EX-10.3



 Exhibit 10.3 

EXECUTION VERSION 
  

 
 LOAN AND SECURITY AGREEMENT

 Dated as of July 13, 2018 
  

 
 AMKOR TECHNOLOGY SINGAPORE HOLDING
PTE. LTD., 
 and 

CERTAIN OF ITS SUBSIDIARIES OR AFFILIATES PARTY HERETO 

as Borrowers 
  

 
 BANK OF AMERICA, N.A.,

 as Agent 
  

 
 DBS BANK LTD., 

as Documentation Agent 
 and 

BANK OF AMERICA, N.A., 

as Sole Lead Arranger and Sole Bookrunner 
  

 








							
	 SECTION 1.
	 	         DEFINITIONS; RULES OF CONSTRUCTION
	  	 	1	 
			
	 1.1
	 	 Definitions
	  	 	1	 
			
	 1.2
	 	 Accounting Terms
	  	 	36	 
			
	 1.3
	 	 Uniform Commercial Code
	  	 	36	 
			
	 1.4
	 	 Certain Matters of Construction
	  	 	36	 
			
	 1.5
	 	 Currency Equivalents
	  	 	37	 
			
	 SECTION 2.
	 	         CREDIT FACILITIES
	  	 	38	 
			
	 2.1
	 	 Revolver Commitment
	  	 	38	 
			
	 2.2
	 	 Reserved
	  	 	40	 
			
	 2.3
	 	 Letter of Credit Facility
	  	 	40	 
			
	 SECTION 3.
	 	         INTEREST, FEES AND CHARGES
	  	 	43	 
			
	 3.1
	 	 Interest
	  	 	43	 
			
	 3.2
	 	 Fees
	  	 	45	 
			
	 3.3
	 	 Computation of Interest, Fees, Yield Protection
	  	 	45	 
			
	 3.4
	 	 Reimbursement Obligations
	  	 	45	 
			
	 3.5
	 	 Illegality
	  	 	46	 
			
	 3.6
	 	 Inability to Determine Rates
	  	 	46	 
			
	 3.7
	 	 Increased Costs; Capital Adequacy
	  	 	47	 
			
	 3.8
	 	 Mitigation
	  	 	49	 
			
	 3.9
	 	 Funding Losses
	  	 	49	 
			
	 3.10
	 	 Maximum Interest
	  	 	49	 
			
	 SECTION 4.
	 	         LOAN ADMINISTRATION
	  	 	49	 
			
	 4.1
	 	 Manner of Borrowing and Funding Revolver Loans
	  	 	49	 
			
	 4.2
	 	 Defaulting Lender
	  	 	51	 
			
	 4.3
	 	 Number and Amount of Interest Period Loans; Determination of Rate
	  	 	52	 
			
	 4.4
	 	 Borrower Agent
	  	 	52	 
			
	 4.5
	 	 One Obligation
	  	 	53	 
			
	 4.6
	 	 Effect of Termination
	  	 	53	 
			
	 SECTION 5.
	 	         PAYMENTS
	  	 	53	 
			
	 5.1
	 	 General Payment Provisions
	  	 	53	 
			
	 5.2
	 	 Repayment of Revolver Loans
	  	 	53	 
			
	 5.3
	 	 Reserved
	  	 	53	 
			
	 5.4
	 	 Payment of Other Obligations
	  	 	53	 









							
	 5.5
	 	 Marshaling; Payments Set Aside
	  	 	54	 
			
	 5.6
	 	 Application and Allocation of Payments
	  	 	54	 
			
	 5.7
	 	 Dominion Account
	  	 	55	 
			
	 5.8
	 	 Account Stated
	  	 	55	 
			
	 5.9
	 	 Taxes
	  	 	55	 
			
	 5.10
	 	 Lender Tax Information
	  	 	57	 
			
	 5.11
	 	 Nature and Extent of Each Borrower’s Liability
	  	 	59	 
			
	 SECTION 6.
	 	         CONDITIONS PRECEDENT
	  	 	62	 
			
	 6.1
	 	 Conditions Precedent to Initial Revolver Loans
	  	 	62	 
			
	 6.2
	 	 Conditions Precedent to All Credit Extensions
	  	 	64	 
			
	 SECTION 7.
	 	         COLLATERAL
	  	 	65	 
			
	 7.1
	 	 Grant of Security Interest
	  	 	65	 
			
	 7.2
	 	 Lien on Deposit Accounts; Cash Collateral
	  	 	66	 
			
	 7.3
	 	 Reserved
	  	 	66	 
			
	 7.4
	 	 Other Collateral
	  	 	66	 
			
	 7.5
	 	 Limitations
	  	 	67	 
			
	 7.6
	 	 Further Assurances
	  	 	67	 
			
	 7.7
	 	 Foreign Subsidiary Stock
	  	 	67	 
			
	 SECTION 8.
	 	         COLLATERAL ADMINISTRATION
	  	 	67	 
			
	 8.1
	 	 Borrowing Base Reports
	  	 	67	 
			
	 8.2
	 	 Accounts
	  	 	67	 
			
	 8.3
	 	 Inventory
	  	 	69	 
			
	 8.4
	 	 Equipment
	  	 	69	 
			
	 8.5
	 	 Deposit Accounts
	  	 	69	 
			
	 8.6
	 	 General Provisions
	  	 	70	 
			
	 8.7
	 	 Power of Attorney
	  	 	71	 
			
	 SECTION 9.
	 	         REPRESENTATIONS AND WARRANTIES
	  	 	72	 
			
	 9.1
	 	 General Representations and Warranties
	  	 	72	 
			
	 9.2
	 	 Complete Disclosure
	  	 	78	 
			
	 SECTION 10.
	 	         COVENANTS AND CONTINUING
AGREEMENTS
	  	 	78	 
			
	 10.1
	 	 Affirmative Covenants
	  	 	78	 
			
	 10.2
	 	 Negative Covenants
	  	 	83	 
			
	 10.3
	 	 Financial Covenants
	  	 	95	 









							
	 SECTION 11.
	 	         EVENTS OF DEFAULT; REMEDIES ON
DEFAULT
	  	 	95	 
			
	 11.1
	 	 Events of Default
	  	 	95	 
			
	 11.2
	 	 Remedies upon Default
	  	 	97	 
			
	 11.3
	 	 Right to Cure
	  	 	98	 
			
	 11.4
	 	 License
	  	 	99	 
			
	 11.5
	 	 Setoff
	  	 	99	 
			
	 11.6
	 	 Remedies Cumulative; No Waiver
	  	 	99	 
			
	 SECTION 12.
	 	         AGENT
	  	 	100	 
			
	 12.1
	 	 Appointment, Authority and Duties of Agent
	  	 	100	 
			
	 12.2
	 	 Agreements Regarding Collateral and Borrower Materials
	  	 	101	 
			
	 12.3
	 	 Action Upon Default
	  	 	102	 
			
	 12.4
	 	 Reliance By Agent
	  	 	102	 
			
	 12.5
	 	 Ratable Sharing
	  	 	102	 
			
	 12.6
	 	 Indemnification
	  	 	103	 
			
	 12.7
	 	 Limitation on Responsibilities of Agent
	  	 	103	 
			
	 12.8
	 	 Successor Agent and Co-Agents
	  	 	103	 
			
	 12.9
	 	 Due Diligence and Non-Reliance
	  	 	104	 
			
	 12.10
	 	 Remittance of Payments and Collections
	  	 	105	 
			
	 12.11
	 	 Individual Capacities
	  	 	105	 
			
	 12.12
	 	 Titles
	  	 	106	 
			
	 12.13
	 	 Bank Product Providers
	  	 	106	 
			
	 12.14
	 	 No Third Party Beneficiaries
	  	 	106	 
			
	 SECTION 13.
	 	         BENEFIT OF AGREEMENT; ASSIGNMENTS
	  	 	106	 
			
	 13.1
	 	 Successors and Assigns
	  	 	106	 
			
	 13.2
	 	 Participations
	  	 	106	 
			
	 13.3
	 	 Assignments
	  	 	107	 
			
	 13.4
	 	 Replacement of Certain Lenders
	  	 	109	 
			
	 SECTION 14.
	 	         MISCELLANEOUS
	  	 	109	 
			
	 14.1
	 	 Consents, Amendments and Waivers
	  	 	109	 
			
	 14.2
	 	 Indemnity
	  	 	110	 
			
	 14.3
	 	 Notices and Communications
	  	 	111	 
			
	 14.4
	 	 Performance of Borrowers’ Obligations
	  	 	112	 
			
	 14.5
	 	 Credit Inquiries
	  	 	112	 
			
	 14.6
	 	 Severability
	  	 	113	 









							
	 14.7
	 	 Cumulative Effect; Conflict of Terms
	  	 	113	 
			
	 14.8
	 	 Counterparts; Execution
	  	 	113	 
			
	 14.9
	 	 Entire Agreement
	  	 	113	 
			
	 14.10
	 	 Relationship with Lenders
	  	 	113	 
			
	 14.11
	 	 No Advisory or Fiduciary Responsibility
	  	 	113	 
			
	 14.12
	 	 Confidentiality
	  	 	114	 
			
	 14.13
	 	 Certifications Regarding Indentures
	  	 	115	 
			
	 14.14
	 	 GOVERNING LAW
	  	 	115	 
			
	 14.15
	 	 Consent to Forum; Bail-In of EEA Financial
Institutions
	  	 	115	 
			
	 14.16
	 	 Waivers by Borrowers
	  	 	116	 
			
	 14.17
	 	 Patriot Act Notice
	  	 	117	 
			
	 14.18
	 	 NO ORAL AGREEMENT
	  	 	117	 








 LIST OF EXHIBITS AND SCHEDULES 

 

			
	 Exhibit A
	  	 Assignment and Acceptance

	 Exhibit B
	  	 Assignment Notice

	 Exhibit C
	  	 Compliance Certificate

	 Exhibit D
	  	 Notice of Borrowing

		
	 Schedule 1.1
	  	 Revolver Commitments

	 Schedule 8.5
	  	 Deposit Accounts

	 Schedule 8.6.1
	  	 Locations of Collateral

	 Schedule 9.1.4
	  	 Capital Structure

	 Schedule 9.1.11
	  	 Intellectual Property

	 Schedule 9.1.14
	  	 Environmental Matters

	 Schedule 9.1.15
	  	 Burdensome Contracts

	 Schedule 9.1.16
	  	 Litigation

	 Schedule 9.1.18
	  	 ERISA

	 Schedule 9.1.12
	  	 Labor Relations

	 Schedule 9.1.21
	  	 Prior Names; Locations

	 Schedule 10.2.2
	  	 Existing Liens









 LOAN AND SECURITY AGREEMENT 

THIS LOAN AND SECURITY AGREEMENT is dated as of July 13, 2018, among AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., a
company incorporated under the laws of Singapore (“Amkor Singapore”) and other entities now or hereafter joined hereto as borrowers (together with Amkor Singapore, each a “Borrower” and collectively, the
“Borrowers”), the financial institutions (which are qualified licensed money lenders under the laws of Singapore) party to this Agreement from time to time as Lenders, and BANK OF AMERICA, N.A., a national banking association
(“Bank of America”), as agent for the Lenders (in such capacity, “Agent”). 
 R E C I T A L S:

 Borrowers have requested that Lenders provide a credit facility to Borrowers to finance their mutual and collective business
enterprise. Lenders are willing to provide the credit facility on the terms and conditions set forth in this Agreement. 
 NOW,
THEREFORE, for valuable consideration hereby acknowledged, the parties agree as follows: 
 SECTION 1.    DEFINITIONS; RULES OF
CONSTRUCTION 
 1.1    Definitions. As used herein, the following terms have the meanings
set forth below: 
 Account: with respect to any Person, any of such Person’s accounts receivable arising from the sale of goods
or supply of services, including the right to payment of any interest or other finance charges, late payment or delinquency charges and any extension or collection fees, and including all “accounts” as defined in the UCC, including all
rights to payment for goods sold or leased, or for services rendered. 
 Account Debtor Approved Countries: (i) any member state
of the European Union as of April 30, 2004, (ii) Australia, (iii) Hong Kong, (iv) New Zealand, (v) Norway, (vi) Singapore, and (vii) Switzerland, in each case, together with any state or province or territory thereof (as
applicable); provided, that during the continuance of a Triggered Activation Period, Agent may, in its Permitted Discretion and as a condition to such jurisdiction remaining an Account Debtor Approved Country, require that Borrowers provide local
law security documentation in respect of Accounts of Account Debtors organized outside of the jurisdiction of organization of such Borrowers to ensure that Agent has a duly perfected and enforceable Lien under the applicable law of such
jurisdiction. 
 Acquired Indebtedness: with respect to any specified Person (a) Debt of any other Person existing at the time
such other Person is merged with or into or became a Subsidiary of such specified Person, whether or not such Debt is incurred in connection with, or in contemplation of, such other Person merging with or into, or becoming a Subsidiary of, such
specified Person and (b) Debt secured by a Lien encumbering any asset acquired by such specified Person. 

  
 1 








 Affiliate: with respect to a specified Person, any other Person that directly, or
indirectly through intermediaries, Controls, is Controlled by or is under common Control with the specified Person. Neither Agent nor any Lender or any of their respective Affiliates shall be considered an Affiliate of Parent or any Subsidiary
thereof. 
 Agent: as defined in the recitals. 

Agent Indemnitees: Agent and its officers, directors, employees, Affiliates, agents and attorneys. 

Agent Professionals: attorneys, accountants, appraisers, auditors, business valuation experts, environmental engineers or consultants,
turnaround consultants, and other professionals and experts retained by Agent. 
 Agreement Currency: as defined in
Section 1.5. 
 Allocable Amount: as defined in Section 5.11.3. 

Amkor Singapore: as defined in the recitals. 

Anti-Terrorism Law: any law relating to terrorism or money laundering, including the Patriot Act. 

Applicable Law: all laws, rules, regulations and governmental guidelines applicable to the Person or matter in question, including
statutory law, common law and equitable principles, as well as provisions of constitutions, treaties, statutes, rules, regulations, orders and decrees of Governmental Authorities. 

Applicable Margin: the margin set forth below, as determined by the Average Availability calculated for Borrower for the preceding
completed Fiscal Quarter of Borrower: 
  

											
	 Level
	  	 Average Availability

for preceding

completed Fiscal

Quarter
	  	Base Rate
Revolver
Loans	 	 	Interest Period Loans
and Singapore Base
Rate Revolver Loans	 
	 I
	  	Less than $50,000,000	  	 	0.75	% 	 	 	1.75	% 
	 II
	  	Greater than or equal to $50,000,000 and equal to or less than $100,000,000	  	 	0.50	% 	 	 	1.50	% 
	 III
	  	Greater than $100,000,000	  	 	0.25	% 	 	 	1.25	% 

 Until September 30, 2018, the above margins shall be determined based on Level II. Thereafter, margins shall be subject
to increase or decrease by Agent on the first day of the calendar month following each Fiscal Quarter end. If Agent is unable to calculate Average Availability for a Fiscal Quarter due to Borrowers’ failure to deliver any Borrowing Base Report
when required hereunder, then, at the option of Agent or Required Lenders, the Applicable Margin shall be determined as if Level III were applicable until the first day of the calendar month following its receipt. 

  
 2 








 Approved Fund: any Person (other than a natural Person) that is owned or Controlled by a
Lender or Affiliate of a Lender, and is engaged in making or investing in commercial loans in its ordinary course of activities. 
 Asset
Sale: as defined in Section 10.2.5. 
 Assignment and Acceptance: an assignment agreement between a
Lender and Eligible Assignee, in the form of Exhibit A or in such other form as is reasonably satisfactory to Agent. 

Attributable Debt: in respect of a sale and leaseback transaction involving an operating lease, at the time of determination, the
present value of the obligation of the lessee for net rental payments during the remaining term of the lease included in such sale and leaseback transaction including any period for which such lease has been extended or may, at the option of the
lessor, be extended. Such present value shall be calculated using a discount rate equal to the rate of interest implicit in such transaction, determined in accordance with GAAP. 

Available Currency: Dollars, Singapore Dollars and any other currency approved by Agent and Lenders in their sole discretion. 

Availability: the Borrowing Base minus Revolver Usage. 

Availability Reserve: the sum (without duplication) of (a) the Rent and Charges Reserve; (b) [Reserved]; (c) the aggregate amount
of liabilities secured by Liens upon Collateral that are or may be senior to Agent’s Liens (but imposition of any such reserve shall not waive an Event of Default arising therefrom); (d) the Dilution Reserve; and (e) such additional
reserves, in such amounts and with respect to such matters, as Agent in its Permitted Discretion may elect to impose from time to time. 

Average Availability: for any period of a completed Fiscal Quarter, the average of the daily amount of Availability for such period,
provided, that solely for purposes of calculating the Applicable Margin, Average Availability shall be determined without reference to clause (a) of the definition of Borrowing Base. 

Bail-In Action: the exercise of any Write-Down and Conversion Powers by the applicable EEA
Resolution Authority in respect of any liability of an EEA Financial Institution. 
 Bail-In
Legislation: with respect to any EEA Member Country implementing Article 55 of Directive 2014/59/EU of the European Parliament and of the Council of the European Union, the implementing law for such EEA Member Country from time to time which is
described in the EU Bail-In Legislation Schedule. 
 Bank of America: as defined in the
recitals. 
 Bank of America Indemnitees: Bank of America and its officers, directors, employees, Affiliates, agents and attorneys.

 Bank Product: any of the following products or services extended to Parent or a Subsidiary of Parent by a Lender or any of its
Affiliates: (a) Cash Management Services; (b) products under Hedging Agreements; (c) commercial credit card and merchant card services; and (d) leases and other banking products or services, other than Letters of Credit. 

  
 3 








 Bankruptcy Code: Title 11 of the United States Code. 

Base Rate: a per annum rate equal to the sum of (a) the LIBOR for a 1 month interest period as in effect on the first day of the
current calendar month, and (b) 1.00%; provided that if the Base Rate shall be less than 0%, such rate shall be deemed to be 0% for purposes of this Agreement. 

Base Rate Revolver Loan: a Revolver Loan that bears interest based on the Base Rate. 

Beneficial Owner: as assigned to such term in Rule 13d-3 and Rule 13d-5 under the Exchange Act. 
 Beneficial Ownership Certificate: each certificate regarding
beneficial ownership required by the Beneficial Ownership Regulation, which certification shall be substantially similar in form and substance to the form of Certification Regarding Beneficial Owners of Legal Entity Customers published jointly, in
May 2018, by the Loan Syndications and Trading Association and Securities Industry and Financial Markets Association. 
 Beneficial
Ownership Regulation: 31 C.F.R. § 1010.230. 
 Board of Governors: the Board of Governors of the Federal Reserve System.

 Borrowed Money: with respect to any Person, without duplication, its (a) debt that (i) arises from the lending of money
to such Person or (ii) is evidenced by notes, drafts, bonds, debentures, credit documents or similar instruments; and (b) the capitalized amount of any Capital Leases, in each case, if and to the extent such obligation would appear as a
liability on a balance sheet of such Person prepared in accordance with GAAP. 
 Borrower: as defined in the recitals. 

Borrower Agent: as defined in Section 4.4. 

Borrower Materials: Borrowing Base Reports, Compliance Certificates and other information, reports, financial statements and other
materials delivered by Borrowers hereunder. 
 Borrowing: a group of Revolver Loans that are made or converted together on the same
day and have the same interest option and, if applicable, Interest Period. 
 Borrowing Base: on any date of determination, subject
to the restrictions in Section 4.09 of each of the Senior Notes Indentures as in effect on the Closing Date, an amount equal to the lesser of (a) the aggregate amount of Revolver Commitments, or (b) the result of (i) up to 85.0%
of the Value of Eligible Accounts and Eligible Foreign Accounts, minus (ii) Availability Reserves. 
 Borrowing Base Report: a
report of the Borrowing Base, in form and substance satisfactory to Agent. 

  
 4 








 Business Day: any day other than a Saturday, Sunday or other day on which commercial banks
are authorized to close under the laws of, or are in fact closed in, the State of North Carolina, the State of California, Hong Kong or Singapore and if such day relates to an Interest Period Loan, any such day on which dealings in applicable
Available Currency deposits are conducted in the London interbank market. 
 Capital Expenditures: for any period, expenditures made
by a Borrower or Subsidiary during such period that, in accordance with GAAP, are or should be included in “additions to property, plant or equipment” or similar items reflected in the consolidated statement of cash flows of Borrower and
its Subsidiaries; provided, that Capital Expenditures shall not include any such expenditures that are: (a) made with Net Proceeds of an Asset Sale, insurance proceeds or condemnation awards; (b) made with the proceeds of any contribution
of capital to Parent or sale or issuance by Parent of Equity Interests which are substantially contemporaneously used for the making of such Capital Expenditure; (c) financed with Borrowed Money other than Revolver Loans; or (d) Strategic
Investments or incurred by any Person acquired in any Strategic Investment prior to (but not in anticipation of) the closing of such Strategic Investment. 

Capital Lease: any lease that is required to be capitalized for financial reporting purposes in accordance with GAAP. 

Cash Collateral: cash delivered to Agent to Cash Collateralize any Obligations, and all interest, dividends, earnings and other
proceeds relating thereto. 
 Cash Collateralize: the delivery of cash to Agent, as security for the payment of Obligations, in an
amount equal to (a) with respect to LC Obligations, 103% of the aggregate LC Obligations, and (b) with respect to any inchoate, contingent or other Obligations (including Secured Bank Product Obligations), Agent’s good faith estimate
of the amount due or to become due, including fees, expenses and indemnification hereunder. “Cash Collateralization” has a correlative meaning. 

Cash Equivalents: (a) Dollars or currency of any other sovereign nation in which Obligors or any Subsidiary conducts business;
(b) marketable obligations issued or unconditionally guaranteed by, and backed by the full faith and credit of, the U.S. government, maturing within 12 months of the date of acquisition; (c) certificates of deposit, time deposits and
bankers’ acceptances maturing within 12 months of the date of acquisition, and overnight bank deposits, in each case which are issued by Bank of America or a commercial bank organized under the laws of the United States or any state or district
thereof, rated A-1 (or better) by S&P or P-1 (or better) by Moody’s at the time of acquisition, and (unless issued by a Lender) not subject to offset rights;
(d) repurchase obligations with a term of not more than 30 days for underlying investments of the types described in clauses (b) and (c) entered into with any bank described in clause (c); (e) commercial paper issued by Bank of America or
rated A-1 (or better) by S&P or P-1 (or better) by Moody’s, and maturing within nine months of the date of acquisition; (f) shares of any money market fund
that has substantially all of its assets invested continuously in the types of investments referred to above, has net assets of at least $500,000,000 and has the highest rating obtainable from either Moody’s or S&P; and (g) in the case
of any Obligor that is not organized in the U.S., other short-term investments that are analogous to the foregoing, are of comparable credit quality and are customarily used by companies in the jurisdiction of such Obligor for cash management
purposes. 

  
 5 








 Cash Management Services: services relating to operating, collections, payroll, trust, or
other depository or disbursement accounts, including automated clearinghouse, e-payable, electronic funds transfer, wire transfer, controlled disbursement, overdraft, depository, information reporting, lockbox
and stop payment services. 
 CERCLA: the Comprehensive Environmental Response Compensation and Liability Act (42 U.S.C. § 9601
et seq.). 
 Change in Law: the occurrence, after the date hereof, of (a) the adoption, taking effect or phasing
in of any law, rule, regulation or treaty; (b) any change in any law, rule, regulation or treaty or in the administration, interpretation or application thereof; or (c) the making, issuance or application of any request, guideline,
requirement or directive (whether or not having the force of law) by any Governmental Authority; provided, that “Change in Law” shall include, regardless of the date enacted, adopted or issued, provided, (i) the Dodd-Frank Wall
Street Reform and Consumer Protection Act, and all rules, regulations, guidelines or directives thereunder or issued in connection therewith and (ii) all requests, rules, guidelines or directives promulgated by the Bank for International
Settlements, the Basel Committee on Banking Supervision (or any successor or similar authority) or the U.S. or foreign regulatory authorities, in each case pursuant to Basel III, shall be deemed to be a “Change in Law”, regardless of the
date enacted, adopted, promulgated or issued, but only to the extent such rules, regulations, or published interpretations or directives are applied to Parent and its Subsidiaries by Agent or any Lender in substantially the same manner as applied to
other similarly situated borrowers under comparable syndicated credit facilities. 
 Change of Control: the occurrence of any of the
following: (a) the adoption of a plan relating to the liquidation or dissolution of Parent or any Borrower, (b) the consummation of any transaction (including, without limitation, any merger or consolidation) the result of which is that
any Person, other than a Permitted Holder, becomes the Beneficial Owner, directly or indirectly, of more than 35.0% of the Voting Stock of Parent, measured by voting power rather than number of shares, and such percentage represents more than the
aggregate percentage of the Voting Stock of Parent, measured by voting power rather than number of shares, as to which any Permitted Holder is the Beneficial Owner, or (c) Parent fails to own and control, directly or indirectly, 100% of all
Equity Interests in each Borrower. For purposes of this definition, any transfer of an Equity Interest of any Person that was formed for the purpose of acquiring Voting Stock of Parent will be deemed to be a transfer of such portion of Voting Stock
as corresponds to the portion of the equity of such Person that has been so transferred. Notwithstanding the foregoing, if at any time Parent is a direct or indirect wholly-owned subsidiary of one or more entities (each, a “Holding
Company”), references to “Parent” in clause (a) and (b) of this definition will be deemed to be references to that Holding Company which is not a subsidiary of any other Holding Company, for so long as Parent remains
wholly-owned, directly or indirectly, by such Holding Company. 
 Claims: all claims, liabilities, obligations, losses, damages,
penalties, judgments, proceedings, interest, costs and expenses of any kind (including remedial response costs, reasonable attorneys’ fees and Extraordinary Expenses) at any time (including after Full Payment of the Obligations or replacement
of Agent or any Lender) incurred by any Indemnitee or asserted against any Indemnitee by any Obligor or other Person, in any way relating to (a) any Revolver Loans, Letters of Credit, Loan Documents, Borrower Materials, or the use thereof or
transactions 

  
 6 








 
relating thereto, (b) any action taken or omitted in connection with any Loan Documents, (c) the existence or perfection of any Liens, or realization upon any Collateral,
(d) exercise of any rights or remedies under any Loan Documents or Applicable Law, or (e) failure by any Obligor to perform or observe any terms of any Loan Document, in each case including all costs and expenses relating to any
investigation, litigation, arbitration or other proceeding (including an Insolvency Proceeding or appellate proceedings), whether or not the applicable Indemnitee is a party thereto. 

Closing Date: as defined in Section 6.1. 

Code: the Internal Revenue Code of 1986. 

Collateral: all Property described in Section 7.1 (excluding, for the avoidance of doubt, any Excluded
Property), all Property described in any Security Documents as security for any Obligations, and all other Property that now or hereafter secures (or is intended to secure) any Obligations. 

Commitment Termination Date: the earliest to occur of (a) the Revolver Termination Date; (b) the date on which Borrowers
terminate the Revolver Commitments pursuant to Section 2.1.4; or (c) the date on which the Revolver Commitments are terminated pursuant to Section 11.2. 

Commodity Exchange Act: the Commodity Exchange Act (7 U.S.C. § 1 et seq.). 

Competitor: (a) any competitor of Parent or its Subsidiaries that is in the same or substantially similar line of business as
Parent or any of its Subsidiaries and (b) any customer or supplier of Parent or any of its Subsidiaries (other than any customer or supplier that is a bank, financial institution, other institutional lender or an Affiliate thereof. 

Compliance Certificate: a certificate, substantially in the form of Exhibit C or in such other form as is reasonably
satisfactory to Agent. 
 Connection Income Taxes: Other Connection Taxes that are imposed on or measured by net income (however
denominated), or are franchise or branch profits Taxes. 
 Consolidated Cash Flow: with respect to Parent and its Subsidiaries for
any period, the Consolidated Net Income for such period, plus (a) an amount equal to any extraordinary loss, plus any net loss realized in connection with an Asset Sale, to the extent such losses were deducted in computing such Consolidated Net
Income, plus (b) provision for taxes based on income or profits of such Person and its Subsidiaries for such period, to the extent that such provision for taxes was deducted in computing such Consolidated Net Income, plus (c) consolidated
interest expense of Parent and its Subsidiaries for such period, whether paid or accrued and whether or not capitalized (including, without limitation, amortization of debt issuance costs and original issue discount,
non-cash interest payments, the interest component of any deferred payment obligations, the interest component of all payments associated with Capital Leases, imputed interest with respect to Attributable
Debt, commissions, discounts, and other fees and charges incurred in respect of letter of credit or bankers’ acceptance financings, and net payments, if any, pursuant to Hedging Agreements), to the extent that any such expense was deducted in
computing such Consolidated Net Income, plus (d) depreciation, amortization (including amortization of goodwill and other intangibles but excluding amortization of prepaid cash expenses that were paid in a prior period),


  
 7 








 
and other non-cash expenses (excluding any such non-cash expense to the extent that it represents an accrual of or
reserve for cash expenses in any future period or amortization of a prepaid cash expense that was paid in a prior period) of Parent and its Subsidiaries for such period to the extent that such depreciation, amortization, and other non-cash expenses were deducted in computing such Consolidated Net Income, plus (e) non-cash items (other than any non-cash items
that will require cash payments in the future or that relate to foreign currency translation) decreasing such Consolidated Net Income for such period, other than items that were accrued in the ordinary course of business, in each case, on a
consolidated basis and determined in accordance with GAAP, minus (f) non-cash items (other than any non-cash items that will require cash payments in the future or
that relate to foreign currency translation) increasing such Consolidated Net Income for such period, other than items that were accrued in the ordinary course of business, in each case, on a consolidated basis and determined in accordance with
GAAP. Notwithstanding the foregoing, the provision for taxes based on the income or profits of, and the depreciation and amortization and other non-cash charges of, a Subsidiary of Parent shall be added to
Consolidated Net Income to compute Consolidated Cash Flow of Parent only to the extent that a corresponding amount would be permitted at the date of determination to be dividended to Parent by such Subsidiary without prior governmental approval
(that has not been obtained), or pursuant to the terms of its charter and all agreements, instruments, judgments, decrees, orders, statutes, rules, and governmental regulations applicable to that Subsidiary or its stockholders, unless such
restriction with respect to the payment of dividends or other payments has been legally waived; provided, however, that Consolidated Net Income shall be increased by the amount of dividends or other payments actually paid in cash (or to the extent
converted into cash) to Parent or a Subsidiary of Parent in respect of such period, to the extent not already included therein. 

Consolidated Net Assets: with respect to any specified Person as of any date, the total assets of such Person as of such date less
(a) the total liabilities of such Person as of such date, (b) the amount of any Disqualified Stock as of such date, and (c) any minority interests reflected on the balance sheet of such Person as of such date. 

Consolidated Net Income: the aggregate of the Net Income of Parent and its Subsidiaries for such period, on a consolidated basis,
determined in accordance with GAAP; provided that: (a) the Net Income of any Person that is not a Subsidiary or that is accounted for by the equity method of accounting shall be included only to the extent of the amount of dividends or
distributions paid in cash to the specified Person or a Subsidiary thereof (and if such Net Income is a loss it shall be included only to the extent that such loss has been funded with cash by the specified Person or a Subsidiary of the specified
Person), (b) the Net Income of any Subsidiary shall be excluded to the extent that the declaration or payment of dividends or similar distributions by that Subsidiary of that Net Income is not at the date of determination permitted without any prior
governmental approval (that has not been obtained) or, directly or indirectly, by operation of the terms of its charter or any agreement, instrument, judgment, decree, order, statute, rule or governmental regulation applicable to that Subsidiary or
its stockholders, unless such restriction with respect to the payment of dividends or other distributions has been legally waived, (c) the Net Income of any Subsidiary shall be excluded if not distributed to the specified Person or one of its
Subsidiaries, (d) the cumulative effect of a change in accounting principles shall be excluded, (e) non-cash compensation charges or other non-cash expenses or
charges arising from the grant or issuance or repricing of stock, stock options or other equity-based awards to the directors, officers and employees of Parent and its Subsidiaries shall be excluded, (f) any impairment charge or asset


  
 8 








 
write-off under GAAP and the amortization of intangibles arising under GAAP shall be excluded, (g) any increase in amortization or depreciation or
other non-cash charges resulting from any application of purchase accounting in relation to any acquisition and adjustments related to purchase accounting in connection with an acquisition, including fair
value measurements of acquired assets and liabilities in accordance with GAAP, net of taxes, shall be excluded, (h) any unrealized gains and losses related to fluctuations in currency exchange rates for such period shall be excluded, and
(i) any gains and losses from any early extinguishment of Debt shall be excluded. 
 Contingent Obligation: any obligation of a
Person arising from a guaranty, indemnity or other assurance of payment or performance of any Debt, lease, dividend or other obligation (“primary obligations”) of another obligor (“primary obligor”) in any manner,
whether directly or indirectly, including any obligation of such Person under any (a) guaranty, endorsement, co-making or sale with recourse of an obligation of a primary obligor; (b) obligation to
make take-or-pay or similar payments regardless of nonperformance by any other party to an agreement; and (c) arrangement (i) to purchase any primary obligation or
security therefor, (ii) to supply funds for the purchase or payment of any primary obligation, (iii) to maintain or assure working capital, equity capital, net worth or solvency of the primary obligor, (iv) to purchase Property or
services for the purpose of assuring the ability of the primary obligor to perform a primary obligation, or (v) otherwise to assure or hold harmless the holder of any primary obligation against loss in respect thereof. The amount of any
Contingent Obligation shall be deemed to be the lesser of (x) the stated or determinable amount of the primary obligation, (y) the maximum amount for which such Person may be liable under the instrument evidencing the Contingent Obligation
and (z) if recourse is limited to a specific asset, the fair market value of such asset; provided, that if none of the foregoing are determinable, the maximum reasonably anticipated liability with respect thereto. 

Control: possession, directly or indirectly, of the power to direct or cause direction of a Person’s management or policies,
whether through the ability to exercise voting power, by contract or otherwise. 
 Credit Facilities: with respect to any Obligor,
one or more debt facilities or commercial paper facilities with banks or other institutional lenders providing for revolving credit loans, term loans, notes, receivables financing (including through the sale of receivables to such lenders or to
special purpose entities formed to borrow from such lenders against such receivables) or letters of credit, in each case, as amended, restated, modified, renewed, refunded, replaced or refinanced in whole or in part from time to time. 

Cure Period: as defined in Section 11.3.1. 

Cure Right: as defined in Section 11.3.1. 

CWA: the Clean Water Act (33 U.S.C. §§1251 et seq.). 

Debt: with respect to any Person and without duplication, any indebtedness of such Person, including Contingent Obligations, in respect
of (a) Borrowed Money, (b) letters of credit or reimbursement obligations in respect thereof, (c) banker’s acceptances, (d) the balance deferred and unpaid of the purchase price of any Property, except any such balance that
constitutes an accrued expense or trade payable, and (e) obligations under Hedging Agreements, if and to the 

  
 9 








 
extent any of such indebtedness (other than letters of credit and obligations under Hedging Agreements) would appear as a liability on a balance sheet of the specified Person prepared in
accordance with GAAP. In addition, the term “Debt” includes all Debt of others secured by a Lien on any asset of the specified Person (whether or not such Debt is assumed by the specified Person measured as the lesser of the fair market
value of the assets of such Person so secured or the amount of such Debt) and, to the extent not otherwise included, the guarantee by such Person of any Debt of any other Person. The amount of any Debt outstanding as of any date shall be the
accreted value thereof, in the case of any Debt issued with original issue discount. In addition, the amount of any Debt shall also include the amount of all obligations of such Person with respect to the redemption, repayment or other repurchase of
any Disqualified Stock or, with respect to any Subsidiary of Parent, any preferred stock of such Subsidiary. 
 Default: an event or
condition that, with the lapse of time or giving of notice, would constitute an Event of Default. 
 Default Rate: for any Obligation
(including, to the extent permitted by Applicable Law, interest not paid when due), 2% plus the interest rate otherwise applicable thereto. 

Defaulting Lender: any Lender that (a) has failed to comply with its funding obligations hereunder (unless such Lender notifies
Agent in writing that such failure is the result of such Lender’s good faith determination that a condition precedent to funding (specifically identified in such writing, including, if applicable, by reference to a specific Event of Default)
has not been satisfied), and such failure is not cured within two Business Days; (b) has notified Agent or any Borrower that such Lender does not intend to comply with its funding obligations hereunder or under any other credit facility, or has
made a public statement to that effect (unless such notification or public statement indicates that such position is based on such Lender’s good-faith determination that a condition precedent (specifically identified in such writing, including,
if applicable, by reference to a specific Event of Default) to funding a loan cannot be satisfied) or; (c) has failed, within three Business Days following request by Agent or any Borrower, to confirm in a manner reasonably satisfactory to
Agent and Borrowers that such Lender will comply with its funding obligations hereunder; or (d) has, or has a direct or indirect parent company that has, become the subject of an Insolvency Proceeding (including reorganization, liquidation, or
appointment of a receiver, custodian, administrator or similar Person by the Federal Deposit Insurance Corporation or any other regulatory authority) or Bail-In Action; provided, that a Lender shall not
be a Defaulting Lender solely by virtue of a Governmental Authority’s ownership of an equity interest in such Lender or parent company unless the ownership provides immunity for such Lender from jurisdiction of courts within the United States
or from enforcement of judgments or writs of attachment on its assets, or permits such Lender or Governmental Authority to repudiate or otherwise to reject such Lender’s agreements. 

Deposit Account Control Agreement: an agreement, in form and substance reasonably satisfactory to Agent, between Agent and a depository
institution which maintains a Deposit Account for an Obligor, which establishes control of such Deposit Account for purposes of perfection of Agent’s Lien in such Deposit Account and the funds held therein. 

Designated Jurisdiction: a country or territory that is the target of a Sanction. 

  
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 Dilution Percent: the percent, determined for Borrowers’ most recent Fiscal Quarter,
equal to (a) bad debt write-downs or write-offs, discounts, returns, promotions, credits, credit memos and other dilutive items with respect to Accounts, divided by (b) gross sales. 

Dilution Reserve: an amount equal to 1.0% of the sum of the Value of Eligible Accounts and Eligible Foreign Accounts for each
percentage point (or portion thereof) that the Dilution Percent exceeds 5.0%. 
 Distribution: any (a) declaration or payment of
a distribution, interest or dividend on any Equity Interest (other than payment-in-kind); or (b) purchase, redemption, or other acquisition or retirement for value
of any Equity Interest. 
 Disqualified Institution: (a) any bank, financial institution, institutional lender or other Person
and Affiliates of the foregoing identified in writing by Borrower Agent to Agent (and provided to the Lenders by Agent) on or prior to the Closing Date, (b) any Competitor and/or any Affiliate of a Competitor identified in writing by Borrower
Agent to Agent on or prior to the Closing Date, and (c) any known Affiliate of any Person referred to in clauses (a) or (b) above that is readily identifiable as such on the basis of such Affiliate’s name; provided that
Borrower Agent, upon notice to Agent (which notice shall be provided to the Lenders by Agent) and with Agent’s consent (not to be unreasonably withheld or delayed), shall be permitted to supplement in writing the list of Persons that are
Disqualified Institutions pursuant to clauses (a) and (b); provided further that any such supplement shall not apply retroactively to disqualify any Persons that have previously acquired an assignment or participation interest in the
Revolver Loans and/or Revolver Commitments. 
 Disqualified Stock: any Equity Interest that, by its terms (or by the terms of any
security into which it is convertible, or for which it is exchangeable, in each case at the option of the holder thereof), or upon the happening of any event, matures or is mandatorily redeemable, pursuant to a sinking fund obligation or otherwise,
or redeemable at the option of the holder thereof, in whole or in part, on or prior to the date that is 91 days after the Termination Date. Notwithstanding the preceding sentence, any Equity Interest that would constitute Disqualified Stock solely
because the holders thereof have the right to require Parent to repurchase such Equity Interest upon the occurrence of a change of control or an asset sale shall not constitute Disqualified Stock if the terms of such Equity Interest provide that
Parent may not repurchase or redeem any such Equity Interest pursuant to such provisions unless such repurchase or redemption complies with Section 10.2.2. 

Dollars: lawful money of the United States. 

Domestic Subsidiary: – a Subsidiary of Parent that is (a) formed under the laws of the U.S. or a state or territory thereof
or (b) as of the date of determination, treated as a domestic entity or a partnership or a division of a domestic entity for U.S. federal income tax purposes. 

Dominion Account: a special account established by Borrowers at Bank of America or another bank acceptable to Agent, over which Agent
has exclusive control for withdrawal purposes. 

  
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 EEA Financial Institution: (a) any credit institution or investment firm established
in an EEA Member Country that is subject to the supervision of an EEA Resolution Authority; (b) any entity established in an EEA Member Country that is a parent of an institution described in clause (a) above; or (c) any financial
institution established in an EEA Member Country that is a subsidiary of an institution described in the foregoing clauses and is subject to consolidated supervision with its parent. 

EEA Member Country: any of the member states of the European Union, Iceland, Liechtenstein and Norway. 

EEA Resolution Authority: any public administrative authority or any Person entrusted with public administrative authority of an EEA
Member Country (including any delegee) having responsibility for the resolution of any EEA Financial Institution. 
 Eligible
Account: an Account owing to a Borrower (or during the 120 day period immediately after the Closing Date, Parent) that arises in the Ordinary Course of Business from the sale of goods or rendition of services, is payable in Dollars
and is deemed by Agent, in its Permitted Discretion, to be an Eligible Account. Without limiting the foregoing, no Account shall be an Eligible Account if (a) it is unpaid for more than 60 days after the original due date, or more than 90 days
after the original invoice date, (b) 50.0% or more of the Accounts owing by the Account Debtor are not Eligible Accounts or Eligible Foreign Accounts under any other provision of this definition or the definition of Eligible Foreign Accounts,
(c) when aggregated with other Accounts owing by the Account Debtor and its Affiliates, it exceeds (i) in the case of Broadcom at 25.0%, Intel at 25.0%, ST Microelectronics at 25.0%, and Qualcomm at 30.0% (in each case, together with their
respective subsidiaries), in each case, of the aggregate Eligible Accounts and Eligible Foreign Accounts and (ii) in the case of any other Account Debtor, 15.0% of the aggregate Eligible Accounts and Eligible Foreign Accounts (or, in either
such case, (A) such higher percentage with the consent of the Required Lenders or (B) lesser percent as Agent may determine in its discretion, as Agent may establish for any such Account Debtor and its Affiliates from time to time), (d) it
does not conform with a covenant or representation herein, (e) it is owing by a creditor or supplier, or is otherwise subject to a offset, counterclaim, dispute, deduction, discount, recoupment, reserve, defense, chargeback, credit, or
allowance (but ineligibility shall be limited to the amount thereof), (f) an Insolvency Proceeding has been commenced by or against the Account Debtor, or the Account Debtor has failed, has suspended, or ceased doing business, is liquidating,
dissolving, or winding up its affairs, or is not Solvent, or is subject to any Sanction or on any specially designated nationals list maintained by OFAC or any Borrower or Parent, as applicable, is not able to bring suit or enforce remedies against
the Account Debtor through judicial process, (g) the Account Debtor is organized or has its principal offices or assets outside the United States or Canada, (h) it is owing by a Government Authority, (i) it is not subject to a duly
perfected, first priority Lien in favor of Agent, or is subject to any other Lien (except a Permitted Accounts Lien), (j) (i) the goods giving rise to it have not been delivered to and accepted by the Account Debtor, or (ii) the services
giving rise to it have not been accepted by the Account Debtor or it otherwise does not represent a final sale, unless, (A) in the case of clause (j)(i) preceding, the Account Debtor on such Account has instructed such Borrower or Parent, as
applicable, in writing to deliver such goods to a designated area at or near such Borrower’s or Parent’s facility, as applicable, or otherwise store such goods for the account of such Account Debtor and has agreed, pursuant to the terms of
the quotation or purchase order for such Account or by separate agreement, that such 

  
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delivery or storage constitutes delivery of such goods by such Borrower or Parent, as applicable, or (B) in the case of clause (j)(ii) preceding, such Borrower or Parent, as applicable, has
delivered to Agent a written agreement signed by the Account Debtor on such Account authorizing such Borrower or Parent, as applicable, to bill for such goods or services, agreeing to pay the invoice for such billing and agreeing not to assert
claims or defenses to payment thereof that might arise with respect to any assembly, test or other services performed or to be performed by a Borrower or Parent, as applicable, or any Affiliate of a Borrower or Parent with respect to such goods
after the time of such billing and prior to the time of final shipment to the Account Debtor, in any such case in form and substance reasonably satisfactory to Agent, (k) it is evidenced by Chattel Paper or an Instrument of any kind, or has
been reduced to judgment, (l) its payment has been extended, the Account Debtor has made a partial payment, or it arises from a sale on a cash-on-delivery basis,
(m) it arises from a sale to an Affiliate, or from a sale on a bill-and-hold, guaranteed sale,
sale-or-return, sale-on-approval, consignment, or other repurchase or return basis,
unless, in the case of any such bill-and-hold arrangement, the Account Debtor on such Account has instructed such Borrower or Parent, as applicable, to deliver such
goods to a designated area at or near such Borrower’s or Parent’s facility, as applicable, or otherwise store such goods for the account of such Account Debtor and has agreed, in the purchase order for such Account or by separate
agreement, that such delivery or storage constitutes delivery of such goods by such Borrower or Parent, as applicable, in any such case in form and substance reasonably satisfactory to Agent, (n) it represents a progress billing or retainage,
unless, in the case of a progress billing arrangement, such Borrower or Parent, as applicable, has delivered to Agent a written agreement signed by the Account Debtor on such Account authorizing such Borrower or Parent, as applicable, to progress
bill for such goods or services, agreeing to pay the invoice for such billing and agreeing not to assert claims or defenses to payment thereof, in any such case in form and substance reasonably satisfactory to Agent, (o) it includes a billing
for interest, fees, or late charges, but ineligibility shall be limited to the extent of such billing, or (p) it arises from a retail sale to a Person who is purchasing for personal, family, or household purposes. 

Eligible Assignee: a Person (other than a Disqualified Institution) that is (a) a Lender, Affiliate of a Lender or Approved Fund;
(b) any other financial institution approved by Borrower Agent (which approval shall not be unreasonably withheld or delayed, and shall be deemed given if no objection is made within 10 Business Days after notice of the proposed assignment)
that extends asset-based lending facilities in its ordinary course of business; or (c) during an Event of Default under Section 11.1(a) (solely with respect to principal and interest payments) or
Section 11.1(j), any Person acceptable to Agent in its discretion. 
 Eligible Foreign Account: an Account
owing to a Borrower (or during the 120 day period immediately after the Closing Date, Parent) from an Account Debtor that is organized or has its principal offices or assets outside the United States or Canada, that (a) arises in the Ordinary
Course of Business from the sale of goods or rendition of services, (b) is payable in Dollars, (c) is owing from an Account Debtor that is organized or has its principal offices in an Account Debtor Approved Country, (d) is owing from
an Account Debtor that is organized or has its principal offices outside of an Account Debtor Approved Country; provided that such Account Debtor is a subsidiary of a parent company that is organized and has its principal offices within the
United States and such parent company has an investment grade debt rating of BBB- or better by S&P or Baa3 or better by Moody’s; provided, further that the Accounts owing from Account Debtors
and their Affiliates under this clause (d) when aggregated with other Accounts owing by other Account 

  
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Debtors and their respective Affiliated under this clause (d) shall not exceed 20% of the sum of all Eligible Accounts and all Eligible Foreign Accounts, (e) is owing from an Account
Debtor that is organized or has its principal offices outside of an Account Debtor Approved Country which is not deemed to be an Eligible Foreign Account under clause (d) above but is deemed to be an Eligible Foreign Account by Agent in its
Permitted Discretion; provided that such Account Debtor is a subsidiary of a parent company that is organized and has its principal offices within the United States; provided, further that the Accounts owing from Account Debtors and
their Affiliates under this clause (e) when aggregated with other Accounts owing by other Account Debtors and their respective Affiliated under this clause (e) shall not exceed 6% of the sum of all Eligible Accounts and all Eligible
Foreign Accounts and (f) meets all of the requirements in clause (a) through clause (p) of the definition of Eligible Accounts other than clause (g) thereof. 

Enforcement Action: any action to enforce any Obligations (other than Secured Bank Product Obligations) or Loan Documents or to
exercise any rights or remedies relating to any Collateral, whether by judicial action, self-help, notification of Account Debtors, setoff or recoupment, credit bid, deed in lieu of foreclosure, action in an Insolvency Proceeding or otherwise. 

Environmental Laws: Applicable Laws (including programs, permits and guidance promulgated by regulators) relating to public health
(other than occupational safety and health regulated by OSHA) or the protection or pollution of the environment, including CERCLA, RCRA and CWA. 

Environmental Notice: a written notice from any Governmental Authority or other Person of any possible noncompliance with,
investigation of a possible violation of, litigation relating to, or potential fine or liability under any Environmental Law, or with respect to any Environmental Release, environmental pollution or hazardous materials, including any complaint,
summons, citation, order, claim, demand or request for correction, remediation or other response action. 
 Environmental Release: a
release as defined in CERCLA or under any other Environmental Law. 
 Equity Interest: the interest of any (a) shareholder in a
corporation; (b) partner in a partnership (whether general, limited, limited liability or joint venture); (c) member in a limited liability company; or (d) other Person having any other form of equity security, share capital or ownership
interest that confers on a Person the right to receive a share of the profits and losses of, or distributions of assets of, the issuing Person. 

ERISA: the Employee Retirement Income Security Act of 1974. 

ERISA Affiliate: any trade or business (whether or not incorporated) under common control with an Obligor within the meaning of
Section 414(b) or (c) of the Code (and Sections 414(m) and (o) of the Code for purposes of provisions relating to Section 412 of the Code). 

ERISA Event: (a) a Reportable Event with respect to a Pension Plan; (b) withdrawal of an Obligor or ERISA Affiliate from a
Pension Plan subject to Section 4063 of ERISA during a plan year in which it was a substantial employer (as defined in Section 4001(a)(2) of ERISA) or a cessation of operations that is treated as such a withdrawal under
Section 4062(e) of ERISA; (c) 

  
 14 








 
complete or partial withdrawal of an Obligor or ERISA Affiliate from a Multiemployer Plan or receipt by an Obligor or ERISA Affiliate of notification that a Multiemployer Plan is in
reorganization under Title IV of ERISA; (d) filing of a notice of intent to terminate, treatment of an amendment as a termination of a Pension Plan under Section 4041 of ERISA or the termination or treatment of an amendment as a
termination of a Multiemployer Plan under Section 4041A of ERISA, or institution of proceedings by the PBGC to terminate a Pension Plan under Section 4042 of ERISA; (e) determination that a Pension Plan is considered an at-risk plan under Section 430 of the Code or Section 303 of ERISA or receipt by an Obligor or ERISA Affiliate of notification that any Multiemployer Plan is in critical or endangered status under
Section 432 of the Code or Section 305 of ERISA; (f) an event or condition that constitutes grounds under Section 4042 of ERISA for termination of, or appointment of a trustee to administer, any Pension Plan; (g) imposition
of any liability on an Obligor or ERISA Affiliate under Title IV of ERISA, other than for PBGC premiums due but not delinquent under Section 4007 of ERISA; or (h) failure by an Obligor or ERISA Affiliate to meet all applicable requirements
under the Pension Funding Rules in respect of a Pension Plan, whether or not waived, or to make a required contribution to a Multiemployer Plan. 

EU Bail-In Legislation Schedule: the EU Bail-In
Legislation Schedule published by the Loan Market Association, as in effect from time to time. 
 Event of Default: as defined in
Section 11. 
 Excluded Account: any Deposit Account (a) that is used for the sole purpose of making
payroll and withholding tax payments related thereto and other employee wage and benefits payments and accrued and unpaid employee compensation payments (including salaries, wages, benefits and expense reimbursements, 401(k) and other retirement
plans and employee benefits, including rabbi trusts for deferred compensation and health care benefits); (b) that is used for the sole purpose of paying taxes, including sales taxes; (c) that is used solely as an escrow account, a fiduciary or
a trust account or otherwise held exclusively for the benefit of an unaffiliated third party; or (d) that is not otherwise subject to the provisions of this definition and, individually or together with any other Deposit Account, has an average
daily balance for any fiscal month of less than $500,000 in the aggregate for all such Deposit Accounts under this clause (d). 

Excluded Domestic Subsidiaries: Guardian Assets, Inc., a Delaware corporation, and Amkor Worldwide Services LLC, a Delaware limited
liability company, each of which owns de minimis assets, conducts little or no business or operations and generates little or no revenues. 

Excluded Property: (a) any Property for which a security interest may not be granted in such Property as a matter of Applicable
Law, or under the terms of the property or the governing document applicable thereto, after giving effect to the UCC or any other applicable law (including the Bankruptcy Code or principles of equity), without the consent of any Governmental
Authority pursuant to such Applicable Law or one or more parties thereto other than any Obligor, but only for so long as such consent has not been obtained; (b) assets subject to Capital Leases or purchase money financings to the extent such
Capital Leases or purchase money financings are permitted under the Loan Documents and prohibit the granting of a Lien; and (c) any property as to which Agent has determined in its sole discretion that the property value is insufficient to
justify the difficulty, time and/or expense of obtaining a perfected security interest therein; provided, that 

  
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“Excluded Property” shall not include any proceeds, products, substitutions or replacements of such Excluded Property (unless such proceeds, products, substitutions or replacements
would otherwise constitute Excluded Property). 
 Excluded Swap Obligation: with respect to an Obligor, each Swap Obligation as to
which, and only to the extent that, such Obligor’s guaranty of or grant of a Lien as security for such Swap Obligation is or becomes illegal under the Commodity Exchange Act because the Obligor does not constitute an “eligible contract
participant” as defined in the act (determined after giving effect to any keepwell, support or other agreement for the benefit of such Obligor and all guarantees of Swap Obligations by other Obligors) when such guaranty or grant of Lien becomes
effective with respect to the Swap Obligation. If a Hedging Agreement governs more than one Swap Obligation, only the Swap Obligation(s) or portions thereof described in the foregoing sentence shall be Excluded Swap Obligation(s) for the applicable
Obligor. 
 Excluded Taxes: (a) Taxes imposed on or measured by a Recipient’s net income (however denominated), franchise
Taxes and branch profits Taxes (i) as a result of such Recipient being organized under the laws of, or having its principal office or applicable Lending Office located in, the jurisdiction imposing such Tax, or (ii) constituting Other
Connection Taxes; (b) withholding Taxes imposed by the U.S. federal government or by the Republic of Singapore on amounts payable to or for the account of a Lender with respect to its interest in a Revolver Loan or Revolver Commitment pursuant
to a law in effect when the Lender acquires such interest (except pursuant to an assignment request by Borrower Agent under Section 13.4) or changes its Lending Office, except to the extent such Taxes were payable to its
assignor immediately prior to such assignment or to the Lender immediately prior to its change in Lending Office; (c) Taxes attributable to a Recipient’s failure to comply with Section 5.10; and (d) U.S.
federal or Singapore withholding Taxes imposed pursuant to FATCA. In no event shall “Excluded Taxes” include any withholding Tax described in (b) of this definition imposed by a jurisdiction other than the U.S. federal government or
the Republic of Singapore to a Recipient that has complied with Section 5.10. 
 Existing Indebtedness:
Debt of any Obligor in existence on the date of this Agreement, until such amounts are repaid. 
 Existing Parent Letters of Credit:
the following outstanding letters of credit issued by Bank of America for the benefit of Parent: (i) standby Letter of Credit bearing number 7420662 in the face amount of $147,404 issued for the benefit of Credit Suisse AG London Branch,
(ii) standby Letter of Credit bearing number 68101486 in the face amount of $257,541 issued for the benefit of Credit Suisse AG London Branch and (iii) standby Letter of Credit bearing number 3096430 in the face amount of $127,652 issued
for the benefit of Salt River Project Agricultural. 
 Extraordinary Expenses: subject to the express exclusions with respect to the
indemnity of Claims set forth in Section 14.2, all reasonable and documented out-of-pocket costs, expenses or advances that Agent or any Lender may incur during an
Event of Default, or during the pendency of an Insolvency Proceeding of an Obligor, including those relating to (a) any audit, inspection, repossession, storage, repair, appraisal, insurance, manufacture, preparation or advertising for sale,
sale, collection, or other preservation of or realization upon any Collateral; (b) any action, arbitration or other proceeding (whether instituted by or against Agent, any Lender, any Obligor, any representative of creditors of an Obligor or
any other Person) in any way relating to any 

  
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Collateral (including the validity, perfection, priority or avoidability of Agent’s Liens with respect to any Collateral), Loan Documents, Letters of Credit or Obligations, including any
lender liability or other Claims; (c) the exercise of any rights or remedies of Agent in, or the monitoring of, any Insolvency Proceeding; (d) settlement or satisfaction of taxes, charges or Liens with respect to any Collateral;
(e) any Enforcement Action; and (f) negotiation and documentation of any modification, waiver, workout, restructuring or forbearance with respect to any Loan Documents or Obligations. Such costs, expenses and advances include transfer
fees, Other Taxes, storage fees, insurance costs, permit fees, utility reservation and standby fees, legal fees, appraisal fees, brokers’ and auctioneers’ fees and commissions, accountants’ fees, environmental study fees, wages and
salaries paid to employees of any Obligor or independent contractors in liquidating any Collateral, and travel expenses. 
 FATCA:
Sections 1471 through 1474 of the Code (including any amended or successor version if substantively comparable and not materially more onerous to comply with), any current or future regulations or official interpretations thereof, any agreements
entered into pursuant to Section 1471(b)(1) of the Code and any fiscal or regulatory legislation, rules or practices adopted pursuant to any intergovernmental agreement, treaty or convention among Governmental Authorities and implementing such
Sections of the Code. 
 Fee Letter: that certain fee letter executed by Agent and Borrower, dated as of even date herewith. 

Federal Funds Rate: (a) the weighted average per annum interest rate on overnight federal funds transactions with members of the
Federal Reserve System on the applicable day (or the preceding Business Day, if the applicable day is not a Business Day), as published by the Federal Reserve Bank of New York on the next Business Day; or (b) if such rate is not so published,
the average rate per annum (rounded up to the nearest 1/8 of 1%) charged to Bank of America on the applicable day on such transactions, as determined by Agent; provided, that in no event shall the Federal Funds Rate be less than zero. 

Fiscal Quarter: each period of three months, commencing on the first day of a Fiscal Year. 

Fiscal Year: the fiscal year of Parent and its Subsidiaries for accounting and tax purposes, ending on December 31 of each year.

 Fixed Charge Coverage Ratio: with respect to Parent and its Subsidiaries for any period, the ratio of (a) an amount equal to
Consolidated Cash Flow minus an amount equal to any extraordinary gain minus any net gain realized in connection with an Asset Sales minus any net gain realized in connection with prepayment, retirement or cancellation of Debt, in each case to the
extent any such gains were included in computing Consolidated Net Income but not excluded in computing Consolidated Cash Flow, to (b) Fixed Charges, in each case determined for such period for Parent and its Subsidiaries. 

Fixed Charges: the sum of (a) Capital Expenditures, (b) cash interest expense, (c) cash taxes, (d) scheduled
principal payments made on Borrowed Money, other than payments (i) made with proceeds of Permitted Refinancing Debt, or (ii) with respect to which Parent or its Subsidiaries have established a cash account pursuant to a Dominion Account at
Bank of America or an additional reserve against the Borrowing Base in an amount equal to the amount of such payment, and (e) Distributions made to the extent permitted by this Agreement. 

  
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 FLSA: the Fair Labor Standards Act of 1938. 

Floating Rate Loan: a Base Rate Revolver Loan or Singapore Base Rate Revolver Loan. 

Flood Laws: the National Flood Insurance Act of 1968, Flood Disaster Protection Act of 1973 and related laws. 

Foreign Lender: any Lender that is not a U.S. Person. 

Foreign Plan: any employee benefit plan or arrangement (a) maintained or contributed to by any Obligor or Subsidiary that is not
subject to the laws of the United States; or (b) mandated by a government other than the United States for employees of any Obligor or Subsidiary. 

Foreign Subsidiary: a Subsidiary of Parent that is not a Domestic Subsidiary. 

Fronting Exposure: a Defaulting Lender’s interest in LC Obligations, Swingline Loans and Protective Advances, except to the extent
Cash Collateralized by the Defaulting Lender or allocated to other Lenders hereunder. 
 Full Payment: with respect to any
Obligations (other than unasserted contingent indemnification and reimbursement obligations), (a) the full cash payment thereof, including any interest, fees and other charges accruing during an Insolvency Proceeding (whether or not allowed in the
proceeding); or (b) if such Obligations are LC Obligations, Secured Bank Product Obligations, or asserted contingent indemnification and reimbursement obligations, Cash Collateralization thereof (or delivery of a standby letter of credit
acceptable to Agent in its discretion, in the amount of required Cash Collateral), or entry into other arrangements acceptable to the applicable counterparty. No Revolver Loans shall be deemed to have been paid in full unless all Revolver
Commitments related to such Revolver Loans are terminated. 
 GAAP: generally accepted accounting principles in effect in the United
States from time to time. 
 Governmental Approvals: all authorizations, consents, approvals, licenses and exemptions of,
registrations and filings with, and required reports to, all Governmental Authorities. 
 Governmental Authority: any federal, state,
local, foreign or other agency, authority, body, commission, court, instrumentality, political subdivision, central bank, or other entity or officer exercising executive, legislative, judicial, taxing, regulatory or administrative powers or
functions for any governmental, judicial, investigative, regulatory or self-regulatory authority (including the Financial Conduct Authority, the Prudential Regulation Authority and any supra-national bodies such as the European Union or European
Central Bank). 
 Guarantor Payment: as defined in Section 5.11.3. 

  
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 Guarantors: Parent and each other Person that guarantees payment or performance of
Obligations. 
 Guaranty and Security Agreement: that certain Guaranty and Security Agreement executed by Parent as of the Closing
Date, any other Guarantor party thereto from time to time and Agent. 
 Hedging Agreement: a “swap agreement” as defined in
Bankruptcy Code Section 101(53B)(A). 
 Indemnified Taxes: (a) Taxes, other than Excluded Taxes, imposed on or relating to
any payment of an Obligation; and (b) to the extent not otherwise described in clause (a), Other Taxes. 
 Indemnitees: Agent
Indemnitees, Lender Indemnitees, Issuing Bank Indemnitees and Bank of America Indemnitees. 
 Insolvency Proceeding: any case or
proceeding commenced by or against a Person under any state, federal or foreign law for, or any agreement of such Person to, (a) the entry of an order for relief under the Bankruptcy Code, or any other insolvency, debtor relief or debt
adjustment law; (b) the appointment of a receiver, receiver and manager, trustee, liquidator, administrator, judicial manager, conservator or other custodian for such Person or any part of its Property; or (c) an assignment or trust
mortgage for the benefit of creditors. 
 Intellectual Property: all intellectual and similar Property of a Person, including
inventions, designs, patents, copyrights, trademarks, service marks, trade names, trade secrets, confidential or proprietary information, customer lists, know-how, software and databases; all embodiments or
fixations thereof and all related documentation, applications, registrations and franchises; all licenses or other rights to use any of the foregoing; and all books and records relating to the foregoing. 

