**Multi-platform
      HyperSpectral imaging**


**“Micro
      Spectrometer” Development**


**Proposal
      Number 05080901**











Proposal
      prepared for


Larry
      Vance


Earth
      Search








**David
      Harris**


VP,
      Strategic Sales


IntelliSense
      Software Corporation


Phone:
      +1
      781 933 8098


Fax:
      +1
      781 933 8099


E-mail:
      dharris@IntelliSenseSoftware.com





**1
      Summary**




IntelliSense
      provides this proposal at the request of Larry Vance of Earth Search. Several
      conversations with Earth Search have resulted in the technical background for
      the proposal.





The
      activities included in the proposal are for the design of a multi-platform
      Micro
      Spectrometer for aircraft mounted, field use or portable spectral analysis
      purposes.





**2
      Specifications**




Preliminary
      specifications of the hyper-spectral imaging spectrometer are shown
      below


Description
            
            Specification
            
            UnitsFull
                Range
            
            400
                – 2500
            
            nmResolution
            
            <
                10 nm over full range
            
            nmPixel
                size
            
            <
                6 Inches
            
            (spatial
                resolution)Optics
            
            Common
                optics for all sensors Telecscoping opticsSensor
            
            Linear
                array preferred, programmable on the flyChannels
            
            Minimum
                of 256 (up to 600)Device
                construction
            
            Non-gimbaled
                designAdditional
                system controls
            
            Integrated
                5-6DOF IMU for:—
                Altitude correction—
                Vibration and noise compensationForward
                speed
            
            0-1500
            
            Miles/hourInterface
            
            Multiple
                interfaces for different levels of productsParticle
                count
            
            Integrated
                polarimetry measurement for on-line particle count data





*Table
      1 Preliminary specifications*





The
      final
      system and device specifications will be finalized by the completion of Phase
      1.








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**3
      Core technology**




The
      core
      technology behind the miniature is based on micro/nano-machining (MEMS/NEMS)
      techniques developed by IntelliSense. The concept behind the micro-spectrometer
      and the anticipated dimensions are shown in the figure below.





**Device
      schematic**





Recent
      advances in micro optics especially in the capability to design and fabrication
      of precision steerable mirror technology make the micro-spectrometer feasible.
      IntelliSense has demonstrated the capability to fabricate micro-mirrors that
      exhibit a large scan angle and a angle resolution of less than 50 micro-radians.
      In addition, improvements in etch capability allows for the creation of
      precision dispersion gratings through micromachining. A combination of the
      micro-mirror technology with the dispersion grating capability is the key
      innovation that makes the micro-spectrometer feasible.















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**System
      schematic**





***Figure
      2 System schematic. A simplified version of the system is shown above. The
      telescopy optics is shown as a transmittive lens, in reality it may be based
      on
      reflective optics such as a Czerney-Turner arrangement. The schematic is meant
      to present a block-level understanding of the system. The field selector can
      be
      implemented in a number of ways including a moving slit, a 2D spatial light
      modulator (SLM) or a MEMS based mirror.***





Telescoping
      optics and the pixel selection scheme form another major component of the
      system. The field selector can be implemented in a number of ways including
      a
      scanning MEMS mirror or a 2D spatial light modulator. The performance/cost
      of
      the system will determine the final configuration of the system.





IntelliSense
      has previously demonstrated 3D mirror technology needed for the field selection.
      The picture below shows a screenshot of MEMS mirror array that can potentially
      be used for the field selector.





*Figure
      3: MEMS based scanning mirror array can be used for the 2D field selector.
      IntelliSense will investigate several alternatives during the design
      phase.*








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**Alternate
      architectures**





While
      the
      architecture presented above represents a most likely configuration,
      IntelliSense will investigate alternate technologies capable of reducing the
      overall project risk and time of implementations. Other hyper-spectral
      architectures have been reported in literature. These include:





•
      Micro-echelon based spectrometers: based on nano-gratings





•
      Fabry-Perot Etalon based interferometric spectrometers based on micro/nano
      resonant cavities





•
      Standing wave transform based spectrometry which uses 1-d scanning micro
      mirrors








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**4
      Three phase implementation**





IntelliSense
      proposes a multi-phase implementation of the project. A highlight of each of
      the
      phases is shown below





Phase
      1:  System architecture and design


Concept
      Evaluation, System Architecture, Design implementation,





Phase
      2:  Prototype fabrication and evaluation


Device
      fabrication (Process development, P0 prototype, Design modifications,
      P1


prototype),
      evaluation and final system specifications.


