Page 1 of 100

**Subpart I**
**— Electronics Manufacturing**  **§ 98. 90**  **Definition of the source category.** (a) The electronics manufacturing source category consists of any of the production processes listed in paragraphs (a)(1) through (a)(5) of this section that use fluorinated GHGs or N 2 O. Facilities that may

use these processes include, but are not limited to, facilities that manufacture micro - electro - mechanical s ys tems (MEMS), liquid cry stal display s (LCDs), photovoltaic cells (PV), and semiconductors (including light - emitting diodes (LEDs)). (1) Any electronics production process in which the etching process uses plasma generated fluorine atoms and other reactive fluorine - containing fragments, that chemicall y react with exposed thin - films (e.g., dielectric, metals) or substrate (e.g., silicon) to selectivel y remove portions of material. (2) Any electronics production process in which chambers used for depositing thin films are cleaned periodicall y using plasm a - generated fluorine atoms and other reactive fluorine containing fragments. (3) Any electronics production process in which wafers are cleaned using plasma generated fluorine atoms or other reactive fluorine - containing fragments to remove residual material from wafer surfaces, including the wafer edge. (4) Any electronics production process in which the chemical vapor deposition (CVD) process or other manufacturing processes use N 2 O. (5) Any electronics manufacturing production process in which fluorinated heat transfer fluids are used to cool process equipment, to control temperature during device testing, to clean substrate surfaces and other parts, and for soldering (e.g., vapor phase reflow). **§ 98. 91**  **Reporting threshold.**Page 2 of 100

(a) You must report GHG emission s under this subpart if electronics manufacturing production processes, as defined in § 98. 90, are performed at your facility and your facility meets the requirements of either § 98. 2(a)(1) or (a)(2). To calculate total annual GHG emissions for comparison to the 25,000 metric ton CO 2 e per year emission threshold in § 98. 2(a)(2), follow the requirements of § 98. 2(b), with one exception. Rather than using the calculation methodologies in § 98. 93 to calculate emissions from electronics manufacturing production processes, calculate emissions of each fluorinated GHG from electronics manufacturing production processes b y using paragraphs (a)(1), (a)(2), or (a)(3) of this section, as appropriate, and then sum the emissions of each fluorinated GHG b y using paragraph (a)(4) of this section. (1) If you manufacture semiconductors or MEMS you must calculate annual production process emissions of each input gas i for threshold applicability purposes using the default emission factors shown in Table I - 1 to this subpart and Equation I - 1 of this subpart.

where: E i = Annual production process emissions of input gas i for threshold applicability

purposes (metric tons CO 2 e). S = 100 percent of annual manufacturing capacity of a facility

as calculated using Equation I - 5 of thi s subpart (m2 ). EF i = Emission factor for input gas i (kg/m2 ). GWP i = Gas - appropriate GWP as provided in Table A - 1 to subpart A of this part. 0.001 = Conversion factor from kg to metric tons. i = Input gas. (2) If you manufacture LCDs, you must calculate annual production process emissions of each input gas i for threshold applicability purposes using the default emission factors shown in Table I - 1 to this subpart and Equation I - 2 of this subpart.Page 3 of 100

where: E i = Annual production process emissions of input gas i for threshold applicability

purposes (metric tons Co 2 e). S = 100 percent of annual manufacturing capacity of a facility

as calculated using Equation I - 5 of this subpart (m2 ). EF i = Emission factor for input gas i (g/m2 ). GWP i = Gas - appropriate GWP a s provided in Table A - 1 to subpart A of this part. 0.000001 = Conversion factor from g to metric tons. i = Input gas. (3) If you manufacture PVs, you must calculate annual production process emissions of each input gas i for threshold applicability purpose s using gas - appropriate GWP values shown in Table A - 1 to subpart A of this part and Equation I - 3 of this subpart.

where: E i = Annual production process emissions of input gas i for threshold applicability

purposes (metric tons Co 2 e). C i = Annual fluorinated GHG (input gas i) purchases or consumption (kg). Onl y

gases that are used in PV manufacturing processes listed at § 98. 90(a)(1) through (a)(4) that have listed GWP values in Table A - 1 to subpart A of this part must be considered for thre shold applicability purposes. GWP i = Gas - appropriate GWP as provided in Table A - 1 to subpart A of this part. 0.001 = Conversion factor from kg to metric tons. i = Input gas. (4) You must calculate total annual production process emissions for threshold app licability

purposes using Equation I - 4 of this subpart.

where:Page 4 of 100

E T = Annual production process emissions of all fluorinated GHGs for threshold

applicability

purposes (metric tons Co 2 e). δ = Factor accounting for fluorinated heat transfer fluid emissions, estimated as

10 percent of total annual production process emissions at a semiconductor facility . Set equal to 1.1 when Equation I - 4 of this subpart is used to calculate total annual production process emissions from semiconductor manufacturing. Set equal to 1 when Equation I - 4 of this subpart is used to calculate total annual production process emissions from MEMS, L CD, or PV manufacturing. E i = Annual production process emissions of input gas i for threshold applicability

purposes (metric tons Co 2 e), as calculated in Equations I - 1, I - 2 or I - 3 of this subpart. i = Input gas. (b) You must calculate annual manufacturing capacity of a facility

using Equation I - 5 of this subpart.

where: S = 100 percent of annual manufacturing capacity of a facility

(m2 ). WX = Maximum substrate starts of fab f in month x (m2 per month). x = Month. **§ 98. 92**  **GHGs to report.** (a) You must report emissions of fluorinated GHGs (as defined in § 98. 6), N 2 O, and fluorinated heat transfer fluids (as defined in § 98. 98). The fluorinated GHGs and fluorinated heat transfer fluids that are emitted from electronics manufacturing production processes include, but are not limited to, those listed in Table I - 2 to this subpart. You must individually report, as appropriate: (1) Fluorinated GHGs em itted. (2) - (3) [Reserved]Page 5 of 100

(4) N 2 O emitted from chemical vapor deposition and other electronics manufacturing processes. (5) Emissions of fluorinated heat transfer fluids. (6) All fluorinated GHGs and N 2 O consumed. (b) CO 2 , CH 4 , and N 2 O combustion emissions from each stationary combustion unit. You must calculate and report these emissions under subpart C of this part (General Stationary Fuel Combustion Sources) by

following the requirements of subpart C of this part. **§ 98. 93**  **Calculating GHG emissions.** (a) Y ou must calculate total annual emissions of each fluorinated GHG emitted by electronics manufacturing production processes from each fab (as defined in § 98. 98) at your facility , including each input gas and each by- product gas. You must use either default gas utilization rates and b y- product formations rates according to the procedures in paragraph (a)(1), (a)(2), or (a)(6) of this section, as appropriate, or the stack test method according to paragraph (i) of this section, to calculate emissions of each input gas and each by- product gas. (1) If you manufacture semiconductors, you must adhere to the procedures in paragraphs (a) (1) (i) through (iii) of this section. You must calculate annual emissions of each input gas and of each b y- product gas using Equations I - 6 and I - 7, respectivel y. If your fab uses less than 50 kg of a fluorinated GHG in one reporting ye ar, you may calculate emissions as equal to your fab's annual consumption for that specific gas as calculated in Equation I - 11 of this subpart, plus any by- product emissions of that gas calculated under this paragraph (a).

Where:Page 6 of 100

Processty peE i = Annual emissions of input gas i from the process ty pe on a fab basis (metric tons). E ij = Annual emissions of input gas i from process sub - ty pe or proces s type j as calculated in Equation I - 8 of this subpart (metric tons). N = The total number of process sub - ty pes j that depends on the electronics manufacturing fab and emission calculation methodology . If E ij is calculated for a process type j in Equation I - 8 of this subpart, N = 1. i = Input gas. j = Process sub - ty pe or process ty

pe.
Where: Processty peBE k = Annual emissions of by- product gas k from the processes type on a fab basis

(metric tons). BE ijk = Annual emissions of by- product gas k formed from input gas i used for

process sub - ty

pe or process ty

pe j as calculated in Equation I - 9 of this subpart (metric tons). N = The total number of process sub - ty pes j that depends on the electronics manufacturing fab and emission calculation methodology . If BE ij k is calculated for a process type j in Equation I - 9 of this subpart, N = 1. i = Input gas. j = Process sub - ty pe, or process ty

pe. k = By- product gas. (i) You must calculate annual fab - level emissions of each fluorinated GHG used for the plasma etching/waf

er cleaning process type using default utilization and by - product formation rates as shown in Table I - 3 or I - 4 of this subpart, and by using Equations I - 8 and I - 9 of this subpart.

Where: E ij = Annual emissions of input gas i from process sub - ty pe or pro cess type j, on a fab basis (metric tons).Page 7 of 100

C ij = Amount of input gas i consumed for process sub - ty pe or process ty

pe j, as calculated in Equation I - 13 of this subpart, on a fab basis (kg). U ij = Process utilization rate for input gas i for process sub - ty pe or process type j (expressed as a decimal fraction). aij = Fraction of input gas i used in process sub - ty pe or process type j with abatement s ys tems, on a fab basis (expressed as a decimal fraction). dij = Fraction of input gas i destroyed or removed in a batement sy stems connected to process tools where process sub - ty pe, or process ty

pe j is used, on a fab basis (expressed as a decimal fraction). This is zero unless the facility adheres to the requirements in § 98. 94(f). UT ij = The average uptime factor of all abatement sy stems connected to process

tools in the fab using input gas i in process sub - ty pe or process ty

pe j, as calculated in Equation I - 15 of this subpart, on a fab basis (expressed as a decimal fraction). 0.001 = Conversion factor from kg to metric tons. i = Input gas. j = Process sub - ty pe or process ty

pe.

Where: BE ijk = Annual emissions of by- product gas k formed from input gas i from process

sub - ty pe or process ty

pe j, on a fab basis (metric tons). B ijk = By- product formation rate of gas k created as a b y - product per amount of

input gas i (kg) consumed by process sub - ty

pe or process type j (kg). C ij = Amount of input gas i consumed for process sub - ty pe, or process ty

pe j, as calculated in Equation I - 13 of this subpart, on a fab basis (kg). aij = Fraction of input gas i used for process sub - ty pe, or process type j with abatement s ys tems, on a fab basis (expressed as a decimal fraction). d jk = Fraction of b y- product gas k destro yed or removed in abatement s ys tems

connected to process tools where process sub - ty pe, or process type j is used, on a fab basis (expressed as a decimal fraction). This is zero unless the facility adheres to the requirements in § 98. 94(f). UT ijk = The average uptime factor of all abatement sy stems connected to process

tools in the fab emitting by- product gas k, formed from input gas i in process sub - ty pe or process ty

pe j, on a fab basis (expressed as a decimal fraction).Page 8 of 100 For this equation, UT ijk is assumed to be equal to UT ij as calculated in Equation I - 15 of this subpart. 0.001 = Conversion factor from kg to metric tons. i = Input gas. j = Process sub - ty pe or process ty

pe. k = By- product gas. (ii) You must calculate annual fab - level emissions of each fluorinated GHG used for each of the process sub - ty

pes associated with the chamber cleaning process ty pe, including in - situ plasma chamber clean, remote plasma chamber clean, and in - situ thermal chamber clean, using default utilization and by - product formation rates as shown in Table I - 3 or I - 4 of this subpart, and by using Equations I - 8 and I - 9 of this subpart. (iii) If default values are not available for a particular input gas and process ty pe or sub ty pe combination in Tabl es I - 3 or I - 4, you must follow the procedures in paragraph (a)(6) of this section.(2) If you manufacture MEMS, L CDs, or PVs, you must calculate annual fab - level emissions of each fluorinated GHG used for the plasma etching and chamber cleaning process ty p es using default utilization and by- product formation rates as shown in Table I - 5, I - 6, or I - 7 of this subpart, as appropriate, and b y using Equations I - 8 and I - 9 of this subpart. If default values are not available for a particular input gas and process typ e or sub - ty pe combination in Tables I 5, I - 6, or I - 7, you must follow the procedures in paragraph (a)(6) of this section. I f your fab uses less than 50 kg of a fluorinated GHG in one reporting ye ar, you may calculate emissions as equal to your fab's annu al consumption for that specific gas as calculated in Equation I - 11 of this subpart, plus any b y- product emissions of that gas calculated under this paragraph (a). (3) - (5) [Reserved]Page 9 of 100

(6) If you are required, or elect, to perform calculations using default emission factors for gas utilization and by- product formation rates according to the procedures in paragraphs (a)(1) or (a)(2) of this section, and default values are not available for a particular input gas and process ty pe or sub - ty

pe combination in Tabl es I - 3, I - 4, I - 5, I - 6, or I - 7, you must use the utilization and by- product formation rates of zero and use Equations I - 8 and I - 9 of this subpart. (b) You must calculate annual fab - level N 2 O emissions from all chemical vapor deposition processes and from th e aggregate of all other electronics manufacturing production processes using Equation I - 10 of this subpart and the methods in paragraphs (b)(1) and (2) of this section. If your fab uses less than 50 kg of N 2 O in one reporting ye ar, you may calculate fab emissions as equal to your fab's annual consumption for N 2 O as calculated in Equation I - 11 of this subpart.

Where: E(N 2 O)

j = Annual emissions of N 2 O for N 2 O - using process j, on a fab basis (metric

tons). C N2O,j = Amount of N 2 O consumed for N 2 O - using proc ess j, as calculated in Equation

I - 13 of this subpart and apportioned to N 2 O process j, on a fab basis (kg). UN2O,j = Process utilization factor for N 2 O - using process j (expressed as a decimal

fraction) from Table I - 8 of this subpart. a N2O,j = Fraction of N 2 O used in N 2 O - using process j with abatement s ys tems, on a

fab basis (expressed as a decimal fraction). d N2O,j = Fraction of N 2 O for N 2 O - using process j destro yedor removed in abatement

sy stems connected to process tools where process j is used, on a fa b basis (expressed as a decimal fraction). This is zero unless the facility adheres to the requirements in § 98. 94(f). UTN2O = The average uptime factor of all the abatement s ys tems connected to process

tools in the fab that use N 2 O, as calculated in Equation I - 15 of this subpart, on a fab basis (expressed as a decimal fraction). For purposes of calculating the abatement s ys tem uptime for N 2 O using process tools, in Equation I - 15 ofPage 10 of 100 this subpart, the only

input gas i is N 2 O, j is the N 2 O using process, and p is the N 2 O abatement s ys tem connected to the N 2 O using tool. 0.001 = Conversion factor from kg to metric tons. j = Ty

pe of N 2 O - using process, either chemical vapor deposition or all other N 2 O - using manufacturing processes. (1) You must use the facto r for N 2 O utilization for chemical vapor deposition processes as shown in Table I - 8 to this subpart. (2) You must use the factor for N 2 O utilization for all other manufacturing production processes other than chemical vapor deposition as shown in Table I - 8 to this subpart. (c) You must calculate total annual input gas i consumption on a fab basis for each fluorinated GHG and N 2 O using Equation I - 11 of this subpart. Where a gas supply s ys tem serves more than one fab, Equation I - 11 is applied to that gas whic h has been apportioned to each fab served b y that s ys tem using the apportioning factors determined in accordance with § 98. 94(c).

where: C i = Annual consumption of input gas i, on a fab basis (kg per ye ar). I Bi = Inventory of input gas i stored in containers at the beginning of the reporting ye ar, including heels, on a fab basis (kg). For containers in service at the beginning of a reporting year, account for the quantity in these containers as if they were full. I Ei = Inventory of input gas i store d in containers at the end of the reporting ye ar, including heels, on a fab basis (kg). For containers in service at the end of a reporting year, account for the quantity in these containers as if they were full. A i = Acquisitions of input gas i during the ye ar through purchases or other

transactions, including heels in containers returned to the electronics manufacturing facility , on a fab basis (kg). D i = Disbursements of input gas i through sales or other transactions during the

ye ar, including heels in containers returned b y the electronics manufacturing facility to the chemical supplier, as calculated using Equation I - 12 of this subpart, on a fab basis (kg).Page 11 of 100

i = Input gas. (d) You must calculate disbursements of input gas i using fab - wide gas - specific h eel factors, as determined in § 98. 94(b), and b y using Equation I - 12 of this subpart. Where a gas supply s ys tem serves more than one fab, Equation I - 12 is applied to that gas which has been apportioned to each fab served b y that s ys tem using the apportioni ng factors determined in accordance with § 98. 94(c).

where: D i = Disbursements of input gas i through sales or other transactions during the

reporting year on a fab basis, including heels in containers returned b y the electronics manufacturing fab to th e gas distributor (kg). h il = Fab - wide gas - specific heel factor for input gas i and container size and typ e l

(expressed as a decimal fraction), as determined in § 98. 94(b). If your fab uses less than 50 kg of a fluorinated GHG or N 2 O in one reporting year , you may assume that any

h il for that fluorinated GHG or N 2 O is equal to zero. N il = Number of containers of size and ty pe l used at the fab and returned to the gas distributor containing the standard heel of input gas i. F il = Full capacity of containers of size and ty pe l containing input gas i (kg). X i = Disbursements under exceptional circumstances of input gas i through sales

or other transactions during the ye ar, on a fab basis (kg). These include returns of containers whose contents have been weighed due to an exceptional circumstance as specified in § 98. 94(b)(4). i = Input gas. l = Size and ty pe of gas container. M = The total number of different sized container types on a fab basis. If onl y one

size and container type is used for an input gas i, M=1 (e) You must calculate the amount of input gas i co nsumed, on a fab basis, for each process sub - ty

pe or process ty

pe j, using Equation I - 13 of this subpart. Where a gas suppl y sy stem serves more than one fab, Equation I - 13 is applied to that gas which has been apportioned to each fab served b y that sy stem using the apportioning factors determined in accordance with §Page 12 of 100

98. 94(c). If you elect to calculate emissions using the stack test method in paragraph (i) of this section, you must calculate the amount of input gas i consumed on the applicable basis by usin g an appropriate apportioning factor. For example, when calculating fab - level emissions of each fluorinated GHG consumed using Equation I - 21 of this section, you must substitute the term fij with the appropriate apportioning factor to calculate the total c onsumption of each fluorinated GHG in tools that are vented to stack sy stems that are tested.

where: C i,j = The annual amount of input gas i consumed, on a fab basis, for process sub ty pe or process ty

pe j (kg). f i,j = Process sub - ty pe - specific or proce ss type - specific j, input gas i apportioning factor (expressed as a decimal fraction), as determined in accordance with § 98. 94(c). C i = Annual consumption of input gas i, on a fab basis, as calculated using

Equation I - 11 of this subpart (kg). i = Input ga s. j = Process sub - ty pe or process ty

pe. (f) [Reserved] (g) If you report controlled emissions pursuant to § 98. 94(f), you must calculate the uptime of all the abatement sy stems for each combination of input gas or b y - product gas, and process sub - ty

pe or process ty

pe, b y using Equation I - 15 of this subpart.

