located at 11F., No. 3, Lane 91, Dongmei Rd., Hsinchu, Taiwan, ROC
(the Assignee).

WHEREAS, Assignor has full title to, ownership of and interest in the Assigned Patents as defined
below and Assignor has desired to assign and transfer to Assignee and Assignee has desired to acquire from Assignor fifty percent (50%) of the title to, ownership of and interest in the Assigned Patents; and

WHEREAS, in response to the desire of Assignor and Assignee to jointly own the Assigned Patents, Assignor and Assignee have jointly acted as the
co-applicants of the Assigned Patents and wish to enter into certain formal agreement for assignment of fifty percent (50%) of the title to, ownership of and interest in Assigned Patents.

NOW THEREFORE, for good and valuable consideration the receipt of which is hereby acknowledged, the Assignor and the Assignee hereby agree as follows:



|1. | 1. Assigned Patents shall mean the issued patents and patent applications listed on Schedule 1, including, but not limited to, (i) all know-how, trade secrets,
discoveries, concepts, ideas, technologies, whether patentable or not, including processes, methods, formulas and techniques related to the foregoing, any and all written, unpatented technical or scientific information developed or acquired by
Assignor, including laboratory and clinical notebooks, research data, research memoranda, computer software (including source code), computer records, scientists notes, consultant reports, research reports from third parties, abandoned patent
applications, invention disclosures, patentability reports and searches, patent and literature references, and the like developed or acquired before the date hereof related to such patents and patent applications; (ii) any and all copyrights,
copyright registrations and copyrightable subject matter owned or controlled by Assignor related to such patents and patent applications; and (iii) any trademarks related to such patents or patent applications.
|-- | -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



|2. | For good and valuable consideration Assignor hereby assigns to Assignee 50% of the right, title and interest in (i) the inventions disclosed in any patent or application listed
on Schedule 1, (ii) the Assigned Patents, (iii) any patent which may issue from any application listed on Schedule 1, and (iv) all divisions, continuations, reissues, re-examinations and extensions of the patents and applications
listed on Schedule 1.
|-- | --------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



|3. | The Assignor represents and warrants that it has the full and unencumbered right to sell and assign the interest herein sold and assigned and that the Assignor has not executed and
will not execute any document or instrument in conflict herewith.
|-- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



|4. | The Assignee hereby agrees and covenants to pay to the Assignor on the date to be further determined by the parties the aggregate purchase price of the Assigned Patents of
US$6,400,000 in immediately available funds by wire transfer to a bank account or accounts designated by the Assignor.
|-- | --------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



---

|5. | The Assignor covenants and agrees that at any time upon request of the Assignee, the Assignor shall communicate to the Assignee or assigns all information known relating to said
Assigned Patents and that the Assignor shall execute and deliver any papers and perform all other lawful acts deemed necessary or desirable by the Assignee to perfect title to the Assigned Patents.
|-- | ---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



|6. | The Assignor hereby grants to the Assignee the power to insert in this assignment any further identification that may be necessary or desirable to comply with the rules of any
patent office of any country for recordation of this assignment.
|-- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



|7. | This Agreement constitutes the entire agreement between the parties with respect to the assignment by the Assignor of the Assigned Patents to the Assignee, and supersedes all prior
agreements and understandings, oral or written, with respect to such matters.
|-- | ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------



|8. | This Agreement shall be governed by and construed in accordance with the laws of ROC. In the event of any dispute arising from or in connection with this Agreement, both parties
agree that the Taiwan Hsinchu District Court shall be the court of jurisdiction in the first instance.
|-- | ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------

IN WITNESS WHEREOF, the parties
hereto have executed this Agreement as of the date first written above.



|                                    |  |                    |  | 
|----------------------------------- |  | ------------------ |  | 
|ChipMOS TECHNOLOGIES INC.           |  |                   
|                                    |  |                   
|By:                                 |  | /s/ R.B. Tsai      |  | 
|Name:                               |  | R.B. Tsai          |  | 
|                                    | 
|ChipMOS TECHNOLOGIES (Bermuda) LTD. |  |                   
|                                    |  |                   
|By:                                 |  | /s/ Shih-Jye Cheng |  | 
|Name:                               |  | Shih-Jye Cheng     |  | 



---

Schedule 1

The Assigned Patents include the following technologies, systems associated to the implementation of the technologies, and patents and patent applications:

Technology:



|1. | Package & Leadframe design
|-- | --------------------------



|2. | Rigid & Flex substrate design
|-- | -----------------------------



|3. | Package assembly technology
|-- | ---------------------------

-small tool/mold chassis
design



|4. | Testing technology
|-- | ------------------

-burn-in board design

-hi-fix/change kit/small tool design



|5. | Test program development
|-- | ------------------------

System:



|1. | Quality system
|-- | --------------



|2. | Logistic system
|-- | ---------------



|3. | Financial system.
|-- | -----------------



|4. | ITM system
|-- | ----------



| | 4.1 | Lotus Notes system application (OA, Work flow, DCC)
| | --- | ---------------------------------------------------



| | 4.2 | Business management system application
| | --- | --------------------------------------



| | 4.3 | Personal data and payroll system of testing
| | --- | -------------------------------------------



| | 4.4 | Manufacture execution system of testing
| | --- | ---------------------------------------



| | 4.5 | Manufacture automation system of package assembly
| | --- | -------------------------------------------------



| | 4.6 | Production automation system of package assembly
| | --- | ------------------------------------------------



| | 4.7 | Test program management
| | --- | -----------------------



| | 4.8 | System hardware
| | --- | ---------------



| | 4.9 | System software
| | --- | ---------------



| | 4.10 | System/data maintenance & support
| | ---- | ---------------------------------



---

| |  |                                  |  |  |  |  |  | 
| |  | -------------------------------- |  |  |  |  |  | 
| |  | Patents and Patent Applications: |  | 