System
      fabrication (P0 prototype, Design modifications, P1 prototype), and
      evaluation





Phase
      3:  Engineering Sample (P2) design and fabrication


Design
      revision, System fabrication, evaluation, and final device
      specifications.





Description
                of prototypesPrototype
            
            DescriptionP0
            
            Proof
                of concept prototype. Demonstrate major concepts and specifications.
                Probe
                card based testing.P1
            
            Lab
                bench prototype. Demonstrate all specifications, PC Board integration
                to
                allow testing on a bench with DSP and Control
                Circuitry.P2
            
            Engineering
                samples. Field trial ready samples. Integration with ASIC controller
&
                DSP on a common substraight / PC
                Board.











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**Anticipated
      timeline**







*Figure
      4 Anticipated timeline for the program*





**5
      Anticipated project cost and schedule**




The
      following estimate is provided for budgetary and project planning only. This
      section is not be construed to be part of the quotation. Again, these reflect
      preliminary budgetary numbers only.





A
      two
      phase prototyping cycle is required before the engineering sample phase. Initial
      estimate for the prototyping and the fabrication of the engineering samples
      is
      anticipated to be $2 M– $2.5 M. A better understanding of the total cost
      estimate will be available at the end of Phase I.





Note
      that
      the budget does not include prototype evaluation. In P0 and P1, foundry will
      perform basic functional evaluation. At present, it is assumed that detailed
      evaluation is to be performed at Earth Search and that Earth Search will supply
      staff and resources (IntelliSense will consult in procuring and setup
      of


test
      benches).








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**6
      Statement of work for Phase I (System architecture and
      design)**





**Summary**:
      Sensor and Field Selector prototype design. Control chip design. DSP chip
      evaluation and programming. Sensor evaluation and design validation





**System
      concept evaluation and design implementation**




IntelliSense
      will provide professional staff, facilities, and will exert its best effort
      to
      perform the following tasks.





**Task
      1: System architecture concept development**




IntelliSense
      possesses several design concepts for the construction of a hyper-spectral
      imaging spectrometer based upon a controllable micro-mirror. In this task,
      IntelliSense will investigate several design concepts including concepts for
      MEMS based sensor, pixel/field selector, control circuitry, photo detection
      array, DSP, and Packaging. A brainstorming session will be held to evaluate
      the
      trade-offs between each concept. In the brainstorming activity, several design
      configurations will be considered for the device. The concepts will be evaluated
      against the criteria set in the technical system specifications. The concepts
      will also be evaluated for performance, technical risk, and
      manufacturability.





Activities
      within this task include:





•
Kickoff
      meeting. IntelliSense proposes a 1-1.5 day kick-off meeting involving the key
      members of the team. The goal of the meeting is for the team to get acquainted
      and brainstorm about various aspects of the project. The team will be
      multi-disciplinary in nature involving people with expertise in design, wafer
      processing, electronics (including control and data signal processing – hardware
& software), packaging, test and manufacturing. A high level approach on the
      various tasks will be discussed, risk assessment, risk mitigation, project
      schedule in each of the key areas will be determined.





•
      Engineering brainstorming





•
      Literature investigation: IntelliSense will research publicly available
      literature and evaluate its applications for Earth Search’s device and system
      requirements.





•
Concept
      evaluation: IntelliSense and Earth Search will compare all the design
      concepts.  From the potential concepts, one or more will be selected
      for further evaluation. The selected concepts will be used for the preliminary
      modeling of Task 3.


•
Control
      requirements: A detailed set of control requirements including control voltage
      and current will be estimated.





•
Data
      Processing requirements: A detailed set of data control requirements including
      decoding, coding and MIPs will be estimated.











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**Task
      2: Develop MEMS process design concept**





In
      this
      task IntelliSense will investigate the process steps necessary to fabricate
      the
      design concepts developed in Task 1 for both the selector and sensor
      devices.





Activities
      within this task will include:





•
      Development of fabrication process sequence. IntelliSense will build process
      sequence tables for each of the designs under evaluation. The process tables
      list all processes for fabrication including process steps, material properties
      and initial die level planar mask layouts.





•
      Material selection: While evaluating the process for fabrication, material
      choices and properties, will be analyzed and determined. Based on the desired
      material properties process steps will be suggested.