Where: UT ij = The average uptime factor of all abatement sy stems connected to process

tools in the fab using input gas i in process sub - ty pe or process ty

pe j (expressed as a decimal fraction).Page 13 of 100

Tdijp = The total time, in minutes, that abatement s ys tem p, connected to process

tool(s) in the fab using input gas i in process sub - ty pe or process ty

pe j, is not in operational mode, as defined in § 98. 98, when at least one of the tools connected to abatement sy stem p is in operation. UT ijp = Total time, in minutes per year, in which abatement sy stem p has at least one

associated tool in operation. For determining the amount of tool operating time, you may

assume that tools that were installed for the whole o f the ye ar were operated for 525,600 minutes per year. For tools that were installed or uninstalled during the ye ar, you must prorate the operating time to account for the day s in which the tool was not installed; treat any partial day

that a tool was inst alled as a full day (1,440 minutes) of tool operation. For an abatement s ys tem that has more than one connected tool, the tool operating time is 525,600 minutes per year if at least one tool was installed at all times throughout the ye ar. If you have tools that are idle with no gas flow through the tool for part of the ye ar, you may calculate total tool time using the actual time that gas is flowing through the tool. i = Input gas. j = Process sub - ty pe or process ty

pe. p = Abatement s ys tem. (h) If you use f

luorinated heat transfer fluids, you must calculate the annual emissions of fluorinated heat transfer fluids on a fab basis using the mass balance approach described in Equation I - 16 of this subpart.

where: EH i = Emissions of fluorinated heat transfer f luid i, on a fab basis (metric tons/year). Densityi = Density of fluorinated heat transfer fluid i (kg/l). I iB = Inventory of fluorinated heat transfer fluid i, on a fab basis, in containers other than equipment at the beginning of the reporting year (in s tock or storage) (l). The inventory at the beginning of the reporting year must be the same as the inventory

at the end of the previous reporting ye ar. P i = Acquisitions of fluorinated heat transfer fluid i, on a fab basis, during the

reporting year (l), including amounts purchased from chemical suppliers, amounts purchased from equipment suppliers with or inside of equipment, and amounts returned to the facility after off - site recycling.Page 14 of 100

N i = Total nameplate capacity (full and proper charge) of equipment that uses

fluorinated heat transfer fluid i and that is newly installed in the fab during the reporting ye ar (l). Ri = Total nameplate capacity (full and proper charge) of equipment that uses

fluorinated heat transfer fluid i and that is removed from servi ce in the fab during the reporting ye ar (l). I iE = Inventory of fluorinated heat transfer fluid i, on a fab basis, in containers other than equipment at the end of the reporting year (in stock or storage) (l). The inventory

at the beginning of the reportin g ye ar must be the same as the inventory at the end of the previous reporting ye ar. D i = Disbursements of fluorinated heat transfer fluid i, on a fab basis, during the

reporting year, including amounts returned to chemical suppliers, sold with or inside of equipment, and sent off - site for verifiable recycling or destruction (l). Disbursements should include only amounts that are properl y stored and transported so as to prevent emissions in transit. 0.001 = Conversion factor from kg to metric tons. i = Fluorinated heat transfer fluid. (1) If you use a fluorinated chemical both as a fluorinated heat transfer fluid and in other applications, you may

calculate and report either emissions from all applications or from only those specified in the definition of flu orinated heat transfer fluids in § 98. 98. (2) [Reserved] (i) Stack Test Method . As an alternative to the default emission factor method in paragraph (a) of this section, you may calculate fab - level fluorinated GHG emissions using fab specific emission fact ors developed from stack testing. To use the method in this paragraph, you must first make a preliminary estimate of the fluorinated GHG emissions from each stack s ys tem in the fab under paragraph (i)(1) of this section. You must then compare the prelimina ry estimate for each stack s ys tem to the criteria in paragraph (i)(2) of this section to determine whether the stack sy stem meets the criteria for using the stack test method described in paragraph (i)(3) of this section or whether the stack s ys tem meets the criteria for using the method described in paragraph (i)(4) of this section to estimate emissions from the stack s ys tems that are not tested.Page 15 of 100

(1) Preliminary

estimate of emissions by stack s ys tem in the fab . You must calculate a preliminary

estimate of the total annual emissions, on a metric ton CO 2 e basis, of all fluorinated GHG from each stack s ystem in the fab using default utilization and by- product formation rates as shown in Table I - 11, I - 12, I - 13, I - 14, or I - 15 of this subpart, as applicable, and by using Equations I - 8 and I - 9 of this subpart. You must include any intermittent low - use fluorinated GHGs, as defined in § 98. 98 of this subpart, in any preliminary estimates. When using Equations I - 8 and I - 9 of this subpart for the purposes of this paragraph (i)(1), you must also adhere to the procedures in paragraphs (i)(1)(i) to (iv) of this section to calculate preliminary estimates. (i) When you are calculating preliminary estimates for the purpose of this paragraph (i)(1), you must consider the subsc ript “j” in Equations I - 8 and I - 9, and I - 13 of this subpart to mean “stack s ys tem” instead of “process sub - ty pe or process type.” For the value of aij , the fraction of input gas i that is used in tools with abatement sy stems, for use in Equations I - 8 and I 9, you may

use the ratio of the number of tools using input gas i that have abatement s ys tems that are vented to the stack s ystem for which you are calculating the preliminary estimate to the total number of tools using input gas i that are vented to that stack sy stem, expressed as a decimal fraction. In calculating the preliminary estimates, you must account for the effect of any fluorinated GHG abatement sy stem meeting the definition of abatement s ystem in § 98. 98. You may use this approach to determinin g aij only for this preliminary

estimate. (ii) You must use representative data from the previous reporting ye ar to estimate the consumption of input gas i as calculated in Equation I - 13 of this subpart and the fraction of input gas i and by- product gas k destroyed in abatement sy stems for each stack sy stem as calculated by Equation s I - 24 A and I - 24B of this subpart. If you were not required to submit an annual report under subpart I for the previous reporting year and data from the previous reporting ye ar are notPage 16 of 100

available, you may estimate the consumption of input gas i and the fraction of input gas i destroyed in abatement sy stems based on representative operating data from a period of at least 30 day s in the current reporting year. When calculating the co nsumption of input gas i using Equation I - 13 of this subpart, the term “f ij ” is replaced with the ratio of the number of tools using input gas i that are vented to the stack sy stem for which you are calculating the preliminary estimate to the total number of tools in the fab using input gas i, expressed as a decimal fraction. You may use this approach to determining f ij only for this preliminary estimate. (iii) You must use representative data from the previous reporting year to estimate the total uptime of all abatement sy stems for the stack sy stem as calculated b y Equation I - 23 of this subpart, instead of using Equation I - 15 of this subpart to calculate the average uptime factor. If yo u were not required to submit an annual report under subpart I for the p revious reporting ye ar and data from the previous reporting year are not available, you may estimate the total uptime of all abatement s ys tems for the stack s ys tem based on representative operating data from a period of at least 30 day s in the current repo rting year. (iv) If you anticipate an increase or decrease in annual consumption or emissions of any fluorinated GHG, or the number of tools connected to abatement s ys tems greater than 10 percent for the current reporting year compared to the previous repo rting ye ar, you must account for the anticipated change in yo ur preliminary estimate. You may

account for such a change using a quantifiable metric (e.g., the ratio of the number of tools that are expected to be vented to the stack sy stem in the current ye ar as compared to the previous reporting ye ar, ratio of the expected number of wafer starts in the current reporting ye ar as compared to the previous reporting year), engineering judgment, or other industry standard practice.Page 17 of 100

(2) Method selection for stack sy stems in the fab . If the calculations under paragraph (i)(1) of this section, as well as any subsequent annual measurements and calculations under this subpart, indicate that the stack sy stem meets the criteria in paragraph (i)(2)(i) through (iii) of th is section, then you may

comply with either paragraph (i)(3) of this section (stack test method) or paragraph (i)(4) of this section (method to estimate emissions from the stack sy stems that are not tested). If the stack s ys tem does not meet all three crit eria in paragraph (i)(2)(i) through (iii) of this section, then you must comply with the stack test method specified in paragraph (i)(3) of this section.(i) The sum of annual emissions of fluorinated GHGs from all of the combined stack sy stems that are not tested in the fab must be less than 10,000 metric ton CO 2 e per year. (ii) When all stack sy stems in the fab are ordered from lowest to highest emitting in metric ton CO 2 e of fluorinated GHG per ye ar, each of the stack s ys tems that is not tested must be wi thin the set of the fab's lowest emitting fluorinated GHG stack sy stems that together emit 15 percent or less of total CO 2 e fluorinated GHG emissions from the fab. (iii) Fluorinated GHG emissions from each of the stack s ys tems that is not tested can onl y b e attributed to particular process tools during the test (that is, the stack sy stem that is not tested cannot be used as an alternative emission point or by pass stack s ys tem from other process tools not attributed to the untested stack s ys tem). (3) Stack s ys tem stack test method . For each stack sy stem in the fab for which testing is required, measure the emissions of each fluorinated GHG from the stack s ystem by conducting an emission test. In addition, measure the fab - specific consumption of each fluorinat ed GHG b y the tools that are vented to the stack s ys tems tested. Measure emissions and consumption of each fluorinated GHG as specified in § 98. 94(j). Develop fab - specific emission factors and calculate fab - level fluorinated GHG emissions using the procedures specified in paragraph (i)(3)(i)Page 18 of 100

through (viii) of this section. All emissions test data and procedures used in developing emission factors must be documented and recorded according to § 98. 97. (i) You must measure, and, if applicable, apportion the fa b - specific fluorinated GHG consumption of the tools that are vented to the stack sy stems that are tested during the emission test as specified in § 98. 94(j)(3). Calculate the consumption for each fluorinated GHG for the test period. (ii) You must calculate the emissions of each fluorinated GHG consumed as an input gas using Equation I - 17 of this subpart and each fluorinated GHG formed as a by- product gas using Equation I - 18 of this subpart and the procedures specified in paragraphs (i)(3)(ii)(A) through (E) of this section. If a stack sy stem is comprised of multiple stacks, you must sum the emissions from each stack in the stack sy stem when using Equation I - 17 or Equation I - 18 of this subpart.

m N m ism s i is 

### t X SV Q MW E   

# 

 

### * 10 * 10 1 * 1 * * 1

3 9 (Eq. I - 17) Where: E is = Total fluorinated GHG input gas i, emitted from stack s ys tem s, during the

sampling period (kg). X ism = Average concentration of fluorinated GHG input gas i in stack sy stem s,

during the time interval m (ppbv). MW i = Molecular weight of fluorinated GHG input gas i (g/g - mole). Q s = Flow rate of the stack s ys tem s, during the sampling period (m 3 /min). SV = Standard molar volume of gas (0.0240 m 3 /g - mole at 68 °F and 1 atm). Δtm = Length of time interval m (minutes). Each time interval in the FTIR sampling

period mus t be less than or equal to 60 minutes (for example an 8 hour sampling period would consist of at least 8 time intervals). 1/10 3 = Conversion factor (1 kilogram/1,000 grams). i = Fluorinated GHG input gas.Page 19 of 100

s = Stack sy stem. N = Total number of time interval s m in sampling period. m = Time interval.

Where: E ks = Total fluorinated GHG by- product gas k, emitted from stack s ys tem s, during

the sampling period (kg). Xks = Average concentration of fluorinated GHG b y- product gas k in stack s ys tem

s, during the time interval m (ppbv). MWk = Molecular weight of the fluorinated GHG b y- product gas k (g/g - mole). Q s = Flow rate of the stack s ys tem s, during the sampling period (m 3 /min). SV = Standard molar volume of gas (0.0240 m 3 /g - mole at 68 °F and 1 atm). Δtm = Length of time interval m (minutes). Each time interval in the FTIR sampling

period must be less than or equal to 60 minutes (for example an 8 hour sampling period would consist of at least 8 time intervals). 1/10 3 = Conversion factor (1 kilogram/1,000 grams). k = Fluorinated GHG b y- product gas. s = Stack sy stem. N = Total number of time intervals m in sampling period. m = Time interval. (A) If a fluorinated GHG is consumed during the sampling period, but emissions are not detected, use one - half of the fiel d detection limit you determined for that fluorinated GHG according to § 98. 94(j)(2) for the value of “X ism ” in Equation I - 17. (B) If a fluorinated GHG is consumed during the sampling period and detected intermittently

during the sampling period, use the d etected concentration for the value of “X ism ” in Equation I - 17 when available and use one - half of the field detection limit you determined for that fluorinated GHG according to § 98. 94(j)(2) for the value of “X ism ” when the fluorinated GHG is not detected.Page 20 of 100

(C) If an expected or possible by- product, as listed in Table I - 17 of this subpart, is detected intermittentl y during the sampling period, use the measured concentration for “Xksm ” in Equation I - 18 when available and use one - half of the field detection li mit you determined for that fluorinated GHG according to § 98. 94(j)(2) for the value of “Xksm ” when the fluorinated GHG is not detected. (D) If a fluorinated GHG is not consumed during the sampling period and is an expected by- product gas as listed in Tabl e I - 17 of this subpart and is not detected during the sampling period, use one - half of the field detection limit you determined for that fluorinated GHG according to § 98. 94(j)(2) for the value of “Xksm ” in Equation I - 18. (E) If a fluorinated GHG is not co nsumed during the sampling period and is a possible by- product gas as listed in Table I - 17 of this subpart, and is not detected during the sampling period, then assume zero emissions for that fluorinated GHG for the tested stack system. (iii) You must calculate a fab - specific emission factor for each fluorinated GHG input gas consumed (in kg of fluorinated GHG emitted per kg of input gas i consumed) in the tools that vent to stack sy stems that are tested, as applicable, using Equation I - 19 of this subpart. If the emissions of input gas i exceed the consumption of input gas i during the sampling period, then equate “E is ” to the consumption of input gas i and treat the difference between the emissions and consumption of input gas i as a by- product of the other input gases, using Equation I - 20 of this subpart.

Where:Page 21 of 100

EF if = Emission factor for fluorinated GHG input gas i, from fab f, representing 100

percent abatement s ys tem uptime (kg emitted/kg input gas consumed). E is = Mass emission of fluorinated GHG inp ut gas i from stack sy stem s, during

the sampling period (kg emitted). Activity

if = Consumption of fluorinated GHG input gas i, for fab f, in the tools vented to

the stack s ys tems being tested, during the sampling period, as determined following the proced

ures specified in § 98. 94(j)(3) (kg consumed). UT f = The total uptime of all abatement sy stems for fab f, during the sampling

period, as calculated in Equation I - 23 of this subpart (expressed as decimal fraction). If the stack system does not have abatement sy stems on the tools vented to the stack s ys tem, the value of this parameter is zero. aif = Fraction of fluorinated GHG input gas i used in fab f in tools with abatement

sy stems (expressed as a decimal fraction). dif = Fraction of fluorinated GHG input g as i destroyed or removed in abatement

sy stems connected to process tools in fab f, as calculated in Equation I - 24 A of this subpart (expressed as decimal fraction). If the stack s ys tem does not have abatement s ys tems on the tools vented to the stack sy stem , the value of this parameter is zero. f = Fab. i = Fluorinated GHG input gas. s = Stack sy stem. (iv) You must calculate a fab - specific emission factor for each fluorinated GHG formed as a b y- product (in kg of fluorinated GHG per kg of total fluorinated GHG consumed) in the tools vented to stack sy stems that are tested, as applicable, using Equation I - 20 of this subpart. When calculating the b y- product emission factor for an input gas for which emissions exceeded its consumption, exclude the consumption o f that input gas from the term “ ∑(Activityif ).”

Where: EF kf = Emission factor for fluorinated GHG b y- product gas k, from fab f,

representing 100 percent abatement s ys tem uptime (kg emitted/kg of all input gases consumed in tools vented to stack s ys tems that are tested).Page 22 of 100

E ks = Mass emission of fluorinated GHG b y- product gas k, emitted from stack

sy stem s, during the sampling period (kg emitted). Activity

if = Consumption of fluorinated GHG input gas i for fab f in tools vented to stack

sy stems that are tes ted, during the sampling period as determined following the procedures specified in § 98. 94(j)(3) (kg consumed). UT f = The total uptime of all abatement sy stems for fab f, during the sampling

period, as calculated in Equation I - 23 of this subpart (expresse d as decimal fraction). a f = Fraction of all fluorinated input gases used in fab f in tools with abatement

sy stems (expressed as a decimal fraction). dkf = Fraction of fluorinated GHG by- product gas k destroyed or removed in

abatement s ys tems connected to process tools in fab f, as calculated in Equation I - 24 B of this subpart (expressed as decimal fraction). f = Fab. i = Fluorinated GHG input gas. k = Fluorinated GHG b y- product gas. s = Stack sy stem. (v) You must calculate annual fab - level emissions of eac h fluorinated GHG consumed using Equation I - 21 of this section.

Where: E if = Annual emissions of fluorinated GHG input gas i (kg/ye ar) from the stack

sy stems that are tested for fab f. EF if = Emission factor for fluorinated GHG input gas i emitted from fab f, as

calculated in Equation I - 19 of this subpart (kg emitted/kg input gas consumed). C if = Total consumption of fluorinated GHG input gas i in tools that are vented to

stack sy stems that are tested, for fab f, for the reporting year, as calculated usi ng Equation I - 13 of this subpart (kg/ye ar). UT f = The total uptime of all abatement sy stems for fab f, during the reporting year,

as calculated using Equation I - 23 of this subpart (expressed as a decimal fraction).Page 23 of 100

aif = Fraction of fluorinated GHG input g as i used in fab f in tools with abatement

sy stems (expressed as a decimal fraction). dif = Fraction of fluorinated GHG input gas i destroyed or removed in abatement

sy stems connected to process tools in fab f that are included in the stack testing option, as calculated in Equation I - 24 A of this subpart (expressed as decimal fraction). f = Fab. i = Fluorinated GHG input gas. (vi) You must calculate annual fab - level emissions of each fluorinated GHG by- product formed using Equation I - 22 of this section.

Where: Ekf = Annual emissions of fluorinated GHG b y- product k (kg/ye ar) from the stack

sy stems that are tested for fab f. EF kf = Emission factor for fluorinated GHG b y- product k, emitted from fab f, as

calculated in Equation I - 20 of this subpart (kg emitted/kg of all fluorinated input gases consumed). C if = Total consumption of fluorinated GHG input gas i in tools that are vented to

stack sy stems that are tested, for fab f, for the reporting year, as calculated using Equation I - 13 of this subpart. UT f = The total uptime of all abatement sy stems for fab f, during the reporting year

as calculated using Equation I - 23 of this subpart (expressed as a decimal fraction). a f = Fraction of fluorinated input gases used in fab f in tools with abatement

sy stems (e xpressed as a decimal fraction). dkf = Fraction of fluorinated GHG by- product k destroyed or removed in

abatement s ys tems connected to process tools in fab f that are included in the stack testing option, as calculated in Equation I - 24 B of this subpart (expressed as decimal fraction). f = Fab. i = Fluorinated GHG input gas. k = Fluorinated GHG b y- productPage 24 of 100

(vii) When using the stack testing method described in this paragraph (i), you must calculate abatement s ys tem uptime on a fab basis using Equation I - 23 of this subpart. When calculating abatement s ystem uptime for use in Equation I - 19 and I - 20 of this subpart, you must evaluate the variables “Td pf ” and “UT pf

” for the sampling period instead of the reporting ye ar.

Where: UT f = The average uptime factor fo r all abatement s ys tems in fab f (expressed as a

decimal fraction). Td pf = The total time, in minutes, that abatement s ys tem p, connected to process

tool(s) in fab f, is not in operational mode as defined in § 98. 98. UT pf = Total time, in minutes per year, in which the tool(s) connected at any point during the ye ar to abatement sy stem p, in fab f could be in operation. For determining the amount of tool operating time, you may assume that tools that were installed for the whole of the ye ar were operated for 525,600 minutes per year. For tools that were installed or uninstalled during the year, yo u must prorate the operating time to account for the days in which the tool was not installed; treat any partial day that a tool was installed as a full day (1,440 m inutes) of tool operation. For an abatement sy stem that has more than one connected tool, the tool operating time is 525,600 minutes per year if there was at least one tool installed at all times throughout the ye ar. If yo u have tools that are idle with no gas flow through the tool, you may calculate total tool time using the actual time that gas is flowing through the tool. f = Fab. p = Abatement s ys tem. (viii) When using the stack testing option described in this paragraph (i), you must calculate the weighted - average fraction of each fluorinated input gas i and each fluorinated b yproduct gas k destro ye d or removed in abatement sy stems for each fab f, as applicable, by using Equation I - 24 A (for input gases) and Equation I - 24B (for by- product gases) of this subpart. 

