# Patent

## Title
Semiconductor control device

## Abstract

A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.

## Background
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor control device, and more particularly relates to a power electronic unit that has a semiconductor module with a semiconductor element mounted on a cooling member and controls the supply of driving electricity to an electric motor.
In recent years, electric vehicles provided with an electric motor as its driving power source are becoming popular. Electric vehicles are provided with a semiconductor control device such as a PEU (Power Electronic Unit) that converts direct-current power supplied from a battery into alternating-current power and controls the supply of the power to the electric motor, and also according to need, performs a control such that alternating-current power generated by a regenerative mechanism is converted into direct-current power and the power is accumulated in a battery such at a time of braking, for example.
The power electronic unit is provided with a power module that converts direct-current power supplied from the battery into alternating-current power, and also according to need, converts the alternating-current power generated by the regenerative mechanism into direct-current power. Because such power modules are often used in plural, while positioning a plurality of power modules relatively close to each other, an electric wire electrically connecting the plurality of power modules with each other, and an electric wire electrically connecting the plurality of power modules with other constituent members and external devices, are routed near the power modules. Furthermore, the power modules convert power by combining a plurality of switching elements, and thus, they are often provided with a plurality of circuit boards that either operate or control the operations of the plurality of switching elements. Further, in the power modules, because a relatively high electric current is used, power semiconductor elements such as a Power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor) are often incorporated as a switching element. Because the operations of such power semiconductor elements are accompanied by the generation of a large amount of heat, heat sinks are mounted on power modules in order to secure a radiation route.
Japanese Patent Application Laid-open No. 2009-159704 relates to a power drive unit, and discloses a configuration provided with a heat sink, and a plurality of power modules arranged in a staggered shape on the heat sink. In such a power drive unit, when controlling the supply of three-phase alternating-current power to the electric motor, a total of six power modules are incorporated, that is, three power modules as high-side switching elements to be connected to a plus terminal of a battery, and three power modules as low-side switching elements to be connected to a minus terminal of the battery.
Japanese Patent Application Laid-open No. 2000-92888 relates to a motor control device, and discloses a configuration where a main printed circuit board that controls a motor applied voltage (an electric current) is connected, via a conversion wiring board that converts terminal arrangements and terminal positions, to a power module having a plurality of power-system elements incorporated therein, while the main printed circuit board is attached through a spacer to a radiator on which the power modules are attached.
SUMMARY OF THE INVENTION
However, according to studies of the present inventors, according to the configuration disclosed in Japanese Patent Application Laid-open No. 2009-159704, although arranging the plurality of power modules in a staggered shape on the heat sink efficiently uses the region over the heat sink, the plurality of power modules positioned on the heat sink have to be appropriately separated from adjacent modules to prevent interference, and therefore tend to require a certain amount of space between each adjacent power module. As a result, the configuration of the power drive unit spreads in planar directions, thereby causing a difficulty in the perspective of reducing its size in terms of width and depth. These constituent members have to be individually attached to the heat sink or a case, and thus the attaching of these constituent members tends to lead to an increase in the number of steps required in assembling the power drive unit.
According to further studies of the present inventors, in a semiconductor control device, various circuit boards are installed, such as a control circuit board used in controlling a switching operation of a semiconductor switching element. However, it is preferable that some of these circuit boards are placed further apart from heat sources and high current paths. In this connection, although Japanese Patent Application Laid-open No. 2009-159704 discloses a configuration where a plurality of power modules are arranged on a heat sink in a staggered shape, there is no teaching of a specific configuration for distancing these circuit boards from heat sources and high current paths.
According to further studies of the present inventors, when assembling a semiconductor control device, if constituent members such as batteries, condensers, and connecting conductors that connect condensers and external devices to semiconductor switching elements, are precisely positioned and attached to another single robust constituent member in advance when manufacturing the other constituent member, it is preferable as the number of steps required in assembling the entire device are greatly reduced. In this connection, although Japanese Patent Application Laid-open No. 2009-159704 discloses a configuration where a plurality of power modules are arranged on the heat sink in a staggered shape, while a bus bar connecting corresponding power modules is routed in the spaces between the power modules and a condenser is arranged in the remaining space between the power modules, there is no teaching of a specific configuration that reduce the number of steps required in assembling the entire device by the constituent members being precisely positioned and attached to another single robust constituent member in advance upon its manufacturing.
According to studies of the present inventors, although Japanese Patent Application Laid-open No. 2000-92888 discloses a configuration where a main printed circuit board is connected to a power module, via a conversion wiring board that converts terminal arrangements and terminal positions, and when using a plurality of power modules with different forms, is designed to share the main printed circuit board, there is a need to connect the connectors on the conversion wiring board with the main printed circuit board. That is, in such a configuration, positioning of these elements needs to be done by only a visual positioning of the connectors on the conversion wiring board against the main printed circuit board, therefore complicating the assembly in the process of connecting the conversion wiring board to the main printed circuit board.
According to further studies of the present inventors, a plurality of circuit boards are often installed in a power electronic unit to either operate or control the operations of a plurality of switching elements. In such a case, it is preferable that the positioning of these circuit boards are not dependent on only a visual positioning, and that highly precisely positioned positioning pins are used, in order to precisely position the circuit boards with each other. In this connection, although Japanese Patent Application Laid-open No. 2000-92888 discloses a configuration where a main printed circuit board is connected to a power module, via a conversion wiring board that changes terminal arrangements and terminal positions, there is no teaching of a specific configuration that uses highly precisely positioned positioning pins in order to precisely position a plurality of circuit boards against each other.
The present invention has been achieved in view of the above studies, and an object of the present invention is to provide a semiconductor control device capable of downsizing, as a reduction in the size of the entire device in terms of width and depth, by efficient use of an internal space that is allowed layout-wise in a case, and while improving radiation of heat generated by heat sources, securely distancing circuit boards that need to be distanced from heat sources and high current paths from such elements.
Another object of the present invention is to provide a semiconductor control device capable of improving the positioning precision of a positioning pins itself, without complicating a configuration of a plurality of circuit boards, while also being capable of precisely positioning a plurality of circuit boards with each other, by efficient use of such highly precisely positioned positioning pins.
Still another object of the present invention is to provide a semiconductor control device in which various constituent members are attached to another single robust constituent member, precisely positioned and fixed in advance in its manufacturing, and is capable of reducing the number of assembling steps of the entire device.
To achieve the above objects, a first aspect of the present invention provides a semiconductor control device comprising: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. In this aspect, the case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module in the internal space.
In a second aspect of the present invention, in addition to the first aspect, the first semiconductor module is mounted with a first semiconductor element on one surface of a first cooling member, and the second semiconductor module is mounted with a second semiconductor element on one surface of a second cooling member that faces opposite to the one surface of the first cooling member. Furthermore, the circuit board is a control circuit board implemented with the control element that controls each of switching operations of the first semiconductor element and the second semiconductor element.
In a third aspect of the present invention, in addition to the second aspect, the semiconductor control device further comprises: an input-side connecting conductor for the first semiconductor element and the second semiconductor element; and an output-side connecting conductor for the first semiconductor element and the second semiconductor element. In this aspect, the internal space has a gap portion, which is not within an occupied area in the internal space occupied by the first semiconductor module, the second semiconductor module, and the control circuit board. The input-side connecting conductor and the output-side connecting conductor are respectively formed along the gap portion and penetrate the sidewall to extend outside of the case.
In a fourth aspect of the present invention, in addition to the second or third aspect, the first semiconductor module is mounted in the case, in a state where the first semiconductor element is positioned within the internal space through the first opening, and the first opening is closed by the first cooling member by exposing the other surface of the first cooling member to outside of the case. The second semiconductor module is mounted in the case, in a state where the second semiconductor element is positioned within the internal space through the second opening, and the second opening is closed by the second cooling member by exposing the other surface of the second cooling member to outside of the case.
In a fifth aspect of the present invention, in addition to any one of the second to fourth aspects, the first semiconductor element and the second semiconductor element respectively have an identical configuration capable of realizing a high-side switching function and a low-side switching function. The first cooling member and the second cooling member have an identical configuration, where the members are made of a same type of material and given an identical shape to each other.
In a sixth aspect of the present invention, in addition to any one of the first to fifth aspects, the first semiconductor module includes, in addition to the semiconductor element, a drive circuit board that operates the semiconductor element, and a frame on which the semiconductor element and the drive circuit board are attached, while the second semiconductor module includes, in addition to the semiconductor element, a drive circuit board that operates the semiconductor element, and a frame on which the semiconductor element and the drive circuit board are attached. The circuit board is a control circuit board that controls each of operations of the semiconductor element of the first semiconductor module and the semiconductor element of the second semiconductor module. The frame includes a plurality of positioning pins that are inserted with and position the drive circuit board of the first semiconductor module, the drive circuit board of the second semiconductor module, and the control circuit board.
In a seventh aspect of the present invention, in addition to the sixth aspect, the first semiconductor module and the second semiconductor module are positioned to be opposite to each other.
In an eighth aspect of the present invention, in addition to the sixth or seventh aspect, the plurality of positioning pins include positioning pins provided to correspond to diagonally opposite corners of the frame.
In a ninth aspect of the present invention, in addition to any one of the sixth to eighth aspects, the plurality of positioning pins include positioning pins that correspond to four corners of the control circuit board and are inserted therethrough.
In a tenth aspect of the present invention, in addition to any one of the first to ninth aspects, the semiconductor control device further comprises: a condenser that is electrically connected to each of the semiconductor element of the first semiconductor module and the semiconductor element of the second semiconductor module; a resin case in which the first semiconductor module, the second semiconductor module, and the condenser are respectively mounted; an input-side connecting conductor that electrically connects an input terminal of the semiconductor element and a connection terminal of the condenser; and an output-side connecting conductor that electrically connects an output terminal of the semiconductor element and an external terminal. In this aspect, each of the input-side connecting conductor and the output-side connecting conductor is integrally formed with the case and fixed to the case.
In an eleventh aspect of the present invention, in addition to the tenth aspect, the condenser is integrally formed with the case and fixed to the case.
In a twelfth aspect of the present invention, in addition to the tenth or eleventh aspect, the semiconductor control device further comprises: a circuit board related to the semiconductor element; and a connector electrically connected to the circuit board. In this aspect, the connector is integrally formed with the case and fixed to the case.
In a thirteenth aspect of the present invention, in addition to any one of the tenth to twelfth aspects, each of the input-side connecting conductor and the output-side connecting conductor is a block structure.
In the semiconductor control device according to the first aspect of the present invention, the case in which the plurality of semiconductor modules each having a cooling member and a semiconductor element and the circuit board implemented with control devices that control the plurality of semiconductor modules are mounted is provided with a cylindrical sidewall that forms the internal space within the case, and on both ends of the sidewall, a first opening and a second opening are formed to be opposite to each other, and the plurality of semiconductor modules include, the first semiconductor module mounted on the sidewall on a side of the first opening, and the second semiconductor module mounted on the sidewall on a side of the second opening, while the circuit board efficiently uses the internal space that is allowed layout-wise in the case by being positioned between the first semiconductor module and the second semiconductor module in the internal space, thereby downsizing the entire device by reducing its size in terms of width and depth, as well as improvements in the radiation of heat generated by heat sources while securely distancing circuit boards that need to be distanced from heat sources and high current paths, from such elements.
In the semiconductor control device according to the second aspect of the present invention, the first semiconductor module is mounted with a first semiconductor element on one surface of the first cooling member, and the second semiconductor module is mounted with a second semiconductor element on one surface of the second cooling member that is opposite to the one surface of the first cooling member, while the circuit board efficiently uses the internal space of the case as a control circuit board being implemented with a control device that controls switching operations of each of the first semiconductor element and the second semiconductor element, thereby realizing downsizing of the entire device, as well as improvements in the radiation of the entire device, while securely distancing the control circuit board from heat sources and high current paths.
In the semiconductor control device according to the third aspect of the present invention, the semiconductor control device further includes an input-side connecting conductor corresponding to the first semiconductor element and the second semiconductor element, an output-side connecting conductor corresponding to the first semiconductor element and the second semiconductor element, and the internal space has a gap portion, which is not within an occupied area in the internal space occupied by the first semiconductor module, the second semiconductor module, and the control circuit board, and each of the input-side connecting conductor and the output-side connecting conductor are respectively formed along the gap portion and penetrate the sidewall to extend outside of the case, and therefore it is possible to secure the gap portion in the internal space of the case and to efficiently use the gap portion to realize downsizing of the entire device, as well as improvements in the radiation of the entire device, while securely distancing the control circuit board from heat sources and high current paths.
In the semiconductor control device according to the fourth aspect of the present invention, as the first semiconductor module is mounted in the case, in such a manner that the first semiconductor element is positioned within the internal space through the first opening, and the first opening is closed by the first cooling member by exposing the other surface of the first cooling member to outside of the case, and the second semiconductor module is mounted in the case, in such a manner that the second semiconductor element is positioned within the internal space through the second opening, and the second opening is closed by the second cooling member by exposing the other surface of the second cooling member to outside of the case, the inner side of the case can be securely sealed with a simple configuration.
In the semiconductor control device according to the fifth aspect of the present invention, as the first semiconductor element and the second semiconductor element respectively have an identical configuration capable of realizing a high-side switching function and a low-side switching function, and the first cooling member and the second cooling member have an identical configuration, where the members are made of a same type of material and given an identical shape to each other, the assembly can be simplified by the first semiconductor module and the second semiconductor module being interchangeable in the assembly process, and a reduction in the types of constituent members is achieved.
In the semiconductor control device according to the sixth aspect of the present invention, by arranging a plurality of positioning pins that are inserted with and position the drive circuit board and the control circuit board that controls the operation of the semiconductor element, on the frame on which the semiconductor element and the drive circuit board configured to operate the semiconductor element is attached, the positioning precision of each positioning pin itself can be improved without complicating the configuration of a plurality of circuit boards, and by efficiently using such highly precisely positioned positioning pins, the drive circuit board and control circuit board can be precisely positioned against each other.
In the semiconductor control device according to the seventh aspect of the present invention, as the semiconductor module is constituted by a first semiconductor module and a second semiconductor module corresponding to the first semiconductor module, and the control circuit board is positioned between the first semiconductor module and the second semiconductor module, an internal space that is allowed layout-wise in the case, which holds the semiconductor element, the drive circuit board, the control circuit board, and the frame, can be efficiently used, and downsizing of the entire device is realized by reducing its size in terms of width and depth, and the precise positioning of the drive circuit board and the control circuit board against each other is realized, while securely distancing control circuit boards that need to be distanced from heat sources and high current paths, from such elements.
In the semiconductor control device according to the eighth aspect of the present invention, as the plurality of positioning pins include pairs of positioning pins respectively formed on diagonally opposite corners of the frame, it is possible to realize more precise positioning of the drive circuit board and the control circuit board against each other with a simple configuration.
In the semiconductor control device according to the ninth aspect of the present invention, as the plurality of positioning pins include positioning pins that are respectively inserted through the four corners of the control circuit board, it is possible to realize more precise positioning of the drive circuit board and the control circuit board against each other with a simple configuration.
In the semiconductor control device according to the tenth aspect of the present invention, the semiconductor control device comprises a semiconductor module including a semiconductor element, a condenser that is electrically connected to the semiconductor element, a resin case in which the semiconductor module and the condenser are mounted, an input-side connecting conductor electrically connecting the input terminal of the semiconductor element and the connection terminal of the condenser, and an output-side connecting conductor electrically connecting the output terminal of the semiconductor element and external terminals, and the input-side connecting conductor and the output-side connecting conductor are integrally formed with the case and fixed to the case. Therefore, the connecting conductor can be attached to the case that is another single robust constituent member, as it is precisely positioned and fixed before forming the case, and thus the number of assembling steps of the entire device can be reduced.
In the semiconductor control device according to the eleventh aspect of the present invention, as the condenser is integrally formed with the case and fixed to the case, the condenser can be attached to the case that is another single robust constituent member, as it is precisely positioned and fixed before forming the case, and thus the number of assembling steps of the entire device can be reduced.
In the semiconductor control device according to the twelfth aspect of the present invention, the semiconductor control device further includes a connector that is electrically connected to a circuit board related to a semiconductor element and a circuit board, and as the connector is integrally formed with the case and fixed to the case, the connector can be attached to the case that is another single robust constituent member, as it is precisely positioned and fixed before forming the case, and thus the number of assembling steps of the entire device can be reduced.
In the semiconductor control device according to the thirteenth aspect of the present invention, as the connecting conductor is a block structure, and as the connecting conductor is integrally formed with the case to reinforce the case, the rigidness of the case can be improved.



BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view showing a power electronic unit according to a first embodiment of the present invention, in a state where one of its power modules is assembled.
FIG. 2A is a front view of the power electronic unit according to the first embodiment as viewed along the direction of an arrow A in FIG. 1; FIG. 2B is a side view of the power electronic unit according to the first embodiment as viewed along the direction of an arrow B in FIG. 1; and FIG. 2C is a back view of the power electronic unit according to the first embodiment as viewed along the direction of an arrow C in FIG. 1.
FIG. 3 is an enlarged detailed cross-sectional view showing the power electronic unit according to the first embodiment cut along a cross-sectional line S3-S3 in FIG. 2A and FIG. 2C, where for each fastening member in FIG. 3 only heads thereof are shown for convenience.
FIG. 4 is an enlarged exploded perspective view of the power electronic unit according to the first embodiment, in a state where both power modules are assembled.
FIG. 5 is an enlarged exploded perspective view of a power electronic unit according to a second embodiment of the present invention, in a state where both power modules are opposite to each other with a control circuit board in between.
FIG. 6 is an exploded perspective view showing a power electronic unit according to a third embodiment of the present invention, in a state where one of its power modules is assembled.
FIG. 7 is an enlarged detailed cross-sectional view of the power electronic unit according to the third embodiment, and is a drawing that corresponds to FIG. 3 in terms of position.
FIG. 8 is an enlarged sectional perspective view of the power electronic unit according to the third embodiment, in a state where its connecting conductor, condenser, and connector are integrally formed in the case.



DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Preferred embodiments of a semiconductor control device according to the present invention will be explained below in detail with reference to the drawings as needed, while taking a power electronic unit as an example. In the drawings, the x-axis, the y-axis, and the z-axis form a three-axis orthogonal coordinate system, where the z-axis extends in a vertical direction, and the x-y plane extends horizontally.
First Embodiment
First, a semiconductor control device according to a first embodiment of the present invention is described in detail with reference to FIG. 1 to FIG. 4.
[Configuration of Control System]
First, a configuration of a control system in which a power electronic unit that is a semiconductor control device according to the present embodiment is applied is explained in detail.
The power electronic unit 1 shown in FIG. 1 to FIG. 4, which is a semiconductor control device according to the present embodiment, typically, although not shown in the drawings, incorporates an electric motor which is a driving power source and a battery which is a secondary cell, and is incorporated on an electric vehicle provided with a regenerative mechanism which generates regenerative power when decelerating.
The power electronic unit 1, in an electric vehicle, each individually, or under the control of a control device (not shown) that controls overall the electric motor, the battery, and the regenerative mechanism, is capable of controlling the supply of drive power from the battery to the electric motor, as well as being capable of controlling the supply of regenerative power from the regenerative mechanism to the battery. For example, when using a three-phase alternating current as the drive current of the electric motor, the power electronic unit 1 has a function of a DC/AC converter that steadily converts the direct current supplied from the battery into a three-phase alternating current consisting of a U-phase, a V-phase, and a W-phase and supplies this alternating current to the electric motor, along with a function of an AC/DC converter that steadily converts the regenerative alternating current generated by the regenerative mechanism into a direct current and supplies this direct current to the battery. Furthermore, according to need, the power electronic unit 1 may only have a DC/AC converter function of steadily converting the direct current supplied from the battery into an alternating current, and supplies this alternating current to the electric motor.
The electric motor, for example, is a three-phase brushless electric motor that operates with a three-phase alternating power supply, and supplies the drive power that drives the electric vehicle.
The battery is a typical nickel-metal-hydride type or lithium-ion type secondary cell, and while supplying the electric motor and other assisting devices with required power, stores the regenerative power generated from the regenerative mechanism.
Furthermore, the power electronic unit 1 can be applied to a hybrid vehicle that incorporates an engine such as an internal-combustion engine in addition to the electric motor, or a fuel cell vehicle that incorporates a fuel cell. In a case where the power electronic unit 1 is applied to a hybrid vehicle, the power electronic unit 1 is capable of controlling the supply of drive power from the battery to the electric motor, as well as controlling the supply of regenerative power from the regenerative mechanism to the battery and the supply of generated power from the generator, which is an assisting device of the engine, to the battery. Furthermore, in a case where the power electronic unit 1 is applied to a fuel cell vehicle, the power electronic unit 1 is capable of controlling the supply of drive power from the fuel cell to the electric motor, as well as controlling the supply of regenerative power from the regenerative mechanism to the battery. Further, in a case where the power electronic unit 1 is applied to either one of an electric vehicle, a hybrid vehicle, or a fuel cell vehicle, the power electronic unit 1 is, according to need, capable of controlling the supply of regenerative power from the electric motor to the battery such as at a time of braking.
[Overall Configuration of Power Electronic Unit]
Next, as an example, the overall configuration of the power electronic unit 1 that is a semiconductor control device according to the present embodiment, in a case where mainly the direct current from the battery is converted to a three-phase alternating current and supplied to the electric motor, is explained in detail.
As shown in FIG. 1 to FIG. 4, the power electronic unit 1 is mainly provided with a first semiconductor module 2 with first semiconductor elements 23(U), 24(V), and 25(W) having switching functions, positioned adjacent to each other in the x-axis direction and mounted on a surface 21A which is the inner-side surface of a first cooling member 21, a second semiconductor module 3 with second semiconductor elements 33(U), 34(V), and 35(W) having switching functions, positioned adjacent to each other in the x-axis direction and mounted on a surface 31A which is the inner-side surface of a second cooling member 31, a case 7 having a sidewall 71 which extends in the vertical direction and is typically rectangular cylindrical, and while forming an internal space S surrounded by the sidewall 71, has a first opening 7H1 and a second opening 7H2, formed on opposite sides of each other on the sidewall 71 at both ends in the vertical direction, which open the internal space S to the outer area, and a circuit board 55 which is typically of a flat rectangular shape and is a control circuit board mounted with a controlling IC (Integrated Circuit) 551 that controls the switching operations of the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W). These constituent members are, in the vertical direction, substantially layered along the same axis.
In the power electronic unit 1, the first semiconductor elements 23(U) to 25(W) are accommodated in the case 7 as to be inserted into the internal space S of the case 7 through the first opening 7H1 of the case 7, and by adjoining one side of the first cooling member 21, the surface 21A, with the bottom end of the case 7 while exposing a surface 21B which is the other outer-side surface of the first cooling member 21 to outside of the case 7, the first semiconductor module 2 is mounted in the case 7 in a state where the first opening 7H1 is closed by the first cooling member 21.
Similarly, in the power electronic unit 1, the second semiconductor elements 33(U) to 35(W) are accommodated in the case 7 as to be inserted into the internal space S of the case 7 through the second opening 7H2 of the case 7, and by adjoining one side of the second cooling member 31, the surface 31A, with the upper end of the case 7 while exposing a surface 31B which is the other outer-side surface of the first cooling member 31 to outside of the case 7, the second semiconductor module 3 is mounted in the case 7 in a state where the second opening 7H2 is closed by the second cooling member 31.
The circuit board 55, typically a PCB (Printed Circuit Board), while electrically being connected to each printed wiring, is mounted with, in addition to the controlling IC 551, various devices such as a resistor device (not shown), or a condenser on the front surface (the upper-side surface), along with being a control circuit board on which a total of three current sensors 552, corresponding to the front surfaces of a total of three protruding portions 553, are mounted on. The controlling IC 551 performs the controlling of the switching operations of the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W). Furthermore, each of the current sensors 552 is a non-contact type current sensor, typically a coreless current sensor having a Hall element, and individually, for the U-phase alternating current, the V-phase alternating current, and the W-phase alternating current, detects corresponding magnetic fields generated and converts these currents to current signals.
This circuit board 55, within the internal space S of the case 7, in between the first semiconductor module 2 and the second semiconductor module 3, in such a manner that each of the first semiconductor elements 23(U) to 25(W) thereof and the second semiconductor elements 33(U) to 35(W) thereof are appropriately separated, is mounted in the case 7 to be parallel with the horizontal surface.
Specifically, the circuit board 55, in between the first opening 7H1 and the second opening 7H2 of the case 7, in such a manner that the rear surface (the lower-side surface) thereof is opposite to one side of the first cooling member 21, the surface 21A, and the front surface thereof is opposite to one side of the second cooling member 31, the surface 31A, is positioned and mounted in parallel in the vertical direction in relation to the first cooling member 21 and the second cooling member 31. With such a configuration, the circuit board 55, while efficiently using the internal space S, is arranged with appropriate spacing of required distances from the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W). Due to this, the circuit board 55, the controlling IC 551, and its control current paths can be distanced from the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W) themselves and current paths where relatively high currents flow upon their operation, reducing the effects of excess heat and electromagnetic waves on the circuit board 55, for example, and improving the durability of these members.
When the circuit board 55 is at a midpoint between the first opening 7H1 and the second opening 7H2 of the case 7, or the circuit board 55 is positioned at a midpoint between the first semiconductor module 2 and the second semiconductor module 3, while appropriately balancing distancing of the circuit board 55 from the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W), the entire configuration of the power electronic unit 1 can be made more compact, and is further preferable.
Furthermore, the power electronic unit 1 is provided with, all of which are mounted in the case 7, one first connecting conductor 81(N), one second connecting conductor 82(P), and a total of three third connecting conductors 83(U), 84(V), and 85(W).
The first connecting conductor 81(N) and the second connecting conductor 82(P), when supplying power to the electric motor, function as a power input wire when connected electrically to the battery and power is supplied from the battery. Specifically, the first connecting conductor 81(N) is electrically connected to a minus terminal of the battery, and the second connecting conductor 82(P) is electrically connected to a plus terminal of the battery. Furthermore, when charging the battery, the first connecting conductor 81(N) and the second connecting conductor 82(P) function as an output wire.
The third connecting conductors 83(U), 84(V), and 85(W), when electrically connected to the electric motor and supplying power to the electric motor, function as an output wire for the three-phase alternating current. Specifically, the third connecting conductor 83(U) is electrically connected to the U-phase drive current input terminal of the electric motor, the third connecting conductor 84(V) is electrically connected to the V-phase drive current input terminal of the electric motor, and the third connecting conductor 85(W) is electrically connected to the W-phase drive current input terminal of the electric motor. Furthermore, when regenerative power is input from the regenerative mechanism, the third connecting conductors 83(U), 84(V), and 85(W) function as an input wire.
Furthermore, the power electronic unit 1 is provided with a total of two condensers, a first condenser 91 and a second condenser 92, which are mounted in the case 7 and accommodated in the internal space S. The first condenser 91 has connection terminals 911 and 912, and the second condenser 92 has connection terminals 921 and 922. That is, the first condenser 91 and the second condenser 92 have an identical configuration to each other including its electrostatic capacity and shape, except for the arrangement position of the connection terminals 921 and 922 and the arrangement position of the connection terminals 911 and 912 being different in the vertical direction.
Each of the first condenser 91 and the second condenser 92 is electrically connected in parallel with each other between the first connecting conductor 81(N) and the second connecting conductor 82(P), along with being electrically connected in parallel with respect to the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W), and when supplying power to the electric motor, function as smoothing condensers that smooth the direct current from the battery. Furthermore, when charging the battery, the first condenser 91 and the second condenser 92 function as smoothing condensers that smooth the direct current from the first semiconductor elements 23(U) to 25(W) and the second semiconductor elements 33(U) to 35(W). Furthermore, according to need, the first condenser 91 and the second condenser 92 may be unified and a single condenser may be used, or the number of condensers may be increased and three or more condensers may be used.
As described above, with the power electronic unit 1, where on both the top and bottom ends of the cylindrical case 7, the first semiconductor module 2 and the second semiconductor module 3 are first mounted correspondingly to each other, and a layered structure where the circuit board 55 is positioned in between the first semiconductor module 2 and the second semiconductor module 3 in the internal space S of the case 7 is used, while downsizing by making compact the configuration of the entire device through efficient use of the internal space S, radiation of the entire device is improved by securing radiation paths on both the top and bottom ends of the case 7, the effects of excess heat and electromagnetic waves on the circuit board 55 and the like are reduced, and the durability of these members are improved.
Respective constituent elements of the power electronic unit 1 as the semiconductor control device according to the present invention are explained below in detail.
[Configuration Related to Semiconductor Module]
As shown in FIG. 1 to FIG. 4, the first semiconductor module 2 is provided with the first cooling member 21, the first semiconductor elements 23(U), 24(V), and 25(W), and additionally provided with a frame 41, a pressing member 42, and a circuit board 51.
The first cooling member 21 that is typically made of an aluminum alloy and fixed to the case 7 has a function of a heat sink that acquires heat generated by the operations of the first semiconductor elements 23(U) to 25(W) and releases this to the outer side, that of a mounting member on which the first semiconductor elements 23(U) to 25(W) are mounted on, and that of a lid that closes the first opening 7H1 of the case 7, while being a part of the structural body of the power electronic unit 1.
One side of the first cooling member 21, the surface 21A, is configured as a flat plane having no differences in level, and on the other side, the surface 21B, on the opposite side, a plurality of radiation fins 215 for increasing the radiation efficiency are arranged in a systematically lined shape. On the first cooling member 21, penetration holes 211 for attachments of sorts and fastening holes having female screw threads are arranged, and it is preferable that these are closed by plugs (not shown) according to need, to prevent entry of water and dust. The size of the first cooling member 21 in the horizontal direction is larger than the individual sizes of the first semiconductor module 2, the second semiconductor module 3, and the circuit board 55 in the horizontal direction.
The first semiconductor element 23(U) of the first semiconductor module 2 has a low-side switching function of generating, among the three-phase alternating current, the U-phase low voltage side alternating current. The first semiconductor element 23(U) is provided with a semiconductor chip (not shown), a sealing body (for which reference numeral is not assigned), which is a package that seals the semiconductor chip, a first power input terminal 231 which is a board shape extending from one end (the end in the positive y-axis direction) of the sealing body in a shape of a gull-wing, a first output terminal 232 which is a board shape extending from the other end (the end in the negative y-axis direction) of the sealing body in the shape of a gull-wing, and connection leads (for which reference numeral is not assigned), which extend upward from one end and the other end of the sealing body.