•
      Manufacturability evaluation: A suitable process design should
      incorporate


manufacturing
      requirements of the device. In association with the foundry partners,
      IntelliSense will evaluate the viability, risk and manufacturing tolerances
      of
      each process flow and packaging with photo detectors. In addition, capital
      expenditure specific to the production will be estimated. Process yield
      estimates will also be considered. Preliminary cost estimates will be
      derived.





**Task
      3: Preliminary MEMS design modeling and analysis**




IntelliSense
      will model the selected concept designs in IntelliSuite. The modeling will
      result in 3D models of the device concepts linked to their fabrication. As
      a
      result a process linked model will be developed.





Activities
      within this task include:





•
Process
      model generation: The microfabrication process tables developed in Task 2 will
      be incorporated into IntelliSuite. To the extent available, each fabrication
      process of the process tables will be simulated and 3D device models will be
      generated for each process step and may be viewed at each process step to aid
      in
      the device design. Process induced stresses such as residual stresses are also
      incorporated into the 3D models during this activity.





•
Device
      analysis: The preliminary models developed will be analyzed for
      performance.  Theoretical analysis (based on reduced order equations)
      and numerical analysis (based on Finite Element or boundary element techniques),
      will be performed to investigate the performance of the devices. Several kinds
      of analysis will be performed. These include: electrostatic analysis,
      thermo-mechanical analysis and coupled field analysis.
      Geometries for each of the major components will be derived. Die level masks
      for
      the device will be generated.





•
      Functionality analysis: The actuation for both devices will need to be studied
      and fully analyzed, and then optimized. This includes investigating the RMS
      roughness of the surfaces as it relates to optical resolution, verticality
      of
      the components, grating size, culmination of light source and overall mirror
      actuation










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•
Unlike
      the IC world, MEMS performance is highly dependent on the package, packaging
      design has to be performed up front to understand the total device cost. The
      micro spectrometer and the selector may need to be packaged in a hermetic
      environment to extend longevity and to prevent the degradation of the moving
      mirror & photo detectors due to humidity and corrosion. IntelliSense will
      develop the packaging concept for the device, based on investigation of the
      3-4
      chip solution (1-2 MEMS, Control & DSP) plus light source with wirebond
      packaging.





**Task
      4: Telescopy optics and compensation systems design**





In
      this
      task, IntelliSense will architect, specify and design and have fabricated the
      telescopy optics, if not available “off the shelf”. A brainstorming session will
      be held to evaluate all trade-offs as they are related to the telescopy optics
      learned at this point in the development program. The developed design will
      be
      fully evaluated for system level performance, environmental issues, technical
      risk, cost trade-off, manufacturability and repeatability.





Activities
      within this task include:





•
      IntelliSense will design and then fully model, simulate and analyze the
      telescopy optics for the system. Non gimbaled mounting of the telescope is
      the
      preferred methodology, IntelliSense will investigate appropriate alternate
      mounting mechanisms.





•
Optical
      performance is highly dependent on the system design and layout, so the
      packaging design has to be performed up front to understand the total system
      performance and cost.





•
      Investigate and choose sensors for (i) altitude correction (ii) noise and
      vibration compensation. IntelliSense will choose appropriate 5-6 DOF IMUs
      (preferable high performance, micro-machined accelerometers/gyros). (iii)
      particle count, IntelliSense will investigate the incorporation of online
      polarimetry for dispersion and particle count measurement.





•
      IntelliSense will update the economics of manufacturing this system based on
      the
      finalized telescopy optics chosen.





**Task
      5: Preliminary economics of manufacturing**




In
      this
      task, IntelliSense will work with a foundry (mutually agreed on) to develop
      a
      cost model for manufacturing each of the concepts as a function of production
      volume. The manufacturing cost is typically a function of die size, process
      complexity, anticipated device yield, packaging complexity and testing. Cost
      estimates for initial production of the device will be made. The costs will
      be
      broken down into the cost for device, packaging and test. Note that the cost
      model will be a preliminary estimate and not the final cost of
      production.







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**Task
      6: Design Review meeting A**




A
      design
      review meeting will be held with Earth Search (and foundry / packaging partner)
      to discuss the process and device design. Based upon the design review the
      final
      concept for P0 will be chosen. Materials for the design review will be prepared
      and distributed in advance (at least 2 days) to aid in effective
      discussion.