#  



     j ij

ijf j ij

ij ijf if 

### U

C DRE U C d )]

1 ( [ ] )) 1 ( [ (Eq. I - 24 A )Page 25 of 100 

#       j ijk

ijf j jk

ijk ijf kf 

### B

C DRE B C d )

( ) ( (Eq. I - 24 B )

Where: dif = The average weighted fraction of fluorinated GHG input gas i destro yed or

removed in abatement s ystems in fab f (expressed as a decimal fraction). dk f = The average weighted fraction of fluorinated GHG by- product gas k

destroyed or removed in abatement s ys tems in fab f (expressed as a decimal fraction). C ijf = The amount of fluorinated GHG input gas i consumed for process type j fed

into abatement sy stems in fab f as calculated using Equation I - 13 of this subpart (kg). (1 - U ij ) = Th e default emission factor for input gas i used in process type j , from

applicable Table I - 3 to I - 7 of this subpart. B ij k = Th e default by- product gas formation rate factor for by- product gas k from

input gas i used in process ty pe j, from applicable Table I - 3 to I - 7 of this subpart. DRE ij = Destruction or removal efficiency for fluorinated GHG input gas i in abatement s ys tems connected to process tools where process ty pe j is u sed (expressed as a decimal fraction) determined according to § 98. 94(f). DRE j k = Destruction or removal efficiency for fluorinated GHG by- product gas k in abatement s ys tems connected to process tools where input gas i is used in process type j (expressed as a decimal fraction) determined according to § 98. 94(f). f = fab. i = Fluorinated GHG input gas. j = Process ty pe. (4) Method to calculate emissions from stack sy stems that are not tested . You must calculate annual fab - level emi ssions of each fluorinated GHG input gas and by- product gas forPage 26 of 100

those fluorinated GHG listed in paragraphs (i)(4)(i) and (ii) of this section using default utilization and by- product formation rates as shown in Tables I - 11, I - 12, I - 13, I - 14, or I - 15 of thi s subpart, as applicable, and b y using Equations I - 8, I - 9, and I - 13 of this subpart. When using Equations I - 8, I - 9, and I - 13 of this subpart to fulfill the requirements of this paragraph, you must use, in place of the term C ij in each equation, the total c onsumption of each fluorinated GHG meeting the criteria in paragraph (i)(4)(i) of this section or that is used in tools vented to the stack sy stems that meet the criteria in paragraph (i)(4)(ii) of this section. You must use, in place of the term aij , the fraction of fluorinated GHG meeting the criteria in paragraph (i)(4)(i) of this section used in tools with abatement sy stems or that is used in tools with abatement sy stems that are vented to the stack s ys tems that meet the criteria in paragraph (i)(4)(ii) of this section. You also must use the results of Equation s I - 24 A and I - 24B of this subpart in place of the terms dij in Equation I - 8 of this subpart and d jk in Equation I - 9 of this subpart, respectively , and use the results of Equation I - 23 of this subpart in place of the results of Equation I - 15 of this subpart for the term UT ij . (i) Calculate emissions from consumption of each intermittent low - use fluorinated GHG as defined in § 98. 98 of this subpart using the default utilization and by- product formatio n rates and equations specified in paragraph (i)(4) of this section. If a fluorinated GHG was not being used during the stack testing and does not meet the definition of intermittent low - use fluorinated GHG in § 98. 98, then yo u must test the stack sy stems associated with the use of that fluorinated GHG at a time when that gas is in use at a magnitude that would allow you to determine an emission factor for that gas according to the procedures specified in paragraph (i)(3) of this section.Page 27 of 100

(ii) Calculate emi ssions from consumption of each fluorinated GHG used in tools vented to stack sy stems that meet the criteria specified in paragraphs (i)(2)(i) through (i)(2)(iii) of this section, and were not tested according to the procedures in paragraph (i)(3) of this section. Calculate emissions using the default utilization and by- product formation rates and equations specified in paragraph (i)(4) of this section. If you are using a fluorinated GHG not listed in Tables I - 11, I - 12, I - 13, I - 14, or I - 15 of this subpart, then you must assume utilization and byproduct formation rates of zero for that fluorinated GHG. (5) To determine the total emissions of each fluorinated GHG from each fab under this stack testing option, you must sum the emissions of each fluorinated GHG determined from the procedures in paragraph (i)(3) of this section with the emissions of the same fluorinated GHG determined from the procedures in paragraph (i)(4) of this section. Sum the total emissions of each fluorinated GHG from all fabs at your fac ility to determine the facility- level emissions of each fluorinated GHG. **§ 98. 94**  **Monitoring and QA/QC requirements.** (a) [Reserved] (b) For purposes of Equation I - 12 of this subpart, you must estimate fab - wide gas specific heel factors for each container ty pe for each gas used, according to the procedures in paragraphs (b)(1) through (b)(5) of this section. This paragraph (b) does not apply to fluorinated GHGs or N 2 O that your fab uses in quantities of less than 50 kg in one reporting ye ar and for which you calculate emissions as equal to consumption under § 98. 93(a)(1), (a)(2), or (b), or for any intermittent low - use fluorinated GHG for which you calculate emissions according to § 98. 93(i)(4)(i).Page 28 of 100

(1) Base your fab - wide gas - specific heel factors on the trigger point for change out of a container for each container size and ty pe for each gas used. Fab - wide gas - specific heel factors must be expressed as the ratio of the trigger point for change out, in terms of mass, to the initial mass in the container, a s determined by paragraphs (b)(2) and (3) of this section. (2) The trigger points for change out you use to calculate fab - wide gas - specific heel factors in paragraph (b)(1) of this section must be determined b y monitoring the mass or the pressure of your c ontainers. If you monitor the pressure, convert the pressure to mass using the ideal gas law, as displayed in Equation I - 25 of this subpart, with the appropriate Z value selected based upon the properties of the gas.

Where: p = Absolute pressure of the gas (Pa). V = Volume of the gas container (m 3 ). Z = Compressibility factor. n = Amount of substance of the gas (moles). R = Gas constant (8.314 Joule/Kelvin mole). T = Absolute temperature (K). (3) The initial mass you use to calculate a fab - wide gas - specific heel factor in paragraph (b)(1) of this section may be based on the weight of the gas provided to you in gas supplier documents; however, yo u remain responsible for the accuracy of these masses and weights under this subpart. (4) If a containe r is changed in an exceptional circumstance, as specified in paragraphs (b)(4)(i) and (ii) of this section, you must weigh that container or measure the pressure of that container with a pressure gauge, in place of using a heel factor to determine the resi dual weightPage 29 of 100

of gas. When using mass - based trigger points for change out, you must determine if an exceptional circumstance has occurred based on the net weight of gas in the container, excluding the tare weight of the container. (i) For containers with a m aximum storage capacity of less than 9.08 kg (20 lbs) of gas, an exceptional circumstance is a change out point that differs b y more than 50 percent from the trigger point for change out used to calculate your fab - wide gas - specific heel factor for that gas and container typ e. (ii) For all other containers, an exceptional circumstance is a change out point that differs by more than 20 percent from the trigger point for change out used to calculate your fab - wide gas - specific heel factor for that gas and container ty pe. (5) You must re - calculate a fab - wide gas - specific heel factor if you execute a process change to modify

the trigger point for change out for a gas and container type that differs b y more than 5 percent from the previously used trigger point for change out for that gas and container type. (c) You must develop apportioning factors for fluorinated GHG and N 2 O consumption (including the fraction of gas consumed b y process tools connected to abatement systems as in Equations I - 8, I - 9, I - 10, I - 19, I - 20 , I - 21, and I - 22 of this subpart), to use in the equations of this subpart for each input gas i, process sub - ty pe, process ty

pe, stack s ys tem, and fab as appropriate, using a fab - specific engineering model that is documented in your site GHG Monitoring Plan as required under § 98. 3(g)(5). This model must be based on a quantifiable metric, such as wafer passes or wafer starts, or direct measurement of input gas consumption as specified in paragraph (c)(3) of this section. To verify your model, you must demon strate its precision and accuracy by adhering to the requirements in paragraphs (c)(1) and (2) of this section.Page 30 of 100

(1) You must demonstrate that the fluorinated GHG and N 2 O apportioning factors are developed using calculations that are repeatable, as defined in § 98. 98. (2) You must demonstrate the accuracy of your fab - specific model b y comparing the actual amount of input gas i consumed and the modeled amount of input gas i consumed in the fab, as follows: (i) You must anal yz e actual and modeled gas consumpti on for a period when the fab is at a representative operating level (as defined in § 98. 98) lasting at least 30 day s but no more than the reporting ye ar. (ii) You must compare the actual gas consumed to the modeled gas consumed for one fluorinated GHG repo rted under this subpart for the fab. You must certify that the fluorinated GHG selected for comparison corresponds to the largest quantity, on a mass basis, of fluorinated GHG consumed at the fab during the reporting ye ar for which you are required to appo rtion following the procedures specified in § 98. 93(a), (b), or (i). You may compare the actual gas consumed to the modeled gas consumed for two fluorinated GHGs and demonstrate conformance according to paragraph (c)(2)(iii) of this section on an aggregate use basis for both fluorinated GHGs if one of the fluorinated GHGs selected for comparison corresponds to the largest quantity , on a mass basis, of fluorinated GHGs used at each fab that requires apportionment during the reporting year. (iii) You must dem onstrate that the comparison performed for the largest quantity of gas(es), on a mass basis, consumed in the fab in paragraph (c)(2)(ii) of this section, does not result in a difference between the actual and modeled gas consumption that exceeds 20 percent relative to actual gas consumption, reported to two significant figures using standard rounding conventions.Page 31 of 100

(iv) If you are required to apportion gas consumption and you use the procedures in § 98. 93(i) to calculate annual emissions from a fab, you must verify your apportioning factors using the procedures in paragraphs (c)(2)(ii) and (iii) of this section such that the time period specified in paragraph (c)(2)(i) of this section and the last day you perform the sampling events specified under § 98. 93(i)( 3) occur in the same accounting month. (v) If your facility

has multiple fabs with a single centralized fluorinated - GHG supply sy stem, you must verify

that your apportioning model can apportion fluorinated GHG consumption among the fabs by adhering to the procedures in paragraphs (c)(2)(ii) through (c)(2)(iv) of this section. (3) As an alternative to developing apportioning factors for fluorinated GHG and N 2 O consumption using a fab - specific engineering model, you may develop apportioning factors through th e use of direct measurement using gas flow meters and weigh scales to measure process sub - ty

pe, process ty

pe, stack s ys tem, or fab - specific input gas consumption. You may use a combination of apportioning factors developed using a fab - specific engineering model and apportioning factors developed through the use of direct measurement, provided this is documented in your site GHG Monitoring Plan as required under 98.3(g)(5). (d) - (e) [Reserved] (f) If your fab emplo ys abatement sy stems and you elect to reflect emission reductions due to these s ys tems, or if your fab employ s abatement sy stems designed for fluorinated GHG abatement and you elect to calculate fluorinated GHG emissions using the stack test method under § 98.93(i), you must comply with the requirements of paragraphs (f)(1) through (f)(3) of this section. I f you use an average of properl y measured destruction or removal efficiencies for a gas and process sub - ty

pe or process type combination, as applicable, in your emissionPage 32 of 100

calculations under § 98. 93(a), (b), and/or (i), you must also adhere to procedures in paragraph (f)(4) of this section. (1) You must certify

and document that the abatement sy stems are properly installed, operated, and maintained according to the site maintenance plan for abatement s ys tems that is developed and maintained in your records as specified in § 98. 97(d)(9). (2) You must calculate and document the uptime of abatement s ys tems using Equation I 15 or I - 23 of this subpart, as applicable. (3) If you use default destruction and removal efficiency values in your emissions calculations under § 98. 93(a), (b), and/or (i), you must certify and document that the abatement sy stems at your facility

for which you use default destruction or removal efficiency values are specificall y designed for fluorinated GHG or N 2 O abatement, as applicable. If you elect to calculate fluorinated GHG emissions using the stack test method under § 98. 93(i), you must also certify that you have included and accounted for all abatement sy stems designed for fluorinated GHG abatement and any respective downtime in your emissions calculations under § 98. 93(i)(3). (4) If you do not use the default destruction or removal efficiency values in Table I - 16 of this subpart to calculate and report controlled emissions, including situations in which your fab employ s abatement s ys tems not specifically designed for fluorinated GHG or N 2 O abatement and yo u elect to reflect emission reduction due to these sy stems, you must use an average of properly measured destruction or removal efficiencies for each gas and process sub - ty pe or process ty

pe combination, as applicable, determined in accordance with procedures in paragraphs (f)(4)(i) through (vi) of this section. You must not use a default value from Table I - 16 of this subpart for any abatement sy stem not specificall y designed for fluorinated GHG and N 2 O abatement, or forPage 33 of 100

any gas and process type combination for which you have measured the destruction or removal efficiency according to the requirements of paragraphs (f)(4)(i) through (vi) of this section. (i) A properly

measured destruction or removal efficiency value must be determined in accordance with EPA 430 - R - 10 - 003 (incorporated by reference, see § 98. 7), or according to an alternative method approved by the Administrator (or authorized representative) as specified in paragraph (k) of this section. I f you are measuring destruction or removal efficiency according to EPA 430 - R - 10 - 003 (incorporated b y reference, see § 98. 7), you may follow the alternative procedures specified in Appendix A to this subpart. (ii) You must select and properl y measure the destruction or removal efficiency for a random sample of abatement sy stems to include in a random sampling abatement sy stem testing program in accordance with procedures in paragraphs (f)(4)(ii)(A) and (B) of this section. (A) For the first 2 ye ars for which your fab is required to report emissions of fluorinated GHG and N 2 O, for each abatement s ys tem gas and process sub - ty pe or process ty

pe combination, as applicable, a random sample of a minimum of 10 percent of installed abatement sy stems must be tested annually for a total of a minimum of 20 percent, or a minimum of 20 percent may

be tested in the first year. For every 3 - ye ar period following the initial 2 - ye ar period, a random samp le of at least 15 percent of installed abatement s ys tems must be tested for each gas and process sub - ty pe or process type combination; you may test 15 - percent in the first ye ar of the 3 - ye ar period, but you must test at least 5 percent each ye ar until 15 p ercent are tested. For each 3 - year period, you must determine the number of abatement sy stems to be tested based on the average number of abatement s ys tems in service over the 3 - ye ar period. If the required percent of the total number of abatement sy stems to be tested for each gas and process sub - ty pe or process ty

pe combination does not equate to a whole number, the number of s ys temsPage 34 of 100

to be tested must be determined by rounding up to the nearest integer. Except as provided in paragraph (f)(4)(v) of this sec tion, you may not retest an abatement s ys tem for any gas and process sub - ty

pe or process ty

pe combination, as applicable, until all of the abatement sy stems for that gas and process sub - ty pe or process type combination have been tested. (B) If testing of a randomly selected abatement sy stem would be disruptive to production, yo u may replace that s ys tem with another randomly selected sy stem for testing and return the sy stem to the sampling pool for subsequent testing. Any one abatement system must not be rep laced by

another randomly

selected s ys tem for more than three consecutive selections. When yo u have to replace a s ys tem in one year, you may select that specific s ys tem to be tested in one of the next two sampling years so that you may plan testing of that abatement sy stem to avoid disrupting production. (iii) If you elect to take credit for abatement s ys tem destruction or removal efficiency before completing testing on 20 percent of the abatement sy stems for that gas and process sub ty pe or process ty

pe co mbination, as applicable, you must use default destruction or removal efficiencies for a gas and process type combination. You must not use a default value from Table I - 16 of this subpart for any abatement s ys tem not specificall y designed for fluorinated GHG and N 2 O abatement, and must not take credit for abatement sy stem destruction or removal efficiency before completing testing on 20 percent of the abatement sy stems for that gas and process sub ty pe or process ty

pe combination, as applicable. Following t esting on 20 percent of abatement sy stems for that gas and process sub - ty pe or process ty

pe combination, you must calculate the average destruction or removal efficiency as the arithmetic mean of all test results for that gas and process sub - ty

pe or proces s type combination, until you have tested at least 30 percent of all abatement s ys tems for each gas and process sub - ty pe or process ty

pe combination. After testingPage 35 of 100

at least 30 percent of all sy stems for a gas and process sub - ty pe or process ty

pe combinatio n, you must use the arithmetic mean of the most recent 30 percent of s ys tems tested as the average destruction or removal efficiency . You may include results of testing conducted on or after January 1, 2011 for use in determining the site - specific destruction or removal efficiency for a given gas and process sub - ty pe or process type combination if the testing was conducted in accordance with the requirements of paragraph (f)(4)(i) of this section. (iv) If a measured destruction or removal efficiency is belo w the manufacturer- claimed fluorinated GHG or N 2 O destruction or removal efficiency for any abatement sy stem specificall y designed for fluorinated GHG or N 2 O abatement and the abatement sy stem is installed, operated, and maintained in accordance with the s ite maintenance plan for abatement sy stems that is developed and maintained in your records as specified in § 98. 97(d)(9), the measured destruction or removal efficiency

must be included in the calculation of the destruction or removal efficiency value for that gas and process sub - ty pe or process ty

pe. (v) If a measured destruction or removal efficiency is below the manufacturer - claimed fluorinated GHG or N 2 O destruction or removal efficiency for any abatement sy stem specificall y designed for fluorinated GH G or N 2 O abatement and the abatement sy stem is not installed, operated, or maintained in accordance with the site maintenance plan for abatement sy stems that is developed and maintained in your records as specified in § 98. 97(d)(9), you must implement corrective action and perform a retest to replace the measured value within the reporting year. In lieu of retesting within the reporting ye ar, you may use the measured value in calculating the average destruction or removal efficiency for the reporting ye ar, implement corrective action, and then include the same sy stem in the next abatement sy stem testing period in addition to the testing of randomly

selected sy stems for that next testing period. Regardless of whether you usePage 36 of 100

the lower measured destruction or removal efficiency and when you perform the retest of the abatement s ys tem, you must count the time that the abatement sy stem is not operated and maintained according to the site maintenance plan for abatement sy stems as not being in operational mode f

or purposes of calculating abatement sy stem uptime. (vi) If your fab uses redundant abatement s ys tems, you may account for the total abatement s ys tem uptime (that is, the time that at least one abatement s ys tem is in operational mode) calculated for a spec ific exhaust stream during the reporting year. (g) You must adhere to the QA/QC procedures of this paragraph when calculating fluorinated GHG and N 2 O emissions from electronics manufacturing production processes: (1) - (2) [Reserved] (3) Follow the QA/QC procedures in accordance with those in EPA 430 - R - 10 - 003 (incorporated b y reference, see § 98. 7), or the applicable QA/QC procedures specified in an alternative method approved by the Administrator (or authorized representative) according to paragraph (k) of this section, when calculating abatement sy stems destruction or removal efficiencies. If you are measuring destruction or removal efficiency according to EPA 430 - R - 10 - 003 (incorporated b y reference, see § 98. 7), and you elect to foll ow the alternative procedures specified in Appendix A to this subpart according to paragraph (f)(4)(i) of this section, you must follow any additional QA/QC procedures specified in Appendix A to this subpart. (4) As part of normal operations for each fab, the inventory of gas stored in containers at the beginning of the reporting ye ar must be the same as the inventory of gas stored in containers at the end of the previous reporting year. You must maintain records documenting the ye ar end and year beginning inventories under § 98. 97(a).Page 37 of 100

(h) You must adhere to the QA/QC procedures of this paragraph (h) when calculating annual gas consumption for each fluorinated GHG and N 2 O used at each fab and emissions from the use of each fluorinated heat transfer fluid on a fab basis. (1) Review all inputs to Equations I - 11 and I - 16 of this subpart to ensure that all inputs and outputs are accounted for. (2) Do not enter negative inputs into the mass balance Equations I - 11 and I - 16 of this subpart and ensure that no negativ e emissions are calculated. (3) Ensure that the inventory at the beginning of one reporting year is identical to the inventory at the end of the previous reporting ye ar. You must maintain records documenting the ye ar end and year beginning inventories under § 98. 97(a) and (r). (4) Ensure that the total quantity of gas i in containers in service at the end of a reporting ye ar is accounted for as if the in - service containers were full for Equation I - 11 of this subpart. Ensure also that the same quantity is ac counted for in the inventory of input gas i stored in containers at the beginning of the subsequent reporting ye ar. (i) All flow meters, weigh scales, pressure gauges, and thermometers used to measure quantities that are monitored under this section or use d in calculations under § 98. 93 must meet the calibration and accuracy requirements specified in § 98. 3(i). (j) Stack test methodology . For each fab for which you calculate annual emissions for any fluorinated GHG emitted from your facility using the stack test method according to the procedure specified in § 98. 93(i)(3), you must adhere to the requirements in paragraphs (j)(1) through (8) of this section. You may request approval to use an alternative stack test method and procedure according to paragraph (k) of this section.Page 38 of 100