As for the semiconductor chip, a power semiconductor element, such as an IGBT or a Power MOSFET having a high-voltage characteristic, is used. For the sealing body, typically a resin sealing body such as an epoxy resin sealing body is used. The inner side of the first power input terminal 231 is electrically connected to the input terminal of the semiconductor chip within the sealing body, and the outer side of the first power input terminal 231 is electrically connected to the first connecting conductor 81(N). The inner side of the first output terminal 232 is electrically connected to the output terminal of the semiconductor chip within the sealing body, and the outer side of the first output terminal 232 is electrically connected to the third connecting conductor 83(U).
As for the first semiconductor module 2, as the other first semiconductor element 24(V) and first semiconductor element 25(W) have a configuration identical to the first semiconductor element 23(U), explanations of identical configurations are abbreviated or omitted for convenience. Specifically, for the first semiconductor element 24(V) and the first semiconductor element 25(W), a product of the same type as the first semiconductor element 23(U), typically a product of the same model number, is used, and the first semiconductor elements 23(U) to 25(W) are interchangeable.
That is, the first semiconductor element 24(V) has a low-side switching function of generating, among the three-phase alternating current, the V-phase low voltage side alternating current, and similarly to the first semiconductor element 23(U), is provided with a first power input terminal 241, a first power output terminal 242 and the like, which are electrically connected correspondingly to the first connecting conductor 81(N), the third connecting conductor 84(V) and the like. Furthermore, the first semiconductor element 25(W) has a low-side switching function of generating, among the three-phase alternating current, the W-phase low voltage side alternating current, and similarly to the first semiconductor element 23(U), is provided with a first power input terminal 251, a first power output terminal 252 and the like, which are electrically connected correspondingly to the first connecting conductor 81(N), the third connecting conductor 85(W) and the like. Furthermore, according to need, the first semiconductor elements 23(U) to 25(W) may be unified, and a single semiconductor element may be used.
As shown particularly in FIG. 1, FIG. 3, and FIG. 4, the three first semiconductor elements 23(U) to 25(W) are attached to the frame 41, and in this state of being attached to the frame 41, are mounted on one side of the first cooling member 21, the surface 21A. The frame 41 is provided with a frame body 411, and a total of two positioning pins 412 and 413 arranged upright on the frame body 411. Furthermore, in FIG. 3, because the positioning pin 413 is in front on the viewing side, this is shown by an imaginary dashed line.
The frame body 411, while maintaining the positioning of the first semiconductor elements 23(U) to 25(W) adjacently arranged in the x-axis direction parallel to the horizontal surface, positions the first power input terminals 231 to 251 to be parallel to each other and aligned in the x-axis direction, and positions the first output terminals 232 to 252 to each correspond, at the opposite side, with the first power input terminals 231 to 251 by being parallel to each other and aligned in the x-axis direction. For the frame body 411, typically an injection molded resin frame body is used. The positioning pins 412 and 413 are typically integrally formed with the frame body 411 and extend in the vertical direction. Furthermore, the frame body 411 and positioning pin 412 and 413 may be made of metal if an increase of weight is allowed, and these elements may be separated if complication of the configuration is allowed.
As shown particularly in FIG. 1 and FIG. 3, on the frame body 411 of the frame 41, a pressing member 42 is fixed and attached. The pressing member 42, while pressing the first semiconductor elements 23(U) to 25(W) onto the frame body 411 with an appropriate pressure, interposes the first semiconductor elements 23(U) to 25(W) between the frame body 411 and one side of the first cooling member 21, the surface 21A. The pressing member 42 is fixed onto the frame body 411 using a fastening member such as screws (for which reference numeral is not assigned). The pressing member 42 is typically made of a metal material such as stainless steel having elasticity and superior in workability of such as machine processing. On the pressing member 42, there is arranged a rib having a U-shaped cross-section for assigning a desired spring constant, for example, between a portion that is attached to the frame body 411 and a portion pressing the first semiconductor elements 23(U) to 25(W).
As shown particularly in FIG. 1 and FIG. 3, the frame 41, in a state where the first semiconductor elements 23(U) though 25(W) are in contact with an insulation sheet 22 mounted on one side of the first cooling member 21, the surface 21A, sharing a fastening member such as screws (for which reference numeral is not assigned), for the pressing member 42 or circuit board 51, is fixed onto one side of the first cooling member 21, the surface 21A. The insulation sheet 22, while acting as a secure electronic insulation between the first cooling member 21 and the first semiconductor elements 23(U) to 25(W), has heat conductivity capable of efficiently conducting the heat generated by the operations of the first semiconductor elements 23(U) to 25(W) to the first cooling member 21. For the insulation sheet 22, typically a silicone rubber sheet is used.
As shown particularly in FIG. 1, FIG. 3, and FIG. 4, the circuit board 51 is, typically of a flat rectangular shape, and within the internal space S of the case 7, mounted in the case 7 between the first semiconductor elements 23(U) to 25(W) and the circuit board 55. The circuit board 51 is a drive circuit board implemented with a driving IC 511 that drives and operates the switching of the first semiconductor elements 23(U) to 25(W), based on control signals transmitted from the controlling IC 551 of the circuit board 55 for controlling the switching operations of the first semiconductor elements 23(U) to 25(W). Furthermore, the driving IC 511 may be divided into a plurality of driving ICs that individually drive the first semiconductor elements 23(U) to 25(W).
Specifically, the circuit board 51 has a pair of positioning holes 512 that conform to the positioning pins 412 and 413 of the frame 41, and while being positioned on the frame 41 by insertion of the positioning pins 412 and 413 through the corresponding positioning holes 512, the circuit board 51 is mounted parallel to the horizontal surface onto the frame 41 using a fastening member such as screws (for which reference numeral is not assigned). At this time, the rear surface of the circuit board 55 and the front surface (the upper-side surface) of the circuit board 51 are parallel to and opposite to each other.
The circuit board 51, typically a PCB, while electrically being connected to each printed wiring, is mounted with, in addition to the driving IC 511, various devices such as a resistor device (not shown), or a condenser on the front surface, and has connection leads (for which reference numeral is not assigned), which extend upwards from the wiring board and are given the shape of a kink. The circuit board 51 electrically connects these connection leads to the circuit board 55 through connectors (not shown) mounted on the front surface of the circuit board 55, and also gets electrically connected to the connection leads of the first semiconductor elements 23(U) to 25(W). That is, the circuit board 51, through its connection leads, receives control signals transmitted from the controlling IC 551 of the circuit board 55, and by transmitting drive signals from the driving IC 511, that operates based on the control signals, to the first semiconductor elements 23(U) to 25(W), through the connection leads of the first semiconductor elements 23(U) to 25(W), operates the switching of the first semiconductor elements 23(U) to 25(W).
Meanwhile, as shown in FIG. 1 to FIG. 4, although the second semiconductor module 3 is attached at a position higher than the first semiconductor module 2 and in an upside-down manner as compared to the first semiconductor module 2, and its usage differs from the first semiconductor module 2, as it has a configuration identical to the first semiconductor module 2, explanations of identical configurations are abbreviated or omitted for convenience. Specifically, the second semiconductor module 3 is provided with a second cooling member 31, second semiconductor elements 33(U), 34(V), and 35(W), as well as being provided with such as a frame 43, a pressing member 44, and a circuit board 52.
That is, the second cooling member 31 has a configuration identical to that of the first cooling member 21, and similarly to the first cooling member 21, has a surface 31A on one side which is a flat plane, a surface 31B on the other side where a radiation fin 315 is arranged, and penetration holes 311. Furthermore, while having a configuration identical to that of the first semiconductor element 23(U), the second semiconductor element 33(U) has a high-side switching function of generating, among the three-phase alternating current, the U-phase high voltage side alternating current, and similarly to the first semiconductor element 23(U), is provided with a second power input terminal 331 and a second power output terminal 332, which are electrically connected correspondingly to the second connecting conductor 82(P), the third connecting conductor 83(U) and the like. Further, while having a configuration identical to that of the second semiconductor element 33(U), the second semiconductor element 34(V) has a high-side switching function of generating the V-phase high voltage side alternating current, and similarly to the second semiconductor element 33(U), is provided with a second power input terminal 341 and a second power output terminal 342, which are electrically connected correspondingly to the second connecting conductor 82(P), the third connecting conductor 83(U) and the like. Further, while having a configuration identical to that of the second semiconductor element 33(U) the second semiconductor element 35(W) has a high-side switching function of generating, among the three-phase alternating current, the W-phase high voltage side alternating current, and similarly to the first semiconductor element 23(U), is provided with a second power input terminal 351 and a second power output terminal 352, which are electrically connected correspondingly to the second connecting conductor 82(P), the third connecting conductor 85(W) and the like.
The frame 43 has a configuration identical to that of the frame 41, and is provided with a frame body 431, and a total of two positioning pins 432 and 433 arranged upright on the frame body 431. Furthermore, the pressing member 44 has a configuration identical to that of the pressing member 42, and is fixed and attached onto the frame body 431 of the frame 43. Further, an insulation sheet 32 having a configuration identical to that of the insulation sheet 22 is arranged on one side of the second cooling member 31, the surface 31A. Further, the circuit board 52 having a configuration identical to that of the circuit board 51 is a drive circuit board implemented with a driving IC 521 that drives and operates the switching of the second semiconductor elements 33(U) to 35(W), and is arranged with a pair of positioning holes 522 which conform to the positioning pins 432 and 433 of the frame 43.
The circuit board 55, which is positioned between the circuit board 51 and the circuit board 52, has a total of four positioning holes 555 which conform to the positioning pins 412 and 413 of the frame 41, and the positioning pins 432 and 433 of the frame 43.
That is, the circuit board 55, by insertion of the positioning pins 412, 413, 432, and 433 through the corresponding positioning holes 555, is positioned against the frames 41 and 43, together with the circuit board 51 positioned on the frame 41 by the positioning pins 412 and 413 inserted through the positioning holes 512, and the circuit board 52 positioned on the frame 43 by the positioning pins 432 and 433 inserted through the positioning holes 522, and is mounted in the case 7 using a fastening member such as screws (for which reference numeral is not assigned).
Furthermore, as described above, in the power electronic unit 1, by configuring the semiconductor module to be divided into two semiconductor modules, the first semiconductor module 2 and the second semiconductor module 3, which have an identical configuration and are interchangeable, and by positioning these modules opposite to each other on the top and bottom ends of the case 7, the assembly is simplified and the types of constituent members are reduced.
[Configuration Related to Case]
As shown in FIG. 1 to FIG. 4, the case 7 is typically integrally formed and made of a resin such as PPS (Polyphenylene Sulfide) resin. That is, the sidewall 71 of the case 7, extending in the vertical direction is typically obtained as an integrally formed rectangular shaped cylindrical piece, and while forming the internal space S on its inside, on opposite sides of each other on the sidewall 71 at both ends in the vertical direction, the second opening 7H2 and the first opening 7H1, which open the internal space S to the outer area, are formed at both ends.
As shown in FIG. 1 to FIG. 4, on the four corners on the upper end of the sidewall 71, fastening holes (for which reference numeral is not assigned) having female screw threads are arranged, and using a fastening member, such as screws (for which reference numeral is not assigned), with these fastening holes, the second cooling member 31 of the second semiconductor module 3 is fixed, closing the second opening 7H2. Furthermore, although not shown in the drawings, fastening holes having female screw threads are also arranged on the four corners on the bottom end of the sidewall 71, and using a fastening member, such as screws (for which reference numeral is not assigned), with these fastening holes, the first cooling member 21 of the first semiconductor module 2 is fixed, closing the first opening 7H1. Furthermore, in such a case, in order to improve the positioning when mounting the first cooling member 21 and the second cooling member 31, in correspondence between both the top and bottom ends of the sidewall 71 and the first cooling member 21 and the second cooling member 31, an interlocking structure of concave and convex shapes, such as a combination of protrusions and matching grooves, may be arranged.
On the case 7, the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are attached, and these, correspondingly through one penetration hole 711, one penetration hole 712, and a total of three penetration holes 713, arranged on the sidewall 71, extend outside of the case 7. A sealing member is arranged in the gap between the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W), and the corresponding penetration holes 711, 712, and 713, sealing the internal space S.
Specifically, as shown in FIG. 1, FIG. 2A to FIG. 2C, and FIG. 4, the second connecting conductor 82(P) extends outside, penetrating the side of the sidewall 71 parallel to the y-z plane and on the positive x-axis direction, through the penetration hole 712, forming a protruding end, and this protruding end acts as a second power input terminal 73 of the power electronic unit 1. Specifically, the second power input terminal 73 is electrically connected to the plus terminal of the battery. Furthermore, on the side of the sidewall 71 parallel to the y-z plane and on the positive x-axis direction, there is arranged a controlling connector 75 having control terminals which are electrically connected to the circuit board 55.
As shown in FIG. 1, FIG. 2A and FIG. 2C, the first connecting conductor 81(N) extends outside, penetrating the side of the sidewall 71 parallel to the y-z plane and on the negative x-axis direction, through the penetration hole 711, forming a protruding end, and this protruding end acts as a first power input terminal 72 of the power electronic unit 1. Specifically, the first power input terminal 72 is electrically connected to the minus terminal of the battery.
As shown in FIG. 1, FIG. 2B, FIG. 3, and FIG. 4, the third connecting conductors 83(U) to 85(W) individually extend outside, penetrating the side of the sidewall 71 parallel to the x-z plane and on the negative y-axis direction, through the corresponding penetration holes 713, forming protruding ends arranged in parallel in the x-axis direction, and these protruding ends act as output terminals 74 of the power electronic unit 1. Specifically, the output terminal 74 corresponding to the third connecting conductor 83(U) is electrically connected to the U-phase drive current input terminal of the electric motor, the output terminal 74 corresponding to the third connecting conductor 84(V) is electrically connected to the V-phase drive current input terminal of the electric motor, and the output terminal 74 corresponding to the third connecting conductor 85(W) is electrically connected to the W-phase drive current input terminal of the electric motor. Furthermore, the penetration holes 713 may be singularly provided, through which all of the third connecting conductors 83(U) to 85(W) may be inserted.