|   |  |                 |  |            |  |                                                                                                     |  |            
|-- |  | --------------- |  | ---------- |  | --------------------------------------------------------------------------------------------------- |  | -----------
|   |  | IPO Filling No. |  | Patent No. |  | Patent Title                                                                                        |  | Patent Area
|1  |  | 02247550.8      |  | 567897     |  | Circuit Board for Preventing Spill of Molding Compound                                              |  | CHINA      
|2  |  | 02251854.1      |  | 572893     |  | TAPE TYPE SEMICONDUCTOR PACKAGE                                                                     |  | CHINA      
|3  |  | 2247461.7       |  | 572341     |  | CHIP-ON-FILM PACKAGE                                                                                |  | CHINA      
|4  |  | 10/227341       |  | 6689638    |  | Substrate on chip packaging process                                                                 |  | USA        
|5  |  | 2247460.9       |  | 569240     |  | SUBSTRATE-ON-CHIP PACKAGE                                                                           |  | CHINA      
|6  |  | 10/327064       |  | 6703075    |  | WAFER HANDLING METHOD FOR MAKING ADHESIVE DIES                                                      |  | USA        
|7  |  | 2130497.1       |  |            |  | WAFER HANDLING METHOD FOR MAKING ADHESIVE DIES                                                      |  | CHINA      
|8  |  | 10/223350       |  | 7005054    |  | Method for manufacturing probes of a probe card                                                     |  | USA        
|9  |  | 93134941        |  | I263291    |  | Chip Carrier Tape having Number Marking of Test Pads                                                |  | TAIWAN     
|10 |  | 91220251        |  | 209955     |  | TCP Package for SDRAM                                                                               |  | TAIWAN     
|11 |  | 91112599        |  | 201917     |  | MEMS METHOD FOR MAKING ANISOTROPIC CONDUCTIVE BOARD                                                 |  | TAIWAN     
|12 |  | 91112600        |  | 178861     |  | ELECTRICAL DEVICE WITH NEEDLE ELECTRODES AND METHOD FOR FORMING THE SAME                            |  | TAIWAN     
|13 |  | 91112597        |  | 179646     |  | METHOD FOR FORMING CONDUCTIVE WIRINGS OF ELASTIC BUMPS                                              |  | TAIWAN     
|14 |  | 91112598        |  | 187943     |  | METHOD FOR MAKING ANISOTROPIC CONDUCTIVE BOARD                                                      |  | TAIWAN     
|15 |  | 91114479        |  | 187956     |  | WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING THE SAME                                  |  | TAIWAN     
|16 |  | 91209907        |  | 208799     |  | PROBE CARD ASSEMBLY WITH EXCHANGEABLE PROBE HEAD                                                    |  | TAIWAN     
|17 |  | 91114480        |  | 189242     |  | WAFER LEVEL BURN-IN BOARD AND METHOD FOR FORMING THE SAME                                           |  | TAIWAN     
|18 |  | 91220696        |  | 223539     |  | Thermal Controlled Oven for Ball Soldering of BGA Package                                           |  | TAIWAN     
|19 |  | 91211466        |  | 224364     |  | ADJUSTABLE PROBE HEAD ASSEMBLY                                                                      |  | TAIWAN     
|20 |  | 91211337        |  | 207137     |  | DUAL-CHIP STACK STRUCTURE WITH BONDING WIRES AND BUMPS                                              |  | TAIWAN     
|21 |  | 91211338        |  | 206963     |  | DUAL FLIP-CHIP CROSS STACK STRUCTURE                                                                |  | TAIWAN     
|22 |  | 91211339        |  | 209359     |  | PROBE CARD ASSEMBLY WITH CROSS STACKING SILICON SUBSTRATES                                          |  | TAIWAN     
|23 |  | 91116680        |  | 192822     |  | TOUCHING-TYPE ELECTRICALLY CONNECTING DEVICE FOR A PROBE CARD                                       |  | TAIWAN     
|24 |  | 91211467        |  | 223809     |  | FLAT MODULAR PROBE CARD                                                                             |  | TAIWAN     
|25 |  | 10/198118       |  | 6621710    |  | MODULAR PROBE CARD ASSEMBLY                                                                         |  | USA        
|26 |  | 91210951        |  | 207135     |  | FLEXIBLE PRINTED CIRCUIT FOR REPLACING BONDING WIRES                                                |  | TAIWAN     
|27 |  | 91210949        |  | 209354     |  | PROBE CARD ASSEMBLY WITH MULTI SILICON SUBSTRATES                                                   |  | TAIWAN     
|28 |  | 91210950        |  | 206179     |  | PROBE CARD ASSEMBLY FOR PROBING A WAFER                                                             |  | TAIWAN     
|29 |  | 91210948        |  | 209353     |  | PROBE CARD ASSEMBLY                                                                                 |  | TAIWAN     
|30 |  | 10/223297       |  | 6686615    |  | FLIP-CHIP TYPE SEMICONDUCTOR DEVICE FOR REDUCING SIGNAL SKEW                                        |  | USA        
|31 |  | 91118605        |  | 197568     |  | PROBE HEAD AND METHOD FOR FORMING PROBE NEEDLES ON THE PROBE HEAD                                   |  | TAIWAN     
|32 |  | 91136225        |  | 200066     |  | Thickness Measuring Method for Liquid Crystal of Liquid Crystal on Silicon                          |  | TAIWAN     
|33 |  | 91218057        |  | 209399     |  | INTEGRATED CIRCUIT PAKAGE WITH EXPOSED-CHIP CONFIGURATION                                           |  | TAIWAN     
|34 |  | 91137088        |  | 194269     |  | METHOD FOR MANUFACTURING A LEADFRAME WITH FINE PITCH
INNER LEADS AND LEADFRAME FORMED FROM THE SAME |  | TAIWAN     
|35 |  | 91220939        |  | 209441     |  | NON-CONTACT TYPE SEMICONDUCTOR PACKAGE                                                              |  | TAIWAN     
|36 |  | 91220940        |  | 211363     |  | LCOS MICRO-DISPLAY MODULE                                                                           |  | TAIWAN     
|37 |  | 91220938        |  | 211730     |  | STACKABLE SEMICONDUCTOR PACKAGE                                                                     |  | TAIWAN     
|38 |  | 91212794        |  | 210326     |  | Interface Card Structure for Semiconductor Testing                                                  |  | TAIWAN     
|39 |  | 91118606        |  | 181850     |  | Flexible Printed Circuit with Elastic Bump Electrodes and Method for Making the Same                |  | TAIWAN     
|40 |  | 91216883        |  | 215236     |  | ADAPTER FOR TEST MACHINE OF MEMORY MODULE                                                           |  | TAIWAN     
|41 |  | 91124414        |  | I221024    |  | MANUFACTURING PROCESS OF MEMORY MODULE WITH DIRECTLY CHIP-ATTACHING                                 |  | TAIWAN     
|42 |  | 10/417263       |  | 6812720    |  | MODULAR PROBE CARD WITH COAXIAL TRANSMITTER                                                         |  | USA        
|43 |  | 91216882        |  | M242696    |  | MODULAR PROBE CARD WITH COAXIAL TRANSMITTER                                                         |  | TAIWAN     
|44 |  | 91124413        |  | I220785    |  | MEMORY MODULE WITH DIRECTLY CHIP-ATTACHING AND METHOD
FOR MAKING THEREOF                            |  | TAIWAN     
|45 |  | 91124412        |  | 190898     |  | PROCESS AND APPARATUS FOR GRINDING A WAFER BACKSIDE                                                 |  | TAIWAN     
|46 |  | 10/721288       |  | 6960491B2  |  | Integrated Circuit Packaging for Improving Effective Chip-Bonding Area                              |  | USA        
|47 |  | 03.13942        |  | 03.13942   |  | Integrated Circuit Packaging for Improving Effective Chip-Bonding Area                              |  | FRANCE     
|48 |  | 10355068.2      |  | 10355068   |  | Integrated Circuit Packaging for Improving Effective Chip-Bonding Area                              |  | GERMANY    
|49 |  | 91135243        |  | 200333     |  | Integrated Circuit Packaging Process for Improving Effective Chip-Bonding Area                      |  | TAIWAN     
|50 |  | 0327510.4       |  | GB2396964  |  | Integrated Circuit Packaging for Improving Effective Chip-Bonding Area                              |  | UK         
|51 |  | 91219179        |  | 209415     |  | CENTRAL-PAD MEMORIES STACK PACKAGE                                                                  |  | TAIWAN     
|52 |  | 91137089        |  |            |  | METHOD FOR CALIBRATING MEASUREMENT OF ACTIVE THICKNESS
OF PLATING LAYER                             |  | TAIWAN     
|53 |  | 91134549        |  | 197628     |  | PACKAGING PROCESS AND PACKAGE FOR STACKING CENTRAL-PAD
MEMORIES                                     |  | TAIWAN     
|54 |  | 91219485        |  | 215104     |  | PROBE CARD ASSEMBLY                                                                                 |  | TAIWAN     
|55 |  | 91221249        |  | 224435     |  | ELASTIC PROBE CARD                                                                                  |  | TAIWAN     
|56 |  | 91138212        |  | 198828     |  | WAFER LEVEL CHIP SCALE PACKAGE                                                                      |  | TAIWAN     
|57 |  | 91138207        |  | 204435     |  | Wafer Level Packaging Method with a Stress Absorbing Film                                           |  | TAIWAN     
|58 |  | 92117493        |  | 203490     |  | Method for automatic calculating testing time of semiconductors                                     |  | TAIWAN     