(1) Stack s ys tem testing . Conduct an emissions test for each applicable stack sy stem according to the procedures in paragraphs (j)(1)(i) through (iv) of this section. (i) You must conduct an emission test during which the fab is operating at a representative operating level, as defined in § 98. 98, and with the abatement sy stems connected to the stack sy stem being tested operating with at least 90 percent uptime, averaged over all abatement s ys tems, during the 8 - hour (or longer) period f or each stack s ys tem, or at no less than 90 percent of the abatement sy stem uptime rate measured over the previous reporting year, averaged over all abatement sy stems. (ii) You must measure for the expected and possible by- products identified in Table I - 17 of this subpart and those fluorinated GHGs used as input fluorinated GHG in process tools vented to the stack s ys tem, except for any intermittent low - use fluorinated GHG as defined in § 98. 98. You must calculate annual emissions of intermittent low - use fluorinated GHGs b y adhering to the procedures in § 98. 93(i)(4)(i). (iii) If a fluorinated GHG being consumed in the reporting ye ar was not being consumed during the stack testing and does not meet the definition of intermittent low - use fluorinated GHG in § 98. 98, then you must test the stack sy stems associated with the use of that fluorinated GHG at a time when that gas is in use at a magnitude that would allow you to determine an emission factor for that gas. If a fluorinated GHG consumed in the reporting year was not being consumed during the stack testing and is no longer in use b y yo ur fab (e.g., use of the gas has become obsolete or has been discontinued), then you must calculate annual emissions for that fluorinated GHG according to the procedure specif ied in § 98. 93(i)(4). (iv) Although all applicable stack s ys tems are not required to be tested simultaneously , yo u must certify

that no significant changes in stack flow configuration occur between testsPage 39 of 100

conducted for any particular fab in a reporting ye ar . You must certify that no more than 10 percent of the total number of fluorinated GHG emitting process tools are connected or disconnected from a stack sy stem during testing. You must also certify that no process tools that were in operation at the start of the test period have been moved to a different stack sy stem during the test period (i.e., during or in between testing of individual stack sy stems) and that no point - of - use abatement sy stems have been permanently removed from service during the test period. You must document any changes in stack flow configuration in the emissions test data and report required to be kept as records under § 98. 97(i)(4). (2) Test methods and procedures . You must adhere to the applicable test methods and procedures specifie d in Table I - 9 to this subpart, or adhere to an alternative method approved by the Administrator (or authorized representative) according to paragraph (k) of this section. If you select Method 320 of 40 CFR part 63, Appendix A to measure the concentration of each fluorinated GHG in the stack s ys tem, you must complete a method validation according to Section 13 of Method 320 of 40 CFR part 63, Appendix A for each FTIR sy stem (hardware and software) and each tester (testing company). Method 320 validation is necessary when any change occurs in instrumentation, tester (i.e., testing company), or stack condition (e.g., acid gas vs. base). Measurement of new compounds require validation for those compounds according to Section 13 of Method 320 of 40 CFR part 63, Appendix A. The field detection limits achieved under your test methods and procedures must fall at or below the maximum field detection limits specified in Table I - 10 to this subpart. (3) Fab - specific fluorinated GHG consumption measurements . You must det ermine the amount of each fluorinated GHG consumed b y each fab during the sampling period for all process tools connected to the stack s ys tems tested under § 98. 93(i)(3), according to thePage 40 of 100

procedures in paragraphs (j)(3)(i) and (ii) of this section. This de termination must include apportioning gas consumption between stack s ys tems that are being tested and those that are not tested under § 98. 93(i)(2). (i) Measure fluorinated GHG consumption using gas flow meters, scales, or pressure measurements. Measure th e mass or pressure, as applicable, at the beginning and end of the sampling period and when containers are changed out. I f you elect to measure gas consumption using pressure (i.e., because the gas is stored in a location above its critical temperature) yo u must estimate consumption as specified in paragraphs (j)(3)(i)(A) and (B) of this section. (A) For each fluorinated GHG, you must either measure the temperature of the fluorinated GHG container(s) when the sampling periods begin and end and when containe rs are changed out, or measure the temperature of the fluorinated GHG container(s) every hour for the duration of the sampling period. Temperature measurements of the immediate vicinity of the containers (e.g., in the same room, near the containers) shall be considered temperature measurements of the containers. (B) Convert the sampling period - beginning, sampling period - ending, and container change - out pressures to masses using Equation I - 25 of this subpart, with the appropriate Z value selected based upon the properties of the gas (e.g., the Z value yi elded b y the Redlich, Kwong, Soave equation of state with appropriate values for that gas). Appl y the temperatures measured at or nearest to the beginning and end of the sampling period and to the time(s) when containers are changed out, as applicable. For each gas, the consumption during the sampling period is the difference between the masses of the containers of that gas at the beginning and at the end of the sampling period, summed across containers, including containers that are changed out.Page 41 of 100

(ii) For each fluorinated GHG gas for which consumption is too low to be accuratel y measured during the sampling period using gas flow meters, scales, or pressure measurements as specified in paragraph (j)(3)(i) of this section, you must follow at least one of the procedures listed in paragraph (j)(3)(ii)(A) through (C) of this section to obtain a consumption measurement. (A) Draw the gas from a single gas container if it is normally supplied from multiple containers connected by

a shared manifold. (B) Calculate consumption from pro - rated long - term consumption data (for example, calculate and use hourl y consumption rates from monthly consumption data). (C) Increase the duration of the sampling period for consumption measurement beyond the minimum duration specified in Table I - 9 of this subpart. (4) Emission test results . The results of an emission test must include the analy sis of samples, number of test runs, the average emission factor for each fluorinated GHG measured, the anal ytical method used, calculation of emissions, the fluorinated GHGs consumed during the sampling period, an identification of the stack s ys tems tested, and the fluorinated GHGs that were included in the test. The emissions test report must contain all information and data used to derive the fab - specific emission factor. (5) Emissions testing frequency . You must conduct emissions testing to develop fab specific emission factors on a frequency according to the procedures in paragraph (j)(5)(i) or (ii) of this section. (i) Annual testing . You must conduct an annual emissions test for each stack sy stem for which emissions testing is required under § 98. 93(i)(3), unless you meet the criteria in paragraph (j)(5)(ii) of this section to skip annual testing. E ach set of emissions testing for a stack s ys tem must be separated b y a period of at least 2 months.Page 42 of 100

(ii) Criteria to test less frequently . After the first 3 years of annual testing, you may calculate the relative standard deviation of the emission factors for each fluorinated GHG included in the test and use that anal ys is to determine the frequency of any future testing. As an alternative, you may conduct all three tests in less than 3 calendar ye ars for purposes of this paragraph (j)(5)(ii), but this does not relieve you of the obligation to conduct subsequent annual testing if you do not meet the criteria to test less frequently. If the criteria specified in paragraphs (j)(5)(ii)(A) and (B) of this section are met, you may use the arithmetic average of the three emission factors for each fluorinated GHG and fluorinated GHG b y- product for the current ye ar and the next 4 years with no further testing unless your fab operations are changed in a way that triggers the re - test criteria in paragraph (j)(8) of this section. In the fifth year following the last stack test included in the previous average, you must test each of the stack sy stems for which testing is required and repeat the relative standard deviation anal ys is using the results of the most recent three tests (i.e., the new test and the two previous tests conducted prior to the 4 year period). If the criteria specified in paragraphs (j)(5)(ii)(A) and (B) of this section are not met, you must use the emission factors developed from the most recent testing and continue annual testing. You may

conduct more than one test in the same year, but each set of emissions testing for a stack s ys tem must be separated by a period of at least 2 months. You may repeat the relative standard deviation anal ys is using the mo st recent three tests, including those tests conducted prior to the 4 year period, to determine if you are exempt from testing for the next 4 ye ars. (A) The relative standard deviation of the total CO 2 e emission factors calculated from each of the three te sts (expressed as the total CO 2 e fluorinated GHG emissions of the fab divided by the total CO 2 e fluorinated GHG use of the fab) is less than or equal to 15 percent.Page 43 of 100

(B) The relative standard deviation for all single fluorinated GHGs that individually accounted for 5 percent or more of CO 2 e emissions were less than 20 percent. (6) Subsequent measurements . You must make an annual determination of each stack sy stem's exemption status under § 98. 93(i)(2) by March 31 each ye ar. If a stack system that was previously

not required to be tested per § 98. 93(i)(2), no longer meets the criteria in § 98. 93(i)(2), you must conduct the emissions testing for the stack s ys tem during the current reporting and develop the fab - specific emission factor from the emissions testing. (7) Previous measurements . You may include the results of emissions testing conducted on or after January

1, 2011 for use in the relative standard deviation calculation in paragraph (j)(5)(ii) of this section if the previous results were determine d using a method meeting the requirements in paragraph (j)(2) of this section. You may request approval to use results of emissions testing conducted between January 1, 2011 and January

1, 2014 using a method that deviated from the requirements in paragrap h (j)(2) of this section by adhering to the requirements in paragraphs (j)(7)(i) through (j)(7)(iv) of this section. (i) Notify the Administrator (or an authorized representative) of your intention to use the results of the previous emissions testing. You must include in the notification the data and results yo u intend to use for meeting either reporting or recordkeeping requirements, a description of the method, and any deviations from the requirements in paragraph (j)(2) of this section. Your description must include an explanation of how any deviations do not affect the quality of the data collected. (ii) The Administrator will review the information submitted under paragraph (j)(7)(i) and determine whether the results of the previous emissions testing are adequate and issue anPage 44 of 100

approval or disapproval of the use of the results within 120 day s of the date on which you submit the notification specified in paragraph (j)(7)(i) of this section. (iii) If the Administrator finds reasonable grounds to disapprove the results of the previous emissions testing, the Administrator may request that you provide additional information to support the use of the results of the previous emissions testing. Failure to respond to any request made by

the Administrator does not af fect the 120 day

deadline specified in paragraph (j)(7)(ii) of this section. (iv) Neither the approval process nor the failure to obtain approval for the use of results from previous emissions testing shall abrogate yo ur responsibility to comply

with the requirements of this subpart. (8) Scenarios that require a stack s ys tem to be re - tested . By March 31 of each reporting ye ar, you must evaluate and determine whether any changes to your fab operations meet the criteria specified in paragraphs (j)(8)(i) throu gh (vi) of this section. If any of the scenarios specified in paragraph (j)(8)(i) through (vi) of this section occur, you must perform a re - test of any applicable stack s ys tem, irrespective of whether you have met the criteria for less frequent testing in paragraph (j)(5)(ii) of this section, before the end of the ye ar in which the evaluation was completed. You must adhere to the methods and procedures specified in § 98. 93(i)(3) for performing a stack s ys tem emissions test and calculating emissions. If you meet the criteria for less frequent testing in paragraph (j)(5)(ii), and yo u are required to perform a re - test as specified in paragraph (j)(8)(i) through (vi) of this section, the requirement to perform a re - test does not extend the date of the next sched uled test that was established prior to meeting the requirement to perform a re - test. If the criteria specified in paragraph (j)(5)(ii) of this section are not met using the results from the re - test and the two most recent stack tests, you must use the emi ssion factorsPage 45 of 100

developed from the most recent testing to calculate emissions and resume annual testing. You may resume testing less frequentl y according to your original schedule if the criteria specified in paragraph (j)(5)(ii) of this section are met usin g the most recent three tests. (i) Annual consumption of a fluorinated GHG used during the most recent emissions test (expressed in CO 2 e) changes b y more than 10 percent of the total annual fluorinated GHG consumption, relative to gas consumption in CO 2 e f or that gas during the year of the most recent emissions test (for example, if the use of a single gas goes from 25 percent of CO 2 e to greater than 35 percent of CO 2 e, this change would trigger a re - test). (ii) A change in the consumption of an intermittent low - use fluorinated GHG (as defined in § 98. 98) that was not used during the emissions test and not reflected in the fab - specific emission factor, such that it no longer meets the definition of an intermittent low - use fluorinated GHG. (iii) A decrease b y more than 10 percent in the fraction of tools with abatement sy stems, compared to the number during the most recent emissions test. (iv) A change in the wafer size manufactured b y the fab since the most recent emissions test. (v) A stack s ys tem that form erl y met the criteria specified under § 98. 93(i)(2) for not being subject to testing no longer meets those criteria. (vi) If a fluorinated GHG being consumed in the reporting ye ar was not being consumed during the stack test and does not meet the definitio n of intermittent, low - use fluorinated GHG in § 98. 98, then you must test the stack sy stems associated with the use of that fluorinated GHG at a time when that gas is in use as required in paragraph (j)(1)(iii) of this section.Page 46 of 100

(k) You may

request approval to use an alternative stack test method and procedure or to use an alternative method to determine abatement sy stem destruction or removal efficiency by adhering to the requirements in paragraphs (k)(1) through (6) of this section. An alternative method i s any

method of sampling and anal yz ing for a fluorinated GHG or N 2 O, or the determination of parameters other than concentration, for example, flow measurements, that is not a method specified in this subpart and that has been demonstrated to the Administrator's satisfaction, using Method 301 in appendix A of part 63, to produce results adequate for the Administrator's determination that it may be used in place of a method specified elsewhere in this subpart. (1) You may

use an alternative method from that specified in this subpart provided that yo u: (i) Notify

the Administrator (or an authorized representative) of your intention to use an alternative method. You must include in the notification a site - specific test plan describing the alternative method and procedures (the alternative test plan), the range of test conditions over which the validation is intended to be applicable, and an alternative means of calculating the fab level fluorinated GHG or N 2 O emissions or determining the abatement system destruc tion or removal efficiency

if the Administrator denies the use of the results of the alternative method under paragraph (k)(2) or (3) of this section. (ii) Use Method 301 in appendix A of part 63 of this chapter to validate the alternative method. This may include the use of onl y portions of specific procedures of Method 301 if use of such procedures are sufficient to validate the alternative method; and (iii) Submit the results of the Method 301 validation process along with the notification of intention and the rationale for not using the specified method.Page 47 of 100

(2) The Administrator will determine whether the validation of the proposed alternative method is adequate and issue an approval or disapproval of the alternative test plan within 120 day s of the date on which you submit the notification and alternative test plan specified in paragraph (k)(1) of this section. If the Administrator approves the alternative test plan, you are authorized to use the alternative method(s) in place of the methods described in paragraph (f)(4)(i) of this section for measuring destruction or removal efficiency or paragraph (j) of this section for conducting the stack test, as applicable, taking into account the Administrator's comments on the alternative test plan. Notwithstanding the requirement in the preceding sentence, you may at any time prior to the Administrator's approval or disapproval proceed to conduct the stack test using the methods specified in paragraph (j) of this section or the destruction or removal efficiency determination specified in (f)(4)(i) of this section if you use a method specified in this subpart instead of the requested alternative. If an alternative test plan is not approved and you still want to use an alternative method, you must recommence the proces s to have an alternative test method approved starting with the notification of intent to use an alternative test method specified in paragraph (k)(1)(i) of this section. (3) You must report the results of stack testing or destruction or removal efficiency determination using the alternative method and procedure specified in the approved alternative test plan. You must include in your report for an alternative stack test method and for an alternative abatement s ys tem destruction or removal efficiency determ ination the information specified in paragraph (j)(4) of this section, including all methods, calculations and data used to determine the fluorinated GHG emission factor or the abatement s ys tem destruction or removal efficiency . The Administrator will revi ew the results of the test using the alternative methods andPage 48 of 100

procedure and then approve or deny the use of the results of the alternative test method and procedure no later than 120 day s after they are submitted to EPA. (4) If the Administrator finds reaso nable grounds to dispute the results obtained by an alternative method for the purposes of determining fluorinated GHG emissions or destruction or removal efficiency

of an abatement s ys tem, the Administrator may require the use of another method specified in this subpart. (5) Once the Administrator has approved the use of the alternative method for the purposes of determining fluorinated GHG emissions for specific fluorinated GHGs and types of stack sy stems or abatement sy stem destruction or removal efficiency , that method may be used at any other facility

for the same fluorinated GHGs and ty pes of stack s ys tems, or fluorinated GHGs and abatement s ys tems, if the approved conditions apply to that facility . In granting approval, the Administrator may limit the range of test conditions and emission characteristics for which that approval is granted and under which the alternative method may be used without seeking approval under paragraphs (k)(1) through (4) of this section. The Administrator will specify those limitations, if any , in the approval of the alternative method. (6) Neither the validation and approval process nor the failure to validate or obtain approval of an alternative method shall abrogate your responsibility to comply

with the requirements of th is subpart. **§ 98. 95**  **Procedures for estimating missing data.** (a) Except as provided in paragraph (b) of this section, a complete record of all measured parameters used in the fluorinated GHG and N 2 O emissions calculations in § 98. 93 and § 98. 94 is required.Page 49 of 100

(b) If you use fluorinated heat transfer fluids at yo ur facility and are missing data for one or more of the parameters in Equation I - 16 of this subpart, you must estimate fluorinated heat transfer fluid emissions using the arithmetic average of the emiss ion rates for the reporting year immediately

preceding the period of missing data and the months immediately following the period of missing data. Alternatively , you may estimate missing information using records from the fluorinated heat transfer fluid su pplier. You must document the method used and values used for all missing data values. **§ 98. 96**  **Data reporting requirements.** In addition to the information required b y § 98. 3(c), you must include in each annual report the following information for each electronics manufacturing facility: (a) Annual manufacturing capacity of each fab at your facility used to determine the annual manufacturing capacity of your facility

in Equation I - 5 of this subpart. (b) For facilities that manufacture semiconductors, the diameter of wafers manufactured at each fab at your facility (mm). (c) Annual emissions, on a fab basis as described in paragraph (c)(1) through (5) of this section.(1) When you use the procedures specified in § 98. 93(a) of this subpart, each fluorinated GHG emitted from each process type for which your fab is required to calculate emissions as calculated in Equations I - 6 and I - 7 of this subpart. (2) When you use the procedures specified in § 98. 93(a) of this subpart, e ach fluorinated GHG emitted from each process type or process sub - ty pe as calculated in Equations I - 8 and I - 9 of this subpart, as applicable.Page 50 of 100

(3) N 2 O emitted from all chemical vapor deposition processes and N2 O emitted from the aggregate of other N 2 O - using manufacturing processes as calculated in Equation I - 10 of this subpart. (4) Each fluorinated heat transfer fluid emitted as calculated in Equation 1 - 16 of this subpart. (5) When you use the procedures specified in § 98. 93(i) of this subpart, annual emissions of each fluorinated GHG, on a f ab basis. (d) The method of emissions calculation used in § 98. 93 for each fab . (e) Annual production in terms of substrate surface area (e.g., silicon, PV - cell, glass) for each fab , including specification of the substrate . (f) - (l) [Reserved] (m) For the fab - specific apportioning model used to apportion fluorinated GHG and N 2 O consumption under § 98. 94(c), the following information to determine it is verified in accordance with procedures in § 98. 94(c)(1) and (2): (1) Identification of the quantifiable metric used in your fab - specific engineering model to apportion gas consumption for each fab, and/or an indication if direct measurements were used in addition to, or instead of, a quantifiable metric. (2) The start and end dates selected under § 98. 94(c)(2)( i). (3) Certification that the gas(es) you selected under § 98. 94(c)(2)(ii) for each fab corresponds to the largest quantity(ies) consumed, on a mass basis, of fluorinated GHG used at yo ur fab during the reporting year for which you are required to apporti on. (4) The result of the calculation comparing the actual and modeled gas consumption under § 98. 94(c)(2)(iii) and (iv), as applicable.Page 51 of 100

(5) If you are required to apportion fluorinated GHG consumption between fabs as required b y § 98. 94(c)(2)(v), certific ation that the gas(es) you selected under § 98. 94(c)(2)(ii) corresponds to the largest quantity(ies) consumed on a mass basis, of fluorinated GHG used at yo ur facility during the reporting ye ar for which you are required to apportion. (n) - (o) [Reserved] (p ) Inventory

and description of all abatement s ys tems through which fluorinated GHGs or N 2 O flow at your facility and for which you are claiming destruction or removal efficiency, including: (1) The number of abatement sy stems controlling emissions for each process sub - ty pe, or process type, as applicable, for each gas used in the process sub - ty pe or process ty

pe. (2) The basis of the destruction or removal efficiency being used (default or site specific measurement according to § 98. 94(f)(4)(i)) for each process sub - ty pe or process ty

pe and for each gas. (q) For all abatement sy stems through which fluorinated GHGs or N 2 O flow at your facility , for which you are reporting controlled emissions, the following: (1) Certification that all abatement sy stems at the facility have been installed, maintained, and operated in accordance with the site maintenance plan for abatement systems that is developed and maintained in your records as specified in § 98. 97(d)(9). (2) If you use default destruction or removal efficiency values in your emissions calculations under § 98. 93(a), (b), or (i), certification that the site maintenance plan for abatement s ys tems for which emissions are being reported contains manufacturer's recommendations and specifications for installation, operation, and maintenance for each abatement s ys tem.Page 52 of 100

(3) If you use default destruction or removal efficiency values in your emissions calculations under § 98. 93(a), (b), and/or (i), certification that the abatement sy stems for which emissions are being reported were specificall y designed for fluorinated GHG or N 2 O abatement, as applicable. You must support this certification by providing abatement sy stem supplier documentation stating that the sy stem was designed for fluorinated GHG or N 2 O abatement, as a pplicable. (4) For all stack s ys tems for which you calculate fluorinated GHG emissions according to the procedures specified in § 98. 93(i)(3), certification that you have included and accounted for all abatement s ys tems and any respective downtime in your emissions calculations under § 98. 93(i)(3). (r) You must report an effective fab - wide destruction or removal efficiency value for each fab at your facility calculated using Equation I - 26, I - 27, and I - 28 of this subpart, as appropriate.