Intellectual Property Claim: any claim or assertion (whether in writing, by suit or otherwise) that a Borrower’s or
Subsidiary’s ownership, use, marketing, sale or distribution of any Inventory, Equipment, Intellectual Property or other Property violates another Person’s Intellectual Property. 

Interest Period: as defined in Section 3.1.3. 

Interest Period Loan: a LIBOR Revolver Loan or a SIBOR Revolver Loan. 

Inventory: as defined in the UCC, including all goods intended for sale, lease, display or demonstration; all work in process; and all
raw materials, and other materials and supplies of any kind that are or could be used in connection with the manufacture, printing, packing, shipping, advertising, sale, lease or furnishing of such goods, or otherwise used or consumed in a
Borrower’s business (but excluding Equipment). 
 Investment: with respect to any Person, all investments by such Person in
other Persons (including Affiliates) in the form of direct or indirect loans (including Contingent Obligations with respect to Debt), advances or capital contributions (excluding payroll, commission, travel, and similar advances to directors,
officers, employees and the like made in the Ordinary Course of 

  
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Business and Accounts or trade credit in the Ordinary Course of Business), purchases or other acquisitions for consideration of Indebtedness, Equity Interests or other securities, together with
all other payments that are or would be classified as investments on a the financial statements prepared in accordance with GAAP. 

IRS: the United States Internal Revenue Service. 

Issuing Bank: Bank of America (including any Lending Office of Bank of America), or any replacement issuer appointed pursuant to
Section 2.3.4. 
 Issuing Bank Indemnitees: Issuing Bank and its officers, directors, employees,
Affiliates, agents and attorneys. 
 Judgment Currency: as defined in Section 1.5. 

LC Application: an application by Borrower Agent to Issuing Bank for issuance of a Letter of Credit, in form and substance reasonably
satisfactory to Issuing Bank and Agent. 
 LC Conditions: upon giving effect to issuance of a Letter of Credit, (a) the
conditions in Section 6 are satisfied; (b) total LC Obligations do not exceed the Letter of Credit Subline and Revolver Usage does not exceed the Borrowing Base; (c) the Letter of Credit and payments thereunder
are denominated in Dollars or other currency reasonably satisfactory to Agent and Issuing Bank; and (d) the purpose and form of the Letter of Credit are reasonably satisfactory to Agent and Issuing Bank in their discretion. 

LC Documents: all documents, instruments and agreements (including LC Requests and LC Applications) delivered by Borrowers or any other
Person to Issuing Bank or Agent in connection with any Letter of Credit. 
 LC Obligations: the sum of (a) all amounts owing by
Borrowers for drawings under Letters of Credit; and (b) the Stated Amount of all outstanding Letters of Credit. 
 LC Request: a
request for issuance of a Letter of Credit, to be provided by Borrower Agent to Issuing Bank, in form reasonably satisfactory to Agent and Issuing Bank. 

Lender Indemnitees: Lenders and Secured Bank Product Providers, and their officers, directors, employees, Affiliates, agents and
attorneys. 
 Lenders: lenders party to this Agreement (including Agent in its capacity as provider of Swingline Loans) and any
Person who hereafter becomes a “Lender” pursuant to an Assignment, in each case, which may be acting through one or more of its Lending Offices. 

Lending Office: the office (including any domestic or foreign Affiliate or branch) designated as such by Agent, a Lender or Issuing
Bank by notice to Borrower Agent and, if applicable, Agent. 

  
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 Letter of Credit: any standby or documentary letter of credit, foreign guaranty,
documentary bankers acceptance, indemnity, reimbursement agreement or similar instrument issued by Issuing Bank for the account or benefit of a Borrower or Affiliate of a Borrower. 

Letter of Credit Subline: $15,000,000. 

LIBOR: the per annum rate of interest (rounded up to the nearest 1/8th of 1%) determined by Agent at or about 11:00 a.m. (London time)
two Business Days prior to an interest period, for a term equivalent to such period, equal to the London Interbank Offered Rate, or comparable or successor rate approved by Agent, as published on the applicable Reuters screen page (or other
commercially available source designated by Agent from time to time); provided, that any comparable or successor rate shall be applied by Agent, if administratively feasible, in a manner consistent with market practice; and provided
further, that in no event shall LIBOR be less than zero. 
 LIBOR Loan: each set of LIBOR Revolver Loans having a common
length and commencement of Interest Period. 
 LIBOR Revolver Loan: a Revolver Loan that bears interest based on LIBOR. 

License: any license or agreement under which an Obligor is authorized to use Intellectual Property in connection with any manufacture,
marketing, distribution or disposition of Collateral, any use of Property or any other conduct of its business. 
 Licensor: any
Person from whom an Obligor obtains the right to use any Intellectual Property. 
 Lien: a Person’s interest in Property
securing an obligation owed to, or a claim by, such Person, including any lien, security interest, pledge, hypothecation, assignment, trust, reservation, encroachment, easement,
right-of-way, covenant, condition, restriction, lease, or other title exception or encumbrance. 

Lien Waiver: an agreement, in form and substance reasonably satisfactory to Agent, by which (a) for any material Collateral
located on leased premises, the lessor waives or subordinates any Lien it may have on the Collateral, and agrees to permit Agent to enter upon the premises and remove the Collateral or to use the premises to store or dispose of the Collateral;
(b) for any Collateral held by a warehouseman, processor, shipper, customs broker or freight forwarder, such Person waives or subordinates any Lien it may have on the Collateral, agrees to hold any Documents in its possession relating to the
Collateral as agent for Agent, and agrees to deliver the Collateral to Agent upon request; (c) for any Collateral held by a repairman, mechanic or bailee, such Person acknowledges Agent’s Lien, waives or subordinates any Lien it may have
on the Collateral, and agrees to deliver the Collateral to Agent upon request; and (d) for any Collateral subject to a Licensor’s Intellectual Property rights, the Licensor grants to Agent the right, vis-à-vis such Licensor, to enforce Agent’s Liens with respect to the Collateral, including the right to dispose of it with the benefit of the Intellectual Property, whether or not a default
exists under any applicable License. 
 Loan Documents: this Agreement, Other Agreements and Security Documents. 

  
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 Loan Year: each 12 month period commencing on the Closing Date or an anniversary thereof.

 Margin Stock: as defined in Regulation U of the Board of Governors. 

Material Adverse Effect: the effect of any event or circumstance that, taken alone or in conjunction with other events or
circumstances, (a) has a material adverse effect on (i) the business, results of operations or financial condition of the Obligors, taken as a whole, (ii) on the value of any material Collateral, (iii) the enforceability of any
Loan Document, or (iv) the validity or priority of Agent’s Liens on a material portion of the Collateral (other than as a result of any action or inaction on the part of Agent or any Lender); (b) materially impairs the ability of the
Obligors, as a whole, to perform their obligations under the Loan Documents, including repayment of any Obligations; or (c) otherwise materially impairs the ability of Agent or any Lender to enforce or collect any Obligations or to realize upon
any Collateral (other than as a result of any action or inaction on the part of Agent or any Lender). 
 Material Contract: any
agreement or arrangement to which an Obligor is party (other than the Loan Documents) (a) that is deemed to be a material contract under any securities law applicable to such Obligor, including the Securities Act of 1933, (b) for which breach,
termination, nonperformance, or failure to renew would reasonably be expected to have a Material Adverse Effect or (c) that relates to the Senior Notes or any other Debt of such Obligor in excess of $15,000,000. 

Moody’s: Moody’s Investors Service, Inc. or any successor thereto. 

Multiemployer Plan: any employee benefit plan of the type described in Section 4001(a)(3) of ERISA, to which an Obligor or ERISA
Affiliate makes or is obligated to make contributions, or during the preceding five plan years, has made or been obligated to make contributions. 

Net Income: the net income (or loss) of Parent and its Subsidiaries, determined in accordance with GAAP and before any reduction in
respect of preferred stock dividends, excluding, however: (a) any gain, together with any related provision for taxes on such gain, realized in connection with (i) any Asset Sale or (ii) the disposition of any securities by Parent or
any of its Subsidiaries or the extinguishment of any Debt of such Person or any of its Subsidiaries, (b) any extraordinary gain, together with any related provision for taxes on such extraordinary gain, (c) any gain or loss relating to
foreign currency translation or exchange, and (d) any income or loss related to any discontinued operation. 
 Net Proceeds: the
aggregate cash proceeds received by Parent or any of its Subsidiaries in respect of any Asset Sale (including, without limitation, any cash received upon the sale or other disposition of any non-cash
consideration received in any Asset Sale), net of the direct costs relating to such Asset Sale, including, without limitation, legal, accounting, and investment banking fees, and sales commissions, any relocation expenses incurred as a result
thereof, and taxes paid or payable as a result thereof, in each case after taking into account (a) any available tax credits or deductions and any tax sharing arrangements, (b) amounts required to be applied to the repayment of
Indebtedness, other than the Obligations, secured by a Lien on the asset or assets that were the subject of such Asset Sale, (c) any reserve for adjustment in respect of the sale price of 

  
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such asset or assets disposed of established in accordance with GAAP, (d) any reserve against liabilities associated with the asset or assets disposed of and retained by Parent or any of its
Subsidiaries established in accordance with GAAP and (e) all distributions and other payments required to be made to third party interest holders in Subsidiaries or joint ventures as a result of such Asset Sale. 

Notice of Borrowing: a request by Borrower Agent for a Borrowing of Revolver Loans, in the form attached as Exhibit D or
otherwise satisfactory to Agent. 
 Notice of Conversion/Continuation: a request by Borrower Agent for conversion or continuation of
a Revolver Loan as an Interest Period Loan, in form satisfactory to Agent. 
 Obligations: all (a) principal of and premium, if
any, on the Revolver Loans, (b) LC Obligations and other obligations of Obligors with respect to Letters of Credit, (c) interest, expenses, fees, indemnification obligations, Extraordinary Expenses and other amounts payable by Obligors
under Loan Documents, (d) Secured Bank Product Obligations, and (e) other Debts, obligations and liabilities of any kind owing by Obligors pursuant to the Loan Documents, in each case whether now existing or hereafter arising, whether
evidenced by a note or other writing, whether allowed in any Insolvency Proceeding, whether arising from an extension of credit, issuance of a letter of credit, acceptance, loan, guaranty, indemnification or otherwise, and whether direct or
indirect, absolute or contingent, due or to become due, primary or secondary, or joint or several; provided, that Obligations of an Obligor shall not include its Excluded Swap Obligations. 

Obligor: each Borrower, Guarantor or other Person that is liable for payment of any Obligations or that has granted a Lien on its
assets in favor of Agent to secure any Obligations. 
 OFAC: Office of Foreign Assets Control of the U.S. Treasury Department. 

Ordinary Course of Business: the ordinary course of business of Parent or its Subsidiaries, undertaken in good faith and/or consistent
with past practices. 
 Organic Documents: with respect to any Person, its constitution, charter, certificate or articles of
incorporation, bylaws, articles of organization, limited liability agreement, operating agreement, members agreement, shareholders agreement, partnership agreement, certificate of partnership, certificate of formation, voting trust agreement, or
similar agreement or instrument governing the formation or operation of such Person. 
 OSHA: the Occupational Safety and Hazard Act
of 1970. 
 Other Agreement: the Fee Letter and each LC Document, Lien Waiver, Borrowing Base Report, Compliance Certificate,
Borrower Materials, or other note, document, instrument or agreement (other than this Agreement or a Security Document) now or hereafter delivered by an Obligor or other Person (provided that an Obligor is party thereto) to Agent or a Lender in
connection with any transactions relating hereto. 
 Other Connection Taxes: Taxes imposed on a Recipient due to a present or former
connection between it and the taxing jurisdiction (other than connections arising from the Recipient having executed, delivered, become party to, performed obligations or received payments under, received or perfected a Lien or engaged in any other
transaction pursuant to, enforced, or sold or assigned an interest in, any Revolver Loan or Loan Document). 

  
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 Other Taxes: all present or future stamp, court, documentary, intangible, recording,
filing or similar Taxes that arise from any payment made under, from the execution, delivery, performance, enforcement or registration of, from the receipt or perfection of a Lien under, or otherwise with respect to, any Loan Document, except any
such Taxes that are Other Connection Taxes imposed with respect to an assignment (other than an assignment made pursuant to Section 13.4(c)). 

Overadvance: as defined in Section 2.1.5. 

Parent: Amkor Technology, INC., a Delaware corporation. 

Participant: as defined in Section 13.2. 

Participant Register: as defined in Section 13.2.3. 

Patriot Act: the Uniting and Strengthening America by Providing Appropriate Tools Required to Intercept and Obstruct Terrorism Act of
2001, Pub. L. No. 107-56, 115 Stat. 272 (2001). 
 Payment Item: each check, draft or
other item of payment payable to a Borrower, including those constituting proceeds of any Collateral. 
 PBGC: the Pension Benefit
Guaranty Corporation. 
 Pension Funding Rules: Code and ERISA rules regarding minimum required contributions (including installment
payments) to Pension Plans set forth in, for plan years ending prior to the Pension Protection Act of 2006 effective date, Section 412 of the Code and Section 302 of ERISA, both as in effect prior to such act, and thereafter, Sections 412
and 430 of the Code and Sections 302 and 303 of ERISA. 
 Pension Plan: any employee pension benefit plan (as defined in
Section 3(2) of ERISA), other than a Multiemployer Plan, that is subject to Title IV of ERISA and is sponsored or maintained by any Obligor or ERISA Affiliate or to which the Obligor or ERISA Affiliate contributes or has an obligation to
contribute, or in the case of a multiple employer or other plan described in Section 4064(a) of ERISA, has made contributions at any time during the preceding five plan years. 

Permitted Account Liens: any of the following Liens: (a) Liens in favor of Agent; (b) Liens for Taxes not yet due or being
Properly Contested; (c) statutory Liens (other than Liens for Taxes or imposed under ERISA) arising in the Ordinary Course of Business, but only if (i) payment of the obligations secured thereby is not yet due or is being Properly
Contested and (ii) such Liens do not materially impair the value or use of the Property or materially impair operation of the business of any Borrower or Subsidiary; and (d) Liens arising by virtue of a judgment or judicial order against
any Borrower or Subsidiary, or any Property of a Borrower or Subsidiary, as long as such Liens are (i) in existence for less than 30 consecutive days or being Properly Contested, and (ii) at all times junior to Agent’s Liens. 

  
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 Permitted Bank Debt: Debt incurred by an Obligor pursuant to the Credit Facilities, any
Receivables Program, any indenture, or one or more other term loan and/or revolving credit or commercial paper facilities (including any letter of credit subfacilities) entered into with commercial banks and/or institutional lenders, and any
replacement, extension, renewal, refinancing or refunding thereof, but excluding the Obligations. 
 Permitted Business: the business
of Parent and its Subsidiaries, taken as a whole, operated in a manner consistent with past operations, and any business that is reasonably related thereto or supplements such business or is a reasonable extension thereof. 

Permitted Discretion: means a determination made in good faith and in the exercise of reasonable (from the perspective of a secured
asset-based lender) business judgment. 
 Permitted Holder: each of (a) James J. Kim and his estate, spouse, siblings,
ancestors, heirs, and lineal descendants, and spouses of any such persons, the legal representatives of any of the foregoing, and the trustee of any bona fide trust of which one or more of the foregoing are the principal beneficiaries or the
grantors, (b) any other Person that is controlled by any of the foregoing or (c) any group (as such term is used in Section 13(d) and 14(d) of the Exchange Act) that is controlled by any of the persons referred to in the immediately
preceding clauses (a) and (b), so long as (1) each member of such group has voting rights approximately proportional to the percentage of ownership interests held or acquired by it (or, in the case of members who are persons referred to in
the immediately preceding clauses (a) and (b), such members collectively have voting rights that are approximately proportional to all interests owned by such persons in the aggregate) and (2) no Person or group (other than the Permitted
Holders specified in clauses (a) and (b) above) beneficially owns more than 50% (on a fully diluted basis) of the Voting Stock held by such group. 

Permitted Investments: (a) any Investment in any Obligor, whether made directly in such Obligor or indirectly through an
Investment in each parent company of such Obligor which is ultimately and substantially contemporaneously with the initial making thereof, made in such Obligor, (b) any Investment in Cash Equivalents, (c) any Investment by an Obligor in a
Person, if as a result of such Investment or in connection with the transaction pursuant to which such Investment is made (i) such Person becomes an Obligor, or (ii) such Person is merged, consolidated, or amalgamated with or into, or
transfers or conveys substantially all of its assets to, or is liquidated into, an Obligor and in each case any Investment held by such Person not acquired in contemplation thereof, (d) any Investment made as a result of the receipt of non-cash consideration from an Asset Sale that was made pursuant to and in compliance with Section 10.2.5 hereof or any disposition not constituting an Asset Sale, (e) any acquisition
of assets (including Equity Interests) solely in exchange for the issuance of Equity Interests (other than Disqualified Stock) of Parent, (f) any Investment in connection with Hedging Agreements, (g) any Investments received (i) in
satisfaction of judgments or (ii) as payment on a claim made in connection with any bankruptcy, liquidation, receivership, or other insolvency proceeding, (h) Investments in (i) prepaid expenses and negotiable instruments held for
collection, (ii) accounts receivable arising in the Ordinary Course of Business (and Investments obtained in exchange or settlement of accounts 

  
 25 








 
receivable for which an Obligor has determined that collection is not likely), and (iii) lease, utility, and worker’s compensation, performance, and other similar deposits arising in
the Ordinary Course of Business, (i) so long as no Default or Event of Default exists immediately before and after giving effect thereto, any Strategic Investment, provided that the aggregate amount of all Investments by Obligors in Strategic
Investments shall not exceed the greater of (x) $100,000,000 or (y) 5% of Parent’s consolidated total assets determined as of the date of the last day of Parent’s most recently ended Fiscal Quarter, (j) Investments purchased or
received in exchange for Permitted Investments existing as of the Closing Date or made thereafter; provided that any additional consideration provided by an Obligor in such exchange shall not be permitted pursuant to this clause (j); and provided,
further, that such purchased or exchanged Investments shall have a fair market value (as determined by an Officer of Parent unless such fair market value exceeds $25,000,000 in which case, as determined by the board of directors) equal to or
exceeding the Permitted Investments exchanged therefor; provided, further, that, notwithstanding the preceding, any extension of credit or advance by an Obligor to a customer or supplier of Obligors in the Ordinary Course of Business shall be a
Permitted Investment, (k) (A) accounts and chattel paper owing to any Obligor, (B) endorsements for collection or deposit in the Ordinary Course of Business, (C) any extension of credit represented by a bank deposit other than a time
deposit; and (D) deposits set forth in clause (k) of the definition of Permitted Liens, (l) Investments accordance with the 2018 Tax Restructuring, and (m) guarantees otherwise permitted by the terms of this Agreement, including
guarantees of Debt, performance guarantees and guarantees of operating leases or other obligations that do not constitute Debt, in each case entered into in the Ordinary Course of Business. The amount of Investments outstanding at any time pursuant
to clause (i) above shall be reduced by the net reduction after the date of this Agreement in Investments made after the date of this Agreement pursuant to such clause relating from dividends, repayments of loans or advances or other transfers
of property, net cash proceeds realized on the sale of any such Investments and net cash proceeds representing the return of capital, in each case any Obligor in respect of any such Investment, less the cost of the disposition of any such
Investment. 
 Permitted Liens: the following Liens on property of any Obligor (a) Liens on the assets, excluding the
Collateral, of any such Obligor securing Permitted Bank Debt that was permitted by the terms of this Agreement to be incurred; (b) [reserved]; (c) Liens in favor of an Obligor; provided that any such Lien on property of any Borrower shall not
extend to any Collateral; (d) Liens on property of a Person or any of its Subsidiaries existing at the time such Person is merged with or into or consolidated with any Obligor; provided, that such Liens were not incurred in contemplation
of such merger or consolidation and do not extend to any assets which constitute Collateral; (e) Liens on property existing at the time of acquisition thereof by any Obligor; provided that such Liens were not incurred in contemplation of
such acquisition and do not extend to any assets which constitute Collateral; (f) Liens to secure the performance of statutory obligations, letters of credit, surety or appeal bonds, performance bonds, or other obligations of a like nature
incurred in the Ordinary Course of Business; (g) Liens to secure obligations in respect of Debt (including obligations under Capital Lease) permitted by Section 10.2.4(b)(iv) covering only the assets acquired with such
Debt, including accessions, additions, parts, attachments, improvements, fixtures, leasehold improvements, or proceeds, if any, related thereto; (h) Liens existing on the effective date of any of the Senior Notes Indentures, excluding Liens on
Collateral; (i) Liens for taxes, assessments, or governmental charges or claims that are not yet delinquent or that are being Properly Contested; (j) Liens imposed by law or arising by operation of law, including, landlords’,
mechanics’, carriers’, warehousemen’s, materialmen’s, suppliers’, and 

  
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vendors’ Liens, Liens for master’s and crew’s wages and other similar Liens, in each case which are incurred in the Ordinary Course of Business for sums not yet delinquent or being
Properly Contested; (k) Liens incurred or pledges and deposits made in the Ordinary Course of Business in connection with workers’ compensation and unemployment insurance, health, disability or other employee benefits or property, casualty
or liability insurance or self-insurance and other types of social security; (l) Liens to secure any extension, renewal, refinancing, or refunding (or successive extensions, renewals, refinancings, or refundings), in whole or in part, of any
Debt secured by Liens referred to in clause (d), clause (e), clause (g), and clause (h) of this definition; provided that such Liens do not extend to any other property of any Obligor and the principal amount of the Debt secured by such
Lien is not increased; (m) judgment Liens not giving rise to an Event of Default so long as such Lien is adequately bonded and any appropriate legal proceedings that may have been initiated for the review of such judgment, decree, or order
shall not have been finally terminated or the period within which such proceedings may be initiated shall not have expired; (n) Liens on property of a Obligor other than Collateral securing obligations of an Obligor under Hedging Agreements
permitted by Section 10.2.4(b)(vii) or any collateral for the Debt to which such Hedging Agreements relate; (o) Liens upon specific items of Inventory or other goods and proceeds securing such Obligor’s
obligations in respect of banker’s acceptances issued or credited for the account of such Obligor to facilitate the purchase, shipment, or storage of such inventory or goods; (p) Liens securing reimbursement obligations with respect to
commercial letters of credit, banker’s acceptances or other sureties which encumber documents and other property relating to such letters of credit, banker’s acceptances or other sureties and products and proceeds thereof; (q) Liens
arising out of consignment or similar arrangements for the sale of goods in the Ordinary Course of Business; (r) Liens in favor of customs or revenue authorities arising as a matter of law to secure payment of duties in connection with the
importation of goods; (s) Liens on property of a Obligor, other than the Collateral, securing other Debt not exceeding the greater of (A) $200,000,000 and (B) an amount equal to 7.5% of Parent’s Total Tangible Assets determined as of
Parent’s most recent fiscal quarter, at any time outstanding; (t) Liens securing Permitted Refinancing Indebtedness, provided that such Liens do not extend to any other property of such Obligor and the principal amount of such Debt
secured by such Lien is not increased; (u) Liens on the Equity Interests of Subsidiaries securing obligations of Obligor not otherwise prohibited by this Agreement; (v) survey exceptions, easements or reservations of, or rights of others
for, licenses, rights-of-way, sewers, electric lines, telegraph and telephone lines and other similar purposes, or zoning or other restrictions as to the use of real
property that were not incurred in connection with Debt and that do not, individually or in the aggregate, materially adversely affect the value of said properties or materially impair their use in the operation of the business of such Person;
(w) any provision for the retention of title to an asset by the vendor or transferor of such asset (including any lessor) which transaction is otherwise permitted under this Agreement; (x) leases, licenses, subleases or sublicenses granted
to others in the Ordinary Course of Business that do not (A) interfere in any material respect with the business of any Obligor or (B) secure any Debt; (y) Liens (A) of a collection bank arising under
Section 4-210 of the Uniform Commercial Code on items in the course of collection or (B) in favor of a banking institution arising as a matter of law encumbering deposits (including the right of set-off) and which are within the general parameters customary in the banking industry; (z) Liens encumbering reasonable customary initial deposits and margin deposits and similar Liens attaching to brokerage
accounts incurred in the ordinary course of business and not for speculative purposes; (aa) Liens solely on any cash earnest money deposits made by any Obligor in connection with any letter of intent or purchase agreement


  
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permitted under this Agreement; (bb) Liens arising from Uniform Commercial Code (or equivalent statute) financing statement filings regarding operating leases entered into in the ordinary course
of business; and (cc) the Liens specified in Schedule 10.2.2. 
 Permitted Refinancing Indebtedness: any Debt of an
Obligor issued in exchange for, or the net proceeds of which are used to extend, refinance, renew, replace, defease, discharge, or refund other Debt of an Obligor (other than intercompany Indebtedness); provided that: (a) the principal
amount (or accreted value, if applicable) of such Permitted Refinancing Indebtedness does not exceed the principal amount of (or accreted value, if applicable), plus accrued interest or premium (including any make-whole premium), if any, on,
the Debt so extended, refinanced, renewed, replaced, defeased, discharged, or refunded (plus, upfront fees, original issue discount and the amount of reasonable expenses incurred in connection therewith); (b) such Permitted Refinancing
Indebtedness has a final maturity date later than the final maturity date of, and has a Weighted Average Life to Maturity equal to or greater than the Weighted Average Life to Maturity of, the Debt being extended, refinanced, renewed, replaced,
defeased, discharged or refunded; provided that if the original maturity date of such Indebtedness is after the Revolver Termination Date (as in effect on the date such Permitted Refinancing Indebtedness was incurred), then such Permitted
Refinancing Indebtedness shall have a maturity at least 180 days after the Revolver Termination Date (as in effect on the date such Permitted Refinancing Indebtedness was incurred); (c) if the Debt being extended, refinanced, renewed, replaced,
defeased, discharged, or refunded is subordinated in right of payment to the Obligations, such Permitted Refinancing Indebtedness is subordinated in right of payment to the Obligations on terms at least as favorable to the Lenders as those contained
in the documentation governing the Debt being extended, refinanced, renewed, replaced, defeased, discharged, or refunded; and (d) in the case of Debt of an Obligor, such Permitted Refinancing Indebtedness is incurred by such Obligor. 

Person: any individual, corporation, limited liability company, partnership, joint venture, association, trust, unincorporated
organization, Governmental Authority or other entity. 
 Plan: an employee benefit plan (as defined in Section 3(3) of ERISA)
maintained for employees of an Obligor or ERISA Affiliate, or to which an Obligor or ERISA Affiliate is required to contribute on behalf of its employees. 

Platform: as defined in Section 14.3.3. 

Pro Rata: with respect to any Lender, a percentage (rounded to the ninth decimal place) determined (a) by dividing the amount of
such Lender’s Revolver Commitment by the aggregate outstanding Revolver Commitments; or (b) following termination of the Revolver Commitments, by dividing the amount of such Lender’s Revolver Loans and LC Obligations by the aggregate
outstanding Revolver Loans and LC Obligations or, if all Revolver Loans and LC Obligations have been paid in full and/or Cash Collateralized, by dividing such Lender’s and its Affiliates’ remaining Obligations by the aggregate remaining
Obligations. 
 Properly Contested: with respect to any obligation of an Obligor, (a) the obligation is subject to a bona fide
dispute regarding amount or the Obligor’s liability to pay; (b) the obligation is being properly contested in good faith by appropriate proceedings promptly instituted and diligently pursued; (c) appropriate reserves have been
established in accordance with GAAP; (d) 

  
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non-payment would not have a Material Adverse Effect, nor result in forfeiture or sale of any material assets of the Obligor; (e) no Lien is imposed
on assets of the Obligor, unless bonded and stayed to the reasonable satisfaction of Agent; and (f) if the obligation results from entry of a judgment or other order, such judgment or order is stayed pending appeal or other judicial review.

 Property: any interest in any kind of property or asset, whether real, personal or mixed, or tangible or intangible. 

Protective Advances: as defined in Section 2.1.6. 

Qualified ECP: an Obligor with total assets exceeding $10,000,000, or that constitutes an “eligible contract participant”
under the Commodity Exchange Act and can cause another Person to qualify as an “eligible contract participant” under Section 1a(18)(A)(v)(II) of such act. 

Qualified Proceeds: any of the following or any combination of the following: (a) any Cash Equivalents other than certificates of
deposit, eurodollar time deposits, bankers’ acceptances, and overnight bank deposits with any commercial bank organized under the laws of a foreign country, (b) any liabilities (as would be shown on Parent’s balance sheet if prepared
in accordance with GAAP on the date of the corresponding Asset Sale) of Parent or any Subsidiary (other than contingent liabilities and liabilities that are by their terms subordinated to the Obligations) that are assumed by the transferee of any
such assets pursuant to a customary novation agreement that releases or indemnifies Parent or such Subsidiary from further liability, (c) any securities, notes, or other obligations received by Parent or any such Subsidiary from such transferee
that are converted by Parent or such Subsidiary into cash or Cash Equivalents within 90 days after such Asset Sale (to the extent of the cash or Cash Equivalents received in that conversion), (d) long-term assets that are used or useful in a
Permitted Business, and (e) all or substantially all of the assets of, or a majority of the voting Equity Interests of, any Permitted Business; provided that in the case of clause (d) and clause (e) preceding, the Asset Sale
transaction shall be with a non-Affiliate and the amount of long-term assets or voting Equity Interests received in the Asset Sale transaction shall not exceed 10.0% of the consideration received. 

RCRA: the Resource Conservation and Recovery Act (42 U.S.C. §§ 6991-6991i). 

Rate Determination Date: two Business Days prior to the commencement of such Interest Period (or such other day as is generally treated
as the rate fixing day by market practice in such interbank market, as determined by Agent; provided that to the extent such market practice is not administratively feasible for Agent, such other day as otherwise reasonably determined by Agent).

 Real Estate: all right, title and interest (whether as owner, lessor or lessee) in any real Property or any buildings, structures,
parking areas or other improvements thereon. 
 Receivables Program: with respect to any Person, an agreement or other arrangement or
program providing for the advance of funds to such Person against the pledge, contribution, sale, or other transfer of encumbrances of Receivables Program Assets of such Person or such Person and/or one or more of its Subsidiaries. 

Receivables Program Assets: all of the following property and interests in property, including any undivided interest in any pool of
any such property or interests, whether now existing 

  
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or existing in the future or hereafter arising or acquired: (a) accounts; (b) accounts receivable, general intangibles, instruments, contract rights, documents, and chattel paper (including,
without limitation, all rights to payment created by or arising from sales of goods, leases of goods, or the rendition of services, no matter how evidenced, whether or not earned by performance); (c) all unpaid seller’s or lessor’s rights
(including, without limitation, rescission, replevin, reclamation, and stoppage in transit) relating to any of the foregoing or arising therefrom; (d) all rights to any goods or merchandise represented by any of the foregoing (including,
without limitation, returned or repossessed goods); (e) all reserves and credit balances with respect to any such accounts receivable or account debtors; (f) all letters of credit, security, or Guarantees of any of the foregoing; (g) all
insurance policies or reports relating to any of the foregoing; (h) all collection or deposit accounts relating to any of the foregoing; (i) all books and records relating to any of the foregoing; (j) all instruments, contract rights,
chattel paper, documents, and general intangibles relating to any of the foregoing; and (k) all proceeds of any of the foregoing. 

Recipient: Agent, Issuing Bank, any Lender or any other recipient of a payment to be made by an Obligor under a Loan Document or on
account of an Obligation. 
 Reimbursement Date: as defined in Section 2.3.2. 

Rent and Charges Reserve: the aggregate of (a) all past due rent and other amounts owing by an Obligor to any landlord,
warehouseman, processor, repairman, mechanic, shipper, freight forwarder, broker or other Person who possesses any Collateral or could assert a Lien on any Collateral; and (b) a reserve at least equal to three months rent and other charges that
could be payable to any such Person, unless it has executed a Lien Waiver. 
 Report: as defined in
Section 12.2.3. 
 Reportable Event: any event set forth in Section 4043(c) of ERISA, other than an
event for which the 30 day notice period has been waived. 
 Required Lenders: (a) if there are one or two Lenders, all of such
Lenders (other than any such Lender that is a Defaulting Lender) and (b) if there are more than two Lenders, at least two unaffiliated Lenders (subject to Section 4.2) holding in excess of 50% of (i) the aggregate outstanding Revolver
Commitments; or (i) after termination of the Revolver Commitments, the aggregate outstanding Revolver Loans and LC Obligations or, upon Full Payment of all Revolver Loans and LC Obligations, the aggregate remaining Obligations; provided,
that Revolver Commitments, Revolver Loans and other Obligations held by a Defaulting Lender and its Affiliates shall be disregarded in making such calculation, but any related Fronting Exposure shall be deemed held as a Revolver Loan or LC
Obligation by the Lender that funded the applicable Revolver Loan or issued the applicable Letter of Credit. 
 Restricted
Investment: any Investment which is not a Permitted Investment. 
 Restricted Payment: as defined in
Section 10.2.2(a). 
 Restrictive Agreement: an agreement (other than a Loan Document) that conditions or
restricts the right of any Borrower, Subsidiary or other Obligor to incur or repay Borrowed Money, to grant Liens on any assets, to declare or make Distributions, to modify, extend or renew any agreement evidencing Borrowed Money, or to repay any
intercompany Debt. 

  
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 Revolver Commitment: for any Lender, its obligation to make Revolver Loans and to
participate in LC Obligations up to the maximum principal amount shown on Schedule 1.1, as hereafter modified pursuant to Section 2.1.7 or an Assignment and Acceptance to which it is a party. “Revolver
Commitments” means the aggregate amount of such commitments of all Lenders. 
 Revolver Loan: any loan made pursuant to
Section 2.1 or as a Swingline Loan. 
 Revolver Termination Date: July 13, 2023. 

Revolver Usage: (a) the aggregate amount of outstanding Revolver Loans; plus (b) the aggregate Stated Amount of
outstanding Letters of Credit, except to the extent Cash Collateralized by Borrowers. 
 S&P: Standard & Poor’s
Financial Services LLC, a subsidiary of The McGraw-Hill Companies, Inc., or any successor thereto. 
 Sanction: any sanction
administered or enforced by the U.S. government (including OFAC), United Nations Security Council, European Union, U.K. government or other sanctions authority. 

SEC: the Securities and Exchange Commission or any Governmental Authority succeeding to any of its principal functions. 

Secured Bank Product Obligations: Debt, obligations and other liabilities with respect to Bank Products owing by Parent or its
Subsidiaries to a Secured Bank Product Provider; provided, that Secured Bank Product Obligations of an Obligor shall not include its Excluded Swap Obligations. 

Secured Bank Product Provider: (a) Bank of America or any of its Affiliates; and (b) any other Lender or Affiliate of a
Lender that is providing a Bank Product, provided such provider delivers written notice to Agent, in form and substance reasonably satisfactory to Agent, within 10 days following the later of the Closing Date or creation of the Bank Product,
(i) describing the Bank Product and setting forth the maximum amount to be secured by the Collateral and the methodology to be used in calculating such amount, and (ii) agreeing to be bound by Section 12.13. 

Secured Parties: Agent, Issuing Bank, Lenders and Secured Bank Product Providers. 

Security Documents: the Singapore Debenture, Singapore Share Pledge, Guaranty and Security Agreement, Deposit Account Control
Agreements, and all other documents, instruments and agreements now or hereafter securing (or given with the intent to secure) any Obligations. 

Senior Notes Indentures: (a) the Senior Notes (2021) Indenture and (b) the Senior Notes (2022) Indenture. 

  
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 Senior Notes: (a) Parent’s 6.625% Senior Notes due June 1, 2021 issued
pursuant to the Senior Notes (2021) Indenture and (b) Parent’s 6.375% Senior Notes due 2022 issued pursuant to the Senior Notes (2022) Indenture. 

Senior Notes (2021) Indenture: that certain Indenture between Parent and U.S. Bank National Association, as Trustee,
dated as of May 20, 2011, as such Indenture may be amended or supplemented from time to time, relating to Parent’s 6.625% Senior Notes due 2021. 

Senior Notes (2022) Indenture: that certain Indenture between Parent and U.S. Bank National Association, as Trustee,
dated as of September 21, 2012, as such Indenture may be amended or supplemented from time to time, relating to Parent’s 6.375% Senior Notes due 2022. 

Senior Officer: the chairman of the board, director, president, chief executive officer, chief financial officer or treasurer of a
Borrower or, if the context requires, an Obligor. 
 Settlement Report: a report summarizing Revolver Loans and participations in LC
Obligations outstanding as of a given settlement date, allocated to Lenders on a Pro Rata basis in accordance with their Revolver Commitments. 

SIBOR: a per annum rate of interest (rounded up to the nearest 1/8th of 1%) equal to the Singapore Interbank Offered Rate, or
comparable or successor rate approved by Agent, determined by it at or about 11:00 a.m. (Singapore time) on the Rate Determination Date, for a term equivalent to the applicable interest period, as published on the applicable Reuters screen page (or
other commercially available source designated by Agent from time to time); provided, that in no event shall SIBOR be less than zero. 

SIBOR Loan: each set of SIBOR Revolver Loans having a common length and commencement of Interest Period. 

SIBOR Revolver Loan: a Revolver Loan denominated in Singapore Dollars that bears interest based on SIBOR. 

Singapore Base Rate: for any day, the per annum rate of interest designated by Bank of America, N.A. (or its affiliates or branches)
from time to time as its prime lending rate for commercial loans made by it in Singapore in Singapore Dollars, which rate is based on various factors, including its costs and desired return, general economic conditions and other factors, and is used
as a reference point for pricing some loans, which may be priced at, above or below such rate; provided, that in no event shall the Singapore Base Rate be less than zero. Any change in such rate shall take effect at the opening of business on the
applicable Business Day. 
 Singapore Base Rate Revolver Loan: a Revolver Loan denominated in Singapore Dollars that bears interest
based on the Singapore Base Rate. 
 Singapore Debenture: the Singapore law governed debenture over all of the assets of Amkor
Singapore dated on or about the date of this Agreement and made between Amkor Singapore and Agent. 

  
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 Singapore Share Pledge: the Singapore law governed pledge over all of the shares of Amkor
Singapore dated on or about the date of this Agreement and made between Amkor Technology Singapore Investment Pte. Ltd. and Agent. 

Singapore Dollars: the lawful currency of Singapore. 

Solvent: as to any Person, such Person (a) owns Property whose fair salable value is greater than the amount required to pay all
of its debts (including contingent, subordinated, unmatured and unliquidated liabilities); (b) owns Property whose present fair salable value (as defined below) is greater than the probable total liabilities (including contingent, subordinated,
unmatured and unliquidated liabilities) of such Person as they become absolute and matured; (c) is able to pay all of its debts as they mature; (d) has capital that is not unreasonably small for its business and is sufficient to carry on
its business and transactions and all business and transactions in which it is about to engage; (e) is not “insolvent” within the meaning of Section 101(32) of the Bankruptcy Code; and (f) has not incurred (by way of
assumption or otherwise) any obligations or liabilities (contingent or otherwise) under any Loan Documents, or made any conveyance in connection therewith, with actual intent to hinder, delay or defraud either present or future creditors of such
Person or any of its Affiliates. “Fair salable value” means the amount that could be obtained for assets within a reasonable time, either through collection or through sale under ordinary selling conditions by a capable and diligent
seller to an interested buyer who is willing (but under no compulsion) to purchase. 
 Specified Allowance Condition: either (A) pro-forma Availability is greater than 20.0% of Revolver Commitments or (B) pro-forma Availability is greater than 12.5% of Revolver Commitments and pro forma
Fixed Charge Coverage Ratio equals or exceeds 1.10 to 1.00. 
 Specified Equity Contribution: as defined in
Section 11.31.1. 
 Specified Event of Default: any Event of Default occurring as a result of a breach of
any of the following Sections of this Agreement: Section 7.2, 8.1, 8.2.4, 8.2.5, 10.1.1, 10.1.2, 10.2.2, 10.2.4, 10.2.7, 10.2.11, 10.2.13, 10.3, 11.1(a), or 11.1(j). 

Specified Obligor: an Obligor that is not then an “eligible contract participant” under the Commodity Exchange Act
(determined prior to giving effect to Section 5.11). 
 Spot Rate: the exchange rate, as determined by
Agent, that is applicable to conversion of one currency into another currency, which is (a) the exchange rate reported by Bloomberg (or other commercially available source designated by Agent) as of the end of the preceding business day in the
financial market for the first currency; or (b) if such report is unavailable for any reason, the spot rate for the purchase of the first currency with the second currency as in effect during the preceding business day in Agent’s principal
foreign exchange trading office for the first currency. 
 Stated Amount: the outstanding amount of a Letter of Credit, including any
automatic increase or tolerance (whether or not then in effect) provided by the Letter of Credit or related LC Documents. 
 Stated
Maturity: with respect to any installment of interest or principal on any series of Debt, the date on which such payment of interest or principal was scheduled to be paid in the 

  
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original documentation governing such Debt, and shall not include any contingent obligations to repay, redeem, or repurchase any such interest or principal prior to the date originally scheduled
for the payment thereof. 
 Strategic Investment: any Investment in any Person whose primary business is related, ancillary, or
complementary to a Permitted Business, and such Investment is determined in good faith by the board of directors of Parent (or senior officers of Parent to whom the board of directors has duly delegated the authority to make such a determination),
whose determination shall be conclusive and evidenced by a resolution, to promote or significantly benefit the businesses of Parent and its Subsidiaries on the date of such Investment; provided, that, with respect to any Strategic Investment
or series of related Strategic Investments involving aggregate consideration in excess of $20,000,000, Parent shall deliver to Agent a resolution of its board of directors set forth in an Officer’s Certificate certifying that such Investment
qualifies as a Strategic Investment pursuant to this definition. 
 Subordinated Debt: Debt incurred by an Obligor that is expressly
subordinate and junior in right of payment to Full Payment of all Obligations, and is on terms (including maturity, interest, fees, repayment, covenants and subordination) reasonably satisfactory to Agent. 

Subsidiary: any entity at least 50% of whose voting securities or Equity Interests is owned by Parent or a Borrower or combination of
Parent or Borrowers (including indirect ownership through other entities in which Parent or a Borrower directly or indirectly owns 50% of the voting securities or Equity Interests). 

Swap Obligations: with respect to an Obligor, its obligations under a Hedging Agreement that constitutes a “swap” within the
meaning of Section 1a(47) of the Commodity Exchange Act. 
 Swingline Loan: any Borrowing of Floating Rate Loans funded with
Agent’s funds, until such Borrowing is settled among Lenders or repaid by Borrowers. 
 Taxes: all present or future taxes,
levies, imposts, duties, deductions, withholdings (including backup withholding), assessments, fees or other charges imposed by any Governmental Authority, including any interest, additions to tax or penalties applicable thereto. 

Total Tangible Assets: with respect to Parent, as of any date, the total consolidated assets of Parent and its Subsidiaries as of such
date less the amount of the consolidated intangible assets of Parent and its Subsidiaries as of such date. 
 Transferee: any actual
or potential Eligible Assignee, Participant or other Person acquiring an interest in any Obligations. 
 Triggered Activation Period:
(a) solely for purposes of Section 10.3, any period beginning on any day on which Availability is below an amount equal to 12.50% of the aggregate Revolver Commitments on such day, and continuing through and including
the first day, if any, when no Specified Event of Default has existed and Availability has exceeded, in each case, for sixty (60) consecutive days, 12.50% of the aggregate Revolver Commitments on each of such consecutive days; (b) solely
for purposes of Section 8.1, any period beginning on any day on which Availability is below an amount equal to 15.00% of the aggregate Revolver Commitments on such day, and 


  
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continuing through and including the first day, if any, when no Specified Event of Default has existed and Availability has exceeded, in each case, for sixty (60) consecutive days, 15.00% of
the aggregate Revolver Commitments on each of such consecutive days and (c) solely for purposes of Sections 5.7, 8.2.4, 8.3.1 and 10.2.9 any period beginning on any day on which an Event of Default occurs or
Availability is below an amount equal to the Triggered Threshold Percentage of the aggregate Revolver Commitments on such day, and continuing through and including the first day, if any, when no Event of Default has existed and Availability has
exceeded, in each case, for sixty (60) consecutive days, Triggered Threshold Percentage of the aggregate Revolver Commitments on each of such consecutive days. 

Triggered Threshold Percentage: (a) 20%, if the Dominion Account is located within the United States and (b) 25% if the Dominion
Account is located outside of the United States. 
 UCC: the Uniform Commercial Code as in effect in the State of New York or, when
the laws of any other jurisdiction govern the perfection or enforcement of any Lien, the Uniform Commercial Code of such jurisdiction. 

Unused Line Fee Rate: a per annum rate equal to (a) 0.375%, if average daily Revolver Usage was 50% or less of the Revolver Commitments
during the preceding calendar month, or (b) 0.25%, if average daily Revolver Usage was more than 50% of the Revolver Commitments during such month. 

U.S. Person: “United States Person” as defined in Section 7701(a)(30) of the Code. 

U.S. Tax Compliance Certificate: as defined in Section 5.10.2(b)(iii). 

Value: for an Account, the face amount of such Account, minus any returns, rebates, discounts (calculated on the shortest terms),
credits, allowances, or Taxes (including sales, excise, and other taxes) that have been or could be claimed by the Account Debtor or any other Person. 

Voting Stock: with respect to any Person as of any date, the Equity Interests of such Person that are at the time entitled to vote in
the election of the board of directors (or other equivalent governing body) of such Person. 
 Weighted Average Life to Maturity:
when applied to any Debt at any date, the number of years obtained by dividing (a) the sum of the products obtained by multiplying (i) the amount of each then remaining installment, sinking fund, serial maturity, or other required payments
of principal, including payment at final maturity, in respect thereof, by (ii) the number of years (calculated to the nearest one-twelfth) that will elapse between such date and the making of such
payment, by (b) the then outstanding principal amount of such Debt. 
 Wholly Owned Subsidiary: with respect to any Person, a
Subsidiary of such Person all of the outstanding Equity Interests of which (other than directors’ qualifying shares or similar shares required by law to be held by third parties) shall at the time be owned by such Person and/or by one or more
Wholly Owned Subsidiaries of such Person. 
 Write-Down and Conversion Powers: the write-down and conversion powers of the applicable
EEA Resolution Authority from time to time under the Bail-In Legislation for the applicable EEA Member Country, which powers are described in the EU Bail-In Legislation
Schedule. 

  
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 2018 Tax Restructuring: the proposed restructuring of Parent and its Subsidiaries as
disclosed to Agent prior to the Closing Date. 
 1.2    Accounting Terms. Under the Loan Documents
(except as otherwise specified therein), all accounting terms shall be interpreted, all accounting determinations shall be made, and all financial statements shall be prepared, in accordance with GAAP applied on a basis consistent with the most
recent audited financial statements of Borrowers delivered to Agent before the Closing Date; provided, that if Borrower Agent notifies Agent that Borrower Agent requests an amendment to any provision (including any definitions) hereof to
eliminate the effect of any change occurring after the Closing Date in GAAP or in the application thereof on the operation of such provision (or if Agent notifies Borrower Agent that Agent requests an amendment to any provision hereof for such
purpose), regardless of whether any such notice is given before or after such change in GAAP or in the application thereof, then such provision shall be interpreted on the basis of GAAP as in effect and applied immediately before such change shall
have become effective until such notice shall have been withdrawn or such provision amended in accordance herewith. Notwithstanding any other provision contained herein, in the event of an accounting change (including the implementation of Topic
842) requiring additional leases to be capitalized, only those leases (assuming for purposes hereof that such leases were in existence on the Closing Date) that would constitute Capital Leases in conformity with GAAP on the Closing Date (e.g. before
the implementation of Topic 842) shall be considered Capital Leases, and all calculations and deliverables under this Agreement or any other Loan Document shall be made or delivered, as applicable, in accordance therewith. For the avoidance of
doubt, “Capital Lease” shall exclude any lease, concession, license of property or other arrangement (or guarantee thereof) which would be considered an operating lease under GAAP as at the Closing Date (e.g. before the implementation of
Topic 842) which subsequently requires capitalization as a result of any change to the treatment of such leases or other arrangements under GAAP. 

1.3    Uniform Commercial Code. Any terms (whether capitalized or lower case) used in this Agreement
that are defined in the UCC (including, without limitation, “Account,” “Account Debtor,” “Chattel Paper,” “Commercial Tort Claim,” “Deposit Account,” “Document,” “Equipment,”
“Farm Products,” “Fixtures,” “General Intangibles,” “Inventory,” “Investment Property,” “Instrument,” “Letters of Credit, Letter-of-Credit-Right,” “Promissory Note,” “Proceeds,” “Securities Account” and “Supporting Obligation”) shall be construed and defined as set forth in the UCC
unless otherwise defined herein or in the Loan Agreement. 
 1.4    Certain Matters of
Construction. The terms “herein,” “hereof,” “hereunder” and other words of similar import refer to this Agreement as a whole and not to any particular section, paragraph or subdivision. Any pronoun used shall be
deemed to cover all genders. In the computation of periods of time from a specified date to a later specified date, “from” means “from and including,” and “to” and “until” each mean “to but
excluding.” The terms “including” and “include” shall mean “including, without limitation” and, for purposes of each Loan Document, the parties agree that the rule of ejusdem generis shall not be applicable
to limit any provision. Section titles appear as a matter of convenience only and shall not affect the interpretation of any Loan Document. All references to (a) laws include all related regulations, interpretations,


  
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supplements, amendments and successor provisions; (b) any document, instrument or agreement include any amendments, waivers and other modifications, extensions or renewals (to the extent
permitted by the Loan Documents); (c) any section mean, unless the context otherwise requires, a section of this Agreement; (d) any exhibits or schedules mean, unless the context otherwise requires, exhibits and schedules attached hereto, which
are hereby incorporated by reference; (e) any Person include successors and assigns; (f) time of day means time of day in Singapore; or (g) discretion of Agent, Issuing Bank or any Lender mean the sole and absolute discretion of such
Person (acting reasonably) exercised at any time. All determinations (including calculations of Borrowing Base and financial covenants) made from time to time under the Loan Documents shall be made in light of the circumstances existing at such
time. Borrowing Base calculations shall be consistent with historical methods of valuation and calculation, and otherwise reasonably satisfactory to Agent in its Permitted Discretion (and not necessarily calculated in accordance with GAAP).
Borrowers shall have the burden of establishing any alleged negligence, misconduct or lack of good faith by Agent, Issuing Bank or any Lender under any Loan Documents. No provision of any Loan Documents shall be construed against any party by reason
of such party having, or being deemed to have, drafted the provision. Reference to a Borrower’s “knowledge” or similar concept means actual knowledge of a Senior Officer, or knowledge that a Senior Officer would have obtained if he or
she had engaged in good faith and diligent performance of his or her duties, including reasonably specific inquiries of employees or agents and a good faith attempt to ascertain the matter. 

1.5    Currency Equivalents. 

1.5.1    Calculations. All references in the Loan Documents to Revolver Loans, Letters of Credit,
Obligations, Borrowing Base components and other amounts shall be denominated in Available Currency, unless expressly provided otherwise. The Dollar equivalent of any amounts denominated or reported under a Loan Document in a currency other than
Dollars shall be determined by Agent on a daily basis, based on the current Spot Rate. Borrowers shall report Value and other Borrowing Base components to Agent in the currency invoiced by Borrowers (for Accounts) or shown in Borrowers’
financial records (for all other assets), and unless expressly provided otherwise, shall deliver financial statements and calculate financial covenants in Dollars. Notwithstanding anything herein to the contrary, if an Obligation is funded or
expressly denominated in a currency other than Dollars, Borrowers shall repay such Obligation in such other currency. 

1.5.2    Judgments. If, in connection with obtaining judgment in any court, it is necessary to
convert a sum from the currency provided under a Loan Document (“Agreement Currency”) into another currency, the Spot Rate shall be used as the rate of exchange. Notwithstanding any judgment in a currency (“Judgment
Currency”) other than the Agreement Currency, a Borrower shall discharge its obligation in respect of any sum due under a Loan Document only if, on the Business Day following receipt by Agent of payment in the Judgment Currency, Agent can
use the amount paid to purchase the sum originally due in the Agreement Currency. If the purchased amount is less than the sum originally due, such Borrower agrees, as a separate obligation and notwithstanding any such judgment, to indemnify Agent
and Lenders against such loss. If the purchased amount is greater than the sum originally due, Agent shall return the excess amount to such Borrower (or to the Person legally entitled thereto). 

  
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 SECTION 2.    CREDIT FACILITIES 

2.1    Revolver Commitment. 

2.1.1    Revolver Loans. Each Lender agrees, severally on a Pro Rata basis up to its Revolver
Commitment, on the terms set forth herein, to make Revolver Loans to Borrowers from time to time through the Commitment Termination Date. The Revolver Loans may be repaid and reborrowed as provided herein. In no event shall Lenders have any
obligation to honor a request for a Revolver Loan if Revolver Usage at such time plus the requested Revolver Loan would exceed the Borrowing Base. 

2.1.2    Notes. Revolver Loans and interest accruing thereon shall be evidenced by the records of
Agent and the applicable Lender. At the request of a Lender, Borrowers shall deliver promissory note(s) to such Lender, evidencing its Revolver Loans. 

2.1.3    Use of Proceeds. The proceeds of Revolver Loans shall be used by Borrowers solely
(a) to satisfy existing Debt; (b) to pay fees and transaction expenses associated with the closing of this credit facility; (c) to pay Obligations in accordance with this Agreement; and (d) for lawful corporate purposes of
Borrowers, including working capital needs and for general corporate purposes. Borrowers shall not, directly or indirectly, use any Letter of Credit or Revolver Loan proceeds, nor use, lend, contribute or otherwise make available any Letter of
Credit or Revolver Loan proceeds to any Subsidiary, joint venture partner or other Person, (i) to fund any activities of or business with any Person, or in any Designated Jurisdiction, that, at the time of issuance of the Letter of Credit or
funding of the Revolver Loan, is the target of any Sanction, to the extent such actions would result in a violation of a Sanction by any Person; or (ii) in any manner that would result in a violation of a Sanction by any Person (including any
Secured Party or other individual or entity participating in any transaction); or (iii) for any purpose that would breach the U.S. Foreign Corrupt Practices Act of 1977, UK Bribery Act 2010 or similar law in any jurisdiction. 

2.1.4    Voluntary Reduction or Termination of Revolver Commitments. 

(a)    The Revolver Commitments shall terminate on the Revolver Termination Date, unless sooner terminated
in accordance with this Agreement. Upon at least 10 days prior written notice to Agent at any time, Borrowers may, at their option, terminate the Revolver Commitments and this credit facility. Any notice of termination given by Borrowers shall be
irrevocable; provided, that a notice of termination of the Revolver Commitments may state that such notice is conditioned upon the effectiveness of other credit facilities or the consummation of an acquisition, in which case such notice may
be revoked or otherwise modified by notice to Agent prior to the specified effective date if such condition is not satisfied. On the Commitment Termination Date, Borrowers shall make Full Payment of all Obligations. 

(b)    Borrowers may permanently reduce the Revolver Commitments, on a ratable basis for all Lenders, upon
at least 10 days prior written notice to Agent, 

  
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which notice shall specify the amount of the reduction and shall be irrevocable once given. Each reduction shall be in a minimum amount of $25,000,000, or an increment of $1,000,000 in excess
thereof. 
 2.1.5    Overadvances. If Revolver Usage exceeds the Borrowing Base
(“Overadvance”) at any time, the excess shall be payable by Borrowers on demand by Agent and shall constitute an Obligation secured by the Collateral and be entitled to all benefits of the Loan Documents. Agent may require
Lenders to fund Floating Rate Loans that cause or constitute an Overadvance (unless Required Lenders have notified Agent in writing that no such Revolver Loans are to be made) and to forbear from requiring Borrowers to cure an Overadvance, as long
as the total Overadvance does not exceed $25,000,000 and does not continue for more than 30 consecutive days without the consent of Required Lenders. In no event shall Revolver Loans be required that would cause Revolver Usage to exceed the
aggregate Revolver Commitments. No funding or sufferance of an Overadvance shall constitute a waiver by Agent or Lenders of the Event of Default caused thereby. No Obligor shall be a beneficiary of this Section nor authorized to enforce any of its
terms. 
 2.1.6    Protective Advances. Agent shall be authorized, in its discretion, at any time
that any conditions in Section 6 are not satisfied, to make Floating Rate Loans (“Protective Advances”) (a) up to an aggregate amount of $25,000,000 outstanding at any time, if Agent deems such Revolver Loans
necessary or desirable to preserve or protect Collateral, or to enhance the collectability or repayment of Obligations, as long as such Revolver Loans do not cause Revolver Usage to exceed the aggregate Revolver Commitments; or (b) to pay any
other amounts chargeable to Obligors under any Loan Documents, including interest, costs, fees and expenses. Lenders shall participate on a Pro Rata basis in Protective Advances outstanding from time to time. Required Lenders may at any time revoke
Agent’s authority to make further Protective Advances under clause (a) by written notice to Agent. Absent such revocation, Agent’s determination that funding of a Protective Advance is appropriate shall be conclusive. 

2.1.7    Increase in Revolver Commitments. Borrowers may request an increase in Revolver Commitments
from time to time upon not less than 30 days’ notice to Agent, as long as (a) the requested increase is in a minimum amount of $25,000,000 and is offered on the same terms as existing
Revolver Commitments, except for a closing fee specified by Agent and Borrowers, and (b) total increases under this Section do not exceed $75,000,000 and no more than three increases are made. Agent shall promptly notify Lenders of the
requested increase and, within 10 Business Days thereafter, each Lender shall notify Agent if and to what extent such Lender commits to increase its Revolver Commitment. Any Lender not responding within such period shall be deemed to have declined
an increase. If Lenders fail to commit to the full requested increase, Eligible Assignees may issue additional Revolver Commitments and become Lenders hereunder. Agent may allocate, in its discretion, the increased Revolver Commitments among
committing Lenders and, if necessary, Eligible Assignees. Total Revolver Commitments shall be increased by the requested amount (or such lesser amount committed by Lenders and Eligible Assignees) on a date agreed upon by Agent and Borrower Agent,
provided the conditions set forth in Section 6.2 are satisfied at such time. Agent, Borrowers, and the 

  
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new and existing Lenders shall execute and deliver such documents and agreements as Agent deems appropriate to evidence the increase in and allocations of Revolver Commitments. On the effective
date of an increase, the Revolver Usage and other exposures under the Revolver Commitments shall be reallocated among Lenders, and settled by Agent as necessary, in accordance with Lenders’ adjusted shares of such commitments. 

2.2    Reserved. 

2.3    Letter of Credit Facility. 

2.3.1    Issuance of Letters of Credit. Issuing Bank shall issue Letters of Credit from time to time
until the Commitment Termination Date, on the terms set forth herein, including the following: 

(a)    Each Borrower acknowledges that Issuing Bank’s issuance of any Letter of Credit is conditioned
upon Issuing Bank’s receipt of a LC Application with respect to the requested Letter of Credit, as well as such other instruments and agreements as Issuing Bank may customarily require for issuance of a letter of credit of similar type and
amount. Issuing Bank shall have no obligation to issue any Letter of Credit unless (i) Issuing Bank receives a LC Request and LC Application at least three Business Days prior to the requested date of issuance; (ii) each LC Condition is
satisfied; and (iii) if a Defaulting Lender exists, such Lender or Borrowers have entered into arrangements reasonably satisfactory to Agent and Issuing Bank to eliminate any Fronting Exposure associated with such Lender. If, in sufficient time
to act, Issuing Bank receives written notice from Agent or Required Lenders that a LC Condition has not been satisfied, Issuing Bank shall not issue the requested Letter of Credit until such notice is withdrawn in writing by Agent or until the
Required Lenders have waived such condition in accordance with this Agreement. Prior to receipt of any such notice, Issuing Bank shall not be deemed to have knowledge of any failure of LC Conditions. 

(b)    Letters of Credit may be requested by a Borrower to support obligations incurred in the Ordinary
Course of Business, or as otherwise approved by Agent. Increase, renewal or extension of a Letter of Credit shall be treated as issuance of a new Letter of Credit, except that Issuing Bank may require a new LC Application in its discretion. 

(c)    Borrowers assume all risks of the acts, omissions or misuses of any Letter of Credit by the
beneficiary. In connection with any Letter of Credit, none of Agent, Issuing Bank or any Lender shall be responsible for the existence, character, quality, quantity, condition, packing, value or delivery of any goods purported to be represented by
any Documents; any differences or variation in the character, quality, quantity, condition, packing, value or delivery of any goods from that expressed in any Documents; the form, validity, sufficiency, accuracy, genuineness or legal effect of any
Documents or of any endorsements thereon; the time, place, manner or order in which shipment of goods is made; partial or 

  
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incomplete shipment of, or failure to ship, any goods referred to in a Letter of Credit or Documents; any deviation from instructions, delay, default or fraud by any shipper or other Person in
connection with any goods, shipment or delivery; any breach of contract between a shipper or vendor and a Borrower; errors, omissions, interruptions or delays in transmission or delivery of any messages, by mail, cable, telegraph, telex, telecopy, e-mail, telephone or otherwise; errors in interpretation of technical terms; the misapplication by a beneficiary of any Letter of Credit or the proceeds thereof; or any consequences arising from causes beyond the
control of Issuing Bank, Agent or any Lender, including any act or omission of a Governmental Authority. Borrowers shall take all action to avoid and mitigate any damages relating to any Letter of Credit or claimed against Issuing Bank, Agent or any
Lender, including through enforcement of any available rights against a beneficiary. Issuing Bank shall be fully subrogated to the rights and remedies of any beneficiary whose claims against any Borrower are discharged with proceeds of a Letter of
Credit. The rights and remedies of Issuing Bank under the Loan Documents shall be cumulative. 

(d)    In connection with its administration of and enforcement of rights or remedies under any Letters of
Credit or LC Documents, Issuing Bank shall be entitled to act, and shall be fully protected in acting, upon any certification, documentation or communication in whatever form believed by Issuing Bank, in good faith, to be genuine and correct and to
have been signed, sent or made by a proper Person. Issuing Bank may use legal counsel, accountants and other experts to advise it concerning its obligations, rights and remedies, and shall be entitled to act upon, and shall be fully protected in any
action taken in good faith reliance upon, any advice given by such experts. Issuing Bank may employ agents and attorneys-in-fact in connection with any matter relating
to Letters of Credit or LC Documents, and shall not be liable for the negligence or misconduct of agents and attorneys-in-fact selected with reasonable care. 