---

|    |  |           |  |         |  |                                                                                                                            |  |       
|--- |  | --------- |  | ------- |  | -------------------------------------------------------------------------------------------------------------------------- |  | ------
|59  |  | 92118419  |  | I234696 |  | Method for managing wafer test data in lot                                                                                 |  | TAIWAN
|60  |  | 92202134  |  | 213010  |  | MEMS PROBE HEAD                                                                                                            |  | TAIWAN
|61  |  | 92201652  |  | 219843  |  | FLAT HIGH FREQUENCY PROBE CARD                                                                                             |  | TAIWAN
|62  |  | 92203371  |  | 214726  |  | WAFER LEVEL CHIP SCALE PACKAGE FOR PREVENTING DISCONNECTION OF REDISTRIBUTION TRACES UNDER CONDUCTIVE GEL POSTS            |  | TAIWAN
|63  |  | 92118417  |  | I221016 |  | Method for Managing Installation of Test Programs and System of the Same                                                   |  | TAIWAN
|64  |  | 92202881  |  | 213203  |  | LIGHT WEIGHT MEMORY MODULE                                                                                                 |  | TAIWAN
|65  |  | 92203370  |  | 217638  |  | WAFER LEVEL CHIP SCALE PACKAGE WITH PIN LEADS                                                                              |  | TAIWAN
|66  |  | 92203739  |  | 220332  |  | High frequent probe head with wiring improved structure                                                                    |  | TAIWAN
|67  |  | 92105301  |  | 204441  |  | METHOD FOR MANUFACTURING PROBE HEADS FOR PROBING INTEGRATED CIRCUITS                                                       |  | TAIWAN
|68  |  | 92203738  |  | 217640  |  | Wafer level package with copper interconnecting chip                                                                       |  | TAIWAN
|69  |  | 92206840  |  | 213395  |  | LCOS MICRO-DISPLAY MODULE FOR REDUCING STRESS                                                                              |  | TAIWAN
|70  |  | 92218529  |  | M244481 |  | Micro-display Device with Light-Adjusting Module Including Color-Splitting Mirror                                          |  | TAIWAN
|71  |  | 92205599  |  | 223152  |  | Probe head for eliminating noise                                                                                           |  | TAIWAN
|72  |  | 92110057  |  | 201938  |  | Wafer level packaging process for protecting bump electrodes                                                               |  | TAIWAN
|73  |  | 92110058  |  | 202876  |  | Wafer level packaging process and structure thereof                                                                        |  | TAIWAN
|74  |  | 92110100  |  | 200972  |  | Wafer level package for integrated circuits                                                                                |  | TAIWAN
|75  |  | 92206841  |  | 217663  |  | Wafer Level Chip Scale Package with improved Pin Leads Strength                                                            |  | TAIWAN
|76  |  | 10/435560 |  | 6781392 |  | MODULARIZED PROBE CARD WITH COMPRESSIBLE ELECTRICAL CONNECTION DEVICE                                                      |  | USA   
|77  |  | 92112599  |  | I231024 |  | Wafer Level Chip Scale Package with Redistribution Wires by Wire Bonding and Method for Manufacturing the Same             |  | TAIWAN
|78  |  | 92113905  |  | I220932 |  | Modular probe head                                                                                                         |  | TAIWAN
|79  |  | 92113908  |  | I221025 |  | Wafer Level Chip Scale Package                                                                                             |  | TAIWAN
|80  |  | 91214623  |  | 214685  |  | TCP Type Semiconductor Device                                                                                              |  | TAIWAN
|81  |  | 92121062  |  | I220778 |  | Stage of Inner Lead Bond and Manufacturing Method of the Same                                                              |  | TAIWAN
|82  |  | 92219489  |  | M245597 |  | Back-Lighted Projecting Machine for Examining TCP/COF Packages                                                             |  | TAIWAN
|83  |  | 92122847  |  | I254436 |  | Stacked Multi Chip Package with Central Bond Pad                                                                           |  | TAIWAN
|84  |  | 10/620448 |  | 6853205 |  | Probe Card Assembly                                                                                                        |  | USA   
|85  |  | 92117497  |  | I221012 |  | Method for Manufacturing Wafer Lever Chip Scale Package With Elastically Metal Conductive Lead and Structure from the Same |  | TAIWAN
|86  |  | 92117498  |  | I233681 |  | Method for Manufacturing Wafer Lever Chip Scale Package and Structure from the Same                                        |  | TAIWAN
|87  |  | 92117495  |  | I234868 |  | Method for Manufacturing Wafer Lever Chip Scale Package                                                                    |  | TAIWAN
|88  |  | 10/680230 |  | 6946860 |  | Modularized probe head                                                                                                     |  | USA   
|89  |  | 92117496  |  | I221015 |  | Modular probe head                                                                                                         |  | TAIWAN
|90  |  | 92214588  |  | M243781 |  | Interposer With Bonding-Wire Contacts                                                                                      |  | TAIWAN
|91  |  | 92122846  |  | I224841 |  | Film Ball Grid Array Package Structure Of An Image Sensor                                                                  |  | TAIWAN
|92  |  | 92214586  |  | M243174 |  | Capsule Endoscopes With Flexible Fin                                                                                       |  | TAIWAN
|93  |  | 92214585  |  | M243173 |  | Improvement of Capsule Endoscopes                                                                                          |  | TAIWAN
|94  |  | 92214587  |  | M243175 |  | Capsule Endoscopes                                                                                                         |  | TAIWAN
|95  |  | 92214583  |  | M242179 |  | Capsule Endoscopes With Rotatable Image Sensing Module                                                                     |  | TAIWAN
|96  |  | 92214584  |  | M243172 |  | Decomposable Capsule Endoscopes                                                                                            |  | TAIWAN
|97  |  | 92214589  |  | M244442 |  | Probe Head for Decreasing Noise                                                                                            |  | TAIWAN
|98  |  | 92216463  |  | M242848 |  | Pluggable Probe Head                                                                                                       |  | TAIWAN
|99  |  | 92216458  |  | M243650 |  | Probe Head For Inhibiting Cross Talk                                                                                       |  | TAIWAN
|100 |  | 92216461  |  | M242697 |  | Improving Elastic Character of Probing Needles of Probe Head                                                               |  | TAIWAN
|101 |  | 92216460  |  | M243782 |  | Probe Head With Chip Scale Package Type Probe Unit                                                                         |  | TAIWAN
|102 |  | 92216457  |  | M243649 |  | Interposer for Modular Probe Card                                                                                          |  | TAIWAN
|103 |  | 92219490  |  | M245598 |  | Stage Structure for a Semiconductor Chip                                                                                   |  | TAIWAN
|104 |  | 92216923  |  | M242178 |  | Capsule Endoscopes With Adjusting Focus Function                                                                           |  | TAIWAN
|105 |  | 92216994  |  | M243170 |  | Capsule Endoscopes With Adjusting Time of Capturing Image                                                                  |  | TAIWAN
|106 |  | 92126116  |  | I226680 |  | Chip Scale Package Of An Image Sensor                                                                                      |  | TAIWAN
|107 |  | 92216995  |  | M243779 |  | Image Sensor Package                                                                                                       |  | TAIWAN
|108 |  | 92219714  |  | M249210 |  | Probe Head With Groove                                                                                                     |  | TAIWAN
|109 |  | 92219715  |  | M248021 |  | Structure of Probe Card                                                                                                    |  | TAIWAN
|110 |  | 92219717  |  | M249376 |  | Image sensor with low noise                                                                                                |  | TAIWAN
|111 |  | 92131140  |  |         |  | METHOD FOR MANUFACTURING CHIP ON FILM TYPE IMAGE SENSOR
AND STRUCTURE OF THE SAME                                          |  | TAIWAN
|112 |  | 92131141  |  | I239602 |  | Chip on film type image sensor package and method for manufacturing of the same                                            |  | TAIWAN
|113 |  | 92219716  |  | M249375 |  | Image Capturing Module with Chip on Glass Configuration                                                                    |  | TAIWAN
|114 |  | 92131137  |  | I227942 |  | Image sensor with metal sealing                                                                                            |  | TAIWAN
|115 |  | 92220557  |  | M248023 |  | Memory stacked package with central pads                                                                                   |  | TAIWAN
|116 |  | 92220555  |  | M248160 |  | Image sensor for avoiding sensing area being contaminated                                                                  |  | TAIWAN
|117 |  | 92132649  |  | I239095 |  | Image sensor package with multi substrates and method for manufacturing of the same                                        |  | TAIWAN
|118 |  | 92132648  |  | I239106 |  | Image sensor package with sealing sensing region configuration                                                             |  | TAIWAN
|119 |  | 92220556  |  | M248165 |  | Structure of image sensor module                                                                                           |  | TAIWAN