Furthermore, as described above, in the power electronic unit 1, as the first semiconductor module 2 and the second semiconductor module 3 are correspondingly mounted on both the top and bottom end of the cylindrical case 7, the first opening 7H1 and the second opening 7H2 opened on both the top and bottom end of the case 7 are correspondingly closed, securely sealing the inner side of the case 7. Together with this, as the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) correspondingly extend out of the case 7 in such a manner that they do not interfere with each other, while keeping the configuration of the entire device compact through the efficient use of the internal space S, these protruding ends act as the first power input terminal 72, the second power input terminal 73, and the output terminals 74, allowing electronic connections correspondingly with the battery and electric motor.
[Configuration Related to Connecting Conductor]
As shown in FIG. 1, FIG. 3, and FIG. 4, the first connecting conductor 81(N), is a current path where a relatively high electric current flows, and while efficiently using the gap portion within the internal space S of the case 7, extends this gap portion in the x-axis direction, and extending out of the sidewall 71 of the case 7 through the penetration hole 711, the protruding end is used as the first power input terminal 72. On the first power input terminal 72, there is arranged a fastening hole 815 having a female screw thread for fastening the connection terminal of the electric wire from the minus terminal of the battery.
Specifically, as shown in FIG. 3 in particular, the first connecting conductor 81(N) is, within the internal space S, appropriately distanced from the controlling IC 551 mounted on the circuit board 55 and its control current path which is a current path of a relatively low current, positioned below the circuit board 55 in the vertical direction, and in the horizontal direction, is a block structure having a horizontal block portion that extends in the x-axis direction in the gap portion between a part within the internal space S of the first semiconductor module 2 and the first condenser 91 and the second condenser 92.
That is, the first connecting conductor 81(N) is, not a member having a shape such as a thin line or a board, and is configured as a prismatic linear conductive block structure where the vertical cross-section in the y-z plane is of a rectangular shape. The first connecting conductor 81(N) itself is a block structure having enough volume and strength as a support member to support the mounting and fastening of the power input terminals corresponding to the first semiconductor elements 23(U) to 25(W), and the corresponding connection terminals of the first condenser 91 and the second condenser 92. Specifically, the first connecting conductor 81(N) is typically made of an aluminum alloy, and its aspect ratio, which in its vertical cross-section is the ratio of its width dimension in the y-axis direction and its thickness dimension in the z-axis direction, although dependant on the positioning and sizes of its fastening holes, is configured within the approximate range of 1:5 and 5:1.
Because the first connecting conductor 81(N) has a conductive block structure and capable of securing plentiful measurements for fastening areas, a total of three fastening holes 813 each having female screw threads are arranged facing upward from its bottom surface, and a total of two fastening holes 814 each having female screw threads are arranged facing downward from its top surface and upward from its bottom surface. The first power input terminal 251 of the first semiconductor element 25(W) is, using a fastening member 811 such as screws, to the bottom surface of the first connecting conductor 81(N) through the fastening holes 813, mechanically fastened and electrically connected. Similarly, first power input terminal 231 of the first semiconductor element 23(U) and the first power input terminal 241 of the first semiconductor element 24(V) are, individually, using the fastening member 811 shown using like reference numerals, to the bottom surface of the first connecting conductor 81(N) through the fastening holes 813 shown using like reference numerals, mechanically fastened and electrically connected. The fastening member 811 is fastened with a fastening tool (not shown), such as a screw driver having a straight handle, inserted into the internal space S through the penetration hole 211 of the first cooling member 21. Furthermore, while the connection terminals 912 of the first condenser 91 are mechanically fastened and electrically connected to the top surface of the first connecting conductor 81(N) using fastening members 812 and the fastening holes 814, a connection terminals 922 of the second condenser 92 are mechanically fastened and electrically connected to the bottom surface of the first connecting conductor 81(N) using the fastening members 812 and the fastening holes 814 each shown using like reference numerals as those related to the first condenser 91.
As shown in FIG. 1, FIG. 3, and FIG. 4, the second connecting conductor 82(P) is a current path where a relatively high electric current flows, and is a member identical to the first connecting conductor 81(N) except for being attached at a position higher than the first connecting conductor 81(N) and in an upside-down manner as compared to the first connecting conductor 81(N). That is, on the second connecting conductor 82(P), similarly to the first connecting conductor 81(N), fastening holes 823, 824, and 825 are arranged. The second power input terminal 331 of the second semiconductor element 33(U), the second power input terminal 341 of the second semiconductor element 34(V), and the second power input terminal 351 of the second semiconductor element 35(W) are, individually, using fastening members 821 shown using like reference numerals, to the top surface of the second connecting conductor 82(P) through the fastening holes 823 shown using like reference numerals, mechanically fastened and electrically connected. Furthermore, while the connection terminals 911 of the first condenser 91 are mechanically fastened and electrically connected to the top surface of the second connecting conductor 82(P) using fastening members 822 and the fastening holes 824, the connection terminals 921 of the second condenser 92 are mechanically fastened and electrically connected to the bottom surface of the second connecting conductor 82(P) using the fastening members 822 and the fastening holes 824 each shown using like reference numerals as those related to the first condenser 91. Further, the connection terminal of the electric wire from the plus terminal of the battery is fastened and electrically connected to the fastening hole 825.
As shown in FIG. 1, FIG. 3, and FIG. 4, the third connecting conductor 85(W) is a current path where a relatively high electric current flows, and in relation to the first connecting conductor 81(N) and the second connecting conductor 82(P), is arranged on the opposite side in the y-axis direction, while a portion of the first semiconductor module 2 positioned within the internal space S and portions of the circuit board 55 and the second semiconductor module 3 positioned within the internal space S are interposed therebetween, and while efficiently using the gap portion within the internal space S of the case 7, extends this gap portion in the y-axis direction, and extending out of the sidewall 71 of the case 7 through the penetration hole 713, the protruding end is used as the output terminal 74. On the output terminal 74 of the third connecting conductor 85(W), there is arranged a fastening hole 852 having a female screw thread for fastening the W-phase drive current input terminal of the electric motor.
Specifically, as shown in FIG. 3 in particular, the third connecting conductor 85(W) is, within the internal space S of the case 7, appropriately distanced from the controlling IC 551 mounted on the circuit board 55 and its control current path which is a current path of a relatively weak current. In the horizontal direction, the third connecting conductor 85(W) extends from the sidewall 71 in the y-axis direction around the gap portion leading to a part of the first semiconductor module 2 positioned within the internal space S, and has a prismatic and linear horizontal block portion where the vertical cross-section in the x-z plane is of a rectangular shape. In the vertical direction, the third connecting conductor 85(W) extends upright from near the portion of the first semiconductor module 2 positioned within the internal space S, and while penetrating a corresponding penetration hole 554 of the circuit board 55, as to bridge between the first output terminal 252 of the first semiconductor element 25(W) and the second output terminal 352 of the second semiconductor element 35(W), extends in the z-axis direction along the gap portion among the portion positioned within the internal space S of the first semiconductor module 2, the portion positioned within the internal space S of the circuit board 55 and the second semiconductor module 3, and the current sensor 552, and has a block structure having a prismatic and linear upright block portion, where the lateral cross-section in the x-y plane is of a rectangular shape, which joins the horizontal block portion. Furthermore, the penetration holes 554 may be a single hole through which all of the third connecting conductors 83(U) to 85(W) may be inserted.
That is, the third connecting conductor 85(W), although being of an L-shape when viewed in the x-axis direction, similarly to the first connecting conductor 81(N) and the second connecting conductor 82(P), is constituted by a conductive block structure made of an aluminum alloy, and its aspect ratio of its portion extending in the y-axis direction, which in its vertical cross-section in the x-z plane is the ratio of its width dimension in the x-axis direction and its thickness dimension in the z-axis direction, and its aspect ratio of its portion extending in the z-axis direction, which in its lateral cross-section in the x-y plane is the ratio of its width dimension in the x-axis direction and its depth dimension in the y-axis direction, are respectively configured within the approximate range of 1:5 to 5:1.
Because the third connecting conductor 85(W) has a conductive block structure and capable of securing plentiful measurements for fastening areas, and capable of securing a plentiful length across from the second semiconductor element 35(W) to the first semiconductor element 25(W), on the third connecting conductor 85(W), a top and bottom pair of fastening holes 851 each having female screw threads can be arranged on the opposite side. As shown in FIG. 3 in particular, the second output terminal 352 of the second semiconductor element 35(W), using fastening members 855 and the fastening holes 851, is mechanically fastened and electrically connected to the top end surface of the upright block portion of the third connecting conductor 85(W). Similarly, the first output terminal 252 of the first semiconductor element 25(W), using fastening members 855 and the fastening holes 851 each shown using like reference numerals, is mechanically fastened and electrically connected to the bottom end surface of the upright block portion of the third connecting conductor 85(W). The fastening members 855 are fastened with a fastening tool (not shown), such as a screw driver having a straight handle, inserted into the internal space S through the corresponding penetration hole 211 of the first cooling member 21 or the corresponding penetration hole 311 of the second cooling member 31.
The third connecting conductor 84(V) adjacently placed on the side in the negative x-axis direction in relation to the third connecting conductor 85(W), and the third connecting conductor 83(U) adjacently placed on the side in the negative x-axis direction in relation to the third connecting conductor 84(V) are respectively current paths where a relatively high electric current flows, and are members identical to the third connecting conductor 85(W), except for their attached positions to be different from the third semiconductor 85(W). That is, the third connecting conductor 83(U) and the third connecting conductor 84(V), similarly to the third connecting conductor 85(W), while efficiently using the gap portion within the internal space S of the case 7 and extending this gap portion in the y-axis direction, extend out from the sidewall 71 of the case 7, and these protruding ends are used as the output terminals 74. On the output terminals 74 of the third connecting conductor 83(U) and the third connecting conductor 84(V), fastening holes 832 and 842 having female screw threads are arranged to correspondingly fasten the U-phase and V-phase drive current input terminals of the electric motor. While the second output terminal 332 of the second semiconductor element 33(U), using a fastening member 835 and a fastening hole 831 having a female screw thread, is mechanically fastened and electrically connected to the top end surface of the upright block portion of the third connecting conductor 83(U), the first output terminal 232 of the first semiconductor element 23(U), using a fastening member 835 and a fastening hole 831 having a female screw thread each shown using like reference numerals, is mechanically fastened and electrically connected to the bottom end surface of the upright block portion of the third connecting conductor 83(U). Furthermore, while the second output terminal 342 of the second semiconductor element 34(V), using a fastening member 845 and a fastening hole 841 having a female screw thread, is mechanically fastened and electrically connected to the top end surface of the upright block portion of the third connecting conductor 84(V), the first output terminal 242 of the first semiconductor element 24(V), using a fastening member 845 and a fastening hole 841 having a female screw thread each shown using like reference numerals, is mechanically fastened and electrically connected to the bottom end surface of the upright block portion of the third connecting conductor 84(V). Further, the U-phase drive current input terminal of the electric motor, through the fastening hole 832 arranged on the output terminal 74 of the third connecting conductor 83(U), is electrically connected while being mechanically fastened and supported, and the V-phase drive current input terminal of the electric motor, through the fastening hole 842 arranged on the output terminal 74 of the third connecting conductor 84(V), is electrically connected while being mechanically fastened and supported.
The first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) shall be block structure, capable of extending along corresponding gap portions within the internal space S and penetrating the sidewall 71 to protrude out of the case 7, having enough strength and volume to act as a supporting member that supports while mechanically fastening to another correspondingly mounted terminal, and having enough conductivity to conduct with another terminal. Therefore, the block structure may include a single block portion, or may be a combination of a plurality of block portions, and by appropriately combining similar block portions, its shape and the length of the current path may be easily expanded. Furthermore, as long as the block portion has a cross-section that does not generate excessive inductance or heat, the block portion is not limited to a shape having a rectangular cross-section, and may have a cross-section of such as another polygon or oval shape. Of course, the block portion, instead of extending as a linear block portion, may be a block portion extending in a curve shape, and instead of having the fastening portion on a flat surface, may have a fastening portion on an inclined surface.
Furthermore, as described above, in the power electronic unit 1, as the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) where a relatively high electric current flows, and the control current paths where relatively weak currents flow, are distanced from each other and distributed efficiently, and the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are correspondingly extended in the gap portions of the internal space S, the configuration of the entire device is kept compact through the efficient use of the internal space S, and by the first connecting conductor 81(N) and the second connecting conductor 82(P) being of an interchangeable identical configuration, and the third connecting conductors 83(U) to 85(W) being of an interchangeable identical configuration, the assembly is simplified and the types of constituent members are reduced.
[Assembling of Power Electronic Unit]
