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UNITED STATES
SECURITIES AND EXCHANGE COMMISSIONWashington, D.C. 20549

FORM 10-K

ý

ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934For the Fiscal Year Ended December 31, 2009oro

TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934Commission File Number: 000-51448


HITTITE MICROWAVE CORPORATION(Exact name of registrant as specified in its charter)

DELAWARE(State or other jurisdiction of
incorporation or organization)

04-2854672(I.R.S. Employer
Identification No.)20 ALPHA ROAD
CHELMSFORD, MA 01824(Address of principal executive offices)Telephone Number: (978) 250-3343
Securities registered pursuant to Section 12(b) of the Act:




Title of Each Class

Name of Each Exchange on Which RegisteredCommon Stock, $.01 par value

The Nasdaq Stock Market, LLC
(Nasdaq Global Select Market)Securities registered pursuant to Section 12(g) of the Act:None.Title of each class


Indicate
by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities
Act. Yes ý    No o

Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Exchange
Act. Yes o    No ý

Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of
1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past
90 days. Yes ý    No o

Indicate by check mark whether the registrant has submitted electronically and posted on its corporate web site, if any, every Interactive Data File required to be
submitted and posted pursuant to Rule 405 of Regulation S-T during the preceding 12 months (or for such shorter period that the registrant was required to submit and
post such files). Yes o    No o

Indicate by check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S-K is not contained herein, and will not be
contained, to the best of registrant's knowledge, in definitive proxy or information statements incorporated by reference in Part III of this Form 10-K or any amendment to
this Form 10-K. o

Indicate by check mark whether the registrant is a large accelerated filer, an accelerated filer, a non-accelerated filer or a smaller reporting
company. See definition of "large accelerated filer," "accelerated filer" and "smaller reporting company" in Rule 12b-2 of the Exchange Act.

Large accelerated filer ý

Accelerated filer o

Non-accelerated filer o (Do not check if a smaller
reporting company)

Smaller reporting company o


Indicate
by check mark whether the registrant is a shell company (as defined in Rule 12b-2 of the Exchange
Act). Yes o    No ý

The aggregate market value of the voting and non-voting common equity held by non-affiliates as of June 30, 2009 was $767,841,456.

As
of February 15, 2010 there were 30,215,719 common shares outstanding.

Documents Incorporated by Reference

Portions of the definitive Proxy Statement for the 2010 Annual Meeting of Shareholders to be filed with the Securities and Exchange Commission on or before
April 30, 2010 are incorporated by reference in Part III of this Annual Report on Form 10-K.



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HITTITE MICROWAVE CORPORATION        FORM 10-K        FOR THE FISCAL YEAR ENDED DECEMBER 31, 2009        INDEX



PART IItem 1.

Business


2Item 1A.

Risk Factors


21Item 1B.

Unresolved Staff Comments


35Item 2.

Properties


35Item 3.

Legal Proceedings


36Item 4.

Submission of Matters to a Vote of Security Holders


36PART IIItem 5.

Market for Registrant's Common Equity, Related Stockholder Matters and Issuer Purchases of Equity Securities


37Item 6.

Selected Financial Data


39Item 7.

Management's Discussion and Analysis of Financial Condition and Results of Operations


40Item 7A.

Quantitative and Qualitative Disclosures About Market Risk


52Item 8.

Financial Statements and Supplementary Data


53Item 9.

Changes in and Disagreements With Accountants on Accounting and Financial Disclosure


53Item 9A.

Controls and Procedures


53Item 9B.

Other Information


54PART IIIItem 10.

Directors, Executive Officers and Corporate Governance


55Item 11.

Executive Compensation


55Item 12.

Security Ownership of Certain Beneficial Owners and Management and Related Stockholder Matters


55Item 13.

Certain Relationships and Related Transactions and Director Independence


55Item 14.

Principal Accountant Fees and Services


55PART IVItem 15.

Exhibits and Financial Statement Schedules


56Signatures


58


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PART I

Item 1.    Business

Our Company

We design and develop high performance integrated circuits (ICs) modules and subsystems for technically demanding radio frequency (RF)
microwave and millimeterwave applications. As a result of our 25 years of experience and innovation, we have developed a deep knowledge of analog, digital and mixed-signal semiconductor
technology, from the device level to the design and assembly of complete subsystems. Our fabless business model enables us to leverage our broad engineering, assembly and test capabilities and our
intellectual property portfolio, including our semiconductor modeling expertise and library of proprietary circuit designs.

Industry Background

Growth in advanced electronic systems using RF, microwave and millimeterwave technology

Global demand for mobile communication services and for real-time access to diverse types of data continues to increase.
This demand, coupled with the increasing capabilities and decreasing cost of computing devices, has led to rapid adoption of a wide variety of advanced electronic systems that rely on electromagnetic
waves for high speed data transmission, reception or acquisition. These systems utilize a variety of data transmission technologies over a wide range of electromagnetic frequency bands, including RF,
microwave and millimeterwave frequencies. These advanced electronic systems are integral to wireless networks such as cellular telephone, fixed wireless and satellite communication systems, as well as
wired networks such as cable TV, broadband access and optical data networks. In addition, an increasing number of automotive, industrial, military, homeland security, scientific and medical
applications use RF, microwave and millimeterwave technology to perform detection, measurement and imaging functions. All of these applications increase the demand for high speed networking equipment.
The growth of advanced electronic systems using RF, microwave and millimeterwave technologies has accelerated demand for analog, digital and mixed-signal ICs, modules and subsystems that are optimized
to provide high performance signal processing across the electromagnetic frequency spectrum.

The electromagnetic frequency spectrum

The terms RF, microwave and millimeterwave refer generally to electromagnetic waves that are propagated when an alternating current is
applied to an antenna or conductor. The properties and uses of electromagnetic energy depend on its frequency. Each type of system typically uses a different frequency range, or band, of the frequency
spectrum. For example:



Access
to specific bands of the frequency spectrum is limited due to spectrum capacity constraints. Frequency use is regulated globally by government agencies, which assign each type of
communication service to one or more specific frequency bands. Growth in the volume of communications traffic, and

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increasing
demand for services such as multimedia that require higher data rates and consequently consume greater bandwidth, have resulted in more extensive use of the frequency spectrum.

Congestion
of the limited available frequency bands is driving the electronics industry to develop more creative and efficient uses of available frequency spectrum. For example, some
applications, such as
newer 3G and 4G cellular telephone systems, have migrated to higher frequencies, which are inherently able to provide higher data transfer rates. Other applications, such as broadband wireless local
loop applications, and cellular telephone systems being deployed in developing nations, take advantage of recently introduced modulation schemes to utilize lower frequency bands more efficiently.
Still others, such as emerging ultra wide band systems, use new system architectures and complex modulation schemes to distribute data over the entire frequency spectrum. The implementation of these
more complex system architectures and modulation schemes, and their distribution over a wider portion of the frequency spectrum, increase the technical challenges associated with the design and
manufacture of ICs, modules and subsystems used in these systems.



The
need for advanced electronic systems offering improved functionality, reliability and speed has intensified the challenges faced by original equipment manufacturers (OEMs) that
design and develop these systems. Many OEMs do not have the IC design or semiconductor process expertise necessary to develop their own ICs, modules and subsystems for RF, microwave and
millimeterwave applications. As a result, they increasingly look to qualified merchant suppliers to provide this expertise and these solutions and, in many cases, to design and manufacture custom
products to meet their application-specific requirements.

Across
all markets, OEMs seek semiconductor suppliers that provide technology that will enable them to differentiate their product offerings with respect to a number of criteria,
including:

High performance.OEMs face continuously increasing competitive pressures to improve their products' overall system performance.
As a result,
OEMs require advanced semiconductor products that offer performance attributes such as higher power and linearity, lower noise, reduced power consumption, improved signal level and frequency
accuracy and better isolation.

High reliability.OEMs seek suppliers with a demonstrated track record of delivering high quality products that will perform
reliably for long
periods of time under a variety of conditions. Manufacturers of advanced electronic systems used in certain commercial, military and aerospace applications have particularly stringent reliability
requirements that mandate specialized design and manufacturing, quality assurance and testing processes.

Increased integration.Under constant pressure to offer their customers lower prices, OEMs seek to
simplify their assembly operations and reduce their manufacturing costs by using more highly integrated components that combine multiple functions, thereby reducing design complexity, component count
and system size.

Streamlined procurement processes.OEMs desiring to streamline their procurement processes seek suppliers with the proven ability
to provide a
broad range of products covering the full range of functions required for the design and manufacturing of high performance electronic systems that operate across the frequency spectrum.

Faster time to market.OEMs seek to shorten their product development cycles by outsourcing the highly specialized task of
designing and
manufacturing RF, microwave and millimeterwave semiconductor products. Additionally, they select vendors that have strong manufacturing and product fulfillment capabilities and can meet short delivery
lead time requirements.

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An
OEM's requirements may vary by market and application. In a particular application, an OEM may seek a highly integrated subsystem, while for another application the same OEM may
prefer a single function IC that offers a specific performance attribute. A manufacturer of systems designed for consumer markets may require a supplier that can meet high volume manufacturing
requirements, while that same manufacturer, when addressing military or aerospace markets, may require relatively low volumes of highly specialized, high value subsystems.

Challenges of developing ICs for manufacturers of advanced electronic systems

Advanced electronic systems typically rely upon a complex chain of analog and digital signals. Conversion of continuously varying
real-world analog signals to binary digital form, and vice versa, and other signal transformations are known as signal processing functions. Semiconductor devices that combine analog and
digital signal processing are referred to as mixed-signal ICs. The performance of an advanced electronic system depends substantially on the performance of the analog and mixed-signal ICs that provide
its core functionality. Significant challenges are involved in designing and manufacturing analog and mixed-signal ICs that will operate satisfactorily at RF, microwave and millimeterwave frequencies,
including the following:

RF, microwave and millimeterwave circuit design.RF, microwave and millimeterwave circuit design requires an understanding of complex
electromagnetic
and mathematical theory. Success in this field requires a combination of advanced scientific study and practical experience in implementing design techniques. Performance characteristics such as
linearity and efficiency that are critical to electronic communications are more difficult to achieve at RF, microwave and millimeterwave frequencies. Unlike digital circuits, the performance of
analog and mixed-signal circuits operating at these frequencies is affected by temperature, power supply and other external factors, as well as by the interaction of adjacent circuit elements. The
design of an analog or mixed-signal circuit requires a sophisticated understanding of the complex interaction of all of these variables and the ability to predict, or model, the behavior of the IC
under a variety of conditions.

Semiconductor device modeling.Creating an accurate device-level model of a semiconductor is fundamental to successful circuit design,
particularly
when the circuit is to be used at higher frequencies. The ability to predict the performance of a device manufactured using a particular process is necessary to enable a designer to modify the circuit
design in order to meet the customer's requirements. Accurate device modeling requires the ability to measure and predict the behavior and interaction of the active and passive elements on a
semiconductor under a range of conditions, including temperature, input power levels, frequency and voltage. Device modeling requires specialized skills and equipment, and engineers often develop
proprietary methods to measure and validate the accuracy of their models. Because modeling is an iterative process, the accuracy, and thus the value, of device models increases with experience in
using them over time.

Integration.Advances in gallium arsenide (GaAs) and silicon semiconductor technology have enabled higher degrees of integration in the
design and
manufacture of semiconductor devices. For example, analog and digital signal processing can now be combined on a single monolithic microwave integrated circuit (MMIC) or system on a chip (SOC). It has
also become possible to combine multiple MMICs into a multi-chip module (MCM), which integrates multiple functions required by an advanced electronic system into a single compact package.
Because MCMs can combine MMICs manufactured under different semiconductor process technologies, they can take advantage of the process technology that is best suited for each function. Higher degrees
of integration can also be attained through the assembly of a number of MCMs into subsystems that provide greater functionality and can be more easily incorporated into an OEM's product.

The
benefits of higher integration to an OEM can include superior performance, higher reliability, smaller form factor, lower parts count and simplified assembly processes. However, in
order to deliver

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the
benefits of higher integration to an OEM effectively, a semiconductor supplier must possess a broad range of engineering capabilities, including expertise in device modeling and the ability to
optimize IC design and component interfaces based on system-level knowledge. The necessary capabilities also include the ability to manage the thermal, mechanical and package engineering issues that
affect the performance of a highly integrated system, as well as the capability to perform more complex assembly and test operations.

As
a result of all these factors, the knowledge and skills required to design integrated analog and mixed-signal devices operating at higher frequencies are highly specialized and can
take many years to develop. We believe that a significant market opportunity exists for a supplier of high performance ICs, modules and subsystems optimized for RF, microwave and millimeterwave
applications that can meet OEMs' diverse requirements.

Our Competitive Strengths

Our key competitive strengths as we address market opportunities include:



Advanced RF, microwave and millimeterwave engineering capabilities.We have developed broad expertise in a number of disciplines
that are critical to
the design and manufacture of ICs, modules and subsystems for technically demanding RF, microwave and millimeterwave applications. These include:



Our
knowledge of analog and mixed-signal semiconductor technology, from the device level to the design and assembly of subsystems and instruments optimized for RF, microwave and
millimeterwave applications, enables us to deliver high performance, high value products to our customers.

Ability to optimize circuit design and semiconductor process and packaging technologies to meet customers' application requirements.Based on
customers' requirements, we select the foundry and semiconductor process that we believe will provide the best combination of performance attributes and form factor for use in that application. We
also have expertise in a range of industry standard and proprietary packaging technologies. Our fabless business model and broad engineering expertise enable us to optimize our product designs using
the semiconductor process and packaging technology that best address our customers' needs.

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Broad product portfolio.We offer a broad range of standard and custom ICs, modules and subsystems that perform a variety of
functions across the RF,
microwave and millimeterwave frequency bands. At December 31, 2009, we had more than 800 standard products spanning 24 product lines:



We
offer our products in a wide variety of packaging formats, modules and subsystems facilitating their use in a broad range of applications. We have the ability to rapidly design,
prototype and commence volume production of our products, assisting our customers in meeting their time-to-market requirements. We introduced four new product lines in each of
2009 and 2008, and three new product lines in 2007. We introduced 83 new standard products in 2009, 100 in 2008 and 152 in 2007, and also added custom products in comparable numbers during those
years.

Diverse customer base, end markets and applications.The diversity of our customers, end markets and applications provides us
with multiple long-term
growth opportunities. In 2009, we sold our products to approximately 3,000 commercial and U.S. government customers for use in a variety of applications and end markets worldwide. Our principal end
markets include:

Automotive



telematics and GPS systems

collision avoidance, blind spot detection and intelligent cruise control

pre-collision sensorsBroadband



cable TV and cable modems

direct broadcast satellite

fixed and mobile wireless networks


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Cellular infrastructure



cellular telephone base stations and repeaters

E911 and GPS location systems

handheld radios and other mobile voice and data devicesFiber optics



communications infrastructure

fiber optic test equipment

data communications equipmentMicrowave and millimeterwave communications



high and low capacity point-to-point and multi-point radio systems

commercial very small aperture terminal (VSAT) systems

short range local area networksMilitary



communications systems

radar, guidance and electronic countermeasure systems

sensing and detection platformsSpace



communication and imaging payloads

command, control and communications for commercial, scientific and military spacecraftTest and measurement



medical and industrial imaging systems

homeland security systems

telecommunications test equipment

scientific and industrial equipment


Many
of our standard products are purchased by a variety of customers in different markets for use in numerous types of applications. We believe that the diversity of our customers, end
markets and applications helps to mitigate the impact on our business of fluctuations in demand from any particular customer or industry.

Multi-channel sales and support capabilities.Due to the technical nature of our products and markets, we utilize a
multi-channel sales and support
model that is intended to facilitate our customers' evaluation and selection of our products. Our sales and support channels include our direct sales force, our applications engineering staff, our
worldwide network of independent sales representatives, a distributor and our website.

We
have established flexible sales and support capabilities. For example:



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We
believe that our multi-channel approach to sales and technical support encourages the selection of our products, results in high customer satisfaction and leads to repeat sales.

Our fabless business model.We outsource wafer manufacturing to multiple third party fabricators and foundries. We believe that
this fabless business
model and our expertise in a wide range of semiconductor process technologies enables us to develop products using the technology most appropriate for our customers' applications. We believe that
investing in our core design and engineering competencies, including advanced RF, microwave and millimeterwave circuit design, device modeling, system-level engineering and packaging engineering,
while outsourcing the capital-intensive task of semiconductor fabrication, best enables us to meet the needs of our customers.

Products

We design, develop and sell high performance analog and mixed-signal ICs, modules and subsystems used in technically challenging RF,
microwave and millimeterwave applications. We offer a broad range of radio frequency integrated circuits (RFICs), MMICs, MCMs and subsystems that perform a variety of signal processing functions and
that operate across the RF, microwave and millimeterwave frequency spectrum. Our products are used in a wide range of wired and wireless communications applications, such as cellular telephone base
stations, microwave and millimeterwave radio systems, broadband wireless access systems and direct broadcast satellite systems. They are also used in detection, measurement and imaging applications
including military communication, targeting, guidance and electronic countermeasure systems, commercial, scientific and military spacecraft, automotive collision avoidance systems, medical imaging
systems and industrial test equipment.

We
offer standard products and custom products. We develop standard products from our own specifications and offer them for sale through our direct sales organization and network of
sales representatives, a distributor and our website. We currently offer more than 800 standard products. Our strategy in developing standard products is to introduce high performance products that
will be valued by customers for their ability to address technically challenging applications, rather than to offer commodity ICs for use in high volume applications where cost, rather than
performance, is the highest priority. We believe that many of our standard products offer a combination of form factor, functionality and performance attributes that are not available from any other
vendor. The standard products listed in our catalog generally are purchased by multiple customers for use in a variety of applications.

We
also develop custom products to meet the specialized requirements of individual customers. Our custom products are not listed in our catalog and are sold by our direct sales force,
which works with customers and prospective customers to have our products selected and designed into our customers' systems and programs. Our custom products generally are purchased by the customer
for which they were developed.



We currently provide standard and custom semiconductor products spanning 24 product lines. Our product lines include most of the
functional circuit blocks required to create both receiver and transmitter subsystems for any RF, microwave or millimeterwave application.

Many
of our products are designed to perform across numerous frequency bands, making them useful for diverse applications. We also offer products that optimize particular performance
attributes required in specific applications. These products are offered in a variety of packaging formats, including

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bare
die, surface mount packages and connectorized modules. Our current product line offerings are as follows:

1.    Amplifiers.Amplifiers boost the gain, or power, of an RF, microwave or millimeterwave signal. We offer a
broad line of amplifiers,
including:



2.    Attenuators.Attenuators are used to reduce the power of a RF, microwave or millimeterwave signal in specific
controlled amounts
without distorting the signal quality. For example, to avoid overloading a base station's receiving circuitry as a mobile transmitter approaches a base station or tower, an
attenuator is used in the receiver to optimize the received signal for processing. Our portfolio of standard attenuators is classified into two types:



3.    Data converters.Data converters are used to convert signals between analog and digital format. Currently our
product line
includes:



4.    Dielectric Resonator Oscillator.An oscillator is a device that produces a RF, microwave or millimeterwave
frequency. A dielectric
resonator oscillator (DRO) is a class of oscillator in which the output frequency is mechanically stabilized over a very narrow range by a resonating dielectric material. Our DRO products are
optimized for military, test equipment and industrial/medical equipment applications, and are characterized by their low phase noise, low temperature drift and robust packaging.

5.    Frequency dividers and detectors.Frequency dividers, also called prescalers, and phase-frequency detectors
are used in frequency
generation circuits, or synthesizers, to help process and

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distribute
the carrier frequency of the system. We offer a full range of frequency dividers and phase-frequency detectors. Our standard dividers and detectors include:



6.    Frequency multipliers.Frequency multipliers are used in frequency generation circuits, or synthesizers, to
increase by a
predetermined factor the carrier frequency and to help distribute it throughout the system. We offer a full range of active and passive frequency multiplier standard products,
including:



7.    High Speed Comparators.A high speed comparator is a device that constantly monitors signal levels at its
inputs. The device
generates a digital output signal based on the difference in amplitude of the input signal levels. Our high speed comparators are optimized for high speed military, test equipment and
industrial/medical equipment applications and exhibit low propagation dispersion, short minimum detectable pulse widths and low power consumption.

8.    High speed digital logic products.High speed digital logic products are used to select, split, invert, route,
 multiply or delay high
speed digital signals. High performance digital systems require these functions to route the signal throughout a digital backplane. Our high speed digital logic products can support digital signals
which propagate at speeds of 13, 26 and 40 gigabits per second (Gb/s), which makes them suitable for OC-48, OC-192 and OC-768 applications. These products contain functions such as clock dividers, NRZ
to RZ converters, XOR and NAND logic gates, flip-flops and 1:2 fanout buffers.

9.    Interface.Interface products are used in the digital or analog control of RF, microwave, and millimeterwave
integrated circuits. Our
first interface product converts a serial or parallel logic input to a six bit wide complementary output, and can be used to simplify the control of digital attenuators, digital phase shifters,
digital variable gain amplifiers and switch matrices.

10.    Limiting amplifiers.Limiting amplifiers increase the gain or power of an RF, microwave, millimeterwave or
digital signal, and have
the feature of adding more gain or power to low level signals, and less gain or power to high level signals. Our limiting amplifier product line is optimized for fiber optic communications and
features low jitter and high data rate capability.

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11.    Mixers and converters.Mixers, upconverters and downconverters are used to transform frequencies from a
higher frequency input to a
lower intermediate frequency, or vice versa, for easier processing of the RF, microwave or millimeterwave signal. The input signal is combined with a fixed carrier signal generated by a local
oscillator (LO) to produce the higher or lower output frequency. Our standard mixer and converter products include:



12.    Modulators and demodulators.Modulators are used in radio transmitters to combine a digital information
signal with an analog
carrier signal generated by an LO. Demodulators are used in radio receivers to extract the digital information signal from the analog carrier signal. Our modulators and demodulators address a variety
of modulation schemes and feature high linearity, low noise and wide bandwidth. Our standard modulator and demodulator products include:



13.    Oscillators.An oscillator produces an RF, microwave or millimeterwave frequency. The output frequency of our
voltage controlled
oscillators (VCOs) can be varied by an analog DC input control voltage. We offer three types of MMIC oscillators:



Our
standard VCO products cover the frequency spectrum of 2.0 to 26.8 GHz, while our custom VCOs cover frequency bands between 2.0 to 80.0 GHz. Our self-contained VCOs
integrate all necessary circuitry on a single chip, so that no external components are required.

14.    Passives.Our passive product line consists of 12 fixed attenuators which operate at frequencies up to
50 GHz. Fixed attenuators, or pads, are used to accurately reduce the power level of a signal without distorting the signal's characteristics.

15.    Phased lock loops.PLL integrated circuits are used in conjunction with oscillators in RF, microwave, and
millimeterwave signal
generation circuitry to accurately select and stabilize the frequency of transmitted and received signals. Our PLL products are designed to minimize noise, allow wide input bandwidth and provide
advanced features. Our PLL products coupled with our VCO products can offer customers state of the art signal generation performance.

16.    Phase lock loops with integrated voltage controlled oscillatorsA PLL with integrated VCO produces an RF, microwave or
millimeterwave
frequency. Our PLL with integrated VCO products

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combine
a fully integrated, low noise VCO, with an advanced PLL integrated circuit. Our single and tri-band PLL with integrated VCO products are optimized for RF and microwave signal
generation applications, and exhibit low phase noise, low spurious products and flexible programming capabilities.

17.    Phase shifters.Phase shifters are used to change the phase of an RF, microwave or millimeter wave signal
while providing little or
no amplitude change or distortion. High performance systems such as phased array radars, RF medical equipment, wide band electronic warfare receivers, and time domain systems require tight design
control over a signal's phase. These systems often rely on phase shifter components to maintain this control.