Where: DRE FAB = Fab - wide effective destruction or removal efficiency value, expressed as a decimal fraction. FGHG i = Total emissions of each fluorinated GHG i emitted from electronics

manufacturing processes in the fab, calculated according to the procedures in § 98. 93. N 2 O j = Emissions of N 2 O from each N 2 O - emitting electronics manufacturing process

j in the fab, expressed in metric ton CO 2 equivalents, calculated according to the procedures in § 98. 93. UAFGHG = Total unabated emissions of fluorinated GHG emitted from elec tronics

manufacturing processes in the fab, expressed in metric ton CO 2 equivalents as calculated in Equation I - 27 of this subpart.Page 53 of 100

SFGHG = Total unabated emissions of fluorinated GHG emitted from electronics

manufacturing processes in the fab, expressed in metric ton CO 2 equivalents, as calculated in Equation I - 28 of this subpart. C N2O,j = Consumption of N 2 O in each N 2 O emitting process j, expressed in metric ton

CO 2 equivalents. 1 - UN2O,j = N 2 O emission factor for each N 2 O emitting process j from Table I - 8 of this

subpart. GWP i = GWP of emitted fluorinated GHG i from Table A - 1 of this part. GWP N2O = GWP of N 2 O from Table A - 1 of this part. i = Fluorinated GHG. j = Process Ty pe. (1) Use Equation I - 27 of this subpart to calculate total unabated emissions, in metric tons CO 2 e, of all fluorinated GHG emitted from electronics manufacturing processes whose emissions of fluorinated GHG you calculated according to the default utilization and by- product formation rate procedures in § 98. 93(a) or § 98. 93(i)(4). For ea ch fluorinated GHG i in process j, use the same consumption (C ij ), emission factors (1 −U ij ), and by- product formation rates (B ijk) to calculate unabated emissions as you used to calculate emissions in § 98. 93(a) or § 98. 93(i)(4).

Where: UAFGHG = Total unabated emissions of fluorinated GHG emitted from electronics

manufacturing processes in the fab, expressed in metric ton CO 2 e for which yo u calculated total emission according to the procedures in § 98. 93(a) or § 98. 93(i)(4). C ij = Total consumption of fluorinated GHG i, apportioned to process j, expressed

in metric ton CO 2 e, which you used to calculate total emissions according to the procedures in § 98. 93(a) or § 98. 93(i)(4). U ij = Process utilization rate for fluorinated GHG i, process ty pe j, which you used to calculate total emissions according to the procedures in § 98. 93(a) or § 98. 93(i)(4). GWP i = GWP of emitted fluorinated GHG i from Table A - 1 of this part.Page 54 of 100

GWP k = GWP of emitted fluorinated GHG b y- product k, from Table A - 1 of this part. B ijk = By- product formation rate of fluorinated GHG k created as a by- product per

amount of fluorinated GHG input gas i (kg) consumed by process type j (kg). i = Fluorinated GHG. j = Process Ty pe. k = Fluorinated GHG b y- product. (2) Use Equation I - 28 to calculate total unabated emissions, in metric ton CO 2 e, of all fluorinated GHG emitted from electronics manufacturing processes whose emissions of fluorinated GHG you calculated according to the stack testing procedures in § 98. 93(i)(3). For each set of processes, u se the same input gas consumption (C if ), input gas emission factors (EF if ), by- product gas emission factors (EF kf ), fractions of tools abated (aif and a f ), and destruction efficiencies (dif and dkf

) to calculate unabated emissions as you used to calculate emissions.

Where: SFGHG = Total unabated emissions of fluorinated GHG emitted from electronics

manufacturing processes in the fab, expressed in metric ton CO 2 e for which yo u calculated total emission according to the procedures in § 98. 93(i)(3). EF if = Emission factor for fluorinated GHG input gas i, emitted from fab f, as

calculated in Equation I - 19 of this subpart (kg emitted/kg input gas consumed). aif = Fraction of fluorinated GHG input gas i used in fab f in tools with abatement

sy stems (expressed a s a decimal fraction). dif = Fraction of fluorinated GHG i destroyed or removed in abatement s ys tems

connected to process tools in fab f, as calculated from Equation I - 24A, which yo u used to calculate total emissions according to the procedures in § 98. 93( i)(3) (expressed as a decimal fraction). C if = Total consumption of fluorinated GHG input gas i, of tools vented to stack

sy stems that are tested, for fab f, for the reporting year, expressed in metric ton CO 2 e, which you used to calculate total emissions according to the procedures in § 98. 93(i)(3) (expressed as a decimal fraction).Page 55 of 100

EF kf = Emission factor for fluorinated GHG b y- product gas k, emitted from fab f, as

calculated in Equation I - 20 of this subpart (kg emitted/kg of all input gases consumed in to ols vented to stack sy stems that are tested). a f = Fraction of input gases used in fab f in tools with abatement s ys tems

(expressed as a decimal fraction). dkf = Fraction of fluorinated GHG by- product k destroyed or removed in

abatement s ys tems connected t o process tools in fab f, as calculated from Equation I - 24B, which you used to calculate total emissions according to the procedures in § 98. 93(i)(3) (expressed as a decimal fraction). GWP i = GWP of emitted fluorinated GHG i from Table A - 1 of this part. GWP k = GWP of emitted fluorinated GHG b y- product k from Table A - 1 of this part. i = Fluorinated GHG. k = Fluorinated GHG b y- product. (s) Where missing data procedures were used to estimate inputs into the fluorinated heat transfer fluid mass balance equati on under § 98. 95(b), the number of times missing data procedures were followed in the reporting year and the method used to estimate the missing data. (t) - (v) [Reserved] (w) If you elect to calculate fab - level emissions of fluorinated GHG using the stack t est methods specified in § 98. 93(i), you must report the following in paragraphs (w)(1) and (2) for each stack s ys tem, in addition to the relevant data in paragraphs (a) through (v) of this section: (1) The date of any stack testing conducted during the reporting year, and the identity of the stack s ys tem tested. (2) An inventory

of all stack s ys tems from which process fluorinated GHG are emitted. For each stack s ys tem, indicate whether the stack sy stem is among those for which stack testing was performed a s per § 98. 93(i)(3) or not performed as per § 98. 93(i)(2). (x) I f the emissions you report under paragraph (c) of this section include emissions from research and development activities, as defined in § 98. 6, report the approximate percentage of total GHG emissions, on a metric ton CO 2 e basis, that are attributable to research andPage 56 of 100

development activities, using the following ranges: less than 5 percent, 5 percent to less than 10 percent, 10 percent to less than 25 percent, 25 percent to less than 50 percent, 50 percent and higher. (y) I f your semiconductor manufacturing facility emits more than 40,000 metric ton CO 2 e of GHG emissions, based on your most recentl y submitted annual report (beginning with the 2015 reporting year) as required in paragraph (c) of this section, from the electronics manufacturing processes subject to reporting under this subpart, you must prepare and submit a triennial (every

3 years) technology

assessment report to the Administrator (or an authorized representative) that meets the re quirements specified in paragraphs (y)(1) through (6) of this section. Any other semiconductor manufacturing facility may voluntaril y s ubmit this report to the Administrator. (1) The first report must be submitted with the annual GHG emissions report that is due no later than March 31, 2017, and subsequent reports must be delivered every 3 years no later than March 31 of the year in which it is due. (2) The report must include the information described in paragraphs (y)(2)(i) through (v) of this section. (i ) It must describe how the gases and technologies used in semiconductor manufacturing using 200 mm and 300 mm wafers in the United States have changed in the past 3 years and whether any of the identified changes are likely to have affected the emissions c haracteristics of semiconductor manufacturing processes in such a way that the default utilization and by- product formation rates or default destruction or removal efficiency factors of this subpart may need to be updated.Page 57 of 100

(ii) It must describe the effect on emissions of the implementation of new process technologies and/or finer line width processes in 200 mm and 300 mm technologies, the introduction of new tool platforms, and the introduction of new processes on previously tested platforms. (iii) It must describe the status of implementing 450 mm wafer technology and the potential need to create or update default emission factors compared to 300 mm technology . (iv) It must provide any

utilization and by- product formation rates and/or destruction or removal efficiency

data that have been collected in the previous 3 years that support the changes in semiconductor manufacturing processes described in the report. For any utilization , byproduct formation rate , and/or destruction or removal efficiency data submi tted, the report must describe , where available : methods used for the measurements, wafer size, film ty pe being manufactured, substrate type, the linewidth or technology node, process typ e, process subtype for chamber clean processes, the input gases used and measured, the utilization rates measured , and the by- product formation rates measured . (v) It must describe the use of a new gas, use of an existing gas in a new process ty pe or sub - ty pe, or a fundamental change in process technology . (3) If, on the basis of the information reported in paragraph (y)(2) of this section, the report indicates that GHG emissions from semiconductor manufacturing may have changed from those represented b y the default utilization and by - product formation rates in Tables I - 3 or I - 4, or the default destruction or removal efficiency values in Table I - 16 of this subpart, the report must lay out a data gathering and anal ys is plan focused on the areas of potential change. The plan must describe the elements in paragraphs (y)(3) (i) and (ii).Page 58 of 100

(i) The testing of tools to determine the potential effect on current utilization and byproduct formation rates and destruction or removal efficiency values under the new conditions. (ii) A planned anal ys is of the effect on overall facility emissions using a representative gas - use profile for a 200 mm, 300 mm, or 450 mm fab (depending on which technology is under consideration). (4) Multiple semiconductor manufacturing facilities may submit a single consolidated 3 - ye ar report as long as the f acility identifying information in § 98. 3(c)(1) and the certification statement in § 98. 3(c)(9) is provided for each facility for which the consolidated report is submitted. (5) The Administrator will review the report received and determine whether it is necessary to update the default utilization rates and by- product formation rates in Tables I - 3, I - 4, I - 11, and I - 12 of this subpart and default destruction or removal efficiency values in Table I - 16 of this subpart based on the following: (i) Whether the r evised default utilization and by- product formation rates and destruction or removal efficiency

values will result in a projected shift in emissions of 10 percent or greater. (ii) Whether new platforms, processes, or facilities that are not captured in current default utilization and by- product formation rates and destruction or removal efficiency values should be included in revised values. (iii) Whether new data are available that could expand the existing data set to include new gases, tools, or processe s not included in the existing data set (i.e. gases, tools, or processes for which no data are currently available). (6) The Administrator will review the reports within 120 day s and will notify you of a determination whether it is necessary to update any default utilization and by- product formationPage 59 of 100

rates and/or destruction or removal efficiency values. If the Administrator determines it is necessary to update default utilization and by- product formation rates and/or destruction or removal efficiency

values , you will then have 180 day s from the date you receive notice of the determination to execute the data collection and analy sis plan described in the report and submit those data to the Administrator. **§ 98. 97**  **Records that must be retained.** In addition to the information required b y § 98. 3(g), you must retain the following records: (a) All data used and copies of calculations made as part of estimating gas consumption and emissions, including all spreadsheets. (b) [Reserved] (c) Documentation for the fab - specific engineering model used to apportion fluorinated GHG and N 2 O consumption. This documentation must be part of your site GHG Monitoring Plan as required under § 98. 3(g)(5). At a minimum, you must retain the following: (1) A clear, detail ed description of the fab - specific model, including how it was developed; the quantifiable metric used in the model; all sources of information, equations, and formulas, each with clear definitions of terms and variables; all apportioning factors used to a pportion fluorinated GHG and N 2 O; and a clear record of any changes made to the model while it was used to apportion fluorinated GHG and N 2 O consumption across process sub - ty pes, process types, tools with and without abatement systems, stack s ys tems, and/o r fabs. (2) Sample calculations used for developing the gas apportioning factors (f ij ) for the two fluorinated GHGs used at your facility in the largest quantities, on a mass basis, during the reporting year.Page 60 of 100

(3) If you develop apportioning factors through the use of direct measurement according to § 98. 94(c)(3), calculations and data used to develop each gas apportioning factor. (4) Calculations and data used to determine and document that the fab was operating at representative operating levels, as define d in § 98. 98, during the apportioning model verification specified in § 98. 94(c). (d) For all abatement sy stems through which fluorinated GHGs or N 2 O flow at your facility , and for which you are reporting controlled emissions, the following in paragraphs ( d)(1) to (9) of this section: (1) Records of the information in paragraphs (d)(1)(i) though (iv) of this section: (i) Documentation to certify that each abatement sy stem or group of abatement sy stems is installed, maintained, and operated in accordance with the site maintenance plan for abatement sy stems that is specified in paragraph (d)(9) of this section. (ii) Documentation from the abatement s ys tem supplier describing the abatement sy stem's designed purpose and emission control capabilities for fluorinated GHG and N 2 O for which the s ys tems or group of sy stems is certified to abate, where available. (iii) If you use default destruction or removal efficiency values in your emissions calculations under § 98. 93(a), (b), and/or (i), certification that the abatement sy stems for which emissions are being reported were specificall y designed for fluorinated GHG and N 2 O abatement, as required under § 98. 94(f)(3), and certification that the site maintenance plan includes manufacturer's recommendations and specifications for installation, operation, and maintenance for all applicable abatement s ys tems.Page 61 of 100

(iv) Certification that yo u have included and accounted for all abatement sy stems and any respective downtime in your emissions calculations under § 98. 93(i)(3), as required under § 98. 94(f)(3). (2) Abatement sy stem calibration and maintenance records. (3) Where the default destruction or removal efficiency value is used, documentation from the abatement sy stem supplier describing the equipment's designed purpose and emi ssion control capabilities for fluorinated GHG and N 2 O. (4) Where properl y measured site - specific destruction or removal efficiencies are used to report emissions, the information in paragraphs (d)(4)(i) though (vi) of this section: (i) Dated certification by

the technician who made the measurement that the destruction or removal efficiency

is calculated in accordance with methods in EPA 430 - R - 10 - 003 (incorporated b y reference, see § 98. 7) and, if applicable Appendix A of this subpart, or an alternative method approved by the Administrator as specified in § 98. 94(k), complete documentation of the results of any initial and subsequent tests, the final report as specified in EPA 430 - R - 10 - 003 (incorporated b y reference, see § 98. 7) and, if applicable, the records and documentation specified in Appendix A of this subpart including the information required in paragraph (b)(7) of Appendix A of this subpart, or a final report as specified in an alternative method approved b y the Administrator as specified in § 98. 94 (k). (ii) The average destruction or removal efficiency of the abatement sy stems operating during the reporting ye ar for each process type and gas combination. (iii) A description of the calculation used to determine the average destruction or removal efficiency for each process ty

pe and gas combination, including all inputs to the calculation.Page 62 of 100

(iv) The records of destruction or removal efficiency measurements for abatement sy stems for all tests that have been used to determine the site - specific destruc tion or removal efficiencies currentl y being used. (v) A description of the method used for randomly selecting abatement sy stems for testing. (vi) The total number of sy stems for which destruction or removal efficiency was properl y measured for each proces s typ e and gas combination for the reporting ye ar. (5) In addition to the inventory specified in § 98. 96(p), the information in paragraphs (d)(5)(i) through (iii) of this section: (i) The number of abatement sy stems of each manufacturer, and model numbers, and the manufacturer's claimed fluorinated GHG and N 2 O destruction or removal efficiency , if any . (ii) Records of destruction or removal efficiency measurements over the in - use life of each abatement s ys tem. (iii) A description of the tool, with the proce ss ty pe or sub - ty

pe, for which the abatement sy stem treats exhaust. (6) Records of all inputs and results of calculations made accounting for the uptime of abatement s ys tems used during the reporting year, in accordance with Equations I - 15 or I - 23 of this subpart, as applicable. The inputs should include an indication of whether each value for destruction or removal efficiency is a default value or a measured site - specific value. (7) Records of all inputs and results of calculations made to determine the av erage weighted fraction of each gas destro yed or removed in the abatement s ys tems for each stack sy stem using Equation s I - 24 A and I - 24B of this subpart, if applicable. The inputs should includePage 63 of 100

an indication of whether each value for destruction or removal efficiency is a default value or a measured site - specific value. (8) Records of all inputs and the results of the calculation of the facility- wide emission destruction or removal efficiency factor calculated according to Equations I - 26, I - 27, and I - 28 of this subpart. (9) A site maintenance plan for abatement s ys tems, which must be maintained on - site at the facility

as part of the facility's GHG Monitoring Plan as described in § 98. 3(g)(5), and be developed and implemented according to paragraphs (d)(9)(i) through (iii) of this section. (i) The site maintenance plan for abatement s ys tems must be based on the abatement sy stem manufacturer's recommendations and specifications for installation, operation, and maintenance if you use default destruction and remo val efficiency values in your emissions calculations under § 98. 93(a), (b), and/or (i). If the manufacturer's recommendations and specifications for installation, operation, and maintenance are not available, you cannot use default destruction and removal efficiency values in your emissions calculations under § 98. 93(a), (b), and/or (i). If you use an average of properl y measured destruction or removal efficiencies determined in accordance with the procedures in § 98. 94(f)(4)(i) through (vi), the site maint enance plan for abatement s ys tems must be based on the abatement sy stem manufacturer's recommendations and specifications for installation, operation, and maintenance, where available. If you deviate from the manufacturer's recommendations and specificatio ns, you must include documentation that demonstrates how the deviations do not negativel y affect the performance or destruction or removal efficiency of the abatement sy stems. (ii) The site maintenance plan for abatement s ys tems must include a defined prev entative maintenance process and checklist.Page 64 of 100

(iii) The site maintenance plan for abatement s ys tems must include a corrective action process that you must follow whenever an abatement system is found to be not operating properl y. (e) Purchase records for gas purchased. (f) Invoices for gas purchases and sales. (g) Documents and records used to monitor and calculate abatement s ys tem uptime. (h) GHG Monitoring Plans, as described in § 98. 3(g)(5), must be completed by April 1, 2011. You must update your GHG Moni toring Plan to comply with § 98. 94(c) consistent with the requirements in § 98. 3(g)(5)(iii). (i) Retain the following records for each fab for which you elect to calculate fab - level emissions of fluorinated GHG using the procedures specified in § 98. 93(i)( 3) or (4). (1) Document all stack sy stems with emissions of fluorinated GHG that are less than 10,000 metric tons of CO 2 e per year and all stack systems with emissions of 10,000 metric tons CO 2 e per year or more. Include the data and calculation used to develop the preliminary estimate of emissions for each stack sy stem. (2) For each stack s ys tem, identify the method used to calculate annual emissions; either § 98. 93(i)(3) or (4). (3) The identity and total annual consumption of each gas identified as an intermittent low use fluorinated GHG as specified in § 98. 93(i)(4)(i) and defined in § 98. 98. (4) The emissions test data and reports (see § 98. 94(j)(4)) and the calculations used to determine the fab - specific emission factor, including the actual fab - specif ic emission factor, the average hourl y emission rate of each fluorinated GHG from the stack s ys tem during the test andPage 65 of 100

the stack s ys tem activity

rate during the test. The report must also contain any changes in the stack sy stem configuration during or betw een tests in a reporting ye ar. (5) The fab - specific emission factor and the calculations and data used to determine the fab - specific emission factor for each fluorinated GHG and by- product, as calculated using Equations I - 19 and I - 20 of § 98. 93(i)(3). (6) Calculations and data used to determine annual emissions of each fluorinated GHG for each fab. (7) Calculations and data used to determine and document that the fab was operating at representative operating levels, as defined in § 98. 98, during the stack t esting period. (8) A cop y of the certification that no significant changes in stack s ys tem flow configuration occurred between tests conducted for any particular fab in a reporting year, as required b y § 98. 94(j)(1)(iv) and any calculations and data supporting the certification. (9) The number of tools vented to each stack s ys tem in the fab. (j) If you report the approximate percentage of total GHG emissions from research and development activities under § 98. 96(x), documentation for the determination of the percentage of total emissions of each fluorinated GHG and/or N 2 O attributable to research and development activities, as defined in § 98. 6. (k) Annual gas consumption for each fluorinated GHG and N 2 O as calculated in Equation I - 11 of this subpart, including where your fab used less than 50 kg of a particular fluorinated GHG or N 2 O used at your facility for which you have not calculated emissions using Equations I - 6, I - 7, I - 8, I - 9, I - 10, I - 21, or I - 22 of this subpart, the chemical name of the GHG use d, the annual consumption of the gas, and a brief description of its use.Page 66 of 100