2.3.2    Reimbursement; Participations. 

(a)    If Issuing Bank honors any request for payment under a Letter of Credit, Borrowers shall pay to
Issuing Bank, by no later than the next Business Day (“Reimbursement Date”), the amount paid by Issuing Bank under such Letter of Credit, together with interest at the interest rate for Floating Rate Loans from the Reimbursement
Date until payment by Borrowers. The obligation of Borrowers to reimburse Issuing Bank for any payment made under a Letter of Credit shall be absolute, unconditional, irrevocable, and joint and several, and shall be paid without regard to any lack
of validity or enforceability of any Letter of Credit or the existence of any claim, setoff, defense or other right that Borrowers may have at any time against the beneficiary. Whether or not Borrower Agent submits a Notice of Borrowing, Borrowers
shall be deemed to have requested a Borrowing of Floating Rate Loans in an amount necessary to pay all amounts due Issuing Bank on any Reimbursement Date and each Lender shall fund its Pro Rata share of such Borrowing whether or not the Revolver
Commitments have terminated, an Overadvance exists or is created thereby, or the conditions in Section 6 are satisfied. 

  
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 (b)    Each Lender hereby irrevocably and unconditionally
purchases from Issuing Bank, without recourse or warranty, an undivided Pro Rata participation in all LC Obligations outstanding from time to time. Issuing Bank is issuing Letters of Credit in reliance upon this participation. If Borrowers do not
make a payment to Issuing Bank when due hereunder, Agent shall promptly notify Lenders and each Lender shall within one Business Day after such notice pay to Agent, for the benefit of Issuing Bank, the Lender’s Pro Rata share of such payment.
Upon request by a Lender, Issuing Bank shall provide copies of Letters of Credit and LC Documents in its possession at such time. 

(c)    The obligation of each Lender to make payments to Agent for the account of Issuing Bank in
connection with Issuing Bank’s payment under a Letter of Credit shall be absolute, unconditional and irrevocable, not subject to any counterclaim, setoff, qualification or exception whatsoever, and shall be made in accordance with this
Agreement under all circumstances, irrespective of any lack of validity or unenforceability of any Loan Documents; any draft, certificate or other document presented under a Letter of Credit having been determined to be forged, fraudulent,
noncompliant, invalid or insufficient in any respect or any statement therein being untrue or inaccurate in any respect; any waiver by Issuing Bank of a requirement that exists for its protection (and not a Borrower’s protection) or that does
not materially prejudice a Borrower; any honor of an electronic demand for payment even if a draft is required; any payment of an item presented after a Letter of Credit’s expiration date if authorized by the UCC or applicable customs or
practices; or any setoff or defense that an Obligor may have with respect to any Obligations. Issuing Bank does not assume any responsibility for any failure or delay in performance or any breach by any Borrower or other Person of any obligations
under any LC Documents. Issuing Bank does not make to Lenders any express or implied warranty, representation or guaranty with respect to any Letter of Credit, Collateral, LC Document or Obligor. Issuing Bank shall not be responsible to any Lender
for any recitals, statements, information, representations or warranties contained in, or for the execution, validity, genuineness, effectiveness or enforceability of any LC Documents; the validity, genuineness, enforceability, collectability, value
or sufficiency of any Collateral or the perfection of any Lien therein; or the assets, liabilities, financial condition, results of operations, business, creditworthiness or legal status of any Obligor. 

(d)    No Issuing Bank Indemnitee shall be liable to any Lender or other Person for any action taken or
omitted to be taken in connection with any Letter of Credit or LC Document except as a result of its gross negligence, willful misconduct or bad faith. Issuing Bank may refrain from taking any action with respect to a Letter of Credit until it
receives written instructions (and in its discretion, appropriate assurances) from the Lenders. 

  
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 2.3.3    Cash Collateral. At Agent’s or Issuing
Bank’s request, Borrowers shall Cash Collateralize (a) the Fronting Exposure of any Defaulting Lender, and (b) all outstanding Letters of Credit if an Event of Default exists, the Commitment Termination Date occurs or the Revolver
Termination Date is scheduled to occur within five Business Days. If Borrowers fail to provide any Cash Collateral as required hereunder, Lenders may (and shall upon direction of Agent) advance, as Revolver Loans, the amount of Cash Collateral
required (whether or not the Revolver Commitments have terminated, an Overadvance exists or the conditions in Section 6 are satisfied). 

2.3.4    Resignation of Issuing Bank. Issuing Bank may resign at any time upon notice to Agent and
Borrowers, and any resignation of Agent hereunder shall automatically constitute its concurrent resignation as Issuing Bank. From the effective date of its resignation, Issuing Bank shall have no obligation to issue, amend, renew, extend or
otherwise modify any Letter of Credit, but shall otherwise have all rights and obligations of an Issuing Bank hereunder relating to any Letter of Credit issued by it prior to such date. A replacement Issuing Bank may be appointed by written
agreement among Agent, Borrower Agent and the new Issuing Bank. 
 SECTION 3.    INTEREST, FEES AND CHARGES 

3.1    Interest. 

3.1.1    Rates and Payment of Interest. 

(a)    The Obligations shall bear interest (i) if a Base Rate Revolver Loan, at the Base Rate in
effect from time to time, plus the Applicable Margin, (ii) if a Singapore Base Rate Revolver Loan, at the Singapore Base Rate in effect from time to time, plus the Applicable Margin, (iii) if a LIBOR Revolver Loan, at LIBOR
for the applicable Interest Period, plus the Applicable Margin; (iv) if a SIBOR Revolver Loan, at SIBOR for the applicable Interest Period, plus the Applicable Margin; (v) if any other Obligation denominated in Dollars (including,
to the extent permitted by Applicable Law, interest not paid when due), at the Base Rate in effect from time to time, plus the Applicable Margin for Base Rate Revolver Loans; and (vi) if any other Obligation denominated in Singapore
Dollars (including, to the extent permitted by Applicable Law, interest not paid when due), at the Singapore Base Rate in effect from time to time, plus the Applicable Margin for Singapore Base Rate Revolver Loans. Interest shall accrue from
the date the Revolver Loan is advanced or the Obligation is incurred or payable, until paid by Borrowers. 

(b)    During an Insolvency Proceeding with respect to any Borrower, or during the existence and
continuation of any other Event of Default if Agent or Required Lenders in their discretion so elect, Obligations shall bear interest at the Default Rate (whether before or after any judgment), payable on demand. 

(c)    Interest shall accrue from the date a Revolver Loan is advanced or Obligation is incurred or
payable, until paid in full by Borrowers, and shall in no event be less than zero at any time. Interest accrued on the Revolver Loans shall 

  
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be due and payable monthly in arrears, (i) on the fifth day of each month with respect to the prior month; (ii) on any date of prepayment, with respect to the principal amount being
prepaid; and (iii) on the Commitment Termination Date. Interest accrued on any other Obligations shall be due and payable as provided in the applicable agreements or, if no payment date is specified, on demand. 

3.1.2    Application of LIBOR and/or SIBOR to Outstanding Revolver Loans. 

(a)    Borrowers may on any Business Day elect to convert any portion of the Floating Rate Loans to, or to
continue any Interest Period Loan at the end of its Interest Period as, an Interest Period Loan. During any Event of Default, Agent may (and shall at the direction of Required Lenders) declare that no Revolver Loan may be made, converted or
continued as an Interest Period Loan. 
 (b)    To convert or continue Revolver Loans as Interest Period
Loans, Borrower Agent shall give Agent a Notice of Conversion/Continuation, no later than 11:00 a.m. at least three Business Days before the requested conversion or continuation date. Promptly after receiving any such notice, Agent shall notify each
Lender thereof. Each Notice of Conversion/Continuation shall be irrevocable, and shall specify the amount of Revolver Loans to be converted or continued, the conversion or continuation date (which shall be a Business Day), and the duration of the
Interest Period (which shall be deemed to be one month if not specified). If, upon the expiration of any Interest Period for any Interest Period Loan, Borrowers shall have failed to deliver a Notice of Conversion/Continuation, they shall be deemed
to have elected to convert such Revolver Loan into a Floating Rate Loan. Agent does not warrant or accept responsibility for, nor shall it have any liability with respect to, administration, submission or any other matter related to any rate
described in the definitions of LIBOR and/or SIBOR. 
 3.1.3    Interest Periods. Borrowers shall
select an interest period (“Interest Period”) of 1, 2 or 3 months to apply to each Interest Period Loan; provided, that: 

(a)    the Interest Period shall begin on the date the Revolver Loan is made or continued as, or converted
into, a Interest Period Loan, and shall expire on the numerically corresponding day in the calendar month at its end; 

(b)    if any Interest Period begins on a day for which there is no corresponding day in the calendar month
at its end or if such corresponding day falls after the last Business Day of such month, then the Interest Period shall expire on the last Business Day of such month; and if any Interest Period would otherwise expire on a day that is not a Business
Day, the period shall expire on the next Business Day; and 
 (c)    no Interest Period shall extend
beyond the Revolver Termination Date. 

  
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 3.2    Fees. 

3.2.1    Unused Line Fee. Borrowers shall pay to Agent, for the Pro Rata benefit of Lenders, a fee
equal to the Unused Line Fee Rate times the amount by which the Revolver Commitments exceed the average daily Revolver Usage during any month. Such fee shall be payable in arrears, on the fifth day of each month (with respect to the prior month) and
on the Commitment Termination Date. 
 3.2.2    LC Facility Fees. Borrowers shall pay (a) to
Agent, for the Pro Rata benefit of Lenders, a fee equal to the Applicable Margin in effect for Interest Period Loans times the average daily Stated Amount of Letters of Credit, which fee shall be payable monthly in arrears, on the fifth day of each
month with respect to the prior month; (b) to Agent, for its own account, a fronting fee equal to 0.250% per annum on the Stated Amount of each Letter of Credit, which fee shall be payable monthly in arrears, on the fifth day of each month with
respect to the prior month; and (c) to Issuing Bank, for its own account, all customary charges associated with the issuance, amending, negotiating, payment, processing, transfer and administration of Letters of Credit, which charges shall be
paid as and when incurred. When an Event of Default has occurred and is continuing, if Agent or Required Lenders so elect, the fee payable under clause (a) shall be increased by 2% per annum. 

3.2.3    Fee Letters. Borrowers shall pay all fees set forth in any fee letter executed in
connection with this Agreement. 
 3.3    Computation of Interest, Fees, Yield Protection.
All interest, as well as fees and other charges calculated on a per annum basis, shall be computed for the actual days elapsed, based on a year of 365 days with respect to SIBOR Loans and 360 days with respect to all other Obligations. Each
determination by Agent of any interest, fees or interest rate hereunder shall be final, conclusive and binding for all purposes, absent manifest error. All fees shall be fully earned when due and shall not be subject to rebate, refund or proration.
All fees payable under Section 3.2 are compensation for services and are not, and shall not be deemed to be, interest or any other charge for the use, forbearance or detention of money. A certificate as to amounts payable
by Borrowers under Section 3.4, 3.6, 3.7, 3.9 or 5.9 (together with reasonably detailed calculations thereof), submitted to Borrower Agent by Agent or the affected Lender shall be final, conclusive and binding
for all purposes, absent manifest error, and Borrowers shall pay such amounts to the appropriate party within 30 days following receipt of the certificate. 

3.4    Reimbursement Obligations. Borrowers shall reimburse all Extraordinary Expenses
promptly upon written request, including documentation reasonably supporting such request (provided that any legal fees and expenses to be limited to the reasonable and documented
out-of-pocket fees and expenses of one (1) lead firm of counsel representing Agent and the Lenders, if necessary, one (1) local counsel in each relevant local
jurisdiction to Agent and the Lenders; provided in the case of an actual conflict between Agent and Lenders, one additional firm of counsel representing all Lenders). Borrowers shall also reimburse Agent for all reasonable and documented out-of-pocket legal (with such legal fees and expenses to be limited to the reasonable and documented
out-of-pocket fees and expenses of one (1) lead firm of counsel representing Agent and, if necessary, one (1) local counsel in each relevant local jurisdiction
to Agent; provided 

  
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in the case of an actual conflict between Agent and Lenders, one additional firm of counsel representing all Lenders), accounting, appraisal, consulting, and other fees and expenses incurred by
it in connection with (a) negotiation and preparation of any Loan Documents, including any modification thereof; (b) administration of and actions relating to any Collateral, Loan Documents and transactions contemplated thereby, including
any actions taken to perfect or maintain priority of Agent’s Liens on any Collateral, to maintain any insurance required hereunder or to verify Collateral; and (c) subject to the limits of Section 10.1.1(b), any
examination or appraisal with respect to any Obligor or Collateral by Agent’s personnel or a third party. If, for any reason (including inaccurate reporting in any Borrower Materials), it is determined that a higher Applicable Margin should
have applied to a period than was actually applied, then the proper margin shall be applied retroactively and Borrowers shall immediately pay to Agent, for the ratable benefit of Lenders, an amount equal to the difference between the amount of
interest and fees that would have accrued using the proper margin and the amount actually paid. All amounts payable by Borrowers under this Section shall be due on demand. If due to an error by Agent it is determined that a lower Applicable
Margin should have applied to a period than was actually applied, then the proper margin shall be applied retroactively and Agent shall establish a credit for Borrower in an amount equal to the difference between the amount of interest and fees that
would have accrued using the proper margin and the amount actually paid for such period to Lenders. All amounts payable by Borrowers under this Section shall be due promptly following demand therefor. 

3.5    Illegality. If any Lender determines that any Applicable Law has made it unlawful, or
that any Governmental Authority has asserted that it is unlawful, for any Lender to perform any of its obligations hereunder, to make, maintain, fund, participate in, or charge applicable interest or fees with respect to, any Revolver Loan or Letter
of Credit, or to determine or charge interest based on LIBOR or SIBOR, or any Governmental Authority has imposed material restrictions on the authority of such Lender to purchase or sell, or to take deposits of, Available Currency in the London
interbank market, then, on notice thereof by such Lender to Agent, any obligation of such Lender to perform such obligations, to make, maintain, fund or participate in the Revolver Loan or Letter of Credit (or to charge interest or fees otherwise
applicable thereto), or to continue or convert Revolver Loans as Interest Period Loans, shall be suspended until such Lender notifies Borrower Agent that the circumstances giving rise to such determination no longer exist. Upon delivery of such
notice, Borrowers shall prepay the applicable Revolver Loan, Cash Collateralize the applicable LC Obligations or, if applicable, convert Interest Period Loan(s) of such Lender to Floating Rate Loan(s), either on the last day of the Interest Period
therefor, if such Lender may lawfully continue to maintain the Interest Period Loan to such day, or immediately, if such Lender may not lawfully continue to maintain the Interest Period Loan. Upon any such prepayment or conversion, Borrowers shall
also pay accrued interest on the amount so prepaid or converted. 
 3.6    Inability to Determine Rates.

 3.6.1    Agent will immediately notify Borrower Agent and Lenders if, in connection with any
Revolver Loan or request for a Revolver Loan, (a) Agent determines that (i) deposits in the applicable Available Currency are not being offered to banks in the London interbank Eurodollar market for the applicable Revolver Loan amount or
Interest Period, or (ii) adequate and reasonable means do not exist for determining LIBOR or SIBOR on any applicable date or that any Interest Period is not available on the basis 

  
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provided herein; or (b) Agent or Required Lenders determine for any reason that LIBOR or SIBOR for the Interest Period does not adequately and fairly reflect the cost to Lenders of funding
the Revolver Loan. Thereafter, Lenders’ obligations to make or maintain affected Interest Period Loans and utilization of the LIBOR component (if affected) in determining Base Rate shall be suspended until Agent (upon instruction by Required
Lenders) withdraws the notice. Upon receipt of such notice, Borrower Agent may revoke any pending request for a Borrowing of, the conversion of any Borrowing to, or the continuation of any Borrowing as, an Interest Period Loan, or, failing that,
will be deemed to have requested a Floating Rate Loan. 
 3.6.2    If at any time Agent determines (which
determination shall be conclusive absent manifest error) that (a) the circumstances set forth in Section 3.6.1 have arisen and such circumstances are unlikely to be temporary or (b) the circumstances set forth in
Section 3.6.1 have not arisen but the supervisor for the administrator of LIBOR or SIBOR or a Governmental Authority having jurisdiction over Agent has made a public statement identifying a specific date after which LIBOR
or SIBOR shall no longer be used for determining interest rates for loans, then Agent and Borrower Agent shall endeavor to establish an alternate rate of interest to the LIBOR or SIBOR, as applicable, that gives due consideration to the then
prevailing market convention for determining a rate of interest for syndicated loans in the United States at such time, and shall enter into an amendment to this Agreement to reflect such alternate rate of interest and such other related changes to
this Agreement as may be applicable (but for the avoidance of doubt, such related changes shall not include a reduction of the Applicable Margin). Such alternative rate of interest shall at no time be less than 0%. Notwithstanding anything to the
contrary in Section 14.1, such amendment shall become effective without any further action or consent of any other party to this Agreement so long as Agent shall not have received, within five Business Days of the date
notice of such alternate rate of interest is provided to the Lenders, a written notice from the Required Lenders stating that such Required Lenders object to such amendment. Until an alternate rate of interest shall be determined in accordance with
this Section 3.6.2, only to the extent the LIBOR or SIBOR is not available or published at such time on a current basis, (i) any requests for the conversion of any Borrowing to, or continuation of any Borrowing as, a
LIBOR or SIBOR Borrowing shall be ineffective, and (y) if any Borrowing Request requests a LIBOR or SIBOR Borrowing, such Borrowing shall be made as an Base Rate Borrowing. 

3.7    Increased Costs; Capital Adequacy. 

3.7.1    Increased Costs Generally. If any Change in Law shall: 

(a)    impose, modify or deem applicable any reserve, liquidity, special deposit, compulsory loan,
insurance charge or similar requirement against assets of, deposits with or for the account of, or credit extended or participated in by, any Lender (except any reserve requirement reflected in calculating LIBOR and/or SIBOR) or Issuing Bank; 

(b)    subject any Recipient to Taxes (other than (i) Indemnified Taxes, (ii) Taxes described in
clauses (b) through (d) of the definition of Excluded Taxes, 

  
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and (iii) Connection Income Taxes) with respect to any Revolver Loan, Letter of Credit, Revolver Commitment or other obligations, or its deposits, reserves, other liabilities or capital
attributable thereto; or 
 (c)    impose on any Lender, Issuing Bank or interbank market any other
condition, cost or expense (other than Taxes) affecting any Revolver Loan, Letter of Credit, participation in LC Obligations, Revolver Commitment or Loan Document; 

and the result thereof shall be to increase the cost to a Lender of making or maintaining any Revolver Loan or Revolver Commitment, or converting to or
continuing any interest option for a Revolver Loan, or to increase the cost to a Lender or Issuing Bank of participating in, issuing or maintaining any Letter of Credit (or of maintaining its obligation to participate in or to issue any Letter of
Credit), or to reduce the amount of any sum received or receivable by a Lender or Issuing Bank hereunder (whether of principal, interest or any other amount) then, within 10 Business Days of the request of such Lender or Issuing Bank, Borrowers will
pay to it such additional amount(s) as will compensate it for the additional costs incurred or reduction suffered. 

3.7.2    Capital Requirements. If a Lender or Issuing Bank determines that a Change in Law affecting
such Lender or Issuing Bank or its holding company, if any, regarding capital or liquidity requirements has or would have the effect of reducing the rate of return on such Lender’s, Issuing Bank’s or holding company’s capital as a
consequence of this Agreement, or such Lender’s or Issuing Bank’s Revolver Commitments, Revolver Loans, Letters of Credit or participations in LC Obligations or Revolver Loans, to a level below that which such Lender, Issuing Bank or
holding company could have achieved but for such Change in Law (taking into consideration its policies with respect to capital adequacy), then from time to time Borrowers will pay to such Lender or Issuing Bank, as the case may be, such additional
amounts as will compensate it or its holding company for the reduction suffered. 
 3.7.3    Interest
Period Loan Reserves. If any Lender is required to maintain reserves with respect to liabilities or assets consisting of or including Eurocurrency funds or deposits, Borrowers shall pay additional interest to such Lender on each Interest Period
Loan equal to the costs of such reserves allocated to the Revolver Loan by the Lender (as determined by it in good faith, which determination shall be conclusive). The additional interest shall be due and payable on each interest payment date for
the Revolver Loan; provided, that if the Lender notifies Borrowers (with a copy to Agent) of the additional interest less than 10 days prior to the interest payment date, then such interest shall be payable 10 days after Borrowers’
receipt of the notice. 
 3.7.4    Compensation. Failure or delay on the part of any Lender or
Issuing Bank to demand compensation pursuant to this Section shall not constitute a waiver of its right to demand such compensation, but Borrowers shall not be required to compensate a Lender or Issuing Bank for any increased costs or reductions
suffered more than nine months (plus any period of retroactivity of the Change in Law giving rise to the demand) prior to the date that the Lender or Issuing Bank notifies Borrower Agent of the applicable Change in Law and of such Lender’s or
Issuing Bank’s intention to claim compensation therefor. 

  
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 3.8    Mitigation. If any Lender gives a notice under
Section 3.5 or requests compensation under Section 3.7, or if Borrowers are required to pay any Indemnified Taxes or additional amounts with respect to a Lender under
Section 5.9, then at the request of Borrower Agent, such Lender shall use reasonable efforts to designate a different Lending Office or to assign its rights and obligations hereunder to another of its offices, branches or
Affiliates, if, in the judgment of such Lender, such designation or assignment (a) would eliminate the need for such notice or reduce amounts payable or to be withheld in the future, as applicable; and (b) would not subject the Lender to
any unreimbursed cost or expense and would not otherwise be disadvantageous to it or unlawful. Borrowers shall pay all reasonable costs and expenses incurred by any Lender in connection with any such designation or assignment. 

3.9    Funding Losses. If for any reason (other than a default by any Lender of its funding
obligations hereunder or the application of Section 3.5 or Section 3.6) (a) any Borrowing, conversion or continuation of an Interest Period Loan does not occur on the date specified therefor in a
Notice of Borrowing or Notice of Conversion/Continuation (whether or not withdrawn), (b) any repayment or conversion of an Interest Period Loan occurs on a day other than the end of its Interest Period, (c) Borrowers fail to repay an Interest
Period Loan when required hereunder, or (d) a Lender (other than a Defaulting Lender) is required to assign an Interest Period Loan prior to the end of its Interest Period pursuant to Section 13.4, then Borrowers shall
pay to Agent its customary administrative charge and to each Lender all losses, expenses and fees arising from redeployment of funds or termination of match funding. For purposes of calculating amounts payable under this Section, a Lender shall be
deemed to have funded an Interest Period Loan by a matching deposit or other borrowing in the London interbank market for a comparable amount and period, whether or not the Revolver Loan was in fact so funded. 

3.10    Maximum Interest. Notwithstanding anything to the contrary contained in any Loan
Document, the interest paid or agreed to be paid under the Loan Documents shall not exceed the maximum rate of non-usurious interest permitted by Applicable Law (“maximum rate”). If Agent or
any Lender shall receive interest in an amount that exceeds the maximum rate, the excess interest shall be applied to the principal of the Obligations or, if it exceeds such unpaid principal, refunded to Borrowers. In determining whether the
interest contracted for, charged or received by Agent or a Lender exceeds the maximum rate, such Person may, to the extent permitted by Applicable Law, (a) characterize any payment that is not principal as an expense, fee or premium rather than
interest; (b) exclude voluntary prepayments and the effects thereof; and (c) amortize, prorate, allocate and spread in equal or unequal parts the total amount of interest throughout the contemplated term of the Obligations hereunder. 

SECTION 4.    LOAN ADMINISTRATION 

4.1    Manner of Borrowing and Funding Revolver Loans. 

4.1.1    Notice of Borrowing. 

(a)    To request Revolver Loans, Borrower Agent shall give Agent a Notice of Borrowing by 11:00 a.m.
(i) on the requested funding date, in the case of Floating Rate Loans, and (ii) at least three Business Days prior to the requested funding date, in the case of Interest Period Loans. Notices received by Agent after


  
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such time shall be deemed received on the next Business Day. Each Notice of Borrowing shall be irrevocable and shall specify (A) the Borrowing amount, (B) the requested funding date
(which must be a Business Day), (C) whether the Borrowing is to be made as a Floating Rate Loan or Interest Period Loan, and (D) in the case of an Interest Period Loan, the applicable Interest Period (which shall be deemed to be one month if
not specified). 
 (b)    Unless payment is otherwise made by Borrowers, the becoming due of any
Obligation (whether principal, interest, fees or other charges, including Extraordinary Expenses, LC Obligations, Cash Collateral and Secured Bank Product Obligations) shall be deemed to be a request for a Floating Rate Loan or Swingline Loan (as
determined by Agent) on the due date in the amount due and the Revolver Loan proceeds shall be disbursed as direct payment of such Obligation. In addition, Agent may, at its option, charge such amount against any operating, investment or other
account of a Borrower maintained with Agent. 
 (c)    If a Borrower maintains a disbursement account
with Agent or any of its Affiliates, then presentation for payment in the account of a Payment Item when there are insufficient funds to cover it shall be deemed to be a request for a Floating Rate Loan on the presentation date, in the amount of the
Payment Item. Proceeds of the Revolver Loan may be disbursed directly to the account. 

4.1.2    Fundings by Lenders. Except for Swingline Loans, Agent shall endeavor to notify Lenders of
each Notice of Borrowing (or deemed request for a Borrowing) by 1:00 p.m. on the proposed funding date for a Floating Rate Loans or by 3:00 p.m. three Business Days before a proposed funding of Interest Period Loans. Each Lender shall fund its Pro
Rata share of a Borrowing in immediately available funds not later than 3:00 p.m. on the requested funding date, unless Agent’s notice is received after the times provided above, in which case Lender shall fund by 11:00 a.m. on the next
Business Day. Subject to its receipt of such amounts from Lenders, Agent shall disburse the Borrowing proceeds in a manner directed by Borrower Agent and acceptable to Agent. Unless Agent receives (in sufficient time to act) written notice from a
Lender that it will not fund its share of a Borrowing, Agent may assume that such Lender has deposited or promptly will deposit its share with Agent, and Agent may disburse a corresponding amount to Borrowers. If a Lender’s share of a Borrowing
or of a settlement under Section 4.1.3(b) is not received by Agent, then Borrowers agree to repay to Agent on demand the amount of such share, together with interest thereon from the date disbursed until repaid, at
the rate applicable to the Borrowing. Agent, a Lender or Issuing Bank may fulfill its obligations under Loan Documents through one or more Lending Offices, and this shall not affect any obligation of Obligors under the Loan Documents or with respect
to any Obligations. 
 4.1.3    Swingline Loans; Settlement. 

(a)    To fulfill any request for a Floating Rate Loan hereunder, Agent may (through one or more of its
Lending Offices) in its discretion advance Swingline Loans to Borrowers, up to an aggregate outstanding amount of $25,000,000. Swingline Loans shall constitute Revolver Loans for all purposes, except that payments thereon shall be made to Agent for
its own account until settled with or funded by Lenders hereunder. 

  
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 (b)    Settlement of Revolver Loans, including Swingline
Loans, among Lenders and Agent (or its applicable Lending Office) shall take place on a date determined from time to time by Agent (but at least weekly, unless the settlement amount is de minimis), on a Pro Rata basis in accordance with the
Settlement Report delivered by Agent to Lenders. Between settlement dates, Agent may in its discretion apply payments on Revolver Loans to Swingline Loans, regardless of any designation by Borrowers or anything herein to the contrary. Each Lender
hereby purchases, without recourse or warranty, an undivided Pro Rata participation in all Swingline Loans outstanding from time to time until settled. If a Swingline Loan cannot be settled among Lenders, whether due to an Obligor’s Insolvency
Proceeding or for any other reason, each Lender shall pay the amount of its participation in the Revolver Loan to Agent, in immediately available funds, within one Business Day after Agent’s request therefor. Lenders’ obligations to make
settlements and to fund participations are absolute, irrevocable and unconditional, without offset, counterclaim or other defense, and whether or not the Revolver Commitments have terminated, an Overadvance exists or the conditions in
Section 6 are satisfied. 
 4.1.4    Notices. If Borrowers request,
convert or continue Revolver Loans, select interest rates or transfer funds based on telephonic or electronic instructions to Agent, Borrowers shall confirm the request by prompt delivery to Agent of a Notice of Borrowing or Notice of
Conversion/Continuation, as applicable. Agent and Lenders are not liable for any loss suffered by a Borrower as a result of Agent acting on its understanding of telephonic or electronic instructions from a person believed in good faith to be
authorized to give instructions on a Borrower’s behalf. 
 4.2    Defaulting Lender.
Notwithstanding anything herein to the contrary: 
 4.2.1    Reallocation of Pro Rata Share;
Amendments. For purposes of determining Lenders’ obligations or rights to fund, participate in or receive collections with respect to Revolver Loans and Letters of Credit (including existing Swingline Loans, Protective Advances and LC
Obligations), Agent shall reallocate Pro Rata shares by excluding a Defaulting Lender’s Revolver Commitments and Revolver Loans from the calculation of shares. A Defaulting Lender shall have no right to vote on any amendment, waiver or other
modification of a Loan Document, except as provided in Section 14.1.1(c). 

4.2.2    Payments; Fees. Agent shall receive and retain any amounts payable to a Defaulting Lender
under the Loan Documents, and a Defaulting Lender shall be deemed to have assigned to Agent such amounts until all Obligations owing to Agent, non-Defaulting Lenders and other Secured Parties have been paid in
full. Agent may use such amounts to cover the Defaulting Lender’s defaulted obligations, to Cash Collateralize such Lender’s Fronting Exposure, to readvance the amounts to Borrowers or to repay Obligations. A Lender shall not be entitled
to receive any fees accruing hereunder while it is a Defaulting Lender and its unfunded Revolver Commitment shall be disregarded for 

  
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purposes of calculating the unused line fee under Section 3.2.1. If any LC Obligations owing to a Defaulted Lender are reallocated to other Lenders, fees attributable to
such LC Obligations under Section 3.2.2 shall be paid to such Lenders. Agent shall be paid all fees attributable to LC Obligations that are not reallocated. 

4.2.3    Status; Cure. Agent may determine in its Permitted Discretion that a Lender constitutes a
Defaulting Lender and the effective date of such status shall be conclusive and binding on all parties, absent manifest error. Borrowers, Agent and Issuing Bank may agree in writing that a Lender has ceased to be a Defaulting Lender, whereupon Pro
Rata shares shall be reallocated without exclusion of the reinstated Lender’s Revolver Commitments and Revolver Loans, and the Revolver Usage and other exposures under the Revolver Commitments shall be reallocated among Lenders and settled by
Agent (with appropriate payments by the reinstated Lender, including its payment of breakage costs for reallocated Interest Period Loans) in accordance with the readjusted Pro Rata shares. Unless expressly agreed by Borrowers, Agent and Issuing
Bank, or as expressly provided herein with respect to Bail-In Actions and related matters, no reallocation of Revolver Commitments and Revolver Loans to non-Defaulting
Lenders or reinstatement of a Defaulting Lender shall constitute a waiver or release of claims against such Lender. The failure of any Lender to fund a Revolver Loan, to make a payment in respect of LC Obligations or otherwise to perform obligations
hereunder shall not relieve any other Lender of its obligations under any Loan Document. No Lender shall be responsible for default by another Lender. 

4.3    Number and Amount of Interest Period Loans; Determination of Rate. Each Borrowing of
Interest Period Loans when made shall be in a minimum amount of $5,000,000, plus an increment of $100,000 in excess thereof. No more than ten (10) aggregated Interest Period Loans may be outstanding at any time. Upon determining LIBOR or SIBOR,
as applicable, for any Interest Period requested by Borrowers, Agent shall promptly notify Borrowers thereof by telephone or electronically and, if requested by Borrowers, shall confirm any telephonic notice in writing. 

4.4    Borrower Agent. Each Borrower hereby designates Amkor Singapore (“Borrower
Agent”) as its representative and agent for all purposes under the Loan Documents, including requests for and receipt of Revolver Loans and Letters of Credit, designation of interest rates, delivery or receipt of communications, delivery of
Borrower Materials, payment of Obligations, requests for waivers, amendments or other accommodations, actions under the Loan Documents (including in respect of compliance with covenants), and all other dealings with Agent, Issuing Bank or any
Lender. Borrower Agent hereby accepts such appointment. Agent and Lenders shall be entitled to rely upon, and shall be fully protected in relying upon, any notice or communication (including any Notice of Borrowing or Notice of
Conversion/Continuation) delivered by Borrower Agent on behalf of any Borrower. Agent and Lenders may give any notice or communication with a Borrower hereunder to Borrower Agent on behalf of such Borrower. Each of Agent, Issuing Bank and Lenders
shall have the right, in its discretion, to deal exclusively with Borrower Agent for all purposes under the Loan Documents. Each Borrower agrees that any notice, election, communication, delivery, representation, agreement, action, omission or
undertaking by Borrower Agent shall be binding upon and enforceable against such Borrower. 

  
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 4.5    One Obligation. The Revolver Loans, LC
Obligations and other Obligations constitute one general obligation of Borrowers (unless otherwise expressly provided in any Loan Document) and are secured by Agent’s Lien on all Collateral; provided, that Agent and each Lender shall be
deemed to be a creditor of, and the holder of a separate claim against, each Borrower to the extent of any Obligations jointly or severally owed by such Borrower. 

4.6    Effect of Termination. On the effective date of the termination of all Revolver
Commitments, the Obligations shall be immediately due and payable, and each Secured Bank Product Provider may terminate its Bank Products. Until Full Payment of the Obligations, all undertakings of Borrowers contained in the Loan Documents shall
continue, and Agent shall retain its Liens in the Collateral and all of its rights and remedies under the Loan Documents. Agent shall not be required to terminate its Liens unless it receives Cash Collateral or a written agreement, in each case
reasonably satisfactory to it, protecting Agent and Lenders from dishonor or return of any Payment Item previously applied to the Obligations. Sections 2.3, 3.4, 3.6, 3.7, 3.9, 5.5, 5.9, 5.10, 12, 14.2, this Section, and
each indemnity or waiver given by an Obligor or Lender in any Loan Document, shall survive Full Payment of the Obligations. 
 SECTION
5.    PAYMENTS 
 5.1    General Payment Provisions. All payments of
Obligations shall be made in the Available Currency in which such Obligation was incurred, without offset, counterclaim or defense of any kind, free and clear of (and without deduction for) any Taxes, unless otherwise provided in
Section 5.9, and in immediately available funds, not later than 12:00 noon on the due date. Any payment after such time shall be deemed made on the next Business Day. If any payment under the Loan Documents shall be stated
to be due on a day other than a Business Day, the due date shall be extended until the next Business Day and such extension of time shall be included in any computation of interest and fees. Borrowers may, at the time of payment, specify to Agent
the Obligations to which such payment is to be applied, but Agent shall in all events retain the right to apply such payment in such manner as Agent, subject to the provisions hereof, may determine to be appropriate. Any payment of an Interest
Period Loan prior to the end of its Interest Period shall be accompanied by all amounts due under Section 3.9. Any prepayment of Revolver Loans shall be applied first to Floating Rate Loans and then to Interest Period
Loans. 
 5.2    Repayment of Revolver Loans. Revolver Loans shall be due and payable in
full on the Revolver Termination Date, unless payment is sooner required hereunder. Revolver Loans may be prepaid from time to time, without penalty or premium. Subject to Section 2.1.5, if an Overadvance exists at any
time, Borrowers shall, on the sooner of Agent’s demand or the first Business Day after any Borrower has knowledge thereof, repay Revolver Loans in an amount sufficient to reduce Revolver Usage to the Borrowing Base. 

5.3    Reserved. 

5.4    Payment of Other Obligations. Obligations other than Revolver Loans, including LC
Obligations and Extraordinary Expenses, shall be paid by Borrowers as provided in the Loan Documents or, if no payment date is specified, on demand. 

  
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 5.5    Marshaling; Payments Set Aside. None of
Agent or Lenders shall be under any obligation to marshal any assets in favor of any Obligor or against any Obligations. If any payment by or on behalf of Borrowers is made to Agent, Issuing Bank or any Lender, or if Agent, Issuing Bank or any
Lender exercises a right of setoff, and any of such payment or setoff is subsequently invalidated, declared to be fraudulent or preferential, set aside or required (including pursuant to any settlement entered into by Agent, Issuing Bank or a Lender
in its discretion) to be repaid to a trustee, receiver or any other Person, then the Obligation originally intended to be satisfied, and all Liens, rights and remedies relating thereto, shall be revived and continued in full force and effect as if
such payment or setoff had not occurred. 
 5.6    Application and Allocation of Payments. 

5.6.1    Application. Payments made by Borrowers hereunder shall be applied (a) first,
as specifically required hereby; (b) second, to Obligations then due and owing; (c) third, to other Obligations specified by Borrowers; and (d) fourth, as determined by Agent in its discretion. 

5.6.2    Post-Default Allocation. Notwithstanding anything in any Loan Document to the contrary,
when an Event of Default under Section 11.1(j) has occurred and is continuing, or when any other Event of Default has occurred and is continuing at the discretion of Agent or Required Lenders, monies to be applied to the
Obligations, whether arising from payments by Obligors, realization on Collateral, setoff or otherwise, shall be allocated as follows: 

(a)    first, to all fees, indemnification, costs and expenses, including Extraordinary Expenses,
owing to Agent; 
 (b)    second, to all other amounts owing to Agent, including Swingline Loans,
Protective Advances, and Revolver Loans and participations that a Defaulting Lender has failed to settle or fund; 

(c)    third, to all amounts owing to Issuing Bank; 

(d)    fourth, to all Obligations (other than Secured Bank Product Obligations) constituting fees,
indemnification, costs or expenses owing to Lenders; 
 (e)    fifth, to all Obligations (other
than Secured Bank Product Obligations) constituting interest; 
 (f)    sixth, to Cash
Collateralize all LC Obligations; 
 (g)    seventh, to all Revolver Loans; 

(h)    eighth, to all Secured Bank Product Obligations; and 

(i)    last, to all remaining Obligations. 

  
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 Amounts shall be applied to payment of each category of Obligations only after Full Payment of amounts payable
from time to time under all preceding categories. If amounts are insufficient to satisfy a category, they shall be paid ratably among outstanding Obligations in the category. Monies and proceeds obtained from an Obligor shall not be applied to its
Excluded Swap Obligations, but appropriate adjustments shall be made with respect to amounts obtained from other Obligors to preserve the allocations in each category. Agent shall have no obligation to calculate the amount of any Secured Bank
Product Obligation and may request a reasonably detailed calculation thereof from a Secured Bank Product Provider. If the provider fails to deliver the calculation within three days following request, Agent may assume the amount is zero unless a
prior calculation has been provided by the applicable Secured Bank Product Provider, in which case the amount set forth on such prior calculation shall be the amount of the Secured Bank Product Obligation. The allocations in this Section are solely
to determine the priorities among Secured Parties and may be changed by agreement of affected Secured Parties without the consent of any Obligor. This Section is not for the benefit of or enforceable by any Obligor, and no Obligor has any right to
direct the application of payments or Collateral proceeds subject to this Section. 

5.6.3    Erroneous Application. Agent shall not be liable for any application of amounts made by it
in good faith and, if any such application is subsequently determined to have been made in error, the sole recourse of any Lender or other Person to which such amount should have been paid shall be to recover the amount from the Person that actually
received it (and, if such amount was received by a Secured Party, the Secured Party agrees to return it). 

5.7    Dominion Account. The ledger balance in the main Dominion Account as of the end of a Business
Day shall be applied to the Obligations at the beginning of the next Business Day, during any Triggered Activation Period. Any resulting credit balance shall not accrue interest in favor of Borrowers and shall be made available to Borrowers as long
as no Event of Default exists. 
 5.8    Account Stated. Agent shall maintain, in accordance with
its customary practices, loan account(s) evidencing the Debt of Borrowers hereunder. Any failure of Agent to record anything in a loan account, or any error in doing so, shall not limit or otherwise affect the obligation of Borrowers to pay any
amount owing hereunder. Entries made in a loan account shall constitute presumptive evidence of the information contained therein. If any information contained in a loan account is provided to or inspected by any Person, the information shall be
conclusive and binding on such Person for all purposes absent manifest error, except to the extent such Person notifies Agent in writing within 30 days after receipt or inspection that specific information is subject to dispute. 

5.9    Taxes. 

5.9.1    Payments Free of Taxes; Obligation to Withhold; Tax Payment 

(a)    All payments of Obligations by Obligors shall be made without deduction or withholding for any
Taxes, except as required by Applicable Law. If Applicable Law (as determined in the good faith discretion of Agent or applicable Obligor) requires the deduction or withholding of any Tax from any such payment


  
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by Agent or an Obligor, then Agent or such Obligor shall be entitled to make such deduction or withholding based on information and documentation provided pursuant to
Section 5.10. 
 (b)    If Agent or any Obligor is required by the Code to
withhold or deduct Taxes, including backup withholding and withholding taxes, from any payment, then (i) Agent shall pay the full amount that it determines is to be withheld or deducted to the relevant Governmental Authority pursuant to the
Code, and (ii) to the extent the withholding or deduction is made on account of Indemnified Taxes, the sum payable by the applicable Obligor shall be increased as necessary so that the Recipient receives an amount equal to the sum it would have
received had no such withholding or deduction been made. 
 (c)    If Agent or any Obligor is required by
any Applicable Law other than the Code to withhold or deduct Taxes from any payment, then (i) Agent or such Obligor, to the extent required by Applicable Law, shall timely pay the full amount to be withheld or deducted to the relevant
Governmental Authority, and (ii) to the extent the withholding or deduction is made on account of Indemnified Taxes, the sum payable by the applicable Obligor shall be increased as necessary so that the Recipient receives an amount equal to the
sum it would have received had no such withholding or deduction been made. 
 5.9.2    Payment of Other Taxes.
Without limiting the foregoing, Borrowers shall timely pay to the relevant Governmental Authority in accordance with Applicable Law, or at Agent’s option, timely reimburse Agent for payment of, any Other Taxes. 

5.9.3    Tax Indemnification. 

(a)    Each Borrower shall indemnify and hold harmless, on a joint and several basis, each Recipient
against any Indemnified Taxes (including those imposed or asserted on or attributable to amounts payable under this Section) payable or paid by a Recipient or required to be withheld or deducted from a payment to a Recipient, and any reasonable
expenses arising therefrom or with respect thereto, whether or not such Indemnified Taxes were correctly or legally imposed or asserted by the relevant Governmental Authority. Each Borrower shall indemnify and hold harmless Agent against any amount
that a Lender or Issuing Bank fails for any reason to pay indefeasibly to Agent as required pursuant to this Section. Each Borrower shall make payment within 10 days after written demand for any amount or liability payable under this Section. A
certificate as to the amount of such payment or liability delivered to Borrowers by a Lender or Issuing Bank (with a copy to Agent), or by Agent on its own behalf or on behalf of any Recipient, shall be conclusive absent manifest error. 

(b)    Each Lender and Issuing Bank shall indemnify and hold harmless, on a several basis, (i) Agent
against any Indemnified Taxes attributable to such Lender or Issuing Bank (but only to the extent Borrowers have not already paid or reimbursed Agent therefor and without limiting Borrowers’ obligation to do so),


  
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(ii) Agent and Obligors, as applicable, against any Taxes attributable to such Lender’s failure to maintain a Participant Register as required hereunder, and (iii) Agent and Obligors,
as applicable, against any Excluded Taxes attributable to such Lender or Issuing Bank, in each case, that are payable or paid by Agent or an Obligor in connection with any Obligations, and any reasonable expenses arising therefrom or with respect
thereto, whether or not such Indemnified Taxes were correctly or legally imposed or asserted by the relevant Governmental Authority. Each Lender and Issuing Bank shall make payment within 10 days after demand for any amount or liability payable
under this Section. A certificate as to the amount of such payment or liability delivered to any Lender or Issuing Bank by Agent shall be conclusive absent manifest error. 

5.9.4    Evidence of Payments. As soon as practicable after payment by an Obligor of any Taxes
pursuant to this Section, Borrower Agent shall deliver to Agent the original or a certified copy of a receipt issued by the appropriate Governmental Authority evidencing the payment, a copy of any return required by Applicable Law to report the
payment or other evidence of payment reasonably satisfactory to Agent. 
 5.9.5    Treatment of
Certain Refunds. If a Recipient determines in its discretion that it has received a refund of Taxes that were indemnified by Borrowers or with respect to which a Borrower paid additional amounts pursuant to this Section, it shall pay the amount
of such refund to Borrowers (but only to the extent of indemnity payments or additional amounts actually paid by Borrowers with respect to the Taxes giving rise to the refund), net of all out-of-pocket expenses (including Taxes) incurred by such Recipient and without interest (other than interest paid by the relevant Governmental Authority with respect to such refund). Borrowers shall, upon
request by the Recipient, repay to the Recipient such amount paid over to Borrowers (plus any penalties, interest or other charges imposed by the relevant Governmental Authority) if the Recipient is required to repay such refund to the Governmental
Authority. Notwithstanding anything herein to the contrary, no Recipient shall be required to pay any amount to Borrowers if such payment would place it in a less favorable net after-Tax position than it would
have been in if the Tax subject to indemnification and giving rise to such refund had not been deducted, withheld or otherwise imposed and the indemnification payments or additional amounts with respect to such Tax had never been paid. In no event
shall Agent or any Recipient be required to make its tax returns (or any other information relating to its taxes that it deems confidential) available to any Obligor or other Person. 

5.9.6    Survival. Each party’s obligations under Sections 5.9 and 5.10 shall
survive the resignation or replacement of Agent or any assignment of rights by or replacement of a Lender or Issuing Bank, the termination of the Revolver Commitments, and the repayment, satisfaction, discharge or Full Payment of any Obligations.

 5.10    Lender Tax Information. 

5.10.1    Status of Lenders. Any Lender that is entitled to an exemption from or reduction of
withholding Tax with respect to payments of Obligations shall deliver to Borrowers and Agent properly completed and executed documentation reasonably 

  
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requested by Borrowers or Agent as will permit such payments to be made without or at a reduced rate of withholding. In addition, any Lender, if reasonably requested by Borrowers or Agent, shall
deliver such other documentation prescribed by Applicable Law or reasonably requested by Borrowers or Agent to enable them to determine whether such Lender is subject to backup withholding or information reporting requirements. Notwithstanding the
foregoing, such documentation (other than documentation described in Sections 5.10.2(a), (b) and (d)) shall not be required if a Lender reasonably believes delivery of the documentation would subject it to any material unreimbursed
cost or expense or would materially prejudice its legal or commercial position. 

5.10.2    Documentation. Without limiting the foregoing, if any Borrower is a U.S. Person, 

(a)    Any Lender that is a U.S. Person shall deliver to Borrowers and Agent on or prior to the date on
which such Lender becomes a Lender hereunder (and from time to time thereafter upon reasonable request of Borrowers or Agent), executed copies of IRS Form W-9 (or applicable successor form), certifying that
such Lender is exempt from U.S. federal backup withholding Tax; 
 (b)    Any Foreign Lender shall, to
the extent it is legally entitled to do so, deliver to Borrowers and Agent (in such number of copies as shall be requested by the recipient) on or prior to the date on which such Foreign Lender becomes a Lender hereunder (and from time to time
thereafter upon reasonable request of Borrowers or Agent), whichever of the following is applicable: 
 (i)    in the
case of a Foreign Lender claiming the benefits of an income tax treaty to which the United States is a party, (x) with respect to payments of interest under any Loan Document, executed copies of IRS Form
W-8BEN (or applicable successor form) or, as applicable, W-8BEN-E (or applicable successor form) establishing an exemption from
or reduction of U.S. federal withholding Tax pursuant to the “interest” article of such tax treaty, and (y) with respect to other payments under the Loan Documents, IRS Form W-8BEN (or
applicable successor form) or, as applicable, W-8BEN-E (or applicable successor form)establishing an exemption from or reduction of U.S. federal withholding Tax pursuant
to the “business profits” or “other income” article of such tax treaty; 
 (ii)    executed copies
of IRS Form W-8ECI (or applicable successor form); 
 (iii)    in the case of a
Foreign Lender claiming the benefits of the exemption for portfolio interest under Section 881(c) of the Code, (x) a certificate in form reasonably satisfactory to Agent to the effect that such Foreign Lender is not a “bank”
within the meaning of Section 881(c)(3)(A) of the Code, a “10 percent shareholder” of a Borrower within the meaning of Section 881(c)(3)(B) of the Code, or a “controlled foreign corporation” described in
Section 881(c)(3)(C) of the Code (“U.S. Tax Compliance Certificate”), and (y) executed copies of IRS Form W-8BEN (or applicable successor form) or, as applicable, W-8BEN-E (or applicable successor form); or 

  
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 (iv)    to the extent a Foreign Lender is not the beneficial owner, executed
copies of IRS Form W-8IMY (or applicable successor form), accompanied by IRS Form W-8ECI (or applicable successor form), IRS Form
W-8BEN (or applicable successor form) or, as applicable, W-8BEN-E (or applicable successor form), a U.S. Tax Compliance
Certificate in form reasonably satisfactory to Agent, IRS Form W-9 (or applicable successor form), and/or other certification documents from each beneficial owner, as applicable; provided, that if the
Foreign Lender is a partnership and one or more of its direct or indirect partners is claiming the portfolio interest exemption, such Foreign Lender may provide a U.S. Tax Compliance Certificate on behalf of each such partner; 

(c)    any Foreign Lender shall, to the extent it is legally entitled to do so, deliver to Borrowers and
Agent (in such number of copies as shall be requested by the recipient) on or prior to the date on which such Foreign Lender becomes a Lender hereunder (and from time to time thereafter upon reasonable request), executed copies of any other form
prescribed by Applicable Law as a basis for claiming exemption from or a reduction in U.S. federal withholding Tax, duly completed, together with such supplementary documentation as may be prescribed by Applicable Law to permit Borrowers or Agent to
determine the withholding or deduction required to be made; and 
 (d)    if payment of an Obligation to
a Lender would be subject to U.S. federal withholding Tax imposed by FATCA if such Lender were to fail to comply with the applicable reporting requirements of FATCA (including those contained in Section 1471(b) or 1472(b) of the Code), such
Lender shall deliver to Borrowers and Agent, at the time(s) prescribed by Applicable Law and otherwise upon reasonable request, such documentation prescribed by Applicable Law (including Section 1471(b)(3)(C)(i) of the Code) and such additional
documentation as may be appropriate for Borrowers or Agent to comply with their obligations under FATCA and to determine that such Lender has complied with its obligations under FATCA or to determine the amount to deduct and withhold from such
payment. Solely for purposes of this clause (d), “FATCA” shall include any amendments made to FATCA after the date hereof. 

5.10.3    Redelivery of Documentation. If any form or certification previously delivered by a Lender
pursuant to this Section expires or becomes obsolete or inaccurate in any respect, such Lender shall promptly update the form or certification or promptly notify Borrowers and Agent in writing of its legal inability to do so. 

5.10.4    Defined Terms. For purposes of this Section 5.10, the term “Lender”
includes any Issuing Bank and the term “Applicable Law” includes FATCA. 
 5.11    Nature and Extent of
Each Borrower’s Liability. 
 5.11.1    Joint and Several Liability.
Each Borrower agrees that it is jointly and severally liable for, and absolutely and unconditionally guarantees to Agent and Lenders the prompt payment and performance of, all Obligations, except its Excluded Swap Obligations. Each Borrower agrees
that its guaranty obligations hereunder constitute a 

  
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continuing guaranty of payment and not of collection, that such obligations shall not be discharged until Full Payment of the Obligations, and that such obligations are absolute and
unconditional, irrespective of (a) the genuineness, validity, regularity, enforceability, subordination or any future modification of, or change in, any Obligations or Loan Document, or any other document, instrument or agreement to which any
Obligor is or may become a party or be bound; (b) the absence of any action to enforce this Agreement (including this Section) or any other Loan Document, or any waiver, consent or indulgence of any kind by Agent or any Lender with respect
thereto; (c) the existence, value or condition of, or failure to perfect a Lien or to preserve rights against, any security or guaranty for any Obligations or any action, or the absence of any action, by Agent or any Lender in respect thereof
(including the release of any security or guaranty); (d) the insolvency of any Obligor; (e) any election by Agent or any Lender in an Insolvency Proceeding for the application of Section 1111(b)(2) of the Bankruptcy Code; (f) any
borrowing or grant of a Lien by any other Borrower, as debtor-in-possession under Section 364 of the Bankruptcy Code or otherwise; (g) the disallowance of any
claims of Agent or any Lender against any Obligor for the repayment of any Obligations under Section 502 of the Bankruptcy Code or otherwise; or (h) any other action or circumstances that might otherwise constitute a legal or equitable
discharge or defense of a surety or guarantor, except Full Payment of the Obligations. 

5.11.2    Waivers. 

(a)    To the extent permitted by Applicable Law, each Borrower expressly waives all rights that it may
have now or in the future under any statute, at common law, in equity or otherwise, to compel Agent or Lenders to marshal assets or to proceed against any Obligor, other Person or security for the payment or performance of any Obligations before, or
as a condition to, proceeding against such Borrower. To the extent permitted by Applicable Law, each Borrower waives all defenses available to a surety, guarantor or accommodation co-obligor other than Full
Payment of Obligations and waives, to the extent permitted by Applicable Law, any right to revoke any guaranty of Obligations as long as it is a Borrower. It is agreed among each Borrower, Agent and Lenders that the provisions of this
Section 5.11 are of the essence of the transaction contemplated by the Loan Documents and that, but for such provisions, Agent and Lenders would decline to make Revolver Loans and issue Letters of Credit. Each Borrower
acknowledges that its guaranty pursuant to this Section is necessary to the conduct and promotion of its business, and can be expected to benefit such business. 

(b)    Agent and Lenders may, in their discretion, pursue such rights and remedies as they deem
appropriate, including realization upon Collateral by judicial foreclosure or nonjudicial sale or enforcement, without affecting any rights and remedies under this Section 5.11. If, in taking any action in connection with
the exercise of any rights or remedies, Agent or any Lender shall forfeit any other rights or remedies, including the right to enter a deficiency judgment against any Borrower or other Person, whether because of any Applicable Laws pertaining to
“election of remedies” or otherwise, each Borrower consents to such action and waives any claim based upon it, even if the action may result in loss of any rights 

  
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of subrogation that any Borrower might otherwise have had. Any election of remedies that results in denial or impairment of the right of Agent or any Lender to seek a deficiency judgment against
any Borrower shall not impair any other Borrower’s obligation to pay the full amount of the Obligations. To the extent permitted by Applicable Law, each Borrower waives all rights and defenses arising out of an election of remedies, such as
nonjudicial foreclosure with respect to any security for Obligations, even though that election of remedies destroys such Borrower’s rights of subrogation against any other Person. Agent may bid Obligations, in whole or part, at any
foreclosure, trustee or other sale, including any private sale, and the amount of such bid need not be paid by Agent but shall be credited against the Obligations. The amount of the successful bid at any such sale, whether Agent or any other Person
is the successful bidder, shall be conclusively deemed to be the fair market value of the Collateral, and the difference between such bid amount and the remaining balance of the Obligations shall be conclusively deemed to be the amount of the
Obligations guaranteed under this Section 5.11, notwithstanding that any present or future law or court decision may have the effect of reducing the amount of any deficiency claim to which Agent or any Lender might
otherwise be entitled but for such bidding at any such sale. 
 5.11.3    Extent of Liability;
Contribution. 
 (a)    Notwithstanding anything herein to the contrary, each Borrower’s
liability under this Section 5.11 shall not exceed the greater of (i) all amounts for which such Borrower is primarily liable, as described in clause (c) below, and (ii) such Borrower’s Allocable Amount.

 (b)    If any Borrower makes a payment under this Section 5.11 of any
Obligations (other than amounts for which such Borrower is primarily liable) (a “Guarantor Payment”) that, taking into account all other Guarantor Payments previously or concurrently made by any other Borrower, exceeds the amount
that such Borrower would otherwise have paid if each Borrower had paid the aggregate Obligations satisfied by such Guarantor Payments in the same proportion that such Borrower’s Allocable Amount bore to the total Allocable Amounts of all
Borrowers, then such Borrower shall be entitled to receive contribution and indemnification payments from, and to be reimbursed by, each other Borrower for the amount of such excess, ratably based on their respective Allocable Amounts in effect
immediately prior to such Guarantor Payment. The “Allocable Amount” for any Borrower shall be the maximum amount that could then be recovered from such Borrower under this Section 5.11 without rendering
such payment voidable under Section 548 of the Bankruptcy Code or under any applicable state fraudulent transfer or conveyance act, or similar statute or common law. 

(c)    Section 5.11.3(a) shall not limit the liability of any Borrower to pay or guarantee Revolver
Loans made directly or indirectly to it (including Revolver Loans advanced hereunder to any other Person and then re-loaned or otherwise transferred to, or for the benefit of, such Borrower), LC Obligations
relating to Letters of Credit issued to support its business, Secured Bank Product Obligations 

  
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incurred to support its business, and all accrued interest, fees, expenses and other related Obligations with respect thereto, for which such Borrower shall be primarily liable for all purposes
hereunder. Agent and Lenders shall have the right, at any time in their discretion, to condition Revolver Loans and Letters of Credit upon a separate calculation of borrowing availability for each Borrower and to restrict the disbursement and use of
Revolver Loans and Letters of Credit to a Borrower based on that calculation. 
 (d)    Each Obligor that
is a Qualified ECP when its guaranty of or grant of Lien as security for a Swap Obligation becomes effective hereby jointly and severally, absolutely, unconditionally and irrevocably undertakes to provide funds or other support to each Specified
Obligor with respect to such Swap Obligation as may be needed by such Specified Obligor from time to time to honor all of its obligations under the Loan Documents in respect of such Swap Obligation (but, in each case, only up to the maximum amount
of such liability that can be hereby incurred without rendering such Qualified ECP’s obligations and undertakings under this Section 5.11 voidable under any applicable fraudulent transfer or conveyance act). The
obligations and undertakings of each Qualified ECP under this Section shall remain in full force and effect until Full Payment of all Obligations. Each Obligor intends this Section to constitute, and this Section shall be deemed to constitute, a
guarantee of the obligations of, and a “keepwell, support or other agreement” for the benefit of, each Obligor for all purposes of the Commodity Exchange Act. 

5.11.4    Joint Enterprise. Each Borrower has requested that Agent and Lenders make this credit
facility available to Borrowers on a combined basis, in order to finance Borrowers’ business most efficiently and economically. Borrowers’ business is a mutual and collective enterprise, and the successful operation of each Borrower is
dependent upon the successful performance of the integrated group. Borrowers believe that consolidation of their credit facility will enhance the borrowing power of each Borrower and ease administration of the facility, all to their mutual
advantage. Borrowers acknowledge that Agent’s and Lenders’ willingness to extend credit and to administer the Collateral on a combined basis hereunder is done solely as an accommodation to Borrowers and at Borrowers’ request. 

5.11.5    Subordination. Each Borrower hereby subordinates any claims, including any rights at law
or in equity to payment, subrogation, reimbursement, exoneration, contribution, indemnification or set off, that it may have at any time against any other Obligor, howsoever arising, to the Full Payment of its Obligations. 

SECTION 6.    CONDITIONS PRECEDENT 

6.1    Conditions Precedent to Initial Revolver Loans. In addition to the conditions set forth
in Section 6.2, Lenders shall not be required to fund any requested Revolver Loan, issue any Letter of Credit, or otherwise extend credit to Borrowers hereunder, until the date (“Closing Date”) that each of
the following conditions has been satisfied or waived by Agent and Required Lenders: 
 (a)    Each Loan
Document shall have been duly executed and delivered to Agent by each of the signatories thereto, and each Obligor shall be in compliance with all terms thereof. 

  
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 (b)    Agent shall have received acknowledgments of all
filings or recordations necessary to perfect its Liens in the Collateral (excluding acknowledgment of stamping or registration of the Singapore Debenture), as well as UCC and Lien searches and other evidence reasonably satisfactory to Agent that
such Liens are the only Liens upon the Collateral, except Permitted Liens. 
 (c)    Agent shall have
received duly executed agreements establishing each Dominion Account and related lockbox, in form and substance, and with financial institutions, reasonably satisfactory to Agent. 

(d)    Agent shall have received certificates, in form and substance reasonably satisfactory to it, from a
knowledgeable director or Senior Officer, as applicable, of each Borrower certifying that, after giving effect to the initial Revolver Loans and transactions hereunder, (i) such Borrower and its Subsidiaries, on a consolidated basis, are
Solvent; (ii) no Default or Event of Default exists; and (iii) the representations and warranties set forth in Section 9 are true and correct in all material respects. 

(e)    Agent shall have received a certificate of a duly authorized officer or director, as applicable, of
each Obligor, certifying (i) that attached copies of such Obligor’s Organic Documents are true and complete, and in full force and effect, without amendment except as shown; (ii) that an attached copy of resolutions authorizing
execution and delivery of the Loan Documents is true and complete, and that such resolutions are in full force and effect, were duly adopted, have not been amended, modified or revoked, and constitute all resolutions adopted with respect to this
credit facility; and (iii) to the title, name and signature of each Person authorized to sign the Loan Documents. Agent may conclusively rely on this certificate until it is otherwise notified by the applicable Obligor in writing. 

(f)    Agent shall have received a written opinion of Dechert, LLP in respect of New York law and of Norton
Rose Fulbright (Asia) LLP in respect of Singapore law, each in form and substance reasonably satisfactory to Agent. 

(g)    Agent shall have received copies of the charter documents of each Obligor, in each case other than
with respect to Amkor Singapore, certified by the Secretary of State or other appropriate official of such Obligor’s jurisdiction of organization. Agent shall have received good standing certificates (to the extent such or similar concept
exists) for each Obligor, issued by the Secretary of State or other appropriate official of such Obligor’s jurisdiction of organization. 

(h)    Agent shall, where applicable, have received copies of policies or certificates of insurance for the
insurance policies carried by Borrowers, all in compliance with the Loan Documents. 

  
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 (i)    Agent shall have completed its business, financial and
legal due diligence of Obligors, including a roll-forward of its previous field examination, with results satisfactory to Agent. Since December 31, 2017, no event, occurrence or development or state of circumstances or facts shall have occurred
that has had, or would reasonably be expected to have, a Material Adverse Effect. 
 (j)    Borrowers
shall have paid all fees and expenses to be paid to Agent and Lenders on the Closing Date. 

(k)    Agent has confirmed that Parent has delivered cash collateral in the amount of $559,226.85 to Bank
of America with respect to the Existing Parent Letters of Credit. 
 (l)    Evidence that Corporation
Services Company has accepted its appointment as agent for service of process for Amkor Singapore. 