18.    Power ConditionersA power conditioner supplies DC power to an integrated circuit. Our power conditioner regulates the voltage
level
of a DC power supply, and removes unwanted noise and spurious products that can be detrimental to the performance of RF, microwave or millimeterwave integrated circuits. Our first power conditioner
product is optimized for frequency generation applications and provides four independent regulated outputs with excellent power supply rejection ratio (PSRR).

19.    Power detectors.Power detectors convert RF signals to DC voltages that can be measured by simple digital
circuitry. These devices
convert power levels from logarithmic to linear voltages.

20.    Sensors.Our sensors use RF, microwave and millimeterwave energy to detect, measure or form an image of an
object. These sensor ICs
integrate multiple circuit functions and are effectively subsystems on a chip. For example, our single chip sensors are used for range detection in multiple military and commercial applications.

21.    Switches.Switches are used to route RF, microwave or millimeterwave signals from one or more input paths to
one or more output
paths. Control of the selected input and output signal path is achieved via digital logic input. Our switches are designed to reduce signal loss, minimize noise and interference, and operate at high
frequencies and power levels. Our standard switch products provide the following functionality:



22.    Synthesizers.Synthesizers generate a coherent set of RF, microwave or millimeterwave frequencies over a
specified range of
frequency and power. Synthesizers are generally used to generate the frequency that acts as a carrier for voice or data communication.

23.    Transimpedance Amplifiers.Transimpedance amplifiers are used between devices which have very different
levels of impedance or
resistance. Our transimpedance amplifier provides a differential

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output
voltage that is proportional to the current at its input, and is optimized for photodiode and fiber optic data communication applications.

24.    Variable gain amplifiers.Variable gain amplifiers (VGAs) boost the gain or power of a RF, microwave or
millimeterwave signal and
have the feature of allowing the user to set the gain or power at a specific level. Our variable gain amplifier MCMs utilize GaAs linear amplifiers, high performance six bit GaAs digital attenuators,
and CMOS silicon drivers.



Our highly integrated modules and subsystems leverage our extensive portfolio of standard and custom ICs with our knowledge of RF,
microwave and millimeterwave system design and our electrical, thermal and mechanical engineering expertise. Our modules and subsystems are mounted on either ceramic substrates or printed circuit
boards in self-contained metal housings. Products include:



Technology

We consider the following technologies to be important in the design and manufacture of our products.



We have expertise in designing RF, microwave and millimeterwave RFICs and MMICs using a variety of semiconductor manufacturing
processes. Different processes produce devices that have characteristic performance attributes that are particularly suitable for specific applications. In choosing the foundry, semiconductor material
and process technology to be used to manufacture a new product, we seek to optimize the match between the process technology and the desired performance parameters of the product.

Our
products are manufactured using GaAs and silicon semiconductor processes, including SiGe, Bi-CMOS and CMOS. We continuously investigate advanced GaAs- and silicon-based
processes that we believe may offer product performance advantages in RF, microwave and millimeterwave applications.



Interaction between an RF, microwave or millimeterwave semiconductor circuit and its package can significantly affect product
performance, particularly at high frequencies. Characteristics such as the ability of the package to dissipate heat produced by the semiconductor, or to withstand vibration, shock, high temperature
and humidity and other environmental conditions, are also critical in certain applications.

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We carefully match the circuit design, semiconductor process and packaging technologies and, where necessary, develop new packaging technologies to ensure the
product will perform as desired under the specified conditions. In this process, we use proprietary techniques to model the interaction between semiconductor and package, and our engineers make
appropriate adjustments in the design of both the semiconductor and its package to take account of that interaction. We consider our expertise in package, design and modeling to be one of our core
competencies and a key factor distinguishing us from our competitors.

We
offer our products in a wide variety of packaging formats, ranging from bare die to surface mount plastic and ceramic packages and highly integrated, chassis-mounted connectorized
subsystems. We offer plastic, ceramic and metal packaging formats, including many industry standard formats, as well as proprietary packaging technologies. Our microwave surface mount packages are
offered in either a hermetically sealed format for military, space and high reliability commercial applications or a non-hermetically sealed format for commercial communications and sensor
applications. Our highly integrated modules and subsystems are constructed utilizing a variety of formats including ceramic substrates or printed circuit boards mounted in self-contained
metal housings.

When
an application requires a standard packaging format, such as a product to be manufactured in large volumes using an industry standard plastic surface mount technology package, we
outsource the packaging step in the manufacturing process to a third-party supplier. We typically perform the packaging of high value ceramic and metal package components in our own facility utilizing
our automated wafer inspection, die attach and wire bond assembly equipment.



In response to environmental concerns, some customers and government agencies impose requirements for the elimination of hazardous
substances, such as lead (which is widely used in soldering connections in the process of semiconductor packaging and assembly), from electronic equipment. For example, in 2003, the European Union
(EU) adopted its Restrictions on Use of Hazardous Substances Directive (RoHS) Directive. Effective July 1, 2006, the RoHS Directive prohibits, with specified exceptions, the sale in the EU
market of new electrical and electronic equipment containing more than agreed levels of lead or other hazardous materials. We have a program in place to meet these customer and governmental
requirements, including the RoHS Directive, where applicable to us, by making available versions of our products that do not include lead or other hazardous substances.

Research and Development

We focus our research and development efforts on designing and introducing new and improved standard and custom products and on
developing new semiconductor device modeling and advanced RF, microwave or millimeterwave circuit design.

We
have made significant investments in our core engineering capabilities, including semiconductor device modeling and advanced RF, microwave and millimeterwave circuit design. Recently,
we expanded our digital software and hardware engineering capabilities to support our subsystem and instrumentation product development efforts. In the area of device modeling, we are expanding our
library of device models that measure and predict the performance of a transistor within a given circuit design and packaging technology. This allows us to select the process technology that provides
the best combination of performance attributes for use in a given application. Our circuit design efforts are focused on developing products that provide superior performance and reliability.

We
have four design centers, located in Chelmsford, Massachusetts; Colorado Springs, Colorado; Istanbul, Turkey; and Ottawa, Ontario, Canada. Our Chelmsford design center is the primary
location of our module, subsystem and instrument development efforts. The integrated circuit design and

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background
intellectual property licensed in 2007 from Northrop Grumman Space Technology sector is being used to further expand our millimeterwave product line.

We
continuously develop products using our own specifications, guided by input from our customers and end markets, that combine technological innovation and general application. Our team
of experienced engineers also works closely with many of our customers to develop and introduce custom products that address the specific requirements of those customers.

Sales, Marketing and Support

We sell our products worldwide through multiple channels, including our worldwide direct sales force and applications engineering
staff, our network of domestic and international independent sales representatives and our website. In addition, many of our standard products are available for sale in North America through our
distributor, Future Electronics. Each of these sales channels is supported by our customer service and marketing organizations. We have sales and customer support offices in the United States, China,
Germany, India, Japan, Korea, Sweden, and the United Kingdom. We intend to expand our sales and support capabilities and our network of independent sales representatives in key regions domestically
and internationally.

Our
direct sales force and applications engineers provide our customers with technical assistance regarding the selection and use of our products. We believe that maintaining a close
relationship with our customers and providing them with technical support improves their level of satisfaction and enables us to anticipate and influence their future product needs. We provide ongoing
technical training to our distributor and sales representatives to keep them informed of our existing and new products. Our website also provides our customers with on-line tools and
technical resources to help them select and use our products.

We
maintain an internal marketing organization that is responsible for the production and dissemination of sales and advertising materials, such as product announcements, press releases,
brochures, magazine articles, advertisements and cover features in trade journals and other publications and our product catalog. We participate in public relations and promotional events, including
industry tradeshows and technical conferences. Our marketing organization is also responsible for the content and maintenance of our website.

Manufacturing

We design and develop our proprietary products and utilize third-party foundries to manufacture the semiconductors used in our
products. In some cases, we use third-party suppliers to assemble our products. Outsourcing many of our manufacturing and assembly activities,
rather than investing heavily in capital-intensive production facilities, provides us with the flexibility to respond to new market opportunities, simplifies our operations and significantly reduces
our capital requirements.

We
currently utilize a wide range of semiconductor processes to develop and manufacture our products, although each of our foundries tends to use a particular process technology in the
production of its semiconductor wafers. Based on the requirements of a particular product, we choose the foundry and semiconductor process that we believe will provide the best combination of
performance attributes for use in that product. For most of our products, we use a single foundry for the production of the semiconductor wafer. Our principal foundries are Cobham, Global
Communications Semiconductors, IBM, Jazz Semiconductor, Northop Grumman, Taiwan Semiconductor Manufacturing Company (TSMC), Telefunken Semiconductor, TriQuint Semiconductor, United Monolithic
Semiconductors (UMS) and WIN Semiconductors. We are actively engaged with these and other foundries to develop device models and intellectual property which can be included in our future production or
research and development programs. Because the quality and reliability of our products is critical, we carefully qualify each of our foundries and processes before applying the technology to a
production program.

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For
most of our products, the production process begins with a GaAs or silicon semiconductor substrate, or wafer. The foundry that we select to manufacture a particular product utilizes
a set of masks that are generated from our proprietary circuit layout designs. Completed wafers or die are shipped by the foundry to us or to our third-party packaging vendors. Depending on the
application, the integrated circuit may be sold as bare die or assembled into an injection molded plastic package or a ceramic or metal package or housing, using a wide variety of packaging
technologies. Standard plastic packaged parts are assembled by third-party suppliers located primarily in Asia and the United States, while packaging of high value package components is performed
primarily at our Chelmsford facility. We utilize contract manufacturers to produce complex printed circuit board assemblies for certain military and commercial subsystems and instruments. Following
the assembly process, we perform a final test for validation, inspection and quality assurance purposes on all finished products before they are shipped to our customers.

Our
Chelmsford facility contains class 100K clean rooms certified for commercial, military and space level product manufacturing. Our networked material requirements planning
documentation and test data acquisition systems enable us to track materials throughout our suppliers and our own facility, as well as schedule production activities and shipments based on customer
demand. We utilize automated and manual test stations for each of our numerous package types, driven by proprietary test equipment configurations and software. Our manual and automatic hybrid assembly
equipment includes die shear and bond pull inspection equipment, die inspect/pick, die/substrate attach and wire bond functions. We are capable of testing our products from DC up to 110 GHz,
utilizing our automated and semi-automated RF, microwave and millimeterwave equipment.

We
conduct environmental screening on production material, including tests such as temperature cycling and temperature shock, constant acceleration, mechanical vibration and shock,
liquid and ambient burn-in, fine and gross hermeticity leak test and particle impact noise detection. Our reliability test equipment includes high temperature life-test
equipment, highly accelerated stress test and infrared reflow testing and acoustic sonic scanning, as well as field emission scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS)
capability.

Quality Assurance

We are committed to maintaining the highest level of quality in our products. Our objective is that our products meet all of our
customer requirements, are delivered on-time and function reliably throughout their useful lives. As part of our total quality assurance program, our quality management system has been
certified to ISO 9001 since 1997 and is ISO 9001:2000 certified. The ISO 9001:2000 standards provide models for quality assurance in design and development, production,
installation and servicing. This level of quality certification is required by many of our customers. Recently, we expanded our quality initiatives and certifications to include S20.20 electrostatic
discharge (ESD) management system certification and AS-9100 aerospace certification. These certifications evidence the fact that our operating policies and procedures satisfy industry
requirements for our products' ESD protection and aerospace manufacturing controls. Many of our customers involved in the manufacture of systems used in military and aerospace applications have
particularly stringent reliability requirements that mandate specialized manufacturing, quality assurance and testing processes. To meet these specialized needs, we have processes in place to
manufacture parts to the requirements of MIL-PRF-38543/38535.

Competition

The markets for our products are highly competitive and are characterized by rapid technological change and continuously evolving
customer requirements. We compete primarily with other suppliers of high performance analog and mixed-signal semiconductor components used in RF, microwave and millimeterwave applications. Because of
the breadth and diversity of our product lines and end

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markets,
our competition is fragmented, and there is no principal competitor that we encounter in most or all of our markets. Our competitors include large, diversified semiconductor manufacturers
with broad product lines, such as Avago, Analog Devices, Eudyna, Linear Technology, NEC, RFMD, Skyworks, TriQuint Semiconductor and UMS. We also encounter competition from manufacturers of advanced
electronic systems that also manufacture semiconductor components internally. Some of our
competitors, such as NEC, are also our customers. Additionally, in certain product categories we compete with semiconductor manufacturers from which we also obtain foundry services, including TriQuint
Semiconductor and UMS.

Many
of our existing competitors have significantly greater financial, technical, manufacturing and marketing resources than we do and might be perceived by prospective customers to
offer financial and operational stability superior to ours. This is particularly true of competitors in the markets for silicon-based products. We expect competition in our markets to intensify, as
new competitors enter the RF, microwave and millimeterwave component market, existing competitors merge or form alliances, and new technologies emerge.

Intellectual Property

We seek to protect our proprietary technology under United States and foreign laws affording protection for trade secrets, and to seek
United States and foreign patent, copyright and trademark protection of our products and developments where appropriate. We rely on trade secrets, patents, technical know-how and other
unpatented proprietary information relating to our product development and manufacturing activities. We seek to protect our trade secrets and proprietary information, in part, by requiring our
employees to enter into agreements providing for the maintenance of confidentiality and the assignment of rights to inventions made by them while employed by us. We also enter into
non-disclosure agreements with our consultants, semiconductor foundries and other suppliers to protect our confidential information delivered to them.

We
believe that while the protection afforded by trade secret, patent, copyright and trademark laws may provide some advantages, our ability to maintain our competitive position is
largely determined by such factors as the technical and creative skills of our personnel, new product developments, and frequent product enhancements. There can be no assurance that our
confidentiality agreements with employees, consultants and other parties will not be breached, that we will have adequate remedies for any breach or that our trade secrets and other proprietary
information will not otherwise become known. There also can be no assurance that others will not independently develop technologies that are similar or superior to our technology or reverse engineer
our products. Additionally, the laws of countries in which we operate may afford little or no protection to our intellectual property rights.

Employees

As of December 31, 2009, we had 349 full-time employees, compared with 332 full-time employees at
December 31, 2008. We have never
experienced a work stoppage, and none of our employees is subject to a collective bargaining agreement. We believe that our current relations with our employees are good.

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Executive Officers and Directors of the Registrant

The following table sets forth certain information regarding our executive officers and directors.

Name

Age

PositionStephen G. Daly


44

Chairman of the Board, President and Chief Executive OfficerWilliam W. Boecke


58

Vice President, Chief Financial Officer and TreasurerEverett N. Cole III


48

Vice President of Hybrid ManufacturingWilliam D. Hannabach


47

Vice President of Global OperationsNorman G. Hildreth, Jr.


46

Vice PresidentDong Hyun (Thomas) Hwang


46

Vice President of SalesBrian J. Jablonski


50

Vice President of OperationsMichael A. Olson


49

Vice PresidentErnest L. Godshalk


64

Director (1)Rick D. Hess


56

Director (2)Adrienne M. Markham


58

Director (3)Brian P. McAloon


59

Director (4)Cosmo S. Trapani


71

Director (5)Franklin Weigold


71

Director (6)


(1)Member
of the Audit and Compensation Committees(2)Chairman
of the Nominating and Corporate Governance Committee and member of the Audit Committee(3)Member
of the Compensation and Nominating and Corporate Governance Committees(4)Member
of the Compensation and Nominating and Corporate Governance Committees(5)Chairman
of the Audit Committee(6)Chairman
of the Compensation Committee and member of the Nominating and Corporate Governance Committee. Mr. Weigold also serves as our Lead Director,
a position established by our Board of Directors in November 2009. Our Lead Director is a non-employee director, appointed by the Board, whose responsibilities are to preside over Board
meetings in the absence of the Chairman and lead executive sessions of the Board (i.e., sessions without management present); to act as a liaison between the independent directors and the
Chairman and facilitate discussions among the independent directors on key issues and concerns outside of Board meetings (without limiting the ability of any independent director to communicate
directly with the Chairman); and to work with the Chairman to set an appropriate calendar of Board meetings and develop the agendas for Board meetings. Our Lead Director has no role in the management
or operations of the Company, does not establish Company policy or strategy and, except as directed by the Board, does not act as a spokesman for the Company.


Stephen G. Dalyhas served as our President since January 2004, as our Chief Executive Officer since December 2004 and as our Chairman since
December
2005. Since joining Hittite in 1996, Mr. Daly has held various positions, including Director of Marketing, Director of Sales, Principal Sales Engineer and Applications Engineer. From 1992 to
1996, Mr. Daly held sales management positions at Alpha Industries and M/A-COM, which are RF and microwave semiconductor companies. From 1988 to 1992, Mr. Daly held various
microwave design engineering positions at Raytheon's Missile Systems

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Division
and Special Microwave Device Operations Division. Mr. Daly received a B.S. in Electrical Engineering from Northeastern University.

William W. Boeckehas served as our Chief Financial Officer and Treasurer since March 2001. From 1997 to 2001, Mr. Boecke served as Vice
President, Corporate Controller of PRI Automation, Inc., a supplier of semiconductor manufacturing automation systems. From 1991 to 1997, Mr. Boecke served as Director of Finance of LTX
Corporation, a developer of automated semiconductor test equipment. Mr. Boecke received a B.S. from St. John's University and an M.B.A. from Boston College, and is a Certified Public
Accountant.

Everett N. Cole IIIhas served as our Vice President of Hybrid Manufacturing since January 2010. From October 1997 to
January 2010, Mr. Cole served as our Director of Quality. From 1985 until joining Hittite in 1997, Mr. Cole held various quality engineering positions at Raytheon's Missile
Systems Division. Mr. Cole received a B.S. in Electrical Engineering from the University of Lowell and an M.S. in Manufacturing Management Science from the University of Massachusetts at
Lowell.

William D. Hannabachhas served as our Vice President of Global Operations since January 2010. Since joining Hittite in
February 2005, Mr. Hannabach has held various positions, including Director of Operations and Director of Programs. From 2003 to 2005, Mr. Hannabach was a Global Supply Chain
Strategy Program Manager at GE Healthcare. From 2000 to 2003, Mr. Hannabach was the Director of Project Management at the Surface Mount Division of Universal Instruments, a capital equipment
manufacturer for the printed wire board industry. From 1985 to 2000, Mr. Hannabach held various program and operations management positions at Lockheed Martin Corporation and GE Aerospace.
Mr. Hannabach received a B.S. in Mechanical Engineering from The Pennsylvania State University and an M.B.A. from Boston University.

Norman G. Hildreth, Jr.has served as Vice President since January 2010, managing research and development engineering. From January 2004 to
January
2010, Mr. Hildreth served as our Vice President of Sales and Marketing, and from February 2002 to January 2004, he served as our Director of Product Development. He was employed by Sirenza
Microdevices, a designer and supplier of RF components, from August 2000 to February 2002, as Vice President, Wireless Products, and Director of Fixed Wireless Products. From February 1992 to August
2000, Mr. Hildreth held various positions at Hittite including Director of Marketing, Director of Sales, Engineering Sales Manager and Senior Engineer. From 1985 to 1992 he held design
engineering positions at Adams-Russell, M/A-Com and ST Olektron. Mr. Hildreth received a B.S. in Electrical Engineering from the University of Massachusetts at Dartmouth.

Dong Hyun (Thomas) Hwanghas served as our Vice President of Sales since January 2010. Since joining Hittite in January 2002,
Mr. Hwang has held various positions, including Asia-Pacific Regional Sales Manager and Director of Sales. From 1997 to 2002, Mr. Hwang served as Country Manager for Korea
for M/A-COM. Mr. Hwang received a B.S in Electrical Engineering from Lehigh University and an M.S. in Electrical Engineering from Lehigh University.

Brian J. Jablonskihas served as our Vice President of Operations since December 2005. From May 2004 to December 2005,
Mr. Jablonski served as our Director of Operations. From 2003 until joining Hittite in 2004, Mr. Jablonski served as a Capital Planning Manager at Allegro Microsystems Corp., a supplier
of advanced mixed signal power IC semiconductors. From 2000 to 2003, he served as Materials Manager at M/A-Com and as the Director of Operations at Trebia Networks, a developer of storage
networking applications. From 1986 to 2000, he served in a number of management positions, including Director of Materials, for Unitrode Integrated Circuits, a manufacturer of analog and mixed signal
integrated circuits. Mr. Jablonski received a B.S. in Industrial Management from Northeastern University and an M.B.A. from New Hampshire College.

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Michael A. Olsonhas served as Vice President since January 2010, managing research and development engineering. From January 2008 to January 2010,
Mr. Olson served as our Vice President of Engineering. From March 1996 to January 2008, Mr. Olson held various positions at Hittite including Director of IC Engineering, Director of
Product Development, Sales Engineer and Applications Manager. From 1985 to 1996, Mr. Olson held various design engineering positions at Raytheon's
Microwave and Power Tube Division and Raytheon's Special Microwave Device Operations Division. Mr. Olson received a B.S. in Electrical Engineering from Lehigh University.

Ernest L. Godshalkhas served as a member of our board of directors since 2008. Mr. Godshalk is Managing Director of ELGIN Management Group, a
private investment company. From 2001 until his retirement in 2004, Mr. Godshalk served as President, Chief Operating Officer and a director of Varian Semiconductor Equipment
Associates, Inc., a manufacturer of semiconductor processing equipment. Previously, he served as Varian's Vice President and Chief Financial Officer. He is a director of Verigy Ltd. and
of GT Solar International Inc. Mr. Godshalk received his B.A. from Yale University in 1967 and his M.B.A. from Harvard University in 1969.

Rick D. Hesshas served as a member of our board of directors since 2005. Mr. Hess is currently the President and Chief Executive Officer of
Konarka Technologies, a developer of photovoltaic cells on plastic. From 2004 to 2006, Mr. Hess was Chief Executive Officer of Integrated Fuel Cell Technologies, Inc., a developer of
micro-fuel cell systems. From 1999 to 2004, Mr. Hess served as President of M/A-COM, a subsidiary of Tyco Electronics. Mr. Hess received a B.S. in Electrical
Engineering from Purdue University and an M.S. in Electrical Engineering from Johns Hopkins University.

Adrienne M. Markhamhas served as a member of our board of directors since 2008. Ms. Markham has been a director in the law firm of
Goulston & Storrs, a Professional Corporation, since 1991. Ms. Markham brings 25 years of experience focusing on employment and corporate litigation. She has been an advisor to
several bio-science and bio-tech firms. Ms. Markham received a B.S. in Education from Boston University and a J.D. from Suffolk University School of Law.

Brian P. McAloonhas served as a member of our board of directors since 2008. Mr. McAloon was, from 2001 to March 2008, Group Vice President
of the DSP and Systems Products Group of Analog Devices, Inc., a provider of semiconductors for high performance signal processing applications. He also served in a number of other roles at
Analog Devices, including Vice President, Sales, Vice President, Sales and MarketingEurope and Southeast Asia and General Manager, Analog Devices, B.V. Mr. McAloon received
his B.Sc. in Electronics and Electrical Engineering from Glasgow University.

Cosmo S. Trapanihas served as a member of our board of directors since 2000. From 2000 to 2002,
Mr. Trapani served as Vice President and Chief Financial Officer of PRI Automation, Inc. From 1999 to 2000, Mr. Trapani was Senior Vice President and Chief Financial Officer at
Circor International, Inc., a manufacturer of fluid control systems. From 1990 to 1998, Mr. Trapani was Executive Vice President and Chief Financial Officer of Unitrode Corporation, a
manufacturer of analog and mixed-signal integrated circuits. Prior to Unitrode Mr. Trapani was Vice President Finance for Instron Corporation, a testing products company, and Corporate
Controller and General Manager of Computervision CAD/CAM Division, an integrated computer systems company. Mr. Trapani was a member of the board of directors and Chairman of the audit committee
of Ibis Technology, a manufacturer of equipment for the semiconductor industry. Mr. Trapani is a Certified Public Accountant and has been a member of various societies including AICPA,
Massachusetts Society of CPAs, Board of Directors of Massachusetts Society of CPAs and Chapter President of IMA. Mr. Trapani received a B.S. from Boston College and was a Commanding Officer in
the U.S. Army.