---

|    |  |                |  |         |  |                                                                                                                      |  |       
|--- |  | -------------- |  | ------- |  | -------------------------------------------------------------------------------------------------------------------- |  | ------
|120 |  | 92221239       |  | M246808 |  | Build-up image sensor package                                                                                        |  | TAIWAN
|121 |  | 92221243       |  | M246810 |  | Optical glass assembly image sensor                                                                                  |  | TAIWAN
|122 |  | 92221238       |  | M246807 |  | Multi chip image sensor package                                                                                      |  | TAIWAN
|123 |  | 92221246       |  | M246802 |  | Image sensor package with glass on chip configuration                                                                |  | TAIWAN
|124 |  | 92221247       |  | M246795 |  | Cutting tool of semiconductor sawing blade                                                                           |  | TAIWAN
|125 |  | 93111308       |  | I245960 |  | Method for manufacturing micro-display module and structure of the same                                              |  | TAIWAN
|126 |  | 93206239       |  | M254723 |  | Micro-display module with UV delay cured adhesives                                                                   |  | TAIWAN
|127 |  | 93204752       |  | M253899 |  | Moisture Resistance Structure for BGA Package                                                                        |  | TAIWAN
|128 |  | 93141419       |  | I246762 |  | Tape of TCP with Guiding Compound between Dummy Leads                                                                |  | TAIWAN
|129 |  | 93118577       |  | I245394 |  | Device including an opto-electronic chip with inner lead bonding and method for manufacturing the same               |  | TAIWAN
|130 |  | 93206850       |  | M256367 |  | Wafer Cartridge having a Wafer-guiding Device                                                                        |  | TAIWAN
|131 |  | 93111307       |  | I227363 |  | Micro-display Module with Wire-bridge                                                                                |  | TAIWAN
|132 |  | 93113239       |  | I252953 |  | Micro-display module for decreasing stress                                                                           |  | TAIWAN
|133 |  | 93206072       |  | M260734 |  | Platform Fixture for a Press Tester for Measuring Resist Compression of a Semiconductor Chip                         |  | TAIWAN
|134 |  | 92136314       |  | I241018 |  | Method for Manufacturing Wafer Level Image Sensor Package with Chip on Glass Configuration and Structure of the Same |  | TAIWAN
|135 |  | 92136313       |  | I242819 |  | Method for Manufacturing Chip on Glass Type Image Sensor and Structure of the Same                                   |  | TAIWAN
|136 |  | 92222330       |  | M250470 |  | Imaging Module with Chip on Glass Configuration                                                                      |  | TAIWAN
|137 |  | 92222329       |  | M249377 |  | Camera Module with Flip Chip Type Image Sensor                                                                       |  | TAIWAN
|138 |  | 10/671735      |  |         |  | Method for Fabricating Anisotropic Conductive Substrate                                                              |  | USA   
|139 |  | 11/011104      |  |         |  | Modularized probe head                                                                                               |  | USA   
|140 |  | 93206545       |  | M255943 |  | Improved probe head                                                                                                  |  | TAIWAN
|141 |  | 93203732       |  | M253166 |  | Chip on film type image sensor                                                                                       |  | TAIWAN
|142 |  | 93203727       |  | M265615 |  | Interposer of probe card                                                                                             |  | TAIWAN
|143 |  | 93203726       |  | M253771 |  | Low noise probe head                                                                                                 |  | TAIWAN
|144 |  | 93106560       |  |         |  | INTERPOSER OF PROBE CARD                                                                                             |  | TAIWAN
|145 |  | 11/317978      |  |         |  | Flexible substrate for package                                                                                       |  | USA   
|146 |  | 200510091771.7 |  |         |  | SUBSTRATE FOR TAPE CARRIER PACKAGE                                                                                   |  | CHINA 
|147 |  | 93141897       |  | I245396 |  | Substrate for Tape Carrier Package (TCP) with reinforced leads                                                       |  | TAIWAN
|148 |  | 11202898       |  |         |  | TAPE FOR TAPE CARRIER PACKAGE                                                                                        |  | USA   
|149 |  | 200510078386.9 |  |         |  | TAPE FOR TAPE CARRIER PACKAGE                                                                                        |  | CHINA 
|150 |  | 93141417       |  | I239088 |  | Tape for tape carrier package                                                                                        |  | TAIWAN
|151 |  | 11/202685      |  |         |  | FLIP CHIP PACKAGE SRUCTURE                                                                                           |  | USA   
|152 |  | 200510078387.3 |  |         |  | FLIP-CHIP-ON-FILM PACKAGE STRUCTURE                                                                                  |  | CHINA 
|153 |  | 93141899       |  | I251319 |  | Chip-on-film package                                                                                                 |  | TAIWAN
|154 |  | 93221489       |  | M269566 |  | Multi chips bonding tool for COF package                                                                             |  | TAIWAN
|155 |  | 93115881       |  | I232940 |  | Probe card with improved probe pin sets                                                                              |  | TAIWAN
|156 |  | 93113240       |  |         |  | Method of manufacturing wafer level light emitting diode package and structure of the same                           |  | TAIWAN
|157 |  | 93115883       |  | I245417 |  | Flip-chip type image sensor chip                                                                                     |  | TAIWAN
|158 |  | 93115882       |  | I234870 |  | Quad flat non-lead image sensor package and method for manufacturing the same                                        |  | TAIWAN
|159 |  | 93115527       |  | I244203 |  | Method for Packaging Image Sensors in a Tape and Structure from the Same                                             |  | TAIWAN
|160 |  | 93116066       |  | I246381 |  | Mounting structure of bumpless chip                                                                                  |  | TAIWAN
|161 |  | 93141422       |  |         |  | Hermetic sealing of image sensor chip                                                                                |  | TAIWAN
|162 |  | 93137652       |  | I248665 |  | Image sensor package and method for manufacturing the same                                                           |  | TAIWAN
|163 |  | 93115149       |  | I253699 |  | Bump with Flat Top and the Method of Forming the Same                                                                |  | TAIWAN
|164 |  | 93221233       |  | M268574 |  | Positioning Device of An Optical Measurement Platform                                                                |  | TAIWAN
|165 |  | 93221490       |  | M269567 |  | Tape automated bonding tool for COF package                                                                          |  | TAIWAN
|166 |  | 93134940       |  | I248179 |  | Multiple Chip Module Package                                                                                         |  | TAIWAN
|167 |  | 93141901       |  | I250597 |  | Method for Manufacturing Multi-Chip Package having Encapsulated Bond-wires between Stack Chips                       |  | TAIWAN
|168 |  | 200510082151.7 |  |         |  | CHIP-UNDER-TAPE PACKAGE STRUCTURE AND MANUFACTURE THEREOF                                                            |  | CHINA 
|169 |  | 93121053       |  | I250623 |  | Chip-Under-Tape package and process for manufacturing the same                                                       |  | TAIWAN
|170 |  | 93211114       |  | M260870 |  | Memory Package                                                                                                       |  | TAIWAN
|171 |  | 93211115       |  | M260869 |  | Thin type memory module                                                                                              |  | TAIWAN
|172 |  | 11/188860      |  |         |  | Electronic device having pin electrode with slight warpage                                                           |  | USA   
|173 |  | 93125405       |  | I237316 |  | Electronic device having pin electrode with slight warpage                                                           |  | TAIWAN
|174 |  | 200510093174.8 |  |         |  | Thermal enhanced BGA package                                                                                         |  | CHINA 
|175 |  | 93125407       |  | I245387 |  | Thermal enhanced BGA package                                                                                         |  | TAIWAN
|176 |  | 93125408       |  | I256115 |  | Memory package                                                                                                       |  | TAIWAN
|177 |  | 11/208595      |  |         |  | Bump structure of opto-electronic chip                                                                               |  | USA   
|178 |  | 93213431       |  | M260879 |  | Bump structure of opto-electronic chip                                                                               |  | TAIWAN
|179 |  | 93125406       |  | I260069 |  | Memory module and method for manufacturing the same                                                                  |  | TAIWAN
|180 |  | 11/011200      |  |         |  | Modulized probe head for high frequency                                                                              |  | USA   
|181 |  | 200510093070.7 |  |         |  | Modulized probe head for high frequency                                                                              |  | CHINA 