(m)    Agent shall have received a Borrowing Base Report as of May 31, 2018. Upon giving effect to the
initial funding of Revolver Loans and issuance of Letters of Credit, and the payment by Borrowers of all fees and expenses incurred in connection herewith as well as any payables stretched beyond their customary payment practices, Availability shall
be at least $50,000,000. 
 6.2    Conditions Precedent to All Credit Extensions. Agent, Issuing
Bank and Lenders shall in no event be required to make any credit extension hereunder (including funding any Revolver Loan, arranging any Letter of Credit, or granting any other accommodation to or for the benefit of any Borrower), if the following
conditions are not satisfied on such date and upon giving effect thereto: 
 (a)    No Default or Event
of Default shall have occurred and be continuing; 
 (b)    The representations and warranties of each
Obligor in the Loan Documents are true and correct in all material respects; provided that such materiality qualifier shall not apply to those representations and warranties which are qualified by materiality (except for representations and
warranties that relate solely to an earlier date); and 
 (c)    With respect to a Letter of Credit
issuance, all LC Conditions are satisfied. 
 Each request (or deemed request) by a Borrower for any credit extension shall constitute a representation by
Borrowers that the foregoing conditions are satisfied on the date of such request and on the date of the credit extension. As an additional condition to a credit extension, Agent may request any other information, certification, document, instrument
or agreement as it reasonably deems appropriate. 

  
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 SECTION 7.    COLLATERAL 

7.1    Grant of Security Interest. To secure the prompt payment and performance of its
Obligations, each Borrower (other than Amkor Singapore) and each other Obligor party hereto hereby grants to Agent, for the benefit of Secured Parties, a continuing security interest in and Lien upon all personal Property (excluding Excluded
Property) of such Borrower and such Obligor, including all of the following Property, whether now owned or hereafter acquired, and wherever located: 

(a)    all Accounts; 

(b)    all Chattel Paper, including electronic chattel paper; 

(c)    all Commercial Tort Claims, including those shown on Schedule 9.1.16; 

(d)    all Deposit Accounts, excluding any Excluded Accounts; 

(e)    all Documents; 

(f)    all General Intangibles, including Intellectual Property, excluding
intent-to-use trademark applications filed in the United States Patent and Trademark Office, pursuant to Section 1(b) of the Lanham Act, 15 U.S.C.
Section 1051, prior to the accepted filing of a “Statement of Use” and issuance of a “Certificate of Registration” pursuant to Section 1(d) of the Lanham Act or an accepted filing of an “Amendment to Allege
Use” whereby such intent-to-use trademark application is converted to a “use in commerce” application pursuant to Section 1(c) of the Lanham Act and
any other Intellectual Property in any jurisdiction where such pledge or security interest would cause the invalidation or abandonment of such Intellectual Property; 

(g)    all Goods, including Inventory, Equipment and fixtures; 

(h)    all Instruments, excluding any notes or other instruments payable to such Borrower from any Foreign
Subsidiary; 
 (i)    all Investment Property, excluding (i) Equity Interests of Foreign
Subsidiaries, (ii) Equity Interests of the Excluded Domestic Subsidiaries and (iii) Equity Interests of a Person that is not a Subsidiary to the extent (in the case of this clause (iii)) the grant by such Borrower of a Lien in such Equity
Interests is prohibited by (A) the terms of the organizational documents of such Person (except to the extent that an appropriate waiver or consent can be obtained after such Borrower has used commercially reasonable efforts to obtain same or
any such prohibition is rendered ineffective pursuant to the UCC) or (B) Applicable Law; 

(j)    all Letter-of-Credit
Rights; 
 (k)    all Supporting Obligations; 

  
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 (l)    all monies, whether or not in the possession or under
the control of Agent, a Lender, or a bailee or Affiliate of Agent or a Lender, including any Cash Collateral; 

(m)    all accessions to, substitutions for, and all replacements, products, and cash and non-cash proceeds of the foregoing, including proceeds of and unearned premiums with respect to insurance policies, and claims against any Person for loss, damage or destruction of any Collateral; and 

(n)    all books and records (including customer lists, files, correspondence, tapes, computer programs,
print-outs and computer records) pertaining to the foregoing. 
 7.2    Lien on Deposit Accounts; Cash
Collateral. 
 7.2.1    Deposit Accounts. To further secure the prompt payment and
performance of its Obligations, each Borrower (other than Amkor Singapore) hereby grants to Agent a continuing security interest in and Lien upon all amounts credited to any Deposit Account (other than any Excluded Account) of such Borrower,
including sums in any blocked, lockbox, sweep or collection account. Each Borrower (other than Amkor Singapore) hereby authorizes and directs each bank or other depository to deliver to Agent, upon request, solely made at any time during the
existence of a Triggered Activation Period exists, all balances in any Deposit Account (other than any Excluded Account) maintained for such Borrower, without inquiry into the authority or right of Agent to make such request. 

7.2.2    Cash Collateral. Cash Collateral may be invested in Cash Equivalents, at Agent’s
discretion (with the consent of Borrowers, provided no Event of Default exists), but Agent shall have no duty to do so, regardless of any agreement or course of dealing with any Borrower, and shall have no responsibility for any investment or loss.
As security for its Obligations, each Borrower hereby grants to Agent a security interest in and Lien upon all Cash Collateral delivered hereunder from time to time, whether held in a segregated cash collateral account or otherwise. Agent may apply
Cash Collateral to payment of such Obligations as they become due, in such order as Agent may elect. All Cash Collateral and related Deposit Accounts shall be under the sole dominion and control of Agent, and no Borrower or other Person shall have
any right to any Cash Collateral until Full Payment of the Obligations. 

7.3    Reserved. 

7.4    Other Collateral. 

7.4.1    Commercial Tort Claims. Borrowers shall promptly notify Agent in writing if any Obligor
(other than Amkor Singapore) has a Commercial Tort Claim (other than a Commercial Tort Claim for less than $5,000,000), shall promptly amend Schedule 9.1.16 to include such claim, and shall take such actions as Agent reasonably deems
appropriate to subject such claim to a duly perfected, Lien in favor of Agent. 

  
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 7.4.2    Certain After-Acquired Collateral. Borrowers
shall promptly (a) notify Agent if a Borrower (other than Amkor Singapore) obtains an interest in (i) any Deposit Account (other than an Excluded Account), (ii) any Chattel Paper, Document, or Letter-of-Credit Right that in each case has an aggregate fair market value in excess of $1,000,000, (iii) any Intellectual Property, or (iv) any Instrument or Investment Property for which, in each
case, the face value is in excess of $500,000 individually or $1,000,000 in the aggregate, in each case of this clause (a), solely to the extent constituting Collateral, and (b) upon Agent’s written request, take such actions as Agent
deems reasonably appropriate to effect its perfected Lien on such Collateral, including obtaining any appropriate possession, control agreement or Lien Waiver. If any Collateral is in the possession of a third party, at Agent’s written request,
Borrowers shall use commercially reasonable efforts to obtain an acknowledgment that such third party holds the Collateral for the benefit of Agent. 

7.5    Limitations. The Lien on Collateral granted hereunder is given as security only and
shall not subject Agent or any Lender to, or in any way modify, any obligation or liability of Borrowers relating to any Collateral. In no event shall the grant of any Lien under any Loan Document secure an Excluded Swap Obligation of the granting
Obligor. 
 7.6    Further Assurances. All Liens granted to Agent under the Loan Documents
are for the benefit of Secured Parties. Promptly upon request, Borrowers shall deliver such instruments and agreements, and shall take such actions, as Agent reasonably deems appropriate under Applicable Law to evidence or perfect its Lien on any
Collateral, or otherwise to give effect to the intent of this Agreement. Each Borrower authorizes Agent to file any financing statement that describes the Collateral as “all assets” or “all personal property” of such Borrower, or
words to similar effect, and ratifies any action taken by Agent before the Closing Date to effect or perfect its Lien on any Collateral. 
 SECTION
8.    COLLATERAL ADMINISTRATION 
 8.1    Borrowing Base Reports. By
(i) the 20th day of each calendar month, or more frequently as Agent may request, Borrowers shall deliver to Agent (and Agent shall promptly deliver same to the Lenders) a Borrowing Base Report prepared as of the last day of the preceding
calendar month and (ii) during any Triggered Activation Period, the third Business Day of each week, Borrowers shall deliver to Agent (and Agent shall promptly deliver same to the Lenders) a Borrowing Base Report prepared as of the last day of
the preceding calendar week. All calculations of Availability in any Borrowing Base Report shall be certified by a Senior Officer of Borrower Agent or such other officer of Borrower Agent as may be acceptable to Agent, provided that Agent may from
time to time review and adjust any such calculation (a) to reflect collections of Accounts received and (b) to the extent the calculation is not made in accordance with this Agreement or does not accurately reflect Reserves imposed by
Agent. 
 8.2    Accounts. 

8.2.1    Records and Schedules of Accounts. Parent and each Borrower shall keep accurate and
complete, in all material respects, records of its Accounts, including all payments and collections thereon, and shall submit to Agent sales, collection, 

  
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reconciliation and other reports in form reasonably satisfactory to Agent, on such periodic basis as Agent may request. Parent and each Borrower shall also provide to Agent, on or before the 20th
day of each month, a detailed aged trial balance of all Accounts as of the end of the preceding month, specifying each Account’s Account Debtor name and address, amount, invoice date and due date, showing any discount, allowance, credit,
authorized return or dispute, and including such proof of delivery, copies of invoices and invoice registers, copies of related documents, repayment histories, status reports and other information as Agent may reasonably request. If Accounts in an
aggregate face amount of $15,000,000 or more cease to be Eligible Accounts or Eligible Foreign Accounts, Parent and Borrowers shall notify Agent of such occurrence promptly (and in any event within one Business Day) after any Senior Officer of
Parent or any Borrower has knowledge thereof. 
 8.2.2    Taxes. If an Account of Parent or any
Borrower includes a charge for any Taxes, Agent is authorized, in its discretion, to pay the amount thereof to the proper taxing authority for the account of Parent or such Borrower and to charge Parent or Borrowers therefor; provided, that
neither Agent nor Lenders shall be liable for any Taxes that may be due from Parent or Borrowers or with respect to any Collateral. Agent shall provide reasonable notice to Parent or such Borrower, as applicable, of any intention to make a payment
of Taxes pursuant to this Section 8.2.2 and, following any such payment, shall promptly provide evidence of such payment to Parent or such Borrower, as applicable. 

8.2.3    Account Verification. Whether or not a Default or Event of Default exists, Agent shall have
the right at any time, in the name of Agent, any designee of Agent or Parent or any Borrower, to verify the validity, amount or any other matter relating to any Accounts of Parent or Borrowers by mail, telephone or otherwise. Parent and Borrowers
shall cooperate fully with Agent in an effort to facilitate and promptly conclude any such verification process and Agent will, if any such verification is being conducted when no Event of Default exists, use reasonable efforts to inform Borrower
Agent that Agent plans to conduct such verification. 
 8.2.4    Maintenance of Dominion Account.
Parent and Borrowers shall maintain Dominion Accounts pursuant to lockbox or other arrangements reasonably acceptable to Agent. Parent and Borrowers shall obtain an agreement (in form and substance reasonably satisfactory to Agent) from each lockbox
servicer and Dominion Account bank, establishing Agent’s control over and Lien in the lockbox or Dominion Account, which may be exercised by Agent during any Triggered Activation Period, requiring immediate deposit of all remittances received
in the lockbox to a Dominion Account, and waiving offset rights of such servicer or bank, except for customary administrative charges. If a Dominion Account is not maintained with Bank of America, Agent may, during any Triggered Activation Period,
require immediate transfer of all funds in such account to a Dominion Account maintained with Bank of America. Agent and Lenders assume no responsibility to Parent or Borrowers for any lockbox arrangement or Dominion Account, including any claim of
accord and satisfaction or release with respect to any Payment Items accepted by any bank. 

  
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 8.2.5    Proceeds of Collateral. Parent and Borrowers
shall request in writing and otherwise take all necessary steps to ensure that all payments on Accounts or otherwise relating to Collateral are made directly to a Dominion Account (or a lockbox relating to a Dominion Account). If Parent, any
Borrower or Subsidiary receives cash or Payment Items with respect to any Collateral, it shall hold same in trust for Agent and promptly (not later than the three Business Days thereafter) deposit same into a Dominion Account. 

8.3    Inventory. 

8.3.1    Returns of Inventory. No Borrower shall return any Inventory to a supplier, vendor or other
Person, whether for cash, credit or otherwise, unless (a) such return is in the Ordinary Course of Business; and (b) if a Triggered Activation Period exists or would result therefor, any payment received by a Borrower for a return is
promptly remitted to Agent for application to the Obligations. 
 8.3.2    Acquisition, Sale and
Maintenance. No Borrower shall acquire or accept any Inventory on consignment or approval (except in the Ordinary Course of Business), and shall take all steps to assure that all Inventory is produced in accordance with Applicable Law in all
material respects, including the FLSA. Borrowers shall use, store and maintain all Inventory with reasonable care and caution, in accordance with applicable standards of any insurance and in conformity in all material respects with all Applicable
Law, and shall make current rent payments (within applicable grace periods provided for in leases) at all locations where any Collateral is located. 

8.4    Equipment. 

8.4.1    Records and Schedules of Equipment. Each Borrower shall keep accurate and complete records,
in all material respects, of its Equipment, including kind, quality, quantity, cost, acquisitions and dispositions thereof, and shall submit to Agent, on such periodic basis as Agent may request, a current schedule thereof, in form reasonably
satisfactory to Agent. Promptly upon reasonable request, Borrowers shall deliver to Agent evidence of their ownership or interests in any Equipment. 

8.4.2    Condition of Equipment. Subject to casualty, condemnation and ordinary wear and tear, the
Equipment is in good operating condition and repair, except where the failure to do so would not reasonably be expected to have, individually or in the aggregate, a Material Adverse Effect. 

8.5    Deposit Accounts. Schedule 8.5 lists all Deposit Accounts maintained by Obligors,
including Dominion Accounts. With respect to each Deposit Account (other than any Excluded Account), each Borrower shall use commercially reasonable efforts to establish Agent’s control of each such Deposit Account. Each Obligor shall be the
sole account holder of each Deposit Account (other than any Excluded Account) and shall not allow any Person (other than Agent and the depository bank) to have control over their Deposit Accounts or any Property deposited therein. Borrowers shall
promptly notify Agent of any opening or closing of a Deposit Account (other than any Excluded Account) and, with the consent of Agent (which consent shall not be unreasonably withheld or delayed), will amend Schedule 8.5 to reflect same. 


  
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 8.6    General Provisions. 

8.6.1    Location of Collateral. All tangible items of Collateral, other than (a) Inventory in transit,
(b) Equipment being used by employees in the Ordinary Course of Business, (c) Equipment which is being refurbished or repaired in the Ordinary Course of Business, and (d) other Collateral having an aggregate value not exceeding
$1,000,000, shall at all times be kept by Obligors at the business locations set forth in Schedule 8.6.1, except that Obligors may (a) make sales or other dispositions of Collateral in accordance with
Section 10.2.5; and (b) move Collateral to another location in the United States or Singapore, upon 10 Business Days prior written notice to Agent. 

8.6.2    Insurance of Collateral; Condemnation Proceeds. 

(a)    Each Borrower shall maintain property, casualty and liability insurance with insurers rated A+ or
better by Best Rating Guide, or with insurers that such Borrower believes (in its business judgment) are financially sound and responsible at the time the relevant coverage is placed or renewed, insurance in at least such amounts (after giving
effect to any self-insurance) as such Borrower believes is reasonable and prudent in light of the size and nature of its business and against at least such risks (and with such risk retentions) as such Borrower believes (in its business judgment)
are reasonable and prudent in light of the size and nature of its business. All proceeds under each policy shall be payable to Agent subject to Section 8.6.2(c) below. From time to time upon reasonable request, Borrowers
shall deliver the originals or certified copies of its insurance policies to Agent. Unless Agent shall agree otherwise, each policy (other than policies with respect to which such endorsements are not customary) shall include reasonably satisfactory
endorsements (i) showing Agent as loss payee or additional insured, as appropriate, (ii) requiring 30 days prior written notice to Agent in the event of cancellation of the policy for any reason whatsoever, and (iii) specifying that
the interest of Agent shall not be impaired or invalidated by any act or neglect of any Borrower or the owner of the Property, nor by the occupation of the premises for purposes more hazardous than are permitted by the policy. If any Borrower fails
to provide and pay for such insurance, Agent may, at its option, but shall not be required to, procure the insurance and charge Borrowers therefor. Each Borrower agrees to deliver to Agent, promptly as rendered, copies of all material reports made
to insurance companies. While no Event of Default exists, Borrowers may settle, adjust, or compromise any insurance claim, as long as the proceeds are delivered to Agent. If an Event of Default exists, only Agent shall be authorized to settle,
adjust, and compromise such claims. Agent acknowledges and agrees that the insurance currently maintained by Borrowers, as evidenced by the certificates or policies provided by Borrowers to Agent, satisfied the requirements of this
Section 8.6.2(a) as of the Closing Date. 
 (b)    Subject to clause (c),
during the existence of an Event of Default, any proceeds of insurance (other than proceeds from workers’ compensation or D&O insurance) and any awards arising from condemnation of any Collateral shall be paid to Agent and applied to
payment of the Obligations in accordance with the provisions of Section 5.6.1. Proceeds from any business interruption insurance may be used by Borrowers in the Ordinary Course of Business. 

  
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 (c)    Following Agent’s receipt of any insurance
proceeds or condemnation awards relating to any loss or destruction of Property, Borrower may use such proceeds or awards to repair or replace such Property as long as (i) no Triggered Activation Period exists or has resulted therefrom and
(ii) the repaired or replaced Property is free of Liens other than Permitted Liens. 

8.6.3    Protection of Collateral. All expenses of protecting, storing, warehousing, insuring,
handling, maintaining and shipping any Collateral, all Taxes payable with respect to any Collateral (including any sale thereof), and all other payments required to be made by Agent to any Person to realize upon any Collateral, shall be borne and
paid by Borrowers. Agent shall not be liable or responsible in any way for the safekeeping of any Collateral, for any loss or damage thereto (except for reasonable care in its custody while Collateral is in Agent’s actual possession), for any
diminution in the value thereof, or for any act or default of any warehouseman, carrier, forwarding agency or other Person whatsoever, but the same shall be at Borrowers’ sole risk. 

8.6.4    Defense of Title. Each Borrower shall, subject to its reasonable business judgement, defend
its title to Collateral and Agent’s Liens therein against all Persons, claims and demands, except Permitted Liens. 

8.7    Power of Attorney. Each Borrower hereby irrevocably constitutes and appoints Agent (and all
Persons designated by Agent) as such Borrower’s true and lawful attorney (and agent-in-fact) for the purposes provided in this Section. Agent, or Agent’s
designee, may (but shall have no obligation to), without notice and in either its or a Borrower’s name, but at the cost and expense of Borrowers: 

(a)    Endorse Borrower’s name on any Payment Item or other proceeds of Collateral (including proceeds
of insurance) that come into Agent’s possession or control; and 
 (b)    Upon the occurrence and
during the continuation of an Event of Default, (i) notify any Account Debtors of the assignment of their Accounts, demand and enforce payment of Accounts by legal proceedings or otherwise, and generally exercise any rights and remedies with
respect to Accounts; (ii) settle, adjust, modify, compromise, discharge or release any Accounts or other Collateral, or any legal proceedings brought to collect Accounts or Collateral; (iii) sell or assign any Accounts and other Collateral
upon such terms, for such amounts and at such times as Agent deems advisable; (iv) collect, liquidate and receive balances in Deposit Accounts or investment accounts, and take control, in any manner, of proceeds of Collateral; (v) prepare,
file and sign a Borrower’s name to a proof of claim or other document in a bankruptcy of an Account Debtor, or to any notice, assignment or satisfaction of Lien or similar document; (vi) receive, open and dispose of mail addressed to a
Borrower, and notify postal authorities to deliver any such mail to an address designated by Agent; (vii) endorse any Chattel Paper, 

  
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Document, Instrument, bill of lading, or other document or agreement relating to any Accounts, Inventory or other Collateral; (viii) use a Borrower’s stationery and sign its name to
verifications of Accounts and notices to Account Debtors; (ix) use information contained in any data processing, electronic or information systems relating to Collateral; (x) make and adjust claims under insurance policies; (xi) take
any action as may be necessary or appropriate to obtain payment under any letter of credit, banker’s acceptance or other instrument for which a Borrower is a beneficiary; (xii) after Agent shall have provided Obligors prior written notice
at least five Business Days prior thereto, exercise any voting or other rights under or with respect to any Investment Property; and (xiii) take all other actions as Agent deems appropriate to fulfill any Borrower’s obligations under the
Loan Documents. 
 SECTION 9.    REPRESENTATIONS AND WARRANTIES 

9.1    General Representations and Warranties. To induce Agent and Lenders to enter into this
Agreement and to make available the Revolver Commitments, Revolver Loans and Letters of Credit, Borrower and each other Obligor represents and warrants that: 

9.1.1    Organization and Qualification. Each Obligor is duly organized or incorporated (as
appropriate), validly existing, and in good standing (to the extent such or a similar concept exists) under the laws of the jurisdiction of its organization or incorporation. Each Obligor is duly qualified, authorized to do business, and in good
standing (to the extent such or a similar concept exists) as a foreign corporation in each jurisdiction where failure to be so qualified would reasonably be expected to have a Material Adverse Effect. No Obligor is an EEA Financial Institution. 

9.1.2    Power and Authority. Each Obligor is duly authorized to execute, deliver, and perform its
Loan Documents. The execution, delivery, and performance of the Loan Documents have been duly authorized by all necessary action, except for the stamping of the Singapore Debenture with the Inland Revenue Authority of Singapore and the registration
of the Singapore Debenture with the Accounting and Corporate Regulatory Authority of Singapore, in each case within the prescribed statutory period, and do not (a) require any consent or approval of any holders of Equity Interests of any
Obligor, other than those already obtained, (b) contravene the Organic Documents of any Obligor, (c) violate or cause a default under any Applicable Law or Material Contract, or (d) result in or require the imposition of any Lien
(other than Permitted Liens and Agent’s Liens) on any Property of any Obligor. 

9.1.3    Enforceability. Each Loan Document is a legal, valid, and binding obligation of each
Obligor party thereto, enforceable in accordance with its terms, except as (a) enforceability may be limited by bankruptcy, insolvency, or similar laws affecting the enforcement of creditors’ rights generally and by equitable principles
and (b) the stamping of the Singapore Debenture with the Inland Revenue Authority of Singapore and the registration of the Singapore Debenture with the Accounting and Corporate Regulatory Authority of Singapore, in each case within the
prescribed statutory period. 

  
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 9.1.4    Capital Structure. As of the Closing Date,
Schedule 9.1.4, shows for Parent and each of its Subsidiaries (a) its name, (b) its jurisdiction of organization or incorporation, (c) with respect to each Subsidiary, its authorized and issued Equity Interests, and the holders
of its Equity Interests. Each Obligor has good title to its Equity Interests in its Subsidiaries, free of any Lien other than Agent’s Liens, Permitted Liens and all such Equity Interests are duly issued, fully paid, and non-assessable. Notwithstanding the foregoing, the requirements of this Section 9.1.4 shall not apply with respect to, and at the time of, the formation or acquisition of a newly formed or
acquired Subsidiary that is formed or acquired in compliance with this Agreement. 
 9.1.5    Title to
Properties; Priority of Liens. Each Obligor has good title (or valid interests in) all of its Property, including all Property reflected in any financial statements delivered to Agent or the Lenders, in each case free of Liens except Permitted
Liens. Each Obligor has paid and discharged all lawful claims that, if unpaid, could become a Lien on its Properties, other than Permitted Liens or as are being Properly Contested. Agent’s Liens in the Collateral, excluding any Lien on
Collateral (a) for which a certificate of title is issued and Agent is not in possession of such certificate of title and listed as first lienholder thereon or (b) which constitutes a Commercial Tort Claim described in the parenthetical
clause of Section 7.4.1, are duly perfected Liens, except for the service of notices of assignment under the Singapore Debenture and the stamping and registration of the Singapore Debenture with the Inland Revenue Authority
of Singapore and the Accounting and Corporate Regulatory Authority of Singapore, respectively, in each case within the prescribed statutory period, subject only to Permitted Liens. 

9.1.6    Accounts. Agent may rely, in determining which Accounts are Eligible Accounts and Eligible
Foreign Accounts, on all statements and representations made by Parent and Borrowers with respect thereto. Parent and Borrowers warrant, with respect to each Account at the time it is shown as an Eligible Account or an Eligible Foreign Account in a
Borrowing Base Report, that: 
 (a)    it is genuine and in all material respects what it purports to be,
and is not evidenced by a judgment; 
 (b)    it arises out of a completed, bona fide sale and delivery
of goods or rendition of services in the Ordinary Course of Business, and substantially in accordance with any purchase order, contract, or other document relating thereto; 

(c)    it is for a sum certain, maturing as stated in the invoice covering such sale or rendition of
services, a copy of which has been furnished or is available to Agent on request; 
 (d)    it is not
subject to any offset, Lien (other than Permitted Account Liens), deduction, defense, dispute, counterclaim, or other adverse condition except as arising in the Ordinary Course of Business, and it is absolutely owing by the Account Debtor, without
contingency in any respect; 

  
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 (e)    no purchase order, agreement, document, or Applicable
Law restricts assignment of the Account to Agent (regardless of whether, under the UCC, the restriction is ineffective); 

(f)    no extension, compromise, settlement, modification, credit, deduction, or return has been authorized
with respect to the Account, except discounts or allowances granted in the Ordinary Course of Business for prompt payment that are reflected on the face of the invoice related thereto and in the reports submitted to Agent hereunder; and 

(g)    to Borrowers’ actual knowledge, (i) there are no facts or circumstances that are
reasonably likely to impair the enforceability or collectibility of such Account and (ii) the Account Debtor had the capacity to contract when the Account arose, continues to meet Parent’s or applicable Borrower’s customary credit
standards, is Solvent (or in the case of a jurisdiction other than the US, the equivalent solvency or insolvency standard), is not contemplating or subject to an Insolvency Proceeding, and has not failed or suspended or ceased doing business. 

9.1.7    Financial Statements. The consolidated and consolidating balance sheets, and related
statements of income, cash flow, and shareholder’s equity, as applicable, of Parent and its Subsidiaries that have been and are from time to time hereafter delivered to Agent and the Lenders, are prepared in accordance with GAAP, and fairly
present in all material respects the financial positions and results of operations of Parent and its Subsidiaries at the dates and for the periods indicated. Since December 31, 2017, there has been no change in the condition, financial or
otherwise, of Parent or its Subsidiaries that would reasonably be expected to have a Material Adverse Effect. 

9.1.8    Surety Obligations. No Parent or Borrower is obligated as surety or indemnitor under any
bond or other contract that assures payment or performance of any obligation of any Person, except as permitted hereunder. 

9.1.9    Taxes. Each Obligor has filed all material federal, state, and local tax returns and other
material reports that it is required by law to file, and has paid, or made provision for the payment of, all Taxes upon it, its income, and its Properties that are due and payable, except to the extent being Properly Contested. 

9.1.10    Brokers. There are no brokerage commissions, finder’s fees, or investment banking
fees payable in connection with any transactions contemplated by the Loan Documents. 

9.1.11    Intellectual Property. Except as disclosed on Schedule 9.1.11, each Obligor owns or
has the lawful right to use all Intellectual Property reasonably necessary for the conduct of its business, without conflict with any rights of others except for any such conflict that would not reasonably be expected to have a Material Adverse
Effect. As of the Closing Date, (a) except as set forth in Schedule 9.1.11, there is no pending or threatened (in writing) Intellectual Property Claim with respect to any Obligor or any of their Intellectual Property that would
reasonably be expected to have a Material Adverse 

  
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Effect, (b) except as disclosed on Schedule 9.1.11, no Obligor pays or owes any Royalty or other compensation to any Person with respect to any Intellectual Property, and (c) all
Intellectual Property registered in the United States owned by any Obligor is shown on Schedule 9.1.11. 

9.1.12    Governmental Approvals. Each Obligor has, and is in compliance with, and is in good
standing with respect to, all Governmental Approvals necessary to conduct its business and to own, lease, and operate its Properties, in each case in all material respects. All necessary import, export, or other licenses, permits, or certificates
for the import or handling of any goods or other Collateral have been procured and are in effect, and the Obligors have complied with all foreign and domestic laws with respect to the shipment and importation of any goods or Collateral, except, in
each case, where such failure or noncompliance would not reasonably be expected to have a Material Adverse Effect. 

9.1.13    Compliance with Laws. Each Obligor has duly complied, and its Properties and business
operations are in compliance, in all material respects with all Applicable Law, except where noncompliance would not reasonably be expected to have a Material Adverse Effect. There have been no citations, notices, or orders of noncompliance issued
to any Obligor under any Applicable Law, except where noncompliance could reasonably be expected to result in a Material Adverse Effect. To the extent the FLSA is applicable to such Obligor, no Inventory has been produced in violation of the FLSA.

 9.1.14    Compliance with Environmental Laws. Except as disclosed on
Schedule 9.1.14 or as would not reasonably be expected to have a Material Adverse Effect, no Obligor’s operations, Real Estate or, to Borrower’s knowledge, other Properties are subject to any federal,
state, or local investigation to determine whether any remedial action is needed to address any environmental pollution, hazardous material, or environmental clean-up. No Obligor has received any Environmental
Notice that is pending and unresolved. No Obligor has any contingent liability under applicable Environmental Laws with respect to any Environmental Release, environmental pollution, or the presence of hazardous materials on any Real Estate now or
previously owned, leased, or operated by it. 
 9.1.15    Burdensome Contracts. No Obligor is a
party or subject to any contract, agreement, or charter the breach of which that would reasonably be expected to have a Material Adverse Effect. As of the Closing Date, no Obligor is party or subject to any Restrictive Agreement, except as shown on
Schedule 9.1.15, none of which prohibit the execution or delivery of any Loan Documents by an Obligor nor the performance by an Obligor of any obligations thereunder. 

9.1.16    Litigation. Except as shown on Schedule 9.1.16, there are no proceedings or
investigations pending or, to any Borrower’s knowledge, threatened against any Obligor, or any of their businesses, operations or Properties that (a) relate to any Loan Documents or transactions contemplated thereby, or (b) as of the
Closing Date, would reasonably be expected to have a Material Adverse Effect if determined adversely to any Obligor. No Obligor is in default with respect to any order, injunction, or judgment of any Governmental Authority. 

  
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 9.1.17    No Defaults. No event or circumstance has
occurred or exists that constitutes a Default or Event of Default. No Obligor is in default, and no event or circumstance has occurred or exists that with the passage of time or giving of notice would constitute a default (after giving effect to any
cure or grace period and waivers or amendments thereof), under any Material Contract. As of the Effective Date, no Obligor has actual knowledge of any basis upon which any party (other than an Obligor) could terminate a Material Contract prior to
its scheduled termination date. 
 9.1.18    ERISA. Except as disclosed on Schedule 9.1.18:

 (a)    Except as would not reasonably be expected to result in a Material Adverse Effect, each Plan is
in compliance with the applicable provisions of ERISA, the Code, and other federal and state laws. Each Plan that is intended to qualify under Section 401(a) of the Code has received a favorable determination (or an opinion or advisory letter
from the IRS affording equivalent reliance) or an application for such a letter is currently being processed by the IRS with respect thereto and, to the knowledge of the Parent or Borrowers, nothing has occurred which would prevent, or cause the
loss of, such qualification. Each Obligor and ERISA Affiliate has met all applicable requirements in all material respects under the Code, ERISA and the Pension Protection Act of 2006 with respect to any Plan, and no application for a waiver of the
minimum funding standards or an extension of any amortization period has been made with respect to any Pension Plan. 

(b)    There are no pending or, to the knowledge of Borrowers, threatened claims, actions or lawsuits, or
action by any Governmental Authority, with respect to any Plan that would reasonably be expected to have a Material Adverse Effect. There has been no prohibited transaction or violation of the fiduciary responsibility rules with respect to any Plan
that has resulted in or would reasonably be expected to have a Material Adverse Effect. 
 (c)    (i) No
ERISA Event has occurred or is reasonably expected to occur, (ii) as of the most recent valuation date for any Pension Plan, the funding target attainment percentage (as defined in Section 430(d)(2) of the Code) is at least 60%, and no
Obligor or ERISA Affiliate knows of any reason that the funding target attainment percentage could reasonably be expected to drop below 60%, (iii) no Obligor or ERISA Affiliate has incurred any liability to the PBGC except for the payment of
premiums, and no premium payments are due and unpaid, (iv) no Obligor or ERISA Affiliate has engaged in a transaction that could be subject to Section 4069 or 4212(c) of ERISA and (v) no Pension Plan has been terminated by its plan
administrator or the PBGC, and no fact or circumstance exists that would reasonably be expected to cause the PBGC to institute proceedings to terminate a Pension Plan. 

(d)    With respect to any Foreign Plan, (i) all employer and employee contributions required by law
or by the terms of the Foreign Plan have been made, or, if applicable, accrued, in accordance with normal accounting practices, (ii) the fair market value of the assets of each funded Foreign Plan, the liability of each


  
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insurer for any Foreign Plan funded through insurance, or the book reserve established for any Foreign Plan, together with any accrued contributions, is sufficient to procure or provide for the
accrued benefit obligations with respect to all current and former participants in such Foreign Plan according to the actuarial assumptions and valuations most recently used to account for such obligations in accordance with applicable generally
accepted accounting principles and (iii) it has been registered as required by, and has been maintained in good standing with, applicable regulatory authorities. 

9.1.19    Trade Relations. There exists no actual or threatened termination or limitation of any
business relationship between any Obligor and any customer or supplier, or any group of customers or suppliers, which individually or in the aggregate would reasonably be expected to result in a Material Adverse Effect. There exists no condition or
circumstance that would reasonably be expected to materially impair the ability of any Obligor to conduct its business at any time hereafter in substantially the manner as conducted on the Closing Date. 

9.1.20    Labor Relations. Except as described on Schedule 9.1.20, as of the Closing Date, no
Obligor is party to or bound by any collective bargaining agreement. There are no material grievances, disputes, or controversies with any union or other organization of any Obligor’s employees, or, to any Borrower’s knowledge, any
asserted or threatened strikes, work stoppages, or demands for collective bargaining. 

9.1.21    Corporate Names; Locations. During the five years preceding the Closing Date, except as
shown on Schedule 9.1.21, no Obligor has been known as or used any corporate, fictitious, or trade names, has been the surviving corporation of a merger or combination, or has acquired any substantial part of the assets of any Person. The
chief executive offices and other places of business of the Obligors as of the Closing Date are shown on Schedule 8.6.1. Except as shown on Schedule 9.1.21, during the five years preceding the Closing Date, no Obligor has had any other
office or place of business. 
 9.1.22    Not a Regulated Entity. No Obligor is (a) an
“investment company” or a “person directly or indirectly controlled by or acting on behalf of an investment company” within the meaning of the Investment Company Act of 1940, (b) [reserved], or (c) subject to regulation
under the Federal Power Act, the Interstate Commerce Act, any public utilities code or any other Applicable Law regarding its authority to incur Debt. 

9.1.23    Margin Stock. No Obligor is engaged, principally or as one of its important activities, in
the business of extending credit for the purpose of purchasing or carrying any Margin Stock. No Revolver Loan proceeds or Letters of Credit will be used by the Borrowers to purchase or carry, or to reduce or refinance any Debt incurred to purchase
or carry, any Margin Stock or for any related purpose governed by Regulations T, U, or X of the Board of Governors. 

9.1.24    OFAC. Neither Parent nor any Subsidiary, or (to the knowledge of Borrower or any
Subsidiary) any director, officer, employee, agent, affiliate or representative thereof, is or is owned or controlled by any individual or entity that is currently the target of any
Sanction or is located, organized or resident in a Designated Jurisdiction. 

  
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 9.1.25    Anti-Corruption Laws. Parent and each
Subsidiary has conducted its business in accordance with applicable anti-corruption laws and has instituted and maintained policies and procedures designed to promote and achieve compliance with such laws. 

9.1.26    Beneficial Ownership Certificate. As of the Closing Date, the information included in the
Beneficial Ownership Certification is true and correct in all material respects. 
 9.2    Complete
Disclosure. The written information concerning Parent and its Subsidiaries, other than budgets, estimates and other projections, forward-looking information and information of a general economic or general industry nature, that has
been made available to Agent or any Lender by or on behalf of any Obligor in connection with any Loan Document (including the information contained in any financial statement), in each case as modified or supplemented by other information so
furnished, does not, when taken as a whole, contain any untrue statement of a material fact or omit to state a material fact necessary to make the statements contained therein not materially misleading in light of the circumstances under which such
statements were made. All projections that are part of such information (including those set forth in any projections delivered subsequent to the Closing Date) are based upon good faith estimates and assumptions believed to be reasonable and fair as
of the date made in light of conditions and facts then known and, as of such date, reflect good faith, reasonable and fair estimates of the information projected for the periods set forth therein (it being understood and agreed that financial
projections are not to be viewed as factual, are not a guarantee of financial performance and actual results may differ from financial projections and such differences may be material). 

SECTION 10.    COVENANTS AND CONTINUING AGREEMENTS 

10.1    Affirmative Covenants. Until Full Payment of the Obligations, Obligors shall agree and
covenant as follows: 
 10.1.1    Inspections; Appraisals. 

(a)    Permit Agent from time to time, subject (unless a Default or Event of Default exists) to reasonable
notice and normal business hours, to visit and inspect the Properties of any Obligor, inspect, audit and make extracts from any Obligor’s books and records, and discuss with its officers, employees, agents, advisors and independent accountants
such Obligor’s business, financial condition, assets, prospects and results of operations. Lenders may participate in any such visit or inspection, at their own expense. Secured Parties shall have no duty to any Obligor to make any inspection,
nor to share any results of any inspection, appraisal or report with any Obligor. Obligors acknowledge that all inspections, appraisals and reports are prepared by Agent and Lenders for their purposes, and Obligors shall not be entitled to rely upon
them. Notwithstanding anything to the contrary herein, no Obligor shall be required to disclose, permit the inspection, examination 

  
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or making of copies of or taking abstracts from, or discuss any document, information, or other matter (i) that constitutes non-financial trade
secrets or non-financial proprietary information of the Obligors or any of its Subsidiaries and/or any of its customers and/or suppliers, (ii) in respect of which access or inspection by, or disclosure
to, Agent or Lender (or any of their respective representatives or contractors) is prohibited by Applicable Law; provided that, with respect to this clause (ii), Obligors shall (x) make Agent aware that information is being withheld (to
the extent permitted by Applicable Law) and (y) use commercially reasonable efforts to communicate the relevant information in a way that does not violate such Applicable Law, (iii) that is subject to attorney-client or similar privilege
or constitutes attorney work product; provided that, with respect to this clause (iii), Obligors shall (x) make Agent aware that information is being withheld and (y) use commercially reasonable efforts to communicate the relevant
information in a way that does not violate such attorney-client or similar privilege or (iv) in respect of which Obligors or any of its Subsidiaries owes confidentiality obligations (to the extent not created in contemplation of such
party’s obligations hereunder) to any third party, provided that, with respect to this clause (iv), Obligors shall (x) make Agent aware of such confidentiality obligations (to the extent permitted under the applicable confidentiality
obligation) and (y) use commercially reasonable efforts to communicate the relevant information in a way that does not violate such confidentiality obligations. 

(b)    Reimburse Agent for reasonable and documented out-of-pocket charges, costs and expenses in connection with examinations of Obligors’ books and records or any other financial or Collateral matters as it deems appropriate, once per Loan Year (and up
to twice per Loan Year if at any time during the 12 month period immediately prior to the commencement of such examination, Availability is less than 35% of the Revolver Commitments for at least 4 consecutive Business Days); provided, that if
an examination or appraisal is initiated during a Default or Event of Default, all charges, costs and expenses relating thereto shall be reimbursed by Borrowers without regard to such limits. Borrowers shall pay Agent’s then standard charges
for examination activities, including charges for its internal examination and appraisal groups, as well as the charges of any third party used for such purposes. No Borrowing Base calculation shall include Collateral acquired outside the Ordinary
Course of Business until completion of applicable field examinations and appraisals (which shall not be included in the limits provided above) satisfactory to Agent. 

10.1.2    Financial and Other Information. Keep adequate records and books of account with respect
to its business activities, in which proper entries are made in accordance with GAAP reflecting all financial transactions; and furnish to Agent and Lenders: 

(a)    as soon as available, and in any event upon the earlier of 120 days after the end of each Fiscal
Year or the filing of Parent’s annual report on Form 10-K, balance sheets as of the end of such Fiscal Year and the related statements of income, cash flow, and shareholders’ equity for such Fiscal
Year, on both a 

  
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consolidated basis for Parent and its Subsidiaries and on a consolidating basis for Borrowers with respect to balance sheets and statements of income, which consolidated statements shall be
certified by a firm of independent certified public accountants of recognized national standing selected by Parent and acceptable to Agent, and shall set forth in comparative form corresponding figures for the preceding Fiscal Year; 

(b)    as soon as available, and in any event within the earlier to occur of 60 days after the last day of
each Fiscal Quarter or the filing of Parent’s quarterly report on Form 10-Q, unaudited balance sheets as of the end of such Fiscal Quarter and the related statements of income for such Fiscal Quarter and
for the portion of the Fiscal Year then elapsed, on a consolidated basis and consolidating basis with respect to balance sheets and statements of income for Parent and its Subsidiaries and statements of cash flow as of the end of such Fiscal Quarter
on a consolidated basis for Parent and its Subsidiaries, setting forth in comparative form corresponding figures for the preceding Fiscal Year and certified by the principal financial officer of the Parent as prepared in accordance with GAAP and
fairly presenting the financial position and results of operations for such Fiscal Quarter, subject only to changes from audit and year-end adjustments and except that such statements need not contain notes;

 (c)    concurrently with delivery of financial statements under clauses (a) and (b) above, a
Compliance Certificate executed by the chief financial officer of Parent and a Senior Officer of Borrower Agent; 

(d)    concurrently with delivery of financial statements under clause (a) and clause
(b) preceding, (i) a listing of each new business location of Obligors and (ii) a listing of each registration by Obligors of any patent, trademark, or copyright with the United States Patent and Trademark Office or the United States
Copyright Office, as applicable, together with all information required by Agent to perfect Agent’s Liens in such Intellectual Property; 

(e)    not later than 30 days after the end of each Fiscal Year, projections of Parent’s consolidated
balance sheets, results of operations, cash flow, and Availability for the next three Fiscal Years, year by year, and for the next Fiscal Year, on a fiscal quarter basis; 

(f)    at Agent’s request, a listing of Parent and each Borrower’s trade payables, specifying the
trade creditor and balance due, and a detailed trade payable aging, all in form reasonably satisfactory to Agent; 

(g)    promptly after the sending or filing thereof, (i) copies of any proxy statements, financial
statements, or reports that Parent has made generally available to its shareholders, (ii) copies of any regular, periodic, and special reports or registration statements or prospectuses that Parent files with the SEC or any other Governmental
Authority, or any securities exchange; and (iii) copies of any press releases or other statements made available by Parent to the public concerning material changes to or developments in the business of Parent or Borrowers; 

  
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 (h)    promptly upon Agent’s request therefor, copies of
any annual report to be filed in connection with each Plan or Foreign Plan; and 
 (i)    such other
reports and information (financial or otherwise) as Agent may request from time to time in connection with any Collateral or any Borrower’s, Subsidiary’s or other Obligor’s financial condition or business. 

Notwithstanding the foregoing, the obligations in clauses (a) and (b) of this Section 10.1.2 may be satisfied with respect to
financial information of Parent by furnishing the Form 10-K or Form 10-Q (or the equivalent), as applicable, of Parent filed with the SEC, in each case, to the extent
that information contained in such Form 10-K or 10-Q (or the equivalent) satisfies the requirements of clauses (a) or (b) of this
Section 10.1.2, as the case may be. 
 10.1.3    Notices. Obligors shall
notify Agent and the Lenders in writing, promptly after Parent’s or a Borrower’s obtaining knowledge thereof, of any of the following that affects any Obligor: (a) the threat or commencement of any proceeding or investigation, whether
or not covered by insurance, that would reasonably be expected to have a Material Adverse Effect, (b) any pending or threatened labor dispute, strike, or walkout, or the expiration of any material labor contract to the extent any such dispute,
strike, walkout, or expiration would reasonably be expected to cause a Material Adverse Effect, (c) any material breach of, event of default under, or termination prior to its scheduled termination date of a Material Contract, (d) the
existence of any Default or Event of Default, (e) any judgment in an amount exceeding $25,000,000, (f) the assertion of any Intellectual Property Claim that would reasonably be expected to have a Material Adverse Effect, (g) any violation
or asserted violation of any Applicable Law (including ERISA, OSHA, FLSA, or any Environmental Laws) that would reasonably be expected to have a Material Adverse Effect, (h) any Environmental Release by an Obligor or on any Property owned,
leased, or occupied by an Obligor; or receipt of any Environmental Notice that would reasonably be expected to have a Material Adverse Effect, (i) the occurrence of any ERISA Event, (j) the discharge of or any withdrawal or resignation by
Parent’s independent accountants or (k) any opening of a new office or place of business. 

10.1.4    Reserved. 

10.1.5    Compliance with Laws. Each Borrower and each Obligor shall, and shall cause each
Subsidiary to, comply with all material Applicable Laws, including ERISA, Environmental Laws, FLSA, OSHA, Anti-Terrorism Laws, and laws regarding collection and payment of Taxes, and maintain all Governmental Approvals necessary to the ownership of
its Properties or conduct of its business, unless, in each case, failure to comply (other than failure to comply with Anti-Terrorism Laws) or maintain compliance would not reasonably be expected to have a Material Adverse Effect. Without limiting
the generality of the foregoing, if any material Environmental Release occurs at or on any Properties of Parent or any Borrower which requires investigation and/or reporting by Parent or Borrower pursuant to applicable Environmental Laws, as
applicable, Parent or 

  
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Borrower shall act promptly and diligently to investigate and/or report to Agent and all appropriate Governmental Authorities the extent of, and to undertake appropriate remedial action with
respect to such Environmental Release, whether or not directed to do so by any Governmental Authority. 

10.1.6    Taxes. Each Obligor shall pay and discharge all material Taxes prior to the date on which
they become delinquent or penalties attach, unless such Taxes are being Properly Contested. 

10.1.7    Insurance. Each Obligor shall, in addition to the insurance required hereunder with
respect to Collateral, maintain insurance with insurers reasonably satisfactory to Agent with respect to the Properties and business of Obligors of such type, in such amounts, and with such coverages and deductibles as are customary for companies
similarly situated. 
 10.1.8    Licenses. Each Obligor shall (a) keep each material License
affecting any Collateral (including the manufacture, distribution, or disposition of Inventory), except to the extent (i) not otherwise required herein, (ii) pursuant to an Asset Sale permitted hereunder, or (iii) any failure to so
maintain such License could not reasonably be expect to result in a Material Adverse Effect; (b) pay all Royalties when due unless such payment is being Properly Contested; and (c) notify Agent of any default or breach asserted by any
Person to have occurred under any material License affecting any Collateral. 

10.1.9    Reserved. 

10.1.10    Anti-Corruption Laws. Each Borrower, each other Obligor and each Subsidiary shall conduct
its business in compliance with applicable anti-corruption laws and maintain policies and procedures designed to promote and achieve compliance with such laws. 

10.1.11    Singapore Debenture. Upon the occurrence of a Triggered Activation Period under clause
(c) thereof, Borrowers shall execute and deliver to Agent such documents and take such actions as requested by Agent to grant to Agent a “fixed charge” over the Deposit Accounts (in each case which are Controlled Accounts (as defined
in the Singapore Debenture)) and Accounts of Borrower, all in form and substance satisfactory to Agent. 

10.1.12     Beneficial Ownership. Promptly following any request therefor, information and
documentation reasonably requested by the Agent or any Lender for purposes of compliance with applicable “know your customer” requirements under the Patriot Act, the Beneficial Ownership Regulation or other applicable anti-money laundering
laws. 
 10.1.13     Deposit Account Control Agreement. Within 60 days after the Closing Date (or
such later date as determined by Agent), Borrowers shall execute and deliver to Agent one or more Deposit Account Control Agreements with respect to the Deposit Accounts of Borrowers maintained by Bank of America at its Singapore branch. 

  
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 10.2    Negative Covenants. Until Full Payment of
the Obligations, Obligors shall: 
 10.2.1    Stay, Extension and Usury Laws. Each Borrower and each other Obligor
covenants (to the extent that it may lawfully do so) that it shall not, and that none of the other Obligors shall, at any time insist upon, plead, or in any manner whatsoever claim or take the benefit or advantage of, any stay, extension, or usury
law wherever enacted, now or at any time hereafter in force, that may affect the covenants or the performance of this Agreement or any other Loan Document, and each Borrower and each Obligor hereby expressly waives all benefit or advantage of any
such law, and covenants that it shall not, by resort to any such law, hinder, delay, or impede the execution of any power herein granted to Agent or the Lenders, but shall suffer and permit the execution of every such power as though no such law has
been enacted. 
 10.2.2    Restricted Payments. 

(a)    Obligors will not directly or indirectly (w) declare or pay any dividend or make any other
payment or distribution on account of the Obligor’s Equity Interests (including, without limitation, any payment in connection with any merger or consolidation involving any Obligor) or to the direct or indirect holders of Obligors’ Equity
Interests in their capacity as such (other than dividends or distributions payable in Equity Interests (other than Disqualified Stock) of Obligor or to an Obligor, whether paid directly to such Obligor or indirectly through a dividend, payment or
distribution to each parent company of such Obligor which is ultimately and substantially contemporaneously with the initial payment thereof, paid to such Obligor), (x) purchase, redeem, or otherwise acquire or retire for value (including, without
limitation, in connection with any merger or consolidation involving an Obligor) any Equity Interests of an Obligor or any direct or indirect parent of an Obligor (other than any such Equity Interests owned by an Obligor), (y) make any payment on or
with respect to, or purchase, redeem, defease, or otherwise acquire or retire for value any Subordinated Debt, except (A) a payment of interest or principal at the Stated Maturity thereof, or (B) the purchase, redemption, defeasance or
other acquisition or retirement thereof for value in anticipation of satisfying a sinking fund obligation, principal installment or final maturity, in each case due within one year of the date of purchase, redemption, defeasance, acquisition or
retirement, or (z) make any Restricted Investment (all such payments and other actions set forth in clause (w) through clause (z) preceding being collectively referred to as “Restricted Payments”),
unless, at the time of and after giving effect to such Restricted Payment: 
 (i)    no Specified Event of Default
shall have occurred and be continuing or would occur as a consequence thereof; and 
 (ii)    the Specified Allowance
Condition is satisfied. 
 (b)    Section 10.2.2(a) preceding will not prohibit (i) the
payment of any dividend or consummation of any irrevocable redemption within 60 days after the date of declaration or giving of redemption notice thereof, if at the date of 

  
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declaration or notice the conditions set forth in Section 10.2.2(a) are satisfied, (ii) (x) the making of any payment on or with respect to, or in connection with,
the redemption, purchase, defeasance, acquisition or retirement for value of, any Debt of any Obligor that is subordinated to the Obligations or any Equity Interests of Parent or any Subsidiary, in each case, in exchange for, or out of the net cash
proceeds of the substantially concurrent sale (other than to an Obligor) of, (1) any subordinated Debt of Parent or (in the case of Debt of any Obligor which is a Subsidiary of Parent only) any Obligor which is a Subsidiary of Parent or
(2) any Equity Interests (other than Disqualified Stock) of Parent, (iii) the making of any payment on or with respect to, or in connection with, the defeasance, redemption, repurchase, retirement, or other acquisition of Debt of an
Obligor that is subordinated to the Obligations with the net cash proceeds from the incurrence of Permitted Refinancing Debt, (iv) the payment of any dividend or other distribution (including a pro rata repurchase of Equity Interests of a
Subsidiary) by an Obligor to the holders of its Equity Interests so long as Parent or, if such Equity Interests are held by another Obligor, such other Obligor receives at least its pro rata share, whether paid directly to such Obligor or indirectly
through a dividend or distribution to each parent company of such Obligor which is ultimately and substantially contemporaneously with the initial payment thereof, paid to such Obligor, (v) so long as no Default or Event of Default has occurred
and is continuing or would be caused thereby, the repurchase, redemption, or other acquisition or retirement for value of any Equity Interests of any Obligor or any distribution, loan or advance to a parent for the repurchase, redemption or other
acquisition or retirement for value of any Equity Interests of an Obligor in each case held by any current or former employee, officer, director or the like (or their assigns, estates or heirs) of any Obligor pursuant to any employee equity
subscription agreement, equity ownership plan, or equity award agreement or other compensatory agreement in effect from time to time; provided that the aggregate price paid for all such repurchased, redeemed, acquired, or retired Equity
Interests shall not exceed $15,000,000 in any twelve-month period (plus the net cash proceeds from the issuance of Equity Interests to employees, officers, directors or the like)(it being understood that the cancellation of Debt owed by current or
former employees, officers, directors or the like to an Obligor in connection with such repurchase, redemption or other acquisition or retirement will not be deemed to be a Restricted Payment), (vi) the making of any payment on or with respect to,
or repurchase, redemption, defeasance, or other acquisition or retirement for value of any convertible notes of Parent in connection with (A) so long as no Event of Default has occurred and is continuing or would be caused thereby and the
Specified Allowance Condition is Satisfied, an optional redemption of any convertible notes of Parent on or after the dates such notes become redeemable or (B) the honoring by Parent of any conversion request into Equity Interests (other than
Disqualified Stock) by a holder of any convertible notes of Parent (including the payment by Parent of any cash in lieu of fractional shares) in accordance with their terms, (vii) that portion of Investments the payment for which consists
exclusively of Equity Interests (other than Disqualified Stock) of Parent, (viii) other Restricted Payments in an aggregate amount not to exceed $15,000,000, (ix) the 

  
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purchases, repurchases, redemptions or other acquisitions or retirements for value of Equity Interests of Parent deemed to occur upon the exercise of stock options if such Equity Interest
represents a portion of the exercise or exchange price thereof, and any purchases, repurchases, redemptions or other acquisitions or retirements for value of Equity Interests of Parent made in lieu of withholding taxes in connection with any
exercise or exchange of warrants, options or rights to acquire Equity Interests, (x) any payments to Parent or one or more Subsidiaries of Parent in an amount not to exceed the good faith estimate of the increased Taxes of Parent or such
Subsidiary of Parent for such period that are attributable to such Borrower’s income or earnings, including items includible by Parent or its Subsidiaries under Subpart F of the Code, (xi) the making of any payment on or with respect to,
or in connection with, the defeasance, redemption, repurchase, retirement or other acquisition of Indebtedness of Parent or any Subsidiary of Parent to Parent or any Subsidiary of Parent (i.e., intercompany Indebtedness), provided that if such
Subsidiary is not an Obligor, the Specified Allowance Condition is satisfied, (xii) the making of any payment on or with respect to, or in connection with, the defeasance, redemption, repurchase, retirement or other acquisition of Disqualified
Stock of Parent or any Subsidiary with the net cash proceeds from the substantially concurrent sale of Disqualified Stock of Parent or a Subsidiary of Parent. 

(c)    The amount of all Restricted Payments (other than cash) shall be the fair market value on the date
of the Restricted Payment of the asset(s) or securities proposed to be transferred or issued by an Obligor, as the case may be, pursuant to the Restricted Payment without giving effect to subsequent changes in value. The fair market value of any
assets or securities that are required to be valued by this covenant with a fair market value in excess of $25,000,000 shall be evidenced by an Officers’ Certificate which shall be delivered to Agent not later than the date of making such
Restricted Payment. Such Officers’ Certificate shall state that such Restricted Payment is permitted and shall set forth the basis upon which the calculations required by this Section 10.2.2 were computed, together
with a copy of any fairness opinion or appraisal required by this Agreement; provided, that such Officer’s Certificate shall only be required to be delivered to Agent if pro-forma Availability after
giving effect to the applicable Restricted Payment is less than 30.0% of Revolver Commitments. In the event that a payment meets the criteria of more than one of the types of Restricted Payments described in the above clauses, including, without
limitation, Section 10.2.2(a), Parent, in its sole discretion, may order, classify and subdivide, and from time to time may reorder, resubdivide and reclassify, such Restricted Payment in any manner that complies with this
covenant. 
 10.2.3    Dividend and Other Payment Restrictions Affecting Subsidiaries. Obligors
shall not directly or indirectly, create or permit to exist or become effective any consensual encumbrance or restriction on the ability of any Subsidiary to (a)(i) pay dividends or make any other distributions to an Obligor (A) on such
Subsidiary’s Equity Interests or (B) with respect to any other interest or participation in, or measured by, such Subsidiary’s profits or (ii) pay any Debt owed to any Obligor, (b) make loans or advances to any Obligor, or
(c) transfer any of its properties or assets to any Obligor, except for such encumbrances or restrictions existing under or by reasons of (I) Existing Indebtedness or other agreements 

  
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as in effect on the date hereof and any amendments, modifications, restatements, renewals, increases, supplements, refundings, replacements, or refinancings thereof, provided that such
amendments, modifications, restatements, renewals, increases, supplements, refundings, replacements, or refinancings are not materially more restrictive, in the good faith judgment of the board of directors of Parent or the board of directors of any
applicable Subsidiary, taken as a whole, with respect to such dividend and other payment restrictions than those contained in such Existing Indebtedness and other agreements, as in effect on the date hereof, (II) this Agreement,
(III) applicable law, (IV) (x) any agreement or instrument governing or relating to Permitted Bank Debt, in each case that meets the criteria specified in clauses (i) and (xiii), respectively, of
Section 10.2.4(b); provided, that in the case of clause (I) the board of directors or an Officer of Parent shall have determined in good faith at the time that such encumbrance or restriction is created that the
encumbrance or restriction (A) would not reasonably be expected to impair the ability of Borrower to pay interest when due hereunder or to pay principal and accrued and unpaid interest when due hereunder, and (B) is not materially more
disadvantageous to the Lenders than is customary in comparable financings, and (y) any instrument governing Debt or Equity Interests of a Person acquired by any Obligor as in effect at the time of such acquisition (except to the extent such
Debt was incurred in connection with or in contemplation of such acquisition), which encumbrance or restriction is not applicable to any Person, or the properties or assets of any Person, other than the Person, or the property or assets of the
Person, so acquired, provided that, in the case of Debt, such Debt was permitted by the terms of this Agreement to be incurred, (V) customary non-assignment and similar provisions in leases, licenses, and
other contracts entered into in the ordinary course of business and consistent with past practices, (VI) purchase money obligations or Capital Lease obligations for property acquired or leased in the ordinary course of business that impose
restrictions on the property so acquired of the nature described in clause (c) preceding, (VII) any agreement for the sale or other disposition of a Subsidiary that restricts dividends, distributions, loans, advances, or transfers by such
Subsidiary pending its sale or other disposition, (VIII) Permitted Refinancing Debt, provided that the restrictions contained in the agreements governing such Permitted Refinancing Debt are not materially more restrictive, in the good faith
judgment of the board of directors of Parent or the board of directors of any applicable Subsidiary, taken as a whole, than those contained in the agreements governing the Debt being refinanced, (IX) agreements entered into with respect to
Liens securing Debt otherwise permitted to be incurred pursuant to the provisions of Section 10.2.7 that limit the right of Parent or any of its Subsidiaries to dispose of the assets subject to such Lien,
(X) provisions with respect to the disposition or distribution of assets or property in joint venture agreements and other similar agreements entered into in the ordinary course of business, (XI) restrictions on cash or other deposits or
net worth imposed by customers or suppliers under contracts entered into in the ordinary course of business, (XII) any Receivables Program for any Obligor which is not a Borrower, (XIII) any restriction imposed pursuant to contracts for
the sale or transfer of assets with respect to the transfer of the assets to be sold pursuant to such contract, (XIV) any encumbrance or restriction in connection with an acquisition of property, so long as such encumbrance or restriction
relates solely to the property so acquired and was not created in connection with or in contemplation of such acquisition; provided that in the case of Debt incurred in connection with or in contemplation of such acquisition, such Debt was permitted
to be 

  
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incurred by the terms of this Agreement; (XV) provisions in agreements or instruments which prohibit the payment of dividends or the making of other distributions with respect to any class
of capital stock or issued share capital of a Person other than on a pro rata or less restrictive basis; and (XVI) any encumbrances or restrictions imposed by any amendments, modifications, restatements, renewals, increases, supplements,
refundings, replacements or refinancings of the contracts, instruments or obligations referred to above; provided that the encumbrances or restrictions in such amendments, modifications, restatements, renewals, increases, supplements, refundings,
replacements or refinancings are not materially more restrictive, in the good faith judgment of the board of directors of Parent or the board of directors of any applicable Subsidiary, taken as a whole, than the encumbrances or restrictions prior to
such amendment, modification, restatement, renewal, increase, supplement, refunding, replacement or refinancing. 