Franklin Weigoldhas served as a member of our board of directors since 2003 and as our lead director since November 2009. From 1999 to 2003,
Mr. Weigold served as Vice President and General

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Manager
of The Micromachined Products Division of Analog Devices, Inc., and from 1992 to 1999 was Vice President and General Manager of its Transportation and Industrial Products Division.
Prior to joining Analog Devices, Mr. Weigold served as President and Chief Operating Officer of Unitrode Corporation. Previously, he was President of Silicon General Inc. Mr. Weigold is
also a member of the Board of Directors of Enpirion, Inc. and Siimpel Corp. Mr. Weigold received a B.S. in Electrical Engineering from Michigan Technological University and an M.B.A. from the
University of Pittsburgh.

Available Information

Our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q, Current Reports on
Form 8-K and amendments to reports filed or furnished pursuant to Sections 13(a) and 15(d) of the Securities Exchange Act of 1934, as amended, are available free of charge on
our website at www.hittite.com as soon as reasonably practicable after such reports are electronically filed with, or furnished to, the Securities and Exchange Commission. The information posted on
our website is not incorporated into this Annual Report.

Item 1A.    Risk Factors

The Private Securities Litigation Reform Act of 1995 contains certain safe harbor provisions regarding forward-looking statements. This
Annual Report on Form 10-K, and other information provided by us or statements made by our directors, officers or employees from time to time, may contain "forward-looking"
statements and information, which involve risks and uncertainties. Actual future results may differ materially. Statements indicating that we "expect," "estimate," "believe," "are planning" or "plan
to" are forward-looking, as are other statements concerning future financial results, product offerings or other events that have not yet occurred. There are several important factors that could cause
actual results or events to differ materially from those anticipated by the forward-looking statements. Such factors include those described below. Although we have sought to identify the most
significant risks to our business, we cannot predict whether, or to what extent, any of such risks may be realized. We also cannot assure that we have identified all possible issues which we might
face. We undertake no obligation to update any forward-looking statements that we make.

The recent global recession and related credit crisis has adversely affected our business, results of operations and financial condition.

The recent global recession has affected all sectors of the economy, resulting in declines in economic growth and consumer confidence,
increases in unemployment rates and uncertainty about economic stability. Global credit and financial markets have also experienced extreme disruptions, including diminished liquidity and credit
availability and rapid fluctuations in market valuations. Our business was significantly affected by these conditions during 2009. Although we have experienced three sequential quarters of revenue
growth and our backlog at December 31, 2009, increased compared to December 31, 2008, given weak economic conditions, there is no certainty that our business will continue to grow. These
uncertainties affect businesses such as ours in a number of ways, making it difficult to accurately forecast and plan our future business activities. Deteriorating economic conditions may lead
consumers and businesses to reduce or postpone spending, which may cause our customers to cancel, decrease or delay their existing and future orders with us. The inability of customers to obtain
credit could negatively affect our revenue and our ability to collect receivables. In addition, financial difficulties experienced by our suppliers, independent sales representatives or distributor
could result in product delays, increased accounts receivable defaults and inventory challenges. If the recent uncertain economic conditions continue or deteriorate, we may recognize charges relating
to restructuring costs or the impairment of assets. These trends could have a material adverse impact on our business, our

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ability
to achieve targeted results of operations and our financial condition as a result of, among other things:



Our efforts to control operating expenses during the recent global recession may to some extent have adversely affected our ability to maintain our competitive position and
meet operational challenges.

Effectively managing our operations and maintaining our competitiveness while continuing to deliver acceptable financial performance in
this environment represents a significant challenge. In light of the recent global recession, we took steps early in 2009 to reduce expenses across our business and maintained certain of these
measures throughout the year. These expense control measures may to some extent have adversely affected our ability to meet our product development targets and make necessary improvements to our
operational, financial and information technology organizations and systems.

Our quarterly revenue and operating results are difficult to predict accurately and may fluctuate significantly from period to period. As a result, we may fail to meet the
expectations of investors, which could cause our stock price to decline.

We operate in a highly dynamic industry and our future results could be subject to significant fluctuations, particularly on a
quarterly basis. Our quarterly revenue and operating results have fluctuated significantly in the past and may continue to vary from quarter to quarter due to a number of factors, many of which are
not within our control. Although some of our customers, such as those who serve the military and space industries, place long-term orders with us or provide us with forecasts of their
future requirements for our products, a significant percentage of our revenue in each quarter is dependent on sales that are booked and shipped during that quarter, typically attributable to a large
number of orders from diverse customers and markets, which we refer to as our turns business. Accurately forecasting our turns business and our total revenue in any quarter is difficult. In addition,
our business is being adversely affected by recent global economic factors, which has made it more difficult for our customers and for us to forecast our near term results. If our operating results do
not meet our publicly stated guidance, if any, or the expectations of investors, our stock price may decline. Additional factors that can contribute to fluctuations in our operating results
include:



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Due
to these and other factors, quarter-to-quarter comparisons of our historical operating results should not be relied upon as accurate indicators of our future
performance.

Our financial results are exposed to the cyclicality of the semiconductor industry.

The recent global recession reduced demand in the semiconductor industry as well as numerous other industries. In addition to being
subject to such broad, macroeconomic conditions, the semiconductor industry is particularly cyclical and has historically experienced significant fluctuations in supply and demand, resulting in
product overcapacity, high inventory levels and accelerated erosion of average selling prices, which may occur even during periods of growth in the broader economy. These conditions have sometimes
lasted for extended periods of time. Downturns in many sectors of the electronic systems industry have in the past contributed to weak demand for semiconductor products. We experienced slower growth
during periods of weak demand in the past, and our business may be adversely impacted by any downturns in the future. Future downturns in the electronic systems industry could adversely impact our
revenue and harm our business, financial condition and results of operations.

Our gross margin fluctuates from period to period, which affects our results of operations.

Our gross margin has fluctuated on a quarterly basis. For example, our quarterly gross margin since the first quarter of 2006 has
ranged from a low of 70.1% to a high of 74.8%. A number of factors can cause our gross margin to fluctuate from period to period. Our gross margin in any period is significantly affected by industry
demand and the intensity of competition in the markets into which we sell our products. Our gross margin is also significantly affected by product mix, that is, the percentage of our revenue in that
period that is attributable to higher or lower margin products, and by pricing, including fluctuations in the relative proportion of high volume orders, on which we offer higher discounts. Additional
factors affecting our gross margin include changes in the cost of wafers and materials, the timing of indirect costs for pre-production masks and evaluation materials, project cost
variations on customer-funded contracts, changes in overhead absorption rates and other manufacturing efficiencies, and other factors, some of which are not under our control. Our margin also can be
substantially affected by changes in our manufacturing yields. Our yields depend on many factors that we control, such as product design and the effectiveness of our own assembly and test operations,
but they are also affected by the activities of third parties, such as the foundries and packaging subcontractors that supply us with critical materials and services, that are beyond our control. As a
result of these or other factors, we may be unable to maintain or increase our gross margin in future periods. A significant decrease in our gross margin would affect our profitability and likely have
an adverse effect on our stock price.

If we fail to develop new products that achieve market acceptance or fail to introduce new products that enable us to address additional markets, our operating results could
be adversely affected.

The markets for our products are characterized by frequent new product introductions and changes in product and process technologies.
The future success of our business and continued growth in our revenue will depend on our ability to develop new products for existing and new markets, introduce

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these
products in a cost-effective and timely manner and have our products designed into the products of OEMs. The development of new high performance semiconductor ICs, modules and
subsystems is highly complex, and from time to time we may experience delays in completing the development and introduction of new products or fail to efficiently manufacture such products in the
early production phase. As the complexity and degree of integration of our products increases, maintaining or increasing our historical rate of new product introductions will become increasingly
challenging. Our ability to successfully develop, manufacture, introduce and deliver new types of high performance semiconductor ICs, modules and subsystems will depend on various factors, including
our ability to:



Furthermore,
a newly introduced standard product generally has little immediate impact on our revenue. A new standard product may not generate meaningful revenue for two or more years,
if ever. In the meantime, we will have incurred expenses to design and produce the product, and we may not recover these expenses if demand for the product fails to reach forecasted levels.

We depend on third-party suppliers, including our foundries and packaging subcontractors, for components, materials and services that are critical to the manufacture of our
products, which makes us susceptible to shortages, price fluctuations and quality risks that could adversely affect our operating results.

We purchase a number of the key components and materials used in our products from sole source suppliers. For example, we obtain all
the semiconductor wafers used in our products from third-party wafer fabrication facilities, known as foundries. Our principal third-party foundries include Cobham in Virginia, Global Communications
Semiconductors in California, IBM in Vermont, Jazz Semiconductor in California, Northrop Grumman in California, Telefunken Semiconductors in Germany, TriQuint Semiconductor in Oregon, TSMC in Taiwan,
UMS in France and WIN Semiconductors in Taiwan. We typically rely on a single foundry for the production of the wafer used in a particular product. Our reliance on third-party foundries involves
several risks, including reduced control over our manufacturing costs, delivery times, reliability and process quality, which can adversely affect the quality of our components produced from these
wafers, the possible misappropriation of our technology and the possibility that third parties may claim that our products infringe their intellectual property, as a result of activities by our
foundries. Our contracts with our foundries and other sole source suppliers generally commit them to supply specified quantities of components or materials at agreed prices, typically over a one to
two-year period.

We
also rely on a small number of subcontractors, primarily in Asia and the United States, to package some of our products, particularly those that utilize standard plastic packages. We
do not have long-term contracts with our third-party packaging subcontractors stipulating fixed prices or packaging volumes. Therefore, in the future, we may be unable to obtain
sufficiently high quality or timely packaging of our products. If our packaging subcontractors fail to achieve and maintain acceptable production yields in the future, we could experience increased
costs, including warranty and product liability expense and costs associated with customer support, delays in or cancellations or rescheduling of orders or shipments, product returns or discounts and
lost net revenue, any of which could have a material adverse effect on our business, financial condition and results of operations.

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We
believe that our suppliers currently have manufacturing capacity adequate to meet our foreseeable requirements. However, some of our suppliers could in the future extend their lead
times or seek to increase the prices of materials we purchase from them as their contracts with us expire. If our key suppliers were to experience difficulties that affected their manufacturing yields
or the quality of the materials they supply to us or seek to increase their prices, our cost of revenue could be adversely affected. Longer lead times and quality problems experienced by our suppliers
or packaging subcontractors could also prevent us from fulfilling our customers' demands for our products on a timely basis, and thus adversely affect our revenue. Longer lead times could also require
us to increase our raw materials inventory levels, in order to be able to meet customers' delivery requirements.

The
ability of our suppliers to meet our requirements could be impaired or interrupted by factors beyond their control, such as earthquakes or other natural phenomena, labor strikes or
shortages or political unrest. Furthermore, financial or other difficulties faced by our suppliers, or significant changes in demand for the components, materials or services they use in the products
they supply to us, could limit the availability of those products, components or materials to us. We believe that a supplier of wafers that are used in a significant number of our products has been
experiencing financial difficulties. Failure of this supplier to meet its supply commitments to us would impair our ability to supply customers with the related products and adversely impact our
revenue and financial results. We are taking steps to mitigate our exposure to this risk; however, there can be no assurance that these measures would be sufficient to avoid disruption of our business
if there were to be a near-term interruption in the supply of wafers that we currently purchase from this supplier. If this or one of our other key suppliers is unable to provide us with
its materials, components or services, our operations may be adversely affected. We might experience difficulty identifying alternative sources of supply for the materials, components and services
used in our products or that we obtain through outsourcing. We could experience delays if we were required to test and evaluate products and services of potential alternative suppliers. Any of these
occurrences could negatively affect our operating results and liquidity and harm our business.

We are subject to claims that we are infringing third-party intellectual property rights, which could result in costly and lengthy litigation that could harm our business.

In recent years there has been significant litigation involving intellectual property rights in many technology-based industries,
including our own. Although we have not to date incurred any damages as a result of claims that our products infringe any patents or other proprietary rights of third parties, we have from time to
time received notice of such claims from third parties, two of which have resulted in legal actions against us that are currently pending, and we could be subject to other such claims in the future.
Since patent applications often are not disclosed until a patent issues, it is not always possible for us to know whether patent applications are pending that might be infringed by our products, and
there could be issued patents that are pertinent to our business of which we are not aware. Our products may also be claimed to infringe intellectual property rights of others as a result of
activities by our foundries or other suppliers with respect to which we have no control or knowledge. In connection with the sale of our products, we often make representations affirming, among other
things, that our products do not infringe on the intellectual property rights of others, and we agree to indemnify customers against third-party claims of such infringement. During the first quarter
of 2008, we received a letter from a third party asserting that sales by us of certain of our products infringe a patent that allegedly applies to a semiconductor process used by certain of our
foundries in manufacturing wafers they supply to us for use in these products. We believe that to the extent that we might incur liability as a result of infringement by any of our foundries of this
or any other third party's patent, we would be entitled to be indemnified by such foundry. During the third quarter of 2008, another third party commenced an action against us in which it alleges that
certain of our products infringe patents held by the third party. During the third quarter of 2009, another third party commenced an action against us, in which it alleges that certain of our products
infringe a patent held by the third party. We have

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incurred
significant costs in defending these actions, and there can be no assurance that these or any other pending or future litigation or claims relating to infringement of third-party intellectual
property rights can be resolved in a manner favorable to us. Any claims relating to the alleged infringement by us of third-party proprietary rights, whether meritorious or not, could be
time-consuming to defend and could harm our working relationships with our foundries and customers, damage our reputation, result in substantial and unanticipated costs associated with
litigation, require us to enter into royalty or licensing agreements, which may not be available on acceptable terms or at all, or result in the payment by us of substantial damages. If we were found
to infringe the intellectual property rights of any third party and if a license were not available on reasonable terms, we could be required to redesign the infringing product so as not to infringe,
which could be time consuming and costly, or if this is not feasible, we could be required to withdraw the infringing product from the market.

Operations at our Chelmsford, Massachusetts facility that are critical to our business are subject to disruption from a variety of causes, including those that may be beyond
our control.

Our executive management and administrative functions, most of our research and development and product design activities, final
assembly of our module and subsystem-level products, and final testing for all of our products are carried out at our headquarters facility in Chelmsford, Massachusetts. These operations are critical
to our business, and could be affected by disruptions such as electrical power outages, fire, earthquake, flooding, acts of terrorism, health advisories or risks, or other natural or
man-made disasters that could damage that facility. Although we seek to mitigate these risks by maintaining business interruption insurance, insurance may be inadequate to protect against
all the consequences of such occurrences. A major disruption affecting our Chelmsford assembly and test operations, in particular, could cause significant delays in shipments until we are able to
procure and outfit another suitable facility or to qualify and contract with alternative third party suppliers, processes which could take many months. Even if alternative assembly and test capacity
is available, we may not be able to obtain it on a timely basis, or favorable terms, which could result in higher costs and/or a loss of customers.

We design and manufacture products in our standard product line based upon our internal assessment and forecasts of market requirements, and our results of operations will
be adversely affected if we fail to assess market requirements accurately.

A majority of our revenue is typically derived from sales of our standard products. We order components and materials, such as
semiconductor wafers, used in the manufacture of our standard products 12-14 weeks in advance, while our customers typically place orders for those products one to eight weeks in
advance, exposing us to inventory and manufacturing costs in advance of anticipated revenue. If we or our customers fail to predict market demand accurately for new and existing standard products, we
may experience a delay or reduction of anticipated revenue without having sufficient time to adjust our inventory and operating expenses. As the number of products we offer increases, we may be
exposed to increased inventory risk.

Lead
times for our manufacturing materials can vary significantly and depend on factors such as specific supplier requirements, the size of the order, contract terms and current market
demand. As a result, we make financial commitments in the form of purchase commitments. Furthermore, we generally lack visibility into the finished goods inventories of our customers, which makes it
more difficult for us to accurately forecast their requirements. If we overestimate our customers' requirements, we may have excess inventory, which would increase our costs. If we underestimate our
customers' requirements, we may have inadequate inventory, which could prevent us from delivering our products to our customers on a timely basis, which could disrupt our customers' production
schedules. Any of these occurrences could negatively impact our operating results and our business.

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We design custom products to meet specific requirements of our customers. The amount and timing of revenue from such products can cause fluctuations in our quarterly
operating results.

The design and sales cycle for our custom products, from initial contact by our sales force to the commencement of shipments of those
products in commercial quantities, is lengthy and can range from three months to as long as two years or more. In this process, our sales and application engineers work closely with the OEM customer
to analyze the customer's system requirements and establish a technical specification for the custom product. We then select a semiconductor process and foundry, evaluate test wafers and components,
and establish assembly and test procedures before manufacturing in commercial quantities can begin. The length of this cycle is influenced by many factors, including the difficulty of the technical
specification, the novelty and complexity of the design and the customer's procurement processes. OEMs typically do not commit to purchase significant quantities of the custom product until they are
ready to commence volume shipment of their own systems, and volume purchases of our products by an OEM customer or its contract manufacturer generally do not occur until the OEM customer has
successfully introduced the system incorporating our product. Our receipt of substantial revenue from sales of a custom product depends on that customer's commercial success in manufacturing and
selling its system incorporating our product. As a result, a significant period may elapse between our investment of time and resources in a custom product and our receipt of substantial revenue from
sales of that product.

The
length of this process increases the risk that a customer will decide to cancel or change its product plans. Such a cancellation or change in plans by a customer could cause us to
lose anticipated sales. In addition, our business, financial condition and results of operations could be adversely affected if a significant customer curtails, reduces or delays orders during our
sales cycle, chooses not to release equipment that contains our products, or is not successful in the sale and marketing its products that incorporate our custom products.

Finally,
if we fail to achieve initial design wins in the customer's qualification process, we may lose the opportunity for significant sales to that customer for a lengthy period of
time because the customer
may be unlikely to change its source for those products in the future due to the significant costs associated with qualifying a new supplier and potentially redesigning its product.

We rely on a small number of customers for a significant percentage of our revenue, and the loss of, or a reduction in, orders from these customers could result in a decline
in revenue.

We have historically depended on a small number of customers for a large percentage of our annual revenue. Although the degree of
concentration in our customer base has diminished in recent years, it remains substantial. Revenue derived from our 10 largest customers as a percentage of our annual revenue was 31.9% in 2009, 34.6%
in 2008 and 38.8% in 2007. No single customer exceeded 10% of our total revenue in 2009, 2008 or 2007. We include in these calculations revenue from products sold to these customers directly by us or
through sales representatives and our distributor, as well as from products sold to contract manufacturers for use in a system manufactured by the contract manufacturer for that customer. Our major
customers often use our products in multiple systems or programs, sometimes developed by different business units within the customer's organization, each having differing product life cycles, end
customers and market dynamics. While the composition of our top 10 customers varies from year to year, we expect that sales to a limited number of customers will continue to account for a significant
percentage of our revenue for the foreseeable future. Additionally, we have noted consolidation among OEMs in some of our end markets, which could result in an increased concentration in our sources
of revenue. It is possible that any of our major customers could terminate its purchasing arrangements with us or significantly reduce or delay the amount of our products that it orders, purchase
products from our competitors or develop its own products internally. The loss of, or a reduction in, orders from any major customer could cause a decline in revenue and adversely affect our results
of operations.

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Our failure to continue to keep pace with new or improved semiconductor process technologies could impair our competitive position.

Semiconductor manufacturers constantly seek to develop new and improved semiconductor process technologies. Our future success depends
in part upon our ability to continue to gain access to these semiconductor process technologies in order to adapt to emerging customer requirements and competitive market conditions. If we fail for
any reason to remain abreast of new and improved semiconductor process technologies as they emerge, we may lose market share which could adversely affect our operating results.

Our business depends on international customers, suppliers and operations, and as a result we are subject to regulatory, operational, financial and political risks which
could adversely affect our financial results.

The percentage of our revenue attributable to sales to customers outside the United States, based on the location to which the product
shipped, was 57.3%, 59.3% and 56.4% in 2009, 2008 and 2007, respectively. We expect that revenue from customers outside the United States will continue to account for the majority of our revenue.
Currently, we maintain international sales offices in Europe and Asia, and we rely on a network of independent sales representatives to sell our products internationally. We also have design centers
in Istanbul, Turkey and Ottawa, Ontario, Canada. We have in the past relied on, and expect to continue to rely on, suppliers, manufacturers and subcontractors located in countries other than the
United States, including France, Germany, Malaysia, Taiwan and Thailand. Accordingly, we will be subject to several risks and challenges, any of which could adversely affect our business and financial
results. These risks and challenges include:



Political
and economic instability and changes in governmental regulations could adversely affect our ability to effectively operate our foreign sales offices and foreign design centers,
as well as the ability of our foreign suppliers to supply us with required materials or services. Any interruption or delay in the supply of our required components, products, materials or services,
or our inability to obtain these components, materials, products or services from alternate sources at acceptable prices and within a reasonable amount of time, could impair our ability to meet
scheduled product deliveries to our customers and could cause customers to cancel orders.

Additionally,
most of our foreign sales, as well as our purchases of material from international suppliers, are denominated in U.S. dollars. An increase in the value of the U.S. dollar
relative to foreign currencies could make our products more expensive for our international customers to

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purchase,
thus rendering the prices of our products less competitive. Conversely, a reduction in the value of the U.S. dollar relative to foreign currencies could increase our supply costs. At the
present time, we do not have a foreign currency hedging policy in place.

The segment of the semiconductor industry in which we participate is intensely competitive, and our inability to compete effectively would harm our business.

The markets for our products are extremely competitive, and are characterized by rapid technological change and continuously evolving
customer requirements. We compete primarily with other suppliers of high performance analog and mixed-signal semiconductor components used in RF, microwave and millimeterwave applications. These
competitors include large, diversified semiconductor manufacturers with broad product lines, such as Avago and Analog Devices, with whom we compete in a number of our end markets. We also compete in
specific markets or
product categories with a large number of semiconductor manufacturers such as Eudyna, Linear Technology, NEC, RFMD, Skyworks, TriQuint Semiconductor and UMS. We also encounter competition from
manufacturers of advanced electronic systems that also manufacture semiconductor components internally. Some of these competitors, such as NEC, are also our customers. Additionally, in certain product
categories we compete with semiconductor manufacturers from which we also obtain foundry services, such as TriQuint Semiconductor and UMS. Our competitors may develop new technologies,
enhancements of existing products or new products that offer price or performance features superior to ours. Many of our competitors have significantly greater financial, technical, manufacturing,
sales and marketing resources than we do, and might be perceived by prospective customers to offer financial and operational stability superior to ours. This is particularly true of competitors in the
markets for silicon-based products. We expect competition in our markets to intensify, as new competitors enter the RF, microwave and millimeterwave component market, existing competitors merge or
form alliances, and new technologies emerge. If we are not able to compete effectively, our market share and revenue could be adversely affected, and our business and results of operations could be
harmed.

We rely on the significant experience and specialized expertise of our senior management and engineering staff and must retain and attract qualified engineers and other
highly skilled personnel in order to grow our business successfully.

Our performance is substantially dependent on the continued services and performance of our senior management and our highly qualified
team of engineers, many of whom have numerous years of experience and specialized expertise in our business. Highly skilled analog and mixed-signal IC engineers, in particular, are in short supply. We
expect to continue to hire additional engineering personnel as we expand our IC design and system-level engineering capabilities. If we are not successful in hiring and retaining highly qualified
engineers, we may not be able to extend or maintain our engineering expertise, and our future product development efforts could be adversely affected.

Our
future success also depends on our ability to identify, attract, hire, train, retain and motivate highly skilled managerial, operations, sales, marketing and customer service
personnel. If we fail to attract, integrate and retain the necessary personnel, our ability to maintain and grow our business could suffer significantly. Further, stock price volatility could impact
our ability to retain key personnel.

Our business could be adversely affected if we experience product returns, product liability and defects claims.