---

|    |  |                |  |         |  |                                                                                    |  |       
|--- |  | -------------- |  | ------- |  | ---------------------------------------------------------------------------------- |  | ------
|182 |  | 93125409       |  |         |  | Modulized probe head for high frequency                                            |  | TAIWAN
|183 |  | 93115528       |  | I232567 |  | Image sensor package with a FPC surrounding a window                               |  | TAIWAN
|184 |  | 93119546       |  | I242250 |  | Process for Packaging Image Sensors on Flexible Substrate                          |  | TAIWAN
|185 |  | 200510093175.2 |  |         |  | Thermally Enhanced flip chip package                                               |  | CHINA 
|186 |  | 94103782       |  |         |  | Improvement of ESI laser repair system 9300/9350 back stop                         |  | TAIWAN
|187 |  | 200510093811.1 |  |         |  | Driver IC package with multi-layer bumps                                           |  | CHINA 
|188 |  | 93133488       |  | I256120 |  | Driver IC package with multi-layer bumps                                           |  | TAIWAN
|189 |  | 93221231       |  | M268731 |  | Apparatus for Carrying Inspection Trays of Small Components                        |  | TAIWAN
|190 |  | 93133489       |  | I235511 |  | Method of manufacturing light emitting diode package and structure of the same     |  | TAIWAN
|191 |  | 200510114523.X |  |         |  | Testing method and structure for LEDs in wafer form                                |  | CHINA 
|192 |  | 93133490       |  |         |  | Testing method and structure for LEDs in wafer form                                |  | TAIWAN
|193 |  | 11/254676      |  |         |  | Image Sensor Package Structure                                                     |  | USA   
|194 |  | 93216784       |  | M264652 |  | Image Sensor Package Structure                                                     |  | TAIWAN
|195 |  | 11/254660      |  |         |  | Package Structure of Image Sensor Device                                           |  | USA   
|196 |  | 93216783       |  | M264651 |  | Package Structure of Image Sensor Device                                           |  | TAIWAN
|197 |  | 11/254677      |  |         |  | Method for assembling image sensor and structure of the same                       |  | USA   
|198 |  | 200510093817.9 |  |         |  | Method for assembling image sensor and structure of the same                       |  | CHINA 
|199 |  | 93132005       |  | I244177 |  | Method for assembling image sensor and structure of the same                       |  | TAIWAN
|200 |  | 93141340       |  | I258451 |  | Tape Cutter Assembly                                                               |  | TAIWAN
|201 |  | 11/254659      |  |         |  | MULTI-CHIP IMAGE SENSOR MODULE                                                     |  | USA   
|202 |  | 93216782       |  | M264775 |  | Image Sensor with Multi Chip Module                                                |  | TAIWAN
|203 |  | 11/254658      |  |         |  | Image sensor package                                                               |  | USA   
|204 |  | 93216781       |  | M264648 |  | Image sensor package                                                               |  | TAIWAN
|205 |  | 93132007       |  | I236768 |  | Low Noise Multi Chip Image Sensor Package                                          |  | TAIWAN
|206 |  | 93216785       |  | M263908 |  | Capsule endoscopes with multi-chip module configuration                            |  | TAIWAN
|207 |  | 93132006       |  | I256116 |  | Thin type integrated circuit package                                               |  | TAIWAN
|208 |  | 200510062653.3 |  |         |  | USING BUMP PACKAGE STRUCTURE AND METHOD THEREOF                                    |  | CHINA 
|209 |  | 94108499       |  |         |  | USING BUMP PACKAGE STRUCTURE AND METHOD THEREOF                                    |  | TAIWAN
|210 |  | 11/202820      |  |         |  | FLIP-CHIP-ON-FILM PACKAGE STRUCTURE                                                |  | USA   
|211 |  | 200510078388.8 |  |         |  | FLIP-CHIP-ON-FILM PACKAGE STRUCTURE                                                |  | CHINA 
|212 |  | 94108261       |  |         |  | THERMALLY ENHANCED FLIP-CHIP-ON-FILM PACKAGE                                       |  | TAIWAN
|213 |  | 11/076935      |  |         |  | Probe Card Interposer                                                              |  | USA   
|214 |  | 200510098693.3 |  |         |  | Probe Card Interposer                                                              |  | CHINA 
|215 |  | 94117086       |  |         |  | Flexibly thermally enhanced Chip-on-Film (COF) package                             |  | TAIWAN
|216 |  | 200510102504.5 |  |         |  | Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof        |  | CHINA 
|217 |  | 94118859       |  | I254462 |  | Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof        |  | TAIWAN
|218 |  | 200510102505.X |  |         |  | Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof        |  | CHINA 
|219 |  | 94118858       |  | I252590 |  | Stacked Chip Package Structure, Chip Package and Fabricating Method Thereof        |  | TAIWAN
|220 |  | 94111878       |  |         |  | FLIP CHIP BGA PACKAGE                                                              |  | TAIWAN
|221 |  | 11/364324      |  |         |  | Image sensor module package                                                        |  | USA   
|222 |  | 200510114333.8 |  |         |  | Image sensor module package                                                        |  | CHINA 
|223 |  | 2005100908.X   |  |         |  | Method for Manufacturing Cavity-Down Chip Packages                                 |  | CHINA 
|224 |  | 94111879       |  | I260754 |  | Method for Manufacturing Cavity-Down Chip Packages                                 |  | TAIWAN
|225 |  | 11/228234      |  |         |  | Pillar grid array package                                                          |  | USA   
|226 |  | 200510093178.6 |  |         |  | Pillar grid array package                                                          |  | CHINA 
|227 |  | 94111881       |  |         |  | Pillar grid array package                                                          |  | TAIWAN
|228 |  | 200510103419.0 |  |         |  | Chip Package and Stacked Chip Package Structure                                    |  | CHINA 
|229 |  | 94127459       |  | I258212 |  | Chip Package and Stacked Chip Package Structure                                    |  | TAIWAN
|230 |  | 11/302736      |  |         |  | CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE THEREOF               |  | USA   
|231 |  | 200510103414.8 |  |         |  | CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE THEREOF               |  | CHINA 
|232 |  | 94123850       |  |         |  | CHIP PACKAGE WITHOUT A CORE AND STACKED CHIP PACKAGE STRUCTURE USING THE SAME      |  | TAIWAN
|233 |  | 94117089       |  |         |  | MEMORY MODULE FOR REPACKAGING BGA PACKAGES                                         |  | TAIWAN
|234 |  | 11/271797      |  |         |  | METHOD OF MANUFACTURING AN INJECTOR PLATE                                          |  | USA   
|235 |  | 200510093179.0 |  |         |  | METHOD OF MANUFACTURING AN INJECTOR PLATE                                          |  | CHINA 
|236 |  | 94108262       |  | I244122 |  | METHOD OF MANUFACTURING AN INJECTOR PLATE                                          |  | TAIWAN
|237 |  | 11/364330      |  |         |  | METHOD FOR FABRICATING A PLURALITY OF ELASTIC PROBES IN A ROW                      |  | USA   
|238 |  | 200510093180.3 |  |         |  | METHOD FOR FABRICATING A PLURALITY OF ELASTIC PROBES IN A ROW                      |  | CHINA 
|239 |  | 94117087       |  |         |  | ELASTIC PROBE PINS IN ROW AND METHOD FOR FABRICATING THE SAME                      |  | TAIWAN
|240 |  | 11/326749      |  |         |  | Manufacturing process for chip package without core dielectric                     |  | USA   
|241 |  | 200510103416.7 |  |         |  | Manufacturing process for chip package without core dielectric                     |  | CHINA 
|242 |  | 94124656       |  | I255561 |  | Manufacturing process for chip package without core dielectric                     |  | TAIWAN
|243 |  | 200510098506.1 |  |         |  | Method for Manufacturing Cavity-Down Chip Packages and Device Made from the Method |  | CHINA 
|244 |  | 94116561       |  | I264784 |  | Method for Manufacturing Cavity-Down Chip Packages and Device Made from the Method |  | TAIWAN