10.2.4    Incurrence of Debt and Issuance of Preferred Stock. 

(a)    Obligors shall not directly or indirectly, create, incur, issue, assume, guarantee, or otherwise
become directly or indirectly liable, contingently or otherwise, with respect to (collectively, “incur”) any Debt (including Acquired Debt), and Parent will not issue any Disqualified Stock and no Obligor will issue any shares of preferred
stock; provided, however, that any Obligor may incur Debt (including Acquired Debt), and Parent may issue Disqualified Stock, and any Obligor that is a Subsidiary Guarantor may issue preferred stock, if the Specified Allowance
Condition is satisfied for Parent’s most recently ended four full Fiscal Quarters for which internal financial statements are available immediately preceding the date on which such additional Debt is incurred or such Disqualified Stock or
preferred stock is issued, on a pro forma basis, as if the additional Debt had been incurred, or the Disqualified Stock or preferred stock had been issued, as the case may be, and the proceeds thereof applied, at the beginning of such four-quarter
period. 
 (b)    Section 10.2.4(a) preceding will not prohibit the incurrence of any of the
following items of Debt (collectively, “Permitted Debt”): 
 (i)    the incurrence by an Obligor of
any Permitted Bank Debt; provided that the aggregate principal amount of all such Debt at any one time outstanding shall not exceed $100,000,000, plus 85.0% of the consolidated accounts receivable of Parent, plus 50.0% of the consolidated inventory
of Parent; provided, further, that none of such Debt (including specifically any Permitted Bank Debt other than the Obligations) may be secured by any of the Collateral; 

(ii)    the incurrence by Obligors of Existing Indebtedness; 

(iii)    the incurrence by the Obligors of the Obligations; 

(iv)    the incurrence by Obligors of (A) Debt incurred for the purpose of financing all or any part of the purchase
price or cost of design, construction or improvement of property, plant, or equipment used in the business of any Obligor and (B) Debt 

  
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incurred under Capital Leases, in an aggregate amount at any time outstanding, including all Permitted Refinancing Debt incurred to refund, refinance, or replace any Debt incurred pursuant to
this clause (iv), not to exceed the greater of $75,000,000 or 10.0% of Parent’s Consolidated Net Assets; 

(v)    the incurrence by an Obligor of Permitted Refinancing Debt in exchange for, or the net proceeds of which are used
to renew, discharge, extend, refund, refinance, or replace, Debt (other than intercompany Debt) that was permitted by this Agreement to be incurred under Section 10.2.4(a) or clause (ii), clause (v), clause (viii), clause
(xiii), or clause (xiv) of this Section 10.2.4(b); 
 (vi)    (x) the incurrence by an
Obligor of intercompany Debt between or among Parent and any of its Subsidiaries; provided, however, that if any Obligor is the obligor on such Debt and such Debt is in favor of a Subsidiary that is not an Obligor, (A) the
Specified Allowance Condition is satisfied with respect to such debt and (B) such Debt must be expressly subordinated to the prior payment in full in cash of the Obligations; or (y) the issuance by any of Parent’s Subsidiaries, to
Parent or to any other Obligor, of shares of preferred stock; 
 (vii)    the incurrence by any Obligor of obligations
under Hedging Agreements that are incurred for the purpose of fixing or hedging interest rate, commodity, or currency risk in the ordinary course of business for bona fide hedging purposes; provided that the notional principal amount of any
such obligations under Hedging Agreements with respect to interest rates does not exceed the amount of Debt or other liability to which such obligation relates; 

(viii)    the guarantee by an Obligor of Debt that was permitted to be incurred by another provision of this
Section 10.2.4 or that was not otherwise prohibited from being incurred hereunder; 

(ix)    the incurrence by the Obligors of Debt in accordance with the 2018 Tax Restructuring; 

(x)    (a) the incurrence by any Obligor of Debt constituting reimbursement obligations with respect to letters of
credit, bankers’ acceptances, bid, performance, appeal, reimbursement, surety and similar bonds or completion or performance guarantees or other obligations in respect of workers’ compensation claims, health, disability, or other employee
benefits or property, casualty or liability insurance or self-insurance obligations; (b) the incurrence by any Obligor of Debt arising from the honoring by a bank or other financial institution of a check, draft or similar instrument
inadvertently drawn against insufficient funds, so long as such Debt is covered within five business days; (c) endorsement of instruments or other payment items for deposit; or (d) the incurrence by any Obligor of Debt in connection with
the repurchase, redemption or other acquisition or retirement of Equity Interests held by any current or former employee, officer, director or the like of Parent or any of its Subsidiaries; provided that such repurchase, redemption or other
acquisition or retirement is permitted by Section 10.2.2(b)(v); 
 (xi)    the incurrence of
Debt arising from the agreements of an Obligor providing for indemnification, adjustment of purchase price, earn out or similar obligations, in each case, incurred or assumed in connection with the disposition of any business,


  
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assets, or Subsidiary; provided, however, that the maximum assumable liability in respect of all such Debt shall at no time exceed the gross proceeds, including non-cash proceeds (the fair market value of such non-cash proceeds being measured at the time received and without giving effect to any subsequent changes in value), actually
received by Parent or any of its Subsidiaries in connection with such disposition; 
 (xii)    the accrual of interest,
accretion or amortization of original issue discount, the payment of interest on any Debt in the form of additional Debt with the same terms, the payment of dividends on Disqualified Stock in the form of additional shares of the same class of
Disqualified Stock, and the reclassification of preferred stock as Debt due to a change in accounting principles; 

(xiii)    Reserved; 

(xiv)    the incurrence by Obligors of additional Debt in an aggregate principal amount (or accreted value, as
applicable) at any time outstanding, including all Permitted Refinancing Debt incurred to refund, refinance, or replace any Debt incurred pursuant to this clause (xiv), not to exceed $75,000,000; 

(xv)    Reserved; 

(xvi)    all premium (if any), fees, expenses, charges and additional and contingent interest on Debt incurred in
compliance with this Section 10.2.4; 
 (xvii)    Notwithstanding any other provision of this
Section 10.2.4(b), none of the Permitted Debt, other than the Obligations, may at any time be secured by a Lien on any or all of the Collateral. 

(c)    [Reserved]. 

(d)    Obligors will not incur any Debt (including Permitted Debt) that is contractually subordinated in
right of payment to any other Debt of such Obligor unless such Debt is also contractually subordinated in right of payment to the Obligations on substantially identical terms; provided, however, that no Debt of an Obligor shall be
deemed to be contractually subordinated in right of payment to any other Debt of such Obligor solely by virtue of any Liens, guarantees, maturity of payments, or structural seniority. 

(e)    For purposes of determining compliance with this Section 10.2.4, in the
event that an item of proposed Debt meets the criteria of more than one of the categories of Permitted Debt described in clause (b)(i) through clause (b)(xvi) preceding, or is entitled to be incurred pursuant to
Section 10.2.4(a), Borrower Agent may, in its sole discretion, classify or reclassify such item of Debt (or any part thereof) in any manner that complies with this Section 10.2.4 and such item of
Debt shall be treated as having been incurred pursuant to only one of such clauses or pursuant to Section 10.2.4(a). For purposes of determining any particular amount of Debt under this
Section 10.2.4, guarantees, Liens, or obligations in support of letters of credit supporting Debt shall not be included to the extent such 

  
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letters of credit are included in the amount of such Debt. Any increase in the amount of any Debt solely by reason of currency fluctuations shall not be considered an incurrence of Debt for
purposes of this covenant. Accrual of interest and the payment of interest in the form of additional Debt shall not be deemed to be an incurrence of Debt for purposes of this Section 10.2.4. 

10.2.5    Asset Sales. 

(a)    Obligors shall not (i) sell, lease, convey, or otherwise dispose of any assets or rights
(including by way of a sale-and-leaseback) other than sales of inventory in the Ordinary Course of Business, (ii) with respect to Parent, sell Equity Interests in
any of its Subsidiaries, or (iii) with respect to Obligors other than Parent, issue Equity Interests (each of the foregoing, an “Asset Sale”), unless (y) Parent (or the other Obligor, as the case may be) receives
consideration at the time of such Asset Sale at least equal to the fair market value (evidenced by a resolution of Parent’s board of directors set forth in an Officer’s Certificate delivered to Agent) of the assets sold or otherwise
disposed of and (z) at least 75.0% of the consideration received therefor by Parent or such other Obligor is in the form of cash or other Qualified Proceeds. 

(b)    Notwithstanding the foregoing, the following shall not be deemed to be Asset Sales: (i) any
single transaction or series of related transactions that (A) involves assets having a fair market value of less than $5,000,000 or (B) results in Net Proceeds to Parent and its Subsidiaries of less than $5,000,000; (ii) a transfer of
assets between or among Obligors, whether transferred directly to such Obligors or indirectly through a transfer to each parent company or Subsidiary of such Obligors which is ultimately and substantially contemporaneously with the initial transfer
thereof, transferred to such Obligors; (iii) an issuance of Equity Interests by an Obligor other than Parent to Parent; (iv) the sale, lease, conveyance, or other disposition of assets or rights (other than Accounts) by an Obligor to a
Subsidiary that is not an Obligor so long as the Specified Allowance Condition is satisfied; (v) the sale, lease, conveyance, or other disposition of Accounts by an Obligor to a Subsidiary that is not an Obligor so long as the Specified
Allowance Condition is satisfied and no Specified Event of Default exists immediately before and after giving effect thereto; (vi) the sale, lease, conveyance, or other disposition of assets or rights by an Obligor in accordance with the 2018
Tax Restructuring; (vii) the sale, lease, conveyance, or other disposition of any Receivable Program Assets by any Subsidiary of Parent which is an Obligor other than a Borrower in connection with a Receivables Program; (viii) the sale,
lease, conveyance, or other disposition of any inventory or other current assets, excluding Accounts, by any Obligor in the Ordinary Course of Business; (ix) the granting of a Permitted Lien; (x) the licensing by an Obligor of intellectual
property in the Ordinary Course of Business or on commercially reasonable terms; (xi) (A) the sale, lease, conveyance, or other disposition of obsolete, surplus, discontinued, damaged, excess or worn out equipment or other property no longer
useful in Obligors’ business or (B) the lapse of registered patents, trademarks and other intellectual property or the termination of license agreements related thereto to the extent not economically desirable in the


  
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conduct of the business; (xii) the making or liquidating of any Restricted Payment or Permitted Investment that is permitted by Section 10.2.2; (xiii) the
disposition of cash or Cash Equivalents in the ordinary course of business; (xiv) any condemnation or other eminent domain event or casualty event; (xv) the surrender or waiver of litigation rights or settlement, release or surrender of
tort or other litigation claims of any kind if it is for the benefit of an Obligor (as determined in good faith by the board of directors of Parent); (xvi) a concurrent purchase and sale or exchange of assets used in a Permitted Business between
Obligors and another Person; provided that such assets received are of a comparable fair market value (as determined by the board of directors) to the assets exchanged and any cash received must be applied in accordance with this
Section 10.2.5; (xvii) the issuance or sale of directors’ qualifying shares or shares or interests required to be held by foreign nationals pursuant to local law or the like; and (xviii) the sale or other
disposition of the patents approved by Agent. 
 (c)    Notwithstanding any other provision of this
Agreement to the contrary, no Obligor will enter into any Asset Sale or other sale, transfer, conveyance, or disposition of any asset or other property, in each such case if such Asset Sale, sale, transfer, conveyance, or disposition is of assets or
other property which constitutes Collateral; provided that Obligors may (i) sell Inventory in the Ordinary Course of Business, (ii) sell, transfer, convey or dispose of property and assets, including Collateral, among Borrowers,
(iii) if no Event of Default exists, sell, transfer, convey, or dispose of Collateral consisting of Equipment and Inventory in an aggregate amount not in excess of $25,000,000 during the term of this Agreement, (iv) make Permitted
Investments, (v) grant licenses of Intellectual Property in the Ordinary Course of Business or on commercially reasonable terms, provided that the owner of any such Intellectual Property which is the subject of any such license retains
ownership of such Intellectual Property and any such license granted is subject to Agent’s Liens, (vi) (A) sell, transfer, convey or dispose of obsolete, surplus, discontinued, damaged, excess or worn out Equipment or other property that
is no longer useful in an Obligor’s business or (B) allow the lapse of registered patents, trademarks and other intellectual property approved by Agent or the termination of license agreements related thereto, to the extent not
economically desirable in the conduct of the business with approval by Agent, (vii) dispose of cash or Cash Equivalents in the ordinary course of business, (viii) surrender or waive litigation rights or settle, release or surrender tort or
other litigation claims of any kind if it is for the benefit of an Obligor (as determined in good faith by the board of directors of Parent), and (ix) sell or otherwise dispose of any patents approved by Agent. 

10.2.6    Transactions with Affiliates. 

(a)    Subject to Section 10.2.5(c), Obligors will not, make any payment to, or
sell, lease, transfer, or otherwise dispose of any of its properties or assets to, or purchase any property or assets from, or enter into or make or amend any transaction, contract, agreement, understanding, loan, advance, or guarantee with, or for
the benefit of, any Affiliate (each, an “Affiliate Transaction”), unless (i) such 

  
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Affiliate Transaction (when viewed together with related Affiliate Transactions, if any) is on terms that are no less favorable to the relevant Obligor than those that would be obtained in a
comparable transaction by the Obligor with an unrelated Person and (ii) Parent delivers to Agent (A) with respect to any Affiliate Transaction or series of related Affiliate Transactions involving aggregate consideration in excess of
$20,000,000, a resolution of the board of directors of Parent set forth in an Officers’ Certificate certifying that such Affiliate Transaction complies with this covenant and that such Affiliate Transaction has been approved by a majority of
the disinterested members of the board of directors (of which there must be at least one) of Parent and (B) with respect to any Affiliate Transaction or series of related Affiliate Transactions involving aggregate consideration in excess of
$50,000,000, an opinion as to the fairness to the Lenders of such Affiliate Transaction from a financial point of view issued by an accounting, appraisal, or investment banking firm of national standing. 

(b)    The following items shall not be deemed to be Affiliate Transactions and, therefore, will not be
subject to the provisions of Section 10.2.6: 
 (i)    Payment pursuant to any employment
agreement or arrangement entered into by an Obligor or any employee benefit plan available to employees of an Obligor generally, in each case in the Ordinary Course of Business of Obligors; 

(ii)    Affiliate Transactions between, among or for the benefit of Obligors and/or their Subsidiaries; 

(iii)    transactions pursuant to agreements or arrangements in existence or contemplated on the Closing Date or any
amendment, modification or extension thereof to the extent such an amendment, modification or extension thereof and fully disclosed to Agent and Lenders; 

(iv)    payment of reasonable directors fees to Persons who are not otherwise Affiliates of Parent and indemnity provided
on behalf of officers, directors, and employees of Parent or any of its Subsidiaries as determined in good faith by the board of directors of Parent; 

(v)    Permitted Investments; 

(vi)    Debt permitted by Section 10.2.4; 

(vii)    Restricted Payments that are permitted by Section 10.2.2; 

(viii)    transaction in accordance with the 2018 Tax Restructuring; 

(ix)    any tax sharing agreement or arrangement and payments pursuant thereto among Obligors and its Subsidiaries and
any other Person with which Obligors or its Subsidiaries is required or permitted to file a consolidated, combined or unitary tax return or with which the Company or any of its Subsidiaries is or could be part of a consolidated, combined or unitary
group for tax purposes; 

  
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 (x)    transactions with a joint venture or other Person that is an
Affiliate of the Company solely because an Obligor owns, directly or through a Subsidiary, an Equity Interest in, or controls, such joint venture or other Person; and 

(xi)    transactions between an Obligor or any of its Subsidiaries and any Person, a director of which is also a director
of an Obligor or any direct or indirect parent company of Obligor, and such director is the sole cause for such Person to be deemed an Affiliate of such Obligor or any of its Subsidiaries. 

(c)    For purposes of this Section 10.2.6, any transaction or series of related
Affiliate Transactions between an Obligor and an Affiliate that is approved by a majority of the disinterested members of the board of directors (of which there must be at least one to utilize this method of approval) of Parent and evidenced by a
board resolution or for which a fairness opinion has been issued shall be deemed to be on terms that are no less favorable to the relevant Obligor than those that would have been obtained in a comparable transaction by such Obligor with an unrelated
Person and thus shall be permitted under this Section 10.2.6, subject to the limitations in Section 10.2.5(c). 

10.2.7    Liens. 

(a)    Obligors will not, directly or indirectly, create, incur, assume, or suffer to exist any Lien of any
kind securing Debt on any asset now owned or hereafter acquired, other than Permitted Liens and Liens in favor of Agent securing the Obligations. 

(b)    The foregoing negative pledge shall not apply to any Margin Stock to the extent such application
would violate or require filings or other actions by any Lender under Regulation U or any similar law. 

10.2.8    Amendment of Subordination Provisions. Parent will not amend, modify, or alter the terms
of the any Subordinated Debt in any way that will (a) increase the rate of or change the time for payment of interest on any Subordinated Debt, (b) increase the principal of, advance the final maturity date of or shorten the Weighted
Average Life to Maturity of any Subordinated Debt, (c) alter the redemption provisions or the price or terms at which Parent is required to offer to purchase any Subordinated Debt, or (d) amend the subordination provisions of any
Subordinated Debt. 
 10.2.9    Limitation on Issuances and Sales of Equity Interests in Wholly Owned
Subsidiaries. Subject to Section 10.2.5, Obligors shall not, transfer, convey, sell, lease, or otherwise dispose of any Equity Interests in any Wholly Owned Subsidiary of an Obligor to any Person (other than an Obligor
or a Wholly Owned Subsidiary of an Obligor), unless (i) such transfer, conveyance, sale, lease, or other disposition is of all the Equity Interests in such Wholly Owned Subsidiary or immediately following such transfer, conveyance, sale, lease,
or other disposition, such Wholly Owned Subsidiary is a Subsidiary and (ii) the cash Net Proceeds from such transfer, conveyance, sale, lease, or other disposition are applied, at any time an Event of Default exists and upon notice by Agent to
Borrower Agent 

  
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during a Triggered Activation Period, in accordance with Section 5.7, and (b) Obligors (excluding Parent) shall not issue any of its Equity Interests (other than,
if necessary, shares of its capital stock or issued share capital constituting directors’ qualifying shares) to any Person other than to Parent or a Wholly Owned Subsidiary of Parent unless immediately following such issuance the Wholly Owned
Subsidiary is an Obligor. 
 10.2.10    Limitation on Sale and Leaseback Transactions. 

(a)    Obligors shall not enter into any sale and leaseback transaction; provided that Obligors may
enter into a sale and leaseback transaction if (i) the transfer of assets in that sale and leaseback transaction is permitted by Section 10.2.5, and (ii) the property subject to such sale and leaseback transaction
is not Collateral. 
 (b)    The restrictions in Section 10.2.10(a) shall not
apply to any sale and leaseback transaction if (i) the transaction is solely between Obligors and their Subsidiaries and such transaction is permitted under Section 10.2.6 or (ii) the sale and leaseback
transaction is consummated within 180 days after the purchase of the assets subject to such transaction. 

10.2.11    Merger and Consolidations. Obligors shall not, directly or indirectly, consolidate or
merge with or into another Person or sell, assign, transfer, convey, or otherwise dispose of all or substantially all of its properties or assets, in one or more related transactions, to another Person, unless in connection with any such merger (but
excluding an sale, assignment, transfer, conveyance, or other disposition) (i) an Obligor is the surviving corporation (if Parent is involved in such transaction, Parent is the surviving Person), (ii) immediately after such merger no Default or
Event of Default exists, and (iii) Parent shall have delivered to Agent an Officers’ Certificate stating that such merger complies with the terms of this Agreement. In addition, Obligors shall not, directly or indirectly, lease
(A) any of the Collateral except as permitted by Section 10.2.5 or (B) or substantially all of its Property, in one or more related transactions, to any other Person. 

10.2.12     Fundamental Changes. No Obligor shall change its name, its charter or other
organizational identification number, or its form or state of organization without providing Agent notice thereof within 10 days prior to such change (or such shorter period as agreed by Agent). Subject Section 10.2.5 and
Section 10.2.11, no Obligor shall liquidate, wind up its affairs or dissolve itself. 

10.2.13     Organic Documents. No Borrower shall amend, modify or otherwise change any of its
Organic Documents in a manner that is materially adverse to the Lenders. 
 10.2.14     Tax
Consolidation. No Obligor shall file or consent to the filing of any consolidated income tax return with any Person other than Parent and its Subsidiaries. 

10.2.15     Accounting Changes. No Obligor shall make any material change in accounting treatment or
reporting practices, except as required by GAAP and in accordance with Section 1.2; or change its Fiscal Year. 

  
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 10.2.16     Hedging Agreements. No Obligor shall enter
into any Hedging Agreement, except to hedge risks arising in the Ordinary Course of Business and not for speculative purposes. 

10.2.17     Conduct of Business. No Obligor shall engage in any business, other than its business as
conducted on the Closing Date and any activities incidental complementary or reasonably related thereto. 

10.2.18     Plans. No Obligor shall become party to any Multiemployer Plan or Foreign Plan, other
than any in existence on the Closing Date. 
 10.3    Financial Covenants. Until Full Payment of
the Obligations, Parent shall: 
 10.3.1    Fixed Charge Coverage Ratio. Maintain a Fixed Charge
Coverage Ratio of at least 1.00 to 1.00, measured on a trailing 4-quarter basis as of the last day of each Fiscal Quarter on a consolidated basis for Parent and Subsidiaries while a Triggered Activation Period
is in effect, measured for the most recent period for which financial statements were delivered hereunder prior to the Triggered Activation Period and each period ending thereafter until the Triggered Activation Period is no longer in effect. 

SECTION 11.    EVENTS OF DEFAULT; REMEDIES ON DEFAULT 

11.1    Events of Default. Each of the following shall be an “Event of
Default” if it occurs for any reason whatsoever, whether voluntary or involuntary, by operation of law or otherwise: 

(a)    Any Borrower fails to pay when due (whether at stated maturity, on demand, upon acceleration or
otherwise), (i) the principal amount of the Obligations or (ii) any other Obligations and such failure continues unremedied for a period of three Business Days; 

(b)    Any representation, warranty or other written statement of an Obligor made in connection with any
Loan Documents or transactions contemplated thereby is incorrect or misleading in any material respect when given; 

(c)    A Borrower breaches or fail to perform any covenant contained in Section 7.2,
7.6, 8.1, 8.2.4, 8.2.5, 8.6.2, 10.1.1, 10.1.2, 10.2 or 10.3; 
 (d)    An Obligor breaches or fails
to perform any other covenant contained in any Loan Documents, and such breach or failure is not cured within 30 days after a Senior Officer of such Obligor has knowledge thereof or receives notice thereof from Agent, whichever is sooner;
provided, that such notice and opportunity to cure shall not apply if the breach or failure to perform is not capable of being cured within such period or is a willful breach by an Obligor; 

(e)    A Guarantor repudiates, revokes or attempts to revoke its guaranty; an Obligor or third party denies
or contests the validity or enforceability of any Loan Documents or Obligations, or the perfection or priority of any Lien granted to Agent; or any Loan Document ceases to be in full force or effect for any reason (other than a waiver or release by
Agent and Lenders); 

  
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 (f)    Any breach or default of an Obligor occurs under
(i) any Hedging Agreement or (ii) any instrument or agreement to which it is a party or by which it or any of its Properties is bound, relating to any Debt (other than the Obligations), in each case, in excess of $15,000,000, but solely to
the extent the effect of such breach or default is to cause, or to permit (with all applicable grace periods having expired) the holder or holders of such Debt to cause, such Debt to become or be declared due and payable (or mandatorily redeemable)
prior to its stated maturity or the stated maturity of any underlying obligation; 
 (g)    Any judgment
or order for the payment of money is entered against an Obligor in an amount that exceeds, individually or cumulatively with all unsatisfied judgments or orders against all Obligors, $15,000,000 (net of amounts paid or covered by insurance
(including self-insurance) or indemnity as to which the insurer or indemnifying party, as applicable, has been notified of such judgment or order and has not disputed or otherwise contested in writing such insurance coverage or indemnification
obligation), and such judgment or order remains undischarged for a period of 30 days unless a stay of enforcement of such judgment or order is in effect; 

(h)    Reserved; 

(i)    An Obligor is enjoined, restrained or in any way prevented by any Governmental Authority from
conducting any material part of its business; an Obligor suffers the loss, revocation or termination of any material license, permit, lease or agreement necessary to its business; there is a cessation of any material part of an Obligor’s
business for a material period of time; any material Collateral or Property of an Obligor is taken or impaired through condemnation; an Obligor agrees to or commences any liquidation, dissolution or winding up of its affairs; or an Obligor ceases to
be Solvent; 
 (j)    An Insolvency Proceeding is commenced by an Obligor; an Obligor makes an offer of
settlement, extension or composition to its unsecured creditors generally; a trustee is appointed to take possession of any substantial Property of or to operate any of the business of an Obligor; or an Insolvency Proceeding is commenced against an
Obligor and: the Obligor consents to institution of the proceeding, the petition commencing the proceeding is not timely contested by the Obligor, the petition is not dismissed within 30 days after filing, or an order for relief is entered in the
proceeding;  
 (k)    An ERISA Event occurs
with respect to a Pension Plan or Multiemployer Plan that has resulted or would reasonably be expected to result in liability of an Obligor to a Pension Plan, Multiemployer Plan or PBGC, or that constitutes grounds for appointment of a trustee for
or termination by the PBGC of any Pension Plan or Multiemployer Plan; an Obligor or ERISA Affiliate fails to 

  
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pay when due any installment payment with respect to its withdrawal liability under Section 4201 of ERISA under a Multiemployer Plan; or any event similar to the foregoing occurs or exists
with respect to a Foreign Plan, in any such case, that would reasonably be expected to have a Material Adverse Effect; 

(l)    any Obligor or any of its Senior Officers (excluding specifically any person who was a Senior
Officer of an Obligor prior to the Closing Date but was not employed by any Obligor at any time on or after the Closing Date) is convicted for (i) a felony committed in the conduct of such Obligor’s business or (ii) any state or
federal law (including the Controlled Substances Act, the Money Laundering Control Act of 1986, and the Illegal Exportation of War Materials Act) that could lead to forfeiture of any material Collateral or would reasonably be expected to cause a
Material Adverse Effect; 
 (m)    any Senior Notes are not paid, repurchased, redeemed or otherwise
retired on or before 90 days prior to its respective final maturity date unless (i) Borrowers have established a cash account for such purpose pursuant to a Dominion Account at Bank of America or (ii) an additional Reserve against the
Borrowing Base has been established for such purpose, in any such case in an amount equal to the amount required to pay such Debt in full at such final maturity date; 

(n)    A Change of Control occurs; or 

(o)    Any Obligor is declared by the Minister of Finance of Singapore to be a company to which Part IX of
the Companies Act, Chapter 50 of Singapore applies. 
 11.2    Remedies upon Default. If an
Event of Default described in Section 11.1(j) occurs with respect to any Obligor, then to the extent permitted by Applicable Law, all Obligations (other than Secured Bank Product Obligations) shall become automatically due
and payable and all Revolver Commitments shall terminate, without any action by Agent or notice of any kind. In addition, or if any other Event of Default exists, Agent may in its discretion (and shall upon written direction of Required Lenders) do
any one or more of the following from time to time: 
 (a)    declare any Obligations (other than Secured
Bank Product Obligations) immediately due and payable, whereupon they shall be due and payable without diligence, presentment, demand, protest or notice of any kind, all of which are hereby waived by Borrowers to the fullest extent permitted by
Applicable Law; 
 (b)    terminate, reduce or condition any Revolver Commitment or adjust the Borrowing
Base; 
 (c)    require Obligors to Cash Collateralize their LC Obligations, Secured Bank Product
Obligations and other Obligations that are contingent or not yet due and payable, and if Obligors fail to deposit such Cash Collateral, Agent may (and shall upon the direction of Required Lenders) advance the required Cash Collateral as Revolver
Loans (whether or not an Overadvance exists or is created thereby, or the conditions in Section 6 are satisfied); and 

  
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 (d)    exercise any other rights or remedies afforded under
any agreement, by law, at equity or otherwise, including the rights and remedies of a secured party under the UCC. Such rights and remedies include the rights to (i) take possession of any Collateral; (ii) require Borrowers to assemble
Collateral, at Borrowers’ expense, and make it available to Agent at a place designated by Agent; (iii) enter any premises where Collateral is located and store Collateral on such premises until sold (and if the premises are owned or
leased by a Borrower, Borrowers agree not to charge for such storage); and (iv) sell or otherwise dispose of any Collateral in its then condition, or after any further manufacturing or processing thereof, at public or private sale, with such
notice as may be required by Applicable Law, in lots or in bulk, at such locations, all as Agent, in its discretion, deems advisable. Each Borrower agrees that 10 days notice of any proposed sale or other disposition of Collateral by Agent shall be
reasonable, and that any sale conducted on the internet or to a licensor of Intellectual Property shall be commercially reasonable. Agent may conduct sales on any Obligor’s premises, without charge, and any sale may be adjourned from time to
time in accordance with Applicable Law. Agent shall have the right to sell, lease or otherwise dispose of any Collateral for cash, credit or any combination thereof, and Agent may purchase any Collateral at public or, if permitted by law, private
sale and, in lieu of actual payment of the purchase price, may credit bid and set off the amount of such price against the Obligations. 

11.3    Right to Cure. 

11.3.1    Notwithstanding anything to the contrary contained in Section 11.1(c),
in the event that Parent fails to comply with the requirements of the covenant set forth in Section 10.3 for any period, until the expiration of (a) with respect to a breach of such covenant that occurs on the first
day of the Triggered Activation Period, the date that is 10 days after such date or (b) otherwise, the 10th day after the date on which financial statements with respect to the relevant period for which the Fixed Charge Coverage Ratio is being
measured are required to be delivered pursuant to Section 10.1.2 (the “Cure Period”), Parent shall have the right to obtain a cash equity contribution (funded with proceeds of Equity Interests that are not
Disqualified Capital Stock issued by Parent or other equity issued by Parent having terms reasonably acceptable to Agent) (the “Cure Right”), and upon the receipt by Parent of net cash proceeds pursuant to the exercise of the Cure
Right (including through the capital contribution of any such net cash proceeds to Parent, the “Specified Equity Contribution”), the Fixed Charge Coverage Ratio shall be recalculated, giving effect to a pro forma increase to
Consolidated Cash Flow for such period in an amount equal to such net cash proceeds; provided that such pro forma adjustment to Consolidated Cash Flow shall be made solely for the purpose of determining the existence of a Default or an Event
of Default under the covenant set forth in Section 10.3 with respect to any period that includes the Fiscal Quarter for which such Cure Right was exercised and not for any other purpose under any Loan Document;
provided, further, that until the expiration of the Cure Period, neither Agent nor any Lender shall have the right to exercise any remedies against any Obligor or any Collateral as a result of the


  
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occurrence and continuance of an Event of Default under Section 11.1(c) arising from the failure to comply with Section 10.3, and then only if
a Cure Right to remedy such Event of Default is available at such time under Section 11.3.2. 

11.3.2    If, after the exercise of the Cure Right and the recalculations pursuant to
Section 11.3.1 above, Parent shall then be in compliance with the requirements of the covenant set forth in Section 10.3 (including for purposes of Section 6.2), Borrowers
shall be deemed to have satisfied the requirements of such covenant as of the relevant date of determination with the same effect as though there had been no failure to comply therewith at such date, and the applicable Default or Event of Default
under Section 11.1(c) that had occurred shall be deemed cured; provided that (a) in each four Fiscal Quarter period, there shall be at least two Fiscal Quarters in which the Cure Right is not exercised,
(b) there shall be no more than five Specified Equity Contributions during the term of this Agreement, (c) with respect to any exercise of the Cure Right, the Specified Equity Contribution shall be no greater than the amount required to
cause Borrowers to be in compliance with the covenant set forth in Section 10.3, and (d) all Specified Equity Contributions will be disregarded for purposes of determining the availability of any baskets or carve-outs
with respect to the covenant set forth in Section 10.3 hereof or for any other purpose. 

11.4    License. Agent is hereby granted an irrevocable,
non-exclusive license or other right to use, license or sub-license (without payment of royalty or other compensation to any Person) any or all Intellectual Property of
Borrowers, computer hardware and software, trade secrets, brochures, customer lists, promotional and advertising materials, labels, packaging materials and other Property, in advertising for sale, marketing, selling, collecting, completing
manufacture of, or otherwise exercising any rights or remedies with respect to, any Collateral. Each Borrower’s rights and interests under Intellectual Property shall inure to Agent’s benefit. 

11.5    Setoff. When an Event of Default has occurred and is continuing, Agent, Issuing Bank,
Lenders, and any of their Affiliates are authorized, to the fullest extent permitted by Applicable Law, to set off and apply any and all deposits (general or special, time or demand, provisional or final, in whatever currency) at any time held and
other obligations (in whatever currency) at any time owing by Agent, Issuing Bank, such Lender or such Affiliate to or for the credit or the account of an Obligor against its Obligations, whether or not Agent, Issuing Bank, such Lender or such
Affiliate shall have made any demand under this Agreement or any other Loan Document and although such Obligations may be contingent or unmatured or are owed to a branch or office of Agent, Issuing Bank, such Lender or such Affiliate different from
the branch or office holding such deposit or obligated on such Debt. The rights of Agent, Issuing Bank, each Lender and each such Affiliate under this Section are in addition to other rights and remedies (including other rights of setoff) that such
Person may have. 
 11.6    Remedies Cumulative; No Waiver. 

11.6.1    Cumulative Rights. All agreements, warranties, guaranties, indemnities and other
undertakings of Obligors under the Loan Documents are cumulative and not in derogation of each other. The rights and remedies of Agent and Lenders under the Loan Documents are cumulative, may be exercised at any time and from time to time,
concurrently or in any order, and are not exclusive of any other rights or remedies available by agreement, by law, at equity or otherwise. All such rights and remedies shall continue in full force and effect until Full Payment of all Obligations.


  
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 11.6.2    Waivers. No waiver or course of dealing
shall be established by (a) the failure or delay of Agent or any Lender to require strict performance by any Obligor under any Loan Document, or to exercise any rights or remedies with respect to Collateral or otherwise; (b) the making of
any Revolver Loan or issuance of any Letter of Credit during a Default, Event of Default or other failure to satisfy any conditions precedent; or (c) acceptance by Agent or any Lender of any payment or performance by an Obligor under any Loan
Documents in a manner other than that specified therein. Any failure to satisfy a financial covenant on a measurement date shall not be cured or remedied by satisfaction of such covenant on a subsequent date. 

SECTION 12.    AGENT 

12.1    Appointment, Authority and Duties of Agent. 

12.1.1    Appointment and Authority. Each Secured Party appoints and designates Bank of America as
Agent under all Loan Documents. Agent may, and each Secured Party authorizes Agent to, enter into all Loan Documents to which Agent is intended to be a party and accept all Security Documents. Any action taken by Agent in accordance with the
provisions of the Loan Documents, and the exercise by Agent of any rights or remedies set forth therein, together with all other powers reasonably incidental thereto, shall be authorized by and binding upon all Secured Parties. Without limiting the
generality of the foregoing, Agent shall have the sole and exclusive authority to (a) act as the disbursing and collecting agent for Lenders with respect to all payments and collections arising in connection with the Loan Documents;
(b) execute and deliver as Agent each Loan Document, including any intercreditor or subordination agreement, and accept delivery of each Loan Document; (c) act as collateral agent for Secured Parties for purposes of perfecting and
administering Liens under the Loan Documents, and for all other purposes stated therein; (d) manage, supervise or otherwise deal with Collateral; and (e) take any Enforcement Action or otherwise exercise any rights or remedies with respect
to any Collateral or under any Loan Documents, Applicable Law or otherwise. Agent alone is authorized to determine eligibility and applicable advance rates under the Borrowing Base, whether to impose or release any reserve, or whether any conditions
to funding or issuance of a Letter of Credit have been satisfied, which determinations and judgments, if exercised in good faith, shall exonerate Agent from liability to any Secured Party or other Person for any error in judgment. 

12.1.2    Duties. The title of “Agent” is used solely as a matter of market custom and the
duties of Agent are administrative in nature only. Agent has no duties except those expressly set forth in the Loan Documents, and in no event does Agent have any agency, fiduciary or implied duty to or relationship with any Secured Party or other
Person by reason of any Loan Document or related transaction. The conferral upon Agent of any right shall not imply a duty to exercise such right, unless instructed to do so by Lenders in accordance with this Agreement. 

  
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 12.1.3    Agent Professionals. Agent may perform its
duties through agents and employees. Agent may consult with and employ Agent Professionals, and shall be entitled to act upon, and shall be fully protected in any action taken in good faith reliance upon, any advice given by an Agent Professional.
Agent shall not be responsible for the negligence or misconduct of any agents, employees or Agent Professionals selected by it with reasonable care. 

12.1.4    Instructions of Required Lenders. The rights and remedies conferred upon Agent under the
Loan Documents may be exercised without the necessity of joining any other party, unless required by Applicable Law. In determining compliance with a condition for any action hereunder, including satisfaction of any condition in
Section 6, Agent may presume that the condition is reasonably satisfactory to a Secured Party unless Agent has received notice to the contrary from such Secured Party before Agent takes the action. Agent may request
instructions from Required Lenders or other Secured Parties with respect to any act (including the failure to act) in connection with any Loan Documents or Collateral, and may seek assurances to its satisfaction from Secured Parties of their
indemnification obligations against Claims that could be incurred by Agent. Agent may refrain from any act until it has received such instructions or assurances, and shall not incur liability to any Person by reason of so refraining. Instructions of
Required Lenders shall be binding upon all Secured Parties, and no Secured Party shall have any right of action whatsoever against Agent as a result of Agent acting or refraining from acting pursuant to instructions of Required Lenders.
Notwithstanding the foregoing, instructions by and consent of specific parties shall be required to the extent provided in Section 14.1.1. In no event shall Agent be required to take any action that it determines in its
discretion is contrary to Applicable Law or any Loan Documents or could subject any Agent Indemnitee to liability. 

12.2    Agreements Regarding Collateral and Borrower Materials. 

12.2.1    Lien Releases; Care of Collateral. 

(a)    Secured Parties authorize Agent to release any Lien on any Collateral (i) upon Full Payment of
the Obligations; (ii) that is the subject of a disposition or Lien that Borrowers certify in writing is an Asset Sale permitted hereunder or a Permitted Lien entitled to priority over Agent’s Liens (and Agent may rely conclusively on such
certificate without further inquiry); (iii) that does not constitute a material part of the Collateral; or (iv) subject to Section 14.1, with the consent of Required Lenders. Secured Parties authorize Agent to
subordinate its Liens to any Lien entitled to priority hereunder. Agent has no obligation to assure that any Collateral exists or is owned by an Obligor, or is cared for, protected or insured, nor to assure that Agent’s Liens have been properly
created, perfected or enforced, or are entitled to any particular priority, nor to exercise any duty of care with respect to any Collateral. Agent shall execute and deliver to Borrowers releases and other instruments as may be necessary to terminate
Agent’s Lien in the Collateral pursuant to clauses (i), (ii), (iii) or (iv) of this Section 12.2.1 and deliver to Borrowers, or such other Person as Borrowers may reasonably request of Agent, any Collateral, if
any, that is held in Agent’s possession. 

  
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 12.2.2    Possession of Collateral. Agent and Secured
Parties appoint each Secured Party as agent (for the benefit of Secured Parties) for the purpose of perfecting Liens in Collateral held or controlled by it, to the extent such Liens are perfected by possession or control. If a Secured Party obtains
possession or control of any Collateral, it shall notify Agent thereof and, promptly upon Agent’s request, deliver such Collateral to Agent or otherwise deal with it in accordance with Agent’s instructions. 

12.2.3    Reports. Agent shall promptly provide to Lenders, when complete, any field examination,
audit or appraisal report prepared for Agent with respect to any Obligor or Collateral (“Report”). Reports and other Borrower Materials may be made available to Lenders by providing access to them on the Platform, but Agent shall
not be responsible for system failures or access issues that may occur from time to time. Each Lender agrees (a) that Reports are not intended to be comprehensive audits or examinations, and that Agent or any other Person performing an audit or
examination will inspect only limited information and will rely significantly upon Borrowers’ books, records and representations; (b) that Agent makes no representation or warranty as to the accuracy or completeness of any Borrower
Materials and shall not be liable for any information contained in or omitted from any Borrower Materials, including any Report; and (c) to keep all Borrower Materials confidential and strictly for such Lender’s internal use, not to
distribute any Report or other Borrower Materials (or the contents thereof) to any Person (except to such Lender’s Participants, attorneys and accountants), and to use all Borrower Materials solely for administration of the Obligations. Each
Lender shall indemnify and hold harmless Agent and any other Person preparing a Report from any action such Lender may take as a result of or any conclusion it may draw from any Borrower Materials, as well as from any Claims arising as a direct or
indirect result of Agent furnishing same to such Lender, via the Platform or otherwise. 
 12.3    Action
Upon Default. Agent shall not be deemed to have knowledge of any Default or Event of Default, or of any failure to satisfy any conditions in Section 6, unless it has received written notice from a Borrower or
Required Lenders specifying the occurrence and nature thereof. If a Lender acquires knowledge of a Default, Event of Default or failure of such conditions, it shall promptly notify Agent and the other Lenders thereof in writing. Each Secured Party
agrees that, except as otherwise provided in any Loan Documents or with the written consent of Agent and Required Lenders, it will not take any Enforcement Action, accelerate Obligations (other than Secured Bank Product Obligations) or assert any
rights relating to any Collateral. 
 12.4    Reliance By Agent. Agent shall be entitled to
rely, and shall be fully protected in relying, upon any certification, notice or other communication (including those by telephone, telex, telegram, telecopy, e-mail or other electronic means) believed by it
to be genuine and correct and to have been signed, sent or made by the proper Person. Agent shall have a reasonable and practicable amount of time to act upon any instruction, notice or other communication under any Loan Document, and shall not be
liable for any delay in acting. 
 12.5    Ratable Sharing. If any Lender obtains any
payment or reduction of any Obligation, whether through set-off or otherwise, in excess of its ratable share of such Obligation, such Lender shall forthwith purchase from Secured Parties participations in the
affected Obligation as are necessary to share the excess payment or reduction on a Pro Rata basis or in accordance 

  
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with Section 5.6.2, as applicable. If any of such payment or reduction is thereafter recovered from the purchasing Lender, the purchase shall be rescinded and the
purchase price restored to the extent of such recovery, but without interest. Notwithstanding the foregoing, if a Defaulting Lender obtains a payment or reduction of any Obligation, it shall immediately turn over the full amount thereof to Agent for
application under Section 4.2.2 and it shall provide a written statement to Agent describing the Obligation affected by such payment or reduction. No Lender shall set off against a Dominion Account without Agent’s
prior consent. 
 12.6    Indemnification. EACH SECURED PARTY SHALL INDEMNIFY AND HOLD HARMLESS
AGENT INDEMNITEES AND ISSUING BANK INDEMNITEES, TO THE EXTENT NOT REIMBURSED BY OBLIGORS, ON A PRO RATA BASIS, AGAINST ALL CLAIMS THAT MAY BE INCURRED BY OR ASSERTED AGAINST ANY SUCH INDEMNITEE, PROVIDED THAT ANY CLAIM AGAINST AN AGENT
INDEMNITEE RELATES TO OR ARISES FROM ITS ACTING AS OR FOR AGENT (IN THE CAPACITY OF AGENT). In Agent’s discretion, it may reserve for any Claims made against an Agent Indemnitee or Issuing Bank Indemnitee, and may satisfy any judgment,
order or settlement relating thereto, from proceeds of Collateral prior to making any distribution of Collateral proceeds to Secured Parties. If Agent is sued by any receiver, trustee or other Person for any alleged preference or fraudulent
transfer, then any monies paid by Agent in settlement or satisfaction of such proceeding, together with all interest, costs and expenses (including attorneys’ fees) incurred in the defense of same, shall be (to the extent not reimbursed by
Obligors) promptly reimbursed to Agent by each Secured Party to the extent of its Pro Rata share. 

12.7    Limitation on Responsibilities of Agent. Agent shall not be liable to any Secured
Party for any action taken or omitted to be taken under the Loan Documents, except for losses directly and solely caused by Agent’s gross negligence or willful misconduct. Agent does not assume any responsibility for any failure or delay in
performance or any breach by any Obligor, Lender or other Secured Party of any obligations under the Loan Documents. Agent does not make any express or implied representation, warranty or guarantee to Secured Parties with respect to any Obligations,
Collateral, Liens, Loan Documents or Obligor. No Agent Indemnitee shall be responsible to Secured Parties for any recitals, statements, information, representations or warranties contained in any Loan Documents or Borrower Materials; the execution,
validity, genuineness, effectiveness or enforceability of any Loan Documents; the genuineness, enforceability, collectability, value, sufficiency, location or existence of any Collateral, or the validity, extent, perfection or priority of any Lien
therein; the validity, enforceability or collectability of any Obligations; or the assets, liabilities, financial condition, results of operations, business, creditworthiness or legal status of any Obligor or Account Debtor. No Agent Indemnitee
shall have any obligation to any Secured Party to ascertain or inquire into the existence of any Default or Event of Default, the observance by any Obligor of any terms of the Loan Documents, or the satisfaction of any conditions precedent contained
in any Loan Documents. 
 12.8    Successor Agent and Co-Agents.

 12.8.1    Resignation; Successor Agent. Agent may resign at any time by giving at least 30
days written notice thereof to Lenders and Borrowers. Required Lenders may appoint a successor that is (a) a Lender or Affiliate of a Lender; or (b) a financial institution reasonably acceptable to Required Lenders and (provided no
Default or Event of Default 

  
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exists) Borrowers. If no successor is appointed by the effective date of Agent’s resignation, then on such date, Agent may appoint a successor that is a financial institution (or agency
institution who ordinarily acts as an agent in syndicated credit facilities) acceptable to it in its discretion (which shall be a Lender unless no Lender accepts the role) or, in the absence of such appointment, Required Lenders shall automatically
assume all rights and duties of Agent. The successor Agent shall thereupon succeed to and become vested with all the powers and duties of the retiring Agent without further act. The retiring Agent shall be discharged from its duties hereunder on the
effective date of its resignation, but shall continue to have all rights and protections available to Agent under the Loan Documents with respect to actions, omissions, circumstances or Claims relating to or arising while it was acting or
transferring responsibilities as Agent or holding any Collateral on behalf of Secured Parties, including the indemnification set forth in Sections 12.6 and 14.2, and all rights and protections under this
Section 12. Any successor to Bank of America by merger or acquisition of stock or this loan shall continue to be Agent hereunder without further act on the part of any Secured Party or Obligor. 

12.8.2    Co-Collateral Agent. If appropriate under
Applicable Law, Agent may appoint a Person to serve as a co-collateral agent or separate collateral agent under any Loan Document; provided that so long as no Event of Default exists, such collateral agent or co-collateral agent is reasonably acceptable to Borrower Agent. Each right, remedy and protection intended to be available to Agent under the Loan Documents shall also be vested in such agent. Secured Parties shall
execute and deliver any instrument or agreement that Agent may request to effect such appointment. If any such agent shall die, dissolve, become incapable of acting, resign or be removed, then all the rights and remedies of the agent, to the extent
permitted by Applicable Law, shall vest in and be exercised by Agent until appointment of a new agent. 

12.9    Due Diligence and Non-Reliance/Singapore Qualified MoneyLender.

 12.9.1    Lender Acknowledgement. Each Lender acknowledges and agrees that it has,
independently and without reliance upon Agent or any other Lenders, and based upon such documents, information and analyses as it has deemed appropriate, made its own credit analysis of each Obligor and its own decision to enter into this Agreement
and to fund Revolver Loans and participate in LC Obligations hereunder. Each Secured Party has made such inquiries as it feels necessary concerning the Loan Documents, Collateral and Obligors. Each Secured Party acknowledges and agrees that the
other Secured Parties have made no representations or warranties concerning any Obligor, any Collateral or the legality, validity, sufficiency or enforceability of any Loan Documents or Obligations. Each Secured Party will, independently and without
reliance upon any other Secured Party, and based upon such financial statements, documents and information as it deems appropriate at the time, continue to make and rely upon its own credit decisions in making Revolver Loans and participating in LC
Obligations, and in taking or refraining from any action under any Loan Documents. Except for notices, reports and other information expressly requested by a Lender, Agent shall have no duty or responsibility to provide any Secured Party with any
notices, reports or certificates furnished to Agent by any Obligor or any credit or other information concerning the affairs, financial condition, business or Properties of any Obligor (or any of its Affiliates) which may come into possession of
Agent or its Affiliates. 

  
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 12.9.2    Moneylender Act. Each Lender represents and
warrants that its entry into, and performance of its obligations under, this Agreement do not and will not conflict with the Moneylenders Act, Chapter 188 of Singapore. 

12.10    Remittance of Payments and Collections. 

12.10.1    Remittances Generally. Payments by any Secured Party to Agent shall be made by the time
and date provided herein, in immediately available funds. If no time for payment is specified or if payment is due on demand and request for payment is made by Agent by 1:00 p.m. on a Business Day, then payment shall be made by the Secured Party by
3:00 p.m. on such day, and if request is made after 1:00 p.m., then payment shall be made by 11:00 a.m. on the next Business Day. Payment by Agent to any Secured Party shall be made by wire transfer, in the type of funds received by Agent. Any such
payment shall be subject to Agent’s right of offset for any amounts due from such payee under the Loan Documents. 

12.10.2    Failure to Pay. If any Secured Party fails to deliver when due any amount payable by it
to Agent hereunder, such amount shall bear interest, from the due date until paid in full, at the greater of the Federal Funds Rate or the rate determined by Agent as customary for interbank compensation for two Business Days and thereafter at the
Default Rate for Floating Rate Loans. In no event shall Borrowers be entitled to credit for any interest paid by a Secured Party to Agent, nor shall a Defaulting Lender be entitled to interest on amounts held by Agent pursuant to
Section 4.2. 
 12.10.3    Recovery of Payments. If Agent pays an amount
to a Secured Party in the expectation that a related payment will be received by Agent from an Obligor and such related payment is not received, then Agent may recover such amount from the Secured Party. If Agent determines that an amount received
by it must be returned or paid to an Obligor or other Person pursuant to Applicable Law or otherwise, then Agent shall not be required to distribute such amount to any Secured Party. If Agent is required to return any amounts applied by it to
Obligations held by a Secured Party, such Secured Party shall pay to Agent, on demand, its share of the amounts required to be returned. 

12.11    Individual Capacities. As a Lender, Bank of America shall have the same rights and
remedies under the Loan Documents as any other Lender, and the terms “Lenders,” “Required Lenders” or any similar term shall include Bank of America in its capacity as a Lender. Agent, Lenders and their Affiliates may accept
deposits from, lend money to, provide Bank Products to, act as financial or other advisor to, and generally engage in any kind of business with, Obligors and their Affiliates, as if they were not Agent or Lenders hereunder, without any duty to
account therefor to any Secured Party. In their individual capacities, Agent, Lenders and their Affiliates may receive information regarding Obligors, their Affiliates and their Account Debtors (including information subject to confidentiality
obligations), and shall have no obligation to provide such information to any Secured Party. 

  
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 12.12    Titles. Each Lender, other than Bank of
America, that is designated in connection with this credit facility as an “Arranger,” “Bookrunner” or “Agent” of any kind shall have no right or duty under any Loan Documents other than those applicable to all Lenders,
and shall in no event have any fiduciary duty to any Secured Party. 
 12.13    Bank Product
Providers. Each Secured Bank Product Provider, by delivery of a notice to Agent of a Bank Product, agrees to be bound by the Loan Documents, including Sections 5.6, 12, 14.3.3 and 14.16, and agrees to hold
harmless Agent Indemnitees, to the extent not reimbursed by Obligors, against all Claims that may be incurred by or asserted against any Agent Indemnitee in connection with such provider’s Secured Bank Product Obligations. 

12.14    No Third Party Beneficiaries. This Section 12 is an
agreement solely among Secured Parties and Agent, and shall survive Full Payment of the Obligations. This Section 12 does not confer any rights or benefits upon Borrowers or any other Person. As between Borrowers and Agent,
any action that Agent may take under any Loan Documents or with respect to any Obligations shall be conclusively presumed to have been authorized and directed by Secured Parties. 

SECTION 13.    BENEFIT OF AGREEMENT; ASSIGNMENTS 

13.1    Successors and Assigns. This Agreement shall be binding upon and inure to the benefit
of Borrowers, Agent, Lenders, Secured Parties, and their respective successors and assigns, except that (a) no Borrower shall have the right to assign its rights or delegate its obligations under any Loan Documents; and (b) any assignment
by a Lender must be made in compliance with Section 13.3. Agent may treat the Person which made any Revolver Loan as the owner thereof for all purposes until such Person makes an assignment in accordance with
Section 13.3. Any authorization or consent of a Lender shall be conclusive and binding on any subsequent transferee or assignee of such Lender. 

13.2    Participations. 

13.2.1    Permitted Participants; Effect. Subject to Section 13.3.3, any
Lender may sell to a financial institution other than a Disqualified Institution (“Participant”) a participating interest in the rights and obligations of such Lender under any Loan Documents. Despite any sale by a Lender of
participating interests to a Participant, such Lender’s obligations under the Loan Documents shall remain unchanged, it shall remain solely responsible to the other parties hereto for performance of such obligations, it shall remain the holder
of its Revolver Loans and Revolver Commitments for all purposes, all amounts payable by Borrowers shall be determined as if it had not sold such participating interests, and Borrowers and Agent shall continue to deal solely and directly with such
Lender in connection with the Loan Documents. Each Lender shall be solely responsible for notifying its Participants of any matters under the Loan Documents, and Agent and the other Lenders shall not have any obligation or liability to any such
Participant. Subject to Section 13.2.5, a Participant that would be a Foreign Lender if it were a Lender shall not be entitled to the benefits of Section 5.9 unless Borrowers agree otherwise in
writing. 

  
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 13.2.2    Voting Rights. Subject to
Section 14.1.1 each Lender shall retain the sole right to approve, without the consent of any Participant, any amendment, waiver or other modification of a Loan Document other than that which forgives principal, interest or fees, reduces the
stated interest rate or fees payable with respect to any Revolver Loan or Revolver Commitment in which such Participant has an interest, postpones the Commitment Termination Date or any date fixed for any regularly scheduled payment of principal,
interest or fees on such Revolver Loan or Revolver Commitment, or releases any Borrower, Guarantor or substantially all Collateral. 

13.2.3    Participant Register. Each Lender that sells a participation shall, acting as a non-fiduciary agent of Borrowers (solely for tax purposes), maintain a register in which it enters the Participant’s name, address and interest in Revolver Commitments, Revolver Loans (and stated interest) and
LC Obligations (such register, the “Participant Register”). Entries in the Participant Register shall be conclusive, absent manifest error, and such Lender shall treat each Person recorded in the register as the owner of the
participation for all purposes, notwithstanding any notice to the contrary. No Lender shall have an obligation to disclose any information in the Participant Register except to the extent necessary to establish that a Participant’s interest is
in “registered form” for U.S. federal income tax purposes. 
 13.2.4    Benefit of
Setoff. Each Participant shall have a right of set-off in respect of its participating interest to the same extent as if such interest were owing directly to a Lender, and each Lender shall also retain the
right of set-off with respect to any participating interests sold by it. By exercising any right of set-off, a Participant agrees to share with Lenders all amounts
received through its set-off, in accordance with Section 12.5 as if such Participant were a Lender. 

13.2.5    Taxes. The Borrowers agree that each Participant shall be entitled to the benefits of
Section 5.9 and 5.10 to the same extent as if it were a Lender and had acquired its interest by assignment pursuant to Section 13.3 (it being understood that the documentation required under
Section 5.10 shall be delivered to the Lender who sells the participation) to the same extent as if it were a Lender and had acquired its interest by assignment pursuant to Section 13.3; provided
that such Participant (A) agrees to be subject to the provisions of Sections 3.8, 5.9, 5.10 and 13.4 as if it were an assignee under Section 13.3 and (B) shall not be entitled to receive any greater
payment under Section 5.9, with respect to any participation, than the Lender from whom it acquired the applicable participation would have been entitled to receive, except to the extent such entitlement to receive a
greater payment results from a change in law that occurs after the Participant acquired the applicable participation. Each Lender that sells a participation agrees, at the Borrowers’ request and expense, to use reasonable efforts to cooperate
with the Borrowers to effectuate the provisions of Sections 5.9 and 5.10 with respect to any Participant. 

13.3    Assignments. 

13.3.1    Permitted Assignments. A Lender may assign to an Eligible Assignee any of its rights and
obligations under the Loan Documents, as long as (a) each assignment is of a constant, and not a varying, percentage of the transferor Lender’s rights and obligations 

  
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under the Loan Documents and, in the case of a partial assignment, is in a minimum principal amount of $15,000,000 (unless otherwise agreed by Agent in its discretion) and integral multiples of
$5,000,000 in excess of that amount; (b) except in the case of an assignment in whole of a Lender’s rights and obligations, the aggregate amount of the Revolver Commitments retained by the transferor Lender is at least $12,500,000 (unless
otherwise agreed by Agent in its discretion); and (c) the parties to each such assignment shall execute and deliver an Assignment to Agent for acceptance and recording. Nothing herein shall limit the right of a Lender to pledge or assign any
rights under the Loan Documents to secure obligations of such Lender, including a pledge or assignment to a Federal Reserve Bank; provided, that no such pledge or assignment shall release the Lender from its obligations hereunder nor
substitute the pledge or assignee for such Lender as a party hereto. 
 13.3.2    Effect; Effective
Date. Upon delivery to Agent of an assignment notice in the form of Exhibit B and payment by the applicable assignee or assignor of a processing fee of $3,500 (unless otherwise agreed by Agent in its discretion), the assignment shall
become effective as specified in the notice, if it complies with this Section 13.3. From such effective date, the Eligible Assignee shall for all purposes be a Lender under the Loan Documents, and shall have all rights and
obligations of a Lender thereunder. Upon consummation of an assignment, the transferor Lender, Agent and Borrowers shall make appropriate arrangements for issuance of replacement and/or new notes, if applicable. The transferee Lender shall comply
with Section 5.10 and deliver, upon request, an administrative questionnaire reasonably satisfactory to Agent. 

13.3.3    Certain Assignees. No assignment or participation may be made to a Borrower, Affiliate of
a Borrower, Defaulting Lender or natural person (or, for the avoidance of doubt, a Disqualified Institution). Agent shall have no obligation to determine whether any assignment is permitted under the Loan Documents. Any assignment by a Defaulting
Lender shall be effective only upon satisfaction of its outstanding obligations under the Loan Documents in a manner reasonably satisfactory to Agent, including payment by the Defaulting Lender or Eligible Assignee of an aggregate amount sufficient
upon distribution (through direct payment, purchases of participations or other methods acceptable to Agent in its discretion) to satisfy all funding and payment liabilities of the Defaulting Lender. If any assignment by a Defaulting Lender (by
operation of law or otherwise) does not comply with the foregoing, the assignee shall be deemed a Defaulting Lender for all purposes until compliance occurs. 

13.3.4    Register. Agent, acting as a non-fiduciary agent
of Borrowers (solely for tax purposes), shall maintain (a) a copy (or electronic equivalent) of each Assignment and Acceptance delivered to it, and (b) a register for recordation of the names, addresses and Revolver Commitments of, and the
Revolver Loans, interest and LC Obligations owing to, each Lender. Entries in the register shall be conclusive, absent manifest error, and Borrowers, Agent and Lenders shall treat each Person recorded in such register as a Lender for all purposes
under the Loan Documents, notwithstanding any notice to the contrary. The register shall be available for inspection by Borrowers or any Lender, from time to time upon reasonable notice. 

  
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 13.4    Replacement of Certain Lenders. If a
Lender (a) within the last 120 days failed to give its consent to any amendment, waiver or action for which consent of all Lenders was required and Required Lenders consented, (b) is a Defaulting Lender, or (c) within the last 120
days gave a notice under Section 3.5 or requested payment or compensation under Section 3.7 or 5.9 (and has not designated a different Lending Office pursuant to
Section 3.8), then Agent or Borrower Agent may, upon 10 days notice to such Lender, require it to assign its rights and obligations under the Loan Documents to Eligible Assignee(s), pursuant to appropriate Assignment(s),
within 20 days after the notice. Agent is irrevocably appointed as attorney-in-fact to execute any such Assignment if the Lender fails to execute it and such assignment
shall be deemed effective upon delivery of such notice to the subject Lender and execution of appropriate Assignment and Acceptance(s) by the Eligible Assignee(s) and any other required parties thereto other than the replaced Lender, regardless of
whether the replaced Lender executes appropriate Assignment and Acceptance(s). Such Lender shall be entitled to receive, in cash, concurrently with such assignment, all amounts owed to it under the Loan Documents through the date of assignment. 

SECTION 14.    MISCELLANEOUS 

14.1    Consents, Amendments and Waivers. 

14.1.1    Amendment. No modification of any Loan Document, including any extension or amendment of a
Loan Document or any waiver of a Default or Event of Default, shall be effective without the prior written agreement of Agent (with the consent of Required Lenders) and each Obligor party to such Loan Document; provided, that 

(a)    without the prior written consent of Agent, no modification shall alter any provision in a Loan
Document that relates to any rights, duties or discretion of Agent; 
 (b)    without the prior written
consent of Issuing Bank, no modification shall alter Section 2.3 or any other provision in a Loan Document that relates to Letters of Credit or any rights, duties or discretion of Issuing Bank; 

(c)    without the prior written consent of each affected Lender, including a Defaulting Lender, no
modification shall (i) increase the Revolver Commitment of such Lender; (ii) reduce the amount of, or waive or delay payment of, any principal, interest or fees payable to such Lender (it being understood that a waiver of any condition
precedent set forth in Section 4.1, Section 4.2 or the waiver of any Default, Event of Default, Default Interest, mandatory prepayment or mandatory reduction of the Commitments shall not constitute
a reduction or forgiveness of any such principal or interest amount); (iii) extend the Revolver Termination Date applicable to such Lender’s Obligations; or (iv) amend this clause (c); 

(d)    without the prior written consent of all Lenders (except any Defaulting Lender), no modification
shall (i) alter Section 5.6.2, 7.1 (except to add Collateral) or 14.1.1; (ii) amend the definition of “Borrowing Base” (or any defined term used in such definition) if the effect of such amendment is
to increase 

  
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borrowing availability, “Pro Rata” (or any other provision or defined term if the effect of such amendment is to alter the pro rata sharing of payments required hereunder) or
“Required Lenders”; (iii) release all or substantially all Collateral; or (iv) except in connection with a merger, disposition or similar transaction expressly permitted hereby, release any Obligor from liability for any Obligations;
and 
 (e)    without the prior written consent of a Secured Bank Product Provider, no modification shall
affect its relative payment priority under Section 5.6.2. 

14.1.2    Limitations. Subject to Section 14.1.1, the agreement of Borrowers shall not be
required for any modification of a Loan Document that deals solely with the rights and duties of Lenders, Agent and/or Issuing Bank as among themselves. Only the consent of the parties to any agreement relating to fees or a Bank Product shall be
required for modification of such agreement, and no Bank Product provider (in such capacity) shall have any right to consent to modification of any Loan Document other than its Bank Product agreement. Any waiver or consent granted by Agent or
Lenders hereunder shall be effective only if in writing and only for the matter specified. 

14.1.3    Payment for Consents. No Borrower will, directly or indirectly, pay any remuneration or
other thing of value, whether by way of additional interest, fee or otherwise, to any Lender (in its capacity as a Lender hereunder) as consideration for agreement by such Lender with any modification of any Loan Documents, unless such remuneration
or value is concurrently paid, on the same terms, on a Pro Rata basis to all Lenders providing their consent. 

14.1.4    Technical Amendments. Notwithstanding anything to the contrary contained in
Section 14.1, if Agent and Borrowers shall have jointly identified any error or defect of a technical or immaterial nature in any provision of the Loan Documents, then Agent and Borrowers shall be permitted to amend such provision, and such
amendment shall become effective without any further action or consent of any other party to any Loan Document if the same is not objected to in writing by the Required Lenders within five Business Days following receipt of notice thereof. 