We introduce a significant number of new products every year, and we may not be able to anticipate all of the possible performance or
reliability problems that could arise with these products. If such problems occur or become significant, we could experience a reduction in our revenue and increased costs related to inventory
write-offs, warranty claims and other expenses which could have an adverse effect on our financial condition.

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The materials used to manufacture our products are complex and are provided by a significant number of vendors in our supply chain. While we perform extensive
testing and inspections during the manufacturing process, some defects may escape detection in our manufacturing process and subsequently pass through to our customers. These matters have arisen from
time to time and may reasonably be expected to occur again in the future. The occurrence of defects such as these could result in product returns from, and reduced product shipments to, our customers.
Such defects also could result in the loss of or delay in market acceptance of our products or harm our reputation.

Our
purchase agreements with our customers typically contain provisions designed to limit our exposure to potential product liability claims. However, the limitation of liability
provisions contained in these agreements may not be effective as a result of federal, state or local laws, or ordinances or unfavorable judicial decisions in the United States or other countries. The
insurance we maintain to protect against claims associated with the use of our products may not adequately cover all claims asserted against us. In addition, even if ultimately unsuccessful, such
claims could result in costly litigation, divert our management's time and resources, and damage our customer relationships.

Our test and measurement instrument products are more complex than our core IC, module and subsystem products, and as a result, present quality, regulatory and product
liability risks that differ from those we have faced in our core IC business and module business.

Our test and measurement instrument products, such as our HMC-T2000 and HMC-T2100 signal generators, are
complex microwave test instruments and could be subject to multiple internal component failures and manufacturing and software defects which could result in product failure. Defects in the hardware or
software incorporated in these products could cause us to incur significant warranty, support and repair costs, divert the attention of our engineering personnel from our product development efforts
and harm our relationship with our customers. Our test and measurement instrument products operate using line voltages of 100 volts or more and certain products require
AC-to-DC power transformers which we purchase from a third party and supply to our customers. The failure of these products or their power transformers could cause safety
problems for the operator, including the risk of electrical shock, injury or death in the event of a short circuit or other malfunction, and a product liability claim brought against us, even if
unsuccessful, would likely be time consuming and costly to defend. We may be required to comply with various domestic and international legal directives governing the manufacture of our test and
measurement instrument products. Failure of our test and measurement system products to meet domestic and international safety and other regulatory requirements for electromagnetic radiation, power
consumption or workmanship standards could result in a loss of revenue, loss of market share or failure to achieve market acceptance. We may conclude that it is advisable or necessary, in order to
promote the sale of these products, to seek certification of the products by various third parties such as Underwriters Laboratories (UL) in the United States or Conformité
Européenne (CE) in Europe. We cannot ensure that we will be able to obtain, or if obtained, maintain any such certifications for our test and measurement instrument products. Our
failure to obtain or maintain such certifications could adversely affect the market acceptance of the products.

We use specialized technologies and know-how to design, develop and manufacture our products. Our inability to protect our intellectual property could hurt our
competitive position, harm our reputation and adversely affect our results of operations.

We seek to protect our proprietary technology under United States and foreign laws affording protection for trade secrets, and seek
United States and foreign patent, copyright and trademark protection of our products and developments where appropriate. We rely primarily on trade secrets, technical know-how and other
unpatented proprietary information relating to our product development and manufacturing activities. While we own a small number of patents, we have not historically

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emphasized
patents as a source of significant competitive advantage. We believe that while the protection afforded by trade secret, patent, copyright and trademark laws may provide some advantages,
the competitive position of participants in our industry is largely determined by such factors as the technical and creative skills of their personnel, the frequency of their new product developments
and their ability to anticipate and rapidly respond to evolving market requirements. To the extent that a competitor effectively uses its intellectual property portfolio, including patents, to prevent
us from selling products that allegedly infringe such competitor's products, our operating results would be adversely affected.

We
seek to protect our trade secrets and proprietary information, in part, by requiring our employees to enter into agreements providing for the maintenance of confidentiality and the
assignment of rights to inventions made by them while employed by us. We also enter into non-disclosure agreements with our consultants, semiconductor foundries and other suppliers to
protect our confidential information delivered to them. There can be no assurance that our confidentiality agreements with employees, consultants and other parties will not be breached, that we will
have adequate remedies for any breach or that our trade secrets and other proprietary information will not otherwise become known. There also can be no assurance that others will not independently
develop technologies that are similar or superior to our technology or reverse engineer our products. Additionally, the laws of countries in which we operate may afford little or no protection to our
intellectual property rights. If we are unable to prevent misappropriation of our technology or to deter independent development of similar technologies, our competitive position and reputation could
suffer.

We generate a portion of our revenue from sales made by third parties, including our independent sales representatives and our distributor, and the failure to manage
successfully our relationships with these third parties could cause our revenue to decline and harm our business.

We rely in part upon third parties, including our independent sales representatives and our distributor, Future Electronics, to promote
our products, generate demand and sales leads, and obtain orders for our products. In addition, these parties provide technical sales support to our customers. The activities of these third parties
are not within our direct control. Our failure to manage our relationships with these third parties effectively could impair the effectiveness of our sales, marketing and support activities. A
reduction in the sales efforts, technical capabilities or financial viability of these parties, a misalignment of interest between us and them, or a termination of our relationship with a major sales
representative or our distributor could have a negative effect on our sales, financial results and ability to support our customers. These parties are engaged under short-term contracts,
which typically may be terminated by either party on 30 to 60 days notice. It generally takes approximately three to six months for a third party such as a sales representative to become
educated about our products and capable of providing quality sales and technical support to our customers. If we were to terminate our relationship with our distributor or one of our larger sales
representatives, or if one of them decided to discontinue its relationship with us, sales to current and prospective customers could be disrupted or delayed, and we could experience a diversion of
substantial time and resources as we seek to identify, contract with and train a replacement.

We may pursue acquisitions and investments in new businesses, products or technologies that involve numerous risks, which could disrupt our business and may harm our
financial results.

In October 2007, we entered into a strategic agreement with Northrop Grumman Space Technology sector to market a specified list
of existing Velocium products worldwide, to license related technology and to assume the associated customer relationships, at a cost of $7.1 million. In August 2005, we acquired
substantially all of the assets of Q-Dot, Inc., a subsidiary of Simtek Corporation, for an aggregate purchase price of $2.5 million. We may make other similar or
significantly larger acquisitions of and investments in new businesses, products and technologies, or we

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may
acquire other operations that expand our current capabilities. Acquisitions present a number of potential risks and challenges that could, if not met, disrupt our business operations, increase our
operating costs and reduce the value to us of the acquired company. For example, if we identify an acquisition candidate, we may not be able to successfully negotiate or finance the acquisition on
favorable terms. Even if we are successful, we may not be able to integrate the acquired businesses, products or technologies into our existing business and products. Further, there can be no
assurance that we will be successful in retaining key employees or customers of the acquired business. In some cases, the consent of a customer may be required before contracts between that customer
and a company that we acquire may be assumed by us, and it may not be feasible to obtain all such consents prior to closing. As a result of the rapid pace of technological change, we may misgauge the
long-term potential of the acquired business or technology, or the acquisition may not be complementary to our existing business. Furthermore, potential acquisitions and investments,
whether or not consummated, may divert our management's attention and require considerable cash outlays at the expense of our existing operations. In addition, to complete future acquisitions, we may
issue equity securities, incur debt, assume contingent liabilities or have amortization expenses and write-downs of acquired assets, which could adversely affect our profitability.

If our principal end markets fail to grow or experience declines, our revenue may suffer.

Although our products are used in a variety of end markets, our future growth depends to a significant extent on the success of our
principal end markets, which are automotive, broadband, cellular infrastructure, fiber optics, microwave and millimeterwave communications, military, space and test and measurement systems. Revenue
derived from our three largest end markets, cellular infrastructure, microwave and millimeterwave communications and military, represented 79.3%, 75.9% and 72.1% of our annual revenue in 2009, 2008
and 2007, respectively. Given the current economic climate, the rate at which our principal end markets will grow or decline is difficult to predict. These markets may fail to grow or may decline for
many reasons, including insufficient consumer demand, lack of access to capital, changes in the United States defense budget and procurement processes and changes in regulatory environments. If demand
for electronic
systems in which our products are incorporated declines, fails to grow, or grows more slowly than we anticipate, our revenue could decline.

Our financial results may be adversely affected by increased tax rates and exposure to additional tax liabilities.

As a global company, our effective tax rate is highly dependent upon the geographic composition of worldwide earnings and tax
regulations governing each region. We are subject to income taxes in both the United States and various foreign jurisdictions, and significant judgment is required to determine worldwide tax
liabilities. Our effective tax rate as well as the actual tax ultimately payable could be adversely affected by changes in the split of earnings between countries with differing statutory tax rates,
in the valuation of deferred tax assets, in tax laws or by material audit assessments, which could affect our profitability. In addition, the amount of income taxes we pay is subject to ongoing audits
in various jurisdictions, and a material assessment by a governing tax authority could affect our profitability.

If we fail to comply with export control regulations we could be subject to substantial fines or other sanctions.

Certain of our products are subject to the Export Administration Regulations, administered by the Department of Commerce, Bureau of
Industry Security, which require that we obtain an export license before we can export products or technology to specified countries. Additionally, some of our products are subject to the
International Traffic in Arms Regulations, which restrict the export of information

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and
material that may be used for military or intelligence applications by a foreign person. Failure to comply with these laws could result in sanctions by the government, including substantial
monetary penalties, denial of export privileges and debarment from government contracts.

If we fail to comply with government contracting regulations, we could suffer a loss of revenue or incur price adjustments or other penalties.

Some of our revenue is derived from contracts with agencies of the United States government and subcontracts with its prime
contractors. As a United States government contractor or subcontractor, we are subject to federal contracting regulations, including the Federal
Acquisition Regulations, which govern the allowability of costs incurred by us in the performance of United States government contracts. Certain contract pricing is based on estimated direct and
indirect costs, which are subject to change. Additionally, the United States government is entitled after final payment on certain negotiated contracts to examine all of our cost records with respect
to such contracts and to seek a downward adjustment to the price of the contract if it determines that we failed to furnish complete, accurate and current cost or pricing data in connection with the
negotiation of the price of the contract.

In
connection with our United States government business, we are also subject to government audits and to review and approval of our policies, procedures, and internal controls for
compliance with procurement regulations and applicable laws. In certain circumstances, if we do not comply with the terms of a contract or with regulations or statutes, we could be subject to downward
contract price adjustments or refund obligations or could in extreme circumstances be assessed civil and criminal penalties or be debarred or suspended from obtaining future contracts for a specified
period of time. Any such suspension or debarment or other sanction could have an adverse effect on our business.

Under
some of our government subcontracts, we are required to maintain secure facilities and to obtain security clearances for personnel involved in performance of the contract, in
compliance with applicable federal standards. If we were unable to comply with these requirements, or if personnel critical to our performance of these contracts were to lose their security
clearances, we might be unable to perform these contracts or compete for other projects of this nature, which could adversely affect our revenue.

Some of our long-term contracts may be terminated for the convenience of the customer and may involve significant expenditures on our part that, if the contract
is terminated early, we may be unable to recover.

Our United States government contracts and subcontracts may be funded in increments over a number of government budget periods and
typically can be terminated by the government for its convenience. Some of our contracts, such as our $35 million production order for microwave subsystems that will be used in an advanced U.S.
military weapon system, which we announced in February 2009, are long-term contracts for the manufacture of complex subsystems for which we are required to expand our production
facilities, hire additional personnel, incur costs to meet customer qualification requirements and make other substantial investments in advance of our receipt of significant revenue. If such a
contract is terminated, in addition to the loss of anticipated revenue, we may be unable to recover all of our costs incurred or committed.

In order to comply with current and pending environmental and climate change laws and regulations, we may need to modify our activities or incur substantial costs, and if we
fail to comply with environmental regulations we could be subject to substantial fines or be required to suspend production, alter manufacturing processes or cease operations.

We are subject to a variety of international, federal, state and local governmental regulations directed at preventing or mitigating
climate change and other environmental harms, as well as to the storage, discharge, handling, generation, disposal and labeling of toxic or other hazardous substances

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used
to manufacture our products. If we fail to comply with these regulations, substantial fines could be imposed on us, and we could be required to suspend production, alter manufacturing processes
or cease operations, any of which could have a negative effect on our sales, income and business operations. Failure to comply with environmental regulations could subject us to civil or criminal
sanctions and property damage or personal injury claims. Compliance with current or future environmental laws and regulations could restrict our ability to expand our facilities or build new
facilities or require us to acquire additional expensive equipment, modify our manufacturing processes, or incur other substantial expenses which could harm our business, financial condition and
results of operations. In response to environmental concerns, some customers and government agencies impose requirements for the elimination of hazardous substances, such as lead (which is widely used
in soldering connections in the process of semiconductor packaging and assembly), from electronic equipment. For example, in 2003, the EU adopted its RoHS Directive. Effective July 1, 2006, the
RoHS Directive prohibits, with specified exceptions, the sale in the EU market of new electrical and electronic equipment containing more than agreed levels of lead or other hazardous materials. We
have a program in place to meet these customer and governmental requirements, including the RoHS Directive, where applicable to us, by making available versions of our products that do not include
lead or other hazardous substances. The European Parliament has also adopted the Waste Electrical and Electronic Equipment Directive, or WEEE Directive, which makes producers of electrical and
electronic equipment financially responsible for specified collection, recycling, treatment and disposal of past and future covered products. Environmental laws and regulations such as these could
become more stringent over time, imposing even greater compliance costs and increasing risks and penalties associated with violations, which could seriously harm our business, financial condition and
results of operations.

Dr. Ayasli, our founder and a principal stockholder, controls approximately 20% of our voting power, and is able to exert significant control over the outcome of
director elections and other matters requiring stockholder approval, including a change in corporate control.

Dr. Yalcin Ayasli, our founder, and the Ayasli Children LLC, of which Dr. Ayasli is the sole manager, are the
beneficial owners of an aggregate of approximately 20% of our
common stock. As a result, Dr. Ayasli has the power to exert significant control over the outcome of matters requiring stockholder approval, such as:



Dr. Ayasli's
significant ownership interest could adversely affect investors' perception of our corporate governance or delay, prevent or cause a change in control of our company,
any of which could adversely affect the market price of our common stock.

We are required to evaluate our internal control over financial reporting under Section 404 of the Sarbanes-Oxley Act of 2002, and any adverse results from such
evaluation could result in a loss of investor confidence in our financial reports and have an adverse effect on our stock price.

Pursuant to Section 404 of the Sarbanes-Oxley Act of 2002, we are required to furnish annually a report by our management on our
internal control over financial reporting. Such a report is required to contain, among other matters, an assessment of the effectiveness of our internal control over financial reporting as of the end
of our fiscal year, including a statement as to whether or not our internal control over financial reporting is effective. This assessment must include disclosure of any material weaknesses in our
internal control over financial reporting identified by management.

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If
our management identifies one or more material weaknesses in our internal control over financial reporting, we will be unable to assert that our internal control is effective. If we
are unable to assert that our internal control over financial reporting is effective, or if our independent registered public accounting firm is unable to express an opinion on the effectiveness of
our internal controls, investors could lose confidence in the accuracy and completeness of our financial reports, which could have an adverse effect on our stock price.

We could be the subject of securities class action litigation due to stock price volatility, which could divert management's attention and adversely affect our financial
position or results of operations.

The stock market in general, and market prices for the securities of technology companies like ours in particular, have experienced
volatility that often has been unrelated to the operating performance of the underlying companies. These broad market and industry fluctuations may adversely affect the market price of our common
stock, regardless of our operating performance. In several recent situations where the market price of a stock has been volatile, holders of that stock have initiated securities class action
litigation against the company that issued the stock. If any of our stockholders were to bring a lawsuit against us, the defense and disposition of the lawsuit could be costly and divert the time and
attention of our management and harm our business.

Anti-takeover provisions in our charter documents and Delaware law could prevent or delay a change in control of our Company that stockholders may consider
beneficial and may adversely affect the price of our stock.

Provisions of our certificate of incorporation and by-laws may discourage, delay or prevent a merger, acquisition or change
of control that a stockholder may consider favorable. These provisions could also discourage proxy contests and make it more difficult for stockholders to elect directors and take other corporate
actions. The existence of these provisions could limit the price that investors might be willing to pay in the future for shares of our common stock. These provisions include authorizing the issuance
of "blank check" preferred stock and establishing advance notice requirements for nominations for election to the board of directors and for proposing matters to be submitted to a stockholder vote.

Provisions
of Delaware law may also discourage, delay or prevent someone from acquiring or merging with our Company or obtaining control of our Company. Specifically, Section 203
of the Delaware General Corporate Law may prohibit business combinations with stockholders owning 15% or more of our outstanding voting stock and could reduce the value of our Company.

Item 1B.    Unresolved Staff Comments

Not applicable.

Item 2.    Properties

Our headquarters are located in Chelmsford, Massachusetts in a 71,000 square foot building that we own. We occupy leased premises of
approximately 13,000 square feet for our design center in Colorado Springs, Colorado; 8,000 square feet for our design center in Istanbul, Turkey; and 7,000 square feet for our design center in
Ottawa, Ontario, Canada. We also occupy approximately 1,000 square feet or less for each of our sales offices in China, Germany, India, Japan, Korea, Sweden and the United Kingdom. We believe that our
existing facilities meet our current needs and that we will be able to obtain additional commercial space as needed.

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Item 3.    Legal Proceedings

In September 2008, Analog Devices, Inc. commenced an action against us in the United States District Court for the
District of Massachusetts, in which it alleges that certain of our products infringe patents held by Analog Devices. The action seeks injunctive relief and damages in an unspecified amount. We have
filed an answer denying that we infringe and asserting defenses, including that the patents in question are invalid. Discovery in the action is proceeding.

In
August 2009, ON Semiconductor Corporation and its subsidiary, Semiconductor Components Industries, LLC, commenced an action against us, along with Hynix
Semiconductor, Inc., Elpida Memory, Inc. and Nanya Technology Corporation and entities affiliated with those defendants, in the United States District Court for the Eastern District of
Texas. The ON Semiconductor action alleges that certain of our products infringe a patent owned by ON Semiconductor. The action seeks injunctive
relief and damages in an unspecified amount. We have filed an answer denying that we infringe and asserting defenses, including that the patent in question is invalid.

Item 4.    Submission of Matters to a Vote of Security Holders

No matters were submitted to a vote of our shareholders during the fourth quarter of the fiscal year ended December 31, 2009.

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Table of Contents

PART II

Item 5.    Market for Registrant's Common Equity, Related Stockholder Matters and Issuer Purchases of Equity Securities

The following table sets forth, for the periods indicated, the range of high and low sale prices for our common stock. Our common stock
trades on the Nasdaq Global Select Market under the symbol HITT.

Year Ended December 31,2009

2008High

Low

High

LowFirst Quarter

$
31.98

$
24.05

$
49.27

$
30.82Second Quarter


37.74


31.22


43.79


35.62Third Quarter


38.99


33.34


36.58


29.19Fourth Quarter


41.10


35.12


33.82


23.77


As
of December 31, 2009, our common stock was held by approximately 420 shareholders of record.

On
July 27, 2005, we paid a cash dividend in the aggregate amount of approximately $34.2 million to our stockholders of record at June 24, 2005. The dividend was
funded out of our
then-existing cash and cash equivalents. Our board of directors found it prudent and consistent with our historical policy as a then-private company to return retained earnings
to the holders of our capital stock in the form of a cash dividend, prior to, and contingent upon, the closing of our initial public offering. We have not paid cash dividends since that time, and do
not anticipate paying cash dividends for the foreseeable future.

Stock Repurchase Program

In April 2008, our board of directors authorized a stock repurchase program to offset the dilutive impact of equity-based compensation
granted to our employees. The shares may be repurchased from time to time in the open market or in privately negotiated transactions. During the three months ended December 31, 2009, we
repurchased 227,159 shares of our common stock at a cost of $8.7 million, as set forth in the table below.

Period

Total number
of shares
purchased(1)

Average price
paid per
share

Total number of
shares purchased
as part of publicly
announced plan

Approximate dollar
value of shares
that may yet be
purchased under
the plans or programs
(in thousands)(2)October 2009


8,980

$
38.92


8,980November 2009


139,246


38.01


139,246December 2009


78,933


38.84


78,933Total


227,159





227,159

$
15,834


(1)Includes
shares repurchased in connection with our stock-based compensation plans.(2)Value
based on an aggregate of 388,370 shares at an assumed purchase price of $40.77 per share, which was the last sale price of our common stock on
December 31, 2009, as reported by the Nasdaq Global Market.


For
information concerning securities authorized for issuance under our equity compensation plans, see Part III, Item 12, "Security Ownership of Certain
Beneficial Owners and Related Stockholder Matters."

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Table of Contents

COMPARISON OF 53 MONTH CUMULATIVE TOTAL RETURN*

Among Hittite Microwave Corporation, The NASDAQ Composite Index
And The Philadelphia Semiconductor Index

LOGO



7/05

9/05

12/05

3/06

6/06

9/06

12/06

3/07

6/07

9/07

12/07

3/08

6/08

9/08

12/08

3/09

6/09

9/09

12/09Hittite Microwave Corporation


100.00


104.11


118.97


173.32


185.91


228.79


166.17


206.53


219.69


226.99


245.55


192.39


183.14


172.75


151.47


160.41


178.66


189.10


209.61NASDAQ Composite


100.00


105.22


107.35


114.15


106.96


111.91


120.78


121.25


130.62


133.48


131.06


112.10


113.12


101.06


77.45


75.07


90.15


104.39


111.88Philadelphia Semiconductor


100.00


105.35


109.51


103.75


95.73


101.26


100.86


99.86


113.69


115.42


108.90


93.75


97.27


80.84


61.08


65.87


74.31


90.26


97.40


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Table of Contents

Item 6.    Selected Financial Data

The following tables set forth our selected financial data for the last five fiscal years.

Year Ended December 31,2009

2008

2007

2006

2005(in thousands, except per share data)Consolidated Statement of Operations Data:Revenue

$
162,990

$
180,251

$
156,412

$
130,290

$
80,677Cost of revenue


45,239


51,556


45,363


35,398


25,715Gross profit


117,751


128,695


111,049


94,892


54,962Operating expenses:Research and development


22,971


24,438


18,546


15,179


10,800Sales and marketing


15,034


15,988


13,313


11,183


8,648General and administrative


9,737


8,347


7,316


6,501


3,408In-process research and development














1,778Total operating expenses


47,742


48,773


39,175


32,863


24,634Income from operations


70,009


79,922


71,874


62,029


30,328Interest income


394


3,420


5,474


3,180


1,090Interest expense











(30
)

(54
)Other income (expense), net


2


(343
)

74


109


Income before income taxes


70,405


82,999


77,422


65,288


31,364Provision for income taxes


24,232


29,157


26,184


22,598


10,286Net income


46,173


53,842


51,238


42,690


21,078Accretion on redeemable convertible preferred stock














944Net income attributable to common stockholders

$
46,173

$
53,842

$
51,238

$
42,690

$
20,134Earnings per share attributable to common stockholders:Basic

$
1.57

$
1.77

$
1.67

$
1.43

$
0.76Diluted

$
1.55

$
1.74

$
1.64

$
1.38

$
0.71Weighted average shares outstanding:Basic


29,380


30,473


30,630


29,856


25,085Diluted


29,850


30,955


31,263


30,882


26,822Cash dividend declared and paid per common share

$


$


$


$


$
1.36




As of December 31,2009

2008

2007

2006

2005(in thousands)Consolidated Balance Sheet Data:Cash and cash equivalents

$
220,477

$
180,856

$
65,735

$
83,798

$
40,559Short-term available-for-sale investments








99,007


38,757


22,082Working capital


255,372


216,894


192,530


142,133


70,762Total assets


292,693


255,084


234,495


172,671


94,397Long-term debt














213Stockholders' equity


274,149


236,929


216,293


156,162


83,330


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Table of Contents

Item 7.    Management's Discussion and Analysis of Financial Condition and Results of Operations

Our discussion and analysis of financial condition and results of operations contains "forward-looking" statements and information,
which involve risks and uncertainties. Actual future results may differ materially. Statements indicating that we "expect," "estimate," "believe," "are planning" or "plan to" are forward-looking, as
are other statements concerning future financial results, product offerings or other events that have not yet occurred. There are several important factors that could cause actual results or events to
differ materially from those anticipated by the forward-looking statements. Such factors include those described below and in "Risk Factors." Although we have sought to identify the most significant
risks to our business, we cannot predict whether, or to what extent, any of such risks may be realized. We also cannot assure that we have identified all possible issues which we might face. We
undertake no obligation to update any forward-looking statements that we make.