---

|    |  |                |  |         |  |                                                                                             |  |       
|--- |  | -------------- |  | ------- |  | ------------------------------------------------------------------------------------------- |  | ------
|245 |  | 200510103366.2 |  |         |  | Stacked Structure of Semiconductor Packaging Device                                         |  | CHINA 
|246 |  | 94210084       |  | M280007 |  | Stacked Structure of Semiconductor Packaging Device                                         |  | TAIWAN
|247 |  | 11/332409      |  |         |  | Thin IC package for improving heat dissipation from chip backside                           |  | USA   
|248 |  | 200510108092.6 |  |         |  | Thin IC package for improving heat dissipation from chip backside                           |  | CHINA 
|249 |  | 94127021       |  |         |  | Thin IC package for improving heat dissipation from chip backside                           |  | TAIWAN
|250 |  | 200510093392.1 |  |         |  | LOC (LEAD-ON-CHIP) IC PACKAGE                                                               |  | CHINA 
|251 |  | 94124277       |  |         |  | LOC (LEAD-ON-CHIP) IC PACKAGE                                                               |  | TAIWAN
|252 |  | 200510114522.5 |  |         |  | Optoelectronic Chip Package and Method for Manufacturing the Same                           |  | CHINA 
|253 |  | 94118641       |  | I256141 |  | Optoelectronic Chip Package and Method for Manufacturing the Same                           |  | TAIWAN
|254 |  | 200510120420.4 |  |         |  | FLEXIBLE SUBSTRATE FOR PACKAGE                                                              |  | CHINA 
|255 |  | 94137504       |  |         |  | FLEXIBLE SUBSTRATE FOR PACKAGE                                                              |  | TAIWAN
|256 |  | 200510108617.6 |  |         |  | Tape for Package                                                                            |  | CHINA 
|257 |  | 94125700       |  | I263348 |  | Tape for Package                                                                            |  | TAIWAN
|258 |  | 200510093508.1 |  |         |  | METHOD FOR LASER MARKING ON A WAFER                                                         |  | CHINA 
|259 |  | 94118640       |  |         |  | METHOD FOR LASER MARKING ON A WAFER                                                         |  | TAIWAN
|260 |  | 94124182       |  |         |  | FLEXIBLE SUBSTRATE WITH STRAIN SURVEY DESIGN                                                |  | TAIWAN
|261 |  | 11/317978      |  |         |  | Flexible substrate for package                                                              |  | USA   
|262 |  | 200510113204.7 |  |         |  | Flexible substrate for package                                                              |  | CHINA 
|263 |  | 94128293       |  |         |  | Flexible substrate for package                                                              |  | TAIWAN
|264 |  | 11/303184      |  |         |  | FLEXIBLE SUBSTRATE CAPABLE OF PREVENTING LEAD THEREON FROM FRACTURING                       |  | USA   
|265 |  | 200510108618.0 |  |         |  | FLEXIBLE SUBSTRATE CAPABLE OF PREVENTING LEAD THEREON FROM FRACTURING                       |  | CHINA 
|266 |  | 94128292       |  |         |  | FLEXIBLE SUBSTRATE CAPABLE OF PREVENTING LEAD THEREON FROM FRACTURING                       |  | TAIWAN
|267 |  | 200510108619.5 |  |         |  | FLIP-CHIP-ON-FILM PACKAGE STRUCTURE CAPABLE OF PREVENTING SEALING MATERIAL FROM OVERFLOWING |  | CHINA 
|268 |  | 94128291       |  |         |  | FLIP-CHIP-ON-FILM PACKAGE STRUCTURE CAPABLE OF PREVENTING SEALING MATERIAL FROM OVERFLOWING |  | TAIWAN
|269 |  | 11/301860      |  |         |  | CHIP STRUCTURE AND STACKED CHIP PACKAGE                                                     |  | USA   
|270 |  | 200510108096.4 |  |         |  | CHIP STRUCTURE AND STACKED CHIP PACKAGE                                                     |  | CHINA 
|271 |  | 94131797       |  |         |  | CHIP STRUCTURE AND STACKED CHIP PACKAGE                                                     |  | TAIWAN
|272 |  | 11/302737      |  |         |  | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF                                         |  | USA   
|273 |  | 200510103537.1 |  |         |  | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF                                         |  | CHINA 
|274 |  | 94131795       |  | I255568 |  | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF                                         |  | TAIWAN
|275 |  | 11/217,978     |  |         |  | Chip Package Structure                                                                      |  | USA   
|276 |  | 200610003254.4 |  |         |  | Chip Package Structure                                                                      |  | CHINA 
|277 |  | 200510108620.8 |  |         |  | Flexible Substrate for Package                                                              |  | CHINA 
|278 |  | 94128290       |  | I253158 |  | Flexible Substrate for Package                                                              |  | TAIWAN
|279 |  | 200510093509.6 |  |         |  | Chip Carrying Tape with Counting Marks at Side(s)                                           |  | CHINA 
|280 |  | 2005-282030    |  |         |  | Chip Carrying Tape with Counting Marks at Side(s)                                           |  | JAPAN 
|281 |  | 94122911       |  |         |  | Chip Carrying Tape with Counting Marks at Side(s)                                           |  | TAIWAN
|282 |  | 200510093510.9 |  |         |  | Tape and Device for COF Package                                                             |  | CHINA 
|283 |  | 94120222       |  | I263346 |  | Tape and Device for COF Package                                                             |  | TAIWAN
|284 |  | 11/249465      |  |         |  | LASER MARK ON AN IC COMPONENT                                                               |  | USA   
|285 |  | 200510092925.4 |  |         |  | LASER MARK ON AN IC COMPONENT                                                               |  | CHINA 
|286 |  | 94125739       |  |         |  | LASER MARK ON AN IC COMPONENT                                                               |  | TAIWAN
|287 |  | 11/234,774     |  |         |  | CHIP PACKAGE STRUCTURE AND BUMPING PROCESS                                                  |  | USA   
|288 |  | 11/361646      |  |         |  | CHIP PACKAGE STRUCTURE AND BUMPING PROCESS                                                  |  | USA   
|289 |  | 200510117212.9 |  |         |  | CHIP PACKAGE STRUCTURE AND BUMPING PROCESS                                                  |  | CHINA 
|290 |  | 94136150       |  |         |  | CHIP PACKAGE STRUCTURE AND BUMPING PROCESS                                                  |  | TAIWAN
|291 |  | 11/352,001     |  |         |  | CHIP PACKAGE HAVING ASYMMETRIC MOLDING                                                      |  | USA   
|292 |  | 200510089824.1 |  |         |  | CHIP PACKAGE HAVING ASYMMETRIC MOLDING                                                      |  | CHINA 
|293 |  | 94126167       |  |         |  | CHIP PACKAGE HAVING ASYMMETRIC MOLDING                                                      |  | TAIWAN
|294 |  | 11/351,651     |  |         |  | CHIP PACKAGE WITH ASYMMETRIC MOLDING                                                        |  | USA   
|295 |  | 200510090107.0 |  |         |  | CHIP PACKAGE WITH ASYMMETRIC MOLDING                                                        |  | CHINA 
|296 |  | 94125376       |  |         |  | CHIP PACKAGE WITH ASYMMETRIC MOLDING                                                        |  | TAIWAN
|297 |  | 11/302610      |  |         |  | CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS                                   |  | USA   
|298 |  | 200510108091.1 |  |         |  | CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS                                   |  | CHINA 
|299 |  | 94129919       |  |         |  | CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS                                   |  | TAIWAN
|300 |  | 200510098222.2 |  |         |  | Chip-on-Glass (COG) Package of Image Sensor                                                 |  | CHINA 
|301 |  | 94128972       |  | I260787 |  | Chip-on-Glass (COG) Package of Image Sensor                                                 |  | TAIWAN
|302 |  | 11/326,789     |  |         |  | UNIVERSAL CHIP PACKAGE STRUCTURE                                                            |  | USA   
|303 |  | 200510117075.9 |  |         |  | UNIVERSAL CHIP PACKAGE STRUCTURE                                                            |  | CHINA 
|304 |  | 94135129       |  |         |  | UNIVERSAL CHIP PACKAGE STRUCTURE                                                            |  | TAIWAN
|305 |  | 11/355483      |  |         |  | NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF                                              |  | USA   
|306 |  | 200510103190.0 |  |         |  | NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF                                              |  | CHINA 