14.2    Indemnity. EACH BORROWER SHALL INDEMNIFY AND HOLD HARMLESS THE INDEMNITEES AGAINST ANY
CLAIMS THAT MAY BE INCURRED BY OR ASSERTED AGAINST ANY INDEMNITEE, INCLUDING CLAIMS ASSERTED BY ANY OBLIGOR OR OTHER PERSON OR ARISING FROM THE NEGLIGENCE OF AN INDEMNITEE; PROVIDED THAT ANY SUCH INDEMNITY WITH RESPECT TO COSTS OF COUNSEL
SHALL BE LIMITED TO THE REASONABLE AND DOCUMENTED OUT-OF-POCKET-FEES, CHARGES AND DISBURSEMENTS OF ANY ONE FIRM OF COUNSEL FOR ANY INDEMNITEE AND, IF NECESSARY, ONE
LOCAL COUNSEL IN EACH APPROPRIATE JURISDICTION, IN EACH CASE FOR ALL INDEMNITEES AND IN THE CASE OF A CONFLICT BETWEEN AGENT AND ANY LENDER, ONE ADDITIONAL COUNSEL REPRESENTING LENDERS. IN NO EVENT SHALL ANY OBLIGOR HAVE ANY OBLIGATION HEREUNDER TO
INDEMNIFY OR HOLD HARMLESS AN INDEMNITEE WITH RESPECT TO A CLAIM THAT IS (A) DETERMINED IN A FINAL, 

  
 110 








 
NON-APPEALABLE JUDGMENT BY A COURT OF COMPETENT JURISDICTION TO RESULT FROM THE GROSS NEGLIGENCE, BAD FAITH OR WILLFUL MISCONDUCT OF SUCH INDEMNITEE,
(B) ARISES SOLELY FROM A DISPUTE AMONG INDEMNITEES WHICH DISPUTE IS UNRELATED TO ANY ACT OR OMISSION OF AN OBLIGOR OR (C) RESULTS FROM A CLAIM BROUGHT BY ANY OBLIGOR AGAINST AN INDEMNITEE FOR A MATERIAL BREACH OF SUCH INDEMNITEE’S
FUNDING OBLIGATIONS HEREUNDER OR UNDER ANY OTHER LOAN DOCUMENT. THIS SECTION 14.2 SHALL NOT APPLY WITH RESPECT TO TAXES OTHER THAN ANY TAXES THAT REPRESENT LOSSES, CLAIMS, DAMAGES, ETC. ARISING FROM ANY
NON-TAX CLAIM. 
 14.3    Notices and Communications. 

14.3.1    Notice Address. Subject to Section 14.3.2, all notices and other
communications by or to a party hereto shall be in writing and shall be given to any Borrower, at Borrower Agent’s address shown on the signature pages hereof, and to any other Person at its address shown on the signature pages hereof (or, in
the case of a Person who becomes a Lender after the Closing Date, at the address shown on its Assignment), or at such other address as a party may hereafter specify by notice in accordance with this Section 14.3. Each
communication shall be effective only (a) if given by mail, three Business Days after deposit in the U.S. mail, with first-class postage pre-paid, addressed to the applicable address; or (b) if given
by personal delivery, when duly delivered to the notice address with receipt acknowledged. Notwithstanding the foregoing, no notice to Agent pursuant to Section 2.1.4, 2.3, 3.1.2, 4.1.1 or 5.3.3 shall be effective
until actually received by the individual to whose attention at Agent such notice is required to be sent. Any written communication that is not sent in conformity with the foregoing provisions shall nevertheless be effective on the date actually
received by the noticed party. Any notice received by Borrower Agent shall be deemed received by all Borrowers. 

14.3.2    Communications. Electronic and telephonic communications (including e-mail, messaging and websites) may be used only for routine communications, such as delivery of the Borrower Materials, administrative matters, distribution of Loan Documents, and matters permitted under
Section 4.1.4 and such other communications as agreed by Agent and Borrowers. Agent and Lenders make no assurances as to the privacy or security of electronic or telephonic communications.
E-mail and voice mail shall not be effective notices under the Loan Documents. 

14.3.3    Platform. The Borrower Materials shall be delivered pursuant to procedures approved by
Agent, including electronic delivery (if possible) upon request by Agent to an electronic system maintained by Agent (“Platform”). Borrowers shall notify Agent of each posting of Borrower Materials on the Platform (which notice may
be communicated electronically in accordance with Section 14.3.2) and the materials shall be deemed received by Agent only upon its receipt of such notice. Borrower Materials and other information relating to this credit
facility may be made available to Secured Parties on the Platform. The Platform is provided “as is” and “as available.” Agent does not warrant the accuracy or completeness of any information on the Platform nor the adequacy or
functioning of the Platform, and expressly disclaims liability for any errors or omissions in 

  
 111 








 
Borrower Materials or any issues involving the Platform. NO WARRANTY OF ANY KIND, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF THIRD PARTY RIGHTS, OR FREEDOM FROM VIRUSES OR OTHER CODE DEFECTS, IS MADE BY AGENT WITH RESPECT TO BORROWER MATERIALS OR THE PLATFORM. No Agent Indemnitee shall have any liability to Borrowers,
Secured Parties or any other Person for losses, claims, damages, liabilities or expenses of any kind (whether in tort, contract or otherwise) relating to use by any Person of the Platform, including any unintended recipient, nor for delivery of
Borrower Materials and other information via the Platform, internet, e-mail, or any other electronic platform or messaging system. 

14.3.4    Public Information. Obligors and Secured Parties acknowledge that “public”
information may not be segregated from material non-public information on the Platform. Secured Parties acknowledge that Borrower Materials may include Obligors’ material
non-public information, and should not be made available to personnel who do not wish to receive such information or may be engaged in investment or other market-related activities with respect to an
Obligor’s securities. 
 14.3.5    Non-Conforming
Communications. Agent and Lenders may rely upon any communications purportedly given by or on behalf of any Borrower even if they were not made in a manner specified herein, were incomplete or were not confirmed, or if the terms thereof, as
understood by the recipient, varied from a later confirmation. Each Borrower shall indemnify and hold harmless each Indemnitee from any liabilities, losses, costs and expenses arising from any electronic or telephonic communication purportedly given
by or on behalf of a Borrower. 
 14.4    Performance of Borrowers’
Obligations. To the extent any Borrower has failed to do so as required in the applicable Loan Document, Agent may, in its discretion at any time and from time to time (with, unless an Event of Default is continuing, reasonable prior
notice to Borrower Agent), at Borrowers’ expense, pay any amount or do any act required of a Borrower under any Loan Documents or otherwise lawfully requested by Agent to (a) enforce any Loan Documents or collect any Obligations;
(b) protect, insure, maintain or realize upon any Collateral; or (c) defend or maintain the validity or priority of Agent’s Liens in any Collateral, including any payment of a judgment, insurance premium, warehouse charge, finishing
or processing charge, or landlord claim, or any discharge of a Lien. All reasonable and documented out-of-pocket payments, costs and expenses (including Extraordinary
Expenses) of Agent under this Section shall be reimbursed to Agent by Borrowers promptly following demand therefor, with interest from the date incurred until paid in full, at the Default Rate applicable to Floating Rate Loans. Any payment made or
action taken by Agent under this Section shall be without prejudice to any right to assert an Event of Default or to exercise any other rights or remedies under the Loan Documents. 

14.5    Credit Inquiries. Agent and Lenders may (but shall have no obligation to) respond to
usual and customary credit inquiries from third parties concerning any Obligor or Subsidiary. 

  
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 14.6    Severability. Wherever possible, each
provision of the Loan Documents shall be interpreted in such manner as to be valid under Applicable Law. If any provision is found to be invalid under Applicable Law, it shall be ineffective only to the extent of such invalidity and the remaining
provisions of the Loan Documents shall remain in full force and effect. 
 14.7    Cumulative Effect;
Conflict of Terms. The provisions of the Loan Documents are cumulative. The parties acknowledge that the Loan Documents may use several limitations or measurements to regulate similar matters, and they agree that these are cumulative
and that each must be performed as provided. Except as otherwise provided in another Loan Document (by specific reference to the applicable provision of this Agreement), if any provision contained herein is in direct conflict with any provision in
another Loan Document, the provision herein shall govern and control. 
 14.8    Counterparts;
Execution. Any Loan Document may be executed in counterparts, each of which shall constitute an original, but all of which when taken together shall constitute a single contract. This Agreement shall become effective when Agent has
received counterparts bearing the signatures of all parties hereto. Delivery of a signature page of any Loan Document by telecopy or other electronic means shall be effective as delivery of a manually executed counterpart of such agreement. Any
signature, contract formation or record-keeping through electronic means shall have the same legal validity and enforceability as a manually executed signature or use of a paper-based recordkeeping system to the fullest extent permitted by
Applicable Law, including the Federal Electronic Signatures in Global and National Commerce Act, the New York State Electronic Signatures and Records Act, or any similar state law based on the Uniform Electronic Transactions Act. Upon request by
Agent, any electronic signature or delivery shall be promptly followed by a manually executed or paper document. 

14.9    Entire Agreement. Time is of the essence with respect to all Loan Documents and
Obligations. The Loan Documents constitute the entire agreement, and supersede all prior understandings and agreements, among the parties relating to the subject matter thereof. 

14.10    Relationship with Lenders. The obligations of each Lender hereunder are several, and
no Lender shall be responsible for the obligations or Revolver Commitments of any other Lender. Amounts payable hereunder to each Lender shall be a separate and independent debt. It shall not be necessary for Agent or any other Lender to be joined
as an additional party in any proceeding for such purposes. Nothing in this Agreement and no action of Agent, Lenders or any other Secured Party pursuant to the Loan Documents or otherwise shall be deemed to constitute Agent and any Secured Party to
be a partnership, joint venture or similar arrangement, nor to constitute control of any Obligor. 

14.11    No Advisory or Fiduciary Responsibility. In connection with all aspects of each
transaction contemplated by any Loan Document, Borrowers acknowledge and agree that (a)(i) this credit facility and any arranging or other services by Agent, any Lender, any of their Affiliates or any arranger are
arm’s-length commercial transactions between Borrowers and their Affiliates, on one hand, and Agent, any Lender, any of their Affiliates or any arranger, on the other hand; (ii) Borrowers have
consulted their own legal, accounting, regulatory and tax advisors to the extent they have deemed appropriate; and (iii) Borrowers are capable of evaluating, and understand and accept, the terms, risks and conditions of the transactions
contemplated by the Loan Documents; 

  
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(b) each of Agent, Lenders, their Affiliates and any arranger is and has been acting solely as a principal and, except as expressly agreed in writing by the relevant parties, has not been, is
not, and will not be acting as an advisor, agent or fiduciary for Borrowers, their Affiliates or any other Person, and has no obligation with respect to the transactions contemplated by the Loan Documents except as expressly set forth therein; and
(c) Agent, Lenders, their Affiliates and any arranger may be engaged in a broad range of transactions that involve interests that differ from those of Borrowers and their Affiliates, and have no obligation to disclose any of such interests to
Borrowers or their Affiliates. To the fullest extent permitted by Applicable Law, each Borrower hereby waives and releases any claims that it may have against Agent, Lenders, their Affiliates and any arranger with respect to any breach of agency or
fiduciary duty in connection with any transaction contemplated by a Loan Document. 

14.12    Confidentiality/Personal Data Protection Act. 

14.12.1    Confidentiality. Each of Agent, Lenders, Issuing Bank and other Secured Parties shall
maintain the confidentiality of all Information (as defined below), except that each of such Agent, Lender, Issuing Bank or other Secured Party and its respective officers (as defined in the Banking Act, Chapter 19 of Singapore) may disclose
Information (a) to its Affiliates, and to its and their partners, directors, officers, employees, agents, auditors, advisors and representatives (provided they are informed of the confidential nature of the Information and instructed to keep it
confidential); (b) to the extent requested by any governmental, regulatory or self-regulatory authority purporting to have jurisdiction over it or its Affiliates, in which case the Person thereby requested shall use commercially reasonable efforts
to inform Borrower as soon as reasonably practicable following such request, provided, in any such case, that any delay or failure to provide any such notice shall not result in any liability of such Person or impair any rights or obligations of any
Person under the Loan Documents; (c) to the extent required by Applicable Law or by any subpoena or other legal process, in which case the Person thereby requested shall use commercially reasonable efforts to inform Borrower as soon as
reasonably practicable following such request, provided, in any such case, that any delay or failure to provide any such notice shall not result in any liability of such Person or impair any rights or obligations of any Person under the Loan
Documents; (d) to any other party hereto; (e) in connection with any action or proceeding relating to any Loan Documents or Obligations; (f) subject to an agreement containing provisions substantially the same as this Section, to any
Transferee or any actual or prospective party (or its advisors) to any Bank Product or to any swap, derivative or other transaction under which payments are to be made by reference to an Obligor or Obligor’s obligations (in each case, other
than a Disqualified Institution); (g) to the extent such Information (i) becomes publicly available other than as a result of a breach of this Section or (ii) is available to Agent, any Lender, Issuing Bank or any of their Affiliates on a non-confidential basis from a source other than Borrowers; (h) on a confidential basis to a provider of a Platform; or (i) with the consent of Borrower Agent. Notwithstanding the foregoing, Agent and
Lenders may publish or disseminate general information concerning this credit facility for league table, tombstone and advertising purposes, and may use Borrowers’ logos, trademarks or product photographs in advertising materials. As used
herein, “Information” means information received from an Obligor or Subsidiary relating to it or its business. A Person required to maintain the confidentiality of Information pursuant to this Section shall be deemed to have
complied if 

  
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it exercises a degree of care similar to that accorded its own confidential information. Each of Agent, Lenders and Issuing Bank acknowledges that (i) Information may include material non-public information; (ii) it has developed compliance procedures regarding the use of such information; and (iii) it will handle the material non-public
information in accordance with Applicable Law. Nothing in this Clause is to be construed as constituting an agreement between the Obligors and the Lenders and Agent for a higher degree of confidentiality than that prescribed in Section 47 of,
and in the Third Schedule to, the Banking Act, Chapter 19 of Singapore. 
 14.12.2    Personal Data
Protection Act. If any Obligor provides a Lender or Agent with personal data of any individual as required by, pursuant to, or in connection with the Loan Documents, that Obligor represents and warrants to the Lenders that it has, to the extent
required by law, (i) notified the relevant individual of the purposes for which data will be collected, processed, used or disclosed; and (ii) obtained such individual’s consent for, and hereby consents on behalf of such individual
to, the collection, processing, use and disclosure of his/her personal data by the Lenders, in each case, in accordance with or for the purposes of the Loan Documents, and confirms that it is authorised by such individual to provide such consent on
his/her behalf. Each Obligor agrees and undertakes to notify the Lenders promptly upon its becoming aware of the withdrawal by the relevant individual of his/her consent to the collection, processing, use and/or disclosure by the Lenders of any
personal data provided by that Obligor to the Lender. Any consent given pursuant to this Agreement in relation to personal data shall, subject to all applicable laws and regulations, survive death, incapacity, bankruptcy or insolvency of any such
individual and the termination or expiration of this Agreement. 
 14.13    Certifications Regarding
Indebtedness Agreements. Parent and Borrowers certify to Agent and the Lenders that neither the execution or performance of the Loan Documents nor the incurrence of any Obligations by the Obligors (including, in the case of any increase in the
aggregate Revolver Commitments pursuant to Section 2.1.7, the Loan Documents and the Obligations after giving effect to any such increase) violates the Senior Notes Indentures or any agreement, document, or instrument
related thereto, respectively. Parent and Borrowers further certify that the Revolver Commitments and the Obligations constitute (including, in the case of any increase in the aggregate Revolver Commitments pursuant to
Section 2.1.7, the Obligations after giving effect to any such increase as of the applicable Increase Effective Date) “Permitted Bank Debt” under the Senior Notes Indentures. 

14.14    GOVERNING LAW. UNLESS EXPRESSLY PROVIDED IN ANY LOAN DOCUMENT, THIS AGREEMENT, THE OTHER LOAN DOCUMENTS
AND ALL CLAIMS SHALL BE GOVERNED BY THE LAWS OF THE STATE OF NEW YORK, WITHOUT GIVING EFFECT TO ANY CONFLICT OF LAW PRINCIPLES EXCEPT FEDERAL LAWS RELATING TO NATIONAL BANKS. 

14.15    Consent to Forum; Bail-In of EEA Financial Institutions.

 14.15.1    Forum. EACH PARTY HERETO HEREBY CONSENTS TO THE EXCLUSIVE JURISDICTION OF ANY
STATE COURT SITTING IN BOROUGH OF MANHATTAN OR THE UNITED STATES DISTRICT COURT OF THE SOUTHERN 

  
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DISTRICT OF NEW YORK, IN ANY DISPUTE, ACTION, LITIGATION OR OTHER PROCEEDING RELATING IN ANY WAY TO ANY LOAN DOCUMENTS, AND AGREES THAT ANY DISPUTE, ACTION, LITIGATION OR OTHER PROCEEDING SHALL
BE BROUGHT BY IT SOLELY IN ANY SUCH COURT. EACH BORROWER IRREVOCABLY AND UNCONDITIONALLY WAIVES ALL CLAIMS, OBJECTIONS AND DEFENSES THAT IT MAY HAVE REGARDING ANY SUCH COURT’S PERSONAL OR SUBJECT MATTER JURISDICTION, VENUE OR INCONVENIENT
FORUM. EACH PARTY HERETO IRREVOCABLY AND UNCONDITIONALLY SUBMITS TO THE JURISDICTION OF SUCH COURTS AND CONSENTS TO SERVICE OF PROCESS IN THE MANNER PROVIDED FOR NOTICES IN 

SECTION 14.3.1. Without prejudice to any other mode of service allowed under any relevant law, Amkor Singapore
irrevocably appoints Corporation Services Company as its agent for service of process in relation to any proceeding before such court in connection with any Loan Document and agrees that failure by a process agent to notify it of the process will
not invalidate the proceedings concerned. A final judgment in any proceeding of any such court shall be conclusive and may be enforced in other jurisdictions by suit on the judgment or any other manner provided by Applicable Law. 

14.15.2    Other Jurisdictions. Nothing herein shall limit the right of Agent or any Lender to bring
proceedings against any Obligor in any other court, nor limit the right of any party to serve process in any other manner permitted by Applicable Law, including bringing proceedings in Singapore against Borrower to enforce its Obligations. Nothing
in this Agreement shall be deemed to preclude enforcement by any party hereto of any judgment or order obtained in any forum or jurisdiction 

14.15.3    Acknowledgement and Consent to Bail-In of EEA
Financial Institutions. Notwithstanding anything to the contrary in any Loan Document or in any other agreement, arrangement or understanding among the parties, each party hereto (including each Secured Party) acknowledges that, with respect to
any Secured Party that is an EEA Financial Institution, any unsecured liability of such Secured Party arising under a Loan Document may be subject to the write-down and conversion powers of an EEA Resolution Authority, and each party hereto agrees
and consents to, and acknowledges and agrees to be bound by, (a) the application of any Write-Down and Conversion Powers by an EEA Resolution Authority to any such liability which may be payable to it by such Secured Party; and (b) the
effects of any Bail-in Action on any such liability, including (i) a reduction in full or in part or cancellation of any such liability; (ii) a conversion of all, or a portion of, such liability into
shares or other instruments of ownership in such EEA Financial Institution, its parent, or a bridge institution that may be issued to the party or otherwise conferred on it, and that such shares or other instruments of ownership will be accepted by
it in lieu of any rights with respect to any such liability under any Loan Document; or (iii) the variation of the terms of such liability in connection with the exercise of any Write-Down and Conversion Powers. 

14.16    Waivers by Borrowers. To the fullest extent permitted by Applicable Law, each Borrower waives
(a) the right to trial by jury (which Agent, Issuing Bank, Lenders and all other Secured Parties hereby also waive) in any proceeding or dispute of any kind relating in any way to any Loan Documents, Obligations or Collateral;
(b) presentment, demand, 

  
 116 








 
protest, notice of presentment, default, non-payment, maturity, release, compromise, settlement, extension or renewal of any commercial paper, accounts,
documents, instruments, chattel paper and guaranties at any time held by Agent on which a Borrower may in any way be liable, and hereby ratifies anything Agent may do in this regard; (c) notice prior to taking possession or control of any
Collateral; (d) any bond or security that might be required by a court prior to allowing Agent to exercise any rights or remedies; (e) the benefit of all valuation, appraisement and exemption laws; (f) any claim against an Indemnitee,
on any theory of liability, for special, indirect, consequential, exemplary or punitive damages (as opposed to direct or actual damages) in any way relating to any Enforcement Action, Obligations, Loan Documents or transactions relating thereto (and
each Secured Party hereby waives any claim against any Obligor on any theory of liability for special, indirect, consequential, exemplary or punitive damages (as opposed to direct or actual damages)); and (g) notice of acceptance hereof. Each
Borrower acknowledges that the foregoing waivers are a material inducement to Agent, Issuing Bank and Lenders entering into this Agreement and that they are relying upon the foregoing in their dealings with Borrowers. Each Borrower has reviewed the
foregoing waivers with its legal counsel and has knowingly and voluntarily waived its jury trial and other rights following consultation with legal counsel. In the event of litigation, this Agreement may be filed as a written consent to a trial by
the court. 
 14.17    Patriot Act Notice. Agent and Lenders hereby notify Borrowers that
pursuant to the Patriot Act, Agent and Lenders are required to obtain, verify and record information that identifies each Borrower, including its legal name, address, tax ID number and other information that will allow Agent and Lenders to identify
it in accordance with the Patriot Act. Agent and Lenders will also require information regarding any personal guarantor and may require information regarding Borrowers’ management and owners, such as legal name, address, social security number
and date of birth. Borrowers shall, promptly upon request, provide all documentation and other information as Agent, Issuing Bank or any Lender may reasonably request from time to time in order to comply with any obligations under any “know
your customer,” anti-money laundering or other requirements of Applicable Law. 
 14.18    NO ORAL
AGREEMENT. THIS AGREEMENT AND THE OTHER LOAN DOCUMENTS REPRESENT THE FINAL AGREEMENT BETWEEN THE PARTIES AND MAY NOT BE CONTRADICTED BY EVIDENCE OF PRIOR, CONTEMPORANEOUS OR SUBSEQUENT ORAL AGREEMENTS BETWEEN THE PARTIES. THERE ARE NO UNWRITTEN
AGREEMENTS BETWEEN THE PARTIES. 
 [Remainder of page intentionally left blank; signatures begin on following page] 

  
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 IN WITNESS WHEREOF, this Agreement has been executed and delivered as of the date set
forth above. 
  

			
	BORROWERS:
	
	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
		
	By:	 	
                     
                                        


	Name:	 	
	Title:	 	
	
	 Address for notices to all Borrowers:

c/o Amkor Technology, Inc.
 2045 E. Innovation
Circle

	 Tempe, Arizona 85284
 Attention:
Treasurer




  
 118 








 
			
	AGENT AND LENDERS:
	
	 BANK OF AMERICA, N.A.,
 as
Agent and Lender

		
	By:	 	
                     
                                        


	Title:	 	
                     
                                        


	
	Address:
		 	333 South Hope Street
		 	19th Floor
		 	Los Angeles, California 90071
		 	Attn: Amkor Asset Based Specialist
	
	                                    
                                         
         ,
	as a Lender
		
	By:	 	
                     
                                        


	Title:	 	  

	
	Address:
		
		 	
                     
                                       

		 	
                     
                                       

		 	
                     
                                       

		 	Attn:                                     
                                
		 	Telecopy:                                    
                         
	
	                                    
                                         
         ,
	as a Lender
		
	By:	 	  

	Title:	 	  

	
	Address:
		
		 	  

		 	  

		 	  

		 	Attn:                                     
                                
		 	Telecopy:                                    
                         



  
 119 








 EXHIBIT A 

to 
 Loan and Security Agreement

 ASSIGNMENT AND ACCEPTANCE 

Reference is made to the Loan and Security Agreement dated as of             ,
20    , as amended (“Loan Agreement”), among [BORROWER 1], [BORROWER 2] and [BORROWER 3] (collectively, “Borrowers”), BANK OF AMERICA,
N.A., as agent (“Agent”) for the financial institutions from time to time party to the Loan Agreement (“Lenders”), and such Lenders. Terms are used herein as defined in the Loan Agreement. 

                       
                  (“Assignor”) and
                                        
                     (“Assignee”) agree as follows: 

1.    Assignor hereby assigns to Assignee and Assignee hereby purchases and assumes from Assignor (a) a principal
amount of $         of Assignor’s outstanding Revolver Loans and $         of Assignor’s participations in LC Obligations, and (b) the amount of
$         of Assignor’s Revolver Commitment (which represents     % of the total Revolver Commitments) (the foregoing items being, collectively, “Assigned Interest”),
together with an interest in the Loan Documents corresponding to the Assigned Interest. This Agreement shall be effective as of the date (“Effective Date”) indicated in the corresponding Assignment Notice delivered to Agent,
provided such Assignment Notice is executed by Assignor, Assignee, Agent and Borrower Agent, if applicable. From and after the Effective Date, Assignee hereby expressly assumes, and undertakes to perform, all of Assignor’s obligations in
respect of the Assigned Interest, and all principal, interest, fees and other amounts which would otherwise be payable to or for Assignor’s account in respect of the Assigned Interest shall be payable to or for Assignee’s account, to the
extent such amounts accrue on or after the Effective Date. 
 2.    Assignor (a) represents that as of the date
hereof, prior to giving effect to this assignment, its Revolver Commitment is $        , and the outstanding balance of its Revolver Loans and participations in LC Obligations is; (b) makes no
representation or warranty and assumes no responsibility with respect to any statements, warranties or representations made in or in connection with the Loan Agreement or the execution, legality, validity, enforceability, genuineness, sufficiency or
value of the Loan Agreement or any other instrument or document furnished pursuant thereto, other than that Assignor is the legal and beneficial owner of the interest being assigned by it hereunder and that such interest is free and clear of any
adverse claim; and (c) makes no representation or warranty and assumes no responsibility with respect to the financial condition of Borrowers or the performance by Borrowers of their obligations under the Loan Documents. [Assignor is
attaching the promissory note[s] held by it and requests that Agent exchange such note[s] for new promissory notes payable to Assignee [and Assignor].] 

3.    Assignee (a) represents and warrants that it is legally authorized to enter into this Assignment;
(b) confirms that it has received copies of the Loan Agreement and such other Loan Documents and information as it has deemed appropriate to make its own credit analysis and decision to enter into this Assignment; (c) agrees that it shall,
independently and without reliance 







 
upon Assignor and based on such documents and information as it shall deem appropriate at the time, continue to make its own credit decisions in taking or not taking action under the Loan
Documents; (d) confirms that it is an Eligible Assignee; (e) appoints and authorizes Agent to take such action as agent on its behalf and to exercise such powers under the Loan Agreement as are delegated to Agent by the terms thereof,
together with such powers as are incidental thereto; (f) agrees that it will observe and perform all obligations that are required to be performed by it as a “Lender” under the Loan Documents; and (g) represents and warrants that
the assignment evidenced hereby will not result in a non-exempt “prohibited transaction” under Section 406 of ERISA. 

4.    This Agreement shall be governed by the laws of the State of
                    .If any provision is found to be invalid under Applicable Law, it shall be ineffective only to the extent of such invalidity and
the remaining provisions of this Agreement shall remain in full force and effect. 
 5.    Each notice or other
communication hereunder shall be in writing, shall be sent by messenger, by telecopy or facsimile transmission, or by first-class mail, shall be deemed given when sent and shall be sent as follows: 

 

	 	(a)	If to Assignee, to the following address (or to such other address as Assignee may designate from time to time): 

  

                       
                                      

                       
                                      

                       
                                      

 

	 	(b)	If to Assignor, to the following address (or to such other address as Assignor may designate from time to time): 

  

                       
                                      

                       
                                      

                       
                                      

                       
                                      

Payments hereunder shall be made by wire transfer of immediately available funds in the applicable Available Currency as follows: 

If to Assignee, to the following account (or to such other account as Assignee may designate from time to time): 

 

                       
                                      

                       
                                      

ABA
No.                                        
      

                       
                                       

Account
No.                                        
 

Reference:                     
                       







 If to Assignor, to the following account (or to such other account as Assignor may designate from
time to time): 
  

                       
                                      

                       
                                      

ABA
No.                                        
      
 Account
No.                                        
 

Reference:                     
                        

IN WITNESS WHEREOF, this Assignment and Acceptance is executed as of
                    . 
  

			
	  

	(“Assignee”)
		
	By	 	
                     
                    

		 	Title:
	
	  

	(“Assignor”)
		
	By	 	
                     
                    

		 	Title:









 EXHIBIT B 

to 
 Loan and Security Agreement

 ASSIGNMENT NOTICE 

Reference is made to (1) the Loan and Security Agreement dated as of
            , 20    , as amended (“Loan Agreement”), among [BORROWER 1], [BORROWER 2] and [BORROWER 3]
(collectively, “Borrowers”), BANK OF AMERICA, N.A., as agent (“Agent”) for the financial institutions from time to time party to the Loan Agreement (“Lenders”), and such Lenders; and
(2) the Assignment and Acceptance dated as of             , 20     (“Assignment”), between
                     (“Assignor”) and
                     (“Assignee”). Terms are used herein as defined in the Loan Agreement. 

Assignor hereby notifies Borrowers and Agent of Assignor’s intent to assign to Assignee pursuant to the Assignment (a) a principal
amount of $         of Assignor’s outstanding Revolver Loans and $         of Assignor’s participations in LC Obligations, and (b) the amount of
$         of Assignor’s Revolver Commitment (which represents     % of the total Revolver Commitments)(the foregoing items being, collectively, the “Assigned
Interest”), together with an interest in the Loan Documents corresponding to the Assigned Interest. This Agreement shall be effective as of the date (“Effective Date”) indicated below, provided this Assignment Notice is
executed by Assignor, Assignee, Agent and Borrower Agent, if applicable. Pursuant to the Assignment, Assignee has expressly assumed all of Assignor’s obligations under the Loan Agreement to the extent of the Assigned Interest, as of the
Effective Date. 
 For purposes of the Loan Agreement, Agent shall deem Assignor’s Revolver Commitment to be reduced by
$        , and Assignee’s Revolver Commitment to be increased by $        . 

The address of Assignee to which notices and information are to be sent under the terms of the Loan Agreement is: 

 
  

 
  

 
  

 
  

The address of Assignee to which payments are to be sent under the terms of the Loan Agreement is shown in the Assignment. 

This Notice is being delivered to Borrowers and Agent pursuant to Section 13.3 of the Loan Agreement. Please
acknowledge your acceptance of this Notice by executing and returning to Assignee and Assignor a copy of this Notice. 







 IN WITNESS WHEREOF, this Assignment Notice is executed as of
                    . 
  

			
	  

	(“Assignee”)
		
	By	 	
                     
                            

		 	Title:
	  

	(“Assignor”)
		
	By	 	
                     
                            

		 	Title:


  

			
	ACKNOWLEDGED AND AGREED,
	AS OF THE DATE SET FORTH ABOVE:
	
	BORROWER AGENT:*
	
	  

		
	By	 	
                     
                    

		 	Title:

  

	*	No signature required if Assignee is a Lender, Affiliate of a Lender or Approved Fund, or if an Event of Default exists. 

  

			
	BANK OF AMERICA, N.A., as Agent
		
	By	 	
                     
                    

		 	Title:








 EXHIBIT C 

to 
 Loan and Security Agreement

 [FORM OF] COMPLIANCE CERTIFICATE 

Financial Statement Date: [            ,
        ]. 
 Each of the undersigned, duly appointed and acting Chief Financial Officer of
Amkor Technology, Inc., a Delaware corporation (the “Parent”) and a Senior Officer of Amkor Technology Singapore Holding Pte. Ltd. a company incorporated under the laws of Singapore (“Amkor Singapore”), each being
duly authorized, hereby delivers this Compliance Certificate to the Agent, pursuant to Section 10.1.2(c) of that certain Loan and Security Agreement, dated as of July 13, 2018 (as such Loan and Security Agreement may
be amended, restated, supplemented or otherwise modified from time to time, the “Loan and Security Agreement”), among Amkor Singapore and other entities joined thereto as borrowers (together with Amkor Singapore, each a
“Borrower” and collectively, the “Borrowers”), the financial institutions (which are qualified licensed money lenders under the laws of Singapore) party thereto from time to time as lenders (the
“Lenders”) and Bank of America, N.A., a national banking association (“Bank of America”), as agent for the Lenders (in such capacity, “Agent”). Terms defined in the Loan and Security Agreement,
wherever used herein, shall have the same meanings as are prescribed by the Loan and Security Agreement. 
 1.    The
Parent hereby delivers to the Agent [check as applicable]: 
  

	 	☐	the Fiscal Year end financial statements on both a consolidated basis for Parent and its Subsidiaries and on a consolidating basis for the Borrowers with respect to balance sheets and statement of income, and the
certificates of such accountants required by Section 10.1.2(a) each dated as of             ,         , together with
comparative form corresponding figures for the preceding Fiscal Year; or 

  

	 	☐	the unaudited Fiscal Quarter end financial statements, on a consolidated basis for Parent and its Subsidiaries and consolidating basis for the Borrowers with respect to balance sheets and statement of income for Parent
and its Subsidiaries and statements of cash flow as of the end of such Fiscal Quarter on a consolidated basis for Parent and its Subsidiaries, setting forth in comparative form corresponding figures for the preceding Fiscal Year and certified by the
principal financial officer of the Parent, required by Section 10.1.2(b), dated as of             ,         .


 Such financial statements fairly present the financial position and results of operations of Parent and its Subsidiaries for such Fiscal
Quarter [, subject only to changes from audit and year-end adjustments] and have been prepared in accordance with GAAP (as applicable) applied consistently throughout the periods reflected therein. 

2.    Each of the undersigned hereby states that, to the best of his or her knowledge and based upon an examination
sufficient to enable an informed statement [check as applicable]: 
  

	 	☐	No Default or Event of Default exists as of the date hereof or existed during the period covered by the financial statements referenced in paragraph 1 of this Compliance Certificate. 


 

	 	☐	 One or more Defaults or Events of Default exist as of the date hereof or existed during the period covered by the
financial statements referenced in paragraph 1 of this Compliance 










	 	
Certificate. Included within Exhibit A attached hereto is a written description specifying each such Default or Event of Default, its nature, when it occurred, whether it is continuing as
of the date hereof and the steps being taken by the Borrowers with respect thereto. Except as so specified, no Default or Event of Default exists as of the date hereof. 


5.    The Fixed Charge Coverage Ratio for the Fiscal Quarter ended
[            ,        ] is [        ] to 1.00. The calculations and information set forth on Exhibit B
attached hereto are true and accurate on and as of the date of this Compliance Certificate.1 
 [Signature Page Follows] 

 
  

	1	To be calculated irrespective of the existence or non-existence of a Triggered Activation Period. 








 
					
	AMKOR TECHNOLOGY, INC., in its capacity as the Parent
		
	By:	 	
                     


		 	Name:	 	
                     


		 	Title:	 	
                     


	
	AMKOR SINGAPORE PTE. LTD., in its capacity as the Borrower Agent
		
	By:	 	
                     


		 	Name:	 	
                     


		 	Title:	 	
                     





  
 COMPLIANCE CERTIFICATE

 (AMKOR) 
 Signature Page 








 EXHIBIT A 

to 
 COMPLIANCE CERTIFICATE 

dated 

            , 20     

The following is attached to and made a part of the above referenced Compliance Certificate. 

[specify Defaults or Events of Default] 







 EXHIBIT B 

to 
 COMPLIANCE CERTIFICATE 

dated 

            , 20     (the “Statement Date”)

 [See attached] 







 EXHIBIT D 

to 
 Loan and Security Agreement

 [FORM OF] NOTICE OF BORROWING 
 Date:
            , 20     
  

	To:	Bank of America, N.A., a national banking association, as agent for the Lenders under that certain Loan and Security Agreement, dated as of July     , 2018 (as amended, restated, amended and
restated, supplemented, or otherwise modified from time to time, the “Loan and Security Agreement”), among AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. a company incorporated under the laws of Singapore (“Amkor
Singapore”) and other entities joined thereto as borrowers (together with Amkor Singapore, each a “Borrower” and collectively, the “Borrowers”), the financial institutions (which are qualified licensed
money lenders under the laws of Singapore) party thereto from time to time as Lenders and Bank of America, N.A., as the Agent for the Lenders. 


Ladies and Gentlemen: 
 Reference is made to the
above described Loan and Security Agreement. Terms defined in the Loan and Security Agreement, wherever used herein unless otherwise defined herein, shall have the same meanings herein as are prescribed by the Loan and Security Agreement. The
undersigned Borrower Agent hereby irrevocably notifies you of the Borrowing specified below: 
  

	 	1.	The Business Day of the proposed Borrowing is             ,         . 


 

	 	2.	The aggregate amount of the proposed Borrowing is $        . 

  

	 	3.	The Borrowing is to be comprised of a [Base Rate Revolver Loan] [Singapore Base Rate Revolver Loan] [LIBOR Revolver Loan] [SIBOR Revolver Loan] in the amount of $        .


  

	 	4.	[The duration of the Interest Period for the [LIBOR Revolver Loan] [SIBOR Revolver Loan], if any, included in the Borrowing shall be          months.]2 


The undersigned hereby certifies that the following statements are true on the date hereof, and will be true on the date of the proposed
Borrowing, before and after giving effect thereto and to the application of the proceeds therefrom: 
  

	 	(a)	No Default or Event of Default exists or will result from the proposed Borrowing requested herein; 

  

	 	(b)	The representations and warranties of the Borrowers contained in the Loan Documents are true and correct in all material respects; provided that such materiality qualifier shall not apply to those representations and
warranties which are qualified by materiality (except for representations and warranties that expressly relate to an earlier date); and 

  

 

	2	In the event the Borrowing is an Interest Period Loan, please specify the applicable Interest Period (which shall be deemed to be one month if not specified). 









	 	(c)	The proposed Borrowing will not cause the aggregate principal amount of all outstanding Revolver Loans to exceed the Borrowing Base. 


This Notice of Borrowing is issued pursuant to and is subject to the Loan and Security Agreement. 

[Signature Page Follows] 







 
			
	BORROWER AGENT:
	
	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
		
	By:	 	
                     
                        

		 	Name:                                     
                                 
		 	Title:                                    
                                    









 SCHEDULE 1.1 

to 
 Loan and Security Agreement

 REVOLVER COMMITMENTS OF LENDERS 
  

					
	 Name of Lender
	  	Revolver Commitment	 
	 Bank of America, N.A.
	  	$	125,000,000.00	 
	 DBS Bank Ltd.
	  	$	75,000,000.00	 
	 JPMorgan Chase Bank, N.A., Singapore Branch
	  	$	50,000,000.00	 
		  	  
	  
	 
	 Total:
	  	$	250,000,000.00	 
		  	  
	  
	 








 SCHEDULE 8.5 

to 
 Loan and Security Agreement

 DEPOSIT ACCOUNTS  

 

					
	 Name of Obligor
	  	 Depository Bank
	  	Type of
Account
	Amkor Technology Singapore Holding Pte. Ltd.	  	Bank of America, Singapore Branch	  	Current
	Amkor Technology Singapore Holding Pte. Ltd.	  	Bank of America, Singapore Branch	  	Current
	Amkor Technology Singapore Holding Pte. Ltd.	  	Bank of America, Singapore Branch	  	Current
	Amkor Technology Singapore Holding Pte. Ltd.	  	Citibank N.A. Singapore Branch	  	Current
	Amkor Technology Singapore Holding Pte. Ltd.	  	Citibank N.A. Singapore Branch	  	Current
	Amkor Technology Singapore Holding Pte. Ltd.	  	Citibank N.A. Singapore Branch	  	Current
	Amkor Technology Singapore Holding Pte. Ltd.	  	Citibank, NA	  	Current
	Amkor Technology, Inc.	  	Citibank, NA	  	Current
	Amkor Technology, Inc.	  	Citibank, NA	  	Current
	Amkor Technology, Inc.	  	Bank of America	  	Current
	Amkor Technology, Inc.	  	JP Morgan Chase	  	Current








 SCHEDULE 8.6.1 

to 
 Loan and Security Agreement

 LOCATION OF COLLATERAL  

 

	1.	Chief Executive Office of each Obligor: 

  

			
	 Obligor
	  	 Chief Executive Office

	Amkor Technology Singapore Holding Pte. Ltd.	  	 Valley Point Office Tower
 491B River Valley
Road, #15-02/04,
 248373, Singapore

		
	Amkor Technology, Inc.	  	 2045 E. Innovation Circle
 Tempe, Arizona
85284


  

	2.	Other Locations of Amkor Technology, Inc.:  

  

	 	a.	25 Metro Drive, Suite 700, San Jose, CA 95110 

  

	 	b.	3 Corporate Park, Suite 230, Irvine, CA 92612 

  

	 	c.	105 Central Street, suite 4300, Boston, MA 02180 

  

	 	d.	3021 Cornwallis Road, Research Triangle Park (RTP), NC 27409 

  

	 	e.	5465 Morehouse Drive, Suite 210, San Diego, CA 92121 

  

	 	f.	1101 Central Expressway South, Suite 215, Allen, TX 75013 

  

	 	g.	8140 N. Mopac, Suite 150, Austin, TX 78759 








 SCHEDULE 9.1.4 

to 
 Loan and Security Agreement

 CAPITAL STRUCTURE  

 

									
	 Name
	  	 Jurisdiction
	  	 Number and

Class

of Authorized

Shares
	  	 Number and

Class

of Issued Shares
	  	 Ownership

	Guardian Assets, Inc.	  	Delaware	  	1,000	  	1,000	  	 100%
 Amkor Technology, Inc.

					
	Amkor Worldwide Services LLC	  	Delaware	  	Not Applicable	  	Not Applicable	  	 100%
 Amkor Technology, Inc.

					
	Amkor Worldwide Services LLC – ROHQ	  	Philippines	  		  		  	 100%
 Amkor Worldwide Services LLC

				
	Amkor Assembly & Test (Shanghai) Co., Ltd.	  	People’s Republic of China (“PRC”)	  	No shares. Amkor Technology, Inc. holds 100% of the equity interest in this subsidiary. Ownership in this type of PRC (a wholly foreign owned enterprise) is not documented with certificated shares.	  	Amkor Technology, Inc.
					
	Amkor Technology Euroservices, SAS	  	France	  	500	  	500	  	 100%
 Guardian Assets, Inc. (499 shares

Amkor Technology, Inc. (1 share)

					
	Amkor Technology, Inc.	  	Delaware	  	—  	  	—  	  	—  
					
	Amkor Technology Limited	  	Cayman Islands	  	50,000	  	50,000	  	 100%
 Amkor Technology Singapore Holding Pte.
Ltd.

					
	Amkor Technology Korea, Inc.	  	Republic of Korea	  	50,000,000	  	34,529,400	  	 100%
 Amkor Technology Limited

					
	Amkor Technology Taiwan Ltd.	  	Republic of China	  	550,000,000	  	539,030,849	  	 80.19%
 Amkor Technology Limited

16.15%
 Amkor Technology, Inc.

					
	Unitive International Ltd.	  	Curacao	  	 6,899,760
 Common A

2,005,000
 Common B
	  	 5,196,125
 Common A

1,796,810
 Common B
	  	 100%
 Amkor Technology, Inc.

					
	Amkor Advanced Technology Taiwan, Inc.	  	Republic of China	  	230,000,000	  	223,240,000	  	 99.97%
 Amkor Technology Taiwan
Ltd.










									
	 Name
	  	 Jurisdiction
	  	 Number and

Class

of Authorized

Shares
	  	 Number and

Class

of Issued Shares
	  	 Ownership

	Amkor Technology Singapore Investment Pte. Ltd.	  	Singapore	  	1,000	  	1,000	  	 100%
 Guardian Assets, Inc.

					
	Amkor Technology Holding B.V.	  	The Netherlands	  	1	  	1	  	 100%
 Amkor Technology, Inc.

					
	Amkor Technology Holding B.V., Germany	  	Germany	  	—  	  	—  	  	 Branch office of
 Amkor Technology Holding
B.V.

					
	ATEP - Amkor Technology Portugal, S.A.	  	Portugal	  	15,000,000 Common Shares	  	15,000,000 Common Shares	  	 100%
 Amkor Technology Holding
B.V.

					
	J-Devices Corporation	  	Japan	  	160,000	  	64,453	  	 100%
 Amkor Technology Holding
B.V.

					
	Nanium Participacoes LTDA	  	Brazil	  	N/A	  	N/A	  	 99.99%
 Amkor Technology Portugal, S.A.

 
 0.01%

José Miranda Chaves Netto

					
	 NA NIUM FABRICAC AO e SERVICOS DE DESENVOLVIMEN TO e TEC NOLOGICA para a INDUSTRIA ELETRO-ELETRONICA LTDA.

“NANIUM SERVICES”
	  	Brazil	  	N/A	  	N/A	  	 99.99%
 Amkor Technology Portugal, S.A.

 
 0.01%

José Miranda Chaves Netto

					
	Amkor Technology Malaysia Sdn. Bhd.	  	Malaysia	  	99,000,000	  	99,000,000	  	 100%
 Amkor Technology Holding
B.V.

					
	Amkor Technology Singapore Holding Pte. Ltd.	  	Singapore	  	201,000	  	201,000	  	 100%
 Amkor Technology Singapore Investment Pte.
Ltd.

					
	Amkor Technology Philippines, Inc.	  	Philippines	  	—  	  	—  	  	 100% Branch of
 Amkor Technology Singapore
Holding Pte. Ltd.

					
	AAPI Realty Corporation	  	Philippines	  	600,000	  	151,000	  	 40% (60,398 shares)
 Amkor Technology
Philippines, Inc.

					
	IMI Salcedo Realty Corporation	  	Philippines	  	60,000,000	  	50,000,000	  	 40% (19,999,997 shares)
 Amkor Technology
Philippines, Inc.









 SCHEDULE 9.1.11 

to 
 Loan and Security Agreement

 PATENTS, TRADEMARKS, COPYRIGHTS AND LICENSES 
  

	1.	Patents1 

  

							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	1	  	5,173,338	  	12/22/92	  	Lead Frame Workholder And Transport Apparatus And Method
				
	2	  	5,179,039	  	01/12/93	  	Method Of Making A Resin Encapsulated Pin Grid Array With Integral Heatsink
				
	3	  	5,183,724	  	02/02/93	  	Method of Producing A Strip Of Lead Frames For Integrated Circuit Dies In A Continuous System
				
	4	  	5,194,695	  	03/16/93	  	Thermoplastic Semiconductor Package
				
	5	  	5,216,278	  	06/01/93	  	Semiconductor Device Having A Pad Array Carrier Package
				
	6	  	5,239,806	  	08/31/93	  	Thermoplastic Semiconductor Package and Method of Producing It
				
	7	  	5,241,133	  	08/31/93	  	Leadless Pad Array Chip Carrier
				
	8	  	5,269,210	  	12/14/93	  	Slitter Machine For Use In Manufacturing Semiconductor Devices
				
	9	  	5,289,039	  	02/22/94	  	Resin Encapsulated Semiconductor Device
				
	10	  	5,305,043	  	04/19/94	  	Method Of And Apparatus For Producing A Strip Of Lead Frames For Integrated Circuit Dies In A Continuous System
				
	11	  	5,328,870	  	07/12/94	  	Method For Forming Plastic Molded Package With Heat Sink For Integrated Circuit Devices
				
	12	  	5,355,283	  	10/11/94	  	Ball Grid Array With Via Interconnection
				
	13	  	5,378,869	  	01/03/95	  	Method For Forming An Integrated Circuit Package With Via Interconnection
				
	14	  	5,381,042	  	01/10/95	  	Packaged Integrated Circuit Including Heat Slug Having An Exposed Surface
				
	15	  	5,433,822	  	07/18/95	  	Method Of Manufacturing Semiconductor Device With Copper Core Bumps

  

	1 	All of scheduled patents are owned by Amkor Technology, Inc.. 









							
	
    #    
	  	USPN	  	Issued	  	 Title

	16	  	5,455,462	  	10/03/95	  	Plastic Molded Package With Heat Sink For Integrated Circuit Devices
				
	17	  	5,471,011	  	11/28/95	  	Homogeneous Thermoplastic Semiconductor Chip Carrier Package
				
	18	  	5,478,007	  	12/26/95	  	Method For Interconnection Of Integrated Circuit Chip And Substrate
				
	19	  	5,482,736	  	01/09/96	  	Method For Applying Flux Ball Grid Array Package
				
	20	  	5,482,898	  	01/09/96	  	Method For Forming A Semiconductor Device Having A Thermal Dissipator And Electromagnetic Shielding
				
	21	  	5,483,100	  	01/09/96	  	Integrated Circuit Package With Via Interconnections Formed In A Substrate
				
	22	  	5,483,740	  	01/16/96	  	Method Of Making Homogeneous Thermoplastic Semiconductor Chip Carrier Package
				
	23	  	5,485,037	  	01/17/96	  	Semiconductor Device Having A Thermal Dissipator And Electromagnetic Shielding
				
	24	  	5,582,772	  	12/10/96	  	Copper Oxide-Filled Polymer Die Attach Adhesive Composition For Semiconductor Package
				
	25	  	5,583,378	  	12/10/96	  	Ball Grid Array Integrated Circuit Package With Thermal Conductor
				
	26	  	5,596,485	  	01/21/97	  	Plastic Packaged Integrated Circuit With Heat Spreader
				
	27	  	5,629,561	  	05/13/97	  	Semiconductor Package With Integral Heat Dissipator
				
	28	  	5,635,671	  	06/03/97	  	Mold Runner Removal From A Substrate-Based Packaged Electronic Device
				
	29	  	5,637,273	  	06/10/97	  	Method For Molding Of Integrated Circuit Package
				
	30	  	5,641,946	  	06/24/97	  	Method And Circuit Board Structure For Leveling Solder Balls In Ball Grid Array Semiconductor Packages
				
	31	  	5,641,987	  	06/24/97	  	Heat Spreader Suitable For Use In Semiconductor Packages Having Different Pad Sizes
				
	32	  	5,650,593	  	07/22/97	  	Thermally Enhanced Chip Carrier Package
				
	33	  	5,661,338	  	08/26/97	  	Chip Mounting Plate Construction Of Lead Frame For Semiconductor Package
				
	34	  	5,672,909	  	09/30/97	  	Interdigitated Wirebond Programmable Fixed Voltage Planes
				
	35	  	5,701,034	  	12/23/97	  	Packaged Semiconductor Die Including Heat Sink With Locking Feature
				
	36	  	5,708,567	  	01/13/98	  	Ball Grid Array Semiconductor Package With Ring-Type Heat Sink
				
	37	  	5,712,570	  	01/27/98	  	Method For Checking A Wire Bond Of A Semiconductor Package
				
	38	  	5,722,161	  	03/03/98	  	Method Of Making A Packaged Semiconductor Die Including Heat Sink With Locking Feature
				
	39	  	5,723,899	  	03/03/98	  	Semiconductor Lead Frame Having Connection Bar And Guide Rings
				
	40	  	5,729,432	  	03/17/98	  	Ball Grid Array Semiconductor Package With Improved Dissipation And Dehumidification Effect
				
	41	  	5,739,588	  	04/14/98	  	Semiconductor Device
				
	42	  	5,740,956	  	04/21/98	  	Bonding Method For Semiconductor Chips
				
	43	  	5,767,446	  	06/16/98	  	Printed Circuit Board Having Epoxy Barrier Around A Throughout Slot And Ball Grid Array Semiconductor Package
				
	44	  	5,795,818	  	08/18/98	  	Integrated Circuit Chip To Substrate Interconnection And Method
				
	45	  	5,796,163	  	08/18/98	  	Solder Ball Joint
				
	46	  	5,807,768	  	09/15/98	  	Method For Fabricating A Heat Sink-Integrated Semiconductor Package
				
	47	  	5,827,999	  	10/27/98	  	Homogeneous Chip Carrier Package
				
	48	  	5,829,988	  	11/03/98	  	Socket Assembly For Integrated Circuit Chip Carrier Packager
				
	49	  	5,838,951	  	11/17/98	  	Wafer Map Conversion Method
				
	50	  	5,852,870	  	12/29/98	  	Method Of Making A Grid Array Assembly









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	51	  	5,854,511	  	12/29/98	  	Semiconductor Package Including Heat Sink With Layered Conductive Plate And Non-Conductive Tape Bonding To Leads
				
	52	  	5,854,741	  	12/29/98	  	Unit Printed Circuit Board Carrier Frame For Ball Grid Array Semiconductor Packages And Method For Fabricating Ball Grid Array Semiconductor Packages Using The Same
				
	53	  	5,858,149	  	01/12/99	  	Process For Bonding Semiconductor Chip
				
	54	  	5,858,815	  	01/12/99	  	Semiconductor Package And Method For Fabricating the Same
				
	55	  	5,859,475	  	01/12/99	  	Carrier Strip And Molded Flex Circuit Ball Grid Array
				
	56	  	5,864,470	  	01/26/99	  	Flexible Circuit Board For Ball Grid Array Semiconductor Package
				
	57	  	5,866,939	  	02/02/99	  	Grid Array Type Lead Frame And Lead End Grid Array Semiconductor Package Employing The Same
				
	58	  	5,867,368	  	02/02/99	  	Mounting For A Semiconductor Integrated Circuit Device
				
	59	  	5,872,399	  	02/16/99	  	Solder Ball Land Metal Structure of Ball Grid Semiconductor Package
				
	60	  	5,894,008	  	04/13/99	  	A Method for Manufacturing an Alumina-Silicon Carbide Nanocomposite
				
	61	  	5,897,334	  	04/27/99	  	Method For Reproducing Printed Circuit Boards For Semiconductor Packages Including Poor Quality Printed Circuit Board Units And Methods For Fabricating Semiconductor Packages Using The Reproduced Printed Circuit Boards
				
	62	  	5,905,633	  	05/18/99	  	Method Of Producing BGA Semiconductor Packages Using Metal Carrier Frame & BGA Produced By Such Method
				
	63	  	5,908,317	  	06/01/99	  	Method Of Forming Chip Bump Chip Scale Semiconductor Package, Such Package And Chip Bump
				
	64	  	5,915,169	  	06/22/99	  	Semiconductor Chip Scale Package And Method Of Producing Such
				
	65	  	5,939,784	  	08/17/99	  	Standing Acoustical Wave Package
				
	66	  	5,949,655	  	09/07/99	  	Mounting Having An Aperture Cover With Adhesive Locking Features For Flip Chip
				
	67	  	5,950,074	  	09/07/99	  	Method Of Making An Integrated Circuit Package
				
	68	  	5,953,589	  	09/14/99	  	Ball Grid Array Semiconductor Package With Solder Balls Fused On Printed Circuit Board
				
	69	  	5,962,810	  	10/05/99	  	Integrated Circuit Package Employing A Transparent Encapsulant And A Method Of Making The Package
				
	70	  	5,971,734	  	10/26/99	  	Mold For Ball Grid Array Semiconductor
				
	71	  	5,973,407	  	10/26/99	  	Integral Heat Spreader For Semiconductor Package
				
	72	  	5,977,624	  	11/02/99	  	Semiconductor Package And Assembly For Fabricating The Same
				
	73	  	5,981,314	  	11/09/99	  	Near Chip Size Integrated Circuit Package
				
	74	  	5,981,873	  	11/09/99	  	Printed Circuit Board For Ball Grid Array Semiconductor Package And Method For Molding Ball Grid Array Semiconductor Package Using The Same
				
	75	  	5,985,695	  	11/16/99	  	Method Of Making A Molded Flex Circuit Ball Grid Array
				
	76	  	5,986,334	  	11/17/99	  	Semiconductor Package Having Light, Thin, Simple, And Compact Structure
				
	77	  	5,998,857	  	12/07/99	  	Semiconductor Packaging Structure With The Bar On Chip
				
	78	  	6,013,554	  	01/11/00	  	Method For Fabricating An LDD MOS Transistor
				
	79	  	6,020,218	  	02/01/00	  	Method Of Manufacturing Ball Grid Array Semiconductor Package
				
	80	  	6,021,563	  	02/08/00	  	Method For Marking Poor Quality Printed Circuit Board Units Of Printed Circuit Board Strip For Semiconductor Package









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	81	  	6,028,354	  	02/22/00	  	A Microelectronic Device Package Having A Heat Sink Structure For Increasing The Thermal Conductivity Of The Package
				
	82	  	6,034,429	  	03/07/00	  	Method Of Making An Integrated Circuit Package
				
	83	  	6,090,715	  	07/18/00	  	Masking Process For Forming Self-Aligned Dual Wells Or Self-Aligned Field-Doping Regions
				
	84	  	6,091,141	  	07/18/00	  	Method Of Forming Chip Bumps Of Bump Chip Scale Semiconductor Package
				
	85	  	6,092,281	  	07/25/00	  	Electromagnetic Interference Shield Device And Method
				
	86	  	6,101,101	  	08/08/00	  	Universal Leadframe For Semiconductor Devices
				
	87	  	6,114,217	  	09/05/00	  	Method Of Forming Isolation Trenches On A Semiconductor Substrate
				
	88	  	6,117,193	  	09/12/00	  	Optical Sensor Array Mounting And Alignment
				
	89	  	6,117,705	  	09/12/00	  	Method Of Making Integrated Circuit Package Having Adhesive Bead Supporting Planar Lid Above Planar Substrates
				
	90	  	6,124,637	  	09/26/00	  	Carrier Strip And Molded Flex Circuit Ball Grid Array
				
	91	  	6,132,081	  	10/17/00	  	Method Of Forming Titanium Silicide By Heating A Silicon Substrate Having A Titanium Film And A Method Of Making
				
	92	  	6,143,588	  	11/07/00	  	A Method Of Making Integrated Circuit Package Employing A Transparent Encapsulant
				
	93	  	6,143,981	  	11/07/00	  	Plastic Integrated Circuit Package And Method And Leadframe For Making The Package
				
	94	  	6,150,193	  	11/21/00	  	RD Shielded Device
				
	95	  	6,150,709	  	11/21/00	  	Grid Array Type Leadframe Having Lead Ends In Different Planes
				
	96	  	6,163,463	  	12/19/00	  	Integrated Circuit Chip To Substrate Interconnection And Method
				
	97	  	6,177,731	  	01/23/01	  	Semiconductor Package
				
	98	  	6,198,163	  	03/06/01	  	Thin Package Integrated Circuit Including Recessed Heatsink With Exposed Surface
				
	99	  	6,200,841	  	03/07/01	  	MOS Transistor That Inhibits Punchthrough And Method For Fabricating The Same
				
	100	  	6,201,302	  	03/13/01	  	Semiconductor Package Having Multi-Dies
				
	101	  	6,201,305	  	03/13/01	  	Making Solder Ball Mounting Pads On Substrates
				
	102	  	6,204,131	  	03/20/01	  	Trench Structure For Isolating Semiconductor Elements And Method For Forming The Same
				
	103	  	6,207,562	  	03/27/01	  	Method Of Forming Titanium Silicide
				
	104	  	6,211,563	  	04/03/01	  	Semiconductor Package With An Improved Leadframe
				
	105	  	6,214,644	  	04/10/01	  	Flip-Chip Micromachine Package Fabrication Method
				
	106	  	6,214,645	  	04/10/01	  	Method Of Molding A Printed Circuit Board For A Semiconductor Package
				
	107	  	6,225,379	  	05/01/01	  	Epoxy Resin Composition For Bonding Semiconductor Chips
				
	108	  	6,228,676	  	05/08/01	  	Near Chip Size Integrated Circuit Package
				
	109	  	6,246,015	  	06/12/01	  	A Printed Circuit Board For Ball Grid Array Semiconductor Package
				
	110	  	6,246,566	  	06/12/01	  	Electrostatic Discharge Protection Package And Method
				
	111	  	6,247,229	  	06/19/01	  	Method Of Forming An Integrated Circuit Device Package Using A Plastic Tape As A Base
				
	112	  	6,255,176	  	07/03/01	  	Method Of Forming Trench For Semiconductor Device Isolation
				
	113	  	6,258,629	  	07/10/01	  	Method Of Making An Electronic Device Package And Lead Frame
				
	114	  	6,266,197	  	07/24/01	  	Molded Window Array For Image Sensor Packages
				
	115	  	6,268,568	  	07/31/01	  	Printed Circuit Board With Oval Solder Ball Lands For BGA Semiconductor Packages
				
	116	  	6,268,654	  	07/31/01	  	Method Of Making Integrated Circuit Package Having Adhesive Bead Supporting Planar Lid Above Planar Substrate









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	117	  	6,274,927	  	08/14/01	  	Plastic Package For An Optical Integrated Circuit Device And Method Of Making
				
	118	  	6,281,568	  	08/28/01	  	Plastic Integrated Circuit Device Package And Leadframe Having Partially Undercut Leads And Die Pads
				
	119	  	6,291,884	  	09/18/01	  	Chip-Size Semiconductor Packages
				
	120	  	6,296,988	  	10/02/01	  	Method For Forming A Mental Writing Pattern On A Semiconductor Device
				
	121	  	6,303,997	  	10/16/01	  	Thin, Stackable Semiconductor Packages
				
	122	  	6,309,916	  	10/30/01	  	Method Of Molding Plastic Semiconductor Packages
				
	123	  	6,309,943	  	10/30/01	  	Precision Marking And Singulation Method
				
	124	  	6,319,755	  	114/20/01	  	Conductive Strap Attachment Process That Allows Electrical Connection Between An Integrated Circuit Die And A Leadframe
				
	125	  	6,320,251	  	11/20/01	  	Stackable Package For Integrated Circuit
				
	126	  	6,326,235	  	12/04/01	  	Long Wire IC Package Fabrication Method
				
	127	  	6,329,606	  	12/11/01	  	Grid Array Assembly Of Circuit Boards With Singulation Grooves
				
	128	  	6,331,451	  	12/18/01	  	Methods Of Making Thin Integrated Circuit Device Packages With Improved Thermal Performance And Substrates For Making The Packages
				
	129	  	6,337,228	  	01/08/02	  	Low Cost Printed Circuit Board With Integral Heat Sink For Semiconductor Package
				
	130	  	6,338,985	  	01/15/02	  	Making Chip Size Semiconductor Package
				
	131	  	6,339,004	  	01/15/02	  	Method Of Forming Shallow Trench Isolation For Preventing Torn Oxide
				
	132	  	6,339,252	  	01/15/02	  	Electronic Device Package And Leadframe
				
	133	  	6,340,623	  	01/22/02	  	Method Of Fabricating Semiconductor Device
				
	134	  	6,340,846	  	01/22/02	  	Semiconductor Package With Stacked Dies And Wire Bond Reinforcement
				
	135	  	6,342,406	  	01/29/02	  	Flip Chip On glass Image Sensor Package Fabrication Method
				
	136	  	6,356,453	  	03/12/02	  	Electronic Package Having Flip Chip Integrated Circuit And Passive Chip Component
				
	137	  	6,369,454	  	04/09/02	  	Semiconductor Package And Method For Fabricating The Same
				
	138	  	6,372,540	  	04/16/02	  	Moisture Resistant Integrated Circuit Chip Package And Method
				
	139	  	6,389,687	  	05/21/02	  	Method Of Fabricating Image Sensor Packages In An Array
				