Overview

We were organized as a Massachusetts corporation in 1985 and reincorporated under the laws of Delaware in 1988. Since our founding, we
have established a 25-year track record of innovation in RF, microwave and millimeterwave semiconductor technology.



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We
employ a fabless business strategy, which means that we do not own a semiconductor fabrication facility, or fab, and purchase all of our semiconductor wafer requirements from
third-party wafer fabrication facilities, known as foundries. We believe that our fabless business model enables us to access a broad range of technologies and quickly respond to new market
opportunities, while significantly reducing our capital requirements.

Description of Our Revenue, Costs and Expenses

Revenue.Our revenue is derived primarily from the sale of standard and custom products. We develop standard products from our own
specifications,
which we sell through our direct sales organization, our network of independent sales representatives, a distributor and our website. We also develop custom products to meet the specialized
requirements of individual customers, which are sold by our direct sales organization.

We
sell our products to OEMs, that supply advanced electronic systems to commercial and military end users, and to these OEMs' contract manufacturers. In general, the decision to
purchase our product is made by the OEM, which has designed our product into its system. In the event that we sell to an OEM's contract manufacturer, the contract manufacturer typically does not have
discretion to replace our product with one from a different supplier.

Our
sales cycle varies substantially, ranging from a period of a month or less when a customer selects a standard product from our catalog or website, to as long as two years or more for
custom products. In the sales process, our sales and application engineers work closely with the OEM customer to analyze the customer's system requirements and select an appropriate standard product
or establish a technical specification for a custom product. In the case of a custom product, we also select a semiconductor process and foundry, and evaluate test wafers and finished components
before manufacturing in commercial quantities can begin. Volume purchases of our products by an OEM customer, or its contract manufacturer, generally do not occur until the OEM customer has made the
decision to begin production of the system incorporating our product. Our receipt of substantial revenue from sales of a product to an OEM customer depends on that customer's commercial success in
manufacturing and selling its system incorporating our product. It may take several years for a newly introduced standard product to generate substantial revenue, if ever. However, the life cycles of
our standard products tend to be lengthy.

Although
most of our revenue is derived from sales of our products, we also receive a small percentage of our revenue from customer-sponsored research and development activities. These
activities range from pure research, in which we investigate IC design techniques on new semiconductor technologies at the request of a government agency or commercial customer, to custom development
projects in which we are paid to enhance or modify an existing product or develop a new product to meet a customer's specifications.

Historically,
a portion of our customer-sponsored research and development activities have been funded by U.S. government agencies under the Small Business Innovation Research (SBIR)
program. We are no longer eligible to compete for new SBIR awards and during 2009 completed substantially all of our SBIR projects. Revenue from SBIR contracts was immaterial in both 2008 and 2009.
There has been no impact to our other U.S. government- or commercial-sponsored research and development activities.

Cost of revenue.Cost of revenue consists primarily of the cost of semiconductor wafers that we purchase from our foundries and other
materials such
as packages, epoxies, connectors and production masks. Cost of revenue also includes personnel costs and overhead related to our manufacturing and

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engineering
operations, including occupancy and equipment costs, inbound shipping costs, charges for inventory obsolescence and warranty obligations and amortization of certain intangible assets.

Research and development.Research and development expense consists primarily of personnel costs of our research and development
organization, costs
of development wafers, license fees for computer-aided design software, costs of development testing and evaluation, costs of developing automated test software, and related occupancy and equipment
costs. We expense all research and development costs as incurred.

Sales and marketing.Sales and marketing expense consists primarily of personnel costs of our sales and marketing organization, sales
commissions
paid to independent sales representatives, costs of advertising, trade shows, corporate marketing, promotion, travel, related occupancy and equipment costs, amortization of certain intangible assets
and other marketing costs.

General and administrative.General and administrative expense consists primarily of personnel costs of our executive management,
finance, and other
administrative staff, outside professional fees, related occupancy and equipment costs and other corporate expenses.

Critical Accounting Policies and Estimates

Our discussion and analysis of our financial condition and results of operations are based on our consolidated financial statements.
The preparation of financial statements, in conformity with accounting principles generally accepted in the United States of America, requires management to make estimates and assumptions that affect
the reported amounts of assets and liabilities and disclosure of contingent assets and liabilities at the date of the financial statements and the reported amounts of revenue and expenses during the
reporting period. By their nature, these estimates and judgments are subject to an inherent degree of uncertainty. On an ongoing basis, we re-evaluate our judgments and estimates including
those related to uncollectible accounts receivable, inventories, intangible assets, stock-based compensation, income taxes, warranty obligations, accrued expenses and other contingencies. We base our
estimates and judgments on our historical experience and on other assumptions that we believe are reasonable under the circumstances, the results of which form the basis for making the judgments about
the carrying values of assets and liabilities that are not readily apparent from other sources. Actual results could differ from those estimates, and material effects on our operating results and
financial position may result. The accounting policies described below are those which, in our opinion, involve the most significant application of judgment, or involve complex estimation, and which
could, if different judgments or estimates were made, materially affect our reported results of operations.

Revenue recognition.We recognize revenue for the majority of our business when the following criteria have been met: (1)
 persuasive evidence
of an arrangement exists; (2) delivery has occurred or services have been rendered; (3) the fee is fixed or determinable; and (4) collectibility is reasonably assured. For
arrangements that involve multiple elements, we allocate arrangement consideration among the elements based on the relative fair values of those elements as determined using objective and reliable
evidence of fair value. If the fair value of an undelivered element cannot be established, the arrangement is accounted for as a single unit of accounting and revenue is recognized when all
performance obligations are met. We maintain a reserve for potential sales returns and allowances. Returns and customer credits are immaterial and are recorded as a reduction to revenue. A portion of
our sales are made to a distributor under an agreement that provides for limited product return privileges. As a result, we defer recognition of such revenue until the product is resold by the
distributor.

Revenue
from contracts with the United States government, government prime contractors and some commercial customers is generally recorded on a percentage of completion basis using costs
incurred as the measurement basis for progress toward completion. Where appropriate, we use an

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output
measure, such as units delivered, to measure progress toward completion. Estimated revenue in excess of amounts billed is reported as unbilled receivables. Contract accounting requires judgment
in estimating costs and assumptions related to technical issues and delivery schedule. Contract costs
include material, subcontract costs, labor and an allocation of indirect costs. The estimation of costs at completion of a contract is subject to numerous variables involving contract costs and
estimates as to the length of time to complete the contract. Changes in contract performance and estimated gross margin, including the impact of final contract settlements, are recognized in the
period in which the changes are determined. Estimated losses on a contract are recognized in full in the period when they become known.

Allowance for doubtful accounts.We perform ongoing credit evaluations of our customers and adjust credit limits, as determined by our
review of
current credit information. We continuously monitor collections and payments from our customers and maintain an allowance for doubtful accounts based upon our historical experience, our anticipation
of uncollectible accounts receivable and any specific customer collection issues that we have identified. While our credit losses have historically been within our expectations and the allowance
established, we may not continue to experience the same credit loss rates that we have in the past.

Inventory.Inventory is stated at the lower of cost (first-in, first-out method) or market. We review the inventory and
compare product costs with current market value, and write down any inventory with costs in excess of current market value to its net realizable value. Estimating demand is inherently difficult,
particularly given the cyclical nature of the semiconductor industry, which can result in excess or obsolete inventory. We recorded expense of $1,988,000, $1,678,000 and $655,000 in 2009, 2008 and
2007, respectively, to reduce inventory to its net realizable value. Once we have written down inventory to its estimated net realizable value, we establish a new cost basis for that inventory and do
not increase its carrying value due to subsequent changes in demand forecasts. Accordingly, if inventory previously written down is subsequently sold, we may realize improved gross profit margins on
these transactions.

Long-lived assets.We evaluate our long-lived assets for potential impairment whenever events or circumstances suggest that
the carrying amount of an asset or group of assets is not recoverable. Our judgments regarding the existence of impairment indicators are based on market and operational performance. Indicators of
potential impairment include:



If
we believe that an indicator of potential impairment exists, we test to determine whether the impairment recognition criteria have been met. To analyze a potential impairment, we
project undiscounted future cash flows over the remaining life of the asset or the primary asset in the asset group, using a probability-weighted multiple scenario approach, reflecting a range of
possible outcomes. If these projected cash flows are less than the carrying amount, an impairment loss is recognized based on the fair value of the asset or asset group less any costs of disposition.
Evaluating the impairment requires judgment by our management to estimate future operating results and cash flows. If different estimates were used, the amount and timing of asset impairments could be
affected. We charge

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impairments
of the long-lived assets to operations if our evaluations indicate that the carrying values of these assets are not fully recoverable.

Warranty Obligations.We accrue for warranty costs at the time revenue is recognized based on the historical rate of claims and costs to
provide
warranty services. If we experience an increase in warranty claims above historical experience or our costs to provide warranty services increase, we would increase our warranty accrual, which would
adversely impact our gross margins.

Stock-based compensation.For share-based payments made on or after January 1, 2006, we measure compensation cost at fair value on
the date of
grant, and recognize this cost as expense over the service period the awards are expected to vest, net of estimated forfeitures. The fair value of restricted stock is determined based on the excess of
the quoted price of our common stock on the date of grant over the exercise price of the restricted stock. The fair value of stock options is determined using the Black-Scholes valuation model.
Determining the appropriate fair value model and calculating the fair value of share-based awards requires judgment, including estimating stock price volatility, the expected life of each equity
instrument and the amount of share-based payments that will ultimately either vest or be forfeited. We consider many factors when estimating expected forfeitures, including the type of the award,
employee group, and historical experience. Actual results, and future changes in estimates, may differ substantially from our current estimates. See Note 11 to the Consolidated Financial
Statements included in this Form 10-K for further disclosure regarding our stock-based compensation.

Income taxes.We determine deferred tax assets and liabilities based upon the difference between the financial statements and the tax
basis of assets
and liabilities using enacted tax rates in effect for the year in which the differences are expected to affect taxable income. The tax consequences of most events recognized in the current year's
financial statements are included in determining income taxes currently payable. However, because tax laws and financial accounting standards differ in their recognition and measurement of assets,
liabilities, equity, revenue, expenses, gains and losses, differences arise between the amount of taxable income and pretax financial income for a year and the tax basis of assets or liabilities and
their reported amounts in the financial statements. Because we assume that the reported amounts of assets and liabilities will be recovered and settled, respectively, a difference between the tax
basis of an asset or a liability and its reported amount in the balance sheet will result in a taxable or a deductible amount in some future years when the related assets or liabilities are settled or
the reported amount of the assets are recovered, hence giving rise to a deferred tax asset or liability. We must then periodically assess the likelihood that our deferred tax assets will be recovered
from our future taxable income, and, to the extent we believe that it is more likely than not our deferred tax assets will not be recovered, we must establish a valuation allowance against our
deferred tax assets. We recognize in our financial statements the tax benefit from an uncertain tax position taken or expected to be taken in an income tax return only if it is more likely than not
that such benefit would be sustained on its technical merits in the event of a tax audit. The assessment of each tax position requires significant judgment. All tax positions are periodically analyzed
and adjusted as a result of events, such as the resolution of tax audits or the expiration of statutes of limitations, which may result in charges or credits to the provision for income taxes. See
Note 12 to the Consolidated Financial Statements included in this Form 10-K for further disclosure regarding income taxes.

Factors and Trends That Affect Our Results of Operations

In reading our financial statements, you should be aware of the following factors and trends that our management believes are important
in understanding our financial performance.

Revenue.From 2003 to 2008, our revenue grew from $42.0 million to $180.3 million, representing a compound annual growth rate
of 33.8%.
In 2009, our revenue decreased 9.6% to $163.0 million, due

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to
the global economic downturn and related credit crisis that affected us along with the entire semiconductor industry. We have also experienced periods of relatively flat
year-over-year growth, as in 2001 and 2002. Although we have experienced three sequential quarters of revenue growth and our backlog at December 31, 2009, increased
compared to December 31, 2008, given weak economic conditions, there is no certainty that our business will continue to grow. Generally, our revenue growth results from increased sales of our
standard products, derived from the introduction of new products, which expands the breadth and diversity of our standard product offerings, growing market acceptance of standard products we
introduced in prior periods, and the expansion of our domestic and international sales efforts.

In
establishing current and future planned levels of operating expenses, we seek to balance near-term financial goals with our longer term strategic objectives. Accordingly,
we took steps early in 2009 to reduce expenses across our business, and maintained certain of these measures throughout the year. We expect to increase spending in research and development in order to
remain competitive, and our plans for growth also require increased spending to support our operations, sales, marketing and administrative functions. Accordingly, we expect that our spending will
increase as conditions improve.

Gross margin.One of our objectives is to maintain and improve our gross margin, which is our gross profit expressed as a percentage of
our revenue.
In the last three years our gross margins were 72.2% in 2009, 71.4% in 2008 and 71.0% in 2007. In general, we seek to introduce high performance products that are valued by our customers for their
ability to address technically challenging applications, rather than commodity ICs for use in high volume applications where cost, rather than performance, is the highest priority. We also seek
continuously to reduce our costs and to improve the efficiency of our manufacturing operations.

Our
gross margin in any period is significantly affected by industry demand and the intensity of competition in the markets into which we sell our products. Gross margins are also
significantly affected by product mix, that is, the percentage of our revenue in that period that is attributable to higher or lower margin products and by pricing, including fluctuations in the
relative proportion of high volume orders, on which we offer higher discounts. Additional factors affecting our gross margins include changes in the cost of wafers and materials, the timing of
indirect costs for pre-production masks and evaluation materials, changes in estimates for contracts recognized on a percentage of completion basis, variations in overhead absorption rates
and other manufacturing efficiencies, and numerous other factors, some of which are not under our control. Our margins can be substantially affected by changes in our manufacturing yields. Our yields
depend on
many factors that we control, such as product design and the effectiveness of our own assembly and test operations, but they are also affected by the activities of third parties, such as the foundries
and packaging subcontractors that supply us with critical materials and services, that are beyond our control. As a result of these or other factors, we may be unable to maintain or increase our gross
margin in future periods.

Purchasing patterns of our standard products.A majority of our revenue in each quarter is typically derived from sales of our standard
products.
Purchasers of our standard products generally do not enter into long-term contracts with us. Customers that purchase large volumes of our standard products generally provide us with
periodic forecasts of their requirements for those products, but these forecasts do not commit the customer to minimum purchases, and customers generally may revise these forecasts without penalty. A
significant portion of our revenue in each quarter is attributable to purchase orders for standard products that are received and fulfilled in that quarter, often including a large number of orders
from diverse customers and end markets. The price list for our standard products includes discounts based on purchase order volume, and, as a result, the revenue we receive from sales of a particular
product in any period is influenced by the average order size for that product during that period. Our forecasting of sales of standard products takes into account a number of factors, including
historical sales patterns for each individual product, our assessment of overall market conditions and our knowledge of the current requirements and purchasing practices of our larger customers.
However,

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the
absence, in most cases, of long-term purchase commitments for our standard products complicates the task of predicting the exact sources and amount of our revenue from standard
products and thus, to some extent, the amount of our total revenue in any quarter. The difficulty of this task is compounded by the uncertainties we and our customers face, related to the recent
global economic downturn.

Relationships with major customers.We have historically depended on a small number of customers for a large percentage of our annual
revenue.
Revenue derived from our 10 largest customers as a percentage of our annual revenue was 31.9% in 2009, 34.6% in 2008 and 38.8% in 2007. No single customer exceeded 10% of our total revenue in 2009,
2008 or 2007. We include in these calculations revenue from products sold to these customers directly by us or through sales representatives and our distributor, as well as from products sold to
contract manufacturers for use in a system manufactured by the contract manufacturer for that customer. Our major customers often use our products in multiple systems or programs, sometimes developed
by different business units within the customer's organization, each having differing product life cycles, end customers and market dynamics. While the composition of our top 10 customers varies from
year to year, we expect that sales to a limited number of customers will continue to account for a significant percentage of our revenue for the foreseeable future. Additionally, we have noted
consolidation among OEMs in some of our end markets, which could result in an increased concentration in our sources of revenue.

Need for continued product and technology innovation.We believe that the breadth of our product line with respect to functionality,
performance and
frequency coverage, and our ability to introduce new products rapidly, afford us significant competitive advantage and have contributed significantly to our revenue growth. We introduced 152 new
standard catalog products in 2007 (including 51 Velocium products), 100 in 2008 and 83 in 2009. Our future competitive position will depend in large part on our ability to continue to innovate,
to anticipate the rapid changes in semiconductor technology and RF, microwave and millimeterwave circuit design techniques that characterize our industry and to develop, introduce and successfully
market new products that meet the evolving application requirements of our customers. As the complexity and degree of integration of our products increases, maintaining or increasing our historical
rate of new product introductions will become increasingly challenging. Driving and supporting this process of continuous innovation and new product introduction is one of our key priorities, and one
that will require continuing expenditures.

Need to meet customer demand for on-time delivery and high quality.The success of our business also depends on our continued ability
to
supply our products on time and in quantities adequate to meet our customers' requirements, while maintaining the high standards of quality and reliability that our customers require. Our senior
management spends a significant amount of its time on these key operational issues, and we devote substantial resources to maintain our sources of supply and to improve our manufacturing and quality
control processes.

Need to continue to expand the diversity of our product lines, customer base, end markets and target applications.The semiconductor
industry in
general, and specific segments of the markets that we serve, are highly cyclical and have historically experienced significant fluctuations in demand, including periods of rapid growth as well as
periods of product overcapacity and weak demand, which occur even during periods of growth in the broader economy. For example, our revenue declined in 2009 due to a global economic downturn, and our
revenue growth rate was largely flat in 2001 and 2002 as a result of a downturn in the telecommunications industry. Revenue derived from our three largest end markets, cellular infrastructure,
microwave and millimeterwave communications and military, represented 79.3%, 75.9% and 72.1% of our annual revenue in 2009, 2008 and 2007, respectively. An important objective of our management is to
reduce our exposure to fluctuations in demand from any particular customer or industry segment by continuing to broaden our customer base and end markets and the range of applications that our
products address.

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Table of Contents

Results of Operations

The following tables set forth, for the periods indicated, selected statement of operations data in dollar amount and expressed as a
percentage of our revenue:

Years Ended December 31,2009

2008

2007(in thousands)Revenue

$
162,990

$
180,251

$
156,412Cost of revenue


45,239


51,556


45,363Gross profit


117,751


128,695


111,049Operating expenses:Research and development


22,971


24,438


18,546Sales and marketing


15,034


15,988


13,313General and administrative


9,737


8,347


7,316Total operating expenses


47,742


48,773


39,175Income from operations


70,009


79,922


71,874Interest income


394


3,420


5,474Other income (expense), net


2


(343
)

74Income before income taxes


70,405


82,999


77,422Provision for income taxes


24,232


29,157


26,184Net income

$
46,173

$
53,842

$
51,238




Years Ended December 31,2009

2008

2007Revenue


100.0
%

100.0
%

100.0
%Cost of revenue


27.8


28.6


29.0Gross profit


72.2


71.4


71.0Operating expenses:Research and development


14.1


13.6


11.9Sales and marketing


9.2


8.9


8.5General and administrative


6.0


4.6


4.7Total operating expenses


29.3


27.1


25.0Income from operations


43.0


44.3


46.0Interest income


0.2


1.9


3.5Other income (expense), net


0.0


(0.2
)

0.0Income before income taxes


43.2


46.0


49.5Provision for income taxes


14.9


16.2


16.7Net income


28.3
%

29.9
%

32.8
%


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Table of Contents

Comparison of Year Ended December 31, 2009 to Year Ended December 31, 2008

Revenue.Our revenue decreased $17.3 million, or 9.6%, to $163.0 million in 2009, from $180.3 million in 2008. Revenue
from
sales to customers outside the United States accounted for 57.3% of our total revenue in 2009, compared with 59.3% in 2008. Our revenue decrease was primarily attributable to decreased sales to the
broadband, microwave and millimeterwave communications and test and measurement markets, caused primarily by the recent global economic downturn and related credit crisis, partially offset by an
increase in sales to the cellular infrastructure market.

Gross margin.Our gross margin was 72.2% in 2009 compared with 71.4% in 2008. The increase in gross margin was primarily attributable
to a favorable
change in product mix and favorable project costs on certain government contracts, partially offset by unfavorable pricing.

Research and development expense.Our research and development expense decreased $1.5 million, or 6.0%, to $23.0 million in
2009, and
represented 14.1% of our revenue, compared with $24.4 million, or 13.6% of our revenue, in 2008. The decrease in our research and development expense was attributable to a $0.6 million
decrease in personnel costs, a $0.5 million decrease in depreciation, and a $0.4 million decrease in other costs. The decrease in personnel costs reflects our cost savings initiatives,
partially offset by the cost increase associated with a shift in engineering resources from customer sponsored activities, the costs for which are charged to cost of revenue, to internal research and
development activities.

Sales and marketing expense.Our sales and marketing expense decreased $1.0 million, or 6.0%, to $15.0 million in 2009, and
represented
9.2% of our revenue, compared with $16.0 million, or 8.9% of our revenue, in 2008. The decrease in our sales and marketing expense was primarily attributable to a $0.4 million decrease
in personnel costs, a $0.2 million decrease in advertising and a $0.2 million net decrease in other costs, primarily due to our cost savings initiatives. In addition, third party
commissions decreased $0.2 million, due to our decrease in revenue.

General and administrative expense.Our general and administrative expense increased $1.4 million, or 16.7%, to $9.7 million
in 2009,
and represented 6.0% of our revenue, compared with $8.3 million, or 4.6% of our revenue, in 2008. The increase in our general and administrative expense was primarily attributable to a
$1.2 million increase in professional fees, including legal fees associated with intellectual property litigation, and a $0.3 million increase in bad debt expense, partially offset by a
$0.1 million net decrease in other costs.

In
light of the recent global recession, we took steps early in 2009 to reduce expenses across our business, and maintained certain of these measures throughout the year. We expect to
increase spending in research and development in order to remain competitive, and our plans for growth also require increased spending to support our operations, sales, marketing and administrative
functions. Accordingly, we expect that our spending will increase as conditions improve.

Interest income.Our interest income decreased $3.0 million to $0.4 million in 2009, compared with $3.4 million in 2008,
as a
result of lower effective yields, due to prevailing market conditions, partially offset by the impact of higher cash and investment balances.

Provision for income taxes.Our provision for income taxes decreased $4.9 million to $24.2 million in 2009, from
$29.2 million
in 2008, representing an effective tax rate of 34.4% in 2009 and 35.1% in 2008. The effective tax rate decreased primarily as a result of an increase in foreign tax benefit, research and development
tax credits and tax benefits from manufacturing activities, partially offset by a decrease in our tax-exempt interest income. Generally, the effective tax rates differ from the federal and
state statutory tax rates primarily due to the impact of federal and state tax credits, tax-exempt interest income and tax benefits from manufacturing activities.

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Table of Contents

Comparison of Year Ended December 31, 2008 to Year Ended December 31, 2007

Revenue.Our revenue increased $23.8 million, or 15.2%, to $180.3 million in 2008, from $156.4 million in 2007. The
growth was
primarily attributable to increased sales to the cellular infrastructure, microwave and millimeterwave communications, and military markets. Our sales growth was primarily due to the increased breadth
of our product offerings and the increased market acceptance of the products we introduced in prior years. Revenue from sales to customers outside the United States accounted for 59.3% of our total
revenue in 2008, compared with 56.4% in 2007.