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|    |  |                |  |         |  |                                                                                                                                                                 |  |       
|--- |  | -------------- |  | ------- |  | --------------------------------------------------------------------------------------------------------------------------------------------------------------- |  | ------
|307 |  | 200610007603.x |  |         |  | NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF                                                                                                                  |  | CHINA 
|308 |  | 94131051       |  |         |  | NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF                                                                                                                  |  | TAIWAN
|309 |  | 95102570       |  |         |  | NOZZLE PLATE AND MANUFACTURING PROCESS THEREOF                                                                                                                  |  | TAIWAN
|310 |  | 11/433150      |  |         |  | LIGHT EMITTING DIODE PACKAGE                                                                                                                                    |  | USA   
|311 |  | 200510115216.3 |  |         |  | LIGHT EMITTING DIODE PACKAGE                                                                                                                                    |  | CHINA 
|312 |  | 94137764       |  |         |  | LIGHT EMITTING DIODE PACKAGE STRUCTURE                                                                                                                          |  | TAIWAN
|313 |  | 11/322408      |  |         |  | Modular probe card                                                                                                                                              |  | USA   
|314 |  | 200510103332.3 |  |         |  | Modular probe card                                                                                                                                              |  | CHINA 
|315 |  | 94131978       |  |         |  | Modular probe card                                                                                                                                              |  | TAIWAN
|316 |  | 11/255,710     |  |         |  | STACKED-TYPE CHIP PACKAGE STRUCTURE                                                                                                                             |  | USA   
|317 |  | 200510115213.X |  |         |  | STACKED-TYPE CHIP PACKAGE STRUCTURE                                                                                                                             |  | CHINA 
|318 |  | 94137762       |  |         |  | STACKED-TYPE CHIP PACKAGE STRUCTURE                                                                                                                             |  | TAIWAN
|319 |  | 11/246,403     |  |         |  | SEMICONDUCTOR PACKAGING PROCESS AND CARRIER FOR SEMICONDUCTOR PACKAGE                                                                                           |  | USA   
|320 |  | 200610057299.X |  |         |  | SEMICONDUCTOR PACKAGING PROCESS AND CARRIER FOR SEMICONDUCTOR PACKAGE                                                                                           |  | CHINA 
|321 |  | 11/249464      |  |         |  | Replaceable modular probe head                                                                                                                                  |  | USA   
|322 |  | 94127877       |  |         |  | Replaceable modular probe head                                                                                                                                  |  | TAIWAN
|323 |  | 200610099189.X |  |         |  | BUMPED STRUCTURE AND ITS FORMING METHOD                                                                                                                         |  | CHINA 
|324 |  | 94131169       |  |         |  | BUMPED STRUCTURE AND ITS FORMING METHOD                                                                                                                         |  | TAIWAN
|325 |  | 200610104249.2 |  |         |  | Semiconductor Package for Improving Chip Shift During Molding                                                                                                   |  | CHINA 
|326 |  | 94133400       |  | I261366 |  | Semiconductor Package for Improving Chip Shift During Molding                                                                                                   |  | TAIWAN
|327 |  | 200610099190.2 |  |         |  | FLIP CHIP PACKAGE STRUCTURE                                                                                                                                     |  | CHINA 
|328 |  | 94139584       |  |         |  | FLIP CHIP PACKAGE STRUCTURE                                                                                                                                     |  | TAIWAN
|329 |  | 11373531       |  |         |  | CHIP PACKAGE STRUCTURE                                                                                                                                          |  | USA   
|330 |  | 200610000572.5 |  |         |  | CHIP PACKAGE STRUCTURE                                                                                                                                          |  | CHINA 
|331 |  | 200620000457.3 |  |         |  | CHIP PACKAGE STRUCTURE                                                                                                                                          |  | CHINA 
|332 |  | 94143093       |  |         |  | CHIP PACKAGE STRUCTURE                                                                                                                                          |  | TAIWAN
|333 |  | 11/314780      |  |         |  | WAFER STRUCTURE AND BUMPING PROCESS                                                                                                                             |  | USA   
|334 |  | 200610064870.0 |  |         |  | WAFER STRUCTURE AND BUMPING PROCESS                                                                                                                             |  | CHINA 
|335 |  | 200610066936   |  |         |  | METHOD FOR INSPECTING A CHIP TRAY                                                                                                                               |  | CHINA 
|336 |  | 94136736       |  |         |  | METHOD FOR INSPECTING A CHIP TRAY                                                                                                                               |  | TAIWAN
|337 |  | 11/400182      |  |         |  | High frequency IC package and method for fabricating the same                                                                                                   |  | USA   
|338 |  | 95104286       |  |         |  | High frequency IC package and method for fabricating the same                                                                                                   |  | TAIWAN
|339 |  | 200610099588.6 |  |         |  | Probe Head with Vertical Probes, Method for Manufacturing the Probe Head, and Probe Card Using the Probe Head                                                   |  | CHINA 
|340 |  | 95102204       |  |         |  | Probe Head with Vertical Probes, Method for Manufacturing the Probe Head, and Probe Card Using the Probe Head                                                   |  | TAIWAN
|341 |  | 11/451,997     |  |         |  | SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF                                                                                                          |  | USA   
|342 |  | 200610057300.9 |  |         |  | SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF                                                                                                          |  | CHINA 
|343 |  | 95106753       |  |         |  | SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF                                                                                                          |  | TAIWAN
|344 |  | 11/454558      |  |         |  | BUMPING PROCESS                                                                                                                                                 |  | USA   
|345 |  | 200610064835.9 |  |         |  | BUMPING PROCESS                                                                                                                                                 |  | CHINA 
|346 |  | 95106519       |  |         |  | BUMPING PROCESS                                                                                                                                                 |  | TAIWAN
|347 |  | 94138164       |  |         |  | CHIP-ON-GLASS SENSOR PACKAGE FOR PREVENTING ITS SENSOR REGION FROM CONTAMINATION OF OUTGASSING DURING CURING AN ENCAPSULANT AND METHOD FOR FABRICATING THE SAME |  | TAIWAN
|348 |  | 200610099116.0 |  |         |  | Device and Method of Bonding An Image Sensor Chip to A Glass Substrate                                                                                          |  | CHINA 
|349 |  | 94144367       |  |         |  | Device and Method of Bonding An Image Sensor Chip to A Glass Substrate                                                                                          |  | TAIWAN
|350 |  | 11/416357      |  |         |  | CHIP PACKAGE                                                                                                                                                    |  | USA   
|351 |  | 200610058156.0 |  |         |  | CHIP PACKAGE                                                                                                                                                    |  | CHINA 
|352 |  | 95106254       |  |         |  | CHIP PACKAGE                                                                                                                                                    |  | TAIWAN
|353 |  | 200610104251.X |  |         |  | Chip Carrier and Chip Package Structure Thereof                                                                                                                 |  | CHINA 
|354 |  | 95103721       |  |         |  | Chip Carrier and Chip Package Structure Thereof                                                                                                                 |  | TAIWAN
|355 |  | 95108939       |  |         |  | Substrate Fixing Jig for Wire Bonder                                                                                                                            |  | TAIWAN
|356 |  | 200610099584.8 |  |         |  | Chip-on-Glass Package of Image Sensor                                                                                                                           |  | CHINA 
|357 |  | 95110299       |  |         |  | Chip-on-Glass Package of Image Sensor                                                                                                                           |  | TAIWAN
|358 |  | 200610103270.0 |  |         |  | Method for Manufacturing Probe Card                                                                                                                             |  | CHINA 
|359 |  | 95124781       |  |         |  | Method for Manufacturing Probe Card                                                                                                                             |  | TAIWAN
|360 |  | 200610111277.7 |  |         |  | Chip-on-Film Packages and Multi-Layer Wiring Tape Thereof                                                                                                       |  | CHINA 
|361 |  | 95111120       |  |         |  | Multi-Layer Wiring Tape for Chip-on-Film Packages                                                                                                               |  | TAIWAN
|362 |  | 200610099587.1 |  |         |  | Reinforced Chip-on-Film Package                                                                                                                                 |  | CHINA 
|363 |  | 95110295       |  |         |  | Reinforced Chip-on-Film Package                                                                                                                                 |  | TAIWAN
|364 |  | 200610111470.0 |  |         |  | Thermally Enhanced Chip-on-Film Package                                                                                                                         |  | CHINA 
|365 |  | 95111122       |  |         |  | Thermally Enhanced Chip-on-Film Package                                                                                                                         |  | TAIWAN
|366 |  | 200610099186.6 |  |         |  | Chip-on-Film Package with Elongated Lead(s)                                                                                                                     |  | CHINA 
|367 |  | 95111123       |  |         |  | Chip-on-Film Package with Elongated Lead(s)                                                                                                                     |  | TAIWAN