The method of assembling the power electronic unit 1 having the above configuration is described below in detail.
First, the insulation sheet 22 is arranged on top of one side of the first cooling member 21, the surface 21A, the pressing member 42 is attached against the frame 41 accommodating the first semiconductor elements 23(U) to 25(W), and the circuit board 51 mounted with the driving IC 511 is attached. By fastening and attaching the frame 41 in the state described above onto one side of the first cooling member 21, the surface 21A, with the insulation sheet 22 in between, the first semiconductor module 2 is assembled.
At this time, through one pair of positioning holes 512 of the circuit board 51, a total of two positioning pins 412 and 413 arranged upright on the frame body 411 of the frame 41 are correspondingly inserted, and thus the circuit board 51 is positioned against the frame 41, and attached to a specific position in the first semiconductor module 2.
Similarly, the insulation sheet 32 is arranged on top of one side of the second cooling member 31, the surface 31A, the pressing member 44 is attached against the frame 43 accommodating the second semiconductor elements 33(U) to 35(W), and the circuit board 52 mounted with the driving IC 521 is attached. By fastening and attaching the frame 43 in the state described above onto one side of the second cooling member 31, the surface 31A, with the insulation sheet 32 in between, the second semiconductor module 3 is assembled.
At this time, through one pair of positioning holes 522 of the circuit board 52, a total of two positioning pins 432 and 433 arranged upright on the frame body 431 of the frame 43 are correspondingly inserted, and thus the circuit board 52 is positioned against the frame 43, and attached to a specific position in the second semiconductor module 3.
Also, the first connecting conductor 81(N) penetrated through the penetration hole 711 through a sealing member, the second connecting conductor 82(P) penetrated through the penetration hole 712 through a sealing member, and the third connecting conductors 83(U) to 85(W) penetrated through the penetration holes 713 through a sealing member, are respectively attached to corresponding fixing parts (not shown) arranged on the sidewall 71 of the case 7.
Furthermore, to the first connecting conductor 81(N) and the second connecting conductor 82(P) in the above mentioned state, each using the corresponding fastening members 812 and 822 along with the fastening holes 814 and 824, the connection terminals 911 and 912 of the first condenser 91, and the connection terminals 921 and 922 of the second condenser 92, are fastened. By this, the first condenser 91 and the second condenser 92, while being accommodated in the internal space S of the case 7, are attached to the first connecting conductor 81(N) and the second connecting conductor 82(P).
Next, with the case 7 in the state described above, with the first semiconductor module 2, the first semiconductor elements 23(U) to 25(W) are positioned within the internal space S through the first opening 7H1, and attached in such a manner that the other surface of the first cooling member 21, the surface 21B, is exposed to outside of the case 7, as to close the first opening 7H1 with the first cooling member 21.
At this time, by inserting the positioning pins 412 and 413 of the first semiconductor module 2 through the corresponding pair of positioning holes 555 of the circuit board 55, the circuit board 55, while being placed on a fixing part (for which reference numeral is not assigned), arranged above the circuit board 51 on the sidewall 71 of the case 7, is positioned against the first semiconductor module 2 attached to the case 7.
Next, with the case 7 in the state described above, with the second semiconductor module 3, the second semiconductor elements 33(U) to 35(W) are arranged within the internal space S through the second opening 7H2, and attached in such a manner that the other surface of the second cooling member 31, the surface 31B, is exposed to outside of the case 7, as to close the second opening 7H2 with the second cooling member 31.
At this time, by inserting the positioning pins 432 and 433 of the second semiconductor module 3 through the remaining corresponding pair of positioning holes 555 of the circuit board 55, while the circuit board 55 and the second semiconductor module 3 are positioned, the circuit board 55 is attached to a fixing part in the case 7.
Next, while sequentially inserting a fastening tool (not shown) into the internal space S through the penetration hole 211 of the first cooling member 21, by fastening the fastening members 811 onto the corresponding fastening holes 813, the first power input terminals 231 to 251 of the first semiconductor elements 23(U) to 25(W) are fastened against the first connecting conductor 81(N), and by fastening the fastening members 835 to 855 onto the corresponding fastening holes 831 to 851, the first output terminals 232 to 252 of the first semiconductor elements 23(U) to 25(W) are fastened against the third connecting conductors 83(U) to 85(W).
Next, while sequentially inserting a fastening tool (not shown) into the internal space S through the penetration hole 311 of the second cooling member 31, by fastening the fastening members 821 onto the corresponding fastening holes 823, the second power input terminals 331 to 351 of the second semiconductor elements 33(U) to 35(W) are fastened against the second connecting conductor 82(P), and by fastening the fastening members 835 to 855 onto the corresponding fastening holes 831 to 851, the second power output terminals 332 to 352 of the second semiconductor elements 33(U) to 35(W) are fastened against the third connecting conductors 83(U) to 85(W).
Subsequently, according to need, by closing the penetration hole 211 of the first cooling member 21 and the penetration hole 311 of the second cooling member 31 using such as grommets (not shown), the assembly of the power electronic unit 1 is completed.
Second Embodiment
Next, a semiconductor control device according to a second embodiment of the present invention is described in detail also with reference to FIG. 5.
A semiconductor control device 1′ according to the present embodiment shown in further detail in FIG. 5 is mainly different from that of the first embodiment for having the relative positioning relations of the positioning pins 412 and 413 of the frame 41, the positioning pins 432 and 433 of the frame 43, the positioning holes 512 of the circuit board 51, the positioning holes 522 of the circuit board 52, and the positioning holes 555 of the circuit board 55, more strictly defined, while configurations of the semiconductor control device 1′ other than the above point are the same as the semiconductor control device according to the first embodiment. Therefore, like constituent elements are denoted by like reference numerals and explanations thereof are appropriately abbreviated or omitted.
Specifically, the positioning pins 412 and 413 arranged upright on the frame body 411 of the frame 41, as it is preferable to increase the span between the positioning pins 412 and 413 in order to improve the positioning precision of the frame 41 and the circuit board 51, and to improve the positioning precision of the circuit board 51 and the circuit board 55, are, in a planar view, arranged upright on each diagonally opposite corner of the rectangular shaped frame 41.
The positioning pins 432 and 433 arranged upright on the frame body 431 of the frame 43, as it is preferable to increase the span between the positioning pins 432 and 433 in order to improve the positioning precision of the frame 43 and the circuit board 52, and to improve the positioning precision of the circuit board 52 and the circuit board 55, are, in a planar view, arranged upright on each diagonally opposite corner of the rectangular shaped frame 43. Furthermore, the positioning pins 432 and 433, when matching the upsides of the frames 41 and 43, are positioned to be in identical positions with the positioning pins 412 and 413 arranged on the frame 41. The reason for this arrangement is, in the assembly of the power electronic unit 1, as the first semiconductor module 2 and the second semiconductor module 3 are attached onto the case 7 in an upside-down manner to each other, when matching the upsides of the frames 41 and 43, if the positioning pins 412 and 413 arranged on the frame 41, and the positioning pins 432 and 433 arranged on the frame 43, are positioned to be in corresponding identical positions on the frames 41 and 43, the four corners of the circuit board 55, which in a planar view is of a rectangular shape, can be penetrated, accurately positioning the circuit board 55 with a minimal number of positioning pins.
The circuit board 55 has a total of four positioning holes 555, which match the positioning pins 412 and 413 arranged on the frame 41, and the positioning pins 432 and 433 arranged on the frame 43 correspondingly on its four corners.
That is, the circuit board 55, by having the positioning pins 412, 413, 432, and 433 inserted through the corresponding positioning holes 555 arranged on the corresponding four corners, is mounted onto the case 7 using a fastening member such as screws (for which reference numeral is not assigned), in a state where the circuit board 51 positioned on the frame 41 by the insertion of the positioning pins 412 and 413 through the positioning holes 522, and the circuit board 52 positioned on the frame 43 by the insertion of the positioning pins 432 and 433 through the positioning holes 512, are inserted together and positioned on the frames 41 and 43. At this time, as the frame 41 and the frame 43 are placed to be opposite to each other in an upside-down manner, the positioning pins 412, 413, 432, and 433 are able to penetrate the corresponding penetration holes 555 on the four corners of the circuit board 55. Furthermore, in order to improve the ease of the assembly of the circuit board 55 in this case, the diameter of one of the positioning holes 555 formed on its four corners may be configured to be larger.
As described above, in the power electronic unit 1′, as the semiconductor module is configured to be divided into the first semiconductor module 2 and the second semiconductor module 3, having an identical configuration and are interchangeable, positioned to be opposite to each other on both the top and bottom end of the case 7, along with the arrangement of the positioning pins 412 and 413 on the frame 41, and the arrangement of the positioning pins 432 and 433 on the frame 43, the assembly is simplified and the types of constituent members are reduced, together with an improvement in the relative positioning precision of the frames 41 and 43, and the circuit boards 51, 52, and 55.
The method of assembling the power electronic unit 1′ having the above configuration is described below in detail.
First, similarly to the first embodiment, the first semiconductor module 2 is assembled. At this time, by correspondingly inserting the total of two positioning pins, the positioning pins 412 and 413 arranged upright on each diagonally opposite corner of the frame body 411 of the frame 41, through one pair of positioning holes 512 on the circuit board 51, the circuit board 51 is positioned against the frame 41, and is attached to a specific position in the first semiconductor module 2.
Similarly to the first embodiment, the second semiconductor module 3 is assembled. At this time, by correspondingly inserting the total of two positioning pins, the positioning pins 432 and 433 arranged upright on each diagonally opposite corner of the frame body 431 of the frame 43, through one pair of positioning holes 522 on the circuit board 52, the circuit board 52 is positioned against the frame 43, and is attached to a specific position in the second semiconductor module 3.
Next, similarly to the first embodiment, the first connecting conductor 81(N) and the second connecting conductor 82(P), on which the first condenser 91 and the second condenser 92 are attached, and the third connecting conductors 83(U) to 85(W), are attached to the case 7. Subsequently, with the case 7 in the state described above, with the first semiconductor module 2, the first semiconductor elements 23(U) to 25(W) are positioned within the internal space S through the first opening 7H1, and attached in such a manner that the other surface of the first cooling member 21, the surface 21B, is exposed to outside of the case 7, as to close the first opening 7H1 with the first cooling member 21.
At this time, by inserting the positioning pins 412 and 413 of the first semiconductor module 2 through the corresponding pair of positioning holes 555 on diagonally opposite corners, out of the positioning holes 555 arranged on the four corners of the circuit board 55, the circuit board 55, while being placed on a fixing part (for which reference numeral is not assigned), arranged above the circuit board 51 on the sidewall 71 of the case 7, is positioned against the first semiconductor module 2 attached to the case 7.
Next, similarly to the first embodiment, with the case 7 in the state described above, with the second semiconductor module 3, the second semiconductor elements 33(U) to 35(W) are positioned within the internal space S through the second opening 7H2, and attached in such a manner that the other surface of the second cooling member 31, the surface 31B, is exposed to outside of the case 7, as to close the second opening 7H2 with the second cooling member 31.
At this time, by inserting the positioning pins 432 and 433 of the second semiconductor module 3 through the remaining corresponding pair of positioning holes 555 on diagonally opposite corners, out of the positioning holes 555 arranged on the four corners of the circuit board 55, the circuit board 55, while positioning the circuit board 55 and the second semiconductor module 3, is attached to the fixing part of the case 7. The positioning pins 412 and 413 of the first semiconductor module 2, and the positioning pins 432 and 433 of the second semiconductor module 3, are inserted through the corresponding positioning holes 555 arranged on the four corners of the circuit board 55, and by the positions of the four corners of the circuit board 55 being accurately positioned against the first semiconductor module 2 and the second semiconductor module 3 each of which is fixed to the case 7, the circuit board 55 is accurately arranged against these in its proper position, and thus the circuit board 55 and its connection leads are not exposed to any unnecessary stress or the like.
Subsequently, similarly to the first embodiment, the first power input terminals 231 to 251 of the first semiconductor elements 23(U) to 25(W) are fastened against the first connecting conductor 81(N), the first output terminals 232 to 252 of the first semiconductor elements 23(U) to 25(W) are fastened against the third connecting conductors 83(U) to 85(W), the second power input terminals 331 to 351 of the second semiconductor elements 33(U) to 35(W) are fastened against the second connecting conductor 82(P), the second power output terminals 332 to 352 of the second semiconductor elements 33(U) to 35(W) are fastened against the third connecting conductors 83(U) to 85(W), and according to need, by closing the penetration hole 211 of the first cooling member 21 and the penetration hole 311 of the second cooling member 31 using such as grommets (not shown), the assembly of the power electronic unit 1′ is completed.
Third Embodiment
Next, a semiconductor control device according to a third embodiment of the present invention is described in detail also with reference to FIG. 6 to FIG. 8.
A semiconductor control device 1′′ according to the present embodiment shown in further detail in FIG. 6 to FIG. 8 is mainly different from that of the first embodiment for having the first connecting conductor 81(N), the second connecting conductor 82(P), the third connecting conductors 83(U) to 85(W), the first condenser 91, the second condenser 92, and the connectors 75 integrally formed with the sidewall 71 of the case 7, the configuration of the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) more strictly defined, while the configuration of the rest remains the same. Therefore, in the present embodiment, explanations will focus on these differences, and explanations of identical configurations will assign identical reference characters and are abbreviated or omitted for convenience. Furthermore, as for the configuration of the present embodiment, the configuration of the second embodiment, which has the relative positioning relations of the positioning pins 412 and 413 of the frame 41, the positioning pins 432 and 433 of the frame 43, the positioning holes 512 of the circuit board 51, the positioning holes 522 of the circuit board 52, and the positioning holes 555 of the circuit board 55, more strictly defined, may of course be applied.