**Task
      7: Concept evaluation report and presentation**





IntelliSense
      will prepare a report of the concept evaluation activities. The report will
      describe the design options investigated. It will also include a recommendation
      for the P0 concept. Model information and preliminary analysis will be included
      within the report. A presentation will be prepared for Earth
      Search.





**Task
      8: Detailed design implementation**





**Detailed
      process design**: The final process design documents for the P0
      fabrication of the mirror and the field selector will be assembled. The
      alternate process flows for the device processing will be narrowed down to
      a
      single final process. Process models will be created/updated in IntelliFAB,
      the
      process flow will be validated using virtual prototyping techniques. Wafer
      level
      packaging techniques and their impact on the device (cost, performance) will
      be
      determined.





**Detailed
      device design**: In this task, IntelliSense will perform a full
      set of analyses to model the entire device with the package, including the
      wirebonded die that makes up the total system. Package generated stresses will
      be included in the device design. The performance of the device and its
      capability to meet the various specifications will be studied. Control and
      alignment performance will be optimized, deflection and actuation Finite Element
      models will be created to gain a good understanding of the
      structure.





**Geometric
      synthesis and optimization**: In this task, the final geometry of
      the device will be determined. IntelliSense will create models to understand
      the
      impact of important variables on the device performance. The sensitivity of
      the
      device to manufacturing tolerances will also be studied. Where relevant, optimal
      synthesis methodologies will be used to model the device.





**System
      model extraction and system simulation**: A system model of the
      device will be derived for incorporation into system level simulations using
      IntelliSuite.





**Task
      9: Test vehicle design**





Test
      vehicles each with a pre-determined task can provide valuable insight into
      different aspects of the device. Also, test vehicles can be used to calibrate
      each sub-component of the design. IntelliSense will hold a brainstorming session
      to determine
      the test vehicles to be fabricated during the P0 fabrication. These test
      vehicles can range from simple stress measurement structures to more
      sophisticated calibration mechanisms.





**Task
      10: Mask layout**





In
      this
      task, IntelliSense will layout the initial 6” mask set for the P0 fabrication.
      The mask set design will be internally reviewed.











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**Task
      11: Material procurement planning**





IntelliSense
      will prepare a list of materials which have long lead times associated with
      them, for instance, specialized wafers, specialized targets for sputtering
      machines, photo detectors, packaging jigs, probe cards for testing, mechanical
      fixtures, etc.





**Task
      12: Test plan formulation**





IntelliSense
      will aid Earth Search in defining the test plan for the evaluation of the P0
      prototypes. Earth Search is expected to provide the resources (staffing, test
      benches) for the full evaluation of the samples. Test needs will have to be
      determined up front.





**Task
      13: Updated economics of manufacturing**





Based
      on
      the finalized P0 process flow and layout, IntelliSense will update the
      estimation of the cost. If appropriate a cost reduction plan will be developed
      for future volumes.





**Task
      14: Design Review B (Design Tape Out of Prototype 0)**





A
      detailed design review will be held between IntelliSense, Earth Search and
      foundry. In this task, the final design flow and mask layouts will be
      determined. Any short loop experiments that need to be performed will be
      addressed between the groups. Based upon the design review the mask-set for
      P0
      (first run) will be finalized. This tape out will be deemed as Version
      1.0





**Task
      15: Final report and presentation**





IntelliSense
      will prepare a full design report and presentation, based on the above tasks
      that encompass the complete design and design validation for P0 prototypes.
      The report will include a summary of the engineering drawings, mask layouts,
      packaging layout, process flow and engineering analysis reports.





**Task
      16: Intellectual property rights and patent filings**





IntelliSense
      and Earth Search will identify areas where protective rights can be filed.
      As
      part of this task, a joint patent search will be performed on the US Patent
      Database to understand the existing patent scenario and potential avenues for
      patent protection.





In
      addition, IntelliSense and Earth Search will formalize a separate Intellectual
      Property (IP) sharing scheme for the multi-platform micro-spectrometer. A high
      level meeting(s) will be arranged between the officers of the two companies
      to
      finalize the IP sharing agreement.











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**6
      Timeline for Phase 1**





IntelliSense
      anticipates the time for Phase 1 system architecture and design planning
      implementation to be 14 weeks. A detailed Gantt chart of the activities is
      shown
      below.







***Figure
      5: Estimated timeline for Phase I***











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      Information





**7
      Cost and contractual issues**





**Phase
      1A quotation**





IntelliSense
      will perform the task set forth in the Phase 1 Statement of Work (Section 5).
      The price for the Phase 1 work is estimated to be $280,000 (USD).