(l) All inputs used to calculate gas consumption in Equation I - 11 of this subpart, for each fluorinated GHG and N 2 O used. (m) Annual amount of each fluorinated GHG consumed for proce ss sub - ty pe, process ty pe, stack s ys tem, or fab, as appropriate, and the annual amount of N 2 O consumed for the aggregate of all chemical vapor deposition processes and for the aggregate of all other electronics manufacturing production processes, as calcul ated using Equation I - 13 of this subpart. (n) Disbursements for each fluorinated GHG and N 2 O during the reporting year, as calculated using Equation I - 12 of this subpart and all inputs used to calculate disbursements for each fluorinated GHG and N 2 O used i n Equation I - 12 of this subpart, including all fab - wide gas specific heel factors used for each fluorinated GHG and N2 O. If your fab used less than 50 kg of a particular fluorinated GHG during the reporting year, fab - wide gas - specific heel factors do not n eed to be reported for those gases. (o) Fraction of each fluorinated GHG or N 2 O fed into a process sub - ty pe, process type, stack sy stem, or fab that is fed into tools connected to abatement s ys tems. (p) Fraction of each fluorinated GHG or N 2 O destroyed or removed in abatement sy stems connected to process tools where process sub - ty pe, process type j is used, or to process tools vented to stack s ys tem j or fab f. (q) All inputs and results of calculations made accounting for the uptime of abatement sy stems us ed during the reporting ye ar, or during an emissions sampling period, in accordance with Equations I - 15 and/or I - 23 of this subpart, as applicable.Page 67 of 100

(r) For fluorinated heat transfer fluid emissions, inputs to the fluorinated heat transfer fluid mass balanc e equation, Equation I - 16 of this subpart, for each fluorinated heat transfer fluid used. (s) Where missing data procedures were used to estimate inputs into the fluorinated heat transfer fluid mass balance equation under § 98. 95(b), the estimates of those data. **§ 98. 98**  **Definitions.** Except as provided in this section, all of the terms used in this subpart have the same meaning given in the Clean Air Act and subpart A of this part. If a conflict exists between a definition provided in this subpart and a definition provided in subpart A, the definition in this subpart takes precedence for the reporting requirements in this subpart. Abatement s ys tem means a device or equipment that is designed to destroy or remove fluorinated GHGs or N 2 O in exhaust streams from one or more electronics manufacturing production processes, or for which the destruction or removal efficiency for a fluorinated GHG or N 2 O has been properl y measured according to the procedures under § 98. 94(f)(4), even if that abatement s ys tem is not de signed to destro y or remove fluorinated GHGs or N 2 O. The device or equipment is only

an abatement sy stem for the individual fluorinated GHGs or N 2 O that it is designed to destro y or remove or for the individual fluorinated GHGs or N 2 O for which destruction or removal efficiencies were properl y measured according to the procedures under § 98. 94(f)(4). Actual gas consumption means the quantity of gas used during wafer/substrate processing over some period based on a measured change in gas container weight or gas container pressure or on a measured volume of gas.Page 68 of 100

By- product formation means the creation of fluorinated GHGs during electronics manufacturing production processes or the creation of fluorinated GHGs by an abatement sy stem. Where the procedures in § 9 8. 93(a) are used to calculate annual emissions, by- product formation is the ratio of the mass of the b y- product formed to the mass flow of the input gas. Where the procedures in § 98. 93(i) are used to calculate annual emissions, by- product formation is the ratio of the mass of the by- product formed to the total mass flow of all fluorinated GHG input gases. Chamber cleaning is a process ty pe that consists of the process sub - ty pes defined in paragraphs (1) through (3) of this definition. (1) In situ plasma process sub - ty pe consists of the cleaning of thin - film production chambers, after processing substrates, with a fluorinated GHG cleaning reagent that is dissociated into its cleaning constituents b y a plasma generated inside the chamber where the film is pro duced. (2) Remote plasma process sub - ty pe consists of the cleaning of thin - film production chambers, after processing substrates, with a fluorinated GHG cleaning reagent dissociated by a remotely located plasma source. (3) In situ thermal process sub - ty pe consists of the cleaning of thin - film production chambers, after processing substrates, with a fluorinated GHG cleaning reagent that is thermally dissociated into its cleaning constituents inside the chamber where thin films are produced. Controlled emissi ons means the quantity of emissions that are released to the atmosphere after application of an emission control device ( e.g., abatement s ys tem). Destruction or removal efficiency (DRE) means the efficiency of an abatement sy stem to destroy or remove fluorinated GHGs, N 2 O, or both. The destruction or removal efficiency isPage 69 of 100

equal to one minus the ratio of the mass of all relevant GHGs exiting the abatement system to the mass of GHG entering the abatement sy stem. When GHGs are formed in an abatement s ys tem, de struction or removal efficiency is expressed as one minus the ratio of amounts of exiting GHGs to the amounts entering the s ys tem in units of CO 2 - equivalents (CO 2 e). Fab means the portion of an electronics manufacturing facility located in a separate phy si cal structure that began manufacturing on a certain date. Fluorinated heat transfer fluids means fluorinated GHGs used for temperature control, device testing, cleaning substrate surfaces and other parts, and soldering in certain types of electronics manuf

acturing production processes. Fluorinated heat transfer fluids do not include fluorinated GHGs used as lubricants or surfactants. For fluorinated heat transfer fluids under this subpart I, the lower vapor pressure limit of 1 mm Hg in absolute at 25 °C in the definition of Fluorinated greenhouse gas in § 98. 6 shall not apply . Fluorinated heat transfer fluids used in the electronics manufacturing sector include, but are not limited to, perfluoropolyethers, perfluoroalkanes, perfluoroethers, tertiary perfluor oamines, and perfluorocyclic ethers. Fully fluorinated GHGs means fluorinated GHGs that contain only single bonds and in which all available valence locations are filled b y fluorine atoms. This includes, but is not limited to, saturated perfluorocarbons, S F 6 , NF 3 , SF 5 CF 3 , C 4 F 8 O, fully fluorinated linear, branched, and cyclic alkanes, fully fluorinated ethers, fully

fluorinated tertiary

amines, full y fluorinated aminoethers, and perfluoropolyethers. Gas utilization means the fraction of input N 2 O or fluorinated GHG converted to other substances during the etching, deposition, and/or wafer and chamber cleaning processes. Gas utilization is expressed as a rate or factor for specific electronics manufacturing process sub ty pes or process typ es.Page 70 of 100

Heel mean s the amount of gas that remains in a gas container after it is discharged or offloaded; heel may

vary by container type. Input gas means a fluorinated GHG or N 2 O used in one of the processes described in § 98. 90(a)(1) through (4) Intermittent low - use fluorinated GHG , for the purposes of determining fluorinated GHG emissions using the stack testing method, means a fluorinated GHG that meets all of the following: (1) The fluorinated GHG is used by the fab but is not used during the period of stack testin g for the fab/stack system. (2) The emissions of the fluorinated GHG, estimated using the methods in § 98. 93(i)(4) do not constitute more than 5 percent of the total fluorinated GHG emissions from the fab on a CO 2 e basis. (3) The sum of the emissions of al l fluorinated GHGs that are considered intermittent low use gases does not exceed 10,000 metric tons CO 2 e for the fab for that year, as calculated using the procedures specified in § 98. 93(i)(1) of this subpart. (4) The fluorinated GHG is not an expected o r possible by- product identified in Table I 17 of this subpart. Maximum substrate starts means for the purposes of Equation I - 5 of this subpart, the maximum quantity

of substrates, expressed as surface area, that could be started each month during a reporting year based on the equipment installed in that facility and assuming that the installed equipment were fully utilized. Manufacturing equipment is considered installed when it is on the manufacturing floor and connected to required utilities.Page 71 of 100

Modeled gas consumed means the quantity of gas used during wafer/substrate processing over some period based on a verified facility- specific engineering model used to apportion gas consumption. Nameplate capacity means the full and proper charge of chemical specified by the equipment manufacturer to achieve the equipment's specified performance. The nameplate capacity is typicall y indicated on the equipment's nameplate; it is not necessarily the actual charge, which may

be influenced by

leakage and other emissions. Op erational mode means the time in which an abatement sy stem is properly installed, maintained, and operated according to the site maintenance plan for abatement sy stems as required in § 98. 94(f)(1) and defined in § 98. 97(d)(9). This includes being properl y operated within the range of parameters as specified in the site maintenance plan for abatement s ys tems. Plasma etching is a process ty pe that consists of any

production process using fluorinated GHG reagents to selectively remove materials from a substrat e during electronics manufacturing. The materials removed may include SiO 2 , SiO X - based or full y organic - based thin - film material, SiN, SiON, Si 3 N 4 , SiC, SiCO, SiCN, etc. (represented by the general chemical formula, Si wO X N yX z where w, x, y

and z are zero o r integers and X may be some other element such as carbon), substrate, or metal films (such as aluminum or tungsten). Process sub - ty

pe is a set of similar manufacturing steps, more closel y related within a broad process ty

pe. For example, the chamber clean ing process type includes in - situ plasma chamber cleaning, remote plasma chamber cleaning, and in - situ thermal chamber cleaning sub ty pes. Process ty

pes are broad groups of manufacturing steps used at a facility associated with substrate (e.g., wafer) proc essing during device manufacture for which fluorinated GHGPage 72 of 100

emissions and fluorinated GHG consumption is calculated and reported. The process typ es are Plasma etching/Wafer Cleaning and Chamber cleaning. Properly measured destruction or removal efficiency m eans destruction or removal efficiencies measured in accordance with EPA 430 - R - 10 - 003 (incorporated by reference, see § 98. 7), and, if applicable, Appendix A to this subpart, or by an alternative method approved by the Administrator as specified in § 98. 94 (k). The Random Sampling Abatement Sy stem Testing Program (RSASTP) means the required frequency

for measuring the destruction or removal efficiencies of abatement s ys tems in order to appl y properl y measured destruction or removal efficiencies to report controlled emissions. Redundant abatement s ys tems means a s ys tem that is specificall y designed, installed and operated for the purpose of destro yi ng fluorinated GHGs and N 2 O gases, or for which the destruction or removal efficiency for a fluorinated GHG or N 2 O has been properly measured according to the procedures under § 98. 94(f)(4), and that is used as a backup to the main fluorinated GHGs and N 2 O abatement s ys tem during those times when the main sy stem is not functioning or operating in accordance with desi gn and operating specifications. Repeatable means that the variables used in the formulas for the facility's engineering model for gas apportioning factors are based on observable and measurable quantities that govern gas consumption rather than engineering judgment about those quantities or gas consumption. Representative operating levels means (for purposes of verification of the apportionment model or for determining the appropriate conditions for stack testing) operating the fab, in terms of substrate s tarts for the period of testing or monitoring, at no less than 50 percent of installedPage 73 of 100

production capacity

or no less than 70 percent of the average production rate for the reporting ye ar, where production rate for the reporting year is represented in aver age monthly substrate starts. For the purposes of stack testing, the period for determining the representative operating level must be the period ending on the same date on which testing is concluded. Stack sy stem means one or more stacks that are connecte d by a common header or manifold, through which a fluorinated GHG - containing gas stream originating from one or more fab processes is, or has the potential to be, released to the atmosphere. For purposes of this subpart, stack s ys tems do not include emergency vents or by

pass stacks through which emissions are not usuall y vented under typical operating conditions. Trigger point for change out means the residual weight or pressure of a gas container type that a facility uses as an indicator that operators nee d to change out that gas container with a full container. The trigger point is not the actual residual weight or pressure of the gas remaining in the cylinder that has been replaced. Unabated emissions means a gas stream containing fluorinated GHG or N2 O that has exited the process, but which has not yet been introduced into an abatement sy stem to reduce the mass of fluorinated GHG or N 2 O in the stream. If the emissions from the process are not routed to an abatement s ys tem, or are routed to an abatement device that is not in an operational mode, unabated emissions are those fluorinated GHG or N 2 O released to the atmosphere. Uptime means the ratio of the total time during which the abatement s ys tem is in an operational mode, to the total time during which production process tool(s) connected to that abatement s ys tem are normally in operation. Wafer cleaning is a process ty pe that co nsists of any

production process using fluorinated GHG reagents to clean wafers at any step during production.Page 74 of 100

Wafer passes is a count of the number of times a wafer substrate is processed in a specific process sub - ty

pe, or ty pe. The total number of wafer passes over a reporting year is the number of wafer passes per tool multiplied by the number of operational process tools in use during the reporting year. Wafer starts means the number of fresh wafers that are introduced into the fabrication sequence each month. It includes test wafers, which means wafers that are exposed to all of the conditions of process characterization, including but not limited to actual etch conditions or actual film deposition conditions. **Table I**
**– 1 to Subpart I** 
**— Default Emission Fac**  **tors for Threshold Applicability Determination**  **Product type Emission factors EF**  **i CF**  **4 C**  **2 F**  **6 CHF**  **3 C**  **3 F**  **8 NF**  **3 SF**  **6** Semiconductors (kg/m 2 ) 0.90 1.00 0.04 0.05 0.04 0.20 LCD (g/m2 ) 0.50 NA NA NA 0.90 4.00 MEMS (kg/m2 ) NA NA NA NA NA 1.02 **Notes:** NA denotes not applicable based on currently available information.Page 75 of 100

**Table I**
**– 2 to Subpart I** 
**— Examples of Fluorinated GHGs Used by the Electronics Industry**  **Product type**  **Fluorinated GHGs used during manufacture**  Electronics CF 4 , C 2 F 6 , C 3 F 8 , c - C 4 F 8 , c - C 4 F 8 O, C 4 F 6 , C 5 F 8 , CHF 3 , CH 2 F 2 , NF 3 , SF 6 , and fluorinated HTFs

(CF 3 - (O

–CF(CF 3 ) - CF 2 ) n - (O

–CF 2 ) m- O

–CF 3 , C nF 2n+2 , C nF 2n+1 (O)C mF 2m+1 , C nF 2nO, (C nF 2n+1 ) 3N ). **Table I**
**– 3 to Subpart I of Part**  **98**
**— Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization**  **Rates (U ij**  **) and By -**  **Product Formation Rates (B ijk**  **) for Semiconductor Manufacturing for 150mm and 200 mm Wafer Sizes**  **Process type/Sub**  **- type**  **Process gas i**

**CF 4**  **C 2**  **F 6**  **CHF 3**  **CH 2**  **F 2**  **C 2**  **HF 5**  **CH 3**  **F C**  **3 F**  **8 C**  **4 F**  **8 NF**  **3 SF**  **6 C**  **4 F**  **6 C**  **5 F**  **8 C**  **4 F**  **8 O** 

**ETCHING/WAFER CLEANING** 1

– U i 0.81 0.72 0. 5 1 0.13 0.064 0. 70 NA 0.14 0.19 0.55 0.17 0.072 NA BCF 4 NA 0.10 0.085 0.079 0.077 NA NA 0.11 0.0040 0.1 3 0.13 NA NA BC 2 F 6 0.046 NA 0.030 0.025 0.024 0.0034 NA 0.037 0.025 0.11 0.11 0.014 NA BC 4 F 6 NA NA NA NA NA NA NA NA NA NA NA NA NA BC 4 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA BC 5 F 8 0.0012 NA 0.0012 NA NA NA NA 0.0086 NA NA NA NA NA BCHF 3 0.10 0.047 NA 0.049 NA NA NA 0.040 NA 0.0012 0.066 0.0039 NA **CHAMBER CLEANING** In situ plasma cleaning: 1

– U i 0.92 0.55 NA NA NA NA 0.40 0.10 0.18 NA NA NA 0.14 BCF 4 NA 0.19 NA NA NA NA 0.20 0.11 0.050 NA NA NA 0.13 BC 2 F 6 NA NA NA NA NA NA NA NA NA NA NA NA 0.045 BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA Remote plasma cleaning: 1

– U i NA NA NA NA NA NA NA NA 0. 01 7 NA NA NA NA BCF 4 NA NA NA NA NA NA NA NA 0.015 NA NA NA NA BC 2 F 6 NA NA NA NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA In situ thermal cleaning: 1

– U i NA NA NA NA NA NA NA NA NA NA NA NA NAPage 76 of 100

**Process type/Sub**  **- type**  **Process gas i**

**CF 4**  **C 2**  **F 6**  **CHF 3**  **CH 2**  **F 2**  **C 2**  **HF 5**  **CH 3**  **F C**  **3 F**  **8 C**  **4 F**  **8 NF**  **3 SF**  **6 C**  **4 F**  **6 C**  **5 F**  **8 C**  **4 F**  **8 O**  BCF 4 NA NA NA NA NA NA NA NA NA NA NA NA NA BC 2 F 6 NA NA NA NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA **Notes:** NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - type or process type. **Table I**
**– 4 to Subpart I of Part 98** 
**– Default Emission Factors (1** 
**– U**  **ij ) for**  **Gas Utilization Rates (U**  **ij ) and By**  **- Product Formation Rates (B**  **ijk ) for Semiconductor Manufacturing for**  **300 mm and 450 mm Wafer Size Process**  **type/sub**   ** type** **Process gas i**

**CF 4**  **C 2**  **F 6**  **CHF 3**  **CH 2**  **F 2**  **CH 3**  **F C**  **3 F**  **8 C**  **4 F**  **8 NF**  **3 SF**  **6 C**  **4 F**  **6 C**  **5 F**  **8 C**  **4 F**  **8 O** 

**ETCHING/WAFER CLEANING** 1

– U i 0.65 0.80 0.42 0.21 0.33 0.30 0.18 0.15 0.32 0.15 0.10 NA BCF 4 NA 0.21 0.095 0.049 0.045 0.21 0.045 0.046 0.040 0.059 0.11 NA BC 2 F 6 0.079 NA 0.064 0.052 0.00087 0.18 0.031 0.045 0.044 0.074 0.083 NA BC 4 F 6 NA NA 0.00010 NA NA NA 0.018 NA NA NA NA NA BC 4 F 8 0.00063 NA 0.00080 NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA 0.00012 NA BCHF 3 0.011 NA NA 0.050 0.0057 0.012 0.027 0.025 0.0037 0.019 0.0069 NA BCH 2 F 2 NA NA 0.0036 NA 0.0023 NA 0.0015 0.00086 0.000029 0.000030 NA NA BCH 3 F 0.0080 NA 0.0080 0.0080 NA 0.00073 NA 0.0080 NA NA NA NA **Chamber Cleaning** In situ plasma cleaning: 1

– U i NA NA NA NA NA NA NA 0.23 NA NA NA NA BCF 4 NA NA NA NA NA NA NA 0.037 NA NA NA NA BC 2 F 6 NA NA NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA Remote Plasma Cleaning: 1

– U i NA NA NA NA NA 0.063 NA 0.018 NA NA NA NA BCF 4 NA NA NA NA NA NA NA 0.075 NA NA NA NA BC 2 F 6 NA NA NA NA NA NA NA NA NA NA NA NAPage 77 of 100

