Initial Review Engineering Report for Premanufacture Notice (PMN) P-11-0029.txt

INITIAL REVIEW ENGINEERING REPORT 

PMN: 11-0029

Focus Ready Draft 11/1/2010

ENGINEER: Hall \ CLM

PV (kg/yr): 2,000 Import Only

SUBMITTER: Zeon Chemicals L.P.

USE: Dry etching agent for production of semiconductors

(95%) and chemical vapor deposition (CVD) for production

of semiconductors (5%). 

MSDS: Yes Label: No

Gen Eqpt: Ventilation: Control airborne concentrations

below the recommended exposure limits. Use only with

adequate ventilation. Mechanical ventilation is

recommended. Provide local exhaust ventilation to

minimize exposure to vapors. Toxic concentrations may

exist in areas with poor ventilation. // Protective

Equipment: During processing operations, safety goggles

or safety glasses with face shield suitable for keeping

liquid material out of the eyes should be worn when eye

contact is anticipated. Rubber gloves and apron should be

worn when skin contact is anticipated. Provide an eye

wash facility and safety shower.

Respirator: For protection against process vapors or

mists, wear a NIOSH approved respirator suitable for the

anticipated airborne concentration. Wear a positive

pressure air-supplied respirator in situations where

there may be potential for elevated airborne exposure.

Health Effects: May be fatal if inhaled, absorbed through

skin, or swallowed. Contact with liquid, vapors, or mists

may cause severe eye irritation. Processing under

conditions of inadequate ventilation may produce symptoms

of nausea, dizziness, or headaches.| Exposure to vapors

or mists may cause shortness of breath, lethargy,

narcosis, unconsciousness, and possible cardiac

arrhythmias. Prolonged or repeated exposure maybe toxic

if inhaled or absorbed through the skin. Prolonged or

repeated inhalation of vapors may cause lung, liver,

heart, kidney, and reproductive effects based on animal

data of a chemically related substance,

octofluorocyclopentene (C5F8).

TLV/PEL:

1,3,3,4,4,5,5-Heptafluorocyclopentene >99% 1 ppm TWA

Manufacturer's recommendation

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CRSS :

Chemical Name: Cyclopentene, 1,3,3,4,4,5,5-heptafluoroS-H20: 0.076 g/L @

VP: 3.4E+2 torr @

MW: 194.00 %<500 %<1000

Physical State and Misc CRSS Info:

Neat: Liquid Mfg: NK - Imported Proc/Form: Gas End Use:

Gas then destroyed by incineration. Submitted data:

liquid; MP = -91 °C; BP = 46 °C at 760 torr; VP = 340

torr at 20 °C; WS = 0.076 g/L at 22 °C; log P = 2.4 (OECD

117); not flammable; density = 1.547 g/cc at 22 °C;

evaporative latent heat = 139.3 kJ/kg; specific heat = 1.

15 J/g.K at 20 °C; critical temperature = 190.4 °C;

critical pressure 2.87 MPa; ignition point > 550 °C;

solubility of water = 460 ppm at 22 °C; viscosity = 1.3

mPa.s at 20 °C; surface tension = 20.2 dyn/cm at 20 °C;

thermal conductivity = 0.088 W/m.K at 20 °C; electrical

conductivity = 0.8 uS/cm at 20 °C; submitted IR and 1H,

13C, and 19F NMR spectra are consistent with the

structure provided.

Consumer Use: No

SAT (concerns) (10/26/2010):

Related Cases and Related Cases and Misc SAT Info:

Ecotox Related Cases:

Migration to groundwater: Moderate

PBT rating: P3B1T2 -

Health: 2-3 Dermal, Drinking Water, Inhalation

Eco: 2 Water (All releases to water with a CC = 350 ppb)

OCCUPATIONAL EXPOSURE RATING: 0-1

NOTES & KEY ASSUMPTIONS:

Generated by the 06/07/2005 version of ChemSTEER. The PMN

is import-only; therefore, manufacturing is not assessed.

POLLUTION PREVENTION CONSIDERATIONS:

No Pollution Prevention information was provided by the

submitter.

EXPOSURE-BASED REVIEW: No

INITIAL REVIEW ENGINEERING REPORT 

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PMN: 11-0029

Use: Semiconductor Mfg - (1) Dry etching agent (95% of PV),

(2) Chemical Vapor Deposition (5% of PV)

Number of Sites/ Location: 10

IBM (3) - Yorktown Heights, NY; East Fishkill, NY;

Burlington, NY

Intel (3) - Hillsboro,OR, others unknown

Tokyo Electron (2) - Albany, NY; Hillsboro, OR

Other (2)- unknown

Days/yr: 24

Basis: Submission specifies 10 use sites, and that

cylinder exchange occurs twice per month (i.e., 24

"batches" per year).

Process Description: PMN supplied in non-pressurized

cylinder (liquid, 100% PMN) --> Silicon wafer is placed

in a chamber equipped with a microwave device --> Argon

gas is introduced into the closed chamber at which time

it is converted into argon plasma via microwave exposure

--> The PMN substance (whose boiling point is ca.46°C) is

vaporized by warming and the vapor of the PMN substance

is introduced into the chamber of the "Plasma Dry Etching

Tool" or the "Plasma CVD Tool" together with oxygen or

fluorocarbon gas, respectively --> Etching or CVD,

respectively, takes place on the surface of the silicon

wafer --> After the etching process, remaining gas left

in the chamber are purged through an abatement system.

The gas is incinerated at high temperature (800 - 1300°C).

 (Submission)

ENVIRONMENTAL RELEASES ESTIMATE SUMMARY

No releases other than empty cylinder purge to

incineration are expected. Tubing opened during cylinder

changing and chamber opened during tool cleaning are

purged to abatement prior to opening; no PMN residual

expected; no other source of PMN emission or exposure

expected.

Incineration

Output 2: 8.7E-2 kg/site-day over 24 days/yr from 10 sites

or 2.1E+1 kg/yr

to: incineration, followed by neutralization, scrubbing,

and and adsorption (submission)

from: Gas Incineration

basis: User-Defined Loss Rate Model. Submission specifies

liquid PMN is contained in 10L cylinders. As conservative,

 and consistent with past cases, assume a used "empty"

cylinder will be filled with gaseous PMN. 10 L/cylinder *

1 mol ideal gas/22.4 L ideal gas * 194 g PMN/mol PMN * 1

kg/1000 g = 0.0866 kg PMN/cylinder. Note, per submission:

"The gas is incinerated at high temperature (800 -

1300°C). The incinerated gas is then treated with

alkaline water and passed through a scrubber. The gas is

then passed through activated charcoal before release

into the atmosphere."

RELEASE TOTAL

2.1E+1 kg/yr - all sites

OCCUPATIONAL EXPOSURES ESTIMATE SUMMARY

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Tot. # of workers exposed via assessed routes: 0

Basis:

Inhalation:

Inhalation not expected - empty cylinders contain only

PMN vapor; tubing opened during cylinder changing is

purged to abatement prior to opening, no PMN residual

expected; no other source of PMN emission or exposure

expected.

Dermal:

Dermal not expected - empty cylinders contain only PMN

vapor; tubing opened during cylinder changing is purged

to abatement prior to opening, no PMN residual expected;

no other source of PMN emission or exposure expected.

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