Specifically, in the case 7, the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are integrally formed with the sidewall 71 of the case 7. For this reason, the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W), through one penetration portion 711′, one penetration portion 712′, and a total of three penetration portions 713′ arranged on the sidewall 71, extend outside of the case 7. As the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are in close contact with their corresponding penetration portions 711′ to 713′, the internal space S is sealed.
In more detail, each of the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) is insert-molded to the case 7, and formed integrally with the sidewall 71 of the case 7. Specifically, when molding the case 7, each of the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) is located in advance in predetermined positions within the mold, and simultaneously as the sidewall 71 is molded during the molding of the case 7, are adhered and fixed onto the sidewall 71 in the penetration portions 711′ to 713′ formed in the sidewall 71.
Furthermore, the first condenser 91 and the second condenser 92 are attached, to the case 7, in a state where they are accommodated in the internal space S, and these are integrally formed with the sidewall 71 of the case 7. Specifically, the first condenser 91 and the second condenser 92, when molding the case 7, are located in advance in predetermined positions within the mold, and simultaneously as the sidewall 71 is molded during the molding of the case 7, a coating portion CP that covers these is formed, and these, covered by the coating portion CP, are fixed onto the sidewall 71.
Further, the connectors 75, when molding the case 7, are located in advance in predetermined positions within the mold, and simultaneously as the sidewall 71 is molded during the molding of the case 7, are adhered and fixed onto the sidewall 71 in penetration portions 714′ formed in the sidewall 71.
Furthermore, as described above, in the power electronic unit 1′′, as the first semiconductor module 2 and the second semiconductor module 3 are correspondingly mounted on both the top and bottom ends of the cylindrical case 7, and the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are correspondingly extended outside of the case 7 in such a manner that they do not interfere with each other, along with the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) each being integrally formed with the case 7, where these are adhered and fixed onto the sidewall 71 in the penetration portions 711′, 712′, and 713′ formed on the sidewall 71, assembling steps of attaching these to the case 7 are reduced, while reinforcing the case 7 and improving its rigidness. Also, as each of the connectors 75, the first condenser 91, and the second condenser 92 is integrally formed with the case 7, the assembling steps of attaching these to the case 7 are reduced.
In a case when the first connecting conductor 81(N) is configured as a block structure, as its material, instead of using a copper alloy or an iron alloy usually considered, it is preferable to use an aluminum alloy.
The reason therefor is, when the first connecting conductor 81(N) is made of a copper alloy, as the copper alloy is relatively superior in conductivity, the cross-sectional area perpendicular to the direction in with the current flows can be made smaller, and due to its high cost, a cabled structure having a plurality of thin lines or a bus bar shaped configuration with thin plates is likely to be used, thus eliminating the need to use a block structure. In such a case, the strength of the first connecting conductor 81(N) itself may not be enough to properly support the first power input terminals 231 to 251 of the first semiconductor elements 23(U) to 25(W) and the connection terminals corresponding to the first condenser 91 and the second condenser 92, let alone the difficulty of directly arranging the fastening holes 813 and 814 on itself. Furthermore, in this case, due to the smaller cross-sectional area, its perimeter and outer surface area are also smaller, leading to a possibility of unnecessary effects on each nearby device from an increase in the inductance against the currents flowing through the part, along with a reduction in the radiation of heat generated by the currents flowing through the part.
On the other hand, when the first connecting conductor 81(N) is made of an iron alloy, as the iron alloy is relatively inferior in conductivity, the cross-sectional area perpendicular to the direction in with the current flows has to be made larger, resulting in the use of a configuration having a large cross-sectional area. In such a case, the size of the first connecting conductor 81(N) itself becomes too large, making it difficult to extend along the gap portion within the internal space S, and attempting to extend this along the gap portion requires the size of the case 7 itself to be larger.
Therefore, for securing the performance while optimizing characteristics, such as electrical properties, mechanical properties, and size, of the first connecting conductor 81(N), in order to configure the first connecting conductor 81(N) as a block structure, it can be evaluated that it is preferable that this conductive material is made of an aluminum alloy. The above mentioned reasoning is the same with the other conductors, the second connecting conductor 82(P) and the third connecting conductors 83(U) to 85(W). Particularly, in the first connecting conductor 81(N) and the second connecting conductor 82(P), as the first power input terminals 231 to 251 of the first semiconductor elements 23(U) to 25(W), the second power input terminals 331 to 351 of the second semiconductor elements 33(U) to 35(W), the connection terminals corresponding to the first condenser 91 and the second condenser 92, the connection terminal of the electric wire from the minus terminal of the battery, and the connection terminal of the electric wire from the plus terminal of the battery can be directly connected to the first connecting conductor 81(N) and the second connecting conductor 82(P) correspondingly, and mechanically supported together while being electrically connected, an additional terminal board can be omitted. Further, in the third connecting conductor 83(U) to 85(W), because the first output terminals 232 to 252 of the first semiconductor elements 23(U) to 25(W), the second output terminals 332 to 352 of the second semiconductor elements 33(U) to 35(W), and the U-phase through W-phase drive current input terminals of the electric motor can be directly connected and mechanically supported together to the third connecting conductors 83(U) through 85(W) correspondingly, while being electrically connected, an additional terminal board can be omitted.
In this configuration, the connection terminal of the electric wire from the minus terminal of a battery (not shown), the first power input terminal 251 of the first semiconductor element 25(W), the first power input terminal 231 of the first semiconductor element 23(U), and the first power input terminal 241 of the first semiconductor element 24(V) are, individually, to the first connecting conductor 81(N) which is a conductive block structure, electrically connected while being mechanically fastened and supported.
The connection terminal of the electric wire from the plus terminal of a battery (not shown), the second power input terminal 351 of the second semiconductor element 35(W), the second power input terminal 331 of the second semiconductor element 33(U), and the second power input terminal 341 of the second semiconductor element 34(V) are, individually, to the second connecting conductor 82(P) which is a conductive block structure, electrically connected while being mechanically fastened and supported.
The W-phase drive current input terminal of an electric motor (not shown), the second output terminal 352 of the second semiconductor element 35(W), and the first output terminal 252 of the first semiconductor element 25(W) are, individually, to the third connecting conductor 85(W) which is a conductive block structure, electrically connected while being mechanically fastened and supported.
The U-phase drive current input terminal of an electric motor (not shown), the second output terminal 332 of the second semiconductor element 33(U), and the first output terminal 232 of the first semiconductor element 23(U) are, individually, to the third connecting conductor 83(U) which is a conductive block structure, electrically connected while being mechanically fastened and supported.
The V-phase drive current input terminal of an electric motor (not shown), the second output terminal 342 of the second semiconductor element 34(V), and the first output terminal 242 of the first semiconductor element 24(V) are, individually, to the third connecting conductor 84(V) which is a conductive block structure, electrically connected while being mechanically fastened and supported.
As described above, in the power electronic unit 1′′, as the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) where a relatively high electric current flows, and the control current paths where relatively weak currents flow, are distanced from each other and distributed efficiently, the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are correspondingly extended in the gap portions of the internal space S, and the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are configured as block structured bodies, the configuration of the entire device is kept compact through the efficient use of the internal space S, and while an additional terminal board is omitted, the first power input terminals 231 to 251 of the first semiconductor elements 23(U) to 25(W) are, to the first connecting conductor 81(N), electrically connected while being mechanically fastened and supported, the second power input terminals 331 to 351 of the second semiconductor elements 33(U) to 35(W) are, to the second connecting conductor 82(P), electrically connected while being mechanically fastened and supported, and the connection terminals corresponding to the first condenser 91 and the second condenser 92 are, to the first connecting conductor 81(N) and the second connecting conductor 82(P), electrically connected while being mechanically fastened and supported. Meanwhile, the connection terminal of the electric wire from the minus terminal of the battery is, to the first connecting conductor 81(N), electrically connected while being mechanically fastened and supported, and the connection terminal of the electric wire from the plus terminal of the battery is, to the second connecting conductor 82(P), electrically connected while being mechanically fastened and supported. Also, the first output terminals 232 to 252 of the first semiconductor elements 23(U) to 25(W) are, to the third connecting conductors 83(U) to 85(W), electrically connected while being mechanically fastened and supported, and the second output terminals 332 to 352 of the second semiconductor elements 33(U) to 35(W) are, to the third connecting conductors 83(U) to 85(W), electrically connected while being mechanically fastened and supported. Meanwhile, the U-phase drive current input terminal of the electric motor is, to the third connecting conductor 83(U), electrically connected while being mechanically fastened and supported, the V-phase drive current input terminal of the electric motor is, to the third connecting conductor 84(V), electrically connected while being mechanically fastened and supported, and the W-phase drive current input terminal of the electric motor is, to the third connecting conductor 85(W), electrically connected while being mechanically fastened and supported.
The method of assembling the power electronic unit 1′′ having the above configuration is explained below in detail.
First, the case 7 is molded and prepared. Specifically, the connectors 75, the first connecting conductor 81(N), the second connecting conductor 82(P), the third connecting conductors 83(U) to 85(W), the first condenser 91, and the second condenser 92, are located in advance in predetermined positions within the mold, and thereafter, the resin material is injected into the mold. Subsequently, simultaneously as the sidewall 71 is molded, the connectors 75, the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W), in the penetration portions 711′ to 714′ formed on the sidewall 71, correspondingly penetrate the sidewall 71. At this time, the first condenser 91 and the second condenser 92 are covered by the coating portion CP. Subsequently, the injection of the resin material into the mold is ended after being performed for a specific time, and when the mold is cooled, the connectors 75, the first connecting conductor 81(N), the second connecting conductor 82(P), and the third connecting conductors 83(U) to 85(W) are, in the penetration portions 711′ to 714′ of the sidewall 71, correspondingly adhered and fixed to the sidewall 71. Also, the first condenser 91 and the second condenser 92 are, covered by the coating portion CP, to the sidewall 71, adhered and fixed. Thereafter, by removing the molded product from the mold, the case 7, with the connectors 75, the first connecting conductor 81(N), the second connecting conductor 82(P), the third connecting conductors 83(U) to 85(W), the first condenser 91, and the second condenser 92 each fixed onto the sidewall 71, is obtained.
The first semiconductor module 2 and the second semiconductor module 3 are assembled similarly to the first embodiment.
Next, by fastening the connection terminals 911 and 912 of the first condenser 91, and the connection terminals 921 and 922 of the second condenser 92, to the corresponding first connecting conductor 81(N) and the second connecting conductor 82(P) in its state of being fixed and attached to the case 7, the first condenser 91 and the second condenser 92, while being accommodated in the internal space S of the case 7, are attached to the first connecting conductor 81(N) and the second connecting conductor 82(P).
Next, similarly to the first embodiment, with the first cooling member 21 of the first semiconductor module 2, the first opening 7H1 of the case 7 is closed, and with the second cooling member 31 of the second semiconductor module 3, the second opening 7H2 of the case 7 is closed.
Subsequently, similarly to the first embodiment, the first power input terminals 231 to 251 of the first semiconductor elements 23(U) to 25(W) are fastened against the first connecting conductor 81(N), the first output terminals 232 to 252 of the first semiconductor elements 23(U) to 25(W) are fastened against the third connecting conductors 83(U) to 85(W), the second power input terminals 331 to 351 of the second semiconductor elements 33(U) to 35(W) are fastened against the second connecting conductor 82(P), and the second output terminals 332 to 352 of the second semiconductor elements 33(U) to 35(W) are fastened against the third connecting conductors 83(U) to 85(W), and according to need, by closing the penetration hole 211 of the first cooling member 21 and the penetration hole 311 of the second cooling member 31 using such as grommets (not shown), the assembly of the power electronic unit 1′′ is completed.
In the present invention, the shape, arrangement, and number or the like of constituent elements are not limited to those described in the above embodiments, and it is of course possible to appropriately modify the constituent elements without departing from the scope of the invention, such as replacing these elements with other ones that have identical operational effects.
As described above, as the present invention can provide a semiconductor control device capable of securely distancing circuit boards that need to be distanced from heat sources and high current paths, from such elements, while improving the radiation of heat generated by heat sources, as well as making downsizing of the entire device possible through reductions in size, in terms of width and depth, by efficiently using the internal space that is allowed layout-wise in the case, for its general purposes and universal characteristics, applications can be expected in a wide range in fields of semiconductor control devices, such as a power electronic unit.
Reference is hereby made to a Patent Application No. TOKUGAN 2011-210650 with a filing date of Sep. 27, 2011 in Japan, a Patent Application No. TOKUGAN 2011-210654 with a filing date of Sep. 27, 2011 in Japan and a Patent Application No. TOKUGAN 2011-210655 with a filing date of Sep. 27, 2011 in Japan, the entire contents of which are incorporated herein by reference.
The present invention is not limited to the embodiments described above in respect of a kind, placement and the number of the component parts and it is of course to be understood that the relevant component parts may be suitably replaced by those having equivalent advantageous effects and alterations may be suitably made without departing from the scope of the present invention, in light of the teachings. The scope of the invention is defined with reference to the following claims.