**Process type/sub**  **** **type Process gas i** 

**CF 4**  **C 2**  **F 6**  **CHF 3**  **CH 2**  **F 2**  **CH 3**  **F C**  **3 F**  **8 C**  **4 F**  **8 NF**  **3 SF**  **6 C**  **4 F**  **6 C**  **5 F**  **8 C**  **4 F**  **8 O**  BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA In Situ Thermal Cleaning: 1

– U i NA NA NA NA NA NA NA 0.28 NA NA NA NA BCF 4 NA NA NA NA NA NA NA 0.010 NA NA NA NA BC 2 F 6 NA NA NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA **Notes:** NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - type or process type. **Table I**
**– 5 to Subpart I of Part 98** 
**— Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization**  **Rates (U ij**  **) and By -**  **Product Formation Rates (B ijk**  **) for MEMS Manufacturing Process type factors**  **Process gas i CF**  **4 C**  **2 F**  **6 CHF**  **3 CH**  **2 F**  **2 C**  **3 F**  **8 c**  **- C**  **4 F**  **8 NF**  **3 Remote**  **NF 3**  **SF 6**  **C 4**  **F 6a**  **C 5**  **F 8a**  **C 4**  **F 8**  **O a**  Etch 1

– U i 0.7 1 0.4 1 0.4 1 0.06 NA 1 0.2 NA 0.2 0.2 0.1 0.2 NA Etch BCF 4 NA 1 0.4 1 0.07 1 0.08 NA 0.2 NA NA NA 1 0.3 0.2 NA Etch BC 2 F 6 NA NA NA NA NA 0.2 NA NA NA 1 0.2 0.2 NA CVD Chamber Cleaning 1

– U i 0.9 0.6 NA NA 0.4 0.1 0.02 0.2 NA NA 0.1 0.1 CVD Chamber Cleaning BCF 4 NA 0.1 NA NA 0.1 0.1 2 0.02 2 0.1 NA NA 0.1 0.1 CVD Chamber Cleaning BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA 0.4 **Notes:** NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - type or process type. 1 Estimate includes multi - gas etch processes. 2 Estimate reflects presence of low - k, carbide and multi - gas etch processes that may contain a C - containing fluorinated GHG additive. **Table I**
**– 6 to Subpart I of Part**  **98**
**— Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization**  **Rates (U ij**  **) and By -**  **Product Formation Rates (B ijk**  **) for LCD Manufacturing Process type factors**  **Process Gas i CF**  **4 C**  **2 F**  **6 CHF**  **3 CH**  **2 F**  **2 C**  **3 F**  **8 c**  **- C**  **4 F**  **8 NF**  **3 Remote**  **NF 3**  **SF 6**  Etch 1

– U i 0.6 NA 0.2 NA NA 0.1 NA NA 0.3 Etch BCF 4 NA NA 0.07 NA NA 0.009 NA NA NA Etch BCHF 3 NA NA NA NA NA 0.02 NA NA NAPage 78 of 100

Etch BC 2 F 6 NA NA 0.05 NA NA NA NA NA NA CVD Chamber Cleaning 1

– U i NA NA NA NA NA NA 0.03 0.3 0.9 **Notes:** NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - type or process type. **Table I**
**– 7 to Subpart I of Part 98** 
**— Default Emission Factors (1** 
**– U**  **ij ) for Gas Util**  **ization Rates (U**  **ij ) and By**  **- Product Formation Rates (B**  **ijk ) for PV Manufacturing**  **Process type factors Process Gas i**  **CF 4**  **C 2**  **F 6**  **CHF 3**  **CH 2**  **F 2**  **C 3**  **F 8**  **c -**  **C 4**  **F 8**  **NF 3**  **Remote NF**  **3 SF**  **6** Etch 1

– U i 0.7 0.4 0.4 NA NA 0.2 NA NA 0.4 Etch BCF 4 NA 0.2 NA NA NA 0.1 NA NA NA Etch BC 2 F 6 NA NA NA NA NA 0.1 NA NA NA CVD Chamber Cleaning 1

– U i NA 0.6 NA NA 0.1 0.1 NA 0.3 0.4 CVD Chamber Cleaning BCF 4 NA 0.2 NA NA 0.2 0.1 NA NA NA **Notes:** NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - type or process type. **Table I**
**– 8 to Subpart I of Part 98** 
**— Default Emission Factors (1** 
**– U**  **N2O j ) for N**  **2 O Utilization**  **(U N2O j**  **) Process type facto**  **rs N**  **2 O**  CVD 1

– U i 0.8 Other Manufacturing Process 1

– U i 1.0 **Table I -**  **9 to Subpart I of Part 98**
**— Methods and Procedures for Conducting Emissions**  **Tests for Stack Systems For each stack system for**  **which you use the “stack test method” to calculate**  **annual emissions...**  **You must... Using...** Page 79 of 100

**For each stack system for which you use the “stack**  **test method” to calculate annual**  **emissions... You must...**  **Using...** For each fluorinated GHG Measure the concentration in the stack sy stem. Method 320 at 40 CFR part 63, appendix A or ASTM D6348 - 03 a (incorporated b y reference, see § 98.7). Conduct the test run for a minimum of 8 hours for each stack sy stem. Select sampling port locations and the number of traverse points. Method 1 or 1A at 40 CFR part 60, appendix A - 1. Determine gas velocity and volumetric flow rate. Method 2, 2A, 2C, 2D, 2F, or 2G at 40 CFR part 60, appendix A - 1 and A - 2. Determine gas molecular weight. Method 3, 3A, or 3B at 40 CFR part 60, appendix A - 2 using the same sampling site and time as fluorinated GHG sampling. Measure gas moisture content. Method 4 at 40 CFR part 60, appendix A - 3, or using FTIR b

. a Reporters may

use ASTM D6348 - 03 (incorporated by reference, see § 98.7) as an alternative to Method 320 at 40 CFR part 63, appendix A, with the following additional requirements: (1) The test plan preparation and implementation in the Annexes to ASTM D6348 - 03, Sections A1 through A8 are mandatory; and (2) In ASTM D6348 - 03 Annex A5 (Anal yt e Spiking Technique), the percent recovery

(%R) must be determined for each target anal yt e (Equation A5.5). The reporter must also follow Section 4.1 of ASTM D6348 - 03 to en sure F - GHG remain in the gas phase. In order for the test data to be acceptable for a compound, the percent recovery must be between 70 and 130 percent. If the percent recovery does not meet this criterion for a target compound, the test data are not accep table for that compound and the test must be repeated for that anal yt e (i.e., the sampling and/or anal ytical procedure should be adjusted before a retest). The percent recovery

value for each compound must be reported in the test report, required under 40 CFR 98.94(j)(4), and all field measurements must be corrected with the calculated percent recovery value for that compound by using the following equation: Reported Result = Measured Concentration in the stack x (100/% R). b Extractive FTIR is an acceptabl e method, in lieu of Method 4 at 40 CFR part 60 appendix A, of determining the volumetric concentrations of moisture in semiconductor stack gas streams. The spectral calibrations employed should bracket the anticipated range of optical depths (H 2 O concentr ation in parts per million multiplied by FTIR sample cell path length) measured in the field for moisture saturated (relative humidity approximately

100 percent) air streams at temperatures characterized via Method 2 at 40 CFR part 60 appendix A, within th e stack. ThePage 80 of 100

HI TRAN molecular spectroscopic database is an example of a widely used international standard of IR absorption parameters that provide accurate H 2 O FTIR calibrations at atmospheric conditions. Field measurements should be verified to be in lin e with moisture saturated wet scrubber exhaust concentrations at measured temperatures. Field measurements at saturated conditions should be verified to be consistent with published water vapor pressure curves at the current stack temperatures (Perry , R.H. and D.W. Green. Perry ’s Chemical Engineer’s Handbook (8 th Edition). McGraw - Hill Publishing Company , Inc. New York, New York. 2008). For unsaturated conditions, field measurements should be verified using a single point verification of the FTIR moisture re ading using Method 4 at 40 CFR part 60 appendix A, or a NIST traceable hygrometer accurate to +/ - 2 percent relative humidity . The FTIR moisture reading shall agree within 10 percent of the moisture measurement obtained using Method 4 at 40 CFR part 60 app endix A or a NIST traceable hygrometer. **Table I**
**– 10 to Subpart I of Part 98** 
**– Maximum Field Detection Limits Applicable to**  **Fluorinated GHG Concentration Measurements for Stack Systems Fluorinated**  **GHG Analyte Maximum Field**  **Detection Limit (ppbv)**  CF 4 20 C 2 F 6 20 C 3 F 8 20 C 4 F 6 20 C 5 F 8 20 c - C 4 F 8 20 CH 2 F 2 40 CH 3 F 40 CHF 3 20 NF 3 20 SF 6 4 Other full y fluorinated GHGs 20 Other fluorinated GHGs 40 ppbv

– Parts per billion by volumePage 81 of 100

**Table I**
**– 11 to Subpart I of Part 98** 
**– Default Emission Factors**  **(1**
**– U**  **ij ) for Gas Utilization Rates (U**  **ij ) and By**  **- Product Formation**  **Rates (B ijk** 

**) for Semiconductor Manufacturing for use with the Stack Test Method (150 mm and 200 mm wafers) All**  **Processes Process Gas i** 

CF 4 C 2 F 6 CHF 3 CH 2 F 2 C 2 HF 5 CH 3 F C 3 F 8 C 4 F 8 NF 3 NF 3 Remote SF 6 C 4 F 6 C 5 F 8 C 4 F 8 O 1 - U i 0.85 0.56 0.50 0.13 0.064 0.51 0.40 0.13 0.16 0.018 0.55 0.17 0.072 0.14 BCF 4 NA 0.19 0.085 0.079 0.077 NA 0.20 0.11 0.045 0.015 0.13 0.13 NA 0.13 BC 2 F 6 0.046 NA 0.030 0.025 0.024 0.0034 NA 0.037 0.025 NA 0.11 0.11 0.014 0.045 BC 4 F 6 NA NA NA NA NA NA NA NA NA NA NA NA NA NA BC 4 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA NA NA BC 5 F 8 0.0012 NA 0.0012 NA NA NA NA 0.0086 NA NA NA NA NA NA BCHF 3 0.10 0.047 NA 0.049 NA NA NA 0.040 NA NA 0.0012 0.066 0.0039 NA **Notes:** NA = Not applicable; i.e., there are no applicable emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - ty pe or process ty

pe. **Table I**
**– 12 to Subpart I of Part 98** 
**– Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization Rates (U**  **ij ) and By**  **- Product Formation**  **Rates (B ijk** 

**) for Semiconductor Manufacturing for use with the Stack Test Method (300 mm and 450 mm Wafer Sizes) All**  **Processes Process Gas i** 

CF 4 C 2 F 6 CHF 3 CH 2 F 2 CH 3 F C 3 F 8 C 4 F 8 NF 3 NF 3 Remote SF 6 C 4 F 6 C 5 F 8 C 4 F 8 O 1 - U i 0.65 0.80 0.42 0.21 0.33 0.20 0.18 0.20 0.018 0.32 0.15 0.10 NA BCF 4 NA 0.21 0.095 0.049 0.045 0.21 0.045 0.040 0.075 0.040 0.059 0.11 NA BC 2 F 6 0.079 NA 0.064 0.052 0.00087 0.18 0.031 0.045 NA 0.044 0.074 0.083 NAPage 82 of 100

**All Processes**  **Process Gas i**

CF 4 C 2 F 6 CHF 3 CH 2 F 2 CH 3 F C 3 F 8 C 4 F 8 NF 3 NF 3 Remote SF 6 C 4 F 6 C 5 F 8 C 4 F 8 O BC 4 F 6 NA NA 0.00010 NA NA NA 0.018 NA NA NA NA NA NA BC 4 F 8 0.000 63 NA 0.00080 NA NA NA NA NA NA NA NA NA NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA 0.00012 NA BCH 2 F 2 NA NA 0.0036 NA 0.0023 NA 0.0015 0.00086 NA 0.000029 0.000030 NA NA BCH 3 F 0.008 0 NA 0.0080 0.0080 NA 0.00073 NA 0.0080 NA NA NA NA NA BCHF 3 0.011 NA NA 0.050 0.0057 0.012 0.027 0.025 NA 0.0037 0.019 0.0069 NA **Notes:** NA = Not applicable; i.e., there are no applicable emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - ty pe or process ty

pe. **Table I**
**– 13 to Subpart I of Part**  **98**
**— Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization Rates (U**  **ij ) and By**  **- Product** 

**Formation Rates (B ijk** 

**) for LCD Manufacturing for use with the Stack Test Method Process Gas (i)**  **Process Gas i CF**  **4 C**  **2 F**  **6 CHF**  **3 CH**  **2 F**  **2 C**  **3 F**  **8 c**  **- C**  **4 F**  **8 NF**  **3 Remote**  **NF 3**  **SF 6**  1

– U i 0.6 NA 0.2 NA NA 0.1 0.03 0.3 0.6 BCF 4 NA NA 0.07 NA NA 0.009 NA NA NA BCHF 3 NA NA NA NA NA 0.02 NA NA NA BC 2 F 6 NA NA 0.05 NA NA NA NA NA NA B C 3 F 8 NA NA NA NA NA NA NA NA NAPage 83 of 100

**Notes:** NA = Not applicable; i.e., there are no applicable emission factor measurements for this gas. This does not necessarily imply

that a particular gas is not used in or emitted from a particular process sub - ty pe or process ty

pe. **Table I**
**– 14 to Subpart I of Part 98** 
**— Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization Rates (U**  **ij ) and By**  **- Product** 

**Formation Rates (B ijk** 

**) for PV Manufacturing for use with the Stack Test Method Process Gas (i)**  **Process Gas i CF**  **4 C**  **2 F**  **6 CHF**  **3 CH**  **2 F**  **2 C**  **3 F**  **8 c**  **- C**  **4 F**  **8 NF**  **3 Remote**  **NF 3**  **SF 6**  1

– U i 0.7 0.6 0.4 NA 0.4 0.2 NA 0.2 0.4 BCF 4 NA 0.2 NA NA 0.2 0.1 NA 0.05 NA BC 2 F 6 NA NA NA NA NA 0.1 NA NA NA B **C 3**  **F 8**  NA NA NA NA NA NA NA NA NA **Notes:** NA = Not applicable; i.e., there are no applicable emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - ty pe or process ty

pe. **Table I**
**– 15 to Subpart I of Part 98** 
**– Default Emission Factors (1** 
**– U**  **ij ) for Gas Utilization Rates (U**  **ij ) and By**  **- Product Formation**  **Rates (B ijk** 

**) for MEMS Manufacturing for use with the Stack Test Method All**  **Pro cesses**  **Process Gas i**

**CF 4**  **C 2**  **F 6**  **CHF 3**  **CH 2**  **F 2**  **C 3**  **F 8**  **c -**  **C 4**  **F 8**  **NF 3**  **Rem ote**  **NF 3**  **SF 6**  **C 4**  **F 6**  **C 5**  **F 8**  **C 4**  **F 8**  **O** 1 - U i 0.9 0.6 0.4 0.1 0.4 0.1 0.2 0.2 0.2 0.1 0.1 0.1 BCF 4 NA 0.2 0.07 0.08 0.1 0.1 a 0.02 0.09 NA 0.3 0.1 0.1 BC 2 F 6 NA NA NA NA NA a 0.04 NA NA NA 0.2 0.04 NA BC 3 F 8 NA NA NA NA NA NA NA NA NA NA NA NA **Notes:** NA = Not applicable; i.e., there are no applicable emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub - type or process type. **a** Estimate reflects presence of low- k, carbide and multi - gas etch processes that may contain a C - containing fluorinated GHG additive.Page 84 of 100

**Table I**
**– 16 to Subpart I of Part 98** 
**— Default Emission Destruction or Removal Efficiency** 

**(DRE) Factors For Electronics Manufacturing Manufacturing Type/Process Type/Gas**  **Default DRE** MEMS, L CDs, and PV Manufacturing 60% Semiconductor Manufacturing Plasma Etch/Wafer Clean Process Ty pe CF 4 75% CH 3 F 97% CHF 3 97% CH 2 F 2 97% C 2 F 6 97% C 3 F 8 97% C 4 F 6 97% C 4 F 8 97% C 5 F 8 97% SF 6 97% NF 3 96% All other carbon - based plasma etch/wafer clean fluorinated GHG 60% Chamber Clean Process Ty pe NF 3 88% All other chamber clean fluorinated GHG 60% N 2 O Processes CVD and all other N 2 O - using processes 60%Page 85 of 100

**Table I**
**– 17 to Subpart I of Part 98** 
**— Expected and Possible By**  **- products For Electronics**  **Manufacturing For each stack system for**  **which you use the “stack test**  **method” to calculate annual emissions, you must**  **measure the following:**  **If emissions are detected**  **intermittently, use the following**

**procedures: If**  **emissions are not detected, use the following procedures:**  Expected By -products: CF 4 C 2 F 6 CHF 3 CH 2 F 2 CH 3 F Use the measured concentration for

“Xksm” in Equation I - 18 when available and use one -half of the field detection limit you determined for the fluorinated GHG according to § 98.94(j)(2) for the value of “Xksm” when the fluorinated GHG is n ot detected. Use one -half of the field detection limit you determined for the fluorinated GHG according to § 98.94(j)(2) for the value of “Xksm” in Equation I - 18.