Cost of revenue and gross margin.Our cost of revenue increased $6.2 million, or 13.7%, to $51.6 million in 2008, from
$45.4 million in 2007, primarily as a result of our increased revenue. In 2008, our gross margin was 71.4%, compared with 71.0% in 2007. The increase in gross margin was primarily attributable
to a favorable change in product mix and a decrease in direct production material costs, partially offset by an increase in higher volume orders, on which we offer higher discounts, an increase in
indirect manufacturing costs and higher project costs on certain government contracts.

Research and development expense.Our research and development expense increased $5.9 million, or 31.8%, to $24.4 million in
2008, from
$18.5 million in 2007, and represented 13.6% of our revenue in 2008 compared with 11.9% in 2007. The increase in our research and development expense was attributable to a $3.9 million
increase in personnel costs, primarily associated with a shift in engineering resources from customer sponsored activities, the costs for which are charged to cost of revenue, to internal research and
development activities, as well as the growth of our engineering organization. In addition, we experienced a $0.8 million increase in depreciation, a $0.5 million increase in engineering
material and a $0.7 million net increase in other costs.

Sales and marketing expense.In 2008, our sales and marketing expense increased $2.7 million, or 20.1%, to $16.0 million in
2008, from
$13.3 million in 2007, and represented 8.9% of our revenue in 2008 compared with 8.5% in 2007. The increase in our sales and marketing expense was primarily attributable to a
$1.3 million increase in personnel costs, associated with the growth of our worldwide direct sales and marketing organization, $0.8 million of intangible asset amortization related to
the October 2007 Velocium strategic agreement, a $0.4 million increase in third party commissions and a $0.2 million net increase in other costs.

General and administrative expense.In 2008, our general and administrative expense increased $1.0 million, or 14.1%, to
$8.3 million
in 2008, from $7.3 million in 2007, and represented 4.6% of our revenue in 2008 compared with 4.7% in 2007. The increase in our general and administrative expense was primarily attributable to
a $0.9 million increase in professional fees and a $0.3 million increase in
personnel costs, primarily due to equity compensation expense, partially offset by a $0.2 million net decrease in other costs.

Interest income.In 2008, our interest income decreased $2.1 million to $3.4 million, compared with $5.5 million in 2007,
as the
increase in our cash and investment balances was more than offset by lower effective yields, due to prevailing market conditions.

Other income (expense), net.In 2008, other expense was $0.3 million, compared with other income of $0.1 million in 2007.
Activity in
both periods related primarily to foreign currency transaction gains and losses recognized arising in the normal course of business.

Provision for income taxes.Our provision for income taxes increased $3.0 million, to $29.2 million in 2008, from
$26.2 million
in 2007, representing an effective tax rate of 35.1% in 2008 and 33.8% in 2007. The effective tax rate increased primarily as a result of the decrease in our tax-exempt interest income and the elected
tax treatment for certain federal and state deductions and incentives provided for under the American Jobs Creation Act of 2004.

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Liquidity and Capital Resources

As of December 31, 2009, we held $220.5 million of cash and cash equivalents. During 2009, given our cash position, we
canceled our $30.0 million bank credit facility, which had been inactive over the past year and had no outstanding balance.

For
the year ended December 31, 2009, cash provided by our operations was $62.4 million, of which the principal components were our net income of $46.2 million and
non-cash charges of $15.6 million, as well as a net decrease in operating assets and liabilities of $2.2 million, partially offset by a net increase in deferred taxes of
$1.6 million. The net decrease in operating assets and liabilities includes a $9.4 million decrease in accounts receivable, due to the timing of customer invoices and our decrease in
revenue, and a decrease in other net operating assets and liabilities of $0.4 million, partially offset by a $7.6 million increase in standard catalog and project inventories.

For
the year ended December 31, 2009, we invested $7.3 million in the purchase of capital equipment, primarily for production test equipment and tooling. We received
$3.2 million from the exercise of stock options and $0.8 million from the tax benefit related to our stock-based compensation plans.

In
April 2008, our board of directors authorized a stock repurchase program to offset the dilutive impact of equity-based compensation granted to our employees. The shares may be
repurchased from time to time on the open market or in privately negotiated transactions. Since April 2008, we have repurchased 1,939,924 shares for $61.2 million, including 623,417 shares
purchased for $19.6 million in 2009. The timing, price and volume of any additional repurchases will be based on market conditions, relevant securities law and other factors as appropriate and
repurchases may be suspended or discontinued at any time.

We
believe that our cash, cash equivalents and cash generated from operations will be sufficient to meet our anticipated cash requirements for at least the next 12 months. Our
future capital requirements will depend on many factors, including our rate of revenue growth or decline, the timing and extent of spending to support product development efforts, the expansion of our
sales and marketing activities, the timing and introduction of new products, the costs to ensure access to adequate manufacturing capacity and the continuing market acceptance of our products. There
is no assurance that additional financing, if required or desired, will be available in amounts or on terms acceptable to us, if at all.

Backlog

We typically do not enter into long-term purchase contracts with our customers, and our revenue in any period is dependent
to a significant extent on orders for standard products booked and shipped in that period. Additionally, despite the existence of contractual penalties, our customers from time to time cancel
or delay scheduled purchases. As a result, we use backlog for purposes of scheduling production but do not consider it to be an accurate indicator of sales for any future period. Generally, we include
in our backlog all accepted purchase orders for which the customer has specified a delivery date within the next 12 months, as well as long-term production contracts that require
longer than 12 months to perform and for which funding is committed. At December 31, 2009, our backlog was $63.9 million, compared to $39.6 million at December 31,
2008.

Recent Accounting Pronouncements

In June 2009, the FASB issued authoritative guidance that is included in ASC 105, "Generally Accepted Accounting Principles." This
guidance establishes the FASB Accounting Standards Codification as the source of authoritative U.S. Generally Accepted Accounting Principles (GAAP) recognized by the FASB to be applied by
nongovernmental entities. We adopted this guidance effective

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July 1,
2009. This guidance does not change GAAP, therefore its adoption had no impact on our financial position or results of operations. References to GAAP in this Annual Report on
Form 10-K have been updated to reflect the ASC.

In
September 2006, the FASB issued authoritative guidance that is included in ASC 820, "Fair Value Measurements and Disclosures." This guidance clarifies the definition of fair value,
establishes guidelines for measuring fair value and expands the related disclosure requirements. We adopted this guidance effective January 1, 2008, except as it applies to certain
non-financial assets and non-financial liabilities, for which the guidance was implemented effective January 1, 2009. Such adoption did not have a material impact on our
financial position or results of operations. See Note 3 to the Consolidated Financial Statements included in this Form 10-K for disclosures regarding the fair value of our
financial instruments.

In
December 2007, the FASB issued authoritative guidance that is included in ASC 805, "Business Combinations." This guidance establishes principles and requirements for how an acquirer
recognizes and measures the identifiable assets and goodwill acquired, liabilities assumed and noncontrolling interests. The guidance also establishes disclosure requirements to enable the evaluation
of the nature and financial effects of the business combination. In April 2009, the FASB amended and clarified this guidance with respect to the initial recognition and measurement, subsequent
measurement and disclosure of contingent assets and liabilities arising from a business combination. We adopted this guidance effective January 1, 2009. Such adoption did not have a material
impact on our financial position or results of operations.

In
March 2008, the FASB issued authoritative guidance that is included in ASC 815, "Derivatives and Hedging." This guidance requires enhanced disclosures to enable investors to better
understand the effects of derivative instruments and hedging activities on an entity's financial position, results of operations and cash flows. We adopted this guidance effective January 1,
2009. Such adoption did not have a material impact on our financial position or results of operations.

In
April 2008, the FASB issued authoritative guidance that is included in ASC 350, "IntangiblesGoodwill and Other." This guidance amends the factors that should be
considered in developing renewal or extension assumptions used to determine the useful life of a recognized intangible. The guidance improves the consistency between the useful life of a recognized
intangible asset and the period of expected cash flows used to measure the fair value of the asset. We adopted this guidance effective January 1, 2009. Such adoption did not have a material
impact on our financial position or results of operations.

In
April 2009, the FASB issued authoritative guidance that is included in ASC 320, "InvestmentsDebt and Equity Securities." This guidance amends the guidance for recognizing
other-than-temporary impairments of debt securities, and requires additional disclosures with respect to both debt and equity securities. We adopted this guidance effective
January 1, 2009. Such adoption did not have a material impact on our financial position or results of operations.

In
April 2009, the FASB issued authoritative guidance that is included in ASC 825, "Financial Instruments." This guidance requires that disclosures regarding the fair value of financial
instruments be provided in interim financial statements. We adopted this guidance effective January 1, 2009. Such adoption did not have a material impact on our financial position or results of
operations.

In
May 2009, the FASB issued authoritative guidance that is included in ASC 855, "Subsequent Events." This guidance provides guidance related to the accounting for and disclosure of
events that occur after the balance sheet date but before the financial statements are issued or are available to be issued, and specifies related disclosure requirements. We adopted this guidance for
the quarterly period ended June 30, 2009. Such adoption did not have a material impact on our financial position or results of operations.

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Table of Contents

In
October 2009, the FASB issued Accounting Standards Update (ASU) 2009-13, "Multiple-Deliverable Revenue Arrangements," which amends ASC 605-25. ASU
2009-13 modifies how consideration is allocated for the purpose of revenue recognition when an arrangement involves multiple deliverables and expands the related disclosure requirements.
The guidance eliminates the residual method of revenue allocation, and requires that the vendor use its best estimate to allocate arrangement consideration between the deliverables in cases where
neither vendor-specific objective evidence nor third-party evidence is available. We have elected to early adopt ASU 2009-13 effective January 1, 2010. Accordingly, this guidance
will be applied to transactions originating or materially modified after such date. We do not believe that the adoption of ASU 2009-13 will have a material effect on our financial position
or results of operations.

In
October 2009, the FASB issued ASU 2009-14, "Certain Revenue Arrangements That Include Software Elements," which amends ASC 985-605. ASU 2009-14
modifies the scope of the software revenue guidance in ASC 985-605 to exclude tangible products that contain both software components and non-software components. We have
elected to early adopt ASU 2009-14 effective January 1, 2010. Accordingly, this guidance will be applied to transactions originating or materially modified after such date. We do
not believe that the adoption of ASU 2009-14 will have a material effect on our financial position or results of operations.

Contractual Obligations

At December 31, 2009, our known contractual obligations were as follows:

Payments Due by PeriodContractual Obligations

Total

Less than
1 Year

1-3
Years

3-5
Years

More than
5 Years(In thousands)Operating leases

$
1,453

$
686

$
767

$


$



As
of December 31, 2009, the total amount of net unrecognized tax benefits for uncertain tax positions and the accrual for the related interest was $6.0 million. Although
it is reasonably possible that the unrecognized tax benefits for tax positions taken on previously filed tax returns could materially change in the next 12 months, we are unable to make a reasonably
reliable estimate as to when cash settlement of the $6.0 million, if any, will occur with a tax authority as the timing of examinations and ultimate resolution of those examinations is
uncertain.

Item 7A.    Quantitative and Qualitative Disclosures About Market Risk

We are exposed to market risk in the ordinary course of business, which consists primarily of interest rate risk associated with our
cash and cash equivalents, as well as foreign exchange rate risk.

Interest rate risk.The primary objectives of our investment activity are to preserve principal, provide liquidity and earn a market
rate of return.
To minimize market risk, we maintain our portfolio in cash and diversified short-term investments, which may consist of bank deposits, money market funds and highly rated,
short-term government and commercial securities. The interest rates are variable and fluctuate with current market conditions. The risk associated with fluctuating interest rates is
limited to this investment portfolio. We do not believe that a 10% change in interest rates would have a material impact on our financial position or results of operations.

Foreign currency risk.To date, our international customer agreements have been denominated primarily in United States dollars.
Accordingly, we have
limited exposure to foreign currency exchange rates and do not enter into foreign currency hedging transactions. The functional currency of each our foreign operations is the local currency.
Accordingly, the effects of exchange rate fluctuations on the net assets of these operations are accounted for as translation gains or losses in accumulated other

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Table of Contents

comprehensive
income within stockholders' equity. We do not believe that a change of 10% in such foreign currency exchange rates would have a material impact on our financial position or results of
operations.

Item 8.    Financial Statements and Supplementary Data

This information is incorporated by reference from pages F-1 through F-23 of this report.

Item 9.    Changes in and Disagreements With Accountants on Accounting and Financial Disclosure

None.

Item 9A.    Controls and Procedures

Evaluation of Disclosure Controls and Procedures.Our management (with the participation of our Chief Executive Officer and Chief
Financial Officer)
evaluated the effectiveness of our disclosure controls and procedures (as defined in Rules 13a-15(e) and 15d-15(e) under the Securities Exchange Act of 1934, as amended
(the "Exchange Act")), as of December 31, 2009. Disclosure controls and procedures are designed to ensure that information required to be disclosed by us in the reports we file or submit under
the Exchange Act is recorded, processed, summarized and reported on a timely basis and that such information is accumulated and communicated to management, including the Chief Executive Officer and
Chief Financial Officer, as appropriate, to allow timely decisions regarding required disclosure. A control system, no matter how well designed and operated, can provide only reasonable, not absolute,
assurance that the objectives of the control system are met. Further, because of the inherent limitations in all control systems, no evaluation of controls can provide absolute assurance that all
control issues and instances of fraud, if any, have been or will be detected. These inherent limitations include the fact that there are resource constraints, and that the benefits of controls must be
considered relative to their costs. Based on this evaluation, our Chief Executive Officer and Chief Financial Officer concluded that, as of December 31, 2009, our disclosure controls and
procedures were effective in providing reasonable assurance that information required to be disclosed by us in the reports that we file or submit under the Exchange Act is recorded, processed,
summarized, reported and accumulated and communicated to our management, including our Chief Executive Officer and Chief Financial Officer, as appropriate to allow timely decisions regarding required
disclosure.

Management's Annual Report on Internal Control Over Financial Reporting

Our management, including our Chief Executive Officer and Chief Financial Officer, is responsible for establishing and maintaining
adequate internal control over financial reporting (as defined in Exchange Act Rules 13a-15(f) and 15d-15(f)) for the Company. Internal control over financial reporting
is a process designed to provide reasonable assurance regarding the reliability of financial reporting and the preparation of financial statements for external purposes in accordance with generally
accepted accounting principles. Our management conducted an assessment of the effectiveness of our internal control over financial reporting as of December 31, 2009 based on criteria
established in "Internal ControlIntegrated Framework" issued by the Committee of Sponsoring Organizations of the Treadway Commission (COSO). Based on this assessment, our management
concluded that, as of December 31, 2009, our internal control over financial reporting was effective.

Our
independent registered public accounting firm, PricewaterhouseCoopers LLP, has audited the effectiveness of our internal control over financial reporting, as stated in their
report that appears on page F-2 of this Annual Report on Form 10-K.

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Table of Contents

Changes in Internal Control over Financial Reporting

There have been no changes in our internal control over financial reporting during the fiscal quarter ended December 31, 2009,
that have materially affected or are reasonably likely to materially affect our internal control over financial reporting.

Limitations on Effectiveness of Controls

Our management has concluded that our disclosure controls and procedures and internal controls provide reasonable assurance that the
objectives of our control system are met. However, our management (including our Chief Executive Officer and Chief Financial Officer) does not expect that the disclosure controls and procedures or
internal controls will prevent all error and all fraud. A control system, no matter how well designed and operated, can provide only reasonable, not absolute, assurance that the objectives of the
control system are met. Further, the design of a control system must reflect the fact that there are resource constraints, and the benefits of controls must be considered relative to their costs. Due
to the inherent limitations in all control systems, no evaluation of controls can provide absolute assurance that all control issues, errors and instances of fraud, if any, within the Company have
been or will be detected.

Item 9B.    Other Information

None.

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Table of Contents

PART III

Item 10.    Directors, Executive Officers and Corporate Governance

The information regarding our directors, executive officers and corporate governance, including that set forth under the captions
"Election of Directors," "Our Board of Directors and Executive Officers," "Corporate Governance," "Section 16(a) Beneficial Ownership Reporting Compliance," and "Information about Our Audit
Committee" appearing in our definitive Proxy Statement for our 2010 Annual Meeting of Shareholders to be filed with the Securities and Exchange Commission not later than April 30, 2010 (the
"Definitive Proxy Statement") is incorporated herein by reference.

Item 11.    Executive Compensation

The information regarding compensation of our executive officers, including that set forth under the captions "Director Compensation,"
"Compensation Committee Interlocks and Insider Participation," "Compensation of Executive Officers," "Compensation Discussion and Analysis" and "Compensation Committee Report" appearing in our
Definitive Proxy Statement is incorporated herein by reference.

Item 12.    Security Ownership of Certain Beneficial Owners and Management and Related Stockholder Matters

The information set forth under the captions "Equity Compensation Plan Information" and "Information about Common Stock Ownership"
appearing in our Definitive Proxy Statement is incorporated herein by reference.

Item 13.    Certain Relationships and Related Transactions and Director Independence

The information set forth under the caption "Certain Relationships and Related Transactions" appearing in our Definitive Proxy
Statement is incorporated herein by reference.

Item 14.    Principal Accountant Fees and Services

The information set forth under the caption "Principal Accountant Fees and Services" appearing in our Definitive Proxy Statement is
incorporated herein by reference.

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PART IV

Item 15.    Exhibits and Financial Statement Schedules

(a) Documents Filed as Part of this Annual Report on Form 10-K

1.
Financial Statements (included in Item 8 of this report on Form 10-K and appearing on pages F-1 through F-23):



(b) Exhibits

Documents listed below, except for documents followed by parenthetical references, are being filed as exhibits. Documents followed by
parenthetical references are not being filed herewith and, pursuant to Rule 12b-32 of the General Rules and Regulations promulgated by the SEC under the Securities Exchange Act of
1934 (the Act), reference is made to such documents as previously filed as exhibits with the SEC. Our file number under the Act is 000-51448.

3.1

Second Amended and Restated Certificate of Incorporation (incorporated by reference to Exhibit 3.1 to our Current Report on Form 8-K filed on August 2, 2005, referred to herein as the "2005
Report on Form 8-K").3.2

Amended and Restated By-laws (incorporated by reference to Exhibit 3.2 to our Quarterly Report on Form 10-Q for the quarter ended June 30, 2008).4.1

Specimen certificate for common stock of Hittite Microwave Corporation (incorporated by reference to Exhibit 4.1 to our Registration Statement on Form S-1, File No. 333-124664).*10.1

Form of Stock Option Agreement pursuant to the 2005 Stock Incentive Plan of Hittite Microwave Corporation (incorporated by reference to Exhibit 10.1 to our Quarterly Report on Form 10-Q for the
quarter ended September 30, 2005).*10.2

Form of Restricted Stock Agreement pursuant to the 2005 Stock Incentive Plan of Hittite Microwave Corporation.*10.3

Amended and Restated 1996 Stock Option Plan of Hittite Microwave Corporation and form of agreement related thereto (incorporated by reference to Exhibit 10.1 to our Registration Statement on
Form S-1, File No. 333-124664).*10.4

2005 Stock Incentive Plan of Hittite Microwave Corporation and forms of agreements related thereto (incorporated by reference to Exhibit 10.2 to our Registration Statement on Form S-1, File
No. 333-124664).10.5

Registration Rights Agreement, dated November 20, 2000, by and among Hittite Microwave Corporation, Dr. Yalcin Ayasli and the holders of Hittite Microwave Corporation's Series A Convertible
Preferred Stock (incorporated by reference to Exhibit 10.3 to our Registration Statement on Form S-1, File No. 333-124664).10.11

Letter of Indemnification Agreement, dated July 17, 2002, by and between Hittite Microwave Corporation and Cosmo Trapani (incorporated by reference to Exhibit 10.9 to our Registration Statement
on Form S-1, File No. 333-124664).


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Table of Contents

10.12

Letter of Indemnification Agreement, dated July 17, 2002, by and between Hittite Microwave Corporation and Bruce Evans (incorporated by reference to Exhibit 10.10 to our Registration Statement on
Form S-1, File No. 333-124664).*10.25

Non-employee director compensation plan.*10.30

Form of Indemnification Agreement dated December 10, 2008, between Hittite Microwave Corporation and each of Stephen G. Daly, Ernest L. Godshalk, Rick D. Hess, Adrienne M. Markham,
Brian P. McAloon, Cosmo S. Trapani and Frankin Weigold (incorporated by reference to Exhibit 10.30 to our Annual Report on Form 10-K for the year ended December 31, 2008).*10.31

Form of Noncompete Agreement (Senior Employee) entered into between the Company and each of Stephen G. Daly, William W. Boecke, Everett N. Cole, III, William D. Hannabach, Norman G. Hildreth, Jr.,
 Dong Hyun (Thomas) Hwang, Brian J. Jablonski, Michael J. Koechlin and Michael A. Olson.21.1

List of Subsidiaries of the Registrant.23.1

Consent of PricewaterhouseCoopers LLP31.1

Certification of Chief Executive Officer pursuant to Rule 13a-14(a)31.2

Certification of Chief Financial Officer pursuant to Rule 13a-14(a)32.1

Certification of Chief Executive Officer pursuant to Section 135032.2

Certification of Chief Financial Officer pursuant to Section 1350


*Management
contract or compensatory plan or arrangement


(c) Financial Statement Schedules

All schedules are omitted because they are either not applicable or the required information is shown on the financial statements or
notes thereto.

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SIGNATURES

Pursuant to the requirements of Section 13 or 15(d) of the Securities Exchange Act of 1934, the registrant has duly caused this
report to be signed on its behalf by the undersigned, thereunto duly authorized, on the 26th day of February, 2010.

HITTITE MICROWAVE CORPORATIONBy:

/s/ STEPHEN G. DALY Chief Executive Officer


Pursuant
to the requirements of the Securities Exchange Act of 1934, this report has been signed below by the following persons on behalf of the registrant and in the capacities and on
the dates indicated.

Signature

Title

Date/s/ STEPHEN G. DALY Stephen G. Daly

Chairman of the Board, President
and Chief Executive Officer
(Principal Executive Officer)

February 26, 2010/s/ WILLIAM W. BOECKE William W. Boecke

Vice President, Chief Financial
Officer and Treasurer (Principal Financial and Accounting Officer)

February 26, 2010/s/ ERNEST L. GODSHALK Ernest L. Godshalk

Director

February 26, 2010/s/ RICK D. HESS Rick D. Hess

Director

February 26, 2010/s/ ADRIENNE M. MARKHAM Adrienne M. Markham

Director

February 26, 2010/s/ BRIAN P. MCALOON Brian P. McAloon

Director

February 26, 2010/s/ COSMO S. TRAPANI Cosmo S. Trapani

Director

February 26, 2010/s/ FRANKLIN WEIGOLD Franklin Weigold

Director

February 26, 2010


58

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Table of Contents

HITTITE MICROWAVE CORPORATION

INDEX TO CONSOLIDATED FINANCIAL STATEMENTS



Page(s)Report of Independent Registered Public Accounting Firm


F-2Consolidated Financial StatementsConsolidated Balance Sheets at December 31, 2009 and 2008


F-3Consolidated Statements of Operations for the Years Ended December 31, 2009, 2008 and 2007


F-4Consolidated Statements of Stockholders' Equity and Comprehensive Income for the Years Ended
December 31, 2009, 2008 and 2007


F-5Consolidated Statements of Cash Flows for the Years Ended December 31, 2009, 2008 and 2007


F-6Notes to Consolidated Financial Statements


F-7


F-1

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Table of Contents

Report of Independent Registered Public Accounting Firm

To
the Board of Directors and Stockholders of
Hittite Microwave Corporation

In
our opinion, the accompanying consolidated balance sheets and the related consolidated statements of operations, stockholders' equity and comprehensive income and cash flows present
fairly, in all material respects, the financial position of Hittite Microwave Corporation and its subsidiaries at December 31, 2009 and December 31, 2008, and the results of their
operations and their cash flows for each of the three years in the period ended December 31, 2009 in conformity with accounting principles generally accepted in the United States of America.
Also in our opinion, the Company maintained, in all material respects, effective internal control over financial reporting as of December 31, 2009, based on criteria established in Internal ControlIntegrated
Frameworkissued by the Committee of Sponsoring Organizations of the Treadway Commission (COSO). The Company's
management is responsible for these financial statements, for maintaining effective internal control over financial
reporting and for its assessment of the effectiveness of internal control over financial reporting, included in Management's Annual Report on Internal Control over Financial Reporting under
Item 9A. Our responsibility is to express opinions on these financial statements and on the Company's internal control over financial reporting based on our integrated audits. We conducted our
audits in accordance with the standards of the Public Company Accounting Oversight Board (United States). Those standards require that we plan and perform the audits to obtain reasonable assurance
about whether the financial statements are free of material misstatement and whether effective internal control over financial reporting was maintained in all material respects. Our audits of the
financial statements included examining, on a test basis, evidence supporting the amounts and disclosures in the financial statements, assessing the accounting principles used and significant
estimates made by management, and evaluating the overall financial statement presentation. Our audit of internal control over financial reporting included obtaining an understanding of internal
control over financial reporting, assessing the risk that a material weakness exists, and testing and evaluating the design and operating effectiveness of internal control based on the assessed risk.
Our audits also included performing such other procedures as we considered necessary in the circumstances. We believe that our audits provide a reasonable basis for our opinions.