## Claims

1. A semiconductor control device comprising:
a plurality of semiconductor modules each having a cooling member and a semiconductor element;
a circuit board mounted with a control element that controls the plurality of semiconductor modules; and
a case in which the plurality of semiconductor modules and the circuit board are respectively mounted,
wherein the case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other, while correspondingly connecting with the both ends of the sidewall to open the internal space of the case to an outer area,
wherein the plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening,
and wherein the circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.

2. The semiconductor control device according to claim 1, wherein the first semiconductor module is mounted with a first semiconductor element on one surface of a first cooling member, and the second semiconductor module is mounted with a second semiconductor element on one surface of a second cooling member that faces opposite to the one surface of the first cooling member,
and wherein the circuit board is a control circuit board implemented with the control element that controls each of switching operations of the first semiconductor element and the second semiconductor element.

3. The semiconductor control device according to claim 2, further comprising:
an input-side connecting conductor for the first semiconductor element and the second semiconductor element; and
an output-side connecting conductor for the first semiconductor element and the second semiconductor element,
wherein the internal space has a gap portion, which is not within an occupied area in the internal space occupied by the first semiconductor module, the second semiconductor module, and the control circuit board
and wherein the input-side connecting conductor and the output-side connecting conductor are respectively formed along the gap portion and penetrate the sidewall to extend outside of the case.

4. The semiconductor control device according to claim 1, wherein the first semiconductor module is mounted in the case, in a state where the first semiconductor element is positioned within the internal space through the first opening, and the first opening is closed by the first cooling member by exposing the other surface of the first cooling member to outside of the case,
and wherein the second semiconductor module is mounted in the case, in a state where the second semiconductor element is positioned within the internal space through the second opening, and the second opening is closed by the second cooling member by exposing the other surface of the second cooling member to outside of the case.

5. The semiconductor control device according to claim 2, wherein the first semiconductor element and the second semiconductor element respectively have an identical configuration capable of realizing a high-side switching function and a low-side switching function,
and wherein the first cooling member and the second cooling member have an identical configuration, where the members are made of a same type of material and given an identical shape to each other.

6. The semiconductor control device according to claim 1, wherein the first semiconductor module includes, in addition to the semiconductor element, a drive circuit board that operates the semiconductor element, and a frame on which the semiconductor element and the drive circuit board are attached, while the second semiconductor module includes, in addition to the semiconductor element, a drive circuit board that operates the semiconductor element, and a frame on which the semiconductor element and the drive circuit board are attached,
wherein the circuit board is a control circuit board that controls each of operations of the semiconductor element of the first semiconductor module and the semiconductor element of the second semiconductor module,
and wherein each of the frame of the first semiconductor module and the frame of the second semiconductor module includes a plurality of positioning pins that are inserted with and position the drive circuit board of the first semiconductor module, the drive circuit board of the second semiconductor module, and the control circuit board.

7. The semiconductor control device according to claim 6, wherein the first semiconductor module and the second semiconductor module are positioned to be opposite to each other.

8. The semiconductor control device according to claim 6, wherein the plurality of positioning pins include positioning pins provided to correspond to diagonally opposite corners of the frame.

9. The semiconductor control device according to claim 6, wherein the plurality of positioning pins include positioning pins that correspond to four corners of the control circuit board and are inserted therethrough.

10. The semiconductor control device according to claim 1, further comprising:
a condenser that is electrically connected to each of the semiconductor element of the first semiconductor module and the semiconductor element of the second semiconductor module;
a resin case in which the first semiconductor module, the second semiconductor module, and the condenser are respectively mounted;
an input-side connecting conductor that electrically connects an input terminal of the semiconductor element and a connection terminal of the condenser; and
an output-side connecting conductor that electrically connects an output terminal of the semiconductor element and an external terminal
wherein each of the input-side connecting conductor and the output-side connecting conductor is integrally formed with the case and fixed to the case.

11. The semiconductor control device according to claim 10, wherein the condenser is integrally formed with the case and fixed to the case.

12. The semiconductor control device according to claim 10, further comprising:
a circuit board related to the semiconductor element; and
a connector electrically connected to the circuit board,
wherein the connector is integrally formed with the case and fixed to the case.

13. The semiconductor control device according to claim 10, wherein each of the input-side connecting conductor and the output-side connecting conductor is a block structure.