Possible By -products C 3 F 8 C 4 F 6 c - C 4 F 8 C 5 F 8 Use the measured concentration for

“Xksm” in Equation I - 18 when available and use one -half of the field detection limit you determined for the fluorinated GHG according to § 98.94(j)(2) for the value of “Xksm” when the fluorinated GHG is not detected. Assume zero emissions for that fluorinated GHG fo r the tested stack system.Page 86 of 100

**Appendix A to Subpart I of Part 98**
**— Alternative Procedures for Measuring Point** **- of**  **- Use**  **Abatement Device Destruction or Removal Efficiency.** If you are measuring destruction or removal efficiency of a point - of - use abatement device according to EPA 430

–R

– 10

–003 (incorporated by reference, see § 98.7) as specified in § 98.94(f)(4), you may follow the alternative procedures specified in paragraphs (a) through (c) of this appendix. (a) In place of the Quadrupole Mass Sp ectrometry protocol requirements specified in section 2.2.4 of EPA 430

–R

– 10

–003 (incorporated by reference, see § 98.7), you must conduct mass spectrometry

testing in accordance with the provisions in paragraph (a)(1) through (a)(15) of this appendix. (1) Detection limits . The mass spectrometer chosen for this application must have the necessary sensitivity

to detect the selected effluent species at or below the maximum field detection limits specified in Table 3 of section 2.2.7 of EPA 430

–R

– 10

–003 (incorp orated by reference, see § 98.7). (2) Sampling location . The sample at the inlet of the point - of - use abatement device must be taken downstream of the process tool and pump package. The sample exhaust must be vented back into the corrosive house ventilatio n sy stem at a point downstream of the sample inlet location. (3) Sampling conditions . For etch processes, destruction or removal efficiencies must be determined while etching a substrate (product, dummy , or test). For chemical vapor deposition processes, d estruction or removal efficiencies must be determined during a chamber clean after deposition (destruction or removal efficiencies must not be determined in a clean chamber). All sampling must be performed non - intrusively during wafer processing. Samples must be drawn through the mass spectrometer source b y an external sample pump. Because of the volatility,Page 87 of 100

vapor pressure, stability

and inertness of CF 4 , C 2 F 6 , C 3 F 8 , CHF 3 , NF 3 , and SF 6 , the sample lines do not need to be heated. (4) Mass spectrometer parame ters . The specific mass spectrometer operating conditions such as electron energy , secondary electron multiplier voltage, emission current, and ion focusing voltage must be selected according to the specifications provided by the mass spectrometer manufacturer, the mass spectrometer sy stem manual, basic mass spectrometer textbook, or other such sources. The mass spectrometer responses to each of the target anal yt es must all be calibrated under the same mass spectrometer operating conditions. (5) Flow rates . A sample flow rate of 0.5

– 1.5 standard liters per minute (slm) must be drawn from the process tool exhaust stream under study . (6) Sample frequency . The mass spectrometer sampling frequency for etch processes must be in the range of 0.5 to 1 cycles per second, and for chemical vapor deposition processes must be in the range of 0.25 to 0.5 cycles per second. As an alternative you may use the sampling frequencies specified in section 2.2.4 of EPA 430

–R

– 10

–003 (incorporated by reference, see § 98.7). (7) Dy

namic dilution calibration parameters . The quadrupole mass spectrometer must be calibrated for both mass location and response to analy tes. A dy namic dilution calibration s ys tem may be used to perform both ty pes of mass spectrometer s ys tem calibrations u sing two mass flow controllers. Use one mass flow controller to regulate the flow rate of the standard component used to calibrate the s ys tem and the second mass flow controller to regulate the amount of diluent gas used to mix with the standard to generate the calibration curve for each compound of interest. The mass flow controller must be calibrated using the single component gas being used with them, for example, nitrogen (N 2 ) for the diluent. A mass flow controllerPage 88 of 100

used with calibration mixtures must b e calibrated with the calibration mixture balance gas (for example, N 2 or He) if the anal yt e components are 2 percent or less of the volume of the sample. All calibration mixtures must be National Institute of Standards and Technology Traceable gases or equivalent. They

must be calibrated over their range of use and must be operated in their experimentally

determined dy

namic linear range. If compressed gas standards cannot be brought into the fab, metered gas flows of target compounds into the process chamb er, under no thermal or plasma conditions and with no wafer(s) present, and with no process emissions from other tools contributing to the sample location, must then be performed throughout the appropriate concentration ranges to derive calibration curves for the subsequent destruction or removal efficiency tests. (8) Mass location calibration . A mixture containing 1 percent He, Ar, Kr, and Xe in a balance gas of nitrogen must be used to assure the alignment of the quadrupole mass filter (see EPA Method 20 5 at 40 CFR part 51, appendix M as reference). The mass spectrometer must be chosen so that the mass range is sufficient to detect the predominant peaks of the components under study . (9) Quadrupole mass spectrometer response calibration . A calibration cur ve must be generated for each compound of interest. (10) Calibration frequency . The mass spectrometer must be calibrated at the start of testing a given process. The calibration must be checked at the end of testing. (11) Calibration range . The mass spectrometer must be calibrated over the expected concentration range of analy tes using a minimum of five concentrations including a zero. The zero point is defined as diluent containing no added anal yt e.Page 89 of 100

(12) Operating procedures . You must follow the operating procedures specified in paragraphs (a)(12)(i) through (v) of this appendix. (i) You must perform a qualitative mass calibration by running a standard (or by flowing chamber gases under non - process conditions) containing stable components such as Ar, Kr, and Xe that provide predominant signals at m/e values distributed throughout the mass range to be used. You must adjust the quadrupole mass filter as needed to align with the inert gas fragments. (ii) You must quantitatively calibrate the quadrupole mass sp ectrometer for each anal yt e of interest. The anal yt e concentrations during calibration must include the expected concentrations in the process effluent. The calibration must be performed under the same operating conditions, such as inlet pressure, as when sampling process exhaust. If the calibration inlet pressure differs from the sampling inlet pressure then the relationship between inlet pressure and quadrupole mass spectrometer signal response must be empirically determined and applied to correct for any differences between calibration and process emissions monitoring data. (iii) To determine the response time of the instrument to changes in a process, a process gas such as C 2 F 6 must be turned on at the process tool for a fixed period of time (for example , 20 seconds), after which the gas is shut off. The sample flow rate through the sy stem must be adjusted so that the signal increases to a constant concentration within a few seconds and decreases to background levels also within a few seconds. (iv) You mu st sample the process effluent through the quadrupole mass spectrometer and acquire data for the required amount of time to track the process, as determined in paragraph (a)(12)(iii) of this appendix. You must set the sample frequency to monitor the change s in the process as specified in paragraph (a)(6) of this appendix. You must repeat this for at least fivePage 90 of 100

substrates on the same process and calculate the average and standard deviation of the anal yt e concentration. (v) You must repeat the quantitative calibration at the conclusion of sampling to identify any drifts in quadrupole mass spectrometer sensitivity . If drift is observed, you must use an internal standard to correct for changes in sensitivity . (13) Sample anal ys is . To determine the concentration of a specific component in the sample, you must divide the ion intensity of the sample response by the calibrated response factor for each component. (14) Deconvolution of interfering peaks . The effects of interfering peaks must be deconvoluted from the m ass spectra for each target analy te. (15) Calculations . Plot ion intensity versus anal yt e concentration for a given compound obtained when calibrating the anal ytical s ys tem. Determine the slope and intercept for each calibrated species to obtain response factors with which to calculate concentrations in the sample. For an acceptable calibration, the R2 value of the calibration curve must be at least 0.98. (b) In place of the Fourier Transform Infrared Spectroscop y protocol requirements specified in section 2.2.4 of EPA 430

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–003 (incorporated b y reference, see § 98.7), you may conduct Fourier Transform Infrared Spectroscopy testing in accordance with the provisions in paragraph (b)(1) through (17) of this appendix, including the laboratory study phase de scribed in paragraphs (b)(1) through (7), and the field study phase described in paragraphs (b)(8) through (17) of this appendix. (1) Conformance with provisions associated with the Calibration Transfer Standard . This procedure calls for the use of a calib ration transfer standard in a number of instances. The use of a calibration transfer standard is necessary to validate optical pathlength and detector responsePage 91 of 100

for spectrometers where cell temperature, cell pressure, and cell optical pathlength are potenti all y variable. For fixed pathlength spectrometers capable of controlling cell temperature and pressure to within +/ - 10 percent of a desired set point, the use of a calibration transfer standard, as described in paragraphs (b)(2) to (17) this appendix is n ot required. (2) Defining spectroscopic conditions . Define a set of spectroscopic conditions under which the field studies and subsequent field applications are to be carried out. These include the minimum instrumental line - width, spectrometer wave number range, sample gas temperature, sample gas pressure, absorption pathlength, maximum sampling sy stem volume (including the absorption cell), minimum sample flow rate, and maximum allowable time between consecutive infrared anal ys es of the effluent. (3) Criteria for reference spectral libraries . On the basis of previous emissions test results and/or process knowledge (including the documentation of results of any initial and subsequent tests, and the final reports required in § 98.97(d)(4)(i)), estimate the maximum concentrations of all of the anal yt es in the effluent and their minimum concentrations of interest (those concentrations below which the measurement of the compounds is of no importance to the anal ys is). Values between the maximum expected concentration and the minimum concentration of interest are referred to below as the “expected concentration range.” A minimum of three reference spectra is sufficient for a small expected concentration range (e.g., a difference of 30 percent of the range between th e low and high ends of the range), but a minimum of four spectra are needed where the range is greater, especiall y for concentration ranges that may differ b y orders of magnitude. If the measurement method is not linear then multiple linear ranges may be n ecessary . If this approach is adopted, then linear range must be demonstrated to pass the required quality

control. When the set of spectra is ordered according to absorbance, thePage 92 of 100

absorbance levels of adjacent reference spectra should not differ by more th an a factor of six. Reference spectra for each anal yt e should be available at absorbance levels that bracket the anal yt e’s expected concentration range; minimally, the spectrum whose absorbance exceeds each anal yt e’s expected maximum concentration or is wi thin 30 percent of it must be available. The reference spectra must be collected at or near the same temperature and pressure at which the sample is to be anal yz ed under. The gas sample pressure and temperature must be continuously monitored during field t esting and you must correct for differences in temperature and pressure between the sample and reference spectra. Differences between the sample and reference spectra conditions must not exceed 50 percent for pressure and 40oC for temperature. (4) Spectra without reference libraries . If reference spectral libraries meeting the criteria in paragraph (b)(3) of this appendix do not exist for all the anal yt es and interferants or cannot be accuratel y generated from existing libraries exhibiting lower minimum ins trumental line - width values than those proposed for the testing, prepare the required spectra according to the procedures specified in paragraphs (b)(4)(i) and (ii) of this appendix. (i) Reference spectra at the same absorbance level (to within 10 percent) of independentl y prepared samples must be recorded. The reference samples must be prepared from neat forms of the anal yt e or from gas standards of the highest quality commonl y available from commercial sources. Either barometric or volumetric methods may be used to dilute the reference samples to the required concentrations, and the equipment used must be independently calibrated to ensure suitable accuracy . Dy

namic and static reference sample preparation methods are acceptable, but dy namic preparations mu st be used for reactive analy tes. Any well characterized absorption pathlength may

be employed in recording reference spectra, but the temperature and pressure ofPage 93 of 100

the reference samples should match as closel y as possible those of the proposed spectroscopic conditions. (ii) If a mercury

cadmium telluride or other potentially non - linear detector (i.e., a detector whose response vs. total infrared power is not a linear function over the range of responses employed) is used for recording the reference spectra, you must correct for the effects of this ty pe of response on the resulting concentration values. As needed, spectra of a calibration transfer standard must be recorded with the laboratory spectrometer sy stem to verify the absorption pathlength and other as pects of the s ys tem performance. All reference spectral data must be recorded in interferometric form and stored digitall y. (5) Sampling s ys tem preparation . Construct a sampling s ys tem suitable for delivering the proposed sample flow rate from the effluent source to the infrared absorption cell. For the compounds of interest, the surfaces of the s ys tem exposed to the effluent stream may need to be stainless steel or Teflon; because of the potential for generation of inorganic automated gases, glass surfaces within the sampling s ys tem and absorption cell may need to be Teflon - coated. The sampling s ys tem should be able to deliver a volume of sample that results in a necessary response time. (6) Preliminary

analy tical routines . For the proposed absorpti on pathlength to be used in actual emissions testing, you must prepare an analy sis method containing of all the effluent compounds at their expected maximum concentrations plus the field calibration transfer standard compound at 20 percent of its full conc entration as needed. (7) Documentation . The laboratory techniques used to generate reference spectra and to convert sample spectral information to compound concentrations must be documented. ThePage 94 of 100

required level of detail for the documentation is that which allows an independent anal ys t to reproduce the results from the documentation and the stored interferometric data. (8) Spectroscopic s ys tem performance . The performance of the proposed spectroscopic sy stem, sampling s ys tem, and anal ytical method must be rigorously examined during and after a field study . Several iterations of the anal ys is method may need to be applied depending on observed concentrations, absorbance intensities, and interferences. During the field study , all the sampling and anal ytical pro cedures envisioned for future field applications must be documented. Additional procedures not required during routine field applications, notably dynamic spiking studies of the anal yt e gases, may be performed during the field study . These additional proce dures need to be performed onl y once if the results are acceptable and if the effluent sources in future field applications prove suitably similar to those chosen for the field study . I f changes in the effluent sources in future applications are noted and require substantial changes to the anal ytical equipment and/or conditions, a separate field study must be performed for the new set of effluent source conditions. All data recorded during the study must be retained and documented, and all spectral information must be permanentl y stored in interferometric form. (9) Sy stem installation . The spectroscopic and sampling sub - sy stems must be assembled and installed according to the manufacturers’ recommendations. For the field study , the length of the sample lines used must not be less than the maximum length envisioned for future field applications. The s ys tem must be given sufficient time to stabilize before testing begins. (10) Pre - Test calibration . Record a suitable background spectrum using pure nitrogen gas; alternativel y, if the analy tes of interest are in a sample matrix consistent with ambient air, it is beneficial to use an ambient air background to control interferences from water and carbon dioxide. For variable pathlength Fourier Transform Infrared Spec trometers, introduce a samplePage 95 of 100

of the calibration transfer standard gas directl y into the absorption cell at the expected sample pressure and record its absorbance spectrum (the “initial field calibration transfer standard spectrum”). Compare it to the labo ratory calibration transfer standard spectra to determine the effective absorption pathlength. If possible, record spectra of field calibration gas standards (single component standards of the anal yt e compounds) and determine their concentrations using the reference spectra and anal ytical routines developed in paragraphs (b)(2) through (7) of this appendix; these spectra may be used instead of the reference spectra in actual concentration and uncertainty calculations. (11) Deriving the calibration transfer standard gas from tool chamber gases . The calibration transfer standard gas may be derived by

flowing appropriate semiconductor tool chamber gases under non - process conditions (no thermal or plasma conditions and with no wafer(s) present) if compressed gas standards cannot be brought on - site. (12) Reactivity and response time checks . While sampling ambient air and continuously recording absorbance spectra, suddenl y replace the ambient air flow with calibration transfer standard gas introduced as close as po ssible to the probe tip. Examine the subsequent spectra to determine whether the flow rate and sample volume allow the sy stem to respond quickly enough to changes in the sampled gas. Should a corrosive or reactive gas be of interest in the sample matrix it would be beneficial to determine the reactivity in a similar fashion, if practical. Examine the subsequent spectra to ensure that the reactivities of the anal yt es with the exposed surfaces of the sampling sy stem do not limit the time response of the anal y tical sy stem. If a pressure correction routine is not automated, monitor the absorption cell temperature and pressure; verify

that the (absolute) pressure remains within 2 percent of the pressure specified in the proposed s ys tem conditions.Page 96 of 100

(13) Anal yt e spiking . Analy te spiking must be performed. While sampling actual source effluent, introduce a known flow rate of calibration transfer standard gas into the sample stream as close as possible to the probe tip or between the probe and extraction line. Measu re and monitor the total sample flow rate, and adjust the spike flow rate until it represents 10 percent to 20 percent of the total flow rate. After waiting until at least four absorption cell volumes have been sampled, record four spectra of the spiked ef fluent, terminate the calibration transfer standard spike flow, pause until at least four cell volumes are sampled, and then record four (unspiked) spectra. Repeat this process until 12 spiked and 12 unspiked spectra have been obtained. If a pressure corre ction routine is not automated, monitor the absorption cell temperature and pressure; verify that the pressure remains within 2 percent of the pressure specified in the proposed sy stem conditions. Calculate the expected calibration transfer standard compound concentrations in the spectra and compare them to the values observed in the spectrum. This procedure is best performed using a spectroscopic tracer to calculate dilution (as opposed to measured flow rates) of the injected calibration transfer standard (or analy te). The spectroscopic tracer should be a component not in the gas matrix that is easily detectable and maintains a linear absorbance over a large concentration range. Repeat this spiking process with all effluent compounds that are potentiall y re active with either the sampling s ys tem components or with other effluent compounds. The gas spike is delivered b y a mass flow controller, and the expected concentration of anal yt e of interest (AOI Theoretical) is calculated as follows:



#     native cylinder sample cylinder cylinder sample l Theoretica 

### AOI Tracer Tracer AOI Tracer Tracer AOI         

      

           1 Where: AOITheoretical = Theoretical anal yt e of interest concentration (parts per million (ppm)).Page 97 of 100

Tracersample = Tracer concentration (ppm) as seen b y the Fourier Transform Infrared

Spectrometer during spiking. Tracercylinder = The concentration (ppm) of tracer recorded during direct injection of the

cylinder to the Fourier Transform Infrared Spectrometer cell. AOIcylinder = The supplier- certified concentration (ppm) of the anal yt e of interest gas

standard. AOInative = The native AOI concentration (ppm) of the effluent during stable conditions. (14) Post - test calibration . At the end of a sampling run and at the end of the field study , record the spectrum of the calibration transfer standard gas. The resulting “final field calibration transfer standard spe ctrum” must be compared to the initial field calibration transfer standard spectrum to verify

suitable stability

of the spectroscopic sy stem throughout the course of the field study . (15) Amendment of analy tical routines . The presence of unanticipated interferant compounds and/or the observation of compounds at concentrations outside their expected concentration ranges may necessitate the repetition of portions of the procedures in paragraphs (b)(2) through (14) of this appendix. Such amendments are allowab le before final anal ys is of the data, but must be represented in the documentation required in paragraph (b)(16) of this appendix. (16) Documentation . The sampling and spiking techniques used to generate the field study spectra and to convert sample spectral information to concentrations must be documented at a level of detail that allows an independent analyst to reproduce the results from the documentation and the stored interferometric data. (17) Method application . When the required laboratory and field studies have been completed and if the results indicate a suitable degree of accuracy , the methods developed may be applied to practical field measurement tasks. During field applications, the procedures demonstrated in the field study specified in paragr aphs (b)(8) through (16) of this appendix mustPage 98 of 100

be adhered to as closel y as possible, with the following exceptions specified in paragraphs (b)(17)(i) through (iii) of this appendix: (i) The sampling lines employed should be as short as practically possible and not longer than those used in the field study . (ii) Anal yt e spiking and reactivity checks are required after the installation of or major repair to the sampling s ystem or major change in sample matrix. In these cases, perform three spiked/unspiked samples with calibration transfer standard or a surrogate analy te on a dail y basis if time permits and gas standards are eas y to obtain and get on - site. (iii) Sampling and other operational data must be recorded and documented as during the field study , but o nl y the interferometric data needed to sufficiently reproduce actual test and spiking data must be stored permanently . The format of this data does not need to be interferograms but may

be absorbance spectra or single beams. (c) When using the flow and dilution measurement protocol specified in section 2.2.6 of EPA 430

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–003 (incorporated b y reference, see § 98.7), you may determine point - of - use abatement device total volume flow with the modifications specified in paragraphs (c)(1) through (3) of this a

ppendix. (1) You may

introduce the non - reactive, non - native gas used for determining total volume flow and dilution across the point - of - use abatement device at a location in the exhaust of the point - of

- use abatement device. For abatement sy stems operating in a mode where specific F GHG are not readily

abated, you may

introduce the non - reactive, non - native gas used for determining total volume flow and dilution across the point - of - use abatement device prior to the point - of - use abatement sy stem; in this case, the tracer must be more difficult to destroy than the target compounds being measured based on the thermal stability of the tracer and target.Page 99 of 100

(2) You may

select a location for downstream non - reactive, non - native gas analy sis that complies with the requirements in this paragraph (c)(2) of this appendix. The sampling location should be traversed with the sampling probe measuring the non - reactive, non - native gas concentrations to ensure homogeneity of the non - reactive gas and point - of - use abatement device ef fluent (i.e., stratification test). To test for stratification, measure the non - reactive, non - native gas concentrations at three points on a line passing through the centroidal area. Space the three points at 16.7, 50.0, and 83.3 percent of the measurement line. Sample for a minimum of twice the sy stem response time, determined according to paragraph (c)(3) of this appendix, at each traverse point. Calculate the individual point and mean non - reactive, non - native gas concentrations. If the non - reactive, non - native gas concentration at each traverse point differs from the mean concentration for all traverse points by no more than ±5.0 percent of the mean concentration, the gas stream is considered unstratified and you may collect samples from a single point th at most closely matches the mean. If the 5.0 percent criterion is not met, but the concentration at each traverse point differs from the mean concentration for all traverse points by no more than ±10.0 percent of the mean, you may take samples from two points and use the average of the two measurements. Space the two points at 16.7, 50.0, or 83.3 percent of the measurement line. If the concentration at each traverse point differs from the mean concentration for all traverse points b y more than ±10.0 percent of the mean but less than 20.0 percent, take samples from three points at 16.7, 50.0, and 83.3 percent of the measurement line and use the average of the three measurements. If the gas stream is found to be stratified because the 20.0 percent criterion fo r a 3 - point test is not met, locate and sample the non - reactive, non - native gas from traverse points for the test in accordance with Sections 11.2 and 11.3 of EPA Method 1 in 40 CFR part 60, Appendix A - 1. A minimum of 40 non - reactive gas concentration meas urementsPage 100 of 100

will be collected at three to five different injected non - reactive gas flow rates for determination of point - of

- use abatement device effluent flow. The total volume flow of the point - of - use abatement device exhaust will be calculated consistent wi th the EPA 430 - R - 10 - 003 (incorporated b y reference, see § 98.7) Equations 1 through 7. (3) You must determine the measurement sy stem response time according to paragraphs (c)(3)(i) through (iii) of this appendix. (i) Before sampling begins, introduce ambi ent air at the probe upstream of all sample condition components in sy stem calibration mode. Record the time it takes for the measured concentration of a selected compound (for example, carbon dioxide) to reach steady state. (ii) Introduce nitrogen in the sy stem calibration mode and record the time required for the concentration of the selected compound to reach steady state. (iii) Observe the time required to achieve 95 percent of a stable response for both nitrogen and ambient air. The longer interval i s the measurement sy stem response time.