	140	  	6,389,689	  	05/21/02	  	Method Of Fabricating Semiconductor Package
				
	141	  	6,395,578	  	05/28/02	  	Semiconductor package And Method For Fabricating The Same
				
	142	  	6,396,043	  	05/28/02	  	Thin Image Sensor Package Fabrication Method
				
	143	  	6,396,130	  	05/28/02	  	Semiconductor Package Having Multiple Dies With Independently Biased Back Surfaces
				
	144	  	6,399,418	  	06/04/02	  	Method For Forming A Reduced Thickness Packaged Electronic Device
				
	145	  	6,399,463	  	06/04/02	  	Method Of Singulation Using Laser Cutting
				
	146	  	6,400,033	  	06/04/02	  	Reinforcing Solder Connections Of Electronic Devices
				
	147	  	6,403,978	  	06/11/02	  	Test Pattern For Measuring Variations Of Critical Dimensions Of Wiring Patterns Formed In The Fabrication Of Semiconductor Devices
				
	148	  	6,404,046	  	06/11/02	  	Stackable Package For Integrated Circuit With Interposer
				
	149	  	6,406,934	  	06/18/02	  	Wafer Level Production Of Chip Size Semiconductor Packages
				
	150	  	6,407,381	  	06/18/02	  	A Wafer Scale Image Sensor Package
				
	151	  	6,407,458	  	06/18/02	  	Moisture-Resistant Integrated Circuit Chip Package And Method
				
	152	  	6,414,396	  	07/02/02	  	Package For Stacked Circuits And Method Of Making
				
	153	  	6,415,505	  	07/09/02	  	Micromachine Package Fabrication Method
				
	154	  	6,417,576	  	07/09/02	  	Method And Apparatus For Attaching Metal Components To Integrated Circuit Modules
				
	155	  	6,420,201	  	07/16/02	  	Method For Forming A Bond Wire Pressure Sensor Die Package
				
	156	  	6,420,204	  	07/16/02	  	Method Of Making A Plastic Package For An Optical Integrated Circuit Device
				
	157	  	6,420,776	  	07/16/02	  	Structure Including Electronic Components Singulated Using Laser Cutting









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	158	  	6,423,576	  	07/23/02	  	A Microelectronic Device Package Having A Heat Sink Structure For Increasing The Thermal Conductivity Of The Package
				
	159	  	6,424,023	  	07/23/02	  	Leadframe And Heatsink Attached Semiconductor Package Using The Same
				
	160	  	6,424,031	  	07/23/02	  	Stackable Package With Heat Sink
				
	161	  	6,424,315	  	07/23/02	  	Semiconductor Chip Having A Radio-Frequency Identification Transceiver
				
	162	  	6,426,277	  	07/31/02	  	Method And A Device For Heat Treating A Semiconductor Wafer Having Different Kinds Of Impurities
				
	163	  	6,428,641	  	08/06/02	  	Method For Laminating Circuit Pattern Tape On Semiconductor Wafer
				
	164	  	6,429,513	  	08/06/02	  	Active Heat Sink For Cooling A Semiconductor Chip
				
	165	  	6,429,515	  	08/06/02	  	Long Wire IC Package
				
	166	  	6,432,737	  	08/13/02	  	Method For Forming A Flip Chip Pressure Sensor Die Package
				
	167	  	6,433,277	  	08/13/02	  	Plastic Integrated Circuit Package And Method And Leadframe For Making The Package
				
	168	  	6,437,427	  	08/20/02	  	Leadframe Used For The Fabrication Using The Same
				
	169	  	6,437,449	  	08/20/02	  	Stacked Die Semiconductor Package Construction With Backside Electrical Bias
				
	170	  	6,441,485	  	08/27/02	  	Apparatus For Mounting An Electronic Device To A Substrate Without Soldering
				
	171	  	6,441,503	  	08/27/02	  	A Bond Wire Pressure Sensor Die Package
				
	172	  	6,441,504	  	08/27/02	  	Precision Aligned And Marked Structure
				
	173	  	6,444,499	  	09/03/02	  	Method For Fabricating A Snapable Multi-Package Array Substrate, Snapable Multi-Package Array, And Snapable Packaged Electronic Components
				
	174	  	6,445,075	  	09/03/02	  	Semiconductor Module Package Substrate
				
	175	  	6,448,506	  	09/10/02	  	Semiconductor Package And Circuit Board For Making The Package
				
	176	  	6,448,509	  	09/10/02	  	Printed Circuit Board With Heat Spreader And Method Of Making
				
	177	  	6,448,633	  	09/10/02	  	Leadframe With Lead Separation Preventing Mean, Semiconductor Package Using The Leadframe And Method For Fabricating
				
	178	  	6,448,635	  	09/10/02	  	Surface Acoustical Wave Flip Chip
				
	179	  	6,452,278	  	09/17/02	  	Low Profile Exposed Die Package For Semiconductor Chip
				
	180	  	6,455,356	  	09/24/02	  	Methods For Molding A Leadframe In Plastic Integrated Circuit Device
				
	181	  	6,455,774	  	09/24/02	  	Molded Image Sensor Package
				
	182	  	6,455,927	  	09/24/02	  	Micromirror Device Package
				
	183	  	6,459,147	  	10/01/02	  	Copper Strap Design For Low Resistance path In An Integrated Circuit Package
				
	184	  	6,462,274	  	10/08/02	  	Chip-Scale Semiconductor Package Of The Fan-Out Type And Method of Manufacturing Such Packages
				
	185	  	6,465,329	  	10/15/02	  	Microcircuit Die Sawing Protector And Method
				
	186	  	6,469,258	  	10/22/02	  	Circuit Board For Semiconductor Package
				
	187	  	6,469,369	  	10/22/02	  	Leadframe Having A Mold Inflow Groove And Method
				
	188	  	6,472,598	  	10/29/02	  	Electromagnetic Interference Shield Driver and Method
				
	189	  	6,472,758	  	10/29/02	  	Semiconductor Package Including Stacked Semiconductor Dies And Bond Wires
				
	190	  	6,475,827	  	11/15/02	  	Method For Making A Semiconductor package Having Improved Defect Testing And Increased Production Yield
				
	191	  	6,476,331	  	11/05/02	  	Printed Circuit Board For Semiconductor Package And Method For Manufacturing The Same
				
	192	  	6,476,476	  	11/05/02	  	Integrated Circuit Package Including Pin And Barrel Interconnects
				
	193	  	6,476,478	  	11/05/02	  	Cavity Semiconductor Package With Exposed Leads And Die Pad
				
	194	  	6,479,887	  	11/12/02	  	Circuit Pattern Tape For Wafer Scale Production Of Chip Size Semiconductor Packages
				
	195	  	6,483,030	  	11/19/02	  	Snap Lid Image Sensor Package
				
	196	  	6,483,101	  	11/19/02	  	Molded Image Sensor Package Having Lens Holder
				
	197	  	6,486,537	  	11/26/02	  	Semiconductor Package With Warpage Resistant Substrate
				
	198	  	6,486,545	  	11/26/02	  	Pre-Drilled BGA Package









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	199	  	6,489,651 Expired	  	12/03/02	  	MOS Transistor That Inhibits Punch Through And Method For Fabricating The Same
				
	200	  	6,489,667	  	12/03/02	  	Semiconductor Device And Method Of Manufacturing Such Device
				
	201	  	6,492,699	  	12/10/02	  	Image Sensor Package Having Sealed Cavity Over Active Area
				
	202	  	6,494,361	  	12/17/02	  	Semiconductor Module Package Substrate Fabrication Method
				
	203	  	6,501,161	  	12/31/02	  	Semiconductor package Having Increased Solder Joint Strength
				
	204	  	6,501,184	  	12/31/02	  	Semiconductor Package And Method For Manufacturing The Same
				
	205	  	6,503,780	  	01/07/03	  	Wafer Scale Image Sensor Package Fabrication Method
				
	206	  	6,507,102	  	01/14/03	  	Printed Circuit Board With Integral Heat Sink For Semiconductor Package
				
	207	  	6,509,560	  	01/21/03	  	Chip Size Image Sensor In Wirebond Package With Step-Up Ring For Electrical Contact
				
	208	  	6,509,637	  	01/21/03	  	Low Profile Mounting Of Thick Integrated Circuit Packages Within Low- Profile Modules
				
	209	  	6,512,219	  	01/28/03	  	Fabrication Method For Integrally Connected Image Sensor Packages having A Window Support In Contact With The Window And Active Area
				
	210	  	6,512,288	  	01/28/03	  	Circuit Board Semiconductor Package
				
	211	  	6,515,269	  	02/04/03	  	Integrally Connected Image Sensor Package Having A Window Support In Connection With A Window And The Active Area
				
	212	  	6,515,356	  	02/04/03	  	Semiconductor Package And Method For Fabricating The Same
				
	213	  	6,517,656	  	02/11/03	  	Method Of Making An Integrated Circuit Package Using A Batch Step For Curing A Die Attachment Film And A Tool System For Performing The Method
				
	214	  	6,518,659	  	02/11/03	  	Stackable Package having A Cavity And A Lid For An Electronic Device
				
	215	  	6,521,982	  	02/18/03	  	Packaging High Power Integrated Circuit Devices
				
	216	  	6,521,987	  	02/18/03	  	Plastic Integrated Circuit Device Package And Method For Making The Package
				
	217	  	6,522,015	  	02/18/03	  	MicroMachine Stacked Wirebonded Package
				
	218	  	6,525,406	  	02/25/03	  	Semiconductor Device Having Increased Moisture Path And Increased Solder Joint Strength
				
	219	  	6,526,653	  	03/04/03	  	Method Of Assembling A Snap Lid Image Sensor Package
				
	220	  	6,528,857	  	03/04/03	  	Chip Size Image Sensor Bumped Package
				
	221	  	6,528,869	  	03/04/03	  	Semiconductor Package With Molded Substrate And Recessed Input/Output Terminals
				
	222	  	6,528,875	  	03/04/03	  	Vacuum Sealed Package For Semiconductor Chip
				
	223	  	6,530,515	  	03/11/03	  	MicroMachine Stacked Flip Chip Package Fabrication Method
				
	224	  	6,530,735	  	03/11/03	  	Gripper Assembly
				
	225	  	6,531,784	  	03/11/03	  	Semiconductor Package With Spacer Strips
				
	226	  	6,532,157	  	03/11/03	  	Angulated Semiconductor Packages
				
	227	  	6,534,338	  	03/18/03	  	Method For Overmolded Encapsulation Of Ceramic Substrate Mediums
				
	228	  	6,534,391	  	03/18/03	  	Semiconductor Package Having Substrate With Laser Formed Aperture Through Solder Mask Layer
				
	229	  	6,534,876	  	03/18/03	  	Flip Chip Micromachine Package
				
	230	  	6,545,345	  	04/08/03	  	Mounting For A Package Containing A Chip
				
	231	  	6,546,620	  	04/15/03	  	Flip Chip Integrated Circuit And Passive Chip Component Package Fabrication Method
				
	232	  	6,548,759	  	04/15/03	  	Pre-Drilled Image Sensor Package
				
	233	  	6,552,416	  	04/22/03	  	Multiple Die Lead Frame Package With Enhanced Die To Die Interconnect Routing Using Internal Lead Trace Wiring
				
	234	  	6,555,899	  	04/29/03	  	Semiconductor Package Leadframe Assembly And Method Of Manufacture
				
	235	  	6,555,917	  	04/29/03	  	Semiconductor Package Having Stacked Semiconductor Chips And Method Of Making The Same
				
	236	  	6,562,655	  	05/13/03	  	Heat Spreader With Spring IC Package Fabrication Method
				
	237	  	6,563,204	  	05/03/03	  	Micro Die Sawing Protector And Method
				
	238	  	6,564,454	  	05/20/03	  	Method Of Making And Stacking A Semiconductor Package









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	239	  	6,566,164	  	05/20/03	  	Exposed Copper Strap In A Semiconductor Package
				
	240	  	6,570,825	  	05/27/03	  	Method And Circuit Module Package For Automatic Switch Actuator Insertion
				
	241	  	6,571,466	  	06/03/03	  	Flip Chip Image Sensor Package Fabrication Method
				
	242	  	6,572,944	  	06/03/03	  	Structure For Fabricating A Special Purpose Die Using A Polymerizable Tape
				
	243	  	6,576,998	  	06/10/03	  	Thin Semiconductor Package With Semiconductor Chip And Electronic Discrete Device
				
	244	  	6,577,012	  	06/10/03	  	Laser Defined Pads For Flip Chip On Leadframe Package
				
	245	  	6,577,013	  	06/10/03	  	Chip Size Semiconductor Packages With Stacked Dies
				
	246	  	6,580,153	  	06/17/03	  	Structure For Protecting A Micromachine With A Cavity In A UV Tape
				
	247	  	6,580,159	  	06/17/03	  	Integrated Circuit Device Packages And Substrates For Making The Package
				
	248	  	6,580,167	  	06/17/03	  	Heat Spreader With Spring IC Package
				
	249	  	6,580,620	  	06/17/03	  	Matrix Type Printed Circuit Board For Semiconductor Packages
				
	250	  	6,586,677	  	07/01/03	  	Plastic Integrated Circuit Device Package Having Exposed Lead Surface
				
	251	  	6,586,824	  	07/01/03	  	Reduced Thickness Packaged Electronic Device
				
	252	  	6,586,826	  	07/01/03	  	Integrated Circuit Package Having Posts For Connection To Other Packages And Substrates
				
	253	  	6,589,801	  	07/08/03	  	Wafer Scale Production Of Chip Scale Semiconductor Package Using Wafer Mapping Techniques
				
	254	  	6,593,545	  	07/15/03	  	Laser Defined Pads For Flip Chip On Leadframe Package Fabrication Method
				
	255	  	6,596,212	  	07/22/03	  	Method And Apparatus For Increasing Thickness Of Molded Body On Semiconductor Package
				
	256	  	6,597,059	  	07/22/03	  	Thermally Enhanced Chip Scale Lead Pm Chip Semiconductor Package
				
	257	  	6,601,293	  	08/05/03	  	Method Of Making An Electromagnetic Interference Shield Device
				
	258	  	6,603,072	  	08/05/03	  	Making Leadframe Semiconductor Packages With Stacked Dies And Interconnecting Interposer
				
	259	  	6,603,183	  	08/05/03	  	Quick Sealing Glass-Lidded Package
				
	260	  	6,605,865	  	08/12/03	  	Semiconductor Package With Optimized Leadframe Bonding Strength
				
	261	  	6,605,866	  	08/12/03	  	Stackable Semiconductor Package And Method For Manufacturing The Same
				
	262	  	6,608,366	  	08/19/03	  	Lead Frame With Plated End Leads
				
	263	  	6,608,497	  	08/19/03	  	Apparatus And Method For Allowing Testing Of Semiconductor Devices At Different Temperatures
				
	264	  	6,610,167	  	08/26/03	  	Method For Fabricating A Special Purpose Die Using A Polymerizable Tape
				
	265	  	6,611,047	  	08/26/03	  	Semiconductor Package With Singulation Crease
				
	266	  	6,614,102	  	09/02/03	  	Shielded Semiconductor Leadframe Package
				
	267	  	6,616,436	  	09/09/03	  	Apparatus For Manufacturing Semiconductor Packages
				
	268	  	6,620,646	  	09/16/03	  	Chip Size Image Sensor Wirebond Package Fabrication Method
				
	269	  	6,620,862	  	09/16/03	  	Sheet Resin Composition And Process For Manufacturing Semiconductor Device Therewith
				
	270	  	6,624,005	  	09/23/03	  	Semiconductor Memory Cards And Method Of Making Same
				
	271	  	6,624,921	  	09/23/03	  	Micromirror Device Package Fabrication Method
				
	272	  	6,627,864	  	09/30/03	  	Thin Image Sensor Package
				
	273	  	6,627,976	  	09/30/03	  	Leadframe For Semiconductor Package And Mold For Molding The Same
				
	274	  	6,627,977	  	09/30/03	  	Semiconductor Packages Including Isolated Ring Structure
				
	275	  	6,627,987	  	09/30/03	  	Ceramic Semiconductor Package And Method For Fabricating The Package
				
	276	  	6,629,633	  	10/07/03	  	Chip Size Image Sensor Bumped Package Fabrication Method
				
	277	  	6,630,661	  	10/07/03	  	Sensor Module With Integrated Discrete Components Mounted On A Window
				
	278	  	6,630,726	  	10/07/03	  	Power Semiconductor Package With Strap









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	279	  	6,630,728	  	10/07/03	  	Plastic Integrated Circuit Package And Leadframe For Making The Package
				
	280	  	6,632,997	  	10/14/03	  	Personalized Circuit Module Package And Method For Packaging Circuit Modules
				
	281	  	6,638,789	  	10/28/03	  	Micromachine Stacked Wirebonded Package Fabrication Method
				
	282	  	6,639,308	  	10/28/03	  	Near Chip Size Semiconductor Package
				
	283	  	6,642,610	  	11/04/03	  	Wire Bonding Method And Semiconductor Package Using The Same
				
	284	  	6,646,290	  	11/11/03	  	Optical Structure Having An Optical Diode And A Sensor In Separate Apertures Inside Double Insulating Layers
				
	285	  	6,646,339	  	11/11/03	  	Thin And Heat Radiant Semiconductor Package And Method For Manufacturing
				
	286	  	6,650,019	  	11/18/03	  	Method of Making A Semiconductor Package Including Stacked Semiconductor Dies
				
	287	  	6,656,765	  	12/02/03	  	Fabricating Very Thin Chip Size Semiconductor Package
				
	288	  	6,657,298	  	12/02/03	  	Integrated Circuit Chip Package Having An Internal Lead
				
	289	  	6,660,559	  	12/09/03	  	Method Of Making A Chip Carrier Package Using Laser Ablation
				
	290	  	6,661,080	  	12/09/03	  	Structure For Backside Saw Cavity Protection
				
	291	  	6,667,544	  	12/23/03	  	Stackable Package Having Clips For Fastening Package And Tool For Opening Clips
				
	292	  	6,670,551	  	12/30/03	  	Image Sensing Component Package And Manufacture Method Thereof
				
	293	  	6,670,698	  	12/30/03	  	Integrated Circuit Package Mounting
				
	294	  	6,672,773	  	01/06/04	  	Optical Fiber Having Tapered End And Optical Connector With Reciprocal Opening
				
	295	  	6,677,662	  	01/13/04	  	Clamp And Heat Block Assembly For Wire Bonding A Semiconductor Package Assembly
				
	296	  	6,677,663	  	01/13/04	  	End Grid Array Semiconductor Package
				
	297	  	6,683,377	  	01/27/04	  	Multi-Stacked Memory Package
				
	298	  	6,683,795	  	01/27/04	  	Shield Cap And Semiconductor Package Including Shield Cap
				
	299	  	6,684,496	  	02/03/04	  	Method Of Making An Integrated Circuit Package
				
	300	  	6,686,580	  	02/03/04	  	Image Sensor Package With Reflector
				
	301	  	6,686,588	  	02/03/04	  	Optical Module With Lens Integral Holder
				
	302	  	6,686,649	  	02/03/04	  	Multi-Chip Semiconductor Package With Integral Shield And Antenna
				
	303	  	6,686,651	  	02/03/04	  	Multi-Layer Leadframe Structure
				
	304	  	6,695,120	  	02/24/04	  	Assembly For Transporting Material
				
	305	  	6,696,747	  	02/24/04	  	Semiconductor Package Having Reduced Thickness
				
	306	  	6,700,187	  	03/02/04	  	Semiconductor Package And Method For Manufacturing The Same
				
	307	  	6,707,138	  	03/16/04	  	Semiconductor Device Including Metal Strap Electrically Coupled Between Semiconductor Die And Metal Leadframe
				
	308	  	6,707,168	  	03/16/04	  	Shielded Semiconductor Package With Single-Sided Substrate And Method For Making The Same
				
	309	  	6,710,438	  	03/23/04	  	Enhanced Chip Scale Package For Wire Bond Dies
				
	310	  	6,710,945	  	03/23/04	  	Injection Molded Lens-Barrel Assembly And Method For Fabricating Lens Barrel And Mount Assemblies
				
	311	  	6,713,322	  	03/30/04	  	Lead Frame For Semiconductor Package
				
	312	  	6,717,126	  	04/06/04	  	Method Of Fabricating And Using An Image Sensor Package With Reflector
				
	313	  	6,717,248	  	04/06/04	  	Semiconductor Package And Method For Fabricating The Same
				
	314	  	6,717,822	  	04/06/04	  	Lead-Frame Method And Circuit Module Assembly Including Edge Stiffner
				
	315	  	6,723,582	  	04/20/04	  	Method Of Making A Semiconductor Package Having Exposed Metal Strap
				
	316	  	6,730,536	  	05/04/04	  	Pre-Drilled Image Sensor Package Fabrication Method
				
	317	  	6,730,544	  	05/04/04	  	Stackable Semiconductor Package And Method For Manufacturing Same
				
	318	  	6,734,419	  	05/11/04	  	Method For Forming an Image Sensor Package With Vision Die In Lens Housing
				
	319	  	6,737,750	  	05/18/04	  	Structures For Improving Heat Dissipation In Stacked Semiconductor Packages









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	320	  	6,740,950	  	05/25/04	  	Optical Device Packages Having Improved Conductor Efficiency, Optical Coupling and Thermal Transfer
				
	321	  	6,747,352	  	06/08/04	  	Integrated Circuit Having Multiple Power/Ground Connections To A Single External Terminal
				
	322	  	6,750,545	  	06/15/04	  	Semiconductor Package Capable Of Die Stacking
				
	323	  	6,753,597	  	06/22/04	  	Encapsulated Semiconductor Package Including Chip Paddle And Leads
				
	324	  	6,756,658	  	06/29/04	  	Making Two Lead Surface Mounting High Power Microleadframe Semiconductor Packages
				
	325	  	6,759,266	  	07/06/04	  	Quick Sealing Glass-Lidded Package Fabrication Method
				
	326	  	6,759,737	  	07/06/04	  	Semiconductor Package Including Stacked Chips With Aligned Input/Output Pads
				
	327	  	6,762,078	  	07/13/04	  	Semiconductor Package Having Semiconductor Chip Within Central Aperture Of Substrate
				
	328	  	6,765,801	  	07/20/04	  	Optical Track Drain Package
				
	329	  	6,770,961	  	08/03/04	  	Carrier Frame And Semiconductor Package Including Carrier Frame
				
	330	  	6,777,789	  	08/17/04	  	Mounting For A Package Containing A Chip
				
	331	  	6,784,376	  	08/31/04	  	Solderable Injection-Molded Integrated Circuit Substrate And Method Therefor
				
	334	  	6,784,534	  	08/31/04	  	Thin Integrated Circuit Package Having An Optically Transparent Window
				
	332	  	6,791,076	  	09/14/04	  	Image Sensor Package
				
	333	  	6,791,166	  	09/14/04	  	Stackable Lead Frame Package Using Exposed Internal Lead Traces
				
	335	  	6,794,740	  	09/21/04	  	Leadframe Package For Semiconductor Devices
				
	336	  	6,798,046	  	09/28/04	  	Semiconductor Package Including Ring Structure Connected To Leads With Vertically Downset Inner Ends
				
	337	  	6,798,047	  	09/28/04	  	Pre-Molded Leadframe
				
	338	  	6,798,049	  	09/28/04	  	Semiconductor Package And Method For Fabricating The Same
				
	339	  	6,803,254	  	10/12/04	  	Wire Bonding Method For A Semiconductor Package
				
	340	  	6,803,645	  	10/12/04	  	Semiconductor Package Including Flip Chip
				
	341	  	6,807,218	  	10/19/04	  	Laser Module And Optical Subassembly
				
	342	  	6,816,032	  	11/09/04	  	Laminated Low-Profile Dual Filter Module For Telecommunications Devices And Method Therefor
				
	343	  	6,816,523	  	11/09/04	  	VSCEL Package and Fabrication Method
				
	344	  	6,818,973	  	11/16/04	  	Exposed Lead QFP Package Fabricated Through The Use Of A Partial Saw Process
				
	345	  	6,822,323	  	11/23/04	  	Semiconductor Package Having More Reliable Electrical Conductive Patterns
				
	346	  	6,825,062	  	11/30/04	  	Semiconductor Package And Method Of Making Using Leadframe Having Lead Locks To Secure Leads to Encapsulant
				
	347	  	6,830,955	  	12/14/04	  	Semiconductor Package And Method For Manufacturing The Same
				
	348	  	6,831,371	  	12/14/04	  	Integrated Circuit Substrate Having Embedded Wire Conductors And Method Therefor
				
	349	  	6,833,609	  	12/21/04	  	Integrated Circuit Device Packages And Substrates For Making The Packages
				
	350	  	6,833,619	  	12/21/04	  	Thin Profile Semiconductor Package Which Reduces Warpage and Damage During Laser Markings
				
	351	  	6,838,309	  	01/04/05	  	Flip-Chip Micromachine Package Using Seal Layer
				
	352	  	6,841,414	  	01/11/05	  	Saw and Etch Singulation Method for a Chip Package
				
	353	  	6,841,874	  	01/11/05	  	Wafer-Level Chip-Scale Package
				
	354	  	6,844,615	  	01/18/05	  	Leadframe Package For Semiconductor Devices
				
	355	  	6,846,704	  	01/25/05	  	Semiconductor Package and Method for Manufacturing the Same
				
	356	  	6,847,099	  	01/25/05	  	Offset Etched Corner Leads For Semiconductor Package
				
	357	  	6,847,103	  	01/25/05	  	Semiconductor Package With Exposed Die Pad and Body-Locking Leadframe
				
	358	  	6,849,916	  	02/01/05	  	Flip Chip on Glass Sensor Package
				
	359	  	6,853,059	  	02/08/05	  	Semiconductor Package Having Improved Adhesiveness and Ground Bonding









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	360	  	6,853,060	  	02/08/05	  	Semiconductor Package Using A Printed Circuit Board and A Method of Manufacturing the Same
				
	361	  	6,858,919	  	02/22/05	  	Semiconductor Package
				
	362	  	6,861,720	  	03/01/05	  	Placement Template and Method For Placing Optical Dies
				
	363	  	6,867,071	  	03/15/05	  	Leadframe Including Corner Leads And Semiconductor Package Using Same
				
	364	  	6,869,861	  	03/22/05	  	Back-Side Wafter Singulation Method
				
	365	  	6,873,032	  	03/29/05	  	Thermally Enhanced Chip Scale Lead On Chip Semiconductor Package And Method Of Making Same
				
	366	  	6,873,041	  	03/29/05	  	Power Semiconductor Package With Strap
				
	367	  	6,875,379	  	04/05/05	  	Tool and Method For Forming An Integrated Optical Circuit
				
	368	  	6,876,068	  	04/05/05	  	Semiconductor Package With Increased Number Of Input And Output Pins
				
	369	  	6,879,034	  	04/12/05	  	Semiconductor Package Including Low Temperature Co-Fired Ceramic Substrate
				
	370	  	6,879,047	  	04/12/05	  	Stacking Structure For Semiconductor Devices Using A Folded Over Flexible Substrate And Method Therefor
				
	371	  	6,884,695	  	04/26/05	  	Sheet Resin Composition And Process For Manufacturing Semiconductor Device Therewith
				
	372	  	6,885,086	  	04/26/05	  	Reduced Copper Lead Frame For Saw-Singulated Chip Package
				
	373	  	6,888,242	  	05/03/05	  	Color Contacts For A Semiconductor Package
				
	374	  	6,889,813	  	05/10/05	  	Material Transport Method
				
	375	  	6,893,900	  	05/17/05	  	Method Of Making An Integrated Circuit Package
				
	376	  	6,897,550	  	05/24/05	  	Fully Molded Leadframe Stand-Off Feature
				
	377	  	6,900,527	  	05/31/05	  	Lead-Frame Method And Assembly For Interconnecting Circuits Within A Circuit Module
				
	378	  	6,905,914	  	06/14/05	  	Wafer Level Package And Fabrication Method
				
	379	  	6,910,635	  	06/28/05	  	Die Down Multi-Media Card And Method Of Making Same
				
	380	  	6,911,718	  	06/28/05	  	Double Downset Double Dambar Suspended Leadframe
				
	381	  	6,919,620	  	07/19/05	  	Compact Flash Memory Card With Clamshell Leadframe
				
	382	  	6,919,631	  	07/19/05	  	Structure For Improving Heat Dissipation In Stacked Semiconductor Packages
				
	383	  	6,921,967	  	07/26/05	  	Reinforced Die Pad Support Structure
				
	384	  	6,927,478	  	08/09/05	  	Reduced Size Semiconductor Package With Stacked Dies
				
	385	  	6,927,483	  	08/09/05	  	Semiconductor Package Exhibiting Efficient Lead Placement
				
	386	  	6,930,256	  	08/16/05	  	Integrated Circuit Substrate Having Laser-Embedded Conductive Patterns And Method Therefor
				
	387	  	6,930,257	  	08/16/05	  	Integrated Circuit Substrate Having Laminated Laser-Embedded Circuit Layers
				
	388	  	6,930,378	  	08/16/05	  	Stacked Semiconductor Die Assembly Having At Least One Support
				
	389	  	6,936,922	  	08/30/05	  	Semiconductor Package Structure Reducing Warpage And Manufacturing Method Thereof
				
	390	  	6,943,429	  	09/13/05	  	Wafer Having Alignment Marks Extending From A First To A Second Surface Of The Wafer
				
	391	  	6,946,316	  	09/20/05	  	Method Of Fabricating And Using An Image Sensor Package
				
	392	  	6,946,323	  	09/20/05	  	Semiconductor Package Having One Or More Die Stacked On A Prepackaged Device And Method Therefor
				
	393	  	6,953,988	  	10/11/05	  	Semiconductor Package
				
	394	  	6,956,201	  	10/18/05	  	Image Sensor Package Fabrication Method
				
	395	  	6,962,829	  	11/08/05	  	Method Of Making Near Chip Size Integrated Circuit Package
				
	396	  	6,963,141	  	11/08/05	  	Semiconductor Package For Efficient Heat Spreading
				
	397	  	6,965,157	  	11/15/05	  	Semiconductor Package With Exposed Die Pad and Body-Locking Leadframe
				
	398	  	6,965,159	  	11/15/05	  	Reinforced Lead-Frame Assembly For Interconnecting Circuits Within A Circuit Module
				
	399	  	6,967,124	  	11/22/05	  	Imprinted Integrated Circuit Substrate And Method For Imprinting An Integrated Circuit Substrate
				
	400	  	6,967,395	  	11/22/05	  	Mounting For A Package Containing A Chip









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	401	  	6,977,431	  	12/20/05	  	Stackable Semiconductor Package And Manufacturing Method Thereof
				
	402	  	6,982,485	  	01/03/06	  	Stacking Structure For Semiconductor Chips And A Semiconductor Package Using It
				
	403	  	6,982,488	  	01/03/06	  	Semiconductor Package And Method For Fabricating The Same
				
	404	  	6,984,879	  	01/10/06	  	Clamp For Pattern Recognition
				
	405	  	6,987,314	  	01/17/06	  	Stackable Semiconductor Package With Solder On Pads On Which Second Semiconductor Package Is Stacked
				
	406	  	6,987,319	  	01/17/06	  	Wafer-Level Chip-Scale Package
				
	407	  	6,987,661	  	01/17/06	  	Integrated Circuit Substrate Having Embedded Passive Components And Methods Therefor
				
	408	  	6,990,226	  	01/24/06	  	Pattern Recognition Method
				
	409	  	6,995,448	  	02/07/06	  	Semiconductor Package Including Passive Elements And Method Of Manufacture
				
	410	  	6,995,459	  	02/07/06	  	Semiconductor Package With Increased Number Of Input And Output Pins
				
	411	  	6,998,702	  	02/14/06	  	Front Edge Chamfer Feature For Fully-Molded Memory Cards
				
	412	  	7,001,799	  	02/21/06	  	Method Of Making A Leadframe For Semiconductor Devices
				
	413	  	7,005,326	  	02/28/06	  	Method Of Making An Integrated Circuit Package
				
	414	  	7,008,825	  	03/07/06	  	Leadframe Strip Having Enhanced Testability
				
	415	  	7,009,283	  	03/07/06	  	Nonexposed Heat Sink For Semiconductor Package
				
	416	  	7,009,296	  	03/07/06	  	Semiconductor Package With Substrate Coupled To A Peripheral Side Surface Of A Semiconductor Die
				
	417	  	7,011,251	  	03/14/06	  	Die Down Multi-Media Card And Method Of Making Same
				
	418	  	7,019,387	  	03/28/06	  	Lead-Frame Connector And Circuit Module Assembly
				
	419	  	7,028,400	  	04/18/06	  	Integrated Circuit Substrate Having Laser-Exposed Terminals
				
	420	  	7,030,474	  	04/18/06	  	Plastic Integrated Circuit Package And Method And Leadframe For Making The Package
				
	421	  	7,030,508	  	04/18/06	  	Substrate For Semiconductor Package And Wire Bonding Method Using Thereof
				
	422	  	7,042,068	  	05/09/06	  	Leadframe And Semiconductor Package Made Using The Leadframe
				
	423	  	7,042,072	  	05/09/06	  	Semiconductor Package And Method Of Manufacturing The Same Which Reduces Warpage
				
	424	  	7,045,396	  	05/16/06	  	Stackable Semiconductor Package And Method For Manufacturing Same
				
	425	  	7,045,882	  	05/16/06	  	Semiconductor Package Including Flip Chip
				
	426	  	7,045,883	  	05/16/06	  	Thermally Enhanced Chip Scale Lead On Chip Semiconductor Package And Method Of Making Same
				
	427	  	7,045,893	  	05/16/06	  	Semiconductor Package And Method For Manufacturing The Same
				
	428	  	7,049,682	  	05/23/06	  	Multi-Chip Semiconductor Package With Integral Shield And Antenna
				
	429	  	7,057,268	  	06/06/06	  	Cavity Case With Clip/Plug For Use On Multimedia Card
				
	430	  	7,057,280	  	06/06/06	  	Leadframe Having Lead Locks To Secure Leads To Encapsulant
				
	431	  	7,059,040	  	06/13/06	  	Optical Module With Lens Integral Holder Fabrication Method
				
	432	  	7,061,120	  	06/13/06	  	Stackable Semiconductor Package Having Semiconductor Chip Within Central Through Hole Of Substrate
				
	433	  	7,064,009	  	06/20/06	  	Thermally Enhanced Chip Scale Lead On Chip Semiconductor Package and Method of Making Same
				
	434	  	7,067,908	  	06/27/06	  	Semiconductor Package Having Improved Adhesiveness And Ground Bonding
				
	435	  	7,071,541	  	07/04/06	  	Plastic Integrated Circuit Package And Method And Leadframe For Making The Package
				
	436	  	7,071,568	  	07/04/06	  	Stacked-Die Extension Support Structure And Method Thereof
				
	437	  	7,074,654	  	07/11/06	  	Tape Supported Memory Card Leadframe Structure
				
	438	  	7,091,571	  	08/15/06	  	Image Sensor Package And Method For Manufacturing Thereof
				
	439	  	7,091,594	  	08/15/06	  	Leadframe Type Semiconductor Package Having Reduced Inductance And Its Manufacturing Method
				
	440	  	7,095,103	  	08/22/06	  	Leadframe Based Memory Card
				
	441	  	7,102,208	  	09/05/06	  	Leadframe And Semiconductor Package With Improved Solder Joint Strength









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	442	  	7,102,214	  	09/05/06	  	Pre-Molded Leadframe
				
	443	  	7,102,216	  	09/05/06	  	Semiconductor Package And Leadframe With Horizontal Leads Spaced In The Vertical Direction And Method Of Making
				
	444	  	7,102,891	  	09/05/06	  	Circuit Module Having Interconnects For Connecting Functioning And Non- Functioning Add Ons And Method Therefor
				
	445	  	7,112,474	  	09/26/06	  	Method Of Making An Integrated Circuit Package
				
	446	  	7,112,875	  	09/26/06	  	Secure Digital Memory Card Using Land Grid Array Structure
				
	447	  	7,115,445	  	10/03/06	  	Semiconductor Package Having Reduced Thickness
				
	448	  	7,126,111	  	10/24/06	  	Camera Module Having A Threaded Lens Barrel And A Ball Grid Array Connecting Device
				
	449	  	7,126,218	  	10/24/06	  	Embedded Heat Spreader Ball Grid Array
				
	450	  	7,132,753	  	11/07/06	  	Stacked Die Assembly Having Semiconductor Die Overhanging Support
				
	451	  	7,138,707	  	11/21/06	  	Semiconductor Package Including Leads And Conductive Posts For Providing Increased Functionality
				
	452	  	7,144,517	  	12/05/06	  	Manufacturing Method For Leadframe And For Semiconductor Package Using The Leadframe
				
	453	  	7,145,238	  	12/05/06	  	Semiconductor Package And Substrate Having Multi-Level Vias
				
	454	  	7,145,251	  	12/05/06	  	Colored Conductive Wires For A Semiconductor Package
				
	455	  	7,145,253	  	12/05/06	  	Encapsulated Sensor Device
				
	456	  	7,146,106	  	12/05/06	  	Optic Semiconductor Module And Manufacturing Method
				
	457	  	7,154,171	  	12/26/07	  	Stacking Structure For Semiconductor Devices Using A Folded Over Flexible Substrate And Method Therefor
				
	458	  	7,170,150	  	01/30/07	  	Lead Frame For Semiconductor Package
				
	459	  	7,170,183	  	01/30/07	  	Wafer Level Stacked Package
				
	460	  	7,176,062	  	02/13/07	  	Lead-Frame Method And Assembly For Interconnecting Circuits Within A Circuit Module
				
	461	  	7,183,630	  	02/27/07	  	Lead Frame With Plated End Leads
				
	462	  	7,185,426	  	03/06/07	  	Method Of Manufacturing A Semiconductor Package
				
	463	  	7,190,062	  	03/13/07	  	Embedded Leadframe Semiconductor Package
				
	464	  	7,190,071	  	03/13/07	  	Semiconductor Package And Method For Fabricating The Same
				
	465	  	7,192,807	  	03/20/07	  	Wafer Level Package And Fabrication Method
				
	466	  	7,193,305	  	03/20/07	  	Memory Card ESC Substrate Insert
				
	467	  	7,199,359	  	04/03/07	  	Camera Module Fabrication Method Including Singulating A Substrate
				
	468	  	7,201,327	  	04/10/07	  	Memory Card And Its Manufacturing Method
				
	469	  	7,202,554	  	04/10/07	  	Semiconductor Package And Its Manufacturing Method
				
	470	  	7,211,471	  	05/01/07	  	Exposed Lead QFP Package Fabricated Through The Use Of A Partial Saw Process
				
	471	  	7,211,879	  	05/01/07	  	Semiconductor Package With Chamfered Corners And Method Of Manufacturing The Same
				
	472	  	7,211,900	  	05/01/07	  	Thin Semiconductor Package Including Stacked Dies
				
	473	  	7,214,326	  	05/08/07	  	Increased Capacity Leadframe And Semiconductor Package Using The Same
				
	474	  	7,217,991	  	05/15/07	  	Fan-In Leadframe Semiconductor Package
				
	475	  	7,220,915	  	05/22/07	  	Memory Card And Its Manufacturing Method
				
	476	  	7,227,236	  	06/05/07	  	Image Sensor Package And Its Manufacturing Method
				
	477	  	7,245,007	  	07/17/07	  	Exposed Lead Interposer Leadframe Package
				
	478	  	7,247,523	  	07/24/07	  	Two-Sided Wafer Escape Package
				
	479	  	7,253,503	  	08/07/07	  	Integrated Circuit Device Packages And Substrates For Making The Packages
				
	480	  	7,293,716	  	11/13/07	  	Secure Digital Memory Card Using Land Grid Array Structure
				
	481	  	7,297,562	  	11/20/07	  	Circuit-On-Foil Process For Manufacturing A Laminated Semiconductor Package Substrate Having Embedded Conductive Patterns
				
	482	  	7,312,103	  	12/25/07	  	Method For Making An Integrated Circuit Substrate Having Laser- Embedded Conductive Patterns
				
	483	  	7,317,245	  	01/08/08	  	Method For Manufacturing A Semiconductor Device Substrate
				
	484	  	7,321,162	  	01/22/08	  	Semiconductor Package Having Reduced Thickness









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	485	  	7,322,507	  	01/29/08	  	Transducer Assembly, Capillary And Wire Bonding Method Using The Same
				
	486	  	7,332,375	  	02/19/08	  	Method Of Making An Integrated Circuit Package
				
	487	  	7,332,712	  	02/19/08	  	Camera Module Fabrication Method Including The Step Of Removing A Lens Mount And Window From The Mold
				
	488	  	7,334,326	  	02/26/08	  	Method For Making An Integrated Circuit Substrate Having Embedded Passive Components
				
	489	  	7,335,986	  	02/26/08	  	Wafer Level Chip Scale Package
				
	490	  	RE40,112	  	02/26/08	  	Semiconductor Package And Method For Fabricating The Same
				
	491	  	7,342,303	  	03/11/08	  	Semiconductor Device Having RF Shielding And Method Therefor
				
	492	  	7,358,174	  	04/15/08	  	Methods Of Forming Solder Bumps On Exposed Metal Pads
				
	493	  	7,358,600	  	04/15/08	  	Interposer for Interconnecting Components In A Memory Card
				
	494	  	7,359,204	  	04/15/08	  	Multiple Cover Memory Card
				
	495	  	7,359,579	  	04/15/08	  	Image Sensor Package And Its Manufacturing Method
				
	496	  	7,361,533	  	04/22/08	  	Stacked Embedded Leadframe
				
	497	  	7,362,038	  	04/22/08	  	Surface Acoustic Wave (SAW) Device Package And Method For Packaging A SAW Device
				
	498	  	7,365,006	  	04/29/08	  	Semiconductor Package And Substrate Having Multi-Level Vias Fabrication Method
				
	499	  	7,375,975	  	05/20/08	  	Enhanced Durability Memory Card
				
	500	  	7,385,408	  	06/10/08	  	Apparatus and Method For Testing Integrated Circuit Devices Having Contacts on Multiple Surfaces
				
	501	  	7,399,661	  	07/15/08	  	Method For Making An Integrated Circuit Substrate Having Embedded Back-side Access Conductors And Vias
				
	502	  	7,408,254	  	08/05/08	  	Stack Land Grid Array Package And Method For Manufacturing The Same
				
	503	  	7,420,272	  	09/02/08	  	Two-Sided Wafer Escape Package
				
	504	  	7,425,750	  	09/16/08	  	Snap Lid Camera Module
				
	505	  	7,429,799	  	09/30/08	  	Land Patterns For A Semiconductor Stacking Structure And Method Therefor
				
	506	  	7,446,422	  	11/04/08	  	Wafer Level Chip Scale Package and Manufacturing Method For The Same
				
	507	  	7,459,349	  	12/02/08	  	Method Of Forming A Stack Of Semiconductor Packages
				
	508	  	7,459,776	  	12/02/08	  	Stacked Die Assembly Having Semiconductor Die Projecting Beyond Support
				
	509	  	7,473,584	  	01/06/09	  	Method For Fabricating A Fan-In Leadframe Semiconductor Package
				
	510	  	7,485,490	  	02/03/09	  	Method Of Forming A Stacked Semiconductor Package
				
	511	  	7,485,491	  	02/03/09	  	Secure Digital Memory Card Using Land Grid Array Structure
				
	512	  	7,485,952	  	02/03/09	  	Drop Resistant Bumpers For Fully Molded Memory Cards
				
	513	  	7,501,338	  	03/10/09	  	Semiconductor Package Substrate Fabrication Method
				
	514	  	7,507,603	  	03/24/09	  	Etch Singulated Semiconductor Package
				
	515	  	7,521,294	  	04/21/09	  	Lead Frame For Semiconductor Package
				
	516	  	7,535,085	  	05/19/09	  	Semiconductor Package Having Improved Adhesiveness And Ground Bonding
				
	517	  	7,548,430	  	06/16/09	  	Buildup Dielectric And Metallization Process And Semiconductor Package
				
	518	  	7,550,857	  	06/23/09	  	Stacked Redistributed Layer (RDL) Die Assembly Package
				
	519	  	7,554,194	  	06/30/09	  	Thermally Enhanced Semiconductor Package
				
	520	  	7,556,986	  	07/07/09	  	Tape Supported Memory Card Leadframe Structure
				
	521	  	7,560,804	  	07/14/09	  	Integrated Circuit Package And Method Making The Same
				
	522	  	7,564,122	  	07/21/09	  	Semiconductor Package And Method Of Making Using Leadframe Having Lead Locks To Secure Leads to Encapsulant
				
	523	  	7,572,681	  	08/11/09	  	Embedded Electronic Component Package
				
	524	  	7,576,401	  	08/18/09	  	Direct Glass Attached On Die Optical Module
				
	525	  	7,589,398	  	09/15/09	  	Embedded Metal Features Structure
				
	526	  	7,598,598	  	10/06/09	  	Offset Etched Corner Leads For Semiconductor Package
				
	527	  	7,609,461	  	10/27/09	  	Optical Module Having Cavity Substrate
				
	528	  	7,629,674	  	12/08/09	  	Shielded Package Having Shield Fence
				
	529	  	7,632,753	  	12/15/09	  	Wafer Level Package Utilizing Laser-Activated Dielectric Material









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	530	  	7,633,144	  	12/15/09	  	Semiconductor Package
				
	531	  	7,633,763	  	12/15/09	  	Double Mold Memory Card And Its Manufacturing Method
				
	532	  	7,633,765	  	12/15/09	  	Semiconductor Package Including A Top-Surface Metal Layer For Implementing Circuit Features
				
	533	  	7,652,361	  	01/26/10	  	Land Patterns For A Semiconductor Stacking Structure And Method Thereof
				
	534	  	7,670,962	  	03/02/10	  	Substrate Having Stiffener Fabrication Method
				
	535	  	7,671,457	  	03/02/10	  	Semiconductor Package Including Top-Surface Terminals For Mounting Another Semiconductor Package
				
	536	  	7,674,701	  	03/09/10	  	Methods Of Forming Metal Layers Using Multi-Layer Lift-Off Patterns
				
	537	  	7,675,180	  	03/09/10	  	Stacked Electronic Component Package Having Film-On-wire Spacer
				
	538	  	7,687,893	  	03/30/10	  	Semiconductor Package Having Leadframe With Exposed Anchor Pads
				
	539	  	7,687,899	  	03/30/10	  	Dual Laminate Package Structure With Embedded Elements
				
	540	  	7,691,745	  	04/06/10	  	Land Patterns For A Semiconductor Stacking Structure And Method Thereof
				
	541	  	7,692,286	  	04/06/10	  	Tow-Sided Fan-Out Wafer Escape Package
				
	542	  	7,714,431	  	05/11/10	  	Electronic Component Package Comprising Fan-Out And Fan-In Traces
				
	543	  	7,718,523	  	05/18/10	  	Solder Attach Film And Method Of Forming Solder Ball Using The Same
				
	544	  	7,719,845	  	05/18/10	  	Chamfered Memory Card Module And Method Of Making Same
				
	545	  	7,723,210	  	05/25/10	  	Direct-Write Wafer Level Chip Scale Package
				
	546	  	7,723,852	  	05/25/10	  	Stakced Semiconductor Package And Method Of making Same
				
	547	  	7,732,899	  	06/08/10	  	Etch Singulated Semiconductor Package
				
	548	  	7,737,542	  	06/15/10	  	Stackable Semiconductor Package
				
	549	  	7,745,910	  	06/29/10	  	Semiconductor Device Having RF Shielding And Method Therefor
				
	550	  	7,745,918	  	06/29/10	  	Package In Package (PIP)
				
	551	  	7,750,250	  	07/06/10	  	Blind Via Capture Pad Structure And Fabrication Method
				
	552	  	7,752,752	  	07/13/10	  	Embedded Circuit Pattern Fabrication Method And Structure
				
	553	  	7,755,164	  	07/13/10	  	Capacitor And Resistor Having Anodic Metal And Anodic Metal Oxide Structure
				
	554	  	7,755,176	  	07/13/10	  	Die-Mounting Substrate And Method Incorporating Dummy Traces For Improving Mounting Film Planarity
				
	555	  	7,768,135	  	08/03/10	  	Semiconductor Package With Fast Power-Up Cycle And Method Of Making Same
				
	556	  	7,777,351	  	08/17/10	  	Thin Stacked Interposer Package
				
	557	  	7,781,852	  	08/24/10	  	Membrane Die Attach Circuit Element Package And Method Therefor
				
	558	  	7,786,429	  	08/31/10	  	Camera Module With Window Mechanical Atachment
				
	559	  	7,808,084	  	10/05/10	  	Semiconductor Package With Half-Etched Locking Features
				
	560	  	7,808,105	  	10/05/10	  	Semiconductor Package And Fabricating Method Thereof
				
	561	  	7,810,695	  	10/12/10	  	Wire Bonding Machine Capable Of Removing Particles From Capillary And Cleaning Method Of Capillary Bottom Tip
				
	562	  	7,825,520	  	11/02/10	  	Stacked Redistribution Layer (RDL) Die Assembly Package
				
	563	  	7,829,990	  	11/09/10	  	Stackable Semiconductor Package Including Laminate Interposer
				
	564	  	7,832,097	  	11/16/10	  	Shielded Trace Structure And Fabrication Method
				
	565	  	7,837,120	  	11/23/10	  	Modular Memory Card And Method Of Making Same
				
	566	  	7,839,136	  	11/23/10	  	System And Method For Testing Radio Frequency (RF) Shielding Defects
				
	567	  	7,842,541	  	11/30/10	  	Ultra Thin Package And Fabrication Method
				
	568	  	7,843,052	  	11/30/10	  	Semiconductor Devices And Fabricating Methods Thereof
				
	569	  	7,843,072	  	11/30/10	  	Semiconductor ackage And Fabricating Method Thereof
				
	570	  	7,847,386	  	12/07/10	  	Reduced Size Stackaed Semiconductor Package And Method Of Making The Same
				
	571	  	7,847,392	  	12/07/10	  	Semiconductor Device Including Leadframe With Increased I/O
				
	572	  	7,847,398	  	12/07/10	  	A Semiconductor Package And Method Of Manufacturing
				
	573	  	7,851,894	  	12/14/10	  	A System And Method For Shielding Of Package On Package (PoP) Assemblies









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	574	  	7,859,107	  	12/28/10	  	Solder Attach Film And Assembly
				
	575	  	7,859,116	  	12/28/10	  	Exposed Metal Bezel For Use In Sensor Devices And Method Therefor
				
	576	  	7,859,119	  	12/28/10	  	Stacked Flip Chip Die Assembly
				
	577	  	7,863,723	  	01/04/11	  	Adhesive On Wire Stacked Semiconductor Package
				
	578	  	7,871,899	  	01/18/11	  	Methods Of Forming Back Side Layers For Thinned Wafers
				
	579	  	7,872,341	  	01/18/11	  	Semiconductor Device
				
	580	  	7,872,343	  	01/18/11	  	Dual Laminate Package Structure With Embedded Elements
				
	581	  	7,875,963	  	01/25/11	  	Semiconductor Device Including Leadframe Having Power Bars And Increased I/O
				
	582	  	7,898,066	  	03/01/11	  	Semiconductor Device Having EMI Shielding And Method Therefor
				
	583	  	7,898,093	  	03/01/11	  	Exposed Die Overmolded Flip Chip Package and Fabrication Method
				
	584	  	7,902,660	  	03/08/11	  	Substrate For Semiconductor Device And Manufacturing Method Thereof
				
	585	  	7,906,845	  	03/15/11	  	Semicondcutor Device Having Reduced Thermal Interface Material (TIM) Degradation And Method Therefor
				
	586	  	7,906,855	  	03/15/11	  	Stacked Semiconductor Package And Method Of Making Same
				
	587	  	7,911,017	  	03/22/11	  	Direct Glass Attach On Die Optical Module
				
	588	  	7,911,037	  	03/22/11	  	Method And Structure For Creating Embedded Metal Features
				
	589	  	7,915,715	  	03/29/11	  	System And Method To Privide RF Shielding For MEMS Microphone Package
				
	590	  	7,919,853	  	04/05/11	  	Semiconductor Package And Fabrication Method Thereof
				
	591	  	7,923,645	  	04/12/11	  	Metal Etch Stop Fabrication Method And Structure
				
	592	  	7,928,542	  	04/19/11	  	Leadframe For Semiconductor Package
				
	593	  	7,932,170	  	04/26/11	  	Flip Chip Bump Structure And Fabrication Method
				
	594	  	7,932,595	  	04/26/11	  	Electronic Component Package Comprising Fan-Out And Traces
				
	595	  	7,932,615	  	04/26/11	  	Electronic Devices Including Solder Bumps On Compliant Dielectric Layers
				
	596	  	7,936,033	  	05/03/11	  	Micro-Optical Device Packaging System
				
	597	  	7,938,308	  	05/10/11	  	Wire Bonder For Improved Bondability Of A Conductive Wire And Method Therefor
				
	598	  	7,944,043	  	05/17/11	  	A Semiconductor Device Having Improved Contact Interface Reliability And Method Therefor
				
	599	  	7,951,697	  	05/31/11	  	Embedded Die Metal Etch Stop Fabrication Method And Structure
				
	600	  	7,956,453	  	06/07/11	  	Semiconductor Package With Patterning Layer And Method Of Making Same
				
	601	  	7,958,626	  	06/14/11	  	Embedded Passive Component Network Substrate And Fabrication Method
				
	602	  	7,960,818	  	06/14/11	  	Conformal Shiled On Punch QFN Semiconductor Package
				
	603	  	7,960,827	  	06/14/11	  	Thermal Via Heat Spreader Package And Method
				
	604	  	7,968,998	  	06/28/11	  	Side Leaded, Bottom Exposed Pad And Bottom Exposed Lead Fusion Quad Flat Semiconductor Package
				
	605	  	7,977,163	  	07/12/11	  	Embedded Electronic Component Package Fabrication Method
				
	606	  	7,977,774	  	07/12/11	  	Fusion Quad Flat Semiconductor Package
				
	607	  	7,977,783	  	07/12/11	  	Wafer Level Chip Size Package And Method Of Manufacturing The Same
				
	608	  	7,982,297	  	07/19/11	  	Stackable Semiconductor Package Having Partially Exposed Semiconductor Die And Method Of Fabricating Of The Same
				
	609	  	7,982,298	  	07/19/11	  	Package In Package Semiconductor Device
				
	610	  	7,982,306	  	07/19/11	  	Stackable Semiconductor Package
				
	611	  	7,982,316	  	07/19/11	  	Semiconductor Package And Fabricating Method Thereof
				
	612	  	7,989,933	  	08/02/11	  	Increased I/O Semiconductor Package And Method Of Making Same
				
	613	  	7,994,043	  	08/09/11	  	Lead Free Alloy Bump Structure And Fabrication Method
				
	614	  	7,994,045	  	08/09/11	  	Bumped Chip Package Fabrication Method And Structure
				
	615	  	7,999,371	  	08/16/11	  	Heat Spreader Package And Method
				
	616	  	8,004,078	  	08/23/11	  	Adhesive Composite For Semiconductor Device
				
	617	  	8,008,753	  	08/30/11	  	System And Method To Reduce Shorting Of Radis Frequency (RF) Shielding
				
	618	  	8,008,758	  	08/30/11	  	Semiconductor Device With Increased I/O Leadframe









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	619	  	8,012,868	  	09/06/11	  	Semiconductor Device Having EMI Shielding And Method Therefor
				
	620	  	8,017,436	  	09/13/11	  	Thin Substrate Fabrication Method And Structure
				
	621	  	8,018,068	  	09/13/11	  	Semiconductor Package Including A Top-Surface Metal Layer For Implementing Circuit Features
				
	622	  	8,018,072	  	09/13/11	  	Semiconductor Package Having A Heat Spreader With An Exposed Exterior Surface And A Top Mold Gate
				
	623	  	8,022,521	  	09/20/11	  	Package Failure Prognostic Structure And Method
				
	624	  	8,026,587	  	09/27/11	  	Semicondcutor Package Including Top-Surface Terminals For Mounting Another Semiconductor Package
				
	625	  	8,026,589	  	09/27/11	  	Reducted Profile Stackable Semiconductor Device
				
	626	  	8,030,722	  	10/04/11	  	Peversible Top/Bottom MEMS Package
				
	627	  	8,058,715	  	11/15/11	  	Package In Package Device For RF Transceiver Module
				
	628	  	8,058,726	  	11/15/11	  	Semiconductor Device Having Redistribution Layer
				
	629	  	8,067,821	  	11/29/11	  	Flat Semiconductor Package With Half Package Molding
				
	630	  	8,072,050	  	12/06/11	  	Semiconductor Device With Increased I/O Leadframe Including Passive Device
				
	631	  	8,072,058	  	12/06/11	  	Semicondcutor Package Having A Plurarity Input/Output Members
				
	632	  	8,072,083	  	12/06/11	  	Stacked Electronic Component Package Having Film-On-wire Spacer
				
	633	  	8,084,868	  	12/27/11	  	Semiconductor Package With Fast Power-Up Cycle And Method Of Making Same
				
	634	  	8,089,141	  	01/03/12	  	Semiconductor Package Having Leadframe With Exposed Anchor Pads
				
	635	  	8,089,145	  	01/03/12	  	Semicondcutor Device Including Increased Capacity Leadframe
				
	636	  	8,089,148	  	01/03/12	  	Circuit Board And Semiconductor Device Having The Same
				
	637	  	8,089,159	  	01/03/12	  	Semiconductor Package With Increased I/O Density And Method Of Making The Same
				
	638	  	8,093,691	  	01/10/12	  	System And Method For RF Shielding Of A Semiconductor Package
				
	639	  	8,102,032	  	01/24/12	  	System And Method For Confortment Shielding Of Stacked Packages
				
	640	  	8,102,037	  	01/24/12	  	Leadframe For Semiconductor Package
				
	641	  	8,110,909	  	02/07/12	  	Semicondcutor Package Including Top-Surface Terminals For Mounting Another Semiconductor Package
				
	642	  	8,115,283	  	02/14/12	  	Reversible Top/Bottom MEMS Package
				
	643	  	8,119,455	  	02/21/12	  	Wafer Level Package Fabrication Method
				
	644	  	8,125,064	  	02/28/12	  	Increased I/O Semiconductor Package And Method Of Making Same
				
	645	  	8,129,824	  	03/06/12	  	Shielding For A Semiconductor Package
				
	646	  	8,129,849	  	03/06/12	  	Method Of Making Semiconductor Package With Adhering Portion
				
	647	  	8,143,727	  	03/27/12	  	Adhesive On Wire Stacked Semiconductor Package
				
	648	  	8,154,111	  	04/10/12	  	Near Chip Size Semiconductor Package
				
	649	  	8,176,628	  	05/15/12	  	Protruding Post Substrate Package Structure And Method
				
	650	  	8,183,678	  	05/22/12	  	Semiconductor Device Having An Interposer
				
	651	  	8,183,683	  	05/22/12	  	Semiconductor Device And Fabricating Method Thereof
				
	652	  	8,184,453	  	05/22/12	  	Increased Capacity Semiconductor Package
				
	653	  	8,188,579	  	05/29/12	  	Semicondcutor Device Including Leadframe Having Power Bars and Increased I/O
				
	654	  	8,188,584	  	05/29/12	  	Direct-Write Wafer Level Chip Scale Package
				
	655	  	8,193,624	  	06/05/12	  	Semiconductor Device Having Improved Contact Interface Reliability And Method Therefor
				
	656	  	8,198,738	  	06/12/12	  	Structure Of Bond Pad For Semiconductor Die And Method Therefor
				
	657	  	8,199,518	  	06/12/12	  	Top Feature Package And Method
				
	658	  	8,203,203	  	06/19/12	  	Stacked Redistribution Layer (RDL) Die Assembly Package
				
	659	  	8,207,022	  	06/26/12	  	Exposed Die Overmolded Flip Chip Package Method
				
	660	  	8,217,507	  	07/10/12	  	Edge Mount Semicondcutor Package
				
	661	  	8,222,538	  	07/17/12	  	Stackable Via Package And Method
				
	662	  	8,227,338	  	07/24/12	  	Semiconductor Package Including A Top-Surface Metal Layer For Implementing Circuit Features
				
	663	  	8,227,905	  	07/24/12	  	Stackable Semiconductor Package
				
	664	  	8,227,921	  	07/24/12	  	Semiconductor Package With Increased I/O Density And Method Of Making The Same









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	665	  	8,237,460	  	08/07/12	  	Pogo Pin Inserting Device For Testing Semiconductor Devices And Method Therefor
				
	666	  	8,258,613	  	09/04/12	  	Semiconductor Memory Card
				
	667	  	8,263,486	  	09/11/12	  	Bumped Chip Package Fabrication Method And Structure
				
	668	  	8,283,767	  	10/09/12	  	Dual Laminate Package Structure With Embedded Elements
				
	669	  	8,294,265	  	10/23/12	  	Semiconductor Device For Improving Electrical And Mechanical Connectivity Of Conductive Pillers And Method Therefor
				
	670	  	8,294,276	  	10/23/12	  	Semiconductor Device And Fabricating Method Thereof
				
	671	  	8,298,866	  	10/30/12	  	Wafer Level Package And Fabricaton Method
				
	672	  	8,299,602	  	10/30/12	  	Semiconductor Device Including Leadframe With Increased I/O
				
	673	  	8,299,610	  	10/30/12	  	Semiconductor Device Having RF Shielding And Method Therefor
				
	674	  	8,300,423	  	10/30/12	  	Stackable Treated Via Package And Method
				
	675	  	8,304,866	  	11/06/12	  	Fusion Quad Flat Semiconductor Package
				
	676	  	8,316,536	  	11/27/12	  	Multi-Level Circuit Substrate And Fabrication Method
				
	677	  	8,318,287	  	11/27/12	  	Integrated Circuit Packae And Method Of Making The Same
				
	678	  	8,319,338	  	11/27/12	  	Thin Stacked Interposer Package
				
	679	  	8,322,030	  	12/04/12	  	Circuit-On-Foil Process For Manufacturing A Laminated Semiconductor Package Substrate Having Embedded Conductive Patterns
				
	680	  	8,323,771	  	12/04/12	  	Straight Conductor Blind Via Capture Pad Structure And Fabrication Method
				
	681	  	8,324,511	  	12/04/12	  	Through Via Nub Reveal Method And Structure
				
	682	  	8,334,590	  	12/18/12	  	Semiconductor Device Having Insulating And Interconnection Layers
				
	683	  	8,337,657	  	12/25/12	  	Mechanical Tape Separation Package And Method
				
	684	  	8,338,229	  	12/25/12	  	Stackable Plasma Cleaned Via Package And Method
				
	685	  	8,341,835	  	01/01/13	  	Buildup Dielectric Layer Having Metallization Pattern Semiconductor Package Fabrication Method
				
	686	  	8,354,747	  	01/15/13	  	Conductive Polymer Lid For A Sensor Package And Method Therefor
				