A
company's internal control over financial reporting is a process designed to provide reasonable assurance regarding the reliability of financial reporting and the preparation of
financial statements for external purposes in accordance with generally accepted accounting principles. A company's internal control over financial reporting includes those policies and procedures
that (i) pertain to the maintenance of records that, in reasonable detail, accurately and fairly reflect the transactions and dispositions of the assets of the company; (ii) provide
reasonable assurance that transactions are recorded as necessary to permit preparation of financial statements in accordance with generally accepted accounting principles, and that receipts and
expenditures of the company are being made only in accordance with authorizations of management and directors of the company; and (iii) provide reasonable assurance regarding prevention or
timely detection of unauthorized acquisition, use, or disposition of the company's assets that could have a material effect on the financial statements.

Because
of its inherent limitations, internal control over financial reporting may not prevent or detect misstatements. Also, projections of any evaluation of effectiveness to future
periods are subject to the risk that controls may become inadequate because of changes in conditions, or that the degree of compliance with the policies or procedures may deteriorate.

/s/
PricewaterhouseCoopers LLP

Boston,
Massachusetts
February 26, 2010

F-2

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Table of Contents



HITTITE MICROWAVE CORPORATION        CONSOLIDATED BALANCE SHEETS        (in thousands, except per share data)

December 31,2009

2008AssetsCurrent assets:Cash and cash equivalents

$
220,477

$
180,856Accounts receivable, net of allowance for doubtful accounts of $334 and $234, respectively


17,886


27,650Inventories


19,564


13,981Deferred costs


114


139Income taxes receivable





20Prepaid expenses and other current assets


1,450


1,127Deferred taxes


7,946


6,206Total current assets


267,437


229,979Property and equipment, net


19,933


17,927Other assets


5,323


7,178Total assets

$
292,693

$
255,084Liabilities and stockholders' equityCurrent liabilities:Accounts payable

$
1,632

$
2,778Accrued commissions


766


1,307Accrued payroll and benefits


1,747


2,497Accrued other expenses


3,695


3,032Income taxes payable


209


Customer advances


584


723Deferred revenue


3,432


2,748Total current liabilities


12,065


13,085Long-term income taxes payable


5,960


4,689Deferred taxes


519


381Total liabilities


18,544


18,155Commitments and contingencies (Note 8)Stockholders' equity:Preferred stock, $.01 par value: 5,000 shares authorized; no shares issued or outstanding at December 31, 2009 and 2008





Common stock, $.01 par value: 200,000 shares authorized; 30,209 and 30,291 shares issued and outstanding at December 31, 2009 and 2008,
respectively


302


303Additional paid-in capital


131,750


121,274Accumulated other comprehensive income (loss)


117


(73
)Retained earnings


141,980


115,425Total stockholders' equity


274,149


236,929Total liabilities and stockholders' equity

$
292,693

$
255,084


The
accompanying notes are an integral part of these consolidated financial statements.

F-3

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Table of Contents



HITTITE MICROWAVE CORPORATION        CONSOLIDATED STATEMENTS OF OPERATIONS        (in thousands, except per share data)

Year ended December 31,2009

2008

2007Revenue

$
162,990

$
180,251

$
156,412Cost of revenue


45,239


51,556


45,363Gross profit


117,751


128,695


111,049Operating expenses:Research and development


22,971


24,438


18,546Sales and marketing


15,034


15,988


13,313General and administrative


9,737


8,347


7,316Total operating expenses


47,742


48,773


39,175Income from operations


70,009


79,922


71,874Interest income


394


3,420


5,474Other income (expense), net


2


(343
)

74Income before income taxes


70,405


82,999


77,422Provision for income taxes


24,232


29,157


26,184Net income

$
46,173

$
53,842

$
51,238Earnings per share:Basic

$
1.57

$
1.77

$
1.67Diluted

$
1.55

$
1.74

$
1.64Weighted average shares outstanding:Basic


29,380


30,473


30,630Diluted


29,850


30,955


31,263


The
accompanying notes are an integral part of these consolidated financial statements.

F-4

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Table of Contents



HITTITE MICROWAVE CORPORATION        CONSOLIDATED STATEMENTS OF STOCKHOLDERS' EQUITY AND        COMPREHENSIVE INCOME        (in thousands)

Common Stock



Accumulated
Other
Comprehensive
Income (Loss)Additional
Paid-in
Capital

Retained
Earnings

Total
Stockholders'
Equity

Comprehensive
IncomeShares

AmountBalance, December 31, 2006


30,707

$
307

$
103,644

$
157

$
52,054

$
156,162Exercise of stock options


276


3


2,731








2,734Foreign currency translation











394





394

$
394Stock-based compensation expense








4,087








4,087Net income














51,238


51,238


51,238Excess income tax benefit related to stock-based compensation plans








1,830








1,830Issuance of restricted common stock under stock plan, net of forfeitures


93


1


(1
)







Impact of the adoption of new accounting guidance for uncertain tax positions














(152
)

(152
)Comprehensive income



















$
51,632Balance, December 31, 2007


31,076


311


112,291


551


103,140


216,293Exercise of stock options


181


2


2,309








2,311Foreign currency translation











(624
)




(624
)
$
(624
)Stock-based compensation expense








5,668








5,668Net income














53,842


53,842


53,842Excess income tax benefit related to stock-based compensation plans








1,009








1,009Issuance of restricted common stock under stock plan, net of forfeitures


350


3


(3
)







Purchase of Company common stock


(1,316
)

(13
)







(41,557
)

(41,570
)Comprehensive income



















$
53,218Balance, December 31, 2008


30,291


303


121,274


(73
)

115,425


236,929Exercise of stock options


243


2


3,165








3,167Foreign currency translation











190





190

$
190Stock-based compensation expense








6,492








6,492Net income














46,173


46,173


46,173Excess income tax benefit related to stock-based compensation plans








822








822Issuance of restricted common stock under stock plan, net of forfeitures


298


3


(3
)







Purchase of Company common stock


(623
)

(6
)







(19,618
)

(19,624
)Comprehensive income



















$
46,363Balance, December 31, 2009


30,209

$
302

$
131,750

$
117

$
141,980

$
274,149


The accompanying notes are an integral part of these consolidated financial statements.

F-5

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Table of Contents



HITTITE MICROWAVE CORPORATION        CONSOLIDATED STATEMENTS OF CASH FLOWS        (in thousands)

Year ended December 31,2009

2008

2007Cash flows from operating activities:Net income

$
46,173

$
53,842

$
51,238Adjustments to reconcile net income to net cash provided by operating activities:Depreciation


5,368


5,675


4,744Amortization


1,437


1,443


261Provision for doubtful accounts


352


46


28Provision for excess or obsolete inventory


1,988


1,678


655Deferred taxes


(1,602
)

(1,700
)

(987
)Stock-based compensation


6,492


5,668


4,087Changes in operating assets and liabilities:Accounts receivable


9,421


(5,252
)

(3,843
)Inventories


(7,570
)

(1,530
)

(3,835
)Deferred costs


24


103


164Other assets


123


(920
)

(419
)Deferred revenue and customer advances


545


(2,627
)

347Accounts payable


(1,146
)

131


1,168Accrued expenses


(645
)

765


1,208Income taxes


1,482


2,638


(1,553
)Net cash provided by operating activities


62,442


59,960


53,263Cash flows from investing activities:Purchases of property and equipment


(7,302
)

(5,232
)

(8,878
)Purchases of available-for-sale investments





(28,294
)

(243,742
)Sales and maturities of available-for-sale investments





127,301


183,492Purchase of Velocium intangible assets








(7,080
)Net cash provided by (used in) investing activities


(7,302
)

93,775


(76,208
)Cash flows from financing activities:Purchase of Company common stock


(19,624
)

(41,570
)

Proceeds from exercise of stock options


3,167


2,311


2,734Excess income tax benefit related to stock-based compensation plans


822


1,009


1,830Net cash provided by (used in) financing activities


(15,635
)

(38,250
)

4,564Effect of exchange rate changes on cash and cash equivalents


116


(364
)

318Net increase (decrease) in cash and cash equivalents


39,621


115,121


(18,063
)Cash and cash equivalents, beginning of year


180,856


65,735


83,798Cash and cash equivalents, end of year

$
220,477

$
180,856

$
65,735Supplemental cash flow information:Cash paid for taxes

$
23,502


27,376


27,628


The accompanying notes are an integral part of these consolidated financial statements.

F-6

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Table of Contents

HITTITE MICROWAVE CORPORATION        NOTES TO CONSOLIDATED FINANCIAL STATEMENTS

1.     Nature of the Business

Hittite Microwave Corporation (the "Company") designs and develops high performance integrated circuits, modules and subsystems for technically demanding radio
frequency, microwave and millimeterwave applications. The Company's products are used in a variety of applications and end markets, including automotive, broadband, cellular infrastructure, fiber
optic, microwave and millimeterwave communications, military, space, and test and measurement. The Company was organized as a Massachusetts corporation in 1985 and reincorporated under the laws of
Delaware in 1988. The Company is headquartered and has its primary design and manufacturing center in
Chelmsford, MA. In addition, the Company operates design centers in Colorado Springs, CO, Istanbul, Turkey, and Ottawa, Ontario, Canada, and has sales offices in China, Germany, India, Japan, Korea,
Sweden and the United Kingdom.

2.     Summary of Significant Accounting Policies

Basis of Presentation

The consolidated financial statements include the accounts of Hittite Microwave Corporation and its wholly-owned subsidiaries and have
been prepared in accordance with generally accepted accounting principles in the United States of America. Intercompany accounts and transactions have been eliminated in consolidation.

Use of Accounting Estimates

The preparation of financial statements in conformity with generally accepted accounting principles requires management to make
estimates and assumptions that affect the reported amount of assets and liabilities and disclosure of contingent assets and liabilities at the date of the financial statements and the reported amounts
of revenue and expenses during the reporting period. Actual results could differ from those estimates.

Revenue Recognition

The Company recognizes revenue for the majority of its business when the following criteria have been met: (1) persuasive
evidence of an arrangement exists; (2) delivery has occurred or services have been rendered; (3) the fee is fixed or determinable; and (4) collectibility is reasonably assured.
For arrangements that involve multiple elements, the Company allocates arrangement consideration among the elements based on the relative fair values of those elements as determined using objective
and reliable evidence of fair value. If the fair value of an undelivered element cannot be established, the arrangement is accounted for as a single unit of accounting and
revenue is recognized when all performance obligations are met. The Company maintains a reserve for potential sales return and allowances. Returns and customer credits are immaterial and are recorded
as a reduction to revenue. Rights of return are generally not included in sales arrangements. A portion of the Company's sales are made to a distributor under an agreement that provides for product
return privileges. As a result, the Company defers recognition of such revenue until the product is resold by the distributor.

Revenue
from contracts with the United States government, government prime contractors and some commercial customers is generally recorded on a percentage of completion basis using costs
incurred as the measurement basis for progress toward completion. Where appropriate, the Company uses an output measure, such as units delivered, to measure progress toward completion. Estimated
revenue in excess of amounts billed is reported as unbilled receivables. Contract accounting requires

F-7

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Table of Contents

judgment
in estimating costs and assumptions related to technical issues and delivery schedule. Contract costs include material, subcontract costs, labor and an allocation of indirect costs. The
estimation of costs at completion of a contract is subject to numerous variables involving contract costs and estimates as to the length of time to complete the contract. Changes in contract
performance and estimated gross margin, including the impact of final contract settlements, are recognized in the period in which the changes are determined. Estimated losses on a contract are
recognized in full in the period when they become known.

Cash and Cash Equivalents

Cash equivalents may include money market funds, as well as highly rated government and commercial securities with maturities of three
months or less at the time of acquisition. Cash equivalents are carried at cost plus accrued interest, which approximates fair market value.

Allowance for Doubtful Accounts

The Company maintains an allowance for doubtful accounts to provide for the estimated amount of accounts receivable that will not be
collected. The allowance is based upon an assessment of customer creditworthiness, historical payment experience and the age of outstanding receivables.

Activity
related to the allowance for doubtful accounts was as follows (in thousands):

Balance at December 31, 2006

$
283Provision


28Utilization


(75
)Balance at December 31, 2007


236Provision


46Utilization


(48
)Balance at December 31, 2008


234Provision


352Utilization


(252
)Balance at December 31, 2009

$
334


Inventories

Inventory is stated at the lower of cost (first-in, first-out method) or market value and includes materials,
labor and manufacturing overhead. The Company reviews the inventory and compares product costs with current market value and writes down any costs in excess of current market value to its net
realizable value. Once the Company has written down inventory to its estimated net realizable value, the carrying value is not changed due to subsequent changes in demand forecasts.

F-8

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Table of Contents

Activity
related to the inventory reserve was as follows (in thousands):

Balance at December 31, 2006

$
1,776Provision


655Utilization


(226
)Balance at December 31, 2007


2,205Provision


1,678Utilization


(208
)Balance at December 31, 2008


3,675Provision


1,988Utilization


(484
)Balance at December 31, 2009

$
5,179


Property and Equipment

Property and equipment are recorded at cost. Depreciation is computed using the straight-line method applied over the
estimated useful lives of the assets, which are generally as follows: machinery and equipment, three to five years; furniture and fixtures, five years; and building, building improvements and related
specialty assets, seven to 30 years. Leasehold improvements are amortized over the shorter of the lease term or the estimated useful life of the related assets.

Cost
of additions and improvements are capitalized while expenditures for maintenance and repairs are charged to expense as incurred. When assets are retired, the related cost and
accumulated depreciation and amortization are removed from the accounts, and any gain or loss is reflected in income.

Long-Lived Assets

Goodwill is carried at cost, and totaled $289,000 at December 31, 2009 and December 31, 2008. The Company evaluates
goodwill for impairment on an annual basis and whenever events or changes in circumstances indicate that it may be impaired. No impairment resulted from this evaluation in the years presented.

Intangible
assets other than goodwill are carried at cost less accumulated amortization. The Company's intangible assets are being amortized over their respective useful lives of five
years. The Company evaluates the recoverability of these assets whenever there is an indication of possible impairment by measuring the carrying amount of the assets against the related estimated
undiscounted future cash flows. When an evaluation indicates that the future undiscounted cash flows are not sufficient to recover the carrying value of the asset, the asset is adjusted to its
estimated fair value.

An
impairment review of goodwill or other long-lived assets could be prompted by significant changes in the manner in which the Company uses the asset, negative industry or
economic trends or underperformance relative to projected operating results.

F-9

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Table of Contents

Accounting for Stock-Based Compensation

For share-based payments made on or after January 1, 2006, the Company measures compensation cost at fair value on the date of
grant, and recognizes this cost as expense over the service period the awards are expected to vest, net of estimated forfeitures. The fair value of restricted stock is determined based on the excess
of the quoted price of the Company's common stock on the date of grant over the exercise price of the restricted stock. The fair value of stock options is determined using the Black-Scholes valuation
model.

Determining
the appropriate fair value model and calculating the fair value of share-based awards requires judgment, including estimating stock price volatility, the expected life of
each equity instrument and the amount of share-based payments that will ultimately either vest or be forfeited. The Company considers many factors when estimating expected forfeitures, including the
type of the award, employee group, and historical experience.

Foreign Currency Translation

The Company has determined that the functional currency of each foreign operation is the respective local currency. Transactions in a
foreign currency are recorded at the rate of exchange on the date of the transaction. Assets and liabilities at year-end are translated at the rate of exchange in effect at the
period-end. Revenue and expenses are translated at average rates of exchange in effect during the period. Translation gains or losses are included as a component of accumulated other
comprehensive income (loss) in stockholders' equity. Transaction gains or losses that arise from exchange rate fluctuations on transactions denominated in a currency in other than the functional
currency are included in the results of operations as incurred. Such transaction gains and losses were not material for the periods presented.

Fair Value of Financial Instruments

The carrying amounts in the accompanying consolidated balance sheets for cash and cash equivalents, accounts receivable and accounts
payable approximate fair value due to their short-term nature.

Comprehensive Income

Comprehensive income is comprised of net income and other comprehensive income (loss). Accumulated other comprehensive income (loss)
consists of the following:

December 31,2009

2008(in thousands)Foreign currency translation

$
117

$
(73
)


Earnings Per Share

Basic net income per share is computed by dividing net income by the weighted-average number of common shares outstanding during the
period, excluding the dilutive effect of common stock equivalents. Diluted net income per share reflects the dilutive effect of common stock equivalents, such as stock options and restricted stock,
under the treasury stock method.

F-10

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Risks and Uncertainties

Financial instruments which potentially subject the Company to credit risk consist primarily of cash, cash equivalents and accounts
receivable. The Company maintains its cash and cash equivalents with high credit quality financial institutions, and monitors credit risk with individual financial institutions and issuers. At
December 31, 2009 and 2008, the Company had cash balances at certain financial institutions in excess of federally insured limits. However, the Company does not believe that it is subject to
unusual credit risk beyond the normal credit risk associated with commercial banking relationships.

The
Company sells its products worldwide through multiple channels, including its direct sales force and applications engineering staff, its network of domestic and international
independent sales representatives, its website and through a distributor. The Company has historically depended on a small number of customers for a large percentage of its annual revenue. Revenue
derived from the Company's 10 largest customers as a percentage of annual revenue was 31.9% in 2009, 34.6% in 2008 and 38.8% in 2007.

The
Company performs credit checks and maintains an allowance for doubtful accounts. The Company generally does not require collateral, although letters of credit are required in certain
circumstances. No customer accounted for 10% or more of the Company's outstanding accounts receivable balance at December 31, 2009 or December 31, 2008.

The
Company typically relies on a single foundry for the production of the semiconductor wafers used in a particular product. The Company also relies on a small number of subcontractors,
primarily in Asia and the United States, to package some of its products, particularly those that utilize standard plastic packages. Reliance on these vendors involves several risks, including reduced
control over the Company's manufacturing costs, delivery times, reliability and process quality, which can adversely affect product quality, and the possible misappropriation of the Company's
technology. Any of these factors could adversely effect the Company's results of operations or financial condition.

Income Taxes

The Company recognizes deferred tax assets and liabilities for the expected future tax consequences of temporary differences between
the financial statements and tax basis of assets and liabilities. Valuation allowances are provided if, based upon the weight of the available evidence, it is more likely than not that some or all of
the deferred assets will not be realized.

The
Company recognizes in its financial statements the tax benefit from an uncertain tax position taken or expected to be taken in an income tax return only if it is more likely than not
that such benefit would be sustained on its technical merits in the event of a tax audit.

Research and Development

Internal research and development expenditures are expensed as incurred, and consist of personnel costs, development materials, license
fees, and other related costs. During 2009, 2008 and 2007, the Company incurred $3,754,000, $8,572,000 and $7,597,000, respectively, of costs for research and development contracts on behalf of
customers. These amounts, funded by customers, are included as cost of revenue in the period the associated revenue is recognized. The Company retains the right to all intellectual property associated
with these efforts, including drawings, processes and know-how.

Recent Accounting Pronouncements

In June 2009, the Financial Accounting Standards Board (FASB) issued authoritative guidance that is included in Accounting Standards
Codification (ASC) 105, "Generally Accepted Accounting Principles." This guidance establishes the FASB Accounting Standards Codification as the source of

F-11

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authoritative
U.S. Generally Accepted Accounting Principles (GAAP) recognized by the FASB to be applied by nongovernmental entities. The Company adopted this guidance effective July 1, 2009.
This guidance does not change GAAP, therefore its adoption had no impact on the Company's financial position or results of operations. References to GAAP in the financial statements have been updated
to reflect the ASC.

In
September 2006, the FASB issued authoritative guidance that is included in ASC 820, "Fair Value Measurements and Disclosures." This guidance clarifies the definition of fair value,
establishes guidelines for measuring fair value and expands the related disclosure requirements. The Company adopted this guidance effective January 1, 2008, except as it applies to certain
non-financial assets and non-financial liabilities, for which the guidance was implemented effective January 1, 2009. Such adoption did not have a material impact on the
Company's financial position or results of operations. See Note 3 for disclosures regarding the fair value of the Company's financial instruments.

In
December 2007, the FASB issued authoritative guidance that is included in ASC 805, "Business Combinations." This guidance establishes principles and requirements for how an acquirer
recognizes and measures the identifiable assets and goodwill acquired, liabilities assumed and noncontrolling interests. The guidance also establishes disclosure requirements to enable the evaluation
of the nature and financial effects of the business combination. In April 2009, the FASB amended and clarified this guidance with respect to the initial recognition and measurement, subsequent
measurement and disclosure of contingent assets and liabilities arising from a business combination. The Company adopted this guidance effective January 1, 2009. Such adoption did not have a
material impact on the Company's financial position or results of operations.

In
March 2008, the FASB issued authoritative guidance that is included in ASC 815, "Derivatives and Hedging." This guidance requires enhanced disclosures to enable investors to better
understand the effects of derivative instruments and hedging activities on an entity's financial position, results of operations and cash flows. The Company adopted this guidance effective
January 1, 2009. Such adoption did not have a material impact on the Company's financial position or results of operations.

In
April 2008, the FASB issued authoritative guidance that is included in ASC 350, "IntangiblesGoodwill and Other." This guidance amends the factors that should be
considered in developing renewal or extension assumptions used to determine the useful life of a recognized intangible. The guidance improves the consistency between the useful life of a recognized
intangible asset and the period of expected cash flows used to measure the fair value of the asset. The Company adopted this guidance effective January 1, 2009. Such adoption did not have a
material impact on the Company's financial position or results of operations.

In
April 2009, the FASB issued authoritative guidance that is included in ASC 320, "InvestmentsDebt and Equity Securities." This guidance amends the guidance for recognizing
other-than-temporary impairments of debt securities and requires additional disclosures with respect to both debt and equity securities. The Company adopted this guidance
effective January 1, 2009. Such adoption did not have a material impact on the Company's financial position or results of operations.

In
April 2009, the FASB issued authoritative guidance that is included in ASC 825, "Financial Instruments." This guidance requires that disclosures regarding the fair value of financial
instruments be provided in interim financial statements. The Company adopted this guidance effective January 1, 2009. Such adoption did not have a material impact on the Company's financial
position or results of operations.