**Duration
      of performance**





Duration
      of performance is currently estimated to be 12 weeks from the kick-off of the
      project.





**Payments**





Performance
      will commence upon receipt of signed agreement and purchase order for a retainer
      of $125,000. The payment for the retainer is contingent on receipt of funding
      by
      Earth Search; the payment will be due to IntelliSense NET 30 days from receipt
      of funds by Earth Search. If the program funding is delayed 30 calendar days
      or
      longer from date of commencement, the program work will be put on hold until
      the
      funding is obtained.





The
      remaining balance will be invoiced in equal installments on a monthly basis,
      as
      follow on to the retainer payment. These remaining payments are due NET 30
      days
      from invoice date.









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      Software • Submitted in confidence • Confidential Proprietary
      Information





**General
      conditions**





No
      oral
      agreements or conversation shall modify these terms, nor shall any terms or
      conditions on any purchase orders or other form, which the Customer may elect
      to
      use. Similarly, should IntelliSense elect to use any additional documentation
      in
      connection with the fulfillment of orders, the terms and conditions of this
      Quotation, rather than any such other additional documentation, will govern
      the
      transaction. Neither party shall have any duty to specifically object to any
      provisions of any additional documentation the other may use, nor fulfillment
      of
      orders by IntelliSense shall not be deemed acceptance of any terms or
      conditions, which may be contained on such orders.





By
      the
      signatures of the duly authorized parties below, the Customer accepts
      IntelliSense’s offer to sell the above goods or services according to the terms
      herein.





Earth
                Search
            
            IntelliSenseName:
            
            Larry
                Vance,
            
            CEO
                Name:
            
            Sandeep
                AkkarajuSignature:
            
            
            
            Signature:
            
            /s/
                Sandeep AkkarajuTitle:
            
            CEO
            
            Title:
            
            CEODate:
            
            
            
            Date:
            
            October
                27, 2005











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      Software • Submitted in confidence • Confidential Proprietary
      Information





**8
      Appendix A: About IntelliSense**





A
      brief
      history of our time





IntelliSense
      was originally founded in 1991 with the mission of developing MEMS specific
      CAD
      tools. In 1993, we released the first software tool for MEMS and in 1995
      followed up with the first completely integrated CAD tool for MEMS. In 1995,
      IntelliSense opened one of the first MEMS-specific foundries. In 2000, Corning
      acquired IntelliSense at a valuation of $750 M and the company changed its
      name
      to Corning IntelliSense. In 2003, the core assets of Corning IntelliSense were
      re-acquired by the original employees of IntelliSense.





IntelliSense
      Software continues to innovate, releasing the first design tool for RF MEMS
      in
      2002 and the first bioMEMS design tool in 2003. In 2005, IntelliSense release
      IntelliSuite 8, featuring many new modules ranging from RIE/ICP etch simulation,
      IntelliMask Pro (a production ready mask layout tool), SYNPLE (Multi-domain
      system synthesis and simulation), and MEMS-SoC (System on a chip integration
      of
      MEMS and high voltage ICs).





Solutions
      for the MEMS enterprise





IntelliSense
      Software is the leading supplier of solutions for the MEMS professional. Its
      IntelliSuite® family of CAD tools ignited the MEMS industry in the 90’s and is
      now used by universities and corporations worldwide. With distributors in 15
      countries, IntelliSense offers software tools and custom design, consulting
      and
      market research services to universities, blue-chip companies and startups
      worldwide. With users in over 20 countries, and partnerships with dozens of
      leading MEMS research institutes worldwide, IntelliSense Software is recognized
      as the leading innovator in MEMS design and development.





IntelliSense
      now operates as a fabless MEMS company with strong affiliations with foundries
      worldwide.  Our comprehensive expertise in all areas of MEMS allows
      our customers to bring to commercialize new products.





IntelliSense
      team





IntelliSense
      is comprised of a multi-disciplinary team. Technical backgrounds of our
      employees are diverse, spanning software development, IC, MEMS and optics design
      and fabrication, and high volume semiconductor and MEMS production. Unlike
      the
      microelectronic industry, MEMS requires a strong bridge between design and
      process development. IntelliSense has extensive experience in both areas and
      provides the strong synergy that is required to develop a reliable and cost
      effective product.











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