	687	  	8,362,597	  	01/29/13	  	Shielded Package Having Shield Lid
				
	688	  	8,362,598	  	01/29/13	  	Semicondcutor Device With Electrmagnetic Interface Shielding
				
	689	  	8,362,612	  	01/29/13	  	Semiconductor Device And Manufacturing Method Thereof
				
	690	  	8,365,611	  	02/05/13	  	Bend Test Method And Apparatus For Flip Chip Devices
				
	691	  	8,368,194	  	02/05/13	  	Exposed Die Overmolded Flip Chip Package
				
	692	  	8,383,950	  	02/26/13	  	Metal Etch Stop Fabrication Method And Structure
				
	693	  	8,390,116	  	03/05/13	  	Flip Chip Bump Structure And Fabrication Method
				
	694	  	8,390,130	  	03/05/13	  	Through Via Recessed Reveal Structure And Method
				
	695	  	8,399,348	  	03/19/13	  	A Semiconductor Device For Improving Electrical And Mechanical Connectivity Of Conductive Pillers And Method Therefor
				
	696	  	8,410,585	  	04/02/13	  	Leadframe And Semiconductor Package Made Using The Leadframe
				
	697	  	8,426,966	  	04/23/13	  	Bumped Chip Package
				
	698	  	8,432,022	  	04/30/13	  	Shielded Embedded Elctronic Compoent Subsrate Fabrication Method
				
	699	  	8,432,023	  	04/30/13	  	Increased I/O Leadframe And Semiconductor Package Including Same
				
	700	  	8,440,554	  	05/14/13	  	Through Via Connected Backside Embedded Circuit Features Structure And Method
				
	701	  	8,441,110	  	05/14/13	  	Side Leaded, Bottom Exposed Pad And Bottom Exposed Lead Fusion Quad Flat Semiconductor Package
				
	702	  	8,441,120	  	05/14/13	  	Heat Spreader Package And Method
				
	703	  	8,441,123	  	05/14/13	  	Semiconductor Device With Metal Dam And Fabrication Method
				
	704	  	8,445,984	  	05/21/13	  	Micro-Optical Device Packaging System
				
	705	  	8,446,017	  	05/21/13	  	Stackable Wafer Level Package And Fabricating Method Thereof
				
	706	  	8,466,545	  	06/18/13	  	Stackable Semiconductor Package
				
	707	  	8,471,154	  	06/25/13	  	Stackable Variable Height Via Package And Method
				
	708	  	8,476,748	  	07/02/13	  	Exposed Die Overmolded Flip Chip Package and Fabrication Method
				
	709	  	8,482,134	  	07/09/13	  	Stackable Package And Method
				
	710	  	8,486,764	  	07/16/13	  	Wafer Level Package And Fabricaton Method
				
	711	  	8,487,420	  	07/16/13	  	Package In Package Semiconductor Device With Film Over Wire
				
	712	  	8,487,445	  	07/16/13	  	Semiconductor Device Having Through Electrodes Protruding From Dielectric Layer









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	713	  	8,492,893	  	07/23/13	  	Semiconductor Device Capable Of Preventing Dielectric Layer From Cracking
				
	714	  	8,501,543	  	08/06/13	  	Direct-Write Wafer Level Chip Scale Package
				
	715	  	8,502,361	  	08/06/13	  	Concentrated Photovoltaic Receiver Package With Stacked Internal Support Features
				
	716	  	8,508,023	  	08/13/13	  	System And Method For Lowering Contact Resistance Of The Radio Frequency (RF) Shield To Ground
				
	717	  	8,525,318	  	09/03/13	  	Semiconductor Device And Fabricating Method Thereof
				
	718	  	8,525,322	  	09/03/13	  	Semiconductor Package Having A Plurality Of Input/Output Members
				
	719	  	8,535,961	  	09/17/13	  	Light Emitting Diode (LED) Package And Method
				
	720	  	8,536,458	  	09/17/13	  	Fine Pitch Copper Pillar Package And Method
				
	721	  	8,536,462	  	09/17/13	  	Flex Circuit Package And Method
				
	722	  	8,536,663	  	09/17/13	  	Metal Mesh Lid MEMS Package And Method
				
	723	  	8,541,260	  	09/24/13	  	Exposed Die Overmolded Flip Chip Package and Fabrication Method
				
	724	  	8,551,820	  	10/08/13	  	Routable Single Layer Substrate And Semiconductor Package Including Same
				
	725	  	8,552,517	  	10/08/13	  	Conductive Paste And Mold For Electrical Connection Of Photovoltaic Die To Substrate
				
	726	  	8,552,539	  	10/08/13	  	Shielded Package Having Shield Lid
				
	727	  	8,552,548	  	10/08/13	  	Conductive Pad On Producing Through Electrode Semiconductor Device And Method Of Manufacturing
				
	728	  	8,552,556	  	10/08/13	  	Wafer Level Fan Out Package And Method Of Fabricating Wafer Level Fan Out Package
				
	729	  	8,552,557	  	10/08/13	  	Electronic Component Package Fabrication Method And Structure
				
	730	  	8,557,629	  	10/15/13	  	Semiconductor Device Having Overlapped Via Apertures
				
	731	  	8,558,365	  	10/15/13	  	Package In Package Device For RF Transceiver Module
				
	732	  	8,564,114	  	10/22/13	  	Semiconductor Package Thermal Tape Window Frame For Heat Sink Attachment
				
	733	  	8,575,742	  	11/05/13	  	Semiconductor Device With Increased I/O Leadframe Including Power Bars
				
	734	  	8,604,356	  	12/10/13	  	Electronic Assembly Having Increased Standoff Height
				
	735	  	8,604,625	  	12/10/13	  	Semiconductor Device Having Conductive Pads To Prevent Solder Reflow
				
	736	  	8,618,619	  	12/31/13	  	Top Port With Interposed MEMS Microphone Package And Method
				
	737	  	8,618,658	  	12/31/13	  	Semiconductor Device And Fabricating Method Thereof
				
	738	  	8,623,753	  	01/07/14	  	Stackable Protruding Via Package And Method
				
	739	  	8,629,546	  	01/14/14	  	Stacked Redistribution Layer (RDL) Die Assembly Package
				
	740	  	8,633,575	  	01/21/14	  	IC Package With Integrated Electrostatic Discharge Protection
				
	741	  	8,633,598	  	01/21/14	  	Underfill Contacting Stacking Balls Package Fabrication Method And Structure
				
	742	  	8,643,177	  	02/04/14	  	Wafers Including Patterned Back Side Layers Thereon
				
	743	  	8,648,450	  	02/11/14	  	Semiconductor Device Including Leadframe With A Combination Of Leads And Lands
				
	744	  	8,653,674	  	02/18/14	  	Electronic Component Package Fabrication Method And Structure
				
	745	  	8,664,090	  	03/04/14	  	Electronic Component Package Fabrication Method And Structure
				
	746	  	8,671,565	  	03/18/14	  	Blind Via Capture Pad Structure And Fabrication Method
				
	747	  	8,674,485	  	03/18/14	  	Semiconductor Device Including Leadframe With Downsets
				
	748	  	8,680,656	  	03/25/14	  	Leadframe Structure For Concentrated Photovoltaic Receiver Package
				
	749	  	8,691,632	  	04/08/14	  	Wafer Level Package And Fabricaton Method
				
	750	  	8,704,368	  	04/22/14	  	Stackable Via Package And Method
				
	751	  	8,704,369	  	04/22/14	  	Flip Chip Bump Structure And Fabrication Method
				
	752	  	8,710,649	  	04/29/14	  	Wafer Level Package And Fabricaton Method
				
	753	  	8,717,775	  	05/06/14	  	Fingerprint Sensor Package And Method
				
	754	  	8,729,682	  	05/20/14	  	Conformal Shiled On Punch QFN Semiconductor Package
				
	755	  	8,729,710	  	05/20/14	  	Semiconductor Package With Patterning Layer And Method Of Making Same
				
	756	  	8,753,730	  	06/17/14	  	Mechanical Tape Separation Package
				
	757	  	8,786,075	  	07/22/14	  	Electric Circuit With Component-Accommodating Lid
				
	758	  	8,791,501	  	07/29/14	  	Integrated Passive Device Structure And Method









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	759	  	8,796,072	  	08/05/14	  	Method And System For A Semiconductor Device Package With A Die- To-Die First Bond
				
	760	  	8,796,561	  	08/05/14	  	Fan Out Build Up Substrate Stackable Package And Method
				
	761	  	8,802,494	  	08/12/14	  	Method Of Fabricating A Semiconductor Device Having An Interposer
				
	762	  	8,802,499	  	08/12/14	  	Methods For Temporary Wafer Molding For Chip-On-Wafer Assembly
				
	763	  	8,809,677	  	08/19/14	  	Molded Light Guide For Concentrated Photovoltaic Receiver Module
				
	764	  	8,823,152	  	09/02/14	  	Semiconductor Device With Increased I/O Leadframe
				
	765	  	8,826,531	  	09/09/14	  	Method For Making An Integrated Circuit Substrate Having Laminated Laser-Embedded Circuit Layers
				
	766	  	8,828,802	  	09/09/14	  	Wafer Level Chip Scale Package And Method Of Fabricating Wafer Level Chip Scale Package
				
	767	  	8,829,678	  	09/09/14	  	Semiconductor Package And Method For Manufacturing The Same
				
	768	  	8,836,115	  	09/16/14	  	Stakced Inverted Flip Chip Package And Fabrication Method
				
	769	  	8,841,547	  	09/23/14	  	Concentrated Photovoltaic Receiver Package With Built-in Connector
				
	770	  	8,847,372	  	09/30/14	  	Exposed Die Overmolded Flip Chip Package and Fabrication Method
				
	771	  	8,853,836	  	10/07/14	  	Integrated Circuit Packae And Method Of Making The Same
				
	772	  	8,866,002	  	10/21/14	  	Through Wafer Via Structure For Concentrated Photovoltaic Cells
				
	773	  	8,866,004	  	10/21/14	  	Frame Interconnect For Concentrated Photovoltaic Module
				
	774	  	8,866,278	  	10/21/14	  	Semiconductor Device With Increased I/O And Method Of Making Same
				
	775	  	8,872,329	  	10/28/14	  	Extended Landing Pad Substrate Package Structure And Method
				
	776	  	8,878,527	  	11/04/14	  	Magnetic Field Simulation For Testing Singulated Or Multi-Site Strip Semiconductor Device And Method Therefor
				
	777	  	8,890,329	  	11/18/14	  	Semiconductor Device
				
	778	  	8,890,337	  	11/18/14	  	Column And Stacking Balls Package Fabricating Method And Structure
				
	779	  	8,900,995	  	12/02/14	  	Semiconductor Device And Manufacturing Method Thereof
				
	780	  	8,912,051	  	12/16/14	  	Design And Method For Controlling Molding Compound Geometry Around A Semiconductor Die
				
	781	  	8,921,955	  	12/30/14	  	Semiconductor Device With Micro Electromechanical System Die
				
	782	  	8,937,381	  	01/20/15	  	Thin Stackable Package And Method
				
	783	  	8,940,587	  	01/27/15	  	Die Seal Design And Method And Apparatus For Integrated Circuit Production
				
	784	  	8,941,050	  	01/27/15	  	Processing Soldebrace Using Light Wavelength Filter
				
	785	  	8,941,250	  	01/27/15	  	Electronic Component Package Fabrication Method And Structure
				
	786	  	8,946,883	  	02/03/15	  	Wafer Level Fan-Out Package With A Fiducial Die
				
	787	  	8,946,886	  	02/03/15	  	Shielded Electronic Component Package And Method
				
	788	  	8,946,891	  	02/03/15	  	Mushroom Shaped Bump On Repassivation
				
	789	  	8,952,522	  	02/10/15	  	Wafer Level Package And Fabricaton Method
				
	790	  	8,963,301	  	02/24/15	  	Integrated Circuit Packae And Method Of Making The Same
				
	791	  	8,969,192	  	03/03/15	  	Low Stress Substrate And Formation Method
				
	792	  	8,981,537	  	03/17/15	  	Reversible Top/Bottom MEMS Package
				
	793	  	8,981,550	  	03/17/15	  	Semiconductor Pacakge And Method For Manufacturing The Same
				
	794	  	8,981,572	  	03/17/15	  	Conductive Pad On Producing Through Electrode Semiconductor Device And Method Of Manufacturing
				
	795	  	8,982,577	  	03/17/15	  	Electronic Component Package Having Bleed Channel Structure And Method
				
	796	  	8,986,806	  	03/24/15	  	Warpage Control Stiffner Ring Package Fabrication Method
				
	797	  	8,987,050	  	03/24/15	  	Method And System For Backside Dielectric Patterning For Wafer Warpage And Stress Control
				
	798	  	8,994,860	  	03/31/15	  	Molded Image Sensor Package And Method
				
	799	  	9,000,586	  	04/07/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	800	  	9,012,789	  	04/21/15	  	Stackable Via Package And Method
				
	801	  	9,013,011	  	04/21/15	  	Stacked And Staggered Die MEMS Package And Method
				
	802	  	9,018,741	  	04/28/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	803	  	9,018,743	  	04/28/15	  	Semiconductor Device
				
	804	  	9,025,301	  	05/05/15	  	Wire Fence Fingerprint Sensor Package And Fabrication Method
				
	805	  	9,029,962	  	05/12/15	  	Molded Cavity Sbstrate MEMS Package Fabrication Method And Structure









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	806	  	9,029,992	  	05/12/15	  	Electronic Package Structure Having Exposed Lands And Method
				
	807	  	9,040,349	  	05/26/15	  	Method And System For A Semiconductor Device Package With A Die To Interposer Wafer First Bond
				
	808	  	9,041,229	  	05/26/15	  	Merged Fiducial For Semiconductor Packages
				
	809	  	9,048,125	  	06/02/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	810	  	9,048,241	  	06/02/15	  	Semiconductor Device Utilizing Redistribution Layers To Couple Stakced Die
				
	811	  	9,048,298	  	06/02/15	  	Backside Warpage Control Structure And Fabrication Method
				
	812	  	9,054,089	  	06/09/15	  	Lead Frame Package And Method For Manufacturing The Same
				
	813	  	9,054,117	  	06/09/15	  	Wafer Level Package And Fabricaton Method
				
	814	  	9,056,765	  	06/16/15	  	Semiconductor Pacakge And Manufacturing Method Thereof
				
	815	  	9,060,430	  	06/16/15	  	Shielded Trace Structure And Fabrication Method
				
	816	  	9,061,884	  	06/23/15	  	Intergrated Circuit With Efficient MEMS Architecture
				
	817	  	9,070,675	  	06/30/15	  	Plating Structure For Wafer Level Packages
				
	818	  	9,082,833	  	07/14/15	  	Through Via Recessed Reveal Structure And Method
				
	819	  	9,117,684	  	08/25/15	  	Semicondcutor Package Having A Plurarity Of Input/Output Members
				
	820	  	9,123,543	  	09/01/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	821	  	9,123,718	  	09/01/15	  	Shielded Package Having Shield Lid
				
	822	  	9,129,873	  	09/08/15	  	Package Of Finger Print Sensor And Fabricating Method Thereof
				
	823	  	9,129,943	  	09/08/15	  	Embedded Component Package And Fabrication Method
				
	824	  	9,129,975	  	09/08/15	  	Method Of Forming A Thin Substrate Chip Scale Package Device And Structure
				
	825	  	9,136,159	  	09/15/15	  	Method And System For A Semiconductor Device Package With A Die- To-Packaging Substrate First Bond
				
	826	  	9,153,543	  	10/06/15	  	Shielding Technique For Semiconductor Package Including Metal Lid And Metalized Contact Area
				
	827	  	9,159,625	  	10/13/15	  	Semiconductor Device
				
	828	  	9,159,672	  	10/13/15	  	Through Via Connected Backside Embedded Circuit Features Structure And Method
				
	829	  	9,162,871	  	10/20/15	  	Metal Mesh Lid MEMS Package And Method
				
	830	  	9,171,812	  	10/27/15	  	A Semiconductor Device Having Conductive Pads To Prevent Solder Reflow And Method Therefor
				
	831	  	9,177,932	  	11/03/15	  	Semiconductor Device Having Overlapped Via Apertures
				
	832	  	9,184,118	  	11/10/15	  	Micro Lead Frame Structure Having Reinforcing Portions And Method
				
	833	  	9,184,148	  	11/10/15	  	Semiconductor Package And Method Therefor
				
	834	  	9,190,370	  	11/17/15	  	Semiconductor Device Utilizing Redistribution Layers To Couple Stakced Die
				
	835	  	9,196,601	  	11/24/15	  	Semiconductor Device
				
	836	  	9,214,434	  	12/15/15	  	Fan-Out Semiconductor Package
				
	837	  	9,219,042	  	12/22/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	838	  	9,224,676	  	12/29/15	  	Integrated Circuit Packae And Method Of Making The Same
				
	839	  	9,230,883	  	01/05/16	  	Trace Stacking Structure And Method
				
	840	  	9,245,862	  	01/26/16	  	Electronic Component Package Fabricating Method And Structure
				
	841	  	9,269,872	  	02/23/16	  	Molded Electronic Package Geometry To Control Warpage And Die Stress
				
	842	  	9,275,939	  	03/01/16	  	Semiconductor Device Including Leadframe With A Combination Of Leads And Lands And Method
				
	843	  	9,287,229	  	03/15/16	  	Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-Photosensitive Passivation Layers
				
	844	  	9,293,398	  	03/22/16	  	Land Structure For Semiconductor Package And Method Therefor
				
	845	  	9,293,403	  	03/22/16	  	Semiconductor Package With Improved Redistribution Layer Design And Fabricating Method Thereof
				
	846	  	9,324,614	  	04/26/16	  	Through Via Nub Reveal Method And Structure
				
	847	  	9,332,164	  	05/03/16	  	Molded Semiconductor Package With Snap Lid
				
	848	  	9,337,137	  	05/10/16	  	Method And System For Solder Shielding Of Ball Grid Arrays
				
	849	  	9,343,427	  	05/17/16	  	Manufacturing Method Of Semiconductor Device And Semiconductor Device Manufactured Thereby









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	850	  	9,346,668	  	05/24/16	  	Molded Cavity Substrate MEMS Package Fabrication Method And Structure
				
	851	  	9,349,613	  	05/24/16	  	Electronic Package With Embedded Materials In A Molded Structure To Control Warpage And Stress
				
	852	  	9,349,681	  	05/24/16	  	Method And System For A Semiconductor Device Package With A Die- To-Packaging Substrate First Bond
				
	853	  	9,355,981	  	05/31/16	  	Semiconductor Device
				
	854	  	9,359,191	  	06/07/16	  	Reversible Top/Bottom MEMS Package
				
	855	  	9,362,209	  	06/07/16	  	Shielding Technique For Semiconductor Package Including Metal Lid
				
	856	  	9,362,210	  	06/07/16	  	Leadframe And Semiconductor Package Made Using The Leadframe
				
	857	  	9,362,437	  	06/07/16	  	Concentrated Photovoltaic Module With Improved Optical Light Guide Assembly
				
	858	  	9,367,712	  	06/14/16	  	High Density Memory Card Using Folded Flex
				
	859	  	9,368,361	  	06/14/16	  	Method Of Forming A Semiconductor Device
				
	860	  	9,391,043	  	07/12/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	861	  	9,406,638	  	08/02/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	862	  	9,406,639	  	08/02/16	  	Semiconductor Packge And Manufacturing Method Thereof
				
	863	  	9,406,645	  	08/02/16	  	Wafer Level Package And Fabricaton Method
				
	864	  	9,412,729	  	08/09/16	  	Semiconductor Package And Fabricating Method Thereof
				
	865	  	9,418,922	  	08/16/16	  	Semiconductor Device With Reduced Thickness
				
	866	  	9,418,942	  	08/16/16	  	Semiconductor Device
				
	867	  	9,420,378	  	08/16/16	  	Top Port MEMS Microphone Package And Method
				
	868	  	9,431,323	  	08/30/16	  	Conductive Pad On Producing Through Electrode
				
	869	  	9,431,334	  	08/30/16	  	Semiconductor Device Having Single Layer Substrate And Method
				
	870	  	9,431,447	  	08/30/16	  	Package Of Finger Print Sensor And Fabricating Method Thereof
				
	871	  	9,433,117	  	08/30/16	  	Shield Lid Interconnect Package And Method
				
	872	  	9,437,575	  	09/06/16	  	Semiconductor Device Package Formed In a Chip-On-Wafer Last Process Using Thin Film Adhesives
				
	873	  	9,449,890	  	09/20/16	  	Method For Temporary Bussing Of Semiconductor Package Substrates
				
	874	  	9,449,946	  	09/20/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	875	  	9,462,690	  	10/04/16	  	Fine Pitch Copper Pillar Package And Method
				
	876	  	9,462,704	  	10/04/16	  	Extended Landing Pad Substrate Package Structure And Method
				
	877	  	9,466,545	  	10/11/16	  	Semiconductor Package In Package
				
	878	  	9,466,580	  	10/11/16	  	Semiconductor Package And Manufacturing Method Thereof
				
	879	  	9,472,494	  	10/18/16	  	Lead Frame Semiconductor Device
				
	880	  	9,478,517	  	10/25/16	  	Electronic Device Package Structure And Method Fabricating The Same
				
	881	  	9,484,291	  	11/01/16	  	Robust Pillar Structure Structure For Semiconductor Device Contacts
				
	882	  	9,484,331	  	11/01/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	883	  	9,490,231	  	11/08/16	  	Manufacturing Method of Semiconductor Device And Semiconductor Device Thereof
				
	884	  	9,496,210	  	11/15/16	  	Stackable Package And Method
				
	885	  	9,502,375	  	11/22/16	  	Semiconductor Device With Plated Pillars And Leads
				
	886	  	9,502,392	  	11/22/16	  	Semiconductor Device With Embedded Semiconductor Die And Substrate- To-Substrate Interconnects
				
	887	  	9,508,631	  	11/29/16	  	Semiconductor Device Including Leadframe With A Combination Of Leads And Lands And Method
				
	888	  	9,510,120	  	11/29/16	  	Apparatus And Method For Testing Sound Transducers
				
	889	  	9,513,254	  	12/06/16	  	Microfluidic Sensor Package Structure And Method
				
	890	  	9,524,906	  	12/20/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	891	  	9,536,858	  	01/03/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	892	  	9,543,235	  	01/10/17	  	Semiconductor Package And Method Therefor
				
	893	  	9,543,242	  	01/10/17	  	Semiconductor Package And Fabricating Method Thereof
				
	894	  	9,552,999	  	01/24/17	  	Packaged Electronic Device Having Reduced Parastic Effects And Method
				
	895	  	9,553,041	  	01/24/17	  	Semicondcutor Device Package And Manufacturing Method Thereof
				
	896	  	9,559,075	  	01/31/17	  	Semiconductor Product With Interlocking Metal-To-Metal Bonds And Method For Manufacturing Thereof









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	897	  	9,565,774	  	02/07/17	  	Embedded Trace Substrate And Method Of Forming The Same
				
	898	  	9,576,917	  	02/21/17	  	Embedded Die In Panel Method And Structure
				
	899	  	9,607,890	  	03/28/17	  	Stress Relieving Through-Silicon Vias
				
	900	  	9,607,919	  	03/28/17	  	Semiconductor Device With Thin Redistribution Layers
				
	901	  	9,613,829	  	04/04/17	  	Method For Fabricating Semiconductor Package And Semiconductor Package Using The Same
				
	902	  	9,627,348	  	04/18/17	  	Laser Assited Bonding For Semiconductor Die Interconnections
				
	903	  	9,627,353	  	04/18/17	  	Method Of Manufacturing A Semiconductor Pakcage
				
	904	  	9,627,368	  	04/18/17	  	Semiconductor Device Using EMC Wafer Support System And Fabricating Method Thereof
				
	905	  	9,631,481	  	04/25/17	  	Semiconductor Device Including Leadframe With A Combination Of Leads And Lands And Method
				
	906	  	9,633,932	  	04/25/17	  	Lead Frame Package And Method For Manufacturing The Same
				
	907	  	9,633,939	  	04/25/17	  	Semiconductor Pacakge And Manufacturing Method Thereof
				
	908	  	9,633,966	  	04/25/17	  	Stacked Semiconductor Pacakge And Manufacturing Method Therefor
				
	909	  	9,653,336	  	05/16/17	  	Semiconductor Package And Manufacturing Method Thereof
				
	910	  	9,653,428	  	05/16/17	  	Semiconductor Pacakge And Fabricating Method Thereof
				
	911	  	9,670,445	  	06/06/17	  	Microfluidics Sensor Package Fabricating Method and Structure
				
	912	  	9,673,122	  	06/06/17	  	Micro Lead Frame Structure Having Reinforcing Portions And Method
				
	913	  	9,691,635	  	06/27/17	  	Buildup Dielectric Layer Having Metallization Pattern Semiconductor Package Fabrication Method
				
	914	  	9,691,734	  	06/27/17	  	Mold Compound Lamination Electronic Component Package Formation Method
				
	915	  	9,704,725	  	07/11/17	  	Semiconductor Device With Leadframe Configured To Facilitate Reduced Burr Formation
				
	916	  	9,704,747	  	07/11/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	917	  	9,704,842	  	07/11/17	  	Interposer, Manufacturing Method Thereof, Semiconductor Package Using The Same, And Method For Fabricating The Semiconductor Package
				
	918	  	9,711,484	  	07/18/17	  	Semiconductor Package With Semiconductor Die Directly Attached To Lead Frame And Method
				
	919	  	9,711,485	  	07/18/17	  	Thin Bonded Interposer Package
				
	920	  	9,716,071	  	07/25/17	  	Semiconductor Device Redistribution Layer With Narrow Trace Width Relatoive To Passivation Layer Opening
				
	921	  	9,721,872	  	08/01/17	  	Methods And Structures For Increasing The Allowable Die Size In TMV Packages
				
	922	  	9,728,476	  	08/08/17	  	Fingerprint Sensor And Manufacturing Method Thereof
				
	923	  	9,728,514	  	08/08/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	924	  	9,730,327	  	08/08/17	  	Stackable Via Package And Method
				
	925	  	9,735,191	  	08/15/17	  	Molded Semiconductor Package With Snap Lid
				
	926	  	9,741,617	  	08/22/17	  	Encapsulated Semiconductor Package and Method of Manufacturing Thereof
				
	927	  	9,741,701	  	08/22/17	  	Method Of Manufacturing Package-On-Package Type Semiconductor Package
				
	928	  	9,748,154	  	08/29/17	  	Wafer Level Fan Out Semiconductor Device And Manufacturing Method Thereof
				
	929	  	9,754,852	  	09/05/17	  	PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
				
	930	  	9,758,372	  	09/12/17	  	MEMS Package With MEMS Die, Magnetic, And Window Substrate Fabrication Method And Structure
				
	931	  	9,768,124	  	09/19/17	  	Semiconductor Package In Package
				
	932	  	9,776,855	  	10/03/17	  	Reversible Top/Bottom MEMS Package
				
	933	  	9,780,024	  	10/03/17	  	Semiconductor Pacakge And Manufacturing Method Thereof
				
	934	  	9,780,074	  	10/03/17	  	Semiconductor Package Using A Coreless Signal Distribution Structure
				
	935	  	9,793,180	  	10/17/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	936	  	9,799,592	  	10/24/17	  	A Semiconductor Device With Through-Silicon Via-Less Deep Wells
				
	937	  	9,809,446	  	11/07/17	  	Semiconductor Package And Manufacturing Method Thereof
				
	938	  	9,812,386	  	11/07/17	  	Elcapsulated Semiconductor Package









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	939	  	9,818,684	  	11/14/17	  	Semiconductor Package And Manufacturing Method Thereof
				
	940	  	9,818,685	  	11/14/17	  	A Semiconductor Device With Redistribution Layers On Partial Encapsulation
				
	941	  	9,818,708	  	11/14/17	  	Semiconductor Device With Thin Redistribution Layers
				
	942	  	9,818,721	  	11/14/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	943	  	9,831,282	  	11/28/17	  	Electronic Device Package And Fabricating Method Thereof
				
	944	  	9,837,331	  	12/05/17	  	Semiconductor Device Having Overlapped Via Apertures
				
	945	  	9,837,376	  	12/05/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	946	  	9,852,976	  	12/26/17	  	Semiconductor Package And Fabricating Method Thereof
				
	947	  	9,859,203	  	01/02/18	  	Semiconductor Package And Fabricating Method Thereof
				
	948	  	9,865,565	  	01/09/18	  	Transient Interface Gradient Conding For Metal Bonds
				
	949	  	9,870,985	  	01/16/18	  	Semiconductor Package With Clip Alignment Notch And Related Methods
				
	950	  	9,871,011	  	01/16/18	  	Semiconductor Package Using A Contact In A Plated Sidewall Encapsulated Opening
				
	951	  	9,871,015	  	01/16/18	  	Wafer Level Package And Fabricaton Method
				
	952	  	9,875,980	  	01/23/18	  	Copper Pillar Sidewall Protection
				
	953	  	9,881,864	  	01/30/18	  	Method For Fabricating Semiconductor Package And Semiconductor Package Using The Same
				
	954	  	9,892,990	  	02/13/18	  	Semiconductor Package Lid Thermal Interface Material Standoffs
				
	955	  	9,905,440	  	02/27/18	  	Method Of Manufacturing an Electronic Device And Electronic Device Manufacturerd Thereby
				
	956	  	9,911,685	  	03/06/18	  	Land Structure For Semiconductor Package And Method Therefor
				
	957	  	9,916,989	  	03/13/18	  	System And Method For Laser Assisted Bonding Of Semicondcutor Die
				
	958	  	9,917,039	  	03/13/18	  	Method Of Forming A Semiconductor Package With Conductive Interconnect Frame And Structure
				
	959	  	9,917,063	  	03/13/18	  	Semiconductor Package Structure For Improving Die Warpage And Manufacturing Method Thereof
				
	960	  	9,922,919	  	03/20/18	  	Electronic Package Structure Having Insulated Substrate With Lands And Conductive Patterns
				
	961	  	9,929,075	  	03/27/18	  	Chip-Scale Electronic Package Structure With Conductive Connective Element Having Increases Surface Area And Laterally Spaced Connection Points For Improved Connectivity
				
	962	  	9,929,113	  	03/27/18	  	Semiconductor Package And Manufacturing Method Thereof
				
	963	  	9,932,221	  	04/03/18	  	Semiconductor Package With Multiple Compartments
				
	964	  	9,935,083	  	04/03/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	965	  	9,941,180	  	04/10/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	966	  	9,947,623	  	04/17/18	  	Conductive Pad On Producing Through Electrode Semiconductor Device And Method Of Manufacturing
				
	967	  	9,960,328	  	05/01/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	968	  	9,966,276	  	05/08/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	969	  	9,966,300	  	05/08/18	  	Semicondcutor Device Package And Manufacturing Method Thereof
				
	970	  	9,966,652	  	05/08/18	  	Packaged Electronic Device Having Integrated Antenna And Locking Structure
				
	971	  	9,978,644	  	05/22/18	  	Semiconductor Device And Manufacturing Method
				
	972	  	9,978,695	  	05/22/18	  	Semiconductor Device Including Leadframe With A Combination Of Leads And Lands And Method
				
	973	  	9,984,947	  	05/29/18	  	Fingerprint Sensor And Manufacturing Method Thereof
				
	974	  	10,008,393	  	06/26/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	975	  	10,014,240	  	07/03/18	  	Embedded component package and fabrication method
				
	976	  	9406580	  	8/2/2016	  	PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
				
	977	  	9754852	  	9/5/2017	  	PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	978	  	4,950,623	  	Dishon	  	Method of Building Solder Bumps and Resulting Structures
				
	979	  	5,162,257	  	Yung	  	Solder Bump Fabrication Method
				
	980	  	5,289,631	  	Koopman et al	  	Method of Testing, Burn-in, and/or Programming of Integrated Circuit Chips
				
	981	  	5,293,006	  	Yung	  	Solder Bump Including Circular Lip
				
	982	  	5,374,893	  	Koopman et al	  	Apparatus for Testing, Burn-in, and/or Programming of Integrated Circuit Chips and Placing Solder Bumps Thereon
				
	983	  	5,381,946	  	Koopman et al	  	Method of Forming Differing Volume of Solder Bumps
				
	984	  	5,447,264	  	Koopman et al	  	Recessed Via Apparatus for Testing , Burn-in and /or Programming of IC Chips
				
	985	  	5,767,010	  	Mis, et al	  	Solder Bump Fabrication Methods and Structure Including a Titanium Barrier Layer
				
	986	  	5,793,116	  	Rinne, et al	  	Microelectronic Packaging Using Arched Solder Columns
				
	987	  	5,892,179	  	Rinne, et al	  	A Solder Bump Structure for a Microelectronic Substrate
				
	988	  	5,902,686	  	Mis	  	Methods for Forming and Internetallic Region Between a Solder Bump and an Under Bump Metallurgy Layer and Related Structures
				
	989	  	5,963,793	  	Rinne, et al	  	Microelectronic Packaging Using Arched Solder Columns
				
	990	  	6,117,299	  	Rinne, et al	  	Methods of electroplating solder bump of uniform height on integrated circuit substrates
				
	991	  	6,222,279	  	Mis, et al	  	Solder Bump Fabrication Methods and Structure Including a Titanium Barrier Layer
				
	992	  	6,329,608	  	Rinne, et al	  	A Solder Bump Structure for a Microelectronic Substrate
				
	993	  	6,388,203	  	Rinne, et al	  	Controll-shaped Solder Reserviors for Increasing the Volume of Solder Bumps and Structures Formed Thereby
				
	994	  	6,389,691	  	Rinne, et al	  	A Solder Bump Structure for a Microelectronic Substrate
				
	995	  	6,392,163	  	Rinne, et al	  	Controlled-Shape Solder Reservoirs for Increasing the Volume of Solder Bumps
				
	996	  	6,418,033	  	Rinne	  	Microelectronic Packages in Which Second Microelectronic Substrates are Oriented Relative to First Microelectronic Substrates at Acute Angles
				
	997	  	6,492,197	  	Rinne	  	Trilayer/Bilayer Solder Bumps and Fabrication Methods Therefor
				
	998	  	6,666,368	  	Rinne	  	Methods and Systems for Positioning Substrates using Spring Force of Phase-Changeable bumps therebetween
				
	999	  	6,762,122	  	Mis, et al	  	Methods of Forming Metallurgy Structures for Wire and Solder Bonding and Related Structures
				
	1000	  	6,793,792	  	Jones, et al	  	Electroplating Methods Including Maintaining A Determined Electroplating Voltage and Related Systems
				
	1001	  	6,863,209	  	Rinne, et al	  	Low Temperature Method of Bonding Components
				
	1002	  	6,960,828	  	Nair et al	  	Electronic Structures Including Conductive Shunt Layers
				
	1003	  	7,032,806	  	Rinne	  	Methods Of Positioning Components Using Liquid Prime Movers And Related Structures
				
	1004	  	7,049,216	  	Rinne	  	Methods Of Providing Solder Structures For Out Plane Connections
				
	1005	  	7,081,404	  	Jan et al	  	Methods Of Selectively Bumping Integrated Circuit Substrates And Related Structures
				
	1006	  	7,156,284	  	Rinne et al	  	Low Temperature Method of Bonding Components And Pelated Structures
				
	1007	  	7,213,740	  	Rinne	  	Optical Structure Including Liquid Bumps And Related Methods
				
	1008	  	7,244,671	  	Mis et al	  	Methods Of Forming Conductive Structures Including Titanium-Tungsten Base Layers And Related Structures
				
	1009	  	7,297,631	  	Nair et al	  	Methods Of Forming Electronic Structures Including Conductive Shunt Layers And Related Structures
				
	1010	  	7,427,557	  	Rinne et al	  	Methods Of Forming Bumps Using Barrier Layers As Etch Masks And Related Structures
				
	1011	  	7,495,326	  	Rinne	  	Stacked Electronic Structures Including Offset Substrates
				
	1012	  	7,531,898	  	Batchelor et al	  	Non-Circular Via Holes For Bumping Pads And Related Structures
				
	1013	  	7,547,623	  	Mis et al	  	Methods Of Forming Lead Free Solder Bumps And Related Structures
				
	1014	  	7,550,849	  	Mis et al	  	Conductive Structures Including Titanium-Tungsten Base Layers









							
	
    #    
	  	 USPN
	  	Issued	  	 Title

	1015	  	7,579,694	  	Jan et al	  	Electronic Devices Including Offset Conductive Bumps
				
	1016	  	7,659,621	  	Rinne	  	Solder Structures For Out Of Plane Connections
				
	1017	  	7,665,652	  	Mis et al	  	Electronic Devices Including Metallurgy Structures For Wire And Solder Bonding
				
	1018	  	7,834,454	  	Rinne et al	  	Electronic Structures Including Barrier Layers Defining Lips
				
	1019	  	7,839,000	  	Mis et al	  	Lead Free Solder Structures Including Barrier Layers With Nickel And/Or Copper
				
	1020	  	7,879,715	  	Nair et al	  	Methods Of Forming Electronic Structures Including Conductive Shunt Layers And Related Structures
				
	1021	  	8,294,269	  	Nair et al	  	Electronic Structures Including Conductive Layers Comprising Copper And Having A Thickness Of At Least 0.5 Micrometers
				
	1022	  	8,487,432	  	Rinne et al	  	Electronic Structures Including Barrier Layers And/Or Oxidation Barriers Defining Lips And Related Methods

  

	2.	Trademarks2 

  

									
	 Matter
	  	Reg. No.	 	  	Reg. Date	 
	 AMKOR
	  	 	1,241,384	 	  	 	6/7/1983	 
	 POWERQUAD
	  	 	1,754,474	 	  	 	2/23/1993	 
	 SUPERBGA
	  	 	1,866,256	 	  	 	12/6/1994	 
	 CHIPARRAY
	  	 	2,159,448	 	  	 	5/19/1998	 
	 AMKOR TECHNOLOGY
	  	 	2,478,303	 	  	 	8/14/2001	 
	 AMKOR TECHNOLOGY
	  	 	2,478,315	 	  	 	8/14/2001	 
	 CHIPARRAY
	  	 	2,505,797	 	  	 	11/13/2001	 
	 POWERSOP
	  	 	2,528,886	 	  	 	1/15/2002	 
	 TAPEARRAY
	  	 	2,568,521	 	  	 	5/7/2002	 
	 MLF
	  	 	2,737,520	 	  	 	7/15/2003	 
	 SUPERFC
	  	 	2,743,074	 	  	 	7/29/2003	 
	 ENABLING A MICROELECTRONIC WORLD
	  	 	2,762,388	 	  	 	9/9/2003	 
	 MICROLEADFRAME
	  	 	2,764,509	 	  	 	9/16/2003	 
	 FUSIONQUAD
	  	 	3,477,228	 	  	 	7/29/2008	 
	 AMKOR
	  	 	3,573,029	 	  	 	2/10/2009	 
	 TMV
	  	 	3,775,559	 	  	 	4/13/2010	 
	 FLIPSTACK
	  	 	3,828,622	 	  	 	8/3/2010	 
	 SWIFT
	  	 	5,161,677	 	  	 	3/14/2017	 
	 POSSUM
	  	 	4724245	 	  	 	4/21/2015	 

  

	3.	Copyrights3 

  

									
	 Copyright
	  	Reg. No.	 	  	Reg. Date	 
	 presentation of march 2010 slide 2 figure
	  	 	VAu001221551	 	  	 	10/5/2015	 
	 Presentation of September 2010 Slide 8 Figure
	  	 	VAu001221552	 	  	 	10/5/2015	 

  

	2 	All of scheduled trademarks are owned by Amkor Technology, Inc.. 


	3 	All of scheduled copyrights are owned by Amkor Technology, Inc.. 









							
	
	Pending Patent Applications - Confidential
				
	
  #  
	  	 Serial No.
	  	Filed on	  	 Title

	1	  	13/169,385	  	06/27/11	  	Integrated Shield Package And Method
				
	2	  	13/292,794	  	11/09/11	  	Optical Pcakge
				
	3	  	13/753,120	  	01/29/13	  	Semiconductor Device And Method Of Manufacturing Semiconductor Device
				
	4	  	13/894,403	  	05/14/13	  	Semiconductor Device With Metal Dam And Fabrication Method
				
	5	  	13/896,710	  	05/17/13	  	Stackable Variable Height Via Package And Method
				
	6	  	13/918,679	  	06/14/13	  	Semicondcutor Package Including Top-Surface Terminals For Mounting Another Semiconductor Package
				
	7	  	14/063,829	  	10/25/13	  	A Semiconductor Device With Plated Conductive Pillar Coupling
				
	8	  	14/069,814	  	11/01/13	  	An Embedded Vibration Management System
				
	9	  	14/172,611	  	02/04/14	  	A Thin Sandwich Embedded Package
				
	10	  	14/255,726	  	04/17/14	  	A Singulated Unit Substrate For A Semiconductor Device
				
	11	  	14/264,027	  	04/28/14	  	Flip Chip Self-Alignment Features For Substrate And Leadframe Applications
				
	12	  	14/449,654	  	08/01/14	  	A Semiconductor Device With Redistribution Layers Formed Utilizing Dummy Substrates
				
	13	  	14/452,933	  	08/06/14	  	A Semiconductor Package With Reduced Thickness
				
	14	  	14/496,764	  	09/25/14	  	A Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Surface
				
	15	  	14/538,018	  	11/11/14	  	Semiconductor Package Structure And Manufacturing Method Thereof
				
	16	  	14/581,305	  	12/23/14	  	Elcapsulated Semiconductor Package
				
	17	  	14/600,815	  	01/20/15	  	Thin Stackable Package And Method
				
	18	  	14/686,725	  	04/15/15	  	Semiconductor Package With High Routing Density Patch
				
	19	  	14/695,345	  	04/24/15	  	Merged Fiducial For Semiconductor Packages
				
	20	  	14/739,345	  	06/15/15	  	Semiconductor Pacakge And Manufacturing Method Thereof
				
	21	  	14/822,487	  	08/10/15	  	Method Of Manufacturing A Semiconductor Device
				
	22	  	14/835,923	  	08/26/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	23	  	14/846,543	  	09/04/15	  	Embedded Component Package And Fabrication Method
				
	24	  	14/931,112	  	11/03/15	  	Wafer-Level Stack Chip Package And Method Of Manufacturing The Same
				
	25	  	14/935,912	  	11/09/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	26	  	14/965,617	  	12/10/15	  	Stiffener Package And Method Of Fabricating Stiffener Package
				
	27	  	14/977,977	  	12/22/15	  	Semiconductor Device And Manufacturing Method Thereof
				
	28	  	14/988,563	  	01/06/16	  	Trace Stacking Structure And Method
				
	29	  	14/995,806	  	01/14/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	30	  	15/009,012	  	01/28/16	  	Semiconductor Package Using A Polymer Substrate
				
	31	  	15/051,216	  	02/23/16	  	Molded Electronic Package Geometry To Control Warpage And Die Stress
				
	32	  	15/069,416	  	03/14/16	  	Semiconductor Package And Manufacturing Method Thereof
				
	33	  	15/078,474	  	03/23/16	  	Semiconductor Package And Manufacturing Method Thereof
				
	34	  	15/092,183	  	04/06/16	  	Fingerprint Sensor And Manufacturing Method Thereof
				
	35	  	15/131,967	  	04/18/16	  	Fingerprint Sensor And Manufacturing Method Thereof
				
	36	  	15/133,081	  	04/19/16	  	Method For Fabricating Semiconductor Package Having A Multi-Layer Molded Conductive Substrate And Structure
				
	37	  	15/148,747	  	05/06/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	38	  	15/149,038	  	05/06/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	39	  	15/149,054	  	05/06/16	  	Capacitor Of Semiconductor Integrated Circuit And Method For Manufacturing The Same
				
	40	  	15/149,141	  	05/08/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	41	  	15/149,147	  	05/08/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	42	  	15/149,158	  	05/08/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	43	  	15/149,378	  	05/09/16	  	A Semiconductor Device With An Electromagnetic Inteference (EMI) Shield
				
	44	  	15/149,436	  	05/09/16	  	A Semiconductor Device With Etched Grooves For Embedded Devices
				
	45	  	15/173,116	  	06/03/16	  	Semiconductor Devicie And Manufacturing Method Thereof
				
	46	  	15/173,281	  	06/03/16	  	Method for Fabricating Semiconductor Package Having A Multilayer Encapsulated Conductive Substrate And Structure
				
	47	  	15/173,379	  	06/03/16	  	Method for Fabricating Semiconductor Package Having A Multilayer Encapsulated Conductive Substrate And Structure
				
	48	  	15/203,245	  	07/05/16	  	Semiconductor Package Including Premold And Method Of Manufacturing The Same
				
	49	  	15/211,534	  	07/15/16	  	Semiconductor Pacakge And Manufacturing Method Thereof
				
	50	  	15/214,567	  	07/20/16	  	Top Port MEMS Microphone Package And Method
				
	51	  	15/219,511	  	07/26/16	  	Semicondctor Device And Manufacturing Method Thereof
				
	52	  	15/225,228	  	08/01/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	53	  	15/233,271	  	08/10/16	  	Method And System For Packing Optimization Of Semiconductor Devices
				
	54	  	15/236,664	  	08/15/16	  	Shield Lid Interconnect Package And Method









							
	
  #  
	  	 Serial No.
	  	Filed on	  	 Title

	55	  	15/284,242	  	10/03/16	  	Fine Pitch Copper Pillar Package And Method
				
	56	  	15/285,110	  	10/04/17	  	A Robust Pillar Structure Structure For Semiconductor Device Contacts
				
	57	  	15/285,225	  	10/04/16	  	Extended Landing Pad Substrate Package Structure And Method
				
	58	  	15/297,365	  	10/19/16	  	Semiconductor Package and Manufacturing Method Thereof
				
	59	  	15/340,785	  	11/01/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	60	  	15/347,545	  	11/09/16	  	Staclable Package And Method
				
	61	  	15/350,647	  	11/14/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	62	  	15/351,026	  	11/14/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	63	  	15/357,551	  	11/21/16	  	A Semiconductor Device With Embedded Semiconductor Die And Substrate-To-Substrate Interconnects
				
	64	  	15/368,583	  	12/03/16	  	Semiconductor Device Having Conductive Wire With Increased Attachment Angle And Method
				
	65	  	15/373,713	  	12/09/16	  	Semiconductor Device And Method Of Manufacturing Thereof
				
	66	  	15/383,923	  	12/19/16	  	Semiconductor Device And Manufacturing Method Thereof
				
	67	  	15/387,016	  	12/21/16	  	Semiconductor Product With Interlocking Metal-To-Metal Bonds And Method For Manufacturing Thereof
				
	68	  	15/390,568	  	12/26/16	  	Semiconductor Device With Through Mold Via
				
	69	  	15/398,845	  	01/05/17	  	An Embedded Die In Panel Method And Structure
				
	70	  	15/404,242	  	01/12/17	  	Semiconductor Package With EMI Shield and Fabricating Method Thereof
				
	71	  	15/413,767	  	01/24/17	  	Semicondcutor Device Package And Manufacturing Method Thereof
				
	72	  	15/429,591	  	02/10/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	73	  	15/445,568	  	02/28/17	  	Semiconductor Device and Method of Manufacturing Thereof
				
	74	  	15/447,931	  	03/02/17	  	Semiconductor Package and Fabricating Method Thereof
				
	75	  	15/460,032	  	03/15/17	  	Method Of Forming A Packaged Semiconductor Device Using Ganged Conductive Connective Assembly And Structure
				
	76	  	15/465,307	  	03/21/17	  	Semiconductor Device and Method of Manufacturing Thereof
				
	77	  	15/467,794	  	03/23/17	  	Semiconductor Device With Tiered Pillar And Manufacturing Method Thereof
				
	78	  	15/468,433	  	03/24/17	  	Stress Relieving Through-Silicon Vias
				
	79	  	15/469,008	  	03/24/17	  	Semiconductor Device And Method Of Manufacturing Thereof
				
	80	  	15/479,223	  	04/04/17	  	Semiconductor Device With Leadframe Configured To Facilitate Reduced Burr Formation
				
	81	  	15/487,024	  	04/13/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	82	  	15/489,978	  	04/18/17	  	A Semiconductor Device Package Formed In a Chip-On-Wafer Last Process Using Thin Film Adhesives
				
	83	  	15/490,091	  	04/18/17	  	Semiconductor Device Using EMC Wafer Support System And Fabricating Method Thereof
				
	84	  	15/591,416	  	05/10/17	  	Fingerprint Sensor And Manufacturing Method Thereof
				
	85	  	15/597,313	  	05/12/17	  	Semiconductor Pacakge And Fabricating Method Thereof
				
	86	  	15/596,351	  	05/16/17	  	Semiconductor Package And Manufacturing Method Thereof
				
	87	  	15/615,769	  	06/06/17	  	Semiconductor Package Having Inspection Structure And Related Methods
				
	88	  	15/632,335	  	06/24/17	  	Semiconductor Device Having EMI Shielding Structure And Related Methods
				
	89	  	15/634,041	  	06/27/17	  	Elcapsulated Semiconductor Package
				
	90	  	15/634,861	  	06/27/17	  	METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES
				
	91	  	15/646,973	  	07/11/17	  	PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
				
	92	  	15/650,205	  	07/14/17	  	A Thin Bonded Interposer Package
				
	93	  	15/656,654	  	07/21/17	  	Wafer Level Fan Out Semiconductor Device And Manufacturing Method Thereof
				
	94	  	15/663,024	  	07/28/17	  	Methods And Structures For Increasing The Allowable Die Size In TMV Packages
				
	95	  	15/670,908	  	08/07/17	  	Stackable Via Package And Method
				
	96	  	15/673,565	  	08/10/17	  	METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
				
	97	  	15/683,065	  	08/22/17	  	Method Of Manufacturing Package-On-Package Type Semiconductor Package
				
	98	  	15/683,328	  	08/22/17	  	Encapsulated Semiconductor Package and Method of Manufacturing Thereof
				
	99	  	15/689,714	  	08/29/17	  	Semiconductor Package Using A Coreless Signal Distribution Structure
				
	100	  	15/695,478	  	09/05/17	  	PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
				
	101	  	15/700,101	  	09/09/17	  	Method Of Forming A Packaged Semiconductor Device Having Enhanced Wettable Flank And Structure









							
	
  #  
	  	 Serial No.
	  	Filed on	  	 Title

	102	  	15/706,688	  	09/16/17	  	Packaged Electronic Device Having Stepped Conductive Structure And Related Methods
				
	103	  	15/707,646	  	09/18/17	  	SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
				
	104	  	15/725,938	  	10/05/17	  	ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF
				
	105	  	15/799,941	  	10/31/17	  	SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
				
	106	  	15/806,074	  	11/07/17	  	Semiconductor Package And Manufacturing Method Thereof
				
	107	  	15/812,202	  	11/14/17	  	A Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
				
	108	  	15/812,741	  	11/14/17	  	A Semiconductor Device With Thin Redistribution Layers
				
	109	  	15/812,953	  	11/14/17	  	Semiconductor Package And Manufacturing Method Thereof
				
	110	  	15/815,243	  	11/16/17	  	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
				
	111	  	15/823,987	  	11/28/17	  	Electronic Device Package And Fabricating Method Thereof
				
	112	  	15/823,737	  	11/28/17	  	Land Structure For Semiconductor Package And Method Therefor
				
	113	  	15/831,771	  	12/05/17	  	Semiconductor Device And Manufacturing Method Thereof
				
	114	  	15/832,027	  	12/05/17	  	Semiconductor Package And Fabricating Method Thereof
				
	115	  	15/837,917	  	12/11/17	  	SEMICONDUCTOR DEVICE HAVING AN ULTRA-THIN SUBSTRATE AND MANUFACTURING METHOD THEREOF
				
	116	  	15/841,892	  	12/14/17	  	SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
				
	117	  	15/847,242	  	12/19/17	  	SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF
				
	118	  	15/847,329	  	12/19/17	  	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
				
	119	  	15/854,095	  	12/26/17	  	Semiconductor Package And Fabricating Method Thereof
				
	120	  	15/869,447	  	01/12/18	  	Method Of Forming A Semiconductor Device
				
	121	  	18/871,617	  	01/15/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	122	  	15/872,397	  	01/16/18	  	Wafer Level Package And Fabricaton Method
				
	123	  	15/874,602	  	01/18/18	  	Method For Fabricating Semiconductor Package And Semiconductor Package Using The Same
				
	124	  	15/888,003	  	02/03/18	  	Method Of Forming A Molded Substrate Electronic Package And Structure
				
	125	  	15/893,591	  	02/10/18	  	Electronic Package Structure
				
	126	  	15/905,602	  	02/26/18	  	Method Of Manufacturing an Electronic Device And Electronic Device Manufacturerd Thereby
				
	127	  	15/907,039	  	02/27/18	  	Method Of Forming An Electronic Device Structure Having An Electronic Component With An On-Edge Orientation And Related Structures
				
	128	  	15/911,082	  	03/03/18	  	Packaged Electronic Device Having Integrated Antenna And Locking Structure
				
	129	  	15/919,569	  	03/13/18	  	System And Method For Laser Assisted Bonding Of Semicondcutor Die
				
	130	  	15/919,791	  	03/13/18	  	Semiconductor Package Structure For Improving Die Warpage And Manufacturing Method Thereof
				
	131	  	15/934,267	  	03/23/18	  	Semiconductor Package With Multiple Compartments
				
	132	  	15/936,877	  	03/27/18	  	Semiconductor Package And Manufacturing Method Thereof
				
	133	  	15/937,423	  	03/27/18	  	ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATING METHOD THEREOF
				
	134	  	15/943,097	  	04/02/18	  	EMBEDDED BALL LAND SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHODS
				
	135	  	15/945,938	  	04/05/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	136	  	15/947,245	  	04/06/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	137	  	15/953,024	  	04/13/18	  	Conductive Pad On Producing Through Electrode Semiconductor Device And Method Of Manufacturing
				
	138	  	15/953,591	  	04/16/18	  	SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
				
	139	  	15/968,360	  	05/01/18	  	Method And System For Packing Optimization Of Semiconductor Devices
				
	140	  	15/973,329	  	05/07/18	  	Semicondcutor Device Package And Manufacturing Method Thereof
				
	141	  	15/973,799	  	05/08/18	  	Semiconductor Device And Manufacturing Method Thereof
				
	142	  	15/987,075	  	05/23/18	  	Semiconductor Device And Method Of Manufacturing Semiconductor Device
				
	143	  	15/988,940	  	05/24/18	  	SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
				
	144	  	16/017,735	  	06/25/18	  	Semiconductor Device And Manufacturing Method Thereof









	4.	Licenses 

  

							
	 Name of

the Obligor
	  	 Company
	  	 Title
	  	 Effective

Date

	 Amkor Technology, Inc.
	  	Tessera, Inc.	  	Limited TCC License Agreement	  	5/9/1996
				
	 Amkor Technology, Inc.
	  	Sharp Corporation	  	Cross-License by and between Amkor Technology, Inc. and Sharp Corporation	  	10/8/1998
				
	 Amkor Technology, Inc.
	  	Flip Chip Technologies, LLC	  	License Agreement	  	2/25/2000
				
	 Amkor Technology, Inc.
	  	Flip Chip Technologies, LLC	  	License Agreement	  	6/5/2001
				
	 Amkor Technology, Inc.
	  	St Assembly Test Services Ltd.	  	MicroLeadFrame License and Settlement Agreement	  	9/4/2001
				
	 Amkor Technology, Inc.
	  	RF Micro Devices, Inc.	  	Integrated Inductor Lead Frame License Agreement	  	1/1/2003
				
	 Amkor Technology, Inc.
	  	Ablestik Korea, a Division of National Starch and Chemical Korea Ltd.	  	Supplementary Agreement	  	3/4/2003
				
	 Amkor Technology, Inc.
	  	RF Micro Devices, Inc.	  	Micro Lead Frame Evaluation and Sampling License Agreement	  	3/5/2003
				
	 Amkor Technology, Inc.
	  	ASAT Holdings Limited	  	MicroLeadFrame and Leadless Plastic Chip Carrier Patent Cross License	  	11/1/2003
				
	 Amkor Technology, Inc.
	  	IBM (International Business Machines) Corporation	  	License Agreement	  	5/31/2004
				
	 Amkor Technology, Inc.
	  	PSi Technologies, Inc.	  	MicroLeadFrame Patent License Agreement	  	11/15/2004
				
	 Amkor Technology, Inc.
	  	ASAT Holdings Limited	  	Flip Chip & Thin Array Plastic Package Technology Cross License Agreement	  	4/1/2005









							
	 Amkor Technology, Inc.
	  	Unimicron Technology Corp.	  	Laser Embedded Substrate Technology License Agreement	  	4/22/2005
				
	 Amkor Technology, Inc.
	  	Freescale Technology	  	Collaboration Agreement RCP Technology Transfer	  	5/4/2005
				
	 Amkor Technology, Inc.
	  	Gem Services	  	MicroLeadFrame Patent License Agreement	  	8/8/2005
				
	 Amkor Technology, Inc.
	  	Advanced Microdevices, Inc.	  	Lead Free Bumping Technology License Agreement	  	9/18/2006
				
	 Amkor Technology, Inc.
	  	UTAC	  	MicroLeadFrame Patent License Agreement	  	1/1/2007
				
	 Amkor Technology, Inc.
	  	TriQuint	  	Test Software License Agreement	  	1/18/2007
				
	 Amkor Technology, Inc.
	  	IBM (International Business Machines) Corporation	  	License Agreement	  	4/27/2007
				
	 Amkor Technology, Inc.
	  	Advanpack Solutions Pte. Ltd.	  	Copper Pillar Patent License Agreement	  	5/1/2007
				
	 Amkor Technology, Inc.
	  	ASAT Holdings	  	FusionQuad License Agreement	  	7/1/2008
				
	 Amkor Technology, Inc.
	  	St Assembly Test Services Ltd.	  	FusionQuad License Agreement	  	5/14/2009
				
	 Amkor Technology, Inc.
	  	Intel Mobile Communications GmbH	  	License Agreement	  	5/17/2010
				
	 Amkor Technology, Inc.
	  	IBM (International Business Machines) Corporation	  	License Agreement	  	6/4/2010
				
	 Amkor Technology, Inc.
	  	GLOBALFOUNDRIES	  	Amended Lead Free Bumping Technology License Agreement	  	5/27/2011
				
	 Amkor Technology, Inc.
	  	SHINKO ELECTRIC INDUSTRIES CO., LTD.	  	TMV License Agreement	  	1/6/2012









							
	Amkor Technology, Inc.	  	Taiwan Semiconductor Manufacturing Company, Ltd.	  	COPPER PILLAR WAFER BUMP LICENSE AGREEMENT	  	1/25/2013
				
	Amkor Technology, Inc.	  	Toshiba Corporation	  	Technical Assistance and License Agreement between Toshiba Corporation and Amkor Technology Inc. for Assembly and Test Technology	  	7/31/2013
				
	Amkor Technology, Inc.	  	shinko ELECTRIC INDUSTRIES CO., LTD.	  	MCeP License Agreement	  	1/21/2014
				
	Amkor Technology, Inc.	  	Toshiba Corporation	  	Technical Assistance and License Agreement for Shield Package Enhancement Technolgy	  	5/26/2014
				
	Amkor Technology, Inc.	  	Globalfoundries Inc.	  	COPPER PILLAR WAFER BUMP LICENSE AGREEMENT	  	12/12/2014
				
	Amkor Technology, Inc.	  	Tessera, Inc.	  	Settlement Agreement	  	1/15/2015
				
	Amkor Technology, Inc.	  	Broadcom Corporation	  	Recon Development and License Agreement	  	2/12/2015
				
	Amkor Technology, Inc.	  	Shinko ELECTRIC INDUSTRIES CO., LTD.	  	MCeP License Agreement #2	  	9/4/2015
				
	Amkor Technology, Inc.	  	Sandia Corporation	  	NON-EXCLUSIVE PATENT LICENSE	  	10/21/2015
				
	Amkor Technology, Inc.	  	Synaptics	  	Settlement, Release, IP License, and Patent Assignment Agreement	  	4/12/2017








 SCHEDULE 9.1.14 

to 
 Loan and Security Agreement

 ENVIRONMENTAL MATTERS  

NONE. 







 SCHEDULE 9.1.15 

to 
 Loan and Security Agreement

 RESTRICTIVE AGREEMENTS 
  

	1.	Senior Notes (2021) Indenture – that certain Indenture between Parent and U.S. Bank National Association, as Trustee, dated as of May 20, 2011, as such Indenture may be amended or supplemented from time
to time, relating to Parent’s 6.625% Senior Notes due 2021. 

  

	2.	Senior Notes (2022) Indenture – that certain Indenture between Parent and U.S. Bank National Association, as Trustee, dated as of September 21, 2012, as such Indenture may be amended or supplemented from
time to time, relating to Parent’s 6.375% Senior Notes due 2022. 








 SCHEDULE 9.1.16 

to 
 Loan and Security Agreement

 LITIGATION  

NONE. 







 SCHEDULE 9.1.18 

to 
 Loan and Security Agreement

 ERISA  

NONE. 







 SCHEDULE 9.1.20 

to 
 Loan and Security Agreement

 LABOR CONTRACTS  

NONE. 







 SCHEDULE 9.1.21 

to 
 Loan and Security Agreement

 PRIOR NAMES AND LOCATIONS 
  

			
	 Obligor
	 	 Former Location

	Amkor Technology, Inc.	 	1900 South Price Road, Chandler AZ 85284
		
	Amkor Technology, Inc.	 	1900 South Price Road, Chandler AZ 85284








 SCHEDULE 10.2.2 

to 
 Loan and Security Agreement

 EXISTING LIENS 
  

	•	 	Cash collateral securing (i) the standby Letter of Credit bearing number 7420662 in the face amount of $147,404 issued for the benefit of Credit Suisse AG London
Branch, (ii) the standby Letter of Credit bearing number 68101486 in the face amount of $257,541 issued for the benefit of Credit Suisse AG London Branch and (iii) the standby Letter of Credit bearing number 3096430 in the face amount of
$127,652 issued for the benefit of Salt River Project Agricultural. 

  

									
	 DEBTOR
	  	 SECURED

PARTY
	  	JURISDICTION	  	TYPE OF FILING AND
FILING NUMBER	  	DESCRIPTION OF
COLLATERAL
	Amkor Technology, Inc.	  	MB Financial Bank, N.A.	  	Delaware	  	UCC-1
 2017 4607195
	  	Specific equipment
					
	Amkor Technology, Inc.	  	MB Financial Bank, N.A.	  	Delaware	  	UCC-1
 2017 5584955
	  	Specific equipment
					
	Amkor Technology, Inc.	  	MB Financial Bank, N.A.	  	Delaware	  	UCC-1
 2017 7303904
	  	Specific equipment