In
May 2009, the FASB issued authoritative guidance that is included in ASC 855, "Subsequent Events." This guidance provides guidance related to the accounting for and disclosure of
events that occur after the balance sheet date but before the financial statements are issued or are available to be issued, and specifies related disclosure requirements. The Company adopted this
guidance for the

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quarterly
period ended June 30, 2009. Such adoption did not have a material impact on the Company's financial position or results of operations.

In
October 2009, the FASB issued Accounting Standards Update (ASU) 2009-13, "Multiple-Deliverable Revenue Arrangements," which amends ASC 605-25. ASU
2009-13 modifies how consideration is allocated for the purpose of revenue recognition when an arrangement involves multiple deliverables and expands the related disclosure requirements.
The guidance eliminates the residual method of revenue allocation, and requires that the vendor use its best estimate to allocate arrangement consideration between the deliverables in cases where
neither vendor-specific objective evidence nor third-party evidence is available. The Company has elected to early adopt ASU 2009-13 effective January 1, 2010. Accordingly, this
guidance will be applied to transactions originating or materially modified after such date. The Company does not believe that the adoption of ASU 2009-13 will have a material effect on
its financial position or results of operations.

In
October 2009, the FASB issued ASU 2009-14, "Certain Revenue Arrangements That Include Software Elements," which amends ASC 985-605. ASU 2009-14
modifies the scope of the software revenue guidance in ASC 985-605 to exclude tangible products that contain both software components and non-software components. The Company
has elected to early adopt ASU 2009-14 effective January 1, 2010. Accordingly, this guidance will be applied to transactions originating or materially modified after such date. The
Company does not believe that the adoption of ASU 2009-14 will have a material effect on its financial position or results of operations.

3.     Fair Value of Financial Instruments

The Company measures at fair value certain financial assets and financial liabilities. Fair value is the price that would be received for an asset, or the exit
price that would be paid to transfer a liability, in the principal or most advantageous market in an orderly transaction between market participants on the measurement date. There are three levels of
inputs used to measure fair value, arranged in a hierarchy that maximizes the use of observable inputs:

Level 1:

Quoted prices in active markets for identical assets or liabilities.Level 2:

Observable inputs other than Level 1 prices, such as quoted prices for similar assets or liabilities, quoted prices in markets that are not active or other inputs that are observable or can be
corroborated by observable market data for substantially the full term of the related assets or liabilities.Level 3:

Unobservable inputs that are supported by little or no market activity.


Assets
and liabilities measured at fair value are classified in their entirety based on the lowest level of input that is significant to the fair value measurement. The Company's
assessment of the significance of a particular input to the fair value measurement requires judgment and considers factors specific to the asset or liability. The following table sets forth the
Company's financial assets that were measured at fair value within the fair value hierarchy:

December 31, 2009

December 31, 2008Level 1

Level 2

Level 3

Total

Level 1

Level 2

Level 3

Total(in thousands)Money market funds

$
195,530

$


$


$
195,530

$
166,504

$


$


$
166,504


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4.     Accounts Receivable

Accounts receivable consist of the following:

December 31,2009

2008(in thousands)Commercial:Billed

$
16,212

$
21,699Unbilled





80U.S. government and government prime contractors:Billed


670


2,136Unbilled


1,080


3,828Retainage


258


14118,220


27,884Less: Allowance for doubtful accounts


334


234Net accounts receivable

$
17,886

$
27,650


5.     Inventories

Net inventories consist of the following:

December 31,2009

2008(in thousands)Raw materials

$
6,976

$
7,397Work in process


7,153


2,986Finished goods


5,435


3,598$
19,564

$
13,981


6.     Property and Equipment

Property and equipment consist of the following:

December 31,2009

2008(in thousands)Land and building

$
6,740

$
6,208Machinery and equipment


41,548


38,964Furniture and fixtures


717


690Leasehold improvements


122


8649,127


45,948Less: Accumulated depreciation and amortization


29,194


28,021Net property and equipment

$
19,933

$
17,927


Depreciation
and amortization expense related to the Company's property and equipment was $5,368,000, $5,675,000 and $4,744,000 in 2009, 2008 and 2007, respectively.

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Table of Contents

7.     Intangible Assets

On October 17, 2007, the Company entered into a strategic agreement with Northrop Grumman Space Technology sector to market a specified list of existing
Velocium products worldwide, to license related technology and to assume the associated customer relationships, at a cost of $7,080,000.

The
Company's intangible assets, all of which relate to the Velocium strategic agreement and are included in other assets in the accompanying consolidated balance sheets, consist of the
following:

December 31, 2009

December 31, 2008Gross
Carrying
Amount

Accumulated
Amortization

Net

Gross
Carrying
Amount

Accumulated
Amortization

Net(in thousands)Licensed technology

$
2,711

$
1,175

$
1,536

$
2,711

$
632

$
2,079Non-compete agreement


2,800


1,213


1,587


2,800


653


2,147Customer relationships


1,569


679


890


1,569


366


1,203Total intangible assets

$
7,080

$
3,067

$
4,013

$
7,080

$
1,651

$
5,429


The
Company's intangible assets are being amortized over their original estimated useful lives of 5 years. Amortization expense associated with these assets was $1,416,000,
$1,415,000 and $236,000 in 2009, 2008 and 2007, respectively. The accompanying consolidated statements of operations for 2009, 2008 and 2007 reflect such amortization as $874,000, $873,000 and
$146,000 of sales and marketing expense and $542,000, $542,000 and $90,000 of cost of revenue, respectively. Based on the current amount of intangible assets subject to amortization, amortization
expense is estimated to be $1,416,000, $1,416,000, $1,181,000, $0 and $0 for 2010, 2011, 2012, 2013 and 2014, respectively.

8.     Commitments and Contingencies

Lease Arrangements

The Company leases office space and equipment under operating leases. The following table summarizes future minimum rental payments
under these leases as of December 31, 2009 (in thousands):

2010

$
6862011


5832012


1842013


2014


Later years


$
1,453


Rental
expense during 2009, 2008 and 2007 was $1,013,000, $962,000 and $878,000, respectively.

Indemnification

In connection with the sale of products in the ordinary course of business, the Company often makes representations affirming, among
other things, that its products do not infringe on the intellectual property rights of others, and agrees to indemnify customers against third-party claims for such infringement. Further, the
Company's by-laws require it to indemnify its officers and directors against any action that may arise out of their services in that capacity, and the Company has also entered into
indemnification agreements with respect to all of its directors. The Company has not been subject to any material liabilities under such provisions and therefore believes that its exposure for

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Table of Contents

these
indemnification obligations is minimal. Accordingly, the Company has no liabilities recorded for these indemnity agreements as of December 31, 2009 and 2008.

Product Warranties

The Company provides product warranties in conjunction with certain product sales. Generally, product sales are accompanied by a
one-year warranty period. These warranties cover factors such as nonconformance to specifications and defects in material and workmanship. Estimated standard warranty costs are recorded in
the period in which the related product sales occur. The warranty liability recorded at each balance sheet date reflects the estimated number of months of warranty coverage outstanding for products
delivered multiplied by the average of historical monthly warranty costs, as well as any additional amounts for major warranty issues that may exceed a normal claims level.

2009

2008

2007(in thousands)Balance at beginning of year

$
250

$
144

$
112Addition for new warranties


300


343


76Deductions for payments made


(200
)

(237
)

(44
)Balance at end of year

$
350

$
250

$
144


Intellectual Property Claims

In recent years there has been significant litigation involving intellectual property rights in many technology-based industries,
including the Company's. Although the Company has not to date incurred any damages as a result of claims that its products infringe any patents or other proprietary rights of third parties, it has
from time to time received notice of such claims from third parties, two of which have resulted in legal actions against the Company that are currently pending, and could be subject to other such
claims in the future. Since patent applications often are not disclosed until a patent issues, it is not always possible for the Company to know whether patent applications are pending that might be
infringed by its products, and there could be issued patents that are pertinent to the Company's business of which it is not aware. The Company's products may also be claimed to infringe intellectual
property rights of others as a result of activities by its foundries or other suppliers with respect to which it has no control or knowledge. During the first quarter of 2008, the Company received a
letter from a third party asserting that sales by the Company of certain of the Company's products infringe a patent that allegedly applies to a semiconductor process used by certain of the Company's
foundries in manufacturing wafers supplied by those foundries to the Company for use in these products. The Company believes that to the extent it might incur liability as a result of infringement by
any of its foundries of this or any other third party's patent, the Company would be entitled to be indemnified by such foundry. During the third quarter of 2008, another third party commenced an
action against the Company in which it alleges that certain of the Company's products infringe patents held by the third party. During the third quarter of 2009, another third party commenced an
action against the Company, in which it alleges that one of the Company's products infringes a patent held by the third party. We have incurred significant costs in defending these actions, and there
can be no assurance that these or any other pending or future litigation or claims relating to infringement of third-party intellectual property rights can be resolved in a manner favorable to the
Company. The Company has not concluded that it is probable that it has incurred a liability to any such claimant, and cannot estimate the amount of the possible loss that might be incurred in the
event that any such claim or litigation is determined adversely to the Company. However, claims relating to the alleged infringement by the Company of third-party proprietary rights, whether
meritorious or not, could be time-consuming to defend and could harm the Company's working relationships with the Company's foundries and

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Table of Contents

customers,
damage the Company's reputation, result in substantial and unanticipated costs associated with litigation, require the Company to enter into royalty or licensing agreements, which may not
be available on acceptable terms or at all, or result in the payment by the Company of substantial damages. If the Company were found to infringe the intellectual property rights of any third party
and if a license were not available on reasonable terms, the Company could be required to redesign the infringing product so as not to infringe, which could be time consuming and costly, or if this is
not feasible, could be required to withdraw the infringing product from the market.

9.     Defined Contribution Plan

The Company has established a defined contribution plan under the provisions of Section 401(k) of the Internal Revenue Code. All employees are eligible to
participate in the plan. The Company may make matching contributions, and may also provide discretionary contributions. During 2007 and 2008, the Company matched 100% of participants' contributions up
to 10% of compensation. In February 2009, the Company suspended its matching program, and provided no further contributions in 2009. In 2009, 2008 and 2007, employer contributions were $96,000,
$2,361,000 and $1,877,000, respectively.

10.   Stockholders' Equity

Each share of common stock entitles the holder to one vote on all matters submitted to a vote of the Company's stockholders. Common stockholders are entitled to
receive dividends, if any, as may be declared by the Company's Board of Directors.

The
Company has 5,000,000 shares of authorized but unissued, $.01 par value preferred stock. These shares may be issued upon approval of the Board of Directors, without stockholder
approval, in one or more series, each of the series to have whatever rights and preferences, including voting rights, dividend rights, conversion rights, redemption privileges and liquidation
preferences, that the Board of Directors may determine. The rights of the holders of common stock may be adversely affected by the rights of holders of any such preferred stock that may be issued in
the future. The issuance of preferred stock, while providing desirable flexibility in connection with possible acquisitions and other corporate purposes, could have the effect of making it more
difficult for others to acquire, or of discouraging others from attempting to acquire, a majority of the outstanding voting stock of the Company. The Company has not issued, and has no current plans
to issue, any shares of this preferred stock.

In
April 2008, the Company's board of directors authorized a stock repurchase program to offset the dilutive impact of equity-based compensation granted to the Company's employees. The
shares may be repurchased from time to time in the open market or in privately negotiated transactions. During 2009, the Company repurchased 623,417 shares of its common stock for $19,624,000. During
2008, the Company repurchased 1,316,507 shares of its common stock for $41,570,000. The timing, price and volume of additional repurchases will be based on market conditions, relevant securities laws
and other factors, as appropriate, and repurchases may be suspended or discontinued at any time.

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Earnings Per Share

The following table sets forth the computation of basic and diluted net income per share:

2009

2008

2007(in thousands,
except per share data)Basic earnings per shareNet income

$
46,173

$
53,842

$
51,238Weighted average common shares outstanding


29,380


30,473


30,630Basic earnings per share

$
1.57

$
1.77

$
1.67Diluted earnings per shareNet income

$
46,173

$
53,842

$
51,238Weighted average common shares outstanding


29,380


30,473


30,630Dilutive effect of stock options and restricted stock


470


482


633Adjusted weighted average sharesdiluted


29,850


30,955


31,263Diluted earnings per share

$
1.55

$
1.74

$
1.64


The
dilutive effect of outstanding options and restricted stock is reflected in diluted earnings per share by application of the treasury stock method, which includes consideration of
unamortized compensation cost and tax benefits on stock-based compensation. An immaterial number of such securities were excluded from the calculation of diluted earnings per share, as their impact
would have been anti-dilutive.

11.   Stock-Based Compensation Plans

The Company had a 1996 Stock Plan (the "1996 Plan"), pursuant to which the Company was authorized to grant to employees, directors and consultants of the Company
stock options to purchase up to 3,748,000 shares of common stock. The maximum allowable term of options granted under the 1996 Plan was ten years from the date of grant. On January 2, 2006, the
1996 Plan expired by its terms, and no further awards may be granted under the 1996 Plan.

The
Company has a 2005 Stock Incentive Plan (the "2005 Plan") for its officers, directors and employees. Under the 2005 Plan, the Board of Directors may grant stock options, restricted
stock awards, unrestricted stock awards, performance share awards and stock appreciation rights. No maximum contractual term is set for awards under the 2005 Plan, except with respect to incentive
stock options, for which a ten-year maximum is prescribed. The 2005 Plan initially authorized the issuance of awards for up to 4,216,500 shares of common stock. The 2005 Plan also
authorizes, on each of the first five anniversaries of the effective date of the 2005 Plan, the issuance of an additional 468,500 shares of common stock or such lesser number of shares, including
zero, as may be determined by the Board of Directors. Giving effect to these annual increases, the aggregate number of shares authorized for issuance as of December 31, 2009 is 6,090,500. A
maximum of 6,559,000 shares of common stock may be issued under the 2005 Plan, giving effect to the maximum annual increase in each year through 2010.

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Table of Contents

Under the 2005 Plan, incentive stock options and nonqualified stock options may be granted at an exercise price not less than the fair market value of the
Company's common stock on the date of grant. Substantially all options currently outstanding under both plans vest over a period of five years. No stock options were granted in 2009, 2008 or 2007.

The
following table summarizes stock-based compensation included in the Company's consolidated statements of operations:

2009

2008

2007Cost of revenue

$
1,630

$
1,351

$
1,117Research and development


2,046


1,743


1,039Sales and marketing


1,072


1,036


764General and administrative


1,744


1,538


1,167Stock-based compensation expense

$
6,492

$
5,668

$
4,087


Stock-based
compensation cost for 2009 includes $2,077,000 related to stock options and $4,415,000 related to restricted stock. Stock-based compensation cost for 2008 includes $2,552,000
related to stock options and $3,116,000 related to restricted stock. Stock-based compensation cost for 2007 includes $2,550,000 related to stock options and $1,537,000 related to restricted stock.

The
Company recognizes any excess income tax benefits from stock-based awards in additional paid-in capital only if an incremental income tax benefit would be realized after
considering all other tax attributes presently available to the Company. The Company measures the tax benefit associated with excess tax deductions related to stock-based compensation expense by
multiplying the excess tax deductions by the statutory tax rates.

Information
related to all stock options granted by the Company is as follows:

Shares

Weighted Average
Exercise Price per
Share

Weighted Average
Remaining
Contractual Life
(in years)

Aggregate
Intrinsic ValueOutstanding at December 31, 2006


1,726,923


14.49Options granted


Options exercised


(275,755
)

9.91Options forfeited / cancelled


(30,000
)

17.00Outstanding at December 31, 2007


1,421,168


15.32Options granted





Options exercised


(181,283
)

12.75Options forfeited / cancelled


(27,369
)

17.05Outstanding at December 31, 2008


1,212,516


15.67Options granted


Options exercised


(243,568
)

13.05Options forfeited / cancelled


(23,091
)

17.65Outstanding at December 31, 2009


945,857


16.29


5.20

$
23,152,000Exercisable at December 31, 2009


268,713


13.70


4.29


7,275,000Vested or expected to vest at December 31, 2009


924,124


16.26


5.20


22,651,000


The
intrinsic value of stock options exercised, calculated as the difference between the market value of the shares on the exercise date and the exercise price of the option, was
$5,599,000, $4,934,000 and $9,085,000 during 2009, 2008 and 2007, respectively. As of December 31, 2009, total compensation

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cost
not yet recognized related to stock options was $1,290,000, which is expected to be recognized over a weighted-average period of 0.6 years.

The
accompanying consolidated statements of cash flows reflect as a financing cash inflow the excess tax benefit associated with the exercise of stock options of $822,000, $1,009,000 and
$1,830,000 for 2009, 2008 and 2007, respectively.

The
following table summarizes information about the Company's stock options outstanding at December 31, 2009:

Options ExercisableRange of
Exercise Prices

Number
Outstanding

Weighted Average
Life (Years)

Weighted Average
Exercise Price

Number
Exercisable

Weighted Average
Exercise Price$
5.34


84,848


1.32

$
5.34


84,848

$
5.3417.00


798,045


5.55


17.00


164,354


17.0020.40


37,964


5.66


20.40


11,179


20.4024.65


25,000


5.95


24.65


8,332


24.65945,857


5.20


16.29


268,713


13.70


Information
related to restricted stock granted by the Company is as follows:

Number
of Shares

Weighted
Average
Grant Date
Fair ValueNonvested at December 31, 2006


270,619

$
30.70Granted


117,830


43.03Vested


(3,099
)

30.87Forfeited


(25,093
)

29.08Nonvested at December 31, 2007


360,257


34.85Granted


363,000


30.92Vested


(36,768
)

25.66Forfeited


(13,231
)

37.52Nonvested at December 31, 2008


673,258


33.19Granted


315,294


39.34Vested


(57,287
)

36.24Forfeited


(17,090
)

37.27Nonvested at December 31, 2009


914,175


35.04


As
of December 31, 2009, total compensation cost not yet recognized related to restricted stock awards was $20,753,000, which is expected to be recognized over a
weighted-average period of 4.0 years.

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Table of Contents

12.   Income Taxes

Deferred income taxes reflect the net effect of temporary differences between the carrying amounts of assets and liabilities for financial reporting purposes and
income tax purposes. Deferred tax assets and liabilities consist of the following;

December 31,2009

2008(in thousands)Current deferred tax assets:Inventory reserve

$
1,937

$
1,375Reserve for bad debts


125


118Sales return reserve


375


346Accrued vacation


352


344Deferred revenue


158


197Stock-based compensation


4,891


3,662Accrued commissions


166


252Prepaid expenses


(212
)

(315
)Other


154


227Total current deferred tax assets

$
7,946

$
6,206Long-term deferred tax liabilities:Depreciation and amortization

$
(824
)
$
(620
)Other


305


239Total long-term deferred tax liabilities

$
(519
)
$
(381
)


The
components of the provision for income taxes are as follows:

2009

2008

2007(in thousands)Current:Federal

$
24,021

$
28,005

$
23,761State


2,111


2,387


2,732Foreign


(119
)

465


526Deferred:Federal


(1,501
)

(1,544
)

(1,279
)State


(280
)

(156
)

444$
24,232

$
29,157

$
26,184


In
2009, 2008 and 2007 domestic income before taxes was $69,250,000, $81,575,000 and $75,887,000, respectively, and foreign income before taxes was $1,155,000, $1,424,000 and $1,535,000,
respectively.

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Table of Contents

The
Company's effective tax rates differ from the federal statutory tax rate as follows:

2009

2008

2007Statutory rate


35.0
%

35.0
%

35.0
%Tax-exempt interest income


(0.1
)

(1.0
)

(1.8
)Domestic production activities deduction


(1.3
)

(0.8
)

(1.8
)State taxes


2.3


2.5


2.7Research and development credits


(1.0
)

(0.4
)

(0.2
)Foreign income tax benefit


(0.7
)

(0.1
)

Other


0.2


(0.1
)

(0.1
)34.4
%

35.1
%

33.8
%


The
Company receives a tax deduction related to the exercise of nonqualified stock options and the vesting of stock awards granted under its stock plans. To the extent this deduction is
greater than the grant date fair value of the award, such difference is recorded as an increase in additional paid-in capital, rather than as a reduction to the provision for income taxes.
This tax benefit totaled $822,000, $1,009,000 and $1,830,000 in 2009, 2008 and 2007, respectively.

The
Company provides United States income taxes on the earnings of foreign subsidiaries unless the subsidiaries' earnings are considered permanently reinvested outside the United States.
As of December 31, 2009, U.S. income taxes were not provided on a cumulative total of $5,961,000 of undistributed earnings for certain foreign subsidiaries, as these earnings are considered
permanently reinvested in operations outside the United States. If these earnings were to be repatriated, the Company would be subject to additional United States income taxes, subject to an
adjustment for foreign tax credits.

As
a result of the adoption of new accounting guidance for uncertain tax positions, included in ASC 740, the Company recognized a $152,000 net increase in unrecognized tax benefits
which, as required, was accounted for as a reduction to the January 1, 2007 balance of retained earnings.

Activity
related to unrecognized tax benefits was as follows (in thousands):

Balance at January 1, 2007

$
2,207Additions based on tax positions related to the current year


549Additions for tax positions of prior years


620Reductions for tax positions of prior years


(5
)Lapse of statute of limitations


(7
)Settlements


(184
)Balance at December 31, 2007


3,180Additions based on tax positions related to the current year


799Additions for tax positions of prior years


736Reductions for tax positions of prior years


(263
)Lapse of statute of limitations


(272
)Balance at December 31, 2008


4,180Additions based on tax positions related to the current year


786Additions for tax positions of prior years


400Reductions for tax positions of prior years


(167
)Balance at December 31, 2009

$
5,199


Substantially
all of the Company's unrecognized tax benefits, if recognized, would be recorded as a decrease to the provision for income taxes.

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The
Company includes any interest and penalties related to uncertain tax positions as a component of the provision for income taxes. No material amount of such expense was recognized
during 2009, 2008 or 2007, and there was no material accrual for interest or penalties as of December 31, 2009 or December 31, 2008.

The
major tax jurisdictions that remain subject to examination are: U.S. Federal 2005-2008; U.S. states 2003-2008; and Germany 2004-2008. The Company is currently under examination by
the U.S. Internal Revenue Service for 2005-2007. Based on such factors as the outcome of tax examinations and the expiration of the statute of limitations for specific jurisdictions, it is
reasonably possible that the unrecognized tax benefits for tax positions taken on previously filed tax returns will materially change in the next 12 months, although it is not possible to estimate the
impact of any such potential change.

13.   Segment, Major Customers and Geographic Information

The Company operates in one reportable segment: the design and development of integrated circuits, modules, and subsystems.

No
customer accounted for more than 10% of total revenue in 2009, 2008 or 2007. It is impracticable for the Company to report its revenue by product or product line.

The
following table summarizes the Company's revenue by geographic region, based on the location to which the product was shipped:

2009

2008

2007(in thousands)United States

$
69,566

$
73,364

$
68,190International


93,424


106,887


88,222Total revenue

$
162,990

$
180,251

$
156,412


Revenue
from China represented 22%, 19% and 17% of total revenue in 2009, 2008 and 2007, respectively.

Long-lived
assets consist primarily of property and equipment and are principally located in the United States for all periods presented.

14.   Selected Quarterly Financial Data (Unaudited)

2009:

First
Quarter

Second
Quarter

Third
Quarter

Fourth
Quarter(in thousands, except per share data)Revenue

$
38,195

$
39,673

$
41,469

$
43,653Gross profit


27,326


27,927


29,846


32,652Net income


10,185


10,586


11,985


13,417Basic earnings per share


0.35


0.36


0.41


0.46Diluted earnings per share


0.34


0.35


0.40


0.45




2008:

First
Quarter

Second
Quarter

Third
Quarter

Fourth
Quarter(in thousands, except per share data)Revenue

$
43,292

$
45,038

$
45,528

$
46,393Gross profit


30,357


31,889


33,024


33,425Net income


13,050


13,462


13,698


13,632Basic earnings per share


0.42


0.44


0.45


0.46Diluted earnings per share


0.42


0.43


0.44


0.45


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