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|    |  |                |  |  |  |                                                                                                                            |  |       
|--- |  | -------------- |  |  |  | -------------------------------------------------------------------------------------------------------------------------- |  | ------
|368 |  | 200610109241.5 |  |  |  | Inner Lead Bonding Tape and Tape Carrier Package Utilizing the Tape                                                        |  | CHINA 
|369 |  | 95110292       |  |  |  | Inner Lead Bonding Tape and Tape Carrier Package Utilizing the Tape                                                        |  | TAIWAN
|370 |  | 200610099187.0 |  |  |  | Semiconductor Package Having a Universal Die Pad                                                                           |  | CHINA 
|371 |  | 95110293       |  |  |  | Semiconductor Package Having a Universal Die Pad                                                                           |  | TAIWAN
|372 |  | 200610104250.5 |  |  |  | Fabricating Process of Leadframe-Based BGA Packages and Leadless Leadframe Utilized in the Process                         |  | CHINA 
|373 |  | 95110298       |  |  |  | Fabricating Process of Leadframe-Based BGA Packages and Leadless Leadframe Utilized in the Process                         |  | TAIWAN
|374 |  | 200610098733.9 |  |  |  | Semiconductor Package for Prevent Contamination of Bonding Pads of Chip by Chip-attach Material and the Substrate Utilized |  | CHINA 
|375 |  | 95111126       |  |  |  | Semiconductor Package for Prevent Contamination of Bonding Pads of Chip by Chip-attach Material and the Substrate Utilized |  | TAIWAN
|376 |  | 200610078937.6 |  |  |  | Semiconductor Chip Having Fine Pitch Bumps and Bumps Thereof                                                               |  | CHINA 
|377 |  | 95111889       |  |  |  | Semiconductor Chip Having Fine Pitch Bumps and Bumps Thereof                                                               |  | TAIWAN
|378 |  | 200610078938.0 |  |  |  | Inspection Method for Package Carrier and Apparatus Thereof                                                                |  | CHINA 
|379 |  | 95114828       |  |  |  | Inspection Method for Package Carrier and Apparatus Thereof                                                                |  | TAIWAN
|380 |  | 200610111477.2 |  |  |  | Leadless Semiconductor Package with Electroplated Layer Embedded in Encapsulant and the Method for Fabricating the Same    |  | CHINA 
|381 |  | 95110296       |  |  |  | Leadless Semiconductor Package with Electroplated Layer Embedded in Encapsulant and the Method for Fabricating the Same    |  | TAIWAN
|382 |  | 11/481719      |  |  |  | CHIP PACKAGE AND WAFER TREATING METHOD FOR MAKING ADHESIVE CHIPS                                                           |  | USA   
|383 |  | 200610083380.5 |  |  |  | CHIP PACKAGE AND WAFER TREATING METHOD FOR MAKING ADHESIVE CHIPS                                                           |  | CHINA 
|384 |  | 95109125       |  |  |  | CHIP PACKAGE AND WAFER TREATING METHOD FOR MAKING ADHESIVE CHIPS                                                           |  | TAIWAN
|385 |  | 200610112070.1 |  |  |  | TAPE STRUCTURE FOR PACKAGING                                                                                               |  | CHINA 
|386 |  | 95128836       |  |  |  | TAPE STRUCTURE FOR PACKAGING                                                                                               |  | TAIWAN
|387 |  | 200610111233.4 |  |  |  | Chip-on-Film Package for Lessening Deformation of Film                                                                     |  | CHINA 
|388 |  | 95116536       |  |  |  | Chip-on-Film Package for Lessening Deformation of Film                                                                     |  | TAIWAN
|389 |  | 200610111544.0 |  |  |  | Chip-on-Film Package and Wiring Film Utilized                                                                              |  | CHINA 
|390 |  | 95116535       |  |  |  | Chip-on-Film Package and Wiring Film Utilized                                                                              |  | TAIWAN
|391 |  | 200610109599.8 |  |  |  | BGA Package with Leads on Chip                                                                                             |  | CHINA 
|392 |  | 95120350       |  |  |  | BGA Package with Leads on Chip                                                                                             |  | TAIWAN
|393 |  | 200610109240.0 |  |  |  | Matrix Package Substrate and Method for Determination of Sawing Type of Package Array                                      |  | CHINA 
|394 |  | 95126329       |  |  |  | Matrix Package Substrate and Method for Determination of Sawing Type of Package Array                                      |  | TAIWAN
|395 |  | 200610111540.2 |  |  |  | Chip Package with Array Pads and Method for Manufacturing the Same                                                         |  | CHINA 
|396 |  | 95119569       |  |  |  | Chip Package with Array Pads and Method for Manufacturing the Same                                                         |  | TAIWAN
|397 |  | 95126005       |  |  |  | Chip Structure                                                                                                             |  | USA   
|398 |  | 200610099115.6 |  |  |  | Chip Structure                                                                                                             |  | CHINA 
|399 |  | 95126005       |  |  |  | Chip Structure                                                                                                             |  | TAIWAN
|400 |  | 200610111238.7 |  |  |  | High Frequency IC Package and Method for Fabricating the Same                                                              |  | CHINA 
|401 |  | 95120084       |  |  |  | High Frequency IC Package                                                                                                  |  | TAIWAN
|402 |  | 200610111274.3 |  |  |  | Process for MEMS Fabricating Alloy Probe(s)                                                                                |  | CHINA 
|403 |  | 95125908       |  |  |  | Process for MEMS Fabricating Alloy Probe(s)                                                                                |  | TAIWAN
|404 |  | 95124971       |  |  |  | Chip Scale Image Sensor Package and Module Utilizing the Same                                                              |  | TAIWAN
|405 |  | 11/530165      |  |  |  | Chip Package and Manufacturing Method Thereof                                                                              |  | USA   
|406 |  | 200610104061.8 |  |  |  | Chip Package and Manufacturing Method Thereof                                                                              |  | CHINA 
|407 |  | 95126496       |  |  |  | Chip Package and Manufacturing Method Thereof                                                                              |  | TAIWAN
|408 |  | 200610111923.X |  |  |  | Leadframe on Offset Stacked Chips Package                                                                                  |  | CHINA 
|409 |  | 95128831       |  |  |  | Leadframe on Offset Stacked Chips Package                                                                                  |  | TAIWAN
|410 |  | 11/470,494     |  |  |  | Chip Package and Manufacturing Method Thereof                                                                              |  | USA   
|411 |  | 200610098      |  |  |  | Chip Package and Manufacturing Method Thereof                                                                              |  | CHINA 
|412 |  | 95124446       |  |  |  | Chip Package and Manufacturing Method Thereof                                                                              |  | TAIWAN
|413 |  | 200610111278.1 |  |  |  | Cob Type IC Package for Improving Bonding of Bumps Embedded in Substrate and Method for Fabricating the Same               |  | CHINA 
|414 |  | 95129709       |  |  |  | Cob Type IC Package for Improving Bonding of Bumps Embedded in Substrate and Method for Fabricating the Same               |  | TAIWAN
|415 |  | 200610111922.5 |  |  |  | Multichip Stack Package                                                                                                    |  | CHINA 
|416 |  | 95128828       |  |  |  | Multichip Stack Package                                                                                                    |  | TAIWAN
|417 |  | 95133660       |  |  |  | Stacked Chip Package Structure with Unbalanced Lead-frame                                                                  |  | TAIWAN
|418 |  | 95133670       |  |  |  | Stacked Chip Package Structure with Lead-frame Having Bus Bar                                                              |  | TAIWAN
|419 |  | 95133664       |  |  |  | Stacked Chip Package Structure with Lead-frame Having Multi-Pieces of Bus Bar                                              |  | TAIWAN
|420 |  | 95139576       |  |  |  | Package Structure with Lead-frame Having Inner Leads with Transfer Pad                                                     |  | TAIWAN
|421 |  | 95133663       |  |  |  | Stacked Chip Package Structure with Lead-frame Having Bus Bar with Transfer Pad                                            |  | TAIWAN
|422 |  | 200610111279.6 |  |  |  | Integrated Circuit Package and Multi-Layer Leadframe Utilized                                                              |  | CHINA 
|423 |  | 95117275       |  |  |  | Integrated Circuit Package and Multi-Layer Leadframe Utilized                                                              |  | TAIWAN
|424 |  | 200610111275.8 |  |  |  | Chip-on-Glass Package of Image Sensor                                                                                      |  | CHINA 
|425 |  | 95126121       |  |  |  | Chip-on-Glass Package of Image Sensor                                                                                      |  | TAIWAN
|426 |  | 95126002       |  |  |  | Chip Structure                                                                                                             |  | USA   



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|    |  |                |  |  |  |                                                                                                  |  |       
|--- |  | -------------- |  |  |  | ------------------------------------------------------------------------------------------------ |  | ------
|427 |  | 200610099117.5 |  |  |  | Chip Structure                                                                                   |  | CHINA 
|428 |  | 95126002       |  |  |  | Chip Structure                                                                                   |  | TAIWAN
|429 |  | 200610111541.7 |  |  |  | Multi-Chip Stack Package Having Reduced Thickness                                                |  | CHINA 
|430 |  | 95122172       |  |  |  | Multi-Chip Stack Package Having Reduced Thickness                                                |  | TAIWAN
|431 |  | 200610109745.7 |  |  |  | Semiconductor Packaging Tape                                                                     |  | CHINA 
|432 |  | 95127400       |  |  |  | Semiconductor Packaging Tape                                                                     |  | TAIWAN
|433 |  | 95139571       |  |  |  | Stacked Chip Packaging with Heat Sink Struct                                                     |  | TAIWAN
|434 |  | 95127401       |  |  |  | High Frequency IC Package for Uniforming Bump-Bonding Height and Method for Fabricating the Same |  | TAIWAN
|435 |  | 95127402       |  |  |  | Pluggable Tape Type IC Package                                                                   |  | TAIWAN
|436 |  | 95137189       |  |  |  | FILM TYPE PACKAGE FOR FINGERPRINT SENSOR                                                         |  | TAIWAN
|437 |  | 95134884       |  |  |  | SEMICONDUCTOR PACKAGE TAPE WITH SCRAPE RESISTANCE AT SPROCKET HOLE SIDES                         |  | TAIWAN
|438 |  | 95134882       |  |  |  | WIRING TAPE FOR CHIP-ON-FILM PACKAGES                                                            |  | TAIWAN