Initial Review Engineering Report for Premanufacture Notice (PMN) P-11-0029.txt

INITIAL REVIEW ENGINEERING REPORT PMN: 11-0029 Focus Ready Draft 11/1/2010

ENGINEER: Hall \ CLM PV (kg/yr): 2,000 Import Only

SUBMITTER: Zeon Chemicals L.P.

USE: Dry etching agent for production of semiconductors (95%) and chemical vapor deposition (CVD) for production of semiconductors (5%).

MSDS: Yes Label: No

Gen Eqpt: Ventilation: Control airborne concentrations below the recommended exposure limits. Use only with adequate ventilation. Mechanical ventilation is recommended. Provide local exhaust ventilation to minimize exposure to vapors. Toxic concentrations may exist in areas with poor ventilation. // Protective Equipment: During processing operations, safety goggles or safety glasses with face shield suitable for keeping liquid material out of the eyes should be worn when eye contact is anticipated. Rubber gloves and apron should be worn when skin contact is anticipated. Provide an eye wash facility and safety shower. Respirator: For protection against process vapors or mists, wear a NIOSH approved respirator suitable for the anticipated airborne concentration. Wear a positive pressure air-supplied respirator in situations where there may be potential for elevated airborne exposure. Health Effects: May be fatal if inhaled, absorbed through skin, or swallowed. Contact with liquid, vapors, or mists may cause severe eye irritation. Processing under conditions of inadequate ventilation may produce symptoms of nausea, dizziness, or headaches.| Exposure to vapors or mists may cause shortness of breath, lethargy, narcosis, unconsciousness, and possible cardiac arrhythmias. Prolonged or repeated exposure maybe toxic if inhaled or absorbed through the skin. Prolonged or repeated inhalation of vapors may cause lung, liver, heart, kidney, and reproductive effects based on animal data of a chemically related substance, octofluorocyclopentene (C5F8). TLV/PEL: 1,3,3,4,4,5,5-Heptafluorocyclopentene >99% 1 ppm TWA Manufacturer's recommendation

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CRSS :Chemical Name: Cyclopentene, 1,3,3,4,4,5,5-heptafluoroS-H20: 0.076 g/L @
VP: 3.4E+2 torr @
MW: 194.00 %<500 %<1000 Physical State and Misc CRSS Info: Neat: Liquid Mfg: NK - Imported Proc/Form: Gas End Use: Gas then destroyed by incineration. Submitted data: liquid; MP = -91 °C; BP = 46 °C at 760 torr; VP = 340 torr at 20 °C; WS = 0.076 g/L at 22 °C; log P = 2.4 (OECD 117); not flammable; density = 1.547 g/cc at 22 °C; evaporative latent heat = 139.3 kJ/kg; specific heat = 1. 15 J/g.K at 20 °C; critical temperature = 190.4 °C; critical pressure 2.87 MPa; ignition point > 550 °C; solubility of water = 460 ppm at 22 °C; viscosity = 1.3 mPa.s at 20 °C; surface tension = 20.2 dyn/cm at 20 °C; thermal conductivity = 0.088 W/m.K at 20 °C; electrical conductivity = 0.8 uS/cm at 20 °C; submitted IR and 1H, 13C, and 19F NMR spectra are consistent with the structure provided.

Consumer Use: No

SAT (concerns) (10/26/2010): Related Cases and Related Cases and Misc SAT Info:
Ecotox Related Cases:

Migration to groundwater: Moderate PBT rating: P3B1T2 - Health: 2-3 Dermal, Drinking Water, Inhalation Eco: 2 Water (All releases to water with a CC = 350 ppb)

OCCUPATIONAL EXPOSURE RATING: 0-1

NOTES & KEY ASSUMPTIONS: Generated by the 06/07/2005 version of ChemSTEER. The PMN is import-only; therefore, manufacturing is not assessed.

POLLUTION PREVENTION CONSIDERATIONS: No Pollution Prevention information was provided by the
submitter.

EXPOSURE-BASED REVIEW: No

INITIAL REVIEW ENGINEERING REPORT Page 2Initial Review Engineering Report for Premanufacture Notice (PMN) P-11-0029.txt
PMN: 11-0029

Use: Semiconductor Mfg - (1) Dry etching agent (95% of PV), (2) Chemical Vapor Deposition (5% of PV)

Number of Sites/ Location: 10 IBM (3) - Yorktown Heights, NY; East Fishkill, NY; Burlington, NY Intel (3) - Hillsboro,OR, others unknown Tokyo Electron (2) - Albany, NY; Hillsboro, OR Other (2)- unknown Days/yr: 24 Basis: Submission specifies 10 use sites, and that cylinder exchange occurs twice per month (i.e., 24 "batches" per year).

Process Description: PMN supplied in non-pressurized cylinder (liquid, 100% PMN) --> Silicon wafer is placed in a chamber equipped with a microwave device --> Argon gas is introduced into the closed chamber at which time it is converted into argon plasma via microwave exposure --> The PMN substance (whose boiling point is ca.46°C) is vaporized by warming and the vapor of the PMN substance is introduced into the chamber of the "Plasma Dry Etching Tool" or the "Plasma CVD Tool" together with oxygen or fluorocarbon gas, respectively --> Etching or CVD, respectively, takes place on the surface of the silicon wafer --> After the etching process, remaining gas left in the chamber are purged through an abatement system. The gas is incinerated at high temperature (800 - 1300°C). (Submission)

ENVIRONMENTAL RELEASES ESTIMATE SUMMARY No releases other than empty cylinder purge to incineration are expected. Tubing opened during cylinder changing and chamber opened during tool cleaning are purged to abatement prior to opening; no PMN residual expected; no other source of PMN emission or exposure expected.

Incineration Output 2: 8.7E-2 kg/site-day over 24 days/yr from 10 sites or 2.1E+1 kg/yr to: incineration, followed by neutralization, scrubbing, and and adsorption (submission) from: Gas Incineration basis: User-Defined Loss Rate Model. Submission specifies liquid PMN is contained in 10L cylinders. As conservative, and consistent with past cases, assume a used "empty" cylinder will be filled with gaseous PMN. 10 L/cylinder * 1 mol ideal gas/22.4 L ideal gas * 194 g PMN/mol PMN * 1 kg/1000 g = 0.0866 kg PMN/cylinder. Note, per submission: "The gas is incinerated at high temperature (800 - 1300°C). The incinerated gas is then treated with alkaline water and passed through a scrubber. The gas is then passed through activated charcoal before release into the atmosphere."

RELEASE TOTAL 2.1E+1 kg/yr - all sites

OCCUPATIONAL EXPOSURES ESTIMATE SUMMARY Page 3Initial Review Engineering Report for Premanufacture Notice (PMN) P-11-0029.txt Tot. # of workers exposed via assessed routes: 0
Basis:

Inhalation: Inhalation not expected - empty cylinders contain only PMN vapor; tubing opened during cylinder changing is purged to abatement prior to opening, no PMN residual expected; no other source of PMN emission or exposure expected.

Dermal: Dermal not expected - empty cylinders contain only PMN vapor; tubing opened during cylinder changing is purged to abatement prior to opening, no PMN residual expected; no other source of PMN emission or exposure expected.

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